Printed Circuit Board Specification

Verpackung - packaging
Boards must be packaged in stacks of 5, 10, 20, 25 or 50. Do not individually bag each board, unless specified. Each package must contain boards of the same date code Max. 25kg pro shipping box
04.07.11
/ Pi
Tolerance / standard
Abziehbare Abdecklack – peelable solder mask Druck – silk screen printing
thickness 400µm +/- 125µm
Lötbarkeit - solderability Elektrische Prüfung – E-Test Teilweise gute Nutzen – X-out
Beschriftung - Marking
Label with Honya part No., part description, qty, date code, lot No., RoHS compliance
Data files
No. Kontur Schichtaufbau 0 1 2 3 4 5 6 Bohrplan Bohrungen Bohrplan Kontur Nutzen Markierung Siebdruck Best.Seite Lötstop Best.Seite Leiterbild Best.Seite Leiterbild Innenlage 1 Leiterbild Innenlage 2 Leiterbild Lötseite Lötstop Lötseite Bohrdaten Excellon Durchmesser Als PDF Konturzeichnung als PDF Nutzenzeichnung als PDF Minimum marking • Manufacturer logo • Date code • UL-Sign • Flammability UL94-V0 • Part No. + Index Abdecklack Zeichnung als PDF BottLayer.spl BottSolder.spl NC_Drill.spl NC_Drill.rep 520571.pdf 519081.pdf 513703a.pdf 513370a.pdf TopSolder.spl TopLayer.spl Description Kontur Leiterplatte File name (Cadstar) Mech.spl
Min. 6 months Yes No Yes No
IPC-A-600 G, Category 3 in J-STD-003 Continuity testing max. 20 Ohm @ 100mA High pot test 1 MOhm @ min. 100VDC Max. 10% of panels may have X-outs Max ..... X-out per panel accepted Mark highly visible by permanent pen, sticker only Pack and mark X-outs separatly
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Identification
Part No. No. of disc Part Description Established Approved
112591
520566
PCB 520566 PCM 4630
04.07.11
/ Pi
Specification
Precedence: Gen. Tolerances: Manufacturing data and drawings take precedence over these general specifications. contour : ± 0.2 mm Non plated holes : ± 0.05 mm Plated holes : ± 0.1 mm Specification 1 (consumer) 2 (Industry Standard) 3 (High Performance) UL- Certificate Brennbarkeit - Flammability UL Listed (ZPMV2) UL94 See panel dwg UL94-V0 IPC-2615 class B IPC-2615 class B single sided double sided multilayer, No. of layers Leiterplattendicke - PCB thickness Kupferdicke – Cu thickness 1.6 mm others …........................ Outside layer min. 35 µm min. 70 µm others …... µm PCB pattern Plattierung der Durchkontaktierung – plating holes According to data files average 25 µm, min. 18µm if pad diameter < drill hole, do not plate hole others …............. Oberflächenbehandlung – surface treatment ENIG (electroless immersion Au) HAL leadfree others Lötstopplack – solder mask ............ 1. Peters SD2468NB-M 2. Enthone DSR 3241 3. Probimer 52 / 65 / 77 4. ShipleyRonal / LeaRonal OPSR-5900 5. Tamura DSR 2200 6. Taiyo PSR-4000 7. T4 Smart 8. others……………………. IPC 6012B Ni / Ni thickness 2.5 - 5.0µm Au thickness min. 0.06µm tin thickness min. 0.1µm HAL thickness 5.0 – 25µm IPC 6012B IPC-4552 Inner layers min. 35 µm min. 70 µm others …... µm IPC-6011/6012B IPC 6012B IPC-A-600 G 4 IPC-2615 class B IPC-2615 class B Description Tolerance / standard IPC-A-600 G
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Identification
Part No. No. of disc Part Description Established Approved
112591
Require 4630
Specification Peters SD2955 others :............................ carbon printing top silk screen, white bottom silk screen, white Description
All rights reserved. No part of these documents or files may be copied or provided to third parties without our written permission.
Page/Seite 2/2
Requirement Qualitätsklasse - class
Nutzen Abmessungen – panel .. mm x .. mm size ..PCB / panel Lochabmessungen – drill drawing PCB Basismaterial - PCB base material See drill dwg FR-4 others …........................
immersion tin ATOTECH
solder mask on top solder mask on bottom plugged Vias, max. 50µm for via plugging only 1. Hysol SR1000 2. Enthone USR-7G
All rights reserved. No part of these documents or files may be copied or provided to third parties without our written permission.