C C++ R - C Memory Management
memory 坏块管理
memory 坏块管理Memory(内存)是计算机中的重要组件之一,用于存储程序和数据。
然而,由于长时间使用或其他原因,内存中的块可能会变得损坏。
因此,对于系统管理员和程序员来说,对内存中的坏块进行管理是非常重要的。
我们需要了解什么是内存坏块。
内存坏块是指内存中的一个或多个连续的存储单元出现了物理损坏,导致无法正常读取或写入数据。
这些内存坏块可能是由于硬件故障、电压问题、过热或长时间使用等原因引起的。
内存坏块对计算机系统的稳定性和性能都会产生负面影响。
首先,坏块可能会导致系统崩溃或运行变慢。
当程序试图读取或写入损坏的内存块时,可能会发生错误,导致程序崩溃或运行变得缓慢。
其次,坏块还可能导致数据丢失或损坏。
如果损坏的内存块中存储了重要的数据,那么这些数据可能会永久丢失或变得无法正常使用。
为了管理内存中的坏块,我们可以采取一些措施。
首先,可以使用内存测试工具来检测内存中的坏块。
这些工具可以扫描整个内存,检测并标记出坏块的位置。
一旦发现坏块,我们可以将其标记为不可用,以避免在程序中使用这些坏块。
其次,我们可以通过重新分配内存来规避坏块。
当发现坏块时,我们可以将其替换为可用的内存块。
这可以通过操作系统或程序来实现。
最后,定期维护内存也是管理坏块的重要步骤。
定期检查内存的物理状态,清理内存中的垃圾数据,可以减少坏块的发生。
除了上述措施,我们还可以采取一些预防措施来避免内存坏块的发生。
首先,要确保计算机的电压稳定。
电压过高或过低都可能导致内存损坏。
其次,要注意内存的散热问题。
过热可能导致内存损坏,因此要确保计算机的散热系统正常工作。
此外,定期清理内存中的垃圾数据也是预防坏块的重要步骤。
在实际应用中,内存坏块管理是一个复杂而重要的任务。
系统管理员和程序员需要密切关注内存的状态,及时检测和修复坏块。
对于关键系统和数据,还可以考虑使用冗余内存或备份来提高系统的稳定性和容错性。
另外,注意及时更新和升级硬件和软件也是防止坏块的一种有效措施。
DCS 常用词汇
DCS 常用词汇英文中文缩写Distributed Control System 分布控制系统 DCS Process Control System 过程控制系统Analog Control 模拟控制Close Control Loop 闭环控制回路Open Control Loop 开环控制回路Analog Input Channel 模拟输入通道 AIAnalog Output Channel 模拟输出通道 AOAnalog Control Station 模拟控制站 SACDigital Control 数字控制Two Position Control 两位式控制 On/Off Digital Input Channel 数字输入通道 DIDigital Output Channel 数字输出通道 DOPulse Input Channel 脉冲输入通道 PIDigital Logic Station 数字逻辑站 DLS Programming Logic Controller 可编程控制器 PLC Control Output 控制输出 COCommunication System 通信系统Communication Network 通信网络Control Network 控制网络 CnetCentral Ring 中心环Slave Ring 子环Remote Ring 远程环Control Way 控制通道 C.WModule Bus 模件总线 M.BExpander Bus 扩展总线 Ex.busField Bus 现场总线Communication Protocol 通信协议Store and Forward 存储转发Contention Detect 冲突检测Broadcast Protocol 广播协议Peer to Peer Communication 对等通信Point to Point 点对点Field Bus Protocol 现场总线协议Series Port 串行口SCSI 小型机系统接口Synchronous 同步 SYNAsynchronous 异步Timing 定时Ethernet 以太网Internet 因特网Data Communication Equipment 数据通信设备 DCEData Termination Equipment 数据终端设备 DTEBit per Second 位/秒 BpsNode 节点Cyclic Redundancy Code 循环冗余码 CRCProcess Control Unit 过程控制单元 PCUHuman System Interface 人系统接口 HISComputer Interface Unit 计算机接口单元 CIUModule Mounting Unit 模件安装单元 MMUCabinet 机柜 CABNetwork Interface Module 网络接口模件 NISNetwork Processing Module 网络处理模件 NPMLoop Address 环路地址Node Address 节点地址Controller 控制器Master Module 主模件Multi-Function Processor 多功能处理器 MFPBridge Controller 桥控制器 BRCMachine Fault Timer 机器故障计时器 MFTDirect Memory Access 【'ækses] 直接存储器存取 DMA Redundancy Link 冗余链DCS Link 站链Reset 复位Module Address 模件地址Power Fault Interruption 电源故障中断 PFITermination Unit 端子单元 TUDip shunt 跨接器Jumper 跳线器Setting and Installation 设置与安装Address Selection Switch 地址选择开关Slave Module 子模件Analog Input Module 模拟输入模件 ASIAnalog Output Module 模拟输出模件 ASODigital Input Module 数字输入模件 DSIDigital Output Module 数字输出模件 DSOPulse Input Module 脉冲输入模件 DSMControl I/O Module 控制I/O模件 CISModular Power System 模件电源系统 MPS Thermocouple 热电偶 TCMillivolt 毫伏 mVRTD 热电阻High Level 高电平Low Level 低电平Distributed Sequence of Event 分布顺序事件 DSOE Time Information 时钟信息Time Link 时钟链Time Synchronous 时钟同步Sequence of Event Master 顺序事件主模件 SEM Sequence of Event Digital 顺序事件数字模件 SED Time Salve Termination 时间子模件端子 TST Operator Interface Station 操作员接口站 OIS Operation System 操作系统Tag 标签Operator Windows 操作员窗口Mini Alarm Windows 最小报警窗口Summer Display 总貌画面Group Display 组画面Alarm Acknowledge 报警确认 ACKAlarm Non Acknowledge 报警非确认 NAKStation Display 站画面Annunciator Display Panel 警告显示盘 ADPQuick Key 快捷键Engineering work Station 工程工作站 EWS Configuration 组态Project Tree 项目树Automation Architect 自动化结构Object Exchange 对象交换Function Code 功能码 FCFunction Block 功能块 FBBlock Address 块地址Block Number 块号Exception Report 例外报告Significant Change 有效变化量Minimum Exception Report Time 最小例外报告时间 tmin Maximum Exception Report Time 最大例外报告时间 tmax High Alarm Limit 高报警限Low Alarm Limit 低报警限Alarm Deadband 报警死区ABC Automatic boiler control 锅炉自动控制AC Alternating current 交流(电)ACC Automatic combustion control 燃烧自动控制ACP Auxiliary control panel 辅助控制盘ACS Automatic control system 自动控制系统ACT actuator 执行机构A/D Analog /digital(conversion) 模/数(转换)ADP Annunciation display panel 报警显示板AEH Analog electro- 模拟式电液调节AFC Air flow control `送风控制AGC Automatic generation control 自动发电量控制AI Analog input 模拟量输入A/M Automatic/manual 自动/手动AO Analog output 模拟量输出APC Automatic plant control 电厂自动控制ASS Automatic synchronized system 自动同期系统ARP Auxiliary relay panel 辅助继电器盘ATC Automatic turbine startup or shutdown control system 汽轮机自启停系统BCS Burner control system 燃烧器控制系统BF Boiler follow 锅炉跟踪BFC Boiler fuel control 锅炉燃料控制BPS By-pass control system 旁路控制系统BTG Boiler turbine generator(panel) 锅炉、汽轮机、发电机(控制盘)CCR Central control room 单元(中央)控制室CHS Coal handing system 输煤控制系统CJC Cold junction compensator 冷端补偿器CPU Central processing unit 中央处理器CRT Cathode-ray tube 阴极射线管屏幕显示器CEMS continuous emission monitor system 连续排放监控系统D/A Digital/analog(conversion) 数/模(转换)DAS Data acquisition system 计算机监视系统或数据采集系统DC Direct current 直流(电)DCE Data circuit-terminating equipment 数据电路终端设备DCS Distributed control system 分散控制系统DDC Direct digital control 直接数字控制DDP Distributed data processing 分散数据处理DEH Digital electro-hydraulic control system 数字式电液控制系统DI Digital input 数字量输入DMP Damper 挡板、风门DO Digital output 数字量输出DSB Distributed switch-board 配电盘DTE Data terminal equipment 数据中端设备EEPROM Electrically-erasable programmable read only memory 电可擦写只读存储器E/P Electro/pneumatic(converter) 电/气(转换器)EPROM Electrically programmable read only memory 光可编程只读存储器ES Expert system 专家系统ETS Emergency trip system 紧急停机系统EWS Engineer wok station 工程师工作站FA Full arc 全周进汽FB Field bus 现场总线FCB Fast cut back (机组)快速甩负荷FDC Furnace draft control 炉膛压力控制FSS Furnace safety system 炉膛安全系统FSSS Furnace safeguard supervisory system 锅炉炉膛安全监控系统GV Governor valve 调节阀门HBP High-pressure by-pass valve 高压旁路I&C Instrumentation &control 仪表与控制INT Interlock 连锁I/O Input/output 输入/输出IDP Integrated data processing 集中数据处理KB Keyboard 键盘LBP Low-pressure by-pass valve 低压旁路LCD Liquid-crystal display 液晶显示器LED Light emitting diode 发光二极管LS Limit switch 限位开关LS Level switch 液位开关M/A Manual/automatic 手动/自动MAX Maximum 最大值MCC Motor control center 电动机控制中心MCR Maximum continuous rating 最大连续运行负荷MCS Modulating control system 模拟量控制系统MEH (BFTP)micro-electro-hydraulic control system (锅炉给水泵汽轮机)电液控制系统MFT Master fuel trip 总燃料跳闸MHC Mechanical hydraulic control 机械液压式控制MIN Minimum 最小值MIS Management information system 管理信息系统MTBF Mean time between failures 平均无故障工作时间MTTF Mean time to failure 失效(故障)前平均工作时间MTTR Mean time to repair 平均故障修复时间NC Normally Closed 常闭NO Normally open 常开OCS On-off control system 开关量控制系统OEI Optic electric interface 光电接口OFT Oil fuel trip 燃油跳闸OPC Overspeed protection CONTROL 超速保护控制OS Operator station 操作员站PA Partial arc 部分进汽PC Programmable controller 可编程控制器PCS Pulverizer control system 磨煤机控制系统PI Purse input 脉冲量输入PID Proportional integral derivative 比例-积分-微分PLC Programmable logic controller 可编程序逻辑控制器PO Pulse output 脉冲量输出RAM Random access memory 随机存取存储器RB Run back (辅机故障)快速甩负荷ROM Read only memory 只读存储器RTC Reheat steam temperature control 再热气温控制SBC Soot blower control system 吹灰控制系统SCM Single chip microcomputer 单片机SCS Sequence control system 顺序控制系统SER Sequence events recorder 事件顺序记录仪SOE Sequence of events 事件顺序记录ST Smart transmitter 智能变送器STC Superheated steam temperature control 过热气温控制TAS Turbine automatic system 汽轮机自动控制系统TBP Turbine by-pass system 汽轮机旁路系统TCS Turbine control system 汽轮机控制系统TF Turbine follow 汽轮机跟踪TSI Turbine supervisory instrument 汽轮机监视仪表UCC Unit coordinated control 机组协调控制ULD Unit load demand(command) 机组负荷指令UPS Uninterrupted power system 不间断电源WTS Water treatment control system 水处理控制系统AGC Automatic Generation Control 自动发电控制AMR Automatic Message Recording 自动抄表ASS Automatic Synchronized System 自动准同期装置ATS Automatic Transform System 厂用电源快速切换装置AVR Automatic Voltage Regulator 自动电压调节器BCS Burner Control System 燃烧器控制系统BMS Burner Management System 燃烧器管理系统CCS Coordinated Control System 协调控制系统CIS Consumer Information System 用户信息系统CRMS Control Room Management System 控制室管理系统CRT Cathode Ray Tube 阴极射线管DA Distribution Automation 配电自动化DAS Data Acquisition System 数据采集与处理系统DCS Distributed Control System 分散控制系统DDC Direct Digital Control 直接数字控制(系统)DEH Digital Electronic Hydraulic Control 数字电液(调节系统)DMS Distribution Management System 配电管理系统DPU Distributed Processing Unit 分布式处理单元DSM Demand Side Management 需求侧管理EMS Energy Management System 能量管理系统ETS Emergency Trip System 汽轮机紧急跳闸系统EWS Engineering Working Station 工程师工作站FA Feeder Automation 馈线自动化FCS Fieldbus Control System 现场总线控制系统FSS Fuel Safety System 燃料安全系统FSSS Furnace Safeguard Supervisory System 炉膛安全监控系统FTU Feeder Terminal Unit 馈线远方终端GIS Gas Insulated Switchgear 气体绝缘开关设备GPS Global Position System 全球定位系统HCS Hierarchical Control System 分级控制系统LCD Liquid Crystal Display 液晶显示屏LCP Local Control Panel 就地控制柜MCC Motor Control Center (电动机)马达控制中心MCS Modulating Control System 模拟量控制系统MEH Micro Electro Hydraulic Control System 给水泵汽轮机电波控制系统NCS Net Control System 网络监控系统OIS Operator Interface Station 操作员接口站OMS Outage Management System 停电管理系统PAS Power Application Software 电力应用软件PID Proportion Integration Differentiation 比例积分微分PIO Process Input Output 过程输入输出(通道)PLC Programmable Logical Controller 可编程逻辑控制器PSS Power System Stabilizator 电力系统稳定器RTU Remote Terminal Unit 站内远方终端SA Substation Automation 变电站自动化SCADA Supervisory Control And Data Acquisition 数据采集与监控系统SCC Supervisory Computer Control 监督控制系统SIS Supervisory Information System 监控信息系统TDCS(TDC) Total Direct Digital Control 集散控制系统WMS Work Management System 工作管理系统。
ecc memory scrubbing机制
ecc memory scrubbing机制在计算机系统中,内存是一个非常重要的组成部分,它存储了运行中的程序和数据。
然而,内存中的位翻转和数据错误可能会导致系统崩溃或数据丢失。
为了解决这个问题,ECC (Error-Correcting Code) 内存模块被引入。
ECC内存模块通过一种称为ECC Memory Scrubbing的机制,提供了对内存错误的检测和纠正能力。
ECC Memory Scrubbing是一种用于检测和修复内存错误的自动化机制。
它通过在内存中定期执行一系列的检查和修复操作来确保数据的完整性。
这个机制通常由硬件控制器和内存模块中的特殊电路组成。
ECC Memory Scrubbing机制的工作原理如下:1. 内存检测:ECC内存模块中的硬件控制器定期对内存中的数据进行检测。
它使用一种称为Hamming Code的错误检测和纠正编码。
Hamming Code是一种能够检测和纠正单位错误的编码技术。
当硬件控制器检测到内存中的位翻转或数据错误时,它会使用Hamming Code来定位和修复错误的位。
2. 错误修复:一旦错误位被定位,ECC内存模块会自动修复这些错误。
它使用纠正编码技术来重新计算受影响位的正确值,并将其写回到内存中。
3. 擦除操作:为了进一步保证内存数据的完整性,ECC内存模块还会定期执行擦除操作。
擦除操作会将内存中的所有位设置为特定的值,以清除潜在的位翻转和数据错误。
ECC Memory Scrubbing机制的优点包括:1. 高可靠性:ECC内存模块能够检测和纠正内存中的位翻转和数据错误,提供了比普通内存模块更高的数据完整性和可靠性。
2. 自动化操作:ECC内存模块中的硬件控制器会自动执行内存检测、错误修复和擦除操作,无需人工干预。
3. 透明性:对于操作系统和应用程序来说,ECC内存模块与普通内存模块没有太大的区别。
它们可以无缝地集成到现有的系统中,而不会对系统性能和稳定性产生明显影响。
CMOS中关于内存的设置
CMOS中关于内存的设置比较多,但不少选项是比较专业的,因此,如果设置后出现问题,请选择“LOAD BIOS DEFAULTS”,恢复可靠的设置参数。
下面逐条说明相关内存设置。
1、Above 1MB Memory Test:设置开机自检时是否检测1M以上内存。
该选项已经在新的BIOS中被淘汰。
由于内存价格下跌,电脑用户安装内存容量陡然增加,开机时的大容量内存自检时间太长,今后,即使一遍的内存检测可能也会出现允许/禁止开关。
2、Auto Configuration:设置为允许时,BIOS按照最佳状态设置。
BIOS可以自动设置内存定时,因此会禁止一些对内存设置的修改,建议选择允许方式。
3、Memory Test Tick Sound:是否发出内存自检的滴嗒声。
如果您闲它烦,可以关闭它们。
4、Memory Parity Error Check:设置是否要设置内存奇偶校验。
多在30线内存条使用时代,已经被淘汰。
但把非奇偶校验内存强行进行奇偶校验设置会使电脑无法开机。
5、Cache Memory Controller:是否使用高速缓存。
不在流行的A ward BIOS中使用。
6、Shadow RAM Option:设置系统BIOS或显示卡BIOS是否映射到常规内存中。
可以加快速度,但也可能造成死机。
7、Internal Cache Memory:是否使用CPU内部缓存(一级缓存)。
可以提高系统性能。
8、External Cache Memory:是否使用CPU外部缓存(主板上的二级缓存)。
可以提高系统性能。
AMD新的具有两级缓存的CPU的出现,使主板上的二级缓存退居成叁级缓存。
9、Concurrent Refresh:直译是同时发生的刷新。
设置CPU在对其它I/O操作时对内存同时刷新,可以提高系统性能。
10、DRAM Read Wait State:设置CPU从内存读数据时的等待时钟周期。
在内存比CPU 慢时可以设置更多的等待。
ecc_memory_scrubbing机制_概述说明
ecc memory scrubbing机制概述说明1. 引言1.1 概述ECC (Error Correcting Code) memory scrubbing机制是一种用于提高计算机系统内存可靠性的技术。
随着计算机应用场景的不断扩大和发展,内存错误对于数据完整性和系统稳定性产生了越来越大的威胁。
ECC memory scrubbing机制通过在内存中添加冗余信息以及周期性地检测和修复内存错误,可以有效降低硬件故障率和数据丢失风险,提高系统性能和可靠性表现。
1.2 文章结构本文将详细介绍ECC memory scrubbing机制的原理、工作流程、优势与应用场景,并对未来发展方向进行展望。
具体结构如下:第2部分:ECC memory scrubbing机制2.1 ECC内存概述2.2 内存误码纠正技术2.3 Scrubbing技术原理第3部分:ECC memory scrubbing机制的工作流程3.1 初始化和配置参数设置3.2 定期读取和校验内存数据3.3 检测和修复内存错误第4部分:ECC memory scrubbing机制的优势与应用场景4.1 降低硬件故障率和数据丢失风险4.2 提高系统性能和可靠性表现4.3 适用于高要求的应用领域第5部分:结论与展望5.1 主要观点总结5.2 未来发展方向1.3 目的本文的目的是对ECC memory scrubbing机制进行全面概述说明,帮助读者了解这一技术的原理、工作流程以及在计算机系统中的应用价值。
通过深入了解ECC memory scrubbing机制,读者可以更好地评估该技术对系统性能和可靠性的影响,并在合适的场景下选择使用。
此外,文章还将探讨未来该技术可能的发展方向,为读者提供对未来趋势有所把握的参考。
2. ECC memory scrubbing机制2.1 ECC内存概述ECC(Error Correcting Code)内存是一种具备纠错功能的内存技术,它能够检测并纠正在数据传输和存储过程中可能出现的错误。
Memory Management
– JIT/compiler generates a map for every program point where a GC may occur – Can constrain optimizations (derived pointers) – Required for type-accurate GC
• Garbage Collection
– Discriminating live objects and garbage
Garbage Collection
GC: How?
• Automatically collect dead objects • Liveness reachability
• Efficiency can be very high • Gives programmers “control”
Garbage Collection
Automatic memory management
• reduces programmer burden • eliminates sources of errors • integral to modern object-oriented languages, i.e., Java, C#, .net • now part of mainstream computing • Challenge:
Garbage Collection
Liveness: the GC and VM/Compiler Contract
• GC Maps - identify what is live
– Root set
• Live registers, walk the stack to enumerate stack variables, globals at any potential GC point
内存控制器(Memory
内存控制器(Memory Controller)——介绍内存控制器(Memory Controller)——介绍2007年05⽉02⽇星期三 02:43内存控制器(控制器(Memory Controller)是计算机系统内部控制内存并且通过内存控制器使内存与CPU之间交换数据的重要组成内存部分。
内存控制器决定了计算机系统所能使⽤的最⼤内存容量、内存BANK数、内存类型和速度、内存颗粒数据深度和数据宽度等等重要参数,也就是说决定了计算机系统的内存性能,从⽽也对计算机系统的整体性能产⽣较⼤影响。
传统的计算机系统其内存控制器位于主板芯⽚组的北桥芯⽚内部,CPU要和内存进⾏数据交换,需要经过“CPU--北桥--内存--北桥--CPU”五个步骤,在此模式下数据经由多级传输,数据延迟显然⽐较⼤从⽽影响计算机系统的整体性能;⽽AMD的K8系列CPU(包括Socket 754/939/940等接⼝的各种处理器)内部则整合了内存控制器,CPU与内存之间的数据交换过程就简化为“CPU--内存--CPU”三个步骤,省略了两个步骤,与传统的内存控制器⽅案相⽐显然具有更低的数据延迟,这有助于提⾼计算机系统的整体性能。
CPU内部整合内存控制器的优点,就是可以有效控制内存控制器⼯作在与CPU核⼼同样的频率上,⽽且由于内存与CPU之间的数据交换⽆需经过北桥,可以有效降低传输延迟。
打个⽐⽅,这就如同将货物仓库直接搬到了加⼯车间旁边,⼤⼤减少了原材料和制成品在货物仓库和加⼯车间之间往返运输所需要的时间,极⼤地提⾼了⽣产效率。
这样⼀来系统的整体性能也得到了提升。
CPU内部整合内存控制器的最⼤缺点,就是对内存的适应性⽐较差,灵活性⽐较差,只能使⽤特定类型的内存,⽽且对内存的容量和速度也有限制,要⽀持新类型的内存就必须更新CPU内部整合的内存控制器,也就是说必须更换新的CPU;例如AMD的K8系列CPU⽬前就只能⽀持DDR,⽽不能⽀持更⾼速的DDR2。
开机提示内存错误常见错误代码及解决方法!
开机提示内存错误常见错误代码及解决方法!下面是小编收集整理的一些常见的内存可能发生的错误代码和简单解决办法,一起来看看吧!为什么开机提示内存错误1.开机提示“CMOSMemorySizeMismatch”【故障表现】开机启动时,提示“CMOSMemorySizeMismatch 信息。
【故障分析】从提示信息来看,是BIOS发现主板上的内存与CMOS中存放的数值不同,所发产生此错误信息。
【故障处理】启动计算机,进入BIOS设置程序,正确设置后保存退出即可。
2.开机提示“Memorytestfail”【故障表现】开机自检时,屏幕出现“Memorytestfail”,并给出“pressF1continue,orDELtosetup”提示信息。
【故障分析】该错误提示信息,表示检测内存时出现故障。
引起该故障多半是由于使用了不同品牌或不同工作频率的内存条,从而导致兼容性问题,亦有可能是内存插槽出现问题。
【故障处理】根据可能引起故障的不同原因,可通过下面的方法解决。
⑴按照提示信息,按“F1”键继续启动计算机,如果可以正常进入系统,但发现显示的内容容量比实际安装的内存条容量要少,则说明该故障完全是由于多个内存条之间的不兼容引起的,可以通过使用同品牌同频率的内存来解决此问题。
⑵若按“F1”键不能正常进入系统,则说明内存发生严重的故障。
先应对单根内存条进行测试排除单个内存条故障。
然后再组合多根内存条进一步测试,找出不兼容的内存条。
⑶若确定所使用的内存条并不存在兼容问题,则需要进一步检查内存及主板上的内存插槽是否有损坏,因为这些问题也可能引起该故障。
3.开机提示“pressESCtoskipmemorytest”【故障表现】开机后会对内存进行很多次检测,并给出“pressESCtoskipmemorytest”提示信息,按“ESC”键可跳过内存检测,继续启动计算机。
【故障分析】多次检测内存并出现提示信息,是因为CMOS中没有启用快速加电自检功能。
ECC内存和RECC内存的区别
ECC内存和RECC内存的区别
内存,是连接CPU 和其他设备的通道,起到缓冲和数据交换作用。
当CPU在工作时,需要从硬盘等外部存储器上读取数据,但由于硬盘这个“仓库”太大,加上离CPU也很“远”,运输“原料”数据的速度就比较慢,导致CPU的生产效率大打折扣!为了解决这个问题,人们便在CPU与外部存储器之间,建了一个“小仓库”—内存
ECC内存,即应用了能够实现错误检查和纠正技术(ECC)的内存条。
一般多应用在服务器及图形工作站上,这将使整个电脑系统在工作时更趋于安全稳定。
ECC是“Error Checking and Correcting”的简写,中文名称是“错误检查和纠正”。
单来说:ECC是一种校验,RECC的R表示register,寄存器。
所以RECC就是在ECC的基础上加了一个寄存器。
第七章MEMORY_MANAGEMENT
7.1 Memory Management Requirements (存储器管理需求 )
• Relocation(重定位)
• Memory Protection(存储保护)
• Memory Sharing(存储共享) • Logical Organization(逻辑组织) • Physical Organization(物理组织)
• 何谓重定位? 把在装入时对目标程序中指令和数据的变换过 程称为重定位。 • 地址变换是在装入时一次完成的,以后不再改 变,故称为静态重定位。 • 将目标模块装入内存后,并不立即把装入模块 中的相对地址转换为绝对地址,而是把这种地 址转换推迟到程序执行时进行,在硬件地址变 换机构的支持下,随着对每条指令或数据的访 问自动进行地址变换,故称为动态重定位。
• Virtual-Memory Segmentation(虚拟存储分段)
7.2 Memory Partitioning
• 存储器管理最基本的操作是由处理器把 程序装入主存执行。
• Fixed Partitioning (固定分区)
1.系统初始启动时将内存划分为数目固定、 尺寸固定的多个分区。 2.这些分区的尺寸可以相等也可以不等。
• Unequal-size partitions(大小不等分区 )
– can assign each process to the smallest partition within which it will fit(把每个进程指定到适应它的 最小分区 ) – queue for each partition – processes are assigned in such a way as to minimize wasted memory within a partition(可以使一个分区 内部浪费的空间最少 ).
英文缩写词
CGFNSCommission on Graduates of Foreign Nuring Schoolsv)Q sSYNuXTO0
CGOChief Government Officerv)Q sS-^l;N{ ;N#N?e^:ggKN儶NAmNl0
ChinaNETChian Networkv)Q sS-N{:gQ [/f?e^v{:gQKNN NKN雔^v g-N岀QI{0
00CD compact disc
00IC Integrated Circuits
00ASCII American standard code for Information Interchange
00EBCDIC Extended Binary Code Decimal Interchange Code
CD-ROMCompact Disk-Read Only Memoryv)Q sSIQX[PhV _N1\/fN^IQq0
CEOChief Executive Officerv)Q sS-^gbL[0
CETCollege English Testv)Q sS'Yf[Km0
CFOChief Finance Officerv)Q sS-^"R;N{0
0)Q[/f(uN*NUSbv{Qb__egN*N[tevb__ [ N TNW[)Q0OY
00kg (kilogram), TV (television), cf (confer), cm (centimetre)
00AD,A.DAnno Domini(=in the year of the Lord;since Christ was born lQCQ
00GIGO garbage in , garbage out
戴尔服务器提示configuring memory 进不去系统(已解决)
戴尔服务器提示configuring memory 进不去系统【已解决】
出现这个提示,先别紧张,内存条的问题。
解决方法:
断电,关机后拔电源,剩下一根内存条其他都拆下来,如有橡皮擦,擦擦金手指(就是内存条一侧的金属条条),然后接上电源开机,
接上显示器看能不能通过自检进入操作界面,然后关机拔电源,继续加第二根内存条,继续开机,如还是卡在这个界面不能进入,关机,此根内存条可能有问题,换插槽插,重新开机,如能进入操作界面,此根内存条没问题,插槽有问题,如还是不能开机此根内存条有问题;如多根内存条重复上述步骤,直至检查出有问题的内存条。
蓝屏终止代码memory management的解决方法
蓝屏终止代码memory management的解决方法蓝屏终止代码memory management的解决方法有以下几种:
1.更新显卡驱动程序:确保您的显卡驱动程序是最新的,可以通过访问显卡制造商的官方网站或使用第三方驱动更新工具进行更新。
2.检查系统内存:确保您的计算机有足够的可用内存。
打开任务管理器(按下
Ctrl+Shift+Esc键),查看内存使用情况。
如果内存不足,请关闭不需要的程序或增加物理内存。
3.禁用不必要的启动项:在Windows搜索框中输入“msconfig”,然后按回车键。
在“常规”选项卡下,取消选中“加载启动项”和“加载模块”复选框。
点击“应用”按钮,然后点击“确定”按钮。
重新启动计算机以使更改生效。
4.检查硬盘错误:使用磁盘检查工具(如chkdsk)检查硬盘是否存在错误。
如果发现错误,请修复它们,然后重新启动计算机。
5.重置BIOS设置:如果您的计算机使用的是BIOS设置,可以尝试重置BIOS设置。
这通常需要将计算机连接到另一台计算机,以便从另一台计算机上获取BIOS设置。
然后按照制造商提供的说明进行操作。
6.更换硬件:如果以上方法都无法解决问题,可能是硬件故障。
尝试更换显卡、内存条等硬件组件,然后重新启动计算机。
memory management解决方法
memory management解决方法
在计算机系统中,内存管理是一项重要的任务,它负责有效地管理计算机的内存资源。
内存管理的目标是优化内存的利用,确保系统可以高效地运行,并提供良好的用户体验。
在面对内存管理问题时,以下是一些常见的解决方法:
1. 分页和分段:分页和分段是常用的内存管理技术。
分页将内存划分为固定大小的页框,而分段将内存划分为逻辑段。
这两种方法可以提高内存的利用率,同时也更容易管理内存。
2. 虚拟内存:虚拟内存是一种将磁盘空间用作内存扩展的技术。
它使得操作系统可以将部分数据存储在磁盘上,并根据需要进行加载和卸载。
虚拟内存可以解决内存不足的问题,同时还可以提供更大的地址空间。
3. 垃圾回收:垃圾回收是一种自动内存管理技术,它可以自动释放不再使用的内存。
垃圾回收器会定期检查内存中的对象,并释放那些无法访问的对象。
这样可以避免内存泄漏和提高内存利用率。
4. 内存池:内存池是一种预先分配一定量的内存并进行管理的技术。
通过使用内存池,可以避免频繁的内存分配和释放操作,从而提高内存管理的效率。
5. 内存压缩:内存压缩是一种将内存中的数据进行压缩以节省空间的技术。
通过使用压缩算法,可以减少内存占用并提高内存的利用率。
总结起来,以上是几种常见的内存管理解决方法。
根据具体的情况和需求,可以选择合适的方法来解决内存管理问题,以提高系统的性能和用户体验。
Memory management for a symmetric multiprocessor c
专利名称:Memory management for a symmetricmultiprocessor computer system发明人:Michael A. Blake,Carl B. Ford,Pak-kinMak,Gary E. Strait申请号:US10436491申请日:20030512公开号:US07085897B2公开日:20060801专利内容由知识产权出版社提供专利附图:摘要:A modular multiprocessor computer system having a plurality of nodes each being in communication with each other via communication links. The plurality of nodeseach have local memory and local cache accessible by the other nodes. The plurality of nodes each also having a cache directory, one or more processing units, and a memory coherent directory to keep track of the scope of ownership of data within the modular multiprocessing computer system. The local memory and the local cache contain configurable regions of storage, wherein memory coherency traffic on the communication links between the nodes is controlled through the use of the memory coherent directory during a data request.申请人:Michael A. Blake,Carl B. Ford,Pak-kin Mak,Gary E. Strait地址:Wappingers Falls NY US,Poughkeepsie NY US,Poughkeepsie NYUS,Poughkeepsie NY US国籍:US,US,US,US代理机构:Cantor Colburn LLP代理人:Lynn Augspurger更多信息请下载全文后查看。
计算机缩写术语完全介绍
计算机缩写术语完全介绍计算机专业英语, 缩写在使用计算机的过程中,你可能会碰到各种各样的专业术语,特别是那些英文缩写常让我们不知所云,下面收集了各方面的词组,希望对大家有帮助。
一、港台术语与内地术语之对照由于港台的计算机发展相对快一些,许多人都去香港或台湾寻找资料,但是港台使用的电脑专业术语与内地不尽相同,你也许曾被这些东西弄得糊里糊涂的。
---------------------------港台术语内地术语埠接口位元位讯号信号数码数字类比模拟高阶高端低阶低端时脉时钟频宽带宽光碟光盘磁碟磁盘硬碟硬盘程式程序绘图图形数位数字网路网络硬体硬件软体软件介面接口母板主板主机板主板软碟机软驱记忆体内存绘图卡显示卡监视器显示器声效卡音效卡解析度分辨率相容性兼容性数据机调制解调器---------------------------二、英文术语完全介绍在每组术语中,按照英文字母的排列顺序来分类。
1、CPU3DNow!(3D no waiting,无须等待的3D处理)AAM(AMD Analyst Meeting,AMD分析家会议)ABP(Advanced Branch Prediction,高级分支预测)ACG(Aggressive Clock Gating,主动时钟选择)AIS(Alternate Instruction Set,交替指令集)ALAT(advanced load table,高级载入表)ALU(Arithmetic Logic Unit,算术逻辑单元)Aluminum(铝)AGU(Address Generation Units,地址产成单元)APC(Advanced Power Control,高级能源控制)APIC(Advanced rogrammable Interrupt Controller,高级可编程中断控制器)APS(Alternate Phase Shifting,交替相位跳转)ASB(Advanced System Buffering,高级系统缓冲)ATC(Advanced Transfer Cache,高级转移缓存)ATD(Assembly Technology Development,装配技术发展)BBUL(Bumpless Build-Up Layer,内建非凹凸层)BGA(Ball Grid Array,球状网阵排列)BHT(branch prediction table,分支预测表)Bops(Billion Operations Per Second,10亿操作/秒)BPU(Branch Processing Unit,分支处理单元)BP(Brach Pediction,分支预测)BSP(Boot Strap Processor,启动捆绑处理器)BTAC(Branch Target Address Calculator,分支目标寻址计算器)CBGA (Ceramic Ball Grid Array,陶瓷球状网阵排列)CDIP (Ceramic Dual-In-Line,陶瓷双重直线)Center Processing Unit Utilization,中央处理器占用率CFM(cubic feet per minute,立方英尺/秒)CMT(course-grained multithreading,过程消除多线程)CMOS(Complementary Metal Oxide Semiconductor,互补金属氧化物半导体)CMOV(conditional move instruction,条件移动指令)CISC(Complex Instruction Set Computing,复杂指令集计算机)CLK(Clock Cycle,时钟周期)CMP(on-chip multiprocessor,片内多重处理)CMS(Code Morphing Software,代码变形软件)co-CPU(cooperative CPU,协处理器)COB(Cache on board,板上集成缓存,做在CPU卡上的二级缓存,通常是内核的一半速度))COD(Cache on Die,芯片内核集成缓存)Copper(铜)CPGA(Ceramic Pin Grid Array,陶瓷针型栅格阵列)CPI(cycles per instruction,周期/指令)CPLD(Complex Programmable Logic Device,?}?s可程式化元件)CPU(Center Processing Unit,中央处理器)CRT(Cooperative Redundant Threads,协同多余线程)CSP(Chip Scale Package,芯片比例封装)CXT(Chooper eXTend,增强形K6-2内核,即K6-3)Data Forwarding(数据前送)dB(decibel,分贝)DCLK(Dot Clock,点时钟)DCT(DRAM Controller,DRAM控制器)DDT(Dynamic Deferred Transaction,动态延期处理)Decode(指令解码)DIB(Dual Independent Bus,双重独立总线)DMT(Dynamic Multithreading Architecture,动态多线程结构)DP(Dual Processor,双处理器)DSM(Dedicated Stack Manager,专门堆栈管理)DSMT(Dynamic Simultaneous Multithreading,动态同步多线程)DST(Depleted Substrate Transistor,衰竭型底层晶体管)DTV(Dual Threshold Voltage,双重极限电压)DUV(Deep Ultra-Violet,纵深紫外光)EBGA(Enhanced Ball Grid Array,增强形球状网阵排列)EBL(electron beam lithography,电子束平版印刷)EC(Embedded Controller,嵌入式控制器)EDEC(Early Decode,早期解码)Embedded Chips(嵌入式)EPA(edge pin array,边缘针脚阵列)EPF(Embedded Processor Forum,嵌入式处理器论坛)EPL(electron projection lithography,电子发射平版印刷)EPM(Enhanced Power Management,增强形能源管理)EPIC(explicitly parallel instruction code,并行指令代码)EUV(Extreme Ultra Violet,紫外光)EUV(extreme ultraviolet lithography,极端紫外平版印刷)FADD(Floating Point Addition,浮点加)FBGA(Fine-Pitch Ball Grid Array,精细倾斜球状网阵排列)FBGA(flipchip BGA,轻型芯片BGA)FC-BGA(Flip-Chip Ball Grid Array,反转芯片球形栅格阵列)FC-PGA(Flip-Chip Pin Grid Array,反转芯片针脚栅格阵列)FDIV(Floating Point Divide,浮点除)FEMMS:Fast Entry/Exit Multimedia State,快速进入/退出多媒体状态FFT(fast Fourier transform,快速热欧姆转换)FGM(Fine-Grained Multithreading,高级多线程)FID(FID:Frequency identify,频率鉴别号码)FIFO(First Input First Output,先入先出队列)FISC(Fast Instruction Set Computer,快速指令集计算机)flip-chip(芯片反转)FLOPs(Floating Point Operations Per Second,浮点操作/秒)FMT(fine-grained multithreading,纯消除多线程)FMUL(Floating Point Multiplication,浮点乘)FPRs(floating-point registers,浮点寄存器)FPU(Float Point Unit,浮点运算单元)FSUB(Floating Point Subtraction,浮点减)GFD(Gold finger Device,金手指超频设备)GHC(Global History Counter,通用历史计数器)GTL(Gunning Transceiver Logic,射电收发逻辑电路)GVPP(Generic Visual Perception Processor,常规视觉处理器)HL-PBGA: 表面黏著,高耐热、轻薄型塑胶球状网阵封装HTT(Hyper-Threading Technology,超级线程技术)Hz(hertz,赫兹,频率单位)IA(Intel Architecture,英特尔架构)IAA(Intel Application Accelerator,英特尔应用程序加速器)ICU(Instruction Control Unit,指令控制单元)ID(identify,鉴别号码)IDF(Intel Developer Forum,英特尔开发者论坛)IEU(Integer Execution Units,整数执行单元)IHS(Integrated Heat Spreader,完整热量扩展)ILP(Instruction Level Parallelism,指令级平行运算)IMM: Intel Mobile Module, 英特尔移动模块Instructions Cache,指令缓存Instruction Coloring(指令分类)IOPs(Integer Operations Per Second,整数操作/秒)IPC(Instructions Per Clock Cycle,指令/时钟周期)ISA(instruction set architecture,指令集架构)ISD(inbuilt speed-throttling device,内藏速度控制设备)ITC(Instruction Trace Cache,指令追踪缓存)ITRS(International Technology Roadmap for Semiconductors,国际半导体技术发展蓝图)KNI(Katmai New Instructions,Katmai新指令集,即SSE)Latency(潜伏期)LDT(Lightning Data Transport,闪电数据传输总线)LFU(Legacy Function Unit,传统功能单元)LGA(land grid array,接点栅格阵列)LN2(Liquid Nitrogen,液氮)Local Interconnect(局域互连)MAC(multiply-accumulate,累积乘法)mBGA (Micro Ball Grid Array,微型球状网阵排列)nm(namometer,十亿分之一米/毫微米)MCA(machine check architecture,机器检查体系)MCU(Micro-Controller Unit,微控制器单元)MCT(Memory Controller,内存控制器)MESI(Modified, Exclusive, Shared, Invalid:修改、排除、共享、废弃)MF(MicroOps Fusion,微指令合并)mm(micron metric,微米)MMX(MultiMedia Extensions,多媒体扩展指令集)MMU(Multimedia Unit,多媒体单元)MMU(Memory Management Unit,内存管理单元)MN(model numbers,型号数字)MFLOPS(Million Floating Point/Second,每秒百万个浮点操作)MHz(megahertz,兆赫)mil(PCB 或晶片?丫值拈L度?挝唬?1 mil = 千分之一英寸)MIPS(Million Instruction Per Second,百万条指令/秒)MOESI(Modified, Owned, Exclusive, Shared or Invalid,修改、自有、排除、共享或无效)MOF(Micro Ops Fusion,微操作熔合)Mops(Million Operations Per Second,百万次操作/秒)MP(Multi-Processing,多重处理器架构)MPF(Micro processor Forum,微处理器论坛)MPU(Microprocessor Unit,微处理器)MPS(MultiProcessor Specification,多重处理器规范)MSRs(Model-Specific Registers,特别模块寄存器)MSV(Multiprocessor Specification Version,多处理器规范版本)NAOC(no-account OverClock,无效超频)NI(Non-Intel,非英特尔)NOP(no operation,非操作指令)NRE(Non-Recurring Engineering charge,非重?}性工程?M用)OBGA(Organic Ball Grid Arral,有机球状网阵排列)OCPL(Off Center Parting Line,远离中心部分线队列)OLGA(Organic Land Grid Array,有机平面网阵包装)OoO(Out of Order,乱序执行)OPC(Optical Proximity Correction,光学临近修正)OPGA(Organic Pin Grid Array,有机塑料针型栅格阵列)OPN(Ordering Part Number,分类零件号码)PAT(Performance Acceleration Technology,性能加速技术)PBGA(Plastic Pin Ball Grid Array,塑胶球状网阵排列)PDIP (Plastic Dual-In-Line,塑料双重直线)PDP(Parallel Data Processing,并行数据处理)PGA(Pin-Grid Array,引脚网格阵列),耗电大PLCC (Plastic Leaded Chip Carriers,塑料行间芯片运载)Post-RISC(加速RISC,或后RISC)PR(Performance Rate,性能比率)PIB(Processor In a Box,盒装处理器)PM(Pseudo-Multithreading,假多线程)PPGA(Plastic Pin Grid Array,塑胶针状网阵封装)PQFP(Plastic Quad Flat Package,塑料方块平面封装)PSN(Processor Serial numbers,处理器序列号)QFP(Quad Flat Package,方块平面封装)QSPS(Quick Start Power State,快速启动能源状态)RAS(Return Address Stack,返回地址堆栈)RAW(Read after Write,写后读)REE(Rapid Execution Engine,快速执行引擎)Register Contention(抢占寄存器)Register Pressure(寄存器不足)Register Renaming(寄存器重命名)Remark(芯片频率重标识)Resource contention(资源冲突)Retirement(指令引退)RISC(Reduced Instruction Set Computing,精简指令集计算机)ROB(Re-Order Buffer,重排序缓冲区)RSE(register stack engine,寄存器堆栈引擎)RTL(Register Transfer Level,?捍嫫鬓D?Q?印S搀w描述?Z言的一?N描述?哟危? SC242(242-contact slot connector,242脚金手指插槽连接器)SE(Special Embedded,特别嵌入式)SEC(Single Edge Connector,单边连接器)SECC(Single Edge Contact Cartridge,单边接触卡盒)SEPP(Single Edge Processor Package,单边处理器封装)Shallow-trench isolation(浅槽隔离)SIMD(Single Instruction Multiple Data,单指令多数据流)SiO2F(Fluorided Silicon Oxide,二氧氟化硅)SMI(System Management Interrupt,系统管理中断)SMM(System Management Mode,系统管理模式)SMP(Symmetric Multi-Processing,对称式多重处理架构)SMT(Simultaneous multithreading,同步多线程)SOI(Silicon-on-insulator,绝缘体硅片)SOIC (Plastic Small Outline,塑料小型)SONC(System on a chip,系统集成芯片)SPGA(Staggered Pin Grid Array、交错式针状网阵封装)SPEC(System Performance Evaluation Corporation,系统性能评估测试)SQRT(Square Root Calculations,平方根计算)SRQ(System Request Queue,系统请求队列)SSE(Streaming SIMD Extensions,单一指令多数据流扩展)SFF(Small Form Factor,更小外形格局)SS(Special Sizing,特殊缩放)SSP(Slipstream processing,滑流处理)SST(Special Sizing Techniques,特殊筛分技术)SSOP (Shrink Plastic Small Outline,缩短塑料小型)STC(Space Time Computing,空余时间计算)Superscalar(超标量体系结构)TAP(Test Access Port,测试存取端口)TBGA(Tie Ball Grid Array,带状球形光栅阵列)TCP: Tape Carrier Package(薄膜封装),发热小TDP(Thermal Design Power,热量设计功率)Throughput(吞吐量)TLB(Translate Look side Buffers,转换旁视缓冲器)TLP(Thread-Level Parallelism,线程级并行)TMP(Threaded Multi-Path,线程多通道)TPI(True Performance Initiative/index,真实性能为先/指标)TQFP (Thin Plastic Quad Flat Pack,薄型方面平面封装)Trc(Row Cycle Time,列循环时间)TrD(Transistor Density,晶体管密度)TSOP(Thin Small Outline Plastic,薄型小型塑料)USWC(Uncacheabled Speculative Write Combination,无缓冲随机联合写操作)VALU(Vector Arithmetic Logic Unit,向量算术逻辑单元)VFSD(Vertex Frequency Stream Divider,顶点频率流分隔)VID(VID:Voltage identify,电压鉴别号码)VLIW(Very Long Instruction Word,超长指令字)VPU(Vector Permutate Unit,向量排列单元)VPU(vector processing units,向量处理单元,即处理MMX、SSE等SIMD指令的地方)VSA(Virtual System Architecture,虚拟系统架构)VTF(VIA Technical Forum,威盛技术论坛)XBar(Crossbar,交叉口闩仲载逻辑单元)XP(Experience,体验)XP(Extra performance,额外性能)XP(eXtreme Performance,极速性能)散热器TFT(Tiny Fin Technology,微型鳍片技术)2、主板3GIO(Third Generation Input/Output,第三代输入输出技术)ACR(Advanced Communications Riser,高级通讯升级卡)ADIMM(advanced Dual In-line Memory Modules,高级双重内嵌式内存模块)AGTL+(Assisted Gunning Transceiver Logic,援助发射接收逻辑电路)AIMM(AGP Inline Memory Module,AGP板上内存升级模块)AMR(Audio/Modem Riser;音效/调制解调器主机板附加直立插卡)AHA(Accelerated Hub Architecture,加速中心架构)AOI(Automatic Optical Inspection,自动光学检验)APU(Audio Processing Unit,音频处理单元)ARF(Asynchronous Receive FIFO,异步接收先入先出)ASF(Alert Standards Forum,警告标准讨论)ASK IR(Amplitude Shift Keyed Infra-Red,长波形可移动输入红外线)AT(Advanced Technology,先进技术)ATX(AT Extend,扩展型AT)BIOS(Basic Input/Output System,基本输入/输出系统)CNR(Communication and Networking Riser,通讯和网络升级卡)CSA(Communication Streaming Architecture,通讯流架构)CSE(Configuration Space Enable,可分配空间)COAST(Cache-on-a-stick,条状缓存)DASP(Dynamic Adaptive Speculative Pre-Processor,动态适应预测预处理器)DB: Device Bay,设备插架DMI(Desktop Management Interface,桌面管理接口)DOT(Dynamic Overclocking Technonlogy,动态超频技术)DPP(direct print Protocol,直接打印协议DRCG(Direct Rambus clock generator,直接RAMBUS时钟发生器)DVMT(Dynamic Video Memory Technology,动态视频内存技术)E(Economy,经济,或Entry-level,入门级)EB(Expansion Bus,扩展总线)EFI(Extensible Firmware Interface,扩展固件接口)EHCI(Enhanced Host Controller Interface,加强型主机端控制接口)EISA(Enhanced Industry Standard Architecture,增强形工业标准架构)EMI(Electromagnetic Interference,电磁干扰)ESCD(Extended System Configuration Data,可扩展系统配置数据)ESR(Equivalent Series Resistance,等价系列电阻)FBC(Frame Buffer Cache,帧缓冲缓存)FireWire(火线,即IEEE1394标准)FlexATX(Flexibility ATX,可扩展性ATX)FSB(Front Side Bus,前端总线)FWH(Firmware Hub,固件中心)GB(Garibaldi架构,Garibaldi基于ATX架构,但是也能够使用WTX构架的机箱)GMCH(Graphics & Memory Controller Hub,图形和内存控制中心)GPA(Graphics Performance Accelerator,图形性能加速卡)GPIs(General Purpose Inputs,普通操作输入)GTL+(Gunning Transceiver Logic,发射接收逻辑电路)HDIT(High Bandwidth Differential Interconnect Technology,高带宽微分互连技术)HSLB(High Speed Link Bus,高速链路总线)HT(HyperTransport,超级传输)I2C(Inter-IC)I2C(Inter-Integrated Circuit,内置集成电路)IBASES(Intel Baseline AGP System Evaluation Suite,英特尔基线AGP系统评估套件)IC(integrate circuit,集成电路)ICH(Input/Output Controller Hub,输入/输出控制中心)ICH-S(ICH-Hance Rapids,ICH高速型)ICP(Integrated Communications Processor,整合型通讯处理器)IHA(Intel Hub Architecture,英特尔Hub架构)IMB(Inter Module Bus,隐藏模块总线)INTIN(Interrupt Inputs,中断输入)IPMAT(Intel Power Management Analysis Tool,英特尔能源管理分析工具)IR(infrared ray,红外线)IrDA(infrared ray,红外线通信接口,可进行局域网存取和文件共享)ISA(Industry Standard Architecture,工业标准架构)ISA(instruction set architecture,工业设置架构)K8HTB(K8 HyperTransport Bridge,K8闪电传输桥)LSI(Large Scale Integration,大规模集成电路)LPC(Low Pin Count,少针脚型接口)MAC(Media Access Controller,媒体存储控制器)MBA(manage boot agent,管理启动代理)MC(Memory Controller,内存控制器)MCA(Micro Channel Architecture,微通道架构)MCH(Memory Controller Hub,内存控制中心)MDC(Mobile Daughter Card,移动式子卡)MII(Media Independent Interface,媒体独立接口)MIO(Media I/O,媒体输入/输出单元)MOSFET(metallic oxide semiconductor field effecttransistor,金属氧化物半导体场效应晶体管)MRH-R(Memory Repeater Hub,内存数据处理中心)MRH-S(SDRAM Repeater Hub,SDRAM数据处理中心)MRIMM(Media-RIMM,媒体RIMM扩展槽)MSI(Message Signaled Interrupt,信息信号中断)MSPCE(Multiple Streams with Pipelining and Concurrent Execution,多重数据流的流水线式传输与并发执行)MT=MegaTransfers(兆传输率)MTH(Memory Transfer Hub,内存转换中心)MuTIOL(Multi-Threaded I/O link,多线程I/O链路)NGIO(Next Generation Input/Output,新一代输入/输出标准)NPPA(nForce Platform Processor Architecture,nForce平台处理架构)OHCI(Open Host Controller Interface,开放式主控制器接口)ORB(operation request block,操作请求块)ORS(Over Reflow Soldering,再流回焊接,SMT元件的焊接方式)P64H(64-bit PCI Controller Hub,64位PCI控制中心)PCB(printed circuit board,印刷电路板)PCBA(Printed Circuit Board Assembly,印刷电路板装配)PCI(Peripheral Component Interconnect,互连外围设备)PCI SIG(Peripheral Component Interconnect Special Interest Group,互连外围设备专业组)PDD(Performance Driven Design,性能驱动设计)PHY(Port Physical Layer,端口物理层)POST(Power On Self Test,加电自测试)PS/2(Personal System 2,第二代个人系统)PTH(Plated-Through-Hole technology,镀通孔技术)RE(Read Enable,可读取)QP(Quad-Pumped,四倍泵)RBB(Rapid BIOS Boot,快速BIOS启动)RNG(Random number Generator,随机数字发生器)RTC(Real Time Clock,实时时钟)KBC(KeyBroad Control,键盘控制器)SAP(Sideband Address Port,边带寻址端口)SBA(Side Band Addressing,边带寻址)SBC(single board computer,单板计算机)SBP-2(serial bus protocol 2,第二代串行总线协协)SCI(Serial Communications Interface,串行通讯接口)SCK (CMOS clock,CMOS时钟)SDU(segment data unit,分段数据单元)SFF(Small Form Factor,小尺寸架构)SFS(Stepless Frequency Selection,步进频率选项)SMA(Share Memory Architecture,共享内存结构)SMT(Surface Mounted Technology,表面黏贴式封装)SPI(Serial Peripheral Interface,串行外围设备接口)SSLL(Single Stream with Low Latency,低延迟的单独数据流传输)STD(Suspend To Disk,磁盘唤醒)STR(Suspend To RAM,内存唤醒)SVR(Switching Voltage Regulator,交换式电压调节)THT(Through Hole Technology,插入式封装技术)UCHI(Universal Host Controller Interface,通用宿主控制器接口)UPA(Universal Platform Architecture,统一平台架构)UPDG(Universal Platform Design Guide,统一平台设计导刊)USART(Universal Synchronous Asynchronous Receiver Transmitter,通用同步非同步接收传送器)USB(Universal Serial Bus,通用串行总线)USDM(Unified System Diagnostic Manager,统一系统监测管理器)VID(Voltage Identification Definition,电压识别认证)VLB(Video Electronics Standards Association Local Bus,视频电子标准协会局域总线)VLSI(Very Large Scale Integration,超大规模集成电路)VMAP(VIA Modular Architecture Platforms,VIA模块架构平台)VSB(V Standby,待命电压)VXB(Virtual Extended Bus,虚拟扩展总线)VRM(Voltage Regulator Module,电压调整模块)WE(Write Enalbe,可写入)WS(Wave Soldering,波峰焊接,THT元件的焊接方式)XT(Extended Technology,扩充技术)ZIF(Zero Insertion Force, 零插力插座)芯片组ACPI(Advanced Configuration and Power Interface,先进设置和电源管理)AGP(Accelerated Graphics Port,图形加速接口)BMS(Blue Magic Slot,蓝色魔法槽)I/O(Input/Output,输入/输出)MIOC: Memory and I/O Bridge Controller,内存和I/O桥控制器NBC: North Bridge Chip(北桥芯片)PIIX: PCI ISA/IDE Accelerator(加速器)PSE36: Page Size Extension 36-bit,36位页面尺寸扩展模式PXB: PCI Expander Bridge,PCI增强桥RCG: RAS/CAS Generator,RAS/CAS发生器SBC: South Bridge Chip(南桥芯片)SMB(System Management Bus,全系统管理总线)SPD(Serial Presence Detect,连续存在检测装置)SSB: Super South Bridge,超级南桥芯片TDP: Triton Data Path(数据路径)TSC: Triton System Controller(系统控制器)QPA: Quad Port Acceleration(四接口加速)3、显示设备AD(Analog to Digitalg,模拟到数字转换)ADC(Apple Display Connector,苹果专用显示器接口)ASIC(Application Specific Integrated Circuit,特殊应用积体电路)ASC(Auto-Sizing and Centering,自动调效屏幕尺寸和中心位置)ASC(Anti Static Coatings,防静电涂层)ASD(Auto Stereoscopic Display,自动立体显示)AGC(Anti Glare Coatings,防眩光涂层)AG(Aperture Grills,栅条式金属板)ARC(Anti Reflect Coating,防反射涂层)BLA: Bearn Landing Area(电子束落区)BMC(Black Matrix Screen,超黑矩阵屏幕)CCS(Cross Capacitance Sensing,交叉电容感应)cd/m^2(candela/平方米,亮度的单位)CDRS(Curved Directional Reflection Screen,曲线方向反射屏幕)CG-Silicon(Continuous Grain Silicon,连续微粒硅)CNT(carbon nano-tube,碳微管)CRC(Cyclical Redundancy Check,循环冗余检查)CRT(Cathode Ray Tube,阴极射线管)CVS(Compute Visual Syndrome,计算机视觉综合症)DA(Digital to Analog,数字到模拟转换)DDC(Display Data Channel,显示数据通道)DDWG(Digital Display Working Group,数字化显示工作组)DEC(Direct Etching Coatings,表面蚀刻涂层)Deflection Coil(偏转线圈)DFL(Dynamic Focus Lens,动态聚焦)DFP(Digital Flat Panel,数字平面显示标准)DFPG(Digital Flat Panel Group,数字平面显示标准工作组)DFS(Digital Flex Scan,数字伸缩扫描)DIC: Digital Image Control(数字图像控制)Digital Multiscan II(数字式智能多频追踪)DLP(digital Light Processing,数字光处理)DOSD: Digital On Screen Display(同屏数字化显示)DPMS(Display Power Management Signalling,显示能源管理信号)Dot Pitch(点距)DQL(Dynamic Quadrapole Lens,动态四极镜)DSP(Digital Signal Processing,数字信号处理)DSTN(Double layers Super Twisted Nematic,双层超扭曲向列,无源矩阵LCD)DTV(Digital TV,数字电视)DVI(Digital Visual Interface,数字化视像接口)ECD(ElectroChromic Display,电铬显示器)EFEAL(Extended Field Elliptical Aperture Lens,可扩展扫描椭圆孔镜头)FED(Field Emission Displays,电场显示器)Flyback Transformer(回转变压器)FPD(flat panel display,平面显示器)FRC: Frame Rate Control(帧比率控制)GLV(grating-light-valve,光栅亮度阀)HDMI(High Definition Multimedia Interface,高精度多媒体接口)HDTV(high definition television,高清晰度电视)HVD(High Voltage Differential,高分差动)IFT(Infinite FlatTube,无限平面管,三星丹娜)INVAR(不胀铜)IPS(in-plane switching,平面开关)LCD(liquid crystal display,液晶显示屏)LCOS: Liquid Crystal On Silicon(硅上液晶)LED(light emitting diode,光学二级管)L-SAGIC(Low Power-Small Aperture G1 wiht Impregnated Cathode,低电压光圈阴极管)LTPS(Low-Temperature Poly-Si,低温多晶硅)LVD(Low Voltage Differential,低分差动)LVDS(Low Voltage Differential Signal,低分差动信号)LRTC(LCD Response Time Compensation,液晶响应时间补偿)LTPS(Low Temperature Polysilicon,低温多硅显示器)MALS(Multi Astigmatism Lens System,多重散光聚焦系统)MDA(Monochrome Adapter,单色设备)Monochrome Monitor(单色显示器)MS: Magnetic Sensors(磁场感应器)MVA(multi-domain vertical alignment,广域垂直液晶队列)OEL(organic electro-luminescent,有机电镀冷光)OLED(Organic light-emitting diode,有机电激发光显示器)OSD(On Screen Display,同屏显示)PAC(psycho-acoustic compensation,心理声学补偿)P&D(Plug and Display,即插即显)PDP(Plasma Display Panel,等离子显示器)Porous Tungsten(活性钨)PPI(Pixel Per Inch,像素/英寸)RGB(Red、Blue、Green,红、蓝、绿三原色)ROP(raster operations,光栅操作)RSDS: Reduced Swing Differential Signal(小幅度摆动差动信号)SC(Screen Coatings,屏幕涂层)Single Ended(单终结)Shadow Mask(点状阴罩)SXGA(Super eXtended Graphics Array,超级扩展型图形阵列)STN(Super Twisted Nematic,超扭曲向列,无源矩阵)TCO(The Swedish Confederation of Professional Employees,瑞典专业工作人员联合会)TDT(Timeing Detection Table,数据测定表)TMDS(Transition Minimized Differential Signaling,转换极低损耗微分信号)TN(Twisted Nematic,扭曲液晶向列,无源矩阵LCD)TN+film(twisted nematic and retardation film,扭曲液晶向列+延迟薄膜)TICRG: Tungsten Impregnated Cathode Ray Gun(钨传输阴级射线枪)TFT(thin film transistor,薄膜晶体管,有源矩阵LCD)Trinitron(特丽珑)UCC(Ultra Clear Coatings,超清晰涂层)UFB(Ultra-Fine&Bright,新概念超亮度液晶显示屏)UXGA (Ultra Extended Graphics Array,极速扩展图形阵列)VAGP: Variable Aperature Grille Pitch(可变间距光栅)VBI: Vertical Blanking Interval(垂直空白间隙)VESA(Video Electronics Standards Association,视频电子标准协会)VGA(video graphics array,视频图像阵列)VDT(Video Display Terminals,视频显示终端)VRR: Vertical Refresh Rate(垂直扫描频率)VW(Virtual Window,虚拟视窗)XGA(eXtended Graphics Array,扩展型图形阵列)YUV(亮度和色差信号)4、视频3D:Three Dimensional,三维3DCG(3D computer graphics,三维计算机图形)3DS(3D SubSystem,三维子系统)A-Buffer(Accumulation Buffer,积聚缓冲)AA(Accuview Antialiasing,高精度抗锯齿)ADC(Analog to Digital Converter,模数传换器)ADI(Adaptive De-Interlacing,自适应交错化技术)AE(Atmospheric Effects,大气雾化效果)AFC(Advanced Frame Capture、高级画面捕获)AFR(Alternate Frame Rendering,交替渲染技术)Anisotropic Filtering(各向异性过滤)APPE(Advanced Packet Parsing Engine,增强形帧解析引擎)AR(Auto-Resume,自动恢复)AST(amorphous-silicon TFT,非晶硅薄膜晶体管)AV(Analog Video,模拟视频)AV(Audio & Video,音频和视频)B Splines(B样条)BAC(Bad Angle Case,边角损坏采样)Back Buffer,后置缓冲Backface culling(隐面消除)Battle for Eyeballs(眼球大战,各3D图形芯片公司为了争夺用户而作的竞争)Bilinear Filtering(双线性过滤)B.O.D.E(Body、Object、Design、Envioment,人体、物体、设计、环境渲染自动识别)BSP(Binary Space Partitioning,二进制空间分区)CBMC(Crossbar based memory controller,内存控制交叉装置)CBU(color blending unit,色彩混和单位)CEA(Critical Edge Angles,临界边角)CEM(cube environment mapping,立方环境映射)CG(C for Graphics/GPU,用于图形/GPU的可编程语言)CG(Computer Graphics,计算机生成图像)Clipping(剪贴纹理)Clock Synthesizer,时钟合成器compressed textures(压缩纹理)Concurrent Command Engine,协作命令引擎CSC(Colorspace Conversion,色彩空间转换)CSG (constructive solid geometry,建设立体几何)CSS(Content Scrambling System,内容不规则加密)DAC(Digital to Analog Converter,数模传换器)DCD(Directional Correlational De-interlacing,方向关联解交错)DCT(Display Compression Technology,显示压缩技术)DDC(Dynamic Depth Cueing,动态深度暗示)图像DDP(Digital Display Port,数字输出端口)DDS(Direct Draw Surface,直接绘画表面)Decal(印花法,用于生成一些半透明效果,如:鲜血飞溅的场面)DFP(Digital Flat Panel,数字式平面显示器)DFS: Dynamic Flat Shading(动态平面描影),可用作加速Dithering(抖动)Directional Light,方向性光源DM(Displacement mapping,位移贴图)DME(Direct Memory Execute,直接内存执行)DOF(Depth of Field,多重境深)dot texture blending(点型纹理混和)DOT3(Dot product 3 bump mapping,点乘积凹凸映射)Double Buffering(双缓冲区)DPBM(Dot Product Bump Mapping,点乘积凹凸映射)DQUICK(DVD Qualification and Integration Kit,DVD资格和综合工具包)DRA(deferred rendering architecture,延迟渲染架构)DRI(Direct Rendering Infrastructure,基层直接渲染)DSP(Dual Streams Processor,双重流处理器)DVC(Digital Vibrance Control,数字振动控制)DVI(Digital Video Interface,数字视频接口)DVMT(Dynamic Video Memory Technology,动态视频内存技术)DxR: DynamicXTended Resolution(动态可扩展分辨率)DXTC(Direct X Texture Compress,DirectX纹理压缩,以S3TC为基础)Dynamic Z-buffering(动态Z轴缓冲区),显示物体远近,可用作远景E-DDC(Enhanced Display Data Channel,增强形视频数据通道协议,定义了显示输出与主系统之间的通讯通道,能提高显示输出的画面质量)Edge Anti-aliasing(边缘抗锯齿失真)E-EDID(Enhanced Extended Identification Data,增强形扩充身份辨识数据,定义了电脑通讯视频主系统的数据格式)eFB(embedded Frame Buffer,嵌入式帧缓冲)eTM(embedded Texture Buffer,嵌入式纹理缓冲)Execute Buffers,执行缓冲区Embosing,浮雕EMBM(environment mapped bump mapping,环境凹凸映射)Extended Burst Transactions,增强式突发处理Factor Alpha Blending(因子阿尔法混合)Fast Z-clear,快速Z缓冲清除FB(fragment buffer,片段缓冲)FL(fragment list,片段列表)FW(Fast Write,快写,AGP总线的特殊功能)Front Buffer,前置缓冲Flat(平面描影)FL(Function Lookup,功能查找)FMC(Frictionless Memory Control,无阻内存控制)Frames rate is King(帧数为王)FRC(Frame Rate Control,帧率控制)FSAA(Full Scene/Screen Anti-aliasing,全景/屏幕抗锯齿)Fog(雾化效果)flip double buffered(反转双缓存)fog table quality(雾化表画质)F-Buffer(Fragment Stream FIFO Buffer,片段流先入先出缓冲区)GPT(Graphics Performance Toolkit,图形性能工具包)FRJS(Fully Random Jittered Super-Sampling,完全随机移动式超级采样)Fur(软毛效果)GART(Graphic Address Remappng Table,图形地址重绘表)GI(Global Illumination,球形光照)GIC(Gold Immersion Coating,化金涂布技术,纯金材质作为PCB最终层,提升信号完整性)GIF(Graphics Interchange Format,图像交换格式)Gouraud Shading,高洛德描影,也称为内插法均匀涂色GPU(Graphics Processing Unit,图形处理器)GTF(Generalized Timing Formula,一般程序时间,定义了产生画面所需要的时间,包括了诸如画面刷新率等)GTS(Giga Textel Sharder,十亿像素填充率)Guard Band Support(支持保护带)HAL(Hardware Abstraction Layer,硬件抽像化层)HDR(High Dynamic Range,高级动态范围)HDRL(high dynamic-range lighting,高动态范围光线)HDVP(High-Definition Video Processor,高精度视频处理器)HEL: Hardware Emulation Layer(硬件模拟层)HLSL(High Level Shading Language,高级描影语言)HMC(hardware motion compensation,硬件运动补偿)Hierarchical Z(Z分级)high triangle count(复杂三角形计数)HOS(Higher-Order Surfaces,高次序表面)HPDR(High-Precision Dynamic-Range,高精度动态范围)HRAA(High Resolution Anti-aliasing,高分辨率抗锯齿)HSI(High Speed Interconnect,高速内连)HSR(Hidden Surface Removal,隐藏表面移除)HTP(Hyper Texel Pipeline,超级像素管道)HWMC(Hardware Motion Compensation,硬件运动补偿)ICD(Installable Client Driver,可安装客户端驱动程序)iDCT(inverse Discrete Cosine Transformation,负离散余弦转换)IDE(Integrated Development Environment,集成开发环境)Immediate Mode,直接模式IMMT(Intelligent Memory Manager Technology,智能内存管理技术)Imposters(诈欺模型)IPEAK GPT(Intel Performance Evaluation and Analysis Kit - Graphics Performance Toolkit,英特尔性能评估和分析套件 - 图形性能工具包)IPPR: Image Processing and Pattern Recognition(图像处理和模式识别)IR(Immediate Rendering,直接渲染)IRA(immediate-mode rendering architecture,即时渲染架构)IQ(inverse quantization,反转量子化)ITC(Internal True Color,内部真彩色)IVC(Indexed Vertex Cache,索引顶点缓存)JFAA(Jitter Free Anti Aliasing,自由跳跃进抗锯齿)JGSS(Jittered Grid Super-Sampling,移动式栅格超级采样)JPRS(Jittered pseudo random sampling,抖动假取样)Key Frame Interpolation,关键帧插补large textures(大型纹理)LE(low end,低端)LF(Linear Filtering,线性过滤,即双线性过滤)LFB(Linear Frame-Buffer,线性帧缓冲)LFM(Light Field Mapping,光照区域贴图)lighting(光源)lightmap(光线映射)LMA(Lightspeed memory Architecture,光速内存架构)Local Peripheral Bus(局域边缘总线)LOD(Levels-of-Detail,细节级)Lossless Z Compression,无损Z压缩LPF(Low-past filter,低通道滤波器)LSR(Light Shaft Rendering,光线轴渲染)mipmapping(MIP映射)MAC(Mediocre Angle Case,普通角采样)Matrix Vertex Blending,矩阵顶点混和MCM(Multichip Module,多芯片模块)Membrane lighting,隔膜光线Mipmap LOD Bias Adjustment(映射LOD偏移调节)Modulate(调制混合)Motion Compensation,动态补偿motion blur(模糊移动)MPPS:Million Pixels Per Second,百万个像素/秒MRT(Multiple Render Targets,多重渲染目标)MSAA(multisampling Scene/Screen Anti-aliasing,多重采样抗锯齿)Multiplicative Texture Blending(乘法纹理混合)Multi-Resolution Mesh,多重分辨率组合Multi Threaded Bus Master,多线程主控Multitexture(多重纹理)MVSD(Motion Vector Steered de-interlacing,移动向量控制解交错)MXM(Mobile PCI Express Module,移动PCI Express模块)NURBS(Non Uniform Relational B Splines,非统一相关B样条)nerest Mipmap(邻近MIP映射,又叫点采样技术)NGP(Next-Generation Graphics Port,下一代图形接口)NSR(nVidia Shading Rasterizer,nVidia描影光栅引擎)NXL(NVIDIA XPress Link,nViadia X紧迫链路)OGSS(Ordered Grid Super-Sampling,顺序栅格超级采样)ORB(Online ResultBrowser,在线分数浏览)OTES(Outside Thermal Exhaust System,向外热排气系统)Overdraw(透支,全景渲染造成的浪费)partial texture downloads(并行纹理传输)Parallel Processing Perspective Engine(平行透视处理器)。
学习c语言的英文作文
学习c语言的英文作文Learning C Programming LanguageC programming language is a powerful and versatile language that has been widely used in various fields of computer science and software development. It is a low-level language that provides a close-to-the-hardware approach, allowing developers to have greater control over system resources and memory management. As a result, C has become a fundamental language for many applications, from operating systems and device drivers to system programming and embedded systems.One of the key reasons for the popularity of C is its efficiency and performance. The language was designed to be fast and compact, making it well-suited for applications that require high-speed processing or limited memory resources. This has made C an essential tool for developers working on systems that need to operate in real-time or have strict performance requirements, such as video games, multimedia applications, and scientific computing.Another important aspect of C is its portability. The language was designed to be platform-independent, meaning that code written inC can be compiled and executed on a wide range of hardware and operating systems. This has made C a popular choice for developing cross-platform applications and has contributed to its widespread adoption in the industry.Learning C programming language can be a challenging but rewarding experience. The language has a steep learning curve, as it requires a deep understanding of computer architecture, memory management, and low-level programming concepts. However, once mastered, C provides a solid foundation for further learning in computer science and software development.One of the key skills required for learning C is a strong grasp of data types, pointers, and memory management. Pointers, in particular, are a fundamental concept in C that can be difficult for beginners to understand. Pointers are variables that store the memory addresses of other variables, allowing for dynamic memory allocation and manipulation. Mastering the use of pointers is crucial for writing efficient and robust C code.Another important aspect of learning C is understanding the language's syntax and control structures. C has a relatively simple and straightforward syntax, but it can be easy to make mistakes, especially when it comes to things like variable declarations, function calls, and loop structures. Developing a strong understanding ofthese basic language features is essential for writing clean and maintainable C code.In addition to the technical aspects of the language, learning C also involves developing a problem-solving mindset. C programming often requires a deep understanding of algorithms and data structures, as well as the ability to break down complex problems into smaller, more manageable tasks. This problem-solving approach is not only useful for C programming but can also be applied to a wide range of other programming languages and domains.One of the best ways to learn C programming is to start with simple programs and gradually work your way up to more complex projects. This could involve writing simple console applications, implementing basic data structures and algorithms, or even contributing to open-source C projects. By building a solid foundation and continuously practicing, learners can develop the skills and confidence needed to tackle more advanced C programming challenges.In conclusion, learning C programming language is a valuable and rewarding endeavor for anyone interested in computer science and software development. The language's efficiency, portability, and low-level nature make it a crucial tool for a wide range of applications, from operating systems to embedded systems. By mastering the fundamentals of C programming, learners can not onlybecome proficient in a powerful and versatile language but also develop essential problem-solving skills that can be applied to a wide range of programming and computer science-related tasks.。
终结开机蓝屏错误memorymanagement
2.打开注册表
3. 找到并单击以下注册表子项之一:
HKEY_LOCAL_MACHINE\System\CurrentControlSet\Services\Msahci
HKEY_LOCAL_MACHINE\System\CurrentControlSet\Services\IastorV
请注意甄别内容中的联系方式诱导购买等信息谨防诈骗
终结开机蓝屏错误memorymanagement
memory management蓝屏;
蓝屏错误memory management;
WINDOWS8.1系统,开机时出现蓝屏,提示错误memory management,如下图:
经过不断尝试,终于找到原因所在,下面是解决办法:
4. 在右侧窗格中,在名Байду номын сангаас列中,右键单击start,然后单击修改。
5. 在值数据框中,键入0,然后单击确定。
6、保存退出注册表
以上终结开机蓝屏错误memory management出自土豆PE,感谢浏览~!
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– below max_nn (note C is case-sensitive and hence max_nn and MAX_NN are different “symbols”) is a variable and hence the size of iarr is also variable
• heap memory: – deallocation:
void free(void *ptr);
• note free takes a void * as an argument thus any pointer could be passed to it:
double *dval_arr = NULL; dval_arr = (double *) malloc(SMALL_LEN * sizeof(double)); free(dval_arr);
• note however though, free only “frees” the space pointed to by dval_arr, it doesn’t “free” dval_arr itself, what does that mean? • the above “thing” is called the problem of “dangling pointers” &
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#define BIG_LEN 200000 /* Memory leak example: don’t do something like the following */ for (ii = 0; ; ) { printf("count = %d\n", ++ii); dval_arr = (double *) malloc(BIG_LEN * sizeof(double)); }
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Memory Management IV
• example of stack memory:
#define SMALL_LEN 50 double * mem_stack1 (void) { double dval; return &dval; } double * mem_stack2 (void) { double dval[SMALL_LEN]; return dval; }
• when to use which? • suppose your job is to store and do some “stuff” with the first N-natural numbers, where N is used specified – suppose beforehand you fix an upper limit and ask of the user to only specify N < 10000 then you may declare:
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• example stack memory mis-usage and heap memory usage:
malloc(SMALL_LEN * sizeof(double))
– “cast” the void * pointer to a pointer to double:
(double *) malloc(SMALL_LEN * sizeof(double))
– note, (double *) is the “cast” operator, in general (typename) foo casts variable foo to type typename &
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• the stack memory may/may not, we don’t know, cause runtime error giving Segmentation Fault • the heap memory if managed properly would work just fine • remember to always deallocate heap memory which you wouldn’t be using anymore • failure to properly deallocate causes what is known as “memory-leak” which makes the program slow and it ultimately gets killed by the operating system
int max_nn = 100000, iarr[max_nn];
– the above is not allowed by gcc -ansi -pedantic i.e. in ANSI C but C99 allows it so plain gcc without those options would compile it just fine – do not use this feature: is the right place to use dynamic memory management with malloc( ), free( ) and the sort c 2005 - Gopi Goswami (goswami@)
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• heap memory: – allocation:
void * malloc(size_t size);
• note malloc returns a void * pointer but, say, we want to allocate space for SMALL_LEN many doubles, here’s how you do it: – get the right amount of space:
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• the following two snippets do not do the same thing: – below MAX_NN is literally substitued by 10000 before compilation i.e. pretend that manually you had typed 10000 in your code wherever you see MAX_NN (why do this? it avoids “magic numbers”, coming later!)
#define MAX_NN 10000 int iarr[MAX_NN];
– note fixing an upper limit is kind of restrictive so you may decide to take a postive number, say, nn, as an input from the user and work with an array of length nn then you may declare (hold on, details coming later):
• example of heap memory:
#define SMALL_LEN 50 double * mem_heap1 (void) { double *dval_arr; dval_arr = (double *) malloc(SMALL_LEN * sizeof(double)); return dval_arr; }