HM100-251R0LF中文资料
Canon Cartridge 054 H Black 安全数据表说明书
SECTION 1: Identification of the substance/mixture and of the company/undertaking1.1. Product Identifier Product name Canon Cartridge 054 H Black Product Code(s)3028C0021.2. Relevant identified uses of the substance or mixture and uses advised against UseToner for electrophotographic machines1.3. Details of the supplier of the safety data sheet Supplier ImporterCanon Europa N.V.Bovenkerkerweg 59, 1185XB Amstelveen, The Netherlands +31 20 5458545, +31 20 5458222Manufacturer Canon Inc.30-2, Shimomaruko 3-Chome, Ohta-ku, Tokyo 146-8501, Japan 1.4. Emergency Telephone Number *1 Kontakt Giftlinien på tlf.nr.: 82 12 12 12 (åbent 24 timer i døgnet). Se punkt 4 om førstehjælp.*2 Only for the purpose of informing medical personnel in cases of acute intoxications.*3 Ask for Poison InformationSECTION 2: Hazards identification2.1. Classification of the substance or mixtureClassification according to Regulation (EC) No 1272/2008Not classified2.2. Label ElementsLabelling according to Regulation (EC) No 1272/2008112Safety Data SheetMalta 112Bulgaria Netherlands +31 (0)30-2748888 [*2]112Poland 112Version : 01Portugal +351 808 250 143CroatiaRomania +40 21 318 36 06+385 (0)1-23-48-342Slovakia +421 2 5477 4166Slovenia 112Cyprus Spain1121401Sweden 112 [*3]Issuing date : 02-Nov-2018United Kingdom 111 (UK only)Czech Republic Iceland 112+420 224919293Liechtenstein 145Norway+47 22 59 13 00Denmark Switzerland145+45 82 12 12 12 [*1]Estonia 16662SDS # : TCW 1791 N - 01 EU ENFinland +358 (0)9 471977France +33 (0)1 45 42 59 59Greece +30 210 7793777Austria Hungary +36 80 20 11 99+43 (0) 1 406 43 43Italy+39 (0)55 7947819Revision date : -Latvia+371 67042473Belgium Lithuania +370 687 53378+32 (0) 70 245 245LuxembourgHazard pictogramsNot requiredSignal wordNot requiredHazard statementsNot requiredPrecautionary statementsNot requiredOther InformationNone2.3. Other HazardsNoneSECTION 3: Composition/information on ingredients 3.2. MixturesChemical name CAS-No EC-No REACH registrationnumber Weight %Classification (Reg.1272/2008)Note toOtherHazardsStyrene acrylate copolymer CBI CBI None75 - 85NoneWax CBI CBI None 5 - 10NoneCarbon black1333-86-4215-609-9CBI 5 - 10NoneAmorphous silica7631-86-9231-545-401-2119379499-16-xxxx 1 - 3NoneFull texts of Hazard statement(s) are listed in SECTION 16Note to Other Hazards : The following substance(s) is (are) marked with (1), (2) and/or (3)- (1) Substance for which EU Occupational Exposure Limit(s) is (are) established (See SECTION 8)- (2) PBT substance or vPvB substance under Regulation (EC) No 1907/2006- (3) Substance listed in Candidate List of SVHC for Authorisation under Regulation (EC) No 1907/2006SECTION 4: First aid measures4.1. Description of first aid measuresInhalation Move to fresh air. Get medical attention immediately if symptoms occur.Ingestion Rinse mouth. Drink 1 or 2 glasses of water. Get medical attention immediately if symptomsoccur.Skin Contact Wash off immediately with soap and plenty of water. Get medical attention immediately ifsymptoms occur.Eye Contact Flush with plenty of water. Get medical attention immediately if symptoms occur.4.2. Most important symptoms and effects, both acute and delayedInhalation None under normal use. Exposure to excessive amounts of dust may cause physicalirritation to respiratory tract.Ingestion None under normal use.Skin Contact None under normal use.Eye Contact None under normal use. May cause slight irritation.Chronic Effects None under normal use. Prolonged inhalation of excessive amounts of dust may cause lungdamage.4.3. Indication of any immediate medical attention and special treatment neededNoneSECTION 5: Firefighting measures5.1. Extinguishing mediaSuitable extinguishing mediaUse CO 2, water, dry chemical, or foam.Unsuitable extinguishing mediaNone5.2. Special hazards arising from the substance or mixtureSpecial HazardMay form explosive mixtures with air.Hazardous combustion productsCarbon dioxide (CO 2), Carbon monoxide (CO)5.3. Advice for firefightersSpecial protective equipment for fire-fightersNoneSECTION 6: Accidental release measures6.1. Personal precautions, protective equipment and emergency proceduresAvoid breathing dust. Avoid contact with skin, eyes and clothing.6.2. Environmental PrecautionsKeep out of waterways.6.3. Methods and material for containment and cleaning upClean up promptly by scoop or vacuum. If a vacuum cleaner is used, be sure to use a model with dust explosion safety measures. May form explosive mixtures with air.6.4. Reference to other sectionsNoneSECTION 7: Handling and storage7.1. Precautions for safe handlingAvoid breathing dust. Avoid contact with skin, eyes and clothing. Clean contaminated surface thoroughly. Use only with adequate ventilation.7.2. Conditions for safe storage, including any incompatibilitiesKeep in a dry, cool and well-ventilated place. Keep out of the reach of children. Incompatible with oxidizing agents.7.3. Specific end usesToner for electrophotographic machines. Obtain special instructions before use.SECTION 8: Exposure controls/personal protection8.1. Control parametersExposure LimitsChemical name EU OEL Austria Belgium Bulgaria Cyprus Carbon black1333-86-4None None TWA: 3.5 mg/m3None NoneAmorphous silica 7631-86-9None TWA: 4 mg/m3inhalable fractionNone None NoneChemical name Czech Republic Denmark Finland France GermanyCarbon black 1333-86-4TWA: 2.0 mg/m3 dust TWA: 3.5 mg/m3TWA: 3.5 mg/m3STEL: 7 mg/m3TWA: 3.5 mg/m3NoneAmorphous silica 7631-86-9TWA: 4.0 mg/m3amorphous SiO2None TWA: 5 mg/m3None TRGS TWA: 4 mg/m3inhalable fractionDFG TWA: 4 mg/m3inhalable fractionChemical name Greece Hungary Ireland Italy NetherlandsCarbon black 1333-86-4TWA: 3.5 mg/m3STEL: 7 mg/m3None TWA: 3.5 mg/m3STEL: 7 mg/m3None NoneAmorphous silica 7631-86-9None None TWA: 6 mg/m3 totalinhalable dustTWA: 2.4 mg/m3respirable dustSTEL: 18 mg/m3 totalinhalable dustSTEL: 7.2 mg/m3respirable dustNone NoneChemical name Poland Portugal Romania Slovakia SpainCarbon black 1333-86-4TWA: 4.0 mg/m3 totalinhalable dustTWA: 3.5 mg/m3None TWA: 2 mg/m3respirable fraction, 5%or less fibrogeniccomponentTWA: 10 mg/m3respirable fraction,greater than 5%fibrogenic componentTWA: 10 mg/m3 totalaerosolTWA: 3.5 mg/m3Amorphous silica 7631-86-9None None None TWA: 4.0 mg/m3 totalaerosolNoneChemical name Sweden United Kingdom Norway Switzerland TurkeyCarbon black 1333-86-4TLV: 3 mg/m3 totaldustTWA: 3.5 mg/m3STEL: 7 mg/m3TWA: 3.5 mg/m3STEL: 3.5 mg/m3None NoneAmorphous silica 7631-86-9None TWA: 6 mg/m3inhalable dustTWA: 2.4 mg/m3respirable dustTWA: 1.5 mg/m3respirable dustSTEL: 1.5 mg/m3respirable dustTWA: 4 mg/m3inhalable dust, alsomanufactured in wetprocessingNone8.2. Exposure controlsAppropriate engineering controls None under normal use conditions. Individual protection measures, such as personal protective equipment Eye/face Protection Not required under normal use.Respiratory Protection Not required under normal use.Thermal hazardsNot ApplicableSECTION 9: Physical and chemical properties9.1. Information on basic physical and chemical properties Appearance Black ; powder OdorSlight odorOdor threshold No data available pHNot ApplicableEvaporation RateNot ApplicableFlammability (solid, gas)Not flammable; estimatedFlammability Limits in AirUpper Flammability Limit Not Applicable Lower Flammability Limit Not Applicable Vapor pressure Not Applicable Vapor density Not Applicable Relative density 1.0 - 1.2Solubility(ies)Organic solvent; partly soluble Partition coefficient: n-octanol/water Not Applicable Explosive properties May form explosive mixtures with air Oxidizing properties No data available9.2. Other Information No data availableSECTION 10: Stability and reactivity10.1. Reactivity None10.2. Chemical stability Stable10.3. Possibility of Hazardous Reactions None10.4. Conditions to Avoid None10.5. Incompatible materialsAcids, Bases, Oxidizing agents, Reducing agents.10.6. Hazardous Decomposition Products Carbon dioxide (CO 2), Carbon monoxide (CO)Melting/Freezing point (°C)Autoignition Temperature (°C)No data available 80 - 130 (Softening point)Decomposition Temperature (°C)> 200Boiling Point/Range (°C)Viscosity (mPa s)Not ApplicableNot Applicable Flash Point (°C)Not ApplicableSECTION 11: Toxicological information11.1. Information on toxicological effectsAcute toxicity Estimate: LD50 > 2000 mg/kg (Ingestion)Skin corrosion/irritation Estimate: Non-irritantSerious eye damage/eye irritation Estimate: Transient slight conjunctival irritation only.Sensitization Estimate: Non-sensitizingGerm cell mutagenicity Ames Test (S. typhimurium, E. coli): NegativeCarcinogenicity The IARC evaluated carbon black as a Group 2B carcinogen, for which there is inadequatehuman evidence, but sufficient animal evidence. The latter is based upon the developmentof lung tumors in rats receiving chronic inhalation exposure to powdered carbon black atlevels that induce particle overload of the lung.However, there is a two-year inhalation study of a toner containing carbon black whichdemonstrated no association between toner exposure and tumor development in rats. Reproductive Toxicity No data availableSTOT - single exposure No data availableSTOT - repeated exposure Muhle et al. reported pulmonary response upon chronic inhalation exposure in rats to atoner enriched in respirable-sized particles compared to commercial toner. No pulmonarychange was found at 1 mg/m3 which is most relevant to potential human exposure. Aminimal to mild degree of fibrosis was noted in 22% of the animals at 4 mg/m3, and a mildto moderate degree of fibrosis was observed in 92% of the animals at 16 mg/m3.These findings are attributed to "lung overloading", a generic response to excessiveamounts of any dust retained in the lung for a prolonged interval.Aspiration hazard No data availableOther Information No data availableSECTION 12: Ecological information12.1. ToxicityEcotoxicity effectsEstimate: Fish, 96h LC50 > 100 mg/lEstimate: Crustaceans, 48h EC50 > 100 mg/lEstimate: Algae, ErC50(0-72h) > 100 mg/l12.2. Persistence and degradabilityNo data available12.3. Bioaccumulative potentialNo data available12.4. Mobility in soilNo data available12.5. Results of PBT and vPvB assessmentThis preparation contains no substance considered to be persistent, bioaccumulating nor toxic (PBT).This preparation contains no substance considered to be very persistent nor very bioaccumulating (vPvB).12.6. Other adverse effects No data availableSECTION 13: Disposal considerations13.1. Waste treatment methodsDO NOT put toner or a toner container into fire. Heated toner may cause severe burns. DO NOT dispose of a toner container in a plastic crusher. Use a facility with dust explosion prevention measures. Finely dispersed particles form explosive mixtures with air.Dispose of in accordance with local regulations.SECTION 14: Transport informationSECTION 15: Regulatory information15.1. Safety, health and environmental regulations/legislation specific for the substance or mixture (EC) No 1907/2006 Authorisation Not regulated (EC) No 1907/2006 Restriction Not regulated (EC) No 1005/2009Not regulated (EC) No 850/2004Not regulated (EU) No 649/2012Not regulated Other InformationNone15.2. Chemical safety assessment NoneSECTION 16: Other informationKey literature references and sources for data- World Health Organization International Agency for Research on Cancer, IARC Monographs on the Evaluation on the Carcinogenic Risk of Chemicals to Humans- EU Regulation (EC) No 1907/2006, (EC) No 1272/2008, (EC) No 1005/2009, (EC) No 850/2004, (EU) No 649/2012None 14.7. Transport in bulk according to Annex II of MARPOL and the IBC CodeNot Applicable 14.3. Transport Hazard Class 14.1. UN numberNone None 14.4. Packing Group None14.5. Environmental Hazards Not classified as environmentally hazardous under UN Model Regulations and marine pollutant under IMDG Code.14.2. UN Proper Shipping Name 14.6. Special Precautions for usersIATA: Not regulatedKey or legend to abbreviations and acronyms used in the safety data sheet- PBT: Persistent, Bioaccumulative and Toxic- vPvB: very Persistent and very Bioaccumulative- SVHC: Substances of Very High Concern- EU OEL: Occupational exposure limits at Union level under Directive 2004/37/EC and (EU) 2017/2398, 98/24/EC, 91/322/EEC, 2000/39/EC, 2006/15/EC, 2009/161/EU and (EU) 2017/164.- TWA: Time Weighted Average- STEL: Short Term Exposure Limit- IARC: International Agency for Research on Cancer- IATA: International Air Transport Association- CBI: Confidential Business InformationIssuing date :02-Nov-2018Revision date :-Revision Note NoneThis safety data sheet (SDS) is supplied voluntarily.DisclaimerThe information provided on this SDS is correct to the best of our knowledge, information and belief at the date of its publication. The information given is designed only as a guide for safe handling, use, processing, storage, transportation, disposal and release and is not to be considered as a warranty or quality specification. The information relates only to the specific material designated and may not be valid for such material used in combination with any other material or in any process, unless specified in the text.。
施乐百风机RH系列离心风机技术参数
施乐百风机RH系列离心风机技术参数
1.风机型号：RH系列离心风机分为RH-1、RH-2、RH-3和RH-4四个型号，分别适用于不同的场合和流量要求。
3.静压范围：RH系列离心风机的静压范围从100Pa到3000Pa不等，可以提供不同的静压级别和风力。
4. 转速范围：RH系列离心风机的转速范围从600 rpm到3600 rpm 不等，可以根据实际需求进行调整。
5.电机功率：RH系列离心风机的电机功率范围从0.75kW到315kW不等，可以满足不同的风量和静压需求。
6.效率：RH系列离心风机的效率高达85%，能够实现较高的能量转换效率，节能环保。
7.噪音：RH系列离心风机的噪音水平低，采用隔音设计和优化的进口扇叶，可以减少噪音污染和影响。
8.构造材料：RH系列离心风机的外壳采用镀锌板材或不锈钢材料，具有耐腐蚀和耐磨损的特性。
9.规格尺寸：RH系列离心风机的规格尺寸多样，有多种安装方式可选，包括水平安装和垂直安装等。
10.控制方式：RH系列离心风机可以采用变频控制，通过调整电机转速和风机叶片角度，实现精确的风量和静压控制。
11.防护等级：RH系列离心风机的防护等级为IP55，具有良好的防尘和防水性能，适用于恶劣的工作环境。
12.应用领域：RH系列离心风机广泛应用于空调、通风、工业制冷和
工业除尘等领域，可以提供稳定、可靠的气流。
总之，施乐百风机RH系列离心风机具有多种型号和规格可选，可以
满足不同行业和应用场合的需求。
其技术参数包括风量范围、静压范围、
转速范围、电机功率、效率、噪音水平、构造材料、规格尺寸、控制方式、防护等级等，能够提供高效、可靠的风力供应。
美瑞克仪器直流电阻测试仪RK2511AL BL系列使用说明书
美瑞克仪器MEIRUIKE INSTRUMENTManua l使用说明书深圳市美瑞克电子科技有限公司版本历史：由于说明书中可能存在错误或遗漏、改进和完善仪器功能、更新技术及升级软件，本说明书将做相应的调整和修订、不断完善以利于使用。
请关注所使用的软件版本及说明书版本。
2020年12月 VER1.02021年07月 VER2.0(地址更新)2021年09月 VER3.0(售后电话变更)2021年12月 VER4.0(修改单位符号K大小写、更正语句错误、添加附件型号)声明：本公司可能对该产品的性能、功能、软件、结构、外观、附件、包装以及说明书等进行完善和提高，如有修改，恕不另行通知！如造成疑惑，请与本公司联系。
目录一、产品概述2二、产品规格...........................................................................................................22.1RK 2511AL 系列简介：.................................................................................22.2测试范围.......................................................................................................22.3测试量程...................................................................................................22.4显示范围...................................................................................................2.5测试速度...................................................................................................2.6触发方式...................................................................................................三、参数规格及相应说明.......................................................................................3.1具体参数...................................................................................................3.2一般技术指标...............................................................................................3.3测试端、基准端说明...................................................................................四、面板、后板介绍...............................................................................................4.1前面板功能介绍...........................................................................................4.2后面板功能介绍............................................................................................五、操作说明.......................................................................................................5.1上电启动...................................................................................................5.2开始测试.....................................................................................................5.3选择测试速度.............................................................................................5.4选择测试量程.............................................................................................5.5清零标准.....................................................................................................5.6功能菜单.....................................................................................................5.7后面板HANDLER 接口介绍（选配）........................................................5.8串行RS-232标准接口（选配）..............................................................六、串口通讯指令（仅适用于RK2511ALR ）七、常见故障及维护.............................................................................................7.1常见故障排除..............................................................................................7.2更换保险说明.................................................................................................7.3产品保修说明............................................................................................................................................................................................................334566788888991113152020207.4装箱清单. (21)203336.1指令格式简要说明..............................................................................................6.2基本指令..............................................................................................附录：选型表.............................................................................................151591........................................................一、产品概述RK2511AL/BL 系列是一款经济实用的直流电阻测试仪，具有更广的测试范围：0.01m Ω～200.0KΩ,最大显示数5000数。
MX25L1005中文资料
MX25L10051M-BIT [x 1] CMOS SERIAL FLASH FEATURESGENERAL• Serial Peripheral Interface (SPI) compatible -- Mode 0 and Mode 3• 1,048,576 x 1 bit structure• 32 Equal Sectors with 4K byte each- Any Sector can be erased individually•2 Equal Blocks with 64K byte each- Any Block can be erased individually• Single Power Supply Operation- 2.7 to 3.6 volt for read, erase, and program operations• Latch-up protected to 100mA from -1V to Vcc +1V• Low Vcc write inhibit is from 1.5V to 2.5VPERFORMANCE• High Performance- Fast access time: 85MHz serial clock (15pF + 1TTL Load) and 66MHz serial clock (30pF + 1TTL Load)- Fast program time: 1.4ms(typ.) and 5ms(max.)/page (256-byte per page)- Fast erase time: 60ms(typ.) and 120ms(max.)/sector (4K-byte per sector) ; 1s(typ.) and 2s(max.)/block (64K-byte per block)• Low Power Consumption- Low active read current: 12mA(max.) at 85MHz, 8mA(max.) at 66MHz and 4mA(max.) at 33MHz- Low active programming current: 15mA (max.)- Low active erase current: 15mA (max.)- Low standby current: 10uA (max.)- Deep power-down mode 1uA (typical)• Minimum 100,000 erase/program cyclesSOFTWARE FEATURES• Input Data Format- 1-byte Command code•Block Lock protection- The BP0~BP1 status bit defines the size of the area to be software protected against Program and Erase instructions.• Auto Erase and Auto Program Algorithm- Automatically erases and verifies data at selected sector- Automatically programs and verifies data at selected page by an internal algorithm that automatically times the program pulse widths (Any page to be programed should have page in the erased state first)•Status Register Feature•Electronic Identification- JEDEC 2-byte Device ID- RES command, 1-byte Device IDHARDWARE FEATURES• SCLK Input- Serial clock input• SI Input- Serial Data Input• SO Output- Serial Data Output• WP# pin- Hardware write protection• HOLD# pin- pause the chip without diselecting the chip• PACKAGE- 8-pin SOP (150mil)- 8-land USON (2x3x0.6mm)*- All Pb-free devices are RoHS CompliantGENERAL DESCRIPTIONMX25L1005 is a CMOS 1,048,576 bit serial Flash memory, which is configured as 131,072 x 8 internally.The MX25L1005 feature a serial peripheral interface and software protocol allowing operation on a simple 3-wire bus. The three bus signals are a clock input (SCLK), a serial data input (SI), and a serial data output (SO). SPI access to the device is enabled by CS# input.The MX25L1005 provide sequential read operation on whole chip.After program/erase command is issued, auto program/ erase algorithms which program/ erase and verify the specified page or sector/block locations will be executed. Program command is executed on page (256 bytes) basis, and erase command is executes on chip or sector(4K-bytes) or block(64K-bytes).To provide user with ease of interface, a status register is included to indicate the status of the chip. The status read command can be issued to detect completion status of a program or erase operation via WIP bit.When the device is not in operation and CS# is high, it is put in standby mode and draws less than 10uA DC current.The MX25L1005 utilize MXIC's proprietary memory cell, which reliably stores memory contents even after 100,000 program and erase cycles.* Advanced InformationPIN CONFIGURATIONSSYMBOL DESCRIPTION CS#Chip SelectSI Serial Data Input SO Serial Data Output SCLK Clock InputHOLD#Hold, to pause the device without deselecting the device VCC + 3.3V Power Supply GNDGroundPIN DESCRIPTION8-PIN SOP (150mil)CS#SO WP#GNDVCC HOLD#SCLK SI8-LAND USON (2x3mm)CS#SO WP#GNDVCC HOLD#SCLK SIBLOCK DIAGRAMDATA PROTECTIONThe MX25L1005 is designed to offer protection against accidental erasure or programming caused by spurious system level signals that may exist during power transition. During power up the device automatically resets the state machine in the Read mode. In addition, with its control register architecture, alteration of the memory contents only occurs after successful completion of specific command sequences. The device also incorporates several features to prevent inadvertent write cycles resulting from VCC power-up and power-down transition or system noise.•Power-on reset and tPUW: to avoid sudden power switch by system power supply transition, the power-on reset and tPUW (internal timer) may protect the Flash.• Valid command length checking: The command length will be checked whether it is at byte base and completed on byte boundary.• Write Enable (WREN) command: WREN command is required to set the Write Enable Latch bit (WEL) before other command to change data. The WEL bit will return to reset stage under following situation:- Power-up- Write Disable (WRDI) command completion- Write Status Register (WRSR) command completion- Page Program (PP) command completion- Sector Erase (SE) command completion- Block Erase (BE) command completion- Chip Erase (CE) command completion•Software Protection Mode (SPM): by using BP0-BP1 bits to set the part of Flash protected from data change.•Hardware Protection Mode (HPM): by using WP# going low to protect the BP0-BP1 bits and SRWD bit from data change.•Deep Power Down Mode: By entering deep power down mode, the flash device also is under protected from writing all commands except Release from deep power down mode command (RDP) and Read Electronic Signature command (RES).Table 1. Protected Area SizesStatus bit Protect level1MbBP1BP0000 (none)None01 1 (1 block)Block 110 2 (2 blocks)All11 3 (All)AllHOLD FEATUREHOLD# pin signal goes low to hold any serial communications with the device. The HOLD feature will not stop the operation of write status register, programming, or erasing in progress.The operation of HOLD requires Chip Select(CS#) keeping low and starts on falling edge of HOLD# pin signal while Serial Clock (SCLK) signal is being low (if Serial Clock signal is not being low, HOLD operation will not start until Serial Clock signal being low). The HOLD condition ends on the rising edge of HOLD# pin signal while Serial Clock(SCLK) signal is being low( if Serial Clock signal is not being low, HOLD operation will not end until Serial Clock being low), see Figure 1. Figure 1. Hold Condition OperationThe Serial Data Output (SO) is high impedance, both Serial Data Input (SI) and Serial Clock (SCLK) are don't care during the HOLD operation. If Chip Select (CS#) drives high during HOLD operation, it will reset the internal logic of the device. To re-start communication with chip, the HOLD# must be at high and CS# must be at low.Table 2. COMMAND DEFINITIONCOMMAND WREN WRDI RDID RDSR WRSR READ Fast Read (byte)(write(write(read ident-(read status(write status(read data)(fast read Enable)disable)ification)register)register)data)1st06 Hex04 Hex9F Hex05 Hex01 Hex03 Hex0B Hex2nd AD1AD13rd AD2AD24th AD3AD35th xAction sets the reset the output the to read out to write new n bytes(WEL)(WEL)manufacturer the status values to the read outwrite write ID and 2-byte register status register untilenable enable device ID CS# goeslatch bit latch bit highCOMMAND SE BE CE PP DP RDP RES REMS (Read (byte)(Sector(Block(Chip(Page(Deep(Release(Read Electronic Erase)Erase)Erase)Program)Power from Deep Electronic ManufacturerDown)Power-down)ID)& Device ID) 1st20 Hex D8 Hex60 or 02 Hex B9 Hex AB Hex AB Hex90 HexC7 Hex2nd AD1AD1AD1x x3rd AD2AD2AD2x x4th AD3AD3AD3x ADD(1)5thAction Output themanufacturerID and deviceID(1) ADD=00H will output the manufacturer's ID first and ADD=01H will output device ID first.(2) It is not allowed to adopt any other code which is not in the above command definition table.Table 3. Memory OrganizationDEVICE OPERATION1.Before a command is issued, status register should be checked to ensure device is ready for the intended operation.2.When incorrect command is inputted to this LSI, this LSI becomes standby mode and keeps the standby mode until next CS# falling edge. In standby mode, SO pin of this LSI should be High-Z.3.When correct command is inputted to this LSI, this LSI becomes active mode and keeps the active mode until next CS# rising edge.4.Input data is latched on the rising edge of Serial Clock(SCLK) and data shifts out on the falling edge of SCLK. The difference of SPI mode 0 and mode 3 is shown as Figure 2.Figure 2. SPI Modes Supported5.For the following instructions: RDID, RDSR, READ, FAST_READ, RES and REMS the shifted-in instruction sequence is followed by a data-out sequence. After any bit of data being shifted out, the CS# can be high. For the following instructions: WREN, WRDI, WRSR, SE, BE, CE, PP, RDP and DP the CS# must go high exactly at the byte boundary;otherwise, the instruction will be rejected and not executed.6.During the progress of Write Status Register, Program, Erase operation, to access the memory array is neglected and not affect the current operation of Write Status Register, Program, Erase.Note:CPOL indicates clock polarity of SPI master, CPOL=1 for SCLK high while idle, CPOL=0 for SCLK low while not transmitting. CPHA indicates clock phase. The combination of CPOL bit and CPHA bit decides which SPI mode is supported.SCLKMSBCPHAshift in shift outSI 01CPOL 0(SPI mode 0)(SPI mode 3)1SO SCLKMSBCOMMAND DESCRIPTION(1) Write Enable (WREN)The Write Enable (WREN) instruction is for setting Write Enable Latch (WEL) bit. For those instructions like PP, SE, BE, CE, and WRSR, which are intended to change the device content, should be set every time after the WREN instruction setting the WEL bit.The sequence of issuing WREN instruction is: CS# goes low-> sending WREN instruction code-> CS# goes high. (see Figure 11)(2) Write Disable (WRDI)The Write Disable (WRDI) instruction is for resetting Write Enable Latch (WEL) bit.The sequence of issuing WRDI instruction is: CS# goes low-> sending WRDI instruction code-> CS# goes high. (see Figure 12)The WEL bit is reset by following situations:- Power-up- Write Disable (WRDI) instruction completion- Write Status Register (WRSR) instruction completion- Page Program (PP) instruction completion- Sector Erase (SE) instruction completion- Block Erase (BE) instruction completion- Chip Erase (CE) instruction completion(3) Read Identification (RDID)The RDID instruction is for reading the manufacturer ID of 1-byte and followed by Device ID of 2-byte. The MXIC Manufacturer ID is C2(hex), the memory type ID is 20(hex) as the first-byte device ID, and the individual device ID of second-byte ID is as followings: 11(hex) for MX25L1005.The sequence of issuing RDID instruction is: CS# goes low-> sending RDID instruction code -> 24-bits ID data out on SO -> to end RDID operation can use CS# to high at any time during data out. (see Figure. 13)While Program/Erase operation is in progress, it will not decode the RDID instruction, so there's no effect on the cycle of program/erase operation which is currently in progress. When CS# goes high, the device is at standby stage.(4) Read Status Register (RDSR)The RDSR instruction is for reading Status Register Bits. The Read Status Register can be read at any time (even in program/erase/write status register condition) and continuously. It is recommended to check the Write in Progress (WIP) bit before sending a new instruction when a program, erase, or write status register operation is in progress.The sequence of issuing RDSR instruction is: CS# goes low-> sending RDSR instruction code-> Status Register data out on SO (see Figure. 14)The definition of the status register bits is as below:WIP bit. The Write in Progress (WIP) bit, a volatile bit, indicates whether the device is busy in program/erase/write status register progress. When WIP bit sets to 1, which means the device is busy in program/erase/write status register progress. When WIP bit sets to 0, which means the device is not in progress of program/erase/write status register cycle.WEL bit. The Write Enable Latch (WEL) bit, a volatile bit, indicates whether the device is set to internal write enable latch. When WEL bit sets to 1, which means the internal write enable latch is set, the device can accept program/erase/write status register instruction. When WEL bit sets to 0, which means no internal write enable latch; the device will not accept program/erase/write status register instruction.BP1, BP0 bits. The Block Protect (BP1, BP0) bits, non-volatile bits, indicate the protected area(as defined in table 1) of the device to against the program/erase instruction without hardware protection mode being set. To write the Block Protect (BP1, BP0) bits requires the Write Status Register (WRSR) instruction to be executed. Those bits define the protected area of the memory to against Page Program (PP), Sector Erase (SE), Block Erase (BE) and Chip Erase(CE) instructions (only if all Block Protect bits set to 0, the CE instruction can be executed)SRWD bit. The Status Register Write Disable (SRWD) bit, non-volatile bit, is operated together with Write Protection (WP#) pin for providing hardware protection mode. The hardware protection mode requires SRWD sets to 1 and WP# pin signal is low stage. In the hardware protection mode, the Write Status Register (WRSR) instruction is no longer accepted for execution and the SRWD bit and Block Protect bits (BP1, BP0) are read only.bit 7bit 6bit 5bit 4bit 3bit 2bit 1bit 0SRWD BP1BP0WEL WIPStatus000the level of the level of(write enable(write in progress Register Write protected protected latch)bit) Protect block block1= status(note 1)(note 1)1=write enable1=write operation register write0=not write0=not in write disable enable operationNote:1. See the table "Protected Area Sizes".2. The endurance cycles of protect bits are 100,000 cycles; however, the tW time out spec of protect bits is relaxedas tW = N x 15ms (N is a multiple of 10,000 cycles, ex. N = 2 for 20,000 cycles) after 10,000 cycles on those bits.(5) Write Status Register (WRSR)The WRSR instruction is for changing the values of Status Register Bits. Before sending WRSR instruction, the Write Enable (WREN) instruction must be decoded and executed to set the Write Enable Latch (WEL) bit in advance. The WRSR instruction can change the value of Block Protect (BP1, BP0) bits to define the protected area of memory (as shown in table 1). The WRSR also can set or reset the Status Register Write Disable (SRWD) bit in accordance with Write Protection (WP#) pin signal. The WRSR instruction cannot be executed once the Hardware Protected Mode (HPM) is entered.The sequence of issuing WRSR instruction is: CS# goes low-> sending WRSR instruction code-> Status Register data on SI-> CS# goes high. (see Figure 15)The WRSR instruction has no effect on b6, b5, b4, b1, b0 of the status register.The CS# must go high exactly at the byte boundary; otherwise, the instruction will be rejected and not executed. The self-timed Write Status Register cycle time (tW) is initiated as soon as Chip Select (CS#) goes high. The Write in Progress (WIP) bit still can be check out during the Write Status Register cycle is in progress. The WIP sets 1 during the tW timing,and sets 0 when Write Status Register Cycle is completed, and the Write Enable Latch (WEL) bit is reset.Table 4. Protection ModesNote:1. As defined by the values in the Block Protect (BP1, BP0) bits of the Status Register, as shown in Table 1.As the above table showing, the summary of the Software Protected Mode (SPM) and Hardware Protected Mode (HPM).Software Protected Mode (SPM):-When SRWD bit=0, no matter WP# is low or high, the WREN instruction may set the WEL bit and can change the valuesof SRWD, BP1, BP0. The protected area, which is defined by BP1, BP0, is at software protected mode (SPM).-When SRWD bit=1 and WP# is high, the WREN instruction may set the WEL bit can change the values of SRWD, BP1,BP0. The protected area, which is defined by BP1, BP0, is at software protected mode (SPM)Note: If SRWD bit=1 but WP# is low, it is impossible to write the Status Register even if the WEL bit has previously beenModeStatus register condition Software protection mode(SPM)Status register can be written in (WEL bit is set to "1") and the SRWD, BP0-BP1bits can be changedWP# and SRWD bit status MemoryWP#=1 and SRWD bit=0, or WP#=0 and SRWD bit=0, or WP#=1 and SRWD=1The protected area cannot be programmed or erased.The protected area cannot be programmed or erased.WP#=0, SRWD bit=1The SRWD, BP0-BP1 ofstatus register bits cannot be changedHardware protection mode (HPM)set. It is rejected to write the Status Register and not be executed.Hardware Protected Mode (HPM):-When SRWD bit=1, and then WP# is low (or WP# is low before SRWD bit=1), it enters the hardware protected mode (HPM). The data of the protected area is protected by software protected mode by BP1, BP0 and hardware protected mode by the WP# to against data modification.Note: to exit the hardware protected mode requires WP# driving high once the hardware protected mode is entered. If the WP# pin is permanently connected to high, the hardware protected mode can never be entered; only can use software protected mode via BP1, BP0.(6) Read Data Bytes (READ)The read instruction is for reading data out. The address is latched on rising edge of SCLK, and data shifts out on the falling edge of SCLK at a maximum frequency fR. The first address byte can be at any location. The address is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can be read out at a single READ instruction. The address counter rolls over to 0 when the highest address has been reached.The sequence of issuing READ instruction is: CS# goes low-> sending READ instruction code-> 3-byte address on SI -> data out on SO-> to end READ operation can use CS# to high at any time during data out. (see Figure. 16)(7) Read Data Bytes at Higher Speed (FAST_READ)The FAST_READ instruction is for quickly reading data out. The address is latched on rising edge of SCLK, and data of each bit shifts out on the falling edge of SCLK at a maximum frequency fC. The first address byte can be at any location. The address is automatically increased to the next higher address after each byte data is shifted out, so the whole memory can be read out at a single FAST_READ instruction. The address counter rolls over to 0 when the highest address has been reached.The sequence of issuing FAST_READ instruction is: CS# goes low-> sending FAST_READ instruction code-> 3-byte address on SI-> 1-dummy byte address on SI->data out on SO-> to end FAST_READ operation can use CS# to high at any time during data out. (see Figure. 17)While Program/Erase/Write Status Register cycle is in progress, FAST_READ instruction is rejected without any impact on the Program/Erase/Write Status Register current cycle.(8) Sector Erase (SE)The Sector Erase (SE) instruction is for erasing the data of the chosen sector to be "1". A Write Enable (WREN) instruction must execute to set the Write Enable Latch (WEL) bit before sending the Sector Erase (SE). Any address of the sector (see table 3) is a valid address for Sector Erase (SE) instruction. The CS# must go high exactly at the byte boundary (the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not executed.Address bits [Am-A12] (Am is the most significant address) select the sector address.The sequence of issuing SE instruction is: CS# goes low -> sending SE instruction code-> 3-byte address on SI -> CS# goes high. (see Figure 19)The self-timed Sector Erase Cycle time (tSE) is initiated as soon as Chip Select (CS#) goes high. The Write in Progress (WIP) bit still can be check out during the Sector Erase cycle is in progress. The WIP sets 1 during the tSE timing, and sets 0 when Sector Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the page is protected by BP1, BP0 bits, the Sector Erase (SE) instruction will not be executed on the page.(9) Block Erase (BE)The Block Erase (BE) instruction is for erasing the data of the chosen block to be "1". A Write Enable (WREN) instruction must execute to set the Write Enable Latch (WEL) bit before sending the Block Erase (BE). Any address of the block (see table 3) is a valid address for Block Erase (BE) instruction. The CS# must go high exactly at the byte boundary (the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not executed.The sequence of issuing BE instruction is: CS# goes low -> sending BE instruction code-> 3-byte address on SI -> CS# goes high. (see Figure 20)The self-timed Block Erase Cycle time (tBE) is initiated as soon as Chip Select (CS#) goes high. The Write in Progress (WIP) bit still can be check out during the Sector Erase cycle is in progress. The WIP sets 1 during the tBE timing, and sets 0 when Sector Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the page is protected by BP1, BP0 bits, the Block Erase (BE) instruction will not be executed on the page.(10) Chip Erase (CE)The Chip Erase (CE) instruction is for erasing the data of the whole chip to be "1". A Write Enable (WREN) instruction must execute to set the Write Enable Latch (WEL) bit before sending the Chip Erase (CE). Any address of the sector (see table 3) is a valid address for Chip Erase (CE) instruction. The CS# must go high exactly at the byte boundary( the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not executed.The sequence of issuing CE instruction is: CS# goes low-> sending CE instruction code-> CS# goes high. (see Figure 20)The self-timed Chip Erase Cycle time (tCE) is initiated as soon as Chip Select (CS#) goes high. The Write in Progress (WIP) bit still can be check out during the Chip Erase cycle is in progress. The WIP sets 1 during the tCE timing, and sets 0 when Chip Erase Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the chip is protected by BP1, BP0 bits, the Chip Erase (CE) instruction will not be executed. It will be only executed when BP1, BP0 all set to "0".(11) Page Program (PP)The Page Program (PP) instruction is for programming the memory to be "0". A Write Enable (WREN) instruction must execute to set the Write Enable Latch (WEL) bit before sending the Page Program (PP). If the eight least significant address bits (A7-A0) are not all 0, all transmitted data which goes beyond the end of the current page are programmed from the start address if the same page (from the address whose 8 least significant address bits (A7-A0) are all 0). The CS# must keep during the whole Page Program cycle. The CS# must go high exactly at the byte boundary( the latest eighth of address byte been latched-in); otherwise, the instruction will be rejected and not executed. If more than 256 bytes are sent to the device, the data of the last 256-byte is programmed at the request page and previous data will be disregarded. If less than 256 bytes are sent to the device, the data is programmed at the request address of the page without effect on other address of the same page.The sequence of issuing PP instruction is: CS# goes low-> sending PP instruction code-> 3-byte address on SI-> at least 1-byte on data on SI-> CS# goes high. (see Figure 18)The self-timed Page Program Cycle time (tPP) is initiated as soon as Chip Select (CS#) goes high. The Write in Progress(WIP) bit still can be check out during the Page Program cycle is in progress. The WIP sets 1 during the tPP timing, and sets 0 when Page Program Cycle is completed, and the Write Enable Latch (WEL) bit is reset. If the page is protected by BP1, BP0 bits, the Page Program (PP) instruction will not be executed.(12) Deep Power-down (DP)The Deep Power-down (DP) instruction is for setting the device on the minimizing the power consumption (to entering the Deep Power-down mode), the standby current is reduced from ISB1 to ISB2). The Deep Power-down mode requires the Deep Power-down (DP) instruction to enter, during the Deep Power-down mode, the device is not active and all Write/ Program/Erase instruction are ignored. When CS# goes high, it's only in standby mode not deep power-down mode. It's different from Standby mode.The sequence of issuing DP instruction is: CS# goes low-> sending DP instruction code-> CS# goes high. (see Figure 22) Once the DP instruction is set, all instruction will be ignored except the Release from Deep Power-down mode (RDP) and Read Electronic Signature (RES) instruction. (RES instruction to allow the ID been read out). When Power-down, the deep power-down mode automatically stops, and when power-up, the device automatically is in standby mode. For RDP instruction the CS# must go high exactly at the byte boundary (the latest eighth bit of instruction code been latched-in); otherwise, the instruction will not executed. As soon as Chip Select (CS#) goes high, a delay of tDP is required before entering the Deep Power-down mode and reducing the current to ISB2.(13) Release from Deep Power-down (RDP), Read Electronic Signature (RES)The Release from Deep Power-down (RDP) instruction is terminated by driving Chip Select (CS#) High. When Chip Select (CS#) is driven High, the device is put in the Stand-by Power mode. If the device was not previously in the Deep Power-down mode, the transition to the Stand-by Power mode is immediate. If the device was previously in the Deep Power-down mode, though, the transition to the Stand-by Power mode is delayed by tRES2, and Chip Select (CS#) must remain High for at least tRES2(max), as specified in Table 6. Once in the Stand-by Power mode, the device waits to be selected, so that it can receive, decode and execute instructions.RES instruction is for reading out the old style of 8-bit Electronic Signature, whose values are shown as table of ID Definitions. This is not the same as RDID instruction. It is not recommended to use for new design. For new deisng, please use RDID instruction. Even in Deep power-down mode, the RDP and RES are also allowed to be executed, only except the device is in progress of program/erase/write cycle; there's no effect on the current program/erase/write cycle in progress.The sequence is shown as Figure 23,24.The RES instruction is ended by CS# goes high after the ID been read out at least once. The ID outputs repeatedly if continuously send the additional clock cycles on SCLK while CS# is at low. If the device was not previously in Deep Power-down mode, the device transition to standby mode is immediate. If the device was previously in Deep Power-down mode, there's a delay of tRES2 to transit to standby mode, and CS# must remain to high at least tRES2(max). Once in the standby mode, the device waits to be selected, so it can be receive, decode, and execute instruction.The RDP instruction is for releasing from Deep Power Down Mode.(14) Read Electronic Manufacturer ID & Device ID (REMS)The REMS instruction is an alternative to the Release from Power-down/Device ID instruction that provides both the JEDEC assigned manufacturer ID and the specific device ID.The REMS instruction is very similar to the Release from Power-down/Device ID instruction. The instruction is initiated by driving the CS# pin low and shift the instruction code "90h" followed by two dummy bytes and one bytes address (A7~A0). After which, the Manufacturer ID for MXIC (C2h) and the Device ID are shifted out on the falling edge of SCLK with most significant bit (MSB) first as shown in figure 25. The Device ID values are listed in Table of ID Definitions on page 16. If the one-byte address is initially set to 01h, then the device ID will be read first and then followed by the Manufacturer ID. The Manufacturer and Device IDs can be read continuously, alternating from one to the other. The instruction is completed by driving CS# high.Table of ID Definitions:RDID Command manufacturer ID memory type memory densityC22011RES Command electronic ID10REMS Command manufacturer ID device IDC210。
Henkel型号选择表说明书
Dispensing EquipmentSelection TableHenkel can provide you with a large choice of needles and accessories to optimise your application:Henkel offers the appropriate mixing nozzle for each product &equipment:This is a selection from our extensive range of equipment.If you need more information,please contact us for a copy of our Equipment Sourcebook.ManualSemi-AutomaticAutomatic Manual Semi-AutomaticAutomaticManualSemi-AutomaticAutomatic98666*97006n.a.97006 (only Gel-CA 454)9841498548 (non thixotropic)985489700197009T:97106n.a.n.a.9854897009T:9710697002n.a.T:97631*n.a.T:97631*9700297002n.a.n.a.n.a.n.a.n.a.97560*97004*9700997003*97009971239712397131*9712198009*97131*971219801397112*97130971149713097134*10ml &30ml 50ml250ml 500g300ml 250ml 20kgEquipmentSyringe Bottle Cartridge Plastic tube PailsIntegrated Tank Controller Controller (requires Tank T)ValvesPlease contact your local Technical SupportPlease contact your local Technical SupportAssemblyInstant BondingFlexible Bonding &SealingLoctite ®Anaerobic Adhesives/Sealants Loctite ®Cyanoacrylate Adhesives/Sealants Loctite ®Silicone/Polyurethane/MS Sealant Light CuringLoctite ® UV AdhesivesManual Semi-AutomaticAutomatic9859197055Please contact your local Technical SupportHandheld ManualHandheld Pneumatic Semi-AutomaticAutomaticMixing Nozzle 9600197042*984569*96003983437984570*983438*983439984570*Twin cartridgePails50ml200ml 400ml1kg & 20kgStructural BondingLoctite ®Epoxy/Acrylic/MethacrylatePlease contact yourlocal Technical SupportLoctite ®products are used for a wide variety of bonding,threadlocking,retaining,gasketing and sealing applications.For users requiring precise and automated dispensing,Henkel has developed equipment especially designed for economical,fast,precise and clean application of adhesives and chemical sealants as beads,drops or continuous rings.Henkel provides a complete line ofdispensing equipment,ranging from simple hand-held dispensers to fully automated systems.Ultraviolet curing system to suit application needs are also available.Loctite ®One Component Adhesives/Sealants:Loctite ®Two Component Adhesives:low flow high flow98026*/**Which Loctite ®product are you using?Loctite ®One Component Adhesives/SealantsPeristaltic Hand Pump • Mounts easily on any Loctite ®50ml (98414)and 250ml (97001) bottle,converting the bottle into a portable dispenser • Controlled amount of adhesive• 98414 comes with a stand to stabilise 50ml bottle97001/98414 300ml Cartridge Pneumatic Dispenser • Dispenses all Loctite ®products packaged in a 250ml tube or in a 300ml cartridge• Integrated pressure regulator allowing user to control the flow rate • Quick pressure relief valveVolumetric Dispenser • For low viscosity,non-thixotropic adhesives • For precise dosing and controlled flow rate • Usable as manual or semi-automatic workstation • No air source required98548Precision Syringe Dispenser – Digital • Accurate dispensing of viscosities from water-thin to paste-like• For products packaged in 10,30,55,and 300ml syringes• Delivers precise dots in a timed mode,or beads or potting,in a continuous mode97006Integrated Semi-Automatic Dispensing System • Combines both acontroller and reservoir into a single unit • Provides digital timing control• Can be actuated either by a footswitch or fingerswitch • Provides empty and end-of-cycle signal9700997002 971239710697114Automatic 97006970099712197130Semi-Automatic 97001/9841497002Manual AssemblyLoctite ®Anaerobic Adhesives/SealantsPinch Valve Applicator • Provides excellent compatibility with all Loctite ®productsincluding cyanoacrylates • Dispenses small drop sizes of low to medium viscosity products • Can be either mounted to the reservoir or to the point of application97121ErgoLOC Valve • Ergonomic design provides comfortable hand application control • Eliminates hand fatigue • Suitable for small drop sizes up to beads of low to medium viscosityproducts including Instant Adhesives97130Reservoir 0,5l /Single Channel-Automatic Controller• Fully programmable independent controller (97123) with PLC interface • Precision pressure regulator for reliable dispensing • Integrated solenoids for cost and space effectiveness• Level sensor in the tank (97106) with levelindication at the controller97106/97123Stationary Applicator Valve• Easy exchange of actuator and shut-off valve modules • Contains adjustable suck-back • Eliminates product stringing• Used for stationary and advancing application97114Cyanoacrylate Dispense Valve • Diaphragm valve with high resolution stroke adjustment • No-drip dispensing • For low to medium viscosity cyanoacrylate adhesives98013971239710698013Automatic 970099712197130Semi-Automatic98548Manual Instant BondingLoctite ®Cyanoacrylate Adhesives/SealantsPlease contact your local Technical SupportSemi-Automatic97002Manual Flexible Bonding and SealingLoctite ®Silicone/Polyurethane/MS SealantUVALOC 1000• For UVA,UVC and visible light curing• Closed system with safety door locking andprogrammable shutter system97055Loctite ®7700 Hand Held LED Light Source • For many UV/visible light cure products• Instant on/off performance and consistent light output • Heating of assemblies virtually eliminated9859150ml Dual Cartridge Manual Applicator • Hand-held,manually operated mix dispenser,provides a convenient,cost-effective method of applying product with minimal waste • Compatible with 1:1,2:1and 10:1 ratio products • Made of impact resistant plastic96001200ml Dual Cartridge Manual Applicator • Hand-held,manually operated dispenser • Provides a convenient,cost-effective method of applying product with minimal waste • Fits 1:1 and 2:1 mix ratio products• Mix nozzles are sold separately • Made of die-cast aluminium96003Dual CartridgePneumatic Applicator • Hand-held,pneumatically operated meter mix applicator• It provides a convenient,cost-effective method to apply product with minimal waste • The dispensers are compatible with 1:1 and 2:1 mix ratio products • 983437 fits 200ml dual cartridges• 983439 fits 400ml dual cartridges983437/983439Light Curing Light CuringLoctite ® UV AdhesivesPlease contact your local Technical SupportSemi-Automatic/Automatic 983437/983439Handheld Pneumatic 9600196003Handheld ManualStructural BondingLoctite ®Epoxy/Acrylic/MethacrylateLoctite ®Two Component Adhesives9705598591® designates a trademark of Henkel KGaA or its affiliates,registered in Germany and elsewhere © Henkel KGaA,2007The data contained herein are intended as reference only.Please contact your local Henkel Technical Support Group for assistance and recommendation on specifications for these products.Henkel Loctite Adhesives Ltd Technologies House Wood Lane End Hemel Hempstead Hertfordshire HP2 4RQ Tel.01442 278100Fax 01442 Product Overview9600126745250ml Dual Cartridge Manual Applicator 1:1,2:196003267453200ml Dual Cartridge Manual Applicator 1:1,2:19700188631250ml Peristaltic Hand Pump 9700288632300ml Cartridge Pneumatic Dispenser 97003135546Integrated Manual System 1bar,0–15psi *97004135547Integrated Manual System 7bar,0–100psi *9700688633Precision Syringe Dispenser97009215845Integrated Semi-Automatic Dispensing System 97055805741UVALOC 1000,Chamber Version 97042476898Pneu.Handgun 50ml 1:1,2:1,10:1*971061355540.5l Reservoir with Dual Level Sensor 9711288643Hand-Held Applicator (Foot Switch activated)*9711488645Stationary Applicator Valve 3/8"9712188650Pinch Valve Applicator97123215993Single Channel-Automatic Controller 97130444643ErgoLOC Valve97131194420Vari-Drop Appl.with 1/4" Feedline *97134194427CA Dispense Valve,High Flow *9756064771720l Extrusion Pail Pump *97631854181300ml Cartridge Pusher *98009218280Light Cure Dispense Valve *98013318654Cyanoacrylate Dispense Valve 98026476902Manual Handgun 30ml Syringes *9841460896650ml Peristaltic Hand Pump 98548769914Benchtop Peristaltic Dispenser98591806035Loctite ®7700 Hand Held LED Light Source 98666883976Digital Syringe Dispenser*983437218315200ml Dual Cartridge Pneumatic Applicator 1:1,2:1983438218312400ml Dual Cartridge Manual Applicator 1:1,2:1*983439218311400ml Dual Cartridge Pneumatic Applicator 1:1,2:1984569478562Square Mix Nozzle Kit for 50ml,10Pcs.*984570478563Square Mix Nozzle Kit for 200/400ml,10Pcs.*Product No.Order No.Product Description* This product is not represented in this brochure,for further details please contact your local technical support.。
佳能GY-HM100U HD记忆卡摄像机记录器中文说明书
HD Memory Card Camera RecorderGY-HM100U Unprecedented MobilityIs it possible?Reliable &Cost-EfficientStorageSuper Portability High Bit Rate EncodingNative NLE File Format RecordingNative File RecordingRecord footage directly in ready-to-editQuickTime ™ MOV files, the native file format of Apple’s Final Cut Pro ™—simply drag the files into the timeline and start editing. Alternatively, you can record MP4 files that are compatible with all major editing systems.Reliable, Low-Cost MediaThe GY-HM100U uses standard, inexpensive and widely available SDHC Class 6 memory cards. These cards are small, light, robust and reliable, and can be read by your computer using any standard card reader.WorkflowUntil now, the camcorder has often beenthe main obstacle to achieving a smoother, more streamlined production workflow. Getting footage into a file format that your editing system could understand was a time consuming and laborious process. With Native File Recording, your footage is ready to edit the moment it's shot.JVC Makes it PossibleShootingTransferUSB2.0SDHCMOV or MP4MOV or MP4MP4MOV QuickTimeExceptional QualityEncoding video at higher bit-rates means just one thing: a higher quality picture. The 35 Mbps data rate used by the GY-HM100U is significantlyhigher than most other handheld camcorders and results in beautifully rich,broadcast-standard HD images.35MbpsStorageBlu-rayFile ServerNetworkEditingFinal Cut Pro ™Avid Adobe CanopusTrue PortabilityThe GY-HM100U is truly an engineering marvel. Weighing only 3.1 lbs. (1.4 kg), this super-compact camcorder can be held comfortably with one hand. Go-anywhere portability makes this the ideal choice for location shooting in even the most difficult of environments.Focus AssistWhen shooting to HD, accurate focusing iscritical. JVC developed Focus Assist to makeaccurate HD focusing quick and easy. WhenFocus Assist is switched on, the image in theviewfinder or LCD monitor becomesmonochrome and all objects that are in focusappear with colored edges.Twin SDHC Card SlotsThe GY-HM100U gives users the flexibility of twin SDHC memory card slots. When the card in thefirst slot is full, the camcorder switches automatically to the second with no drop out. Memorycards are hot swappable, so cards can be removed for editing without interrupting the shoot.2.8-inch LCD MonitorThe 2.8-inch 16:9 aspect ratio LCD monitorprovides not only an alternative to theviewfinder when shooting, it also displays awide array of monitoring and setup indications.3CCDManual Versatility, Automatic FlexibilityShooter-Friendly Controlsmajor role in the design of theGY-HM100U. The camera’s2.8-inchGUIThe new GUI, visible in both the LCD monitor and as an overlay in the viewfinder, features several improvements that make the GY-HM100U a pleasure to use. The high-resolution picturethumbnail display makes it a simple task to select clips visually for review, and more detailed file and shooting information for each clip is now available, including the fileformat, frame rate andresolution.Data BatteryThe supplied JVC Data Battery provides over two hours of recording time. Using a JVC Data Battery not only guarantees excellent battery performance, it also enables you to monitor the remaining power and recording time, all at the touch of a button. Continuous recording time by the provided BN-VF823U battery is approximately 120 minutes with viewfinder and LCD monitor on at 25˚C.Video OutputFor external monitoring or capture, the GY-HM100U is equipped with a variety of video output options, including HDMI ™ and component output for HD or downconverted SD video, and composite output for SD video only. HDMI™ output is via astandard HDMI ™ connector and can output full HD video as well as uncompressed audio.No cross convert capability.Output signal format is determined by System select and Connection setting in the menu.User-Friendly FunctionalityHDMI™ outUSB 2.0 outComponent outA/V (Composite) outSDDownconverted 480i/p or 576i/p Downconverted 480i or 576i Downconverted 480i or 576iHD720p or 1080i 720p or 1080i-HDMI™Component CompositeGY-HM100U Editing WorkflowMOV File WorkflowDirect file access to Apple’sFinal Cut Pro™SDHC SDHC Memory Card ReaderSDHC Memory Card ReaderRecorded MOV filesUSB 2.0MP4 File WorkflowIngest MP4 clips to majorNLE systemsRecorded MP4 filesProHD Clip ManagerFile ingestAvidAdobe CanopusImportingSDHC USB 2.0Drag and dropDimensionsProHD SoftwareJVC ProHD Clip ManagerThe ProHD Clip Manager, for both Mac and Windows, makes it easy to manage MP4 clips on the GY-HM100U’s memory cards from your PC. With a few clicks of the mouse you can copy, move or delete clips, preview clip content, as well as view and edit clip metadata. You can also manage folders to keep things organized, check the remaining space left on a card, and set the index frame of a clip to use as its thumbnail.ProHD Log and Transfer Plug-inThe ProHD Log and Transfer Plug-in is a software for Apple’s Final Cut Pro ™ that lets you drop MP4 files recorded on the GY-HM100U into the clip bin of Final Cut Pro ™. With the plug-in installed, you can view thumbnails of the MP4 files on a memory card from the Log and Transfer screen of Final Cut Pro ™. Simply drag and drop the thumbnails into the bin to automatically convert the clips to QuickTime ™ format, ready for use.Log and transfer screenMain screen for Windows ®Viewer window Information window IR remote control sensorIngest LoggingBrowser PreviewUnit: inches (mm)05-3/8 (135)4-1/2 (114)3-15/16 (100)4-1/16 (102)6-1/8 (154)7-1/16 (179)7-3/8 (186)7-7/8 (200)10-3/4 (272)14-7/16 (366)5-7/16 (138)1-3/16(30)(hood)(without battery)(with battery)Optional AccessoriesPrinted in JapanDISTRIBUTED BYSimulated pictures.The values for weight and dimensions are approximate.E.&O.E. Design and specifications subject to change without notice.[General]Power requirement: DC 11 V (using AC adapter)/DC 7.2 V (using battery)Power consumption: 7.8 W (when LCD screen backlight is set to [STANDARD])Dimensions: 272 mm (W) x 179 mm (H) x 135 mm (D) (10-6/8" x 7-1/8" x 5-3/8")Mass: Approx. 1.4 kg (3.1 lbs.) (including battery BN-VF823, SDHC card and microphone)Temperature:Operating: 0˚C to 40˚C (32˚F to 104˚F)Storage: -20˚C to 50˚C (-4˚F to 122˚F)Humidity:Operating: 35 % to 80 % RHImage pickup device: 3-chip 1/4" Progressive CCD Color separation prism: 3-color separation prism Sync system: Internal sync (built-in SSG)Filter diameter:When the hood is detached: 46 mm (screw pitch: 0.75 mm)Compatible with filter, tele-converter and wide-converter When the hood is attached: 72 mm (screw pitch: 0.75 mm)Compatible with filter onlyLens: Fujinon F1.8 to 2.8, 10x, f=3.7-37 mm (35 mm conversion: 39 to 390 mm)ND filter: OFF , +1/10NDGain: 0dB, 3dB, 6dB, 9dB, 12dB, 15dB, 18dB, Lolux, AGCMinimum illumination: 5lx (typical) (1920x1080 mode, F1.8, +18dB, with 16-frame accumulation)Electronic shutter: 1/3.75 to 1/10000, EEI Viewfinder: 0.44" LCD, 235,000 pixels, 16:9LCD monitor: 2.8" LCD, 206,000 pixels, 16:9Supported media: SDHC (Class 6)Slots: x 2Recording time: Approx. 25 minutes (8 GB SDHC card, 35 Mbps, VBR mode)[Video/Audio]Recording file format: QuickTime ™ File Format for Final Cut Pro ™/MP4 File FormatRecording format:Video: MPEG-2 long GOPHQ mode: VBR, 35 Mbps (Max) MPEG-2 MP@HL SP mode: CBR, 25 Mbps (1440x1080i)/19 Mbps (1280 x 720p24/25/30): MPEG-2 MP@H-1419 Mbps (1280 x 720p50/60): MPEG-2 MP@HL Audio: LPCM 2ch, 48 kHz/16bit Video frame rate: NTSC settings:HQ mode: 1920 x 1080/59.94i, 29.97p, 23.98p, 1440 x 1080/59.94i (MOV only), 1280 x 720/59.94p, 29.97p, 23.98pSP mode: 1440 x 1080/59.94i, 1280 x 720/59.94p, 29.97p, 23.98p PAL settings:HQ mode: 1920 x 1080/50i, 25p, 1440 x 1080/50i (MOV only), 1280 x 720/50p, 25pSP mode: 1440 x 1080/50i, 1280 x 720/50p, 25p [Still Picture]Still picture recording format: JPEGRecording size: 4 modes (1920 x 1080/1440 x 1080/1024 x 768/640 x 480)Recording quality: 2 modes (Fine, Standard)[Connectors]AV output: Video analog composite output (480i or 576i: Downconverted,4:3/16:9): 1.0 V (p-p), 75-ohms, Audio Stereo, analog output 300 mV , 1 k-ohms (Special cable)Component output: Y , Pb, Pr component output (480i or 576i: Downconverted/720p/1080i)Y: 1.0 V (p-p), 75-ohmsPb, Pr: 0.7 V (p-p), 75-ohms (Special cable)HDMI ™output: HDMI ™(480i/p or 576i/p: Downconverted/720p/1080i) (V .1.3, x.v. Color compliant)USB: Mini USB-B type, USB 2.0Headphone: 3.5 mm mini-jack (stereo)Microphone: 3.5 mm mini-jack (stereo)Audio input:[MIC]: -60 dBs, 3 k-ohms, XLR (balanced), +48 V output (phantom power supply)[LINE]: +4 dBs, 10 k-ohms, XLR (balanced)[Accessories Provided]Battery pack (BN-VF823) x 1, AC adapter (AP-V21) x 1,Battery charger (AA-VF8) x 1, Microphone x 1, Wireless remote control unit x 1, Component cable x 1, A/V cable x 1, USB cable x 1Specifications GY-HM100UGL-V0746U0.7x Wide converter AA-VF8UBattery chargerGL-V1846U1.8x Tele converter MV-P615USuper direction microphoneMZ-V8UStereo microphoneBN-VF823U BatteryJQA-0288Final Cut Pro™ is not supplied.Microsoft® and Windows® are either registered trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. Apple, Apple logo, Macintosh, QuickTime, and Final Cut Pro are trademarks of Apple Inc. registered in the United States and other countries. The SD and SDHC logos are trademarks of the SD Card Association. Product and company names mentioned here are trademarks or registered trademarks of their respective owners.Hachioji Business Center of Victor Company of Japan, Ltd.has received ISO9001 Certifications.■ SDHC Class 6 recording time (approx.)MOV/MP4SPHQ 720p/1080i 12 min.25 min.50 min.1 hr. 40 min.1080i 17 min.35 min.1 hr. 10 min.2 hr. 20 min.720p22 min.45 min.1 hr. 30 min.3 hr.4GB 8GB 16GB 32GB。
VERSILOK 254 产品说明书
USA SAFETY DATA SHEET1. CHEMICAL PRODUCT AND COMPANY IDENTIFICATIONProduct name:VERSILOK 254Product Use/Class: Acrylic Adhesive, Part 2 of 2LORD Corporation111 LORD DriveCary, NC 27511-7923 USATelephone: 814 868-3180Non-Transportation Emergency: 814 763-2345Chemtrec 24 Hr Transportation Emergency No.800 424-9300 (Outside Continental U.S. 703 527-3887)EFFECTIVE DATE: 11/18/20202. HAZARDS IDENTIFICATIONGHS CLASSIFICATION:Acute toxicity Inhalation - Dust and MistCategory 4 - 63.1% of the mixture consists of ingredient(s) of unknown toxicity.Reproductive toxicity Category 2Specific target organ systemic toxicity (single exposure) Category 1 Nervous systemSpecific target organ systemic toxicity (repeated exposure) Category 1 Nervous systemSpecific target organ systemic toxicity (repeated exposure) Category 2 Adrenal glandHazardous to the aquatic environment - acute hazard Category 1Hazardous to the aquatic environment - chronic hazard Category 1GHS LABEL ELEMENTS:Symbol(s)Signal WordD ANGERHazard StatementsHarmful if inhaled.Suspected of damaging fertility or the unborn child.Causes damage to organs.(Nervous system)Causes damage to organs through prolonged or repeated exposure.(Nervous system)May cause damage to organs through prolonged or repeated exposure.(Adrenal gland)Very toxic to aquatic life.Very toxic to aquatic life with long lasting effects.Precautionary StatementsPreventionObtain special instructions before use.Do not handle until all safety precautions have been read and understood.Use personal protective equipment as required.Do not breathe dust/fume/gas/mist/vapors/spray.Wash thoroughly after handling.Do not eat, drink or smoke when using this product.Use only outdoors or in a well-ventilated area.Avoid release to the environment.300000001064ResponseCall a POISON CENTER or doctor/physician if you feel unwell.IF exposed: Call a POISON CENTER or doctor/physician.Specific treatment (see supplemental first aid instructions on this label).IF INHALED: Remove to fresh air and keep at rest in a position comfortable for breathing.Collect spillage.StorageStore locked up.Disposal:Dispose of contents/container in accordance with waste/disposal laws and regulations of your country or particular locality.Other Hazards:This product contains component(s) which have the following warnings; however based on the GHS classification criteria of your country or locale, the product mixture may be outside the respective category(s).Acute: Dermal absorption possible. May cause eye irritation. May cause respiratory tract irritation. May causeheadache and nausea. See Section 11 for additional information. May be harmful if swallowed. Ingestion is not an expected route of entry in industrial or commercial uses.Chronic: Repeated or prolonged skin contact may cause allergic reactions with susceptible persons. Chronicexposure to the tricresyl phosphate in this product may cause adrenal, reproductive and developmental effects based on animal data. See Section 11 for additional information.withheld.FIRST AID - EYE CONTACT: Flush eyes immediately with large amount of water for at least 15 minutes holding eyelids open while flushing. Get prompt medical attention.FIRST AID - SKIN CONTACT: Flush contaminated skin with large amounts of water while removing contaminated clothing. Wash affected skin areas with soap and water. Get medical attention if symptoms occur.FIRST AID - INHALATION: Move person to fresh air. Restore and support continued breathing. If breathing is difficult, give oxygen. Get immediate medical attention.FIRST AID - INGESTION: If swallowed, do not induce vomiting. Call a physician or poison control center immediately for further instructions. Never give anything by mouth if victim is rapidly losing consciousness, unconscious or convulsing.SUITABLE EXTINGUISHING MEDIA: Carbon Dioxide, Dry Chemical, Foam, Water FogUNSUITABLE EXTINGUISHING MEDIA: Not determined for this product.SPECIFIC HAZARDS POSSIBLY ARISING FROM THE CHEMICAL: Keep containers tightly closed. Closed containers may rupture when exposed to extreme heat. Use water spray to keep fire exposed containers cool. During a fire, irritating and/or toxic gases and particulate may be generated by thermal decomposition or combustion.SPECIAL PROTECTIVE EQUIPMENT AND PRECAUTIONS FOR FIRE-FIGHTERS: Wear full firefighting protective clothing, including self-contained breathing apparatus (SCBA). If water is used, fog nozzles are preferable.PERSONAL PRECAUTIONS, PROTECTIVE EQUIPMENT AND EMERGENCY PROCEDURES: Avoid breathing vapors. Avoid contact. Use appropriate respiratory protection for large spills or spills in confined area.ENVIRONMENTAL PRECAUTIONS: Do not contaminate bodies of water, waterways, or ditches, with chemical or used container.METHODS AND MATERIALS FOR CONTAINMENT AND CLEANUP: Notify appropriate authorities if necessary. Avoid contact. Keep non-essential personnel away from spill area. Scoop spilled material into an appropriate container for proper disposal. (If necessary, use inert absorbent material to aid in containing the spill).HANDLING: Keep closure tight and container upright to prevent leakage. Avoid skin and eye contact. Wash thoroughly after handling. Do not handle until all safety precautions have been read and understood.STORAGE: Store only in well-ventilated areas. Keep container closed when not in use.INCOMPATIBILITY: Amines, acids, water, hydroxyl, or active hydrogen compounds.Engineering controls: Sufficient ventilation in pattern and volume should be provided in order to maintain air contaminant levels below recommended exposure limits.PERSONAL PROTECTION MEASURES/EQUIPMENT:RESPIRATORY PROTECTION: Use a NIOSH approved air-purifying organic vapor respirator if occupational limits are exceeded. For emergency situations, confined space use, or other conditions where exposure limits may be greatly exceeded, use an approved air-supplied respirator. For respirator use observe OSHA regulations (29CFR1910.134) or use in accordance with applicable laws and regulations of your country or particular locality.SKIN PROTECTION: Use neoprene, nitrile, or rubber gloves to prevent skin contact.EYE PROTECTION: Use safety eyewear including safety glasses with side shields and chemical goggles where splashing may occur.OTHER PROTECTIVE EQUIPMENT: Use disposable or impervious clothing if work clothing contamination is likely. Remove and wash contaminated clothing before reuse.HYGIENIC PRACTICES: Wash hands before eating, smoking, or using toilet facility. Food or beverages should not be consumed anywhere this product is handled or stored. Wash thoroughly after handling.Typical values, not to be used for specification purposes.ODOR: Epoxy VAPOR PRESSURE: N.D.APPEARANCE: Gray VAPOR DENSITY: Heavier than AirPHYSICAL STATE: Liquid LOWER EXPLOSIVE LIMIT: Not ApplicableUPPER EXPLOSIVE LIMIT: Not ApplicableFLASH POINT:≥ 201 °F, 93 °CSetaflash Closed CupBOILING RANGE: N.A.EVAPORATION RATE: Not Applicable AUTOIGNITION TEMPERATURE:N.D.DENSITY: 1.44 g/cm3 (11.97 lb/gal) DECOMPOSITION TEMPERATURE:N.D. VISCOSITY, DYNAMIC: N.D.ODOR THRESHOLD: N.D.VISCOSITY, KINEMATIC: N.D.SOLUBILITY IN H2O: Insoluble VOLATILE BY WEIGHT: 0.03 %pH: N.A.VOLATILE BY VOLUME: 0.05 %FREEZE POINT: N.D. VOC CALCULATED: 0 lb/gal, 0 g/l0 g/lN.D. METHOD 24: 0.85 lbs/gal COEFFICIENT OF WATER/OILDISTRIBUTION:LEGEND: N.A. - Not Applicable, N.E. - Not Established, N.D. - Not DeterminedHAZARDOUS POLYMERIZATION: Hazardous polymerization will not occur under normal conditions. STABILITY: Product is stable under normal storage conditions.CONDITIONS TO AVOID: High temperatures.INCOMPATIBILITY: Amines, acids, water, hydroxyl, or active hydrogen compounds.HAZARDOUS DECOMPOSITION PRODUCTS: Carbon monoxide, carbon dioxide, aldehydes, Oxides of phosphorusEXPOSURE PATH: Refer to section 2 of this SDS.SYMPTOMS:Refer to section 2 of this SDS.TOXICITY MEASURES:Germ cell mutagenicity: No classification proposedCarcinogenicity: No classification proposedReproductive toxicity: Category 2 - Suspected of damaging fertility or the unborn child.Components contributing to classification: Tricresyl phosphate.TOXICOLOGICAL INFORMATION:Historical data on Tricresyl phosphate (TCP) has shown neurological effects associated with levels of the ortho isomer within TCP. The manufacturer of the TCP in this product has noted on their SDS that the TCP does not exhibit negative neurological effects based on toxicology and epidemiology studies. This LORD product may contain a very small amount of the ortho isomer. However, LORD analytical testing of the raw material containing TCP indicates no ortho isomer present. Also, based on the TCP manufacturer's information, the LORD product content should not exceed225ppm, if present at all.ECOTOXICITY:PERSISTENCE AND DEGRADABILITY:Not determined for this product.BIOACCUMULATIVE: Not determined for this product.MOBILITY IN SOIL: Not determined for this product.OTHER ADVERSE EFFECTS: Not determined for this product.DISPOSAL METHOD: Disposal should be done in accordance with Federal (40CFR Part 261), state and local environmental control regulations. If waste is determined to be hazardous, use licensed hazardous waste transporter and disposal facility.US DOT RoadProper Shipping Name: Environmentally hazardous substances, liquid, n.o.s.Hazard Class: 9SECONDARY HAZARD: NoneUN/NA Number: 3082Packing Group: IIIEmergency Response Guide Number: 171For US DOT non-bulk road shipments this material may be classified as NOT REGULATED. For the most accurate shipping information, refer to your transportation/compliance department regarding changes inpackage size, mode of shipment or other regulatory descriptors.IATA CargoPROPER SHIPPING NAME: Environmentally hazardous substance, liquid, n.o.s.Hazard Class: 9HAZARD CLASS: NoneUN NUMBER: 3082PACKING GROUP: IIIEMS: 9LIMDGPROPER SHIPPING NAME: Environmentally hazardous substance, liquid, n.o.s.Hazard Class: 9HAZARD CLASS: NoneUN NUMBER: 3082PACKING GROUP: IIIEMS: F-AThe listed transportation classification applies to non-bulk shipments. It does not address regulatory variations due to changes in package size, mode of shipment or other regulatory descriptors. For the most accurate shipping information, refer to your transportation/compliance department.U.S. FEDERAL REGULATIONS: AS FOLLOWS:SARA SECTION 313This product contains the following substances subject to the reporting requirements of Section 313 of Title III of the Superfund Amendment and Reauthorization Act of 1986 and 40 CFR part 372.:Chemical Name CAS Number Weight % Less ThanDibenzoyl peroxide94-36-0 5.0%TOXIC SUBSTANCES CONTROL ACT:INVENTORY STATUSThe chemical substances in this product are on the TSCA Section 8 Inventory.EXPORT NOTIFICATIONThis product contains the following chemical substances subject to the reporting requirements of TSCA 12(B) if exported from the United States:NoneUnder HazCom 2012 it is optional to continue using the HMIS rating system. It is important to ensure employees have been trained to recognize the different numeric ratings associated with the HazCom 2012 and HMIS schemes.HMIS RATINGS - HEALTH: 2* FLAMMABILITY: 1 PHYSICAL HAZARD: 1* - Indicates a chronic hazard; see Section 2Revision: Company LogoEffective Date: 11/18/2020The information contained herein is, to the best of our knowledge and belief, accurate. However, since the conditions of handling and use are beyond our control, we make no guarantee of results, and assume no liability for damages incurred by use of this material. It is the responsibility of the user to comply with all applicable federal, state and local laws and regulations.。
RYII中文资料
1Datasheet Rev. HC1 Issued 2008/03 Dimensions are in mm unlessotherwise specified and areshown for reference purposesProduct specificationaccording to IEC61810-1.Product data, technical para-processing informationonly to be used togetherwith the'Definitions' at‘Schrack’ section.Specifications subject toEspecially suitable for resistive and inductive loads on NO and NC contactsRoHS compliant (Directive 2002/95/EC) as per product date code 0403Applications: heating control, interface technology, domestic appliances, timers,V REG.-Nr. 5358, Z E214025Contact dataContact configuration 1 CO or 1NO or 1NCContact set single contactType of interruption micro disconnectionRated current8ARated voltage/max. switching voltage AC250/400VACMaximum breaking capacity AC2000VAContact material AgNi0,15, AgSnO2, AgCdOMechanical endurance30x106cyclesRated frequency of operation with/without load 6 / 1200min-1Contact ratingsType Load CyclesRY**1***NO, 8 A, 250 VAC, resistive, 70°C1x105RY**1***NC, 8 A, 250 VAC, resistive, 70°C5x104RY**(0,1,2)***8 A, 30 VDC, UL 5083x104RY**(0,1,2)***0,28 A, 250 VDC, UL 5083x104RY**(0,1,2)***1/2 HP, 240 VDC, UL 508RY**(0,1,2)***1/4 HP, 120 VDC, UL 508RY**(0)***8 A, 415 VAC, resistive, UL 5086x103RY**(0,1,2)***Pilot duty - B300, UL 5086000RY*** ***CO, 8 A, 250 VAC, resistive, 70°C5x103RY**1 ***6(4)A, 250 VAC, 85°C, EN607301x105Coil dataRated coil voltage range DC coil 5...60VDCCoil power DC coil typ. 220mWOperative range2Coil versions,DC-coilCoil Rated Operate Release Coil Rated coilcode voltage voltage voltage resistance powerVDC VDC VDC Ohm mW00553,50,5112+10%22300664,20,6162+10%22200996,30,9320+10%253012128,41,2627+10%2300242416,82,42350+10%2450484833,64,89391+10%2450606042,06,014000+10%257All figures are given for coil without preenergization, at ambient temperature +23°COther coil voltages on requestF0142-FInsulation CO contact NO contact Dielectric strength coil-contact circuit5000V effopen contact circuit1000V effClearance/creepage coil-contact circuit W8 / 8mmMaterial group of insulation parts IIIaTracking index of relay base PTI250, PTI 175* Type of insulation coil-contact circuit reinforcedopen contact circuit functionalRated insulation voltage250V250VPollution degree 3 23Rated voltage system230V 400V230 / 400VOvervoltage category III IIIOther dataRoHS - Directive 2002/95/EC compliant as per product date code 0403 Flammability class according to UL94V-0GWT to IEC 60335-1> 750 °C**Ambient temperature range -40...+70°CAmbient temperature max.85°C at 6AOperate- / release time typ. 7 / 3msBounce time NO / NC contact typ. 2.5 / 4.5ms Vibration resistance (function) NO/NC contact20 / 5gShock resistance (function) NO/NC contact20 / 5gShock resistance (destruction) 100gCategory of protection RTII-flux proof, RTIII- wash tight** Mounting pcbMounting position anyMinimum mounting distance W 0mmSoldering heat resistance flux proof version270°C/10swash tight version260°C/5sRelay weight8gPackaging unit20 / 500pcs AccessoiresFor technical details see datasheet Accessoires RYII* reflow-solderable version** not as reflow-solderable version PCB layout / terminal assignment Bottom view on solder pins1 NO, 1 NC contact 5mmS0254-AAS0254-ABS0254-ACS0254-ADS0254-AFS0254-AEDimensionsPinning 3.2mmPinning 5mmSoldering profile for reflow-solderable version。
LF工艺与操作
LF工艺与操作管理提醒：本帖被fengzhitang 执行置顶操作(2008-09-10)1 钢包炉冶炼前的检查与准备1.1 检查各种介质是否满足使用条件。
1.1.1 水冷炉盖冷却水压力0.4～0.5MPa。
1.1.2 氩气管路压力0.9～1.0MPa1.1.3 压缩空气压力0.5～0.6MPa1.1.4 检查介质系统的压力表、流量表及各种阀门是否正常工作。
1.2 检查主控室及炉前操作盘、画面、仪表及报警显示系统等是否正常。
1.3 检查液压系统是否正常。
1.4检查电极长度是否够用,必要时进行滑电极或接电极。
1.5 检查测温、取样设备是否正常,各种探头、取样器是否够用。
1.6 检查高位料仓存料情况，确认高位料仓存料是否够用，炉前铝粒、电石、焦碳等是否够用。
1.7 检查水冷炉盖有无漏水现象。
1.8 检查炉盖电极环及其它部件耐火材料能否继续使用。
1.9 检查钢包车轨道是否有异物,钢包车运行是否正常。
2 钢包炉冶炼技术要点2.1 对钢包要求2.1.1 钢包透气砖、罐龄及渣线部位能否满足精炼处理要求2.1.2 水口及钢包上沿不应有残钢或废物,钢包水口及滑动机械应保持良好状态。
2.1.3 使用连续生产的正常运转钢包且要红包出钢。
2.2 对转炉的出钢要求2.2.1 要求转炉挡渣出钢,若下渣量较大,由转炉炉长通知精炼扒渣位,进行扒渣。
2.2.2 在出钢过程中加入200Kg石灰块,便于形成碱性顶渣。
同时加入合金和脱氧剂进行脱氧。
2.2.3 出完钢后,测温并试吹氩1-3min,如果发现透气砖不透气,应进行倒包处理,吹不起氩气,严禁送往精炼。
2.2.4 钢包净空最大不超过1300mm,对于经VD的钢种钢包净空应大于900mm。
2.2.5 钢水成分、温度应符合相应技术要求。
2.3 钢包就位2.3.1 由吊车将钢包从钢包运输车上吊至精炼钢包车上,人工连接钢包车上的氩气快速接头,通过计算机画面,打开氩气阀门调节双线氩气流量至200L/min,发现吹氩不好,立即换成事故吹氩,若事故吹氩吹不起,则返回转炉。
各类软件注册码大全
各类软件注册码大全AAceHTML Pro 5.01.1－Name:Sponge Uk - TNT[CraCK!TEaM] Code:FVTW-5YAD-LAFT-HMMQAdobe PageMaker 7.0－S/N：1039-1121-2998-7586-7388-7545 Adobe Photoshop V6.01中文正式版安装序列号：PWC601R3382269-296或者PWC601R4999617-923acdsee32 2.0sender 27168acdsee32 3.0 full911913243408102441光盘版700076064285591441acdsee 3.1SN:881451784190102441132728175249781441ACDsee SR1 PowerPack Retail243478918944730541ACDSee 4.0 零售注册版SN:711-108-595-288-491-441ACDSee 4.0 Power Pack Suite708-801-298-633-437-541Acrobat 4.0AOW301R7136978-298Acrobat 5。
sn:AEB100R3498245-291 Acrobat 5 正式版注册码：KWW500R7150122-128Adobe LiveMotion v1.0.0.78正式版(34.8M) 安装序列号：GDW100R7100002-687 ArGoSoft 1.2.2.2Name:Free User Code:5DD12A4D69828673 ArGoSoft Mail Server Plus 1.6.1.8Name:Free User Code:D0CC1653E2F3251FASPEdit 2000 build 10。
下载(5.43M) 注册码：Name:tiger Number:93867AutoCAD R14 : s/n: 110-99423726 Key: WYUR Code: B4D83673 or s/n: 117-99703105 Key: W36H Code: C3DF32EAA1MONITOR 2001 V5.6.2-Code:Y4176AbsoluteFTP 2.0.0 Beta 4-Name:CZY Company:CZYSerial:02-16-361500 Key:18292198071562904476 Date:NeverAbsoluteFTP 2.0.0 Beta 2-Name:CZY Company:CZYSerial:02-16-361500 Key:18292198071562904476 Date:NeverAbsoluteFTP 2.0.0 Beta 1-Name:CZY Company:CZYSerial:02-16-361500 Key:18292198071562904476 Date:NeverAbsolute Company:CZY Serial:02-16-361500Key:18292198071562904476 Date:NeverACDSee Power Pack Suite 4.0－Serial:708-801-298-633-437-541ACDSee 4.01.0598 零售注册版注册码：148-817-607-012-681-441 ACDSee 4.0 Retail 零售版－SN:711-108-595-288-491-441Ace2.05.0 User Code:A333U4-4XZ7PK-TTMDZC-WMBHAU Ace User Code:A333U4-4XZ7PK-TTMDZC-WMBHAUAce－Name:Free UserCode:A333U4-4XZ7PK-TTMDZC-WMBHAUAceHTML Pro V5.04－Name:Sponge Uk - TNT[CraCK!TEaM] Code:FVTW-5YAD-LAFT-HMMQAceHTML Pro V5.03.1－Name:Sponge Uk - TNT[CraCK!TEaM] Code:FVTW-5YAD-LAFT-HMMQAceHTML Pro 5.01.1－Name:Sponge Uk - TNT[CraCK!TEaM] Code:FVTW-5YAD-LAFT-HMMQAcqURL 6.1 Code:821452361253012614127138AcqURL 5.5 Code:821452361253012614127138Adobe Streamline 4.0注册码Adobe PageMaker 7.0－S/N：1039-1121-2998-7586-7388-7545 Adobe Photoshop V6.01中文正式版安装序列号：PWC601R3382269-296或者PWC601R4999617-923Adobe Photoshop V6.01中文正式版安装序列号：PWW550R7162534-100或者PWW600R7105467-948Adaptec Easy CD Creator V5.02PlatiniumSN:G-332NB-MGJNH-ZFVPB 或者sn:P-7TGQ4-G06CM-N5G1LAdaptec Easy CD Creator V5.0Platinium-sn:P-7TGQ4-G06CM-N5G1LAdvanced Direct Remailer 2.15-Code:ADR-99-PXHSY-749Advanced Direct Remailer 2.14-Code:ADR-99-PXHSY-749Advanced Disk Catalog1.47-Code:1303196920041974ny3hscMDeIhSe5sCAudioCD MP3 Studio 2000 V2.35－Code:CSN77B-0LasH0-0389Audio CD Maker 5.02 s/n: 11410355AMS 或者Code:ACDv50-765RRw978Audio CD Maker 5.01 s/n: 11410355AMS 或者Code:ACDv50-765RRw978AltoMP3 Maker 3.10－Name:Sponge Uk Code:2509556074ArGoSoft Mail Server Pro 1.8.0.7-Code:C8CCD24C4D1A9995Agent 1.91-s/n: HH2W7UP4-63W9NK4J-1ZR5831C-DVRCMYRG 安全之星XP正式版－－SN:CHR-SSV456-9985303DSK-3或者CHR-SSV234-9913220CHR-3Adobe After Effects V5.0－－sn:EWE780A7645038-389-588或者SN:EWW471R7080005-040-498Adobe After Effects V4.1--sn:EWW400R4000123-666-922Adobe Acrobat 5.0.1 简体中文版－－SN:KWC500R6538415-885Adobe Acrobat 5.0 正式完全版－－sn:AEB100R3498245-291或者sn:KWW500R7150122-128Adobe Acorobat full 4.0－－sn:AOW301R7136978-298Adobe Acorobat read 1.2－－sn:ARM100R3100034-100-397Adobe Acorobat distiller 2.1－－sn:DEE100R3001172-010-496Adobe Acorobat capture－－sn:WCW100R3101909-171Adobe Dimission 3.01－－sn:DJW301R2100011-348Adobe Genesis－－sn::44444 autoriznatincode:2077229778Adobe Illustrator 9.0繁体中文版－－sn:ABT800R7100102-625Adobe Illustrator 8.0中文版－－sn:ABW800X7102095-685或者sn:EXX500R5900103198-517Adobe PageMaker.v7.0－－S/N：1039-1121-2998-7586-7388-7545 Adobe Pagemaker 6.0－－sn:03W600R1124621-479Adobe Pagemaker NL v5.0－－sn: 03-5025-303224614简体中文正式版:SN:FM9FY-TMF7Q-KCKCT-V9T29-TBBBGAdobe Premiere 6.0 final－－sn:MBF500B7205104-998Adobe Premiere 5.1－－sn:MXX500R145503-500-448Adobe Premiere RT 5.1 for 9x/NT－－sn: MBF420U3000205-940 Adobe PhotoShop v6.01 中文版－－PWC601R3382269-296或者PWC601R4999617-923或者PWW600R7105467-948或者PWW550R7162534-100Adobe Photoshop 6.0－－sn:PWW600R7105467-948或者EXX600B6311279-428Adobe Photoshop 5.0－－sn:PWW400R7106337-339Adobe Photoshop 4.0－－sn:PWW250R3107069-312Adobe Photo deluxe－－sn:HTW200R7100048-493Adobe Streamline v4.0－－sn:SBW400U7102000-766或者SBW400U7100000-392Adobe Streamline v3.0－－sn:SBW300S1100640-184Adobe 无效manager－－sn:AWW400P0101591-292Adobe Wild 无效－－sn:FHW251R31003373AbsoluteFTP 2.0.0 Beta 4-Name:CZY Company:CZY Serial:02-16-361500 Key:18292198071562904476 Date:NeverAbsoluteFTP 2.0.0 Beta 2-Name:CZY Company:CZY Serial:02-16-361500 Key:18292198071562904476 Date:NeverAbsoluteFTP 2.0.0 Beta 1-Name:CZY Company:CZY Serial:02-16-361500 Key:18292198071562904476 Date:NeverAbsolute Company:CZY Serial:02-16-361500Key:18292198071562904476 Date:NeverAbsolute Name: RePulsive Company: Pirates Gone Crazy S/n:02-16-123456 Exp: Never Key: 01803292020690490481Absolute RC 11 Name: _RudeBoy_ Company: Phrozen Crew S/n: 02-01-900000 Exp: Never Key: 1237 9814 1293 3185 9734Absolute Final Name: CORE/JES Company: CORE S/n:00-00-000000 Exp: Never Key: 1074 2875 9697 3324 3564Absolute beta 6 Name: CORE/JES Company: CORE S/n:00-00-000000 Exp: never Key: 1074 2875 9697 3324 3564Absolute security pro 3.9--Name: CROSSFIRE ROCKER s/n: JDHULALBFRHMLQY or Name: FIREANGEL [EVD] s/n: NVMFTMKNPTUCHJAACDSee 4.01.0598 零售注册版注册码：148-817-607-012-681-441 AcdSee V4.0----sn：711-108-595-288-491-441AcdSee 3.1 build 921 Retail－－sn:243478918944730541ACDsee SR1 PowerPack Retail－－sn:243478918944730541ACDsee 3.1－－sn:132728175249781441Ace User Code:A333U4-4XZ7PK-TTMDZC-WMBHAUAce－Name:Free UserCode:A333U4-4XZ7PK-TTMDZC-WMBHAUAce－－Name: Free User s/n:A333U4-4XZ7PK-TTMDZC-WMBHAUAceHTML Pro 5.01.1－Name:Sponge Uk - 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Code: BM1-E3BDN-ED81U-BB7DBlindwrite 1.2.4.9 Beta 多语言版Code:YRB1F1J1YDYU7MEJ Blindwrite 1.1.0.7 多语言版-Code:YRB1F1J1YDYU7MEJ办公之星企业版v3.0－Name:唐朝在线CompanyName SerialNumber:OST86-JG8L4-P6R25CCamtasia 3.0.1-Code:FE2D88D8-D546708505CD Mate Deluxe(光碟工坊) 2.2.3.11-Code:CMSBDF04072AB CD Mate Deluxe(光碟工坊) 2.2.2.6-Code:CMSBDF04072ABCD Mate Deluxe(光碟工坊) 2.2.2.5-Code:CMSBDF04072ABCD Mate Deluxe(光碟工坊) 2.2.1.30-Code:CMSBDF04072AB CD Mate Deluxe(光碟工坊) 2.2.1.2－Code:CMSBDF04072AB CD Mate Deluxe(光碟工坊) 2.1.2.27－Code:CMSBDF04072AB CD Mate Deluxe(光碟工坊) 2.1.1.27－Code:CMSBDF04072AB CD Mate Deluxe(光碟工坊) 2.1.1.23－Code:CMSBDF04072AB CD Mate Deluxe(光碟工坊) 2.1.1.19－Code:CMSBDF04072ABCD Mate Deluxe(光碟工坊) 2.1.0 Build 30－Code:CMSBDF04072ABCDRWin 5.02.000 Final 正式版注册码CDRWin V5.0 正式版注册码CDRWin V4.0a Build 2002.01.26注册码CDRWin V4.0a Build 2002.01.09注册码CompuPic Pro 6.0 Build 1155－Name:TMD Photo:666888 Code:1BB3ASX2X4Q19Cookie Pal 1.7a Name:Free User Code:4064650CloneCD V4.0.0.0 Final－注册码CloneCD 3.3.4.1 多语言版－注册码CloneCD 3.3.3.1 多语言版－注册码CloneCD 3.3.2.1 多语言版－注册码CloneCD 3.3.1.1 多语言版－注册码CloneCD 3.2.2.1 多语言版－注册码CloneCD 3.2.2.1 多语言版－注册码CloneCD 3.1.1.0 多语言版－注册码CloneCD 3.1.0.0 多语言版－注册码CloneCD 3.0.9.1 多语言版－注册码Clean Disk Security 6.01-Code:deepgreenClean Disk Security 5.2-Code:deepgreenCuteFtp通用注册码Name:1key.126 custom:1keysn:AY6RP7E6V9DX37Cute V2.0注册序列号：A6B34224J2J423 姓名：Dr_NetCute Cleaner v2.0 Name:广明网站S/N:G90Q-U4WU-RQZR-A91V Customizer XP 1.7.8 正式版－Code:28031979-ph-17081945Customizer XP 1.7－Code:28031979-ph-17081945Customizer XP 1.6－Code:28031979-ph-17081945Customizer XP 1.5－Code:28031979-ph-17081945Customizer XP 1.4－Code:28031979-ph-17081945CPUCool 7.09完全版Code:7398356超级兔子魔法设置系列注册码超级兔子魔法设置(Magic Set)2002中文零售版本序列号SRMSS10987-RKMJQTMNOAC或者序列号SRMSS39797-LGABCSFNKHS超级兔子魔法设置4.17 注册：Name：好论坛Code：CXMSR-FOLEDUVWIUP或者Name:leeyamSN:CXMS-AFSTUABAPMA超级兔子魔法设置4.16 新注册：姓名:REGISTER 注册码:CXMS-HECGRSTHBJK超级兔子魔法设置4.16 注册：姓名:fpxfpx 注册码:CXMS－GIFDSFGHBVD超级兔子魔法设置V4.1(Magic Set) 简体中文版注册名：NAME:小鱼儿SN:CSMX-XUEIPQREQWE或者NAME:爱你一万年SN:CXMS-DAEIPQREBWE超级兔子魔法设置3.99简体中文版(Super Rabbit MagicSet)NAME:fish SN:CXMS-PMEIPQREAWE超级兔子魔法设置3.99简体中文版(Super Rabbit Magic Set)注册名：星梦之网注册码：CXMS-FCBJOPQWDHQ超级兔子魔法设置3.98简体中文版Name：好论坛Code：CXMSR-FOLEDUVWIUP超级兔子注册表优化V4.8－NAME:小鱼儿SN:CSMX-XUEIPQREQWE彩票点金术4.0版email:fish[BCG] sn:w>]_>DQI?otpMu超级兔子魔法设置4.15 简体中文版( 3950KB )注册名：爱你一万年注册码：CXMS-DAEIPQREBWE注册名：有钱真好注册码：CXMS-FXUEDUVWINP超级兔子魔法设置〔Magic Set〕4.16 简体中文版用户名：Register 密码：CXMS-HECGRSTHBJK超级兔子魔法设置2002 零售版序列号：SRMSS10987-RKMJQTMNOACCDRWinName: CoKeBoTtLe99Unlock Code: 60D015F4-600893EB-BEFF5755-53E4E943Check Code: 3334FCB7-00D8861F-DEF7C4BE-ED1BBE16CDRWin 3.8b注册码：Name:CHENZYKey Code:2415FEE6-3BFE6E6D-8E3A5B70-5FDCD80ACheck Code:7BC926EC-1FEB908B-B5C4351D-D1E6837ACDRWIN v4.0AName: CoKeBoTtLe99Unlock Code: 60D015F4-600893EB-BEFF5755-53E4E943Check Code: 3334FCB7-00D8861F-DEF7C4BE-ED1BBE16CloneCD v2.7.8.1 ，能够把PS碟做成*.image文件，Daemon Tools V2.23版支持！Name: Ron Erlandsons/n:1048CC2C56535F626771FEAC48458EA2E109DFE407215DD41E200D689AF86EBEB00FC5EF072323E7E44A04CA5F4BE2C07D347864517CB4C0F692501CD1001BBFclonecd2842Name:Karen Keheleys/n:10542B69A0FDB37CBDD65A6D826C7763C0E1ED5F5EFFCB6DCCA9CF844F2284BEB10F68BF6FFC23E6E44A04CA5F4B3CF57DCFB1DE01FFB4C0457E57BBD1001BBFCloneCD v3.0.0.11Name:microkeCode:10D3853C8C003B8ED5E83B851C9E8756B8D61AEC441BE7AB91F0253DADC257BEB10F23EC7F6F23E6E44A04CA5F4BCB577E578A67ABE9B4BF693ADAE2D1001BBFCorel Draw 10D10NR-3284253T76Delphi6(134M)另一下载注册码:z9j8-pum4n-c6gzq认证码:rw2-7jwDDelphi6.0 企业版Serial:z9j8-pum4n-c6gzq Key:rw2-7jwDelphi 6 Personal Edition-serial: n5qh-6rk23-zmr85 Key: d32-ru2 DHTML Menu注册信息Name:Ramon AlvarezCode:62F7BDA050509968E1CE12FCB2CB9A02Disk2Disk 1.3 Build 175 Name:CHZHY E-mial:CZY@USA Serial:lYQrfJHmxxzHsSqszWAz5-XJ3cZYkoPgDownload Mage V1.85a 注册信息用户：注册用户；注册码：AAA7F1062D544D47或者用户名:Ronnier，注册码:A7FCF3A4274A725BDownload Mage V1.85 注册信息用户：注册用户；注册码：AAA7F1062D544D47Download Mage V1.84c 注册信息用户：注册用户；注册码：AAA7F1062D544D47Dll Show 4.8－Name:[eGIS! 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mead-spec hm1500lf 相对湿度模块说明书
HM1500LF – Relative Humidity Module•Small size product• Product free from Lead, Cr(6+), Cd and Hg • Humidity calibrated within +/-2% @55%RH•Typical 1 to 3.6 Volt DC output for 0 to 100% RH at 5Vdc supply• Ratiometric to voltage supply from 4.75Vdc to 5Vdc• Patented solid polymer structureDESCRIPTIONBased on the rugged HS1101LF capacitive humidity sensor, HM1500LF is a dedicated humidity transducer designed for OEM applications where a reliable and accurate measurement is needed. Direct interface with a micro-controller is made possible with the module’s linear voltage output.FEATURESAPPLICATIONS• Full interchangeability•Industrial• • High reliability and long term stability • Process control • • Not affected by water immersion• • …• Very low temperature dependence •Suitable for 3 to 10 Vdc supply voltageHumidity Sensor Specific featuresInstantaneous de-saturation after long periods in saturation phase Fast response timePart could be washed with distilled water(1) Soldering temperature profiles available on request / contact us at **********************************PERFORMANCE SPECSMAXIMUM RATINGSSymbol Value Unit Storage Temperature Tstg -30 to 70 °C Storage HumidityRHstg 0 to 100 % RH Supply Voltage (Peak) Vs 10 Vdc Humidity Operating Range RH 0 to 100 % RH Temperature Operating RangeTa-40 to 60°CELECTRICAL CHARACTERISTICS(Ta=23°C, Vs=5Vdc +/-5%, R L >1M unless otherwise stated)*Maximum power supply ramp up time to Vcc should be less than 4ms.TYPICAL PERFORMANCE CURVESHUMIDITY SENSOR• Measurement conditionsHM1500LF is specified for accurate measurements within 10 to 95% RH.Excursion out of this range (<10% or >95% RH, including condensation) does not affect the reliability of HM1500LF characteristics.Dedicated HM15XX products are available for extreme RH conditions (as HM1520 for low dewpoints). Consult MEAS-FRANCE/Humirel for further information.• Modeled Signal OutputTyp Max Unit Humidity Measuring RangeRH 0 100 %RH Relative Humidity Accuracy (10 to 95% RH) RH +/-3 +/-5 %RH Supply Voltage (regulated at 5Vdc*) Vs 5 Vdc Nominal Output @55%RH (at 5Vdc) Vout 2.42 2.48 2.54V Current consumptionIc 1.4 2 mA Temperature Coefficient (10 to 50°C) Tcc - 0.05 -0.1 %RH/°C Average Sensitivity from 33% to 75%RH Vout/ RH+26 mV/%RH Sink Current Capability (R L =33k ) Is 150 µA Humidity Hysteresis+/-1 %RH Time Constant (at 63% of signal, static) 33% to 75%RH τ 10 s Warm up time (electronic) tw 150 ms Humidity resolution 0.4 %RH Output ImpedanceZ 70RH (%) Vout (mV) RH (%) Vout (mV) 10 1325 55 2480 15 1465 60 2605 20 1600 65 2730 25 1735 70 2860 30 1860 75 2990 35 1990 80 3125 40 2110 85 3260 45 2235 90 3405 50 2360 95 3555LINEAR EQUATION:V out = 25.68RH + 1079 RH = 0.03892 V out - 42.017 (With V out in mV and RH in %)POLYNOMIAL EQUATION:V out = 9E -4 RH 3- 1.3E -1 RH 2+ 30.815 RH + 1030RH = -1,91E -9 V out 3 + 1,33E -5 V out 2 + 9,56E -3 V out - 2,16E +1(With V out in mV and RH in %)• Error Budget at 23°CTEMPERATURE COMPENSATION:(With T : Temperature in °C and RH: Relative Humidity in %)QUALIFICATION PROCESSRESISTANCE TO PHYSICAL AND CHEMICAL STRESSES• HM1500LF has passed through qualification processes of MEAS-FRANCE/HUMIREL including vibration, shock, storage, high temperature and humidity, ESD.• Additional tests under harsh chemical conditions demonstrate good operation in presence of salt atmosphere, SO2 (0.5%, H2S (0.5%), 03, NOx, NO, CO, CO2, Softener, Soap, Toluene, acids (H2SO4, HNO3, HCI), HMDS, Insecticide, Cigarette smoke, this is not an exhaustive list. • HM1500LF is not light sensitive.SPECIFIC PRECAUTIONS• HM1500LF is protected against reversed polarity.•If you wish to use HM1500LF in a chemical atmosphere not listed above, consult us.()05.023×−+=T RHRH actualatTcompensaedPACKAGE OUTLINEORDERING INFORMATIONHPP805A031 (MULTIPLE PACKAGE QUANTITY OF 10 PIECES)HM1500LF – HUMIDITY ANALOG VOLTAGE OUTPUTSample kit of HM1500LF is available through MEAS-FRANCE/Humirel web site:Customer Service contact details Measurement Specialties, Inc. 105 av. du Général Eisenhower BP 23705 31037 TOULOUSE CEDEX 1FRANCETél: +33 (0) 561 194 848 Fax:+33 (0) 561 194 553Sales: ****************************DimMin (mm) Max (mm) A 9.75 10.25 B 4.00 4.50 C 53 55 D 10.9 11.4 E*200250Wire Color Function W1 White Ground W2 Blue Supply VoltageW3YellowHumidity Output Voltage* Specific lenght available on requestDateC Power supply ramp up time specification added C.EISMANN September 06 DHPP Number updated, RoHS logo addedD. LE GALL September 07 EStandardized datasheet format and Current consumption lowering updatedD. LE GALLApril 08The information in this sheet has been carefully reviewed and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Furthermore, this information does not convey to the purchaser of such devices any license under the patent rights to the manufacturer. Measurement Specialties, Inc. reserves the right to make changes without further notice to any product herein. Measurement Specialties, Inc. makes no warranty, representation or guarantee regarding the suitability of its product for any particular purpose, nor does Measurement Specialties, Inc. assume any liability arising out of the application or use of any product or circuit and specifically disclaims any and all liability, including without limitation consequential or incidental damages. Typical parameters can and do vary in different applications. All operating parameters must be validated for each customer application by customer’s technical experts. Measurement Specialties, Inc. does not convey any license under its patent rights nor the rights of others.。
米尔100 用户手册 (zh)说明书
用户指南(zh) 06/2019v.1.3版权和免责声明保留所有权利。
未经Mobile Industrial Robots A/S(MiR)明示书面许可，禁止以任何形式复制本手册任何内容。
MiR对于本文档或其内容，不做任何明示或暗示保证。
此外，本文档内容如有修改，恕不先行通知。
在准备本文档时，已采取一切预防措施。
然而，MiR对于其中的错误、遗漏、或因使用所含信息引起的任何损失不承担任何责任。
版权所有©2019，Mobile Industrial Robots A/S。
联系制造商：Mobile Industrial Robots A/SEmil Neckelmanns Vej15FDK-5220Odense SØ电话：+4520377577电子邮件：**********************CVR：35251235目录1.关于本文档51.1.如何获取更多信息51.2.文档历史62.安全72.1.安全消息类型72.2.一般安全注意事项72.3.可预见误用92.4.风险评估2.5.剩余风险2.6.安全相关的功能和接口112.7.安全相关的限制功能2.8.锂电池123.开始使用3.1.随箱物品3.2.开箱MiR100144.调试164.1.通电164.2.连接机器人界面204.3.在手动模式下驾驶机器人214.4.检查硬件状态234.5.机器人充电234.6.关停机器人265.产品介绍5.1.MiR100的主要特性275.2.识别标签285.3.MiR100外部零件5.4.MiR100内部零件5.5.传感器系统315.6.灯光指示器376.维护38 6.1.每周定期检查和维护任务38 6.2.定期检查和更换396.3.包装运输7.应用437.1.安装顶部模块438.有效载荷规格459.接口规格9.1.应用接口9.2.急停4710.更新MiR100软件491.关于本文档本文档包含以下信息：•如何启动和操作MiR100。
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促进剂 ACCELERATOR 131
磷化配套
中和剂 GRANO STARTER 65
磷化配套
25KG 25KG 25K G 25KG 25KG 25KG 25KG 25KG 35KG 35KG 25KG 35KG 35KG 25KG 25KG 25KG 25KG 25KG
袋式除尘器型号
280
96-2×9
121000
168
1728
315
96-2×10
134500
1868
1920
350
128-6
67300
1770
<1300
125
128-9
100900
1402
1152
196
128-10
112100
1558
1280
2053
128-2×6
34600
1869
1536
323
128-2×7
291600
4050
3328
337
128-2×14
314000
4361
3584
352
HCMC型低压长袋脉冲袋式除尘器技术参数：
型号
处理风量m3
总过滤面积㎡
室数个
风速m/min
滤袋规格φ×L
清灰压力Mpa
YLC84-5
61500～73806
61200～79344
1230
6
YLC 84-7
77160～92592
1435
7
YLC 84-8
98400～118080
1640
8
YLC 84-2×4
98400～118080
1640
8
YLC 84-2×5
123000～147600
2050
10
YLC 84-2×6
147600～165888
2460
12
YLC 84-2×7
172200～186624
157000
2181
1792
247
H100I中文资料
Key Features:• 1W Output Power• Miniature MiniDIP Case • 3,000 VDC Isolation• Complies to RFI Standards • >2 MHour MTBF• 18 Standard Models• Industry Standard Pin-OutH100I Ultra-Miniature MiniDIP 1W, High Isolation DC/DC Con v ert ersSeriesNew Models!!InputParameterConditionsMin.Typ.Max.UnitsInput Voltage Range 5 VDC Input4.55.0 5.5VDC 12 VDC Input 10.812.013.224 VDC Input21.624.026.4Input FilterInternal CapacitorReverse Polarity Input Current0.3A OutputParameterConditionsMin.Typ.Max.Units Output Voltage Accuracy ±1.0±3.0%Line Regulation For Vin Change of 1%±1.2±1.5%Load Regulation Iout = 20% to 100%±8.0%Ripple & Noise (20 MHz)100mV P - P Output Power Protection 120%Temperature Coeffi cient ±0.01±0.02%/ºC Output Short CircuitMomentary (0.5 Sec.)GeneralParameter ConditionsMin.Typ.Max.Units Isolation Voltage 60 Seconds 3,000VDC Isolation Resistance 500 VDC 1,000M ΩIsolation Capacitance 100 kHz, 1V60100pF Switching Frequency 80kHzEMI/RFIEN55022 A, EN55024 A, IEC 61000-4-2, IEC 61000-4-3, FCC 47 CFR Part 15 B EnvironmentalParameterConditionsMin.Typ.Max.UnitsOperating Temperature Range -40+25+85ºCOperating Temperature Range Case+100ºCStorage Temperature Range -40+125ºCCoolingFree Air ConvectionHumidityRH, Non-condensing95%PhysicalCase Size 0.50 x 0.40 x 0.27 Inches (12.70 x 10.16 x 6.85 mm)Case Material Non-Conductive Black Plastic (UL94-V0)Weight0.06 Oz (1.8g)Reliability Specifi cationsParameter ConditionsMin.Typ.Max.Units MTBFMIL HDBK 217F , 25ºC, Gnd Benign 2.0MHours Absolute Maximum RatingsParameterConditionsMin.Typ.Max.UnitsInput Voltage Surge (1 Sec) 5 VDC Input-0.77.0VDC12 VDC Input -0.715.024 VDC Input-0.728.0Lead Temperature 1.5 mm From Case For 10 Sec260ºC Internal Power DissipationAll Models450mW Caution: Exceeding Absolute Maximum Ratings may damage the module. These are not continuous operating ratings.MicroPower Direct292 Page StreetSte DStoughton, MA 02072USAT: (781) 344-8226F: (781) 344-8481E: sales@ W: RoHS CompliantElectrical Specifi cationsSpecifi cations typical @ +25°C, nominal input voltage & rated output current, unless otherwise noted. Specifi cations subject to change without notice.Notes:1. Output load regulation is specifi ed for a load change of 20% to 100%.2. When measuring output ripple, it is recommended that an external 0.33 µF ceramic capacitor be placed from the +Vout pin to the -Vout pin.3. O peration at no-load will not damage these units. How-ever, they may not meet all specifi cations.4. The 5V, 12V and 24V input units do not require external components to operate, but the use of a low ESR capaci-tor (approximately 10 u F , ESR <1.0Ω at 100 kHz) mounted close to the converter input pins is recommended.For 48 VDC input units, an input capacitor should always be used. Dependent upon the application, a value between 4.7 µF and 47 u F should be suffi cient.5. It is recommended that a fuse be used on the input of a power s upply for protection. See the table above for the correct rating.Model Selection GuideNotes:• All dimensions are typical in inches (mm)• Tolerance x.xx = ±0.01 (±0.25)• Pin 1 is marked by a “dot” or indentation on the top of the unitMechanical DimensionsPin ConnectionsModel Number InputOutput Effi ciency (%, Typ)Fuse Rating Slow-Blow(mA)Voltage (VDC)Current (mA)Voltage(VDC)Current (mA, Max)Current (mA, Min)Nominal RangeFull-Load No-Load H101I 5 4.5 - 5.527825 3.3300.0 5.072500H102I 5 4.5 - 5.526725 5.0200.0 4.075500H103I 5 4.5 - 5.5260259.0111.0 2.077500H104I 5 4.5 - 5.52562512.083.3 2.078500H105I 5 4.5 - 5.52572515.066.6 2.078500H106I 5 4.5 - 5.52572524.041.6 2.078500H111I 1210.8 - 13.211616 3.3300.0 5.072200H112I 1210.8 - 13.211216 5.0200.0 4.075200H113I 1210.8 - 13.2109169.0111.0 2.077200H114I 1210.8 - 13.21071612.083.3 2.078200H115I 1210.8 - 13.21071615.066.6 2.078200H116I 1210.8 - 13.21071624.041.6 2.078200H121I 2421.6 - 26.4588 3.3300.0 5.072100H122I 2421.6 - 26.4568 5.0200.0 4.075100H123I 2421.6 - 26.45589.0111.0 2.077100H124I 2421.6 - 26.454812.083.3 2.078100H125I 2421.6 - 26.454815.066.6 2.078100H126I2421.6 - 26.454824.041.62.078100Pin Function 1-Vin 4+Vin 5+Vout 7-Vout(µF Max)220Capacitive LoadOther outputs are available.Contact the factory for details at: sales@MicroPower Direct292 Page Street Ste D Stoughton, MA 02072 • TEL: (781) 344-8226 • FAX: (781) 344-8481 • E-Mail: sales@Derating Curve。
454FTB系列100525中文版
应用场合
■ 工业气体的流量测量 ■ 美国EPA（环保局）颁布的大气污染法规中烟道气的流量测量 ■ 通风空气流量和化解过程中废气流量测量 ■ 溶剂回收系统流量测量 ■ 水泥厂生产过程中气体流量测量 ■ 压缩空气流量测量 ■ 半导体工艺气体测量 ■ 美国能源部空气取 样
■ 助燃气体流量测量 ■ 火炬气流量测量 ■ 焚烧炉烟气流量测量 ■ VOC烟道气流量测量 ■ 燃煤锅炉中助燃空气流量测量 ■ 天然气和大多数的工业气体流量测量 ■ 核电站 ■ O.E.M.应用
传感器材质：
标准配置： 哈氏合金C-276； 可选配： (1) 哈氏合金C-276材质传感器上涂氮化铬，更加耐磨损 (2) 在哈氏合金C-276传感器和传感器支撑杆上涂PTFE，耐腐蚀 但涂PTFE的HHT传感器：最高温度260℃
传感器支撑杆材质
316L 不锈钢, 可选配哈氏合金C-276；
重复性： 0.25% 流速响应时间：
气体标定
用户可选择实验室标定或相关气体标定。Kurz（S） 400D 型 NIST 可追踪风洞测量仪可用于空气标定。
传感器的保护
6
454FTB 的电路包括防止因传感器，电线或器件损坏而造成温度过高现象的保护电路。在零流量时，我们的传感器不会过热， 这与大部分竞争对手的设备不同，这是因为我们有与众不同的恒温传感器的控制方法和功率限制设计。
对于每种质量流量计型号pn编号和每种气体类型的基准流速v是指在标准状态下的最大流速方程式气体类型drp方程式drp10空气氮气氧气氩气1059drp12drp1353drp18drp30drp1000基本代码表使用定义说明方程式drppppsxtstp方程式在表2中所列的基准流速sfpm英制单位nmps公制单位vpht高温工作型号40hht超高温工作型号40fd2快速双铠装全焊接结构速度和温度传感器直径0105传感器探头ni无火花型atexcsa认证xpfp防爆隔爆型csa和atex认证ta一体型传感器和变送器于一体ts分体型传感器和变送器分别独立安装间距可调气体组号和气体类型气体组号气体类型氢气11vmax对于某种工艺条件下特定气体的最大流速流量因子ts标准绝对温度537r77f460英制单位
HMBTA94中文资料
Page No. : 1/3HMBTA94PNP EPITAXIAL PLANAR TRANSISTORDescriptionThe HMBTA94 is designed for application that requires high voltage.Features• High Breakdown Voltage: VCEO=400(Min.) at IC=1mA • Complementary to HMBTA44Absolute Maximum Ratings• Maximum TemperaturesStorage Temperature............................................................................................ -55 ~ +150 °C Junction Temperature.................................................................................... +150 °C Maximum • Maximum Power DissipationTotal Power Dissipation (Ta=25°C)................................................................................ 350 mW • Maximum Voltages and Currents (Ta=25°C)VCBO Collector to Base Voltage...................................................................................... -400 V VCEO Collector to Emitter Voltage................................................................................... -400 V VEBO Emitter to Base Voltage............................................................................................. -6 V IC Collector Current ...................................................................................................... -150 mACharacteristics (Ta=25°C)Symbol Min.Typ.Max.Unit Test ConditionsBVCBO -400--V IC=-100uA, IE=0BVCEO -400--VIC=-1mA, IB=0BVEBO -6--V IE=-10uA, IC=0ICBO ---100nA VCB=-400V, IE=0IEBO ---100nA VEB=-6V, IC=0ICES ---500nA VCE=-400V, VBE=0*VCE(sat)1---200mV IC=-1mA, IB=-0.1mA *VCE(sat)2---300mV IC=-10mA, IB=-1mA *VCE(sat)3---600mV IC=-50mA, IB=-5mA *VBE(sat)---900mVIC=-10mA, IB=-1mA *hFE150--VCE=-10V, IC=-1mA *hFE275-200VCE=-10V, IC=-10mA *hFE360--VCE=-10V, IC=-50mA *hFE440--VCE=-10V, IC=-100mA Cob-46pFVCE=-10V, f=1MHz*Pulse Test: Pulse Width ≤380us, Duty Cycle ≤2%Page No. : 2/3Characteristics CurvePage No. : 3/3SOT-23 Dimension*: TypicalInches MillimetersInches MillimetersDIM Min.Max.Min.Max.DIM Min.Max.Min.Max.A 0.11020.1204 2.80 3.04J0.00340.00700.0850.177B 0.04720.0630 1.20 1.60K 0.01280.02660.320.67C 0.03350.05120.89 1.30L 0.03350.04530.851.15D 0.01180.01970.300.50S 0.08300.10832.10 2.75G 0.06690.0910 1.70 2.30V0.00980.02560.250.65H0.00050.00400.0130.10Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997.2.Controlling dimension: millimeters.3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material.4.If there is any question with packing specification or packing method, please contact your local HSMC sales office.Material:• Lead: 42 Alloy; solder plating• Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0Important Notice:• All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC.• HSMC reserves the right to make changes to its products without notice.• HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.• HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.Head Office And Factory:• Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C.Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454• Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931。
hme062r规格书
hme062r规格书英文回答：The HME062R specification sheet provides detailed information about the specifications and features of the HME062R product. It is a comprehensive document that outlines the technical specifications, performance characteristics, and operational parameters of the product.The specification sheet includes information such as the dimensions and weight of the product, the power requirements, and the operating temperature range. It also provides details about the input and output interfaces, the communication protocols supported, and any additional features or options available.For example, the specification sheet may mention that the HME062R has a compact design with dimensions of 10cm x 15cm x 5cm and weighs 500 grams. It may also state that it operates on a 12V power supply and has an operatingtemperature range of -20°C to 70°C.Furthermore, the specification sheet may highlight the product's performance characteristics, such as its processing speed, memory capacity, and data transfer rate.It may also provide details about the supported operating systems and software compatibility.Additionally, the specification sheet may outline any certifications or compliance standards that the product meets, such as ISO 9001 or CE. It may also mention any warranties or support services provided by the manufacturer.In conclusion, the HME062R specification sheet is a valuable resource for understanding the technical specifications and features of the product. It provides detailed information about the product's dimensions, power requirements, operating temperature range, performance characteristics, and additional features. It is essentialfor potential buyers or users to refer to the specification sheet to ensure that the product meets their specific requirements.中文回答：HME062R规格书提供了关于HME062R产品的详细规格和特性信息。