MAX3301EETJ中文资料

合集下载

MAX3221EEUE+中文资料

-40°C to +85°C 20 Plastic DIP -40°C to +85°C 20 SSOP -40°C to +85°C 20 TSSOP
Applications
Notebook, Subnotebook, and Palmtop Computers Cellular Phones Battery-Powered Equipment Handheld Equipment Peripherals Printers
20 Thin QFN-EP* -40°C to +85°C T2055-5 (5mm x 5mm)
* Exposed paddle. Ordering Information continued at end of data sheet.
Selector Guide
PART MAX3221E NO. OF DRIVERS/ RECEIVERS 1/1 2/2 3/5 VCC RANGE (V) +3.0 to +5.5 +3.0 to +5.5 +3.0 to +5.5 AutoShutdown ✔ ✔ ✔
元器件交易网
±15kV ESD-Protected, 1µA, 3.0V to 5.5V, 250kbps, RS-232 Transceivers with AutoShutdown MAX3221E/MAX3223E/MAX3243E
ABSOLUTE MAXIMUM RATINGS
VCC to GND ..............................................................-0.3V to +6V V+ to GND (Note 1) ..................................................-0.3V to +7V V- to GND (Note 1) ...................................................+0.3V to -7V V+ + |V-| (Note 1) .................................................................+13V Input Voltages T_IN, EN, FORCEON, FORCEOFF to GND ............-0.3V to +6V R_IN to GND ......................................................................±25V Output Voltages T_OUT to GND................................................................±13.2V R_OUT, R2OUTB, INVALID to GND .........-0.3V to (VCC + 0.3V) Short-Circuit Duration T_OUT to GND .........................................................Continuous Continuous Power Dissipation (TA = +70°C) 16-Pin SSOP (derate 7.14mW/°C above +70°C) ...........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C) ........754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C) ......1666.7mW 20-Pin Plastic DIP (derate 11.11mW/°C above +70°C)....889mW 20-Pin SSOP (derate 8.00mW/°C above +70°C) ...........640mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C) .........879mW 20-Pin TQFN (derate 21.3mW/°C above +70°C) ......1702.1mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)............762mW 28-Pin TSSOP (derate 12.8mW/°C above +70°C) .......1026mW Operating Temperature Ranges MAX32_ _EC_ _ ....................................................0°C to +70°C MAX32_ _EE_ _..................................................-40°C to +85°C Storage Temperature Range .............................-65°C to +160°C Lead Temperature (soldering, 10s) .................................+300°C

MAX3222E中文材料

MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E为+3.0V供电的EIA/TIA-232和V.28/V.24通信接口芯片，具有低功耗、高数据速率、增强型ESD保护等特性。

增强型ESD结构为所有发送器输出和接收器输入提供保护，可承受±15kV IEC 1000-4-2气隙放电、±8kV IEC 1000-4-2接触放电(MAX3246E为±9kV)和±15kV人体放电模式。

MAX3237E的逻辑引脚及接收器I/O引脚均提供上述保护，而它的发送器输出引脚提供±15kV人体放电模式的保护。

采用专有的低压差发送输出级，+3.0V至+5.5V供电时利用内部双电荷泵提供真正的RS-232性能。

工作于+3.3V电源时，荷泵仅需要四个0.1µF的小电容。

每款器件保证在250kbps数据速率下维持RS-232输出电平。

MAX3237E确保标准工作模式下提供250kbps的数据速率、在MegaBaud™工作模式下速率高达1Mbps。

MAX3222E/MAX3232E包括两个发送器和两个接收器；MAX3222E具有1µA关断模式，可降低电池供电便携式系统的功耗。

关断模式下，MAX3222E接收器仍保持有效状态，允许监视外设，而且仅消耗1µA的电源电流。

MAX3222E和MAX3232E的引脚、封装和功能分别兼容于工业标准的MAX242和MAX232。

MAX3241E/MAX3246E提供完备的串口(3个驱动器/5个接收器)，专为笔记本电脑和亚笔记本电脑设计。

MAX3237E (5个驱动器/3个接收器)非常适合要求高速数据传输的外围设备。

这些器件都具有关断模式，此模式下所有接收器仍保持有效状态，而且仅消耗1µA (MAX3241E/MAX3246E)或10nA (MAX3237E)的电流。

MAX3222E、MAX3232E和MAX3241E都具有节省空间的SO、SSOP、TQFN及TSSOP封装，MAX3237E提供SSOP封装，MAX3246E提供超小型6 x 6 UCSP™封装。

MAX3030EEUE+T中文资料

MAX3032E) o Slew-Rate-Controlled 2Mbps Data Rate
(MAX3031E, MAX3033E) o Available in 16-Pin TSSOP and Narrow SO
Packages o Low-Power Design (<330µW, VCC = 3.3V Static) o +3.3V Operation o Industry-Standard Pinout o Thermal Shutdown
DC ELECTRICAL CHARACTERISTICS
(3V ≤ VCC ≤ 3.6V, TA = TMIN to TMAX, unless otherwise noted. Typical values are at VCC = +3.3V and TA = +25°C.) (Note 1)
PARAMETER DRIVER OUTPUT: DO_+, DO_-
元器件交易网
MAX3030E–MAX3033E
±15kV ESD-Protected, 3.3V Quad RS-422 Transmitters
ABSOLUTE MAXIMUM RATINGS
(All Voltages Are Referenced to Device Ground, Unless Otherwise Noted) VCC ........................................................................................+6V EN1&2, EN3&4, EN, EN............................................-0.3V to +6V DI_ ............................................................................-0.3V to +6V DO_+, DO_- (normal condition) .................-0.3V to (VCC + 0.3V) DO_+, DO_- (power-off or three-state condition).....-0.3V to +6V Driver Output Current per Pin.........................................±150mA

x3301使用手册

使用说明书
95-8527
Protect•ir Multispectrum IR Flame Detector X3301 型多频谱红外保护红外火焰探测器
电子探测器公司
6901 110号街西 • 明尼阿波利斯市, 明尼苏达州 55438 美国电话: 952.941.5665 or 800.765.3473 • 传真: 952.829.8750
磁力聚光检测时要放一块磁体在探测器外测标示的位置上（磁力oi）。手动聚光检测进行时需要通过一个外部开关把聚光oi接线（22号接线口）与电源阴极相连。这就是把探测器设置在特殊的运行模式。必须让磁体或开关在适当的位置上维持至少 6 秒钟。两种方法都可启动校准用红外发射器。如果最终的信号符合检测标准，就表明，探测器还有一半以上的探测范围，报警继电器改变状态，使发光二极管变为红色，4－ 20 毫安电流设备的输出为20毫安。这种状态一直保持到拿掉磁体或断开开关。如果报警继电器设定为非锁定操作，它就会改变状态，发光二极管的红色就会变成绿色。如果该单元采用的是锁定继电器，就要通过断开输入电源（至少0.1秒钟）或采用瞬时性利用磁体或手动聚光oi开关的办法让这些继电器复位。
磁力聚光/手动聚光
X3301型火焰探测器同时兼有磁力聚光及手动聚光两项功能，可进行与自动聚光检测同等的校准工作，并可启动报警继电器，验证检测输出设备运行情况，以满足预防性维护需求。上述功能可随时开启，不需任何非校准性的外部检测灯。
小心上述检测要求所有灭火装置上均设有旁路，以避免成功检测后得不到结果。

MAX3032EEUE+中文资料

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
MAX3030E/ MAX3031E
16 VCC 15 DI4 14 DO4+ 13 DO412 EN 11 DO310 DO3+ 9 DI3
TSSOP/SO
DI1 1 DO1+ 2 DO1- 3 EN1&2 4 DO2- 5 DO2+ 6
DI2 7 GND 8
MAX3032E/ MAX3033E
16 VCC 15 DI4 14 DO4+ 13 DO412 EN3&4 11 DO310 DO3+ 9 DI3
Ordering Information
ቤተ መጻሕፍቲ ባይዱ
TEMP RANGE 0°C to +70°C 0°C to +70°C
-40°C to +85°C -40°C to +85°C

伊玛产品类别

四线
18~36 VDC
PNP NO/NC,NPN NO/NC
4~20 mA,0~10 V
可
PA1108
智慧型
7 LED
内螺纹
G 1/4
400 bar
四线
18~36 VDC
PNP NO/NC,NPN NO/NC
4~20 mA,0~10 V
可
PA1109
智慧型
7 LED
内螺纹
G 1/4
2 bar
四线
18~36 VDC
200
60
M12
接插件
N
Y
N
IP67
否
IA0031
齐平
brass
10~36VDC
1
两线
NO
DC PNP/NPN
200
60
M12
接插件
N
Y
N
IP67
否
IA0032
齐平
brass
10~36VDC
1
两线
NC
DC PNP/NPN
200
60
M12
接插件
N
Y
N
IP67
否
IA0033
非齐平
brass
10~36VDC
可
TA1099
智慧型
7 LED
内螺纹
M18 X 1.5
-40~150°C
四线
20~30 VDC
PNP NO/NC,NPN NO/NC
4~20 mA,0~10 V
可
产品类别
压力变送器(模拟量输出)
压力变送器(开关量输出)
订货号
功能
显示
牙口形式

hrs3301规格书

HRS3301规格书1. 引言本规格书旨在详细描述HRS3301产品的技术规格、功能特性、性能指标和使用要求。

HRS3301是一款先进的人力资源管理系统，旨在提高企业的人力资源管理效率和员工工作满意度。

2. 技术规格2.1 硬件要求•处理器：至少双核处理器，主频不低于2GHz•内存：至少4GB RAM•存储空间：至少100GB可用空间•显示器：分辨率不低于1280x800，支持彩色显示•网络连接：支持有线或无线网络连接2.2 软件要求•操作系统：Windows 10或更高版本，macOS 10.13或更高版本，Linux发行版（如Ubuntu、CentOS）等•数据库：MySQL、Oracle等关系型数据库•浏览器：推荐使用最新版本的Google Chrome、Mozilla Firefox等现代浏览器2.3 安全性要求HRS3301采用严格的安全措施来保护用户数据和系统安全。

以下是一些安全性要求：•用户认证：支持多种认证方式，如用户名密码登录、指纹识别等。

•数据加密：对用户数据进行加密存储和传输，保护数据的安全性。

•权限管理：提供灵活的权限管理机制，确保只有授权人员能够访问敏感信息。

•防止攻击：采用防火墙、入侵检测系统等技术来防止网络攻击。

3. 功能特性3.1 员工信息管理HRS3301提供了全面的员工信息管理功能，包括员工档案、个人信息、职务调动、薪资福利等。

具体功能如下：•员工档案：记录员工基本信息、入职日期、离职日期等。

•个人信息：记录员工的个人联系方式、紧急联系人、身份证号码等。

•职务调动：支持对员工的职务变动进行记录和管理。

•薪资福利：管理员工的薪资核算、绩效考核和福利发放。

3.2 招聘与招聘HRS3301提供招聘与招聘流程的自动化支持，包括发布岗位需求、简历筛选、面试安排等。

具体功能如下：•岗位发布：支持发布岗位需求，并将需求自动推送到各大招聘网站。

•简历筛选：根据设定的条件自动筛选简历，并生成候选人列表。

温度传感器

温度传感器在带式输送机温度保护中，通过温度传感器，对带式输送机的滚筒及轴承或环境温度进行监控。

当监视点的温度高于规定值时，系统报警并驱动洒水装置的电磁阀实现超温洒水。

由于滚筒和胶带的摩擦作用，当滚筒温度过高时，会使胶带燃着。

因此，要监测滚筒温度，当温度达到一定值时报警。

温度传感器从使用上可分为接触式和非接触式两大类，接触式目前使用较为广泛，而非接触式测量是通过检测被测物体所发出的红外线，来达到测温的日的。

被测对象是一直转动的滚筒表面，接触式温度传感器测量起来误差太大，响应时间太长，温度变化的传递完全依靠空气为介质进行热交换，因而采用接触式测量不适用于设计。

因此，选用了矿用木质安全型AMK1-MID3301非接触式红外温度传感器。

此型号温度传感器适合于煤矿井下非接触式测温的要求，为矿井的测温工作作提供了操作自如、工作方便的检测仪器。

矿用红外测温仪体积小，重量轻，坚固、耐用，只需对准目标，扣动扳机，不到一秒钟即可读取物体表面温度，无需接触，即可安全测量热的、危险的或难以接触的物体的表面温度。

将检测到的红外温度与设定值比较，当温度大于设定值时，则发出报警指令，同时启动洒水阀洒水降温。

它具有响应速度快，测量精度高，安装维护简便等特点。

图2.10 AMK1—MID3301 红外温度传感器（1）主要技术参数传感器的工作电压：DC 15—28V，工作电流：15mA；温度测量范围：-32~535℃；测温精度：小于100℃时，误差不大于±2℃；大于100℃时，误差不大于±2%的读数。

(最高可达±1℃或±1%)；响应时间：不大于500ms；显示：带背景光的液晶屏显示；功能：具有高、低温报警，具有最大值/最小值/平均值/差值显示，具有数据存储，具有扳机锁定；重量和尺寸：320g，20016055mm；防爆标志：ExibI(+150℃)。

（2）工作原理红外测温仪测量物体表面温度时，测温仪的光学元件将物体所辐射的能量会聚到红外探测器上，测温仪的电子元件将此信息转换成温度数值，并显示在测温仪的显示屏上。

MAX4613EEE+中文资料

________________General DescriptionThe MAX4613 quad analog switch features on-resis-tance matching (4Ωmax) between switches and guar-antees on-resistance flatness over the signal range (9Ωmax). This low on-resistance switch conducts equally well in either direction. It guarantees low charge injec-tion (10pC max), low power consumption (35µW max),and an electrostatic discharge (ESD) tolerance of 2000V minimum per Method 3015.7. The new design offers lower off-leakage current over temperature (less than 5nA at +85°C).The MAX4613 quad, single-pole/single-throw (SPST)analog switch has two normally closed switches and two normally open switches. Switching times are less than 250ns for t ON and less than 70ns for t OFF .Operation is from a single +4.5V to +40V supply or bipolar ±4.5V to ±20V supplies.________________________ApplicationsSample-and-Hold Circuits Communication Systems Test Equipment Battery-Operated Systems Heads-Up DisplaysPBX, PABXGuidance and Control Systems Audio Signal Routing Military RadiosModems/Faxes____________________________Features♦Pin Compatible with Industry-Standard DG213♦Guaranteed R ON Match Between Channels (4Ωmax)♦Guaranteed R FLAT(ON)Over Signal Range (9Ωmax)♦Guaranteed Charge Injection (10pC max)♦Low Off-Leakage Current Over Temperature (<5nA at +85°C) ♦Withstands 2000V min ESD, per Method 3015.7♦Low R DS(ON)(85Ωmax)♦Single-Supply Operation +4.5V to +40V Bipolar-Supply Operation ±4.5V to ±20V ♦Low Power Consumption (35µW max)♦Rail-to-Rail Signal Handling ♦TTL/CMOS-Logic CompatibleMAX4613Quad, SPST Analog Switch________________________________________________________________Maxim Integrated Products 119-1362; Rev 3; 6/07________________Ordering InformationPin Configurations/___Functional Diagrams/TruthTable*Contact factory for dice specifications.**Contact factory for availability.***EP = Exposed PadFor pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .M A X 4613Quad, SPST Analog SwitchABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS—Dual Supplies(V+ = 15V, V- = -15V, V L = 5V, GND = 0V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted.)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Referenced to GNDV+......................................................................................+44V V-.........................................................................................-44V V+ to V-..............................................................................+44V V L ...................................................(GND - 0.3V) to (V+ + 0.3V)Digital Inputs V S_V D_ (Note 1)...................(V- - 2V) to (V+ + 2V)or 30mA (whichever occurs first)Continuous Current (any terminal)......................................30mA Peak Current, S_ or D_(pulsed at 1ms, 10% duty cycle max)...........................100mAContinuous Power Dissipation (T A = +70°C)Plastic DIP (derate 10.53mW/°C above +70°C).............842mW Narrow SO (derate 8.70mW/°C above +70°C).............696mW QSOP (derate 8.3mW/°C above +70°C).......................667mW Thin QFN (derate 33.3mW/°C above +70°C)..............2667mW TSSOP (derate 6.7mW/°C above +70°C).....................457mW Operating Temperature RangesMAX4613C_ _......................................................0°C to +70°C MAX4613E_ _...................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +165°C Lead Temperature (soldering, 10sec).............................+300°CNote 1:Signals on S_, D_, or IN_ exceeding V+ or V- are clamped by internal diodes. Limit forward current to maximum current rating.MAX4613Quad, SPST Analog Switch_______________________________________________________________________________________3ELECTRICAL CHARACTERISTICS—Dual Supplies (continued)(V+ = 15V, V- = -15V, V L = 5V, GND = 0V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted.)ELECTRICAL CHARACTERISTICS—Single Supply(V+ = 12V, V- = 0V, V L = 5V, GND = 0V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted.)M A X 4613Quad, SPST Analog Switch 4_______________________________________________________________________________________ELECTRICAL CHARACTERISTICS—Single Supply (continued)(V+ = 12V, V- = 0, V L = 5V, GND = 0V, V INH = 2.4V, V INL = 0.8V, T A = T MIN to T MAX , unless otherwise noted.)Note 2:Typical values are for design aid only,are not guaranteed and are not subject to production testing. The algebraic convention,where the most negative value is a minimum and the most positive value a maximum, is used in this data sheet.Note 3:Guaranteed by design.Note 4:On-resistance match between channels and flatness are guaranteed only with bipolar-supply operation. Flatness is definedas the difference between the maximum and the minimum value of on-resistance as measured at the extremes of the speci-fied analog signal range.Note 5:Leakage parameters I S(OFF), I D(OFF), I D(ON), and I S(ON)are 100% tested at the maximum rated hot temperature and guaranteed at +25°C.Note 6:Off-Isolation Rejection Ratio = 20log (V D /V S ).Note 7:Between any two switches.__________________________________________Typical Operating Characteristics(T A = +25°C, unless otherwise noted.)O N L E A K A G E (n A )-2-112-15015V S , V D (V)-10-5510ON LEAKAGE CURRENTSO F F L E A K A G E (n A )-1-0.50.51V S , V D (V)-15015-10-5510OFF LEAKAGE CURRENTSV I N (V )0.51.52.02.53.03.5±5±10±15±20BIPOLAR SUPPLY VOLTAGE (V)SWITCHING THRESHOLD vs. BIPOLAR SUPPLY VOLTAGE02550751001255101520V D (V)R D S (O N ) (Ω)150ON-RESISTANCE vs. V D (UNIPOLAR SUPPLY VOLTAGE)R D S (O N ) (Ω)306090120-20-1001020V D (V)0ON-RESISTANCE vs. V D (BIPOLAR SUPPLY VOLTAGE)R D S (O N ) (Ω)020406080100V D (V)-15015-10-5510ON-RESISTANCE vs. V D (BIPOLAR SUPPLY VOLTAGE AND TEMPERATURE)MAX4613Quad, SPST Analog Switch_______________________________________________________________________________________5_____________________________Typical Operating Characteristics (continued)(T A = +25°C, unless otherwise noted.)255075100125150R D S (O N ) (Ω)4812V D (V)ON-RESISTANCE vs. V D (UNIPOLAR SUPPLY VOLTAGE AND TEMPERATURE)T I M E (n s )4080120160±5±10±15±20BIPOLAR SUPPLY VOLTAGE (V)SWITCHING TIME vs. BIPOLAR SUPPLY VOLTAGET I M E (n s )05010015020010152025UNIPOLAR SUPPLY VOLTAGE (V)SWITCHING TIME vs. UNIPOLAR SUPPLY VOLTAGEQ (p C )-200-102010-15-1001015V D (V)CHARGE INJECTION vs.V D VOLTAGEQ (p C )-105-551015V D (V)10CHARGE INJECTION vs.V D VOLTAGEM A X 4613Applications InformationGeneral Operation1)Switches are open when power is off.2)I N_, D_, and S_ should not exceed V+ or V-, even with the power off.3)Switch leakage is from each analog switch terminal to V+ or V-, not to other switch terminals.Operation with Supply VoltagesOther than ±15VUsing supply voltages less than ±15V will reduce the analog signal range. The MAX4613 operates with ±4.5V to ±20V bipolar supplies or with a +4.5V to +40V single supply; connect V- to GND when operating with a single supply. Also, all device types can operate with unbalanced supplies such as +24V and -5V. V L must be connected to +5V to be TTL compatible, or to V+ for CMOS-logic level inputs. The Typical Operating Characteristics graphs show typical on-resistance with ±20V, ±15V, ±10V, and ±5V supplies. (Switching times increase by a factor of two or more for operation at ±5V.)Overvoltage ProtectionProper power-supply sequencing is recommended for all CMOS devices. Do not exceed the absolute maximum ratings because stresses beyond the list-ed ratings may cause permanent damage to the devices. Always sequence V+ on first, followed byV L , V-, and logic inputs. If power-supply sequencing is not possible, add two small, external signal diodes in series with supply pins for overvoltage protection (Figure 1). Adding diodes reduces the analog signal range to 1V below V+ and 1V above V-, but low switch resistance and low leakage char-acteristics are unaffected. Device operation is unchanged, and the difference between V+ and V-should not exceed +44V.Quad, SPST Analog Switch 6_______________________________________________________________________________________Figure 1. Overvoltage Protection Using External Blocking DiodesMAX4613Quad, SPST Analog Switch_______________________________________________________________________________________7Figure 2. Switching TimeFigure 3. Break-Before-Make Test CircuitTiming Diagrams/Test Circuits____________________Revision HistoryPages changed at Rev 3: 1, 9, 10M A X 4613Quad, SPST Analog Switch 8________________________________________________________________________________________________________________________Timing Diagrams/Test Circuits (continued)Figure 5. Off-Isolation Rejection RatioFigure 6. CrosstalkFigure 7. Source/Drain-Off CapacitanceFigure 8. Source/Drain-On CapacitanceMAX4613Quad, SPST Analog Switch_______________________________________________________________________________________9Pin Configurations (continued)Package Information(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)M A X 4613Quad, SPST Analog Switch Maxim cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim product. No circuit patent licenses are implied. Maxim reserves the right to change the circuitry and specifications without notice at any time.10____________________Maxim Integrated Products, 120 San Gabriel Drive, Sunnyvale, CA 94086 408-737-7600©2007 Maxim Integrated Productsis a registered trademark of Maxim Integrated Products.Package Information (continued)(The package drawing(s) in this data sheet may not reflect the most current specifications. For the latest package outline information go to /packages .)。

威斯丹利智能家庭中控网关说明书

-6-
扫扫码码关关注注公公众众号号
广州市威士丹利智能科技有限公司
GGuanggzzhhoouuVAePnsOi LInLtOelliSgmenatrtTeTcehcnhonloogloy gCyoC., oL.t,dLtd 广广州州市市⻩⻩埔埔区区科科学学大大道道181号8号广广州芯州大芯厦大8厦楼8楼全全国国服服务务热热线线：：4040-06-868-84-2432838
Q3:网关无法添加 a. 指示灯是否亮的。若不亮，请确认线路是否联通的，是否停电。 b. 指示灯亮的，复位后，指示灯是否有相应改变。若指示灯没有相应反应，
尝试重启。
3. 包装成箱的产品，应放在通⻛、干燥、无腐蚀性气体的地方贮存，堆放高度不能超过十层，仓库温度-10℃~+40℃，湿度≤75%。
4. 避免雨、雪、猛力撞击等。
Zigbee指示灯
WAN网口 LAN网口 CLR复位孔电源插孔
电源指示灯网络指示灯
USB插口 POWER按键 C-3B401-10
Zigbee指示灯
WAN网口 CLR复位孔
电源插孔
USB插口 POWER按键
Zigbee入网孔: 短按，网关打开设备搜索入网。 CLR 复位孔: ⻓按5秒，设备恢复出厂默认状态 POWER 按键: ⻓按5秒，清除用户信息，用户可重新绑定
最大发射功率：20dbm 无线信道：2.4GHz 材质：PC+ABS 工作温度：0-40℃ 工作湿度：10%-90%RH
三.孔位标示
C-3B501-10
C-3B502-10
指示灯
Zigbee入网孔 CLR复位孔
POWER按键 LAN/WAN
LAN/WAN POWER按键
-２-

ET—GIA无线型紧急电话介绍[1]

ET－GⅠA型无线紧急电话系统北京公科飞达交通工程发展有限公司北京公科飞达交通工程发展有限公司ET－GⅠA型无线紧急电话系统介绍ET－GⅠA型无线紧急电话系统介绍北京飞达ET－GⅠA型无线紧急电话系统是基于GSM公众蜂窝数字移动通信网平台的高速公路紧急电话系统。

依托于先进、可靠、强大的GSM公网，ET－GⅠA型无线紧急电话系统性能优越、可靠稳定、安装方便、维护简单，应用前景广泛。

一．系统构成ET－GⅠA型无线紧急电话系统典型结构如下图所示。

典型系统结构ET－GⅠA型无线紧急电话系统由中心控制设备和外场紧急电话分机组成。

一套中心控制设备可管理控制多台紧急电话分机。

中心控制设备包括无线紧急电话主控机、通信控制器、值班电话机及打印机等。

12配置如下：主控机为值班员提供友好的图形用户界面，显示高速公路线形图、所有紧急电话分机的布设位置及互通、大桥等构造物。

通信控制器完成必要的数据通信。

值班电话机用于事故接警。

图形用户界面外场紧急电话分机采用主副机结构或两主机结构均可。

在主副机结构中，一对分机分别为主机和副机，主副机共用一套控制核心部件，主副机之间用电缆连接。

在两主机结构中，一对分机均为主机，之间无需任何连接。

北京公科飞达交通工程发展有限公司ET－GⅠA型无线紧急电话系统介绍二．系统特点优势1．紧急电话分机音量大，音质好，失真小。

音量、音质不受与中心距离远近的限制。

2．系统容量不受限制，移动公网覆盖的范围内都可设置分机，无需敷设干线光电缆，安装方便，维护简单。

3．环境适应性采用工业级元器件，温度适应性强。

电路板经过三防处理，适应高温、低温、潮湿、霉雨等各种气候环境。

送、受话器均选用防水材料制成。

机箱密封性能好，防护等级IP65。

4．远程维护功能分机检测采用GRU新技术，不产生网络服务费：系统控制主机对分机进行检测时，采用了GRU回铃音侦测技术，通过对分机回铃音的分析，判断分机的状态正常与否。

这样由于网络没有建立接续，因此不会产生网络服务费。

MAX3232EEUE+T中文资料

For pricing, delivery, and ordering information, please contact Maxim Direct at 1-888-629-4642,or visit Maxim's website at .General DescriptionThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E +3.0V-powered EIA/TIA-232 and V.28/V.24communications interface devices feature low power con-sumption, high data-rate capabilities, and enhanced electrostatic-discharge (ESD) protection. The enhanced ESD structure protects all transmitter outputs and receiver inputs to ±15kV using IEC 1000-4-2 Air-G ap Discharge, ±8kV using IEC 1000-4-2 Contact Discharge (±9kV for MAX3246E), and ±15kV using the Human Body Model. The logic and receiver I/O pins of the MAX3237E are protected to the above standards, while the transmit-ter output pins are protected to ±15kV using the Human Body Model.A proprietary low-dropout transmitter output stage delivers true RS-232 performance from a +3.0V to +5.5V power supply, using an internal dual charge pump. The charge pump requires only four small 0.1µF capacitors for opera-tion from a +3.3V supply. Each device guarantees opera-tion at data rates of 250kbps while maintaining RS-232output levels. The MAX3237E guarantees operation at 250kbps in the normal operating mode and 1Mbps in the MegaBaud™ operating mode, while maintaining RS-232-compliant output levels.The MAX3222E/MAX3232E have two receivers and two transmitters. The MAX3222E features a 1µA shutdown mode that reduces power consumption in battery-pow-ered portable systems. The MAX3222E receivers remain active in shutdown mode, allowing monitoring of external devices while consuming only 1µA of supply current. The MAX3222E and MAX3232E are pin, package, and func-tionally compatible with the industry-standard MAX242and MAX232, respectively.The MAX3241E/MAX3246E are complete serial ports (three drivers/five receivers) designed for notebook and subnotebook computers. The MAX3237E (five drivers/three receivers) is ideal for peripheral applications that require fast data transfer. These devices feature a shut-down mode in which all receivers remain active, while consuming only 1µA (MAX3241E/MAX3246E) or 10nA (MAX3237E).The MAX3222E, MAX3232E, and MAX3241E are avail-able in space-saving SO, SSOP, TQFN and TSSOP pack-ages. The MAX3237E is offered in an SSOP package.The MAX3246E is offered in the ultra-small 6 x 6 UCSP™package.ApplicationsBattery-Powered Equipment PrintersCell PhonesSmart Phones Cell-Phone Data Cables xDSL ModemsNotebook, Subnotebook,and Palmtop ComputersNext-Generation Device Features♦For Space-Constrained ApplicationsMAX3228E/MAX3229E: ±15kV ESD-Protected, +2.5V to +5.5V, RS-232 Transceivers in UCSP ♦For Low-Voltage or Data Cable ApplicationsMAX3380E/MAX3381E: +2.35V to +5.5V, 1µA, 2Tx/2Rx, RS-232 Transceivers with ±15kV ESD-Protected I/O and Logic PinsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246E±15kV ESD-Protected, Down to 10nA, 3.0V to 5.5V ,Up to 1Mbps, True RS-232 Transceivers________________________________________________________________Maxim Integrated Products 119-1298; Rev 11; 10/07Ordering Information continued at end of data sheet.*Dice are tested at T A = +25°C, DC parameters only.**EP = Exposed paddle.Pin Configurations, Selector Guide, and Typical Operating Circuits appear at end of data sheet.MegaBaud and UCSP are trademarks of Maxim Integrated Products, Inc.†Covered by U.S. Patent numbers 4,636,930; 4,679,134;4,777,577; 4,797,899; 4,809,152; 4,897,774; 4,999,761; and other patents pending.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversABSOLUTE MAXIMUM RATINGSELECTRICAL CHARACTERISTICS(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Notes 3, 4)Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.V CC to GND..............................................................-0.3V to +6V V+ to GND (Note 1)..................................................-0.3V to +7V V- to GND (Note 1)...................................................+0.3V to -7V V+ + |V-| (Note 1).................................................................+13V Input Voltages T_IN, EN , SHDN , MBAUD to GND ........................-0.3V to +6V R_IN to GND.....................................................................±25V Output Voltages T_OUT to GND...............................................................±13.2V R_OUT, R_OUTB (MAX3241E)................-0.3V to (V CC + 0.3V)Short-Circuit Duration, T_OUT to GND.......................Continuous Continuous Power Dissipation (T A = +70°C)16-Pin SSOP (derate 7.14mW/°C above +70°C)..........571mW 16-Pin TSSOP (derate 9.4mW/°C above +70°C).......754.7mW 16-Pin TQFN (derate 20.8mW/°C above +70°C).....1666.7mW 16-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin Wide SO (derate 9.52mW/°C above +70°C).....762mW 18-Pin PDIP (derate 11.11mW/°C above +70°C)..........889mW 20-Pin TQFN (derate 21.3mW/°C above +70°C)........1702mW 20-Pin TSSOP (derate 10.9mW/°C above +70°C)........879mW 20-Pin SSOP (derate 8.00mW/°C above +70°C)..........640mW 28-Pin SSOP (derate 9.52mW/°C above +70°C)..........762mW 28-Pin Wide SO (derate 12.50mW/°C above +70°C).............1W 28-Pin TSSOP (derate 12.8mW/°C above +70°C)......1026mW 32-Lead Thin QFN (derate 33.3mW/°C above +70°C)..2666mW 6 x 6 UCSP (derate 12.6mW/°C above +70°C).............1010mW Operating Temperature Ranges MAX32_ _EC_ _...................................................0°C to +70°C MAX32_ _EE_ _.................................................-40°C to +85°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 2)Infrared, 15s..................................................................+200°C Vapor Phase, 20s..........................................................+215°C Note 1:V+ and V- can have maximum magnitudes of 7V, but their absolute difference cannot exceed 13V.Note 2:This device is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the devicecan be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow.Preheating is required. Hand or wave soldering is not allowed.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________3M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers4_______________________________________________________________________________________TIMING CHARACTERISTICS—MAX3237E(V CC = +3V to +5.5V, C1–C4 = 0.1µF, T A = T MIN to T MAX , unless otherwise noted. Typical values are at T A = +25°C.) (Note 3)±10%. MAX3237E: C1–C4 = 0.1µF tested at +3.3V ±5%, C1–C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.047µF, C2, C3, C4 =0.33µF tested at +5.0V ±10%. MAX3246E; C1-C4 = 0.22µF tested at +3.3V ±10%; C1 = 0.22µF, C2, C3, C4 = 0.54µF tested at 5.0V ±10%.Note 4:MAX3246E devices are production tested at +25°C. All limits are guaranteed by design over the operating temperature range.Note 5:The MAX3237E logic inputs have an active positive feedback resistor. The input current goes to zero when the inputs are atthe supply rails.Note 6:MAX3241EEUI is specified at T A = +25°C.Note 7:Transmitter skew is measured at the transmitter zero crosspoints.TIMING CHARACTERISTICS—MAX3222E/MAX3232E/MAX3241E/MAX3246EMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________5-6-4-202460MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = GND)LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )10001500500200025003000531-1-3-5-6-2-42046-5-31-135010001500500200025003000LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCE-7.5-5.0-2.502.55.07.5MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. LOAD CAPACITANCE (MBAUD = V CC )LOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )500100015002000__________________________________________Typical Operating Characteristics(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)-6-5-4-3-2-10123456010002000300040005000MAX3241ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V)302010405060020001000300040005000MAX3241EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )04286121014010002000300040005000MAX3241ESLEW RATE vs. LOAD CAPACITANCEM A X 3237E t o c 05LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )-6-5-4-3-2-10123456010002000300040005000MAX3222E/MAX3232ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P UT V O L T A G E (V )624108141216010002000300040005000MAX3222E/MAX3232ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L E W R A T E (V /μs)2520155103530404520001000300040005000MAX3222E/MAX3232E OPERATING SUPPLY CURRENT vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers6_______________________________________________________________________________________Typical Operating Characteristics (continued)(V CC = +3.3V, 250kbps data rate, 0.1µF capacitors, all transmitters loaded with 3k Ωand C L , T A = +25°C, unless otherwise noted.)20604080100MAX3237ETRANSMITTER SKEW vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)100015005002000T R A N S M I T T E R S K E W (n s )-6-2-42046-3-51-1352.03.03.52.54.04.55.0SUPPLY VOLTAGE (V)T R A N S M I T T E R O U T P U T V O L T A G E (V )MAX3237ETRANSMITTER OUTPUT VOLTAGE vs. SUPPLY VOLTAGE (MBAUD = GND)10203040502.0MAX3237E SUPPLY CURRENT vs. SUPPLY VOLTAGE (MBAUD = GND)SUPPLY VOLTAGE (V)S U P P L Y C U R R E N T (m A )3.03.52.54.04.55.0MAX3246ETRANSMITTER OUTPUT VOLTAGEvs. LOAD CAPACITANCELOAD CAPACITANCE (pF)T R A N S M I T T E R O U T P U T V O L T A G E (V )4000300010002000-5-4-3-2-101234567-65000468101214160MAX3246ESLEW RATE vs. LOAD CAPACITANCELOAD CAPACITANCE (pF)S L EW R A T E (V /μs )200030001000400050001020304050600MAX3246EOPERATING SUPPLY CURRENT vs. LOAD CAPACITANCEM A X 3237E t o c 17LOAD CAPACITANCE (pF)S U P P L Y C U R R EN T (m A )1000200030004000500055453525155024681012MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = GND)LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )10001500500200025003000010203050406070MAX3237ESLEW RATE vs. LOAD CAPACITANCE(MBAUD = V CC )LOAD CAPACITANCE (pF)S L E W R A T E (V /μs )5001000150020001020304050MAX3237ESUPPLY CURRENT vs. LOAD CAPACITANCE WHEN TRANSMITTING DATA (MBAUD = GND)LOAD CAPACITANCE (pF)S U P P L Y C U R R E N T (m A )10001500500200025003000MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________7Pin DescriptionM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers8_______________________________________________________________________________________MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_______________________________________________________________________________________9Detailed DescriptionDual Charge-Pump Voltage ConverterThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246Es’ internal power supply consists of a regu-lated dual charge pump that provides output voltages of +5.5V (doubling charge pump) and -5.5V (inverting charge pump) over the +3.0V to +5.5V V CC range. The charge pump operates in discontinuous mode; if the output voltages are less than 5.5V, the charge pump is enabled, and if the output voltages exceed 5.5V, the charge pump is disabled. Each charge pump requires a flying capacitor (C1, C2) and a reservoir capacitor (C3, C4) to generate the V+ and V- supplies (Figure 1).RS-232 TransmittersThe transmitters are inverting level translators that con-vert TTL/CMOS-logic levels to ±5V EIA/TIA-232-compli-ant levels.The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E transmitters guarantee a 250kbps data rate with worst-case loads of 3k Ωin parallel with 1000pF,providing compatibility with PC-to-PC communication software (such as LapLink™). Transmitters can be par-alleled to drive multiple receivers or mice.The MAX3222E/MAX3237E/MAX3241E/MAX3246E transmitters are disabled and the outputs are forcedinto a high-impedance state when the device is in shut-down mode (SHDN = G ND). The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E permit the outputs to be driven up to ±12V in shutdown.The MAX3222E/MAX3232E/MAX3241E/MAX3246E transmitter inputs do not have pullup resistors. Connect unused inputs to GND or V CC . The MAX3237E’s trans-mitter inputs have a 400k Ωactive positive-feedback resistor, allowing unused inputs to be left unconnected.MAX3237E MegaBaud OperationFor higher-speed serial communications, the MAX3237E features MegaBaud operation. In MegaBaud operating mode (MBAUD = V CC ), the MAX3237E transmitters guarantee a 1Mbps data rate with worst-case loads of 3k Ωin parallel with 250pF for +3.0V < V CC < +4.5V. For +5V ±10% operation, the MAX3237E transmitters guarantee a 1Mbps data rate into worst-case loads of 3k Ωin parallel with 1000pF.RS-232 ReceiversThe receivers convert RS-232 signals to CMOS-logic output levels. The MAX3222E/MAX3237E/MAX3241E/MAX3246E receivers have inverting three-state outputs.Drive EN high to place the receiver(s) into a high-impedance state. Receivers can be either active or inactive in shutdown (Table 1).Figure 1. Slew-Rate Test CircuitsLapLink is a trademark of Traveling Software.M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers10______________________________________________________________________________________The complementary outputs on the MAX3237E/MAX3241E (R_OUTB) are always active, regardless of the state of EN or SHDN . This allows the device to be used for ring indicator applications without forward biasing other devices connected to the receiver outputs. This is ideal for systems where V CC drops to zero in shutdown to accommodate peripherals such as UARTs (Figure 2).MAX3222E/MAX3237E/MAX3241E/MAX3246E Shutdown ModeSupply current falls to less than 1µA in shutdown mode (SHDN = low). The MAX3237E’s supply current falls to10nA (typ) when all receiver inputs are in the invalid range (-0.3V < R_IN < +0.3). When shut down, the device’s charge pumps are shut off, V+ is pulled down to V CC , V- is pulled to ground, and the transmitter out-puts are disabled (high impedance). The time required to recover from shutdown is typically 100µs, as shown in Figure 3. Connect SHDN to V CC if shutdown mode is not used. SHDN has no effect on R_OUT or R_OUTB (MAX3237E/MAX3241E).±15kV ESD ProtectionAs with all Maxim devices, ESD-protection structures are incorporated to protect against electrostatic dis-charges encountered during handling and assembly.The driver outputs and receiver inputs of the MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E have extra protection against static electricity. Maxim’s engineers have developed state-of-the-art structures to protect these pins against ESD of ±15kV without damage.The ESD structures withstand high ESD in all states:normal operation, shutdown, and powered down. After an ESD event, Maxim’s E versions keep working without latchup, whereas competing RS-232 products can latch and must be powered down to remove latchup.Furthermore, the MAX3237E logic I/O pins also have ±15kV ESD protection. Protecting the logic I/O pins to ±15kV makes the MAX3237E ideal for data cable applications.SHDN T2OUTT1OUT5V/div2V/divV CC = 3.3V C1–C4 = 0.1μFFigure 3. Transmitter Outputs Recovering from Shutdown or Powering UpMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversESD protection can be tested in various ways; the transmitter outputs and receiver inputs for the MAX3222E/MAX3232E/MAX3241E/MAX3246E are characterized for protection to the following limits:•±15kV using the Human Body Model•±8kV using the Contact Discharge method specified in IEC 1000-4-2•±9kV (MAX3246E only) using the Contact Discharge method specified in IEC 1000-4-2•±15kV using the Air-G ap Discharge method speci-fied in IEC 1000-4-2Figure 4a. Human Body ESD Test ModelFigure 4b. Human Body Model Current WaveformFigure 5a. IEC 1000-4-2 ESD Test Model Figure 5b. IEC 1000-4-2 ESD Generator Current WaveformM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceiverscharacterized for protection to ±15kV per the Human Body Model.ESD Test ConditionsESD performance depends on a variety of conditions.Contact Maxim for a reliability report that documents test setup, test methodology, and test results.Human Body ModelFigure 4a shows the Human Body Model, and Figure 4b shows the current waveform it generates when dis-charged into a low impedance. This model consists of a 100pF capacitor charged to the ESD voltage of interest,which is then discharged into the test device through a 1.5k Ωresistor.IEC 1000-4-2The IEC 1000-4-2 standard covers ESD testing and performance of finished equipment; it does not specifi-cally refer to integrated circuits. The MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E help you design equipment that meets level 4 (the highest level)of IEC 1000-4-2, without the need for additional ESD-protection components.The major difference between tests done using the Human Body Model and IEC 1000-4-2 is higher peak current in IEC 1000-4-2, because series resistance is lower in the IEC 1000-4-2 model. Hence, the ESD with-stand voltage measured to IEC 1000-4-2 is generally lower than that measured using the Human Body Model. Figure 5a shows the IEC 1000-4-2 model, and Figure 5b shows the current waveform for the ±8kV IEC 1000-4-2 level 4 ESD Contact Discharge test. The Air-G ap Discharge test involves approaching the device with a charged probe. The Contact Discharge method connects the probe to the device before the probe is energized.Machine ModelThe Machine Model for ESD tests all pins using a 200pF storage capacitor and zero discharge resis-tance. Its objective is to emulate the stress caused by contact that occurs with handling and assembly during manufacturing. All pins require this protection during manufacturing, not just RS-232 inputs and outputs.Therefore, after PC board assembly, the Machine Model is less relevant to I/O ports.Table 2. Required Minimum Capacitor ValuesFigure 6a. MAX3241E Transmitter Output Voltage vs. Load Current Per TransmitterTable 3. Logic-Family Compatibility with Various Supply VoltagesMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversApplications InformationCapacitor SelectionThe capacitor type used for C1–C4 is not critical for proper operation; polarized or nonpolarized capacitors can be used. The charge pump requires 0.1µF capaci-tors for 3.3V operation. For other supply voltages, see Table 2 for required capacitor values. Do not use val-ues smaller than those listed in Table 2. Increasing the capacitor values (e.g., by a factor of 2) reduces ripple on the transmitter outputs and slightly reduces power consumption. C2, C3, and C4 can be increased without changing C1’s value. However, do not increase C1without also increasing the values of C2, C3, C4,and C BYPASS to maintain the proper ratios (C1 to the other capacitors).When using the minimum required capacitor values,make sure the capacitor value does not degradeexcessively with temperature. If in doubt, use capaci-tors with a larger nominal value. The capacitor’s equiv-alent series resistance (ESR), which usually rises at low temperatures, influences the amount of ripple on V+and V-.Power-Supply DecouplingIn most circumstances, a 0.1µF V CC bypass capacitor is adequate. In applications sensitive to power-supply noise, use a capacitor of the same value as charge-pump capacitor C1. Connect bypass capacitors as close to the IC as possible.Operation Down to 2.7VTransmitter outputs meet EIA/TIA-562 levels of ±3.7V with supply voltages as low as 2.7V.Figure 6b. Mouse Driver Test CircuitM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 TransceiversFigure 7. Loopback Test CircuitT1IN T1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V C1–C4 = 0.1μFFigure 8. MAX3241E Loopback Test Result at 120kbps T1INT1OUTR1OUT5V/div5V/div5V/divV CC = 3.3V, C1–C4 = 0.1μFFigure 9. MAX3241E Loopback Test Result at 250kbps+5V 0+5V 0-5V +5VT_INT_OUT5k Ω + 250pFR_OUTV CC = 3.3V C1–C4 = 0.1μFFigure 10. MAX3237E Loopback Test Result at 1000kbps (MBAUD = V CC )Transmitter Outputs Recoveringfrom ShutdownFigure 3 shows two transmitter outputs recovering from shutdown mode. As they become active, the two trans-mitter outputs are shown going to opposite RS-232 levels (one transmitter input is high; the other is low). Each transmitter is loaded with 3k Ωin parallel with 2500pF.The transmitter outputs display no ringing or undesir-able transients as they come out of shutdown. Note thatthe transmitters are enabled only when the magnitude of V- exceeds approximately -3.0V.Mouse DrivabilityThe MAX3241E is designed to power serial mice while operating from low-voltage power supplies. It has been tested with leading mouse brands from manu-facturers such as Microsoft and Logitech. The MAX3241E successfully drove all serial mice tested and met their current and voltage requirements.MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversFigure 6a shows the transmitter output voltages under increasing load current at +3.0V. Figure 6b shows a typical mouse connection using the MAX3241E.High Data RatesThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E maintain the RS-232 ±5V minimum transmit-ter output voltage even at high data rates. Figure 7shows a transmitter loopback test circuit. Figure 8shows a loopback test result at 120kbps, and Figure 9shows the same test at 250kbps. For Figure 8, all trans-mitters were driven simultaneously at 120kbps into RS-232 loads in parallel with 1000pF. For Figure 9, a single transmitter was driven at 250kbps, and all transmitters were loaded with an RS-232 receiver in parallel with 1000pF.The MAX3237E maintains the RS-232 ±5.0V minimum transmitter output voltage at data rates up to 1Mbps.Figure 10 shows a loopback test result at 1Mbps with MBAUD = V CC . For Figure 10, all transmitters were loaded with an RS-232 receiver in parallel with 250pF.Interconnection with 3V and 5V LogicThe MAX3222E/MAX3232E/MAX3237E/MAX3241E/MAX3246E can directly interface with various 5V logic families, including ACT and HCT CMOS. See Table 3for more information on possible combinations of inter-connections.UCSP ReliabilityThe UCSP represents a unique packaging form factor that may not perform equally to a packaged product through traditional mechanical reliability tests. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and usage environ-ment. The user should closely review these areas when considering use of a UCSP package. Performance through Operating Life Test and Moisture Resistance remains uncompromised as the wafer-fabrication process primarily determines it.Mechanical stress performance is a greater considera-tion for a UCSP package. UCSPs are attached through direct solder contact to the user’s PC board, foregoing the inherent stress relief of a packaged product lead frame. Solder joint contact integrity must be consid-ered. Table 4 shows the testing done to characterize the UCSP reliability performance. In conclusion, the UCSP is capable of performing reliably through envi-ronmental stresses as indicated by the results in the table. Additional usage data and recommendations are detailed in the UCSP application note, which can be found on Maxim’s website at .Table 4. Reliability Test DataM A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________________Pin ConfigurationsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 TransceiversPin Configurations (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers__________________________________________________Typical Operating CircuitsMAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)M A X 3222E /M A X 3232E /M A X 3237E /M A X 3241E †/M A X 3246EUp to 1Mbps, True RS-232 Transceivers_____________________________________Typical Operating Circuits (continued)MAX3222E/MAX3232E/MAX3237E/MAX3241E †/MAX3246EUp to 1Mbps, True RS-232 Transceivers______________________________________________________________________________________21Selector Guide___________________Chip InformationTRANSISTOR COUNT:MAX3222E/MAX3232E: 1129MAX3237E: 2110MAX3241E: 1335MAX3246E: 842PROCESS: BICMOSOrdering Information (continued)†Requires solder temperature profile described in the AbsoluteMaximum Ratings section. UCSP Reliability is integrally linked to the user’s assembly methods, circuit board material, and environment. Refer to the UCSP Reliability Notice in the UCSP Reliability section of this datasheet for more information.**EP = Exposed paddle.。

AX3301中文资料

AX3301PWM Step-Down Controller GENERAL DESCRIPTIONThe AX3301 integrates Pulse-Width-Modulation (PWM) control circuit into a single chip. These devise include a reference voltage source, oscillation circuit, error amplifier and etc.AX3301 provides low-ripple power, high efficiency, and excellent transient characteristics. The PWM control circuit is able to very the duty ratio linearly form 0 up to 100%. This controller also contains an error amplifier circuit as well as a soft-start circuit that prevents overshoot at startup. An enable function, an over current protect function and short circuit protect function are built inside, and when OCP or SCP happens, the operation frequency will be reduced. Also, an internal compensation block is built in to minimum external component count.With the addition of an external P-channel Power MOS, a coil, capacitors, and a diode connected externally, these components can function as step-down switching regulators. They serve as ideal power supply units for portable devices when coupled with the SOP-8L & MSOP-8L mini-package, providing such outstanding features as low current consumption. Since this converter can accommodate an input voltage up to 24V, it is also suitable for the operation via an AC adapter.FEATURES-Input voltage 3.6V to 24V-Output voltage 0.8V to Vcc-Duty ratio 0% to 100% PWM control-Oscillation frequency 330 KHz typ.-Soft-start (SS), Current Limit (CL), Enable function.-Thermal Shutdown function.-Short Circuit Protect (SCP).-External SW P-channel MOS.-MSOP-8L & SOP-8L Pb-Free package.1/11Block DiagramGATEVccFBPIN ASSIGNMETThese packages of AX3301 are MSOP-8L & SOP-8L; the pin assignment is given by:NameDescriptionEN Shutdown Control Input. H normal operation(Step-down)L Shutdown modeOCSETAdd an external resistor to set maxswitch output current.V CC IC power supply pinGATEGate drive for external P-channelMOSFET.( Top View )LX EN FB Vss VccGATENC Ocset MSOP - 8L & SOP - 8LLX LX is the current sense input. V SS GND pinFBFeedback pinAbsolute Maximum Ratings (at Ta=25 )Characteristics Symbol Rating Unit VCC Pin Voltage V CC V SS - 0.3 to V SS + 26 V Feedback Pin Voltage V FB V SS - 0.3 to V CC VON/OFF Pin Voltage V EN V SS - 0.3 to V CC + 0.3 V Switch Pin Voltage V SW V SS - 0.3 to V CC + 0.3 V Power Dissipation PD Internally limited mWStorage Temperature Range T ST-40 to +150 Operating Temperature Range T OP -20 to +125Operating Supply VoltageV OP +3.6 to +24VThermal Resistance from Junction to caseθJC SOP8=40, MSOP8=45 /W Thermal Resistance from Junction to ambientθJASOP8=120, MSOP8=200/WNote : JA is measured with the PCB copper area of approximately 1 in 2(Multi-layer).Electrical Characteristics (V CC = 12V, Ta=25°C, unless otherwise specified)Characteristics Symbol Conditions Min Typ Max UnitsFeedback Voltage V FB I OUT =0.1A 0.784 0.800 0.816 VQuiescent Current I CCQ V FB =1.2V force driver off 3 5 mA Feedback Bias Current I FB I OUT =0.1A - 0.1 0.5 uAShutdown Supply Current I SD V EN =0V-210uAOCSET pin bias current I OCSET95 110 125 uALine Regulation V OUT /V OUT V CC = 5V~24V, I OUT =0.2A - 0.6 1.2 % Load Regulation V OUT /V OUT I OUT = 0.1 to 5A -0.30.5%Oscillation Frequency F OSC SW pin 260 330 400 KHz V SH High (regulator ON) 2.0 - - EN Pin Logic input threshold voltage V SL Low (regulator OFF) - - 0.8VI SH V EN =2.5V (ON) - 20 - uA EN Pin Input Current I SL V EN =0.3V (OFF)- -10 - uA Soft-Start Time T SS0.3 4 8 msLX Rise Time T LXR C LX =1000pF 45LX Fall Time T LXF C LX =1000pF 45 nSI OUT = 2A - 92 -EfficiencyEFFI V OUT = 5V I OUT = 3A- 91 - %Thermal shutdown TempTSD125Application CircuitA.Typical circuitB.Standby current (Iout=0A) < 4mAFunction DescriptionsPWM ControlThe AX3301 integrates Pulse-Width-Modulation (PWM) control circuit into a single chip.The pulse width varies in a range from 0 to 100%, according to the load current. The ripple voltage produced by the switching can easily be removed through a filter because theswitching frequency remains constant. Therefore, these controllers provide a low-ripple power over broad ranges of input voltage and load current.RDS (ON) Current LimitingThe current limit threshold is setting by the external resistor (R3) connecting from V CC supply to OCSET pin. The internal 110uA sink current crossing the resistor sets the voltage at pin of OCSET. When the PWM voltage is less than the voltage at OCSET, an over-current condition is triggered. Please refer to the formula for setting the current limit valueR I I DS(ON)OCSET SW(MAX)075.0R3+×=(Normally, The I SW(MAX) setting more than I OUT 0.5~1.0A ).Example:I SW = (110uA * 1.8k + 0.075)/ 50m Ω (AP9435GM SPEC) = 5.5ASetting the Output VoltageApplication circuit item shows the basic application circuit with AX3301 adjustable output version. The external resistor sets the output voltage according to the following equation:⎟⎠⎞⎜⎝⎛+×=2118.0R R V V OUTTable 1 Resistor select for output voltage settingV OUT R2 R1 1.3K 6.8K 5V 5.6K 30K 1.5K 4.7K 3.3V 5.6K 18K 2.2K 4.7K 2.5V5.6K 12K1.8V 1.2K 1.5K 1.5V2.2K 2.0KInductor SelectionFor most designs, Low inductance values are physically smaller but require fasterswitching, which results in some efficiency loss. The inductor value can be derived from the following equation:()fI V V V V LLXL IN OUT IN OUT ××−×=∆Where is inductor Ripple Current. Large value inductors lower ripple current and smallvalue inductors result in high ripple currents. Choose inductor ripple current approximately 15% of the maximum input current 3A, ∆I L=0.45A.Table 2 Inductor select for output voltage setting (AX3301 at V CC=12V)5V(5A) V OUT 2.5V 3.3V 5V 3.3V(5A)L1 Value 15uH 18uH 22uH 12uH 15uH The DC current rating of the inductor should be at least equal to the maximum load current plus half the ripple current to prevent core saturation (3A+0.3A).Input Capacitor SelectionThe input capacitor reduces the surge current drawn from the input and switching noise from the device. The input capacitor impedance at the switching frequency shall be lessthan input source impedance to prevent high frequency switching current passing to the input. A low ESR input capacitor sized for maximum RMS current must be used.The capacitor voltage rating should be at least 1.5 times greater than the input voltage, and often much higher voltage ratings are needed to satisfy.Output Capacitor SelectionThe output capacitor is required to keep the output voltage ripple small and to ensure regulation loop stability. The output capacitor must have low impedance at the switching frequency. A low ESR capacitor sized for maximum RMS current must be used. the lowESR requirements needed for low output ripple voltage.The capacitor voltage rating should be at least 1.5 times greater than the input voltage, and often much higher voltage ratings are needed to satisfy.Layout GuidanceWhen laying out the PC board, the following suggestions should be taken to ensure proper operation of the AX3301. These items are also illustrated graphically in below.1. The power traces, including the PMOS Drain & Source trace, the Schottky and the C2 trace should be kept short, direct and wide to allow large current flow.2. Keep the switching node, away from the sensitive FB node.3. Connect ground side of the C2 & D1 as closely as possible.4. Connect PMOS Source and R3 as closely as possible.5. Do not trace signal line under inductor.Typical CharacteristicsVFB VS VINICCQ VS VINIOCSET VS VINFOSC VS VINVFB VS TEMPERATUREICCQ VSTEMPERATURETypical CharacteristicsIOCSET VS TEMPERATURE FOSC VS TEMPERATUREEfficiency (V IN=12V, V OUT=5V)Efficiency (V IN=12V, V OUT=3.3V)Typical CharacteristicsEN PIN on test wave (V IN=12V, V OUT=5V, I OUT=5A)Power on test wave (V IN=12V, V OUT=5V, I OUT =5A)Load transient Response 0A to 5A(V IN=12V, V OUT=5V)Load transient Response 0.2A to 5A(V IN=12V, V OUT=5V)Output Ripple(V IN=12V, V OUT=5V, I OUT=5A)Start-Up from Thermal Shutdown(V IN=12V, V OUT=5V, I OUT=1A )V OUTI SWV INSWI SWSWV INV OUTV OUT (AC)SWI SWPackage Outlines (SOP-8L)Dimensions In Millimeters Dimensions In Inches SymbolMin. Nom. Max. Min. Nom. Max.A 1.40 1.60 1.75 0.055 0.063 0.069A1 0.10 - 0.25 0.040 - 0.100 A2 1.30 1.45 1.50 0.051 0.057 0.059C 0.19 0.20 0.25 0.0075 0.008 0.010D 4.80 4.90 5.00 0.189 0.193 0.197E 3.80 3.90 4.00 0.150 0.154 0.157H 5.79 5.99 6.20 0.228 0.236 0.244L 0.38 0.71 1.27 0.015 0.028 0.050b 0.33 0.41 0.51 0.013 0.016 0.020e 1.27 TYP 0.050 TYPy - - 0.10 - - 0.004 θ0O - 8O0O - 8O11/11Axelite Confidential Materials, do not copy or distribute without written consent .Rev.1.1 Oct.18, 2007 PWM Step-Down Controller AX3301Package Outlines (MSOP-8L)Dimensions In Millimeters Dimensions In InchesSymbol Min. Nom. Max. Min. Nom. Max.A 0.81 0.96 1.12 0.032 0.038 0.044 A1 0.05 - 0.15 0.002 - 0.006 A2 0.76 0.86 0.97 0.030 0.034 0.038 b 0.28 0.30 0.38 0.011 0.012 0.015C 0.13 0.15 0.23 0.005 0.006 0.009D 2.90 3.00 3.10 0.114 0.118 0.122E 4.80 4.90 5.00 0.189 0.193 0.197 E1 2.90 3.00 3.10 0.114 0.118 0.122 e - 0.65 - - 0.0256 - L 0.40 0.6 0.8 0.016 0.023 0.032 y - - 0.076 - - 0.003 θ 0º 3º 6º 0º 3º 6º。

MAX3301EETJ资料

General DescriptionThe MAX3301E fully integrated USB On-the-Go (OTG)transceiver and charge pump allows mobile devices such as PDAs, cellular phones, and digital cameras to interface directly with USB peripherals and each other without the need of a host PC. Use the MAX3301E with an embedded USB host to directly connect to peripher-als such as printers or external hard drives.The MAX3301E integrates a USB OTG transceiver, a V BUS charge pump, a linear regulator, and an I 2C™-compatible, 2-wire serial interface. An internal level shifter allows the MAX3301E to interface with logic sup-ply voltages from +1.65V to +3.6V. The MAX3301E’s OTG-compliant charge pump operates with +3V to +4.5V input supply voltages, and supplies an OTG-com-patible output on V BUS while sourcing more than 8mA of output current.The MAX3301E enables USB OTG communication from highly integrated digital devices that cannot supply or tol-erate the +5V V BUS levels that USB OTG requires. The device supports USB OTG session-request protocol (SRP) and host-negotiation protocol (HNP) by controlling and measuring V BUS using internal comparators.The MAX3301E provides built-in ±15kV electrostatic-discharge (ESD) protection for the V BUS , ID_IN, D+,and D- terminals. The MAX3301E is available in 5 x 5chip-scale (UCSP™) and 32-pin (5mm x 5mm x 0.8mm)thin QF N packages and operates over the extended -40°C to +85°C temperature range.ApplicationsMobile Phones PDAsDigital Cameras MP3 Players Photo PrintersFeatures♦USB 2.0-Compliant Full-/Low-Speed OTG Transceivers♦Ideal for USB On-the-Go, Embedded Host, or Peripheral Devices♦±15kV ESD Protection on ID_IN, V BUS , D+, and D-Terminals♦Charge Pumps for V BUS Signaling and Operation Down to 3V♦Internal V BUS and ID Comparators♦Internal Switchable Pullup and Pulldown Resistors for Host/Peripheral Functionality ♦I 2C Bus Interface with Command and Status Registers♦Linear Regulator Powers Internal Circuitry and D+/D- Pullup Resistors♦Supports Car Kit Interrupts and Audio-Mode Operation♦Supports SRP and HNP♦Low-Power Shutdown Mode♦Available in 32-Pin Thin QFN and 5 x 5 UCSP PackagesMAX3301EUSB On-the-Go Transceiver and Charge Pump________________________________________________________________Maxim Integrated Products 1Ordering Information19-3275; Rev 0; 5/04For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .I 2C is a trademark of Philips Corp.Purchase of I 2C components from Maxim Integrated Products,Inc. or one of its sublicensed Associated Companies, conveys a license under the Philips I 2C Patent Rights to use these compo-nents in an I 2C system, provided that the system conforms to the I 2C Standard Specification as defined by Philips. UCSP is a trademark of Maxim Integrated Products, Inc.Typical Operating Circuit and Pin Configurations appear at end of data sheet.*EP = Exposed paddle.**Requires solder temperature profile described in the Absolute Maximum Ratings section. UCSP reliability is integrally linked to the user’s assembly methods, circuit board material, and environ-ment. See the UCSP Reliability Notice in the UCSP Applications Information section of this data sheet for more information.M A X 3301EUSB On-the-Go Transceiver and Charge PumpABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)Note 1:The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.All voltages are referenced to GND.V CC , V L .....................................................................-0.3V to +6V TRM (regulator off or supplied by V BUS )..-0.3V to (V BUS + 0.3V)TRM (regulator supplied by V CC )...............-0.3V to (V CC + 0.3V)D+, D- (transmitter tri-stated)...................................-0.3V to +6V D+, D- (transmitter functional)....................-0.3V to (V CC + 0.3V)V BUS .........................................................................-0.3V to +6V ID_IN, SCL, SDA.......................................................-0.3V to +6V INT , SPD, RESET , ADD, OE/INT , RCV, VP,VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (V L + 0.3V)C+.............................................................-0.3V to (V BUS + 0.3V)C-................................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, V BUS to GND .........................ContinuousContinuous Power Dissipation (T A = +70°C)5 x 5 UCSP (derate 12.2mW/°C above +70°C)...........976mW 32-Pin Thin QFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°C above +70°C).............................................................1702mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 1)Infrared (15s)...............................................................+200°C Vapor Phase (20s).......................................................+215°CMAX3301EUSB On-the-Go Transceiver and Charge Pump_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)M A X 3301EUSB On-the-Go Transceiver and Charge Pump 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)MAX3301EUSB On-the-Go Transceiver and Charge Pump_______________________________________________________________________________________5TIMING CHARACTERISTICSM A X 3301EUSB On-the-Go Transceiver and Charge Pump 6_______________________________________________________________________________________I 2C-/SMBus™- COMPATIBLE TIMING SPECIFICATIONSNote 3:Guaranteed by bench characterization. Limits are not production tested.Note 4:A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s fallingedge.Note 5:C B is the total capacitance of one bus line in pF, tested with C B = 400pF.Note 6:Input filters on SDA, SCL, and ADD suppress noise spikes of less than 50ns.SMBus™ is a trademark of Intel Corporation.DRIVER PROPAGATION DELAY HIGH-TO-LOW(FULL-SPEED MODE)MAX3301E toc094ns/divD+1V/divD-1V/divDAT_VP 1V/divDRIVER PROPAGATION DELAY LOW-TO-HIGH(LOW-SPEED MODE)MAX3301E toc08100ns/divD-1V/divD+1V/div DAT_VP 1V/div DRIVER PROPAGATION DELAY HIGH-TO-LOW(LOW-SPEED MODE)MAX3301E toc07100ns/divD+1V/divD-1V/divDAT_VP 1V/div TIME TO EXIT SHUTDOWNMAX3301E toc054µs/div D-1V/divD+1V/divSCL 1V/divV BUS DURING SRP20ns/divV BUS 1V/divV BUS 1V/divC VBUS > 96µFC VBUS > 13µFTIME TO ENTER SHUTDOWNMAX3301E toc04100ns/div D+1V/div D-1V/div SCL 2V/div V BUS OUTPUT VOLTAGE vs. INPUT VOLTAGE (V CC )INPUT VOLTAGE (V CC ) (V)V B U S O U T P U T V O L T A G E (V )5.55.04.54.03.53.04.755.005.255.505.754.502.56.0V BUS OUTPUT VOLTAGE vs. VBUS OUTPUT CURRENTV BUS OUTPUT CURRENT (mA)V B U S O U T P U T V O L T A G E (V )2520151054.254.504.755.005.255.504.0030INPUT CURRENT (I CC)vs. V BUS OUTPUT CURRENTV BUS OUTPUT CURRENT (mA)I N P U T C U R R E N T (I C C ) (m A )16128410203040500020MAX3301EUSB On-the-Go Transceiver and Charge Pump_______________________________________________________________________________________7Typical Operating Characteristics(Typical operating circuit, V CC = +3.7V, V L = +2.5V, C FLYING = 100nF, T A = +25°C, unless otherwise noted.)SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )603510-150.20.40.60.81.00-4085DRIVER DISABLE DELAY (LOW-SPEED MODE)MAX3301E toc1410ns/divD+1V/divD-1V/divOE/INT 1V/divDRIVER ENABLE DELAY (LOW-SPEED MODE)100ns/divD-1V/divD+1V/div C D+ = C D- = 400pFOE/INT 1V/divDRIVER DISABLE DELAY (FULL-SPEED MODE)MAX3301E toc1210ns/divD+1V/divD-1V/div1V/divDRIVER ENABLE DELAY (FULL-SPEED MODE)MAX3301E toc1110ns/divD-1V/divD+1V/div OE/INT 1V/divDRIVER PROPAGATION DELAY LOW-TO-HIGH(FULL-SPEED MODE)MAX3301E toc104ns/divD-1V/divD+1V/divDAT_VP 1V/div M A X 3301EUSB On-the-Go Transceiver and Charge Pump 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(Typical operating circuit, V CC = +3.7V, V L = +2.5V, C FLYING = 100nF, T A = +25°C, unless otherwise noted.)MAX3301EUSB On-the-Go Transceiver and Charge Pump_______________________________________________________________________________________9Pin DescriptionM A X 3301EUSB On-the-Go Transceiver and Charge Pump 10______________________________________________________________________________________Pin Description (continued)Test Circuits and Timing DiagramsFigure 1. Load for Disable Time MeasurementFigure 2. Load for Enable Time, Transmitter Propagation Delay,and Transmitter Rise/Fall Times Figure 3. Load for Receiver Propagation Delay and Receiver Rise/Fall TimesFigure 4. Load for DAT_VP, SE0_VM Enable/Disable Time MeasurementsMAX3301ETest Circuits and Timing Diagrams (continued)Figure 6. Timing of DAT_VP, SE0_VM to D+, D- in VP_VM Mode (dat_se0 = 0)Figure 7. Timing of DAT_VP, SE0_VM to D+/D- in DAT_SE0Mode (dat_se0 = 1)Figure 8. Enable and Disable TimingFigure 9. D+/D- to RCV, DAT_VP, SE0_VM Propagation Delays (VP_VM Mode)Figure 10. D+/D- to DAT_VP, SE0_VM Propagation Delays (DAT_SE0 Mode)M A X 3301EBlock DiagramFigure 11. Block DiagramMAX3301EDetailed DescriptionThe USB OTG specification defines a dual-role USB device that acts either as an A device or as a B device.The A device supplies power on V BUS and initially serves as the USB host. The B device serves as the ini-tial peripheral and requires circuitry to monitor and pulse V BUS . These initial roles can be reversed using HNP.The MAX3301E combines a low- and full-speed USB transceiver with additional circuitry required by a dual-role device. The MAX3301E employs flexible switching circuitry to enable the device to act as a dedicated host or peripheral USB transceiver. For example, the charge pump can be turned off and the internal regulator can be powered from V BUS for bus-powered peripheral applications.TransceiverThe MAX3301E transceiver complies with the USB ver-sion 2.0 specification, and operates at full-speed (12Mbps) and low-speed (1.5Mbps) data rates. Set the data rate with the SPD input. Set the direction of data transfer with the OE/INT input. Alternatively, control trans-ceiver operation with control register 1 (Table 7) and spe-cial-function registers 1 and 2 (see Tables 14 and 15).Level ShiftersInternal level shifters allow the system-side interface to run at logic-supply voltages as low as +1.65V. Interface logic signals are referenced to the voltage applied to the logic-supply voltage, V L .Charge PumpThe MAX3301E’s OTG-compliant charge pump oper-ates with +3V to +4.5V input supply voltages (V CC ) and supplies a +4.8V to +5.25V OTG-compatible output on V BUS while sourcing the 8mA or greater output current that an A device is required to supply. Connect a 0.1µF flying capacitor between C+ and C-. Bypass V BUS to GND with a 1µF to 6.5µF capacitor, in accordance with USB OTG specifications. The charge pump can be turned off to conserve power when not used. Control of the charge pump is set through the vbus_drv bit (bit 5)of control register 2 (see Table 8).Linear Regulator (TRM)An internal 3.3V linear regulator powers the transceiver and the internal 1.5k ΩD+/D- pullup resistor. Under the control of internal register bits, the linear regulator can be powered from V CC or V BUS . The regulator power-supply settings are controlled by the reg_sel bit (bit 3) in special-function register 2 (see Table 15). This flexibilityallows the system designer to configure the MAX3301E for virtually any USB power situation.The output of the TRM is not a power supply. Do not use as a power source for any external circuitry. Connect a 1.0µF (or greater) ceramic or plastic capacitor from TRM to GND, as close to the device as possible.V BUS Level-Detection ComparatorsComparators drive interrupt source register bits 0, 1,and 7 (Table 10) to indicate important USB OTG V BUS voltage levels:•V BUS is valid (vbus_vld)•USB session is valid (sess_vld)•USB session has ended (sess_end)The vbus_valid comparator sets vbus_vld to 1 if V BUS is higher than the V BUS valid comparator threshold. The V BUS valid status bit (vbus_vld) is used by the A device to determine if the B device is sinking too much current (i.e., is not supported). The session_valid comparator sets sess_vld to 1 if V BUS is higher than the session valid comparator threshold. This status bit indicates that a data transfer session is valid. The session_end com-parator sets sess_end to 1 if V BUS is higher than the session end comparator threshold. Figure 12shows the level-detector comparators. The interrupt-enable regis-ters (Tables 12 and 13) determine whether a falling or rising edge of V BUS asserts these status bits.Figure 12. Comparator Network DiagramM A X 3301EID_INThe USB OTG specification defines an ID input that determines which dual-role device is the default host.An OTG cable connects ID to ground in the connector of one end and is left unconnected in the other end.Whichever dual-role device receives the grounded end becomes the A device. The MAX3301E provides an internal pullup resistor on ID_IN. Internal comparators detect if ID_IN is grounded or left floating.Interrupt LogicWhen OTG events require action, the MAX3301E pro-vides an interrupt output signal on INT . Alternatively,OE/INT can be configured to act as an interrupt output while the device operates in USB suspend mode.Program INT and OE/INT as open-drain or push-pull interrupts with irq_mode (bit 1 of special-function regis-ter 2, see Table 15).V BUS Power ControlV BUS is a dual-function port that powers the USB bus and/or provides a power source for the internal linear reg-ulator. The V BUS power-control block performs the various switching functions required by an OTG dual-role device.These actions are programmed by the system logic using bits 5 to 7 of control register 2 (see Table 8) to: •Discharge V BUS through a resistor •Provide power-on or receive power from V BUS •Charge V BUS through a resistorThe OTG supplement allows an A device to turn V BUS off when the bus is not being used to conserve power.The B device can issue a request that a new session be started using SRP. The B device must discharge V BUS to a level below the session-end threshold (0.8V) toensure that no session is in progress before initiating SRP. Setting bit 6 of control register 2 to a 1, discharges V BUS to GND through a 5k Ωcurrent-limiting resistor.When V BUS has discharged, the resistor is removed from the circuit by resetting bit 6 of control register 2. An OTG A device is required to supply power on V BUS .The MAX3301E provides power to V BUS from V CC or from the internal charge pump. Set bit 5 in control regis-ter 2 to a 1 in both cases. Bit 5 in control register 2 con-trols a current-limited switch, preventing damage to the device in the event of a V BUS short circuit.An OTG B device (peripheral mode) can request a ses-sion using SRP. One of the steps in implementing SRP requires pulsing V BUS high for a controlled time. A 930Ωresistor limits the current according to the OTG specifi-cation. Pulse V BUS through the pullup resistor by assert-ing bit 7 of control register 2. Prior to pulsing V BUS (bit 7), a B device first connects an internal pulldown resis-tor to discharge V BUS below the session-end threshold.The discharge current is limited by the 5k Ωresistor and set by bit 6 of control register 2. An OTG A device must supply 5V power and at least 8mA on V BUS . Setting bit 5 of control register 2 turns on the V BUS charge pump.Operating ModesThe MAX3301E has four operating modes to optimize power consumption. Only the I 2C interface remains active in shutdown mode, reducing supply current to 1µA. The I 2C interface, the ID_IN port, and the session-valid com-parator all remain active in interrupt shutdown mode. RCV asserts low in suspend mode; however, all other circuitry remains active. Table 1lists the active blocks’ power in each of the operating modes.MAX3301EApplications InformationData TransferTransmitting Data to the USBThe MAX3301E transceiver features two modes of trans-mission: DAT_SE0 or VP_VM (see Table 3). Set the transmitting mode with dat_se0 (bit 2 in control register 1, see Table 7). In DAT_SE0 mode with OE/INT low,DAT_VP specifies data for the differential transceiver,and SE0_VM forces D+/D- to the single-ended zero (SE0) state. In VP_VM mode with OE/INT low, DAT_VP drives D+, and SE0_VM drives D-. The differential receiver determines the state of RCV.Receiving Data from the USBThe MAX3301E transceiver features two modes of receiving data: DAT_SE0 or VP_VM (see Table 4). Set the receiving mode with dat_se0 (bit 2 in control register 1, see Table 7). In DAT_SE0 mode with OE/INT high,DAT_VP is the output of the differential receiver and SE0_VM indicates that D+ and D- are both logic-low. In VP_VM mode with OE/INT high, DAT_VP provides the input logic level of D+ and SE0_VM provides the input logic level of D-. The differential receiver determines the state of RCV. VP and VM echo D+ and D-, respectively.OE/INTOE/INT controls the direction of communication. OE/INT can also be programmed to act as an interrupt output when in suspend mode. The output enable portion con-trols the input or output status of DAT_VP/SE0_VM and D+/D-. When OE/INT is a logic 0, DAT_VP and SE0_VM function as inputs to the D+ and D- outputs in a method depending on the status of dat_se0 (bit 2 in control reg-ister 1). When OE/INT is a logic 1, DAT_VP and SE0_VM indicate the activity of D+ and D-.OE/INT functions as an interrupt output when the MAX3301E is in suspend mode and oe_int_en = 1 (bit 5in control register 1, see Table 7). In this mode, OE/INT detects the same interrupts as INT . Set irq_mode (bit 1in special-function register 2, see Table 15) to a 0 to program OE/INT as an open-drain interrupt output. Set irq_mode to a 1 to configure OE/INT as a push-pull interrupt output.RCVRCV monitors D+ and D- when receiving data. RCV is a logic 1 for D+ high and D- low. RCV is a logic 0 for D+low and D- high. RCV retains its last valid state when D+and D- are both low (single-ended zero, or SE0). RCV asserts low in suspend mode. Table 4shows the state of RCV.SPDUse hardware or software to control the slew rate of the D+ and D- terminals. The SPD input sets the slew rate of the MAX3301E when spd_susp_ctl (bit 1 in special-func-tion register 1, see Table 14) is 0. Drive SPD low to select low-speed mode (1.5Mbps). Drive SPD high to select full-speed mode (12Mbps). Alternatively, when spd_susp_ctl (bit 1 of special-function register 1) is a 1,software controls the slew rate. The SPD input is ignored when using software to control the data rate. The speed bit (bit 0 of control register 1, see Table 7) sets the slew rate when spd_susp_ctl = 1.SUSUse hardware or software to control the suspend mode of the MAX3301E. Set spd_susp_ctl (bit 1 of special-function register 1, see Table 14) to 0 to allow the SUS input to enable and disable the suspend mode of the MAX3301E. Drive SUS low for normal operation. Drive SUS high to enable suspend mode. RCV asserts low in suspend mode while all other circuitry remains active. Alternatively, when the spd_susp_ctl bit (bit 1 of special-function register 1) is set to a 1, software controls the suspend mode. Set the suspend bit (bit 1 of control reg-ister 1, see Table 7) to a 1 to enable suspend mode. Set the suspend bit to zero to resume normal operation. The SUS input is ignored when using software to control sus-pend mode. The MAX3301E must be in full-speed mode (SPD = high or speed = 1) to issue a remote wake-up from the device when in suspend mode.RESETThe active-low RESET input allows the MAX3301E to be asynchronously reset without cycling the power supply.Drive RESET low to reset the internal registers (see Tables 7–15for the default power-up states). Drive RESET high for normal operation.2-Wire I 2C-Compatible Serial InterfaceA register file controls the various internal switches and operating modes of the MAX3301E through a simple 2-wire interface operating at clock rates up to 400kHz.This interface supports data bursting, where multiple data phases can follow a single address phase.UART ModeSet uart_en (bit 6 in control register 1) to 1 to place the MAX3301E in UART mode. D+ transfers data to DAT_VP and SE0_VM transfers data to D- in UART mode.M A X 3301EGeneral-Purpose Buffer ModeSet gp_en (bit 7 in special-function register 1) and dat_se0 (bit 2 in control register 1) to 1, set uart_en (bit 6in control register 1) to zero, and drive OE/INT low to place the MAX3301E in general-purpose buffer mode.Control the direction of data transfer with dminus_dir and dplus_dir (bits 3 and 4 of special-function register 1, see Tables 2 and 14).Serial AddressingThe MAX3301E operates as a slave device that sends and receives control and status signals through an I 2C-compatible 2-wire interface. The interface uses a serial data line (SDA) and a serial clock line (SCL) to achieve bidirectional communication between master(s) and slave(s). A master (typically a microcontroller) initiates all data transfers to and from the MAX3301E and gener-ates the SCL clock that synchronizes the data transfer (Figure 13).The MAX3301E SDA line operates as both an input and as an open-drain output. SDA requires a pullup resistor,typically 4.7k Ω. The MAX3301E SCL line only operates as an input. SCL requires a pullup resistor if there are multiple masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output.Each transmission consists of a start condition (see Figure 14) sent by a master device, the MAX3301E 7-bit slave address (determined by the state of ADD), plus an R/W bit (see Figure 15), a register address byte, one or more data bytes, and a stop condition (see Figure 14).Both SCL and SDA assert high when the interface is not busy. A master device signals the beginning of a trans-mission with a start (S) condition by transitioning SDA from high to low while SCL is high. The master issues a stop (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another trans-mission (see Figure 14).Bit TransferOne data bit is transferred during each clock pulse. The data on SDA must remain stable while SCL is high (see Figure 16).Figure 13. 2-Wire Serial Interface Timing DetailsMAX3301EFigure 14. Start and Stop ConditionsM A X 3301ENote 7:Enter suspend mode by driving SUS high or by writing a 1 to suspend (bit 1 in control register 1), depending on the status of spd_susp_ctl in special-function register 1.X = Don’t care.MAX3301EAcknowledgeThe acknowledge bit (ACK) is the 9th bit attached to any 8-bit data word. ACK is always generated by the receiving device. The MAX3301E generates an ACK when receiving an address or data by pulling SDA low during the ninth clock period. When transmitting data,the MAX3301E waits for the receiving device to gener-ate an ACK. Monitoring ACK allows for detection of unsuccessful data transfers. An unsuccessful data transfer occurs if a receiving device is busy or if a sys-tem fault has occurred. In the event of an unsuccessful data transfer, the bus master should reattempt commu-nication at a later time.Slave AddressA bus master initiates communication with a slave device by issuing a START condition followed by the 7-bit slave address (see F igure 15). When idle, theMAX3301E waits for a START condition followed by its slave address. The LSB of the address word is the read/write (R/W ) bit. R/W indicates whether the master is writing to or reading from the MAX3301E (R/W = 0selects the write condition, R/W = 1 selects the read condition). After receiving the proper address, the MAX3301E issues an ACK.The MAX3301E has two possible addresses (see Table 5). Address bits A6 through A1 are preset, while a reset condition or an I 2C general call address loads the value of A0 from ADD. Connect ADD to GND to set A0 to 0.Connect ADD to V L to set A0 to 1. This allows up to two MAX3301Es to share the same bus.Write Byte FormatWriting data to the MAX3301E requires the transmission of at least 3 bytes. The first byte consists of the MAX3301E’s 7-bit slave address, followed by a 0 (R/W bit). The second byte determines which register is to be written to. The third byte is the new data for the selected register. Subsequent bytes are data for sequential reg-isters. Figure 18shows the typical write byte format.Read Byte FormatReading data from the MAX3301E requires the trans-mission of at least 3 bytes. The first byte consists of the MAX3301E’s slave address, followed by a zero (R/W bit). The second byte selects the register from which data is read. The third byte consists of the MAX3301’s slave address, followed by a one (R/W bit). The master then reads one or more bytes of data. Figure 19shows the typical read byte format.Burst-Mode Write Byte FormatThe MAX3301E allows a master device to write to sequential registers without repeatedly sending the slave address and register address each time. The master first sends the slave address, followed by a zero to write data to the MAX3301E. The MAX3301E sends an acknowledge bit back to the master. The master sends the 8-bit register address and the MAX3301E returns an acknowledge bit. The master writes a data byte to the selected register and receives an acknowl-edge bit if a supported register address has been cho-sen. The register address increments and is ready forFigure 16. Bit TransferFigure 17. Acknowledge。

条形码扫描仪的马达及旋转镜组合结构[实用新型专利]

专利名称：条形码扫描仪的马达及旋转镜组合结构专利类型：实用新型专利
发明人：谢孟晏
申请号：CN201020200190.9
申请日：20100518
公开号：CN201673511U
公开日：
20101215
专利内容由知识产权出版社提供
摘要：一种条形码扫描仪的马达及旋转镜组合结构，该组合结构包括一马达及一旋转镜；马达具有一定子及对应定子配置旋转的一转子，转子具有一传动轴及连接传动轴的一环形围板；旋转镜罩盖于转子上，旋转镜具有供传动轴穿接的一轴孔及朝下延伸与环形围板紧密套接的一定位壁；以此，能够将马达与旋转镜牢牢固接并保持平衡稳定。

申请人：阿丹电子企业股份有限公司
地址：中国台湾台北县新店市中正路四维巷2弄2号5楼
国籍：CN
代理机构：北京汇泽知识产权代理有限公司
代理人：程殿军
更多信息请下载全文后查看。

hrs3301规格书

hrs3301规格书【最新版】目录1.HRS3301 规格书概述2.HRS3301 规格书的主要内容3.HRS3301 规格书的特点和优势4.HRS3301 规格书的应用领域5.总结正文一、HRS3301 规格书概述HRS3301 规格书是一份详细的技术文档，它主要描述了一种名为HRS3301 的产品的各项性能、功能、设计参数和测试方法等。

这份规格书旨在为产品设计人员、工程师、测试人员和用户提供全面的技术参考，以便更好地理解和使用 HRS3301 产品。

二、HRS3301 规格书的主要内容HRS3301 规格书主要包括以下几个方面的内容：1.产品概述：介绍 HRS3301 产品的基本信息，如产品名称、型号、功能、应用领域等。

2.功能性能：详细描述 HRS3301 产品的各项功能和性能指标，如工作电压、工作电流、响应时间、传输速率等。

3.设计参数：提供 HRS3301 产品的各项设计参数，如尺寸、重量、材质等，以便产品设计人员进行相关设计。

4.测试方法：介绍 HRS3301 产品的各项测试方法和测试标准，以便测试人员进行产品测试。

5.使用说明：提供 HRS3301 产品的使用方法和注意事项，以便用户正确使用产品。

6.维护保养：介绍 HRS3301 产品的维护保养方法和技巧，以延长产品使用寿命。

三、HRS3301 规格书的特点和优势HRS3301 规格书具有以下几个特点和优势：1.详细的技术描述：规格书对产品的各项性能、功能和设计参数进行了详细的描述，使用户能够全面了解产品。

2.权威的测试方法：规格书提供了权威的测试方法和测试标准，确保产品测试的准确性和可靠性。

3.易懂的使用说明：规格书提供了易懂的使用说明，方便用户正确操作和使用产品。

4.实用的维护保养技巧：规格书介绍了实用的维护保养方法和技巧，有助于延长产品使用寿命。

四、HRS3301 规格书的应用领域HRS3301 规格书主要应用于以下几个领域：1.电子产品设计：为设计人员提供详细的产品性能和设计参数，以便进行相关设计。

TE3301 系列组合式电气火灾监控探测器安装使用说明书

一、概述TE3301系列组合式电气火灾监控探测器(以下简称探测器)根据GB 14287-2014《电气火灾监控系统》标准要求设计，是一款针对电气火灾进行实时监控的探测器。

探测器可通过前端传感器传递的信号自行进行分析，判断出被监控设备的工作状态(即故障状态、报警状态、正常工作状态)，并能够通过总线将实时数据信息传递到电气火灾监控设备上进行集中显示，从而有效预警火灾的发生，最大限度地保障被监控设备的稳定运行。

二、特点1.支持LCD显示并配有多个LED指示灯与按键，便于人机交互。

2.最多同时支持监控8路通道。

3.具有自动识别接入传感器类型（温度/电流）。

4.实时监测传感器工作状态，并能及时将工作信息上传至电气火灾监控设备。

5.支持声光报警且具有一路无源继电器输出。

6.二总线无极性通讯。

7.模块化设计，维护方便。

三、技术参数1.检测对象：剩余电流、温度2.检测范围：剩余电流：0mA~1000mA温度：0℃~140℃报警范围：剩余电流：20mA~1000mA温度：45℃~140℃3.通讯方式：无极性二总线通讯距离：≤1000m（NH-RVS 2×1.5mm²）≤600m（NH-RVS 2×1.0mm²）4.工作电压：交流AC220V/50HZ 或DC24V功耗：≤1W5.安装方式：导轨或面板嵌入式6.外形尺寸：108.0mm×108.0mm×59.0mm（长×宽×高）（嵌入式安装开孔尺寸100.0mm×100.0mm）7.适配监控设备：TE3004电气火灾监控设备8.执行标准：GB 14287.2-2014、GB 14287.3-20149.使用环境：工作温度：-10℃～+55℃相对湿度：≤95%RH（不凝露）四、结构特征与工作原理 1. 结构特征1.1 TE3301系列组合式电气火灾监控探测器及底座的外形尺寸示意图如图1、图2所示。

UM330EEUE技术说明

UM330EEUE技术说明UM330EEUE低压电动机/线路微机型保护测控装置集保护、测量、控制、通讯为一体，与框架断路器、塑壳断路器、接触器、软启动器等低压电器配合，可取代时间继电器、中间继电器、电压继电器、电流继电器、各种电力仪表、指示灯、按钮、可编程控制器(PLC)及变送器等多种分立元件，是智能化MCC和PC的理想选择。

UM330EEUE产品主要特点:集成电路采用多层板和SMT 表面贴装技术，可靠性高，适应于恶劣环境。

具备对EEPROM、AD、5V电源等关键元器件的自诊断功能。

并具有软件陷阱功能，断电记忆功能。

当CPU出现非正常复位时，可自动完成对出口状态、运行状态的再恢复。

对电动机的启动采用无流到有流上升沿识别技术，对装置的跳闸出口采用标志反馈技术，可在任何情况下正确识别电动机当前所处的就绪、启动、运行、停车冷却、停车等相应状态。

端子全部采用插拔式，安装维护方便。

一套装置，既可应用于线路，也可应用于电动机;既可满足接触器、塑壳断路器要求，也可满足框架断路器、软启动器等其它回路要求。

系列装置可满足MNS、GCS、GCK、GGD等不同柜型的安装要求，可直接安装于1/4模数的抽屉柜中。

UM330EEUE环境条件工作环境：应安装在无爆炸危险和无导电尘埃、无足以腐蚀金属和破坏绝缘的地方。

工作环境温度：-10℃~+55℃，且24h的平均值不超过+35℃。

储存环境温度：-25℃~+70℃，相对湿度不大于85%，宜储存于防雨、防雪的室内，周围空气中不含有酸性、碱性或其它腐蚀性及爆炸性气体。

相对湿度：在最高温度为+40℃时相对湿度不超过50%;在较低温度下可以有较高的相对湿度，例如20℃时达90%，因温度变化偶尔产生的凝露，应采取特殊措施。

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

General DescriptionThe MAX3301E/MAX3302E fully integrated USB On-the-Go (OTG) transceivers and charge pumps allow mobile devices such as PDAs, cellular phones, and digital cameras to interface directly with USB peripherals and each other without the need of a host PC. Use the MAX3301E/MAX3302E with an embedded USB host to directly connect to peripherals such as printers or external hard drives.The MAX3301E/MAX3302E integrate a USB OTG trans-ceiver, a V BUS charge pump, a linear regulator, and an I 2C-compatible, 2-wire serial interface. An internal level shifter allows the MAX3301E/MAX3302E to interface with +1.65V to +3.6V logic supply voltages. The MAX3301E/MAX3302E’s OTG-compliant charge pump operates with +3V to +4.5V input supply voltages, and supplies an OTG-compatible output on V BUS while sourcing more than 8mA of output current.The MAX3301E/MAX3302E enable USB OTG communi-cation from highly integrated digital devices that cannot supply or tolerate the +5V V BUS levels that USB OTG requires. The device supports USB OTG session-request protocol (SRP) and host-negotiation protocol (HNP).The MAX3301E/MAX3302E provide built-in ±15kV elec-trostatic-discharge (ESD) protection for the V BUS , ID_IN,D+, and D- terminals. The MAX3301E/MAX3302E are available in 25-bump chip-scale (UCSP™), 25-bump WLP package, 28-pin TQF N, and 32-pin TQF N pack-ages and operate over the extended -40°C to +85°C temperature range.ApplicationsMobile Phones Digital Cameras PDAsMP3 PlayersFeatureso USB 2.0-Compliant Full-/Low-Speed OTG Transceiverso Ideal for USB On-the-Go, Embedded Host, or Peripheral Deviceso ±15kV ESD Protection on ID_IN, V BUS , D+, and D-Terminalso Charge Pump for V BUS Signaling and Operation Down to 3Vo Internal V BUS and ID Comparatorso Internal Switchable Pullup and Pulldown Resistors for Host/Peripheral Functionality o I 2C Bus Interface with Command and Status Registerso Linear Regulator Powers Internal Circuitry and D+/D- Pullup Resistors o Support SRP and HNPMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps________________________________________________________________Maxim Integrated Products1Ordering Information19-3275; Rev 3; 10/07For pricing, delivery, and ordering information,please contact Maxim Direct at 1-888-629-4642,or visit Maxim’s website at .Note:All devices specified over the -40°C to +85°C operating range.‡UCSP bumps are in a 5 x 5 array. The UCSP package size is 2.5mm x 2.5mm x 0.62mm. Requires solder temperature profile described in the Absolute Maximum Ratings section. UCSP reli-ability is integrally linked to the user’s assembly methods, circuit board material and environment. See the UCSP Applications Information section of this data sheet for more information.*Future product—contact factory for availability.**EP = Exposed paddle.T = Tape and reel.+Denotes a lead-free package.Selector GuidePin Configurations appear at end of data sheet.M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge PumpsABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)Note 1:The UCSP package is constructed using a unique set of packaging techniques that impose a limit on the thermal profile the device can be exposed to during board-level solder attach and rework. This limit permits only the use of the solder profiles recom-mended in the industry-standard specification, JEDEC 020A, paragraph 7.6, Table 3 for IR/VPR and convection reflow. Preheating is required. Hand or wave soldering is not allowed.Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.All voltages are referenced to GND.V CC , V L .....................................................................-0.3V to +6V TRM (regulator off or supplied by V BUS )..-0.3V to (V BUS + 0.3V)TRM (regulator supplied by V CC )...............-0.3V to (V CC + 0.3V)D+, D- (transmitter tri-stated)...................................-0.3V to +6V D+, D- (transmitter functional)....................-0.3V to (V CC + 0.3V)V BUS .........................................................................-0.3V to +6V ID_IN, SCL, SDA.......................................................-0.3V to +6V INT , SPD, RESET , ADD, OE/INT , RCV, VP,VM, SUS, DAT_VP, SE0_VM ......................-0.3V to (V L + 0.3V)C+.............................................................-0.3V to (V BUS + 0.3V)C-................................................................-0.3V to (V CC + 0.3V)Short-Circuit Duration, V BUS to GND .........................ContinuousContinuous Power Dissipation (T A = +70°C)25-Bump WLP (derate 12.2mW/°C above +70°C).......976mW 25-Bump UCSP (derate 12.2mW/°C above +70°C)....976mW 32-Pin TQFN (5mm x 5mm x 0.8mm) (derate 21.3mW/°Cabove +70°C).........................................................1702mW 28-Pin TQFN (4mm x 4mm x 0.8mm) (derate 20.8mW/°Cabove +70°C).........................................................1666mW Operating Temperature Range ...........................-40°C to +85°C Junction Temperature......................................................+150°C Storage Temperature Range.............................-65°C to +150°C Lead Temperature (soldering, 10s).................................+300°C Bump Reflow Temperature (Note 1)Infrared (15s)...............................................................+200°C Vapor Phase (20s).......................................................+215°CM MMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps_______________________________________________________________________________________3DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 4_______________________________________________________________________________________DC ELECTRICAL CHARACTERISTICS (continued)(V CC = +3V to +4.5V, V L = +1.65V to +3.6V, C FLYING = 100nF, C VBUS = 1µF, ESR CVBUS = 0.1Ω(max), T A = T MIN to T MAX , unless otherwise noted. Typical values are at V CC = +3.7V, V L = +2.5V, T A = +25°C.) (Note 2)MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps_______________________________________________________________________________________5TIMING CHARACTERISTICSM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 6_______________________________________________________________________________________I 2C-/SMBus™-COMPATIBLE TIMING SPECIFICATIONSNote 3:Guaranteed by bench characterization. Limits are not production tested.Note 4:A master device must provide a hold time of at least 300ns for the SDA signal to bridge the undefined region of SCL’s fallingedge.Note 5:C B is the total capacitance of one bus line in pF, tested with C B = 400pF.Note 6:Input filters on SDA, SCL, and ADD suppress noise spikes of less than 50ns.SMBus is a trademark of Intel Corporation.DRIVER PROPAGATION DELAY HIGH-TO-LOW(FULL-SPEED MODE)MAX3301E toc094ns/divD+1V/divD-1V/divDAT_VP 1V/divDRIVER PROPAGATION DELAY LOW-TO-HIGH(LOW-SPEED MODE)MAX3301E toc08100ns/divD-1V/divD+1V/div DAT_VP 1V/div DRIVER PROPAGATION DELAY HIGH-TO-LOW(LOW-SPEED MODE)MAX3301E toc07100ns/divD+1V/divD-1V/divDAT_VP 1V/div TIME TO EXIT SHUTDOWNMAX3301E toc054μs/div D-1V/divD+1V/divSCL 1V/divV BUS DURING SRP20ns/divV BUS 1V/divV BUS 1V/divC VBUS > 96μFC VBUS > 13μFTIME TO ENTER SHUTDOWNMAX3301E toc04100ns/div D+1V/div D-1V/div SCL 2V/div V BUS OUTPUT VOLTAGE vs. INPUT VOLTAGE (V CC )INPUT VOLTAGE (V CC ) (V)V B U S O U T P U T V O L T A G E (V )5.55.04.54.03.53.04.755.005.255.505.754.502.56.0V BUS OUTPUT VOLTAGE vs. VBUS OUTPUT CURRENTV BUS OUTPUT CURRENT (mA)V B U S O U T P U T V O L T A G E (V )2520151054.254.504.755.005.255.504.0030INPUT CURRENT (ICC )vs. V BUS OUTPUT CURRENTV BUS OUTPUT CURRENT (mA)I N P U T C U R R E N T (I C C ) (m A )16128410203040500020MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumps_______________________________________________________________________________________7Typical Operating Characteristics(Typical operating circuit, V CC = +3.7V, V L = +2.5V, C FLYING = 100nF, T A = +25°C, unless otherwise noted.)SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (m A )603510-150.20.40.60.81.00-4085DRIVER DISABLE DELAY (LOW-SPEED MODE)MAX3301E toc1410ns/divD+1V/divD-1V/divOE/INT 1V/divDRIVER ENABLE DELAY (LOW-SPEED MODE)MAX3301E toc13100ns/divD-1V/divD+1V/div C D+ = C D- = 400pFOE/INT 1V/divDRIVER DISABLE DELAY (FULL-SPEED MODE)MAX3301E toc1210ns/divD+1V/divD-1V/divOE/INT 1V/divDRIVER ENABLE DELAY (FULL-SPEED MODE)MAX3301E toc1110ns/divD-1V/divD+1V/div OE/INT 1V/divDRIVER PROPAGATION DELAY LOW-TO-HIGH(FULL-SPEED MODE)MAX3301E toc104ns/divD-1V/divD+1V/divDAT_VP 1V/div M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 8_______________________________________________________________________________________Typical Operating Characteristics (continued)(Typical operating circuit, V CC = +3.7V, V L = +2.5V, C FLYING = 100nF, T A = +25°C, unless otherwise noted.)MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 10______________________________________________________________________________________Test Circuits and Timing DiagramsFigure 1. Load for Disable Time MeasurementFigure 2. Load for Enable Time, Transmitter Propagation Delay,and Transmitter Rise/Fall TimesMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsTest Circuits and Timing Diagrams (continued)Figure 6. Timing of DAT_VP, SE0_VM to D+, D- in VP_VM Mode (dat_se0 = 0)Figure 7. Timing of DAT_VP, SE0_VM to D+/D- in DAT_SE0Mode (dat_se0 = 1)Figure 8. Enable and Disable TimingFigure 9. D+/D- to RCV, DAT_VP, SE0_VM Propagation Delays(VP_VM Mode)Figure 10. D+/D- to DAT_VP, SE0_VM Propagation Delays (DAT_SE0 Mode)Figure 3. Load for Receiver Propagation Delay and Receiver Rise/Fall TimesFigure 4. Load for DAT_VP, SE0_VM Enable/Disable Time MeasurementsM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps Block DiagramFigure 11. Block DiagramMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsDetailed DescriptionThe USB OTG specification defines a dual-role USB device that acts either as an A device or as a B device.The A device supplies power on V BUS and initially serves as the USB host. The B device serves as the ini-tial peripheral and requires circuitry to monitor and pulse V BUS . These initial roles can be reversed using HNP.The MAX3301E/MAX3302E combine a low- and full-speed USB transceiver with additional circuitry required by a dual-role device. The MAX3301E/MAX3302E employ flexible switching circuitry to enable the device to act as a dedicated host or peripheral USB transceiv-er. For example, the charge pump can be turned off and the internal regulator can be powered from V BUS for bus-powered peripheral applications.The Selector Guide shows the differences between the MAX3301E and MAX3302E. The MAX3301E powers up in its lowest power state and must be turned on by set-ting the sdwn bit to 0. The MAX3302E powers up in the operational, VP/VM USB mode. This allows a micro-processor (µP) to use the USB port for power-on boot-up, without having to access I 2C. To put the MAX3302E into low-power shutdown, set the sdwn bit to 0. In the MAX3302E, special-function register 2 can be addressed at I 2C register location 10h, 11h (as well as locations 16h, 17h) to support USB OTG serial-interface engine (SIE) implementations that are limited to I 2C register addresses between 0h and 15h.TransceiverThe MAX3301E/MAX3302E transceiver complies with the USB version 2.0 specification, and operates at full-speed (12Mbps) and low-speed (1.5Mbps) data rates.Set the data rate with the SPD input. Set the direction of data transfer with the OE/INT input. Alternatively, control transceiver operation with control register 1 (Table 7)and special-function registers 1 and 2 (see Tables 14,15, and 16).Level ShiftersInternal level shifters allow the system-side interface to run at logic-supply voltages as low as +1.65V. Interface logic signals are referenced to the voltage applied to the logic-supply voltage, V L .Charge PumpThe MAX3301E/MAX3302E’s OTG-compliant charge pump operates with +3V to +4.5V input supply voltages (V CC ) and supplies a +4.8V to +5.25V OTG-compatible output on V BUS while sourcing the 8mA or greater out-put current that an A device is required to supply.Connect a 0.1µF flying capacitor between C+ and C-.Bypass V BUS to GND with a 1µF to 6.5µF capacitor, inaccordance with USB OTG specifications. The charge pump can be turned off to conserve power when not used. Control of the charge pump is set through the vbus_drv bit (bit 5) of control register 2 (see Table 8).Linear Regulator (TRM)An internal 3.3V linear regulator powers the transceiver and the internal 1.5k ΩD+/D- pullup resistor. Under the control of internal register bits, the linear regulator can be powered from V CC or V BUS . The regulator power-supply settings are controlled by the reg_sel bit (bit 3) in special-function register 2 (Tables 15 and 16). This flexibility allows the system designer to configure the MAX3301E/MAX3302E for virtually any USB power situation.The output of the TRM is not a power supply. Do not use as a power source for any external circuitry. Connect a 1.0µF (or greater) ceramic or plastic capacitor from TRM to GND, as close to the device as possible.V BUS Level-Detection ComparatorsComparators drive interrupt source register bits 0, 1,and 7 (Table 10) to indicate important USB OTG V BUS voltage levels:•V BUS is valid (vbus_vld)•USB session is valid (sess_vld)•USB session has ended (sess_end)The vbus_valid comparator sets vbus_vld to 1 if V BUS is higher than the V BUS valid comparator threshold. The V BUS valid status bit (vbus_vld) is used by the A device to determine if the B device is sinking too much current (i.e., is not supported). The session_valid comparator sets sess_vld to 1 if V BUS is higher than the session valid comparator threshold. This status bit indicates that a data transfer session is valid. The session_end com-parator sets sess_end to 1 if V BUS is higher than theFigure 12. Comparator Network DiagramM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumpssession end comparator threshold. Figure 12 shows the level-detector comparators. The interrupt-enable regis-ters (Tables 12 and 13) determine whether a falling or rising edge of V BUS asserts these status bits.ID_INThe USB OTG specification defines an ID input that determines which dual-role device is the default host.An OTG cable connects ID to ground in the connector of one end and is left unconnected in the other end.Whichever dual-role device receives the grounded end becomes the A device. The MAX3301E/MAX3302E pro-vide an internal pullup resistor on ID_IN. Internal com-parators detect if ID_IN is grounded or left floating.Interrupt LogicWhen OTG events require action, the MAX3301E/MAX3302E provide an interrupt output signal on INT .Alternatively, OE/INT can be configured to act as an interrupt output while the device operates in USB sus-pend mode. Program INT and OE/INT as open-drain or push-pull interrupts with irq_mode (bit 1 of special-func-tion register 2, see Tables 15 and 16).V BUS Power ControlV BUS is a dual-function port that powers the USB bus and/or provides a power source for the internal linear reg-ulator. The V BUS power-control block performs the various switching functions required by an OTG dual-role device.These actions are programmed by the system logic using bits 5 to 7 of control register 2 (see Table 8) to:•Discharge V BUS through a resistor•Provide power-on or receive power from V BUS •Charge V BUS through a resistorThe OTG supplement allows an A device to turn V BUS off when the bus is not being used to conserve power.The B device can issue a request that a new session be started using SRP. The B device must discharge V BUS to a level below the session-end threshold (0.8V) to ensure that no session is in progress before initiating SRP. Setting bit 6 of control register 2 to 1, discharges V BUS to GND through a 5k Ωcurrent-limiting resistor.When V BUS has discharged, the resistor is removed from the circuit by resetting bit 6 of control register 2. An OTG A device is required to supply power on V BUS .The MAX3301E/MAX3302E provide power to V BUS from V CC or from the internal charge pump. Set bit 5 in control register 2 to 1 in both cases. Bit 5 in control register 2controls a current-limited switch, preventing damage to the device in the event of a V BUS short circuit.An OTG B device (peripheral mode) can request a ses-sion using SRP. One of the steps in implementing SRP requires pulsing V BUS high for a controlled time. A 930Ωresistor limits the current according to the OTG specifi-cation. Pulse V BUS through the pullup resistor by assert-ing bit 7 of control register 2. Prior to pulsing V BUS (bit 7), a B device first connects an internal pulldown resis-tor to discharge V BUS below the session-end threshold.The discharge current is limited by the 5k Ωresistor and set by bit 6 of control register 2. An OTG A device mustMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge Pumpssupply 5V power and at least 8mA on V BUS . Setting bit 5 of control register 2 turns on the V BUS charge pump.Operating ModesThe MAX3301E/MAX3302E have four operating modes to optimize power consumption. Only the I 2C interface remains active in shutdown mode, reducing supply cur-rent to 1µA. The I 2C interface, the ID_IN port, and the session-valid comparator all remain active in interrupt shutdown mode. RCV asserts low in suspend mode; how-ever, all other circuitry remains active. Table 1 lists the active blocks’ power in each of the operating modes.Applications InformationData TransferTransmitting Data to the USBThe MAX3301E/MAX3302E transceiver features two modes of transmission: DAT_SE0 or VP_VM (see Table 3).Set the transmitting mode with dat_se0 (bit 2 in control register 1, see Table 7). In DAT_SE0 mode with OE/INT low, DAT_VP specifies data for the differential transceiv-er, and SE0_VM forces D+/D- to the single-ended zero (SE0) state. In VP_VM mode with OE/INT low, DAT_VP drives D+, and SE0_VM drives D-. The differential receiver determines the state of RCV.Receiving Data from the USBThe MAX3301E/MAX3302E transceiver features two modes of receiving data: DAT_SE0 or VP_VM (see Table 4). Set the receiving mode with dat_se0 (bit 2 in control register 1, see Table 7). In DAT_SE0 mode with OE/INT high, DAT_VP is the output of the differential receiver and SE0_VM indicates that D+ and D- are both logic-low. In VP_VM mode with OE/INT high, DAT_VP provides the input logic level of D+ and SE0_VM pro-vides the input logic level of D-. The differential receiver determines the state of RCV. VP and VM echo D+ and D-, respectively.OE/INTOE/INT controls the direction of communication. OE/INT can also be programmed to act as an interrupt output when in suspend mode. The output-enable portion con-trols the input or output status of DAT_VP/SE0_VM and D+/D-. When OE/INT is a logic 0, DAT_VP and SE0_VM function as inputs to the D+ and D- outputs in a method depending on the status of dat_se0 (bit 2 in control reg-ister 1). When OE/INT is a logic 1, DAT_VP and SE0_VM indicate the activity of D+ and D-.OE/INT functions as an interrupt output when the MAX3301E/MAX3302E is in suspend mode and oe_int_en = 1 (bit 5 in control register 1, see Table 7). Inthis mode, OE/INT detects the same interrupts as INT .Set irq_mode (bit 1 in special-function register 2, see Tables 15 and 16) to 0 to program OE/INT as an open-drain interrupt output. Set irq_mode to 1 to configure OE/INT as a push-pull interrupt output.RCVRCV monitors D+ and D- when receiving data. RCV is a logic 1 for D+ high and D- low. RCV is a logic 0 for D+low and D- high. RCV retains its last valid state when D+and D- are both low (single-ended zero, or SE0). RCV asserts low in suspend mode. Table 4 shows the state of RCV.SPDUse hardware or software to control the slew rate of the D+ and D- terminals. The SPD input sets the slew rate of the MAX3301E/MAX3302E when spd_susp_ctl (bit 1 in special-function register 1, see Table 14) is 0. Drive SPD low to select low-speed mode (1.5Mbps). Drive SPD high to select full-speed mode (12Mbps). Alternatively,when spd_susp_ctl (bit 1 of special-function register 1)is 1, software controls the slew rate. The SPD input is ignored when using software to control the data rate.The speed bit (bit 0 of control register 1, see Table 7)sets the slew rate when spd_susp_ctl = 1.SUSUse hardware or software to control the suspend mode of the MAX3301E/MAX3302E. Set spd_susp_ctl (bit 1 of special-function register 1, see Table 14) to 0 to allow the SUS input to enable and disable the suspend mode of the MAX3301E/MAX3302E. Drive SUS low for normal operation. Drive SUS high to enable suspend mode.RCV asserts low in suspend mode while all other circuit-ry remains active.Alternatively, when the spd_susp_ctl bit (bit 1 of special-function register 1) is set to 1, software controls the sus-pend mode. Set the suspend bit (bit 1 of control register 1, see Table 7) to 1 to enable suspend mode. Set the suspend bit to 0 to resume normal operation. The SUS input is ignored when using software to control suspend mode. The MAX3301E/MAX3302E must be in full-speed mode (SPD = high or speed = 1) to issue a remote wake-up from the device when in suspend mode. RESETThe active-low RESET input allows the MAX3301E/MAX3302E to be asynchronously reset without cycling the power supply. Drive RESET low to reset the internal registers (see Tables 7–16 for the default power-up states). Drive RESET high for normal operation.M A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge Pumps 2-Wire I 2C-Compatible Serial InterfaceA register file controls the various internal switches and operating modes of the MAX3301E/MAX3302E through a simple 2-wire interface operating at clock rates up to 400kHz. This interface supports data bursting, where multiple data phases can follow a single address phase.UART ModeSet uart_en (bit 6 in control register 1) to 1 to place the MAX3301E/MAX3302E in UART mode. D+ transfers data to DAT_VP and SE0_VM transfers data to D- in UART mode.General-Purpose Buffer ModeSet gp_en (bit 7 in special-function register 1) and dat_se0 (bit 2 in control register 1) to 1, set uart_en (bit 6in control register 1) to 0, and drive OE/INT low to place the MAX3301E/MAX3302E in general-purpose buffer mode. Control the direction of data transfer with dmi-nus_dir and dplus_dir (bits 3 and 4 of special-function register 1, see Tables 2 and 14).Serial AddressingThe MAX3301E/MAX3302E operate as a slave device that sends and receives control and status signals through an I 2C-compatible 2-wire interface. The inter-face uses a serial data line (SDA) and a serial clock line (SCL) to achieve bidirectional communication between master(s) and slave(s). A master (typically a microcon-troller) initiates all data transfers to and from the MAX3301E/MAX3302E and generates the SCL clock that synchronizes the data transfer (Figure 13).The MAX3301E/MAX3302E SDA line operates as both an input and as an open-drain output. SDA requires aMAX3302E SCL line only operates as an input. SCL requires a pullup resistor if there are multiple masters on the 2-wire interface, or if the master in a single-master system has an open-drain SCL output.Each transmission consists of a start condition (see F igure 14) sent by a master device, the MAX3301E/MAX3302E 7-bit slave address (determined by the state of ADD), plus an R/W bit (see F igure 15), a register address byte, one or more data bytes, and a stop condi-tion (see Figure 14).Figure 13. 2-Wire Serial-Interface Timing DetailsMAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsFigure 14. Start and Stop ConditionsFigure 15. Slave AddressM A X 3301E /M A X 3302EUSB On-the-Go Transceivers and Charge PumpsNote 7:Enter suspend mode by driving SUS high or by writing a 1 to suspend (bit 1 in control register 1), depending on the status of spd_susp_ctl in special-function register 1.X = Don’t care.MAX3301E/MAX3302EUSB On-the-Go Transceivers and Charge PumpsStart and Stop ConditionsBoth SCL and SDA assert high when the interface is not busy. A master device signals the beginning of a trans-mission with a start (S) condition by transitioning SDA from high to low while SCL is high. The master issues a stop (P) condition by transitioning SDA from low to high while SCL is high. The bus is then free for another trans-mission (see Figure 14).Bit TransferOne data bit is transferred during each clock pulse. The data on SDA must remain stable while SCL is high (see Figure 16).AcknowledgeThe acknowledge bit (ACK) is the 9th bit attached to any 8-bit data word. ACK is always generated by the receiving device. The MAX3301E/MAX3302E generatean ACK when receiving an address or data by pulling SDA low during the ninth clock period. When transmit-ting data, the MAX3301E/MAX3302E wait for the receiv-ing device to generate an ACK. Monitoring ACK allows for detection of unsuccessful data transfers. An unsuc-cessful data transfer occurs if a receiving device is busy or if a system fault has occurred. In the event of an unsuccessful data transfer, the bus master should reat-tempt communication at a later time.Slave AddressA bus master initiates communication with a slave device by issuing a START condition followed by the 7-bit slave address (see F igure 15). When idle, the MAX3301E/MAX3302E wait for a START condition fol-lowed by its slave address. The LSB of the address word is the read/write (R/W ) bit. R/W indicates whether the master is writing to or reading from the MAX3301E/MAX3302E (R/W = 0 selects the write con-dition, R/W = 1 selects the read condition). After receiving the proper address, the MAX3301E/MAX3302E issue an ACK.The MAX3301E/MAX3302E have two possible addresses (see Table 5). Address bits A6 through A1 are preset,while a reset condition or an I 2C general call address loads the value of A0 from ADD. Connect ADD to GND to set A0 to 0. Connect ADD to V L to set A0 to 1. This allows up to two MAX3301E’s or two MAX3302E’s to share the same bus.Write Byte FormatWriting data to the MAX3301E/MAX3302E requires the transmission of at least 3 bytes. The first byte consists of the MAX3301E/MAX3302E’s 7-bit slave address, fol-lowed by a 0 (R/W bit). The second byte determines which register is to be written to. The third byte is the new data for the selected register. Subsequent bytes are data for sequential registers. F igure 18 shows the typical write byte format.Read Byte FormatReading data from the MAX3301E/MAX3302E requires the transmission of at least 3 bytes. The first byte con-sists of the MAX3301E/MAX3302E’s slave address, fol-lowed by a 0 (R/W bit). The second byte selects the register from which data is read. The third byte consistsFigure 16. Bit TransferFigure 17. Acknowledge。