日本汉高高温银胶规格书
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ECCOBOND C-990J #584
ELECTRICALLY CONDUCTIVE EPOXY ADHESIVE FOR
<#584U/Oct.98>
Technical Data
DISCRIPTION: 1. Low temperature (150ﾟC / 1 hr) cure 2. Less voids under the die 3. Low levels of extractable ionic contaminants 4. Suitable for screen print or pin transfer
CURE SCHEDULE: 150℃/1hr 275℃/60sec
Oven cure Heater block
PHYSICAL PROPERTIES: Color Viscosity (@25ﾟC) Silver content
Silver 25,000 cps (BF : #TC, 10 rpm) 70－80 %
Volume resistivity Chloride content Sodium content
0.0002Ω-cm ＜20 ppm ＜10 ppm
Glass transition temp
120℃
CTE
α1 : 5.5×10-5
α2 : 14.0×10-5
Potassium content
＜10 ppm
Tensile shear strength
80 Kg/c㎡ (Al to Al)
Ammonium content
＜10 ppm
Die shear strength (@25ﾟC) 6.0 Kg (50X50 mils chip)
(@200ﾟC) 1.2 Kg (100X100 mils chip)
Thermal conductivity(25℃) 1.27 Kcal/m. Hr. ﾟC
SHELF LIFE: Storage temp Shelf life
0℃ 6 month
25℃ 3 weeks
40℃ 2 days
Emerson & Cuming
a National Starch & Chemical Company 100 Kaneda, Atsugi-shi Kanagawa-ken 243-0807 Japan
TEL : (81) 46-225-8820 / FAX : (81) 46-2-22-1347