Performance Evaluation of a Radio Wave Propagation Parallel Simulator

合集下载

复杂电磁环境下武器装备试验与评估

复杂电磁环境下武器装备试验与评估

复杂电磁环境下武器装备试验与评估Chapter 1: Introduction- Background and significance- Research purpose and objectives- Research questions and hypotheses- Overview of research methodsChapter 2: Literature Review- Overview of electromagnetic environment- Characterization of complex electromagnetic environment- Impacts of electromagnetic environment on weapon systems- Methods and techniques for electromagnetic testing and evaluation- Challenges and limitations of testing in complex electromagnetic environmentChapter 3: Research Methodology- Research design and approach- Data collection methods and instruments- Data analysis techniques and tools- Ethical considerationsChapter 4: Results and Findings- Description of the electromagnetic test environment- Analysis of the test data and results- Evaluation of the weapon systems' performance in the complex electromagnetic environment- Identification of the strengths and weaknesses of the weapon systemsChapter 5: Conclusions and Recommendations- Summary of the research findings and results- Implications and contributions of the study- Limitations of the study and suggestions for future research- Recommendations for improving weapon systems performance in complex electromagnetic environmentChapter 1: Introduction Background and Significance:In modern warfare, electronic warfare has become an integral part of military operations. Electronic Warfare involves the use of electromagnetic spectrum to gain advantage over the opponent, and this makes the electromagnetic environment (EME) a critical aspect of modern weapon system design. However, the increasing complexity of the electromagnetic environment has created several challenges in testing and evaluating weapon systems. This research aims to assess the performance of weapon systems in a complex electromagnetic environment.Research Purpose and Objectives:The purpose of this research is to evaluate the performance of weapon systems in a complex electromagnetic environment. The specific objectives of this research are:1. To characterize the complex electromagnetic environment in which modern weapon systems operate.2. To evaluate the impacts of the electromagnetic environment on weapon system performance.3. To examine the methods and techniques used in testing and evaluating weapon systems in complex electromagnetic environments.4. To identify the strengths and weaknesses of weapon systems operating in a complex electromagnetic environment.Research Questions and Hypotheses:The research questions to be addressed in this study are as follows: 1. What are the characteristics of complex electromagnetic environments in which modern weapon systems operate?2. How does the electromagnetic environment impact weapon system performance?3. What testing and evaluation methods and techniques are best suited for evaluating weapon systems in complex electromagnetic environments?4. What are the strengths and weaknesses of weapon systems operating in complex electromagnetic environments?The null hypotheses for this research are:1. The electromagnetic environment has no significant impact on weapon system performance.2. The current methods and techniques used in testing weapon systems in complex electromagnetic environments are adequate.3. Weapon systems operating in complex electromagnetic environments have no inherent weaknesses.Overview of Research Methods:To evaluate weapon systems' performance in a complex electromagnetic environment, this research will utilize a mixed approach that involves both qualitative and quantitative data collection and analysis. Data will be collected through acombination of literature review, surveys, interviews, and simulation studies. The collected data will be analyzed using appropriate statistical and qualitative analysis methods. The results of the analysis will be used to draw conclusions and make recommendations for improving the performance of weapon systems operating in complex electromagnetic environments.In summary, this chapter has introduced the research background and significance, research purpose and objectives, research questions and hypotheses, and the research methods that will be used in this study. The next chapter will provide a comprehensive literature review of the electromagnetic environment and its impact on weapon systems.Chapter 2: Literature Review Introduction:The electromagnetic environment (EME) is defined as the physical space in which electromagnetic energy is present, and it includes all frequencies of the electromagnetic spectrum. The EME is a complex and dynamic environment, and understanding it is critical to the design and evaluation of weapon systems. In this literature review, we will examine the characteristics of the EME and its impact on weapon systems.Characteristics of the Electromagnetic Environment:The EME is a complex environment with a wide range of physical and environmental factors that affect the propagation of electromagnetic waves. The EME includes natural sources of electromagnetic radiation, such as the sun, as well as man-made sources, including radio and television broadcasting, telephone and data communication, and electronic warfare systems. The EMEcan also be influenced by environmental factors such as temperature, humidity, and atmospheric pressure.The EME can be characterized by several factors, including frequency, power density, polarization, bandwidth, and direction of arrival. Frequency is the number of waves that pass a fixed point per unit time, and it is measured in hertz (Hz). Power density is the amount of electromagnetic energy that passes through a unit area in a specified time, and it is measured in watts per square meter (W/m²). Polarization refers to the orientation of electric and magnetic fields in an electromagnetic wave. Bandwidth refers to the range of frequencies that a system can receive or transmit. Direction of arrival refers to the direction from which an electromagnetic wave arrives at a receiving antenna.Impact of the Electromagnetic Environment on Weapon Systems: The EME can have a significant impact on the performance of weapon systems, especially those that rely on the use of the electromagnetic spectrum. The electromagnetic radiation from civilian and military sources can cause interference or jamming that can disrupt the operation of weapon systems. In addition, the use of electronic warfare systems can create a hostile electromagnetic environment that can compromise the performance of weapon systems.Weapon systems' susceptibility to the electromagnetic environment can also depend on their design and architecture. For example, some weapon systems may be more prone to interference or jamming due to the frequency range they operate in or the design of their antennas. The susceptibility of weapon systems to theelectromagnetic environment can be evaluated through testing and evaluation in a controlled environment.Methods and Techniques for Testing and Evaluating Weapon Systems in the Electromagnetic Environment:There are several methods and techniques used to test and evaluate weapon systems in the electromagnetic environment. These include simulation studies, laboratory testing, and field testing. Simulation studies involve the use of computer programs to simulate the electromagnetic environment and evaluate the performance of weapon systems in that environment. Laboratory testing involves the use of specialized equipment to create a controlled electromagnetic environment and evaluate weapon system performance. Field testing involves the use of weapon systems in real-world scenarios to assess their performance in actual electromagnetic environments.Strengths and Weaknesses of Weapon Systems Operating in the Electromagnetic Environment:The strengths and weaknesses of weapon systems operating in the electromagnetic environment can depend on several factors. The design and architecture of the weapon system can impact its resistance to interference and jamming. In addition, the use of advanced technologies such as adaptive signal processing and frequency hopping can increase the resilience of weapon systems to electromagnetic interference.However, weaknesses in the electromagnetic environment can compromise weapon system performance. Electronic warfare systems and other sources of electromagnetic radiation can causeinterference or jamming, reducing the effectiveness of weapon systems. Moreover, the increasing complexity of the electromagnetic environment makes it difficult to predict the impact of the environment on weapon system performance. Conclusion:The electromagnetic environment is a critical aspect of modern weapon system design and evaluation. The EME is a complex and dynamic environment that can impact weapon system performance in various ways. Weapon systems' susceptibility to the electromagnetic environment can depend on their design and architecture, and their resistance to interference and jamming can be improved through the use of advanced technologies. There are several methods and techniques used to test and evaluate weapon systems in the electromagnetic environment, and field testing is essential for assessing weapon systems' performance in actual electromagnetic environments.Chapter 3: Impact of the Electromagnetic Environment on Specific Weapon Systems Introduction:In this chapter, we will examine the impact of the electromagnetic environment on specific weapon systems. The performance of different weapon systems can be affected in different ways by the electromagnetic environment, and understanding these effects is vital for weapon system design and evaluation.Impact of the Electromagnetic Environment on Radar Systems: Radar systems rely heavily on the use of the electromagnetic spectrum to detect and track targets. The susceptibility of radar systems to the electromagnetic environment can depend on severalfactors, including the type of radar system, the frequency range it operates in, and the design of its antenna.The electromagnetic environment can affect radar systems in several ways. Interference from other sources of electromagnetic radiation can lead to false readings or cause a loss of target tracking. Jamming from electronic warfare systems can also compromise the performance of radar systems.The impact of the electromagnetic environment on radar systems can be mitigated through the use of advanced signal processing techniques, such as adaptive beamforming and frequency agility. These techniques can increase a radar system's ability to operate in a hostile electromagnetic environment.Impact of the Electromagnetic Environment on Communications Systems:Communications systems also rely heavily on the use of the electromagnetic spectrum, especially in the areas of radio and satellite communications. Interference from other sources of electromagnetic radiation can reduce the quality and clarity of communication signals, leading to missed or misinterpreted information.Electronic warfare systems and other sources of electromagnetic radiation can also cause intentional jamming of communication signals, compromising the ability of military personnel to communicate effectively. The impact of the electromagnetic environment on communications systems can be mitigated through the use of frequency hopping and other advanced signal processingtechniques.Impact of the Electromagnetic Environment on Guided Missiles: Guided missile systems use guidance systems that rely on electromagnetic signals to reach and track their targets. The electromagnetic environment can impact the performance of guided missile systems, especially when the enemy deploys countermeasures such as jamming or deception.Advanced missile guidance systems can incorporate advanced signal processing techniques like multiple mode signal processing and adaptive filtering to increase the resilience of the missile to countermeasures in the electromagnetic environment. These techniques can help the missile maintain accuracy and target tracking despite interference or jamming.Impact of the Electromagnetic Environment on Unmanned Aerial Systems (UAS):UAS systems, commonly called "drones," rely heavily on the use of the electromagnetic spectrum to communicate with operators and to maintain their position and orientation in the air. The electromagnetic environment can impact the connectivity and communication quality of UAS systems, reducing their ability to transmit critical information.Interference from other sources of electromagnetic radiation, including other UAS or radio stations, can cause loss of communication signals and reduce UAS system performance. Advanced signal processing techniques, like multiple-input and multiple-output signal processing or time-reversal, can improve theconnectivity and communication quality of UAS systems in the electromagnetic environment.Conclusion:The electromagnetic environment can impact the performance of specific weapon systems, including radar, communication, guided missile, and unmanned aerial systems. The susceptibility of these systems to electromagnetic interference and jamming can depend on their design and architecture, and their resilience to interference can be improved through the use of advanced signal processing techniques. Understanding the impact of the electromagnetic environment on specific weapon systems is critical for system design and evaluation, to ensure that these systems can operate effectively in a changing and complex electromagnetic environment.Chapter 4: Mitigating the Impact of the Electromagnetic Environment on Weapon Systems Introduction:In the previous chapter, we explored how the electromagnetic environment can impact specific weapon systems. In this chapter, we will focus on various techniques that can be used to mitigate these effects and enhance the resiliency of weapon systems to operate in adverse electromagnetic environments.Frequency Agility:Frequency agility involves rapidly changing the frequency of the electromagnetic signal transmitted or received by a weapon system. It can help the system adapt to changes in the electromagnetic environment, making it difficult for an adversary to jam the system. This technique is commonly used in radar and communicationsystems.Electronic Counter-Counter-Measures (ECCM):ECCM involves the use of methods to detect and counter electronic warfare systems deployed by an adversary. It can be used to identify and mitigate jamming attempts or other forms of electromagnetic interference. ECCM techniques can include digital processing or adaptive filtering, which can effectively remove unwanted signals or distortions in a system's data.Multiple-Input, Multiple-Output (MIMO) Signal Processing: MIMO signal processing involves the use of multiple antennas to transmit and receive signals simultaneously. It can improve the resiliency of a system to interference and improve its accuracy and performance by reducing signal fading or distortion. This technique is used in both radar and communication systems. Adaptive Beamforming:Adaptive beamforming involves the use of algorithms that can adjust the direction or shape of an antenna pattern. It can enhance the ability of a system to detect and track targets in adverse electromagnetic environments. The technique can be used in both radar and communication systems to improve their resiliency to interference.Time-Reversal Signal Processing:Time-reversal signal processing involves the use of a signal that is transmitted, receives a reflection from the target, and then retraces its path back to its point of origin. This technique can help to overcome the effects of multipath interference in a communicationsystem, allowing it to transmit or receive data more effectively. Conclusion:The electromagnetic environment poses a significant challenge to the effective operation of weapon systems. However, by using advanced signal processing techniques like frequency agility, ECCM, MIMO signal processing, adaptive beamforming, and time-reversal signal processing, weapon systems can improve their resiliency to interference and maintain their accuracy and performance even in adverse electromagnetic environments. The selection of the right technique or combination of techniques depends on the type of system under consideration and the nature of the electromagnetic environment it is expected to operate in. It is crucial to continue advancing technical capabilities to ensure that weapon systems can adapt to an ever-changing electromagnetic environment and continue to deliver the necessary capabilities to the military.Chapter 5: Future Developments in Electromagnetic WarfareIntroduction:As technology advances and new threats emerge, the field of electromagnetic warfare is constantly evolving. Developments in electronic warfare technology are advancing at a rapid pace and changing the nature of modern warfare. In this chapter, we will explore some of the emerging technologies and techniques that are likely to shape the future of electromagnetic warfare.High-Powered Microwave Weapons:High-powered microwave weapons (HPM) are a type of electronic warfare system that uses intense bursts of electromagnetic energyto disrupt or damage electronic equipment. They are being developed for use in a range of applications, including disabling enemy missile systems and disrupting communication networks. HPM weapons could provide a potent new tool for military forces in future conflicts.Quantum Cryptography:Quantum cryptography is an emerging technology that offers a new level of security for electronic communications. It uses the principles of quantum mechanics to create encryption keys that can be shared securely between users. Quantum cryptography offers the potential to ensure secure communications even in the face of sophisticated electronic warfare attacks.Artificial Intelligence (AI) in Electronic Warfare:The use of AI in electronic warfare is likely to become increasingly important in the years to come. AI has the potential to optimize sweep rates, spectrum allocation, and signal processing, improving the accuracy and efficiency of electronic warfare systems. AI algorithms could also help to automate the process of identifying and responding to electronic threats.Directed Energy Weapons:Directed energy weapons (DEW) are devices that use electromagnetic waves to destroy or disable enemy targets. They could be a game-changer in electronic warfare, providing a way to disable enemy missile systems or destroy aircraft from long range. DEW systems are being developed for use on both land and sea, and their effectiveness is likely to grow as technology improves.Autonomous Electronic Warfare Systems:Autonomous electronic warfare (EW) systems are another emerging technology in the field. These systems would be able to detect, identify, and respond to electronic threats without human intervention, allowing for faster and more effective responses to electronic attacks. Autonomous EW systems could help to improve the overall resilience of military forces to electronic warfare. Conclusion:The field of electronic warfare is rapidly evolving, and new technologies and techniques are constantly emerging. High-powered microwave weapons, quantum cryptography, AI in electronic warfare, directed energy weapons, and autonomous electronic warfare systems are just a few examples of the developments that are likely to shape the future of electromagnetic warfare. As these technologies continue to advance, the importance of electronic warfare in modern conflicts is likely to grow. It will be essential for military forces to stay on top of these developments and work to stay one step ahead of potential adversaries.。

初中英语教师刷题练习 11

初中英语教师刷题练习 11

绝密★启封前刷题练习 11.27英语考生注意:1.考试时间120分钟, 试卷满分150分。

2.本考试设试卷和答题纸两部分。

试卷分为第I卷(第1-12页)和第II卷(第13页),全卷共13页。

所有答题必须涂(选择题)或写(非选择题)在答题纸上,做在试卷上一律不得分。

答题前,务必在答题纸上填写准考证号和姓名,并将核对后的条形码贴在指定位置上,在答题纸反而清楚地填写姓名。

第I卷(共103分)Listening ComprehensionSection ADirections: In Section A, you will hear ten short conversations between two speakers. At the end of each conversation, a question will be asked about what was said. The conversations and the questions will be spoken only once. After you hear a conversation and the question about it, read the four possible answers on your paper, and decide which one is the best answer to the question you have heard.1.A.He knows who is knocking. B.He is eager to know who it is.C.He doesn’t want to open the door. D.He is ready to open the door.2.A.By plane. B.By bus. C.By taxi. D.By train.3.A.$100. B.$200. C.$300. D.$400.4.30.A.She went to cinema. B.She went to an exhibition.C.She stayed at home. D.She stayed with her classmates.5.A.In a doctor’s office. B.In a professor’s office.C.In an operating room. D.In an emergency ward.6.A.The man paid the tuition for learning physics. B.The man got a lot of money for his hard work.C.His hard work was not rewarding at all. D.His work before the test led to a good result.7.A.A furnished house. B.A recent book. C.A further study. D.A new record.34.A.They will go swimming. B.They will climb mountains.C.They will buy some clothes. D.They will forecast the weather conditions.8.A.He has another lecture to attend.B.He has no interest in the lecture.C.He’s attended the same lecture given by Professor Wilson bef ore.D.He might miss the lecture, if the woman didn’t remind him.9.A.She fully agrees with the man. B.They are uncertain about the weather.C.She disagrees with the man. D.She thought the man was always late.10.A. She fully agrees with the man.B. They are uncertain about the weather.C. She disagrees with the man.D. She thought the man was always late.Section BDirections: In Section B, you will hear one longer conversation and two short passages, and you will be asked several questions on each of the conversation and the passages. The conversation and the passages will be read twice, but the questions will be spoken only once. When you hear a question, read the four possible answers on your paper and decide which one would be the best answer to the question you have heard.Questions 11 through 13 are based on the following dialogue.Questions 11 through 13 are based on the following passage.11.A.People are encouraged to be a craftsman.B.Learning woodworking is not as hard as you think.C.Learning woodworking will help you know more people.D.Taking a class in woodworking will be very helpful.12.A.Because I am a talent in this art and want to share it with others.B.Because I am interested in it and want to show it to others.C.Because I wonder how to pick materials and how to do it well.D.Because it’s a good way to know more people interested in it.13.A.You can expect to do woodworking perfectly the very first time. B.Doing woodworking means being alone for long.C.You can also learn from other people interested in woodworking. D.Taking a class in woodworking costs a lot of money.Questions 14 through 16 are based on the following passage.14.A.To analyze causes and effects of using a credit card.B.To encourage people to borrow money from banks.C.To let people know the responsibility in using a credit card.D.To present the effect of computers in popularizing the use of credit cards. 15.A.The development of computers.B.People’s greediness for more money.C.People’s needs for less paper money.D.People’s learning to be more responsible.16.A.To learn to be responsible by using credit cards.B.To stop using credit cards and borrow money from friends or relatives. C.To pay money back as fast as possible after using credit cards.D.To stop borrowing money and use your own funds for shopping. Questions 17 through 20 are based on the following passage.17.A.A newspaper. B.An advertisement company.C.A cleanup company. D.A market.18.A.She wants to spare more room for something new.B.She wants to turn their old stuff into cash at a low cost.C.She knows that the sales consultant before the man does.D.She just wants to clean up their house.19.A.Rudy is likely to buy their stuff.B.Rudy will come and take their stuff away.C.Rudy plays guitar as well as the man.D.Rudy will help them with the ad and the sale.20.A.His old guitar.B.Their appliances, jewelry, furniture and exercise equipment.C.The spring cleanup sale.D.The low cost of ad and friendly service.II. Grammar and VocabularySection ADirections: After reading the passages below, fill in the blanks to make the passages coherent and grammatically correct. For the blanks with a given word, fill in each blank with the proper form. of the given word; for the other blanks, use one word that best fits each blank.A painter hangs his or her finished pictures on a wall, and everyone can see it. A composer writes a work, but no one can hear it 21.it is performed. Professional singers and players have great responsibilities, for the composer is absolutely dependent on them. A student of music needs as long and as tough a training to become a performer as a medical student needs22.(become)a doctor. Most training is concerned23.technique, for musicians have to be as muscularly skillful as an athlete or a ballet dancer. Singers practice breathing every day, as their vocal chords(声带)would be inadequate without24.(control)muscular support. String players practice moving the fingers of the left hand up and down, while drawing the bow back and forth with the right arm,25.are two entirely different movements.Singers and instruments have to be able to get every note perfectly in tune. Pianists 26.(spare)this particular anxiety, for the notes are already there, and it is the piano tuner’s responsibility to tune the instrument for27.. But they have their own difficulties; the hammers that hit the string must be dealt with carefully not to sound like drum or bass, and each tone, even if played very fast, has to sound clear.The problem28.(face)student conductors is that they have to learn to know every note of the music and29.it should sound, and they need to aim at controlling these sound with enthusiastic but selfless authority.Technique is of no use unless it is combined with musical knowledge and understanding. Great artists are those who are so thoroughly at home in the language of music30.they canenjoy performing works written in any century.Section BDirections: Fill in each blank with a proper word chosen from the box. Each word can beDear Admissions Committee,I had the pleasure of teaching Sara in her 11th grade honors English class at Mark Twain High School. From the first day of class, Sara impressed me with her ability to clearly explain difficult 31.and texts, her sensitivity to the slight differences within literature, and her passion for reading, writing, and creative expression— both in and out of the classroom. Sara is a talented literary critic and poet, and she has my highest 32.as a student and writer.Sara is talented at considering the elegances within literature and the 33.behind authors' works. She produced an extraordinary year-long thesis paper on creative identity development, in which she compared works from three different time periods and synthesized cultural and historical 34.to inform her analysis. When called upon to give her thesis defense in front of her peers, Sara spoke clearly and35.about her conclusions and responded to questions in a thoughtful way. Outside of the classroom, Sara is devoted to her literary pursuits, especially to poetry. She publishes her poetry in our school's literary magazine, as well as in online magazines. She is an insightful, sensitive, and deeply self-aware individual driven to 36.art, writing, and a deeper understanding of the human condition.Throughout the year Sara was an active participant in our discussions, and she always supported her peers. Her caring nature and personality allow her to work well with others in a team setting, as she always respects others' opinions even when they differ from her own. When we held a class debate about gun laws, Sara chose to speak for the side opposite her own views. She explained her choice as37.by a desire to put herself in other people's shoes, view the issues from a new perspective, and gain a clearer sense of the issue from all angles. Throughout the year, Sara 38.this openness to the opinions, feelings, and perspectives of others, along with sharp powers of observation, all 39.that make her outstanding as a student of literature and burgeoning writer.I am certain that Sara is going to continue to do great and creative things in her future. I highly recommend her for admission to your undergraduate program. She is talented, caring, dedicated, and focused in her pursuits. Sara consistently seeks out 40.feedback so she can improve her writing skills, which is a rare and impressive quality in a high school student. Sara is truly a stand-out individual who will impress everyone she meets. Please feel free to contact me if ********************************************.Sincerely,Ms. ScribeEnglish TeacherMark Twain High SchoolIII. Reading ComprehensionSection ADirections: For each blank in the following passage there are four words or phrases marked A, B, C and D. Fill in each blank with the word or phrase that best fits the context.Research has shown that two-thirds of human conversation is taken up not with discussion of the cultural or political problems of the day, not heated debates about films we've just watched or books we've just finished reading, but plain and simple 41 .Language is our greatest treasure as a species, and what do we 42 do with it? We gossip. About others' behaviour and private lives, such as who's doing what with whom, who's in and who's out——and why; how to deal with difficult 43 situations involving children, lovers, and colleagues.So why are we keen on gossiping? Are we just natural 44 , of both time and words? Or do we talk a lot about nothing in particular simply to avoid facing up to the really important issues of life? It's not the case according to Professor Robin Dunbar. In fact, in his latest book, Grooming, Gossip and the Evolution of Language, the psychologist says gossip is one of these really 45 issues.Dunbar 46 the traditional view that language was developed by the men at the early stage of social development in order to organize their manly hunting activities more effectively, or even to promote the exchange of poetic stories about their origins and the supernatural. Instead he suggests that language evolved among women. We don't spend two-thirds of our time gossiping just because we can talk, argues Dunbar —47 , he goes on to say, language evolved specifically to allow us to gossip.Dunbar arrived at his cheery theory by studying the 48 of the higher primates like monkeys. By means of grooming——cleaning the fur by brushing it, monkeys form groups with other individuals on whom they can rely for support in the event of some kind of conflict within the group or 49 from outside it.As we human beings evolve from a particular branch of the primate family, Dunbar 50 that at one time in our history we did much the same. Grouping together made sense because the bigger the group, the greater the 51 it provided; on the other hand, the bigger the group, the greater the stresses of living close to others. Grooming helped to 52 the pressure and calm everybody down.But as the groups got bigger and bigger, the amount of time spent in grooming activities also had to be 53 to maintain its effectiveness. Clearly, a more 54 kind of grooming was needed, and thus language evolved as a kind of vocal grooming which allowed humans to develop relationship with ever-larger groups by exchanging information over a wider network of individuals than would be possible by one-to-one 55 contact.41.A.claim B.description C.gossip D.language42.A.occasionally B.habitually C.independently D.originally 43.A.social B.political C.historical D.cultural44.A.admirers B.masters C.users D.wasters45.A.vital B.sensitive C.ideal D.difficult46.A.confirms B.rejects C.outlines D.broadens47.A.for instance B.in addition C.on the contrary D.as a result 48.A.motivation B.appearance C.emotion D.behavior49.A.attack B.contact C.inspection D.assistance50.A.recalls B.denies C.concludes D.confesses51.A.prospect B.responsibility C.leadership D.protection 52.A.measure B.show C.maintain D.ease53.A.saved B.extended C.consumed D.gained54.A.common B.efficient C.scientific D.thoughtful55.A.indirect B.daily C.physical D.secretSection BDirection:Read the following three passages. Each passage is followed by several questions or unfinished sattments. For each of them there are four choices markedA, B, C and D. Choose the one that fits best according to the information given in the passage you have just read.(A)In a career that lasted more than half a century, Tom Wolfe wrote fiction and nonfictionbest-sellers including The Electric Kool-Aid Acid Test and The Bonfire of the Vanities. Along the way, he created a new type of journalism and coined phrases that became part of the American vocabulary.Wolfe began working as a newspaper reporter, first for The Washington Post, then the New York Herald Tribune. He developed a literary style in nonfiction that became known as the “New Journalism.” “I’ve always agreed on a theoretical level that the techniques for fiction and nonfiction are interchangeable,” he said. “The things that work in nonfiction would work in fiction, and vice versa.”“When Tom Wolfe’s voice broke into the world of nonfiction, it was a time when a lot of writers, and a lot of artists in general, were turning inwards,” says Lev Grossman, book critic for Time magazine. “Wolfe didn’t do that. Wolfe turned outwards. He was a guy who was interested in other people.” Wolfe was interested in how they thought, how they did things and how the things they did affected the world around them.In 1979, Wolfe published The Right Stuff, an account of the military test pilots who became America’s first astronauts. Four years later, the book was adapted as a feature film. “The Right Stuff was the book for me,” says Grossman. “It reminded me, in case I’d forgotten, that the world is an incredible pla ce.”In The Right Stuff, Wolfe popularized the phrase “pushing the envelope.” In a New York magazine article, Wolfe described the 1970s as “The ‘Me’ Decade.” Grossman says these phrases became part of the American idiom because they were accurate.“He was an enormously forceful observer, and he was not afraid of making strong claims about what was happening in reality,” Grossman says. “He did it well and people heard him. And they repeated what he said because he was right.” All those words started a revolu tion in nonfiction that is still going on.56. The “New Journalism” is a style of journalism that .A. changes its news writing techniques frequentlyB. popularizes new American idioms in a literary wayC. combines novelistic techniques with traditional reportingD. reports various news events from a theoretical perspective57. It can be learned from the passage that The Right Stuff .A. is a film directed by Lev GrossmanB. is an influential book by Tom WolfeC. accounts for popular American phrasesD. deals with incredible places in the world58. According to the passage, Tom Wolfe .A. was good at reporting news from a realistic perspectiveB. preferred making claims about events to writing booksC. was fond of commenting on other people’s though tsD. liked analyzing social problems from the outside59. Which of the following is the best title for the passage?A. Tom Wolfe: A Professional Phrase CoinerB. Tom Wolfe: A Forceful Observer and NovelistC. Tom Wolfe: A Theoretical Creator in LiteratureD. Tom Wolfe: An Innovative Journalist and Writer(B)The idea of using radio or wireless to broadcast to audiences was formed in 1916 by a president of the American Marconi Company, David Sarnoff. His superiors were doubtful about his idea to “make radio a household cause, so that by purchase of a ‘radio music box’, the audience could enjoy lectures, music performance, etc.”Four years later the American engineer Frank Conrad, an employee at W E Corp, attracted considerable attention when a local newspaper reported on the growing audience listening on crystal radio sets to his evening and weekend amateur broadcasts. A local music store had provided records to play on the Victoria, and Conrad and his family served as disc jockeys(唱片音乐播音员). Westinghouse vice president Harry Davis asked Conrad to build a more powerful transmitter(发射台)in time to announce the outcome of the next US presidential election. Conrad completed his assignment, and on November 2, 1920, station KDKA in Pittsburgh, Pennsylvania, broadcast theannouncement that Warren G. Harding had been elected president. About 1000 people heard this first news broadcast.Radio communicated news much faster than did newspapers, and because crystal sets were easy to build and inexpensive, radio expanded rapidly in the following years. To stimulate the sale of radio sets, equipment manufactures provided transmitting facilities. Singers, comedians, and entire orchestras volunteered their services for publicity. The eventual financial basis of the new industry, however, was still unclear. One group in New York City tried to seek contributions from listeners while others urged that private foundations support radio stations as a public service. In August 1922 the first commercial radio advertisement was broadcast on WEAF (now WNBC) in New York City. In 1926, when about 5 million homes had radios, the Radio Corporation of America (RCA), in cooperation with the American Telephone & Telegraph Company, established the first commercial radio network. In the 1920s radio was established as a new mass medium had a practicable industry, and it became a national forum(论坛)for news and popular culture. 59.The passage is mainly concerned with _______.A.the contribution of radio to popular cultureB.the invention and uses of radioC.early radio programs for a mass audienceD.the history of radio broadcasting60.Who started broadcasting radio programs to mass audience?A.Frank Conrad B.David Sarnoff C.Harry Davis D.Warren Harding 61.After 1920, radio expanded rapidly because _______.A.people could easily get it in stores B.it was cheaper than newspapersC.it had advantages over newspapers D.people were interested in anything new62.By saying that “the eventual financial basis of the new industry was still unclear”, the author means that _______.A.the private foundations were unwilling to support the stationsB.the stations were not sure yet where to get the operational moneyC.advertising and commercial programs could not raise enough moneyD.the listeners would not pay for the broadcasting stations(C)The Earth is facing a climate crisis, but it’s also getting greener and leafier. According to new research, the rise is largely due to China and India.A study by National Aeronautics and Space Administration (NASA), based on extensive satellite photographs and published in the journal Nature Sustainability, has revealed that the two countries with the world’s biggest populations are also responsible for the largest increase in greenness.S ince 2000, the planet’s green leaf area has increased by 5 percent, or over 2 million square miles. That’s an area equivalent to the sum total of the Amazon rainforests, NASA says. But researchers stressed that the new greenery does not neutralize deforestation and its negative impacts on ecosystems elsewhere.A third of the leaf increase is thanks to China and India, due to the implementation of major tree-planting projects alongside a vast increase in agriculture.Using the data from a NASA sensor, researchers discovered that China is the source of a quarter of the increase in green leaf area, despite possessing only 6.6 percent of the world’s vegetated area (植被区). Forests account for 42 percent of that increase, while croplands make up a further 32 percen t. China’s increase in forest area is the result of forest preservation and expansion programs, NASA said, established to fight against the impacts of climate change, air pollution and soil erosion (水土流失). India has contributed a further 6.8 percent rise in green leaf area, with 82 percent from croplands and 4.4 percent from forests.Rama Nemani, a co-author of the study and a researcher at NASA’s Ames Research Center, said in a statement, “When the greening of the Earth was first observed, we thought it wa s due to a warmer, wetter climate and fertilization from the added carbon dioxide in the atmosphere, leading to more leaf growth in northern forests, for instance.” “Now, with the data that lets us understand the phenomenon at really small scales, we see t hat humans are also contributing,” Nemani said. “This will help scientists make better predictions about the behavior of different Earth systems, which will help countries make better decisions about how and when to take action.”Thomas Pugh, a professor a t the University of Birmingham’s School of Geography, Earth and Environmental Sciences, said the NASA report expands scientists’ understanding of the causes behind global greening. But he also cautioned that a direct line cannot be drawn between an increasein global greening and a decrease in negative impacts of climate change.63. The passage mainly tells us that .A. China and India have the world’s largest green leaf areasB. China and India are the lead role players in global greeningC. our planet is experiencing a climate crisis despite human effortsD. our planet is getting greener due to the joint efforts of the world64. What can be learned about China and India?A. The area of croplands in India is larger than that in China.B. India’s rise in leaf area is largely due to its forestry program.C. They both show a greater increase in forests than in croplands.D. China boasts twenty-five percent of the global rise in leaf area.65. According to Rama Nemani, their new findings are .A. unexpected but significantB. surprising but valuelessC. predictable but disappointingD. uncontrollable but inspiring66. What can be inferred from the passage?A. There is an indirect link between global greening and climate change.B. The new greenery does not have any positive effect on the global climate.C. The gain in greenness does not make up for the damage from loss of leaf area.D. The increase in greening reduces the deforestation rate and its impact globally.Section CDirections : Complete the following passage by using the sentences listed below. Each sentence can only be used once. Note that there are two sentences more than you need.Can just one person make a difference? You bet! In a community every person counts, and getting involved is not difficult. Take stock of your own talents and interests. ___67___. Don’t wait for someone else to act first. Take the initiative! Once you see what you can accomplish, you’ll want to keep going.Here are just a few ways to make a difference in your community. How many more ways can you come up with?Clean up the community. People often throw litter in places where there is already litter. And the problem only becomes worse until someone gets fed up and does something. Could your neighborhood use a cleanup? Neighborhood cleanups are often sponsored by local businesses or schools. But if your community doesn’t have a cleanup program, get together with friends to organize one. You could pick up garbage in a larger area twice a year, or you could clean a smaller area every few months. ___68___.Include the isolated. Do you know anyone who is housebound? Almost all neighborhoods have a few people who have to stay at their homes. These people are often elderly and unable to leave their homes to perform simple tasks. ___69___. By letting them “borrow” your legs and eyes, you can make them feel included. You can run errands for them like shopping or paying bills. They might like you to read to them if their eyesight is failing. Governments provide some of the services these people need, but programs cannot give them friendship; that’s what communities are for!___70___. Reading clubs are popular all over Europe and North America. Members might read at home to prepare for discussion, or they might read aloud to each other and talk about what they just read. Either way, a book or article can spark lively discussion and this often challenges people to take action.Section DDirections : Read the following passage , Summarize the main idea and the main points of thepassage in no more than 60 words . Use your own words as far as possible.Are you working with your computer routinely either as a office employee or a game lover? Are your eyes dry, watery, blurry, seeing double or sensitive to light? If your answer is a “yes”, you are likely one of many people today who suffer from digital eyestrain, also called computer-vision syndrome. What on earth is this syndrome coming from? What can we do to deal with this problem?Eyestrain is often related to the amount of exposure to screens, the distance from eyes to screens and the use of multiple screens simultaneously. However, studies have also shown that the blue light produced by digital devices today reaches further into the eyes than other kinds of light. This light actually assists attention during the day but can result in interrupted sleep patterns at night.Years of scientific researches indicate that eyestrain isn’t necessarily an unavoidable problem for those who deal with computer work in the daily base. There are ways you can adopt which can overcome the problem considerably. To begin with, your computer screen should be high-resolution(高分辨率), at least 50 centimeters wide diagonally and may require a screen filter to decrease reflections. Also, be aware that “computer glasses”, which cut down glare and blue light,are available.Besides, to reduce your risk for computer-vision syndrome, take frequent breaks during your computer workday. Many workers take only two 15-minute breaks from their computer throughout their day. According to a recent study, eyestrain are significantly reduced when computer workers take four additional five-minute “mini-breaks”throughout their workday.Finally, many of us fall into bad habits while using digital screens, which only worsen the effects of eyestrain. While viewing digital screens, many people blink (眨眼) one third less oftenthan they usually do. Place a reminder on your computer to “blink” so that your eyes don’t dry out.第II卷(共47分)I.TranslationDirections: Translate the following sentences into English, using the words given in the brackets.72. 远足是我们接触大自然的最简单方式之一。

UCC28060EVM 300-W Interleaved PFC Pre-Regulator Us

UCC28060EVM 300-W Interleaved PFC Pre-Regulator Us

1Description2Thermal Requirements3Electrical CharacteristicsUser's GuideSLUU280B–May 2007–Revised July 2008The UCC28060is a dual-phase,transition-mode Power Factor Correction (PFC)pre-regulator.The UCC28060EVM is an evaluation module (EVM)with a 390-V,300-W,dc output that operates from a universal input of 85V RMS to 265V RMS and provides power-factor correction.Throughout this document,the acronym EVM and the phrases evaluation board and evaluation module are synonymous with the UCC28060EVM.The pre-regulator uses theto shape the input current wave to provide power-factor ™technology to interleave boost phases.This user’s guide provides the schematic,List of Materials list,assembly drawing for a single-sided printed circuit board application,and test set-up information necessary to evaluate the UCC28060in a typical PFC application.This evaluation module will operate up to 300W without external cooling in ambient tempatures of 25°C.Table 1summarizes the electrical specifications of the UCC28060EVM.Table 1.UCC28060EVM Electrical SpecificationsUCC28060EVMPARAMETERCONDITIONSUNITS MINTYPMAXRMS input voltage (ac line)85265V RMS Output voltage,V OUT 390V Line frequency4763HzPower factor (PF)at maximum load 0.9Output power 300WAC line =115V 94%Full load efficiencyAC line =230V97%Natural Interleaving is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.Schematics 4SchematicsFigure1and Figure2show the schematics for this EVM.See the List of Materials for specific values.To evaluate inductor ripple currents,Jumpers JP8and JP9can be removed and replaced with currentloops.Figure1.Interleaved PFC Power Stage SchematicsFigure2.Controller Circuitry5Test Setup and Power-Up/Power-DownInstructionsTest Setup and Power-Up/Power-Down Instructions A separate 13-V bias supply is required to power the UCC28060control circuitry.The unit will start up under no-load conditions.However,for safety,a load should be connected to the output of the device before it is powered up.The unit should also never be handled while power is applied to it or when the output voltage is above 50-V dc.Refer to Figure 3for a recommended test setup diagram.Figure 3.Test Setup6Typical Performance Data Typical Performance DataFigure4through Figure 7present characteristic performance data for the UCC28060EVM.Figure 4.Efficiency at 85V RMS and 265V RMSThe UCC28060control device has phase management capability to improve light load efficiency.To demonstrate the light load efficiency,the unit efficiency was measured with phase management enabled and disabled at 115V RMS and Phase management improved the light loadefficiency up to 3%.Refer to the for details on how to use the phase management function of this device.Figure 5.Efficiency at 115V RMS ,With and Without Phase Management1.407061.172560.938050.703540.469040.234530.00002A m p l i t u d e (A )612182430364248Harmonic No.Typical Performance Data Figure 6.Efficiency at 230V RMS ,With and Without Phase ManagementFigure 7.Current Harmonics6.1Output Ripple Voltage at FullLoad6.2Input Ripple CurrentCancellation Typical Performance DataFigure 8illustrates the output ripple voltage.Figure 8.V OUT Ripple,P OUT =300WFigure 9through Figure 14show the input current (M 1=I L1+I L2),Inductor Ripple Current (I L1,I L2)versus rectified line voltage.From these graphs,it can be observed that interleaving reduces the magnitude of input ripple current caused by the inductor ripple current.Figure 9.Inductor and Input Ripple Current atFigure 10.Inductor and Input Ripple Current 85V RMS at Peak of Line Voltage at 85V RMS Input at Half the Line VoltageTypical Performance Data Figure11.Inductor and Input Ripple Current Figure12.Inductor and Input Ripple Current at265V RMS Input at Peak Line Voltage at265V RMS Input at Half Peak Line VoltageFigure13.Inductor and Input Ripple Current Figure14.Inductor and Input Ripple Current at V IN=85V RMS,P OUT=300W at V IN=265V RMS,P OUT=350W6.3StartupCharacteristics6.4BrownoutProtection Typical Performance DataFigure 15and Figure 16illustrate the UCC28060EVM startup characteristics.Figure 15.Start-Up at V IN =85V RMS ,P OUT =Figure 16.Start-Up at V IN =265V RMS ,P OUT =0350W WThe UCC28060has a brownout protection that shuts down both gate drives (GDA and GDB)when the VINAC pin detects that the RMS input voltage is too low.This EVM was designed to go into a brownout state when the line drops below 64V RMS .Once the UCC28060control device has determined that the input is in a brownout condition,a 400-ms timer starts to allow the line to recover before shutting down the gate drivers.After 400ms of brownout,both gate drivers turn off,as shown in Figure 17and Figure 18.Figure 17.Brownout at 85V RMS Figure 18.Brownout at 265V RMSTypical Performance Data 6.5Line TransientA line transient test was conducted with an ac source on the reference design.The line was varied from230V RMS to115V RMS to230V RMS and the transient response was evaluated in each case.From theoscilloscope image in Figure19,it can be observed that the output recovered from line transients within 300ms at full load.Figure19.Line Transient,P OUT=300W Reference Design Assembly Drawing 7Reference Design Assembly DrawingFigure20and Figure22show the top and bottom layers(respectively)of the UCC28060EVM.Note:Board layouts are not to scale.These figures are intended to show how the board is laid out;they are not intended to be used for manufacturing UCC28060EVM PCBs.Figure20.Top Layer AssemblyFigure21.Bottom Layer CopperSLUU280B–May2007–Revised July2008UCC28060EVM300-W Interleaved PFC Pre-Regulator118List ofMaterialsList of Materials Figure 22.Bottom Layer AssemblyTable 2lists the EVM components as configured according to the schematics (see Section 4).Table 2.List of Materials12UCC28060EVM 300-W Interleaved PFC Pre-RegulatorSLUU280B–May 2007–Revised July 2008 List of MaterialsTable2.List of Materials(continued)SLUU280B–May2007–Revised July2008UCC28060EVM300-W Interleaved PFC Pre-Regulator13EVALUATION BOARD/KIT IMPORTANT NOTICETexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling the product(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided are not intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations,including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility,restricted substances(RoHS),recycling (WEEE),FCC,CE or UL,and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from all claims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement of patents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling the product.This notice contains important safety information about temperatures information on TI’s environmental and/or safety programs,please contact the TI application engineer or visitNo license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,or combination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of this equipment in other environments may cause interference with radio communications,in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.EVM WARNINGS AND RESTRICTIONSIt is important to operate this EVM within the input voltage range of85V RMS to265V RMS and the output voltage range of375V to450V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there are questions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM. Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the load specification, please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than+100°C.The EVM is designed to operate properly with certain components above+100°C as long as the input and output ranges are maintained.These components include but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types of devices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes near these devices during operation, please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated。

听力的重要性(Theimportanceoflistening)

听力的重要性(Theimportanceoflistening)

听力的重要性(The importance of listening)First of all, in English learning, the four basic skills that are emphasized repeatedly are listening, speaking, reading and writing". In the four, listening is the first, so the importance of listening is not the same. According to statistics, people spend 45% of their time listening and speaking, accounting for 30%, accounting for 16%, accounting for 9%. Therefore, if we want to learn a foreign language well, we should not only train the ability of reading and writing, but also pay more attention to the cultivation of listening and speaking ability.Now, in primary school, junior high school, high school and College Listening teaching more and more attention and attention, people's understanding of its importance is further deepened.After careful analysis and study, we find that the causes of poor students' English listening are mainly the following aspects:1, the lack of a living language environment, due to geographical location, the surrounding environment, school teaching conditions, parents cultural quality and other factors limited.2, lack of good learning habits. "Mouth, hands, brains" is the key to learn English well. A large number of facts have proved that most students can not make good use of hand, mouth and brain in the process of learning.3, lack of correct learning methods. For example: do not previewbefore class, what teachers want to talk about, in the heart of spectrum; class lectures, although attentive, but not good at thinking, do not seriously take notes; lack of timely review after class consolidation. In the course of time, it is difficult for these students to keep up with the speed of the teacher, and even do not understand anything.English Listening: the importance of listeningWhy do you want to learn English? The reason I hear the most is: want to speak English; few people will say, want to learn to understand English; fewer people will say, they want to learn "listen" english.Of course, the easiest way to measure your progress in English is your ability to speak english. In fact, human nature is that most of us are more willing to listen than to say. And our own ideas, ideas and experiences are binding in speech. However, as the "moral" said: "the man is not he who knows does not speak words." In other words, "listening" rather than "speaking" is the root of learning and the source of wisdom. This is true for learning English and any other forms of learning. There are plenty of reasons for that:1. when we speak a language, we can control the speech. We use the vocabulary and structure that we feel comfortable with our own choice of speed. But when we listen, we can't control. We're under the control of the speaker. They speak at their speed (speaking to us too quickly), and use the language they choose (many of us don't understand). That's why listening is more challenging than saying, and it requires more practice.2. there is a big difference between Chinese and English. It's hard to imagine how to say something you've never heard in english. If you just translate Chinese proverbs or phrases into English, your English interlocutors will be puzzled. Therefore, you need to listen to the English speakers first, so that you can make sure that your English is correct.3. finally, if you understand most of what people say, you'll be a very successful and popular interlocutor. If you speak Chinese to the same person, he just says, "don't understand", "say it again", how much fun can you enjoy in such a conversation?That's why I always advise people who study English: listen, listen, listen. The use of excellent English radio and television programs to watch English original movies (of course, watching English subtitles). This is a good way to help learners lay a solid foundation for listening and build confidence in language communication skills.So, when you listen to others to speak English, but nothing, you can refer to the "moral" of the thing, make yourself in a favorable position, "He who knows does not speak he who speaks does not know".Psychological tests show that people acquire more than 80% of the total knowledge through audio-visual perception. Listening ability in English four skills (listening, speaking, reading and writing) is ranked in the first place, only to listen to and hear and understand that to understand, to imitate, imitatequasi clearly to say that exact, clear, well. Therefore, from the beginning of listening, it not only conforms to the teaching rules, but also conforms to the rules of language learning. For most Chinese students who lack English language environment, listening is the only way for them to acquire English knowledge and pure and graceful pronunciation and intonation. Only by having a certain listening ability, can we listen to and understand the English spoken by others, so that students can have the confidence to speak and communicate with others in English, so as to ensure the smooth progress of English classroom teaching. If students don't dare to speak or say something bad, they often fail to listen, listen, or understand. Or even though they listened to it, they didn't consolidate it in time, and then forgot. Therefore, in the stage of the primary school English teaching, teachers in every class as far as possible for students to create a good language environment, to try to help the students to listen, listen and practice, give full play to the primary features of acute hearing, sound discrimination ability, focus on training students in listening, enough "listen to the language in learning english.So how to train this extremely important listening comprehension? The author believes that there are the following aspects: aCreate a harmonious atmosphere and expand the channels of listeningThe traditional teaching listening activities generally confined to the sentence, as the center of the dialogue teaching, focuses on the form of language perception and memory, inputthe amount of information is obviously insufficient. And usually do the special training of listening skills, mostly test questions, the purpose is too strong, do much, it is easy to cause students' fatigue, repulsion, even disgust, thus losing interest in listening. Modern language teaching theory holds that sufficient language input for understanding content is the key to form communicative listening and even to determine the success of language learning.In the classroom, teachers should keep as much as possible in English teaching, including greeting, classroom language, evaluation, assignments, and students are required to work hard in the classroom to speak English as much as possible, don't worry that students do not, in fact, it does not take a long time, the students fully understand your command, request, or even you can learn some words and expressions. For example, for those students who are new to English classes, teachers should make common classroom language speak a word of English, repeat Chinese, let it slowly adapt to, such as Hello, boys and girls. good students! Good morning/ afternoon, boys and girls. morning / afternoon, boys and girls! Is everyone here? Are they all here? Who's absent? Who's absent? What day is it today? What day is it today? Wait。

光载无线电(RoF)网络技术

光载无线电(RoF)网络技术

2012年第06期,第45卷 通 信 技 术 Vol.45,No.06,2012 总第246期 Communications Technology No.246,Totally光载无线电(RoF)网络技术李秀娟(武警石家庄指挥学院有线通信教研室,河北 石家庄 050061)【摘 要】光载无线电(RoF,Radio-over-Fiber)技术是无线宽带接入的发展趋势,这项技术是把射频(RF, Radio Frequency)副载波调制到光载波上,从而在光纤网络中传输。

它结合光纤通信和无线通信两大技术,可以实现超过Gb/s的无线业务传输,在未来高速宽带无线通信系统中具有重要的应用。

在RoF系统中使用光纤传输的优点是高带宽、低损耗,不受电磁干扰、串扰小,重量轻、投资小、灵活性高等。

主要介绍RoF系统的结构,优势、限制以及关键技术等。

【关键词】光载无线电;移动通信;光纤通信【中图分类号】TN929.11【文献标识码】A 【文章编号】1002-0802(2012)06-0039-03Radio-over-Fiber Network TechnologyLI Xiu-juan(Shijiazhuang Command College of the Armed Police Forces, Shijiazhuang Hebei 050061, China)【Abstract】Radio-over-fiber technology is the development trends of wideband wireless access network. This technique modulates the radio frequency subcarrier onto an optical carrier for transmission over a optical fiber network. Optical fiber is attractive for RoF systems due to its prominent features, including high bandwidth, low loss, immunity to EMI, light weight, small cross-interference, low cost, and high flexibility. This paper principally describes the this paper including the architectures, superiorities, and limitations, and critical techniques of RoF system.【Key words】radio-over-fiber; mobile communication; optical fiber communication0 引言在移动通信早期,全球移动通信系统GSM、通用分组无线服务技术GPRS的数据传输速率很低,目前,用户要求通信系统提供给他们一个在任何时候任何地方、传输快速、使用灵活的多媒体信息服务。

安立RF仪表

安立RF仪表

Product Brochure Reliable. Powerful. Trusted.RF and Microwave InstrumentsM odel FrequencyRBWNoise LevelKey FeaturesMS2661C 9 kHz to 3 GHz 30 Hz to 3 MHz–130 dBm(option and frequency dependent)n Frequency counter n C/Nn Adjacent channel power n Occupied‑frequency bandwidth n Burst average power n Noise power n PASS/FAIL limit linesMS2663C 9 kHz to 8.1 GHz 30 Hz to 3 MHz–130 dBm(option and frequency dependent)MS2665C 9 kHz to 21.2 GHz 30 Hz to 3 MHz–130 dBm(option and frequency dependent)n Compact, lightweight (13 kg standard)n H igh C/N and superior distortion characteristics n Easy‑to‑use operationn Options support wide range of applications n M S2665C supports easy set up auto measurementsn MS2667/68C supports millimeter applicationsMS2667C 9 kHz to 30 GHz 10 Hz to 3 MHz–135 dBm(option and frequency dependent)MS2668C 9 kHz to 40 GHz 10 Hz to 3 MHz–135 dBm(option and frequency dependent)MS2681A 9 kHz to 3 GHz 1 Hz to 20 MHzDown to –148.3 dBm(option and frequency dependent)n F ast data transmission speed (GPIB transmission speed:120 kbytes/second)n O ptional measurement software for high‑speed modulation analysis (1.5 seconds with W‑CDMA, 0.5 seconds with IEEE 802.11a)n Optional narrow resolution bandwidth from 1 HzMS2683A 9 kHz to 7.8 GHz 1 Hz to 20 MHzDown to –146.5 dBm(option and frequency dependent)MS2687B 9 kHz to 30 GHz 1 Hz to 20 MHzDown to –146.5 dBm(option and frequency dependent)n O ptional measurement software for high‑speed modulation analysis (0.5 seconds with IEEE 802.11a)n O ptional power meter that measures up to 32 GHz n F ast data transmission speed (GPIB transmission speed:120 kbytes/second)MS2711D 100 kHz to 3 GHz 100 Hz to 1 MHz –135 dBmn Typical dynamic range of 100 dBn T ypical phase noise of –110 dBc/Hz at 10 kHz offsets up to 6 GHzn R F and demodulator measurement capabilities with pass/fail functionsn 13 software options for wireless measurements from GSM to Mobile WiMAXMS2717B MS2718B MS2719B 9 kHz to 7.1 GHz 9 kHz to 13 GHz 9 kHz to 20 GHz 1 Hz to 3 MHz–153 dBm typical to 1 GHzMS2721B 9 kHz to 7.1 GHz –163 dBm typical to 1 GHz, 1 Hz RBW MS2723B 9 kHz to 13 GHz –156 dBm typical to 1 GHz, 1 Hz RBW–139 dBm typical to 1 GHz, 1 Hz RBW MS2724B9 kHz to 20 GHz–156 dBm typical to 1 GHz, 1 Hz RBW –136 dBm typical to 1 GHz, 1 Hz RBWMS2690AMS2691A MS2692ASignal Analyzer50 Hz to 6.0 GHz 50 Hz to 13.5 GHz 50 Hz to 26.5 GHzSpectrum Analyzer Mode 30 Hz to 20 MHz Signal Analyzer Mode 1 Hz to 1 MHzDown to –155 dBm(option and frequency dependent)n World class dynamic range n 125 MHz analysis bandwidthn E xcellent accuracy of level and modulation analysis up 6 GHzn E xcellent accuracy of level and modulation analysis up 6 GHz n High speed modulation analysis n S upports GSM/EDGE/EDGE evolution, HSPA, LTE, and Mobile WiMAXMS8608ADigital Mobile Radio Transmitter Tester9 kHz to 7.8 GHz 1 Hz to 20 MHzDown to –146.5 dBm(option and frequency dependent)n E xcellent performance for evaluating W‑CDMA modulation signalsn S upports GSM/EDGE, HSDPA, WLAN/802.11,CDMA, 1xEVDO, and Pi/4DQPSK (PHS, PDC, IS–136) measurements n R esolution bandwidth of up to 20 MHz via built‑in spectrum analyzer n P ower can be measured with an accuracy of ±0.4 dB using the power sensorMS8609A Digital Mobile Radio Transmitter Tester9 kHz to 13.2 GHzRF and Microwave Testing Solutions | 3Spectrum AnalyzersSuperior performance. Advancedcapabilities. Affordable pricing. The Anritsu family of spectrum analyzers delivers high frequency/ level accuracies and a broad set of smart, intuitive features —including models with built-in one-button measurements.Take advantage of alarge s election of optionsto handle a wider range of applications at a reasonable cost.MS2719BMS2661C MS2668C4Vector Network Analyzer Features Benefits ApplicationsVectorStar Family Microwaveand mmWave VNAMS4640A Series70 kHz to 70 GHzMS4642A Series70 kHz to 10 MHz to 20 GHzMS4644A Series70 kHz to 10 MHz to 40 GHzMS4647A Series70 kHz to 10 MHz to 70 GHz Broadest frequency spanfrom a single coaxial test portcovering 70 kHz to 70 GHz ina single instrument and 70 kHzto 110 GHz in the Broadbandconfigurationn O btain the most thorough and accuratebroadband device characterization.n E liminate time consuming concatenationprocess across the RF, microwave/mm‑wave bands.n D ecrease test instrument expensesby eliminating the need for a 2ndRF VNA.n R educe the risk of DC extrapolationerrors in your device modeling.n Device characterizationn M icrowave and millimeter wavecomponent testn On‑wafern Waveguide S‑parametersn R&D and production environmentsn M ixer measurements includingautomatic de‑embedded measurementswith absolute phase and group delayn Embed/De‑embed applicationsn Amplifier testingn Broadband characterizationn Parameter extractionn Device modelingFastest swept synthesizedmeasurement speed< 20 µsec per pointn I ncrease manufacturing revenueby increasing throughput.n Q uickly and easily spot the most hardto find failures and reduce the risk ofshipping defective products.Superior Dynamic Range –up to 140 dBn A ccurately measure medium and highloss devices.n C atch all potential filter feed‑throughs inout‑of‑band regions.High compression point –up to15 dBm at 70 GHzn E liminate the need for additionalattenuators.n I mprove calibration and measurementaccuracy.Best test port characteristic –up to 50 dB Directivity, SourceMatch, Load Matchn R educe measurement uncertaintyn R educe measurement guard bandsn Improve productivityn Optimum precision in R&DHighest point resolution –100,000 pointsn Z oom in on narrow band responseswithout re‑calibration.Best device modeling datan A cc elerate design cyclen A ccurate DC modelingn E liminate the need for 2nd VNABest time domain analysisn 100,000 points and 700 kHzfrequency step size provide themost accurate, highest resolved,Low Pass Mode measurements.n M easure long transmission lineswith the best non‑aliasing range.Most convenient automaticcalibration system with bestaccuracyn U se Precision AutoCal for an easy, one‑button method of VNA calibration andbetter accuracy than traditional SOLTcalibration.n S pend less time setting up theVNA for the next production run.Lightning Family Microwave and mmwave VNA40 MHz to 20, 40, 67 GHz n B est performance to price ration E xcellent dynamic range and test port characteristics provide accurate,reliable measurements.n M any of the advanced high performance features found in VectorStarincluding; wide range of calibration choices, AutoCal, Embedding/De‑embedding, multiple source control, and power meter correction.n Passive devicesn Active devicesn Mixersn E/O and O/En On‑waferMS4630B RF VNA 10 Hz to 300 MHz n A ccurate magnitude and phase measurementsn Filter and resonator analysis functionsn High‑speed device evaluationn P assive filters, resonators for bothR&D and manufacturingn Optimized for IF measurementsRF and Microwave Testing Solutions | 54Vector Network AnalyzersAnritsu VNAs encompass a wide range of high-performance, component test tools designed to address the growing needs of wireless, satellite, defense, broad-band communication and optoelectronic components markets . Choose between the VectorStar and Lightning family of VNAs for the ideal solution of advanced performance, accuracy and reliability for measuring any activeor passive device or system – from characterization and designing to manu-facturing and verification.Theversatility tocompletely characterizewireless components and systems.37397DMS4647A VectorStar VNAPower Meters (RF Microwave)Anritsu power meters provide accurate measurements for the full range of communications, wireless and aerospace applications.T h e preferred choice o f service providers,network operators and contractorsworldwide.ML2488BPower MeterFrequency VBW Dynamic Range ( d Bm)Channels ML2437A Power Meter 100 kHz to 65 GHz Sensor dependent 100 kHz –70 to +20 dBm Sensor dependent 1ML2438A Power Meter100 kHz 2ML2487B Wideband Peak Power Meter 50 MHz to 18 GHz Sensor dependent 20 MHz –60 to +20 dBm Sensor dependent 2ML2488B Wideband Peak Power Meter 20 MHz 2ML2495A Wideband Peak Power Meter 100 kHz to 65 GHz Sensor dependent 65 MHz –70 to +20 dBm Sensor dependent 1ML2496A Wideband Peak Power Meter 65 MHz 2 ML2530A Calibration Receiver100 kHz to 3 GHz100 kHzRange dependent1Signal AnalyzersTechnicians looking for exceptional e ngineering insight for advanced RF and communications products need to look no further. Anritsu Signal Analyzers offer cost-effective solutions with integrated Fixed and Mobile WiMAX measurements, industry-best DANL and dynamic range and comprehensive W-CDMA/HSDPA measurements.Signal AnalyzerFrequencyRBWNoise LevelKey FeaturesMS2690AMS2691A MS2692ASignal Analyzer50 Hz to 6.0 GHz 50 Hz to 13.5 GHz 50 Hz to 26.5 GHzSignal Analyzer Mode 1 Hz to 1 MHzSpectrum Analyzer Mode 30 Hz to 20 MHzDown to –155 dBm (option and frequency dependent)n World class dynamic range n 125 MHz analysis bandwidthn E xcellent accuracy of level and modulation analysis up 6 GHzn E xcellent accuracy of level and modulationanalysis up 6 GHzn High speed modulation analysis n S upports GSM/EDGE/EDGE evolution, HSPA, LTE, and Mobile WiMAXMS2690ASynthesized Signal GeneratorsWhether you test in the microwave, fixed or mobile satellite communications or defense industries, Anritsu provides the best synthesized signal generator solutions. With high-signal purity, low noise and excellent frequency stability, our signal generators are a fundamental measuring instrument for your lab or manufacturing site. Choose instruments with a full range of modulation capabilities for signal s imulations from simple to the most complex, including Amplitude (AM), Frequency (FM), Phase (φ) and Pulse (PM). Plus, you’ll find a series of configurable and upgradable broadband high-performance signal generators that meet your exact specifications.Anritsu provides the bestsynthesized signal generator solutions.MG37020ARF and Microwave Testing Solutions | 7Handheld SolutionsDelivering be n chtop performancein a handheld instrument. Handheld Cable and Antenna Analyzer: Site Master™As powerful as it is easy to use, more field technicians choose Site Master than any other handheld analyzer. And for applications as VHF, broadcasting, paging, Land Mobile Radio, cellular, GPS, PCS/GSM, 2.5G, 3G, WLAN and WiMAX, Site Master delivers accurate, repeatable measurements.Site Master Frequency MeasurementsS311D Cable and Antenna Analyzer 2 MHz to 1600 MHzn Return Loss n SWRn Cable Loss n Distance‑To‑FaultS331D Cable and Antenna Analyzer 2 MHz to 6000 MHzS312D Cable, Antenna and Spectrum Analyzer 2 MHz to 1600 MHzcable and antenna analyzer,100 kHz to 1.6 GHz spectrum analyzern Return Loss n Channel Powern SWR n Field strengthn Cable Loss n Interference Analysisn Distance‑To‑Fault n Occupied Bandwidthn A djacent Channel Power Ratio n T ransmission Measurementn P25 Transmitter andCoverage Measurements(S412D only)S412D Cable, Antenna, Spectrum, Interference, and P25 / iDEN Modulation Analyzer 2 MHz to 1600 MHzcable and antenna analyzer,100 kHz to 1.6 GHz spectrum analyzerS332D Cable and Antenna Analyzer 2 MHz to 6000 MHzcable and antenna analyzer,100 kHz to 3 GHz spectrum analyzerS810D Broadband Microwave Transmission Line and Antenna Analyzer 2 MHz to 10.5 GHz n Return Loss n Distance‑To‑Faultn 1‑port Cable Loss n 2‑port Cable Lossn C oax and waveguideVSWRS820D Broadband Microwave Transmission Line and Antenna Analyzer 2 MHz to 20 GHzDon’t let their size fool you.These rugged, lightweightand easy-to-use instrumentsdeliver powerful, field-tested,lab-approved reliabilityand accuracy to the palmof your hand—and towherever there’s microwaveor communicationsystems issues.S332D8 | RF and Microwave Testing SolutionsRF and Microwave Testing Solutions |4Handheld Base Station Analyzers: BTS Master ™ and Cell Master ™BTS Master ™ is like having multiple tools in one compact instrument. You get the functionality of a transmitter analyzer (W-CDMA/HSDPA, GSM/GPRS/EDGE, WiMAX), plus all the features of the field-proven Spectrum Master.Cell Master eliminates the need to carry, manage and learn multiple test sets. It includes a transmitter analyzer (GSM, CDMA, cdmaOne, CDMA2000 1xRTT, and CDMA2000 1xEV-DO), a transmission analyzer for 2-port devices, interference analyzer, channel scanner, GPS receiver, CW signal generator (tests LNAs, repeaters or basestation receiver sensitivity) and T1/E1 analyzer.MT8212BRF and Microwave Testing Solutions | 9MT8222A Quickly and e a sily perform all measurementsfor wireless network deployment, installation and maintenance.MP1026BEye Pattern Analyzer Frequency MeasurementsMP1026B Bit Master0.1 to 12.5 Gbpsn S upports OC‑192/STM‑64 SONET/SDH, 10G Fibre Channel, and 10G Ethernet n Optional integrated Optical/Electronic converter n C ompliance masks and mask margin percentage for Industry StandardsMeasure m entsjust got personal.Handheld Analyzer forNext Generation Networks: Bit Master ™The Bit Master conducts economical mask compliance testing on transmitter outputs using eye pattern measurements. Fully portable, it serves engineers in the lab, production line, and in test labs.10 | RF and Microwave Testing SolutionsHandheld Spectrum Analyzers:Spectrum Master ™As the de facto industry standard, the Spectrum Master series provides ultimate measurement flexibility in a lightweight, rugged package for field environments and mobile applications. With frequencies ranging from 9 kHz to 20 GHz, the Spectrum Master is ideal for such applications as identifying sources of interference, measuring field strength of cellular, satellite and military land mobile signals, field analysis of 802.11a/b/g wireless LAN signals and measurement of RF output from circuits, devices and instruments.Handheld Vector Network Analyzers:VNA Master ™Need unparalleled performance and essential RF capabilities atmodest prices? Enter the VNA Master series —simply the most advanced ultra-portable handheld VNAs on the market.VNA Master VNA Frequency SPA Frequency Measurements MS2024A 2 MHz to 4 GHz —n Return Loss n Cable Lossn VSWR n 1‑port phase n 2‑port phase n Smith chart n 2‑port gainn Distance‑To‑FaultMS2026A 2 MHz to 6 GHz —MS2034A 2 MHz to 4 GHz 100 kHz to 9 GHz MS202xA measurements plus: n High‑performance spectrum analysis n Channel scanner n Interference analysisMS2036A2 MHz to 6 GHz100 kHz to 9 GHzSpectrum Master Frequency RBWNoise Level (dBm)MS2711D 100 kHz to 3 GHz 100 Hz to 1 MHz –135 dBmMS2721B 9 kHz to 7.1 GHz 1 Hz to 3 MHz –163 dBm typical to 1 GHz in 1 Hz RBW MS2723B9 kHz to 13 GHz1 Hz to 3 MHz–156 dBm to 1 GHz, 1 Hz RBW –139 dBm to 3 GHz, 1 Hz RBW MS2724B 9 kHz to 20 GHz 1 Hz to 3 MHz–156 dBm to 1 GHz, 1 Hz RBW –136 dBm to 18 GHz, 1 Hz RBWMS2721BMS2026AFrequency CountersAnritsu’s frequency counters provide the most comprehensive frequency measurements in the industry. Frequency Counter Frequency Key Features Key ApplicationsMF2400 Microwave Frequency Counter 10 Hz to 20/27/40 GHzn Wideband measurementn High‑accuracy burst measurementn Analog display functionn Template functionn High‑speed transient measurementn Gating functionn M obile radio communications devicesand circuitsn C arrier frequency and pulse width ofb urst signalInstrumentation Grade AttenuatorsHighly accurate, versatile and economical, Anritsu Instrumentation Grade Attenuators also provide GPIB standard and feature automatic measuring system components.Grade Attenuators Frequency Key Features Key ApplicationsMN63A/65A/72A/64B Programmable Attenuator DC to 18 GHzn Wide frequency rangen High accuracyn Long operating lifen High‑speed switchingn R&Dn Inspectionn ProductionPrecision Components, Precision MeasurementsTechnicians rely on Anritsu for industry-leading design and production of precision microwave components.n Precision coaxial connector systems to 65 GHz n Precision coaxial and waveguide to coax adaptersn High-directivity SWR auto testers and bridges n RF detectorsn Precision terminations and air lines n Precision fixed attenuatorsn Precision step attenuators n Precision power dividers and splittersn Precision bias tees n Broadband microwave limitersRF and Microwave Testing Solutions | 11Please Contact:Anritsu Corporation5‑1‑1 Onna, Atsugi‑shi, Kanagawa, 243‑8555 Japan Phone: +81‑46‑223‑1111 Fax: +81‑46‑296‑1264• U.S.A.Anritsu Company1155 East Collins Boulevard, Suite 100, Richardson, Texas 75081 U.S.A.Toll Free: 1‑800‑ANRITSU (267‑4878) Phone: +1‑972‑644‑1777 Fax: +1‑972‑671‑1877• CanadaAnritsu Electronics Ltd.700 Silver Seven Road, Suite 120, Kanata, Ontario K2V 1C3, Canada Phone: +1‑613‑591‑2003 Fax: +1‑613‑591‑1006• BrazilAnritsu Electrônica Ltda.Praca Amadeu Amaral, 27‑1 Andar 01327‑010 ‑ Paraiso, São Paulo, Brazil Phone: +55‑11‑3283‑2511 Fax: +55‑11‑3886940• MexicoAnritsu Company, S.A. de C.V.Av. Ejército Nacional No. 579 Piso 9, Col. Granada 11520 México, D.F., México Phone: +52‑55‑1101‑2370 Fax: +52‑55‑5254‑3147• U.K.Anritsu EMEA Ltd.200 Capability Green, Luton, Bedfordshire LU1 3LU, U.K. Phone: +44‑1582‑433200 Fax: +44‑1582‑731303• France Anritsu S.A.16/18 Avenue du Québec‑SILIC 720 91961 COURTABOEUF CEDEX, France Phone: +33‑1‑60‑92‑15‑50 Fax: +33‑1‑64‑46‑10‑65• Germany Anritsu GmbHNemetschek Haus, Konrad‑Zuse‑Platz 1 81829 München, Germany Phone: +49 (0) 89 442308‑0 Fax: +49 (0) 89 442308‑55• ItalyAnritsu S.p.A.Via Elio Vittorini, 129, 00144 Roma, Italy Phone: +39‑06‑509‑9711 Fax: +39‑06‑502‑2425• Sweden Anritsu ABBorgafjordsgatan 13, 164 40 Kista, Sweden Phone: +46‑8‑534‑707‑00 Fax: +46‑8‑534‑707‑30• Finland Anritsu ABTeknobulevardi 3‑5, FI‑01530 Vantaa, Finland Phone: +358‑20‑741‑8100 Fax: +358‑20‑741‑8111• Denmark Anritsu A/SKirkebjerg Allé 90 DK‑2605 Brøndby, Denmark Phone: +45‑72112200 Fax: +45‑72112210• SpainAnritsu EMEA Ltd.Oficina de Representación en EspañaEdificio VeganovaAvda de la Vega, n 1 (edf 8, pl1, of 8) 28108 ALCOBENDAS ‑ Madrid, Spain Phone: +34‑914905761 Fax: +34‑914905762• RussiaAnritsu EMEA Ltd.Representation Office in RussiaTverskaya str. 16/2, bld. 1, 7th floor. Russia, 125009, Moscow Phone: +7‑495‑363‑1694 Fax: +7‑495‑935‑8962• United Arab Emirates Anritsu EMEA Ltd. Dubai Liaison OfficeP O Box 500413 ‑ Dubai Internet CityAl Thuraya Building, Tower 1, Suite 701, 7th Floor Dubai, United Arab Emirates Phone: +971‑4‑3670352 Fax: +971‑4‑3688460• Singapore Anritsu Pte. Ltd.60 Alexandra Terrace, #02‑08, The Comtech (Lobby A) Singapore 118502Phone: +65‑6282‑2400 Fax: +65‑6282‑2533• IndiaAnritsu Pte. Ltd. India Branch Office3rd Floor, Shri Lakshminarayan Niwas,#2726, 80 ft Road, HAL 3rd Stage, Bangalore ‑ 560 075, India Phone: +91‑80‑4058‑1300 Fax: +91‑80‑4058‑1301• P. R. China (Hong Kong) Anritsu Company Ltd.Units 4 & 5, 28th Floor, Greenfield Tower, Concordia Plaza, No. 1 Science Museum Road, Tsim Sha Tsui East, Kowloon, Hong Kong, P.R. China Phone: +852‑2301‑4980 Fax: +852‑2301‑3545• P. R. China (Beijing) Anritsu Company Ltd.Beijing Representative OfficeRoom 2008, Beijing Fortune Building, No. 5 , Dong‑San‑Huan Bei Road,Chao‑Yang District, Beijing 100004, P.R. China Phone: +86‑10‑6590‑9230Fax: +82‑10‑6590‑9235• KoreaAnritsu Corporation, Ltd.8F Hyunjuk Bldg. 832‑41, Yeoksam‑Dong, Kangnam‑ku, Seoul, 135‑080, Korea Phone: +82‑2‑553‑6603 Fax: +82‑2‑553‑6604• AustraliaAnritsu Pty Ltd.Unit 21/270 Ferntree Gully Road, Notting Hill Victoria, 3168, Australia Phone: +61‑3‑9558‑8177 Fax: +61‑3‑9558‑8255• TaiwanAnritsu Company Inc.7F, No. 316, Sec. 1, Neihu Rd., Taipei 114, Taiwan Phone: +886‑2‑8751‑1816 Fax: +886‑2‑8751‑1817。

常用的一些测试英语缩写

常用的一些测试英语缩写

Full Name
Advanced Audio Distribution Profile Authentication, Authorization, and Accounting Advanced Audio Coding ATM Adaptation Layer type 1 Authentication Algorithm Number Activity-Based Buggeting Activity-Based Costing Activity-Base Management Available Bit Rate Alternating Current Audio Coder-3 Accept Anisotropic Conductive Film Advanced Configuration & Power Interface AT Command Interpreter Acknowledgement SMS Access Control List Add, Compare, Select Agency Dept. Automatic data capture Absolute Dimension Measurement Administration Function at the LIAN Audio Asymmetric Digital Subscriber Line Adaptive Dynamic Threshold Additional Elementary Functions Association for Electric Home Appliances Advance Encryption standard Alternative Frequency List Audio Frequency Control Annual Failure Rate Access Gateway Audio Gateway Anti-Glare Advanced Global Alignment Accelerated Graphics Port、Advanced Graphics Port Assisted Global Positioning System Auto Insertion Acquisition Indicatior Acquisition Indication Channel Article Inspection report Article Inspection report ATM Line Interface Module subrack alternate lighting of surfaces Accelerated Life Test General Administration Dept.

MD-012 Disciplined Oscillator Module商品说明书

MD-012 Disciplined Oscillator Module商品说明书

MD-012Disciplined Oscillator ModuleThe MD-012 is a Microchip standard platform module that provides 1 pps TTL,10 MHz sine wave and 10 MHz square wave outputs that are disciplined to an external reference input. Internal to the module is a Microchip digitally corrected OCXO.•1pps TTL output signal• 10MHz sinewave and square wave output • Other RF output frequencies available• Adaptive aging correction during holdover • Barometric pressure correction • Serial communications interface• 1PPS to 75 MHz Reference Frequency Input • Evaluation kit with software• Basestation Communications • Digital Video Broadcast • E911 Location Systems• General Timing and Synchronization • Military Radio • Radar SystemsFeaturesBlock DiagramApplicationsQuartz Oscillator(OCXO)Processor/ControllerOutput Frequency Generation1PPS OutputRF Output(10 MHz standard - other frequencies available)SerialFigure 1. Functional Block DiagramOutput Locked Module OKHardwareResetManual Holdover External ReferenceInputNotes:• RF and 1pps input and output connectors are MCX type (SMA, SMB, MMCX connectors require additional part numbers).• Keyed connector is Samtec FTSH-108-01LDVK type.• Dimensions: mm• Module height in part number is the sum of oscillator height, board, and clearancePackage OutlineAlthough ESD protection circuitry has been designed into the MD-012 proper precautions should be taken when handling and mounting.Microchip employs a human body model (HBM) and a charged-device model (CDM) for ESD susceptibility testing and design protectionReliabilityMicrochip qualification includes aging various extreme temperatures, shock and vibration, temperature cycling, and IR reflow simulation. The MD-012 family is capable of meeting the following qualification tests:Ordering Information InstructionsCustomization to unique customer requirements is available and is common for this level of integration. Common customizations include alternate output frequencies, temperature ranges, differing values and methods of hold over specification, and holdover optimization in the frequency domain. The table below lists exisiting combinations available as of the date of publication of this data sheet. Please contact the factory for additional options.Ordering InformationMD - 012 3 - B X E - 15E7 - 10M0000000Product FamilyMD: Precision ModulesPackage 65x115mm Height 3: 19.5 mmSupply Voltage B: +12VHold Over15E7: 1.5 µs hold over option 40E7: 4.0 µs hold over optionFrequencyRF Output Code X: standard outputs per specificationTemperature Range E: -40°C to +85°C1) Holdover and aging performance is after 7 days of power-on time. Temperature and aging rates are whendevice is not locked. Performance measured in still air.2) After customer applies correct offset using cable delay command while locked, after 24 hours of locked opera-tion3) ADEV at t =86400s while locked, after 24 hours of locked operation4) The status locked indicator is intended to indicate when the module is fully locked to a reference.5) The Hardware OK indicator is intended to indicate when the module is operating properly without any failures, including hardware, software or parameter out of range.6) The Rx pin is the serial interface input and the Tx pin is the serial interface output. The serial interface shall operate at 115,200 baud with eight (8) data bits, one (1) stop bit and no parity.USA:100 Watts StreetMt Holly Springs, PA 17065Tel: 1.717.486.3411Fax: 1.717.486.5920Europe:Landstrasse74924 NeckarbischofsheimGermanyTel: +49 (0) 7268.801.0Fax: +49 (0) 7268.801.281Information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your reasonability to ensure that your application meets with your specifications. MICRO-CHIP MAKES NO REPRESENTATION OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING, BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, MERCHANTABILITY OR FITNESS FOR PURPOSE. Microchip disclaims all liability arising from this information and its use. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly, or otherwise, under any Microchip intellectual property rights unless otherwise stated.。

Mitutoyo U-WAVE-R 用户手册说明书

Mitutoyo U-WAVE-R 用户手册说明书

U-WAVE-RIntroductionThe U-WAVE-R in conjunction with a Mitutoyo U-WAVE-T (available separately) allows wireless communication of the measurement data from Digimatic-output interfaced tool to load it to a personal computer for data display.To obtain the highest performance and the longest service life from the U-WAVE-R, carefully read this User’s Manual thoroughly prior to use.After reading this manual, keep it near the U-WAVE-R for quick reference.The specifications of the U-WAVE-R and descriptions in this manual are subject to change without prior notification.Safety PrecautionsUse the U-WAVE-R in conformance with the specifications, functions and precautions for use given in this manual. If the U-WAVE-R is used in other way, it may jeopardize safety.• Do not use the U-WAVE-R near a medical device that has a possibility of causing amalfunction due to radio waves.• The U-WAVE-R using an electric wave has a possibility that communication isinterrupted under the influence of external noises, etc., even within the distance ofcommunication of the electric wave. In this case take sufficient failure preventionaction (security measures).• In the event the U-WAVE-R should fail, take sufficient failure prevention action(security measures).Notes on Export RegulationThe U-WAVE-R falls into the Catch-All-Controlled Goods or Program under theCategory 16 of the Separate Table 1 of the Export Trade Control Order or theCategory 16 of the Separate Table of the Foreign Exchange Control Order,based on the Foreign Exchange and Foreign Trade Law of Japan.Further, this User's Manual and U-WAVE Quick Manual (No. 99MAL110B) alsofalls into the Catch-All-Controlled Technology for use of the Catch-All-ControlledGoods or Program, under the Category 16 of the Separate Table of the ForeignExchange Control Order.If you intend re-exporting or re-providing the product or technology to any partyother than yourself, please consult with Mitutoyo prior to such re-exportingor re-providing.Precautions for the Wireless LawThe U-WAVE-R can use in Japan, EU member countries, U.S.A, Canada .The U-WAVE-R cannot be used in countries other than Japan, EU member countries, U.S.A,Canada• The U-WAVE-R must follow the corresponding regulation which is specified in thecountry to use an electric wave.• Do not disassemble or modify any part of the U-WAVE-R.• Do not peel off the following certification label stuck on the U-WAVE-R.The use of any U-WAVE-R without the label is prohibited.• Do not use the U-WAVE-R in an airplane.The use of a wireless equipment in the airplane is prohibited.Changes or modifications not expressly approved by the party responsiblefor compliance could void the user’s authority to operate the equipment.NotesThis equipment has been tested and found to comply with the limits for a Class Bdigital device, pursuant to Part 15 of the FCC Rules. These limits are designed toprovide reasonable protection against harmful interference in a residential installation.This equipment generates, uses and can radiate radio frequency energy and, if notinstalled and used in accordance with the instructions, may cause harmful interferenceto radio communications, However, there is no guarantee that interference will notoccur in a particular installation. If this equipment does cause harmful interference toradio or television reception, which can be determined by turning the equipment offand on, the user is encouraged to try to correct the interference by one or more ofthe following measures:-- Reorient or relocate the receiving antenna.-- Increase the separation between the equipment and receiver.-- Connect the equipment into an outlet on a circuit different from that to which thereceiver is connected.-- Consult the dealer or an experienced radio/TV technician for help.Precautions on Wireless Communication EnvironmentsNotice that this performance of the U-WAVE-R may not be fully delivered depending on theenvironment such as a midway obstruction.For the items of obstruction factors refer to the following table.Precautions for UseThe following deeds and situations will cause a failure or malfunction in the U-WAVE-R.Care should be exercised.IMPORTANT• The U-WAVE-R operates on the power supply from a personal computer. A personalcomputer may generate large noises depending on the manufacturer and model. Be sure toverify the whole system operation once prior to use.• Do not give a sudden shock such as a drop or apply an excessive force to the U-WAVE-R.• If the U-WAVE-R is not used more than 3 months, disconnect the U-WAVE-R from thepersonal computer and store it in a safe place.• Avoid using or storing the U-WAVE-R at sites which are exposed to direct sunlight,excessively high or low temperature.• Avoid using or storing the U-WAVE-R at sites where it may be subject to the adhesion ofsolution such as acid and alkali or organic solvent.• If a high-voltage device such as an electro-spark engraving pen is used for the U-WAVE-R,the internal electronic parts may be damaged.• Exercise care so as not to apply an undue force or curvature to the USB cable.WarrantyIn the event that the U-WAVE-R should prove defective in workmanship or material, withinone year from the date of original purchase for use, it will be repaired or replaced, at ouroption, free of charge upon its prepaid return to us.This warranty is effective only where the U-WAVE-R is properly installed and operated inconformance with the instructions in this manual.Disposal of Old Electrical & Electronic Equipment (Applicable in the EuropeanUnion and other European countries with separate collection systems)This symbol on the U-WAVE-R or on its packaging indicates that the U-WAVE-R shallnot be treated as household waste. To reduce the environmental impact of WEEE(Waste Electrical and Electronic Equipment) and minimize the volume of WEEEentering landfills, please reuse and recycle.For further information, please contact your local dealer or distributors.[1] Name of Each Part and External Dimensions (Unit : mm)1. POWER (Green LED)2. ERROR (Red LED)3. USB connector4. INIT. Switch (Initialize switch)5. Device ID label6. Certification label[2] Software InstallationThe U-WAVE-R outputs measurement data to a personal computer using the dedicatedsoftware “U-WAVEPAK” included in the CD supplied as a standard accessory.Before using the U-WAVE-R be sure to read the standard accessory“U-WAVE QUICK Manual” thoroughly, and then install the “U-WAVEPAK” and “USB Driver”.IMPORTANT• Log in to Windows by ‘Administrator’.• Be sure to install the U-WAVEPAK before connecting the U-WAVE-R to a personal computer.• When connecting the U-WAVE-R to a USB Hub, always use a self-powered USB Hub.• The U-WAVE-R does not support the operation in the Standby or Hibernate of a personalcomputer. Cancel each setting in the U-WAVE-R prior to use.• Please read the “U-WAVEPAK User’s Manual“ in “PDF_Manual” folder of the CD supplied as astandard accessory for a detailed operation method of U-WAVEPAK.“Adobe Reader” of Adobe Systems INC. is necessary to read.[3] Setup1)Setting the communication informationYou need to set various information necessary for communication in the U-WAVE-R usingthe U-WAVEPAK. (No information is registered default setting.)IMPORTANT• Please read the “U-WAVE Quick manual “ and “U-WAVEPAK User’s Manual“ in “PDF_Manual”folder of the CD supplied as a standard accessory for setting the communication information.• The U-WAVE-R will not function properly if a U-WAVE-R with the same group ID and bandID settings exists nearby. Be sure to set different information for each ID in the U-WAVE-R.6. Certification labelW A R N I N GW A R N I N GW GUser’s ManualNo.99MAL109B32) Installation procedureInstall the U-WAVE-R at a location with a good view and eliminate any obstacle between the U-WAVE-R and the U-WAVE-T. If installing it on a wall, etc., use the installation board (No. 02AZD815) from among the standard accessories. To install the U-WAVE-R on a wall, observe the following procedure.(1) Attach the mounting plate to the U-WAVE-R backside with cross-recessed head tapping screws (nominal size 2.6 × 6 No. A131-6221CP 2pcs.) in the standard accessories.Screw holes are provided on the U-WAVE-R backside so that the mounting plate can be fixed at one of three positions. Attach the mounting plate at an appropriate position where the U-WAVE-R is easily mounted.(2) Install the U-WAVE-R on a wall at a desired location with the two screws.When installing the U-WAVE-R, refer to the following figure. Carefully install the U-WAVE-R so that it will not drop from the wall.• Figure of the installation board (Unit : mm) • Figure of how to attach the plate to the U-WAVE-R(Attachable at one of three positions.)[4] Functions 1) Communication FunctionThe U-WAVE-R displays the data received from the U-WAVE-T.Observe the following procedure for output operation.(1) Connect the U-WAVE-R to a personal computer with a USB cable.(2) Boot the U-WAVEPAK.(3) Please read the “U-WAVE Quick manual “ and “U-WAVEPAK User’s Manual“ in“PDF_Manual” folder of the CD supplied as a standard accessory for setting correctly.(4) Press the DATA switch on the connecting cable connected to the U-WAVE-T or the DATAswitch on a Measuring tool to transmit data.(5) The U-WAVE-R displays the received data and wireless transmits the confirm signal tothe U-WAVE-T.(6) U-WAVE-T receives the confirmation signal from U-WAVE-R, and can confirm the success (or failure) with LED (Buzzer).IMPORTANT• Log in to Windows by ‘Power Users’ or above. • The U-WAVE-PAK automatically transmits the measurement data to the active application software (such as Microsoft Excel or Microsoft word). Before booting multiple applicationsoftware simultaneously, be sure to activate the application software that you want to use.• U-WAVE-R receives the data from the U-WAVE-T and wireless transmits the confirmationsignal to the U-WAVE-T, even if U-WAVEPAK doesn't start .Please confirm measurements are displayed in the application software that is before the measurement begins that wants to be used. 2) Low power supply alarmRed LED blinks when the voltage of the power supply from the personal computer decreases.(Green LED is in the state of lighting.)Please change to a new USB cable at such a state.3) Initializing the setting information If communication is disabled while using the U-WAVE-R, first refer to section 5. If communication is still disabled, initialize the information set in section 3 to default settings, and then retry setup.Initialize the setting information with the following procedure.(1) Close U-WAVEPAK activated on the personal computer, and then pull off the cable of theU-WAVE-R from the USB cable on the computer.(2) While holding down the INIT. switch on the U-WAVE-R, plug the cable from the U-WAVE-R into the USB cable on the personal computer again. Wait for 3 seconds or more in this state. The setting information is initialized. At this time check that the green LED is blinking.(3) Implement the setup again.IMPORTANTOnce initialization is performed, the setting information used until then is all cleared. [5] Troubleshooting If any trouble is not corrected even when the following actions are taken, contact a Mitutoyoservice center.Please read the final page of “U-WAVEPAK User’s Manual“ in “PDF_Manual” folder of the CD supplied as a standard accessory about Mitutoyo service center.1) Confirmation of U-WAVE-R (1) The green LED will not light up (or start blinking).• Is the power to the personal computer turned on?• Is the USB cable connected between the U-WAVE-R and personal computer?The U-WAVE-R is supplied with power from the personal computer, and thereby no power will be supplied to the U-WAVE-R unless the personal computer is turned on. Check the USB cable for proper connection. • Is the USB driver installed?(2) The red LED is blinking with the green LED being lit.• Is any undue force applied to the USB cable? Check the connecting condition of the USB cable. Also, the USB cable might be broken internally. Check it out by using a new USB cable.(3) The green LED and red LED keep blinking alternately.• Has setup been completed?Referring to the U-WAVEPAK User’s Manual, set up the system correctly.• Does any U-WAVE-R with the same group ID and band ID exist near the U-WAVE-R? Set different information for each ID in the U-WAVE-R.2) Confirmation of U-WAVE-T(1) Data transmission always fails and the red LED lights up.• Is the LCD of the Measuring tool put in the count display state?Communication is not possible if the LCD on the connected Measuring tool is turned off or in the data entry state. Put the Measuring tool LCD in the count display state. • Has the battery voltage come down?If the battery is consumed to a low voltage, the red LED is blinking and data transmission is disabled.Replace the battery with a new one.• Is the U-WAVE-T installed correctly on the Measuring tool?Recheck that the U-WAVE-T and the Measuring tool are properly mated using the supplied connecting cable.Also, when using the specific connecting cable (02AZD791A, B), be sure to mate the black-marked side of the connecting cable with the U-WAVE-T.• Is the device ID described in the label on the U-WAVE-T set in the connecting state on the U-WAVEPAK?Unless it is in the connecting state, communication is not implemented.Referring to read the “U-WAVE Quick manual “ and “U-WAVEPAK User’s Manual“ in “PDF_Manual” folder of the CD supplied as a standard accessory, set up the system correctly.(2) The U-WAVE-R search cannot be executed, blinking orange color LED disappears, and red LED blinks.• Is the U-WAVE-T installed correctly on the Measuring tool?Recheck that the U-WAVE-T and the Measuring tool are properly mated using the supplied connecting cable.If U-WAVE-T is installed correctly on the Measuring tool correctly, initialize the settinginformation and then retry communication after referring “section 6 (2) in U-WAVE-T manual”3) Confirmation of Wireless Communication EnvironmentsData communication is not stabilized, causing an error frequently. • Is the U-WAVE-R separated too far from the U-WAVE-T?• Is there any obstacle between the U-WAVE-R and the U-WAVE-T?First, bring these instruments close to each other, and then try communication betweenthem. If an obstacle such as a wall or a metallic partition exists between the U-WAVE-R and U-WAVE-T, communication may be affected adversely. Also, the communication condition may be improved by changing the U-WAVE-R location andorientation. • Is any microwave oven, wireless LAN, or Bluetooth used nearby? A wireless communication device or electric household appliance using a frequency of 2.4 GHz, which is close to the frequency used in the U-WAVE-R, might be affected adversely. Particularly, medical equipment could cause a threat to life due to electromagnetic interference. Carefully use the U-WAVE-R while separating sufficiently from such equipment. Also, check the situation of used bands at the periphery with the U-WAVEPAK and change the current band to that with better communication quality. It may be possible to stabilize communication. Make an attempt on this, referring to “U-WAVEPAK User’s Manual“ in “PDF_Manual” folder of the CD supplied as a standard accessory.○ Standard accessories0û U-WAVE-R User’s Manual this manualÿ No. 99MAL109B 0û U-WAVE QUICK Manual No. 99MAL110B 0û USB cable (1m) No. C177-0080û An Installation board No. 02AZD815 0û Cross-recessed head tapping screws nominal size 2.6 × 6 No. A131-6221CP 2pcs. 0ûU -WAVEPAK No.02ARB110 (The following contents bundle into the CD) 0û U-WAVEPAK Program 0û USB Device Driver 0û Data Collection Macro for U-WAVE 0û U-WAVEPAK User’s Manual No. 99MAL216 0û Warranty card Mitutoyo Corporation20-1, Sakado 1-Chome, Takatsu-ku, Kawasaki-shi, Kanagawa 213-8533, Japan。

船舶英文缩写

船舶英文缩写
ed Hours of Work Scheduled Boundary Integral Method The Baltic and Internation Maritime Council Built for In-Water Survey Bracket Base Line Brake Mean Effective Pressure Barge Mounted Plant Bridge Maneuvering System Burner Management System Biochemical Oxygen Demand Boiled Off Gas Bill of Material Back Order Quantity Brine British Standards Boiler Survey British Standard Institution British Ship Research Association Builder's Sea Trial Builder's Trial British Thermal Unit Bureau Veritas Bilge Well Ballast Water Tank Bonded Warehouse Transaction Chartered Base Center of Gravity cofferdam Cargo Hold Center Line Credit Note Certificate of Origin Capacity Plan Control Air Comite Des Association D'Armateurs Des Communautes Europeennes Centralized Administration & Control Center Computer Aided Design Computer Aided Design And Manufacturing Cad-Adra Computer Aided Manufacturing Computer Aided Process Planning Corrective Action Request Component Assembly Shop Condition Assessment Scheme Canadian Standards Association Block Coefficient Clean Ballast Tank Corvette Class Comment Item Cargo Control Room

空口测试方法及其新应用

空口测试方法及其新应用

92021年第2期 安全与电磁兼容漆一宏 加拿大工程院和美国国家发明家科学院院士、深圳鹏城实验室科学家、深圳通用测试系统有限公司董事长。

研究领域为测试理论与技术、天线、卫星定位和无线感知。

已发布和正在申请的专利近500项。

西安电子科技大学博士。

1995~2010年任加拿大黑莓公司高级电磁研究技术总监。

目前,他是密苏里科技大学EMC 实验室的兼职教授,西南交通大学名誉教授。

曾获IEEE EMC 学会技术成就奖、CES 创新奖和网络 产品奖 。

IEEE Transactions on Electromagnetic Compatibility 和 IEEE Internet of Things Journal 副主编。

引言无线通讯、无线感知、雷达、无线定位是以智能驾驶、智慧医疗和智能家居为标志的智慧世界的基石[1]。

无线终端的性能会影响其信号覆盖范围、数据传输速率等关乎用户体验的指标。

无线通讯系统的性能也会影响无线网络的频率复用、网络的稳定性、可靠性以及网络的建设成本等,这些都是网络开发商和运行商关注的系统指标。

对于无线终端和分系统的设备制造商而言, 无线性能关系到企业的信誉、产品的开发成本和上市时间。

因此,国际标准组织3GPP 和CTIA 定义了标准无线性能OTA 测试方法的评价方式,以便无线技术的推广与普及[2-3]。

OTA 测试的指标包括基本无线连接指标和系统通讯效率指标。

其中空口测试方法及其新应用Over-the-air Test and its Novel Applications深圳市通用测试系统有限公司漆一宏 李俊 翁子杉 沈鹏辉 罗庆春 刘列摘要在移动通信领域,空口测试(OTA)已成为无线设备性能评估的标准方法,并广泛用于通讯基站、通讯终端的性能评估。

随着无线通信在智慧城市的应用,OTA 迎来了新的挑战。

新的测试技术与方法被不断地引入到传统通信测试领域,如文中提出的辐射两阶段法、近场快速测量及场源重构等方法,可以解决OTA 在汽车测试、卫星相控阵天线测试、毫米波测试、大型物联网终端测试等新领域的应用中所面临的工程与技术难题,同时使空口测试系统能够测得准、测得快和用得起。

翻译

翻译

pixel Patterns Euler perimeter (equivalent interac t alternative Syntax capabilities民主democracy 科学science Approach motor diagnosis applications确no-stationary 不了harmonic by means of FFT aturation or control interaction broken bars and shorted stator turns using winding operation o到induction motor 解voltage component.C axial flux and d-q current and voltage component. majority of them based on destructive effect Stator winding faults functions (IMF) of the signal being analyzed; thus, it is notfunctions (IMF) of the signal being analyzed; thus, it is notphase-to-phase phase-to-ground phase否Armature faults tolerant in the presence of any single point I. INTRODUCTION intrinsic mode functions Index Terms Decompositiondemonstrateanalysis V alidate表明instantaneous frequencies 成本a collection of intrinsic mode functions analyzedStator conditionsanalyzes studypresents paper Abstract Wigner Ville DistributionDecompositionDetectionPermanent Magnet Synchronous MotorWignerDecomposition Ville Distribution failures in synchronous machines. demonstrateExperimental laboratory results validate instantaneous frequencies resulting Hilbert–Huang transform collection intrinsic mode Stator Current simulationmeans of speed transients circuit include either saturation or control interactions. From yearsfailures for Permanent Magnet Synchronous Motor analyzes Wigner Ville Distribution means oEmpirical Mode Decomposition Short Circuit Fault Short Circuit itCircuit Fault Detection in PMSMC Sequencer axial flux and d-q current and voltage component. Inter-integrated circuit moduleperipheralIntegrated Emulation synchronous serial I/OversionPlus Segregates Peripheral Framessegregatesdecoupled from increasing CPU clock speeds timing of peripheralsis fed into VBvalidfree running up counter maskedinterrupt linesblockBranch to SCI, skip ADC calibrationpresents a unified memory linker.execute code or for data variables. The partitioningprocessor Memory BusMultiplexes Frame V ersions Migration ninterference. icritical code locationsprogrammable strobe timingmultiplexes enables glueless interface Strobe programmableExternally modifiedExtending Asynchronous Stack on C28x devices, are mapped to both program and data space. Hence,Embedded Mapped flash/OTP Pipelining V alidate Strobe uniqueversioninterconnect.ArchitectureFetches Simultaneous data1-wait Random min Paged FLASH Programmable Programmed via Sectors configuration*spurious Certain memory ranges are EALLOW protected against sp restricted tPeripheralFrame Espeed transients nhanced capture input/output 2 tie conversionceramic bypass capacitorPositive Outpunce Medium Output.External Current Bias Resistor. Low Reference (executionDevice high-impedance stated for TI. Must be left unconnected. (I/O)Reserved fEmulatoEmulator adequate protection.internal pullup internal pulldown d Controller Area NetworkMultichannel Buffered Serial Port (McBSP)/SPI32-bit Capture inputs or auxiliary PWM outputsrespectivelyabbreviateddemanding control applications.Disable Individual Peripheral ClocksEmulation FeaturesJTAG Boundary Scan SupportProgrammableInternal or External ReferenceChannel Input MultiplexerUp to 6 Event Capture InpPWM OQuadrature Encoder InterfacesHRPWMUp to 6 HRPWM Outputs With 150 ps MEPResolutionPrevents Firmware Reverse EngineeringBlockOscillator–Dynamic PLL RatioSci pci capture modules失落Release note RTX Runtime Development KitEvaluationV ersion expires evaluation starvation exception. Issues That Have Been Resolved In RTX 7.0 execute real-time applications in the releasereleaseadministrator privileges. versionslog logout ofthe domainActive Directory, multiprocessor (MP) systems two process processorUpdate the “Emergency Recovery” disk for the system (i Computer node (click on the plus sign) to show its leaf. Computer nodeHardware>Device Manager HAL type. rebootedX Samples directory hear a steady 1 KHz tone for 15 seconds along with a histogramof the systems response time measurements. purchase order is processedRTX environment along with providing networking support to the RTX Peripherals hihg-resolution modules network core dual mac interface chip oscillator expansion fir reverse 复制I am always on you side 横波斯湾纵波pertain inertial magnitude vibration vibrate Amplitude expenditure quantify calibrate analogous constraint intelligible extraneous amplification modify sector portion ancestry barest precisseness intermediate usable pulse tolerances detail filter transducer spindle contact springmass elastic orifice buoyant venturi vane propeller opt contactor ical photoelectric cell lenses optical filters amplify attenuating telemeter integrate fiber resistance displacement index electron column 圆锥taper 正alphanumeric readout ink light beam photographic magnetic compute strain deed selectivein integration differentiating telemeter s ek comprehensible senses intend recognitione exception indicating oscilloscope oscillograph light beam odometer voltmeter cylinder piston stem scale division bears against compress applied indicate velocity voltage addition attenuatean anatrlog respect thereby velocity linear adynamic response available optimum component importan bond gage manufacture applied apply unit structure gage install ambiguous substituted predetermined period ic nonrepetitive transient aperiodi transient response wavefront static productivity significant management discipline detection prediction profitability inspectoion boundary catastrophic compensation Dictate unmanend rugged intrusive viscosity load consistency force Turbidity density optical refraction nucleonic mass overall monitors discrete frepuency monitor 连续的确shock pulse monitor signal averaging capacitive sensorinherent properties possess stiffness oscillates equilibrium bandwidth peak amplitude bar digits arrow minor source refresh ezplot subscript indices propertypertinent subject numerical upon represent significance interplay variable systematic manipulation deviations loosely procedures terminologies theory statisticalhypotheses theoretical calculate prime universe finite diameter 半径radius radii semidiameter marbles represent nebulous infinite yield specimen sample coal unit analytical velocity vacuo evaluated apparatus cumulative multisample intent estimate indicated applied express inasmuch resort thereof interchangeably instrument specification amount bias systematic alibration recure resolution precisionsensitivity illegitimate blunder computational chaotic insidious repetitive recure susceptible statistical propagation probability predictn predetermined dispersed termed deviation insertion coefficientjustify readout warranted take into account orifice sharpedged assumed incremental variations unrun ignite soak taper ball b dramatically rotating manifest degradation spectrum earing harmonics duration assume sharpedged微米micrometer micron 分米decimeter毫米coefficient nominal diverter synchronization distribution 厘米centimeter spall overroll stress short duration Domain rectification rectificate simulate harmonic resultant series summation sumtossed rigorous favorable heads and tails preclude 排除万难premise 前提likelihook dice histogram manipulate applicable disperse 分散curve premise dashsolid curve standard deviation arithmetic mean 方差epuation equation normal datum date date 操作entity 空虚vacuity 支持sustain bear abet aegis auspice 擦brush rub wipe scrape 资源exploit essence exploition polarization ultimately productive force develop configue abort palette captain label updates relevance autostemming off morniting monitoring abstract program standard deviationssu bset cluster attribute time stamp variant chart graph error outweigh essent issueial iillusion dramatically extraordinary contribute to contentment adopt meaningful phenomenon employees acknowledge laborious consequently funds fees tuition soar ing dramatically authors interpreting basis engineer comparison calibrate inch ancestry wavelength krypton radio strip transduction electricalintegrate ion differentiating telemetering comprehensible recognition indicating odometer voltmeters tire automobile cylinder piston resisting stem division bear compresses applied summing voltage accelerometer galvanometer type amplifieramplifie r resistance bios bond pdf PDF eq ordinate uatio n 横坐标abscissa 寝室bedchamber 宿舍dorm dormitory hostel lodging house symmetrical abide bia s error offset duplicateghost kid video badges porn demo embed blockset neural 铣刀sensor fusion fuck disastrous solitary absurd kindergartens nursery unfavorable devote supervise far outweigh profound raptures mere mention artisticand forever sculptures galleries rarities maintain essential essence infrastructure priority advocate invest sum inrural emigrants peasants sociologists scarce worsened loneliness obstacle alien dormitory library homelessness smoothly ashion merely 党员干部团员duplicate analyze application interpolation dimension data socket phase specify propertites binary byte scan refnum fret bound imaginary command state usage blunder sophisticated susceptible simplest doubted legitimate stem calibration synchronized fabrication vector described angel 键盘columns. Network layer bias competitive overall monitor discrete frequency monitor shock pulse kurtosis cepstrum analysis inductive sn capacitive electrically conducting filtersoptical oil turbidity magnetic plugs centrifuges particle counter ferrography wear debris acoustic debris strain access blower boiler brazing cou peak value sd plingkurtosis standard deviation skewness phase geometric mean arithmetic mean crest factorroot mean square handler polling adspacer config phase peak vector RMS transpose pertain operation performance develop angular fashion voltage mutual levels of significance thorough evaluation realize derive illegitimate source determination essential precision error competitive truncated valid 本科隐私intimacy 专业检测技术the technology of measurement and instrument仪器仪表vt九月份获得奖情况陇望蜀奖学金奖励制度成绩一等三好学生优秀excellent student 机器人优胜w 奖奖励比赛robot 竞赛活动t物理学competition of physics 软件包熟练master 轻松简单software of office 流利流畅娴熟熟悉familiarly 担任委员assume the commissioner of propagandize of class 宣传计量实习期practice of measurement The 2nd. Heavy Machinery Manufacturing Factory/Plant Practice of measurement inThe 2nd Heavy Machinery Manufacturing Factory in China 八月☐Aa电子工艺实习期technics of electron 实验室课程设计实习期Assume the commissioner of propagandize of class for one year and studying of☐担当担任make occupy act 宣传Ability to deal with personnel at all levels effectively. Ability to work independent1y, mature and resourceful.☐个人评价individual生产测试工程师production testing engineer 参加革命加入实验室友laboratory 困难重重师兄坚持原则优点缺点心理素质惊艳心态认真对待graveness 党员成绩斐然改进arrogance 源头确original 资源宠物form unit spuninst1)讲述DSP 的CPU,memory,program memory addressing,data memory addressin EVM 板,DSK 等原理图,完成DSP 、各控制信号管脚的连接、JTAG口的CCS supply Peripheral BusMemory Bus (Harvard Bus Architecture) . External Interface (XINTFExpansion (PIE) Block3.3 Register Map.Device Emulation Registers fpgaInterface JTAG test reset with internal pulldown. TRST, when driven high, gives the scan system control of the operations of the device. If this signal is not connected or driven low, the device operates in its functional mode, and the test reset signals are ignored.NOTE: TRST is an active high test pin and must be maintained low at all times during normal device operation. An external pulldown resistor is recommended on this pin. Thevalue of this resistor should be based on drive strength of the debugger pods applicable tothe design. A 2.2-k? resistor generally offers adequate protection. Since this isapplication-specific, it is recommended that each target board be validated for properoperation of the debugger and the application. (I, ↓){}Firmware Reverse Engineering Event Capture Inputs Serial Port Peripherals Multiplexed GPIO Pins With Input FilteringBoundary Scan SupportEmulation Featureunitauxiliary PWM QEPMultichannel Buffered Serial Port Serial Peripheral Interface (SPI)Serial PortTable 2-3 describes the signals. The GPIO function (shown in Italics) is the default at reset.alternate functions.indicated). All GPIO pins are I/O/Z and have an internal pullupenabled upon reset.,JTAGInternal Reference Positive Output.ceramic bypassADCREFP 56 P5 P5capa citor of 2.2 μF to analog ground. (O)Memory blocks are not to scale.Peripheral FrameAssumes。

汽车消声器的声学性能分析与结构优化

汽车消声器的声学性能分析与结构优化

48机械设计与制造Machinery Design&Manufacture第4期2021年4月汽车消声器的声学性能分析与结构优化顾倩霞,左言言,赵海卫,宋文兵(江苏大学振动噪声研究所,江苏镇江212013)摘要:针对某三缸发动机排气嗓声超出目标限值,将声学性能作为评价指标,利用b声学有限元樸块对排气消声器的声学性能进行仿真分析,对比传递损失试验结果对该声学软件的仿真精度作出评价:b软件在整个频段与试验值较为接近,能准确的反映消声器的声学性能。

根据原排气消声器的传递损失分析结果,提出亥姆霍兹共振腔结构及阻抗复合型结构等参数设计的前后端消声器优化方案。

最终对优化后的排气消声器进行尾管嗓声试验,确认排气噪声达标。

关键词:排气消声器;仿真分析;传递损失;尾管噪声中图分类号:TH16;TB535.2文献标识码:A文章编号:1001-3997(2021 )04-0048-05Acoustic Performance Analysis and Optimized Design of Vehicle MufflerGU Qian-xia, ZUO Yan-yan, ZHAO Hai-wei, SONG Wen-bing(Institute of Noise and Vibration of Jiangsu University,Jiangsu Zhenjiang212013, China)Abstract:Base on a three-cylinder engine exhaust noise exceeding target limit y according to the evaluation index of acoustic performance y the analysis of acoustic performance was conducted in acoustic FEM module o f software VirtuaL Comparing the transmission loss test results to evaluate the simulation accuracy of the acoustic software:the simulation results〇/*b software were close to the experimental value on entire frequency band and accurately reflection on the acoustic performanceof the muffler.The simulalion results are compared with the test results to confirm the simulation accuracy.According to the analysis results of the transmission loss of the original exhaust muffler^optimization solutions for front and rear mufflers designed with parameters such as Helmholtz resonator and impedance compound structure was proposed for the frequencyband with poor muffling effect.Finally,the tail pipe noise test was performed on the optimized exhaust muffler to confirm thatthe exhaust noise reached the standard.Key Words:Exhaust Muffler;Simulation Analysis;Transmission Loss;Tailpipe Noisel引言2原排气消声器测试数据分析据国外有关资料统计,交通噪声占整个环境噪声比例达到75%,是目前影响城市环境和人体健康的主要噪声来源。

DAC31x2EVM用户手册说明书

DAC31x2EVM用户手册说明书

User's GuideSBOU096A–November2010–Revised January2011DAC31x2EVM This document is a user's guide for the DAC31x2EVM,an evaluation fixture for the DAC3152and DAC3162(DAC31x2)series of dual-channel,10-/12-bit,500-MSPS digital-to-analog converters(DACs).The DAC31x2EVM includes the TRF3703-33quadrature modulator to facilitate measuring the output signals at a desired RF frequency.The EVM also includes the CDCP1803clock buffer that distributes the clocks to the DAC,as well as a pattern generator.This EVM is ideally suited for mating with the TSW3100 pattern generation card for evaluating QAM,WCDMA,LTE,or other high-performance modulation schemes.For more information about the DAC31x2family,see the product data sheet(available for download at ).Throughout this document,the acronym EVM and the phrases evaluation module and evaluation fixture are synonymous with the DAC31x2EVM.Contents1Introduction (2)2Testing and Configuration (3)List of Figures1DAC31x2EVM Block Diagram (2)2DAC31x2EVM Test Setup (3)3TSW3100CommsSignalPattern(WCDMA)Programming GUI (4)4DAC3162EVM and TRF3703-33WCDMA Output (5)5DAC3162EVM Transformer-Coupled Output at30MHz IF (6)All trademarks are the property of their respective owners.1 SBOU096A–November2010–Revised January2011DAC31x2EVM Submit Documentation FeedbackRFLO (Introduction 1Introduction 1.1Block DiagramFigure 1shows the DAC31x2EVM block diagram.Figure 1.DAC31x2EVM Block Diagram1.2Software ControlNo software is required to use the DAC31x2EVM.2DAC31x2EVM SBOU096A–November 2010–Revised January 2011Submit Documentation Feedback Testing and Configuration 2Testing and ConfigurationThis section outlines the basic procedure for testing the DAC31x2EVM.2.1Test Set-UpFigure 2illustrates the test configuration for general testing of the DAC31x2with the TSW3100patterngeneration card.Figure 2.DAC31x2EVM Test Setup2.2Test Set-Up ConnectionsFollow these procedures to properly connect the DAC31x2EVM and the TSW3100pattern generator.TSW3100Pattern Generator:•Connect a 5-V power supply to J9,the 5V_IN jack of the TSW3100EVM.•Connect the PC Ethernet port to J13,the Ethernet port of the TSW3100.The cable should be astandard crossover Cat5e Ethernet cable.DAC31x2EVM:•Connect the J5connector of DAC31x2EVM to connector J74of the TSW3100EVM.•Connect 5V and Ground to connectors J12and J13respectively.•Provide a 0.5-V RMS ,500-MHz (max)clock at J9,the CLOCK IN SMA port of the DAC31x2EVM.•Provide a 7-dBm,350-MHz to 4-GHz local oscillator (LO)source at port J10of the DAC31x2EVM.Thisinput provides the LO source to the TRF3703-33modulators.•Connect the RF output port of (J11)to the spectrum analyzer.DAC31x2EVM Jumpers:Power distribution to the DAC31x2and CDCP1803devices on the EVM can be achieved throughlow-dropout regulators (LDOs)or dc-dc converters.Jumpers JP24,JP25,JP26,and JP27allow theuser to choose one of the power schemes from these two available options.The default setting ofthese jumpers is shown;these settings use power management for the ICs through dc-dc switchers.•JP24on pin {1,2}•JP25on pin {1,2}•JP26on pin {1,2}•JP27on pin {1,2}Jumper JP4supplies power to the TRF3703-33modulator.This jumper must be installed in order to usethe modulator.3SBOU096A–November 2010–Revised January 2011DAC31x2EVM Submit Documentation FeedbackTesting and Configuration 2.3TSW3100Quick-Start OperationRefer to the TSW3100User’s Guide for a more detailed discussion of how to set up and operate theTSW3100.This user guide presumes that the TSW3100software is installed and functioning properly.CommsSignalPattern Setup from Default Configuration(WCDMA):Step1.Change the interpolation value to DAC Clock Rate/3.84(that is,491.52/3.84=128).Step2.Enter the desired offset frequency(for example,30MHz)for each desired carrier.Step3.Select the LVDS Output button.Step4.Select the Offset Binary option.Step5.Check the LOAD and Run box.Step6.Press the green Create button.Figure3shows a screenshot of the properly configured TSW3100software interface.Figure3.TSW3100CommsSignalPattern(WCDMA)Programming GUI4DAC31x2EVM SBOU096A–November2010–Revised January2011Submit Documentation Feedback Testing and Configuration 2.4DAC31x2EVM Configuration for Modulator OutputFollow these steps to set up the DAC31x2EVM and perform a spectrum analysis.at the J9SMA connector of the DAC31x2EVM.Step1.Set the clock input to491.52MHz at0.5VRMSStep2.Supply the LO source of900MHz(7dBm)at the J10SMA connector of the DAC31x2EVM.Step3.Turn on power to the board at J12/J13.Step4.Verify the spectrum using the Spectrum Analyzer at the RF output of the DAC31x2EVM (J11).A typical WCDMA output from a wave analyzer is shown in Figure4.Figure4.DAC3162EVM and TRF3703-33WCDMA Output5 SBOU096A–November2010–Revised January2011DAC31x2EVM Submit Documentation FeedbackTesting and Configuration 2.5DAC31x2EVM Configuration for DAC OutputFollow this procedure to configure the DAC31x2EVM in order to test the EVM signal output.Step1.Four0-Ωresistors must be moved in order to configure the output of the DAC31x2as1:1 transformer-coupled.•Remove the resistors R109,R110,R111,and R112•Install the resistors R211,R207,R191,and R195Step2.Provide the clock input:491.52MHz at1.5VRMS at the J9SMA connector of theDAC31x2EVM.Step3.Turn on power to the board at J12/J13.Step4.Verify the spectrum using the Spectrum Analyzer at the two DAC outputs of theDAC31x2EVM(J3and J2).Figure5illustrates a typical transformer-coupled output using a wave analyzer.Figure5.DAC3162EVM Transformer-Coupled Output at30MHz IF6DAC31x2EVM SBOU096A–November2010–Revised January2011Submit Documentation Feedback Revision HistoryRevision HistoryChanges from Original(November,2010)to A Revision Page •Updated abstract to reflect device availability;removed DAC3172from associated devices (1)•Updated title of Figure4 (5)•Changed title of Figure5 (6)NOTE:Page numbers for previous revisions may differ from page numbers in the current version.7 SBOU096A–November2010–Revised January2011Revision History Submit Documentation FeedbackEvaluation Board/Kit Important NoticeTexas Instruments(TI)provides the enclosed product(s)under the following conditions:This evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.Persons handling the product(s)must have electronics training and observe good engineering practice standards.As such,the goods being provided are not intended to be complete in terms of required design-,marketing-,and/or manufacturing-related protective considerations, including product safety and environmental measures typically found in end products that incorporate such semiconductor components or circuit boards.This evaluation board/kit does not fall within the scope of the European Union directives regarding electromagnetic compatibility,restricted substances(RoHS),recycling(WEEE),FCC,CE or UL,and therefore may not meet the technical requirements of these directives or other related directives.Should this evaluation board/kit not meet the specifications indicated in the User’s Guide,the board/kit may be returned within30 days from the date of delivery for a full refund.THE FOREGOING WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES,EXPRESSED,IMPLIED,OR STATUTORY,INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE.The user assumes all responsibility and liability for proper and safe handling of the goods.Further,the user indemnifies TI from all claims arising from the handling or use of the goods.Due to the open construction of the product,it is the user’s responsibility to take any and all appropriate precautions with regard to electrostatic discharge.EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE,NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT,SPECIAL,INCIDENTAL,OR CONSEQUENTIAL DAMAGES.TI currently deals with a variety of customers for products,and therefore our arrangement with the user is not exclusive.TI assumes no liability for applications assistance,customer product design,software performance,or infringement of patents or services described herein.Please read the User’s Guide and,specifically,the Warnings and Restrictions notice in the User’s Guide prior to handling the product.This notice contains important safety information about temperatures and voltages.For additional information on TI’s environmental and/or safety programs,please contact the TI application engineer or visit /esh.No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine,process,or combination in which such TI products or services might be or are used.FCC WarningThis evaluation board/kit is intended for use for ENGINEERING DEVELOPMENT,DEMONSTRATION,OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end-product fit for general consumer use.It generates,uses,and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part15 of FCC rules,which are designed to provide reasonable protection against radio frequency interference.Operation of this equipment in other environments may cause interference with radio communications,in which case the user at his own expense will be required to take whatever measures may be required to correct this interference.EVM Warnings and RestrictionsIt is important to operate this EVM within the input voltage range of5V to7V and the output voltage range of2.8V to3.8V. Exceeding the specified input range may cause unexpected operation and/or irreversible damage to the EVM.If there are questions concerning the input range,please contact a TI field representative prior to connecting the input power.Applying loads outside of the specified output range may result in unintended operation and/or possible permanent damage to the EVM.Please consult the EVM User's Guide prior to connecting any load to the EVM output.If there is uncertainty as to the load specification,please contact a TI field representative.During normal operation,some circuit components may have case temperatures greater than+55°C.The EVM is designed to operate properly with certain components above+55°C as long as the input and output ranges are maintained.These components include but are not limited to linear regulators,switching transistors,pass transistors,and current sense resistors.These types of devices can be identified using the EVM schematic located in the EVM User's Guide.When placing measurement probes near these devices during operation,please be aware that these devices may be very warm to the touch.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。

M.2135 Guidelines for evaluation of radio interface technologies for IMT-Advanced

M.2135 Guidelines for evaluation of radio interface technologies for IMT-Advanced

This Report provides guidelines for both the procedure and the criteria (technical, spectrum and service) to be used in evaluating the proposed IMT-Advanced radio interface technologies (RITs) or Sets of RITs (SRITs) for a number of test environments and deployment scenarios for evaluation. These test environments are chosen to simulate closely the more stringent radio operating environments. The evaluation procedure is designed in such a way that the overall performance of the candidate RIT/SRITs may be fairly and equally assessed on a technical basis. It ensures that the overall IMT-Advanced objectives are met.
All rights reserved. No part of this publication may be reproduced, by any means whatsoever, without written permission of ITU.
Rep. ITU-R M.2135-1
1

大功率单路和功率合成式100-115GHz肖特基平衡式二倍频器

大功率单路和功率合成式100-115GHz肖特基平衡式二倍频器

第40卷第1期2021年2月红外与毫米波学报J.Infrared Millim.Waves Vol.40,No.1 February,2021文章编号:1001-9014(2021)01-0013-06DOI:10.11972/j.issn.1001-9014.2021.01.003 High power single and power-combined100~115GHz Schottky balanceddoublersTIAN Yao-Ling1,2,HUANG Kun1,2,CEN Ji-Na1,2,TANG Chuan-Yun1,Lin Chang-Xing1,2*,ZHANG Jian3*(1.Microsystem and Terahertz Research Center,China Academy of Engineering Physics,Chengdu610200,China;2.Institute of Electronic Engineering,China Academy of Engineering Physics,Mianyang621900,China;3.School of Electronic Science and Engineering,University of Electronic Science and Technology of China,Chengdu611731,China)Abstract:The research on high power110GHz single and power-combined frequency doublers based on discretediodes is presented in this paper.The doubler with a single Schottky diode circuit has a measured peak efficiencyof33%and bandwidth over13.6%.Meanwhile,two different architectures with two single devices adding in-phase have been utilized to realize the power-combined doublers.The combined doubler features four discreteSchottky diodes with twelve junctions altogether soldered on two127μm-thick ALN substrates.Both deviceshave demonstrated output powers more than200mW with a pumping power over800mW and are capable of pro⁃viding more power for higher driven power.Key words:110GHz,balanced doubler,Schottky,power-combinedPACS:85.30.Hi,85.30.Kk,84.30.Vn,07.57.Hm大功率单路和功率合成式100~115GHz肖特基平衡式二倍频器田遥岭1,2,黄昆1,2,岑冀娜1,2,唐川云1,林长星1,2*,张健3*(1.中国工程物理研究院微系统与太赫兹研究中心,四川成都610200;2.中国工程物理研究院电子工程研究所,四川绵阳621900;3.电子科技大学电子科学与工程学院,四川成都611731)摘要:研究了基于肖特基二极管的单路和功率合成式110GHz大功率平衡式二倍频器。

畸变产物耳声发射在飞行员早期听力损失诊断中的应用

畸变产物耳声发射在飞行员早期听力损失诊断中的应用

畸变产物耳声发射在飞行员早期听力损失诊断中的应用向华;王纯巍;杨忠【摘要】目的了解噪声对飞行员畸变产物耳声发射的影响,以便及早发现听力损失,为空军卫生勤务保障提供参考.方法采用纯音听力计和耳声发射测试仪,对30名低年龄段飞行员、7名高年龄段飞行员及30名健康青年分别进行纯音听阈和畸变产物耳声发射检查.结果飞行员听力损失主要在3 ~8 kHz,可以出现单耳高频听力损失.随着年龄增加,逐渐出现双耳高频听力损失.低年龄段飞行员和健康青年两组受试者0.5~8 kHz平均纯音听阈差异无统计学意义.低年龄段飞行员1 kHz和6 kHz 畸变产物耳声发射幅值低于健康青年,两组差异具有统计学意义(t=2.11,P<0.05;t =2.41,P<0.05).低年龄段飞行人员2、3、4、8 kHz畸变产物耳声发射幅值与健康青年类似,两组差异无统计学意义.低年龄段军事飞行员高频纯音听阈异常率(13.3%)和健康青年(6.7%)的差别无统计学意义.低年龄段飞行人员高频畸变产物耳声发射异常率(33.3%)高于健康青年(6.7%),两组差异具有统计学意义(x2 =5.10,P <0.05).结论畸变产物耳声发射受噪声的影响较纯音听阈敏感,畸变产物耳声发射可早期发现飞行员的噪声性听力损失.【期刊名称】《武警医学》【年(卷),期】2014(025)005【总页数】4页(P462-464,467)【关键词】飞行员;畸变产物耳声发射;听力损失;噪声【作者】向华;王纯巍;杨忠【作者单位】101111,北京市医疗器械检验所;100142北京,空军总医院感染内科;101111,北京市医疗器械检验所【正文语种】中文【中图分类】R764畸变产物耳声发射(distortion product otoacoustic emission,DPOAE)是由两个不同频率的纯音同时刺激诱发的耳蜗外毛细胞主动活动产生的,可于外耳道记录的一种声能。

它具有高度的灵敏性和频率选择性,能够早期、客观地反映耳蜗外毛细胞的轻微损害[1]。

屏蔽效能宽带同轴线夹具的优化设计与测试

屏蔽效能宽带同轴线夹具的优化设计与测试

屏蔽效能宽带同轴线夹具的优化设计与测试陈翔;陈永光;魏明;罗乐;胡小锋【摘要】为解决现有同轴线夹具测试设备无法满足材料电磁脉冲屏蔽效能时域测试的宽频带要求等问题,在对同轴内外导体尺寸和过渡段进行分析的基础上,使用粒子群优化算法结合电磁场数值分析软件对支撑介质进行了优化设计,研制了一种宽带同轴线夹具测试装置.实测结果表明:所研制的同轴线夹具装置,回波损耗在6.4GHz以下小于-20 dB;将材料屏蔽效能的测试频段上限最低扩展到6.4 GHz的同时,还保证了低频下限可达直流;测试所需的材料试样更小,曲线更平滑.【期刊名称】《电波科学学报》【年(卷),期】2013(028)004【总页数】6页(P788-793)【关键词】屏蔽效能;同轴线夹具;屏蔽材料;粒子群优化【作者】陈翔;陈永光;魏明;罗乐;胡小锋【作者单位】军械工程学院静电与电磁防护研究所,河北石家庄050003;军械工程学院静电与电磁防护研究所,河北石家庄050003;军械工程学院静电与电磁防护研究所,河北石家庄050003;解放军63893部队,河南洛阳471003;军械工程学院静电与电磁防护研究所,河北石家庄050003【正文语种】中文【中图分类】TM153引言材料电磁脉冲屏蔽效能的测试,是强场作用下的弱信号测量,必然要求测试系统有足够大的动态范围[1-3].在参考现有标准[4]的基础上改进的一些脉冲时域测试方法,如“窗口法”、“试件法”,由于受脉冲场传感器的制约,动态范围有限,而使用同轴线夹具测试方法则能很好地克服这一问题.目前,比较典型的同轴线夹具测试方法有美国材料试验学会(American Society for Testing and Materials,ASTM)的两个标准ES7和D4935,其测试频率上限均为1.5 GHz[6].ASTM ES7的特点是同轴的中心导体连续,其低频下限主要由信号源确定,理论上可到直流.而ASTM D4935特点是测试时内外导体全断开,使用法兰配合塑料螺母夹持材料,依靠测试面的容性电流保持电连接,其频率下限为30 MHz[7].虽然Sarto M S等[8]和Vasquez H L等[9]分别在2006年和2009年,研制了高频上限达8 GHz和13.5 GHz的导体断开同轴线夹具,但其低频性能仍然不足.且ASTM ES7同轴线夹具模拟的情况更接近于无限大平面材料在自由空间的情况,更适合于材料的电磁脉冲屏蔽效能测试.文献[10]使用基于ASTM ES7标准的改进1.5 GHz同轴测试线夹具搭建了时域测试系统,并提出缩小同轴的尺寸来改善其高频性能的建议.本文使用粒子群优化(Particle Swarm Optimization,PSO)算法结合电磁场数值计算软件,设计制作了一种宽带同轴线夹具测试装置,利用矢量网络分析仪搭建了材料屏蔽效能频域测试系统,测量了同轴线夹具的回波损耗(Return Loss,RL)和两种金属织物材料的插入损耗(Insertion Loss,IL),比较了与使用1.5 GHz改进同轴线夹具的测试结果.1 同轴线夹具的优化设计图1为参考ASTM ES-7标准制作的宽带同轴线夹具测试装置示意图,内导体连续且贯通材料样本中心,构成低频回路,外导体由螺母连接.下面分别从同轴的尺寸、过渡段和支撑介质三个方面进行讨论.图1 宽带同轴线夹具的示意图1.1 同轴的内外导体尺寸为使同轴仅传输横电磁波(Transverse Electric and Magnetic,TEM)模,同轴必须工作在截止频率以下.而TE11模作为截止频率最低的模式,其大小与同轴内外导体的尺寸需满足(1)式中:fc为TE11模截止频率;c0为光速; R1为内导体的直径; R2为外导体的内直径.同轴的阻抗由式(2)确定(2)式中: Z0为同轴阻抗;η0为空气阻抗;εr为填充介质的相对介电常数.为保证同轴线夹具与测试系统其它组件的匹配,取Z0=50Ω.联立式(1)、(2),得到同轴的尺寸与截止频率的关系式为(3)(4)陈翔等[10]之前进行的材料电磁脉冲屏蔽效能试验中所使用的方波脉冲源,其上升沿大约在300 ps左右,包含有频率很高的成分.为保证同轴工作在TEM模式下,并为设计留有足够的余量,取同轴的截止频率为10 GHz,计算得到R1=5.78 mm,R2=13.3 mm.1.2 过渡段的设计同轴线夹具末端使用N型同轴连接器底座与线缆连接,文中选用L16-50KF连接器,其内导体芯的直径R11=3.04 mm,要保持50 Ω阻抗的连续,则R22=7 mm.同轴尺寸突变的地方会产生不连续阶梯电容,处理不好会导致传输TEM波的强烈反射,影响到同轴的性能.对过渡段的处理方式有渐变式和阶梯式[11],文中R1/R11=1.90,在内外径之比不大时选择阶梯式过渡,即可通过较短的过渡段满足所需的性能要求,如图1所示.使用CST电磁场仿真软件进行参数扫描,得A=1.64 mm时同轴线夹具的回波损耗最小.1.3 支撑介质的设计支撑介质通常选用介电常数较小的聚四氟乙烯(Polytetrafluoroethene,PTFE),取相对介电常数εr=2.1,厚度d=4 mm.图2为图1中支撑介质部分的局部放大图,支撑介质的引入会改变该处同轴的阻抗.图2 支撑介质示意图为保证同轴的阻抗为50 Ω,按式(5)重新计算同轴的内外径比例,将内外导体设计成图2所示的槽状结构[12].(5)在满足式(5)的条件下,可以得到不同的外导体槽深h2和内导体槽深h1组合,将式(5)重写为(6)得到h2与h1的关系式h2=3.30(R1/2-h1)-R2/2 .(7)设h1=0时的外导体槽深h2=h0,则当外导体槽深时,同轴的回波损耗最小,此时h1=0.66mm.为进一步降低不连续电容,减少在宽频带上的反射,常常在支撑介质与空气交界面上挖一个环形凹槽(图2),形成小电感来补偿不连续电容.环形凹槽的深度W和宽度L,将直接影响同轴的性能.此外,同轴中两个支撑介质间的距离2(l1-A-B-d)以及支撑介质与外导体直径变化处的距离(A+B)都会影响谐振频点,为削弱这种影响[11],取2(l1-A-B-d)≥2R2,A+B≥R2.其中,仅有参数B未定,经整理得B的取值范围:R2-A≤B≤l1-A-d-R2,取l1=10mm,l2=40mm.通过前面的分析,还有三个参数需要最终确定,其约束条件分别为B(11.7~21 mm)、L(0.1~3.6 mm)、W(0.1~0.5 mm).使用CST仿真软件对有支撑介质的同轴线夹具进行参数化建模,结合基本PSO算法对三个参数进行优化,使RL(0~10 GHz)的最大值不断变小,直到整个迭代过程完成.取粒子的数目为30,最大迭代次数为15,使用PSO算法寻优,当B=16.44 mm,L=3.42 mm,W=0.46 mm,LRmax=0.023时.图3为对支撑介质进行共面补偿并优化后同轴线夹具在0~10 GHz的回波损耗曲线,在4.2 GHz的时候LRmax=-32.7 dB,相比未经以上优化的同轴线夹具有了很大的改善.图3 优化前后同轴线夹具的回波损耗2 实测试验2.1 宽带同轴线夹具的频域性能测试选用黄铜作为材料,按照上节优化得到的尺寸制作宽带同轴线夹具.使用表1中的矢量网络分析仪(Vector Network Analyzer,VNA)1与其组成材料屏蔽效能频域测试系统,如图4所示.宽带同轴线夹具1的两端通过转接头与矢量网络分析仪的线缆接头相连.表1 试验设备试验设备型号性能参数同轴线夹具1自制截止频率<10GHz同轴线夹具2实验室购置截止频率<1.62GHzVNA1Agilent:N5230A带宽:10MHz~20GHzVNA2Agilent:E5081A带宽:300kHz~1.5GHz使用VNA1的线性扫频模式测试同轴线夹具1在10 MHz~10 GHz的回波损耗,如图5所示.另外,还使用了表1中的VNA2测量同轴线夹具1的回波损耗,结果表明在300 kHz~10 MHz的回波损耗LR小于-38 dB.综上,该宽带同轴线装置在6.4 GHz以下的LR小于-20 dB(驻波比小于1.2).图4 宽带屏蔽效能频域测试系统图5 宽带同轴线夹具的回波损耗对比图3和图5可发现仿真与实测试验结果有很大的不同.这是由于仿真设计中假设同轴两端为理想状态、阻抗均为50 Ω的源和负载,而实际测试系统中,还需要使用N型同轴连接头、线缆及其转接头等与VNA相连.还有一个重要原因是仿真中假设支撑介质为理想介电常数为2.1的PTFE,而实际使用中的PTFE的电磁参数则并不能很好地控制.此外,零件机械加工的公差以及内外导体制造和装配产生的不同轴等因素.这些都会影响同轴线夹具的性能,最终导致仿真和实测性能的出入.2.2 金属织物的屏蔽效能测试宽带同轴线夹具的夹持材料部分设计如图6所示,内导体一端留有长5 mm、直径3 mm的栓舌,另一端留有与之配合的孔洞,这样可以很好的保持内导体的连续性和径向的定位,外导体则由大螺母连接.试验时仅需准备内径3 mm、外径41 mm的圆环状试样即可,材料厚度不得超过5 mm.图6 同轴线夹具的夹持材料部分下面选用两种不同的金属织物屏蔽材料AM-01和AM-03材料进行测试,使用图4所示的材料屏蔽效能测试系统测得两种材料的插入损耗,结果如图7所示.两种材料的LI值在0~6 GHz相差大约5 dB,在整个频段上的趋势基本一致.图7 两种材料的插入损耗曲线文献[8]已经指出,材料的厚度、介电常数均会影响到插入损耗曲线的谐振频点,进而决定同轴线夹具的可用频率范围.由图7同样可看出,在6.4~10 GHz区间,由于谐振的存在,AM-01的插入损耗值甚至会大于AM-03.为了说明宽带同轴线夹具1相对于同轴线夹具2的改善,使用同轴线夹具2和VNA2组成的材料屏蔽效能测试系统同样对以上两种材料进行了测试,结果如图8所示.可见同轴线夹具1在0~6.4 GHz的范围内测得的材料插入损耗曲线比较平滑,而同轴线夹具2测得的曲线在频段内则有很大的波动.研制的宽带同轴线夹具1在将材料屏蔽效能的测试频段高频最低扩展到6.4 GHz的同时,还保证了低频可达直流(根据信号源而定).6.4~10 GHz的测试数据也可作为参考,能够在一定程度上反映材料在该频段的屏蔽性能.图8 两种同轴线夹具测得的材料插入损耗曲线使用同轴线夹具装置测得的是材料的插入损耗,而插入损耗作为对材料屏蔽效能的估计,是否精确的等价于材料的屏蔽效能,主要取决于材料的电厚度和同轴线的电长度[13-14].取宽带同轴线夹具的频率上限为6.4 GHz,则电薄材料(波长的1%)的厚度不应超过0.47 mm,文中的两种材料完全符合要求.笔者仅对金属织物屏蔽材料进行了测试,对于其它一些材料如导电玻璃、导电薄膜等的适用性还需要进一步研究.文中制作的同轴性能与仿真结果有较大差异,还需要反复改进和试验.如支撑介质可以尝试使用带气孔的支撑介质,以获得更小的介电常数;仿真时将同轴接头底座的引入也考虑到.此外,在满足材料测试动态范围的条件下还可以给同轴线夹具连接上50 Ω的衰减器来更好的匹配整个测试系统.3 结论使用粒子群优化算法结合电磁场数值分析软件对同轴线夹具装置的支撑介质进行了优化设计,使其在宽频带上(0~10 GHz)的回波损耗小于-32.7 dB,得到了宽带同轴线夹具装置的关键尺寸.实测试验表明该宽带同轴线夹具的回波损耗在6.4 GHz以下小于-20 dB,能够在0~6.4 GHz范围内准确评价材料的屏蔽效能,而且所需的材料试样更小,测试曲线更平滑,测试速度更快.参考文献[1] 周璧华,陈彬,高成.钢筋网及钢筋混凝土电磁脉冲屏蔽效能研究[J].电波科学学报,2000,15(3):251-259.ZHOU Bihua,CHEN Bin,GAO Cheng.Study on EMP shielding effectiveness of wire-mesh reinforcement and reinforced-concrete[J].Chinese Journal of Radio Science,2000,15(3):251-259.(in Chinese)[2] 石丹.平面波斜入射到有孔腔体的屏蔽效能分析[J].电波科学学报,2011,26(4):678-682.SHI Dan.Shielding effectiveness analysis of enclosure with aperture irradiated by oblique incident plane wave[J].Chinese Journal of Radio Science,2011,26(4):678-682.(in Chinese)[3] 王建宝,周璧华,杨波.屏蔽室接地位置不同对其屏蔽效能的影响研究[J].电波科学学报,2012,27(1):45-49+65.WANG Jianbao,ZHOU Bihua,YANG Bo.Influence of grounding locations on shielding effectiveness of shielded room[J].Chinese Journal of Radio Science,2012,27(1):45-49+65.(in Chinese)[4] 国防科学技术工业委员会.GJB6190-2008 电磁屏蔽材料屏蔽效能测量方法[S].北京:中国标准出版社,2008.[5] 刘顺坤,韩军,陈向跃.材料电磁脉冲屏蔽效能的时域测量方法[J].核电子学与探测技术,2009,29(6):1456-1460.LIU Shunkun,HAN Jun,CHEN Xiangyue.Method of measurement on material’s shielding effec tiveness test in time domain[J].Nuclear Electronics & Detection Technology,2009,29(6):1456-1460.(in Chinese) [6] 蒋全兴,周忠元,景莘慧,等.电磁防护材料性能的评价方法[J].安全与电磁兼容,2011(3):9-12.JIANG Quanxing,ZHOU Zhongyuan,JING Shenhui,et al.Evaluation methods for the performance of electromagnetic protectionmaterial[J].Safety & EMC,2011(3):9-12.(in Chinese)[7] WILSON P F,MA M T,J.ADAMS W.Techniques for measuring the electromagnetic shielding effectiveness of materials:PartⅠ:far-field source simulation[J].IEEE Transaction on Electromagnetic Compatibility,1988,30(3):239-250.[8] SARTO M S,TAMBURRANO A.Innovative test method for the shielding effectiveness measurement of conductive thin films in a wide frequency range[J].IEEE Transactions on Electromagnetic Compatibility,2006,5(48):331-341.[9] VASQUEZ H L,ESPINOZA K,LOZANO H,et a1.Simple device for electromagnetic interference shielding effectiveness measurement[J].EMC IEEE EMC Society Newsletter,2009:62-68.[10] 陈翔,陈永光,魏明,等.采用法兰同轴法的材料电磁脉冲屏蔽效能时域测试方法[J].高电压技术,2012,38(3):594-600.CHEN Xiang,CHEN Yongguang,WEI Ming,et al.Time domain testing methods of material’s shielding effectiveness of electromagnetic pulse using flange coaxial[J].High voltage Engineering,2012,38(3):594-600.(in Chinese)[11] 冯良平,徐岚.射频同轴连接器设计要点[J].国外电子测量技术,2005,24(11):39-44.FENG Liangping,XU Lan.Some design art for RF coaxialconnectors[J].Foreign Electronic Measurement Technology,2005,24(11):39-44.(in Chinese)[12] 陈超禅,桑昱,陆福敏,等.SE同轴测试装置中支撑介质的研究与设计[J].中国测试,2010,36(6):1-4.CHEN Chaochan,SANG Yu,LU Fumin,et al.Optimization of brace medium in SE coaxial tester[J].China Measurement & Test,2010,36(6):1-4.(in Chinese)[13] BDIC M,MARINESCU M J.The failure of coaxial TEM cells ASTM standards methods in H.F.range[C]// IEEE International Symposium on Electromagnetic Compatibility.Minneapolis,August 19-23,2002,1:29-34.[14] BDIC M,MARINESCU M J. On the complete theory of coaxial TEM cells[C]// IEEE International Symposium on Electromagnetic Compatibility.Washington DC,August 21-25,2000,2:897-902.。

  1. 1、下载文档前请自行甄别文档内容的完整性,平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益,请联系客服反馈,我们会尽快为您处理(人工客服工作时间:9:00-18:30)。

Performance Evaluationof a Radio Wave Propagation Parallel Simulator Michel Pahud,Fr´e d´e ric Guidec,Thierry CornuSwiss Federal Institute of Technology LausanneParallel Computing Research GroupTheoretical Computing LaboratoryCH-1015Lausanne,SwitzerlandE-mail:pahud,guidec,cornu@di.epfl.chAbstractThis paper presents a performance model for a paral-lel application with irregular data structures,that simu-lates wave propagation.The model is based on the mea-surement of basic communication and computation routines. The computational workload of each processor and the load imbalance are modeled parison between predicted and measured performance are shown for a Cray T3D computer.We indicate how the model can be used to analyze the scalability of the algorithm and tofind optimal trade-offs in the partitioning of its data.1IntroductionDuring the last decade,performance prediction has been repeatedly quoted as a key factor to developing parallel sys-tems[3,4,6].Predicting the performance of a program as a function of the number of processors and of the problem size is important,for choosing the best hardware size and and tuning various parameters.Numerous prediction tools have been recently proposed in the literature[2,7,8,9,13,14]. Most of them focus mainly on regular applications using static data structures.Some approaches exclusively con-sider loop nests[4].In contrast,this paper shows an example of performance analysis of an irregular application.The application is a wave propagation simulation algorithm called ParFlow++. The performance analysis method is closely related to the Bulk Synchronous Programming(BSP)model[12,15].The wave propagation program is described in section2.The performance prediction is based on the measurements of communication times on the parallel machine used(a Cray T3D),and on the execution times of sections of the code on one processor.Section3describes the performance model,section4compares the estimated performance with actual measurements,and section5concludes the paper.2Wave propagation with ParFlow++2.1ParFlow methodThe ParFlow method was designed at the University of Geneva by Chopard,Luthi and Wagen[10].It is based on the so-called Lattice Boltzman Model,describes a physi-cal system in terms of motion offictitious microscopic par-ticles over a lattice[1].In Parflow,a radio-electric wave is simulated by the propagation of aflow inside of a two-dimensional discrete grid,according to afinite difference equation model.Obstacles(typically,city buildings)are modeled by two kinds of grid points:wall points,and indoor points(seefig-ure1).In the current ParFlow model,it is assumed that waves do not penetrate buildings:wall points are perfectly reflecting points that return any incident wave with oppo-site sign[11].Indoor points may therefore be ignored in the computation.2.2ParFlow++implementationSince the ParFlow method does not simulate wave prop-agation through buildings,it can be most interesting to avoid any computation for indoor points.Indeed,experi-ence shows that when modeling an urban area,buildings can represent up to30%of the surface considered.Not modeling indoor points avoids wasting memory space and saves computational power.An other improvement is also possible:because of the discretization of time and space in the simulation process,a wave radiated by the source point propagates step by step throughout the simulation zone;noOutdoor pointsFigure1.The ParFlow method operates on acity district described as a bitmap that dis-tinguishes between indoor points,outdoorpoints,and wall points.activePoints=source point;foreach iteration step dotmpActive=activePoints;foreach point in tmpActive docompute outgoingflows based on incomingflows;update incomingflows based on neighbors’outgoingflows;activePoints=activePointsnewly activated neighbors;endforendforFigure 2.Single-processor version of theParFlow++algorithm.computation should be performed for points not yet reached by the wave.ParFlow++[5]is a C++implementation of the ParFlow method that implements these optimizations.ParFlow++ maintains a list of references to active points.Active points are grid points already reached by the wave and not located inside buildings.At each step of the simulationflow,values need only be calculated for active points,and the propagation of outgoing flows is only required from active points to their neighbors.A single-processor version of the algorithm is reproduced in figure2.Due to the presence of buildings at random locations in the grid,the ParFlow++program maintains irregular data structures.The amount of computation required during a simulation step also varies in an irregular way.2.3Multi-processor implementationLike other grid-based computations,the ParFlow method is a good candidate for parallel implementation.A parallel version of the ParFlow++code was developed for MIMD machines with a distributed memory.It relies on the PVM communication library.Thesimulation zone is split intoP0P1P2P3P0P1P2P3Figure 3.Simulation zone partitioning andmapping.activePoints=source point;distribution of partitions onto the processors;forall processors do in parallelforeach iteration step dolocalTmpActive=localActivePoints;foreach point in localTmpActive docompute outgoingflows based on incomingflows;update incomingflows based on neighbors’outgoing flows;localActivePoints=localActivePointsnewly activated neighbors;end foreachcommunication of partition borders;localActivePoints=localActivePointsnewly activated border points;end foreachend forallFigure 4.Multi-processor version of theParFlow++algorithm.horizontal strip called partitions,which are then allocated to processors based on a round-robin policy,as shown infig-ure3.A local list of active points is maintained for each parti-tion.Due to the partitioning policy,adjacent partitions are always allocated to different processors.Thus,communica-tions take place at the borders between adjacent partitions, were waveflows and activation status are propagated.The multi-processor implementation of ParFlow++is de-picted infigure4.During the initial stage of the wave propagation,only the processors whose partitions are close to the wave source host active points.This results in a load imbalance.Balanc-ing of the workload is achieved by increasing the number of partitions allocated per processor,as shown infigure5. On the other hand,multiplying the number of partitions in-creases the communication costs.Therefore,a trade-off has to be found in the number of partitions per processor.Pre-dicting the optimal number of partitions is one of the goalsPE 0PE 1PE 2PE 3(a)PE 0PE 1PE 2PE 3PE 0PE 1PE 2PE 3(b)Figure5.Simulation of wave propagation onfour processors:(a)one partition per proces-sor,(b)two partitions per processor.of the performance model developed in the next section.3Performance modelOur performance model focuses on the outer foreach loop of the algorithm offigure4.The initialization phase of the algorithm,that is,the distribution of initial data onto the processors,is not considered in this paper.In fact,modeling the initialization phase is also not relevant for determining the optimal number of partitions.3.1MethodologyThe computation workload of a processor is assumed to be proportional to the number of active points handled by this processor.This number is not necessarily identical for each processor and increases at each iteration step.A model of the number of active points per processor,and of its evo-lution,is detailed in section3.2.Since the communication operation at the end of the foreach loop implements an implicit synchronization bar-rier,the computation time of one iteration is assumed to be the one needed by the most heavily loaded processor.The cost of the communication itself is assumed to be proportional to the number of partition borders handled by one processor.This cost is constant over the iterations since, in our implementation,the volume of data transferred does not depend on the number of active points but only on the number of points per partition border.To model the behavior of ParFlow++on a new parallel architecture,only two measurements will be required:the execution time of one iteration of the innermost loop,and the communication time per partition border.The execu-tion time of the innermost loop is measured by timing one iteration of a single-processor ParFlow++algorithm,when all grid-points are active(an area without buildings is con-sidered).The communication time is obtained by timing the point-to-point communication time of a message of the same size as a partition border.Contention is neglected in a first approximation.The measured communication time in-cludes the cumulated time taken by the PVM communica-tion routine,by the procedures responsible for packing and unpacking the data contained in a border,andfinally by the call to the encapsulating C++methods.3.2Cost of local computationTo model local computation,we evaluate the number of active points handled by a processor at a given time,as a function of the number of processors,of the number of par-titions per processor,and of the position of the considered processor’s partitions with respect to the source of the wave. Wefirst derive the number of active points for an area with-out buildings.When the wave source is located in the mid-dle of the simulation area,deriving the number of points reached by the wave is straightforward.The following no-tations will be used in this paper:-the current iteration step;-the iteration step at which the considered partition is entered by the wave;assuming no buildings,depends only on the distance of the wave source to the nearest edge of the partition;-the partition length in grid points;-the height of the partition in grid points;-the number of active points in the partition at it-eration step;this quantity is proportional to the com-putational workload induced by the partition.In the case of,the propagation of the wave inside a partition can be subdivided into three stages(figure6):1.thefirst stage starts when the wave enters the partitionthrough one of its borders,and ends when the opposite border is reached;2.the second stage ends when the wave reaches the leftand right edges of the partition;3.the last stage ends when all points of the partition havebeen reached.Depending on the maximal number of iterations,stages2 and3may be completed only partially,or not at all.Once all partition points have been activated,computation may still proceed further.However,the number of active points of the partition has reached a maximum and becomes a constant value.The number of grid points reached by the wave at the different stages can be computed:h1)hh2)3)Figure 6.Three successive stages of the propagation of the wave insidea partition.d +d +L /d +h +L /Figure 7.Number of grid points reached by the wave as a function of the iteration.This yields the curve of figure 7.When buildings are present,the number of active points is derived from the previous model,by subtracting all in-door points,since they are not processed in the ParFlow++implementation.To avoid considering the actual location of buildings in the grid,we assume that they are uniformly dis-tributed.Therefore,the number of active points is simply multiplied by a constant corrective factor,corresponding to the ratio of outdoor surface to the total surface.In the case of,or for a wave source not cen-tered,the number of stages to distinguish in the propagation changes.In these cases,it is straightforward to generalize the above analysis,although the complexity of the calcula-Figure 8.Time spent by the different pro-cessors in the main ParFlow++loop (mea-sured and predicted)as a function of the it-eration step.Data for a 10001000simu-lation zone without buildings,simulated on 16processors with 1partition each.Dashed curves correspond to actual measurements and plain curves to the model.tion will increase.4ResultsWe validated the ParFlow++performance model on the Cray T3D multi-processor architecture.Let us first exam-ine the local computational workload as described in sec-tion 3.2.Figure 8compares the measured and the theoretical computation times for a 16-processors system working on asimulation zone without buildings ,with onepartition per munication times are not con-sidered here;each curve shows the computation time spent by one of the processors in the body of the outermost fore-ach loop of figure 4,as a function of the iteration step .In this case,the model fits well to the data.The hypothesis that the computation time is proportional to the number of active points is verified.Figure 9shows similar results,but with buildings present (namely,a district of the city of Geneva).Since no compu-tation is performed in the indoor areas,the average execu-tion time at the end of the propagation (iteration step 1000)is lower than for the empty area.Discrepancies between the measurements and the model show the impact of the non uniform distribution of buildings.Although,the load of individual processors is predicted only imperfectly (due to the irregularity of data),this predic-tion can still be used very efficiently in the model of the totalFigure9.Time spent by the different pro-cessors in the main ParFlow++loop(mea-sured and predicted)as a function of the it-eration step.Data for a10001000sim-ulation zone with buildings,representing a2km2km district of Geneva,simulated on16processors with1partition each.Dashedcurves correspond to actual measurementsand plain curves to the model.execution time.This is shown onfigures10and11.Fig-ure10shows the predicted and measured execution times for the district of the Geneva city,as a function of the num-ber of partitions per processor.The communication time is taken into account.Both the predictions and the mea-surements clearly show the trade-off between a good load-balancing and reduced communication costs.The optimal partitioning for this problem size is actually four partitions per processor,while the prediction indicates three partitions. The performance difference between the predicted and mea-sured option is quite small.The discrepanciesbetween the two curves are mainly due to the irregularity of the distribu-tion of buildings.Without a priori information on building locations,three partitions per processors would actually be the best bet.Figure11compares the evolution of the measured and predicted speedups for the same area,as a function of the number of processors used.In this case,only one partition per processor is used.The quality of the prediction is very satisfactory;prediction error varies between0and6%.5ConclusionWe have presented a performance model of a parallel ap-plication using an irregular data structure.On the massively parallel Cray T3D,we were able to provide a valid predic-Figure10.Total execution time of ParFlow++ on a2km2km district of the Geneva city (10001000points),as a function of the num-ber of partitions per processor.51015202530354005101520253035MeasurePredictiontion.The model presented can be used for scalability anal-yses,such as speedup prediction,or to seek optimal trade-offs in issues such as data partitioning.Prediction relies on only a few basic measurements:the timing of point-to-point communications and of elementary local computations.Future work will include the modeling of other parallel irregular algorithm with a similar methodology.Parallel op-timization algorithms like branch&bound,tabou search and evolutionary algorithms,are good candidates for such inves-tigations.Modeling on other multi-processor architectures (other distributed memory machines like the Intel Paragon, shared memory architectures like the SGI Origin2000,and networks of workstations)will also be investigated,to check the generality of the modeling method.The approach we adopted will be applied to other appli-cations and systematized into a general performance model. The BSP model[12]will give a very good framework for this purpose.BSP has been shown to be very well adapted to the performance modeling of a lot of parallel regular algo-rithms,and we expect it to alsofit to a wide range of irregular algorithms.AcknowledgmentsThis research was supported partly by the Swiss National Science Foundation under grant#2100-042391.94/1.The ParFlow++application was developed in the framework of the European ACTS project STORMS.The Cray T3D ex-perimentations were conducted on the machine of the Swiss Federal Institute of Technology in Lausanne.The following people deserve acknowledgments for helpful discussions and proofreading the manuscript: G.Coray,C.Diderich,P.Kuonen.References[1]R.Benzi,S.Succi,and M.Vergassola.The Lattice Boltz-mann Equation:Theory and Applications.Physics Reports, 222(3):145–197,1992.[2]R.J.Block,S.Sarukkai,and P.Mehra.Automated perfor-mance prediction of message-passing parallel programs.In Proceedings of Supercomputing’95,San Diego,Dec.1995.ACM/IEEE.[3]N.J.Davies.The Performance and Scalability of ParallelSystems.PhD thesis,Department of Computer Science,Fac-ulty of Engineering,University of Bristol,UK,Dec.1994.[4]T.Fahringer.Automatic Performance Prediction for Paral-lel Programs on Massively Parallel Computers.PhD thesis, Technical University Vienna,Austria,1993.[5] F.Guidec,P.Kuonen,and P.Cal´e gari.ParFlow++:AC++parallel application for wave propagation simulation.SPEEDUP Journal,10(1/2):68–73,Dec.1996.[6] A.Gupta and V.Kumar.Analyzing scalability of parallelalgorithms and architectures.Journal of Parallel and Dis-tributed Computing,22(3):379–391,Sept.1994.[7]K.Harzallah and K.C.Sevcik.Predicting application be-havior in large scale shared-memory multiprocessors.In Proceedings of Supercomputing’95,San Diego,Dec.1995.ACM/IEEE.[8]J.M.D.Hill,I.Crumpton,Paul,and A.Burgess,David.Theory,practice,and a tool for BSP performance prediction.In Proceedings of the Euro-Par’96Conference,volume II, number1124in Lecture Notes in Computer Science,pages 697–713,Lyon,Aug.1996.Springer Verlag.[9]W.Kuhn.Performance prediction and benchmarking resultsfrom the ALPSTONE project.In Proceedings of the Inter-national Conference and Exhibition on High-Performance Computing and Networking(HPCN Europe’96),number 1067in Lecture Notes in Computer Science,pages763–769, Brussels,Belgium,Apr.1996.Springer Verlag.[10]P.O.Luthi and B.Chopard.Wave Propagation with Trans-mission Line Matrix.Technical report,University of Geneva and Swiss Telecom PTT,1994.[11]P.O.Luthi,B.Chopard,and J.-F.Wagen.Wave Propagationin Urban Micro-cells:a Massively Parallel Approach using the TLM Method.In Proceeding of P ARA’95,Workshop on Applied Parallel Scientific Computing,Copenhagen,aug 1995.Also in COST231TD(95)33.[12]W.F.McColl.Universal computing.In Proceedings of theEuro-Par’96Conference,volume I,number1123in Lecture Notes in Computer Science,pages25–36,Lyon,Aug.1996.Springer Verlag.[13]R.Sarukkai,Sekhar,P.Mehra,and R.J.Block.Auto-mated sclability analysis of message-passing parallel pro-grams.IEEE Parallel and Distributed Technology,Winter 1995.[14]J.Simon and J.-M.Wierum.Accurate performance pre-diction for massively parallel systems and its applications.In Proceedings of the Euro-Par’96Conference,volume II, number1124in Lecture Notes in Computer Science,pages 675–688,Lyon,Aug.1996.Springer Verlag.[15]L.G.Valiant.Bulk-synchronous parallel computers.InM.Reeve and S.E.Zenith,editors,Parallel Processing and Artificial Intelligence,Chichester,UK,1989.Wiley.。

相关文档
最新文档