SN75183NSR中文资料
ANALOG DEVICES ADV7513 英文产品数据手册
165 MHz, High PerformanceHDMI Transmitter Data Sheet ADV7513Rev. 0Information furnished by Analog Devices is believed to be accurate and reliable. However, noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners. O ne Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 Fax: 781.461.3113 ©2011 Analog Devices, Inc. All rights reserved.FEATURESGeneralIncorporates HDMI v1.4 features, including3D video support165 MHz supports all video formats up to 1080pand UXGASupports gamut metadata packet transmission Integrated CEC buffer/controllerCompatible with DVI v1.0 and HDCP v1.4Video/audio inputs accept logic levels from 1.8 V to 3.3 V Digital video3D video readyProgrammable, 2-way color space converterSupports RGB, YCbCr, and DDRSupports ITU-656-based embedded syncsAutomatic input video format timing detection (CEA-861-E) Digital audioSupports standard S/PDIF for stereo linear pulse codemodulation (LPCM) or compressed audio up to 192 kHz High bit rate (HBR) audio8-channel uncompressed LPCM I2S audio up to 192 kHz Special features for easy system design5 V tolerant I2C and Hot Plug™ detect (HPD) I/Os,no extra device neededNo audio master clock needed for supporting S/PDIFand I2SOn-chip MPU with I2C master performs HDCP operationsand EDID reading operationsOn-chip MPU reports HDMI events through interruptsand registersAPPLICATIONSGaming consolesPCsDVD players and recordersDigital set-top boxesA/V receiversFUNCTIONAL BLOCK DIAGRAM1225-1Figure 1.GENERAL DESCRIPTIONThe ADV7513 is a 165 MHz, High-Definition Multimedia Interface (HDMI®) transmitter that is ideal for DVD players/ recorders, digital set-top boxes, A/V receivers, gaming consoles, and PCs.The digital video interface contains an HDMI v1.4/DVI v1.0-compatible transmitter and supports all HDTV formats. The ADV7513 supports HDMI v1.4-specific features, including 3D video. The ADV7513 also supports x.v.Color™, high bit rate (HBR) audio, and the programmable auxiliary video information (AVI) InfoFrame features. With the inclusion of HDCP, the ADV7513 allows the secure transmission of protected content as specified by the HDCP v1.4 protocol.The ADV7513 supports both S/PDIF and 8-channel I2S audio. Its high fidelity 8-channel I2S interface can transmit either stereo or 7.1 surround audio up to 768 kHz. The S/PDIF interface can carry compressed audio, including Dolby® Digital, DTS®, and THX®. Fabricated in an advanced CMOS process, the ADV7513 is provided in a 64-lead LQFP surface-mount plastic package with exposed pad and is specified over the −25°C to +85°C temperature range.ADV7513Data SheetRev. 0 | Page 2 of 12TABLE OF CONTENTSFeatures .............................................................................................. 1 Applications ....................................................................................... 1 Functional Block Diagram .............................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Electrical Specifications (3)Absolute Maximum Ratings ............................................................5 Explanation of Test Levels ............................................................5 ESD Caution...................................................................................5 Pin Configuration and Function Descriptions ..............................6 Applications Information .................................................................8 Design Resources ..........................................................................8 Outline Dimensions ..........................................................................9 Ordering Guide .. (9)REVISION HISTORY11/11—Revision 0: Initial VersionData SheetADV7513Rev. 0 | Page 3 of 12SPECIFICATIONSELECTRICAL SPECIFICATIONSTable 1.Parameter Symbol Temp Test Level 1 Min Typ Max Unit DIGITAL INPUTS Data Inputs, Video and Audio, CEC_CLK Input Voltage, High V IH Full VI 1.35 3.5 V Input Voltage, Low V IL Full VI −0.3 +0.7 V Input Capacitance 25°C VIII 1.0 1.5 pFCEC_CLK Frequency 2Full VIII 3 12 100 MHz CEC_CL KAccuracy Full VIII −2 +2 % DDC I 2C Lines (DDCSDA, DDCSCL) Input Voltage, High V IH Full IV 1.4 5.5 V Input Voltage, Low V IL Full IV −0.3 +0.7 V I 2C Lines (SDA, SCL) Input Voltage, High V IH Full VI 1.4 5.5 V Input Voltage, Low V IL Full VI −0.3 +0.7 V CEC Pin Input Voltage, High V IH Full VI 2.0 5.5 V Input Voltage, Low V IL Full VI −0.3 +0.8 V Output Voltage, High V OH Full VI 2.5 3.63 V Output Voltage, Low V OL Full VI −0.3 +0.6 V HPD Pin Input Voltage, High V IH Full VI 1.3 5.5 V Input Voltage, Low V IL Full VI −0.3 +0.8 V THERMAL CHARACTERISTICS Thermal Resistance Junction-to-Case θJC Full V 20 °C/W Junction-to-Ambient θJA Full V 43 °C/W Ambient Temperature Full V −25 +25 +85 °C DC SPECIFICATIONS Input Leakage Current I IL 25°C VI −1 +1 μA POWER SUPPLY1.8 V Supply Voltage (DVDD, AVDD,PVDD, BGVDD)Full IV 1.71 1.8 1.90 V 3.3 V Supply Voltage (DVDD_3V) Full IV 3.15 3.3 3.45 V Power-Down Current 25°C IV 300 μATransmitter Total Power 3At 1.8 V Full VI 256 mW At 3.3 V Full VI 1 mW AC SPECIFICATIONS TMDS Output Clock Frequency 25°C IV 20 165 MHz TMDS Output Clock Duty Cycle 25°C IV 48 52 % Input Video Clock Frequency Full IV 165 MHzInput Video Data Setup Time 4t VSU Full IV 1.8 ns Input Video Data Hold Time 4 t VHLD Full IV 1.3 ns TMDS Differential Swing 25°C VII 800 1100 1200 mV Differential Output Timing Low-to-High Transition Time 25°C VII 75 95 ps High-to-Low Transition Time 25°C VII 75 95 ps VSYNC and HSYNC Delay From DE Falling Edge 25°C IV 1 UI 5 To DE Rising Edge 25°C IV 1 UI 5ADV7513Data SheetRev. 0 | Page 4 of 12Parameter Symbol Temp Test Level 1 Min Typ Max Unit AUDIO AC TIMING SCLK Duty Cycle N/2 Is an Even Number Full IV 40 50 60 % N/2 Is an Odd Number Full IV 49 50 51 % I2S[3:0], S/PDIF Setup Time t ASU Full IV 2 ns I2S[3:0], S/PDIF Hold Time t AHLD Full IV 2 ns LRCLK Setup Time t ASU Full IV 2 ns LRCLK Hold Time t AHLD Full IV 2 ns I 2C INTERFACE SCL Clock Frequency Full 400 kHz SDA Setup Time t DSU Full 100 ns SDA Hold Time t DHO Full 100 ns Setup Time for Start Condition t STASU Full 0.6 μs Hold Time for Start Condition t STAH Full 0.6 μs Setup Time for Stop Condition t STOSU Full 0.6 μs1 See the Explanation of Test Levels section.212 MHz crystal oscillator for default register settings. 31080p, 24-bit typical random pattern. 4The video data setup and hold times are measured at 0.9 V. The relationship between the clock and data is programmable in 400 ps steps. 5UI is the unit interval.Data SheetADV7513Rev. 0 | Page 5 of 12ABSOLUTE MAXIMUM RATINGSTable 2.Parameter RatingDigital Inputs (SDA, SCL, DDCSDA, DDCSCL,HPD, PD)−0.3 V to +5.5 V Audio/Video Digital Inputs (D[23:0], MCLK,CLK, LRCLK, CEC, CEC_CLK, SPDIF, I2S[3:0],SCLK, HSYNC, DE, VSYNC)−0.3 V to +3.63 V Digital Output Current 20 mAOperating Temperature Range −40°C to +100°CStorage Temperature Range −65°C to +150°C Maximum Junction Temperature 150°C Maximum Case Temperature 150°CStresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those indicated in the operationalsection of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. EXPLANATION OF TEST LEVELSI. 100% production tested. II. 100% production tested at 25°C and sample tested at specified temperatures. III. Sample tested only. IV . Parameter is guaranteed by design and characterizationtesting.V . Parameter is a typical value only. VI.100% production tested at 25°C; guaranteed by design and characterization testing.VII.Limits defined by HDMI specification; guaranteed by design and characterization testing.VIII. Parameter is guaranteed by design.ESD CAUTIONADV7513Data SheetRev. 0 | Page 6 of 12DVDD D12T X C –H S Y N CPIN CONFIGURATION AND FUNCTION DESCRIPTIONSD ED 0D 1D 2D 3D 4D 5D 6D 7D 8C L KD 9D V D DD 10D 11VSYNC SPDIF MCLK I2S0I2S1I2S2I2S3SCLKLRCLK PVDD DVDD BGVDD R_EXT AVDD HPD D13D14D15D16D17D18D19D20D21D22D23SDA SCL DDCSDA DDCSCLT X C +A V D DT X 0–T X 0+P DT X 1–T X 1+A V D DT X 2–T X 2+I N TD V D D _3VC E CD V D DC E C _C L KNOTES1. THE EXPOSED PAD IS THE ELECTRICAL GROUND FOR THE PART AND MUST BE SOLDERED TO THE PCB.10225-002Figure 2. Pin ConfigurationTable 3. Pin Function DescriptionsPin No. Mnemonic Type Description 1, 11, 31, 51 DVDD Power 1.8 V Power Supply. These pins should be filtered and as quiet as possible. 2 VSYNC Input Vertical Synchronization Input. 3 SPDIF Input S/PDIF (Sony/Philips Digital Interface) Audio Input. 4 MCLK Input Audio Reference Clock Input. 5 I2S0 Input I 2S Channel 0 Audio Data Input. 6 I2S1 Input I 2S Channel 1 Audio Data Input. 7 I2S2 Input I 2S Channel 2 Audio Data Input. 8 I2S3 Input I 2S Channel 3 Audio Data Input. 9 SCL KInput I 2S Audio Clock Input. 10 LRCLK Input Left/Right Channel Signal Input. 12 PVDD Power 1.8 V PLL Power Supply. 13 BGVDD Power 1.8 V Band Gap Power Supply. 14 R_EXT Input This pin sets the internal reference currents. 15, 19, 25 AVDD Power 1.8 V Power Supply for TMDS Outputs. 16 HPD Input Hot Plug Detect Signal Input. 17, 18 TXC−, TXC+ DifferentialoutputDifferential TMDS Clock Output. 20, 21 TX0−, TX0+ DifferentialoutputDifferential TMDS Output Channel 0. 22 PD Input Power-Down Control and I 2C Address Selection. 23, 24 TX1−, TX1+ DifferentialoutputDifferential TMDS Output Channel 1. 26, 27 TX2−, TX2+ DifferentialoutputDifferential TMDS Output Channel 2.Data SheetADV7513Rev. 0 | Page 7 of 12Pin No. Mnemonic Type Description 28 INT Output Interrupt Signal Output. 29 DVDD_3V Power 3.3 V Power Supply. 30 CEC Input/output CEC Data Signal. 32 CEC_CLK Input CEC Clock (Oscillator from 3 MHz to 100 MHz). 33 DDCSCL Control Serial Port Data Clock to Sink. 34 DDCSDA Control Serial Port Data Input/Output to Sink. 35 SCL Control Serial Port Data Clock Input. 36 SDA Control Serial Port Data Input/Output.37 to 50, 52, 54 to 62 D[23:0]Input Video Data Inputs. 53 CLK Input Video Input Clock. 63 DE Input Data Enable Signal for Digital Video. 64 HSYNC Input Horizontal Synchronization Input. EPAD Power The exposed pad is the electrical ground for the part and must be soldered to the PCB.ADV7513Data SheetRev. 0 | Page 8 of 12APPLICATIONS INFORMATIONDESIGN RESOURCESEvaluation kits, reference design schematics, hardware and soft-ware guides, and other support documentation are available under a nondisclosure agreement (NDA). For more information, contact ATV_VideoTx_Apps@ . Other references include the following: •EIA/CEA-861-E —this technical specification document describes audio and video InfoFrames, as well as the E-EDID structure for HDMI. It is available from the Consumer Electronics Association (CEA).•High-Definition Multimedia Interface SpecificationVersion 1.4, a defining document for HDMI v1.4, and the HDMI Compliance Test Specification (CTS) Version 1.3a are available from HDMI Licensing, LLC.•High-Bandwidth Digital Content Protection SystemRevision 1.4, the defining technical specification document for HDCP Revision 1.4, is available from Digital Content Protection, LLC.Data SheetADV7513Rev. 0 | Page 9 of 12OUTLINE DIMENSIONSCOMPLIANT TO JEDEC STANDARDS MS-026-BCD-HD03-16-2010-AVIEW AROTATED 90°CCWFOR PROPER CONNECTION OF THE EXPOSED PAD,REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONSSECTION OF THIS DATA SHEET.Figure 3. 64-Lead Low Profile Quad Flat Package [LQFP_EP](SW-64-2)Dimensions shown in millimetersORDERING GUIDEModel 1Temperature Range Package DescriptionPackage Option ADV7513BSWZ −25°C to +85°C 64-Lead Low Profile Quad Flat Package, Exposed Pad [LQFP_EP] SW-64-2 EVAL-ADV7513-AKZEvaluation kit with HDCP keys1Z = RoHS Compliant Part.ADV7513 Data Sheet NOTESRev. 0 | Page 10 of 12Data Sheet ADV7513 NOTESRev. 0 | Page 11 of 12ADV7513Data SheetRev. 0 | Page 12 of 12 NOTESI 2C refers to a communications protocol originally developed by Philips Semiconductors (now NXP Semiconductors).HDMI, the HDMI Logo, and High-Definition Multimedia Interface are trademarks or registered trademarks of HDMI Licensing LLC in the United States and other countries.©2011 Analog Devices, Inc. All rights reserved. Trademarks andregistered trademarks are the property of their respective owners.D10225-0-11/11(0)。
SN75ALS181中文资料
IMPORTANT NOTICETexas Instruments (TI) reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of relevant information to verify, before placing orders, that the information being relied on is current.TI warrants performance of its semiconductor products and related software to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily performed, except those mandated by government requirements.Certain applications using semiconductor products may involve potential risks of death, personal injury, or severe property or environmental damage (“Critical Applications”).TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED, OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS, DEVICES OR SYSTEMS OR OTHER CRITICAL APPLICATIONS.Inclusion of TI products in such applications is understood to be fully at the risk of the customer. Use of TI products in such applications requires the written approval of an appropriate TI officer. Questions concerning potential risk applications should be directed to TI through a local SC sales office.In order to minimize risks associated with the customer’s applications, adequate design and operating safeguards should be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. Nor does TI warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other intellectual property right of TI covering or relating to any combination, machine, or process in which such semiconductor products or services might be or are used.Copyright © 1996, Texas Instruments Incorporated。
半导体中频变压器参数表
半导体中频变压器参数表
【实用版】
目录
一、半导体中频变压器的概念与作用
二、半导体中频变压器的分类与型号
三、半导体中频变压器的参数及其含义
四、如何选择半导体中频变压器
五、使用半导体中频变压器的注意事项
正文
一、半导体中频变压器的概念与作用
半导体中频变压器是一种用于半导体收音机、电视机等电子设备中的电子元器件，主要作用是在信号处理过程中对中频信号进行变换和放大。
通过变换和放大中频信号，可以提高电子设备的接收性能和信号质量。
二、半导体中频变压器的分类与型号
半导体中频变压器有很多分类和型号，常见的分类有调频、调幅收音机用的中频变压器，彩色电视机用的中频变压器等。
其中，调频收音机的中频变压器有 TP-11、TP-12、TP-13、TP-06、WTP-07、TP-08、TP-09 等型号；调幅收音机的中频变压器有 TTF-1、TTF-2、BZX-19、BZX-20、SZP1、SZP2 等型号；彩色电视机用的中频变压器有 1OKR3744、1OKRC3706、
1OKRC3707、1SlOTCO1 等型号。
三、半导体中频变压器的参数及其含义
半导体中频变压器的参数主要包括工作频率、额定功率、电压等。
这些参数决定了中频变压器的使用范围和性能。
例如，工作频率决定了中频变压器适用的信号范围；额定功率决定了中频变压器能承受的最大功率；电压则决定了中频变压器的输入和输出电压范围。
四、如何选择半导体中频变压器
选择半导体中频变压器时，首先要根据设备的需要确定所需的型号和参数；其次要考虑中频变压器的性能，如工作稳定性、抗干扰能力等；最后还要考虑中频变压器的价格和可靠性。
半导体中频变压器参数表
半导体中频变压器参数表摘要：一、半导体中频变压器参数表的概述1.半导体中频变压器的定义和作用2.半导体中频变压器参数表的重要性二、半导体中频变压器参数表的具体内容1.变压器的基本参数a.输入电压b.输出电压c.额定功率d.频率e.电压调整率f.电流调整率g.效率h.绝缘电阻i.耐压强度2.变压器的结构参数a.外形尺寸b.重量c.接线方式d.冷却方式e.防护等级三、半导体中频变压器参数表的应用领域1.通信行业2.家电行业3.工业自动化领域4.医疗设备5.其他电子设备四、半导体中频变压器参数表的注意事项1.选择合适的参数2.考虑产品的可靠性3.考虑产品的安全性4.考虑产品的兼容性正文：半导体中频变压器参数表是半导体中频变压器的重要技术文档，它详细列出了变压器的各项性能指标和技术参数，为用户选择和使用半导体中频变压器提供了重要依据。
一、半导体中频变压器参数表的概述半导体中频变压器是一种将电能从一个电路传输到另一个电路的设备，它在电子设备中有着广泛的应用。
半导体中频变压器参数表则是详细列出变压器的各项性能指标和技术参数的表格，它对于理解变压器的性能和选择合适的变压器有着重要的参考价值。
二、半导体中频变压器参数表的具体内容半导体中频变压器参数表主要包括变压器的基本参数和结构参数。
其中，基本参数包括输入电压、输出电压、额定功率、频率、电压调整率、电流调整率、效率、绝缘电阻和耐压强度等；结构参数包括外形尺寸、重量、接线方式、冷却方式、防护等级等。
三、半导体中频变压器参数表的应用领域半导体中频变压器参数表广泛应用于通信行业、家电行业、工业自动化领域、医疗设备和其他电子设备等领域。
在这些领域中，用户可以根据参数表选择合适的变压器，以满足设备的性能要求。
四、半导体中频变压器参数表的注意事项在使用半导体中频变压器参数表时，用户需要注意选择合适的参数，以保证变压器的性能和可靠性。
SN75175DR中文资料
PACKAGING INFORMATIONOrderable DeviceStatus (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN65175D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN65175DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175D ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DE4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DG4ACTIVE SOIC D 1640Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DR ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DRE4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175DRG4ACTIVE SOIC D 162500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175J OBSOLETE CDIP J 16TBD Call TI Call TISN75175N ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN75175NE4ACTIVE PDIP N 1625Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN75175NSR ACTIVE SO NS 162000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN75175NSRE4ACTIVESONS162000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)PACKAGE OPTION ADDENDUM15-Nov-2006Addendum-Page 1(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.PACKAGE OPTION ADDENDUM 15-Nov-2006Addendum-Page 2IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
SN75175中文资料
p
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Input Voltage – High Logic State (Three–State Control) Input Voltage – Low Logic State (Three–State Control) Input Current – High Logic State (Three–State Control) (VIH = 2.7 V) (VIH = 5.5 V) Input Current – Low Logic State (Three–State Control) (VIL = 0.4 V) Input Clamp Diode Voltage (Three–State Control) (IIK = –18 mA) Output Third State Leakage Current (VI(D) = 3.0 V, VIL = 0.8 V, VO = 0.4 V) (VI(D) = –3.0 V, VIL = 0.8 V, VO = 2.4 V) Output Short–Circuit Current (Note 5) (VI(D) = 3.0 V, VIH = 2.0 V, VO = 0 V) Power Supply Current (VIL = 0 V) (All Inputs Grounded)
QUAD EIA–485 LINE RECEIVER WITH THREE–STATE OUTPUTS
SEMICONDUCTOR TECHNICAL DATA
• • • • • • • • • •
Meets CCITT Recommendations V.10, V.11, X.26, and X.27 Designed for Multipoint Transmission on Long Bus Lines in Noisy Environments 3–State Outputs Common–Mode Input Voltage Range . . . –12 V to 12 V Input Sensitivity . . . ±200 mV Input Hysteresis . . . 50 mV Typ High Input Impedance . . . 1 EIA–485 Unit Load Operates from Single 5.0 V Supply Lower Power Requirements Plug–In Replacement for MC3486
维沙亚高速塑料接收器数据手册说明书
Soft Recovery Ultrafast Plastic RectifierFEATURES•Glass passivated pellet chip junction •Ultrafast reverse recovery time •Low forward voltage drop•Low switching losses, high efficiency •High forward surge capability•Solder dip 275 °C max. 10 s, per JESD 22-B106•Material categorization: for definitions of compliance please see /doc?99912TYPICAL APPLICATIONSFor use in high frequency rectification and freewheeling application in switching mode converters and inverters for consumer, computer and telecommunication.MECHANICAL DATACase: DO-201ADMolding compound meets UL 94 V-0 flammability rating Base P/N-E3 - RoHS-compliant, commercial gradeTerminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102E3 suffix meets JESD 201 class 1A whisker test Polarity: Color band denotes cathode endPRIMARY CHARACTERISTICSI F(AV) 3.0 AV RRM 50 V, 100 V, 200 V, 300 V, 400 V, 500 V, 600 V, 800 V, 1000 VI FSM 150 A t rr 50 ns, 75 ns V F 1.0 V, 1.7 V T J max.150 °C Package DO-201ADDiode variationsSingle dieDO-201ADMAXIMUM RATINGS (T A = 25 °C unless otherwise noted)PARAMETERSYMBOL UF5400UF5401UF5402UF5403UF5404UF5405UF5406UF5407UF5408UNIT Maximum repetitive peak reverse voltage V RRM 501002003004005006008001000V Maximum RMS voltage V RMS 3570140210280350420560700V Maximum DC blocking voltage V DC 501002003004005006008001000V Maximum average forwardrectified current, 0.375" (9.5 mm) lead length at T A = 55 °C I F(AV)3.0APeak forward surge current 8.3 ms single half sine-wave superimposed on rated load I FSM 150AOperating junction and storage temperature rangeT J , T STG-55 to +150°CNote(1)Pulse test: 300 μs pulse width, 1 % duty cycleNote(1)Thermal resistance from junction to lead and from junction to ambient with 0.375" (9.5 mm) lead length, both leads attached to heatsinkRATINGS AND CHARACTERISTICS CURVES (T A = 25 °C unless otherwise noted)Fig. 1 - Maximum Forward Current Derating Curve Fig. 2 - Forward Power Loss CharacteristicsELECTRICAL CHARACTERISTICS (T A = 25 °C unless otherwise noted)PARAMETER TEST CONDITIONS SYMBOL UF5400UF5401UF5402UF5403UF5404UF5405UF5406UF5407UF5408UNITMaximum instantaneous forward voltage 3.0 AV F (1)1.01.7VMaximum DC reverse current at rated DCblocking voltage T A = 25 °CI R10μAT A = 100 °C 75200Maximumreverse recovery timeI F = 0.5 A, I R = 1.0 A, I rr = 0.25 AT J = 25 °Ct rr 5075nsTypical junction capacitance4.0 V, 1 MHz C J 4536pFTHERMAL CHARACTERISTICS (T A = 25 °C unless otherwise noted)PARAMETERSYMBOL UF5400UF5401 UF5402 UF5403 UF5404 UF5405 UF5406 UF5407 UF5408 UNIT Typical thermal resistanceR θJA (1)20°C/WR θJL (1)8.5ORDERING INFORMATION (Example)PREFERRED P/N UNIT WEIGHT (g)PREFERRED PACKAGE CODEBASE QUANTITYDELIVERY MODEUF5406-E3/54 1.17254140013" diameter paper tape and reelUF5406-E3/731.172731000Ammo pack packagingFig. 3 - Maximum Non-Repetitive Peak Forward Surge Current Fig. 4 - Typical Instantaneous Forward Characteristics Fig. 5 - Typical Reverse Leakage CharacteristicsFig. 6 - Typical Junction CapacitancePACKAGE OUTLINE DIMENSIONS in inches (millimeters)Legal Disclaimer Notice VishayDisclaimerALL PRODUCT, PRODUCT SPECIFICAT IONS AND DAT A ARE SUBJECT T O CHANGE WIT HOUT NOT ICE T O IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and / or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.© 2017 VISHAY INTERTECHNOLOGY, INC. ALL RIGHTS RESERVED。
SN75188NE4中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)5962-86889012A ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type 5962-8688901CA ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type 5962-8688901DA ACTIVE CFP W141TBD A42SNPB N/A for Pkg Type MC1488N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeMC1488NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg Type SN55188J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SN75188D ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188DRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75188NE4ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75188NSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75188NSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ55188FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SNJ55188J ACTIVE CDIP J141TBD A42SNPB N/A for Pkg Type SNJ55188W ACTIVE CFP W141TBD A42SNPB N/A for Pkg Type (1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is 18-Jul-2006provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.18-Jul-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。
SN75117D中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
SN75173中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgment, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.Customers are responsible for their applications using TI components.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 2000, Texas Instruments Incorporated。
SN74LS38中文资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.PACKAGING INFORMATIONOrderableDevice Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)JM38510/00303BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/30203B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/30203B2A ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC JM38510/30203BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/30203BCA ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC JM38510/30203BDA ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC JM38510/30203BDAACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SN5438J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN5438J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN54LS38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN54LS38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN54S38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN54S38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SN7438D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438J OBSOLETE CDIP J 14TBD Call TI Call TI SN7438J OBSOLETE CDIP J 14TBD Call TI Call TISN7438N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN7438N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN7438N3OBSOLETE PDIP N 14TBD Call TI Call TI SN7438N3OBSOLETE PDIP N 14TBD Call TI Call TISN7438NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN7438NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN7438NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN7438NSRE4ACTIVESONS142000Green (RoHS &CU NIPDAULevel-1-260C-UNLIM26-Sep-2005OrderableDeviceStatus (1)Package Type Package Drawing Pins Package QtyEco Plan (2)Lead/Ball FinishMSL Peak Temp (3)no Sb/Br)SN7438NSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38DBRG4ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LS38DBRG4ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-2-260C-1YEAR SN74LS38DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS38N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS38N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74LS38N3OBSOLETE PDIP N 14TBD Call TI Call TISN74LS38NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS38NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74LS38NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38NSRG4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LS38NSRG4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38DRACTIVESOICD142500Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM26-Sep-2005Orderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)SN74S38DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74S38N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74S38N3OBSOLETE PDIP N 14TBD Call TI Call TI SN74S38N3OBSOLETE PDIP N 14TBD Call TI Call TISN74S38NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74S38NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN74S38NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38NSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74S38NSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ5438J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SNJ5438J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SNJ5438W ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SNJ5438W ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SNJ54LS38FK ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC SNJ54LS38FK ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC SNJ54LS38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SNJ54LS38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SNJ54LS38W ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SNJ54LS38W ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SNJ54S38FK ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC SNJ54S38FK ACTIVE LCCC FK 201TBD Call TI Level-NC-NC-NC SNJ54S38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SNJ54S38J ACTIVE CDIP J 141TBD Call TI Level-NC-NC-NC SNJ54S38W ACTIVE CFP W 141TBD Call TI Level-NC-NC-NC SNJ54S38WACTIVECFPW141TBDCall TILevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.26-Sep-2005(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS)or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.26-Sep-2005IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。
SN74LS138NSRG4;中文规格书,Datasheet资料
PACKAG PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Pea76005012A ACTIVE LCCC FK201TBD Call TI Call TI7600501EA ACTIVE CDIP J161TBD Call TI Call TI7600501EA ACTIVE CDIP J161TBD Call TI Call TI7600501FA ACTIVE CFP W161TBD Call TI Call TI7600501FA ACTIVE CFP W161TBD Call TI Call TI76041012A ACTIVE LCCC FK201TBD Call TI Call TI76041012A ACTIVE LCCC FK201TBD Call TI Call TI7604101EA ACTIVE CDIP J161TBD Call TI Call TI7604101EA ACTIVE CDIP J161TBD Call TI Call TI7604101FA ACTIVE CFP W161TBD Call TI Call TI7604101FA ACTIVE CFP W161TBD Call TI Call TI JM38510/07701BEA ACTIVE CDIP J161TBD A42N / A for PkgJM38510/07701BEA ACTIVE CDIP J161TBD A42N / A for PkgJM38510/07701BFA ACTIVE CFP W161TBD A42N / A for PkgJM38510/07701BFA ACTIVE CFP W161TBD A42N / A for PkgJM38510/30701B2A ACTIVE LCCC FK201TBD POST-PLATE N / A for PkgJM38510/30701B2A ACTIVE LCCC FK201TBD POST-PLATE N / A for PkgJM38510/30701BEA ACTIVE CDIP J161TBD A42N / A for PkgJM38510/30701BEA ACTIVE CDIP J161TBD A42N / A for PkgJM38510/30701BFA ACTIVE CFP W161TBD A42N / A for PkgJM38510/30701BFA ACTIVE CFP W161TBD A42N / A for PkgJM38510/30701SEA ACTIVE CDIP J1625TBD A42N / A for PkgJM38510/30701SEA ACTIVE CDIP J1625TBD A42N / A for PkgJM38510/30701SFA ACTIVE CFP W1625TBD A42N / A for PkgJM38510/30701SFA ACTIVE CFP W1625TBD A42N / A for PkgM38510/07701BEA ACTIVE CDIP J161TBD A42N / A for PkgM38510/07701BEA ACTIVE CDIP J161TBD A42N / A for PkgM38510/07701BFA ACTIVE CFP W161TBD A42N / A for PkgM38510/07701BFA ACTIVE CFP W161TBD A42N / A for PkgM38510/30701B2A ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg /PACKAG Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL PeaM38510/30701B2A ACTIVE LCCC FK201TBD POST-PLATE N / A for Pkg M38510/30701BEA ACTIVE CDIP J161TBD A42N / A for Pkg M38510/30701BEA ACTIVE CDIP J161TBD A42N / A for Pkg M38510/30701BFA ACTIVE CFP W161TBD A42N / A for Pkg M38510/30701BFA ACTIVE CFP W161TBD A42N / A for Pkg M38510/30701SEA ACTIVE CDIP J1625TBD A42N / A for Pkg M38510/30701SEA ACTIVE CDIP J1625TBD A42N / A for Pkg M38510/30701SFA ACTIVE CFP W1625TBD A42N / A for Pkg M38510/30701SFA ACTIVE CFP W1625TBD A42N / A for Pkg SN54LS138J ACTIVE CDIP J161TBD A42N / A for Pkg SN54LS138J ACTIVE CDIP J161TBD A42N / A for Pkg SN54S138J ACTIVE CDIP J161TBD A42N / A for Pkg SN54S138J ACTIVE CDIP J161TBD A42N / A for Pkg SN74LS138D ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138D ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DE4ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DE4ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DG4ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DG4ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DR ACTIVE SOIC D162500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DR ACTIVE SOIC D162500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DRE4ACTIVE SOIC D162500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DRE4ACTIVE SOIC D162500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C/PACKAG Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL PeaSN74LS138DRG4ACTIVE SOIC D162500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138DRG4ACTIVE SOIC D162500Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C SN74LS138N ACTIVE PDIP N1625Pb-Free (RoHS)CU NIPDAU N / A for PkgSN74LS138N ACTIVE PDIP N1625Pb-Free (RoHS)CU NIPDAU N / A for PkgSN74LS138N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS138N3OBSOLETE PDIP N16TBD Call TI Call TISN74LS138NE4ACTIVE PDIP N1625Pb-Free (RoHS)CU NIPDAU N / A for PkgSN74LS138NE4ACTIVE PDIP N1625Pb-Free (RoHS)CU NIPDAU N / A for PkgSN74LS138NSR ACTIVE SO NS162000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138NSR ACTIVE SO NS162000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138NSRE4ACTIVE SO NS162000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138NSRE4ACTIVE SO NS162000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138NSRG4ACTIVE SO NS162000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74LS138NSRG4ACTIVE SO NS162000Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74S138AD ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74S138ADE4ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260CSN74S138ADG4ACTIVE SOIC D1640Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C SN74S138AN ACTIVE PDIP N1625Pb-Free (RoHS)CU NIPDAU N / A for PkgSN74S138AN3OBSOLETE PDIP N16TBD Call TI Call TISN74S138ANE4ACTIVE PDIP N1625Pb-Free (RoHS)CU NIPDAU N / A for PkgSNJ54LS138FK ACTIVE LCCC FK201TBD POST-PLATE N / A for PkgSNJ54LS138FK ACTIVE LCCC FK201TBD POST-PLATE N / A for PkgSNJ54LS138J ACTIVE CDIP J161TBD A42N / A for Pkg /PACKAG Orderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL PeaSNJ54LS138J ACTIVE CDIP J161TBD A42N / A for PkgSNJ54LS138W ACTIVE CFP W161TBD A42N / A for PkgSNJ54LS138W ACTIVE CFP W161TBD A42N / A for PkgSNJ54S138FK ACTIVE LCCC FK201TBD POST-PLATE N / A for PkgSNJ54S138FK ACTIVE LCCC FK201TBD POST-PLATE N / A for PkgSNJ54S138J ACTIVE CDIP J161TBD A42N / A for PkgSNJ54S138J ACTIVE CDIP J161TBD A42N / A for PkgSNJ54S138W ACTIVE CFP W161TBD A42N / A for PkgSNJ54S138W ACTIVE CFP W161TBD A42N / A for Pkg(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.tinformation and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable fo Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retard in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate inf continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical an TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for releasIn no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to CuOTHER QUALIFIED VERSIONS OF SN54LS138, SN54LS138-SP, SN74LS138 :/分销商库存信息: TISN74LS138NSRG4。
NS8002 单声道 AB 类音频功放用户手册说明书
N S8002用户手册V1.0深圳市纳芯威科技有限公司2011年11月修改历史日期版本作者修改说明目录1功能说明 (5)2主要特性 (5)3应用领域 (5)4典型应用电路 (5)5极限参数 (6)6电气特性 (6)7芯片管脚描述 (7)7.1 管脚分配图 (7)7.2 引脚功能描述 (7)8NS8002典型参考特性 (8)8.1 总谐波失真（THD），失真＋噪声（THD+N），信噪比（S/N） (8)8.2 电源电压抑制比（PSRR） (10)8.3 芯片功耗（Power Dissipation） (11)8.4 关断滞回（Shut Down Hysteresis） (12)8.5 输出功率(Output Power) (13)9NS8002应用说明 (14)9.1 芯片基本结构描述 (14)9.2 芯片数字逻辑特性 (15)9.3 外部电阻配置 (15)9.4 外部电容配置 (15)9.5 芯片功耗 (15)9.6电源旁路 (15)9.7 掉电模式 (15)10芯片的封装 (16)图目录图1 NS8002典型应用电路 (5)图2 SOP8封装的管脚分配图（top view） (7)图3 NS8002原理框图 (14)图4 SOP8封装尺寸图 (16)表目录表1 芯片最大物理极限值 (6)表2 NS8002电气特性 (6)表3 NS8002管脚描述 (7)关断信号数字逻辑特性表4 (15)1功能说明NS8002是一款AB类桥式输出音频功率放大器。
其应用电路简单，只需极少数外围器件。
输出不需要外接耦合电容或上举电容和缓冲网络。
SOP8封装,更适合用于便携系统。
NS8002可以通过控制进入低功耗关断模式，从而减少功耗。
增益带宽积高达2.5M，并且单位增益稳定。
通过配置外围电阻可以调整放大器的电压增益，方便应用。
NS8002提供 SOP8封装，额定的工作温度范围为-40℃至85℃。
2主要特性●输出功率: 2. 4W（RL=4Ω,THD=10%）●掉电模式漏电流小: 1uA（典型）●高电平ShutDown●采用SOP8封装●外部增益可调●电压范围3.0V—5.25V●不需驱动输出耦合电容、自举电容和缓冲网络●单位增益稳定3应用领域●手提电脑●台式电脑●低压音响系统4典型应用电路图1NS8002典型应用电路5极限参数表1 芯片最大物理极限值参数最小值最大值单位说明电源电压 2.8 5.5 V储存温度-65 150 o C输入电压-0.3 V DD V耐ESD电压1 3000 VHBM耐ESD电压2 250 VMM节温150 o C 典型值150工作温度-40 85 o C热阻θJC(SOP8) 35o C/WθJA(SOP8) 140o C/W焊接温度 220 o C 15秒内注：在极限值之外或任何其他条件下，芯片的工作性能不予保证。
74138中文资料
LOW POWER SCHOTTKYDevice Package Shipping SN74LS138N 16 Pin DIP 2000 Units/Box SN74LS138D16 PinSOIC D SUFFIX CASE 751B2500/T ape & ReelPLASTIC N SUFFIX CASE 648161161ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATIONASIA/PACIFIC: LDC for ON Semiconductor – Asia SupportPhone:303–675–2121 (Tue–Fri 9:00am to 1:00pm, Hong Kong Time)Toll Free from Hong Kong 800–4422–3781Email: ONlit–asia@JAPAN: ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–8549Phone: 81–3–5487–8345Email: r14153@Fax Response Line:303–675–2167。
SN74LS378NSRG4资料
Copyright © 1988, Texas Instruments Incorporated PRODUCTION DATA information is current as of publication date.Products conform to specifications per the terms of Texas Instrumentsstandard warranty. Production processing does not necessarily includetesting of all parameters.1POST OFFICE BOX 655303 • DALLAS, TEXAS 752652POST OFFICE BOX 655303 • DALLAS, TEXAS 752653 POST OFFICE BOX 655303 • DALLAS, TEXAS 752654POST OFFICE BOX 655303 • DALLAS, TEXAS 75265IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments IncorporatedIMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements, improvements,and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right,or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI. Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use anynon-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityLow Power /lpw Telephony /telephonyWirelessVideo&Imaging /videoWireless /wirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2007,Texas Instruments Incorporated。
SN75172中文资料
元器件交易网IMPORTANT NOTICETexas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinueany product or service without notice, and advise customers to obtain the latest version of relevant informationto verify, before placing orders, that information being relied on is current and complete. All products are soldsubject to the terms and conditions of sale supplied at the time of order acknowledgement, including thosepertaining to warranty, patent infringement, and limitation of liability.TI warrants performance of its semiconductor products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extentTI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarilyperformed, except those mandated by government requirements.CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OFDEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICALAPPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, ORWARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHERCRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TOBE FULLY AT THE CUSTOMER’S RISK.In order to minimize risks associated with the customer’s applications, adequate design and operatingsafeguards must be provided by the customer to minimize inherent or procedural hazards.TI assumes no liability for applications assistance or customer product design. TI does not warrant or representthat any license, either express or implied, is granted under any patent right, copyright, mask work right, or otherintellectual property right of TI covering or relating to any combination, machine, or process in which suchsemiconductor products or services might be or are used. TI’s publication of information regarding any thirdparty’s products or services does not constitute TI’s approval, warranty or endorsement thereof.Copyright © 1998, Texas Instruments Incorporated。
75176B中文资料
75176B中⽂资料PACKAGING INFORMATION Orderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN65176BD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDR ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDRE4ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BDRG4ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN65176BP ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N/A for Pkg TypeSN65176BPE4ACTIVE PDIP P850Pb-Free (RoHS)CU NIPDAU N/A for Pkg TypeSN75176BD ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDE4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDG4ACTIVE SOIC D875Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDR ACTIVE SOIC D82500Green(RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDRE4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BDRG4ACTIVE SOIC D82500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BP ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BPE4ACTIVE PDIP P850Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN75176BPSR ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN75176BPSRG4ACTIVE SO PS82000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /doc/7167b986cc22bcd126ff0c93.html /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die andpackage,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak soldertemperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATIONDevice Package Pins Site ReelDiameter(mm)ReelWidth(mm)A0(mm)B0(mm)K0(mm)P1(mm)W(mm)Pin1QuadrantSN65176BDR D8FMX33012 6.4 5.2 2.1812Q1 SN75176BDR D8FMX33012 6.4 5.2 2.1812Q1 SN75176BPSR PS8MLA330168.2 6.6 2.51216Q1TAPE AND REEL BOX INFORMATIONDevice Package Pins Site Length(mm)Width(mm)Height(mm)SN65176BDR D8FMX338.1340.520.64SN75176BDR D8FMX338.1340.520.64SN75176BPSR PS8MLA342.9336.628.58。
ST L7800AB AC SERIES 说明书
现货库存、技术资料、百科信息、热点资讯，精彩尽在鼎好!L7800AB/ACSERIESPRECISION 1A REGULATORS®November 1999s OUTPUT CURRENT IN EXCESS OF 1AsOUTPUT VOLTAGESOF 5;6;8;9;12;15;18;20;24Vs THERMAL OVERLOAD PROTECTIONs OUTPUT TRANSITION SOA PROTECTION s 2%OUTPUT VOLTAGE TOLERANCE sGUARANTEED IN EXTENDED TEMPERATURE RANGEDESCRIPTIONThe L7800A series of three-terminal positive regulators is available in TO-220and D 2PAK packages and several fixed output voltages,making it useful in a wide range of applications.These regulators can provide local on-card regulation,eliminating the distribution problems associated with single point regulation.Each type employs internal current limiting,thermal shut-down and safe area protection,making it essentially indestructible.If adequate heat sinking is provided,they can deliver over 1A output current.Although designed primarily as fixed voltage regulators,these devices can be used with external components to obtain adjustable voltages and currents.TO-220D 2PAKBLOCK DIAGRAM1/17CONNECTION DIAGRAM AND ORDERING NUMBERS (top view)TO-220D 2PAKTHERMAL DATASymbolParameterD 2PAK TO-220UnitR thj-ca se R thj-amb Thermal Resistance Junction-case Max Thermal Resistance Junction-ambient Max362.5350o C/W oC/WTypeTO-220D 2PAK (*)Output VoltageL7805AB L7805AC L7806AB L7806AC L7808AB L7808AC L7809AB L7809AC L7812AB L7812AC L7815AB L7815AC L7818AB L7818AC L7820AB L7820AC L7824AB L7824ACL7805ABV L7805ACV L7806ABV L7806ACV L7808ABV L7808ACV L7809ABV L7809ACV L7812ABV L7812ACV L7815ABV L7815ACV L7818ABV L7818ACV L7820ABV L7820ACV L7824ABV L7824ACVL7805ABD2T L7805ACD2T L7806ABD2T L7806ACD2T L7808ABD2T L7808ACD2T L7809ABD2T L7809ACD2T L7812ABD2T L7812ACD2T L7815ABD2T L7815ACD2T5V 5V 6V 6V 8V 8V 9V 9V 12V 12V 15V 15V 18V 18V 24V 24V(*)AVAILABLE IN TAPE AND REEL WITH ”-TR”SUFFIXABSOLUTE MAXIMUM RATINGSSymbol ParameterValue Unit V i DC Input Voltage (for V O =5to 18V)(for V O =20,24V)3540V VI o Output Current Internally limited P tot Power DissipationInternally limitedT op Operating Junction Temperature Range (for L7800AC )(for L7800AB )0to 150-40to 125o C o C T st gStorage Temperature Range-65to 150oCL7800AB/AC2/17L7800AB/AC APPLICATION CIRCUITSCHEMATIC DIAGRAM3/17TEST CIRCUITSFigure3:Ripple Rejection.Figure2:Load Regulation.Figure1:DC Parameter L7800AB/AC4/17*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.ELECTRICAL CHARACTERISTICS FOR L7805A (V i =10V,I o =1A,T j =0to 125o C (L7805AC),T j =-40to 125o C (L7805AB)unless otherwise specified)Symbol ParameterTest ConditionsMin.Typ.Max.Unit V o Output Voltage T j =25o C 4.95 5.1V V o Output Voltage I o =5mA to 1A P o ≤15W V i =7.5to 20V 4.85 5.2V ∆V o *Line RegulationV i =7.5to 25V I o =500mA V i =8to 12V V i =8to 12V T j =25o C V i =7.3to 20VT j =25o C710275052550mV mV mV mV ∆V o *Load RegulationI o =5mA to 1AI o =5mA to 1.5A T j =25o C I o =250to 750mA 2530810010050mV mV mV I d Quiescent Current T j =25oC4.366mA ∆I dQuiescent Current ChangeV i =8to 25V I o =500mAV i =7.5to 20VT j =25o C I o =5mA to 1A 0.80.80.5mA mA mA SVR Supply Voltage Rejection V i =8to 18V f =120HzI o =500mA 68dB V d Dropout Voltage I o =1AT j =25o C2V e N Output Noise Voltage B =10Hz to 100KHz T j =25oC10µV/V o R o Output Resistance f =1KHz 17m ΩI s c Short Circuit Current V i =35V T amb =25o C0.2A I scp Short Circuit Peack Current T j =25o C2.2A ∆V o∆TOutput Voltage Drift-1.1mV/o CL7800AB/AC5/17ELECTRICAL CHARACTERISTICS FOR L7806A(V i=11V,I o=1A,T j=0to125o C(L7806AC),T j=-40to125o C(L7806AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C 5.886 6.12V V o Output Voltage I o=5mA to1A P o≤15WV i=8.6to21V5.7666.24V∆V o*Line Regulation V i=8.6to25V I o=500mAV i=9to13VV i=9to13V T j=25o CV i=8.3to21V T j=25o C9113960603060mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.366mA∆I d Quiescent Current Change V i=9to25V I o=500mAV i=8.6to21V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=9to19V f=120HzI o=500mA65dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz17mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-0.8mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.L7800AB/AC6/17ELECTRICAL CHARACTERISTICS FOR L7808A(V i=14V,I o=1A,T j=0to125o C(L7808AC),T j=-40to125o C(L7808AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C7.8488.16V V o Output Voltage I o=5mA to1A P o≤15WV i=10.6to23V7.788.3V∆V o*Line Regulation V i=10.6to25V I o=500mAV i=11to17VV i=11to17V T j=25o CV i=10.4to23V T j=25o C 121551280804080mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.366mA∆I d Quiescent Current Change V i=11to25V I o=500mAV i=10.6to23V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=11.5to21.5V f=120HzI o=500mA62dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz18mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-0.8mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.L7800AB/AC7/17ELECTRICAL CHARACTERISTICS FOR L7809A(V i=15V,I o=1A,T j=0to125o C(L7809AC),T j=-40to125o C(L7809AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C8.8299.18V V o Output Voltage I o=5mA to1A P o≤15WV i=10.6to23V8.6599.35V∆V o*Line Regulation V i=10.6to25V I o=500mAV i=11to17VV i=11to17V T j=25o CV i=10.4to23V T j=25o C 121551290904590mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.366mA∆I d Quiescent Current Change V i=11to25V I o=500mAV i=10.6to23V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=11.5to21.5V f=120HzI o=500mA61dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz18mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-0.8mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.L7800AB/AC8/17ELECTRICAL CHARACTERISTICS FOR L7812A(V i=19V,I o=1A,T j=0to125o C(L7812AC),T j=-40to125o C(L7812AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C11.751212.25V V o Output Voltage I o=5mA to1A P o≤15WV i=14.8to27V11.51212.5V∆V o*Line Regulation V i=14.8to30V I o=500mAV i=16to22VV i=16to22V T j=25o CV i=14.5to27V T j=25o C 131661312012060120mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.466mA∆I d Quiescent Current Change V i=15to30V I o=500mAV i=14.8to27V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=15to25V f=120HzI o=500mA60dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz18mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-1mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.L7800AB/AC9/17ELECTRICAL CHARACTERISTICS FOR L7815A(V i=23V,I o=1A,T j=0to125o C(L7815AC),T j=-40to125o C(L7815AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C14.71515.3V V o Output Voltage I o=5mA to1A P o≤15WV i=17.9to30V14.41515.6V∆V o*Line Regulation V i=17.9to30V I o=500mAV i=20to26VV i=20to26V T j=25o CV i=17.5to30V T j=25o C 131661315015075150mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.466mA∆I d Quiescent Current Change V i=17.5to30V I o=500mAV i=17.5to30V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=18.5to28.5V f=120HzI o=500mA58dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz19mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-1mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.L7800AB/AC10/17ELECTRICAL CHARACTERISTICS FOR L7818A(V i=27V,I o=1A,T j=0to125o C(L7818AC),T j=-40to125o C(L7818AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C17.641818.36V V o Output Voltage I o=5mA to1A P o≤15WV i=21to33V17.31818.7V∆V o*Line Regulation V i=21to33V I o=500mAV i=24to30VV i=24to30V T j=25o CV i=20.6to33V T j=25o C 252810518018090180mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.566mA∆I d Quiescent Current Change V i=21to33V I o=500mAV i=21to33V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=22to32V f=120HzI o=500mA57dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz19mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-1mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.11/17ELECTRICAL CHARACTERISTICS FOR L7820A(V i=28V,I o=1A,T j=0to125o C(L7820AC),T j=-40to125o C(L7820AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C19.62020.4V V o Output Voltage I o=5mA to1A P o≤15WV i=23to35V19.22020.8V∆V o*Line Regulation V i=23to35V I o=500mAV i=26to32VV i=26to32V T j=25o CV i=23to32V T j=25o C 200200100200mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.566mA∆I d Quiescent Current Change V i=23to35V I o=500mAV i=23to35V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=24to35V f=120HzI o=500mA56dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz20mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-1mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.12/17ELECTRICAL CHARACTERISTICS FOR L7824A(V i=33V,I o=1A,T j=0to125o C(L7824AC),T j=-40to125o C(L7824AB)unless otherwise specified)Symbol Parameter Test Conditions Min.Typ.Max.Unit V o Output Voltage T j=25o C23.52424.5V V o Output Voltage I o=5mA to1A P o≤15WV i=27.3to38V232425V∆V o*Line Regulation V i=27to38V I o=500mAV i=30to36VV i=30to36V T j=25o CV i=26.7to38V T j=25o C 31351431240240120240mVmVmVmV∆V o*Load Regulation I o=5mA to1AI o=5mA to1.5A T j=25o CI o=250to750mA 25301010010050mVmVmVI d Quiescent Current T j=25o C 4.666mA∆I d Quiescent Current Change V i=27.3to38V I o=500mAV i=27.3to38V T j=25o CI o=5mA to1A 0.80.80.5mAmAmASVR Supply Voltage Rejection V i=28to38V f=120HzI o=500mA54dB V d Dropout Voltage I o=1A T j=25o C2Ve N Output Noise Voltage B=10Hz to100KHz T j=25o C10µV/V oR o Output Resistance f=1KHz20mΩI s c Short Circuit Current V i=35V T amb=25o C0.2AI scp Short Circuit Peack Current T j=25o C 2.2A∆V o∆TOutput Voltage Drift-1.5mV/o C*Load and line regulation are specified at constant junction temperature.Changes in V o due to heating effects must be taken into account separately.Pulse testing with low duty cycle is used.13/17APPLICATIONS INFORMATIONDESIGN CONSIDERATIONSThe L7800A Series of fixed voltage regulators are designed with Thermal Overload Protection that shuts down the circuit when subjected to an excessive power overload condition,Internal Short-circuit Protection that limits the maximum current the circuit will pass,and Output Transistor Safe-Area Compensation that reduces the output short-circuit current as the voltage across the pass transistor is increased.In many low current applications,compensation capacitors are not required.However,it is recommended that the regulator input be bypassed with a capacitor if the regulator is connected to the power supply filter with long wire lengths,or if the output load capacitance is large.An input bypass capacitor should be selected to provide good high-frequency characteristics to insure stable operation under all load conditions.A 0.33µF or larger tantalum,mylar,or other capacitor having low internal impedance at high frequencies should be chosen.The bypass capacitor should be mounted with the shortest possible leads directly across the regulators input terminals.Normally good construction techniques should be used to minimize ground loops and lead resistance drops since the regulator has no external sense lead.Figure 4:Current Regulator.Figure 5:Adjustable Output Regulator.Figure 6:Current Boost Regulator.Figure 7:Short-circuit Protection.V O ,7.0V to 20V V i –V O ≥2.0VThe addition of an operational amplifier allows adjustment to higher or intermediate values while retaining regulation characteristics.The minimum voltage obtainable with this arrangement is 2.0V greater than the regulator voltage.The circuit of figure 6can be modified to provide supply protection against short circuit by adding a short-circuit sense resistor,R sc ,and an additional PNP transistor.The current sensing PNP must be able to handle the short-circuit current of the three-terminal regulator.Therefore,a four-ampere plastic power transistor is specified.R 1=V BEQ 1I REQ −I Q 1βQ 1I O =IREG+Q 1(I REG −V BEQ 1R 1)I O =V XXR 1+I d 14/17DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 4.40 4.600.1730.181C 1.23 1.320.0480.051D 2.402.720.0940.107D1 1.270.050E 0.490.700.0190.027F 0.610.880.0240.034F1 1.14 1.700.0440.067F2 1.14 1.700.0440.067G 4.95 5.150.1940.203G1 2.4 2.70.0940.106H210.010.400.3930.409L216.40.645L413.014.00.5110.551L5 2.65 2.950.1040.116L615.2515.750.6000.620L7 6.2 6.60.2440.260L9 3.5 3.930.1370.154DIA.3.75 3.850.1470.151L6ACDED 1FGL7L2Dia.F 1L5L4H 2L9F 2G 1TO-220MECHANICAL DATAP011C15/17DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 4.4 4.60.1730.181A1 2.49 2.690.0980.106B 0.70.930.0270.036B2 1.14 1.70.0440.067C 0.450.60.0170.023C2 1.23 1.360.0480.053D 8.959.350.3520.368E 1010.40.3930.409G 4.88 5.280.1920.208L 1515.850.5900.624L2 1.27 1.40.0500.055L31.41.750.0550.068L2L3LB2B GEAC2DCA1DETAIL”A”DETAIL”A”A 2P011P6/FTO-263(D 2PAK)MECHANICAL DATA16/17Information furnished is believed to be accurate and reliable.However,STMicroelectroni c s assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use.No license is granted by implication or otherwise under any patent or patent rights of STMicroelectroni c s.Specification mentioned in this publication are subject to change without notice.This publication supersedes and replaces all informati o n previously supplied.STMicroelectronics products are not authorized for use as critical components in life support devices or systems withoutexpress written approval of STMicroelectronics.The ST logo is a registered trademark of STMicroelectronics©1999STMicroelectronics–Printed in Italy–All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia-Brazil-China-Finland-France-Germany-Hong Kong-India-Italy-Japan-Malaysia-Malta-MoroccoSingapore-Spain-Sweden-Switzerland-United Kingdom-U.S.A..17/17。
SM7513隔离12V0.3A小功率恒流电源芯片非认证电源方案
GOSTON ELECTRONICS CO.,LTD 型号: SM7513(12V,300mA) 版本：N1-1.0
NO. 元件类型 型号描述 用量 1 线绕电阻 RES-FUS-10.00R-0.250W 1 2 贴片电阻 RES-SMD-1206-003.0R-1%-0.250W 1 3 贴片电阻 RES-SMD-0805-011.00K-5%-0.125W 1 4 贴片电容 CAP-SMD-0805-1.0u-10%-16V 1 5 贴片电容 CAP-SMD-1206-10.0u-10%-25V 1 6 电解电容 CAP-ELE-004.70u-400V_Ф8*12 1 7 贴片二极管 DIO-FAS-SMA-01.00A-200V-US1D 1 8 贴片桥堆 BR-MBS-1.00A-600V-MB6S 1 9 变压器 TR-EE10卧式/2.4mH(146T:26T) 1 10 芯片 IC-SM-SM7513_SOP8 1 11 线材 WIR-CE-0.5mm*mm-white 1 12 线材 WIR-CE-0.5mm*mm-white 1 13 线材 WIR-CE-0.5mm*mm-red 1 14 线材 WIR-CE-0.5mm*mm-black 1 15 PCB板 24*16(L*W) 1 单位
4 2
密绕 密绕
二、线圈结构
三、产品外型(单位mm)
四、电性能 项目 电感量 漏感 直流铜阻 耐压测试 脚位 规定值 测试条件 3—1 2.4mH±6％ 1KHZ 0.25V 3—1 ≤300uH 1KHZ 0.25V P—S P、S—C 2000VAC 1000VAC
5mA
3S
五、技术说明 1、骨架上有斜边处为1脚。
Pcs Pcs Pcs Pcs Pcs Pcs Pcs Pcs Pcs Pcs EA EA EA EA EA
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PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package DrawingPins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)7900901CA ACTIVE CDIP J 141None A42SNPB Level-NC-NC-NC 7900901DA ACTIVE CFP W 141None A42SNPB Level-NC-NC-NC DS8830N OBSOLETE PDIP N 14None Call TI Call TISN55183J ACTIVE CDIP J 141None A42SNPB Level-NC-NC-NC SN75183D ACTIVE SOIC D 1450Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN75183DR ACTIVE SOIC D 142500Pb-Free (RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIM SN75183N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU Level-NC-NC-NC SN75183NSR ACTIVE SO NS 142000Pb-Free (RoHS)CU NIPDAULevel-2-260C-1YEAR/Level-1-235C-UNLIM SNJ55183FK ACTIVE LCCC FK 201None POST-PLATE Level-NC-NC-NC SNJ55183J ACTIVE CDIP J 141None A42SNPB Level-NC-NC-NC SNJ55183WACTIVECFPW141NoneA42SNPBLevel-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -May not be currently available -please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead (Pb-Free).Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor productsthat are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green (RoHS &no Sb/Br):TI defines "Green"to mean "Pb-Free"and in addition,uses package materials that do not contain halogens,including bromine (Br)or antimony (Sb)above 0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM4-Mar-2005Addendum-Page 1元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. 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