TPS73201DCQRG4中文资料
LTC3201EMS;LTC3201EMS#PBF;LTC3201EMS#TR;LTC3201EMS#TRPBF;中文规格书,Datasheet资料
I OUT = 100mAI IN = 205mAV IN = 3.6V1/LTC320123201fABSOLUTE AXI U RATI GSW W WU PACKAGE/ORDER I FOR ATIOUUW (Note 1)ELECTRICAL CHARACTERISTICSThe q denotes the specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V IN = 3.6V, C FILTER = C FLY = 0.22µF, C IN = C OUT = 1µF,t MIN to t MAX unless otherwise noted.V IN , V FILTER , V OUT , CP, CM to GND..............–0.3V to 6V D0, D1, D2, FB to GND .................–0.3V to (V IN + 0.3V)V OUT Short-Circuit Duration.............................Indefinite I OUT ......................................................................................150mA Operating Temperature Range (Note 2)...–40°C to 85°C Storage Temperature Range.................–65°C to 150°C Lead Temperature (Soldering, 10 sec)..................300°CORDER PART NUMBER MS PART MARKING T JMAX = 150°CθJA = 130°C/W (1 LAYER BOARD)θJA = 100°C/W (4 LAYER BOARD)Consult LTC Marketing for parts specified with wider operating temperature ranges.LTC3201EMS PARAMETER CONDITIONSMIN TYP MAX UNITSV IN Operating Voltage q2.74.5V V IN Operating Current I OUT = 0mAq 4 6.5mA V IN Shutdown Current D0, D1, D2 = 0V, V OUT = 0V q1µA Open-Loop Output Impedance I OUT = 100mA 8ΩInput Current Ripple I IN = 200mA30mA P-P Output Ripple I OUT = 100mA, C OUT = 1µF 30mV P-PV FB Regulation Voltage D0 = D1 = D2 = V INq 0.570.630.66V V FB DAC Step Size 90mV Switching Frequency Oscillator Free Running1.4 1.8MHzD0 to D2 Input Threshold q 0.4 1.1V D0 to D2 Input Current q–11µA V OUT Short-Circuit Current V OUT = 0V 150mA V OUT Turn-On TimeI OUT = 0mA1msLTVB12345V OUT CP FILTER CM GND109876FB V IN D2D1D0TOP VIEWMS PACKAGE10-LEAD PLASTIC MSOP Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired.Note 2: The LTC3201E is guaranteed to meet performance specifications from 0°C to 70°C. Specifications over the –40°C to 85°C operatingtemperature range are assured by design, characterization and correlation with statistical process controls./3 /4/LTC320153201fAPPLICATIO S I FOR ATIOW UUU Operation (Refer to Simplified Block Diagram)The LTC3201 is a switched capacitor boost charge pump especially designed to drive white LEDs in backlighting applications. The LTC3201’s internal regulation loop maintains constant LED output current by monitoring the voltage at the FB pin. The device has a novel internal filter that, along with an external 0.22µF capacitor, significantly reduces input current ripple. An internal 7-state DAC allows the user to lower the regulation voltage at the FB pin, thus lowering the LED current. To regulate the output current, the user places a sense resistor between FB and GND. The white LED is then placed between V OUT and FB.The value at the FB pin is then compared to the output of the DAC. The charge pump output voltage is then changed to equalize the DAC output and the FB pin. The value of the sense resistor determines the maximum value of the output current.When the charge pump is enabled, a two-phase nonoverlapping clock activates the charge pump switches.The flying capacitor is charged to V IN on phase one of the clock. On phase two of the clock, it is stacked in series with V IN and connected to V OUT . This sequence of charging and discharging the flying capacitor continues at a free run-ning frequency of 1.8MHz (typ) until the FB pin voltage reaches the value of the DAC.In shutdown mode all circuitry is turned off and the LTC3201 draws only leakage current (<1µA) from the V IN supply. Furthermore, V OUT is disconnected from V IN . The LTC3201 is in shutdown when a logic low is applied to all three D0:D2 pins. Note that if V OUT floats to >1.5V,shutdown current will increase to 10µA max. In normal operation, the quiescent supply current of the LTC3201will be slightly higher if any of the D0:D2 pins is driven high with a signal that is below V IN than if it is driven all the way to V IN . Since the D0:D2 pins are high impedance CMOS inputs, they should never be allowed to float.Input Current RippleThe LTC3201 is designed to minimize the current ripple at V IN . Typical charge pump boost converters draw large amounts of current from V IN during both phase 1 and phase 2 of the clocking. If there is a large nonoverlap time between the two phases, the current being drawn from V INcan go down to zero during this time. At the full load of 100mA at the output, this means that the input could potentially go from 200mA down to 0mA during the nonoverlap time. The LTC3201 mitigates this problem by minimizing the nonoverlap time, using a high (1.8MHz)frequency clock, and employing a novel noise FILTER network. The noise filter consists of internal circuitry plus external capacitors at the FILTER and V IN pins. The filter capacitor serves to cancel the higher frequency compo-nents of the noise, while the V IN capacitor cancels out the lower frequency components. The recommended values are 0.22µF for the FILTER capacitor and 1µF for the V IN capacitor. Note that these capacitors must be of the highest possible resonant frequencies. See Layout Considerations.3-Bit DAC for Output Current ControlDigital pins D0, D1, D2 are used to control the output current level. D0 = D1 = D2 = V IN allows the user to program an output LED current that is equal to 0.63V/R SENSE , where R SENSE is the resistor connected to any single LED and connected between FB and ground. Due to the finite transconductance of the regulation loop, for a given diode setting, the voltage at the FB Pin will decrease as output current increases. All LEDs subsequently connected in parallel should then have similar currents. The mismatch-ing of the LED V F and the mismatching of the sense resistors will cause a differential current error between LEDs connected to the same output. Once the sense resistor is selected, the user can then control the voltage applied across that resistor by changing the digital values at D0:D2. This in turn controls the current into the LED.Note that there are only 7 available current states. The 8th is reserved to shutdown. This is the all 0s code. Refer to Table below.D0D1D2FB HIGH HIGH HIGH 0.63V HIGH HIGH LOW 0.54V HIGH LOW HIGH 0.45V HIGH LOW LOW 0.36V LOW HIGH HIGH 0.27V LOW HIGH LOW 0.18V LOW LOW HIGH 0.09V LOWLOWLOWShutdown/LTC320163201fPower EfficiencyThe power efficiency (η) of the LTC3201 is similar to that of a linear regulator with an effective input voltage of twice the actual input voltage. This occurs because the input current for a voltage doubling charge pump is approxi-mately twice the output current. In an ideal regulator the power efficiency would be given by:η===P P V I V I V V OUT IN OUT OUT IN OUTOUTIN ••22At moderate to high output power the switching lossesand quiescent current of LTC3201 are relatively low. Due to the high clocking frequency, however, the current used for charging and discharging the switches starts to reduce efficiency. Furthermore, due to the low V F of the LEDs,power delivered will remain low.Short-Circuit/Thermal ProtectionThe LTC3201 has short-circuit current limiting as well as overtemperature protection. During short-circuit condi-tions, the output current is limited to typically 150mA.On-chip thermal shutdown circuitry disables the charge pump once the junction temperature exceeds approxi-mately 160°C and re-enables the charge pump once the junction temperature drops back to approximately 150°C.The LTC3201 will cycle in and out of thermal shutdown indefinitely without latchup or damage until the short-circuit on V OUT is removed.V OUT Capacitor SelectionThe style and value of capacitors used with the LTC3201determine several important parameters such as output ripple, charge pump strength and minimum start-up time.To reduce noise and ripple, it is recommended that low ESR (<0.1Ω) capacitors be used for C FILTER , C IN , C OUT .These capacitors should be ceramic.The value of C OUT controls the amount of output ripple.Increasing the size of C OUT to 10µF or greater will reduce the output ripple at the expense of higher turn-on times and start-up current. See the section Output Ripple. A 1µF C OUT is recommended.V IN , V FILTER Capacitor SelectionThe value and resonant frequency of C FILTER and C IN greatly determine the current noise profile at V IN . C FILTER should be a high frequency 0.22µF capacitor with a reso-nant frequency over 30MHz. Input capacitor C IN should be a 1µF ceramic capacitor with a resonant frequency over 1MHz. The X5R capacitor is a good choice for both. The values of C FILTER (0.22µF) and C IN (1µF) provide optimum high and low frequency input current filtering. A higher filter cap value will result in lower low frequency input current ripple, but with increased high frequency ripple.The key at the FILTER node is that the capacitor has to be very high frequency. If capacitor technology improves the bandwidth, then higher values should be used. Similarly,increasing the input capacitor value but decreasing its resonant frequency will not really help. Decreasing it will help the high frequency performance while increasing the low frequency current ripple.Direct Connection to BatteryDue to the ultra low input current ripple, it is possible to connect the LTC3201 directly to the battery without using regulators or high frequency chokes.Flying Capacitor SelectionWarning: A polarized capacitor such as tantalum or alumi-num should never be used for the flying capacitor since its voltage can reverse upon start-up. Low ESR ceramic capacitors should always be used for the flying capacitor.The flying capacitor controls the strength of the charge pump. In order to achieve the rated output current it is necessary to have at least 0.22µF of capacitance for the flying capacitor. Capacitors of different materials lose their capacitance with higher temperature and voltage at different rates. For example, a ceramic capacitor made of X7R material will retain most of its capacitance from –40°C to 85°C whereas a Z5U and Y5V style capacitor will lose considerable capacitance over that range. Z5U and Y5V capacitors may also have a very strong voltage coefficient causing them to lose 60% or more of their capacitance when the rated voltage is applied. Therefore,when comparing different capacitors it is often moreAPPLICATIO S I FOR ATIOW UUU /LTC320173201fappropriate to compare the achievable capacitance for a given case size rather than discussing the specified ca-pacitance value. For example, over the rated voltage and temperature, a 1µF, 10V, Y5V ceramic capacitor in an 0603case may not provide any more capacitance than a 0.22µF 10V X7R available in the same 0603 case. The capacitor manufacturer’s data sheet should be consulted to deter-mine what value of capacitor is needed to ensure 0.22µF at all temperatures and voltages.Below is a list of ceramic capacitor manufacturers and how to contact them:AVX (843) Kemet (864) Murata (770) Taiyo Yuden (800) Vishay(610) 644-1300Open-Loop Output ImpedanceThe theoretical minimum open-loop output impedance of a voltage doubling charge pump is given by:R V V I FCOUT MIN IN OUT OUT ()–==21where F if the switching frequency (1.8MHz typ) and C isthe value of the flying capacitor. (Using units of MHz and µF is convenient since they cancel each other). Note that the charge pump will typically be weaker than the theoreti-cal limit due to additional switch resistance. Under normal operation, however, with V OUT ≈ 4V, I OUT < 100mA,V IN > 3V, the output impedance is given by the closed-loop value of ~0.5Ω.Output RippleThe value of C OUT directly controls the amount of ripple for a given load current. Increasing the size of C OUT will reduce the output ripple at the expense of higher minimum turn-on time and higher start-up current. The peak-to-peak output ripple is approximated by the expression:V I F C RIPPLE P P OUT OUT()•−≅2 F is the switching frequency (1.8MHz typ).Loop StabilityBoth the style and the value of C OUT can affect the stability of the LTC3201. The device uses a closed loop to adjust the strength of the charge pump to match the required output current. The error signal of this loop is directly stored on the output capacitor. The output capacitor also serves to form the dominant pole of the loop. To prevent ringing or instability, it is important for the output capaci-tor to maintain at least 0.47µF over all ambient and operating conditions.Excessive ESR on the output capacitor will degrade the loop stability of the LTC3201. The closed loop DC imped-ance is nominally 0.5Ω. The output will thus change by 50mV with a 100mA load. Output capacitors with ESR of 0.3Ω or greater could cause instability or poor transient response. To avoid these problems, ceramic capacitors should be used. A tight board layout with good ground plane is also recommended.Soft-StartThe LTC3201 has built-in soft-start circuitry to prevent excessive input current flow at V IN during start-up. The soft-start time is programmed at approximately 30µyout ConsiderationsDue to the high switching frequency and large transient currents produced by the LTC3201, careful board layout is necessary. A true ground plane is a must. To minimize high frequency input noise ripple, it is especially important that the filter capacitor be placed with the shortest dis-tance to the LTC3201 (1/8 inch or less). The filter capacitor should have the highest possible resonant frequency.Conversely, the input capacitor does not need to be placed close to the pin. The input capacitor serves to cancel out the lower frequency input noise ripple. Extra inductance on the V IN line actually helps input current ripple. Note that if the V IN trace is lengthened to add parasitic inductance,it starts to look like an antenna and worsen the radiated noise. It is recommended that the filter capacitor be placed on the left hand side next to Pin 3. The flying capacitor can then be placed on the top of the device. It is also importantAPPLICATIO S I FOR ATIOW UUU Information furnished by Linear Technology Corporation is believed to be accurate and reliable.However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights./8Linear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 qFAX: (408) 434-0507 q © LINEAR TECHNOLOGY CORPORA TION 2001/分销商库存信息:LINEAR-TECHNOLOGYLTC3201EMS LTC3201EMS#PBF LTC3201EMS#TR LTC3201EMS#TRPBF。
CD系列芯片资料(全)
CD系列:CD4000 双3输入端或非门+单非门TICD4001 四2输入端或非门HIT/NSC/TI/GOL CD4002 双4输入端或非门NSCCD4006 18位串入/串出移位寄存器NSCCD4007 双互补对加反相器NSCCD4008 4位超前进位全加器NSCCD4009 六反相缓冲/变换器NSCCD4010 六同相缓冲/变换器NSCCD4011 四2输入端与非门HIT/TICD4012 双4输入端与非门NSCCD4013 双主-从D型触发器FSC/NSC/TOS CD4014 8位串入/并入-串出移位寄存器NSC CD4015 双4位串入/并出移位寄存器TICD4016 四传输门FSC/TICD4017 十进制计数/分配器FSC/TI/MOTCD4018 可预制1/N计数器NSC/MOTCD4019 四与或选择器PHICD4020 14级串行二进制计数/分频器FSCCD4021 08位串入/并入-串出移位寄存器PHI/NSCCD4022 八进制计数/分配器NSC/MOTCD4023 三3输入端与非门NSC/MOT/TICD4024 7级二进制串行计数/分频器NSC/MOT/TICD4025 三3输入端或非门NSC/MOT/TICD4026 十进制计数/7段译码器NSC/MOT/TICD4027 双J-K触发器NSC/MOT/TICD4028 BCD码十进制译码器NSC/MOT/TICD4029 可预置可逆计数器NSC/MOT/TICD4030 四异或门NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器NSC/MOT/TICD4032 三串行加法器NSC/TICD4033 十进制计数/7段译码器NSC/TICD4034 8位通用总线寄存器NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存NSC/MOT/TI CD4038 三串行加法器NSC/TICD4040 12级二进制串行计数/分频器NSC/MOT/TICD4041 四同相/反相缓冲器NSC/MOT/TICD4042 四锁存D型触发器NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器NSC/MOT/TICD4048 4输入端可扩展多功能门NSC/HIT/TICD4049 六反相缓冲/变换器NSC/HIT/TICD4050 六同相缓冲/变换器NSC/MOT/TICD4051 八选一模拟开关NSC/MOT/TICD4052 双4选1模拟开关NSC/MOT/TICD4053 三组二路模拟开关NSC/MOT/TICD4054 液晶显示驱动器NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器NSC/HIT/TICD4056 液晶显示驱动器NSC/HIT/TICD4059 “N”分频计数器NSC/TICD4060 14级二进制串行计数/分频器NSC/TI/MOT CD4063 四位数字比较器NSC/HIT/TICD4066 四传输门NSC/TI/MOTCD4067 16选1模拟开关NSC/TICD4068 八输入端与非门/与门NSC/HIT/TICD4069 六反相器NSC/HIT/TICD4070 四异或门NSC/HIT/TICD4071 四2输入端或门NSC/TICD4072 双4输入端或门NSC/TICD4073 三3输入端与门NSC/TICD4075 三3输入端或门NSC/TICD4076 四D寄存器CD4077 四2输入端异或非门HIT CD4078 8输入端或非门/或门CD4081 四2输入端与门NSC/HIT/TI CD4082 双4输入端与门NSC/HIT/TI CD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器NSC/MOT/ST CD4094 8位移位存储总线寄存器NSC/TI/PHI CD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器NSC/MOT/TICD4099 8位可寻址锁存器NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器NSCTICD40107 双2输入端与非缓冲/驱动器HARTI CD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动ST CD40147 10-4线编码器NSCMOTCD40160 可预置BCD加计数器NSCMOTCD40161 可预置4位二进制加计数器NSCMOTCD40162 BCD加法计数器NSCMOTCD40163 4位二进制同步计数器NSCMOTCD40174 六锁存D型触发器NSCTIMOTCD40175 四D型触发器NSCTIMOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSCTI CD40193 可预置4位二进制加/减计数器NSCTICD40194 4位并入/串入-并出/串出移位寄存NSCMOT CD40195 4位并入/串入-并出/串出移位寄存NSCMOTCD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐)CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器。
CD3207中文资料
AI0
7-Bit Transceiver FB2041
B0 35 34 33 32 31 30 29 28 27
52-lead PQFP
The B-port interfaces to “Backplane Transceiver Logic” (See the IEEE 1194.1 BTL standard). BTL features low power consumption by reducing voltage swing (1Vp-p, between 1V and 2V) and reduced capacitive loading by placing an internal series diode on the drivers. BTL also provides incident wave switching, a necessity for high performance backplanes. There are three separate pairs of driver enables in a 1 bit, 3 bit, 3 bit arrangement. The TTL/BTL output drivers for bit 0 are enabled with OEA1/OEB1, output drivers for bits 1–2–3 are enabled with OEA2/OEB2 and output drivers for bits 4–5–6 are enabled with OEA3/OEB3. The A-port operates at TTL levels with separate I/O. The 3-state A-port drivers are enabled when OEAn goes High after an extra 6ns delay which is built in to provide a break-before-make function. When OEAn goes Low, A-port drivers become High impedance without any extra delay. During power on/off cycles, the A-port drivers are held in a High impedance state when VCC is below 2.5V. The B-port has an output enable, OEB0, which affects all seven drivers. When OEB0 is High and OEBn is Low the output driver will be enabled. When OEB0 is Low or if OEBn is High, the B-port drivers will be inactive and at the level of the backplane signal.
MC33201 2 4系列低电压、铁路到铁路操作放大器说明书
MC33201, MC33202,MC33204, NCV33201,NCV33202, NCV33204Low Voltage, Rail-to-Rail Operational AmplifiersThe MC33201/2/4 family of operational amplifiers provide rail −to −rail operation on both the input and output. The inputs can be driven as high as 200mV beyond the supply rails without phase reversal on the outputs, and the output can swing within 50 mV of each rail. This rail −to −rail operation enables the user to make full use of the supply voltage range available. It is designed to work at very low supply voltages (±0.9 V) yet can operate with a supply of up to +12V and ground. Output current boosting techniques provide a high output current capability while keeping the drain current of the amplifier to a minimum. Also, the combination of low noise and distortion with a high slew rate and drive capability make this an ideal amplifier for audio applications.Features•Low V oltage, Single Supply Operation (+1.8 V and Ground to +12 V and Ground)•Input V oltage Range Includes both Supply Rails •Output V oltage Swings within 50 mV of both Rails•No Phase Reversal on the Output for Over −driven Input Signals •High Output Current (I SC = 80 mA, Typ)•Low Supply Current (I D = 0.9 mA, Typ)•600 W Output Drive Capability•Extended Operating Temperature Ranges (−40° to +105°C and −55° to +125°C)•Typical Gain Bandwidth Product = 2.2 MHz•NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC −Q100Qualified and PPAP Capable•These Devices are Pb −Free and are RoHS CompliantSee detailed ordering and shipping information in the package dimensions section on page 10 of this data sheet.ORDERING INFORMATIONPDIP −8P , VP SUFFIX CASE 6261SOIC −8D, VD SUFFIX CASE 751PDIP −14P , VP SUFFIX CASE 646SOIC −14D, VD SUFFIX CASE 751ATSSOP −14DTB SUFFIX CASE 948GMicro8]DM SUFFIX CASE 846ASee general marking information in the device marking section on page 11 of this data sheet.DEVICE MARKING INFORMATION8PIN CONNECTIONSNC InputsV EE NC V CC NCOutput (Top View)MC33201MC33202All Case StylesOutput 1Inputs 1V EECC Inputs 2(Top View)MC33204(Top View)Output 1Inputs 1V CC Output 2Inputs 2EEFigure 1. Circuit Schematic(Each Amplifier)EEThis device contains 70 active transistors (each amplifier).MAXIMUM RATINGSRating Symbol Value Unit Supply Voltage (V CC to V EE)V S+13V Input Differential Voltage Range V IDR Note 1V Common Mode Input Voltage Range (Note 2)V CM V CC +0.5 V toV EE−0.5 VV Output Short Circuit Duration t s Note 3sec Maximum Junction Temperature T J+150°C Storage Temperature T stg−65 to +150°C Maximum Power Dissipation P D Note 3mW DC ELECTRICAL CHARACTERISTICS (T A = 25°C)Characteristic V CC = 2.0 V V CC = 3.3 V V CC = 5.0 V Unit Input Offset VoltageV IO(max)MC33201, NCV33201V MC33202, NCV33202, V MC33204, NCV33204, V ±8.0±10±12±8.0±10±12±6.0±8.0±10mVOutput Voltage SwingV OH (R L = 10 k W) V OL (R L = 10 k W)1.90.103.150.154.850.15V minV maxPower Supply Currentper Amplifier (I D) 1.125 1.125 1.125mA Specifications at V CC = 3.3 V are guaranteed by the 2.0 V and 5.0 V tests. V EE = GND.DC ELECTRICAL CHARACTERISTICS (V CC = +5.0 V, V EE = Ground, T A = 25°C, unless otherwise noted.)Characteristic Figure Symbol Min Typ Max UnitInput Offset Voltage (V CM 0 V to 0.5 V, V CM 1.0 V to 5.0 V) MC33201/NCV33201V:T A = +25°CMC33201:T A = −40° to +105°CMC33201V/NCV33201V:T A = −55° to +125°CMC33202/NCV33202, V:T A = +25°CMC33202/NCV33202:T A = −40° to +105°CMC33202V/NCV33202V:T A = −55° to +125°C (Note 4) MC33204/NCV33204V:T A = +25°CMC33204:T A = −40° to +105°CMC33204V/NCV33204V:T A = −55° to +125°C (Note 4)3⎮V IO⎮−−−−−−−−−−−−−−−−−−6.09.0138.01114101317mVInput Offset Voltage Temperature Coefficient (R S = 50 W) T A = −40° to +105°CT A = −55° to +125°C 4D V IO/D T−−2.02.0−−m V/°CInput Bias Current (V CM = 0 V to 0.5 V, V CM = 1.0 V to 5.0 V) T A = +25°CT A = −40° to +105°CT A = −55° to +125°C 5, 6⎮I IB⎮−−−80100−200250500nAStresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.1.The differential input voltage of each amplifier is limited by two internal parallel back−to−back diodes. For additional differential input voltagerange, use current limiting resistors in series with the input pins.2.The input common mode voltage range is limited by internal diodes connected from the inputs to both supply rails. Therefore, the voltageon either input must not exceed either supply rail by more than 500 mV.3.Power dissipation must be considered to ensure maximum junction temperature (T J) is not exceeded. (See Figure 2)4.All NCV devices are qualified for Automotive use.DC ELECTRICAL CHARACTERISTICS (cont.) (V CC = +5.0 V, V EE = Ground, T A = 25°C, unless otherwise noted.)Characteristic Figure Symbol Min Typ Max UnitInput Offset Current (V CM = 0 V to 0.5 V, V CM = 1.0 V to 5.0 V) T A = +25°CT A = −40° to +105°CT A = −55° to +125°C −⎮I IO⎮−−−5.010−50100200nACommon Mode Input Voltage Range−V ICR V EE−V CC VLarge Signal Voltage Gain (V CC = +5.0 V, V EE = −5.0 V) R L = 10 k WR L = 600 W 7A VOL5025300250−−kV/VOutput Voltage Swing (V ID = ±0.2 V) R L = 10 k WR L = 10 k WR L = 600 WR L = 600 W 8, 9, 10V OHV OLV OHV OL4.85−4.75−4.950.054.850.15−0.15−0.25VCommon Mode Rejection (V in = 0 V to 5.0 V)11CMR6090−dBPower Supply Rejection RatioV CC/V EE = 5.0 V/GND to 3.0 V/GND 12PSRR50025−m V/VOutput Short Circuit Current (Source and Sink)13, 14I SC5080−mAPower Supply Current per Amplifier (V O = 0 V) T A = −40° to +105°CT A = −55° to +125°C 15I D−−0.90.91.1251.125mAAC ELECTRICAL CHARACTERISTICS (V= +5.0 V, V = Ground, T = 25°C, unless otherwise noted.)T A , AMBIENT TEMPERATURE (°C)P E R C E N T A G E OF A M P L I F I E R S (%)TC V IO, INPUT OFFSET VOLTAGE TEMPERATURE COEFFICIENT (m V/°C)3004010A V O L , O P E N L O O P V O L T A G E G A I N (k V /V )Figure 2. Maximum Power Dissipationversus TemperatureFigure 3. Input Offset Voltage DistributionP E R C E N T A G E O F A M P L I F I E R S (%)V IO , INPUT OFFSET VOLTAGE (mV)3015020Figure 4. Input Offset Voltage Temperature Coefficient Distribution 500T A , AMBIENT TEMPERATURE (°C)Figure 5. Input Bias Currentversus TemperatureFigure 6. Input Bias Current versus Common Mode Voltage Figure 7. Open Loop Voltage Gain versusTemperature150500- 50V CM , INPUT COMMON MODE VOLTAGE (V)1500P D (m a x ), M A X I M U M P O W E R D I S S I P A T I O N (m W )T A , AMBIENT TEMPERATURE (°C)I I B , I N P U T B I A S C U R R E N T (n A )5.010I I B , I N P U T B I A S C U R R E N T (n A )100-100-150- 200- 250V O ,O U T P U T V O L T A G E (V )p p V O ,O U T P U T V O L T A G E (V )p p⎮V out ⎮, OUTPUT VOLTAGE (V)f, FREQUENCY (Hz)Figure 8. Output Voltage Swingversus Supply Voltage Figure 9. Output Saturation Voltageversus Load CurrentV I L , LOAD CURRENT (mA)EE Figure 10. Output Voltageversus Frequency V CC ,⎮V EE ⎮ SUPPLY VOLTAGE (V)Figure 11. Common Mode Rejectionversus FrequencyFigure 12. Power Supply Rejectionversus Frequency Figure 13. Output Short Circuit Currentversus Output Voltage1208060f, FREQUENCY (Hz)f, FREQUENCY (Hz)C M R , C O M M O N M ODE R E J E C T I O N (d B )P S R , P O W E R S U P P L Y R E J E C T I O N (d B )10040200S A T , O U T P U T S A T U R A T I O N V O L T A G E (V )I S C , O U T P U T S H O R T C I R C U I T C U R R E N T (m A )101001.0 k 10 k 100 k1.0 M1.02.03.04.05.06.01.0 k100 k 1.0 M10 k 01520±1.0± 2.0105.01001.0 k 10 k 100 k1.0 MCC CC - 0.2 V CC - 0.4 V EE + 0.4 VEE + 0.2 V, E X C E S S P H A S E (D E G R E E S )V CC , ⎮V EE ⎮, SUPPLY VOLTAGE (V)I S C , O U T P U T S H O R T C I R C U I T C U R R E N T (m A )S R , S L E W R A T E (V / s )μT A , AMBIENT TEMPERATURE (°C)Figure 14. Output Short Circuit Currentversus Temperature Figure 15. Supply Current per Amplifierversus Supply Voltage with No LoadI Figure 16. Slew Rate versus Temperature T A , AMBIENT TEMPERATURE (°C)Figure 17. Gain Bandwidth Productversus TemperatureFigure 18. Voltage Gain and Phaseversus Frequency Figure 19. Voltage Gain and Phaseversus Frequencyf, FREQUENCY (Hz)G B W , G A I N B A N D W I D T H P R O D U C T (M H z )A , O P E N L O O P V O L T A G E G A I N (dB )C C , S U P P L Y C U R R E N T P E R A M P L I F I E R (m A )T A , AMBIENT TEMPERATURE (°C)V O L, E X C E S S P H A S E (D E G R E E S )f, FREQUENCY (Hz)O O 70503010- 302.001.50.51.02.01.6070503010-10- 30 1.20.80.410 k 100 k1.0 M10 M10 k100 k1.0 M10 M24040801201602004080120160200240A , O P E N L O O P V O L T A G E G A I N (d B )V O LM , P H A S E M A R G I N (D E G R E E S )i , I N P U T R E F E R R E D N O I S E C U R R E N T (p A H z )n 504030e , E Q U I V A L E N T I N P U T N O I S E V O L T A G E (n V / H z )20100nR T , DIFFERENTIAL SOURCE RESISTANCE (W )C L , CAPACITIVE LOAD (pF)Figure 20. Gain and Phase Marginversus Temperature Figure 21. Gain and Phase Margin versus Differential Source Resistance75600Figure 22. Gain and Phase Marginversus Capacitive Load 70604010T A , AMBIENT TEMPERATURE (°C)Figure 23. Channel Separationversus FrequencyFigure 24. Total Harmonic Distortionversus Frequency Figure 25. Equivalent Input Noise Voltageand Current versus Frequencyf, FREQUENCY (Hz)5015090600C S , C H A N N E L S E P A R A T I O N (d B )30T H D , T O T A L H A R M O N I C D I S T O R T I O N (%)20453015f, FREQUENCY (Hz)f, FREQUENCY (Hz)M , P H A S E M A R G I N (D E G R E E S )30A M , G A I N M A R G I N (d B )A M , G A I N M A R G I N (d B )A M, G A I N M A R G I N (d B )120M , P H A S E M A R G I N (D E G R E E S )O O O 1001.0 k10 k100 k101001.0 k100 k- 55- 40- 25257012585105101010010 k100 k10 k1.0 kDETAILED OPERATING DESCRIPTIONGeneral InformationThe MC33201/2/4 family of operational amplifiers are unique in their ability to swing rail −to −rail on both the input and the output with a completely bipolar design. This offers low noise, high output current capability and a wide common mode input voltage range even with low supply voltages. Operation is guaranteed over an extended temperature range and at supply voltages of 2.0 V , 3.3 V and 5.0V and ground.Since the common mode input voltage range extends from V CC to V EE , it can be operated with either single or split voltage supplies. The MC33201/2/4 are guaranteed not to latch or phase reverse over the entire common mode range,however, the inputs should not be allowed to exceed maximum ratings.Circuit InformationRail −to −rail performance is achieved at the input of the amplifiers by using parallel NPN −PNP differential input stages. When the inputs are within 800 mV of the negative rail, the PNP stage is on. When the inputs are more than 800mV greater than V EE , the NPN stage is on. This switching of input pairs will cause a reversal of input bias currents (see Figure 6). Also, slight differences in offset voltage may be noted between the NPN and PNP pairs. Cross −coupling techniques have been used to keep this change to a minimum.In addition to its rail −to −rail performance, the output stage is current boosted to provide 80 mA of output current,enabling the op amp to drive 600 W loads. Because of this high output current capability, care should be taken not to exceed the 150° C maximum junction temperature.O, O U T P U T V O L T A G E (50 m V /D I V )V t, TIME (10 m s/DIV)Figure 26. Noninverting Amplifier Slew Rate Figure 27. Small Signal Transient Responset, TIME (5.0 m s/DIV)Figure 28. Large Signal Transient ResponseV CC = + 6.0 V V EE = - 6.0 V R L = 600 W C L = 100 pF T A = 25°C O, O U T P U T V O L T A G E (2.0 m V /D I V )V CC = + 6.0 V V EE = - 6.0 V R L = 600 W C L = 100 pF A V = 1.0T A = 25°CV V CC = + 6.0 V V EE = - 6.0 V R L = 600 W C L = 100 pF T A = 25°Ct, TIME (10 m s/DIV)O, O U T P U T V O L T A G E (2.0 V /D I V )V Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self −align when subjected to a solder reflow process.ORDERING INFORMATIONOperational Amplifier Function Device OperatingTemperature RangePackageShipping†Single MC33201DGT A= −40° to +105°CSOIC−8(Pb−Free)98 Units / Rail MC33201DR2G2500 / Tape & Reel MC33201VDGT A = −55° to 125°C98 Units / Rail MC33201VDR2G2500 / Tape & Reel NCV33201VDR2G2500 / Tape & ReelDual MC33202DGT A= −40 ° to +105°CSOIC−8(Pb−Free)98 Units / RailMC33202DR2G2500 / Tape & ReelMC33202DMR2G Micro−8(Pb−Free)4000 / Tape & Reel NCV33202DMR2G*MC33202VDGT A = −55° to 125°CSOIC−8(Pb−Free)98 Units / RailMC33202VDR2G2500 / Tape & Reel NCV33202VDR2G*Quad MC33204DGT A= −40 ° to +105°CSO−14(Pb−Free)55 Units / RailMC33204DR2G2500 Units / Tape & ReelMC33204DTBG TSSOP−14(Pb−Free)96 Units / RailMC33204DTBR2G2500 Units / Tape & ReelMC33204VDGT A = −55° to 125°CSO−14(Pb−Free)55 Units / RailMC33204VDR2G2500 Units / Tape & Reel NCV33204DR2G*NCV33204DTBR2G*TSSOP−14(Pb−Free)2500 Units / Tape & Reel†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.SOIC −8D SUFFIX CASE 751PDIP −8P SUFFIX CASE 626SOIC −8VD SUFFIX CASE 751x = 1 or 2A = Assembly Location WL, L = Wafer Lot YY , Y = YearWW, W = Work Week G = Pb −Free Package G = Pb −Free Package(Note: Microdot may be in either location)PDIP −8VP SUFFIX CASE 626SO −14D SUFFIX CASE 751ATSSOP −14DTB SUFFIX CASE 948GPDIP −14P SUFFIX CASE 646SO −14VD SUFFIX CASE 751A PDIP −14VP SUFFIX CASE 646MARKING DIAGRAMSMicro −8DM SUFFIX CASE 846A 18MC3320xP AWL YYWWG 18MC33202VP AWL YYWWG114MC33204DG AWLYWW114MC33204VDG AWLYWW 114MC33204P AWLYYWWG 114MC33204VP AWLYYWWG 114MC33204ALYW G G**This marking diagram applies to NCV3320xV**This marking diagram applies to NCV33202DMR2G**114MC33204V ALYW G G **PDIP −8P , VP SUFFIX CASE 626−05ISSUE NNOTE 8END VIEWWITH LEADS CONSTRAINEDDIM MIN MAX INCHES A −−−−0.210A10.015−−−−b 0.0140.022C 0.0080.014D 0.3550.400D10.005−−−−e 0.100 BSC E 0.3000.325M−−−−10−−− 5.330.38−−−0.350.560.200.369.0210.160.13−−−2.54 BSC 7.628.26−−−10MIN MAX MILLIMETERSNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCHES.3.DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-AGE SEATED IN JEDEC SEATING PLANE GAUGE GS −3.4.DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH.5.DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C.6.DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED.7.DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY .8.PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS).E10.2400.280 6.107.11b2eB −−−−0.430−−−10.920.060 TYP 1.52 TYP cA20.1150.195 2.92 4.95L 0.1150.150 2.92 3.81°°NOTE 5SOIC −8 NB CASE 751−07ISSUE AKNOTES:1.DIMENSIONING AND TOLERANCING PERANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5.DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.6.751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.DIM AMIN MAX MINMAX INCHES4.805.000.1890.197MILLIMETERS B 3.80 4.000.1500.157C 1.35 1.750.0530.069D 0.330.510.0130.020G 1.27 BSC 0.050 BSC H 0.100.250.0040.010J 0.190.250.0070.010K 0.40 1.270.0160.050M 0 8 0 8 N 0.250.500.0100.020S5.806.200.2280.244MYM0.25 (0.010)YM0.25 (0.010)Z SXS____0.60.024ǒmm inchesǓSCALE 6:1*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*Micro8DM SUFFIX CASE 846A −02ISSUE H8X*For additional information on our Pb −Free strategy and solderingdetails, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.846A-01 OBSOLETE, NEW STANDARD 846A-02.DIM A MIN NOM MAX MIN MILLIMETERS−−−− 1.10−−INCHES A10.050.080.150.002b 0.250.330.400.010c 0.130.180.230.005D 2.90 3.00 3.100.114E 2.903.00 3.100.114e 0.65 BSCL 0.400.550.700.016−−0.0430.0030.0060.0130.0160.0070.0090.1180.1220.1180.1220.026 BSC0.0210.028NOM MAX 4.75 4.90 5.050.1870.1930.199H EPDIP −14CASE 646−06ISSUE RWITH LEADS CONSTRAINEDDIM MIN MAX INCHES A −−−−0.210A10.015−−−−b 0.0140.022C 0.0080.014D 0.7350.775D10.005−−−−e 0.100 BSC E 0.3000.325M−−−−10−−− 5.330.38−−−0.350.560.200.3618.6719.690.13−−−2.54 BSC 7.628.26−−−10MIN MAX MILLIMETERSNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: INCHES.3.DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-AGE SEATED IN JEDEC SEATING PLANE GAUGE GS −3.4.DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE NOT TO EXCEED 0.10 INCH.5.DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR TO DATUM C.6.DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE LEADS UNCONSTRAINED.7.DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE LEADS, WHERE THE LEADS EXIT THE BODY .8.PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE CORNERS).E10.2400.280 6.107.11b2eB −−−−0.430−−−10.920.060 TYP 1.52 TYP cA20.1150.195 2.92 4.95L 0.1150.150 2.92 3.81°°SOIC −14CASE 751A −03ISSUE KNOTES:1.DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.4.DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS.5.MAXIMUM MOLD PROTRUSION 0.15 PERSIDE.DETAIL ADIM MIN MAX MIN MAX INCHESMILLIMETERS D 8.558.750.3370.344E 3.80 4.000.1500.157A 1.35 1.750.0540.068b 0.350.490.0140.019L 0.40 1.250.0160.049e 1.27 BSC 0.050 BSC A30.190.250.0080.010A10.100.250.0040.010M0 7 0 7 H 5.80 6.200.2280.244h 0.250.500.0100.019____14X0.581.27PITCH*For additional information on our Pb −Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.TSSOP −14CASE 948G ISSUE BDIM MIN MAX MIN MAX INCHES MILLIMETERS A 4.90 5.100.1930.200B 4.30 4.500.1690.177C −−− 1.20−−−0.047D 0.050.150.0020.006F 0.500.750.0200.030G 0.65 BSC 0.026 BSC H 0.500.600.0200.024J 0.090.200.0040.008J10.090.160.0040.006K 0.190.300.0070.012K10.190.250.0070.010L 6.40 BSC 0.252 BSC M0 8 0 8 NOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.4.DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION.INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.5.DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08(0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.6.TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY .7.DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W −.____14X REF K14X0.360.65PITCHON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent PUBLICATION ORDERING INFORMATIONMicro8 is a trademark of International Rectifier.Mouser ElectronicsAuthorized DistributorClick to View Pricing, Inventory, Delivery & Lifecycle Information:O N Semiconductor:NCV33202VDR2G NCV33204DR2G NCV33204DTBR2G MC33201DG MC33201DR2G MC33201VDGMC33201VDR2G MC33202DG MC33202DMR2G MC33202DR2G MC33202VDG MC33202VDR2G MC33204DG MC33204DR2G MC33204DTBG MC33204DTBR2G MC33204VDG MC33204VDR2G NCV33201VDR2GSCY33202DR2G SCY33201DR2G。
最新三电系统维修手册专业知识讲座
参数 200V420V DC 13.8V DC 87A 1.2kW 2.5mm² 16mm² 0.75mm²
备注
峰值1.4kW 套橙色波汶管 套黑色波汶管 套黑色波汶管
DC-DC转换器技术规格
文档来源于网络，文档所提供的信息仅供参考之用，不能作为科学依据，请勿模 仿。文档如有不当之处，请联系本人或网站删除。
文档来源于网络，文档所提供的信息仅供参考之用，不能作为科学依据，请勿模 仿。文档如有不当之处，请联系本人或网站删除。
2、充电机维修 3、如以上方法均不能排除故障，建议按以下步骤拆解及更换充电机。 a：在维修须知条件下，按图2-2所示，拔下充电机的三个连接器。 b：按图2-3所示，用套筒（10mm）或开口扳手拆下充电机的四个安装螺栓
b：按图1-3所示，用M10的套筒或开口扳手拆下DC-DC的四个安装螺栓Q1840616。 c：拆下损坏的DC-DC，并将新的DC-DC按以上相反顺序安装，将4个连接器依次安装，确 保锁紧到位。如更换DC-DC仍无法排除故障，请联系厂家售后人员。
文档来源于网络，文档所提供的信息仅供参考之用，不能作为科学依据，请勿模 仿。文档如有不当之处，请联系本人或网站删除。
文档来源于网络，文档所提供的信息仅供参考之用，不能作为科学依据，请勿模 仿。文档如有不当之处，请联系本人或网站删除。
1、DC-DC转换器维修
如以上方法均不能排除故障，建议按以下步骤拆解及更换DC-DC。 a：在维修须知条件下，按图1-2所示，拔下4个连接器。
图1-2 维修步骤1
图1-3 维修步骤2
维修工具：万用表、开口扳手、套筒、举升机。
故障排查
DC-DC在故障模式下会输出故障信号到组合仪表，在组合仪表中显示DCDC的故障信号为 （红色）。按以下步骤排查故障：
Skyworks Solutions SKY77807 四频带LTE电源放大器模块产品概述说明书
PRODUCT SUMMARYSKY77807 Quad-Band Power Amplifier Module for FDD/TDD LTE (Tx Bands 7, 38, 40, 41)Applications•Multi-band 4G handsets •Long Term Evolution (LTE)-Up to 20 MHz bandwidth/ 100resource blocks Features•Envelope Tracking(ET)FDD band•Average Power Tracking (APT) for TDD/FDD bands•50 ohm input/output impedance with internal DC-blocking •Fully programmable Mobile Industry Processor Interface digital control •Continuous bias control for3G/4G PA High Power Mode via MIPI/RFFE interface•Low Supply voltage•Low voltage support (0.6 V) for APT/SMPS applications •Low Leakage current in power-down mode •Temperature Sensor •Integrated TDD TX-Rx switch for single SAW architecture •Low voltage support forAPT/SMPS applications •Small, low profile package-4.0x 3.0x 1.0 (Max.) mm-24-pad configurationDescriptionThe SKY77807Quad-Band Power Amplifier Module (PAM) is a fully matched, 24-pad surface mount module developed for 4G LTE applications. The PAM consists of PA blocks, input and output matching, and a MIPI standard logic control block for multiple power control levels, output input switch control in a single 4.0mm x 3.0mm x 1.0 (Max.)mm package.The SKY77807uses an enhanced architecture to cover multiple bands and meet the spectral linearity requirements of LTE QPSK and 16QAM modulations with up to 20 MHz bandwidth and up to 100 resource block allocations. Output power is controlled by varying the input power and VCC is adjusted using an ET modulator or DCDC converter to maximize efficiency for each power level. Extremely low leakage current maximizes handset standby time.Skyworks Solutions, Inc. • Phone [781] 376-3000 • Fax [781] 376-3100•*********************•203049C• Skyworks Proprietary Information. • Products and product information are subject to change without notice. • January 13, 20141Ordering InformationProduct Name Order Number Evaluation Board Part NumberSKY77807SKY77807© 2013,Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects,errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of stated published specifications or parameters. Skyworks, the Skyworks symbol, and “Breakthrough Simplicity” are trademarks or registered trademarks of Skyworks Solutions, Inc., in the United States and other countries. Third-party brands and names are for identification purposes only, and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.。
珠海市海威尔电器有限公司 DC DC 电源模块说明书
选型表产品特性封装形式：SIP 7工作温度范围：-40℃-105℃ 隔离电压：3000VDC 效率：最高效率可达89% 符合标准：国际标准引脚方式应用领域：电力、工控、通信、物联网、汽车等#每路输出输入特性输出特性纹波噪声20MHz带宽--45100mVp-p 温度漂移系数满载--±0.03--%/℃短路保护可持续，自恢复通用特性物理特性外壳材料黑色阻燃耐热塑料(UL94V-0)封装尺寸19.65*6.00*10.16mm重量 2.4g冷却方式自然空冷EMC特性EMI 传导骚扰CISPR32/EN55032CLASS B（推荐电路见图5）辐射骚扰CISPR32/EN55032CLASS B（推荐电路见图5）EMS静电放电IEC/EN61000-4-2Contact±8KV perf.Criteria B产品特性曲线图+2.0%-5.0%-12%10%20%40%60%80%100%0%-5%-10%+5%+12%输出电压精度输出电流百分比（标称输入电压）.误差包络曲线图（3.3VDC输出）图1Max.Typ.Min.误差包络曲线图（其他输出）+2.5%-2.5%-7.5%10%20%40%60%80%100%+5%0%-5%-10%+10%+15%输出电压精度输出电流百分比（标称输入电压）M a x .T y p .M in .图2外观尺寸/建议印刷版图注：尺寸单位：mm[inch]端子直径公差：±0.10[±0.004]未标注之公差：±0.50[±0.020]引脚功能（单路）功能（双路）1Vin Vin 2GND GND 5-Vo -Vo 6NO PIN COM 7+Vo+VoNC ：不能与任何外部电路链接2]0.1.典型应用若要求进一步减小输入输出纹波，可在输入输出端连接一个电容滤波网络，应用电路如图4所示。
但应注意选用合适的滤波电容。
固纬电子任意波形信号发生器的技术参数和特点说明书
超越传统、创新价值的任意波形信号发生器固纬电子最新推出一款轻巧紧凑的兼具直流电源的任意波信号源模块AFG-22SP。
其与GDS-2000A系列示波器可无缝对接，并可完美嵌入GDS-2000A示波器底座下，使示波器、信号源以及电源三者结合极大节约了实验桌的空间。
AFG-22SP等性能的双通道都具有2SMHz频率带宽（正弦波／方波），l u H z分辨率，内置正强波、方波、脉冲波、三角波以及噪声波。
对于任意波功能，2个通道都提供l20MSa/s采样率，10位分辨率，4k点记录长度，同时内置66种任意波供用户选择。
另外AFG-22SP还提供AM/FM/PM/FSK/SUM/Bust调制，扫频等功能，用于各种通信领域应用。
AFG-22SP的两个通道可以进行独立或关联配置。
提供藕合，跟踪，相位三种运算功能。
另外还提供2.SV/3.3V /SV, 0.6A的直流电源输出，提供简单的供电需求，给用户提供便利。
为了满足不同害户的需求，AFG-125/225系列信号源模块另有单通道以及不带电源输出的机种供选择。
「�l AFC-225P 2SMHz带宽，双通道，任意波形信号发生器（含直流电源输出）AFC-125P 2SMHz带宽，单通道，任意波形信号发生器（含直流电源输出）’， ... ..,>, r仿仰，＼mor.�'\ ＼＇，�·.r.ttnn ；�rlll'111t.r 「i1「1@1.「�1、叭’”’…r.to.r> ·n11v W制巾，向J T、，「画1「�l.τ 言M{:.．．．．．．．． ． ．．．．．．．AFC-225 25 M Hz带宽，双通道，任意波形信号发生器AFC-125 2SMH z带宽，单通道，任意波形信号发生器｜田等能逼迫信号输AFG-22S/22SP特有的等性能双通道信号输出功能，如同将两台性能相同的单通道任意波函数信号发生器一起使用，而不是分为主通道与附属通道，其中附属通道仅提供较少数的功能或规格较差。
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
DBV PACKAGE SOT23 ( 2 3
5
APPLICATIONS
• • • • Portable/Battery-Powered Equipment Post-Regulation for Switching Supplies Noise-Sensitive Circuitry such as VCOs Point of Load Regulation for DSPs, FPGAs, ASICs, and Microprocessors
POWER DISSIPATION RATINGS (1)
BOARD Low-K (2) High-K
(3)
PACKAGE DBV DBV DCQ DRB
RΘJC 64°C/W 64°C/W 15°C/W 1.2°C/W
RΘJA 255°C/W 180°C/W 53°C/W 40°C/W
DERATING FACTOR ABOVE TA = 25°C 3.9mW/°C 5.6mW/°C 18.9mW/°C 25.0mW/°C
Copyright © 2003–2006, Texas Instruments Incorporated
元器件交易网
TPS732xx
SBVS037I – AUGUST 2003 – REVISED MAY 2006
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage. ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
元器件交易网
TPS732xx
SBVS037I – AUGUST 2003 – REVISED MAY 2006
Cap-Free, NMOS, 250mA Low Dropout Regulator with Reverse Current Protection
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under the Electrical Characteristics is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability.
ABSOLUTE MAXIMUM RATINGS
over operating junction temperature range unless otherwise noted (1)
TPS732xx VIN range VEN range VOUT range VNR, VFB range Peak output current Output short-circuit duration Continuous total power dissipation Junction temperature range, TJ Storage temperature range ESD rating, HBM ESD rating, CDM (1) –0.3 to 6.0 –0.3 to 6.0 –0.3 to 5.5 –0.3 to 6.0 Internally limited Indefinite See Dissipation Ratings Table –55 to +150 –65 to +150 2 500 °C °C kV V UNIT V V V V
FEATURES
• • • • • • • • • • • Stable with No Output Capacitor or Any Value or Type of Capacitor Input Voltage Range: 1.7V to 5.5V Ultralow Dropout Voltage: 40mV Typ at 250mA Excellent Load Transient Response—with or without Optional Output Capacitor New NMOS Topology Provides Low Reverse Leakage Current Low Noise: 30µVRMS Typ (10kHz to 100kHz) 0.5% Initial Accuracy 1% Overall Accuracy (Line, Load, and Temperature) Less Than 1µA Max IQ in Shutdown Mode Thermal Shutdown and Specified Min/Max Current Limit Protection Available in Multiple Output Voltage Versions – Fixed Outputs of 1.20V to 5.0V – Adjustable Outputs from 1.20V to 5.5V – Custom Outputs Available
(1) (2) (3)
For the most current specification and package information, refer to the Package Option Addendum located at the end of this datasheet or see the TI website at . Output voltages from 1.2V to 4.5V in 50mV increments are available through the use of innovative factory EEPROM programming; minimum order quantities may apply. Contact factory for details and availability. For fixed 1.2V operation, tie FB to OUT.
ORDERING INFORMATION (1)
PRODUCT TPS732xxyyyz VOUT (2) XX is nominal output voltage (for example, 25 = 2.5V, 01 = Adjustable (3)). YYY is package designator. Z is package quantity.
DESCRIPTION
The TPS732xx family of low-dropout (LDO) voltage regulators uses a new topology: an NMOS pass element in a voltage-follower configuration. This topology is stable using output capacitors with low ESR, and even allows operation without a capacitor. It also provides high reverse blockage (low reverse current) and ground pin current that is nearly constant over all values of output current. The TPS732xx uses an advanced BiCMOS process to yield high precision while delivering very low dropout voltages and low ground pin current. Current consumption, when not enabled, is under 1µA and ideal for portable applications. The extremely low output noise (30µVRMS with 0.1µF CNR) is ideal for powering VCOs. These devices are protected by thermal shutdown and foldback current limit.