39-01-4050;中文规格书,Datasheet资料
39K100资料
Device 39K30 39K50 39K100 39K165 39K200
Notes: 3. Speed bins shown here are for commercial operating range. Please refer to Delta39K ordering information on industrial-range speed bins on page 38. 4. Self-boot solution integrates the boot PROM (flash memory) with Delta39K die inside the same package. This flash memory can endure at least 10,000 programming/erase cycles and can retain data for at least 100 years.
PIM
LB 5 LB 4
Cluster RAM
Channel RAM
LB 2 LB 3
Cluster RAM
PIM
LB 5 LB 4
Cluster RAM
Channel RAM
LB 2 LB 3
Cluster RAM
PIM
LB 5 LB 4
Cluster RAM
Channel RAM
GCLK[3:0] 4 4 4 4
元器件交易网
Delta39K™ ISR™
CPLD Family CPLDs at FPGA Densities™
Features
• High density — 30K to 200K usable gates — 512 to 3072 macrocells — 136 to 428 maximum I/O pins — Twelve dedicated inputs including four clock pins, four global I/O control signal pins and four JTAG interface pins for boundary scan and reconfigurability Embedded memory — 80K to 480K bits embedded SRAM • 16K to 96K bits of (dual-port) channel memory High speed – 233-MHz in-system operation AnyVolt™ interface — 3.3V, 2.5V,1.8V, and 1.5V I/O capability Low-power operation — 0.18-mm six-layer metal SRAM-based logic process — Full-CMOS implementation of product term array — Standby current as low as 5mA • Simple timing model — No penalty for using full 16 product terms/macrocell — No delay for single product term steering or sharing • Flexible clocking — Spread Aware™ PLL drives all four clock networks • Allows 0.6% spread spectrum input clocks • Several multiply, divide and phase shift options — Four synchronous clock networks per device — Locally generated product term clock — Clock polarity control at each register • Carry-chain logic for fast and efficient arithmetic operations • Multiple I/O standards supported — LVCMOS (3.3/3.0/2.5/1.8V), LVTTL, 3.3V PCI, SSTL2 (I-II), SSTL3 (I-II), HSTL (I-IV), and GTL+ • Compatible with NOBL™, ZBT™, and QDR™ SRAMs • Programmable slew rate control on each I/O pin • User-programmable Bus Hold capability on each I/O pin • Fully 3.3V PCI-compliant (to 66-MHz 64-bit PCI spec, rev. 2.2) • CompactPCI hot swap ready • Multiple package/pinout offering across all densities — 208 to 676 pins in PQFP, BGA, and FBGA packages — Simplifies design migration across density — Self-Boot™ solution in BGA and FBGA packages • In-System Reprogrammable™ (ISR™) — JTAG-compliant on-board programming — Design changes do not cause pinout changes • IEEE1149.1 JTAG boundary scan
0436500229;中文规格书,Datasheet资料
This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:43650-0229Status:ActiveOverview:Micro-Fit 3.0™ ConnectorsDescription:3.00mm Pitch Micro-Fit 3.0™ Header, Surface Mount Compatible, Single Row, Vertical,with PCB Polarizing Peg, 2 Circuits, 0.76µm Gold (Au) Selective Plating, Glow Wire CompatibleDocuments:3D ModelTest Summary TS-43045-002 (PDF)Drawing (PDF)RoHS Certificate of Compliance (PDF)Product Specification PS-43650 (PDF)Product Literature (PDF)Agency CertificationCSA LR19980TUV R72081037ULE29179GeneralProduct Family PCB Headers Series43650Application Power, Wire-to-BoardComments"High Temperature|Square Pin|Solder Type<P><P>This Molex product is manufactured from material that has the following ratings, tested by independent agencies:.a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with therequirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire. <P><P> The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s). <P> If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options."OverviewMicro-Fit 3.0™ Connectors Product Literature Order No 987650-5984Product Name Micro-Fit 3.0™UPC800753879140PhysicalBreakawayNo Circuits (Loaded)2Circuits (maximum)2Color - ResinBlack Durability (mating cycles max)30Flammability94V-0Glow-Wire Compliant Yes Lock to Mating Part YesMated Height 17.27mm Material - MetalBrassSeriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHCContains SVHC: No Low-Halogen Status Low-HalogenNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 43650SeriesMates With43645 Micro-Fit 3.0™ Receptacle HousingMaterial - Plating Mating GoldMaterial - Plating Termination TinMaterial - Resin High Temperature ThermoplasticNet Weight0.461/gNumber of Rows1Orientation VerticalPC Tail Length 3.18mmPCB Locator YesPCB Retention NonePCB Thickness - Recommended 1.60mmPackaging Type TrayPitch - Mating Interface 3.00mmPlating min - Mating0.762µmPlating min - Termination 2.540µmPolarized to PCB YesShrouded FullyStackable NoSurface Mount Compatible (SMC)YesTemperature Range - Operating-40°C to +105°CTermination Interface: Style Through HoleElectricalCurrent - Maximum per Contact5AVoltage - Maximum250VSolder Process DataDuration at Max. Process Temperature (seconds)30Lead-free Process Capability SMC & Wave Capable (TH only)Max. Cycles at Max. Process Temperature3Process Temperature max. C260Material InfoReference - Drawing NumbersProduct Specification PS-43650Sales Drawing SD-43650-010Test Summary TS-43045-002This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0436500229。
DMC4050SSD-13;中文规格书,Datasheet资料
40V COMPLEMENTARY PAIR ENHANCEMENT MODE MOSFETProduct SummaryDeviceV (BR)DSSR DS(on) maxI D maxT A = 25°C (Notes 3 & 5)Q1 40V45m Ω @ V GS = 10V5.5A 60m Ω @ V GS = 4.5V 4.2A Q2 -40V45m Ω @ V GS = -10V-5.8A 60m Ω @ V GS = -4.5V -4.2ADescription and ApplicationsThis MOSFET has been designed to ensure that R DS(on) of N and P channel FET are matched to minimize losses in both arms of thebridge. The DMC4040SSD is optimized for use in 3 phases brushless DC motor circuits (BLDC), CCFL backlighting. • 3 phases BLDC motor • CCFL backlightingFeatures and Benefits• Matched N & P R DS(on) - Minimizes power losses • Fast switching – Minimizes switching losses • Dual device – Reduces PCB area• "Green" component and RoHS compliant (Note 1) • Qualified to AEC-Q101 Standards for High ReliabilityMechanical Data• Case: SO-8 • Case Material: Molded Plastic, “Green” Molding Compound. ULFlammability Classification Rating 94V-0 (Note 1) • Moisture Sensitivity: Level 1 per J-STD-020• Terminals: Finish - Matte Tin annealed over Copper lead frame. Solderable per MIL-STD-202, Method 208 •Weight: 0.074 grams (approximate)Ordering Information (Note 1)Product Marking Reel size (inches) Tape width (mm)Quantity per reel DMC4050SSD-13 C4050SD 13 12 2,500Notes: 1. Diodes, Inc. defines “Green” products as those which are RoHS compliant and contain no halogens or antimony compounds; further information about Diodes Inc.’s “Green” Policy can be found on our website. For packaging details, go to our website. Marking InformationSO-8Top ViewTop ViewEquivalent CircuitD1S1G1S2G2D1D2D2= Manufacturer’s MarkingC4050SD = Product Type Marking Code YYWW = Date Code Marking YY = Year (ex: 10 = 2010) WW = Week (01 - 53)Maximum Ratings @T A = 25°C unless otherwise specifiedCharacteristicSymbol N-Channel - Q1 P-Channel - Q2Units Drain-Source Voltage V DSS 40 -40VGate-Source Voltage V GSS ±20 ±20Continuous Drain CurrentV GS = 10V(Notes 3 & 5)I D 5.8 -5.8 A T A = 70°C (Notes 3 & 5) 4.38 -4.52 (Notes 2 & 5) 4.2 -4.2 (Notes 2 & 6) 5.3 -5.3 Pulsed Drain Current V GS = 10V (Notes 4 & 5) I DM 24.1 -24.9 Continuous Source Current (Body diode) (Notes 3 & 5) I S 2.5 -2.5 Pulsed Source Current (Body diode) (Notes 4 & 5)I SM24.1 -24.9Thermal Characteristics @T A = 25°C unless otherwise specifiedCharacteristicSymbolN-Channel - Q1 P-Channel - Q2UnitPower Dissipation Linear Derating Factor(Notes 2 & 5)P D1.25 10 W mW/°C(Notes 2 & 6) 1.8 14.3 (Notes 3 & 5)2.14 17.2 Thermal Resistance, Junction to Ambient (Notes 2 & 5) R θJA 100 °C/W (Notes 2 & 6) 70 (Notes 3 & 5) 58 Thermal Resistance, Junction to Lead(Notes 5 & 7)R θJL 51 Operating and Storage Temperature RangeT J, T STG-55 to +150°CNotes: 2. For a device surface mounted on 25mm x 25mm x 1.6mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions; the device ismeasured when operating in a steady-state condition.3. Same as note (2), except the device is measured at t ≤ 10 sec.4. Same as note (2), except the device is pulsed with D = 0.02 and pulse width 300µs.5. For a dual device with one active die.6. For a device with two active die running at equal power.7. Thermal resistance from junction to solder-point (at the end of the drain lead).Thermal Characteristics0.00.51.01.52.0020406080100110100Derating CurveM a x P o w e r D i s s i p a t i o n (W )Temperature (°C)Transient Thermal ImpedanceT h e r m a l R e s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationM a x i m u m P o w e r (W )Pulse Width (s)Electrical Characteristics N-CHANNEL @T A = 25°C unless otherwise specifiedCharacteristicSymbol Min Typ Max Unit Test ConditionOFF CHARACTERISTICS (Note 8) Drain-Source Breakdown VoltageBV DSS 40 - - VV GS = 0V, I D = 250μA Zero Gate Voltage Drain Current T J = 25°C I DSS - -1.0 μA V DS = 40V, V GS = 0V Gate-Source LeakageI GSS- -±100 nA V GS = ±20V, V DS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold VoltageV GS(th) 0.8 1.3 1.8 VV DS = V GS , I D = 250μA Static Drain-Source On-Resistance R DS (ON) -20 33 4560 m Ω V GS = 10V, I D = 3A V GS = 4.5V, I D = 3AForward Transfer Admittance |Y fs | - 12.6 - SV DS = 5V, I D = 3A Diode Forward Voltage (Note 8) V SD - 0.71.0 V V GS = 0V, I S = 1A DYNAMIC CHARACTERISTICS (Note 9)Input Capacitance C iss- 1790.8 - pF V DS = 20V, V GS = 0V, f = 1.0MHz Output Capacitance C oss- 160.6 - pF Reverse Transfer Capacitance C rss - 120.5 - pF Gate Resistance R g - 1.03 - ΩV DS = 0V, V GS = 0V, f = 1MHz Total Gate Charge Q g- 37.56 - nC V GS = 10V, V DS = 20V, I D = 3A Gate-Source Charge Q gs- 7.8 - nC Gate-Drain Charge Q gd- 6.6 -nC Turn-On Delay Time t D(on) -8.08 - ns V GS = 10V, V DS = 20V, I D = 3A Turn-On Rise Time t r -15.14 - ns Turn-Off Delay Time t D(off) -24.29 - ns Turn-Off Fall Time t f- 5.27 - ns Notes: 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to production testing. Fig. 1 Typical Output Characteristic V , DRAIN-SOURCE VOLTAGE (V)DS I , D R A I N C U R R E N T (A )D Fig. 2 Typical Transfer Characteristic V , GATE-SOURCE VOLTAGE (V)GS I , D R A I N C U R R E N T (A )DFig. 3 Typical On-Resistance vs. Drain Current and Gate VoltageI , DRAIN-SOURCE CURRENT (A)D R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩI , DRAIN CURRENT (A)D Fig. 4 Typical On-Resistance vs. Drain Current and T emperatureR , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 5 On-Resistance Variation with T emperature T , AMBIENT TEMPERATURE (°C)A R , D R A I N -S O U R C EO N -R E S I S T A N C E (N O R M A L I Z E D )D S O NFig. 6 On-Resistance Variation with T emperatureT , AMBIENT TEMPERATURE (°C)A R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S O N ΩT , AMBIENT TEMPERATURE (°C)A V , G A T E T H R E S H O L D V O L T A G E (V )G S (T H)0.20.40.60.8 1.0 1.2V , SOURCE-DRAIN VOLTAGE (V)SD I , S O U R C E C U R R E N T (A )S1001,00010,000Fig. 9 Typical Total CapacitanceV , DRAIN-SOURCE VOLTAGE (V)DS C , C A P A C I T A N C E (p F )Fig. 10 Typical Leakage Currentvs. Drain-Source VoltageV , DRAIN-SOURCE VOLTAGE (V) DS I , L E A K A G E C U R R E N T (n A )D S SFig. 11 Gate-Charge Characteristics Q , TOTAL GATE CHARGE (nC) g V , G A T E -S O U R C E V O L T A G E (V )G St , PULSE DURATION TIME (s)1r (t ), T R A N S I E N T T H E R M A L R E S I S T A N C EElectrical Characteristics P-CHANNEL @T A = 25°C unless otherwise specifiedCharacteristicSymbol Min Typ Max Unit Test ConditionOFF CHARACTERISTICS (Note 8) Drain-Source Breakdown VoltageBV DSS -40 - - VV GS = 0V, I D = -250μA Zero Gate Voltage Drain Current T J = 25°C I DSS - --1.0 μA V DS = -40V, V GS = 0V Gate-Source LeakageI GSS - -±100 nA V GS = ±20V, V DS = 0V ON CHARACTERISTICS (Note 8) Gate Threshold VoltageV GS(th) -0.8 -1.3 -1.8 V V DS = V GS , I D = -250μAStatic Drain-Source On-Resistance R DS (ON) -28 30 4560 m Ω V GS = -10V, I D = -3A V GS = -4.5V, I D = -3AForward Transfer Admittance |Y fs | - 16.6 - S V DS = -5V, I D = -3A Diode Forward Voltage (Note 8) V SD - -0.7-1.0 V V GS = 0V, I S = -1A DYNAMIC CHARACTERISTICS (Note 9)Input Capacitance C iss- 1643.17- pF V DS = -20V, V GS = 0V, f = 1.0MHz Output Capacitance C oss- 179.13 - pF Reverse Transfer Capacitance C rss - 127.82 - pF Gate Resistance R g - 6.43 - ΩV DS = 0V, V GS = 0V, f = 1MHz Total Gate Charge Q g- 33.66 - nC V GS = -10V, V DS = -20V, I D = -3A Gate-Source Charge Q gs- 5.54 - nC Gate-Drain Charge Q gd- 7.30 - nC Turn-On Delay Time t D(on) - 6.85 - ns V GS = -10V, V DS = -20V, I D = -3A Turn-On Rise Time t r - 14.72 - nsTurn-Off Delay Time t D(off) - 53.65 - ns Turn-Off Fall Time t f- 30.86 - ns Notes: 8. Short duration pulse test used to minimize self-heating effect. 9. Guaranteed by design. Not subject to production testing. Fig. 13 Typical Output Characteristic -V , DRAIN-SOURCE VOLTAGE (V)DS -I , D R A I N C U R R E N T (A )D Fig. 14 Typical Transfer Characteristic -V , GATE-SOURCE VOLTAGE (V)GS -I , D R A I N C U R R E N T (A )DFig. 15 Typical On-Resistance vs. Drain Current and Gate Voltage-I , DRAIN-SOURCE CURRENT (A)D 00.010.020.030.040.05R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )Ω-I , DRAIN CURRENT (A)D Fig. 16 Typical On-Resistance vs. Drain Current and T emperatureR , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 17 On-Resistance Variation with Temperature T , AMBIENT TEMPERATURE (°C)A R , D R A I N -S O U R C E O N -R E S I S T A N C E (N O R M A L I Z E D )D S O NFig. 18 On-Resistance Variation with T emperature T , AMBIENT TEMPERATURE (°C)A R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S O N ΩT , AMBIENT TEMPERATURE (°C)A -V , G A T E T H R E S H O L D V O L T A G E (V )G S (T H )-V , SOURCE-DRAIN VOLTAGE (V)SD -I , S O U R C E C U R R E N T (A )SFig. 21 Typical Total Capacitance-V , DRAIN-SOURCE VOLTAGE (V)DS C , C A P A C I T A N C E (p F )Fig. 22 Typical Leakage Currentvs. Drain-Source Voltage-V , DRAIN-SOURCE VOLTAGE (V) DS -I , L E A K A G E C U R R E N T (n A )D S SFig. 23 Gate-Charge CharacteristicsQ , TOTAL GATE CHARGE (nC) g -V , G A T E -S O U R C E V O L T A G E (V )G SFig. 24 Transient Thermal Responset , PULSE DURATION TIME (s)1r (t ), T R A N S I E N T T H E R M A L R E S I S T A N C EPackage Outline DimensionsSuggested Pad LayoutSO-8Dim Min Max A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h - 0.35 L 0.62 0.82θ0° 8° All Dimensions in mmDimensionsValue (in mm)X 0.60 Y1.55 C15.4 C2 1.27Gauge Plane Seating PlaneDetail ‘A’XC2Y分销商库存信息: DIODESDMC4050SSD-13。
N50P111;中文规格书,Datasheet资料
DatasheetEasyPoint TMN50P111Navigation Module1 General DescriptionEasyPoint™ N50P111 is a miniature joystick module concept based on contact-less, magnetic movement detection. The integrated two-dimensional linear encoder monitors the movement of the magnet incorporated in the knob and provides directly the x and ycoordinates via I²C output. An integrated mechanical push button built in the module provides a “select” function.Figure 1. N50P111-xxxxx-H2 Key FeaturesXY coordinates direct read with 8-bit resolution 2.7V to 3.6V operating voltage Down to 1.7V I/O voltageLateral magnet movement radius up to 2.0mm High-speed I²C interfaceConfigurable interrupt output for motion detection Push button feature3 ApplicationsThe EasyPoint™ N50P111 is ideal for small form-factor manual input devices in battery operated equipment, such as Mobile phones, MP3 players, PDAs, GPS receivers, Gaming consoles and Analog joystick replacement.4 BenefitsHigh reliability due to magnetic non-contact sensing Low power consumption Two operating modes-Idle mode-Low Power modeN50P111Push button GNDI²C AddressGND: 0x40VDDp: 0x41AS5013Two-dimensional magnetic encoderContents1 General Description (1)2 Key Features (1)3 Applications (1)4 Benefits (1)5 Pin Assignments (4)5.1 Pin Descriptions (4)6 Absolute Maximum Ratings (5)7 Electrical Characteristics (6)7.1 Operating Conditions (6)7.2 Digital IO Pads DC/AC Characteristics (6)7.3 Switch Characteristics (7)7.4 Mechanical Specifications (8)7.5 Recommended Reflow Temperature Profile (8)8 Using the N50P111 Module (9)8.1 Powering up the Module (9)8.2 Registers Initialization (9)8.3 C Source Code Example (10)8.3.1 Initialization (10)8.3.2 Offset Calibration (10)8.3.3 Dead Zone area (11)8.3.4 Interrupt Routine (11)9 XY Coordinates Interpretation (12)9.1 EasyPoint Operating Principle (12)9.1.1 Knob Displacement and Register Value Relation (13)9.2 Operation Principle (14)10 I²C interface (15)10.1 Interface Operation (15)10.2 I²C Electrical Specification (16)10.3 I²C Timing (17)10.4 I²C Modes (18)10.4.1 Automatic Increment of Address Pointer (18)10.4.2 Invalid Addresses (18)10.4.3 Reading (18)10.4.4 Writing (18)10.4.5 High Speed Mode (21)10.4.6 Automatic Increment of Address Pointer (22)10.4.7 Invalid Addresses (22)10.5 SDA, SCL Input Filters (22)11 I²C Registers (23)11.1 Control Register 1 (0Fh) (23)11.2 X Register (10h) (25)11.3 Y_res_int Register (11h) (25)11.4 Xp Register (12h) (25)11.5 Xn Register (13h) (25)11.6 Yp Register (14h) (26)11.7 Yn Register (15h) (26)11.8 M_ctrl Register (2Bh) (26)11.9 J_ctrl Register (2Ch) (27)11.10 T_ctrl Register (2Dh) (27)11.11 Control Register 2 (2Eh) (27)11.12 Registers Table (28)12 Package Drawings and Markings (30)Datasheet - P i n A s s i g n m e n t s5 Pin Assignments5.1 Pin DescriptionsTable 1. Pin DescriptionsConnector Pin #Pin Type Description 1Power VDDp: IO power supply for SCL, SDA, INTn, 1.7V ~ 3.6V2Power VDD: Core power supply, 2.7V ~ 3.6V3Power GND4Bi-directional SDA: I²C bus data, open drain5Input SCL: I²C bus clock6Input RESETn: Reset input, active LOW0: GND → Reset, all registers return to their reset value 1: VDDp → Normal operation mode7Open drain INTn: Interrupt output, open drain: Active: LOWInactive: Hi-Z8Output SWITCHn: Push button signal output: Not pushed: OpenPushed: GND9Input ADDR: I²C Address selection input:0: GND → 0x401: VDDp → 0x411234J1VDDVDDpSCLSDAGNDDatasheet - A b s o lu t e M a x im u m R a ti n g s6 Absolute Maximum RatingsStresses beyond those listed in Table 2 may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in Electrical Characteristics on page 6 is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Table 2. Absolute Maximum RatingsSymbol Parameter Min Max Units NotesV DD DC supply voltage-0.35VVDDp Peripheral supply voltage-0.35VDD + 0.3V SCL, SDA, RESETn, ADDRV IN Input pin voltage -0.3VDDp + 0.3VSCL, SDA, RESETn, ADDR - 3.6VI SCR Input current (latchup immunity)-100100mA Norm: JEDEC 78ESD Electrostatic discharge-±2kV All pins, Norm: MIL 883 E method 3015 T Strg Storage temperature-4085ºCHumidity non-condensing585%Degrees of protection IP5X Norm: IEC 605297 Electrical Characteristics7.1 Operating ConditionsT AMB = -20 to +70ºC, VDD = 3.3V 7.2 Digital IO Pads DC/AC CharacteristicsTable 3. Operating Conditions Symbol ParameterMin TypMax Units NotesVDDCore Supply voltage2.73.6VVDDp Peripheral Supply voltage 1.7VDD VInput: RESETnOpen drain outputs: SCL, SDA, INTn.External I²C pull up resistor to be connected to VDDp.IDD SMaximal average current consumption on VDD,Pulsed peaks = IDD fdepends on the sampling time ts[ms]3+3760/ts [ms]µAT AMB = -20 to +50 ºC10+3760/ts [ms]T AMB = 50 to +70 ºC IDD I Current consumption on core supply, Idle mode,no readout (ts = infinite)3µAT AMB = -20 to +50 ºC10T AMB = 50 to +70 ºC IDD f Current consumption on core supply,Full Power mode 10mA Continuous current pin VDD Maximum sampling ts = 450µs Tpua Power up time analog 1000µs Step on VDD to Data_Ready Tconv Conversion time 450µs Read X/Y coordinate I²C STOP condition to Data_Readyt P,W Nominal wakeup time 20320ms T AMBAmbient temperature range -20+70ºCResolution of XY displacement8Over 2*dx and 2*dy axisTable 4. Digital IO Pads DC/AC Characteristics Symbol ParameterMinMaxUnitsNotesInputs: SCL, SDAV IH High level input voltage 0.7 * VDDpV I²C V IL Low level input voltage 0.3 * VDDpV I²C I LEAK Input leakage current 1µA VDDp = 3.6V Inputs: ADDR, RESETn (JEDEC76)V IH High level input voltage 0.65 * VDDpV JEDEC V IL Low level input voltage 0.35 * VDDpV JEDEC I LEAK Input leakage current1µAVDDp = 3.6VOutputs: SDAV OHHigh level output voltageOpen drainLeakage current 1µA High level outputvoltage7.3 Switch CharacteristicsV OL1Low level output voltageVSS + 0.4V-6mA; VDDP > 2V;fast mode V OL3VDDP * 0.2V-6mA; VDDP ≤ 2V;fast mode V OL1VSS + 0.4V-3mA; VDDP > 2V;high speed V OL3VDDP * 0.2V -3mA; VDDP ≤ 2V;high speed C L Capacitive load 400pF standard mode ( 100 kHz )400pF fast mode ( 400 kHz )100pFhigh speed mode ( 3.4 MHz )Outputs: INTn (JEDEC76)V OH High level output voltage Open drain1µA Leakage current High level output voltageV OL Low level output voltageVSS + 0.2V -100µA VSS + 0.45-2mA C LCapacitive load30pFstandard mode ( 100 kHz )Table 5. Switch CharacteristicsParameterMinMax Units Notes Contact resistance of dome switch 750m ΩNorm: EIA-364-23Dielectric withstanding voltage100Vac Norm: EIA-364-20Insulation resistance 100m ΩNorm: EIA-364-21, 100VdcBouncing (On/Off)5msRate: 2 times/sec.Table 4. Digital IO Pads DC/AC Characteristics Symbol ParameterMinMax Units Notes7.4 Mechanical Specifications7.5 Recommended Reflow Temperature ProfileTable 6. Mechanical SpecificationsParameter Note Number of operating shaftsSingle shaft Shaft material LCP Housing material LCP & PA46Shell material Stainless Steel or Copper alloyTravel (XY operation)±2.00mm (±10%)Travel (Z push operation)0.22mm (±0.05mm)Directional operating force (XY direction)0.70N (±0.15N)Push operating force (Z direction)1.80N (±15%)Vibration10-500-10Hz 15 minutes, 12 cycles, 3 axes (total 36 cycles)Operating life – XY direction Each direction > 1 million cyclesOperating life – Push Z direction > 1 million cyclesShaft strength (XYZ direction)> 3.5 kgfFree fall Dispensing Glue40 drops(2X6 sides + 1X12 edges + 2X8 corners) @ 1.5m drop height to concrete surface, module is assembled to phone mechanics.Over forceDispensing Glue 1.5kgf > 100k cycles8 Using the N50P111 Module8.1 Powering up the ModuleThe N50P111 module has a Power ON Reset (POR) cell to monitor the VDD voltage at startup and reset all the internal registers. After the internal reset is completed, the POR cell is disabled in order to save current during normal operation.If VDD drops below 2.7V down to 0.2V, the POR cell will not be enabled back, and the registers will not be correctly reseted or can get random values.Note:It is highly recommended to control the external RESETn signal by applying a LOW pulse of >100ns once VDD has reached 2.7V and VDDp reached 1.7V.8.2 Registers InitializationAfter Power Up, the following sequence must be performed:1. VDD and VDDp Power up, and reached their nominal values (VDD>2.7V, VDDp>1.7V).2. Initialization:a. RESETn pulse LOW during >100ns, then RESETn HIGHb. Loop check register [0Fh] until the value F0h or F1h is present (reset finished, registers to default values)c. Write value 16h into register [2Dh]3. Perform an Offset Calibration (X and Y coordinate compensation for zero position)4. Configure the Dead Zone Area for Wake-up function (if needed)5. Configure the wanted Power Mode and INT function into register [0Fh] (Idle mode / Low Power Mode with Timebase configuration, INTfor Wake-up or Coordinates ready)6. X Y coordinates are ready to be read.8.3 C Source Code Example8.3.1 Initializationvoid EasyPoint_init (void){unsigned char Reset_status = 0;RESETn = 0;Delay_ms(1);// RESETn pulse after power upRESETn = 1; Delay_ms(1);while (Reset_status != 0xF0)// Check the reset has been done{Reset_status = I2C_Read8(0x40, 0x0F) & 0xFE;}I2C_Write8(0x40, 0x2E, 0x16); // Scaling factor for N50 (2.0mm knob travel) }8.3.2 Offset Calibrationvoid Offset_Calibrate (void){char i;int x_cal=0, y_cal=0;EA = 0;// Disable the MCU interruptsI2C_Write8(0x40, 0x0F, 0x00);// Low Power Mode 20msDelay_ms(1);I2C_Read8(0x40, 0x11); // Flush an unused Y_reg to reset the interruptfor (i=0; i<16; i++)// Read 16 times the coordinates and then average{while (INTn);// Wait until next interrupt (new coordinates)x_cal += (signed char) I2C_Read8(0x40, 0x10); // Read X positiony_cal += (signed char) I2C_Read8(0x40, 0x11); // Read Y position }// offset_X and offset_Y are global variables, used for each coordinate readout in the interrupt routineoffset_X = -(x_cal>>4); // Average X: divide by 16offset_Y = -(y_cal>>4); // Average Y: divide by 16EA = 1; // Enable the MCU interrupts}分销商库存信息: AMSN50P111。
BD3931FP中文资料
Japan / (Internal Sales)
Tokyo Yokohama Nagoya Kyoto 2-1-1, Yaesu, Chuo-ku, Tokyo 104-0082 TEL : +81(3)5203-0321 FAX : +81(3)5203-0300 2-4-8, Shin Yokohama, Kohoku-ku, Yokohama, Kanagawa 222-8575 TEL : +81(45)476-2131 FAX : +81(45)476-2128 Dainagayo Building 9F 3-28-12, Meieki, Nakamura-ku, Nagoya,Aichi 450-0002 TEL : +81(52)581-8521 FAX : +81(52)561-2173 579-32 Higashi Shiokouji-cho, Karasuma Nishi-iru, Shiokoujidori, Shimogyo-ku, Kyoto 600-8216 TEL : +81(75)311-2121 FAX : +81(75)314-6559 TEL : +81(45)476-9270 FAX : +81(045)476-9271
(Contact address for overseas customers in Japan)
Yokohama
As of 0)1 56 97 30 60 FAX : +33(0) 1 56 97 30 80 TEL : +852(2)740-6262 TEL : +86(21)6279-2727 TEL : +86(411)8230-8549 TEL : +86(10)8525-2483 TEL : +866(2)2500-6956 TEL : +82(2)8182-700 TEL : +65-6332-2322 TEL : +60(3)7958-8355 TEL : +63(2)807-6872 TEL : +66(2)254-4890 FAX : +852(2)375-8971 FAX : +86(21)6247-2066 FAX : +86(411)8230-8537 FAX : +86(10)8525-2489 FAX : +866(2)2503-2869 FAX : +82(2)8182-715 FAX : +65-6332-5662 FAX : +60(3)7958-8377 FAX : +63(2)809-1422 FAX : +66(2)256-6334
0190990008;中文规格书,Datasheet资料
This document was generated on 08/10/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:19099-0008Status:ActiveOverview:Ring Tongue - Spade TerminalsDescription:InsulKrimp™ Snap Spade for 18-22 AWG Wire, Stud Size 5 (M3), Mylar Tape CarrierDocuments:Drawing (PDF)Product Specification PS-19902-011 (PDF)Product Specification PS-19902-009 (PDF)RoHS Certificate of Compliance (PDF)Agency CertificationCSA LR18689ULE32244GeneralProduct Family Ring and Spade Terminals Series19099Crimp Quality Equipment Yes Mil-Spec N/AOverviewRing Tongue - Spade Terminals Product Name InsulKrimp™Type Spade Snap UPC800753088771PhysicalBarrel Type Closed Color - Resin Natural Flammability 94V-0InsulationPVC Material - Plating Mating Tin Net Weight0.578/gPackaging Type Adhesive Tape on Reel Stud Size5 (M3)Wire Insulation Diameter 4.40mm max.Wire Size AWG 18, 20, 22Wire Size mm²0.25 - 1.50Material InfoOld Part NumberAA-2704-05XTReference - Drawing NumbersProduct Specification PS-19902-009, PS-19902-011Sales DrawingAACD20502Seriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHC Not ReviewedLow-Halogen Status Not ReviewedNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 19099SeriesApplication Tooling | FAQTooling specifications and manuals are found by selecting the products below.Crimp Height Specifications are then contained in the Application Tooling Specification document.GlobalDescription Product #Crimp Dies for MTA-100 Tape Applicator used in 3BF Press, MTA-105Tape Applicator used in TM-2000™ Press,and ATP-301 Air Crimping Press for Mylar Tape Mounted Terminals 0192880023Mini-Mac™Applicator0638851300This document was generated on 08/10/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0190990008。
0449150002;中文规格书,Datasheet资料
This document was generated on 09/20/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:44915-0002Status:ActiveOverview:Modular Plugs - JacksDescription:Modular Plug, Category 6, Long Body, Unshielded, 8/8Documents:Drawing (PDF)RoHS Certificate of Compliance (PDF)Product Specification PS-44915-003 (PDF)Agency CertificationULE107635GeneralProduct Family Modular Jacks/Plugs Series44915Component Type Wire Plug Magnetic NoOverviewModular Plugs - Jacks Performance Category 6Power over Ethernet (PoE)N/A Product Name RJ45UPC800756395548PhysicalColor - ResinClear Durability (mating cycles max)500Inverted / Top Latch N/A Jack HeightN/A Lightpipes/LEDs NoneMaterial - MetalPhosphor Bronze Material - Plating MatingGold Material - Plating Termination TinMaterial - Resin Polycarbonate Net Weight 1.504/g Orientation N/A PCB Locator No PCB Retention None Packaging Type Bag Panel MountN/A Pitch - Mating Interface1.02mm Pitch - Termination Interface 1.27mm Ports1Positions / Loaded Contacts 8/8Temperature Range - Operating -40°C to +85°C Termination Interface: Style N/A Wire/Cable TypeRound ElectricalCurrent - Maximum per Contact1.5A Grounding to Panel N/A ShieldedNo Voltage - Maximum125VMaterial InfoReference - Drawing NumbersProduct SpecificationPS-44915-003Seriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHC Not ReviewedLow-Halogen Status Not ReviewedNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 44915Series Mates With FCC 68 JacksApplication Tooling | FAQTooling specifications and manuals are found by selecting the products below.Crimp Height Specifications are then contained in the Application Tooling Specification document.GlobalDescription Product #ServiceGrade™Hand Crimp Tool -Ratchet0640160044Hand Crimp Tool 0622020500Sales Drawing SD-44915-001This document was generated on 09/20/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0449150002。
JM4050ABFA中文资料
Original Creation Date: 07/27/99Last Update Date: 10/18/99Last Major Revision Date: 09/21/99MJCD4050A-X REV 1A0MICROCIRCUIT DATA SHEETNON-INVERTING HEX BUFFERGeneral DescriptionThis hex buffer is a monolithic complementary MOS (CMOS) integrated circuit constructed with N- and P- channel enhancement mode transistors. This device features logic level conversion using only one supply voltage (VDD). The input signal high level (VIH) canexceed the VDD supply voltage when the device is used for logic conversion. The device is intended for use as a hex buffer, CMOS to DTL/TTL converter or as a CMOS current driver,and at VDD = 5.0V, it can drive two DTL/TTL loads over the full operating temperature range.NS Part NumbersJM4050ABEA JM4050ABFAIndustry Part NumberCD4050APrime DieCD4050AControlling Document38510/05504, amend. #3ProcessingMIL-STD-883, Method 5004Quality Conformance InspectionMIL-STD-883, Method 5005Subgrp Description Temp ( C)o 1Static tests at +252Static tests at +1253Static tests at -554Dynamic tests at +255Dynamic tests at +1256Dynamic tests at -557Functional tests at +258A Functional tests at +1258B Functional tests at -559Switching tests at +2510Switching tests at +12511Switching tests at-55MICROCIRCUIT DATA SHEET MJCD4050A-X REV 1A0(Absolute Maximum Ratings)(Note 1, 2)Voltage at Any Pin-0.5V to Vdd +0.5VPower Dissipation (Pd)200mWVdd Range-0.5V to +15.5VStorage Temperature (Ts)-65C to +150CLead Temperature(Soldering, 10 seconds)300CInput Current (each input)+ 10mAThermal Resistance, junction to caseSee MIL-STD-1835Maximum Junction Temperature (Tj max)175CNote 1:"Absolute Maximum Ratings" are those values beyond which the safety of the device cannot be guaranteed. Except for "Operating Temperature Range" they are not meant toimply that the device should be operated at these limits. The table of "ElectricalCharacteristics" provides conditions for actual device operation.Note 2:All voltages measured with respect to Vss unless otherwise specified.Recommended Operating ConditionsSupply Voltage (VDD)4.5V to 12.5VOperating Temperature Range-55C to +125CInput Low Voltage Range (VIL)VDD=5.0V0V to 0.85VVDD=12.5V0V to 2.1VInput High Voltage Range (VIH)VDD=5.0V3.95V to 5.0VVDD=12.5V10.0V to 12.5VMJCD4050A-X REV 1A0MICROCIRCUIT DATA SHEETElectrical CharacteristicsDC PARAMETERSSYMBOL PARAMETER CONDITIONS NOTES PIN-NAME MIN MAX UNITSUB-GROUPSVic-Input ClampingVoltage(negative)VDD=0.0V, VSS=Gnd, IIN=-1mA (otherinputs open)5, 6INPUTS-6.0V1IIH Input HighCurrent VDD=15.0V, VIN=15.0V(each input measured separately)3, 4INPUTS100.0nA1, 2IIL Input Low Current VDD=15.0V, VIN=0.0V(each input measured separately)3, 4INPUTS-100.0nA1, 2ISS Power SupplyCurrent VDD=15.0V, VIN=15.0V or VIN=0.0V,VM=0.0V3, 4VSS-75.0nA13, 4VSS-750.0nA2 VDD=15.0V, VIN=0.0V, VM=0.0V3, 4VSS-75.0nA13, 4VSS-750.0nA2VOH1Output HighVoltage VDD=4.5V, VIH=3.8V, IOH=-0.10mA1, 2OUTPUTS 2.5V1 VDD=4.5V, VIH=3.6V, IOH=-0.10mA1, 2OUTPUTS 2.5V2 VDD=4.5V, VIH=3.95V, IOH=-0.10mA1, 2OUTPUTS 2.5V3VOH2Output HighVoltage VDD=5.0V, VIH=3.8V, IOH=-0.45mA1, 2OUTPUTS 4.5V1 VDD=5.0V, VIH=3.6V, IOH=-0.35mA1, 2OUTPUTS 4.5V2 VDD=5.0V, VIH=3.95V, IOH=-0.65mA1, 2OUTPUTS 4.5V3VOH3Output HighVoltage VDD=5.0V, VIH=3.8V, IOH=-0.0mA1, 2OUTPUTS 4.95V1 VDD=5.0V, VIH=3.6V, IOH=-0.0mA1, 2OUTPUTS 4.95V2 VDD=5.0V, VIH=3.95V, IOH=-0.0mA1, 2OUTPUTS 4.95V3VOH4Output HighVoltage VDD=12.5V, VIH=9.5V, IOH=-0.0mA1, 2OUTPUTS11.25V1 VDD=12.5V, VIH=9.25V, IOH=-0.0mA1, 2OUTPUTS11.25V2 VDD=12.5V, VIH=9.75V, IOH=-0.0mA1, 2OUTPUTS11.25V3VOL1Output LowVoltage VDD=5.5V, VIL=1.1V, IOL=0.23mA1, 2OUTPUTS0.5V1 VDD=5.5V, VIL=0.85V, IOL=0.23mA1, 2OUTPUTS0.5V2 VDD=5.5V, VIL=1.35V, IOL=0.23mA1, 2OUTPUTS0.5V3VOL2Output LowVoltage VDD=5.0V, VIL=1.1V, IOL=3.0mA1, 2OUTPUTS0.5V1 VDD=5.0V, VIL=0.85V, IOL=2.10mA1, 2OUTPUTS0.5V2 VDD=5.0V, VIL=1.35V, IOL=3.70mA1, 2OUTPUTS0.5V3VOL3Output LowVoltage VDD=5.0V, VIL=1.1V, IOL=0.0mA1, 2OUTPUTS0.05V1 VDD=5.0V, VIL=0.85V, IOL=0.0mA1, 2OUTPUTS0.05V2 VDD=5.0V, VIL=1.35V, IOL=0.0mA1, 2OUTPUTS0.05V3MJCD4050A-X REV 1A0MICROCIRCUIT DATA SHEETElectrical CharacteristicsDC PARAMETERS(Continued)SYMBOL PARAMETER CONDITIONS NOTES PIN-NAME MIN MAX UNITSUB-GROUPSVOL4Output LowVoltage VDD=12.5V, VIL=2.8V, IOL=0.0mA1, 2OUTPUTS 1.25V1 VDD=12.5V, VIL=2.55V, IOL=0.0mA1, 2OUTPUTS 1.25V2 VDD=12.5V, VIL=3.05V, IOL=0.0mA1, 2OUTPUTS 1.25V3AC PARAMETERS(The following conditions apply to all the following parameters, unless otherwise specified.) AC:VDD=5.0V, CL=50pF, RL=200K Ohms to ground, Tr/Tf=10nStpHL Propagation DelayTime 7, 8In toOn6150nS9, 117, 8In toOn9225nS10tpLH Propagation DelayTime 7, 8In toOn6230nS9, 117, 8In toOn9345nS10tTHL Transition Time7, 8On670nS9, 117, 8On9105nS10 tTLH Transition Time7, 8On6270nS9, 117, 8On9405nS10 Cin Input Capacitance VDD=Gnd, f=1MHz10INPUTS12pF4DC PARAMETERS: DRIFT VALUES(The following conditions apply to all the following parameters, unless otherwise specified.)DC:Delta calculations performed at production burn-in and Group C (operational life test).ISS Power SupplyCurrent VDD=15.0V, VIN=15.0V or VIN=0.0V,VM=0.0V12VSS-20.020.0nA1 VDD=15.0V, VIN=0.0V, VM=0.0V12VSS-20.020.0nA1VOL1Output LowVoltageVDD=5.5V, VIL=1.1V, IOL=0.23ma12OUTPUTS-0.040.04V1VOH1Output HighVoltageVDD=4.5V, VIL=3.8V, IOH=-0.10ma12OUTPUTS-0.080.08V1Note 1:Screen tested 100% on each device at +25C, +125C and -55C temperature, subgroups A1,2 and 3.Note 2:Sample tested (Method 5005, Table 1) on each MFG. lot at +25C, +125C and -55Ctemperature, subgroups A1, 2 and 3.Note 3:Screen tested 100% on each device at +25C and +125C temperature only, subgroup A1 and2.Note 4:Sample tested (Method 5005, Table 1) on each MFG. lot at +25C and +125C temperature only, subgroup A1 and 2.Note 5:Screen tested 100% on each device at +25C temperature only, subgroup A1.Note 6:Sample tested (Method 5005, Table 1) on each MFG. lot at +25C temperature only,subgroup A1.Note 7:Screen tested 100% on each device at +25C temperature only, subgroup A9.MJCD4050A-X REV 1A0MICROCIRCUIT DATA SHEET(Continued)Note 8:Sample tested (Method 5005, Table 1) on each MFG. lot at +25C, +125C and -55Ctemperature, subgroups A9, 10 and 11.Note 9:VIL, VIH, IOL and IOH are guaranteed by applying specified conditions and testing VOL and VOH.Note 10:Guaranteed parameter. This test is only performed during qualification.Note 11:Guaranteed parameter, not tested.Note 12:Drift values need not be calculated if post burn-in electrical test is performed within 24 hours after burn-in.MICROCIRCUIT DATA SHEET MJCD4050A-X REV 1A0Revision HistoryRev ECN #Rel Date Originator Changes1A0M000356810/18/99Donald B. Miller Initial MDS release.。
0444280403;中文规格书,Datasheet资料
This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:44428-0403Status:ActiveOverview:Micro-Fit 3.0™ ConnectorsDescription:3.00mm Pitch Micro-Fit 3.0 BMI™ Header, Surface Mount Compatible, Dual Row, Right Angle, with Snap-in Plastic Peg PCB Lock, 4 Circuits, 0.76µm Gold (Au) Selective PlatingDocuments:3D ModelRoHS Certificate of Compliance (PDF)Drawing (PDF)Product Literature (PDF)Product Specification PS-44300-001 (PDF)Agency CertificationCSA LR19980TUV R72081037ULE29179GeneralProduct Family PCB Headers Series44428Application Board-to-Board, Power, Wire-to-BoardCommentsHigh Temperature|Square Pin|Solder Type|Polarized to Mating PartOverviewMicro-Fit 3.0™ Connectors Product Literature Order No 987650-5984Product Name Micro-Fit 3.0 BMI™UPC800756379944PhysicalBreakawayNo Circuits (Loaded)4Circuits (maximum)4Color - ResinBlack Durability (mating cycles max)30First Mate / Last Break No Flammability94V-0Glow-Wire Compliant No Guide to Mating Part No Keying to Mating Part None Lock to Mating Part Yes Material - MetalBrass Material - Plating MatingGold Material - Plating Termination TinMaterial - Resin High Temperature Thermoplastic Net Weight1.394/g Number of Rows 2Orientation Right Angle PC Tail Length 3.50mm PCB Locator Yes PCB RetentionYes PCB Thickness - Recommended 1.60mm Packaging TypeTray Pitch - Mating Interface 3.00mm Plating min - Mating0.762µm Plating min - Termination 2.540µm Polarized to PCBYesSeriesimage - Reference onlyEU RoHSChina RoHSELV and RoHS Compliant REACH SVHCContains SVHC: No Low-Halogen Status Not Low-HalogenNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 44428SeriesMates With44133 , 44764 , 44769Shrouded FullyStackable NoSurface Mount Compatible (SMC)YesTemperature Range - Operating-40°C to +105°CTermination Interface: Style Through HoleElectricalCurrent - Maximum per Contact5AVoltage - Maximum250VSolder Process DataDuration at Max. Process Temperature (seconds)5Lead-free Process Capability Wave Capable (TH only)Max. Cycles at Max. Process Temperature1Process Temperature max. C260Material InfoReference - Drawing NumbersProduct Specification PS-44300-001, RPS-44300-001Sales Drawing SD-44428-001This document was generated on 08/20/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0444280403。
0449140602;中文规格书,Datasheet资料
This document was generated on 09/04/2012PLEASE CHECK FOR LATEST PART INFORMATIONPart Number:44914-0602Status:ActiveOverview:Micro-Fit 3.0™ ConnectorsDescription:3.00mm Pitch Micro-Fit 3.0 CPI™ Header, Dual Row, Vertical, Compliant Pin Interface,6 Circuits, LCP, Glass-Filled, UL 94V-0, 0.38µm Gold (Au) Selective Contact Plating,Tin/Lead (Sn/Pb) Plated Tails, Glow Wire CompatibleDocuments:3D ModelRoHS Certificate of Compliance (PDF)Drawing (PDF)Product Literature (PDF)Product Specification PS-43045 (PDF)Agency CertificationCSA LR19980TUV R72081037ULE29179GeneralProduct Family PCB Headers Series44914ApplicationPower, Wire-to-Board Application Tooling Part Link 622008400Application Tooling Part Link 622030455Comments"High Temperature|Square Pin<P><P>This Molex product is manufactured from material that has the following ratings, tested by independent agencies:.a) A Glow Wire Ignition Temperature (GWIT) of at least 775 deg C per IEC 60695-2-13.. b) A Glow Wire Flammability Index (GWFI) above 850 deg C per IEC 60695-2-12.and hence complies with therequirements set out in the International Standard IEC 60335-1 5th edition - household and similar electrical appliances - safety, section 30 Resistance to heat and fire. <P><P> The customers using this product must determine its suitability for use in their particular application through testing or other acceptable means as described in end-product glow-wire flammability test standard IEC 60695-2-11 and any applicable product end-use standard(s). <P> If it is determined during the customer’s evaluation of suitability, that higher performance is required, please contact Molex for possible product options."OverviewMicro-Fit 3.0™ Connectors Product Literature Order No 987650-5984Product Name Micro-Fit 3.0 CPI™UPC756054638514PhysicalBreakawayNo Circuits (Loaded)6Circuits (maximum)6Durability (mating cycles max)30Flammability94V-0Glow-Wire Compliant Yes Lock to Mating Part YesMaterial - MetalHigh Performance Alloy (HPA)Seriesimage - Reference onlyEU RoHSChina RoHSRoHS Compliant by Exemption REACH SVHCContains SVHC: No Low-Halogen Status Low-HalogenNeed more information on product environmental compliance?Email productcompliance@For a multiple part number RoHS Certificate of Compliance, click herePlease visit the Contact Us section for any non-product compliance questions.Search Parts in this Series 44914SeriesMates With430250600 ReceptacleApplication Tooling | FAQTooling specifications and manuals are found by selecting the products below.Crimp Height Specifications are then contained in the Application Tooling Specification document.GlobalDescription Product #Compliant Pin Insertion Flat Rock Tool0622008400Removal Tool 0622030455Material - Plating Mating GoldMaterial - Plating Termination90/10 Tin Lead, 90/10 Tin-LeadNet Weight0.974/gNumber of Rows2Orientation VerticalPCB Locator YesPCB Retention YesPackaging Type TrayPitch - Mating Interface 3.00mmPlating min - Mating0.381µmPlating min - Termination 1.270µmPolarized to Mating Part YesPolarized to PCB YesShrouded FullyStackable NoSurface Mount Compatible (SMC)NoTemperature Range - Operating-40°C to +105°CTermination Interface: Style Through Hole - Compliant PinElectricalCurrent - Maximum per Contact5AVoltage - Maximum250VSolder Process DataReplacement RoHS Compliant Part Number0449145602Material InfoReference - Drawing NumbersProduct Specification PS-43045, RPS-43045-003, RPS-43045-004Sales Drawing SD-44914-001This document was generated on 09/04/2012PLEASE CHECK FOR LATEST PART INFORMATION分销商库存信息: MOLEX 0449140602。
SST39SF040数据手册
PRODUCT DESCRIPTION
The SST39SF010A/020A/040 are CMOS Multi-Purpose Flash (MPF) manufactured with SST’s proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39SF010A/020A/040 devices write (Program or Erase) with a 5.0V power supply. The SST39SF010A/020A/040 devices conform to JEDEC standard pinouts for x8 memories.
The SuperFlash technology provides fixed Erase and Program times, independent of the number of Erase/Program cycles that have occurred. Therefore the system software or hardware does not have to be modified or de-rated as is necessary with alternative flash technologies, whose Erase and Program times increase with accumulated Erase/Program cycles.
39uf 电解电容规格书
39uf 电解电容规格书一、产品概述39uf电解电容是一种常见的被动元件，用于各种电子设备中作为电源滤波器、耦合、旁路、消除直流偏置等功能。
本规格书将详细介绍39uf电解电容的技术参数、特点、应用场景以及使用注意事项，并提供选型建议。
二、技术参数1.容量：39uf2.额定电压：通常为25V或50V，具体规格请参考产品型录。
3.耐温范围：通常为-40℃至+105℃，但可能因具体产品而异。
4.介质：铝电解膜5.极性：39uf电解电容具有正负极性，请确保正确安装。
6.尺寸：通常为10mm x 16mm或13mm x 20mm。
详见产品型录。
三、特点1.高容量：39uf电解电容的容量相对较大，适合对电流稳定性要求较高的设备。
2.低ESR：39uf电解电容具有低等效串联电阻（ESR）特性，能够提供较低的功耗。
3.长寿命：经过精心设计和优化的制造工艺，39uf电解电容具有较长的使用寿命。
4.快速充放电响应：39uf电解电容具有较快的充放电响应速度，适用于高频应用。
5.可靠性：39uf电解电容可靠性高，能够在恶劣环境中正常工作。
四、应用场景39uf电解电容广泛应用于各种电子设备中，包括但不限于以下场景：1.电源滤波器：39uf电解电容用于去除电源中的直流偏置，保证电路的稳定性和可靠性。
2.耦合和旁路：39uf电解电容能够有效隔离和传递信号，提高电路的性能。
3.电动机驱动器：39uf电解电容用于电动机起电容器，提供启动电流和稳定工作电流。
4.汽车电子设备：39uf电解电容用于汽车音响、照明、点火系统等电子设备。
5.通信设备：39uf电解电容用于通信基站、无线电设备等电源和信号传输电路。
五、选型建议1.容量选型：根据实际应用需求选择39uf电解电容的容量，如需更精确的选型可咨询厂家或工程师。
2.额定电压选型：根据电路工作电压选择39uf电解电容的额定电压。
3.尺寸选型：根据电子设备的空间限制选择适当的39uf电解电容尺寸。