Electrical and Magnetic Properties of Electron Doped BixCa1-xMnO3 (0〈x ≤0.33) Ceramics

合集下载

金属材料相关英语词汇(2)

金属材料相关英语词汇(2)金属材料相关英语词汇(2)金属材料相关英语词汇(2)base metal, application, jis astm standard, and normal thickness of galvanized steel sheet锌镀层质量zinc coating mass表面处理surface treatment冷轧钢片cold-rolled steel sheet/strip热轧钢片hot-rolled sheet/strip电解冷轧钢片厚度公差thickness tolerance of electrolytic cold-rolled sheet热轧钢片厚度公差thickness tolerance of hot-rolled sheet冷轧或热轧钢片阔度公差width tolerance of cold or hot-rolled sheet长度公差length tolerance理论质量theoretical mass锌镀层质量(两个相同锌镀层厚度)mass calculation of coating (for equal coating)/mm锌镀层质量(两个不同锌镀层厚度)mass calculation of coating (for differential coating)/mm镀锡薄铁片(白铁皮/马口铁) (日工标准jis g3303)简介general镀锡薄铁片的构造construction of electrolytic tinplate镀锡薄钢片(白铁皮/马日铁)制造过程production process of electrolytic tinplate锡层质量mass of tin coating (jis g3303-1987)两面均等锡层both side equally coated mass两面不均等锡层both side different thickness coated mass级别、电镀方法、镀层质量及常用称号grade, plating type, designation of coating mass common coatingmass镀层质量标记markings designations of differential coatings硬度hardness单相轧压镀锡薄铁片(白铁皮/马口铁)single-reduced tinplate双相辗压镀锡薄钢片(马口铁/白铁皮)dual-reduction tinplate钢的种类type of steel表面处理surface finish常用尺寸commonly used size电器用硅[硅] 钢片electrical steel sheet简介general软磁材料soft magnetic material滞后回线narrow hystersis矫顽磁力coercive force硬磁材料hard magnetic material最大能量积maximum energy product硅含量对电器用的低碳钢片的最大好处the advantage of using silicon low carbon steel晶粒取向(grain-oriented)及非晶粒取向(non-oriented) grain oriented non-oriented电器用硅[硅] 钢片的最终用途及规格end usage and designations of electrical steel strip电器用的硅[硅] 钢片之分类classification of silicon steel sheet for electrical use电器用钢片的绝缘涂层performance of surface insulation of electrical steel sheets晶粒取向电器用硅钢片主要工业标准international standard –grain-oriented electrical steel siliconsteel sheet for electrical use晶粒取向电器用硅钢片grain-oriented electrical steel晶粒取向，定取向芯钢片及高硼定取向芯钢片之磁力性能及夹层系数(日工标准及美材标准)magnetic properties and lamination factor of si-orient-coresi-orient-core-hi b electrical steel strip (jis and aisi standard)退火annealing电器用钢片用家需自行应力退火原因annealing of the electrical steel sheet退火时注意事项annealing precautionary碳污染prevent carbon contamination热力应先从工件边缘透入heat from the laminated stacks edges提防过份氧化no excessive oxidation应力退火温度stress –relieving annealing temperature晶粒取向电器用硅[硅] 钢片–高硼(hi-b)定取向芯钢片及定取向芯钢片之机械性能及夹层系数mechanical properties and lamination factors of si-orient-core-hi-band si-orient-core grain orient electrical steel sheets晶粒取向电器用硅[硅] 钢;片–高硼低硫(ls)定取向钢片之磁力及电力性能magnetic and electrical properties of si-orient-core-hi-b-ls 晶粒取向电器用硅[硅] 钢片–高硼低硫(ls) 定取向钢片之机械性能及夹层系数mechanical properties and lamination factors ofsi-orient-core-hi-b-ls晶粒取向电器用硅(硅)钢片-高硼(hi-b)定取向芯钢片，定取向芯钢片及高硼低硫(ls)定取向芯钢片之厚度及阔度公差physical tolerance of si-orient-core-hi-b, si-orient-core,si-core-hi-b-ls grainoriented electrical steel sheets晶粒取向电器用硅(硅)钢片–高硼(hi-b)定取向芯钢片，定取向芯钢片及高硼低硫(ls)定取向芯钢片之标准尺寸及包装standard forms and size of si-orient-core-hi-b,si-core,si-orient-core-hi-b-ls grain-oriented electrical steel sheets绝缘表面surface insulation非晶粒取向电力用钢片的电力、磁力、机械性能及夹层系数lamination factors of electrical, magnetic mechanical non-grainoriented electrical电器及家电外壳用镀层冷辘[低碳] 钢片coated (low carbon) steel sheets for casing,electricals homeappliances镀铝硅钢片aluminized silicon alloy steel sheet简介general镀铝硅合金钢片的特色feature of aluminized silicon alloy steel sheet用途end usages抗化学品能力chemical resistance镀铝(硅)钢片–日工标准(jis g3314)hot-aluminum-coated sheets and coils to jis g 3314镀铝(硅)钢片–美材试标准(astm a-463-77)35.7 jis g3314镀热浸铝片的机械性能mechanical properties of jis g 3314 hot-dip aluminum-coated sheetsand coils公差size tolerance镀铝(硅)钢片及其它种类钢片的抗腐蚀性能比较comparsion of various resistance of aluminized steel other kindsof steel镀铝(硅)钢片生产流程aluminum steel sheet, production flow chart焊接能力weldability镀铝钢片的焊接状态(比较冷辘钢片)tips on welding of aluminized sheet in comparasion with cold rolledsteel strip钢板steel plate钢板用途分类及各国钢板的工业标准包括日工标准及美材试标准type of steel plate related jis, astm and other major industrialstandards钢板生产流程production flow chart钢板订货需知ordering of steel plate不锈钢stainless steel不锈钢的定义definition of stainless steel不锈钢之分类，耐腐蚀性及耐热性classification, corrosion resistant heat resistance of stainlesssteel铁铬系不锈钢片chrome stainless steel马氏体不锈钢martensite stainless steel低碳马氏体不锈钢low carbon martensite stainless steel含铁体不锈钢ferrite stainless steel镍铬系不锈钢nickel chrome stainless steel释出硬化不锈钢precipitation hardening stainless steel铁锰铝不锈钢fe / mn / al / stainless steel不锈钢的磁性magnetic property stainless steel不锈钢箔、卷片、片及板之厚度分类classification of foil, strip, sheet plate by thickness表面保护胶纸surface protection film不锈钢片材常用代号designation of sus steel special use stainless表面处理surface finish薄卷片及薄片(0.3至2.9mm厚之片)机械性能mechanical properties of thin stainless steel(thickness from 0.3mmto 2.9mm) –strip/sheet不锈钢片机械性能(301, 304, 631, csp)mechanical properties of spring use stainless steel不锈钢–种类，工业标准，化学成份，特点及主要用途stainless steel –type, industrial standard, chemical composition,characteristic end usage of the most commonly usedstainless steel不锈钢薄片用途例end usage of thinner gauge不锈钢片、板用途例examples of end usages of strip, sheet plate不锈钢应力退火卷片常用规格名词图解general specification of tension annealed stainless steel strips耐热不锈钢heat-resistance stainless steel镍铬系耐热不锈钢特性、化学成份、及操作温度heat-resistance stainless steel铬系耐热钢chrome heat resistance steel镍铬耐热钢ni - cr heat resistance steel超耐热钢special heat resistance steel抗热超级合金heat resistance super alloy耐热不锈钢比重表specific gravity of heat –resistance steel plates andsheetsstainless steel不锈钢材及耐热钢材标准对照表stainless and heat-resisting steels发条片power spring strip发条的分类及材料power spring strip classification and materials上链发条wind-up spring倒后擦发条pull back power spring圆面("卜竹")发条convex spring strip拉尺发条measure tape魔术手环magic tape魔术手环尺寸图drawing of magic tap定型发条constant torque spring定型发条及上炼发条的驱动力spring force of constant torque spring and wing-up spring 定型发条的形状及翻动过程shape and spring back of constant torque spring定型发条驱动力公式及代号the formula and symbol of constant torque spring边缘处理edge finish硬度hardness高碳钢化学成份及用途high carbon tool steel, chemical composition and usage 每公斤发条的长度简易公式the length of 1 kg of spring steel stripsk-5 aisi-301 每公斤长的重量/公斤(阔100-200公厘) weight per one meter long(kg) (width 100-200mm)sk-5 aisi-301 每公斤之长度(阔100-200公厘) length per one kg (width100-200mm)sk-5 aisi-301 每公尺长的重量/公斤(阔2.0-10公厘)weight per one meter long (kg) (width 2.0-10mm)sk-5 aisi-301 每公斤之长度(阔2.0-10公厘)length per one kg (width 2.0-10mm)高碳钢片high carbon steel strip分类classification用组织结构分类classification according to grain structure用含碳量分类–即低碳钢、中碳钢及高碳钢classification according to carbon contains金属材料相关英语词汇(2) 相关内容:。

Ferroelectricity 材料的铁电性能

MMAT 317 Electronic and Magnetic Properties of Materials
Ferroelectricit y
Some Important Definitions D: electrical displacement
: dielectric constant
E: electrical field Ec: coercive field
Institute of Materials Science
MMAT 317 Electronic and Magnetic Properties of Materials
Why Ferroelectrics?
Lead Oxygen Titanium
Ferroelectricit y
P
+PE +PR
Ferroelectricit y
Polarization, Capacitance, Dielectric Properties
Institute of Materials Science
MMAT 317 Electronic and Magnetic Properties of Materials
MMAT 317 Electronic and Magnetic Properties of Materials
Ferroelectricit y
Polarization Switching by a
E>0
E≈EC
Institute of Materials Science
MMAT 317 Electronic and Magnetic Properties of Materials

物理勘探方法英语

物理勘探方法英语Physical Exploration Methods.Physical exploration methods are geophysical techniques that utilize physical properties of the Earth's materials to investigate subsurface structures and properties. These methods involve measuring and interpreting physical fields, such as gravity, magnetic, electrical, and seismic waves, to determine the physical characteristics and geological formations beneath the Earth's surface.Gravity Exploration.Gravity exploration is based on the principle that the Earth's gravitational field varies due to the different densities of subsurface materials. Denser materials, such as metallic ores or massive rocks, exert a stronger gravitational pull than less dense materials, such as voids or fluids. Gravity surveys involve measuring the variations in the Earth's gravitational field using gravimeters. Thesemeasurements can reveal subsurface structures, such as faults, folds, and intrusions, as well as the presence of dense ore bodies or fluid-filled cavities.Magnetic Exploration.Magnetic exploration utilizes the Earth's magneticfield and the magnetic properties of subsurface materials. Magnetic surveys measure variations in the Earth's magnetic field caused by the presence of magnetic minerals or magnetized rocks. Magnetic anomalies, which are deviations from the normal magnetic field, can indicate the presence of magnetic ore deposits, buried metallic objects, or geological structures with contrasting magnetic susceptibilities.Electrical Exploration.Electrical exploration methods involve introducing electrical currents into the ground and measuring the resulting electrical field. The electrical properties of subsurface materials, such as conductivity, resistivity,and dielectric permittivity, vary depending on their composition and porosity. Electrical surveys can detect subsurface structures, such as conductive ore veins, resistive bedrock, and fluid-saturated zones.Seismic Exploration.Seismic exploration is based on the propagation of seismic waves through the Earth's materials. Seismic surveys involve generating seismic waves using controlled explosions or vibrating sources and recording the waves as they travel through the subsurface. The velocity and reflection patterns of seismic waves provide information about the subsurface geology, including the depth, thickness, and composition of rock layers, as well as the presence of faults and hydrocarbon reservoirs.Other Physical Exploration Methods.In addition to the main methods described above, there are various specialized physical exploration methods that can be used for specific purposes. These include:Radioactive Exploration: This method measures the natural radioactivity emitted by radioactive minerals, such as uranium and thorium, to identify radioactive ore deposits.Electromagnetic Exploration: This method utilizes electromagnetic waves to detect conductive subsurface structures, such as ore bodies and buried pipelines.Ground-Penetrating Radar (GPR): This method uses high-frequency electromagnetic waves to investigate shallow subsurface structures, such as buried utilities, cavities, and archaeological remains.Thermal Exploration: This method measures subsurface temperatures to identify geothermal resources, such as hot springs and magma chambers.Borehole Geophysics: This method involves logging down boreholes to obtain physical measurements, such as density, resistivity, and seismic velocity, for detailed subsurfacecharacterization.Applications of Physical Exploration Methods.Physical exploration methods have a wide range of applications in various fields, including:Mineral exploration: Identifying and assessing ore deposits of metals, minerals, and hydrocarbons.Hydrogeological investigations: Determining groundwater resources, assessing aquifer properties, and detecting groundwater contamination.Engineering geology: Evaluating subsurface conditions for construction projects, such as tunnels, dams, and pipelines.Environmental investigations: Identifying buried waste sites, monitoring groundwater contamination, and assessing soil stability.Archaeological surveys: Locating buried structures, artifacts, and archaeological features.Geothermal exploration: Identifying potential geothermal reservoirs for energy production.Advantages and Limitations of Physical Exploration Methods.Physical exploration methods offer several advantages:Non-invasive: These methods do not require direct excavation of the ground, which minimizes environmental impact and disruption.Depth penetration: Some methods, such as seismic and gravity surveys, can provide information about deep subsurface structures.Quantifiable data: The measurements obtained from physical exploration surveys can be quantified and processed to provide detailed subsurface models.However, physical exploration methods also have limitations:Resolution: The resolution of physical exploration methods varies depending on the method and the subsurface conditions.Interpretation: The interpretation of physical exploration data requires expert knowledge and experience to accurately determine subsurface structures and properties.Cost: Physical exploration surveys can be relatively expensive, especially for large-scale projects.。

材料科学基础英文版

材料科学基础英文版Material Science Fundamentals。

Material science is an interdisciplinary field that explores the properties of materials and their applications in various industries. It combines elements of physics, chemistry, engineering, and biology to understand the behavior of materials at the atomic and molecular levels. This English version of the material science fundamentals aims to provide a comprehensive overview of the key concepts and principles in this field.1. Introduction to Material Science。

Material science is concerned with the study of materials and their properties. It encompasses the discovery, design, and development of new materials, as well as the investigation of existing materials for specific applications. The field is essential for the advancement of technology and innovation in various industries, including aerospace, automotive, electronics, and healthcare.2. Atomic Structure and Bonding。

【精品】材料科学与工程(Materials Science and Engineering)专业英语讲义word版

材料科学与工程专业英语Materials Science and EngineeringUnit1Materials Science and EngineeringMaterials are properly more deep-seated in our culture than most of us realize. 材料可能比我们大部分人所意识到的更加深入地存在于我们的文化当中。

Transportation, housing, clothing, communication, recreation and food production－virtually every segment of our lives is influenced to one degree or another by materials.运输、住房、衣饰、通讯、娱乐，还有食品生产——实际上我们日常生活的每个部分都或多或少地受到材料的影响。

Historically, the development and advancement of societies have been int imately tied to the members’ abilities to produce and manipulate materials to fill their needs. 从历史上看，社会的发展和进步已经与社会成员生产和利用材料来满足自身需求的能力紧密地联系在一起。

In fact, early civilizations have been designated by the level of their materials development.事实上，早期文明是以当时材料的发展水平来命名的。

（也就是石器时代，青铜器时代）The earliest humans has access to only a very limited number of materials, those that occur naturally stone, wood, clay, skins, and so on. 最早的人类只能利用非常有限数量的材料，象那些自然界的石头，木头，黏土和毛皮等等。

材料科学与工程专业英语课后习题答案unit1-7

Materials science材料科学Stone age石器时代Naked eye肉眼Bronze age铜器时代Optical property光学性能Integrated circuit集成电路Mechanical strength机械强度Thermal conductivity导热“Materials science” involves investigating the relationships that exist between the structures and properties of materials. In contrast ,”materials engineering “is ,on the basis of there structure property correlations ,designing or engineering the structure of a material that produce a predetermined set of properties。

，材料工程是根据材料的结构和性质的关系来设计或操纵材料的结构以求制造出一系列可预定的性质。

从功能方面来说，材料科学家的作用是发展或合成新的材料V irtually all important properties of solid materials may be grouped into six different categories: mechanical, electrical, thermal, magnetic, optical ,and deteriorative。

固体材料的所有重要的性质可以分成六个不同的种类，机械性能、电性能、热性能、磁性能、光性能和内耗。

In addition to structure and properties , two other important components are involved in the sciences and engineering of materials , namely“processing”and“performance”.除了组织性能之外，另外两个重要的性质也包括在材料科学和工程之中，即“加工”和“特性”The more familiar an engineer or scientist is with the various characteristics and structure-property relationship，as well as processing techniques of material，the more proficient and confident he or she will be to make judicious materials choices based on these criteria。

Effect ofthedanglingbondontheelectronicandmagneticproperties

Effect of the dangling bond on the electronic and magnetic propertiesof BN nanoribbonFang-Ling Zheng a,Yan Zhang b,Jian-Min Zhang a,n,Ke-Wei Xu ca College of Physics and Information Technology,Shaanxi Normal University,Shaanxi,Xian710062,PR Chinab Laboratoire SPMS,E´cole Centrale Paris,CNRS-UMR8580,92295Chˆa tenay-Malabry Cedex,Francec State Key Laboratory for Mechanical Behavior of Materials,Xian Jiaotong University,Shaanxi,Xian710049,PR Chinaa r t i c l e i n f oArticle history:Received19August2010Received in revised form15October2010Accepted13January2011Available online21January2011Keywords:A.NanostructuresA.SemiconductorsC.Ab initio calculationsD.Electrical propertiesD.Magnetic propertiesa b s t r a c tThe effect of the dangling bond on the electronic and magnetic properties of BN nanoribbon with zigzagedge(ZBNNR)and armchair edge(ABNNR)have been studied using theﬁrst-principles projector-augmented wave(PAW)potential within the density function theory(DFT)framework.Though ZBNNRor ABNNR with H atom terminated at both edges is nonmagnetic semiconductor,the dangling bondinduces magnetism for the ZBNNR with bare N edge,bare B edge,bare N and B edges,the ABNNR withbare N edge and bare B edge.However,the ABNNR with bare N and B edges is still nonmagneticsemiconductor due to the strong coupling of the dangling bonds of dimeric N and B atoms at the sameedge.The magnetic moment of ZBNNR with bare N(B)edge is nearly half the magnetic moment ofABNNR with bare N(B)edge.Such a half relationship is also existed in the number of the dangling bondstates appeared around the Fermi level in the band structures.Furthermore,the dangling bond statesalso cause both ZBNNR and ABNNR with bare N edge a transition from semiconducting to half-metallicand thus a completely(100%)spin-polarization,while cause both ZBNNR and ABNNR with bare B edgeas well as ABNNR with bare N and B edges only a decrease in their band gap.&2011Elsevier Ltd.All rights reserved.1.IntroductionAs a quasi-two-dimensional insulator,hexagonal boron nitride(h-BN)has a large band gap and,hence,when rolled up into atubular form,the so formed BN nanotubes remain large band gapinsulators independent of their chirality and diameter[1–5],dif-ferent from carbon nanotubes[6–9].It is then not surprising thatthe nanoribbons made out of h-BN are also nonmagnetic insula-tors[10,11].BN nanoribbon(BNNR)is found to be strong andstable quasi-one-dimensional structure.The band gaps of the Hterminated BNNRs were found dependence on not only the edgeshapes(zigzag and armchair)but also the ribbon width.The bandgap of zigzag BNNR(ZBNNR)is indirect and decreases monotoni-cally with increasing ribbon width due to the enhanced chargetransfer from the B edge to the N edge[12,13].However,the bandgap of armchair BNNR(ABNNR)is direct and the gap variationsversus width exhibit three distinct family behaviors due to thequantized wave vector along the width direction[11].Similarphenomenon has been found in previous researches on thegraphene,SiC,Si and Ge nanoribbon with armchair edges[14–16].Experimentally,the nanostructures formed in a layered h-BN,e.g.nanosheets[17–19],nanocones[20,21],nanotubes[22–26],nanohorns[26,27],nanorods[26],nanowires[28],nanoparti-cles[29,30]and nanoribbons[30]have already been synthesizedby various experimental methods.Among all these differentnanostructures,the BNNRs are particularly important due totheir precursor property,well-deﬁned geometry and possibleease of manipulation.The electron and magnetic properties ofthe BNNRs can be manipulated by C doping[10,31–35],B or Nvacancy[12,35–37],H adsorption[38–44]and applied electricﬁeld[11,45,46].The experimental results of Terrones et al.[30]showed that the presence of an electricﬁeld can remove someforeign species located initial on the edges of the BNNRs therebyenhance andﬁnally stabilize theﬁeld emission due to decrease inthe work function.This suggested that active edges of the BNNRscan be obtained by electricﬁeld and are needed for stableﬁeldemission.Furthermore,the dehydrogenated ribbons are alsouseful in the development of sensors,catalysts and ceramiccomposites.However,to the best of our knowledge,the stabilityof the BNNRs with bare edges has not been systemically investi-gated theoretically.In this work,we explore the stability of bothZBNNR and ABNNR with bare N edge,bare B edge,bare N and Bedges,and the effects of them on the electronic and magneticproperties usingﬁrst-principle total energy density functional theory(DFT)calculations under the generalized-gradient approximationContents lists available at ScienceDirectjournal homepage:/locate/jpcsJournal of Physics and Chemistry of Solids0022-3697/$-see front matter&2011Elsevier Ltd.All rights reserved.doi:10.1016/j.jpcs.2011.01.005n Corresponding author.Tel.:+862985308456.E-mail address:jianm_zhang@(J.-M.Zhang).Journal of Physics and Chemistry of Solids72(2011)256–262(GGA).The rest of the paper is organized as follows.In the second section,the calculation methods and structural models are described in detail.The results and discussions are given in the third section.The last section is devoted to the conclusions.2.Calculation methods and structural modelsThe calculations are performed using the Vienna ab-initio simulation package (VASP)based on the density function theory (DFT)[47–52].The electron–ionic core interaction is represented by the projector-augmented wave (PAW)potentials [53],which are more accurate than the ultrasoft pseudopotentials.To treat electron exchange and correlation,we chose the Perdew–Burke–Ernzerhof (PBE)[54]formulation of the generalized-gradient approximation (GGA),which yields the correct ground-state structure of the systems.The cutoff energy for the plane-waves is chosen to be 450eV.The 2s 22p 3,2s 22p 1and 1s 1electrons are taken as the valence electrons for N,B and H atoms,respectively.The vacuum space is set to be 15˚Ain both edge-to-edge and layer-to-layer directions,which is large enough to separate the interaction between BNNR and its periodic images.The sampled k points in the Brillouin zone are generated by the Monkhorst–Pack scheme [55]with G -centered grids.To avoid the numerical instability due to level crossing and quasi-degeneracy near the Fermi level,we use a method of Methfessel–Paxton order N (N ¼1)with a width of 0.2eV.Geometric structures are fully relaxed to minimize the total energy of the system until a precision of 10À4is reached.The conjugate gradient minimization is used for optimization of the atom coordinates until the forcesacting on each atom are smaller than 0.02eV/˚A.As examples,the optimized geometry structures of 6-ZBNNR and 6-ABNNR terminated with H atoms are shown in Fig.1(a)and (b),respectively.As convention nomenclature,the width of either ZBNNR or ABNNR is deﬁned by the number of B–N atom pairs along the ribbons,n ,in the unit cell.We ﬁnd that theaverage B–N bond length is 1.46˚A,and the N–H and the B–H bond lengths are 1.01and 1.20˚A,respectively.3.Results and discussionsThe calculated magnetic moments m are listed in Table 1forboth ZBNNR and ABNNR within ribbon width from 4to 12each with H atom terminated at both edges (perfect),bare N,bare B,as well as bare N and B edges.It can be seen that the magnetic moment is zero for perfect ZBNNR and ABNNR.However,the dangling bond induces magnetism.In detail,for both ZBNNR andABNNR with either bare N edge or bare B edge,the magnetic moment is independent of the ribbon width.The magnetic moment of either ZBNNR or ABNNR with bare N edge is larger than that of them with bare B edge due to the N atom having larger numbers of the valance electrons in compared with B atom.It is interesting to note that the magnetic moment of ZBNNR with bare N(B)edge is nearly half the magnetic moment of ABNNR with bare N(B)edge.The reason is that the ZBNNR with bare N(B)edge has only one dangling bond per unit cell,while the ABNNR with bare N(B)edge has two dangling bonds per unit cell.For ZBNNR,the magnetic moment in the case of bare N and B edges is larger than that in the case of either bare N edge or bare B edge as expected,but is smaller than the sum of them for bare N edge and bare B edge implying there exists an interaction between the dangling bonds at both edges in the case of bare N and B edges.With increasing ribbon width,such an interaction decreases and thus the magnetic moment of the ZBNNR with bare N and B edges increases and tends to the sum of the magnetic moments for bare N edge and bare B edge.In fact,there also exists an interaction between the dangling bonds at the same edge of ZBNNR or ABNNR with bare N edge,bare B edge,or bare N and B edges.A zero magnetic moment is obtained for ABNNR with bare N and B edges can be attributed to the strong coupling of the dangling bonds of dimeric N and B atoms at the same edge.The energies needed in per unit cell to obtain bare N edge,bare B edge and bare N and B edges for ZBNNR and ABNNR are shown in Fig.2(a)and (b),respectively,as a function of the ribbon width.It can be seen that in all cases the energies needed are indepen-dent of the ribbon width.For either ZBNNR or ABNNR,bare B edge is easier to obtain than bare N edge (E bare B ¼5:79eV and E bare N ¼6:45eV for ZBNNR,E bare B ¼11:37eV and E bare N ¼12:76eV for ABNNR)because the strength of the B–H bond is weaker than that of the N–H bond.Furthermore,the energy needed to obtain bare N and B edges (E bare N and B ¼12:18eV for ZBNNR and E bare N and B ¼19:11eV for ABNNR)is larger than that to obtain either bare N edge or bare B edge as expected,but smaller than the sum of them for bare N edge and bare B edge especially for ABNNR case due to strong coupling of the dangling bonds of dimeric N and B atoms at the same edge (see Fig.3h).The energy needed for ZBNNR with bare N edge,bare B edge,or bare N and B edges is nearly half value for ABNNR with bare N edge,bare B edge,or bare N and B edges,respectively.The reason is that the number of the dangling bonds per unit cell in ZBNNR cases is half that in the ABNNR cases.The different energies needed to obtain bare N edge,bare B edge and bare N and B edges for ZBNNR and ABNNR can be used as a guide of the experiments to obtain different bare edges of theBNNRs.6-ZBNNR 6-ABNNRNB HFig.1.The optimized geometry structures of (a)6-ZBNNR and (b)6-ABNNR terminated with H atoms.The area between two dashed lines represents the prime periodic unit cell.F.-L.Zheng et al./Journal of Physics and Chemistry of Solids 72(2011)256–262257The difference charge densities on ribbon plane between the majority spin and minority spin are shown in Fig.3for 6-ZBNNR (left panels)and 6-ABNNR (right panels)with bare N edge,bare B edge,as well as bare N and B edges.For comparison,those for perfect 6-ZBNNR and 6-ABNNR are also shown in Fig.3(a)and (e),respectively.It can be seen that the difference charge densities are mainly located on the edge bare atoms except (Fig.3(h))for 6-ABNNR with bare N and B edges having zero difference charge density and thus zero magnetic moment.This clearly indicates that the magnetic moment of the BNNRs is induced by the dangling bond.Both the larger difference charge density for edge bare N atoms and decaying for N sub-lattices away from edge,as well as the smaller difference charge density for edge bare B atoms explain well why the magnetic moment of BNNRs with bare N edge is larger than that of them with bare B edge.The reason for 6-ABNNR with bare N and B edges,as an example,having zero difference charge density and thus zero magnetic moment is due to the strong coupling of the dangling bonds of dimeric N and B atoms at the same edge.This is also the reason why the length of edge dimerB–N bond is shortened from 1.41˚Afor perfect 6-ABNNR to 1.30˚A for 6-ABNNR with bare N and B edges.The band structures for 6-ZBNNR (upper panels)and 6-ABNNR (bottom panels)with bare N edge,bare B edge,as well as bare N and B edges are shown in Fig.4.For comparison,the band structures for perfect 6-ZBNNR and 6-ABNNR are also shown in Fig.4(a)and (e),respectively.In each graph,the left panel corresponds to the majority spin and the right panel refers the minority spin.The Fermi level E F is set to zero energy and indicated by the horizontal green dashed paring with Fig.4(a)and (e)for the band structures of 6-ZBNNR and 6-ABNNR with H termination on both edges,we can see that the band structures are modiﬁed by dangling bonds.Firstly,one readily identiﬁes an asymmetry in the proximity of the Fermi level between the majority spin and minority spin for 6-ZBNNR with bare N edge (Fig.4b),bare B edge (Fig.4c),or bare N and B edges (Fig.4d),as well as for 6-ABNNR with bare N edge (Fig.4f),or bare B edge (Fig.4g).While a completely symmetry between the majority spin and minority spin is observed for 6-ABNNR with bare N and B edges (Fig.4h).These are consistent with the resulting magnetic moments above.Secondly,several extra bands (marked in red dashed lines)caused by the edge dangling bonds appear for BNNRs with bare N edge,bare B edge as well as bare N and B edges.In details,two (four)extra bands appear at or near the Fermi level for 6-ZBNNR with either bare N edge or bare B edge (with bare N and B edges).However,double extra bands,i.e.four (eight)extra bands,appear near the Fermi level for 6-ABNNRTable 1The calculated magnetic moment m (m B /per unit cell)for both ZBNNR and ABNNR within ribbon width from 4to 12each with H atom terminated at both edges (perfect),bare N,bare B as well as bare N and B edges.TypeWidth 456789101112ZBNNR Perfect 000000000Bare N 0.910.910.910.910.910.910.910.910.91Bare B0.600.600.600.600.600.600.600.600.60Bare N and B 1.31 1.36 1.38 1.40 1.42 1.42 1.44 1.44 1.49ABNNR Perfect 000000000Bare N 1.87 1.87 1.88 1.88 1.88 1.88 1.88 1.88 1.88Bare B1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20 1.20Bare N and B467891011124111213141516171819E n e r g y (e V )Ribbon width nRibbon width n681012681012Fig.2.The energy needed to obtain the structures of (a)ZBNNR and (b)ABNNR with bare N edge,bare B edge,bare N and B edges as a function of the ribbon width.F.-L.Zheng et al./Journal of Physics and Chemistry of Solids 72(2011)256–262258with either bare N or bare B edge (with bare N and B edges)due to its double number of the dangling bonds in per unit cell with respect to 6-ZBNNR cases.Furthermore,in either majority spin or minority spin,two extra bands normally degenerate near Z point and with increasing ABNNR width the degenerate region increases up to nearly overlap.In order to study the variation of band gap with ribbon width and the dangling bond type,the band gap as a function of ribbon width is shown in Fig.5for perfect ZBNNR,ZBNNR with bare B edge,perfect ABNNR,ABNNR with bare B edge,as well as ABNNR with bare N and B edges.Those for ZBNNR with bare N edge,ZBNNR with bare N and B edges,and ABNNR with bare N edge arebare N and Bbare Bbare N6-ABNNRperfectbare N bare Bbare N and B6-ZBNNRperfect Fig.3.The difference charge density on ribbon plane between majority spin and minority spin for 6-ZBNNR (left panels)and 6-ABNNR (right panels).(a)and (e)Perfect,(b)and (f)bare N edge,(c)and (g)bare B edge,(d)and (h)bare N and B edges.The blue and red regions represent minimum (0e/˚A3)and maximum (0.2e/˚A 3)values,respectively.(For interpretation of the references to color in this ﬁgure legend,the reader is referred to the web version of this article.)F.-L.Zheng et al./Journal of Physics and Chemistry of Solids 72(2011)256–262259not shown because they are metallic.It can be clearly seen that with increasing ribbon width,the band gap of perfect ZBNNR (green circles)decreases monotonically due to the enhanced charge transfer from the B edge to the N edge [11,13],however,the band gap of perfect ABNNR (red squares)exhibits three distinct family behaviors due to the quantized wave vector along the width direction [11].Similar results were also obtained by Duet al.[10].The band gap of ZBNNR with bare B edge (orange circles)is much smaller than that of the perfect ZBNNR and nearly keeps as a constant of about 2.15eV.In addition,the band gap of ABNNR with bare B edge (blue squares)especially or bare N and B edges (black squares)is smaller than the perfect ABNNR.This is consistent with the fact that many materials usually decrease the band gap when H termination is removed.The reason is that the existence of additional states within the band gap region induced by the dangling bonds reduces band gap effectively.For perfect ABNNR,ABNNR with bare B edge or with bare N and B edges,the band gap oscillates and has a trend to quenching to a constant value.This is consistent with the results of Topsakal et al.[12].To gain deep insight into the effect of the dangling bond on the distribution of the electron with energy,total density of states (DOS)are plotted in Fig.6for (a)and (e)perfect,(b)and (f)bare N edge,(c)and (g)bare B edge,(d)and (h)bare N and B edges of 6-ZBNNR (left panels)and 6-ABNNR (right panels).Comparing with the DOS of either perfect 6-ZBNNR (Fig.6a)or perfect 6-ABNNR (Fig.6e),we can obtain the following characters.Firstly,the DOS of either 6-ZBNNR or 6-ABNNR with bare N edge (Fig.6b or f)displays completely (100%)spin-polarization around the Fermi level and the charge transport is totally dominated by minority spin electrons.A similar behavior was also obtained for 10-ZAlNNR with bare N edge [56].Since most transport occurs around the Fermi level,the strong spin polarization brings into either 6-ZBNNR or 6-ABNNR with bare N edge,implying these structures can be utilized to construct efﬁcient spin-polarized transport devices.The spin polarization is very small (12.62%)for 6-ZBNNR with bare N and B edges (Fig.6d).Secondly,the 6-ZBNNR or 6-ABNNR with bare B edge (Fig.6c or g)causes spin-splitting gap states.Since it is still nonmagnetic semiconductor,the 6-ABNNR with bare N and B edges (Fig.6h)has a completely symmetry DOSs between the majority spin and minority spin and-8-6-4-202468E n e r g y (e V )FF-8-6-4-202468E n e r g y (e V )Fig.4.The band structures for 6-ZBNNR (upper panels)and 6-ABNNR (bottom panels).(a)and (e)Perfect,(b)and (f)bare N edge,(c)and (g)bare B edge,(d)and (h)bare N and B edges.For each graph,the left panel corresponds to the majority spin and the right panel refers to the minority spin.The Fermi level E F is set to zero and indicated by the horizontal green dashed lines.(For interpretation of the references to color in this ﬁgure legend,the reader is referred to the web version of this article.)42.02.53.03.54.04.55.0B a n d g a p (e V )Ribbon width n681012Fig.5.The band gap as a function of ribbon width for perfect ZBNNR,ZBNNR with bare B edge,perfect ABNNR,ABNNR with bare B edge,as well as ABNNR with bare N and B edges.(For interpretation of the references to color in this ﬁgure legend,the reader is referred to the web version of this article.)F.-L.Zheng et al./Journal of Physics and Chemistry of Solids 72(2011)256–262260thus a zero spin polarization.One thing we should point out is that the spin polarization P is deﬁned by P ¼½N k ðE F ÞÀN m ðE F Þ =½N k ðE F ÞþN m ðE F Þwhere N m ðE F Þand N k ðE F Þrepresent the total DOS of the majority spin and minority spin at the Fermi level,respectively.4.ConclusionsIn summary,the effects of the dangling bond on the electronic and magnetic properties are studied for ZBNNR and ABNNR with width from 4to 12by using the ﬁrst-principles PAW potential within DFT framework under GGA.Though perfect ZBNNR or ABNNR is nonmagnetic semiconductor,the dangling bonds cause magnetism for ZBNNR with bare N edge,bare B edge,bare N and B edges,ABNNR with bare N edge and bare B edge.However,the ABNNR with bare N and B edges is still nonmagnetic semicon-ductor due to the strong coupling of the dangling bonds of dimeric N and B atoms at the same edge.The magnetic moment of ZBNNR with bare N(B)edge is nearly half the magnetic moment of ABNNR with bare N(B)edge because of its half number of the dangling bonds in per unit cell with respect to ABNNR cases,which also makes half extra bands appear near the Fermi level for ZBNNR with bare N edge,bare B edge as well as bare N and B edges comparing with those for ABNNR with bare N edge,bare B edge as well as bare N and B edges,respectively.Furthermore,the extra bands caused by the dangling bonds lead ZBNNR and ABNNR with bare N edge a transition from semicon-ducting to half-metallic,while ZBNNR with bare B edge,ABNNR with bare B edge,as well as ABNNR with bare N and B edges a decrease in their band gap.Especially,the dangling bonds of ZBNNR and ABNNR with bare N edge induce a completely (100%)spin-polarization around the Fermi level,indicating thesestructures can be utilized to construct efﬁcient spin-polarized transport devices.AcknowledgementsThe authors would like to acknowledge the State Key Devel-opment for Basic Research of China (Grant no.2004CB619302)and the National Natural Science Foundation of China (Grant no.51071098)for providing ﬁnancial support for this research.References[1]X.Blase,A.Rubio,S.G.Louie,M.L.Cohen,Europhys.Lett.28(1994)335.[2]X.Blase´,J.C.Charlier,A.De Vita,A.Car,Appl.Phys.Lett.70(1997)197.[3]A.Loiseau,F.Willaime,N.Demoncy,N.Schramcheko,G.Hug,C.Colliex,H.Pascard,Carbon 36(1998)743.[4]D.Zhang,R.Q.Zhang,Chem.Phys.Lett.371(2003)426.[5]X.Chen,J.Ma,Z.Hu,Q.Wu,Y.J.Chen,Am.Chem.Soc.127(2005)7982.[6]X.Blase,L.X.Benedict,E.L.Shirley,S.G.Louie,Phys.Rev.Lett.72(1994)1878.[7]N.Hamada,S.Sawada,A.Oshiyama,Phys.Rev.Lett.68(1992)1579.[8]R.Saito,M.Fujita,G.Dresselhaus,M.S.Dresselhaus,Appl.Phys.Lett.60(1992)2204.[9]O.G ¨ulseren,T.Yildirim,S.Ciraci,Phys.Rev.B 65(2002)153405.[10]A.J.Du,S.C.Smith,G.Q.Lu,Chem.Phys.Lett.447(2007)181.[11]Z.H.Zhang,W.l.Guo,Phys.Rev.B 77(2008)075403.[12]M.Topsakal,E.kt ¨urk,S.Ciraci,Phys.Rev.B 79(2009)115442.[13]J.Nakamura,T.Nitta,A.Natori,Phys.Rev.B 72(2005)205429.[14]Y.W.Son,M.L.Cohen,S.G.Louie,Phys.Rev.Lett.97(2006)216803.[15]J.M.Zhang,F.L.Zheng,Y.Zhang,V.Ji,J.Mater.Sci.45(2010)3259.[16]S.Cahangirov,M.Topsakal,E.Akt ¨urk,H.Sahin,S.Ciraci,Phys.Rev.Lett.102(2009)236804.[17]A.Nagashima,N.Tejima,Y.Gamou,T.Kawai,C.Oshima,Phys.Rev.Lett.75(1995)3918.[18]M.Corso,T.Greber,J.Osterwalder,Surf.Sci.577(2005)L78.[19]D.Pacile ´,J.C.Meyer,C -.O¨.Girit,A.Zettl,Appl.Phys.Lett.92(2008)133107.[20]L.Bourgeois,Y.Bando,W.Q.Han,T.Sato,Phys.Rev.B 61(2000)7686.[21]L.Bourgeois,Y.Bando,S.Shinozaki,K.Kurashima,T.Sato,Acta Crystallogr.A 55(1999)168.-12-404-404-404-404E FEnergy (eV)6-ABNNR -12-4046-ZBNNR Energy (eV)-404-404-404D O S (1/e V )-8-404812-8-4048Fig.6.The DOS for 6-ZBNNR (left panels)and 6-ABNNR (right panels).(a)and (e)Perfect,(b)and (f)bare N edge,(c)and (g)bare B edge,(d)and (h)bare N and B edges.The Fermi level E F is set to zero and is indicated by the vertical green dashed lines.(For interpretation of the references to color in this ﬁgure legend,the reader is referred to the web version of this article.)F.-L.Zheng et al./Journal of Physics and Chemistry of Solids 72(2011)256–262261[22]N.G.Chopra,R.J.Luyken,K.Cherrey,V.H.Crespi,M.L.Cohen,S.G.Louie,A.Zettl,Science269(1995)966.[23]A.Loiseau,F.Willaime,N.Demoncy,G.Hug,H.Pascard,Phys.Rev.Lett.76(1996)4737.[24]M.Terrones,W.K.Hsu,H.Terrones,J.P.Zhang,S.Ramos,J.P.Harea´,R.Castlllo,K.Prassldes,A.K.Cheetham,H.W.Kroto,D.R.M.Walton,Chem.Phys.Lett.259 (1996)568.[25]D.Golberg,Y.Bando,M.Eremets,K.Takemura,K.Kurashima,H.Yusa,Appl.Phys.Lett.69(1996)2045.[26]D.Golberg, A.Rode,Y.Bando,M.Mitome, E.Gamaly, B.Luther-Davies,Diamond Relat.Mater.12(2003)1269.[27]C.Zhi,Y.Bando,C.Tang,D.Golberg,Appl.Phys.Lett.87(2005)063107.[28]Y.J.Chen,H.Z.Zhang,Y.Chen,Nanotechnology17(2006)786.[29]D.Golberg,Y.Bando,O.Stephan,K.Kurashima,Appl.Phys.Lett.73(1998)2441.[30]M.Terrones,J.C.Charlier,A.Gloter,E.Cruz-Silva,E.Terre´s,Y.B.Li,A.Vinu,Z.Zanolli,J.M.Dominguez,H.Terrones,Y.Bando,D.Golberg,Nano Lett.8 (2008)1026.[31]P.Kohler-Redlich,M.Terrones, C.Manteca-Diego,W.K.Hsu,H.Terrones,M.R¨uhle,H.W.Kroto,D.R.M.Walton,Chem.Phys.Lett.310(1999)459.[32]S.Okada,M.Igami,K.Nakada,A.Oshiyama,Phys.Rev.B62(2000)9896.[33]S.Okada,A.Oshiyama,Phys.Rev.Lett.87(2001)146803.[34]S.B.Tang,Z.X.Cao,Phys.Chem.Chem.Phys.12(2010)2313.[35]S.B.Tang,Z.X.Cao,Comput.Mater.Sci.48(2010)648.[36]S.Okada,Phys.Rev.B80(2009)161404.[37]W.Chen,Y.F.Li,G.T.Yu,Z.Zhou,Z.F.Chen,J.Chem.Theory Comput.5(2009)3088.[38]X.Wu,J.Yang,J.G.Hou,Q.Zhu,J.Chem.Phys.121(2004)8481.[39]S.S.Han,S.H.Lee,J.K.Kang,H.M.Lee,Phys.Rev.B72(2005)113402.[40]S.A.Shevlin,Z.X.Guo,Phys.Rev.B76(2007)024104.[41]Y.F.Li,Z.Zhou,D.Golberg,Y.Bando,P.V.R.Schleyer,Z.F.Chen,J.Phys.Chem.C112(2008)1365.[42]J.T.Tanskanen,M.Linnolahti, A.J.Karttunen,T.A.Pakkanen,Chem.Phys.Chem.9(2008)2390.[43]J.T.Tanskanen,M.Linnolhti,A.J.Karttunen,T.A.Pakkanen,J.Phys.Chem.C113(2009)10065.[44]S.B.Tang,Z.X.Cao,Chem.Phys.Lett.488(2010)67.[45]V.Barone,J.E.Peralta,Nano Lett.8(2008)2210.[46]C.H.Park,S.G.Louie,Nano Lett.8(2008)2200.[47]G.Kresse,J.Hafner,Phys.Rev.B47(1993)558.[48]G.Kresse,J.Hafner,Phys.Rev.B49(1994)14251.[49]G.Kresse,J.Furthm¨uller,Comput.Mater.Sci.6(1996)15.[50]G.Kresse,J.Furthm¨uller,Phys.Rev.B54(1996)11169.[51]H.J.Monkhorst,J.D.Pack,Phys.Rev.B13(1976)5390.[52]W.Kohn,L.Sham,Phys.Rev.A140(1965)1133.[53]G.Kresse,D.Joubert,Phys.Rev.B59(1999)1758.[54]J.P.Perdew,S.Burke,M.Ernzerhof,Phys.Rev.Lett.77(1996)3865.[55]H.J.Monkhorst,J.D.Pack,Phys.Rev.B13(1976)5188.[56]A.J.Du,Z.H.Zhu,Y.Chen,G.Q.Lu,S.C.Smith,Chem.Phys.Lett.469(2009)183.F.-L.Zheng et al./Journal of Physics and Chemistry of Solids72(2011)256–262 262。

材料物理英语

材料物理英语Material Physics English。

Material physics is a branch of physics that focuses on the study of the physical properties of materials. It is a multidisciplinary field that combines principles from physics, chemistry, and engineering to understand the behavior of materials at the atomic and molecular levels. In this document, we will explore some key concepts and terms related to material physics in English.1. Crystal Structure。

The crystal structure of a material refers to the arrangement of atoms or molecules in a crystalline solid. It is an important factor that determines the physical and mechanical properties of the material. Common types of crystal structures include cubic, hexagonal, and tetragonal. Understanding the crystal structure of a material is essential for designing new materials with specific properties.2. Mechanical Properties。

Materials Characterization

Materials Characterization Materials characterization is a crucial aspect of materials science and engineering, providing valuable insights into the properties and behavior of materials. It involves a variety of techniques and methods to analyze the structure, composition, and properties of materials at the microscopic and macroscopic levels. By understanding these characteristics, researchers and engineers can make informed decisions about the selection, design, and optimization of materials for specific applications. One of the primary goals of materials characterization is to determine the structure of materials at different length scales. This includes examining the arrangement of atoms, grains, phases, and defects within a material. Techniques such as X-ray diffraction, electron microscopy, and spectroscopy can provide detailed information about the crystal structure, morphology, and chemical composition of materials. By analyzing these structural features, researchers can gain insights into the mechanical, thermal, electrical, and magnetic properties of materials. In addition to structural characterization, materials characterization also involves analyzing the mechanical properties of materials. This includes measuring parameters such as hardness, strength, elasticity, and toughness. Techniques like tensile testing, hardness testing, and impact testing can provide valuable data on the mechanical behavior of materials under different loading conditions. By understanding how materials respond to external forces, engineers can design materials that can withstand specific mechanical requirements in various applications. Furthermore, materials characterization plays a crucial role in understanding the thermal properties of materials. Thermal analysis techniques such as differential scanning calorimetry, thermogravimetric analysis, and thermal conductivity measurements can provide information about the heat flow, phase transitions, and thermal stability of materials. By studying these thermal properties, researchers can optimize the performance of materials in applications that involve high temperatures, thermal cycling, or heat transfer. Moreover, materials characterization is essential for evaluating the electrical and magnetic properties of materials. Techniques such as electrical conductivity measurements, dielectric spectroscopy, and magnetic hysteresis loops can provide insights into the electrical and magnetic behavior ofmaterials. By understanding these properties, researchers can develop materialsfor applications such as electronic devices, sensors, actuators, and magnetic storage devices. Additionally, materials characterization is critical for analyzing the chemical properties of materials. Techniques such as X-ray photoelectron spectroscopy, Fourier-transform infrared spectroscopy, and nuclear magnetic resonance spectroscopy can provide information about the chemical composition, bonding, and surface chemistry of materials. By studying these chemical properties, researchers can tailor the surface properties of materialsfor specific functionalities, such as corrosion resistance, adhesion, or catalytic activity. In conclusion, materials characterization is a multifaceted field that encompasses a wide range of techniques and methods to analyze the structure, composition, and properties of materials. By characterizing materials at different length scales and in various aspects, researchers and engineers can gain a comprehensive understanding of materials and make informed decisions about their selection, design, and optimization for specific applications. Ultimately, materials characterization plays a crucial role in advancing materials science and engineering, leading to the development of innovative materials with enhanced performance and functionality.。

介绍陶瓷作用英文作文

介绍陶瓷作用英文作文英文：Ceramics have been used for various purposes throughout history, from creating pottery and porcelain to building materials and even space shuttle heat shields. As a material, ceramics have unique properties that make them useful in a wide range of applications.One of the most notable properties of ceramics is their high resistance to wear and corrosion. This makes themideal for use in machinery and equipment that undergoes a lot of stress and friction, such as bearings and cutting tools. For example, the ceramic ball bearings used in high-speed machinery are able to withstand extreme temperatures and pressures without degrading or wearing down.Another important property of ceramics is their ability to withstand high temperatures. This makes them useful in applications where other materials would melt or deform,such as in furnace linings, gas turbine blades, and even the heat shields of spacecraft. For example, the ceramic tiles on the underside of the Space Shuttle were designed to protect the craft from the intense heat generated during re-entry into Earth's atmosphere.Ceramics are also known for their electrical and magnetic properties, which make them useful in electronic devices and other applications. For example, ceramic capacitors are used in electronic circuits to store electrical energy, while magnetic ceramics are used in microwave devices and magnetic storage media.Overall, ceramics have a wide range of applications due to their unique properties. Whether it's in machinery, construction, electronics, or aerospace, ceramics play a vital role in modern technology.中文：陶瓷在历史上被用于各种用途，从制作陶器和瓷器到建筑材料甚至航天飞船热盾。

材料科学与工程专业英语课文自己整理的可以打印匡少平王世颖第二版化学工业出版社

Unit 1Materials are probably more deep-seated in our culture than most of us realize. Transportation, housing, clothing, communication, recreation, and food production— virtually every segment of our everyday lives is influenced to one degree or another by materials. Historically, the development and advancement of societies have been intimately tied to the members’ ability to produce and manipulate materials to fill their needs. In fact, early civilizations have been designated by the level of their materials development (Stone Age, Bronze Age, Iron Age).1The earliest humans had access to only a very limited number of materials, those that occur naturally: stone, wood, clay, skins, and so on. With time they discovered techniques for producing materials that had properties superior to those of the natural ones; these new materials included pottery and various metals. Furthermore, it was discovered that the properties of a material could be altered by heat treatments and by the addition of other substances. At this point, materials utilization was totally a selection process that involved deciding from a given, rather limited set of materials the one best suited for an application by virtue of its characteristics. It was not until relatively recent times that scientists came to understand the relationships between the structural elements of materials and their properties. This knowledge, acquired over approximately the past 100 years, has empowered them to fashion, to a large degree, the characteristics of materials. Thus, tens of thousands of different materials have evolved with rather specialized characteristics that meet the needs of our modern and complex society; these include metals, plastics, glasses, and fibers.The development of many technologies that make our existence so comfortable has been intimately associated with the accessibility of suitable materials. An advancement in the understanding of a material type is often the forerunner to the stepwise progression of a technology. For example, automobiles would not have been possible without the availability of inexpensive steel or some other comparable substitute. In our contemporary era, sophisticated electronic devices rely on components that are made from what are called semiconducting materials.MATERIALS SCIENCE AND ENGINEERINGSometimes it is useful to subdivide the discipline of materials science and engineering into materials science and materials engineering sub disciplines. Strictly speaking, “materials science” involves investigating the relationships that exist between the structures and properties of materials. In contrast, “materials engineering” is, on the basis of these structure–property correlations, designing or engineering the structure of a material to produce a predetermined set of properties.2 From a functional perspective, the role of a materials scientist is to develop or synthesize new materials, whereas a materials engineer is called upon to create new products or systems using existing materials, and/or to develop techniques for processing materials. Most graduates in materials programs are trained to be both materials scientists and materials engineers.“Structure” is at this point a nebulous term that des erves some explanation. In brief, the structure of a materialusually relates to the arrangement of its internal components. Subatomic structure involves electrons within the individual atoms and interactions with their nuclei. On an atomic level, structure encompasses the organization of atoms or molecules relative to one another. The next larger structural realm, which contains large groups of atoms that are normally agglomerated together, is termed “microscopic,” meaning that which is subject to direct o bservation using some type of microscope. Finally, structural elements that may be viewed with the naked eye are termed “macroscopic.”The notion of “property” deserves elaboration. While in service use, all materials are exposed to external stimuli that evoke some type of response. For example, a specimen subjected to forces will experience deformation, or a polished metal surface will reflect light. A property is a material trait in terms of the kind and magnitude of response to a specific imposed stimulus. Generally, definitions of properties are made independent of material shape and size.Virtually all important properties of solid materials may be grouped into six different categories: mechanical, electrical, thermal, magnetic, optical, and deteriorative. For each there is a characteristic type of stimulus capable of provoking different responses. Mechanical properties relate deformation to an applied load or force; examples include elastic modulus and strength. For electrical properties, such as electrical conductivity and dielectric constant, the stimulus is an electric field. The thermal behavior of solids can be represented in terms of heat capacity and thermal conductivity. Magnetic properties demonstrate the response of a material to the application of a magnetic field. For optical properties, the stimulus is electromagnetic or light radiation; index of refraction and reflectivity are representative optical properties. Finally, deteriorative characteristics relate to the chemical reactivity of materials. The chapters that follow discuss properties that fall within each of these six classifications.In addition to structure and properties, two other important components are involved in the science and engineering of materials—namely, “processing” a nd “performance. “With regard to the relationships of these four components, the structure of a material will depend on how it is processed. Furthermore, a material’s performance will be a function of its properties. Thus, the interrelationship between processing, structure, properties, and performance is as depicted in the schematic illustration shown in Figure 1.1. Throughout this text we draw attention to the relationships among these four components in terms of the design, production, and utilization of materialsWHY STUDY MATERIALS SCIENCE AND ENGINEERING?Why do we study materials? Many an applied scientist or engineer, whether mechanical, civil, chemical, or electrical, will at one time or another be exposed to a design problem involving materials. Examples might include a transmission gear, the superstructure for a building, an oil refinery component, or an integrated circuit chip. Of course, materials scientists and engineers are specialists who are totally involved in the investigation and design of materials.Many times, a materials problem is one of selecting the right material from the many thousands that are available. There are several criteria on which the final decision is normally based. First of all, the in-service conditions must be characterized, for these will dictate the properties required of the material. On only rare occasions does a materialpossess the maximum or ideal combination of properties. Thus, it may be necessary to trade off one characteristic for another. The classic example involves strength and ductility; normally, a material having a high strength will have only a limited ductility. In such cases a reasonable compromise between two or more properties may be necessary.A second selection consideration is any deterioration of material properties that may occur during service operation. For example, significant reductions in mechanical strength may result from exposure to elevated temperatures or corrosive environments. Finally, probably the overriding consideration is that of economics: What will the finished product cost? A material may be found that has the ideal set of properties but is prohibitively expensive. Here again, some compromise is inevitable. The cost of a finished piece also includes any expense incurred during fabrication to produce the desired shape.The more familiar an engineer or scientist is with the various characteristics and structure–property relationships, as well as processing techniques of materials, the more proficient and confident he or she will be to make judicious materials choices based on these criteria.U n i t2CLASSIFICATION OF MATERIALSSolid materials have been conveniently grouped into three basic classifications: metals, ceramics, and polymers. This scheme is based primarily on chemical makeup anatomic structure, and most materials fall into one distinct grouping or another, although there are some intermediates. In addition, there are the composites, combinations of two or more of the above three basic material classes. Another classification is advanced materials—those used in high-technology applications—viz. semiconductors, biomaterials, smart materials, and nanoengineered materials;MetalsMaterials in this group are composed of one or more metallic elements (such as iron, aluminum, copper, titanium, gold, and nickel), and often also nonmetallic elements (for example, carbon, nitrogen, and oxygen) in relatively small amounts.3 Atoms in metals and their alloys are arranged in a very orderly manner (as discussed in Chapter 3),and in comparison to the ceramics and polymers, are relatively dense (Figure 1.3).With regard to mechanical characteristics, these materials are relatively stiff (Figure 1.4)and strong (Figure 1.5), yet are ductile (i.e., capable of large amounts of deformation without fracture), and are resistant to fracture (Figure 1.6), which accounts for their widespread use in structural applications. Metallic materials have large numbers of nonlocalized electrons; that is, these electrons are not bound to particular atoms .Many properties of metals are directly attributable to these electrons. For example, metals are extremely good conductors of electricity (Figure 1.7) and heat, and are not transparent to visible light; a polished metal surface has a lustrous appearance. In addition, some of the metals (viz., Fe, Co, and Ni) have desirable magnetic properties.CeramicsCeramics are compounds between metallic and nonmetallic elements; they are most frequently oxides, nitrides, and carbides. For example, some of the common ceramic materials include aluminum oxide (or alumina, Al2O3), silicon dioxide (or silica, SiO2), silicon carbide (Sic), silicon nitride (Si3N4), and, in addition, what some refer to as the traditional ceramics—those composed of clay minerals (i.e., porcelain), as well as cement, and glass. With regard to mechanical behavior, ceramic materials are relatively stiff and strong—stiffnesses and strengths are comparable to those of the metals (Figures 1.4 and 1.5). In addition, ceramics are typically very hard. On the other hand, they are extremely brittle (lack ductility), and are highly susceptible to fracture (Figure 1.6). These materials are typically insulative to the passage of heat and electricity (i.e., have low electrical conductivities, Figure 1.7), and are more resistant to high temperatures and harsh environments than metals and polymers. With regard to optical characteristics, ceramics may be transparent, translucent, or opaque (Figure1.2), and some of the oxide ceramics (e.g., Fe3O4) exhibit magnetic behavior.PolymersPolymers include the familiar plastic and rubber materials. Many of them are organic compounds that are chemically based on carbon, hydrogen, and other nonmetallic elements (vision, N, and Si). Furthermore, they have very large molecular structures, often chain-like in nature that have a backbone of carbon atoms. Some of the common and familiar polymers are polyethylene (PE), nylon, poly (vinyl chloride) (PVC), polycarbonate (PC), polystyrene (PS), and silicone rubber. These materials typically have low densities (Figure 1.3), whereas their mechanical characteristics are generally dissimilar to the metallic and ceramic materials—they are not as stiff nor as strong as these other material types (Figures 1.4 and 1.5). However, on the basis of their low densities, many times their stiffness’s and strengths on a per mass basis are comparable to the metals and ceramics. In addition, many of the polymers are extremely ductile and pliable (i.e., plastic), which means they are easily formed into complex shapes. In general, they are relatively inert chemically and unreactive in a large number of environments. One major drawback to the polymers is their tendency to soften and/or decompose at modest temperatures, which, in some instances, limits their use. Furthermore, they have low electrical conductivities (Figure1.7) and are nonmagnetic.CompositesA composite is composed of two (or more) individual materials, which come from the categories discussed above—viz., metals, ceramics, and polymers. The design goal of a composite is to achieve a combination of properties that is not displayed by any single material, and also to incorporate the best characteristics of each of the component materials. A large number of composite types exist that are represented by different combinations of metals, ceramics, and polymers. Furthermore, some naturally-occurring materials are also considered to be composites—for example, wood and bone. However, most of those we consider in our discussions are synthetic (or man-made) composites.ADVANCED MATERIALSMaterials that are utilized in high-technology (or high-tech) applications are sometimes termed advanced materials.By high technology we mean a device or product that operates or functions using relatively intricate and sophisticated principles; examples include electronic equipment (camcorders, CD/DVD players, etc.), computers, fiber-optic systems, spacecraft, aircraft, and military rocketry. These advanced materials are typically traditional materials whose properties have been enhanced, and, also newly developed, high-performance materials. Furthermore, they may be of all material types (e.g., metals, ceramics, polymers), and are normally expensive. Advanced materials include semiconductors, biomaterials, and what we may term “materials of the future” (that is, smart materials and Nan engineered materials) SemiconductorsSemiconductors have electrical properties that are intermediate between the electrical conductors (viz. metals and metal alloys) and insulators (viz. ceramics and polymers)—Figure 1.7. Furthermore, the electrical characteristics of these materials are extremely sensitive to the presence of minute concentrations of impurity atoms, for which the concentrations may be controlled over very small spatial regions. Semiconductors have made possible the advent of integrated circuitry that has totally revolutionized the electronics and computer industries (not to mention our lives) over the past three decades.BiomaterialsBiomaterials are employed in components implanted into the human body for replacement of diseased or damaged body parts. These materials must not produce toxic substances and must be compatible with body tissues (i.e., must not cause adverse biological reactions). All of the above materials—metals, ceramics, polymers, composites, and semiconductors—may be used as biomaterials. For example, some of the biomaterials that are utilized in artificial hip replacementsMaterials of the FutureSmart MaterialsSmart (or intelligent) materials are a group of new and state-of-the-art materials now being developed that will have a significant influence on many of our technologies. The adjective “smart” implies that these materials are able to sense changes in their environments and then respond to these changes in predetermined manners—traits that are also found in living organisms. In addition, this “smart” concept is being extended to rather sophisticated systems that consist of both smart and traditional materials. Components of a smart material (or system) include some type of sensor (that detects an input signal), and an actuator (that performs a responsive and adaptive function). Actuators may be called upon to change shape, position, natural frequency, or mechanical characteristics in response to changes in temperature, electric fields, and/or magnetic fields. Four types of materials are commonly used for actuators: shape memory alloys, piezoelectric ceramics, magnetostrictive materials, and electrorheological/magnetorheological fluids. Shape memory alloys are metals that, after having been deformed, revert back to their original shapes when temperature is changed (see the Materials of Importance piece following Section 10.9). Piezoelectric ceramics expand and contract in response to an applied electric field (or voltage); conversely, they also generate an electric field when their dimensions are altered (see Section18.25).The behavior of magnetostrictive materials is analogous to that of the piezoelectric, except that they are responsive to magnetic fields. Also, electro rheological and magnetorheological fluids are liquids that experience dramatic changes in viscosity upon the application of electric and magnetic fields, respectively.Materials/devices employed as sensors include optical fibers (Section 21.14), piezoelectric materials (including some polymers), and microelectromechanical devices (MEMS, Section 13.8).For example, one type of smart system is used in helicopters to reduce aerodynamic cockpit noise that is created by the rotating rotor blades. Piezoelectric sensors inserted into the blades monitor blade stresses and deformations; feedback signals from these sensors are fed into a computer-controlled adaptive device, which generates noise-canceling antinomies.Nanoengineered MaterialsUntil very recent times the general procedure utilized by scientists to understand the chemistry and physics of materials has been to begin by studying large and complex structures, and then to investigate the fundamental building blocks of these structures that are smaller and simpler. This approach is sometimes termed “top down “science. However, with the advent of scanning probe microscopes (Section4.10), which permit observation of individual atoms and molecules, it has become possible to manipulate and move atoms and molecules to form new structures and, thus, design new materials that are built from simple atomic-level constituents(i.e., “materials by design”). This ability to carefully arrange atoms provides opportunities to develop mechanical, electrical, magnetic, and other properties that are not otherwise possible. We call this the “bottom-up” approach, and the study of the properties of these materials is termed “nanotechnology”; the “nan” prefix denotes that the dimensions of these structural entities are on the order of a nanometer (10_9 m)—as a rule, less than 100 nanometers (equivalent to approximately 500atom diameters).5 One example of a material of this type is the carbon nanotube, discussed in Section 12.4. In the future we will undoubtedly find that increasingly more of our technological advances will utilize these nanengineered materials.Unit 4Physical properties are those that can be observed without changing the identity of the substance. The general properties of matter such as color, density, hardness, are examples of physical properties. Properties that describe how a substance changes into a completely different substance are called chemical properties. Flammability andcorrosion/oxidation resistance are examples of chemical properties.The difference between a physical and chemical property is straightforward until the phase of the material is considered. When a material changes from a solid to a liquid to a vapor it seems like them become a difference substance. However, when a material melts, solidifies, vaporizes, condenses or sublimes, only the state of the substance changes.Consider ice, liquid water, and water vapor, they are all simply H2O. Phase is a physical property of matter and matter can exist in four phases – solid, liquid, gas and plasma.Some of the more important physical and chemical properties from an engineering material standpoint will be discussed in the following sections.•Phase Transformation Temperatures•Density•Specific Gravity•Thermal Conductivity•Linear Coefficient of Thermal Expansion•Electrical Conductivity and Resistivity•Magnetic Permeability•Corrosion ResistancePhase Transformation TemperaturesWhen temperature rises and pressure is held constant, a typical substance changes from solid to liquid and then to vapor. Transitions from solid to liquid, from liquid to vapor, from vapor to solid and visa versa are called phase transformations or transitions. Since some substances have several crystal forms, technically there can also be solid to another solid form phase transformation.Phase transitions from solid to liquid, and from liquid to vapor absorb heat. The phase transition temperature where a solid changes to a liquid is called the melting point. The temperature at which the vapor pressure of a liquid equals 1 atm (101.3 kPa) is called the boiling point. Some materials, such as many polymers, do not go simply from a solid to a liquid with increasing temperature. Instead, at some temperature below the melting point, they start to lose their crystalline structure but the molecules remain linked in chains, which results in a soft and pliable material. The temperature at which a solid, glassy material begins to soften and flow is called the glass transition temperature.DensityMass can be thinly distributed as in a pillow, or tightly packed as in a block of lead. The space the mass occupies is its volume, and the mass per unit of volume is its density.Mass (m) is a fundamental measure of the amount of matter. Weight (w) is a measure of the force exerted by a mass and this force is force is produced by the acceleration of gravity. Therefore, on the surface of the earth, the mass of an object is determined by dividing the weight of an object by 9.8 m/s2 (the acceleration of gravity on the surface of the earth). Since we are typically comparing things on the surface of the earth, the weight of an object is commonly used rather than calculating its mass.The density (r) of a material depends on the phase it is in and the temperature. (The density of liquids and gases is very temperature dependent.) Water in the liquid state has a density of 1 g/cm3 = 1000kg/m3 at 4o C. Ice has a density of 0.917 g/cm3 at 0o c, and it should be noted that this decrease in density for the solid phase is unusual. For almost all other substances, the density of the solid phase is greater than that of the liquid phase. Water vapor (vapor saturated air) has a density of 0.051 g/cm3.Some common units used for expressing density are grams/cubic centimeter, kilograms/cubic meter, grams/milliliter, grams/liter, pounds for cubic inch and pounds per cubic foot; but it should be obvious that any unit of mass per any unit of volume can be used.Substance Density(g/cm3)Air 0.0013Gasoline 0.7Wood 0.85Water (ice) 0.92Water (liquid) 1.0Aluminum 2.7Steel 7.8Silver 10.5Lead 11.3Mercury 13.5Gold 19.3Specific GravitySpecific gravity is the ratio of density of a substance compared to the density of fresh water at 4°C (39° F). At this temperature the density of water is at its greatest value and equal 1 g/mL. Since specific gravity is a ratio, so it has no units. An object will float in water if its density is less than the density of water and sink if its density is greater that that ofwater. Similarly, an object with specific gravity less than 1 will float and those with a specific gravity greater than one will sink. Specific gravity values for a few common substances are: Au, 19.3; mercury, 13.6; alcohol, 0.7893; benzene, 0.8786. Note that since water has a density of 1 g/cm3, the specific gravity is the same as the density of the material measured in g/cm3.Magnetic PermeabilityMagnetic permeability or simply permeability is the ease with which a material can be magnetized. It is a constant of proportionality that exists between magnetic induction and magnetic field intensity. This constant is equal to approximately 1.257 x 10-6 Henry per meter (H/m) in free space (a vacuum). In other materials it can be much different, often substantially greater than the free-space value, which is symbolized µ0.Materials that cause the lines of flux to move farther apart, resulting in a decrease in magnetic flux density compared with a vacuum, are called diamagnetic. Materials that concentrate magnetic flux by a factor of more than one but less than or equal to ten are called paramagnetic; materials that concentrate the flux by a factor of more than ten are called ferromagnetic. The permeability factors of some substances change with rising or falling temperature, or with the intensity of the applied magnetic field.In engineering applications, permeability is often expressed in relative, rather than in absolute, terms. If µ o represents the permeability of free space (that is, 4p X10-7H/m or 1.257 x 10-6 H/m) and µ represents the permeability of the substance in question (also specified in henrys per meter), then the relative permeability, µr, is given by:µr = µ / µ0For non-ferrous metals such as copper, brass, aluminum etc., the permeability is the same as that of "free space", i.e. the relative permeability is one. For ferrous metals however the value of µ r may be several hundred. Certain ferromagnetic materials, especially powdered or laminated iron, steel, or nickel alloys, have µr that can range up to about 1,000,000. Diamagnetic materials have µr less than one, but no known substance has relative permeability much less than one. In addition, permeability can vary greatly within a metal part due to localized stresses, heating effects, etc.When a paramagnetic or ferromagnetic core is inserted into a coil, the inductance is multiplied by µr compared with the inductance of the same coil with an air core. This effect is useful in the design of transformers and eddy current probes.Unit 5The mechanical properties of a material are those properties that involve a reaction to an applied load. The mechanical properties of metals determine the range of usefulness of a material and establish the service life that can be expected. Mechanical properties are also used to help classify and identify material. The most common properties considered are strength, ductility, hardness, impact resistance, and fracture toughness.Most structural materials are anisotropic, which means that their material properties vary with orientation. The variation in properties can be due to directionality in the microstructure (texture) from forming or cold working operation, the controlled alignment of fiber reinforcement and a variety of other causes. Mechanical properties are generally specific to product form such as sheet, plate, extrusion, casting, forging, and etc. Additionally, it is common to see mechanical property listed by the directional grain structure of the material. In products such as sheet and plate, the rolling direction is called the longitudinal direction, the width of the product is called the transverse direction, and the thickness is called the short transverse direction. The grain orientations in standard wrought forms of metallic products are shown the image.The mechanical properties of a material are not constants and often change as a function of temperature, rate of loading, and other conditions. For example, temperatures below room temperature generally cause an increase in strength properties of metallic alloys; while ductility, fracture toughness, and elongation usually decrease. Temperatures above room temperature usually cause a decrease in the strength properties of metallic alloys. Ductility may increase or decrease with increasing temperature depending on the same variablesIt should also be noted that there is often significant variability in the values obtained when measuring mechanical properties. Seemingly identical test specimen from the same lot of material will often produce considerable different results. Therefore, multiple tests are commonly conducted to determine mechanical properties and values reported can be an average value or calculated statistical minimum value. Also, a range of values are sometimes reported in order to show variability.LoadingThe application of a force to an object is known as loading. Materials can be subjected to many different loading scenarios and a material’s performance is dependant on the loading conditions. There are five fundamental loadin g conditions; tension, compression, bending, shear, and torsion. Tension is the type of loading in which the two sections of material on either side of a plane tend to be pulled apart or elongated. Compression is the reverse of tensile loading and involves pressing the material together. Loading by bending involves applying a load in a manner that causes a material。

金属材料英文词汇[整理]

【推荐】金属材料词汇物料科学Material Science物料科学定义Material Science Definition加工性能Machinability强度Strength抗腐蚀及耐用Corrosion & resistance durability金属特性Special metallic features抗敏感及环境保护Allergic, re-cycling & environmental protection化学元素Chemical element元素的原子序数Atom of Elements原子及固体物质Atom and solid material原子的组成、大小、体积和单位图表The size, mass, charge of an atom, and is particles (Pronton,Nentron and Electron) 原子的组织图Atom Constitutes周期表Periodic Table原子键结Atom Bonding金属与合金 Metal and Alloy铁及非铁金属Ferrous & Non Ferrous Metal金属的特性Features of Metal晶体结构 Crystal Pattern晶体结构，定向格子及单位晶格Crystal structure, Space lattice & Unit cellX线结晶分析法X – ray crystal analyics method金属结晶格子 Metal space lattice格子常数 Lattice constant米勒指数 Mill's Index金相及相律 Metal Phase and Phase Rule固熔体 Solid solution置换型固熔体 Substitutional type solid solution插入型固熔体 Interstital solid solution金属间化物 Intermetallic compound金属变态Transformation变态点Transformation Point磁性变态Magnetic Transformation同素变态Allotropic Transformation合金平衡状态Thermal Equilibrium相律Phase Rule自由度Degree of freedom临界温度Critical temperture共晶Eutectic包晶温度 Peritectic Temperature包晶反应 Peritectic Reaction包晶合金 Peritectic Alloy亚共晶体 Hypoeutetic Alloy过共晶体 Hyper-ectectic Alloy金属的相融、相融温度、晶体反应及合金在共晶合金、固熔孻共晶合金及偏晶反应的比较Equilibrium Comparision金属塑性 Plastic Deformation滑动面 Slip Plan畸变 Distortion硬化 Work Hardening退火 Annealing回复柔软 Crystal Recovery再结晶 Recrystallization金属材料的性能及试验Properties & testing of metal化学性能Chemical Properties物理性能Physical Properties颜色Colour磁性Magnetisum比电阻Specific resistivity & specific resistance比重Specific gravity & specific density比热Specific Heat热膨胀系数Coefficient of thermal expansion导热度Heat conductivity机械性能 Mechanical properties屈服强度(降伏强度) (Yield strangth)弹性限度、阳氏弹性系数及屈服点elastic limit, Yeung's module of elasticity to yield point 伸长度Elongation断面缩率Reduction of area金属材料的试验方法The Method of Metal inspection不破坏检验Non – destructive inspections渗透探伤法Penetrate inspection磁粉探伤法Magnetic particle inspection放射线探伤法Radiographic inspection超声波探伤法Ultrasonic inspection显微观察法Microscopic inspection破坏的检验Destructive Inspection冲击测试Impact Test疲劳测试Fatigue Test潜变测试 Creep Test潜变强度Creeps Strength第壹潜变期Primary Creep第二潜变期Secondary Creep第三潜变期Tertiary Creep主要金属元素之物理性质Physical properties of major Metal Elements工业标准及规格–铁及非铁金属Industrial Standard – Ferrous & Non – ferrous Metal磁力 Magnetic简介 General软磁 Soft Magnetic硬磁 Hard Magnetic磁场 Magnetic Field磁性感应 Magnetic Induction透磁度 Magnetic Permeability磁化率 Magnetic Susceptibility (Xm)磁力(Magnetic Force)及磁场(Magnetic Field)是因物料里的电子(Electron)活动而产生抗磁体、顺磁体、铁磁体、反铁磁体及亚铁磁体Diamagnetism, Paramagnetic, Ferromagnetism,Antiferromagnetism & Ferrimagnetism 抗磁体 Diamagnetism磁偶极子 Dipole负磁力效应 Negative effect顺磁体 Paramagnetic正磁化率 Positive magnetic susceptibility铁磁体 Ferromagnetism转变元素 Transition element交换能量 Positive energy exchange外价电子 Outer valence electrons化学结合 Chemical bond自发上磁 Spontaneous magnetization磁畴 Magnetic domain相反旋转 Opposite span比较抗磁体、顺磁体及铁磁体Comparison of Diamagnetism, Paramagnetic & Ferromagnetism反铁磁体 Antiferromagnetism亚铁磁体 Ferrimagnetism磁矩 magnetic moment净磁矩 Net magnetic moment钢铁的主要成份The major element of steel钢铁用"碳"之含量来分类Classification of Steel according to Carbon contents 铁相Steel Phases钢铁的名称Name of steel纯铁体Ferrite渗碳体Cementitle奥氏体 Austenite珠光体及共释钢Pearlite &Eutectoid奥氏体碳钢Austenite Carbon Steel单相金属Single Phase Metal共释变态Eutectoid Transformation珠光体 Pearlite亚铁释体Hyppo-Eutectoid初释纯铁体 Pro-entectoid ferrite过共释钢 Hype-eutectoid珠光体Pearlite粗珠光体 Coarse pearlite中珠光体 Medium pearlite幼珠光体 Fine pearlite磁性变态点 Magnetic Transformation钢铁的制造Manufacturing of Steel连续铸造法 Continuous casting process电炉 Electric furnace均热炉 Soaking pit全静钢 Killed steel半静钢 Semi-killed steel沸腾钢(未净钢) Rimmed steel钢铁生产流程 Steel Production Flow Chart钢材的熔铸、锻造、挤压及延轧The Casting, Fogging, Extrusion, Rolling & Steel熔铸 Casting锻造 Fogging挤压 Extrusion延轧 Rolling冲剪 Drawing & stamping特殊钢 Special Steel简介General特殊钢以原素分类Classification of Special Steel according to Element特殊钢以用途来分类Classification of Special Steel according to End Usage 易车(快削)不锈钢Free Cutting Stainless Steel含铅易车钢Leaded Free Cutting Steel含硫易车钢Sulphuric Free Cutting Steel硬化性能Hardenability钢的脆性Brittleness of Steel低温脆性 Cold brittleness回火脆性 Temper brittleness日工标准下的特殊钢材Specail Steel according to JIS Standard铬钢–日工标准 JIS G4104Chrome steel to JIS G4104铬钼钢钢材–日工标准 G4105 62Chrome Molybdenum steel to JIS G4105镍铬–日工标准 G4102 63Chrome Nickel steel to JIS G4102镍铬钼钢–日工标准 G4103 64Nickel, Chrome & Molybdenum Steel to JIS G4103高锰钢铸–日工标准High manganese steel to JIS standard片及板材Chapter Four-Strip, Steel & Plate冷辘低碳钢片(双单光片)(日工标准 JIS G3141) 73 - 95 Cold Rolled (Low carbon) Steel Strip (to JIS G 3141)简介General美材试标准的冷辘低碳钢片Cold Rolled Steel Strip American Standard – American Society for testing and materials (ASTM)日工标准JIS G3141冷辘低碳钢片(双单光片)的编号浅释Decoding of cold rolled(Low carbon)steel strip JIS G3141材料的加工性能 Drawing abillity硬度 Hardness表面处理 Surface finish冷辘钢捆片及张片制作流程图表Production flow chart cold rolled steel coil sheet冷辘钢捆片及张片的电镀和印刷方法Cold rolled steel coil & sheet electro-plating & painting method冷辘(低碳)钢片的分类用、途、工业标准、品质、加热状态及硬度表End usages, industrial standard, quality, condition and hardness of cold rolled steel strip 硬度及拉力 Hardness & Tensile strength test拉伸测试(顺纹测试)Elongation test杯突测试(厚度: 0.4公厘至1.6公厘，准确至0.1公厘 3个试片平均数)Erichsen test (Thickness: 0.4mm to 1.6mm, figure round up to 0.1mm)曲面(假曲率)Camber厚度及阔度公差 Tolerance on Thickness & Width平坦度(阔度大于500公厘，标准回火)Flatness (width>500mm, temper: standard)弯度 Camber冷辘钢片储存与处理提示General advice on handling & storage of cold rolled steel coil & sheet防止生锈Rust Protection生锈速度表Speed of rusting焊接 Welding气焊 Gas Welding埋弧焊 Submerged-arc Welding电阻焊 Resistance Welding冷辘钢片(拉力: 30-32公斤/平方米)在没有表面处理状态下的焊接状况Spot welding conditions for bared (free from paint, oxides etc) Cold rolled mild steel sheets(T/S:30-32 Kgf/ μ m2)时间效应(老化)及拉伸应变Aging & Stretcher Strains日工标准(JIS G3141)冷辘钢片化学成份Chemical composition – cold rolled steel sheet to JIS G3141冷辘钢片的"理论重量"计算方程式Cold Rolled Steel Sheet – Theoretical mass日工标准(JIS G3141)冷辘钢片重量列表Mass of Cold-Rolled Steel Sheet to JIS G3141冷辘钢片订货需知Ordering of cold rolled steel strip/sheet其它日工标准冷轧钢片(用途及编号)JIS standard & application of other cold Rolled Special Steel电镀锌钢片或电解钢片Electro-galvanized Steel Sheet/Electrolytic Zinc Coated Steel Sheet简介General电解/电镀锌大大增强钢片的防锈能力Galvanic Action improving Weather & Corrosion Resistance of the Base Steel Sheet上漆能力 Paint Adhesion电镀锌钢片的焊接Welding of Electro-galvanized steel sheet点焊Spot welding滚焊Seam welding电镀锌(电解)钢片Electro-galvanized Steel Sheet生产流程Production Flow Chart常用的镀锌钢片(电解片)的基层金属、用途、日工标准、美材标准及一般厚度Base metal, application, JIS & ASTM standard, and Normal thickness of galvanized steel sheet锌镀层质量 Zinc Coating Mass表面处理 Surface Treatment冷轧钢片 Cold-Rolled Steel Sheet/Strip热轧钢片 Hot-Rolled Sheet/Strip电解冷轧钢片厚度公差Thickness Tolerance of Electrolytic Cold-rolled sheet热轧钢片厚度公差Thickness Tolerance of Hot-rolled sheet冷轧或热轧钢片阔度公差Width Tolerance of Cold or Hot-rolled sheet长度公差 Length Tolerance理论质量 Theoretical Mass锌镀层质量(两个相同锌镀层厚度)Mass Calculation of coating (For equal coating)/MM锌镀层质量(两个不同锌镀层厚度)Mass Calculation of coating (For differential coating)/MM镀锡薄铁片(白铁皮/马口铁) (日工标准 JIS G3303)简介General镀锡薄铁片的构造Construction of Electrolytic Tinplate镀锡薄钢片(白铁皮/马日铁)制造过程Production Process of Electrolytic Tinplate锡层质量Mass of Tin Coating (JIS G3303-1987)两面均等锡层Both Side Equally Coated Mass两面不均等锡层Both Side Different Thickness Coated Mass级别、电镀方法、镀层质量及常用称号Grade, Plating type, Designation of Coating Mass & Common Coating Mass 镀层质量标记Markings & Designations of Differential Coatings硬度 Hardness单相轧压镀锡薄铁片(白铁皮/马口铁)Single-Reduced Tinplate双相辗压镀锡薄钢片(马口铁/白铁皮)Dual-Reduction Tinplate钢的种类 Type of Steel表面处理 Surface Finish常用尺寸 Commonly Used Size电器用硅 [硅] 钢片 Electrical Steel Sheet简介 General软磁材料 Soft Magnetic Material滞后回线 Narrow Hystersis矫顽磁力 Coercive Force硬磁材料 Hard Magnetic Material最大能量积 Maximum Energy Product硅含量对电器用的低碳钢片的最大好处The Advantage of Using Silicon low Carbon Steel晶粒取向(Grain-Oriented)及非晶粒取向(Non-Oriented)Grain Oriented & Non-Oriented电器用硅 [硅] 钢片的最终用途及规格End Usage and Designations of Electrical Steel Strip电器用的硅 [硅] 钢片之分类Classification of Silicon Steel Sheet for Electrical Use电器用钢片的绝缘涂层Performance of Surface Insulation of Electrical Steel Sheets晶粒取向电器用硅钢片主要工业标准International Standard – Grain-Oriented Electrical Steel Silicon Steel Sheet for Electrical Use晶粒取向电器用硅钢片 Grain-Oriented Electrical Steel晶粒取向，定取向芯钢片及高硼定取向芯钢片之磁力性能及夹层系数(日工标准及美材标准)Magnetic Properties and Lamination Factor of SI-ORIENT-CORE& SI-ORIENT-CORE-HI B Electrical Steel Strip (JIS and AISI Standard)退火Annealing电器用钢片用家需自行应力退火原因Annealing of the Electrical Steel Sheet退火时注意事项 Annealing Precautionary碳污染 Prevent Carbon Contamination热力应先从工件边缘透入Heat from the Laminated Stacks Edges提防过份氧化No Excessive Oxidation应力退火温度Stress –relieving Annealing Temperature晶粒取向电器用硅 [硅] 钢片–高硼(HI-B)定取向芯钢片及定取向芯钢片之机械性能及夹层系数Mechanical Properties and Lamination Factors of SI-ORIENT-CORE-HI-B and SI-ORIENT-CORE Grain Orient Electrical Steel Sheets晶粒取向电器用硅 [硅] 钢;片–高硼低硫(LS)定取向钢片之磁力及电力性能Magnetic and Electrical Properties of SI-ORIENT-CORE-HI-B-LS晶粒取向电器用硅 [硅] 钢片–高硼低硫(LS) 定取向钢片之机械性能及夹层系数Mechanical Properties and Lamination Factors of SI-ORIENT-CORE-HI-B-LS晶粒取向电器用硅(硅)钢片-高硼(HI-B)定取向芯钢片，定取向芯钢片及高硼低硫(LS)定取向芯钢片之厚度及阔度公差Physical Tolerance of SI-ORIENT-CORE-HI-B, SI-ORIENT-CORE, & SI-CORE-HI-B-LS GrainOriented Electrical Steel Sheets晶粒取向电器用硅(硅)钢片–高硼(HI-B)定取向芯钢片，定取向芯钢片及高硼低硫(LS)定取向芯钢片之标准尺寸及包装Standard Forms and Size of SI-ORIENT-CORE-HI-B,SI-CORE, & SI-ORIENT-CORE-HI-B-LS Grain-Oriented Electrical Steel Sheets绝缘表面 Surface Insulation非晶粒取向电力用钢片的电力、磁力、机械性能及夹层系数Lamination Factors of Electrical, Magnetic & Mechanical Non-Grain Oriented Electrical 电器及家电外壳用镀层冷辘 [低碳] 钢片Coated (Low Carbon) Steel Sheets for Casing,Electricals & Home Appliances镀铝硅钢片 Aluminized Silicon Alloy Steel Sheet简介 General镀铝硅合金钢片的特色Feature of Aluminized Silicon Alloy Steel Sheet用途End Usages抗化学品能力Chemical Resistance镀铝(硅)钢片–日工标准(JIS G3314)Hot-aluminum-coated sheets and coils to JIS G 3314镀铝(硅)钢片–美材试标准(ASTM A-463-77)35.7 JIS G3314镀热浸铝片的机械性能Mechanical Properties of JIS G 3314 Hot-Dip Aluminum-coated Sheets and Coils公差 Size Tolerance镀铝(硅)钢片及其它种类钢片的抗腐蚀性能比较Comparsion of various resistance of aluminized steel & other kinds of steel镀铝(硅)钢片生产流程Aluminum Steel Sheet, Production Flow Chart焊接能力 Weldability镀铝钢片的焊接状态(比较冷辘钢片)Tips on welding of Aluminized sheet in comparasion with cold rolled steel strip钢板Steel Plate钢板用途分类及各国钢板的工业标准包括日工标准及美材试标准Type of steel Plate & Related JIS, ASTM and Other Major Industrial Standards钢板生产流程Production Flow Chart钢板订货需知Ordering of Steel Plate不锈钢Stainless Steel不锈钢的定义 Definition of Stainless Steel不锈钢之分类，耐腐蚀性及耐热性Classification, Corrosion Resistant & Heat Resistance of Stainless Steel铁铬系不锈钢片Chrome Stainless Steel马氏体不锈钢Martensite Stainless Steel低碳马氏体不锈钢Low Carbon Martensite Stainless Steel含铁体不锈钢Ferrite Stainless Steel镍铬系不锈钢Nickel Chrome Stainless Steel释出硬化不锈钢Precipitation Hardening Stainless Steel铁锰铝不锈钢Fe / Mn / Al / Stainless Steel不锈钢的磁性Magnetic Property & Stainless Steel不锈钢箔、卷片、片及板之厚度分类Classification of Foil, Strip, Sheet & Plate by Thickness表面保护胶纸Surface protection film不锈钢片材常用代号Designation of SUS Steel Special Use Stainless表面处理 Surface finish薄卷片及薄片(0.3至2.9mm厚之片)机械性能Mechanical Properties of Thin Stainless Steel(Thickness from 0.3mm to 2.9mm) –strip/sheet不锈钢片机械性能(301, 304, 631, CSP)Mechanical Properties of Spring use Stainless Steel不锈钢–种类，工业标准，化学成份，特点及主要用途Stainless Steel – Type, Industrial Standard, Chemical Composition, Characteristic & end usage of the most commonly used Stainless Steel不锈钢薄片用途例End Usage of Thinner Gauge不锈钢片、板用途例Examples of End Usages of Strip, Sheet & Plate不锈钢应力退火卷片常用规格名词图解General Specification of Tension Annealed Stainless Steel Strips耐热不锈钢Heat-Resistance Stainless Steel镍铬系耐热不锈钢特性、化学成份、及操作温度Heat-Resistance Stainless Steel铬系耐热钢Chrome Heat Resistance Steel镍铬耐热钢Ni - Cr Heat Resistance Steel超耐热钢Special Heat Resistance Steel抗热超级合金Heat Resistance Super Alloy耐热不锈钢比重表Specific Gravity of Heat – resistance steel plates and sheets stainless steel不锈钢材及耐热钢材标准对照表Stainless and Heat-Resisting Steels发条片 Power Spring Strip发条的分类及材料Power Spring Strip Classification and Materials上链发条 Wind-up Spring倒后擦发条 Pull Back Power Spring圆面("卜竹")发条 Convex Spring Strip拉尺发条 Measure Tape魔术手环 Magic Tape魔术手环尺寸图Drawing of Magic Tap定型发条 Constant Torque Spring定型发条及上炼发条的驱动力Spring Force of Constant Torque Spring and Wing-up Spring定型发条的形状及翻动过程Shape and Spring Back of Constant Torque Spring定型发条驱动力公式及代号The Formula and Symbol of Constant Torque Spring边缘处理 Edge Finish硬度 Hardness高碳钢化学成份及用途High Carbon Tool Steel, Chemical Composition and Usage每公斤发条的长度简易公式The Length of 1 Kg of Spring Steel StripSK-5 & AISI-301 每公斤长的重量/公斤(阔100-200公厘) Weight per one meter long (kg) (Width 100-200mm)SK-5 & AISI-301 每公斤之长度(阔100-200公厘) Length per one kg (Width 100-200mm)SK-5 & AISI-301 每公尺长的重量/公斤(阔2.0-10公厘)Weight per one meter long (kg) (Width 2.0-10mm)SK-5 & AISI-301 每公斤之长度(阔2.0-10公厘)Length per one kg (Width 2.0-10mm)高碳钢片 High Carbon Steel Strip分类Classification用组织结构分类Classification According to Grain Structure用含碳量分类–即低碳钢、中碳钢及高碳钢Classification According to Carbon Contains弹簧用碳钢片CarbonSteel Strip For Spring Use冷轧状态 Cold Rolled Strip回火状态 Annealed Strip淬火及回火状态Hardened & Tempered Strip/ Precision – Quenched Steel Strip 贝氏体钢片 Bainite Steel Strip弹簧用碳钢片材之边缘处理 Edge Finished淬火剂Quenching Media碳钢回火 Tempering回火有低温回火及高温回火Low & High Temperature Tempering高温回火High Temperature Tempering退火 Annealing完全退火 Full Annealing扩散退火 Diffusion Annealing低温退火 Low Temperature Annealing中途退火 Process Annealing球化退火 Spheroidizing Annealing光辉退火 Bright Annealing淬火 Quenching时间淬火 Time Quenching奥氏铁孻回火 Austempering马氏铁体淬火 Marquenching高碳钢片用途 End Usage of High Carbon Steel Strip冷轧高碳钢–日本工业标准Cold-Rolled (Special Steel) Carbon Steel Strip to JIS G3311 电镀金属钢片 Plate Metal Strip简介 General电镀金属捆片的优点Advantage of Using Plate Metal Strip金属捆片电镀层Plated Layer of Plated Metal Strip镀镍 Nickel Plated镀铬 Chrome Plated镀黄铜 Brass Plated基层金属 Base Metal of Plated Metal Strip低碳钢或铁基层金属Iron & Low Carbon as Base Metal不锈钢基层金属 Stainless Steel as Base Metal铜基层金属Copper as Base Metal黄铜基层金属Brass as Base Metal轴承合金 Bearing Alloy简介General轴承合金–日工标准 JIS H 5401Bearing Alloy to JIS H 5401锡基、铅基及锌基轴承合金比较表Comparison of Tin base, Lead base and Zinc base alloy for Bearing purpose易溶合金 Fusible Alloy焊接合金 Soldering and Brazing Alloy软焊 Soldering Alloy软焊合金–日本标准 JIS H 4341Soldering Alloy to JIS H 4341硬焊 Brazing Alloy其它焊接材料请参阅日工标准目录Other Soldering Material细线材、枝材、棒材Chapter Five Wire, Rod & Bar线材/枝材材质分类及制成品Classification and End Products of Wire/Rod铁线(低碳钢线)日工标准 JIS G 3532Low Carbon Steel Wires ( Iron Wire ) to JIS G 3532光线(低碳钢线)，火线(退火低碳钢线)，铅水线 (镀锌低碳钢线)及制造钉用低碳钢线之代号、公差及备注Ordinary Low Carbon Steel Wire, Annealed Low Carbon Steel Wire, Galvanized low Carbon Steel Wire & Low Carbon Steel Wire for nail manufacturing - classification, Symbol of Grade, Tolerance and Remarks.机械性能Mechanical Properites锌包层之重量，铜硫酸盐试验之酸洗次数及测试用卷筒直径Weight of Zinc-Coating, Number of Dippings in Cupric Sulphate Test and Diameters of Mandrel Used for Coiling Test冷冲及冷锻用碳钢线枝Carbon Steel Wire Rods for Cold Heading & Cold Forging (to JIS G3507)级别，代号及化学成份Classification, Symbol of Grade and Chemical Composition直径公差，偏圆度及脱碳层的平均深度Diameter Tolerance, Ovality and Average Decarburized Layer Depth冷拉钢枝材Cold Drawn Carbon Steel Shafting Bar枝材之美工标准，日工标准，用途及化学成份AISI, JIS End Usage and Chemical Composition of Cold Drawn Carbon Steel Shafting Bar冷拉钢板重量表Cold Drawn Steel Bar Weight Table高碳钢线枝High Carbon Steel Wire Rod (to JIS G3506)冷拉高碳钢线Hard Drawn High Carbon Steel Wire(to JIS G3521, ISO-84580-1&2)化学成份分析表Chemical Analysis of Wire Rod线径、公差及机械性能(日本工业标准 G 3521)Mechanical Properties (JIS G 3521)琴线(日本标准 G3522)Piano Wires ( to G3522)级别，代号，扭曲特性及可用之线材直径Classes, symbols, twisting characteristic and applied Wire Diameters直径，公差及拉力强度Diameter, Tolerance and Tensile Strength裂纹之容许深度及脱碳层Permissible depth of flaw and decarburized layer常用的弹簧不锈钢线-编号，特性，表面处理及化学成份StainlessSpring Wire – National Standard number, Charateristic, Surface finish & Chemical composition弹簧不锈钢线，线径及拉力列表Stainless Spring Steel, Wire diameter and Tensile strength of Spring Wire处理及表面状况Finish & Surface各种不锈钢线在不同处理拉力比较表Tensile Strength of various kinds of Stainless Steel Wire under Different Finish圆径及偏圆度之公差Tolerance of Wire Diameters & Ovality铬镍不锈钢及抗热钢弹簧线材–美国材验学会 ASTM A313 – 1987Chromium – Nickel Stainless and Heat-resisting Steel Spring Wire – ASTM A313 –1987化学成份 Chemical Composition机械性能 Mechanical Properties305, 316, 321及347之拉力表Tensile Strength Requirements for Types 305, 316, 321 and 347A1S1-302 贰级线材之拉力表Tensile Strength of A1S1-302 Wire日本工业标准–不锈钢的化学成份(先数字后字母排列)JIS – Chemical Composition of Stainless Steel (in order of number & alphabet)美国工业标准–不锈钢及防热钢材的化学成份(先数字后字母排列)AISI – Chemical Composition of Stainless Steel & Heat-Resistant Steel(in order of number & alphabet)易车碳钢Free Cutting Carbon Steels (to JIS G4804 )化学成份 Chemical composition圆钢枝，方钢枝及六角钢枝之形状及尺寸之公差Tolerance on Shape and Dimensions for Round Steel Bar, Square Steel Bar, Hexagonal Steel Bar易车(快削)不锈钢 Free Cutting Stainless Steel易车(快削)不锈钢种类 Type of steel易车(快削)不锈钢拉力表Tensile Strength of Free Cutting Wires枝/棒无芯磨公差表(μ) (μ = 1/100 mm)Rod/Bar Centreless Grind Tolerance易车不锈钢及易车钢之不同尺寸及硬度比较Hardness of Different Types & Size of Free Cutting Steel扁线、半圆线及异形线Flat Wire, Half Round Wire, Shaped Wire and Precision Shaped Fine Wire加工方法Manufacturing Method应用材料Material Used特点Characteristic用途End Usages不锈钢扁线及半圆线常用材料Commonly used materials for Stainless Flat Wire & Half Round Wire扁线公差Flat Wire Tolerance方线公差Square Wire Tolerance。

Correlations among magnetic, electrical and magneto-transport properties of NiFe nanohole arrays

Home Search Collections Journals About Contact us My IOPscienceCorrelations among magnetic, electrical and magneto-transport properties of NiFe nanohole arraysThis article has been downloaded from IOPscience. Please scroll down to see the full text article.2013 J. Phys.: Condens. Matter 25 066007(/0953-8984/25/6/066007)View the table of contents for this issue, or go to the journal homepage for moreDownload details:IP Address: 202.207.14.58The article was downloaded on 12/03/2013 at 07:46Please note that terms and conditions apply.IOP P UBLISHING J OURNAL OF P HYSICS:C ONDENSED M ATTER J.Phys.:Condens.Matter25(2013)066007(9pp)doi:10.1088/0953-8984/25/6/066007Correlations among magnetic,electrical and magneto-transport properties of NiFe nanohole arraysD C Leitao1,J Ventura2,J M Teixeira2,C T Sousa2,S Pinto2,J B Sousa2,J M Michalik3,4,5,J M De Teresa3,4,5,M Vazquez6and J P Araujo21INESC-MN and IN,Rua Alves Redol9,1000-029Lisboa,Portugal2IFIMUP and IN,Departamento de F´ısica e Astronomia,Faculdade de Ciˆe ncias da Universidade doPorto,Rua do Campo Alegre,678,4169-007,Porto,Portugal3Instituto de Ciencia de Materiales de Aragon(ICMA),CSIC—Universidad de Zaragoza,E-50009Zaragoza,Spain4Laboratorio de Microcopias Avanzadas(LMA),Instituto de Nanociencia de Arag´o n(INA),Universidad de Zaragoza,E-50018Zaragoza,Spain5Departamento de F´ısica de la Materia Condensada,Universidad de Zaragoza,E-50009Zaragoza,Spain6Instituto de Ciencia de Materiales de Madrid CSIC,E-28049Madrid,SpainE-mail:dleitao@inesc-mn.ptReceived8August2012,inﬁnal form17December2012Published11January2013Online at /JPhysCM/25/066007AbstractIn this work,we use anodic aluminum oxide(AAO)templates to build NiFe magneticnanohole arrays.We perform a thorough study of their magnetic,electrical andmagneto-transport properties(including the resistance R(T),and magnetoresistance MR(T)),enabling us to infer the nanoholeﬁlm morphology,and the evolution from granular tocontinuousﬁlm with increasing thickness.In fact,different physical behaviors were observedto occur in the thickness range of the study(2nm<t<100nm).For t<10nm,aninsulator-to-metallic crossover was visible in R(T),pointing to a granularﬁlm morphology,and thus being consistent with the presence of electron tunneling mechanisms in themagnetoresistance.Then,for10nm<t<50nm a metallic R(T)allied with a largeranisotropic magnetoresistance suggests the onset of morphological percolation of the granularﬁlm.Finally,for t>50nm,a metallic R(T)and only anisotropic magnetoresistance behaviorwere obtained,characteristic of a continuous thinﬁlm.Therefore,by combining simplelow-cost bottom-up(templates)and top-down(sputtering deposition)techniques,we are ableto obtain customized magnetic nanostructures with well-controlled physical properties,showing nanohole diameters smaller than35nm.(Someﬁgures may appear in colour only in the online journal)1.IntroductionThe introduction of voids into a thinﬁlm signiﬁcantly alters the characteristics of the medium,leading to exotic and interesting physical properties.In fact,such voids can lead to quantum effects in the conductivity[1,2],enhanced optical transmission[3],artiﬁcial vortex pinning sites in superconductors[4]and magnonic crystals[5,6],facilitating research and technological applications.Regarding magnetic materials,the inclusion of these artiﬁcial defects becomes an easy way to engineer their properties at micrometer and nanometer scales[7,8].The voids alter the stray ﬁeld distribution(compared to a continuousﬁlm)and pin domain walls(DWs),thus inﬂuencing the coercivity and remanence[9,10]while at the same time tailoring the magnetization switching processes[11].Therefore,nanoholeFigure 1.AFM images of the (a)as-grown AAO substrate and (b)25nm thick NiFe nanohole array.arrays embedded in a magnetic thin ﬁlm have been pointed out as a promising route to obtaining future data storage media [7].The main advantage of these structures resides in the absence of the superparamagnetic limit for small bit size,since there is no isolated magnetic volume.Nowadays,researchers focus mainly on understanding the physical properties of nanohole arrays with nanometer dimensions,where the magnetic domain morphology and reversal processes are very much distinct from those of the widely studied micrometer-period structures [11–15].Studies on exchange-biased systems provide an example where the inter-hole distance (D int )and hole diameter (D h )can be comparable to the characteristic domain lengths of the ferromagnetic and/or antiferromagnetic layers [16,17].Nevertheless,the main challenge regarding such nm-size arrays still lies in the fabrication processes.Most of the published works rely on lithography-based processes such as electron-beam and lift-off [7],focused-ion-beam [16]and deep ultraviolet [18]methods.As an alternative,one may chose a bottom-up approach consisting of self-assembly procedures [19–21].One reliable method resorts to anodic aluminum oxide (AAO)as a pre-patterned substrate for template-assisted growth of the nanohole arrays,with major advantages regarding process simplicity and cost [12,13,9,22,23].In this work,we study in detail the magnetic,electrical and magneto-transport properties of NiFe nanohole arrays with thicknesses (t )ranging from 2to 100nm,sputter deposited on top of AAO.NiFe is a well-characterized alloy,with extensive literature concerning the magnetic and transport properties for continuous thin ﬁlms and micrometer-size nanohole arrays.It provides an excellent starting point for addressing different physical aspects such as the morphology of thin ﬁlms grown on top of nanopatterned and rough substrates such as AAO templates.In addition,NiFe is also relevant in a wide number of applications ranging from motor cores to magnetic recording [24,25].Using temperature dependent resistance (R (T ))and magnetoresistance (MR (T ))measurements together with room temperature magnetic characterizations (M (H )),we were able to address the morphology of the NiFe nanohole array.An evolution from an island-like morphology towards a continuous thin ﬁlm with increasing t was observed.Also,Hall resistivity (ρH )measurements show an increase of the planar Hall effectcontribution with thickness,here ascribed to the in-plane magnetic anisotropy induced during growth.2.Experimental detailsFor the growth of magnetic nanohole arrays we used anodic aluminum oxide (AAO)templates obtained by a standard two-step method of anodization of high-purity (99.997%)Al foils [26].After an electropolishing pre-treatment,the Al foils were anodized in a 0.3M oxalic acid solution at ∼4◦C and under an applied potential of 40V [27].The ﬁrst anodization was carried out for 24h while the second lasted 1h.These anodization conditions resulted in nanopores disposed in an ordered hexagonal lattice (ﬁgure 1(a)),with an average diameter of ∼35nm,separation of ∼105nm and length of ∼2.5µm.On top of the AAO we deposited a NiFe (80:20)thin ﬁlm using a 1160L four-target ion-beam deposition (IBD)system from Commonwealth Scientiﬁc Corporation with a base pressure of ∼8×10−7Torr [28].A beam voltage of 1000V and a beam current of 15mA were used,giving a NiFe deposition rate of 0.035nm s −1for an Ar ﬂow of 5sccm with the working pressure of ∼2×10−4Torr.During deposition a magnetic ﬁeld of 250Oe was applied in the sample plane,inducing an uniaxial magnetic easy axis.We varied the nominal thickness (t )of the NiFe thin ﬁlms within the 2nm ≤t ≤100nm range.Continuous control samples were also deposited on Si/SiO 2substrates in the same batch.The surface of the samples was analyzed with a low-vacuum FEI Quanta 400FEG scanning electron microscope (SEM)and a nanoscope multimode atomic force microscope (AFM)from Veeco Instruments operating in tapping mode.Magnetic characterization was performed with a commercial VSM magnetometer (KLA-Tencor EV7VSM)at room temperature.The measurements were performed with the magnetic ﬁeld applied in the sample’s plane,both parallel ( )and transverse (⊥)to the uniaxial direction induced during growth.In addition,temperature dependent magnetic properties (M (T ))were also studied with a Quantum Design SQUID magnetometer (5–350K)and the zero-ﬁeld-cooled/ﬁeld-cooled (ZFC/FC)curves were measured with a ﬁeld (H )of 50Oe applied along the growth-induced uniaxial direction.The R (T )and MR (T )measurements were performed with a pseudo-four-probe DC method from 20Figure2.(a)Average D h dependence on t showing a quasi-linear trend.(b)Gaussian distribution of D h sizes for the nanohole sample with t=30nm.SEM top-surface images of(c)AAO and(d)a30nm thick nanohole array.to300K and applied magneticﬁelds up to6kOe.The MR properties were characterized in the longitudinal( ) and transverse(⊥)geometries(with magneticﬁeld always applied in the sample’s plane)and the currentﬂowing parallel to the induced uniaxial direction.Electrical contacts were placed on the sides of the samples enclosing the width of the nanohole arrays,and deﬁned by sputtering using a shadow mask.ForρH measurements,the samples were patterned by optical lithography into a well-deﬁned geometry,consisting of a300µm electrode where currentﬂows,sided with pads for the measurement of voltage drop,and this allows one to minimize offset voltages in the Hall measurements[29].3.Experimental results3.1.Morphology of the nanohole arraysFigure1compares AFM topography images of the AAO substrate and a25nm thick NiFe nanohole array.As expected, the AAO hexagonal pattern is replicated by the thinﬁlm deposited on top.The latter grows mainly on the surface between the nanopores,giving rise to holes embedded in the continuousﬁlm[12,22].Furthermore,six hills(height of ∼10–15nm)surrounding each nanopore are also replicated by the coveringﬁlm.Figure2(a)displays the dependence of the hole diameter (D h)on the thickness(t)of the depositedﬁlm obtained from statistical analysis of SEM images(ﬁgures2(c)and (d)).For low t,the magneticﬁlm retains the size of the nanopores underneath;however,with increasing t,the hole diameter is reduced until a continuousﬁlm is formed.In fact,a quasi-linear D h(t)dependence is observed and a critical thickness of t c≈52nm can be extrapolated for the closure of the nanopores.The latter occurs due to deposition of material around the pore entrance which progressively leads to its closure.In fact,Rahman et al observed that for high-aspect-ratio AAO(like that used here),deposition occurs only on the top surface of the template[11,15].In addition,cross-section images revealed,in particular,closing of pores with conical-like features lying within the nanopore entrances[12–14].3.2.Magnetic propertiesFigure3shows the room temperature M(H)behavior for selected nanohole arrays and corresponding continuous thin ﬁlms(t=2,30and100nm).The continuousﬁlms show a squared easy-axis M(H)loop consistent with DW nucleation and propagation,while an almost linear M(H)is observed for the hard axis,ascribed to magnetization rotation(ﬁgures 3(a2)–(c2))[12].In contrast,the nanohole arrays display an almost isotropic M(H)behavior with an overall increase in coercivity(H c)and decrease in remanence(m r)(ﬁgures 3(a1)–(c1))[9,30],as predicted by the inclusion theory[31]. The inset ofﬁgure3(b1)displays the angular dependence of H c for the t=30nm sample.H c(θ)reveals a small change (∼4Oe)between the(expected growth-induced)easy and hard axes.In this case,the substantial roughness and particular topography of the AAO substrates are crucial and may lead to irregular growth of the magneticﬁlm,thus smearing theFigure3.Room temperature M(H)curves for nanohole arrays and corresponding continuous thinﬁlms with(a)t=2nm(thin),(b)t=30nm(intermediate)and(c)t=100nm(thick).Note the distinct magneticﬁeld magnitudes of the nanohole and thinﬁlm samples. The and⊥symbols correspond to the direction of H relative to the growth-induced axis.The inset of(a1)shows a wideﬁeld range ofM(H)for the2nm sample.The inset of(b1)shows the angular dependence of H c for30nm nanohole arrays.deﬁnition of an average preferential magnetic direction[32]. Since a hexagonal multidomain[27]hole structure is present in these AAO cases,no clear inﬂuence from the underlying lattice is observed in M(H).Notice the particular M(H)shape for nanohole samples with t=30and100nm.When theﬁeld reverses (ﬁgure3(c1)),we observe an abrupt jump of M(H) characteristic of DW motion;the magnetic moments are therefore reversed in the continuous zones between holes.However,at sites where the anisotropy is stronger (surrounding the holes;accentuated hills),the spins still show an angle relative to H.With further H increase a smoother M(H)behavior approaching magnetic saturation is seen.Such behavior was previously predicted[32],but never observed.In contrast,the thinner sample(t=2nm)shows an M(H)behavior resembling that of nanogranular systems (ﬁgure3(a1))[33,34],with H ,⊥c 80Oe,whereas for100nm samples an H ,⊥c 15Oe was obtained instead.Furthermore,an increase in m r with t is visible for the nanohole arrays.This effect is a consequence of the stray ﬁelds arising from the dipoles around the nanoholes,and becomes increasingly important for reducing thickness.The inclusion of a small percentage ofﬁlm around the entrance of the nanopores also leads to reduced in-plane H c and m r[32,35],due to the appearance of a small out-of-plane magnetization component.3.3.Transport propertiesFigure4shows normalized R(T)curves for selected nanohole arrays(t=2,6,100nm)representative of the entire deposited thickness range.For t<10nm,a pronounced minimum is visible in R(T)at temperatures(T∗)of130and65K for t=2 and6nm,respectively.Above T∗a metallic-like behavior is present(d R/d T>0),while below T∗an insulator-like R(T) characterized by d R/d T<0is obtained.In particular,theFigure 4.R (T )curves for selected nanohole array samples and corresponding continuous thin ﬁlms with values of t of (a)2nm,(b)6.5nm and (c)100nm.(d)Sheng–Abeles law ﬁt to the insulator R (T )part of the nanohole array with t =2nm.The inset of(c)shows the ZFC–FC M (T )curve for the nanohole array sample with t =2.8nm.insulator part of R (T )for the nanohole array with t =2nm follows the Sheng–Abeles law [36](ﬁgure 4)expected for discontinuous ﬁlms [33,36–38],R =R 0exp 2Ck B T 1/2,where C and k B are the activation energy and Boltzmann constants,respectively.A rather low Sheng–Abeles activation energy of C =7.6×10−3meV was obtained from our results.We note that in CoFe (t )/Al 2O 3discontinuous multilayers,activation energies ranging from ∼0.1meV for t =1.6nm to ∼8meV for t =1.2nm were found [33,37].The ﬁrst value was obtained for samples close to morphological percolation and displaying an insulator R (T )behavior over the entire measurement temperature range (20–300K).Interestingly,the sample with t =2nm displayed an R (T )behavior similar to the one presented here,although no values of C were given for this case [33].The observed transition from tunnel to metallic-like transport suggests that these thinner samples are composed of tunnel bridges connecting continuous magnetic clusters of large size,the latter being part of a metallic network within the NiFe nanohole array.Additional ZFC/FC curvesfor a nanohole array with t =2.8nm display a bifurcation at low temperatures (∼162K),characteristic of materials with large magnetic anisotropies and consistent with island-like morphologies.Furthermore,two mean blocking temperatures (T B )of ∼29and ∼120K are observed,indicating the presence of a distinctive size distribution for magnetic domains,as suggested from transport measurements.On the other hand,for t ≥10nm a typical metallic R (T )is observed for the nanohole arrays.In particular,the R (T )behavior is similar for t =100nm thin ﬁlm and nanohole samples,corroborating our hypothesis that the holes start to close and the samples approach the (continuous)thin ﬁlm condition.Figure 5shows the MR behavior at 100K for the same set of samples (t =2,6and 100nm).Here,we deﬁne the MR ratio asMR ,⊥=R (H )−R (H max )R (H max ),where H max is the maximum applied ﬁeld (=6kOe).Overall,the measured values of MR are consistently smaller than for the corresponding continuous samples.Such an accentuated decrease originates mainly from the nanoholes introduced,which conﬁne and locally alter the electrical current paths [18,32].Notice that the thinner sample (t =2nm)displays an almost isotropic MR behavior,with similar magnitudes for the two H conﬁgurations (ﬁgures 5(a)and (b)).This triangular shape curve is typically observed for systems of discontinuous magnetic multilayers and attributed to the presence of TMR [33,39](‘T’standing for tunnel).Such a contribution is further corroborated by the crossover between insulator and metallic transport observed in R (T )(ﬁgure 4(a)).Moreover,and although no distinguishable peaks are visible near the origin,the sharper feature at H =0in MR may be a consequence of easier magnetization reversal due to a reminiscent growth-induced magnetic anisotropy,mainly in regions where large magnetic clusters are present.Figure 6(b)displays the Hall resistivity (ρH )measurements for the t =2nm nanohole array sample.In this case,a planar Hall effect contribution is observed in ρH ,consistent with the presence of an in-plane magnetization component.With increasing t an in-plane AMR (‘A’standing for anisotropic)behavior is observed (ﬁgures 5(c)–(f))[8],in agreement with the larger planar Hall effect contribution observed for t =100nm,as compared with t =2nm (ﬁgure 6(d)).For such a thickness range,the MR curves display two peaks at low ﬁelds ascribed to the switching ﬁeld of the magnetization (H sw ),followed by an almost linear MR dependence at moderate ﬁelds (0.5kOe <H <6.0kOe).This particular MR shape indicates the presence of two reversal mechanisms [12]:the peaks are consistent with DW displacement occurring in the continuous space between the nanoholes.In contrast,the linear MR is characteristic of a non-homogeneous rotation of the magnetic moments closer to the edges of the holes [22].Such misalignment of the magnetic moments relative to the external magnetic ﬁeld is directly related to the particular topography of the ﬁlmgeometries.The insets show details near H sw.Figure6.(a)Optical image of the sample used to measureρH.Room temperatureρH for(b)t=2nm and(c)t=100nm nanohole arrays.(d)Comparison between the shapes of the twoρH signals;due to the differentρH magnitudes,the data were normalized.For magneticmaterials,ρH=R Oµ0H+R Aµ0M,the ordinary Hall effect being proportional to H and the anomalous Hall effect,to the out-of-plane M.induced by the underlying substrate(embedded holes and hills surrounding each hole)[40].We would also like to remark that for t=100nm, two bumps appear close to H=0(ﬁgures5(e)and(f)). Similar features were observed in the out-of-plane MR curves[41],conﬁrming the presence of a local out-of-plane magnetization component,probably resulting from material deposited around the entrance of the nanoholes,or from the pronounced AAO topography mimicked by theﬁlm.4.DiscussionThe resistivity(ρ)value at aﬁxed temperature is usually an easy and straightforward parameter to extract as a ﬁgure of merit for a sample’s properties.However,the particular geometry of an array of nanoholes makes such aﬁgure of merit hard to obtain.The holes,together with the complex topography of the AAO and the changes in theﬁlm morphology with increasing thickness,lead to an extraordinarily complex interpretation being required to reliably obtain a cross-sectional area and an effective current path between electrical contacts for each sample.In analogy,one can introduce a pseudo-resistivity parameter (ρ∗),obtained fromρ∗=R wtL,(1) where R is the measured resistance,t(w)is the thickness (width)of theﬁlm and L is the spacing between the electrical contacts.ρ∗relates to the realρof the nanoholeﬁlm system throughρ=F(w,t,L)ρ∗,where F represents a form factor (effective cross-sectional area and electrical contact distance) correlated with theﬁlm morphology.Figure7(a)shows the room temperatureρ∗(t)depen-dence for the nanohole array samples.Initially,ρ∗(t)has a similar trend to the continuous thinﬁlms,decreasing rapidly as t increases(inset ofﬁgure7(a))[28,42]. However,a minimum is visible around t 50nm,which is close to our extrapolated thickness for the closure of the nanopores(ﬁgure2(a)).In contrast to the case for NiFe continuousﬁlms,a change in the effective(conductive) cross-section and current paths of these samples is expected as theﬁlm approaches the continuous regime,modulated by the underlying AAO topography.We emphasize that the anomalous increase visible inρ∗above50nm is not directly related to a higher intrinsic resistivity of the material,but more probably to complicated geometrical features arising as the nanohole closes,which are reﬂected in F(w,t,L)[13,14].Figure7(b)shows MR⊥(t)for the nanohole arrays at 100and300K.For a homogeneous and continuous thin ﬁlm one obtains a monotonic increase of MR⊥(t),towards an almost constant value(inset ofﬁgure7(a)).However, for the nanohole samples,a completely different trend is observed(ﬁgure7(b)).First,an increase of MR⊥from2to 10nm is visible,which is then followed by a decrease up to t<50nm;ﬁnally an increase is again observed.Such behavior is inconsistent with the presence of only AMR for t<50nm.In fact,Krzyk et al systematicallystudied Figure7.(a)ρ∗and(b)MR⊥dependence on t for the nanohole arrays.The inset showsρ(t)and MR⊥(t)for the continuous NiFe thinﬁlms.The lines are guides to the eye.continuous ultrathin NiFeﬁlms(0.5<t<4.5nm)deposited on different substrates(SiO2,MgO and Al2O3),where a competition between TMR and AMR contributions to the total MR(t)of the systems was present[43].Furthermore,the onset of AMR dominance depended on the nature of the substrate (t 1.8nm for Si/SiO2,t 3.8nm for MgO and t 5.6nm for Al2O3).Our data then suggest:(i)For t≤3nm the transport properties indicate the pres-ence of a signiﬁcant tunnel contribution,corroborated by the insulator/metallic crossover observed in R(T)at low temperatures(ﬁgure4(a)).Furthermore,for the t= 2nm nanohole arrays,the data closely follow the ln R∝2(C/k B T)1/2dependence observed in granular systems and characteristic of the limit of low electricﬁeld for tunneling(ﬁgure4).The almost isotropic MR behavior observed inﬁgures5(a)and(b),together with the lack of distinguishable H sw peaks,is expected if theﬁlm is composed by islands of magnetic material[39].These characteristics point to a granular morphology,facilitated by the accentuated topography of the underlying AAO substrate,which in turn explains the particular M(H) behavior(ﬁgure3(a)).The NiFe nanohole array sample is then composed of tunnel bridges connecting continuous parts of a metallic network(i.e.ordered magnetic clusters of large size)[33].(ii)In the3nm<t≤10nm range,a remanent tunnel contribution is still present,as indicated by the insulator-like behavior observed in R(T)at very low temperatures.Nevertheless,a contribution from the AMR starts to appear,as supported by the visible changes in the shape of the MR(H)cycles(ﬁgures5(c)and(d)).(iii)For10nm<t≤50nm,a negligible contribution from the TMR is expected as the morphological percolation is largely overcome.Therefore,in this regime,MR(t) suggests the presence of a larger AMR effect in detriment to the TMR.Also,an entirely continuousﬁlm covering the space in between the nanoholes over the AAO surface is expected.(iv)Finally for t>50nm only the AMR is present.MR increases with t,following the same tendency as for thin ﬁlms[28,42].The fact that MR⊥shows a particular dependence on t, suggesting the presence of TMR and AMR contributions,is here attributed to the substrate dependent growth morphology of theﬁlm,and thus of the nanohole arrays.5.ConclusionsWe observed that NiFe thinﬁlms deposited on top of AAO conform to its surface,reproducing the underlying hexagonal pattern.In addition,the pronounced topography of the AAO characterized by the presence of hills surrounding each nanopore was also transferred to the nanohole array.By correlating the magnetic,electrical and magneto-transport properties of the nanohole arrays,we inferred the nanoholeﬁlm morphology,which depended strongly on the depositedﬁlm thickness and particular AAO topography. For small t a granular-likeﬁlm is formed,promoted by the high roughness and the particular topography of the AAO substrates(ﬁgure1(a)).With increasing t,morphological percolation occurs and the contribution from TMR decreases. Therefore,when theﬁlm coalesces and the bulk-like part starts to dominate the conduction mechanisms,the TMR vanishes and only AMR is present.Interestingly,this coincides with the t value( 50nm)obtained for the closure of the nanopores.This work opens new doors to the growth of more complex nanostructured materials on AAO substrates obtained from the anodization of thick Al foils,with well-controlled physical properties,the latter being a crucial aspect for facilitating further technological advances. AcknowledgmentsThe authors thank Dr Andre M Pereira for valuable discussions concerning the manuscript.The work was supported in part by project FEDER/POCTI/n2-155/94. DCL,CTS and JMT are grateful for FCT grants (SFRH/BPD/72359/2010,SFRH/BD/82010/2011and SFRH/BPD/72329/2010).M Vazquez thanks the Spanish Ministry of Economia y Competitividad,MEC,for assistance under project MAT2010-20798-C05-01.References[1]Nakanishi T and Ando T1996Quantum interference effects inantidot lattices in magneticﬁelds Phys.Rev.B548021[2]Uryu S and Ando T1998Numerical study of localization inantidot lattices Phys.Rev.B5810583[3]Ruan Z and Qiu M2006Enhanced transmission throughperiodic arrays of subwavelength holes:the role oflocalized waveguide resonances Phys.Rev.Lett.96233901 [4]Van de V ondel J,de Souza Silva C C,Zhu B Y,Morelle M andMoshchalkov V V2005V ortex-rectiﬁcation effects inﬁlmswith periodic asymmetric pinning Phys.Rev.Lett.94057003[5]Neusser S and Grundler D2009Magnonics:spin waves on thenanoscale Adv.Mater.212927–32[6]Neusser S,Botters B and Grundler D2008Localization,conﬁnement,andﬁeld-controlled propagation of spin wavesin Ni80Fe20antidot lattices Phys.Rev.B78054406[7]Cowburn R P,Adeyeye A O and Bland J A C1997Magneticdomain formation in lithographically deﬁned antidotPermalloy arrays Appl.Phys.Lett.702309–11[8]Adeyeye A O,Bland J A C and Daboo C1997Magneticproperties of arrays of holes in Ni80Fe20ﬁlms Appl.Phys.Lett.703164–6[9]Barnard J A,Fujiwara H,Inturi V R,Jarratt J D,Scharf T W and Weston J L1996Nanostructured magneticnetworks Appl.Phys.Lett.692758–60[10]Wang C C,Adeyeye A O,Singh N,Huang Y S andWu Y H2005Magnetoresistance behavior of nanoscaleantidot arrays Phys.Rev.B72174426[11]Rahman M T,Dumas R K,Eibagi N,Shams N N,Wu Y-C,Liu K and Lai C-H2009Controlling magnetization reversalin Co/Pt nanostructures with perpendicular anisotropy Appl.Phys.Lett.94042507[12]Merazzo K J,Leitao D C,Jimenez E,Araujo J P,Camarero J,del Real R P,Asenjo A and Vazquez M2011Geometry-dependent magnetization reversal mechanism inordered Py antidot arrays J.Phys.D:Appl.Phys.44505001 [13]Xiao Z L et al2002Nickel antidot arrays on anodic aluminasubstrates Appl.Phys.Lett.812869–71[14]Navas D,Ilievski F and Ross C A2009CoCrPt antidot arrayswith perpendicular magnetic anisotropy made on anodicalumina templates J.Appl.Phys.105113921[15]Toﬁzur Rahman M et al2008A large-area mesoporous arrayof magnetic nanostructure with perpendicular anisotropyintegrated on Si wafers Nanotechnology19325302 [16]Kovylina M,Erekhinsky M,Morales R,Villegas J E,Schuller I K,Labarta A and Batlle X2009Tuning exchangebias in Ni/FeF2heterostructures using antidot arrays Appl.Phys.Lett.95152507[17]Rahman M T,Shams N N,Wang D S and Lai C-H2009Enhanced exchange bias in sub-50-nm IrMn/CoFenanostructure Appl.Phys.Lett.94082503[18]Wang H,Wu Y,Wang M,Zhang Y,Li G and Zhang L2006Fabrication and magnetotransport properties of orderedsub-100nm pseudo-spin-valve element arraysNanotechnology171651[19]Ho C-C,Hsieh T-W,Kung H-H,Juan W-T,Lin K-H andLee W-L2010Reduced saturation magnetization in cobaltantidot thinﬁlms prepared by polyethylene oxide-assistedself-assembly of polystyrene nanospheres Appl.Phys.Lett.96122504[20]Zhukov A A,Goncharov A V,de Groot P A J,Bartlett P N and Ghanem M A2003Magnetic antidotarrays from self-assembly template methods J.Appl.Phys.937322–4[21]Wei Q,Zhou X,Joshi B,Chen Y,Li K-D,Wei Q,Sun K andWang L2009Self-assembly of ordered semiconductornanoholes by ion beam sputtering Adv.Mater.212865–9 [22]Leitao D C,Ventura J,Pereira A M,Sousa C T,Moreira J M,Carpinteiro F C,Sousa J B,Vazquez M andAraujo J P2010Study of nanostructured array of antidotsusing pulsed magneticﬁelds J.Low Temp.Phys.159245–8。

mno2晶胞锰氧的八面体空隙

mno2晶胞锰氧的八面体空隙MnO2 is a compound known as manganese dioxide, which has a crystal structure with octahedral voids. These octahedral voids are spaces within the crystal lattice where no atoms are present, creating a three-dimensional arrangement of voids that can be visualized as a series of interconnected octahedra. The presence of these voids in the crystal structure of MnO2 plays a significant role in its physical and chemical properties.One important aspect of the octahedral voids in MnO2 is their impact on the overall stability and reactivity of the compound. The presence of these voids can affect the packing efficiency of the crystal lattice, leading to changes in the density and strength of the material. Additionally, the octahedral voids can act as sites for the adsorption of other molecules or ions, influencing the chemical reactivity of MnO2. This can have implications for the compound's performance in various applications, such as catalysis or energy storage.Furthermore, the presence of octahedral voids in MnO2 can also affect its electrical and magnetic properties. The voids can create localized distortions in the crystal lattice, leading to changes in the conductivity andmagnetic behavior of the material. This can be exploited in various technological applications, such as in the development of electronic devices or magnetic storage media. Understanding the role of octahedral voids in MnO2 is therefore crucial for optimizing its performance in these areas.In addition to their impact on the physical andchemical properties of MnO2, the octahedral voids in the crystal structure also play a role in determining the compound's overall structure and symmetry. The arrangementof voids within the crystal lattice can influence the crystallographic symmetry of MnO2, affecting itsdiffraction patterns and overall crystal morphology. This structural information is important for characterizing the compound and understanding its behavior under different conditions.Moreover, the presence of octahedral voids in MnO2 can also influence its mechanical properties. The voids can act as stress concentrators within the crystal lattice, affecting the material's response to external forces such as compression or shearing. This can impact the compound's strength, ductility, and fracture behavior, making the study of octahedral voids essential for predicting and controlling the mechanical performance of MnO2 in various applications.Overall, the octahedral voids in the crystal structure of MnO2 play a crucial role in determining its physical, chemical, electrical, magnetic, and mechanical properties. Understanding the nature and significance of these voids is essential for harnessing the full potential of MnO2 in a wide range of applications, from catalysis and energy storage to electronics and magnetism. By studying the octahedral voids in MnO2, researchers can gain valuable insights into the compound's behavior and optimize its performance for various technological advancements.。

单相铁芯的检测标准

单相铁芯的检测标准The testing standards for single-phase iron cores are essential in ensuring the quality and performance of these crucial components in electrical equipment. 铁芯是电气设备中一项关键组件，因此对其进行检测标准的制定至关重要。

Testing standards help to ensure that iron cores meet the necessary requirements for efficiency, safety, and reliability. 检测标准有助于确保铁芯符合效率、安全和可靠性等必要要求。

From material composition to dimensional accuracy, insulation resistance, and magnetic properties, there are various aspects that need to be evaluated in the testing process. 从材料成分到尺寸精度、绝缘电阻和磁性能，测试过程中需要评估的方面很多。

Material composition is one of the critical aspects that are evaluated in the testing of single-phase iron cores. 材料组成是单相铁芯测试中需要评估的关键方面之一。

The materials used in the construction of the iron core have a significant impact on its performance and reliability. 铁芯建设中所使用的材料对其性能和可靠性有着重大影响。

用electrical造句

用electrical造句用electrical造句如下：1、The company is a world leader in electrical goods.这家公司的电器产品在全世界首屈一指。

2、The fire was started by an electrical short-circuit. 火灾是由电线短路引发的。

3、The test records the electrical activity of the brain. 这个测试显示出大脑的电流活动。

4、An electrical surge damaged the computer's disk drive. 电流浪涌损坏了计算机的磁盘驱动器。

5、The salt reduces the electrical resistance of the water.盐使水的电阻减小。

6、A radio signal has both electrical and magnetic properties.无线电信号既具有电的特性也具有磁的特性。

7、He had been lifting electrical goods from the store where he worked.他一直从他工作的商店里偷窃电器商品。

8、The photochemical reactions transform the lightinto electrical impulses.光化学反应使光变为电脉冲。

9、Any attempts to cut through the cabling will breakthe electrical circuit.任何切断电缆的做法都会使电路中断。

10、Information is transferred along each neurone by means of an electrical impulse.信息以电学推动的形式沿神经细胞传递11、When installing electrical equipment don't take any chances. A mistake could kill.安装电器设备时千万不要冒险，弄错了有可能会出人命的。

signal to造句

signal to造句1、When we turned the boat about，the signal began to bleep again constantly.(我们调转船头的时候，信号器又开始发出不停的嘟嘟声。

)2、When I give the signal ，run!(我一发信号，你就跑！)3、The transmitters will send a signal automatically to a local base station.(发射台会自动将信号发送到地方基站。

)4、You must signal which way you are going to turn.(你要朝哪个方向转，必须发出信号。

)5、A radio signal was sent to the spacecraft.(向宇宙飞船发出了无线电信号。

)6、It's a signal that we might need to protect ourselves.(这是我们保护自己可能需要的一个信号。

)7、The reception was a little faint but clear enough for him to receive the signal.(接收有些弱，但足够清晰到使他能够接收信号。

)8、The recall of Ambassador Alan Green is a public signal of America's concern.(艾伦·格林大使的召回是美国关注此事的公开信号。

)9、The coded signal is received by satellite dishes.(电码信号通过卫星天线接收。

)10、When the stem dies，its hormone signal also ceases.(当茎死亡时，它的激素信号也停止了。

17 Electricity and Magnetism17电和磁

+
-
if
Example Problem
A parallel-plate capacitor is held at a potential difference of 250 V. A proton is fired toward a small hole in the negative plate with a speed of 3.0 x 105 m/s. What is its speed when it emerges through the hole in the positive plate? (Hint: The electric potential outside of a parallel-plate capacitor is zero).
Slide 24-26
Answer
Point P is 5 cm above the wire as you look straight down at it. In which direction is the magnetic field at P?
D.
Slide 24-27
Checking Understanding
(
Solenoids and Electromagnets
If a piece of iron is inserted in the solenoid, the magnetic field greatly increases. Such electromagnets have many practical applications.
ELECTRICITY AND MAGNETISM
ELECTRICITY HAS MAGNETIC EFFECTS MAGNETISM EFFECTS ELECTRICITY

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。