Copper doping in titanium oxide catalyst film prepared by dc reactive magnetron sputtering45

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富五边形缺陷氮掺杂碳纳米材料的英文缩写

富五边形缺陷氮掺杂碳纳米材料的英文缩写

富五边形缺陷氮掺杂碳纳米材料的英文缩写Rich pentagon defective nitrogen doped carbon nanomaterials are a type of carbon-based nanomaterial that has attracted significant attention due to their unique properties and potential applications in various fields, such as energy storage, catalysis, and sensing. In this document, we will discuss the synthesis, properties, and applications of these materials, as well as their potential future directions.Synthesis:The synthesis of rich pentagon defective nitrogen doped carbon nanomaterials typically involves the preparation of precursor materials, such as carbon sources and nitrogen sources, followed by the controlled pyrolysis or chemical vapor deposition of these precursors. The introduction of specific defects, such as pentagon defects, can be achieved through the use of specific techniques, such as nitrogen doping and annealing processes.Properties:Rich pentagon defective nitrogen doped carbon nanomaterials exhibit unique properties that make them suitable for a wide range of applications. These properties include highelectrical conductivity, excellent mechanical strength, large surface area, and tunable chemical reactivity. The presence of nitrogen dopants and pentagon defects further enhances these properties, leading to improved performance in various applications.Applications:Rich pentagon defective nitrogen doped carbon nanomaterials have been investigated for a variety of applications, including energy storage devices (such as supercapacitors and batteries), catalysis (such as oxygen reduction reaction and hydrogen evolution reaction), and sensing (such as gas sensing and biosensing). The unique properties of these materials make them promising candidates for these applications, with potential for further optimization and enhancement.Future directions:In the future, the development of rich pentagon defective nitrogen doped carbon nanomaterials is likely to focus on improving the synthesis methods, optimizing the properties for specific applications, and exploring new applications in emerging fields. Advances in nanotechnology and materials science will continue to drive the research and development ofthese materials, leading to new opportunities for innovation and discovery.In conclusion, rich pentagon defective nitrogen doped carbon nanomaterials are a promising class of materials with unique properties and potential applications in various fields. Further research and development in this area will help to unlock the full potential of these materials and contribute to the advancement of science and technology.。

硫掺杂改性二氧化钛光催化剂的研究进展

硫掺杂改性二氧化钛光催化剂的研究进展

性 TiO2 光催化剂的机理及制备方法等的研究进展。
1 非 金 属 硫 掺 杂 的 光 催 化 机 理
1.1 TiO2 光催化作用原理 由于 TiO2 半导体的 禁 带 宽 度 一 般 在 3.2eV 以 下,所 以
只有在波长小于或等于387nm 的紫外光照射下,价带中的电 子才能被激发到导带形成带负电的高 活 性 电 子 (e- ),同 时 在 价带上产生带 正 电 的 空 穴 (h+ ),即 产 生 电 子-空 穴 对。 由 于 光生电子和空穴都不稳定,极易复合,当 没 有 俘 获 剂 存 在 时, 一部分光生电子和空穴便简单地复合并释放 热 能,另 一 部 分 则与吸附在 TiO2 表面的 物 质 发 生 一 系 列 的 化 学 反 应:h+ 与 吸附在 TiO2 表面的 OH- 和 H2O 反 应 产 生 大 量 的 高 活 性 自 由基(·OH),这 些 自 由 基 能 将 污 染 物 氧 化 成 为 阳 离 子 后 最 终分解为 CO2 和 H2O。h+ 本身也可直 接 氧 化 污 染 物 使 其 降 解。同时e- 与吸附在 TiO2 表 面 的 O2 和 H+ 反 应 生 成 一 些 活性氧类(HOO· ,O2- ),最终 生 成 ·OH,从 而 可 以 降 解 许 多难降解的有机及 无 机 污 染 物。TiO2 光 催 化 反 应 原 理 如 图 1所示 。 [5] 1.2 硫掺杂 TiO2 的机理探讨
· 50 ·
材料导报
2011 年 11 月 第 25 卷 专 辑 18
硫掺杂改性二氧化钛光催化剂的研究进展*
毕 珊 ,秦 好 丽
(贵州师范大学化学与材料科学学院,贵阳 550001)
摘要 二氧化钛具有良好的稳定性、低成本和无二次污染等特点,有着广阔的应用前景,但 禁 带 较 宽 致 使 紫 外 光激发成为制约其应用的瓶颈,拓宽二氧化钛的光谱响应 范 围、实 现 可 见 光 激 发 是 二 氧 化 钛 光 催 化 材 料 面 临 的 主 要 问 题 。 综 述 了 非 金 属 硫 掺 杂 二 氧 化 钛 的 制 备 方 法 及 光 催 化 机 理 的 研 究 进 展 ,并 展 望 了 今 后 值 得 关 注 与 研 究 的 问 题 。

氧化钛纳米片材料的合成及其催化应用进展

氧化钛纳米片材料的合成及其催化应用进展

CHEMICAL INDUSTRY AND ENGINEERING PROGRESS 2017年第36卷第7期·2488·化 工 进展氧化钛纳米片材料的合成及其催化应用进展李路1,2,徐金铭2,齐世学1,黄延强2(1烟台大学化学与化工学院,山东 烟台 264005;2中国科学院大连化学物理研究所,航天催化与新材料研究室,辽宁 大连 116023)摘要:氧化钛纳米片材料为一种新兴的二维层状材料,在催化、环境、能源和电子领域引起人们广泛的关注。

本文从催化研究的角度出发,综述了氧化钛纳米片材料的结构、制备方法、金属及非金属元素的掺杂、纳米片基复合材料和其在光催化、光电催化和热催化等方面的应用进展。

分析表明氧化钛纳米片材料拥有特殊的形貌和特别的物理化学性质,通过控制材料的组成及结构变化,能够实现氧化钛纳米片材料的多种功能化。

指出氧化钛纳米片材料虽然有着优良的性能,但是在实际应用中远不能满足要求。

因此,优化合成和探索新形式的二氧化钛纳米片材料,对其表面进行改性及开发具有特殊功能纳米复合材料是解决其瓶颈的有效途径。

探索催化反应过程中的反应机理,开发氧化钛纳米片基工业应用催化剂将是今后重要的研究方向。

关键词:氧化钛纳米片;层状钛酸盐;催化;合成;纳米材料中图分类号:O611.4 文献标志码:A 文章编号:1000–6613(2017)07–2488–09 DOI :10.16085/j.issn.1000-6613.2016-2340Recent advances in titanium oxide nanosheets for catalytic applicationsLI Lu 1,2,XU Jinming 2,QI Shixue 1,HUANG Yanqiang 2(1College of Chemistry and Chemical Engineering ,Yantai University ,Yantai 264005,Shandong ,China ;2Laboratory of Catalysts and New Materials for Aerospace ,Dalian Institution of Chemical Physics ,Chinese Academy of Science ,Dalian 116023,Liaoning ,China )Abstract: As a new class 2D layered materials ,Titanium oxide nanosheets have attracted great interest inthe fields of catalysis ,environment ,energy and electronics. In this work ,we provide an overview of the recent advance of titanium oxide nanosheets on their layered structure ,synthetic methods ,doping with metals or nonmetal ,as well as their nanocomposites and applications in catalysis. Recent researches indicate that titanium oxide nanosheets with unique structure and special physical and chemical properties can achieve multiple functions by controlling their compositions and structures. Although titanium oxide nanosheets have a lot of advantages ,they are still far from practical applications. Therefore it is demanded to explore new synthesis ,doping and modification methods ,and develop new composite materials. In addition ,the reaction mechanism in the catalytic reaction process and the industrial application of titanium oxide nanosheets will be important research directions in the future. Key words :titanium oxide nanosheets ;layered titanate compounds ;catalysis ;synthesis ;nanomaterials助理研究员,从事有序介孔材料合成及表面修饰和生物质催化转化制化学品相关科研工作。

罗格斯公司高频材料的铜片说明说明书

罗格斯公司高频材料的铜片说明说明书

Copper Foils for High Frequency MaterialsCopper foils, for the wide range of Rogers’ high frequency circuit substrates, are designed to provide optimum performance in high reliability applications.There are various types of copper foil are offered; in a range of weights (thicknesses). Their characteristics differ, and an understanding of these differences is important to ensure the correct selection of copper foil for each application or environmental condition.Copper Foil ManufacturingStandard ED CopperIn an electrodeposited copper manufacturing process, the copper foil is deposited on a titanium rotating drum from a copper solution where it is connected to a DC voltage source. The cathode is attached to the drum and the anode is submerged in the copper electrolyte solution. When an electric field is applied, copper is deposited on the drum as it rotates at a very slow pace. The copper surface on the drum side is smooth while the opposite side is rough. The slower the drum speed, the thicker the copper gets and vice versa. The copper is attracted and accumulated on the cathode surface of the titanium drum. The matte and drum side of the copper foil go through different treatment cycles so that the copper could be suitable for PCB fabrication. The treatments enhance adhesion between the copper and dielectric interlayer during copper clad lamination process. Another advantage of the treatments is to act asanti-tarnish agents by slowing down oxidation of copper.Fig. Electrodeposited Copper Manufacturing ProcessPropertiesRolled CopperRolled copper is made by successive cold rolling operations to reduce thickness and extend length starting with a billet of pure copper. The surface smoothness depends on the rolling mill condition.Fig. Rolled Copper Manufacturing ProcessResistive CopperThe matte side of the ED copper is coated with metal or alloy that acts as a resistive layer. The next process is to roughen the resistive layer with nickel particles.Reverse Treated ED Copper and LoPro Copper FoilReverse treated foils involve the treatment of the smooth side of electrodeposited copper. Treatment layers are thin coatings that improve adhesion of the base foil to dielectrics and add corrosion resistance which makes the shiny side rougher than it was before. During the process of making circuit board panels, the treated side of copper is laminated to the dielectric material. The fact that the treated drum side is rougher than the other side constitutes a greater adhesion to the dielectric. That is the majoradvantage over the standard ED copper. The matte side doesn’t need any mechanical or chemical treatment before applyingphotoresist. It is already rough enough for good laminate resist adhesion.In case of the LoPro™ copper, a thin layer of adhesive is applied on the reverse treated side of the copper. There is a physical layer of the bond enhancement material. Just like the reverse treated electrodeposited copper, the adhesive treated side is bonded to the dielectric layer for better adhesion. Our RO4000 series material are available laminated with LoPro copper foil. Crystalline StructureElectrodeposited copper crystals tend to grow lengthwise in the Z-axis of the foil. Typically, a polished cross-section ofelectrodeposited copper foil has the appearance of a picket fence, with long crystal boundaries perpendicular to the foil plane. Rolled copper crystals are broken and crushed during the cold rolling operation. They are smaller than the electrodeposited crystals, and have irregular, spherical shapes, nearly parallel to the foil plane.Copper Foil Roughness MeasurementsSurface roughness can be measured by mechanical and optical methods. Many sources report the “Rz” (peak to valley”) profile as measured by a mechanical profilometer . However, in our experience, the Sq (RMS) profile as measured by white light interferometry of the treated side of copper foil correlates best with conductor losses. Figure 1 shows the interferometer profile of the ½ oz. ED foil used on Rogers’ PTFE and TMM laminates. Table 1 shows the types of copper foils used on Rogers’ laminate materials along with typical profile information. A recent study (reference 7) has shown that the “top side” profile has a very different structure than the treated side and has very little effect on conductor loss, even in a stripline configuration.Treated SideShiny SideFig 1. Surface topographies of ½ oz electrodeposited foil by white light interferometryAs displayed on Table 1, roughness data of electrodeposited and rolled copper foils with different thicknesses was obtained by using an optical surface profiler. It also shows for which products the individual copper foils are used at Rogers Corporation. The rolled copper with no surface treatment is typically the smoothest.Table 1: Typical Root Mean Square Roughness ValuesElectric Performance of LaminatesIt has been well-known since the earliest days of microwave engineering with wave guides that the conductor surface roughness can substantially affect the conductor loss. In 1949, S.P. Morgan (1) published results of numerical simulations that indicated that a factor of two increase in conductor loss could be caused by surface roughness. Hammerstad and Jensen (2), incorporated Morgan’s model, along with correlated data in microstrip design method. The H&J model became the “textbook” (3) method for calculating the effect of surface roughness on conductor loss. More recently, at higher frequencies and with thinner laminates,it was found that H&J significantly under predicted the increase in conductor loss with surface roughness (5,6). The “Hall-Huray” model (4), developed from a “first principles” analysis, has been recently incorporated into commercial design software.In our experience, with modest adjustments to the input parameters, the Hall Huray model can accurately predict conductor loss over a wide range of laminate thicknesses and frequencies. The Hall-Huray model has been incorporated in Rogers Corporation’s impedance and loss calculator, MWI. We are currently working to develop the best Hall-Huray input parameters for modeling Rogers’ laminates. Please check at Rogers Technical Support Hub on-line or your Rogers Sales Engineer for updates.Rogers copper foils studies (5,6,7) have also shown that the copper profile can affect the propagation constant, with higher profile foils leading to an apparent increase in the effective dielectric constant Figure 3 shows the calculated dielectric constant of 50 ohm TLs on 4 mil liquid crystal polymer (LCP) laminates clad with different foils with Sq values ranging from 0.4 to 2.8 microns. The circuit with the highest profile foil exhibits an increase in DK of nearly 10%. The effect of copper profile on phase response is not accounted for in the Hall Huray model.The effect of copper profile on insertion loss can be quite large (Fig.2). At 90 GHz, the insertion loss of a 50 ohm TL fabricated from a 0.004” thick liquid crystal polymer (LCP) laminates with RA foil (blue line), is 2.2 dB/inch and is nearly perfectly modeled as a smooth conductor. The same substrate clad with ED foil exhibiting with Sq value of 2.0 microns, exhibits an insertion loss of 3.7 dB/inch. Figure 4 shows the morphologies of the roughness treatments on the conductors used to generate the data presented in Figure 2.Fig 2. Comparisons of different copper roughness on the insertion loss of microstrip transmission linesFig 3. Comparisons of different copper roughness on the dielectric constant of microstrip transmission lines0.4 m m RMS 2.0 m m RMS2.8 m m RMSFig. 4: SEM images of 1/2 oz copper foils - Treated SideMechanical Performance of LaminatesA. Thermal Shock ResistanceUnder some extreme conditions of rapid thermal cycling, electrodeposited copper may exhibit thermal stress cracks in narrow conductors. Under similar conditions, rolled copper has significantly improved resistance to cracking. Although electrodeposited copper has greater tensile strength and elongation before breaking, rolled copper has better elastic elongation before reaching permanent deformation.B. Foil AdhesionBecause the adhesion of resin systems to metals is predominantly mechanical, bond strength is directly related to the surface roughness of the treated foil side. Typical peel strengths after thermal shock for 1 oz. copper foils toC. Bondability of Stripline Assemblies (PTFE Substrates)The SEM photographs below illustrate the differences in topography and roughness between copper types and etch dielectric surfaces. If the boards are to be adhesive bonded, then for electrodeposited copper, sodium etch or plasma etch of the dielectric surface is not necessary, provided that care is exercised to preserve the surface topography. However, for rolled copper-clad circuit boards, the surface roughness of the dielectric will give a poor mechanical bond, and surface treatment is necessary for reliable chemically bonded assemblies.PropertiesThe different manufacturing methods of the two types of foil lead to differences in the electrical andMechanical properties. The primary differences are listed in Table 2.* Values represent properties after lamination to a PTFE laminate.Rogers Statement on Resistive Foil Visual Appearance and Resistivity ExpectationsRogers Advanced Connectivity Solutions (ACS) produces upon request a select number of copper clad laminates using commercially available, subtractively processed resistive foils. Resistive foil technology enables the use of planar resistors within the circuit boards that are made from our laminate products. The availability of these resistive foils varies dependingon each particular copper clad laminate product offered by ACS. However, in general ACS uses both OhmegaPly® foil from Ohmega Technologies, Inc. (/) and TCR® foil from Ticer Technologies (/). ACS customers are encouraged to research the specific resistive foil products that are available as well as the performance and processing details from each foil supplier prior to placing orders with Rogers.(1) Typical values are mean values derived from populations of measurements involving multiple lots of the specific foil type.The information in this data sheet is intended to assist you in designing with Rogers’ circuit materials. It is not intended to and does not create any warranties express or implied, including any warranty of merchantability or fitness for a particular purpose or that the results s hown on this data sheet will be achieved by a user for a particular purpose. The user should determine the suitability of Rogers’ circuit materials for eac h application.These commodities, technology and software are exported from the United States in accordance with the Export Administratio n regulations. Diversion contrary to U.S. law prohibited.The Rogers’ logo, XtremeSpeed RO1200, ML Series, 92ML, StaCool, AD250, AD255, AD260, AD255C-IM, AD300, AD300D-IM, AD320, AD350, AD410, AD430, AD450, AD600, AD1000, CLTE, CLTE-AT, CLTE-XT, CLTE-MW, CuClad, CuClad 217, CuClad 233, CuClad 250, DiClad, DiClad 527, DiClad 870, DiClad 880, DiClad 880-IM, IsoClad, IsoClad 917, IsoClad 933, Kappa 438, LoPro, RO1200, RO3003, RO3006, RO3010, RO3035, RO3203, RO3206, RO3210, RO4003C, RO4350B, RO4360G2, RO4533,RO4534, RO4535, RO4725JXR, RO4730JXR, RO4730G3, RO4830, RO4835, RO4835T, RT/duroid, TC350, TC600, and TMM are trademarks of Rogers Corporation or one of its subsidiaries.OhmegaPly is a registered trademark of Ohmega Technologies, Inc.TCR is a registered trademark owned by Nippon Mining & Metals Co., Ltd.Ticer Technologies is a licensee of the technology and trademark of TCR Wyko is a trademark of Veeco Instruments.© 2021 Rogers Corporation, Printed in U.S.A. All rights reserved.Revised 1530 091721 Publication #92-243References:1. S.P . Morgan, “Effect of surface roughness on eddy current losses at microwave frequencies,” J. Applied Physics, p. 352, v. 20, 19492. E. Hammerstad and O. Jensen, “Accurate models of computer aided microstrip design,” IEEE MTT-S Symposium Digest, p. 407, May 19803. D. M. Pozar, Microwave Engineering, 2nd Edition, Wiley (1998)4. P .G. Huray, O. Oluwafemi, J. Loyer, E. Bogatin, and X. Ye, “Impact of Copper Surface Texture on Loss: A model that works,” DesignCon20105. A.F. Horn III, J. W. Reynolds, P . A. LaFrance, J. C. Rautio, “ Effect of conductor profile on the insertion loss, phase constant, and dispersion of thin high frequencytransmission lines,” DesignCon20106. A. F. Horn, III, J. W. Reynolds, J. C. Rautio, “Conductor profile effects on the propagation constant of microstrip transmission line,” Microwave Symposium Digest(MTT), 2010 IEEE MTT-S International, pp 868-8717. Allen F. Horn III, Patricia A. LaFrance, Christopher J. Caisse, John P . Coonrod, Bruce B. Fitts, “Effect of conductor profile structure on propagation in transmissionlines,”. DesignCon2016。

二氧化钛表面超强酸化光氧复合降解罗丹明B

二氧化钛表面超强酸化光氧复合降解罗丹明B

第40卷第2期2021年3月Vol.40No.2Mar.2021大连工业大学学报JournalofDalianPolytechnicUniversityDOI:10.19670/ki.dlgydxxb.2021.0210二氧化钛表面超强酸化光氧复合降解罗丹明B温宇,杨大伟(大连工业大学轻工与化学工程学院,辽宁大连116034)摘要:采用共结晶方法制备了锌锆共掺杂的介孔二氧化钛,前驱体用硫酸处理使其具有超强酸性。

将制备的介孔二氧化钛用于降解废水模拟物罗丹明B,测试其光催化与氧催化降解能力。

通过紫外-可见分光光度计、X射线衍射、电镜扫描等对催化剂进行表征,实验结果表明,在强酸修饰二氧化钛前驱体的影响下,掺杂锌锆的介孔二氧化钛具有光催化与氧催化活性。

锌锆共掺杂介孔二氧化钛的光催化与氧催化效率分别达到了72%与25%o硫酸处理后在TiO2与掺杂原子表明形成酸性中心,在无光条件下氧化降解废水效率为30%,提高了降解效率。

关键词:二氧化钛;光催化;酸催化;罗丹明B中图分类号:X703.5文献标志码:A文章编号:1674-1404(2021)02-0136-04Composite degradation of rhodamine B using TiO2withphotocatalytic oxygen and super acidWEN Yu,YANG Dawei(SchoolofLightndustryandChemicalEngineering,DalianPolytechnicUniversity,Dalian116034,China) Abstract:The mesoporous titania doped with zinc oxide,zirconium dioxide,zinc and zirconium were prepared by the co-crystallization method and the precursor of mesoporous titania was pretreated with sulfuric acid to endowed it super acidic.The mesoporous titania was used for degradation of rhodamine B in simulated wastewater and its photocatalytic activity and oxygen catalytic ability was analyzed by UV-visible spectrophotometer,X ray diffraction,scanning electron microscopy.The results showed that the T1O2doped metal oxides and super acid exhibited excellent photocatalytic and oxygen catalytic ability.The degradation rate of rhodamine B photocatalyzed and oxygen catalyzed by the prepared catalysts were72%and25%,respectively.After treatment with sulfuric acid,the acidic centers were formed between the doped atoms and the surface of titanium dioxide,which improved the oxygen degrading efficiency of wastewater to30%.Keywords:TiO2;photocatalytic;acidic catalysis;rhodamine B0引言工业生产中生成的有机废水对环境造成严重污染,国家对废水排放标准执行越来越严格,如何降低或消除有机废水中大分子有机物成为研究的重点。

三核铜配合物的合成、表征及其催化性能

三核铜配合物的合成、表征及其催化性能

2018年第37卷第10期 CHEMICAL INDUSTRY AND ENGINEERING PROGRESS·3879·化 工 进展三核铜配合物的合成、表征及其催化性能冷帅1,2,李云涛1,邓建国2(1西南石油大学材料科学与工程学院,四川 成都 610500;2中国工程物理研究院化工材料研究所,四川 绵阳 621900)摘要:采用溶剂热法合成了以三核碘化亚铜(CuI )四面体结构为活性中心的硅氢加成反应催化剂,探讨了物料比对产物收率的影响。

结果说明了当配体与碘化亚铜的摩尔比为1∶6时,产物收率最高。

通过元素分析、傅里叶红外光谱分析、X 射线光电子能谱分析、X 射线单晶体衍射分析、紫外可见光光谱分析、热失重分析对配合物的化学组成、空间结构及性能进行表征,并进一步通过甲基苯基乙烯基树脂和甲基苯基含氢硅油的硅氢加成反应进行催化固化效果验证。

结果说明了在催化剂填加量为0.04%、固化温度为150℃的优化条件下反应24h ,共混体系固化效果最佳。

该配合物对硅氢加成反应具有很好的催化性能,并且原料成本低、制备方法简单、晶体颗粒方便储存,有望解决硅氢加成反应中贵金属催化剂的高成本问题。

关键词:配合物;催化剂;硅氢加成;碘化亚铜;晶体;合成中图分类号:TQ426.61;O643.36 文献标志码:A 文章编号:1000–6613(2018)10–3879–06 DOI :10.16085/j.issn.1000-6613.2017-2271Synthesis, characterization and catalytic performance of tri-nuclearcopper complexLENG Shuai 1,2, LI Yuntao 1, DENG Jianguo 2(1School of Materials Science and Engineering, Southwest Petroleum University ,Chengdu 610500,Sichuan ,China ;2Institute of Chemical Materials ,China Academy of Engineering Physics ,Mianyang 621900,Sichuan ,China)Abstract :A complex catalyst with tetrahedron structure copper(I) iodide (CuI) as active center has been synthesized by solvent-thermal method ,which is then used in hydrosilylation. The effect of the material ratios on the product yield has been discussed in depth. The results show that when the molar ratio of ligand to CuI is 1∶6,the highest yield is obtained. The chemical composition ,spatial structure and properties of the catalyst have been studied by elemental analysis ,Fourier transform infrared spectroscopy analysis ,X-ray photoelectron spectroscopy analysis ,X-ray single crystal diffraction analysis ,UV-visible spectroscopy analysis and thermogravimetric analysis, respectively. Furthermore ,the catalytic performance has been tested by the hydrosilylation reaction of methylphenyl vinyl resin and methylphenyl hydro-silicone oil. The results indicate that the curing effect is the best when the blending system reacts for 24h under the addition of 0.04% complex at 150℃. The complex shows very good catalytic performance in hydrosilylation ,and can be synthesized with the advantages of low-cost raw materials ,simple preparation method and convenient storage. It is promising to solve the problem of the high cost of traditional precious metal catalysts in hydrosilylation.Key words :complex ;catalyst ;hydrosilylation ;copper(I) iodide ;crystal ;synthesis合材料。

氧化钛

氧化钛

二氧化钛百科名片二氧化钛,为TiO2,俗称钛白粉,多用于光触媒、,能靠紫外线消毒及杀菌,现正广泛开发,将来有机会成为新工业。

二氧化钛可由金红石用酸分解提取,或由四氯化钛分解得到。

二氧化钛性质稳定,大量用作中的白色,它具有良好的遮盖能力,和铅白相似,但不像铅白会变黑;它又具有锌白一样的持久性。

二氧化钛还用作搪瓷的消光剂,可以产生一种很光亮的、硬而耐酸的罩面。

目录二氧化钛简介管制信息本品不属于易制毒、易制爆化学品,不受公安部门管制。

名称中文名称:二氧化钛中文别名:二氧化钛,钛酐,氧化钛(IV)英文别名:Titanium(IV)oxide,Titaniumdioxide,Titanicanhydride,Titunicacidanhydride,Titania,Titanicacidanhydride,Titania,Unitane,Pigmentwhite6,化学式TiO2相对分子质量性状白色无定形粉末。

溶于和热浓,不溶于水、、?和稀硫酸。

与或与氢氧化碱或碳酸碱共同熔融成钛酸碱后可溶于水。

相对密度约。

熔点1855℃。

储存密封保存。

SCRC用途制备一定浓度的钛化合物标准。

颜料。

陶瓷工业。

聚乙烯着色剂。

研磨剂。

电容介质。

高纯钛盐制备。

耐高温合金、耐高温海绵钛制造。

具体介绍白色固体或粉末状的。

又称钛白。

TiO2,分子量,1830~1850℃,2500~3000℃。

存在的二氧化钛有三种变体:为四方晶体;为四方晶体;为正交晶体。

二氧化钛在水中的溶解度很小,但可溶于酸,也可溶于碱,反应的如下:二氧化钛和酸的反应:TiO2+H2SO4=TiOSO4+H2O二氧化钛和碱的反应:TiO2+2NaOH=Na2TiO3+H2O二氧化钛可由金红石用酸分解提取,或由分解得到。

二氧化钛性质稳定,大二氧化钛量用作中的白色颜料,它具有良好的遮盖能力,和铅白相似,但不像铅白会变黑;它又具有锌白一样的持久性。

二氧化钛还用作的,可以产生一种很光亮的、硬而耐酸的罩面。

铑金属苯乙酮

铑金属苯乙酮
Байду номын сангаас
INTRODUCTION The development of asymmetric homogeneous catalysts to elicit stereoselective transformations is an important branch of synthetic organic chemistry. In many cases, extensive optimization of chiral ligands and catalysts is required to achieve highly stereoselective reactions for specified substrates. Often, however, two major challenges remain. First, the discovery of catalytic systems for new asymmetric reactions and optimization of a catalytic system toward high stereoselectivity are time- and manpower-consuming efforts, which, although often effective, can yield homogeneous catalysts that are expensive and tend to be successful for a very limited reaction scope. Second, scaling up such catalytic reactions in a way that would be beneficial for industrial application requires an effective strategy for the recycling of catalysts. Heterogeneous catalysts hold practical advantages such as reduced contamination by catalyst residues leaching into the products, the safe and simple manipulation of workup, and the recovery and reuse of the costly chiral and metal resources. Several pathways have been taken toward this goal.1−4 The most common method used is the immobilization of homogeneous asymmetric catalysts by adsorption onto surfaces, encapsulation within porous materials, or covalent tethering to inert matrixes,1−7 yet such solutions typically yield significantly less active or stereoselective catalysts. Another approach is to modify surfaces with a chiral compound.1−4,8 The successful use of platinum modified with a cinchona alkaloid for hydrogenation of pyruvate esters is a notable example.9 More recently, incorporation of chiral ligands and/or catalysts into

钛植入合金表面电化学沉积掺镁羟基磷灰石涂层_熊睿

钛植入合金表面电化学沉积掺镁羟基磷灰石涂层_熊睿

钛植入合金表面电化学沉积掺镁羟基磷灰石涂层熊睿,庞小峰*,贾晓立(电子科技大学生命科学与技术学院,四川成都 610054)摘要:以Ca(NO3)2、(NH4)2HPO4和Mg(NO3)2为原料,采用电化学沉积法在医用钛合金表面制备了掺镁羟基磷灰石涂层,研究了电沉积工艺条件对掺镁羟基磷灰石涂层表面形貌的影响。

结果表明,当电流密度为1.0 mA/cm2,温度为65 °C,pH为4.5,n(Mg)∶n(Ca)= 1∶3,电沉积时间为1 300 s时,得到了均匀致密的晶须状涂层。

X射线衍射分析表明,烧结后的掺镁羟基磷灰石涂层中Mg2+取代了Ca2+,使HA涂层的晶格发生了变化。

关键词:钛合金;羟基磷灰石涂层;电化学沉积;镁;掺杂中图分类号:TG174.45 文献标志码:A文章编号:1004 – 227X (2012) 02 – 0072 – 04 Electrodeposition of magnesium-doped hydroxyapatite coating on surface of titanium implant alloy // XIONG Rui, PANG Xiao-feng*, JIA Xiao-liAbstract: A magnesium-doped hydroxyapatite (Mg-HA) coating was prepared by electrodeposition on the surface of medical titanium implant alloy with Ca(NO3)2, (NH4)2HPO4, and Mg(NO3)2 as raw materials. The effects of electro- deposition process conditions on the morphology of Mg-HA coating was studied. The results showed that Mg-HA coatings with uniform and dense crystal whiskers can be obtained under the following process conditions: current density 1.0 mA/cm2, electrodeposition temperature 65 °C, pH 4.5, Mg-to-Ca ratio 1:3, and electrodeposition time 1 300 s. X-ray diffraction analysis indicated that Ca2+ is substituted by Mg2+ in the Mg-HA coating after sintering, resulting in a change of the crystal lattice of HA coating.Keywords: titanium alloy; hydroxyapatite coating; electrodeposition; magnesium; dopingFirst-author’s address: College of Life Science and Technology, University of Electronic Science and Technology of China, Chengdu 610054, China1 前言羟基磷灰石[Ca10(PO4)6(OH)2,简称HAP或HA]收稿日期:2011–07–11修回日期:2011–08–30基金项目:国家“973”计划(2007CB936103)。

钙钛矿缺陷化学和表面钝化研究

钙钛矿缺陷化学和表面钝化研究

钙钛矿缺陷化学和表面钝化研究Calcium titanium oxide (CaTiO3), also known as perovskite, has attracted considerable attention in recent years due to its excellent photovoltaic properties. However, the performance of perovskite solar cells is often limited by defects and surface instabilities. In order to optimize the device efficiency and stability, extensive research hasbeen conducted on defect chemistry and surface passivation techniques.钙钛矿氧化物(CaTiO3),也被称为钙钛矿,由于其优异的光伏特性而在近年来引起了广泛的关注。

然而,钙钛矿太阳能电池的性能往往受到缺陷和表面不稳定性的限制。

为了优化器件的效率和稳定性,科学家们进行了大量关于缺陷化学和表面钝化技术方面的研究。

Defects in perovskite materials can arise from various sources, including lattice imperfections, impurities, and vacancies. These defects lead to trap states within the bandgap of the material, which can affect charge carrier dynamics and recombination processes. To understand and characterize these defect states, advanced spectroscopictechniques such as photoluminescence spectroscopy and transient absorption spectroscopy have been employed.钙钛矿材料中的缺陷可能来自多个来源,包括晶格缺陷、杂质和空位。

铜改性分子筛催化甲烷氧化制甲醇研究新进展

铜改性分子筛催化甲烷氧化制甲醇研究新进展

甲烷是天然气的主要成分,甲烷的转化和应用是天然气化工领域的重要研究方向,尤其是随着页岩气等非常规天然气资源的开发,甲烷催化转化制备化学品受到广泛关注。

甲醇常温下是液体,也是有机化工原料和C1化学的核心。

甲醇作为基本化工原料,可以很容易通过甲醇制烯烃、甲醇制芳烃工艺过程转化成烯烃、芳烃等重要的化工原料及燃料。

目前工业上制备甲醇主要采用一氧化碳催化加氢的方法,基本上都是采取合成气或煤气进行转换,属于甲烷的间接转化,这种间接途径碳原子利用率低,能耗较高,并且还伴随着多步反应过程。

因此,迫切需要开发一种可以替代间接路线的低成本直接转化工艺。

但是甲烷是一种稳定性很高的分子,由于其低的电子和质子亲和力、低的极性、高的电离能和强的C鄄H键(约440kJ·mol鄄1),难以被活化。

甲烷直接催化氧化制取甲醇是一条由甲烷一步直接制备甲醇的路线,长期以来受到研究者们广泛的关注。

甲烷的C鄄H键可以通过氧化反应过程被活化,但是,作为氧化中间产物之一甲醇中的C鄄H键比甲烷弱,在甲烷活化的反应条件下容易被完全氧化为二氧化碳。

受到生物体系中甲烷单加氧酶(MMO)室温选择氧化甲烷为甲醇的启发,研究人员发现模拟甲烷单加氧酶的金属改性分子筛催化剂能够实现催化甲烷氧化制甲醇,而铜改性的分子筛催化剂在催化甲烷氧化制甲醇反应中表现出良好的催化性能。

铜改性分子筛催化剂具有优异的催化性能、高温水热稳定性及良好的抗积炭能力,广泛应用于NO x的催化还原、低碳烷烃氧化以及羰基化等反应。

近年来学术界研究发现铜改性分子筛催化剂在催化甲烷制甲醇反应表现出优异的催化性能,并开展了广泛深入研究。

本文在梳理催化甲烷氧化制甲醇最新研究结果的基础上,综述了铜改性分子筛催化甲烷氧化直接制甲醇催化剂研究的最新进展。

铜改性分子筛催化甲烷氧化制甲醇研究新进展陈景润,刘俊霞*,张伟,袁亚飞,张亮,张磊,班渺寒(陕西延长石油(集团)有限责任公司大连化物所西安洁净能源(化工)研究院,陕西西安710065)摘要:甲烷直接催化氧化制取甲醇是近年来研究人员广泛关注的天然气资源高效利用新路线。

纳米二氧化钛

纳米二氧化钛

纳米二氧化钛的研究现状、应用及展望姓名:马苓化工学院学号:2011207366摘要: 综述了纳米二氧化钛的特性及其制备方法,液相法、气相法等。

概述了纳米二氧化钛的表面改性,介绍了纳米二氧化钛在各个领域的应用,最后对其发展前景进行了展望。

关键词:纳米二氧化钛,制备,表面改性,应用1.前言纳米科技是二十世纪80年代兴起的高新技术, 并将是二十一世纪高新技术的龙头, 它一问世就显示出在科学技术领域的重要地位, 纳米材料的制备、结构、性能[1]及应用的研究已经成为人们共同关注的前沿课题。

二氧化钛,俗称钛白,粘附力强,不易起化学变化,并且无毒。

它的熔点很高,被用来制造耐火玻璃,釉料,陶土,耐高温的实验器皿等。

纳米TiO2具有化学性能稳定,常温下几乎不与其它化合物反应,不溶于水、稀酸,微溶于碱和热硝酸,且具有生物惰性。

纳米TiO2是一种典型半导体料,纳米TiO2在光电和化学性质等方而有许多优异性能,能够把光能转化为电能和化学能,使在通常情况下难于实现或不能实现的反应( 水的分解) 能够在温和的条件下(不需要高温高压) 顺利的进行。

纳米TiO2[2]具有独特的光催化性,优异的颜色效应以及紫外线屏蔽等功能,在能源,环保,建材,医疗卫生等领域有重要应用前景,是一种重要的功能材料。

纳米级半导体催化氧化作为一项新兴的现代污水处理技术,具有速度快,设备简单,操作方便,处理效果好,无 2 次污染,杀菌作用强,应用前景广阔。

对低浓度污染物及气相污染物液也有很好的去除效果,且催化材料易得,运行成本低,是一项很有前途的污染治理技术,近年来受到广泛关注。

随着纳米二氧化钛技术的发展,其应用领域更加广泛。

2. 研究现状2.1 纳米二氧化钛的制备制备纳米TiO2的方法很多, 归纳起来主要有: 液相法、气相法、机械粉碎法[3]、电化学法等。

其中,气相法和液相法各有优缺点,气相法所制得的纳米Ti02粉体粒度小,单分散性好,但工艺复杂、成本高。

青铜矿二氧化钛纳米结构的研究

青铜矿二氧化钛纳米结构的研究

广州化工Guangzhou Chemical Industry 第47卷第21期2019年11月Vol. 47 No. 21Nov. 2019青铜矿二氧化钛纳米结构的研究孙萍萍,郭云均,葛传楠,付 城,王 广,田玖玖(江苏第二师范学院物理与电子工程学院,江苏南京210013)扌商 要:二氧化钛由于资源丰富、价格便宜、化学稳定性好等优点,在能源环境领域有着广泛的应用。

它有多种晶型,分 别锐钛矿、板钛矿、金红石、青铜矿二氧化钛。

其中,青铜矿二氧化钛由于独特的结构特点,具有更适合锂/钠离子迁移的通道, 相比其他晶型的二氧化钛,因此在能源存储领域具有广大的应用前景。

基于此,介绍了青铜矿二氧化钛纳米结构、制备方法及应 用.旨在加深对其的理解,并推广其应用。

关键词:青铜矿二氧化钛;纳米结构;制备方法;应用中图分类号:TQ134. 1 文献标志码:A 文章编号:1001-9677(2019)21-0020-03Research of Nanostructure of Bronze Titanium Dioxide SUN Ping-ping , GUO Yun-jun , GE Chuan-nan , FU Cheng , WANG Guang , TIAN Jiu-jiu(College of Physics and Electronic Engineering , Jiangsu Second Normal University ,Jiangsu Nanjing 210013 , China)Abstract : Titanium dioxide is widely used in the field of energy and environment due to its advantages of abundant resources , low price and good chemical stability. It has many polymorphs , including anatase , brookite , rutile and bronze. Among them , bronze titanium dioxide is more favorable for lithium/sodium ion migration due to its unique structural characteristics , which is more promising in the field of energy storage than others. Based on this , the nanostructure , preparation method and application of bronze titanium dioxide were introduced , in order to deepen the understanding of bronze titanium dioxide and promote its application.Key words : bronze titanium dioxide ; nanostructure ; preparation method : application 二氧化钛由于资源丰富、环境友好、价格低廉且化学性质稳定等特点,在能源和环境领域得到了广泛的应用。

钛铱不溶性阳极制作工艺流程

钛铱不溶性阳极制作工艺流程

钛铱不溶性阳极制作工艺流程英文回答:To begin with, I would like to explain the process of manufacturing insoluble anodes using titanium iridium. This process involves several steps that ensure the production of high-quality anodes.Firstly, the starting material is titanium iridium alloy, which is a combination of titanium and iridium metals. This alloy is chosen due to its excellent corrosion resistance and high conductivity properties. The alloy is typically in the form of a solid bar or plate.The first step in the manufacturing process is to cut the titanium iridium alloy into the desired shape and size. This can be done using various cutting tools such as saws or water jets. The alloy can be cut into different shapes, such as rectangular or cylindrical, depending on the specific requirements of the anode.After cutting, the next step is to clean the titanium iridium alloy. This is crucial to remove any impurities or contaminants that may affect the performance of the anode. Cleaning can be done through various methods, including chemical cleaning or mechanical polishing.Once the alloy is clean, the next step is to prepare the surface for coating. This involves roughening the surface to improve adhesion of the coating material. This can be done through sandblasting or etching. The roughened surface provides a better surface area for the coating material to adhere to.After surface preparation, the next step is to apply the coating material. In the case of insoluble anodes, the most commonly used coating material is a mixed metal oxide (MMO) coating. This coating is applied using various methods, such as thermal spraying or electrochemical deposition.Once the coating is applied, the anode is subjected toa curing process. This involves heating the anode at a specific temperature for a certain duration to ensure the proper bonding of the coating material to the alloy substrate. Curing can be done in an oven or using other heat treatment methods.After curing, the final step is to inspect the anode for quality control purposes. This involves checking for any defects or imperfections in the coating, as well as measuring the electrical conductivity of the anode. Any defective anodes are rejected, while the acceptable ones are packaged and prepared for shipment.中文回答:首先,我想解释一下使用钛铱制造不溶性阳极的工艺流程。

多巴胺介导钛表面纳米银涂层的构建及其抗菌和成骨活性评价

多巴胺介导钛表面纳米银涂层的构建及其抗菌和成骨活性评价
2、成骨活性实验将涂层、未涂层钛片与成骨细胞共培养一定时间,观察细 形态、数量和碱性磷酸酶(ALP)活性。
成骨活性评价
3、成骨评价标准根据细胞增殖、ALP活性和细胞矿化能力评价成骨活性。
机理探讨
机理探讨
1、纳米银的传输机制多巴胺分子通过自组装在钛表面形成致密的单层,提供 了一个稳定的微环境。在此环境下,纳米银颗粒能够快速、均匀地分散在涂层中, 并通过多巴胺的介导作用与钛表面牢固结合。
一、钛内植物表面纳米银超疏水 抗菌涂层的构建
1、前期准备
1、前期准备
在构建钛内植物表面纳米银超疏水抗菌涂层之前,需要对钛内植物进行表面 预处理,以提高其表面能和水疏性。常用的预处理方法包括酸碱处理等离子处理、 射线处理等。经过预处理的钛内植物表面能够增加纳米银颗粒的附着能力,从而 提高涂层的稳定性和耐久性。
三、问题和解决方案
三、问题和解决方案
在钛内植物表面纳米银超疏水抗菌涂层的构建和评估过程中,可能会遇到一 些问题,如纳米银颗粒的团聚、涂层稳定性的不足、细胞毒性等。针对这些问题, 可以采取以下解决方案:
三、问题和解决方案
(1)对于纳米银颗粒的团聚问题,可以通过添加分散剂、调整溶液pH值等方法, 改善纳米银颗粒的分散性。
1、性能评估方法
(3)细胞相容性评估:通过细胞实验测定涂层对细胞生长和增殖的影响,以评 估其生物相容性。
1、性能评估方法
(4)体内实验评估:将涂层植入体内,通过观察其组织反应、排异反应等方面, 评估涂层的生物安全性。
2、影响因素
2、影响因素
钛内植物表面纳米银超疏水抗菌涂层的性能受到多种因素的影响,如纳米银 颗粒的尺寸、浓度、表面改性等。此外,涂层的厚度、均匀度、稳定性等因素也 会影响其性能。因此,在制备和评估过程中,需要充分考虑这些因素,以获得最 佳的涂层性能。

【CN109876843A】铜合金修饰二氧化钛氮化碳异质结光催化剂及制备方法【专利】

【CN109876843A】铜合金修饰二氧化钛氮化碳异质结光催化剂及制备方法【专利】

(19)中华人民共和国国家知识产权局(12)发明专利申请(10)申请公布号 (43)申请公布日 (21)申请号 201910178047.X(22)申请日 2019.03.08(71)申请人 北京化工大学地址 100029 北京市朝阳区北三环东路15(72)发明人 张慧 乔之勇 李进 (74)专利代理机构 北京华谊知识产权代理有限公司 11207代理人 刘月娥(51)Int.Cl.B01J 27/24(2006.01)C01B 3/04(2006.01)(54)发明名称铜合金修饰二氧化钛/氮化碳异质结光催化剂及制备方法(57)摘要一种铜合金修饰二氧化钛/氮化碳异质结光催化剂及制备方法,属于纳米材料光催化技术领域。

催化剂的表达式为M x Cu/TC,其中M x Cu为铜基合金纳米粒子,M代表贵金属Au、Pt和Pd,x代表贵金属M与Cu的摩尔比,为0.25~4,铜基合金纳米粒子质量百分含量为0.1~10.0wt%,TC为具有蜂巢状类纳米片阵列形貌的二氧化碳/氮化碳异质结。

该催化剂是通过沉积还原法将铜基合金纳米粒子原位固载于二氧化碳/氮化碳异质结上得到的,尺寸2~8nm的铜基合金纳米粒子高分散于蜂巢状类纳米片阵列异质结表面。

优点在于,铜基合金修饰的二氧化碳/氮化碳异质结光催化剂在光解水制氢和光还原CO 2中表现出优异的活性,催化剂结构稳定,且制备工艺简便,易于实现工业化生产。

权利要求书1页 说明书6页 附图4页CN 109876843 A 2019.06.14C N 109876843A1.一种铜合金修饰二氧化钛/氮化碳异质结光催化剂,其特征在于,表达式为M x Cu/TC,其中M x Cu为铜基合金纳米粒子,M代表贵金属Au、Pt和Pd,x代表贵金属M与Cu的摩尔比,为0.25~4,铜基合金的质量百分含量为0.1wt%~10.0wt%;TC为具有蜂巢状类纳米片阵列形貌的二氧化钛/氮化碳异质结。

2.一种权利要求1所述的铜合金修饰二氧化钛/氮化碳异质结光催化剂的制备方法,其特征在于,包括以下步骤:(1)二氧化钛/氮化碳异质结的制备采用文献报道的以尿素为原料的快速简便热缩聚法制备g -C 3N 4,将得到的黄色粉末粗产品研磨后,依次用100~300mL去离子水,25~100mL的0.1~0.4mol/L HCl溶液和50~200mL的0.05~0.2mol/L NaOH溶液洗涤去除g -C 3N 4表面的杂质,最后用去离子水洗涤至滤液显中性,在70~80℃下干燥20~28h得到黄色的g -C 3N 4样品;将100~200mg上述g -C 3N 4加入50~80mL异丙醇中,超声0.5~1h得到剥离g -C 3N 4层片分散液,转移至聚四氟乙烯容器后依次加入0.03~0.18mL的二乙烯三胺与3~9mL钛酸异丙酯,超声处理3~10min使溶液混合均匀,将容器装入不锈钢反应釜在180~200℃下溶剂热反应12~48h,再使用50~80mL无水乙醇洗涤离心3次后在在60~80℃下干燥12~24h得到二氧化钛/氮化碳异质结前驱体,将前驱体在静态空气气氛下于管式炉中以1~3℃/min的速率升温至300~400℃恒温3~5h,得到二氧化钛/氮化碳异质结,简称TC;(2)铜基合金修饰的二氧化钛/氮化碳异质结光催化剂M x Cu/TC的制备将100~200mg上述所得二氧化钛/氮化碳异质结置于250mL三口烧瓶中,依次加50~100mL去离子水,0.5~5mL的8.0×10-4~0.4mol/L M的化合物溶液和0.5~5mL的4×10-4~1.2mol/L Cu盐溶液后超声分散10~30min,再向溶液中滴加0.01~0.10mol/L的NaOH溶液调节pH至8.5~10.0;在N 2气氛60~100℃下机械搅拌4~6h后向溶液滴加10~40mL0.05~0.20mol/LNaBH 4溶液,冷却至室温,离心并用50~80mL无水乙醇洗涤三次,所得沉淀物于60~100℃下真空干燥10~16h,得到铜基合金修饰二氧化钛/氮化碳异质结光催化剂M x Cu/TC。

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Effect of surface species on Cu-TiO 2photocatalytic activityBaifu Xin a ,b ,Peng Wang a ,*,Dandan Ding b ,Jia Liu b ,Zhiyu Ren b ,Honggang Fu baSchool of Municipal and Environmental Engineering,Harbin Institute of Technology,Harbin 150090,ChinabSchool of Chemistry and Materials Science,Heilongjiang University,Harbin 150080,ChinaReceived 20June 2007;received in revised form 11August 2007;accepted 3September 2007Available online 6September 2007AbstractThe Cu-TiO 2nanoparticles with different Cu dopant content were prepared by sol–gel method.The structure of the as-prepared catalysts and the surface species of Cu-TiO 2were determined using X-ray diffraction (XRD),X-ray photoelectron spectroscopy (XPS)and diffuse reflection spectroscopy (DRS).The relationship between the photocatalytic activity and the surface species of Cu-TiO 2was revealed via the measurement of surface photovoltage spectroscopy (SPS)as well as the degradation of the rhodamine B (RhB).The experimental results suggest that the Cu-TiO 2photocatalysts with appropriate content of Cu (about 0.06mol%)possess abundant electronic trap,which effectively inhibits the recombination of photoinduced charge carriers,improving the photocatalytic activity of TiO 2.While at high Cu dopant region (>0.06mol%),the excessive oxygen vacancies and Cu species can become the recombination centers of photoinduced electrons and holes.Meanwhile,at heavy Cu doping concentration,excessive P-type Cu 2O can cover the surface of TiO 2,which leads to decrease in the photocatalytic activity of photocatalyst.The photocatalytic experimental results are in good agreement with the conclusions of SPS measurements,indicating that there is a close relationship between the photocatalytic activity and the intensity of SPS spectra.#2008Published by Elsevier B.V .Keywords:TiO 2;Cu doping;Photocatalysis;SPS1.IntroductionTitanium dioxide is broadly used as a photocatalyst because it is photochemically stable,non-toxic and cost little [1–5].However,the efficiency of photocatalytic reactions is limited by the high recombination rate of photoinduced electron–hole pairs formed in photocatalytic processes and by the absorption capability for visible light of photocatalysts.Many studies have been devoted to the improvement of photocatalytic efficiency of TiO 2,such as depositing noble metals [6–14]and doping metal or nonmetal ions [15–22].Generally,the introduction of doped ions can result in the formation of a doping energy level between the conduction and valence bands of TiO 2.In principle,it should be possible for doped TiO 2to extend its absorption into the visible region effectively.The effects of copper ions have been studied on the photodegradation of organic pollutant [23–29].A number ofpostulations have been put forward with regard to the role of copper ions play in the mechanism of the photocatalytic degradation of these organics.Some studies have suggested that observed enhancement of the photocatalytic degradation rates was due to electron trapping by the copper ions leading to the prevention of electron hole-recombination [23,26,30–35].Despite a large number of studies have been carried out on these Cu-TiO 2systems,many aspects with regard to the role of copper species with multivalent states in the photocatalytic reaction remain unclear.In this work,the copper-doped TiO 2nanoparticles were prepared and the effects of the surface species on the photocatalytic activity were investigated by means of XPS,SPS and DRS technology.2.Experimental2.1.Preparation of Cu-TiO 2photocatalystThe photocatalyst was prepared by means of sol–gel method.7.6mL of tetrabutyl titanate was slowly added into 8mL of ethanol under vigorously stirring (solution A),a certain amount of Cu(NO 3)2dissolved in 2mL of ethanol was then/locate/apsuscAvailable online at Applied Surface Science 254(2008)2569–2574*Corresponding author.Tel.:+8645186283801;fax:+8645186673647.E-mail address:pwang73@ (P.Wang).0169-4332/$–see front matter #2008Published by Elsevier B.V .doi:10.1016/j.apsusc.2007.09.002added dropwise to solution A,and the mixed solution was continuously stirred until the gel was formed.The gel was dried at1008C,calcined at4008C,and ground to obtain the Cu-TiO2 nanoparticles.The Cu concentrations in the samples were0, 0.02,0.04,0.06,0.08,0.10,0.15,0.20,0.40,0.60,0.80,1and 3mol%,respectively.2.2.Characterization of samplesXRD analysis of TiO2powders was carried out on a Rigaku D/MAX-rA X-ray diffractometer,employing Cu K a(Ni filtered)radiation l=0.15418nm.The patterns were recorded in a range of20–658(2u).The surface compositions and chemical states of the samples were examined by a VG ESCALAB MKII X-ray photoelectron spectrometer using a monochromatic aluminum X-ray source. All binding energies(BE)were calibrated by the BE(284.6eV) of C1s,which gave BE values within an accuracy ofÆ0.1eV.Quantitative analysis was carried out using the sensitivity factors supplied by the XPS instrument.The SPS instrument was assembled at Jilin University,and monochromatic light was obtained by passing light from a 500W xenon lamp(CHF-XQ500W,China)through a double prism monochromator(SBP300,China).The slit widths of entrance and exit were2and1mm,respectively.A lock-in amplifier(SR830,USA),synchronized with a light chopper (SR540,USA),was employed to amplify the photovoltage signal.The powder sample was sandwiched between two ITO glass electrodes.The diffuse reflection spectra were obtained in the wavelength range300–700nm using a Shimadzu UV-2550 UV–vis spectrometer equipped with the integrating sphere accessory for diffuse reflectance spectra.BaSO4was used as a reference.2.3.Evaluation of the photocatalytic activity of Cu-TiO2The photocatalytic degradation of RhB over Cu-TiO2was carried out in a home-built reactor.A160W high-pressure mercury lamp was used as light source,whose intensity was 17.1mW/cm2.In each run0.10g Cu-TiO2catalyst was added into20mL RhB solution of10mg/L.After premixing for 20min,the light was turned on to initiate the reaction.A Shimadzu UV-2550UV–vis spectrometer was used to determine the concentration of RhB solution before and after photocatalytic degradation.3.Results and discussion3.1.XRD measurementFig.1shows the XRD patterns of3mol%Cu-TiO2powders calcined at different temperatures for4h.From Fig.1,it can be seen that a little rutile phase appeared when the calcining temperature was5508C,a considerable amount of anatase transformed into rutile in the powder while the sample was calcined at6008C,and all anatase transformed into rutile after calcined paring with the XRD patterns of pure TiO2samples[36],it can be found that Cu dopant could promote the phase transformation from anatase to rutile.There were two possible reasons for the decrease in the phase transformation temperature.One was that the density of surface defects of Cu-TiO2would increase with increasing Cu doping content,which would promote the phase transformation since the surface defects were considered as the rutile nucleation sites[37,38], Another was that the surface oxygen vacancy concentration of anatase grains is increased with increase of Cu dopant content, which favored the rearrangement of ions and reorganization of structure for rutile phase[39].Moreover,no peaks due to various Cu species were detected in Fig.1,which suggests that Cu species were uniformly dispersed in TiO2powder.3.2.XPS characterizationThe XPS spectra of O1s of TiO2(A)and the0.06%Cu-TiO2 (B)are shown in Fig.2.They werefitted with the non-linear least squarefit program using Gauss–Lorentzian peak shapes and three O1s peaks appear after deconvolution,which are attributed to lattice oxygen(O L,530.3eV),surface hydroxyl oxygen(O–OH,532.1eV)and adsorbed oxygen(O S,533.6eV) in TiO2[40].According to the principle method and handbook of the XPS instrument,the relatively quantitative analysis can be performed by utilizing the XPS peak area of different elements and their own sensitivity factor according to the following equation:nðE1ÞnðE2Þ¼AðE1Þ=SðE1ÞAðE2Þ=SðE2Þ;where n is the atomic number,E an element and S is elemental sensitivity factor.Thus,some important XPS data could be obtained.The approximate formulas for calculating the per-centage of oxygen vacancies are as follows:V O}%¼½ðThe atomic number ratio of TiÂ4ÞÀðThe atomic number ratio of O LÂ2Þ2sÂ100; Fig. 1.The XRD patterns of the3mol%Cu-TiO2calcined at different temperature for4h.B.Xin et al./Applied Surface Science254(2008)2569–2574 2570where V O ¨is the oxygen vacancies.Table 1shows the XPS data of O and Ti elements on the surface of TiO 2and the 0.06%Cu-TiO 2.Based on the data of Fig.2and Table 1,it can be found that the amount of surface hydroxyl oxygen,adsorbed oxygen and oxygen vacancies of the 0.06%Cu-TiO 2increased but the amount of crystal lattice oxygen decreased.The oxygen vacan-cies are a very active group,which can easily combine with other atoms or groups to become stable,and it accounts for an increase in the amount of the adsorbed oxygen and surface hydroxyl oxygen [41,42].Fig.3shows the Cu2p 3/2XPS spectrum of the 3mol%Cu-TiO 2.It was fitted with the non-linear least square fit program using Gauss–Lorentzian peak shapes.The XPS spectrum of Cu2p 3/2indicates that there are two components after deconvolution,attributed to Cu 2O (928.9eV)and CuO (931.1eV)on the surface of TiO 2,respectively.According to the position and the shape of the XPS peaks,the copper on the surface of TiO 2may exist in multiple-oxidation states.These experimental data are less than the reference data of Cu2p binding energies of Cu 2O (932.1eV)and CuO (933.4eV)reported by Wagner et al.[43].Meanwhile,the Ti2p binding energy of the 0.06mol%Cu-TiO 2sample is increased comparing with that of pure TiO 2as shown in Fig.4.This is because the Fermi levels of Cu 2O and CuO are lower than that of TiO 2so that the electrons of TiO 2may transfer to the Cu 2O and CuO dispersed on the surface of TiO 2,which results in changes in the outer electron cloud density of Ti and Cu ions.So,the Ti2p binding energy increases and Cu2p binding energies decrease.This fact suggests that there is an intense interaction between TiO 2and Cuspecies.Fig.2.XPS spectra of O 1s on the surface of TiO 2(A)and the 0.06%Cu-TiO 2(B)nanoparticles,respectively.Table 1XPS data of different chemical states of O and Ti elements on the surface of TiO 2and the 0.06%Cu-TiO 2SamplesBinding energy (eV)Atomic number ratio of O L and Ti Percentage of O L Percentage of O –OH Percentage of O S Evaluated percentage of oxygen vacancies O 1s (O L )O 1s (O –OH )O 1s (O S )Ti2p 3/2TiO 2530.1531.6533.0457.6100:58.377.015.57.5170.06%Cu-TiO 2530.1531.4533.1458.1100:61.564.625.59.923Fig.3.XPS spectrum of Cu2p on the surface of the 3%Cu-TiO 2nanoparticles.Fig.4.XPS spectra of Ti2p of TiO 2and the 0.06%Cu-TiO 2nanoparticles,respectively.B.Xin et al./Applied Surface Science 254(2008)2569–257425713.3.DRS analysisFig.5is DRS spectra of pure TiO 2and Cu-TiO 2with different doping ratio.Three response regions can be seen after Cu doping.It is well known that Cu 2O and CuO are P-type semiconductors with a small band gap of 2.1and 1.7eV,respectively [44,45].The absorption in the visible region from 400to 700nm can be attributed to the absorption of Cu 2O and CuO on the TiO 2surface.The Eg of TiO 2is approximately 3.2eV which corresponds to the absorption of wavelength <380nm.The DRS spectra of Cu-TiO 2exhibit a progressive increase in absorbance with an increase in Cu content.It can be concluded that Cu modified TiO 2extends its absorption into the visible region effectively.3.4.SPS analysisThe surface photovoltage (SPV)method is a well-establish contactless technique for the characterization of semiconduc-tors.It can offer important information about semiconductor surface,interface and bulk properties,mainly reflecting the carrier separation and transfer behavior with the aid of light [46].The SPS principle can be explained as shown in Chart 1.The absorbed photons induce the formation of free carriers by creating electron–hole pairs via band-to-band transitions.The photoinduced electrons may be transferred from the surface to the bulk and the photogenerated holes can be moved to the surface under the built-in electric field.Thus,the surfacepotential across the surface space charge region (SCR)change from V s to V s 0.It is the signal of SPS that variational value of surface potential before and after illumination during the test,i.e.D V .Fig.6shows the SPS spectra of pure TiO 2and Cu-TiO 2with different Cu dopant content.It can be found that the SPS spectra of pure TiO 2is different from that of doped TiO 2,The SPS intensity is increased with increase in Cu dopant content from 0up to 0.06mol%,and then decreased.This is because that oxygen vacancies and Cu (II)ions can act as traps to capture the photoinduced electron.Meanwhile,due to the Fermi levels of CuO and Cu 2O are lower than that of TiO 2,which leads to the photoinduced electrons transfer from TiO 2to CuO and Cu 2O at low Cu dopant region ( 0.06mol%).These factors result in that the surface potential of Cu doped TiO 2is much less than that of pure TiO 2during the illumination.Thus,the recombination of photoinduced electron–hole pairs is inhibited so as to make the SPS response signal increase.This is of benefit to the photocatalytic reaction.While at high Cu dopant region (>0.06mol%),the excessive oxygen vacancies and Cu species can become the recombination centers of photoinduced electrons and holes.So,it can be seen that the intensity of SPS signal is decreased.Moreover,from Fig.7,SPS spectra of pure TiO 2and the mol%Cu-TiO 2,a new negative response can be found.It can be attributed to the SPS response of P-type Cu 2O.It is well known that P-type semiconductor has poor photocatalytic activity.3.5.Evaluation of photocatalytic activityFig.8shows the photocatalytic degradation curves of RhB over Cu-TiO 2photocatalysts with different Cu dopant content calcined at 4008C for 4h.It can be found that the degradation ratio of RhB is increased gradually with increase in Cu dopant content.Over 0.06mol%Cu-TiO 2,the degradation ratio is the highest,which could be attributed to the following:(1)appropriate amount of oxygen vacancies and doped Cu (II)ions on the surface layer of TiO 2can effectively capture the photoinduced electrons;(2)photoinduced electrons can transfer to the Cu 2O and CuO on the surface of TiO 2;(3)the amount of surface hydroxyl is increased.While at highCuFig. 5.The DRS spectra of (a)pure TiO 2,(b)0.02mol%Cu-TiO 2,(c)0.2mol%Cu-TiO 2,(d)0.6mol%Cu-TiO 2,(e)0.8mol%Cu-TiO 2,(f)1.0mol%Cu-TiO 2and (g)3.0mol%Cu-TiO 2.Chart 1.Schematic diagram of surface photovoltage spectroscopyprinciple.Fig.6.SPS spectra of pure TiO 2and Cu-TiO 2with different Cu content.B.Xin et al./Applied Surface Science 254(2008)2569–25742572dopant region (>0.06mol%),the excessive oxygen vacancies and Cu species can become the recombination centers of photoinduced electrons and holes.Meanwhile,excessive P-type Cu 2O can cover the surface of TiO 2,leading to decrease in the photocatalytic activity of photocatalyst.The photocatalytic experimental results are in good agreement with the conclu-sions of SPS measurements,indicating that there is a close relationship between the photocatalytic activity and the intensity of SPS spectra.So the activity of photocatalyst may be estimated by SPS measurements.4.Conclusions(1)The Cu-TiO 2nanoparticles with different Cu dopant content have been prepared via sol–gel method.The Cu-TiO 2photocatalysts with appropriate content of Cu (about 0.06mol%)possess abundant electronic trap,such as the oxygen vacancies and Cu (II)ions.Meanwhile,the Cu 2O and CuO also act as the roles of capture the photoinduced electrons.As a result,the recombination of photoinduced charge carriers can be effectively inhibited.In addition,the content of surface hydroxyl on the surface of the 0.06mol%Cu-TiO 2is increased remarkably in contrast to that of pure TiO 2.These factors can improve the photocatalytic activity of TiO 2.While at high Cu dopant region (>0.06mol%),the excessive oxygen vacancies and Cu species can become the recombination centers of photoinduced electrons and holes.Meanwhile,at heavy Cu doping concentration,excessive P-type Cu 2O can cover the surface of TiO 2,which leads to decrease in the photocatalytic activity of photocatalyst.(2)The photocatalytic experimental results are in good agreement with the conclusions of SPS measurements,indicating that there is a close relationship between the photocatalytic activity and the intensity of SPS spectra.So the activity of photocatalyst may be estimated by SPS measurements.AcknowledgmentsThis project is supported from the Key Program Projects of National Natural Science Foundation of China (no.20431030),the Program for New Century Excellent Talents in University (NCET-04-0341),the Foundation for Excellent Youth of Heilongjiang University (2005),the Foundation for Youth Science and Technology Innovation Talents of Harbin of China (no.2006RFQXS096),the Key Item Projects of Educational Department of Heilongjiang Province of China (no.1152Z002),for which the authors are very grateful.References[1]A.Fujishima,T.N.Rao,D.A.Tryk,J.Photochem.Photobiol.C 1(2000)1–21.[2]Z.G.Zou,J.H.Ye,K.Sayama,H.Arakawa,Nature 414(2001)625–627.[3]R.Asahi,T.Morikawa,T.Ohwaki,K.Aoki,Y .Taga,Science 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