PCB无铅喷锡PFMEA分析范例
合集下载
- 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
- 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
- 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
product 7 performance and cosmetics
板子浸助焊剂后到喷 锡停留时间长
holding time from 2 flux coating to HASL is too long
涂助焊剂10min内完成喷锡 control holding time
within 10 min from flux coating to HASL
来料污渍dirty incoming boards
1
每批来料抽检spot inspect every lot of the incoming boards
生产目检 employee checks
7
49
绿油PAD边发白
微蚀过度over microetching
掉油solder mask on pad turn white and drop from
锡面粗糙rough solder 5 surface
H2SO4含量偏低 sulfuric acid concentration is
too high
2
浓度控制在2-4%
每班化学分析一次
control according to 2- chemical analysis
4%
every shift
4
56
SPS含量偏低SPS content is too
探 测R 度P DN
前处理吸干:吸干板 面水份
sponge:sponge water on board
surface
吸干不够 unadequate
sponge
影响吹干效果 affect the
drying
5
影响外观 affect cosmetics
海棉润湿度差sponge is poor wetting
过程 功能process function
要求 requirement
潜在失 效模式 potential failure mode
潜在失 效后果 potential failure effect
严 重 度
S
级别 clas sifi cati
on
潜在失效 起因/机理potential
failure cause/mechanism
正常板:145±5℃
烤板温度偏高baking temperature is too high
2
绿油固化不良板:130±5℃ for common board：145±5
℃; for soldermask solidify defect board：
设备自动控制baking temperature controller
high
浓度控制在50-70g/L 每班化学分析一次
2 control according to 50- chemical analysis 4 56
70g/L
every shift
速度太慢speed is too slow
速度控制在3.5±0.5m/min 每班检查速度设定值
1 control the speed within Check speed
to HASL
surface to form
the Pd/Ti coating
and meanwhile to protect the solder mask
涂覆不均匀 uneven coating
上锡不良poor solderability
7
锡高 thickness
solder
影响产品性能 及外观affect
S
date
O
D
R P N
烤板:烤去板子水份 baking:remove the
water on board surface
烤板温度高 baking
temperature is too high
绿油发黄影响 外观solder mask discolor to affect the cosmetics
5
不定期巡检touring inspection randomly
4
56
无none
喷咀堵塞sprayer nozzle is blocked
1
定时对喷嘴进行保养 Maintain the nozzle
regularly
生产目检 employee checks
7
49
风刀气压不足air
2
首板检查合格后方可批量生 产inspect the first
水洗压力不够 rinsing pressure
is unadequate
1
水洗压力控制在1.0－ 每班员工目视检查压
2.0kg/cm2 control
力表Every shift
rinsing pressure within employee checks
7
1.5－2.5kg/cm2
pressure gauge
频 度 O
现行过程 控制预防current process
control method
现行过程 控制探测 current process detection
探 测 度
R P
DN
建议
责任及 目标完 成日期
措施结果 action result
措施advice action
respons
ibility 采取的措施 & due action adopted
潜在失 效后果 potential failure effect
严 重 度
S
级别 clas sifi cati
on
潜在失效 起因/机理potential
failure cause/mechanism
频 度 O
现行过程 控制预防current process
control mt process detection
每班员工目视检查压
力表Every shift employee checks
7 49
pressure gauge
无none 无none 无none
防呆计时器锁定25PNL清理
风刀堵塞air knife is blocked
一次风刀口clean the air 2 knife every 25 panels by 生产自检Self-check
low
浓度控制在50-70g/L 每班化学分析一次
2 control according to 50- chemical analysis 4 56
70g/L
every shift
建议
责任及 目标完 成日期
措施结果 action result
措施advice action
respons
ibility 采取的措施 & due action adopted
2
开线前用清水浸泡海棉至软 化dip sponge to make it
soft before use
生产前点检check before production
5
70
海棉太脏sponge is too dirty
2
开线前清洗一次海棉clean the sponge before production
生产前点检check before production
潜在失效 起因/机理potential
failure cause/mechanism
频 度 O
现行过程 控制预防current process
control method
现行过程 控制探测 current process detection
探 测R 度P DN
微蚀不够 unadequate
microetching
micro-
锡面粗糙rough solder 5
1/7
过程 功能process function
要求 requirement
潜在失 效模式 potential failure mode
潜在失 效后果 potential failure effect
严 重 度
S
级别 clas sifi cati
on
49
水脏water is dirty
1
对水洗缸进行更换和保养 re-new rinsing tank and
maintain it according
生产目检 employee checks
7
35
2/7
无none 无none
过程 功能process function
要求 requirement
潜在失 效模式 potential failure mode
article prior to batch production
首板PQA全检 total inspect the first
article by PQA
5
70
knife pressure is
unadequate
1
气压控制为3-5kg/cm2 control air pressure
within 3-5kg/cm2
编制 Prepareby：
类型Type:
PCB
关键日期 Key Date：
/
内容版本content Version：B1
审批Approvalby：
过程责任
无铅喷锡Lead free hot air solder 修订日期
Responsibility：
leveling
Modify Date：
2019/7/1
3
30
130±5℃
无none 无none
速度太快speed is too fast
速度控制在3.5±0.5m/min 每班检查速度设定值
1 control the speed within Check speed
7
3.5±0.5m/min
settings per shift
49
无none
微蚀不够 unadequate
成铅锡合金同时保 holding time 油solder mask
护阻焊层flux
out of on pad turn 5
coating:help control from white and
solder to combine flux coating drop from pad
with copper
正常板:30min,绿油固化不
烤板时间偏长baking time is too long
2
良板:120min for common board： 30min,for soldermask solidify defect board：
烤板时间计时器控制 baking timer control
3
30
120min
Potential Failure Mode and Effect Analysis 过程潜在失效模式及后果分析
（PFMEA）
项目Item：
双面板/多层板double-side/multi- FMEA编号
layers PCB
FMEA No.：
FMEA-LF-HAL-01
编制日期Pepare date：2015/4/20
5
pad
H2SO4含量偏高 sulfuric acid concentration is
too high
2
浓度控制在2-4%
每班化学分析一次
control according to 2- chemical analysis
4%
every shift
4
56
SPS含量偏高SPS content is too
5
70
建议
责任及 目标完 成日期
措施结果 action result
措施advice action
respons
ibility 采取的措施 & due action adopted
S
date
O
D
R P N
无none
无none
前处理助焊剂:有助 浸助焊剂到喷
于铜面与锡焊接形 锡时间管控差 PAD绿油发白掉
工厂批准plant approval ：
核心小组core team： 1.如果客户有指定产品及过程特性符号，按客户要求标识；2.客户没有指定，则按如公司规定标识。产品特性符号表示: “◆”,过程特性符号表示:“▲”。classification symbol description ：1.mark symbol per customer's specific symbol;2.if no specific symbol from customer，mark symbol as below:“◆” for product special characteristic ,and “▲” for process spec
7
3.5±0.5m/min
settings per shift
49
无none 无none 无none 无none 无none
前处理水洗：清洗 水洗不净 板面rinsing:clean rinsing is the board surface not clean
污染助焊剂 pollute the 5
flux
S
date
O
D
R P N
无none
无none
前处理：去除板面 氧化，粗化铜面 microetching:remove
the oxidation on board and roughen
surface
◆
微蚀量不足
2
0.5-1.0um
每班化学分析一次 chemical analysis 4 40
every shift
板子浸助焊剂后到喷 锡停留时间长
holding time from 2 flux coating to HASL is too long
涂助焊剂10min内完成喷锡 control holding time
within 10 min from flux coating to HASL
来料污渍dirty incoming boards
1
每批来料抽检spot inspect every lot of the incoming boards
生产目检 employee checks
7
49
绿油PAD边发白
微蚀过度over microetching
掉油solder mask on pad turn white and drop from
锡面粗糙rough solder 5 surface
H2SO4含量偏低 sulfuric acid concentration is
too high
2
浓度控制在2-4%
每班化学分析一次
control according to 2- chemical analysis
4%
every shift
4
56
SPS含量偏低SPS content is too
探 测R 度P DN
前处理吸干:吸干板 面水份
sponge:sponge water on board
surface
吸干不够 unadequate
sponge
影响吹干效果 affect the
drying
5
影响外观 affect cosmetics
海棉润湿度差sponge is poor wetting
过程 功能process function
要求 requirement
潜在失 效模式 potential failure mode
潜在失 效后果 potential failure effect
严 重 度
S
级别 clas sifi cati
on
潜在失效 起因/机理potential
failure cause/mechanism
正常板:145±5℃
烤板温度偏高baking temperature is too high
2
绿油固化不良板:130±5℃ for common board：145±5
℃; for soldermask solidify defect board：
设备自动控制baking temperature controller
high
浓度控制在50-70g/L 每班化学分析一次
2 control according to 50- chemical analysis 4 56
70g/L
every shift
速度太慢speed is too slow
速度控制在3.5±0.5m/min 每班检查速度设定值
1 control the speed within Check speed
to HASL
surface to form
the Pd/Ti coating
and meanwhile to protect the solder mask
涂覆不均匀 uneven coating
上锡不良poor solderability
7
锡高 thickness
solder
影响产品性能 及外观affect
S
date
O
D
R P N
烤板:烤去板子水份 baking:remove the
water on board surface
烤板温度高 baking
temperature is too high
绿油发黄影响 外观solder mask discolor to affect the cosmetics
5
不定期巡检touring inspection randomly
4
56
无none
喷咀堵塞sprayer nozzle is blocked
1
定时对喷嘴进行保养 Maintain the nozzle
regularly
生产目检 employee checks
7
49
风刀气压不足air
2
首板检查合格后方可批量生 产inspect the first
水洗压力不够 rinsing pressure
is unadequate
1
水洗压力控制在1.0－ 每班员工目视检查压
2.0kg/cm2 control
力表Every shift
rinsing pressure within employee checks
7
1.5－2.5kg/cm2
pressure gauge
频 度 O
现行过程 控制预防current process
control method
现行过程 控制探测 current process detection
探 测 度
R P
DN
建议
责任及 目标完 成日期
措施结果 action result
措施advice action
respons
ibility 采取的措施 & due action adopted
潜在失 效后果 potential failure effect
严 重 度
S
级别 clas sifi cati
on
潜在失效 起因/机理potential
failure cause/mechanism
频 度 O
现行过程 控制预防current process
control mt process detection
每班员工目视检查压
力表Every shift employee checks
7 49
pressure gauge
无none 无none 无none
防呆计时器锁定25PNL清理
风刀堵塞air knife is blocked
一次风刀口clean the air 2 knife every 25 panels by 生产自检Self-check
low
浓度控制在50-70g/L 每班化学分析一次
2 control according to 50- chemical analysis 4 56
70g/L
every shift
建议
责任及 目标完 成日期
措施结果 action result
措施advice action
respons
ibility 采取的措施 & due action adopted
2
开线前用清水浸泡海棉至软 化dip sponge to make it
soft before use
生产前点检check before production
5
70
海棉太脏sponge is too dirty
2
开线前清洗一次海棉clean the sponge before production
生产前点检check before production
潜在失效 起因/机理potential
failure cause/mechanism
频 度 O
现行过程 控制预防current process
control method
现行过程 控制探测 current process detection
探 测R 度P DN
微蚀不够 unadequate
microetching
micro-
锡面粗糙rough solder 5
1/7
过程 功能process function
要求 requirement
潜在失 效模式 potential failure mode
潜在失 效后果 potential failure effect
严 重 度
S
级别 clas sifi cati
on
49
水脏water is dirty
1
对水洗缸进行更换和保养 re-new rinsing tank and
maintain it according
生产目检 employee checks
7
35
2/7
无none 无none
过程 功能process function
要求 requirement
潜在失 效模式 potential failure mode
article prior to batch production
首板PQA全检 total inspect the first
article by PQA
5
70
knife pressure is
unadequate
1
气压控制为3-5kg/cm2 control air pressure
within 3-5kg/cm2
编制 Prepareby：
类型Type:
PCB
关键日期 Key Date：
/
内容版本content Version：B1
审批Approvalby：
过程责任
无铅喷锡Lead free hot air solder 修订日期
Responsibility：
leveling
Modify Date：
2019/7/1
3
30
130±5℃
无none 无none
速度太快speed is too fast
速度控制在3.5±0.5m/min 每班检查速度设定值
1 control the speed within Check speed
7
3.5±0.5m/min
settings per shift
49
无none
微蚀不够 unadequate
成铅锡合金同时保 holding time 油solder mask
护阻焊层flux
out of on pad turn 5
coating:help control from white and
solder to combine flux coating drop from pad
with copper
正常板:30min,绿油固化不
烤板时间偏长baking time is too long
2
良板:120min for common board： 30min,for soldermask solidify defect board：
烤板时间计时器控制 baking timer control
3
30
120min
Potential Failure Mode and Effect Analysis 过程潜在失效模式及后果分析
（PFMEA）
项目Item：
双面板/多层板double-side/multi- FMEA编号
layers PCB
FMEA No.：
FMEA-LF-HAL-01
编制日期Pepare date：2015/4/20
5
pad
H2SO4含量偏高 sulfuric acid concentration is
too high
2
浓度控制在2-4%
每班化学分析一次
control according to 2- chemical analysis
4%
every shift
4
56
SPS含量偏高SPS content is too
5
70
建议
责任及 目标完 成日期
措施结果 action result
措施advice action
respons
ibility 采取的措施 & due action adopted
S
date
O
D
R P N
无none
无none
前处理助焊剂:有助 浸助焊剂到喷
于铜面与锡焊接形 锡时间管控差 PAD绿油发白掉
工厂批准plant approval ：
核心小组core team： 1.如果客户有指定产品及过程特性符号，按客户要求标识；2.客户没有指定，则按如公司规定标识。产品特性符号表示: “◆”,过程特性符号表示:“▲”。classification symbol description ：1.mark symbol per customer's specific symbol;2.if no specific symbol from customer，mark symbol as below:“◆” for product special characteristic ,and “▲” for process spec
7
3.5±0.5m/min
settings per shift
49
无none 无none 无none 无none 无none
前处理水洗：清洗 水洗不净 板面rinsing:clean rinsing is the board surface not clean
污染助焊剂 pollute the 5
flux
S
date
O
D
R P N
无none
无none
前处理：去除板面 氧化，粗化铜面 microetching:remove
the oxidation on board and roughen
surface
◆
微蚀量不足
2
0.5-1.0um
每班化学分析一次 chemical analysis 4 40
every shift