MIC5400_05中文资料
STAR 5400II 票据打印机
单页纸139.7-304.8mm,穿孔纸:114.3-304.8mm
分辨率
360dpi
打印方向
双向逻辑寻距
纸张种类
单页纸、票据
纸张厚度
<0.5mm
复印能力
1+6
打印针寿命
3亿次
色带类型
STAR通用色带盒(LZ24HD)
色带寿命
400万字
字体
中文宋体24点阵国标(GB2312)字库,西文ANK OCR-B BARCODE,32种国标字符集,半角英数字,宋体,等线体
供纸方式
平推式前出纸,平推式后出纸,链式前出纸
接口类型
Centronics(IEEE P1284)并行接口,RS-232C串行接口(选件)
工作噪音
< 56dB
电气规格
电源电压
220V
电源频率
50/60Hz
外观参数
颜色
灰色
长度
392
宽度(mm)
525
高度
240
重量
7.7
环境参数
工作温度
5-40℃
工作湿度
STAR 5400II票据打印机
详细说明
主要参数
打印方式:Leabharlann 4针针式点阵打印打印针数:24
STAR 5400II详细参数
主要参数
打印方式
24针针式点阵打印
打印针数
24
最高打印速度
7.5cpi:高密56字/秒,高速112字/秒,超高速168字/秒,西文:高密LQ字/秒,高速:HS-LQ字/秒,超高速:Draft,10cpi:高密75字/秒,高速150字/秒,超高速225字/秒,12cpi:高密90字/秒,高速180字/秒,超高速270字/秒,15cpi:高密112字/秒,高速225字/秒,超高速337字/秒
航天科技集团五院五O四研究所网络设备产品
航天科技集团五院五O四研究所网络设备产品询价采购函XRTB20070814非常高兴与贵公司合作!航天科技集团五院五O四研究所按照公开、公平、公正的原则,拟采取询价采购的方式对一批网络设备(含软件)进行采购,凡注册经营下述品牌产品,具有合法资质,信誉良好,承认并履行询价采购文件规定条款的生产厂家/服务商均可参与。
一、询价采购说明:1)设备名称、数量及技术要求见技术文件。
2) 如询价函中规定的产品及技术要求无法满足,应及时与我所沟通,并可推荐提供性能相近产品。
3) 投标时,投标文件应包含产品的供货期限、质保期、详细配置、价格等。
4)提供验收方案建议。
4)投标文件必须加盖投标方公章或合同章,并提供公司及代理产品的资质材料、工商、税务材料等。
5)按504所技术文件要求提供投标文件(方案书)。
6)提供贵公司已售同类产品的大用户名单(三个以上)。
二、质量要求及供方对质量负责条件和期限:供方提供的产品必须是原装正品且为全新,必须符合国家质量检测标准、该产品的出厂标准或具有国家鉴定证书。
供方按生产厂家的保修规定进行保修。
保修期内非因采购实体的人为原因而出现的质量问题,以及修理或调换所发生的费用,由供方负责。
供方负责送货、安装调试,在五O四所交付验收。
供方应在交付设备时向需方提供产品的使用说明书及相关的资料。
供方将货物运到需方指定地点,运送中所产生的一切费用由供方负担。
三、验收方式:由504所组织人员或委托专人负责验收。
四、付款方式:产品验收合格后由需方与供方商定付款协议。
五、保修及服务:1、按生产厂家的保修规定进行保修。
因产品质量问题造成的修理或退换所发生的费用,由供方负责。
2、如产品发生故障,供方应在 4小时之内响应,48小时之内解决。
3、提供免费的技术咨询服务。
六、拿到此询价函的合格服务供应商请于2007年9月 30 日下午15:00之前,将招标文件(一式三份)密封送达五O四研究所。
七、需方统一拆封评标,通知中标单位洽谈合同及执行细则;其他应标单位恕不另行告知。
C5000W入门手册
手持式数据终端使用手册第一章快速指导1.1产品概述:此设备将“ALL IN ONE”的设计理念贯穿其中,它将图像获取、无线通讯、条码扫描、RFID读写器等功能集成一身。
并且具有多协议兼容、工业级设计(IP64)等优点,可广泛的应用于各种场所,典型的应用场合有:✧物流和仓储管理:物品流动与仓储管理以及邮件、包裹、运输行李等的流动管理。
✧供应链应用领域:物品供应过程的应用等。
✧产品防伪检测:利用标签内存储器写保护功能,对产品真伪进行鉴别。
✧其它领域:在俱乐部管理、图书馆、学生学籍、消费管理、考勤管理、就餐管理、泳池管理等。
特性:●企业必须的耐用性:可承受各种环境下的日常使用。
●多种可选读取方式:可选支持一维、二维条码扫描,可选RFID低频、高频等多种频段、多种协议读取。
●支持多种通讯模块传输方式:GPRS/Zigbee/WIFI/433M/蓝牙模块。
●触屏和可选的键盘功能:允许采用多种方式输入数据,充分发挥应用程序功能,满足用户偏好。
●时尚的设计:易于手持,可最大限度的减轻用户使用时的疲劳感。
●坚固耐用的外壳:本产品符合IP64标准。
●支持标准卡和扩展卡:支持TF卡具有可扩展功能。
1.2外部结构正面图1-21编号名称1 听筒2 左侧按键3 键盘面板4 话筒5 开关机键6 右侧按键7 触摸屏8 音量调节按钮9 指示灯背面图1-22编号名称1 条码扫描头(一维、二维)2 触摸笔3 RFID感应区4 腕带孔5 电池壳螺丝6 电池7 摄像头8 扩展螺丝孔底部图1-23编号名称1 USB接口(10P)2 IO扩展口(14P)1.3键盘说明此设备的按键包括26个键盘按键和4个侧按键,其中4个侧按键及键盘下方的F1/F2/F3/F4/F5共9个功能键均可以自定义功能。
图1-3键盘功能表按键说明左右功能键,根据应用程序设定不同的功能在待机界面,点击可分别进入工具和设置功能。
向上、向下、向左、向右移动选定位置。
RETURN键,数字键,按对应数字可在输入框中输入。
Flycolor Raptor 5 4in1 ESC 用户手册说明书
Raptor04 零件清单05 注意事项01 产品特点02 规格参数● ARM 32-bit Cortex 核心MCU STM32G071,工作频率高达64MHz ,较上 一代MCU 提升25%;● PWM 频率最高支持128K ,大油门运行更顺滑、更稳定;● 较上一代 ESC ,优化了ESC 固件,油门线性更加顺滑,响应速度更快;● 较上一代 ESC ,优化设计,更佳的走线和元件布局;● 内置电流计、Vbat 电池电压输出;● 大面积铝合金散热器,有效减缓电调温升;● 电调上电自动检测油门信号,支持普通PWM 油门模式(1-2ms )的脉宽输 入、()和Oneshot125(125-250us )、Oneshot4241.7-83.3us Multshot (5-25us );● 支持所有Dshot 和Proshot 数字信号;● Damped light 再生制动,使得效率更高,油门从大到小变化时电机减速响 应更加迅速,稳定性和灵活性显著加强;● 支持更大功率负载,适合竞速级多旋翼的暴力飞行。
● 每次上电会自动检测输入的油门信号,然后执行相应的油门模式;● 首次使用无刷电调或更换遥控设备后需要进行油门行程校准; Dshot 模式时,将不再需要校准油门;● 请勿刷写除“Flycolor_Raptor_5” 以外的固件,以免损坏电调;● VBAT 为电池电压,如果连接至其它设备,务必确认工作电压是否匹配;● CRT.(Current)为电流检测口,可连接至飞控对应电流检测口;● 无论任何时候都要注意极性,供电之前一定要反复检查;● 在插拔或者做任何连接时,请关闭电源;● 请不要超出ESC 工作电流、电压范围使用;● 所有焊接要求良好的焊接技术,任何时候都需要避免因焊接而造成元件 或线材之间短路;● 可以做一些减震措施尽量避免震动;●请确保所有电线和连接部件绝缘良好,避免短路造成产品损坏;●请避免在潮湿、高温等恶劣环境下使用产品,避免造成产品损坏;● 如需更多信息,请联系飞盈佳乐售后或者技术支持。
MICRF500BLQ资料
General DescriptionThe MICRF500 is a single chip UHF transceiver designed forspread spectrum communication (FHSS) intended for ISM (Industrial, Scientific and Medical) and SRD (Short Range Device) frequency bands from 700MHz to 1100MHz with FSK data rates up to 128k baud.The transmitter consists of a PLL frequency synthesizer and a power amplifier. The frequency synthesizer consists of a voltage-controlled oscillator (VCO), a crystal oscillator, dual-modulus prescaler, programmable frequency dividers and a phase-detector. The loop filter is external for flexibility and can be a simple passive circuit. The VCO is a Colpitts oscillator which requires an external resonator and varactor.FSK modulation can be applied externally to the VCO. The synthesizer has two different N, M and A frequency dividers.FSK modulation can also be implemented by switching between these dividers (max. 2400bps). The lengths of the N and M and A registers are 12, 10 and 6 bits respectively. For all types of FSK modulation, data is entered at the DATAIXO pin (see application circuit). The output power of the power amplifier can be programmed to eight levels. A lock detect circuit detects when the PLL is in lock.In receive mode the PLL synthesizer generates the local oscillator (LO) signal. The N, M and A values that give the LO frequency are stored in the N0, M0 and A0 registers. The receiver is a zero intermediate frequency (IF) type in order to make channel filtering possible with low-power integrated low-pass filters. The receiver consists of a low-noise amplifier (LNA) that drives a quadrature mixer pair. The mixer outputs feed two identical signal channels in phase quadrature. Each channel includes a preamplifier, a third order Sallen-Key RC low pass filter that protects the following gyrator filter from strong adjacent channel signals and finally, a limiter. The main channel filter is a gyrator capacitor implementation of a seven-pole elliptic low pass filter. The elliptic filter minimizes the total capacitance required for a given selectivity and dynamic range. The cut-off frequency of the Sallen-Key RC filter can be programmed to four different frequencies: 10kHz,30kHz, 60kHz and 200kHz. An external resistor adjusts the cut-off frequency of the gyrator filter. The demodulator de-modulates the I and Q channel outputs and produces a digital data output. It detects the relative phase of the I and the Q channel signal. If the I channel signal lags the Q channel, the FSK tone frequency lies above the LO frequency (data ‘1’). If the I channel leads the Q channel, the FSK tone lies below the LO frequency (data ‘0’). The output of the receiver is available on the DATAIXO pin. A RSSI (Receive Signal StrengthIndicator) circuit indicates the received signal level.Micrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • A two pin serial interface is used to program the circuit.External components are necessary for RF input and output impedance matching and decoupling of power. Other exter-nal components are the VCO resonator circuit with varactor,crystal, feedback capacitors and components for FSK modu-lation with the VCO, loop filter, bias resistors for the power amplifier and gyrator filters. A T/R switch can be implemented with 2-pin diodes. This gives maximum input sensitivity and transmit output power.Features•Frequency range:700MHz to 1100MHz •Modulation:FSK•RF output power:10dBm•Sensitivity (19.2k bauds, BER=10-3):–104dBm •Maximum data rate:128k baudsApplications•Telemetry•Remote metering •Wireless controller•Wireless data repeaters •Remote control systems •Wireless modem•Wireless security systemOrdering InformationPart Number Ambient Temp. RangePackage MICRF500BLQ–40°C to +85°C44-Lead LQFPRadioWire is a trademark of Micrel, Inc.RadioWire™Pin DescriptionPin NumberPin Name Pin Function 1IFGND IF Ground 2IFVDD IF Power 3ICHOUT I-Channel Output 4QCHOUT Q-Channel Output 5OSCVDD Colpitts Oscillator Power 6OSCIN Colpitts Oscillator Input7OSCGND Colpitts Oscillator and Substrate Ground 8GND Substrate Ground 9CMPOUT Charge Pump Output 10CMPR Charge Pump Resistor Input 11MOD Output for VCO Modulation 12XOSCIN Crystal Oscillator Input 13XOSCOUT Crystal Oscillator Output14LD_C External Capacitor for Lock Detector 15LOCKDET Lock Detector Output16RSSI Received Signal Strength Indicator Output 17PDEXT Power Down Input (0=Power Down)18DATAC Data Filter Capacitor 19DATAIXO Data Input/Output20CLKIN Clock Input for Programming 21REGIN Data Input for Programming 22DIGVDD Digital Circuitry Power 23DIGGNDDigital Circuitry GroundPin ConfigurationR S S I L O C K D E T L D _C X O S C O U T X O S C I N P D E X T D A T A C D A T A I X O IFGND IFVDD ICHOUT QCHOUT OSCVDD OSCIN OSCGNDGND CMPOUT CMPR MODD I G V D DR E G I N C L K I N MIXERVDD MIXERGND LNA_C RFGND2RFIN RFVDD RFGND RFOUT PABIAS PA_C DIGGNDI F Q I N P I F Q I N N I C H C Q C H C V B _I PM I X Q O U T N M I X Q O U T P I F I I N N M I X I O U T PM I X I O U T N I F I I N P 44-Pin LQFP (BLQ)Pin Description, cont’tPin Number Pin Name Pin Function24PA_C Capacitor for Slow Ramp Up/Down of PA25PABIAS External Bias Resistor for Power Amplifier26RFOUT Power Amplifier Output27RFGND LNA, PA and Substrate Ground28RFVDD LNA and PA Power29RFIN Low Noise RF Amplifier (LNA) Input30RFGND2LNA First Stage Ground31LNA_C External LNA Stabilizing Capacitor32MIXERGND Mixer Ground33MIXERVDD Mixer Power34MIXIOUTP I-Channel Mixer Positive Output35MIXIOUTN I-Channel Mixer Negative Output36IFIINP I-Channel IF Amplifier Positive Input37IFIINN I-Channel IF Amplifier Negative Input38MIXQOUTP Q-Channel Mixer Positive Output39MIXQOUTN Q-Channel Mixer Negative Output40IFQINP Q-Channel IF Amplifier Positive Input41IFQINN Q-Channel IF Amplifier Negative Input42ICHC I-Channel Amplifier Capacitor43QCHC Q-Channel Amplifier Capacitor44VB_IP Gyrator Filter ResistorElectrical CharacteristicsF REF = 850MHz, V DD = 2.5 to 3.4V, T A = 25°C, unless otherwise specified .Parameter ConditionMinTypMaxUnitsOverallOperating Frequency 7008501100MHz Power Down Current < 12µA Logic High Input, V IH 70%V DD Logic Low Input, V IL30%V DD DATAIXO, Logic High Output (V OH )I OH = –500µA V DD -0.3V DATAIXO, Logic Low Output (V OL )I OL = 500µA 0.3V LockDet, Logic High Output (V OH )I OH = –100µA V DD -0.25V LockDet, Logic Low Output (V OL )I OL = 100µA0.25V Clock/Data Frequency 10MHz Clock/Data Duty-Cycle2575%Data Setup to Clock (rising edge)25nsVCO and PLL Section Prescaler Divide Ratio 64/65Reference Frequency40MHz PLL Lock Time (int. modulation)4kHz loop filter bandwidth 1ms PLL Lock Time (ext. modulation)1kHz loop filter bandwidth 4ms Rx – (Tx with PA on) Switch Time 1kHz loop filter bandwidth2.5ms Charge Pump Current ±95/±380±125/±500±155/±620µATransmit Section f OUT = 850MHzOutput PowerR LOAD = 50Ω, V DD = 3.0V10dBm Transmit Data Rate (ext. modulation)Note 419.2128kbauds Transmit Data Rate (int. modulation)Note 52.4kbaudsFrequency Deviation to Modulation Rate Ratio unfiltered FSK 1.01.5Current Consumption Transmit Mode10 dBm, R LOAD = 50Ω50mAAbsolute Maximum Ratings (Note 1)Maximum Supply Voltage (V DD )...................................+7VMaximum NPN Reverse Base-Emitter Voltage..........+2.5V Storage Temperature Range (T S )............–55°C to +150°C ESD Rating, Note 3. (500V)Operating Ratings (Note 2)Supply Voltage (V IN )...................................+2.5V to +3.4V Ambient Temperature (T A ).........................–40°C to +85°C Package Thermal ResistanceTQFP (θJA )-Multilayer board .............................46.3°C/WParameter Condition MinTypMaxUnitsReceive Sectionf IN = 850MHz Receiver Sensitivity (Note 6)BER=10-3–1046dBm Input 1dB Compression Level –34dBm Input IP3–24dBm Input Impedance 22.5-j28.5W RSSI Dynamic Range 60dB RSSI Output VoltageP IN = –100dBm 0.7V P IN = –30dBm2.1V Adjacent Channel Rejection:f C = 10kHz 25kHz channel spacing 26dB f C = 30kHz 100kHz channel spacing 37dB f C = 60kHz 200kHz channel spacing 45dB f C = 200kHz 700kHz channel spacing 48dB Blocking Immunity (1MHz)RC filter:f C = 10kHz 66dB RC filter:f C = 30kHz 61RC filter:f C = 60kHz 59dB RC filter:f C = 200kHz53dB Maximum Receiver Bandwidth 175kHz Receiver Settling Time 1ms Current Consumption gyrator filter f C = 60kHz12mA Receive ModeCurrent Consumption XCO300µANote 1.Exceeding the absolute maximum rating may damage the device.Note 2.The device is not guaranteed to function outside its operating rating.Note 3.Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.Note 4.Modulation is applied to the VCO and therefore the modulation cannot have any DC component. Some kind of coding is needed to ensure that the modulation is DC free, e.g., Manchester code or block code. With Manchester code the bitrate is half the baudrate, but with 3B4B block code the bitrate is 3/4 of the baudrate.Note 5:Bitrate is the same as the baudrate.Note 6:Measured at 19.2k bauds and frequency deviation ±25kHz (external modulation), jitter of received data: < 45%.P O U T (d B m )I TOT (mA)Output Power vs. Current @ 25°CFunctional DiagramFigure 1.Transceiver Internal BlocksTypical ApplicationFigure 2 shows an example of a transceiver with modulationapplied to the VCO. The VCO and matching components are optimized for 915MHz, 120kbps data rate. The inductors and trimming capacitors must have a good high frequency perfor-mance.RSSIC8C7Figure 2.Application Circuit - Optimized for 915MHz. 120kbpsThe varactor SMV1215-011 is a single variable capacitance diode manufactured by Skyworks Solutions (formerly Alpha Industries). The pin diode SMP1320 is also manufactured by Skyworks Solutions.ComponentValues C3047pF C31 5.6pF C32 6.8pF C3347pF C3410µF C3547pF C36 1.5pF C374pF C38(np)L112nH L2 5.1nH L38.7nH L4 5.6nH L510nHD1SMV1215-011D2SMP1320-079D3SMP1320-079crystal10MHzComponentValues C8 4.7nF C91nF C101nF C111nF C121nF C13 4.7pF C15 3.3nF C1639nF C1768pF C18100nF C19470pF C204pF-100pF C21100pF C227pF C231nF C241nF C25470pF C2610nF C2818pF C29100pFList of componentsComponentValues R130ΩR20ΩR339ΩR410ΩR562ΩR61k ΩR720k ΩR839k ΩR916k ΩR1016k ΩR11100k ΩR12 6.8k ΩR13270k ΩR14 2.2k ΩR16 2.2k ΩC147pF C447pF C547pF C647pF C74.7nFApplications InformationVCO and PLL SectionThe frequency synthesizer consists of a VCO, crystal oscilla-tor, dual-modulus prescaler, programmable frequency divid-ers, phase-detector, charge pump, lock detector and an external loop filter. The dual-modulus prescaler divides the VCO-frequency by 64/65. This mode is controlled by the A-divider. There are two sets of M, N and A-frequency ing both sets in transmit mode, FSK can be implemented by switching between those two sets. The phase-detector is a frequency/phase detector with back slash pulses to mini-mize phase noise. The VCO, crystal oscillator, charge pump,lock detector and the loop filter will be described in detail below.Voltage Controlled Oscillator (VCO)C38Figure 3.VCOThe circuit schematic of the VCO with external components is shown in Figure 3. The VCO is basically a Colpitts oscilla-tor. The oscillator has an external resonator and varactor.The resonator consists of inductor L1 and the series connec-tion of capacitor C13, the internal capacitance and the capacitance of the varactor. The capacitance of the varactor (D1) decreases as the input voltage increases. The VCO frequency will therefore increase as the input voltage in-creases. The VCO has a positive gain (MHz/Volt). If neces-sary a parallel capacitor can be added next to D1 to bring the VCO tuning voltage to its middle range or VDD/2, which is measured at Pin 9 - CMPOUT.If the value of capacitor C13 becomes too small the amplitude of the VCO signal decreases, which leads to lower output power.The layout of the VCO is very critical. The external compo-nents should be placed as close to the input pin (Pin 6) as possible. The anode of D1 must be placed next to Pins 7 and 8 in the PCB layout. G round vias should be next to component pads.Crystal OscillatorThe crystal oscillator is the reference for the RF output frequency as well as for the LO frequency in the receiver. The crystal oscillator is a very critical block since very good phase and frequency stability is required. The schematic of the crystal oscillator with external components for 10MHz is shown in Figure 4. These components are optimized for acrystal with 15pF load capacitance.10MHzXOSCOUTFigure 4.Crystal OscillatorThe crystal oscillator is tuned by varying the trimming capaci-tor C20. The drift of the RF frequency is the same as the drift of crystal frequency when measured in ppm. The total differ-ence in ppm, ∆f(ppm), between the tuned RF frequency and the drifted frequency is given by:∆f(ppm) = S T × ∆T + n × ∆t where:•S T is the total temperature coefficient of the oscillator frequency (due to crystal and components) in ppm °C.•∆T is the change in temperature from room temperature, at which the crystal was tuned.•n is the ageing in ppm/year.•∆t is the time (in years) elapsed since the transceiver was last tuned.The demodulator will not be able to decode data when ∆f(Hz) = ∆f(ppm) × f RF is larger than the FSK frequency deviation. For small frequency deviations, the crystal should be pre-aged, and should have a small temperature coeffi-cient. The circuit has been tested with a 10MHz crystal, but other crystal frequencies can be used as well.Prestart of XCOThe start-up time of a crystal oscillator is typically some milliseconds. Therefore, to save current consumption, the MICRF500 circuit has been designed so that the XCO is turned on before any other circuit block. During start-up the XCO amplitude will eventually reach a sufficient level to trigger the M-counter. After counting two M-counter output pulses the rest of the circuit will be turned on. The current consumption during the prestart period is approximately 300µA.Lock DetectorThe MICRF500 circuit has a lock detector feature that indi-cates whether the PLL is in lock or not. A logic high on Pin 15(LOCKDET) means that the PLL is in lock.The phase detector output is converted into a voltage that is filtered by the external capacitor C23, connected to Pin 14,LDC. The resulting DC voltage is compared to a reference window set by bits Ref0 – Ref5. The reference window can be stepped up/down linearly between 0V, Ref0 – Ref5 = 1, and Ref0 – Ref5 = 0, which gives the highest value (DC voltage)of the reference window. The size of the window can either be equal to two (Ref6 = 1) reference steps or four reference steps (Ref6 = 0).The bit setting that corresponds to lock can vary, depending on temperature, loop filter and type of varactor. Therefore, the lock detect circuit needs to be calibrated regularly by a software routine that finds the correct bit setting, by running through all combinations of bits Ref0 – Ref5. Depending on the size of the reference window, there will be several bit combinations that show lock. For instance, with a large reference window, as much as five bit combinations can make the lock detector show lock. To have the maximum robustness to noise, the third of the bit settings should be chosen.Charge PumpThe charge pump can be programmed to four different modes with two currents, ±125µA and ±500µA. Bit 70 and 71 in the control word (cpmp1 and cpmp0) controls the operation. The four modes are:1.cpmp1=0Current is constant ±125µA. Used incpmp0=0applications where short PLL locktime is not important.2.cpmp1=0Current is constant ±500µA. Used incpmp0=1applications where a short PLL locktime is important, e.g., internal modula-tion. See “Modulation Inside PLL”section.3.cpmp1=1Current is ±500µA when PLL is out ofcpmp0=0lock and ±125µA when it is in lock.Controlled by LOCKDET (Pin 15). Locktime is halved.See “Modulation Outside PLL” section.4.cpmp1=1Same as above in Tx. In Rx the currentcpmp0=1is ±500µA. Used when using dual-loopfilters. See “Modulation Outside PLLDual-Loop Filters” section.Tuning of VCO and XCOThere are two circuit blocks that may need tuning, the VCO and the crystal oscillator.VCO TuningWhen the VCO voltage is not at its mid-point, a capacitor may be added in parallel with D1or by small increments changes in the L1 or C13 values.This is particularly important when using VCO modulation. The gain curve of the VCO (MHz/Volt) is not linear and the gain will therefore vary with loop voltage. This means that the FSK frequency deviation also varies with loop voltage. When using internal modulation, tuning the VCO can be omitted as long as the VCO gain is large enough to allow the PLL to handle variations in process parameters and tempera-ture without going out of lock.XCO TuningTune the trimming capacitor in the crystal oscillator to the precise desired transmit frequency. It is not possible to tune the crystal oscillator over a large frequency range. N, M and A values must therefore be chosen to give a RF frequency very close to the desired frequency. Because of the small tuning range the VCO will not go out of lock when tuning the crystal oscillator.FSK ModulationThe circuit has two sets of frequency dividers A0, N0, M0 and A1, N1, M1. The frequency dividers are programmed via the control word. A0, N0, M0 are to be programmed with the receive frequency and are used in receive mode. There are three ways of implementing FSK:•FSK modulation can be applied to the VCO. This way of implementing FSK modulation is ex-plained more in detail in the next section. Thevalues corresponding to the transmit frequencyshould be programmed in dividers A1, N1 andM1. Pin DATAIXO must be kept in tri-state fromthe time Tx-mode is entered until one startssending data.•FSK modulation by switching between the two sets of A, N and M dividers. A, N and M valuescorresponding to the receive frequency and bothtransmit frequencies have to be found. Intransmit the values corresponding to data ‘0’should be programmed in dividers A0, N0 andM0, and the values corresponding to data ‘1’should be programmed in dividers A1, N1 andM1.•FSK modulation by adding/subtracting 1 todivider A1. The frequency deviation will be equalto the comparison frequency. The valuescorresponding to the transmit frequency shouldbe programmed in dividers A1, N1 and M1.For all types of FSK modulation, data is entered at the DATAIXO pin.Loop FilterThe design of the loop filter is of great importance for optimizing parameters like modulation rate, PLL lock time, bandwidth and phase noise. Low bitrates will allow modula-tion inside the PLL, which means the loop will lock on different frequency for 1s and 0s. This can be implemented by switch-ing the internal dividers (M, N and A).Higher modulation rates (above 2400bps) imply implementa-tion of modulation outside the PLL. This can be implemented by applying the modulation directly to the VCO.Loop filter values can be found using an appropriate software program.Modulation Inside PLLA fast PLL requires a loop filter with relatively high bandwidth. If a second order loop filter is chosen, it may not give adequate attenuation of the comparison frequency. There-fore in the following example a third order loop filter is chosen. Example 1:Radio frequency f RF868MHzComparison frequency f C100kHzLoop bandwidth BW 3.8kHzVCO gain K o30MHz/VPhase comparator gain K d500µA/radPhase margin j62°Breakthrough suppression A20dBThe component values will be:OUTINFigure 5.Third Order Loop FilterWith this loop filter, internal modulation up to 2400bps ispossible. The PLL lock time from power-down to Rx will beapproximately 1ms.Modulation Outside PLL (Closed Loop)When modulation is applied outside the PLL, it means that thePLL should not track the changes in the loop due to themodulation signal. A loop filter with relatively low bandwidthis therefore necessary. The exact bandwidth will depend onthe actual modulation rate. Because the loop bandwidth willbe significantly lower than the comparison frequency, asecond order loop filter will normally give adequate attenua-tion of the comparison frequency. If not, a third order loop filtermay give the extra attenuation needed.Example 2:Radio frequency f RF868MHzComparison frequency f C140kHzLoop bandwidth BW900HzVCO gain K o30MHz/VPhase comparator gain K d125µA/radPhase margin j61°The component values will be:OUTINCmpRFigure 6.Second Order Loop FilterData rates above approximately 19200baud (includingManchester coding) can be used with this loop filter withoutsignificant tracking of the modulating signal. PLL lock time willbe approximately 4ms.If a faster PLL lock time is wanted, the charge pump can bemade to deliver a current of 500µA per unit phase error, whilean open drain NMOS on chip (Pin 10, CmpR) switches in asecond damping resistor (R10) to ground as shown in Figure6. Once locked on the correct frequency, the PLL automati-cally returns to standard low noise operation (charge pumpcurrent: 125µA/rad). If correct settings have been made in thecontrol word (cpmp1=1, cpmp0=0), the fast locking featureis activated and will reduce PLL lock time by a factor of twowithout affecting the phase margin in the loop.Components C17, C18 C19, R11, R12 and R13 (see applica-tion circuit) are necessary if FSK modulation is applied to theVCO. Data entered at the DATAIXO pin will then be fedthrough the Mod pin (Pin 11) which is a current output. The pinsources a current of 50µA when Logic 1 is entered at theDATAIXO and drains the current for Logic 0. The capacitanceof C17 will set the order of filtering of the baseband signal. Alarge capacitance will give a slow ramp-up and therefore ahigh order of filtering of the baseband signal, while a smallcapacitance gives a fast ramp-up, which in turn also gives abroader frequency spectrum. Resistors R11 and R12 set thefrequency deviation. If C18 is large compared to C17, thefrequency deviation will be large. R13 should be large toavoid influencing the loop filter. Pin DATAIXO must be keptin tri-state from the time Tx-mode is entered until one startssending data.Modulation Outside PLL, Dual-Loop FiltersModulation outside the PLL requires a loop filter with arelatively low bandwidth compared to the modulation rate.This results in a relatively long loop lock time. In applicationswhere modulation is applied to the VCO, but at the same timea short start-up time from power down to receive mode isneeded, dual-loop filters can be implemented. Figure 7shows how to implement dual-loop filters.towards_VCOFigure 7.Dual-Loop FiltersThe loop filter used in transmit mode is made up of C15, C16,R9 and R10. The fast lock feature is also included (internalNMOS controlled by FLC, Fast Lock Control). This filter isautomatically switched in/out by an internal NMOS at Pin 4,QchOut, which is controlled by DFC (Dual Filter Control). BitsOutS2, OutS1, OutS0 must be set to 110. When QchOut isused to switch the Tx loop filter to ground, neither QchOut norIchOut can be used as test pins to look at the different receiversignals. The receive mode loop filter comprises C115, C116,R109, R101 and C101.Modulation Outside PLL (Open Loop)In this mode the charge pump output is tri-stated. The loop isopen and will therefore not track the modulation. This meansthat the loop filter can have a relatively high bandwidth, whichgive short switching times. However, the loop voltage willdecrease with time due to current leakage. The transmit timewill therefore be limited and is dependent on the bandwidth ofthe loop filter. High bandwidth gives low capacitor values andthe loop voltage will decrease faster, which gives a shortertransmit time.The loop is closed until the PLL is locked on the desiredfrequency and the power amplifier is turned on. The loopimmediately opens when the modulation starts. The loop willnot track the modulation, but the modulation still needs to beDC free due to the AC coupling in the modulation network.TransmitPower Amplifier (PA)The power amplifier is biased in class AB. The last stage has an open collector, and an external load inductor (L2) is therefore necessary. The DC current in the amplifier is adjusted with an external bias resistor (R14). A good starting point when designing the PA is a 1.5kΩ bias resistor which gives a bias current of approximately 50µA. This will give a bias current in the last stage of about 15mA.The impedance matching circuit will depend on the type of antenna used, but should be designed for maximum output power. For maximum output power the load seen by the PA must be resistive and should be about 100Ω. The output power is programmable in eight steps, with approximately 3dB between each step. This is controlled by bits Pa2 - Pa0. To prevent spurious components from being transmitted the PA should be switched on/off slowly, by allowing the bias current to ramp up/down at a rate determined by the external capacitor C25 connected to Pin 24. The ramp up/down current is typically 1.1µA, which makes the on/off rate for a 3.0V power supply 2.6µs/pF. Turning the PA on/off affects the PLL. Therefore the on/off rate must be adjusted to the PLL bandwidth.PA BufferA buffer amplifier is connected between the VCO and the PA to ensure that the input signal of the PA has sufficient amplitude to achieve the desired output power. This buffer can be bypassed by setting the bit Gc to 0.ReceiveFront End (LNA and Mixers)A low noise amplifier in RF receivers is used to boost the incoming signal prior to the frequency conversion process. This is important in order to prevent mixer noise from domi-nating the overall front end noise performance. The LNA is a two-stage amplifier and has a nominal gain of 23dB at 900MHz. The LNA has a dc feedback loop, which provides bias for the LNA. The external capacitor C26 decouples and stabilizes the overall dc feedback loop, which has a large low frequency loop gain. Figure 8 shows the input impedance of the LNA. Input matching is very important to get high receive sensitivity.The LNA can be bypassed by setting bit ByLNA to ‘1’. This is useful for very strong signal levels.The RSSI signal can be used to drive a microcontroller in a way when a strong RF income signal is present the LNA can be bypassed. This will increase the dynamic range by ap-proximately 25dB.The mixers have a gain of about 12dB at 900MHz. The differential outputs of the mixers are available at Pins 34, 35 and at Pins 38, 39. The output impedance of each mixer is about 15kΩ.Figure 8.Input ImpedanceSallen-Key Filter and PreamplifierEach channel includes a preamplifier and a prefilter, which is a three-pole elliptic Sallen-Key low pass filter with 20dB stopband attenuation. It protects the following gyrator filter from strong adjacent channel signals. The preamplifier has a gain of 20dB when bit Gc=0 and 30dB when bit Gc=1. The output voltage swing is about 200mV PP for the 30dB gain setting and 1V PP for the 20dB gain setting.The third order Sallen-Key low pass filter is programmable to four different cut-off frequencies according to the table below: Fc1Fc0Cut-Off Frequency Recommended(kHz)Channel Spacing 0010 ±2.525kHz0130 ±7.5100kHz1060 ±15200kHz11200 ±50700kHzFor the 10kHz cut-off frequency the first pole must be gener-ated externally by connecting a 820pF capacitor between the outputs of each mixer. For the 30kHz cut-off frequency a 68pF capacitor is needed between the outputs.As the cut-off frequency of the gyrator filter can be set by varying an external resistor, the optimum channel spacing will depend on the cut-off frequencies of the Sallen-Key filter. The table above shows the recommended channel spacing depending on the different bit settings.Gyrator FilterThe main channel filter is a gyrator capacitor implementation of a seven-pole elliptic low pass filter. The elliptic filter minimizes the total capacitance required for a given selectiv-ity and dynamic range. An external resistor can adjust the cut-off frequency of the gyrator filter. The following table shows how the cut-off frequency varies with bias resistor:。
Micall终端校准工具使用使用说明书1.0.4
MiCall终端校准工具使用说明书文档编号版本号 1.0.4作者林金龙提交日期版权所有西安瑞视信通信技术有限公司本资料及其包含的所有内容为西安瑞视信通信技术有限公司(西安瑞视信)所有,受中国法律及适用之国际公约中有关著作权法律的保护。
未经西安瑞视信书面授权,任何人不得以任何形式复制、传播、散布、改动或以其它方式使用本资料的部分或全部内容,违者将被依法追究责任。
文档修改记录修改日期修改人修改说明版本号2014.06.23 林金龙创建文档 1.0.0 2014.06.23 林金龙根据软件2.1.0.0版本的功能进行修改, 1.0.11.0.3 2014.07.17 林金龙根据软件2.1.2.0版本的功能进行修改.增加指示灯和按键及旋钮测试等1.0.4 2014.08.11 林金龙根据软件2.1.3.0版本的功能进行修改.增加增加喇叭音量校准、麦克风校准等目录1、引言 (4)2、简介 (4)3、打开软件 (4)4、打开串口 (4)5、重启 (5)6、硬件参数配置 (5)7、校准 (5)7.1服务器设置 (6)7.2音量校准 (6)7.3麦克风校准 (6)7.4电源自动校准 (6)7.5指示灯测试 (6)7.6按钮及旋钮测试 (7)8、设备信息配置 (8)1、引言MiCall终端校准工具v2.1.0 适用于无屏MiCall终端。
2、简介您可以使用MiCall终端校准工具对MiCall终端进行音量、麦克风、电源自动校准、指示灯测试、按键测试等。
建议您首先使用本软件前先点击“读取”按钮读取数据,再调整数据后再次点击“写入”按钮将数据写入终端。
校准完成后请重启终端生效配置。
安装对系统的要求:本软件设计为在笔记本电脑和其他兼容电脑上运行。
操作系统要求为:Windows 2000、Windows XP或win73、打开软件在安装目录下打开“MiCall终端校准工具”可执行程序或在桌面双击如图1图标打开此工具软件。
瑞丰WI -E-045 A1 产品说明书
applications which has special requirement in quality and reliability. 如产品需要用在有特殊质量要求及可靠性要求的地方,请提前咨询瑞丰的销售人员以取得相关信息。
4. Without Refond permission, customer shouldn’t disassemble and analyze the LEDs. If the customer find invalid product, please notice Refond in written form.在取得瑞丰的同意前,客户不应该对产品进行拆解分析,如发现失效产品,请直接书面通知瑞丰。
Features 特征Extremely wide viewing angle.发光角度大Suitable for all SMT assembly and solder process.适用于所有的SMT 组装和焊接工艺 Moisture sensitivity level: Level 3.防潮等级 Level 3Package:4000pcs/reel.包装每卷4000pcsRoHS compliant. 满足RoHS 要求Description 描述The Colour LED which was fabricated by using a yellow chip 该产品为黄光LED ,是由黄光芯片封装形成Applications 应用Optical indicator.光学指示Switch and Symbol,Display.开关和标识、显示器等General use.其他应用Package Dimension 外观尺寸NOTES:1.All dimensions units are millimeters. (所有尺寸标注单位为毫米)2.All dimensions tolerances are ±0.2mm unless otherwise noted. (除特别标注外,所有尺寸公差为±0.2毫米)Electrical / Optical Characteristics at Ts=25°C 电性与光学特性Absolute Maximum Ratings at Ts=25°C绝对最大值Typical optical characteristics curves典型光学特性曲线°C)Packaging Specifications 包装规格⏹Tape Dimensions 载带尺寸⏹Note:The tolerances unless mentioned ±0.1mm. Unit : mm 注:未注公差为±0.1毫米,尺寸单位:毫米。
SCX05DNC资料
Microstructure Pressure SensorsCompensated 0 psi to 1psi up to 0 psi to 150 psiSCX SeriesFEATURES• Precision TemperatureCompensation• Calibrated Zero & Span • Small Size • Low Noise• Low Cost (SCX_NC) • High Accuracy (SCX_N) • High Impedance for Low Power ApplicationsTYPICAL APPLICATIONS• Medical Equipment The SCX series sensors provide a very cost-effective solution for pressure applications that require operation over wide temperature range. Theseinternally calibrated and temperature compensated sensors were specifically designed to provide an accurate and stable output over a 0 °C to 70 °C[32 °F to 158 °F] temperature range. This series is intended for use with non-corrosive, non-ionic working fluids such as air, dry gases and the like. • Barometry• Computer Peripherals • Pneumatic Controls • HVACELECTRICAL CONNECTIONDevices are available to measure absolute, differential and gage pressures from 1 psi (SCX01) up to 150 psi (SCX150). The Absolute (A in modelnumber) devices have an internal vacuum reference and an output voltage proportional to absolute pressure. The Differential (D in model number) devices allow application of pressure to either side of the pressure-sensingdiaphragm and can be used for gage or differential measurements.The SCX series devices feature an integrated circuit (IC) sensor element and laser trimmed thick film ceramic housed in a compact solvent resistant case. This package provides excellent corrosion resistance and provides isolation to external packaging stresses. The package has convenient mounting holes and pressure ports for ease of use with standard plastic tubing for pressure connection.PIN 1) TEMPERATURE OUTPUT (+) PIN 2) VsPIN 3) + OUTPUT PIN 4) GROUND If the application requires extended temperature range operation, beyond 0 °C to 70 °C [32 °F to 158 °F], two pins which provide an output voltage proportional to temperature are available for use with external circuitry. The 100 microsecond response time makes this series an excellent choice for computer peripherals and pneumatic control applications.PIN 5) - OUTPUTPIN 6) TEMPERATURE OUTPUT (-)Note: The polarity indicated is for pressure applied to port B. (Forabsolute devices pressure is applied to port A and the output polarity is reversed)The output of the bridge is ratio metric to the supply voltage. Operation from any dc supply voltage up to 20 Vdc is acceptable.WARNINGPERSONAL INJURY DO NOT USE these products as safety oremergency stop devices or in any other application where failure of the product could result in personal injury.Failure to comply with these instructions could result in death or serious injury.Contact your local honeywell representative, or go to Honeywell’s website at /sensing for additional details.WARNINGMISUSE OF DOCUMENTATION• The information presented in this product sheet is for reference only. Do not use this document as a product installation guide.• Complete installation, operation, and maintenance information is provided in the instructions supplied with each product.Failure to comply with these instructions could result in death or serious injury.Sensing and ControlMicrostructure Pressure SensorsCompensated 0 psi to 1psi up to 0 psi to 150 psiSCX SeriesPRESSURE RANGE SPECIFICATIONSFull-Scale Span (1)Model *Operating PressureProofPressure (2)Sensitivity Min. Typ.Max.SCX01DN17.82 mV 18.00 mV 18.18 mV SCX01DNC 0 psid to 1 psid 20 psid18 mV/psi 17.00 mV 18.00 mV 19.00 mV SCX05DN59.40 mV 60.00 mV 60.60 mV SCX05DNC 0 psid to 5 psid 20 psid12 mV/psi 57.50 mV 60.00 mV 62.50 mV SCX15AN89.10 mV 90.00 mV 90.90 mV SCX15ANC 0 psid to 15 psia 30 psia6.0 mV/psi 85.00 mV 90.00 mV 95.00 mV SCX15DN89.10 mV 90.00 mV 90.90 mV SCX15DNC 0 psid to 15 psid 30 psid6.0 mV/psi 85.00 mV 90.00 mV 95.00 mV SCX30AN89.10 mV 90.00 mV 90.90 mV SCX30ANC 0 psid to 30 psia 60 psia3.0 mV/psi 85.00 mV 90.00 mV 95.00 mV SCX30DN89.10 mV 90.00 mV 90.90 mV SCX30DNC 0 psid to 30 psid 60 psid3.0 mV/psi 85.00 mV 90.00 mV 95.00 mV SCX100AN99.00 mV 100.0 mV 101.0 mV SCX100ANC 0 psid to 100 psia 150 psia1.0 mV/psi 95.00 mV 100.0 mV 105.0 mV SCX100DN99.00 mV 100.0 mV 101.0 mV SCX100DNC 0 psid to 100 psid 150 psid1.0 mV/psi 95.00 mV 100.0 mV 105.0 mV SCX150AN89.00 mV 90.00 mV 91.00 mV SCX150ANC 0 psid to 150 psia 150 psia0.6 mV/psi 85.00 mV 90.00 mV 95.00 mV SCX150DN89.00 mV 90.00 mV 91.00 mV SCX150DNC0 psid to 150 psid 150 psid0.6 mV/psi85.00 mV90.00 mV 95.00 mV* Ordering information: Order model number.GENERAL SPECIFICATIONSCharacteristic Description (Maximum Ratings) All Devices Supply Voltage (V S) 20 Vdc Common Mode Pressure 50 psig Lead Soldering Temperature (2 seconds to 4 seconds)250 °C [482 °F]ENVIRONMENTAL SPECIFICATIONSCharacteristicDescription (Maximum Ratings) All DevicesCompensated Operating Temperature 0 °C to 70 °C [32 °F to 158 °F] Operating Temperature -40 °C to 85 °C [-40 °F to 185 °F] Storage Temperature -55 °C to 125 °C [-67 °F to 257 °F] Humidity Limits0 % RH to 100 % RHACCURACYModel Accuracy SCX01 through SCX150 Calibrated for span to within ±1 % (Highest accuracy) SCX01_C through SCX150_C Calibrated for span to within ±5 % (Fine adjustments of zeroand span can be provided in external circuitry)2 Honeywell • Sensing and ControlMicrostructure Pressure SensorsCompensated 0 psi to 1psi up to 0 psi to 150 psi SCX SeriesSCX PERFORMANCE CHARACTERISTICS (3)Characteristic Min.Typ.Max.Unit Zero Pressure Offset (4) -300 0.0 300 MicrovoltCombined Pressure Non-Linearity and Pressure Hysteresis (5) – ±0.1 ±0.5 %FSOTemperature Effect on Span 0 °C to 70 °C [32 °F to 158 °F] (6) – ±0.2 ±0.1 %FSOTemperature Effect on Offset 0 °C to 70 °C [32 °F to 158 °F] (6) – ±100 ±500 MicrovoltRepeatability (7) – ±0.2 ±0.5 %FSOInput Resistance (8) – 4.0 – kOhmOutput Resistance (9) – 4.0 – kOhmCommon Mode Voltage (10) 5.8 6.0 6.2 VdcResponse Time (11) – 100 – Microsec.Long Term Stability of Offset and Span (12) – ±0.1 – mVSCX_C SERIES PERFORMANCE CHARACTERISTICS (3)Characteristic Min.Typ.MaxUnit Zero Pressure Offset -1.0 0.0 ±1.0 mVCombined Pressure Non-Linearity and Pressure Hysteresis (5) Models: SCX05DNC, SCX15ANC, and SCX15DNC,Models: SCX01DNC, SCX30ANC, SCX30DNC, SCX100ANC, SCX100DNC, SCX150ANC, and SCX150DNC –– ±0.1±0.2±1.0±1.0% FSO% FSOTemperature Effect on Span 0 °C to 70 °C [32 °F to 158 °F] (6) –±0.4±2.0%FSO Temperature Effect on Offset 0 °C to 70 °C [32 °F to 158 °F] (6) – ±0.2 ±1.0 mVRepeatability (7) – ±0.2 ±0.5 %FSOInput Resistance (8) – 4.0 – kOhmOutput Resistance (9) – 4.0 – kOhmCommon Mode Voltage (10) 5.7 6.0 6.3 VdcResponse Time (11) – 100 – Microsec.Long Term Stability of Offset and Span (12) – ±0.1 – mV SPECIFICATION NOTESNote 1: Full-Scale Span is the algebraic difference between the output voltage at full-scale pressure and the output at zero pressure.Full-Scale Span is ratiometric to the supply voltage.Note 2: Maximum pressure above which causes permanent sensor failure.Note 3: Reference Conditions: (Unless otherwise noted)T A = 25°C, Supply VS= 12 Vdc, Common Mode Line pressure = 0 psig, Pressure applied to Port B. For absolute devices only,pressure is applied to Port A, and the output polarity is reversed.Note 4: For models SCX15AN, SCX30AN, SCX100AN, and SCX150AN,the Maximum zero pressure offset for absolute devices is 0 to ±500 Microvolt.Note 5: Pressure Hysteresis – the maximum output difference at any point within the operating pressure range for increasing and decreasing pressure.Note 6: Maximum error band of the offset voltage and the error band of the span, relative to the 25 °C [77 °F] reading.Note 7: Maximum difference in output at any pressure within the operating pressure range and the temperature within 0 °C to 70 °C[32 °F to 158 °F] after:a) 1,000 temperature cycles, 0 °C to 70 °C [32 °F to 158 °F]b) 1.5 million pressure cycles, 0 psi to Full-Scale Span.Note 8: Input resistance is the resistance between pins 2 and 4.Note 9: Output resistance is the resistance between pins 3 and 5.Note 10: Common Mode voltage of the output arms (Pins 3 and 5) for V S=12 Vdc.Note 11: Response time for a 0 psi to Full-Scale Span pressure step change, 10 % to 90 % rise time.Note 12: Long term stability over a one-year period.Honeywell • Sensing and Control 3Microstructure Pressure SensorsCompensated 0 psi to 1psi up to 0 psi to 150 psiSCX SeriesSensing and Control/sensingPHYSICAL DIMENSIONS for Reference Only (mm/in)WARRANTY/REMEDYHoneywell warrants goods of its manufacture as being free of defective materials and faulty workmanship.Contact your local sales office for warranty information. If warranted goods are returned to Honeywell during the period of coverage, Honeywell will repair or replace without charge those items it finds defective. Theforegoing is Buyer’s sole remedy and is in lieu of all other warranties, expressed or implied, including those of merchantability and fitness for a particular purpose.Specifications may change without notice. Theinformation we supply is believed to be accurate and reliable as of this printing. However, we assume no responsibility for its use.While we provide application assistance personally,through our literature and the Honeywell web site, it is up to the customer to determine the suitability of the product in the application.For application assistance, current specifications, or name of the nearest Authorized Distributor, contact a nearby sales office. Or call: 1-800-537-6945 USA/Canada 1-815-235-6847 International FAX1-815-235-6545 USA INTERNET/sensing info.sc@Honeywell11 West Spring Street Freeport, Illinois 61032008096-1-EN IL50 GLO 1203 Printed in USACopyright 2003 Honeywell International Inc. All Rights Reserved。
安阳市新世纪电子研究所 J05P 产品手册
J05P P超外差无线接收模块J05摘要:J05P是超高频无线数据传送超外差接收模块。
该模块采用超高频RF集成芯片,具有极高灵敏度及性价比,,可靠性高,是滚动码遥控/电动门控系统及远距离传输理想的低价位高品质超外差接收模块,可以应用于遥控车库门、伸缩门、道闸等,广泛应用与工业控制,通讯及遥控安防等领域。
可过FCC、CE各项指标认证。
特点:(1)接收灵敏度高ASK调制(315M-114dBm;433M-112dBm)。
(2)有中频滤波器,接收距离比一般超外差模块远。
(3)采用晶振稳频,性能稳定一致性好。
(4)适用温度范围广。
(5)具有休眠功能,小于1uA。
(6)工作电压范围宽,3-5V体积小,应用方便。
外形尺寸图:引脚说明:名称功能说明VCC模块电源+5VGND接天线地DATA数据输出端CE休眠控制GND地ANT外接天线使用参数:极限参数:应用注意:(1)VCC接收主板供电电压和模块工作电压一致。
(2)电源VCC和GND脚之间就近接一个0.01uF瓷片电容。
(3)接收模块对电源纹波很敏感,比如纹波系数大的开关电源,晶振,接收主板上的各种信号源等通过电源串入接收模块的放大整形电路便会在数据端输出干扰,影响到单片机对数据的正确判断。
接收模块对外界干扰虽然无法抗拒,但接收主板上产生的干扰是可以通过滤波电路来改善。
(4)天线对接收效果影响很大,最好接1/4波长单振子天线。
天线的直径大于0.8mm,要拉直,弯曲的天线效果很差,没有天线距离会很近。
天线直接焊在模块的ANT接口,也可以用50Ω线连接到50Ω天线。
天线尽可能远离金属屏蔽体,高压,及干扰源的地方。
(5)接收模块的地要焊到接收主板的大面积敷铜面,不要用连接线接地。
(6)J05P是采用ASK的传输方式,ASK的方式在传输中会产生数据信号脉宽的变移,因此,在编写无线数据时应做如下处理:例如接收解码时的约定。
"1"高电平大于200us即可判为"1""0"高电平小于200us即可判为"0"引导码可采用"1"码或"0"码,起始码采用1ms的低电平。
迅达公司介绍及客户清单
迅达电梯集团简介Schindler - 迅达集团-- 迅达-电梯及自动扶梯公司由Robert Schindler先生于1874年在瑞士创立,总部位于Lucerne(卢塞恩),至今已有138年的历史.迅达集团是世界最大的高端电梯及自动扶梯供应商。
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瑞士迅达集团总部Schindler China - 迅达中国迅达(中国)电梯有限公司是1980年成立的中国第1家工业性合资企业中国迅达电梯公司是电梯行业首个在1994年就通过了国际认证机构《英国劳氏质量保证公司》的体系认证,同时获得英、德、澳、荷及新西兰等国认证机构的ISO9001认证书,保证中国迅达电梯公司服务和产品的质量和水平。
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中国大陆地区在用项目有上海世博会世博轴、上海APEC会议主会场、北京新世界中心、武汉崇光百货、武汉时代广场马可波罗酒店、武汉保利文化广场都采用了迅达电梯。
迅达电梯公司奉行用户为本、服务第一的宗旨,服务热线全年365天,每天24小时开通,同时,公司不断进行客户满意度的测试,及时修正、改进服务质量。
瑞士迅达集团在上海浦东张江高科技园区投入近亿元资金建设迅达电梯中国培训中心,先进的硬件设施堪称国内之最,先进的服务理念、先进的电梯产品技术向中国境内的员工进行全方位的培训,这必将对瑞士迅达在中国业务的拓展发挥重要的作用。
SN5400中文资料
PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)JM38510/00104BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/00104BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC JM38510/07001BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/07001BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC JM38510/30001B2A ACTIVE LCCC FK201None Call TI Level-NC-NC-NC JM38510/30001BCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/30001BDA ACTIVE CFP W141None Call TI Level-NC-NC-NC JM38510/30001SCA ACTIVE CDIP J141None Call TI Level-NC-NC-NC JM38510/30001SDA ACTIVE CFP W141None Call TI Level-NC-NC-NC SN5400J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SN54LS00J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SN54S00J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSN7400D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7400DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN7400N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN7400N3OBSOLETE PDIP N14None Call TI Call TISN7400NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS00D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS00DBLE OBSOLETE SSOP DB14None Call TI Call TISN74LS00DBR ACTIVE SSOP DB142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS00DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS00J OBSOLETE CDIP J14None Call TI Call TISN74LS00N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NCSN74LS00NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74LS00PSR ACTIVE SO PS82000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S00D ACTIVE SOIC D1450Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S00DR ACTIVE SOIC D142500Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S00N ACTIVE PDIP N1425Pb-Free(RoHS)CU NIPDAU Level-NC-NC-NC SN74S00N3OBSOLETE PDIP N14None Call TI Call TISN74S00NSR ACTIVE SO NS142000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSN74S00PSR ACTIVE SO PS82000Pb-Free(RoHS)CU NIPDAU Level-2-260C-1YEAR/Level-1-235C-UNLIMSNJ5400J ACTIVE CDIP J141None Call TI Level-NC-NC-NCOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SNJ5400W ACTIVE CFP W141None Call TI Level-NC-NC-NCSNJ5400WA OBSOLETE CFP WA14None Call TI Level-NC-NC-NC SNJ54LS00FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NC SNJ54LS00J ACTIVE CDIP J141None Call TI Level-NC-NC-NC SNJ54LS00W ACTIVE CFP W141None Call TI Level-NC-NC-NC SNJ54S00FK ACTIVE LCCC FK201None Call TI Level-NC-NC-NCSNJ54S00J ACTIVE CDIP J141None Call TI Level-NC-NC-NCSNJ54S00W ACTIVE CFP W141None Call TI Level-NC-NC-NC(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-May not be currently available-please check /productcontent for the latest availability information and additional product content details.None:Not yet available Lead(Pb-Free).Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean"Pb-Free"and in addition,uses package materials that do not contain halogens, including bromine(Br)or antimony(Sb)above0.1%of total product weight.(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDECindustry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. 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AK5365中文资料
ASAHI KASEI[AK5365]GENERAL DESCRIPTIONAK5365 is a high-performance 24-bit, 96kHz sampling ADC for consumer audio and digital recording applications. Thanks to AKM’s Enhanced Dual-Bit modulator architecture, this analog-to-digital converter has an impressive dynamic range of 103dB with a high level of integration. The AK5365 has a 5-channel stereo input selector, an input Programmable Gain Amplifier with an ALC function. All this integration with high-performance makes the AK5365 well suited for CD and DVD recording systems.FEATURES1. 24bit Stereo ADC• 5ch Stereo Inputs Selector• Input PGA from +12dB to 0dB, 0.5dB Step• Auto Level Control (ALC) Circuit• Digital HPF for offset cancellation (fc=1.0Hz@fs=48kHz)• Digital Attenuator• Soft Mute• Single-end Inputs• S/(N+D) : 94dB• DR, S/N : 103dB• Audio I/F Format : 24bit MSB justified, I2S2. 3-wire Serial µP Interface / I2C-Bus3. Master / Slave Mode4. Master Clock : 256fs/384fs/512fs5. Sampling Rate : 32kHz to 96kHz6. Power Supply• AVDD: 4.75 ∼ 5.25V (typ. 5.0V)• DVDD: 3.0 ∼ 5.25V (typ. 3.3V)7. Power Supply Current : 27mA8. Ta = -40 ∼85°C9. Package : 44pin LQFPOrdering GuideAK5365VQ −40 ∼ +85°C 44pin LQFP (0.8mm pitch)AKD5365Evaluation Board for AK5365Pin LayoutLIN5R I N 54443142414039383736353433323130292827262524232221201918171615141312234567891011AK5365VQTop ViewTEST1LIN4TEST2LIN3TEST3LIN2TEST4LIN1LOPIN LOUTI P G A LI P G A RR O U TR O P I NA V D DA V S SV C O MD V S SD V D DS D T OB IC K LRCKMCLK PDN ALC SMUTE SEL0SEL1SEL2CDTI/SDA CCLK/SCL CSN/CAD1T E S T 8R I N 4T E S T 7R I N 3T E S T 6R I N 2T E S T 5R I N 1M /SC T R LPIN/FUNCTIONNo.Pin Name I/O Function 1LIN5I Lch Analog Input 5 Pin2TEST1I Test 1 Pin (Connected to AVSS)3LIN4I Lch Analog Input 4 Pin4TEST2I Test 2 Pin (Connected to AVSS)5LIN3I Lch Analog Input 3 Pin6TEST3I Test 3 Pin (Connected to AVSS)7LIN2I Lch Analog Input 2 Pin8TEST4I Test 4 Pin (Connected to AVSS)9LIN1I Lch Analog Input 1 Pin10LOPIN I Lch Feed Back Resistor Input Pin11LOUT O Lch Feed Back Resistor Output Pin12IPGAL I Lch IPGA Input Pin13IPGAR I Rch IPGA Input Pin14ROUT O Rch Feed Back Resistor Output Pin15ROPIN I Rch Feed Back Resistor Input Pin16AVDD-Analog Power Supply Pin, 4.75 ∼ 5.25V17AVSS-Analog Ground Pin18VCOM O Common Voltage Output Pin, AVDD/2 Bias voltage of ADC input.19DVSS-Digital Ground Pin20DVDD-Digital Power Supply Pin, 3.0 ∼ 5.25V21SDTO O Audio Serial Data Output Pin22BICK I/O Audio Serial Data Clock PinNote: All digital input pins except pull-down pins should not be left floating. Note: TEST1, TEST2, TEST3 and TEST4 pins should be connected to AVSS.No.Pin Name I/O Function 23LRCK I/O Output Channel Clock Pin24MCLK I Master Clock Input Pin25PDN I Power-Down Mode Pin“H”: Power up, “L”: Power down reset and initializes the control register.26ALC I ALC Enable Pin (Internal Pull-down Pin, typ. 100kΩ) “H” : ALC Enable, “L” : ALC Disable27SMUTE I Soft Mute Pin (Internal Pull-down Pin, typ. 100kΩ) “H” : Soft Mute, “L” : Normal Operation28SEL0I Input Selector 0 Pin29SEL1I Input Selector 1 Pin30SEL2I Input Selector 2 PinCDTI I Control Data Input Pin in 3-wire Control (CTRL pin = “L”) 31SDA I/O Control Data Input / Output Pin in I2C Control (CTRL pin = “H”)CCLK I Control Data Clock Pin in 3-wire Control (CTRL pin = “L”) 32SCL I Control Data Clock Pin in I2C Control (CTRL pin = “H”)CSN I Chip Select Pin in 3-wire Control (CTRL pin = “L”) 33CAD1I Chip Address 1 Select Pin in I2C Control (CTRL pin = “H”)34CTRL I Control Mode Pin“H” : I2C Control & I2S Compatible, “L” : 3-wire Control35M/S I Master / Slave Mode Pin“H” : Master Mode, “L” : Slave Mode36RIN1I Rch Analog Input 1 Pin37TEST5I Test 5 Pin (Connected to AVSS)38RIN2I Rch Analog Input 2 Pin39TEST6I Test 6 Pin (Connected to AVSS)40RIN3I Rch Analog Input 3 Pin41TEST7I Test 7 Pin (Connected to AVSS)42RIN4I Rch Analog Input 4 Pin43TEST8I Test 8 Pin (Connected to AVSS)44RIN5I Rch Analog Input 5 PinNote: All digital input pins except pull-down pins should not be left floating. Note: TEST5, TEST6, TEST7 and TEST8 pins should be connected to AVSS.ABSOLUTE MAXIMUM RATINGS(AVSS, DVSS=0V; Note 1)Parameter Symbol min max UnitsPower Supplies:AnalogDigital|AVSS – DVSS| (Note 2)AVDDDVDD∆GND−0.3−0.3-6.06.00.3VVVInput Current, Any Pin Except Supplies IIN-±10mA Analog Input Voltage(VREF, LIN1-5, RIN1-5, LOPIN, ROPIN, IPGAL, IPGAR pins)VINA−0.3AVDD+0.3V Digital Input Voltage (All digital input pins)VIND−0.3DVDD+0.3V Ambient Temperature (powered applied)Ta−4085°C Storage Temperature Tstg−65150°C Note 1. All voltages with respect to ground.Note 2. AVSS and DVSS must be connected to the same analog ground plane.WARNING: Operation at or beyond these limits may result in permanent damage to the device.Normal operation is not guaranteed at these extremes.RECOMMENDED OPERATING CONDITIONS(AVSS, DVSS=0V; Note 1)Parameter Symbol min typ max UnitsPower Supplies (Note 3)AnalogDigitalAVDDDVDD4.753.05.03.35.25AVDDVVNote 1. All voltages with respect to ground.Note 3. The power up sequence between AVDD and DVDD is not critical.WARNING: AKM assumes no responsibility for the usage beyond the conditions in this datasheet.ANALOG CHARACTERISTICS(Ta=25°C; AVDD=5.0V, DVDD=3.3V; AVSS=DVSS=0V; fs=48kHz, 96kHz; BICK=64fs; Signal Frequency=1kHz; 24bit Data; Measurement frequency=20Hz ∼ 20kHz at fs=48kHz, 40Hz ∼ 40kHz at fs=96kHz; unless otherwise specified) Parameter min typ max Units Pre-Amp Characteristics:Feedback Resistance1050kΩS/(N+D) (Note 4)-100dBS/N (A-weighted)-108dB Load Resistance (Note 5) 6.3kΩLoad Capacitance20pF Input PGA Characteristics:Input Voltage (Note 6)0.91 1.1Vrms Input Resistance (Note 7) 6.31015kΩStep Size0.20.50.8dBGain Control Range ALC = OFFALC = ON−9.5+12+12dBdBADC Analog Input Characteristics: IPGA=0dB, ALC = OFF (Note 8)Resolution24BitsS/(N+D) (−0.5dBFS)fs=48kHzfs=96kHz 84829492dBdBDR (−60dBFS)fs=48kHz, A-weightedfs=96kHz 968910399dBdBS/N fs=48kHz, A-weightedfs=96kHz 968910399dBdBInterchannel Isolation (Note 9)90110dB Interchannel Gain Mismatch0.20.5dB Gain Drift100-ppm/°C Power Supply Rejection (Note 10)50-dB Power SuppliesPower Supply CurrentNormal Operation (PDN pin = “H”)AVDDDVDD (fs=48kHz)(fs=96kHz)Power-down mode (PDN pin = “L”) (Note 11) AVDDDVDD 2348101035816100100mAmAmAµAµANote 4. This value is measured at LOUT and ROUT pins using the circuit as shown in Figure 24.The input signal voltage is 2Vrms.Note 5. This value is the input impedance of an external device that the LOUT and ROUT pins can drive, when a device is connected with LOUT and ROUT pin externally. The feedback resistor (min. 10kΩ) that it is usually connected with the LOUT/ROUT pins, and the value of input impedance (min. 6.3kΩ) of the IPGAL/R pins are not included. Note 6. Full scale (0dB) of the input voltage at ALC=OFF and IPGA=0dB.Input voltage to IPGAL and IPGAR pins is proportional to AVDD voltage. Vin = 0.2 x AVDD (Vrms).Note 7. This value is input impedance of the IPGAL and IPGAR pins.Note 8. This value is measured via the following path. Pre-Amp → IPGA (Gain : 0dB) → ADC.The measurement circuit is Figure 24.Note 9. This value is the interchannel isolation between all the channels of the LIN1-5 and RIN1-5 when the applied input signal causes the Pre-Amp output to equal IPGA input.Note 10. PSR is applied to AVDD and DVDD with 1kHz, 50mVpp.Note 11. All digital input pins are held DVDD or DVSS.FILTER CHARACTERISTICS (fs=48kHz)(Ta=−40 ∼ 85°C; AVDD=4.75 ∼ 5.25V; DVDD=3.0 ∼ 5.25V; fs=48kHz)Parameter Symbol min typ max Units ADC Digital Filter (Decimation LPF):Passband (Note 12)−0.005dB−0.02dB−0.06dB−6.0dB PB0---21.76822.024.021.5---kHzkHzkHzkHzStopband SB26.5kHz Passband Ripple PR±0.005dB Stopband Attenuation SA80dB Group Delay (Note 13)GD29.61/fs Group Delay Distortion∆GD0µs ADC Digital Filter (HPF):Frequency Response (Note 12)−3dB−0.5dB−0.1dB FR 1.02.96.5HzHzHzNote 12. The passband and stopband frequencies scale with fs. For example, 21.768kHz at −0.02dB is 0.454 x fs. Note 13. The calculated delay time induced by digital filtering. This time is from the input of an analog signalto the setting of 24bit data both channels to the ADC output register for ADC.FILTER CHARACTERISTICS (fs=96kHz)(Ta=−40 ∼ 85°C; AVDD=4.75 ∼ 5.25V; DVDD=3.0 ∼ 5.25V; fs=96kHz)Parameter Symbol min typ max Units ADC Digital Filter (Decimation LPF):Passband (Note 14)−0.005dB−0.02dB−0.06dB−6.0dB PB0---43.53644.048.043.0---kHzkHzkHzkHzStopband SB53.0kHz Passband Ripple PR±0.005dB Stopband Attenuation SA80dB Group Delay (Note 15)GD29.61/fs Group Delay Distortion∆GD0µs ADC Digital Filter (HPF):Frequency Response (Note 14)−3dB−0.5dB−0.1dB FR25.813HzHzHzNote 14. The passband and stopband frequencies scale with fs. For example, 43.536kHz at −0.02dB is 0.454 x fs. Note 15. The calculated delay time induced by digital filtering. This time is from the input of an analog signalto the setting of 24bit data both channels to the ADC output register for ADC.DC CHARACTERISTICS(Ta=−40 ∼ 85°C; AVDD=4.75 ∼ 5.25V; DVDD=3.0 ∼ 5.25V)Parameter Symbol min typ Max UnitsHigh-Level Input Voltage Low-Level Input Voltage VIHVIL70%DVDD----30%DVDDVVHigh-Level Output Voltage (Iout=−400µA) Low-Level Output Voltage(Except SDA pin : Iout=400µA) (SDA pin : Iout=3mA)VOHVOLVOLDVDD-0.5------0.50.4VVVInput Leakage Current Iin--±10µASWITCHING CHARACTERISTICS(Ta=−40 ∼ 85°C; AVDD=4.75 ∼ 5.25V; DVDD=3.0 ∼ 5.25V; C L=20pF)Parameter Symbol min typ max Units Master Clock TimingFrequencyPulse Width Low Pulse Width HighfCLKtCLKLtCLKH8.1920.4/fCLK0.4/fCLK24.576MHznsnsLRCK FrequencyNormal Speed Mode Double Speed Mode fsnfsd32484896kHzkHzDuty Cycle Slave modeMaster mode 455055%%Audio Interface Timing Slave modeBICK PeriodBICK Pulse Width LowPulse Width HighLRCK Edge to BICK “↑” (Note 16) BICK “↑” to LRCK Edge (Note 16) LRCK to SDTO (MSB) (Except I2S mode) BICK “↓” to SDTOtBCKtBCKLtBCKHtLRBtBLRtLRStBSD160656530303535nsnsnsnsnsnsnsMaster modeBICK Frequency BICK DutyBICK “↓” to LRCK BICK “↓” to SDTOfBCKdBCKtMBLRtBSD−20−2064fs502035Hz%nsnsNote 17. BICK rising edge must not occur at the same time as LRCK edge.Parameter Symbol min typ max Units Control Interface Timing (3-wire Serial mode):CCLK PeriodCCLK Pulse Width Low Pulse Width High CDTI Setup TimeCDTI Hold TimeCSN “H” TimeCSN “↓” to CCLK “↑” CCLK “↑” to CSN “↑”tCCKtCCKLtCCKHtCDStCDHtCSWtCSStCSH200808040401505050nsnsnsnsnsnsnsnsControl Interface Timing (I2C Bus mode):SCL Clock FrequencyBus Free Time Between TransmissionsStart Condition Hold Time (prior to first clock pulse) Clock Low TimeClock High TimeSetup Time for Repeated Start ConditionSDA Hold Time from SCL Falling (Note 17) SDA Setup Time from SCL RisingRise Time of Both SDA and SCL LinesFall Time of Both SDA and SCL LinesSetup Time for Stop ConditionPulse Width of Spike Noise Suppressed by Input FilterfSCLtBUFtHD:STAtLOWtHIGHtSU:STAtHD:DATtSU:DATtRtFtSU:STOtSP-4.74.04.74.04.70.25--4.0100-------1.00.3-50kHzµsµsµsµsµsµsµsµsµsµsnsReset TimingPDN Pulse Width (Note 18) PDN “↑” to SDTO valid (Note 19) PWN “↑” to SDTO valid (Note 20)tPDtPDVtPDV150516516ns1/fs1/fsNote 17. Data must be held long enough to bridge the 300ns-transition time of SCL.Note 18. The AK5365 can be reset by bringing the PDN pin = “L”.Note 19. This cycle is the number of LRCK rising edges from the PDN pin = “H”.Note 20. This cycle is the number of LRCK rising edges from the PWN bit = “1”.Purchase of Asahi Kasei Microsystems Co., Ltd I2C components conveys a license under the Philips I2C patent to use the components in the I2C system, provided the system conform to the I2C specifications defined by Philips.Timing DiagramMCLKLRCKBICKClock TimingLRCK VIH VILBICK VIH VILSDTO50%DVDDAudio Interface Timing (Slave mode)LRCK BICK50%DVDDSDTO 50%DVDD50%DVDDAudio Interface Timing (Master mode)CSNVIH VILCCLKVIH VILCDTIVIH VILWRITE Command Input TimingCSNVIH VILCCLKVIH VIL CDTI VIH VILWRITE Data Input TimingSDASCLVILVIL I C Bus Mode TimingPDNVILCSNVIH VILSDTO50%DVDDPDNVIH VILSDTO50%DVDDPower Down & Reset TimingOPERATION OVERVIEWSystem ClockMCLK (256fs/384fs/512fs), BICK (48fs∼) and LRCK (fs) clocks are required in slave mode. The LRCK clock input must be synchronized with MCLK, however the phase is not critical. MCLK frequency is automatically detected in slave mode. Table 1 shows the relationship of typical sampling frequency and the system clock frequency.MCLK (256fs/384fs/512fs) is required in master mode. MCLK frequency is selected by CKS1-0 bits as shown in Table 2. In master mode, after setting CKS1-0 bits, there is a possibility the frequency and duty of LRCK and BICK outputs become an abnormal state.All external clocks (MCLK, BICK and LRCK) must be present unless PDN pin = “L” and PWN bit = “1”. If these clocks are not provided, the AK5365 may draw excess current due to its use of internal dynamically refreshed logic. If the external clocks are not present, place the AK5365 in power-down mode (PDN pin = “L” or PWN bit = “0”). In master mode, the master clock (MCLK) must be provided unless PDN pin = “L”.MCLKfs256fs384fs512fs32kHz8.192MHz12.288MHz16.384MHz44.1kHz11.2896MHz16.9344MHz22.5792MHz48kHz12.288MHz18.432MHz24.576MHz96kHz24.576MHz N/A N/ATable 1. System clock example (Slave mode)MCLKCKS1CKS032kHz ≤ fs ≤ 48kHz48kHz < fs ≤ 96kHz00256fs256fs Default01512fs N/A10384fs N/A11N/A N/ATable 2. Master clock frequency select (Master mode)Audio Interface FormatTwo kinds of data formats can be chosen with the DIF bit (Table 3) and the CTRL pin (Table 4). The DIF bit and CTRL pin are ORed between pin and register. In both modes, the serial data is in MSB first, 2’s compliment format. The SDTO is clocked out on the falling edge of BICK. The audio interface supports both master and slave modes. In master mode, BICK and LRCK are output with the BICK frequency fixed to 64fs and the LRCK frequency fixed to 1fs.Mode DIF bit SDTO LRCK BICK FigureDefault0024bit, MSB justified H/L≥ 48fs Figure 11124bit, I2S Compatible L/H≥ 48fs Figure 2Table 3. Audio Interface Format (CTRL pin = “L”)Mode CTRL pin SDTO LRCK BICK Figure0L24bit, MSB justified H/L≥ 48fs Figure 11H24bit, I2S Compatible L/H≥ 48fs Figure 2Table 4. Audio Interface Format (DIF bit = “0”)LRCKBICK(64fs)SDTO(o)Figure 1. Mode 0 TimingLRCKBICK(64fs)SDTO(o)Figure 2. Mode 1 TimingMaster Mode and Slave ModeThe M/S pin selects either master or slave mode. M/S pin = “H” selects master mode and “L” selects slave mode. The AK5365 outputs BICK and LRCK in master mode. In slave mode, MCLK, BICK and LRCK are input externally.BICK, LRCKSlave Mode BICK = Input LRCK = InputMaster Mode BICK = Output LRCK = OutputTable 5. Master mode/Slave modeDigital High Pass FilterThe ADC has a digital high pass filter for DC offset cancellation. The cut-off frequency of the HPF is 1.0Hz (@fs=48kHz) and scales with sampling rate (fs).Power-up/downThe AK5365 is placed in the power-down mode by bringing PDN pin = “L” and the digital filter is also reset at the same time. This reset should always be done after power-up. An analog initialization cycle starts after exiting the power-down mode. Therefore, the output data SDTO becomes available after 516 cycles of LRCK.(1) Power-up Sequence 1Power SupplyPDN pinADC Internal StateIPGASDTOExternal clocksin slave modeExternal clocksin master modeBICK, LRCKin master mode- INITA :Initializing period of ADC analog section (516/fs).- FI :Fade in. After exiting power down, IPGA value fades in.- PDN :Power down state.- The period of (1) should be min. 150ns in Figure 3.Figure 3. Power-up Sequence 1(2) Power-up Sequence 2Power SupplyPDN pinADC Internal StateIPGASDTOExternal clocksin slave modeExternal clocksin master modeBICK, LRCKin master mode- INITA :Initializing period of ADC analog section (516/fs).- FI :Fade in. After exiting power down, IPGA value fades in.- PDN :Power down state.- The period of (1) should be min. 150ns in Figure 4.Figure 4. Power-up Sequence 2Input SelectorThe AK5365 includes 5ch stereo input selectors (Figure 5). The input selector is 5 to 1 selector. The input channel is set by the SEL2-0 bits (Table 6) and the SEL2-0 pins (Table 7). The SEL2-0 pins should be fixed to “LLL” if the AK5365 is controlled by the SEL 2-0 bits, because the setting of the SEL2-0 pins are prior to the SEL2-0 bits setting.SEL2 bit SEL1 bit SEL0 bit Input Channel000LIN1 / RIN1Default001LIN2 / RIN2010LIN3 / RIN3011LIN4 / RIN4100LIN5 / RIN5Table 6. Input Selector (SEL2-0 pin = “LLL”)SEL2 pin SEL1 pin SEL0 pin Input ChannelL L L LIN1 / RIN1L L H LIN2 / RIN2L H L LIN3 / RIN3L H H LIN4 / RIN4H L L LIN5 / RIN5Table 7. Input Selector (SEL2-0 bit = “000”)Figure 5. Input Selector[Input selector switching sequence]The input selector should be changed after soft mute to avoid the switching noise of the input selector (Figure 6).1.Enable the soft mute before changing channel.2.Change channel.3.Disable the soft mute.SMUTEAttenuation Channel DATT Level-∞Figure 6. Input channel switching sequence exampleThe period of (1) varies in the setting value of DATT. It takes 1024/fs to mute when DATT value is 0dB.When changing channels, the input channel should be changed during (2). The period of (2) should be around 200ms because there is some DC difference between the channels.Function of CTRL PinThe CTRL pin sets the audio interface format and the type of serial control interface. When the CTRL pin is “L”, the audio interface format is selected by the DIF bit and the serial control interface is 3-wire control mode. When the CTRL pin is “H”, the audio interface format is fixed to 24bit I2S compatible and the serial control interface is I2C-bus control mode.CTRL pin Audio Interface Format Serial Control InterfaceL Note3-wire ControlH24bit, I2S Compatible I2C-Bus ControlTable 8. CTRL pin FunctionNote: The audio interface format is ORed between the CTRL pin and DIF bit. When the CTRL pin is “L”, the audio interface format can be selected between 24bit MSB justified and 24bit I2S compatible by DIF bit. When the CTRL pin is “H”, the audio interface format is fixed to 24bit I2S compatible.Input AttenuatorThe input ATTs are constructed by adding the input resistor (Ri) for LIN1-5/RIN1-5 pins and the feedback resistor (Rf) between LOPIN (ROPIN) pin and LOUT (ROUT) pin (Figure 7). The input voltage range of the IPGAL/IPGAR pin is typically 0.2 x AVDD (Vrms). If the input voltage of the input selector exceeds 0.2 x AVDD, the input voltage of the IPGAL/IPGAR pins must be attenuated to 0.2 x AVDD by the input ATTs. Table 9 shows the example of Ri and Rf.Figure 7. Input ATT• Example for input rangeInput Range Ri [kΩ]Rf [kΩ]ATT Gain [dB]IPGAL/R pin4Vrms4712−11.86 1.02Vrms2Vrms4724−5.84 1.02Vrms1Vrms474701VrmsTable 9. Input ATT exampleInput VolumeThe AK5365 includes two independent channel analog volumes (IPGA) with 25 levels at 0.5dB steps located in front of the ADC. The digital volume controls (DATT) have 128 levels (including MUTE) and is located after the ADC. Both the analog and digital volumes are controlled through the same register address. When the MSB of the register is “1”, the IPGA changes and when the MSB = “0”, the DATT changes.The IPGA is a true analog volume control that improves the S/N ratio as seen in Table 10. Independent zero-crossing detection is used to ensure level changes only occur during zero-crossings. If there are no zero-crossings, the level will then change after a time-out period (Table 11); the time-out period scales with fs. If a new value is written to the IPGA register before the IPGA changes at the zero crossing or time-out, the previous value becomes invalid. The timer (channel independent) for time-out is reset and the timer restarts for new IPGA value.The DATT is a pseudo-log volume that is linear-interpolated internally. When changing the level, the transition between ATT values has 8031 levels and is done by soft changes, eliminating any switching noise.Input Gain Setting0dB+6dB+12dBfs=48kHz, A-weight103dB100dB96dBTable 10. PGA+ADC S/NZTM1ZTM0Zero crossing timeout period@fs=48kHz00288/fs6ms011152/fs24ms102304/fs48ms Default114608/fs96msTable 11. Zero crossing timeout period[Writing operation at ALC Enable]Writing to the area over 80H (Table 17) of IPGL/R registers is ignored during ALC operation. After ALC is disabled, the IPGA changes to the last written data by zero-crossing or time-out. In case of writing to the DATT area under 7FH (Table 17) of IPGL/R registers, the DATT changes even if ALC is enabled.ALC Operation[1]ALC Limiter OperationWhen the ALC limiter is enabled, and either Lch or Rch exceed the ALC limiter detection level (LMTH bit), the IPGA value is attenuated by the amount defined in the ALC limiter ATT step (LMAT bit) automatically. Then the IPGA value is changed commonly for L/R channels.When the ZELMN bit = “1”, the timeout period is set by the LTM1-0 bits. The operation for attenuation is done continuously until the input signal level becomes the ALC limiter detection level (LMTH bit) or less. If the ALC bit does not change into “0” or the ALC pin does not change into “L” after completing the attenuation, the attenuation operation repeats until the input signal level equals or exceeds the ALC limiter detection level (LMTH bit).When the ZELMN bit = “0”, the timeout period is set by the ZTM1-0 bits. This enables the zero-crossing attenuation function so that the IPGA value is attenuated at the zero-detect points of the waveform.When FR bit = “1”, the ALC operation corresponds to the impulse noise in additional to the normal ALC operation. Then if the impulse noise is supplied at ZELMN bit = “0”, the ALC operation becomes the faster period than a set of ZTM1-0 bits. In case of ZELMN bit = “1”, it becomes the same period as LTM1-0 bits. When FR bit = “0”, the ALC operation is the normal ALC operation.[2]ALC Recovery OperationThe ALC recovery refers to the amount of time that the AK5365 will allow a signal to exceed a predetermined limiting value prior to enabling the limiting function. The ALC recovery operation uses the WTM1-0 bits to define the wait period used after completing an ALC limiter operation. If the input signal does not exceed the “ALC Recovery Waiting Counter Reset Level”, the ALC recovery operation starts. The IPGA value increases automatically during this operation up to the reference level (REF7-0 bits). The ALC recovery operation is done at a period set by the WTM1-0 bits. Zero crossing is detected during WTM1-0, the ALC recovery operation waits WTM1-0 period and the next recovery operation starts. During the ALC recovery operation, when input signal level exceeds the ALC limiter detection level (LMTH bit), the ALC recovery operation changes immediately into an ALC limiter operation.In the case of “(Recovery waiting counter reset level) ≤ Input Signal < Limiter detection level” during the ALC recovery operation, the wait timer for the ALC recovery operation is reset. Therefore, in the case of “(Recovery waiting counter reset level) > Input Signal”, the wait timer for the ALC recovery operation starts.When the impulse noise is input at FR bit = “1”, the ALC recovery operation becomes faster than a normal recovery operation. When the FR bit = “0”, the ALC recovery operation is done by normal period.[3] ALC Level Diagram (1) ALC=OFFFigure 8 and 9 show the level diagram example at ALC=OFF. In Figure 8, Input ATT is −12dB.4Vrms2Vrms0dBFS-12dB-12dB-12dB1Vrms-12dB+6dB+12dBFigure 8. ALC Level diagram example (ALC=OFF)In Figure 9, Input ATT is −6dB.0dBFSFigure 9. ALC Level diagram example (ALC=OFF)(2) ALC=ONFigure 10 and 11 show the level diagram example at ALC=ON. In Figure 10, Input ATT is −12dB and REF7-0 bits are “8CH”.4Vrms2Vrms-12dB-12dB-12dB1Vrms-12dB0.5Vrms-0.5dB-0.5dBFS-6dBFS -12dBFS 0dBFS +5.5dB+6dB0.25VrmsFigure 10. ALC Level diagram example (ALC=ON)In Figure 11, Input ATT is −6dB and REF7-0 bits are “8CH”.2Vrms1Vrms-6dB-6dB0.5Vrms-6dB0.25Vrms-6dB-0.5dB-0.5dBFS-6dBFS 0dBFS +5.5dB+6dB-12dBFSFigure 11. ALC Level diagram example (ALC=ON)[4]Example of ALC OperationThe following registers should not be changed during the ALC operation.•LTM1-0, LMTH, LMAT, WTM1-0, ZTM1-0, RATT, REF7-0, ZELMN bits• The IPGA value of Lch becomes the start value if the IPGA value is different with Lch and Rch when the ALC starts.• Writing to the area over 80H (Table 17) of IPGL/R registers is ignored during ALC operation. After ALC is disabled, the IPGA changes to the last written data by zero-crossing or time-out. In case of writing to the DATT area under 7FH (Table 17) of IPGL/R registers, the DATT changes even if ALC is enabled.Figure 12. Registers set-up sequence at ALC operation(1): Enable soft mute (2): Disable soft muteNote : ALC operation is enabled by the ALC pin.Note : All the bits about ALC operation operate by the default value when an ALC operation is started with the ALC pin without setting up a bit about ALC operation with the register. A bit about ALC operation operate by the setting value when a bit about ALC operation is set up with the register and an ALC operation is started with the ALC pin. Note : After ALC operation is disabled, the IPGA changes to the last written data during or before ALC operation.。
MIC8115_05资料
Features
• • • • • • • • • • • • Precision voltage monitor for 3.3V power supplies Specifically tailored to the AMD Elan SC500 Series /RESET remains valid with VCC as low as 1V 5µA typical supply current 1100ms minimum reset pulse width Manual reset input Available in 4-Pin SOT-143 Package Portable equipment Intelligent instruments Critical microprocessor power monitoring Printers/computers Embedded controllers
3
/MR
4
VCC
MIC8115
2
July 2005
元器件交易网 MIC8115
Absolute Maximum Ratings(Note 1)
Terminal Voltage (VCC) ...........................................................–0.3V to 6.0V (/MR) ..................................................–0.3V (VCC + 0.3V) Input Current (VCC, /MR) ............................................ 20mA Output Current (/RESET) ........................................... 20mA Rate of Rise (VCC) ..................................................100V/µS Lead Temperature (soldering, 10 sec.) ...................... 300°C Storage Temperature (TS) ........................ –65°C to +150°C ESD Rating .................................................................... 3kV
XCS05XL-4PC144I中文资料
© 2001 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at /legal.htm .All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.IntroductionThe Spartan ™ and the Spartan-XL families are a high-vol-ume production FPGA solution that delivers all the key requirements for ASIC replacement up to 40,000 gates.These requirements include high performance, on-chip RAM, core solutions and prices that, in high volume,approach and in many cases are equivalent to mask pro-grammed ASIC devices.The Spartan series is the result of more than 14 years of FPGA design experience and feedback from thousands of customers. By streamlining the Spartan series feature set,leveraging advanced process technologies and focusing on total cost management, the Spartan series delivers the key features required by ASIC and other high-volume logic users while avoiding the initial cost, long development cycles and inherent risk of conventional ASICs. The Spar-tan and Spartan-XL families in the Spartan series have ten members, as shown in T able 1.Spartan and Spartan-XL FeaturesNote: The Spartan series devices described in this data sheet include the 5V Spartan family and the 3.3V Spartan-XL family. See the separate data sheet for the 2.5V Spartan-II family.•First ASIC replacement FPGA for high-volume production with on-chip RAM•Density up to 1862 logic cells or 40,000 system gates •Streamlined feature set based on XC4000 architecture •System performance beyond 80MHz•Broad set of AllianceCORE ™ and LogiCORE ™ predefined solutions available •Unlimited reprogrammability •Low cost•System level features-Available in both 5V and 3.3V versions -On-chip SelectRAM ™ memory -Fully PCI compliant-Full readback capability for program verificationand internal node observability -Dedicated high-speed carry logic -Internal 3-state bus capability-Eight global low-skew clock or signal networks -IEEE 1149.1-compatible Boundary Scan logic -Low cost plastic packages available in all densities -Footprint compatibility in common packages•Fully supported by powerful Xilinx development system -Foundation Series: Integrated, shrink-wrapsoftware-Alliance Series: Dozens of PC and workstationthird party development systems supported-Fully automatic mapping, placement and routing Additional Spartan-XL Features• 3.3V supply for low power with 5V tolerant I/Os •Power down input •Higher performance •Faster carry logic•More flexible high-speed clock network•Latch capability in Configurable Logic Blocks •Input fast capture latch•Optional mux or 2-input function generator on outputs •12 mA or 24 mA output drive •5V and 3.3V PCI compliant •Enhanced Boundary Scan •Express Mode configuration •Chip scale packagingSpartan and Spartan-XL Families Field Programmable Gate ArraysDS060 (v1.6) September 19, 2001Product Specification T able 1: Spartan and Spartan-XL Field Programmable Gate Arrays1.Max values of Typical Gate Range include 20-30% of CLBs used as RAM.2DS060 (v1.6) September 19, 2001General OverviewSpartan series FPGAs are implemented with a regular, flex-ible, programmable architecture of Configurable Logic Blocks (CLBs), interconnected by a powerful hierarchy of versatile routing resources (routing channels), and sur-rounded by a perimeter of programmable Input/Output Blocks (IOBs), as seen in Figure 1. They have generous routing resources to accommodate the most complex inter-connect patterns.The devices are customized by loading configuration data into internal static memory cells. Re-programming is possi-ble an unlimited number of times. The values stored in thesememory cells determine the logic functions and intercon-nections implemented in the FPGA. The FPGA can either actively read its configuration data from an external serial PROM (Master Serial mode), or the configuration data can be written into the FPGA from an external device (Slave Serial mode).Spartan series FPGAs can be used where hardware must be adapted to different user applications. FPGAs are ideal for shortening design and development cycles, and also offer a cost-effective solution for production rates well beyond 50,000 systems per month.Figure 1: Basic FPGA Block DiagramSpartan series devices achieve high-performance, low-cost operation through the use of an advanced architecture and semiconductor technology. Spartan and Spartan-XL devices provide system clock rates exceeding 80MHz and internal performance in excess of150MHz. In contrast to other FPGA devices, the Spartan series offers the most cost-effective solution while maintaining leading-edge per-formance. In addition to the conventional benefit of high vol-ume programmable logic solutions, Spartan series FPGAs also offer on-chip edge-triggered single-port and dual-port RAM, clock enables on all flip-flops, fast carry logic, and many other features.The Spartan/XL families leverage the highly successful XC4000 architecture with many of that family’s features and benefits. T echnology advancements have been derived from the XC4000XLA process developments.Logic Functional DescriptionThe Spartan series uses a standard FPGA structure as shown in Figure1, page2. The FPGA consists of an array of configurable logic blocks (CLBs) placed in a matrix of routing channels. The input and output of signals is achieved through a set of input/output blocks (IOBs) forming a ring around the CLBs and routing channels.•CLBs provide the functional elements for implementing the user’s logic.•IOBs provide the interface between the package pins and internal signal lines.•Routing channels provide paths to interconnect the inputs and outputs of the CLBs and IOBs.The functionality of each circuit block is customized during configuration by programming internal static memory cells. The values stored in these memory cells determine the logic functions and interconnections implemented in the FPGA.Configurable Logic Blocks (CLBs)The CLBs are used to implement most of the logic in an FPGA. The principal CLB elements are shown in the simpli-fied block diagram in Figure2. There are three look-up tables (LUT) which are used as logic function generators, two flip-flops and two groups of signal steering multiplexers. There are also some more advanced features provided by the CLB which will be covered in the Advanced Features Description, page13.Function GeneratorsTwo 16x1 memory look-up tables (F-LUT and G-LUT) are used to implement 4-input function generators, each offer-ing unrestricted logic implementation of any Boolean func-tion of up to four independent input signals (F1 to F4 or G1 to G4). Using memory look-up tables the propagation delay is independent of the function implemented.A third 3-input function generator (H-LUT) can implement any Boolean function of its three inputs. Two of these inputs are controlled by programmable multiplexers (see box "A" of Figure2). These inputs can come from the F-LUT or G-LUT outputs or from CLB inputs. The third input always comes from a CLB input. The CLB can, therefore, implement cer-tain functions of up to nine inputs, like parity checking. The three LUTs in the CLB can also be combined to do any arbi-trarily defined Boolean function of five inputs.4DS060 (v1.6) September 19, 2001A CLB can implement any of the following functions:•Any function of up to four variables, plus any second function of up to four unrelated variables, plus any third function of up to three unrelated variablesNote: When three separate functions are generated, one of the function outputs must be captured in a flip-flop internal to the CLB. Only two unregistered function generator outputs are available from the CLB.•Any single function of five variables•Any function of four variables together with some functions of six variables•Some functions of up to nine variables.Implementing wide functions in a single block reduces both the number of blocks required and the delay in the signal path, achieving both increased capacity and speed. The versatility of the CLB function generators significantly improves system speed. In addition, the design-software tools can deal with each function generator independently.This flexibility improves cell usage.Flip-FlopsEach CLB contains two flip-flops that can be used to regis-ter (store) the function generator outputs. The flip-flops and function generators can also be used independently (see Figure 2). The CLB input DIN can be used as a direct input to either of the two flip-flops. H1 can also drive either flip-flop via the H-LUT with a slight additional delay.The two flip-flops have common clock (CK), clock enable (EC) and set/reset (SR) inputs. Internally both flip-flops are also controlled by a global initialization signal (GSR) which is described in detail in Global Signals: GSR and GTS ,page 20.Latches (Spartan-XL only)The Spartan-XL CLB storage elements can also be config-ured as latches. The two latches have common clock (K)and clock enable (EC) inputs. Functionality of the storage element is described in Table 2.Figure 2: Spartan/XL Simplified CLB Logic Diagram (some features not shown)Clock InputEach flip-flop can be triggered on either the rising or falling clock edge. The CLB clock line is shared by both flip-flops.However, the clock is individually invertible for each flip-flop (see CK path in Figure 3). Any inverter placed on the clock line in the design is automatically absorbed into the CLB. Clock EnableThe clock enable line (EC) is active High. The EC line is shared by both flip-flops in a CLB. If either one is left discon-nected, the clock enable for that flip-flop defaults to the active state. EC is not invertible within the CLB. The clock enable is synchronous to the clock and must satisfy the setup and hold timing specified for the device.Set/ResetThe set/reset line (SR) is an asynchronous active High con-trol of the flip-flop. SR can be configured as either set or reset at each flip-flop. This configuration option determines the state in which each flip-flop becomes operational after configuration. It also determines the effect of a GSR pulse during normal operation, and the effect of a pulse on the SR line of the CLB. The SR line is shared by both flip-flops. If SR is not specified for a flip-flop the set/reset for that flip-flop defaults to the inactive state. SR is not invertible within the CLB.CLB Signal Flow ControlIn addition to the H-LUT input control multiplexers (shown in box "A" of Figure 2, page 4) there are signal flow control multiplexers (shown in box "B" of Figure 2) which select the signals which drive the flip-flop inputs and the combinatorial CLB outputs (X and Y).Each flip-flop input is driven from a 4:1 multiplexer which selects among the three LUT outputs and DIN as the data source.Each combinatorial output is driven from a 2:1 multiplexer which selects between two of the LUT outputs. The X output can be driven from the F-LUT or H-LUT, the Y output from G-LUT or H-LUT .Control SignalsThere are four signal control multiplexers on the input of the CLB. These multiplexers allow the internal CLB control sig-nals (H1, DIN, SR, and EC in Figure 2 and Figure 4) to be driven from any of the four general control inputs (C1-C4 in Figure 4) into the CLB. Any of these inputs can drive any of the four internal control signals.T able 2: CLB Storage Element FunctionalityLegend:XDon ’t careRising edge (clock not inverted).SR Set or Reset value. Reset is default.0*Input is Low or unconnected (default value)1*Input is High or unconnected (default value)Figure 3: CLB Flip-Flop Functional Block Diagram6DS060 (v1.6) September 19, 2001The four internal control signals are:•EC: Enable Clock•SR: Asynchronous Set/Reset or H function generator Input 0•DIN: Direct In or H function generator Input 2•H1: H function generator Input 1.Input/Output Blocks (IOBs)User-configurable input/output blocks (IOBs) provide the interface between external package pins and the internal logic. Each IOB controls one package pin and can be con-figured for input, output, or bidirectional signals. Figure 6shows a simplified functional block diagram of the Spar-tan/XL IOB.IOB Input Signal PathThe input signal to the IOB can be configured to either go directly to the routing channels (via I1 and I2 in Figure 6) or to the input register. The input register can be programmed as either an edge-triggered flip-flop or a level-sensitive latch. The functionality of this register is shown in Table 3,and a simplified block diagram of the register can be seen in Figure 5.Figure 4: CLB Control Signal InterfaceFigure 5: IOB Flip-Flop/Latch Functional BlockDiagramTable 3: Input Register FunctionalityX Don ’t care.Rising edge (clock not inverted).SR Set or Reset value. Reset is default.0*Input is Low or unconnected (default value)1*Input is High or unconnected (default value)The register choice is made by placing the appropriate library symbol. For example, IFD is the basic input flip-flop (rising edge triggered), and ILD is the basic input latch (transparent-High). Variations with inverted clocks are also available. The clock signal inverter is also shown in Figure5 on the CK line.The Spartan IOB data input path has a one-tap delay ele-ment: either the delay is inserted (default), or it is not. The Spartan-XL IOB data input path has a two-tap delay ele-ment, with choices of a full delay, a partial delay, or no delay. The added delay guarantees a zero hold time with respect to clocks routed through the global clock buffers. (See Glo-bal Nets and Buffers, page12 for a description of the glo-bal clock buffers in the Spartan/XL families.) For a shorter input register setup time, with positive hold-time, attach a NODELAY attribute or property to the flip-flop.The output of the input register goes to the routing channels (via I1 and I2 in Figure6). The I1 and I2 signals that exit the IOB can each carry either the direct or registered input signal.The 5V Spartan input buffers can be globally configured for either TTL (1.2V) or CMOS (VCC/2) thresholds, using an option in the bitstream generation software. The Spartan output levels are also configurable; the two global adjust-ments of input threshold and output level are independent. The inputs of Spartan devices can be driven by the outputs of any 3.3V device, if the Spartan inputs are in TTL mode. Input and output thresholds are TTL on all configuration pins until the configuration has been loaded into the device and specifies how they are to be used. Spartan-XL inputs are TTL compatible and 3.3V CMOS compatible. Supported sources for Spartan/XL device inputs are shown in Table4.Spartan-XL I/Os are fully 5V tolerant even though the V CC is 3.3V. This allows 5V signals to directly connect to the Spar-tan-XL inputs without damage, as shown in Table4. In addi-tion, the 3.3V V CC can be applied before or after 5V signals are applied to the I/Os. This makes the Spartan-XL devices immune to power supply sequencing problems.Figure 6: Simplified Spartan/XL IOB Block Diagram8DS060 (v1.6) September 19, 2001Spartan-XL V CC ClampingSpartan-XL FPGAs have an optional clamping diode con-nected from each I/O to V CC . When enabled they clamp ringing transients back to the 3.3V supply rail. This clamping action is required in 3.3V PCI applications. V CC clamping is a global option affecting all I/O pins.Spartan-XL devices are fully 5V TTL I/O compatible if V CC clamping is not enabled. With V CC clamping enabled, the Spartan-XL devices will begin to clamp input voltages to one diode voltage drop above V CC . If enabled, TTL I/O com-patibility is maintained but full 5V I/O tolerance is sacrificed.The user may select either 5V tolerance (default) or 3.3V PCI compatibility. In both cases negative voltage is clamped to one diode voltage drop below ground.Spartan-XL devices are compatible with TTL, LVTTL, PCI 3V, PCI 5V and LVCMOS signalling. The various standards are illustrated in Table 5.Additional Fast Capture Input Latch (Spartan-XL only)The Spartan-XL IOB has an additional optional latch on the input. This latch is clocked by the clock used for the output flip-flop rather than the input clock. Therefore, two different clocks can be used to clock the two input storage elements.This additional latch allows the fast capture of input data,which is then synchronized to the internal clock by the IOB flip-flop or latch.T o place the Fast Capture latch in a design, use one of the special library symbols, ILFFX or ILFLX. ILFFX is a trans-parent-Low Fast Capture latch followed by an active High input flip-flop. ILFLX is a transparent Low Fast Capture latch followed by a transparent High input latch. Any of the clock inputs can be inverted before driving the library element,and the inverter is absorbed into the IOB.IOB Output Signal PathOutput signals can be optionally inverted within the IOB,and can pass directly to the output buffer or be stored in an edge-triggered flip-flop and then to the output buffer. The functionality of this flip-flop is shown in T able 6.T able 4: Supported Sources for Spartan/XL InputsT able 5: I/O Standards Supported by Spartan-XL FPGAsTable 6: Output Flip-Flop Functionality X Don ’t careRising edge (clock not inverted). SR Set or Reset value. Reset is default.0*Input is Low or unconnected (default value)1*Input is High or unconnected (default value)Z3-stateOutput Multiplexer/2-Input Function Generator (Spartan-XL only)The output path in the Spartan-XL IOB contains an addi-tional multiplexer not available in the Spartan IOB. The mul-tiplexer can also be configured as a 2-input function generator, implementing a pass gate, AND gate, OR gate, or XOR gate, with 0, 1, or 2 inverted inputs.When configured as a multiplexer, this feature allows two output signals to time-share the same output pad, effec-tively doubling the number of device outputs without requir-ing a larger, more expensive package. The select input is the pin used for the output flip-flop clock, OK.When the multiplexer is configured as a 2-input function generator, logic can be implemented within the IOB itself. Combined with a Global buffer, this arrangement allows very high-speed gating of a single signal. For example, a wide decoder can be implemented in CLBs, and its output gated with a Read or Write Strobe driven by a global buffer. The user can specify that the IOB function generator be used by placing special library symbols beginning with the letter "O." For example, a 2-input AND gate in the IOB func-tion generator is called OAND2. Use the symbol input pin labeled "F" for the signal on the critical path. This signal is placed on the OK pin — the IOB input with the shortest delay to the function generator. Two examples are shown in Figure7.Output BufferAn active High 3-state signal can be used to place the out-put buffer in a high-impedance state, implementing 3-state outputs or bidirectional I/O. Under configuration control, the output (O) and output 3-state (T) signals can be inverted. The polarity of these signals is independently configured for each IOB (see Figure6, page7). An output can be config-ured as open-drain (open-collector) by tying the 3-state pin (T) to the output signal, and the input pin (I) to Ground.By default, a 5V Spartan device output buffer pull-up struc-ture is configured as a TTL-like totem-pole. The High driver is an n-channel pull-up transistor, pulling to a voltage one transistor threshold below V CC. Alternatively, the outputs can be globally configured as CMOS drivers, with additional p-channel pull-up transistors pulling to V CC. This option, applied using the bitstream generation software, applies to all outputs on the device. It is not individually programma-ble.All Spartan-XL device outputs are configured as CMOS drivers, therefore driving rail-to-rail. The Spartan-XL outputs are individually programmable for 12mA or 24mA output drive.Any 5V Spartan device with its outputs configured in TTL mode can drive the inputs of any typical 3.3V device. Sup-ported destinations for Spartan/XL device outputs are shown in Table7.Three-State Register (Spartan-XL Only)Spartan-XL devices incorporate an optional register control-ling the three-state enable in the IOBs. The use of the three-state control register can significantly improve output enable and disable time.Output Slew RateThe slew rate of each output buffer is, by default, reduced, to minimize power bus transients when switching non-criti-cal signals. For critical signals, attach a FAST attribute or property to the output buffer or flip-flop.Spartan/XL devices have a feature called "Soft Start-up," designed to reduce ground bounce when all outputs are turned on simultaneously at the end of configuration. When the configuration process is finished and the device starts up, the first activation of the outputs is automatically slew-rate limited. Immediately following the initial activation of the I/O, the slew rate of the individual outputs is deter-mined by the individual configuration option for each IOB. Pull-up and Pull-down NetworkProgrammable pull-up and pull-down resistors are used fortying unused pins to V CC or Ground to minimize power con-sumption and reduce noise sensitivity. The configurablepull-up resistor is a p-channel transistor that pulls to V CC.The configurable pull-down resistor is an n-channel transis-tor that pulls to Ground. The value of these resistors is typi-cally 20KΩ − 100KΩ (See "Spartan DC Characteristics Figure 7: AND and MUX Symbols in Spartan-XL IOB10DS060 (v1.6) September 19, 2001Over Operating Conditions" on page 43.). This high value makes them unsuitable as wired-AND pull-up resistors.After configuration, voltage levels of unused pads, bonded or unbonded, must be valid logic levels, to reduce noise sensitivity and avoid excess current. Therefore, by default,unused pads are configured with the internal pull-up resistor active. Alternatively, they can be individually configured with the pull-down resistor, or as a driven output, or to be driven by an external source. To activate the internal pull-up, attach the PULLUP library component to the net attached to the pad. To activate the internal pull-down, attach the PULL-DOWN library component to the net attached to the pad.Set/ResetAs with the CLB registers, the GSR signal can be used to set or clear the input and output registers, depending on the value of the INIT attribute or property. The two flip-flops can be individually configured to set or clear on reset and after configuration. Other than the global GSR net, no user-con-trolled set/reset signal is available to the I/O flip-flops (Figure 5). The choice of set or reset applies to both the ini-tial state of the flip-flop and the response to the GSR pulse.Independent ClocksSeparate clock signals are provided for the input (IK) and output (OK) flip-flops. The clock can be independently inverted for each flip-flop within the IOB, generating eitherfalling-edge or rising-edge triggered flip-flops. The clock inputs for each IOB are mon Clock EnablesThe input and output flip-flops in each IOB have a common clock enable input (see EC signal in Figure 5), which through configuration, can be activated individually for the input or output flip-flop, or both. This clock enable operates exactly like the EC signal on the Spartan/XL CLB. It cannot be inverted within the IOB.Routing Channel DescriptionAll internal routing channels are composed of metal seg-ments with programmable switching points and switching matrices to implement the desired routing. A structured,hierarchical matrix of routing channels is provided to achieve efficient automated routing.This section describes the routing channels available in Spartan/XL devices. Figure 8 shows a general block dia-gram of the CLB routing channels. The implementation soft-ware automatically assigns the appropriate resources based on the density and timing requirements of the design.The following description of the routing channels is for infor-mation only and is simplified with some minor details omit-ted. For an exact interconnect description the designer should open a design in the FPGA Editor and review the actual connections in this tool.The routing channels will be discussed as follows;•CLB routing channels which run along each row and column of the CLB array.•IOB routing channels which form a ring (called a VersaRing) around the outside of the CLB array. It connects the I/O with the CLB routing channels.•Global routing consists of dedicated networks primarily designed to distribute clocks throughout the device with minimum delay and skew. Global routing can also be used for other high-fanout signals.CLB Routing ChannelsThe routing channels around the CLB are derived from three types of interconnects; single-length, double-length,and longlines. At the intersection of each vertical and hori-zontal routing channel is a signal steering matrix called a Programmable Switch Matrix (PSM). Figure 8 shows the basic routing channel configuration showing single-length lines, double-length lines and longlines as well as the CLBs and PSMs. The CLB to routing channel interface is shown as well as how the PSMs interface at the channel intersec-tions.T able 7: Supported Destinations for Spartan/XL OutputsNotes:1.Only if destination device has 5V tolerant inputs.CLB InterfaceA block diagram of the CLB interface signals is shown in Figure9. The input signals to the CLB are distributed evenly on all four sides providing maximum routing flexibility. In general, the entire architecture is symmetrical and regular. It is well suited to established placement and routing algo-rithms. Inputs, outputs, and function generators can freely swap positions within a CLB to avoid routing congestion during the placement and routing operation. The exceptions are the clock (K) input and CIN/COUT signals. The K input is routed to dedicated global vertical lines as well as four single-length lines and is on the left side of the CLB. The CIN/COUT signals are routed through dedicated intercon-nects which do not interfere with the general routing struc-ture. The output signals from the CLB are available to drive both vertical and horizontal channels.Programmable Switch MatricesThe horizontal and vertical single- and double-length lines intersect at a box called a programmable switch matrix (PSM). Each PSM consists of programmable pass transis-tors used to establish connections between the lines (see Figure10).For example, a single-length signal entering on the right side of the switch matrix can be routed to a single-length line on the top, left, or bottom sides, or any combination thereof, if multiple branches are required. Similarly, a dou-ble-length signal can be routed to a double-length line on any or all of the other three edges of the programmable switch matrix.Single-Length LinesSingle-length lines provide the greatest interconnect flexibil-ity and offer fast routing between adjacent blocks. There are eight vertical and eight horizontal single-length lines associ-ated with each CLB. These lines connect the switching matrices that are located in every row and column of CLBs. Single-length lines are connected by way of the program-mable switch matrices, as shown in Figure10. Routing con-nectivity is shown in Figure8.Single-length lines incur a delay whenever they go through a PSM. Therefore, they are not suitable for routing signals for long distances. They are normally used to conduct sig-nals within a localized area and to provide the branching for nets with fanout greater than one.Figure 8: Spartan/XL CLB Routing Channels and Interface Block DiagramFigure 9: CLB Interconnect Signals。
惠威IP-9805网络寻呼话筒说明书
产品说明书2-接以太网3频输出-音4频输入-音5路输入-线6路输出-线①终端配置端口:终端IP地址配置端口、程序烧录端口。
②网络输入:接以太网网线。
③音频输出:可直接接耳机。
④音频输入:可直接接mic。
⑤线路输入:外接音源信号输入。
五. 安装调试配置方法一:通过网络配置地址1. 连通终端的电源与网络,使其与服务器处于通导状态。
按照下面步骤打开终端配置程序对终端进行配置:点击服务器“开始”—“程序”—“惠威IP 网络广播”—“终端配置程序”,如下图:⑥线路输出:音频信号输出,可外接有源音箱。
⑦电源插头:DC24V 。
2. 连接方式选择“网络。
地址”,输入IP 地址:192.168.1.105(此地址必须是要配置终端的IP 地址,出厂默认值为192.168.1.105),发送端口为:15100。
3. 在配置栏输入需要配置的地址,如下图:第三步:按“确定键”进行播放文件(图7.3)。
返回上一层,按“取消键”或“* 键”。
第四步:进入图7.3界面,按“确定键”,进行选时操作(图7.4),选时即选择文件中的一个时段进行播放。
【操作方法:输入时间按“数字键”,退格按“取消键”,播放按“确定键”,返回按“* 键”。
】图7.2音乐库1.任贤齐-老地方向上[12]播放图7.3任贤齐-老地方重复:X 0.13 4.35图7.4任贤齐-老地方重复:X0.00 4.35总长:4.35返回播放选时:.0006.8播放控制(1)播放控制操作说明在播放控制界面下(图8.1)可完成常用的MP3播放操作。
例如:播放、暂停、停止等操作,对应的数字键为:1/A 、2/播放、3/B 、4/快退、5/暂停、6/快进、7/A-B 、8/停止、9、0。
用户可根据实际情况按相应“数字键”进行控制操作。
(注意:此操作需在文件播放开启的状态下才可进行播放控制操作。
)图7.3任贤齐-老地方重复:X0.24 4.35在播放控制界面下(图8.1),按“音量+键和音量-键”可调整音量的大小(图8.2)。
喷涂机器人概述-ABBIRB5400培训资料
PA服务程序用于简化操作和设置与涂装有关的功能,例如管理程序选 择、设定换色顺序等。
ProcessWare:
ProcessWare软件用于特定的应用上,比如涂装、点焊、胶粘等。它 们是在机器人控制器内的在操作系统之外运行的软件可选项。用于涂 装的软件选件称为PaintWare。
ATMA - 32
喷涂机器人吹扫单元
ATMA - 37
IRB5400机器人吹扫区域
* 来自吹扫单元的空气经由柔性软管(内含电缆)进入到支座单元内。 从支座单元流出,经由底座单元和垂直臂,空气被传送到水平臂的后部。
ATMA - 38
IRB500机器人吹扫区域
* 来自吹扫单元的空气经由柔性软管(内含电缆)进入到支座单元内。 从支座单元流出,经由底座单元和垂直臂,空气被传送到水平臂的后部。
Atomizing air Shaping air Fluid out
Needle air
Applicator
ATMA - 45
ATMA - 46
IPS Pump 2 K Solution
AMA
Air cabinet
Can bus
Can bus Motor Power Cable
Motor Power Cable Air supply
Anout Anout Anin Anin
Anin
DMC
Sensor
Actuator
Sensor
Actuator
PSAC
Resolver Feedback
Sensor Sensor
Resolver Feedback Digout
Fluid supply Sensor Sensor
浙江航芯源集成电路科技有限公司 M42005C 产品手册说明书
浙江航芯源集成电路科技有限公司浙江航芯源集成电路科技有限公司Zhejiang HangXinYuan IC Technology Co.,LtdM42005C 产品手册5.5V ,4A ,小型化、高效率,微电源模块1.产品特性➢上下管导通电阻:35mΩ/15mΩ➢PG 指示位➢驱动能力:4A➢输入电压范围:2.7V~5.5V ➢工作频率:3MHz ➢关机状态静态电流≤0.1μA➢内部软启动➢电压良好指示位➢过流保护,欠压锁定,过温保护2.功能描述M42005C 是一款3MHz ,4A 的同步降压微模块。
模块内部由一个电感和一颗控制芯片集成封装而成。
并且具有宽输入电压范围(2.7V~5.5V )。
此芯片针对小型化进行优化,集成高侧和低侧MOSFET 并提供极高的转换效率。
3.产品应用➢FPGA 、微处理器、ASIC 等负载点芯片供电4.裸芯片/封装简介➢该模块采用QFN3×3-10小型化封装。
集成电路科技有限公5. 绝对最大额定值表 1 绝对最大额定值(1)使用中超过这些绝对最大值可能对芯片造成永久损坏。
6. 推荐工作条件1) 输入电压V IN :2.7V~5.5V 2) 输出电压V OUT :2.7V~5V3) 工作环境温度T C :-55℃~125℃7. 主要电参数除非特别说明,V IN =5V ,V OUT =3.3V ,I OUT =2A ,T C = -55℃~125℃表 2 主要电参数航芯源集成电路科技有限8. 引脚介绍图 1 M42005C 引脚分布图(顶视图)表 3 M42005C 引脚介绍航芯源集成电路科技有限公司9. 典型特性曲线图 2 V OUT =1.2V 效率图 3 V OUT =1.8V 效率图 4 V OUT =3.3V 效率10. 芯片应用说明M42005C 是一款3MHz ,4A 的同步降压微模块(3mm×3mm×2mm )。
内部由一个电感和一颗控制芯片集成封装而成。
SPTMV0100PG5W02;SPT4V0100PG5W02;SPT4V0500PG5W02;SPTMV0030PG5W02;中文规格书,Datasheet资料
SPT SeriesLow Cost, Stainless Steel Media Isolated Pressure SensorsDESCRIPTIONHoneywell’s SPT Series stainless steel pressure sensors are designed for media that will not adversely attack 316L stainless steel.The back side metal tube is made from 304 stainless steel which provides effective protection against most harsh environments. The SPT Series is calibrated and compensated for three styles of output: 4.0 mA to 20.0 mA (mA version); 1.0 Vdc to 5.0 Vdc (4 V version); and 0 mV to 100 mV (mV version). All versions feature a variety of pressure connections to allow use in a wide range of OEM (Original Equipment Manufacturer) equipment.The SPT Series stainless steel devices are rugged and reliable transducers for use in a wide variety of pressure sensing applications where corrosive liquids and gases are monitored.FEATURES•Reliable semiconductor technology•Calibrated and temperature compensated •Rugged, stainless steel package•NEMA 4 design•Small size•Absolute, gage, sealed gage, vacuum gage pressures •0 psi to 3 psi, 0 psi to 5000 psiPOTENTIAL APPLICATIONS •Industrial automation and flow control •Pressure instrumentation •Hydraulic systems•Process controlSPT Series2 /sensingTable 1. SpecificationsCharacteristic Parameter Environmental specifications Compensated temperature range -10 °C to 85 °C [14 °F to 185 °F] Operating temperature range -40 °C to 85 °C [-40 °F to 185 °F] Storage temperature range -40 °C to 85 °C [-40 °F to 185 °F] Vibration10 G at 20 Hz to 2000 Hz Shock100 G for 11 ms Insulation resistance100 M Ω at 50 Vdc Recommended supply range SPT mA supply voltage+12.5 Vdc to +24 VdcSPT 4V Supply voltage V S Quiescent current I QSC Short circuit current I SC +12.5 Vdc to +24 Vdc 5 mA 18 mASPT mV supply voltage V S +10 Vdc Maximum supply ratingsSPT mV supply voltage V S +15 Vdc SPT mA and SPT 4V supply voltage V S +24 VdcTable 2. Pressure Range SpecificationsCatalog Listing 1Pressure Range Proof Pressure 2 Burst Pressure 3SPT (mA, mV, 4V) 0003P G (4,5,6,7,9) (B/WXX) 0 psig to 3 psig 9 psig 15 psig SPT (mA, mV, 4V) 0005P G (4,5,6,7,9) (B/WXX) 0 psig to 5 psig 15 psig 25 psig SPT (mA, mV, 4V) 0010P G (4,5,6,7,9) (B/WXX)0 psig to 10 psig 30 psig 50 psig SPT (mA, mV, 4V) 0015P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 15 psi 45 psi 75 psi SPT (mA, mV, 4V) 0030P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 30 psi 90 psi 150 psi SPT (mA, mV, 4V) 0050P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 50 psi 150 psi 250 psi SPT (mA, mV, 4V) 0100P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 100 psi 300 psi 500 psi SPT (mA, mV, 4V) 0200P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 200 psi 600 psi 100 psi SPT (mA, mV, 4V) 0300P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 300 psi 900 psi 1500 psi SPT (mA, mV, 4V) 0500P (A,G,V) (4,5,6,7,9) (B/WXX) 0 psi to 500 psi 1200 psi 2400 psi SPT (mA, mV, 4V) 1000P (A,S) (4,5,6,7) (B/WXX) 0 psi to 1000 psi 3000 psia 5000 psia SPT (mA, mV, 4V) 2000P (A,S) (4,5,6,7) (B/WXX) 0 psi to 2000 psi 6000 psia 10000 psia SPT (mA, mV, 4V) 3000P (A,S) (4,5,6,7) (B/WXX) 0 psi to 3000 psi 9000 psia 10000 psia SPT (mA, mV, 4V) 5000P (A,S) (4,5,6,7) (B/WXX) 0 psi to 5000 psi 10000 psia 10000 psiaNotes:1. Vacuum gage units (V option) allow you to pull a hard vacuum on the gage units. Vacuum gage parts are only available on the mV version in 15 psig through 500 psig. As sold, this package design is not submersible. In order to make the package submersible, the package needs to be sealed.2. The maximum pressure that can be applied without changing the transducer’s performance or accuracy.3. The maximum pressure that can be applied to a transducer without rupture of either the sensing element or transducer case.Low Cost, Stainless Steel Media Isolated Pressure SensorsHoneywell Sensing and Control3Table 3. Performance Specifications 1Characteristic Minimum Typical Maximum UnitSPT mV Version Zero pressure offset -2 0 +2 mVFull-scale span (0 psig to 3 psig and 0 psig-5 psig only)248 50 52 mVFull-scale span (0 psi to10 psi and 0 psi to 3000 psi only)298 100 102 mVFull-scale span (0 psi to 5000 psi only)2148 150 152 mVPressure non-linearity 3– ±0.1 ±0.25 %FSSPressure hysteresis 3– ±0.015 ±0.030 %FSS Repeatability – ±0.010 ±0.030 %FSSTemp. effect on span 4– ±0.5 ±1.0 %FSSTemp. effect on offset 4– ±0.5 ±1.0 %FSSTemp. effect on span (0 psi to 3 psi and 0 psi to 5 psi only)4– ±1 ±2.0 %FSSTemp. effect on offset (0 psi to 3 psi and 0 psi to 5 psi only)4– ±1 ±2.0 %FSS Thermal hysteresis (-10 °C to 85 °C [14 °F to 185 °F]) – ±0.1 ±0.3 %FSSLong-term stability of offset and span 5– ±0.1 ±0.3 %FSSResponse time 6– 0.1 – msCommon mode voltage (voltage version “K”)70.5 1.25 2.0 Vdc Input resistance 8.0 25 50 k Ω Output resistance 3.0 4.5 6.0 k ΩSPT mA Version Zero pressure offset 3.84 4.0 4.16 mAFull-scale span 215.84 16.0 16.16 mAPressure non-linearity 3– ±0.1 ±0.25 %FSSPressure hysteresis 3– ±0.015 ±0.03 %FSS Repeatability – ±0.010 ±0.030 %FSSTemp. effect on span 4– ±0.5 ±1.5 %FSSTemp. effect on offset 4– ±0.5 ±1.5 %FSSTemp. effect on span (0 psi to 3 psi and 0 psi to 5 psi only)4– ±1.5 ±2.5 %FSSTemp. effect on offset (0 psi to 3 psi and 0 psi to 5 psi only)4– ±1.5 ±2.5 %FSS Thermal hysteresis -10 °C to 85 °C [14 °F to 185 °F] – ±0.1 ±0.3 %FSSLong term stability of offset and span 5– ±0.1 ±0.3 %FSSResponse time 6– 5 – msSPT 4V Version Zero pressure offset 0.96 1.0 1.04 VFull-scale span 23.964.0 4.04 VPressure non-linearity 3– ±0.1 ±0.25 %FSSPressure hysteresis 3– ±0.015 ±0.03 %FSS Repeatability – ±0.010 ±0.030 %FSSTemp. effect on span 4– ±0.5 ±1.5 %FSSTemp. effect on offset 4– ±0.5 ±1.5 %FSSTemp. effect on span (0 psi to 3 psi and 0 psi to 5 psi only)4– ±1.5 ±2.5 %FSSTemp. effect on offset (0 psi to 3 psi and 0 psi to 5 psi only)4– ±1.5 ±2.5 %FSS Thermal hysteresis -10 °C to 85 °C [14 °F to 185 °F] – ±0.1 ±0.3 %FSSLong term stability of offset and span 5– ±0.1 ±0.3 %FSSResponse time 6– 5 – ms Notes:1. Reference conditions (unless otherwise noted): T A = 25 °C [77 °F]; For SPTmA and SPT4V, Supply V S = 23.5 Vdc ±0.01 Vdc; for SPTmV: V S = 10 Vdc.2. Full-scale span (FSS) is the algebraic difference between the output voltage at full-scale positive pressure and the output at zero pressure. FSS is ratiometric to the supply voltage.3. Pressure non-linearity is based on best-fit straight line from zero to the full-scale pressure. Pressure hysteresis is the maximum output difference at any point within the operating pressure range for increasing and decreasing pressure.4. Maximum error band of the offset voltage or span over the compensated temperature range, relative to the 25 °C [77 °F] reading.5. Long-term stability over a six-month period.6. Response time for a 0 psi to FSS pressure step change, 10% to 90% rise time.7. Common mode voltage as measure from output to ground.4 /sensingFigure 1. Equivalent Basic Circuits SPT mASPT 4VSPT mVFigure 2. SPT mA Version External Load LineFigure 3. Pinout and Wire Code for all Package StylesMOUNTING DIMENSIONS (For reference only, in (mm).)Figure 4: Package 4: 1/8-27 NPT Port*Bayonet termination is dimensionally equivalent to an Amphenol Bendix PTIH-8-4P.Low Cost, Stainless Steel Media Isolated Pressure SensorsHoneywell Sensing and Control5Figure 5. Package 5: 1/4-18 NPT PortFigure 6. Package 6: 7/16-20 UNF Port*Bayonet termination is dimensionally equivalent to an Amphenol Bendix PTIH-8-4P.6 /sensingFigure 7. Package 7: 1/4-19 BSPP PortFigure 8. Package 9: VCR Port*Bayonet termination is dimensionally equivalent to an Amphenol Bendix PTIH-8-4P.Low Cost, Stainless Steel Media Isolated Pressure SensorsHoneywell Sensing and Control7Order Guide SPT mASPT mVSPT 4VSensing and Control Honeywell1985 Douglas Drive North Golden Valley, MN 55422 /sensing 008133-2-EN IL50 GLO Printed in USA August 2009Copyright © 2009 Honeywell International Inc. All rights reserved.WARNINGPERSONAL INJURYDO NOT USE these products as safety or emergency stop devices or in any other application where failure of the product could result in personal injury.Failure to comply with these instructions could result in death or serious injury.WARRANTY/REMEDYHoneywell warrants goods of its manufacture as being free of defective materials and faulty workmanship. Honeywell’s standard product warranty applies unless agreed to otherwise by Honeywell in writing; please refer to your orderacknowledgement or consult your local sales office for specific warranty details. If warranted goods are returned to Honeywell during the period of coverage, Honeywell will repair or replace, at its option, without charge those items it finds defective. The foregoing is buyer’s sole remedy and is in lieu of all other warranties, expressed or implied, including those ofmerchantability and fitness for a particular purpose. In no event shall Honeywell be liable for consequential, special, or indirect damages.While we provide application assistance personally, through our literature and the Honeywell web site, it is up to the customer to determine the suitability of the product in the application.Specifications may change without notice. The information we supply is believed to be accurate and reliable as of this printing. However, we assume no responsibility for its use.WARNINGMISUSE OF DOCUMENTATION• The information presented in this product sheet is forreference only. Do not use this document as a product installation guide.• Complete installation, operation, and maintenanceinformation is provided in the instructions supplied with each product.Failure to comply with these instructions could result in death or serious injury.SALES AND SERVICEHoneywell serves its customers through a worldwide network of sales offices, representatives and distributors. For application assistance, current specifications, pricing or name of the nearest Authorized Distributor, contact your local sales office or:E-mail: info.sc@ Internet: /sensing Phone and Fax:Asia Pacific +65 6355-2828 +65 6445-3033 Fax Europe +44 (0) 1698 481481+44 (0) 1698 481676 FaxLatin America +1-305-805-8188+1-305-883-8257 Fax USA/Canada +1-800-537-6945+1-815-235-6847 +1-815-235-6545 Fax分销商库存信息:HONEYWELLSPTMV0100PG5W02SPT4V0100PG5W02SPT4V0500PG5W02 SPTMV0030PG5W02SPTMA0100PG5W02SPTMA0030PG5W02 SPTMA0500PG5W02SPTMA0005PG5W02SPTMA0015PG5W02 SPT4V0030PG5W02SPT4V0005PG5W02SPT4V0015PG5W02 SPTMV0300PG5W02SPTMV0500PG5W02SPTMV0005PG5W02 SPTMV0015PG5W02SPTMA0300PG5W02SPT4V0300PG5W02。
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Typical ApplicationV DDMicrel, Inc. • 1849 Fortune Drive • San Jose, CA 95131 • USA • tel + 1 (408) 944-0800 • fax + 1 (408) 944-0970 • Pin DescriptionPin NumberPin Name Pin Function Pin Name Function1,2,3,4A4,A3,A2,A1Current Sink pins to be connected to LED cathodes5LOADIf this pin is Low, the device acts as a shift register. When this pin is High,only the first falling edge of the clock transfers data from the Shift-Register to the Parallel Register. The next rising edge transfers data from the Status Register to the Shift Register 6SHFTCLK Shift-register Clock Input 7VDD Positive Supply Voltage 8,22GND Ground9SHIFTIN Shift-register Data Input 10SHIFTOUT Shift-register Data Output11,12,13,14B1,B2,B3,B4Current Sink pins to be connected to LED cathodes 15,16,17,18B5,B6,B7,B8Current Sink pins to be connected to LED cathodes19VDDB Analog Power source pins which provide current sense points for Channel A and Channel B PNP emitter currents, independently.20BD_B Base Drive Outputs for external PNP transistors. Feedback Loop compensa-tion requires one external capacitor at each PNP transistor collector.21REF Reference current output. Must be connected to an external resistor to set the maximum current for the current sink outputs.23BD_A Base Drive Outputs for external PNP transistors. Feedback Loop compensa-tion requires one external capacitor at each PNP transistor collector.24VDDA Analog Power source pins which provide current sense points for Channel A and Channel B PNP emitter currents, independently.25,26,27,28A8,A7,A6,A5Current Sink pins to be connected to LED cathodesPin ConfigurationA4A3A2A1LOAD SHFTCLK VDD GND SHIFTIN SHIFTOUT A5A6A7A8VDDA BD_A GND IREF BD_B VDDB B1B8B2B7B3B6B4B528-Lead SOICAbsolute Maximum Ratings (Note 1)Supply Voltage..............................................................+7V Input Voltage.......................................–0.3V to V CC + 0.3V Base Drive Voltage.......................................................+7V Output Sink Current (per output)................................35mA Lead Temperature (soldering, 5 sec)........................260°C Junction Temperature (T J)(max)...............................125°C Operating Ratings (Note 2)Supply Voltage (V CC)................................+4.75V to +5.5V Junction Temperature (T J).......................–40°C to +125°C Package Thermal ResistanceSOIC (θJC).......................................................... 28°C/W SOIC (θJA).........................................................100°C/WDC Electrical CharacteristicsV DD = 4.75V to 5.5 V, T A = 25°C, bold values indicate –40°C ≤ T A≤ +85°C. R BIAS = 500Ω. Applies to all channels unless noted. Symbol Parameter Condition Min Typ Max Units I OUT Output Sink Current2635mA ∆I OUT Output Current Matching7% I OUT(OFF)Output Off Leakage V OUT = 5V–11µA I DD Supply Current V DD = 5.5V02mA I B PNP Base Drive Current V BD = 4V750mA V REF Reference Output Voltage I REF = –4mA 1.9 2.1V V IH Logic 1 Input Threshold 2.2V V IL Logic 0 Input Threshold0.8V V OH Logic 1 Output Level I LOAD = 1mA 2.4V V OL Logic 0 Output Level I LOAD = 1mA0.4V T SHUTDOWN Thermal Shutdown Temperature165°CAC Electrical CharacteristicsV DD = 4.75V to 5.5V, T A = 25°C, bold values indicate –40°C ≤ T A≤ +85°C. R BIAS = 500Ω. Applies to all channels unless noted Symbol Parameter Conditions Min Typ Max Units f SHIFT Shift Frequency15MHz t SET-DATA Set Up Time for Data In Note 57ns t HOLD-DATA Hold Time for Data In Note 513ns t SET-LOAD Set Up Time for Load Note 520ns t HOLD-LOAD Hold Time for Load Note 513ns I OUT(tr)Rise Time I OUT Note 4, 5125ns I OUT(ttf)Fall Time I OUT Note 4, 550ns t D-SHIFT Clock to Shift Out Delay Rise and Fall, 50% C LOAD = 30pF, Note 523ns t r,f-OUT Shift Out Rise and Fall Time10% to 90%; C LOAD =30pF, Note 510ns t WD-TIMEOUT Watch Dog Timeout Delay No Shiftclock25200µs t r,f[in]Logic Input Rise and Fall Times10ns Note 1.Exceeding the absolute maximum rating may damage the device.Note 2.The device is not guaranteed to function outside its operating rating.Note 3.Devices are ESD sensitive. Handling precautions recommended. Human body model, 1.5k in series with 100pF.Note 4.Test circuit shown in Figure 1.Note 5.Guaranteed by design; not production tested.Test CircuitV OUT to FET Probe (C < 1.5pF)V DD = 5VFigure 1.AC Output Test CircuitTiming DiagramsSHFTCLKLOADControl Register ContentsShift Register Contents Status Register ContentsFigure 2.MIC5400 Timing DiagramLinearity51015202530354045I O U T ( m A )I REF (mA)Typical Global Full Scale Linearity(any output)Figure 3.Typical Global Full Scale LinearityFunctional DiagramSHIFTINSHFTCLKMIC5400 Functional DiagramAddress Data A Data B Watchdog Divisor DAC B DAC B3 Bits10 bits10 Bits 1 Bit4 Bits 4 Bits 4 BitsQ1 to Q3Q4 to Q13Q14 to Q23Q24Q25 to Q28Q29 to Q32Q33 to Q36 [Q1 = LSB]Bit Description1Address bit 12Address Bit 23Address Bit 34Data A Bit 15Data A Bit 26Data A Bit 37Data A Bit 48Data A Bit 59Data A Bit 610Data A Bit 711Data A Bit 812Data A Bit 913Data A Bit 1014Data B Bit 115Data B Bit 216Data B Bit 317Data B Bit 418Data B Bit 519Data B Bit 620Data B Bit 721Data B Bit 822Data B Bit 923Data B Bit 1024Watchdog Bit [Disable = 1]25Divisor Bit 126Divisor Bit 227Divisor Bit 328Divisor Bit 429DAC A Bit 130DAC A Bit 231DAC A Bit 332DAC A Bit 433DAC B Bit 134DAC B Bit 235DAC B Bit 336DAC B Bit 4Table 1. Shift Register Data FormatStatus A Status B Watchdog Thermal Mask Revision Alternating Bits [1 = Open Circuit][1 = Open Circuit][1 = Timeout][1 = Overtemp]8 Bits8 Bits 1 Bit 1 Bit 3 Bits15 Fixed BitsD1-D8D9-D16D17D18D19 to D21D22 to D36Bit Description1Status A - Bit 1 (Output Open Circuit = 0)2Status A - Bit 2 (Output Open Circuit = 0)3Status A - Bit 3 (Output Open Circuit = 0)4Status A - Bit 4 (Output Open Circuit = 0)5Status A - Bit 5 (Output Open Circuit = 0)6Status A - Bit 6 (Output Open Circuit = 0)7Status A - Bit 7 (Output Open Circuit = 0)8Status A - Bit 8 (Output Open Circuit = 0)9Status B - Bit 1 (Output Open Circuit = 0)10Status B - Bit 2 (Output Open Circuit = 0)11Status B - Bit 3 (Output Open Circuit = 0)12Status B - Bit 4 (Output Open Circuit = 0)13Status B - Bit 5 (Output Open Circuit = 0)14Status B - Bit 6 (Output Open Circuit = 0)15Status B - Bit 7 (Output Open Circuit = 0)16Status B - Bit 8 (Output Open Circuit = 0)17Watchdog Status [0 = Normal, 1 = Time Out]18Thermal Status [0 = Normal, 1 = Overtemp]19Mask Revision Bit 120Mask Revision Bit 221Mask Revision Bit 3220 [Fixed Pattern Filler Bits]231240251260271280291300311320331340351360Table 2. Status Word FormatApplications InformationOutput Current DriveThe MIC5400 includes several ways to program LED output current. These output current controls are superimposed and have an additive effect on LED output current as follows:Global Full Scale Current Limit:This function sets the Global Full Scale (GFS) current at each of the outputs. The G FS value current is about 8.1 times ISET.ISET is the current through the single resistor, RBIAS,connected from VREF to Ground. VREF is regulated to 2V (nominal) so:I V R V R SET REF BIAS BIAS ==()2 and GFS V R BIAS=[]×[]812.For R BIAS = 500Ω, GFS = ≈32.4mAThe recommended value for I SET is 4mA or less for linear operation. See Figure 3.Brightness ControlBrightness contol is provided by two, 4-bit DACs, one DAC for each of the two output banks of 8 outputs. The output current is varied between 0*GFS and (15/16) *GFS in 15 equal steps based on the 4 Bit DAC code from the shift register Data Word; Bits Q29 -Q32 control Output Bank A and Bits QA33-36 control Output Bank B. (See Table 1: Data Word Format).Watchdog Status is read back from Status Word Bit Q17.Thermal Status is read from Status Word Bit Q18.Output IntensityEach LED Output intensity is further controlled by a Pulse Width Modulator providing 10-bit resolution intensity varia-tion. One LED output per bank can be set up for each Data Word. A 3-bit address selects 1 of the 8 PWMs for each of the two output banks. Programming bits Q1-Q3 determine the PWM address, bits Q4-Q13 control the PWMs driving Bank A, bits Q14-Q23 control the PWMs driving Bank B. The PWM is created by comparing the count of a 10-bit counter with the 10-bit programming word. If the count output is greater than the programming word, the output is “OFF”.The PWM frequency is also programmable, in ratio to the frequency of the shift register clock. The ratio value is set by the Divisor, loaded into bits Q25-Q28 of the Data Word. See Table 3.Watchdog and Thermal ShutdownThe MIC5400 incorporates both a watchdog and thermal shutdown.The watchdog shuts off all outputs and sets watchdogstatus bit to logic 1 if the shift clock is absent for more than 200 microseconds. Watchdog status remains logic 0 for shift clocks more frequent than 25 microseconds. The watchdog is enabled by data word bit Q24. Watchdog status is read back from status word bit D17.As a result of the 25 microsecond minimum watchdog timeout delay, the lower limit of clock frequency is 40kHz.The thermal shutdown typically activates if the die tem-perature exceeds 165°C. Thermal shutdown shuts off all outputs and sets the Thermal status bit to logic 1 if over-temperature is detected. Thermal status is read back from status word bit D18.External PNP TransistorsThe external PNPs have a dual role. As part of a voltage regulator loop they aid in limiting package power dissipation.Sensing current in the PNP emitters also allows setting an overall limit to the current available to one bank of 8 LEDs.Power dissipation: The regulator loop controls the voltage at the LED drive output to limit power dissipation. The outputs are typically controlled to 1.1V. A 2.2 µF capactor is required at the collector of each PNP for frequency compensation.PNP Current LimitThe current limit of the external PNP can be set by conncting a sense resistor R CS from VDD to VDDA and VDDB respec-tively. The current limit is:I LIM = 48mVRSCIf current limit is not used, short VDDA and VDDB to VDD.Daisy ChainsParts may be cascaded in groups of arbitrary size. The SHIFTOUT pin of one part is connected to the SHIFTIN pin of the following part. Data bit 36 is the first bit data to be shifted in. Status bit 36 is the first status bit to be shifted out. (See Table 1 and Table 2)When loading the 36-bit data words, the user must keep track of the number of SHIFTCLOCK cycles to determine when data is aligned for transfer to the control and PWM registers.For example, if one daisy chains 10 parts, 360 SHIFTCLK cycles are required to clock in all the data words.LOAD and the Data/Control and Status Registers:When LOAD is low, the MIC5400 acts as a 36-bit shift register. When LOAD goes high, the part no longer shifts data. Data is transferred from the Shift Register to the parallel control registers on the first falling edge of SHIFTCLK after LOAD goes high. While LOAD remains high, the next rising edge of SHIFTCLOCK transfers data from the status regis-ters to the shift register. The first status bit to appear on SHIFTOUT is Status Filler Bit 36 (Logic 0). See Table 2 for description and Figure 2 for timing.Status A or Status B = 0 if the output is open circuit, i.e., open LED.After LOAD returns low, normal shift register operation re-sumes and status data is shifted out as new data words are shifted in on the rising edge of SHIFTCLK.Divisor Code 0123456789A B C D E F Divide by R 12345678910111213141516Table 3. PWM Clock Ratio to Shift Clock [PWM Clock Freq. = (Shift Clock Freq)/R]TIME (2.5ns/div)(2V /d i v )(1V /d i v)TIME (2.5ns/div)(1V /d i v )TIME (2.5ns/div)(1V /d i v)Output Current Sink Rise Time Clock to Shiftout Delay TimeOutput Current Sink Fall TimePackage InformationRev. 0228-Pin Wide SOICMICREL, INC.1849 FORTUNE DRIVE SAN JOSE, CA95131USATEL + 1 (408) 944-0800 FAX + 1 (408) 944-0970 WEB The information furnished by Micrel in this datasheet is believed to be accurate and reliable. However, no responsibility is assumed by Micrel for its use.Micrel reserves the right to change circuitry and specifications at any time without notification to the customer.Micrel Products are not designed or authorized for use as components in life support appliances, devices or systems where malfunction of a product can reasonably be expected to result in personal injury. Life support devices or systems are devices or systems that (a) are intended for surgical implant into the body or (b) support or sustain life, and whose failure to perform can be reasonably expected to result in a significant injury to the user. A Purchaser’s use or sale of Micrel Products for use in life support appliances, devices or systems is at Purchaser’s own risk and Purchaser agrees to fully indemnifyMicrel for any damages resulting from such use or sale.© 2005 Micrel, Incorporated.。