IS41LV8512-50T中文资料
AT8511 8512 用户手册说明书
SHENZHEN LANGPU ELECTRONIC TECH.CO.,LTD深圳市深南中路南光捷佳大厦1402室TEL**************839801588304741583986300FAX**************83047419网址:综合推广网 衡器烘箱网邮箱:***********QQ:374542908MSN:******************FAX**************安全须知当你发现有以下不正常情形发生,请立即终止操作并断开电源线。
立刻与安柏科技销售部联系维修。
否则将会引起火灾或对操作者有潜在的触电危险。
z仪器操作异常。
z操作中仪器产生反常噪音、异味、烟或闪光。
z操作过程中,仪器产生高温或电击。
z电源线、电源开关或电源插座损坏。
z杂质或液体流入仪器。
安全信息为避免可能的电击和人身安全,请遵循以下指南进行操作。
免责声明用户在开始使用仪器前请仔细阅读以下安全信息,对于用户由于未遵守下列条款而造成的人身安全和财产损失,安柏科技将不承担任何责任。
仪器接地 为防止电击危险,请连接好电源地线。
不可在爆炸性气体环境使用仪器 不可在易燃易爆气体、蒸汽或多灰尘的环境下使用仪器。
在此类环境使用任何电子设备,都是对人身安全的冒险。
不可打开仪器外壳 非专业维护人员不可打开仪器外壳,以试图维修仪器。
仪器在关机后一段时间内仍存在未释放干净的电荷,这可能对人身造成电击危险。
不要使用已经损坏的仪器 如果仪器已经损害,其危险将不可预知。
请断开电源线,不可再使用,也不要试图自行维修。
不要使用工作异常的仪器 如果仪器工作不正常,其危险不可预知,请断开电源线,不可再使用,也不要试图自行维修。
不要超出本说明书指定的方式使用仪器超出范围,仪器所提供的保护措施将失效。
声明:!, $, #,安柏标志和文字是常州安柏精密仪器有限公司的商标或注册商标。
Email:***********FAX**************AT8511/8512直流电子负载用 户 手 册User’s Manual简体中文ChineseSimplifiedFEB, 2008第1版Rev.A3@%常州安柏精密仪器有限公司©2005-2009 Applent T echnologies, Inc.有限担保和责任范围常州安柏精密仪器有限公司(以下简称Applent)保证您购买的每一台AT8511/8512在质量和计量上都是完全合格的。
IT8511使用手册
版权所有 © 艾德克斯电子有限公司
iv
IT8500 用户手册
目录
认证与质量保证 ........................................................................................................................................................ 1 保固服务 .................................................................................................................................................................... 1 保证限制 .................................................................................................................................................................... 1 安全标志 .................................................................................................................................................................... 1 安全注意事项 ............................................................................................................................................................ 2 环境条件 .................................................................................................................................................................... 2 法规标记 .................................................................................................................................................................... 3 废弃电子电器设备指令(WEEE) ........................................................................................................................3 符合性信息 ................................................................................................................................................................ 3
TiR2-TiR3-TiR4-Ti40-Ti45-Ti50-Ti55 说明书
®TiR2,TiR3,TiR4, Ti40,Ti45,Ti50,Ti55IR FlexCam Thermal Imagers用户手册January 2007, Rev. 1, 8/07 (Simplified Chinese)2007 Fluke Corporation. All rights reserved.All product names are trademarks of their respective companies.有限担保和有限责任Fluke 担保在正常使用和保养的情况下,其产品没有材料和工艺上的缺陷。
两年的担保期间由产品发货之日算起。
部件、产品修理和服务的担保期限为 90 天。
本担保仅限于Fluke 授权零售商的原购买人或最终用户,并且不适用于一次性电池、电缆接头、电缆绝缘转换接头或 Fluke 认为由于误用、改装、疏忽、污染及意外或异常操作或处理引起的任何产品损坏。
Fluke 担保软件能依照功能规格正常运行 90 天,并且软件是记录在无缺陷的媒介上。
Fluke 并不担保软件毫无错误或在运行中不会中断。
Fluke 授权的零售商应仅对最终用户就新的和未使用的产品提供本担保,但无权代表Fluke 公司提供额外或不同的担保。
只有通过 Fluke 授权的销售店购买的产品或者买方已经按适用的国际价格付款才能享受 Fluke 的担保支持。
在一国购买的产品需在他国修理时,Fluke 有权向买方要求负担重大修理/零件更换费用。
Fluke 的担保为有限责任,由 Fluke 决定是否退还购买金额、免费修理或更换在担保期间退还 Fluke 授权服务中心的故障产品。
如需要保修服务,请与您就近的 Fluke 授权服务中心联系,获得退还授权信息;然后将产品寄至服务中心,并附上产品问题描述,同时预付运费和保险费(目的地离岸价格)。
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在保修之后,产品将被寄回给买方并提前支付运输费(目的地交货)。
NI8512
Back to TopBack to TopLast Revised: 2014-11-06 07:14:41.0High-Performance NI-XNET Interfaces for CAN, LIN, and FlexRay NI PCI-851x, NI PXI-851x, NI 986xHigh-performance CAN, LIN, and FlexRay interfaces with onboard transceivers and software-selectable terminationNI-XNET driver and API for CAN, LIN, and FlexRay that simplify application development in NI LabVIEW, NI LabWindows™/CVI, and C/C++NI-XNET device-driven DMA engine that minimizes message latency and streams full-bandwidth CAN, LIN, and FlexRay bus dataIntegrated signal databases that automatically translate CAN, LIN, and FlexRayframes to engineering-level signals, including FIBEX, CANdb (.DBC), LIN Description File (LDF), and NI-CAN (.NCD)Hardware synchronization, 1 μs timestamps for integration with NI data acquisition,digitizers, switches, and large systemsIntegrated, onboard transceivers for simpler setup, better reliability, and no hidden costsDedicated per-port processors that manage up to 192 hardware-accelerated frames,reducing host system load and software complexityBundled software: All NI-XNET interfaces include the NI-XNET driver and API,NI-XNET Bus Monitor, and NI-XNET Database EditorOverviewThe NI-XNET platform combines a series of high-performance CAN, LIN, and FlexRay interfaces with the NI-XNET driver and API—a common set of easy-to-use functions for reading and writing CAN, LIN, and FlexRay frames and signals in user-created applications.Requirements and CompatibilityOS InformationPharLap Real-Time OS Windows 7Windows 7 64-bit Windows Vista x64/x86Windows XPDriver InformationNI-CAN NI-XNETSoftware CompatibilityANSI C/C++Borland C++/Builder LabVIEWLabVIEW Real-Time Module LabWindows/CVIApplication and Technology Feature ComparisonModelBus Physical Layer Transceivers Min Baud Rate Max Baud RateExt Sync ConnectorPortsPCI PCI-8511CAN Low-Speed/Fault-Tolerant TJA1054A 40 kbits/s [1]125 kbits/s -1PCI-8511/2CANLow-Speed/Fault-Tolerant 2 x TJA1054A 40 kbits/s [1]125 kbits/s -2PCI-8512CANHigh-Speed/FDTJA104140 kbits/s8 Mbit/s-11Low-speed CAN transceivers operate down to 10 kbits/s in error conditions.CAN FD is the next generation of high-speed CAN communication with evolving standards for higher data rates. NI has enabled speeds up to 8 Mbit/s using the TJA1041 and TJA1043 transceivers through the NI-XNET driver. As transceiver vendors complete qualifications for CAN FD speeds, NI will update our documentation as necessary.NI-XNET High-Performance CAN, LIN, and FlexRay Interfacesand FlexRay interfaces; an optimized driver; easy-to-use APIs; and configuration and debugging utilities. With NI-XNET interfaces, youSupport for industry-standard CAN, LIN, and FlexRay signal database formats, including FIBEX, CANdb (.DBC), LDF, and NI-CAN NCD, simplifies NI-XNET integration intoHardware-in-the-loop simulationRapid control prototypingBus monitoring/replayHigh-throughput bus streamingRest-of-bus simulationAutomation controlIn-vehicle data loggingFigure 1. Simple NI-XNET Example Code for Reading and Writing CAN Signals Figure 2. The Same NI-XNET Code Adapted to Reading and Writing FlexRay Signals byChanging the Session InputsIntegration With NI ProductsMicrosecond-level timestamping, external timebase support, and PXI/RTSI triggering enable NI-XNET interfaces to integrate with hundreds of NI PCI and PXI devices for a wide variety of custom applications, ranging from synchronized data acquisition and bus-level measurements to fault-insertion and large distributed systems.For National Instruments 986x NI-XNET interfaces used in NI CompactDAQ and NI CompactRIO chassis, you achieve triggering and synchronization with other modules through the sharing of the same clock in the hardware backplane.Integrated Signal DatabasesThe NI-XNET API automatically translates CAN, LIN, and FlexRay frames to engineering-level signals, a feature often found only in expensive turnkey applications. With integrated support for industry-standard signal databases including FIBEX, CANdb (.DBC), LDF, and NI-CAN (.NCD), NI-XNET simplifies building custom applications to work with other tools in complex embedded design workflows.Backward CompatibilityNI-XNET interfaces are compatible with most legacy NI-CAN Frame and Channel API applications written for NI Series 2 and USB CAN interfaces. The NI-XNET NI-CAN compatibility layer operates at the driver level, ensuring a drop-in performance boost to established in-house applications without time-consuming code refactoring and recompiling. NI-XNET is not compatible with applications written for USB-LIN.NI Device-Driven DMA EngineThe patent-pending NI-XNET device-driven DMA engine reduces system latency, a common pain point for PC-based CAN interfaces, from milliseconds to microseconds. The engine enables the onboard processor to move frames and signals between the interface and the user program without CPU interrupts, freeing host processor time for processing complex models and applications.NI-XNET HardwareNI-XNET interfaces are available for CAN, LIN, and FlexRay in PCI, PXI, NI CompactDAQ, and NI CompactRIO form factors, and in one- and two-port models.PCI/PXI-8511 Low-Speed/Fault-Tolerant (LS) CANPCI/PXI-8512 High-Speed/FD (HS/FD) CANPCI/PXI-8513 Software-Selectable/FD (XS/FD) CANPCI/PXI-8517 FlexRayPCI/PXI-8516 LINNI 9862 High-Speed/FD (HS/FD) CANNI 9861 Low-Speed/Fault-Tolerant (LS) CANNI 9866 LINNI-XNET software-selectable interfaces offer the best flexibility for CAN development with onboard transceivers for high-speed/FD, low-speed/fault-tolerant, and single-wire CAN. All specifications in this document apply equally to 1- and 2-port models unless otherwise specified.NI-XNET SoftwareThe NI-XNET driver software and utilities are included at no additional charge with all NI-XNET CAN, LIN, and FlexRay interfaces.NI-XNET APIThe NI-XNET API provides function calls in LabVIEW, LabWindows/CVI, and C/C++ so you can easily send and receive CAN, LIN, and FlexRay signals and framesto and from your application. You can choose from 12 data transfer modes to optimize the data transfer for a particular application:Single-point signal input and output modes read and write the most recent values received for each signal. These modes are ideal for control and simulationapplications that use up to hundreds of simultaneous signals, which is common for hardware-in-the-loop applications.Waveform signal input and output modes use the time when the signal frame is received to resample the signal data to a waveform at a fixed sample rate. These modes typically are used for synchronizing NI-XNET data with NI-DAQmx analog/digital input channels and plotting waveforms.XY signal input and output modes return exact XY pairs of a signal's timestamp and its value. This is especially useful for knowing to the microsecond when a signal was last updated.Stream input and output modes for frames read or write every frame on the network. These modes are used for analyzing and logging all frame traffic on the network.Queued frame input and output modes read and write frame data from a dedicated queue per frame. These modes enable your application to read a sequence of data specific to a frame (for example, CAN identifier).NI-XNET LabVIEW Project SessionsThe NI-XNET API installs extra support for LabVIEW users to streamline programming on Windows and real-time targets. With NI-XNET sessions, configuration and setup information is stored in the project, which reduces coding and simplifies signal management.Figure 3. NI-XNET SessionFigure 4. NI-XNET Code Without SessionsFigure 5. NI-XNET code with sessions eliminates setup code and reduces clutter for complicated programs.NI-XNET UtilitiesNI-XNET Database EditorFigure 6. NI-XNET Database EditorThe NI-XNET Database Editor is a stand-alone tool for creating and maintaining embedded network databases that contain signals, frames, and network parameters. NI-XNET products use the ASAM FIBEX (FIeld Bus EXchange) standard as the primary database storage format. In addition to FIBEX, the NI-XNET Database Editor can import the .NCD.DBC) and convert themNI-CAN database format () and CANdb format ( to FIBEX.Use the editor toConfigure a basic new network from scratch or import an existing network such as a network from a large projectDefine and modify frames and signals exchanged on the networkAssign frames to corresponding ECUsNI-XNET Bus MonitorMeasure bus load and monitor bus load historyTransmit single and periodic test framesMap frames to database names for easier diagnosticsView CAN, LIN, and FlexRay bus statisticsLog raw frame data to disk as ASCII or binary NI CAN Logfile format (.NCL)Figure 7. NI I/O Trace UtilityThe NI I/O Trace utility monitors function calls to the NI-XNET APIs from user applications to help troubleshoot applications without adding complex and time-consuming debugging code. This tool helps you debug application programming problems, regardless of the programming environment used.NI-CAN Application CompatibilityPCI NI-XNET interfaces feature a RTSI bus connector for synchronization with other PCI NI-XNET interfaces and NI PCI and PCIBack to TopAbility to implement automotive diagnostics in LabVIEW, LabWindows™/CVI, Visual C/C++ 6.0Compatibility with Windows 7/Vista/XP/2000 and LabVIEW Real-TimeKWP2000 (ISO 14230), Diagnostics on CAN (ISO 15765, OBD-II), and Diagnostics over IP (ISO 13400)Transport protocols: ISO Transport Protocol 15765-2 and Volkswagen TP 2.0 Compatible interfaces: NI-XNET CAN, CompactRIO CAN, USB CAN, and Series 2 NI CAN (PXI, PCI, PCMCIA)Examples for KWP2000 and UDS, including a software ECU simulator NI LabVIEW function blocks to create CANopen master applicationsTransmit-and-receive process data objects (PDOs) and service data objects (SDOs)Support for all NI Series 2 high-speed CAN interfacesLabVIEW Real-Time support with Series 2 PXI high-speed CAN interfacesNetwork management, heartbeat, node guarding, and synchronization functions<b>NI does not recommend the NI CANopen LabVIEW Library for use in new designs.</b>NI ECU Measurement and Calibration Toolkit CAN Calibration Protocol (CCP) Version 2.1supportAccess to ECU physical values (DAQ andSTIM lists) for measurement and simulationapplicationsUniversal Measurement and CalibrationProtocol (XCP) master functionality on CANand EthernetAccess to internal ECU characteristics (1D to3D) and support for *.A2L database filesNI LabVIEW Real-TimeModuleDesign deterministic real-time applicationswith LabVIEW graphical programmingDownload to dedicated NI or third-partyhardware for reliable execution and a wideselection of I/OTake advantage of built-in PID control, signalprocessing, and analysis functionsAutomatically take advantage of multicoreCPUs or set processor affinity manuallyCompatibility with all NI PCI, PXI, PCMCIA, USB, and C Series CAN interfaces Included XCP and CCP Master add-on for NI VeriStand Includes real-time OS, development and debugging support, and board support Purchase individually or as part of a LabVIEW suiteSupport - Visit /support to access the NI KnowledgeBase, example programs, and tutorials or to contact our applications engineers who are located in NI sales offices around the world and speak the local language.Discussion Forums - Visit for a diverse set of discussion boards on topics you care about.Online Community - Visit to find, contribute, or collaborate on customer-contributed technical content with users like you.Classroom training in cities worldwide - the most comprehensive hands-on training taught by engineers.On-site training at your facility - an excellent option to train multiple employees at the same time.Online instructor-led training - lower-cost, remote training if classroom or on-site courses are not possible.Course kits - lowest-cost, self-paced training that you can use as reference guides.Training memberships and training credits - to buy now and schedule training later.Low-Speed/Fault-Tolerant CANBus Power RequirementsCAN_H wire interruptedCAN_L wire interruptedCAN_H short-circuited to batteryCAN_L short-circuited to batteryCAN_H short-circuited to VCCCAN_L short-circuited to VCCCAN_H short-circuited to groundCAN_L short-circuited to groundCAN_H and CAN_L mutually short-circuitedHigh-SpeedLow-Speed/Fault-TolerantSingle WirePinouts/Front Panel ConnectionsCAN DB9 pinoutLIN DB9 pinoutFlexRay DB9 pinoutBack to Top©2011 National Instruments. All rights reserved. CompactRIO, CVI, FieldPoint, LabVIEW, National Instruments, National Instruments Alliance Partner, NI, , NI CompactDAQ, and RTSI are trademarks of National Instruments. The mark LabWindows is used under a license from Microsoft Corporation. Windows is a registered trademark of Microsoft Corporation in the United States and other countries. Other product and company names listed are trademarks or trade names of their respective companies. A National Instruments Alliance Partner is a business entity independent from National Instruments and has no agency, partnership, or joint-venture relationship with National Instruments.My Profile RSS Privacy Legal Contact NI© 2014 National Instruments Corporation. All rights reserved.| | | |。
tl851芯片用法
tl851芯片用法TL851芯片是一款功能强大的集成电路芯片,主要用于通信和控制领域。
下面我将从多个角度来介绍TL851芯片的用法。
首先,TL851芯片在通信领域有广泛的应用。
它支持多种通信协议,如UART、SPI、I2C等,可以与其他设备进行数据交互和通信。
通过TL851芯片,可以实现数据的传输和接收,用于串口通信、无线通信、以太网通信等各种通信场景。
它的高性能和稳定性使得它成为许多通信设备的重要组成部分。
其次,TL851芯片在控制领域也有重要的应用。
它具有较强的处理能力和丰富的接口资源,可以实现各种控制算法和逻辑运算。
通过TL851芯片,可以实现智能家居控制、工业自动化控制、机器人控制等各种控制应用。
它的可编程性和灵活性使得它成为控制系统设计中的重要组成部分。
此外,TL851芯片还可以用于嵌入式系统的开发。
它支持多种开发环境和编程语言,如C语言、汇编语言等,开发者可以根据自己的需求进行系统开发和编程。
TL851芯片的丰富的外设和接口资源,如定时器、中断控制器、GPIO等,可以方便地与其他外部设备进行连接和控制,满足各种嵌入式系统的需求。
此外,TL851芯片还具有低功耗和小尺寸的特点,适用于一些对功耗和尺寸要求较高的应用场景。
例如,可以将TL851芯片应用于便携式设备、物联网设备等,实现低功耗的数据处理和通信功能。
总结起来,TL851芯片作为一款功能强大的集成电路芯片,在通信和控制领域有广泛的应用。
它可以用于各种通信场景、控制应用和嵌入式系统开发,具有低功耗和小尺寸的特点。
通过TL851芯片的使用,可以实现数据传输、通信控制、系统开发等多种功能,满足不同领域的需求。
LM41CIMT资料
LM41Hardware Monitor with Thermal Diode Inputs and SensorPath ™BusGeneral DescriptionThe LM41is a hardware monitor that measures 2tempera-ture zones,5voltages and has a single-wire interface com-patible with National Semiconductor’s SensorPath bus.Sen-sorPath data is pulse width encoded,thereby allowing the LM41to be easily connected to many general purpose micro-controllers.Several National Semiconductor Super I/O products include a fully integrated SensorPath master,that when connected to the LM41can realize a hardware monitor function that includes limit checking for measured values,autonomous fan speed control and many other functions.The LM41measures the temperature of its own die as well as one external device such as a processor thermal diode or a diode connected transistor.The LM41can resolve tem-peratures up to 255˚C and down to -256˚C.The operating temperature range of the LM41is 0˚C to +125˚ing Σ∆ADC it measures +1.2V,+2.5V,+3.3V,+5V and +12V analog input voltages with internal scaling resistors.The address programming pin allows two LM41’s to be placed on one SensorPath bus.Featuresn SensorPath Interface—2hardware programmable addresses n Voltage Monitoring —9-bit Σ∆ADC—Internal scaling resistors for all inputs—Monitors +1.2V,+2.5V,+3.3V,+5V and +12V n Temperature Sensing—Remote diode temperature sensor zone —Internal local temperature zone —0.5˚C resolution—Measures temperatures up to 140˚C n 14-lead TSSOP packageKey Specificationsn Voltage Measurement Accuracy ±2%(max)n Temperature Sensor Accuracy ±3˚C (max)n Temperature Range:—LM41junction0˚C to +85˚C —Remote Temp Accuracy 0˚C to +100˚C n Power Supply Voltage+3.0V to +3.6Vn Average Power Supply Current 0.5mA (typ)n Conversion Time (all Channels)22.1ms to 1456msApplicationsn Microprocessor based equipment(Motherboards,Video Cards,Base-stations,Routers,ATMs,Point of Sale,…)n Power SuppliesTypical Application20070301SensorPath ™is a trademark of National Semiconductor CorporationMay 2004LM41Hardware Monitor with Thermal Diode Inputs and SensorPath ™Bus©2004National Semiconductor Corporation Connection DiagramTSSOP-1420070302Top ViewNational Package Number MTC14COrder Number Package Marking NS Package Number Transport Media LM41CIMT LM41CIMT MTC14C 94units per railLM41CIMTXLM41CIMTMTC14C2500units in tape and reelPin DescriptionPin Number Pin NameDescription Typical Connection1,10,13,14NC No Connect May be tied to V+,GND or left floating.Do not tie active signals to pin 10.2GND GroundSystem ground3V+/+3.3V_SBYPositive power supply pin as well as a +3.3V voltage monitorConnected system 3.3V standby power and to a 0.1µF bypass capacitor in parallel with 100pF.A bulk capacitance of approximately 10µF needs to be in the near vicinity of the LM41.4SWD SensorPath Bus line;Open-drain outputSuper I/O,Pull-up resistor,1.6k5ADDDigital input -device number select input for the serial bus device numberPull-up to 3.3V or pull-down to GND resistor,10k;must never be left floating 6+1.2V +1.2V voltage monitoring input with scaling resistorsProcessor core voltage to be monitored 7+2.5V +2.5V voltage monitoring input with scaling resistorsPower supply voltage to be monitored 8D-Thermal diode analog voltage output and negative monitoring inputRemote Thermal Diode cathode(THERM_DC)-Can be connected to a CPU or thermal diode,an MMBT3904or a GPU thermal diode.A 100pF capacitor should be connected between respective D-and D+for noise filtering.9D+Thermal diode analog current output and positive monitoring input Remote Thermal Diode anode (THERM_DA)-Can be connected to a CPU or thermal diode,an MMBT3904or a GPU thermal diode.A 100pF capacitor should be connected between respective D-and D+for noise filtering.11+5V +5V voltage monitoring input with scaling resistorsPower supply voltage to be monitored 12+12V+12V voltage monitoring input with scaling resistorsPower supply voltage to be monitoredL M 41 2LM41 Block Diagram3Absolute Maximum Ratings(Notes 2,1)Supply Voltage (V +)−0.5V to 6.0V Voltage at Any Digital Input or Output Pin−0.5V to 6.0V Voltage on 12V Analog Input −0.5V to 16V Voltage on 5V Analog Input −0.5V to 6.67VVoltage on D+−0.5V to (V++0.05V)Voltage on Other Analog Inputs −0.5V to 6.0VCurrent on D-±1mA Input Current per Pin(Note 3)±5mA Package Input Current (Note 3)±30mAPackage Power Dissipation (Note 4)Output Sink Current 10mAESD Susceptibility (Note 5)Human Body Model 2500V Machine Model 250VStorage Temperature−65˚C to +150˚C Soldering process must comply with National’s reflow temperature profile specifications.Refer to /packaging/.(Note 6)Operating Ratings(Notes 1,2)Temperature Range for Electrical Characteristics LM41CIMT (T MIN ≤T A ≤T MAX )0˚C ≤T A ≤+85˚C Operating Temperature Range 0˚C ≤T A ≤+125˚C Remote Diode Temperature (T D )Range-5˚C ≤T D ≤+140˚C Supply Voltage Range (V+)+3.0V to +3.6VAnalog Input Voltage Rage:+1.2V and +2.5V −0.05V to (V++0.05V)+3.3V_SBY (V+)+3.0V to +3.6V +5V −0.05V to +6.67V +12V−0.05V to +16V DC Electrical CharacteristicsThe following specifications apply for V+=+3.0V DC to +3.6V DC ,and all analog source impedance R S =50Ωunless other-wise specified in the conditions.Boldface limits apply for LM41CIMT T A =T J =T MIN =0˚C to T MAX =85˚C;all other limits T A =+25˚C.T A is the ambient temperature of the LM41;T J is the junction temperature of the LM41;T D is the junction tem-perature of the remote thermal diode.POWER SUPPLY CHARACTERISTICS Symbol ParameterConditionsTypical (Note 7)Limits (Note 8)Units (Limit)V+Power Supply Voltage3.3 3.03.6V (min)V (max)I+ShutdownShutdown Power Supply CurrentSensorPath Bus Inactive (Note 9)260420µA (max)I+AverageAverage Power Supply Current SensorPath Bus Inactive;all sensors enabled;t CONV =182ms;(Note 9)900µA (max)I+PeakPeak Power Supply Current SensorPath Bus Inactive (Note 9)3.3mA (max)Power-On Reset Threshold Voltage1.6V (min)2.8V (max)TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICSParameterConditionsTypical (Note 7)Limits (Note 8)Units (Limits)Temperature Accuracy Using the Remote Thermal Diode,see (Note 12)for Thermal Diode Processor Type.T J =0˚C to +85˚C T D =+25˚C ±1±2.5˚C (max)T J =0˚C to +85˚C T D =0˚C to +100˚C ±3˚C (max)T J =0˚C to +85˚CT D =+100˚C to +125˚C±4˚C (max)Temperature Accuracy Using the Local Diode T J =0˚C to +85˚C (Note 10)±1±3˚C (max)Remote Diode and Local Temperature Resolution 10Bits 0.5˚C D−Source Voltage0.7VL M 41 4TEMPERATURE-TO-DIGITAL CONVERTER CHARACTERISTICSParameter Conditions Typical(Note7)Limits(Note8)Units(Limits)Diode Source Current (V D+−V D−)=+0.65V;High Current188280µA(max) Low Current11.75µADiode Source Current High Current to Low CurrentRatio16 ANALOG TO DIGITAL CONVERTER CHARACTERISTICSSymbol Parameter Conditions Typical(Note7)Limits(Note8)Units(Limit)TUE Total Unadjusted Error(Note11)±2%FS(max) Resolution9Bits DNL Differential Non-linearity1LSB Power Supply Sensitivity±1%/VInput Resistance,all analog inputs(total resistance of divider chain)210140kΩ(min)400kΩ(max)SWD and ADD DIGITAL INPUT CHARACTERISTICSSymbol Parameter Conditions Typical(Note7)Limits(Note8)Units(Limit)V IH SWD Logical High Input Voltage 2.1V(min)V++0.5V(max) V IL SWD Logical Low Input Voltage0.8V(max)-0.5V(min) V IH ADD Logical High Input Voltage90%x V+V(min) V IL ADD Logical Low Input Voltage10%x V+V(max) V HYST Input Hysteresis300mVI L SWD and ADD Input Current GND≤V IN≤V+±0.005±10µA(max)SWD Input Current with V+Open or Grounded GND≤V IN≤3.6V,and V+Open orGND±0.005µAC IN Digital Input Capacitance10pF SWD DIGITAL OUTPUT CHARACTERISTICSSymbol Parameter Conditions Typical(Note7)Limits(Note8)Units(Limit)V OL Open-drain Output Logic“Low”Voltage I OL=4mA0.4V(max) I OL=50µA0.2V(max)I OH Open-drain Output Off Current±0.005±10µA(max)C OUT Digital Output Capacitance10pF AC Electrical CharacteristicsThe following specification apply for V+=+3.0V DC to+3.6V DC,unless otherwise specified.Boldface limits apply forT A=T J=T MIN=0˚C to T MAX=85˚C;all other limits T A=T J=25˚C.The SensorPath Characteristics conform to the SensorPath specification revision0.98.Please refer to that speciation for further details.Symbol Parameter Conditions Typical(Note7)Limits(Note8)Units(Limits)HARDWARE MONITOR CHARACTERISTICSt CONV Total Monitoring Cycle Time(Note13)All Voltage andTemperature readings(Default)182163.8ms(min)200.2ms(max)LM415AC Electrical Characteristics(Continued)The following specification apply for V+=+3.0V DC to +3.6V DC ,unless otherwise specified.Boldface limits apply forT A =T J =T MIN =0˚C to T MAX =85˚C ;all other limits T A =T J =25˚C.The SensorPath Characteristics conform to the SensorPath specification revision 0.98.Please refer to that speciation for further details.SymbolParameterConditionsTypical (Note 7)Limits (Note 8)Units (Limits)SensorPath Bus CHARACTERISTICSt f SWD fall time (Note 16)R pull-up =1.25k Ω±30%,C L =400pF300ns (max)t r SWD rise time (Note 16)R pull-up =1.25k Ω±30%,C L =400pF1000ns (max)t INACTMinimum inactive time (bus at high level)guaranteed by the slave before an attention request11µs (min)t Mtr0Master drive for Data Bit 0write and for Data Bit 0-1read11.8µs (min)17.0µs (max)t Mtr1Master drive for Data Bit 1write 35.4µs (min)48.9µs (max)t SFEdet Time allowed for LM41activity detection 9.6µs (max)t SLout1LM41drive for Data Bit 1read by master 28.3µs (min)38.3µs (max)t MtrS Master drive for Start Bit 80µs (min)109µs (max)t SLoutA LM41drive for Attention Request 165µs (min)228µs (max)t RST Master or LM41drive for Reset354µs (min)t RST_MAXMaximum drive of SWD by an LM41,after the power supply is raised above 3V500ms (max)Note 1:Absolute Maximum Ratings indicate limits beyond which damage to the device may occur.Operating Ratings indicate conditions for which the device is functional,but do not guarantee performance limits.For guaranteed specifications and test conditions,see the Electrical Characteristics.The guaranteed specifications apply only for the test conditions listed.Some performance characteristics may degrade when the device is not operated under the listed test conditions.Note 2:All voltages are measured with respect to GND,unless otherwise noted.Note 3:When the input voltage (V IN )at any pin exceeds the power supplies (V IN <GND or V IN >V+),the current at that pin should be limited to 5mA.Parasitic components and/or ESD protection circuitry are shown below for the LM41’s pins.The nominal breakdown voltage of the zener is 6.5V.SNP stands for snap-back device.L M 41 6PIN #Pin Name Pin Circuit All Input Structure Circuits1NC A Circuit ACircuit CCircuit BCircuit D2GND B 3V+/3.3V SB B 4SWD A 5ADD A 6+1.2V C 7+2.5V C 8D-D 9D+E 10NC E 11+5V C Circuit E12+12V C 13NC none 14NCANote 4:Thermal resistance junction-to-ambient in still air when attached to a printed circuit board with 1oz.foil is 148˚C/W.Note 5:Human body model,100pF discharged through a 1.5k Ωresistor.Machine model,200pF discharged directly into each pin.Note 6:Reflow temperature profiles are different for lead-free and non lead-free packages.Note 7:“Typicals”are at T A =25˚C and represent most likely parametric norm.They are to be used as general reference values not for critical design calculations.Note 8:Limits are guaranteed to National’s AOQL (Average Outgoing Quality Level).Note 9:The supply current will not increase substantially with a SensorPath transaction.Note 10:Local temperature accuracy does not include the effects of self-heating.The rise in temperature due to self-heating is the product of the internal power dissipation of the LM41and the thermal resistance.See (Note 4)for the thermal resistance to be used in the self-heating calculation.Note 11:TUE ,total unadjusted error,includes ADC gain,offset,linearity and reference errors.TUE is defined as the "actual Vin"to achieve a given code transition minus the "theoretical Vin"for the same code.Therefore,a positive error indicates that the input voltage is greater than the theoretical input voltage for a given code.If the theoretical input voltage was applied to an LM41that has positive error,the LM41’s reading would be less than the theoretical.Note 12:The accuracy of the LM41CIMT is guaranteed when using the thermal diode of an Intel 90nm Pentium 4processor or any thermal diode with a non-ideality factor of 1.011and series resistance of 3.33Ω.When using a MMBT3904type transistor as a thermal diode the error band will be typically shifted by -4.5˚C.Note 13:This specification is provided only to indicate how often temperature and voltage data are updated.Note 14:The output fall time is measured from (V IH min )to (V IL max ).Note 15:The output rise time is measured from (V IL max )to (V IH min ).Note 16:The rise and fall times are not tested but guaranteed by design.LM417Timing Diagrams20070304FIGURE 1.Timing for Data Bits 0,1and Start Bit.See Section 1.2"SensorPath BIT SIGNALING"for further details.L M 41 8LM41 Timing Diagrams(Continued)20070305FIGURE2.Timing for Attention Request and Reset.See Section1.2"SensorPath BIT SIGNALING"for further details.9Typical Performance CharacteristicsRemote Diode Temperature Reading Sensitivity to DiodeFilter CapacitanceThermal Diode Capacitor or PCB Leakage Current Effecton Remote Diode Temperature Reading20070321200703221.0Functional DescriptionThe LM41hardware monitor measures up to 2temperature zones and 5power supply voltages.The LM41uses a ∆V be temperature sensing method.A differential voltage,repre-senting temperature,is digitized using a Sigma-Delta analog to digital converter.Internal scaling resistors allow direct measurement of the +1.6V,+2.5V,+5V,+3.3V and +12V power supply inputs.The digitized data can be retrieved over a simple single-wire interface called SensorPath.Sensor-Path has been defined by National Semiconductor and is optimized for hardware monitoring.National offers a royalty-free license in connection with its intellectual property rights in the SensorPath bus.The LM41has one address pin to allow up to two LM41s to be connected to one SensorPath bus.The physical interface of SensorPath’s SWD signal is identical to the familiar indus-try standard SMBus SMBDAT signal.The digital information is encoded in the pulse width of the signal being transmitted.Every bit can be synchronized by the master simplifying the implementation of the master when using a micro-controller.For micro-controller’s with greater functionality an asynchro-nous attention signal can be transmitted by the LM41to interrupt the micro-controller and notify it that temperature/voltage data has been updated in the readout registers.To optimize the LM41’s power consumption to the system requirements,the LM41has a shutdown mode and supports multiple conversion rates.1.1SensorPath BUS SWDSWD is the Single Wire Data line used for communication.SensorPath uses 3.3V single-ended signaling,with a pull-up resistor and open-drain low-side drive (see Figure 3).For timing purposes SensorPath is designed for capacitive loads (C L )of up to 400pF.Note that in many cases a 3.3V standby rail of the PC will be used as a power supply for both the sensor and the master.Logic high and low voltage levels for SWD are TTL compatible.The master may provide an inter-nal pull-up resistor.In this case the external resistor is not needed.The minimum value of the pull-up resistor must take into account the maximum allowable output load current of 4mA.1.2SensorPath BIT SIGNALINGSignals are transmitted over SensorPath using pulse-width encoding.There are five types of "bit signals":•Data Bit 0•Data Bit 1•Start Bit•Attention Request •ResetAll the "bit signals"involve driving the bus to a low level.The duration of the low level differentiates between the different "bit-signals".Each "bit signal"has a fixed pulse width.Sen-sorPath supports a Bus Reset Operation and Clock Training sequence that allows the slave device to synchronize its internal clock rate to the master.Since the LM41meets the ±15%timing requirements of SensorPath,the LM41does not require the Clock Training sequence and does not sup-port this feature.This section defines the "bit signal"behav-ior in all the modes.Please refer to the timing diagrams in the Electrical Characteristics section (Figure 1and Figure 2)while going through this section.Note that the timing dia-grams for the different types of "bit signals"are shown together to better highlight the timing relationships between them.However,the different types of "bit signals"appear on SWD at different points in time.These timing diagrams show the signals as driven by the master and the LM41slave as well as the signal as seen when probing SWD.Signal labels that begin with the label Mout_depict a drive by the master.20070307FIGURE 3.SensorPath SWD simplified schematic L M 41101.0Functional Description(Continued) Signal labels that begin with the label Slv_depict the drive by the LM41.All other signals show what would be seen when probing SWD for a particular function(e.g."Master Wr0"is the Master transmitting a Data Bit with the value of0).1.2.1Bus InactiveThe bus is inactive when the SWD signal is high for a period of at least t INACT.The bus is inactive between each"bit signal".1.2.2Data Bit0and1All Data Bit signal transfers are started by the master.A Data Bit0is indicated by a"short"pulse;a Data Bit1is indicated by a longer pulse.The direction of the bit is relative to the master,as follows:•Data Write-a Data Bit transferred from the master to the LM41.•Data Read-a Data Bit transferred from the LM41to the master.A master must monitor the bus as inactive before starting a Data Bit(Read or Write).A master initiates a data write by driving the bus active(low level)for the period that matches the data value(t Mtr0or t Mtr1 for a write of"0"or"1",respectively).The LM41will detect that the SWD becomes active within a period of t SFEdet,and will start measuring the duration that the SWD is active in order to detect the data value.A master initiates a data read by driving the bus for a period of t Mtr0.The LM41will detect that the SWD becomes active within a period of t SFEdet.For a data read of"0",the LM41 will not drive the SWD.For a data read of"1"the LM41will start within t SFEdet to drive the SWD low for a period of t SLout1.Both master and LM41must monitor the time at which the bus becomes inactive to identify a data read of"0" or"1".During each Data Bit,both the master and all the LM41s must monitor the bus(the master for Attention Request and Reset;the LM41s for Start Bit,Attention Request and Reset) by measuring the time SWD is active(low).If a Start Bit, Attention Requests or Reset"bit signal"is detected,the current"bit signal"is not treated as a Data Bit.Note that the bit rate of the protocol varies depending on the data transferred.Thus,the LM41has a value of"0"in reserved or unused register bits for bus bandwidth efficiency.1.2.3Start BitA master must monitor the bus as inactive before beginning a Start Bit.The master uses a Start Bit to indicate the beginning of a transfer.LM41s will monitor for Start Bits all the time,to allow synchronization of transactions with the master.If a Start Bit occurs in the middle of a transaction,the LM41being ad-dressed will abort the current transaction.In this case the transaction is not"completed"by the LM41(see Section1.3 "SensorPath Bus Transactions").During each Start Bit,both the master and all the LM41s must monitor the bus for Attention Request and Reset,bymeasuring the time SWD is active(low).If an AttentionRequest or Reset condition is detected,the current"bitsignal"is not treated as a Start Bit.The master may attemptto send the Start Bit at a later time.1.2.4Attention RequestThe LM41may initiate an Attention Request when the Sen-sorPath bus is inactive.Note that a Data Bit,or Start Bit,from the master may startsimultaneously with an Attention Request from the LM41.Inaddition,two LM41s may start an Attention Request simul-taneously.Due to its length,the Attention Request has pri-ority over any other"bit signal",except Reset.Conflict withData Bits and Start Bits are detected by all the devices,toallow the bits to be ignored and re-issued by their originator.The LM41will either check to see that the bus is inactivebefore starting an Attention Request,or start the AttentionRequest within the t SFEdet time interval after SWD becomesactive.The LM41will drive the signal low for t SLoutA time.After this,both the master and the LM41must monitor thebus for a Reset Condition.If a Reset condition is detected,the current"bit signal"is not treated as an Attention Request.After Reset,an Attention Request can not be sent before themaster has sent14Data Bits on the bus.See Section1.3.5for further details on Attention Request generation.1.2.5Bus ResetThe LM41issues a Reset at power up.The master must alsogenerate a Bus Reset at power-up for at least the minimumreset time,it must not rely on the LM41.SensorPath puts nolimitation on the maximum reset time of the master.Follow-ing a Bus Reset,the LM41may generate an Attention Re-quest only after the master has sent14Data Bits on the bus.See Section1.3.5for further details on Attention Requestgeneration.1.3SensorPath BUS TRANSACTIONSSensorPath is designed to work with a single master and upto seven slave devices.Each slave has a unique address.The LM41supports up to2device addresses that are se-lected by the state of the address pin ADD.The Register Setof the LM41is defined in Section2.0.1.3.1Bus Reset OperationA Bus Reset Operation is global on the bus and affects onlythe communication interface of all the devices connected toit.The Bus Reset operation does not affect either the con-tents of the device registers,or device operation,to theextent defined in LM41Register Set,see Section2.0.The Bus Reset operation is performed by generating a Resetsignal on the bus.The master must apply Reset after power-up,and before it starts operation.The Reset signal end willbe monitored by all the LM41s on the bus.After the Reset Signal the SensorPath specification requiresthat the master send a sequence of8Data Bits with a valueof"0",without a preceding Start Bit.This is required toenable slaves that"train"their clocks to the bit timing.TheLM41does not require nor does it support clock training.LM41111.0Functional Description(Continued)1.3.2Read TransactionDuring a read transaction,the master reads data from a register at a specified address within a slave.A read trans-action begins with a Start Bit and ends with an ACK bit,as shown in Figure 5.•Device Number This is the address of the LM41device accessed.Address "000"is a broadcast address and can be responded to by all the slave devices.The LM41ignores the broadcast address during a read transaction.•Internal Address The address of a register within the LM41that is read.•Read/Write (R/W)A "1"indicates a read transaction.•Data Bits During a read transaction the data bits are driven by the LM41.Data is transferred serially with the most significant bit first.This allows throughput optimiza-tion based on the information that needs to be read.The LM41supports 8-bit or 16-bit data fields,as de-scribed in Section 2.0"Register Set".•Even Parity (EP)This bit is based on all preceding bits (device number,internal address,Read/Write and data bits)and the parity bit itself.The parity -number of 1’s -of all the preceding bits and the parity bit must be even -i.e.,the result must be 0.During a read transaction,the EP bit is sent by the LM41to the master to allow the master to check the received data before using it.•Acknowledge (ACK)During a read transaction the ACK bit is sent by the master indicating that the EP bit was received and was found to be correct,when compared to the data preceding it,and that no conflict was detected on the bus (excluding Attention Request -see Section 1.3.5"Attention Request Transaction").A read transfer is considered "complete"only when the ACK bit is received.A transaction that was not positively acknowledged is not considered "complete"by the LM41and following are performed:—The BER bit in the LM41Device Status register is set —The LM41generates an Attention Request before,or together with the Start Bit of the next transactionA transaction that was not positively acknowledged is also not considered "complete"by the master (i.e.inter-nal operations related to the transaction are not per-formed).The transaction may be repeated by the master,after detecting the source of the Attention Request (the LM41that has a set BER bit in the Device Status regis-ter).Note that the SensorPath protocol neither forces,nor automates re-execution of the transaction by the master.The values of the ACK bit are:—1:Data was received correctly—0:An error was detected (no-acknowledge).1.3.3Write TransactionIn a write transaction,the master writes data to a register at a specified address in the LM41.A write transaction begins with a Start Bit and ends with an ACK Data Bit,as show in Figure 6.•Device Number This is the address of the slave device accessed.Address "000"is a broadcast address and is responded to by all the slave devices.The LM41re-sponds to broadcast messages to the Device Control Register.•Internal Address This is the register address in the LM41that will be written.•Read/Write (R/W)A "0"data bit directs a write transac-tion.20070308FIGURE 4.Bus Reset Transaction20070309FIGURE 5.Read Transaction,master reads data from LM41L M 41 121.0Functional Description(Continued)•Data Bits This is the data written to the LM41register, are driven by the master.Data is transferred serially with the most significant bit first.The number of data bits may vary from one address to another,based on the size of the register in the LM41.This allows throughput optimi-zation based on the information that needs to be written.The LM41supports8-bit or16-bit data fields,as de-scribed in Section2.0"Register Set".•Even Parity(EP)This data bit is based on all preceding bits(Device Number,Internal Address,Read/Write and Data bits)and the Even Parity bit itself.The parity(num-ber of1’s)of all the preceding bits and the parity bit must be even-i.e.the result must be0.During a write trans-action,the EP bit is sent by the master to the LM41to allow the LM41to check the received data before using it.•Acknowledge(ACK)During the write transaction the ACK bit is sent by the LM41indicating to the master that the EP was received and was found correct,and that no conflict was detected on the bus(excluding Attention Request-see Section1.3.5"Attention Request Transac-tion").A write transfer is considered"completed"only when the ACK bit is generated.A transaction that was not positively acknowledged is not considered complete by the LM41(i.e.internal operation related to the transaction are not performed)and the following are performed:—The BER bit in the LM41Device Status register is set;—The LM41generates an Attention Request before,or together with the Start Bit of the next transactionA transaction that was not positively acknowledged is also not considered"complete"by the master(i.e.inter-nal operations related to the transaction are not per-formed).The transaction may be repeated by the master, after detecting the source of the Attention Request(the LM41that has a set BER bit in the Device Status regis-ter).Note that the SensorPath protocol neither forces,nor automates re-execution of the transaction by the master. The values of the ACK bit are:—1:Data was received correctly;—0:An error was detected(no-acknowledge).1.3.4Read and Write Transaction ExceptionsThis section describes master and LM41handling of special bus conditions,encountered during either Read or Write transactions.If an LM41receives a Start Bit in the middle of a transaction, it aborts the current transaction(the LM41does not"com-plete"the current transaction)and begins a new transaction. Although not recommend for SensorPath normal operation, this situation is legitimate,therefore it is not flagged as an error by the LM41and Attention Request is not generated in response to it.The master generating the Start Bit,is re-sponsible for handling the not"complete"transaction at a "higher level".If LM41receives more than the expected number of data bits (defined by the size of the accessed register),it ignores the unnecessary bits.In this case,if both master and LM41 identify correct EP and ACK bits they"complete"the trans-action.However,in most cases,the additional data bits differ from the correct EP and ACK bits.In this case,both the master and the LM41do not"complete"the transaction.In addition,the LM41performs the following:•the BER bit in the LM41Device Status register is set •the LM41generates an Attention RequestIf the LM41receives less than the expected number of data bits(defined by the size of the accessed register),it waits indefinitely for the missing bits to be sent by the master.If then the master sends the missing bits,together with the correct EP/ACK bits,both master and LM41"complete"the transaction.However,if the master starts a new transaction generating a Start Bit,the LM41aborts the current transac-tion(the LM41does not"complete"the current transaction) and begins the new transaction.The master is not notified by the LM41of the incomplete transaction.1.3.5Attention Request TransactionAttention Request is generated by the LM41when it needs the attention of the master.The master and all LM41s must monitor the Attention Request to allow bit re-sending in case of simultaneous start with a Data Bit or Start Bit transfer. Refer to the"Attention Request"section,Section1.2.4in the "Bit Signaling"portion of the data sheet.The LM41will generate an Attention Request using the following rules:1.A Function event that sets the Status Flag has occurredand Attention Request is enabled and2.The"physical"condition for an Attention Request is met(i.e.,the bus is inactive),and3.At the first time2is met after1occurred,there has notbeen an Attention request on the bus since a read of the Device Status register,or since a Bus Reset.OR1.A bus error event occurred,and2.the"physical"condition for an Attention Request is met(i.e.,the bus is inactive),and3.At the first time2.is met after1occurred,there has notbeen a Bus Reset.20070310FIGURE6.Write Transaction,master write data to LM41LM4113。
Tip41三极管参数——龙洞买野网
Symbol VCEO(sus)
ICEO ICES
IEBO hFE VCE(sat) VBE(on) fT hfe
ORDERING INFORMATION Device
TIP41 TIP41G
TIP41A TIP41AG
TIP41B TIP41BG
TIP41C TIP41CG
TIP42 TIP42G
DC Current Gain (IC = 0.3 Adc, VCE = 4.0 Vdc) DC Current Gain (IC = 3.0 Adc, VCE = 4.0 Vdc)
Collector-Emitter Saturation Voltage (IC = 6.0 Adc, IB = 600 mAdc) Base-Emitter On Voltage (IC = 6.0 Adc, VCE = 4.0 Vdc) DYNAMIC CHARACTERISTICS
6 AMPERE COMPLEMENTARY SILICON
POWER TRANSISTORS 40-60-80-100 VOLTS,
65 WATTS
MARKING DIAGRAM
4
1 2 3
TO-220AB CASE 221A
STYLE 1
TIP4xxG AYWW
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Characteristic
OFF CHARACTERISTICS
Collector-Emitter Sustaining Voltage (Note 2) (IC = 30 mAdc, IB = 0)
Vdc
lis8512datasheet
莱士电子科技有限公司
6/7
LIS-DS-8512-V1.1
LIS8512
两绕组-初级侧控制 LED 驱动开关
封装信息
修改历史
版本 V1.1
日期 Dec, 2012
状态描述 最大功率应用,描述变更
声明: 无锡莱士电子科技股份有限公司保留本 DATA SHEET 变更权。客户在下单前应获取最新版本资料,并验证 相关信息是否完整和最新。
式。当错误条件消失,系统自动恢复正常工作状 态。
CS 开路保护 LIS8512 集成了 CS 引脚的开路保护功能,当芯片 的 CS 引脚开路, 开关管会关断,进入自动重起保 护模式。当错误条件消失,系统自动恢复正常工作 状态。
振荡器 LIS8512 有一个振荡频率为 2MHz 的内部振荡器, 其输出的时钟作为系统的同步时钟,芯片开关管 ON/OFF 的导 通 周 期 和 这 个 基 本 频 率 的 周 期 成 正 比。
Min. Typ.
-
200
-
110
8.0
8.8
14.8 15.6
26
28
31
33
1.85
2
65
70
8.05 8.75
-
±6
-
450
970 1000
-
8
-
150
100
10
700
11.5
50 60
Max.
250 150 9.6 16.4 30 35
1
Unit
采样和时序
tLEB Vth tSS
保护
OTP OOP OSP
内部 MOS
BVDSS IDSS RDS(ON) ID Tr Tf
UCT41XX系列系列系列系列 1W LED恒流驱动器恒流驱动器恒流驱动
SOT-89封装TO-252封装恒定电流(mA)UCT4127A-M3 UCT4127A-T 270 UCT4130A-M3 UCT4130A-T 300 UCT4135A-M3UCT4135A-T350引脚排列图UCT41XX 系列芯片是专为驱动1W LED而设计的低压差线性电流调整器,在额定的工作电压范围内,具有恒定输出电流的能力。
UCT41XX 采用了先进的Bi-CMOS工艺,从而实现了较低的静态电流和低工作压差。
• 适用于以1W白光LED为光源的照明类产品;特点• 无需外部元器件;• 恒定输出电流;• 输出短路/开路保护电路; • 低工作压差; • 低静态电流;• 电源电压范围:2.7V ~6V; • 内部过热保护;• 2KV HSM ESD 保护; • 先进的Bi-CMOS 工艺;• 封装尺寸:SOT89-3、TO-252。
用途UCT41XX 系列 1W LED 恒流驱动器选型指南功能块框图极限参数参数符号极限值单位输入电压V DD-0.3~7 V输出电压V LEDM-0.3~7 V最大工作结温Tj max150 ℃存贮温度T stg-40~+150 ℃焊接温度和时间T solder260℃, 10s推荐工作条件参数最小典型最大单位电源电压 2.7 6 V输出电流400 mA 工作环境温度-40 85 ℃主要参数及工作特性V DD =3.7V,T A = 25℃,无负载。
(特殊说明除外)测试条件数值单位符号含义最小典型最大I SINK输出电流V OUT=0.2V,UCT4135315 350 390 mA负载线性度V OUT=0.2~1V 3 mA/V电源电压调整率V DD=3V~6V,V OUT=0.2V3 mA /VV OUTL输出压差Iout = 90% x I O @V OUT=200mV130 m VI DD电源电流90 µAVout :芯片OUT管脚对地的电压。
PM39LV512中文资料
GENERAL DESCRIPTION
The Pm39LV512/010/020/040 are 512 Kbit/1 Mbit/2 Mbit/4 Mbit 3.0 Volt-only Flash Memories. These devices are designed to use a single low voltage, range from 2.7 Volt to 3.6 Volt, power supply to perform read, erase and program operations. The 12.0 Volt VPP power supply for program and erase operations are not required. The devices can be programmed in standard EPROM programmers as well.
• Hardware Data Protection
• Automatic Erase and Byte Program - Build-in automatic program verification - Typical 16 µs/byte programming time - Typical 55 ms sector/block/chip erase time
The memory array of Pm39LV512 is divided into uniform 4 Kbyte sectors for data or code storage. The memory arrays of Pm39LV010/020/040 are divided into uniform 4 Kbyte sectors or uniform 64 Kbyte blocks (sector group consists of sixteen adjacent sectors). The sector or block erase feature allows users to flexibly erase a memory area as small as 4 Kbyte or as large as 64 Kbyte by one single erase operation without affecting the data in others. The chip erase feature allows the whole memory array to be erased in one single erase operation. The devices can be programmed on a byte-by-byte basis after performing the erase operation.
国产DIRIS A41说明书
仪表可直接取代常规电力变送器、测量指示仪表以及相关的辅助单元,模
块化的 结构 设计, 用户 可根 据 实 际 需 求选 择 最 为 经 济的 功 能配 置 , 具有极 高的
性能价 格比 。
仪表可广泛应用于能源管理系统、供配电网自动化、小区电力监控、成套
设备开 关柜 等场合 ,具 有安装 方便 、接线简 单 、维护方 便 ,工 程量 小、现 场可
的额定输入电压,否则应考虑使用PT,在电压输入端须安装1A 保险丝;输入
电流 应不高于产 品的额定输 入电流,否 则应考虑使 用外部CT 。
3
湘湖 DIRIS A41多功能网络电力仪表使用说明书
总 功率 有功 3 .300kW 无功0.002kv ar 视 在 3 .3 0 0 kVA
总 功率 有功 3.300 kW 无功 0.0 02k var 视在 3.3 00k VA
4
6
湘湖 DIRIS A41多功能网络电力仪表使用说明书
湘湖 DIRIS A41多功能网络电力仪表使用说明书
“显示方式”菜单 参数值/对应字符 0 循环显示
1 相电压
示例
/
相 电压 UA 220.0 V UB 22 0. 1 V UC 219 . 8 V
2 线电压
线 电压 UA B 38 0.0 V UB C 3 8 0.1 V UCA 37 9.8 V
仪 表有多种 扩展功 能模 块可供选 择 :4路模拟量( 0~2 0 mA / 4~20 mA )输出
可实现 电量 的 变送 输出 功能 ; 4路 开 关 量 输 入 和4路开 关 量 输 出 可 实 现 本地或 远
程的开 关信 号监 测 和控 制输出 功 能 ( “ 遥 信 ” 和 “ 遥 控 ” 功能 ) 。
电子负载仪IT8512说明书
PMC-851X综合保护测控装置用户说明书_V1.5_131014
DAC8512EPZ资料
LINEARITY ERROR – LSB
0.5 0.25 0 –0.25 –0.5 –0.75 –1.0 0 1024 2048 3072 4096 DIGITAL INPUT CODE – Decimal
Linearity Error vs. Digital Input Code
Hale Waihona Puke REV. AInformation furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 617/329-4700 World Wide Web Site: Fax: 617/326-8703 © Analog Devices, Inc., 1996
NOTES 1 All input control signals are specified with tr = tf = 5 ns (10% to 90% of +5 V) and timed from a voltage level of 1.6 V. 2 1 LSB = 1 mV for 0 V to +4.095 V output range. 3 Includes internal voltage reference error. 4 These parameters are guaranteed by design and not subject to production testing. 5 The settling time specification does not apply for negative going transitions within the last 6 LSBs of ground. Some devices exhibit double the typical settling time in this 6 LSB region. Specifications subject to change without notice.
IS61LV51216中文资料
FUNCTIONAL BLOCK DIAGRAM
Write
WE CE OE LB UB
XHXXX
H
L
H
X
X
X
L
X
H
H
H
L
L
L
H
H
L
L
H
L
H
L
L
L
L
L
L
X
L
H
L
L
X
H
L
L
L
X
L
L
ISSI ®
I/O PIN
I/O0-I/O7
I/O8-I/O15
High-Z
High-Z
High-Z High-Z
High-Z High-Z
DOUT High-Z DOUT
GND ≤ VIN ≤ VDD
ILO
Output Leakage
GND ≤ VOUT ≤ VDD Outputs Disabled
Notes: 1. VIL (min.) = –2.0V for pulse width less than 10 ns.
Com. Ind. Auto.
Com. Ind. Auto.
DESCRIPTION The ISSI IS61/64LV51216 is a high-speed, 8M-bit static
40系列IC资料大全
40系列IC资料大全型号器件名称厂牌备注CD4000 双3输入端或非门+单非门 TICD4001 四2输入端或非门 HIT/NSC/TI/GOLCD4002 双4输入端或非门 NSCCD4006 18位串入/串出移位寄存器 NSCCD4007 双互补对加反相器 NSCCD4008 4位超前进位全加器 NSCCD4009 六反相缓冲/变换器 NSCCD4010 六同相缓冲/变换器 NSCCD4011 四2输入端与非门 HIT/TICD4012 双4输入端与非门 NSCCD4013 双主-从D型触发器 FSC/NSC/TOSCD4014 8位串入/并入-串出移位寄存器 NSCCD4015 双4位串入/并出移位寄存器 TICD4016 四传输门 FSC/TICD4017 十进制计数/分配器 FSC/TI/MOTCD4018 可预制1/N计数器 NSC/MOTCD4019 四与或选择器 PHICD4020 14级串行二进制计数/分频器 FSCCD4021 08位串入/并入-串出移位寄存器 PHI/NSCCD4022 八进制计数/分配器 NSC/MOTCD4023 三3输入端与非门 NSC/MOT/TICD4024 7级二进制串行计数/分频器 NSC/MOT/TICD4025 三3输入端或非门 NSC/MOT/TICD4026 十进制计数/7段译码器 NSC/MOT/TICD4027 双J-K触发器 NSC/MOT/TICD4028 BCD码十进制译码器 NSC/MOT/TICD4029 可预置可逆计数器 NSC/MOT/TICD4030 四异或门 NSC/MOT/TI/GOLCD4031 64位串入/串出移位存储器 NSC/MOT/TICD4032 三串行加法器 NSC/TICD4033 十进制计数/7段译码器 NSC/TICD4034 8位通用总线寄存器 NSC/MOT/TICD4035 4位并入/串入-并出/串出移位寄存 NSC/MOT/TI CD4038 三串行加法器 NSC/TICD4040 12级二进制串行计数/分频器 NSC/MOT/TICD4041 四同相/反相缓冲器 NSC/MOT/TICD4042 四锁存D型触发器 NSC/MOT/TICD4043 4三态R-S锁存触发器("1"触发) NSC/MOT/TI CD4044 四三态R-S锁存触发器("0"触发) NSC/MOT/TI CD4046 锁相环 NSC/MOT/TI/PHICD4047 无稳态/单稳态多谐振荡器 NSC/MOT/TICD4048 4输入端可扩展多功能门 NSC/HIT/TICD4049 六反相缓冲/变换器 NSC/HIT/TICD4050 六同相缓冲/变换器 NSC/MOT/TICD4051 八选一模拟开关 NSC/MOT/TICD4052 双4选1模拟开关 NSC/MOT/TICD4053 三组二路模拟开关 NSC/MOT/TICD4054 液晶显示驱动器 NSC/HIT/TICD4055 BCD-7段译码/液晶驱动器 NSC/HIT/TICD4056 液晶显示驱动器 NSC/HIT/TICD4059 “N”分频计数器 NSC/TICD4060 14级二进制串行计数/分频器 NSC/TI/MOTCD4063 四位数字比较器 NSC/HIT/TICD4066 四传输门 NSC/TI/MOTCD4067 16选1模拟开关 NSC/TICD4068 八输入端与非门/与门 NSC/HIT/TICD4069 六反相器 NSC/HIT/TICD4070 四异或门 NSC/HIT/TICD4071 四2输入端或门 NSC/TICD4072 双4输入端或门 NSC/TICD4073 三3输入端与门 NSC/TICD4075 三3输入端或门 NSC/TICD4076 四D寄存器CD4077 四2输入端异或非门 HITCD4078 8输入端或非门/或门CD4081 四2输入端与门 NSC/HIT/TICD4082 双4输入端与门 NSC/HIT/TICD4085 双2路2输入端与或非门CD4086 四2输入端可扩展与或非门CD4089 二进制比例乘法器CD4093 四2输入端施密特触发器 NSC/MOT/STCD4094 8位移位存储总线寄存器 NSC/TI/PHICD4095 3输入端J-K触发器CD4096 3输入端J-K触发器CD4097 双路八选一模拟开关CD4098 双单稳态触发器 NSC/MOT/TICD4099 8位可寻址锁存器 NSC/MOT/STCD40100 32位左/右移位寄存器CD40101 9位奇偶较验器CD40102 8位可预置同步BCD减法计数器CD40103 8位可预置同步二进制减法计数器CD40104 4位双向移位寄存器CD40105 先入先出FI-FD寄存器CD40106 六施密特触发器反相器 NSC\TICD40107 双2输入端与非缓冲/驱动器 HAR\TICD40108 4字×4位多通道寄存器CD40109 四低-高电平位移器CD40110 十进制加/减,计数,锁存,译码驱动 STCD40147 10-4线编码器 NSC\MOTCD40160 可预置BCD加计数器 NSC\MOTCD40161 可预置4位二进制加计数器 NSC\MOTCD40162 BCD加法计数器 NSC\MOTCD40163 4位二进制同步计数器 NSC\MOTCD40174 六锁存D型触发器 NSC\TI\MOTCD40175 四D型触发器 NSC\TI\MOTCD40181 4位算术逻辑单元/函数发生器CD40182 超前位发生器CD40192 可预置BCD加/减计数器(双时钟) NSC\TICD40193 可预置4位二进制加/减计数器 NSC\TICD40194 4位并入/串入-并出/串出移位寄存 NSC\MOT CD40195 4位并入/串入-并出/串出移位寄存 NSC\MOT CD40208 4×4多端口寄存器CD4501 4输入端双与门及2输入端或非门CD4502 可选通三态输出六反相/缓冲器CD4503 六同相三态缓冲器CD4504 六电压转换器CD4506 双二组2输入可扩展或非门CD4508 双4位锁存D型触发器CD4510 可预置BCD码加/减计数器CD4511 BCD锁存,7段译码,驱动器CD4512 八路数据选择器CD4513 BCD锁存,7段译码,驱动器(消隐) CD4514 4位锁存,4线-16线译码器CD4515 4位锁存,4线-16线译码器CD4516 可预置4位二进制加/减计数器CD4517 双64位静态移位寄存器CD4518 双BCD同步加计数器CD4519 四位与或选择器CD4520 双4位二进制同步加计数器CD4521 24级分频器CD4522 可预置BCD同步1/N计数器CD4526 可预置4位二进制同步1/N计数器CD4527 BCD比例乘法器CD4528 双单稳态触发器CD4529 双四路/单八路模拟开关CD4530 双5输入端优势逻辑门CD4531 12位奇偶校验器CD4532 8位优先编码器CD4536 可编程定时器CD4538 精密双单稳CD4539 双四路数据选择器CD4541 可编程序振荡/计时器CD4543 BCD七段锁存译码,驱动器CD4544 BCD七段锁存译码,驱动器CD4547 BCD七段译码/大电流驱动器CD4549 函数近似寄存器CD4551 四2通道模拟开关CD4553 三位BCD计数器CD4555 双二进制四选一译码器/分离器CD4556 双二进制四选一译码器/分离器CD4558 BCD八段译码器CD4560 "N"BCD加法器CD4561 "9"求补器CD4573 四可编程运算放大器CD4574 四可编程电压比较器CD4575 双可编程运放/比较器CD4583 双施密特触发器CD4584 六施密特触发器CD4585 4位数值比较器CD4599 8位可寻址锁存器CD22100 4×4×1交*点开关function forumhottag_callback(data){ tags = data; }。
艾特顿 198556 产品说明书
Eaton 198556Eaton Moeller® series Rapid Link - Speed controller, 4.3 A, 1.5 kW, Sensor input 4, 400/480 V AC, AS-Interface®, S-7.4 for 31 modules, HAN Q5General specificationsEaton Moeller® series Rapid Link Speed controller198556RASP5-4404A31-5120000S14015081964314157 mm 270 mm 220 mm 3.41 kgUL approval CE RoHSIEC/EN 61800-5-1 UL 61800-5-1Product NameCatalog NumberModel CodeEANProduct Length/Depth Product Height Product Width Product Weight Certifications Catalog Notes can be switched over from U/f to (vector) speed control Connection of supply voltage via adapter cable on round or flexible busbar junction Diagnostics and480 VIs the panel builder's responsibility. The specifications for the switchgear must be observed.480 V AC, 3-phase400 V AC, 3-phaseMeets the product standard's requirements.1.5 kW500 VMeets the product standard's requirements.-40 °C380 VInternal DC linkPC connectionKey switch position AUTOSelector switch (Positions: REV - OFF - FWD)Two sensor inputs through M12 sockets (max. 150 mA) for quick stop and interlocked manual operationThermo-click with safe isolationKey switch position OFF/RESETKey switch position HANDPTC thermistor monitoringFour fixed speedsIGBT inverterControl unit0 Hz200 %, IH, max. starting current (High Overload), For 2 seconds every 20 seconds, Power section Electromagnetic compatibility (EMC)Configuration to Rockwell PLC for Rapid LinkGeneration Change RA-SP to RASP5Generation change from RA-SP to RASP 4.0Connecting drives to generator suppliesGeneration change RAMO4 to RAMO5Generation change from RA-MO to RAMO 4.0Generation Change RASP4 to RASP5Rapid Link 5 - brochureDA-SW-drivesConnect - InstallationshilfeDA-SW-drivesConnect - installation helpDA-SW-USB Driver PC Cable DX-CBL-PC-1M5DA-SW-Driver DX-CBL-PC-3M0DA-SW-drivesConnect USB Driver DX-COM-PCKITDA-SW-USB Driver DX-COM-STICK3-KITDA-SW-drivesConnectMaterial handling applications - airports, warehouses and intra-logisticsProduct Range Catalog Drives EngineeringProduct Range Catalog Drives Engineering-ENDA-DC-00004184.pdfDA-DC-00004514.pdfDA-DC-00003964.pdfDA-DC-00004508.pdfeaton-bus-adapter-rapidlink-speed-controller-dimensions-003.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-002.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions-004.eps eaton-bus-adapter-rapidlink-speed-controller-dimensions.epsETN.RASP5-4404A31-5120000S1.edzIL034085ZUMains voltage - max10.11 Short-circuit ratingRated operational voltage10.4 Clearances and creepage distancesOutput at quadratic load at rated output voltage - max Output voltage - max10.2.3.1 Verification of thermal stability of enclosures Ambient storage temperature - minMains voltage - minFitted with:Output frequency - minStarting current - max Application notes BrochuresCatalogs Certification reports DrawingseCAD model Installation instructions10 kA40 °CAS-Interface2 HP500 Hz8 kHz, 4 - 32 kHz adjustable, fPWM, Power section, Main circuitParameterization: drivesConnectDiagnostics and reset on device and via AS-Interface Parameterization: FieldbusParameterization: KeypadParameterization: drivesConnect mobile (App)-10 °C≤ 0.6 A (max. 6 A for 120 ms), Actuator for external motor brakeDoes not apply, since the entire switchgear needs to be evaluated.4.3 ADoes not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Speed controller Rapid Link 5MN034004EN MZ040046_EN MN040003_ENramo5_v19.dwg rasp5_v19.stpRated conditional short-circuit current (Iq)Ambient operating temperature - maxCommunication interfaceAssigned motor power at 115/120 V, 60 Hz, 1-phase Output frequency - maxSwitching frequencyFeaturesAmbient operating temperature - minBraking currentNumber of HW-interfaces (serial TTY)10.6 Incorporation of switching devices and components Nominal output current I2N10.2.6 Mechanical impact10.3 Degree of protection of assembliesProduct categoryRadio interference class Installation videos Manuals and user guidesmCAD modelC1: for conducted emissions onlyC2, C3: depending on the motor cable length, the connected load, and ambient conditions. External radio interference suppression filters (optional) may be necessary.Heat dissipation capacity Pdiss0 WRated control voltage (Uc)24 V DC (-15 %/+20 %, external via AS-Interface® plug) 400/480 V AC (external brake 50/60 Hz)Assigned motor power at 460/480 V, 60 Hz, 3-phase2 HPNumber of HW-interfaces (RS-422)Mains current distortion120 %ProtocolAS-Interface profile cable: S-7.4 for 31 modulesASI10.9.2 Power-frequency electric strengthIs the panel builder's responsibility.Overvoltage categoryIIIDegree of protectionIP65NEMA 12Ambient storage temperature - max70 °CRated impulse withstand voltage (Uimp)2000 VConnectionPlug type: HAN Q5Overload currentFor 60 s every 600 sAt 40 °CFunctionsFor actuation of motors with mechanical brakeOutput at linear load at rated output voltage - max1.5 kWMains voltage tolerance380 - 480 V (-10 %/+10 %, at 50/60 Hz)Leakage current at ground IPE - max3.5 mAConverter typeU converter10.2.2 Corrosion resistanceMeets the product standard's requirements.Supply frequency50/60 Hz10.2.4 Resistance to ultra-violet (UV) radiationMeets the product standard's requirements.10.2.7 InscriptionsMeets the product standard's requirements.Shock resistance15 g, Mechanical, According to IEC/EN 60068-2-27, 11 ms, Half-sinusoidal shock 11 ms, 1000 shocks per shaftApplication in domestic and commercial area permittedYesNumber of inputs (analog)Number of phases (output)310.12 Electromagnetic compatibilityIs the panel builder's responsibility. The specifications for the switchgear must be observed.10.2.5 LiftingDoes not apply, since the entire switchgear needs to be evaluated.Number of HW-interfaces (RS-485)1Number of HW-interfaces (industrial ethernet)Efficiency98 % (η)System configuration typeCenter-point earthed star network (TN-S network)AC voltagePhase-earthed AC supply systems are not permitted.10.8 Connections for external conductorsIs the panel builder's responsibility.ProtectionFinger and back-of-hand proof, Protection against direct contact (BGV A3, VBG4)Braking voltage400/480 V AC -15 % / +10 %, Actuator for external motor brakeApplication in industrial area permittedYesClimatic proofing< 95 %, no condensationIn accordance with IEC/EN 5017810.9.3 Impulse withstand voltageIs the panel builder's responsibility.Overload current IL at 150% overload6.5 AInput current ILN at 150% overload4.1 ANumber of HW-interfaces (RS-232)Number of inputs (digital)4Current limitationAdjustable, motor, main circuit0.4 - 4.3 A, motor, main circuitCable lengthC2 ≤ 5 m, maximum motor cable lengthC1 ≤ 1 m, maximum motor cable lengthC3 ≤ 25 m, maximum motor cable length10.5 Protection against electric shockDoes not apply, since the entire switchgear needs to be evaluated.Mounting positionVerticalMains switch-on frequencyMaximum of one time every 60 seconds10.13 Mechanical functionThe device meets the requirements, provided the information in the instruction leaflet (IL) is observed.10.9.4 Testing of enclosures made of insulating materialIs the panel builder's responsibility.Heat dissipation per pole, current-dependent Pvid0 WElectromagnetic compatibility1st and 2nd environments (according to EN 61800-3)Resolution0.1 Hz (Frequency resolution, setpoint value)Assigned motor power at 460/480 V, 60 Hz2 HPRelative symmetric net voltage tolerance10 %Rated operational current (Ie)4.3 A at 150% overload (at an operating frequency of 8 kHz and an ambient air temperature of +40 °C)Number of outputs (analog)Rated operational power at 380/400 V, 50 Hz, 3-phase1.5 kWNumber of HW-interfaces (USB)Operating modeU/f controlBLDC motorsSensorless vector control (SLV)Synchronous reluctance motorsPM and LSPM motorsRated frequency - min45 HzDelay time< 10 ms, Off-delay< 10 ms, On-delayNumber of outputs (digital)Power consumption46 W10.2.3.2 Verification of resistance of insulating materials to normal heatMeets the product standard's requirements.10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effectsMeets the product standard's requirements.Number of HW-interfaces (other)1Rated frequency - max66 HzVibrationResistance: According to IEC/EN 60068-2-6Resistance: 57 Hz, Amplitude transition frequency on accelerationResistance: 10 - 150 Hz, Oscillation frequencyResistance: 6 Hz, Amplitude 0.15 mmShort-circuit protection (external output circuits)Type 1 coordination via the power bus' feeder unit, Main circuit10.7 Internal electrical circuits and connectionsIs the panel builder's responsibility.Braking torque≤ 30 % (I/Ie)Adjustable to 100 % (I/Ie), DC - Main circuitRelative symmetric net frequency tolerance10 %10.10 Temperature riseThe panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Number of HW-interfaces (parallel)Assigned motor power at 230/240 V, 60 Hz, 1-phase2 HPInterfacesMax. total power consumption from AS-Interface® power supply unit (30 V): 190 mANumber of slave addresses: 31 (AS-Interface®) Specification: S-7.4 (AS-Interface®)Number of phases (input)3Eaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All Rights Reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmedia32.3 W at 25% current and 0% speed 33.2 W at 25% current and 50% speed 35.2 W at 50% current and 90% speed 36.2 W at 50% current and 0% speed 37.6 W at 50% current and 50% speed 46.3 W at 100% current and 90% speed 48.7 W at 100% current and 0% speed 48.7 W at 100% current and 50% speed 0Max. 2000 mAbove 1000 m with 1 % performance reduction per 100 mHeat dissipation at current/speed Number of interfaces (PROFINET)Altitude。
AD8512TRZ-EP JFET 操作放大器说明书
AD8512TRZ-EPPrecision, Very Low Noise, Low Input Bias Current,Wide Bandwidth JFET Operational AmplifierEnhanced ProductAD8512-EPRev. 0 Document FeedbackInformation furnished by Analog Devices is believed to be accurate and reliable. However , noresponsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. T rademarks and registered trademarks are the property of their respective owners.One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support FEATURESFast settling time: 500 ns to 0.1%Low offset voltage: 1.0 mV maximum at V S = ±15 V Low offset voltage drift: 1.7 µV/°C typicalLow input bias current: 25 pA typical at V S = ±15 V Dual-supply operation: ±5 V to ±15 VLow noise: 8.0 nV/√Hz typical at f = 1 kHz Low distortion: 0.0005% No phase reversal Unity gain stableENHANCED PRODUCT FEATURESSupports defense and aerospace applications (AQEC standard)Military temperature range (−55°C to +125°C) Controlled manufacturing baseline 1 assembly/test site 1 fabrication siteProduct change notificationQualification data available on requestAPPLICATIONSInstrumentation Multipole filtersPrecision current measurementPhotodiode amplifiers Military communication AvionicsPIN CONFIGURATION–IN A +IN A V –V+–IN B+IN B17170-002Figure 1.GENERAL DESCRIPTIONThe AD8512-EP is a dual-precision JFET amplifier that features low offset voltage, input bias current, input voltage noise, and input current noise.The combination of low offsets, low noise, and very low input bias currents makes these amplifiers especially suitable for high impedance sensor amplification and precise currentmeasurements using shunts. The combination of dc precision, low noise, and fast settling time results in superior accuracy in flight instruments, electronic measurement, and aviation equipment. Unlike many competitive amplifiers, the AD8512-EP maintains its fast settling performance even with substantial capacitive loads. Unlike many older JFET amplifiers, the AD8512-EP does not suffer from output phase reversal wheninput voltages exceed the maximum common-mode voltage range.Fast slew rate and great stability with capacitive loads make the AD8512-EP suitable for high performance filters. Low input bias currents, low offset, and low noise result in a wide dynamic range of photodiode amplifier circuits. Low noise and distortion, high output current, and excellent speed make the AD8512-EP a great choice for military communication applications. The AD8512-EP is available in an 8-lead narrow SOIC_N package. The AD8512-EP is specified over a military temperature range of −55°C to +125°C. Additional application and technical information can be found in the AD8512 data sheet.AD8512-EPEnhanced ProductRev. 0 | Page 2 of 7TABLE OF CONTENTSFeatures .............................................................................................. 1 Enhanced Product Features ............................................................ 1 Appl ications ....................................................................................... 1 Pin Configuration ............................................................................. 1 General Description ......................................................................... 1 Revision History ............................................................................... 2 Specifications ..................................................................................... 3 Electrical Characteristics . (4)Absolute Maximum Ratings ............................................................5 Thermal Resistance .......................................................................5 ESD Caution...................................................................................5 Typical Performance Characteristics ..............................................6 Outline Dimensions ..........................................................................7 Ordering Guide .. (7)REVISION HISTORY8/2018—Revision 0: Initial VersionEnhanced Product AD8512-EP SPECIFICATIONSV S = ±5 V, V CM = 0 V, T A = 25°C, unless otherwise noted.Table 1.Parameter Symbol Test Conditions/Comments Min Typ Max Unit INPUT CHARACTERISTICSOffset Voltage V OS0.1 0.9 mV−55°C < T A < +125°C 1.8 mVInput Bias Current I B21 75 pA−55°C < T A < +85°C 0.7 nA−55°C < T A < +125°C 7.5 nAInput Offset Current I OS 5 50 pA−55°C < T A < +85°C 0.3 nA−55°C < T A < +125°C 0.5 nAInput CapacitanceDifferential 12.5 pF Common Mode 11.5 pFInput Voltage Range −2.0 +2.5 V Common-Mode Rejection Ratio CMRR V CM = −2.0 V to +2.5 V 86 100 dBLarge-Signal Voltage Gain A VO R L = 2 kΩ, V O = −3 V to +3 V 65 107 V/mV Offset Voltage Drift (T C V OS) ΔV OS/ΔT 1.7 12 µV/°C OUTPUT CHARACTERISTICSOutput Voltage High V OH R L = 10 kΩ 4.1 4.3 VR L = 2 kΩ 3.9 4.2 VR L = 600 Ω 3.7 4.1 VOutput Voltage Low V OL R L = 10 kΩ, −55°C < T A < +125°C −4.9 −4.7 VR L = 2 kΩ, −55°C < T A < +125°C −4.9 −4.5 VR L = 600 Ω, −55°C < T A < +125°C −4.8 −4.2 VOutput Current I OUT ±40 ±54 mA POWER SUPPLYPower Supply Rejection Ratio PSRR V S = ±4.5 V to ±18 V 86 130 dB Supply Current/Amplifier I SY V O = 0 V 2.0 2.3 mA−55°C < T A < +125°C 2.5 mA DYNAMIC PERFORMANCESlew Rate SR R L = 2 kΩ 20 V/µs Gain Bandwidth Product GBP 8 MHz Settling Time t S To 0.1%, 0 V to 4 V step, G = +1 0.4 µsTotal Harmonic Distortion (THD) + Noise THD + N 1 kHz, G = +1, R L = 2 kΩ 0.0005 % Phase Margin φM 44.5 Degrees NOISE PERFORMANCEVoltage Noise Density e n f = 10 Hz 34 nV/√Hzf = 100 Hz 12 nV/√Hzf = 1 kHz 8.0 10 nV/√Hzf = 10 kHz 7.6 nV/√Hz Peak-to-Peak Voltage Noise e n p-p 0.1 Hz to 10 Hz bandwidth 2.4 5.2 µV p-pRev. 0 | Page 3 of 7AD8512-EPEnhanced ProductRev. 0 | Page 4 of 7ELECTRICAL CHARACTERISTICSV S = ±15 V , V CM = 0 V , T A = 25°C, unless otherwise noted. Table 2.ParameterSymbol Test Conditions/Comments Min Typ Max Unit INPUT CHARACTERISTICS Offset Voltage V OS0.1 1.0 mV−55°C < T A < +125°C 1.8 mV Input Bias Current I B25 80 pA −55°C < T A < +85°C 0.7 nA−55°C < T A < +125°C 10 nA Input Offset Current I OS6 75 pA −55°C < T A < +85°C 0.3 nA−55°C < T A < +125°C 0.5 nA Input Capacitance Differential 12.5 pF Common Mode11.5pF Input Voltage Range−13.5 +13.0 V Common-Mode Rejection Ratio CMRR V CM = −12.5 V to +12.5 V 86 108 dB Large-Signal Voltage Gain A VO R L = 2 kΩ, V CM = 0 V, V O = −13.5 V to +13.5 V 115 196 V/mV Offset Voltage DriftΔV OS /ΔT 1.7 12 µV/°C OUTPUT CHARACTERISTICSOutput Voltage High V OH R L = 10 kΩ 14.0 14.2 V R L = 2 kΩ 13.8 14.1 V R L = 600 Ω13.5 13.9 VR L = 600 Ω, −55°C < T A < +125°C 11.4V Output Voltage Low V OL R L = 10 kΩ, −55°C < T A < +125°C −14.9 −14.6 V R L = 2 kΩ, −55°C < T A < +125°C –14.8 −14.5 V R L = 600 Ω−14.3 −13.8 VR L = 600 Ω, −55°C < T A < +125°C −12.1 V Output Current I OUT ±70 mA POWER SUPPLYPower Supply Rejection Ratio PSRR V S = ±4.5 V to ±18 V 86 dB Supply Current/Amplifier I SY V O = 0 V2.2 2.5 mA−55°C < T A < +125°C 2.6 mA DYNAMIC PERFORMANCESlew RateSR R L = 2 kΩ 20 V/µs Gain Bandwidth Product GBP8 MHz Settling Time t S To 0.1%, 0 V to 10 V step, G = +1 0.5 µsTo 0.01%, 0 V to 10 V step, G = +1 0.9 µs Total Harmonic Distortion (THD) + Noise THD + N 1 kHz, G = +1, R L = 2 kΩ 0.0005 %Phase MarginφM 52 Degrees NOISE PERFORMANCEVoltage Noise Density e n f = 10 Hz 34 nV/√Hz f = 100 Hz 12 nV/√Hz f = 1 kHz 8.0 10 nV/√Hzf = 10 kHz7.6 nV/√Hz Peak-to-Peak Voltage Noisee n p-p0.1 Hz to 10 Hz bandwidth2.45.2µV p-pEnhanced ProductAD8512-EPRev. 0 | Page 5 of 7ABSOLUTE MAXIMUM RATINGSTable 3.Parameter Rating Supply Voltage ±18 V Input Voltage ±V SPower DissipationSee Figure 2 Storage Temperature Range −65°C to +150°C Operating Temperature Range −55°C to +125°C Junction Temperature Range−65°C to +150°C Lead Temperature (Soldering, 10 sec) 300°C Electrostatic Discharge (Human Body Model)2000 VStresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability.THERMAL RESISTANCEThermal performance is directly linked to printed circuit board (PCB) design and operating environment. Careful attention to PCB thermal design is required.θJA is the natural convection junction to ambient thermalresistance measured in a one cubic foot sealed enclosure. θJC is the junction to case thermal resistance. Table 4. Thermal ResistancePackage Type 1 θJA θJC Unit R-8158 43 °C/W1Thermal impedance simulated values are based on a JEDEC 2S2P thermal test board. See JEDEC JESD-51.1.000.10.20.30.40.50.60.70.80.9–55–35–15525456585105125M A X I M U M P O W E R D I S SI P A T I O N (W )AMBIENT TEMPERATURE (°C)17170-040Figure 2. Maximum Power Dissipation vs. Ambient TemperatureESD CAUTIONAD8512-EPEnhanced ProductRev. 0 | Page 6 of 7TYPICAL PERFORMANCE CHARACTERISTICST C V OS (µV/°C )N U M B E R O F A M P L I F I E R S10151.032.03.04.05.00.5 1.5 2.5 3.5 4.5 5.56.017170-009Figure 3. T C V OS DistributionTEMPERATURE (°C )I N P U T B I AS C U R R E N T (p A )–551101001k–3510k100k–1552545658510512517170-010Figure 4. Input Bias Current vs. TemperatureTEMPERATURE (°C )I N P U T O FF S E T C U R R E N T (p A )–550.010.1110–351001k–1552545658510512517170-011Figure 5. Input Offset Current vs. TemperatureTEMPERATURE (°C )S U P P L Y CU R R E N T P E R A M P L I F I E R (m A )–551.00–352.502.252.001.751.501.25–1552545658510512517170-015Figure 6. Supply Current per Amplifier vs. TemperatureEnhanced ProductAD8512-EPRev. 0 | Page 7 of 7OUTLINE DIMENSIONSCONTROLLING DIMENSIONS ARE I N MILLIMETERS;INCH DIMENSIONS (IN PARENTHESES)ARE ROUNDED-OFF MILLIMETER EQUIVALENTS FOR REFERENCE ONLY AND ARE NOT APPROPRIATE FOR USE IN DESIGN.COMPLIANT TO JEDEC STANDARDS MS-012-AA012407-A0.25(0.0098)0.17(0.0067)0.40(0.0157)45°Figure 7. 8-Lead Standard Small Outline Package [SOIC_N]Narrow Body (R-8)Dimensions shown in millimeters and (inches)ORDERING GUIDEModel 1Temperature Range Package DescriptionPackage Option Marking Code AD8512TRZ-EP −55°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 DNL AD8512TRZ-EP-R7−55°C to +125°C 8-Lead Standard Small Outline Package [SOIC_N] R-8 DNL1Z = RoHS Compliant Part©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D17170-0-8/18(0)AD8512TRZ-EP。
IT8511使用手册
IT8511使用手册IT8511是一款功能齐全的数字电源万用表,具有多种功能和测量模式,广泛应用于电子设备制造和维护等领域。
本文将为您介绍该万用表的详细使用方法和注意事项,帮助您充分发挥其功能,并确保安全有效地操作。
一、外观和规格IT8511的外观为灰色金属表壳,具有中空钣金弧形手柄,方便携带和使用。
其屏幕面板为4.3英寸彩色液晶屏,具有丰富的数据显示和测量选项。
该万用表的主要规格如下:输出功率:1,500W电源输入:AC 220V/110V±10%,50Hz/60Hz电流范围:0A~30A电压范围:0V~150V功率范围:0W~1,500W电阻范围:0Ω~999.9Ω温度范围:-40℃~+80℃二、基本操作1、开机接好电源,按下电源开关,IT8511即可开机。
在正常操作状态下,液晶屏幕上会显示主界面和各个功能图标。
2、模式选择通过液晶屏幕下方的菜单按钮,在不同的功能模式之间切换。
当前支持DCV模式、DCA模式、ACV模式、ACA模式、OHM 模式、PT模式、TEMP模式等多种模式。
3、测量范围调节在不同测量模式下,通过左侧旋钮或菜单按钮,调节电流、电压、电阻、功率等测量范围,以达到合适的测量参数。
4、测量A、V、Ω、W四个参数在DCV模式下,当需要测量电压时,将正负极的电瓶端子和被测电路连接,数值将在液晶屏幕上显示。
同样,在DCA模式下,可以通过连接外部电路来进行电流测量。
在ACV和ACA模式下,可以测量交流电压和电流。
而在OHM模式下,可以进行电阻测量,而在PT模式下,可以进行电位器的测量和调节。
最后,在TEMP模式下,IT8511可以通过连接温感电阻,实现精准的温度测量。
三、特别功能1、数据储存IT8511可以通过内置的存储卡,将测量数据存储到卡中,支持XXS,TS25和MMC等多种储存卡格式。
同时,还支持导出文件到PC或U盘等外部储存设备。
2、报警在某些情况下,IT8511支持自动报警功能,当测量值超过设定的警戒线时,会自动触发报警指示灯和声音提示,以保证设备的安全和有效测量。
HM62V8512CLTS-5资料
Renesas Technology Corp. Customer Support Dept. April 1, 2003
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.EATURESExtended Data-Out (EDO) Page Mode access cycle TTL compatible inputs and outputs; tristate I/ORefresh Interval: 1024 cycles /16 msRefresh Mode: RAS-Only, CAS-before-RAS (CBR), HiddenJEDEC standard pinoutSingle power supply:5V ± 10% (IS41C8512)3.3V ± 10% (IS41LV8512)Byte Write and Byte Read operation via CASIndustrail Temperature Range -40o C to 85o C DESCRIPTIONThe 1+51 IS41C8512 and IS41LV8512 is a 524,288 x 8-bit high-performance CMOS Dynamic Random Access Memories. The IS41C8512 offer an accelerated cycle access called EDO Page Mode. EDO Page Mode allows 512 random accesses within a single row with access cycle time as short as 10 ns per 8-bit.These features make the IS41C8512and IS41LV8512 ideally suited for high-bandwidth graphics, digital signal processing, high-performance computing systems, and peripheral applications.The IS41C8512 is packaged in a 28-pin 400mil SOJ and 400mil TSOP-2.IS41C8512IS41LV8512512K x 8 (4-MBIT) DYNAMIC RAMWITH EDO PAGE MODEKEY TIMING PARAMETERSParameter-35-50-60UnitMax. RAS Access Time (t RAC)355060nsCACAAPCMin. Read/Write Cycle Time (t RC)6090110nsPIN CON.IGURATIONS28 Pin SOJ, TSOP-2PIN DESCRIPTIONSA0-A9Address InputsI/O0-7Data Inputs/OutputsWE Write EnableOE Output EnableRAS Row Address StrobeCAS Column Address StrobeVcc PowerGND GroundNC No ConnectionICSI reserves the right to make changes to its products at any time without notice in order to improve design and supply the best possible product. We assume no responsibility for any errors which may appear in this publication. © Copyright 2000, Integrated Circuit Solution Inc.IS41C8512IS41LV85122Integrated Circuit Solution Inc.TRUTH TABLE.unction RAS CAS WE OE Address t R /t C I/OStandby H H X X X High-Z ReadL L H L ROW/COL D OUT Write: Word (Early Write)L L L X ROW/COL D IN Read-Write L L H →L L →H ROW/COL D OUT , D IN Hidden Refresh Read L →H →L L H L ROW/COL D OUT Write (1)L →H →LL L X ROW/COL D OUT RAS -Only Refresh L H X X ROW/NA High-ZCBR RefreshH →L L X X X High-ZNote:1.EARLY WRITE only.IS41C8512IS41LV8512.unctional DescriptionThe IS41C8512 and IS41LV8512 is a CMOS DRAM optimized for high-speed bandwidth, low power applications. During READ or WRITE cycles, each bit is uniquely addressed through the 10 address bits. These are entered ten bits (A0-A9) at a time. The row address is latched by the Row Address Strobe (RAS). The column address is latched by the Column Address Strobe (CAS). RAS is used to latch the first ten bits and CAS is used the latter nine bits.Memory CycleA memory cycle is initiated by bring RAS LOW and it is terminated by returning both RAS and CAS HIGH. To ensures proper device operation and data integrity any memory cycle, once initiated, must not be ended or aborted before the minimum t RAS time has expired. A new cycle must not be initiated until the minimum precharge time t RP, t CP has elapsed.Read CycleA read cycle is initiated by the falling edge of CAS or OE, whichever occurs last, while holding WE HIGH. The column address must be held for a minimum time specified by t AR. Data Out becomes valid only when t RAC, t AA, t CAC and t OEA are all satisfied. As a result, the access time is dependent on the timing relationships between these parameters.Write CycleA write cycle is initiated by the falling edge of CAS and WE, whichever occurs last. The input data must be valid at or before the falling edge of CAS or WE, whichever occurs first.Refresh CycleTo retain data, 1024 refresh cycles are required in each 16 ms period. There are two ways to refresh the memory.1.By clocking each of the 1024 row addresses (A0 through A9) with RAS at least once every 16 ms. Any read, write, read-modify-write or RAS-only cycle re-freshes the addressed row.ing a CAS-before-RAS refresh cycle. CAS-before-RAS refresh is activated by the falling edge of RAS, while holding CAS LOW. In CAS-before-RAS refresh cycle, an internal 10-bit counter provides the row ad-dresses and the external address inputs are ignored.CAS-before-RAS is a refresh-only mode and no data access or device selection is allowed. Thus, the output remains in the High-Z state during the cycle.Extended Data Out Page ModeEDO page mode operation permits all 512 columns within a selected row to be randomly accessed at a high data rate.In EDO page mode read cycle, the data-out is held to the next CAS cycle s falling edge, instead of the rising edge. .or this reason, the valid data output time in EDO page mode is extended compared with the fast page mode. In the fast page mode, the valid data output time becomes shorter as the CAS cycle time becomes shorter. Therefore, in EDO page mode, the timing margin in read cycle is larger than that of the fast page mode even if the CAS cycle time becomes shorter.In EDO page mode, due to the extended data function, the CAS cycle time can be shorter than in the fast page mode if the timing margin is the same.The EDO page mode allows both read and write opera-tions during one RAS cycle, but the performance is equiva-lent to that of the fast page mode in that case.Power-OnAfter application of the V CC supply, an initial pause of 200 µs is required followed by a minimum of eight initial-ization cycles (any combination of cycles containing a RAS signal).During power-on, it is recommended that RAS track with V CC or be held at a valid V IH to avoid current surges.IS41C8512IS41LV85124Integrated Circuit Solution Inc.ABSOLUTE MAXIMUM RATINGS (1)Symbol ParametersRating Unit V T Voltage on Any Pin Relative to GND 5V 1.0 to +7.0V 3.3V 0.5 to +4.6V CC Supply Voltage5V 1.0 to +7.0V 3.3V0.5 to +4.6I OUT Output Current 50mA P D Power Dissipation1W T A Commercial Operation Temperature 0 to +70°C Industrial Operationg Temperature 40 to +85°C T STGStorage Temperature55 to +125°CNote:1.Stress greater than those listed under ABSOLUTE MAXIMUM RATINGS may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.RECOMMENDED OPERATING CONDITIONS (Voltages are referenced to GND.)Symbol Parameter Min.Typ.Max.Unit V CC Supply Voltage 5V 4.5 5.0 5.5V 3.3V 3.0 3.3 3.6V IH Input High Voltage 5V 2.4 V CC + 1.0V 3.3V 2.0 V CC + 0.3V IL Input Low Voltage5V 1.0 0.8V 3.3V0.3 0.8T ACommercial Ambient Temperature 0 70°C Industrial Ambient Temperature4085°CCAPACITANCE (1,2)Symbol ParameterMax.Unit C IN 1Input Capacitance: A0-A85p.C IN 2Input Capacitance: RAS , UCAS , LCAS , WE , OE 7p.C IOData Input/Output Capacitance: I/O0-I/O157p.Notes:1. Tested initially and after any design or process changes that may affect these parameters.2. Test conditions: T A = 25°C, f = 1 MHz.IS41C8512IS41LV8512ELECTRICAL CHARACTERISTICS(1)(Recommended Operating Conditions unless otherwise noted.)Symbol Parameter Test Condition Speed Min.Max.Unit I IL Input Leakage Current Any input 0V < V IN < Vcc 1010µAOther inputs not under test = 0VI IO Output Leakage Current Output is disabled (Hi-Z) 1010µA0V < V OUT < VccV OH Output High Voltage Level I OH = 2.5 mA 2.4 VV OL Output Low Voltage Level I OL =+2.1mA 0.4VI CC1Standby Current: TTL RAS, CAS > V IH Commerical5V 3mAIndustrial5V 4Commerical3V 2Industrial3V 3I CC2Standby Current: CMOS RAS, CAS > V CC 0.2V5V 2mA3V 1I CC3Operating Current:RAS, CAS,-35 230mARandom Read/Write(2,3,4)Address Cycling, t RC = t RC (min.)-50 180Average Power Supply Current-60 170I CC4Operating Current:RAS = V IL, CAS,-35 220mAEDO Page Mode(2,3,4)Cycling t PC = t PC (min.)-50 170Average Power Supply Current-60 160I CC5Refresh Current:RAS Cycling, CAS > V IH-35 230mARAS-Only(2,3)t RC = t RC (min.)-50 180Average Power Supply Current-60 170I CC6Refresh Current:RAS, CAS Cycling-35 230mACBR(2,3,5)t RC = t RC (min.)-50 180Average Power Supply Current-60 170 Notes:1. An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycles (RAS-Only or CBR) before proper deviceoperation is assured. The eight RAS cycles wake-up should be repeated any time the t RE. refresh requirement is exceeded.2. Dependent on cycle rates.3. Specified values are obtained with minimum cycle time and the output open.4. Column-address is changed once each EDO page cycle.5. Enables on-chip refresh and address counters.IS41C8512IS41LV85126Integrated Circuit Solution Inc.AC CHARACTERISTICS (1,2,3,4,5,6)(Recommended Operating Conditions unless otherwise noted.)-35-50-60Symbol ParameterMin.Max.Min.Max.Min.Max.Units t RC Random READ or WRITE Cycle Time 60 90 110 ns t RAC Access Time from RAS (6, 7)35 50 60ns t CAC Access Time from CAS (6, 8, 15)10 14 15ns t AA Access Time from Column-Address (6) 18 25 30ns t RAS RAS Pulse Width 3510K 5010K 6010K ns t RP RAS Precharge Time 2030 40 ns t CAS CAS Pulse Width (26)610K 810K 1010K ns t CP CAS Precharge Time (9, 25)5 8 10 ns t CSH CAS Hold Time (21)35 50 60 ns t RCD RAS to CAS Delay Time (10, 20)112819362045ns t ASR Row-Address Setup Time 0 0 0 ns t RAH Row-Address Hold Time6 8 10 ns t ASC Column-Address Setup Time (20)0 0 0 ns t CAH Column-Address Hold Time (20)6 8 10 ns t AR Column-Address Hold Time 30 40 40 ns (referenced to RAS )t RAD RAS to Column-Address Delay Time (11)102014251530ns t RAL Column-Address to RAS Lead Time 18 25 30 ns t RPC RAS to CAS Precharge Time 0 0 0 ns t RSH RAS Hold Time (27)8 14 15 ns t CLZ CAS to Output in Low-Z (15, 29)3 3 3 ns t CRP CAS to RAS Precharge Time (21)5 5 5 ns t OD Output Disable Time (19, 28, 29)312312312ns t OE Output Enable Time (15, 16)010015 15ns t OEHC OE HIGH Hold Time from CAS HIGH 10 10 10 ns t OEP OE HIGH Pulse Width10 10 10 ns t OES OE LOW to CAS HIGH Setup Time 5 5 5 ns t RCS Read Command Setup Time (17, 20)0 0 0 ns t RRH Read Command Hold Time 0 0 0 ns (referenced to RAS )(12)t RCH Read Command Hold Time 0 0 0 ns (referenced to CAS )(12, 17, 21)t WCH Write Command Hold Time (17, 27)5 8 10 ns t WCR Write Command Hold Time 30 40 50 ns (referenced to RAS )(17)t WP Write Command Pulse Width (17)5 8 10 ns t WPZ WE Pulse Widths to Disable Outputs 10 10 10 ns t RWL Write Command to RAS Lead Time (17)8 14 15 ns t CWL Write Command to CAS Lead Time (17, 21)8 14 15 ns t WCS Write Command Setup Time (14, 17, 20)0 0 0 ns t DHRData-in Hold Time (referenced to RAS )304040nsIS41C8512IS41LV8512AC CHARACTERISTICS (Continued)(1,2,3,4,5,6)(Recommended Operating Conditions unless otherwise noted.)-35-50-60Symbol Parameter Min.Max.Min.Max.Min.Max.Units t ACH Column-Address Setup Time to CAS15 15 15 ns Precharge during WRITE Cyclet OEH OE Hold Time from WE during8 8 15 ns READ-MODI.Y-WRITE cycle(18)t DS Data-In Setup Time(15, 22)0 0 0 ns t DH Data-In Hold Time(15, 22)6 6 10 ns t RWC READ-MODI.Y-WRITE Cycle Time80 100 140 ns t RWD RAS to WE Delay Time during45 50 80 ns READ-MODI.Y-WRITE Cycle(14)t CWD CAS to WE Delay Time(14, 20)25 30 36 ns t AWD Column-Address to WE Delay Time(14)30 30 49 ns t PC EDO Page Mode READ or WRITE12 15 25 ns Cycle Time(24)t RASP RAS Pulse Width in EDO Page Mode35100K40100K50100K ns t CPA Access Time from CAS Precharge(15) 21 27 34ns t PRWC EDO Page Mode READ-WRITE40 45 56 ns Cycle Time(24)t COH Data Output Hold after CAS LOW5 5 5 ns t O..Output Buffer Turn-Off Delay from315315315ns CAS or RAS(13,15,19, 29)t WHZ Output Disable Delay from WE315315315ns t CLCH Last CAS going LOW to .irst CAS10 10 10 ns returning HIGH(23)t CSR CAS Setup Time (CBR RE.RESH)(30, 20)8 10 10 ns t CHR CAS Hold Time (CBR RE.RESH)(30, 21)8 10 10 ns t ORD OE Setup Time prior to RAS during0 0 0 ns HIDDEN RE.RESH Cyclet RE.Refresh Period (1024 Cycles) 1616 16 ms t T Transition Time (Rise or .all)(2, 3)150150150nsIS41C8512IS41LV85128Integrated Circuit Solution Inc.Notes:1.An initial pause of 200 µs is required after power-up followed by eight RAS refresh cycle (RAS -Only or CBR) before proper deviceoperation is assured. The eight RAS cycles wake-up should be repeated any time the t RE. refresh requirement is exceeded.2.V IH (MIN) and V IL (MAX) are reference levels for measuring timing of input signals. Transition times, are measured between V IHand V IL (or between V IL and V IH ) and assume to be 1 ns for all inputs.3.In addition to meeting the transition rate specification, all input signals must transit between V IH and V IL (or between V IL and V IH )in a monotonic manner.4.If CAS and RAS = V IH , data output is High-Z.5.If CAS = V IL , data output may contain data from the last valid READ cycle.6.Measured with a load equivalent to one TTL gate and 50 p..7.Assumes that t RCD ≤ t RCD (MAX). If t RCD is greater than the maximum recommended value shown in this table, t RAC will increaseby the amount that t RCD exceeds the value shown.8.Assumes that t RCD ≥ t RCD (MAX).9.If CAS is LOW at the falling edge of RAS , data out will be maintained from the previous cycle. To initiate a new cycle and clear thedata output buffer, CAS and RAS must be pulsed for t CP .10.Operation with the t RCD (MAX) limit ensures that t RAC (MAX) can be met. t RCD (MAX) is specified as a reference point only; if t RCDis greater than the specified t RCD (MAX) limit, access time is controlled exclusively by t CAC .11.Operation within the t RAD (MAX) limit ensures that t RCD (MAX) can be met. t RAD (MAX) is specified as a reference point only; if t RADis greater than the specified t RAD (MAX) limit, access time is controlled exclusively by t AA .12.Either t RCH or t RRH must be satisfied for a READ cycle.13.t O.. (MAX) defines the time at which the output achieves the open circuit condition; it is not a reference to V OH or V OL .14.t WCS , t RWD , t AWD and t CWD are restrictive operating parameters in LATE WRITE and READ-MODI.Y-WRITE cycle only. If t WCS ≥ t WCS(MIN), the cycle is an EARLY WRITE cycle and the data output will remain open circuit throughout the entire cycle. If t RWD ≥ t RWD (MIN), t AWD ≥ t AWD (MIN) and t CWD ≥ t CWD (MIN), the cycle is a READ-WRITE cycle and the data output will contain data read from the selected cell. If neither of the above conditions is met, the state of I/O (at access time and until CAS and RAS or OE go back to V IH ) is indeterminate. OE held HIGH and WE taken LOW after CAS goes LOW result in a LATE WRITE (OE -controlled) cycle.15.Output parameter (I/O) is referenced to corresponding CAS input.16.During a READ cycle, if OE is LOW then taken HIGH before CAS goes HIGH, I/O goes open. If OE is tied permanently LOW, a LATEWRITE or READ-MODI.Y-WRITE is not possible.17.Write command is defined as WE going low.TE WRITE and READ-MODI.Y-WRITE cycles must have both t OD and t OEH met (OE HIGH during WRITE cycle) in order to ensurethat the output buffers will be open during the WRITE cycle. The I/Os will provide the previously written data if CAS remains LOW and OE is taken back to LOW after t OEH is met.19.The I/Os are in open during READ cycles once t OD or t O.. occur.20.The first χCAS edge to transition LOW.21.The last χCAS edge to transition HIGH.22.These parameters are referenced to CAS leading edge in EARLY WRITE cycles and WE leading edge in LATE WRITE or READ-MODI.Y-WRITE cycles.st falling χCAS edge to first rising χCAS edge.st rising χCAS edge to next cycle s last rising χCAS st rising χCAS edge to first falling χCAS edge.26.Each χCAS must meet minimum pulse st χCAS to go LOW.28.I/Os controlled, regardless CAS .29.The 3 ns minimum is a parameter guaranteed by design.30.Enables on-chip refresh and address counters.IS41C8512IS41LV8512READ CYCLE Array Note:1.t O.. is referenced from rising edge of RAS or CAS, whichever occurs last.IS41C8512IS41LV851210Integrated Circuit Solution Inc.EARLY WRITE CYCLE (OE = DON'T CARE)IS41LV8512READ WRITE CYCLE (LATE WRITE and READ-MODI.Y-WRITE Cycles)IS41LV851212Integrated Circuit Solution Inc.EDO -PAGE -MODE READ CYCLENote:1.t PC can be measured from falling edge of CAS to falling edge of CAS , or from rising edge of CAS to rising edge of CAS . Both measurements must meet the t PC specifications.IS41LV8512EDO-PAGE-MODE EARLY-WRITE CYCLEIS41LV851214Integrated Circuit Solution Inc.EDO -PAGE -MODE READ -WRITE CYCLE (LATE WRITE and READ-MODI.Y WRITE Cycles)Note:1.t PC can be measured from falling edge of CAS to falling edge of CAS , or from rising edge of CAS to rising edge of CAS . Both measurements must meet the t PC specifications.IS41LV8512EDO-PAGE-MODE READ-EARLY-WRITE CYCLE (Psuedo READ-MODI.Y WRITE)IS41LV8512AC WAVE.ORMSREAD CYCLE (With WE-Controlled Disable)4)5-ONLY RE.RESH CYCLE (OE, WE = DON'T CARE)16Integrated Circuit Solution Inc.IS41LV8512HIDDEN RE.RESH CYCLE (1) (WE = HIGH; OE = LOW)+*4 RE.RESH CYCLE (Addresses; WE , OE = DON'T CARE)Notes:1.A Hidden Refresh may also be performed after a Write Cycle. In this case, WE = LOW and OE = HIGH.2.t O.. is referenced from rising edge of RAS or CAS , whichever occurs last.IS41LV851218Integrated Circuit Solution Inc.ORDERING IN.ORMATION IS41C8512Commercial Range: 0°C to 70°CSpeed (ns)Order Part No.Package 35IS41C8512-35K 400mil SOJ IS41C8512-35T 400mil TSOP-2IS41C8512-50T 400mil TSOP-260IS41C8512-60K 400mil SOJ IS41C8512-60T400mil TSOP-2ORDERING IN.ORMATION:IS41LV8512Commercial Range: 0°C to 70°CSpeed (ns)Order Part No.Package 35IS41LV8512-35K 400mil SOJ IS41LV8512-35T 400mil TSOP-2IS41LV8512-50T 400mil TSOP-260IS41LV8512-60K 400mil SOJ IS41LV8512-60T400mil TSOP-2Industrial Range: -40°C to 85°CSpeed (ns)Order Part No.Package 35IS41C8512-35KI 400mil SOJ IS41C8512-35TI 400mil TSOP-250IS41C8512-50KI 400mil SOJ IS41C8512-50TI 400mil TSOP-260IS41C8512-60KI 400mil SOJ IS41C8512-60TI400mil TSOP-2Industrial Range: -40°C to 85°CSpeed (ns)Order Part No.Package 35IS41LV8512-35K 400mil SOJ IS41LV8512-35T 400mil TSOP-2IS41LV8512-50TI 400mil TSOP-260IS41LV8512-60KI 400mil SOJ IS41LV8512-60TI400mil TSOP-2Integrated Circuit Solution Inc.HEADQUARTER:NO.2, TECHNOLOGY RD. V, SCIENCE-BASED INDUSTRIAL PARK,HSIN-CHU, TAIWAN, R.O.C.TEL: 886-3-5780333.ax: 886-3-5783000BRANCH O..ICE:7., NO. 106, SEC. 1, HSIN-TAI 5TH ROAD,HSICHIH TAIPEI COUNTY, TAIWAN, R.O.C.TEL: 886-2-26962140.AX: 886-2-26962252。