SCM474K601H7N29-F中文资料

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康海时代(COMHIGHER)NC601的产品技术参数

速率
50 bps至460800 bps
控制台端口
RS-232
软件特性
协议
Telnet,SNMP,HTTP,DHCP,PPP/SLIP,ARP,ICMP,IP,TCP, UDP,
使用平台
Windows 95/98/ME/NT/2000/XP
Real COM
Windows NT/2000/XP/2003 Real COM
TTY驱动程序
Unix,Linux real tty driver
配置
Telnet，Console和Web(中英文菜单可选）
电源需求
电源输入
NC601:5 V
NC601-5V(电源接口为接线端子)
功耗
290 mA/1.45W(max)
环境
工作温度
-20～85℃
工作湿度
5～95%RH
机械
材料
铝合金
规格
康海时代COMHIGHER产品技术标准及功能说明书
品牌
康海时代™（COMHIGHER™）
型号
康海时代™（COMHIGHER™）NC601
图片
硬件
处理器
32位嵌入式100兆CPU
ቤተ መጻሕፍቲ ባይዱ内存
2M
LAN
以太网
10Mbps, RJ45
保护
内建2 KV电磁隔离
串口界面
串口方式
RS-232
串口数
1
接口形式
DB9针
信号
TXD, RXD, RTS, CTS, DTR, DSR, DCD, GND
串口保护
15 KV ESD保护，短路保护
加密功能
AES加密（可选）
串口通讯参数

DMN601TK-7;中文规格书,Datasheet资料

Features• Low On-Resistance: R DS(ON) • Low Gate Threshold Voltage • Low Input Capacitance • Fast Switching Speed• Low Input/Output Leakage• Lead Free By Design/RoHS Compliant (Note 2) • ESD Protected Up To 2kV • "Green" Device (Note 4)Mechanical Data• Case: SOT-523 • Case Material: Molded Plastic, “Green” MoldingCompound. UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020D • Terminals: Finish ⎯ Matte Tin annealed over Alloy 42leadframe. Solderable per MIL-STD-202, Method 208 • Terminal Connections: See Diagram • Marking Information: See Page 3 • Ordering Information: See Page 3 • Weight: 0.002 grams (approximate)Maximum Ratings @T A = 25°C unless otherwise specifiedCharacteristicSymbol Value Units Drain-Source Voltage V DSS 60 VGate-Source Voltage V GSS±20 V Drain Current (Note 1) ContinuousPulsed (Note 3)I D300800mAThermal Characteristics @T A = 25°C unless otherwise specifiedCharacteristicSymbol Value Units Total Power Dissipation (Note 1)P D 150 mW Thermal Resistance, Junction to Ambient R θJA 833 °C/W Operating and Storage Temperature Range T J , T STG-65 to +150°CElectrical Characteristics @T A = 25°C unless otherwise specifiedCharacteristicSymbol Min Typ Max UnitTest ConditionOFF CHARACTERISTICS (Note 5) Drain-Source Breakdown Voltage BV DSS 60 ⎯ ⎯ V V GS = 0V, I D = 10μA Zero Gate Voltage Drain Current I DSS ⎯ ⎯ 1.0 μA V DS = 60V, V GS = 0V Gate-Source LeakageI GSS ⎯ ⎯ ±10 μA V GS = ±20V, V DS = 0V ON CHARACTERISTICS (Note 5) Gate Threshold VoltageV GS(th) 1.0 1.6 2.5 VV DS = 10V, I D = 1mA Static Drain-Source On-Resistance R DS (ON) ⎯ ⎯ ⎯ 2.0 3.0 ΩV GS = 10V, I D = 0.5A V GS = 5V, I D = 0.05A Forward Transfer Admittance |Y fs | 80 ⎯ ⎯ ms V DS =10V, I D = 0.2A DYNAMIC CHARACTERISTICS Input Capacitance C iss ⎯ ⎯ 50 pF V DS = 25V, V GS = 0V f = 1.0MHz Output CapacitanceC oss ⎯ ⎯ 25 pF Reverse Transfer CapacitanceC rss⎯⎯5.0pFNotes: 1. Device mounted on FR-4 PCB. 2. No purposefully added lead.3. Pulse width ≤10μS, Duty Cycle ≤1%4. Diodes Inc.’s “Green” policy can be found on our website at /products/lead_free/index.php.5. Short duration pulse test used to minimize self-heating effect.SOT-523TOP VIEWPin Out ConfigurationESD Protected up to 2kVEQUIVALENT CIRCUITPlease click here to visit our online spice models database.V , DRAIN-SOURCE VOLTAGE (V)Fig. 1 Typical Output CharacteristicsDS I , D R A I N C U R R E N T (A )DFig. 2 Typical Transfer CharacteristicsGS T , CHANNEL TEMPERATURE (°C)Fig. 3 Gate Threshold Voltage vs. Channel T emperaturech 00.51.5I DRAIN CURRENT (A)Fig. 4 Static Drain-Source On-Resistancevs. Drain CurrentD , R , S T A T I C D R A I N -S O U R CE D S (O N)Fig. 5 Static Drain-Source On-Resistancevs. Drain CurrentDR , S T A T I C D R A I N -S O U R C E D S (O N )V GATE SOURCE VOLTAGE (V)Fig. 6 Static Drain-Source On-Resistancevs. Gate-Source VoltageGS,R , S T A T I C D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 7 CH Static Drain-Source On-State Resistancevs. Channel T emperatureR , S T A T I C D R A I N -S O U R C E D S (O N )1I , R E V E R S E D R A I N C U R RE N T (A )D R 1I , DRAIN CURRENT (A)D Fig.10 Forward Transfer Admittancevs. Drain CurrentOrdering Information (Note 6)Part Number Case Packaging DMN601TK-7SOT-523 3000/Tape & ReelNotes: 6. For packaging details, go to our website at /datasheets/ap02007.pdf.Marking InformationDate Code KeyYear 2005 2006 2007 2008 2009 2010 2011 2012 Code S T U V W X Y ZMonth Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec Code 1 2 3 4 5 6 7 8 9 O N DK7K = Product Type Marking Code YM = Date Code Marking Y = Year (ex: S = 2005) M = Month (ex: 9 = September) K7K YMPackage Outline DimensionsSuggested Pad LayoutIMPORTANT NOTICEDiodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to any product herein. Diodes Incorporated does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights, nor the rights of others. The user of products in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on our website, harmless against all damages.LIFE SUPPORTDiodes Incorporated products are not authorized for use as critical components in life support devices or systems without the expressed written approval of the President of Diodes Incorporated.SOT-523Dim Min Max Typ A 0.15 0.30 0.22 B 0.75 0.85 0.80 C 1.45 1.75 1.60 D ⎯ ⎯ 0.50 G 0.90 1.10 1.00 H 1.50 1.70 1.60 J 0.00 0.10 0.05 K 0.60 0.80 0.75 L 0.10 0.30 0.22 M 0.10 0.20 0.12 N 0.45 0.65 0.50α0° 8° ⎯ All Dimensions in mmDimensions Value (in mm)Z1.8 X 0.4 Y 0.51 C 1.3 E 0.7X EYCZ分销商库存信息: DIODESDMN601TK-7。

2014三菱重工中央空调产品篇

进口
19
FDUM – KXE6D
中静压风管机
1 暗装式风管机 2 噪音低 3 散流器送风，更灵活地适应装修要求 4 软风管接口设计，便于安装及维护
合资
室内机介绍
额定制冷量
2.2KW 2.8KW 3.6KW 4.5KW 5.6KW 7.1KW 9.0KW 11.2KW 14.0KW
20
FDK – KXE6F
1 依据CFD分析成果设计 2 低噪音 3 送风距离远 4 易清洗的结构设计 5 卓越的制冷效果
室内机介绍
FDC分析证实，能最大限度地减小阻力，实现均匀送风
进口
FDE – KXE6F
额定制冷量 3.6KW 4.5KW 5.6KW 7.1KW 11.2KW 14.0KW
室内机介绍
1 配管可从3个方向接入 2 轻薄设计，210mm高 3 重量轻 4 噪音低 5 可根据房间情况，自由选择送风方向
产品篇
KX6-Q系列 KX6-I系列 KX6mini系列 UI系列 SCM系列一拖一商用机系列（UA/TB）空气净化器
产品阵容
KX6多联机
KX6变频多联机系列
变制冷剂流量多联分体式空调系统—VRF多联机 1982年JX系列 1996年KX2系列 2003年KX3系列 2004年KX4系列 2008年KX6系列
三菱重工独有的专利技术
3D压缩机
1 业界最先进的压缩机——3D涡旋式压缩机。 2 径向和轴向同时压缩，内部高压区阻力力矩小，
输入功率小，能效比高。 3 高压区涡旋盘齿根降低，根部应力减小，寿命延长。
室外机风扇
室外机风扇
根据三菱重工航空航天空气动力学研究成果设计，锯齿边缘风扇采用直流变频电机驱动，风扇转速无级调节，降低噪音，节约能源可自动切换低噪音模式--标准模式运转，智能化的设计，节能效果更好

国祥空调说明书

国祥空调说明书国祥空调说明书篇一：国祥风冷模块安装使用说明书篇二：空调控制板维修中央空调控制维修关键词电子膨胀阀故障检测及修理方法富田螺杆机组配置广州大麦空调控制器格力中央空调外置电子膨胀阀结构降膜螺杆机组如何控制西臣仕中央空调系统电脑控制汇中地源热泵空调说明书克莱门特中央冷暖空调控制电路 sink空调空气处理机组线路板海润空调风冷模块机组安装图纸水源热泵监控系统枫叶能源空调水机组故障代码热泵电子膨胀阀故障聊城麦克维尔地源热泵奇威特中央空调空调电子膨胀阀维修指引奇威特控制器模块机通用电路板电子膨胀阀接线图电子膨胀阀原理空调板式换热器冻坏中央空调空调FERDLIS 约克YCAE-BC使用说明中央空调通用控制器空调风冷模块通用电脑板蒋立天加天加蒋立螺杆水冷空调液晶线路板空调电路板接线中央空调市场占有率空调监控 GPRS模块空调遥控器维修中央空调压缩机保养图片格力201X上半年销售额富田中央空调主板汇中中央空调喷液压缩机麦克维尔热泵控制板伯瑞斯B-8空调天津开利螺杆冷水机组主板谷轮压缩机内部结构天加空调蒋立中央空调接线图空调开关电源的原理欧科中央空调简介麦克维尔风冷模块机组报压缩机过载电子膨胀阀原理图中央空调PLC系统中央空调因电造成故障空调使用年限规定电子膨胀阀门的原理模块机万能控制板伯瑞斯空调格力201X年上半年销售额约克空调机型 C002.MCB.P:003. 中央空调电脑远程控制器空气处理机组电路板地源热泵空调品牌空调变频通用板 carel easytls编程软件下载 eurklimat 空调器充注制冷剂海润通家用智能化控制惠康别墅式水冷冷/热家用中央空调使用说明书空调触摸屏控制面板惠康螺杆式中央空调新晃工业株式会社集团在日本公司地址中央空调电路板接线空调全部工具枫叶能源空调水机故障代码风冷空调控制板海润通控产品 EK户式风冷热泵空调电路板维修视频空调电子膨胀阀电子膨胀阀测试美的MDV4商用中央空调室内机故障代码查询约克冷水机电路板维修中央空调通常都会显示通讯故障空调线控器用什么协议通用螺杆空调触摸屏中央空调数据故障报警是什么原因奇威特水机说明伯瑞斯空调说明书空调室内机电子膨帐阀接线图中央空调机通用电路板美的mdv4空调维修手册 YCE30SMC主机参数 sink空调的技术文档空调维修专业工具聊城水地源热泵空调招聘空调电路板维修电子膨胀阀中央plc可编程控制空调螺杆压缩机 tcl 空调面板可设置密码？大金帕缔能单相压缩机空调维修需要的工具电子阀线圈的阻值中央空调维修工具浙江国祥螺杆水(地)源热泵机组调试方法空调市场占有率排名枫叶中央空调麦克维尔m-cud220b5y 家用中央空调控制开关麦克维尔型号MDS200BR 螺杆式冷水机组控制电路维修视屏风冷模块更换通用主板克莱门特3000地热中央空调系统变频空调通用版空调出风口正对着沙发离心中央空调机通用板刘结果水源热泵线路板汇中戈特尔空调空调控制原理图深圳海润通控电子膨胀阀空调老式中央空调壁挂机控制电路图克莱门特3000 中央空调水机国翔空调控制接线 ycae130 天加空调蒋立篇三：中央空调调查报告中央空调调查报告一、中央空调分类（一）中央空调根据冷媒不同，可分为风管式系统、冷热水机组系统和多联机型系统。

Ho7RN-F

线芯标识
根据VDE0293 标准，2芯：棕色，蓝色。

3芯：绿色/黄色，棕色，蓝色。

4芯：绿色/黄色，黑色，蓝色，棕色。

5芯：绿色/黄色，黑色，蓝色，棕色，黑色。

6 芯：配有数字编码，黑色芯线配有白色数字编码。

结构
导体：柔软镀锡铜或裸铜，绝缘体： E.P.R. 橡胶，外层护套：橡胶。

H - 通过高协调性能认证
7 - 额定电压450/750伏
R - 天然或合成橡胶
N - 氯丁( 二烯) 橡胶
F - 多股柔软导体
H07RN-F 3 芯类型450/750V EPR/PCP 橡胶电缆
H07RN-F 5 芯类型450/750V EPR/PCP 橡胶电缆
H07RN-F 多芯类型450/750V EPR/PCP 橡胶电缆
H07RN-F单芯类型 450/750V EPR/PCP 橡胶电缆
H07RN-F 2芯类型450/750V EPR/PCP 橡胶电缆
H07RN-F 4 芯类型450/750V EPR/PCP 橡胶电缆
说明
1、额定温度：-15℃+60℃
2、额定电压：450/750V
3、测试电压：2500V
4、裸软铜或镀锡铜绞线
5、乙丙橡胶绝缘
6、氯乙橡胶被覆
7、阻燃、防水、防油、耐老化
应用
应用于强电设备及一般电动工具。

Valtek MaxFlo 4 Eccentric Rotary Plug Control Valv

Valtek MaxFlo 4 Eccentric Rotary Plug Control ValveMaxFlo 4 Eccentric Rotary Plug Control Valve2The Flowserve Valtek MaxFlo 4 control valve is a high performance eccentric rotary plug valve designed for the process industry. It features a large capacity, standard hardened trim and superior shaft blow-out protection. This valve is available in sizes 1 through 12 inches, ASME Class 150, 300 and 600 as well as DIN PN 10, PN16, PN 25, PN40 and PN63.An optional ISA 75.08.01 or DIN EN 558 series 1 long-pattern body makes this valve an easy drop-in replacement for a globe control valve.The MaxFlo 4 is suitable for most applications; its control valve features include:• Highest Rated Cv • Precise Control • Reliable Shut-off• Most Current Safety Standards • Fugitive Emissions Elimination •Integral Noise Reduction PlatesHighest Rated CvThe unique design of the MaxFlo 4 shaft and plug provide as much as 70% more Cvcompared to the competition. This allows customers to get more flow when neededand sometimes allows for a smaller, more economical valve to be used.Precise ControlThe MaxFlo 4 polygon connection between the shaft and plug is a proven superiormethod for making demanding mechanical connections that are stronger, more preciseand have a substantially longer service life. This reduces backlash and the high strengthof the polygon connections makes them capable of withstanding greater shock loadsunder extreme torque reversal conditions.Reliable Shut-offThe MaxFlo 4 double-offset eccentric plug rotates into the seat at an angle that eliminatessliding over the seat surface. This design reduces seat wear, and thereby decreases main-tenance requirements and costs. At the same time, a tight ANSI Class VI shutoff is easilyobtainable using the soft seat design.Safety StandardThe shaft is designed to meet the safety requirements of industry standard ASME B16.34to ensure that the shaft is retained even if the actuator is removed when the valve is stillpressurized. This is standard on every MaxFlo 4 to provide our customers with confidenceand safety.3Separate bonnet ensures positive anti-blowout, accommodates multiple packing options, and offers flexibility in material selection for demandingapplications.Heavy-duty rigid metal seat,with hardfaced or soft-seat options, provides tighter shutoff, and easier maintenance. Available in full area and several reductions in every size to suit your process needs.Blow out proof shaft required by ASME B16.34 2004 Sec 6.5 ensures safety. Standard on every MaxFlo 4.An economical flangeless configuration of the MaxFlo 4 is also available. The standard flanged body is the same length. To replace existing globe valves we offer the flanged body with the same face to face length as a globe valve (Per ISA 75.08.01).4Open Flow Path gives as much as 70%more C v than competitive valves that have the shaft obstructing the flow. In many cases it is possible to use a smaller, more economical MaxFlo 4.Flanged end post allows for easy maintenance.Hard stainless steel plug requires no breakout torque and increases valve life as the plug lifts off the seat immediately when it begins rotating.Precision NC machined plug and shaft significantly reduces maintenance costs byallowing replacement of only the necessary parts.Polygon shaft/plug connection for precise robust control.Shimless seat offers simplified assembly and easy maintenance.5Eliminate Fugitive EmissionsSpecial Flowserve packing sets, such as SureGuard XT live loaded packing, are available to control fugitive emissions. Packing options include: PTFE V-Ring, Braided PTFE, Graphite, Sureguard XT, Garlock SVS, LATTYflon 3265 LM and LATTYgraf 6995 NG (meeting requirements for TA-Luft, ISO 15848-1 class B and A, and EPA standards).Integral Noise-Reduction Plate OptionDesigned to reduce noise levels by 5 to 10 dBA, our integral plate fits into the valve body. It can be easily maintained using the same tools required for the seat retainer. It is perfectly suitable with all gases in the shaft-downstream direction, and the plate does not change the length of the valve.Integrated Control Valve SolutionOperated by a diaphragm, piston, or rack-and-pinion actuator coupled with a Logix digital positioner, the MaxFlo 4 maintains high positioning accuracy, repeatability, controlled high speed and reliable response. With the advanced diagnostic solutions that can be seamlessly integrated into a host control and/or plant asset management system, along with state-of-the-art features and performance, the MaxFlo 4 is the most economical Eccentric Rotary Plug valve in the market.NR Diaphragm Rotary ActuatorThe Flowserve NR diaphragm rotary actuator is a rugged single-acting actuator designed to provide high performance, long life and reliability. The diaphragm actuator is very sensitive to small changes in air supply, which allows it toprecisely move the valve plug without over shoot.6Logix 3000MD+ Digital PositionerEasiest calibration and configuration of any positioner available. Single, push-button calibration and DIP switch configuration allow you to fully commission the positioner in a matter of minutes. Using ValveSight Software DTM brings the availability of 24/7 diagnostics.For more information see document number LGENIM0059 and LGENIM3404 at .Logix 500MD+ Series Digital PositionerTo minimize your total cost of ownership and maximize productivity, Flowserve developed the Logix MD+ digital positioner. The Logix MD+ digital positioner allows for fast, simple commis-sioning, extremely accurate and reliable control, and diagnostic features that provide powerfuland easy ways to determine when maintenance is required.ValveSight™ Diagnostic Software – Prevention deliveredValveSight is a diagnostic solution for control valves that can be seamlessly integrated into a host control and/or plant asset management system. The power of ValveSight is the intel-ligent diagnostic engine -- which detects an emerging condition in the valve, actuator, posi-tioner, and control signal -- that may indicate a performance, safety, or environmental problem. ValveSight advises which corrective actions totake to prevent a failure.VR Spring Cylinder Rotary ActuatorThe Flowserve VR spring cylinder rotary actuator combines high torque and pneu-matic stiffness with excellent throttling capabilities. These characteristics are designed into a lightweight, rugged and compact assembly, making the Flowserve spring cylinder rotary actuator an excel-lent choice for quarter-turn applications.SuperNova Rack & Pinion Rotary ActuatorThe Flowserve SuperNova rack & pinion rotary actuator is designed forreliability, versatility and safety. Rugged, yet compact construction combined with technical solutions make this product extremely reliable in the severest of operating conditionsLogix 420 Digital PositionerThe Logix 420 is the latest addition to the digital positioner family from Flowserve. When mounted to the MaxFlo 4 eccentric rotary plugcontrol valve, Logix 420 provides the user with a cost competitive solutionfor the general service, explosion proof market. For more information see document numberLGENIM0106 at www .Unparalleled Service: Day or Night, WorldwideFlowserve Quick Response Centers (QRCs) are equipped with thousands of parts, including OEM andFlowserve custom-built products. Each has the manpower andequipment to expedite time-sensitiverepairs of any size.7To find your local Flowserve representative:For more information about Flowserve Corporation, visit or callUSA 1 800 225 6989 or International +1 972 910 0774FCD VLENBR0064-01-AQ Printed in USA. November 2015. © 2015 Flowserve Corporation United States Flowserve1350 N. Mt. Springs Parkway Springville, UT 84663USAPhone: +1 801 489 8611Fax: +1 801 489 3719AustriaFlowserve Control Valves GmbH Kasernengasse 69500 Villach AustriaPhone: +43 (0)4242 41181 0Fax: +43 (0)4242 41181 50FranceFlowserve France S.A.S.BP 60 63307 Thiers Cedex FrancePhone: 33 4738 04266Fax: 33 4738 01424IndiaFlowserve India Controls Pvt. Ltd Plot # 4, 1A, E.P .I.P , Whitefield Bangalore Kamataka India 560 066Phone: +91 80 284 10 289Fax: +91 80 284 10 286SingaporeFlowserve Pte. Ltd.12 Tuas Avenue 20Republic of Singapore 638824SingaporePhone: +65 6879 8900Fax: +65 6862 4940Saudi ArabiaFlowserve Abahsain Flow Control Co., Ltd.Makkah Road, Phase 4Plot 10 & 12, 2nd Industrial City Damman, Kingdom of Saudi ArabiaPhone: +966 3 857 3150 ext. 243Fax: +966 3 857 4243ChinaFlowserve Fluid Motion and Control (Suzhou) Co., Ltd.No. 35, Baiyu RoadSuzhou Industrial Park, Suzhou Jiangsu Province, P .R. 215021ChinaPhone: 86 512 6288 8790Fax: 86 512 6288 8736。

HM61104R7LFTR7中文资料

Outline Dimensions (mm)
Figure 1 Recommended Solder Pad Layout
Refer to Specifications table for ‘Ht’ dimension of each model.
Figure 2
Recommended Solder Pad Layout
Notes:
Inductance, Lo @1kHz, 0.1V µH ±10%
10 22 47 100 220 470 10 12 15 18 22 27 33 39 47 56 68 82 100 120 150 180 220 270 330 390 470 560 680 820 1000 1200 1500 1800 2200 2700
Marking Code Std LF
05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84
DCR Ω Typ.
0.12 0.26 0.50 1.0 2.2 5.0 0.065 0.07 0.09 0.1 0.11 0.13 0.15 0.18 0.2 0.25 0.28 0.35 0.45 0.5 0.65 0.75 0.95 1.1 1.35 1.6 2 2.4 2.7 3.6 4.3 5.6 6.5 7 9.2 10.5

西克氟制冷机运行参数表

西克氟制冷机运行参数表【最新版】目录1.西克氟制冷机概述2.制冷机的运行参数3.参数表的解读4.西克氟制冷机的应用领域正文一、西克氟制冷机概述西克氟制冷机是一种采用氟利昂作为制冷剂的制冷设备，具有高效、节能、环保等特点。

它广泛应用于工业冷冻、空调、冷藏等领域，为用户提供优质的制冷服务。

二、制冷机的运行参数西克氟制冷机的运行参数主要包括以下几个方面：1.制冷量：制冷量是指制冷机在单位时间内能够吸收的热量，通常用单位时间内的制冷量（如：kW）表示。

2.制冷功率：制冷功率是指制冷机在单位时间内所消耗的电能，通常用单位时间内的功率（如：kW）表示。

3.制冷系数：制冷系数是指制冷机在单位制冷量下所消耗的功率，通常用单位制冷量的功率（如：W/kW）表示。

4.运行温度：运行温度是指制冷机在正常运行时，冷凝器、蒸发器等部件的温度。

5.运行压力：运行压力是指制冷机在正常运行时，冷凝器、蒸发器等部件的压力。

三、参数表的解读西克氟制冷机参数表可以提供有关制冷机的各种性能数据。

通过对参数表的解读，我们可以了解制冷机的工作状态、性能优劣以及适用场景等信息。

例如，根据制冷量和制冷功率，我们可以计算出制冷机的能效比，从而评估其节能效果。

根据运行温度和运行压力，我们可以判断制冷机是否在正常运行范围内，以及是否需要进行维护和保养。

四、西克氟制冷机的应用领域西克氟制冷机具有广泛的应用领域，包括但不限于以下几个方面：1.工业冷冻：西克氟制冷机可以为工业生产中的冷却、冷冻等环节提供稳定的制冷服务。

2.空调系统：西克氟制冷机可以作为空调系统的核心部件，为用户提供舒适的室内环境。

3.冷藏设备：西克氟制冷机可以为各类冷藏设备（如：冰箱、冷柜等）提供制冷功能，保证食品的新鲜和安全。

总之，西克氟制冷机作为一种高效、节能、环保的制冷设备，已经成为各个领域不可或缺的重要设备。

等离子数控线切割复合机床的使用

等离子数控线切割复合机床的使用等离子数控线切割复合机床的使用文章标题：等离子数控线切割复合机床的使用常州依维柯客车有限公司为了使客车上的各种形状不规则的钣金件方便加工成为可能，引进了先进的等离子数控线切割复合机床，它可以完成以前的切割机床无法完成的各种不规则曲线轮廓断面的零件的加工，并且还可在其上进行冲孔加工。

以下就我公司的CNC661型等离子机床的设备、软件编程两方面进行介绍：1CNC661型等离子数控线切割复合机床的组成简介等离子数控复合机床由以下几个部分组成：等离子切割系统、冲孔系统（含模具库）、GE-FANUC系列操作系统、多力特（TORIT）除尘过滤器、电控柜、液压缸装置。

其外貌见图1。

以下简述主要部件的功能：1.1等离子切割系统所选用的HD3070等离子切割系统由一个能量供给、RHF控制台、气控台、喷火器快速脱离装置、离阀装置和机器喷火器装置以及可调单元、时间计数器、远程电流控制组成。

该系统为不同的切割要求配置了可选择的不同电流输出来为12.7mm厚以内的铸钢、不锈钢、铜和铝等金属的切割提供最好的条件。

1.2冲孔系统该设备除了等离子切割功能外还具备冲孔的功能。

如图2所示，它具有不同尺寸的冲孔上模、刀座板、压板以及下模与下模体，从而组成一模具库，刀具的转换受气控台控制。

1.3GE-FANUC系列操作系统该系统包含远程控制系统、FANUC系统的程序编辑与读取器。

它可以直接编辑程序也可以读取程序语言以决定加工方式，是数控机床的指挥中心。

1.4多力特（TORIT）除尘过滤器它用于收集空气中的灰尘和微粒物，以保证只有洁净的空气才可排放到工厂环境中。

1.5电控柜该电控柜是向数控机床提供电力的装置，主要面向控制等离子系统的工作过程的伺服电机提供电能，向冲孔系统提供电能，并且GE-FANUC系列操作系统的存贮器亦安装在电控柜中。

1.6液压缸它负责向冲孔装置的工作过程提供液压动力，同时向材料的夹紧装置提供动力来源。

29F4000资料

MX29F400T/B4M-BIT [512Kx8/256Kx16] CMOS FLASH MEMORYerase cycle completion.•Ready/Busy pin (RY/BY)- Provides a hardware method of detecting program or erase cycle completion.- Sector protect/unprotect for 5V only system or 5V/12V system.•Sector protection- Hardware method to disable any combination of sectors from program or erase operations •100,000 minimum erase/program cycles•Latch-up protected to 100mA from -1V to VCC+1V •Boot Code Sector Architecture - T = Top Boot Sector - B = Bottom Boot Sector•Low VCC write inhibit is equal to or less than 3.2V •Package type:- 44-pin SOP - 48-pin TSOP•Compatibility with JEDEC standard- Pinout and software compatible with single-power supply Flash•20 years data retentionFEATURES•524,288 x 8/262,144 x 16 switchable •Single power supply operation- 5.0V only operation for read, erase and program operation•Fast access time: 55/70/90/120ns •Low power consumption- 40mA maximum active current(5MHz)- 1uA typical standby current •Command register architecture- Byte/word Programming (7us/12us typical)- Sector Erase (Sector structure 16K-Bytex1, 8K-Bytex2, 32K-Bytex1, and 64K-Byte x7)•Auto Erase (chip & sector) and Auto Program- Automatically erase any combination of sectors with Erase Suspend capability.- Automatically program and verify data at specified address•Erase suspend/Erase Resume- Suspends an erase operation to read data from, or program data to, another sector that is not being erased, then resumes the erase.•Status Reply- Data polling & Toggle bit for detection of program andGENERAL DESCRIPTIONThe MX29F400T/B is a 4-mega bit Flash memory orga-nized as 512K bytes of 8 bits or 256K words of 16 bits.MXIC's Flash memories offer the most cost-effective and reliable read/write non-volatile random access memory. The MX29F400T/B is packaged in 44-pin SOP ,48-pin TSOP . It is designed to be reprogrammed and erased in system or in standard EPROM programmers.The standard MX29F400T/B offers access time as fast as 55ns, allowing operation of high-speed microproces-sors without wait states. To eliminate bus contention,the MX29F400T/B has separate chip enable (CE) and MXIC's Flash memories augment EPROM functionality with in-circuit electrical erasure and programming. The MX29F400T/B uses a command register to manage this functionality. The command register allows for 100%TTL level control inputs and fixed power supply levels during erase and programming, while maintaining maxi-mum EPROM compatibility.MXIC Flash technology reliably stores memory contents even after 100,000 erase and program cycles. The MXIC cell is designed to optimize the erase and programming mechanisms. In addition, the combination of advanced tunnel oxide processing and low internal electric fields for erase and program operations produces reliable cy-cling. The MX29F400T/B uses a 5.0V ±10% VCC sup-ply to perform the High Reliability Erase and auto Pro-gram/Erase algorithms.The highest degree of latch-up protection is achieved with MXIC's proprietary non-epi process. Latch-up pro-tection is proved for stresses up to 100 milliamps on address and data pin from -1V to VCC + 1V.PIN CONFIGURATIONS44 SOP(500 mil)PIN DESCRIPTIONSYMBOL PIN NAME A0~A17Address Input Q0~Q14Data Input/OutputQ15/A-1Q15(Word mode)/LSB addr(Byte mode)CE Chip Enable Input WE Write Enable Input BYTE Word/Byte Selction inputRESET Hardware Reset Pin/Sector Protect Unlock OE Output Enable Input RY/BY Ready/Busy Output VCC Power Supply Pin (+5V)GNDGround Pin48 TSOP (Standard Type) (12mm x 20mm)234567891011121314151617181920212244434241403938373635343332313029282726252423NC RY/BY A17A7A6A5A4A3A2A1A0CE GND OE Q0Q8Q1Q9Q2Q10Q3Q11RESET WE A8A9A10A11A12A13A14A15A16BYTE GND Q15/A-1Q7Q14Q6Q13Q5Q12Q4VCCM X 29F 400T /BA15A14A13A12A11A10A9A8NC NC WE RESETNC NC RY/BY NC A17A7A6A5A4A3A2A1123456789101112131415161718192021222324A16BYTE GND Q15/A-1Q7Q14Q6Q13Q5Q12Q4VCC Q11Q3Q10Q2Q9Q1Q8Q0OE GND CE A0484746454443424140393837363534333231302928272625MX29F400T/BSECTOR STRUCTUREMX29F400T TOP BOOT SECTOR ADDRESS TABLESector Size Address Range (in hexadecimal)(Kbytes/(x8)(x16) Sector A17A16A15A14A13A12Kwords)Address Range Address Range SA0000X X X64/3200000h-0FFFFh00000h-07FFFh SA1001X X X64/3210000h-1FFFFh08000h-0FFFFh SA2010X X X64/3220000h-2FFFFh10000h-17FFFh SA3011X X X64/3230000h-3FFFFh18000h-1FFFFh SA4100X X X64/3240000h-4FFFFh20000h-27FFFh SA5101X X X64/3250000h-5FFFFh28000h-2FFFFh SA6110X X X64/3260000h-6FFFFh30000h-37FFFh SA71110X X32/1670000h-77FFFh38000h-3BFFFh SA81111008/478000h-79FFFh3C000h-3CFFFh SA91111018/47A000h-7BFFFh3D000h-3DFFFh SA1011111X16/87C000h-7FFFFh3E000h-3FFFFh MX29F400B BOTTOM BOOT SECTOR ADDRESS TABLESector Size Address Range (in hexadecimal)(Kbytes/(x8)(x16) Sector A17A16A15A14A13A12Kwords)Address Range Address Range SA000000X16/800000h-03FFFh00000h-01FFFh SA10000108/404000h-05FFFh02000h-02FFFh SA20000118/406000h-07FFFh03000h-03FFFh SA30001X X32/1608000h-0FFFFh04000h-07FFFh SA4001X X X64/3210000h-1FFFFh08000h-0FFFFh SA5010X X X64/3220000h-2FFFFh10000h-17FFFh SA6011X X X64/3230000h-3FFFFh18000h-1FFFFh SA7100X X X64/3240000h-4FFFFh20000h-27FFFh SA8101X X X64/3250000h-5FFFFh28000h-2FFFFh SA9110X X X64/3260000h-6FFFFh30000h-37FFFh SA10111X X X64/3270000h-7FFFFh38000h-3FFFFh Note: Address range is A17~A-1 in byte mode and A17~A0 in word mode.AUTOMATIC PROGRAMMINGThe MX29F400T/B is byte programmable using the Au-tomatic Programming algorithm. The Automatic Pro-gramming algorithm makes the external system do not need to have time out sequence nor to verify the data programmed. The typical chip programming time at room temperature of the MX29F400T/B is less than 4 sec-onds.AUTOMATIC CHIP ERASEThe entire chip is bulk erased using 10 ms erase pulses according to MXIC's Automatic Chip Erase algorithm. T ypical erasure at room temperature is accomplished in less than 4 second. The Automatic Erase algorithm au-tomatically programs the entire array prior to electrical erase. The timing and verification of electrical erase are controlled internally within the device. AUTOMATIC SECTOR ERASEThe MX29F400T/B is sector(s) erasable using MXIC's Auto Sector Erase algorithm. Sector erase modes allow sectors of the array to be erased in one erase cycle. The Automatic Sector Erase algorithm automatically pro-grams the specified sector(s) prior to electrical erase. The timing and verification of electrical erase are con-trolled internally within the device.AUTOMATIC PROGRAMMING ALGORITHMMXIC's Automatic Programming algorithm requires the user to only write program set-up commands (including 2 unlock write cycle and A0H) and a program command (program data and address). The device automatically times the programming pulse width, provides the pro-gram verification, and counts the number of sequences.A status bit similar to DAT A polling and a status bit tog-gling between consecutive read cycles, provide feed-back to the user as to the status of the programming operation.AUTOMATIC ERASE ALGORITHMMXIC's Automatic Erase algorithm requires the user to write commands to the command register using stan-dard microprocessor write timings. The device will auto-matically pre-program and verify the entire array. Then the device automatically times the erase pulse width, provides the erase verification, and counts the number of sequences. A status bit toggling between consecu-tive read cycles provides feedback to the user as to the status of the programming operation.Register contents serve as inputs to an internal state-machine which controls the erase and programming cir-cuitry. During write cycles, the command register inter-nally latches address and data needed for the program-ming and erase operations. During a system write cycle, addresses are latched on the falling edge, and data are latched on the rising edge of WE or CE, whichever hap-pens first .MXIC's Flash technology combines years of EPROM experience to produce the highest levels of quality, reli-ability, and cost effectiveness. The MX29F400T/B elec-trically erases all bits simultaneously using Fowler-Nordheim tunneling. The bytes are programmed by us-ing the EPROM programming mechanism of hot elec-tron injection.During a program cycle, the state-machine will control the program sequences and command register will not respond to any command set. During a Sector Erase cycle, the command register will only respond to Erase Suspend command. After Erase Suspend is completed, the device stays in read mode. After the state machine has completed its task, it will allow the command regis-ter to respond to its full command set.TABLE1. SOFTWARE COMMAND DEFINITIONSFirst Bus Second Bus Third Bus Fourth Bus Fifth Bus Sixth Bus Command Bus Cycle Cycle Cycle Cycle Cycle CycleCycle Addr Data Addr Data Addr Data Addr Data Addr Data Addr Data Reset 1XXXH F0HRead1RA RDRead Silicon ID Word4555H AAH2AAH55H555H90H ADI DDIByte4AAAH AAH555H55H AAAH90H ADI DDISector Protect Word4555H AAH2AAH55H555H90H(SA)XX00HVerify x02H XX01HByte4AAAH AAH555H55H AAAH90H(SA)00Hx04H01HPorgram Word4555H AAH2AAH55H555H A0H PA PDByte4AAAH AAH555H55H AAAH A0H PA PDChip Erase Word6555H AAH2AAH55H555H80H555H AAH2AAH55H555H10H Byte6AAAH AAH555H55H AAAH80H AAAH AAH555H55H AAAH10H Sector Erase Word6555H AAH2AAH55H555H80H555H AAH2AAH55H SA30H Byte6AAAH AAH555H55H AAAH80H AAAH AAH555H55H SA30H Sector Erase Suspend1XXXH B0HSector Erase Resume1XXXH30HUnlock for sector6555H AAH2AAH55H555H80H555H AAH2AAH55H555H20H protect/unprotectNote:1. ADI = Address of Device identifier; A1=0, A0 = 0 for manufacture code,A1=0, A0 = 1 for device code, A2~A17=do not care. (Refer to table 3)DDI = Data of Device identifier : C2H for manufacture code, 23H/ABH (x8) and 2223H/22ABH (x16) for device code.X = X can be VIL or VIHRA=Address of memory location to be read.RD=Data to be read at location RA.2.P A = Address of memory location to be programmed.PD = Data to be programmed at location P A.SA = Address to the sector to be erased.3.The system should generate the following address patterns: 555H or 2AAH to Address A10~A0 in word mode/AAAH or 555H to Address A10~A-1 in byte mode.Address bit A11~A17=X=Don't care for all address commands except for Program Address (P A) and SectorAddress (SA). Write Sequence may be initiated with A11~A17 in either state.4. For Sector Protect Verify operation:If read out data is 01H, it means the sector has been protected. If read out data is 00H, it means the sector is still not being protected.PinsCEOEWEA0A1A6A9Q0 ~ Q15ModeRead Silicon ID LLHLLXV ID (2)C2H (Byte mode)Manfacturer Code(1)00C2H (Word mode)Read Silicon ID LLHHLXV ID (2)23H/ABH (Byte mode)Device Code(1)2223H/22ABH (Word mode)Read L L H A0A1A6A9D OUT Standby H X X X X X X HIGH Z Output Disable L H H X X X X HIGH Z WriteL HLA0A1A6A9D IN (3)Sector Protect with 12V LV ID (2)LXXLV ID (2)Xsystem(6)Chip Unprotect with 12V LV ID (2)LXXHV ID (2)Xsystem(6)Verify Sector Protect LLHXHXV ID (2)Code(5)with 12V systemSector Protect without 12V LHLXXLHXsystem (6)Chip Unprotect without 12V LHLXXHHXsystem (6)Verify Sector Protect/Unprotect LLHXHXHCode(5)without 12V system (7)ResetXXXXXXXHIGH ZTABLE 2. MX29F400T/B BUS OPERATIONNOTES:1. Manufacturer and device codes may also be accessed via a command register write sequence. Refer to Table 1.2. VID is the Silicon-ID-Read high voltage, 11.5V to 12.5V .3. Refer to Table 1 for valid Data-In during a write operation.4. X can be VIL or VIH.5. Code=00H/XX00H means unprotected.Code=01H/XX01H means protected.A17~A12=Sector address for sector protect.6. Refer to sector protect/unprotect algorithm and waveform.Must issue "unlock for sector protect/unprotect" command before "sector protect/unprotect without 12V system" command.7. The "verify sector protect/unprotect without 12V sysytem" is only following "Sector protect/unprotect without 12V system"command.Note that the Erase Suspend (B0H) and Erase Resume (30H) commands are valid only while the Sector Erase operation is in progress. Either of the two reset com-mand sequences will reset the device(when applicable).COMMAND DEFINITIONSDevice operations are selected by writing specific address and data sequences into the command register. Writing incorrect address and data values or writing them in the improper sequence will reset the device to the read mode.T able 1 defines the valid register command sequences.READ/RESET COMMANDThe read or reset operation is initiated by writing the read/reset command sequence into the command reg-ister. Microprocessor read cycles retrieve array data.The device remains enabled for reads until the command register contents are altered.If program-fail or erase-fail happen, the write of F0H will reset the device to abort the operation. A valid com-mand must then be written to place the device in the desired state.SILICON-ID-READ COMMANDFlash memories are intended for use in applications where the local CPU alters memory contents. As such, manu-facturer and device codes must be accessible while the device resides in the target system. PROM program-mers typically access signature codes by raising A9 to a high voltage. However, multiplexing high voltage onto address lines is not generally desired system design practice.The MX29F400T/B contains a Silicon-ID-Read opera-tion to supplement traditional PROM programming meth-odology. The operation is initiated by writing the read silicon ID command sequence into the command regis-ter. Following the command write, a read cycle with A1=VIL,A0=VIL retrieves the manufacturer code of C2H/00C2H. A read cycle with A1=VIL, A0=VIH returns the device code of 23H/2223H for MX29F400T , ABH/22ABH for MX29F400B.SET-UP AUTOMATIC CHIP/SECTOR ERASE PinsA0A1Q15~Q8Q7Q6Q5Q4Q3Q2Q1Q0Code(Hex)Manufacture code Word VIL VIL 00H 1100001000C2H Byte VIL VIL X 11000010C2H Device code Word VIH VIL 22H 001000112223H for MX29F400T Byte VIH VIL X 0010001123H Device code Word VIH VIL 22H 1010101122ABH for MX29F400B ByteVIH VIL X 10101011ABHSector Protection X VIH X 0000000101H (Protected)VerificationXVIHX00H (Unprotected)TABLE 3. EXPANDED SILICON ID CODECOMMANDSChip erase is a six-bus cycle operation. There are two "unlock" write cycles. These are followed by writing the "set-up" command 80H. Two more "unlock" write cy-cles are then followed by the chip erase command 10H.The Automatic Chip Erase does not require the device to be entirely pre-programmed prior to executing the Au-tomatic Chip Erase. Upon executing the Automatic Chip Erase, the device will automatically program and verify the entire memory for an all-zero data pattern. When the device is automatically verified to contain an all-zero pattern, a self-timed chip erase and verify begin. The erase and verify operations are completed when the data on Q7 is "1" at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations.When using the Automatic Chip Erase algorithm, note that the erase automatically terminates when adequate erase margin has been achieved for the memory array(no erase verification command is required).If the Erase operation was unsuccessful, the data on Q5 is "1"(see T able 4), indicating the erase operation exceed internal timing limit.The automatic erase begins on the rising edge of the last WE or CE, whichever happens later, pulse in the command sequence and terminates when the data on Q7 is "1" and the data on Q6 stops toggling for two con-secutive read cycles, at which time the device returns to the Read mode.StatusQ7Q6Q5Q3Q2RY/BY Note1Note2Byte Program in Auto Program Algorithm Q7Toggle 0N/A No 0Toggle Auto Erase Algorithm0Toggle 01Toggle0Erase Suspend Read1No 0N/A Toggle1(Erase Suspended Sector)Toggle In ProgressErase Suspended ModeErase Suspend Read Data Data Data Data Data 1(Non-Erase Suspended Sector)Erase Suspend ProgramQ7Toggle 0N/A N/A 0Byte Program in Auto Program AlgorithmQ7Toggle 1N/A No 0Toggle ExceededTime Limits Auto Erase Algorithm0Toggle 11Toggle 0Erase Suspend ProgramQ7Toggle1N/AN/Aerase margin has been achieved for the memory array (no erase verification command is required). Sector erase is a six-bus cycle operation. There are two "un-lock" write cycles. These are followed by writing the set-up command 80H. T wo more "unlock" write cycles are then followed by the sector erase command 30H. The sector address is latched on the falling edge of WEor CE, whichever happens later, while the command(data)is latched on the rising edge of WE or CE, whichever happens first. Sector addresses selected are loaded into internal register on the sixth falling edge of WE or CE, whichever happens later. Each successive sector load cycle started by the falling edge of WE or CE, which-ever happens later, must begin within 30us from the rising edge of the preceding WE or CE, whichever hap-pens First, otherwise, the loading period ends and inter-nal auto sector erase cycle starts. (Monitor Q3 to deter-mine if the sector erase timer window is still open, see section Q3, Sector Erase Timer.) Any command other than Sector Erase(30H) or Erase Suspend(B0H) during the time-out period resets the device to read mode.SECTOR ERASE COMMANDSThe Automatic Sector Erase does not require the de-vice to be entirely pre-programmed prior to executing the Automatic Set-up Sector Erase command and Auto-matic Sector Erase command. Upon executing the Au-tomatic Sector Erase command, the device will auto-matically program and verify the sector(s) memory for an all-zero data pattern. The system is not required to provide any control or timing during these operations.When the sector(s) is automatically verified to contain an all-zero pattern, a self-timed sector erase and verify begin. The erase and verify operations are complete when the data on Q7 is "1" and the data on Q6 stops toggling for two consecutive read cycles, at which time the device returns to the Read mode. The system is not required to provide any control or timing during these operations.When using the Automatic Sector Erase algorithm, note that the erase automatically terminates when adequate Table 4. Write Operation StatusNote:1.Q7 and Q2 require a valid address when reading status information. Refer to the appropriate subsection for further details.2.Q5 switches to '1' when an Auto Program or Auto Erase operation has exceeded the maximum timing limits.See "Q5:Exceeded Timing Limits " for more information.ERASE SUSPENDThis command only has meaning while the state ma-chine is executing Automatic Sector Erase operation, and therefore will only be responded during Automatic Sector Erase operation. When the Erase Suspend com-mand is written during a sector erase operation, the de-vice requires a maximum of 100us to suspend the erase operations. However, When the Erase Suspend command is written during the sector erase time-out, the device immediately terminates the time-out period and suspends the erase operation. After this command has been ex-ecuted, the command register will initiate erase suspend mode. The state machine will return to read mode auto-matically after suspend is ready. At this time, state ma-chine only allows the command register to respond to the Read Memory Array, Erase Resume and program commands.The system can determine the status of the program operation using the Q7 or Q6 status bits, just as in the standard program operation. After an erase-suspend pro-gram operation is complete, the system can once again read array data within non-suspended sectors. ERASE RESUMEThis command will cause the command register to clear the suspend state and return back to Sector Erase mode but only if an Erase Suspend command was previously issued. Erase Resume will not have any effect in all other conditions.Another Erase Suspend command can be written after the chip has resumed erasing.SET-UP AUTOMATIC PROGRAMCOMMANDSTo initiate Automatic Program mode, A three-cycle com-mand sequence is required. There are two "unlock" write cycles. These are followed by writing the Automatic Pro-gram command A0H.Once the Automatic Program command is initiated, the next WEor CE, pulse causes a transition to an active programming operation. Addresses are latched on the falling edge, and data are internally latched on the rising edge of the WE or CE, whichever happens first, pulse. The rising edge of WE or CE, whichever happens first, also begins the programming operation. The sys-tem is not required to provide further controls or timings. The device will automatically provide an adequate inter-nally generated program pulse and verify margin.If the program opetation was unsuccessful, the data on Q5 is "1"(see T able 4), indicating the program operation exceed internal timing limit. The automatic programming operation is completed when the data read on Q6 stops toggling for two consecutive read cycles and the data on Q7 and Q6 are equivalent to data written to these two bits, at which time the device returns to the Read mode(no program verify command is required).DATA POLLING-Q7The MX29F400T/B also features Data Polling as a method to indicate to the host system that the Auto-matic Program or Erase algorithms are either in progress or completed.While the Automatic Programming algorithm is in opera-tion, an attempt to read the device will produce the complement data of the data last written to Q7. Upon completion of the Automatic Program Algorithm an at-tempt to read the device will produce the true data last written to Q7. The Data Polling feature is valid after the rising edge of the fourth WEor CE, whichever happens first, pulse of the four write pulse sequences for auto-matic program.While the Automatic Erase algorithm is in operation, Q7 will read "0" until the erase operation is competed. Upon completion of the erase operation, the data on Q7 will read "1". The Data Polling feature is valid after the rising edge of the sixth WE or CE, whichever happens first pulse of six write pulse sequences for automatic chip/ sector erase.The Data Polling feature is active during Automatic Pro-gram/Erase algorithm or sector erase time-out.(see sec-tion Q3 Sector Erase Timer)RY/BY:Ready/BusyThe RY/BY is a dedicated, open-drain output pin that indicates whether an Automatic Erase/Program algorithm is in progress or complete. The RY/BY status is valid after the rising edge of the final WE or CE, whichever happens first, pulse in the command sequence. Since RY/BY is an open-drain output, several RY/BY pins can be tied together in parallel with a pull-up resistor to Vcc.Q2:Toggle Bit IIThe "Toggle Bit II" on Q2, when used with Q6, indicates whether a particular sector is actively eraseing (that is,the Automatic Erase alorithm is in process), or whether that sector is erase-suspended. Toggle Bit I is valid af-ter the rising edge of the final WE or CE, whichever hap-pens first, pulse in the command sequence.Q2 toggles when the system reads at addresses within those sectors that have been selected for erasure. (The system may use either OE or CE to control the read cycles.) But Q2 cannot distinguish whether the sector is actively erasing or is erase-suspended. Q6, by com-parison, indicates whether the device is actively eras-ing, or is in Erase Suspend, but cannot distinguish which sectors are selected for erasure. Thus, both status bits are required for sectors and mode information. Refer to T able 4 to compare outputs for Q2 and Q6.Reading Toggle Bits Q6/ Q2Whenever the system initially begins reading toggle bit status, it must read Q7-Q0 at least twice in a row to determine whether a toggle bit is toggling. Typically, the system would note and store the value of the toggle bit after the first read. After the second read, the system would compare the new value of the toggle bit with the first. If the toggle bit is not toggling, the device has completed the program or erase operation. The system can read array data on Q7-Q0 on the following read cycle.However, if after the initial two read cycles, the system determines that the toggle bit is still toggling, the sys-tem also should note whether the value of Q5 is high (see the section on Q5). If it is, the system should then determine again whether the toggle bit is toggling, since the toggle bit may have stopped toggling just as Q5 went high. If the toggle bit is no longer toggling, the device has successfuly completed the program or erase opera-tion. If it is still toggling, the device did not complete the operation successfully, and the system must write the reset command to return to reading array data.The remaining scenario is that system initially determines that the toggle bit is toggling and Q5 has not gone high.The system may continue to monitor the toggle bit and Q5 through successive read cycles, determining the sta-tus as described in the previous paragraph. Alterna-tively, it may choose to perform other system tasks. In this case, the system must start at the beginning of the algorithm when it returns to determine the status of the operation.Q6:Toggle BIT IT oggle Bit I on Q6 indicates whether an Automatic Pro-gram or Erase algorithm is in progress or complete, or whether the device has entered the Erase Suspend mode.T oggle Bit I may be read at any address, and is valid after the rising edge of the final WE or CE, whichever happens first, pulse in the command sequence(prior to the program or erase operation), and during the sector time-out.During an Automatic Program or Erase algorithm opera-tion, successive read cycles to any address cause Q6to toggle. The system may use either OE or CE to con-trol the read cycles. When the operation is complete, Q6stops toggling.After an erase command sequence is written, if all sec-tors selected for erasing are protected, Q6 toggles and returns to reading array data. If not all selected sectors are protected, the Automatic Erase algorithm erases the unprotected sectors, and ignores the selected sectors that are protected.The system can use Q6 and Q2 together to determine whether a sector is actively erasing or is erase sus-pended. When the device is actively erasing (that is, the Automatic Erase algorithm is in progress), Q6 toggling.When the device enters the Erase Suspend mode, Q6stops toggling. However, the system must also use Q2to determine which sectors are erasing or erase-sus-pended. Alternatively, the system can use Q7.If a program address falls within a protected sector, Q6toggles for approximately 2 us after the program com-mand sequence is written, then returns to reading array data.Q6 also toggles during the erase-suspend-program mode,and stops toggling once the Automatic Program algo-rithm is complete.T able 4 shows the outputs for Toggle Bit I on Q6.If the output is low (Busy), the device is actively erasing or programming. (This includes programming in the Erase Suspend mode.)If the output is high (Ready), the device is ready to read array data (including during the Erase Suspend mode), or is in the standby mode.T able 4 shows the outputs for RY/BY .。

SingleDual IGBT Snubber Capacitor Modules

Type SCMT Single/Dual IGBT Snubber Capacitor ModulesApplicationsdual IGBT modules from overvoltage, Figure 1. Style SCMTclamp snubber where single IGBT modules are used, Figure 2. Highlights•Mount directly to the IGBT module• 1 or 2 wire taps for connecting external resistor•Low inductance• Flame resistant case and epoxy, meets UL 94VO •Low Loss• Other terminal pitches and capacitance values available.•Hyperfast diodes integrated into •packageDischarge Restrictive De-couplingsame principles as the de-coupling capacitor, but only during turn-off switching. As the IGBT turns off, energy trapped in the loop inductance is transferred to the capacitor. The diode blocks oscillations from occurring and excess charge onresistor.RCD ClampThe function of this snubber is similar to a clamp,biased and the snubber is activated. The energy trapped in the stray inductance is absorbed by the snubber capacitor. During turn-on the snubbera discharge path through the forward biasedresistors. This reduces the reverse recovery voltage transient.SCMT型单个或双个IGBT突波吸收密封盒装电容器使用SCMT型目的就像是放电限制分离耦合，是保护双IGBT模块。

CL10B474KA8NNNC中文资料

物料编号CL10B474KA8NNNC参数_易容网
MLCC即是多层陶瓷电容片式，是电子信息产品不可或缺的基本组件之一。

我国MLCC的生产起步在80年代初，行业早期主要是在外资企业的带动下发展起来的，近年来国内企业在技术上实现突破，行业国产化成效显著，并推动了MLCC产量迅速增长。

目前，MLCC的应用领域已从手机、电脑、电视机等消费电子领域，逐步拓展到新能源发电、新能源汽车、节能灯具、轨道交通、直流输变电、三网融合、高清电视、机顶盒、手机电视等多个行业。

对于这个悄悄活跃在人们生活中的元件你又知道多少呢.
本次易容网为大家推荐比较常用的MLCC三星 | Samsung品牌的料号CL10B474KA8NNNC相关参数
易容网是深圳市易容信息技术有限公司独自研发的全球最大的MLCC搜索采购服务网站，2014年创立于深圳市南山区，全国首家电子元器件行业电容元件的搜索引擎及o2o商务服务平台。

易容网（）现已建成全球最大的MLCC电容搜索引擎数据库，包含全球25家电容生产厂商超过28万组MLCC产品数据，用户可根据行业应用、物料编号、规格参数等信息快速的找到所有相关的MLCC电容数据。

易容网在搜索服务的前提下还提供村田、TDK、国巨、太阳诱电、风华高科等常见品牌产品的o2o商务服务，让企业客户实现询价、报价、在线订单、出库、实时物流、签收、账期服务等在线一站式商务服务体验。

菱科LK600系列变频器中文说明书

1、顶部/底部以及两侧所需的间隙对敞开机架型（IP00）和封闭壁挂型(IP20)是同样的。 2、变频器的许可入口空气温度为敞开机架型：-10℃ - +45℃ 封闭机架型：-10℃ - +40℃ 3、上部和下部区域要留有足够的散热空间，以便进出变频器的进气和排气通畅。
3、接线
警告
●只有在确认电源断开后才能开始接线。不遵守这一条警告会导致电击或着火。 ●接线只能由专业操作人员进行。不遵守这一条警告会导致电击或着火。 ●当连接紧急停止回路时，接线后必需检查动作。不遵守这一条警告会导致人身伤害。 ●所有引线的耐压须与变频器的电压等级相符。不遵守这一条警告会导致人身伤害。
按照下述方法取下和重新装上数字操作器：取下数字操作器。按向下方向按压数字操作器的锁定扣子，可把数字操作器从前盖上取出。重新装上数字操作器。把数字操作器压入面板键盘框上，锁定扣子会自动锁住数字操作器。
2-3、选择安装变频器的环境
为了保证完好的性能和长期工作的寿命，LK600 系列变频器选择安装环境时应遵守下列建议，保护变频器免遭下列条件的侵害：
1 --
Print to PDF without this message by purchasing novaPDF (/)
6-8、保护参数……………………………………………………………… ……… …… … 49 6-9、其它功能…………………………………………………………… ………………… 53 6-10、RS-485 控制…………………………………………………………………………54
2-4、安装间隙 LK600 系列变频器垂直安装时，要留有足够的散热空间，以保证有效地冷却.错误!未找到引用
源。
LK600 系列变频器的安装空间 ★ 注意

冷王制冷机组参数

冷王制冷机组参数1.引言1.1 概述冷王制冷机组参数是指用于冷王制冷机组的一系列参数。

冷王制冷机组是一种常用的制冷设备，广泛应用于各种工业和商业场所。

冷王制冷机组参数包括了机组的工作压力、流量、温度等信息。

这些参数对于机组的运行状态和性能有着重要的影响。

在设计和选择冷王制冷机组时，合理的参数选择是十分重要的。

不同的使用环境和需求会对机组参数有所不同。

因此，准确把握冷王制冷机组参数的概念和要点，对于确保机组的运行效果和节能效果具有重要意义。

本篇文章将介绍冷王制冷机组参数的概述，并重点阐述几个关键要点。

通过深入了解和研究这些参数，我们可以更好地理解冷王制冷机组的工作原理和性能特点，进而优化其运行和调整。

同时，也能为今后的研究和应用提供参考和指导。

接下来的章节将分别对冷王制冷机组参数的概述、要点1和要点2进行详细介绍。

通过对这几个方面的讨论，我们可以全面地认识和了解冷王制冷机组参数的重要性和实际应用。

最后，在结论部分，将对本文的内容进行总结，并对冷王制冷机组参数的意义和未来展望进行探讨。

文章结构部分的内容应包括对整篇文章的组织和框架进行概述和介绍。

下面是一个示例：1.2 文章结构本文主要介绍冷王制冷机组的参数，并对其进行详细分析和探讨。

文章分为引言、正文和结论三个部分。

具体结构如下：引言部分将概述文章的背景和目的，以及本文所要讨论的冷王制冷机组参数的重要性和实际应用价值。

正文部分将详细介绍冷王制冷机组参数的概述、要点1和要点2。

在2.1节中，我们将对冷王制冷机组参数进行整体概述，包括其基本定义、分类、常见测量方法等内容。

在2.2节和2.3节中，我们将侧重探讨冷王制冷机组参数的关键要点，从多个角度进行分析和解释。

结论部分将对本文的主要内容进行总结，并指出冷王制冷机组参数的意义和展望。

在3.1节中，我们将对本文的主要观点和结论进行概括性总结。

在3.2节中，我们将展望冷王制冷机组参数在未来的发展方向和应用前景。

IN4747A中文资料

1N4728A - 1N4764A Zeners
元器件交易网
1N4728A - 1N4764A
Zeners
January 2005
DO-41 Glass case
COLOR BAND DENOTES CATHODE
Absolute Maximum Ratings * Ta = 25°C unless otherwise noted
1N4733A 1N4734A 1N4735A 1N4736A 1N4737A
1N4738A 1N4739A 1N4740A 1N4741A 1N4742A
1N4743A 1N4744A 1N4745A 1N4746A 1N4747A
1N4748A 1N4749A 1N4750A 1N4751A 1N4752A
XY XY XY XY XY
XY XY XY XY XY
XY XY XY XY XY
XY XY
3 1N4728A - 1N4764A Rev. G2

1N4728A - 1N4764A Zeners
元器件交易网
Top Mark Information (Continued)
7.0 Devices shall be marked as required in the device specification (PID or FSC Test Spec).
8.0 Maximum no. of marking lines: 5
9.0 Maximum no. of digits per line: 3
1N4738A 1N4739A 1N4740A 1N4741A 1N4742A
1N4743A 1N4744A 1N4745A 1N4746A 1N4747A

中英文安装说明书20111年_FCC_

Enclosure Climate Control Unit工业控制柜制冷机Assembly Instructions安装说明书（FCC系列）雷子克（广州）电气设备有限公司 Let Us Take You To The Top...3.3顶装按照开孔图开孔, 再锁紧制冷机底部内置的螺丝孔保证制冷机与控制柜的固定与密封。

4．安全与注意安全提示¾制冷机为精密电气，搬运务必轻放，严禁倒置，倾斜存放。

¾安装制冷机前，应该先取开外壳，（松开制冷机顶部的螺丝，由下向上垂直推卸外壳），把制冷机安装上控制柜后再把外壳装上制冷机（靠紧制冷机四周边框，由上向下卡入钩环，再拧紧制冷机顶部的两粒螺钉）¾因制冷机为无冷凝水设计，制冷机的出水管只为安全备份使用，正常使用时无水导出，不必考虑冷凝水的处理。

注意事项¾制冷机在灰尘大，或油性，毛绒的环境务必及时清理过滤网，否则会影响制冷机性能。

¾制冷机入风口需安装到控制柜体的上部。

¾控制柜外的温度不能超过55摄氏度，但短暂的高温并不影响制冷机运作。

¾包装应完好，如果发现制冷机有油渍，极有可能是泄漏制冷剂，包装的任何损坏都有可能引起制冷机的故障。

¾控制柜必须达到IP54，如果控制柜有漏洞或缝隙，冷凝水可能会发生。

¾制冷机之间或制冷机与墙壁距离至少不小于200mm¾在控制柜内部，制冷机入风和出风口不可有障碍物阻塞。

¾制冷机需水平安装、使用，最大倾斜角度不大于2°¾维护及送电必须由专业人员操作。

¾为避免冷凝物的形成，建议采用门位开关，保证当控制柜门打开时，制冷机必须关闭。

¾控制柜内部的电气元件的热释放不能超过制冷机可用制冷功率，否则会出现制冷机长期运作。

¾不可用任何方式修改制冷机。

5．电气联接电压与频率必须与制冷机的铭牌相匹配，在制冷机电气联接前端不可有其他的温度控制，制冷机上回路电保护元件应与制冷机额定功率相吻合，在安装时参考相关说明。

阿特拉斯空压机机型代表

阿特拉斯空压机机型代表阿特拉斯空压机说明书介绍及阿特拉斯空压机机型代表阿特拉斯空压机说明书内容包括以下十二大类：安全措施、概述、Elektronikon® 控制器，Elektronikon® Graphic 控制器、安装、操作说明、保养、调整和维护保养步骤、排除故障、技术数据、使用说明，检查指南。

阿特拉斯空压机说明书机型代表Z系列代表无油机ZA单级压缩（水冷，压力在3.5bar左右）ZR双级压缩（水冷，压力在7.5~10 bar左右）ZT双级压缩（风冷，压力在7.5~10bar）ZE单级压缩（风冷，压力在3.5~4bar）ZH700-150000离心机，双级，三级压缩机型代表G系列代表喷油机GA单级压缩,流量0.82~84.7m3/min,功率5.5~500KW(3,5,7,11,15,18,22,30,37,45,55,75,90,110,132,160,180,200,250,315,355,400,450, 500),排气压力7.5bar,8.5bar,10bar,13barGR双级压缩GX小型移动式螺杆机,流量0.24~1.6m/min。

率2~11KW(2,3,4,5,6,7,11)排气压力7.5bar~13bar。

GAR系列铁路机车车辆专用喷油螺杆压缩机,流量0.6~3.7m,功率5~30KW。

Z系列代表无油机ZA单级压缩(水冷,压力在3.5bar左右)ZE单级压缩(风冷,压力在3.5~4bar)ZT双级压缩(风冷,压力在7.5~10bar)ZR双级压缩(水冷,压力在7.5~10 bar左右)X系列代表移动机XAS:单级压缩,低风压压力在4~13bar左右XRV:双级压缩,高风压SF系列无油涡漩压缩机:流量0.16~1.2m/min,功率1.5~22KW排气压力8bar,10bar。

FX系列冷冻式干燥器:流量0.42~74.2m3/minDD/PD/QD系列精密过滤器:流量0.54m3/min~432m3/min机组系列号分类AII:GA90以下原装进口机(不包括GA90)AIF:FA90以上原装进口机(包括GA90以及所以无油机)ARP:年限较久的空压机,1990年以前生产的。

常用功率管参数

有刷/无刷电调常用功率管参数大全(若以上无你所需型号请留言)08年8月21日更新A2700 N型管(贴片)耐压：30V电流：9A导通电阻：7.3mΩSI4336 N型管(贴片)耐压：30V电流：22A导通电阻：4.2mΩSI4404 N型管(贴片)耐压：30V电流：17A导通电阻：8mΩSI4410 N型管(贴片)耐压：30V电流：10A导通电阻：14mΩSI4420 N型管(贴片)耐压：30V电流：10A导通电阻：10mΩSI4812 N型管(贴片)耐压：30V电流：7.3A导通电阻：28mΩSI9410 N型管(贴片)耐压：30V电流：6.9A导通电阻：50mΩIRF7313 N型管(贴片)耐压：30V电流：6A导通电阻：29mΩIRF7413 N型管(贴片) 耐压：30V电流：12A导通电阻：18mΩIRF7477 N型管(贴片) 耐压：30V电流：11A导通电阻：20mΩIRF7805Z N型管(贴片) 耐压：30V电流：16A导通电阻：6.8mΩIRF7811 N型管(贴片) 耐压：30V电流：11A导通电阻：12mΩIRF7831 N型管(贴片) 耐压：30V电流：16A导通电阻：0.004ΩIRF7832 N型管(贴片) 耐压：30V电流：20A导通电阻：4mΩIRF8113 N型管(贴片)耐压：30V电流：17A导通电阻：5.6mΩTPC8003 N型管(贴片) 耐压：30V电流：12A导通电阻：6mΩFDS6688 N型管(贴片) 耐压：30V电流：16A导通电阻：0.006ΩFDD6688 TO-252贴片耐压：30V电流：84A导通电阻：5mΩA2716 P型管(贴片)耐压：30V电流：7A导通电阻：11.3mΩSI4405 P型管(贴片) 耐压：30V电流：17A导通电阻：7.5mΩSI4425 P型管(贴片)耐压：30V电流：9A导通电阻：19mΩSI4435 P型管(贴片) 耐压：30V电流：8A导通电阻：20mΩSI4463 P型管(贴片)耐压：20V电流：12.3A导通电阻：16mΩSI9435 P型管(贴片) 耐压：30V电流：5.3A导通电阻：50mΩIRF7424 P型管(贴片)电流：8.8A导通电阻：22mΩSTM4439A P型管(贴片) 耐压：30V电流：14A导通电阻：18mΩFDS6679 P型管(贴片) 耐压：30V电流：13A导通电阻：9mΩBUZ111S N型管(直插) 耐压：55V电流：80A导通电阻：8mΩ5N05 N型管(直插)耐压：50V电流：75A导通电阻：0.0095Ω6N60 N型管(直插)耐压：600V电流：5.5A导通电阻：0.75Ω50N03L N型管(直插)耐压：25V电流：28A导通电阻：21mΩ60N06 N型管(直插)耐压：60V电流：60A导通电阻：14mΩBTS110 N型管(直插) 耐压：100V导通电阻：200mΩBTS120 N型管(直插)耐压：100V电流：19A导通电阻：100mΩIRF15 0 N型管(铁壳非直插) 耐压：100V电流：40A导通电阻：55mΩIRF1405 N型管(直插)耐压：55V电流：131A导通电阻：5.3mΩIRF2804 N型管(直插)耐压：40V电流：75A导通电阻：2mΩIRF3205 N型管(直插)耐压：55V电流：110A导通电阻：8mΩIRF3703 N型管(直插)耐压：30V电流：210A导通电阻：2.3mΩIRL3803 N型管(直插)耐压：30V电流：140A导通电阻：6mΩ。