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诺基亚手机CPU频率一览

诺基亚手机CPU频率一览

诺基亚手机CPU频率一览诺基亚手机(CPU)频率一览转的有兴趣,就看看,毕竟知道下自己爱机的CPU类型型号类型处理器类型架构频率Nokia 3230 RM-51 32-bit RISC CPU ARM-9 123 MHz ; Nokia 3600 NHM-10 32-bit RISC CPU ARM-9 104 MHz Nokia 3620 NHM-10(X) 32-bit RISC CPU ARM-9 104 MHz ' Nokia3650 NHL-8 32-bit RISC CPU ARM-9 104 MHzNokia 3660 NHL-8X 32-bit RISC CPU ARM-9 104 MHzNokia 6260 RM-25 32-bit RISC CPU ARM-9 123 MHz Nokia 6600 NHL-10 32-bit RISC CPU ARM-9 104 MHz Nokia 6620 NHL-12 32-bit RISC CPU ARM-9 150 MHz Nokia 6630 RM-1 TIOMAP 1710 ARM-926 220 MHzNokia 6670 RH-67 32-bit RISC CPU ARM-9 123 MHz Nokia 6670B RH-68 32-bit RISC CPUARM-9 123 MHzNokia 6680 RM-36 TI OMAP1710 ARM-926 220 MHzNokia 6681 RM-57 TI OMAP1710 ARM-926 220 MHzNokia 6682 RM-58 TI OMAP1710 ARM-926 220 MHzNokia 7610 RM-51 32-bit RISC CPUARM-9 123 MHzNokia 7610B RH-52 32-bit RISC CPUARM-9 123 MHzNokia 7650 NHL-2(NA); 32-bit RISC CPUARM-9 104 MHzNokia 770 SU-18 TI OMAP1710 ARM-926 220 MHzNokia 7710 RM-12 32-bit RISC CPUARM-9 150 MHzNokia 9210 RAE-3(N); 32-bit RISC CPUARM-9 52 MHzNokia 9210c RAE-3(N); 32-bit RISC CPUARM-9 52 MHzNokia 9210i RAE-5(N); 32-bit RISC CPUARM-9 52 MHzNokia 9290 RAB-3(N); 32-bit RISC CPUARM-9 52 MHzNokia 9300 RAE-6(N); TI OMAP 1510 ARM-925 150 MHNokia 9300B RA-4 TI OMAP1510 ARM-925 150 MHz1510 ARM-925 150 MHNokia 9500 RA-2 TI OMAP1510 ARM-925 150 MHzNokia 9500B RA-3 TI OMAP1510 ARM-925 150 MHzNokia E50-1 RM-170 TI OMAP1710 ARM-926 220 MHzNokia E50-2 RM-171 TI OMAP1710 ARM-926 220 MHzNokia E60 RM-49 TI OMAP1710 ARM-926 220 MHzNokia E61 RM-89 TI OMAP1710 ARM-926 220 MHNokia E62-1 RM-8 TI OMAP1710 ARM-926 220 MHzNokia E62-1 RM-8A TI OMAP1710 ARM-926 220 MHzNokia E70-1 RM-10 TI OMAP1710 ARM-926 220 MHzNokia E70-2 RM-24 TI OMAP1710 ARM-926 220 MHzNokia N-Gage NEM-4 32-bit RISCCPU ARM-9 104 MHzNokia N-Gage QD RH-29 32-bit RISC CPU ARM-9 104 MHzNokia N-Gage QDA RH-47 32-bit RISC CPUARM-9 104 MHzNokia N70-1 RM-84 TI OMAP1710 ARM-926 220 MHzNokia N70-5 RM-99 TI OMAP1710 ARM-926 220 MHzNokia N71-1 RM-67 TI OMAP1710 ARM-926 220 MHzNokia N71-5 RM-112 TI OMAP1710 ARM-926 220 MHz ,Nokia N72-5 RM-180 TI OMAP1710 ARM-926 220 MHzNokia N73-1 RM-133 TI OMAP1710 ARM-926 220 MHzNokia N73-? RM-132 TI OMAP1710 ARM-926 220 MHzNokia N80-1 RM-92 TI OMAP1710 ARM-926 220 MHz1710 ARM-926 220 MHzNokia N90-1 RM-42 TI OMAP1710 ARM-926 220 MHzNokia N91-1 RM-43 TI OMAP1710 ARM-926 220 MHzNokia N91-5 RM-158 TI OMAP1710 ARM-926 220 MHzNokia N92 TI OMAP1710 ARM-926 220 MHzNokia N93-1 RM-55 TI OMAP2420 ARM-11 330 MHzNokia N93-5 RM-153 TI OMAP 2420 ARM-11 330 MHz分析NOKIA手机的CPU 让你认清N73,N95,6120c和57006600等机的CPU由于过于古老,在此不讨论从6630开始使用,在现在N73 N70 N72 N71等机用的是ARM9架构的德州仪器OMAP1710 CPU,频率220MHz,以下称为方案一N93 N93i N95 E90等强机使用的是ARM11架构 OMAP2420,频率330MHz,以下称为方案二N76 6610N 5700 6120C 6290等新出的NOKIA机子,使用ARM11架构 Freescale MXC300-30,称为方案三N93 N93i N95 E90等机不是一般能承受得起,在本文,重点讨论方案一和方案三在NOKIA的网站上,我们可以了解到方案一的CPU信息是Dual CPUCPU Type: ARM 9CPU Clock Rate: 220 MHz而方案三是Single CPUCPU Type: ARM 11CPU Clock Rate: 369 MHz关于这两个CPU的争论相当多,尤其是最近N76 5700等新机的速度相当快,得益于高CPU频率,但看了CPU信息后,大家都会产生疑问: 方案一是Dual CPU,方案三是Single CPU,从字面理解就是方案一是双核,方案三是单核,刚公布此消息时,不知其中道理的网友甚至还抱怨怎么换成单核的呢?本来已经够慢了,以后还要更慢? 在官方得到了解释(在GOOGLE找到,由于是E文,这里我给大家大概讲下意思)The"dual-CPU" in the case of N71 means that theres_disibledevent="TEXT-DECORATION: underline"href="/desktop_pc_index/subcate27_list_1.html" ; target=_blank>电脑用的双核CPU 这不像电脑上的双核和单核的关系,OMAP1710CPU,有一个核心运行在220MHz,用于处理手机的用户界面,多媒体应用,JAVA等等之类的应用(这里相当于电脑的CPU的功能),另外一个核心用于处理网络数据(也就是电话功能,打电话,发短信之内的,上网/3G也应该包括,但肯定不处理WIFI数据) 也就是说,OMAP1710是3G时代NOKIA采用的CPU,用此CPU的必有3G版本,以前的旧CPU机是没有3G的这样的好处是无论你运行多大的软件,占用了多少CPU资源,都不会影响到接电话这样的手机最基本功能再来看看 Freescale MXC300-30,方案三,从卖ARM芯片的网站上找到的介绍MXC300-30:3G手机用单核调制解调器处理器,能提供完整UTMS平台的,包括组合了基带和应用处理器,RF,功率放大器和功率管理,高达250MHz的StarCore SC140 DSP,高达532MHz的ARM11应用处理器,四波段GSM850/900/1800/1900MHz,WCDMA三波段850/1900/2100MHz,UTMS数据速率: DL 384Kbps,UL384Kbps,HSDPA 为1.8Mbps(DL),GSM EDGE无线电接入网络(GERAN)数据速率(最大): DL236Kbps,UL 118Kbps,GPRS/EGPRS(EDGE)时隙,高达Class12(4d/4u),最适合的开放式操作系统如Linux和Symbian,不需要增加任何的处理器或加速器,用于GMSK的单天线干扰消除,集成了图像处理单元(IPU)视频加速器,无线连接特性包括支持A-GPS接口,蓝牙接口,以及支持无线LAN 802.11a/b/g接口和DVB-H接口,处理器可用在各种手持设备如MP3播放器,手持DVD播放器或数码相机成为全功能的智能移动蜂窝设备由此可以看出,FreescaleMXC300-30是一个物美价廉的好U,一个CPU解决大部分问题,且频率高,价格便宜而且相当的省电,比OMAP1710省电得多.而且是相当的多(在另外一份介绍中讲到),这就可以解释为什么N76在369MHz的频率700mA/h在电池下能够正常使用差不多2天,追得上拥有1100mA/h的电池CPU频率只为220MHz的N73.NOKIA用此CPU的目的就是为了降低成本看上去MXC300-30一切都美好但事实上呢?很多人说MXC300-30性能不高,只是跟OMAP1710差不多,又说它单核比不过双核(这个问题前面已经说了,根本不是这样),反正就很多批判的话语.但是,从测试数据来看,N76,5700等机的性能全面超越N73,有些项目超了一倍(具体请看太平洋的评测)因此,单从性能来说,方案三的性能远超方案一毫无悬念不过不排除N76,5700等机型用的Symbian 9.2 FP1系统做的优化,但是从测试数据上分析,即使N73搭载Symbian 9.2 FP1,性能与N76还是会有差距那究竟方案三有什么不好呢?这个问题也困扰了我好久,终于在一个小论坛看到了一个用户对N76的抱怨,让我茅塞顿开那个人说:N76好快啊,但是播放MP4视频时很卡,在N73上都不卡,3GP没有此问题大家再看看这张图,对比用方案三的6290和方案一的N73大家可以看出6290是缺少AAC的硬支持的因此可以知道MXC300-30这个CPU是没有AAC的硬解码的,要播放AAC,就要用到CPU 去解码,消耗CPU资源,而N73是不需要的!(硬解码的好处是芯片内直接内置解码器,而不需要CPU去解码,就像现在的显卡硬解HDTV一样,CPU资源消耗奇低)结合论坛上的教程,很多论坛教大家压缩MP4时都推荐用AAC音频编码,而3GP则多数不用AAC因此结论很明显:用AAC作为音频编码的MP4格式在N76上消耗过多CPU资源,导致播放不流畅!这样思路就很清晰了,MXC300-30是频率制胜,少了增加成本的很多解码器,少了专用于电话功能的DSP,因此能在低成本下实现高速度而OMAP1710更注重应用,多媒体等方面,为了成本,NOKIA在中端机中使用220MHz频率.事实上可以证明,OMAP1710的通话质量,网络质量,音乐播放效果上是比MXC300-30要好,而MXC300-30在性能上远超OMAP1710,而且更加省电不过让MXC300-30的机拥有好音质也不是没有办法,像5700内置一个专用音乐DSP 处理音频(我认为是wolfson的),音质会很好因此音质的比较是5700>N73>N76,扩展一下就是有专用音乐芯片>OMAP1710>MXC300-30在总结之前,这里多说两句1.很多人去测N76,5700的CPU频率时,有的人测到369,有的人测到420多,其实MXC300-30这个CPU是可以变频的,当初发布时就已经说了此CPU在工艺上的进展能使它的频率达到1GHz(现在当然不可能啦),更深入的现在无法了解,反正大家先知道MXC300-30是可以变频的2.还有大家如果看了评测,可以发现N76在拥有40多M运行内存的情况下性能比只有10多M内存的5700高不了多少(在以前内存增大对S60机的效果是很明显的),这又是为什么呢?在NOKIA那里,我们找到了答案(E61用OMAP1710,E62用未知的CPU,虽然不是MXC300-30,但是从数据上看跟MXC300-30相当类似,应该也是Freescale的产品,而且XIP(以下讲到)的好处显而易见,MXC300-30应该也有XIP,虽然现在没有直接证据)In the NOKIA E61 the applications must be loaded tothe RAM for execution, whereas in the NOKIA E62 they can be directlyexecuted from their permanent locetion in Flash memory. Also the memorytypes are different between the two. So even though the NOKIA E61 andthe NOKIA E62 look the same, the internal HW is different, whichaffects the performance and characteristics. NOKIA E62 (and NOKIA E50): Single chip design /ARM9 235Mhz / 32MB SDRAM / 32 NOR + 128 NAND Flash / with XIP (eXecuteIn Place) support (execution from Flash)NOKIA E61 (and NOKIA E60, NOKIA E70): Dual chip design (with separate chip for cellular modem) Details of the application side chip: ARM9 220Mhz / 64 DDR SDRAM / 128 NAND Flash / without XIP (must be loaded to RAM) 以上内容总结一下,就是E62有XIP,而OMAP1710没有XIP,XIP的用途就是让CPU能够直接从储存卡中读取数据,而不用将数据先复制到运行内存,再由CPU处理,因此OMAP1710对内存依赖大,经常可以听到有人说N73会提示内存不足,而新CPU的机型还没有人说试过内存不足结合N76跟5700的性能差距不大的事实,我们有理由相信MXC300-30是有XIP的,因此N76的大内存主要目的应该是能同时运行更多的程序3.在MXC300-30的介绍文章中提到,MXC300-30最多能支持200象素的摄像头,这就可以理解为什么6290,N76,6110N,5700,6120C等机都是200象素的摄像头而不是更高了,当然,你说加个什么东西能够让它支持更高象素我不敢肯定,但是这样就不太符合NOKIA采用MXC300-30的初衷(降低成本)总结:方案一优点在于多媒体能力强,对于手机的基本功能:电话功能做得更好,虽然是dualcore,但是实际用起来就是单核,跟方案三一样,能够支持高象素得摄像头,基本除了慢没什么缺点.方案三优点在于速度快,相当的快,成本低,省电(很省电),缺点就是多媒体能力差,不能支持高象素摄像头 PS:N95等机型所用的OMAP2420跟OMAP1710是一个系列的,除了以下几点都跟OMAP1710差不多,好处相当明显1.频率为330MHz,很快,但是没有MXC300-30快,也不能变频,不知道有没有XIP2.内置3D加速器,在JAVA 3D的测试中能拿到900多分,N76只拿到200多,N73只有100多,因此N76虽然2D性能比N95好,但是3D性能差一大截,就在于这个,而且支持OpenGL特效(天啊)3.支持更高的分辨率,更高的摄像头象素(还没有体现)4.等等之类的因此我估计,以后NOKIA高端机会继续用OMAP2420甚至以后更高的型号,中低端则用MXC300-30,这样S60在全面迈进Symbian 9.2 FP1后就全部都变快了,S60开始进入黄金时期另外,最新发布的N81也是用方案三的,因为NOKIA要把N-Gage推广到全N系列(包括以前),用方案二很难推广,而且方案二成本高,部部都4000多以上最后:这大概就像是CORE 2 DUO1.66和P4 3.0的区别吧,大家个人喜好不同,各取所需解密NOKIA最新两代手机CPU的玄机以N95/6120C等为例大家也知道NOKIA最近新出的手机比如 N76,5700,6120C等是越来越便宜,最便宜的6210的水货价格甚至1.5K,而且配置上感觉越来越高。

(081016期发布)H3C产品价格清单(办事处)081113

(081016期发布)H3C产品价格清单(办事处)081113

H3C SecPath F1800-A 防火墙-电源模块 AC-PSE350-A-H3 H3C SecPath F1800-A 350W交流电源模块 20,000.00 DC-PSE350-D-H3 H3C SecPath F1800-A 350W直流电源模块 20,000.00 安全产品-附属设备 安全产品-可选内存 DDR SDRAM-256MB-333 内存条-DDR SDRAM-256MB-184PIN-3ns-333000KHz-2.5V320 DDR SDRAM-512MB-333 内存条-DDR SDRAM-512MB-184PIN-3ns-333000KHz-2.5V560 SDRAM-512MB-DDR2 512MB DDR2-533内存条 310 SDRAM-1GB-DDR2 1GB DDR2-533内存条 790 安全产品-可选CF卡 CF-256M-I 256M工业级CF卡 200 CF-512M Compact Flash 512MB 245 CF-1G Compact Flash 1G 460 安全产品-安装材料 安全产品-单根电缆 CAB-RPS-1m-AR2921 RPS电源线-1m-(H2X7(4.20))-(18UL2464(14C))-(H2X7(4 69 Cable-Power-AC 外部电源线-国标交流250V10A-3.00m-3*1.0mm^2-黑-(PI 20 SecPoint 客户端软件-软件 分销组合包 NS-Z2-9 H3C SecPathF100-A+SecPathF1000-A组合配置1(SecPathF 390,000.00 NS-Z2-13 H3C SecPath F100-C+SecPath F100-M 组合配置1(H3C SecPath F 135,000.00 NS-Z2-14 H3C SecPath F100-C+SecPath F100-M 组合配置2(H3C SecPath F 150,000.00 NS-SecPath F100-A-SI-AC H3C SecPath F100-A-SI 主机-交流电源(6FE/1Slot) 78,000.00 NS-SecPath F1000-C-AC H3C SecPath F1000-C 主机-双交流电源(4GE/2Slot) 180,000.00 安全产品-电源设备 18,000.00 AC-RPS800-A 一次电源RPS800-A-90Vac-264Vac输入-12V,17.25A;-54V IPS系列 H3C SecPath IPS系列 H3C SecPath T200系列 主设备 NS-SecPath T200(GT4) H3C SecPath T200-IPS 主机(4GE电口)-含一年特征库升级 680,000.00 NS-SecPath T200(GT4FT4) H3C SecPath T200-IPS 主机(4GE电口+4FE电口)-含一年特征库升级 740,000.00 840,000.00 NS-SecPath T200(GT4GP2) H3C SecPath T200-IPS 主机(4GE电口+2GE光口)-含一年特征库升级 NS-SecPath T200-E(GT4) H3C SecPath T200-E-IPS主机(4GE电口)-含一年特征库升级730,000.00 NS-SecPath T200-E(GT4FT4)3C SecPath T200-E-IPS主机(4GE电口+4FE电口)-含一年特征库升级 H 810,000.00 NS-SecPath T200-E(GT4GP2)3C SecPath T200-E-IPS主机(4GE电口+2GE光口)-含一年特征库升级 H 960,000.00 H3C SecPath T1000系列 主设备 NS-T1000-S+1Y H3C SecPath T1000-S-IPS主机(4GE电口+2SLOT)-含一年特征库升级 1,100,000.00 NS-T1000-M+1Y H3C SecPath T1000-M,IPS主机(4GE电口+2SLOT),含一年特征库升级 1,430,000.00 NS-T1000-A+1Y H3C SecPath T1000-A-IPS主机(4GE电口+2SLOT)-含一年特征库升级 1,700,000.00 H3C SecPath T5000-S3 系列 主设备 NS-T5000S+2M+GP16C8+1Y H3C SecPath T5000-S3主机,提供24端口千兆/百兆以太网光口 2,650,000.00 H3C SecPath T5000-S3 系列 电源 LSQM1AC650 H3C PSR650A 交流电源模块,650W 16,000.00 LSQM1DC650 H3C PSR650A 直流电源模块,650W 18,000.00 H3C IPS 管理系统 NSQM1IPSM H3C SecCenter组件-IPS Manager入侵防御管理系统-纯软件275,000.00 H3C SecPath IPS系列 接口模块 NS1M1GT4C0 4端口10/100/1000M Base-T电口模块-(RJ45) 80,000.00 NS1M1GX4C0 4端口1000M以太网光接口模块-(SFP,LC) 140,000.00 H3C SecPath IPS系列 SFP模块 SFP-GE-SX-MM850-A 光模块-SFP-GE-多模模块-(850nm,0.55km,LC) 5,000.00 SFP-GE-LX-SM1310-A 光模块-SFP-GE-单模模块-(1310nm,10km,LC) 9,900.00 SFP-GE-LH40-SM1310 光模块-SFP-GE-单模模块-(1310nm,40km,LC) 39,000.00 SFP-GE-LH40-SM1550 光模块-SFP-GE-单模模块-(1550nm,40km,LC) 47,000.00 SFP-GE-LH70-SM1550 光模块-SFP-GE-单模模块-(1550nm,70km,LC) 59,600.00 H3C SecPath PFC 系列 NS-SecPath PFC H3C SecPath PFC主机 20,000.00 NS1M18EPM H3C SecPath PFC-8电口保护模块 6,000.00 NS1M14FPM H3C SecPath PFC-4路光纤保护模块 60,000.00 H3C SecPath IPS系列,特征库升级 LIS-T200-SA-1Y H3C SecPath T200-特征库升级-1年,病毒库升级-1年 45,500.00 LIS-T200E-SA-1Y H3C SecPath T200-E-特征库升级-1年,病毒库升级-1年 51,500.00 63,500.00 LIS-T1000S-SA-1Y H3C SecPath T1000-S,特征库升级-1年,病毒库升级-1年 LIS-T1000M-SA-1Y H3C SecPath T1000-M,特征库升级-1年,病毒库升级-1年 95,000.00 LIS-T1000A-SA-1Y H3C SecPath T1000-A,特征库升级-1年,病毒库升级-1年 118,000.00

Mediatek_Wireless_Roadmap-2013-12-27

Mediatek_Wireless_Roadmap-2013-12-27

Confidential BMediaTek Roadmap UpdateDecember/27/2013Copyright © MediaTek Inc. All rights reserved.Confidential BAgenda▪ WiFi Market Update ▪ WiFi Networking Roadmap ▪ Beyond WiFiCopyright © MediaTek Inc. All rights reserved.2013/12/27-2-Confidential BWiFi Market UpdateCopyright © MediaTek Inc. All rights reserved.Smart Phone Say Hello to 802.11acConfidential BHTC New OneSamsung S4Sony Xperia Z Ultra C6802MediaTek13’Feb13’Mar13’Jun14’Q1Copyright © MediaTek Inc. All rights reserved.2013/12/27-4-11n vs. 11ac Transition100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 2013 2014 20152013/12/27 5Confidential BN300 takes entry level positionAC750/AC1200 replace N600 and get growth momentumAC-4SS (DBC) AC-3SS (DBC) AC-2SS (DBC) AC-2SS (FE, DBC) AC-1SS (DBC) 3SS (DBC) 2SS (DBC) 3SS 2SS 1SS20162017Copyright © MediaTek Inc. All rights reserved.Source: ABI, In-Stat, Mediatek IntelligenceMarket Dynamic▪ Router SKU Transition– – – – – –Confidential BN300 replaced N150 as 11n entry level router 11ac DBC router replaced 11n DBC router (AC1200 $79) LTE Smart Phone drive 11ac and NFC demand Normal power router + repeater to extend coverage Router 2.0 - Internet router (public cloud) + home router (personal cloud) Deep Packet Inspection (DPI) becomes mandatory function in mid-/high-end router▪ Next Generation Hotspot (Passpoint R2) moves Wi-Fi to the heart of the carrier network ▪ Home Security & Automation– – – – – Cloud & App, +touch panel for control Surveillance: WiFi Cloud IPC Security: BT Door Lock Home Automation: +Zigbee/Sub-1G for sensor network Healthcare: +BTLE2013/12/27 -6-Copyright © MediaTek Inc. All rights reserved.Confidential BWiFi Networking RoadmapCopyright © MediaTek Inc. All rights reserved.Confidential BAgenda▪ Chip Roadmap ▪ MT7620 Highlights ▪ MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27-8-11n Router RoadmapN600(GbE) N750(GbE) N900(GbE)RT6856 RT3593 RT3593 MT7530 • MIPS34KEc (700 MHz) • DDRI/DDRII, NAND/SPI • FE SW, 802.3az • USB2.0 (2), rGMII, PCIe (2) • IPSec Engine (140Mbps) • AES256-CBC • Storage AcceleratorCPUMPConfidential BMT7620ART3593 MT7530MT7620ART5592 MT7530• MT7530 GbE SW • 5p+2 rGMII • 802.3az EEE • Jumbo FrameN600MT7620ART5592MT7620AMT7530N300MT7620AMT7620N• • • • • • • • • •2x2 802.11n (300 Mbps) MIPS24KEc (580/600 MHz) SDR/DDRI/DDRII, NAND/SPI/SD-XC/eMMC FE SW, 802.3az USB, rGMII(2), PCIe 2Gbps HWNAT (IPv6) Storage Accelerator Lowest Power Consumption Best IOT w/ Intel6300 eCos IPv6 logo ready turnkey (2/8)MT762x• • • • • • • • • •2x2 802.11n (300 Mbps) MIPS24KEc (580 MHz) DDRI/DDRII, SPI/SD-XC/eMMC FE SW, 802.3az USB, PCIe AES128/256-CBC Calibration Free 5V/0.6A power adapter DRAM embedded ULC rBOM, PCBN300GMPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’1511ac Router Roadmap• MIPS1004K dual-core (880MHz) • 256KB L2 • DDRII/DDRIII, NAND/SPI/SD-XC • GbE SW, 802.3az EEE • USB 3.0, USB 2.0, rGMII, PCIe (3) • IPSec Engine (> 400Mbps) • HWNAT(IPv6)+BW Control • Storage Accelerator • NFC: MT6605 • SATAIII(2): 3rd PCIeCPUMPConfidential BAC1750(GbE)MT7621AMT7605E MT7615EAC1200(GbE)MT7621AMT7612E MT7602EMT7602E • LDPC, Beamforming • 256QAMMT7621AMT7612E MT7603EAC1200MT7603E • ULC • MCC • Airtime Fairness • 802.11v, 802.11j • Samples: Q1 2014• 4x4/4SS, 11ac stage2 • LDPC, Beamforming, MU-MIMO • 802.11v, 802.11j • CPU offload • Samples: Q4 2014MT7620AMT7612E• iPA • LDPC, Beamforming • Calibration FreeAC750MT7620AMT7610E• BeamformeeMPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’15Dongle RoadmapAC1300CPUMPConfidential BAC866MT7612U • USB 3.0 • LDPC, Beamforming • Calibration Free, iPAMT7662U • USB 3.0 • BT 4.0+HS, LDPC, Beamforming • Calibration Free, iPA • Linux, Android MT7650U • USB 2.0 • BT 4.0+HS • Beamformee • Linux, AndroidAC433MT7610U • USB 2.0 • BeamformeeN450RT3573N300RT5572 RT5372 • USB 2.0 • Calibration Free, SoftAP mode • QFN40-5x5 (Smallest) MT7670U • USB 2.0 • High Power MT7603U • USB 2.0 • Calibration Free • ULCN150MT7601U RT3070MPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’15PCIe Roadmap>AC1300CPUMPConfidential BMT7615E • 4x4/4SS, 11ac stage2 • LDPC, Beamforming, MU-MIMOAC866MT7612E • LDPC, Beamforming • Calibration Free, iPAAC433MT7610E • BeamformeeN450RT3593 • Calibration Free • LDPC, Beamforming • 256QAM • Calibration Free • 802.11j, 802.11v • 64QAMN300RT5592/EP RT5392MT7602E • USB 2.0 • Calibration Free, SoftAP mode • QFN40-5x5 (Smallest)MT7603EN150MT7601U RT3070MPQ1’14Q2’14Q3’14Q4’14Q1’15Q2’15MT7621 VPN Performance (>400Mbps)Confidential BVPN TunnelLAN:10.10.10.254Encrypti on DES 3DES AES-128 AES-192 AES-256 3DES AES-128 AES-192 AES-256 Authentication SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 SHA-1 MD5 DH Group DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH2 DH5 DH5 DH5 DH5 DH5 DH5 DH5 DH5NetScreen第一次 第二次 第三次503.963 415.579 450.942 552.657 597.048 546.626 507.185 588.509 422.110 380.032 457.272 455.986 444.925 332.600 448.310 422.465 423.996 505.989 507.322 504.105 421.491 549.283 399.405 395.676 382.091 510.567 398.124 381.551 540.925 508.904 360.313 562.598 420.892 473.680 420.030 472.003 510.725 476.088 517.963 512.740 380.029 502.125 454.674 420.783 557.360 478.124 421.747 552.370TCPTCPTCP平均449.617 465.0827 459.4313 509.5883 509.7547 523.999 474.851 498.975 394.7433 464.2413 436.69 419.44 514.4033 439.876 410.1233 512.4777Copyright © MediaTek Inc. All rights reserved.2013/12/27- 13 -MediaTek Technology RoadmapConfidential B20152014 {BBP} 1. BW 5/10 2. Airtime Fairness {MAC} 1. MCC 2. WiFi Positioning {SoC} KGD2013 {RF} DPD, 11ac iPA {BBP} LDPC, TxBF {MAC} STA-Proxy {SoC} HNAT+HQoS, VPN, Storage AcceleratorCopyright © MediaTek Inc. All rights reserved.{RF} 1. DPA 2. 4x4/4ss, 3. 11ac stage2 {BBP} 1. Smart Antenna v3 2. MU-MIMO2013/12/27- 14 -Software RoadmapReadyOpenWRT trunkOpenWRT (MT7620, 3.x)Confidential B2013 Q1 Q2 Q3 Q4 Q12014 Q2 Q3 Q42015 Q1 Q2●● OpenWRT(MT7620, 2.6.36)(RT5350, 3.x)● OpenWRT● OpenWRT(MT7621, 3.x)Linux SDK● SDK 4.1(MT7620, 2.6.36)● SDK 4.2(MT7621, 2.6.36)● SDK 5.0(Kernel 3.x)eCos OpenBSD● MT7620N/ ● MT7620NMT5350 SDK 2.4.1.4 (2/8M)● AC750 SDK2.4.3.0 (2/16M)● AC750 SDK2.4.5.0 (2/8M)eCos –IPv6 FreeBSD● MT7620N ● AC750 SDK3.0.3.0 (2/8M) - 15 2013/12/27IPv6 SDK 3.0.1.0 (2/16M)IPv6 SDK 3.0.2.0 (2/8M)● AC1200 SDK3.0.4.0 (2/8M)Copyright © MediaTek Inc. All rights reserved.Confidential BSDK 4.2 vs. 4.1 ComparisonSDK 4.1Kernel Chip 2.6.21 2.6.36 (RT6856, MT7620) RT3050, RT3052 RT3883, RT3662 RT3352, RT5350 RT6856, MT7620 GCC 3.4.2SDK 4.22.6.21 2.6.36 (RT6856, MT7620, MT7621) RT3050, RT3052 RT3883, RT3662 RT3352, RT5350 RT6856, MT7620 MT7621 GCC 4.6.3 (MT7621 default) (MT7620 option) uClibc 0.9.33.2 (MT7621 default) (MT7620 option) Fast path (MT7620, MT7621) Fast path (MT7620, MT7621) lighthttpd web server (BSD license) Linux 2.6.36 support 2.6.38 MT7620+MT7530 RT3883+MT7530 WM8960 YES (MT7621) 400Mbps (MT7621) YES xHCI (MT7621) Win8- 16 -DescriptionGccUser LibraryuClibc 0.9.28PPTP L2TP HTTP Server Layer7 QoS Openswan Gigabit Switch Audio DAC HQoS VPN SPDIF USB Windows certificationn/a n/a Go-ahead Linux 2.6.21 only 2.6.22 RT3883+Vitesse WM8750 n/a 150Mbps (RT6856) n/a EHCI (RT6856/MT7620) Vista/Win7MT720 performance gain ~120% MT7620 performance gain ~100% /QDMACopyright © MediaTek Inc. All rights reserved.2013/12/27Value Added SoftwareDPI +iQoS DPI +iQoS (Broadweb) CAPWAP user kernel driverConfidential BSamba, Airplay, Airprint, DLNA DMSVPN NTFS (Paragon) (MediaTek)NTFS (Paragon)Remote USBUSB Printer Audio StorageIPv6 HNAT HQoS (MediaTek)Storage Accelerator (MediaTek)VoW (MediaTek)Mesh (TerraNet)IP cam H.264 (AIT/Sonix) Audio DAC (WM8960)Copyright © MediaTek Inc. All rights reserved.2013/12/27- 17 -Confidential BAgendaChip Roadmap ▪ MT7620 Highlights ▪ MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 18 -Confidential BMT7620A Functional Block3.3V 20/40MHz Crystal PMU 2.5/1.0V Clock/Timer/Reset/PLL DRAM Controller NAND/SD-XC/eMMC SPI RF FEM RF FEM MAC BBP UART Full+ UART Lite USB 2.0 Host/Device CTRL/PHY I2C PPE w/ IPv6 I2S PCM 2 3 4 External Interface TransformerSDRAM(512Mbits) DDR1(1Gbits) DDR2(2Gbits) NAND Flash(8Gbits) SPI Flash/Codec UART Interface USB 2.0 Interface EEPROM/Control Audio Interface Codec GPIO/LEDMIPS 24KEc (580/600 MHz) 64K I-Cache 32K D-Cache5G WiFi 2x2 11n: RT5592 2x2 11n: RT5592EP (HP) 3x3 11n: RT3593 1x1 11ac: MT7610ERGMIIPCIe Storage Accelerator Ethernet SwitchRGMII01Copyright © MediaTek Inc. All rights reserved.2013/12/27- 19 -MT7620 Highlights• Best DBC TP w/ Intel 6300 • Best TP w/ mutiSTAs • No. 1 HNAT in smallnetbuilder • First IPv6 HNATConfidential BBest DBC Throughput w/ Intel63002Gbps IPv6 HNATMT7620Lowest Power Consumption• Lowest power consumption • Thermal PK w/ E900USB 2.0 Samba Performance• Perform same performance w/ EA3500 and E4200v2Copyright © MediaTek Inc. All rights reserved.2013/12/27- 20 -HNAT (Chariot) Benchmarkipv6 HNATConfidential B2Gbps HNATOutperform in iPv6 benchmarkCopyright © MediaTek Inc. All rights reserved.2013/12/27- 21 -Confidential BPower Consumption BenchmarkD-LINK DIR-605L RTL8196C+ RTL8192CE 2.31 2.64 1.42 1.38 1.37MT7620NSDRTenda W308R BCM5357TP-LINK TL-WR841N AR9341Uplink Downlink STA associated STA unassociated Radio off1.80 2.18 1.03 0.83 0.613.42 4.41 2.88 2.79 2.072.632 3.290 2.444 2.350 2.068Copyright © MediaTek Inc. All rights reserved.2013/12/27- 22 -Confidential BDBC TP Benchmark (vs. Intel6300)Copyright © MediaTek Inc. All rights reserved.2013/12/27- 23 -Peak Throughput Benchmark APto1STA or APto2STAsConfidential BCopyright © MediaTek Inc. All rights reserved.2013/12/27- 24 -N300/600, AC750/1200(GbE) Solution▪ MT7620A (580MHz)– – – – – 2x2 11n 2.4GHz GbE LAN(4)+WAN USB 2.0, SD-XC, I2S DDR2, SPI Flash PCIe: 802.11 a/n/acMT7620AConfidential B1x1/2x2 11ac▪ MT7530– 5p GbE SwitchMT7530▪ 4L PCB, double sides▪ OS– Linux SDKCopyright © MediaTek Inc. All rights reserved.2013/12/27- 25 -Outdoor AP Solution (Industry Spec.)▪ MT7620A (580MHz)– – – – – 2x2 11n 2.4GHz GbE(2) USB 2.0, PoE DDR1, NAND Flash PCIe• •Confidential BrGMII iNIC802.11 a/n/ac 802.11ac iNICMT7620A– rGMIIPCIe 1x1/2x2 11ac▪ HW Spec.– 4L PCB, double sides – -40~85 degrees (Industry Spec.) – Tx PowerMCS0: 26.8dbm per chain • Over temperature: +- 1dbm•PoE▪ OS– Linux SDKCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 26 -Confidential BAgendaChip Roadmap MT7620 Highlights ▪ MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 27 -AC750 Products▪ Chip: MT7620A+7610EConfidential B▪ MT7620A HNAT, DPD, STA-Proxy, USB performance outperform among all 2x2 11n SoC ▪ eCos IPv6 turnkey for small memory footprint ▪ Shipping AC750 modelsD-Link (DIR-810)Copyright © MediaTek Inc. All rights reserved.IO-Data (WN-AC733GR)2013/12/27 - 28 -PCI (MZK-750DHP)AC750 Solution▪ MT7620A (580MHz)– – – – 2x2 11n 2.4GHz FE LAN(4)+WAN USB 2.0, SD-XC, I2S DDR2, SPI FlashMT7620AConfidential BMT7610E▪ MT7610E– 1x1 11ac (ePA)▪ 4L PCB, double sides▪ Power Consumption– 3.13w (power optimized) – 3.96w (rBOM optimized)▪ OS– Linux SDK – eCos turnkey (2/16)Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 29 -AC750 vs. HTC New One TP140 120 100 80 60 40 20 0 UplinkCopyright © MediaTek Inc. All rights reserved.Confidential BMbps119.288.890.311ac TPDnlink2013/12/27 - 30 -Bi-directionAC1200(FE) Solution▪ Chip: MT7620A+7612EConfidential B▪ HNAT, DPD, STA-Proxy, USB performance outperform among all 2x2 11n SoC ▪ enable 11ac iPA w/ industry lowest rBOM ▪ support ePA for better coverage ▪ eCos IPv6 turnkey for small memory footprintCopyright © MediaTek Inc. All rights reserved.2013/12/27- 31 -AC1200 Solution▪ MT7620A (580MHz)– – – – 2x2 11n 2.4GHz FE LAN(4)+WAN USB 2.0, SD-XC, I2S DDR2, SPI FlashConfidential BMT7612E▪ MT7612E– 2x2 11ac (iPA/ePA)MT7620A▪ 4L PCB, double sides ▪ Power Consumption– 3.13w (power optimized) – 3.96w (rBOM optimized)▪ OS– Linux SDKCopyright © MediaTek Inc. All rights reserved.2013/12/27- 32 -Confidential BAC1200 iPA Benchmark▪ Tx Power BenchmarkTX output (dBm) MT7612EBelkin AC1000 RTL8197D+ RTL8192ER+ RTL8812AR5GRF HW OFDM HT20 HT40 VHT20 VHT40 VHT80 6M 54M MCS0 MCS7 MCS0 MCS7 MCS0 MCS8 MCS0 MCS9 MCS0 MCS92x2 ac iPA 19 16.5 19 15.5 18.5 15.5 19 15 18.5 15 17.5 152x2 ac ePA 16 14DIR-860 AC1200 (BCM) 2x2 ac ePA 18 16 18 16 18 161218 14Copyright © MediaTek Inc. All rights reserved.2013/12/27- 33 -*TX Pout is single chain data at antenna port which includes 1.5dB loss (transmission line+diplexer+IPEX connector)Confidential BAgendaChip Roadmap MT7620 Highlights MT7620 11ac Solutions ▪ MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 34 -Confidential BMT7621A Function Block20/25/40MHz Crystal DRAM Controller Clock/Timer/Reset/PLL NAND/SD-XC/eMMC SPI (2)DDR2(2Gbits, 1066) DDR3(4Gbits, 1200) NAND Flash(8Gbits) SPI Flash/Codec UART Interface USB 3.0 Interface USB 2.0 Interface SATA SATAIII (2) Audio Interface NFC MT6605 GPIO/LED11n WiFiPCIeMIPS 1004KEc (880 MHz) 32K I-Cache 32K D-Cache L2-Cache 256KB Storage AcceleratorMIPS 1004KEc (880 MHz) 32K I-Cache 32K D-Cache Cache Coherency Port HNAT+ BW CTRLUART Lite (3) USB 3.0 Host11ac WiFiPCIeUSB 2.0 Host PCIe I2S, PCM, S/PDIFCryptoGigabit SwitchRGMII01234I2C External InterfaceTransformerCopyright © MediaTek Inc. All rights reserved.2013/12/27- 35 -MT7621 ApplicationConfidential BEthernet USB dongle SPDIFeMMC SDXC USB/SATAUSBUSB (printer)Airplay WiFi MT7662 BT Sink play I2C MT6605 PCM (VoIP)I2S I2SSPITouch panelCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 36 -MT7621N/AMT7621A Package GbE Power Consumption PCB Heat Sink Application TFBGA 11.7x13.6 GbE(5)+rGMII 2.4W 2/4L Yes AC1200G-Router MT7621N TFBGA 11.7x13.6 rGMII 1.2W 2/4L NoConfidential BAC1200-Repeater NAS+GbE(1) AC1200-FE Internet RouterCopyright © MediaTek Inc. All rights reserved.2013/12/27- 37 -Confidential BMT7621 Introduction▪ Platform based network processor for 2x2/3x3 11ac, LTE cat4/5 with rich extensions– Rich I/O sets: 5p GbE switch, rGMII, PCIe(3), USB3, USB2, SD-XC, I2S, PCM, S/PDIF▪ HNAT+BW CTRL can work seamlessly– HNAT w/ 2Gbps wired speed IPv6 routing – HW bandwidth control to replace software scheduler▪ Upgradable L7 QoS database for “Auto QoS” ▪ Storage accelerator – GSO/GRO, fast DMA for write offload ▪ >400 Mbps VPN crypto engine ▪ NFC for WPS replacement ▪ Industry lowest power consumption ▪ World’s first 2x2 11ac iPA to save rBOM ▪ World’s first 2x2 11ac DBC 2L design to save rBOMCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 38 -AC1200AC1200 -GbE 4L RFB▪ 4L, double side ▪ DDR3 1200/NAND Flash ▪ On board dual band concurrent WIFI– 7612E: 2x2 11ac iPA/iLNA – 7602E: 2x2 11n iPA/iLNAGbE 5p GbEConfidential BU3U2 MT6605 (NFC)IC+ GbE PhyNAND Flash MT7621 A DDR3 (1200)▪ Co-crystal design ▪ External high power module– 7612E: 2x2 11ac – 7602E: 2x2 11n (256QAM) – 7603E: 2x2 11n (64QAM)SD-XCSATA3.0ASM1061 MT7602E (2.4GHz) MT7612E (11ac) S/PDIF▪ USB 3.0/2.0/SATA3.0Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 39 -*Note: PCB cost estimation by vendor “Newheart”AC1200AC1200 -GbE 2L RFB▪ PCB cost down 40%– Dimension: 168mm x 115mm x 1.6mm – Single side – FR4 PCB: 100pcs estimation – 4Layer:NTD 175 – 2Layer: NTD 105*U 2Confidential B5p GbESD-XC DDR2 (1066)▪ DDR2 800/1066, SPI flash ▪ Co-crystal design ▪ On board dual band concurrent WIFI– 7612E: 2x2 11ac iPA/iLNA – 7602E: 2x2 11ac iPA/iLNAMT7602E (2.4GHz)MT7621ASPI FlashMT7612E (11ac)▪ USB 2.0 HS host supportCopyright © MediaTek Inc. All rights reserved. 2013/12/27 - 40 -MT7621A HDK V31*Note: PCB cost estimation by vendor “Newheart”Benchmark with Dlink DIRDIR-860LBetter computing power Integrated RF front-endConfidential BBenchmark Chip Set AC1200-GbE MT7621A+ MT7612E+MT7602E iPA/iLNA Dual Core 880MHz TX:iPA performance better than competitor ePADlink DIR-860L BCM47081A0+ BCM4352+BCM43217 ePA/eLNA Single Core 800MHz Front-end module:RFMD RFFM4501CPU WIFI 5GMTK AC1200-GbERX:Low rate worst than competitor eLNA 0.5dB High rate better than competitorBetter RF performanceWIFI 2.4GTX:iPA performance better than competitor iPATX:iPARX: Dlink DIR-860L Excellent power consumption Lower thermal risk Cost advantage Power Consumption Thermal r-BOMiLNA better than competitor iLNARX: iLNAUplink: 7.21W Downlink: 7.45W Less heat sink, thermal pad and shielding case USD: 3.8638 Co-clock supportUplink: 9.03W Downlink: 10.98W More thermal strategy USD: 6.5361 w/ RF front-end USD: 5.3967 w/o RF front-endNote: rBOM cost is not including thermal strategy, and shielding case Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 41 -Benchmark with Netgear R6200v2Confidential BBenchmark Chip Set AC1200-GbE MT7621A+ MT7612E+MT7602E ePA/eLNA Dual Core 880MHz TX:ePA: SKYWORKS SKY85402-11Netgear R6200v2 BCM47081A0+ BCM4352+BCM43217 ePA/eLNA Single Core 800MHz Front-end module:RFMD RFFM4501Better computing power Better RF performance MTK AC1200-GbECPU WIFI 5GRX:eLNASKYWORKS SKY85601-11Better RF performanceWIFI 2.4GFront-end module:RFMD RFFM4203TX:ePA: SKYWORKS SE2528RX: Netgear R6200-V2 Power Consumption Lower thermal risk Cost advantage Thermal r-BOM Less heat sink, thermal pad and shielding case USD:3.8638* Co-clock support USD: 3.9684*eLNA: Richwave RTC6602Uplink: 9.55W Downlink: 12.48W*Note: rBOM cost is not including external RF front-end, thermal strategy, and shielding case Copyright © MediaTek Inc. All rights reserved. 2013/12/27 - 42 -Media Security Gateway (MT7621+STB+ZigBee)Confidential B11n WiFiDDR3 NAND11ac WiFiUSB 2.0 USB 3.0STB SoC (Slave )ASM 1060ZigBeeMT7621 (Host)PCIeHDDSLICUART rGMII Transformer (1000Mps)R J 1 1R J 1 1R J 4 5R J 4 5R J 4 5R J 4 5MocaCopyright © MediaTek Inc. All rights reserved.2013/12/27- 43 -MT762xA + 2.8”(240x320 Dots) TFT +Touch Panel (Resistive (Resistive) )Confidential BCopyright © MediaTek Inc. All rights reserved.2013/12/27- 44 -What’s QoS?▪ End to End ▪ Big Pipe to Small Pie ▪ QoS Components1 Classifier 2 Queue/BW Mgmt 3 Scheduler/ShaperConfidential BCopyright © MediaTek Inc. All rights reserved.2013/12/27- 45 -HWHW-BWBW-CTRL - UpstreamConfidential B1 2 3 4 3 2 1Copyright © MediaTek Inc. All rights reserved.2013/12/27- 46 -HWHW-BWBW-CTRL - DnstreamConfidential B1 2 3 4 3 2 1Copyright © MediaTek Inc. All rights reserved.2013/12/27- 47 -HWHW-BWBW-CTRL – Dnstream (2)1Confidential B2Copyright © MediaTek Inc. All rights reserved.2013/12/27- 48 -USB 3.0 Samba BenchmarkConfidential BAP Linksys EA6400 Buffalo AC1750 D-Link DIR-860L MT7621AFormatHDD Model NameRead (MByte/sec) 13.75Write (MByte/sec) 11.67 15.77test tool InterfaceFAT32Buffalo HD-LB131.45 37.93 72.30IOMETER USB3.0 16.55 29.50Copyright © MediaTek Inc. All rights reserved.2013/12/27- 49 -Confidential BAgendaChip Roadmap MT7620 Highlights MT7620 11ac Solutions MT7621 11ac Solutions ▪ MT7612 11ac SolutionsCopyright © MediaTek Inc. All rights reserved.2013/12/27- 50 -。

ADLRAN ATLAS 800PLUS 使用手册说明书

ADLRAN ATLAS 800PLUS 使用手册说明书
Change or modifications to this unit not expressly approved by the party responsible for compliance could void the user’s authority to operate the equipment.
iv
Affidavit Requirements for Connection to Digital Services • An affidavit is required to be given to the telephone company whenever digital terminal equipment
901 Explorer Boulevard P.O. Box 140000
Huntsville, AL 35814-4000 (256) 963-8000
© 2000 ADTRAN, Inc. All Rights Reserved.
Prinns require that in this manual the following information be provided to the customer:
6. This unit contains no user-serviceable parts. 7. The following information may be required when applying to your local telephone company for
leased line facilities.
without encoded analog content and billing protection is used to transmit digital signals containing encoded analog content which are intended for eventual conversion into voiceband analog signals and transmitted on the network. • The affidavit shall affirm that either no encoded analog content or billing information is being transmitted or that the output of the device meets Part 68 encoded analog content or billing protection specifications. • End user/customer will be responsible for filing an affidavit with the local exchange carrier when connecting unprotected customer premise equipment (CPE) to 1.544 Mbps or subrate digital services. • Until such time as subrate digital terminal equipment is registered for voice applications, the affidavit requirement for subrate services is waived.

三电平PWM整流器研究

三电平PWM整流器研究
In this paper, the direct current control strategy, which combines the current state feedback decoupling method and two closed-loop control strategy is studied in detail. After being decoupled, the model of three- level PWM rectifier is very similar to the DC motor governor system, so the idea of controller design in the DC motor governor system can be used for reference, engineering design method, optimal parameter confirming method and natural
关键词:三电平 PWM 整流器 中点控制方法
数学模型空间矢量 双闭环控制
PWM 中点平衡问题 复合控制
I
ABSTRACT
In recent years, high- voltage and high-power power electronics devices have been widely used.
Compound control
III
独创性声明
本人声明所呈交的学位论文是我个人在导师指导下进行的研究工作及取得的 研究成果。尽我所知,除文中已经标明引用的内容外,本论文不包含任何其他个 人或集体已经发表或撰写过的研究成果。对本文的研究做出贡献的个人和集体, 均已在文中以明确方式标明。本人完全意识到本声明的法律效果由本人承担。

tms320f28335中文数据手册介绍

tms320f28335中文数据手册介绍
3 功能概述 ............................................................................................................................ 33 3.1 内存映射 .................................................................................................................... 34 3.2 简要说明 .................................................................................................................... 41 3.2.1 C28x CPU ................................................................ 41 3.2.2 内存总线(哈弗总线架构) .................................................................................... 41 3.2.3 外设总线 ......................................................................................................... 41 3.2.4 实时 JTAG 和分析 .............................................................................................. 42 3.2.5 外部接口(XINTF) ................................................................................................ 42 3.2.6 闪存 ............................................................................................................... 42 3.2.7 M0,M1 SARAM ............................................................................................... 42 3.2.8 L0, L1, L2, L3, L4, L5, L6, L7SARAM ........................................................................ 43 3.2.9 引导 ROM ........................................................................................................ 43 3.2.9.1 引导加载器使用的外设引脚 ....................................................................... 44 3.2.10 安全性 ............................................................................................................ 44 3.2.11 外设中断扩展 (PIE) 块 ......................................................................................... 46 3.2.12 外部中断 (XINT1-XINT7,XNMI) ............................................................................. 46 3.2.13 振荡器和锁相环 (PLL) .......................................................................................... 46 3.2.14 安全装置 ......................................................................................................... 46 3.2.15 外设时钟 ......................................................................................................... 46 3.2.16 低功率模式 ....................................................................................................... 46 3.2.17 外设帧 0,1,2,3 (PFn) ...................................................................................... 47 3.2.18 通用输入/输出 (GPIO) 复用器 ................................................................................. 47 3.2.19 32 位 CPU 定时器 (0,1,2) .................................................................................. 47 3.2.20 控制外设 ......................................................................................................... 48 3.2.21 串行端口外设 .................................................................................................... 48 3.3 寄存器映射 ................................................................................................................. 49 3.4 器件仿真寄存器 ............................................................................................................ 51 3.5 中断 .......................................................................................................................... 52 3.5.1 外部中断 ......................................................................................................... 56 3.6 系统控制 .................................................................................................................... 57 3.6.1 OSC 和 PLL 块 .................................................................................................. 58 3.6.1.1 外部基准振荡器时钟选项 .......................................................................... 59 3.6.1.2 基于 PLL 的时钟模块 .............................................................................. 60 3.6.1.3 输入时钟损失 ....................................................................................... 61 3.6.2 安全装置块 ....................................................................................................... 62 3.7 低功率模式块 ............................................................................................................... 63

给排水专业废止图集

给排水专业废止图集

给序号图集号图集名称废止文号废止时间替代图集1S3给水排水标准图集 排水设备及卫生器具安装(2004年合订本)2S141(一)皮碗式防冻给水栓建设[1994]386号1994年6月18日3S141(二)活塞式防冻给水栓建设[1994]386号1994年6月18日4S141(三)外排式防冻给水栓建设[1994]386号1994年6月18日5S141(四)地温式防冻给水栓建设[1994]386号1994年6月18日6CS142自闭式水锤消除器建设[1994]386号1994年6月18日7CS150太阳能热水器建设[1994]386号1994年6月18日01SS126 8S215砖砌汽车库洗车污水沉淀池建设[1994]386号1994年6月18日04S519 9S217小型排水构筑物建设[1994]386号1994年6月18日10S315钢制活塞式浮球阀建设[1994]386号1994年6月18日11S316铸铁活塞式浮球阀建设[1994]386号1994年6月18日12S323投药设备建设[1994]386号1994年6月18日13S420含氰污水混合反应池(连续式)建设[1994]386号1994年6月18日14S421含铬污水混合反应池(连续式)建设[1994]386号1994年6月18日15S422.1生产污水沉淀池(重力排空式)建设[1994]386号1994年6月18日16S422.2生产污水沉淀池(非重力排空式)建设[1994]386号1994年6月18日17CS425(一)电解法处理含铬废水重力式调节池建设[1994]386号1994年6月18日18CS425(二)电解法处理含铬废水提升式调节池建设[1994]386号1994年6月18日19CS426(一)电解法处理含铬废水硬聚氯乙烯塑料电解槽建设[1994]386号1994年6月18日20CS426(二)电解法处理含铬废水地上式钢筋混凝土电解槽建设[1994]386号1994年6月18日21CS426(三)电解法处理含铬废水地上式钢筋混凝土电解槽建设[1994]386号1994年6月18日22S416.1含氰污水处理池(重力排空式)建设[1994]386号1994年6月18日23S416.2含氰污水处理池(非重力排空式)建设[1994]386号1994年6月18日24S417含铬污水处理池(间歇式)建设[1994]386号1994年6月18日25S651(三)阶梯型半地下式深井泵房建设[1994]386号1994年6月18日26S774(一)机械加速澄清池200m3/h建设[1994]386号1994年6月18日27S774(二)机械加速澄清池320m3/h建设[1994]386号1994年6月18日28S774(三)机械加速澄清池430m3/h建设[1994]386号1994年6月18日29S774(四)机械加速澄清池600m3/h建设[1994]386号1994年6月18日30S774(五)机械加速澄清池800m3/h建设[1994]386号1994年6月18日31S774(六)机械加速澄清池1000m3/h建设[1994]386号1994年6月18日32S774(七)机械加速澄清池1300m3/h建设[1994]386号1994年6月18日33S774(八)机械加速澄清池1800m3/h建设[1994]386号1994年6月18日34S755压力式无阀滤池,产水能力10~45立方米/时建设[1994]386号1994年6月18日35S314提拔阀门建设[1996]491号1996年8月20日36S418.1酸碱污水自然中和池(重力排空式)建设[1996]491号1996年8月20日37S418.2酸碱污水自然中和池(非重力排空式)建设[1996]491号1996年8月20日38S419.1酸碱污水处理池(重力排空式)建设[1996]491号1996年8月20日39S419.2酸碱污水处理池(非重力排空式)建设[1996]491号1996年8月20日4091S430电渗析器选用安装图建设[1996]491号1996年8月20日41S343浮子式定量投配设备(孔板型)建设[1996]491号1996年8月20日42S344浮子式流量恒定器(孔板型)建设[1996]491号1996年8月20日4385SS782压力滤器选用安装图建设[1996]491号1996年8月20日44S6S788(给排水设计选用手册)全国通用建筑标准设计图集给水排水设计选用手册深井取水、净水、蓄水构筑物建设[1996]491号1996年8月20日4585SS850(一)气压给水罐建设[1996]491号1996年8月20日4685SS850(二)气压给水罐建设[1996]491号1996年8月20日4785SS850(三)气压给水罐建设[1996]491号1996年8月20日4890SS851补气式气压设备选用安装图建设[2000]58号2000年3月17日49S461给水管穿越铁路建设[2000]58号2000年3月17日5090S470污水两级气浮设备选用安装图建设[2000]58号2000年3月17日5185S653(一)~(八)钢筋混凝土及砖石造大口井建设[2000]58号2000年3月17日5285SS654小型取水口建质[2001]258号2001年12月26日5386SS656IS型水泵安装建质[2001]258号2001年12月26日54CS772(一)~(三)脉冲澄清池建质[2001]258号2001年12月26日55S773(一)~(四)虹吸滤池建质[2001]258号2001年12月26日5685SS776自然沉淀池建质[2001]258号2001年12月26日5785S347小型投药设备建质[2001]258号2001年12月26日5887S348雨水斗建质[2001]258号2001年12月26日01S3025985S652钢、铸铁、钢筋混凝土及砾石混凝土井管建质[2001]258号2001年12月26日6089SS471(一)~(二)医院污水处理(氯片消毒法)建质[2001]258号2001年12月26日6192SS472(一)~(三)医院污水处理次氯酸纳系列建质[2001]258号2001年12月26日6292SS473(一)~(三)医院污水处理次氯酸钠系列建质[2001]258号2001年12月26日6392SS474(一)~(三)医院污水处理次氯酸钠系列建质[2001]258号2001年12月26日6494SS475(一)、(二)医院污水处理液氯系列建质[2001]258号2001年12月26日6594SS476(一)、(二)医院污水处理液氯系列建质[2001]258号2001年12月26日6694SS477(一)、(二)医院污水处理液氯系列建质[2001]258号2001年12月26日6788S326水上式底阀选用安装图建质[2001]258号2001年12月26日6890S342卫生设备安装建质[2001]258号2001年12月26日99S304 69S313套管式伸缩器建质[2001]258号2001年12月26日70S318水塔水池浮漂水位标尺建质[2001]258号2001年12月26日7188S238(一)~(四)锅炉排污降温池建质[2001]258号2001年12月26日04S5197293S217小型排水构筑物建质[2001]258号2001年12月26日7393S180热管开水器安装选用图建质[2001]258号2001年12月26日7493S181热管快速热交换器(汽─水换热)安装、选用图建质[2001]258号2001年12月26日7594S182热管卧式容积式热交换器(汽─水换热)安装、选用图建质[2001]258号2001年12月26日S122-1~107694S183热管立式容积式热交换器(汽─水换热)安装、选用图建质[2001]258号2001年12月26日7795S184热管卧式容积式热交换器(水─水换热)安装、选用图建质[2001]258号2001年12月26日7895S185热管立式容积式热交换器(水─水换热)安装、选用图建质[2001]258号2001年12月26日7989S152(一)~(五)卧式贮水罐建质[2001]258号2001年12月26日01S1238089S153(一)~(五)立式贮水罐建质[2001]258号2001年12月26日81S156冷热水混合器建质[2001]258号2001年12月26日8287S157蒸汽间断式开水炉建质[2001]258号2001年12月26日01S1258386S158(一)蒸汽一水快速热交换器(小型单管式)建质[2001]258号2001年12月26日8488S162室外消火栓安装建质[2001]258号2001年12月26日01S201 8587S163室内消火栓安装建质[2001]258号2001年12月26日04S20299S20399(03)S2038792S170(一)~(二)热交换器选用安装图建质[2001]258号2001年12月26日S122-1~108891SS852(一)、(二)隔膜式气压水罐选用安装图建质[2001]258号2001年12月26日8686S164消防水泵接合器安装建质[2001]258号2001年12月26日8986SS901农村给水工程(总册)建质[2001]258号2001年12月26日9085S778(一)~(五)慢滤池建质[2001]258号2001年12月26日9195S843(4~6)、(10~18)钢筋混凝土支架不保温水塔(50m3~200m3)建质[2001]258号2001年12月26日9290S847(一)、(五)(分册)钢筋混凝土支筒保温水塔(50m3~400m3)建质[2001]258号2001年12月26日9385S848小型砖石圆型蓄水池(10m3~300m3)建质[2001]258号2001年12月26日9485S849(一)、(二)15m3砖支筒水塔建质[2001]258号2001年12月26日9595S845(一)~(五)砖支筒不保温水塔建质[2003]53号2003年3月18日9690S846(一)~(六)砖支筒保温水塔建质[2003]53号2003年3月18日9785S779(一)~(三)快滤池建质[2003]53号2003年3月18日9885SS780(一)~(三)地下水除铁滤池建质[2003]53号2003年3月18日9988S810小型钢筋混凝土蓄水池建质[2003]53号2003年3月18日100S151(一)方形给水箱建质[2003]53号2003年3月18日02S101 101S151(二)圆形给水箱建质[2003]53号2003年3月18日10292SS177装配式给水箱选用安装图建质[2003]53号2003年3月18日01S201 10393S178冲压钢板给水箱安装、选用图建质[2003]53号2003年3月18日02(03)S51502S515 105S232矩形排水检查井建质[2003]53号2003年3月18日106S233扇形排水检查井建质[2003]53号2003年3月18日107S234跌水井建质[2003]53号2003年3月18日108CS236耐腐蚀检查井及耐腐蚀管道接口建质[2003]53号2003年3月18日109S311钢制管道零件建质[2003]53号2003年3月18日02S403 110S312防水套管建质[2003]53号2003年3月18日02S40411192S213(一)~(五)砖砌化粪池建质[2003]53号2003年3月18日02S70111292S214(一)~(五)钢筋混凝土化粪池建质[2003]53号2003年3月18日03S70211390S319水池通气管、吸水喇叭管及支架建质[2003]53号2003年3月18日02S403114CS345(一)~(六)给水承插铸铁管道支墩(Dg400~1200)建质[2003]53号2003年3月18日03S504115S346投药、消毒设备建质[2003]53号2003年3月18日11690S436(一)玻璃钢冷却塔选用安装图(逆流式)建质[2003]53号2003年3月18日02S10611791S436(二)玻璃钢冷却塔选用安装图(横流式)建质[2003]53号2003年3月18日11895S603-1~5 原95S717~721改号机械搅拌澄清池建质[2003]53号2003年3月18日11995SS601-1 原95SS437(1)改号100~2000m2钢筋混凝土自然通风冷却塔选用安装图建质[2003]53号2003年3月18日12085SS777(一)~(十一)穿孔旋流反应斜管沉淀池建质[2003]53号2003年3月18日121S771(一)~(八)水力循环澄清池建质[2003]53号2003年3月18日122S775(一)~(九)重力式无阀滤池建质[2003]53号2003年3月18日123S161管道支架及吊架建质[2003]74号2003年5月1日03S402 12487S159管道和设备保温建质[2003]211号2003年12月1日03S401 12589SS175室内自动喷水灭火设施安装建质[2004]28号2004年3月1日04S206 12601S519小型排水构筑物建质[2004]28号2004年3月1日04S519 12795S516排水管道基础及接口建质[2004]28号2004年3月1日04S51612896S811~96S821、96S834~96S835圆形钢筋混凝土清水池建质[2004]28号2004年3月1日04S803104S231圆形排水检查井建质[2003]53号2003年3月18日。

三未信安服务器密码机-技术白皮书v3.0(201301)

三未信安服务器密码机-技术白皮书v3.0(201301)

三未信安服务器密码机技术白皮书SANSEC HSM SJJ0930/SJJ1012 White Paper Version 3.0北京三未信安科技发展有限公司2013年1月1.产品简介三未信安服务器密码机(SJJ0930/SJJ1012)是由北京三未信安科技发展有限公司自主研发的高性能密码设备,能够适用于各类密码安全应用系统进行高速的、多任务并行处理的密码运算,可以满足应用系统数据的签名/验证、加密/解密的要求,保证传输信息的机密性、完整性和有效性,同时提供安全、完善的密钥管理机制。

密码应用系统通过调用密码机提供的标准API函数来使用密码机的服务,密码机API与密码机之间的调用过程对上层应用透明,应用开发商能够快速的使用密码机所提供的安全功能。

密码机API接口符合《公钥密码基础设施应用技术体系密码设备应用接口规范(试行)》标准接口规范,通用性好,能够平滑接入各种系统平台,满足大多数应用系统的要求,在应用系统安全方面具有广泛的应用前景。

2.功能描述⏹密钥生成与管理:可以生成1024/2048/3072/4096位RSA密钥对和256位ECC密钥对1,采用由国家密码管理局批准使用的物理噪声源产生器芯片生成的随机数。

⏹密钥的安全存储:设备内可存储50对RSA密钥对(包括签名密钥对和加密密钥对)和50对ECC密钥对2,并且私钥部分受系统保护密钥的加密保护。

⏹数据加密和解密:支持SSF33算法3、SM1算法、SM4算法4、AES算法、3DES算法的ECB和CBC模式的数据加密和解密运算。

1仅SJJ1012型号支持ECC算法2同上3SSF33对称算法为可选算法4⏹消息鉴别码的产生和验证:支持基于SSF33算法5、SM1算法、SM4算法6、AES算法、3DES算法的MAC产生及验证。

⏹数据摘要的产生和验证:支持SM37、SHA-1、SHA224、SHA256、SHA384、SHA512等杂凑算法。

⏹数字签名的产生和验证:可以根据需要利用内部存储的RSA/ECC8私钥或外部导入RSA/ECC私钥对请求数据进行数字签名。

SIMATIC S7-1500 ET 200MP 自动化系统 系统手册说明书

SIMATIC S7-1500 ET 200MP 自动化系统 系统手册说明书

SIMATICS7-1500/ET 200MP 自动化系统系统手册01/2023A5E03461186-AKSiemens AG Digital Industries Postfach 48 48 90026 NÜRNBERG 德国Ⓟ 02/2023 本公司保留更改的权利Copyright © Siemens AG 2013 - 2023.保留所有权利法律资讯警告提示系统为了您的人身安全以及避免财产损失,必须注意本手册中的提示。

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注意表示如果不采取相应的小心措施,可能导致财产损失。

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扫特龙和曼维尔产品数据表705、706、710和726个人攻击发射器说明书

扫特龙和曼维尔产品数据表705、706、710和726个人攻击发射器说明书

705, 706, 710 & 726 Personal attack transmittersWhy settle for less when your staffneed help most?Hopefully, your staff will never need to find out whyour personal attack transmitters are so highly regarded.But should they ever be attacked, they’ll quickly realisewhy over 750,000 people worldwide trust them withtheir lives. The 705, 706, 710 and 726 models all comewith 10mW transmitting power compared to the usual0.25mW. And, to ensure your transmitter is alwaysworking, the long-life lithium battery sends a signalwhen less than one month’s operation remains.All models are designed to prevent accidental activationand a variety of wearing options – hand-held, neckpendant or clip-on – means there’s a style to suiteveryone.With many other state-of-the-art features (see overleaf),no other range of personal attack transmitters is betterequipped to draw attention to a member of staff whenthey are under attack.• Reliable, secure Scantronic 868 MHz narrow-bandradio operation• Dual button operation• 2-channel version for alert (pre-warning) + alarmsignals• Extended and standard range options• Lithium battery-powered (supplied)At a glance...Tel: +44 (0)1594 545 400Fax: +44 (0)1594 545 401Email:***********************Web: EatonElectrical Sector EMEA Route de la Longeraie 71110 Morges, Switzerland EatonSecurity House,Vantage Point Business Village, Mitcheldean, Gloucestershire GL17 0SXScantronic and Menvier product datasheetCompatible productsProduct specification705rEUR-00706rEUR-00710rEUR-00726rEUR-50726rEUR-60Part number 710rEUR-00705rEUR-00706rEUR-00726rEUR-50726rEUR-60Description2 channel personal attack transmitter2 channel personal attack transmitter Double push lock, beltmounted, secondary tilit sensor “man down” channel Extended range, dualoperation personal attack transmitter Standard, dual operationpersonal attack transmitter Channels12 (alert + alarm)211Operating frequency868.6625MHz @ 20KHz bandwidth.CE tested to I-ETS 300 220868.6625MHz @ 20KHz bandwidth.CE tested to I-ETS 300 220868.6625MHz at 20kHz bandwidth. I-ETS 300 220868.6625MHz @ 20KHz bandwidth.CE tested to I-ETS 300 220868.6625MHz @ 20KHz bandwidth.CE tested to I-ETS 300 220T ransmission power 10mW 10mW 10mW 10mW 10mW Free space radio range >1000m >600m>900m> 1000m>600mPower supply (battery)3v CR2 Li 3.6v Li 1/2 AA Not user replaceble 3.6v Li 1/2 AA Not user replaceable 3.6v Li 1/2 AA Not user replaceble 3.6v Li 1/2 AA Not user replaceble T ypical battery life 3-5 years 3-5 years 3-5 years 3-5 years 3-5 years T emperature range -10 to +55 ˚C -10 to +55 ˚C -10 to +55 ˚C -10 to +55 ˚C -10 to +55 ˚C Dimensions 58 x 40 x 16mm 104 x 46 x 30mm 170 x 45 x 30mm (including aerial)163 x 46 x 30mm 104 x 46 x 30mm Weight 34gm 60gm 68gm 65gm 65gm Colour Dark GreyDark GreyDark GreyDark GreyDark GreyComplianceEN50131-2 Grade 2, EN61000-6-3:2001, environmental class ll PD6662:2004EN50131-2 Grade 2, EN61000-6-3:2001, environmental class ll PD6662:2004EN50131-2 Grade 2EN61000-6-3:2001environmental class II PD6662:2004EN50131-2 Grade 2, EN61000-6-3:2001, environmental class ll PD6662:2004EN50131-2 Grade 2, EN61000-6-3:2001, environmental class ll PD6662:2004Scantronic 9960rEUR-08 & 16 RFX receiver interfaces (not 705rEUR-00)i-on4040 zone control panel Scantronic Homelink 55 24zone radio alarm panel (not 705rEUR-00)i-on50EX 50 zone control panel Scantronic Homelink 75 32zone radio alarm system (not 705rEUR-00)i-on160EX 160 zone control panel Scantronic 762rEUR-00 2 channel receiver Menvier3030 zone control panel Scantronic 768rEUR-008 - 32 channel receiver Menvier4040 zone control panel Scantronic EXP-R1010 zone radio expander Menvier100100 zone control panel Scantronic EXP-R3030 zone radio expander Menvier300300 zone control paneli-on1616 zone control panel Menvier MRNODE receiver interface (not 705rEUR-00)i-on30EX16 zone control panelMultibus1000 zone control panel。

H3C S3110-SI系列安全易用交换机

H3C S3110-SI系列安全易用交换机

H3C S3110-SI系列安全易用交换机H3C S3110-SI系列交换机是H3C公司为构建高安全、高智能网络需求而专门设计的新一代百兆以太网交换机产品,在满足高性能接入的基础上,采用新一代绿色节能设计理念,给用户带来一个高性能、高性价比、绿色节能的接入网络。

H3C S3110-SI系列以太网交换机目前包含如下型号:S3110-10TP-SI: 8个10/100Base-TX以太网端口,2个10/100/1000Base-T以太网端口和2个复用的100/1000Base-X SFP端口;S3110-26TP-SI:24个10/100Base-TX以太网端口,2个10/100/1000Base-T以太网端口和2个复用的100/1000Base-X SFP端口;S3110-52TP-SI:48个10/100Base-TX以太网端口,2个10/100/1000Base-T以太网端口和2个100/1000Base-X SFP端口;产品特点:高性能与灵活扩展能力H3C S3110-SI系列交换机支持所有端口线速转发,满足了用户对高带宽的需求。

S3110-SI系列交换机至少支持2或4端口千兆上行,并且SFP端口既可以支持百兆光模块,也可以支持千兆光模块,在降低用户成本的同时,更好的考虑了用户后续升级的实际需求。

H3C S3110-SI系列交换机采用专利技术,允许交换机利用专用互联电缆实现多16台设备的堆叠,最大扩展至768个10/100M端口,支持不同端口设备的混合堆叠。

具有即插即用、单一IP管理。

同时大大降低系统扩展的成本,保护了用户投资。

增强的网络管理和维护的易用性H3C S3110-SI系列交换机支持通过FTP、TFTP实现设备的远程升级,支持SNMP v1/v2/v3,可支持Open View等通用网管平台,以及iMC智能管理中心。

支持CLI命令行,Web网管,TELNET,使设备管理更方便。

并且支持SSH2.0等加密方式,使得管理更加安全。

巯基化透明质酸包封的仿生交联基因微载体的构建

巯基化透明质酸包封的仿生交联基因微载体的构建
比为 8的 P ID A 缔 合 体 溶 液 中 , 静 电 驱 动 力 E/ N 在 T b i e r n pt tlf ieet al1 a t d -o nao frn e D m e a f e i d
装 ,构建 了壳层二硫键仿生交联 的基 因超分 子组装体 ( E/ N / A—H) P ID A H S .凝胶 电泳 结果表 明 , 组装体 有 该 很好的 D A缔合特性 .壳层 的仿生交联使基 因超分子组装体在生理盐 溶液 中的稳定性 得到有效 改善 ,细胞 N 毒性显著降低 ,并能有效转染细胞 ,为非病毒基 因传递体 系的设计 提供了新途径.
胱 甘肽 对壳 层二 硫键 的“ 生物 开关 ” 效应 , 有望 实 现细胞 内的解 组装 响应 ,为高效 安 全 的非 病 毒基 因载 体 的设 计提 供切 实 可行 的新 思路 .
1 实 验 部 分
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购 自 BoB s 公 司 ; E F (7 3 p 购 自 Coe c 司 ; 5一 代 - 一2硝基 苯 甲酸 ) D N 购 i ai c p G P 4 3b ) l t h公 ne 5, 二硫 双 (一 ( T B) 自 日本 株式 会社 同仁化 学研 究所 ;鱼精 D A( 盐 ,高纯 级 ) 羟 乙基 哌 嗪 乙磺 酸 ( ee) 自 A r N 钠 和 H ps 购 me—

VN31012Y资料

VN31012Y资料

VN31ISO HIGH SIDE SMART POWER SOLID STATE RELAYPRELIMINARY DATASeptember 1994BLOCK DIAGRAMTYPE V DSS R DS(on)I n (*)V C C VN3160V0.03Ω11.5A26VPENTAWATT (vertical)(*)In=Nominal current according to ISO definition for high side automotive switch (see note 1)(#)The maximum continuous output current is the current at T c =85o C for a battery voltage of 13V which does not activate self protectionsMAXIMUM CONTINUOUS OUTPUT CURRENT (#):31A @T c =85o Cs 5V LOGIC LEVEL COMPATIBLE INPUT s THERMAL SHUT-DOWNs UNDER VOLTAGE PROTECTION s OPEN DRAIN DIAGNOSTIC OUTPUTs INDUCTIVE LOAD FAST DEMAGNETIZATION sVERY LOW STAND-BY POWER DISSIPATIONDESCRIPTIONThe VN31is a monolithic device made using SGS-THOMSON Vertical Intelligent Power Technology,intended for driving resistive or inductive loads with one side grounded.Built-in thermal shut-down protects the chip from over temperature and short circuit.The open drain diagnostic output indicates:open load in off state and in on state,output shorted to V CC and overtemperature.Fast demagnetization of inductive loads is archieved by negative (-18V)load voltage at turn-off.PENTAWATT (horizontal)PENTAWATT (in-line)ORDER CODES:PENTAWATT vertical VN31PENTAWATT horizontal VN31(011Y)PENTAWATT in-line VN31(012Y)1/11VN31ABSOLUTE MAXIMUM RATINGSymbol Parameter Value Unit V(BR)DSS Drain-Source Breakdown Voltage60VI O UT Output Current(cont.)at T c=85o C31AI R Reverse Output Current at T c=85o C-31AI I N Input Current±10mA-V CC Reverse Supply Voltage-4VI STA T Status Current±10mAV E SD Electrostatic Discharge(1.5kΩ,100pF)2000V P tot Power Dissipation at T c=85o C54W T j Junction Operating Temperature-40to150o C T stg Storage Temperature-55to150o CCONNECTION DIAGRAMCURRENT AND VOLTAGE CONVENTIONS2/11THERMAL DATAR thj-cas e R thj-amb Thermal Resistance Junction-case MaxThermal Resistance Junction-ambient Max1.260o C/Wo C/WELECTRICAL CHARACTERISTICS(V CC=13V;-40≤T j≤125o C unless otherwise specified) POWERSymbol Parameter Test Conditions Min.Typ.Max.Unit V C C Supply Voltage 5.51326V In(*)Nominal Current T c=85o C V DS(on)≤0.5(note1)11.5AR on On State Resistance I OU T=11.5AI OU T=11.5A T j=25o C 0.060.03ΩΩI S Supply Current Off State T j≥25o COn State 5015µAmAV DS(MAX)Maximum Voltage Drop I OU T=25A T c=85o C 1.5V SWITCHINGSymbol Parameter Test Conditions Min.Typ.Max.Unitt d(on)(^)Turn-on Delay Time OfOutput Current I OU T=11.5A Resistive LoadInput Rise Time<0.1µs90µst r(^)Rise Time Of OutputCurrent I OU T=11.5A Resistive LoadInput Rise Time<0.1µs100µst d(off)(^)Turn-off Delay Time OfOutput Current I OU T=11.5A Resistive LoadInput Rise Time<0.1µs140µst f(^)Fall Time Of OutputCurrent I OU T=11.5A Resistive LoadInput Rise Time<0.1µs50µs(di/dt)on Turn-on Current Slope I OU T=11.5AI OU T=I OV 0.080.51A/µsA/µs(di/dt)off Turn-off Current Slope I OU T=11.5AI OU T=I OV 0.233A/µsA/µsV demag Inductive Load ClampVoltageI OU T=11.5A L=1mH-24-18-14V LOGIC INPUTSymbol Parameter Test Conditions Min.Typ.Max.Unit V IL Input Low LevelVoltage0.8VV IH Input High LevelVoltage2(•)VV I(hy st.)Input HysteresisVoltage0.5VI I N Input Current V IN=5VV IN=2VV IN=0.8V25250500250µAµAµAV ICL Input Clamp Voltage I IN=10mAI IN=-10mA 5.56-0.7-0.3VVVN313/11ELECTRICAL CHARACTERISTICS(continued)PROTECTION AND DIAGNOSTICS(continued)Symbol Parameter Test Conditions Min.Typ.Max.Unit V STAT Status Voltage OutputLowI STAT=1.6mA0.4VV US D Under Voltage ShutDown5VV SCL Status Clamp Voltage I STAT=10mAI STAT=-10mA6-0.7VVI OV Over Current R LOA D<10mΩ-40≤T c≤125o C140AI AV Average Current inShort CircuitR LOA D<10mΩT c=85o C 2.5AI OL Open Load CurrentLevel56001250mAT TS D Thermal Shut-downTemperature140o C T R Reset Temperature125o C V OL Open Load VoltageLevelOff-State(note2) 2.5 3.755Vt1(on)Open Load FilteringTime(note3)1510mst1(off)Open Load FilteringTime(note3)1510mst2(off)Open Load FilteringTime(note3)1510ms t povl Status Delay(note3)510µs t pol Status Delay(note3)50700µs(^)See Switchig Time Waveforms(•)The V I H is internally clamped at6V about.It is possible to connect this pin to an higher voltage via an external resistor calculated to not exceed10mA at the input pin.note1:The Nominal Current is the current at T c=85o C for battery voltage of13V which produces a voltage drop of0.5V note2:I OL(of f)=(V CC-V OL)/R OL(see fi gure)note3:t1(on):minimum open load duration which accti vates the status outputt1(of f):minimum load recovery time which desactivates the status outputt2(of f):minimum on time after thermal shut down which desacti vates status outputt po vl t pol:ISO definition(see figure)Note2Relevant Figure Note3Relevant FigureVN314/11FUNCTIONAL DESCRIPTIONThe device has a diagnostic output which indicates open load conditions in off state as well as in on state,output shorted to V CC and overtemperature.The truth table shows input, diagnostic and output voltage level in normal operation and in fault conditions.The output signals are processed by internal logic.The open load diagnostic output has a5ms filtering. The filter gives a continuous signal for the fault condition after an initial delay of about5ms.This means that a disconnection during normal operation,with a duration of less than5ms does not affect the status output.Equally,any re-connection of less than5ms during a disconnection duration does not affect the status output.No delay occur for the status to go low in case of overtemperature conditions.From the falling edge of the input signal the status output initially low in fault condition(over temperature or open load)will go back with a delay(t povl)in case of overtemperature condition and a delay(t pol)in case of open load.These feature fully comply with International Standard Office(I.S.O.) requirement for automotive High Side Driver.To protect the device against short circuit and over current conditions,the thermal protection turns the integrated Power MOS off at a minimum junction temperature of140o C. When the temperature returns to125o C the switch is automatically turned on again.In short circuit the protection reacts with virtually no delay,the sensor being located in the region of the die where the heat is generated.Driving inductive loads,an internal function of the device ensures the fast demagnetization with a typical voltage(V demag)of-18V.This function allows to greatly reduce the power dissipation according to the formula:P dem=0.5•L load•(I loa d)2•[(V CC+V dem ag)/V demag]•f where f=switching frequency andV demag=demagnetization voltageBased on this formula it is possible to know the value of inductance and/or current to avoid a thermal shut-down.The maximum inductance which causes the chip temperature to reach the shut down temperature in a specific thermal environment,is infact a function of the load current for a fixed V CC,V demag and f. PROTECTING THE DEVICE AGAIST LOAD DUMP-TEST PULSE5The device is able to withstand the test pulse No.5at level II(V s=46.5V)according to the ISO T/R7637/1without any external component.This means that all functions of the device are performed as designed after exposure to disturbance at level II.The VN31is able to withstand the test pulse No.5at level III adding an external resistor of150ohm between pin1and ground plus a filter capacitor of1000µF between pin3and ground(if R LOAD≤20Ω). PROTECTING THE DEVICE AGAINST REVERSE BATTERYThe simplest way to protect the device against a continuous reverse battery voltage(-26V)is to insert a Schottky diode between pin1(GND)and ground,as shown in the typical application circuit (fig.3).The consequences of the voltage drop across this diode are as follows:–If the input is pulled to power GND,a negative voltage of-V f is seen by the device.(Vil,Vih thresholds and Vstat are increased by Vf with respect to power GND).–The undervoltage shutdown level is increa-sed by Vf.If there is no need for the control unit to handle external analog signals referred to the power GND,the best approach is to connect the reference potential of the control unit to node[1] (see application circuit in fig.4),which becomes the common signal GND for the whole control board avoiding shift of V ih,V il and V stat.This solution allows the use of a standard diode.Switching Time WaveformsVN315/11TRUTH TABLEINPUT OUTPUT DIAGNOSTICNormal Operation LH LHHHOpen Circuit(No Load)H H L Over-temperature H L L Under-voltage X L H Short load to V C C L H LFigure1:WaveformsFigure2:Over Current Test CircuitVN316/11VN31 Figure3:Typical Application Circuit With A Schottky Diode For Reverse Supply ProtectionFigure4:Typical Application Circuit With Separate Signal Ground7/11DIM.mm inch MIN.TYP.MAX.MIN.TYP.MAX.A 4.80.189C 1.370.054D 2.4 2.80.0940.110D1 1.2 1.350.0470.053E 0.350.550.0140.022F 0.8 1.050.0310.041F11 1.40.0390.055G 3.2 3.4 3.60.1260.1340.142G1 6.6 6.870.2600.2680.276H210.40.409H310.0510.40.3960.409L 17.850.703L115.750.620L221.40.843L322.50.886L5 2.630.1020.118L615.115.80.5940.622L766.60.2360.260M 4.50.177M140.157Dia3.653.850.1440.152L2L3L5L7L6Dia.ACDED 1H 3H 2FGG 1L1LM M 1F 1P010EPentawatt (vertical)MECHANICAL DATAVN318/11DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 4.80.189C 1.370.054D 2.4 2.80.0940.110D1 1.2 1.350.0470.053E 0.350.550.0140.022F 0.8 1.050.0310.041F11 1.40.0390.055G 3.2 3.4 3.60.1260.1340.142G1 6.66.870.2600.2680.276H210.40.409H310.0510.40.3960.409L 14.2150.5590.590L1 5.7 6.20244L214.615.20.598L3 3.5 4.10.1370.161L5 2.630.1020.118L615.115.80.5940.622L76 6.60.2360.260Dia3.65 3.850.1440.152P010FPentawatt (horizontal)MECHANICAL DATAVN319/11DIM.mminch MIN.TYP.MAX.MIN.TYP.MAX.A 4.80.189C 1.370.054D 2.4 2.80.0940.110D1 1.2 1.350.0470.053E 0.350.550.0140.022F 0.8 1.050.0310.041F11 1.40.0390.055G 3.2 3.4 3.60.1260.1340.142G1 6.66.870.2600.2680.276H210.40.409H310.0510.40.3960.409L223.0523.423.80.9070.9210.937L325.325.6526.10.996 1.0101.028L52.630.1020.118L615.115.80.5940.622L76 6.60.2360.260Dia3.653.850.1440.152P010DPentawatt (In-Line)MECHANICAL DATAVN3110/11元器件交易网VN31 Information furnished is believed to be accurate and reliable.However,SGS-THOMSON Microelectronics assumes no responsability for theconsequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use.Nolicense is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics.Specificationsmentionedin this publication are subject to change without notice.This publication supersedes and replaces all information previously supplied.SGS-THOMSON Microelectronics products are not authorized for use as critical components in life support devices or systems without expresswritten approval of SGS-THOMSON Microelectonics.©1994SGS-THOMSON Microelectronics-All Rights ReservedSGS-THOMSON Microelectronics GROUP OF COMPANIESAustralia-Brazil-France-Germany-Hong Kong-Italy-Japan-Korea-Malaysia-Malta-Morocco-The Netherlands-Singapore-Spain-Sweden-Switzerland-Taiwan-Thailand-United Kingdom-U.S.A11/11。

VOIP接口板卡详解加配置

VOIP接口板卡详解加配置

(5) 配置POTS 拨号进程
详细配置步骤与 《POTS 拨号进程》中的配置POTS 拨号进程相同,区别仅在于如下说明。
port E1模块号/E1端口号:时隙组号 ;将该进程的电话号码绑定在指定端口
另外,E1线路生成的端口通常连接PBX,因而需要进行与PBX交换拨号数字的设置:
forward-digits {num-digit | all | extra} ;向PBX传送指定的拨号数字位数。选项分别为“指定位数 | 所有位数 | 未匹配的数字(即通配符代表的数字)”,默认为extra。
VIC and VWIC卡
VIC2-4FXO 4-port VIC–FXO (universal)—also supports CAMA
VIC2-2FXS 2-port VIC–FXS
VIC2-2E/M 2-port voice interface card–E&M
VWIC-1MFT-E1 1-port RJ-48 multiflex trunk–E1
cas-custom 0
unused-abcd 0 1 1 1
country china
answer-signal group-b 1
cas-custom 1
unused-abcd 0 1 1 1
country china
answer-signal group-b 1
!
class-map match-all video
数字接口有:E1(欧洲标准,中国遵从欧洲标准) 、T1接口(北美标准)、STM1 (155M的带宽,以后voip核心设备会大量使用)
E1:支持30路电话,Cisco模块由一下几种:

白皮书 全新EMC VNX系列简介 VNX5200 VNX5400 VNX5600 VNX5800 VNX7600 VNX8000详细介绍 20131031

白皮书 全新EMC VNX系列简介 VNX5200 VNX5400 VNX5600 VNX5800 VNX7600 VNX8000详细介绍 20131031

I/O 模块 ................................................................................................................ 42
存储处理器的 I/O 模块 .................................................................................................... 42 Data Mover 的 I/O 模块.................................................................................................... 46
白皮书
全新 EMC VNX 系列简介
VNX5200、VNX5400、VNX5600、VNX5800、VNX7600 和 VNX8000
详细介绍
摘论了不同的 型号、新功能和改进的功能,以及主要优点。 2013 年 11 月
版权所有 © 2013 EMC Corporation。保留所有权利。 EMC 确信本出版物在发布之日内容准确无误。本出版物中的 信息可随时更改而不另行通知。 本出版物的内容按“原样”提供。EMC Corporation 对本出 版物的内容不提供任何形式的陈述或担保,明确拒绝对有特 定目的的适销性或适用性进行默示担保。 使用、复制或分发本出版物所描述的任何 EMC 软件都要有相 应的软件许可证。 有关 EMC 产品名称的最新清单,请参见 上的 EMC Corporation 商标。 VMware 是 VMware, Inc. 的注册商标。此处使用的所有其他 商标均为其各自所有者的资产。 部件号 H12145.1

产品说明书 MACH3 以太网控制器 NVEM

产品说明书 MACH3 以太网控制器 NVEM

产品说明书MACH3以太网控制器NVEMMNVEM产品说明书Contect..........................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................................01第一章 概 述1.1 产品简介飞斯特数控专注数控行业7年,专门从事于多种高质量,高可靠性CNC 数控系统的研究、开发和生产工作。

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VN31SPHIGH SIDE SMART POWER SOLID STATE RELAYJuly 1998BLOCK DIAGRAMsMAXIMUM CONTINUOUS OUTPUT CURRENT (#):31 A @ T c =85o Cs 5 V LOGIC LEVEL COMPATIBLE INPUT s THERMAL SHUT-DOWNs UNDER VOLTAGE PROTECTION s OPEN DRAIN DIAGNOSTIC OUTPUT sINDUCTIVE LOAD FAST DEMAGNETIZATIONsVERY LOW STAND-BY POWER DISSIPATIONDESCRIPTION The VN31SP is a monolithic device made using STMicroelectronics VIPower Technology,intended for driving resistive or inductive loads with one side grounded.Built-in thermal shut-down protects the chip from over temperature and short circuit.The open drain diagnostic output indicates: open load in off state, and in on state, output shorted to V CC and overtemperature. Fast demagnetization of inductive loads is archivied by negative (-18V)load voltage at turn-off.®(#) The maximum continuous output current is the the current at T c = 85 o C for a battery voltage of 13V which does not activate self protection.1/9VN31SPABSOLUTE MAXIMUM RATINGCONNECTION DIAGRAMSCURRENT AND VOLTAGE CONVENTIONSVN31SP THERMAL DATAELECTRICAL CHARACTERISTICS (V CC = 13 V; -40 ≤ T j≤ 125 o C unless otherwise specified) POWERSWITCHINGLOGIC INPUTELECTRICAL CHARACTERISTICS (continued)PROTECTION AND DIAGNOSTICS() The V IH is internally clamped at 6V about. It is possible to connect this pin to an higher voltage via an external resistor calculated to not exceed 10 mA at the input pin.note 1: The Nominal Current is the current at T c = 85 o C for battery voltage of 13V which produces a voltage drop of 0.5 V note 2: I OL(off) = (V CC -V OL )/R OL (see figure)note 3: t 1(on): minimum open load duration which acctivates the status output t 1(off): minimum load recovery time which desactivates the status outputt 2(off): minimum on time after thermal shut down which desactivates status output t povl t pol : ISO definition (see figure)Note 2 Relevant FigureNote 3 Relevant FigureVN31SPFUNCTIONAL DESCRIPTION The device has a diagnostic output which indicates open load conditions in off state as well as in on state, output shorted to V CC and overtemperature. The truth table shows input,diagnostic and output voltage level in normal operation and in fault conditions. The output signals are processed by internal logic. The open load diagnostic output has a 5 ms filtering.The filter gives a continuous signal for the fault condition after an initial delay of about 5 ms. This means that a disconnection during normal operation, with a duration of less than 5 ms does not affect the status output. Equally, any re-connection of less than 5 ms during a disconnection duration does not affect the status output. No delay occur for the status to go low in case of overtemperature conditions. From the falling edge of the input signal the status output initially low in fault condition (over temperature or open load) will go back with a delay (t povl )in case of overtemperature condition and a delay (t pol ) in case of open load. These feature fully comply with International Standard Office (I.S.O.)requirement for automotive High Side Driver.To protect the device against short circuit and over current conditions, the thermal protection turns the integrated Power MOS off at a minimum junction temperature of 140 o C.When the temperature returns to 125 o C the switch is automatically turned on again. In short circuit the protection reacts with virtually no delay, the sensor being located in the region of the die where the heat is generated. Driving inductive loads, an internal function of the device ensures the fast demagnetization with atypical voltage (V demag ) of -18V.This function allows to greatly reduce the power dissipation according to the formula:P dem = 0.5 • L load • (I load )2• [(V CC +V demag )/V demag ]•fwhere f = switching frequency and V demag = demagnetization voltageBased on this formula it is possible to know the value of inductance and/or current to avoid a thermal shut-down. The maximum inductance which causes the chip temperature to reach the shut down temperature in a specific thermal environment, is infact a function of the load current for a fixed V CC , V demag and f.PROTECTING THE DEVICE AGAIST LOAD DUMP - TEST PULSE 5 The device is able to withstand the test pulse No. 5 at level II (V s = 46.5V) according to the ISO T/R 7637/1 without any external component. This means that all functions of the device are performed as designed after exposure to disturbance at level II. The VN06SP is able to withstand the test pulse No.5 at level III adding an external resistor of 150 ohm between GND pin and ground plus a filter capacitor of 1000 µF between V CC pin and ground (if R LOAD ≤ 20 Ω).PROTECTING THE DEVICE AGAINST REVERSE BATTERY The simplest way to protect the device against a continuous reverse battery voltage (-26V) is to insert a Schottky diode between GND pin and ground, as shown in the typical application circuit (fig.3).The consequences of the voltage drop across this diode are as follows:If the input is pulled to power GND, a negative voltage of -V f is seen by the device. (Vil, Vih thresholds and Vstat are increased by Vf with respect to power GND).The undervoltage shutdown level is increa- sed by Vf.If there is no need for the control unit to handle external analog signals referred to the power GND, the best approach is to connect the reference potential of the control unit to node [6](see application circuit in fig. 4), which becomes the common signal GND for the whole control board avoiding shift of V ih , V il and V stat . This solution allows the use of a standard diode.Switching Time WaveformsVN31SPTRUTH TABLEFigure 1:WaveformsFigure 2:Over Current Test CircuitVN31SPFigure 3:Typical Application Circuit With A Schottky Diode For Reverse Supply ProtectionFigure 4:Typical Application Circuit With Separate Signal GroundVN31SPVN31SPInformation furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specification mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.The ST logo is a trademark of STMicroelectronics © 1998 STMicroelectronics – Printed in Italy – All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - France - Germany - Italy - Japan - Korea - Malaysia - Malta - Mexico - Morocco - The Netherlands -Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A..VN31SP分销商库存信息:STMVN31SP13TR VN31SPTR-E VN31SP VN31SP-E。

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