BC41B143AXX-IXB-E4中文资料

合集下载

贴片A系列三极管参数

Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Max Sie Phi Phi Zet Sie Phi Phi Max Max Max Max Max Max Max Max Max Max
B B I S B B C C C C C C C I I B N N N N N N N N N N N B D D D D D D RQ BQ I C M N N N N N N
SOT363 SOD323 SOT143 SOT143 SOT143 SOT23 SOT23 SOT323 SOT23 SC74 SOT323 SOT23 SOT23 SOT416 SOD110 SOD323 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT323 SC75 SC74 SOT323 SOT23 SOT143 SOT143 SOD323 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23 SOT23
Code A A A A0 A0 A03 A06 A07 A1 A1 A1 A1 A1p A1t A1t A1s A1s A1s A1X A2 A2 A2 A2s A2 A2 A2 A22 A2X A3 A3 A3 A3 A3 A3p A3t A3 A3X A4 A4s A4s A4s A4s A4 A4p A4t
A4t A4X A5 A5p A5t A5 A5 A5 A6s A6s A6s A6 A6p A6t A6 A6 A6p A6 A6A A6B A6C A6D A6E A6F A6G A6H A6J A6K A6L A6X A7s A7s A7s A7s A7 A7 A7 A8 A8 A8 A8 A8A A8B A8C A8D A8E A8F

爱国者移动伴侣规格说明书

基本信息产品类型移动伴侣产品品牌aigo爱国者产品名称移动伴侣（无线硬盘型）产品型号PB716产品尺寸81mmL x 81mmW x 27mmH产品净重215g产品颜色白装箱清单主机 X1三头USB线 X1快速使用指南 X1三包卡 X1产品合格证 X1环境要求工作温度：5-40°C工作湿度：5%-90%RH（不凝结）储藏温度：0-60°C储藏湿度：5%-90%RH（不凝结）功耗标准最高3.7W接口界面RJ45以太网口 X1复位按键 X1MicroUSB3.0TYPE B插座 X1电源开关按键 X1USB2.0 TYPE A充电插座 X1状态指示灯 X4电池（Batt）指示灯硬盘（HDD）指示灯无线（WLAN）指示灯互联网（WAN）指示灯软硬件主要规格内置电池类型锂聚合物电池内置电池容量2600mAh本机充电规格5V-1A对外充电规格5V-1A无线协议802.11 b/g/n无线频段 2.4GHz无线最高传输速率150Mb/s无线安全WEP/WPA/WPA2无线天线内置式天线无线有效范围无遮挡，直径4米有线网络标准100 BaseT内置存储介质类型 1.8英寸固态硬盘（SSD）内置存储容量32GB （可定制，最高支持128GB）内置存储接口标准USB 3.0内置存储文件系统NTFS文件共享协议支持CIFS、NFS？、Samba协议Web数据传输协议支持IOOS、WebDAV协议访问控制Web管理界面密码保护客户端软件登录密码保护文件共享密码保护Web图形管理界面支持系统设置、网络设置、文件管理、固件升级等功能。

跨平台客户端软件支持iOS（iPad/iPhone）、Android、Windows XP/Vista/7/8、Mac OS质保信息质保政策一个月包换，一年包修全国联保客服电话400-610-6666官方网址基本信息产品类型移动伴侣产品品牌aigo爱国者产品名称移动伴侣（无线硬盘型）产品型号PB726产品尺寸129mmL x 82mmW x 25mmH产品净重245g产品颜色白装箱清单主机 X1三头USB线 X1快速使用指南 X1三包卡 X1产品合格证 X1环境要求工作温度：5-40°C工作湿度：5%-90%RH（不凝结）储藏温度：0-60°C储藏湿度：5%-90%RH（不凝结）功耗标准最高3.7W接口界面RJ45以太网口 X1复位按键 X1MicroUSB3.0TYPE B插座 X1电源开关按键 X1USB2.0TYPE A充电插座 X1状态指示灯 X4电池（Batt）指示灯硬盘（HDD）指示灯无线（WLAN）指示灯互联网（WAN）指示灯软硬件主要规格内置电池类型锂聚合物电池内置电池容量3000mAh本机充电规格5V-1A对外充电规格5V-1A无线协议802.11 b/g/n无线频段 2.4GHz无线最高传输速率150Mb/s无线安全WEP/WPA/WPA2无线天线内置式天线无线有效距离无遮挡，直径4米有线网络标准100 BaseT内置存储介质类型 2.5英寸 SATA 硬盘内置存储容量500GB （可定制，最高支持1.5TB）内置存储接口标准USB 3.0内置存储文件系统NTFS文件共享协议支持CIFS、NFS？、Samba协议Web数据传输协议支持IOOS、WebDAV协议访问控制Web管理界面密码保护客户端软件登录密码保护文件共享密码保护Web图形管理界面支持系统设置、网络设置、文件管理、固件升级等功能。

S3C44BOX 中文数据手册

S3C44B0X中文数据手册目录S3C44B0X中文数据手册 (1)13 A/D转换器 (2)13．2 S3C44B0X具备的ADC (2)13．2．1ADC转换时间计算 (2)13．2．2 ADC的分辨率的计算 (3)13．2．3 关于采样保持器 (3)13．2．4 ADC的相关寄存器 (3)13．2．4．1 A/D转换控制寄存器（ADCCON） (3)13．2．4．2 A/D转换预分频寄存器 (4)13．2．4．3 A/D转换数据寄存器 (4)13 A/D转换器13．2 S3C44B0X具备的ADCS3C44B0X具有8路模拟信号输入的10位模/数转换器（ADC），它是一个逐次逼近型的ADC，内部结构中包括模拟输入多路复用器，自动调零比较器，时钟产生器，10位逐次逼近寄存器（SAR），输出寄存器如下图所示。

这个ADC还提供可编程选择的睡眠模式，以节省功耗。

图13－2 S3C44B0X内部ADC结构图上图展示了S3C44B0X内部ADC的功能结构图。

清注意，出于对电压的稳定性的考虑，正向参考电压REFT，反向参考电压REFB和模拟共用电压VCOM应该相应地连接一个旁路电容（ARMSys上已经具备）。

它的主要特性是：－分辨率：10位；－微分线性度误差：±1 LSB－积分线性度误差：±2 LSB（最大±3 LSB）－最大转换速率： 100KSPS－输入电压范围：0－2.5V－输入带宽：0－100Hz（不具备采样保持(S/H)电路）－低功耗13．2．1ADC转换时间计算A/D转换时间即完成一次A/D转换所需要的时间。

当系统的时钟频率微64MHz且ADC 时钟源的预分频值为20时，10位数字量的转换时间如下：64MHz / 2*(20+1) / 16（10位操作至少要16个周期）＝ 95.2 KHz ＝ 10.5 us S3C44B0X的这个ADC不具有采样保持电路，因此虽然它具有较高的采样速度，但为了得到精确的转换数据，输入的模拟信号的频率应该不超过100Hz。

USB Type-C 规范1.2(中文版)

INTELLECTUAL PROPERTY DISCLAIMER
知识产权声明
THIS SPECIFICATION IS PROVIDED TO YOU “AS IS” WITH NO WARRANTIES WHATSOEVER, INCLUDING ANY WARRANTY OF MERCHANTABILITY, NON-INFRINGEMENT, OR FITNESS FOR ANY PARTICULAR PURPOSE. THE AUTHORS OF THIS SPECIFICATION DISCLAIM ALL LIABILITY, INCLUDING LIABILITY FOR INFRINGEMENT OF ANY PROPRIETARY RIGHTS, RELATING TO USE OR IMPLEMENTATION OF INFORMATION IN THIS SPECIFICATION. THE PROVISION OF THIS SPECIFICATION TO YOU DOES NOT PROVIDE YOU WITH ANY LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS.
预发行行业审查公司提供反馈
Revision History.......................................................................................................................14
LIMITED COPYRIGHT LICENSE: The USB 3.0 Promoters grant a conditional copyright license under the copyrights embodied in the USB Type-C Cable and Connector Specification to use and reproduce the Specification for the sole purpose of, and solely to the extent necessary for, evaluating whether to implement the Specification in products that would comply with the specification.

XL4013原厂资料中文版演示

线性调整率与负载调整率：
Efficiency(%) Output voltage(V)
Efficiency VS Load current
100
95
90
85
80
75
70
VIN=8V,VOUT=5V,IOUT=0.1A~4A
65
VIN=12V,VOUT=5V,IOUT=0.1A~4A
VIN=24V,VOUT=5V,IOUT=0.1A~4A
5.070
3.8
5.072
4.0
EFF(%) 53.67 63.43 73.50 77.60 80.40 81.72 82.62 82.96 83.51 83.69 83.84 83.99 84.12 84.05 84.15 83.40 83.54 83.39 83.28 83.29 83.07
转换效率：
版本：1.1 页数：第 4 页，共 6 页
DEMO 实物图
PCB 布局
30mm
40mm
顶层
底层
应用信息
输入电容选择在连续模式中，转换器的输入电流是一组占空比约为 VOUT/VIN 的方波。为了防止大的瞬态电压，必须采用针对最大 RMS 电流要求而选择低 ESR(等效串联电阻)输入电容器。对于大多数的应用，1 个 10uF 的输入电容器就足够了, 它的放置位置尽可能靠近 XL4013 的位置上。最大 RMS 电容器电流由下式给出：
5.057
0.1
5.056
0.2
5.058
0.4
5.058
0.6
5.057
0.8
5.057
1.0
5.057
1.2
5.058

E3643A中文资料(Agilent(Hewlett-Packard))中文数据手册「EasyDatasheet - 矽搜」

防护
一年E364xA系列电源
三个月标准运附件
产品监管
设计符合UL3111-1;认证,CSA 22.2 1010.1号; 符合IEC 1010-1;符合EMC指令89/336/EEC（第1组,A类）
订购信息
安捷伦E364xA系列电源 E3640A 30瓦单电源 E3641A 30瓦单电源 E3642A 50瓦单电源 E3643A 50瓦单电源 E3644A 80瓦单电源 E3645A 80瓦单电源 E3646A 60瓦双电源 E3647A 60瓦双电源 E3648A 100瓦双电源 E3649A 100瓦双电源
E3640A
E3641A
E3642A
E3643A
E3644A
E3645A
30 W
50 W
80 W
1
0至8 V / 3 A或 0 to 20 V/1.5 A
5.3千克
1
0〜35 V / 0.8 A或 0 to 60 V/0.5 A
5.2千克
1
0至8 V / 5 A或 0 to 20 V/2.5 A
6.3千克
*与1CM或锁定链接机架安装/ FL法兰套件需要
安捷伦或客户支持轨
安捷伦支持RailsE3663AC
5
（标准命令可编程仪器）允许快速和简单编程程
序. 此外,用户手册,为所有最终用户编程足够信息,从初学者到退伍军人 .
广泛支持
VXI 即插即用软件驱动程序适用于VEE,国家仪器公司LabVIEW and LabWin dows .有这些驱动程序, 整合E364xA到您系统不能有任何容易.该
驱动程序在微软支持
准确度编程电压
12个月
（@ 25ºC±5°C）,±（％输出+偏移）

PENTAX电子下消化道内窥镜中文操作手册

警告
：可能导致死亡或严重损伤。
小心
：可能导致轻微/中度损伤或设备损坏。
注意
：可能导致设备损坏。同时向购买者和操作者提供使用本设备的重要信息。
说明
联邦（美国）法律规定，定购及销售本仪器的人员必须为医生或其他具有注册资格的医务人员。
“生产商”标志
“生产日期”标志
“欧盟授权经销商”标志
The CE marking assures that this product complies with the requirements of the EC directive for safety. Das CE Zeichen garantiert, daß dieses Produkt die in der EU erforderlichen Sicherheitsbestimmungen erfüllt. Le logo CE certifie que ce produit est conforme aux normes de sécurité prévues par la Communauté Européenne. II marchio CE assicura che questo prodotto è conforme alle direttive CE relative alla sicurezza. La marca CE asegura que este producto cumple todas las directivas de seguridad de la CE.
本手册中的内容适用于多款PENTAX内窥镜，使用者必须仔细阅读，并严格遵守与封面上所印刷的特定型号相关的各项指示和说明。
如果您对本说明书中的信息由任何疑问，或存在设备安全性和（或）使用方面的问题，请与当地PENTAX经销商联系。

致铭主板zm-el41b-p43b-p43c

掩盖或堵塞。 6.在将本设备与电源连接前,请确认电源电压值,将电压调整为 110V/220V。 7.请将电源置于不会被践踏到的地方, 并且不要在电源线上堆置任何对象。 8 . 插拔任何扩展卡或设备模块前，请都将电源线拔下。 9. 请留意手册上提到的所有注意和警告事项。 10.不得将任何液体倒入机箱开口的缝槽中，否则会产生严重损坏或电路瘫痪。 1 1. 如果发生以下情况，请找专业人员处理;
产品清单说明
请确认您所购买的主机板包装及相关配件是否完整，如果有包装损坏或是有任何配件短缺的情形，请尽快与您的经销商联系。
1. ZM-ELG41B-LM(GM)/ZM-ELP43C-L(G)/ZM-ELP43B-L(G)主机板一块 2. Ultra ATA 100 IDE 排线一根(选配) 3. 驱动程序光盘一张 4. 用户手册一本 5. SATA 数据连接线一根 6. 质保卡一张 7. 合格证一张 8. 挡板一块
第四章驱动程序的安装 ....................... 33
4.1 安装 Intel 芯片组驱动程序 ............................... 3 3 4 . 2 板载网卡驱动的安装 ...................................... 3 3 4.3 USB2.0 驱动程序的安装 ................................... 3 3 4 . 4 声卡驱动程序的安装 ...................................... 3 4 4.5 DirectX 9.0 的安装 ..................................... 3 4 4 . 6 六声道输出的设置 ........................................ 3 4 4 . 7 八声道输出的设置 ........................................ 3 5 4. 8 话筒设置说明 ............................................ 3 6Βιβλιοθήκη CTHIM Mainboard

IBM B24参数介绍

硬件概要
∙ 1 U 19 " 封装设计适于安装在机架上或桌面上。

∙通过 8Gbps 光纤通道端口实现高性能（需要支持 8Gbps 吞吐量的存储硬件）。

∙速度自动检测功能可向后兼容 4、2 和 1Gbps 光纤通道链路。

∙支持 8、4 和 2Gbps 链路速度或 4、2 和 1Gbps 链路速度，具体取决于所使用的 SFP 光学收发器。

∙可以将不同速度的短波和长波 SFP 混合在同一交换机中，以便满足特定需求。

∙所有的端口上均可进行全光纤网络操作和通用端口操作。

∙所有端口均支持交换机间链路（ISL）干线。

∙高级分区、使用 Web 工具的智能管理和监控、Fabric Watch 和性能监控功能。

∙非阻塞架构配有 24个端口，可以提供高达 284Gbps 的总吞吐量。

∙标准高级分区功能可提供硬件强制分区，以防止未经授权或验证的存储网络访问、不安全的管理访问以及全球名称欺诈。

∙IBM SAN b 型交换机和导向器使用通用的交换机固件，有助于简化 SAN 光纤网络扩展。

∙固件升级不会影响正常运行。

∙可以使用 GUI、SNMP 和 Telnet 通过光纤网络进行远程访问和远程管理。

BCX51 52 53 PNP中间功率导电器SOT89数据手册说明书

Features• BV CEO > -45V, -60V & -80V• I C = -1A Continuous Collector Current • I CM = -2A Peak Pulse Current• Low Saturation Voltage V CE(sat) <************• Gain Groups 10 and 16• Complementary NPN Types: BCX54, 55, and 56• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) • Halogen- and Antimony-Free. "Green" Device (Note 3)•For automotive applications requiring specific change control (i.e. parts qualified to AEC-Q100/101/200, PPAPcapable, and manufactured in IATF 16949 certified facilities),please contact us or your local Diodes representative.https:///quality/product-definitions/Mechanical Data• Case: SOT89• Case Material: Molded Plastic, “Green” Molding Compound; UL Flammability Rating 94V-0• Moisture Sensitivity: Level 1 per J-STD-020•Terminals: Matte Tin Finish Leads; Solderable per MIL-STD-202 Method 208•Weight: 0.052 grams (Approximate)Applications • Medium Power Switching or Amplification Applications • AF Driver and Output StagesOrdering Information (Note 4)Product Compliance Marking Reel Size (inches)Tape Width (mm)Quantity per ReelBCX51TA Standard AA 7 12 1,000 BCX51-13R Standard AA 13 12 4,000 BCX5110TA Standard AC 7 12 1,000 BCX5116TA Standard AD 7 12 1,000 BCX5116TC Standard AD 13 12 4,000 BCX52TA Standard AE 7 12 1,000 BCX5210TA Standard AG 7 12 1,000 BCX5216TA Standard AM 7 12 1,000 BCX53TA Standard AH 7 12 1,000 BCX5310TA Standard AK 7 12 1,000 BCX5316TA Standard AL 7 12 1,000 BCX5316TC Standard AL 13 12 4,000 BCX5316-13R Standard AL 13 12 4,000 BCX5110TC Standard AC 13 12 4,000 BCX51TC Standard AA 13 12 4,000 BCX5210TC Standard AG 13 12 4,000 BCX5216TC Standard AM 13 12 4,000 BCX52TC Standard AE 13 12 4,000 BCX5310TC Standard AK 13 12 4,000 BCX53TCStandardAH13124,000Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant.2. See https:///quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds.4. For packaging details, go to our website at https:///design/support/packaging/diodes-packaging/.Top View Device SymbolTop View Pin-Out SOT89E C BMarking InformationAbsolute Maximum Ratings (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol BCX51 BCX52 BCX53 Unit Collector-Base Voltage V CBO -45 -60 -100 V Collector-Emitter Voltage V CEO -45-60 -80V Emitter-Base Voltage V EBO -5 V Continuous Collector CurrentI C -1 A Peak Pulse Collector Current (Single pulse) I CM -2 Continuous Base CurrentI B -100 mAPeak Pulse Base Current (Single pulse) I BM-200Thermal Characteristics (@ T A = +25°C, unless otherwise specified.)CharacteristicSymbol Value Unit Power Dissipation(Note 5) P D1 W(Note 6) 1.5 (Note 7) 2.0 Thermal Resistance, Junction to Ambient Air (Note 5) R θJA 125 °C/W (Note 6) 83 (Note 7)60 Thermal Resistance, Junction to Lead (Note 8) R θJL 13 °C/W Thermal Resistance, Junction to Case (Note 9)R θJC 27 °C/W Operating and Storage Temperature Range T J, T STG-55 to +150°CESD Ratings (Note 10)CharacteristicSymbol Value Unit JEDEC ClassElectrostatic Discharge - Human Body Model ESD HBM 4,000 V 3A Electrostatic Discharge - Machine ModelESD MM400VCNotes: 5. For a device mounted with the exposed collector pad on 15mm x 15mm 1oz copper that is on a single-sided 1.6mm FR4 PCB; device is measured under still air conditions whilst operating in a steady-state.6. Same as Note 5, except the device is mounted on 25mm x 25mm 1oz copper.7. Same as Note 5, except the device is mounted on 50mm x 50mm 1oz copper.8. Thermal resistance from junction to solder-point (on the exposed collector pad).9. Thermal resistance from junction to the top of the case.10. Refer to JEDEC specification JESD22-A114 and JESD22-A115.xx = Product Type Marking Code, as follows:BCX51 = AA BCX52 = AEBCX53 = AH BCX5110 = AC BCX5210 = AG BCX5310 = AK BCX5116 = AD BCX5216 = AMBCX5316 = ALThermal Characteristics and Derating Information2550751001251500.00.20.40.60.81.0Derating CurveTemperature (°C) M a x P o w e r D i s s i p a t i o n (W )Transient Therm al Im pedanceT h e r m a l R e s i s t a n c e (°C /W )Pulse Width (s)Pulse Power DissipationPulse Width (s)M a x P o w e r D i s s i p a t i o n (W )Copper Area (sqmm)M a x i m u m P o w e r (W )Copper Area (sqmm)T h e r m a l R e s i s t a n c e (°C /W )Note:11. Measured under pulsed conditions. Pulse width ≤ 300µs. Duty cycle ≤ 2%.Typical Electrical Characteristics (@ T A = +25°C, unless otherwise specified.)-I , COLLECTOR CURRENT (A)C h ,D C C U R RE N T G A I NF E Fig. 2 Typical DC Current Gain vs. Collector CurrentDC Current Gain vs. Collector Current -V , COLLECTOR-EMITTER VOLTAGE (V)CE I , C O L L E C T O R C U R R E N T (A )CFig. 1 Typical Collector Current vs. Collector-Emitter VoltageCollector Current vs. Collector-Emitter Voltage -h FE V I CI C V V CETypical Electrical Characteristics (continued.)0.20.40.60.81.0-V , B A S E -E M I T T E R T U R N -O N V O L T A G E (V )B E (O N)-I , COLLECTOR CURRENT (A)C -V , C O L L E C T O R -E M I T T E R S A T U R A T I O N V O L T A G E (V )C E (S A T )Fig. 4 Typical Collector-Emitter Saturation Voltagevs. Collector Current 0.20.40.60.81.01.2-V , B A S E -E M I T T E R S A T U R A T I O N V O L T A G E (V B E (S AT )-I , COLLECTOR CURRENT (mA)C f , G A I N -B A ND W I D T H P R O D U C T (M H z )T Fig. 6 Typical Gain-Bandwidth Product vs. Collector Current V , REVERSE VOLTAGE (V)R C A P A C I T A N C E (p F )Fig. 7 Typical Capacitance Characteristics -V B E (s a t ), B A S E -E M I T T E R S A T U R A T I O N V O L T A G E )-V B E (o n ), B A S E -E M I T T E R T U R N -O N V O L T A G E (V )-V C E (s a t ) , C O L L E C T O R -E M I T T E RC v V RVCE(sat) V I Cf T V I CPackage Outline DimensionsPlease see /package-outlines.html for the latest version.SOT89SOT89Dim Min Max TypA 1.40 1.60 1.50B 0.50 0.62 0.56B1 0.42 0.540.48c 0.35 0.43 0.38D 4.40 4.60 4.50D1 1.62 1.83 1.733D2 1.61 1.81 1.71E 2.40 2.60 2.50E2 2.05 2.35 2.20e - - 1.50H 3.95 4.25 4.10H1 2.63 2.93 2.78L 0.90 1.20 1.05L1 0.327 0.527 0.427z 0.20 0.40 0.30All Dimensions in mmSuggested Pad LayoutPlease see /package-outlines.html for the latest version.SOT89Dimensions Value(in mm)C 1.500G 0.244X 0.580X1 0.760X2 1.933Y 1.730Y1 3.030Y2 1.500Y3 0.770Y4 4.530TOP VIEW。

BCX41-资料

10 4 BCX 41/BSS 64 nA
Ι CB0 10 3 5
10 2 5
10 1 5
100 5
10 -1
0
50
max
EHP00426
10 3 BCX 41/BSS 64 h FE 5
10 2 typ
5
EHP00427
150 ˚C 25 ˚C -50 ˚C
100 ˚C 150 TA
10 1 10 -1
Parameter
Symbol
Values
Unit
min. typ. max.
DC Characteristics
Collector-emitter saturation voltage1)
VCEsat
V
IC = 300 mA, IB = 30 mA
BCX41
-
-
0.9
IC = 4 mA, IB = 0.4 mA
BCX41 BCX41
IEBO ICEO
-
- 100 nA
µA
-
-
10
-
-
75
DC current gain 1)
IC = 100 µA, VCE = 1 V IC = 1 mA, VCE = 1 V IC = 4 mA, VCE = 1 V IC = 10 mA, VCE = 1 V IC = 20 mA, VCE = 1 V IC = 100 mA, VCE = 1 V IC = 200 mA, VCE = 1 V
BSS64 BCX41
BSS64 BCX41
V(BR)EBO 5
ICBO -
ICBO -
-
-
nA

BC40充电器使用说明书 20161114

BC40充电器产品使用说明书目录概述 (2)免责说明 (2)阅读提示 (2)注意事项 (3)警告 (3)不适宜场合 (3)充放电使用说明 (3)产品使用 (4)产品简介 (4)外观说明 (4)功能菜单 (5)其他功能介绍 (10)常见问题 (11)日常维护 (12)长期存放 (12)产品参数 (12)概述本说明书是随机附带部分，建议新购入机器者或供应商都应保存说明书，保证产品使用前已详细阅读本手册免责说明感谢您购买使用本产品。

任何用户在使用本产品之前，请仔细阅读本手册，一旦使用，即被视为对本声明全部内容的认可和接受。

请严格遵守本手册安装和使用该产品，鉴于深圳市北航旭飞科技有限公司（以下简称“旭飞”）无法控制用户的具体使用情况，旭飞不承担因任何操作、安装和使用控制上所导致的任何性能、安全与法律等相关责任。

请在专业人员指导下操作本产品，旭飞不承担因用户安装、配置、操作等导致的任何事故负责。

请在法律允许的范围内使用本产品，旭飞不承担因任何非法使用而导致的法律责任。

阅读提示⊘禁止重要注意事项操作使用提示阅读提示注意事项警告保持充电器远离灰尘、潮湿、雨淋、热源、阳光直射以及振动源。

充电器和电池必须放置在隔热、不易燃、绝缘的表面，勿将其放在汽车座位、地毯或类似的地方。

远离所有易燃、易挥发物，远离操作区域。

为避免充电线之间的短路，请先将外接电源接入充电器，再将电池连上。

解除连接时使用相反的顺序。

允许输入电压为220VAC(最大功率4000W)。

请避免儿童接触。

使用时至少配备一种有效灭火装置。

不适宜场合包含有不同种类电池的电池包（包括不同生产商）。

已经充满的的电池。

仅限于锂(LiPo,LiHV,LiIo,LiFe)电池充电，请勿用于其他电池充电；充放电使用说明1.此充电器支持家用供电设备或发电机发电设备提供交流电源(220VAC),最大功率可支持4000W,用户需要确认供电设备的最大功率是否能满足要求，以免跳闸断电等现象。

cp41培训资料

4
3.安全回路板 MC23
MC23 电路板根据#HS 继电器有无有两种型号，F/HS 的场合使用无#HS 继电器的规格。
6602GBN001 C1x-MC23x
#HS 继电器搭载
6602GBN002
C2x-MC23x
#HS 继电器不搭载
1)MC23 电路板上搭载了 6 个安全回路监视状态确认用的 AC 监视器：*B、*C、*D、*E、*G、*I。
关于 FULL/WEAK 电压设定，CP38 系统的场合是通过 IF118 板上的 FULL/WEAK 旋钮开关进行设定，CP40 的场合是通过 IF139 板上的 FULL/WEAK 旋钮开关进行设定，VS49 板上没有 FULL/WEAK 旋钮开关，FULL/WEAK 电压是通过 EEPROM 进行设定，具体见下表：
00
DCL-35F 富士 100W 马达 2CO
20
DRD-10F 天津核奥达制 PM 马达 2CO
F002(B) 数据有效判定(1)
AA
设定数据初始化时，即使监视到的数据是正确
F003(B) 数据有效判定(2)
55
的，也需要进行写入处理。
F004(I) 开口距离
----- 单位:mm
关于 F001(B)的设定详细见下表：
亮灯：变频器控制程序检出异常，30B为ON。闪烁：变频器控制程序使Y5信号为ON。灭灯：正常注：如果LED10, LED11, UP, DN全部亮灯时，表示V-MIC的ROM不良。
4)EEPROM的数据范围
CP41 地址
0F00～1FFF A000～AFFF B000～BFFF ※0F00～0FFF 为变频器控制程序用的 EEPROM 范围，其余为 M-MIC 的 EEPROM 范围。

FB41-FB42参数详细说明 S7-300 西门子

用Step7 中SFB41/FB 41，SFB42/FB42，SFB43/FB43实现PID控制SLC A&D CSMay 2004目录1概述 (3)1.1应用 (3)1.2控制系统分析 (4)2PID系统控制器的选择 (7)2.1连续控制器、开关控制器 (7)2.2固定值控制器 (8)2.3级联控制器 (8)2.4混合控制器 (8)2.5比例控制器 (9)2.5.1单循环比例控制器 (9)2.5.2多循环比例控制器 (9)2.6二级控制器 (9)2.7三级控制器 (10)3布线 (10)3.1布线规则 (10)3.1.1连接电缆 (10)3.1.2屏蔽端接元件 (10)3.1.3警告 (10)3.1.4其它信息 (10)4参数赋值工具介绍 (10)4.1调试PID参数的用户界面 (11)4.2获取在线帮助的途径 (12)5在用户程序中实现 (12)5.1调用功能块 (12)5.2背景数据块 (13)5.3程序结构 (13)6功能块介绍 (13)6.1连续调节功能SFB 41/FB 41 “CONT_C” (13)6.1.1简介 (13)6.1.2应用程序 (14)6.1.3说明 (14)6.2步进控制功能SFB 42/FB 42“CONT_S” (26)6.2.1简介 (26)6.2.2应用程序 (26)6.2.3说明 (27)6.3脉冲宽度调制器SFB 43/FB 43“PULSEGEN” (36)6.3.1简介 (36)6.3.2应用程序 (36)6.3.3说明 (36)7功能块举例 (49)1 概述本文中所讨论的功能块（SFB41/FB41，SFB42/FB42，SFB43/FB43）仅仅是使用于S7和C7的CPU中的循环中断程序中。

该功能块，定期计算所需要的数据，保存在指定的DB中（背景数据块）。

允许多次调用该功能块。

CONT_C块与PULSEGEN块组合使用，可以获得一个带有比例执行机构脉冲输出的控制器（例如，加热和冷却装置）。

低频小功率三极管3AX31

低频小功率三极管 3AX31
三极管由于其特性不同，可选为低频管、高频管、开关管等。从材料来看，用途最广泛的有锗管和硅管两类。3AX 系列属锗管、低频管一类。通常用于低频放大电路中，下为 3AX31 技术性能。
主要电参数
参数符号单位
ICBO
µA
直
ICEO
µA
流
参 VCE（sat）
V
数
hFE
hie
KΩ
交
hfe
流
hre
×10-4
参
hoe
µΩ
数
fβ
kHz
KP
dB
BVCBO
V
极 BVCEO
V
限
ICM
mA
参
PCM
mW
数
RT
℃
/mW
测试条件 VCB=-6V VCE=-6V VBE=VCE IC=-125mA
VCE=-1V IC=-100mA VCE=-6V
IC=-1mA f=1 kHz
VCE=-6V IC=-10mA
hre hfe hoe fβ Kp BVCBO BVCEO ICM PCM RT
———共发射极小信号开路电压反馈系数 ———共发射极小信号短路电流放大系数 ———共发射极小信号开路输出导纳短路电流放大系数 ———共发射极截止频率 ———功率增益
———发射极开路，集电极-基极反向击穿电压 ———基极开路，集电极-发射极反向击穿电压 ———集电极最大允许电流 ———集电极最大允许耗散功率 ———半导体管的
≤0.65 50～150
0.5～4 30～150
≤13 ≤100
≥8 21～30
≥40 ≥25 1Biblioteka 5 125≥8 38～48

B系列

B 系列型号电压V电流A功率W频率等BC107B SI-N50V0.2A0.3W250MHz BC107C SI-N50V0.2A0.3W250MHz BC109B SI-N30V0.2A0.3W300MHz BC109C SI-N30V0.2A0.3W150MHz BC117SI-N120V50mA0.3W>60MHz BC119SI-N60V1A0.8W10MHz BC135SI-N45V0.2W>200MHz BC136SI-N60V0.5A0.3W>60MHz BC139SI-P40V0.5A0.7WBC141-10SI-N100V1A0.75W50MHz BC141-16SI-N100V1A0.75W50MHz BC142SI-N80V1A0.8WBC143SI-P60V1A0.7W AF/DRIVE BC146SI-N20V50mA50mW150MHz BC161-16SI-P60V1A0.75W50MHz BC177A SI-P50V0.1A0.3W130MHz BC177B SI-P50V0.1A0.3W130MHz BC177C SI-P50V0.1A0.3W130MHz BC190SI-N70V0.1A0.3W250MHz BC285SI-N120V0.1A0.36W80MHz BC300SI-N120V0.5A6W120MHz BC303SI-P85V1A6W75MHz BC313SI-P60V1A4W50MHz BC323SI-N100V5A0.8W100MHz BC327-16SI-P50V0.8A625mW100MHz BC327-25SI-P50V0.8A625mW100MHz BC327-40SI-P50V0.8A625mW100MHz BC336SI-P25V50mA0.31W50MHz BC337-16SI-N50V0.8A625mW150MHz BC337-25SI-N50V0.8A625mW150MHz BC337-40SI-N50V0.8A0.625W150MHz BC368SI-N20V1A0.8W100MHz BC369SI-P20V1A0.8WBC376SI-P25V1A0.625W150MHz BC393SI-P180V10mA40mWBC441SI-N75V2A1WBC448SI-P80V0.3A0.625W>100BC449SI-N100V0.3A0.625WBC450SI-P100V0.3A0.625WBC451SI-N50V0.1A0.3W>150MHz BC461SI-P75V2A1WBC485SI-N45V1A0.625W200MHz BC487B SI-N60V1A0.625W200MHzBC488SI-P60V0.1A625mW>135MHz BC489SI-N80V1A0.625W200MHz BC490SI-P80V1A0.625W200MHz BC516P-DARL40V0.4A0.625WBC517N-DARL40V0.4A0.625WBC538SI-N80V1A0.625W100MHz BC546A SI-N80V0.2A0.5WBC546B SI-N80V0.2A0.5WBC546C SI-N80V0.1A0.5WBC547A SI-N50V0.2A0.5WBC547B SI-N50V0.2A0.5W300MHz BC547C SI-N50V0.2A0.5W300MHz BC550B SI-N50V0.2A0.5WBC550C SI-N50V0.2A0.5WBC556A SI-P60V0.2A0.5WBC556B SI-P80V0.2A0.5WBC557A SI-P50V0.2A0.5WBC557B SI-P50V0.2A0.5WBC557C SI-P50V0.2A0.5WBC560B SI-P50V0.2A0.5WBC560C SI-P50V0.2A0.5WBC618N-DARL80V1A0.625W B>10BC639SI-N80V1A0.8W100MHz BC640SI-P80V1A0.8W130MHz BC807-25SI-P50V0.5A0.25W5BBC807-40SI-P45V0.5A0.3W100MHz BC817-16SI-N50V0.5A0.25W6ABC817-25SI-N50V0.5A0.25W6BBC817-40SI-N50V0.5A0.25W6CBC828SI-P50V0.8A0.8W100MHz BC846B SI-N80V0.1A0.25W1BBC847A SI-N50V0.1A0.2WBC847B SI-N50V0.1A0.25W1FBC847BR SI-N50V0.1A0.25W SMDBC847C SI-N50V0.1A0.25W1GBC849C SI-N30V0.1A0.25W2CBC850C SI-N45V0.1A0.25W2GBC856A SI-P65V0.1A150MHz,3A BC856B SI-P65V0.1A150MHz,3B BC857A SI-P50V0.1A150MHz BC857B SI-P45V0.1A0.2W3FBC857BR SI-P45V0.1A0.2WBC857C SI-P45V0.1A0.25W3GBC859B SI-P30V0.1A0.25W4BBC860B SI-P50V0.1A4FBC860C SI-P50V0.1A4GBC868SI-N25V1A60MHzBC869SI-P25V1A1W60MHzBC879N-DARL100V1A0.8WBC880P-DARL100V1A0.8WBCP68SI-N20V1A 1.5W60MHz BCV27N-DARL40V0.5A0.25W B>1BCX17SI-P50V0.5A100MHz,T1 BCX17R SI-P50V0.5A100MHz,T4 BCX19SI-N50V0.5A300mW200MHz BCX38B N-DARL80V0.8A1W B>4000 BCX53SI-P100V1A50MHz BCX56SI-N100V1A130MHz BCY59SI-N45V0.2A1W250MHz BCY71SI-P45V0.2A0.35WBCY72SI-P30V0.2A0.35WBCY79SI-P45V0.2A1W180MHz BCY85SI-N100V0.2A0.3WBD109SI-N60V3A15WBD115SI-N245V0.15A0.8WBD129SI-N400V0.5A17.5WBD131SI-N70V3A15W>60MHz BD132SI-P45V3A15W>60MHz BD139SI-N80V 1.5A12.5W50MHzBD139-16SI-N80V 1.5A12.5W50MHzBD140SI-P80V 1.5A12.5W50MHzBD140-16SI-P80V 1.5A12.5W50MHzBD141SI-N140V8A117WBD142SI-N50V15A117WBD159SI-N375V0.5A20WBD160SI-N250V5A25WBD179SI-N80V3A30WBD180SI-P80V3A30W>2MHzBD183SI-N85V15A117WBD201SI-N60V8A55WBD201F SI-N60V8A32WBD204F SI-P60/60V8A60W>7MHzBD230SI-N100V 1.5A12.5WBD231SI-P100V 1.5A12.5WBD232SI-N300V0.25A7WBD237SI-N100V2A25W3MHzBD238SI-P100V2A25W3MHzBD239C SI-N100V2A30W3MHzBD240SI-P45V2A30WBD240C SI-P100V2A30W3MHzBD241C SI-N100V3A40W3MHzBD241D SI-N120V3A40W3MHzBD242C SI-P100V3A40W3MHzBD243C SI-N100V6A65W3MHzBD243F SI-N200V6A65W3MHz BD244C SI-P100V6A65W3MHz BD244F SI-P200V6A65W3MHz BD250C SI-P100V25A125W3MHz BD277SI-P45V7A70W>10MHz BD302SI-P60V8A55W>3MHz BD303SI-N60V8A55W>3MHz BD314SI-P80V10A150WBD317SI-N100V16A200W1MHz BD318SI-P100V16A200WBD329SI-N32V3A15W130MHz BD330SI-P32V3A15WBD335N-DARL100V6A60WBD336P-DARL100V6A60WBD337N-DARL+D120V6A60W>10MHz BD362SI-P32V3A15WBD371B SI-N60V1,5A2,5WBD385SI-N60V1A10W>250MHz BD387SI-N80V1A10W>250MHz BD410SI-N500V1A20WBD411N-DARL50V2A10W B>25K BD441SI-N80V4A36W3MHz BD442SI-P80V4A36W3MHz BD515SI-N45V2A10W160MHz BD537SI-N80V8A50WBD538SI-P80V4A50W>3MHz BD539SI-N40V5A45WBD543C SI-N100V8A70W3MHz BD545SI-N40V15A85W3MHz BD637SI-N100V2A3OW>3MHz BD638SI-P100V2A30W>3MHz BD648P-DARL80V8A62,5WBD651N-DARL120V8A62.5WBD652P-DARL120V8A62.5WBD679A N-DARL+D80V4A40WBD680A P-DARL+D80V4A40WBD681N-DARL+D100V4A40W B>75 BD682P-DARL+D100V4A40WBD683N-DARL120V4A40WBD684P-DARL120V4A40WBD711SI-N100V12A75WBD712SI-P100V12A75W POWER BD722SI-P80V4A36W>3MHz BD743C SI-N110V15A90W>5MHz BD744C SI-P110V15A90W5MHz BD750SI-P100V20A200WBD751SI-N100V20A200WBD791SI-N100V4A15WBD792SI-P100V4A15WBD801SI-N100V8A65W>3MHz BD829SI-N100V1A8WBD830SI-P100V1A8W75MHz BD839SI-N45V 1.5A10W125MHz BD843SI-N100V 1.5A10W>150MHz BD877N-DARL80V1A9W200MHz BD879N-DARL100V1A9W200MHz BD880P-DARL100V1A200MHz BD901N-DARL+D100V8A70WBD902P-DARL100V8A70WBD911SI-N100V15A90WBD912SI-P100V15A90WBD939F SI-N120V3A19W3MHz BD941SI-N140V3A30W3MHz BD942SI-P140V3A30W3MHz BD943SI-N22V5A40W3MHz BD948SI-P45V5A40W3MHz BD951SI-N80V5A40W>3MHz BD956SI-P120V5A40W3MHz BDT61N-DARL+D60V4A50W>10MHz BDT61C N-DARL+D120V4A50W>10MHz BDT61F N-DARL+D60V4ABDT62C P-DARL120V10A90W B>1K BDT63C N-DARL120V10A90W B>1K BDT64C P-DARL120V12A125W B>1K BDT65C N-DARL120V12A125W B>1K BDT85A SI-N100V15A125W20MHz BDT86A SI-P100V15A125W20MHz BDT87SI-N120V15A125W10MHz BDT88SI-P120V12A117WBDT95A SI-N100V10A90W4MHz BDT96A SI-P100V10A90W4MHz BDV64C P-DARL+D120V20A125W B>BDV65B N-DARL+D100V20A125W B>BDV65C N-DARL+D120V20A125W B>BDV66C P-DARL+D120V16A200W7MHz BDV66D P-DARL+D160V16A200WBDW22C SI-P100V10A90W>3MHz BDW23C N-DARL+D100V6A50WBDW42N-DARL100V15A85W B>1K BDW46P-DARL80V15A85W B>1K BDW47P-DARL100V15A85W B>1K BDW51C SI-N100V15A125W>3MHz BDW83C N-DARL100V15A150WBDW83D N-DARL+D120V15A150WBDW84C P-DARL100V15A150WBDW84D P-DARL+D120V15A150W>1 BDW93CF N-DARL100V12A40W ISOLA BDW94C P-DARL100V12A80WBDX11SI-N160V10A117W>0.8MHz BDX16A SI-P140V3A25W800KHz BDX20SI-P160V10A117W>4MHz BDX32SI-N1700V4A40WBDX33C N-DARL100V10A70WBDX34C P-DARL100V10A70WBDX37SI-N80V5A15W350ns BDX44N-DARL+D90V1A5W 1.5us BDX47P-DARL90V1A5WBDX50SI-N160V16A150W>800KH BDX53C N-DARL100V6A60W B=500 BDX53F N-DARL160V6A60W B=500 BDX54C P-DARL100V6A60W B=500 BDX54F P-DARL160V6A60W B=500 BDX62C P-DARL120V8A90WBDX63C N-DARL140V8A90WBDX64C P-DARL120V12A117W B>1K BDX65C N-DARL120V12A117WBDX66C P-DARL120V16A150WBDX66C P-DARL120V16A150WBDX67C N-DARL120V16A150WBDX71SI-N70V10A75W>0.8MHz BDX75SI-N45V16A75W>0.8MHz BDX77SI-N100V8A60W>7MHz BDX87C N-DARL100V12A120WBDX88C P-DARL100V12A120WBDX94SI-P80V8A90W>4MHz BDX95SI-N100V8A90W>4MHz BDX96SI-P100V8A90W>4MHz BDY20SI-N100V15A117W1MHz BDY29SI-N100V30A220W POWER BDY56SI-N180V15A115W>10MHz BDY58SI-N160V25A175WBDY73SI-N100V15A115W>8KHz BDY83B SI-P50V4A36W3MHz BDY90SI-N120V10A60W0.35us BF115SI-N50V30mA0.15WBF120SI-N220V50mA0.3WBF125SI-N AM/FM V/M/O/ZF450MHzBF152SI-N,VHF-30V0.2W800MHz BF155SI-N40V20mA600MHz BF161SI-N50V20mA550MHz BF163SI-N40V20mW600MHzBF164SI-N40V0.2W600MHzBF166SI-N40V20MA0.175W500MHzBF173SI-N40V25mA0.23W600MHzBF180SI-N30V20mA.15W675MHzBF182SI-N25V20mA650MHzBF184SI-N20V30mA260MHzBF186SI-N190V0.06A0.8W120MHzBF189SI-N30V25mA270MHzBF195SI-N30V30mA.22W200MHzBF199SI-N40V25mA0.3W550MHzBF200SI-N30V20mA0.15W500MHzBF224SI-N45V50mA0.25W450MHzBF240SI-N40V25mA0.25W400MHzBF244A N-FET30V25mA0.3WBF244C N-FET30V25mA0.3WBF245A N-FET30V25mA0.3WBF245B N-FET30V25mA0.3WBF245C N-FET30V0.1A0.3W170MCBF246C N-FET25V25mA0.25WBF247B N-FET25V25mA0.25WBF247C N-FET25V25mA0.25WBF253SI-N30V30mA150MHzBF254SI-N30V30mA.22W260MHzBF255SI-N20V30mA.22W200MHzBF256A N-FET30V7mA Vgs<7.5BF256B N-FET30V13mABF256C N-FET30V10mA0.25WBF259SI-N300V0.1A0.8W90MHzBF259S SI-N300V0.1A0.8W90MHzBF271SI-N40V30mA240mW1GHzBF299SI-N300V0.1A0.625WBF316SI-P UHF-M/O550..660MHz BF324SI-P30V25mA.25W450MHzBF339SI-P VHF-V/M/O500MHzBF343SI-P35V35mA.25W>80MHzBF357SI-N30V0.05A 1.6GHzBF362SI-N UHF-V800MHzBF370SI-N40V0.1A0.5W>500MHzBF377SI-N15V25mA 1.3GHzBF393SI-N300V0.5A0.65WBF410B N-FET20V0.7mABF410C N-FET20V12mA AMPLIFBF411SI-N110V0.05A0.3WBF417SI-N300V0.2A6W50MHzBF418SI-P300V0.2A6W50MHzBF419SI-N300V0.1A6WBF420SI-N300V0.1A0.83WBF421SI-P300V0.1A0.83WBF424SI-P30V25mA300MHz BF435SI-P160V0.2A0.625W80MHz BF440SI-P40V25mA250MHz BF441B SI-P40V25mA250MHz BF450SI-P40V25mA.25W375MHz BF455AM/FM-V/M/O400MHz BF459SI-N300V0.1A10W90MHz BF462SI-N350V0.5A10W45MHz BF471SI-N300V0.1A2W60MHz BF472SI-P300V30mA2W60MHz BF479SI-P30V50mA.16W 1.4GHz BF487SI-N400V0.05A0.83WBF493SI-P300V0.5A0.625WBF494SI-N20V30mA260MHz BF495C SI-N30V30mA0.3W200MHz BF496SI-N30V20mA0.3W550MHz BF506SI-P40V30mA0.3W550MHz BF507SI-N30V20mA0.5W>750MHz BF509SI-P40V30mA0.3W750MHz BF516SI-P35V20mA850MHz BF569SI-P40V30mA280mW850MHz BF585SI-N350V0.05A5W70MHz BF587SI-N400V0.05A5W>70MHz BF622SI-N250V0.1A2WBF679SI-P40V30mA.16W880MHz BF680SI-P40V30mA.16W750MHz BF689SI-N15V25mA0.2W1GHz BF689K SI-N25V25mA0.36W0.2GHz BF758SI-N300V0.5A2WBF759SI-N350V0.5A10W VID-PO BF763SI-N15V25mA0.36W 1.8GHz BF770A SI-N15V0.05A 5.5GHZBF791SI-P300V0.1A5WBF799SI-N30V35mA280mW800MHz BF819SI-N250V0.1A 1.2WBF820SI-N300V25mA>60MHz BF821SI-P300V25mA0.31WBF840SI-N40V25mA0.28W380MHz BF844SI-N450V0.3A625mW>50MHz BF859SI-N300V0.1A 2.5WBF871SI-N300V0.1A 1.8WBF872SI-P300V0.1A 1.6W60MHz BF881SI-N400V0.03A>60MHz BF883S SI-N275V0.05A7W>60MHz BF891SI-P400V30mA<60MHz BF910N-FET-DG20V50mA0.33WBF926SI-P20V25mA350MHz,17dBBF939SI-P30V220mA0.25750MHzBF959SI-N20V0.1A 1.1GHzBF960N-FET-DG20V25mA.8GHz,1BF961N-FET-DG20V30mA.2GHz,2BF964N-FET-DG20V30mA.2GHz,2BF966N-FET-DG20V30mA.8GHz,1BF966S N-FET-DG20V30mA.2W.8GHzBF967SI-P30V20mA.16W900MHzBF968SI-P UHF TRANS.1100MHzBF970SI-P35V30mA0.3W1GHzBF979SI-P20V50mA0.3W 1.75GHzBF980A N-FET-DG18V30mA UHFBF981N-FET-DG20V20mA VHFBF982N-FET-DG20V40mA200MHzBF989N-FET20V30mA0.2WBF990A N-FET-DG18V30mA0.2WBF991N-FET-DG20V20mA UHFBF992N-FET20V40mA0.2WBF994S N-FET-DG20V30mA200MHzBF996S N-FET-DG20V30mA800MHzBF998N-FET-DG12V30mA800MHzBF999N-FET20V30MA0.2W300MHzBFG135SI-N25V0.15A1W BIPOLARBFG198SI-N20V0.1A1W8GHZBFG65SI-N10V50mA0.3W8GHzBFG94SI-N15V60mA0.7W BIPOLABFG96SI-N20V75mA0.7W800MHzBFG97SI-N20V0.1A0.5W BIPOLABFQ10N-FET30V30mA250mWBFQ162SI-N20V0.5A3W1GHzBFQ232SI-N100V0.3A1GHzBFQ232A SI-N115V0.3A800MHzBFQ235A SI-N115V0.3A3W800MHzBFQ252SI-P100V0.3A3WBFQ252A SI-P115V0.3A800MHzBFQ255SI-P100V0.3A3W1GHzBFQ255A SI-P115V0.3A3W800MHzBFQ262SI-P100V0.4A5W1GHzBFQ262A SI-P115V0.4A5W800MHzBFQ33C SI-N7V20mA0.14W12.5GHzBFQ34SI-N18V0.15A 2.7W4GHzBFQ43SI-N18V 1.2A4W175MHz1 BFQ65SI-N10V50mA0.3W8GHz8 BFQ68SI-N18V0.3A 4.5W4GHzBFR29N-FET30V10mA Up<4VBFR35AP SI-N12V30mA 4.9GHz,14dBBFR36SI-N40V200mA0.8W 1.3GHzBFR37SI-N30V50mA0.25W 1.4GHzBFR38SI-P40V20mA0.2W1GHzBFR39SI-N90V1A0.8W>100MHz BFR40SI-N70V1A0.8W>100MHz BFR79SI-P90V1A0.8W>100MHz BFR84N-FET-DG20V50MA0.3WBFR90SI-N15V30mA19.5dB5GHzBFR90A SI-N15V30mA16dB 5.5GHzBFR91SI-N12V50mA18dB5GHzBFR91A SI-N12V50mA14dB6GHzBFR92SI-N15V30mA19.5dB5GHzBFR92A SI-N15V30mA16dB 5.5GHzBFR92R SI-N15V30mA REVERS5GHzBFR93A SI-N15V50mA14dB6GHzBFR95SI-N25V0.15A 1.5W 3.5GHzBFR96SI-N15V75mA16dB5GHzBFR96S SI-N15V0.1A11dB 5.5GHzBFS17SI-N15V25mA1GHz,E1 BFS19SI-N30V30mA260MHzBFS20SI-N30V25mA450MHz.G1 BFS22A SI-N3V0.75A4W175MHzBFS23A SI-N36V0.5A 4.5W500MHzBFT25SI-N8V 6.5mA50mW500NHzBFT43SI-N125/100V1A0.8WBFT45SI-P250V0.5A0.75W70MHzBFT66SI-N15V30mA 4.5GHz,12dB BFT79SI-P90V1A0.8W>100MHz BFT95SI-P,UHF15V25mA 3.6-5GHz BFW10N-FET30V20mA AMPL.BFW11N-FET30V10mA AMPL.BFW12N-FET30V5mA AMPL.BFW16A SI-N25V0.3A 1.5W 1.2GHz BFW17A SI-N25V0.3A 1.5W 1.1GHz BFW30SI-N10V0.1A0.25W 1.6GHz BFW43SI-P150V0.1A0.4W150MHz BFW44SI-P150V0.1A0.7W50MHzBFW92SI-N15V50mA0.3W 1.6GHz BFW92A SI-N15V25mA 3.2GHz,13dB BFX34SI-N60V5A0.87WBFX37SI-P90V0.1A0.36W70MHzBFX38SI-P55V1A0.8W B>85BFX40SI-P75V1A0.8W B>85BFX48SI-P30V0.1A0.36WBFX55SI-N60V0.4A 2.2W700MHzBFX85SI-N100V1A0.8WBFX89SI-N15V50mA0.2W 1.3GHzBFY39SI-N45V0.1A0.3W150MHz BFY50SI-N80V1A0.7W55/175ns BFY51SI-N60V1A0.7WBFY52SI-N40V1A0.8W100MHz BFY56SI-N60V1A0.8WBFY64SI-P40V0.6A0.7WBFY88SI-N25V25mA850MHz BFY90SI-N15V25mA2GHz,8dB BGX885N CATV AMPL.17dB860MHz BGY88CATV AMP.35dB450MHz BGY89CATV AMP.38dB450MHz BLW32SI-N50V0.65A10W 3.5GHz BLW60C SI-N18V9A100W650MHz BLX15SI-N110V 6.5A195W275MHz BLY87C SI-N36V 1.53A20W175MHz BLY88C SI-N18V3A36W850MHz BLY89C SI-N18V6A73W800MHz BLY93C SI-N65V2A25W175MHz BLY94SI-N65V6A50W175MHz BS107N-FET200V0.13A0.8W26RBS108N-FET200V0.23A0.8W8EBS170N-FET60V0.3A0.8W5RBS208P-FET200V0.2A0.8WBS250P-FET45V0.18A0.83WBSN254A N-FET250V0.3A1W<7EBSN274N-FET270V0.25A1W<8EBSN304N-FET300V0.25A1W<8EBSR14SI-N75V0.8A<35285ns BSR31SI-P70V1A B>100BSR50N-DARL60V2A0.8W350MHz BSR60P-DARL45V1A0.8WBSS123N-FET100V0.17A1329ns BSS38SI-N120V0.1A0.2WBSS44SI-P65V5A5WBSS52N-DARL100V1A0.8WBSS68SI-P60/40V0.8A<50110ns BSS89N-FET240V0.3A1W6RBSS91N-FET200V0.35A 1.5W<6EBSS92P-FET200V0.15A1W38/45 BSV52SI-N20V0.1A225mW400MHz BSV80N-FET40V10mA0.35WBSV81N-FET30V50mA0.2W100E BSW43SI-N60V0.2A0.3W B>180 BSW68A SI-N150V2A5W130MHz BSW85SI-N75V0.5A0.5W250MHz BSX20SI-N40V0.5A.36W7/18ns BSX26SI-N40V0.5A0.36WBSX29SI-P12V0.2A0.36W25/35BSX32SI-N65V1A0.8W35/40ns BSX47SI-N120V1A5WBSX52SI-N25V0.2A0.3W B>180BSX59SI-N45V1A0.8WBSX88SI-N40V0.5A0.36WBSY56SI-N120V0.5A0.8W100MHz BTS121A N-FET100V22A95W0.1EBU106SI-N325V10A50WBU107SI-N300V10A50WBU109SI-N330V10A85WBU110SI-N150V10A30W15MHzBU124A SI-N400V10A50W6MHzBU125SI-N130/60V5A0.8W100MHzBU128SI-N300/200V10A62WBU133SI-N750/250V3A30W TO3BU1506DX SI-N+D1500V5A32W0.5USBU1508AX SI-N1500V8A35W0.6USBU1508DX SI-N+D1500V8A35W0.6USBU180A SI-N+D400V10ABU180E N-DARL1500V5A12WBU189N-DARL330V8A60WBU208A SI-N1500V8A150W THIN B BU208B SI-N700V5A80W7MHzBU208D SI-N+D1500V8A150WBU209SI-N1700V4A12.5W TO3BU226SI-N2000V 1.5A10W TO3BU2506DF SI-N+D1500V5A45W0.4usBU2506DX SI-N+D1500V5A45W0.4USBU2508A SI-N1500V8A125W0.4usBU2508AF SI-N1500V8A45W0.4usBU2508AX SI-N1500V8A45W0.4USBU2508D SI-N+D1500V8A125W0.4usBU2508DF SI-N+D1500V8A45W0.4usBU2508DX SI-N+D1500V8A45W0.4usBU2520AF SI-N1500V10A45W0.2usBU2520AX SI-N1500V10A45W0.2usBU2520DF SI-N+D1500V10A45W0.35 BU2520DX SI-N+D1500V10A45W0.35 BU2525A SI-N1500V12A0.2usBU2525AF SI-N1500V12A45W0.2usBU2525AX SI-N1500V12A45W0.2USBU2525D SI-N+D1500V12A0.2usBU2527AF SI-N1500V12A45W0.2usBU2527AX SI-N1500V12A45W0.2USBU2722AF SI-N1700V10A45WBU312SI-N280/150V6A25WBU325SI-N200/200V3A25WBU326A SI-N900V6A75WBU326S-RFT S I-N800/400V6A60W TO3 BU406SI-N400V7A65W0.75us BU406D SI-N+D400V7A65W0.75us BU407SI-N330V7A65W0.75us BU407D SI-N+D330V7A65W0.75us BU409D SI-N+D250V7A60WBU412SI-N+D280V8ABU413SI-N330V10A60W TO3 BU414B SI-N+D900V8A60WBU415A SI-N800V12A120W TO3 BU415B SI-N+D800V12A120WBU426A SI-N900V6A114WBU426E SI-N800V6A70W TO220 BU426V SI-N800/375V6A70WBU433SI-N375V6A70WBU500SI-N1500V6A75WBU500D SI-N+D1500/700V6A75WBU505SI-N1500V 2.5A75W0.9us BU505D SI-N+D1500V 2.5A75WBU505DF SI-N+D1500V 2.5A20WBU506SI-N700V5A100W POWER BU506D SI-N+D700V5A100W POWER BU506DF SI-N+D1500V5A20W POWER BU508A SI-N1500V8A125W0.7us BU508A SI-N1500V8A125W0.7us BU508A SI-N1500V8A125W0.7us BU508AF SI-N1500V8A34W0.7us BU508AF SI-N1500V8A34W0.7us BU508AF SI-N1500V8A34W0.7us BU508D SI-N+D1500V8A125W0.7us BU508D SI-N+D1500V8A125W0.7us BU508DF SI-N+D1500V8A34W0.7us BU508DF SI-N+D1500V8A34W0.7us BU508DR SI-N+D1500V8A125WBU522N-DARL400/375V7A75WBU526SI-N800V8A86WBU536SI-N1100V8A62WBU546SI-N1350V6A100W TO3 BU603SI-N1350V5A100W0.7us BU606D SI-N+D400V7A90WBU608SI-N400V6A90W TO3 BU608D SI-N+D400V7A90WBU626A SI-N1000V10A100WBU705SI-N1500V 2.5A75W0.7us BU706DF SI-N+D1500V5A32W0.7usBU706F SI-N1500V5A32W0.7usBU801SI-N+D600V3A40WBU806N-DARL+D400V8A60W0.35 BU806FI SI-N+D400V8ABU808DF N-DARL+D1500/700V5A50WBU810N-DARL+D600V7A75WBU824N-DARL+D650V0.5ABU826N-DARL+D800V6A125W0.2 BU826A N-DARL+D900V6A125W0.2 BU920P N-DARL350V10A120WBU921P SI-N400/450V10A120WBU931SI-N500V15A175WBU931T SI-N450V10A125WBU932N-DARL500V15A175WBU932P N-DARL500V15A125WBU941P N-DARL500V15A150WBU941ZP N-DARL350V15A150WBUF405A SI-N1000/450V7.5A80WBUF405AF SI-N1000V7.5A ISOLATEDBUF410SI-N850V15A125WBUH1015SI-N1500V14A160W0.11us BUH1015HISI-N1500V14A70W0.11us BUH1215SI-N1500V19A200W0.11us BUH315SI-N1500V5A50WBUH315D SI-N+D1500/700V5A50WBUH515SI-N1500V8A60W 3.9us BUH515D SI-N+D1500/700V8A60WBUH517SI-N1700V8A60W 3.9us BUH517D SI-N+D1700/700V8A60WBUH715SI-N1500V10A60WBUK436/800B N-FET800V4A125W<4EBUK437/400B N-FET400V14A180WBUK437/600B N-FET600V9A180W<1E2 BUK438/800B N-FET800V7.6A220W2EBUK443/60B N-FET60V13A25W<E1BUK444/800B N-FET800V 1.2A30W8EBUK445/600B N-FET600V 2.2A30W2R5BUK446/800B N-FET800V2A30WBUK454/800A N-FET800V2A75WBUK455/600B N-FET600V4A100W2R5BUK456/200B N-FET200V19A150W<E2BUK456/60A N-FET60V52A150W0.028E BUK456/800A N-FET800V4A125W3EBUK555/60B N-FET60V35A125W0.055E BUL310SI-N1000V5A75W0.4us BUL310PI SI-N1000V5A35W0.4us BUL45SI-N400V5A75W12MHzBUL54A SI-N1000V4A65W20MHz BUL810SI-N1000V15A125WBUR51SI-N300/200V60A350WBUR52SI-N350/250V60A350WBUS14A SI-N1000/450V30A250WBUS23SI-N300V15A175WBUS48A SI-N1000V15A175WBUS48AP SI-N1000V15A125WBUS98A SI-N450V30A250WBUT11A SI-N1000V5A100W0.8us BUT11A SI-N1000V5A100W0.8us BUT11AF SI-N1500V5A20W0.8us BUT12A SI-N1000V8A125W0.8us BUT12AF SI-N1000V8A23W0.8us BUT13N-DARL+D400V28A175WBUT18A SI-N1000/450V6A110W0 BUT18AF SI-N1000V6A33W0.8us BUT30V SI-N200/125V100A250WBUT34N-DARL+D850V50A250WBUT56A SI-N1000V8A100WBUT57N-DARL+D400V15A110W B>BUT70SI-N200V40A200WBUT72SI-N400V40A200WBUT76A SI-N1000V10A100W0.8us BUT90SI-N200V50A250WBUT92SI-N350/250V50A250WBUT93SI-N600V4A55W9MHz BUV18SI-N120V47A250W 1.5us BUV20SI-N160V50A250W 1.5us BUV21SI-N250/200V40A250WBUV23SI-N325V40A250WBUV24SI-N400V30A250WBUV25SI-N500V20A250WBUV26SI-N180V14A85W 1.8us BUV26A SI-N200V20A85WBUV27SI-N240V12A65W40ns BUV28SI-N400V10A65W40ns BUV28A SI-N450V10A65W40NS BUV46A SI-N1000/450V6A85WBUV48A SI-N1000V15A150W0.8us BUV48AF SI-N1000V15A65WBUV48C SI-N1200/700V15A150WBUV48CF SI-N1200V15A65WBUV50SI-N250V25A150WBUV56A SI-N1000V10A70WBUV61SI-N300V50A250WBUV70SI-N1300/550V10A140WBUV90N-DARL+D650V10A125WBUV93SI-N600/350V2A15W12MHz BUV98A SI-N1000V30A150W5MHz BUW11A SI-N1000V5A100W0.8us BUW11AF SI-N1000V5A32W0.8us BUW12SI-N850V8A125W0.8us BUW12A SI-N1000V8A125W0.8us BUW12F SI-N850V8A34W0.8us BUW13SI-N850V15A175W0.8us BUW13A SI-N1000V15A175W0.8us BUW23SI-P450V10A125W<300NS BUW26SI-N800V10A125W20MHz BUW42SI-P400V15A150WBUW48SI-N120V30A150W 1.5us BUW49SI-N160V30A150WBUW50SI-N250V25A150W TO-218 BUW72SI-N450V10A100WBUW81A N-DARL800V10A80WBUW84SI-N800V2A50W0.4us BUW85SI-N1000V2A50W0.4us BUX10SI-N160V25A150W 1.5us BUX12SI-N300V20A150WBUX13SI-N400V15A150W>8MHz BUX20SI-N160V50A350W 1.5us BUX22SI-N300V40A250W POWSWI BUX23SI-N400/325V30A350WBUX24SI-N450/400V20A350W>8BUX32B SI-N1000V8A150WBUX37N-DARL400V15A35WBUX39SI-N120/90V30A120W8MHz BUX40SI-N160V20A120W 1.2us BUX41SI-N250V15A120WBUX41N SI-N220/160V18A120WBUX42SI-N300V12A120WBUX48A SI-N1000V15A175W0.8us BUX51SI-N300/200V 3.5A10W>8BUX54SI-N450V2A10W>8MHz BUX55SI-N450V2A10W8MHz BUX66SI-P200/150V2A35W>20MHz BUX77SI-N100V5A40W>2.5MHz BUX80SI-N800V10A100WBUX81SI-N1000V10A100WBUX82SI-N800V6A60WBUX84SI-N800V2A40W0.4us BUX85SI-N1000V2A40W0.4us BUX85F SI-N1000V2A18W0.4us BUX86P SI-N800V0.5A20W0.4usBUX87SI-N1000V0.5A20W0.4us BUX87P SI-N1000V0.5A20W0.4us BUX88SI-N1500V12A160W7MHz BUX98A SI-N450V30A250WBUX98C SI-N1200V30A250W5MHz BUY18S SI-N80/40V10A20WBUY47SI-N150/120V7A10W90MHz BUY49P SI-N250V3A10WBUY49S SI-N250V3A10W50MHz BUY69A SI-N1000V10A100W1usBUY70A SI-N1000/400V10A75WBUY71SI-N2200V2A40W HORDEFL BUY72SI-N280/200V10A60WBUY89SI-N1500V6A80WBUZ10N-FET50V20A80W0.08R BUZ100N-FET50V60A250W0.18E BUZ11N-FET50V36ABUZ11A N-FET50V27A90W0.055R BUZ14N-FET50V39A125WBUZ15N-FET50V45A125WBUZ171P-FET50V8A40W0.3RBUZ21N-FET100V21ABUZ215N-FET500V5A75W<1E5BUZ22N-FET100V34A125W0.055 BUZ30A N-FET200V7A75WBUZ310N-FET1000V 2.5A75W<5EBUZ325N-FET400V12.5A125W<E3BUZ326N-FET400V10.5A125WBUZ330N-FET500V9.5A125W0.00E+00 BUZ332N-FET600V8.5A150W0.8RBUZ332A N-FET600V8A150W0.9EBUZ338N-FET500V13.5A180W<E4BUZ341N-FET200V33A170W0.07E BUZ345N-FET100V41A150W<E045 BUZ349N-FET100V32A125WBUZ380N-FET1000V 5.5A125W140 BUZ384N-FET500V10.5A125WBUZ50A N-FET1000V 2.5A75W5EBUZ71N-FET50V18A80W0.1RBUZ71AF N-FET50V11A35W0.12R BUZ72A N-FET100V11ABUZ72AF N-FET100V10A40W ISOLAT BUZ73N-FET200V7A40W0.4RBUZ73A N-FET200V 5.8A40W0.6RBUZ90N-FET600V 4.5A70W<1E6BUZ900N-FET160V8A125WBUZ901N-FET200V8A125WBUZ905P-FET160V8A125WBUZ906P-FET200V8A125WBUZ90A N-FET600V4A75W2R BUZ90AF N-FET600V 4.3A75WBUZ91A N-FET600V8A150W0.9R BUZ93N-FET600V 3.6A80W<2E5。

XC6113B343资料

1/26XC6101_07_XC6111_17 ETR0207_009Preliminary◆CMOS Voltage Detector◆Manual Reset Input ◆Watchdog Functions ◆Built-in Delay Circuit ◆Detect Voltage Range: 1.6~5.0V, ± 2% ◆Reset Function is Selectable V DFL (Low When Detected) V DFH (High When Detected)■GENERAL DESCRIPTION The XC6101~XC6107, XC6111~XC6117 series aregroups of high-precision, low current consumption voltage detectors with manual reset input function and watchdog functions incorporating CMOS process technology. The series consist of a reference voltage source, delay circuit, comparator, and output driver.With the built-in delay circuit, the XC6101 ~ XC6107, XC6111 ~ XC6117 series’ ICs do not require any external components to output signals with release delay time. Moreover, with the manual reset function, reset can be asserted at any time. The ICs produce two types of output; V DFL (low when detected) and V DFH (high when detected).With the XC6101 ~ XC6105, XC6111 ~ XC6115 series’ ICs, the WD pin can be left open if the watchdog function is not used. Whenever the watchdog pin is opened, the internal counter clears before the watchdog timeout occurs. Since the manual reset pin is internally pulled up to the V IN pin voltage level, the ICs can be used with the manual reset pin left unconnected if the pin is unused.The detect voltages are internally fixed 1.6V ~ 5.0V in increments of 100mV, using laser trimming technology. Six watchdog timeout period settings are available in a range from 6.25msec to 1.6sec. Seven release delay time 1 are available in a range from 3.13msec to 1.6sec.■APPLICATIONS●Microprocessor reset circuits●Memory battery backup circuits ●System power-on reset circuits ●Power failure detection■TYPICAL APPLICATION CIRCUIT* Not necessary with CMOS output products.■FEATURESDetect Voltage Range: 1.6V ~ 5.0V, +2% (100mV increments)Hysteresis Range : V DF x 5%, TYP .(XC6101~XC6107)V DF x 0.1%, TYP .(XC6111~XC6117)Operating Voltage Range : 1.0V ~ 6.0V Detect Voltage Temperature Characteristics : +100ppm/O C (TYP .) Output Configuration : N-channel open drain,CMOSWatchdog Pin : Watchdog inputIf watchdog input maintains ‘H’ or ‘L’ within the watchdog timeout period, a reset signal is output to the RESET output pinManual Reset Pin : When driven ‘H’ to ‘L’levelsignal, the MRB pin voltage asserts forced reset on theoutput pin.Release Delay Time : 1.6sec, 400msec, 200msec,100msec, 50msec, 25msec, 3.13msec (TYP .) can be selectable.Watchdog Timeout Period : 1.6sec, 400msec, 200msec,100msec, 50msec,6.25msec (TYP .) can be selectable.■TYPICAL PERFORMANCE CHARACTERISTICS ●Supply Current vs. Input Voltage* ‘x’ represents both ‘0’ and ‘1’. (ex. XC61x1⇒XC6101 and XC6111)2/26XC6101~XC6107, XC6111~XC6117 SeriesPIN NUMBERXC6101, XC6102 XC6103 XC6104, XC6105XC6106, XC6107XC6111, XC6112 XC6113 XC6114, XC6115XC6116, XC6117SOT-25 USP-6C SOT-25 USP-6C SOT-25 USP-6C SOT-25USP-6CPIN NAMEFUNCTION1 4 - - 1 4 1 4 R ESETB Reset Output(V DFL : Low Level When Detected)2 5 2 5 2 5 2 5 V SSGround3 2 3 2 - -4 1 M RB ManualReset 4 1 4 1 4 1 - - WDWatchdog5 6 5 6 5 6 5 6 V IN Power Input - - 1 4 3 2 3 2 RESETReset Output (V DFH: High Level When Detected)■PIN CONFIGURATION SOT-25 (TOP VIEW)MRBV IN WD RESETBV SSMRBWD RESETV SSV IN RESETWD RESETBV SS V IN SOT-25 (TOP VIEW)RESETMRB RESETBV SS V IN SOT-25 (TOP VIEW) ■PIN ASSIGNMENT●SOT-25XC6101, XC6102 SeriesXC6111, XC6112 SeriesSOT-25 (TOP VIEW)XC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 Series●USP-6CXC6101, XC6102 Series XC6111, XC6112 SeriesXC6103 & XC6113 SeriesXC6104, XC6105 Series XC6114, XC6115 SeriesXC6106, XC6107 Series XC6116, XC6117 SeriesUSP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)USP-6C (BOTTOM VIEW)* The dissipation pad for the USP-6C package should be solder-plated in recommended mount pattern and metal masking so as to enhance mounting strength and heat release. If the pad needs to be connected to other pins, it should be connected to the V SS pin.3/26XC6101 ~ XC6107, XC6111~ XC6117SeriesRESET OUTPUTSERIES WATCHDOGMANUAL RESET V DFL (RESETB)V DFH (RESET)XC6101 XC6111 Available Available CMOS - XC6102XC6112AvailableAvailableN-channel open drain-XC6103 XC6113 Available Available - CMOS XC6104 XC6114 Available Not AvailableCMOS CMOS XC6105 XC6115 Available Not Available N-channel open drain CMOS XC6106 XC6116 Not Available AvailableCMOSCMOS XC6107XC6117Not AvailableAvailableN-channel open drainCMOSDESIGNATORDESCRIPTIONSYMBOLDESCRIPTION0 : V DF x 5% (TYP .) with hysteresis ① Hysteresis Range1 : V DF x 0.1% (TYP .) without hysteresis② Functions and Type of Reset Output1 ~ 7: Watchdog and manual functions, and reset output type as per Selection Guide in the above chartA : 3.13msec (TYP .)B : 25msec (TYP .) C: 50msec (TYP .) D : 100msec (TYP .) E : 200msec (TYP .) F : 400msec (TYP .) ③ Release Delay Time * H : 1.6sec (TYP .)0 : No WD timeout period forXC6106, XC6107, XC6116, XC6117 Series 1: 6.25msec (TYP .) 2 : 50msec (TYP .) 3 : 100msec (TYP .) 4 : 200msec (TYP .) 5 : 400msec (TYP .) ④ Watchdog Timeout Period6: 1.6sec (TYP .) ⑤⑥ Detect Voltage 16 ~ 50: Detect voltageex.) 4.5V: ⑤⇒4, ⑥⇒5M : SOT-25 ⑦ Package E : USP-6C R : Embossed tape, standard feed ⑧ Device OrientationL: Embossed tape, reverse feed* Please set the release delay time shorter than or equal to the watchdog timeout period. ex.) XC6101D427MR or XC6101D327MR■PRODUCT CLASSIFICATION ●Selection Guide ●Ordering Information XC61①②③④⑤⑥⑦⑧4/26XC6101~XC6107, XC6111~XC6117 Series■PACKAGING INFORMATION●SOT-25●USP-6C5/26XC6101 ~ XC6107, XC6111~ XC6117Series④ Represents production lot number0 to 9 and A to Z and inverted 0 to 9 and A to Z repeated. (G, I, J, O, Q, W expected.) * ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)■MARKING RULE●SOT-25①②③④SOT-25 (TOP VIEW)6/26XC6101~XC6107, XC6111~XC6117 Series① Represents product series② Represents release delay time MARK RELEASE DELAY TIME PRODUCT SERIES A 3.13msec XC61XxAxxxxx B 25msec XC61XxBxxxxx C 50msec XC61XxCxxxxx D 100msec XC61XxDxxxxx E 200msec XC61XxExxxxx F 400msec XC61XxFxxxxx H 1.6sec XC61XxHxxxxx③ Represents watchdog timeout period MARK WATCHDOG TIMEOUT PERIOD PRODUCT SERIES 0 XC61X6, XC61X7 series XC61Xxx0xxxx 1 6.25msec XC61Xxx1xxxx 2 50msec XC61Xxx2xxxx 3 100msec XC61Xxx3xxxx 4 200msec XC61Xxx4xxxx 5 400msec XC61Xxx5xxxx 6 1.6sec XC61Xxx6xxxx④⑤ Represents detect voltage MARK④ ⑤DETECT VOLTAGE (V)PRODUCT SERIES3 3 3.3 XC61Xxxx33xx 5 0 5.0XC61Xxxx50xx⑥ Represents production lot number0 to 9 and A to Z repeated. (G, I, J, O, Q, W excepted.)* No character inversion used. ** ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)MARK PRODUCT SERIES MARK PRODUCT SERIES 3 XC6101xxxxxx 8 XC6111xxxxxx 4 XC6102xxxxxx 9 XC6112xxxxxx 5 XC6103xxxxxx A XC6113xxxxxx 6 XC6104xxxxxx B XC6114xxxxxx 7 XC6105xxxxxx C XC6115xxxxxx 3 XC6106xxxxxx 8 XC6116xxxxxx 4 XC6107xxxxxx 9 XC6117xxxxxx■MARKING RULE (Continued)●USP-6CUSP-6C (TOP VIEW)7/26XC6101 ~ XC6107, XC6111~ XC6117Series■BLOCK DIAGRAMS●XC6101, XC6111 Series●XC6102, XC6112 Series●XC6103, XC6113 Series8/26XC6101~XC6107, XC6111~XC6117 Series■BLOCK DIAGRAMS (Continued)●XC6107, XC6117 Series●XC6106, XC6116 Series●XC6105, XC6115 Series●XC6104, XC6114 Series9/26XC6101 ~ XC6107, XC6111~ XC6117SeriesPARAMETERSYMBOL RATINGSUNITSV INV SS -0.3 ~ 7.0 VM RBV SS -0.3 ~ V IN +0.3 VInput Voltage WD V SS -0.3 ~ 7.0V Output Current I OUT 20 mACMOS Output RESETB/RESET V SS -0.3 ~ V IN +0.3Output Voltage N-ch Open Drain Output RESETB V SS -0.3 ~ 7.0VSOT-25 250Power Dissipation USP-6C Pd 100mWOperational Temperature Range Topr -40 ~ +85 OCStorage Temperature Range Tstg -40 ~ +125 OC■ABSOLUTE MAXIMUM RATINGSTa = 25O C10/26XC6101~XC6107, XC6111~XC6117 SeriesNOTE:*1: XC6101~XC6107 (with hysteresis) *2: XC6111~XC6117 (without hysteresis)*3: ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111) *4: V DF(T): Setting detect voltage*5: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).PARAMETERSYMBOLCONDITIONSMIN.TYP .MAX. UNITS CIRCUITDetect Voltage V DFL V DFHV DF(T)× 0.98V DF(T) V DF(T)× 1.02 V 1 Hysteresis Range XC6101~XC6107 (*1) V HYS V DF × 0.02V DF × 0.05 V DF× 0.08 V 1Hysteresis Range XC6111~XC6117 (*2) V HYS 0 V DF × 0.001 V DFx 0.01V 1V IN =V DF(T)×0.9V - 5 11 V IN =V DF(T)×1.1V- 10 16 XC61X1/XC61X2/XC61X3XC61X4/XC61X5 (*3)(The MRB & the WD Pin: No connection) V IN =6.0V - 1218 V IN =V DF(T)×0.9V - 4 10 V IN =V DF(T)×1.1V - 8 14 Supply Current I SS XC61X6/XC61X7 (*3)(The MRB Pin: No connection)V IN = 6.0V - 1016 µA 2Operating Voltage V IN 1.0 - 6.0 V 1VIN = 1.0V 0.15 0.5 -V IN =2.0V (V DFL(T)> 2.0V) 2.0 2.5 - V IN =3.0V (V DFL(T) >3.0V) 3.0 3.5 -N-ch.V DS = 0.5V V IN =4.0V (V DFL(T) >4.0V) 3.5 4.0 - 3 V DFL Output Current (RESETB) I RBOUTCMOS,P-chV DS = 0.5V V IN = 6.0V - - 1.1 -0.8 mA 4 N-chV DS = 0.5VV IN =6.0V 4.4 4.9 - 3V IN =1.0V - - 0.08 - 0.02 V IN =2.0V (V DFH(T)> 2.0V)- - 0.50 - 0.30 V IN =3.0V (V DFH(T)>3.0V)- - 0.75 - 0.55V DFHOutput Current (RESET) I ROUT P-ch. V DS = 0.5V V IN =4.0V (V DFH(T)>4.0V)- - 0.95 - 0.75 mA 4Temperature Characteristics △V DF / △Topr ・V DF -40OC < Topr < 85 O C - +100 - ppm / O C12 3.13 5 13 25 3825 50 75 60 100 140 120 200 280 240 400 560Release Delay Time(V DF <1.8V)T DR Time until V IN is increased from1.0V to2.0Vand attains to the release time level,and the Reset output pin inverts.960 1600 2240 ms 5 2 3.13 5 13 25 38 25 50 7560 100 140 120 200 280 240 400 560 Release Delay Time(V DF >1.9V)T DRTime until V IN is increased from1.0V to (V DF x1.1V) and attains to the releasetime level,and the Reset output pin inverts. 960 1600 2240ms 5 Detect Delay Time T DFTime until V IN is decreased from 6.0V to 1.0V and attains to the detect voltage level, and the Reset output pin detectswhile the WD pin left opened.- 3 30 µs 5V DFL /V DFH CMOS Output Leak CurrentI LEAK V IN =6.0V, RESETB=6.0V (V DFL ) V IN =6.0V, RESET=0V (V DFH )- 0.01 - µA 3V DFL N-ch Open DrainOutput Leak CurrentI LEAKV IN =6.0V, RESETB=6.0V-0.010.10µA 3■ELECTRICAL CHARACTERISTICS●XC6101~XC6107, XC6111~XC6117 SeriesTa = 25O CSeriesPARAMETERSYMBOL CONDITIONS MIN.TYP . MAX. UNITS CIRCUIT3.13 6.25 9.38 25 50 7560 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF <1.8V)T WDTime until V IN increases form1.0V to2.0V andthe Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 3.13 6.25 9.38 25 50 75 60 100 140 120 200 280240 400 560 Watchdog Timeout Period (V DF >1.9V)T WDTime until V IN increases form1.0V to (V DF x1.1V)and the Reset output pin is released to go into the detection state. (WD=V SS )960 1600 2240 ms 6 WatchdogMinimum Pulse Width T WDIN V IN =6.0V,Apply pulse from 6.0V to 0Vto the WD pin. 300 - - ns 7 Watchdog High Level VoltageV WDH V IN =V DF x 1.1V ~ 6.0V V IN x 0.7- 6 V 7 Watchdog Low Level Voltage V WDL V IN =V DF x 1.1V ~ 6.0V0 - V IN x 0.3 V 7 V IN =6.0V, V WD =6.0V (Avg. when peak )- 12 19Watchdog Input Current I WD V IN =6.0V, V WD =0V (Avg. when peak) - 19 -12 -µA 8 Watchdog Input ResistanceR WDV IN =6.0V, V WD =0V, R WD =V IN / |I WD |315500880k Ω8PARAMETERSYMBOL CONDITIONS MIN.TYP . MAX.UNITS CIRCUITMRBHigh Level VoltageV MRH V IN =V DF x1.1V ~ 6.0V 1.4 - V IN 9MRBLow Level VoltageV MRL V IN =V DF x1.1V ~ 6.0V-0.35 V9MRBPull-up Resistance R MR V IN =6.0V, MRB=0V, R MR =V IN / |I MRB | 1.6 2.4 3.0 M Ω 10 MRB Minimum Pulse Width (*3) XC6101~XC6105 XC6111~XC6115 T MRINV IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin 2.8 - -MRB Minimum Pulse Width (*4) XC6106, XC6107 XC6116, XC6117T MRIN V IN =6.0V,Apply pulse from 6.0V to 0V tothe MRB pin1.2 - -µs11●XC6101 ~ XC6103, XC6106 ~ XC6107, XC6111 ~ XC6113, XC6116 ~ XC6117 Series NOTE:*1: V DF(T): Setting detect voltage *2: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected). *3: Watchdog function is available. *4: Watchdog function is not available.Ta = 25O CTa = 25O C ■ELECTRICAL CHARACTERISTICS (Continued)●XC6101~XC6105, XC6111~XC6115 Series■OPERATIONAL EXPLANATIONThe XC6101~XC6107, XC6111~XC6117 series compare, using the error amplifier, the voltage of the internal voltage reference source with the voltage divided by R1, R2 and R3 connected to the V IN pin. The resulting output signal from the error amplifier activates the watchdog logic, manual reset logic, delay circuit and the output driver. When the V IN pin voltage gradually falls and finally reaches the detect voltage, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type ICs.<RESETB / RESET Pin Output Signal>* V DFL (RESETB) type - output signal: Low when detected.The RESETB pin output goes from high to low whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESETB pin remains low for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the RESETB pin output remains low for the release delay time (T DR), and thereafter the RESET pin outputs high level signal. * V DFH (RESET) type – output signal: High when detected.The RESET pin output goes from low to high whenever the V IN pin voltage falls below the detect voltage, or whenever the MRB pin is driven from high to low. The RESET pin remains high for the release delay time (T DR) after the V IN pin voltage reaches the release voltage. If neither rising nor falling signals are applied to the WD pin within the watchdog timeout period, the V OUT pin output remains high for the release delay time (T DR), and thereafter the RESET pin outputs low level signal.<Hysteresis>When the internal comparator output is high, the NMOS transistor connected in parallel to R3 is turned ON, activating the hysteresis circuit. The difference between the release and detect voltages represents the hysteresis range, as shown by the following calculations:V DF (detect voltage) = (R1+R2+R3) x Vref(R2+R3)V DR (release voltage) = (R1+R2) x Vref(R2)V HYS (hysteresis range)=V DR-V DF (V)V DR > V DF* Detect voltage (V DF) includes conditions of both V DFL (low when detected) and V DFH (high when detected).* Please refer to the block diagrams for R1, R2, R3 and Vref.Hysteresis range is selectable from V DF x 0.05V (XC6101~XC6107) or V DF x 0.001V (XC6111~XC6117).<Watchdog (WD) Pin>The XC6101~XC6107, XC6111~XC6117 series use a watchdog timer to detect malfunction or “runaway” of the microprocessor. If neither rising nor falling signals are applied from the microprocessor within the watchdog timeout period, the RESETB/RESET pin output maintains the detection state for the release delay time (T DR), and thereafter the RESET/RESETB pin output returns to the release state (Please refer to the FUNCTION CHART). The timer in the watchdog is then restarted. Six watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 6.25msec.<MRB Pin>Using the MRB pin input, the RESET/RESETB pin signal can be forced to the detection state. When the MRB pin is driven from high to low, the RESETB pin output goes from high to low in the case of the V DFL type ICs, and the RESET pin output goes from low to high in the case of the V DFH type. Even after the MRB pin is driven back high, the RESET/RESETB pin output maintains the detection state for the release delay time (T DR). Since the MRB pin is internally pulled up to the V IN pin voltage level, leave the MRB pin open if unused (Please refer to the FUNCTION CHART). A diode, which is an input protection element, is connected between the MRB pin and V IN pin. Therefore, if the MRB pin is applied voltage that exceeds V IN, the current will flow to V IN through the diode. Please use this IC within the stated maximum ratings (V SS -0.3 ~ V IN+0.3) on the MRB pin.<Release Delay Time>Release delay time (T DR) is the time that elapses from when the V IN pin reaches the release voltage, or when the watchdog timeout period expires with no rising signal applied to the WD pin, until the RESET/RESETB pin output is released from the detection state. Seven release delay time (T DR) watchdog timeout period settings are available in 1.6sec, 400msec, 200msec, 100msec, 50msec, 25msec, 3.13msec.<Detect Delay Time>Detect Delay Time (T DF) is the time that elapses from when the V IN pin voltage falls to the detect voltage until the RESET/ RESETB pin output goes into the detection state.Series■TIMING CHARTS●CMOS Output●T DF (CMOS Output)VINVDFL LevelGNDVIN Level VDFL Level GNDVIN x 0.1V■NOTES ON USE1. Please use this IC within the stated maximum ratings. Operation beyond these limits may cause degrading or permanent damage to the device.2. When a resistor is connected between the V IN pin and the input, the V IN voltage drops while the IC is operating and a malfunction may occur as a result of the IC’s through current. For the CMOS output products, the V IN voltage drops while the IC is operating and malfunction may occur as a result of the IC’s output current. Please be careful with using the XC6111~XC6117 series (without hysteresis).3. In order to stabilize the IC’s operations, please ensure that the V IN pin’s input frequency’s rise and fall times are more than 1 µ sec/V.4. Noise at the power supply may cause a malfunction of the watchdog operation or the circuit. In such case, please strength the line between V IN and the GND pin and connect about 0.22µF of a capacitor between the V IN pin and the GND pin.5. Protecting against a malfunction while the watchdog time out period, an ignoring time (no reaction time) occurs to the rise and fall times. Referring to the figure below, the ignoring time (no reaction time) lasts for 900µsec at maximum.GNDGNDGNDVIN Pin Wave FormWD Pin Wave FormRESETB Pin Wave Form (VDFL)SeriesPIN NAMELOGIC CONDITIONSH V IN >V DF +V HYS V IN L V IN <V DF H MRB>1.40V MRBL MRB<0.35V H When keeping W D >V WDH more than T WD L When keeping W D <V WDL more than T WD L → H V WDL → V WDH , T WDIN >300nsec WDH → L V WDH →V WDH , T WDIN >300nsecV IN MRB WD RESETB (*2) H HH LRepeat detect and release (H →L →H)H OpenH L → HH H or Open H → L H HLL *1 LV IN MRB WD RESETB (*3) H HH LRepeat detect and release (L →H →L)H OpenH L → HH H or Open H → L L HLL *1 HV IN WD RESETB (*2) RESET (*3) H HH L Repeat detect and release (H →L →H)Repeat detect and release (L →H →L)H OpenH L → HH H → L H L HL*1 L HV IN MRB RESETB (*2)RESET (*3)H H or Open H LH LL L H■PIN LOGIC CONDITIONSNOTE:*1: If only “V DF ” is indicated, it represents both V DFL (low when detected) and V DFH (high when detected).*2: For the details of each parameter, please see the electrical characteristics. V DF : Detect VoltageV HYS : Hysteresis RangeV WDH : WD High Level Voltage V WDL: WD Low Level Voltage T WDIN : WD Pulse Width T WD : WD Timeout Period■FUNCTION CHART●XC6103/XC61113 Series●XC6104/XC61114, XC6105/XC6115 Series●XC6106/XC61116, XC6107/XC6117 Series●XC6101/XC61111, XC6102/6112 Series*1: Including all logic of WD (WD=H, L, L →H, H →L, OPEN). *2: When the RESETB is High, the circuit is in the release state. When the RESETB is Low, the circuit is in the detection state. *3: When the RESET is High, the circuit is in the release state. When the RESET is Low, the circuit is in the detection state.■TEST CIRCUITSCircuit 1Circuit 2Circuit 3Circuit 4Series ■TEST CIRCUITS (Continued)Circuit 5Circuit 6Circuit 7■TEST CIRCUITS (Continued)Circuit 8Circuit 9Circuit 10Circuit 11Series■TYPICAL PERFORMANCE CHARACTERISTICS(1.1) Supply Current vs. Input Voltage(1.2) Supply Current vs. Input Voltage■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(2) Detect, Release Voltage vs. Ambient Temperature(1.2) Supply Current vs. Input Voltage (Continued)Series■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (3-1) Output Voltage vs. Input Voltage (V DFL ) (3.1) Detect, Release Voltage vs. Input Voltage (V DFL )(3.2) Detect, Release Voltage vs. Input Voltage (V DFH )■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(4) N-ch Driver Output Current vs. V DSSeries(6) P-ch Driver Output Current vs. Input Voltage 1■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(8) Release Delay Time vs. Ambient Temperature(7) P-ch Driver Output Current vs. Input Voltage 2■TYPICAL PERFORMANCE CHARACTERISTICS (Continued) (10) Release Delay Time vs. Input Voltage(11) Watchdog Timeout Period vs. Input VoltageSeries■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)(14) MRB Low Level Voltage vs. Ambient Temperature(15) MRB High Level Voltage vs. Ambient Temperature* ‘X’ represents both ‘0’ and ‘1’. (ex. XC61X1⇒XC6101 and XC6111)。

七彩虹 C.MRC41 VER2.1主板中文说明书

因ＩＴ市场变化迅速，编辑时间有限，不保证本手册中没有错误，所以本手册仅供用户参考使用，不提供任何形式的担保。

本公司保留对本文内容修订和改变的权利。

对于所作修改，公司没有责任和义务通知任何个人。

商标本手册中有使用到其他公司的注册商标，特声明如下：Microsoft、MS-DOS和Windows是微软公司（Microsoft Corp．）的注册商标。

MMX、Pentium、Celeron是Intel公司的注册商标。

其他在本说明书中使用的产品名称是他们各自所属公司所拥有和被公认的。

技术支持七彩虹网站七彩虹信箱support@800免费服务热线800-830-5866全国联保—请直接与各地分公司联系：北京：010-********上海：021-********广州：020-********沈阳：024-********成都：028-********南京：025-********武汉：027-********深圳：83754601ｉｉｉ安全指导１．务必请仔细通读本安全指导。

２．务必请妥善保管本手册，以备将来参考。

３．请保持本设备的干燥。

４．在使用前，宜将本设备置于稳固的平面上。

５．机箱的开口缝槽是用于通风，避免机箱内的部件过热。

请勿将此类开口掩盖或堵塞。

６．在将本设备与电源连接前，请确认电源电压值，将电压调整为１１０／２２０Ｖ。

７．请将电源线置于不会被践踏的地方，并且不要在电源线上堆置任何物件。

８．插拔任何扩展卡或模块前，请都将电源线拔下。

９．请留意手册上提到的所有注意和警告事项。

１０．不得将任何液体倒入机箱开口的缝槽中，否则会产生严重损坏或电路瘫痪。

１１．如果发生以下情况，请找专业人员处理：１）电源线或插头损坏２）液体渗入机器内３）机器暴露在潮湿的环境中４）机器工作不正常或用户不能通过本手册的指导使其正常工作５）机器跌落或受创６）机器有明显的破损迹象１２．请不要将本设备置于或保存在环境温度高于６０℃（１４０Ｆ）下，否则会对设备造成伤害。

珊星变频器说明书V2.7

用户须知
本设备的用户和对使用本设备负有责任的人，必须详细阅读本手册，认真遵循手册中的说明和指导，保证本设备的使用可靠和安全。在任何情况下，对于使用本设备不当而造成的直接或间接的损害，本公司概不负责。本手册中的图表仅用于对文字进行说明，手册中所示的带插图的用途和用法本公司不承担法律责任和义务。未经我公司的许可，不得对本手册进行全部/部分，或其他方式的复制。产品的使用或安装的不正确，会导致元件损坏和产品寿命缩短，用户在安装和使用变频器的过程中，必须执行适用的工业标准和具体的安全指标规范，以及接口要求。
3.1.3 显示说明 ................................................................................................................24 3.1.4 操作说明 ................................................................................................................28 3.2 大面板键盘操作...........................................................................................................29 3.2.1 操作键盘 ................................................................................................................29 3.2.2 基本操作 ................................................................................................................30 3.2.3 监控方式切换 .........................................................................................................31 3.2.4 功能参数设置(编程模式) .......................................................................................33 3.3 参数设置注意事项 ........................................................................................................36 第四章功能参数表 ................................................................................................................37 第五章功能参数说明.............................................................................................................44 第六章使用范例 ....................................................................................................................79 6.1 设定最大输出频率 ........................................................................................................79 6.2 由自控变为外控 ............................................................................................................80 6.3 低频时转矩提升 ............................................................................................................81 6.4 多段速运行....................................................................................................................81 6.5 加/减速时间的设定 .......................................................................................................83 6.6 点动运行 .......................................................................................................................84 6.7 用比例频率运行(主从操作)...........................................................................................85 6.8 过流、过压失速保护.....................................................................................................86 6.9 风机及水泵类负载的应用 .............................................................................................86 第七章故障与排除 ..............................................................................................................88 7.1 故障诊断 .......................................................................................................................88 7.2 变频器复位....................................................................................................................90 7.3 故障排除 .......................................................................................................................91 第八章维护与保养 ................................................................................................................92 8.1 日常检查 .......................................................................................................................92 8.2 定期检查 .......................................................................................................................92 8.3 部件更换 .......................................................................................................................92 第九章技术规范 ....................................................................................................................93 第十章串行通信 ....................................................................................................................96

相关主题

1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。

_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíDevice Features _äìÉ`çêÉ»QJolj=`pm=bao Single Chip Bluetooth ® v2.0 + EDR SystemProduct Data Sheet for BC41B143A September 2005 ! Fully Qualified Bluetooth v2.0 + EDR System ! Enhanced Data Rate (EDR) compliant withv2.0 of specification for both 2Mbits/s and 3Mbits/s modulation modes ! Full-speed Bluetooth Operation with FullPiconet Support ! Scatternet Support ! 1.8V core, 1.7 to 3.6V I/O Split Rails! Ultra Low Power Consumption! Excellent Compatibility with CellularTelephones! Minimum External Components Required ! Integrated 1.8V Linear Regulator! USB and UART Port to 3MBits/s! Support for 802.11 Co-existence! RoHS CompliantGeneral Description Applications_äìÉ`çêÉQJolj=`pm is a single-chip radio and baseband IC for Bluetooth 2.4GHz systemsincluding EDR to 3Mbits/s. With the on-chip CSR Bluetooth software stack it provides a fully compliant Bluetooth system tov2.0 + EDR of the specification for data and voice communications. ! Cellular Handsets! Personal Digital Assistants (PDAs)! Digital cameras and other high-volume consumerproducts! Space critical applicationsBlueCore4-ROM CSP is designed to reduce the numberof external components required. This ensures thatproduction costs are minimised.The device incorporates auto-calibration and built-inself-test (BIST) routines to simplify development, typeapproval and production test. All hardware and devicefirmware is fully compliant with the Bluetooth v2.0 + EDRSpecification (all mandatory and optional features).To improve the performance of both Bluetooth and802.11b/g co-located systems a wide range ofco-existence features are available including a variety ofhardware signalling: basic activity signalling and IntelWCS activity and channel signalling.BlueCore4-ROM CSP System Architecture_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíContents1 Status Information (7)2 Key Features (8)3 CSP Package Information (9)3.1 BlueCore4-ROM CSP Pinout Diagram (9)3.2 BC41B143AXX-IXF Device Terminal Functions (10)4 Electrical Characteristics (13)4.1 Power Consumption (19)5 Radio Characteristics – Basic Data Rate (20)5.1 Temperature +20°C (20)5.1.1 Transmitter (20)5.1.2 Receiver (22)5.2 Temperature -40°C (24)5.2.1 Transmitter (24)5.2.2 Receiver (24)5.3 Temperature -25°C (25)5.3.1 Transmitter (25)5.3.2 Receiver (25)5.4 Temperature +85°C (26)5.4.1 Transmitter (26)5.4.2 Receiver (26)5.5 Temperature +105°C (27)5.5.1 Transmitter (27)5.5.2 Receiver (27)6 Radio Characteristics – Enhanced Data Rate (28)6.1 Temperature +20°C (28)6.1.1 Transmitter (28)6.1.2 Receiver (29)6.2 Temperature -40°C (30)6.2.1 Transmitter (30)6.2.2 Receiver (31)6.3 Temperature -25°C (32)6.3.1 Transmitter (32)6.3.2 Receiver (33)6.4 Temperature +85°C (34)6.4.1 Transmitter (34)6.4.2 Receiver (35)6.5 Temperature +105°C (36)6.5.1 Transmitter (36)6.5.2 Receiver (37)7 Device Diagram (38)8 Description of Functional Blocks (39)8.1 RF Receiver (39)8.1.1 Low Noise Amplifier (39)8.1.2 Analogue to Digital Converter (39)8.2 RF Transmitter (39)8.2.1 IQ Modulator (39)8.2.2 Power Amplifier (39)8.2.3 Auxiliary DAC (39)8.3 RF Synthesiser (39)8.4 Power Control and Regulation (39)8.5 Clock Input and Generation (40)8.6 Baseband and Logic (40)_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉí8.6.1 Memory Management Unit (40)8.6.2 Burst Mode Controller (40)8.6.3 Physical Layer Hardware Engine DSP (40)8.6.4 RAM (40)8.6.5 ROM (40)8.6.6 USB (41)8.6.7 Synchronous Serial Interface (41)8.6.8 UART (41)8.6.9 Audio PCM Interface (41)8.7 Microcontroller (41)8.7.1 Programmable I/O (41)8.7.2 802.11 Coexistence Interface (41)9 CSR Bluetooth Software Stacks (42)9.1 BlueCore HCI Stack (42)9.1.1Key Features of the HCI Stack – Standard Bluetooth Functionality (42)9.1.2 Key Features of the HCI Stack - Extra Functionality (44)9.2 BCHS Software (45)9.3 Additional Software for Other Embedded Applications (45)9.4 CSR Development Systems (45)10 Enhanced Data Rate (46)10.1 Enhanced Data Rate Baseband (46)10.2 Enhanced Data Rate π/4 DQPSK (46)10.3 Enhanced Data Rate 8DPSK (47)11 Device Terminal Descriptions (49)11.1 RF_A and RF_B (49)11.1.1 Transmit RF Power Control for Class 1 Applications .................................................................50 11.1.2Control of External RF Components (51)11.2 External Reference Clock Input (XTAL_IN) (51)11.2.1 External Mode (51)11.2.2 XTAL_IN Impedance in External Mode (52)11.2.3 Clock Timing Accuracy (52)11.2.4 Clock Start-Up Delay (52)11.2.5 Input Frequencies and PS Key Settings (53)11.3 Crystal Oscillator (XTAL_IN, XTAL_OUT) (54)11.3.1 XTAL Mode (54)11.3.2 Load Capacitance (55)11.3.3 Frequency Trim (55)11.3.4 Transconductance Driver Model (56)11.3.5 Negative Resistance Model (56)11.3.6 Crystal PS Key Settings (57)11.3.7 Crystal Oscillator Characteristics (57)11.4 UART Interface (60)11.4.1 UART Bypass (62)11.4.2 UART Configuration while RESETB is Active (62)11.4.3 UART Bypass Mode (62)11.5 USB Interface (63)11.5.1 USB Data Connections..............................................................................................................63 11.5.2 USB Pull-Up Resistor.................................................................................................................63 11.5.3 Power Supply.............................................................................................................................63 11.5.4 Self-powered Mode....................................................................................................................63 11.5.5 Bus-powered Mode....................................................................................................................64 11.5.6 Suspend Current........................................................................................................................65 11.5.7 Detach and Wake-Up Signalling................................................................................................65 11.5.8 USB Driver.................................................................................................................................65 11.5.9 USB Compliance........................................................................................................................6611.5.10 USB 2.0 Compatibility (66)11.6 Serial Peripheral Interface (66)11.6.1 Instruction Cycle (66)11.6.2 Writing to BlueCore4-ROM CSP (67)11.6.3Reading from BlueCore4-ROM CSP (67)11.6.4Multi-Slave Operation (67)11.7Audio PCM Interface (68)11.7.1PCM Interface Master/Slave (68)11.7.2Long Frame Sync (69)11.7.3Short Frame Sync (69)11.7.4Multi Slot Operation (70)11.7.5GCI Interface (70)11.7.6Slots and Sample Formats (71)11.7.7Additional Features (71)11.7.8PCM Timing Information (72)11.7.9PCM Slave Timing (74)11.7.10PCM_CLK and PCM_SYNC Generation (75)11.7.11PCM Configuration (76)11.8I/O Parallel Ports (77)11.8.1PIO Defaults for BlueCore4-ROM CSP (77)11.9I2C Master (78)11.10TCXO Enable OR Function (78)11.11Resetting BlueCore4-ROM CSP (79)11.11.1Pin States during Reset (79)11.11.2Status after Reset (80)11.12Power Supply (80)11.12.1Voltage Regulator (80)11.12.2Sequencing (80)11.12.3Sensitivity to Disturbances (80)12Application Schematic (81)13Package Dimensions (82)14Ordering Information (83)14.1BlueCore4-ROM CSP (83)15Contact Information (84)16Document References (85)Terms and Definitions (86)Document History...............................................................................................................................................89_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíList of FiguresFigure 3.1: BlueCore4-ROM CSP Package (9)Figure 7.1: BlueCore4-ROM CSP Device Diagram for CSP Package (38)Figure 9.1: BlueCore HCI Stack (42)Figure 10.1: Basic Data Rate and Enhanced Data Rate Packet Types (46)Figure 10.2: π/4 DQPSK Constellation Pattern (47)Figure 10.3: 8DPSK Constellation Pattern (48)Figure 11.1: Circuit RF_A and RF_B (49)Figure 11.2: Internal Power Ramping (50)Figure 11.3: TCXO Clock Accuracy (52)Figure 11.4: Actual Allowable Clock Presence Delay on XTAL_IN vs. PS Key Setting (53)Figure 11.5: Crystal Driver Circuit (54)Figure 11.6: Crystal Equivalent Circuit (55)Figure 11.7: Crystal Load Capacitance and Series Resistance Limits with Crystal Frequency (57)Figure 11.8: Crystal Driver Transconductance vs. Driver Level Register Setting (58)Figure 11.9: Crystal Driver Negative Resistance as a Function of Drive Level Setting (59)Figure 11.10: Break Signal (61)Figure 11.11: UART Bypass Architecture (62)Figure 11.12: USB Connections for Self Powered Mode (64)Figure 11.13: USB Connections for Bus-Powered Mode (64)Figure 11.14: USB_DETACH and USB_WAKE_UP Signalling (65)Figure 11.15: Write Operation (67)Figure 11.16: Read Operation (67)Figure 11.17: BlueCore4-ROM CSP as PCM Interface Master (68)Figure 11.18: BlueCore4-ROM CSP as PCM Interface Slave (69)Figure 11.19: Long Frame Sync (Shown with 8-bit Companded Sample) (69)Figure 11.20: Short Frame Sync (Shown with 16-bit Sample) (69)Figure 11.21: Multi Slot Operation with Two Slots and 8-bit Companded Samples (70)Figure 11.22: GCI Interface (70)Figure 11.23: 16-Bit Slot Length and Sample Formats (71)Figure 11.24: PCM Master Timing Long Frame Sync (73)Figure 11.25: PCM Master Timing Short Frame Sync (73)Figure 11.26: PCM Slave Timing Long Frame Sync (74)Figure 11.27: PCM Slave Timing Short Frame Sync (75)Figure 11.28: Example EEPROM Connection (78)Figure 11.29: Example TXCO Enable OR Function (78)Figure 12.1: Application Circuit for CSP Package (81)Figure 14.1: BlueCore4-ROM CSP Package Dimensions.....................................................................................82_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíList of TablesTable 10.1: Data Rate Schemes (46)Table 10.2: 2-Bits Determine Phase Shift Between Consecutive Symbols (47)Table 10.3: 3-Bits Determine Phase Shift Between Consecutive Symbols (48)Table 11.1: PSKEY_TXRX_PIO_CONTROL Values (51)Table 11.2: External Clock Specifications (51)Table 11.3: PS Key Values for CDMA/3G Phone TCXO Frequencies (53)Table 11.4: Crystal Specification (55)Table 11.5: Possible UART Settings (60)Table 11.6: Standard Baud Rates (61)Table 11.7: USB Interface Component Values (65)Table 11.8: Instruction Cycle for an SPI Transaction (66)Table 11.9: PCM Master Timing (72)Table 11.10: PCM Slave Timing (74)Table 11.11: PSKEY_PCM_LOW_JITTER_CONFIG Description (76)Table 11.12: PSKEY_PCM_LOW_JITTER_CONFIG Description (77)Table 11.13: Pin States of BlueCore4-ROM CSP on Reset (79)List of EquationsEquation 11.1: Output Voltage with Load Current ≤ 10mA (50)Equation 11.2: Output Voltage with No Load Current (50)Equation 11.3: Load Capacitance (55)Equation 11.4: Trim Capacitance (55)Equation 11.5: Frequency Trim (56)Equation 11.6: Pullability (56)Equation 11.7: Transconductance Required for Oscillation (56)Equation 11.8: Equivalent Negative Resistance (56)Equation 11.9: Baud Rate (61)Equation 11.10: PCM_CLK Frequency When Being Generated Using the Internal 48MHz Clock (75)Equation 11.11: PCM_SYNC Frequency Relative to PCM_CLK...........................................................................75_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉí_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉí1 Status InformationThe status of this Data Sheet is Advance Information.CSR Product Data Sheets progress according to the following format:Advance InformationInformation for designers concerning CSR product in development. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values.All detailed specifications including pinouts and electrical specifications may be changed by CSR without notice. Pre-Production InformationPinout and mechanical dimension specifications finalised. All values specified are the target values of the design. Minimum and maximum values specified are only given as guidance to the final specification limits and must not be considered as the final values.All electrical specifications may be changed by CSR without notice.Production InformationFinal Data Sheet including the guaranteed minimum and maximum limits for the electrical specifications. Production Data Sheets supersede all previous document versions.RoHS ComplianceBlueCore4-ROM devices meet the requirements of Directive 2002/95/EC of the European Parliament and of the Council on the Restriction of Hazardous Substance (RoHS).Trademarks, Patents and LicensesUnless otherwise stated, words and logos marked with ™ or ® are trademarks registered or owned byCambridge Silicon Radio Limited or its affiliates. Bluetooth® and the Bluetooth logos are trademarks owned by Bluetooth SIG, Inc. and licensed to CSR. Other products, services and names used in this document may have been trademarked by their respective owners.Windows®, Windows 98™, Windows 2000™, Windows XP™ and Windows NT™ are registered trademarks of the Microsoft Corporation.OMAP™ is a trademark of Texas Instruments Inc.The publication of this information does not imply that any license is granted under any patent or other rights owned by Cambridge Silicon Radio Limited.CSR reserves the right to make technical changes to its products as part of its development programme.While every care has been taken to ensure the accuracy of the contents of this document, CSR cannot accept responsibility for any errors.CSR’s products are not authorised for use in life-support or safety-critical applications.2 Key FeaturesRadio!Common TX/RX terminals simplify external matching and eliminates external antenna switch !BIST minimises production test time. No external trimming is required in production!Full RF reference designs are available!Bluetooth v2.0 + EDR Specification compliant Transmitter!+6dBm RF transmit power with level control from on-chip 6-bit DAC over a dynamic range >30dB!Class 2 and Class 3 support without the need for an external power amplifier or TX/RX switch!Class 1 support using external power amplifier, with RF power controlled by an internal 8-bit DAC!Supports DQPSK (2Mbps) and 8DPSK (3Mbps) modulationReceiver!Integrated channel filters!Digital demodulator for improved sensitivity and co-channel rejection!Real-time digitised RSSI available on HCI interface !Fast AGC for enhanced dynamic range!Supports DQPSK and 8DPSK modulation!Channel classificationSynthesiser!Fully integrated synthesizer requires no external VCO varactor diode, resonator or loop filter!Compatible with crystals between 8 and 40MHz (in multiples of 250kHz) or an external clock!Accepts 7.68, 14.44, 15.36, 16.2, 16.8, 19.2, 19.44,19.68, 19.8 and 38.4MHz TCXO frequencies forGSM and CDMA devices with sinusoidal or logiclevel signalsAuxiliary Features!Crystal oscillator with built-in digital trimming!Power management includes digital shut down and wake up commands with an integrated low-poweroscillator for ultra-low Park/Sniff/Hold mode!Clock Request output to control an external clock source Auxiliary Features (continued)!Device can run in low power modes from anexternal 32KHz clock signal!Auto Baud Rate setting for different TCXOfrequencies!On-chip linear regulator, producing 1.8V outputfrom 2.2-4.2V input!Power-on-reset cell detects low supply voltageBaseband and Software!Internal 48-KByte RAM, allows full-speed datatransfer, mixed voice and data, and full piconetoperation, including all medium rate preset types!Logic for forward error correction, header errorcontrol, access code correlation, CRC,demodulation, encryption bit stream generation,whitening and transmit pulse shaping. Supports allBluetooth v2.0 + EDR features including eSCO andAFH!Transcoders for A-law, μ-law and linear voice fromhost and A-law, μ-law and CVSD voice over airPhysical Interfaces!Synchronous serial interface up to 4Mbaud forsystem debugging!UART interface with programmable baud rate up to 3Mbits/s with an optional bypass mode!Full-speed USB v2.0 interface supports OHCI andUHCI host interfaces!Synchronous bi-directional serial programmableaudio interface!Optional I2C™ compatible interfaces!Optional 802.11 co-existence interfacesBluetooth StackCSR’s Bluetooth protocol stack runs on the on-chipMCU in a variety of configurations:!Standard HCI (UART or USB)!Customised builds with embedded application code Package Options!47-ball CSP 3.8 x 4.0 x 0.7mm_äìÉ`çêÉ»QJolj=`pm=baomêçÇìÅí=a~í~=pÜÉÉí3 CSP Package Information3.1 BlueCore4-ROM CSP Pinout DiagramA B C D E F G 1234567A2A3A4A5A6A7B1B2B3B4B5B6B7C1C2C3C4C5C6C7D2D3E1E2E3F1F2F3G1G2G3D5D6D7E5E6E7F5F6F7G5G6G7D4E4F4G4Orientation from top of deviceFigure 3.1: BlueCore4-ROM CSP Package_äìÉ`çêÉ»QJolj=`pm=baomêçÇìÅí=a~í~=pÜÉÉí_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉí 3.2 BC41B143AXX-IXF Device Terminal Functions Radio Ball Pad Type DescriptionRF_A E2 Analogue Transmitter output/switched receiver input RF_B E1 Analogue Complement of RF_AAUX_DAC D2 Analogue Voltage DACSynthesiser andOscillator Ball Pad Type DescriptionXTAL_IN A3 Analogue For crystal or external clock inputXTAL_OUT B3 Analogue Drive for crystalPCM Interface Ball Pad Type DescriptionPCM_OUT E4 CMOS output, tri-statablewith weak internal pull-downSynchronous data outputPCM_IN B7 CMOS input, with weakinternal pull-down Synchronous data inputPCM_SYNC D5 Bi-directional with weakinternal pull-down Synchronous data syncPCM_CLK B6 Bi-directional with weakinternal pull-down Synchronous data clockUSB and UART Ball Pad Type DescriptionUART_TX C5 CMOS output, tri-statablewith weak internal pull-up UART data output active highUART_RX D4 CMOS input with weakinternal pull-down UART data input active highUART_RTS A7 CMOS output, tri-statablewith weak internal pull-up UART request to send active lowUART_CTS C4 CMOS input with weakinternal pull-down UART clear to send active lowUSB_DP B5 Bi-directional USB data plus with selectable internal1.5k Ω Pull-up resistorUSB_DN A6 Bi-directional USB data minusCSP Package Information_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíTest and Debug Ball Pad Type DescriptionRESETB E7 CMOS input with weak internal pull-up Reset if low. Input debounced so must below for >5ms to cause a resetSPI_CSB G6 CMOS input with weak internal pull-up Chip select for Serial Peripheral Interface(SPI), active lowSPI_CLK G5 CMOS input with weakinternal pull-down SPI clockSPI_MOSI F6 CMOS input with weakinternal pull-down SPI data input into BlueCoreSPI_MISO F7 CMOS output, tri-state withweak internal pull-down SPI data output from BlueCoreTEST_EN G7 CMOS input with stronginternal pull-down For test purposes only (leave unconnected)PIO Port Ball Pad Type DescriptionPIO[0] F3 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[1] F4 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[2] G1 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[3] G2 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[4] E6 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[5] F5 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[6] D7 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[7] E5 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[8] E3 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[9] F1 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output linePIO[10] F2 Bi-directional withprogrammable strength internal pull-up/downProgrammable input/output lineAIO[0] D3 Bi-directional Programmable input/output lineAIO[2] C3 Bi-directional Programmable input/output lineCSP Package Information_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíPower Supplies andControl Ball Pad Type DescriptionVREG_IN A2 Regulator input Regulator inputVDD_USB A5 VDD Positive supply for UART ports and AIOsVDD_PIO G4 VDD Positive supply for PIO [3:0] and [10:8]VDD_PADS D6 VDD Positive supply for all other digitalinput/output ports, and PIO [7:4]VDD_CORE C6 VDD Positive supply for internal digital circuitryVDD_LO B2 VDD Positive supply for VCO and synthesisercircuitryVDD_RADIO C2 VDD Positive supply for RF circuitryVDD_ANA A4 VDD/Regulator output Positive supply for analogue circuitry andinternal 1.8V regulator outputVSS_DIG C7 VSS Ground connection for internal digitalcircuitry and digital portsVSS_PADS G3 VSS Ground connection for digital portsVSS_RADIO C1 VSS Ground connections for RF circuitryVSS_ANA B4 VSS Ground connections for analogue circuitryVSS_LO B1 VSS Ground connection for VCO and synthesisercircuitry4 Electrical CharacteristicsAbsolute Maximum RatingsMaximum Rating MinimumStorage temperature -40°C 150°C_äìÉ`çêÉ»QJolj=`pm=bao Supply voltage: VDD_RADIO, VDD_LO, VDD_ANA, and-0.4V 2.2VVDD_CORESupply voltage: VDD_PADS, VDD_PIO and VDD_USB -0.4V 3.7VSupply voltage: VREG_IN -0.4V 5.6VVDD+0.4VOther terminal voltages VSS-0.4VRecommended Operating ConditionsOperating Condition Minimum MaximumOperating temperature range -40°C 105°CGuaranteed RF performance range(1)-40°C 105°CSupply voltage: VDD_RADIO, VDD_LO, VDD_ANA, and1.7V 1.9VVDD_CORESupply voltage: VDD_PADS, VDD_PIO and VDD_USB 1.7V 3.6VSupply voltage: VREG_IN 2.2V 4.2V(2)Note:(1) Typical figures are given for RF performance between -40°C and +105°C.(2) The device will operate without damage with VREG_IN as high as 5.6V. However the RF performance isnot guaranteed above 4.2V.mêçÇìÅí=a~í~=pÜÉÉí_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉí Input/Output Terminal CharacteristicsLinear RegulatorMinimum Typical Maximum Unit Normal OperationOutput voltage (I load = 70mA / VREG_IN = 3.0V) 1.70 1.78 1.85 VTemperature coefficient -250 - 250 ppm/°COutput noise (1) - - 1 mV rms Load regulation (I load < 70mA) - - 50 mV/ASettling time (2) - - 50 μsMaximum output current 70 - - mAOutput current: Minimum load current 5 - - μAInput voltage - - 4.2(3) VDropout voltage (I load = 70mA) - - 350 mVQuiescent current (excluding Ioad, I load < 1mA) 25 35 50 μALow Power Mode (4)Quiescent current (excluding Ioad, I load < 100μA) 4 7 10 μADisabled Mode (5)Quiescent current 1.5 2.5 3.5 μANotes:(1) Regulator output connected to 47nF pure and 4.7μF 2.2Ω ESR capacitors. Frequency range 100Hz to100kHz(2) 1mA to 70mA pulsed load(3) Operation up to 5.6V is permissible without damage and without the output voltage rising sufficiently todamage the rest of BlueCore4-ROM CSP, but output regulation and other specifications are no longerguaranteed at input voltages in excess of 4.2V(4) Low power mode is entered and exited automatically when the IC enters/leaves Deep Sleep mode(5) Regulator is disabled when VREG_EN is pulled low. It can also be disabled by VREG_IN when it iseither open circuit or driven to the same voltage as VDD_ANA_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíInput/Output Terminal Characteristics (Continued)Digital TerminalsMinimum Typical Maximum Unit Input Voltage Levels2.7V ≤ VDD ≤3.0V -0.4 - 0.8 V V IL input logic level low 1.7V ≤ VDD ≤ 1.9V -0.4 - 0.4 VV IH input logic level high 0.7VDD - VDD+0.4 VOutput Voltage LevelsV OL output logic level low,(l o = 4.0mA) (1), 2.7V ≤ VDD ≤ 3.0V - - 0.2 VV OL output logic level low,(l o = 4.0mA) (1), 1.7V ≤ VDD ≤ 1.9V - - 0.4 VV OH output logic level high,(l o = -4.0mA) (2), 2.7V ≤ VDD ≤ 3.0V VDD-0.2 - - VV OH output logic level high,(l o = -4.0mA) (2), 1.7V ≤ VDD ≤ 1.9V VDD-0.4 - - VInput and Tri-State Current with:Strong pull-up -100 -40 -10 μAStrong pull-down 10 40 100 μAWeak pull-up -5 -1 -0.2 μAWeak pull-down 0.2 1 5.0 μAI/O pad leakage current -1 0 1 μAC I input capacitance 1.0 - 5.0 pFNotes:(1) Current sunk into terminal(2) Current sourced out of terminal_äìÉ`çêÉ»QJolj=`pm=bao mêçÇìÅí=a~í~=pÜÉÉíInput/Output Terminal Characteristics (Continued)USB TerminalsMinimum Typical Maximum Unit VDD_USB for correct USB operation 3.1 3.6 VInput thresholdV IL input logic level low - - 0.3VDD_USB VV IH input logic level high 0.7VDD_USB - - VInput leakage currentVSS_USB < V IN < VDD_USB (1) -1 1 5 μAC I Input capacitance 2.5 - 10.0 pFOutput Voltage levelsTo correctly terminated USB CableV OL output logic level low 0.0 - 0.2 VV OH output logic level high 2.8 - VDD_USB VNotes:(1) Internal USB pull-up disabledInput/Output Terminal Characteristics (Continued)Power-on reset Minimum Typical Maximum UnitVDD_CORE falling threshold 1.40 1.50 1.60 VVDD_CORE rising threshold 1.50 1.60 1.70 VHysteresis 0.05 0.10 0.15 VInput/Output Terminal Characteristics (Continued)Auxiliary ADC Minimum Typical Maximum UnitResolution - - 8 Bits Input voltage range(LSB size = VDD_ANA/255) 0 - VDD_ANA VAccuracy INL -1 - 1 LSB(Guaranteed monotonic) DNL 0 - 1 LSBOffset -1 - 1 LSB Gain error -0.8 - 0.8 %Input bandwidth - 100 - kHzConversion time - 2.5 - μsSample rate - - 700 Samples/s。