CMMI文件清单中英文对照表(已排版)

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CMMI体系22个PA信息文件清单

实践对应规程文件小组责任人 GP 2.1 建立组织级方针 GP 2.2 计划过程 GP 2.3 提供资源 GP 2.4 分派职责 GP 2.5 培训人员 QMS-ARCH-P01规程概述与方 GP 2.6 控制工作产品针领导小组 GP 2.7 识别相关干系人，并使之参与 QMS-PI-P01 过程改进规程 GP 2.8 监督并控制过程 GP 2.9 客观评价遵守程度 GP 2.10 与上级管理层一起进行状态评审 GP 3.1 建立已定义的过程 GP 3.2 收集与过程相关的经验 SP 1.1 识别配置项 QMS-CM-P01 配置管理规程 SP 1.2 建立配置管理系统 QMS-NA-P01 系统网络管理规 SP 1.3 创建或发布基线程配置管理改进 SP 2.1 跟踪变更请求 QMS-PAM-P01 产品档案管理 SP 2.2 控制配置项规程 SP 3.1 建立配置管理记录 QMS-RC-P01 文件控制规程 SP 3.2 执行配置审计 SP 1.1 建立度量目标 SP 1.2 明确说明度量项 SP 1.3 明确说明数据收集与存储的规程 QMS-MA-P01 度量分析规程 SP 1.4 明确说明分析规程度量改进 SP 2.1 获得度量数据 SP 2.2 分析度量数据 SP 2.3 存储数据与结果 SP 2.4 沟通结果 SP 1.1 监督项目计划参数 SP 1.2 监督承诺 QMS-PM-P01 项目管理规程 SP 1.3 监督项目风险 QMS-PM-P02 系统集成项目管 SP 1.4 监督数据管理理规程 CMMI2-3级改 SP 1.5 监督干系人的参与 QMS-MRP-P01 项目管理评审善小组 SP 1.6 进行进展评审规程 SP 1.7 进行里程碑评审 QMS-RC-P01 质量记录监控规 SP 2.1 分析问题程 SP 2.2 采取纠正措施 SP 2.3 管理纠正措施 SP 1.1 估算项目范围 SP 1.2 建立对工作产品与任务属性的估算 SP 1.3 定义项目生命周期阶段 SP 1.4 估算工作量与成本 SP 2.1 建立预算与进度 SP 2.2 识别项目风险 SP 2.3 计划数据管理 QMS-SEM-P01软件估算管理规程 CMMI2-3级改善小组 SP 2.4 计划项目资源 SP 2.5 计划所需的知识与技能 SP 2.6 计划干系人的参与 SP 2.7 建立项目计划 SP 3.1 评审影响项目的各项计划 SP 3.2 协调工作与资源水平 SP 3.3 获得对计划的承诺

CMMI中英文术语对照表

CMMI中英文术语对照表A-D E-L M-R S-ZAability to perform执行的能力: （参见公共特性/common feature）acceptance criteria接受标准：为让用户、客户或其他授权组织接受，一个系统或组件所必须满足的条件。

[IEEE-STD-610] acceptance testing接受性测试：用来决定系统是否达到接受标准的正规测试，从而能够使客户决定是否接受系统。

[IEEE-STD-610]acting phase行动阶段：（参见IDEAL 方法）action item行动项目：（1）列表中分配给个人或组进行处理的一个单元。

（2）已被接受的一项行动提议。

action proposal行动提议：文档化的修改过程或过程相关项的建议，用以防止缺陷预防活动中发现的缺陷再发生。

（参见软件过程改进提议/software process improvement proposal）activities performed执行的活动：（参见公共特性/common features）activity活动：为达到某些目标而执行的一个步骤或一项功能，可能是脑力的也可能是体力的。

包括管理和技术人员为执行项目或组织工作任务而进行的所有活动。

（比照任务/task）Allocated requirements分配的需求：参见系统分配至软件的需求/system requirements allocated to softwareappraisal评审：是一个广泛意义上的词，可以是软件过程评估（process assessment），也可以是软件能力的评价（capability evaluation）。

assessment评估：在CMM中，一般指内部的过程评估。

audit审核：对一个或一套工作产品的独立的检查，用以确定是否符合规格说明、标准、合同协议或其他的准则。

[IEEE-STD-610]Bbaseline基线：经过正式审查并被一致认可的规格说明或产品，作为进一步开发基础，只有通过正式变更控制程序才能改变。

软件测试中英文术语对照表

Capture/Replay Tool
捕获/回放工具
Capture/Playback Tool
CASE
计算机辅助软件工程
Computer Aided Software Engineering
CAST
计算机辅助软件测试
Computer Aided Software Engineering的首字母缩写，参见Test Automation。在测试过程中使用计算机软件工具进行辅助的测试
Black-Box Testing
黑盒测试
不考虑组件或系统内部结构的功能或非功能测试
Black-Box Test Design Technique
黑盒测试设计技术
基于系统功能或非功能规格说明书来设计或选择测试用例的技术，不设计软件内部结构
Bottom-Up Testing
自底向上测试
渐增式集成测试的一种，其策略是先测试底层的组件，为此为基础逐步进行更高层次的组件测试，直到系统集成所有的组件，参见Intergration Testing
Analyzability
可分析性
软件产品缺陷或运行失败原因可悲诊断的能力，或对修改部分的可识别能力(ISO9126)。参见Maintainability
Analyzer
分析器
Static Analyzer
Anomaly
异常
任何和基于需求文档、设计文档、用户文档、标准或者个人的期望和预期之间偏差的情况都可以称为异常。异常可以在但不限于下面的过程中识别：评审（Review)、测试分析（Test Analysis)、编译(Compilation)、软件产品或应用文档的使用等。参见Defect、Deviation、Error、Fault、Failure、Incident、Problem

CMMI中英文术语对照表

CMMI中英⽂术语对照表Aability to perform执⾏的能⼒: （参见公共特性/common feature）acceptance criteria 接受标准：为让⽤户、客户或其他授权组织接受，⼀个系统或组件所必须满⾜的条件。

[IEEE-STD-610]acceptance testing 接受性测试：⽤来决定系统是否达到接受标准的正规测试，从⽽能够使客户决定是否接受系统。

[IEEE-STD-610]acting phase⾏动阶段：（参见 IDEAL ⽅法）action item⾏动项⽬：（1）列表中分配给个⼈或组进⾏处理的⼀个单元。

（2）已被接受的⼀项⾏动提议。

action proposal⾏动提议：⽂档化的修改过程或过程相关项的建议，⽤以防⽌缺陷预防活动中发现的缺陷再发⽣。

（参见软件过程改进提议/software process improvement proposal）activities performed执⾏的活动：（参见公共特性/common features）activity活动：为达到某些⽬标⽽执⾏的⼀个步骤或⼀项功能，可能是脑⼒的也可能是体⼒的。

包括管理和技术⼈员为执⾏项⽬或组织⼯作任务⽽进⾏的所有活动。

（⽐照任务/task）Allocated requirements分配的需求：参见系统分配⾄软件的需求/system requirements allocated to softwareappraisal评审：是⼀个⼴泛意义上的词，可以是软件过程评估（process assessment），也可以是软件能⼒的评价（capability evaluation）。

assessment评估：在CMM中，⼀般指内部的过程评估。

audit审核：对⼀个或⼀套⼯作产品的独⽴的检查，⽤以确定是否符合规格说明、标准、合同协议或其他的准则。

[IEEE-STD-610]Bbaseline 基线：经过正式审查并被⼀致认可的规格说明或产品，作为进⼀步开发基础，只有通过正式变更控制程序才能改变。

CMMI2.0实践域中英文对照

CMMI2.0实践域中英文对照目录一、CMMI V2.0架构与实践域组织 (2)二、实践域及与V1.3对应关系说明 (4)1.RDM(3) 需求开发和需求管理 (4)2.PQA(3) 过程质量保证 (5)3.VV(3) 验证和确认 (7)4.PR(3) 同行评审 (8)5.TS(3) 技术解决方案 (9)6.PI(3) 产品集成 (11)7.SAM(4) 供应商协议管理 (12)8.EST(3) 估算 (14)9.PLAN(4) 计划 (15)10.MC(3) 监视和控制 (18)11.RSK(3) 风险和机遇管理 (19)12.OT(3) 组织培训 (21)13.CAR(5) 根因分析和解决方案 (22)14.DAR(3) 决策分析和解决方案 (24)15.CM(2) 配置管理 (26)16.PCM(4) 过程管理 (27)17.PAD(3) 过程资产开发 (29)18.MPM(5) 管理绩效和度量 (30)(4) 高层管理 (33)20.II(3) 基本资源配置 (34)一、CMMI V2.0架构与实践域组织二、实践域及与V1.3对应关系说明1.RDM(3) 需求开发和需求管理全称：Requirements Development and ManagementV1.3映射RD/REQMIntent（意图）Elicit requirements, ensure common understanding by stakeholders, and align requirements, plans, and work products.引出需求，确保干系人达成共识，并协调需求、计划和工作产品。

Value（价值）Ensures that customer's needs and expectations are satisfied.确保客户的需要和期望得到满足。

实践2.PQA(3) 过程质量保证全称：Process Quality AssuranceV1.3映射PPQAIntent（意图）Verify and enable improvement of the quality of the performed processes and resulting work products.验证并促进被执行的过程和工作产品结果的质量改进。

CMMI文档一览表（大全5篇）

CMMI文档一览表（大全5篇）第一篇：CMMI文档一览表CMMI文档一览表 V0.9 项目名称:《立项申请书》——《评审申请表》《评审准备表》《评审报告》；《立项通知单》《项目章程》《项目启动会议》《项目过程定义》——《评审申请表》《评审准备表》《评审报告》《项目WBS 估计书》——《评审申请表》《评审准备表》《评审报告》《项目开发计划》——《评审申请表》《评审准备表》《评审报告》（风险计划、培训计划、沟通计划、跟踪计划）《测试计划》——《评审申请表》《评审准备表》《评审报告》《风险管理列表》《项目周报》《项目成员周报》《项目阶段报告》《项目总结报告》《产品移交申请表》《产品移交文档清单》《移交组织财富库清单》项目例会、里程碑会议、总结会议《项目会议纪要》《数据项检查表》《项目问题跟踪表》单元《测试用例》《单元测试缺陷报告》《测试报告》/《工序报验单》、《材料报验单》、《产品验收记录单》集成《测试用例》《产品集成就绪检查列表》《集成测试缺陷报告》《测试报告》——《评审准备表》《评审报告》系统《测试用例》《系统测试缺陷报告》《测试报告》——《评审准备表》《评审报告》《验收测试计划》《验收测试缺陷报告》《验收测试用例》《验收测试报告》/《验收报告》《测试计划》（美伦纱业）注：船安一卡通和二层交换机项目在所有测试结束后，汇总缺陷，形成文档《缺陷报告》美伦纱业项目的《阶段缺陷报告》，每个阶段一个，项目结项以后汇总成一个《缺陷报告》《需求开发计划》《需求记录表》《需求模块功能矩阵》《用户需求规格说明书》——《评审申请表》《评审准备表》《评审报告》《软件需求规格说明书》——《评审申请表》《评审准备表》《评审报告》《设计说明书》《模块设计方案》《技术数据包》——《评审申请表》《评审准备表》《评审报告》《用户手册》——《评审申请表》《评审准备表》《评审报告》《集成计划》——《评审申请表》《评审准备表》《评审报告》QA《工作环境及设备检查表》《配置管理计划》——《评审申请表》《评审准备表》《评审报告》《配置审计报告》《配置状态报告》《变更申请表》《CM周报》《质量保证计划》——《评审申请表》《评审准备表》《评审报告》《QA过程评审检查表》《QA报告》《QA问题跟踪表》《QA 周报》《QA年度工作总结》《QA向高层报告》《项目度量计划》——《评审申请表》《评审准备表》《评审报告》《项目度量表》《项目估计记录》《决策分析报告》《培训申请表》《培训考勤表》《培训记录表》《项目异常数据分析表》、《原因分析会议记录》、《原因分析及改进报告》附：已有文档在文档旁注明数量，如果该文档只有一个，则打一个钩代替1。

中英文对照

英文简称
RMA PPM MIL MIS TUV UL CE SGS PM M/N
英文全称
Return Material Authorization Part Per Million Military(U.S) Management Information System
中文解释
客户退回 10-6(百万分之…) 美国军事标准管理认证公司德国认证公司美国优力安全检验欧盟认证公司英国远东公证
Production Market Manufacturing Notice
产品市场制造通告
英文简称
DCC ECN ECR DCN PE/ME EPR HR IE/QE R&D PPR
英文全称
Document Control Center Engineering Change Notice Engineering Change Request Document Change Notice
Hewlett-Packard Quality Manual Quality Procedure Working Instruction On Job Training First In First Out
Man Machine Material Method Environment 人`机器`材料`方法`环境
英文简称
AC/RE AQL CR MA MI QVL TQM PDCA MTBF QCDS
英文全称
Accept/Reject Acceptable Quality Level Critical Defect Major Defect Minor Defect Qualified Vendor List Total Quality Management Plan Do Check Action Mean Time Between Failures Quality Cost Delivery Service

CMM中英文名词对照表

124A/D 转换器阿贝误差验收检测实际接触点气动平衡空气轴承找正、建坐标系万向探测系统万向探测系统形状误差万向探测系统位置误差万向探测系统尺寸误差自动更换装置轴向四轴误差（转台）返回距离滚珠丝杠最佳拟合笛卡尔直角坐标系合格证明数控测量机热膨胀系数柱式坐标测量机比较仪压缩空气计算机辅助精度优化计算机辅助设计接触式探测系统连续轨迹控制转换规则转换检测参数坐标测量坐标测量机修正测量点修正扫描线修正扫描点平衡机构对角线百分表、千分表尺寸尺寸测量用接口标准直接CAD 接口直接CAD 编译器离散点探测离散点探测速度漂移动态作用误差修正图A/D Converter Abbe ErrorAcceptance Test (Of A CMM )Actual Contact PointAir (Pneumatic )Counter Balance Air Bearing AlignmentArticulated Probing SystemArticulated Probing System Form Error Articulated Probing System Location Error Articulated Probing System Size Error Autochanger Axial Four-Axis Error Back Off Distance Ballscrew Best-Fit Process Cartesian System Certification CNC CMMCoefficient Of Thermal Expansion Column CMM Comparator Compressed AirComputer Aided Accuracy Computer-Aided Design (CAD )Contacting Probing System Continuous Path Control Conversion RuleConverted Test Parameter Values Coordinate MeasurementCoordinate Measuring Machine (CMM )Corrected Measured Point Corrected Scan Line Corrected Scan Point Counter Balance Diagonal Line Dial Indicator DimensionDimensional Measuring Interface Standard (DMIS )Direct CAD Interface (DCI )Direct CAD Translation (DCT )Discreted-Point Probing Discreted-Point Probing Speed DriftDynamic Effect Error Mapping125Error Of Indication Of A CMM For Size Measurement Extent (Of A Data Set )Feature Construction Filtration SystemFinite Element Analysis (FEA )Fixed Bridge CMM Fixed HeadFixed Multiple-Stylus Probing System Form Error Fixed Multiple-Stylus Probing System Location Error Fixed Multiple-Stylus Probing System Size Error Fixed Table Cantilever CMM Fixed Table Horizontal-Arm CMM Form Friction BarFriction Driver (Capstan Or Traction )Gantry CMM Gauge BlockGaussian Associated Feature Gaussian Radial DistanceGPS (Geometrical Product Specifications )Helical GearHigh Point Density (Of A CMM )Humidity HysteresisIndicated Measured Point InfraredInterim Check (Of A CMM )Interim Testing Interim PointInternational Organization For Standardization (ISO )Laser Interferometer Laser Scanning Probe Lead Screw Learn Programming Least SquareLeast-Squares Associated Feature Length StandardLinear Displacement Accuracy LocationLow Point Density (Of A CMM )L-Shaped Bridge CMM Machine Coordinate System Magnetic Scale Manual CMM Manual Head Material Standard Material Standard Of Size坐标测量机尺寸测量的示值误差数据集的范围元素构造过滤系统有限元分析固定桥式坐标测量机固定测头座固定多探针探测系统形状误差固定多探针探测系统位置误差固定多探针探测系统尺寸误差固定工作台悬臂式坐标测量机固定工作台水平悬臂坐标测量机形状摩擦杆摩擦杆传动龙门式坐标测量机量块高斯辅助要素高斯径向距离产品几何量技术规范斜齿轮（坐标测量机）的高点密度湿度滞后，回程误差指示测量点红外的（坐标测量机）的中间检查中间检查中间点国际标准组织激光干涉仪激光扫描测头丝杠自学习编程最小二乘最小二乘辅助要素长度标准位置精度位置（坐标测量机）的低点密度L 型桥式坐标测量机机器坐标系统磁栅尺手动测量机手动测头座实物标准器尺寸实物标准器126Maximum Inscribed CircleMaximum Permissible Error Of Indication Of A CMM For Size MeasurementMaximum Permissible Fixed Multiple-Stylus Probing System Form ErrorMaximum Permissible Fixed Multiple-Stylus Probing System Location ErrorMaximum Permissible Fixed Multiple-Stylus Probing System Size ErrorMaximum Permissible Probing ErrorMaximum Permissible Articulated Probing System Form Error Maximum Permissible Articulated Probing System Location Error Maximum Permissible Articulated Probing System Size Error Maximum Permissible Axial Four Axis Error Maximum Permissible Radial Four Axis Error Maximum Permissible Scanning Probing Error Maximum Permissible Tangential Four Axis Error Maximum Permissible Time For Scanning Test Mean Time Between Failure (MTBF )Mean Time For Repair (MTFR )Measuring Volume Micrometer Micro-Strain GageMinimum Circumscribed Circle Motorized CMM Motorized Head Moving Bridge CMMMoving Ram Horizontal-Arm CMM Moving Table Cantilever CMM Moving Table Horizontal-Arm CMM Multiple Styli Multiple Stylus Multi-Probe System Multi-Stage Speed ReducerNational Institute Of Standard And Technology (NIST )Non-Cartesian System Non-Contacting Probing System Non-Uniform Temperatures Not Pre-Defined Path Scanning Off-Line Programming Optical Probe Optical Probing System Optical Scale OrientationParameterization Of A Feature Part Coordinate System Part Handling最大内切圆坐标测量机尺寸测量的最大允许示值误差最大允许固定多探针探测系统形状误差最大允许固定多探针探测系统位置误差最大允许固定多探针探测系统尺寸误差最大允许探测误差最大允许万向探测系统形状误差最大允许万向探测系统位置误差最大允许万向探测系统尺寸误差最大允许轴向四轴误差（转台）最大允许径向四轴误差（转台）最大允许扫描探测误差最大允许切向四轴误差（转台）最大允许扫描检测时间平均失效时间平均修复时间测量空间千分尺微型应变片最小外接圆机动测量机机（自）动测头座移动桥式坐标测量机水平悬臂移动式坐标测量机移动工作台悬臂式坐标测量机移动工作台水平悬臂坐标测量机多探针多探针多测头系统多级减速器（美国）国家标准及技术研究院非直角坐标系非接触式探测系统不均匀温度场非预定路径扫描脱机编程光学测头光学探测系统光学直线尺，光栅尺方向要素参数化零件坐标系零件工夹具127Part Programming Piezo Sensor PitchPre-Defined Path Scanning Pretravel ProbeProbe Calibration Probe Head Probe Lobbing Probing Error Probing SystemProbing System Qualification Probing (to probe )Program Point Programmable Fixture Rack-And-Pinion Radial Four Axis Error Ram Range Read Head Reference Data Set Reference PairReference Parameter Value Reference Parameterization Reference Residual Reference Software Reference Sphere Reflection Scale Reliability Repeatability Residual ResonanceReverification Test (Of A CMM )Reverse Engineering Roll Rotary Table Rotary Table Setup Sampling Strategy Scan Sequence Scanning Scanning Probe Scanning Probing Error Scanning Speed Sensitivity Coefficient Servo MotorSheet Metal Feature Measurement Size零件编程压电测头俯仰角摆预定路径扫描（测头）预行程测头测头校验测头座（测头）座测头的三角形效应探测误差探测系统探测系统的标定探测程序点可编程夹具齿轮齿条径向四轴误差探测轴范围（光栅）读数头标准数据标准付标准参数值标准参数化标准残差标准软件标准球反射式光栅可靠性重复性残差谐振（坐标测量机）的复检检测逆向工程自转转台转台设置采点策略扫描顺序扫描扫描测头扫描探测误差扫描速度敏感系数伺服电机薄壁件特征测量尺寸128Software Software InterfaceSpeed (Velocity )Forward Feedback Spur Gear Squareness Statistical Analysis Straightness Stylus Stylus Length Stylus SystemStylus System Components Stylus Tip Stylus Tip Offset Subdivided Switching Probe Synchro Trasmission Belt Tangential Four-Axis Error Target Contact Point Target Scan LineTemperature Compensation Test Parameter Values Test Parameterization Test Residual Test SphereThe American Society Of Mechanical Engineers (ASME )Thermal Conductivity Time For Scanning Test Tip Correction Vector Touch-Trigger Probe Tractability Transfer Shuttle Transmission Scale Uncertainty Vector Control Vibration Video ProbeVision Checking System Volumetric Performance Weight Counter Balance Workpiece Coordinate System Yaw Zerodu软件软件接口速度前馈正齿轮垂直度统计分析直线度探针探针长度探针系统探针系统元件探针针头探针针头偏置细分开关测头同步带切向四轴误差目标接触点目标扫描线温度补偿检测参数值检测参数化检测残差检测球美国机械工程师协会导热性扫描检测时间针头修正矢量接触式触发测头溯源性随行夹具透射光栅不确定度矢量（运动）控制振动光学测头（成像测头）视觉检测系统空间性能重锤平衡工件坐标系统方向角摆零膨胀系数材料129（测头）予行程（光栅）读数头（美国）国家标准及技术研究院（坐标测量机）的低点密度（坐标测量机）的复检检测（坐标测量机）的高点密度（坐标测量机）的中间检查A/D 转换器CNC 测量机L 型桥式坐标测量机阿贝误差百分表、千分表比较仪标准参数化标准参数值标准残差标准付标准球标准软件标准数据集薄壁件特征测量不均匀温度场不确定度采点策略残差测量空间测头测头的三角形效应测头校验测头座（测头）座产品几何量技术规范长度标准程序点尺寸尺寸尺寸测量用接口标准尺寸实物标准器齿轮齿条垂直度磁栅尺导热性笛卡尔直角坐标系动态作用对角线多测头系统Pretravel Read HeadNational Institute Of Standard And Technology (NIST )Low Point Density (Of A CMM )Reverification Test (Of A CMM )High Point Density (Of A CMM )Interim Check (Of A CMM )A/D Converter CNC CMML-Shaped Bridge CMM Abbe Error Dial Indicator ComparatorReference Parameterization Reference Parameter Value Reference Residual Reference Pair Reference Sphere Reference Software Reference Data SetSheet Metal Feature Measurement Non-Uniform Temperatures Uncertainty Sampling Strategy ResidualMeasuring Volume Probe Probe Lobbing Probe Calibration Probe HeadGPS (Geometrical Product Specifications )Length Standard Program Point Dimension SizeDimensional Measuring Interface Standard (DMIS )Material Standard Of Size Rack-And-Pinion Squareness Magnetic Scale Thermal Conductivity Cartesian System Dynamic Effect Diagonal Line Multi-Probe System130多级减速器多探针多探针反射式光栅返回距离范围方向方向角摆非接触式探测系统非预定路径扫描非直角坐标系俯仰角摆高斯辅助要素高斯径向距离工件坐标系统固定测头座固定多探针探测系统尺寸误差固定多探针探测系统位置误差固定多探针探测系统形状误差固定工作台水平悬臂坐标测量机固定工作台悬臂式坐标测量机固定桥式坐标测量机光学测头光学测头（成像测头）光学探测系统光栅尺，光学直尺滚珠丝杠国际标准组织过滤系统合格证明红外的机（自）动测头座机动测量机机器坐标系统激光干涉仪激光扫描测头计算机辅助精度优化计算机辅助设计检测参数化检测参数值检测残差检测球接触式触发测头接触式探测系统Multi-Stage Speed Reducer Multiple Styli Multiple Stylus Reflection Scale Back Off Distance Range Orientation YawNon-Contacting Probing System Not Pre-Defined Path Scanning Non-Cartesian System PitchGaussian Associated Feature Gaussian Radial Distance Workpiece Coordinate System Fixed HeadFixed Multiple-Stylus Probing System Size Error Fixed Multiple-Stylus Probing System Location Error Fixed Multiple-Stylus Probing System Form Error Fixed Table Horizontal-Arm CMM Fixed Table Cantilever CMM Fixed Bridge CMM Optical Probe Video ProbeOptical Probing System Optical Scale BallscrewInternational Organization For Standardization (ISO )Filtration System Certification Infrared Motorized Head Motorized CMMMachine Coordinate System Laser Interferometer Laser Scanning Probe Computer Aided Accuracy Computer-Aided Design (CAD )Test Parameterization Test Parameter Values Test Residual Test Sphere Touch-Trigger Probe Contacting Probing System131径向四轴误差开关测头可编程夹具可靠性空间性能空气轴承离散点探测离散点探测速度连续轨迹控制量块零件编程零件工夹具零件坐标系零膨胀系数材料龙门式坐标测量机美国机械工程师协会敏感系数摩擦杆摩擦杆传动目标接触点目标扫描线逆向工程漂移平衡机构平均失效时间平均修复时间气动平衡千分尺切向四轴误差热膨胀系数软件软件接口扫描扫描测头扫描检测时间扫描顺序扫描速度扫描探测误差湿度实际接触点实物标准器矢量（运动）控制视觉检测系统手动测量机手动测头座数据集的范围Radial Four Axis Error Switching Probe Programmable Fixture ReliabilityVolumetric Performance Air BearingDiscreted-Point Probing Discreted-Point Probing Speed Continuous Path Control Gauge Block Part Programming Part HandlingPart Coordinate System Zerodu Gantry CMMThe American Society Of Mechanical Engineers (ASME )Sensitivity Coefficient Friction BarFriction Driver (Capstan Or Traction )Target Contact Point Target Scan Line Reverse Engineering DriftCounter BalanceMean Time Between Failure (MTBF )Mean Time For Repair (MTFR )Air (Pneumatic )Counter Balance MicrometerTangential Four-Axis Error Coefficient Of Thermal Expansion Software Software Interface Scanning Scanning Probe Time For Scanning Test Scan Sequence Scanning Speed Scanning Probing Error HumidityActual Contact Point Material Standard Vector Control Vision Checking System Manual CMM Manual Head Extent (Of A Data Set )132水平悬臂移动式坐标测量机丝杠伺服电机速度前馈溯源性随行夹具探测探测误差探测系统探测系统的标定探测轴探针探针长度探针系统探针系统元件探针针头探针针头偏置同步带统计分析透射光栅脱机编程万向探测系统万向探测系统尺寸误差万向探测系统位置误差万向探测系统形状误差微型应变片位置位置精度温度补偿误差修正图细分斜齿轮谐振形状修正测量点修正扫描点修正扫描线压电测头压缩空气验收检测要素参数化移动工作台水平悬臂坐标测量机移动工作台悬臂式坐标测量机移动桥式坐标测量机有限元分析预定路径扫描元素构造Moving Ram Horizontal-Arm CMM Lead Screw Servo MotorSpeed (Velocity )Forward Feedback Tractability Transfer Shuttle Probing (to probe )Probing Error Probing SystemProbing System Qualification Ram Stylus Stylus Length Stylus SystemStylus System Components Stylus Tip Stylus Tip Offset Synchro Trasmission Belt Statistical Analysis Transmission Scale Off-Line Programming Articulated Probing SystemArticulated Probing System Size Error Articulated Probing System Location Error Articulated Probing System Form Error Micro-Strain Gage LocationLinear Displacement Accuracy Temperature Compensation Error Mapping Subdivided Helical Gear Resonance FormCorrected Measured Point Corrected Scan Point Corrected Scan Line Piezo Sensor Compressed AirAcceptance Test (Of A CMM )Parameterization Of A Feature Moving Table Horizontal-Arm CMM Moving Table Cantilever CMM Moving Bridge CMM Finite Element Analysis (FEA )Pre-Defined Path Scanning Feature Construction133找正、建坐标系针头修正矢量振动正齿轮直接CAD 编译器直接CAD 接口直线度指示测量点滞后，回程误差中间点中间检查重锤平衡重复性轴向四轴误差（转台）柱式坐标测量机转换规则转换检测参数转台转台设置自动更换装置自学习编程自转最大内切圆最大允许固定多探针探测系统尺寸误差最大允许固定多探针探测系统位置误差最大允许固定多探针探测系统形状误差最大允许径向四轴误差（转台）最大允许切向四轴误差（转台）最大允许扫描检测时间最大允许扫描探测误差最大允许探测误差最大允许万向探测系统尺寸误差最大允许万向探测系统位置误差最大允许万向探测系统形状误差最大允许轴向四轴误差（转台）最佳拟合最小二乘最小二乘辅助要素最小外接圆AlignmentTip Correction Vector Vibration Spur GearDirect CAD Translation (DCT )Direct CAD Interface (DCI )StraightnessIndicated Measured Point HysteresisIntermediate Point Interim TestingWeight Counter Balance RepeatabilityAxial Four-Axis Error Column CMM Conversion RuleConverted Test Parameter Values Rotary TableRotary Table Setup AutochangerLearn Programming RollMaximum Inscribed CircleMaximum Permissible Fixed Multiple-Stylus Probing System Size ErrorMaximum Permissible Fixed Multiple-Stylus Probing System Location ErrorMaximum Permissible Fixed Multiple-Stylus Probing System Form ErrorMaximum Permissible Radial Four Axis Error Maximum Permissible Tangential Four Axis Error Maximum Permissible Time For Scanning Test Maximum Permissible Scanning Probing Error Maximum Permissible Probing ErrorMaximum Permissible Articulated Probing System Size ErrorMaximum Permissible Articulated Probing System Location ErrorMaximum Permissible Articulated Probing System Form ErrorMaximum Permissible Axial Four Axis Error Best-Fit Process Least SquareLeast-Squares Associated Feature Minimum Circumscribed Circle134附录（二）：坐标测量技术中英名词对照表坐标测量坐标测量机坐标测量机尺寸测量的示值误差坐标测量机尺寸测量的最大允许示值误差Coordinate Measurement Coordinate Measuring Machine (CMM )Error Of Indication Of A CMM For Size Measurement Maximum Permissible Error Of Indication Of A CMMFor Size Measurement。

CMMI文件清单中英文对照表

里程碑评审规程
Milestone Review Procedure
软件开发计划变更规程
Software Development Plan Revise Procedure
对外承诺变更控制规程
External Commitment Change Procedure
MA
度量分析
测量与分析控制程序
Measurement & Analysis Process
项目需增加硬件、软件成本预算表
Budget Form For Hardware & Software Added
共利益者协调计划表
Stakeholder Negotiation Plan
资料管理计划表
Materials Management Plan
开发计划
Development Plan
项目培训计划
培训课程开发规程
Training Course Development Procedure
外购培训管理规程
Outsourcing Training Management Procedure
培训效果评估规定
Training Effectiveness Evaluation Procedure
培训效果跟踪表
Sub-Contract Configuration Management Procedure
子合同配置监督计划模版
Sub-Contract Configuration Monitoring Plan Template
子合同QA审核规程
Sub-Contract QA Audit Procedure
软件子承包商评定标准
Performance Appraisal Rules For EPG Member

CMMI术语中英文对照表

产品选择控制程序 COTS product selection process COTS软件产品评价准则 COTS product evaluation criteria COTS软件产品评价报告 COTS product evaluation report 供给商合作通知单 cooperation notification to supplier 第三方产品评估表 the 3rd party's product evaluation form 商业现货采购控制程序 COTS product procurement process 软件子合同管理控制程序 software sub-contract management process 子合同评审规程 sub-contract review procedure 子合同开发监管规程 sub-contract development monotoring procedure 子合同配置管理规程 sub-contract Configuration Management procedure 子合同配置监督计划模版 sub-contract configuration monitoring plan template 子合同QA审核规程 sub-contract QA audit procedure 软件子承包商评定标准 sub-contractor evaluation criteria 直真软件开发子合同模板(商务) contract template (business) for ZZ's software sub-contract 子合同开发过程监控报告 sub-contract development monotoring report 子合同开发过程监控计划 sub-contract development monotoring plan 子合同工作计划 sub-coptract working plan 产品（项目）子合同申请单 application form for product( project ) sub-contract 候选子承包商评估报告 candidate sub-contractor evaluation report 软件子合同评审记录 software sub-contract review record 项目策划控制程序 project planning process 规模估计规程 size estimation procedure 工作量估计规程 effort estimation procedure 编制进度规程 schdule generation procedure 项目策划计划 plan for project planning PDSP文档 PDSP document 项目环境列表 project's environment list 项目的任务WBS列表 project's task WBS list 产品规模估计表 product size estimation form 工作量估计表 effort estimation form 要害计算机资源表 CCR list 外来工作产品清单 out-sourcing work product list 主要工作产品清单 main work product list 交付工作产品清单 delivarable work product list 人力资源需求表 HR demands form 人力资源评估表 HR evaluation form 项目人员计划表 project's HR plan 项目预算工时表 project's budget/ effort form 项目需增加硬件、软件成本预算表 Budget form for hardware & software added 共利益者协调计划表 stakeholder negotiatioห้องสมุดไป่ตู้ plan 资料管理计划表 materials management plan 开发计划 development plan 项目培训计划 project training plan 项目进度表 project schedule 项目总体进度表 abstract project schedule 合同项目立项报告 initiating report for contract project 研发项目立项报告 initiating report for R&D project 项目跟踪监控程序 SPTO process 研发中央例会管理规定 Review meeting procedure for R&D center 研发项目组例会管理规定 Review meeting procedure for R&D project team 项目关闭控制程序 project closure process 里程碑评审规程 milestone review procedure 软件开发计划变更规程 Software development plan revise procedure 对外承诺变更控制规程 External commitment change procedure

CMMI中有关定义及英文缩写说明

CMMI中有关定义及英文缩写说明一、英文缩写说明l 能力成熟度模型集成CMMI:Capability Maturity Model Integrationl 通用目标GG：Generic Goalsl 特定目标SG：Specific Goalsl 通用实践GP：Generic Practicesl 特定实践SP：Specific Practicesl 过程域PArocess Areal 需求管理REQM: Requirement Managementl 项目策划PProject Planningl 项目监督和控制PMCroject Monitoring and Control Planningl 供方协定管理SAM:Supplier Agreement Managementl 测量和分析MA:Measurement and Analysisl 过程和产品质量保证PPQA:Process and Product Quality Assurancel 配置管理CM:Configuration Managementl 需求开发RD:Requirement Developmentl 技术解决TS:Technical Solutionl 产品集成PI:Product Integrationl 验证VER:Verificationl 确认VAL:Validationl 组织过程聚焦OPF:Organization Process Focusl 组织过程定义OPD:Organization Process Definitionl 组织培训OT:Organization Trainingl 集成项目管理IPM:Integration Project Managementl 风险管理RSKM:Risk Managementl 决策分析和决定DARecision Analysis and Resolutionl 质量保证QA:Quality Assurancel 项目经理PM：Project Managerl 软件工程过程组SEPG:Software engineering process groupl 过程改进指导描述PIID：Process Improvement Indicator Descriptionl SCAMPI：Appraisal Method for Process Improvement （CMMI中评估过程改进的一种方法）二、定义l 共利益者（Stakeholder）：所谓“共利益者”，指的是受到某种负责产生输出的方式影响的群体或个人。

CMM CMMI术语缩写一览表

术语一览表（按字母排序）AB= Ability to perform (CMM KPA comon feature) AC=Activities to perform (CMM KPA comon featureAD/Software Group=Application DevelopmentAE=Adaptive Enterprise (HP) RTI AI=Assessment InstrumentAPW=Action Planning WorkshopARC=Appraisal Requirements for CMMIATQG=Aassessor Training and Qualifications Guide (ISO SPICE) ATW=Actiion Team WorkshopsBAM=Business Activity MonitoringBI=Business IntelligenceBpel=Business Process Execution LanguageBPFBPG=Baseline Practice Guide (ISO SPICE)BPM=Business Process ManagementBPM=Busiiness Process MaturityBPMM=Business Process Maturity ModeBPO=Business Process OutsourcingBPR=Business Process RedesignBSI=British Standards Institute (standard BS 15000) CAPM=Certified Associate in Project ManagementCAR=Causal Analysis and Resolution (CMMI process area)CBA=CMM-Based AssessmentCBA IPI=CMM-Based Assessment for Internal Process ImprovementCBP=Competency Based PracticesCCB=Configuration Control BoardC-CommerceCDG=Capability Determination Guide (ISO SPICE)CEP=Complex Event ProcessingCEU=Continuing Education UnitsCII=Confederation of Indian IndustriesCM=Configuration ManagementCMM=Capability Maturity Model (also referred to as SWCMM). A model for improving the capability of software organizations.CMMI=Capability Maturity Model-Integration (published by the Software engineering Institute at Carnegie Mellon University in Pittsburgh) /sei-home.html(integrates 3 source models the SW CMM, SE CMM and the IPD-CMM)CMU=Carnegie Mellon UniversityCO=Committement to perform (CMM KPA common feature)COBit=Control Objectives for Information and Related TechnologyCOCOMO II=COnstructive COst MOdel II is a model that allows one to estimate the cost, effort, and schedule when planning a new software development activity.CO=Commitment to PerformCOTS=Commercial off-the-shelfCPM=Corporate Permormance MonitoringCRADA=Cooperarive Research and Development AgreementCRD=Career Recommendations DevelopmentCRM=Customer Relationship ManagementDAR=Decision Analysis and Resolution (CMMI process area)DBA=Database AdministratorDELLTA=Danish Electronics Light & AcousticsDI=Directing ImplementationDoD=Department of DefenseDP=Defect Prevention (CMM Process area)DTIZC=Defense Technical Information CenterEAI=Enterprise Application IntegrationEDA=Event Driven ArchitectureEIA=Electronic Industries AllianceEIT=Enterprise Information IntegrationELG=Executive Leadership GroupEPG=Engineering Process GroupEPIG=Engineering Process Improvement GroupERP=Enterprise Resource PlanningESB=Enterprise Service BusesESP=External Service ProvidersETL=Extraction Transformation LoadingETVX format=Enty criteria, Tasks, Verification, and eXit criteria (CMMI) FAR=Functional Area Representative (term used in some assessments) FP=Function PointFTE=Full-time Equivalent (measure of personnel availability)GAO=General Accounting OfficeGESP=Global External Service ProvidersGG=Generic GoalGP=Generic PracticeG-Q-M Approach=Goal Queston Metric techniqueIC=Intergroup Coordination (CMM process Area)IDEAL=Initiating-Diagnosing-Establishing-Acting-Leveraging; an improvement cycle often used for process improvementIEC=International Electrotechnical CommissionIEEE=Institute of Electrical and Electronics Engineers.. A professional organizationIESP=Indian External Service ProvidersIG=Introductory Guide (ISO SPICE)IM=Integrated Management (CMM process area)IPD-CMM=Integrated Product Development Capability Maturity ModelIPM=Integrated Project Management (CMM process area)IPPD=Integrated Product and Process DevelopmentIPI=Internal Process ImprovementIPT=Integrated Product TeamISACA=Information Systems Audit and Control Association ISM=Integrated Software Management (CMM process area)ISM=Integrated Supplier Management (CMMI process area)ISO=International Organization fro Standardization (International Standards Organization)IT=Integrated Teaming (CMM process area)ITIL=Information Technology Infrastructure LibraryJAD=Joint application designJIT=Just in TimeJTCI=Joint Technical Committee on Information Technology KGI=Key Goal IndicatorsKIPA=Korean IT Industry Promotion IndustryKP=Key practiceKPI's=Key Performance IndicatorKPA=Key Process AreaKSLOC=thousand source lines of codeMA (M&A)=Measurement and Analysis (CMM process area) MBNQA=Malcom Bridge National Quality AwardMDD=Method Description DocumentME=Measurement and Analysis (CMM KPA common feature) MOA=Memorandum of AgreementMOM=Message Orientated MiddlewareMQ=Maturity QuestionnaireMSG=Management Steering GroupMSMO=Microsoft Message Queue ServerMTBF-Mean Time Between FailuresOEI=Organizational Environment for Integration (CMMI process area)OID=Organizational Innovation and Deployment (CMMI process area)OO=Object OrientatedOOA&D=Object Orientated Analysis & DesignOoda=Observe-Orient-Decide-ActOPD=Organization Process Definition (CMM process area Level 3 KPA)OPF=Organizational Process Focus (CMM process area Level 3 KPA)OPF=Organizational Process Focus (CMMI process area)OPM3=Organizational Project Management Model (Published by PMI in January, 2004)OPP=Organizational Process Performance (OPF=Organizational Process Focus (CMMI process area)OSSP=Organization's Set of Standart PracticesOT=Organizational Training OPF=Organizational Process Focus (CMMI process area)OUSD/AT&L=Office of the Under Secretary of Defense, Acquisition , Technology and LogisticsPA=Process AreaPAIS=Process Appraisal Information Systems (Record of Entry Form for CBA IPIs) PAG=Process Assessment Guiide (ISO SPICE)PAT=Process Action TeamPC=Process Change (Management (CMM Level 5 KPA)PCA's=Pacaged Composite ApplicationsPCAR=People CMM Assessment Repository (Record of Entry Form for a PCMM Assessment)PCB's=Process Capability Baselines-a documented characterization of the range of expected resultsPCM=Process Change Management (CMM Level 5 KPA)PCMM=People Capability Maturity Model (CMM Level 3 KPA)PD=(Organization) Process DefinitionPDCA=Plan-Do-Check-Act; an improvement cycle often used for process improvementPDU=Professional Development UnitPE=(Software) Project Engineering (CMM Level 3 KPA)PF=(Organization) Process Focus (CMM Level 3 KPA)PI=Product IntegrationPII=Process Improvement IndicatorPII=Practice Implementation IndicatorsPIID=Practice Implementation Indicator Data (used for SCAMPI)PIG=Process Improvement Guide (ISO SPICE)PIP=Packaged Integration ProcessesPM=Project ManagementPMAT=appears in COCOMO II model shows the benefit of process maturity on and estimate of effort for a software project. CMM Level 2 to Level 3 noted improvements. 4-11%PMBoK=Product Management Body of KnowledgePMC=Project Monitoring and Control (CMMI process area)PMC=Process Management CapabilityPMI=Project Management InstitutePMM=People Maturity ModelPMM=Process Maturity ModelPMP=Project Management ProfessionalPMO=Project Management OfficePP=(Software) Project Planning (CMM Level 2 KPA)PP=Project PlanningPI=Product Integration (CMMI process area)PPBs=Process Performance Baselines-a documented characterization of the actual results achieved by following a process.PPM=Process Performance Model (CMMI)PPQA=Process and Product Quality Assurance (CMMI process area) PSM= Practical Software and Systems ManagementPSM= Practical Software and Systems Measurement () PSP/TSP=Personal Software Process/Team Software ProcessPT=(Software) Project Tracking (and Oversight) (CMM Level 2 KPA) PTO=Project Tracking and Oversight (CMM Level 2 KPA)QA=(Software) Quiality Assurance (CMM Level 2 KPA)QFD=Quality Function DeploymentQM=(Software) Quality Management (CMM Level 4 KPA)OO=Object OrientatedOoa&D=Object Orientation Analysis and DesignQP=Software Quality Process (Management (CMM Level 4 KPA)OPD=Organizational Process DefiinitionQPM=Quantitative Process Management (CMM process area)QPM=Quantitative Project Management (CMMI process area)RAI=Research Access Inc.RD=Requirements Development (CMMI process area)RE=Requirements EngineeringREQM=Requirements Management (CMMI process area)RM=Requirements Management (CMM Level 2 KPA)RM=Risk ManagmentROI=Return On InvestmentRPG=Report Program GeneratorRSKM=Risk Management (CMMI process area)RTE=Real Tme EnterpriseRTI=Real Time InfrastructureRTM=Requirements Traceability MatrixSA-CMM=Software Acquisition Capability Maturity ModelSAM=Supplier Agreement Management (CMMI process area)Software Acquisition Management (CMM process area)SAP=Over the course of three decades, SAP has evolved from a small, regional enterprise into a world-class international company. Today, SAP is the global market leader incollaborative, inter-enterprise business solutions. The company now employs over 28,900 peopleSC7=Subcommittee 7 (ISO JTC1 subcommittee on software engineering)SCAMPI=Standard CMMI Appraisal Method for Process ImprovementSCCB=Software Configuration Control BoardSCE=Software Capability EvaluationsSCM=Software Configuration Management (CMM Level 2 KPA) SDD=Software Design DocumentSDF=Software Development FileSDLC=Software Development Life CycleSDP=Software Development Plan (also known as Project Plan) SE CAMM=Software Engineering Capability Assessment Model SECM=Software Engineering Capability ModelSE CMM=Software Engineering Capability Maturity ModelSEI=Software Engineering Institute (at Carnegie Mellon University) SEPG=Software Engineering Process GroupSEPI=Systems Engineering Process InitiativeSERP=Software Engineering Process GroupSG=Specific GoalSLA=Service Level AgreementSLOC=Source Line of CodeSM=Senior ManagementSM=(Software) Subcontract Management (CMM Level 2 KPA)SME=Subject Matter ExpertSOA=Service Orientated ArchitectureSOAP=Simple Object Access ProtocolSOW=Statement of WorkSP=Specific PracticeSPA=Software Process Assessment (SEI project; now CMM-based appraisals) software process assessment (method)SPC=Statistical Process ControlSPC=Software Product ConsortiumSPE=Software Product Engineering (CMM Level 3 KPA)SPI=Software Process ImprovementSPICE=Software Process Improvement and Capability DeterminationSPIN=Software Proess Improvement NetworkSPM=Software Process Mearurement (SEI project)SPP=Software Process Program; Software Project Planning (CMM Level 2 KPA)SPPT=Software Project Tracking and Oversight (CMM process area)SPTO=Software Project Tracking and OversightSQA=Software Quality Assurance (CMM Level 2 KPA)SQM=Software Quality Management (CMM Level 4 KPA)SRS=Software Requirements Specification (also known as Requirements Document)SS=Supplier SourcingSSM=Software Subcontract Management (CMM Level 2 KPA)STP=Straight Through ProcessingSW-CMM=Software Capability Maturity ModelTC176=Technical Committee 176 (ISO technical committee on quality managemetn systems)TCM=Technology Change ManagementTCO=Total Cost of OwnershipTM=Technology (Change) Management (CMM Level 5 KPA)TP=Training Program (CMM Level 3 KPA)TQM=Total Quality Management TQM can be defined as the application of quantitative methods and human resources to improve the materials and services provided as inputs to an organization an to improve all of the processes within the organization. The goal of TQM is to meet the needs of the customer, now and in the future.TS=Technical SolutionTTM=Time to MarketTTT=Train the TrainerTVO=Total Value of OpportunityUAN=Universal Application NetworkUAT=user Acceptance TestUDDI=Universal Desciption, Discovery and IntegrationVAL=Validation (CMMI process area)VB=Visual BasicVE=Verifying implementation (CMM KPA common feature)VER=Verification (CMMI process area)WBS=Work Breakdown StructureWG10=Working Group 10 (ISO/IEC JTC1/SC7 Working Group on software process assessment)WG7=Working Group 7 (ISO/IEC JTC1/SC7 Working Group on software life cycle processes)WiMAX=Worldwide Interoperability for Microwave Access. 802.11. 70MB Wireless connectivity over 30 milesWP=Workforce PlanningWS=Web ServicesWSDL=Web Services Descriptive LanguageXML=Extensible Markup LanguagexMM=Maturity Models for different business models (SW, I, P)XSL=Extensible Stylesheet LanguageZLE=Zero Latency Enterprise。

CMMI1.3《需求开发》翻译

CMMI1.3《需求开发》翻译REQUIREMENTS DEVELOPMENT需求开发目次Purpose目的 (1)Introductory Notes简介 (1)Related Process Areas相关过程域 (5)Specific Goal and Practice Summary特定目标和实践摘要 (6) Specific Practices by Goal各特定目标的特定实践 (6)SG1Develop Customer Requirements开发客户需求 (6)SP1.1Elicit Needs引出需要 (7)SP1.2Transform Stakeholder Needs into Customer Requirements将相关干系人的需要转化为客户需求 (9)SG2Develop Product Requirements开发产品需求 (10)SP2.1Establish Product and Product Component Requirements建立产品或产品组件需求 (11)SP2.2Allocate Product Component Requirements分配产品组件需求 (13)SP2.3Identify Interface Requirements识别接口需求 (15)SG3Analyze and Validate Requirements分析并确认需求 (16) SP3.1Establish Operational Concepts and Scenarios建立操作概念和场景 (17)SP3.2Establish a Definition of Required Functionality and Quality Attributes建立必要的功能和质量特性定义 (19)SP3.3Analyze Requirements分析需求 (20)SP3.4Analyze Requirements to Achieve Balance分析需求以取得平衡 (22)SP3.5Validate Requirements确认需求 (23)iREQUIREMENTS DEVELOPMENT需求开发An Engineering Process Area at Maturity Level3成熟度3级的工程类过程域Purpose目的The purpose of Requirements Development(RD)is to elicit,analyze,and establish customer, product,and product component requirements.需求开发（RD）的目的是引出、分析并建立顾客、产品及产品组件的需求。

CMMI中英对照

简写 OPD OPF OT PP PMC SAM IPM
中文组织级过程定义组织级过程焦点组织培训管理项目计划
描述建立和维护有用的组织过程资产在理解现有过程强项和弱项的基础上计划和实施组织过程改善增加开发人员的技能和知识，使他们能有效地执行他们的任务保证在正确的时间有正确的资源可用。为每个人员分配任务。协调人员。根据实际情况，调整项目通过项目的跟踪与监控活动，及时反映项目的进度、费用、风险、规模、关键计算机资源及工作量等情况，通过对跟踪结果的分析，依据跟踪与监控策略采取有效的行动，使项目组能在既定的时间、费用、质量要求等情况下完成项目旨在对以正式协定的形式从项目之外的供方采办的产品和服务实施管理根据从组织标准过程剪裁而来的集成的、定义的过程对项目和利益相关者的介入进行管理识别潜在的问题，以便策划应对风险的活动和必要时在整个项目生存周期中实施这些活动，缓解不利的影响，实现目标需求管理的目的是在客户和软件项目之间就需要满足的需求建立和维护一致的约定需求开发的目的在于定义系统的边界和功能、非功能需求，以便涉众（客户、最终用户）和项目组对所开发的内容达成一致在开发、设计和实现满足需求的解决方案。解决方案的设计和实现等都围绕产品、产品组件和与过程有关的产品从产品组件组装产品，确保集成产品功能正确并交付产品验证确保选定的工作产品满足需求规格确认证明产品或产品部件在实际应用下满足应用要求建立和维护在项目的整个软件生存周期中软件项目产品的完整性为项目组和管理层提供项目过程和相关工作产品的客观信息开发和维持度量的能力，以便支持对管理信息的需要，作为改进、了解、控制决策应用正式的评估过程依据指标评估候选方案，在此基础上进行决策
序号
分组过程 1 Organizational Process Definition 过程 2 Organizational Process Focus 管理 3 Organizational Training 4 5 6 7 8 9 项目管理 Project Plan Project Monitoring and Control Supplier Agreement Management Integrated Project Management Risk Management Requirements Management Requirement Development

CMMI (中文翻译)度量与分析

度量与分析( P178-P197 )目的度量与分析（MA）的目的是开发并保持度量能力，用于支持管理信息的需要。

介绍度量与分析过程域包括：l 明确度量的目标，并与已识别的信息需求保持一致l 确定所需的度量、数据收集和存储机制、分析技术、报告和反馈机制l 收集、存储、分析并报告所收集的数据l 提供能用于决策并采取所需纠正措施的分析结果度量和分析在项目层面的应用：l 客观地制订计划和进行估算l 根据所确定计划的目标来进行项目跟踪l 识别并解决与过程有关的事项l 为将来在其它项目过程中应用度量提供基础需要执行一个度量能力的人可以是也可以不是一个组织范围内的计划所雇用的人员，度量能力可能会应用于单独的项目或者其他组织功能（例如，质量保证）。

度量活动最初是关注在项目级别上的，然而一个度量能力也可以证明对选择组织和/或者企业内部信息需要是有帮助的。

项目可能选择在一个项目特定的知识库保存项目特定的数据和结果。

当数据被更广泛地在项目间共享时，则需要放在组织的度量知识库中。

对于供应商原始资料供应商提供的产品组件的度量和分析是对项目质量和成本有效管理的基本要素。

很可能，对供应商合同的细致管理就提供了对供应商供应能力分析数据的洞察。

相关过程域有关估计项目属性和其他计划信息需要的更多信息请参见项目计划过程域。

有关监督项目执行信息需要的更多信息请参见项目监督和控制过程域。

有关管理度量工作产品的更多信息请参见配置管理过程域。

有关汇集客户需求和相关信息需要的更多信息请参见需求制定过程域。

有关维持需求可追溯性和相关信息需要的更多信息请参见需求管理过程域。

有关制定组织的度量知识库的更多信息请参见组织过程定义过程域。

有关理解变更和静态分析技术的适当使用的更多信息请参见量化项目管理过程域。

实践－目标关系表连续式分级式SG1安排度量与分析活动SG1安排度量与分析活动SP1.1-1建立度量对象SP1.2-1详细描述度量SP1.3-1详细描述数据收集和存储程序SP1.4-1详细描述分析过程SG2提供度量结果SP2.1-1收集度量数据SP2.2-1分析度量数据SP2.3-1存储（度量）数据和结果SP2.4-1沟通（度量）结果GG1 达到特定目标GP1.1 完成基础实践GG2 制度化一个已管理的过程GP2.1建立组织的方针GP2.2 计划过程GP2.3 提供资源GP2.4 分配职责GP2.5 培训人员GP2.6 管理配置GP2.7 识别和包括相关的干系人GP2.8 监督和控制这个过程GP2.9 客观的评价坚持状况GP2.10 以更高等级的管理回顾状态GG3 制度化已定义的过程GP3.1 建立一个已定义的过程C/ML3-5GP3.2 收集改进信息GG4 制度化一个已量化管理的过程GP4.1 建立过程的量化目标GP4.2 稳定子过程的执行GG5 制度化一个优化中的过程GP5.1 保证连续的过程改进GP5.2 改正问题的根源实现目标的关键实践SG1安排度量与分析活动根据（度量）目标和已确定的信息需要，安排度量对象和活动。

中英文单词对照表

一、品质专业词汇Quality Professional GlossaryQC Quality Control (品质管控)IQC Incoming Quality Control (进料品质管控)IPQC In process Quality Control (制程品质管控)FQC Final Quality Control (终点品质管控)OQC Output Quality Control (最终出货品质管控)QA Quality Assurance (质量保证)TQC Total Quality Control (全面质量管理)FAA First Article Assurance (首件确认)POC Passage Quality Control (段检)OQA Output Quality Assurance (出货质量保证)QE Quality engineering (品质工程)QI Quality Improvement （品质改善）ACC Accept (允收) REE Reject (拒收)AOD Accept On Deviation （特采）CR Critical (极严重的)MAJ Major （主要的）MIN Minor （轻微的）AQL Acceptable Quality Level (品质允收水准)S/S Sample size （抽样检验样本大小）CAR Corrective Action Request (矫正措施要求)C/R Corrective Action （矫正措施）ECN Engineering Change Notes (工程变更通知)(供应商)ECO Engineering Change Order (工程改动要求)(客户)PCN Process Change Notice (工序改动通知)PMP Product Management Plan (生产管制计划)SIP Specification In Process (制程检验规格)SOP Standard Operation Procedure (制造作业规范)IS Inspection Specification (成品检验规范)BOM Bill Of Material (物料清单)PS Package Specification （包装规范）SPEC Specification （规格）CCC China Compulsory Certificate（中国强制认证）QCC Quality Control Circle （品管圈）QIT Quality Improvement Team （品质改善小组）QP Quality Policy （质量方针）QT Quality Target （质量目标）OK OK (好，合格)NG Not Good (不行，不合格)Lot (批) Lot Size (批量)Sample(样本) Sampling(抽样)Defect （缺陷）Inspection(检验)PDCA Plan Do Check Action (计划执行检查总结)5W1H When Where Who What Why How （何时何地何人何事为何怎么做）4M1E Man Machine Material Method Environment (人机器物料方法环境)二、产品词汇Production GlossaryUPS Uninterruptible Power Supply （不间断电源）EPS Emergency Power supply （应急电源）Low Frequency Online UPS (低频在线UPS\工频在线UPS)High Frequency Online UPS (高频在线UPS)On-line UPS (在线UPS)Off ine UPS(离线UPS)Back-up UPS (后备UPS)Line Interactive UPS (在线互动UPS)Electric Power UPS(电力UPS)Home UPS(家用UPS)Inverter (逆变器)Frequency Converter(变频器)AC Stabilized Power Supply (交流稳压电源)DC Power Supply (直流电源)三、电气专用词汇Electric Professional GlossaryInput Voltage (输入电压) Output Voltage (输出电压) Rated Voltage (额定电压) Input Current (输入电流) Output Current (输出电流) Rated Current (额定电流) Input Frequency (输入频率) Output Frequency (输出频率) Rated Frequency (额定功率) Input Power (输入功率) Output Power (输出功率) Rated Power (额定功率) Manual Bypass (手动旁路) Maintenance Bypass (维修旁路)Transform Time (转换时间) Waveform Distortion (波形失真)Phase (相数) Phase Sequence (相序)Single Phase (单相) Three Phase (三相)Efficiency (效率) Load (负载)Temperature (温度) Humidity (湿度)Normal (正常) Abnormal (不正常)Waveform (波形) Sine Wave (正弦波)Square Waveform (方波) Modified Sine Wave (修正正弦波)MIN Minimum （最小值）MAX Maximum (最大值)MIN Power (最小功率) MAX Power (最大功率)Protection (保护) Fault/Failure (故障)Reset (复位) Test (测试)Startup (启动) Shutdown (关闭)Alarm (报警) Silence (静音)Overload Protection (过载保护)Short Circuit Protection (短路保护)Over Temperature Protection (过温保护)Battery Low Voltage Protection (电池低压保护)Rated Battery Voltage (额定电池电压)Charge Voltage (充电电压)Float Voltage (浮充电压)Cycle Voltage (均充电压)Charge Current (充电电流)Isolation Resistance (绝缘电阻)Isolation Intensity (绝缘强度)Grounding Resistance (接地电阻)Leakage current to ground (对地泄漏电流)PF Power Factor (功率因数)CF Crest Factor (峰值因数)AVR Automatic Voltage regulate (自动稳压)EPO Emergency Process Operation (紧急操作程序)REC Rectifier (整流器) BYP Bypass (旁路) BAT Battery (电池)L line (火线) N neutral (零线/中线) G Ground (地 )SNMP Simple Network Management Protocol (简单网络管理协议)USB Universal Serial Bus (通用串行总线架构)SMT surface mount technology (贴片技术)AI Auto-Insertion (自动插件)四、产品包装箱和丝印词汇 Production Packaging-Box And Silk-Screen Glossary Model （型号） Specification (规格)Series (系列)Dimension (尺寸)Quantity (数量) Capacity (容量)Weight (重量) Shipping Weight (运输重量)Net Weight (净重) Gross Weight (毛重)L Length (长度) W Width (宽度)H High (高度) D Depth (深度)Color<英> Colour<美> (颜色)Grey (灰色) Red (红色)Black (黑色) White (白色)Yellow (黄色) Silver (银色)Blue (蓝色) Green (绿色)S/N Serial Number (序列号)TEL Telephone (电话)Modem (调制解调器) FAX (传真)Caution/Warning (警告) Notice (注意)Port (端口) Slot (槽)Parallel Port (并机端口)Communication Port (通讯端口)Intelligent Port (智能端口)Single Mode (单机模式)Parallel Mode （并机模式）五、电子物料词汇 Electron Materiel GlossaryTransformer (变压器) Relay (继电器)Transistor (晶体管) Resistance (电阻)Capacitance (电容) Inductance (电感)Diode (二极管) Audion (三极管)Fuse (保险丝) Buzzer （蜂鸣器）Socket (插座) Plug (插头)Filter (滤波器) Fan (风扇)Circuit Breaker (断路器)Crystal Oscillator (晶振)Touch Screen (触摸屏)LCD Liquid crystal Display (液晶显示屏)LED Light-emitting Diode （发光二极管）MOSFET Metallic Oxide Semiconductor Field Effect Transistor（金属氧化物半导体场效应晶体管）IGBT Isolated Gate Bipolar Transistor (绝缘双极性晶体管)SCR Silicon Control Rectifier (可控硅)STS Static Transform Switch (静态转换开关)六、其他语言词汇 Other Language Glossary中文英文法文德文西班牙文灰色 gray gris grau gris白色white blanc weiß blanco红色 red rouge rot rojo蓝色 blue bleu blau azul绿色green vert grün verde黑色 black noir Schwarz negro橙色 orange orange orange naranja黄色yellow jaune gelb amarillo。

品质管理中英文对照表

品质管理中英文对照表品质管理(be) qualfied, up to grade 合格3B 模具正式投産前確認5M Man/Machine/Material/Method/Measurement 人力/ 機器/ 材料/ 方法/ 量測5S整理/ 整頓/ 清掃/ 清潔/ 教養5WIH When/Where/Who/What/Why/How to 何時/ 何地/ 誰/ 何事/ 為什麼/ 怎麼做7QCT ools7 Quality Controls Tools 品管七大手法8 disciplines 8項回復內容abnormal handling 異常處理ACC Accept 允收acceptance = receive 驗收ADM Absolute Dimension Measurement全尺寸測量AIR Artical Inspection reportAOD Accept On Deviation 特采AOQ Average Output Quality平均出廠品質AOQL Average Output Quality Level 平均出廠品質水準APP Approve 核准,認可,承認AQL Acceptable Quality Level 允收品質水準AR Averary Range全距平均值Bending 軟體導入C=0 Critical=0 極嚴重不允許CARCorrective action request 改正行動要求改正報告CPcapability index製造能力指數CPK模具制程能力參數capability index of processCR Critical 極嚴重的defective product/non-good parts 不良品defective products不良品DFR Defect Failure RateNG Not Good 不良,不合格No.Number 數(號)OOBA開箱檢查out of box auditOQA出貨品質保證output quality assuranceOQC最終出貨品管output quality controlORT On going Reliability QualitP/O Waive Purchase Order WaivePacking 包裝PDCA Plan/ Do /Check /Action 計劃/ 執行/ 檢查/ 總結POC段檢人員passage quality controlPPM Parts Per Million 百萬分之一Product Control ListQ/R/S Quality/Reliability/Service 品質/可靠度/服務QA質量保證quality assuranceQAN Quality Ameliorate Notice 品質改善活動QC品管quality controlQC Quality Control 品管QC Quality System 品質系統QC Section品管科QCC Quality Control Circle 品質圈QE品質工程quality engineeringQFD品質機能展開quality function deploymentQI Quality Improvement 品質改善QIT Quality Improvement Team品質改善小組QP Quality Policy 目標方針QT Quality Target 品質目標quality 品質R Range 全距REE Reject 拒收RMA Return Material Audit 退料認可RQT Reliability Quality TestS I-S IV Special I-Special IV 特殊抽樣水準等級S/S Sample size 抽樣檢驗樣本大小SPC Statistical Process Control 統計制程管制SQC Statistical Quality Control 統計品質管制SSQA合格供應商品質評估standardized supplier qualityTQC全面品質管理total quality controlTQM T otal Quality Management全面品質管理UAI Use As It 特采UCL Upper Central Limit 管制上限ZD Zero Defect 零缺點ZD Zero Defect 零缺點Down Load Box轉接盒FA最終稽核final auditFAA首件確認first article assuranceFAI首件檢查first article inspectionFC Function checkFMEA失效模式分析failure model effectiveness analysisFPIR First Piece Inspection Report首件檢查報告FQC最終品管final quality controlFREQ Frequency 頻率good product , accepted goods, accepted parts, good parts 良品GRR Gauge Reproducibility & Repeatability 量具之再制性及重測性判斷量可靠與否IPQC制程中品管in process quality controlIQC進料品質管制incoming quality controlJapanese Industrial Standard 日本工業規格(JIS) LCL Lower Central Limit 管制下限LQL Limiting Quality Level 最低品質水準LRR Lot Reject Rate 批退率MAJ Major 主要的MAX Maximum 最大值odd item offeroffer sheetopen accountorderover lookedpackingpamphletpartial shipmentpatentpaying pricepayment methodport of destinationport of trans-shipment priceprice descendingprice rising procurementprompt delivery purchasepurchasing agent quotationrebatereferenceremittancerepeat orderrequest letterRFQ Request For Quotation rumorsample ordersecond hand goods shipmentshippershippingshipping marksold outspecial discount 特別折扣specification 規格standing 信用情形storage charge 倉租subcontract 外包subject to final confirmation 有待確認之報價supplier 供應商T/T 電匯tie-in sale 搭售trade fair 商展會transferred 已轉運trans-shipment 轉運wharf 碼頭PD Product Department生産部PDA Personal Digital Assistant 個人數位助理PE ProductEngineering 産品工程部performance 動作性能physical count quantity 帳面數量physical inventory 盤點數量PM Post Meridian 下午PMC Production & Material Control 生産和物料控制PMP Product Management Plan 生産管制計劃PPC Production Plan Control 生産計劃控制pre-fixed finishing date 預定完成日prepared by 製表present members 出席人員production control confirmation 生産確認production tempo 生産進度現狀PS Package Specification 包裝規範Q’TY Quantity 數量quantity of customs count 會計師盤,點數量quantity of physical invetory second count 複盤點數量R&D Research & Design 設計開發部REF Reference 僅供參考remark 備註responsible department 負責單位REV RevisionRFI Read Frequency InputS/T Standard TimesampleSECC SECC`second checksecond countsemi-finished productSGCC SGCCSIMM Single in-line memory moduleSIP Specification In ProcessSOP Standard Operation Procedurespare parts physical inventory listspare parts=bufferSPEC SpecificationSPS Switching power supplySQA Strategy Quality AssuranceSSQA Sales and service Quality Assurancestock age analysis sheetsubjectsummary of year-end physical inventory billsT/P True PositionTBD To Be Discussthe first pageThis sheet and physical inventory list will be sent to accountingdepartment and financial department)to put file in order 整理資料total 合計TPM Total Production Maintenance 全面生産保養TYP Type 類型上一页下一页。