pcb行业et名词解释

pcb行业et名词解释
1. PCB (Printed Circuit Board):
A PC
B is a flat board made of non-conductive material, usually fiberglass, on which electronic components are mounted and interconnected. It provides mechanical support to the components and also serves as a pathway for electrical current to flow between different components.
2. ET (Electric Testing):
ET refers to the testing process conducted on PCBs to ensure that the electrical connections are correct and the board is functioning properly. It involves the use of specialized equipment to apply electrical signals to the PCB and measure the corresponding responses.
3. FR4:
FR4 is the most common type of material used for PCB fabrication. It is a flame retardant epoxy resin reinforced by woven fiberglass cloth. FR4 offers good mechanical strength, fire resistance, and electrical insulation properties, making it ideal for various PCB applications.
4. DFM (Design for Manufacturability):
DFM is a design approach that focuses on designing PCBs in a way that maximizes their manufacturability and efficiency. It considers factors such as component placement, routing, and layer stackup to ensure that the design can be efficiently translated into a physical PCB.
5. DFT (Design for Testability):
DFT refers to the design practices employed to enhance the testability of a PCB. It involves incorporating features such as test points, access probes, and boundary scan cells to facilitate the testing process and improve fault coverage during the ET phase. 6. SMT (Surface Mount Technology):
SMT is a method of electronic component mounting where the components are directly soldered onto the surface of the PCB. It eliminates the need for through-hole components, reducing the size and weight of the PCB and enabling high-density designs.
7. Through-Hole Technology:
Through-Hole Technology, or TH technology, is the traditional method of component mounting where the components have leads that are inserted into drilled holes on the PCB and then soldered. TH technology provides robust mechanical connections but limits the density of the PCB.
8. Pad:
A pad is a small conducting area on the PC
B where an electronic component is soldered. It provides electrical connectivity between the component and the PCB traces.
9. Trace:
A trace is a conductive path on the PC
B that connects various components and their corresponding pads. It allows the flow of electrical current between different parts of the circuit.
10. Via:
A via is a conductive hole on the PC
B that connects different
layers of the board. It allows electrical signals to pass through and facilitates the routing of traces between layers.
11. Gerber Files:
Gerber files are the standard format used to describe PCB designs to PCB manufacturers. They contain information about the PCB layers, component placement, traces, pads, and other design details needed for manufacturing.
12. IPC (Institute for Printed Circuits):
IPC is an international trade association representing the PCB and electronics assembly industries. It develops and publishes industry standards and specifications related to PCB design, manufacturing, and assembly.
13. NPTH (Non-Plated Through-Hole):
NPTH refers to the holes on the PCB that are not plated. These holes are used for mechanical fastening, such as mounting the board to the chassis, and do not require electrical connectivity. 14. BGA (Ball Grid Array):
BGA is a type of surface mount packaging used for integrated circuits. Instead of leads, the IC is mounted onto the PCB using an array of tiny solder balls, which provide electrical connections between the IC and the PCB.
15. Megatron:
Megatron is a type of automatic optical inspection (AOI) system used in PCB manufacturing. It uses high-resolution cameras to
scan the PCB for defects and compares the scans to a reference image to identify any discrepancies.。