电感物理特性试验测试方法

RELIABILITY TEST CONDITIONS
FOR SMT/SMD and other similar types
Item (
項目)
Required Characteristics (要求)
Test Method / Condition (測試方法)
Solderability test
Terminals must have 95% minimum solder coverage
1.Dip the terminals in the flux then in the solder pot at 245±5℃ for 5seconds.
Reference documents:
MIL-STD-202G Method 208H IPC J-STD-002D 2.Solder: lead free 3.Flux: rosin flux
可焊性測試
端子必須有95%以上著錫
1.端子浸入助焊劑, 然後浸入245±5℃錫爐中5秒
2.焊料 :無鉛焊料
3.助焊劑: 松香助焊劑
Heat endurance of Reflow soldering
1.No significant defects in appearance.
2. L/L ≦10%
3. Q/Q ≦30% （SMD series only ）
4. DCR/DCR ≦10%
1.Refer to the above reflow curve and go through the reflow for twice.
2.The peak temperature : 260+0/-5℃
3.The reflow test conditions are based on the testing instruments available in
Reference documents:
MIL-STD-202G Method 210F
耐焊錫熱測試
1.無明顯的外觀缺陷
2.感值變化不超過10%
3.品質因數變化不超過30% (僅限SMD 系列)
4.直流電阻變化不超過10% 1.參照上圖回流焊曲線過2次2.峰值溫度為: 260+0/-5℃
3.迴流焊溫度條件是根據我司設備制定的
Vibration test
1.No significant defects in appearance.
2.No short and no open.
Apply frequency 10~55~10Hz and amplitude 1.5mm, 1 min/cycle in X ,Y and Z direction for 2 hours each. (total 6 hours)
Reference documents:
MIL-STD-202G Method 201A
振動測試
1.無明顯的外觀缺陷
2.無短路開路異常
用10~55~10Hz 振動頻率,振幅1.5mm,振動周期為1min/cycle.沿X,Y,Z 方向各振動2小時.(共6小時)
Terminal strength
1. HPI / SMD(V) / SMB / SMI / SMW series:Applied force:5N Duration: 10sec
2.Other SMT series besides the above series:Applied force:10N Duration: 10sec
3.Solder paste thickness:0.12mm
4.Meet the above requirements without any loose terminal.
Solder the test samples to the PCB through 245 ℃ reflow, apply a standard force on the side of the test samples for 10 seconds.
Reference documents:IEC 68-2-21:1992
端子強度
1. HPI / SMD(V) / SMB / SMI / SMW 系列:施加力:5N 持續時間:10秒
2.除上述系列以外的其他SMT 系列:施加力:10N 持續時間:10秒
3.錫膏厚度:0.12毫米
4.端子不發生鬆脫并滿足上述要求測試樣品過245℃的迴流焊上PCB 板，施加一個力到測試器件的側面，這個力應持續10秒。

Resistance to solvent test Reference documents:No damage in appearance or marking
Dip parts into IPA solvent for 5±0.5Min, dry them at room temp for 5Min,then brush them for 10 times.
IEC 68-2-45:1993耐溶劑性試驗
無外觀破壞及標記破損
在IPA 溶劑中浸泡 5±0.5分鐘,室溫下乾燥5分鐘,然後擦拭10次.
FOR SMT/SMD and other similar types
P h y s i c a l c h a r a c t e r i s t i c t e s t s (物理特性試驗)。