pcb线路板专业英语中英

2/P138
d-3 鉚釘組合 (eyelet ) d-4 疊板 (Lay up) d-5 壓 合 (Lamination) d-6 後處理 (Post Treatment) d-7 黑氧化 ( Black Oxide Removal ) d-8 銑靶 (spot face) d-9 去溢膠 (resin flush removal) E. 減銅 (Copper Reduction) e-1 薄化銅(Copper Reduction) F. 電鍍 (Horizontal Electrolytic Plating) f-1 水平電鍍 (Horizontal Electro-Plating) (Panel Plating) f-2 錫鉛電鍍 ( Tin-Lead Plating ) (Pattern Plating) f-3 低於 1 mil ( Less than 1 mil Thickness ) f-4 高於 1 mil ( More than 1 mil Thickness) f-5 砂帶研磨 (Belt Sanding) f-6 剝錫鉛 ( Tin-Lead Stripping) f-7 微切片 ( Microsection) G. 塞孔 (Plug Hole) g-1 印刷 ( Ink Print ) g-2 預烤 (Precure) g-3 表面刷磨 (Scrub) g-4 後烘烤 (Postcure) H. 防焊(綠漆): (Solder Mask) h-1 C面印刷 (Printing Top Side) h-2 S面印刷 (Printing Bottom Side) h-3 靜電噴塗 (Spray Coating) h-4 前處理 (Pretreatment) h-5 預烤 (Precure) h-6 曝光 (Exposure) h-7 顯影 (Develop) h-8 後烘烤 (Postcure)
6/P138
back lighting back-up banked work in process base material baseline performance batch beta backscattering beveling biaxial deformation black-oxide blank controller
1/P138
* Process Module 說明 : A. 下料 ( Cut Lamination) a-1 裁板 ( Sheets Cutting) a-2 原物料發料 (Panel)(Shear material to Size) B. 鑽孔 (Drilling)
b-1 內鑽 (Inner Layer Drilling )
b-2 一次孔(Outer Layer Drilling ) b-3 二次孔 (2nd Drilling) b-4 雷射鑽孔 (Laser Drilling )(Laser Ablation ) b-5 盲(埋)孔鑽孔 (Blind & Buried Hole Drilling) C. 乾膜製程 ( Photo Process(D/F)) c-1 前處理 (Pretreatment) c-2 壓 膜 (Dry Film Lamination) c-3 曝 光 (Exposure) c-4 顯 影 (Developing) c-5 蝕銅 (Etching) c-6 去膜 (Stripping) c-7 初檢 ( Touch-up) c-8 化學前處理,化學研磨 ( Chemical Milling ) c-9 選擇性浸金壓膜 (Selective Gold Dry Film Lamination) c-10 顯 影(Developing ) c-11 去膜(Stripping ) D. 壓 合 Lamination d-1 黑 化 (Black Oxide Treatment) d-2 微 蝕 (Microetching) Developing , Etching & Stripping ( DES )
背光 墊板 預留在製品 基材 基準績效 批 貝他射線照射法 切斜邊;斜邊 二方向之變形 黑化 空白對照組
7/P138
blank panel blanking blip blister blistering blow hole board-thickness error bonding plies bow ; bowing 板彎 break out bridging BTO (Build To Order) burning burr camcorder carbide carlson pin carrier catalyzing catholic sputtering caul plate calibration system requirements center beam method central projection certification chamfer chamfering characteristic impedance charge transfer overpotential chase checkboard chelator chemical bond 化學鍵 chemical vapor deposition circumferential void clad metal clean room clearance coat coating error 空板 挖空 彈開 氣泡;起泡 氣泡 吹孔 板厚錯誤 黏結層
M. 終檢 ( Final Visual Inspection) m-1 壓板翹 ( Warpage Remove) m-2 X-OUT 印刷 (X-Out Marking) m-3 包裝 及出貨 (Packing & shipping)
4/P138
m-4 目檢 ( Visual Inspection) m-5 清洗 及烘烤( Final Clean & Baking) m-6 護銅劑 (ENTEK Cu-106A)(OSP) m-7 離子殘餘量測試 (Ionic Contamination Test )(Cleanliness Test) m-8 冷熱衝擊試驗 (Thermal cycling Testing) m-9 焊錫性試驗 ( Solderability Testing ) N. 雷射鑽孔(Laser Ablation) N-1 雷射鑽Tooling孔 (Laser ablation Tooling Hole) N-2 雷射曝光對位孔(Laser Ablation Registration Hole) N-3 雷射Mask製作(Laser Mask) N-4 雷射鑽孔(Laser Ablation) N-5 AOI 檢查及VRS ( AOI Inspection & Verified & Repaired) N-6 Blaser AOI (after Desmear and Microetching) N-7 除膠渣 (Desmear) N-8 微蝕 (Microetching )
8/P138
coefficient of thermal expansion (CTE) 熱澎脹系數 cold solder joint 冷焊點 cold-weld 金屬粉末冷焊 color 顏色 color error 顏色錯誤 compensation 補償 competitive performance 競爭力績效 complex salt 錯化物 complexor 錯化物 component hole 零件孔 component side 零件面 concentric 同心 conformance 密貼性 consumer products 消費性產品 contact resistance 接觸電阻 continuous performance 連續發揮效能 contract service 協力廠 controlled split 均裂式 conventional flow 亂流方式 conventional tensile test 傳統張力測試法 conversion coating 轉化層 convex 突出 coordinate list 資料清單 copper claded laminates (CCL) 銅箔基板 copper exposure 線路露銅 copper mirror 鏡銅 copper pad 銅箔圓配 copper residue (copper splash) 銅渣 corrosion rate numbering 腐蝕速率計數系統 corrosion resistance 抗蝕性 coulombs law 庫倫定律 countersink 喇叭孔 coupon 試樣 coupon location 試樣點 covering power 遮蓋力 CPU 中央處理器 crack 破裂;裂痕 crazing 裂痕;白斑 cross linking 交聯聚合
3/P138
h-9 UV烘烤 (UV Cure) h-10 文字印刷 ( Printing of Legend ) h-11 噴砂 ( Pumice)(Wet Blasting) h-12 印可剝離防焊 (Peelable Solder Mask) I . 鍍金 Gold plating i-1 金手指鍍鎳金 ( Gold Finger ) i-2 電鍍軟金 (Soft Ni/Au Plating) i-3 浸鎳金 ( Immersion Ni/Au) (Electroless Ni/Au) J. 噴錫 (Hot Air Solder Leveling) j-1 水平噴錫 (Horizontal Hot Air Solder Leveling) j-2 垂直噴錫 ( Vertical Hot Air Solder Leveling) j-3 超級焊錫 (Super Solder ) j-4. 印焊錫突點 (Solder Bump) K. 成型 (Profile)(Form)
從平環內破出 搭橋;橋接 接單生產 燒焦 毛邊(毛頭) 一體型攝錄放機 碳化物 定位梢 載運劑 催化 陰極濺射法 隔板;鋼板 校驗系統之各種要求 中心光束法 集中式投射線 認證 倒角 (金手指) 切斜邊;倒角 特性阻抗 電量傳遞過電壓 網框 棋盤 蟹和劑
化學蒸著鍍 圓周性之孔破 包夾金屬 無塵室 間隙 鍍外表 防焊覆蓋錯誤
5/P138
A/W (artwork) 底片 Ablation 燒溶(laser),切除 abrade 粗化 abrasion resistance 耐磨性 absorption absorption ACC ( accept ) 允收 accelerated corrosion test 加速腐蝕 accelerated test 加速試驗 acceleration 速化反應 accelerator 加速劑 acceptable 允收 activator 活化液 active work in process 實際在製品 adhesion 附著力 adhesive method 黏著法 air inclusion 氣泡 air knife 風刀 amorphous change 不定形的改變 amount 總量 amyl nitrite 硝基戊烷 analyzer 分析儀 anneal 回火 annular ring 環狀墊圈;孔環 anode slime (sludge) 陽極泥 anodizing 陽極處理 AOI ( automatic optical inspection ) 自動光學檢測 applicable documents 引用之文件 AQL sampling 允收水準抽樣 aqueous photoresist 液態光阻 aspect ratio 縱橫比(厚寬比) As received 到貨時
k-1 k-2 k-3 k-4 k-5
撈型 (N/C Routing ) (Milling) 模具沖 (Punch) 板面清洗烘烤 (Cleaning & Backing) V型槽 ( V-Cut)(V-Scoring) 金手指斜邊 ( Beveling of G/F)
ቤተ መጻሕፍቲ ባይዱ
L. 短斷路測試 (Electrical Testing) (Continuity & Insulation Testing) l-1 l-2 l-3 l-4 l-5 AOI 光學檢查 ( AOI Inspection) VRS 目檢 (Verified & Repaired) 汎用型治具測試 (Universal Tester) 專用治具測試 (Dedicated Tester) 飛針測試 (Flying Probe)