ASM焊线机参数指导
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ASM
CMLT Ball Size & Gold Remain Issue
- Smaller capillary CD
ATS WB Process
ASM
Material Background & Spec
Die source : Chi-Mei 14 x 17mil chip
Pad Opening : P Pad 94um, N Pad 92um
Bonding Method : BSOB 2 wires
Device : 3020 18 columns x 8 rows
Ball shear spec : > 42g
Ball size spec : Max 85um
Gold remain spec : > 50%
Gold Wire : K&S AW99 1mil (EL 2-7% BL >9g)
1A 0/0 20/2 16 Enc 100% 0 168 50% 5 Smpl 50% Ellipse4 45/30
Scrub only applied to P Pad
ASM
Data
P Pad ball size &
thickness
Min Max Average
X (um) 78.32 74.53 75.8 75.8 77.9 74.53 78.32 76.47
BSOB Wire Parameter 2nd Bond pt OS Search speed2 Contact Srch Threshold2 Base time 1/2 Base power 1/2 Base force 1/2
Base Parameter Standby power 1/2 Contact time 1/2 Contact Power 1/2 Contact Force 1/2
Min Max Average
P Pad 71.5 59.7 57.7 55.82 67 55.82 71.50 62.34
Min Max Average
N Pad 75.23 56.76 61.63 61.55 68.11 56.76 75.23 64.66
ASM
Result photo
Best P Pad
End force
Reference Parameter Search height 1/2
3/3 Const P/Const P
Lo/Lo Mode A
4000 725 35
58 384 48 20/10 55/50 45/55
50/0 20/0 45/0 55/0
55/0
10/8
Enhancer Parameter Enhancer Mode Enhancer Power Enhancer time Enhancer delay Enhancer StdbyPower Enhancer F1 Enhancer S1 Enhancer S2 Enhancer F2 Enhancer Control Mode
X (um) 76.63 74.9 77.9 76.63
77 74.90 77.90 76.61
Y (um) 83.8 81.68 78.3 80.4 83 78.30 83.80 81.44
Z (um) 13.5 14.5 12 13.5 12.5 12 14.5 13.20
N Pad Ball Shear (g)
P Pad N Pad
Capillary : GAISER 1551-13-437GM 65(6x120D-8D-10) (CD:2.5mil (63.5um) Tip:6.5mil Hole:1.3mil)
ASM
Material Background
Machine type : Harrier S/N TE019-052
5.25
Date/Time
Tue Jun 6 16:03:22 2023
ASM
Parameter Setting
BQM Setup Rise time 1/2 Power Control 1/2 Power Level 1/2 Mode 1/2
EFO Parameter Current (*0.01)mA EFO time (us) Tail L 20 256 82 28
Advance
Scrub Parameter Scrub Control mode Scrub Offset SPC/SPC2 Scrub Period T1/Cycle Scrub Amp Amplitude ratio Y Scrub Delay Z Scrub Delay SPC Speed SPC Delay Scrub Speed (%) Scrub Direction Scrub Power/Force
Software version:
Machine Name : Harrier
System Version 10.01.33 rev 8
Site
Generic
PR
7.12 Rev 9
BQM
1.06 (1.13)
WH
4.76
Servo (Z)
1.42
Servo (XY)
1.26
Heater
30A
Bonder
Best N Pad
Worst P Pad Worst N Pad
ASM
After Shear Gold Remain
P pad 100% P pad
70%
N pad
90% N pad
80%
ASM
Summary Result
With smaller CD capillary, smaller ball size can be achieved
Y (um) 80
81.68 79.6 78.7 80.4 78.70 81.68 80.08
Z (um) 13.5 14.5 11.5 12.5 14 11.5 14.5 13.20
P Pad Ball Shear (g)
N Pad ball size &
thickness
Min Max Average
➢ Enhancer F2 increased to 28 (was 20) ➢ Scrub T1 & Amplitude also increased
Both P & N pads able to achieve >50% gold remain
CMLT Ball Size & Gold Remain Issue
- Smaller capillary CD
ATS WB Process
ASM
Material Background & Spec
Die source : Chi-Mei 14 x 17mil chip
Pad Opening : P Pad 94um, N Pad 92um
Bonding Method : BSOB 2 wires
Device : 3020 18 columns x 8 rows
Ball shear spec : > 42g
Ball size spec : Max 85um
Gold remain spec : > 50%
Gold Wire : K&S AW99 1mil (EL 2-7% BL >9g)
1A 0/0 20/2 16 Enc 100% 0 168 50% 5 Smpl 50% Ellipse4 45/30
Scrub only applied to P Pad
ASM
Data
P Pad ball size &
thickness
Min Max Average
X (um) 78.32 74.53 75.8 75.8 77.9 74.53 78.32 76.47
BSOB Wire Parameter 2nd Bond pt OS Search speed2 Contact Srch Threshold2 Base time 1/2 Base power 1/2 Base force 1/2
Base Parameter Standby power 1/2 Contact time 1/2 Contact Power 1/2 Contact Force 1/2
Min Max Average
P Pad 71.5 59.7 57.7 55.82 67 55.82 71.50 62.34
Min Max Average
N Pad 75.23 56.76 61.63 61.55 68.11 56.76 75.23 64.66
ASM
Result photo
Best P Pad
End force
Reference Parameter Search height 1/2
3/3 Const P/Const P
Lo/Lo Mode A
4000 725 35
58 384 48 20/10 55/50 45/55
50/0 20/0 45/0 55/0
55/0
10/8
Enhancer Parameter Enhancer Mode Enhancer Power Enhancer time Enhancer delay Enhancer StdbyPower Enhancer F1 Enhancer S1 Enhancer S2 Enhancer F2 Enhancer Control Mode
X (um) 76.63 74.9 77.9 76.63
77 74.90 77.90 76.61
Y (um) 83.8 81.68 78.3 80.4 83 78.30 83.80 81.44
Z (um) 13.5 14.5 12 13.5 12.5 12 14.5 13.20
N Pad Ball Shear (g)
P Pad N Pad
Capillary : GAISER 1551-13-437GM 65(6x120D-8D-10) (CD:2.5mil (63.5um) Tip:6.5mil Hole:1.3mil)
ASM
Material Background
Machine type : Harrier S/N TE019-052
5.25
Date/Time
Tue Jun 6 16:03:22 2023
ASM
Parameter Setting
BQM Setup Rise time 1/2 Power Control 1/2 Power Level 1/2 Mode 1/2
EFO Parameter Current (*0.01)mA EFO time (us) Tail L 20 256 82 28
Advance
Scrub Parameter Scrub Control mode Scrub Offset SPC/SPC2 Scrub Period T1/Cycle Scrub Amp Amplitude ratio Y Scrub Delay Z Scrub Delay SPC Speed SPC Delay Scrub Speed (%) Scrub Direction Scrub Power/Force
Software version:
Machine Name : Harrier
System Version 10.01.33 rev 8
Site
Generic
PR
7.12 Rev 9
BQM
1.06 (1.13)
WH
4.76
Servo (Z)
1.42
Servo (XY)
1.26
Heater
30A
Bonder
Best N Pad
Worst P Pad Worst N Pad
ASM
After Shear Gold Remain
P pad 100% P pad
70%
N pad
90% N pad
80%
ASM
Summary Result
With smaller CD capillary, smaller ball size can be achieved
Y (um) 80
81.68 79.6 78.7 80.4 78.70 81.68 80.08
Z (um) 13.5 14.5 11.5 12.5 14 11.5 14.5 13.20
P Pad Ball Shear (g)
N Pad ball size &
thickness
Min Max Average
➢ Enhancer F2 increased to 28 (was 20) ➢ Scrub T1 & Amplitude also increased
Both P & N pads able to achieve >50% gold remain