Atazanavir_198904-31-3_DataSheet_MedChemExpress

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Taiwan Headquarters
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Landrex Shenzhen
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Philippines Rep.
No.232, Yung- Chang St, Ying-Ko, Taipei, Taiwan 239, R.O.C. Tel :886-2-2678-7966 Fax:886-2-2678-0160
No.232, Yung- Chang St, Ying-Ko, Taipei, Taiwan 239, R.O.C. Tel :886-2-2678-7966 Fax:886-2-2678-0160

阿扎那韦杂质汇总

10mg 25mg 50mg 100mg 更大规格请咨询
项目报批纯度高于98%
Atazanavir Impurity 3
阿扎那韦杂质3
（(3S,8R,9R,12S)-
N/A
Atazanavir）
10mg 25mg 50mg 100mg 更大规格请咨询
项目报批纯度高于98%
阿扎那韦杂质4
Hale Waihona Puke Atazanavir Impurity 4 （(3R,8S,9S,12R)- 1292296-11-7 Atazanavir）
扬信医药代理各品种杂质对照品:舒更葡糖钠杂质，达托霉素杂质，依维莫司杂质，他克莫司杂质，阿奇霉素杂质，克拉维酸钾杂质，红霉素杂质，克拉霉素杂质，林可霉素杂质，罗红霉素杂质，克林霉素杂质，恩曲他滨杂质，艾地那非杂质，瑞卢戈利杂质，艾氟康唑
杂质等；并提供COA、NMR、HPLC、MS等结构确证图谱;详情请点用户名，谢谢！
专业<杂质对照品>解决方案，代理中检所/EP/BP/USP/LGC/TRC/DR/TLC/MC/SIGMA/BACHEM/STD等品牌。
阿扎那韦杂质列表集
中文名称
英文名称
CAS
规格
阿扎那韦杂质1
Atazanavir Impurity 1 （(3R,8S,9S,12S)- 1332981-14-2 Atazanavir）
10mg 25mg 50mg 100mg 更大规格请咨询
用途
项目报批纯度高于98%
结构式
阿扎那韦杂质2
Atazanavir Impurity 2 （(3S,8S,9S,12R)- 1332981-16-4 Atazanavir）
10mg 25mg 50mg 100mg 更大规格请咨询

（ECL）NA931-GEHealthcareLifeSciences

Product Specification SheetCode: NA931WarningFor research use only.Not recommended or intended for diagnosis of disease in humans or animals.Do not use internally or externally in humans or animals. Before using this product, please read the instructions for safe handling, storage and disposalStorageStore at 2–8°C. Do not freeze. Under these conditions, the product is stable for at least 6 months from the date of despatch.ExpirySee outer packaging.Safety warnings and precautionsAll chemicals should be considered as potentially hazardous. We therefore recommend that this product is handled only by those persons who have been trained in laboratory techniques and that it is used in accordance with the principles of good laboratory practice. Wear suitable protective clothing such as laboratory overalls, safety glasses and gloves. Care should be taken to avoid contact with skin or eyes. In the case of contact with skin or eyes wash immediately with water. See material safety data sheet(s) and/or safety statement(s) for specific advice. ComponentsHorseradish Peroxidase conjugated antibody is supplied in Phosphate Buffered Saline (Sodium Phosphate 0.1 M, NaCl 0.1 M) pH 7.5, containing 1% (w/v) Bovine Serum Albumin and an anti-microbial agent.DescriptionPurification to ensure species-specificityThe antibody is prepared by hyper-immunizing sheep with purified immunoglobulin fractions from normal mouse serum to produce high affinity antibodies. The pooled antiserum is used to produce an immunoglobulin preparation which is then affinity adsorbed to remove cross-reacting antibodies towards rat, human and rabbit immunoglobulins. These activities are thoroughly depleted to ensure species-specificity.Finally, to select for specific binding to mouse IgG, the antibodies are purified using an affinity column of mouse IgG. After washingto remove non-specific serum components and low affinity antibodies, the species-specific antibodies are eluted using carefully selected, mild conditions which minimize aggregation and preserve immunological activity, yet which will elute high affinity antibodies.Preparation of labelled antibodyThe enzyme Horseradish Peroxidase is attached to the immunoglobulin molecules using an adaptation of the periodate oxidation technique (1). This method has been found not to affect the effective binding of the antibody to the antigen or the activity of the enzyme.Quality controlFor every batch of enzyme-linked antibody that is produced the antibody titre is determined in an ELISA. The substrate used forthe peroxidase is 2,2’-Azinobis[3-Ethylbenzothiazoline Sulphonate, diammonium salt], ABTS™.Every batch is also QC tested in a Western blotting system. Thisis performed using Amersham Protran™ Premium membrane containing serially-diluted tubulin protein and is immunodetected with: primary monoclonal anti-tubulin antibody and anti-mouse IgG HRP secondary antibody (NA931). Blots are detected using Amersham ECL and Amersham ECL Prime™ detection systems. Applications1. Protein blottinga) Detection with Amersham ECL Western blotting reagents (2) This reagent has been shown to be suitable for use in ECL Western blotting applications.The control system used was the detection of monoclonal anti-tubulin.We have found in our laboratories that dilutions of: 1:2000 for monoclonal anti-tubulin; and 1:5000 for anti-mouse IgG, HRP are suitable for the detection of 3 ng of tubulin on Amersham Protran Premium membrane, exposed to Hyperfilm™ ECL for 5 minutes.To achieve the same sensitivity level on Amersham Hybond™, concentrations would typically be: anti-tubulin - 1:2000; andNA931 - 1:10000.b) Detection with Amersham ECL Prime Western blotting reagents (3, 4)Amersham ECL Prime Western blotting reagent is highly sensitive, giving an increase, for this antibody, of 4-20 fold over ECL detection. This property can be utilized in 2 ways:• Preservation of antibodies that are rare or costly• Increase in detectable sensitivity levelsThe control system used was the same as for Amersham ECL.The suitable antibody dilutions, to detect 3 ng of tubulin on Amersham Protran Premium membrane are: anti-tubulin - 1:5000; and NA931 - 1:50 000.For Amersham Hybond membrane antibody dilutions are typically: anti-tubulin - 1:10 000; and NA931-1:100 000.c) Colorimetric detectionA dilution of 1:300 is recommended.2. ELISAIf this reagent is to be used to detect mouse immunoglobulins, we have found in our laboratories that a dilution of 1:6000 is suitable for the detection of 1 µg of IgG.For greater sensitivity (for example down to 300 pg) the reagent should be diluted rather less (for example 1:500). A suitable diluent is Phosphate-Buffered Saline containing 0.05% (v/v) Tween™ 20.Amersham™ECL™ Anti-Mouse IgG, Horseradish Peroxidase-Linked Species-Specific Whole Antibody (from sheep)imagination at work3. ImmunocytochemistryWhen using the reagent as a second antibody inimmunocytochemistry on sections of formalin-fixed wax-embedded tissue the antibody can typically be diluted 1:100 in Phosphate-Buffered Saline. The user may wish to adjust this to obtain the required sensitivity for the tissue under investigation. If frozensections are used, acceptable staining may be obtained using even higher dilutions of the reagent.Protocol recommendations MembranesNitrocellulose and PVDF membranes are suitable for use with both detection systems. PVDF membrane is highly recommended for use with Amersham ECL Prime detection reagents.For high quality results the following guidelines should be followed: Blocking: Use enough blocking agent to block all non-specific sites. A typical block 5% non-fat dried milk in PBS Tween or TBS Tween (order RPN2125).Washing: The volume of wash buffer (eg PBS-T or TBS-T) must be sufficient to cover the membrane completely.Optimization of primary and secondary antibodies ECL detectionAmersham ECL Western blotting is a very sensitive technique. As such it is essential to optimize the system under study for high signal and low background for both primary and secondary antibodies.Dot blots are a quick and effective method of determining the optimum dilutions required for primary and secondary antibodies. Optimization details are set out in the RPN2106/2108/2109/2209/ 2134 booklets.Amersham ECL Prime detectionDue to the improved sensitivity of Amersham ECL Prime compared to ECL, optimization details as set out in the RPN2132/2133 booklets.Typical anti-mouse secondary antibody dilution ranges:Amersham ECL for nitrocellulose membrane 1:1000 to 1:5000 Amersham ECL Prime for nitrocellulose membrane 1:2000 to 1:10 000For PVDF membrane the use of higher dilutions may be necessary. The exact concentration of the secondary antibody will always be dependent upon the primary antibody used and the sensitivity and exposure times required.Detection: Ensure any excess Amersham ECL or Amersham ECL Prime detection reagents are sufficiently drained prior to exposure.Exposure times:Amersham ECL - exposure times of 1 to 15 minutes are suggested. Amersham ECL Prime - initial exposure times of 1 to 5 minutes are suggested.Signal can still be obtained up to 24 hours after the application of Amersham ECL Prime reagents, and for this exposure times of 1 to 2 hours may be required.Related productsAmersham ECL Western blottingdetection reagentsRPN2106/2108/2109/ 2209/2134Amersham ECL Prime Western blotting detection systemRPN2232 & RPN2236Amersham Protran Premium 10600048 RPN2020D Amersham Hybond membrane 10600058 RPN2020FAmersham Hyperfilm ECL film28906835/28906836/ 28906837/28906838/ 28906839Amersham ECL protein molecular weight markersRPN2107/2124/2125References1) NAKANE, P.K. and KAWAOI, A., Journal of Histochemistry andCytochemistry , 22, pp.1084-1091, 1974.2) WHITEHEAD, T.P. et al., Clin. Chem., 25, pp.1532-1546, 1979.3) AKHAVEN-TAFTI, H. et al., Clin. Chem., 41, pp.1368-1369, 1995.4) AKHAVEN-TAFTI, H. et al., Biolum. And Chemilum. Fundamentals and Applied Aspects, pp.199-202, Chichester, 1994.LegalGE, imagination at work and GE Monogram are trademarks of General Electric Company.Amersham, Hybond, ECL, ECL Prime and Hyperfilm are trademarks of GE Healthcare companies.ABTS is a trademark of Boehringer Mannheim GmBH Tween is a trademark of ICI Americas Inc.Amersham ECL Prime and Amersham ECL Select is manufactured and sold under license from Cyanagen Srl and is subject of US patent application number 2008241868 and 2008176251, and Italian application number TO2010A000580, together with other equivalent granted patents and patent applications in other countries.© 2006 - 2014 General Electric Company – All rights reserved First published 2006All goods and services are sold subject to the terms and conditions of sale of the company within GE Healthcare which supplies them. A copy of these terms and conditions is available on request. Contact your local GE Healthcare representative for the most current information.For your local office contact information, visit /contact GE Healthcare UK Limited Amersham PlaceLittle Chalfont, Buckinghamshire, HP7 9NA, UKGE Healthcare offices:GE Healthcare Bio-Sciences AB Björkgatan 30, 751 84 Uppsala, SwedenGE Healthcare Europe GmbHMunzinger Strasse 5, D-79111 Freiburg, GermanyGE Healthcare Bio-Sciences Corp.800 Centennial Avenue, P.O. Box 1327, Piscataway, NJ 08855-1327, USAGE Healthcare Japan Corporation Sanken Bldg. 3-25-1, Hyakunincho, Shinjuku-ku, Tokyo 169-0073, Japan29093068 Rev AA 01-2014。

ATF33143中文资料

120 100 80
Cpk = 2.3 Std = 0.2
80
60
-3 Std
+3 Std
60
-3 Std
+3 Std
40
40
20
20
0 29
31
33 OIP3 (dBm)
35
37
0 13
14
15 GAIN (dB)
16
17
Figure 3. OIP3 @ 2 GHz, 4 V, 80 mA. LSL=30.0, Nominal=33.3, USL=37.0
test requirements. Circuit losses have been de-embedded from actual measurements. 10. The probability of a parameter being between ±1σ is 68.3%, between ±2σ is 95.4% and between ±3σ is 99.7%.
0.3
0.4
0.5 NF (dB)
0.6
0.7
0.8
Figure 1. Typical Pulsed I-V Curves [7]. (VGS = -0.2 V per step)
100 Cpk = 1.21 Std = 0.94
Figure 2. NF @ 2 GHz, 4 V, 80 mA. LSL=0.2, Nominal=0.53, USL=0.8
Applications
• Low Noise Amplifier and Driver Amplifier for Cellular/PCS Base Stations • LNA for WLAN, WLL/RLL, LEO, and MMDS Applications • General Purpose Discrete PHEMT for Other Ultra Low Noise Applications

Agilent GeneJammer 转染试剂,货号 204131 - 化学品安全说明书

GeneJammer Transfection Reagent, Part Number 204131*************(24小时)化学品安全技术说明书GHS product identifier 应急咨询电话（带值班时间）::供应商/ 制造商:安捷伦科技贸易（上海）有限公司中国（上海）外高桥自由贸易试验区英伦路412号（邮编:200131)电话号码： 800-820-3278传真号码: 0086 (21) 5048 2818GeneJammer Transfection Reagent, Part Number 204131化学品的推荐用途和限制用途204131部件号:安全技术说明书根据 GB/ T 16483-2008 和 GB/ T 17519-2013GHS化学品标识:GeneJammer 转染试剂，货号 204131推荐用途:有关环境保护措施，请参阅第 12 节。

物质或混合物的分类根据 GB13690-2009 和 GB30000-2013紧急情况概述液体。

无资料。

物理状态:颜色:气味:GHS危险性类别警示词:危险危险性说明::防范说明预防措施:P241 - 使用防爆的电气、通风、照明设备。

P242 - 使用不产生火花的工具。

P243 - 采取行动防止静电放电。

P233 - 保持容器密闭。

P264 - 作业后彻底清洗。

标签要素象形图易燃液体 - 类别 2严重眼损伤/眼刺激 - 类别 2AP305 + P351 + P338 - 如进入眼睛：用水小心冲洗几分钟。

如戴隐形眼镜并可方便地取出，取出隐形眼镜。

继续冲洗。

P337 + P313 - 如仍觉眼刺激：求医要么就诊。

安全储存:废弃处置:P501 - 处置内装物/容器按照地方/区域/国家/国际规章。

物理和化学危险高度易燃液体和蒸气。

健康危害::与物理,化学和毒理特性有关的症状皮肤接触食入吸入没有具体数据。

没有具体数据。

PDP-11 DATATRIEVE VAX 版本2.0 SPO 25.14.3说明书

• FIND establishes a collection (subset) of records contained in either a domain or a previously established collection based on a Boolean expression.
• DECLARE defines global and local variables to be used within a DATATRIEVE query.
• DEFINE provides a consistent mechanism for creating domain, record, procedure, table and view definitions in the Data Dictionary.
DATATRIEVE enables the user to define domains that cross RMS file definitions and subset record defi n itions.
DATATRIEVE provides an Application Design Tool (ADT) to assist the novice user in creating domain and record definitions. The ADT uses an interactive dialogue technique to guide the user through the data definition process. It creates an indirect command file which is then processed to actually update the DATATRIEVE Data Dictionary.

Altivar Easy 310 ATV310H075N4E 变速电机驱动商品说明书

Product datasheetCharacteristicsATV310H075N4Evariable speed drive ATV310 - 0.75 kW - 1 hp -380...460 V - 3 phaseMainRange of productAltivar Easy 310Product or component type Variable speed drive Product specific application Simple machine Assembly style With heat sink Device short name ATV310Network number of phases Three phase[Us] rated supply voltage 380...460 V (- 15...10 %)Motor power kW 0.75 kW Motor power hp1 hpComplementaryProduct destination Asynchronous motors Quantity per set Set of 1EMC filter Without EMC filter Supply frequency50/60 Hz +/- 5 %Communication port protocol ModbusConnector type RJ45 for Modbus on front face Physical interface 2-wire RS 485 for Modbus Transmission frame RTU for Modbus Transmission rate4800 bit/s 9600 bit/s 19200 bit/s 38400 bit/sNumber of addresses 1...247 addresses for ModbusCommunication serviceRead holding registers (03), messaging: 29 words Write single register (06), messaging: 29 words Write multiple registers (16), messaging: 27 wordsRead/write multiple registers (23), messaging: 4/4 words Read device identification (43)Line current 3.1 A Apparent power 2.5 kVA Prospective line Isc <= 5 kA Continuous output current2.3 A at 4 kHzi s c l a i m e r : T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n sMaximum transient current 3.5 A for 60 sPower dissipation in W28.83 W at InSpeed drive output frequency0.5...400 HzNominal switching frequency 4 kHzSwitching frequency 2...12 kHz (adjustable)Speed range 1 (20)Transient overtorque170...200 % of nominal motor torque depending on drive rating and type of motorBraking torque Up to 150 % of nominal motor torque with braking resistor at high inertiaUp to 70 % of nominal motor torque without braking resistorAsynchronous motor control profile Energy saving ratioQuadratic voltage/frequency ratioSensorless flux vector controlMotor slip compensation AdjustablePreset in factoryOutput voltage380...460 V three phaseElectrical connection 1.5...2.5 mm² at terminal L1, L2, L3, PA/+, PB, U, V, WTightening torque0.8...1 N.mInsulation Electrical between power and controlSupply Internal supply for reference potentiometer : 5 V (4.75...5.25 V) DC 10 mA with overload and short-circuit protectionInternal supply for logic inputs : 24 V (20.4...28.8 V) DC 100 mA with overload and short-circuitprotectionAnalogue input number1Analogue input type Configurable current (AI1) 0...20 mA, impedance 250 OhmConfigurable voltage (AI1) 0...10 V, impedance 30 kOhmConfigurable voltage (AI1) 0...5 V, impedance 30 kOhmDiscrete input number4Discrete input type24 V (18...30 V) programmable, at LI1...LI4 terminal(s)Discrete input logic Positive logic (source), 0...< 5 V (state 0), > 11 V (state 1)Negative logic (sink), > 16 V (state 0), < 10 V (state 1), input impedance 3.5 kOhmSampling duration10 ms for analogue input20 ms, tolerance +/- 1 ms for logic inputLinearity error+/- 0.3 % of maximum value for analogue inputAnalogue output number1Analogue output type AO1 software-configurable voltage : 0...10 V, impedance: 470 Ohm, resolution 8 bitsAO1 software-configurable current : 0...20 mA, impedance: 800 Ohm, resolution 8 bitsDiscrete output number2Discrete output type(LO+, LO-) logic output(R1A, R1B, R1C) protected relay output 1 C/OMinimum switching current 5 mA at 24 V DC for logic relayMaximum switching current 2 A at 250 V AC on inductive load (cos phi = 0.4 L/R = 7 ms) for logic relay2 A at 30 V DC on inductive load (cos phi = 0.4 L/R = 7 ms) for logic relay3 A at 250 V AC on resistive load (cos phi = 1 L/R = 0 ms) for logic relay4 A at 30 V DC on resistive load (cos phi = 1 L/R = 0 ms) for logic relayAcceleration and deceleration ramps SULinear from 0...999.9 sBraking to standstill By DC injection, <= 30 sProtection type Against input phase loss in three-phaseThermal motor protection via the drive by continuous calculation of I²tLine supply overvoltageLine supply undervoltageOvercurrent between output phases and earthOverheating protectionShort-circuit between motor phasesFrequency resolution Converter A/D, 10 bits for analog input0.1 Hz for display unitTime constant20 ms, tolerance +/- 1 ms for reference changeOperating position Vertical +/- 10 degreeHeight130 mmWidth72 mmDepth143 mmProduct weight0.7 kgEnvironmentElectromagnetic compatibility Voltage dips and interruptions immunity test conforming to EN/IEC 61000-4-11Electrical fast transient/burst immunity test (test level: level 4) conforming to EN/IEC 61000-4-4Electrostatic discharge immunity test (test level: level 3) conforming to EN/IEC 61000-4-2Immunity to conducted disturbances (test level: level 3) conforming to EN/IEC 61000-4-6Radiated radio-frequency electromagnetic field immunity test (test level: level 3) conforming to EN/IEC 61000-4-3Surge immunity test (test level: level 3) conforming to EN/IEC 61000-4-5Standards EN/IEC 61800-3EN/IEC 61800-5-1IP degree of protection IP41 on topIP20 without blanking plate on upper partPollution degree 2 conforming to EN/IEC 61800-5-1Environmental characteristic Chemical pollution resistance class 3C3 conforming to EN/IEC 60721-3-3Dust pollution resistance class 3S2 conforming to EN/IEC 60721-3-3Shock resistance15 gn (duration = 11 ms) conforming to EN/IEC 60068-2-27Relative humidity 5...95 % (without condensation) conforming to IEC 60068-2-35...95 % (without dripping water) conforming to IEC 60068-2-3Ambient air temperature for storage-25...70 °CAmbient air temperature for operation-10...55 °C without derating55...60 °C protective cover from the top of the drive removed with current derating 2.2 % per °C Operating altitude<= 1000 m without deratingDimensions Drawings DimensionsDimensions in mmDimensions in in.Mounting and ClearanceMounting RecommendationsClearanceMounting TypesMounting Type AMounting Type BRemove the protective cover from the top of the drive.Connections and SchemaThree-Phase Power Supply Wiring DiagramA1 :DriveKM1 :Contactor (only if a control circuit is needed)P1 : 2.2 kΩ reference potentiometer. This can be replaced by a 10 kΩ potentiometer (maximum). Q1 :Circuit breakerR :Braking resistor (optional)(1)Negative logic (Sink)(2)Positive logic (Source) (factory set configuration)(3)0...10 V or 0...20 mA(4)Line choke three-phase (optional)。

Connect Tech XMC to PCIe 104 Adapter 用户指南说明书

XMC to PCIe/104 AdapterConnect Tech Inc.Tel:519-836-129142 Arrow Road Toll:800-426-8979 (North America only) Guelph, Ontario Fax:519-836-4878N1K 1S6 Email:********************************************Table of ContentsTable of Contents (2)Preface (3)Disclaimer (3)Customer Support Overview (3)Contact Information (3)Limited Product Warranty (4)Copyright Notice (4)Trademark Acknowledgment (4)ESD Warning (5)Revision History (5)Introduction (6)Product Features and Specifications (6)Product Overview (7)Connector Summary & Locations (7)Jumper Summary & Locations (8)Detailed Feature Description (9)PCIe/104 Connector (9)Description (9)Connectors & Jumpers (9)XMC Expansion Slot (10)Description (10)Connectors & Jumpers (10)Indicator LEDs (11)Description (11)Connectors & Jumpers (11)Typical Installation (12)PrefaceDisclaimerThe information contained within this user’s guide, including but not limited to any product specification, is subject to change without notice.Connect Tech assumes no liability for any damages incurred directly or indirectly from any technical ortypographical errors or omissions contained herein or for discrepancies between the product and the user’s guide.Customer Support OverviewIf you experience difficulties after reading the manual and/or using the product, contact the Connect Tech reseller from which you purchased the product. In most cases the reseller can help you with product installation and difficulties.In the event that the reseller is unable to resolve your problem, our highly qualified support staff can assist you.Our support section is available 24 hours a day, 7 days a week on our website at:/sub/support/support.asp. See the contact information section below for moreinformation on how to contact us directly. Our technical support is always free.Contact InformationMail/CourierConnect Tech Inc.Technical Support42 Arrow RoadGuelph, OntarioCanada N1K 1S6Email/Internet********************************************Telephone/FacsimileTechnical Support representatives are ready to answer your call Monday through Friday, from 8:30 a.m. to 5:00 p.m. Eastern Standard Time. Our numbers for calls are:Toll Free: 800-426-8979 (North America only)Telephone: 519-836-1291 (Live assistance available 8:30 a.m. to 5:00 p.m. EST,Monday to Friday)Facsimile: 519-836-4878 (on-line 24 hours)Limited Product WarrantyConnect Tech Inc. provides a 2 year Warranty for the XMC to PCIe/104 Adapter. Should this product, in Connect Tech Inc.'s opinion, fail to be in good working order during the warranty period, Connect Tech Inc.will, at its option, repair or replace this product at no charge, provided that the product has not been subjected to abuse, misuse, accident, disaster or non-Connect Tech Inc. authorized modification or repair.You may obtain warranty service by delivering this product to an authorized Connect Tech Inc. business partner or to Connect Tech Inc. along with proof of purchase. Product returned to Connect Tech Inc. must be pre-authorized by Connect Tech Inc. with an RMA (Return Material Authorization) number marked on the outside of the package and sent prepaid, insured and packaged for safe shipment. Connect Tech Inc. will return this product by prepaid ground shipment service.The Connect Tech Inc. Limited Warranty is only valid over the serviceable life of the product. This is defined as the period during which all components are available. Should the product prove to be irreparable, Connect Tech Inc. reserves the right to substitute an equivalent product if available or to retract the Warranty if no replacement is available.The above warranty is the only warranty authorized by Connect Tech Inc. Under no circumstances willConnect Tech Inc. be liable in any way for any damages, including any lost profits, lost savings or otherincidental or consequential damages arising out of the use of, or inability to use, such product. Copyright NoticeThe information contained in this document is subject to change without notice. Connect Tech Inc. shall not be liable for errors contained herein or for incidental consequential damages in connection with the furnishing, performance, or use of this material. This document contains proprietary information that is protected by copyright. All rights are reserved. No part of this document may be photocopied, reproduced, or translated to another language without the prior written consent of Connect Tech, Inc.Copyright 2016 by Connect Tech, Inc.Trademark AcknowledgmentConnect Tech, Inc. acknowledges all trademarks, registered trademarks and/or copyrights referred to in this document as the property of their respective owners. Not listing all possible trademarks or copyrightacknowledgments does not constitute a lack of acknowledgment to the rightful owners of the trademarks and copyrights mentioned in this document.ESD WarningElectronic components and circuits are sensitive toElectroStatic Discharge (ESD). When handling any circuit board assemblies including Connect Tech COM Express carrier assemblies, it is recommended that ESD safety precautions be observed. ESD safe best practices include, but are not limited to:∙ Leaving circuit boards in their antistatic packaginguntil they are ready to be installed.∙ Using a grounded wrist strap when handling circuitboards, at a minimum you should touch a grounded metal object to dissipate any static charge that may be present on you.∙ Only handling circuit boards in ESD safe areas, whichmay include ESD floor and table mats, wrist strap stations and ESD safe lab coats.∙ Avoiding handling circuit boards in carpeted areas. ∙ Try to handle the board by the edges, avoiding contactwith components.Revision HistoryIntroductionConnect Tech’s XMC to PCIe/104 Adapter Board is an engineering tool for the purpose of enabling rapid development of systems requiring the use of next generation form factor peripheral cards. This product complies with the VITA 42 specification.Product Features and SpecificationsProduct Overview Connector Summary & Locations ADG095 Top ViewADG095 BottomViewJumper Summary & LocationsDetailed Feature DescriptionPCIe/104 ConnectorDescriptionPCIe/104 interface to CPU module Connectors & JumpersXMC Expansion SlotDescriptionM.2 interface slots for expansion cards. Can be ordered in either key E or key BM. Card type support is listed below.See Part Numbers/Ordering Information section for more ordering details.Connectors & JumpersIndicator LEDsDescriptionIndicator LED’s Connectors & JumpersTypical InstallationCard may be installed in a stack-up or stack-down configuration. 10mm height, M2.5 standoffs required between XMC adapter and XMC expansion card. Example stack-up on Connect Tech’s Com Express Type 6 104e Carrier shown below:。

ReadyNAS 复制补充功能用户手册说明书

350 East Plumeria Drive San Jose, CA 95134 USAJune 2012202-10727-02ReadyNAS Replicate Add-on ManualReadyNAS Replicate© NETGEAR, Inc. All rights reservedNo part of this publication may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any means without the written permission of NETGEAR, Inc.NETGEAR, the NETGEAR logo, and Connect with Innovation are trademarks and/or registered trademarks of NETGEAR, Inc. and/or its subsidiaries in the United States and/or other countries. Information is subject to change without notice. Other brand and product names are registered trademarks or trademarks of their respective holders. © NETGEAR, Inc. All rights reserved.Technical SupportThank you for choosing NETGEAR. To register your product, get the latest product updates, get support online, or for more information about the topics covered in this manual, visit the Support website at.Phone (US & Canada only): 1-888-NETGEARPhone (Other Countries): Check the list of phone numbers at/app/answers/detail/a_id/984.Statement of ConditionsTo improve internal design, operational function, and/or reliability, NETGEAR reserves the right to make changes to the products described in this document without notice. NETGEAR does not assume any liability that may occur due to the use, or application of, the product(s) or circuit layout(s) described herein.ContentsChapter 1 Getting StartedAbout ReadyNAS Replicate. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Chapter 2 Replicate and Restore DataAccess the Web Management Console. . . . . . . . . . . . . . . . . . . . . . . . . . .11Replicate . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12Replicate Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13Replicate a System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Restore. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18Restore Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18Restore a System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .19 Chapter 3 Manage Replication JobsMonitor the Network. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .21View and Manage Jobs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .22Monitor Jobs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .23Run Job Reports . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .241 1. Getting StartedReadyNAS Replicate allows you to create an on-demand virtual private connection between two or more ReadyNAS systems. Unlike a traditional VPN application, all you need to do to establish this connection is add your ReadyNAS system to your virtual network and register the unit with the centralized management portal. After the connection is formed, your devices act as if they are on the same LAN.This chapter covers the following topics:•About ReadyNAS Replicate•InstallationFor more information about the topics covered in this manual, visit the support website at.Firmware updates with new features and bug fixes are made available from time to time on . If the features or behavior of your product does not match what is described in this guide, you might need to update your firmware.About ReadyNAS ReplicateThe ReadyNAS Replicate add-on lets you copy data from one ReadyNAS system to another. It uses the ReadyNAS Remote add-on as its underlying communication technology.ReadyNAS Remote allows devices to communicate with each remotely over the Internet. (For more information about ReadyNAS Remote, see the ReadyNAS Remote Add-on Manual .)ReadyNAS Replicate allows data from one ReadyNAS system to be replicated to andrestored from another ReadyNAS system. Using a centralized web portal, you can create, manage, and monitor backup and restore tasks that operate across ReadyNAS systems from multiple locations.Web browserWAN ReadyNAS Remotereplication webapplicationReadyNAS ReadyNAS WANDispatch jobPeer-to-peer Gather reports system systemFigure 1. Create and manage jobs using ReadyNAS ReplicateAlthough replication and restore tasks happen between ReadyNAS systems, the central management portal gives you full control over every aspect of the process.Use the central management portal to control data on your ReadyNAS systems from anywhere.The management portal runs in the cloud and dispatches tasks to your ReadyNAS systems where the replication or restore job runs. You can use it to schedule jobs, immediately store and restore data, disable and resume jobs, and view consolidated reports.You can restore a single file by date from one ReadyNAS system to another from anywhere with no need to download and copy the file, and no need for remote access to the network.InstallationReadyNAS Replicate is compatible with the following ReadyNAS storage systems:•RAIDiator 5.3 systems:•Duo v2•NV+ v2•RAIDiator 4.2 systems:•Ultra 2/4/6•Ultra Plus 2/4/6•Pro 2/4/6•1500•2100•3100•3200•4200To use ReadyNAS Replicate, you need the following:•Two or more ReadyNAS systems on your network•ReadyNAS Remote add-on• A ReadyNAS Remote account• A valid license key for ReadyNAS ReplicateYou can obtain a ReadyNAS Remote account through the ReadyNAS Remote agent you install on your Windows or Mac computer, or you can create one during the ReadyNAS Replicate installation process.You can obtain a ReadyNAS Replicate license key from a reseller or through a link on the application. If you do not have a license key, you can register for a 45-day trial period, after which a permanent ReadyNAS Replicate license is required. If you do not have a valid license key, you are denied access to ReadyNAS Replicate.To install ReadyNAS Replicate:1. Ensure that the ReadyNAS Remote add-on is installed on each ReadyNAS system.For more information, see the ReadyNAS Remote Add-on Manual.2Install the ReadyNAS Replicate Add-on as follows:If your ReadyNAS storage system is running RAIDiator 4.2 firmware, follow these steps:a Log in to the ReadyNAS system’s FrontView management console.b.Select Add-ons > Available.c.Scroll down to the ReadyNAS Replicate pane and click the Install button.A progress bar shows the download process. When the download completes, apop-up window notifies you.d.Click the OK button.The add-on now appears on the Installed Add-ons window.e.Select Add-ons > Installed and scroll down to the ReadyNAS Replicate pane.ReadyNAS Replicate is ready to use if the Manage ReadyNAS Replicate button is active. If it is not, select the ReadyNAS Replicate button and click Save. The Manage ReadyNAS Replicate button activates.If your storage system is running RAIDiator 5.3 firmware, follow these steps:a In Dashboard, select Configure > Add-ons.A window displays showing all available add-ons.b.Scroll down to the ReadyNAS Replicate pane and click the Get button.A dialog box displays when the add-on installation finishes.c.Click the OK button.The add-on now appears on the Installed Add-ons window.d.Click the Installed button and scroll down to the ReadyNAS Replicate pane.3Click the Manage ReadyNAS Replicate button to enable replication for this ReadyNAS system.You are prompted to enter a license key.If your storage system is behind an HTTP proxy server, the license and user registration process is not available until you enter the proxy setting. Follow these steps:a Click the Advanced Settings button.The configuration tab is enabled.b.Click the Configuration tab.plete the required fields.d.Click Apply Settings.The settings are saved.4Enter the license key and click the Update License button.A valid license key auto-populates your account information. This account is used toadminister the application on the storage system.If you do not have a license, do one of the following:• Purchase a license using the Click here to purchase a license link.• Purchase a license from your reseller.• Click the 45 day trial button to use the product without entering a key.If you purchase a license, an email confirmation with the license key is sent to you. If you use the trial license and decide to purchase a license, follow these steps after youpurchase a licnese:a Return to this window.b.Enter the valid license key.c.Click the Update License button.You are prompted to enter your ReadyNAS Remote account credentials.5Enter your ReadyNAS Remote account ID and password and click the Register button.Entering your ReadyNAS Remote account credentials registers your storage system so that ReadyNAS Replicate can display information about it in the management portal.If you do not have a ReadyNAS Remote account, click the link and follow the prompts to create one.2 2. Replicate and Restore DataThis chapter covers the following topics:•Access the Web Management Console•Replicate• RestoreAccess the Web Management ConsoleUse the ReadyNAS Replicate web management console to manage replication and restoration jobs between your ReadyNAS systems.To log in to ReadyNAS Replicate:1. Using a browser, navigate to .2Enter your ReadyNAS Remote ID and password.The ReadyNAS Replicate application launches.3Select Views > Network.The Replicate Home window displays.From here, you can see and manage all the registered devices on the network.ReplicateWhen a replication job first runs, all the data from the source ReadyNAS system must be replicated to the remote ReadyNAS system. The next time the job runs, only data blocks that have changed are sent to the remote ReadyNAS system. For this reason, the first replicate job might be much larger than later, incremental replicate jobs.If you are replicating large amounts of data from your source ReadyNAS system, if possible, break up a larger replication job into smaller pieces and stagger the schedule. Perform the initial replication job and also the first few incremental replication jobs on the same LAN to get an idea of how large your incremental replication jobs will be.The snapshot feature allocates storage space for the replication job to make sure that the source data and replication data are synchronized at the time of the replication job. You can specify how much of the snapshot reserve you want to use for the snapshot that is taken when a job runs and then released when the job completes. Snapshots ensure that the data replicated on the remote system is consistent with the data on the source system at the time that the replication job is run.Note:ReadyNAS Duo v2 and NV+ v2 do not support snapshots.The snapshot reserve is the amount of disk space that is shared by all active snapshots on the volume. The default snapshot reserve is 10 GB; however, NETGEAR recommends that you allocate up to 5 percent of your storage capacity.New files being written to the ReadyNAS system do not affect snapshot reserve space;however, files that are modified or deleted do. Logical unit numbers (LUNs) in particular use up snapshot reserve space as any data written to the LUN, including new files, use snapshot reserve space.If you do not use snapshots, then files in use during the replication job are not updated at the remote site. If this happens, the job is shown to have failed, but the logs show that only files in use were not replicated. Typically, most files are copied, and in the next run of the job, the files that were not replicated are included in the replication job.Replicate DataReadyNAS Replicate allows you to replicate data at the individual folder level.To replicate folder data:1. Select Tools > Backup Data.2. From the Backup From drop-down menu, select the device and the folder to back up.3. From the Save To drop-down menu, select the destination where you want to copy the data.If needed, click the New Folder button to create a folder for it.4. Specify the schedule for the replication job.a.Select the date you want the backup to take effect.b. From the Repeat drop-down menu, select one of the following:• Hourly• Daily• Every Weekday• Monthly• Custom5Click Next.A preview window displays.6(Optional) Edit the Snapshot size setting.Specify how much of the snapshot reserve you want to use for the snapshot that is taken when a job runs and then released when the job completes. The Snapshot size value is set to 10 GB by default.7(Optional) Edit the Limit revisions setting.You can save all versions of files in your backup or you can specify the number ofrevisions to keep. The Limit revisions field is set to unlimited by default.8(Optional) Clear the Compression check box.Compression is enabled by default.For replication jobs running on the same LAN, disable compression becausecompression slows the transfer speed.For WAN replication jobs, enable compression to keep the link from becoming abottleneck. When scheduling jobs over the WAN, make sure that the link speed can allow the job to complete before the next job begins.9Click Apply.Your changes are saved and the job is added to the list of scheduled jobs.10. (Optional) Select Views > Jobs.A list of scheduled jobs displays.Replicate a SystemReadyNAS Replicate allows you to replicate an entire system. The process is similar to replicating folders.ReadyNAS Replicate supports replicating data at the system level only between ReadyNAS storage systems running similar firmware. For example, you can replicate system data between any two ReadyNAS systems running RAIDiator 5.3 firmware, but you cannot replicate system data between one ReadyNAS system running RAIDiator 5.3 firmware and another system running RAIDiator 4.2 firmware.For a complete list of supported systems and the firmware they run, see Installation on page 6.To replicate system data:1. Select Tools > Backup System.2. In the Backup From drop-down menu, select the source system.3. In the Save To drop-down menu, select the destination folder in which to copy the data.If needed, click the New Folder button to create a folder.4Click Next.A schedule window displays.5In the Effective from field, select a date.6From the Repeat drop-down menu, select one of the following:• Hourly• Daily• Every Weekday• Monthly• Custom7Click Next.A preview window displays.8(Optional) Edit the Snapshot size setting.Specify how much of the snapshot reserve you want to use for the snapshot that is taken when a job runs and then released when the job completes. The Snapshot size value is set to 10 GB by default.9(Optional) Edit the Limit revisions setting.You can save all versions of files in your backup or you can specify the number ofrevisions to keep. The Limit revisions value is set to unlimited by default.10(Optional) Clear the Disable compression check box.Compression is enabled by default. For replication jobs running on the same LAN,disable compression, because compression slows the transfer speed.For WAN replication jobs, enable compression to keep the link from becoming abottleneck. When scheduling jobs over the WAN, make sure that the link speed can allow the job to complete before the next job begins.11Click Apply.Your changes are saved and the job is added to the list of scheduled jobs.12. (Optional) Select Views > Jobs.A list of scheduled jobs displays.RestoreRestoring replicated data is similar to the process for replicating it.Restore DataUse this option to restore data at the individual folder level.To restore data:1. Select Tools > Restore Data.2From the Restore drop-down menu, select the device with the data you want to restore.3. From the Data drop-down menu, select the restoration job to restore.If you want, you can select a different device from the Alternative drop-down menu.4. Click Apply.The data is restored.Restore a SystemUse this option to restore data at the system level.ReadyNAS Replicate supports restoring data at the system level only between ReadyNAS storage systems running similar firmware. For example, you can restore system databetween any two ReadyNAS systems running RAIDiator 5.3 firmware, but you cannot restore system data between one ReadyNAS system running RAIDiator 5.3 firmware and another system running RAIDiator 4.2 firmware.For a complete list of supported systems and the firmware they run, see Installation on page 6.To restore system data:1. Select Tools > Restore System.2. From the Restore drop-down menu, select the device with the data you want to restore.3. From the Data drop-down menu, select the backup job to restore.If you want, you can select a different device from the Alternative drop-down menu.4. Click Apply.The system data is restored.3 3. Manage Replication JobsThis chapter covers the following topics:•Monitor the Network•View and Manage Jobs•Monitor Jobs•Run Job ReportsMonitor the NetworkThe ReadyNAS Replicate home window lists each system registered on the network and the status of each.Figure 2. ReadyNAS Replicate home windowThe top panel shows the following information:• Device name• Each volume in the device• Total size of each volume in the device• Amount of space used on each volumeThe bottom panel shows the following information:• Device name• RAIDiator firmware version• Device model• Free space on the device• Total size of all volumes on the device• Total space used on all volumes on the deviceView and Manage JobsThe Jobs view provides an easy way to add and delete restoration jobs. After a job is created, ReadyNAS Replicate runs that job based on the schedule defined for that job.To view and manage jobs:1Select Views > Jobs.A list of backup jobs displays.2(Optional) Manage the jobs using the icons next to each job, as follows:•Disable a job. Click the red icon.•Re-enable a disabled job. Click the red icon again.•Edit a job. Click the middle icon.•Delete a job. Click the blue X icon.Monitor JobsThe Monitor view allows you to view the status of pending and active restoration jobs. Active jobs are currently running, while pending jobs are the next occurrences of scheduled jobs. If you want, you can run a job immediately from the Monitor view.To monitor jobs:1Click Views > Monitor.A list of active and pending jobs displays. Active jobs are currently running, while pendingjobs are the next occurrences of scheduled jobs.2(Optional) Manage active and pending jobs using the icons next to each job, as follows:•Skip the next occurrence of a scheduled job. Click the red icon.•Return a skipped job to an enabled state. Click the red icon again.•Immediately run a job. Click the blue play button.Run Job ReportsAt your request, ReadyNAS Replicate generates reports that show the outcome of a scheduled job.To run a report:1. Select Views > Reports.2Select a job from the drop-down menu.A detailed progress report runs automatically.3Click a + icon to see details about the job.If a job fails, a generated report shows where the problem occurred.。

Yield potential yield stability__ and stress tolerance in maize

Yield potential,yield stability and stress tolerance in maizeM.Tollenaar *,E.A.LeeDepartment of Plant Agriculture,Crop Science Building,University of Guelph,Guelph,Ont.,Canada N1G 2W1Received 3February 2002;accepted 7February 2002AbstractAverage commercial maize yield in the US has increased from about 1Mg/ha in the 1930s to about 7Mg/ha in the 1990s.Although the increase has been the result of both genetic and agronomic-management improvements,we contend that most of this improvement is the result of the genotype Âmanagement interaction.The genetic improvement in maize yield is associated neither with yield potential per se,nor with heterosis per se,but it is associated with increased stress tolerance,which is consistent with the improvement in the genotype Âmanagement interaction.The potential for future yield improvement through increased stress tolerance of maize in the US is large,as yield potential is approximately three times greater than current commercial maize yields.The mechanism by which maize breeders have improved stress tolerance is not known,but we speculate that increased stress tolerance may have resulted from the selection for yield stability.Stability analyses were performed on a number of high-yielding maize hybrids,including three hybrids that have been involved in some of the highest maize yields recorded in producers'®elds,to examine the relationship between yield and yield stability.Results of the stability analyses showed that high-yielding maize hybrids can differ in yield stability,but results do not support the contention that yield stability and high grain yield are mutually exclusive.#2002Published by Elsevier Science B.V .Keywords:Zea mays L.;Genetic improvement;Yield potential;Yield stability;Stress tolerance1.Factors associated with grain yield improvement in maizeIn the last 60years,mean commercial maize grain yields in the US have increased from about 1Mg/ha in the 1930s to about 7Mg/ha in the 1990s (Troyer,1990).Traditionally the improvement in grain yield has been attributed to both genetic gains made by plant breeders and adoption of improved agronomic prac-tices.The total yield improvement of 6.0Mg/ha (Fig.1)could be partitioned into 60%(i.e.,3.6Mg/ha)from plant-breeding efforts (Duvick,1992)and40%(i.e.,2.4Mg/ha)from improved agronomic prac-tices (Cardwell,1982).The simple partitioning of yield improvement into a genetic and an agronomic component assumes the lack of interaction between the two components.However,a comparison of maize hybrids from different eras grown at different plant densities (i.e.,plant density represents the agronomic-management factor that changed most during the past six decades)showed a strong interaction between genetics and agronomics (Duvick,1997).Grain yields of 1930s hybrids grown at 10,000and 79,000plants/ha did not differ signi®cantly (i.e.,A C in Fig.1)and yield of 1990s hybrids did not differ from that of 1930s hybrids when grown at 10,000plants/ha (i.e.,A E in Fig.1).This indicates that most of the yield improvement in US maize hybrids from the1930sField Crops Research 75(2002)161±169*Corresponding author.Tel.: 91-519-8244120;fax: 91-519-763-8933.E-mail address:mtollena@uoguelph.ca (M.Tollenaar).0378-4290/02/$±see front matter #2002Published by Elsevier Science B.V .PII:S 0378-4290(02)00024-2to 1990s may have been the result of an improved genetic Âagronomic-management interaction,rather than the result of either genetic and/or agronomic improvement per se.Grain yield potential per plant of US maize hybrids does not appear to have increased between 1930and 1990.Yield potential of a cultivar or hybrid has been de®ned as the yield of a cultivar or hybrid when grown under non-limiting abiotic and biotic conditions in an environment to which it is adapted (Evans and Fischer,1999).Grain yields of US maize hybrids from the 1930s to 1990s did not differ when plants were grown widely spaced,i.e.,under conditions when the com-petition among plants for resources such as incident solar radiation,soil nutrients,and soil moisture among plants was negligible (Duvick,1997).When plant density was increased from 1.0to 7.9plants/m 2,grain yield per unit area increased from about 4.5to 12Mg/ha for 1990s hybrids,but grain yield per unit area remained about 4.5Mg/ha for 1930s hybrids (Duvick,1997).Hence,grain yield per plant was 450g for both 1930s and 1990s hybrids when resources were non-limiting,and grain yield per plant declined to 55g for 1930s hybrids and to 150g for 1990s hybrids when resources became limiting.Stated differently,differ-ences in grain yield per plant between 1930s and 1990s hybrids become smaller when resources for plant dry matter accumulation become less limiting (Fig.2).Potential rates of three important physiological processes that underlie plant yield have remained unchanged.First,leaf photosynthetic rate at saturating irradiance (P max )at around silking was actually higher in a hybrid released in Ontario during the 1950s (i.e.,Pride 5)than in two hybrids released in Ontario during the late 1980s and the early 1990s (i.e.,Pioneer 3902and Cargill 1877)(Ying et al.,2000).Similarly,a comparison of the leaf photosynthetic rates of US Corn Belt maize era hybrids showed no differences in P max around silking (Tollenaar et al.,2000).Second,leaf area per plant of Corn Belt hybrids from the 1930s to 1980s has remained fairly stable (Crosbie,1982;Duvick,1997),although leaf area index (LAI)has increased from the 1930s to 1990s because newer hybrids are grown at higher plant densities than older hybrids.Third,the harvest index of commercial maize hybrids has remained approximately 50%during the past seven decades (Tollenaar et al.,1994).Differ-ences in harvest index among hybrids representing different eras have been reported (Russell,1985),but differences were apparent only when hybrids were grown at high plant population densities (i.e.,under a relatively high stress level).Maize yield improvement since the introduction of maize hybrids does not appear to be associated with heterosis.Yields were stagnant during the era of open-pollinated maize cultivars and following the introduc-tion of hybrids yields increased at a mean rate 0.1Mg/ha per year (Tollenaar et al.,1994).The ®rst maize hybrids in the 1930s yielded about 15%higher than high-yielding open-pollinated varieties and approxi-mately 60%of the yield of 1930s single crosseswasFig.1.Mean grain yield of maize grown in producers'®elds in the US from the 1930s to 1990s (AB)and the hypothetical contribution of the genetic (CB)and agronomic management (DC)components of the improvement during this period.162M.Tollenaar,E.A.Lee /Field Crops Research 75(2002)161±169attributable to heterosis (Duvick,1999).The absolute amount of heterosis as a portion of F1yield has remained stable from the 1930s to 1990s and,conse-quently,heterosis as a percent of F1yield has been declining (Duvick,1999).Heterosis per se does not appear to have contributed to the yield improvement of US hybrids from the 1930s to 1990s.Yield improvement in maize has been associated with increased stress tolerance (Duvick,1977,1984,1992,1997;Tollenaar et al.,1994,2000)and the increase in stress tolerance may have resulted,in part,from the selection for increased yield stability.There was a shift in hybrid evaluation philosophy that occurred in the early 1980s in North America.Instead of emphasising relatively high precision per location at a few locations the evaluation procedure empha-sised relatively low precision at a large number of locations (Bradley et al.,1988).This shift encom-passed an increase in the number of locations and years and a change in the type of location.In addition,hybrid evaluation occurred under conditions that re¯ected the changes in management practices (e.g.,increase in plant density).The type of environments shifted from high-yielding environments to environ-ments that are most likely to occur in commercial maize production,including stress environments.This shift occurred because maize-breeding companies were interested in identifying widely adapted maize hybrids (Bradley et al.,1988),thereby increasing yield stability.Duvick (2001,mun.)has suggested another important reason for the continuing increase in stability and stress tolerance.Maize breeding has depended heavily on recycling successful inbred lines through pedigree breeding,with breeders using inbred lines from the most popular hybrids as parents of the next generation.The most popular hybrids were those that were high yielding and dependable in producers'®elds.Consequently,maize producers were doing yield testing on a very large scale of parents that the breeders used to make the next generation of inbred lines.The objective of this paper is to examine the inter-relationship between yield potential,stress tolerance and yield stability in maize.`Yield potential'refers to the performance of a plant when resource capture and utilisation are not limiting.`Stress'is de®ned as any factor that reduces either resource capture or utilisa-tion.Therefore by de®nition,`stress tolerance'is a measure of the ability to mitigate the impact of stress on the physiological processes involved in resource capture (e.g.,nutrient uptake,absorption of incident solar radiation)and utilisation (e.g.,rate of leaf photo-synthesis,rate of dry matter accumulation).The slope between resources per plant and grain yield per plant (Fig.2)will decline when stress tolerances increases until the absence of one or more resources limits resource capture or utilisation.The difference between yield potential and actual yield within anenvironmentFig.2.Grain yield per plant of US Corn Belt hybrids during 1930s (solid line)and 1990s (dashed line)as a function of plant density or the relative availability of resources per plant.Data adapted from Duvick (1997).M.Tollenaar,E.A.Lee /Field Crops Research 75(2002)161±169163represents the potential contribution of stress tolerance to yield improvement.As actual yield approaches yield potential,genotypes are considered to be more stress tolerant.`Yield stability'is a measure of the ability of a genotype to maintain relative performance across a wide range of environments.The environ-ments frequently represent`environments that are most likely to occur for the genotype',but the actual nature of the stresses and stress levels in these envir-onments are not known.Therefore,stress tolerance is an expression of physiological mechanisms that the plant uses to cope with one or more stresses,and yield stability measures the outcome on economic yield of all stresses encountered during the life cycle of the crop.2.Yield potentialFew estimates of crop yield potential have been reported in the scienti®c literature.Loomis and Amthor(1999)stated that although achieving high yield is conceptually simple(i.e.,``maximise the extent and duration of radiation interception;use the captured energy in ef®cient photosynthesis;parti-tion the new assimilates in ways that provide optimal proportions of leaf,stem,root,and reproductive struc-tures;and maintain those at minimum cost''),the processes involved are complex.An estimate of the theoretical yield potential of about25Mg/ha has been reported for maize grown under conditions encoun-tered in central North America(Tollenaar,1983).This estimate was based on mean daily incident solar irradiance during the growing season and a number of assumptions:(i)leaf photosynthetic ef®ciency is 0.067mol CO2per mole photon or a4.4%ef®ciency of conversion of intercepted photosynthetic active radiation into crop biomass;(ii)full light interception between1July and30September and some simplify-ing assumptions about light interception before and after this period;(iii)50%harvest index;and(iv)roots constitute10%of total crop dry matter at physiolo-gical maturity.This estimate is similar to several high yields obtained by maize producers.Maize in these ``record''yield reports was grown under conditions and availability of resources(e.g.,incident solar radia-tion,and soil moisture)similar to those experienced by maize producers in central North America.We will discuss four of those reports;note that all yields cited herein are reported at0%grain moisture.(i)A grain yield of19.7Mg/ha was reported in the early1970s for maize grown in a producer's®eld in Michigan from 26April to30September(Anonymous,1977).(ii)A maize producer in Illinois recorded a15-year mean maize yield of14.5Mg/ha from the early1970s to the middle1980s and a yield of19.6Mg/ha was recorded with the hybrid FS854on a0.41ha®eld in1985 (Warsaw,1985).(iii)Grain yield of19.4Mg/ha was recorded in1998and1999for maize grown near Rougemont,Que.(A.Dedreu,mun.,Syn-genta,Arva,Ont.,Canada).In1998,the Syngenta hybrid Max357was seeded on23April at a plant population density of77,900plants/ha and harvested on21October and in1999,the same hybrid was seeded on29April at a plant population density of 92,600plants/ha and harvested on16October.The crop rotation for the®elds was maize,soybean,and wheat that were underseeded with red clover.(iv) Grain yield of20.9Mg/ha was recorded for maize grown near Manchester,IA,which was obtained from a harvested area of0.5ha that was within a2ha®eld (Murrell and Childs,2000;mun.,National Corn Growers Association,St.Louis,MO,US).The hybrid Pioneer34G81was seeded on29April1999at a plant population density of110,000plants/ha and harvested on October1999.The®eld had been con-tinuously in maize production during the past30years. We contend that these four maize yields represent a fair estimate of the yield potential of maize in central North America as cultural management practices used were similar to those practised by maize producers in this area during the latter part of the20th century. Reported maize yields of about20Mg/ha are about three times greater than the average commercial yield of about6±7Mg/ha between1980and2000in central North America,but are below the theoretical yield potential of25Mg/ha(Tollenaar,1983).In order to achieve a yield of20Mg/ha,mean photosynthetic ef®ciency of the maize canopy should be about 3.5%,assuming that light interception and dry matter partitioning are similar to the values used in the estimate of the theoretical yield potential.A mean photosynthetic ef®ciency of3.5%is high,but it is plausible,as we have reported an ef®ciency of6.4% for a30-day period bracketed by silking for maize grown under controlled-environment conditions,with164M.Tollenaar,E.A.Lee/Field Crops Research75(2002)161±169a mean maize yield of11.5Mg/ha in a4-year growth room experiment(Tollenaar and Migus,1984).If current maize hybrids can yield20Mg/ha,increasing yield potential does not appear to be a good strategy in the genetic improvement of maize.3.Stress toleranceGenetic yield improvement of North American maize hybrids from the1930s to the1990s appears to be associated with improved stress tolerance.It has been known for several decades that newer maize hybrids are more tolerant to high plant population density.Improved tolerance to stresses such as weed interference,low soil N,and low soil moisture has been reported more recently for maize hybrids grown in Ontario from the1950s to1990s(Tollenaar and Wu, 1999).In addition,leaf photosynthesis(i.e.,P max)in newer Ontario hybrids is more tolerant than in older Ontario hybrids to low night temperatures during the grain-®lling period(Ying et al.,2000).Interestingly, improved late-season cold tolerance has also been observed in hybrids developed for the central US Corn Belt(Tollenaar et al.,2000).These observations indi-cate that there may be a common mechanism that improves the tolerance to a variety of stresses.This contention is further supported by the observation in tropical maize that populations selected for mid-sea-son drought stress exhibited a concomitant increase in the tolerance to N stress(La®tte and Edmeades,1995; BaÈnziger et al.,1999).The physiological basis of increased stress tolerance in maize has not been elucidated and,indeed,it is curious how any mechan-ism could confer tolerance to such a diverse set of abiotic stresses.4.Yield stability4.1.IntroductionStability can be de®ned as either static or dynamic (Becker and Leon,1988):in static stability,the per-formance of a genotype remains unchanged regardless of the environmental conditions and in dynamic sta-bility,a genotype changes in a predictable manner across a wide range of environmental conditions (Fig.3).Static stability is an absolute measure.Yield of a genotype across a range of environments is expressed regardless of the performance of other genotypes under evaluation.Dynamic stabilityonFig.3.Yield response of a maize hybrid grown across a range of environments in comparison to the environmental index,which is the mean yield of a number of hybrids grown in the same environments.In static stability,yield of the hybrid remains relatively constant across a range of low-to high-yielding environments,whereas in dynamic stability,yield response of the hybrid to the environments is similar to the response of the mean yield of hybrids included in the environmental index.M.Tollenaar,E.A.Lee/Field Crops Research75(2002)161±169165the other hand is a relative measure.The environment in¯uences yield of a genotype.The environment is typically de®ned by a common set of genotypes under evaluation and the value assigned to a particular genotype is relative to the yields of other genotypes under evaluation.For the purposes of this paper,we will limit our discussion to dynamic stability and we will use the regression approach of Finlay and Wilk-inson(1963)to assess stability.The Finlay and Wilk-inson's stability analysis uses the mean of all genotypes evaluated in an environment as an environ-mental yield index.Performances of individual geno-types are then regressed(®t to a linear model)against the environmental index.Following the dynamic con-cept of stability,the stability of genotypes with b-values approaching1is by de®nition average.The stability of genotypes with b<1is relatively high and we will call these genotypes``work-horses''.The stability of genotypes with b>1is relatively low and we will call those genotypes``race-horses''.Is there a metabolic cost associated with yield stability and,as a result,are high yield potential and high yield stability mutually exclusive?Jensen and Cavalieri(1983)stated that``many plant breeders feel that stress resistance is negatively correlated with high yield''.Their evaluation of a large data set revealed that the correlation between yield and the b-value of the regression over the environmental index was negative,but the correlation was relatively low (Jensen and Cavalieri,1983).If yield potential and yield stability are negatively associated,commercial hybrids with high yield stability should respond like ``work-horses''and the hybrids used to achieve record yields should behave like``race-horses''.To the best of our knowledge,maize hybrids utilised in the reported record yields in producers'®elds described above have not been evaluated for yield stability in terms of the``work-horse''vs.``race-horse''response. Hence,we carried out a survey to evaluate whether there is an association between yield stability as de®ned by the b-value of a linear regression analysis and the apparent yield potential of maize hybrids.4.2.Materials and methodsRegression analysis as described by Finlay and Wilkinson(1963)was used to calculate phenotypic stability(b-value)for a number of hybrids.Phenotypic stability(b-value)for a hybrid is the slope of a linear regression of the yield of that hybrid at a given location against the mean yield of all hybrids grown at the location.The mean yield of a hybrid was expressed as a percent of mean yield of the location to characterise its relative yield level.The average b-value for a group of hybrids is1.0,whereas a hybrid with a b>1:0has less than average stability and b<1:0greater than average stability.Stability analyses were performed on®ve data sets. Entries in each of the data sets were grown in multi-location yield tests across at least2years.In general,at each location entries were grown at commercial plant densities in plots consisting of5±6m long rows, 0.76m between rows,and replicated twice.The®rst data set contained entries of the White Food Corn trial conducted across64environments(Darrah et al., 1998,1999,2000).The second data set contained four Zeneca hybrids that were evaluated for grain yield across130environments.The hybrids were (with relative maturity rating in parenthesis):Garst 8600IT(112days MRMR),Garst8590(112days MRMR),Garst8686(108days MRMR),and Garst 8640(108days MRMR).The third data set contained the hybrid FS854and other commercial maize hybrids grown in performance trials conducted by the University of Illinois from1974to1982across 74environments.The fourth data set contained the Novartis hybrid Max357and other commercial maize hybrids that were evaluated across a total of74 environments in1998and1999.The®fth data set contained the hybrid Pioneer34G81and other com-mercial maize hybrids tested across239environments in1998and1999.The environmental index,i.e.,the location yield,was determined by four hybrids in the Zeneca data set and the number of entries varied among locations and years within each of the other four data sets,but the number was always>10. 4.3.Results and discussionOur evaluation of the relative stability of current commercial maize hybrids shows that there is varia-tion among high-yielding hybrids in this character and there is a slight tendency for an inverse relationship between mean yield of the hybrid and its relative yield stability.Among the White Food Corn data set (Table1,hybrid set A),a``race-horse''type hybrid166M.Tollenaar,E.A.Lee/Field Crops Research75(2002)161±169could be identi®ed with a mean yield that was greater than the trial mean yield (Whisand 50AW)and a ``work-horse ''type hybrid could be identi®ed with a mean yield that was lower than the trial mean yield (Dekalb DK665W).However,the yield of one ``race-horse ''type hybrid was not different from the trial mean yield (IFSI90-1)and the yield of one ``work-horse ''type hybrid was greater than the trial mean yield.In the Zeneca data set of four hybrids (Table 1,hybrid set B),the b -value of two hybrids was not signi®cantly different from 1(Garst 8590and Garst 8686),one hybrid was a ``race-horse ''type hybrid (Garst 8640),and one hybrid was a ``work-horse ''type hybrid (Garst 8600IT).The mean yield of the ``work-horse ''type hybrid (Garst 8600IT)was lower than that the mean trial yield and the mean yield of the ``race-horse ''type hybrid (Garst 8640)was not different from the mean trial yield (Table 1).Our results are similar to those reported by Jensen and Cavalieri (1983)in which they evaluated 339elite Corn Belt hybrids and reported that 21%had a b -value signi®-cantly <1.0and 12%had a b -value signi®cantly >1.Their results included hybrids that exhibited a high yield and a high b -value,hybrids that exhibited a low yield and a low b -value,and hybrids that exhibited a high yield and average b -values.Their results showed also that hybrid response varied with geographical region and year of testing.The relationship betweenTable 1Mean grain yield,slope of hybrid yield vs.environmental index (b i ),and standard error of the slope (S.E.)of maize hybrids in ®ve data sets a HybridMean yield (Mg/ha)b i S.E.(A)White Food Corn Pioneer 33948.370.850.08Whisand 50AW 8.43 1.110.05Dekalb DK665W 7.470.890.06IFSI90-18.16 1.130.05LSD (0.05)0.28(B)Zeneca Garst 86409.49 1.110.05Garst 85909.91 1.010.05Garst 86869.33 1.040.05Garst 8600IT 9.060.850.05LSD (0.05)0.64(C)University of Illinois FS 854 6.63 1.020.05(D)Novartis Max 3578.640.940.04(E)Pioneer Pioneer 34G819.170.940.04aThe White Food Corn data set (A)includes 65environments and the overall trial mean was 8.11Mg/ha.The Zeneca data set (B)includes 130environments and the overall trial mean was 9.38Mg/ha.The University of Illinois data set (C)includes 74locations,the Novartis data set (D)includes 74environments,and the Pioneer data set (E)includes 239environments.Fig.4.Yield response of the hybrid Pioneer 34G81vs.the environmental index for maize hybrids grown in 239environments during 1998and 1999(see Table 1).M.Tollenaar,E.A.Lee /Field Crops Research 75(2002)161±169167the b-value and the mean yield of a hybrid was negatively correlated in their study,although the correlation was not high.Results of a stability analysis of three maize hybrids that were used in some of the highest maize yields in producers'®elds that have been reported show that those hybrids are not``race-horse''type hybrids.The three hybrids involved in high yields all have b-values not signi®cantly different from1(Table1).The slope of FS854,the hybrid used by Herman Warsaw in the early1980s,was1.02(Table1,hybrid set C).The slopes of Novartis hybrid Max357,the hybrid used in the high yields reported in Quebec in1998and1999, and Pioneer34G81,the hybrid that yielded20.9Mg/ ha in Iowa in1999,were0.94(Table1,hybrid sets D and E;Fig.4),which is actually signi®cantly smaller than1.0at P<0:15.The mean yields of the two hybrids were both numerically slightly smaller(2%) than their mean environmental index of8.9and 9.4Mg/ha,respectively.Hence,Max357and Pioneer 34G81have a tendency towards being more like a work-horse than a race-horse in this range of envir-onments,but this stability analysis does not allow us to extrapolate to the record yield environments discussed above.However,the results do not support the con-tention that yield stability and high grain yield are mutually exclusive.5.ConclusionsThe increase in commercial maize grain yield in North America from about1Mg/ha in the1930s to about7Mg/ha in the1990s is attributable predomi-nantly to genetic improvement of hybrids.The genetic improvement of maize hybrids during this period has been the result of an improved genotypeÂagronomic-management interaction.(i)Yield per plant in the absence of biotic or abiotic stresses(i.e.,yield poten-tial)has not changed.(ii)Heterosis has not increased. (iii)Current yield potential is at least three times greater than the current average mean commercial yield.(iv)Stress tolerance has increased and there is some evidence indicating that there is a common mechanism that confers tolerance to a variety of stresses.(v)Increased stress tolerance may have resulted,in part,from the trend in commercial breed-ing programs to test and develop hybrids for wide adaptation,which has increased yield stability,and because inbred lines in widely successful hybrids have been the basis for much of the breeding during the past 70years.(vi)Results of stability analyses of hybrids used in some of the highest maize yields that have been reported indicate that high grain yield and yield stability are not mutually exclusive.AcknowledgementsWe thank Mr.J.Wu,Garst Seeds,Dr.E.S.Nafzin-ger,University of Illinois,Mr.A.Dedreu,Novartis, and Dr.C.Zinselmeier,Pioneer Hi-Bred,for releasing results of multi-location yield tests to us.ReferencesAnonymous,1977.Unpublished lea¯et distributed by DeKalb Seed Company.DeKalb,IL.BaÈnziger,M.,Edmeades,G.O.,La®tte,H.R.,1999.Selection for drought tolerance increases maize yields across a range of nitrogen levels.Crop Sci.39,1035±1040.Becker,H.C.,Leon,J.,1988.Stability analysis in plant breeding.Plant Breeding101,1±23.Bradley,J.P.,Knittle,K.H.,Troyer,A.F.,1988.Statistical methods in seed corn product selection.J.Prod.Agric.1,34±38. Cardwell,V.B.,1982.Fifty years of Minnesota corn production: sources of yield increase.Agron.J.74,984±990. Crosbie,T.M.,1982.Changes in physiological traits associated with long-term efforts to improve grain yield of maize.In: Loden,H.D.,Wilkinson,D.(Eds.),Proceedings of the37th Annual Research Conference on Corn and Sorghum,Chicago, IL,December5±9,1982.American Seed Trade Association, Washington,DC,pp.206±233.Darrah,L.L.,Lundquist,R.L.,Hibbard,B.E.,Mbuvi,S.,Poneleit,C.G.,West,D.R.,Bernardo,R.,Betran,F.J.,Pataky,J.K.,Maddux,L.D.,Gordon, B.,Elmore,R.W.,Stenburg, D., Ziegler,K.E.,Wicks III,Z.W.,Thomison,P.R.,Schaafsma,A.,Zhu,X.,Fischer,D.,Henry,R.,Deutsch,J.A.,Benson,D.,1998.White Food Corn1998performance tests.Special Report DA-ARS and Agriculture Experimental Station, University of Missouri±Columbia.Darrah,L.L.,Lundquist,R.L.,Hibbard,B.E.,Mbuvi,S.,Poneleit,C.G.,West,D.R.,Betran,F.J.,Xu,W.,Pataky,J.K.,Maddux,L.D.,Gordon,B.,Elmore,R.W.,Stenburg,D.E.,Wicks III, Z.W.,Beauzay,P.,Thomison,P.R.,Jordan,D.M.,Schaafsma,A.,Lee,E.A.,Ziegler,K.E.,Zhu,X.,Fischer,D.B.,Henry,R.,Deutsch,J.A.,Strissel,J.F.,1999White Food Corn1999 performance tests.Special DA-ARS and Agriculture Experimental Station,University of Missouri±Columbia.168M.Tollenaar,E.A.Lee/Field Crops Research75(2002)161±169。

Atazanavir_198904-31-3_DataSheet_MedChemExpress

Product Name:Atazanavir CAS No.:198904-31-3Cat. No.:HY-17367Product Data SheetMWt:704.86Formula:C38H52N6O7Purity :>98%Solubility:DMSO MethanolMechanisms:Biological Activity:Atazanavir(BMS-232632)is an highly potent HIV-1protease inhibitorPathways:Anti-infection; Target:HIV Pathways:Metabolism/Protease; Target:HIV ProteaseAtazanavir(BMS 232632) is an highly potent HIV 1 protease inhibitor.IC50 value:Target: HIV-1 protease inhibitor Atazanavir sulfate is a sulfate salt form of atazanavir that is an highly potent HIV-1 proteaseinhibitor. It has a pharmacokinetic profile that supports once-daily dosing and has demonstrated a unique resistance profile and superior virologic potency compared with other antiretrovirals in vitro.In subjects with HIV, atazanavir (400 mg once daily) produced rapid and sustained improvements in viral load and CD4 counts in both antiretroviral-naive as well as previously treated patients when used in combination with dual nucleoside reverse transcriptase inhibitor (NRTI) treatment [1].References:[1]. Gianotti N, Soria A, Lazzarin A. Antiviral activity and clinical efficacy of atazanavir in HIV-1-infected patients: a review. New Microbiol. 2007 Apr;30(2):79-88.[2]. von Hentig N. Atazanavir/ritonavir: a review of its use in HIV therapy. Drugs Today (Barc). 2008After intravenous (iv), oral (po) and intraportal (ip) administration of ATV at a dosage of 7 mg/kg,AUCs in HL rats were 12.41, 5.24 and 8.89 microg/mLh, respectively, and we...[]g py g y ()Feb;44(2):103-32.[3]. Wood R. Atazanavir: its role in HIV treatment. Expert Rev Anti Infect Ther. 2008 Dec;6(6):785-96.[4]. Croom KF, Dhillon S, Keam SJ. Atazanavir: a review of its use in the management of HIV-1infection. Drugs. 2009 May 29;69(8):1107-40.[5]. Bentué-Ferrer D, Arvieux C, Tribut O et al. Clinical pharmacology, efficacy and safety ofatazanavir: a review. Expert Opin Drug Metab Toxicol. 2009 Nov;5(11):1455-68.[6]. Atazanavir Caution: Not fully tested. For research purposes onlyMedchemexpress LLC18 W i l k i n s o n W a y , P r i n c e t o n , N J 08540,U S AE m a i l : i n f o @m e d c h e m e x p r e s s .c o m W e b : w w w .m e d c h e m e x p r e s s .c o m。

Nanosized CaCO3 as Hard Template for Creation of Intracrystal Pores within Silicalite-1 Crystal

Nanosized CaCO3as Hard Template for Creation of IntracrystalPores within Silicalite-1Crystal†Haibo Zhu,‡Zhicheng Liu,§Yangdong Wang,§Dejin Kong,§Xiaohong Yuan,§andZaiku Xie*,‡,§School of Chemistry and Chemical Technology,Shanghai Jiao Tong Uni V ersity,800Dongchuan Road, Shanghai200240,China,and SINOPEC Shanghai Research Institute of Petrochemical Technology,1658Pudong Beilu,Shanghai201208,ChinaRecei V ed May22,2007.Re V ised Manuscript Recei V ed July31,2007The silicalite-1crystal with intracrystal pores in the range of50–100nm was synthesized by using the nanosized CaCO3as a hard template.The nanosized CaCO3can be trapped into the silicalite-1crystal during the crystallization process.By means of acid dissolution,the encapsulated nanoparticles were removed,giving rise to the intracrystal pores within the zeolite crystal.Characterization techniques including XRD,TEM,SEM,and N2adsorption provided the detailed information on this hierarchical pore structure.The hydroxyl groups on the surface of CaCO3are essential to taking the hard template effect.The secondary pores within zeolite correspond well to the morphology of the nanosized CaCO3, which conﬁrms the template effect of nanosized CaCO3.These results suggest that using CaCO3as a hard template may be a useful approach for the synthesis of hierarchical porous materials.IntroductionZeolites are the crystalline porous materials with uniform pores in the molecular dimension,as well as a high internal surface,ﬂexible framework,and controllable chemistry, making them widely application in catalysis,puriﬁcation, adsorption,separation,and other industrialﬁelds.1But the small channels and cavities in the zeolite framework,usually in the range of0.5-1.5nm,not only reduce the diffusion of reagents and reaction products through the pore network but also limit the bulk molecules involved the reaction.The ﬁnding of mesoporous materials with pore sizes of2–50nm, such as MCM-41,MCM-48,and SBA-15,may afford an opportunity to overcome this problem.2,3However,the weak acidity and low hydrothermal stability resulting from the amorphous nature of the mesoporous walls dramatically prevent them from being used in practical applications in industrialﬁelds.In an attempt to circumvent such difﬁculty,the construc-tion of mesopore-modiﬁed zeolites with the advantages of microporous and mesoporous materials may show satisfac-tory activity toward some catalytic reactions.4The template-directed method has been exploited to synthesize mesoporous pared to conventional steaming and chemical leaching approaches,this technique provides a route for the formation of mesopores in zeolites in a controllable manner.Carbon-based porous materials,such as carbon black,5 multiwall carbon nanotube,6and carbon nanoﬁber,7are effective templates for the synthesis of mesoporous zeolites. Jacobsen et al.have investigated the synthesis of mesoporous zeolites including ZSM-5,ZSM-11,TS-1,TS-2,and sili-calite-2with a pore size distribution of10–100nm by using carbon black and multiwall carbon nanotubes as mesopore-forming templates.8,9Tao et al.have reported the preparation of zeolite ZSM-5and Y monolith with a bimodal pore structure of uniform mesopores by the templating method using a carbon aerogel of uniform mesopores.10–14An ordered mesoporous aluminosilicate with completely crystal-line ZSM-5wall structure has been successfully synthesized, upon the recrystallization of SBA-15using in situ formed CMK-5as the hard template.15The ZSM-5zeolite with unique supermicropores has been obtained by synthesizing the zeolite using well-ordered mesoporous carbon(CMK-3) as the solid template,and the texture properties of the resulting ZSM-5can be tailored by changing the nature of the(CMK-3)template.16†Part of the“Templated Materials Special Issue”.*To whom correspondence should be addressed.E-mail:xzk@. Fax:862168462283.‡Shanghai Jiao Tong University.§Shanghai Research Institute of Petrochemical Technology.(1)Corma,A.Chem.Re V.1995,95,559.(2)Kresge,C.T.;Leonowicz,M.E.;Roth,W.J.;Vartuli,J.C.;Beck,J.S.Nature1991,352,710.(3)Zhao,D.;Feng,J.;Huo,Q.;Melosh,N.;Fredrickson,G.H.;Chmelka,B.F.;Stucky,G.D.Science1998,279,548.(4)Hartmann,M.Angew.Chem.,Int.Ed.2004,43,5880.(5)Jacobsen,C.J.H.;Madsen,C.;Houzvicka,J.;Schmidt,I.;Carlsson,A.J.Am.Chem.Soc.2000,122,7116.(6)Schmidt,I.;Boisen,A.;Gustavsson,E.;Stahl,K.;Pehrson,S.;Dahl,S.;Carlsson,A.;Jacobsen,C.J.H.Chem.Mater.2001,13,4416.(7)Janssen,A.H.;Schmidt,I.;Jacobsen,C.J.H.;Koster,A.J.;de Jong,K.P.Micorporous Mesoporous Mater.2003,65,59.(8)Kustova,M.Y.;Hasselriis,P.;Christensen,C.H.Catal.Lett.2004,96,205.(9)Schmidt,I.;Krogh,A.;Wienberg,K.;Carlsson,A.;Brorson,M.;Jacobsen,mun.2000,2157.(10)Tao,Y.;Kanoh,H.;Kaneko,K.J.Am.Chem.Soc.2003,125,6044.(11)Tao,Y.;Kanoh,H.;Hanzawa,Y.;Kaneko,K.Colloids Surf.,A2004,241,75.(12)Tao,Y.;Kanoh,H.;Kaneko,K.J.Phys.Chem.B2003,107,10974.(13)Li,W.C.;Lu,A.H.;Schüth,F.Chem.Mater.2005,17,3620.(14)Tao,Y.;Hattori,Y.;Matumoto,A.;Kanoh,H.;Kaneko,K.J.Phys.Chem.B2005,109,194.(15)Fang,Y.M.;Hu,H.Q.J.Am.Chem.Soc.2006,128,10636.(16)Yang,Z.;Xia,Y.;Mokaya,R.Ad V.Mater.2004,16,727.1134Chem.Mater.2008,20,1134–113910.1021/cm071385o CCC:$40.75 2008American Chemical SocietyPublished on Web12/01/2007Recently,the mesoscale polymer template route has been developed to fabricate hierarchical mesoporous zeolites.The silane functionalized polyethylenimine has shown promise in the synthesis of MFI and FAU zeolites with small intracrystal mesopores and narrow pore size distribution.17 Xiao et al.have demonstrated a facile,controllable,and universal route for the synthesis of hierarchal mesoporous zeolites templated from a mixture of small organic am-monium salt and mesoscale cationic polymer.18Meanwhile, the organosilane-modiﬁed surfactant designed by Choi and colleagues has been found to be effective in synthesizing polycrystalline zeolite assemblies with relatively uniform mesopores that lead to superior performance in the catalytic reactions involving large organic molecules.19–21 Herein,we describe a new method by using a hard template to synthesize silicalite-1with intracrystal pores.The nanosized CaCO3,which is cheap and easily available,is used as the hard template to create the intracrystal pores within zeolite crystal.Experimental SectionMaterials.Hydrophilic and hydrophobic nanosized CaCO3used as a hard template were obtained from Shanghai Yaohua nanotech Corporation(China).The particle size distribution of CaCO3is in the range of50–100nm,and the surface of the hydrophobic CaCO3 is modiﬁed by fatty acid.Aerosil-200(99%,degussa),NaOH(99%), and tetrapropyl ammonium hydroxide(25%,denoted as TPAOH)were commercial available and used in the synthesis without further puriﬁcation.Synthesis of Silicalite-1with Intracrystal Pores.In a typical synthesis of hierarchical porous silicalite-1,6g of the nanosized CaCO3was added to a clear solution of tetrapropylammonium hydroxide,water,and NaOH.The suspension was under strong stirring in order to produce a paste in which the nanosized CaCO3 is highly dispersed.Four grams of Aerosil-200was then slowly added into this suspension.The resulting mixture underwent ultrasonic agitation for10min in order to give the homogeneous dispersion of CaCO3particle into silica gel.Afterward,the homogeneous mixture was vigorously stirred for2h.The resulting mixture of silica gel(0.4TPAOH:0.03Na2O:1SiO2:20H2O)and the nanosized CaCO3was introduced to a Teﬂon-lined steel autoclave for further hydrothermal treatment.The hydrothermal crystallization was carried out at140°C for7days.After the completion of the hydrothermal synthesis,the composite was acid-treated to dissolve the nanosized CaCO3,which released the secondary pores within the crystal.The HCl solution was added to the composite dropwise until the pH value was below6.0and no gas came out from the product.The as-synthesized zeolite was isolated byﬁltration, washed with water,and dried at100°C for2h.The organic structure-directing agent trapped in the pores was thoroughly removed by calcination at550°C for6h.For comparison,the synthesis procedure without the addition of the nanosized CaCO3was also performed in the same condition. Steam Treatment.The hydrothermal stability test was carried out byﬂowing water through the sample hold on a microreactor at 600°C for6h,and the waterﬂow was generated by a pump. Finally,the obtained samples were taken out and dried for XRD characterization.Characterization Methods.X-ray powder diffraction(XRD) patterns were measured on a Bruker diffractometer equipped with a rotating anode and Cu KR radiation.The microstructure charac-terizations were carried out using a JSM-7401F scanning electron microscopy(SEM)operating at5kV.Transmission electron microscopy(TEM)studies were carried out on a Tecnai20S-TWIN instrument using an electron beam generated by a CeB6ﬁlament and an acceleration voltage of120kV.Samples for TEM studies were prepared by dipping a carbon-coated copper grid into a suspension of samples in ethanol that was presonicated.Infrared spectra(IR)data was recorded on a Nicolet5700Fourier Transform Infrared Spectrophotometer;the samples were ground with KBr and pressed into thin wafers.The nitrogen adsorption/desorption isotherms were measured at-196°C on a Micromertitics ASAP 2020M instrument.Before measurement,samples were evacuated overnight at250°C.The BET surface area was calculated from the linear part of the BET plot according to IUPAC recommenda-tions.The mesopore size distribution was analyzed from the nitrogen desorption branch using the BJH model.Results and DiscussionThe X-ray powder diffraction patterns of CaCO3and the silicalite-1/CaCO3composite are shown in Figure1.Dif-fraction peaks located at2θ)23.1,29.4,35.9,39.4, 43.1,47.6,and48.5°clearly reveal that CaCO3belongs to the calcite phase.22The composite of silicalite-1/CaCO3 exhibits two groups of diffraction peaks.The peaks with(17)Wang,H.;Pinnavaia,T.J.Angew.Chem.,Int.Ed.2006,45,7603.(18)Xiao,F.X.;Wang,L.F.;Yin,C.Y.;Lin,K.F.;Di,Y.;Li,J.X.;Xu,R.R.;Su,D.S.;Schlögl,R.;Yokoi,T.;Tatsumi,T.Angew.Chem., Int.Ed2006,45,3090.(19)Choi,M.;Cho,S.H.;Srivastava,R.;Venkatesan,C.;Choi,D.H.;Ryoo,R.Nat.Mater.2006,5,718.(20)Choi,M.;Srivastava,R.;Ryoo,mun.2006,4380.(21)Srivastava,R.;Choi,M.;Ryoo,mun.2006,4489.(22)Wang,C.Y.;Sheng,Y.;Zhao,X.;Zhao,J.Z.;Ma,X.K.;Wang,Z.C.Mater.Sci.Eng.,C2007,27,42.Figure1.XRD patterns of(a)silicalite-1/CaCO3,and(b)nanosized CaCO3.1135Chem.Mater.,Vol.20,No.3,2008Intracrystal Pores within Silicalite-1Crystalhigher intensity are ascribed to the diffraction of calcite,suggesting that CaCO 3is stable enough to resist the hydro-thermal synthesis in alkaline media.In addition,the char-acteristic peaks of silicalite-1emerging at 2θ)7.9,8.8,23.1,24.0,and 24.5°are also detectable in the composite of silicalite-1/CaCO 3.23The comparison of X-ray powder diffraction patterns of the material obtained by the removal of CaCO 3from the silicalite-1/CaCO 3composite and the conventional silicalite-1are shown in Figure 2.After the removal of CaCO 3,the peaks indexed to the crystalline calcite disappear completely.Determined from an EDS mounted on the SEM,the residual content of CaCO 3occluded in zeolite is only about 0.1%,which is negligible.CaCO 3is easily soluble in an acidic medium,even though the weak organic acid such as acetic acid can remove CaCO 3trapped into zeolite.For the reasons stated above,the acid treatment can dissolve the nanosized CaCO 3encapsulated in the crystal,releasing the correspond-ing intracrystal pores within crystal.On the other hand,the characteristic diffraction peaks of silicalite-1become evident in the new material.This new material shows a high level of crystallinity comparable to that of the conventional silicalite-1,which is synthesized in the same conditions without the addition of nanosized CaCO 3.The comparison of X-ray powder diffraction means that the crystallinity of the last product is not remarkably inﬂuenced by the nanosized CaCO 3.The nanosized particles play a decisive role in generating the intracrystal pores within silicalite-1,so the morphology of CaCO 3is important to evaluate the hard template effect.The SEM images in Figure 3give details on its morphology.The low magniﬁcation image shows that the particles are uniform.The SEM image taken at a magniﬁcation of 40000times reveals that the particles exhibit nearly cubic shape and the particle size is in the range of 50–100nm.The results of scanning electron microscopy (SEM)for the hard-template-directed silicalite-1are shown in Figure 4,and the sample appears to be highly crystalline.Estimated from the SEM overview,the average crystal size of sili-calite-1is in the range of 400–800nm.Interestingly,some mesopores and macropores caused by the acid dissolution of CaCO 3that are opening at the external surface of the silicalite-1can be directly observed in the high-magniﬁcation image of the SEM.Such intracrystal pores leading to the surface may promote the diffusion of bulk guest molecules into the internal surface of zeolite.A TEM image is a projection of the mass density encountered by electrons passing through the sample;pores show up as bright areas.Therefore,it is a powerful technique for direct observation of secondary pores in zeolite.24The representative TEM images of the intracrystal-pore-modiﬁed zeolite are shown in Figure 5.The zeolite particles display regular shape in the TEM images.Hence,they should be considered as the single crystals.The TEM images under the high magniﬁcation show that the noncrystallographic pores created by the hard template are clearly visible in the images.The intracrystal pores are different from the regular mesopore structure in typical mesoporous materials and are randomly distributed in a whole crystal.It also can be observed that some noncrystallographic pores are intercon-nected to each other in a single crystal;accordingly,such pore system can be beneﬁcial for efﬁcient mass transport in zeolite crystal.Besides,the shape of the intracrystal pores is consistent with the morphology of cubic-shaped CaCO 3,suggesting that the secondary pore structure imprints the morphology of the nanosized CaCO 3.The TEM images prove that the nanosized inorganic material takes a signiﬁcant template effect on creating secondary pores within zeolite crystal.The N 2adsorption isotherm of the silicalite-1with intrac-rystal pores is shown in Figure 6,and the corresponding pore size distribution is given in the inset of Figure 6.The N 2adsorption isotherm exhibits a steep increase at relatively low pressure (P /P 0)<0.02.This adsorption is interpreted as micropores ﬁlling and capillary condensation.Besides,the N 2isotherm shows a hysteresis loop from P /P 0)0.8to P /P 0)1.This hysteresis loop is relative to the existence of the intracrystal pores.25Relative to conventional ordered mesoporous materials,the pore size distribution of the mesopores in the silicalite-1sample is relatively wide.The pore size distribution is calculated from the desorption branch of the isotherms on the basis of the Barrett–Joyner–Halenda (BJH)model,and the result shows that the pore width is widely distributed in the range of 50–100nm.This result is not only in good agreement with the particle diameter of(23)Van Koningsveld,H.;Jansen,J.C.;van Bekkum,H.Zeolite 1990,10,235.(24)Boisen,A.;Schmidt,I.;Carlsson,A.;Dahl,S.;Brorson,M.;Jacobsen,mun.2003,958.(25)Groen,J. C.;Peffer,L.;A, A.;Pérez-Ramírez,J.MicoporousMesoporous Mater.2003,60,1.Figure 2.XRD patterns of (a)silicalite-1with intracrystal pores,and (b)conventional silicalite-1.1136Chem.Mater.,Vol.20,No.3,2008Zhu et al.the nanosized CaCO 3but also consistent with the pore size directly observed from the TEM image.It is important to note that the pronounced peak at 4nm in the BJH desorption pore size distribution does not suggest real pore,which is due to the tensile strength effect (TSE)of the adsorbed phase.26Quantitatively,the BET total surface area of the sample is 445m 2/g,with micropore and mesopore areas of 215and 230m 2/g,respectively.The total pore volume is 0.40cm 3/g,consisting of micropore volume of 0.10cm 3/g (calculated by the t -plot method of Lipens and de Boer 27)and mesopore volume of 0.30cm 3/g.The micropore volume of this new material is almost same as that of the conven-tional silicalite-1zeolite.28The N 2adsorption isotherm as well as the TEM image result suggest that the intracrystal pores within silicalite-1are caused by the nanosized CaCO 3trapped into the crystal during the zeolization.It is well-known that the drawback of mesoporous and macroporous materials is the low stability and hydrothermal stability,resulting from the amorphous wall.Many methods have been developed to enhance the ability to resist the hydrothermal condition,but most of them are far fromindustrial requirements.29–31To evaluate the hydrothermal stability of this material,we put the sample under steam destruction at 600°C for 6h.The comparison of XRD patterns of the parent sample and the sample treated by steam (see the Supporting Information),indicates that the sample retains the crystallinity at a high level even after steam treatment for a long time.Meanwhile,the intracrystal pores can be also observed in the TEM image.It can thus be concluded that steam treatment at high temperature does not cause signiﬁcant destruction on its structure.Although the intracrystal pores are introduced into the crystal through CaCO 3template,the atom distribution in zeolite still retains a short-range order.The hydrothermal stability can be attributed to the highly ordered crystalline structure.The creation of hierarchal pores in silicalite-1is attributed to the use of nanosized CaCO 3as a hard template.The efﬁciency of the hard template effect largely depends on the surface property of nanosized CaCO 3.Hydrophilic and hydrophobic CaCO 3have been used to conduct the synthesis in the same condition.These two types of nanosized CaCO 3are the same in morphology but different in surface proper-ties.The hydrophobic CaCO 3is produced upon the modi-(26)Groen,J.C.;Pérez-Ramírez,J.Appl.Catal.,A 2004,268,121.(27)Lipens,B.C.;de Boer,J.H.J.Catal.1965,4,319.(28)Li,W.C.;Lu,A.H.;Palkovits,R.;Schmidt,W.;Spliethoff,B.;Schüth,F.J.Am.Chem.Soc.2005,127,12595.(29)Selvaraj,M.;Kawi,S.Chem.Mater.2007,19,509.(30)Kato,M.;Shigeno,T.;Kimura,T.;Kuroda,K.Chem.Mater.2005,17,6416.(31)Kruk,M.;Celer,E.B.;Jaroniec,M.Chem.Mater.2004,16,698.Figure 3.Low-and high-magniﬁcation SEM image of nanosized CaCO 3.Figure 4.Low-and high-magniﬁcation SEM image of silicalite-1with intracrystal pores.1137Chem.Mater.,Vol.20,No.3,2008Intracrystal Pores within Silicalite-1Crystalﬁcation of the surface of hydrophilic CaCO 3by fatty acid.In addition to the vibration modes assigned to calcite structure absorption,the absorption occurring around 2927and 2865cm -1are detected in the IR of hydrophobic CaCO 3(see the Supporting Information).They are due to the characteristic absorption of H -C -H asymmetric and sym-metric stretching vibrations,respectively,which result from the alkyl groups in the fatty acid.The IR data prove that the organic moieties are bound onto the surface of hydrophobic CaCO 3.Because of the difference in surface properties,only the hydrophilic nanosized CaCO 3can work well to yield the intracrystal pores in silicalite-1crystal.In the case of the synthesis using hydrophobic CaCO 3as a template,the last product is the conventional zeolite without the hierarchical pore.The hard template effect of the nanosized CaCO 3may be related to its hydrophilic property.This effect is different from the synthesis of mesoporous zeolite templated by carbon-based porous materials in the previous reports.5,6Because of the pores in carbon materials,the zeolite crystal growth proceeds within the void;subsequently,large zeolite single crystal grows and encapsulates the whole carbon particles.On the contrary,CaCO 3is a solid rather than porous material.However,there is a large number of hydroxyl groups on the surface of the hydrophilic nanosized CaCO 3.These highly active hydroxyl groups can give rise to strong interaction between SiO 2and CaCO 3.Because of this interaction,the nanosized CaCO 3dispersed in the silica gel is encapsulated into the crystal during the crystallization process.Because of the attachment of fatty acid to thesurfaceFigure 5.TEM images of silicalite-1synthesized in the presence of the nanosized CaCO 3.Figure 6.N 2adsorption/desorption isotherm of silicalite-1samples with intracrystal pores,and mesopore size distributions calculated from the adsorption branch by the BJH method.1138Chem.Mater.,Vol.20,No.3,2008Zhu et al.of hydrophilic CaCO3,the active hydroxyl groups may be protected.Therefore,it hinders the interaction between SiO2 and CaCO3.This phenomenon proves that the hydrophilic property of the nanosized CaCO3is essential to taking the template effect.ConclusionsIn conclusion,the preparation of silicalite-1single crystal with intracrystal pores in the range of50–100nm by using the nanosized CaCO3as a hard template is reported for the ﬁrst time.The nanosized CaCO3can be trapped in the silicalite-1crystal during the crystallization process.By means of acid dissolution,the encapsulated nanoparticles are removed and give rise to the intracrystal pores within the zeolite crystal.The hydroxyl groups on the surface of CaCO3 are essential to taking the hard template effect.The combined use of X-ray diffraction,TEM,SEM image analysis,and N2adsorption/desorption proves that the synthesized material exhibits two levels of hierarchy in pore organization.The intracrystal pores correspond well to the morphology of the nanosized CaCO3,which conﬁrms the effectiveness of nanosized CaCO3as a hard template in the creation of secondary pores within zeolite.Hierarchical zeolites combining an intrinsic micropore with an intracrystal mesopore and macropore system has shown unique properties in catalysis and otherﬁelds.32–34Detailed studies of the synthesis,characterization,and catalytic reactivity of such porous zeolites are currently underway. Acknowledgment.We gratefully acknowledgeﬁnancial support from the Major State Basic Research Development Program of the People’s Republic of China(2003CB615802).Supporting Information Available:XRD patterns and IR spectra(PDF).This material is available free of charge via the Internet at .CM071385O(32)Christensen,C.H.;Schmidt,I.;Carlsson,A.;Johannsen,K.;Herbst,K.J.Am.Chem.Soc.2005,127,8098.(33)Christensen,C.H.;Johannsen,K.;Schmidt,I.;Christensen,C.H.J.Am.Chem.Soc.2003,125,13370.(34)Schmidt,I.;Krogh,A.;Wienberg,K.;Carlsson,A.;Brorson,M.;Jacobsen,mun.2000,2157.1139Chem.Mater.,Vol.20,No.3,2008Intracrystal Pores within Silicalite-1Crystal。

AN-IMC-1-001_Integration_of the_Vector_CCP_Driver_with_a_free_CAN_Driver

Integration of the Vector CCP Driver with a free CAN DriverVersion 1.1.406/10/03Application Note AN-IMC-1-001Author(s) Ko,Iz Restrictions Public Document - no restrictions - suitable for web and publication Abstract This application note describes how to integrate the Vector CCP Driver into an ECU and how tointerface it with an existing CAN Driver.Revision historyVersion Author Description1.1.4 Iz Minor changes 1.1.3 Ko Seed & Key / Flash Kernel description changed 1.1.2 Ko Some emphasis changed/added1.1.1 Ko, Iz Some details added, Iz released the document 1.1 Ko Chapter “C Code generation” added 1.0Ko, IzDocumentation startedTable of ContentsCopyright © 2003 - Vector Informatik GmbH1Contact Information: www.vector-informatik.de or +49 (0)711 80670-01.0Overview (3)1.1 Using the CAN Driver.........................................................................................................................................4 1.2 Configuring the CCP Driver................................................................................................................................5 1.3 Writing the Interface Functions for the CCP Driver............................................................................................6 1.4 Integration of the Vector CCP Driver into an ECU .............................................................................................7 1.5 Enabling the Polling Mode..................................................................................................................................9 1.6 Enabling the Synchronous Data Acquisition Mode (DAQ).................................................................................9 1.7 Checksum Calculation......................................................................................................................................11 1.8 Flash Kernel Download.....................................................................................................................................11 1.9 Seed & Key.......................................................................................................................................................11 1.10C Code Generation of Parameters...................................................................................................................12 2.0CCP_TEST Demo example (13)2.1 Integration of the Basic CCP Driver in the ECU...............................................................................................14 2.2 Creation of a new CANape Graph Project .......................................................................................................16 2.3 Adding a Measurement Signal to the Controller Database..............................................................................19 2.4 Measuring Signals in Polling Mode ..................................................................................................................21 2.5 Enabling the Synchronous Data Acquisition Mode (DAQ)...............................................................................23 2.5.1 Using the Synchronous Data Acquisition Mode in CANape Graph...............................................................24 2.5.2 Explaining the Synchronous Data Acquisition Mode.....................................................................................27 2.6 Enabling the Checksum Calculation.................................................................................................................29 2.6.1 Enabling the Checksum Calculation in the ECU............................................................................................31 2.6.2Enabling the Checksum Calculation and the Cache in CANape Graph (31)2.7Enabling “Flash Kernel Download” in the ECU (32)2.7.1Enabling “Flash Kernel Download” in CANape Graph (32)2.8Enabling “Seed & Key” in the ECU (34)2.8.1“Seed & Key” – DLL (35)2.8.2Enabling “Seed & Key” in CANape Graph (36)2.9 C Code Generation for Calibration Data Objects (37)2.9.1Template Files (37)2.9.2Macros (38)2.9.3Template Example (38)2.9.4How to generate a C code file (A) (39)3.0CCP_TEST Demo Sample Files (42)4.0CARD12.D60 Evaluation Board (43)5.0Additional Resources (43)6.0Contacts (44)Application Note AN-IMC-1-001 2Application Note AN-IMC-1-001 31.0 OverviewThis overview summaries in general how to integrate the Vector CCP Driver into an ECU and demonstrates how to interface it with an existing CAN Driver. A free CAN Driver is provided with the CCP Test demo example. Detailed information about integrating the CCP Driver step by step into a Motorola HC12 microcontroller is described in later chapters with the CCP Test demo sample.Note: CANape Graph V4.0 has been used for doing the screen shoots in this application note.The Vector CCP Driver is delivered with three files:• ccp.c : Vector CCP Driver Source Code • ccp.h : Header file for the Vector CCP Driver •ccppar.h : File to configure the Vector CCP DriverThe Vector CCP Driver is configured by editing the ccppar.h file, which contains important definitions like which CRO (Command Receive Object) ID or DTO (Data Transmission Object) ID will be used, the number of DAQ lists, their size etc.The interface between the CCP Driver and the CAN Driver has to be implemented as shown in Figure 1. The application calls the CCP Driver function ccpInit() once, e.g. after the initialization of the CAN Driver. The CAN Driver which is part of the CCP_TEST demo example is delivered for Motorola HC12 microcontrollers, which works in polling mode . This means that the receive buffer of the microcontroller has to be polled by the application cyclically. If a new CRO message arrives, the Vector CCP Driver function ccpCommand() has to be called (see Figure 1).CAN Network ApplicationApplication Network InterfaceSoftwareCCP DriverccpDAQccpInit ccpBackgroundccpCommandccpSend ccpSendCallbackFigure 1: Functional Interface Overview DiagramThe CCP Driver uses the ccpSend() function to send DTO messages to the measurement and calibration system, e.g. CANape Graph. After transmitting a DTO message, the CAN Driver has to call the CCP Driver function4ccpSendCallback(). The CCP driver will not call ccpSend() again until ccpSendCallBack() has indicated the successful transmission of the previous message.Some functions are not included in the ccp.c file and have to be provided by the ECU developer. These functions are described in Section 2.3, Description of Interface Functions of the CCP.PDF documentation provided with the Vector CCP Driver. These interface functions should be written in a separate file, e.g. ccp_can_interface.c.The first step will be to integrate the basic CCP Driver functionality in the ECU (see Chapter 0). If the communication between CANape Graph and the ECU is set up properly, the other CCP options, like the synchronous data acquisition mode, the checksum calculation function can be enabled in further steps (see Section 2.5)1.1Using the CAN DriverIn this chapter the functionality of the provided CAN Driver is introduced. This CAN Driver is operated in the polling mode. The header file boot_can.h has to be included in the main application.The CAN Driver contains the following functions:> ccpBootInit() : Initializes the CAN controller> ccpBootTransmitCrmPossible() : Checks to see if a transmission is possible > ccpBootTransmitCrm() : Transmits a CAN message >ccpBootReceiveCro() : Receives a CAN messageThe following must be done to send a single CAN message with a user-defined ID: a send buffer (unsigned char array) of eight bytes must be defined the send buffer must be initializedccpBootInit (receive_ID, transmit_ID) must be called in the application with a CAN receive and a transmit ID in hex ccpTransmitCrm(send_buffer) must be called Example:5The following must be done to receive a single CAN message with a user-defined ID:a receive buffer (unsigned char array) of eight bytes must be definedccpBootInit (receive_ID, transmit_ID) must be called in the application with a CAN receive and a transmit IDin hex ccpReceiveCro(receive_buffer) must be calledExample:1.2 Configuring the CCP DriverThe ccppar.h file is the most important configuration file for the Vector CCP Driver and must be adjusted by the user for the specific ECU. This file contains many defines like:/*----------------------------------------------------------------------------*//*CCP Data Acquisition Parameters*/;#define CCP_DAQ/*Enable synchronous data acquisition in ccpDaq()*/;#define CCP_MAX_ODT3/*Number of ODTs in each DAQ list*/;#define CCP_MAX_DAQ2/*Number of DAQ lists*/……All the configuration options to be enabled or disabled by the defines are described in the CCP.PDF documentationprovided with the Vector CCP Driver.For a basic CCP Driver implementation onlyCCP_STATION_ADDR, CCP_STATION_ID, CCP_DTO_ID and CCP_CRO_IDhave to be defined.In Section 2.1 the ccppar.h file for the CCP Test demo example will be configured in detail.1.3 Writing the Interface Functions for the CCP DriverThese functions are described in Section 2.3, Description of Interface Functions of the CCP.PDF documentationprovided with the Vector CCP Driver.The functions needed when using the provided CAN Driver are ccpSend(), ccpGetPointer() andccpUserBackground().In the following an excerpt from the delivered ccp_can_interface.c file is shown:6}//-----------------------------------------------------------------------------1.4 Integration of the Vector CCP Driver into an ECUThe following files also have to be included with the application:>ccp.c : Vector CCP Driver>ccp.h: Header file of the Vector CCP Driver>ccppar.h: Header file which configures the CCP Driver>ccp_can_interface.c: Interface functions for the CCP Driver>ccp_can_interface.h: Header file of the interface functions for the CCP DriverThe following steps below are needed to integrate the CCP Driver:the ccppar.h file must be opened with an editor to configure the basic CCP Driverccp.h, ccppar.h, ccp_can_interface.h must be included in your applicationa receive buffer (unsigned char array) of eight bytes must be defined, likeunsigned char receive_buffer[8];ccpBootInit(CCP_CRO_ID, CCP_DTO_ID) must be called in the application (initializes the CAN Driver)ccpInit() must be called (initializes the CCP Driver)check if a new CRO message in receive buffer is available, if so ccpCommand(receive_buffer) must be calledall interrupts must be disabled (protect ccpSendCallBack() function call)check if data transmission is possibleccpSendCallBack() must be calledall interrupts must be enabledthe instructions for the compiler and linker for the ccp.c and ccp_can_interface.c files must be addedThe integration of the CCP Driver in the ECU source code could look like in this example:7Application Note AN-IMC-1-00181.5 Enabling the Polling ModeThe polling mode is supported by the basic CCP command set. This means that if the CCP Driver is integrated inthe ECU, the polling mode can be used immediately.Note: No changes are required in the ECU software.The polling mode has to be selected in the CANape Graph measurement configuration list. The user has to assigna data acquisition rate for each measurement signal (see Figure 2).Figure 2: Configuration of the measurement listCANape Graph automatically sends a request to the ECU according to the selected measurement rates andreceives the measurement signal value as the response from the ECU, e.g. a current counter value etc. In Section2.4 will be showed how the polling data acquisition mode of the HC12 demo example can be enabled.1.6 Enabling the Synchronous Data Acquisition Mode (DAQ)The synchronous data acquisition mode has to be enabled in the ccppar.h file. The needed defines CCP_DAQ,CCP_MAX_ODT, CCP_MAX_DAQ, which must be defined, and the optional defines CCP_SEND_QUEUE andCCP_SEND_QUEUE_OVERRUN_INDICATION which can be enabled, are described in Chapter 3, OptionalFeatures of the CCP Driver in the CCP.PDF documentation provided with the Vector CCP Driver.Application Note AN-IMC-1-0019Application Note AN-IMC-1-001 10The ECU developer has to add ccpDaq(x) function calls in his ECU source code at all the places where the ECU has to transmit the measurement signals (see the example below). This means that the measurement signals which have been assigned previously in the CANape Graph measurement list are sent automatically to CANape Graph during the ccpDaq(x) call. The number “x” represents the channel number used and the value of “x” can be a number between 0x00 and 0xFF.The user has to define the desired “x” channel number for each ccpDaq(x)-call in the program in the “CCP Device Setup” dialog in CANape Graph. Finally, the user has to add the signals to measure from the different tasks in the measurement list and assign them to the correct task. In the example below, the signals a,b and c have to be assigned to Task1_10ms because these signals are used in Task 1. These signals will be transmitted automatically from the ECU to CANape Graph every 10ms, during the ccpDaq(1) call. The signals u, v and w are assigned to Task2_in_event . Each time the specified event occurs, Task 2 is executed and only then the signals u,v and w will be transmitted automatically by the ECU to CANape Graph.Example of an ECU program with two tasks:In Section 2.5 we will see in detail how to enable the synchronous data acquisition mode in our HC12 demosample.Calculation1.7 ChecksumThe use of a cache in CANape Graph optimizes read accesses to the calibration memory of the ECU and isespecially recommended if maps of dynamic size are used. Another benefit of the use of a cache in CANapeGraph is that the calibration engineer can also change parameters if the ECU is offline.When the calibration engineer changes over from the Offline to the Online mode, a checksum is used todeterminate whether the cache in CANape Graph matches the ECU calibration RAM. If it does not match, the useris asked whether an upload or a download should be performed. If the user selects upload, then the contents of thecalibration RAM are loaded from the ECU into the CANape Graph cache. If the user selects download, then thecontents of the CANape Graph cache are copied into the ECU calibration RAM.In order to use the cache in CANape Graph, the ECU needs to be able to calculate a checksum on the calibrationmemory area. The checksum calculation can also be enabled in the ccppar.h file. The needed defines,CCP_CHECKSUM and CCP_CHECKSUM_TYPE, which have to be enabled are described in Chapter 3, OptionalFeatures of the CCP Driver in the CCP.PDF documentation provided with the Vector CCP Driver.In Section 2.6 we will see in detail how to enable the checksum calculation in our HC12 demo sample and how toenable the cache in CANape Graph.1.8 Flash Kernel DownloadThe main task of an ECU is to perform calculations with sensor data or other signals in the RAM, while the mainapplication is stored in the ROM or flash memory of the ECU. In running operation the user is able to change thebehavior of the ECU via changing some parameters with help of an measurement and calibration tool, like CANapeGraph. The general disadvantage is that only RAM data can be changed, data stored in the flash memory can onlybe programmed with special flash routines.To solve this problem it is possible to integrate flash routines into the code of the main ECU application. Thedisadvantage of this solution is that flash memory is wasted unnecessary, because these flash routines are notused very often. Another approach is the usage of a flash kernel. The flash kernel is loaded here by CANapeGraph into the microcontroller’s RAM via CCP whenever the flash memory must be reprogrammed in thecontroller. The flash kernel contains all needed flash routines, its own CAN and CCP driver to communicate via theCAN interface with CANape Graph.In chapter 2.7 we will show how to enable the “Flash Kernel Download” in our HC12 CCP_TEST example.1.9 Seed & KeyThe development engineers are able to protect their ECU from editing parameters or variables by unauthorizedpersons. To enable this protection the “Seed & Key” option has to be enabled in the ccppar.h file.A seed is sent by the ECU to CANape Graph when a connection occurs (switching from Offline to Online Mode).CANape Graph has to calculate the correct key with an special *.dll (see section 2.8) and return it to the ECU.Finally the ECU grants access if the key is correct.In section 2.8 we will see in detail how to enable “Seed & Key” in our HC12 demo sample.Application Note AN-IMC-1-00111Application Note AN-IMC-1-001 121.10 C Code Generation of ParametersThe C code generation is a new feature starting with CANape Graph version 3.1.50 and enables the generation of C code for parameters, curves or maps etc. This feature is very useful when the parameter values were changed during a measurement and calibration session with CANape Graph, and the user whishes consistent data in his C source code.This is an example of “CCP Test” with the a configuration file. The map shown below is stored in the ecu.c source.In Section 2.9 we will see in detail how to generate a C code file with the HC12 demo example.Application Note AN-IMC-1-001 132.0 CCP_TEST Demo exampleIn this section it will be demonstrated how to interface the Vector CCP Driver to an existing CAN Driver using the CCP Test demo example. The CCP Driver will be integrated into a Motorola HC12 microcontroller and step by step the different CCP options will be, like the synchronous data acquisition mode and the checksum calculation. At the same time CANape Graph will be configured to make measurements in the polling mode, in the synchronous data acquisition mode, and the cache will be enabled.All the needed files (e.g. the source code files, CANape Graph project for the CCP Test demo sample) are provided with the CCP Test demo example.The CCP_TEST demo sample simulates an ECU program. The demo example contains some parameters, curves and maps which can be changed by CANape Graph. Some randomized variables, and calculated variables which depend on parameters, are also included in the demo sample. As shown in figure 3, Task 1 is called cyclically all 10 ms from the ECU. Every time Task 1 runs some calculations are performed. The input and output signals are simulated by variables inside the ECU, e.g. ampl, period, channel1, triangle. If the value of an input signal is changed via CANape Graph, the effect can immediately be visualized in CANape Graph.Figure 3 briefly describes the source code files of the CCP Test demo example.Figure 3: CCP Test demo example - Source Code Structure2.1 Integration of the Basic CCP Driver in the ECUThe steps discussed in section 1.4 will be done now to integrate the CCP Driver into the ECU.In the CCP TEST demo sample the basic CCP Driver has to be configured via the ccppar.h file with the followingsettings:Application Note AN-IMC-1-00114Next, the ccp.c source code files and the can_ccp_interface.c file have to be included in the ECU application.Figure 4:Dependencies of the files used in the CCP_Test demo sampleIn the file ccp_test.c the ccpInit() function has to be added to initialize the CCP Driver. The receive buffer of theHC12 is checked in an infinite loop for new CRO messages from CANape Graph. When a new CRO CANApplication Note AN-IMC-1-00115message is received, the function ccpCommand() is called. The ccpCommand() interprets the contents of the CRO CAN message and responds with a DTO CAN message.This completes the integration of the basic CCP Driver in the ECU. Next a new CANape Graph project will be created and then a measurement configuration to acquire measurement data in the polling mode will be configured.2.2 Creation of a new CANape Graph ProjectIn this chapter a new CANape Graph project for the CCP Test demo sample will be created. Then CANape Graph will be started and the HC12 with the CCP Test demo sample will be added in the CANape Graph device list.“Create new project” in the windows start menu in the CANape Graph program folder must be choosen click <Next> and enter a name for your project, e.g. CCP_TESTin the next window a path for your new project must be selectedbe sure the checkbox "Place shortcut on Desktop"is checked;uncheck "Start menu" if necessaryclick <Next>. Do NOT “Start CANape immediately“, but click instead <Finish>on the Windows desktop a new icon with the name of your project has been created:to start CANape Graph double click this iconIn the next step, a new device (ECU) has to be added in the CANape Graph device list:press on the symbol in the CANape Graph toolbar or select the menu commandTools | Device configuration to add a new device in the CANape Graph device listpress the <New> buttonApplication Note AN-IMC-1-00116Application Note AN-IMC-1-001 17enter a name for your device, e.g. HC12_Vectorclick <Next>select the type of the driver used in your device (here: CCP).Select the CCP driver, press the tab key to enter the drivers options and click on the <Driver configuration> buttonCRO-Identifier: enter the ID for the CCP driver (in this example: 100h)DTO-Identifier: enter the ID for the CCP driver (in this example: 101h)ECU-Address: enter the ECU address (in our example: 0)ECU-Format: MotorolaApplication Note AN-IMC-1-00118uncheck "Seed+Key", "Overload detection " and “Enable” from the Checksum area. The tab pageshould now look like this:the CAN channel and the baud rate must be adjusted (e.g. CAN1, 500kBit/s) click <Ok>exit the dialog with <Ok> and click on the <Next> buttonthe default settings on the next dialog page can be used, click on the <Next> buttonthe entry "one map file" has to be selected and select the map file directory with the <Browse> buttonmap file format: select the COSMIC format(our CCP Test demo sample was compiled with the COSMIC C compiler)Application Note AN-IMC-1-001 19enter the name of the map file "ccp_test". The extension is automatically set (the default extension nameis .MAP)Note: A linker map file is needed to create a controller description file (*.db or *.a2l). The linker map file contains all the measurement and calibration objects with their addresses and, depending on the linker map format, also the data type.click <Next>The device configuration dialog displays now a window asking to specify the directory for thedevice’s hex file. Accept the default settings. Click on the <Next> buttonThe Project Wizard displays now a summary of your settings. Click on the <Back> button to go back toprevious pages to correct an entry, or click <Ok> if all the entries are okCANape Graph tries now to get a connection to the ECU and opens a dialog to ask if a database shouldbe imported. Click <No>.Because no ASAP2 database exists, CANape Graph also asks if an empty ASAP2 database should becreated. <Yes> must be selected here.If CANape Graph could go online with the ECU, a new created device is displayed with a green checksymbol in the device configuration listclick <Close>2.3 Adding a Measurement Signal to the Controller DatabaseCANape Graph has created an empty controller database. In this section we will add a measurement signal into the controller database. A measurement signal can be e.g. an output variable from the ECU device. In our example the “Triangle” signal will be added. Other signals and parameters can be added into the ECU controller database in a similar manner. For more details, see the corresponding chapter in the CANape Graph User Manual.Application Note AN-IMC-1-00120To open the controller database with the database editor, the symbol in the toolbar must be clickedRight-click in the right empty space and select “New | Measurement value”a name for the measurement object (here: Triangle) must be entered. A comment can also be entered,e.g. “Triangle test signal used for PWM output”to assign a linker map object to the measurement object “Triangle”, the button <Mapfile> has to be clickedand the correct linker map object must be selected:Application Note AN-IMC-1-001 21select the linker map object: sbyteTriangleclick <Ok>. On the right side the following can be seen:exit the database editor with thesymbol2.4 Measuring Signals in Polling ModeIn this chapter the “Triangle”signal will be added in the CANape Graph measurement list and this data will be acquired in the polling mode. Next a graphic window to display the triangle signal during the running measurement will be configured.the measurement list must be opened with the symbol in the toolbarclick <New signal> and select in the controller database the "Triangle" measurement signal.Press <Apply>Application Note AN-IMC-1-001 22close the controller database window. The “Triangle” measurement signal will now appear in theMeasurement configuration list, be sure that the data acquisition mode is set to “polling” and enter a rate, e.g. 10msclick <Ok>a new graphic window in CANape Graph can be created by right-clicking and selecting the entry “Graphicwindow”the signal "Triangle" can be added by right-clicking the empty graphic window and selecting the entry“Insert measurement signal” the measurement can be started by pressing the F9 key or by clicking thesymbol in the toolbara triangle signal should now be displayed in the graphic window:Figure 5: triangle signal displayed in graphic windowthe measurement can be stopped by pressing the ESC key or the symbol in the toolbar2.5 Enabling the Synchronous Data Acquisition Mode (DAQ)In this section the synchronous data acquisition mode in the CCP Test demo sample will be enabled. In thisexample two DAQ lists with three object descriptor tables (ODT) and the send queue will be used. With thisconfiguration, a maximum of 42 bytes ( 2 * 3 * 7 bytes ) at two different time rates can be measured.The synchronous data acquisition mode has to be enabled in the ccppar.h file:The ccpDaq(x) function calls must be added in the ECU source code in all the places where the ECU has totransmit the measurement signals. In this CCP Test demo sample the ccpDaq(x) function will only be called in oneplace, in the interrupt service routine for Timer_0. The timer interrupt event has been programmed in this exampleto occur every 10 ms, which means that the timer interrupt service routine is also executed every 10 ms.Application Note AN-IMC-1-00123Application Note AN-IMC-1-001 24Now the whole project must be recompiled and the HC12 must be re-program with the new code.2.5.1Using the Synchronous Data Acquisition Mode in CANape GraphIn CANape Graph all the used synchronous data acquisition event channels in the ECU must be defined. Then the measurement mode of the signals must be configured in the measurement list.start CANape Graph with a double click on the CANape icon on your desktopopen the CCP Device Setup dialog with “Tools |Driver configurations…”select the tab “Events”click <Insert> and enter a name for a new synchronous data acquisition event channel (e.g. Task1) withthe channel number 1 (in this example we only use one channel as described before)。

吉玛基因 RNA FISH 试剂盒 SA-Biotin 系统（细胞爬片）说明书

股票代码：430601如有疑问欢迎垂询上海电话：************E-mail：**********************苏州电话：*************E-mail：************************ RNA FISH试剂盒SA-Biotin系统（细胞爬片）说明书股票代码：430601一、检测原理RNA荧光原位杂交（Fluorescence in Situ Hybridization），简称为RNA FISH，是一种重要的非放射性原位杂交技术。

传统的RNA FISH，直接在oligos上标记荧光染料，根据碱基互补配对原则，与待检测的RNA特异结合，通过荧光显微镜检测荧光信号，该方法一般需要20个oligos以上，以便检测到较强较多的荧光信号点。

本系统中SA（链霉亲和素蛋白）是一类四聚体蛋白，大小为66 kDa，每一分子SA能够与四分子生物素进行高度特异性的结合，且两者之间的亲和力较强。

应用该原理，我们将染料Cy3偶联到SA蛋白上，一分子SA能偶联上6个Cy3；同时在探针上标记生物素，将两者在体外进行亲和连接，大约每个SA能与4条Biotin-probe结合，每个SA上有6个Cy3，也就是每一条探针上连接了6个Cy3，因此该方法具有一定的放大信号的作用。

SA-Biotin系统原理示意图股票代码：430601二、组分和保存条件成分容量（50tests）容量（100tests）储存Buffer A（TritonX-100）30μL60μL室温Buffer C（20×SSC）6mL12mL室温Buffer E（杂交缓冲液）8mL16mL室温Buffer F（Tween20）50μL100μL室温DEPC水6mL12mL-20℃DAPI15μL30μL-20℃封闭液100μL200μL4℃SA-Cy350μL100μL4℃股票代码：430601三、试剂配置1.0.1%Buffer A配制：PBS999μL，Buffer A1μL，且每次新鲜配制；2.Buffer C母液为20×，用一级纯水（建议DEPC水）稀释成4×、2×使用；3.0.1%Buffer F配制：4×Buffer C999μL，Buffer F1μL，且每次新鲜配制；4.封闭液为母液，100μL封闭液用1×PBS（PBS建议用DEPC水配制）定容至5mL后可直接使用，4ºC保存；5.SA-Cy3浓度为1μM，即用型试剂；6.DAPI工作液：DAPI原液用PBS1000倍稀释，需避光保存和使用。

美国阿格迪agdia公司转基因检测产品

NPTII检测试纸条
STX74000/0050
50条
2450
阳性质控物
LPC73000
220
8Байду номын сангаас
Bt-Cry1F, ELISA DAS ELISA
内毒素蛋白检测试剂盒
过氧化物酶标记物
PSP10301/0096
96反应孔
2660
PSP10301/0288
288反应孔
4600
PSP10301/0480
480反应孔
6.Bt-Cry1F and Bt-Cry34Ab1货号：STX10900/0050规格：50条报价：2240元
7.Bt-Cry2A货号：STX05801/0050规格：50条报价：1540元
8.Bt-Cry34Ab1货号：STX04500/0050规格：50条报价：1540元
9.Bt-Cry3Bb1货号：STX06100/0050规格：50条报价：1540元
多克隆抗体/多克隆抗体，碱性磷酸酶标记物
PSA05900/0096
96反应孔
2660
PSA05900/0288
288反应孔
4600
PSA05900/0480
480反应孔
7210
PSA05900/4800
4800反应孔
38920
Bt-Cry3AImmunoStrip检测试纸条，必须与SEB4样品提取缓冲液结合使用，请另外购买SEB4缓冲液。
10.mBt-Cry3A货号：STX06700/0050规格：50条报价：1540元
11.neomycin phosphotransferase II货号：STX73000/0050规格：50条报价：2450元

ICD10-第三卷+O-3编码版 (1)

APUD 瘤(M8248/1) - 见肿瘤，动态未定Apudoma (M8248/1) - see Neoplasm, uncertain behaviorā 阿阿斯金瘤(M9365/3) - 见肿瘤，结缔组织，恶性Askin's tumor (M9365/3) - see Neoplasm, connectivetissue, malignantái 癌癌(M8010/3) - 另见肿瘤，恶性Carcinoma (M8010/3) - see also Neoplasm, malignant 注－除在其他处另有说明外，列在下面的癌的形态学类型应按部位以…肿瘤，恶性‟进行编码。

Note －Except where otherwise indicated, the morphologicalvarieties of carcinoma in the list below should be coded by site as for Neoplasm, malignant.－C 细胞(M8345/3)－C cell (M8345/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant －－未特指部位 C73－－unspecified site C73－伴有－with－－顶泌性汗腺化生(M8573/3)－－apocrine metaplasia (M8573/3)－－骨(和软骨)化生(M8571/3)－－osseous (and cartilaginous) metaplasia (M8571/3)－－鳞状(上皮)化生(M8570/3)－－squamous metaplasia (M8570/3)－－软骨(和骨)化生(M8571/3)－－cartilaginous (and osseous) metaplasia (M8571/3)－－梭形细胞化生(M8572/3)－－spindle cell metaplasia (M8572/3)－－纤维化(M8141/3)－－productive fibrosis (M8141/3)－玻璃状细胞(M8015/3)－Glassy cell (M8015/3)－表面扩散性(M8143/3)－superficial spreading (M8143/3)－表皮内(M8070/2) - 见肿瘤，原位－intraepidermal (M8070/2) - see Neoplasm, in situ －－鳞状细胞，鲍恩型(M8081/2) - 见肿瘤，皮肤，原位－－squamous cell, Bowen's type (M8081/2) – see Neoplasm, skin, in situ －表皮样(M8070/3) - 另见癌，鳞状细胞－epidermoid (M8070/3) - see also Carcinoma, squamous cell －－伴有腺癌，联合性(M8560/3)－－with adenocarcinoma, mixed (M8560/3)－－大细胞，非角化的(M8072/3)－－large cell, nonkeratinizing (M8072/3)－－角化的(M8071/3)－－keratinizing (M8071/3)－－梭形细胞(M8074/3)－－spindle cell (M8074/3)－－小细胞，非角化的(M8073/3)－－small cell, nonkeratinizing (M8073/3)－－疣状(M8051/3)－－verrucous (M8051/3)－－原位，鲍恩型(M8081/2) - 见肿瘤，皮肤，原位－－in situ, Bowen's type (M8081/2) - see Neoplasm, skin,in situ －产粘液性(M8481/3)－mucin-producing (M8481/3)－肠型(M8144/3)－intestinal type (M8144/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant －－未特指部位 C16.9－－unspecified site C16.9－成釉细胞(M9270/3) C41.1－ameloblastic (M9270/3) C41.1－－上颌(骨) C41.0－－upper jaw (bone) C41.0－储备细胞(M8041/3)－reserve cell (M8041/3)肿瘤及其形态学编码的字母顺序索引正文A－大细胞(M8012/3)－large cell (M8012/3)－－具有杆状显型的(M8014/3)－－with rhabdoid phenotype (M8014/3)－－鳞状细胞(M8070/3)－－squamous cell (M8070/3)－－－非角化的(M8072/3)－－－nonkeratinizing (M8072/3)－－－角化的(M8071/3)－－－keratinizing (M8071/3)－－小细胞(M8045/3)－－small cell (M8045/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C34.9－－－unspecified site C34.9－单纯(M8231/3)－simplex (M8231/3)－胆管(M8160/3)－bile duct (M8160/3)－－伴有肝细胞癌，联合性(M8180/3) C22.0－－with hepatocellular, mixed (M8180/3) C22.0－－肝 C22.1－－liver C22.1－－特指部位 NEC - 见肿瘤，恶性－－specified site NEC - see Neoplasm, malignant －－未特指部位 C22.1－－unspecified site C22.1－导管(细胞)(M8500/3)－duct (cell) (M8500/3)－－伴有佩吉特病[乳腺导管内癌](M8541/3) - 见肿瘤，乳房，恶性－－with Paget's disease (M8541/3) – see Neoplasm, breast, malignant－－浸润性(M8500/3)－－infiltrating (M8500/3)－－－伴有小叶性(原位)癌(M8522/3)－－－with lobular carcinoma (in situ) (M8522/3)－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant －－－－未特指部位 C50.9－－－－unspecified site C50.9－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位(女性) C50.9－－－unspecified site (female) C50.9－导管内(非浸润性)(M8500/2)－intraductal (noninfiltrating) (M8500/2)－－伴有佩吉特病[乳腺导管内癌](M8543/3) - 见肿瘤，乳房，恶性－－with Paget's disease (M8543/3) – see Neoplasm, breast, malignant－－乳房 D05.1－－breast D05.1－－乳头状(M8503/2)－－papillary (M8503/2)－－－伴有侵袭(M8503/3)－－－with invasion (M8503/3)－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant－－－－未特指部位 C50.9－－－－unspecified site C50.9－－－乳房 D05.1－－－breast D05.1－－－特指部位 NEC - 见肿瘤，原位－－－specified site NEC - see Neoplasm, in situ－－－未特指部位 D05.1－－－unspecified site D05.1－－特指部位 NEC - 见肿瘤，原位－－specified site NEC - see Neoplasm, in situ－－未特指部位 D05.1－－unspecified site D05.1－导管性(M8500/3)－ductal (M8500/3)－－伴有小叶性(M8522/3)－－with lobular (M8522/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C50.9－－－unspecified site C50.9－盯聍(M8420/3) C44.2－ceruminous (M8420/3) C44.2－顶泌性(M8401/3)－apocrine (M8401/3)－－乳房 - 见肿瘤，乳房，恶性－－breast - see Neoplasm, breast, malignant－－特指部位 NEC - 见肿瘤，皮肤，恶性－－specified site NEC - see Neoplasm, skin, malignant －－未特指部位 C44.9－－unspecified site C44.9－多角细胞(M8034/3)－polygonal cell (M8034/3)－多形性(M8022/3)－pleomorphic (M8022/3)－非浸润性(M8010/2)－noninfiltrating (M8010/2)－－导管内(M8500/2)－－intraductal (M8500/2)－－－乳房 D05.1－－－breast D05.1－－－乳头状(M8503/2)－－－papillary (M8503/2)－－－－乳房 D05.1－－－－breast D05.1－－－－特指部位 NEC - 见肿瘤，原位－－－－specified site NEC - see Neoplasm, in situ－－－－未特指部位 D05.1－－－－unspecified site D05.1－－－特指部位 - 见肿瘤，原位－－－specified site - see Neoplasm, in situ－－－未特指部位 D05.1－－－unspecified site D05.1－－囊内(M8504/2) - 见肿瘤，原位－－intracystic (M8504/2) - see Neoplasm, in situ－－小叶性(M8520/2)－－lobular (M8520/2)－－－乳房 D05.0－－－breast D05.0－－－特指部位 NEC - 见肿瘤，原位－－－specified site NEC - see Neoplasm, in situ－－－未特指部位 D05.0－－－unspecified site D05.0－非小细胞(M8046/3)(C34._)－Non-small cell (M8046/3)(C34._)－肺泡(M8251/3) - 见肿瘤，肺，恶性－alveolar (M8251/3) - see Neoplasm, lung, malignant－－细胞(M8250/3) - 见肿瘤，肺，恶性－－cell (M8250/3) - see Neoplasm, lung, malignant－分泌粘液性(M8481/3)－mucin-secreting (M8481/3)－分泌性，乳房(M8502/3) - 见肿瘤，乳房，恶性－secretory, breast (M8502/3) - see Neoplasm, breast,malignant－附属器(皮肤)(M8390/3) - 见肿瘤，皮肤，恶性－adnexal (skin) (M8390/3) - see Neoplasm, skin, malignant －富糖原(M8315/3) - 见肿瘤，乳房，恶性－glycogen-rich (M8315/3) - see Neoplasm, breast,malignant－富脂质(M8314/3) C50.9－lipid-rich (M8314/3) C50.9－肝胆小管性(M8180/3) C22.0－hepatocholangiolitic (M8180/3) C22.0－肝细胞(性)(M8170/3) C22.0－hepatic cell, hepatocellular, liver cell (M8170/3) C22.0－－伴有胆管癌，联合性(M8180/3) C22.0－－with bile duct, mixed (M8180/3) C22.0－－纤维板状(M8171/3) C22.0－－fibrolamellar (M8171/3) C22.0－睾丸间质细胞[莱迪希细胞](睾丸)(M8650/3)－Leydig cell (testis) (M8650/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位－－unspecified site－－－男性 C62.9－－－male C62.9－－－女性 C56－－－female C56－骨内性(M9270/3) C41.1－intraosseous (M9270/3) C41.1－－上颌(骨) C41.0－－upper jaw (bone) C41.0－管状(M8211/3)－tubular (M8211/3)－汗腺(M8400/3) - 见肿瘤，皮肤，恶性－sweat gland (M8400/3) - see Neoplasm, skin, malignant －呼吸细支气管(M8250/3) - 见肿瘤，肺，恶性－bronchioloalveolar (M8250/3) - see Neoplasm, lung,malignant－肌上皮-上皮(M8562/3)－myoepithelial-epithelial (M8562/3)－基底-鳞状细胞，混合性(M8094/3) - 见肿瘤，皮肤，恶性－basal-squamous cell, basosquamous, mixed (M8094/3) -see Neoplasm, skin, malignant－基底细胞(色素沉着的)(M8090/3) - 另见肿瘤，皮肤，恶性－basal cell (pigmented) (M8090/3) - see also Neoplasm, skin, malignant－－多中心性(M8091/3) - 见肿瘤，皮肤，恶性－－multicentric (M8091/3) - see Neoplasm, skin,malignant－－结节性(M8097/3)(C44._)－－nodular (M8097/3)(C44._)－－－小(M8097/3)(C44._)－－－micronodular (M8097/3)(C44._)－－纤维上皮(M8093/3) - 见肿瘤，皮肤，恶性－－fibro-epithelial (M8093/3) - see Neoplasm, skin,malignant－－硬斑性(M8092/3) - 见肿瘤，皮肤，恶性－－morphea (M8092/3) - see Neoplasm, skin, malignant －基底细胞样(M8123/3)－basaloid (M8123/3)－棘细胞(M8070/3)－spinous cell (M8070/3)－继发性(M8010/6) - 见肿瘤，继发性－secondary (M8010/6) - see Neoplasm, secondary －假粘液性(M8470/3)－pseudomucinous (M8470/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C56－－unspecified site C56－假肉瘤性(M8033/3)－pseudosarcomatous (M8033/3)－假腺样，鳞状细胞(M8075/3)－pseudoglandular, squamous cell (M8075/3)－间变型(M8021/3)－anaplastic type (M8021/3)－见于－in－－多形性腺瘤(M8941/3) - 见肿瘤，涎腺，恶性－－pleomorphic adenoma (M8941/3) - seeNeoplasm,salivary gland, malignant－－绒毛状腺瘤(M8261/3)－－villous adenoma (M8261/3)－－息肉(M8210/3)－－polyp (M8210/3)－－息肉样腺瘤(M8210/3)－－polypoid adenoma (M8210/3)－－腺瘤样－－adenomatous－－－结肠息肉病(M8220/3) C18.9－－－polyposis coli (M8220/3) C18.9－－－息肉(M8210/3)－－－polyp (M8210/3)－－小管性腺瘤(M8210/3)－－tubular adenoma (M8210/3)－－原位(M8010/2) - 见原位癌－－situ (M8010/2) - see Carcinoma in situ－浆液性(M8441/3)－serous (M8441/3)－－表面，乳头状(M8461/3)－－surface, papillary (M8461/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C56－－－unspecified site C56－－乳头状(M8460/3)－－papillary (M8460/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C56－－－unspecified site C56－胶样，胶状(M8480/3)－colloid, gelatinous (M8480/3)－浸润性－infiltrating－－导管(M8500/3)－－duct (M8500/3)－－－伴有佩吉特病[乳腺导管内癌](M8541/3) -见肿瘤，乳房，恶性－－－with Paget's disease (M8541/3) –see Neoplasm, breast, malignant－－－伴有小叶性(M8522/3)－－－with lobular (M8522/3)－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant －－－－未特指部位 C50.9－－－－unspecified site C50.9－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant －－－未特指部位(女性) C50.9－－－unspecified site (female) C50.9－－小管性(M8521/3)－－ductular (M8521/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant －－－未特指部位 C50.9－－－unspecified site C50.9－－小叶性(M8520/3)－－lobular (M8520/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant －－－未特指部位 C50.9－－－unspecified site C50.9－巨细胞(M8031/3)－giant cell (M8031/3)－－伴有破骨细胞样(M8035/3)－－with osteoclast-like (M8035/3)－－伴有梭形细胞(M8030/3)－－with spindle cell (M8030/3)－颗粒细胞(M8320/3)－granular cell (M8320/3)－淋巴上皮(M8082/3)－lymphoepithelial (M8082/3)－鳞状(细胞)(M8070/3)－squamous (cell) (M8070/3)－－伴有角质形成(M8078/3)－－with horn formation (M8078/3)－－伴有腺癌，联合性(M8560/3)－－with adenocarcinoma, mixed (M8560/3)－－大细胞，非角化的(M8072/3)－－large cell, nonkeratinizing (M8072/3)－－非角化的(大细胞)(M8072/3)－－nonkeratinizing (large cell) (M8072/3)－－基底样(M8083/3)－－Basaloid (M8083/3)－－假腺样(M8075/3)－－pseudoglandular (M8075/3)－－角化的，大细胞(M8071/3)－－keratinizing, large cell (M8071/3)－－明细胞型(M8084/3)－－clear cell type (M8084/3)－－乳头状(M8052/3)－－papillary (M8052/3)－－梭形细胞(M8074/3)－－spindle cell (M8074/3)－－微小侵袭性(M8076/3)－－microinvasive (M8076/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C53.9－－－unspecified site C53.9－－腺样(M8075/3)－－adenoid (M8075/3)－－小细胞，非角化的(M8073/3)－－small cell, nonkeratinizing (M8073/3)－－疣状(M8051/3)－－verrucous (M8051/3)－－转移性(M8070/6) - 见肿瘤，继发性－－metastatic (M8070/6) - see Neoplasm, secondary－滤泡旁细胞(M8345/3)－parafollicular cell (M8345/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C73－－unspecified site C73－滤泡性(M8330/3)－follicular (M8330/3)－－高度分化(M8331/3) C73－－well differentiated (M8331/3) C73－－中度分化(M8332/3) C73－－moderately differentiated (M8332/3) C73－－伴有乳头状(混合性)(M8340/3) C73－－with papillary (mixed) (M8340/3) C73－－纯滤泡(M8331/3) C73－－pure follicle (M8331/3) C73－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C73－－unspecified site C73－－小梁性(M8332/3) C73－－trabecular (M8332/3) C73－卵泡细胞(M8620/3) C56－granulosa cell (M8620/3) C56－毛基质(M8110/3) - 见肿瘤，皮肤，恶性－pilomatrix (M8110/3) - see Neoplasm, skin, malignant －梅克尔细胞(M8247/3) - 见肿瘤，皮肤，恶性－Merkel cell (M8247/3) - see Neoplasm, skin, malignant －弥漫型(M8145/3)－diffuse type (M8145/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C16.9－－unspecified site C16.9－膜细胞(M8600/3) C56－theca cell (M8600/3) C56－囊内(M8504/3)－intracystic (M8504/3)－－非浸润性(M8504/2) - 见肿瘤，原位－－noninfiltrating (M8504/2) - see Neoplasm, in situ－粘蛋白性(M8480/3)－mucinous (M8480/3)－粘液表皮样(M8430/3)－mucoepidermoid (M8430/3)－粘液样，粘液(M8480/3)－mucoid, mucous (M8480/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C75.1－－unspecified site C75.1――细胞(M8300/3)――cell (M8300/3)－膀胱上皮(M8120/3)－urothelial (M8120/3)－胚胎性(M9070/3)－embryonal (M9070/3)－－伴有畸胎瘤，混合性(M9081/3)－－with teratoma, mixed (M9081/3)－－多胚型(M9072/3)－－polyembryonal type (M9072/3)－－肝 C22.7－－liver C22.7－－合并绒毛膜癌(M9101/3)－－combined with choriocarcinoma (M9101/3)－－婴儿型(M9071/3)－－infantile type (M9071/3)－皮肤附属物(M8390/3) - 见肿瘤，皮肤，恶性－skin appendage (M8390/3) - see Neoplasm, skin,malignant－皮脂腺(M8410/3) - 见肿瘤，皮肤，恶性－sebaceous (M8410/3) - see Neoplasm, skin, malignant －球状细胞(M8010/3)－spheroidal cell (M8010/3)－绒毛膜(M9100/3)－chorionic (M9100/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位－－unspecified site－－－男性 C62.9－－－male C62.9－－－女性 C58－－－female C58－绒毛状(M8262/3)－villous (M8262/3)－乳头状(M8050/3)－papillary (M8050/3)－－伴有滤泡性(混合性)(M8340/3) C73－－with follicular (mixed) (M8340/3) C73－－表皮样(M8052/3)－－epidermoid (M8052/3)－－导管内(非浸润性)(M8503/2)－－intraductal (noninfiltrating) (M8503/2)－－－伴有侵袭(M8503/3)－－－with invasion (M8503/3)－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant－－－－未特指部位 C50.9－－－－unspecified site C50.9－－－乳房 D05.1－－－breast D05.1－－－特指部位 NEC - 见肿瘤，原位－－－specified site NEC - see Neoplasm, in situ－－－未特指部位 D05.1－－－unspecified site D05.1－－浆液性(M8460/3)－－serous (M8460/3)－－－表面(M8461/3)－－－surface (M8461/3)－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant－－－－未特指部位 C56－－－－unspecified site C56－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C56－－－unspecified site C56－－鳞状细胞(M8052/3)－－squamous cell (M8052/3)－－滤泡性变异(M8340/3) C73－－follicular variant (M8340/3) C73－－移行细胞(M8130/3)－－transitional cell (M8130/3)－乳头状囊性(M8450/3)－papillocystic (M8450/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C56－－unspecified site C56－鳃或鳃源性 C10.4－branchial or branchiogenic C10.4－塞托利细胞(M8640/3)－Sertoli cell (M8640/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C62.9－－unspecified site C62.9－－－男性 C62.9－－－male C62.9－－－女性 C56－－－female C56－筛状(M8201/3)－cribriform (M8201/3)－上皮-肌上皮(M8562/3)－epithelial-myoepithelial (M8562/3)－上皮内(M8010/2) - 见肿瘤，原位－intraepithelial (M8010/2) - see Neoplasm, in situ－－鳞状细胞(M8070/2) - 见肿瘤，原位－－squamous cell (M8070/2) - see Neoplasm, in situ －神经内分泌 (M8246/3) C80－neuroendocrine (M8246/3) C80－－大细胞(8013/3)－－Large cell (8013/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－肾上腺皮质(M8370/3) C74.0－adrenal cortical (M8370/3) C74.0－肾细胞(M8312/3) C64－renal cell (M8312/3) C64－施明克(M8082/3) - 见肿瘤，鼻咽，恶性－Schmincke (M8082/3) - see Neoplasm, nasopharynx,malignant－施奈德(M8121/3)－Schneiderian (M8121/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C30.0－－unspecified site C30.0－实体(M8230/3)－solid (M8230/3)－嗜碱-嗜酸细胞，混合性(M8281/3)－basophil-acidophil, mixed (M8281/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C75.1－－unspecified site C75.1－嗜碱细胞性(M8300/3)－basophil (M8300/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C75.1－－unspecified site C75.1－嗜酸-嗜碱细胞，混合性(M8281/3)－acidophil-basophil, mixed (M8281/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C75.1－－unspecified site C75.1－嗜酸瘤细胞性(M8290/3)－oncocytic (M8290/3)－嗜酸性(M8290/3)－oxyphilic (M8290/3)－嗜酸性粒细胞(M8280/3)－acidophil, eosinophil (M8280/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C75.1－－unspecified site C75.1－水样透明细胞(M8322/3) C75.0－water-clear cell (M8322/3) C75.0－髓样(M8510/3)－medullary (M8510/3)－－伴有－－with－－－淀粉样间质(M8345/3) C73.9－－－amyloid stroma (M8345/3) C73.9－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant－－－－未特指部位 C73－－－－unspecified site C73－－－淋巴样间质(M8512/3)－－－lymphoid stroma (M8512/3)－－－－特指部位 - 见肿瘤，恶性－－－－specified site - see Neoplasm, malignant－－－－未特指部位(女性) C50.9－－－－unspecified site (female) C50.9－梭形细胞(M8032/3)－spindle cell (M8032/3)－－伴有巨细胞(M8030/3)－－with giant cell (M8030/3)－透明细胞(中肾样)(M8310/3)－clear cell (mesonephroid) (M8310/3)－未分化(M8020/3)－undifferentiated (M8020/3)－沃尔夫管(M9110/3)－wolffian duct (M9110/3)－无包膜硬化性(M8350/3) C73－nonencapsulated sclerosing (M8350/3) C73－细支气管(M8250/3) - 见肿瘤，肺，恶性－bronchiolar (M8250/3) - see Neoplasm, lung, malignant－纤维上皮性，基底细胞(M8093/3) - 见肿瘤，皮肤，恶性－fibroepithelial, basal cell (M8093/3) - see Neoplasm, skin, malignant－嫌色细胞(M8270/3)－chromophobe (M8270/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant －－未特指部位 C75.1－－unspecified site C75.1－腺鳞(M8560/3)－adenosquamous (M8560/3)－腺泡(细胞)(M8550/3)－acinar, acinic (cell) (M8550/3)－腺样－adenoid－－基底(M8098/3)(C53._)－－basal (M8098/3)(C53._)－－鳞状细胞(M8075/3)－－squamous cell (M8075/3)－－囊性(M8200/3)－－cystic (M8200/3)－腺样囊性(M8200/3)－adenocystic (M8200/3)－小管性(M8211/3)－tubular (M8211/3)－小管性，浸润性(M8521/3)－ductular, infiltrating (M8521/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C50.9－－unspecified site C50.9－小梁性(M8190/3)－trabecular (M8190/3)－小细胞(M8041/3)－small cell (M8041/3)－－大细胞(M8045/3)－－large cell (M8045/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C34.9－－－unspecified site C34.9－－鳞状细胞，非角化的(M8073/3)－－squamous cell, nonkeratinizing (M8073/3)－－梭形细胞(M8043/3)－－fusiform cell (M8043/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C34.9－－－unspecified site C34.9－－中间细胞(M8044/3)－－intermediate cell (M8044/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C34.9－－－unspecified site C34.9－小叶性(浸润性)(M8520/3)－lobular (infiltrating) (M8520/3)－－伴有导管内(M8522/3)－－with intraductal (M8522/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C50.9－－－unspecified site C50.9－－非浸润性(M8520/2)－－noninfiltrating (M8520/2)－－－乳房 D05.0－－－breast D05.0－－－特指部位 NEC - 见肿瘤，原位－－－specified site NEC - see Neoplasm, in situ －－－未特指部位 D05.0－－－unspecified site D05.0－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位(女性) C50.9－－unspecified site (female) C50.9－泄殖腔源性(M8124/3)－cloacogenic (M8124/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C21.2－－unspecified site C21.2－胸腺(M8586/3) C37－thymic (M8586/3) C37－许特尔细胞(M8290/3) C73－Hurthle cell (M8290/3) C73－牙源性(M9270/3) C41.1－odontogenic (M9270/3) C41.1－－上颌(骨) C41.0－－upper jaw (bone) C41.0－炎性(M8530/3)－inflammatory (M8530/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位(女性) C50.9－－unspecified site (female) C50.9－燕麦细胞(M8042/3)－oat cell (M8042/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位 C34.9－－unspecified site C34.9－胰岛细胞(M8150/3)－islet cell (M8150/3)－－伴有外分泌，混合性(M8154/3)－－with exocrine, mixed (M8154/3)－－－特指部位 - 见肿瘤，恶性－－－specified site - see Neoplasm, malignant－－－未特指部位 C25.9－－－unspecified site C25.9－－特指部位 NEC - 见肿瘤，恶性－－specified site NEC - see Neoplasm, malignant －－未特指部位 C25.4－－unspecified site C25.4－－胰腺 C25.4－－pancreas C25.4－移行(细胞)(M8120/3)－transitional (cell) (M8120/3)－－乳头状(M8130/3)－－papillary (M8130/3)－－梭形细胞(M8122/3)－－spindle cell (M8122/3)－－微乳头状(M8131/3)(C67._)－－micropapillary (M8131/3)(C67._)－异型(M8095/3) - 见肿瘤，皮肤，恶性－metatypical (M8095/3) - see Neoplasm, skin, malignant －印戒细胞(M8490/3)－signet ring cell (M8490/3)－－转移性(M8490/6) - 见肿瘤，继发性－－metastatic (M8490/6) - see Neoplasm, secondary－硬癌(M8141/3)－scirrhous (M8141/3)－硬斑性，基底细胞(M8092/3) - 见肿瘤，皮肤，恶性－morphea, basal cell (M8092/3) - see Neoplasm, skin, malignant－疣状(表皮样)(鳞状细胞)(M8051/3)－verrucous (epidermoid)(squamous cell) (M8051/3)－幼年，乳房(M8502/3) - 见肿瘤，乳房，恶性－juvenile, breast (M8502/3) - see Neoplasm, breast,malignant－圆细胞(M8041/3)－round cell (M8041/3)－圆柱状(M8200/3)－cylindroid (M8200/3)－支气管或支气管源性 - 见肿瘤，肺，恶性－bronchial or bronchogenic - see Neoplasm, lung,malignant－中后肾性(M9110/3)－mesometanephric (M9110/3)－中肾性(M9110/3)－mesonephric (M9110/3)－转移性(M8010/6) - 见肿瘤，继发性－metastatic (M8010/6) - see Neoplasm, secondary－子宫内膜样(M8380/3)－endometrioid (M8380/3)－－特指部位 - 见肿瘤，恶性－－specified site - see Neoplasm, malignant－－未特指部位－－unspecified site－－－男性 C61－－－male C61－－－女性 C56－－－female C56癌病Carcinomatosis－腹膜(M8010/6) C78.6－peritonei (M8010/6) C78.6－特指部位 NEC(M8010/3) - 见肿瘤，恶性－specified site NEC (M8010/3) - see Neoplasm, malignant －未特指部位(M8010/6) C80－unspecified site (M8010/6) C80癌肉瘤(M8980/3) - 见肿瘤，恶性Carcinosarcoma (M8980/3) - see Neoplasm, malignant－胚胎性(M8981/3) - 见肿瘤，恶性－embryonal (M8981/3) - see Neoplasm, malignant癌性(M8000/3) - 见肿瘤，恶性Cancerous (M8000/3) - see Neoplasm, malignant癌症，癌瘤(M8000/3) - 另见肿瘤，恶性Cancer (M8000/3) - see also Neoplasm, malignant注－当术语“癌症”被形容词或形容词短语所修饰并指明其形态学类型时，则应以具有该形容词或短语的“癌”的同样方式进行编码。

欧洲药典7.5版

EUROPEAN PHARMACOPOEIA 7.5
INDEX
To aid users the index includes a reference to the supplement in which the latest version of a text can be found. For example : Amikacin sulfate...............................................7.5-4579 means the monograph Amikacin sulfate can be found on page 4579 of Supplement 7.5. Note that where no reference to a supplement is made, the text can be found in the principal volume.
English index ........................................................................ 4707
Latin index ................................................................................. 4739
EUROPEAN PHARMACOPபைடு நூலகம்EIA 7.5
Index
Numerics 1. General notices ................................................................... 7.5-4453 2.1.1. Droppers...................

Schneider Electric ATV71HD45N4变速驱动器产品数据手册说明书

T h e i n f o r m a t i o n p r o v i d e d i n t h i s d o c u m e n t a t i o n c o n t a i n s g e n e r a l d e s c r i p t i o n s a n d /o r t e c h n i c a l c h a r a c t e r i s t i c s o f t h e p e r f o r m a n c e o f t h e p r o d u c t s c o n t a i n e d h e r e i n .T h i s d o c u m e n t a t i o n i s n o t i n t e n d e d a s a s u b s t i t u t e f o r a n d i s n o t t o b e u s e d f o r d e t e r m i n i n g s u i t a b i l i t y o r r e l i a b i l i t y o f t h e s e p r o d u c t s f o r s p e c i f i c u s e r a p p l i c a t i o n s .I t i s t h e d u t y o f a n y s u c h u s e r o r i n t e g r a t o r t o p e r f o r m t h e a p p r o p r i a t e a n d c o m p l e t e r i s k a n a l y s i s , e v a l u a t i o n a n d t e s t i n g o f t h e p r o d u c t s w i t h r e s p e c t t o t h e r e l e v a n t s p e c i f i c a p p l i c a t i o n o r u s e t h e r e o f .N e i t h e r S c h n e i d e r E l e c t r i c I n d u s t r i e s S A S n o r a n y o f i t s a f f i l i a t e s o r s u b s i d i a r i e s s h a l l b e r e s p o n s i b l e o r l i a b l e f o r m i s u s e o f t h e i n f o r m a t i o n c o n t a i n e d h e r e i n .Product data sheetCharacteristicsATV71HD45N4variable speed drive ATV71 - 45kW-60HP -480V - EMC filter-graphic terminalProduct availability: Stock - Normally stocked in distribution facilityMainRange of product Altivar 71Product or component typeVariable speed driveProduct specific applica-tionComplex, high-power machines Component name ATV71Motor power kW 45 kW, 3 phase 380...480 V Maximum Horse Power Rating60 hp, 3 phase 380...480 V Maximum motor cable length328.08 Ft (100 m) shielded cable 656.17 ft (200 m) unshielded cable Power supply voltage 380...480 V - 15...10 %Phase 3 phaseLine current 104 A 380 V 3 phase 45 kW / 60 hp 85 A 480 V 3 phase 45 kW / 60 hp EMC filter Integrated Assembly style With heat sinkApparent power 68.5 kVA 380 V 3 phase 45 kW / 60 hp Prospective line Isc 22 kA 3 phaseNominal output current 77 A 2.5 kHz 460 V 3 phase 45 kW / 60 hp 94 A 2.5 kHz 380 V 3 phase 45 kW / 60 hp Maximum transient cur-rent141 A 60 s 3 phase 45 kW / 60 hp 155 A 2 s 3 phase 45 kW / 60 hp Output frequency 0.1…500 Hz Nominal switching fre-quency2.5 kHzSwitching frequency 1...16 kHz adjustable2.5...16 kHz with derating factorAsynchronous motor control profileFlux vector control (FVC) with sensor (current vec-tor)Voltage/Frequency ratio (2 or 5 points)ENA (Energy adaptation) system for unbalanced loadsSensorless flux vector control (SFVC) (voltage or current vector)Type of polarizationNo impedance ModbusComplementaryProduct destination Synchronous motors Asynchronous motors Power supply voltage limits 323…528 V Power supply frequency 50...60 Hz - 5...5 %Power supply frequency limits 47.5...63 HzSpeed range1…100 asynchronous motor in open-loop mode, without speed feedback 1…1000 asynchronous motor in closed-loop mode with encoder feedback 1…50 synchronous motor in open-loop mode, without speed feedbackSpeed accuracy+/- 0.01 % of nominal speed in closed-loop mode with encoder feedback 0.2 Tn to Tn+/- 10 % of nominal slip without speed feedback 0.2 Tn to Tn Torque accuracy+/- 15 % in open-loop mode, without speed feedback +/- 5 % in closed-loop mode with encoder feedbackTransient overtorque170 % +/- 10 % 60 s every 10 minutes220 % +/- 10 % 2 sBraking torque<= 150 % with braking or hoist resistor30 % without braking resistorSynchronous motor control profile Vector control without speed feedbackRegulation loop Adjustable PI regulatorMotor slip compensation Automatic whatever the loadNot available in voltage/frequency ratio (2 or 5 points)SuppressableAdjustableDiagnostic Drive voltage 1 LED red)Output voltage<= power supply voltageInsulation Electrical between power and controlType of cable for mounting in an enclosure With a NEMA Type1 kit 3 UL 508 cable 104 °F (40 °C), copper 75 °C / PVCWith an IP21 or an IP31 kit 3 IEC cable 104 °F (40 °C), copper 70 °C / PVCWithout mounting kit 1 IEC cable 113 °F (45 °C), copper 70 °C / PVCWithout mounting kit 1 IEC cable 113 °F (45 °C), copper 90 °C / XLPE/EPR Electrical connection Terminal 2.5 mm², AWG 14 AI1-/AI1+, AI2, AO1, R1A, R1B, R1C, R2A, R2B,LI1...LI6, PWR)Terminal 150 mm² L1/R, L2/S, L3/T, U/T1, V/T2, W/T3, PC/-, PO, PA/+, PA, PB) Tightening torque 5.31 Lbf.In (0.6 N.m) AI1-/AI1+, AI2, AO1, R1A, R1B, R1C, R2A, R2B, LI1 (I6)PWR)362.88 lbf.in (41 N.m), 360 lb.in L1/R, L2/S, L3/T, U/T1, V/T2, W/T3, PC/-, PO,PA/+, PA, PB)Supply Internal supply for reference potentiometer (1 to 10 kOhm) 10.5 V DC +/- 5 %,<10 mA overload and short-circuit protectionInternal supply 24 V DC 21…27 V), <200 mA overload and short-circuit protection Analogue input number2Analogue input type AI1-/Al1+ bipolar differential voltage +/- 10 V DC 24 V max 11 bits + signAI2 software-configurable current 0...20 mA 242 Ohm 11 bitsAI2 software-configurable voltage 0...10 V DC 24 V max 30000 Ohm 11 bits Input sampling time2 Ms +/- 0.5 ms AI1-/Al1+) - analog2 Ms +/- 0.5 ms Al2) - analog2 Ms +/- 0.5 ms LI1...LI5) - discrete2 ms +/- 0.5 ms LI6)if configured as logic input - discreteResponse time<= 100 ms in STO (Safe Torque Off)AO1 2 ms +/- 0.5 ms analogR1A, R1B, R1C 7 ms +/- 0.5 ms discreteR2A, R2B 7 ms +/- 0.5 ms discreteAbsolute accuracy precision+/- 0.6 % AI1-/Al1+) for a temperature variation 60 °C+/- 0.6 % AI2) for a temperature variation 60 °C+/- 1 % AO1) for a temperature variation 60 °CLinearity error+/- 0.15 % of maximum value AI1-/Al1+, AI2)+/- 0.2 % AO1)Analogue output number1Analogue output type AO1 software-configurable logic output 10 V 20 mAAO1 software-configurable current 0...20 mA 500 Ohm 10 bitsAO1 software-configurable voltage 0...10 V DC 470 Ohm 10 bitsDiscrete output number2Discrete output type Configurable relay logic R1A, R1B, R1C) NO/NC - 100000 cyclesConfigurable relay logic R2A, R2B) NO - 100000 cyclesMinimum switching current3 mA 24 V DC configurable relay logicMaximum switching current R1, R2 2 A 250 V AC inductive, cos phi = 0.4R1, R2 2 A 30 V DC inductive, cos phi = 0.4R1, R2 5 A 250 V AC resistive, cos phi = 1R1, R2 5 A 30 V DC resistive, cos phi = 1Discrete input number7Discrete input type LI1...LI5 programmable 24 V DC level 1 PLC 3500 OhmLI6 switch-configurable 24 V DC level 1 PLC 3500 OhmLI6 switch-configurable PTC probe 0…6 1500 OhmPWR safety input 24 V DC 1500 Ohm ISO 13849-1 level dDiscrete input logic Negative logic (sink) LI1...LI5), > 16 V, < 10 VPositive logic (source) LI1...LI5), < 5 V, > 11 VNegative logic (sink) LI6)if configured as logic input, > 16 V, < 10 VPositive logic (source) LI6)if configured as logic input, < 5 V, > 11 V Acceleration and deceleration ramps S, U or customizedLinear adjustable separately from 0.01 to 9000 sAutomatic adaptation of ramp if braking capacity exceeded, by using resistorBraking to standstill By DC injectionProtection type Against exceeding limit speed driveAgainst input phase loss driveBreak on the control circuit driveInput phase breaks driveLine supply overvoltage driveLine supply undervoltage driveOvercurrent between output phases and earth driveOverheating protection driveOvervoltages on the DC bus driveShort-circuit between motor phases driveThermal protection driveMotor phase break motorPower removal motorThermal protection motorInsulation resistance> 1 mOhm 500 V DC for 1 minute to earthFrequency resolution Analog input 0.024/50 HzDisplay unit 0.1 HzCommunication port protocol ModbusCANopenConnector type 1 RJ45 on front face)Modbus1 RJ45 on terminal)ModbusMale SUB-D 9 on RJ45CANopenPhysical interface2-wire RS 485 ModbusTransmission frame RTU ModbusTransmission rate4800 bps, 9600 bps, 19200 bps, 38.4 Kbps Modbus on terminal9600 bps, 19200 bps Modbus on front face20 kbps, 50 kbps, 125 kbps, 250 kbps, 500 kbps, 1 Mbps CANopen Data format8 bits, 1 stop, even parity Modbus on front face8 bits, odd even or no configurable parity Modbus on terminal Number of addresses1…127 CANopen1…247 ModbusMethod of access Slave CANopenMarking CEOperating position Vertical +/- 10 degreeHeight24.80 in (630 mm)Depth11.42 in (290 mm)Width12.60 in (320 mm)Net weight97.00 lb(US) (44 kg)Functionality FullSpecific application Other applicationsOption card Communication card CC-LinkController inside programmable cardCommunication card DeviceNetCommunication card Ethernet/IPCommunication card FipioI/O extension cardCommunication card Interbus-SInterface card for encoderCommunication card Modbus PlusCommunication card Modbus TCPCommunication card Modbus/Uni-TelwayOverhead crane cardCommunication card Profibus DPCommunication card Profibus DP V1EnvironmentNoise level63.7 dB 86/188/EECDielectric strength3535 V DC between earth and power terminals5092 V DC between control and power terminalsElectromagnetic compatibility 1.2/50 µs - 8/20 µs surge immunity test level 3 IEC 61000-4-5Conducted radio-frequency immunity test level 3 IEC 61000-4-6Electrical fast transient/burst immunity test level 4 IEC 61000-4-4Electrostatic discharge immunity test level 3 IEC 61000-4-2Radiated radio-frequency electromagnetic field immunity test level 3 IEC61000-4-3Voltage dips and interruptions immunity test IEC 61000-4-11Standards UL Type 1EN 61800-3 environments 1 category C3IEC 60721-3-3 class 3S2EN 61800-3 environments 2 category C3IEC 60721-3-3 class 3C1EN 55011 class A group 2EN/IEC 61800-3EN/IEC 61800-5-1Product certifications NOM 117CSAULC-TickGOSTPollution degree 2 EN/IEC 61800-5-13 UL 840IP degree of protection IP20Vibration resistance 1 gn 13…200 Hz)EN/IEC 60068-2-61.5 mm peak to peak 3…13 Hz)EN/IEC 60068-2-6Shock resistance15 gn 11 ms EN/IEC 60068-2-27Relative humidity5…95 % without condensation IEC 60068-2-35…95 % without dripping water IEC 60068-2-3Ambient air temperature for operation14…122 °F (-10…50 °C) without)Ambient air temperature for storage-13…158 °F (-25…70 °C)Operating altitude<= 3280.84 ft (1000 m) without3280.84...9842.52 ft (1000...3000 m) with current derating 1 % per 100 m Ordering and shipping detailsCategory22132 - ATV71 - 60 THRU 150HP DRIVESDiscount Schedule CP4CGTIN00785901966500Package weight(Lbs)53.89 kg (118.8 lb(US))Returnability YesCountry of origin INOffer SustainabilitySustainable offer status Green Premium productCalifornia proposition 65WARNING: This product can expose you to chemicals including: Lead and leadcompounds which is known to the State of California to cause Carcinogen & Re-productive harm. For more information go to REACh Regulation REACh DeclarationEU RoHS Directive Pro-active compliance (Product out of EU RoHS legal scope)EU RoHS Decla-rationMercury free YesRoHS exemption information YesChina RoHS Regulation China RoHS DeclarationEnvironmental Disclosure Product Environmental ProfileCircularity Profile End Of Life InformationWEEE The product must be disposed on European Union markets following specificwaste collection and never end up in rubbish bins.Contractual warrantyWarranty18 monthsDimensions DrawingsUL Type 1/IP 20 DrivesDimensions without Option CardDimensions with 1 Option Card (1)(1) Option cards: I/O extension cards, communication cards or "Controller Inside” programmable card.Dimensions with 2 Option Cards (1)(1) Option cards: I/O extension cards, communication cards or "Controller Inside” programmable card.Mounting and ClearanceMounting RecommendationsDepending on the conditions in which the drive is to be used, its installation will require certain precautions and the use of appropriate accessories.Install the unit vertically:●Avoid placing it close to heating elements●Leave sufficient free space to ensure that the air required for cooling purposes can circulate from the bottom to the top of the unit. ClearanceMounting TypesType A MountingType B MountingType C MountingBy removing the protective blanking cover from the top of the drive, the degree of protection for the drive becomes IP 20.The protective blanking cover may vary according to the drive model (refer to the user guide).The protective blanking cover must be removed from ATV 71P•••N4Z drives when they are mounted in a dust and damp proof enclosure. Specific Recommendations for Mounting the Drive in an EnclosureVentilationTo ensure proper air circulation in the drive:●Fit ventilation grilles.●Ensure that there is sufficient ventilation. If there is not, install a forced ventilation unit with a filter. The openings and/or fans must providea flow rate at least equal to that of the drive fans (refer to the product characteristics).●Use special filters with IP 54 protection.●Remove the blanking cover from the top of the drive.Dust and Damp Proof Metal Enclosure (IP 54)The drive must be mounted in a dust and damp proof enclosure in certain environmental conditions: dust, corrosive gases, high humidity with risk of condensation and dripping water, splashing liquid, etc.This enables the drive to be used in an enclosure where the maximum internal temperature reaches 50°C.Product data sheetConnections and SchemaATV71HD45N4Wiring Diagram Conforming to Standards EN 954-1 Category 1, IEC/EN 61508 Capacity SIL1, in Stopping Category 0 According to IEC/EN 60204-1Three-Phase Power Supply with Upstream Breaking via ContactorA1ATV71 drive KM1Contactor L1DC chokeQ1Circuit-breakerQ2GV2 L rated at twice the nominal primary current of T1Q3GB2CB05S1,S2XB4 B or XB5 A pushbuttonsT1100 VA transformer 220 V secondary(1)Line choke (three-phase); mandatory for ATV71HC11Y…HC63Y drives (except when a special transformer is used (12-pulse)).(2)For ATV71HC40N4 drives combined with a 400 kW motor, ATV71HC50N4 and ATV71HC40Y…HC63Y, refer to the power terminal connections diagram.(3)Fault relay contacts. Used for remote signalling of the drive status.(4)Connection of the common for the logic inputs depends on the positioning of the SW1 switch. The above diagram shows the internal power supply switched to the “source” position (for other connection types, refer to the user guide).(5)There is no PO terminal on ATV71HC11Y…HC63Y drives.(6)Optional DC choke for ATV71H•••M3, ATV71HD11M3X…HD45M3X, ATV71•075N4…•D75N4 and ATV71P•••N4Z drives. Connected in place of the strap between the PO and PA/+ terminals. For ATV71HD55M3X, HD75M3X, ATV71HD90N4…HC50N4 drives, the choke is supplied with the drive; the customer is responsible for connecting it.(7)Software-configurable current (0…20 mA) or voltage (0…10 V) analog input.(8)Reference potentiometer.All terminals are located at the bottom of the drive. Fit interference suppressors on all inductive circuits near the drive or connected on the same circuit, such as relays, contactors, solenoid valves, fluorescent lighting, etc.Wiring Diagram Conforming to Standards EN 954-1 Category 1, IEC/EN 61508 Capacity SIL1, in Stopping Category 0 According to IEC/EN 60204-1Three-Phase Power Supply with Downstream Breaking via Switch DisconnectorA1ATV71 drive L1DC chokeQ1Circuit-breakerQ2Switch disconnector (Vario)(1)Line choke (three-phase), mandatory for ATV71HC11Y…HC63Y drives (except when a special transformer is used (12-pulse)).(2)For ATV71HC40N4 drives combined with a 400 kW motor, ATV71HC50N4 and ATV71HC40Y…HC63Y, refer to the power terminal connections diagram.(3)Fault relay contacts. Used for remote signalling of the drive status.(4)Connection of the common for the logic inputs depends on the positioning of the SW1 switch. The above diagram shows the internal power supply switched to the “source” position (for other connection types, refer to the user guide).(5)There is no PO terminal on ATV71HC11Y…HC63Y drives.(6)Optional DC choke for ATV71H•••M3, ATV71HD11M3X…HD45M3X, ATV71•075N4…•D75N4 and ATV71P•••N4Z drives. Connected in place of the strap between the PO and PA/+ terminals. For ATV71HD55M3X, HD75M3X, ATV71HD90N4…HC50N4 drives, the choke is supplied with the drive; the customer is responsible for connecting it.(7)Software-configurable current (0…20 mA) or voltage (0…10 V) analog input.(8)Reference potentiometer.All terminals are located at the bottom of the drive. Fit interference suppressors on all inductive circuits near the drive or connected on the same circuit, such as relays, contactors, solenoid valves, fluorescent lighting, etc.Wiring Diagram Conforming to Standards EN 954-1 Category 3, IEC/EN 61508 Capacity SIL2, in Stopping Category 0 According to IEC/EN 60204-1Three-Phase Power Supply, Low Inertia Machine, Vertical MovementA1ATV71 drive A2Preventa XPS AC safety module for monitoring emergency stops and switches. One safety module can manage the “Power Removal”function for several drives on the same machine. In this case, each drive must connect its PWR terminal to its + 24 V via the safety contacts on the XPS AC module. These contacts are independent for each drive.F1Fuse L1DC choke Q1Circuit-breaker S1Emergency stop button with 2 contacts S2XB4 B or XB5 A pushbutton (1)Power supply: 24 Vdc or Vac, 48 Vac, 115 Vac, 230 Vac.(2)S2: resets XPS AC module on power-up or after an emergency stop. ESC can be used to set external starting conditions.(3)Requests freewheel stopping of the movement and activates the “Power Removal” safety function.(4)Line choke (three-phase), mandatory for and ATV71HC11Y…HC63Y drives (except when a special transformer is used (12-pulse)).(5)The logic output can be used to signal that the machine is in a safe stop state.(6)For ATV71HC40N4 drives combined with a 400 kW motor, ATV71HC50N4 and ATV71HC40Y…HC63Y, refer to the power terminal connections diagram.(7)Fault relay contacts. Used for remote signalling of the drive status.(8)Connection of the common for the logic inputs depends on the positioning of the SW1 switch. The above diagram shows the internal power supply switched to the “source” position (for other connection types, refer to the user guide).(9)Standardized coaxial cable, type RG174/U according to MIL-C17 or KX3B according to NF C 93-550, external diameter 2.54 mm /0.09 in., maximum length 15 m / 49.21 ft. The cable shielding must be earthed.(10)There is no PO terminal on ATV71HC11Y…HC63Y drives.(11)Optional DC choke for ATV71H•••M3, ATV71HD11M3X…HD45M3X, ATV71•075N4…•D75N4 and ATV71P•••N4Z drives. Connected in place of the strap between the PO and PA/+ terminals. For ATV71HD55M3X, HD75M3X, ATV71HD90N4…HC50N4 drives, the choke is supplied with the drive; the customer is responsible for connecting it.(12)Software-configurable current (0…20 mA) or voltage (0…10 V) analog input.(13)Reference potentiometer.All terminals are located at the bottom of the drive. Fit interference suppressors on all inductive circuits near the drive or connected on the same circuit, such as relays, contactors, solenoid valves, fluorescent lighting, etc.Wiring Diagram Conforming to Standards EN 954-1 Category 3, IEC/EN 61508 Capacity SIL2, in Stopping Category 1 According to IEC/EN 60204-1Three-Phase Power Supply, High Inertia MachineA1ATV71 drive A2(5)Preventa XPS ATE safety module for monitoring emergency stops and switches. One safety module can manage the "Power Removal”safety function for several drives on the same machine. In this case the time delay must be adjusted on the drive controlling the motor that requires the longest stopping time. In addition, each drive must connect its PWR terminal to its + 24 V via the safety contacts on the XPS ATE module. These contacts are independent for each drive.F1Fuse L1DC choke Q1Circuit-breaker S1Emergency stop button with 2 N/C contacts S2Run button (1)Power supply: 24 Vdc or Vac, 115 Vac, 230 Vac.(2)Requests controlled stopping of the movement and activates the “Power Removal” safety function.(3)Line choke (three-phase), mandatory for ATV71HC11Y…HC63Y drives (except when a special transformer is used (12-pulse)).(4)S2: resets XPS ATE module on power-up or after an emergency stop. ESC can be used to set external starting conditions.(5)For stopping times requiring more than 30 seconds in category 1, use a Preventa XPS AV safety module which can provide a maximum time delay of 300 seconds.(6)The logic output can be used to signal that the machine is in a safe state.(7)For ATV71HC40N4 drives combined with a 400 kW motor, ATV71HC50N4 and ATV71HC40Y…HC63Y, refer to the power terminal connections diagram.(8)Fault relay contacts. Used for remote signalling of the drive status.(9)Connection of the common for the logic inputs depends on the positioning of the SW1 switch. The above diagram shows the internal power supply switched to the “source” position (for other connection types, refer to the user guide).(10)Standardized coaxial cable, type RG174/U according to MIL-C17 or KX3B according to NF C 93-550, external diameter 2.54 mm/0.09 in., maximum length 15 m/49.21 ft. The cable shielding must be earthed.(11)Logic inputs LI1 and LI2 must be assigned to the direction of rotation: LI1 in the forward direction and LI2 in the reverse direction.(12)There is no PO terminal on ATV71HC11Y…HC63Y drives.(13)Optional DC choke for ATV71H•••M3, ATV71HD11M3X…HD45M3X, ATV71•075N4…•D75N4 and ATV71P•••N4Z drives. Connected in place of the strap between the PO and PA/+ terminals. For ATV71HD55M3X, HD75M3X, ATV71HD90N4…HC50N4 drives, the choke is supplied with the drive; the customer is responsible for connecting it.(14)Software-configurable current (0…20 mA) or voltage (0…10 V) analog input.(15)Reference potentiometer.All terminals are located at the bottom of the drive. Fit interference suppressors on all inductive circuits near the drive or connected on the same circuit, such as relays, contactors, solenoid valves, fluorescent lighting, etc.Product data sheet Performance Curves ATV71HD45N4Derating CurvesThe derating curves for the drive nominal current (In) depend on the temperature, the switching frequency and the mounting type. Forintermediate temperatures (e.g. 55°C), interpolate between 2 curves.XSwitching frequency (1)Mounting typeAbove 50ºC, the drive should be fitted with a control card fan kit.。