KP3020中文资料
M30302MEP-XXXFP中文资料
PRELIMINARYM16C/30P GroupSINGLE-CHIP 16-BIT CMOS MICROCOMPUTERNotice: This is not a final specification.Some parametric limits are subject to change.REJ03B0088-0080Rev.0.80Mar 18, 20051.OverviewThe M16C/30P Group of single-chip microcomputers are built using the high-performance silicon gate CMOS process using a M16C/60 Series CPU core and are packaged in a 100-pin plastic molded QFP.These single-chip microcomputers operate using sophisticated instructions featuring a high level of instruction efficiency. With 1M bytes of address space, they are capable of executing instructions at high speed. In addition, this microcomputer contains a multiplier and DMAC which combined with fast instruction processing capability, makes it suitable for control of various OA, communication, and industrial equipment which requires high-speed arithmetic/logic operations.1.1ApplicationsAudio, cameras, TV , home appliance, office/communications/portable/industrial equipment, etc.Specifications written in this manual are believed to be accurate,but are not guaranteed to be entirely free of error. Specifications in this manual may be changed for functional or performance improvements. Please make sure your manual is the latest edition.1.2Performance OutlineTable 1.1 lists Performance Outline of M16C/30P Group.NOTES:1.I 2C bus is a registered trademark of Koninklijke Philips Electronics N. V.2.IEBus is a registered trademark of NEC Electronics Corporation.e the M16C/30P on VCC1 = VCC2.Table 1.1Performance Outline of M16C/30P GroupItem PerformanceCPU Number of Basic Instructions 91 instructionsMinimum Instruction Execution Time 62.5ns(f(XIN)=16MHz, VCC1=VCC2=4.2 to 5.5V, no wait)100ns(f(XIN)=10MHz, VCC1=VCC2=2.7 to 5.5V, no wait)Operation Mode Single-chip Memory Space 1 Mbyte Memory Capacity See Table 1.2 Product ListPeripheral Function Port Input/Output : 87 pins, Input : 1 pin Multifunction Timer Timer A : 16 bits x 3 channels,Timer B : 16 bits x 3 channelsSerial Interface 3 channelsClock synchronous, UART, I 2C bus (1)1 channels IEBus (2)A/D Converter 10-bit A/D converter: 1 circuit, 18 channels DMAC 2 channels CRC Calculation Circuit CCITT-CRC Watchdog Timer 15 bits x 1 channel (with prescaler)Interrupt Internal: 20 sources, External: 7 sources, Software: 4sources, Priority level: 7 levelsClock Generating Circuit 2 circuitsMain clock generation circuit (*), Subclock generation circuit (*),(*)Equipped with a built-in feedback resistor.Electric Characteristics Supply Voltage VCC1=VCC2=3.0 to 5.5 V (f(XIN)=16MHz)VCC1=VCC2=2.7 to 5.5 V (f(XIN)=10MHz, no wait)Power Consumption 10 mA (VCC1=VCC2=5V, f(XIN)=16MHz)8 mA (VCC1=VCC2=3V, f(XIN)=10MHz)1.8 µA (VCC1=VCC2=3V, f(XCIN)=32kHz, wait mode)0.7 µA(VCC1=VCC2=3V, stop mode)Operating Ambient Temperature -20 to 85°C, -40 to 85°C Package 100-pin plastic mold QFP , LQFP1.3Block DiagramFigure 1.1 is a M16C/30P Group Block Diagram.1.4Product ListTable 1.2 lists the M16C/30P group products and Figure 1.2 shows the Type No., Memory Size, and Package.Table 1.2Product List As of Mar 2005 Type No.ROM Capacity RAM Capacity Package Type RemarksM30302MAP-XXXFP(D)96 Kbytes5 Kbytes100P6S-A MASK ROM version M30302MAP-XXXGP(D)100P6Q-AM30302MCP-XXXFP(D)128 Kbytes100P6S-AM30302MCP-XXXGP(D)100P6Q-AM30302MEP-XXXFP(D)192 Kbytes6 Kbytes100P6S-AM30302MEP-XXXGP(D)100P6Q-A(D): Under development(P): Under planning1.5Pin ConfigurationFigures 1.3 to 1.4 show the pin configurations (top view).1.6Pin DescriptionI : Input O : Output I/O : Input and outputTable 1.3Pin Description (1)Signal Name Pin Name I/O Type DescriptionPower supply input VCC1, VCC2VSS I Apply 2.7 to 5.5 V to the VCC1 and VCC2 pins and 0 V to the V SSpin. The VCC apply condition is that VCC1 = VCC2.Analog power supply input AVCC AVSS I Applies the power supply for the A/D converter. Connect the AVCCpin to VCC1. Connect the AVSS pin to VSS.Reset input RESET I The microcomputer is in a reset state when applying “L” to the thisVSSCNVSS I Connect this pin to VSS.External data bus width select input BYTE IMain clock input XIN I I/O pins for the main clock generation circuit. Connect a ceramic resonator or crystal oscillator between XIN and XOUT. To use the external clock, input the clock from XIN and leave XOUT open.Main clock output XOUT O Sub clock input XCIN I I/O pins for a sub clock oscillation circuit. Connect a crystaloscillator between XCIN and XCOUT. To use the external clock, input the clock from XCIN and leave XCOUT open.Sub clock output XCOUT O Clock output CLKOUT O The clock of the same cycle as fC, f8, or f32 is outputted.INT interrupt input INT0 to INT4I Input pins for the INT interrupt.NMI interrupt input NMI I Input pin for the NMI interrupt.Key input interrupt input KI0 to KI3I Input pins for the key input interrupt.Timer ATA0OUT to TA2OUTI/O These are timer A0 to timer A2 I/O pins. (except the output of TA0OUT for the N-channel open drain output.)TA0IN to TA2IN I These are timer A0 to timer A2 input pins.Timer BTB0IN to TB2IN I These are timer B0 to timer B2 input pins.Serial interfaceCTS0 to CTS2I These are send control input pins.RTS0 to RTS2 O These are receive control output pins.CLK0 to CLK2I/O These are transfer clock I/O pins.RXD0 to RXD2I These are serial data input pins.TXD0 to TXD2O These are serial data output pins. (except TXD2 for the N-channel open drain output.)CLKS1O This is output pin for transfer clock output from multiple pins function.I 2C mode SDA0 to SDA2I/O These are serial data I/O pins. (except SDA2 for the N-channel open drain output.)SCL0 to SCL2I/OThese are transfer clock I/O pins. (except SCL2 for the N-channel open drain output.)Table 1.4Pin Description (2)Signal Name Pin Name I/O Type DescriptionReferencevoltage inputVREF I Applies the reference voltage for the A/D converter.A/D converter AN0 to AN7,AN0_0 to AN0_7I Analog input pins for the A/D converter.ADTRG I This is an A/D trigger input pin.ANEX0I/O This is the extended analog input pin for the A/D converter, and is theoutput in external op-amp connection mode.ANEX1I This is the extended analog input pin for the A/D converter.I/O port P0_0 to P0_7,P1_0 to P1_7,P2_0 to P2_7,P3_0 to P3_7,P4_0 to P4_7,P5_0 to P5_7,P6_0 to P6_7,P7_0 to P7_7,P9_0 to P9_7,P10_0 to P10_7I/O8-bit I/O ports in CMOS, having a direction register to select an input or output.Each pin is set as an input port or output port. An input port can be setfor a pull-up or for no pull-up in 4-bit unit by program. (except P7_0 andP7_1 for the N-channel open drain output.)P8_0 to P8_4,P8_6, P8_7I/O I/O ports having equivalent functions to P0.Input port P8_5I Input pin for the NMI interrupt. Pin states can be read by the P8_5 bitin the P8 register.I : Input O : Output I/O : Input and output2.Central Processing Unit (CPU)Figure 2.1 shows the CPU registers. The CPU has 13 registers. Of these, R0, R1, R2, R3, A0, A1 and FB comprise a register bank. There are two register banks.2.1Data Registers (R0, R1, R2 and R3)The R0 register consists of 16 bits, and is used mainly for transfers and arithmetic/logic operations. R1 to R3 are the same as R0.The R0 register can be separated between high (R0H) and low (R0L) for use as two 8-bit data registers.R1H and R1L are the same as R0H and R0L. Conversely, R2 and R0 can be combined for use as a 32-bit data register (R2R0). R3R1 is the same as R2R0.2.2Address Registers (A0 and A1)The register A0 consists of 16 bits, and is used for address register indirect addressing and address register relative addressing. They also are used for transfers and logic/logic operations. A1 is the same as A0.In some instructions, registers A1 and A0 can be combined for use as a 32-bit address register (A1A0).2.3Frame Base Register (FB)FB is configured with 16 bits, and is used for FB relative addressing.2.4Interrupt Table Register (INTB)INTB is configured with 20 bits, indicating the start address of an interrupt vector table.2.5Program Counter (PC)PC is configured with 20 bits, indicating the address of an instruction to be executed.2.6User Stack Pointer (USP) and Interrupt Stack Pointer (ISP)Stack pointer (SP) comes in two types: USP and ISP, each configured with 16 bits.Your desired type of stack pointer (USP or ISP) can be selected by the U flag of FLG.2.7Static Base Register (SB)SB is configured with 16 bits, and is used for SB relative addressing.2.8Flag Register (FLG)FLG consists of 11 bits, indicating the CPU status.2.8.1Carry Flag (C Flag)This flag retains a carry, borrow, or shift-out bit that has occurred in the arithmetic/logic unit.2.8.2Debug Flag (D Flag)The D flag is used exclusively for debugging purpose. During normal use, it must be set to “0”.2.8.3Zero Flag (Z Flag)This flag is set to “1” when an arithmetic operation resulted in 0; otherwise, it is “0”.2.8.4Sign Flag (S Flag)This flag is set to “1” when an arithmetic operation resulted in a negative value; otherwise, it is “0”.2.8.5Register Bank Select Flag (B Flag)Register bank 0 is selected when this flag is “0” ; register bank 1 is selected when this flag is “1”.2.8.6Overflow Flag (O Flag)This flag is set to “1” when the operation resulted in an overflow; otherwise, it is “0”.2.8.7Interrupt Enable Flag (I Flag)This flag enables a maskable interrupt.Maskable interrupts are disabled when the I flag is “0”, and are enabled when the I flag is “1”. The I flagis cleared to “0” when the interrupt request is accepted.M16C/30P Group 2. Central Processing Unit (CPU)2.8.8Stack Pointer Select Flag (U Flag)ISP is selected when the U flag is “0”; USP is selected when the U flag is “1”.The U flag is cleared to “0” when a hardware interrupt request is accepted or an INT instruction for softwareinterrupt Nos. 0 to 31 is executed.2.8.9Processor Interrupt Priority Level (IPL)IPL is configured with three bits, for specification of up to eight processor interrupt priority levels from level 0to level 7.If a requested interrupt has priority greater than IPL, the interrupt is enabled.2.8.10Reserved AreaWhen write to this bit, write “0”. When read, its content is indeterminate.M16C/30P Group 3. Memory3.MemoryFigure 3.1 is a Memory Map of the M16C/30P group. The address space extends the 1M bytes from address 00000h to FFFFFh.The internal ROM is allocated in a lower address direction beginning with address FFFFFh. For example, a 64-Kbyte internal ROM is allocated to the addresses from F0000h to FFFFFh.The fixed interrupt vector table is allocated to the addresses from FFFDCh to FFFFFh. Therefore, store the start address of each interrupt routine here.The internal RAM is allocated in an upper address direction beginning with address 00400h. For example, a 10-Kbyte internal RAM is allocated to the addresses from 00400h to 02BFFh. In addition to storing data, the internal RAM also stores the stack used when calling subroutines and when interrupts are generated. The SFR is allocated to the addresses from 00000h to 003FFh. Peripheral function control registers are located here. Of the SFR, any area which has no functions allocated is reserved for future use and cannot be used by users.The special page vector table is allocated to the addresses from FFE00h to FFFDBh. This vector is used by the JMPS or JSRS instruction. For details, refer to the M16C/60 and M16C/20 Series Software Manual.4.Special Function Register (SFR)SFR(Special Function Register) is the control register of peripheral functions. Tables 4.1 to 4.5 list the SFR information.Table 4.1SFR Information(1) (1)Address Register Symbol After Reset 0000h0001h0002h0003h0004h Processor Mode Register 0 (2)PM000h0005h Processor Mode Register 1PM100XXX0XXb0006h System Clock Control Register 0CM001001000b0007h System Clock Control Register 1CM100100000b0008h0009h Address Match Interrupt Enable Register AIER XXXXXX00b000Ah Protect Register PRCR XX000000b000Bh000Ch000Dh000Eh Watchdog Timer Start Register WDTS XXh000Fh Watchdog Timer Control Register WDC00XXXXXXb0010h Address Match Interrupt Register 0RMAD000h0011h00h0012h X0h0013h0014h Address Match Interrupt Register 1RMAD100h0015h00h0016h X0h0017h0018h0019h001Ah001Bh001Ch001Dh001Eh001Fh0020h DMA0 Source Pointer SAR0XXh0021h XXh0022h XXh0023h0024h DMA0 Destination Pointer DAR0XXh0025h XXh0026h XXh0027h0028h DMA0 Transfer Counter TCR0XXh0029h XXh002Ah002Bh002Ch DMA0 Control Register DM0CON00000X00b002Dh002Eh002Fh0030h DMA1 Source Pointer SAR1XXh0031h XXh0032h XXh0033h0034h DMA1 Destination Pointer DAR1XXh0035h XXh0036h XXh0037h0038h DMA1 Transfer Counter TCR1XXh0039h XXh003Ah003Bh003Ch DMA1 Control Register DM1CON00000X00b003Dh003Eh003FhNOTES:1.The blank areas are reserved and cannot be accessed by users.2.The PM00 and PM01 bits do not change at software reset.X : Nothing is mapped to this bitTable 4.2SFR Information(2) (1)Address Register Symbol After Reset 0040h0041h0042h0043h0044h INT3 Interrupt Control Register INT3IC XX00X000b0045h0046h UART1 BUS Collision Detection Interrupt Control Register U1BCNIC XXXXX000b 0047h UART0 BUS Collision Detection Interrupt Control Register U0BCNIC XXXXX000b 0048h0049h INT4 Interrupt Control Register INT4IC XX00X000b004Ah UART2 Bus Collision Detection Interrupt Control Register BCNIC XXXXX000b004Bh DMA0 Interrupt Control Register DM0IC XXXXX000b004Ch DMA1 Interrupt Control Register DM1IC XXXXX000b004Dh Key Input Interrupt Control Register KUPIC XXXXX000b004Eh A/D Conversion Interrupt Control Register ADIC XXXXX000b004Fh UART2 Transmit Interrupt Control Register S2TIC XXXXX000b 0050h UART2 Receive Interrupt Control Register S2RIC XXXXX000b 0051h UART0 Transmit Interrupt Control Register S0TIC XXXXX000b 0052h UART0 Receive Interrupt Control Register S0RIC XXXXX000b 0053h UART1 Transmit Interrupt Control Register S1TIC XXXXX000b 0054h UART1 Receive Interrupt Control Register S1RIC XXXXX000b 0055h Timer A0 Interrupt Control Register TA0IC XXXXX000b 0056h Timer A1 Interrupt Control Register TA1IC XXXXX000b 0057h Timer A2 Interrupt Control Register TA2IC XXXXX000b 0058h0059h005Ah Timer B0 Interrupt Control Register TB0IC XXXXX000b005Bh Timer B1 Interrupt Control Register TB1IC XXXXX000b005Ch Timer B2 Interrupt Control Register TB2IC XXXXX000b005Dh INT0 Interrupt Control Register INT0IC XX00X000b005Eh INT1 Interrupt Control Register INT1IC XX00X000b005Fh INT2 Interrupt Control Register INT2IC XX00X000b0060hto024Fh0250h0251h0252h0253h0254h0255h0256h0257h0258h0259h025Ah025Bh025Ch025Dh025Eh Peripheral Clock Select Register PCLKR00000011b025Fh0260hto0335h0336h0337h0338h0339h033Ah033Bh033Ch033Dh033Eh033FhNOTES:1.The blank areas are reserved and cannot be accessed by users.X : Nothing is mapped to this bitTable 4.3SFR Information(3) (1)Address Register Symbol After Reset 0340h0341h0342h0343h0344h0345h0346h0347h0348h0349h034Ah034Bh034Ch034Dh034Eh034Fh0350h0351h0352h0353h0354h0355h0356h0357h0358h0359h035Ah035Bh035Ch035Dh035Eh Interrupt Factor Select Register 2IFSR2A00XXXXXXb035Fh Interrupt Factor Select Register IFSR00h0360h0361h0362h0363h0364h0365h0366h0367h0368h0369h036Ah036Bh036Ch UART0 Special Mode Register 4U0SMR400h036Dh UART0 Special Mode Register 3U0SMR3000X0X0Xb036Eh UART0 Special Mode Register 2U0SMR2X0000000b036Fh UART0 Special Mode Register U0SMR X0000000b0370h UART1 Special Mode Register 4U1SMR400h0371h UART1 Special Mode Register 3U1SMR3000X0X0Xb0372h UART1 Special Mode Register 2U1SMR2X0000000b0373h UART1 Special Mode Register U1SMR X0000000b0374h UART2 Special Mode Register 4U2SMR400h0375h UART2 Special Mode Register 3U2SMR3000X0X0Xb0376h UART2 Special Mode Register 2U2SMR2X0000000b0377h UART2 Special Mode Register U2SMR X0000000b0378h UART2 Transmit/Receive Mode Register U2MR00h0379h UART2 Bit Rate Generator U2BRG XXh037Ah UART2 Transmit Buffer Register U2TB XXh037Bh XXh037Ch UART2 Transmit/Receive Control Register 0U2C000001000b037Dh UART2 Transmit/Receive Control Register 1U2C100000010b037Eh UART2 Receive Buffer Register U2RB XXh037Fh XXhNOTES:1.The blank areas are reserved and cannot be accessed by users.X : Nothing is mapped to this bitTable 4.4SFR Information(4) (1)Address Register Symbol After Reset 0380h Count Start Flag TABSR000XX000b0381h Clock Prescaler Reset Fag CPSRF0XXXXXXXb 0382h One-Shot Start Flag ONSF00XXX000b0383h Trigger Select Register TRGSR XXXX0000b 0384h Up-Down Flag UDF XX0XX000b (2) 0385h0386h Timer A0 Register TA0XXh0387h XXh0388h Timer A1 Register TA1XXh0389h XXh038Ah Timer A2 Register TA2XXh038Bh XXh038Ch038Dh038Eh038Fh0390h Timer B0 Register TB0XXh0391h XXh0392h Timer B1 Register TB1XXh0393h XXh0394h Timer B2 Register TB2XXh0395h XXh0396h Timer A0 Mode Register TA0MR00h0397h Timer A1 Mode Register TA1MR00h0398h Timer A2 Mode Register TA2MR00h0399h039Ah039Bh Timer B0 Mode Register TB0MR00XX0000b039Ch Timer B1 Mode Register TB1MR00XX0000b039Dh Timer B2 Mode Register TB2MR00XX0000b039Eh039Fh03A0h UART0 Transmit/Receive Mode Register U0MR00h03A1h UART0 Bit Rate Generator U0BRG XXh03A2h UART0 Transmit Buffer Register U0TB XXh03A3h XXh03A4h UART0 Transmit/Receive Control Register 0U0C000001000b03A5h UART0 Transmit/Receive Control Register 1U0C100000010b03A6h UART0 Receive Buffer Register U0RB XXh03A7h XXh03A8h UART1 Transmit/Receive Mode Register U1MR00h03A9h UART1 Bit Rate Generator U1BRG XXh03AAh UART1 Transmit Buffer Register U1TB XXh03ABh XXh03ACh UART1 Transmit/Receive Control Register 0U1C000001000b03ADh UART1 Transmit/Receive Control Register 1U1C100000010b03AEh UART1 Receive Buffer Register U1RB XXh03AFh XXh03B0h UART Transmit/Receive Control Register 2UCON X0000000b03B1h03B2h03B3h03B4h03B5h03B6h03B7h03B8h DMA0 Request Factor Select Register DM0SL00h03B9h03BAh DMA1 Request Factor Select Register DM1SL00h03BBh03BCh CRC Data Register CRCD XXh03BDh XXh03BEh CRC Input Register CRCIN XXh03BFhNOTES:1.The blank areas are reserved and cannot be accessed by users.2.Bit 5 in the Up-down flag is “0” by reset. However, The values in these bits when read are indeterminate.X : Nothing is mapped to this bitTable 4.5SFR Information(5) (1)Address Register Symbol After Reset 03C0h A/D Register 0AD0XXh03C1h XXh03C2h A/D Register 1AD1XXh03C3h XXh03C4h A/D Register 2AD2XXh03C5h XXh03C6h A/D Register 3AD3XXh03C7h XXh03C8h A/D Register 4AD4XXh03C9h XXh03CAh A/D Register 5AD5XXh03CBh XXh03CCh A/D Register 6AD6XXh03CDh XXh03CEh A/D Register 7AD7XXh03CFh XXh03D0h03D1h03D2h03D3h03D4h A/D Control Register 2ADCON2XXX000X0b03D5h03D6h A/D Control Register 0ADCON0000X0XXXb03D7h A/D Control Register 1ADCON100000XXXb03D8h03D9h03DAh03DBh03DCh03DDh03DEh03DFh03E0h Port P0 Register P0XXh03E1h Port P1 Register P1XXh03E2h Port P0 Direction Register PD000h03E3h Port P1 Direction Register PD100h03E4h Port P2 Register P2XXh03E5h Port P3 Register P3XXh03E6h Port P2 Direction Register PD200h03E7h Port P3 Direction Register PD300h03E8h Port P4 Register P4XXh03E9h Port P5 Register P5XXh03EAh Port P4 Direction Register PD400h03EBh Port P5 Direction Register PD500h03ECh Port P6 Register P6XXh03EDh Port P7 Register P7XXh03EEh Port P6 Direction Register PD600h03EFh Port P7 Direction Register PD700h03F0h Port P8 Register P8XXh03F1h Port P9 Register P9XXh03F2h Port P8 Direction Register PD800X00000b03F3h Port P9 Direction Register PD900h03F4h Port P10 Register P10XXh03F5h03F6h Port P10 Direction Register PD1000h03F7h03F8h03F9h03FAh03FBh03FCh Pull-Up Control Register 0PUR000h03FDh Pull-Up Control Register 1PUR100h03FEh Pull-Up Control Register 2PUR200h03FFh Port Control Register PCR00hNOTES:1.The blank areas are reserved and cannot be accessed by users.X : Nothing is mapped to this bit5.Electrical CharacteristicsTable 5.1Absolute Maximum RatingsSymbol Parameter Condition Rated Value Unit V CC Supply Voltage(V CC1=V CC2)V CC1=V CC2=AV CC−0.3 to 6.5V AV CC Analog Supply Voltage V CC1=V CC2=AV CC−0.3 to 6.5V V I Input Voltage RESET, CNVSS, BYTE,P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7,P9_0 to P9_7, P10_0 to P10_7,VREF, XIN−0.3 to V CC+0.3VP7_0, P7_1−0.3 to 6.5VV O OutputVoltage P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4,P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7,XOUT−0.3 to V CC+0.3V P7_0, P7_1−0.3 to 6.5VP d Power Dissipation−40°C<T opr≤85°C300mW T opr OperatingAmbientTemperatureWhen the Microcomputer is Operating−20 to 85 / −40 to 85°C T stg Storage Temperature−65 to 150°CNOTES:1.Referenced to V CC1 = V CC2 =2.7 to 5.5V at T opr = −20 to 85°C / −40 to 85°C unless otherwise specified.2.The Average Output Current is the mean value within 100ms.3.The total I OL(peak) for ports P0, P1, P2, P8_6, P8_7, P9 and P10 must be 80mA max. The total I OL(peak) for ports P3, P4, P5,P6, P7 and P8_0 to P8_4 must be 80mA max. The total I OH(peak) for ports P0, P1, and P2 must be −20mA max. The total I OH(peak) for ports P3, P4 and P5 must be −40mA max. The total I OH(peak) for ports P6, P7, and P8_0 to P8_4 must be −40mA max.The total I OH(peak) for ports P8_6, P8_7 and P9 must be −40mA max. Set Average Output Current to 1/2 of peak .4.Relationship between main clock oscillation frequency, and supply voltage.Table 5.2Recommended Operating Conditions (1)Symbol ParameterStandardUnit Min.Typ.Max.V CC Supply Voltage (V CC1=V CC2) 2.75.0 5.5V AV CC Analog Supply Voltage V CC V V SS Supply Voltage 0V AV SS Analog Supply Voltage 0V V IHHIGH Input VoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_7,P9_0 to P9_7, P10_0 to P10_7,XIN, RESET, CNVSS, BYTE 0.8V CCV CC VP7_0, P7_10.8V CC6.5V V ILLOW InputVoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7,P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7,P9_0 to P9_7, P10_0 to P10_7,XIN, RESET, CNVSS, BYTE0.2V CCVI OH(peak)HIGH Peak Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7−10.0mA I OH(avg)HIGH Average Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7−5.0mA I OL(peak)LOW Peak Output Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_710.0mA I OL(avg)LOW Average Output CurrentP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_75.0mA f(XIN)Main Clock Input Oscillation Frequency (4)V CC =4.2V to 5.5V 016MHz V CC =2.7V to 4.2V 04×V CC −0.8MHz f(XCIN)Sub-Clock Oscillation Frequency 32.76850kHz f(BCLK)CPU Operation Clock16MHzNOTES:1.Referenced to V CC =AV CC =V REF =3.3 to 5.5V, V SS =AV SS =0V at T opr = −20 to 85°C / −40 to 85°C unless otherwise specified.2.φAD frequency must be 10 MHz or less.3.When sample & hold function is disabled, φAD frequency must be 250 kHz or more, in addition to the limitation in Note 2.When sample & hold function is enabled, φAD frequency must be 1MHz or more, in addition to the limitation in Note 2.Table 5.3A/D Conversion Characteristics (1)Symbol ParameterMeasuring ConditionStandard Unit Min.Typ.Max.−ResolutionV REF =V CC 10Bits INLIntegral Non-Linearity Error10bitV REF =V CC =5V AN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input ±5LSBV REF =V CC =3.3VAN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input ±7LSB8bitV REF =V CC =3.3V ±2LSB −Absolute Accuracy 10bitV REF =V CC =5V AN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input ±5LSBV REF =V CC =3.3VAN0 to AN7 input,AN0_0 to AN0_7 input, ANEX0, ANEX1 input±7LSB8bitV REF =V CC =3.3V ±2LSB −Tolerance Level Impedance 3k ΩDNL Differential Non-Linearity Error ±2LSB −Offset Error ±5LSB −Gain Error ±5LSB R LADDER Ladder ResistanceV REF =V CC1040k Ωt CONV 10-bit Conversion Time, Sample & Hold Function AvailableV REF =V CC =5V, φAD=10MHz 3.3µs t CONV 8-bit Conversion Time, Sample & Hold Function Available V REF =V CC =5V, φAD=10MHz2.8µs t SAMP Sampling Time 0.3µs V REF Reference Voltage3.0V CC V V IAAnalog Input VoltageV REF VTable 5.4Power Supply Circuit Timing CharacteristicsSymbol Parameter Measuring ConditionStandardUnit Min.Typ.Max.t d(P-R)Time for Internal Power Supply StabilizationDuring Powering-OnV CC=2.7V to 5.5V2ms t d(R-S)STOP Release Time1500µs t d(W-S)Low Power Dissipation Mode Wait ModeRelease Time1500µsNOTES:1.Referenced to V CC1=V CC2=4.2 to 5.5V, V SS = 0V at T opr = −20 to 85°C / −40 to 85°C, f(XIN)=16MHz unless otherwisespecified.2.With one timer operated using fC32.3.This indicates the memory in which the program to be executed exists.Table 5.5Electrical Characteristics (1)Symbol ParameterMeasuring ConditionStandard UnitMin.Typ.Max.V OHHIGH Output Voltage P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OH =−5mA V CC −2.0V CCVV OHHIGH Output VoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_2 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OH =−200µA V CC −0.3V CC VV OH HIGH Output Voltage XOUT HIGHPOWER I OH =−1mA V CC −2.0V CC V LOWPOWER I OH =−0.5mA V CC −2.0V CCHIGH Output Voltage XCOUTHIGHPOWER With no load applied 2.5VLOWPOWERWith no load applied 1.6V OLLOW Output Voltage P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OL =5mA2.0VV OLLOW Output VoltageP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7I OL =200µA0.45VV OL LOW Output Voltage XOUT HIGHPOWER I OL =1mA 2.0V LOWPOWER I OL =0.5mA2.0LOW Output Voltage XCOUTHIGHPOWER With no load applied 0VLOWPOWERWith no load appliedV T+-V T-HysteresisTA0IN to TA2IN, TB0IN to TB2IN,INT0 to INT4, NMI, ADTRG, CTS0 to CTS2, CLK0 to CLK2, TA0OUT to TA2OUT, KI0 to KI3, RXD0 to RXD2, SCL0 to SCL2, SDA0 to SDA20.2 1.0V V T+-V T-Hysteresis RESET 0.2 2.5V V T+-V T-HysteresisXIN0.20.8VI IHHIGH Input Current P0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, XIN, RESET, CNVSS, BYTE V I =5V5.0µAI IL LOW Input CurrentP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7, P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_7, P9_0 to P9_7, P10_0 to P10_7, XIN, RESET, CNVSS, BYTEV I =0V−5.0µAR PULLUP Pull-UpResistanceP0_0 to P0_7, P1_0 to P1_7, P2_0 to P2_7, P3_0 to P3_7, P4_0 to P4_7, P5_0 to P5_7,P6_0 to P6_7, P7_0 to P7_7, P8_0 to P8_4, P8_6, P8_7, P9_0 to P9_7, P10_0 to P10_7V I =0V 3050170k ΩR fXIN Feedback Resistance XIN 1.5M ΩR fXCIN Feedback Resistance XCIN 15M ΩV RAM RAM Retention Voltage At stop mode2.0V I CCPower Supply Current(V CC1=V CC2=4.2V to 5.5V)In single-chip mode, the output pins are open and other pins are V SSMask ROM f(XIN)=16MHz No division10mA f(XCIN)=32kHz Low power dissipation mode,ROM (3)25µA f(XCIN)=32kHz Wait mode (2),Oscillation capacity High 7.5µA f(XCIN)=32kHz Wait mode (2),Oscillation capacity Low 2.0µAStop mode Topr =25°C0.83.0µA。
电力保护设备-定义的目的定义的目的电力保护设备-GP、FP、KP、LP和MP框架系列说明书
Volume 4—Circuit Protection CA08100005E—March V4-T2-3672Definite PurposeDefinite Purpose Molded Case Circuit Breaker FamilyGP, FP, KP, LP and MP FramesContentsDescriptionPage Product Selection Guide . . . . . . . . . . . . . . . . . . . .V4-T2-368Electrical Characteristics. . . . . . . . . . . . . . . . . .V4-T2-368Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V4-T2-370Base Mounting Hardware . . . . . . . . . . . . . . . . .V4-T2-370Line and Load Termination . . . . . . . . . . . . . . . .V4-T2-370Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V4-T2-370Optional Line and Load Terminals . . . . . . . . . . .V4-T2-370Catalog Number Selection . . . . . . . . . . . . . . . . . . .V4-T2-371Product Selection . . . . . . . . . . . . . . . . . . . . . . . . .V4-T2-372Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V4-T2-373Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .V4-T2-373LearnOnlineDrawings OnlineDefinite Purpose Molded Case Circuit BreakersOptimized solution for HVAC/R and Pumping Applications.Product OverviewGP, FP, KP, LP and MP Frames 15–800 Amperes NEMA 480 VacEaton’s Definite Purpose molded case circuit breakers are available in three-pole configurations, and aredesigned to meet the specific requirements of HVAC/R and pumping applications.As with other members of Eaton’s family of molded case circuit breakers, Definite Purpose breakers provide high quality, reliability, unmatched performance and outstanding value.Eaton’s Definite Purpose breakers are rated from 15–800A and are available in five frame sizes. Each frame size has the same compact outside dimensions as Series C breakers.Additionally, Definite Purpose breakers are suitable for 50°C applications and have been rigorously tested to the UL 489 standard. They are assembled in an ISO ® certified facility.Trip Units and TerminalsDefinite Purpose breakers contain factory-sealedthermal-magnetic trip units.The GP-Frame breaker (15–100A) includes line and load terminals and breakermounting hardware. Frames FP (15–225A), KP (200–400A), LP (450–600A) and MP (700–800A) includemounting hardware and ship standard without lugs,offering additional flexibility.External AccessoriesDefinite Purpose breakers use the same external accessories as Series C breakers: handle mechanisms, motoroperators, lock-off devices, bus bar extensions and multiple terminal arrangements. A fullcomplement of terminals are available to customize Definite Purpose breakers as required.2Product Selection GuideElectrical CharacteristicsBreaker Type GPS FPS FPH KPS KPH Amperage range15–100A15–225A15–225A200–400A200–400A Performance level S S HS H Breaker capacity (kA rms)240 Vac656510065100 NEMA®, UL®, CSA®480Vac2235653565 600 Vac—18252535 Number of poles33333 Maximum voltage (Vac)480600600600600 Thermal-magnetic■■■■■V4-T2-368Volume 4—Circuit Protection CA08100005E—March Volume 4—Circuit Protection CA08100005E—March V4-T2-3692Definite PurposeElectrical Characteristics, continuedBreaker Type LPS LPH MPS MPH Amperage range 450–600A 450–600A 700–800A 700–800A Performance level S H S HBreaker capacity (kA rms)240 Vac 6510065100NEMA, UL, CSA480 Vac35655065600 Vac 25352535Number of poles 3333Maximum voltage (Vac)600600600600Thermal-magnetic■■■■2FeaturesBase Mounting HardwareMetric base mountinghardware is included witheach breaker. Englishmounting hardwareis available for fieldinstallation only.Line and Load TerminalsBoth line and load terminalsare included with GP-FrameDefinite Purpose breakers.OptionsOptional Line andLoad TerminalsCompression terminals withhardware are available for awide range of conductors.Field installation only.Base Mounting HardwareLine and Load T erminationOptional Line and Load T erminalsNotes1Base mounting hardware, is included with GP-Frame breakers. A separate catalog numberis not required.2Package of three terminals.FrameCatalog NumberEnglish MetricGP 1——FP BMH1BMH1MKP BMH3BMH3MLP BMH4BMH4MMP BMH5BMH5MBreakerTerminationTypeAwg WireRangeMetric WireRange (mm)WireTypeBolt SizeEnglishBolt SizeMetricTorqueLb–InTorqueNmCatalogNumberGP Wire#14–1/0 2.5–50Cu only——45 5.1IncludedBreakerMaximumAmperesAwg WireRangeWireTypeCatalogNumberCatalog Numberwith Control WireTerminationFP100#14–#10Cu/Al3T100FB 2—100#8Cu/Al3T100FB 2—100#6–#4Cu/Al3T100FB 2—100#3–4/0Cu/Al3T100FB 2—200#3–4/0Cu only3T150FB 2—225#4–4/0Cu/Al3TA225FB 2—225#6–300Cu/Al3TA225FDK 2—KP400250–500 (1)Cu/Al TA350K—4003/0–250 (2)Cu/Al3TA400K 23TA400KCWLP500250–350 (2)Cu/Al TA602LD TA602LDCW600400–500 (2)Cu/Al3TA603LDK 23TA603LDKCWMP8003/0–400 (3)Cu/Al TA800MA2 TA800MA2CWT800500–750 (2)Cu/Al TA801MA TA801MACWTV4-T2-370Volume 4—Circuit Protection CA08100005E—March Volume 4—Circuit Protection CA08100005E—March V4-T2-3712Definite PurposeCatalog Number SelectionNotes1Not available on GP-Frame.2When choosing a molded case switch, select the highest amperage rating for the frame and the standard interrupting rating.Frame Size GP = GP -Frame FP = FP -Frame KP = KP -Frame LP = LP -Frame MP = LP -FrameNumber of Poles 3 = Three-poleAmpere Rating GP-Frame FP-Frame KP-Frame LP-Frame MP-Frame 015= 15A 020= 20A 025= 25A 030= 30A 035= 35A 040= 40A 045= 45A 050= 50A 060= 60A 070= 70A 080= 80A 090= 80A 100= 100A015= 15A 020= 20A 025= 25A 030= 30A 035= 35A 040= 40A 045= 45A 050= 50A 060= 60A 070= 70A 080= 80A 100= 100A 110= 110A 125= 125A 150= 150A 175= 175A 200= 200A 225= 225A175= 175A 200= 200A 250= 250A 300= 300A 400= 400A450= 450A 500= 500A 600= 600A 700= 700A 800= 800AOptionsK = Molded case switch 2L = Line and load terminals W = Without terminals 1Interrupting Rating S = Standard H = High 1FP S 3 150 L2Product SelectionCatalog NumbersWhen ordering Definite Purpose breakers, use the appropriatecatalog numbers given below.GP-Frame/15–100A FP-Frame/15–225AFrame/Ampere RatingThree-PoleCatalogNumberGP/15–100A circuit breakers GPS3015GPS3020GPS3025GPS3030GPS3035GPS3040GPS3045GPS3050GPS3060GPS3070GPS3080GPS3090GPS3100GP/100A molded case switchGPS3100KGP 100Frame/Ampere RatingThree-PoleCatalogNumberFP/15–225A circuit breakers FPS3015FPS3020FPS3025FPS3030FPS3035FPS3040FPS3045FPS3050FPS3060FPS3070FPS3080FPS3100FPS3110FPS3125FPS3150FPS3175FPS3200FPS3225FPH3015FPH3020FPH3025FPH3030FPH3035FPH3040FPH3045FPH3050FPH3060FPH3070FPH3080FPH3100FPH3110FPH3125FPH3150FPH3175FPH3200FPH3225FP/225A molded case switchFPS3225KFP 225V4-T2-372Volume 4—Circuit Protection CA08100005E—March Volume 4—Circuit Protection CA08100005E—March V4-T2-3732Definite PurposeKP-Frame/200–400ALP-Frame/450–600AMP-Frame/700–800AFrame/Ampere RatingThree-PoleCatalog Number KP/175–400A circuit breakersKPS3175KPS3200KPS3250KPS3300KPS3400KPH3175KPH3200KPH3250KPH3300KPH3400KP/400A molded case switchKPS3400KFrame/Ampere RatingThree-PoleCatalog Number LP/450–600A circuit breakersLPS3450LPS3500LPS3600LPH3450LPH3500LPH3600LP/600A molded case switchLPS3600KFrame/Ampere RatingThree-PoleCatalog Number MP/700–800A circuit breakersMPS3700MPS3800MPH3700MPH3800MP/800A molded case switchMPS3800KKP 250LP 400MP 800AccessoriesEnd Cap Accessory KitEnd caps for line and load conductor termination are optional with each breaker. End caps secure theconductor with a ring-type connector. The kit includes one end cap, three capscrews, three nuts and three lock washers.Series C AccessoriesFor internal accessories, see Page V4-T2-303.For external accessories, see Page V4-T2-334.End Cap Accessory KitDimensionsApproximate Dimensions in Inches (mm)All dimensions are provided for guidance and should not be used for construction purposes unless approved.Contact Eaton for detailed outline drawings.GP , FP , KP , LP and MP Definite Purpose FramesBreaker Type GP FP KP LP MP Width 3.00 (76.2) 4.13 (104.9) 5.49 (139.4)8.25 (209.6)8.25 (209.6)Height 4.88 (124.0)6.00 (152.4)10.12 (257.0)10.75 (273.1)16.00 (406.4)Depth 2.63 (66.7)3.38 (85.9)4.31 (109.6)3.81 (96.8)4.06 (103.1)。
LNK302-306中文资料
D Package (SO-8C)
S1 S2 BP 3 FB 4
8S 7S
5D
3a
BP 1 FB 2
D4
8S 7S 6S 5S
3b
图 3. 引脚布局
PI-5422-041509
LinkSwitch-TN 功能描述
LinkSwitch-TN在一个器件上结合了一个高压功率MOSFET 开关及一个电源控制器。与传统的PWM(脉宽调制)控制器 不同，LinkSwitch-TN采用简单的开/关控制器来调节输出 电压。LinkSwitch-TN的控制器包括一个振荡器、反馈电 路(检测及逻辑电路)、5.8 V稳压电路、旁路引脚欠压电 路、过温保护、频率调制、限流电路、前沿消隐电路及 一个700 V的功率MOSFET。LinkSwitch-TN还另外集成了 用于自动重启动的保护电路。
振荡器
典型的振荡器频率由内部设置，其平均频率为66 kHz。 振荡器可生成两个信号：最大占空比信号(DCMAX)及每个 开关周期开始的时钟信号。
LNK302/304-306
LinkSwitch-TN的振荡器电路可产生轻微的频率调制，通 常为4 kHz峰峰值用来降低EMI。频率调制的调制速率设 置在1 kHz的水平，目的是优化EMI并降低其平均值及准 峰值。测量频率调制时应把示波器触发设定在漏极电压 波形的下降沿来测量。图4的波形显示了LinkSwitch-TN的 频率调制状态。
反馈输入电路 在FB引脚的反馈输入电路由一个低阻抗的源极跟随器 输出，其输出设定为1.65 V。当流入此引脚的电流大于 49 µA时，在反馈电路的输出会产生一个低的逻辑电平信 号(禁止信号)。在每个时钟信号的上升沿，对此输出电 平进行采样。如果采样值为高电平，功率MOSFET在此 周期开通(使能)。相反，如果此采样电平为低电平，功率 MOSFET会保持关断状态(禁止)。由于采样仅在每个周期 信号的上升沿处进行，此周期中随后产生的FB引脚电压或 电流的变化对MOSFET状态都不构成影响。
TA3020中文资料
TECHNICAL INFORMATION
Stereo 300W (4Ω) Class-T Digital Audio Amplifier Driver using Digital Power ProcessingTM Technology TA3020
PRELIMINARY – January 2001
2
TA3020, Rev 2.1, 01.01
元器件交易网
TECHNICAL INFORMATION
Electrical Characteristics (Note 6)
TA = 25 °C. See Application/Test Circuit on page 7. Unless otherwise noted, the supply voltage is VPP=|VNN|=45V.
SYMBOL Iq PARAMETER Quiescent Current (No load, BBM0=1,BBM1=0, Mute = 0V) Mute Supply Current (No load, Mute = 5V) High-level input voltage (MUTE) Low-level input voltage (MUTE) High-level output voltage (HMUTE) IOH = 3mA Low-level output voltage (HMUTE) Output Offset Voltage Over Current Sense Voltage Threshold VPPSENSE Threshold Currents IOL = 3mA No Load, MUTE = Logic low 0.1% RFBA, RFBB, RFBC resistors TBD Over-voltage turn on (muted) Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted) Over-voltage turn on (muted) Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted) Over-voltage turn on (muted) Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted) Over-voltage turn on (muted) Over-voltage turn off (mute off) Under-voltage turn off (mute off) Under-voltage turn on (muted) -TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD 1.0 162 154 79 72 TBD TBD TBD TBD 174 169 86 77 TBD TBD TBD TBD 4.0 0.5 TBD TBD TBD TBD TBD TBD TBD TBD TBD TBD CONDITIONS VPP = +45V VNN = -45V V5 = 5V VN10 = 10V VPP = +45V VNN = -45V V5 = 5V VN10 = 10V 3.5 1.0 MIN. TYP. 90 90 45 200 1 1 20 1 MAX. UNITS mA mA mA mA mA mA mA mA V V V V mV V µA µA µA µA V V V V µA µA µA µA V V V V
DMP3020LSS-13;中文规格书,Datasheet资料
Features• Low On-Resistance• 14m Ω @ V GS = -10V • 25m Ω @ V GS = -4.5V • Low Gate Threshold Voltage • Low Input Capacitance • Fast Switching Speed • Low Input/Output Leakage • Lead Free By Design/RoHS Compliant (Note 1) • "Green" Device (Note 2) • Qualified to AEC-Q101 Standards for High ReliabilityMechanical Data• Case: SO-8 • Case Material: Molded Plastic, “Green” Molding Compound.UL Flammability Classification Rating 94V-0 • Moisture Sensitivity: Level 1 per J-STD-020 • Terminals Connections: See Diagram • Terminals: Finish - Matte Tin annealed over Copper leadframe. Solderable per MIL-STD-202, Method 208 • Weight: 0.072g (approximate)Ordering Information (Note 3)Part Number Case Packaging DMP3020LSS-13SO-82500/Tape & ReelNotes: 1. No purposefully added lead.2. Diodes Inc.'s "Green" policy can be found on our website at .3. For packaging details, go to our website at .Marking InformationSO-8Top ViewTop ViewInternal SchematicS D D GD DS S Top ViewP3020LS YY WWMaximum Ratings@T A = 25°C unless otherwise specifiedCharacteristic SymbolValueUnits Drain-Source Voltage V DSS-30 VGate-Source Voltage V GSS±25 VDrain Current (Note 4) Steady State T A = 25°CT A = 70°CI D-12-6APulsed Drain Current (Note 5) I DM-40 AThermal CharacteristicsCharacteristic SymbolValueUnit Total Power Dissipation (Note 4) P D 2.5 WThermal Resistance, Junction to Ambient RθJA50 °C/WOperating and Storage Temperature Range T J, T STG-55 to +150 °CElectrical Characteristics@T A = 25°C unless otherwise specifiedCharacteristic SymbolMinTypMaxUnitTestConditionOFF CHARACTERISTICS (Note 6)Drain-Source Breakdown Voltage BV DSS-30 ⎯⎯V V GS = 0V, I D = -250μAZero Gate Voltage Drain Current I DSS⎯⎯-1 μA V DS = -30V, V GS = 0VGate-Source Leakage I GSS ⎯⎯±100nAV GS = ±20V, V DS = 0V ⎯⎯±800 V GS = ±25V, V DS = 0VON CHARACTERISTICS (Note 6)Gate Threshold Voltage V GS(th)-1 ⎯-2 VV DS = V GS, I D = -250μAStatic Drain-Source On-Resistance R DS (ON)⎯⎯11.618.61425mΩV GS = -10V, I D = -8AV GS = -4.5V, I D = -5AForward Transconductance g fs⎯12 ⎯S V DS = -10V, I D = -12ADiode Forward Voltage (Note 6) V SD-0.5 ⎯-1.1 VV GS = 0V, I S = -2ADYNAMIC CHARACTERISTICSInput Capacitance C iss⎯1802 ⎯pFV DS = -15V, V GS = 0V, f = 1.0MHz Output Capacitance C oss⎯415 ⎯pFReverse Transfer Capacitance C rss⎯295 ⎯pFGate Resistance R G⎯ 2.3 ⎯ ΩV GS = 0V, V DS = 0V, f = MHz SWITCHING CHARACTERISTICSTotal Gate Charge Q g⎯ 15.330.7 ⎯nCV DS = -15V, V GS = -4.5V, I D = -8AV DS = -15V, V GS = -10V, I D = -8AGate-Source Charge Q gs⎯ 3.5 ⎯ V DS = -15V, V GS = -10V, I D = -8A Gate-Drain Charge Q gd⎯ 7.9 ⎯ V DS = -15V, V GS = -10V, I D = -8A Turn-On Delay Time t d(on)⎯ 5.1 ⎯ns V GS = -10V, V DS = -15V, R D = 15Ω, R G = 6ΩRise Time t r⎯ 8 ⎯ Turn-Off Delay Time t d(off)⎯ 46 ⎯ Fall Time t f⎯ 30 ⎯Notes: 4. Device mounted on 2 oz. Copper pads on FR-4 PCB with RθJA = 50°C/W.5. Pulse width ≤10μS, Duty Cycle ≤1%.6. Short duration pulse test used to minimize self-heating effect.Fig. 1 Typical Output Characteristic-V , DRAIN-SOURCE VOLTAGE (V)DS -I , D R A I N C U R R E N T (A )DFig. 2 Typical Transfer Characteristic-V , GATE-SOURCE VOLTAGE (V)GS -I , D R A I N C U R R E N T (A )DFig. 3 Typical On-Resistance vs. Drain Current and Gate Voltage-I , DRAIN-SOURCE CURRENT (A)D R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 4 Typical On-Resistance vs. Drain Current and T emperature0.0050.010.0150.020.0250.03-I , DRAIN CURRENT (A)D R , D R A I N -S O U R C E O N -R E S I S T A N C E ()D S (O N )ΩFig. 5 Normalized On-Resistance vs. Ambient TemperatureT , AMBIENT TEMPERATURE (°C)A R , D R A I N -S O U R C E O N -R E S I S T A N C E (N O R M A L I Z E D )D S (O N )Fig. 6 Typical Total CapacitanceV , DRAIN-SOURCE VOLTAGE (V)DS C , C A P A C I T A N C E (p F )Fig. 7 Gate Threshold Variation vs. Ambient T emperatureT , AMBIENT TEMPERATURE (°C)A -V , G A T E T H R E S H O L D V O L T A G E (V )G S (T H )Fig. 8 Diode Forward Voltage vs. Current48-V , SOURCE-DRAIN VOLTAGE (V)SD -I , S O U R C E C U R R E N T (A )SV , DRAIN-SOURCE VOLTAGE (V)DS Fig. 9 SOA, Safe Operation Area0.01I , D R A I N C U R R E N T (A )D0.00010.0010.010.11101001,00010,000r (t ), T R A N S I E N T T H E R M A L R E S I S T A N C Et , PULSE DURATION TIME (s)1Package Outline DimensionsSuggested Pad LayoutSO-8Dim Min Max A - 1.75 A1 0.10 0.20 A2 1.30 1.50 A3 0.15 0.25 b 0.3 0.5 D 4.85 4.95 E 5.90 6.10 E1 3.85 3.95 e 1.27 Typ h - 0.35 L 0.62 0.82θ0° 8° All Dimensions in mmDimensionsValue (in mm)X 0.60 Y1.55 C15.4 C21.27Gauge Plane Seating PlaneDetail ‘A’XC2YIMPORTANT NOTICEDIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated website, harmless against all damages.Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel. Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings noted herein may also be covered by one or more United States, international or foreign trademarks.LIFE SUPPORTDiodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:A. Life support devices or systems are devices or systems which:1. are intended to implant into the body, or2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in thelabeling can be reasonably expected to result in significant injury to the user.B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause thefailure of the life support device or to affect its safety or effectiveness.Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.Copyright © 2011, Diodes Incorporated分销商库存信息: DIODESDMP3020LSS-13。
K3020PG资料
K3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors1PbP b -freee3Optocoupler, Phototriac Output, 400 V V DRMFeatures•Isolation materials according to UL 94-VO •Pollution degree 2 (DIN/VDE 0110 resp. IEC 60664)•Climatic classification 55/100/21 (IEC 60068 part 1)•Special construction: Therefore, extra low cou-pling capacity of typical 0.2 pF, high C ommon M ode R ejection •I FT offered into 4 groups•Rated impulse voltage (transient overvoltage) V IOTM = 6 kV peak•Isolation test voltage (partial discharge test volt-age) V pd = 1.6 kV•Rated isolation voltage (RMS includes DC) V IOWM = 600 V RMS (848 V peak)•Rated recurring peak voltage (repetitive) V IORM = 600 V RMS•Thickness through insulation ≥ 0.75 mm •Creepage current resistance according to VDE 0303/IEC 60112 C omparative T racking I ndex: CTI = 275•Lead-free component•Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/ECAgency Approvals•UL1577, File No. E76222 System Code C, Double Protection•BSI: BS EN 41003, BS EN 60095 (BS 415), BS EN 60950 (BS 7002), Certificate number 7081 and 7402•DIN EN 60747-5-2 (VDE0884)DIN EN 60747-5-5 pending•FIMKO (SETI): EN 60950, Certificate No. 12398ApplicationsMonitorsAir conditioners Line Switches Solid state relay MicrowaveCircuits for safe protective separation against electri-cal shock according to safety class II (reinforced iso-lation):• For appl. class I - IV at mains voltage ≤ 300 V• For appl. class I - III at mains voltage ≤ 600 V accord-ing to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending, table 2, suitable for.Order InformationG = Leadform 10.16 mm; G is not marked on the bodyDescriptionThe K3020P/ K3020PG series consists of a pho-totransistor optically coupled to a gallium arsenide infrared-emitting diode in a 6-lead plastic dual inline package.Part RemarksK3020P I FT < 30 mA, V DRM = 400 V, DIP-6 300 mil K3021P I FT < 15 mA, V DRM = 400 V, DIP-6 300 mil K3022PI FT < 10 mA, V DRM = 400 V, DIP-6 300 mil K3023P I FT < 5 mA, V DRM = 400 V, DIP-6 300 mil K3036P I FT < 3.6 mA, V DRM = 400 V, DIP-6 300 mil K3020PG I FT < 30 mA, V DRM = 400 V, DIP-6 400 mil K3021PG I FT < 15 mA, V DRM = 400 V, DIP-6 400 mil K3022PG I FT < 10 mA, V DRM = 400 V, DIP-6 400 mil K3023PG I FT < 5 mA, V DRM = 400 V, DIP-6 400 mil K3036PGI FT < 3.6 mA, V DRM = 400 V, DIP-6 400 mil 2Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsVDE StandardsThese couplers perform safety functions according to the following equipment standards:DIN EN 60747-5-2(V DE0884)/ DIN EN 60747-5-5pendingOptocoupler for electrical safety requirementsIEC 60950/EN 60950Office machines (applied for reinforced isolation for mains voltage≤ 400 VRMS)VDE 0804Telecommunication apparatus and data processingIEC 60065Safety for mains-operated electronic and related household appa-ratus.Absolute Maximum RatingsT amb = 25°C, unless otherwise specifiedStresses in excess of the absolute Maximum Ratings can cause permanent damage to the device. Functional operation of the device is not implied at these or any other conditions in excess of those given in the operational sections of this document. Exposure to absolute Maximum Rating for extended periods of the time can adversely affect reliability.InputOutputCoupler1) Related to standard climate 23/50 DIN 50014ParameterTest conditionSymbol Value Unit Reverse voltage V R 5V Forward current I F 80mA Forward surge current t p ≤ 10 µsI FSM 3A Power dissipation P diss 100mW Junction temperatureT j100°CParameterTest conditionSymbol Value Unit Off state output terminal voltage V DRM 400V On state RMS current I TRM 100mA Peak surge current, non-repetitive t p ≤ 10 msI TSM 1.5A Power dissipation P diss 300mW Junction temperatureT j100°CParameterTest condition Symbol Value Unit Isolation test voltage (RMS)V ISO 1)3750V RMS Total power dissipation P tot 350mW Ambient temperature range T amb - 40 to + 85°C Storage temperature range T stg - 55 to + 100°C Soldering temperature2 mm from case, t ≤ 10 sT sld260°CK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors3Electrical CharacteristicsT amb = 25°C, unless otherwise specifiedMinimum and maximum values are testing requirements. Typical values are characteristics of the device and are the result of engineering evaluation. Typical values are for information only and are not part of the testing requirements.InputOutput1)Test voltage must be applied within dv/dt ratingsCouplerNote: I FT is defined as a minimum trigger currentParameterT est conditionSymbol MinT yp.Max Unit Forward voltage I F = 50 mA V F 1.25 1.6V Junction capacitanceV R = 0, f = 1 MHzC j50pFParameterT est conditionSymbol Min T yp.Max Unit Forward peak off-state voltage (repetitive)I DRM = 100 nA V DRM 1)400VPeak on-state voltage I TM = 100 mA V TM 1.53V Critical rate of rise of off-state voltageI FT = 0, I FT = 30 mAdV/dt cr 10V/µs dV/dt crq0.10.2V/µsParameterT est conditionPart Symbol MinT yp.Max Unit Emitting diode trigger currentV S = 3 V , R L = 150 ΩK3020P I FT 1530mA K3020PG I FT 1530mA K3021P I FT 815mA K3021PG I FT 815mA K3022P I FT 510mA K3022PG I FT 510mA K3023P I FT 25mA K3023PG I FT 25mA K3036P I FT 2 3.6mA K3036PGI FT 2 3.6mA Holding currentI F = 10 mA, V S ≥ 3 VI H100µA 4Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsFigure 1. Test circuit for dV/dt cr and dV/dt crqFigure 2.Figure 3. Motor control circuitTest condition:dV/dt crV S =2/3V DRM (Sine wave)R L =33k dV/dt crq V eff =30V (Sine wave)R L =2k9510815~K3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors5Maximum Safety Ratings(according to DIN EN 60747-5-2(VDE0884)/ DIN EN 60747-5-5 pending) see figure 1 This optocoupler is suitable for safe electrical isolation only within the safety ratings.Compliance with the safety ratings shall be ensured by means of suitable protective circuits.InputOutputCouplerInsulation Rated ParametersParameterT est conditionSymbol MinT yp.Max Unit Forward currentI F130mAParameterT est conditionSymbol MinT yp.Max Unit Power dissipationP diss600mWParameterT est conditionSymbol MinT yp.Max Unit Rated impulse voltage V IOTM 6kV Safety temperatureT si150°CParameterT est conditionSymbol Min T yp.Max Unit Partial discharge test voltage - Routine test100 %, t test = 1 s V pd 1.6kV Partial discharge test voltage - Lot test (sample test)t Tr = 60 s, t test = 10 s, (see figure 5)V IOTM 6kV V pd 1.3kV Insulation resistanceV IO = 500 VR IO 1012ΩV IO = 500 V , T amb = 100°C R IO 1011ΩV IO = 500 V , T amb = 150°C(construction test only)R IO109ΩFigure 4. Derating diagram0751502253003754505256006750255075100125150T amb (°C )9510925Figure 5. Test pulse diagram for sample test according to DIN EN60747-5-2(VDE0884)/ DIN EN 60747-; IEC6074713930V IOTMV Pd V IOWM V 6Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG SeriesVishay SemiconductorsTypical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 6. Total Power Dissipation vs. Ambient Temperature Figure 7. Forward Current vs. Forward Voltage Figure 8. Relative Threshold Forward Current vs. AmbientTemperature0100200300400020406080100P –T o t a l P o w e r D i s s i p a t i o n (m W )T amb –Ambient T emperature (°C )9611701t o t0.1110100100000.20.40.60.81.01.21.41.61.82.0V F -Forward Voltage (V )9611862F I -F o r w a r d C u r r e n t (m A )0.50.60.70.80.91.01.11.21.31.41.5–30–20–1001020304050607080T amb –Ambient T emperature (°C )9611922I –R e l a t i v e T h r e s h o l d F o r w a r d C u r r e n tF T r e l Figure 9. Relative On - State vs. Ambient TemperatureFigure 10. Off - State Current vs. Ambient TemperatureFigure 11. On - State Current vs. Ambient Temperature0.50.60.70.80.91.01.11.21.31.41.5–30–20–1001020304050607080T amb –Ambient T emperature (°C )9611923V –R e l a t i v e O n –S t a t e V o l t a g eTM r e l 1101002030405060708090100T amb –Ambient Temperature(°C)9611924I –O f f –S t a t e C u r r e n t (n A )D R M –250–200–150–100–50050100150200250–2.5–2.0–1.5–1.0–0.50.00.51.01.52.02.5V TM –On–State Voltage (V )9611926I –O n –S t a t e C u r r e n t (mA )T MK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors7Package Dimensions in mm–250–200–150–100–50050100150200250–2.5–2.0–1.5–1.0–0.50.00.51.01.52.02.5V TM –On–State Voltage (V )9611925I –O n –S t a t e C u r r e n t (m A )TM Figure12. On - State Current vs. Ambient Temperature 8Document Number 83505Rev. 1.9, 26-Oct-04K3020P/ K3020PG Series Vishay SemiconductorsPackage Dimensions in mmK3020P/ K3020PG SeriesDocument Number 83505Rev. 1.9, 26-Oct-04Vishay Semiconductors9Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution andoperatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personaldamage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyTelephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423Document Number: 91000Revision: 18-Jul-081DisclaimerLegal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网。
MBR30200PT中文资料
RMS LIMIT DC
6 4 2 0 0 2 4 6 8 10 12 14 16 18 20 22 24
AVERAGE FORWARD CURRENT, IF (AV)
AVERAGE FORWARD CURRENT, IF(AV)
Figure 5. Max. Allowable Case Temperature Vs. Average Forward Current (PerLeg)
Figure 6. Forward PowerLoss Characteristics (PerLeg)
1000
NON-REPETITIVE SURGE CURRENT, IFSM(A)
AT ANY RATED LOAD CONDITION AND WITH RATED V RRM APPLIED FOLLOWING SURGE
VF
V
IR ROJC CJ TJ TSTG
Maximum DC Reverse Current At Rated DC Blocking Voltage Typical Thermal Resistance (Note 2)
天电光电 EMC 3020 产品 A19 球泡灯参考设计说明书
天电光电EMC 3020产品A19球泡灯参考设计Lightning EMC 3020 LED A19 Bulb Reference Design目录Table of contents简介Introduction (1)灯具规格需求Define lighting requirements (2)设计目标Define design goals (2)整灯方案规划Estimate system efficiency (2)确定LED型号及数量Calculate the number of LED needed (2)散热方案设计Thermal requirements (3)驱动电源Driver (5)二次光学配件Secondary optics (5)样灯完成及测试结果Prototyping and test results (6)BOM表估算Bill of materials (8)结论Conclusion (9)简介本参考设计手册系统描述了如何应用天电光电EMC系列3020LED产品来制作9W球泡灯。
3020LED产品可以提供卓越的光电性能并大幅降低灯具系统成本。
所制作的球泡灯可广泛应用于各种室内应用，涵盖家居及商用照明应用等。
天电光电3020LED产品提供良好的大电流驱动性能，低热阻，单颗功率可以达到1.2W，是制作球泡灯的最佳LED光源之一。
同时，在台灯，吸顶灯及筒灯应用里也有非常大的优势。
IntroductionThis application note details the design of a 9W LED bulb lamp using TDEMC 3020 LED. The 3020 LED offers industry-leading performance and reduces system cost sharply. LED bulb lamps are widely used in various of indoor and outdoor applications, residential and commercial lighting applications, etc. TD EMC 3020 LED provides good performance for over-current drive, low thermal resistance, and can achieve 1.2W, which is the best candidate for use in a bulb lamp. Meanwhile, there is a great advantage in desk lamp, ceiling light and down light applications.设计目标本次设计需要达到以下参数目标：整灯方案规划本次参考设计主要通过较低的温度、较高的光学效率、较高的电源效率来达到设计目标。
DP3020-7R中文资料
1Edition 6/10.2001•Extremely slim case (4 TE), fully enclosed •Extremely low inrush current, hot swappable •Operating ambient temperature range –40...71°C with convection coolingP Series 120...195 Watt DC-DC ConvertersSelection chart2Edition 6/10.2001Cassette StyleP SeriesInputInput voltagerefer to selection chartOutputNominal output current I o1,2,3,4 nom P o nom /Number of outputs/U o1,2,3,4 nom Maximal output current I o1,2,3,4 max P o max /Number of outputs/U o1,2,3,4 nom i nom o nom Voltage setting accuracy 1, 2U i nom , I o nom ±0.6% U o1,2 nom i nom o nom ±1.5% U o3,4 nom Worst case output voltage 1, 2U i min ...U i max , 0...I o1,2 max , T C min ...T C max ±1.6% U o nom in individual or series configuration 5% I o1,4 nomin individual or series configuration 5% I o2,3 nomo1,4 min o1,4 max o1o4Load regulation output 3I o2,3 min ...I o2,3 max typ. 100 m Ω • (I o2...I o3)o nom Common power limitation (P o1 + P o4) rectangular U/I characteristic typ. 130% P o max /2o2o3o max ProtectionInput reverse polaritybuilt-in fuseInput undervoltage lockout typ. 90% U i min Input overvoltage lockout typ. 110% U i maxOutputno-load, overload and short-circuit proof Output overvoltage varistortyp. 125% U o nomOvertemperatureswitch-off with auto restartT C typ. 100°C3Edition 6/10.2001ControlOutput voltage adjustment output 1, 460/80...110% U o nomInhibit on input side TTL input, output(s) disabled if open circuit Output good signal (Out OK)isolated open collector signalSafetyApprovalsEN 60950, UL 1950, CSA C22.2 No. 950Class of equipment class I Electric strength test voltageI/case, O/case, Out OK/case 1.5 kV ACO/O500 V DCEMCElectrostatic discharge IEC/EN 61000-4-2, level 4 (8/15 kV)criterion B Electr. fast transients/bursts IEC/EN 61000-4-4, output/input, level 3/4 (2/4 kV)criterion B Conducted disturbances IEC/EN 61000-4-6, level 2/3 (3/10 V)criterion A EnvironmentalOperating ambient temperature U i nom , P o nom , convection cooled –25...71°C Operating case temperature T C U i nom , P o nom /P o max –25...95°C Storage temperature non operational–40...100°CDamp heatIEC/EN 60068-2-3, 93%, 40°C56 days Vibration, sinusoidal IEC/EN 60068-2-6, 10...60/60...2000 Hz 0.35 mm/5 g nn BumpIEC/EN 60068-2-29, 11 ms25 g n Random vibrationIEC/EN 60068-2-64, 20...500 Hz 4.9 g n rmsOptionsExtended temperature range –40...71°C, ambient, operating -9Out OK output excludes option i D Inhibit on output side excludes option Di Heat SinkB1P Series120...195 Watt DC-DC Converters4Edition 6/10.2001Mechanical dataTolerances ±0.3 mm (0.012") unless otherwise indicated.Cassette StyleP Series5Edition 6/10.2001Pin allocationP Series120...195 Watt DC-DC ConvertersAccessoriesAdditional external heat sinks for operation above P o nom or T A maxFront panels for 19" rack mounting in 3U or 6U configuration (Schroff/Intermas)Mating H15 connectors with screw, solder, fast-on or press-fit terminals Mechanical mounting supports for chassis, DIN-rail and PCB mounting。
SIM-MAX N3020使用说明书(20110216 定稿)
6
图 1.1 中子测量原理示意图
3
SIM-MAX，For A Safer Tomorrow
1.3 仪器构成
4
8
1 7 2 3 6 5
1—彩色液晶屏 2—贴膜面板按键 3—主机开关 5—主箱体 6—通讯接口盖 7—能响平衡体
Hale Waihona Puke 4—报警指示灯 8—手柄当用户需要进行数据导出或电池充电时，可以轻轻旋开通讯接口盖，旋开 后，用户会看到如下示图，然后可以根据传输方式来选用对应的接插设备。
III
SIM-MAX，For A Safer Tomorrow
1 概述
1.1 前言
SIM-MAX N3020 中子周围剂量当量（率）仪是上海新漫传感技术研究发 展有限公司（以下简称“新漫公司” ）自主研制的一款专门用于监测中子周围剂 量当量(率)的便携式仪器，现已申请国家专利两项。本仪器的探头部分由
1.2 测量原理
SIM-MAX N3020 采用 LiI(Eu) 闪烁体为探测中子的核心部件。中子入射 到探测器上，首先与慢化体材料中的氢原子发生弹性散射，中子通过把能量传 递给氢原子核而损失能量，当中子到达探测器的灵敏体积时，它的能量已经降 低到 0.025eV，即此时的中子已经被慢化成热中子，热中子与 LiI(Eu) 闪烁体 中的 Li 原子核的核反应截面最大，它们会发生如下核反应：
使 用 须 知
尊敬的用户： 您好！感谢您选用本公司生产的 SIM-MAX N3020 中子周围剂量当量（率） 仪。通过仔细阅读并理解本使用说明书，您可以全面地了解本产品的功能、 操作及保养方法。 为保证本产品的设计性能和使用寿命，任何使用、维护本产品的人员都 必须完全遵守本使用说明书。
注意事项
LT3020中文资料
12ELECTRICAL CHARACTERISTICSThe ● denotes specifications which apply over the full operating temperature range, otherwise specifications are T J = 25°C. PARAMETER CONDITIONS MIN TYP MAX UNITS Minimum Input Voltage I LOAD = 500mA, T J > 0°C0.9 1.05V (Notes 5,14)I LOAD = 500mA, T J < 0°C0.9 1.10V ADJ Pin Voltage (Notes 4, 5)V IN = 1.5V, I LOAD = 1mA196200204mV1.15V < V IN < 10V, 1mA < I LOAD < 500mA●193200206mV Regulated Output Voltage LT3021-1.2V IN = 1.5V, I LOAD = 1mA 1.176 1.200 1.224V (Note 4) 1.5V < V IN < 10V, 1mA < I LOAD < 500mA● 1.157 1.200 1.236V LT3021-1.5V IN = 1.8V, I LOAD = 1mA 1.470 1.500 1.530V1.8V < V IN < 10V, 1mA < I LOAD < 500mA● 1.447 1.500 1.545VLT3021-1.8V IN = 2.1V, I LOAD = 1mA 1.764 1.800 1.836V2.1V < V IN < 10V, 1mA < I LOAD < 500mA● 1.737 1.800 1.854V Line Regulation (Note 6)LT3021∆V IN = 1.15V to 10V, I LOAD = 1mA●–1.750+1.75mV LT3021-1.2∆V IN = 1.5V to 10V, I LOAD = 1mA●–10.5010.5mVLT3021-1.5∆V IN = 1.8V to 10V, I LOAD = 1mA●–13013mVLT3021-1.8∆V IN = 2.1V to 10V, I LOAD = 1mA●–15.8015.8mV Load Regulation (Note 6)LT3021V IN = 1.15V, ∆I LOAD = 1mA to 500mA–20.42mV LT3021-1.2V IN = 1.5V, ∆I LOAD = 1mA to 500mA–616mVLT3021-1.5V IN = 1.8V, ∆I LOAD = 1mA to 500mA–7.5 1.57.5mVLT3021-1.8V IN = 2.1V, ∆I LOAD = 1mA to 500mA–929mV Dropout Voltage (Notes 7, 12)I LOAD = 10mA4575mVI LOAD = 10mA●110mVI LOAD = 500mA155190mVI LOAD = 500mA●285mV GND Pin Current I LOAD = 0mA●110250µA V IN = V OUT(NOMINAL) + 0.4V I LOAD = 10mA920µA (Notes 8, 12)I LOAD = 100mA 2.25mAI LOAD = 500mA● 6.2010mA Output Voltage Noise C OUT = 4.7µF, I LOAD = 500mA, BW = 10Hz to 100kHz, V OUT = 1.2V300µV RMS ADJ Pin Bias Current V ADJ = 0.2V, V IN = 1.2V (Notes 6, 9)2050nA Shutdown Threshold V OUT = Off to On●0.610.9V V OUT = On to Off●0.250.61V SHDN Pin Current (Note 10)V SHDN = 0V, V IN = 10V●±1µA V SHDN = 10V, V IN = 10V●3 9.5µA Quiescent Current in Shutdown V IN = 6V, V SHDN= 0V39µA Ripple Rejection (Note 6)LT3021V IN – V OUT = 1V, V RIP = 0.5V P-P, f RIPPLE = 120Hz,70dBI LOAD = 500mALT3021-1.2V IN – V OUT = 1V, V RIPPLE = 0.5V P-P, f RIPPLE = 120Hz,60dBI LOAD = 500mALT3021-1.5V IN – V OUT = 1V, V RIPPLE = 0.5V P-P, f RIPPLE = 120Hz,58dBI LOAD = 500mALT3021-1.8V IN – V OUT = 1V, V RIPPLE = 0.5V P-P, f RIPPLE = 120Hz,56dBI LOAD = 500mA3 3021fa45678910113021faThe LT3021 regulator has internal thermal limiting (with hysteresis) designed to protect the device during overload conditions. For normal continuous conditions, do not exceed the maximum junction temperature rating of 125°C.Carefully consider all sources of thermal resistance from junction to ambient including other heat sources mounted in proximity to the LT3021.The underside of the LT3021 DH package has exposed metal (14mm 2) from the lead frame to where the die is attached.This allows heat to directly transfer from the die junction to the printed circuit board metal to control maximum operating junction temperature. The dual-in-line pin ar-rangement allows metal to extend beyond the ends of the package on the topside (component side) of a PCB. Con-nect this metal to GND on the PC B. The multiple IN and OUT pins of the LT3021 also assist in spreading heat to the PCB.The LT3021 S8 package has pin 4 fused with the lead frame. This also allows heat to transfer from the die to the printed circuit board metal, therefore reducing the thermal resistance. Copper board stiffeners and plated through-holes can also be used to spread the heat generated by power devices.The following tables list thermal resistance for several different board sizes and copper areas for two different packages. Measurements were taken in still air on 3/32"FR-4 board with one ounce copper.Table 1. Measured Thermal Resistance For DH PackageCOPPER AREA THERMAL RESISTANCETOPSIDE*BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)2500mm22500mm22500mm 230°C/W 900mm 22500mm 22500mm 235°C/W 225mm 22500mm 22500mm 250°C/W 100mm 22500mm 22500mm 255°C/W 50mm 22500mm 22500mm 265°C/WTable 2. Measured Thermal Resistance For S8 PackageCOPPER AREATHERMAL RESISTANCE TOPSIDE*BACKSIDE BOARD AREA (JUNCTION-TO-AMBIENT)2500mm 22500mm 22500mm 270°C/W 1000mm 22500mm 22500mm 270°C/W 225mm 22500mm 22500mm 278°C/W 100mm 22500mm 22500mm 284°C/W 50mm22500mm22500mm296°C/W*Device is mounted on topside.Calculating Junction TemperatureExample: Given an output voltage of 1.2V, an input voltage range of 1.8V ±10%, an output current range of 1mA to 500mA, and a maximum ambient temperature of 70°C,what will the maximum junction temperature be for an application using the DH package?The power dissipated by the device is equal to:I OUT(MAX)(V IN(MAX) – V OUT ) + I GND (V IN(MAX))whereI OUT(MAX) = 500mA V IN(MAX) = 1.98VI GND at (I OUT = 500mA, V IN = 1.98V) = 10mA soP = 500mA(1.98V – 1.2V) + 10mA(1.98V) = 0.41W The thermal resistance is in the range of 35°C /W to 70°C/W depending on the copper area. So the junction temperature rise above ambient is approximately equal to:0.41W(52.5°C/W) = 21.5°CThe maximum junction temperature equals the maximum junction temperature rise above ambient plus the maxi-mum ambient temperature or:T JMAX = 21.5°C + 70°C = 91.5°C Protection FeaturesThe LT3021 incorporates several protection features that make it ideal for use in battery-powered circuits. In addi-tion to the normal protection features associated with monolithic regulators, such as current limiting and ther-mal limiting, the device also protects against reverse-input voltages, reverse-output voltages and reverse output-to-input voltages.Current limit protection and thermal overload protection protect the device against current overload conditions at the output of the device. For normal operation, do not exceed a junction temperature of 125°C.The IN pins of the device withstand reverse voltages of 10V. The LT3021 limits current flow to less than 1µA and no negative voltage appears at OUT. The device protects both itself and the load against batteries that are plugged in backwards.APPLICATIO S I FOR ATIOW UUU123021faThe LT3021 incurs no damage if OUT is pulled below ground. If IN is left open circuit or grounded, OUT can be pulled below ground by 10V. No current flows from the pass transistor connected to OUT. However, current flows in (but is limited by) the resistor divider that sets the output voltage. C urrent flows from the bottom resistor in the divider and from the ADJ pin’s internal clamp through the top resistor in the divider to the external circuitry pulling OUT below ground. If IN is powered by a voltage source,OUT sources current equal to its current limit capability and the LT3021 protects itself by thermal limiting. In this case, grounding SHDN turns off the LT3021 and stops OUT from sourcing current.The LT3021 incurs no damage if the ADJ pin is pulled above or below ground by 10V. If IN is left open circuit or grounded and ADJ is pulled above ground, ADJ acts like a 25k resistor in series with a 1V clamp (one Schottky diode in series with one diode). ADJ acts like a 25k resistor in series with a Schottky diode if pulled below ground. If IN is powered by a voltage source and ADJ is pulled below its reference voltage, the LT3021 attempts to source its current limit capability at OUT. The output voltage in-creases to V IN – V DROPOUT with V DROPOUT set by whatever load current the LT3021 supports. This condition can potentially damage external circuitry powered by the LT3021 if the output voltage increases to an unregulated high voltage. If IN is powered by a voltage source and ADJ is pulled above its reference voltage, two situations can occur. If ADJ is pulled slightly above its reference voltage,the LT3021 turns off the pass transistor, no output current is sourced and the output voltage decreases to either the voltage at ADJ or less. If ADJ is pulled above its no load recovery threshold, the no load recovery circuitry turns on and attempts to sink current. OUT is actively pulled low and the output voltage clamps at a Schottky diode above ground. Please note that the behavior described above applies to the LT3021 only. If a resistor divider is con-nected under the same conditions, there will be additional V/R current.In circuits where a backup battery is required, several different input/output conditions can occur. The output voltage may be held up while the input is either pulled to ground, pulled to some intermediate voltage or is left openAPPLICATIO S I FOR ATIOW UUU circuit. In the case where the input is grounded, there is less than 1µA of reverse output current.If the LT3021 IN pin is forced below the OUT pin or the OUT pin is pulled above the IN pin, input current drops to less than 10µA typically. This occurs if the LT3021 input is connected to a discharged (low voltage) battery and either a backup battery or a second regulator circuit holds up the output. The state of the SHDN pin has no effect on the reverse output current if OUT is pulled above IN.Input Capacitance and StabilityThe LT3021 is designed to be stable with a minimum capacitance of 3.3µF placed at the IN pin. Ceramic capaci-tors with very low ESR may be used. However, in cases where a long wire is used to connect a power supply to the input of the LT3021 (and also from the ground of the LT3021 back to the power supply ground), use of low value input capacitors combined with an output load current of 20mA or greater may result in an unstable application. This is due to the inductance of the wire forming an LC tank circuit with the input capacitor and not a result of the LT3021 being unstable.The self-inductance, or isolated inductance, of a wire is directly proportional to its length. However, the diameter of a wire does not have a major influence on its self-inductance. For example, the self inductance of a 2-AWG isolated wire with a diameter of 0.26 in. is about half the inductance of a 30-AWG wire with a diameter of 0.01 in.One foot of 30-AWG wire has 465nH of self inductance.The overall self-inductance of a wire can be reduced in two ways. One is to divide the current flowing towards the LT3021 between two parallel conductors and flows in the same direction in each. In this case, the farther the wires are placed apart from each other, the more inductance will be reduced, up to a 50% reduction when placed a few inches apart. Splitting the wires basically connects two equal inductors in parallel. However, when placed in close proximity from each other, mutual inductance is added to the overall self inductance of the wires. The most effective way to reduce overall inductance is to place the forward and return-current conductors (the wire for the input and the wire for ground) in very close proximity. Two 30-AWG wires separated by 0.02 in. reduce the overall self-induc-tance to about one-fifth of a single isolated wire.133021faAPPLICATIO S I FOR ATIOW UUU If the LT3021 is powered by a battery mounted in close proximity on the same circuit board, a 3.3µF input capaci-tor is sufficient for stability. However, if the LT3021 is powered by a distant supply, use a larger value input capacitor following the guideline of roughly 1µF (in addi-tion to the 3.3µF minimum) per 8 inches of wire length. As power supply output impedance may vary, the minimum input capacitance needed to stabilize the application mayalso vary. Extra capacitance may also be placed directly on the output of the power supply; however, this will require an order of magnitude more capacitance as opposed to placing extra capacitance in close proximity to the LT3021.Furthermore, series resistance may be placed between the supply and the input of the LT3021 to stabilize the appli-cation; as little as 0.1Ω to 0.5Ω will suffice.14Information furnished by Linear Technology C orporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.15163021faPART NUMBER DESCRIPTIONCOMMENTSLT1121/LT1121HV 150mA, Micropower LDOs V IN : 4.2V to 30V/36V, V OUT : 3.75V to 30V, V DO = 0.42V, I Q = 30µA,I SD = 16µA, Reverse-Battery Protection, SOT-223, S8, Z Packages LT1129700mA, Micropower LDOV IN : 4.2V to 30V, V OUT : 3.75V to 30V, V DO = 0.4V, I Q = 50µA, I SD = 16µA,DD, SOT-223, S8, TO220-5, TSSOP20 PackagesLT1761100mA, Low Noise Micropower LDOV IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.3V, I Q = 20µA, I SD < 1µA,Low Noise: < 20µV RMSP-P , Stable with 1µF Ceramic Capacitor,ThinSOT PackageLT1762150mA, Low Noise Micropower LDO V IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.3V, I Q = 25µA, I SD < 1µA,Low Noise: <20µV RMSP-P , MS8 PackageLT1763500mA, Low Noise Micropower LDO V IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.3V, I Q = 30µA, I SD < 1µA,Low Noise: < 20µV RMSP-P , S8 PackageLT1764/LT1764A3A, Low Noise, Fast Transient Response LDOsV IN : 2.7V to 20V, V OUT : 1.21V to 20V, V DO = 0.34V, I Q = 1mA, I SD < 1µA,Low Noise: <40µV RMSP-P , “A” Version Stable with Ceramic Capacitors,DD, TO220-5 PackagesLTC1844150mA, Low Noise, Micropower VLDO V IN : 1.6V to 6.5V, V OUT(MIN) = 1.25V, V DO = 0.09V, I Q = 35µA,I SD < 1µA, Low Noise: < 30µV RMS , ThinSOT PackageLT1962300mA, Low Noise Micropower LDOV IN : 1.8V to 20V, V OUT : 1.22V to 20V, V DO = 0.27V, I Q = 30µA, I SD < 1µA,Low Noise: < 20µV RMSP-P , MS8 PackageLT1963/LT1963A1.5A, Low Noise, Fast Transient Response LDOsV IN : 2.1V to 20V, V OUT : 1.21V to 20V, V DO = 0.34V, I Q = 1mA, I SD < 1µA,Low Noise: < 40µV RMSP-P , “A” Version Stable with Ceramic Capacitors,DD, TO220-5, SOT223, S8 PackagesLT301050mA, High Voltage, Micropower LDOV IN : 3V to 80V, V OUT : 1.275V to 60V, V DO = 0.3V, I Q = 30µA, I SD < 1µA,Low Noise: <100µV RMSP-P , Stable with 1µF Output Capacitor, Exposed MS8 PackageLT3020100mA, Low Voltage LDOV IN : 0.9V to 10V, V OUT : 0.2V to 5V (min), V DO = 0.15V, I Q = 120µA,Noise: <250µV RMSP-P , Stable with 2.2µF Ceramic Capacitors,DFN-8, MS8 PackagesLTC3025300mA, Low Voltage Micropower LDO V IN : 0.9V to 5.5V, V OUT : 0.4V to 3.6V (min), V DO = 0.05V, I Q = 54µA,Stable with 1µF Ceramic Capacitors, DFN-6 PackageLTC30261.5A, Low Input Voltage VLDO RegulatorV IN : 1.14V to 3.5V (Boost Enabled), 1.14V to 5.5V (with External 5V),V DO = 0.1V, I Q = 950µA, Stable with 10µF Ceramic Capacitors, 10-Lead MSOP and DFN-10 PackagesLT3150Low V IN , Fast Transient Response, VLDO ControllerV IN : 1.1V to 10V, V OUT : 1.21V to 10V, V DO = Set by External MOSFET R DS(ON), 1.4MHz Boost Converter Generates Gate Drive, SSOP16 PackageLT/TP 0705 500 • PRINTED IN USA© LINEAR TECHNOLOGY CORPORA TION 2005Linear Technology Corporation1630 McCarthy Blvd., Milpitas, CA 95035-7417(408) 432-1900 ● FAX: (408) 434-0507 ● RELATED PARTS。
HCPL-3020中文资料
The HCPL-3020 in DIP-8 and HCPL-0302 in SO-8 package complement Agilent’s existing family of gate drive optocouplers. The new 0.2 A devices consist of GaAsP LEDs optically coupled toan integrated circuit witha power output stage. The current rating, combined with the high commonmode rejection (CMR),fast switching and latch-up performance uniquely qualify these optocouplers for low-power inverter gate drive applications. The high operating voltage ranges of the HCPL-3020 and HCPL-0302 output stages provide the drive voltages required by MOS-gated devices like IGBTs or MOSFETs. The voltage and current provided by these optocouplers make it suitable for driving IGBTs with rating up to 1200 V/20 A. For IGBTs with higher ratings, the HCPL-0314/3140 (0.4 A), HCPL-3150 (0.5 A) or HCPL-3120 (2 A) can be used. The HCPL-3020 and HCPL-0302 are among the cheapest solutions available for driving MOS-gated devices in a safe, effi cient, reliable and cost-effective way. Besides ease of implementation,the HCPL-3020 and HCPL-0302 also excel in power consumption. The low supply current of 3 mA allows bootstrap techniques, thuseliminating additionalisolated power supplies forgate drive circuitry. Usingdiscrete power IGBTs orMOSFETs together with gatedrive optoisolators insteadof integrated modulesallows the designer tocontrol the gate signal fl ow.This makes it possible tochange the switching speedand related EMI behavior.Compared with high-voltageintegrated circuits (HVICs)Agilent’s optocouplers offersuperior galvanic isolation.The optoisolators feature aproprietary internal Faradayshield, which provides thebest common-mode rejection(CMR) performance of anycompeting isolation solution.Features• 0.2 A min. peakoutput current• H igh-speed response:0.7 µs max. propagationdelay over temp. range• U ltra-high CMR: min.10 kV/µs @ VCM= 1000 V• B ootstrappable supplycurrent: max. 3 mA• W ide operating temp.range: -40…+100 °C• W ide VCCoperating range:10…30 V overtemp. range• D IP-8 and SO-8 packages• U L approval: 2500 VRMSfor 1 minute• C SA approval pending• V DE approval pending:• V IORM = 630 V PEAK(HCPL-3020)• V IORM = 566 V PEAK(HCPL-0302)Applications• I solated IGBT/powerMOSFET gate drive• A C and brushlessDC motor drives• I ndustrial inverters• A ir conditioners• W ashing machines• I nduction heatersfor cookers• S witching powersupplies (SPS)0.2 A Output Current Gate Drive Optocoupler from Agilent TechnologiesMichael Prangs, EBV Kaarst24MIP Edition 3/2003。
RCWP51001K30FKS3中文资料
Thick Film Chip Resistors, Industrial For technical questions contact: ff2bresistors@Document Number: 31011RCWPVishay DaleFEATURES•Operating temperature range: - 55°C to + 150°C•Same materials and construction as MIL-PRF-55342chip resistors•Termination: Tin/Lead wraparound termination overnickel barrier. Also available with Lead (Pb)-freewraparound terminations.•to customer requirements•Size, value, packaging and materials can be customized for special customer requirements.*Consult factory for extended resistance range.**Power rating depends on the max. temperature at the solder point, the component placement density and the substrate material.STANDARD ELECTRICAL SPECIFICATIONSGLOBAL MODEL HISTORICAL MODEL POWER RATING MAXIMUM OPERATINGTEMPERATURE COEFFICIENTTOLERANCE%RESISTANCE RANGE RCWP0402RCWP-04020.0425300100± 1 to ± 10± 1 to ± 10 5.62 - 1M 10 - 1M RCWP0603RCWP-06030.0750300100, 300± 2 to ± 10± 1 to ± 10 3 - 1M 5.62 - 1M RCWP0540RCWP-5400.0840300100, 300± 2 to ± 10± 1 to ± 10 3 - 4.7M 10 - 499K RCWP0550RCWP-5500.1050300100, 300± 2 to ± 10± 1 to ± 10 2 - 4.7M 5.62 - 1M RCWP0575RCWP-5750.1570300100, 300± 2 to ± 10± 1 to ± 10 2 - 10M 5.62 - 1M RCWP5100RCWP-51000.20100300100, 300± 2 to ± 10± 1 to ± 10 3 - 15M 5.62 - 1M RCWP1206RCWP-12060.25100300100, 300± 2 to ± 10± 1 to ± 10 3 - 15M 5.62 - 5.62M RCWP5150RCWP-51500.35125300100, 300± 2 to ± 10± 1 to ± 10 3 - 20M 5.62 - 4.75M RCWP1100RCWP-11000.50100300100, 300± 2 to ± 10± 1 to ± 10 3 - 7.5M 5.62 - 5.62M RCWP7225RCWP-72250.60200300100, 300± 2 to ± 10± 1 to ± 10 3 - 20M 5.62 - 15M RCWP2010RCWP-20100.80200300100, 300± 2 to ± 10± 1 to ± 10 3 - 20M 5.62- 15M RCWP2512RCWP-25121.0200300100, 300± 2 to ± 10± 1 to ± 105 - 20M 5.62 - 15MRCWPThick Film Chip Resistors, IndustrialVishay DaleDocument Number: 31011For technical questions contact: ff2bresistors@DIMENSIONSDIMENSIONS [in millimeters]GLOBAL MODEL A (Len g th)B (Width)C (Hei g ht)D(Top Term)E(Bottom Term)RCWP04020.039 ± 0.003[0.99 ± 0.08]0.020 ± 0.003[0.51 ± 0.08]0.013 ± 0.003[0.33 ± 0.08]0.010 ± 0.005[0.25 ± 0.13]0.010 ± 0.005[0.25 ± 0.13]RCWP05400.055 ± 0.005[1.40 ± 0.13]0.040 ± 0.005[1.02 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.010 ± 0.005[0.25 ± 0.13]0.010 ± 0.005[0.25 ± 0.13]RCWP05500.055 ± 0.005[1.40 ± 0.13]0.050 ± 0.005[1.27 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.010 ± 0.005[0.25 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP05750.080 ± 0.005[2.03 ± 0.13]0.050 ± 0.005[1.27 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP06030.063 ± 0.005[1.60 ± 0.13]0.032 ± 0.005[0.81 ± 0.13]0.018 ± 0.005[0.46 ± 0.13]0.012 ± 0.005[0.31 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP11000.105 ± 0.005[2.67 ± 0.13]0.100 ± 0.005[2.54 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP12060.125 ± 0.005[3.18 ± 0.13]0.063 ± 0.005[1.60 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP20100.197 ± 0.006[5.00 ± 0.15]0.098 ± 0.005[2.49 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]RCWP25120.250 ± 0.006[6.35 ± 0.15]0.124 ± 0.005[3.15 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]RCWP51000.105 ± 0.005[02.67 ± 0.13]0.050 ± 0.005[1.27 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP51500.155 ± 0.005[3.94 ± 0.13]0.050 ± 0.005[1.27 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]0.015 ± 0.005[0.38 ± 0.13]RCWP72250.230 ± 0.005[5.84 ± 0.13]0.075 ± 0.005[1.91 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]0.020 ± 0.005[0.51 ± 0.13]Legal Disclaimer NoticeVishayNoticeSpecifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc., or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.Information contained herein is intended to provide a product description only. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Vishay for any damages resulting from such improper use or sale.。
3020控标技术参数++0526+2014
一、关于Optiplex 3020 的控标点1、Optiplex 3020、ThinkCentreM4500、启天M4500和HP Prodesk 400 G1（最高可配I7处理器）均采用第四代酷睿处理器和H81芯片组，而HP Pro 4300、HP Pro 3380MT / 3381MT，Acer Veriton T430（MT=28L）/ D430（MT=23L）均采用第三代酷睿处理器和H61芯片组，是上一代产品。
可以用H81芯片组屏蔽掉所有上一代的产品。
2、Optiplex 3020、ThinkCentre M4500和HP Prodesk 400 G1均有2个内存插槽，最大支持16 GB内存；启天M4500、HP Pro 4300、HP Pro 3380MT/ 3381MT，Acer Veriton T430有2个内存插槽，最大只支持8 GB内存。
可以用最大支持16GB内存屏蔽掉启天M4500、HP Pro 4300、HP Pro 3380MT/ 3381MT、Acer Veriton T430。
3、Optiplex 3020 MT支持双硬盘（2内，2外）或双光驱选项；ThinkCenterM450t支持双硬盘（2内，2外）或双光驱选项；ThinkCenter M4500S/Q、昭阳M4500不支持双硬盘或者双光驱选项；HP Prodesk 400 G1和HP Pro 3380MT均支持双硬盘选项（2内，2外）；HP Pro 3381MT 不支持双硬盘选项（2内，1外）；HP Pro 4300SFF不支持双硬盘选项（1内1外）；Acer Veriton T430系列支持双硬盘或者双光驱选项。
可以用支持双硬盘或双光驱选项来屏蔽掉ThinkCenter M4500S/Q、HP Pro 4300SFF、3381MT系列和Veriton D430系列。
4、Optiplex 3020可选配500GB混合硬盘，ThinkCentreM4500支持混合硬盘；HP Prodesk 400 G1可选配最大1TB混合硬盘，上述其它竞品均不支持混合硬盘。
武汉国电华美电气设备有限公司 HM3020X 气体定性检漏仪 说明书
HM3020X气体定性检漏仪说明书武汉国电华美电气有限公司84663808邮箱：官网：地址：武汉市汉南区华顶工业园A25-1统一热线：4000-935-230目录概述 (2)特点 (2)部件和控制 (3)准备工作 (3)操作 (4)检漏操作 (6)注意事项 (6)适用范围 (7)维护保养 (7)技术参数 (8)HM3020X SF6气体检漏仪（定性）一﹑概述HM3020X型检气体检漏仪是积30多年检漏仪生产验之精华,最近强档推出的新一代全自动智慧型检漏仪，是一款最稳定、最灵敏的检漏仪。
我们充分考虑了广大用户的实际需求,以我们丰富的技术及经验应用于这款产品，使用户得以享受到极佳的性能价格比。
高科技的中央微处理单元是本产品的核心，它的数字信号处理能力可以更好地管理电路和处理检测信号。
由于大量采用集成电路使电路中元件的数量减少了40%,大大提高了可靠性和效率。
微处理器以每秒4000次的速度监测探头和电池电压,极微小的信号也可捕捉到，在任何环境下均可稳定、可靠地工作。
HM3020X型检气体检漏仪增加了一些方便使用的功能：七级灵敏度使灵敏度增大64倍，三色发光二级管以渐进的方式宽范围地指示泄漏程度。
同时也用于显示灵敏度级别和电池电量；触摸键盘可进行所有的操作；前卫的瘦长型造型设计极大地方便用户使用和维护；指示灯在使用中处于直视范围非常方便。
使用前备必仔细阅读本手册！在阅读了本手册后，若有任何问题或建议请随时与我们联系！二﹑特点全部采用具有高级数字信号处理能力的微处理器控制●三色视频显示●七档灵敏度设置﹑最大增强64倍●轻触式键盘●灵敏度随时可调●自动电池测试功能●电池电压指示●退过SAEJ1627认证，可检测R134a,R12,R22.●能检测所有卤素制冷剂●真机械泵采样,为探头提供正向气流.●具有渐变功能●无线、便携，只需2节二号电池●高强度仪器盒,可靠保护仪器●35厘米柔性不锈钢探杆●三年质保三﹑部件和控制1．探头2．探头防护罩3．电源开关4．电池测试键5．复位键6．音频渐变键7．增加灵敏度键8．降低灵敏度键9．发光二极管指示10．柔性探杆四﹑准备工作安装电池：如图﹑向上滑动拆下位于产品底部的电池仓盖，装入电池，正极向外（朝电池仓盖方向）。
CPM制粒机3020—6说明书
C P M制粒机3000系列说明书目录3000系列制粒机指导手册介绍设备规格及技术参数–第2页第一部分安全指导--------------------------------- 3第二部分安装指导--------------------------------- 7第三部分操作--------------------------------- 15第四部分润滑--------------------------------- 19第五部分环模及压辊维护--------------------------------- 24第六部分总的操作和维护指导---------------------------------31第七部分零件清单和附录-------------------------------- 34介绍这本指导说明书由CPM公司提供了设备的安装，维护和操作等信息。
所用图表是典型的，而且显示了主要的设计特征。
一些单元的特殊图表应咨询，以便获得更精确的细节。
任何CPM公司的合约职责都以销售协议的形式规定了。
该手册中的内容在安装、操作及维修之前，应被所有工程人员、管理人员和操作维修人员认真研究。
尽管已努力提供全面说明，但不可能涉及到操作及维修过程中所碰到的以外情况。
若想了解更详细的信息或有问题，请与CPM 公司客户服务部联系，电话CPM/无锡公司: 7/85282240/852822849, 传真: 9.当查询所要求的备件时，请确认所在机器的特殊系列号。
如果客户要求提供安装、机械检测或维修服务，CPM公司可提供区域服务。
想了解详细情况，请拨以上号码，与CPM公司客户服务部联系。
该手册既是一本详细的手册又是一本便利的参考指南。
它应放在一个所有维修和操作人员唾手可得的地方。
第一部分安全指导第一部分安全指导1.1. 介绍操作制粒机之前，人员必须被培训正确使用机器。
仔细阅读说明书中“安全指导”这一部分。
3KP200资料
.340 ( 8.6 )
MECHANICAL DATA
Case: JEDEC P600 molded plastic Terminals: Axial leads, solderable per MIL-STD-750, Method 2026 Polarity: Color band denoted cathode except Bipolar Mounting Position: Any Weight: 0.07 ounce, 2.1 gram
56. 2 46. 6 51. 6 42. 0 46. 4
DATE : DEC.05.2002
PAGE . 2
元器件交易网
P art N umber
V R WM Min. V V
V BR @ I T M a x. V IT mA
I R @ VRWM UNI uA BI uA V
元器件交易网
DATA SHEET
3KP5.0~3KP220CA
GLASS PASSIVATED JUNCTION TRANSIENT VOLTAGE SUPPRESSOR 3000 Watt Peak Power VOLTAGE - 5.0 to 220 Volts
P-600
1.0 ( 25.4 ) MIN.
.360 ( 9.1 ) .340 ( 8.6 )
RATING Peak Power Dissipation at TA=25°C, TP=1ms(Note 1) Steady State Power Dissipation at TL=75°CLead Lengths .375",(9.5mm) (Note 2) Peak Forward Surge Current, 8.3ms Single Half Sine-Wave Superimposed on Rated Load(JECED Method) (Note 3) Operating and Storage Temperature Range