2SD1710中文资料(Wing Shing)中文数据手册「EasyDatasheet - 矽搜」

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S3C2410中文手册第1章_产品综述

通过提供一系列完整的系统外围设备，S3C2410A大大减少了整个系统的成本，消除了为系统配置额外器件的需要。本文档将介绍S3C2410A中集成的以下片上功能： z 1.8V/2.0V内核供电，3.3V存储器供电，3.3V外部I/O供电； z 具备16KB的I-Cache和16KB的D-Cache/MMU； z 外部存储控制器（SDRAM 控制和片选逻辑） z LCD 控制器（最大支持 4K 色 STN 和 256K 色 TFT）提供 1 通道 LCD 专用 DMA。 z 4 通道 DMA 并有外部请求引脚。 z 3 通道 UART(IrDA1.0,16 字节 Tx FIFO，和 16 字节 Rx FIFO)/2 通道 SPI z 1 通道多主 IIC-BUS/1 通道 IIS-BUS 控制器。 z 兼容 SD 主接口协议 1.0 版和 MMC 卡协议 2.11 兼容版。 z 2 端口 USB 主机/1 端口 USB 设备（1.1 版） z 4 通道 PWM 定时器和 1 通道内部定时器 z 看门狗定时器 z 117 个通用 I/O 口和 24 通道外部中断源。 z 功耗控制模式：具有普通，慢速，空闲和掉电模式。 z 8 通道 10 比特 ADC 和触摸屏接口 z 具有日历功能的 RTC z 具有 PLL 片上时钟发生器
UART................................................................................................................................................ 4 DMA控制器 .....................................................................................................................................5 A/D转换和触摸屏接口 ...................................................................................................................5 LCD控制器STN LCD显示特性 ......................................................................................................5 TFT彩色显示屏 ............................................................................................................................... 5 看门狗定时器.................................................................................................................................. 5 IIC总线接口 ....................................................................................................................................6 IIS总线接口 .....................................................................................................................................6 USB主设备 ......................................................................................................................................6 SD主机接口 ..................................................................................................................................... 6 SPI接口 ............................................................................................................................................ 6 工作电压.......................................................................................................................................... 7 操作频率.......................................................................................................................................... 7 封装.................................................................................................................................................. 7 1.2 内部结构图....................................................................................................................................8 表 1－1 272－FBGA 引脚分配及顺序..........................................................................................9 表 1－2 272－FBGA封装的引脚分配..........................................................................................12 信号描述........................................................................................................................................ 21 表 1－3 S3C2410A信号描述.........................................................................................................21 表 1－4 S3C2410A 专用寄存器...................................................................................................25

德国centrotherm CMI 中文版操作

功能区...........................................................................................................................................27 工作 ..............................................................................................................................................27
“工艺炉管”区域 ........................................................................................................................27 “工作列表”区域 ........................................................................................................................29 命令栏 .....................................................................................................................................29 系统 ..............................................................................................................................................30 CESAR 选项卡组 ....................................................................................................................30 “舟”选项卡组............................................................................................................................34 “处理”选项卡组 ........................................................................................................................35 “CMS”选项卡组 .......................................................................................................................37 “设备状态”选项卡组 .................................................................................................................38 “终端服务”选项卡组（可选） ..................................................................................................38 数据日志 .......................................................................................................................................39 设置 ..............................................................................................................................................39 “舟”选项卡组............................................................................................................................39 “工艺程序”选项卡组 .................................................................................................................41 “总览”选项卡组 ........................................................................................................................43 “升降机”选项卡组.....................................................................................................................45 “WTS”选项卡组 .......................................................................................................................48 “预防性维护”选项卡组 .............................................................................................................50 “CMS”选项卡组 .......................................................................................................................51 “限制”选项卡组（可选）..........................................................................................................52 终端（可选）................................................................................................................................53 警报 ..............................................................................................................................................54 帮助 ..............................................................................................................................................55

EHT-105-01-S-D-RA中文资料(samtec)中文数据手册「EasyDatasheet - 矽搜」

"A"段 - "A" 尺度2.5:1
AW
注意：
UNLESS OTHERWISE SPECIFIED, DIMENSIONS ARE IN INCHES. TOLERANCES ARE: .XX: .01 [0.3] .XXX: .005 [0.13] .XXXX: .0020 [0.051] 2
1. C 始终代表一个关键方面. 2.最小PUSHOUT力：1磅 3.最大PIN旋转体：2° 4.DUE TO THE HIGH AMOUNT OF INSERTION FORCE NEEDED,
.237 6.03 REF "R"
（见注）
"S"
（见注）
AW
-SM IN-PROCESS 1
AW
-SM IN-PROCESS 2
PPP-24
.338 8.59
90°
取放焊盘（不同,如,以其他方式同图1）
（LATCH EHA-01为清楚起见移走）图5 （EHT-105-01-XX-D-SM-P所示）
偏光选项
-XX = PIN省略
尾选项 -RA：直角（图2,SHT 2） -SM：表面安装（见图4,SHT 2）（留空为通孔）
ROW规格 -D: DOUBLE
C
没有位置X 0.0787 [2.000] + 0.543 [13.79]参考文献
没有位置X 0.0787 [2.000] + .177 [4.50]参考文献（没有POS x0.0787 [2.000]） - 0.0787 [2.000]±0.005 [0.13] 极化
芯片中文手册,看全文,戳
修订AW
不要规模由本打印无位置

日本新光电子秤中文说明书

3. 安装
为确保天平发挥最佳效能, 天平要放在合适的工作环境中. 否则可能导致错误结果:
1. 勿放在松软地方, 造成天平不平衡.
2. 勿放在温度或湿度突变剧烈的地方.
3. 勿放在高温、高湿或多尘的地方.
4. 勿放在不牢固的台面, 或接近有振动的地方.
5. 勿放在风扇或冷气机的气流下的地方
6. 勿放在太阳直射的地方
设定代码详见52表格按zerotare键最右方数值会改变按数次直到显示屏显示用户需要的设定设定代码详见52表格52功能設定表格显示屏显示功能功能指令右方数值解说关闭比较测定功能比较测定功能任何时间判别包括在不稳定时判别环境高于5范围判别判别范围一个限定值判别ok或lo只在比较测定功能激活时看到判别点两个限定值判别hiok或lo关闭零位跟踪零位跟踪开动零位跟踪开动零位跟踪防止零位偏差关闭自动关机自动关机开动自动关机只限用充电池模式六数字输出接口输出七数字输出0114ct克拉15oz盎司16lb英磅17ozt全衡盎司18dwt英钱19grain1atlhongkong香港两1btlsingaporemalaysia新加坡两1ctltaiwan台湾两1dmommommes1etola20pcs件数1f百分比单位设定设定后可用功能键快速切换单位00unitset停用关闭glp打印glp打印开动glp打印只限gsw系列出厂已设定才显示显示屏显示功能功能指令右方数值解说按下打印键输出一个数据仅在稳定时输出一个数据不包括零位仅在稳定时输出一个数据包括零位当稳定时的一个输出并在不稳定时连续输出数据输出控制按下打印键输出一个数据只在稳定时4800bps波特率仅在七数字输出下使用出厂已设定切换单位天平可预先设定最多五个重量单位
7.1 一次采样 1.
按“Function”键, 使显示屏显示“Pcs”. 进入（计数）测量模式.

MOBOTIX产品手册

Q22
虚拟PTZ——不需马达 Q22能放大图像，深入至每个像点。全景摄像机的图像可以无级放大，用摇杆或鼠标，您可以漫游到图像中的任何局部。这样，您既享受了机械云台摄像机的灵活性，又避免使用磨损部件，免却
隐蔽的嵌入式吸顶安装
完美的全景监控利用MOBOTIX富有创意的全景环视技术，可以对整个空间实行完美的全景监控。只要花698欧元购买一台——外形精致美观又隐蔽的——Q22摄像机，就可替代多台传统的摄像机，既节省了设备成本，又降低了安装费用。通过这个全球创新产品，MOBOTIX 再次证明了其作为百万像素视频安防系统的全球市场领导者的创新力。
Q22 PQa2n2or环am景a:宽ei视ne野Ka:m一er台a -摄d像rei机An-si三cht个en视gl频eic窗hzeitig
1
高分辨率 180°-环景图像
2
3
虚拟 PTZ 1
虚拟 PTZ 2
高效的图像传输一般的摄像机系统总是要把3百万像素的整图通过网络传输用于分析，MOBOTIX 系统则不一样，它只传输需要的图像局部。一张Q22环景图像只有原始整图1/6 的数据量，或只需 1/6 的带宽。也就是说，用同样的网络传输图像，摄像机数量可增加到6倍。
... 开辟了视频新天地
The HiRes Video Company
MOBOTIX 分布式方案与中央集中控制的传统解决方案不同，按MOBOTIX分布型系统架构的概念，每台摄像机都集成有一台高效的计算机，必要时还集成有数字存储设备(SD卡)，用于存储长时摄录内容。而控制台的电脑只用于观看图像，而不需分析和记录存储图像。因此，即便未连接或未打开电脑，MOBOTIX摄像机也能由事件控制自动摄录并长时存储带音频的视频。

研华数据采集卡PCI-1710快速入门手册

PCI-1710快速安装使用手册PCI-1710快速安装使用手册 (1)第一章产品介绍 (2)1.1 概述 (2)1.1.1 即插即用功能 (2)1.1.2 单端或差分混合的模拟量输入 (2)1.1.3 卡上FIFO(先入先出)存储器 (2)1.1.4 卡上可编程计数器 (2)1.1.5 用于降低噪声的特殊屏蔽电缆 (2)1.1.6 16路数字输入和16路数字输出 (3)1.1.7 短路保护 (3)1.2 特点： (3)1.3 一般特性： (3)第二章安装与测试 (3)2.1 初始检查 (3)2.2 Windows2K/XP/9X下板卡的安装 (4)2.2.1 软件的安装： (6)2.2.2 硬件的安装： (7)2.3 测试 (8)2.3.1 模拟输入功能测试 (8)2.3.2 模拟输出功能测试 (9)2.3.3 数字量输入功能测试 (10)2.3.4 数字量输出功能测试 (11)2.4.5 计数器功能测试 (12)第三章信号连接 (13)3.1 模拟信号输入连接： (15)3.1.1 单端模拟输入连接 (15)3.1.2 差分式模拟输入连接 (15)3.2模拟信号输出连接 (17)3.3触发源连接 (17)3.3.1 内部定时器触发连接 (17)3.3.2 外部触发源连接 (18)第四章例程使用详解 (18)4.1 板卡支持例程列表4.2 常用例子使用说明 (18)4.2.1 ADSOFT/ADTRIG（软件触发方式例程） (18)4.2.2 ADint（中断方式进行数据采集的例程） (19)4.2.3 DIGOUT（数字量输出）： (21)4.2.4 COUNTER（计数程序） (23)4.2.5 Digin (数字量输入例程) (24)4.2.6 PULSE(脉冲输出例程) (24)4.2.7 MADint(多通道中断采集例程) (25)第五章遇到问题，如何解决？.................. 错误!未定义书签。

富士通 ETERNUS SF V16.7 存储管理软件数据手册说明书

Data SheetFUJITSU ETERNUS SF V16.7Storage Management SoftwareCentral console and advanced management functions forETERNUS DX and ETERNUS AF storage environments.ETERNUS SF Storage Management Software The comprehensive and flexible datamanagement for ETERNUS DX storage systems offers convenient, consistent and powerful tools with enterprise class functionalities even for the entry class. Innovative and advanced functions increase operational efficiency and help to implement appropriate service levels. Complementing the integrated ETERNUS DX hardware storage management the ETERNUS SF storage management software is used to support overall daily operations within the entire storage infrastructure. ETERNUS DX’ embedded management, together with ETERNUS SF, serve as the overarching basis for Fujitsu’s highly efficient Flexible Data Management. It offers the same usability for all operational workflows throughout the ETERNUS DX series, from entry-level systems up to the high-end models. Therefore, acquired management skills can be leveraged over sites and over time. A high degree of automation and an easy to learn, easy to handle graphical user interface reduces significantly administrator’s training efforts with regards to cost and time. The customizable dashboard screen further eases all management tasks for the daily work. Storage resource optimization including implementation of policies for enhancing storage integration and operation, error discovery, health monitoring, capacity management, provisioning, local and remote replication and disaster recovery arepresented with a consistent user friendly look and feel.In addition to the cost savings given by the ergonomic and unified storage managementETERNUS SF also enables to eliminate unnecessarymaintenance cost as even complex storage management operations can be executed without high-level skills or expensive vendor’s intervention.A flexible and transparent license model guarantees that customers pay only needed functionalities and such can grow with rising requirements at foreseeable cost.ETERNUS SF Express is the management console for ETERNUS DX entry systems.ETERNUS DX60, DX100 and DX200 disk storage systems are shipped with a free-of-charge ETERNUS SF Express license. The Expresssoftware offers basic management features, as well as simple, wizard based configuration and can monitor multiple ETERNUS DX systems with one centralized console. For advanced features ETERNUS SF Express can be easily upgraded to ETERNUS SF Storage Cruiser.Features & BenefitsLicenses and functions overviewETERNUS SF Web GUIThe standard browser based graphical user interface provides an intuitive single console for the entire ETERNUS DX family and enables administrators to implement storage environments with ease and without high-level skills. A customizable dashboard facilitates real-time and comprehensive information regarding the current system state. ETERNUS SF Express LicenseFree-of-charge license for the ETERNUS DX entry systems that offers restricted functions for configuration, management and monitoring as well as basic snapshot capabilitiesETERNUS SF Storage Cruiser (SC) LicensesETERNUS SF SC Basic License: Offers functions to monitor and administrate multiple ETERNUS DX systems including unified (block and file) mangement, storage system configuration, thin provisioning, health and status overview, performance monitoring, Eco Mode settings, power consumption and temperature monitoring.ETERNUS SF SC Standard License: Enhanced license offering in addition to the basic license health, status and end-to-end relationship overview for 3rd party storage, switches, servers and VM’s, SAN managementwith correlation and map view and a reporting function. Mandatory prerequisite for the Optimization, QoS and Storage Cluster licenses.ETERNUS SF SC Optimization License: Enables automated tiering by setting policies to automatically place data on the right media at the right time, achieving the best balance between maximizing performance and minimizing cost(available for ETERNUS DX S3/DX S4 series except DX60 S3/S4, DX80 S2, DX90 S2, DX400 S2 series, DX8700 S2 and ETERNUS AF series).ETERNUS SF SC QoS Management License: Enables the consolidationof multiple tiers of applications in single storage systems. The ETERNUS SF QoS automation feature enhances the array-based ETERNUS DX QoS feature and automates the process by dynamically maintaining, controlling and balancing the response times of the application-specific volumes(available for ETERNUS DX100 S3/S4, DX200 S3/S4, DX500 S3/S4, DX600 S3/S4, DX8700 S3, DX8900 S3/S4 and ETERNUS AF series).ETERNUS SF SC Storage Cluster License: Transparent failover feature which ensures business continuity in case of planned or unplanned outage of a complete array(available for DX100 S3/S4, DX200 S3/S4, DX500 S3/S4, DX600 S3/S4,DX8700 S3, DX8900 S3/S4, DX200F and ETERNUS AF series).ETERNUS SF AdvancedCopy Manager (ACM) LicensesETERNUS SF ACM Local Copy License: Offers a comprehensive set of array-based snapshot, cloning and mirroring capabilities including wizard- assisted backup for Exchange and SQL Servers. Mandatory prerequisite for the Exchange Server and SQL Server licensesETERNUS SF ACM Remote Copy License: Enables synchronous or asynchronous remote mirroring between arrays. Mandatory prerequisite for the Storage Cluster license(not available for ETERNUS DX60/DX60 S2/DX60 S3/DX60 S4/DX80/DX80 S2).ETERNUS SF ACM for Exchange Server License: Restore wizard for Exchange ServerETERNUS SF ACM for SQL Server License: Restore wizard for SQL Server Feature PacksETERNUS SF Replication Bundle: includes SC Standard License, ACM Local Copy, ACM Remote Copy, ACM for Exchange, ACM for SQL Server licenses (available for ETERNUS DX S3 / DX S4 series, for DX60 S3/S4 wihout ACM Remote Copy).ETERNUS SF Replication Bundle with Tiering: includes Replication Bundle and SC Optimization Option licenses(available for ETERNUS DX S3 / DX S4 series except DX60 S3/S4).ETERNUS SF Tiering Bundle: includes SC Standard and SC Optimization Option licenses(available for ETERNUS DX100 S3/S4, DX200 S3/S4, DX500 S3/S4, DX600 S3/S4).ETERNUS SF Business Continuity Bundle: includes SC Standard, ACM Remote Copy and Storage Cluster Option licenses.(available for ETERNUS DX100 S3/S4, DX200 S3/S4, DX500 S3/S4, DX600 S3/S4 ).All-in FlashPack: includes SC Standard, ACM Local & Remote Copy and SC Quality of Service Management Option .(included in ETERNUS AF series).More details for all features can be found on:/global/products/computing/storage/disk/eternus-dx/ feature/Technical detailsETERNUS SF Whitepapers and Details for FeaturesETERNUS SF Technical Whitepaper /global/products/computing/storage/software/eternus-sf/index.html Storage Cluster /global/products/computing/storage/disk/eternus-dx/storage-cluster/ VMware VVOL /global/products/computing/storage/disk/eternus-dx/eternusdx-vvol/ ETERNUS SF Storage Cruiser- Supported DevicesDisk Storage Systems ETERNUS DX60 S4, DX100 S4, DX200 S4, DX500 S4, DX600 S4ETERNUS DX60 S3, DX100 S3, DX200 S3, DX500 S3, DX600 S3ETERNUS DX8900 S4ETERNUS DX8700 S3, DX8900 S3ETERNUS DX60/DX60 S2, DX80 S2, DX90 S2ETERNUS DX410/DX410 S2, DX440/DX440 S2ETERNUS DX8400, DX8700/DX8700 S2NetApp FAS seriesTintri VMstore series (can be monitored only by the management server for Windows)NetApp FAS series, NetApp V series, NetApp AFF A seriesAll Flash Arrays ETERNUS AF250 S2, AF650 S2ETERNUS AF250, AF650ETERNUS DX200FTape Libraries ETERNUS LT20/LT20 S2, LT40/LT40 S2, LT60 S2ETERNUS LT200, LT210, LT220, LT230, LT250, LT270, LT270 S2, LT260Data Protection Appliances ETERNUS CS800, CS800 S2, CS800 S3, CS800 S4, CS800 S5ETERNUS CS2000Fibre Channel Switches Brocade 12000, 24000, 48000Brocade 8000, 7800, 7810, 7500, 6730, 6710, 6510, 6505, 5000, 5100, 5300, 5450Brocade 4016, 4016 D4, 4100, 4900Brocade 3250, 3850, 3014, 3200, 3800, 3900Brocade G630, G620, G610Brocade 200E, 300Brocade DCX 8510-4/8, DCX, DCX-4SBrocade X6-4/8Brocade AP7420PRIMERGY Fibre Channel Switch BladePRIMERGY BX600 Fibre Channel Switch BladePRIMERGY Fibre Channel Switch BladeS26361-F3144-E1/L1, S26361-F3144-E2/L2, S26361-F3144-E4S26361-F3144-E6, S26361-F3144-E14, S26361-F3144-E16S26361-K1305-V14, S26361-K1305-V26, S26361-K1305-V126ETERNUS SF AdvancedCopy Manager - Supported DevicesDisk Storage Systems ETERNUS DX60 S4, DX100 S4, DX200 S4, DX500 S4, DX600 S4ETERNUS DX60 S3, DX100 S3, DX200 S3, DX500 S3, DX600 S3ETERNUS DX8900 S4ETERNUS DX8700 S3, DX8900 S3ETERNUS DX60/DX60 S2, DX80 S2, DX90 S2ETERNUS DX410/DX410 S2, DX440/DX440 S2ETERNUS DX8400, DX8700/DX8700 S2All Flash Arrays ETERNUS AF250 S2, AF650 S2ETERNUS AF250, AF650ETERNUS DX200FETERNUS SF Express- Supported DevicesHybrid Storage Systems/Disk Storage Systems ETERNUS DX60 S4, DX100 S4, DX200 S4 ETERNUS DX60 S3, DX100 S3, DX200 S3 ETERNUS DX60/DX60 S2, DX80 S2, DX90 S2All Flash Arrays ETERNUS DX200FInstallation specificationManager Platforms Microsoft Windows Server 2019Microsoft Windows Server 2016Microsoft Windows Server 2012, 2012 R2Microsoft Windows Server 2008, 2008 R2Solaris 11 (11/11 or later), Solaris 10 (except ETERNUS SF Express)Red Hat Enterprise Linux 7Red Hat Enterprise Linux 6Red Hat Enterprise Linux 5Oracle Linux 6VMware® vSphere 6.0, 6.5, 6.7VMware® vSphere 5.0, 5.1, 5.5Microsoft Windows Server 2019 Hyper-VMicrosoft Windows Server 2016 Hyper-VMicrosoft Windows Server 2012 Hyper-V, 2012 R2 Hyper-VMicrosoft Windows Server 2008 Hyper-V, 2008 R2 Hyper-VHyper-V 2.0Agent Platforms Microsoft Windows Server 2019Microsoft Windows Server 2016Microsoft Windows Server 2012, 2012 R2Microsoft Windows Server 2008, 2008 R2Solaris 11 (11/11 or later), Solaris 10Red Hat Enterprise Linux 7Red Hat Enterprise Linux 6Red Hat Enterprise Linux 5Oracle Linux 6SUSE Linux Enterprise Server 12HP-UX 11i v3, HP-UX 11i v3 (IPF)AIX 7.1/6.1VMware® vSphere 6.0, 6.5, 6.7VMware® vSphere 5.0, 5.1, 5.5Microsoft Windows Server 2019 Hyper-VMicrosoft Windows Server 2016 Hyper-VMicrosoft Windows Server 2012 Hyper-V, 2012 R2 Hyper-VMicrosoft Windows Server 2008 Hyper-V, 2008 R2 Hyper-VHyper-V 2.0KVM on RHEL 7KVM on RHEL 6Client - Web Browser Internet Explorer 9, 10, 11Firefox ESR 17, 24, 31, 38, 45, 52, 60Microsoft Edge® 25, 42Google Chrome 60Client - Tablet (Dashboard Screens)Safari 8, 9 (iOS)Chrome 47, 50 (Android)ContactFUJITSU LIMITEDWebsite: /eternus2021-07-30 WW-ENworldwide project for reducing burdens on the environment.Using our global know-how, we aim to contribute to the creation of a sustainable environment for future generations through IT.Please find further information at http://www./global/about/environmentdelivery subject to availability. Any liability that the data and illustrations are complete, actual or correct is excluded. Designations may be trademarks and/or copyrights of the respective owner, the use of which by third parties for their own purposes may infringe the rights of such owner.。

UDZSTE-1710B;UDZSTE-172.4B;UDZSTE-172.7B;UDZSTE-173.0B;UDZSTE-173.3B;中文规格书,Datasheet资料

0.1 1 10 100 TIME:t(s) Rth-t CHARACTERISTICS
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UDZS10B
Data Sheet
10 Ta=125℃ REVERSE CURRENT:IR (nA) ZENER CURRENT:Iz(mA) 1 Ta=75℃ Ta=25℃ 0.1 Ta=-25℃
1000 Ta=125℃ 100 10 1 Ta=25℃ 0.1 0.01
100 f=1MHz CAPACITANCE BETWEEN TERMINALS:Ct(pF) 6 7
0
IR DISPERSION MAP
Ct DISPERSION MAP
1000
DYNAMIC IMPEDANCE:Zz(Ω)
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1 0.1 1 ZENER CURRENT(mA) Zz-Iz CHARACTERISTICS 10

c 2012 ROHM Co., Ltd. All rights reserved. ○
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Notice
Notes
No copying or reproduction of this document, in part or in whole, is permitted without the consent of ROHM Co.,Ltd. The content specified herein is subject to change for improvement without notice. The content specified herein is for the purpose of introducing ROHM's products (hereinafter "Products"). If you wish to use any such Product, please be sure to refer to the specifications, which can be obtained from ROHM upon request. Examples of application circuits, circuit constants and any other information contained herein illustrate the standard usage and operations of the Products. The peripheral conditions must be taken into account when designing circuits for mass production. Great care was taken in ensuring the accuracy of the information specified in this document. However, should you incur any damage arising from any inaccuracy or misprint of such information, ROHM shall bear no responsibility for such damage. The technical information specified herein is intended only to show the typical functions of and examples of application circuits for the Products. ROHM does not grant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by ROHM and other parties. ROHM shall bear no responsibility whatsoever for any dispute arising from the use of such technical information. The Products specified in this document are intended to be used with general-use electronic equipment or devices (such as audio visual equipment, office-automation equipment, communication devices, electronic appliances and amusement devices). The Products specified in this document are not designed to be radiation tolerant. While ROHM always makes efforts to enhance the quality and reliability of its Products, a Product may fail or malfunction for a variety of reasons. Please be sure to implement in your equipment using the Products safety measures to guard against the possibility of physical injury, fire or any other damage caused in the event of the failure of any Product, such as derating, redundancy, fire control and fail-safe designs. ROHM shall bear no responsibility whatsoever for your use of any Product outside of the prescribed scope or not in accordance with the instruction manual. The Products are not designed or manufactured to be used with any equipment, device or system which requires an extremely high level of reliability the failure or malfunction of which may result in a direct threat to human life or create a risk of human injury (such as a medical instrument, transportation equipment, aerospace machinery, nuclear-reactor controller, fuelcontroller or other safety device). ROHM shall bear no responsibility in any way for use of any of the Products for the above special purposes. If a Product is intended to be used for any such special purpose, please contact a ROHM sales representative before purchasing. If you intend to export or ship overseas any Product or technology specified herein that may be controlled under the Foreign Exchange and the Foreign Trade Law, you will be required to obtain a license or permit under the Law.

2SB1710资料

Transistors1/2General purpose amplification (−30V, −1A)2SB1710z ApplicationLow frequency amplifier Driverz Features1) A collector current is large.2) Collector saturation voltage is low. V CE (sat) ≤ −350mVat Ic = −500mA / I B = −25mA z External dimensions (Units : mm)z Absolute maximum ratings (T a=25°C)ParameterSymbol V CBO V CEO V EBO I CI CP P C Tj TstgLimits −30−30−6−1500150−55~+150−2∗1Unit V V V A A mW °C °C∗2∗1∗2Collector-base voltageCollector-emitter voltageEmitter-base voltageCollector currentPower dissipationJunction temperature Range of storage temperature Single pulse, P W =1msEach Terminal Mounted on a Recommendedz Packaging specificationsz Electrical characteristics (T a=25°C)ParameterSymbol Min.Typ.Max.Unit ConditionsV CB =−10V, I E =0A, f =1MHzf T −320−MHz V CE =−2V, I E =100mA, f =100MHz BV CBO −30−−V I C =−10µA BV CEO −30−−V I C =−1mA BV EBO −6−−V I E =−10µA I CBO −−−100nA V CB =−30V I EBO −−−100nA V EB =−6VV CE(sat)−−150−350mV I C =−500mA, I B =−25mA h FE 270−680−V CE =−2V, I C =−100mA Cob −7−pF∗∗Collector-base breakdown voltage Collector-emitter breakdown voltage Emitter-base breakdown voltage Collector cutoff current Emitter cutoff currentCollector-emitter saturation voltage DC current gainTransition frequencyCorrector output capacitance∗ PulsedTransistors2/2z Electrical characteristic curvesCOLLECTOR CURRENT : I C (A)D C C U R RE N T G A I N : hF EFig.1 DC current gainvs. collector currentCOLLECTOR CURRENT : I C (A)B A S E S A T U R A T I O N V O L T A G E : V B E (s a t ) (V )C O L L E C T O R S A T U R A T I O N V O L T A G E : V C E (s at ) (V )Fig.2 Collector-emitter saturation voltagebase-emitter saturation voltage vs. collector currentCOLLECTOR CURRENT : I C(A)C O L L E C T O R S A T U R A T I O N V O L T A G E : V C E (s a t ) (V )Fig.3 Collector-emitter saturation voltagevs. collector currentBASE TO EMITTER CURRENT : V BE (V)C O L L EC T O R C U R R E N T : I C (A )Fig.4 Grounded emitter propagationcharacteristicsEMITTER CURRENT : I E (A)T R A N S I T I O N F R E Q U E N C Y : f T (M H z )Fig.5 Gain bandwidth productvs. emitter currentCOLLECTOR CURRENT : I C (A)Fig.6 Switching timeS W I T C H I N G T I M E : (n s )C O L L E C T O R O U T P U T C A P A C I T A N C E : C o b (p F )E M I T T E R I N P U T C A P A C I T A N C E : C i b (pF )Fig.7 Collector output capacitancevs. collector-base voltage Emitter input capacitance vs. emitter-base voltageEMITTER TO BASE VOLTAGE : V EB (V)COLLECTOR TO BASE VOLTAGE : V CB (V)AppendixAbout Export Control Order in JapanProducts described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade ControlOrder in Japan.In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause)on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.Appendix1-Rev1.0。

研华数据采集卡pci 1710

PCL-10168电缆
接线端子板采用ADAM-3968型，是DIN导轨安装的68芯 SCSI-II接线端子板，用于各种输入输出信号线的连接。
ADAM-3968接线端子板
用PCI-1710HG板卡构成的控制系统框图如图6-6所示。
PCI-1710HG板卡设备的安装
首先进入研华公司官方网站找到并下载下列程序：PCI1710.exe、DevMgr.exe、PortIO.exe、 All_Examples.exe、Utility.exe等；
图6-8 PCI-1710HG板卡安装
重新开启计算机，进入WindowsXP系统，首先出现“找到新的硬件向导”对话框，选择“自动安装软件”项，点击“下一步” 按钮，计算机将自动完成Advantech PCI1710HG Device驱动程序的安装。
系统自动地为PCI板卡设备分配中断和基地址，用户无需关心。
大部分数据采集应用实例都使用了驱动软件。软件层中的驱动软件可以直接对数据采集件的寄存器编程，管理数据采集硬件的操作并把它和处理器中断，DMA和内存这样的计算机资源结合在一起。驱动软件隐藏了复杂的硬件底层编程细节，为用户提供容易理解的接口。
系统特点
基于PC的DAQ系统（简称PCs）的基本特点是，输入输出装置为板卡的形式，并将板卡直接与个人计算机的系统总线相连，即直接插在计算机主机的扩展槽上。这些输入输出板卡往往按照某种标准由第三方批量生产，开发者或用户可以直接在市场上购买，也可以由开发者自行制作。一块板卡的点数（指测控信号的数量）少的有几点，多的可达24点、32点甚至更多。
数据采集卡的种类
基于PC总线的板卡种类很多，其分类方法也有很多种。按照板卡处理信号的不同可以分为模拟量输入板卡 (A/D卡)、模拟量输出板卡(D/A卡)、开关量输入板卡、开关量输出板卡、脉冲量输入板卡、多功能板卡等。其中多功能板卡可以集成多个功能，如数字量输入/输出板卡将模拟量输入和数字量输入/输出集成在同一张卡上。根据总线的不同，可分为PCI板卡和ISA板卡。

MAX1710EEG中文资料

Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
High-Speed, Digitally Adjusted Step-Down Controllers for Notebook CPUs MAX1710/MAX1711
ABSOLUTE MAXIMUM RATINGS
LX to BST..................................................................-6V to +0.3V V+ to GND ..............................................................-0.3V to +30V REF Short Circuit to GND ...........................................Continuous VCC, VDD to GND .....................................................-0.3V to +6V PGND to GND.....................................................................±0.3V Continuous Power Dissipation (TA = +70°C) SHDN, PGOOD to GND ...........................................-0.3V to +6V 24-Pin QSOP (derate 9.5mW/°C above +70°C)..........762mW OVP, ILIM, FB, FBS, CC, REF, D0–D4, Operating Temperature Range ...........................-40°C to +85°C GNDS, TON to GND ..............................-0.3V to (VCC + 0.3V) Junction Temperature ......................................................+150°C SKIP to GND (Note 1).................................-0.3V to (VCC + 0.3V) Storage Temperature Range .............................-65°C to +165°C DL to PGND................................................-0.3V to (VDD + 0.3V) Lead Temperature (soldering, 10sec) .............................+300°C BST to GND ............................................................-0.3V to +36V DH to LX .....................................................-0.3V to (BST + 0.3V) Note 1: SKIP may be forced below -0.3V, temporarily exceeding the absolute maximum rating, for the purpose of debugging prototype breadboards using the no-fault test mode. Limit the current drawn to -5mA maximum.

ITA-1711快速入门手册说明书

ITA-1711快速入门手册 1安装系统之前，用户需确认包装中含有本设备以及下面所列各项：• 1 x ITA-1711 系列工业电脑• 1 x ITA-1711 配件盒• 1 x 包含启动实用程序和手册（PDF格式）的CD光盘• 2 x 安装支架• 4 x 底部橡胶垫• 4 x M4螺丝（用于安装支架）• 1 x 质保卡如果其中任何一项缺失或损坏，请立即与经销商或销售代表联系。

注1：有关ITA-1711产品的详细信息，请参考CD光盘中的信息（PDF格式）。

注2：阅读PDF文件需要使用Acrobat Reader。

用户可从以下路径下载Acrobat Reader：/Products/acrobat/readstep2.html（Acrobat为Adobe公司的商标）ITA-1711系列无风扇嵌入式Celeron级双核紧凑型工业电脑快速入门手册标准功能• 芯片和芯片组：英特尔Celeron处理器J1900 • BIOS：AMI SPI 64 Mb Flash • 内存：板载4GB DDR3L 1333内存• 显示：Embedded Gen7+GFX Core，频率542 MHz 共享系统内存最高达256 MB SDRAM• 双显模式：单显分辨率可达2048 x 1536，双显分辨率可达1920 x 1080• 存储：支持1个CompactFlash插槽,1个M-Sata插槽以及1个2.5寸HDD/SSD• 扩展槽：支持1个Mini PCIe插槽系统规格• 以太网：2个10/100/1000M以太网• USB：5个USB2.0,1个USB3.0• VGA：2个VGA• 串口：10个串口，支持RS-232/422/485切换• 数字I/O：12个GPI，12个GPO• 声音：1个带2 x 4W放大器的扬声器输出，1个线路输入机箱与环境• 产品尺寸（W x H x D）：200 x 190 x 100 mm(7.87”x 7.48”x 3.94”) • 电源输入：直流9 ~ 36 V输入• 工作温度：-25 ~ 60°C (-13 ~ 140°F)• 重量：3.6 kg如需了解有关本产品及研华其它产品的详细信息，请访问我们的网站： /epc如需技术服务与支持，请访问我们的技术支持网站：本手册适用于ITA-1711系列。

IMYTAHART温变中文版

IMYTAHART温变中⽂版使⽤⼿册YTA 系列温度变送器HART 通信IM01C50T01-01C⽬录⽬录 (ii)1概述.........................................................................................................................1-1 本⼿册的注意事项............................................................................................1-1 安全和修订的注意事项.....................................................................................1-1 符号索引..........................................................................................................1-1 质保..............................................................................................................1-21.1检查仪表DD。

..................................................................................................1-2 2HART智能终端的操作............................................................................................2-12.1 在线通讯条件...................................................................................................2-12.1.1 YTA和HART通讯接线..........................................................................2-12.1.2在线通讯条件..........................................................................................2-12.2 HART智能终端的基本操作(275)......................................................................2-22.2.1 按键与功能.............................................................................................2-22.2.2 显⽰........................................................................................................2-32.2.3 菜单地址的呼出......................................................................................2-42.2.4数据的输⼊、设定以及发送.....................................................................2-6 3操作.........................................................................................................................3-13.1参数的⽤途和选择.............................................................................................3-13.2 菜单树..............................................................................................................3-53.3 REVIEW/回顾....................................................................................................3-63.4 基本设置...........................................................................................................3-63.4.1 传感器配置.............................................................................................3-63.4.2 过程变量赋值.........................................................................................3-83.4.3单位.......................................................................................................3-103.4.4 PV范围.................................................................................................3-113.4.5 阻尼时间常数.......................................................................................3-133.4.6⼯位号...................................................................................................3-143.5 Detailed Setup-详细设置.................................................................................3-153.5.1 Device information-设备信息.................................................................3-153.5.3 Burnout -过载功能...............................................................................3-163.5.4 内藏指⽰仪显⽰模式.............................................................................3-163.5.5 写保护..................................................................................................3-183.5.6 Sensor Trim- 传感器修正......................................................................3-193.5.7 模拟输出修正.......................................................................................3-213.5.8 Sensor Backup 传感器备份功能（仅YTA320）..................................3-223.5.9 Burst 模式............................................................................................3-233.5.10 Multi Drop...........................................................................................3-233.5.11 传感器匹配功能..................................................................................3-243.5.12 CJC 选择............................................................................................3-253.6 ⾃诊断............................................................................................................3-263.6.1 查问题..................................................................................................3-263.6.2 警告........................................................................................................3-13.6.3 ⽇志功能.................................................................................................3-2 4参数表.....................................................................................................................4-31 概述欢迎使⽤YTA系列温度变送器。

WinGlink处理MT数据说明书

WinGlink处理MT数据说明书WinGlink是一款意大利GEOSYSTEM公司开发的综合解释平台，主要侧重于大地电磁的建模和数据处理，能结合重磁资料和大地电磁的联合处理解释，并实现了钻孔等资料的约束反演。

该系统实现了大地电磁的一、二维反演，并可进行三维大地电磁的模拟，其正演采用了Randy Mackie的二维交错采样有限差分迭代算法程序。

本文针对WinGlink处理大地电磁测深数据作详细的讲解。

1、使用WinGlink软件前，需将电脑转换至英文系统下：“开始菜单”—“控制面板”—“时钟、语言和区域”—“区域和语言”—“管理”点击“更改系统区域设置”后，出现下图所示的语言选择框，选择任意英语国家，并重新启动计算机。

2、重新启动后，点击图标运行软件，出现下图中的对话框：其中1号框图表示创建一个新的数据库；2号框图表示打开一个已有的数据库，3号框图则表示使用已购买的工具箱。

对于初学者或该软件为破解版的情况下，一般选择1号或者2号框图按钮。

本文中点击“creat a newdatabase”，然后点击“OK”按钮。

3、点击“OK”按钮后，会弹出一存储对话框，选择存储的文件夹并编辑数据库名称。

4、新建数据库后，则需填写新建的数据库信息（Database properties），其中共三项，分别是：General、Projected Coords、Geographic Coords。

第一项：General（常规信息），其中包含地区名称、所处半球，平面坐标单位、垂直坐标的单位。

第二项：ProjectedCoords（投影坐标），对话框中的UTM即Universal Transverse Mercator，表示通用横轴墨卡托投影，处理MT数据一般默认使用该投影，故无需进行改变。

中间的True Origin（坐标原点），Latitude框无法改变，而Longitude框的数值则需改成测区范围的任意经度，并以度分秒的形式，例如改写成：107°00’00.0000’’。

iw1710规格书中文版

iw1710规格书中文版IW1710机翻中文版IW1710数字PWM电流模式控制器，应用准谐工作模式1.0 产品特点原边反馈简化了设计，并去除了光耦准谐振模式，提高的整体效率EZ-EMI ® 设计，轻松满足全球EMI标准高达130 kHz的开关频率，适用于小尺寸变压器极为严格的输出电压调节无需外部补偿元件符合CEC/ EPA空载功耗和平均效率规定内置输出恒流控制与初级侧反馈低启动电流（典型值10μA）内置软启动内置短路保护和输出过压保护可选的AC线路欠压/过电压保护轻负载时工作在PFM模式电流检测电阻短路保护过温保护2.0 说明iW1710是一款高性能的AC/DC电源控制器，它采用数字控制技术，打造峰值电流PWM模式反激式电源。

iW1700工作在准谐振模式，在重负载提供高效率，以及一些关键的内置保护功能，同时最大限度地减少了外部元件数量，简化了EMI设计，降低材料成本的总费用。

iW1710不再需要次级反馈电路，同时实现出色的线性和负载调节。

它在去除了环路补偿元件的同时保证稳定的工作。

脉冲波形分析使环路响应是比传统的解决方案快得多，从而提高了动态负载响应。

内置电流限制功能可优化变压器设计，通用的离线应用程序在很宽的输入电压范围。

在轻负载时超低的工作电流和和待机功率，保证iW1710是新管理标准和平均效率应用的理想选择。

3.0 应用3.1 典型应用电路4.0 引脚说明引脚名称类型说明1 NC - 悬空脚2 V SENSE模拟输入辅助电压检测（用于初级端调节）3 V IN模拟输入输入端电压平均值检测4 SD 模拟输入外部关断控制。

通过一个电阻连接到地，如不使用见10.165 GND 地地6 I SENSE模拟输入初级电流检测（用于逐周期峰值电流控制和限制）7 OUTPUT输出外部MOSFET管栅极驱动。

8 V CC电源输入控制逻辑的电源和电压检测的上电复位电路。

5.0 额定最大值参数符号数值单位VCC直流电压范围（PIN8 V CC）V CC-0.3~18V 直流电源电流（PIN8 V CC）I CC20mA MOSFET栅极驱动（PIN7 OUTPUT）-0.3~18V 电压反馈（PIN2 V SENSE）-0.7~4V 输入端电压检测（PIN3 V IN）-0.3~18V SD输入（PIN4 SD）-0.3~18V 功耗 T A≤25℃P D526mW 最高结温T JMAX125℃工作温度T STG-65~150℃结到环境的热阻θJA160℃/W 防静电等级2000V 闩锁测试±100mA6.0 电气特性VCC=12V -40℃至85℃7.0 典型性能特性8.0 功能框图9.0 工作原理iW1710采用了专有的初级侧控制技术，去除了光耦反馈和传统设计所需的二次调节电路的数字控制器。

Fluke VR1710使用说明书

Fluke 授权经销商只对最终用户新的和未使用的产品提供本保证，但无权代表 Fluke 公司提供额外或不同的保证。只有通过 Fluke 授权经销商购买的产品或者买方已经按适用的国际价格付款才能享受 Fluke 的保证支持。在一国购买的产品需在他国修理时，Fluke 有权向买方要求负担重大修理/零件更换费用。
有效值电压通道有效值电压测量范围70有效值电压分辨率0125有效值电压不确定性量程的05300测量方法真有效值采样频率32khz频率范围50hz频率不确定性002hz瞬态高压记录分辨率12谐波振幅不确定性相对于基波有效值的最大谐波记录次数50vr1710用户手册10内部存储容量正常条件下记录时间超过个月通讯usb1120内部时钟误差功耗25电源要求70134mm15重量0207kg045lb工作海拔2000ip等级40限室内使用振动要求milprf28800f工作温度1050c14存放温度2060c4工作湿度无冷凝30c3286f最大相对湿度9540c86104f最大相对湿度7550c104122f最大相对湿度45测量类别等级300vcatii污染等级ii安全性iec610101电磁兼容性emciec613261
• 记录时间间隔可配置 • 提供图形格式和电子数据表格式的数据摘要 • 带时间戳的 Min（最小值）、Max（最大值）和 Average RMS
（平均有效值） • 瞬态波形记录 • 个次谐波值和时间曲线图 • 可通过（附带的）USB 电缆将记录的数据下载到 PC 机 • 打印表格、图形和综合的格式化报告 • 查看、打印和导出数据详情请参阅 VR1710 手册光盘中附带的 Power Log 用户手册。该手册提供了安装和使用说明，以及连接至 Fluke 电力质量检测仪器的常规说明。
有限保证和责任限制

三星电子VT-WINII培训教材（中文版）

三星电子VT-WINII培训教材（中文版）中文版目次CHIP件系列的检查原理自动抽出 (2)焊盘部 (3)三极管系列的检查原理自动抽出 (9)焊盘部 (10)ＩＣ系列的检查原理自动抽出 (14)焊盘部 (17)插座（从ＩＣ系列检查原理变更）自动抽出 (23)插入式元件自动抽出 (24)焊盘部 (24)基准校正的检查原理校正 (27)色参数的设定方法 (28)共通连接 (29)CHIP 件系列原理（电容／二极管／排电阻）注意：色参数设定时尽可能不要把白色的印迹和电路板面等对检查有影响的颜色設定进来。

□焊盘部的抽出□ 元件本体抽出□ 電極抽出□ 元件本体扩张功能上＿（画素）下＿（画素）① 进行焊盘部抽出时，焊盘窗口首先向实际的焊盘相对应的位置移動。

所有窗口也随之一起移动。

② 元件本体抽出或者電極抽出时，元件本体窗口向实际的本体位置移動。

扩大扩大象电容等元件先端有電極的元件适用于这一功能。

部品本体抽出後、沿窗口的箭头方向元件本体扩张。

扩张后的大小作为元件的本体尺寸。

注意：如果抽出比较安定，色参数的設定不受窗口外颜色的影响。

□ 缺件判定（焊锡形状）焊盘中央部元件漏贴时，焊盘中央部显示红色。

色参数．．．抽出焊锡的红色部分面積（％）＿≧□ NG 的良品进行补救参数．．．抽出焊锡的兰色部分面積（％）＿≧把検査領域的面積作为100%色参数設定的颜色如果抽出設定値以上 NG50% 把検査領域的面積作为100%良品良品焊锡量多的时候、焊锡如图所示，中央显示红色。

焊盘中央部的検査只通过面積設定，不能够分辨，判定为ＮＧ这样良品被判定不良。

为避免这样的误判断，这种形状的焊锡，利用焊盘元件側检查，对良品进行补救。

□ 電極有無．．．用于焊锡量過多的検出。

電極上如果粘上焊锡電極的面積就会減少。

色参数．．．抽出電極的红色面積＿（％）≧□ 横向偏移＿（％）通过自動抽出窗口中抽出的焊盘和元件位置进行判定。

色参数不必設定。

□ 纵向偏移＿（％）通过自動抽出窗口中抽出的焊盘和元件位置进行判定。