kieso15e_testbank_ch14

合集下载

清月全系列杰理芯片_强制升级工具4.0_如何下载程序_集锦FAQ_V4

清月全系列杰理芯片_强制升级工具4.0_如何下载程序_集锦FAQ_V4

一、下载工具的造型:V2.0版本下载器--目前还在继续用带晶振的芯片,好用蓝牙全系列支持V3.0版本下载器--也还行,适合AD14、AD16N等等芯片蓝牙全系列支持V4.0版本下载器--目前主要用这个--免晶振芯片用这个也很好用,就是贵注意,虽然下载工具分为三个造型,或者说三个版本,但是他们的下载原理是一样的很重要,原理一样,操作也基本一样。

列重点!!!!先看!!!!1、母头连接电脑,公头连接样机,不要搞反了。

==》什么是母,什么是公不用教了吧2、无需任何驱动,无需任何驱动,不需要安装软件,不需要安装软件。

不用再次问了二、常见的问题问题1此工具需要安装驱动吗?回答1、此工具,是免驱的,不需要安装任何驱动,不需要安装任何驱动问题2此工具该如何使用呢?回答1、母头,是连接电脑。

首先先连接到电脑。

搞根公对公的线连接电脑2、公头,是连接待升级的样板。

如果接口不合适,可以自行做转接线3、正常情况下,蓝灯和红灯会常亮。

红灯是供电灯,蓝灯是下载指示灯4、需要升级的时候,把公头插入待升级的样板,正常现象是蓝灯会熄灭,此时就可以下载了问题3为什么我按照操作,还是不能升级程序呢?回答1、查usb的连接是否正常,再次重申,母头电脑公头样机。

蓝灯是否熄灭2、有时候可能需要插拔几次,才能升级,这也是属于正常现象3、一定要注意,不要用usbhub,或者usb的扩展坞,或者usb的集线器4、不要用电脑的usb3.0接口5、如果出现一个usb接口不能下载,尝试换一下usb口6、尝试换一个板子试试,先自己排查一下,不要碰到问题,就开始大喊大叫,先做排除法,其实这个工具很好用,只是你不会,不熟悉而已,别抗拒问题4为什么我按照操作,还是不能升级程序呢?怎么查问题呢?跟电脑有关系吗回答1、右键“我的电脑”属性--设备管理器,看看如下截图下载器和目标的芯片,也就是被下载的芯片,通讯成功之后,会出现一个“USB大容量存储设备”没有出现就是不对,再次插一下,回到问题3去看看三、第1步-----按照接口连接好USB座子四、第2步-----插上下载器此时,电脑的设备管理器1、下载器母头接电脑,公头接样机2、会多出一个usb设备3、同时电脑会伴随一个usb设备插入的提示音。

NuMicro N9H30系列开发板用户手册说明书

NuMicro N9H30系列开发板用户手册说明书

NuMicro®FamilyArm® ARM926EJ-S BasedNuMaker-HMI-N9H30User ManualEvaluation Board for NuMicro® N9H30 SeriesNUMAKER-HMI-N9H30 USER MANUALThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.Table of Contents1OVERVIEW (5)1.1Features (7)1.1.1NuMaker-N9H30 Main Board Features (7)1.1.2NuDesign-TFT-LCD7 Extension Board Features (7)1.2Supporting Resources (8)2NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION (9)2.1NuMaker-N9H30 Board - Front View (9)2.2NuMaker-N9H30 Board - Rear View (14)2.3NuDesign-TFT-LCD7 - Front View (20)2.4NuDesign-TFT-LCD7 - Rear View (21)2.5NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB Placement (22)3NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS (24)3.1NuMaker-N9H30 - GPIO List Circuit (24)3.2NuMaker-N9H30 - System Block Circuit (25)3.3NuMaker-N9H30 - Power Circuit (26)3.4NuMaker-N9H30 - N9H30F61IEC Circuit (27)3.5NuMaker-N9H30 - Setting, ICE, RS-232_0, Key Circuit (28)NUMAKER-HMI-N9H30 USER MANUAL3.6NuMaker-N9H30 - Memory Circuit (29)3.7NuMaker-N9H30 - I2S, I2C_0, RS-485_6 Circuit (30)3.8NuMaker-N9H30 - RS-232_2 Circuit (31)3.9NuMaker-N9H30 - LCD Circuit (32)3.10NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 Circuit (33)3.11NuMaker-N9H30 - RMII_0_PF Circuit (34)3.12NuMaker-N9H30 - RMII_1_PE Circuit (35)3.13NuMaker-N9H30 - USB Circuit (36)3.14NuDesign-TFT-LCD7 - TFT-LCD7 Circuit (37)4REVISION HISTORY (38)List of FiguresFigure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation Board (5)Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board (6)Figure 2-1 Front View of NuMaker-N9H30 Board (9)Figure 2-2 Rear View of NuMaker-N9H30 Board (14)Figure 2-3 Front View of NuDesign-TFT-LCD7 Board (20)Figure 2-4 Rear View of NuDesign-TFT-LCD7 Board (21)Figure 2-5 Front View of NuMaker-N9H30 PCB Placement (22)Figure 2-6 Rear View of NuMaker-N9H30 PCB Placement (22)Figure 2-7 Front View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement (23)Figure 3-1 GPIO List Circuit (24)Figure 3-2 System Block Circuit (25)Figure 3-3 Power Circuit (26)Figure 3-4 N9H30F61IEC Circuit (27)Figure 3-5 Setting, ICE, RS-232_0, Key Circuit (28)Figure 3-6 Memory Circuit (29)Figure 3-7 I2S, I2C_0, RS-486_6 Circuit (30)Figure 3-8 RS-232_2 Circuit (31)Figure 3-9 LCD Circuit (32)NUMAKER-HMI-N9H30 USER MANUAL Figure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit (33)Figure 3-11 RMII_0_PF Circuit (34)Figure 3-12 RMII_1_PE Circuit (35)Figure 3-13 USB Circuit (36)Figure 3-14 TFT-LCD7 Circuit (37)List of TablesTable 2-1 LCD Panel Combination Connector (CON8) Pin Function (11)Table 2-2 Three Sets of Indication LED Functions (12)Table 2-3 Six Sets of User SW, Key Matrix Functions (12)Table 2-4 CMOS Sensor Connector (CON10) Function (13)Table 2-5 JTAG ICE Interface (J2) Function (14)Table 2-6 Expand Port (CON7) Function (16)Table 2-7 UART0 (J3) Function (16)Table 2-8 UART2 (J6) Function (16)Table 2-9 RS-485_6 (SW6~8) Function (17)Table 2-10 Power on Setting (SW4) Function (17)Table 2-11 Power on Setting (S2) Function (17)Table 2-12 Power on Setting (S3) Function (17)Table 2-13 Power on Setting (S4) Function (17)Table 2-14 Power on Setting (S5) Function (17)Table 2-15 Power on Setting (S7/S6) Function (18)Table 2-16 Power on Setting (S9/S8) Function (18)Table 2-17 CMOS Sensor Connector (CON9) Function (19)Table 2-18 CAN_0 (SW9~10) Function (19)NUMAKER-HMI-N9H30 USER MANUAL1 OVERVIEWThe NuMaker-HMI-N9H30 is an evaluation board for GUI application development. The NuMaker-HMI-N9H30 consists of two parts: a NuMaker-N9H30 main board and a NuDesign-TFT-LCD7 extensionboard. The NuMaker-HMI-N9H30 is designed for project evaluation, prototype development andvalidation with HMI (Human Machine Interface) function.The NuMaker-HMI-N9H30 integrates touchscreen display, voice input/output, rich serial port serviceand I/O interface, providing multiple external storage methods.The NuDesign-TFT-LCD7 can be plugged into the main board via the DIN_32x2 extension connector.The NuDesign-TFT-LCD7 includes one 7” LCD which the resolution is 800x480 with RGB-24bits andembedded the 4-wires resistive type touch panel.Figure 1-1 Front View of NuMaker-HMI-N9H30 Evaluation BoardNUMAKER-HMI-N9H30 USER MANUAL Figure 1-2 Rear View of NuMaker-HMI-N9H30 Evaluation Board1.1 Features1.1.1 NuMaker-N9H30 Main Board Features●N9H30F61IEC chip: LQFP216 pin MCP package with DDR (64 MB)●SPI Flash using W25Q256JVEQ (32 MB) booting with quad mode or storage memory●NAND Flash using W29N01HVSINA (128 MB) booting or storage memory●One Micro-SD/TF card slot served either as a SD memory card for data storage or SDIO(Wi-Fi) device●Two sets of COM ports:–One DB9 RS-232 port with UART_0 used 75C3232E transceiver chip can be servedfor function debug and system development.–One DB9 RS-232 port with UART_2 used 75C3232E transceiver chip for userapplication●22 GPIO expansion ports, including seven sets of UART functions●JTAG interface provided for software development●Microphone input and Earphone/Speaker output with 24-bit stereo audio codec(NAU88C22) for I2S interfaces●Six sets of user-configurable push button keys●Three sets of LEDs for status indication●Provides SN65HVD230 transceiver chip for CAN bus communication●Provides MAX3485 transceiver chip for RS-485 device connection●One buzzer device for program applicationNUMAKER-HMI-N9H30 USER MANUAL●Two sets of RJ45 ports with Ethernet 10/100 Mbps MAC used IP101GR PHY chip●USB_0 that can be used as Device/HOST and USB_1 that can be used as HOSTsupports pen drives, keyboards, mouse and printers●Provides over-voltage and over current protection used APL3211A chip●Retain RTC battery socket for CR2032 type and ADC0 detect battery voltage●System power could be supplied by DC-5V adaptor or USB VBUS1.1.2 NuDesign-TFT-LCD7 Extension Board Features●7” resolution 800x480 4-wire resistive touch panel for 24-bits RGB888 interface●DIN_32x2 extension connector1.2 Supporting ResourcesFor sample codes and introduction about NuMaker-N9H30, please refer to N9H30 BSP:https:///products/gui-solution/gui-platform/numaker-hmi-n9h30/?group=Software&tab=2Visit NuForum for further discussion about the NuMaker-HMI-N9H30:/viewforum.php?f=31 NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUAL2 NUMAKER-HMI-N9H30 HARDWARE CONFIGURATION2.1 NuMaker-N9H30 Board - Front View Combination Connector (CON8)6 set User SWs (K1~6)3set Indication LEDs (LED1~3)Power Supply Switch (SW_POWER1)Audio Codec(U10)Microphone(M1)NAND Flash(U9)RS-232 Transceiver(U6, U12)RS-485 Transceiver(U11)CAN Transceiver (U13)Figure 2-1 Front View of NuMaker-N9H30 BoardFigure 2-1 shows the main components and connectors from the front side of NuMaker-N9H30 board. The following lists components and connectors from the front view:NuMaker-N9H30 board and NuDesign-TFT-LCD7 board combination connector (CON8). This panel connector supports 4-/5-wire resistive touch or capacitance touch panel for 24-bits RGB888 interface.Connector GPIO pin of N9H30 FunctionCON8.1 - Power 3.3VCON8.2 - Power 3.3VCON8.3 GPD7 LCD_CSCON8.4 GPH3 LCD_BLENCON8.5 GPG9 LCD_DENCON8.7 GPG7 LCD_HSYNCCON8.8 GPG6 LCD_CLKCON8.9 GPD15 LCD_D23(R7)CON8.10 GPD14 LCD_D22(R6)CON8.11 GPD13 LCD_D21(R5)CON8.12 GPD12 LCD_D20(R4)CON8.13 GPD11 LCD_D19(R3)CON8.14 GPD10 LCD_D18(R2)CON8.15 GPD9 LCD_D17(R1)CON8.16 GPD8 LCD_D16(R0)CON8.17 GPA15 LCD_D15(G7)CON8.18 GPA14 LCD_D14(G6)CON8.19 GPA13 LCD_D13(G5)CON8.20 GPA12 LCD_D12(G4)CON8.21 GPA11 LCD_D11(G3)CON8.22 GPA10 LCD_D10(G2)CON8.23 GPA9 LCD_D9(G1) NUMAKER-HMI-N9H30 USER MANUALCON8.24 GPA8 LCD_D8(G0)CON8.25 GPA7 LCD_D7(B7)CON8.26 GPA6 LCD_D6(B6)CON8.27 GPA5 LCD_D5(B5)CON8.28 GPA4 LCD_D4(B4)CON8.29 GPA3 LCD_D3(B3)CON8.30 GPA2 LCD_D2(B2)CON8.31 GPA1 LCD_D1(B1)CON8.32 GPA0 LCD_D0(B0)CON8.33 - -CON8.34 - -CON8.35 - -CON8.36 - -CON8.37 GPB2 LCD_PWMCON8.39 - VSSCON8.40 - VSSCON8.41 ADC7 XPCON8.42 ADC3 VsenCON8.43 ADC6 XMCON8.44 ADC4 YMCON8.45 - -CON8.46 ADC5 YPCON8.47 - VSSCON8.48 - VSSCON8.49 GPG0 I2C0_CCON8.50 GPG1 I2C0_DCON8.51 GPG5 TOUCH_INTCON8.52 - -CON8.53 - -CON8.54 - -CON8.55 - -NUMAKER-HMI-N9H30 USER MANUAL CON8.56 - -CON8.57 - -CON8.58 - -CON8.59 - VSSCON8.60 - VSSCON8.61 - -CON8.62 - -CON8.63 - Power 5VCON8.64 - Power 5VTable 2-1 LCD Panel Combination Connector (CON8) Pin Function●Power supply switch (SW_POWER1): System will be powered on if the SW_POWER1button is pressed●Three sets of indication LEDs:LED Color DescriptionsLED1 Red The system power will beterminated and LED1 lightingwhen the input voltage exceeds5.7V or the current exceeds 2A.LED2 Green Power normal state.LED3 Green Controlled by GPH2 pin Table 2-2 Three Sets of Indication LED Functions●Six sets of user SW, Key Matrix for user definitionKey GPIO pin of N9H30 FunctionK1 GPF10 Row0 GPB4 Col0K2 GPF10 Row0 GPB5 Col1K3 GPE15 Row1 GPB4 Col0K4 GPE15 Row1 GPB5 Col1K5 GPE14 Row2 GPB4 Col0K6GPE14 Row2GPB5 Col1 Table 2-3 Six Sets of User SW, Key Matrix Functions●NAND Flash (128 MB) with Winbond W29N01HVS1NA (U9)●Microphone (M1): Through Nuvoton NAU88C22 chip sound input●Audio CODEC chip (U10): Nuvoton NAU88C22 chip connected to N9H30 using I2Sinterface–SW6/SW7/SW8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5and J5)–SW6/SW7/SW8: 2-3 short for I2S function and connected to NAU88C22 (U10).●CMOS Sensor connector (CON10, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11)–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON10)Connector GPIO pin of N9H30 FunctionCON10.1 - VSSCON10.2 - VSSNUMAKER-HMI-N9H30 USER MANUALCON10.3 - Power 3.3VCON10.4 - Power 3.3VCON10.5 - -CON10.6 - -CON10.7 GPI4 S_PCLKCON10.8 GPI3 S_CLKCON10.9 GPI8 S_D0CON10.10 GPI9 S_D1CON10.11 GPI10 S_D2CON10.12 GPI11 S_D3CON10.13 GPI12 S_D4CON10.14 GPI13 S_D5CON10.15 GPI14 S_D6CON10.16 GPI15 S_D7CON10.17 GPI6 S_VSYNCCON10.18 GPI5 S_HSYNCCON10.19 GPI0 S_PWDNNUMAKER-HMI-N9H30 USER MANUAL CON10.20 GPI7 S_nRSTCON10.21 GPG2 I2C1_CCON10.22 GPG3 I2C1_DCON10.23 - VSSCON10.24 - VSSTable 2-4 CMOS Sensor Connector (CON10) FunctionNUMAKER-HMI-N9H30 USER MANUAL2.2NuMaker-N9H30 Board - Rear View5V In (CON1)RS-232 DB9 (CON2,CON6)Expand Port (CON7)Speaker Output (J4)Earphone Output (CON4)Buzzer (BZ1)System ResetSW (SW5)SPI Flash (U7,U8)JTAG ICE (J2)Power ProtectionIC (U1)N9H30F61IEC (U5)Micro SD Slot (CON3)RJ45 (CON12, CON13)USB1 HOST (CON15)USB0 Device/Host (CON14)CAN_0 Terminal (CON11)CMOS Sensor Connector (CON9)Power On Setting(SW4, S2~S9)RS-485_6 Terminal (CON5)RTC Battery(BT1)RMII PHY (U14,U16)Figure 2-2 Rear View of NuMaker-N9H30 BoardFigure 2-2 shows the main components and connectors from the rear side of NuMaker-N9H30 board. The following lists components and connectors from the rear view:● +5V In (CON1): Power adaptor 5V input ●JTAG ICE interface (J2) ConnectorGPIO pin of N9H30Function J2.1 - Power 3.3V J2.2 GPJ4 nTRST J2.3 GPJ2 TDI J2.4 GPJ1 TMS J2.5 GPJ0 TCK J2.6 - VSS J2.7 GPJ3 TD0 J2.8-RESETTable 2-5 JTAG ICE Interface (J2) Function●SPI Flash (32 MB) with Winbond W25Q256JVEQ (U7); only one (U7 or U8) SPI Flashcan be used●System Reset (SW5): System will be reset if the SW5 button is pressed●Buzzer (BZ1): Control by GPB3 pin of N9H30●Speaker output (J4): Through the NAU88C22 chip sound output●Earphone output (CON4): Through the NAU88C22 chip sound output●Expand port for user use (CON7):Connector GPIO pin of N9H30 FunctionCON7.1 - Power 3.3VCON7.2 - Power 3.3VCON7.3 GPE12 UART3_TXDCON7.4 GPH4 UART1_TXDCON7.5 GPE13 UART3_RXDCON7.6 GPH5 UART1_RXDCON7.7 GPB0 UART5_TXDCON7.8 GPH6 UART1_RTSCON7.9 GPB1 UART5_RXDCON7.10 GPH7 UART1_CTSCON7.11 GPI1 UART7_TXDNUMAKER-HMI-N9H30 USER MANUAL CON7.12 GPH8 UART4_TXDCON7.13 GPI2 UART7_RXDCON7.14 GPH9 UART4_RXDCON7.15 - -CON7.16 GPH10 UART4_RTSCON7.17 - -CON7.18 GPH11 UART4_CTSCON7.19 - VSSCON7.20 - VSSCON7.21 GPB12 UART10_TXDCON7.22 GPH12 UART8_TXDCON7.23 GPB13 UART10_RXDCON7.24 GPH13 UART8_RXDCON7.25 GPB14 UART10_RTSCON7.26 GPH14 UART8_RTSCON7.27 GPB15 UART10_CTSCON7.28 GPH15 UART8_CTSCON7.29 - Power 5VCON7.30 - Power 5VTable 2-6 Expand Port (CON7) Function●UART0 selection (CON2, J3):–RS-232_0 function and connected to DB9 female (CON2) for debug message output.–GPE0/GPE1 connected to 2P terminal (J3).Connector GPIO pin of N9H30 Function J3.1 GPE1 UART0_RXDJ3.2 GPE0 UART0_TXDTable 2-7 UART0 (J3) Function●UART2 selection (CON6, J6):–RS-232_2 function and connected to DB9 female (CON6) for debug message output –GPF11~14 connected to 4P terminal (J6)Connector GPIO pin of N9H30 Function J6.1 GPF11 UART2_TXDJ6.2 GPF12 UART2_RXDJ6.3 GPF13 UART2_RTSJ6.4 GPF14 UART2_CTSTable 2-8 UART2 (J6) Function●RS-485_6 selection (CON5, J5, SW6~8):–SW6~8: 1-2 short for RS-485_6 function and connected to 2P terminal (CON5 and J5) –SW6~8: 2-3 short for I2S function and connected to NAU88C22 (U10)Connector GPIO pin of N9H30 FunctionSW6:1-2 shortGPG11 RS-485_6_DISW6:2-3 short I2S_DOSW7:1-2 shortGPG12 RS-485_6_ROSW7:2-3 short I2S_DISW8:1-2 shortGPG13 RS-485_6_ENBSW8:2-3 short I2S_BCLKNUMAKER-HMI-N9H30 USER MANUALTable 2-9 RS-485_6 (SW6~8) FunctionPower on setting (SW4, S2~9).SW State FunctionSW4.2/SW4.1 ON/ON Boot from USB SW4.2/SW4.1 ON/OFF Boot from eMMC SW4.2/SW4.1 OFF/ON Boot from NAND Flash SW4.2/SW4.1 OFF/OFF Boot from SPI Flash Table 2-10 Power on Setting (SW4) FunctionSW State FunctionS2 Short System clock from 12MHzcrystalS2 Open System clock from UPLL output Table 2-11 Power on Setting (S2) FunctionSW State FunctionS3 Short Watchdog Timer OFFS3 Open Watchdog Timer ON Table 2-12 Power on Setting (S3) FunctionSW State FunctionS4 Short GPJ[4:0] used as GPIO pinS4Open GPJ[4:0] used as JTAG ICEinterfaceTable 2-13 Power on Setting (S4) FunctionSW State FunctionS5 Short UART0 debug message ONS5 Open UART0 debug message OFFTable 2-14 Power on Setting (S5) FunctionSW State FunctionS7/S6 Short/Short NAND Flash page size 2KBS7/S6 Short/Open NAND Flash page size 4KBS7/S6 Open/Short NAND Flash page size 8KBNUMAKER-HMI-N9H30 USER MANUALS7/S6 Open/Open IgnoreTable 2-15 Power on Setting (S7/S6) FunctionSW State FunctionS9/S8 Short/Short NAND Flash ECC type BCH T12S9/S8 Short/Open NAND Flash ECC type BCH T15S9/S8 Open/Short NAND Flash ECC type BCH T24S9/S8 Open/Open IgnoreTable 2-16 Power on Setting (S9/S8) FunctionCMOS Sensor connector (CON9, SW9~10)–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11).–SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensorconnector (CON9).Connector GPIO pin of N9H30 FunctionCON9.1 - VSSCON9.2 - VSSCON9.3 - Power 3.3VCON9.4 - Power 3.3V NUMAKER-HMI-N9H30 USER MANUALCON9.5 - -CON9.6 - -CON9.7 GPI4 S_PCLKCON9.8 GPI3 S_CLKCON9.9 GPI8 S_D0CON9.10 GPI9 S_D1CON9.11 GPI10 S_D2CON9.12 GPI11 S_D3CON9.13 GPI12 S_D4CON9.14 GPI13 S_D5CON9.15 GPI14 S_D6CON9.16 GPI15 S_D7CON9.17 GPI6 S_VSYNCCON9.18 GPI5 S_HSYNCCON9.19 GPI0 S_PWDNCON9.20 GPI7 S_nRSTCON9.21 GPG2 I2C1_CCON9.22 GPG3 I2C1_DCON9.23 - VSSCON9.24 - VSSTable 2-17 CMOS Sensor Connector (CON9) Function●CAN_0 Selection (CON11, SW9~10):–SW9~10: 1-2 short for CAN_0 function and connected to 2P terminal (CON11) –SW9~10: 2-3 short for CMOS sensor function and connected to CMOS sensor connector (CON9, CON10)SW GPIO pin of N9H30 FunctionSW9:1-2 shortGPI3 CAN_0_RXDSW9:2-3 short S_CLKSW10:1-2 shortGPI4 CAN_0_TXDSW10:2-3 short S_PCLKTable 2-18 CAN_0 (SW9~10) Function●USB0 Device/HOST Micro-AB connector (CON14), where CON14 pin4 ID=1 is Device,ID=0 is HOST●USB1 for USB HOST with Type-A connector (CON15)●RJ45_0 connector with LED indicator (CON12), RMII PHY with IP101GR (U14)●RJ45_1 connector with LED indicator (CON13), RMII PHY with IP101GR (U16)●Micro-SD/TF card slot (CON3)●SOC CPU: Nuvoton N9H30F61IEC (U5)●Battery power for RTC 3.3V powered (BT1, J1), can detect voltage by ADC0●RTC power has 3 sources:–Share with 3.3V I/O power–Battery socket for CR2032 (BT1)–External connector (J1)●Board version 2.1NUMAKER-HMI-N9H30 USER MANUAL2.3 NuDesign-TFT-LCD7 -Front ViewFigure 2-3 Front View of NuDesign-TFT-LCD7 BoardFigure 2-3 shows the main components and connectors from the Front side of NuDesign-TFT-LCD7board.7” resolution 800x480 4-W resistive touch panel for 24-bits RGB888 interface2.4 NuDesign-TFT-LCD7 -Rear ViewFigure 2-4 Rear View of NuDesign-TFT-LCD7 BoardFigure 2-4 shows the main components and connectors from the rear side of NuDesign-TFT-LCD7board.NuMaker-N9H30 and NuDesign-TFT-LCD7 combination connector (CON1).NUMAKER-HMI-N9H30 USER MANUAL 2.5 NuMaker-N9H30 and NuDesign-TFT-LCD7 PCB PlacementFigure 2-5 Front View of NuMaker-N9H30 PCB PlacementFigure 2-6 Rear View of NuMaker-N9H30 PCB PlacementNUMAKER-HMI-N9H30 USER MANUALFigure 2-7 Front View of NuDesign-TFT-LCD7 PCB PlacementFigure 2-8 Rear View of NuDesign-TFT-LCD7 PCB Placement3 NUMAKER-N9H30 AND NUDESIGN-TFT-LCD7 SCHEMATICS3.1 NuMaker-N9H30 - GPIO List CircuitFigure 3-1 shows the N9H30F61IEC GPIO list circuit.Figure 3-1 GPIO List Circuit NUMAKER-HMI-N9H30 USER MANUAL3.2 NuMaker-N9H30 - System Block CircuitFigure 3-2 shows the System Block Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-2 System Block Circuit3.3 NuMaker-N9H30 - Power CircuitFigure 3-3 shows the Power Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-3 Power Circuit3.4 NuMaker-N9H30 - N9H30F61IEC CircuitFigure 3-4 shows the N9H30F61IEC Circuit.Figure 3-4 N9H30F61IEC CircuitNUMAKER-HMI-N9H30 USER MANUAL3.5 NuMaker-N9H30 - Setting, ICE, RS-232_0, Key CircuitFigure 3-5 shows the Setting, ICE, RS-232_0, Key Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-5 Setting, ICE, RS-232_0, Key Circuit3.6 NuMaker-N9H30 - Memory CircuitFigure 3-6 shows the Memory Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-6 Memory Circuit3.7 NuMaker-N9H30 - I2S, I2C_0, RS-485_6 CircuitFigure 3-7 shows the I2S, I2C_0, RS-486_6 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-7 I2S, I2C_0, RS-486_6 Circuit3.8 NuMaker-N9H30 - RS-232_2 CircuitFigure 3-8 shows the RS-232_2 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-8 RS-232_2 Circuit3.9 NuMaker-N9H30 - LCD CircuitFigure 3-9 shows the LCD Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-9 LCD Circuit3.10 NuMaker-N9H30 - CMOS Sensor, I2C_1, CAN_0 CircuitFigure 3-10 shows the CMOS Sensor,I2C_1, CAN_0 Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-10 CMOS Sensor, I2C_1, CAN_0 Circuit3.11 NuMaker-N9H30 - RMII_0_PF CircuitFigure 3-11 shows the RMII_0_RF Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-11 RMII_0_PF Circuit3.12 NuMaker-N9H30 - RMII_1_PE CircuitFigure 3-12 shows the RMII_1_PE Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-12 RMII_1_PE Circuit3.13 NuMaker-N9H30 - USB CircuitFigure 3-13 shows the USB Circuit.NUMAKER-HMI-N9H30 USER MANUALFigure 3-13 USB Circuit3.14 NuDesign-TFT-LCD7 - TFT-LCD7 CircuitFigure 3-14 shows the TFT-LCD7 Circuit.Figure 3-14 TFT-LCD7 CircuitNUMAKER-HMI-N9H30 USER MANUAL4 REVISION HISTORYDate Revision Description2022.03.24 1.00 Initial version NUMAKER-HMI-N9H30 USER MANUALNUMAKER-HMI-N9H30 USER MANUALImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, anymalfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomicenergy control instruments, airplane or spaceship instruments, the control or operation ofdynamic, brake or safety systems designed for vehicular use, traffic signal instruments, all typesof safety devices, and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claimsto Nuvoton as a result of customer’s Insecure Usage, custome r shall indemnify the damagesand liabilities thus incurred by Nuvoton.。

SecuGen 指纹识别设备说明书

SecuGen 指纹识别设备说明书

Hamster™ IVSecuGen Hamsters are the industry’s most accurate, rugged, and affordable USB fingerprint readers. T hese h igh-performance, v ersatile r eaders f eature a dvanced o ptical s ensors e ngineered with patented SEIR™ technology to give you the highest quality in fingerprint biometrics.Features• Accurate, patented optical USB fingerprint sensor with 508 DPI resolution• Auto-On TM to automatically detect the presence of a finger when placed on the reader• Smart Capture TM for reliable scanning of dry, moist, aged, scarred and difficult-to-scan fingers • Hardened optical glass platen that is scratch, impact, corrosion and electrostatic shock resistant • Compact and ergonomic design works with any finger or thumb • Integrated finger guide and removable, weighted stand • Supports BioAPI, INCITS 378-2004 and ISO 19794• Supports SecuGen proprietary, 3rd party and MINEX Certified Template Extractor and Matcher algorithms • Supports FIPS 201, FBI Certified as “PIV Single Finger Capture Device” and STQC Certified for UIDBenefits of Using SecuGen ReadersReduced password reset requests, decreased risk of security breaches, and improved accountability, all in a convenient and intuitive method for almost any user. Easy to install and use with software applications requiring fingerprint authentication that lets your fingerprints act like digital passwords that cannot be lost, forgotten or stolen.Consistent performance and security for a growing number of applications, with support for a wide range of operating systems, computing environments, and U.S. and international biometric standards.Backed by the industry’s best quality guarantee and over a decade of field use and proven performance under extreme conditions. This helps avoid the cost and inconvenience of replacing damaged units made by other sensor manufacturers.STQC CertifiedFBI CertifiedSpecificationsWhat’s Inside a Hamster?At the heart of the Hamster readers are SecuGen’s next-generation fingerprint sensors with advanced features including:• Auto-On™ that automatically detects the presence of a finger when placed on the reader for quick and easy authentication 1• Smart Capture ™ that captures high qualityfingerprints from dry, moist, aged, scarred and difficult-to-scan fingers for greater accuracy and reliability 1• High durability and ruggedness with provenresistance to electrostatic shock, impact, drops, scratches, extreme temperatures, humidity, and contaminants such as sweat, dirt, and oil• Patented optical technologies for clear, accurate image quality with high contrast, high signal-to-noise ratio, and practically no distortion using Surface Enhanced Irregular Reflection (SEIR™)• Reliable performance even under challenging conditions and tough environments• Rejection of false fingerprints such as latent prints and 2-D fingerprint images such as photocopies 2• Fingerprint data protection with templates that cannot be used to reconstruct fingerprint images 2• Greater sensor-to-sensor consistency for high accuracy when matching fingerprints enrolled with different fingerprint readers at different locations • Ease of integration into many types of applications using a wide offering of free Software Developer Kits • Multi-Device Connectivity™ that allows multiple fingerprint readers to be connected to one computer at the same time 2• Device Recognition™ that uses a programmable internal serial number to identify and differentiate multiple fingerprint readers 31 Auto-On and Smart Capture are built into the sensor but need to be enabled by the software application that calls for a fingerprint scan.2 Feature dependent upon software application used 3Option available with SecuGen SDKsProduct Name Model NumberFingerprint Sensor Optic Module Image Resolution Image Size Platen SizeEffective Sensing Area Image GrayscaleLight Source / Typical Lifetime Fingerprint Capture Speed Electrical / Communication InterfaceSupply VoltageCurrent Consumption (max)PhysicalDimensions (W x L x H) WeightCable LengthOperating Temperature Operating Humidity Other WarrantySupported Standards ComplianceSupported Operating SystemsHamster IV HSDU04P , HFDU04SDU04P , FDU04508 DPI258 x 336 pixels 16.1 mm x 18.2 mm 12.9 mm x 16.8 mm 256 levels (8-bit)LED / 60,000 hours0.2 ~ 0.8 sec with Smart Capture (HSDU04P)0.4 ~ 1.2 sec with Smart Capture (HFDU04)USB 1.1 Full-Speed, USB 2.0 Hi-Speed 5 V DC (via USB)150 mA27 x 40 x 73 mm (without stand)53 x 73 x 84 mm (with stand)100 g (without stand)165 g (with stand)1500 mm -20o ~ 65o C90% or less RH, noncondensing One year limitedANSI INCITS 378, BioAPI, FIPS 201, ISO/IEC 19794-2, ISO/IEC 19794-4FCC, CE, RoHS, FBI PIV Single Finger, STQC Windows 7, Vista, XP , 2000, 9x Windows Server 2008 R2, 2003Android (HSDU04P), Java, Linux© 2013 SecuGen Corp. All rights reserved. SecuGen, SecuGen Hamster, Auto-On, Device Recognition, HSDU04P , Multi-Device Connectivity, Open the World with Your Fingertip!, SDU04P , SEIR and Smart Capture are trademarks or registered trademarks of SecuGen Corporation in the United States and/or other countries. Other company, product, and service names may be trademarks or service marks of others. Product specifications and availability are subject to change without notice. (03/13)Open the World with Your Fingertip!®。

蓝牙模块AT指令集

蓝牙模块AT指令集

下行命令 3:查询帮助信息
下行命令 AT+HELP
Command
电话:0755-26509941
应答
Description
网址:
参数 无
Page 2 of 20
博陆科电子BLK-MD-BC04-B蓝牙模块AT指令集
-----------------------------------------------------------------
到的设备(如果设置 000000
则返回所有搜索到的设备)
默认:001f00,000000
为了能有效地对周围诸多蓝牙设备实施过滤,并快速查询或被查询自定义蓝牙设备,用
户可以将模块设置为非标准蓝牙设备类型,如 001f00(十六进制)。
下行命令 10:查询/设置——模块 SPP 主从模式
下行命令
应答
参数
+INQM=<Para1>,<Para2>,<Para3 >
1.+INQM=<Para1>,<Para2>,<Para 3> OK——成功 2.ERROR=<Error_Code> — — 失 败
<Para1>:查询模式 0:inquiry_mode_standard 1:inquiry_mode_rssi 2:inquiry_mode_eir 长度:1 字节 <Para2>:最多蓝牙设备响应 数 长度:2 字节
wwwbolutekcnpage1420106主从模式设置长度超过1字节107连接模式长度超过1字节108设置绑定地址长度错误109设置iac长度超过6字节110设置inqm长度错误111设置自动查询长度超过1字节112设置自动连接长度超过1字节113设置senm长度错误114设置ipscan长度错误115设置sniff长度错误116设置lowpower长度错误117connect连接命令输入地址码长度错误118设置uartmode长度错误119设置enableind长度错误121设置removepdl长度错误201波特率参数超出范围1202设备类型cod输入值错误203取远程设备名地址码值错误204主从模式设置值错误205连接模式设置值错误206取远程设备名地址码值错误207设置绑定地址值错误208设置iac值输入错误209设置inqm值输入错误210设置自动查询值错误211设置自动连接值错误212设置senm值输入错误213设置ipscan值输入错误214设置sniff值输入错误215设置lowpower值输入错误216connect连接命令输入地址码值错误217设置uartmode值错误218设置enableind值错误220设置supervision值错误301iac值不在正常范围0x9e8b000x9e8b33302该命令只支持主模式303inquriy命令只能在ready状态下有效304取消inquiry命令只能在inquiring状态下有效305connect连接命令只能在ready状态下有效博陆科电子blkmdbc04b蓝牙模块at指令集电话

卡巴斯基ksc9.0如何制作跳过检测不兼容的独立安装包

卡巴斯基ksc9.0如何制作跳过检测不兼容的独立安装包

制作跳过检测不兼容程序的独立安装包
1.在ksc安装文件下找到反病毒的安装文件夹如:ksc9.0/sever/packages/KES 8.1.0.646.
2.修改描述文件:
首先,从光盘中复制kes8的安装程序到本地计算机。

使用写字板打开kes8in.kud 文件。

在[Setup]节点中Params一项原有参数后新增加/pSKIPPRODUCTCHECK=1
/pSKIPPRODUCTUNINSTALL=1 。

然后使用另存为,将文件保存为Unicode文档。

最后修改保存后的文档扩展名为kud。

这里包括kes8.1.0.646下的kes8win.kud文件,还包括“exec”文件夹下的kes8win.kud
首先用写字板打开kes8win.kud
修改之后另存为:
保存之后,将原文件kes8win.kud删除,在将kes8win.txt改成后缀名kud即kes8win.kud 3.通过管理工具制作新的安装包
通过安装包创建向导创建新的安装包,选择描述文件时选之前修改的描述文件,按照提示完成安装包创建。

3.1在ksc新建安装包
3.2输入新你安装包名称点下一步
3.3为程序选择安装文件,点浏览选择kes8win.kud文件,点击打开
3.4默认,点下一步下一步
4
4.创建独立安装包
选择创建完成的安装吧,右键菜单中选择创建独立安装包,根据向导完成创建。

Android手机,正品验证、自检代码

Android手机,正品验证、自检代码

需要注意的是,以下部分代码要谨慎使用,因为有些代码可能令手机失去原有功能。

此外因为ROM作者会修改一部分ROM内容,所以有些代码在刷有第三方ROM(或手机厂家自定制优化系统)的手机上可能无效,请确认您了解代码作用描述的具体意思之后再进行操作,并请您自行承担操作所带来的一切结果。

*#*#4636#*#*
显示手机信息、电池信息、电池记录、使用统计数据、WiFi 信息
*#*#7780#*#*
重设为原厂设定(不会删除预设程序,及SD卡档案)
*2767*3855#
重设为原厂设定(会删除SD 卡所有档案)
*#*#34971539#*#*
显示相机相机韧体版本,或更新相机韧体
*#*#7594#*#*
当长按关机按钮时,会出现一个切换手机模式的窗口,包括:静音模式、飞航模式及关机,您可以用以上代码,让其直接变成关机按钮
*#*#273283*255*663282*#*#*
开启一个能让您备份媒体文件的地方,例如相片、声音及影片等
*#*#197328640#*#*
启动服务模式,可以测试手机部分设置,及更改设定WLAN、GPS
及蓝牙测试的代码
*#*#232339#*#* 或*#*#526#*#* 或 *#*#528#*#*
WLAN 测试
*#*#232338#*#*显示WiFi MAC 地址*#*#1472365#*#*
GPS 测试
*#*#1575#*#*
其它GPS 测试
*#*#232331#*#*
蓝牙测试
*#*#232337#*#
显示蓝牙装置地址
*#*#8255#*#*
启动GTalk 服务监视器。

HTC G14两种root方法及可删除软件

HTC G14两种root方法及可删除软件

root方法一:1、下载su-2[1].3.6.3-efgh-signed复制到SD卡根目录2、重启手机,直到全部黑屏后,快速按住【音量-】和【开机电源键】,几秒后,进入HBOOT模式。

3、此时按音量向下键选择到RECOVERY 再按电源键!就会进入RECOVERY恢复模式了!4、按菜单键向下选择到install zip from sdcard (从SD卡安装ZIP) ,按搜索键,确认!5、在按一次搜索键确认进入到choose zip fromt sdcard (从SD卡选择ZIP)6、再选择到su-2.3.6.3-efgh-signed.zip,按搜索键,确认!7、选择到Yes - Install su-2.3.6.3-efgh-signed.zip 按搜索键,确认!8、看到界面上出现Install complete.Enjoy! 和Install from sdcard complete时,说明刷完成!9、按返回键,返回到主界面,reboot system now (现在重启系统)按搜索键,确认!10、ROOT完毕!进入系统,装一些需要ROOT权限的软件,如R.E管理器之类的吧,挂载权限之后,你可以顺意删除你不喜欢的程序了!root方法二:1、关机状态按住音量下键和电源键进入hboot界面(此时会自动检查SD卡里的更新文件) 不能进HBOOT界面的先按如下方法设置先开机状态2.2版本设置->应用程序->快速启动(取消勾选)2.3版本设置->电源->快速启动(取消勾选)再关机状态-按住音量下键和电源键,等待几秒钟我们熟悉的HBoot界面就出来了2、此时界面跳转到等待提示是否更新recovery(此过程是自动进行的)用音量上键确定更新此更新过程很快几秒钟就OK了,然后提示重新启动,按电源键重启正常进入系统。

进入系统后,将PG58IMG.zip删除或重命名。

测试进入刚刷好的recovery(再次进入hboot界面,用音量下键选择Recovery,再按电源键确认就进入Recovery界面了)OK,至此刷recovery完成!==============================================================附recovery里各按键的功能介绍音量键,控制进行上下选择电源键,为确定音量下+电源键,重启手机音量上+电源键,关闭recovery界面的字符串显示附:Recovery 各菜单中英文对照表(V2.5版本有八个选项主菜单,每个主菜单中都有下一级菜单)-reboot system now 重启系统-apply sdcard:update.zip 使用SD卡根目录的update.zip更新系统-wipe data/factory reset 清空data分区并恢复出厂设置-wipe cache partition 清空cache分区-install zip from sdcard 从SDcard选择文件更新系统--apply sdcard:update.zip 使用SD卡根目录的update.zip 更新系统--choose zip from sdcard 从SD卡选择zip格式升级包--toggle signature verification 切换签名验证--toggle script asserts 切换升级脚本检查-backup & restore 备份和恢复--Backup 备份--Restore 恢复--Advanced Restore 高级恢复-mounts & storage 挂载和存储--mount /system 挂载/system分区(系统分区)--mount /data 挂载/data分区(数据分区)--mount /cache 挂载/cache分区(缓存分区)--mount /sd-ext 挂载/sd-ext分区(A2SD分区)--format boot 格式化内核分区--format system 格式化系统分区--format data 格式化数据分区--format cache 格式化缓存分区--format sdcard 格式化存储卡--format sd-ext 格式化内存卡SD--mount USB storage 挂载SD卡为U盘模式--Unmount 卸载-advanced 高级--Reboot Recovery 重启Recovery--Wipe Dalvik Cache 清空Dalvik缓存--Wipe Battery Stats 清空电池状态--Report Error 报告错误--Key Test 键位测试--Partition SD Card 对SD卡分区--Fix Permissions 修复权限【ROOT】下载文件"HTC_Sensation_Root.zip"放到SD卡根目录(之前卡里的"PG58IMG.zip"要先删除掉或放到其他文件夹)HTC_Sensation_Root.zip (289.79 KB)接着按如下步骤操作:1、关机按住音量下和电源键开机进hboot界面用音量下键选择RECOVERY 按电源键确定进入2、按下电源键后会自动重起进入recovery界面用音量下键选择install zip from sdcard(中文版:选择从SD卡更新)按下电源键3、再选择choose zip from sdcard (中文版:从SD卡选择文件)按下电源键4、选择HTC_Sensation_Root.zip 按下电源键确定下5、选择Yes-Install HTC_Sensation_Root.zip(中文版:开始安装刷写ROOT文件)按下电源键确定开始ROOT6、整个ROOT过程很快,几秒就OK了ROOT完成后选择+++++GO BacK+++++回到recovery第一界面,选择"reboot system now(中文版:重启)" 按电源键确定,这时手机自动重起ROOT完成.现在可以随意刷第三方ROM了(也可删除系统自带软件和安装带ROOT权限的软件)自带程序列表AccountSyncManager 账户同步管理(同步要用到的,建议别删)AdobeReader 电子阅读器(可以删除)AlarmClock.apk 闹钟(可以删除)ApplicationsProvider 应用程序信息存储器(不能删除)AppSharing 应用程序共享(可以删除)BlackBoard 黑板皮肤(自带皮肤,可以删除,建议别删)Bluetooth 蓝牙(不能删除)BrcmBluetoothServices 蓝牙服务(不能删除)Browser 自带浏览器(不能删除)Bugreport Bug报告(可以删除)Calculator 计算器(可以删除,建议别删)Calendar 谷歌日历(可以删除,建议别删)CalendarProvider 谷歌日历储存器(可以删除,建议别删)CertInstaller 证书安装器(不能删除)CheckinProvider 签入服务(不能删除)Clicker 键盘校准(不能删除)com.amazon.mp3 亚马逊音乐(可以删除)com.htc.FMRadioWidget 桌面收音机插件(插件类都可以删除)com.htc.FriendStreamWidget 好友流小插件(插件类都可以删除)com.htc.MusicWidget 桌面音乐插件(插件类都可以删除)com.htc.PlurkWidget 桌面Plurk插件(插件类都可以删除)com.htc.StockWidget 桌面股票插件(插件类都可以删除)com.htc.TwitterWidget 桌面Twitter插件(插件类都可以删除)com.htc.WeatherWidget 桌面天气插件(插件类都可以删除)ContactsProvider 存储联系人信息(不能删除)CSPeopleSyncServiceCustomizationSettingsProvider 自定义设置服务(不能删除)CustomizationSetup 自定义设置(不能删除)DCSImpl 集散控制系统服务(不能删除)DCSStock 股票后台传输程序(不用股票可以删除)DCSUtility 集散控制系统公共程序组件(不能删除)DebugTool 调试工具(不能删除)DefaultContainerService apk安装服务(不能删除)DownloadProvider 下载管理器(不能删除)DreyeAndroidHTC Dr.eye英语字典(可以删除)DrmProviderDRM 受数字版权保护的数据存储服务(不能删除)Email 电子邮件客户端(可以删除)EReaderLibrary 阅读器(可以删除)EReaderViewer 阅读器(可以删除)EReaderWidget 阅读器挂件(可以删除)FieldTest 测试程序(不能删除)FilePicker 文件定位(不能删除)Flashlight 手电筒(可以删除,建议别删)Flickr Flickr应用(国内无法使用,可以删除)FriendStream htc主推的社交推送软件,可以聚合Facebook,twitter等(可以删除)GDataFeedsProvider GoogleData提供(可以删除)GenieWidget 天气与新闻(可以删除)Gmail (可以删除,建议别删)GmailProvider Gmail提供(可以删除,建议别删)GoogleApps 谷歌程序包(包括下面的关于Google的一些列软件,不用Google的(可以删除,使用的建议别删)GoogleBackupTransport 谷歌备份传输(可以删除,建议别删)GoogleCalendarSyncAdapter 谷歌日历同步适配器(可以删除)GoogleContactsSyncAdapter 谷歌联系人同步适配器(可以删除)GoogleFeedback 谷歌反馈(可以删除)GooglePartnerSetup Google助手(可以删除,建议别删)GoogleQuickSearchBox 谷歌搜索(可以删除,建议别删)GoogleServicesFramework 谷歌同步支持服务框架(可以删除,建议别删)GoogleSearch 搜索工具(可以删除,建议别删)GSD 函数测试程序(不能删除)gtalkservice GTalk服务(可以删除)HTC_IME 英文输入法(不能删除)HtcAddProgramWidget 向桌面添加程序的插件(不能删除)HTCAlbum HTC自带相册(可以删除,建议别删)HtcAutoRotateWidget 自动旋转开关(不能删除)HtcBackgroundDataWidget 后台数据(不能删除)htcbookmarkwidget HTC 桌面标签插件(可以删除)HtcCalculatorWidget 计算机插件(可以删除)htccalendarwidgets HTC日历桌面插件(可以删除,建议别删)HTCCamera 照相机(不能删除)HtcClockWidget 闹钟插件(可以删除)HtcCompressViewer (可以删除)HtcContacts 联系人(不能删除)htccontactwidgets HTC联系人插件(可以删除,建议别删)HtcCopyright HTC相关服务(不能删除)HtcDataRoamingWidget (可以删除,建议别删)HtcDataStripWidget 数据控制台插件(可以删除,建议别删)HtcDialer 拨号(不能删除)HtcDirect htc hub(可以删除)HtcDirectDownloadsProvider (不用htc hub可以删除)HtcDLNAMiddleLayer Wifi相关(不能删除)HtcDMCHtcFacebook Facebook(可以删除)HtcFMRadio 调频立体声(可以删除,建议别删)HtcGreader 新闻(可以删除)HtcGreaderWidget 新闻插件(可以删除)HtcImageWallpaper 壁纸(不能删除)HtcLaputa HTC自带导航软件(可以删除)HtcLaputaInstaller HTC自带导航软件(可以删除)HtcLaputaWidget HTC自带导航软件桌面插件(可以删除)HtcLocationService 定位服务(不能删除)HtcLockScreen HTC锁屏(不能删除)htcmailwidgets HTC Mail插件(可以删除)HtcMessageCS (不能删除)HtcMessageUploader (不能删除)htcmsgwidgets 短消息插件(可以删除,建议别删)HtcMusic HTC自带音乐(可以删除,建议别删,因为有杜比音效和srs)HtcMusicMarkedItems HTC自带音乐相关网上商店(可以删除,建议别删)HtcPhotoWidget 图片插件(可以删除,建议别删)HtcPlurk Plurk(可以删除)HtcPowerStripWidget 电源控制台插件(可以删除,建议别删)HtcProfileWidget 选择声音或震动插件(可以删除,建议别删)HtcPushMedia 媒体播送,输出到播放器的媒体(可以删除)HtcRecommends 只有几个软件的类似商店的东西(可以删除)HtcRecommendsWidget 同上的插件(可以删除)HtcRingtoneTrimmer 铃声剪辑(可以删除)HtcRingtoneWidget 选择铃声的插件(可以删除)HtcScreenBrightnessWidget 调节屏幕亮度插件(可以删除)HtcScreenTimeoutWidget 调节屏幕延时插件(可以删除)HtcSettingsProvider HTC设置(不能删除)htcsettingwidgets HTC设置插件,WIFI、移动网络、GPS、飞行模式、蓝牙的开关(可以删除,建议别删)HTCSetupWizard HTC安装向导(不能删除)HtcSoundRecorder 录音(可以删除,建议别删)HtcSoundSetDownloadManager 在设置/声音中选择铃声和通知音等(不能删除)HtcStreamPlayer 流媒体播放器(可以删除,建议别删)HtcSyncwidget HTC同步插件(可以删除)HtcTipWidget 操作提示插件(可以删除)HtcTwitter Twitter(可以删除)HtcWeatherWallpaper HTC天气壁纸(不能删除)HTC_IME 输入法(可以删除)HTMLViewer HTML浏览器(可以删除)install_flash_player flash插件(不能删除)IM 即使通讯组件包含MSN、yahoo通(可以删除)ImCredentialProvider (可以删除)ImProvider (可以删除)Jbed JAVA模拟器(可以删除)Launcher 开机向导(不能删除)LiveWallpapers 动态墙纸(不能删除)LiveWallpapersPicker 动态墙纸(不能删除)LocationPickerLaputa 资讯与天气(可以删除)MagicSmokeWallpapers 魔幻烟雾壁纸(不能删除)Mail (可以删除,建议别删)Maps (可以删除,建议别删)MarketUpdater 市场软件更新(不能删除)MediaProvider 媒体数据存储服务(不能删除)MediaUploader Google媒体数据上传服务(可以删除,建议别删)MessageTabPluginMetal 金属皮肤(自带皮肤,可以删除,建议别删)Mms 信息(不能删除)Mode10Wallpapers htc提供的壁纸软件(不能删除)MyHTC (可以删除,建议别删)MyFaves T-Mobile MyFaves程序(可以删除)NetworkLocation 谷歌网络定位服务(不能删除)OnlineAssetDetails 和HTC Link相关的,查看HTC线上详细信息(可以删除,建议别删)PackageInstaller APK安装程序(不能删除)PCSCII PC同步(不能删除)Phone 电话(不能删除)PicoTts 文字语音转换引擎(设置-语音输入与输出中)(不能删除)PluginManager Sense插件管理(不能删除)QuickLookup 快速查阅,维基百科搜索(可以删除,建议别删,很好用)Quickoffice office软件的阅读(可以删除,建议别删)QxdmLog 电话相关(不能删除)restartapp Restart应用(不能删除)Rosie 桌面的主程序(不能删除)SearchAnywhere 任意搜索的应用(可以删除,建议别删,很有用)SearchAnywhereWidget 任意搜索的应用插件(可以删除,建议别删,很有用)Settings 系统设置(不能删除)SettingsProvider 设置服务(不能删除)SetupWizard Google的设置向导(不能删除)SkinPicker 皮肤类的程序(不能删除)Slate 主题类的程序(不能删除)Stk SIM卡服务(不能删除)Stock 股票程序(可以删除)Street google街景(可以删除)Sync 同步程序(不能删除)Talk GTALK(GTALK主程序,其gtalkservice.apk和ImProvider.apk才是服务程序,删除这个服务后market无法下载)(可以删除)Teeter 自带重力球游戏(可以删除)TelephonyProvider 拨号记录存储服务(不能删除)TransferData 数据传输(可以删除,建议别删)TtsService 文本到语音服务(不能删除)Updater 程序更新器(不能删除)UpgradeSetup 更新程序(不能删除)UploadProvider HTC 媒体上传器(不能删除)UserDictionaryProvider 用户字典(可以删除)Vending 电子市场(可以删除)VisualizationWallpapers 动态音乐背景自带墙纸(不能删除)VoiceDialer 语音拨号器(可以删除,建议别删)VoiceSearch 语音搜索(可以删除,建议别删)***Services 虚拟专用网服务***代理(不能删除)Weather 天气组件(可以删除,建议别删)WeatherAgentService 天气组件(可以删除,建议别删)WeatherProvider 天气组件(可以删除,建议别删)WeatherSyncProvider 天气组件(可以删除,建议别删)Wifi r outer wifi路由(不能删除)Wood 木板皮肤(自带皮肤,可以删除,建议别删)WorldClock 世界时钟(可以删除,建议别删)YouTube Youtube视频(可以删除)。

FPGA可编程逻辑器件芯片XCZU15EG-2FFVB1156E中文规格书

FPGA可编程逻辑器件芯片XCZU15EG-2FFVB1156E中文规格书

Zynq UltraScale+ MPSoCsA comprehensive device family, Zynq UltraScale+ MPSoCs offer single-chip, all programmable,heterogeneous multiprocessors that provide designers with software, hardware, interconnect, power, security, and I/O programmability. The range of devices in the Zynq UltraScale+MPSoC family allows designers to target cost-sensitive as well as high-performance applications from a single platform using industry-standard tools. While each Zynq UltraScale+MPSoC contains the same PS, the PL, Video hard blocks, and I/O resources vary between the devices.•Automotive: Driver assistance, driver information, and infotainment•Wireless Communications: Support for multiple spectral bands and smart antennas•Wired Communications: Multiple wired communications standards and context-aware network services •Data Centers: Software Defined Networks (SDN), data pre-processing, and analytics •Smarter Vision: Evolving video-processing algorithms, object detection, and analytics•Connected Control/M2M: Flexible/adaptable manufacturing, factory throughput, quality, and safetyThe UltraScale MPSoC architecture provides processor scalability from 32 to 64 bits with support for virtualization, the combination of soft and hard engines for real-time control, graphics/video processing, waveform and packet processing, next-generation interconnect and memory, advanced powermanagement, and technology enhancements that deliver multi-level security, safety, and reliability. Xilinx offers a large number of soft IP for the Zynq UltraScale+MPSoC family. Stand-alone and Linux device drivers are available for the peripherals in the PS and the PL. Xilinx’s Vivado® Design Suite, SDK™, and PetaLinux development environments enable rapid product development for software, hardware, and systems engineers. The Arm-based PS also brings a broad range of third-party tools and IP providers in combination with Xilinx's existing PL ecosystem.The Zynq UltraScale+MPSoC family delivers unprecedented processing, I/O, and memory bandwidth in the form of an optimized mix of heterogeneous processing engines embedded in a next-generation, high-performance, on-chip interconnect with appropriate on-chip memory subsystems. Theheterogeneous processing and programmable engines, which are optimized for different application tasks, enable the Zynq UltraScale+ MPSoCs to deliver the extensive performance and efficiency required to address next-generation smarter systems while retaining backwards compatibility with the original Zynq-7000 All Programmable SoC family. The UltraScale MPSoC architecture also incorporates multiple levels of security, increased safety, and advanced power management, which are critical requirements of next-generation smarter systems. Xilinx’s embedded UltraFast™ design methodology fully exploits the Table 7:Zynq UltraScale+ MPSoC Device FeaturesCG DevicesEG DevicesEV DevicesAPU Dual-core Arm Cortex-A53Quad-core Arm Cortex-A53Quad-core Arm Cortex-A53RPU Dual-core Arm Cortex-R5Dual-core Arm Cortex-R5Dual-core Arm Cortex-R5GPU –Mali-400MP2Mali-400MP2VCU––H.264/H.265找FPGA 和CPLD 可编程逻辑器件,上深圳宇航军工半导体有限公司ASIC-class capabilities afforded by the UltraScale MPSoC architecture while supporting rapid system development.The inclusion of an application processor enables high-level operating system support, e.g., Linux. Other standard operating systems used with the Cortex-A53 processor are also available for theZynq UltraScale+MPSoC family. The PS and the PL are on separate power domains, enabling users to power down the PL for power management if required. The processors in the PS always boot first, allowing a software centric approach for PL configuration. PL configuration is managed by software running on the CPU, so it boots similar to an ASSP.Programmable LogicThis section covers the information about blocks in the Programmable Logic (PL).Device LayoutUltraScale architecture-based devices are arranged in a column-and-grid layout. Columns of resources are combined in different ratios to provide the optimum capability for the device density, target market or application, and device cost. At the core of UltraScale+MPSoCs is the processing system that displaces some of the full or partial columns of programmable logic resources. Figure 1 shows a device-level view with resources grouped together. For simplicity, certain resources such as the processing system, integrated blocks for PCIe, configuration logic, and System Monitor are not shown.Resources within the device are divided into segmented clock regions. The height of a clock region is 60CLBs. A bank of 52 I/Os, 24 DSP slices, 12 block RAMs, or 4 transceiver channels also matches the height of a clock region. The width of a clock region is essentially the same in all cases, regardless of device size or the mix of resources in the region, enabling repeatable timing results. Each segmented clock region contains vertical and horizontal clockrouting that span its full height and width. These horizontal and vertical clock routes can be segmented at the clock region boundary to provide a flexible, high-performance, low-power clock distribution architecture. Figure 2 is a representation of a device divided into regions.Figure 1:Device with Columnar ResourcesFigure 2:Column-Based Device Divided into Clock RegionsHigh-Speed Serial TransceiversUltra-fast serial data transmission between devices on the same PCB, over backplanes, and across even longer distances is becoming increasingly important for scaling to 100Gb/s and 400Gb/s line cards. Specialized dedicated on-chip circuitry and differential I/O capable of coping with the signal integrity issues are required at these high data rates.Three types of transceivers are used in Zynq UltraScale+ MPSoCs: GTH, GTY, and PS-GTR. All transceivers are arranged in groups of four, known as a transceiver Quad. Each serial transceiver is a combined transmitter and receiver. Table 10 compares the available transceivers.The following information in this section pertains to the GTH and GTY only.The serial transmitter and receiver are independent circuits that use an advanced phase-locked loop (PLL) architecture to multiply the reference frequency input by certain programmable numbers between 4 and 25 to become the bit-serial data clock. Each transceiver has a large number of user-definable features and parameters. All of these can be defined during device configuration, and many can also be modified during operation.Table 10:Transceiver InformationZynq UltraScale+ MPSoCsType PS-GTRGTH GTY Qty40–440–28Max. Data Rate 6.0Gb/s 16.3Gb/s 32.75Gb/s Min. Data Rate1.25Gb/s0.5Gb/s0.5Gb/sApplications•PCIe Gen2•USB•Ethernet•Backplane •HMC•100G+Optics •Chip-to-Chip •25G+Backplane •HMC。

Silicon Labs CP210x USB-to-UART Bridge 产品更换指南说明书

Silicon Labs CP210x USB-to-UART Bridge 产品更换指南说明书

AN976: CP2101/2/3/4/9 to CP2102N Porting GuideThe CP2102N USB-to-UART bridge device has been designed tobe a replacement and upgrade for existing single-interface CP210x USB-to-UART devices.For some devices, such as the CP2102 and CP2104, the CP2102N is virtually a drop-in replacement. Apart from the addition of two resistors, no other hardware or software changes are required to use the CP2102N in existing designs. For other devices, slight package or feature differences may require minor changes to hardware or host soft-ware.This application note describes in detail the steps required to integrate a CP2102N de-vice into a design in place of a previous CP210x device. Devices covered by this appli-cation note are: CP2101, CP2102/9, CP2103, and CP2104. Multiple-interface devices, such as the CP2105 and CP2108, are not discussed.KEY POINTS •The CP2102N maintains a high degree of pin and feature compatibility with most existing CP210x devices.•Designs will require minimal hardware or software changes when migrating to theCP2102N.•The CP2102N provides a migration path for:•CP2101•CP2102/9•CP2103•CP21041. Device Comparison1.1 Feature CompatibilityA full feature comparison table for all CP210x devices, including the CP2102N, is given below. In general, the CP2102N meets or ex-ceeds the feature set of all previous CP210x devices.Table 1.1. CP210x Family FeaturesNote: The CP2102N cannot directly generate Line Break Conditions. The use of this feature is generally considered uncommon, al-though it was previously supported on CP2102/9 devices. A Line Break Condition occurs when the receiver input is held to logic low (i.e. zero) for some period of time, generally for more than one character time. This condition is seen by the receiver as a character with all zero bits with a framing error. A user can potentially emulate this on a CP2102N, however, by changing the baud rate to be slower than expected, then transmitting a null character. The CP2102N does have the capability to receive Line Breaks.1.2 Pin CompatibilityWith the exception of its VBUS pin, which must be connected to a voltage divider for proper operation, the CP2102N is largely pin-compatible with most CP210x devices. Below is a table of variants of the CP2102N that can be used to replace previous CP210x devi-ces.Table 1.2. CP2102N Replacements for CP210x DevicesAs the CP2102N datasheet notes, there are two relevant restrictions on the VBUS pin voltage in self-powered and bus-powered config-urations. The first is the absolute maximum voltage allowed on the VBUS pin, which is defined as VIO + 2.5 V in Absolute Maximum Ratings table. The second is the input high voltage (VIH) that is applied to VBUS when the device is connected to a bus, which is de-fined as VIO – 0.6 V in the table of GPIO specifications.A resistor divider (or functionally-equivalent circuit) on VBUS, as shown in Figure 1.1 Bus-Powered Connection Diagram for USB Pins on page 3and Figure 1.2 Self-Powered Connection Diagram for USB Pins on page 4for bus- and self-powered operation, re-spectively, is required to meet these specifications and ensure reliable device operation. In this case, the current limitation of the resis-tor divider prevents high VBUS pin leakage current, even though the VIO + 2.5 V specification is not strictly met while the device is not powered.Figure 1.1. Bus-Powered Connection Diagram for USB PinsFigure 1.2. Self-Powered Connection Diagram for USB Pins1.3 Configuration CompatibilityWhile the CP2102N supports the same configuration parameters as the CP210x, the means of programming these into the device are different. Of particular note is the fact that the configuration data structure for the CP2102N has an entirely different format than that used for the CP210x. In short, it is not possible to write the configuration data for a legacy CP210x device to the CP2102N and vice versa.Furthermore, if the CP210x manufacturing DLL is incorporated into custom software as part of a production or test flow, the API calls used to read and write the individual parameters on a CP210x device cannot be used with the CP2102N. Thus, calls to any of the functions listed in Table 1.3 CP210x Configuration APIs on page 5and documented in AN721: USBXpress™ Device Configuration and Programming Guide must be replaced wholesale with calls to the new CP210x_GetConfig and CP210x_SetConfig functions that are specific to the CP2102N.Table 1.3. CP210x Configuration APIs2. Device MigrationThe following sections describe the migration considerations when transitioning from an existing CP210x device to a CP2102N device.2.1 CP2101 to CP2102NHardware CompatibilityThe CP2102N-A02-GQFN28 is pin compatible with the CP2101 with the addition of the voltage divider circuit shown in Figure 1.1 Bus-Powered Connection Diagram for USB Pins on page 3 and Figure 1.2 Self-Powered Connection Diagram for USB Pins on page 4.The CP2102N does, however, have extra functionality on pins 13 through 22. A new design may want to take advantage of these extra pins, but they can be safely left unconnected.Software CompatibilityThe CP2102N is fully feature compatible with the CP2101. No software changes will be required when transitioning a CP2101 design to the CP2012N.The CP2102N does have several common features that the CP2101 lacks. For example, the CP2101 only allows for 8 data bits per frame, where the CP2102N has the ability for 5, 6, 7, or 8 data bits. If desired, the CP2102N can be customized to disable these addi-tional features.2.2 CP2102/9 to CP2102NHardware CompatibilityThe CP2102N-A02-GQFN28 is pin compatible with the CP2102/9 with the addition of the voltage divider circuit shown in Figure 1.1 Bus-Powered Connection Diagram for USB Pins on page 3and Figure 1.2 Self-Powered Connection Diagram for USB Pins on page 4.The CP2102N does, however, have extra functionality on pins 13 through 22. A new design may want to take advantage of these extra pins, but they can be safely left unconnected.The CP2109 has an additional hardware requirement that the VPP pin (pin 18) should be connected to a capacitor to ground for in-system programming. This capacitor is not required on the CP2102N and can be safely omitted.Software CompatibilityThe CP2102N is feature compatible with the CP2102/9, with two exceptions:•Baud Rate Aliasing•Line Breaks / Break ConditionsBaud Rate Aliasing is a feature that allows a device to use a pre-defined baud rate in place of a baud rate that is requested by the user. For example, a device using Baud Rate Aliasing can be programmed to use a baud rate of 45 bps whenever 300 bps is requested. Baud Rate Aliasing is not supported on the CP2102N.If Baud Rate Aliasing is used in a CP2102/9 design, the CP2102N is incompatible as a replacement.Line Breaks (also called a Break Condition) occur when the transmission line to logic low for more than one character time. The CP2102/9 devices have the ability to transmit a Line Break or Break Condition by directly setting the device's break state property. This forces the transmission line to logic low until the break state property is cleared. This feature is not directly supported on the CP2102N. However, a break condition can be emulated by temporarily lowering the baud rate, then transmitting a null character. The duration of this emulated break condition can be controlled by adjusting the baud rate, but it cannot exceed 27ms (8 bits at the lowest available baud rate, 300bps).If Break Conditions are used in a CP2102/9 design, care must be taken to assure that the CP2102N can emulate these conditions cor-rectly.2.3 CP2103 to CP2102NHardware CompatibilityThe CP2102N does not have a pin-compatible variant that can replace the CP2103. The CP2103 QFN28 package has an additional VIO pin at pin 5 which shifts the function of previous pins on the package clock-wise around the package by one pin compared to the CP2102N QFN28 package. This affects pins 1-4 and 22-28. All other pins remain in the same configuration.If a separate VIO rail is required for a design, the smaller CP2102N QFN24 variant can be used. This variant has an identical function-ality set as the CP2103, but in the smaller QFN24 package.Beside this difference in pin-outs, no other hardware changes are required to migrate from the CP2103 to the CP2102N.Software CompatibilityThe CP2102N is fully feature compatible with the CP2103 with one exception: Baud Rate Aliasing.Baud Rate Aliasing is a feature that allows a device to use a pre-defined baud rate in place of a baud rate that is requested by the user. For example, a device using Baud Rate Aliasing can be programmed to use a baud rate of 45 bps whenever 300 bps is requested. Baud Rate Aliasing is not supported on the CP2102N.If Baud Rate Aliasing is used in a CP2103 design, the CP2102N is incompatible as a replacement.2.4 CP2104 to CP2102NHardware CompatibilityThe CP2102N-A02-GQFN24 is pin compatible with the CP2104 with the addition of the voltage divider circuit shown in Figure 1.1 Bus-Powered Connection Diagram for USB Pins on page 3 and Figure 1.2 Self-Powered Connection Diagram for USB Pins on page 4. No other hardware changes are required when transitioning a CP2104 design to the CP2102N. The CP2104 does require a capacitor be-tween VPP (pin 16) and ground for in-system programming, but this pin is not connected on the CP2102N. Whether or not this capaci-tor is attached to this pin will have no effect on the CP2102N.Software CompatibilityThe CP2102N is fully feature compatible with the CP2104. No software changes will be required when transitioning a CP2104 design to the CP2012N.Revision History 3. Revision HistoryRevision 1.3Mar, 2022•Added X to CP2104 Line Break Transmission in Table 1.1 CP210x Family Features on page 2.•Updated CP2102-A01-GQFN28 with CP2102-A02-GQFN28 in Table 1.2 CP2102N Replacements for CP210x Device on page 3 and Chapter 2. Device Migration.•Updated Figure 1.1 Bus-Powered Connection Diagram for USB Pin on page 3 and Figure 1.2 Self-Powered Connection Diagram for USB Pin on page 4 to reflect new SP0503BAHTG protection device RoHS-compliant part number.•Corrected typo in Configuration Compatibility section names.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USAIoT Portfolio/IoTSW/HW/simplicityQuality /qualitySupport & Community/communityDisclaimerSilicon Labs intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software imple-menters using or intending to use the Silicon Labs products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and “Typical” parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Labs reserves the right to make changes without further notice to the product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Without prior notification, Silicon Labs may update product firmware during the manufacturing process for security or reliability reasons. Such changes will not alter the specifications or the performance of the product. Silicon Labs shall have no liability for the consequences of use of the infor -mation supplied in this document. This document does not imply or expressly grant any license to design or fabricate any integrated circuits. The products are not designed or authorized to be used within any FDA Class III devices, applications for which FDA premarket approval is required or Life Support Systems without the specific written consent of Silicon Labs. A “Life Support System” is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Labs products are not designed or authorized for military applications. Silicon Labs products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons. Silicon Labs disclaims all express and implied warranties and shall not be responsible or liable for any injuries or damages related to use of a Silicon Labs product in such unauthorized applications. Note: This content may contain offensive terminology that is now obsolete. Silicon Labs is replacing these terms with inclusive language wherever possible. For more information, visit /about-us/inclusive-lexicon-projectTrademark InformationSilicon Laboratories Inc.®, Silicon Laboratories ®, Silicon Labs ®, SiLabs ® and the Silicon Labs logo ®, Bluegiga ®, Bluegiga Logo ®, EFM ®, EFM32®, EFR, Ember ®, Energy Micro, Energy Micro logo and combinations thereof, “the world’s most energy friendly microcontrollers”, Redpine Signals ®, WiSeConnect , n-Link, ThreadArch ®, EZLink ®, EZRadio ®, EZRadioPRO ®, Gecko ®, Gecko OS, Gecko OS Studio, Precision32®, Simplicity Studio ®, Telegesis, the Telegesis Logo ®, USBXpress ® , Zentri, the Zentri logo and Zentri DMS, Z-Wave ®, and others are trademarks or registered trademarks of Silicon Labs. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. Wi-Fi is a registered trademark of the Wi-Fi Alliance. All other products or brand names mentioned herein are trademarks of their respective holders.。

XPG XENIA 15 游戏笔记本电脑快速入门指南说明书

XPG XENIA 15 游戏笔记本电脑快速入门指南说明书

01
02
Right Side
A
B
C
A 2 in 1 Card Reader
Support for SD/SDHC/SDXC memory cards
B USB 3.2 Gen2 Port
Connect any USB device into this port, such as a USB flash drive, keyboard, or mouse.
Screen
+
Brightness Up:
Press this key combination (FN + F10) to increase screen brightness.
2nd Monitor
+
Control:
Press this key combination (FN + F11) to initiate secondary monitor display mode.
+
Lock:
primary/secondary Fn row assignment.
Sleep:
Press this key combination (FN +F1) to initiate low power state.
+
Mute
Press this key combination (FN + F2) to toggle between mute
C Vents
The thermal vents are designed to cool the internal components and avoid overheating
05

Evaluation Board Manual for i7x Non-Isolated DC-DC

Evaluation Board Manual for i7x Non-Isolated DC-DC

i7CxxC03-EVK-S1; i7AxxC01-EVK-S1 Evaluation Kit Manual for i7x Non-Isolated DC-DC SeriesContents1.Introduction (2)2.Ordering Information (2)3.General Features (3)4.Turn-on / Turn-off module by switch (4)5.Change Output Voltage (4)6.When use external clock (SYNC function) (4)7.Capture output ripple/noise waveform (4)8.Mechanical Outline (5)9.Schematic (6)10.PCB Layout (7)11.Parts List (9)1. IntroductionThis evaluation kit has been designed to provide an easy way to characterize the product performance and its features. It is intended to aid customers and determine the product suitability for the target application. The evaluation board incorporates the required external components to demonstrate the complete product functionality. It also includes other components (e.g. test points, etc…) to facilitate a successful end user experience. Not all these external components are required if the product features are not needed. Details of the external components, schematics, and PCB layout are provided in this documentation for reference only. Final design and qualification needs to be verified at customer’s end system level.2. Ordering InformationTDK-Lambda offers a wide variety of non-isolated dc-dc power modules in the i7X series. Not every product is currently available in an evaluation kit. The table below includes description and ratings which should help in selecting the most applicable evaluation kit.Evaluation Kit PartNumberNon-Isolated DC-DC Module(Included and Mounted on the Evaluation Board)DC-DC Module PartNumberType I/P Range O/P RangeO/P Current(max)O/P Power(Max)i7C08A-C03-EVK-S1 i7C4W008A120V-003-R Buck-Boost 9 – 53 V 9.6 – 48 V 8 A 300 Wi7C12A-C03-EVK-S1 i7C4W012A050V-003-R Buck-Boost 9 – 53 V 5.0 – 28 V 12.5 A 300 Wi7C20A-C03-EVK-S1 i7C2W020A120V-003-R Buck-Boost 9 – 36 V 8.0 – 24 V 20 A 300 Wi7A33A-C01-EVK-S1 i7A4W033A033V-001-R Buck 18 – 60 V 3.3 – 24 V 33 A 500 Wi7A45A-C01-EVK-S1 i7A24045A033V-001-R Buck 18 – 32 V 3.3 – 18 V 45 A 750 WIMPORTANT INFORMATION∙Observe proper safety and laboratory procedures when testing electronic products. This list serves as general guide only and not a substitute for common sense and best practices.∙Before applying power, double check and ensure all connections to the evaluation board interface are correct (e.g.Input source polarity connections, etc…).∙This evaluation board is not populated with an input fuse. An input fuse can be populated in pcb location F1. Check the product specifications for the input fuse ratings and the evaluation board schematics included this manual.Make sure the existing jumper connections, BB4 and BB5, are removed when adding the fuse.∙Although highly efficient, these high power density modules can dissipate significant amounts of power, especially at heavy load. Care should be taken to ensure adequate cooling is provided and the modules are operated within the thermal specifications outlined in the product data sheets. Heat sink and base plated versions of the i7X family are available for use in demanding environments.∙This evaluation kit is designed for general laboratory use. It is not intended for installation in end customer product or equipment.∙Please check the pertinent product (DC-DC Module) datasheets and specifications for complete information.3. General Features∙ Screw Terminals for secured input and output connections ∙ Toggle switch for Remote ON/OFF∙ Test points / Scope probe hook-ups for ease of measurement ∙ Trim Potentiometer for adjusting the output voltage setting∙Component PCB pad provisions for: Input fuse, input inductor, additional input and output capacitance*, Output header connector for optional features and signals.* Note the output capacitor value may need to be adjusted to meet transient response or ripple requirements of the final application. Refer to product data sheet for a range of acceptable values.Test Point DescriptionTest PointDescriptionTP1 Vin (+) TP8 SENSE + TP2 Vin (-) / GND TP9 PG (Power Good) TP3 Not Populated TP10 Vout (+) TP4 ON / OFF TP11 Vout (-) / GNDTP5 SYNC (Frequency Synchronization)TP12 Vout (+) - for Output Ripple MeasurementTP6I_MON (Output Current Monitor)TP13Vout (-) / GND – for Output Ripple MeasurementScrew Terminal DescriptionScrew Terminal DescriptionJ1 Vin (+) J3 Vout (+) J2Vin (-) / GNDJ4Vout (-) / GNDOUTPUT (+)INPUT (+)OUTPUT (-)INPUT (-)TP11VR1 (Vout Adjust)S1: On/Off SwitchTP4 TP5TP6TP2TP1TP9TP8TP10 J1J2J3J4TP12TP134. Turn-on / Turn-off module by switchChange position of toggle switch”S1” to “CLOSE” turns-on the powersupply unit.5. Change Output VoltageTurn screw on trimmer pot “VR1” to change the output voltage.Turn clockwise to decrease output voltage.Turn counter clockwise to increase output voltage.C.C.W.C.W.6. When using external clock (SYNC function)SYNC function default setting is disabled. Please removeresister ”R14” on bottom side of the board to enable theSYNC function.Remove R14When using sync7. Capture output ripple/noise waveformPlease use TP12, TP13 to measure output ripple/spike.Wired GND clip may pick up higher spike noise.To use bare probe minimize spike noise.Please pay attention for connect right polarity.TP12 is Vout(+) / TP13 is GND.recommend8. Mechanical Outline9. SchematicG e n e r a l S c h e m a t i c : C h e c k t h e a c c o m p a n y i n g p a r t s l i s t t h a t p e r t a i n s t o t h e a c t u a l E v a l u a t i o n K i t p a r t n u m b e r t o s e e w h i c h c i r c u i t c o d e s /c o m p o n e n t s a r e u s e d .10. PCB LayoutTop LayerLayer 2PCB Layout (continued) Layer 3Bottom11. Parts ListSchematic Circuit Code Part TypeManufacturer (Mfr)Mfr Part No.Manufacturer (Mfr)Mfr Part No.i7A_i7C DC-DC Module TDK Lambda i7C4W008A120V-003-R TDK Lambda i7C4W012A050V-003-R Q1OMIT OMIT OMIT C1Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C2Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C3Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C4-C18OMIT OMIT OMIT C19Capacitor NI-CHEMI EMHB630ARA361MLH0S NI-CHEMI EMHB630ARA361MLH0S C20-C22OMIT OMIT OMIT C23Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C24Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C25Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C26Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C27Capacitor MURATA GRM32ER71J106MA12L MURATA GRM32ER71J106MA12L C28-C34OMIT OMITOMITC35Capacitor NI-CHEMI EMHB630ARA361MLH0S NI-CHEMI EMHB630ARA361MLH0S C36Capacitor TDK C1608X7S2A104KT TDK C1608X7S2A104KT C37-C38OMIT OMITOMITC39Capacitor TDK C1608X7S2A104KT TDK C1608X7S2A104KT C40Capacitor TDK C1608X7S2A104KT TDK C1608X7S2A104KT F1OMITOMITOMITBB1Copper Pin ROWLEY SPRING ZP00185_01ROWLEY SPRING ZP00185_01BB2Copper Pin ROWLEY SPRING ZP00185_01ROWLEY SPRING ZP00185_01BB3OMITOMITOMITBB4Copper Pin ROWLEY SPRING ZP00185_01ROWLEY SPRING ZP00185_01BB5Copper Pin ROWLEY SPRING ZP00185_01ROWLEY SPRING ZP00185_01IC1OMIT OMIT OMIT VR1Resistor BOURNS 3266W-1-204LFBOURNS 3266W-1-503LFL1OMIT OMIT OMIT R1-R6OMIT OMIT OMIT R7Resistor KOA RK73Z1JTTDKOA RK73Z1JTTDR8Resistor KOA RK73H1JTTD21R5F KOA RK73H1JTTD3010F R9OMIT OMITOMITR10Resistor KOA RK73Z2ATTD KOA RK73Z2ATTDR11OMIT OMIT OMIT R12Resistor KOA RK73H1JTTD3323F OMIT R13OMIT OMIT OMIT R14Resistor KOA RK73Z1JTTDKOA RK73Z1JTTDR15Resistor KOA RK73H1JTTD1002D KOA RK73H1JTTD1002D CN1OMIT OMITOMITS1SwitchLIGHT COUNTRY 2US1T1A1M2RES LIGHT COUNTRY 2US1T1A1M2RES J1, J2, J3, J4Screw Terminal KEYSTONE 8196KEYSTONE 8196TP1Test Point: Vin(+)MAC8WT-2-2MAC8WT-2-2TP2Test Point: Vin(-)MAC8WT-2-2MAC8WT-2-2TP3OMITOMIT OMIT TP4Test Point: On/Off MAC8WT-2-2MAC8WT-2-2TP5Test Point: SYNC MAC8WT-2-2MAC8WT-2-2TP6Test Point: I_Mon MAC8WT-2-2MAC8WT-2-2TP8Test Point: SENSE+MAC8WT-2-2MAC8WT-2-2TP9Test Point: PG MAC8WT-2-2MAC8WT-2-2TP10Test Point: Vout(+)MAC8WT-2-2MAC8WT-2-2TP11Test Point: Vout(-)MAC8WT-2-2MAC8WT-2-2TP12Test Point: Vout(+)MAC8WT-2-2MAC8WT-2-2TP13Test Point: Vout(-)MAC8WT-2-2MAC8WT-2-2SCR1, SCR2, SCR3, SCR4Screw for J1, J2, J3, J4KEYSTONE 9427KEYSTONE 9427SO1, SO2, SO3, SO4StandoffKEYSTONE1902CKEYSTONE1902Ci7C08A-C03-EVK-S1i7C12A-C03-EVK-S1Evaluation Kit Part Number。

FPGA可编程逻辑器件芯片XCZU15EG-1FFVB1156E中文规格书

FPGA可编程逻辑器件芯片XCZU15EG-1FFVB1156E中文规格书

Package MarkingAll Virtex-6 devices have package top-markings similar to the example shown in Figure 6-1 and explained in Table 6-1.Note:The informational product change customer notice XCN11022: Product Marking Change outlines a change to the top marking process from an ink mark to laser marking. The previous top mark included an ink patch.Figure 6-1:Virtex-6 Device Package MarkingTable 6-1:Xilinx Device Marking Definition—ExampleItem DefinitionXilinx Logo Xilinx logo, Xilinx name with trademark, and trademark-registered status.Family Brand Logo Virtex-6 family name with trademark and trademark-registered status. This line is optional and could appear blank.Pb-Free Logo If the Pb-Free logo appears, the package is RoHS compliant. If the logo does not appear, the package is RoHS compliant if it has the G detailed in the 2nd Line definition below.1st LineDevice type.Table5-1 shows the thermal resistance data for Virtex-6 devices (grouped in the packagesoffered). The data includes junction-to-ambient in still air, junction-to-case, and junction-to-board data based on standard JEDEC four-layer measurements.Note:The data in Table5-1 is for device/package comparison purposes only. Do not apply directly toyour system design. Attempts to recreate this data are only valid using the steady-state measurementtechnique outlined in JESD51-2a, JESD51-6, and JESD51-8.Table 5-1:Thermal Resistance Data—All DevicesPackagePackageBody SizeDevicesθJA(°C/W)θJB(°C/W)θJC(°C/W)θJA (°C/W)@ 250 LFMθJA (°C/W)@ 500 LFMθJA (°C/W)@ 750 LFMFF484 FFG48423x23XC6VLX75T13.1 3.50.288.97.4 6.8XC6VLX130T12.6 3.10.178.37.0 6.4FF784FFG784 RF78429x29XC6VLX75T11.8 3.50.287.5 6.4 5.8XC6VLX130TXQ6VLX130T11.2 3.10.177.1 6.0 5.4XC6VLX195T10.9 2.90.147.0 5.8 5.3XC6VLX240TXQ6VLX240T10.8 2.70.11 6.8 5.7 5.2FF1154 FFG115435x35XC6VHX250T9.7 2.50.09 5.8 4.8 4.3XC6VHX380T9.5 2.30.06 5.6 4.6 4.1FF1155 FFG115535x35XC6VHX255T9.5 2.30.06 5.6 4.6 4.1XC6VHX380T9.5 2.30.06 5.6 4.6 4.1FF1156FFG1156 RF115635x35XC6VLX130TXQ6VLX130T10.0 2.90.16 6.1 5.1 4.6XC6VLX195T9.9 2.70.12 6.0 5.0 4.5XC6VLX240TXQ6VLX240T9.8 2.60.10 5.9 4.9 4.4XC6VLX365T9.6 2.40.08 5.7 4.7 4.2XC6VSX315TXQ6VSX315T9.6 2.40.08 5.7 4.7 4.2XC6VSX475TXQ6VSX475T9.3 2.10.10 5.4 4.4 4.0determined by those using these guidelines. For complete information on packagemoisture / reflow classification and package reflow conditions, refer to the JointIPC/JEDEC Standard J-STD-020C.Sn/Pb Reflow SolderingFigure5-4 shows typical conditions for solder reflow processing of Sn/Pb soldering usingIR/convection. Both IR and convection furnaces are used for BGA assembly. The moisturesensitivity of PSMCs must be verified prior to surface-mount flow.Figure 5-4:Typical Conditions for IR Reflow Soldering of Sn/Pb Solder Notes for Figure5-4:1.Maximum temperature range = 220°C (body). Minimum temperature range before205°C (leads/balls).2.Preheat drying transition rate 2–4°C/s3.Preheat dwell 95–180°C for 120–180 seconds4.IR reflow must be performed on dry packagesPb-Free Reflow SolderingXilinx uses SnAgCu (SAC305) solder balls for BGA packages. In addition, suitable materialare qualified for the higher reflow temperatures (245°C–250°C) required by Pb-freesoldering processes. Xilinx recommends soldering SAC305 BGA packages with SAC305solder paste.The optimal profile must take into account the solder paste/flux used, the size of theboard, the density of the components on the board, and the mix between large componentsand smaller, lighter components. Profiles should be established for all new board designsusing thermocouples at multiple locations on the component. In addition, if there is amixture of devices on the board, then the profile should be checked at various locations onthe board. Ensure that the minimum reflow temperature is reached to reflow the largercomponents and at the same time, the temperature does not exceed the thresholdtemperature that might damage the smaller, heat sensitive components.Table5-4 and Figure5-5 provide guidelines for profiling Pb-free solder reflow.In general, a gradual, linear ramp into a spike has been shown by various sources to be theoptimal reflow profile for Pb-free solders (Figure5-5). SAC305 alloy reaches full liquidusSoldering Guidelines temperature at 235°C. When profiling, identify the possible locations of the coldest solder joints and ensure that those solder joints reach a minimum peak temperature of 235°C for at least 10 seconds. It might not be necessary to ramp to peak temperatures of 260°C. Reflowing at high peak temperatures of 260°C and above can damage the heat sensitive components and cause the board to warp.Users should reference the latest IPC/JEDEC J-STD-020 standard for the allowable peak temperature on the component body. The allowable peak temperature on the component body is dependent on the size of the component. Refer to Table5-4 for peak package reflow body temperature information. In any case, use a reflow profile with the lowest peak temperature possible.Table 5-4:Pb-Free Reflow Soldering GuidelinesProfile Feature Convection, IR/ConvectionRamp-up rate2°C/s maximumPreheat Temperature 150°–200°C60–120 secondsTemperature maintained above 217°C60–150 seconds (60–90 seconds typical)Time within 5°C of actual peak temperature30 seconds maximumPeak Temperature (lead/ball)235°C minimum, 245°C typical (depends onsolder paste, board size, components mixture) Peak Temperature (body)245°C–250°C, package body size dependent(reference Table5-5)Ramp-down Rate2°C/s maximumTime 25°C to Peak Temperature 3.5 minutes minimum, 5.0 minutes typical,8minutes maximumFigure 5-5:Typical Conditions for Pb-Free Reflow SolderingChapter 6:Package Marking。

Lenovo Flex System EN2092 1Gb Ethernet Scalable Sw

Lenovo Flex System EN2092 1Gb Ethernet Scalable Sw

Lenovo Flex System EN2092 1Gb Ethernet Scalable SwitchProduct Guide (withdrawn product)The Lenovo® Flex System™ EN2092 1Gb Ethernet Scalable Switch enables administrators to offer full Layer 2 and 3 switching and routing capability with combined 1 Gb and 10 Gb external ports in a Flex System chassis. Such consolidation simplifies the data center infrastructure and helps reduce the number of discrete devices, management consoles, and management systems while leveraging the 1 Gb Ethernet infrastructure. In addition, the next-generation switch module hardware supports IPv6 Layer 3 frame forwarding protocols. This Scalable Switch delivers cost savings with flexible port mapping and Features on Demand upgrades, efficient traffic management, increased external bandwidth, and strong Ethernet switching price/performance.The following figure shows the switch module.Figure 1. Lenovo Flex System EN2092 1Gb Ethernet Scalable SwitchDid you know?The base switch configuration comes standard with 24x 1 GbE port licenses that can be assigned to internal or external 1 GbE connections or even external SFP+ ports with flexible port mapping. For example, this feature allows customers to trade off one external 1 GbE RJ-45 port for one internal 1 GbE port (or vice versa) or trade off ten 1 GbE ports for one 10 GbE port. Customers then have the flexibility of turning on more ports when you need them using Lenovo's Features on Demand upgrade licensing capabilities that provide “pay as you grow” scalability without the need to buy additional hardware. Delivering advanced virtualization awareness and cloud readiness helps simplify management and automates VM mobility by making the network VM aware with VMready® which works with all the major hypervisors.Click here to check for updatesFigure 2. Front panel of the Flex System EN2092 1Gb Ethernet Scalable SwitchThe front panel contains the following components:20x 1000BASE-T Ethernet external ports for 10/100/1000 Mbps connections to external Ethernet devices.4x SFP+ external ports to attach SFP/SFP+ transceivers for 1 Gb or 10 Gb connections or DAC cables for 10 Gb Ethernet connections.One mini-USB RS-232 console port that provides an additional means to configure the switchFigure 3. Location of the I/O bays in the Flex System chassisThe EN2092 switch can be installed in bays 1, 2, 3, and 4 of the Flex System chassis. A supported adapter card must be installed in a corresponding slot of the compute node. Each adapter can use up to four lanes to connect to the respective I/O module bay. The EN2092 is able to use up to two of the four lanes.In compute nodes that have an integrated dual-port 10 GbE network interface controller (NIC), NIC's ports are routed to bays 1 and 2 with a specialized periscope connector, and the adapter card is not required. However, when needed, the periscope connector can be replaced with the adapter card. In such a case integrated NIC will be disabled.Prior to Networking OS 7.8, with 4-port or 8-port adapters, an optional Upgrade 1 (90Y3562) was required for the switch to allow communications on four ports. With Networking OS 7.8 or later, there is no need to buy additional switch upgrades for 4-port adapters if the total number of port licenses on the switch does not exceed the number of external (upstream network ports) and internal (compute node network ports) connections used.The midplane connections between the adapters that are installed in the compute nodes to the I/O module bays in the chassis are listed in the following table. Half-wide compute nodes support up to two adapters, and full-wide compute nodes support up to four adapters.Table 8. Adapter to I/O bay correspondenceI/O adapter slotin the compute node Port on the adapter Corresponding I/O module bay in the chassisBay 1Bay 2Bay 3Bay 4Slot 1Port 1YesPort 2YesPort 3YesPort 4YesSlot 2Port 1YesPort 2YesPort 3YesPort 4YesSlot 3(full-wide compute nodes only)Port 1YesPort 2Yes Port 3YesPort 4YesSlot 4(full-wide compute nodes only)Port 1YesPort 2Yes Port 3YesPort 4YesThe following table lists the I/O adapters that are supported by the EN2092 1Gb Scalable Switch. 10 GbE adapters operate at 1 GbE speeds when used with this switch.Table 9. Network adaptersDescription Part number Feature code10 Gb Ethernet (10 GbE adapters operate at 1 GbE speeds)Embedded 10Gb Virtual Fabric Adapter (2-port)*None NoneFlex System CN4022 2-port 10Gb Converged Adapter#88Y5920A4K3Flex System CN4052 2-port 10Gb Virtual Fabric Adapter00JY800A5RPFlex System CN4052S 2-port 10Gb Virtual Fabric Adapter00AG540ATBTFlex System CN4054 10Gb Virtual Fabric Adapter (4-port)90Y3554A1R1Flex System CN4054R 10Gb Virtual Fabric Adapter (4-port)00Y3306A4K2Flex System CN4054S 4-port 10Gb Virtual Fabric Adapter00AG590ATBSFlex System CN4058S 8-port 10Gb Virtual Fabric Adapter94Y5160A4R61 Gb EthernetEmbedded 1 Gb Ethernet controller (2-port)**None NoneFlex System EN2024 4-port 1Gb Ethernet Adapter49Y7900A10Y* The Embedded 10Gb Virtual Fabric Adapter is built into select compute nodes.# The CN4022 supports 1 Gbps links with firmware 2.4.1D1 and driver nx2-2.2.5f-1.710.11 or later levels. For additional information, refer to https:///support/entry/myportal/docdisplay?lndocid=migr-5094970.** The Embedded 1 Gb Ethernet controller is built into select compute nodes.Network connectivityThe following table lists the network switches that are offered by Lenovo that can be used with theEN2092 in Flex System network connectivity solutions.Table 10. Network switchesDescription Part number 1 Gb Ethernet switchesLenovo RackSwitch G7028 (Rear to Front)7159BAX Lenovo RackSwitch G7052 (Rear to Front)7159CAX Lenovo RackSwitch G8052 (Rear to Front)7159G5210 Gb Ethernet switchesLenovo RackSwitch G8124E (Rear to Front)7159BR6 Lenovo RackSwitch G8264 (Rear to Front)7159G64 Lenovo RackSwitch G8272 (Rear to Front)7159CRW Lenovo RackSwitch G8296 (Rear to Front)7159GR610 Gb Converged switchesLenovo RackSwitch G8264CS (Rear to Front)7159DRX40 Gb Ethernet switchesLenovo RackSwitch G8332 (Rear to Front)7159BRX For more information, see the list of Product Guides in the Top-of-rack Switches category:/servers/options/switchesTrademarksLenovo and the Lenovo logo are trademarks or registered trademarks of Lenovo in the United States, other countries, or both. A current list of Lenovo trademarks is available on the Web athttps:///us/en/legal/copytrade/.The following terms are trademarks of Lenovo in the United States, other countries, or both:Lenovo®Flex SystemNMotion®RackSwitchVMready®XClarity®Other company, product, or service names may be trademarks or service marks of others.。

Duo v2 NV+ v2 Ultra 2 Ultra 2 Plus Ultra 4 Ultra 4

Duo v2 NV+ v2 Ultra 2 Ultra 2 Plus Ultra 4 Ultra 4
ReadyNAS
Home/Prosumer Product Line Comparison
Hardware
- CPU - Memory - Embedded flash memory for firmware - Form factor - Serial ATA channels - Hot-swappable disk trays - 10/100/1000 Ethernet ports - USB 2.0 ports - USB 3.0 ports - LCD/OLED display - Compatible with SATA I & II HDD - Native SATA II support - Kensington latch
Volumes
- Volume management
- Volume monitoring and resource view


- Single-volume auto-expansion (X-RAID/X-RAID2)


- Journaled file system


- User and group-level quotas
√ √ √ √ √ √ √ √ √ √ √ √ Optional

√ √ √
√ √ √ √


√ √ √ √ √ √ √
Optional
Ultra 6 Plus
√ √ √ √ √ √ √ √ √ √
√ √ √ √ √ √ √ √ √ √ √ √ Optional

√ √ √
√ √ √ √


√ √ √ √ √ √ √

Denon DN-D4500 专业双CD MP3播放器说明书

Denon DN-D4500 专业双CD MP3播放器说明书

3231A reliable,-S1200 COMPACT CD/USB MEDIAThis compact 8"-wide media player/controller features a slot-in CD drive (plays audio CDs, CD-R, CD-RW), USB MIDI & D interface, USB 2.0, touch-sensitive 110mm jog disc, D-Link, 7 onboard effects, 2 hot starts, 2 seamless loops, 24-bit audio processing, Denon DJ Music Manager PC appli-cation, and is firmware upgradeable. Compatible with Windows XP SP2, Vista, MAC OSX 10.4 or higher.AUSTRALIAN MONITOR MY MUSIC PROGRAM SOURCES These 3 program sources are available in a range of compact (1RU) playback devices. The CD players feature USB input for added flexibility. Dual units have independent RCA outputs.I EM DESCRIP T ION PRICE MYMDCD ...................Dual-CD/MP3 player program source...........................................695.22MYMDT ......................Dual-AM/FM tuner program source ..............................................299.88MYMTCD ....................CD player/tuner program source ..................................................499.70MYMDCD3232Follow us!DENON DNC615 SINGLE CD PLAYER Supports MP3/folder search and CD-RW T DEN ON DN C635 STUDIO CD PLAYER Supports MP3, CDR (without TOC),T DENON DN-C620 BROADCAST CD PLAYER Based on the DN-C640, this CD player T CDX-1210DENON DN-C640 SLOT-IN NETWORK CD PLAYER A full-featured, rackmounted T GALAXY AUDIO RM2 RACKMOUNT CHASSIS AND MODULES A diverse line of CD players, digital recorders, cassette players, and AM/FM tuners. Two 1/2 rack modules can be installed in various configurations into the single space RM2 rack chassis. The RM2 supplies power and provides useable rear panel inputs and outputs to the modules. It also features dedicated stereo RCA outs for each module, a priority stereo RCA out, a stereo RCA in for recording, and AM/FM antenna terminals. It has a universal power supply for use with AC anywhere in the world plus a 12VDC screw terminal power input.I T EM DESCRIP T ION PRICERM2-GALAXY .............1RU rackmount chassis...............................................................179.99RM-CASS ...................Cassette recorder ........................................................................189.99RM-CASSP .................Cassette player..............................................................................99.99RM-CD .......................CD player, plays MP3, USB & SD card input ................................199.99RM-CDAF ...................CD player, AM/FM tuner w/remote, plays MP3,USB & SD card input ...................................................................249.99RM-DIGIMP ...............Digital media player, USB & SD card input....................................99.99RM-DIGIREC ..............Digital recorder, USB & SD card input, 2 mic inputs (1/4") .........189.99RM-TUNER .................AM/FM digital tuner .......................................................................99.99DENON DN-F300/F400 SOLID-STATE& WAV files from SD or SDHC cards (theDN-F300 also reads from USB drives),ideal for audio playback in a myriad ofdemanding applications, including background music, fitness, message on holdT N E W!This innovative CD player provides flexible file display screen offers three selectable modes, as well as adjustable resistance for a custom feel. Other features include (6) DSP-powered effects, 3 programmable Hot Cues for instant N E W !PRICES SUBJECT TO CHANGE WITHOUT NOTICE. Call today or visit us online!3233CD MIXER W/ IPOD DOCK layer/mixers feature Numark’s tion jog/shuttle wheel for track searching and pitchbending/beat matching. The iCDMI X units also have replaceable crossfaders, PFL cueing, and seam-less looping, as well as RCA inputs for additional devices. ICDMIX2CDN77USBIPOD NOT INCLUDED.Features large 206 mm jogdial, front-load slot disc drive, rotary selector, browse buttons integrated within the unit's display, and an analog RCA output. Songs can be listed by title, the display. Works with mp3, AAC, WAV, AIFF files on CD-R/RWs and USB storage devices. Comes with rekordbox™ MAC and PC music management software, allowing you to create cue & loop settings, create & edit playlists, and T PRICECD/audio file DJ player ................................................................899.00Features loop creating functions (beat matching, Loop Divide, nome, auto BPM lock, tion, skip prevention,4 level tempo settings (±6%, ±10%, ±16%, ibility with DJ software. PIONEER CDJ-900 PRO DJ TABLETOP MULTI-FORMAT PLAYER d evices. A multi-format audio media player for DJs allows you to search, access and control your music with ease. Comes with Pioneer's Rekordbox music assignable buttons, slip mode for continued song playback during looping, reversing or scratching, and PRICE ......................1299.003234Follow us!PIONEER CDJ-2000MULTI-FORMAT DJ CD/MP3 PLAYER/CONTROLLER Play MP3, AIFF, WAV and AAC files on CDs, DVD-ROMs, SD cards and USB memory devices. Features a 6.1" color LCD panel & GUI, a Needle Search pad for in-song cueing, assignable buttons for DJ effects and software with MIDI mapping capability. Has Pro DJ Link which allows you to link as many as 4 player/controller units to one music source. Comes with Pioneer's Rekordbox Music Management software.I T EM DESCRIP T ION PRICECDJ2000 ....................Multi-format CD/MP3 player/controller ......................................1899.00T CDA750T CDA550T display tags and CD text. Provides features such as pitch control with an on/off knob, headphone-out with level control, RCA out, S/PDIF digital outputs (coaxial and optical), intro check, anti-shock memory, and a variety of playback modes. The CD-200i and CD-200iB have a slide-out iPod dock. The CD200iB also has dual balanced XLR outputs. All models include remote control.I T CD200CD200I CD200IB T EM DESCRIP T ION PRICE.......................MP3 player/card reader .........................97.88ROLLS MP322 MP3 PLAYER/CARD READER This device plays mp3 files off of SD cards, MMD cards and USB (1.1 and 2.0) jump drives (up to 2GB). Comes with wireless remote control and universal wall adapter. 1/8" and RCA output jacks.Para asistencia en Español llame al 800-356-5844 x1164 y x11783235YAMAHA CD-S300RK & CD-C600RK CD PLAYERS With numerous playback CD-S300-RKTEAC CDP1260 SINGLE CD PLAYER A table-top single-CD player that features 8 lution jog wheel with multi-style, illuminated STAN TON RACKMOUN T CD PLAYERS The C.402 is a single CD player that C402YAMAHA CD-C600 FIVE-DISC CD CHANGERN。

Audient iD14 USB 音频接口快速启动指南说明书

Audient iD14 USB 音频接口快速启动指南说明书

Quick Start Guide USB-CConnectionMic/LineInputs 1 + 2InstrumentInputDual HeadphoneOutputs2 x SpeakerOutputsADAT OpticalInputa u d i e n t.c o mPlease read this quick guide to help get you started. For more information, download the full manual & specifications from: /iD14/downloads1. Download the iD application for Mac from /iD14/downloads2. Open the downloaded file and drag the iD icon into the Applications folder.3. Connect the iD4 to the Mac using the included USB-C cable. A third party USB-C to A cable can also be used if required. Requires a connection to a USB 3.0 port or greater.4. Run the iD application from your Applications folder. If a firmware update is available you’ll be prompted to install it.5. A registration screen will appear allowing you to register your product with Audient ARC to receive firmware updates as well as exclusive plugins and software. MacOS macOS 10.11.6 (El Capitan) or later. Mac Intel CPU 1GB RAM Minimum System requirements:1. Download the iD application for Windows from /iD14/downloads 2. Open the installer and follow the instructions shown on screen. It will ask you to connect the iD14 during the installation procedure. Once the installer is complete it can sometimes take a few moments for Windows to finalise the drivers before the unit is recognised.3. Launch the iD application from the Application list in the Start menu. If a firmware update is available you’ll be prompted to install it.4. A registration screen will appear allowing you to register your product with Audient ARC to receive firmware updates as well as exclusive plugins and software.Windows Welcome to your new Audient iD14 Audio InterfaceiD Button Main Output Select Volume Knob Headphone Output Select Main MetersChannel 1(Mic/Line Input)Channel 2 (Mic/Line Input)Phantom Power。

HTC S715e 一键root权限获取图文教程

HTC S715e 一键root权限获取图文教程

HTC S715e 一键root权限获取教程,亲测好用
HTC S715e在外观上以黑红色搭配,显得格外显眼。

该机拥有4.0英寸的触摸屏,分辨率为400×800像素。

不少机友一直想给HTC S715e获取root权限,但苦于HTC手机的奇葩有锁设计,使得原来很简单的root方法变得难上加难,今天给大家分享一篇HTC S715e 一键root权限获取教程,亲测好用。

ROOT准备:
1.保证手机拥有50%以上的电量,需要一根合适的数据线。

2.手机必须是已经解锁状态,由于绝大部分的HTC手机需要解锁才能ROOT 和刷机。

如果您的手机没有解锁,小编在这里提供了解锁方法:HTC手机解锁详细图文教程。

4.下载可以直接root此机型的root工具:ROOT大师。

5.安装好驱动,ROOT大师连接你的手机后会自动装好手机驱动。

开始ROOT:
1.首先打开手机的usb调试模式,不会可以参考这里:USB调试模式打开方法。

2.然后连接root大师,等待root大师识别你的机型。

3.识别出机型后,点击一键root,可能需要1-3分钟的时间。

4.然后你会神奇的发现手机已经root成功了,因为root大师支持该机型一键root。

5.root成功手机会自动重启,刷机大师开发了智能卸载内置软件功能,也删除那些可恶的系统预装软件了,不用担心卸载软件导致系统问题注意:如果失败说明root不彻底,建议连接ROOT大师后重新root。

SONY VPL-SW630 WXGA 3100lm 超短焦距投影机产品说明书

SONY VPL-SW630 WXGA 3100lm 超短焦距投影机产品说明书

Ultra Short Throw ProjectorVPL-SW630WXGA / 3,100 lmOpticalLight Output /Color Light Output3100 lumens (Lamp mode: High) 2300 lumens (Lamp mode: Standard) 1900 lumens (Lamp mode: Low)LCD Panels 0.59”x3 BrightEra LCD Panel Panel Display Resolution WXGA (1280x800 dots) Contrast Ratio 3,000:1 (Full white/full black)*1Light Source Ultra high-pressure mercury lamp 225 W typeRecommended Lamp ReplacementTime*23000H (Lamp mode: High)5000H (Lamp mode: Standard)8000H (Lamp mode: Low)Filter Cleaning Cycle*2Max. 8000HSame time as the lamp replacement isrecommendedProjection Lens Zoom / Focus Approx. 1.03x Manual Zoom / Manual FocusLens ShiftManual, Vertical +/-3.7%Horizontal + /-2.3%Throw Ratio 0.27:1Screen Size 65” to 110” InterfaceComputer andVideo Input/Output INPUT AMini D-sub 15-pin (RGB/Y Pb Pr)Audio: Stereo mini jack INPUT BMini D-sub 15-pin (RGB)Audio: Stereo mini jackINPUT CHDMI (Digital RGB/Y Pb Pr, Digital Audio)(HDCP support)VIDEO INPin JackAudio : Pin jack (x2) (shared with S VIDEO IN)S VIDEO INMini DIN 4-pinAudio : Pin jack (x2) (shared with VIDEO IN)Monitor OUTMini D-sub 15-pin(from INPUT A and INPUT B)Audio OUT Stereo mini jack (variable out)*3Other SignalInput/OutputRS-232C D-sub 9-pin (male)LAN RJ-45, 10BASE-T/100BASE-TX USB Type-A, Type-B MicrophoneinputMini jack General Speaker 16Wx1 (monaural)Scanning Frequency H: 15 to 92 kHz, V: 48 to 92 HzDisplayResolution Computer Signal Input Maximum display resolution : UXGA 1600x1200 dotsVideoSignal InputVideo(Composite), 15k(480/60i, 576/50i),DTV (480/60p, 576/50p, 720/60p, 720/50p,1080/60i, 1080/50i, 1080/60p, 1080/50p)Color System NTSC3.58, PAL, SECAM, NTSC4.43, PAL-M, PAL-N UPC Code 0 27242 87140 3Power Requirements AC 100 V to 240 V, 3.3 A to 1.5 A, 50 Hz/60 HzPower Consumption323 W (AC 100 V-120 V)311 W (AC 220 V-240 V)Standby Mode Power Consumption 5.1 W (Std)/ 0.5 W (Low)(AC 100V-120 V)5.4 W (Std)/ 0.5 W (Low) (AC 220V-240 V)Dimensions (WxHxD)(without protrusion)372x 138 x 382 mm 14 21/32 x 5 7/16 x 15 1/32 ” Mass (without wall mount) 6.0 kg /13 lb Optional Accessories Replacement Lamp LMP-E220Wall Mount PSS-640Wireless LAN Module IFU-WLM3Service PartsReplacement Filter 4-530-530-01 (FILTER A [Outside] )4-530-531-01 (FILTER B [Inside] )(Filters are cleanable)Replacement Remote 1-490-463-11 (RM-PJ8)Key Features*1 The value is average.*2 The figures are expected maintenance time and not guaranteed.They will depend on the environment or how the projector is used.*3Works as an audio switcher function. Output from a selected channel, not available in standby.Dimensions (Bottom)•3,100 lumens•Native WXGA (1,280x800) resolution •High contrast ratio •Bright Era® Panel•Ultra Short throw distance (TR= 0.27:1)•Optical lens shift and zoom for easy adjustment •Long-lasting lampRecommended lamp replacement time 8000h (low mode)•Synchronized lamp and filter maintenance cycle •Energy efficient design-Auto power saving mode -Blank with lamp dimming-4 lamp mode (High, Std, Low, Auto*)*Auto lamp control by picture brightness -ECO MODE key•Convenient terminals including HDMI,RS-232C and RJ-45•16W Speaker •USB display•USB media viewer•PC Wireless capability (option)•Tablet Device & Smart Phone connection (wireless)Dimensions (Front)Unit: mm (inches)Connector Panels© 2014 Sony Corporation. All rights reserved. Reproduction in whole or in part without written permission is prohibited. Features and specifications are subject to change without notice. The values for mass and dimension are approximate. “SONY”and “BrightEra” are trademarks of Sony Corporation. The terms HDMI and HDMI High -Definition Multimedia Interface, and the HDMI Logo are trademarks orregistered trademarks of HDMI Licensing LLC in the United States and other countries. All other trademarks are the property of their respective owners.For more information, visit : /projectors6/14。

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CHAPTER 14LONG-TERM LIABILITIESIFRS questions are available at the end of this chapter.TRUE-FALSE—Conceptual Answer No. DescriptionT 1. Bond interest payments.F 2. Debenture bonds.T 3. Definition of serial bonds.F 4. Market rate vs. coupon rate.F 5. Definition of stated interest rate.T 6. Stated rate and coupon rate.F 7. Amortization of premium and discount.F 8. Issuance of bonds.F 9. Interest paid vs. interest expense.T 10. Accounting for bond issue costs.T 11. Refunding of bond issue.F 12. Long-term notes payable.T 13. Variable-rate mortgages.T 14. Definition of unrealized holiday gain/loss.T 15. Off-balance-sheet financing.T 16. Debt to assets ratio.F 17. Refinancing long-term debt.F 18. Times interest earned ratio.F *19. Loss recognized on impaired loan.F *20. Gain/loss in troubled debt restructuring.MULTIPLE CHOICE—Conceptual Answer No. Descriptiona 21. Liability identification.a 22. Bond terms.b 23. Definition of "debenture bonds."a P24. Definition of bearer bonds.d S25. Definition of income bonds.a S26. Effective-interest vs. straight-line method.d S27. Interest rate of the bond indenture.d 28. Rate of interest earned by the bondholders.d 29. Calculating the issue price of bonds.d 30. Calculating the issue price of bonds.b 31. Premium and interest rates.a 32. Interest and discount amortization.d 33. Effective-interest amortization method.d 34. Impact of effective-interest method.c 35. Recording bonds issued between interest dates.d 36. Bonds issued at other than an interest date.d 37. Classification of bond issuance costs.c 38. Bond issuance costs.14 - 2Test Bank for Intermediate Accounting, Fifteenth EditionMULTIPLE CHOICE—Conceptual (cont.) Answer No. Descriptionb 39. Classification of treasury bonds.d 40. Early extinguishment of bonds payable.d 41. Gain or loss on extinguishment of debt.c P42. In-substance defeasance.c P43. Reporting long-term debt.a S44. Debt instrument exchanged for property.d 45. Stated interest rate of note.d 46. Creditworthiness of a company.c 47. Accounting for the fair value option.a 48. Project financing arrangement.c S49. Off-balance-sheet financing.d S50. Long-term debt maturing within one year.d 51. Required bond disclosures.d 52. Long-term debt disclosures.c 53. Times interest earned ratio.c 54. Debt to assets ratio.c *55. Modification of terms in debt restructure.d *56. Gain/loss on troubled debt restructuring.b *57. Gain/loss on troubled debt restructuring.b *58. Interest and troubled debt restructuring.c *59. Creditor's calculations for modification of terms.P These questions also appear in the Problem-Solving Survival Guide.S These questions also appear in the Study Guide.* This topic is dealt with in an Appendix to the chapter.MULTIPLE CHOICE—Computational Answer No. Descriptiona 60. Calculate the present value of bond principal.b 61. Calculate the present value of bond interest.a 62. Determine the issue price of bonds.c 63. Proceeds from bond issuance.c 64. Bonds issued between interest dates.c 65. Proceeds from bond issuance.c 66. Bonds issued between interest dates.c 67. Effective-interest method interest expense.a 68. Effective-interest method carrying value.d 69. Straight-line method carrying value.d 70. Straight-line amortization/interest expense.c 71. Effective-interest method interest expense.a 72. Effective-interest method carrying value.d 73. Straight-line method carrying value.d 74. Straight-line method amortization/interest expense.b 75. Interest expense using effective-interest method.c 76. Interest expense using effective-interest method.d 77. Entry to record issuance of bonds.a 78. Calculate bond interest expense.Long-Term Liabilities 14 - 3 MULTIPLE CHOICE—Computational (cont.)Answer No. Descriptionb 79. Entry to record issuance of bonds.c 80. Calculate bond interest expense.b 81. Calculate interest expense for two periods.b 82. Calculate unamortized bond discount balance.b 83. Calculate unamortized bond premium balance.c 84. Calculate interest expense for two periods.b 85. Entry to record bond redemption.b 86. Entry to record bond redemption.b 87. Calculate loss on bond redemption.c 88. Calculate loss on bond redemption.c 89. Calculate gain on retirement of bonds.b 90. Calculate gain on retirement of bonds.b 91. Calculate loss on retirement of bonds.b 92. Bond retirement with call premium.b 93. Calculate loss on retirement of bonds.b 94. Early extinguishment of debt.b 95. Early extinguishment of debt.a 96. Interest on noninterest-bearing note.c 97. Interest on installment note payable.b 98. Determine balance of discount on notes payable.d 99. Calculate times interest earned ratio.a 100. Calculate times interest earned ratio.c 101. Calculate income before taxes with times interest earned ratio.d 102. Determine total long-term liabilities.b *103. Transfer of equipment in debt settlement.d *104. Recognizing gain on debt restructure.a *105. Interest and troubled debt restructuring.MULTIPLE CHOICE—CPA AdaptedAnswer No. Descriptiona 106. Determine proceeds from bond issue.b 107. Determine unamortized bond premium.a 108. Determine unamortized bond discount.c 109. Calculate bond interest expense.a 110. Calculate loss on retirement of bonds.d 111. Calculate loss on retirement of bonds.d 112. Calculate gain on retirement of bonds.c 113. Determine carrying value of bonds to be retired.c 114. Carrying value of bonds with call provision.c 115. Classification of gain from debt refunding.d *116. Classification of gain from troubled debt restructuring.Test Bank for Intermediate Accounting, Fifteenth Edition14 - 4BRIEF EXERCISES Item DescriptionB E14-117 Terms related to long-term debt.B E14-118 Bond issue price and premium amortization.B E14-119 Amortization of discount or premium.EXERCISESE14-120 Entries for bonds payable.E14-121 Retirement of bonds.E14-122 Early extinguishment of debt.*E14-123 Accounting for a troubled debt settlement.*E14-124 Accounting for troubled debt restructuring.*E14-125 Accounting for troubled debt.PROBLEMSItem DescriptionP14-126 Bond discount amortization.P14-127 Bond interest and discount amortization.P14-128 Entries for bonds payable.P14-129 Entries for bonds payable.P14-130 Fair value option*P14-131 Accounting for a troubled debt settlement.CHAPTER LEARNING OBJECTIVES1. Describe the formal procedures associated with issuing long-term debt.2. Identify various types of bond issues.3. Describe the accounting valuation for bonds at date of issuance.4. Apply the methods of bond discount and premium amortization.5. Describe the accounting for the extinguishment of debt.6. Explain the accounting for long-term notes payable.7. Describe the accounting for the fair value option.8. Explain the reporting of off-balance-sheet financing arrangements.9. Indicate how to present and analyze long-term debt.*10. Describe the accounting for a debt restructuring.Long-Term Liabilities 14 - 5 11. Compare the accounting procedures for long-term liabilities under GAAP and IFRS.Test Bank for Intermediate Accounting, Fifteenth Edition14 - 6SUMMARY OF LEARNING OBJECTIVES BY QUESTIONSLong-Term Liabilities 14 - 7 SUMMARY OF LEARNING OBJECTIVES BY QUESTIONS (cont.)Note: TF = True-False E = Exercise CT= Critical Thinking MC = Multiple Choice P = Problem BE =Brief ExerciseTRUE FALSE—Conceptual1. Companies usually make bond interest payments semiannually, although the interest rateis generally expressed as an annual rate.2. A mortgage bond is referred to as a debenture bond.3. Bond issues that mature in installments are called serial bonds.4. If the market rate is greater than the coupon rate, bonds will be sold at a premium.5. The interest rate written in the terms of the bond indenture is called the effective yield ormarket rate.6. The stated rate is the same as the coupon rate.7. Amortization of a premium increases bond interest expense, while amortization of adiscount decreases bond interest expense.8. A bond may only be issued on an interest payment date.9. The cash paid for interest will always be greater than interest expense when usingeffective-interest amortization for a bond.14 - 8Test Bank for Intermediate Accounting, Fifteenth Edition10. Bond issue costs are capitalized as a deferred charge and amortized to expense over thelife of the bond issue.11. The replacement of an existing bond issue with a new one is called refunding.12. If a long-term note payable has a stated interest rate, that rate should be considered to bethe effective rate.13. The interest rate of variable-rate mortgages is tied to changes in the fluctuating marketrate.14. An unrealized holding gain or loss is the net change in the fair value of the liability fromone period to another, exclusive of interest expense recognized but not recorded.15. Off-balance-sheet financing is an attempt to borrow monies in such a way to minimize thereporting of debt on the balance sheet.16. The debt to assets ratio will go up if an equal amount of assets and liabilities are added tothe balance sheet.17. If a company plans to retire long-term debt from a bond retirement fund, it should reportthe debt as current.18. The times interest earned ratio is computed by dividing income before interest expense byinterest expense.*19. The loss to be recognized by a creditor on an impaired loan is the difference between the investment in the loan and the expected undiscounted future cash flows from the loan.*20. In a troubled debt restructuring, the loss recognized by the creditor will equal the gain recognized by the debtor.MULTIPLE CHOICE—Conceptual21. An example of an item which is not a liability isa. dividends payable in stock.b. advances from customers on contracts.c. accrued estimated warranty costs.d. the portion of long-term debt due within one year.Long-Term Liabilities 14 - 9 22. The covenants and other terms of the agreement between the issuer of bonds and thelender are set forth in thea. bond indenture.b. bond debenture.c. registered bond.d. bond coupon.Test Bank for Intermediate Accounting, Fifteenth Edition14 - 1023. The term used for bonds that are unsecured as to principal isa. mortgage bonds.b. debenture bonds.c. indebenture bonds.d. callable bonds.P24. Bonds for which the owners' names are not registered with the issuing corporation are calleda. bearer bonds.b. term bonds.c. debenture bonds.d. secured bonds.S25. Bonds that pay no interest unless the issuing company is profitable are calleda. collateral trust bonds.b. debenture bonds.c. revenue bonds.d. income bonds.S26. If bonds are issued initially at a premium and the effective-interest method of amortization is used, interest expense in the earlier years will bea. greater than if the straight-line method were used.b. greater than the amount of the interest payments.c the same as if the straight-line method were used.d. less than if the straight-line method were used.27. The interest rate written in the terms of the bond indenture is known as thea. coupon rate.b. nominal rate.c. stated rate.d. coupon rate, nominal rate, or stated rate.28. The rate of interest actually earned by bondholders is called thea. stated rate.b. coupon rate.c. nominal rate.d. effective rate.Use the following information for questions 29 and 30:Fox Co. issued $100,000 of ten-year, 10% bonds that pay interest semiannually. The bonds are sold to yield 8%.29. One step in calculating the issue price of the bonds is to multiply the principal by the tablevalue fora. 10 periods and 10% from the present value of 1 table.b. 20 periods and 5% from the present value of 1 table.c. 10 periods and 8% from the present value of 1 table.d. 20 periods and 4% from the present value of 1 table.30. Another step in calculating the issue price of the bonds is toa. multiply $10,000 by the table value for 10 periods and 10% from the present value ofan annuity table.b. multiply $10,000 by the table value for 20 periods and 5% from the present value of anannuity table.c. multiply $10,000 by the table value for 20 periods and 4% from the present value of anannuity table.d. None of these answers is correct.31. Reich, Inc. issued bonds with a maturity amount of $200,000 and a maturity ten yearsfrom date of issue. If the bonds were issued at a premium, this indicates thata. the effective yield or market rate of interest exceeded the stated (nominal) rate.b. the nominal rate of interest exceeded the market rate.c. the market and nominal rates coincided.d. no necessary relationship exists between the two rates.32. If bonds are initially sold at a discount and the straight-line method of amortization is used,interest expense in the earlier years willa. exceed what it would have been had the effective-interest method of amortizationbeen used.b. be less than what it would have been had the effective-interest method of amortizationbeen used.c. be the same as what it would have been had the effective-interest method of amortiza-tion been used.d. be less than the stated (nominal) rate of interest.33. Under the effective-interest method of bond discount or premium amortization, theperiodic interest expense is equal toa. the stated (nominal) rate of interest multiplied by the face value of the bonds.b. the market rate of interest multiplied by the face value of the bonds.c. the stated rate multiplied by the beginning-of-period carrying amount of the bonds.d. the market rate multiplied by the beginning-of-period carrying amount of the bonds.34. When the effective-interest method is used to amortize bond premium or discount, theperiodic amortization willa. increase only if the bonds were issued at a discount.b. decrease only if the bonds were issued at a premium.c. increase only if the bonds were issued at a premium.d. increase if the bonds were issued at either a discount or a premium.35. If bonds are issued between interest dates, the entry on the books of the issuingcorporation could include aa. debit to Interest Payable.b. credit to Interest Receivable.c. credit to Interest Expense.d. credit to Unearned Interest.36. When the interest payment dates of a bond are May 1 and November 1, and a bond issueis sold on June 1, the amount of cash received by the issuer will bea. decreased by accrued interest from June 1 to November 1.b. decreased by accrued interest from May 1 to June 1.c. increased by accrued interest from June 1 to November 1.d. increased by accrued interest from May 1 to June 1.37. Theoretically, the costs of issuing bonds could bea. expensed when incurred.b. reported as a reduction of the bond liability.c. debited to a deferred charge account and amortized over the life of the bonds.d. any of these answers are correct.38. The printing costs and legal fees associated with the issuance of bonds shoulda. be expensed when incurred.b. be reported as a deduction from the face amount of bonds payable.c. be accumulated in a deferred charge account and amortized over the life of the bonds.d. not be reported as an expense until the period the bonds mature or are retired.39. Treasury bonds should be shown on the balance sheet asa. an asset.b. a deduction from bonds payable issued to arrive at net bonds payable and outstanding.c. a reduction of stockholders' equity.d. both an asset and a liability.40. An early extinguishment of bonds payable, which were originally issued at a premium, ismade by purchase of the bonds between interest dates. At the time of reacquisitiona. any costs of issuing the bonds must be amortized up to the purchase date.b. the premium must be amortized up to the purchase date.c. interest must be accrued from the last interest date to the purchase date.d. All of these answers are correct.41. The generally accepted method of accounting for gains or losses from the earlyextinguishment of debt treats any gain or loss asa. an adjustment to the cost basis of the asset obtained by the debt issue.b. an amount that should be considered a cash adjustment to the cost of any other debtissued over the remaining life of the old debt instrument.c. an amount received or paid to obtain a new debt instrument and, as such, should beamortized over the life of the new debt.d. a difference between the reacquisition price and the net carrying amount of the debtwhich should be recognized in the period of redemption.P42. "In-substance defeasance" is a term used to refer to an arrangement wherebya. a company gets another company to cover its payments due on long-term debt.b. a governmental unit issues debt instruments to corporations.c. a company provides for the future repayment of a long-term debt by placingpurchased securities in an irrevocable trust.d. a company legally extinguishes debt before its due date.P43. A corporation borrowed money from a bank to build a building. The long-term note signed by the corporation is secured by a mortgage that pledges title to the building as security for the loan. The corporation is to pay the bank $80,000 each year for 10 years to repay the loan. Which of the following relationships can you expect to apply to the situation?a. The balance of mortgage payable at a given balance sheet date will be reported as along-term liability.b. The balance of mortgage payable will remain a constant amount over the 10-yearperiod.c. The amount of interest expense will decrease each period the loan is outstanding, whilethe portion of the annual payment applied to the loan principal will increase each period.d. The amount of interest expense will remain constant over the 10-year period.S44. A debt instrument with no ready market is exchanged for property whose fair value is currently indeterminable. When such a transaction takes placea. the present value of the debt instrument must be approximated using an imputedinterest rate.b. it should not be recorded on the books of either party until the fair value of the propertybecomes evident.c. the board of directors of the entity receiving the property should estimate a value forthe property that will serve as a basis for the transaction.d. the directors of both entities involved in the transaction should negotiate a value to beassigned to the property.45. When a note payable is exchanged for property, goods, or services, the stated interestrate is presumed to be fair unlessa. no interest rate is stated.b. the stated interest rate is unreasonable.c. the stated face amount of the note is materially different from the current cash salesprice for similar items or from current fair value of the note.d. any of these answers are correct.46. Which of the following arguments is presented by FASB to explain why a gain is recordedby a company when its creditworthiness is becoming worse?a. The shareholders’ loss is the debtholder s’ gain.b. The income of the company will increase as the amount of interest payment willreduce.c. The decrease in market rate will increase the value of equity shares.d. The debtholders’loss is the shareholders’ gain.47. If a company chooses the fair value option, a decrease in the fair value of the liability isrecorded by creditinga. Bonds Payable.b. Gain on Restructuring of Debt.c. Unrealized Holding Gain/Loss-Income.d. None of these answers are correct.48. A project financing arrangement refers to:a. an arrangement where a company creates a special-purpose entity to perform aspecial project.b. an arrangement where a company borrows from its subsidiary to finance a project.c. an arrangement where a company promises future repayment by placing purchasedassets in an irrevocable trust.d. an arrangement where a company finances a project from a sinking fund establishedfor bond repayments.S49. When a business enterprise enters into what is referred to as off-balance-sheet financing, the companya. is attempting to conceal the debt from shareholders by having no information aboutthe debt included in the balance sheet.b. wishes to confine all information related to the debt to the income statement and thestatement of cash flow.c. can enhance the quality of its financial position and perhaps permit credit to beobtained more readily and at less cost.d. is in violation of generally accepted accounting principles.S50. Long-term debt that matures within one year and is to be converted into stock should be reporteda. as a current liability.b. in a special section between liabilities and stockholders’ equity.c. as noncurrent.d. as noncurrent and accompanied with a note explaining the method to be used in itsliquidation.51. Which of the following must be disclosed relative to long-term debt maturities and sinkingfund requirements?a. The present value of future payments for sinking fund requirements and long-termdebt maturities during each of the next five years.b. The present value of scheduled interest payments on long-term debt during each ofthe next five years.c. The amount of scheduled interest payments on long-term debt during each of the nextfive years.d. The amount of future payments for sinking fund requirements and long-term debtmaturities during each of the next five years.52. Note disclosures for long-term debt generally include all of the following excepta. assets pledged as security.b. call provisions and conversion privileges.c. restrictions imposed by the creditor.d. names of specific creditors.53. The times interest earned ratio is computed by dividinga. net income by interest expense.b. income before taxes by interest expense.c. income before income taxes and interest expense by interest expense.d. net income and interest expense by interest expense.54. The debt to assets ratio is computed by dividinga. current liabilities by total assets.b. long-term liabilities by total assets.c. total liabilities by total assets.d. total assets by total liabilities.*55. In a troubled debt restructuring in which the debt is continued with modified terms and the carrying amount of the debt is less than the total future cash flows,a. a loss should be recognized by the debtor.b. a gain should be recognized by the debtor.c. a new effective-interest rate must be computed.d. no interest expense or revenue should be recognized in the future.*56. A troubled debt restructuring will generally result in aa. loss by the debtor and a gain by the creditor.b. loss by both the debtor and the creditor.c. gain by both the debtor and the creditor.d. gain by the debtor and a loss by the creditor.*57. In a troubled debt restructuring in which the debt is restructured by a transfer of assets with a fair value less than the carrying amount of the debt, the debtor would recognizea. no gain or loss on the restructuring.b. a gain on the restructuring.c. a loss on the restructuring.d. None of these answers are correct.*58. In a troubled debt restructuring in which the debt is continued with modified terms, a gain should be recognized at the date of restructure, but no interest expense should be recognized over the remaining life of the debt, whenever thea. carrying amount of the pre-restructure debt is less than the total future cash flows.b. carrying amount of the pre-restructure debt is greater than the total future cash flows.c. present value of the pre-restructure debt is less than the present value of the futurecash flows.d. present value of the pre-restructure debt is greater than the present value of the futurecash flows.*59. In a troubled debt restructuring in which the debt is continued with modified terms and the carrying amount of the debt is less than the total future cash flows, the creditor shoulda. compute a new effective-interest rate.b. not recognize a loss.c. calculate its loss using the historical effective rate of the loan.d. calculate its loss using the current effective rate of the loan.Solutions to those Multiple Choice questions for which the answer is ―none of these.‖30. multiply $5,000 by the table value for 20 periods and 4% from the present value of anannuity table.MULTIPLE CHOICE—ComputationalUse the following information for questions 60 through 62:On January 1, 2014, Ellison Co. issued eight-year bonds with a face value of $4,000,000 and a stated interest rate of 6%, payable semiannually on June 30 and December 31. The bonds were sold to yield 8%. Table values are:Present value of 1 for 8 periods at 6% ......................................... .627Present value of 1 for 8 periods at 8% ......................................... .540Present value of 1 for 16 periods at 3% ....................................... .623Present value of 1 for 16 periods at 4% ....................................... .534Present value of annuity for 8 periods at 6% ................................ 6.210Present value of annuity for 8 periods at 8% ................................ 5.747Present value of annuity for 16 periods at 3% .............................. 12.561Present value of annuity for 16 periods at 4% .............................. 11.65260. The present value of the principal isa. $2,136,000.b. $2,160,000.c. $2,492,000.d. $2,508,000.61. The present value of the interest isa. $1,379,280.b. $1,398,240.c. $1,490,400.d. $1,507,320.62. The issue price of the bonds isa. $3,534,240.b. $3,539,280.c. $3,558,240.d. $3,998,400.January 1, 2014. The bonds pay interest semiannually on June 30 and December 31. The bonds are issued to yield 5%. What are the proceeds from the bond issue?a. $4,000,000b. $4,173,195c. $4,175,047d. $4,173,84764. Feller Company issues $15,000,000 of 10-year, 9% bonds on March 1, 2014 at 97 plusaccrued interest. The bonds are dated January 1, 2014, and pay interest on June 30 and December 31. What is the total cash received on the issue date?a. $14,550,000b. $15,337,500c. $14,775,000d. $14,325,00065. Everhart Company issues $20,000,000, 6%, 5-year bonds dated January 1, 2014 onJanuary 1, 2014. The bonds pay interest semiannually on June 30 and December 31. The bonds are issued to yield 5%. What are the proceeds from the bond issue?a. $20,000,000b. $20,865,976c. $20,875,236d. $20,869,23266. Farmer Company issues $25,000,000 of 10-year, 9% bonds on March 1, 2014 at 97 plusaccrued interest. The bonds are dated January 1, 2014, and pay interest on June 30 and December 31. What is the total cash received on the issue date?a. $24,250,000b. $25,562,500c. $24,625,000d. $23,875,000。

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