高性能电子产品说明书
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050-7272 R e v A 10-2004
MAXIMUM RATINGS
All Ratings: T C = 25°C unless otherwise specified.
Power MOS V ® is a new generation of high voltage N-Channel enhancement mode power MOSFETs. This new technology minimizes the JFET effect,increases packing density and reduces the on-resistance. Power MOS V ®also achieves faster switching speeds through optimized gate layout.
•Faster Switching •Avalanche Energy Rated •Lower Leakage
•TO-247 or Surface Mount D 3Pak
•Fast Recovery Body Diode
APT4014BVFR APT4014SVFR
400V
28A
0.140Ω
POWER MOS V
®
DYNAMIC CHARACTERISTICS
APT4014BVFR_SVFR
050-7272 R e v A 10-2004
Z θ
J C , T H E R M A L I M P E D A N C E (°C /W )10-5
10-4
10-310-210-1 1.010RECTANGULAR PULSE DURATION (SECONDS)
FIGURE 1, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs PULSE DURATION
0.5
0.10.05
0.010.005
0.001
SOURCE-DRAIN DIODE RATINGS AND CHARACTERISTICS
Characteristic / Test Conditions Continuous Source Current (Body Diode)Pulsed Source Current 1 (Body Diode)Diode Forward Voltage 2 (V GS = 0V, I S = -28A)Peak Diode Recovery dv /dt 5Reverse Recovery Time (I S = -28A, di /dt = 100A/µs)Reverse Recovery Charge (I S = -28A, di /dt = 100A/µs)Peak Recovery Current (I S = -28A, di /dt = 100A/µs)
Symbol I S I SM V SD
dv /dt
t rr Q rr I RRM
UNIT Amps Volts V/ns ns µC Amps
Symbol C iss C oss C rss Q g Q gs Q gd t d (on)t r t d (off)t f
Characteristic Input Capacitance Output Capacitance
Reverse Transfer Capacitance Total Gate Charge 3Gate-Source Charge Gate-Drain ("Miller") Charge Turn-on Delay Time Rise Time
Turn-off Delay Time Fall Time
Test Conditions
V GS = 0V V DS = 25V f = 1 MHz V GS = 10V V DD = 200V I D = 28A @ 25°C V GS = 15V V DD = 200V I D = 28A @ 25°C R G = 1.6Ω
MIN
TYP
MAX
360056023016020701210478
UNIT pF
nC
ns MIN TYP MAX 281121.315T j = 25°C 250T j = 125°C 500
T j = 25°C 1.3T j = 125°C 4.5T j = 25°C 12T j = 125°C
18
THERMAL CHARACTERISTICS
Symbol R θJC R θJA
MIN
TYP
MAX
0.4240
UNIT °C/W
Characteristic Junction to Case Junction to Ambient
1Repetitive Rating: Pulse width limited by maximum junction
3See MIL-STD-750 Method 3471
temperature.4Starting T j = +25°C, L = 3.32mH, R G = 25Ω, Peak I L
= 28A 2Pulse Test: Pulse width < 380 µs, Duty Cycle < 2%5dv /dt
numbers reflect the limitations of the test circuit rather than the
device itself. I S ≤ -I D [Cont.]
di /dt ≤ 700A/µs V R ≤ V DSS
T J ≤ 150°C
APT Reserves the right to change, without notice, the specifications and information contained herein.