67-22R6G6C-B092T;中文规格书,Datasheet资料

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PT204-6B;中文规格书,Datasheet资料

Everlight Electronics Co., Ltd. http:\\ Rev 1 Page: 1 of 7Technical Data Sheet3mm Phototransistor T-1PT204-6BFeatures․Fast response time ․High photo sensitivity ․Pb Free․The product itself will remain within RoHS compliant version.Descriptions․PT204-6B is a high speed and high sensitive NPN silicon phototransistor molded in a standard 3 mm package.Due to its black epoxy the device is sensitive to infrared radiation.Applications․Infrared applied system ․Camera ․Printer․Cockroach catcherDevice Selection Guide Chip LED Part No.MaterialLens ColorPT204-6B Silicon BlackPT204-6BAbsolute Maximum Ratings (Ta=25℃)Parameter Symbol RatingUnitsCollector-Emitter Voltage V CEO 30 VEmitter-Collector-Voltage V ECO 5 VCollector Current I C 20 mAOperating Temperature Topr -25 ~ +85℃℃Storage Temperature Tstg -40 ~ +85℃℃Lead Soldering Temperature Tsol 260 ℃Power Dissipation at (orPc 75 mWbelow)25℃Free Air TemperatureNotes: *1:Soldering time≦5 seconds.Everlight Electronics Co., Ltd. http:\\ Rev 1 Page: 2 of 7Everlight Electronics Co., Ltd. http:\\ Rev 1 Page: 3 of 7PT204-6BElectro-Optical Characteristics (Ta=25℃)Parameter SymbolCondition Min. Typ. Max. Units Collector – Emitter Breakdown Voltage BV CEO I C =100μAEe=0mW/cm 230 --- --- V Emitter-Collector Breakdown Voltage BV ECO I E =100μAEe=0mW/cm 2 5--- --- VCollector-Emitter Saturation Voltage V CE)(sat)I C =2mA Ee=1mW/cm 2--- --- 0.4VRise Time t r--- 15 ---Fall Timet f V CE =5VI C =1mARL=1000Ω--- 15 --- μSCollector Dark Current I CEOEe=0mW/cm 2V CE =20V --- --- 100 nA On State Collector Current I C(on)Ee=1mW/cm 2V CE =5V 0.7 --- 5.07 mAWavelength of Peak Sensitivityλp --- --- 940 --- nm Rang of Spectral Bandwidthλ0.5--- --- 760-1100 --- nmRankings ParameterSymbolMinMaxUnitTest ConditionG0.7 1.9 H 1.14 2.6 J 1.77 3.61KI C(ON) 2.67 5.07mAV CE =5VEe=1mW/c ㎡PT204-6BReliability Test Item And ConditionThe reliability of products shall be satisfied with items listed below.Confidence level：90%Everlight Electronics Co., Ltd. http:\\ Rev 1 Page: 6 of 7PT204-6B Packing Quantity Specificationconsent.Everlight Electronics Co., Ltd. http:\\ Rev 1 Page: 7 of 7分销商库存信息: EVERLIGHTPT204-6B。

LTC3706EGN#PBF;LTC3706EGN#TRPBF;LTC3706IGN#PBF;LTC3706IGN#TRPBF;中文规格书,Datasheet资料

13706fdTYPICAL APPLICATIONDESCRIPTIONForward Controller with PolyPhase CapabilityThe L TC ®3706 is a PolyPhase capable secondary-side controller for synchronous forward converters. When used in conjunction with the L TC3705 gate driver and primary-side controller , the part creates a complete isolated power supply that combines the power of PolyPhase operation with the speed of secondary-side control.The L TC3706 has been designed to simplify the design of highly efficient, secondary-side forward converters. Working in concert with the L TC3705, the L TC3706 forms a robust, self-starting converter that eliminates the need for the separate bias regulator that is commonly used in secondary-side control applications. In addition, a pro-prietary scheme is used to multiplex gate drive signals and DC bias power across the isolation barrier through a single, tiny pulse transformer .The L TC3706 provides remote sensing, accurate power good and overvoltage monitoring circuits to support preci-sion, high current applications. A linear regulator controller with thermal protection is also provided to simplify the generation of secondary-side bias voltage.The L TC3706 is available in a 24-lead SSOP package.36V-72V to 3.3V/20A Isolated Forward ConverterFEATURESAPPLICATIONSnIsolated 48V Telecommunication Systems n Internet Servers and Routersn Distributed Power Step-Down Converters nAutomotive and Heavy EquipmentnSecondary-Side Control for Fast T ransient Response n Self-Starting Architecture Eliminates Need for Separate Bias Regulatorn Proprietary Gate Drive Encoding Scheme Reduces System Complexityn PolyPhase ® Operation Reduces C INRequirements n Current Mode Control Ensures Current Sharing n PLL Fixed Frequency: 100kHz to 500kHz n ±1% Output Voltage Accuracy n T rue Remote Sense Differential Amplifier n Power Good Output Voltage Monitor n High Voltage Linear Regulator Controller n Wide Supply Range: 5V to 30Vn Available in a Narrow 24-Lead SSOP PackageV IN –V IN +3OUT –OUT +L , L T , L TC, L TM, PolyPhase, Burst Mode, Linear Technology and the Linear logo are registered trademarks and No R SENSE and ThinSOT are trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. Protected by U.S. Patents including 6144194, other patents pending./23706fdPIN CONFIGURATIONABSOLUTE MAXIMUM RATINGSV CC ........................................................... –0.3V to 10V V IN ........................................................... –0.3V to 33V SW ............................................................... –5V to 50V NDRV ......................................................... –0.3V to 13V ITH, RUN/SS, V SOUT , V S +, V S –, REGSD ....... –0.3V to 7VAll Other Pins ............................................ –0.3V to 10VOperating Temperature Range (Note 2) LTC3706E GN .......................................–40°C to 85°C LTC3706IGN ........................................–40°C to 85°C Junction Temperature (Note 3) ............................ 125°C Storage Temperature Range ..................–65°C to 150°C Lead Temperature (Soldering, 10 sec) ...................300°C(Note 1)ORDER INFORMATIONLEAD FREE FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE L TC3706EGN#PBF L TC3706EGN#TRPBF L TC3706EGN 24-Lead Plastic SSOP –40°C to 85°C L TC3706IGN#PBF L TC3706IGN#TRPBF L TC3706IGN 24-Lead Plastic SSOP –40°C to 85°C LEAD BASED FINISH TAPE AND REEL PART MARKING PACKAGE DESCRIPTION TEMPERATURE RANGE L TC3706EGN L TC3706EGN#TR L TC3706EGN 24-Lead Plastic SSOP –40°C to 85°C L TC3706IGNL TC3706IGN#TRL TC3706IGN24-Lead Plastic SSOP–40°C to 85°CConsult L TC Marketing for parts specified with wider operating temperature ranges.For more information on lead free part marking, go to: http://www.linear .com/leadfree/For more information on tape and reel specifications, go to: http://www.linear .com/tapeandreel//ELECTRICAL CHARACTERISTICSThel indicates specifications which apply over the full operating temperature range, otherwise specifications are at T A = 25°C. V CC = 7V, V IN = 15V, GND = PGND = 0V, unless otherwise noted.SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS Main Control LoopV FB Regulated Feedback Voltage(Note 4) ITH = 1.2V l0.5940.6000.606V I FB Feedback Input Current(Note 4)2100nA ∆V FB(LINREG)Feedback Voltage Line Regulation V IN = 6V to 30V, ITH = 1.2V0.001%/V ∆V FB(LOADREG)Feedback Voltage Load Regulation Measured in Servo Loop,ITH = 0.5V to 2Vl–0.01–0.1%V ISMAX Maximum Current Sense Threshold R SENSE Mode, 0V < V IS– < 5VV IS– = V CC, 0V < V IS+ < 2V (CT Mode)681.15781.28881.4mVVV ISOC Over-Current Shutdown Threshold R SENSE Mode, 0V < V IS– < 5VV IS– = V CC, 0V < V IS+ < 2V (CT Mode)871.451001.651131.85mVVg m T ransconductance Amplifier g m 2.40 2.75 3.10mS I RUN/SS(C)Soft-Start Charge Current V RUN/SS = 2V–4–5–6µA I RUN/SS(D)Soft-Start Discharge Current3µA V RUN/SS RUN/SS Pin On Threshold V RUN/SS Rising l0.40.450.5V t ON,MIN Minimum On-Time200ns FG, SG R UP FG, SG Driver Pull-Up On Resistance FG, SG Low 1.5 2.7ΩFG, SG R DOWN FG, SG Driver Pull-Down On Resistance FG, SG High 1.5 2.7ΩPT+, PT– R UP PT+, PT– Driver Pull-Up Resistance PT+, PT– Low 1.5 2.7ΩPT+, PT– R DOWN PT+, PT– Driver Pull-Down Resistance PT+, PT– High 1.5 2.7Ω∆V FB(OV)Output Overvoltage Threshold V FB Rising151719% V CC SupplyV CCOP Operating Voltage Range510V V CCREG Regulated Output Voltage 6.67.07.4VI CC Supply CurrentOperatingShutdown f OSC = 200kHz (Note 5)V RUN/SS = GND4.2240mAµAV UVLO UV Lockout V CC Rising l 4.52 4.60 4.70V V HYS UV Hysteresis0.4V V IN SupplyV INOP Operating Voltage Range530VI IN Supply CurrentNormal ModeShutdown f OSC = 200kHzV RUN/SS = GND900460µAµAV INUVLO UV Lockout V IN Rising l 3.90 4.30 4.51V V INHYS0.2V V REGSD REGSD Shutdown Threshold V REGSD Rising4Vg m,REGSD REGSD T ransconductance5µS /33706fd43706fdELECTRICAL CHARACTERISTICS Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime.Note 2: The L TC3706E is guaranteed to meet the performance specifica-tions over the 0°C to 85°C operating temperature range. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls. The L TC3706I is guaranteed and tested over the full –40°C to 85°C operating temperature range.Note 3: Junction temperature T J (in °C) is calculated from the ambient tem-perature T A and the average power dissipation P D (in Watts) by the formula: T J = T A + θJA • P DRefer to the Applications Information section for details.Note 4: The L TC3706 is tested in a feedback loop that servos V FB to a voltage near the internal 0.6V reference voltage to obtain the specified ITH voltage (V ITH = 1.2V).Note 5: Operating supply current is measured in test mode. Dynamic supply current is higher due to the internal gate charge being delivered at the switching frequency. See the Typical Performance Characteristics section.SYMBOL PARAMETERCONDITIONSMINTYP MAXUNITSOscillator and Phase-Locked LoopI FS FS/SYNC Pin Sourcing Current 20µA f LOW Oscillator Low Frequency Set Point V FS/SYNC = GND 165200235kHz f HIGH Oscillator High Frequency Set Point V FS/SYNC = VCC247300353kHz ∆f (R FS )Oscillator Resistor Set Accuracy 75kΩ < R FS/SYNC < 175kΩ–2220%f PLL(MAX)Maximum PLL Sync Frequency 500kHz f PLL(MIN)Minimum PLL Sync Frequency75kHzPGOOD Output V FBH /0.6Power Good Upper Threshold V FB Rising 115117119%V FBL1/0.6Power Good Lower Threshold V FB Rising 91.59394.5%V FBL2/0.6Power Good Lower Threshold V FB Falling89.59192.5%Differential Amplifier (V SENSE AMP)ADA GainV S – = GND, 1V ≤ V S + ≤ 5V0.9901 1.010V/V CMRR DA Common Mode Rejection Ratio 75dB R IN Input Resistance 80kΩf BW–3dB Bandwidth3MHzThe l indicates specifications which apply over the full operatingtemperature range, otherwise specifications are at T A = 25°C. V CC = 7V, V IN = 15V, GND = PGND = 0V, unless otherwise noted./53706fdTYPICAL PERFORMANCE CHARACTERISTICSMaximum Current Sense RUN/SS ON Threshold Oscillator Frequency T A = 25°C, unless otherwise noted.Maximum Current Sense IS Pins Source Current V CC Supply Current V CC Regulator Output Voltage Maximum Current Sense /63706fdGate Driver On-Resistance TYPICAL PERFORMANCE CHARACTERISTICST A = 25°C, unless otherwise noted.Undervoltage Lockout REGSD Shutdown Threshold /PIN FUNCTIONSSG (Pin 1): Gate Drive for the “Synchronous” MOSFET. FG (Pin 2): Gate Drive for the “Forward” MOSFET. PGOOD (Pin 3): Open-Drain Power Good Output. The FBpin is monitored to ensure that the output is in regulation. When the output is not in regulation, the PGOOD pin is pulled low.MODE (Pin 4): Tie to either GND or V CC to set the maxi-mum duty cycle at either 50% or 75% respectively. Tie to ground through either a 200k or 100k resistor (50% or 75% maximum duty cycle) to disable pulse encoding. In this mode, normal PWM signals will be generated at the PT+ pin, while a clock signal is generated at the PT– pin. PHASE (Pin 5): Control Input to the Phase Selector. This pin determines the phasing of the controller CLK relative to the synchronizing signal at the FS/SYNC pin.FB (Pin 6): The Inverting Input of the Main Loop Error Amplifier.ITH (Pin 7): The Output of the Main Loop Error Amplifier. Place compensation components between the ITH pin and GND.RUN/SS (Pin 8): Combination Run Control and Soft-Start Inputs. A capacitor to ground sets the ramp time of the output voltage. Holding this pin below 0.4V causes the IC to shut down all internal circuitry.V SOUT, V S+, V S– (Pins 9, 10, 11): V SOUT is the output of a precision, unity-gain differential amplifier. Tie V S+ and V S– to the output of the main DC/DC converter to achieve true remote differential sensing. This allows DCR error effects to be minimized.GND (Pin 12): Signal Ground.FS/SYNC (Pin 13): Combination Frequency Set and SYNC pin. Tie to GND or V CC to run at 200kHz and 300kHz respectively. Place a single resistor to ground at this pin to set the frequency between 100kHz and 500kHz. To synchronize, drive this pin with a clock signal to achieve PLL synchronization from 75kHz to 500kHz. Sources 20µA of current.SLP (Pin 14): Slope Compensation Input. Place a single resistor to ground to set the desired amount of slope compensation.I S– (Pin 15): Negative Input to the Current Sense Circuit. When using current sense transformers, this pin may be tied to V CC for single-ended sensing with a 1.28V maximum current trip level.I S+ (Pin 16): Positive Input to the Current Sense Circuit. Connect to the positive end of a current sense resistor or to the output of a current sense transformer. REGSD (Pin 17):T his p in i s u sed t o p revent o verheating o f t he external linear regulator pass device that generates the V CC supply voltage from the V IN voltage. A current proportional to the voltage across the external pass device flows out of this pin. The IC shuts down the linear regulator when the voltage on this pin exceeds 4V. Place a resistor (or a resistor and capacitor in parallel) between this pin and GND to limit the temperature rise of the external pass device. NDRV (Pin 18): Drive Output for the External Pass Device of the V CC Linear Regulator. Connect to the base (NPN) or gate (NMOS) of an external N-type device.V IN (Pin 19): Connect to a higher voltage bias supply, typically the output of a peak detected bias winding. When not used, tie together with the V CC and NDRV pins.SW (Pin 20): Connect to the drain of the “synchronous” MOSFET. This input is used for adaptive shoot-through prevention and leading edge blanking.PT–, PT+ (Pins 21, 22): Pulse T ransformer Driver Outputs. For most applications, these connect to a pulse trans-former (with a series DC blocking capacitor). The PWM information is multiplexed together with DC power and sent through a single pulse transformer to the primary side. This information may be decoded by the L TC3705 gate driver and primary-side controller.PGND (Pin 23): Gate Driver Ground Pin.V CC (Pin 24): Main V CC Input for all Driver and Control Circuitry./73706fdBLOCK DIAGRAM83706fd/OPERATIONMain Control LoopThe L TC3706 is designed to work in a constant frequency, current mode 2-transistor forward converter. During normal operation, the primary-side MOSFETs (both top and bottom) are “clocked” on together with the forward MOSFET on the secondary side. This applies the reflected input voltage across the inductor on the secondary side. When the current in the inductor has ramped up to the peak value as commanded by the voltage on the ITH pin, the current sense comparator is tripped, turning off the primary-side and forward MOSFE Ts. To avoid turning on the synchronous MOSFET prematurely and causing shoot-through, the voltage on the SW pin is monitored. This voltage will usually fall below 0V soon after the primary-side MOSFETs have turned completely off. When this condition is detected, the synchronous MOSFET is quickly turned on, causing the inductor current to ramp back downwards. The error amplifier senses the output voltage, and adjusts the ITH voltage to obtain the peak current needed to maintain the desired main-loop output voltage. The L TC3706 always operates in a continuous current, synchronous switching mode. This ensures a rapid transient response as well as a stable bias supply voltage at light loads. A maximum duty cycle (either 50% or 75%) is internally set via clock dividers to prevent saturation of the main transformer. In the event of an overvoltage on the output, the synchronous MOSFET is quickly turned on to help protect critical loads from damage.Gate Drive EncodingSince the L TC3706 controller resides on the secondary side of an isolation barrier, communication to the primary-side power MOSFETs is generally done through a transformer. Moreover, it is often necessary to generate a low voltage bias supply for the primary-side gate drive circuitry. In order to reduce the number of isolated windings present in the system, the L TC3706 uses a proprietary scheme to encode the PWM gate drive information and multiplex it together with bias power for the primary-side drive and control, using a single pulse transformer. Note that, unlike optoisolators and other modulation techniques, this multiplexing scheme does not introduce a significant time delay into the system.For most forward converter applications, the PT+ and PT– outputs will contain a pulse-encoded PWM signal. These outputs are driven in a complementary fashion with an essentially constant 50% duty cycle. This results in a stable volt-second balance as well as an efficient transfer of bias power across the pulse transformer. As shown in Figure 1, the beginning of the positive half-cycle coincides with the turn-on of the primary-side MOSFETs. Likewise, the beginning of the negative half-cycle coincides with the maximum duty cycle (forced turn-off of primary switches). At the appropriate time during the positive half-cycle, the end of the on-time (PWM going LOW) is signaled by briefly applying a zero volt differential across the pulse transformer. Figure 1 illustrates the operation of this multiplexing scheme.The L TC3705 primary-side controller and gate driver will decode this PWM information as well as extract the power needed for primary-side gate drive.Figure 1. Gate Drive Encoding Scheme (V MODE = GND)DUTY CYCLE = 15%V PT1+ – V PT1DUTY CYCLE = 0%/93706fd103706fdOPERATIONvalues using the SLP pin as shown in Table 1. Note that the amount of slope compensation doubles when the duty cycle exceeds 50%.Table 1SLP PIN SLOPE (D < 0.5)SLOPE (D > 0.5)GND 0.05 • I SMAX • f OSC0.1 • I SMAX • f OSCV CCNone None 400kΩ to GND 0.1 • I SMAX • f OSC 0.2 • I SMAX • f OSC 200kΩ to GND 0.15 • I SMAX • f OSC 0.3 • I SMAX • f OSC 100kΩ to GND 0.25 • I SMAX • f OSC 0.5 • I SMAX • f OSC 50kΩ to GND0.5 • I SMAX • f OSC1.0 • I SMAX • f OSCIn Table 1 above, I SMAX is the maximum current limit, and f OSC is the switching frequency.Current Sensing and Current LimitFor current sensing, the L TC3706 supports either a current sense resistor or a current sense transformer . The current sense resistor may either be placed in series with the inductor (either high side or ground lead sensing), or in the source of the “forward” switch. If a current sense transformer is used, the I S – input should be tied to V CC and the I S + pin to the output of the current sense transformer . This causes the gain of the internal current sense amplifier to be reduced by a factor of 16×, so that the maximum current sense voltage (current limit) is increased from 78mV to 1.28V . An internal, adaptive leading edge blanking circuit ensures clean operation for “switch” current sensing applications.Current limit is achieved in the L TC3706 by limiting the maximum voltage excursion of the error signal (ITH volt-age). Note that if slope compensation is used, the precise value at which current limit occurs will be a function of duty cycle (See the Typical Performance Characteristics section). If a short circuit is applied, an independent overcurrent comparator may be tripped. In this case, the L TC3706 will enter a “hiccup” mode using the soft-start circuitry.Self-Starting ArchitectureWhen the LTC3706 is used in conjunction with the LTC3705 primary-side controller and gate driver , a complete self-starting isolated supply is formed. When input voltage is first applied in such an application, the L TC3705 will begin switching in an “open-loop” fashion, causing the main output to slowly ramp upwards. This is the primary-side soft-start mode. On the secondary side, the L TC3706 derives its operating bias voltage from a peak-charged capacitor . This peak-charged voltage will rise more rapidly than the main output of the converter , so that the L TC3706 will become operational well before the output voltage has reached its final value.When the L TC3706 has adequate operating voltage, it will begin the procedure of assuming control from the primary side. To do this, it first measures the voltage on the power supply’s main output and then automatically advances its own soft-start voltage to correspond to the main output voltage. This ensures that the output voltage increases monotonically as the soft-start control is transferred from primary to secondary. The L TC3706 then begins sending PWM signals to the L TC3705 on the primary side through a pulse transformer . When the L TC3705 has detected a stable signal from the secondary controller , it transfers control of the primary switches over to the L TC3706, beginning the secondary-side soft-start mode. The L TC3706 continues in this mode until the output voltage has ramped up to its final value. If for any reason, the L TC3706 either stops sending (or initially fails to send) PWM information to the L TC3705, the L TC3705 will detect a FAUL T and initiate a soft-start retry. (See the L TC3705 data sheet.) Slope CompensationSlope compensation is added at the input of the PWM comparator to improve stability and noise margin of the peak current control loop. The amount of slope compen-sation can be selected from one of five preprogrammed/分销商库存信息:LINEAR-TECHNOLOGYLTC3706EGN#PBF LTC3706EGN#TRPBF LTC3706IGN#PBF LTC3706IGN#TRPBF。

数据手册_HR6P60HL_Datasheet_C V2.2

关于芯片的开发环境
海尔 MCU 芯片具有完整的软/硬件开发环境，并受知识产权保护。选择上海海尔集成电路有限公司或其指定的第三方公司的汇编器、编译器、编程器、硬件仿真器开发环境，必须遵循与芯片相关的规定和说明。
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关于芯片的 ESD 防护措施
海尔 MCU 芯片具有满足工业级 ESD 标准保护电路。建议用户根据芯片存储/应用的环境采取适当静电防护措施。应注意应用环境的湿度；建议避免使用容易产生静电的绝缘体；存放和运输应在抗静电容器、抗静电屏蔽袋或导电材料容器中；包括工作台在内的所有测试和测量工具必须保证接地；操作者应该佩戴静电消除手腕环手套，不能用手直接接触芯片等。
HR6P60HL 数据手册
海尔 MCU 芯片使用注意事项
关于芯片的上/下电海尔 MCU 芯片具有独立电源管脚。当 MCU 芯片应用在多电源供电系统时，应先对 MCU 芯片上电，再对系统其他部件上电；反之，下电时，先对系统其他部件下电，再对 MCU 芯片下电。若操作顺序相反则
可能导致芯片内部元件过压或过流，从而导致芯片故障或元件退化。具体可参照芯Hale Waihona Puke 的数据手册说明。关于芯片的时钟
海尔 MCU 芯片具有内部和外部时钟源。内部时钟源会随着温度、电压变化而偏移，可能会影响时钟源精度；外部时钟源采用陶瓷、晶体振荡器电路时，建议使能起振延时；使用 RC 振荡电路时，需考虑电容、电阻匹配；采用外部有源晶振或时钟输入时，需考虑输入高/低电平电压。具体可参照芯片的数据手册说明。
3. 2
第 4 章 4. 1 4. 2 4. 3 4. 4 4. 5

11-22-R6G6C-A01-2T中文资料

Technical Data SheetChip LED with Bi-Color (Multi-Color)11-22/R6G6C-A01/2T Features․Package in 8mm tape on 7〞diameter reel.․Compatible with automatic placement equipment.․Compatible with infrared and vapor phase reflowsolder process.․Multi-color type.․Pb-free.․The product itself will remain within RoHScompliant version.Descriptions․The 11-22 SMD Taping is much smallerthan lead frame type components, thusenable smaller board size, higher packingdensity, reduced storage space and finallysmaller equipment to be obtained.․Besides, lightweight makes them ideal forminiature applications. etc.Applications․Automotive: backlighting in dashboard and switch.․Telecommunication: indicator and backlighting intelephone and fax.․Flat backlight for LCD, switch and symbol.․General use.Device Selection GuideChipLens ColorColorType Material EmittedRedR6 AlGaInP BrilliantWater Clear G6 AlGaInP Brilliant Yellow Green11-22/R6G6C-A01/2T Package Outline DimensionsNote: The tolerances unless mentioned is ±0.1mm,Unit = mm11-22/R6G6C-A01/2TAbsolute Maximum Ratings (Ta=25℃)Parameter SymbolRating Unit Reverse Voltage V R 5 VForward Current I F R6:25G6:25mAOperating Temperature Topr -40 ~ +85 ℃Storage Temperature Tstg -40 ~ +90 ℃Soldering Temperature Tsol 260 (for 5 second)℃Electrostatic Discharge(HBM) ESD 2000 VPower Dissipation Pd R6:60G6:60mWPeak Forward Current (Duty 1/10 @1KHz) I FPR6:60G6:60mASoldering Temperature Tsol Reflow Soldering : 260 ℃for 10 sec. Hand Soldering : 350 ℃for 3 sec.11-22/R6G6C-A01/2TElectro-Optical Characteristics (Ta=25℃)Parameter Symbol Min. Typ. Max. Unit ConditionLuminous Intensity Iv R6G61404522572----------mcdViewing Angle2θ1/2----- 60 ----- degPeak Wavelength λp R6G6-----632575----- nmDominant Wavelengthλd R6G6 ----------624573----------nmSpectrum Radiation Bandwidth △λR6G6-----2020-----nmForward Voltage V F 1.7 2.0 2.4 VI F=20mA Reverse Current I R ----- ----- 10 μA V R=5V11-22/R6G6C-A01/2T Typical Electro-Optical Characteristics CurvesR611-22/R6G6C-A01/2T Typical Electro-Optical Characteristics CurvesG611-22/R6G6C-A01/2T Label explanationCAT:Luminous Intensity RankHUE: Dom. Wavelength RankREF:Forward Voltage RankReel DimensionsNote: The tolerances unless mentioned is ±0.1mm ,Unit = mm11-22/R6G6C-A01/2T Carrier Tape Dimensions: Loaded quantity 2000 PCS per reelNote: The tolerances unless mentioned is ±0.1mm ,Unit = mm11-22/R6G6C-A01/2TReliability Test Items And ConditionsThe reliability of products shall be satisfied with items listed below. Confidence level ：90% LTPD ：10%No. Items Test Condition Test Hours/Cycles SampleSizeAc/Re1 Reflow Soldering Temp. : 260℃±5℃Min. 5sec. 6 Min.22 PCS.0/1 2 Temperature Cycle H : +100℃ 15min∫ 5 minL : -40℃ 15min 300 Cycles 22 PCS.0/13 Thermal Shock H : +100℃ 5min∫ 10 secL : -10℃ 5min300 Cycles 22 PCS.0/1 4High TemperatureStorageTemp. : 100℃ 1000 Hrs. 22 PCS.0/1 5Low TemperatureStorage Temp. : -40℃ 1000 Hrs. 22 PCS.0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS.0/1 7High Temperature / High Humidity85℃/ 85%RH1000 Hrs.22 PCS.0/111-22/R6G6C-A01/2TPrecautions For Use1. Over-current-proofCustomer must apply resistors for protection, otherwise slight voltage shift will cause bigcurrent change ( Burn out will happen ).2. Storage2.1 Do not open moisture proof bag before the products are ready to use.2.2 Before opening the package: The LEDs should be kept at 30℃or less and 90%RH or less.2.3 After opening the package: The LED's floor life is 1 year under 30 deg C or less and 60% RH or less.If unused LEDs remain, it should be stored in moisture proof packages.2.4 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded thestorage time, baking treatment should be performed using the following conditions.Baking treatment : 60±5℃for 24 hours.3. Soldering Condition3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times.3.3 When soldering, do not put stress on the LEDs during heating.3.4 After soldering, do not warp the circuit board.元器件交易网EVERLIGHT ELECTRONICS CO.,LTD.11-22/R6G6C-A01/2T4.Soldering Iron Each terminal is to go to the tip of soldering iron temperature less than 350℃ for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder. 5.Repairing Repair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing.EVERLIGHT ELECTRONICS CO., LTD. Office: No 25, Lane 76, Sec 3, Chung Yang Rd, Tucheng, Taipei 236, Taiwan, R.O.CTel: 886-2-2267-2000, 2267-9936 Fax: 886-2267-6244, 2267-6189, 2267-6306 Everlight Electronics Co., Ltd. Device No. : DSE-112-C01 Prepared date: 22-Sep-2005Rev. 1Page: 11 of 11Prepared by: Ashley Kuo.。

ME 67 系统 K6 电源适配器模块的说明书

ME 67 BedienungsanleitungInstructions for useMikrofonmodul passend zum Speiseadapter K6 oder K6P. Technische DatenÜbertragungsbereich40 - 20000 Hz ± 2,5 dBß5 Richtcharakterstik Keule / Superniere Freifeldleerlaufübertragungsfaktor50 mV/Pa ± 2,5 dB Ersatzgeräuschpegel10 dB (nach DIN IEC 651)21 dB (nach CCIR 468-3) Grenzschalldruck bei K = 1%125 dB(A) bei 1 kHz Abmessungen in mm343 x 22,5Gewicht100 gMicrophone module suitable for powering module K6 or K6P. Technical dataFrequency response40 - 20000 Hz ± 2.5 dBß5 Pick-up pattern supercardioid / lobe Free field no-load sensitivity50 mV/Pa ± 2.5 dB Equivalent sound pressure level10 dB (as per DIN IEC 651)21 dB (as per CCIR 468-3) Max. sound pressure level for K = 1%125 dB(A) for 1 kHz Dimensions in mm221 x 22.5Weight100 gModule microphone pour l’adaptateur d’alimenation K6 ou K6P. Caractéristiques techniquesBande passante40 - 20000 Hz ± 2,5 dBß5 Directivitésupercardioïde / lobe Facteur de transmission à vide50 mV/Pa ± 2,5 dB Volume sonore équivalent10 dB (selon DIN IEC 651)21 dB (selon CCIR 468-3) Limite de pression acoustique à K = 1% 125 dB(A) à 1 kHz Dimensions en mm221 x 22,5Poids100 gModulo microfono adatto all’adattatore di alimentazione K6 o K6P. DatI tecniciGamma di frequenza40 - 20000 Hz ± 2,5 dB Direttivitàsupercardioide / clava Coefficiente di transmissione a vuoto50 mV/Pa ± 2,5 dBLivello di rumore equivalente10 dB (secondo DIN IEC 651)21 dB (secondo CCIR 468-3) Pressione acustica limite a K = 1%125 dB(A) a 1 kHz Dimensioni in mm343 x 22,5Peso100 gModulo micrófono para el adaptador de alimentación K6 o K6P. Caracteristicas tecnicasGama de frecuencia40 - 20000 Hz ± 2,5 dB Directividad supercardioide / lobular Factor de transmisión en vacío50 mV/Pa ± 2,5 dB Volumen sonoro equivalente10 dB (según DIN IEC 651)21 dB (según CCIR 468-3)Límite de presión acústica a K = 1%125 dB(A) a 1 kHz Dimensiones en mm343 x 22,5Peso100 gMikrofoonmoduul behorend bij de netadapter K6 of K6P. Technische gegevensWeergavebereik40 - 20000 Hz ± 2,5 dB Richtkarakteristiek Supernier / keul Onbelaste werking frequ.-faktor veld50 mV/Pa ± 2,5 dB Vervangend geluidsdrukniveau10 dB (volgens DIN IEC 651)21 dB (volgens CCIR 468-3) Max. geluidsdrukniveau bij K = 1%125 dB(A) bij 1 kHz Afmetingen in mm343 x 22,5Gewicht100 gSoll-Frequenzgang (0° und 90°) / PolardiagrammNominal frequency response (0° und 90°) / Pick-up patternRéponse en fréquence (0° und 90°) / Diagramme de la directivitéRisposta in frequenza (0° und 90°) / Diagramma polare Respuesta en frecuencia (0° und 90°) / Diagrama de la directividad Ingestelde frequentiekarakteristiek (0° und 90°) / PooldiagrammenSennheiser electronic GmbH & Co. KG30900 Wedemark, GermanyPhone +49 (5130) 600 0Printed in Germany Fax +49 (5130) 600 300Publ. 12/06 52759/A01。

omron g6b功率继电器说明书

项目
负载
电阻负载
感性负载（cosφ=0.4、L/R=7ms）
接触结构
接点材质
额定负载
AC250V 5A(3A) DC 30V 5A(3A)
AC250V 2A(2A) DC 30V 2A(2A)
额定通电电流
5A(5A)
接点电压的最大值
接点电流的最大值
5A(5A)
注1. （）内的值为-FD的场合。 2. 感性负载、电源负载请使用接点不粗糙的-FD型。
G6B-1174P(C)-US G6B-1177P(C)-ND-US G6B-1174P(C)-FD-US G6B-1177P(C)-FD-ND-US
电阻负载
感性负载（cosφ=0.4、L/R=7ms）单
Ag合金
AC250V 8A(5A) DC 30V 8A(5A)
AC250V 2A(2A) DC 30V 2A(2A)
额定电压(V)
(mA)
线圈电阻 (Ω)
动作电压 (V)
复位电压 (V)
5
40
116
DCG12来自19.761070%以下
10%以上
6
24
11.3
2,120
B 注1. 额定电流、线圈电阻是线圈温度在+23℃时的值，公差为±10%。
2. 动作特性为线圈温度在+23℃时的值。
3. 最大允许电压为继电器线圈能承受的电压的最大值。
5
6 DC
12
24
额定电流 (mA)
40 33.3 16.7
8.3
线圈电阻 (Ω) 125 180 720 2.880
动作电压 (V)
70%以下
复位电压最大容许电压消耗功率

DMP2160U-7;中文规格书,Datasheet资料

Symbol Min
BVDSS
-20
IDSS
⎯
IGSS
⎯ ⎯
VGS(th)
-0.4
Static Drain-Source On-Resistance
RDS (ON)
⎯
Forward Transconductance Diode Forward Voltage (Note 5) DYNAMIC CHARACTERISTICS (Note 6)
• Battery Charging • Power Management Functions • DC-DC Converters • Portable Power Adaptors
Features and Benefits
• Low On-Resistance • 75 mΩ @ VGS = -4.5V • 96 mΩ @ VGS = -2.5V • 140 mΩ @ VGS = -1.8V
Solderable per MIL-STD-202, Method 208 • Weight: 0.008 grams (approximate)
SOT23 Top View
Drain
Gate Source
Internal Schematic
D
G
S
Top View
Ordering Information (Note 3)
Packaging 3000/Tape & Reel
Marking Information
Date Code Key Year Code
Month Code
DMF
YM
DMF = Marking Code YM = Date Code Marking Y = Year (ex: V = 2008) M = Month (ex: 9 = September)

MPS6726中文资料

A
R P F L
B
SEATING PLANE
NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. DIMENSION F APPLIES BETWEEN P AND L. DIMENSIONS D AND J APPLY BETWEEN L AND K MIMIMUM. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. INCHES MIN MAX 0.175 0.205 0.290 0.310 0.125 0.165 0.018 0.022 0.016 0.019 0.045 0.055 0.095 0.105 0.018 0.024 0.500 ––– 0.250 ––– 0.080 0.105 ––– 0.100 0.135 ––– 0.135 ––– MILLIMETERS MIN MAX 4.44 5.21 7.37 7.87 3.18 4.19 0.46 0.56 0.41 0.48 1.15 1.39 2.42 2.66 0.46 0.61 12.70 ––– 6.35 ––– 2.04 2.66 ––– 2.54 3.43 ––– 3.43 –––
1 2 3
CASE 29–05, STYLE 1 TO–92 (TO–226AE)
THERMAL CHARACTERISTICS
Characteristic Thermal Resistance, Junction to Ambient Thermal Resistance, Junction to Case Symbol RqJA RqJC Max 125 50 Unit °C/W °C/W

symbia intevo6ct参数

symbia intevo6ct参数下载提示：该文档是本店铺精心编制而成的，希望大家下载后，能够帮助大家解决实际问题。

文档下载后可定制修改，请根据实际需要进行调整和使用，谢谢!本店铺为大家提供各种类型的实用资料，如教育随笔、日记赏析、句子摘抄、古诗大全、经典美文、话题作文、工作总结、词语解析、文案摘录、其他资料等等，想了解不同资料格式和写法，敬请关注!Download tips: This document is carefully compiled by this editor. I hope that after you download it, it can help you solve practical problems. The document can be customized and modified after downloading, please adjust and use it according to actual needs, thank you! In addition, this shop provides you with various types of practical materials, such as educational essays, diary appreciation, sentence excerpts, ancient poems, classic articles, topic composition, work summary, word parsing, copy excerpts, other materials and so on, want to know different data formats and writing methods, please pay attention!标题：探索Symbia Intevo 6CT参数：优势与应用导言近年来，医学影像技术取得了巨大的进步，其中计算机断层扫描（CT）技术在临床诊断和研究中扮演着至关重要的角色。

cre2269p规格书

cre2269p规格书摘要：一、CRE2269P规格书简介二、CRE2269P主要性能参数1.电源电压2.工作温度3.存储温度4.湿度范围5.尺寸和重量三、CRE2269P功能特点1.高速数据传输2.稳定性能3.低功耗4.抗干扰能力四、CRE2269P应用领域1.工业自动化2.智能家居3.通信设备4.航空航天五、CRE2269P的选购与使用注意事项1.选购要点2.使用注意事项六、CRE2269P售后服务与技术支持正文：一、CRE2269P规格书简介CRE2269P是一款高性能、高可靠性的电子产品。

本规格书详细介绍了CRE2269P的各项性能参数、功能特点以及应用领域。

通过对本规格书的阅读，用户可以全面了解CRE2269P的产品特性，为选购和使用提供参考。

二、CRE2269P主要性能参数1.电源电压：CRE2269P适用于宽电压范围，可在12V-70V的电压下正常工作。

2.工作温度：CRE2269P具有良好的温度适应性，可在-40℃至+85℃的环境下稳定工作。

3.存储温度：CRE2269P的存储温度范围为-55℃至+125℃。

4.湿度范围：CRE2269P具有较高的湿度耐受能力，可在5%至95%的相对湿度下正常工作。

5.尺寸和重量：CRE2269P的产品尺寸和重量可根据客户需求定制，以满足不同应用场景的需求。

三、CRE2269P功能特点1.高速数据传输：CRE2269P支持高速数据传输，可满足各类高速通信、工业自动化等应用场景的需求。

2.稳定性能：CRE2269P采用高性能电路设计，具有良好的抗干扰能力和稳定性，确保产品在恶劣环境下仍能正常工作。

3.低功耗：CRE2269P采用低功耗设计，有效降低能耗，延长产品使用寿命。

4.抗干扰能力：CRE2269P具备较强的抗干扰能力，可有效抵御电磁干扰、射频干扰等，确保产品在复杂环境中的稳定性。

四、CRE2269P应用领域1.工业自动化：CRE2269P可应用于工业自动化领域，如机器人、生产线等，提高生产效率。

G6中文样本_201007

类激光性能 LED光源技术，光点更亮更精确 1 金属螺纹安装孔，安装简便且坚固 2 施克ASIC芯片，抗环境光干扰和传感器互相干扰大旋钮方便调节指示灯大而明亮
(0.11)
3
28.5 (1.12) 25.4 (1.00) 31.5 (1.24)
4 6
L
5
D
2.8
(0.30)
7.6
(0.38)
9.7
(0.04)
*L*
订货号 6025888 6025889 6025890 6025894 6025895 6025896
订货号 6025891 6025892 6025893 6025897 6025898 6025899 4/blk 3/blu 22.8 (0.9)
针脚 3 3 3 4 4 4 2/wht 1/brn
brn 1 blu 3 blk 4
L+ M Q
6
SICK
2010-xx-xx
如有更改,不另行通知
G6
技术数据最大检测距离检测范围配合使用光点，光源类型光点直径偏光滤镜供电电压纹波能耗开关输出输出电压PNP 高/低输出电压NPN 高/低输出方式最大输出电流Iamax 响应时间切换频率连接方式 VDE防护等级电流保护 7.2 m 6m 反射镜 PL80A LED红光, 650 nm 1) 8 mm，距离 350 mm 处 12 ... 24 V DC 2) ± 10 % 3) ≤ 30 mA 4) NPN: 集电极开路: Q PNP: Q VS - 3 V/ 约. 0 V 约 . VS/3 V 亮通/暗通旋钮 100 mA < 625 μs 5) 1 kHz 6) 电缆 PVC, 2 m 7) M8插头，4针电源极性反接保护/ 输入输出短路保护/ 输出过流和短路保护 IP 67 -25 °C ... +55 °C -40 °C ... +70 °C M8 插头型，约 20g 2m 电缆型，约 60g ABS, PC, PMMA 反射镜 P250, 安装支架

MBRD660CTT4G;MBRD620CTT4G;MBRD640CTT4G;MBRD660CTRLG;MBRD660CTG;中文规格书,Datasheet资料

I F(AV) , AVERAGE FORWARD CURRENT (AMPS) 8.0 RATED VOLTAGE APPLIED 7.0 6.0 5.0 4.0 3.0 2.0 1.0 0 80 90 100 110 120 130 140 150 160 TC, CASE TEMPERATURE (C) SINE WAVE OR SQUARE WAVE RqJC = 6C/W TJ = 150C
dc
Figure 4. Current Derating, Case, Per Leg
I F(AV) , AVERAGE FORWARD CURRENT (AMPS)
4.0 3.5 3.0 2.5 2.0 1.5 VR = 60 V 1.0 0.5 0 0 20
TJ = 150C
RqJA = 80C/W SURFACE MOUNTED ON MIN. PAD SIZE RECOMMENDED dc SQUARE WAVE OR SINE WAVE
MAXIMUM RATINGS
MBRD/NRVBD/SBR Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current TC = 130C (Rated VR) Per Diode Per Device Peak Repetitive Forward Current, TC = 130C (Rated VR, Square Wave, 20 kHz) Per Diode Nonrepetitive Peak Surge Current − (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Peak Repetitive Reverse Surge Current (2 ms, 1 kHz) Operating Junction Temperature (Note 1) Storage Temperature Voltage Rate of Change (Rated VR) Symbol VRRM VRWM VR IF(AV) 3 6 IFRM 6 IFSM IRRM TJ Tstg dv/dt 75 1 −65 to +175 −65 to +175 10,000 A A C C V/ms A 620CT 20 630CT 30 640CT 40 650CT 50 660CT 60 Unit V

SC622资料

POWER MANAGEMENT SC622LED Light Management UnitCharge Pump, 400mA Flash LED, DualLDOs, and SemWire TM Interface FeaturesInput supply voltage range — 3.0V to 5.5V Charge pump modes — 1x, 1.5x and 2x Flash LED — 400mA max in fl ash mode, 250mA max continuous for spotlight Two user-confi gurable 100mA low-noise LDO regulatorsCharge pump frequency — 250kHzSemWire TM single wire interface — up to 75kbit/s External fl ash control pin to sync with camera Optional 1s fl ash time outAutomatic sleep mode (LEDs off ) — I Q = 100μA Low shutdown current — 0.1μA (typical)Ultra-thin package — 3mm x 3mm x 0.6mm Fully WEEE and RoHS compliantApplicationsCellular phone fl ashPDA flash Camera I/O and core powerDescriptionThe SC622 is a high effi ciency charge pump LED driver using Semtech’s proprietary mAhXLife TM technology. Performance is optimized for use in single-cell Li-ion battery applications.The charge pump provides continuous or bursted current to a fl ash LED using a dedicated fl ash driver current sink. The load and supply conditions determine whether the charge pump operates in 1x, 1.5x, or 2x mode. A fl ash-timeout feature disables the fl ash if active for longer than 1 second. The SC622 also provides two low-dropout, low-noise linear regulators for powering a camera module or other peripheral circuits.The SC622 uses the proprietary SemWire TM single wire interface. The interface controls all functions of the device, including fl ash current and two LDO voltage outputs. The single wire implementation minimizes microcontroller and interface pin counts. The fl ash/spotlight output is triggered via either the SemWire interface or a dedicated pin.In sleep mode, the device reduces quiescent current to 100μA while continuing to monitor the serial interface. The two LDOs can be enabled when the device is in sleep mode. Total current reduces to 0.1μA in shutdown.US Patents: 6,504,422; 6,794,926Typical Application CircuitPin Confi gurationMarking InformationOrdering InformationDevicePackageSC622ULTRT (1)(2)MLPQ-UT-20 3×3SC622EVBEvaluation BoardNotes:(1) Available in tape and reel only. A reel contains 3,000 devices.(2) Available in lead-free package only. Device is WEEE and RoHScompliant.yyww = Date Code xxxx = Semtech Lot No.622yyww xxxxExceeding the above specifi cations may result in permanent damage to the device or device malfunction. Operation outside of the parameters specifi ed in the Electrical Characteristics section is not recommended.NOTES:(1) Tested according to JEDEC standard JESD22-A114-B.(2) Calculated from package in still air, mounted to 3” x 4.5”, 4 layer FR4 PCB with thermal vias under the exposed pad per JESD51 standards.Absolute Maximum RatingsVIN (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0VOUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3 to +6.0C1+, C2+ (V) . . . . . . . . . . . . . . . . . . . . . . . -0.3 to (V OUT + 0.3)Pin Voltage — All Other Pins (V) . . . . . . . . . -0.3 to (V IN + 0.3)VOUT Short Circuit Duration . . . . . . . . . . . . . . . . Continuous VLDO1, VLDO2 Short Circuit Duration . . . . . . . Continuous ESD Protection Level (1)(kV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2Recommended Operating ConditionsAmbient Temperature Range (°C) . . . . . . . . -40 < T A < +85VIN (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.0 < V IN < 5.5 VOUT (V) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5 < V OUT < 5.25Thermal InformationThermal Resistance, Junction to Ambient (2) (°C/W) . . . . 35Maximum Junction Temperature (°C) . . . . . . . . . . . . . . +150Storage Temperature Range (°C) . . . . . . . . . . . . -65 to +150Peak IR Reflow Temperature (10s to 30s) (°C) . . . . . . . +260Unless otherwise noted, T A = +25°C for Typ, -40ºC to +85°C for Min and Max, T J(MAX) = 125ºC, V IN = 3.0V to 4.2V, C IN = C 1= C 2= 2.2μF, C OUT = 4.7μF (ESR = 0.03Ω)ParameterSymbol Conditions Min Typ Max UnitsSupply Specifi cations Shutdown CurrentI Q(OFF)Shutdown, V IN = 4.2V 0.12μATotal Quiescent CurrentI QSleep (LDOs off ), SWIF = V IN 100160μASleep (LDOs on), SWIF = V IN ,V IN > (V LDO + 300mV), I LDO < 200mA220340Charge pump in 1x mode 3.8 4.65mACharge pump in 1.5x mode 4.6 5.85Charge pump in 2x mode4.65.85Fault Protection Output Short Circuit Current Limit I OUT(SC)VOUT pin shorted to GND300mA Over-Temperature T OTP 160°C Flash Mode Safety Timer (1)t FL(MAX)Flash sink active0.751.001.25sElectrical CharacteristicsParameterSymbol Conditions Min Typ Max UnitsFault Protection (continued)Charge PumpOver-Voltage ProtectionV OVP VOUT pin open circuit, V OUT = V OVPrising threshold5.35.76.0V Undervoltage LockoutV UVLO Decreasing V IN2.4V V UVLO-HYS300mVCharge Pump Electrical Specifi cationsMaximum Total Output CurrentI OUT(MAX)V IN > 3.4V, V OUT(MAX) = 4.0V 400mA Flash Current Setting I FL Nominal setting for FL 50400mA Flash Current Accuracy I FL_ACC V IN = 3.7V, I FL = 400mA, T A = 25°C -15+15%1x Mode to 1.5x Mode Falling Transition Voltage V TRANS1x I OUT = 100mA, V OUT = 3.3V 3.37V 1.5x Mode to 2x Mode Falling Transition Voltage V TRANS1.5xI OUT = 100mA, V OUT = 4.5V (2)3.3V Current Sink Off -State Leakage Current I BLn V IN = V FL =4.2V 0.11μA Pump Frequencyf PUMPV IN = 3.2V250kHzLDO Electrical Specifi cationsLDO1 Voltage Setting V LDO1Range of nominal settings in 100mV increments 2.5 3.3V LDO2 Voltage Setting V LDO2Range of nominal settings in 100mV increments 1.5 1.8V LDO1, LDO2 Output Voltage AccuracyV LDO1, V LDO2V IN = 3.7V, I LDO = 1mA -3.5±3+3.5%Line RegulationΔV LINELDO1, I LDO1 = 1mA, V OUT = 2.8V2.17.2mV LDO2, I LDO2 = 1mA, V OUT = 1.8V1.34.8Electrical Characteristics (continued)Electrical Characteristics (continued)ParameterSymbolConditionsMinTypMaxUnitsLDO Electrical Specifi cations (continued)Load RegulationΔV LOADV LDO1 = 3.3V, V IN = 3.7V,I LDO1 = 1mA to 100 mA 25mVV LDO2 = 1.8V, V IN = 3.7V, I LDO2 = 1mA to 100 mA20Dropout Voltage (3)V D I LDO1 = 100mA100150mV Current LimitI LIM 200mAPower Supply Rejection RatioPSRR LDO1 2.5V < V LDO1 < 3V, f < 1kHz, C BYP = 22nF, I LDO1 = 50mA,V IN = 3.7V with 0.5V P-P ripple50dBPSRR LDO2 f < 1kHz, C BYP = 22nF, I LDO2 = 50mA, V IN = 3.7V with 0.5V P-P ripple 60Output Voltage Noisee n-LDO1LDO1, 10Hz < f < 100kHz, C BYP = 22nF, C LDO = 1μF,I LDO1 = 50 mA, V IN = 3.7V, 2.5V < V LDO1 < 3V 100μV RMSe n-LDO2LDO2, 10Hz < f < 100kHz, C BYP = 22nF, C LDO = 1μF,I LDO2 = 50 mA, V IN = 3.7V50Minimum Output CapacitorC LDO(MIN)1μFDigital I/O Electrical Specifi cations (FLEN, SWIF)Input High Threshold V IH V IN = 5.5V 1.6V Input Low Threshold V IL V IN = 3.0V 0.4V Input High Current I IH V IN = 5.5V -1+1μA Input Low Current I IL V IN = 5.5V-1+1μA SemWire Bit Rate f SWIF 1075kbit/s SemWire Start-up Time (4)t EN 1ms SemWire Disable Time (5)t DIS 10ms SemWire Data Latch Delay (6)D DL5bitNotes:(1) Once tripped, fl ash output will remain disabled until FLEN pin is cycled or reset via serial interface.(2) Test voltage is V OUT = 4.5V — a relatively extreme LED voltage — to force a transition during test. Typically V OUT = 3.3V for the white LED at100mA.(3) Dropout is defi ned as (V IN - V LDO1) when V LDO1 drops 100mV from nominal. Dropout does not apply to LDO2 since it has a maximum output voltageof 1.8V.(4) The SemWire start-up time is the minimum period that the SWIF pin must be held high to enable the part before commencingcommunication.(5) The SemWire disable time is the minimum period that the SWIF pin must be pulled low to shut the part down.(6) The SemWire data latch delay is the maximum duration after communication has ended before the register is updated.Typical CharacteristicsBattery Current — 250mA SpotlightV OUT =3.47V, I OUT =250mA, 25°C20025030035040045033.23.43.63.844.2VIN (V)B a t t e r yC u r r e n t (m A )Effi ciency — 250mA SpotlightV OUT =3.47V, I OUT =250mA, 25°C50607080901003.03.23.43.63.84.04.2VIN (V)% E f f i c i e n c yBattery Current — 100mA SpotlightV OUT =3.22V, I OUT =100mA, 25°C8010012014016018033.23.43.63.844.2VIN (V)B a t t e r yC u r r e n t (m A )Effi ciency — 100mA SpotlightV OUT =3.22V, I OUT =100mA, 25°C506070809010033.23.43.63.844.2VIN (V)% E f f i c i e n c yBattery Current — 50mA SpotlightV OUT =3.0V, I OUT =50mA, 25°C40455055606533.23.43.63.844.2VIN (V)B a t t e r yC u r r e n t (m A )Effi ciency — 50mA SpotlightV OUT =3.0V, I OUT =50mA, 25°C506070809010033.23.43.63.844.2VIN (V)% E f f i c i e n c yTypical Characteristics (continued)Flash Current — 400mA3103403704004304604903.03.23.43.63.84.04.2V IN (V)F l a s h C u r r e n t (m A )V OUT =3.39V at 25°CSpotlight Current — 50mA474849505152533.03.23.43.63.84.04.2V IN (V)S p o t l i g h t C u r r e n t (m A )V OUT =3.02V at 25°CFlash Current — 300mA2102402703003303603903.03.23.43.63.84.04.2V IN (V)F l a s h C u r r e n t (m A )V OUT =3.58V at 25°CSpotlight Current — 250mA1601902202502803103403.03.23.43.63.84.04.2V IN (V)S p o t l i g h t C u r r e n t (m A )V OUT =3.50V at 25°CPSRR vs. Frequency (LDO2)-70-60-50-40-30-20-10010100100010000Frequency (Hz)P S R R (d B )V IN =3.7V at 25°C, I LDO2=50mA, V LDO2=1.8VPSRR vs. Frequency (LDO1)-70-60-50-40-30-20-10010100100010000Frequency (Hz)P S R R (d B )V IN =3.7V at 25°C, I LDO1=50mA, V LDO1=2.8VTypical Characteristics (continued)Load Regulation (LDO1)-24-16-8081624306090120150I LDO1(mA)O u t p u t V o l t a g e V a r i a t i o n (m V )V LDO1=3.3V, V IN =3.7V, 25°CNoise vs Load Current (LDO1)5060708090100020406080100I LDO1 (mA)N o i s e (μV )V LDO1=2.8V, V IN =3.7V, 25°CLoad Regulation (LDO2)-24-16-8816240306090120150I LDO2(mA)O u t p u t V o l t a g e V a r i a t i o n (m V )V LDO2=1.8V, V IN =3.7V, 25°CNoise vs Load Current (LDO2)20406080100020406080100I LDO2 (mA)N o i s e (μV )V LDO2=1.8V, V IN =3.7V, 25°CLine Regulation (LDO1)-3-2-1123.03.23.43.63.84.04.2V IN (V)O u t p u t V o l t a g e V a r i a t i o n (m V )V LDO1=2.8V, I LDO1=1mA, 25°CLine Regulation (LDO2)-3-2-1123.03.23.43.63.84.04.2V IN (V)O u t p u t V o l t a g e V a r i a t i o n (m V )V LDO2=1.8V, I LDO2=1mA, 25°CTypical Characteristics (continued)Load Transient Response (LDO2) — Falling EdgeTime (200μs/div)V LDO2 (50mV/div)I LDO2(100mA/div)V IN =3.7V, V LDO2=1.8V, I LDO2=100 to 1mALoad Transient Response (LDO1) — Rising EdgeTime (20μs/div)V LDO1 (50mV/div)I LDO1 (100mA/div)VIN =3.7V, V LDO1=2.8V, I LDO1=1 to 100mATime (200μs/div)Load Transient Response (LDO1) — Falling EdgeV IN =3.7V, V LDO1=2.8V, I LDO1=100 to 1mAV LDO1 (50mV/div)I LDO1 (100mA/div)Time (20μs/div)Load Transient Response (LDO2) — Rising EdgeV IN =3.7V, V LDO2=1.8V, I LDO2=1 to 100mAV LDO2 (50mV/div)I LDO2 (100mA/div)Typical Characteristics (continued)Output Short Circuit Current LimitTime (1ms/div)V OUT (1V/div)I OUT (100mA/div)V OUT =0V, V IN =4.2V, 25°CFlash Mode Safety TimerTime (200ms/div)V FLEN (5V/div)V OUT (2V/div)I FL (200mA/div)V IN =3.7V, 25°COutput Open Circuit ProtectionTime (4ms/div)V FL (500mV/div)V OUT (2V/div)I FL (100mA/div )V=3.7V, 25°CFlash Current PulseV FLEN (5V/div)V OUT (2V/div)I FL (200mA/div)I FL =400mA, V IN =3.7V, V OUT =3.7V, 25°CTime (40ms/div)6V0VPin DescriptionsPin #Pin Name Pin Function1C2-Negative connection to bucket capacitor 2 — requires a 2.2μF capacitor connected to C2+ 2PGND Ground pin for high current charge pump and Flash LED driver3FL Current sink output for fl ash LED(s)4NC Unused pin — do not terminate5NC Unused pin — do not terminate6NC Unused pin — do not terminate7NC Unused pin — do not terminate8AGND Analog ground pin — connect to ground and separate from PGND current9GREF Ground reference — connect to ground10FLEN Control pin for fl ash LED(s) — high = ON, low = OFF11SWIF SemWire single wire interface pin — used to enable/disable the device and to set up all internal registers (refer to Register Map and SemWire Interface sections)12NC Unused pin — do not terminate13BYP Bypass pin for voltage reference — connect with a 22nF capacitor to AGND 14LDO2Output of LDO2 — connect with a 1μF capacitor to AGND15LDO1Output of LDO1 — connect with a 1μF capacitor to AGND16VOUT Charge pump output — all LED anode pins should be connected to this pin — requires a 4.7μF capacitor to PGND17C2+Positive connection to bucket capacitor 2 — requires a 2.2μF capacitor connected to C2-18C1+Positive connection to bucket capacitor 1 — requires a 2.2μF capacitor connected to C1-19VIN Battery voltage input — connect with a 2.2μF capacitor to PGND20C1-Negative connection to bucket capacitor 1 — requires a 2.2μF capacitor connected to C1+T THERMAL PAD Thermal pad for heatsinking purposes — connect to ground plane using multiple vias — not connected internallyBlock DiagramC1+C1-C2+C2-VOUT NC NC NC NC FLVIN PGNDLDO2LDO1AGNDBYP SWIF FLEN GREFNCGeneral DescriptionThis design is optimized for handheld applications supplied from a single Li-Ion cell and includes the following key features:A high effi ciency fractional charge pump that supplies power to the fl ash LED An LED fl ash output that provides up to 400mA of momentary current or up to 250mA of continuous spotlight currentTwo adjustable LDOs with outputs ranging from 2.5V to 3.3V for LDO1 and 1.5V to 1.8V for LDO2, adjustable in 100mV incrementsA SemWire single wire interface that provides control of all device functionsHigh Current Fractional Charge PumpThe fl ash output is supported by a high effi ciency, high current fractional charge pump output at the VOUT pin. The charge pump multiplies the input voltage by 1, 1.5, or 2 times. The charge pump switches at a fi xed frequency of 250kHz in 1.5x and 2x modes and is disabled in 1x mode to save power and improve effi ciency.The mode selection circuit automatically selects the 1x, 1.5x or 2x mode based on circuit conditions. Circuit conditions such as low input voltage, high output current, or high LED voltage place a higher demand on the charge pump output. A higher numerical mode may be needed momentarily to maintain regulation at the VOUT pin during intervals of high demand, such as the high current of an LED fl ash or the droop at the VIN pin during a supply voltage transient. The charge pump responds to these momentary high demands, setting the charge pump to the optimum mode (1x, 1.5x or 2x), as needed to deliver the output voltage and load current while optimizing effi ciency. Hysteresis is provided to prevent mode toggling.The charge pump requires two bucket capacitors for low ripple operation. One capacitor must be connected between the C1+ and C1- pins and the other must be connected between the C2+ and C2- pins as shown in the typical application circuit diagram. These capacitors should be equal in value, with a minimum capacitance of••••2.2μF to support the charge pump current requirements. The device also requires a 2.2μF capacitor on the VIN pin and a 4.7μF capacitor on the VOUT pin to minimize noise and support the output drive requirements. Capacitors with X7R or X5R ceramic dielectric are strongly recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coeffi cients make them unsuitable for this application.LED Flash and Spotlight Current SinkA single output current sink is provided to drive both fl ash and spotlight functions. In fl ash mode, this current sink provides up to 400mA for a fl ash LED or array of parallel LEDs . Flash current settings are in 50mA increments from 50mA to 400mA. The FLEN pin directly triggers the FLASH function when pulled high, or it can be wired to VIN to enable software control via the serial interface.In spotlight mode, the output can be set for up to 250mA of continuous current. Settings are available in 50mA increments from 50mA to 250mA. Continuous operation above 250mA is not recommended due to high power dissipation.Flash and Spotlight Safety TimerA safety timer disables the fl ash and spotlight output current sink if the sink remains active for an extended period. The timer protects the SC622 and the LED from high power dissipation that can cause overheating. The timer’s default state is on, but the timer may be disabled via the serial interface to allow continuous output current in spotlight mode. The safety timer aff ects only the FL pin and will turn off the sink after a period of 1 second. The timer may be reset by either forcing the FLEN pin low or by resetting the Flash/Spotlight control bits via the interface.Programmable LDO OutputsTwo low dropout (LDO) regulators are provided for camera module I/O and core power. Each LDO has at least 100mA of available load current with ±3.5% accuracy. The minimum current limit is 200mA, so outputs greater than 100mA are possible at somewhat reduced accuracy.Applications InformationApplications Information (continued)A 1μF, low ESR capacitor should be used as a bypass capacitor on each LDO output to reduce noise and ensure stability. In addition, it is recommended that a minimum 22nF capacitor be connected from the BYP pin to ground to minimize noise and achieve optimum power supply rejection. A larger capacitor can be used for this function, but at the expense of increasing turn-on time. Capacitors with X7R or X5R ceramic dielectric are strongly recommended for their low ESR and superior temperature and voltage characteristics. Y5V capacitors should not be used as their temperature coeffi cients make them unsuitable for this application.Shutdown StateThe device is disabled when the SWIF pin is low. All registers are reset to default condition when SWIF is low.Sleep ModeWhen the LED is off , sleep mode is activated. This is a reduced current mode that helps minimize overall current consumption by turning off the clock and the charge pump while continuing to monitor the serial interface for commands. Both LDOs can be powered up while in sleep mode.SemWire Single Wire Interface FunctionsAll device functions can be controlled via the SemWire single wire interface. The interface is described in detail in the SemWire Interface section of the datasheet.Protection FeaturesThe SC622 provides several protection features to safeguard the device from catastrophic failures. These features include:Output Open Circuit Protection Over-Temperature ProtectionCharge Pump Output Current Limit LDO Current Limit LED Float DetectionOutput Open Circuit ProtectionOver-Voltage Protection (OVP) is provided at the VOUT pin to prevent the charge pump from producing an•••••excessively high output voltage. In the event of an open circuit at VOUT, the charge pump runs in open loop and the voltage rises up to the OVP limit. OVP operation is hysteretic, meaning the charge pump will momentarily turn off until V OUT is suffi ciently reduced. The maximum OVP threshold is 6.0V, allowing the use of a ceramic output capacitor rated at 6.3V with no fear of over-voltage damage.Over-Temperature ProtectionThe Over-Temperature (OT) protection circuit helps prevent the device from overheating and experiencing a catastrophic failure. When the junction temperature exceeds 160 °C, the device goes into thermal shutdown with all outputs disabled until the junction temperature is reduced. All register information is retained during thermal shutdown.Charge Pump Output Current LimitThe device also limits the charge pump current at the VOUT pin. When VOUT is shorted to ground, the typical output current limit is 300mA. The current limiting is triggered by an output under-voltage lockout below 2V. The output returns to normal when the short is removed and VOUT is above 2.5V. Above 2.5V, a typical current limit of 1A applies.LDO Current LimitThe device limits the output currents of LDO1 and LDO2 to help prevent it from overheating and to protect the loads. The minimum limit is 200mA, so load current greater than the rated 100mA can be used with degraded accuracy and larger dropout without tripping the current limit.LED Float DetectionFloat detect is a fault detection feature of the LED current sink output. If the output is programmed to be enabled and an open circuit fault occurs at the current sink output, the output will be disabled to prevent a sustained output OVP condition from occurring due to the resulting open loop.PCB Layout ConsiderationsThe layout diagram in Figure 1 illustrates a proper two-layer PCB layout for the SC622 and supporting components. Following fundamental layout rules is critical for achieving the performance specifi ed in the Electrical Characteristics table. The following guidelines are recommended when developing a PCB layout:Place all bypass and decoupling capacitors — C1, C2, CIN, COUT, CLDO1, CLDO2, and CBYP as close to the device as possible.All charge pump current passes through VIN, VOUT, and the bucket capacitor connection pins. Ensure that all connections to these pins make use of wide traces so that the resistive drop on each connection is minimized.The thermal pad should be connected to the ground plane using multiple vias to ensure proper thermal connection for optimal heat transfer.•••Applications Information (continued)Make all ground connections to a solid ground plane as shown in the example layout (Figure 3).If a ground layer is not feasible, the following groupings should be connected:P GND — CIN, COUT A GND — Ground Pad, CLDO1, CLDO2, CBYPIf no ground plane is available, PG ND and AG ND should be routed back to the negative battery terminal as separate signals using thick traces. Joining the two ground returns at the terminal prevents large pulsed return currents from mixing with the low-noise return currents of the LDOs.Both LDO output traces should be made as wide as possible to minimize resistive losses.••••Figure 1 — Recommended PCB LayoutFigure 2 — Layer 1Figure 3 — Layer 2Register MapAddressD7D6D5D4D3D2D1D0Reset ValueDescription0x020(1)0(1)0(1)FLTO FL_2FL_1FL_0FL/SPLB 0x10Flash/SpotlightControl 0x030(1)LDO2_2LDO2_1LDO2_0LDO1_3LDO1_2LDO1_1LDO1_00x00LDO ControlNotes:(1) 0 = always write a 0 to these bitsRegister and Bit Defi nitionsFlash/Spotlight Control Register (0x02)This register is used to confi gure the fl ash time-out feature, the fl ash or spotlight current, and select fl ash or spotlight current ranges.FLTOThis bit is used to enable the fl ash safety time-out feature. The default state is enabled with FLTO = 1. If this bit is set, the device will turn off the fl ash after a nominal period of 1s . Two ways to re-enable the fl ash function after a safety time-out are:Pull the FLEN pin low to re-enable the fl ash functionClear and re-write FL[2:0]FL[2:0]These bits are used to set the current for the fl ash current sink when confi gured for fl ash or spotlight by the FL/SPLB bit. Bits FL[2:0] set the fl ash or spotlight current, as shown in Table 1.••Table 1 — Flash/Spotlight Control BitsFL_2FL_1FL_0FL/SPLBFlash/Spotlight Current (mA)0000OFF 0010500100100011015010002001010250110025011102500001OFF 0011300(1)0101350(1)0111400(1)1001400(1)1011400(1)1101400(1)1111400(1)Note:(1) When on continuously, the device may reach the temperaturelimit with 300mA and higher.Register and Bit Defi nitions (continued)FL/SPLBThis bit is used to select either the fl ash or spotlight current ranges. If this bit is set, the FL current sink can be used to drive a fl ash of maximum duration 500ms and the current range will be the high (fl ash) current range. If this bit is cleared, the FL current sink can be used to drive a continuous spotlight at a lower current and the current range will be the lower (spotlight) current range, as shown in Table 1.LDO Control Register (0x03)This register is used to enable the LDOs and to set their output voltages.LDO2[2:0]These bits are used to set the output voltage of LDO2, as shown in Table 2.LDO2_2LDO2_1LDO2_0LDO2 Output Voltage000OFF 001 1.8V 010 1.7V 011 1.6V 11.5V 101 through 111 are not usedOFFTable 2 — LDO2 Control BitsLDO1[3:0]These bits set the output voltage of LDO1, as shown in Table 3.LDO1_3LDO1_2LDO1_1LDO1_0LDO1 Output Voltage0000OFF 0001 3.3V 0010 3.2V 0011 3.1V 0100 3.0V 0101 2.9V 0110 2.8V 0111 2.7V 1000 2.6V 112.5V 1010 through 1111 are not usedOFFTable 3 — LDO1 Control BitsSemwire Interface FunctionsThe SWIF pin is a write-only single wire interface. It provides the capability to address up to 32 registers to control device functionality. The protocol for using this interface is described in the following subsections.Driving the SWIF PinThe SWIF pin should be driven by a GPIO from the system microcontroller. The output level can be confi gured as either a push-pull driver (TTL or CMOS levels) or as an open drain driver with an external pull-up resistor.Enabling the DeviceThe SWIF pin must be pulled from low to high for a period of greater than 1ms (t EN ) to enable the device into the sleep state. In the sleep state, the device bandgap is active, UVLO monitoring is active, and the serial interface is monitored for communication.Automatic Sleep State If t he fl ash c urrent s ink i s d isabled, t he d evice a utomatically enters the sleep state in order to minimize the current draw from the battery. When in sleep mode, the charge pump and oscillator are both disabled. The LDOs remain on if enabled.Disabling the DeviceThe SWIF pin must be pulled from high to low for a period greater than 10ms (t DIS ) in order to shut down the device. In this state the device remains disabled until the SWIF pin is pulled high for a period greater than 1ms. All registers return to the default state, resetting all bits to zero except for FLT0, which defaults to one.SemWire Communication Protocol and TimingThe following six step communication sequence controls all device functions when the device is enabled.OSC On — The SWIF pin is toggled low for one bitduration and high for one bit duration in order to enable the oscillator. The oscillator is turned off in the sleep state to minimize quiescent current.Sample — The SWIF pin is toggled low for one bitduration and high for one bit duration. During this time, the device samples the bit rate and determines the bit rate at which the register address and data values that follow will arrive. The sample rate is at least 20 times the bit rate ensuring robust communication synchronization.Start — The SWIF pin is pulled low for one bit duration,which starts communication with the target register.Address — The next 5 bits are the address of thetarget register — MSB fi rst, LSB last.Data — The next 8 bits are the data written to thetarget register — MSB fi rst, LSB last.Standby — After the last data bit is sent, the SWIF pinis pulled high for 5 bit durations to return the device to standby before another data write can take place. If all LEDs are disabled, the device will go back to sleep mode.NOTE: The bit rate must be set by the host controller to a rate that is between the minimum and maximum frequencies listed in the Electrical Characteristics section.1.2.3.4.5.6.SemWire Interface。

ADS62C17EVM;中文规格书,Datasheet资料

ADS62PXXEVMUser's GuideLiterature Number:SLAU237AMay2008–Revised April20092SLAU237A–May2008–Revised April2009Submit Documentation Feedback1Overview (6)1.1ADS62PXX EVM Quick-Start Procedure (6)2Circuit Description (8)2.1Schematic Diagram (8)2.2ADC Circuit Function (8)3TI ADC SPI Control Interface (17)3.1Installing the ADC SPI Control Software (17)3.2Setting Up the EVM for ADC SPI Control (18)3.3Using the TI ADC SPI Interface Software (19)4Connecting to FPGA Platforms (21)4.1TSW1200Capture Board (21)4.2TSW1100 (24)5ADC Evaluation (25)5.1Hardware Selection (25)5.2Coherent Input Frequency Selection (26)6Physical Description (27)6.1PCB Layout (27)6.2Bill of Materials (31)6.3EVM Schematics (33)Important Notices (39)SLAU237A–May2008–Revised April2009Table of Contents3 Submit Documentation FeedbackList of Figures1ADS62PXX Jumpers (8)2ADS62PXX Surface Jumpers (9)3ADS62PXXEVM Power Distribution (10)4CDCE72010EEPROM Configuration Block Diagram (16)5Found New Hardware (17)6Window Logo Testing (18)7Hardware Device Manager (18)8SPI Interface Screen (19)9TSW1200GUI Introduction (21)10Quick-Setup Test Result (22)11ADC Performance With Clock Through Onboard VCXO,CDCE72010and Crystal Filter (23)12ADC Performance With Clock Through Onboard VCXO,CDCE72010Configured for Differential LVPECL Output (24)13Top Silkscreen (27)14Component Side (28)15Power Plane1 (28)16Layer2 (29)17Layer3 (29)18Bottom Side (30)19EVM Schematic,Sheet1 (33)20EVM Schematic,Sheet2 (34)21EVM Schematic,Sheet3 (35)22EVM Schematic,Sheet4 (36)23EVM Schematic,Sheet5 (37)24Breakout Board Schematic,Sheet6 (38)4List of Figures SLAU237A–May2008–Revised April2009Submit Documentation FeedbackList of Tables1Jumper List (7)2EVM Power Supply Jumper Description (11)3EVM Power Supply Options (11)4Analog Input Jumper description (12)5EVM Analog Input Options (13)6Clock Input Jumper Description (14)7EVM Clock Input Options (15)8ADS62PXX Frequently Used Registers (20)9Bill of Materials (31)SLAU237A–May2008–Revised April2009List of Tables5 Submit Documentation FeedbackUser's GuideSLAU237A–May2008–Revised April20091OverviewThis user’s guide gives a general overview of the evaluation module(EVM)and provides a generaldescription of the features and functions to be considered while using this module.This manual isapplicable to the ADS62P42/43/44/45/48/49,ADS62P22/23/24/25/28/29and ADS62C15/17analog todigital converters(ADC),which will be collectively referred to as ADS62PXX.This document should be used in combination with respective ADC data sheet.The ADS62PXX EVM provides a platform forevaluating the analog-to-digital converter(ADC)under various signal,clock,reference and power supply conditions.1.1ADS62PXX EVM Quick-Start ProcedureThe ADS62PXXEVM provides numerous options for providing clock,input frequency and power to the ADC under evaluation.The quick start procedure describes how to quickly get initial results using thedefault configuration of the EVM as it was shipped.The EVM can be put back to default configuration by setting all jumpers to the default positions as described in Table1.The default configuration of the EVM is for the Input Frequency(IF)and the clock input,each to ended input that istransformer-coupled to the ADC.The default configuration for the power supply is to provide a single5V supply to the red banana jack J10,PWR IN.The default configuration for the EVM is to control the modes of operation by jumper settings for parallel input control pins rather than serial SPI control of the register space.The other modes of operation of the EVM are described in the latter sections of this document.If users modify the default jumper settings,this procedure does not apply.A quick-setup procedure for the default configuration of the ADS62PXX follows:1.Verify all the jumper settings against the schematic jumper list in Table1.2.Connect the5V supply between J10(PWR IN)and J12(GND).If you are using the TSW1200forcapture,it also can be used to source5V for the EVM.To use the5V output power of the TSW1200,configure JP8to short1-2,J22to short1-2,and jumper over5V from the banana jacks on theTSW1200to J10on the ADC EVM.Do not connect a voltage source greater than5.5V.3.Switch on power supplies.ing a function generator with50Ωoutput impedance,generate a0V offset,1.5V PP sine-wave clockinto J19.The frequency of the clock must be within the specification for the device speed grade.e a frequency generator with a50Ωoutput impedance,generate a0V offset,–1dBFS-amplitudesine-wave signal into J6(Channel A)or J3(Channel B).This provides a transformer-coupled differential input signal to the ADC.6.Connect the TSW1200or suitable logic analyzer to J8to capture the resulting digital data.If aTSW1200is being used to capture data,follow the additional alphabetically labeled steps.For moredetails,see Connecting to FPGA Platforms,located in this document.a.After installing the TSW1200software and connecting the TSW1200to the USB port,open theTSW1200software.b.Depending on the ADC under evaluation,select from the TI ADC Selection pull-down menu.c.Change the ADC Sample rate and ADC Input frequency to match those of the signal generator.d.After selecting a Single Tone FFT test,press the Capture Data button.Windows is a registered trademark of Microsoft Corporation.6ADS62PXXEVM SLAU237A–May2008–Revised April2009Submit Documentation Feedback OverviewTable1.Jumper ListJumper Function Default Jumper SettingInterface Circuit Operational Amplifier THS4509(Bypassed)SJP1AMP_OUT+1-2SJP2AMP_OUT-1-2JP3THS4509_PD2-3SJP5AMPIN-1-2SJP3AMPIN+No ShuntADC CircuitJP11Parallel1-2JP9SDATA1-2JP10SEN1-2MODE(Internal or External reference and GainJP121-2selection)JP8SCLK1-2JP5CTRL31-2JP6CTRL21-2JP7CTRL11-2JP13No ShuntDFS(Data Format and LVDS/CMOS outputJP143-4interface)JP22SDOUT/SPI-MISO Selection No ShuntClock Interface CircuitJ18VCXO EN No ShuntSJP4CLOCKIN1-2SJP7CLOCKIN,Y0,Y1P SELECT1-2SJP6YIN SELECT1-2SJP8PLL LOCK1-2J15RST(CDC Reset)No ShuntJ14CDC_PWRDWN1-2JP20AUX SEL1-2JP21MODE_SEL1-2Power SupplyJP15ADC VA1-2JP18ADC VD1-2JP16TPS79501INPUT SELECT1-2JP195V_AUX1-2JP17TPS5420INPUT SELECT No ShuntSLAU237A–May2008–Revised April2009ADS62PXXEVM7 Submit Documentation Feedback2Circuit Description 2.1Schematic Diagram2.2ADC CircuitFunctionCircuit Description The schematic diagram for the this EVM is attached at the end of this document.See the schematic or relevant section of this user's guide before changing any jumpers.Selection of various modes of operation of the ADS62PXX EVM is most often controlled by jumpers on the EVM,either by placing shunts on 0.025-inch square jumper posts or by installation of surface mount 0Ωresistors.In general,the use of 0Ωresistors as jumpers are used in the clock or signal path where signal integrity is critical,and jumper posts are used for static or low-speed control paths.Figure 1shows the relative location of the jumpers,connectors,and switches used on the ADS62PXX EVM.Figure 2shows the relative locations of most of the resistors and surface-mount 0Ωjumper locations used on the EVM.In the description of the circuit options in the following sections,each operational mode is accompanied by a table entry that details the jumper or resistor changes that enable that option.Figure 1and Figure 2can assist the user to quickly identify where these jumpers are located on the Figure 1.ADS62PXX Jumpers8ADS62PXXEVMSLAU237A–May 2008–Revised April 2009Submit Documentation Feedback2.2.1ADC Operational Mode Circuit DescriptionFigure 2.ADS62PXX Surface JumpersBy default,the ADC is configured to operate in parallel-mode operation,since jumper (JP11)asserts a 3.3V state to the ADC reset pin.Consequently,the SW1reset pushbutton must be pressed only when the device is configured in serial operation mode.Since the ADC is in parallel operation mode,voltages are used to set the ADC configuration ers can use the information printed on the EVM silkscreen to set the operation modes.SLAU237A–May 2008–Revised April 2009ADS62PXXEVM 9Submit Documentation Feedback2.2.2EVM PowerConnectionsCircuit Description Figure 3.ADS62PXXEVM Power DistributionPower is supplied to the EVM through banana jacks.From this input power,several different ways of delivering power to the ADC and other EVM functions are available.Figure 3shows a simplifiedrepresentation of the power options available for the option is to provide 5V to the red banana jack J10,and from there,the EVM generates 3.3V for the analog supply to the ADC and the necessary digital supply voltage for the populated ADC.The EVM also generates the proper voltages for optional features of the EVM such as the Clock Generation circuitry,the USB circuitry,and the CMOS output buffer.Some ADC devices that may be evaluated on the ADS62PXXEVM platform do not take 1.8V for the digital supply,but rather require 3.3V for the digital supply.For this reason,an adjustable voltage regulator was chosen for the digital supply;the output may be changed to 3.3V by changing the value of a resistor,R269and capacitor C148.The resistor and capacitor need not to be changed in the field unless the ADC isbeing changed,because the EVM ships with the correct digital supply voltage for the ADC that is installed.For reference,ADS62P42/43/44/45,ADS62P22/23/24/25and ADS62C15use 3.3V as digital supply for the ADC whereas ADS62P48/49,ADS62P28/29and ADS62C17use 1.8V as digital supply for the ADC.Power for the optional THS4509operational amplifier is supplied by banana jacks J11and J13.If the amplifier is being evaluated in AC coupled configuration,5V is supplied to J11,and J13is connected to ground.In DC-coupled configuration,4V is supplied to J11and –1V is supplied to J13.Otherwise,these inputs may be left unconnected.Although various power options are available on this EVM,care must be taken while applying power on J10as different options have different voltage ranges specified.Table 2displays the general jumper setting information;Table 3displays the various power option to making any jumper settings,see the schematics located at the end of this document.10ADS62PXXEVMSLAU237A–May 2008–Revised April 2009Submit Documentation Feedback分销商库存信息: TIADS62C17EVM。

PQ6CB11X1CP;中文规格书,Datasheet资料

Notice The content of data sheet is subject to change without prior notice.In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.Features(Unit:mm)Applications1.Mobile phone2.DSC3.PDAPQ6C B11X1CP1.High switching voltage :MAX.30V(capable of driving max 6 LEDs in series connection)2.Switching current: 250mA3.High frequency PWM control :1.2MHz4.High efficiency(efficiency ：90%)5.Built-in overheat, overcurrent protection functions6.Built-in soft start function7.RoHS directive compliantV IN Absolute Maximum RatingsParameterSymbolUnitV V V V V (Ta=25°C)°C °C °C °C6RatingInput voltage Output voltage V O 30Switching voltage V SW 30Control voltage CTRL V IN Feed back voltage FB 6Switching current I SW 250mA Power dissipation Pd 350mW Junction temperature T j 150Operating temperature T opr -40 to +85260(10s)Storage temperature T stg -40 to +150Soldering temperatureT solOperating conditionsParameter SymbolUnit°CRating Operating Junction temperature -40 to +125T jLead finish:Au platingCompact SMD CMOSStep-up LED Driver■ Outline Dimensions2Sheet No.: OP06061Electrical CharacteristicsVmA %ParameterReference voltage Oscillation frequency Overcurrent detection level Maximum dutyCTRL pin bias currentOn-resistance Symbol ConditionsMIN.TYP .MAX.Unit 2-0.8 1.6-0.11-90---90.39599.7301001 1.4-----1.290250----1.7 2.50.051---0.412.726(Unless otherwise specified,condition shall be V IN =VCTRL=3.6V,V O =10V,I O =20mA,Ta=25°C)Input-output voltage range -Efficiency-ON-state voltage for control fo mV nA mA V V ηMHz V REF V CTRL ＝0V D MAX I SD DUTY=70%,Switching current peakμA R ON I SW ＝250mA V C(ON)OVP V IN I ｑSwitching,I O ＝0mA3 LEDsI FB V IN ＝3VI L ΩI LEAK V SW ＝28V,V IN =V CTRL =0VμA V C(OFF)μAI CTRL-5.5Overvoltage detecting level 5pin 2830VOvervoltage detecting hysteresis level OVP(hys)5pin-Quiescent current Stand-by current Error amplifierFB pin bias currentOscllator%Power switch--Leakage currentControl terminalOFF-state voltage for control ---50VV O Block DiagramμFV IN 3.6VO L Example of applicationInput voltage V IN (V)Fig.1 Standard measuring circuitL:VLP4612(TDK CO.,LTD.)D:MA2Z720(MATSUSHITA ELECTRIC INDUSTRIAL CO.,LTD)　Output ONVINLI OO N /OFF control logic 4pin LOW HIG H OPE NOFF OFF100200300400-1.0-0.50.51.060658085100LED current I O (mA)70759095P o w e r d i s s i p a t i o n P d (m W )Ambient temperature Ta (°C)Fig.3 Reference Voltage Fluctuation vs. Junction TemperatureJunction temperature Tj (°C )R e f e r e n c e v o l t a g e f l u c t u a t i o n ΔV R E F (%)Fig.4 Reference Voltage Fluctuation vs. Input voltageR e f e r e n c e v o l t a g e f l u c t u a t i o n ΔV R E F (%)Fig.5 Effciency vs. LED CurrentE f f c i e n c y η (％)Fig.2 Power Dissipation vs.Ambient TemperatureFig.7 Oscillation Frequency Fluctuation vs. Junction TemperatureJunction temperature Tj (°C )O s c i l l a t i o n f r e q u e n c y f l u c t u a t i o n Δf O (%)Junction temperature Tj (°C )Fig.10 Use Range of White LED3.23.63.843Input voltage V IN (V)3.44.260658085100707590950.51.01.52.02.53.03.54.04.55.000.10.20.30.40.50.60.70.80.91.0■　Current-limitFig.6 Effciency vs. Input VoltageE f f c i e n c y η (％)Fig.8 On-Resistance vs. Junction TemperatureO n -r e s i s t a n c e R O N (Ω)Fig.9 ON /OFF-state Voltage for Control vs. Junction TemperatureO N /O F F -s t a t e v o l t a g e f o r c o n t r o l V C (V )Junction temperature Tj (°C )This product monitors the switch current at every cycle and limits the switch current not to exceed the overcurrent detection level.Please set the white LED current under the maximum LED current shown in the graph indicated below within the range of input voltage (V IN ) you use.M a x i m u m L E D c u r r e n t (m A )V IN (V)分销商库存信息:SHARP-MICROELECTRONICS PQ6CB11X1CP。

PA96CE, 规格书,Datasheet 资料

-40 10 100 1K 10K 100K 1M 10M100M FREQUENCY, (Hz)
APPLICATIONS
• PZT DRIVE • MAGNETIC DEFLECTION • PROGRAMMABLE POWER SUPPLIES • 70V LINE AUDIO to 70W
TYPICAL APPLICATION
RF RI + +275V
8-PIN TO-3 PACKAGE STYLE CE
+VS − 12 −VS + 12 +VS − 8 −VS + 8 1.5 200
+VS − 5.6 −VS + 10
250 2 7 1.2 1.6 30
V V V V A V/µS µS Ω °C/W °C/W °C/W °C V mA mA
NOTES: 1. Long term operation at the maximum junction temperature will result in reduced product life. Derate power dissipation to achieve high MTTF. 2. The power supply voltage specified under typical (TYP) applies unless noted as a test condition. 3. +VS and –VS denote the positive and negative supply rail respectively. Total VS is measured from +VS to –VS. 4. Rating applies if the output current alternates between both output transistors at a rate faster than 60Hz.

R9026规格书(中文版)

符号 VCC IVCC VUVLO IST VCS TON(min) VFB2
TSD
测试条件 VCC 灌入 1mA 电流 VCC 灌入电流 VCC 上升，Hys=0.3V VCC 灌入电流 TA=-45℃~85℃ 设计电感值不要低于最大值
最小值 6.1
5
410 500 1
典型值 6.8
5.5 100 420
1，最低输入交流电压，最低输出电压时芯片的供电问题（此时供电最弱），D
，
R4=（1-0.167） =22.49K；
2，最高输入交流电压 260V，最高输出电压 80V（此时供电最强）时，该电阻的功耗问题。此
时D
，该电阻上最大功耗
，
采样电阻
R9026 是一款专用于 LED 非隔离降压型控制器，系统工作在谷底开关模式,只需要很少的外围器件即可实现高精度的恒流输出。芯片逐周期的检测电感上的峰值电流，CS 端连接芯片内部，并与内部 420mV 的电压进行比较，当 CS 达到内部阈值时，系统会关掉外部功率管。
算，VOOVP = 1.4
=128.8V，而 C4 耐压选择必须高于该电压，这里可以选取 200V 电容。
R9026 在进入打嗝模式后，自动检测输出电压,当输出电压低于 VOOVP 时，系统会重新进入正常工作状态。
输出开(短)路保护
R9026 内部集成了输出开(短)路保护，R9026 一旦检测到输出开(短)路，系统会自动进入打嗝模式, 直到开(短)路保护条件除去。
非隔离降压型 LED 驱动器
R9026
特点
无需辅助线圈供电谷底开关，高效率，低 EMI PF 可调节至 0.9 自动补偿电感的感量变化自动适应输出电压变化短路保护温度保护过压保护开路保护外围元件少工作温度：-40 ~ 100℃

CR6PM中文资料

GATE TRIGGER CURRENT VS.
JUNCTION TEMPERATURE
103
7
TYPICAL EXAMPLE
5
3 2
102 7 5
3 2
101 7 5
3 2
100 –40 –20 0 20 40 60 80 100 120 140160
JUNCTION TEMPERATURE (°C)
100 (%)
CASE TEMPERATURE (°C)
TRANSIENT THERMAL IMPEDANCE (°C/W)
MITSUBISHI SEMICONDUCTOR 〈THYRISTOR〉
CR6PM
MEDIUM POWER USE INSULATED TYPE, GLASS PASSIVATION TYPE
Conditions Commercial frequency, sine half wave, 180° conduction, Tc=85°C 60Hz sine half wave 1 full cycle, peak value, non-repetitive Value corresponding to 1 cycle of half wave 60Hz, surge on-state current
3 2
102 7 5
3 2
101 7 5
3 2
100
0
1
2
3
4
5
ON-STATE VOLTAGE (V)
RATED SURGE ON-STATE CURRENT 200 180 160 140 120 100
80 60 40 20
0 100 2 3 4 5 7 101 2 3 4 5 7 102