SN74LVTH646IPWREP, 规格书,Datasheet 资料

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SN74CBT16233DGGR,SN74CBT16233DGVR,SN74CBT16233DLR,规格书,Datasheet 资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74CBT16233DGGRE4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBT16233DGGRG4ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBT16233DGVRE4ACTIVE TVSOP DGV 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74CBT16233DGVRG4ACTIVE TVSOP DGV 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DGGR ACTIVE TSSOP DGG 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DGVR ACTIVE TVSOP DGV 562000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DL ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DLG4ACTIVE SSOP DL 5620Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DLR ACTIVE SSOP DL 561000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74CBT16233DLRG4ACTIVESSOPDL561000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Freeproducts are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.PACKAGE OPTION ADDENDUM18-Sep-2008TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74CBT16233DGGR TSSOP DGG 562000330.024.48.615.6 1.812.024.0Q1SN74CBT16233DGVR TVSOP DGV 562000330.024.4 6.811.7 1.612.024.0Q1SN74CBT16233DLRSSOPDL561000330.032.411.3518.673.116.032.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74CBT16233DGGR TSSOP DGG562000346.0346.041.0 SN74CBT16233DGVR TVSOP DGV562000346.0346.041.0 SN74CBT16233DLR SSOP DL561000346.0346.049.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers AudioData Converters AutomotiveDSP BroadbandClocks and Timers Digital ControlInterface MedicalLogic MilitaryPower Mgmt Optical NetworkingMicrocontrollers SecurityRFID TelephonyRF/IF and ZigBee®Solutions Video&ImagingWirelessMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2008,Texas Instruments Incorporated芯天下--/。

MC74ACT646中文资料

MC74AC646, MC74ACT646 Octal Transceiver/Register with 3-State Outputs (Non-inverting)The MC74AC646/74ACT646 consist of registered bus transceiver circuits, with outputs, D–type flip–flops and control circuitry providing multiplexed transmission of data directly from the input bus or from the internal storage registers. Data on the A or B bus will be loaded into the respective registers on the LOW–to–HIGH transition of the appropriate clock pin (CAB or CBA). The four fundamental data handling functions available are illustrated Figures 1 to 4.•Independent Registers for A and B Buses•Multiplexed Real–Time and Stored Data Transfers •Choice of True and Inverting Data Paths•3–State Outputs•300 mil Slim Dual In–Line Package•Outputs Source/Sink 24 mA•′ACT646 Has TTL Compatible InputsREAL TIME TRANSFERAĆBUS TO BĆBUSREAL TIME TRANSFERDevice Package ShippingORDERING INFORMATIONMC74AC646N PDIP–2415 Units/Rail MC74AC646DW SOIC–2430 Units/Rail MC74ACT646N PDIP–2415 Units/RailMC74AC646DWR2SOIC–241000 T ape & Reel MC74ACT646DW SOIC–2430 Units/Rail MC74ACT646DWR2SOIC–241000 T ape & ReelPIN ASSIGNMENTFigure 6. Logic SymbolCAB DIRCBA A 0TO 7 OTHER CHANNELSNOTE:This diagram is provided only for the understanding of logicoperations and should not be used to estimate propagation delays.Figure 7. Logic Diagram Figure 5. Pinout: 24–Lead Packages Conductors(Top View)1CAB 2SAB 3DIR4A 05A 16A 27A 38A 49A 510A 611A 712GND2423222120191817161413V CC CBA SBA G B 0B 1B 2B 3B 4B 5B 6B 715i.e., data at the bus pins will be stored on every LOW–to–HIGH transition of the appropriate clock inputs.NOTE:H = HIGH Voltage Level; L = LOW Voltage Level; X = Immaterial; = LOW–to–HIGH Transition*Maximum Ratings are those values beyond which damage to the device may occur. Functional operation should be restricted to the Recom-mended Operating Conditions.1.V in from 30% to 70% V CC; see individual Data Sheets for devices that differ from the typical input rise and fall times.2.V in from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.*All outputs loaded; thresholds on input associated with output under test.†Maximum test duration 2.0 ms, one output loaded at a time.NOTE:I IN and I CC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V V CC.*Voltage Range 3.3 V is 3.3 V ±0.3 V. Voltage Range 5.0 V is 5.0 V ±0.5 V.*Voltage Range 3.3 V is 3.3 V ±0.3 V.Voltage Range 5.0 V is 5.0 V ±0.5 V.*All outputs loaded; thresholds on input associated with output under test.†Maximum test duration 2.0 ms, one output loaded at a time.*Voltage Range 5.0 V is 5.0 V ±0.5 V.AC OPERATING REQUIREMENTS*Voltage Range 5.0 V is 5.0 V ±0.5 V.PACKAGE DIMENSIONSPDIP–24N SUFFIX24 PIN PLASTIC DIP PACKAGECASE 724–03ISSUE DNOTES:1.CHAMFERED CONTOUR OPTIONAL.2.DIMENSION L TO CENTER OF LEADS WHEN FORMED PARALLEL.3.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.4.CONTROLLING DIMENSION: INCH.DIM MIN MAX MIN MAX MILLIMETERSINCHES A 1.230 1.26531.2532.13B 0.2500.270 6.35 6.85C 0.1450.175 3.69 4.44D 0.0150.0200.380.51E 0.050 BSC 1.27 BSC F 0.0400.060 1.02 1.52G 0.100 BSC 2.54 BSC J 0.0070.0120.180.30K 0.1100.140 2.80 3.55L 0.300 BSC 7.62 BSC M 0 15 0 15 N0.0200.0400.51 1.01____SO–24DW SUFFIX24 PIN PLASTIC SOIC PACKAGECASE 751E–04ISSUE ENOTES:1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.2.CONTROLLING DIMENSION: MILLIMETER.3.DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION.4.MAXIMUM MOLD PROTRUSION 0.15 (0.006)PER SIDE.5.DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBARPROTRUSION SHALL BE 0.13 (0.005) TOTAL IN EXCESS OF D DIMENSION AT MAXIMUMMATERIAL CONDITION.DIM MIN MAX MIN MAX INCHESMILLIMETERS A 15.2515.540.6010.612B 7.407.600.2920.299C 2.35 2.650.0930.104D 0.350.490.0140.019F 0.410.900.0160.035G 1.27 BSC 0.050 BSC J 0.230.320.0090.013K 0.130.290.0050.011M 0 8 0 8 P 10.0510.550.3950.415R0.250.750.0100.029____NotesNotes11ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. PUBLICATION ORDERING INFORMATIONJAPAN: ON Semiconductor, Japan Customer Focus Center4–32–1 Nishi–Gotanda, Shinagawa–ku, Tokyo, Japan 141–0031Phone: 81–3–5740–2700Email: r14525@。

SN74LVC1G373DBVR,SN74LVC1G373DBVR,SN74LVC1G373DBVR,SN74LVC1G373DCKR, 规格书,Datasheet 资料

DESCRIPTION/ORDERING INFORMATION
This single D-type latch is designed for 1.65-V to 5.5-V VCC operation.
The SN74LVC1G373 is particularly suitable for implementing buffer registers, I/O ports, bidirectional bus drivers, and working registers. While the latch-enable (LE) input is high, the Q outputs follow the data (D) inputs. When LE is taken low, the Q outputs are latched at the logic levels set up at the D inputs.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website at .
– 1000-V Charged-Device Model (C101)
DCK PACKAGE (TOP VIEW)
YZP PACKAGE (BOTTOM VIEW)
LE
1
6 OE
D 34 Q
GND 2 5 VCC
GND
2
5
VCC
LE 1 6 OE
D
3
4Q
See mechanical drawings for dimensions.

74ls04 datasheet

IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. To minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third–party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Mailing Address:Texas InstrumentsPost Office Box 655303Dallas, Texas 75265Copyright 2002, Texas Instruments Incorporated。

74系列各个芯片详细介绍

74系列芯片资料程序匠人发表于 2005-10-29 19:20:00 阅读全文(2477) | 回复(0) | 引用通告(0) | 编辑74系列芯片资料反相器驱动器 LS04 LS05 LS06 LS07 LS125 LS240 LS244 LS245与门与非门 LS00 LS08 LS10 LS11 LS20 LS21 LS27 LS30 LS38或门或非门与或非门 LS02 LS32 LS51 LS64 LS65异或门比较器 LS86译码器 LS138 LS139寄存器 LS74 LS175 LS373反相器:Vcc 6A 6Y 5A 5Y 4A 4Y 六非门 74LS04┌┴─┴─┴─┴─┴─┴─┴┐六非门(OC门) 74LS05_ │14 13 12 11 10 9 8│六非门(OC高压输出) 74LS06Y = A ）││ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1Y 2A 2Y 3A 3Y GND驱动器:Vcc 6A 6Y 5A 5Y 4A 4Y┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│Y = A ）│六驱动器(OC高压输出) 74LS07│ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1Y 2A 2Y 3A 3Y GNDVcc -4C 4A 4Y -3C 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐_ │14 13 12 11 10 9 8│Y =A+C ）│四总线三态门 74LS125│ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘-1C 1A 1Y -2C 2A 2Y GNDVcc -G B1 B2 B3 B4 B8 B6 B7 B8┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8位总线驱动器 74LS245 │20 19 18 17 16 15 14 13 12 11│）│ DIR=1 A=>B│ 1 2 3 4 5 6 7 8 9 10│ DIR=0 B=>A└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘DIR A1 A2 A3 A4 A5 A6 A7 A8 GND页首非门,驱动器与门,与非门或门,或非门异或门,比较器译码器寄存器正逻辑与门,与非门:Vcc 4B 4A 4Y 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│Y = AB ）│ 2输入四正与门 74LS08 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 1Y 2A 2B 2Y GNDVcc 4B 4A 4Y 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐__ │14 13 12 11 10 9 8│Y = AB ）│ 2输入四正与非门 74LS00 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 1Y 2A 2B 2Y GNDVcc 1C 1Y 3C 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐___ │14 13 12 11 10 9 8│Y = ABC ）│ 3输入三正与非门 74LS10 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 2A 2B 2C 2Y GNDVcc H G Y┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│）│ 8输入与非门 74LS30│ 1 2 3 4 5 6 7│ ________└┬─┬─┬─┬─┬─┬─┬┘ Y = ABCDEFGHA B C D E F GND页首非门,驱动器与门,与非门或门,或非门异或门,比较器译码器寄存器正逻辑或门,或非门:Vcc 4B 4A 4Y 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐ 2输入四或门 74LS32│14 13 12 11 10 9 8│）│ Y = A+B│ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 1Y 2A 2B 2Y GNDVcc 4Y 4B 4A 3Y 3B 3A┌┴─┴─┴─┴─┴─┴─┴┐ 2输入四或非门 74LS02│14 13 12 11 10 9 8│ ___）│ Y = A+B│ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1Y 1A 1B 2Y 2A 2B GNDVcc 2Y 2B 2A 2D 2E 1F┌┴─┴─┴─┴─┴─┴─┴┐双与或非门 74S51│14 13 12 11 10 9 8│ _____）│ 2Y = AB+DE│ 1 2 3 4 5 6 7│ _______└┬─┬─┬─┬─┬─┬─┬┘ 1Y = ABC+DEF1Y 1A 1B 1C 1D 1E GNDVcc D C B K J Y┌┴─┴─┴─┴─┴─┴─┴┐ 4-2-3-2与或非门 74S64 74S65(OC门) │14 13 12 11 10 9 8│ ______________）│ Y = ABCD+EF+GHI+JK│ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘A E F G H I GND页首非门,驱动器与门,与非门或门,或非门异或门,比较器译码器寄存器2输入四异或门 74LS86Vcc 4B 4A 4Y 3Y 3B 3A┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│）│ _ _│ 1 2 3 4 5 6 7│ Y=AB+AB└┬─┬─┬─┬─┬─┬─┬┘1A 1B 1Y 2Y 2A 2B GND8*2输入比较器 74LS688_Vcc Y B8 A8 B7 A7 B6 A6 B5 A5┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8*2输入比较器 74LS688│20 19 18 17 16 15 14 13 12 11│）││ 1 2 3 4 5 6 7 8 9 10│└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘CE A1 B1 A2 B2 A3 B3 A4 B4 GND_Y=A1⊙B1+A2⊙B2+A3⊙B3+A4⊙B4+A5⊙B5+A6⊙B6+A7⊙B7+A8⊙B8页首非门,驱动器与门,与非门或门,或非门异或门,比较器译码器寄存器3-8译码器 74LS138Vcc -Y0 -Y1 -Y2 -Y3 -Y4 -Y5 -Y6 __ _ _ _ __ _ _ __ _ _ __ _ ┌┴─┴─┴─┴─┴─┴─┴─┴┐ Y0=A B C Y1=A B B Y2=A B C Y3=A B C │16 15 14 13 12 11 10 9 │）│ __ _ _ __ _ __ _ __│ 1 2 3 4 5 6 7 8│ Y4=A B C Y5=A B C Y6=A B C Y7=A B C └┬─┬─┬─┬─┬─┬─┬─┬┘A B C -CS0 -CS1 CS2 -Y7 GND双2-4译码器 74LS139Vcc -2G 2A 2B -Y0 -Y1 -Y2 -Y3 __ __ __ __ __ __ __ __┌┴─┴─┴─┴─┴─┴─┴─┴┐ Y0=2A 2B Y1=2A 2B Y2=2A 2B Y3=2A 2B │16 15 14 13 12 11 10 9 │）│ __ __ __ __ __ __ __ __│ 1 2 3 4 5 6 7 8│ Y0=1A 1B Y1=1A 1B Y2=1A 1B Y3=1A 1B └┬─┬─┬─┬─┬─┬─┬─┬┘-1G 1A 1B -Y0 -Y1 -Y2 -Y3 GND8*2输入比较器 74LS688_Vcc Y B8 A8 B7 A7 B6 A6 B5 A5┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8*2输入比较器 74LS688│20 19 18 17 16 15 14 13 12 11│）││ 1 2 3 4 5 6 7 8 9 10│└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘CE A1 B1 A2 B2 A3 B3 A4 B4 GND_Y=A1⊙B1+A2⊙B2+A3⊙B3+A4⊙B4+A5⊙B5+A6⊙B6+A7⊙B7+A8⊙B8寄存器:Vcc 2CR 2D 2Ck 2St 2Q -2Q┌┴─┴─┴─┴─┴─┴─┴┐双D触发器 74LS74│14 13 12 11 10 9 8 │）││ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1Cr 1D 1Ck 1St 1Q -1Q GNDVcc 8Q 8D 7D 7Q 6Q 6D 5D 5Q ALE┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8位锁存器 74LS373│20 19 18 17 16 15 14 13 12 11│）││ 1 2 3 4 5 6 7 8 9 10│└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘-OE 1Q 1D 2D 2Q 3Q 3D 4D 4Q GND型号器件名称厂牌[数据表]SN7400四2输入端与非门 TI[DATA]SN7401四2输入端与非门(OC) SN7402四2输入端或非门 TI[DATA]SN7403四2输入端与非门(OC)TI[DATA]SN7404六反相器 TI[DATA]SN7405六反相器(OC)TI[DATA]SN7406六高压输出反相器 (OC,30V)TI[DATA]SN7407六高压输出缓冲,驱动器(OC,30V)TI[DATA]SN7408四2输入端与门 TI[DATA]SN7409四2输入端与门(OC)TI[DATA]SN7410三3输入端与非门 TI[DATA]SN7412三3输入端与非门(OC)TI[DATA]SN7413双4输入端与非门 TI[DATA]SN7414六反相器TI[DATA]SN7416六高压输出反相缓冲/驱动器 I[DATA]SN7417六高压输出缓冲/驱动器(OC,15V)TI[DATA]SN7420双4输入端与非门 TI[DATA]SN7422双4输入端与非门(OC)TI[DATA]SN7423可扩展双4输入端或非门 TI[DATA]SN7425双4输入端或非门TI[DATA]SN7426四2输入端高压输出与非缓冲器 [DATA]SN7427三3输入端或非门TI[DATA]SN7428四2输入端或非缓冲器 I[DATA]SN74308输入端与非门TI[DATA]SN7432四2输入端或门。

SN74CB3T3257PWR,SN74CB3T3257DGVR,SN74CB3T3257PW,SN74CB3T3257PWRE4,规格书,Datasheet 资料

• Control Inputs Can Be Driven by TTL or 5-V/3.3-V CMOS Outputs
• Ioff Supports Partial-Power-Down Mode Operation
• Latch-Up Performance Exceeds 250 mA Per JESD 17
TA –40°C to 85°C
TSSOP – PW TVSOP – DGV
ORDERING INFORMATION
PACKAGE (1)
ORDERABLE PART NUMBER
Tube
SN74CB3T3257PW
Tape and reel
SN74CB3T3257PWR
Tape and reel
SN74CB3T3257DGVR
PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters.
– 5-V/3.3-V Input Down to 2.5-V Output Level Shift With 2.5-V VCC
• 5-V-Tolerant I/Os With Device Powered Up or Powered Down
• Bidirectional Data Flow With Near-Zero Propagation Delay

74系列芯片功能大全

74系列芯片功能大全7400 TTL 2输入端四与非门7401 TTL 集电极开路2输入端四与非门7402 TTL 2输入端四或非门7403 TTL 集电极开路2输入端四与非门7404 TTL 六反相器7405 TTL 集电极开路六反相器7406 TTL 集电极开路六反相高压驱动器7407 TTL 集电极开路六正相高压驱动器7408 TTL 2输入端四与门7409 TTL 集电极开路2输入端四与门7410 TTL 3输入端3与非门74107 TTL 带清除主从双J-K触发器74109 TTL 带预置清除正触发双J-K触发器7411 TTL 3输入端3与门74112 TTL 带预置清除负触发双J-K触发器7412 TTL 开路输出3输入端三与非门74121 TTL 单稳态多谐振荡器74122 TTL 可再触发单稳态多谐振荡器74123 TTL 双可再触发单稳态多谐振荡器74125 TTL 三态输出高有效四总线缓冲门74126 TTL 三态输出低有效四总线缓冲门7413 TTL 4输入端双与非施密特触发器74132 TTL 2输入端四与非施密特触发器74133 TTL 13输入端与非门74136 TTL 四异或门74138 TTL 3-8线译码器/复工器74139 TTL 双2-4线译码器/复工器7414 TTL 六反相施密特触发器74145 TTL BCD—十进制译码/驱动器7415 TTL 开路输出3输入端三与门74150 TTL 16选1数据选择/多路开关74151 TTL 8选1数据选择器74153 TTL 双4选1数据选择器74154 TTL 4线—16线译码器74155 TTL 图腾柱输出译码器/分配器74156 TTL 开路输出译码器/分配器74157 TTL 同相输出四2选1数据选择器74158 TTL 反相输出四2选1数据选择器7416 TTL 开路输出六反相缓冲/驱动器74160 TTL 可预置BCD异步清除计数器74161 TTL 可予制四位二进制异步清除计数器74162 TTL 可预置BCD同步清除计数器74163 TTL 可予制四位二进制同步清除计数器74164 TTL 八位串行入/并行输出移位寄存器74165 TTL 八位并行入/串行输出移位寄存器74166 TTL 八位并入/串出移位寄存器74169 TTL 二进制四位加/减同步计数器7417 TTL 开路输出六同相缓冲/驱动器74170 TTL 开路输出4×4寄存器堆74173 TTL 三态输出四位D型寄存器74174 TTL 带公共时钟和复位六D触发器74175 TTL 带公共时钟和复位四D触发器74180 TTL 9位奇数/偶数发生器/校验器74181 TTL 算术逻辑单元/函数发生器74185 TTL 二进制—BCD代码转换器74190 TTL BCD同步加/减计数器74191 TTL 二进制同步可逆计数器74192 TTL 可预置BCD双时钟可逆计数器74193 TTL 可预置四位二进制双时钟可逆计数器74194 TTL 四位双向通用移位寄存器74195 TTL 四位并行通道移位寄存器74196 TTL 十进制/二-十进制可预置计数锁存器74197 TTL 二进制可预置锁存器/计数器7420 TTL 4输入端双与非门7421 TTL 4输入端双与门7422 TTL 开路输出4输入端双与非门74221 TTL 双/单稳态多谐振荡器74240 TTL 八反相三态缓冲器/线驱动器74241 TTL 八同相三态缓冲器/线驱动器74243 TTL 四同相三态总线收发器74244 TTL 八同相三态缓冲器/线驱动器74245 TTL 八同相三态总线收发器74247 TTL BCD—7段15V输出译码/驱动器74248 TTL BCD—7段译码/升压输出驱动器74249 TTL BCD—7段译码/开路输出驱动器74251 TTL 三态输出8选1数据选择器/复工器74253 TTL 三态输出双4选1数据选择器/复工器74256 TTL 双四位可寻址锁存器74257 TTL 三态原码四2选1数据选择器/复工器74258 TTL 三态反码四2选1数据选择器/复工器74259 TTL 八位可寻址锁存器/3-8线译码器7426 TTL 2输入端高压接口四与非门74260 TTL 5输入端双或非门74266 TTL 2输入端四异或非门7427 TTL 3输入端三或非门74273 TTL 带公共时钟复位八D触发器74279 TTL 四图腾柱输出S-R锁存器7428 TTL 2输入端四或非门缓冲器74283 TTL 4位二进制全加器74290 TTL 二/五分频十进制计数器74293 TTL 二/八分频四位二进制计数器74295 TTL 四位双向通用移位寄存器74298 TTL 四2输入多路带存贮开关74299 TTL 三态输出八位通用移位寄存器7430 TTL 8输入端与非门7432 TTL 2输入端四或门74322 TTL 带符号扩展端八位移位寄存器74323 TTL 三态输出八位双向移位/存贮寄存器7433 TTL 开路输出2输入端四或非缓冲器74347 TTL BCD—7段译码器/驱动器74352 TTL 双4选1数据选择器/复工器74353 TTL 三态输出双4选1数据选择器/复工器74365 TTL 门使能输入三态输出六同相线驱动器74365 TTL 门使能输入三态输出六同相线驱动器74366 TTL 门使能输入三态输出六反相线驱动器74367 TTL 4/2线使能输入三态六同相线驱动器74368 TTL 4/2线使能输入三态六反相线驱动器7437 TTL 开路输出2输入端四与非缓冲器74373 TTL 三态同相八D锁存器74374 TTL 三态反相八D锁存器74375 TTL 4位双稳态锁存器74377 TTL 单边输出公共使能八D锁存器74378 TTL 单边输出公共使能六D锁存器74379 TTL 双边输出公共使能四D锁存器7438 TTL 开路输出2输入端四与非缓冲器74380 TTL 多功能八进制寄存器7439 TTL 开路输出2输入端四与非缓冲器74390 TTL 双十进制计数器74393 TTL 双四位二进制计数器7440 TTL 4输入端双与非缓冲器7442 TTL BCD—十进制代码转换器74352 TTL 双4选1数据选择器/复工器74353 TTL 三态输出双4选1数据选择器/复工器74365 TTL 门使能输入三态输出六同相线驱动器74366 TTL 门使能输入三态输出六反相线驱动器74367 TTL 4/2线使能输入三态六同相线驱动器74368 TTL 4/2线使能输入三态六反相线驱动器7437 TTL 开路输出2输入端四与非缓冲器74373 TTL 三态同相八D锁存器74374 TTL 三态反相八D锁存器74375 TTL 4位双稳态锁存器74377 TTL 单边输出公共使能八D锁存器74378 TTL 单边输出公共使能六D锁存器74379 TTL 双边输出公共使能四D锁存器7438 TTL 开路输出2输入端四与非缓冲器74380 TTL 多功能八进制寄存器7439 TTL 开路输出2输入端四与非缓冲器74390 TTL 双十进制计数器74393 TTL 双四位二进制计数器7440 TTL 4输入端双与非缓冲器7442 TTL BCD—十进制代码转换器74447 TTL BCD—7段译码器/驱动器7445 TTL BCD—十进制代码转换/驱动器74450 TTL 16:1多路转接复用器多工器74451 TTL 双8:1多路转接复用器多工器74453 TTL 四4:1多路转接复用器多工器7446 TTL BCD—7段低有效译码/驱动器74460 TTL 十位比较器74461 TTL 八进制计数器74465 TTL 三态同相2与使能端八总线缓冲器74466 TTL 三态反相2与使能八总线缓冲器74467 TTL 三态同相2使能端八总线缓冲器74468 TTL 三态反相2使能端八总线缓冲器74469 TTL 八位双向计数器7447 TTL BCD—7段高有效译码/驱动7448 TTL BCD—7段译码器/内部上拉输出驱动74490 TTL 双十进制计数器74491 TTL 十位计数器74498 TTL 八进制移位寄存器7450 TTL 2-3/2-2输入端双与或非门74502 TTL 八位逐次逼近寄存器74503 TTL 八位逐次逼近寄存器7451 TTL 2-3/2-2输入端双与或非门74533 TTL 三态反相八D锁存器74534 TTL 三态反相八D锁存器7454 TTL 四路输入与或非门74540 TTL 八位三态反相输出总线缓冲器7455 TTL 4输入端二路输入与或非门74563 TTL 八位三态反相输出触发器74564 TTL 八位三态反相输出D触发器74573 TTL 八位三态输出触发器74574 TTL 八位三态输出D触发器74645 TTL 三态输出八同相总线传送接收器74670 TTL 三态输出4×4寄存器堆7473 TTL 带清除负触发双J-K触发器7474 TTL 带置位复位正触发双D触发器7476 TTL 带预置清除双J-K触发器7483 TTL 四位二进制快速进位全加器7485 TTL 四位数字比较器7486 TTL 2输入端四异或门7490 TTL 可二/五分频十进制计数器7493 TTL 可二/八分频二进制计数器7495 TTL 四位并行输入\\输出移位寄存器7497 TTL 6位同步二进制乘法器SN74LSOO 四2输入与非门SN74LSO2 四2输入与非门SN74LS04 六反相器SN74LS06 六反相缓冲器/驱动器SN74LS08 四2输入与非门SN74LS10 三3输入与非门SN74LS12 三3输入与非门SN74LS14 六反相器.斯密特触发SN74LS16 六反相缓冲器/触发器SN74LS20 双4输入与门SN74LS22 双4输入与门SN74LS26 四2输入与非门SN74LS28 四输入端或非缓冲器SN74LS32 四2输入或门SN74LS37 四输入端与非缓冲器SN74LS40 四输入端与非缓冲器SN74LS47 BCD－七段译码驱动器SN74LS49 BCD－七段译码驱动器SN74LS54 四输入与或非门SN74LS63 六电流读出接口门SN74LS74 双D触发器SN74LS76 双J－K触发器SN74LS83 双J－K触发器SN74LS86 四2输入异或门SN74LS90 4位十进制波动计数器SN74LS92 12分频计数器SN74LS96 5位移位寄存器SN74LS109 正沿触发双J－K触发器SN74LS113 双J－K负沿触发器SN74LS121 单稳态多谐振荡器SN74LS123 双稳态多谐振荡器SN74LS125 三态缓冲器SN74LS131 3－8线译码器SN74LS133 13输入与非门SN74LS137 地址锁存3－8线译码器SN74LS139 双2－4线译码－转换器SN74LS147 10－4线优先编码器SN74LS153 双4选1数据选择器SN74LS155 双2－4线多路分配器SN74LS157 四2选1数据选择器SN74LS160 同步BDC十进制计数器SN74LS162 同步BDC十进制计数器SN74LS164 8位串入并出移位寄存SN74LS166 8位移位寄存器SN74LS169 4位可逆同步计数器SN74LS172 16位多通道寄存器堆SN74LS174 6D型触发器SN74LS176 可预置十进制计数器SN74LS182 超前进位发生器SN74LS189 64位随机存储器SN74LS191 二进制同步可逆计数器SN74LS193 二进制可逆计数器SN74LS195 并行存取移位寄存器SN74LS197 可预置二进制计数器SN74LS238 3－8线译码/多路转换器SN74LS241 八缓冲/驱动/接收器SN74LS243 四总线收发器SN74LS245 八总线收发器SN74LS248 BCD－七段译码驱动器SN74LS251 三态8－1数据选择器SN74LS256 双四位选址锁存器SN74LS258 四2选1数据选择器SN74LS260 双5输入或非门SN74LS266 四2输入异或非门SN74LS275 七位树型乘法器SN74LS279 四R－S触发器SN74LS283 4位二进制全加器SN74LS293 4位二进制计数器SN74LS365 六缓冲器带公用启动器SN74LS367 六总线三态输出缓冲器SN74LS373 8D锁存器SN74LS375 4位双稳锁存器SN74LS386 四2输入异或门SN74LS393 双4位二进制计数器SN74LS574 8位D型触发器SN74LS684 8位数字比较器SN74LSO1 四2输入与非门SN74LS03 四2输入与非门SN74LS05 六反相器SN74LS07 六缓冲器/驱动器SN74LS09 四2输入与非门SN74LS11 三3输入与非门SN74LS13 三3输入与非门SN74LS15 三3输入与非门SN74LS17 六反相缓冲器/驱动器SN74LS21 双4输入与门SN74LS25 双4输入与门SN74LS27 三3输入与非门SN74LS30 八输入端与非门SN74LS33 四2输入或门SN74LS38 双2输入与非缓冲器SN74LS42 BCD－十进制译码器SN74LS48 BCD－七段译码驱动器SN74LS51 三3输入双与或非门SN74LS55 四4输入与或非门SN74LS73 双J－K触发器SN74LS75 4位双稳锁存器SN74LS78 双J－K触发器SN74LS85 4位幅度比较器SN74LS88 4位全加器SN74LS91 8位移位寄存器SN74LS93 二进制计数器SN74LS95 4位并入并出寄存器SN74LS107 双J－K触发器SN74LS112 双J－K负沿触发器SN74LS114 双J－K负沿触发器SN74LS122 单稳态多谐振荡器SN74LS124 双压控振荡器SN74LS126 四3态总线缓冲器SN74LS132 二输入与非触发器SN74LS136 四异或门SN74LS138 3－8线译码/转换器SN74LS145 BCD十进制译码/驱动器SN74LS148 8－3线优先编码器SN74LS151 8选1数据选择器SN74LS154 4－16线多路分配器SN74LS156 双2－4线多路分配器SN74LS158 四2选1数据选择器SN74LS161 4位二进制计数器SN74LS163 4位二进制计数器SN74LS165 8位移位寄存器SN74LS168 4位可逆同步计数器SN74LS170 4x4位寄存器堆SN74LS173 4D型寄存器SN74LS175 4D烯触发器SN74LS181 运算器/函数发生器SN74LS183 双进位保存全价器SN74LS190 同步BCD十进制计数器SN74LS192 BCD－同步可逆计数器SN74LS194 双向通用移位寄存器SN74LS196 可预置十进制计数器SN74LS221 双单稳态多谐振荡器SN74LS240 八缓冲/驱动/接收器SN74LS242 四总线收发器SN74LS244 八缓冲/驱动/接收器SN74LS247 BCD－七段译码驱动器SN74LS249 BCD－七段译码驱动器SN74LS253 双三态4－1数据选择器SN74LS257 四3态2－1数据选择器SN74LS259 8位可寻址锁存器SN74LS261 2x4位二进制乘发器SN74LS273 八进制D型触发器SN74LS276 四J－K触发器SN74LS280 9位奇偶数发生校检器SN74LS290 十进制计数器SN74LS295 4位双向通用移位寄存器SN74LS366 六缓冲器带公用启动器SN74LS368 六总线三态输出反相器SN74LS374 8D触发器SN74LS377 8位单输出D型触发器SN74LS390 双十进制计数器SN74LS573 8位三态输出D型锁存器SN74LS670 8位数字比较器SN74HC00 四2输入与非门SN74HC02 四2输入或非门SN74HC03 四2输入或非门SN74HC04 六反相器SN74HC05 六反相器SN74HC08 四2输入与门SN74HC10 三3输入与非门SN74HC11 三3输入与门SN74HC14 六反相器/斯密特触发器SN74HC20 双四输入与门SN74HC21 双四输入与非门SN74HC27 三3输入与非门SN74HC30 八输入端与非门SN74HC32 四2输入或门SN74HC42 BCD十进制译码器SN74HC73 双J－K触发器SN74HC74 双D型触发器SN74HC76 双J－K触发器SN74HC86 四2输入异或门SN74HC107 双J－K触发器SN74HC113 双J－K负沿触发器SN74HC123 双稳态多谐振荡器SN74HC125 三态缓冲器SN74HC126 四三态总线缓冲器SN74HC132 二输入与非缓冲器SN74HC137 二输入与非缓冲器SN74HC138 3－8线译码/解调器SN74HC139 双2－4线译码/解调器SN74HC148 8选1数据选择器SN74HC151 双4选1数据选择器SN74HC154 4－16线多路分配器SN74HC157 四2选1数据选择器SN74HC161 4位二进制计数器SN74HC163 4位二进制计数器SN74HC164 8位串入并出移位寄存器SN74HC165 8位移位寄存器SN74HC173 4D型触发器SN74HC174 6D触发器SN74HC175 4D型触发器SN74HC191 二进制同步可逆计数器SN74HC221 双单稳态多谐振荡器SN74HC238 3－8线译码器SN74HC240 八缓冲器SN74HC244 八总线3态输出缓冲器SN74HC245 八总线收发器SN74HC251 三态8－1数据选择器SN74HC259 8位可寻址锁存器SN74HC266 四2输入异或非门SN74HC273 8D型触发器SN74HC367 六缓冲器/总线驱动器SN74HC368 六缓冲器/总线驱动器SN74HC373 8D锁存器SN74HC374 8D触发器SN74HC393 双4位二进制计数器SN74HC541 8位三态输出缓冲器SN74HC573 8位三态输出D型锁存器SN74HC574 8D型触发器SN74HC595 8位移位寄存器/锁存器SN74HC4028 7级二进制串行加数器SN74HC4046 锁相环SN74HC4050 六同相缓冲器SN74HC4051 8选1模拟开关SN74HC4053 三2选1模拟开关SN74HC4060 14位计数/分频/振荡器SN74HC4066 四双相模拟开关SN74HC4078 3输入端三或门SN74HC4511 7段锁存/译码驱动器SN74HC4520 双二进制加法计数器?>74F00 高速四2输入与非门74F02 高速四2输入或非门74F04 高速六反相器74F08 高速四2输入与门74F10 高速三3输入与门74F14 高速六反相斯密特触发74F32 高速四2输入或门74F38 高速四2输入或门74F74 高速双D型触发器74F86 高速四2输入异或门74F139 高速双2－4线译码/驱动器74F151 高速双2－4线译码/驱动器74F153 高速双4选1数据选择器74F157 高速双4选1数据选择器74F161 高速6D型触发器74F174 高速6D型触发器74F175 高速4D型触发器74F244 高速八总线3态缓冲器74F245 高速八总线收发器74F373 高速8D锁存器SN74HCT04 六反相器?>74ls00 2输入四与非门74ls01 2输入四与非门(oc)74ls02 2输入四或非门74ls03 2输入四与非门(oc)74ls04 六倒相器74ls05 六倒相器(oc)74ls06 六高压输出反相缓冲器/驱动器(oc,30v) 74ls07 六高压输出缓冲器/驱动器(oc,30v)74ls08 2输入四与门74ls09 2输入四与门(oc)74ls10 3输入三与非门74ls11 3输入三与门74ls12 3输入三与非门(oc)74ls13 4输入双与非门(斯密特触发)74ls14 六倒相器(斯密特触发)74ls15 3输入三与门(oc)74ls16 六高压输出反相缓冲器/驱动器(oc,15v) 74ls17 六高压输出缓冲器/驱动器(oc,15v)74ls18 4输入双与非门(斯密特触发)74ls19 六倒相器(斯密特触发)74ls20 4输入双与非门74ls21 4输入双与门74ls22 4输入双与非门(oc)74ls23 双可扩展的输入或非门74ls24 2输入四与非门(斯密特触发)74ls25 4输入双或非门(有选通)74ls26 2输入四高电平接口与非缓冲器(oc,15v) 74ls27 3输入三或非门74ls28 2输入四或非缓冲器74ls30 8输入与非门74ls31 延迟电路74ls32 2输入四或门74ls33 2输入四或非缓冲器(集电极开路输出) 74ls34 六缓冲器74ls35 六缓冲器(oc)74ls36 2输入四或非门(有选通)74ls37 2输入四与非缓冲器74ls38 2输入四或非缓冲器(集电极开路输出) 74ls39 2输入四或非缓冲器(集电极开路输出) 74ls40 4输入双与非缓冲器74ls41 bcd-十进制计数器74ls42 4线-10线译码器(bcd输入)74ls43 4线-10线译码器(余3码输入)74ls44 4线-10线译码器(余3葛莱码输入) 74ls45 bcd-十进制译码器/驱动器74ls46 bcd-七段译码器/驱动器74ls47 bcd-七段译码器/驱动器74ls48 bcd-七段译码器/驱动器74ls49 bcd-七段译码器/驱动器(oc)74ls50 双二路2-2输入与或非门(一门可扩展) 74ls51 双二路2-2输入与或非门74ls51 二路3-3输入,二路2-2输入与或非门74ls52 四路2-3-2-2输入与或门(可扩展)74ls53 四路2-2-2-2输入与或非门(可扩展) 74ls53 四路2-2-3-2输入与或非门(可扩展) 74ls54 四路2-2-2-2输入与或非门74ls54 四路2-3-3-2输入与或非门74ls54 四路2-2-3-2输入与或非门74ls55 二路4-4输入与或非门(可扩展)74ls60 双四输入与扩展74ls61 三3输入与扩展74ls62 四路2-3-3-2输入与或扩展器74ls63 六电流读出接口门74ls64 四路4-2-3-2输入与或非门74ls65 四路4-2-3-2输入与或非门(oc)74ls70 与门输入上升沿jk触发器74ls71 与输入r-s主从触发器74ls72 与门输入主从jk触发器74ls73 双j-k触发器(带清除端)74ls74 正沿触发双d型触发器(带预置端和清除端)74ls75 4位双稳锁存器74ls76 双j-k触发器(带预置端和清除端)74ls77 4位双稳态锁存器74ls78 双j-k触发器(带预置端,公共清除端和公共时钟端) 74ls80 门控全加器74ls81 16位随机存取存储器74ls82 2位二进制全加器(快速进位)74ls83 4位二进制全加器(快速进位)74ls84 16位随机存取存储器74ls85 4位数字比较器74ls86 2输入四异或门74ls87 四位二进制原码/反码/oi单元74ls89 64位读/写存储器74ls90 十进制计数器74ls91 八位移位寄存器74ls92 12分频计数器(2分频和6分频)74ls93 4位二进制计数器74ls94 4位移位寄存器(异步)74ls95 4位移位寄存器(并行io)74ls96 5位移位寄存器74ls97 六位同步二进制比率乘法器74ls100 八位双稳锁存器74ls103 负沿触发双j-k主从触发器(带清除端)74ls106 负沿触发双j-k主从触发器(带预置,清除,时钟) 74ls107 双j-k主从触发器(带清除端)74ls108 双j-k主从触发器(带预置,清除,时钟)74ls109 双j-k触发器(带置位,清除,正触发)74ls110 与门输入j-k主从触发器(带锁定)74ls111 双j-k主从触发器(带数据锁定)74ls112 负沿触发双j-k触发器(带预置端和清除端) 74ls113 负沿触发双j-k触发器(带预置端)74ls114 双j-k触发器(带预置端,共清除端和时钟端)74ls116 双四位锁存器74ls120 双脉冲同步器/驱动器74ls121 单稳态触发器(施密特触发)74ls122 可再触发单稳态多谐振荡器(带清除端) 74ls123 可再触发双单稳多谐振荡器74ls125 四总线缓冲门(三态输出)74ls126 四总线缓冲门(三态输出)74ls128 2输入四或非线驱动器74ls131 3-8译码器74ls132 2输入四与非门(斯密特触发)74ls133 13输入端与非门74ls134 12输入端与门(三态输出)74ls135 四异或/异或非门74ls136 2输入四异或门(oc)74ls137 八选1锁存译码器/多路转换器74ls138 3-8线译码器/多路转换器74ls139 双2-4线译码器/多路转换器74ls140 双4输入与非线驱动器74ls141 bcd-十进制译码器/驱动器74ls142 计数器/锁存器/译码器/驱动器74ls145 4-10译码器/驱动器74ls147 10线-4线优先编码器74ls148 8线-3线八进制优先编码器74ls150 16选1数据选择器(反补输出)74ls151 8选1数据选择器(互补输出)74ls152 8选1数据选择器多路开关74ls153 双4选1数据选择器/多路选择器74ls154 4线-16线译码器74ls155 双2-4译码器/分配器(图腾柱输出)74ls156 双2-4译码器/分配器(集电极开路输出) 74ls157 四2选1数据选择器/多路选择器74ls158 四2选1数据选择器(反相输出)74ls160 可预置bcd计数器(异步清除)74ls161 可预置四位二进制计数器(并清除异步) 74ls162 可预置bcd计数器(异步清除)74ls163 可预置四位二进制计数器(并清除异步) 74ls164 8位并行输出串行移位寄存器74ls165 并行输入8位移位寄存器(补码输出)74ls166 8位移位寄存器74ls167 同步十进制比率乘法器74ls168 4位加/减同步计数器(十进制)74ls169 同步二进制可逆计数器74ls170 4*4寄存器堆74ls171 四d触发器(带清除端)74ls172 16位寄存器堆74ls173 4位d型寄存器(带清除端)74ls174 六d触发器74ls175 四d触发器74ls176 十进制可预置计数器74ls177 2-8-16进制可预置计数器74ls178 四位通用移位寄存器74ls179 四位通用移位寄存器74ls180 九位奇偶产生/校验器74ls181 算术逻辑单元/功能发生器74ls182 先行进位发生器74ls183 双保留进位全加器74ls184 bcd-二进制转换器74ls185 二进制-bcd转换器74ls190 同步可逆计数器(bcd,二进制) 74ls191 同步可逆计数器(bcd,二进制) 74ls192 同步可逆计数器(bcd,二进制) 74ls193 同步可逆计数器(bcd,二进制) 74ls194 四位双向通用移位寄存器74ls195 四位通用移位寄存器74ls196 可预置计数器/锁存器74ls197 可预置计数器/锁存器(二进制)74ls198 八位双向移位寄存器74ls199 八位移位寄存器74ls210 2-5-10进制计数器74ls213 2-n-10可变进制计数器74ls221 双单稳触发器74ls230 八3态总线驱动器74ls231 八3态总线反向驱动器74ls240 八缓冲器/线驱动器/线接收器(反码三态输出) 74ls241 八缓冲器/线驱动器/线接收器(原码三态输出) 74ls242 八缓冲器/线驱动器/线接收器74ls243 4同相三态总线收发器74ls244 八缓冲器/线驱动器/线接收器74ls245 八双向总线收发器74ls246 4线-七段译码/驱动器(30v)74ls247 4线-七段译码/驱动器(15v)74ls248 4线-七段译码/驱动器74ls249 4线-七段译码/驱动器74ls251 8选1数据选择器(三态输出)74ls253 双四选1数据选择器(三态输出)74ls256 双四位可寻址锁存器74ls257 四2选1数据选择器(三态输出)74ls258 四2选1数据选择器(反码三态输出)74ls259 8为可寻址锁存器74ls260 双5输入或非门74ls261 4*2并行二进制乘法器74ls265 四互补输出元件74ls266 2输入四异或非门(oc)74ls270 2048位rom (512位四字节,oc) 74ls271 2048位rom (256位八字节,oc) 74ls273 八d触发器74ls274 4*4并行二进制乘法器74ls275 七位片式华莱士树乘法器74ls276 四jk触发器74ls278 四位可级联优先寄存器74ls279 四s-r锁存器74ls280 9位奇数/偶数奇偶发生器/较验器74ls28174ls283 4位二进制全加器74ls290 十进制计数器74ls291 32位可编程模74ls293 4位二进制计数器74ls294 16位可编程模74ls295 四位双向通用移位寄存器74ls298 四-2输入多路转换器(带选通)74ls299 八位通用移位寄存器(三态输出)74ls348 8-3线优先编码器(三态输出)74ls352 双四选1数据选择器/多路转换器74ls353 双4-1线数据选择器(三态输出)74ls354 8输入端多路转换器/数据选择器/寄存器,三态补码输出74ls355 8输入端多路转换器/数据选择器/寄存器,三态补码输出74ls356 8输入端多路转换器/数据选择器/寄存器,三态补码输出74ls357 8输入端多路转换器/数据选择器/寄存器,三态补码输出74ls365 6总线驱动器74ls366 六反向三态缓冲器/线驱动器74ls367 六同向三态缓冲器/线驱动器74ls368 六反向三态缓冲器/线驱动器74ls373 八d锁存器74ls374 八d触发器(三态同相)74ls375 4位双稳态锁存器74ls377 带使能的八d触发器74ls378 六d触发器74ls379 四d触发器74ls381 算术逻辑单元/函数发生器74ls382 算术逻辑单元/函数发生器74ls384 8位*1位补码乘法器74ls385 四串行加法器/乘法器74ls386 2输入四异或门74ls390 双十进制计数器74ls391 双四位二进制计数器74ls395 4位通用移位寄存器74ls396 八位存储寄存器74ls398 四2输入端多路开关(双路输出) 74ls399 四-2输入多路转换器(带选通) 74ls422 单稳态触发器74ls423 双单稳态触发器74ls440 四3方向总线收发器,集电极开路74ls441 四3方向总线收发器,集电极开路74ls442 四3方向总线收发器,三态输出74ls443 四3方向总线收发器,三态输出74ls444 四3方向总线收发器,三态输出74ls445 bcd-十进制译码器/驱动器,三态输出74ls446 有方向控制的双总线收发器74ls448 四3方向总线收发器,三态输出74ls449 有方向控制的双总线收发器74ls465 八三态线缓冲器74ls466 八三态线反向缓冲器74ls467 八三态线缓冲器74ls468 八三态线反向缓冲器74ls490 双十进制计数器74ls540 八位三态总线缓冲器(反向)74ls541 八位三态总线缓冲器74ls589 有输入锁存的并入串出移位寄存器74ls590 带输出寄存器的8位二进制计数器74ls591 带输出寄存器的8位二进制计数器74ls592 带输出寄存器的8位二进制计数器74ls593 带输出寄存器的8位二进制计数器74ls594 带输出锁存的8位串入并出移位寄存器74ls595 8位输出锁存移位寄存器74ls596 带输出锁存的8位串入并出移位寄存器74ls597 8位输出锁存移位寄存器74ls598 带输入锁存的并入串出移位寄存器74ls599 带输出锁存的8位串入并出移位寄存器74ls604 双8位锁存器74ls605 双8位锁存器74ls606 双8位锁存器74ls607 双8位锁存器74ls620 8位三态总线发送接收器(反相)74ls621 8位总线收发器74ls622 8位总线收发器74ls623 8位总线收发器74ls640 反相总线收发器(三态输出)74ls641 同相8总线收发器,集电极开路74ls642 同相8总线收发器,集电极开路74ls643 8位三态总线发送接收器74ls644 真值反相8总线收发器,集电极开路74ls645 三态同相8总线收发器74ls646 八位总线收发器,寄存器74ls647 八位总线收发器,寄存器74ls648 八位总线收发器,寄存器74ls649 八位总线收发器,寄存器74ls651 三态反相8总线收发器74ls652 三态反相8总线收发器74ls653 反相8总线收发器,集电极开路74ls654 同相8总线收发器,集电极开路74ls668 4位同步加/减十进制计数器74ls669 带先行进位的4位同步二进制可逆计数器74ls670 4*4寄存器堆(三态)74ls671 带输出寄存的四位并入并出移位寄存器74ls672 带输出寄存的四位并入并出移位寄存器74ls673 16位并行输出存储器,16位串入串出移位寄存器74ls674 16位并行输入串行输出移位寄存器74ls681 4位并行二进制累加器74ls682 8位数值比较器(图腾柱输出)74ls683 8位数值比较器(集电极开路)74ls684 8位数值比较器(图腾柱输出)74ls685 8位数值比较器(集电极开路)74ls686 8位数值比较器(图腾柱输出)74ls687 8位数值比较器(集电极开路)74ls688 8位数字比较器(oc输出)74ls689 8位数字比较器74ls690 同步十进制计数器/寄存器(带数选,三态输出,直接清除) 74ls691 计数器/寄存器(带多转换,三态输出)74ls692 同步十进制计数器(带预置输入,同步清除)74ls693 计数器/寄存器(带多转换,三态输出)74ls696 同步加/减十进制计数器/寄存器(带数选,三态输出,直接清除)74ls697 计数器/寄存器(带多转换,三态输出)74ls698 计数器/寄存器(带多转换,三态输出)74ls699 计数器/寄存器(带多转换,三态输出)74ls716 可编程模n十进制计数器74ls718 可编程模n十进制计数器74系列芯片资料反相器驱动器 LS04 LS05 LS06 LS07 LS125 LS240 LS244 LS245与门与非门 LS00 LS08 LS10 LS11 LS20 LS21 LS27 LS30 LS38或门或非门与或非门 LS02 LS32 LS51 LS64 LS65异或门比较器 LS86译码器 LS138 LS139寄存器 LS74 LS175 LS373反相器:Vcc 6A 6Y 5A 5Y 4A 4Y 六非门 74LS04┌┴─┴─┴─┴─┴─┴─┴┐六非门(OC门) 74LS05_ │14 13 12 11 10 9 8│六非门(OC高压输出) 74LS06Y = A ）││ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1Y 2A 2Y 3A 3Y GND驱动器:Vcc 6A 6Y 5A 5Y 4A 4Y┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│Y = A ）│六驱动器(OC高压输出) 74LS07 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1Y 2A 2Y 3A 3Y GNDVcc -4C 4A 4Y -3C 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐_ │14 13 12 11 10 9 8│Y =A+C ）│四总线三态门 74LS125 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘-1C 1A 1Y -2C 2A 2Y GNDVcc -G B1 B2 B3 B4 B8 B6 B7 B8┌┴─┴─┴─┴─┴─┴─┴─┴─┴─┴┐ 8位总线驱动器 74LS245│20 19 18 17 16 15 14 13 12 11│）│ DIR=1 A=>B│ 1 2 3 4 5 6 7 8 9 10│ DIR=0 B=>A└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘DIR A1 A2 A3 A4 A5 A6 A7 A8 GND页首非门,驱动器与门,与非门或门,或非门异或门,比较器译码器寄存器正逻辑与门,与非门:Vcc 4B 4A 4Y 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│Y = AB ）│ 2输入四正与门 74LS08│ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 1Y 2A 2B 2Y GNDVcc 4B 4A 4Y 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐__ │14 13 12 11 10 9 8│Y = AB ）│ 2输入四正与非门 74LS00 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 1Y 2A 2B 2Y GNDVcc 1C 1Y 3C 3B 3A 3Y┌┴─┴─┴─┴─┴─┴─┴┐___ │14 13 12 11 10 9 8│Y = ABC ）│ 3输入三正与非门 74LS10 │ 1 2 3 4 5 6 7│└┬─┬─┬─┬─┬─┬─┬┘1A 1B 2A 2B 2C 2Y GNDVcc H G Y┌┴─┴─┴─┴─┴─┴─┴┐│14 13 12 11 10 9 8│）│ 8输入与非门 74LS30│ 1 2 3 4 5 6 7│ ________└┬─┬─┬─┬─┬─┬─┬┘ Y = ABCDEFGHA B C D E F GND。

芯片类型

或门或非门与或非门 LS02 LS32 LS51 LS64 LS65
异或门比较器 LS86
Hale Waihona Puke 译码器 LS138 LS139
寄存器 LS74 LS175 LS373
反相器:
Vcc 6A 6Y 5A 5Y 4A 4Y 六非门 74LS04
┌┴─┴─┴─┴─┴─┴─┴┐ 六非门(OC门) 74LS05
_ │14 13 12 11 10 9 8│ 六非门(OC高压输出) 74LS06
Y = A ） │
│ 1 2 3 4 5 6 7│
Y=A1⊙B1+A2⊙B2+A3⊙B3+A4⊙B4+A5⊙B5+A6⊙B6+A7⊙B7+A8⊙B8
页首非门,驱动器与门,与非门或门,或非门异或门,比较器译码器寄存器
3-8译码器 74LS138
Vcc -Y0 -Y1 -Y2 -Y3 -Y4 -Y5
│20 19 18 17 16 15 14 13 12 11│
） │
│ 1 2 3 4 5 6 7 8 9 10│
└┬─┬─┬─┬─┬─┬─┬─┬─┬─┬┘
CE A1 B1 A2 B2 A3 B3 A4 B4 GND
74系列芯片资料（还算可以）！
74系列芯片资料
反相器驱动器 LS04 LS05 LS06 LS07 LS125 LS240 LS244 LS245
与门与非门 LS00 LS08 LS10 LS11 LS20 LS21 LS27 LS30 LS38
） │ Y = ABCD+EF+GHI+JK
│ 1 2 3 4 5 6 7│

74HC164中文资料（功能,真值表,引脚图及电气参数介绍）

74HC164中文资料（功能,真值表,引脚图及电气参数介绍）
移位寄存器74HC164中文资料(功能,真值表,引脚图及电气参数介绍)
SN54HC164,/SN74HC164是8位移位寄存器，当其中一个（或二个）选通串行输入端的低电平禁止进入新数据，并把第一个触发器在下一个时钟脉冲来后复位到低电平时，门控串行输入端（A 和B）可完全控制输入数据。

一个高电平输入后就使另一个输入端赋能，这个输入就决定了第一个触发器的状态。

虽然不管时钟处于高电平或低电平时，串行输入端的数据都可以被改变，但只有满足建立条件的信息才能被输入。

时钟控制发生在时钟输入由低电平到高电平的跃变上。

为了减小传输线效应，所有输入端均采用二极管钳位。

74HC164功能表：
H=高电平（稳定态） L=低电平（稳定态）×=不定↑=从低电平转换到高电平
QA0…QH0=在稳定态输入条件建立前QA…QH 的相应电平
QAn…QHn=在最近的时钟输入条件（↑）建立前QA…QH 的相应电平，表示移位一位
74HC164引脚图及逻辑图:
图1 逻辑图（正逻辑）
图2 引脚图
74HC164电气参数:
Absolute Maximum Ratings绝对最大额定值
DC SPECIFICATIONS直流电气规格表：
DC SPECIFICATIONS直流电气规格（续）
图3 参数测量信息
74HC164典型工作时序图
图4 typical clear, shift, and clear sequence典型清除、移位和清除时序
74HC164应用电路
TAG标签：74真值引脚表图。

SN74HC4060NSR,SN74HC4060D,SN74HC4060DRE4,SN74HC4060PWRE4,SN74HC4060PWRG4, 规格书,Datasheet 资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN54HC4060FK ACTIVE LCCC FK201TBD POST-PLATE N/A for Pkg Type SN74HC4060D ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DBR ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DBRE4ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DBRG4ACTIVE SSOP DB162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DE4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DG4ACTIVE SOIC D1640Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DR ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DRE4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DRG4ACTIVE SOIC D162500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DT ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DTE4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060DTG4ACTIVE SOIC D16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060N ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74HC4060NE4ACTIVE PDIP N1625Pb-Free(RoHS)CU NIPDAU N/A for Pkg TypeSN74HC4060NSR ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060NSRE4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060NSRG4ACTIVE SO NS162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PW ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWE4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWG4ACTIVE TSSOP PW1690Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWR ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWRE4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWRG4ACTIVE TSSOP PW162000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWT ACTIVE TSSOP PW16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74HC4060PWTE4ACTIVE TSSOP PW16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74HC4060PWTG4ACTIVE TSSOP PW16250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS),Pb-Free(RoHS Exempt),or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free(RoHS Exempt):This component has a RoHS exemption for either1)lead-based flip-chip solder bumps used between the die and package,or2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free(RoHS compatible)as defined above.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74HC4060DBR SSOP DB 162000330.016.48.2 6.6 2.512.016.0Q1SN74HC4060DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC4060DR SOIC D 162500330.016.4 6.510.3 2.18.016.0Q1SN74HC4060NSR SO NS 162000330.016.48.210.5 2.512.016.0Q1SN74HC4060PWR TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC4060PWR TSSOP PW 162000330.012.47.0 5.6 1.68.012.0Q1SN74HC4060PWRG4TSSOP PW 162000330.012.4 6.9 5.6 1.68.012.0Q1SN74HC4060PWTTSSOPPW16250330.012.46.95.61.68.012.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74HC4060DBR SSOP DB162000367.0367.038.0 SN74HC4060DR SOIC D162500333.2345.928.6 SN74HC4060DR SOIC D162500367.0367.038.0 SN74HC4060NSR SO NS162000367.0367.038.0 SN74HC4060PWR TSSOP PW162000367.0367.035.0 SN74HC4060PWR TSSOP PW162000364.0364.027.0 SN74HC4060PWRG4TSSOP PW162000367.0367.035.0SN74HC4060PWT TSSOP PW16250367.0367.035.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to 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TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

74LVTH16240资料

© 2005 Fairchild Semiconductor Corporation DS012025March 1999Revised June 200574LVT16240 • 74LVTH16240 Low Voltage 16-Bit Inverting Buffer/Line Driver with 3-STATE Outputs74LVT16240 • 74LVTH16240Low Voltage 16-Bit Inverting Buffer/Line Driver with 3-STATE OutputsGeneral DescriptionThe LVT16240 and LVTH16240 contain sixteen inverting buffers with 3-STATE outputs designed to be employed as a memory and address driver, clock driver, or bus-oriented transmitter/receiver. The device is nibble controlled.Individual 3-STATE control inputs can be shorted together for 8-bit or 16-bit operation.The LVTH16240 data inputs include bushold, eliminating the need for external pull-up resistors to hold unused inputs.These buffers and line drivers are designed for low-voltage (3.3V) V CC applications, but with the capability to provide a TTL interface to a 5V environment. The LVT16240 and LVTH16240 are fabricated with an advanced BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation.Featuress Input and output interface capability to systems at 5V V CC s Bushold data inputs eliminate the need for externalpull-up resistors to hold unused inputs (74LVTH16240),also available without bushold feature (74LVT16240)s Live insertion/extraction permitteds Power Up/Down high impedance provides glitch-free bus loading s Outputs source/sink 32 mA/ 64 mAs Functionally compatible with the 74 series 16240s Latch-up performance exceeds 500 mA s ESD performance:Human-body model ! 2000V Machine model ! 200V Charged-device model ! 1000VOrdering Code:Devices also available in T ape and Reel. Specify by appending suffix letter “X” to the ordering code.Logic SymbolOrder Number Package Number Package Description74LVT16240MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LVT16240MTD MTD4848-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 74LVTH16240MEA MS48A 48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" Wide 74LVTH16240MTDMTD4848-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm Wide 274L V T 16240 • 74L V T H 16240Connection DiagramPin DescriptionsTruth TableH HIGH Voltage Level L LOW Voltage Level X ImmaterialZ High ImpedanceFunctional DescriptionThe LVT16240 and LVTH16240 contain sixteen inverting buffers with 3-STATE standard outputs. The device is nibble (4-bits) controlled with each nibble functioning identically, but independent of the other. The control pins may be shorted together to obtain full 16-bit operation. The 3-STATE outputs are controlled by an Output Enable (OE n ) input for each nib-ble. When OE n is LOW, the outputs are in 2-state mode. When OE n is HIGH, the outputs are in the high impedance mode,but this does not interfere with entering new data into the inputs.Logic DiagramPlease note that this diagram is provided only for the understanding of logic operations and should not be used to estimate propagation delays.Pin Names DescriptionOE n Output Enable Inputs (Active LOW)I 0–I 15InputsO 0–O 153-STATE OutputsInputsOutputsOE 1I 0–I 3O 0–O 3L L H L H L HX Z InputsOutputs OE 2I 4–I 7O 4–O 7L L H L HL H X Z InputsOutputsOE 3I 8–I 11O 8–O 11L L H L H L HX Z InputsOutputs OE 4I 12–I 15O 12–O 15L L H L H L HXZ74LVT16240 • 74LVTH16240Absolute Maximum Ratings (Note 1)Recommended Operating ConditionsNote 1: Absolute Maximum continuous ratings are those values beyond which damage to the device may occur. Exposure to these conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation under absolute maximum rated conditions is not implied.Note 2: I O Absolute Maximum Rating must be observed.DC Electrical CharacteristicsSymbol ParameterValueConditionsUnits V CC Supply Voltage 0.5 to 4.6V V I DC Input Voltage 0.5 to 7.0VV O DC Output Voltage 0.5 to 7.0Output in 3-STATEV0.5 to V CC 0.5Output in HIGH or LOW State (Note 2)I IK DC Input Diode Current 50V I GND mA I OK DC Output Diode Current 50V O GNDmA I O DC Output Current64V O ! V CC Output at HIGH State mA 128V O ! V CC Output at LOW StateI CC DC Supply Current per Supply Pin r 64mA I GND DC Ground Current per Ground Pin r 128mA T STGStorage Temperature65 to 150q CSymbol ParameterMin Max Units V CC Supply Voltage 2.7 3.6V V I Input Voltage5.5V I OH HIGH Level Output Current 32mA I OL LOW Level Output Current 64mAT AFree-Air Operating Temperature4085q C 't/'VInput Edge Rate, V IN 0.8V –2.0V, V CC 3.0V10ns/VSymbol ParameterV CC (V)T A 40q C to 85q C UnitsConditionsMinTyp Max(Note 10)V IK Input Clamp Diode Voltage 2.7 1.2V I I 18 mA V IH Input HIGH Voltage 2.7–3.6 2.0V V O d 0.1V or V IL Input LOW Voltage 2.7–3.60.8VV O t V CC 0.1V V OHOutput HIGH Voltage2.7–3.6V CC 0.2VI OH 100 P A 2.7 2.4I OH 8 mA 3.02.0I OH 32 mA V OLOutput LOW Voltage2.70.2V I OL 100 P A 2.70.5I OL 24 mA3.00.4I OL 16 mA 3.00.5I OL 32 mA 3.00.55I OL 64 mA I I(HOLD)Bushold Input Minimum Drive3.075P A V I 0.8V (Note 4) 75V I 2.0V I I(OD)Bushold Input Over-Drive 3.0500P A (Note 5)(Note 4)Current to Change State 500(Note 6)I IInput Current3.610P AV I 5.5V Control Pins 3.6r 1V I 0V or V CC Data Pins3.6 5V I 0V 1V I V CCI OFF Power Off Leakage Current 0r 100P A 0V d V I or V O d 5.5V I PU/PD Power Up/Down 3-STATE 0–1.5V r 100P A V O 0.5V to 3.0V Output CurrentV I GND or V CC I OZL 3-STATE Output Leakage Current 3.6 5P A V O 0.5V I OZH3-STATE Output Leakage Current3.65P A V O 3.0V 474L V T 16240 • 74L V T H 16240DC Electrical Characteristics (Continued)Note 3: All typical values are at V CC 3.3V, T A 25q C.Note 4: Applies to bushold versions only (LVTH16240).Note 5: An external driver must source at least the specified current to switch from LOW-to-HIGH.Note 6: An external driver must sink at least the specified current to switch from HIGH-to-LOW.Note 7: This is the increase in supply current for each input that is at the specified voltage level rather than V CC or GND.Dynamic Switching Characteristics (Note 8)Note 8: Characterized in SSOP package. Guaranteed parameter, but not tested.Note 9: Max number of outputs defined as (n). n 1 data inputs are driven 0V to 3V. Output at LOW.AC Electrical CharacteristicsNote 10: All typical values are at V CC 3.3V, T A 25q C.Note 11: Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (t OSHL ) or LOW-to-HIGH (t OSLH ).Capacitance (Note 12)Note 12: Capacitance is measured at frequency f 1 MHz, per MIL-STD-883, Method 3012.Symbol ParameterV CC (V)T A 40q C to 85q C Units ConditionsMinTyp Max (Note 10)I OZH 3-STATE Output Leakage Current 3.610P A V CC V O d 5.5V I CCH Power Supply Current 3.60.19mA V I GND or V CC ,Outputs HIGH I CCL Power Supply Current 3.65mA V I GND or V CC ,Outputs LOW I CCZ Power Supply Current 3.60.19mA V I GND or V CC ,Outputs Disabled I CCZHPower Supply Current3.60.19mAV I GND or V CC , V CC d V O d 5.5V,Outputs Disabled'I CCIncrease in Power Supply Current 3.60.2mAOne Input at V CC 0.6V (Note 7)Other Inputs at V CC or GNDSymbol ParameterV CC T A 25q C Units Conditions (V)MinTyp MaxC L 50 pF, R L 500:V OLP Quiet Output Maximum Dynamic V OL 3.30.8V (Note 9)V OLVQuiet Output Minimum Dynamic V OL3.30.8V(Note 9)SymbolParameterT A 40q C to 85q C, C L 50 pF, R L 500:UnitsV CC 3.3V r 0.3VV CC 2.7V Min Typ MaxMinMax(Note 10)t PLH Propagation Delay Data to Output1.0 3.5 1.0 4.2ns t PHL 1.03.5 1.04.0t PZH Output Enable Time 1.0 4.0 1.0 4.9ns t PZL 1.2 4.8 1.2 6.1t PHZ Output Disable Time 1.7 4.7 1.75.2ns t PLZ 1.74.2 1.74.4t OSHL Output to Output Skew 1.01.0nst OSLH(Note 11)Symbol ParameterConditionsTypical Units C IN Input Capacitance V CC 0V, V I 0V or V CC 4pF C OUTOutput CapacitanceV CC 3.0V, V O 0V or V CC8pF74LVT16240 • 74LVTH16240Physical Dimensionsinches (millimeters) unless otherwise noted48-Lead Small Shrink Outline Package (SSOP), JEDEC MO-118, 0.300" WidePackage Number MS48A674L V T 16240 • 74L V T H 16240 L o w V o l t a g e 16-B i t I n v e r t i n g B u f f e r /L i n e D r i v e r w i t h 3-S T A T E O u t p u t sPhysical Dimensions inches (millimeters) unless otherwise noted (Continued)48-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 6.1mm WidePackage Number MTD48Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right at any time without notice to change said circuitry and specifications.LIFE SUPPORT POLICYFAIRCHILD ’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:1.Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be rea-sonably expected to result in a significant injury to the user. 2. A critical component in any component of a life support device or system whose failure to perform can be rea-sonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.。

SN74LV10ADR中文资料

PACKAGING INFORMATIONOrderable Device Status(1)PackageType PackageDrawingPins PackageQtyEco Plan(2)Lead/Ball Finish MSL Peak Temp(3)SN74LV10AD ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADBR ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADBRE4ACTIVE SSOP DB142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADE4ACTIVE SOIC D1450Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADGVR ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADGVRE4ACTIVE TVSOP DGV142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADR ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ADRE4ACTIVE SOIC D142500Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ANSR ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10ANSRE4ACTIVE SO NS142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10APW ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10APWE4ACTIVE TSSOP PW1490Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10APWR ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10APWRE4ACTIVE TSSOP PW142000Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10APWT ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LV10APWTE4ACTIVE TSSOP PW14250Green(RoHS&no Sb/Br)CU NIPDAU Level-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan-The planned eco-friendly classification:Pb-Free(RoHS)or Green(RoHS&no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free(RoHS):TI's terms"Lead-Free"or"Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all6substances,including the requirement that lead not exceed0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Green(RoHS&no Sb/Br):TI defines"Green"to mean Pb-Free(RoHS compatible),and free of Bromine(Br)and Antimony(Sb)based flame retardants(Br or Sb do not exceed0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annual basis.元器件交易网IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications,enhancements, improvements, and other changes to its products and services at any time and to discontinueany product or service without notice. Customers should obtain the latest relevant information before placingorders and should verify that such information is current and complete. All products are sold subject to TI’s termsand conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale inaccordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TIdeems necessary to support this warranty. Except where mandated by government requirements, testing of allparameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible fortheir products and applications using TI components. T o minimize the risks associated with customer productsand applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right,copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or processin which TI products or services are used. Information published by TI regarding third-party products or servicesdoes not constitute a license from TI to use such products or services or a warranty or endorsement thereof.Use of such information may require a license from a third party under the patents or other intellectual propertyof the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is withoutalteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproductionof this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable forsuch altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for thatproduct or service voids all express and any implied warranties for the associated TI product or service andis an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Following are URLs where you can obtain information on other Texas Instruments products and applicationsolutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetworkMicrocontrollers Security /securityTelephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2005, Texas Instruments Incorporated。

SN74LS646DWE4,SN74LS646DWG4,SN74LS648NT,SN74LS648NTE4,SN74LS646DWR, 规格书,Datasheet 资料

X XH or LH or LXH or LXH or LOCTAL BUS TRANSCEIVERS AND REGISTERS7-Jun-2010 PACKAGING INFORMATIONOrderable Device Status (1)Package Type PackageDrawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)Samples(Requires Login)SN74LS646DW ACTIVE SOIC DW2425Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM Purchase SamplesSN74LS646DWE4ACTIVE SOIC DW2425Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM Purchase SamplesSN74LS646DWG4ACTIVE SOIC DW2425Green (RoHS& no Sb/Br)CU NIPDAU Level-1-260C-UNLIM Purchase Samples SN74LS646NT ACTIVE PDIP NT2415Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Purchase Samples SN74LS646NT3OBSOLETE PDIP NT24TBD Call TI Call TI Samples Not Available SN74LS646NTE4ACTIVE PDIP NT2415Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Purchase Samples SN74LS647DW OBSOLETE SOIC DW24TBD Call TI Call TI Samples Not Available SN74LS647NT OBSOLETE PDIP NT24TBD Call TI Call TI Samples Not Available SN74LS648NT ACTIVE PDIP NT2415Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Purchase Samples SN74LS648NTE4ACTIVE PDIP NT2415Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type Purchase Samples SN74LS649NT OBSOLETE PDIP NT24TBD Call TI Call TI Samples Not Available (1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.7-Jun-2010 Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,modifications,enhancements,improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by government requirements,testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design.Customers are responsible for their products and applications using TI components.To minimize the risks associated with customer products and applications,customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any TI patent right,copyright,mask work right, or other TI intellectual property right relating to any combination,machine,or process in which TI products or services are rmation published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.Reproduction of this information with alteration is an unfair and deceptive business practice.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice.TI is not responsible or liable for any such statements.TI products are not authorized for use in safety-critical applications(such as life support)where a failure of the TI product would reasonably be expected to cause severe personal injury or death,unless officers of the parties have executed an agreement specifically governing such use.Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications,and acknowledge and agree that they are solely responsible for all legal,regulatory and safety-related requirements concerning their products and any use of TI products in such safety-critical applications,notwithstanding any applications-related information or support that may be provided by TI.Further,Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in such safety-critical applications.TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are specifically designated by TI as military-grade or"enhanced plastic."Only products designated by TI as military-grade meet military specifications.Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at the Buyer's risk,and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use. TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are designated by TI as compliant with ISO/TS16949requirements.Buyers acknowledge and agree that,if they use any non-designated products in automotive applications,TI will not be responsible for any failure to meet such requirements.Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAudio /audio Communications and Telecom /communicationsAmplifiers Computers and Peripherals /computersData Converters Consumer Electronics /consumer-appsDLP®Products Energy and Lighting /energyDSP Industrial /industrialClocks and Timers /clocks Medical /medicalInterface Security /securityLogic Space,Avionics and Defense /space-avionics-defense Power Mgmt Transportation and /automotiveAutomotiveMicrocontrollers Video and Imaging /videoRFID Wireless /wireless-appsRF/IF and ZigBee®Solutions /lprfTI E2E Community Home Page Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2011,Texas Instruments Incorporated。

SN74LVCH16T245-EP 16位双电源总线收发器说明书

DGV PACKAGE(TOP VIEW)1234567891011121314151617181920212223244847464544434241403938373635343332313029282726251DIR1B11B2GND1B31B4V CCB1B51B6GND1B71B82B12B2GND2B32B4V CCB2B52B6GND2B72B82DIR1OE1A11A2GND1A31A4V CCA1A51A6GND1A71A82A12A2GND2A32A4V CCA2A52A6GND2A72A82OESN74LVCH16T245-EP SCES726A–NOVEMBER2008–REVISED NOVEMBER201316-BIT DUAL-SUPPLY BUS TRANSCEIVERWITH CONFIGURABLE VOLTAGE TRANSLATION AND3-STATE OUTPUTSCheck for Samples:SN74LVCH16T245-EPFEATURES•Control Inputs V IH/V IL Levels Are Referenced toV CCA Voltage•V CC Isolation Feature–If Either V CC Input Is atGND,All Outputs Are in the High-ImpedanceState•Overvoltage-Tolerant Inputs/Outputs AllowMixed-Voltage-Mode Data Communications•Fully Configurable Dual-Rail Design AllowsEach Port to Operate Over the Full1.65-V to5.5-V Power-Supply Range•Bus Hold on Data Inputs Eliminates the Needfor External Pullup/Pulldown Resistors•I off Supports Partial-Power-Down ModeOperation•Latch-Up Performance Exceeds100mA PerJESD78,Class II•ESD Protection Exceeds JESD22–2000-V Human-Body Model(A114-A)–200-V Machine Model(A115-A)–1000-V Charged-Device Model(C101)SUPPORTS DEFENSE,AEROSPACE,AND MEDICAL APPLICATIONS•Controlled Baseline•One Assembly/Test Site•One Fabrication Site•Available in Military(–55°C/125°C)Temperature Range(1)•Extended Product Life Cycle•Extended Product-Change Notification•Product Traceability(1)Custom temperature ranges availableDESCRIPTIONThis16-bit noninverting bus transceiver uses two separate configurable power-supply rails.The A port is designed to track V CCA.V CCA accepts any supply voltage from1.65V to5.5V.The B port is designed to track V CCB.V CCB accepts any supply voltage from1.65V to5.5V.This allows for universal low-voltage bidirectional translation between any of the1.8-V,2.5-V,3.3-V,and5-V voltage nodes.The SN74LVCH16T245is designed so that the control pins(1DIR,2DIR,1OE,and2OE)are supplied by V CCA.Please be aware that an important notice concerning availability,standard warranty,and use in critical applications ofTexas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.PRODUCTION DATA information is current as of publication date.Copyright©2008–2013,Texas Instruments Incorporated Products conform to specifications per the terms of the TexasTo Seven Other Channels 1DIR1A11B11OETo Seven Other Channels2DIR2A12B12OESN74LVCH16T245-EPSCES726A –NOVEMBER 2008–REVISED NOVEMBER 2013DESCRIPTION (CONTINUED)The SN74LVCH16T245is designed for asynchronous communication between two data buses.The logic levels of the direction-control (DIR)input and the output-enable (OE)input activate either the B-port outputs or the A-port outputs or place both output ports into the high-impedance mode.The device transmits data from the A bus to the B bus when the B-port outputs are activated,and from the B bus to the A bus when the A-port outputs are activated.The input circuitry on both A and B ports is always active and must have a logic HIGH or LOW level applied to prevent excess I CC and I CCZ .Active bus-hold circuitry holds unused or undriven data inputs at a valid logic e of pullup or pulldown resistors with the bus-hold circuitry is not recommended.This device is fully specified for partial-power-down applications using I off .The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.The V CC isolation feature ensures that if either V CC input is at GND,then all outputs are in the high-impedance state.The bus-hold circuitry on the powered-up side always stays active.To ensure the high-impedance state during power up or power down,OE should be tied to V CC through a pullup resistor;the minimum value of the resistor is determined by the current-sinking capability of the driver.Table 1.ORDERING INFORMATION (1)T APACKAGE (2)ORDERABLE PART NUMBER TOP-SIDE MARKING TVSOP –DGV Tape and reel CLVCH16T245MDGVREP LDHT245MEP –50°C to 125°C TSSOP -DGGTape and reelCLVCH16T245MDGGREP8UT245MEP(1)For the most current package and ordering information,see the Package Option Addendum at the end of this document,or see the TI Web site at .(2)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at /sc/package .FUNCTION TABLE (1)(EACH 16-BIT SECTION)CONTROL INPUTS OUTPUT CIRCUITS OPERATION OE DIR A PORT B PORT L L Enabled Hi-Z B data to A bus L H Hi-Z Enabled A data to B busH XHi-ZHi-ZIsolation(1)Input circuits of the data I/Os are always active.LOGIC DIAGRAM (POSITIVE LOGIC)2Submit Documentation Feedback Copyright ©2008–2013,Texas Instruments IncorporatedSN74LVCH16T245-EP SCES726A–NOVEMBER2008–REVISED NOVEMBER2013Absolute Maximum Ratings(1)over operating free-air temperature range(unless otherwise noted)MIN MAX UNITV CCASupply voltage range–0.5 6.5VV CCBI/O ports(A port)–0.5 6.5V I Input voltage range(2)I/O ports(B port)–0.5 6.5VControl inputs–0.5 6.5V O Voltage range applied to any output A port–0.5 6.5V in the high-impedance or power-off state(2)B port–0.5 6.5A port–0.5V CCA+0.5V O Voltage range applied to any output in the high or low state(2)(3)VB port–0.5V CCB+0.5I IK Input clamp current V I<0–50mAI OK Output clamp current V O<0–50mAI O Continuous output current±50mAContinuous current through each V CCA,V CCB,and GND±100mAθJA Package thermal impedance(4)58°C/WT stg Storage temperature range–65150°C (1)Stresses beyond those listed under"absolute maximum ratings"may cause permanent damage to the device.These are stress ratingsonly,and functional operation of the device at these or any other conditions beyond those indicated under"recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The output positive-voltage rating may be exceeded up to6.5V maximum if the output current rating is observed.(4)The package thermal impedance is calculated in accordance with JESD51-7.Copyright©2008–2013,Texas Instruments Incorporated Submit Documentation Feedback3SN74LVCH16T245-EPSCES726A–NOVEMBER2008–REVISED Recommended Operating Conditions(1)(2)(3)V CCI V CCO MIN MAX UNIT V CCA 1.65 5.5 Supply voltage VV CCB 1.65 5.51.65V to1.95V V CCI×0.652.3V to2.7V 1.7High-levelV IH Data inputs(4)V input voltage3V to3.6V24.5V to5.5V V CCI×0.71.65V to1.95V V CCI×0.352.3V to2.7V0.7Low-levelV IL Data inputs(4)V input voltage3V to3.6V0.84.5V to5.5V V CCI×0.31.65V to1.95V V CCA×0.652.3V to2.7V 1.7High-level Control inputsV IH V input voltage(referenced to V CCA)(5)3V to3.6V24.5V to5.5V V CCA×0.71.65V to1.95V V CCA×0.352.3V to2.7V0.7Low-level Control inputsV IL V input voltage(referenced to V CCA)(5)3V to3.6V0.84.5V to5.5V V CCA×0.3V I Input voltage Control inputs0 5.5VActive state0V CCOV I/O Input/output voltage V3-State0 5.51.65V to1.95V–42.3V to2.7V–8I OH High-level output current mA3V to3.6V–244.5V to5.5V–321.65V to1.95V42.3V to2.7V8I OL Low-level output current mA3V to3.6V244.5V to5.5V321.65V to1.95V202.3V to2.7V20Input transitionΔt/Δv Data inputs ns/V rise or fall rate3V to3.6V104.5V to5.5V5T A Operating free-air temperature–4085°C(1)V CCI is the V CC associated with the data input port.(2)V CCO is the V CC associated with the output port.(3)All unused control inputs of the device must be held at V CCA GND to ensure proper device operation and minimize power consumption.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs,literature number SCBA004.(4)For V CCI values not specified in the data sheet,V IH min=V CCI×0.7V,V IL max=V CCI×0.3V.(5)For V CCA values not specified in the data sheet,V IH min=V CCA×0.7V,V IL max=V CCA×0.3V.4Submit Documentation Feedback Copyright©2008–2013,Texas Instruments IncorporatedSN74LVCH16T245-EP SCES726A–NOVEMBER2008–REVISED NOVEMBER2013Electrical Characteristics(1)(2)over recommended operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS V CCA V CCB MIN TYP MAX MIN MAX UNITI OH=–100μA,V I=V IH 1.65V to4.5V 1.65V to4.5V V CCO–0.1I OH=–4mA,V I=V IH 1.65V 1.65V 1.2V OH I OH=–8mA,V I=V IH 2.3V 2.3V 1.9VI OH=–24mA,V I=V IH3V3V 2.4I OH=–32mA,V I=V IH 4.5V 4.5V 3.8I OL=100μA,V I=V IL 1.65V to4.5V 1.65V to4.5V0.1I OL=4mA,V I=V IL 1.65V 1.65V0.45V OL I OL=8mA,V I=V IL 2.3V 2.3V0.3VI OL=24mA,V I=V IL3V3V0.55I OL=32mA,V I=V IL 4.5V 4.5V0.55ControlI I V I=V CCA or GND 1.65V to5.5V 1.65V to5.5V±0.5±1±2μAinputsV I=0.58V 1.65V 1.65V15V I=0.7V 2.3V 2.3V45I BHL(3)μAV I=0.8V3V3V75V I=0.1.35V 4.5V 4.5V100V I=1.07V 1.65V 1.65V–15V I=1.7V 2.3V 2.3V–45I BHH(4)μAV I=2V3V3V–75V I=3.15V 4.5V 4.5V–1001.95V 1.95V2002.7V 2.7V300I BHLO(5)V I=0to V CCμA3.6V 3.6V5005.5V 5.5V9001.95V 1.95V–2002.7V 2.7V–300I BHHO(6)V I=0to V CCμA3.6V 3.6V–5005.5V 5.5V–900A port0V0to5.5V±0.5±1±2I off V I or V O=0to5.5VμAB port0to5.5V0V±0.5±1±2A or BOE=V IH 1.65V to5.5V 1.65V to5.5V±1±2 V O=V CCO orportI OZ GND,μAB port0V 5.5V±1±2OE=don'tV I=V CCI or GNDcareA port 5.5V0V±1±21.65V to5.5V 1.65V to5.5V20I CCA V I=V CCI or GND,I O=05V0V20μA0V5V–21.65V to5.5V 1.65V to5.5V20I CCB V I=V CCI or GND,I O=05V0V–2μA0V5V20I CCA+I CCB V I=V CCI or GND,I O=0 1.65V to5.5V 1.65V to5.5V30μA(1)V CCO is the V CC associated with the output port.(2)V CCI is the V CC associated with the input port.(3)The bus-hold circuit can sink at least the minimum low sustaining current at V IL max.I BHL should be measured after lowering V IN to GNDand then raising it to V IL max.(4)The bus-hold circuit can source at least the minimum high sustaining current at V IH min.I BHH should be measured after raising V IN toV CC and then lowering it to V IH min.(5)An external driver must source at least I BHLO to switch this node from low to high.(6)An external driver must sink at least I BHHO to switch this node from high to low.Copyright©2008–2013,Texas Instruments Incorporated Submit Documentation Feedback5SN74LVCH16T245-EPSCES726A–NOVEMBER2008–REVISED Electrical Characteristics(1)(2)(continued)over recommended operating free-air temperature range(unless otherwise noted)PARAMETER TEST CONDITIONS V CCA V CCB MIN TYP MAX MIN MAX UNIT DIR at V CCA–0.6V,ΔI CCA DIR B port=open,3V to5.5V3V to5.5V50μAA port at V CCA or GNDControlC i V I=V CCA or GND 3.3V 3.3V45pFinputsA or BC io V O=V CCA/B or GND 3.3V 3.3V8.510pFportSwitching Characteristicsover recommended operating free-air temperature range,V CCA=1.8V±0.15V(unless otherwise noted)(see Figure1)V CCB=1.8V V CCB=2.5V V CCB=3.3V V CCB=5VFROM TO±0.15V±0.2V±0.3V±0.5V PARAMETER UNIT (INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAXt PLHA B 1.721.9 1.39.217.40.47.1nst PHLt PLHB A0.923.80.823.80.723.40.723.4nst PHLt PHZOE A 1.529.6 1.529.4 1.529.3 1.429.2ns t PLZt PHZOE B 2.432.2 1.913.1 1.712 1.310.3ns t PLZt PZHOE A0.4240.423.80.423.70.423.7ns t PZLt PZHOE B 1.832 1.518 1.212.60.910.8ns t PZLSwitching Characteristicsover recommended operating free-air temperature range,V CCA=2.5V±0.2V(unless otherwise noted)(see Figure1)V CCB=1.8V V CCB=2.5V V CCB=3.3V V CCB=5VFROM TO±0.15V±0.2V±0.3V±0.5V PARAMETER UNIT (INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLHA B 1.521.4 1.290.8 6.20.6 4.8nst PHLt PLHB A 1.29.319.118.90.98.8nst PHLt PHZOE A 1.49 1.49 1.49 1.49ns t PLZt PHZOE B 2.329.6 1.811 1.79.30.9 6.9ns t PLZt PZHOE A110.9110.9110.9110.9ns t PZLt PZHOE B 1.728.2 1.512.9 1.29.41 6.9ns t PZL6Submit Documentation Feedback Copyright©2008–2013,Texas Instruments IncorporatedSN74LVCH16T245-EP SCES726A–NOVEMBER2008–REVISED NOVEMBER2013Switching Characteristicsover recommended operating free-air temperature range,V CCA=3.3V±0.3V(unless otherwise noted)(see Figure1)V CCB=1.8V V CCB=2.5V V CCB=3.3V V CCB=5VFROM TO±0.15V±0.2V±0.3V±0.5V PARAMETER UNIT (INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAXt PLHA B 1.621.2 1.18.80.8 6.20.6 4.4nst PHLt PLHB A0.87.20.8 6.20.7 6.10.66nst PHLt PHZOE A 1.68.2 1.68.2 1.68.2 1.68.2ns t PLZt PHZOE B 2.129 1.710.3 1.58.80.8 6.3ns t PLZt PZHOE A0.87.80.88.10.88.10.88.1ns t PZLt PZHOE B 1.827.7 1.412.4 1.18.50.8 6.4ns t PZLSwitching Characteristicsover recommended operating free-air temperature range,V CCA=5V±0.5V(unless otherwise noted)(see Figure1)V CC=1.8V V CC=2.5V V CC=3.3V V CC=5VFROM TO±0.15V±0.2V±0.3V±0.5V PARAMETER UNIT (INPUT)(OUTPUT)MIN MAX MIN MAX MIN MAX MIN MAX t PLHA B 1.521.418.80.760.4 4.2nst PHLt PLHB A0.770.4 4.80.3 4.50.3 4.3nst PHLt PHZOE A0.3 5.40.3 5.40.3 5.40.3 5.4ns t PLZt PHZOE B228.7 1.89.7 1.480.7 5.7ns t PLZt PZHOE A0.7 6.40.7 6.40.7 6.40.7 6.4ns t PZLt PZHOE B 1.527.6 1.311.418.10.96ns t PZLOperating CharacteristicsT A=25�CV CCA=V CCA=V CCA=V CCA=TEST VCCB =1.8V V CCB=2.5V V CCB=3.3V V CCB=5VPARAMETER UNIT CONDITIONSTYP TYP TYP TYPA-port input,B-port output2223C pdA(1)CL =0,B-port input,A-port output18191922f=10MHz,pFA-port input,B-port output18192022t r=t f=1nsC pdB(1)B-port input,A-port output2222(1)Power dissipation capacitance per transceiverCopyright©2008–2013,Texas Instruments Incorporated Submit Documentation Feedback7V OH V OLLOAD CIRCUIT × V CCOOpenOutput Control (low-level enabling)Output Waveform 1S1 at 2 × V CCO (see Note B)Output Waveform 2S1 at GND (see Note B)0 V0 VV CCI0 VV CCAV CCOVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESVOLTAGE WAVEFORMS PULSE DURATIONVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMESInputt pd t PLZ /t PZL t PHZ /t PZHOpen 2 × V CCO GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR v 10 MHz, Z O = 50 Ω, dv/dt ≥ 1 V/ns,dv/dt ≥1 V/ns.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.V CCI is the V CC associated with the input port.I.V CCO is the V CC associated with the output port.J.All parameters and waveforms are not applicable to all devices.1.8 V ± 0.15 V2.5 V ± 0.2 V3.3 V ± 0.3 V 5 V ± 0.5 V2 k Ω2 k Ω2 k Ω2 k ΩV CCO R L 0.15 V 0.15 V 0.3 V 0.3 VV TP C L 15 pF 15 pF 15 pF 15 pFSN74LVCH16T245-EPSCES726A –NOVEMBER 2008–REVISED NOVEMBER 2013PARAMETER MEASUREMENT INFORMATIONFigure 1.Load Circuit and Voltage Waveforms8Submit Documentation Feedback Copyright ©2008–2013,Texas Instruments IncorporatedPACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken andAddendum-Page 1continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN74LVCH16T245-EP :•Catalog: SN74LVCH16T245NOTE: Qualified Version Definitions:•Catalog - TI's standard catalog productAddendum-Page 2MECHANICAL DATAMTSS003D – JANUARY 1995 – REVISED JANUARY 1998POST OFFICE BOX 655303 •DALLAS, TEXAS 75265DGG (R-PDSO-G**)PLASTIC SMALL-OUTLINE PACKAGE4040078/F 12/9748 PINS SHOWN0,250,15 NOMGage Plane6,006,208,307,900,750,50Seating Plane250,270,1724A4811,20 MAXM0,080,100,500°–8°5614,1013,9048DIM A MAXA MIN PINS **12,4012,606417,1016,900,150,05NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold protrusion not to exceed 0,15.D.Falls within JEDEC MO-153IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA(INCLUDING DATASHEETS),DESIGN RESOURCES(INCLUDING REFERENCE DESIGNS),APPLICATION OR OTHER DESIGN ADVICE,WEB TOOLS,SAFETY INFORMATION,AND OTHER RESOURCES“AS IS”AND WITH ALL FAULTS,AND DISCLAIMS ALL WARRANTIES,EXPRESS AND IMPLIED,INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products.You are solely responsible for(1)selecting the appropriate TI products for your application,(2)designing,validating and testing your application,and(3)ensuring your application meets applicable standards,and any other safety,security,or other requirements.These resources are subject to change without notice.TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource.Other reproduction and display of these resources is prohibited.No license is granted to any other TI intellectual property right or to any third party intellectual property right.TI disclaims responsibility for,and you will fully indemnify TI and its representatives against,any claims, damages,costs,losses,and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale(/legal/termsofsale.html)or other applicable terms available either on or provided in conjunction with such TI products.TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright© 2020,Texas Instruments Incorporated。

SN74LVC1GX04DCKR;SN74LVC1GX04DRLR;74LVC1GX04DBVRE4;74LVC1GX04DCKRE4;中文规格书,Datasheet资料

FEATURESSee mechanical drawings for dimensions.DNU – Do not useNC – No internal connectionDBV PACKAGE(TOP VIEW)651YVCCNC2GND34X1X2DRL PACKAGE(TOP VIEW)2GNDYVCC651NC34X1X2DCK PACKAGE(TOP VIEW)2GND34X1YVCC65NCX21YEP OR YZP PACKAGE(BOTTOMVIEW)GNDYVCCX1X2 DESCRIPTION/ORDERING INFORMATIONSN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY2004–REVISED DECEMBER2006•Available in Texas Instruments NanoStar™•±24-mA Output Drive at3.3V and NanoFree™Packages•IoffSupports Partial-Power-Down Mode •Supports5-V V CC Operation Operation•Inputs Accept Voltages to5.5V•Latch-Up Performance Exceeds100mA PerJESD78,Class II•One Unbuffered Inverter(SN74LVC1GU04)and One Buffered Inverter(SN74LVC1G04)•ESD Protection Exceeds JESD22•Suitable for Commonly Used Clock–2000-V Human-Body Model(A114-A) Frequencies:–200-V Machine Model(A115-A)–15kHz,3.58MHz,4.43MHz,13MHz,–1000-V Charged-Device Model(C101) 25MHz,26MHz,27MHz,28MHz•Max t pd of2.4ns at3.3V•Low Power Consumption,10-µA Max I CCThe SN74LVC1GX04is designed for 1.65-V to 5.5-V V CC operation.This device incorporates the SN74LVC1GU04(inverter with unbuffered output)and the SN74LVC1G04(inverter)functions into a single device.The LVC1GX04is optimized for use in crystal oscillator applications.ORDERING INFORMATIONT A PACKAGE(1)ORDERABLE PART NUMBER TOP-SIDE MARKING(2)NanoStar™–WCSP(DSBGA)SN74LVC1GX04YEPR(3)PREVIEW0.23-mm Large Bump–YEPReel of3000NanoFree™–WCSP(DSBGA)SN74LVC1GX04YZPR(3)PREVIEW0.23-mm Large Bump–YZP(Pb-free)Reel of3000SN74LVC1GX04DBVR–40°C to85°C SOT(SOT-23)–DBV CX4_Reel of250SN74LVC1GX04DBVTReel of3000SN74LVC1GX04DCKRSOT(SC-70)–DCK D2_Reel of250SN74LVC1GX04DCKTSOT(SOT-553)–DRL Reel of4000SN74LVC1GX04DRLR UC_(1)Package drawings,standard packing quantities,thermal data,symbolization,and PCB design guidelines are available at/sc/package.(2)DBV/DCK/DRL:The actual top-side marking has one additional character that designates the assembly/test site.YEP/YZP:The actual top-side marking has three preceding characters to denote year,month,and sequence code,and one following character to designate the assembly/test site.Pin1identifier indicates solder-bump composition(1=SnPb,•=Pb-free).(3)Package previewPlease be aware that an important notice concerning availability,standard warranty,and use in critical applications of TexasInstruments semiconductor products and disclaimers thereto appears at the end of this data sheet.NanoStar,NanoFree are trademarks of Texas Instruments.UNLESS OTHERWISE NOTED this document contains Copyright©2004–2006,Texas Instruments Incorporated PRODUCTION DATA information current as of publication date.Products conform to specifications per the terms of TexasInstruments standard warranty.Production processing does notnecessarily include testing of all parameters.DESCRIPTION/ORDERING INFORMATION (CONTINUED)X1X2YAbsolute Maximum Ratings (1)SN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY 2004–REVISED DECEMBER 2006X1and X2can be connected to a crystal or resonator in oscillator applications.The device provides an additional buffered inverter (Y)for signal conditioning (see Figure 3).The additional buffered inverter improves the signal quality of the crystal oscillator output by making it NanoStar™and NanoFree™package technology is a major breakthrough in IC packaging concepts,using the die as the package.This device is fully specified for partial-power-down applications using I off (Y output only).The I off circuitry disables the outputs,preventing damaging current backflow through the device when it is powered down.FUNCTION TABLEOUTPUTS INPUT X1X2Y H L H LHLLOGIC DIAGRAM (POSITIVE LOGIC)over operating free-air temperature range (unless otherwise noted)MINMAX UNIT V CC Supply voltage range –0.5 6.5V V I Input voltage range (2)–0.5 6.5V V O Voltage range applied to Y output in the high-impedance or power-off state (2)–0.5 6.5V V O Voltage range applied to any output in the high or low state (2)(3)–0.5V CC +0.5V I IK Input clamp current V I <0–50mA I OK Output clamp current V O <0–50mA I OContinuous output current±50mA Continuous current through V CC or GND±100mADBV package165DCK package 259θJAPackage thermal impedance (4)°C/W DRL package 142YEP/YZP package123T stg Storage temperature range–65150°C (1)Stresses beyond those listed under "absolute maximum ratings"may cause permanent damage to the device.These are stress ratings only,and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions"is not implied.Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)The input and output negative-voltage ratings may be exceeded if the input and output current ratings are observed.(3)The value of V CC is provided in the recommended operating conditions table.(4)The package thermal impedance is calculated in accordance with JESD 51-7.2Submit Documentation FeedbackRecommended Operating Conditions(1)SN74LVC1GX04 CRYSTAL OSCILLATOR DRIVER SCES581B–JULY2004–REVISED DECEMBER2006MIN MAX UNITOperating 1.65 5.5V CC Supply voltage Data retention only 1.5VCrystal oscillator use2V IH High-level input voltage V CC=1.65V to5.5V0.75×V CC VV IL Low-level input voltage V CC=1.65V to5.5V0.25×V CC VV I Input voltage0 5.5VX2,Y0V CCV O Output voltage VY output only,Power-down mode,V CC=0V0 5.5V CC=1.65V–4V CC=2.3V–8I OH High-level output current–16mAV CC=3V–24V CC=4.5V–32V CC=1.65V4V CC=2.3V8I OL Low-level output current16mAV CC=3V24V CC=4.5V32V CC=1.8V±0.15V,2.5V±0.2V20∆t/∆v Input transition rise or fall rate V CC=3.3V±0.3V10ns/VV CC=5V±0.5V10T A Operating free-air temperature–4085°C (1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.Refer to the TI application report,Implications of Slow or Floating CMOS Inputs,literature number SCBA004.3Submit Documentation FeedbackElectrical CharacteristicsSwitching CharacteristicsSwitching CharacteristicsOperating CharacteristicsSN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY 2004–REVISED DECEMBER 2006over recommended operating free-air temperature range (unless otherwise noted)PARAMETERTEST CONDITIONSV CCMIN TYP (1)MAX UNITI OH =–100µA 1.65V to 5.5VV CC –0.1I OH =–4mA1.65V 1.2I OH =–8mA2.3V 1.9V OHV I =5.5V or GNDV I OH =–16mA 2.43V I OH =–24mA 2.3I OH =–32mA 4.5V 3.8I OL =100µA 1.65V to 5.5V0.1I OL =4mA1.65V 0.45I OL =8mA2.3V 0.3V OLV I =5.5V or GND V I OL =16mA 0.43V I OL =24mA 0.55I OL =32mA4.5V 0.55I I X1V I =5.5V or GND 0to 5.5V±5µA I off X1,YV I or V O =5.5V 0±10µA I CC V I =5.5V or GND,I O =01.65V to 5.5V10µA C i V I =V CC or GND3.3V7pF (1)All typical values are at V CC =3.3V,T A =25°C.over recommended operating free-air temperature range,C L =15pF (unless otherwise noted)(see Figure 1)V CC =1.8V V CC =2.5V V CC =3.3V V CC =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAXMIN MAX MIN MAX MIN MAXX2140.8 2.60.6 2.40.52t pdX1ns Y (1)3.5102.26251.53.5(1)X2–no external loadover recommended operating free-air temperature range,C L =30pF or 50pF (unless otherwise noted)(see Figure 2)V CC =1.8V V CC =2.5V V CC =3.3V V CC =5V FROM TO ±0.15V ±0.2V ±0.3V ±0.5V PARAMETERUNIT(INPUT)(OUTPUT)MIN MAXMIN MAXMIN MAX MIN MAXX2 1.170.840.8 3.70.83t pdX1ns Y (1)3.81827.427.825(1)X2–no external loadT A =25°CV CC =1.8VV CC =2.5VV CC =3.3VV CC =5V TEST PARAMETERUNIT CONDITIONS TYP TYP TYP TYP C pdPower dissipation capacitancef =10MHz22222435pF4Submit Documentation FeedbackPARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 V InputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH V LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen V LOAD GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.All parameters and waveforms are not applicable to all devices.Output Control V I1.8 V ± 0.15 V2.5 V ± 0.2 V3.3 V ± 0.3 V 5 V ± 0.5 V1 M Ω1 M Ω1 M Ω1 M ΩV CC R L 2 × V CC 2 × V CC 6 V 2 × V CCV LOAD C L 15 pF 15 pF 15 pF 15 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 3 V V CCV I V CC /2V CC /21.5 V V CC /2V M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 nsINPUTS SN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY 2004–REVISED DECEMBER 2006Figure 1.Load Circuit and Voltage Waveforms5Submit Documentation FeedbackPARAMETER MEASUREMENT INFORMATIONFrom Output Under TestLOAD CIRCUITOpen Data InputTiming InputV I0 VV I0 V0 VInputVOLTAGE WAVEFORMS SETUP AND HOLD TIMESVOLTAGE WAVEFORMS PROPAGATION DELAY TIMESINVERTING AND NONINVERTING OUTPUTSVOLTAGE WAVEFORMS PULSE DURATIONV OHV OHV OLV OLV I0 V InputOutput Waveform 1S1 at V LOAD (see Note B)Output Waveform 2S1 at GND (see Note B)V OLV OH V LOAD /20 V≈0 VV IVOLTAGE WAVEFORMS ENABLE AND DISABLE TIMES LOW- AND HIGH-LEVEL ENABLINGOutputOutputt PLH /t PHL t PLZ /t PZL t PHZ /t PZHOpen V LOAD GNDTEST S1NOTES: A.C L includes probe and jig capacitance.B.Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.C.All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z O = 50 Ω.D.The outputs are measured one at a time, with one transition per measurement.E.t PLZ and t PHZ are the same as t dis .F.t PZL and t PZH are the same as t en .G.t PLH and t PHL are the same as t pd .H.All parameters and waveforms are not applicable to all devices.Output Control V I1.8 V ± 0.15 V2.5 V ± 0.2 V3.3 V ± 0.3 V 5 V ± 0.5 V1 k Ω500 Ω500 Ω500 ΩV CC R L 2 × V CC 2 × V CC 6 V 2 × V CCV LOAD C L 30 pF 30 pF 50 pF 50 pF0.15 V 0.15 V 0.3 V 0.3 VV ∆V CC V CC 3 V V CCV I V CC /2V CC /21.5 V V CC /2V M t r /t f ≤2 ns ≤2 ns ≤2.5 ns ≤2.5 nsINPUTS SN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY 2004–REVISED DECEMBER 2006Figure 2.Load Circuit and Voltage Waveforms6Submit Documentation FeedbackAPPLICATION INFORMATIONValues of C 1and C 2are chosen so that C L +C 1C 2C 1)C 2and C 1≡C 2.R sis the current-limiting resistor,and the of C 2at resonance frequency,i.e.,R s +X C2.R F is the feedback resistor that is used to bias the inverter in theC 1 ≅ 32 pF R LOADa) Logic Diagram ViewYSN74LVC1GU04PortionSN74LVC1G04PortionSN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY 2004–REVISED DECEMBER 2006Figure 3shows a typical application of the SN74LVC1GX04in a Pierce oscillator circuit.The buffered inverter portion)produces a rail-to-rail voltage waveform.The recommended load for the crystal shown in this example is 16pF.The value of the recommended load (C L )can be found in the crystal manufacturer's data sheet.value depends on the maximum power dissipation of the crystal.Generally,the recommended value of R s is specified in the crystal manufacturer's data sheet and,usually,this value is approximately equal to the reactancelinear region of ually,the value is chosen to be within 1M Ωto 10M Ω.Figure 3.Oscillator Circuit7Submit Documentation FeedbackAPPLICATION INFORMATIONR LOADb) Oscillator Circuit in DBV or DCK PinoutPractical Design TipsSN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY 2004–REVISED DECEMBER 2006Figure 3.Oscillator Circuit (continued)•The open-loop gain of the unbuffered inverter decreases as power-supply voltage decreases.This decreases the closed-loop gain of the oscillator circuit.The value of R s can be decreased to increase the closed-loop gain,while maintaining the power dissipation of the crystal within the maximum limit.•R s and C 2form a low-pass filter and reduce spurious ponent values can be adjusted,based on the desired cutoff frequency.•C 2can be increased over C 1to increase the phase shift and help in start-up of the oscillator.Increasing C 2may affect the duty cycle of the output voltage.•At high frequency,phase shift due to R s becomes significant.In this case,R s can be replaced by a capacitor to reduce the phase shift.8Submit Documentation FeedbackAPPLICATION INFORMATION Testing SN74LVC1GX04CRYSTAL OSCILLATOR DRIVERSCES581B–JULY2004–REVISED DECEMBER2006 After the selection of proper component values,the oscillator circuit should be tested using these components.To ensure that the oscillator circuit performs within the recommended operating conditions,follow these steps:1.Without a crystal,the oscillator circuit should not oscillate.To check this,the crystal can be replaced byits equivalent parallel-resonant resistance.2.When the power-supply voltage drops,the closed-loop gain of the oscillator circuit reduces.Ensure thatthe circuit oscillates at the appropriate frequency at the lowest V CC and highest V CC.3.Ensure that the duty cycle,start-up time,and frequency drift over time is within the system requirements.9Submit Documentation FeedbackPACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball Finish MSL Peak Temp (3)74LVC1GX04DBVRE4ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DBVRG4ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DBVTE4ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DBVTG4ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DCKRE4ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DCKRG4ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DCKTE4ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DCKTG4ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM 74LVC1GX04DRLRG4ACTIVE SOT DRL 64000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1GX04DBVR ACTIVE SOT-23DBV 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1GX04DBVT ACTIVE SOT-23DBV 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1GX04DCKR ACTIVE SC70DCK 63000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIMSN74LVC1GX04DCKT ACTIVE SC70DCK 6250Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74LVC1GX04DRLRACTIVESOTDRL64000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIM(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it isPACKAGE OPTION ADDENDUM18-Sep-2008Addendum-Page 1/分销商库存信息:TISN74LVC1GX04DBVR SN74LVC1GX04DCKR SN74LVC1GX04DRLR 74LVC1GX04DBVRE474LVC1GX04DCKRE474LVC1GX04DBVRG4 74LVC1GX04DCKRG474LVC1GX04DRLRG4SN74LVC1GX04DBVT SN74LVC1GX04DCKT74LVC1GX04DBVTE474LVC1GX04DCKTE4 74LVC1GX04DBVTG474LVC1GX04DCKTG4。

SN74LS07 六路高电压开关集成电路数据手册说明书

AYCopyright © 2016Texas Instruments IncorporatedProductFolderSample &BuyTechnicalDocuments Tools &SoftwareSupport &CommunityAn IMPORTANT NOTICE at the end of this data sheet addresses availability,warranty,changes,use in safety-critical applications,intellectual property matters and other important disclaimers.PRODUCTION DATA.SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016SN74LS07Hex Buffers and Drivers With Open-Collector High-Voltage Outputs1Features•Convert TTL Voltage Levels to MOS Levels •High Sink-Current Capability •Input Clamping Diodes Simplify System Design•Open-Collector Driver for Indicator Lamps and Relays2Applications•AV Receivers•Audio Docks:Portable•Blu-ray Players and Home Theaters •MP3Players or Recorders•Personal Digital Assistants (PDA)•Power:Telecom/Server AC/DC Supply:Single Controller:Analog and Digital•Solid-State Drives (SSD):Client and Enterprise •TVs:LCD,Digital,and High-Definition (HDTV)•Tablets:Enterprise •Video Analytics:Server•Wireless Headsets,Keyboards,and Mice3DescriptionThese hex buffers and drivers feature high-voltage open-collector outputs to interface with high-level circuits or for driving high-current loads.They are also characterized for use as buffers for driving TTL inputs.The SN74LS07devices have a rated output voltage of 30V.The maximum sink current is 40mA.These circuits are compatible with most TTL families.Inputs are diode-clamped to minimize transmission-line effects,which simplifies design.Typical power dissipation is 140mW,and average propagation delay time is 12ns.Device Information (1)PART NUMBER PACKAGE (PINS)BODY SIZE (NOM)SN74LS07D SOIC (14)8.65mm ×3.90mm SN74LS07DB SSOP (14) 6.20mm ×5.30mm SN74LS07N PDIP (14)19.30mm ×6.35mm SN74LS07NSSO (14)10.30mm ×5.30mm(1)For all available packages,see the orderable addendum atthe end of the data sheet.Logic Diagram (Positive Logic)2SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments IncorporatedTable of Contents1Features ..................................................................12Applications ...........................................................13Description .............................................................14Revision History .....................................................25Pin Configuration and Functions . (36)Specifications .........................................................46.1Absolute Maximum Ratings......................................46.2ESD Ratings..............................................................46.3Recommended Operating Conditions.......................46.4Thermal Information..................................................46.5Electrical Characteristics...........................................56.6Switching Characteristics..........................................56.7Typical Characteristics..............................................57Parameter Measurement Information ..................68Detailed Description . (7)8.1Overview...................................................................78.2Functional Block Diagram.. (7)8.3Feature Description...................................................78.4Device Functional Modes (7)9Application and Implementation (8)9.1Application Information..............................................89.2Typical Application. (8)10Power Supply Recommendations .......................911Layout . (10)11.1Layout Guidelines.................................................1011.2Layout Example. (10)12Device and Documentation Support (11)12.1Documentation Support........................................1112.2Community Resource............................................1112.3Trademarks...........................................................1112.4Electrostatic Discharge Caution............................1112.5Glossary................................................................1113Mechanical,Packaging,and OrderableInformation (11)4Revision HistoryNOTE:Page numbers for previous revisions may differ from page numbers in the current version.Changes from Revision C (February 2004)to Revision D Page•Added Device Information table,ESD Ratings table,Feature Description section,Device Functional Modes ,Application and Implementation section,Power Supply Recommendations section,Layout section,Device andDocumentation Support section,and Mechanical,Packaging,and Orderable Information section .....................................1•Deleted SN54LS07and SN74LS17from the data sheet because they are obsolete and no longer supplied......................1•Deleted Ordering Information table (1)1A VCC1Y 6A 2A 6Y 2Y 5A 3A 5Y 3Y 4A GND4Y3SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated 5Pin Configuration and FunctionsD,DB,N,or NS Packages 14-Pin SOIC,SSOP,PDIP,SOTop ViewPin FunctionsPINI/O DESCRIPTION 11A I Input 121Y O Output 132A I Input 242Y O Output 253A I Input 363Y O Output 37GND —Ground pin 84Y O Output 494A I Input 4105Y O Output 5115A I Input 5126Y O Output 6136A I Input 614V CC—Power pin4SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated(1)Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.These are stress ratings only,which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions .Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.(2)All voltage values are with respect to GND.(3)This is the maximum voltage that should be applied to any output when it is in the off state.6Specifications6.1Absolute Maximum Ratingsover operating free-air temperature range (unless otherwise noted)(1)MINMAX UNIT V CC Supply voltage 7V V I Input voltage (2)7V V O Output voltage (2)(3)30V T J Operating virtual junction temperature 150°C T stg Storage temperature–65150°C(1)JEDEC document JEP155states that 500-V HBM allows safe manufacturing with a standard ESD control process.(2)JEDEC document JEP157states that 250-V CDM allows safe manufacturing with a standard ESD control process.6.2ESD RatingsVALUEUNIT V (ESD)Electrostatic dischargeHuman-body model (HBM),per ANSI/ESDA/JEDEC JS-001(1)±2000VCharged-device model (CDM),per JEDEC specification JESD22-C101(2)±1000(1)All unused inputs of the device must be held at V CC or GND to ensure proper device operation.See the TI application report,Implications of Slow or Floating CMOS Inputs ,SCBA004.6.3Recommended Operating Conditionsover operating free-air temperature range (unless otherwise noted)(1)MINNOMMAX UNIT V CC Supply voltage 4.7555.25V V IH High-level input voltage 2V V IL Low-level input voltage 0.8V V OH High-level output voltage 30V I OL Low-level output current 40mA T A Operating free-air temperature070°C(1)For more information about traditional and new thermal metrics,see the Semiconductor and IC Package Thermal Metrics application report,SPRA953.6.4Thermal InformationTHERMAL METRIC (1)SN74LS07UNITD (SOIC)DB (SSOP)N (PDIP)NS (SO)14PINS14PINS 14PINS 14PINS R θJA Junction-to-ambient thermal resistance 85.297.450.282.8°C/W R θJC(top)Junction-to-case (top)thermal resistance 43.549.837.540.9°C/W R θJB Junction-to-board thermal resistance 39.744.53041.4°C/W ψJT Junction-to-top characterization parameter 10.916.522.312.4°C/W ψJB Junction-to-board characterization parameter39.44429.941.1°C/W12345678910010203040506070t P L H (n s )Temperature (ƒC)C0035SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated (1)For conditions shown as MIN or MAX,use the appropriate value specified under recommended operating conditions.(2)I OL =40mA6.5Electrical Characteristicsover recommended operating free-air temperature range (unless otherwise noted)PARAMETER TEST CONDITIONS (1)MINTYPMAX UNIT V IK V CC =MIN,I I =–12mA–1.5V I OH V CC =MIN,V IH =2V V OH =30V 0.25mA V OL V CC =MIN,V IL =0.8V I OL =16mA 0.4V I OL =MAX (2)0.7I I V CC =MAX,V I =7V 1mA I IH V CC =MAX,V I =2.4V 20µA I IL V CC =MAX,V I =0.4V –0.2mA I CCH V CC =MAX 14mA I CCL V CC =MAX45mA6.6Switching CharacteristicsV CC =5V,T A =25°C (see Figure 2)PARAMETER FROM (INPUT)TO (OUTPUT)TEST CONDITIONS MINTYP MAX UNIT t PLH AYR L =110Ω,C L =15pF610nst PHL19306.7Typical CharacteristicsFigure 1.t PLH vs.Temperaturett LOAD CIRCUITFOR 3-STATE OUTPUTSHigh-LevelPulseLow-LevelPulseVOLTAGE WAVEFORMSPULSE DURATIONSInputOut-of-PhaseOutput (see Note D)3 V0 VV OLV OH V OH V OL In-Phase Output (see Note D)VOLTAGE WAVEFORMS PROPAGATION DELAY TIMESV Test PointFrom Output Under TestC (see Note LOAD CIRCUITFOR OPEN-COLLECTOR OUTPUTSLOAD CIRCUITFOR 2-STATE TOTEM-POLE OUTPUTS (see Note B)V LFrom Output Under TestTest (see Note B)V CCFrom Output Under Test (see Note S1S23 V3 V0 V 0 VVOLTAGE WAVEFORMS SETUP AND HOLD TIMESTiming InputData Input3 V0 VOutput Control (low-level enabling)Waveform 1(see Notes Cand D)Waveform 2(see Notes Cand D)≈1.5 V V OH −0.5 V V OL + 0.5 V≈1.5 V VOLTAGE WAVEFORMSENABLE AND DISABLE TIMES,3-STATE OUTPUTS6SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated7Parameter Measurement InformationA.C L includes probe and jig capacitance.B.All diodes are 1N3064or equivalent.C.Waveform 1is for an output with internal conditions such that the output is low,except when disabled by the output control.Waveform 2is for an output with internal conditions such that the output is high,except when disabled by the output control.D.S1and S2are closed for t PLH ,t PHL ,t PHZ ,and t PLZ ;S1is open and S2is closed for t PZH ;S1is closed and S2is open for t PZL .E.Phase relationships between inputs and outputs have been chosen arbitrarily for these examples.F.All input pulses are supplied by generators having the following characteristics:PRR ≤1MHz,Z O ≈50Ω,t r ≤1.5ns,t f ≤2.6ns.G.The outputs are measured one at a time,with one input transition per measurement.Figure 2.Load Circuits and Voltage WaveformsAYCopyright © 2016Texas Instruments IncorporatedInputV CCOutputGNDCopyright © 2016,Texas Instruments Incorporated7SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated 8Detailed Description8.1OverviewThe outputs of the SN74LS07device are open-collector and can be connected to other open-collector outputs to implement active-low wired-OR or active-high wired-AND functions.The maximum sink current for the SN74LS07is 40mA.Inputs can be driven from 2.5-V,3.3-V (LVTTL),or 5-V (CMOS)devices.This feature allows the use of this device as translators in a mixed-system environment.Resistor values shown are nominal.Figure 3.Schematic (Gate)8.2Functional Block Diagram8.3Feature Description•Allows for up translation–Inputs accept voltages to 5.25V –Outputs accept voltages to 30V •High Sink-Current Capability –Up to 40mA8.4Device Functional ModesTable 1lists the functions of this device.Table 1.Function TableINPUT AOUTPUT YH Hi-Z LLCopyright © 2016, Texas Instruments Incorporated8SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated9Application and ImplementationNOTEInformation in the following applications sections is not part of the TI component specification,and TI does not warrant its accuracy or completeness.TI’s customers are responsible for determining suitability of components for their purposes.Customers should validate and test their design implementation to confirm system functionality.9.1Application InformationThe SN74LS07device is a high-drive,open-drain CMOS device that can be used for a multitude of buffer-type functions.It can produce 40mA of drive current at 5V.Therefore,this device is ideal for driving multiple inputs.The inputs are 5.25-V tolerant and outputs are 30-V tolerant.9.2Typical ApplicationMultiple channels of the SN74LS07device can be used to create a positive AND logic function,as shown in Figure 4.Additionally,the SN74LS07device can be used to drive an LED by sinking up to 40mA,which may be more than the previous stage can sink.Figure 4.Typical Application Diagram9.2.1Design RequirementsEnsure that the inputs are in a known state as defined by V IH and V IL noted in Recommended Operating Conditions ,or else the outputs may be in an unknown state.9.2.2Detailed Design Procedure 1.Recommended Input Conditions–For specified high and low level,see V IH and V IL in Recommended Operating Conditions .–Inputs are overvoltage tolerant allowing them to go as high as 5.25V.2.Recommend Output Conditions–Load currents must not exceed 40mA per output.–Outputs must not be pulled above 30V.1313.213.413.613.81414.214.414.614.815010203040506070t P H L (n s )Temperature (ƒC)C0049SN74LS07SDLS021D –MAY 1990–REVISED APRIL 2016Product Folder Links:SN74LS07Submit Documentation FeedbackCopyright ©1990–2016,Texas Instruments Incorporated Typical Application (continued)9.2.3Application CurveFigure 5.t PHL vs Temperature10Power Supply RecommendationsThe power supply can be any voltage between the minimum and maximum supply voltage rating indicated in Recommended Operating Conditions .Each V CC pin must have a good bypass capacitor to prevent power disturbance.For devices with a single supply,TI recommends a 0.1-µF capacitor;if there are multiple V CC pins,then TI recommends either a 0.01-µF or 0.022-µF capacitor for each power pin.It is acceptable to parallel multiple bypass capacitors to reject different frequencies of noise.A 0.1-µF and a 1-µF capacitor are commonly used in parallel.The bypass capacitor must be installed as close to the power pin as possible for best results.V ccInputOutputInputOutput10SN74LS07SDLS021D–MAY1990–REVISED Product Folder Links:SN74LS07Submit Documentation Feedback Copyright©1990–2016,Texas Instruments Incorporated 11Layout11.1Layout GuidelinesWhen using multiple bit logic devices,inputs must never float.In many cases,functions or parts of functions of digital logic devices are unused,for example,when only two inputs of a triple-input AND gate are used or only3of the4buffer gates are used.Such input pins must not be left unconnected because the undefined voltages at the outside connections result in undefined operational states.Figure6specifies the rules that must be observed under all circumstances.All unused inputs of digital logic devices must be connected to a high or low bias to prevent them from floating.The logic level that must be applied to any particular unused input depends on the function of the device.Generally they are tied to GND or V CC,whichever makes more sense or is more convenient.It is generally acceptable to float outputs,unless the part is a transceiver.11.2Layout Exampleyout DiagramSN74LS07 SDLS021D–MAY1990–REVISED APRIL201612Device and Documentation Support12.1Documentation Support12.1.1Related DocumentationFor related documentation see the followign:Implications of Slow or Floating CMOS Inputs,SCBA00412.2Community ResourceThe following links connect to TI community resources.Linked contents are provided"AS IS"by the respective contributors.They do not constitute TI specifications and do not necessarily reflect TI's views;see TI's Terms of Use.TI E2E™Online Community TI's Engineer-to-Engineer(E2E)Community.Created to foster collaboration among engineers.At ,you can ask questions,share knowledge,explore ideas and helpsolve problems with fellow engineers.Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support.12.3TrademarksE2E is a trademark of Texas Instruments.All other trademarks are the property of their respective owners.12.4Electrostatic Discharge CautionThese devices have limited built-in ESD protection.The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates.12.5GlossarySLYZ022—TI Glossary.This glossary lists and explains terms,acronyms,and definitions.13Mechanical,Packaging,and Orderable InformationThe following pages include mechanical,packaging,and orderable information.This information is the most current data available for the designated devices.This data is subject to change without notice and revision of this document.For browser-based versions of this data sheet,refer to the left-hand navigation.PACKAGING INFORMATION(1) The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.Addendum-Page 1(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.Addendum-Page 2TAPE AND REEL INFORMATION*All dimensions are nominal Device Package Type Package DrawingPinsSPQ Reel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74LS07DR SOIC D 142500330.016.4 6.59.0 2.18.016.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm)SN74LS07DR SOIC D142500367.0367.038.0MECHANICAL DATAMSSO002E – JANUARY 1995 – REVISED DECEMBER 2001DB (R-PDSO-G**)PLASTIC SMALL-OUTLINE4040065/E 12/0128 PINS SHOWNGage Plane8,207,400,550,950,253812,9012,302810,50248,50Seating Plane9,907,903010,509,900,385,605,00150,2214A 28120166,506,50140,05 MIN 5,905,90DIMA MAX A MIN PINS **2,00 MAX 6,907,500,65M 0,150°–ā8°0,100,090,25NOTES: A.All linear dimensions are in millimeters.B.This drawing is subject to change without notice.C.Body dimensions do not include mold flash or protrusion not to exceed 0,15.D.Falls within JEDEC MO-150IMPORTANT NOTICE AND DISCLAIMERTI PROVIDES TECHNICAL AND RELIABILITY DATA(INCLUDING DATASHEETS),DESIGN RESOURCES(INCLUDING REFERENCE DESIGNS),APPLICATION OR OTHER DESIGN ADVICE,WEB TOOLS,SAFETY INFORMATION,AND OTHER RESOURCES“AS IS”AND WITH ALL FAULTS,AND DISCLAIMS ALL WARRANTIES,EXPRESS AND IMPLIED,INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY,FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS.These resources are intended for skilled developers designing with TI products.You are solely responsible for(1)selecting the appropriate TI products for your application,(2)designing,validating and testing your application,and(3)ensuring your application meets applicable standards,and any other safety,security,or other requirements.These resources are subject to change without notice.TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource.Other reproduction and display of these resources is prohibited.No license is granted to any other TI intellectual property right or to any third party intellectual property right.TI disclaims responsibility for,and you will fully indemnify TI and its representatives against,any claims, damages,costs,losses,and liabilities arising out of your use of these resources.TI’s products are provided subject to TI’s Terms of Sale(/legal/termsofsale.html)or other applicable terms available either on or provided in conjunction with such TI products.TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products.Mailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2019,Texas Instruments Incorporated。

M74HCT646RM13TR, 规格书,Datasheet 资料

1/15April 2003sHIGH SPEED: f MAX = 60 MHz (TYP .) at V CC = 4.5V sLOW POWER DISSIPATION:I CC = 4µA(MAX.) at T A =25°CsCOMPATIBLE WITH TTL OUTPUTS : V IH = 2V (MIN.) V IL = 0.8V (MAX)sSYMMETRICAL OUTPUT IMPEDANCE:|I OH | = I OL = 6mA (MIN)sBALANCED PROPAGATION DELAYS:t PLH ≅ t PHLsPIN AND FUNCTION COMPATIBLE WITH 74 SERIES 646DESCRIPTIONThe 74HCT646 is an advanced high-speed CMOS OCTAL BUS TRANSCEIVER AND REGISTER (3-STATE) fabricated with silicon gate C 2MOS technology.This device consists of bus transceiver circuits with 3 state, D-type flip-flops, and control circuitry arranged for multiplexed transmission of data directly from the input bus or from the internal registers. Data on the A or B bus will be clocked into register on the low to high transition of the appropriate clock pin (Clock AB or Clock BA).Enable (G) and direction (DIR) pins are provided to control the transceiver functions. In the transceiver mode, data present at the high-impedance port may be stored in either register or in both. The select controls (Select ABselect BA) can multiplex stored and real time(transparent mode) data. The direction control determines which bus will receive data when enable G is active (low). In the isolation mode (enable G high), "A" data may be stored in one register and/or "B" data may be stored in the other register. When an output function is disabled, the input function is still enabled and may be used to store and transmit data. Only one of the two buses, A or B, may be driven at a time.All inputs are equipped with protection circuits against static discharge and transient excess voltage.M74HCT646OCTAL BUS TRANSCEIVER/REGISTERWITH 3 STATE OUTPUTSPIN CONNECTION AND IEC LOGIC SYMBOLSORDER CODESPACKAGE TUBET & RDIP M74HCT646B1R SOP M74HCT646M1RM74HCT646RM13TR TSSOPM74HCT646TTRb s o l et e Pr o du c t(s ) - O bs o l e t eP ro dM74HCT6462/15INPUT AND OUTPUT EQUIVALENT CIRCUITPIN DESCRIPTIONTRUTH TABLEZ : High ImpedanceQn : The data stored to the internal flip-flops by most recent low to high transition of the clock inputs* : The data at the A and B bus will be stored to the internal flip-flops on every low to high transition of the clock inputs.PIN No SYMBOL NAME AND FUNCTION1CLOCK ABA toB Clock Input (LOW to HIGH, Edge-Triggered)2SELECT AB Select A to B Source Input 3GAB Direction Control Input 4, 5, 6, 7, 8, 9, 10, 11A1 to A8 A Data Inputs/Outputs 20, 19, 18, 17, 16, 15, 14, 13B1 to B8 B Data Inputs/Outputs 21G Output Enable Input(Active LOW)22SELECT BA Select B to A Source Input 23CLOCK BA B to A Clock Input (LOWto HIGH, Edge Triggered)12GND Ground (0V)24V CC Positive Supply VoltageP ro d u ct(s )M74HCT6463/15LOGIC DIAGRAMTIMING CHARTu c t(s ) - O bs o l e t eP ro d u ct(s )M74HCT6464/15ABSOLUTE MAXIMUM RATINGSAbsolute Maximum Ratings are those values beyond which damage to the device may occur. Functional operation under these conditions is not implied(*) 500mW at 65 °C; derate to 300mW by 10mW/°C from 65°C to 85°CRECOMMENDED OPERATING CONDITIONSSymbol ParameterValue Unit V CC Supply Voltage -0.5 to +7V V I DC Input Voltage -0.5 to V CC + 0.5V V O DC Output Voltage -0.5 to V CC + 0.5V I IK DC Input Diode Current ± 20mA I OK DC Output Diode Current ± 20mA I O DC Output Current ± 35mA I CC or I GND DC V CC or Ground Current± 70mAP D Power Dissipation 500(*)mW T stg Storage Temperature -65 to +150°C T LLead Temperature (10 sec)300°CSymbol ParameterValueUnit V CC Supply Voltage 4.5 to 5.5V V I Input Voltage 0 to V CC V V O Output Voltage 0 to V CC V T op Operating Temperature-55 to 125°C t r , t fInput Rise and Fall Time (V CC = 4.5 to 5.5V)0 to 500nsO b s o l et e Pr o du c t(s )- O bs o l e t eP ro d u ct(s )M74HCT6465/15DC SPECIFICATIONSSymbolParameterTest ConditionValue UnitV CC (V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.V IH High Level Input Voltage4.5 to5.5 2.02.02.0V V ILLow Level Input Voltage4.5 to5.50.80.80.8V V OH High Level Output Voltage4.5I O =-20 µA 4.4 4.5 4.4 4.4V I O =-6.0 mA 4.184.31 4.134.10V OL Low Level Output Voltage4.5I O =20 µA 0.00.10.10.1VI O =6.0 mA 0.170.260.330.40I I Input Leakage Current5.5V I = V CC or GND ± 0.1± 1± 1µAI OZHigh Impedance Output Leakage Current5.5V I = V IH or V IL V O = V CC or GND ± 0.5± 5± 10µA I CC Quiescent Supply Current5.5V I = V CC or GND 44080µA ∆ I CCAdditional Worst Case Supply Current5.5Per Input pin V I = 0.5V or V I = 2.4V Other Inputs at V CC or GNDI O = 02.02.93.0mAO b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )M74HCT6466/15AC ELECTRICAL CHARACTERISTICS (C L = 50 pF, Input t r = t f = 6ns)CAPACITIVE CHARACTERISTICS1) C PD is defined as the value of the IC’s internal equivalent capacitance which is calculated from the operating current consumption without load. (Refer to Test Circuit). Average operating current can be obtained by the following equation. I CC(opr) = C PD x V CC x f IN + I CC /8 (per bit)SymbolParameterTest ConditionValue UnitV CC (V)C L (pF)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.t TLH t THL Output TransitionTime4.5507121519ns t PLH t PHL Propagation DelayTime 4.55020303848ns 150********t PLH t PHL Propagation DelayTime(CLOCK-A,B) 4.55029445565ns 150********t PLH t PHL Propagation DelayTime (SELECT - A,B)4.55024344353ns 15029425365t PZL t PZH High ImpedanceOutput Enable Time (G, DIR)4.550R L = 1 K Ω26384860ns150R L = 1 K Ω31465870t PLZ t PHZ High ImpedanceOutput Disable Time (G, DIR)4.550R L = 1 K Ω26354455ns f MAX Maximum ClockFrequency4.55031552520MHz t W(H) t W(L)Minimum PulseWidth 4.55081519ns t s Minimum Set-Up Time4.5503101313ns t hMinimum Hold Time4.550555nsSymbolParameterTest ConditionValue UnitV CC(V)T A = 25°C -40 to 85°C -55 to 125°C Min.Typ.Max.Min.Max.Min.Max.C INInput Capacitance 5101010pF C I/OBus TerminalCapacitance13pF C PDPower Dissipation Capacitance (note 1)40pFO b s ol e t eP r odu c t(s )- O bs o l et eP ro d u ct(s )M74HCT6467/15TEST CIRCUITC L = 50pF/150pF or equivalent (includes jig and probe capacitance)R 1 = 1K Ω or equivalentR T = Z OUT of pulse generator (typically 50Ω)WAVEFORM 1: PROPAGATION DELAY TIME (f=1MHz; 50% duty cycle)TESTSWITCH t PLH , t PHL Open t PZL , t PLZ V CC t PZH , t PHZGNDO b s o l et e Pr o du c t(s ) - O bs o l e te Pr o du cM74HCT6468/15WAVEFORM 2 : CLOCK AB, BA MINIMUM PULSE WIDTH, PROPAGATION DELAY TIME (f=1MHz; 50% duty cycle)WAVEFORM 3: A, B TO CLOCK MINIMUM SETUP AND HOLD TIME (f=1MHz; 50% duty cycle)O b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )M74HCT6469/15WAVEFORM 4 : OUTPUT ENABLE AND DISABLE TIME (f=1MHz; 50% duty cycle)WAVEFORM 5: OUTPUT ENABLE AND DISABLE TIME (f=1MHz; 50% duty cycle)O b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )15/15Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics.© The ST logo is a registered trademark of STMicroelectronics © 2003 STMicroelectronics - Printed in Italy - All Rights ReservedSTMicroelectronics GROUP OF COMPANIESAustralia - Brazil - Canada - China - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - MoroccoSingapore - Spain - Sweden - Switzerland - United Kingdom - United States.© O b s o l et e Pr o du c t(s ) - O bs o l e t eP ro d u ct(s )。

PSL646技术说明书

正常工作时不大于 25W
动作时
不大于 40W
b) 交流电压回路每相不大于 0.5VA
c) 交流电流回路额定电流为 5A 时每相不大于 1VA
额定电流为 1A 时每相不大于 0.5VA
2.1.4 状态量电平
CPU 及通信接口模件的输入状态量电平 24V 18 V 30V
GPS 对时脉冲输入电平
V1.41
国电南京自动化股份有限公司 2002 年 9 月
*本说明书可能会被修改,请注意最新版本资料 *国电南自技术部监制
第一部分技术说明书
目次
声明
1
安全标准
3
１装置简介
4
1 1 装置的特点
5
２技术参数
8
2.1 额定参数
8
2.2 主要技术性能
9
2.3 绝缘性能
9
2.4 抗电磁干扰性能
10
2.5 机械性能
, 段零序方向电流
方向闭锁
可选
可选
电压闭锁
可选
可选
三相
同期或无压
重合闸
非同期
前加速
加速
后加速
手合加速
过负荷
遥控功能压板
遥测
测量级 CT
保护级 CT
遥信
遥控
4
功能
电度
电度计量
脉冲计量
GPS 对时
防误闭锁
远方管理
装置简介 PSL 646
PSL640 系列
1.1 装置的特点
本产品结构紧凑光电转换模件集成度高已内置于保护装置中光纤接口通用型强适用于工业广泛采用的 1.310 微米波长的单模石英光纤光纤系统传输数字信息量大通过光纤可传送线路本侧全部三相电流量及其他所需信号所有产品的功能配置在出厂前已由本公司完成不增加用户额外的工作量本产品在软件上彻底模块化平台化增强了产品品质的可信赖性简单灵活可靠三者得到完美的统一

SN74AC74PWE4中文资料

PACKAGING INFORMATIONOrderable Device Status (1)Package Type Package Drawing Pins Package Qty Eco Plan (2)Lead/Ball FinishMSL Peak Temp (3)5962-88520012A ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type 5962-8852001CA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type 5962-8852001DA ACTIVE CFPW 141TBD A42N /A for Pkg Type 5962-8852001VCA ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type 5962-8852001VDA ACTIVE CFP W 141TBD A42N /A for Pkg Type SN74AC74D ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DBLE OBSOLETE SSOP DB 14TBDCall TI Call TISN74AC74DBR ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DBRE4ACTIVE SSOP DB 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DE4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DG4ACTIVE SOIC D 1450Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DR ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DRE4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74DRG4ACTIVE SOIC D 142500Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74N ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AC74NE4ACTIVE PDIP N 1425Pb-Free (RoHS)CU NIPDAU N /A for Pkg Type SN74AC74NSR ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74NSRE4ACTIVE SO NS 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74PW ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74PWE4ACTIVE TSSOP PW 1490Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74PWLE OBSOLETE TSSOP PW 14TBDCall TI Call TISN74AC74PWR ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74AC74PWRE4ACTIVE TSSOP PW 142000Green (RoHS &no Sb/Br)CU NIPDAULevel-1-260C-UNLIMSNJ54AC74FK ACTIVE LCCC FK 201TBD POST-PLATE N /A for Pkg Type SNJ54AC74J ACTIVE CDIP J 141TBD A42SNPB N /A for Pkg Type SNJ54AC74WACTIVECFPW141TBDA42N /A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE:Product device recommended for new designs.LIFEBUY:TI has announced that the device will be discontinued,and a lifetime-buy period is in effect.NRND:Not recommended for new designs.Device is in production to support existing customers,but TI does not recommend using this part in a new design.PREVIEW:Device has been announced but is not in production.Samples may or may not be available.18-Jul-2006OBSOLETE:TI has discontinued the production of the device.(2)Eco Plan -The planned eco-friendly classification:Pb-Free (RoHS),Pb-Free (RoHS Exempt),or Green (RoHS &no Sb/Br)-please check /productcontent for the latest availability information and additional product content details.TBD:The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS):TI's terms "Lead-Free"or "Pb-Free"mean semiconductor products that are compatible with the current RoHS requirements for all 6substances,including the requirement that lead not exceed 0.1%by weight in homogeneous materials.Where designed to be soldered at high temperatures,TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt):This component has a RoHS exemption for either 1)lead-based flip-chip solder bumps used between the die and package,or 2)lead-based die adhesive used between the die and leadframe.The component is otherwise considered Pb-Free (RoHS compatible)as defined above.Green (RoHS &no Sb/Br):TI defines "Green"to mean Pb-Free (RoHS compatible),and free of Bromine (Br)and Antimony (Sb)based flame retardants (Br or Sb do not exceed 0.1%by weight in homogeneous material)(3)MSL,Peak Temp.--The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications,and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided.TI bases its knowledge and belief on information provided by third parties,and makes no representation or warranty as to the accuracy of such information.Efforts are underway to better integrate information from third parties.TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary,and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s)at issue in this document sold by TI to Customer on an annualbasis.18-Jul-2006IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard warranty. T esting and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where mandated by government requirements, testing of all parameters of each product is not necessarily performed.TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and applications using TI components. T o minimize the risks associated with customer products and applications, customers should provide adequate design and operating safeguards.TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right, or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI.Reproduction of information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive business practice. TI is not responsible or liable for such altered documentation.Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Following are URLs where you can obtain information on other Texas Instruments products and application solutions:Products ApplicationsAmplifiers Audio /audioData Converters Automotive /automotiveDSP Broadband /broadbandInterface Digital Control /digitalcontrolLogic Military /militaryPower Mgmt Optical Networking /opticalnetwork Microcontrollers Security /securityLow Power Wireless /lpw Telephony /telephonyVideo & Imaging /videoWireless /wirelessMailing Address:Texas InstrumentsPost Office Box 655303 Dallas, Texas 75265Copyright 2006, Texas Instruments Incorporated。