Finite Layer Thickness Stabilizes the Pfaffian State for the 52 Fractional Quantum Hall Eff
AlGaN
第52卷第6期2023年6月人㊀工㊀晶㊀体㊀学㊀报JOURNAL OF SYNTHETIC CRYSTALSVol.52㊀No.6June,2023AlGaN/GaN纳米异质结构中的二维电子气密度研究杨㊀帆1,许并社1,2,3,董海亮1,2,张爱琴1,梁㊀建1,贾志刚1,2(1.太原理工大学新材料界面科学与工程教育部重点实验室,太原㊀030024;2.山西浙大新材料与化工研究院,太原㊀030000;3.陕西科技大学材料原子㊃分子科学研究所,西安㊀710021)摘要:本文设计了纳米线核壳AlGaN/GaN异质结构,研究了势垒层厚度㊁Al组分㊁掺杂浓度对平面和纳米线异质结构中二维电子气(2DEG)浓度的影响规律㊂结果表明,随着势垒层厚度的逐渐增大,两种结构中2DEG浓度增速逐渐减缓,当达到40nm后,由于表面态电子完全发射,2DEG浓度逐渐稳定不变㊂随着Al组分的增加,极化效应逐渐增强,使得两种结构在异质界面处的2DEG浓度都逐渐增加㊂当掺杂浓度逐渐提高时,两者在异质界面处电势差增大,势阱加深,束缚电子能力加强,最终导致2DEG浓度逐渐增加,当掺杂浓度增加到2.0ˑ1018cm-3后,2DEG面密度达到最大值㊂与平面结构相比,纳米线结构可以实现更高的Al组分,在高Al组分之下,2DEG面密度最高可达5.13ˑ1013cm-2,相比于平面结构有较大的提高㊂关键词:AlGaN/GaN;纳米线结构;平面结构;二维电子气浓度;异质结构;能带结构中图分类号:O471;O472㊀㊀文献标志码:A㊀㊀文章编号:1000-985X(2023)06-1136-09Two-Dimensional Electron Gas Density Studies inAlGaN/GaN NanoheterostructuresYANG Fan1,XU Bingshe1,2,3,DONG Hailiang1,2,ZHANG Aiqin1,LIANG Jian1,JIA Zhigang1,2(1.Key Laboratory of Interface Science and Engineering in Advanced Materials Ministry of Education,Taiyuan University of Technology,Taiyuan030024,China;2.Institute of Advanced Materials and Chemical Engineering,Shanxi-Zheda,Taiyuan030000,China;3.Institute of Atomic and Molecular Science,Shaanxi University of Science and Technology,Xi an710021,China)Abstract:In this paper,nanowire core-shell AlGaN/GaN heterostructures were designed and the effects of potential barrier layer thickness,Al component,and doping concentration on the concentration of two-dimensional electron gas(2DEG)in the planar as well as nanowire heterostructures were studied.The results show that,the rise rate of2DEG concentration in both structures slow down as the thickness of potential barrier layer increases,and when the thickness reaches40nm,the2DEG concentration gradually stabilizes due to the complete emission of surface state electrons.With the increase of Al component, the polarization effect is gradually enhanced,which makes the2DEG concentration at the heterogeneous interface of both structures gradually increase.When the doping concentration gradually increases,it can be found that potential difference at the heterogeneous interface increases,the potential well deepening and the ability strengthening for bound electron,which finally lead to the gradual increase of2DEG concentration.The2DEG surface density reaches its maximum value as the doping concentration increases to2.0ˑpared with the planar structure,the nanowire structure can achieve a higher Al component,and the2DEG surface density can reach up to5.13ˑ1013cm-2under the high Al component,which is a large improvement.Key words:AlGaN/GaN;nanowire structure;planar structure;two-dimensional electron gas concentration;heterostructure; band structure㊀㊀收稿日期:2023-01-09㊀㊀基金项目:国家自然科学基金(21972103,61904120,61604104,51672185);山西浙大新材料与化工研究院研发项目(2021SX-AT001, 2021SX-AT002)㊀㊀作者简介:杨㊀帆(1998 ),男,山西省人,硕士研究生㊂E-mail:1532079918@㊀㊀通信作者:贾志刚,博士,讲师㊂E-mail:jiazhigang@㊀第6期杨㊀帆等:AlGaN /GaN 纳米异质结构中的二维电子气密度研究1137㊀0㊀引㊀㊀言GaN 及其三元合金AlGaN 具有禁带宽度大㊁电子漂移速度高㊁击穿电压高㊁热导率高㊁化学性质稳定㊁抗辐照等特点,是制作高电子迁移率晶体管(high electron mobility transistor,HEMT)的理想材料[1-4]㊂纤锌矿结构的AlGaN /GaN 异质结HEMT 存在很强的极化效应(包括压电极化与自发极化效应)[5],极化电场在异质结界面处产生大量的极化电荷,使得AlGaN /GaN HEMT 无须掺杂就具有高浓度的二维电子气(two-dimensional electron gas,2DEG)㊂HEMT 的独特性能是其在异质界面上产生2DEG 的结果,传统HEMT 的制备工艺流程包括缓冲层㊁交替层㊁有源沟道㊁空间层和施主层的生长[6]㊂随着HEMT 体积的逐渐减小,随之出现的各种效应会使其性能变得很不稳定,如温度稳定性差㊁短沟道效应等[7-8]㊂为了解决这些问题,研究人员提出了纳米线沟道HEMT [9-12]㊂然而,刻蚀的纳米线沟道HEMT 会受到声子散射和库仑散射两种散射机制的影响,导致不同的栅极偏置电压㊂为了克服这一问题,本文主要设计了纳米线核壳AlGaN /GaN 异质结构,其可通过外延生长技术来制备,能够避免刻蚀的纳米线在制备过程中产生的位错㊁粗糙等缺陷,可以有效减弱散射效应,提高2DEG 迁移率㊂本文在理论分析的基础上,设计了如图1所示的平面和纳米线异质结构㊂运用nextnano 数值模拟软件分别对平面异质结构和纳米线异质结构中2DEG 浓度进行数值计算,重点对AlGaN /GaN 纳米线异质结构中2DEG 性质进行分析㊂主要包括以下方面:首先分别讨论平面和纳米线AlGaN /GaN 异质结构中势垒层厚度㊁Al 组分㊁势垒层掺杂浓度等参数对2DEG 浓度的影响,然后对平面和纳米线结构中2DEG 浓度进行理论分析,最后进行总结㊂图1㊀异质结构示意图Fig.1㊀Schematic diagram of the heterogeneous structure 1㊀二维电子气浓度仿真计算AlGaN /GaN 异质结构中2DEG 浓度是决定HEMT 器件性能的重要指标㊂异质结构中大的导带偏移和强的极化电场会产生一个窄而深的异质结势阱[13],势阱的形状会直接影响2DEG 的浓度,其对异质结构中势垒层厚度㊁Al 组分㊁掺杂浓度等因素有着较强的依赖关系㊂本节首先对异质界面处电势和电荷的变化进行理论分析,然后对能带结构和2DEG 浓度随各个参数的变化结果进行仿真模拟,之后进一步对能带结构和2DEG 随各参数的变化趋势进行分析与总结㊂1.1㊀AlGaN 势垒层厚度对AlGaN /GaN 异质结构中二维电子气浓度的影响当n 型(窄带隙一侧)和N 型(宽带隙一侧)掺杂的两个晶体接触时,电荷会再分布并产生空间电荷区,为了形成统一的费米能级,电子将从N 区溢出到n 区㊂电荷分布如图2(a)所示,其表达式如式(1)所示㊂ρ(x )=-q (n (x )-N d ),x <0qN D ,0<x <x N {(1)式中:N D ㊁N d 分别为N㊁n 侧的掺杂浓度(本方案中N d 为零);n (x )为接触后空间电荷区的电子气浓度分布函数;x N 为N 侧电荷区的宽度;q 为基本电荷;ρ(x )为空间电荷区中x 处的电荷密度㊂根据高斯定律,Δ㊃(εE )=ρ(其中ε为介电常数,E 为电场强度,Δ为梯度算子,ρ为电荷密度)可知,1138㊀研究论文人工晶体学报㊀㊀㊀㊀㊀㊀第52卷当远离结即n (x )趋近于N d 时,电场分布如图2(b)所示,其表达式如式(2)所示㊂E (x )=-qʏx -ɕ[n (x ∗)]d x ∗/εn ,x <0qN D (x -x N )/εN ,0<x <x N {(2)式中:εN ㊁εn 分别N㊁n 区的介电常数;E (x )为空间电荷区中x 处的电场强度㊂由x =0处电位移矢量的法向分量连续的边界条件,可得电中性条件为[14]:n s =N D x N (3)式中:n s 为2DEG 在n 侧的面密度㊂电荷区的静电势分布ϕ(x )和电场由E (x )=-d ϕ(x )/d(x )相联系,即静电势分布的斜率与电场分布异号,其表达式为:d ϕ(x )d(x )=-E (x )=qʏx -ɕ[n (x ∗)]d x ∗/εn ,x <0qN D (x N -x )/εN ,0<x <x N {(4)图2㊀空间电荷区中的电荷分布和电场分布Fig.2㊀Charge distribution and electric field distribution in the space charge region AlGaN 势垒层的厚度是影响2DEG 浓度的一个重要因素㊂图3和图4给出了平面和纳米线结构随着势垒层厚度增加时的导带图以及2DEG 面密度拟合曲线图㊂图3㊀异质界面处导带随势垒层厚度的变化关系图(其中d 表示AlGaN 势垒层厚度)Fig.3㊀Variation of the conduction band at heterogeneous interface with the thickness of the potential barrier layer (where d denotes the thickness of the AlGaN barrier layer)随着AlGaN 势垒层厚度的增加,传统平面结构和纳米线结构中能够给2DEG 势阱里提供电子的能力增强,从而会使n s 与n (x ∗)增大,由式(3)㊁(4)可知,d ϕ(x )/d(x )逐渐增加,又因为ϕ(x )为增函数,ϕ(x )始终增大的同时增速随着AlGaN 厚度的增加而加快㊂因此,随着势垒层厚度的增加,处于n 与N 两侧同等位置的两点,电势差逐渐增大,从而使传统平面结构和纳米线结构异质界面处势阱深度加大,其束缚电子的能力加强,2DEG 浓度逐渐上升㊂如图3㊁4所示,当其厚度增加到40nm 之后,两者的势阱深度不再发生明显㊀第6期杨㊀帆等:AlGaN /GaN 纳米异质结构中的二维电子气密度研究1139㊀变化,电子浓度增加甚微,此时,平面结构中2DEG 面密度可达1.01ˑ1013cm -2,而在纳米线结构中,2DEG 面密度达到了9.4ˑ1012cm -2,因此,初步估计能够给2DEG 势阱里提供电子的有效势垒厚度为40nm,根据2DEG 来源于表面态的理论[15-16],这可能是由于表面态电子完全发射,2DEG 浓度趋于饱和,其他文献与实验中也证实了这一点[17-18]㊂虽说两者变化趋势相近,但在同一势垒层厚度下,纳米线结构的2DEG 面密度会略低于平面结构㊂1.2㊀Al 组分对AlGaN /GaN 异质结构中二维电子气浓度的影响AlGaN /GaN 异质结构中,决定2DEG 浓度大小的最主要因素是Al 组分㊂未掺杂的AlGaN /GaN 异质结构中2DEG 的形成主要是因为AlGaN 和GaN 中的自发极化效应和压电极化效应,而Al 组分又强烈调制AlGaN 层中的自发极化和压电极化强度,因此对其中载流子浓度和分布具有强烈影响㊂如图5所示为纤锌矿结构的Ga 面AlGaN /GaN 异质结的自发极化和压电极化图解[6],对于纤锌矿结构的GaN 晶体,在没有外应力的情况下,正负电荷中心不重合导致沿极轴方向出现的极化效应叫作自发极化效应[19];AlGaN 材料晶格常数介于AlN 与GaN 之间,当在GaN 衬底上生长AlGaN 时,AlGaN 材料横向将会受到张应力的作用,AlGaN 材料纵向将会受到压缩,使得材料本身不重合的正电中心与负电中心的距离进一步增加,产生了压电极化效应㊂图4㊀2DEG 面密度随AlGaN 势垒层厚度的变化关系图Fig.4㊀Variation of 2DEG surface density with AlGaN potential barrier layerthickness 图5㊀纤锌矿结构Ga 面AlGaN /GaN 异质结的自发极化和压电极化图解Fig.5㊀Illustration of spontaneous polarisation and piezoelectric polarisation of Ga-face AlGaN /GaN heterojunction with wurtzite structure Ga 面的AlGaN /GaN HEMT 器件在异质界面处感生极化电荷,其面密度σ可以表示为:σ=P (top)-P (bottom)=P SP (top)+P PE (top)-P SP (bottom)=P SP (AlGaN)+P PE (AlGaN)-P SP (GaN)(5)式中:P (top)㊁P (bottom)分别为异质界面处上层和下层的极化强度[20];P SP (top)㊁P SP (bottom)分别为异质界面处上层和下层的自发极化强度;P PE (top)为异质界面处上层的压电极化强度;P SP (AlGaN)㊁P SP (GaN)分别为异质界面处AlGaN 层和GaN 层的自发极化强度;P PE (AlGaN)为异质界面处AlGaN 层的压电极化强度㊂其中自发极化强度为[19]:P SP (y )=-(0.052y +0.029)(6)式中:y 为Al 组分含量㊂压电极化强度为[21]:P PE =e 33εz +e 31(εx +εy )(7)式中:e 31㊁e 33为压电系数张量;εz =(c -c 0)/c 0是沿c 轴的应变;εx =εy =(a -a 0)/a 0为x-y 平面内的应变;c ㊁a 和c 0㊁a 0分别是产生应变后的晶格常数和本征晶格常数,两者的关系为[21]:c -c 0c 0=-2C 13C 33a -a 0a 0(8)式中:C 13和C 33是弹性常数,根据以上公式,考虑弛豫度的影响,沿c 轴方向的压电极化大小可表示为[5]:1140㊀研究论文人工晶体学报㊀㊀㊀㊀㊀㊀第52卷P PE =2(1-R )a -a 0a 0e 31-e 33C 13C 33()(9)式中:R 为应变层的弛豫度,各项参数的数值如表1所示㊂当晶格全应变时R =0,完全弛豫时R =1,不存在压电极化㊂对于AlGaN /GaN 异质界面处,AlGaN 薄膜处于张应变状态,即a >a 0,而对于任意Al 组分,都满足(e 31-e 33C 13C 33)<0㊂因此,P PE 为负值,其方向与自发极化方向相同㊂表1㊀纤锌矿结构GaN 、AlN 各项参数Table 1㊀Parameters of GaN and AlN with wurtzite structureParameter GaN AlN Reference a 0/nm 0.31890.3112[22]c 0/nm 0.51850.4982[22]P SP /(C㊃m -2)-0.029-0.081[23]e 33/(C㊃m -2)0.73 1.46[23]e 31/(C㊃m -2)-0.49-0.60[23]C 13/GPa 100127[24]C 33/GPa392382[24]图6和图7分别是室温下平面和纳米线结构的导带图和2DEG 浓度图㊂其中,AlGaN 势垒层的厚度为40nm,Al 组分为0.24㊂在平面结构中,Al 组分的范围一般取0.15~0.40,因为当Al 组分继续增大时,虽然2DEG 浓度有所上升,但其会导致AlGaN 和GaN 之间晶格失配度增大,会使势垒层中缺陷和位错增大,从而导致其界面粗糙度增加,2DEG 迁移率大幅下降,器件性能降低;当Al 组分低于0.15时,AlGaN 和GaN 异质界面处的导带偏移量较小,其对2DEG 限制作用较弱,会导致电子泄漏到AlGaN 和GaN 层,最终使得2DEG 浓度降低㊂而纳米线结构比平面结构多一个维度释放应力[25],能够容忍更高的应变而不产生位错㊂因此,可以将Al 组分的选择范围扩展到0.15~0.75㊂高Al 组分的纳米线结构会产生更高的2DEG 浓度,从而能够使器件性能得到进一步的提升㊂图6㊀异质界面处导带随Al 组分的变化关系图Fig.6㊀Variation of conduction band at heterogeneous interface with Al component 可以看出,随着Al 组分的增加,P SP (AlGaN)及式(9)中的晶格常数a 随之增大,从而导致极化电荷σ逐渐加强,电场增大,电势差加大,使得平面结构与纳米线结构中的势阱深度随着Al 组分的增大而加深㊂在平面结构中,势阱深度逐渐加深,束缚的电子数增加,从而使最终形成的2DEG 浓度增加,当Al 组分达到0.40时,其2DEG 面密度可达到2.45ˑ1013cm -2;在纳米线结构中,铝组分的增加不仅使势阱深度加深,而且在高铝组分下,势垒层中的自发和压电极化效应增强,导致界面处正极化电荷密度增大,势垒高度增加,使得2DEG 浓度快速提高,当Al 组分达到0.75时,其2DEG 面密度最高可达到5.13ˑ1013cm -2㊂但在同一铝组分下,纳米线结构的2DEG 浓度略低于传统平面结构㊂㊀第6期杨㊀帆等:AlGaN /GaN 纳米异质结构中的二维电子气密度研究1141㊀图7㊀2DEG 面密度随Al 组分的变化关系图Fig.7㊀Plot of 2DEG surface density with Al component 1.3㊀掺杂浓度对AlGaN /GaN 异质结构中二维电子气浓度的影响势垒层掺硅会提供电子,因此掺杂浓度对提高2DEG 浓度有重要作用,如图8㊁图9所示为计算所得平面和纳米线结构的导带和2DEG 面密度随势垒层掺杂浓度的变化关系图㊂图8㊀异质界面处导带随势垒层掺杂浓度的变化关系图(其中n 0表示掺杂浓度)Fig.8㊀Plot of the variation of the conduction band at heterogeneous interface with doping concentration of the potential barrier layer (where n 0indicates the dopingconcentration)图9㊀2DEG 面密度随势垒层掺杂浓度的变化关系图Fig.9㊀Plot of 2DEG surface density with doping concentration of the potential barrier layer 从图8和图9中可以看出,随着掺杂浓度的不断提高,式(4)中的n (x ∗)与n s 逐渐增加,从而导致电势差增强,使得平面和纳米线结构的异质结界面势阱深度都有所加深,导致2DEG 面密度不断提高㊂当掺杂浓度增加到2.0ˑ1018cm -3之后,两结构的势阱深度都保持不变,2DEG 面密度达到最大值㊂平面结构中,2DEG 面密度最大可达到1.07ˑ1013cm -2㊂在纳米线结构中,2DEG 面密度最高达到了1.05ˑ1013cm -2㊂但在同一个掺杂浓度下,纳米线结构的2DEG 面密度都低于平面结构,同时,掺杂浓度在2.0ˑ1017~8.0ˑ1017cm -3时,两者面密度差距较大,随着掺杂浓度的继续增加,平面结构的面密度先达到饱和,之后两者面密度差距逐渐减小,最终都达到饱和㊂1142㊀研究论文人工晶体学报㊀㊀㊀㊀㊀㊀第52卷2㊀二维电子气浓度理论分析如图10所示为AlGaN /GaN 异质结的能带分布图[26],根据对异质结的能带和电荷的半经典静电分析,构建出所需要的2DEG 面密度计算公式[19]:n s (y )=σ(y )e - 0 (y )d e 2[eϕb (y )+ΔE F (y )-ΔE C (y )](10)式中:n s (y )为2DEG 面密度;y 为Al 组分含量;σ(y )为AlGaN /GaN 界面的极化电荷;e 为基本电荷电量; 0为真空介电常数;d 为AlGaN 的势垒层厚度㊂图10㊀AlGaN /GaN 异质结的能带分布图Fig.10㊀Energy band distribution of AlGaN /GaN heterojunction AlGaN 的相对介电常数为: (y )=-0.5y +9.5(11)AlGaN 的肖特基势垒高度为:eϕb (y )=(1.3y +0.84)(eV)(12)AlGaN 的费米能级为[19]:ΔE F (y )=E 0(y )+πħ2m ∗(y )n s (y )(13)式中:ħ=h 2π,h 为普朗克常数;AlGaN 的电子有效质量m ∗(y )=(0.2+0.2y )m 0,m 0为静止电子质量,E 0(y )为:E 0(y )=9πħe 28 0㊀8m ∗(y )n s (y ) (y ){}2/3(14)AlGaN /GaN 界面导带带阶为:ΔE C (y )=0.7[E g (y )-E g (0)](15)其中AlGaN 的禁带宽度为:E g (y )=yE g (AlN)+(1-y )E g (GaN)-y (1-y )(16)式中:E g (AlN)㊁E g (GaN)分别是AlN㊁GaN 的禁带宽度㊂将式(13)㊁(14)代入式(10)中并整理可得: 0 (y )d e 29πħe 28 0 (y )㊀8m ∗(y )[]2/3n s (y )2/3+ 0 (y )d e 2πħ2m ∗(y )+1[]n s (y )=σ(y )e - 0 (y )d e 2[eϕb (y )-ΔE C (y )](17)由式(17)可知,在同一参数下,2DEG 浓度n s (y )与极化电荷σ(y )的变化趋势保持一致㊂在平面结构中,晶格为全应变即R =0,其压电极化大小根据式(9)可表示为:P PE =2a -a 0a 0e 31-e 33C 13C 33()(18)在纳米线结构中,晶格为部分弛豫,其压电极化大小参见式(9)㊂其中,0<R <1㊂两者在同一参数下的自发极化相同,因此,根据式(5)可知,平面结构的极化电荷σ(y )强于纳米线结构㊂由式(17)可得,同一参数下,平面结构的2DEG 浓度强于纳米线结构,此结论与2DEG 浓度仿真计算的结果保持一致㊂3㊀结㊀㊀论采用nextnano 软件对AlGaN /GaN 纳米线异质结构中2DEG 浓度进行研究,通过改变势垒层的不同参数,得到以下结论:1)随着势垒层厚度的增加,异质界面处势阱深度加大,其束缚电子的能力加强,2DEG 浓度逐渐上升㊂初步估计能够给2DEG 阱里提供电子的有效势垒厚度为40nm,此时,平面结构中2DEG 面密度可达1.01ˑ1013cm -2,而在纳米线结构中,2DEG 面密度为9.4ˑ1012cm -2㊂当势垒层厚度继续上升时,2DEG 浓度保持不变㊂2)Al 组分是影响2DEG 浓度最主要的因素,随着Al 组分的逐渐增加,形成的2DEG 面密度逐渐增大㊂㊀第6期杨㊀帆等:AlGaN/GaN纳米异质结构中的二维电子气密度研究1143㊀纳米线结构由于可以形成更高的Al组分,其2DEG面密度可达到5.13ˑ1013cm-2,相比于平面结构,有较大的提高㊂3)势垒层掺杂对提高电子气浓度有重要作用,随着掺杂浓度的不断增加,2DEG面密度不断提高,当掺杂浓度增加到2.0ˑ1018cm-3之后,势阱深度不再变化,2DEG面密度达到饱和以后不再增加,此时,平面结构中2DEG面密度可达1.07ˑ1013cm-2,而纳米线中2DEG面密度为1.05ˑ1013cm-2㊂4)分析了同等参数下,平面结构中2DEG浓度高于纳米线结构的主要原因㊂纳米线中存在部分弛豫现象,其压电极化效应弱于平面结构,从而导致其异质界面处极化电荷较少,最终造成2DEG浓度较低㊂参考文献[1]㊀KHAN M A,BHATTARAI A,KUZNIA J N,et al.High electron mobility transistor based on a GaN-Al x Ga1-x N heterojunction[J].AppliedPhysics Letters,1993,63(9):1214-1215.[2]㊀郝㊀跃,张金凤.AlGaN/GaN界面特性研究进展[J].微纳电子技术,2002,39(10):1-7.HAO Y,ZHANG J F.Progress of AlGaN/GaN interface characteristics research[J].Semiconductor Information,2002,39(10):1-7(in Chinese).[3]㊀MAJEWSKI J A,ZANDLER G,VOGL P.Heterostructure field effect transistors based on nitride interfaces[J].Journal of Physics:CondensedMatter,2002,14(13):3511-3522.[4]㊀张东国,李忠辉,彭大青,等.低温GaN插入层对AlGaN/GaN二维电子气特性的改善[J].人工晶体学报,2013,42(7):1406-1409.ZHANG D G,LI Z H,PENG D Q,et al.Improvement of low tmperature GaN interlayer on the property of the two-dimensional electron gas in AlGaN/GaN heterostructure[J].Journal of Synthetic Crystals,2013,42(7):1406-1409(in Chinese).[5]㊀孔月婵,郑有炓.Ⅲ族氮化物异质结构二维电子气研究进展[J].物理学进展,2006,26(2):127-145.KONG Y C,ZHENG Y D.Progress in two-dimensional electron gas in group-ⅲ-nitride heterostructures[J].Progress in Physics,2006,26(2): 127-145(in Chinese).[6]㊀LENKA T R,PANDA A K.Characteristics study of2DEG transport properties of AlGaN/GaN and AlGaAs/GaAs-based HEMT[J].Semiconductors,2011,45(5):650-656.[7]㊀KEYES R W.Fundamental limits of silicon technology[J].Proceedings of the IEEE,2001,89(3):227-239.[8]㊀CHAU R,DOYLE B,DATTA S,et al.Integrated nanoelectronics for the future[J].Nature Materials,2007,6(11):810-812.[9]㊀HE Y L,WANG C,MI M H,et al.Investigation of enhancement-mode AlGaN/GaN nanowire channel high-electron-mobility transistor withoxygen-containing plasma treatment[J].Applied Physics Express,2017,10(5):056502.[10]㊀HE Y L,MI M H,WANG C,et al.Enhancement-mode AlGaN/GaN nanowire channel high electron mobility transistor with fluorine plasmatreatment by ICP[J].IEEE Electron Device Letters,2017,38(10):1421-1424.[11]㊀LU B,MATIOLI E,PALACIOS T.Tri-gate normally-off GaN power MISFET[J].IEEE Electron Device Letters,2012,33(3):360-362.[12]㊀SON D H,JO Y W,SINDHURI V,et al.Effects of sidewall MOS channel on performance of AlGaN/GaN FinFET[J].MicroelectronicEngineering,2015,147:155-158.[13]㊀薛舫时.AlGaN/GaN二维电子气的特性研究[J].半导体情报,2001,38(6):47-51.XUE F S.Two-dimensional electron gases induced in AlGaN/GaN heterostructures[J].Semiconductor Information,2001,38(6):47-51(in Chinese).[14]㊀庄顺连.光子器件物理[M].贾东方,王肇颖,桑㊀梅,等,译.2版.北京:电子工业出版社,2013:45-46.CHUANG S L.Photonic Device Physics[M].JIA D F,WANG Z Y,SANG M,et al.,Transl.2nd ed.Beijing:Electronic Industry Press, 2013:45-46(in Chinese).[15]㊀IBBETSON J P,FINI P T,NESS K D,et al.Polarization effects,surface states,and the source of electrons in AlGaN/GaN heterostructure fieldeffect transistors[J].Applied Physics Letters,2000,77(2):250-252.[16]㊀KOLEY G,SPENCER M G.Surface potential measurements on GaN and AlGaN/GaN heterostructures by scanning Kelvin probe microscopy[J].Journal of Applied Physics,2001,90(1):337-344.[17]㊀KOLEY G,SPENCER M G.On the origin of the two-dimensional electron gas at the AlGaN∕GaN heterostructure interface[J].Applied PhysicsLetters,2005,86(4):042107.[18]㊀VETURY R,SMORCHKOVA I P,ELSASS C R,et al.Polarization induced2DEG in MBE grown AlGaN/GaN HFETs:on the origin,DC andRF characterization[J].MRS Online Proceedings Library,2000,622(1):251.[19]㊀王朝旭.AlGaN/GaN HEMT器件栅漏区域电学性能的研究[D].成都:电子科技大学,2019:23-25.WANG Z X.The study of the gate drain region of AlGaN/GaN HEMT devices on electrical performance[D].Chengdu:University of Electronic Science and Technology of China,2019:23-25(in Chinese).1144㊀研究论文人工晶体学报㊀㊀㊀㊀㊀㊀第52卷[20]㊀AMBACHER O,FOUTZ B,SMART J,et al.Two dimensional electron gases induced by spontaneous and piezoelectric polarization in undopedand doped AlGaN/GaN heterostructures[J].Journal of Applied Physics,1999,87(1):334-344.[21]㊀AMBACHER O.Growth and applications of group III-nitrides[J].Journal of Physics D:Applied Physics,1998,31(20):2653-2710.[22]㊀STRITE S,LIN M E,MORKOÇH.Progress and prospects for GaN and the III-V nitride semiconductors[J].Thin Solid Films,1993,231(1/2):197-210.[23]㊀BERNARDINI F,FIORENTINI V,VANDERBILT D.Spontaneous polarization and piezoelectric constants of III-V nitrides[J].Physical ReviewB,1997,56(16):R10024-R10027.[24]㊀KIM K,LAMBRECHT W R,SEGALL B.Elastic constants and related properties of tetrahedrally bonded BN,AlN,GaN,and InN[J].PhysicalReview B,Condensed Matter,1996,53(24):16310-16326.[25]㊀ERTEKIN E,GREANEY P A,CHRZAN D C,et al.Equilibrium limits of coherency in strained nanowire heterostructures[J].Journal ofApplied Physics,2005,97(11):114325.[26]㊀郝㊀跃,张金风,张进成.氮化物宽禁带半导体材料与电子器件[M].北京:科学出版社,2013:69.HAO Y,ZHANG J F,ZHANG J C.Nitride wide bandgap semiconductor materials and electronic 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FOX50热流计器仪器的用户手册说明书
LaserComp,Inc., 2001-2003 THERMAL CONDUCTIVITY TESTS OF LIQUIDSUSING FOX50HEAT FLOW METER INSTRUMENT(Amendment the FOX50Instrument Manual) INTRODUCTIONTo measure thermal conductivity of liquids using the FOX50Instrument a special cell described here should be used.The cell is made of two flat Pyrex glasses framed into the Polyethylene Terephthalate(PET)spacer ring.The cell should be filled up by the liquid and placed between the two plates of the Instrument.The plates of the FOX50Instrument are made of copper–material having very high thermal conductivity to create uniform heat flow through the sample.Each plate has a heat flow transducer to convert the heat flow into the electric signal.Temperatures of the plates are measured by thermocouples and are automatically controlled to create and maintain the constant temperature difference between the plates,and,consequently,to create the constant heat flow(after reaching thermal equilibrium)through the cell(or sample).Automatic thickness measurement system measures total thickness of the cell.Thickness of the Pyrex glasses x glass is known(comes with the cell), so the software calculates thickness of the liquid layer.CELLThe cell has two holes on the sides of its spacer ring–one to fill the cell, and second one-to let air out of the cell during the filling.Each of the holes has flexible Ether-based Polyurethane e a syringe to fill the cell(see photograph on the next page).Place the cell at an angle and fill it slowly from the bottom.Be careful to let all the air out of the cell,and do not allow any bubbles to form.The outer ends of the tubes should be kept in position higher than the cell to avoid leakage of the liquid.Two O-rings(033Buna-N,2”I D a n d21/8”O D)a r e u s e d t o s e a l t h e c e l l.You can disassemble the cell(if you need to wash it)by carefully applying some water pressure inside it using syringe.The easiest way is to put both the cell and the syringe under water.Do not use sharp tools to open the cell!After assembling the cell back please make sure that its Pyrex glasses are properly placed(parallel to each other)and have good contact with inner part of the spacer ring.TESTSBefore starting the liquid cell tests a Two-Thickness Pyrex calibration with downward heat flow s h o u l d b e p e r f o r m e d.A l s o t h i c k n e s s o f t h e c e l l’s Pyrex glasses should be known(0.33cm each).Warning:For tests of liquids use only downward heat flow to avoid free convection.This is especially important in case of liquids of low viscosity and at elevated temperatures.-O p e n“Wi n T h e r m50”s o f t w a r e a n d e s t a b l i s h c o m m u n i c a t i o n w i t h t h eF O X50I n s t r u m e n t(s e e F O X50I n s t r u m e n t’s M a n u a l).R e-zero thep l a t e s’t h i c k n e s s m e a s u r e m e n t s s y s t e m.C l i c k“S t a r t”.-Put the cell on t h e c e n t e r o f t h e I n s t r u m e n t’s p l a t e.-Make sure that the FOX50upper insulation is in contact with the lower insulation,and the liquid cell hoses that extend beyond have their ends up to prevent liquid draining out.-S e l e c t t h e T e s t M o d e:“L i q u i d C e l l“,u s i n g“F i l e d C a l i b r a t i o n,c l i c k “R u n”.-N e x t t h e“S a m p l e I n f o r m a t i o n”w i n d o w a p p e a r s.E n t e r n a m e o f t h e f i l e, t h i c k n e s s e s o f t h e c e l l’s P y r e x g l a s s e s i n c e n t i m e t e r s(0.33c m),a n d any additional information about the liquid and conditions of the runi n t o“A u x I n f o”.C l i c k“O K”.-N e x t“E n t e r T e s t S e t p o i n t”w i n d o w a p p e a r s.E n t e r t h e s e t p o i n t s’temperatures.Remember that the upper plate should have HIGHER t e m p e r a t u r e t h a n t h e l o w e r o n e!C l i c k O K”.-Next select the double-t h i c k n e s s(i.e.w i t h“.d c a l”e x t e n s i o n)Pyrex calibration file with downward heat flow to be used for calculations.C l i c k“O K”.C h a n g e,i f n e c e s s a r y,t h e“E q u i l i b r i u m C r i t e r i a”(s e eManual).A f t e r f i n i s h i n g e a c h o f t h e s e t p o i n t s t h e m o d i f i e d“Wi n T h e r m50”s o f t w a r e c a l c u l a t e s t h e l i q u i d’s t h e rmal conductivity using values of the heat flow t r a n s d u c e r s’s i g n a l s,c a l i b r a t i o n f a c t o r,t e m p e r a t u r e d i f f e r e n c e,t h i c k n e s s o f t h e l i q u i d l a y e r.C a l i b r a t i o n f a c t o r s a n d P y r e x/I n s t r u m e n t’s t h e r m a l contact resistances are taken from the calibration file to calculate the heat f l u x a n d t h e r m a l r e s i s t a n c e o f t h e l i q u i d l a y e r(s e e n e x t“T h e o r y”S e c t i o n).THEORYThermal resistance is resistance to the flow of heat.Thermal resistance R of a layer is equal to its thickness∆x[m]divided by its thermal conductivity λ[W/mK]:R liquid=∆x liquid/λliquid[m2K/W](1)R glass=∆x glass/λglass[m2K/W](2)Thermal contact resistance R is equal to temperature differenceδT[K] between two contacting surfaces divided by heat flux q[W/m2]:R=δT/q[m2K/W](3)and depends on the types of adjoining materials,their surface roughness, and the interface pressure.T h e r e i s n o t h e r m a l c o n t a c t r e s i s t a n c e b e t w e e n l i q u i d a n d t h e c e l l’s glasses,so the total thermal resistance is equal to:R total=2R glass+R liquid+2R contact(4)Heat Flow Meter instruments can measure only the total thermal resistance-s u m o f t h e c e l l’s t h e r m a l r e s i s t a n c e(l i q u i d a n d t w o P y r e x g l a s s e s),a n d s a m p l e/i n s t r u m e n t’s t h e r m a l c o n t a c t r e s i s t a n c e s2R of both surfaces.The FOX50inst r u m e n t,u s i n g m o d i f i e d“Wi n T h e r m50”s o f t w a r e developed by LaserComp,is able to determine pure thermal conductivityo f t h e l i q u i d e x c l u d i n g t h e P y r e x g l a s s e s’a n d c o n t a c t s’t h e r m a l resistances.Electric signal Q[μV]in Heat Flow Meter instruments is proportional to the heat flux q[W/m2],which is equal to temperature difference∆T divided by the total thermal resistance:Q=q/S cal=∆T/[(∆x/λ+2R contact+2R glass)S cal][μV](5) The calibration factor S cal i s p a r t i c u l a r i n s t r u m e n t’s c h a r a c t e r i s t i cs,which should be determined beforehand during Two-Thickness calibration run (to determine and exclude thermal contact resistance)using Pyrex as standard material with well-known thermal conductivity.Physically,the calibration factor S cal is equal to the heat flux q necessary to create1 microVolt signal on the transducer.Thermal resistance of the glasses2R glass can be calculated using Eq.(3) where the heat fluxq=Q S cal(6)is the same for all layers of the stack–layer of the liquid,both of the glasses and contacts between the glasses and the Instrument plates. Thermal contact resistance2R contac t is taken from Pyrex calibration file.S o,t h e v a l u e o f t h e l i q u i d’s t h e r m a l c o n d u c t i v i t yλis equal to thickness of t h e l i q u i d’s l a y e r d i v i d e d b y t h e l i q u i d’s t h e r m a l r e s i s t a n c e,which is equal to total thermal resistance minus t h e r m a l c o n t a c t r e s i s t a n c e a n d P y r e x’g l a s s e s’t h e r m a l r e s i s t a n c e s:λ=∆x liquid/R liquid=∆x liquid/(R total-2R glass-2R thermal contact);(7) T h e m o d i f i e d“Wi n T h e r m50”s o f t w a r e d e v e l o p e d b y L a s e r C o m p,I n c calculates all results automatically.If you have questions–feel free to call,fax or e-mail to LaserComp: Phone:(781)233-1717;Fax:(781)941-2484;E-mail:***********************Address:LaserComp,Inc.,20Spring Street,Saugus,MA01906,USA。
DBL_7381_2008-10
E/ October 2008Mercedes-BenzSupply SpecificationCoating for major passenger car components/body panels and other functional parts* with high corrosive stressDBL 7381BQF available* also decorative - weather resistantAdditional Daimler standards required: DBL 7399, 7390, 7392, 8585, 6714 and MB Special Terms In addition, Directive 2000/53/EC of the European Parliament and Council of 18 September 2000 regarding end-of-life vehicles (ELV) shall be observed.Supersedes draft 7381 for passenger cars Edition:December 2007Continued on pages 2 to 25Issued by:Daimler AG70546 StuttgartStandards (H. Pfander); Tel.: +49 (0)71117-41040Technical responsibility (Name): Petra Emmert Department: PWT/VBTPlant: 050 Phone: +49(0)7031 90-3775HPC: E 430Technical coordination by PWT / Production and Coating Engineering Plant 050, Department PWT/VBT Name: Dr. Rolf SpechtTelephone: +49(0)7031 90-5326 HPC: B 515Confidential! All rights reserved. Distribution or duplication in part or in whole without prior written approval of DaimlerChrysler AG is not permitted. Incase of doubt, the German language original should be consulted as the authoritative text.Product versions (PV) and application examplesGeneral: Finish coat (top coat) for components subject to high corrosive stress, and - if applicable - also mechanical stress.This DBL applies to coatings on the outer side and underside of vehicles and in the engine compartment, not for vehicle interiors.P r o d u c t v e r s i o n sM o d e r a t e c o r r o s i v e s t r e s sM e a n c o r r o s i v e s t r e s sH e a v y c o r r o s i v e s t r e s sC a v i t y c o a t i n gS t o n e i m p a c t r e s i s t a n t c o a t i n gT h e r m a l s t r e s s 24 h o u r s 130°C *D e c o r a t i v e e f f e c tType of coatingApplication examples00 X Single or multicoat finishcataphoretic dip coating, powder etc.01 X X Thermally stable single or multicoatfinishOnly for special cases following agreement10XSingle or multicoat finish, e.g.cataphoretic dip coating, powder etc.11 X X Thermally stable single or multicoatfinish12 X X Multicoat finish/powder coatingAll parts in the engine compartment and on the underfloor not falling in the category body panel / PV 20/21.20 X XCataphoretic dip coating21 X X XCataphoretic dip coating + stone impact-resistant coating All components in the underfloor area with cavities, or components subject to particularly high corrosive stress22XCataphoretic dip coatingBody panels and/or detachable parts which are only cataphoretically dip coated, such asunderfloor, front module, engine compartment partition, sliding roof frame etc.30 X X Baked multicoat finish and/or powder coatingDecorative and weather resistant Functional parts such as Al disk wheels, outside mirror, air inlet grille, decorative roof strip etc. 31X XBaked multicoat finishDecorative and weather resistantBody panels and/or detachable parts such as trunk lids, engine hoods etc.Abbreviated designation: For drawings in the block for surface protection e.g. DBL 7381.30For product versions 20 to 22, the responsible department PWT/VBT shall be contacted in the event of continuous temperatures > 130°C.PVs 22 and 31 concern components which must comply with MobiLolife requirements.Single or multicoat finish: all common coating systems provided that they comply with the requirements of this DBL. Diese DBL gilt für Beschichtungen an der Außen- und Unterseite des Fahrzeuges und imMotorraum, nicht für den Fahrzeuginnenraum1Field of application, general requirementsProduct versions with light alloys as base material1.1.1 Aluminum alloys1.1.1.1 Extruded aluminum parts / Rolled aluminumThe CASS test and/or the filiform test according to 4.17 shall be performed as approval-relevant corrosion test.1.1.1.2 Aluminum die castingThe CASS test without scribe shall be performed as approval-relevant corrosion test.1.1.1.3 Aluminum sand casting/Aluminum chill castingThe CASS test shall be performed as approval-relevant corrosion test.1.1.1.4 Mirror-turned / polished aluminum wheelsThe filiform corrosion test according to Section 4.17 shall be performed as approval-relevant corrosion test for the mirror-turned section, and the CASS test for the three-layer structure.1.1.2Magnesium die casting / Zinc die castingThe corrosion cycle test shall be performed as the approval-relevant corrosion test .To check the coverage of the whole surface, the CASS test can be used as accelerated test.(This test is performed without scratching the surface).1.1.3Other substratesApproval-relevant corrosion tests shall be agreed with the responsible department.2General properties of the materials, raw materials and supply conditionAll product versionsThe materials (cleaning and phosphating agents) used for pretreatment before coating, the binder types and pigments used for the paintwork structure as well as the coating methods and the drying types shall be disclosed to the receiving Daimler AG plant for initial samples and in the event of changes. This stipulation is intended to facilitate, in particular within the framework of development processes, the general material assessment and compliance with any necessary technical and/or personal protective measures for the processing of painted components (e.g. grinding, welding). The pretreatments and coatings shall be free of heavy metals such as arsenic, cadmium, chromium-VI, lead or their compounds. In addition, DBL 7399, Section1.2.1, DBL 8585 and DBL 6714 as well as directive 2000/53/EC of the European Parliament and Council of 18 September 2000 regarding end-of-life vehicles (ELV) or the latest version of the ELV directive shall be observed.Pretreatment, coating material and coating processes shall be selected by the part supplier so as to fulfill the requirements of this DBL. Residues which could promote corrosion and/or impair adhesion of the coating (flux, scale or similar) shall be removed chemically or mechanically, in particular on weld seams or on laser-cut edges.Edges, corners, overlaps and points accessible only with difficulty which are subject to the risk of corrosion shall be treated particularly carefully.The surface shall be free of any visible roughness, craters, dust inclusions etc.2.1.1PV 22/31All materials used in the coating must have been approved according to the applicable material DBL.e.g. cataphoretic dip coating in accordance with DBL 7292.2.2 InitialsamplingThe corrosion-relevant documents of the initial sample inspection report (ISIR) to PWT/VBT or the responsible department of the receiving MB plant shall be attached in the SQMS system (if available) under ISIR plants – surfaces/corrosion testing, and include the following information:Indication of the production and coating location. If the component is produced or coated at several locations, these locations shall be listed separately including the following data for each location. In addition, one component shall be submitted for sampling for each production/coating location.- Pretreatment materials, product name with product code, supplier- Coating materials, product name with product code (for cataphoretic dip coats also binder and pigment paste), supplier- Process description (flow chart)- Process parameters, test frequency- Layer thickness, layer thickness measuring points and layer thickness window (illustrated documentation), test frequency - Object stoving temperature (ideal, minimum, maximum)- Object temperature curves (at full load), object temperature measuring points (illustrated documentation), test frequency - Test frequency requalification measures according to MB Special Terms (corrosion tests, technical-mechanical coating test in analogy with Section 6.2 of this DBL)- Corrosion test report (illustrated)- Repair paint : work instructions, coating materials with product and name of supplierCorrosion test report for this repair concept (illustrated)(material,process)2.3 ChangesAny changes shall be notified to the Daimler AG receiving plant in good time according to VDA volume 2 and MB Special Terms No. 13 and subjected to initial sampling and approval before application in production.2.4 AssembliesNote that this DBL applies to the testing of individual components. If these components are installed with other components which might have an influence on the overall corrosion result after exposure (e.g. conductive rubber components, material combinations which run the risk of creating contact corrosion etc.), relevant corrosion tests in the corresponding assembly condition shall be agreed.2.5 MAG weld seams / heat-affected zoneMAG weld seams shall be pretreated so that silicate and slag residues are removed to an extent that allows proper pretreatment (e.g. phosphating). The heat-affected zone shall be treated in the same way, if it is accessible. Options: ceramic blasting, vibratory finishing ("Trowalisation"), dry ice blasting etc. In individual cases, an additional coating on the weld seams is also possible. It depends on the component which of these possibilities mentioned makes sense, and it shall therefore be selected following discussions with the responsible Daimler AG department.Pickling of components with cavities is not permissible; exceptions can only be allowed in individual cases for small production series following discussions with PWT/VBT. For such components, a cavity preservation shall then always be provided. Precoated components (e.g. with zinc) shall not be pickled in principle.2.6 Punched and cut edgesPunched and cut edges shall be designed such that compliance with the edge protection required in the relevant PV is reliably ensured. The following rework possibilities are available to improve edge protection: grinding, brushing, vibratory finishing ("Trowalisation"), shot peening etc. If freedom from burrs is specified on the drawing, embossing of the edges, where possible, is recommended. If the parts are laser cut, an oxygen-free cut shall be chosen. Where this is not possible, the edges shall be finished as described above.2.7 Cataphoretic dip coating material and pretreatmentThe supplier shall ensure that the phosphate content in the cataphoretic dip coating bath does not exceed 100 ppm as corrosion protection deteriorates significantly with increasing phosphate content. PWT/VBT and/or the materials engineering department of the relevant Daimler AG receiving plant shall be notified in writing if the cataphoretic dip coating materials are changed following sampling with regard to binder / solids ratio, or if measures are taken which might impact on the flow.In addition, care shall be taken to ensure that an Ni content of 0,8 - 1,2 g/l is maintained in the phosphating when zinc-coated sheets are used.coating2.8 CavityThe minimum layer thickness of cataphoretic dip coatings in cavities shall be 12 µm. A complete flow through the parts shall be ensured for cataphoretic dip coatings of cavities. If air bubbles cannot be avoided, these air bubbles shall be shifted to areas which are non-critical with regard to corrosion and functionality by suspending the parts appropriately. If required, additional measures (e.g. waxing) shall be taken.2.8.1 Cavity preservationIf the flange corrosion exceeds the requirements specified in Sections 4.11.7 and 4.12.7, cavity preservation shall be provided. Also, if the adhesion test in the heat-affected zone of cavities is worse than that required in Sections 4.11.8 and 4.12.8, cavity preservation shall be performed.paintwork2.9 RepairFor repair paintwork, the supplier's repair instructions and the coating materials used shall be indicated according to 2.1.2. If repair paintwork is carried out, the relevant components shall also comply with the requirements of the specified PV. The relevant department is responsible for requesting a component repaired in line with these instructions and for testing it according to the specified PV.The following process is required for rewelded, cataphoretically coated components:Completely remove any weld residues from the weld.- Use angle grinder to remove weld flash.- Resand using 80 grit sanding paper.- Clean using commercially available silicone remover.- Apply 2-component repair primer 4075 manufactured by Spies Hecker.Mixing ratio, layer thickness and drying according to manufacturer's specifications.Refinish using MB 7 167, MB spray can (1-component) MB Art. No. 00 986 29 50/7 167 2 spray applications, air drying. 2.10 CoatingthicknessesFor the paints used, the coating thicknesses specified by the paint supplier, at which the requirements of this DBL are fulfilled, shall be maintained.3Dimensions and tolerances / Form of supplyIn accordance with drawing and approved sample.4Technical dataPreliminary remark:Since in addition to the quality of the coating material itself, the material, the pretreatment and the shape of the parts to be coated may also be crucial to compliance with the following requirements, the tests shall be conducted on finished parts. If, due to their size, components are sawn into pieces, the cut edges shall be protected (by waxing, masking with Jaband No. 92402 supplied by Jaband, www.jaband.de).A test angle between 30° and 70° shall be maintained. For components intended for the underfloor, the underside of the components in the intended installation position in the vehicle shall form the upper side in the test chamber.All values indicated are maximum values.FPT ... Focal point test, refer to Section 6.2 of this DBL.n.r. no requirementFrom Section 4.11, either cross cuts or scratch tests can be performed. The values indicated shall always apply.Affected PVs and their requirementsProperties00/01 10/11/12 20/21/22 30/31 Test method4.1 Color Deviation with respect to standard panel not greater than degree of deviation3-4Section 5.16 of this DBL4.2 GlossIn accordance with drawing or approved sample.Deviation with respect to standard panel not greater than degree of deviation2-3Section 5.15 of this DBL4.3 Layer thickness (FPT) According to drawing or approved sample with the tolerances typical of thematerial, as documented in the ISIR.Section 5.1 of this DBL4.4 Cross-cut (FPT) Gt 1Section 5.3 of this DBL4.5 Mandrel bending test,conical mandrelDocument resultNo requirement at presentSection 5.17 of this DBL4.6 CuppingDocument resultNo requirement at presentSection 5.18 of this DBL4.7 Scratch test (FPT) K2 Section5.2 of this DBLAffected PVs and their requirementsProperties 01 11 Test method4.8 Temperatureresistance The coating shall attain the characteristic values of Section 4.4/4.6 and 4.11 or 4.12 (corrosion cycle test) following exposure to temperature24h 130°C Affected PVs and their requirementsProperties Test method4.9 4.9.1 Multiple stone impact testOriginal conditiononly PVs 30/31Chipping area rating 2Degree of corrosion 0,5Section 5.19 of this DBLSection 5.19.1 of this DBL4.9.2 With salt spray fogExposure time in hRequirementonly PV 12/2172Chipping area rating 2Degree of corrosion 1Section 5.19.2 of this DBL4.10 4.10.1 4.10.2 Steam jet teston St Andrews crosson multiple stone impactonly for PV 30/31No loss of adhesion on St Andrew's crossD1, minor wash-out of existing damageSection 5.20 of this DBLAffected PVs and their requirementsProperties 00/01 10/11/12 20/21/22 30/31 Test method4.11 Constant condensation wateratmosphereSection 5.8 of this DBL Exposure time in h 120 240 360 3604.11.1 Blistering/degree of blistering(S) < 2 (S 2) 0Section 5.6 of this DBL4.11.2 Scratch testK21/24 h minutes after removal on the undamaged surface Section 5.2 of this DBL4.11.3 Cross-cutGt 11/24 h minutes after removal on the undamaged surface Section 5.3 of this DBLAffected PVs and their requirementsProperties 00/01 10/11/12 20/21/22 30/31 Test method4.12 Corrosion cycle testSteel substrates(FPT)Assessment after 1, 3 cycles and at the end of the test period.PVs 00/10 shall only be assessed at the end of the test period.Section 5.10 of this DBLExposure time in cycles 3 6 10 104.12.1 Surface corrosion No clusters or accumulations4.12.1.1 Intermediate assessment1 cycleRi 0 Ri 0 Ri 04.12.1.2 Intermediate assessment3 cyclesRi 0 Ri 0 Ri 04.12.1.3 Final assessment 3 cycles Ri 14.12.1.4 Final assessment 6 cycles Ri 14.12.1.5 Final assessment 10 cycles Ri 1 Ri 0Section 5.5 of this DBL 4.12.2 Edgecorrosion The values indicated refer to one edge length.No integration across the whole component is made.4.12.2.1 Intermediate assessment1 cycle KR 0 KR 0 KR 04.12.2.2 Intermediate assessment3 cycles KR 1 (5%) KR 1 (5%) KR 04.12.2.3 Final assessment 3 cycles KR 2 (30%)4.12.2.4 Final assessment 6 cycles KR 2 (30%)4.12.2.5 Final assessment 10 cycles KR 2 (30%) KR 1 (5 %)Section 5.7 of this DBL 4.12.3 Weld corrosion4.12.3.1 Intermediate assessment1 cycle SR 0 SR 0 SR 04.12.3.2 Intermediate assessment3 cycles SR 1 (5%) SR 1 (5%) SR 1 (5%)4.12.3.3 Final assessment 3 cycles SR 1,5 (20%)4.12.3.4 Final assessment 6 cycles SR 1,5 (20%)4.12.3.5 Final assessment 10 cycles SR 1,5 (20%) SR 1,5 (20%)Section 5.14 of this DBL4.12.4 Subsurface corrosionU/2 in mm at end of test 1,5 2 1,5 1,5Section 5.4 of this DBL 4.12.5 Scratch test K 2 Section 5.2 of this DBL 4.12.6 Cross-cutGt1 Section 5.3 of this DBL4.12.7 Blistering/degree of blistering(S)< 2 (S 2) 0 Section 5.6 of this DBL4.12.8 Flange corrosionAssessment after 3 cyclesNo flange corrosion (no red rust) visible to customer Section 5.22 of this DBL4.12.9 CavitiesAssessment at end of testonly PV 20/21Complete coating in cavities with at least 12µmscratch adhesion in the heat-affected zone K 2. Surface corrosion Ri 0Affected PVs and their requirementsProperties 00/01 10/11/12 20/21/22 30/31 Test method 4.13 Corrosion cycle testZinc-coated and zinc-coated + organically coated / hot-dip aluminized substrates (FPT)Assessment after 1, 3 cycles and at the end of the test period.PVs 00/01 shall only be assessed at the end of the test period.The values indicated refer to white rust. No red rust shall occur in any case.Section 5.10 of this DBLExposure time in cycles 3 6 10 10 4.13.1 Surface corrosion No clusters or accumulations4.13.1 .1 Intermediate assessment1 cycle Ri 0 Ri 0 Ri 04.13.1.2 Intermediate assessment3 cycles Ri 0 Ri 0 Ri 04.13.1.3 Final assessment 3 cycles Ri 14.13.1.4 Final assessment 6 cycles Ri 14.13.1.5 Final assessment 10 cycles Ri 1 Ri 0Section 5.5 of this DBL4.13.2 Edge corrosionThe values indicated refer to one edge length. No integration across the whole component is made.4.13.2.1 Intermediate assessment1 cycle KR 0 KR 0 KR 04.13.2.2 Intermediate assessment3 cycles KR 1 (5%) KR 1 (5%) KR 04.13.2.3 Final assessment 3 cycles KR 3 (50%)4.13.2.4 Final assessment 6 cycles KR 3 (50%)4.13.2.5 Final assessment 10 cycles KR 3 (50%) KR 2 (30%)Section 5.7 of this DBL 4.13.3 Weld corrosion4.13.3.1 Intermediate assessment1 cycleSR 0 SR 0 SR 04.13.3.2 Intermediate assessment3 cycles SR 1 (5%) SR 1 (5%) SR 1 (5%)4.13.3.3 Final assessment 3 cycles SR 1,5 (20%)4.13.3.4 Final assessment 6 cycles SR 1,5 (20%)4.13.3.5 Final assessment 10 cycles SR 1,5 (20%) SR 1,5 (20%)Section 5.14 of this DBL4.13.4 Subsurface corrosionU/2 in mm at end of test4 4 4 4 Section 5.4 of this DBL 4.13.5 Scratch test K 2 Section 5.2 of this DBL 4.13.6 Cross-cut Gt 1 Section 5.3 of this DBL4.13.7 Blistering/degree of blistering(S)< 2 (S 2) 0 Section 5.6 of this DBL4.13.8 4.13.8.1 4.13.8.2 Flange corrosionAssessment after 3 cyclesEnd of testonly PV 20/21/22/31No flange corrosion (no red rust) visible to customerOpen flanges max. Ri 4 white rust (no red rust)Section 5.22 of this DBL4.13.9 CavitiesAssessment at end of testonly PV 20/21/22/31Complete coating in cavities with at least 12µm cataphoretic dip coating scratch adhesion in the heat-affected zone K 2. Surface corrosion Ri 0Affected PVs and their requirementsProperties 00/01 10/11/12 20/21/22 30/31 Test method4.14 Salt spray testonly steel substrates This test can be used to obtain a quick assessment of running series parts forsteel substrates without zinc coatingSection 5.9 of this DBLExposure time in h 168 240 504 5044.14.1 Subsurface corrosionU/2 in mm1 Section 5.4 of this DBL4.14.2 Surface corrosion Ri 1 Section5.5 of this DBL4.14.3 Blistering/degree of blistering(S)< 2 (S 2) 0 Section 5.6 of this DBL 4.14.4 Edge corrosion KR 1 Section 5.7 of this DBL 4.14.5 Scratch test K 2 Section 5.2 of this DBL 4.14.6 Cross-cut Gt1 Section 5.3 of this DBLAffected PVs and their requirementsProduct version 00/01 10/11/12 20/21/22 30/314.15 CASS testAluminumThis test shall be used for aluminum as base material. Section 5.11 of this DBL Exposure time in h 96 168 240 2404.15.1 Subsurface corrosionU/2 in mm2 1 Section 5.4 of this DBL 4.15.2 Surface corrosion Ri 0 Section 5.5 of this DBL4.15.3 Blistering/degree of blistering(S)< 2 (S 2) 0 Section 5.6 of this DBL 4.15.4 Edge corrosion KR 2 (30%) KR 1 (5%) Section 5.7 of this DBL 4.15.4.1 Edge corrosion Al wheels KR 1 Section 5.7 of this DBL 4.15.5 Scratch test K 2 Section 5.2 of this DBL 4.15.6 Cross-cut Gt1 Section 5.3 of this DBLAffected PVs and their requirementsProperties 30/31 Test method4.16 Filiform testAluminumThis test shall be used for aluminum as base material. Section 5.12 of this DBLExposure timeCass test 24 hours28 days at 40°C ±1°C / 82°% ±2% rel. humidity4.16.1 4.16.1.1 Subsurface corrosion around ascribe U/2 in mmMaximum filament length inmm24Section 5.13.1 of this DBL4.16.2 Surface corrosion Ri 0Section 5.5 of this DBL4.16.3 Blistering/degree of blistering(S) 0 (S 0)Section 5.6 of this DBL4.16.4 Edge corrosion Ri 1 (5%) Section5.7 of this DBL 4.16.5 Scratch test K 2 Section 5.2 of this DBL 4.16.6 Cross-cut Gt 1 Section 5.3 of this DBLAffected PVs and their requirementsProperties 30 Test method4.17 Filiform corrosionAluminumThis test shall only be used for mirror turned/polished aluminum wheels.Section 5.13 of this DBLExposure timeCass test 24 hours28 days at 60°C ±1°C / 82°% ±2% rel. humidity4.17.1 4.17.1.1 Subsurface corrosion around ascribe U/2 in mmMaximum filament length inmm24Section 5.13.1 of this DBL4.17.2 Surface corrosion Ri 0 Section5.5 of this DBL 4.17.3 Blistering/degree of blistering(S)0 Section 5.6 of this DBL 4.17.4 Edge corrosion KR 0 Section 5.7 of this DBLAffected PVs and their requirementsProperties 00/0110/11/12 20/21/2230/31Test method 4.18 Corrosion cycle testMagnesium/ZincSection 5.10 of this DBL Exposure time in cycles 104.18.1Subsurface corrosion U/2 in mm 1,5 Section 5.4 of this DBL 4.18.2Surface corrosionRi 0Section 5.5 of this DBL4.18.3 Blistering/degree of blistering (S)0 Section 5.6 of this DBL4.18.4 Edge corrosionKR 2 Section 5.7 of this DBL4.18.5 Scratch test K 2 Section5.2 of this DBL4.18.6 Cross-cut Gt 1Section 5.3 of this DBL Affected PVs and their requirementsProperties 00/01 10/11/12 20/21/22 30/31Test method 4.19 CASS testMagnesium/ZincIn principle, this test is only intended to check the complete coverage of thesurface. This test is performed without scratching the surface.Section 5.11 of this DBLExposure time in h 2404.19.1Surface corrosionSection 5.5 of this DBL4.19.2Edge corrosionSection 5.7 of this DBL4.19.3Blistering/degree ofblistering (S)Only to be used as comparative test.Surface corrosion, edge corrosion and blistering shall comply with the values of the alternating VDA test.The values of the original sample from the CASS test are then a constituent part of the ISIR.Section 5.6 of this DBLAffected PVs and their requirementsProperties 00/01 10/11/12 20/21/22 30/31 Test method4.20 Process and operatingfluid test Proof of compliance with these requirements by the paint supplier shall be sufficient (test results are part of ISIR)4.20.1 Hydraulic fluids The coating shall not demonstrate any changes VDA test sheet 621-412Section 4.1.4 Exposure time4 h at 50 °C4.20.2 Standard gasoline Temporary softening is still permitted provided that the adhesion testrequirements in accordance with Section 4.7. are fulfilled again after aregeneration time of 16 hours VDA test sheet 621-412 Section 4.1.1 Exposure time 10 min at 23°C ± 2°C4.20.3 Preservatives After an exposure time of 60 minutes at 23 ± 2°C, wipe off the preservativewith standard gasoline in accordance with DIN 51 604 Part 1.The coating shall neither be swollen nor discolored. VDA test sheet 621-412 Section 4.2.44.20.4 Cold cleaning solvent Temporary softening is permitted provided that the adhesion test requirementsin accordance with Section 4.7. are fulfilled again after a regeneration time of16 hours VDA test sheet 621-412 Section 4.2.3 Exposure time 10 min at 23°C ± 2°C4.20.5 Brake fluid Temporary softening is permitted provided that the adhesion test requirementsin accordance with Section 4.7. are fulfilled again after a regeneration time of16 hours VDA test sheet 621-412 Section 4.2.1 Exposure time 10 min at 23°C ± 2°CAffected PVs and their requirementsProperties 30/31 Test method4.21 Resistance to chemicals Proof of compliance with these requirements by the paint supplier shall besufficient (test results are part of ISIR)Section 5.21 of this DBL 4.21.1 Sulfuric acid4.21.2 Tree pitch4.21.3 Pancreatin4.21.4 Water4.21.5 Caustic soda solution No discoloration. No change in surface with regard to gloss and adhesionSection 5.21 of this DBL4.21.6 Wheel cleaner Only for Al wheels Section5.21 of this DBL For wheel MB No.A 001 986 34 71Affected PVs and their requirementsProperties30/31 Test method 4.22 Cold resistance No cracks 1 hour at –40°CAffected PVs and their requirementsProperties 30 31 Test method4.23 Weathering Proof of compliance with thisrequirement by the paint suppliershall be sufficient (reference samplepart of ISIR) The coating materials used require a separate DBL approval with regard to the compliance with this item.4.23.1 4.23.1.14.23.1.2 Florida testExposure time withoutaluminum wheelsExposure timeAl wheelsAt least 3 yearsAt least 2 yearsChange in color and gloss compared to unexposed reference sample notgreater than assessment figure 3-4 (color) / 2-3 (gloss).No cracks, no chalking.DBL 7399,Section 7.8.2 under 5°South。
Finite Element Analysis (FEA)
Finite Element Analysis (FEA) Finite Element Analysis (FEA) is a powerful tool used in engineering and scientific fields to simulate and analyze the behavior of complex structures and systems. It is a numerical technique that breaks down a larger system into smaller, more manageable parts called finite elements. These elements are then analyzed to predict how the entire system will behave under various conditions such as stress, heat, vibration, and fluid flow. One of the key benefits of FEA is its ability to provide insight into the performance of a design without the need for physical prototyping. This can significantly reduce the time and cost involved in the product development process. Additionally, FEA allows engineers to explore a wide range of design options and make informed decisions based on the analysis results. This can lead to more efficient and optimized designs that meet performance requirements while minimizing material usage. FEA is widely used in industries such as aerospace, automotive, civil engineering, and biomechanics to analyze and improve the performance of components and systems. For example, in the aerospace industry, FEA is used to simulate the behavior of aircraft structures undervarious loading conditions, helping engineers ensure the safety and reliability of the aircraft. In the automotive industry, FEA is used to optimize the design of vehicle components such as chassis, suspension systems, and engine components to improve performance and fuel efficiency. Despite its many advantages, FEA alsohas its limitations and challenges. One of the main challenges is the need for accurate input data, such as material properties, boundary conditions, and loading conditions. Inaccurate input data can lead to unreliable analysis results, highlighting the importance of careful model setup and validation. Additionally, FEA requires specialized software and expertise to use effectively, which can be a barrier for smaller companies or organizations with limited resources. Furthermore, FEA is not a substitute for physical testing and validation. While FEA can provide valuable insights into the behavior of a design, physical testingis still necessary to verify the accuracy of the analysis results and ensure the safety and reliability of the final product. Moreover, FEA can be computationally intensive, especially for large and complex models, requiring significant computational resources and time to complete the analysis. In conclusion, FiniteElement Analysis (FEA) is a valuable tool for engineers and scientists to simulate and analyze the behavior of complex structures and systems. It offers numerous benefits such as cost and time savings, design optimization, and insight into performance without physical prototyping. However, it also comes with its own set of challenges and limitations, such as the need for accurate input data, specialized software and expertise, and the necessity of physical testing for validation. Despite these challenges, FEA remains an essential tool in the modern engineering and scientific toolkit, enabling the development of safer, more efficient, and innovative designs.。
MISC-Solvers
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UV固化条件聚合动力学和光泽度聚氨酯丙烯酸酯涂料的
Progress in Organic Coatings 76 (2013) 432–438Contents lists available at SciVerse ScienceDirectProgress in OrganicCoatingsj o u r n a l h o m e p a g e :w w w.e l s e v i e r.c o m /l o c a t e /p o r g c o atInfluence of UV-curing conditions on polymerization kinetics and gloss of urethane acrylate coatingsViera Janˇc oviˇc ová∗,Milan Mikula,Bohuslava Havlínová,Zuzana JakubíkováInstitute of Polymer Materials,Department of Graphics Arts Technology and Applied Photochemistry,Faculty of Chemical and Food Technology,Slovak University of Technology,Radlinského 9,SK-81237Bratislava 1,Slovak Republica r t i c l ei n f oArticle history:Received 21April 2012Received in revised form 28September 2012Accepted 20October 2012Available online 14 November 2012Keywords:Photopolymerization Urethane acrylate Kinetics FTIR Glossa b s t r a c tThe photochemically curable polymer films were prepared by addition of 2,2-dimethyl-2-hydroxyacetophenone (Darocure 1173)as a radical initiator to aliphatic urethane tetraacrylate Craynor 925.Kinetic study of the UV-curing of these films by medium pressured mercury lamp was performed by means of infrared spectroscopy.The results showed that the photoinitiator concentration,the light inten-sity,sample coating thickness,presence of air oxygen,as well as the UV light intensity were the most significant factors affecting the polymerization course of UV-cured films.The influence of the sample coating thickness on the kinetics and final gloss were also considerable.© 2012 Elsevier B.V. All rights reserved.1.IntroductionLight induced curing in polymer coating systems has been intensively studied due to environmental protection,lower energy consumption and rapid curing even at the room temperature.One of the most effective methods of fast generation of spatial crosslinked polymers is based on a multifunctional monomer or oligomer exposed by UV light in the presence of an initiator [1–3].Therefore,UV-curing technology has been considered as an alterna-tive to traditional solvent-borne coatings,due to its eco-compatible process and excellent properties,such as high hardness,gloss,scratch and chemical resistance caused by high crosslink density from acrylate groups [4].Desired ingredients in radically cured formulations are ure-thane acrylate oligomers providing chemical,water resistance and heat resistance and adhesion.Polyurethane acrylate resins are often used in the liquid state as precursors to produce three-dimensional networks giving high-performance final materials [5].As UV curable resins they prove excellent adhesion,flexibility,impact property,chemical and scratch resistance and weather-ability [6,7]but often suffer from the high viscosities.They are commercially available with molecular weights ranging from 600g/mol to 6000g/mol and with functionalities ranging from 2to 6.Depending on molecular weight and chemical structure,hard∗Corresponding author.Tel.:+421259325227;fax:+421252493198.E-mail address:viera.jancovicova@stuba.sk (V.Janˇc oviˇc ová).stiff to flexible coatings can be prepared in a broad range of prop-erties [8,9].The photoinitiated polymerization with photoinitiatorDarocure 1173(2-hydroxy-2-methyl-1-phenylpropane-1-one)was studied and the maximal conversion was obtained at 70◦C [10].Several authors dealt with water based urethane acrylate coatings.The advantages offered by these environment-friendly systems are partially offset by the necessity to introduce a drying step before the UV-exposure,which will increase the overall processing time.The water sensitivity of these UV-cured polymers and their hydrophilic character may also restrict their use in a humid environment and in exterior applications [11,12].The important aspect of a coated material in terms of qual-ity is a gloss [13–16].It is influenced by many factors such as rheological properties and formulation of the coating,film flat-tening,curing rate,layer thickness,refraction index,substrate characteristics (roughness,pore size distribution),film curing behaviour (wrinkling,cratering,and yellowing),etc.In principle,the gloss is a complex phenomenon resulting from the interaction between light and the surface of the coating.Kim et al.studied the influence of coating composition and curing conditions on the final surface properties (pencil hardness and coating gloss).They found out that some gloss decrease can be caused by oxygen inhibition of polymerization.If simultaneously the lower layers are cross-linked,then shrinkage could occur resulting in puckering or wrinkling in the top layer.Consequently,the wrinkled pattern on the surface leads to low gloss since the surface is no longer smooth [17].The influence of the curing conditions (UV light intensity,coating thickness)and coating formulation (photoinitiator type0300-9440/$–see front matter © 2012 Elsevier B.V. All rights reserved./10.1016/j.porgcoat.2012.10.010V.Janˇc oviˇc ováet al./Progress in Organic Coatings76 (2013) 432–438433and concentration)on the UV-curing of1,6-hexandioldiacrylate andfinal gloss of the cured surface was significant.In these low viscose formulations the gloss was decreasing during the curing process.The gloss decrease of the coatings thicker than15m was considerable,which might be caused by shrinking of the sample surface during its curing[15].Ruiz and Machado[16]discussed the behaviour of UV-clear coats submitted to degradation processes on the basis of gloss changes.The authors found that the composition of the curing system and the curing conditions effectively affect the rate of polymerization,the maximum conversion reached and the surface properties,including gloss,hydrophobicity,surface energy.Gloss is important parameter in the printing technology, providing products with a better overall look,higher chroma (greater depth of colours)[15].UV-cured urethane acrylate clear coats are suitable to function as protective coating for prints,their advantage is an improvement in the surface properties of the coated materials such as excellent scratch and abrasion resistance, the gloss and brilliancy of print[18].The aim of this study was to investigate the curing process of a simple varnish model system composed of urethane acrylate oligomer Craynor925and photoinitiator(Darocure1173)in rela-tion to a coating composition,curing conditions(UV light intensity, air)and coating thickness.Subsequently,the influence of these fac-tors on the gloss evolution during the curing process as well as the influence of coating on the colour stability was studied.2.Material and methods2.1.MaterialsLow viscosity modified aliphatic urethane tetraacrylate Craynor925(Sartomer,France)and radical photoinitiator,2-hydroxy-2-methyl-1-phenylpropane-1-one(Darocure1173,Ciba, Switzerland)were used in order to prepare a simple varnish model.The UV–vis spectrum of this photoinitiator has absorp-tion maxima at245nm(ε=7320dm3mol−1cm−1),280nm (ε=947dm3mol−1cm−1)and325nm(ε=85dm3mol−1cm−1).2.2.Preparation offilmsThe samples were applied immediately after preparation.Var-ious amounts of initiator(from0.5wt.%to5wt.%)were added to urethane acrylate,mechanically mixed and stored in opaque bot-tle.The viscosity of prepared coatings was2700mPa s at25◦C,the density1.1g cm−3and the surface energy about35mJ m−2.Pho-tocuring reactions were realized on aluminium and glass plates. The defined sample volume(according to layer thickness)was spread on the plate by spin coating apparatus(Tesla Roˇz nov,Czech Republic).Different layer thicknesses were achieved by different spin velocity(2000–4000rpm)and different amount of applied sample,while the average layer thickness was determined by gravi-metric measurements.Consequently,some layers were covered with polyethylene foil(PE,Chemosvit,Slovak Republic,thickness 30m,molecular weight3×103kg mol−1,permeability for oxy-gen450cm3m−2day−1).The PE foil reduced the sample contact with atmospheric oxygen,thus,preventing the oxygen inhibition influence.PE foil had absorbed round40%of radiation in the spec-tral absorption region of the photoinitiator that was considered at the UV exposition.2.3.UV-curing of coatingsThe samples on the aluminium plates were irradiated by a medium pressure mercury lamp250W(RVC,Czech Republic)built into an UV-cure device constructed in our laboratory.The lamp (without anyfilters)emits standard medium pressure mercury radiation with narrow bands in UV and vis regions.However, the absorption regions of the used photoinitiator with maxima at245nm,280nm and325nm,causes that only UV radiation is photochemically active.In order to prevent the overheating during exposure the samples were placed on the water cooled Cu plate kept at25◦C.The intensity of incident light was changed with the varying distance of the light source from the sample(5cm=23mW cm−2,9cm=17mW cm−2, 12cm=12mW cm−2,15cm=7mW cm−2).The incident light intensity was measured by UVX digital radiometer(UVP,USA)with the probes for UVA and UVB region(the given values are the sum of the two measured values).Full sample area(12cm2)was exposed with the same light intensity.The curing process was evaluated by IR spectroscopy(FTIR spectrophotometer EXCALIBUR SERIES Digi-lab FTS3000NX,USA)based on the transmittance measurements. The degree of conversion in the curedfilm was determined accord-ing to the amount of acrylate double bond(twisting vibration at 810cm−1,stretching vibration at1610–1640cm−1)by a baseline method.The internal standard was a carbonyl peak at1725cm−1, in order to eliminate the influence of scatter in layer thickness.The degree of conversion X and relative polymerization rate R p were cal-culated from well-known equation(1)[19]which were modified according to the standard peak:X=1−A t( )A0( )·A0(1725)A t(1725)×100(1)where A0( )and A t( )is the absorbance of monomers C C bonds measured at chosen wavelength(810,1618or1635cm−1)before and after the exposure to UV light for the time t,respectively and A0(1725)and A t(1725)is the absorbance of carbonyl bonds at the same exposure time.Generally,our experiences show that the absorbance at1725cm−1did not change with irradiation.The relative polymerization rate R p was calculated from equa-tion R p=( X/ t),where X is the conversion degree of monomer’s C C bonds,at the exposure time t.The values of maximum conver-sion X max and maximum polymerization rate R p,max were obtained from the plots of X and R p vs.time in initial stage of curing.The time interval of curing steps was changed during the curing pro-cess to obtain nearly the same and noticeable change of absorbance at1635cm−1.2.4.Sample gloss estimationGloss(G)is defined as the ability of a surface to reflect light to the specular angle.Gloss(in gloss units“GU”)can be measured by gloss-metres that are able to compare the amount of light reflected from the sample surface and from the gloss standard at the same geometry set-up.Glossy black glass with defined refractive index is usually used as a calibration standard(GU=100).The sample surface appears to be matt if its gloss is less than6GU,if the sample gloss is in the range of6–30GU then the surface is semi-matt,if the surface reaches the gloss of30–70GU then the surface appears to be semi-glossy,and if its gloss is over70GU of the standard gloss then the surface is high-glossy.The gloss of coated lustrously foils is often pretty higher than100GU because of light reflection from 2or more boundaries.Gloss changes were monitored in real time during the sample curing process using a monochromatic gloss-metre constructed in our laboratory.The gloss measurements were carried out using the glass substrate samples with a matt-white surface.The sample was placed andfixed on a horizontal support,illuminated by red diode-laser light(650nm)at the angle of45◦,and the light reflected from the sample surface was detected by a silicon photodetector with the linear amplifier.Illuminated area was10mm×5mm at the centre of the sample and the laser diode was25cm apart.At the434V.Janˇc oviˇc ováet al./Progress in Organic Coatings 76 (2013) 432–438same time,the sample was exposed and cured by UV light andthe change of the photodetector signal U t sample was recorded.The signal is proportional to the light reflected,i.e.to the gloss of the sample surface.The glossy black glass was used as the calibration standard (100GU).The gloss value at given exposure time t was calculated using equation:G t =U t sampleU standard×100(2)The final gloss values of completely cured surfaces G ∞were obtained from plots of G t vs.time [15].2.5.Testing the effect of coating on the light fastness of ink-jet prints coloursThe samples (solid printed areas,4cm 2)were printed by ink jet printer Desk Jet 560C (Hewlett Packard,resolution 300dpi)with CMYK dye based inks on paper,then coated by bar film applicator with a layer of urethane acrylate Craynor 925containing 3wt.%)of photoinitiator Darocure 1173.The coatings were cured (60s at 23mW cm −2).Consequently the samples were irradiated in the laboratory made box with metal halogen and fluorescent lamps simulating day light exposition (colour temperature 5000K).The total light dose varied between 5and 20MJ m −2.UV–vis reflectance spectra were measured by spectrocolorimeter Spectrolino,GretagMacbeth AG.The total colour difference E ∗abwas calculated from Eq.(3)[20]:E ∗ab=[( L ∗)2+( a ∗)2+( b ∗)2]1/2(3)where L ∗=L ∗2−L ∗1; a ∗=a ∗2−a ∗1and b ∗=b ∗2−b ∗1.Value L *represents lightness of colour spot,chromatic coordi-nates a *and b *range from red to green and from yellow to blue colour respectively.Difference of the two colours in the CIELAB colour space is given by the length of the line connecting the points given by the L *,a *,b *coordinates of respective colours and can be calculated using equation [24],where values L 1,a 1,b 1were mea-sured immediately after samples preparation and L 2,a 2,b 2after irradiation with the above-mentioned lamp.3.Results and discussionPhotochemical curing of coatings prepared from urethane acrylate Craynor 925with various content of initiator 2-hydroxy-2-methyl-1-phenylpropane-1-one was observed by FTIR spectroscopy.The samples were coated on aluminium plates.The curing process resulted in a decrease of the intensity of C C band vibrations at 810,1618and 1635cm −1(Fig.1).The conversion was calculated according to equation for all three wavenumbers (Fig.2).The calculated values of consumption of monomer and polymer-ization rate were very similar and independent on wavenumber.In the following experiments the conversion degrees and the reac-tion rates were calculated only based on the values at 810cm −1.The spectra were normalized according to the carbonyl peak at 1725cm −1.The double bond content of the uncured formulation was defined as 100%.3.1.Influence of the initiator concentrationThe photoinitiator plays a key role in the process of light induced curing.It produces free radicals that are initiating the chain reac-tion with double bond in tetrafunctional urethane acrylate.Hence it regulates the rate of initiation,the amount of light penetrating to the system and the degree of conversion.The lower production of initiating radicals at low photoinitiator concentration results in the20001750150 0125 0100 075020*********T r a n s m i t a n c e [%]Wavenumber [cm -1]Fig.1.Infrared spectra of a urethane acrylate Craynor 925with initiator Darocure 1173contents 3wt.%before (solid line)and after exposition 1min,light intensity 23mW cm −2(dot line).reduction of the polymerization rate and lower conversion.Another factor affecting the polymerization is the oxygen inhibition effect,which is due to the scavenging of the initiating and grows radi-cals by molecular oxygen [21,22].Longer UV exposure required at low photoinitiator concentration will increase the amount of atmospheric oxygen that diffuses into the sample and makes the oxygen inhibition to be more pronounced.In order to reduce the oxygen amount in the layer the samples were covered with thin polyethylene foil during curing.The samples were cured at various light intensities in the range from 7mW cm −2to 23mW cm −2.The curing at the lowest and at the highest intensity is presented in Fig.3and Table 1.The concentration of photoinitiator varied in the range of 0.5–5wt.%)according to the mass of urethane acrylate.The amount of initia-tor has significant influence on the curing of urethane acrylate.The maximal conversion degree and maximal polymerization rate were reached at the initiator concentration of 3wt.%(X max 92%at 23mW cm −2and 86%at 7mW cm −2).These results are in a good agreement with the results of Huang and Shi [23]obtained for sim-ilar system by DSC analysis.In our experiment with the increase of the amount of photoinitiator from 3wt.%to 5wt.%,decreased the double bond conversion as well as the rate of polymerization was observed.Probably the higher concentration of 2-hydroxy-2-methyl-1-phenylpropane-1-one exhibits high absorption at its absorptions maximum at 245nm,and the initiator acts as inter-nal filter.This internal filtration effect (decreased penetration of UV light)can give rise to a concentration gradient between surface and bottom layer of irradiated film.Additionally,local high con-centration of initiator radicals can simultaneously promote radical recombination,and hence consumption of initiator in side reaction not leading to a polymerization.Table 1Effect of photoinitiator concentration and light intensity on maximal degree of con-version X max and maximal relative polymerization rate R p (layer thickness 10m,PE foil).Initiator concentration (wt.%)Light intensity (mW cm −2)237X max (%)R p,max (s −1)X max (%)R p,max (s −1)0.5660.06470.021790.33740.222860.42790.433920.71860.563.5890.44810.185850.37800.10V.Janˇc oviˇc ováet al./Progress in Organic Coatings 76 (2013) 432–438435180**** **** 0165 0160 0155 0150 0020406080100T r a n s m i t a n c e [%]Wavenumber [cm -1]Wavenumber [cm -1]A 0(1635) = 0.78A 60(1635)= 0.12X 1635= 84.6 %100095 090085 080 07507020406080100T r a n s m i t a n c e [%]A 0 (810] = 1.29A 60 (810) = 0.20X 810 = 84 .5%Fig.2.Double bond conversion (60s)estimation in urethane acrylate at wavenumbers 810,1618and 1635cm −1.C o n v e r s i o n [%]Irradiation time [s]C o n v e r s i o n [%]Irradiation time [s]Fig.3.Influence of irradiation time on the UV-curing of urethane acrylate Craynor 925at various Darocure 1173concentrations (layerthickness 10m,covered with PEfoil)at the light intensity 23mW cm −2(a)and 7mW cm −2(b).Although the conversion values achieved at total light dose 1J cm −2were very similar for both intensities,the maximal conversion achieved at higher intensity was higher compared to that at lower intensity (Fig.4).The influence of composition onC o n v e r s i o n [%]Concentration of initiator [wt %]Fig.4.The effect of initiator concentration on the conversion of double bond inurethane acrylate at different light intensity (X max is the maximal achieved double bond conversion,X 1J is the conversion after light dose 1J cm −2).maximal achieved conversion was more important for curing at light intensity of 7mW cm −2.For composition with 0.5wt.%of initiator the maximal conversion was only 47%at this intensity.The composition was uncured in fact and tacky.When the light intensity was 23mW cm −2.,the maximal conversion of 66%was obtained with the same initiator concentration and system was completely cured.Anyway,the highest conversion was observed at initiator concentration 3wt.%.The rate of polymerization,R p,max (Table 1)was also influ-enced by the photoinitiator concentration.The highest value was achieved at the higher radiation intensity (23mW cm −2)and at the initiator concentration 3wt.%.3.2.Influence of the external conditionsThe radiation intensity,the thickness of the applied layer,the temperature [24]and the oxygen presence [21,22]are factors which can significantly influence curing process and the final quality of the cured film.The influence of three of these factors (incident light intensity,layer thickness and oxygen presence)was observed (Figs.5and 6).The conversion degree of the double bond increased with increasing incident light intensity.Under the given experimental conditions the photopolymerization represents a complex process,with polymerization rate and conversion strongly436V.Janˇc oviˇc ováet al./Progress in Organic Coatings 76 (2013) 432–438C o n v e r s i o n [%]Irradiation time [s]C o n v e r s i o n [%]Irradiation time [s]Fig.5.The influence of irradiation time on the curing of urethane acrylate Craynor 925at various light intensities (initiator concentration 3wt.%,layer thickness 10m)unprotected (a)and covered with PE foil (b).dependent on light intensity.An extension of exposure does not lead to an increasing conversion and the conversion values for the formulations cured with the same UV dose but with higher incident light intensity were higher in comparison to those with lower incident light intensity in accordance with literature [25,26].The influence of light intensity was insignificant when cured samples were covered with PE foil preventing the air oxygen access into the cured layer (Fig.5).The influence of oxygen increased,when curing occurred in air without protection by PE foil.At low intensity the curing was very slow and the hardening was insuffi-cient obviously.The reaction of formed radicals with oxygen was faster than the initiation reaction with double bond.The effect of layer thickness on the curing of samples on the air is shown in Fig.6.The highest reaction rate was observed in the initial curing phase for the thickest layer.The reaction was proba-bly more effective in bottom layer of coating,following the effect of top layer as barrier for air oxygen.As viscosity increased dur-ing photopolymerization,theoxygen penetration throughout the coating became more difficult and the photopolymerization was more effective in thinner layers (10and 15m).The highest max-imal conversion degree was observed for the thinnest layer;with the increasing layer thickness this value diminished.Slowdown of the reaction in the later reaction phase (exposure time longer that 10s)with the growing layer can be probably due to the decrease of UV light transmission involved higher absorption of reaction prod-ucts in surface layer of irradiated film.Higher layer thickness willC o n v e r s i o n [%]Irradiation t ime [s]Fig.6.The influence of irradiation time on the curing of urethane acrylate Craynor925at various layer thicknesses (initiator concentration 3wt.%,light intensity 7mW cm −2,air).decrease the light penetration to the bottom of the coating and result in low and non-homogenous conversion,which may lead to inferior adhesion properties [22].The influence of air oxygen on the curing of tetrafunctional urethane acrylate in the presence of photoinitiator 2-hydroxy-2-methyl-1-phenylpropane-1-one (Fig.5)was very significant.The samples covered with polyethylene foil were well hardened after 30s at the intensity 7mW cm −2(light dose 0.210J cm −2,conver-sion degree 75%);while the uncovered samples were insufficiently cured after 5min (light dose 2.1W cm −2,conversion degree 65%)and the samples were tacky.Air oxygen significantly retarded the reaction.Even the longer exposition (3min,exposition doses 2–6J cm −2)was not enough to cure the coating at this light inten-sity.The coatings were tacky,smelling and cracked.Free radicals formed by the photolysis of the initiator are rapidly scavenged by O 2molecules to yield peroxyl radicals.They are not reactive towards the acrylate double bonds and cannot initiate or participate in any polymerization reaction.They cannot abstract also hydrogen atoms from the polymer backbone to generate hydroperoxides.Oxygen can also react with polymer grow-radicals to yield hydroperoxide and premature chain termination occurred.The elimination of air oxygen access to the cured layers increased the curing efficiency [21,22].3.3.Gloss changes during curingSpecular gloss is a measure of the ability of a coating surface to reflect a beam light in a particular angle without scattering.This is an important property of coating specially used for aesthetic and decorative purposes [27].The effect of layer thickness and curing conditions on the kinetics and gloss were investigated using the sample with constant composition and three different intensities of UV light.The layer thickness affected the final gloss of the samples (Fig.7).It is obvious that the value of final gloss was firstly increased with increasing the thickness of layers (at the range from 20m to 30m).In the case of layers thicker than 30m (40m)the lower value of G ∞was achieved.It was caused by the orange peel effect creation during the sample curing.Reducing either the sam-ple thickness or photopolymerization rate can eliminate the orange peel effect.Final gloss of the cured samples depended on the used UV light intensity (Fig.7).Time dependence of gloss had increas-ing character with the tendency to achieve a steady state where the gloss of the cured surface was constant.All samples showed very high-gloss and were transparent after curing.The change of gloss was more intense in the initial part of the curing process,and depended on both the above-mentioned factors.V.Janˇc oviˇc ováet al./Progress in Organic Coatings 76 (2013) 432–438437Irr adiati on ti me [s]G l o s s [G U ]G l o s s [G U ]Irradiati on time [s]Fig.7.Gloss changes during curing of urethane acrylate Craynor 925(initiator concentration 3wt.%)at the light intensity 23mW cm −2(a)and 7mW cm −2(b)and differentlayer thickness.Table 2Total colour differences E ∗abafter 5and 20h irradiation of unprotected samples and samples protected with the system urethane acrylate CN-925/initiator Darocure 1173(3wt.%),layer thickness 10,15and 20m for 4inks –cyan (C),magenta (M),yellow (Y)and black (B).Layer thickness of coatingIrradiation time (h)5h20hCMYBCMYB0m 4.1 5.7 1.00.918.222.1 5.1 1.210m 3.6 4.60.50.29.312.4 4.60.815m 3.8 5.30.60.310.013.1 4.20.420m3.74.60.60.310.113.13.80.43.4.The composition influence on the inks stabilityThe low stability of ink jet prints towards environmental influ-ences represents an extensive problem especially for the outdoor use of prints or coatings.Inks are often very sensitive against light [28].One of the possible solutions could consist in the development of transparent layer with barrier properties against water,which will acts as protecting layer against the sunlight.UV–vis reflectance spectra of four inks (cyan,magenta,yellow and black)deposited on paper and corresponding CIELAB values L *,a *,b *were measured immediately after samples preparation and after irradiation withthe day light irradiation.The total colour difference E ∗abwas cal-culated according to equation from Hunt [20]mentioned in Section 2.5.The results summarized in Table 2show that the applied accel-erated ageing procedures caused significant colour changes,asdocumented by the values of colour difference E ∗ab.The most significant changes were observed for magenta and cyan.The coating influence was positive,the E ∗abfor coated foils was smaller compared to the uncoated foils,but no significant differ-ence was observed between samples with various layer thicknesses (Table 2).As the layer thickness does not influence the colour sta-bility significantly,it is possible to use the coating with the thinner layer (10m),allowing faster and more effective UV-curing.4.ConclusionsPhotochemical curing of coatings prepared from urethane acrylate Craynor 925with various content of initiator 2-hydroxy-2-methyl-1-phenylpropane-1-one was studied by FTIR spectroscopy.The samples were coated on aluminium plates.The conversion degrees and the reaction rates were calculated from values atwavenumber of 810cm −1,the carbonyl peak at 1725cm −1was used as an internal standard.The final properties of UV-cured coatings depend on their com-position as well as on the experimental curing conditions.The highest conversion was achieved for initiator concentration 3wt.%.The initial slope of the curve of final conversion vs.initiator con-centration was steepest for the lower irradiation intensities.The influence of light intensity was insignificant for curing samples covered with PE foil,which avoided the air oxygen access to the cured layer.Influence of light intensity increased when curing on air.Moreover,the layer thickness influenced the conversion degree.The highest conversion degree was calculated for the thinnest layer (10m).Final gloss of the cured samples depended on the UV light inten-sity used;the samples cured at higher light intensity reached the higher gloss values.It is obvious that the maximal value of final gloss was obtained for layers with thickness of 30m.The influence of prepared coating on the colour ink stability waspositive;coated foils exhibited lower total colour difference E ∗abcompared to uncoated foils.However,the total colour differenceE ∗abdoes not depend on layer thickness of protective coating.AcknowledgementsThe authors thank the Slovak Grant Agencies APVV (Project No.0324-10)and VEGA (Project No.1/0811/11)for their financial sup-port.Appendix A.Supplementary dataSupplementary data associated with this article can be found,in the online version,at /10.1016/j.porgcoat.2012.10.010.References[1]J.P.Fouassier,Photoinitiation,Photopolymerization and Photocuring,CarlHanser Verlag,München,1995.[2]J.Kindernay,A.Blaˇz ková,J.Rudá,V.Janˇc oviˇc ová,Z.Jakubíková,J.Photochem.Photobiol.A:Chem.151(2002)229–236.[3]J.F.Rabek,Mechanisms of Photophysical and Photochemical Reactions in Poly-mers,Theory and Practical Applications,Wiley,New York,1987.[4]H.Hwang,C.Park,J.Moon,H.Kim,T.Masubuchi,.Coat.72(2011)663–675.[5]X.Yu, B.P.Grady,R.S.Reiner,S.L.Cooper,J.Appl.Polym.Sci.49(1993)1943–1955.[6]R.Schwalm,UV,Coatings,Basics,Recent Developments and New Applications,first ed.,Elsevier,Amsterdam,2007.[7]Y.Zhang,F.Zhan,W.Shi,.Coat.71(2011)399–405.。
氮化铁锅发黑工艺流程
氮化铁锅发黑工艺流程英文回答:Nitriding process for iron cookware involves a series of steps to achieve a blackened finish. Here is a step-by-step guide to the process:1. Surface Preparation:The first step is to clean the iron cookware thoroughly to remove any dirt, grease, or rust.This can be done by scrubbing the surface with a wire brush and using a degreasing agent.After cleaning, the cookware should be rinsed and dried completely.2. Preheating:Once the surface is clean, the cookware needs to be preheated to a specific temperature.This helps in preparing the surface for thenitriding process and ensures uniformity.The cookware can be preheated in an oven or on a stovetop burner.3. Nitriding:The next step is to introduce the cookware into a nitriding chamber or furnace.The chamber is filled with a nitrogen-rich atmosphere, usually ammonia gas.The cookware is exposed to the nitrogen gas at a high temperature for a specific period.This allows nitrogen atoms to diffuse into the surface of the iron, forming a nitride layer.4. Quenching:After the desired nitriding time, the cookware is quickly removed from the nitriding chamber.It is then immediately quenched in a liquid, such as oil or water.Quenching helps in cooling down the cookware rapidly and stabilizes the nitride layer.5. Post-Treatment:The cookware is then subjected to post-treatment processes to enhance the blackened finish.This can include polishing, buffing, or applying a protective coating.These processes help in improving the appearance and durability of the nitrided surface.Example:I recently had my iron skillet nitrided to achieve a blackened finish. I followed the above process, starting with cleaning the skillet thoroughly using a wire brush and degreasing agent. Once it was clean, I preheated theskillet on my stovetop burner. Then, I placed it in a nitriding chamber filled with ammonia gas and let it stay there for about two hours. After the nitriding process, I quickly removed the skillet and quenched it in a bucket of water. Finally, I polished the skillet to give it a smooth and shiny black surface. The result was amazing my skillet now looks brand new with a beautiful black finish.中文回答:氮化铁锅发黑的工艺流程包括以下几个步骤:1. 表面处理:首先要彻底清洁铁锅的表面,去除任何污垢、油脂或锈迹。
layernorm linear relu的顺序
layernorm linear relu的顺序Layer normalization, linear, and ReLU are all essential components in deep learning models. In this article, we will discuss the order in which they should be applied and delve into their functions and benefits. By the end of this article, you will have a better understanding of how these components work individually and in combination.Before we dive into the specifics, let's first define what each component does:1. Layer normalization: Layer normalization is a technique that normalizes the inputs across the features dimension for each training example. It helps in reducing the internal covariate shift and improves the overall stability and efficiency of the neural network.2. Linear layer: A linear layer, also known as a fully connected layer, applies a linear transformation to the input data by multiplying it with learnable weights and adding a bias term. It is responsible for mapping the input data to a higher-dimensional space, enabling the model to learn complex relationships and representations.3. Rectified Linear Unit (ReLU): ReLU is an activation function commonly used in deep learning models. It introducesnon-linearity to the model by transforming negative inputs to zero and passing positive inputs as they are. ReLU is computationally efficient and helps in addressing the vanishing gradient problem.Now that we have an understanding of each component let's discuss the order in which they should be applied.The ideal order of applying these components in a deep learning model is: Linear layer →Layer normalization →ReLU.1. Linear layer:The linear layer is usually the first layer in a deep learning model as it processes the raw input data and maps it to a higher-dimensional space. It applies a linear transformation to the input, enabling the model to learn complex relationships and representations.2. Layer normalization:After the linear transformation, it is common practice to apply layer normalization. Layer normalization normalizes the inputs acrossthe features dimension for each training example, reducing the internal covariate shift. This normalization technique helps in improving the overall stability and efficiency of the model by reducing the dependence on the scale of the input data.3. ReLU:Finally, the ReLU activation function is applied after layer normalization. ReLU introduces non-linearity to the model by transforming negative inputs to zero and passing positive inputs as they are. It helps address the vanishing gradient problem and enables the model to learn complex patterns and representations.By following this order, the model benefits from the linear transformation's increased complexity, layer normalization's stability and efficiency, and the non-linearity introduced by ReLU.Each component plays a crucial role in the success and performance of deep learning models:- Layer normalization helps in reducing the internal covariate shift and stabilizes the learning process. It brings the inputs to a similar scale, which reduces the model's dependence on the magnitude ofthe input values.- Linear layers enable the model to learn complex representations and relationships. They transform the input data, allowing the model to capture intricate patterns and make accurate predictions.- ReLU activation function introduces non-linearity, enabling the model to learn complex patterns and representations that would otherwise be challenging to capture with linear operations alone. It helps in addressing the vanishing gradient problem and speeds up the convergence of the model during training.In conclusion, applying layer normalization, linear layers, and ReLU activations in the order of linear layer →layer normalization →ReLU helps in achieving better stability, improved learning, and increased complexity in deep learning models. Each component serves a specific purpose and contributes to the overall performance of the model. Understanding the order and importance of these components is essential for designing effective deep learning architectures.。
anisotropie磁晶各向异性
Rep.Prog.Phys.59(1996)1409–1458.Printed in the UKMagnetic anisotropy in metallic multilayersM T Johnson†,P J H Bloemen‡§,F J A den Broeder†and J J de Vries‡†Philips Research Laboratories,Prof.Holstlaan4,5656AA Eindhoven,The Netherlands‡Eindhoven University of Technology,Department of Physics,PO Box513,5600MB Eindhoven,The Netherlands Received25July1996AbstractFerromagnetic materials exhibit intrinsic‘easy’and‘hard’directions of the magnetization. This magnetic anisotropy is,from both a technological and fundamental viewpoint one of the most important properties of magnetic materials.The magnetic anisotropy in metallic magnetic multilayers forms the subject of this review article.As individual layers in a multilayer stack become thinner,the role of interfaces and surfaces may dominate that of the bulk:this is the case in many magnetic multilayers,where a perpendicular interface contribution to the magnetic anisotropy is capable of rotating the easy magnetization direction from in thefilm plane to perpendicular to thefilm plane.In this review,we show that the(in-plane)volume and(perpendicular)interface contribution to the magnetic anisotropy have been separated into terms related to mechanical stresses,crystallographic structure and the planar shape of thefilms.In addition,the effect of roughness,often inherent to the deposition techniques used,has been addressed theoretically.Several techniques to prepare multilayers and to characterize their growth as well as methods to determine the magnetic anisotropy are discussed.A comprehensive survey of experimental studies on the perpendicular magnetic anisotropy in metallic multilayers containing Fe,Co or Ni is presented and commented on.Two major subjects of this review are the extrinsic effects of strain,roughness and interdiffusion and the intrinsic effect of the crystallographic orientation on the magnetic anisotropy.Both effects are investigated with the help of some dedicated experimental studies.The results of the orientational dependence studies are compared with ab initio calculations.Finally,the perpendicular surface anisotropy and the in-plane step anisotropy are discussed.§Present address:Philips Research Laboratories,Prof.Holstlaan4,5656AA Eindhoven,The Netherlands 0034-4885/96/111409+50$59.50c 1996IOP Publishing Ltd14091410M T Johnson et alContentsPage1.Introduction14112.Origin of the magnetic anisotropy in thinfilms14142.1.Magnetic dipolar anisotropy(shape anisotropy)14142.2.Magnetocrystalline anisotropy14152.3.Magneto-elastic anisotropy14163.Techniques to determine magnetic anisotropy14193.1.Magnetization methods14193.2.Magneto-optical Kerr effect measurements14214.Sample preparation and characterization14224.1.Preparation methods14234.2.Sample characterization14275.Overview of anisotropy studies14285.1.Tables14285.2.Fe versus Ni versus Co14286.Influence of the structure on the magnetic anisotropy14316.1.Effect of roughness and interdiffusion14326.2.Magneto-elastic effects14347.Orientational dependence of the perpendicular magnetic anisotropy14387.1.Structural aspects14397.2.Interfacial and volume anisotropy14417.3.Theoretical predictions of PMA1446paring measured and calculated PMA14498.Surface versus interface anisotropy14519.Step anisotropies145210.Summary and concluding remarks1453Acknowledgments1454 References1455Magnetic anisotropy in metallic multilayers14111.IntroductionIt is an experimental fact that ferromagnetic single crystals exhibit‘easy’and‘hard’directions of the magnetization;i.e.the energy required to magnetize a crystal depends on the direction of the appliedfield relative to the crystal axes.From the technological viewpoint this magnetic anisotropy is one of the most important properties of magnetic materials. Depending on the type of application,material with high,medium or low magnetic anisotropy will be required,for respective application as,for example,permanent magnets, information storage media or magnetic cores in transformers and magnetic recording heads.The physical basis that underlies a preferred magnetic moment orientation in ultrathin magneticfilms and multilayers can be quite different from the factors that account for the easy-axis alignment along a symmetry direction of a bulk material,and the strength can also be markedly different.The prominent presence of symmetry-breaking elements such as planar interfaces and surfaces,which automatically accompany the layered form of these systems,are the basic ingredients for this behaviour.By varying the thicknesses of the individual layers and choosing appropriate materials,it appeared possible to tailor the magnetic anisotropy.The most dramatic manifestation in this respect is the change of the preferential direction of the magnetization from the commonly observed in-plane orientation to the direction perpendicular to the plane.This phenomenon is usually referred to as perpendicular magnetic anisotropy(PMA)and is particularly important for information storage and retrieval applications.PMA plays an important role in magneto-optical(MO)recording.To write bits in MO media,the disk is heated locally by a pulse of a diode laser beam which is focused to a spot of about1µm(see alsofigure1).The magnetization is reversed only in the area of the heated spot by applying a small bias counterfield,which is smaller than the coercivefield ofFigure1.Schematic representation of the principle of magneto-optical recording(Zeper1991).For more information see text.1412M T Johnson et althe MO layer at room temperature but larger than the coercivefield in the heated area.Thesame laser that is used for writing also reads back the written bits(domain pattern)makinguse of the polar magneto-optical Kerr effect,the effect that the polarization of the light ischanged(i.e.rotation of the plane of linear polarization over an angleθK)upon reflection at a magnetic surface(Kerr1877).Since the latter is most sensitive to the perpendicularcomponent of the magnetization,one of the principle requirements of an MO medium is aperpendicular preferential orientation.Today’s MO materials,the amorphous Gd–Tb–Fe andTb–Fe–Co alloys,meet this requirement and have a sufficient Kerr effect.However,apartfrom intrinsic deficiencies such as their susceptibility to corrosion and oxidation,their Kerreffect considerably decreases at shorter wavelengthsλof the light.They therefore oppose afurther increase in the storage density since the latter is largely determined by the diffractionlimited spot area being proportional toλ2.Several metallic magnetic multilayers appearednot to exhibit these disadvantages.This application possibility of magnetic multilayers withPMA formed one of the principle motivations for many groups to enter thefield and is stillin part responsible for the current world-wide attention for these systems.In addition,newphenomena such as the interlayer exchange coupling and the giant magnetoresistance havealso attracted considerable attention in the last decade,see Fert and Bruno(1994)for arecent review on the latter two topics.The PMA is a result of a magnetic anisotropy at the interface which considerably differsfrom the magnetic anisotropy in the bulk.This type of magnetic anisotropy,a so-calledinterface or surface anisotropy,was predicted already in1954by N´e el(1954)to result fromthe lowered symmetry at the surface or interface.Thefirst experiments which had revealedsuch an interface anisotropy were performed in1968by Gradmann and M¨u ller(1968)onultrathin NiFefilms on Cu(111).What they observed was an easy axis perpendicular to thefilm plane for1.8monolayers of NiFe and furthermore that the magnetic anisotropy scaledwith the reciprocalfilm thickness.For multilayers PMA wasfirst observed in1985byCarcia et al in the Co/Pd system Carcia et al(1985)and later on in several other Co-basedmultilayers:Co/Pt(Carcia1988),Co/Au(den Broeder et al1988),Co/Ru(Sakurai et al1991)and Co/Ir(den Broeder et al1991).In these studies the(effective)magnetic anisotropy energy K(J m−3)could bephenomenologically separated in a volume contribution K v(J m−3)and a contributionfrom the interfaces K s(J m−2)and approximately obeyed the relation:K=K eff=K v+2K s/t.(1) This relation just represents a weighted average of the magnetic anisotropy energy(MAE) of the interface atoms and the inner atoms of a magnetic layer of thickness t.The relation is presented under the convention that K s/d(with d the thickness of a monolayer)represents the difference between the anisotropy of the interface atoms with respect to the inner or bulk atoms.Also the layer is assumed to be bounded by two identical interfaces accounting for the prefactor2.Equation(1)is commonly used in experimental studies,and the determination of K v and K s can be obtained by a plot of the product K eff t versus t.Figure2shows a typical example of such a plot for Co/Pd multilayers(den Broeder et al1991).Here,and in the following,a positive K eff describes the case of a preferred direction of the magnetization perpendicular to the layer plane.The negative slope indicates a negative volume anisotropy K v,favouring in-plane magnetization,while the intercept at zero Co thickness indicates a positive interface anisotropy K s,favouring perpendicular magnetization.Below a certain thickness t⊥(=−2K s/K v,in this case13˚A)the interface anisotropy contribution outweighs the volume contribution,resulting in a perpendicularly magnetized system.In other words, the strong demagnetizingfields which are created when tilting the magnetization out ofMagnetic anisotropy in metallic multilayers1413Figure2.MAE times the individual Co layer thickness versus the individual Co layer thicknessof Co/Pd multilayers.The vertical axis intercept equals twice the interface anisotropy,whereasthe slope gives the volume contribution.Data are taken from den Broeder et al(1991).thefilm plane and which are usually responsible for the orientation of the magnetization parallel to thefilm plane,are overcome.As will be shown later on,the volume energy corresponding to these demagnetizingfields form the major contribution to K v in most cases.The many experimental results of the type shown infigure2considerably stimulated theoretical work.For the bulk transition metals,it appeared very difficult to calculate the magnetic anisotropy fromfirst principles.The order of magnitude was correct,but the predicted sign was often wrong(Daalderop et al1990a).These difficulties are related to the fact that the corresponding energies are very small(of the order of1meV per atom). However,for multilayers and ultrathinfilms,which exhibit generally larger anisotropies, much progress has recently been made.For several Co based multilayers,good agreement has been reached betweenfirst principles calculated anisotropies and the corresponding experimental values(Daalderop et al1990b).To increase the general understanding,these calculations can now,in principle,be used to calculate the magnetic anisotropy of magnetic layers and multilayers which cannot be made under laboratory conditions,such as free-standing monolayers;alternatively,one can make predictions for multilayers that have not been studied experimentally previously.An example of the latter is formed by Co/Ni multilayers(Daalderop et al1992).This review article is primarily concerned with the experimental aspects of the research performed on the magnetic anisotropy in thinfilms and multilayers.A restriction has been made to(multi)layers containing transition metals;rare-earth transition metal multilayers are not considered.Moreover,the(perpendicular)uniaxial out-of-plane anisotropy is emphasized although in-plane anisotropies will also be addressed.Earlier reviews on magnetic anisotropy were given by Heinrich and Cochran(1993)and de Jonge et al(1994).The article is organized as follows.Section2deals with the theory of several contributions to the magnetic anisotropy of magnetic thinfilms.The most commonly used experimental techniques to quantitatively determine the magnetic anisotropy are briefly introduced in section3.In section4,a compilation of the currently used techniques to1414M T Johnson et algrow,as well as to characterizefilms and multilayers,is given and the advantages and disadvantages are mentioned.An extensive overview of the measured magnetic anisotropies is given in section5.Section6is devoted to several aspects of the growth conditions andfilm structure which influence the PMA in magnetic multilayers,such as roughness and interdiffusion,stress and preparation methods.The orientational dependence of the magnetic anisotropy is discussed in relation with theoretical calculations in section7.The remaining sections deal with the magnetic anisotropy generated at free surfaces,section8, and surface steps,section9.In view of the limited space a selection of interesting studies has been made so as to cover,as much as possible,different aspects that are of importance for the general understanding of the magnetic anisotropy of ultrathin magnetic layers.The authors apologise to those whose work is not explicitly mentioned.Thefield has become too large to cover all interesting studies in one paper.Included are tables of multilayers and sandwiches exhibiting PMA studied so far and of the orientational dependence of the PMA in Co/Pt,Co/Pd and Co/Ni multilayers.Other topics are a study on the Cu/Ni system emphasizing the importance of magneto-elastic contributions for both interface and volume anisotropy terms and a systematic experimental investigation of the relation between the magnetic anisotropy and the interface roughness.2.Origin of the magnetic anisotropy in thinfilmsBasically,the two main sources of the magnetic anisotropy are the magnetic dipolar interaction and the spin–orbit interaction.Due to its long range character,the dipolar interaction generally results in a contribution to the anisotropy,which depends on the shape of the specimen.It is of particular importance in thinfilms,and is largely responsible for the in-plane magnetization usually observed.In the absence of spin–orbit and dipolar interaction,the total energy of the electron–spin system does not depend on the direction of the magnetization.In a localized picture the spins are coupled via the spin–orbit interaction to the orbits which,in turn,are influenced by the crystal lattice.For itinerant materials the spin–orbit interaction induces a small orbital momentum,which then couples the total (spin plus orbital)magnetic moment to the crystal axes.This results in a total energy which depends on the orientation of the magnetization relative to the crystalline axes,and which reflects the symmetry of the crystal.This is known as the magnetocrystalline contribution to the anisotropy.The lowered symmetry at an interface strongly modifies this contribution as compared to the bulk,yielding,as mentioned already,a so-called interface anisotropy as pointed out by N´e el(1954).In conjunction with the overlap in wavefunctions between neighbouring atoms,the spin–orbit interaction is also responsible for the magneto-elastic or magnetostrictive anisotropy induced in a strained system,a situation which is frequently encountered in multilayers due to the lattice mismatch between the adjacent layers.In the following subsections each of these anisotropy terms will be discussed in somewhat more detail.2.1.Magnetic dipolar anisotropy(shape anisotropy)Among the most important sources of the magnetic anisotropy in thinfilms is the long range magnetic dipolar interaction,which senses the outer boundaries of the sample.Neglecting the discrete nature of matter,the shape effect of the dipolar interaction in ellipsoidal ferromagnetic samples can be described,via an anisotropic demagnetizingfield,H d,given by H d=−N M.Here M is the magnetization vector and N is the shape-dependent demagnetizing tensor.For a thinfilm,all tensor elements are zero except for the directionMagnetic anisotropy in metallic multilayers 1415perpendicular to the layer:N ⊥=1.Since the magnetostatic energy can be expressed as E d =−µ02VM ·H d d v (2)where µ0is the permeability of vacuum,it results in an anisotropy energy contribution per unit volume V of a film of:E d =12µ0M 2s cos 2θ.(3)Here the magnetization is assumed to be uniform with a magnitude equal to the saturation magnetization M s ,and subtends an angle θwith the film normal.According to this expression,the contribution favours an in-plane preferential orientation for the magnetization.Because the thickness of the film does not enter into the continuum approach employed above,it contributes only to K v .It is this contribution which is mainly responsible for the negative slope of the K eff t versus t plot in figure 2.This continuum approach is common in the analysis of the experimental data.However,when the thickness of the ferromagnetic layer is reduced to only a few monolayers (ML),the film should not,in principle,be considered as a magnetic continuum,but has to be treated as a collection of discrete magnetic dipoles on a regular lattice.Calculations made on the basis of discretely summing the dipolar interactions for films in the range of 1–10MLs lead to the following results (Draaisma and de Jonge 1988).Depending on the symmetry of the interface,the outer layers experience a dipolar anisotropy which can be appreciably lower than the inner layers.For the inner layers,the dipolar anisotropy is rather close to the value based on the continuum approach.Consequently,the average dipolar anisotropy can be phenomenologically expressed by a volume and an interface contribution.The magnitude of the dipolar interface contribution,however,is of minor importance,and other sources of interface anisotropy,such as spin–orbit coupling,appear to be dominant.2.2.Magnetocrystalline anisotropyAs stated before,the microscopic origin of the magnetocrystalline anisotropy is the spin–orbit interaction.In principle,also the exchange interaction and the dipolar interaction could contribute to the magnetocrystalline anisotropy.The exchange interaction,however,cannot give rise to anisotropy since it is proportional to the scalar product of the spin vectors and is therefore independent of the angle between the spins and the crystal axes.The dipolar interaction energy on the other hand,does depend on the orientation of the magnetization relative to the crystal axes.In principle it results,apart from the shape contribution already discussed in subsection 2.1,in a magnetocrystalline contribution.However,for cubic crystals it can be shown from symmetry arguments that the sum of the dipole–dipole energies cancels.For structures with lower symmetry,such as hexagonal crystals,this is generally not the case.For bulk hcp cobalt however,this contribution is negligible,since the deviation of the c/a ratio from the ideal value √8/3is relatively small (−0.67%)(Daalderop et al 1990a).Consequently,the spin–orbit interaction will be primarily responsible for the magnetocrystalline anisotropy in Fe,Ni (both cubic)and Co.Before a good understanding of itinerant electron behaviour was achieved,van Vleck discussed the magnetocrystalline anisotropy (in the case of bulk)in a pair interaction model assuming localized magnetic moments (van Vleck 1937).N´e el (1954)extended this model to surfaces and showed that the reduced symmetry at the surface should result in magnetic anisotropies at the surface differing strongly from the bulk atoms.For this surface anisotropy energy he derives for fcc(111)and fcc(100)surfaces for instance,the1416M T Johnson et alrelation E=−K s cos2θ,with K s differing for(111)and(100)surfaces.Although the pair interaction model also played a role in the discussion about roughness and interdiffusion, as discussed later,and contributed significantly to the understanding,it is fundamentally incorrect.It does not discriminate between interface and surface,nor does it give a dependence of K s on the adjacent(non-magnetic)metal.In some cases it predicts the wrong sign.Throughout this text,in fact,interface anisotropy will be considered except in section8where the surface anisotropy is discussed.A thorough understanding of the magnetocrystalline anisotropy can now be obtained from ab initio bandstructure calculations.As shown in(Daalderop1991),the symmetry and location with respect to the Fermi level of spin–orbit split or shifted states are of major importance.The symmetry of the state for instance,determines whether or not the state is split if the direction of the magnetization is perpendicular or parallel to thefilm plane,i.e. it determines the sign of the contribution of the state to the magnetocrystalline anisotropy. For further and more detailed discussions the reader is referred to(Daalderop et al1994).A short summary of the current status of the theory is presented in subsection7.4.2.3.Magneto-elastic anisotropyStrain in a ferromagnet changes the magnetocrystalline anisotropy and may thereby alter the direction of the magnetization.This effect is the‘inverse’of magnetostriction,the phenomenon that the sample dimensions change if the direction of the magnetization is altered.The energy per unit volume associated with this effect can,for an elastically isotropic medium with isotropic magnetostriction,be written asE me=−K me cos2θ(4) withK me=−32λσ(5) =−3λE .(6) Hereσis the stress which is related to the strain, ,via the elastic modulus E byσ=E . The magnetostriction constantλdepends on the orientation and can be positive or negative. The angleθmeasures the direction of the magnetization relative to the direction of uniform stress.If the strain in thefilm is non-zero,the magneto-elastic coupling contributes in principle to the effective anisotropy.When the parameters are constant(not depending on the magnetic layer thickness,t)this contribution can be identified with a volume contribution K v(compare equation(1)).Strain infilms can be induced by various sources.Among them are thermal strain associated with differences in thermal expansion coefficients,intrinsic strain brought about by the nature of the deposition process and strain due to non-matching lattice parameters of adjacent layers.Of particular interest in the present context,is the strain due to lattice mismatchηof a material A deposited on material B:η=(a A−a B)/a A(7) where a is the lattice parameter of material A or B.Currently this problem is described in terms of the van der Merwe model in which elastic as well as dislocation energies are considered(van der Merwe1963).Two regimes should be distinguished.If the lattice mismatch between the lattice parameters is not too large,minimizing the total energy leads to a situation whereby,below a critical thickness t c,the misfit can be accommodated byMagnetic anisotropy in metallic multilayers1417 introducing a tensile strain in one layer and a compressive strain in the other such that ultimately the two materials A and B adopt the same in-plane lattice parameter.This regime is called the coherent regime,the lateral planes are in full lattice-registry.The strain as well as t c depend strongly on the specific geometry(bilayer,sandwich,film on a substrate,multilayer,etc).For a general multilayer A/B in the coherent regime, minimization of the elastic energy(12tE 2),yields in good approximation:A=−η/(1+t A E A/t B E B)(8)B=η+ A(9) with E A and E B the elastic moduli of layer A and B.For other geometries,analogous relations can be derived.Assuming that layer A is the magnetic layer,substitution of A inequation(6)gives the magneto-elastic contribution to the anisotropy K cohme =−3λE A A.Inprinciple,this contribution contains the thickness of the magnetic layer t A,and therefore may obscure the simple analysis in terms of volume and interface contributions(equation(1)). In the specific cases of t A t B and t A/t B=constant,the magneto-elastic anisotropy is independent of t A and contributes only to K v:K coh me,v=3λE Aη.(10) The elastic energy associated with the coherent situation is proportional to the strained volume.Increasing the thickness of layer A will therefore increase the elastic energy.This energy increase will not persist.At a certain critical thickness t c,already mentioned above, it becomes energetically more favourable to introduce misfit dislocations which partially accommodate the lattice misfit,allowing the uniform strain to be reduced.The lattice-registry is then partially lost and the layers become partially coherent or in short incoherent.In general,it is not an easy task to calculate the strain in the incoherent regime.In the special case of a single layer A on a rigid substrate it has been shown(Matthews1990, Chappert and Bruno1988),by minimization of the sum of the elastic energy and the energy due to dislocations,that the residual strain A,which is assumed to be uniform within the layer,can be written asA=−ηt c/t A(11) where t c,infirst approximation,is given by(den Broeder et al1991):t c=Gb8|η|E A.(12)Here use was made of the simple expression for the energy of a dislocation E=1Gb2, where b is the Burgers vector of the dislocation and G the shear modulus.The critical thickness t c in the case of a thin layer A sandwiched between two identical layers B is four times larger since two layers B are elastically deformed,while there are two interfaces A/B to mediate the stress(den Broeder et al1991).Alternatively,by considering the strain field around a misfit dislocation,Matthews and Blakeslee(1974,1975)derived a critical thickness:t c b =Gx4π|η|E Alnt cb+1(13)where x=1for a single layer deposited on a substrate and x=2if the stressed layer is sandwiched between two considerably thicker layers which both support coherent growth. This expression has been used for comparison with the experiment in subsection6.2.As a consequence of the specific form of equation(11),the contribution of the magneto-elastic energy,equation(6),also contains the1/t dependence.Following the common analysis1418M T Johnson et alFigure3.Theoretical thickness dependence of(a)the strain and(b)the MAE times the layerthickness in the coherent and incoherent regime.of anisotropy data as introduced by equation(1),this contribution,which is essentially generated in the volume,will emerge as an apparent interface contribution for the incoherent growth regime:K me=3λE Aηt c/t A.(14) By substituting K me=2K inc me,s/t A,the interface anisotropy is found to be:K inc me,s=3λE Aηt c.(15) It should be noted that K inc me,s does not depend onηbecause its dependence cancels against that of t c,see equations(12)and(13).An alternative,simple expression for the magneto-elastic interface contribution in the case of a sandwiched layer,can be given in terms of G and b(den Broeder et al1991)(η<0):K inc me,s=−3λGb.(16) Figure3illustrates the transition between the coherent and incoherent regime and the resulting effect observed in the magnetic anisotropy.Thus,a separate interpretation of the magnetic anisotropy must be made in the regions above and below t c(den Broeder et al1991).In the coherent region below t c,the volume anisotropy K v incorporates shape anisotropy,magnetocrystalline anisotropy(K mc)and strain anisotropy(K me,v),with interface anisotropy being solely N´e el-type.K s=K N(17)K v=−12µo M2s+K mc+K coh me,v(18)with K cohme,v as in equation(10).In this region,the influence of misfit strain thus appears asa volume contribution to the anisotropy.In the incoherent region above t c,the distinctive form of volume strain represented by equation(11)has been shown to lead to an apparent interface contribution:the magneto-elastic interface anisotropy(Chappert and Bruno1988), so that:K s=K N+K inc me,s(19)K v=−12µo M2s+K mc(20) with K inc me,s as in equation(15).Figure3(b)schematically illustrates the expected dependence of K eff t on t,with a marked kink appearing at the critical thickness t c.The relevance ofthis picture will be discussed by considering the Cu/Ni model system,in subsection6.2.。
slope stability analysis by finite elements
Slope stability analysis by finite elements is a numerical method used to assess the stability of slopes and embankments in geotechnical engineering. The finite element method (FEM) is a numerical technique for analyzing complex structures or systems by dividing them into smaller, interconnected elements.Here is a general outline of the process for slope stability analysis using finite elements:1. Geometry and Material Properties: Define the geometry of the slope or embankment and assign appropriate material properties to the different soil layers. This includes parameters such as soil type, unit weight, shear strength, and cohesion.2. Mesh Generation: Divide the slope into a finite element mesh, where each element represents a small portion of the slope. The choice of element type and size depends on the complexity of the problem and the desired accuracy of the analysis.3. Boundary Conditions: Specify the boundary conditions for the slope model. This includes fixing certain nodes or applying external loads or displacements to simulate the actual field conditions.4. Soil Constitutive Model: Select appropriate soil constitutive models to represent the mechanical behavior of the soil under loading. Common models include Mohr-Coulomb, Drucker-Prager, or other specific models for cohesive or granular soils.5. Equilibrium Equations: Apply the equilibrium equations (force equilibrium and moment equilibrium) to the finite element model to calculate the internal forces and stresses within the slope.6. Stability Analysis: Perform a slope stability analysis by computing the factor of safety (FS) against slope failure using limit equilibrium methods, such as the Bishop method, Morgenstern-Price method, or by conducting a deformation analysis to assess the displacements and deformations.7. Sensitivity Analysis and Design Optimization: Perform sensitivity analysis to investigate the influence of different factors (e.g., soil parameters, geometry, water conditions) on the stability and make necessary adjustments to the design. Optimization techniques can also be applied to achieve a more economical and safe design.8. Results Interpretation: Analyze and interpret the results, including factor of safety values, stress distributions, and failure mechanisms, to make informed decisions regarding slope stability and the need for any stabilization measures.It's important to note that slope stability analysis is a complex topic, and professional expertise and software tools are usually necessary for accurate and reliable analysis.。
资勘专业英语段落翻译
Unit1 Cosmic Beginnings宇宙的起源1.Where and when does the history of the Earth begin? Only in the last few decades could this question be asked with any hope of a scientific answer. 地球的历史上是何时何地开始的?只有在过去的几十年里,这个问题才有了一个比较科学的回答来解释。
Certainly one good point at which to start is the time when the materials that were to become the Earth became separated in space from materials that were to become other members of the solar system. 当然存在一个较好的说法是地球的起源时间是当组成地球的物质在宇宙中开始与太空中组成太阳系其它成员的物质分离的时候.Although the story could well commence here, a great many important questions would remain unanswered.虽然故事很可能开始在这里,许多重要的问题仍悬而未决。
Something needs to be said about the materials that make up the Earth, and this pushes the question of origin to a more remote period. 一些有必要提及的物质构成了地球,这将推动更偏远的起源问题。
Earth's partners in space must also be considered. 地球在太空的合作伙伴也必须加以考虑。
常用岩芯描述英语词汇及简写
常用岩芯描述英语词汇及简写coordinate co 一致coordinate ord 座标coordinate ord 一致coquina coq 贝壳灰岩coral crl 珊瑚coralline corln 珊瑚的coralline corln 珊瑚状core c,- 岩心corehole CH 取心井corrected corr 校正好的corrected depth CD 校正井深correlate correl 对比cover cov 覆盖层cover cov 包括cream crm淡黄色cream crm奶油色crenulate cren 细褶皱crenulate cren 锯齿状cretaceous K 白垩系cretaceous K 白垩纪cretaceous Cret 白垩系cretaceous Cret 白垩纪crevice crev 裂隙crinkled crnk 褶卷曲crinkled crnk 成波状crinoid crin 海百合cross X 交错cross-laminated Xlam交错纹层cross-stratified Xstrat 交错层理crossbed Xbd 交错层crossbeding Xbdg 交错层理crum bly crmb 易碎的crum bly crmb 脆的crum pled crpld 挤压crum pled crpld 变皱crum pled crpld 扭曲crypto crp 隐crypto crp 隐蔽cryptoprefix crp 隐cryptoprefix crp 隐蔽cryptocrystalline crpxl 隐晶质的cryptofissile crpfisscryptograined crpgr 隐晶岩crystal xl 晶体crystal xl 结晶crystalline xln 晶质的crystalline xln 结晶的cube cub 立方的cube cub 立方体cubic cub 立方的cubic cub 立方的cubic foot CF 立方英寸cummulative cum累计的cut ct 切cut ct 割cut ct 馏点cut flourescence CF 溶液荧光cutting ctg 切割cutting ctg 切片cuttings ctgs 岩屑cuttings ctgs 钻屑cycle cyc 旋回cycle cyc 周期cycle per m inute CPM 转/分dacite dac 英安岩dark dk 暗的dark dk 深的darker dkr 暗的darker dkr 深的debris deb 岩屑debris deb 碎石decrease decr 减少decrease decr 降低degree deg 度degree deg 程度degree deg 方次dendritic dend 树枝的dendritic dend 多枝的dense dns 浓的dense dns 稠密的dense dns 密集的density dnsty 密度depositional depstnl 沉积的depositional depstnl 沉积作用的depth unit DU 深度单位description des 描述description des 说明dessication des 干躁剂determine dtrm确定determine dtrm决定determine dtrm限定detrital dtrl 碎屑的detritus dtrs 碎石development dev 发展development dev 开发deviation dev 偏的deviation dev 偏差devonian D 泥盆系devonian D 泥盆纪devonian devo 泥盆系devonian devo 泥盆纪diabase db 辉绿岩diagenesis diag 成岩作用diagonal diag 斜的diagonal diag 对角线的diameter dia 直径diametor dia 直径的diametor diam直径的diamictite diamic 杂岩diamictite diamic 混杂陆源沉积岩siffierent dif 差异siffierent dif 区别siffierent dif 不同diorite drdirty drty 泥土discontinuous discont 不连续的dolomite dol 白云石dolerite do 粗粒玄武岩dolerite do 辉绿岩dolomit ic dolc 白云石的dolomit ized dold 白云岩化dolomold dolmd 白云石穴dolomold dolmd 白云石晶模dolostone dolst 白云灰岩dominant dom主要的dominant dom占优势的druse drs 晶族druse drs 晶洞drusy drsy 晶族状dusky dky 微暗的maximum dip angle DMAX 最大倾角normal calculated D exponent DCN 正常D 指数earthy erthy 土状的earthy erthy 泥土的echinoidal ech 海胆类effective core porosity ECP 岩心有效孔隙度elevation elev 海拔高度elliptical elip 椭圆形的elongate elg 伸长状elongate elg 狭长状em bedded em bd 埋入的em bedded em bd 嵌入的eocene Eoc 始新世equivalent cirulating density E.C.D 等效循环密度equivalent m ud weight E,M.W 当量泥浆必重eroded erod 侵蚀的erosional eros 冲蚀erosional eros 侵蚀estim ated est 估计estim ated est 评价estim ated est 判断euhedral euhed 自形的euxinic eux 静海相的euxinic eux 闭塞环境evaporite evap 蒸发岩evaporite evap 蒸发盐example ex 例子excellent excel 优良的excellent excel 极好的exposed exp 暴露的external upset end EUE 外加厚extraclast exclas 外来碎屑extraclastic ex clas 外来碎屑extremely extr 极度extremely extr 极端extremely extr 终极fabric fab 结构fabric fab 构造facet fac 磨光面facet fac 刻面faint fnt 微弱的faint fnt 淡的fair fr 好的fair fr 公正fault flt 断层feet ft 英尺feldspar fld 长石fenestra fen 模孔fenestra fen 窗孔ferro-m ag fe-m ag 铁锰铜和金ferruginous ferr 含铁的ferruginous ferr 铁质few fw 少量fibrous fibr 纤维状fibrous fibr 纤维质fill fl 冲填filtercake FC 泥饼fine f 细fine f 细粒的fine f 好的firm frm硬firm frm坚硬fissible fis 裂变物质fissible fis 易剥裂的flag of shale FSHA 泥岩标志flaggy flg 断层flaggy flg 薄层flake flk 薄片flake flk 磷片flat fl 平的flat fl 无光泽的flourescence flour 荧光foliated fol 叶片状foliated fol 薄层状form ation fm地层form ation fm形成form ation fm建造form ation flacter FC 地层因素fom ation water Fm W 地层水fossil foss 化石fossil foss 含化石的fossiliferous foss 化石fossiliferous foss 含化石的fracture frac 断口fracture frac 裂缝fracture frac 破裂fragm ent frag 碎块fragm ent frag 碎片fragm ent frag 碎屑frequent freq 频繁frequent freq 经常frequent freq 常见的fram estone fram est 骨架岩fresh frs 新鲜的fresh frs 淡的fresh break FB 新破碎的fresh water Frw 淡水friable fri 易碎的friable fri 脆性的fringe frg 边缘fringe frg 条纹friosted fros 无光泽的good g 好gradational contact grad-con 整合接触关系grade grd 粒级grade grd 坡度grade grd 等级gradient grad 梯度grading grdg 分选grading grdg 分级grain gr 粒grain gr 颗粒gradual grad 逐渐的grainstone grst 粒状灰岩grainstone grst 颗粒岩gram/liter g/l 克/升granite grnt 花岗岩granite wash grntw 花岗冲积物granite wash GW 花岗冲积物granitic grntc 花岗岩的grano-diorite grndior 花岗闪长岩granodiorite grndior 花岗闪长岩granule gran 细粒granule gran 粒砂granulestone granlst 细粒granulestone granlst 颗粒岩grapestone grap 笔石grapestone grnpst 葡萄状灰岩graptolite grap 笔石gravel gvl 砾石gravel gvl 砂砾gravity grav 重力gravity grav 比重gray gy 灰色greasy gsy 油性的greasy gsy 多脂的green gn 绿色的greywacke gywk 杂砂岩greywacke gywk 硬砂岩grit gt 粗砂质的gritty gt 粗砂质的groove cast grv cst 凹槽ground grd 地面ground level GL 地平面ground level GL 地平线group G 团体gumm y gm y 胶质gumm y gm y 粘性gypsiferous gyp 含石膏gypsum gyp 石膏hackly hkl 锯齿状hackly hkl 粗糙的haem atite haem赤铁矿haem atiteic haem赤铁矿halite hal 石盐halite hal 岩盐haliteic hal 石盐haliteic hal 岩盐hard hd 坚硬的head hd 头顶head hd 源头heavy hvy 重的heavy hvy 强烈的heavy fuel oil HFO 重燃油heterogeneous hetr 非均质的hexagonal hex 六边形hexagonal hex 六角形high hi 高的high hi 强烈的high gas oil ratio hgor 高气油比high pressure hp 高压high tem perature HT 高温high viscosity HV 高粘性high water loss HWL 严重失水holocene hol 全新始homogeneous hom均质的homogeneous hom均匀的horiz hor 层horiz hor 层位horiz hor 水平线horizontal hztl 水平的horizontal hztl 强烈的hornblend ho 角闪石horse power hp 马力hour hr 小时hydrocarbin hycbn 烃hydrocarbin hycbn 碳氢化和物hydrochloric acid Hcl 盐酸hydrogen ion concentration ph 氢离子浓度hydrogen sulphide H2s 硫化氢hydrostatic gradient HG 静液压力梯度hypabyssal rock hypb rk 浅成岩hypabyssal rock hypb rk 半深成岩thick of mud cake HMC 泥饼厚度inter int 在....中间idest ie 即idest ie 就是igneous rock ig 火成岩igneous rock ig 岩浆岩illite illit 伊利石illiteic illit 伊利石imbeded imbd 埋入的impermeable imperm不透明的impression im p 压痕impression im p 印记impression im p 影响in part i/p 部分的inch in 英寸included incl 包括included incl 包体increase incr 增加increase incr 增长increaseing incr 增加increaseing incr 增长indistinct indst 不清楚indistinct indst 不易区别的indurated ind 固结的indurated ind 硬化的initial producation IP 初始产量input/output I/O 输入/输出insetnal upset ends IUE 内加厚inside diameter ID 内径insoluble insl 不熔的interbeded intbd 互层的interbeded intbd 间层的intercalated intcl 插入intercalated intcl 加入intercalated intcl 夹层intercrystalline interxln 晶间的interfingered intfg 泄形夹层interfingered intfg 指状交错intergranular intgran 粒间的intergrown intgwn 共生intergrown intgwn 互生intergrown intgwn 连晶interlaminated intlam层间的interlaminated intlam薄层相interparticle intpar 颗粒间的interrupt INT 打断intersticies intst 潮间的intersticies intst 潮区的interstitial intstl 空隙的interstitial intstl 隙间的interval intvl 层段interval intvl 井段interval intvl 间距intraparticle intrapar 粒间的ironstone fest 含铁矿石ironstone fest 铁岩irregular irr 不规则的joint jts 节理joint jts 接头joint jts 结合jurassic Ju 侏罗系jurassic Ju 侏罗纪kaolinitic kaoc 高岭土laminated lam纹层状laminated lam页状lavender lav 淡紫色light lt 淡色的light lt 浅色的lime lm石灰limestone ls 石灰岩limonite lm n 褐铁矿limonite lm n 褐铁矿的limonitic lm n 褐铁矿limonitic lm n 褐铁矿的limy lm y 含灰质的limy lm y 有粘性的lithic lit 岩屑的lithic lit 岩性的lithic lit 石灰的lithology lith 岩性学llittle ltl 小little ltl 少llittle ltl 不多的local loc 局部的local loc 地方的lump lmp 团块lumpy lmpy 块状luster lstr 光泽lutite lut 细屑岩lutite lut 泥质岩magnetic mgn 磁性的magnetite m gt 磁铁矿marble mbl 大理岩marble mbl 大理石marginal mrgnl 边缘的marginal mrgnl 边际的marine m arn 海的marl mrl 灰泥marl mrl 泥灰岩marly mrl 灰泥marly mrl 泥灰岩marlstone m rlst 硬泥灰岩marly mrlyf 泥灰岩maroon m ar 栗色maroon apr 紫酱的massive m as 块状的material m ati 物质matrix m ax 基质matrix m ax 母质matrix m ax 填质matter m at 物质matter m at 物体medium m中间的mesozoic Mz 中生代metam orphic m et 变质的metam orphic rock m eta 变质岩metasom atism m sm交代变质作用mica mic 云母micaceous m icas 云母状的micaceous m icas 含云母的micrite m icr 微晶灰岩micro micr 小micro micr 微middle m id 中部middle m id 中期的minimum m in 最小的minor m nr 次要的minor m nr 较小的minute min 分minute min 微小的miocene m io 渐新统moderate m od 中等的moderate m od 适度的mont m orillonitic m ont m oril 微晶高岭土mottled m ot 斑点的mottled m ot 杂色的muscovite m usc 白云母nacreous nac 珍珠的nacreous nac 珍珠状的neogene neo 下第三纪net oil sand NOS 纯油砂no n 无no cut NCT 无岩屑no flourescence NF 无荧光no recovery NR 未取的no sample N.S 无样品no show NS 无显示no visible porosity n.v.p 无可见孔no water NW 无水nodule nod 结核non nn 无non-upset Nu 不加厚noncalcareous ncal 不含钙的noncommercial NC 无商业价值的none ne 无not reached NR 未达到的not recorded NRec 未记录的novaculite novac 燧石岩number No 号码numerous num许多的odor stain fluoresence OSF 气味油斑及荧光odor taste and stain OTS 气味油感及油斑odor taste stain flouresence OTSF 气味油感油斑荧光oil sand oil sd 油砂oil saurce rock osr 油源岩oil stain ostn 油斑oil-cut m ud OCM 油浸泥浆old well OW 老油井oligocene olig 渐新世olive olv 橄揽olive olv 橄榄色的opaque op 不透明的opaque op 不透明的opaque op 不透明的opaque op 不透明的opaque op 不透明的opaque op 不透明的opaque op 不透明的orange oran 桔黄的orange oran 橙色orbitolina orbit 有孔虫类ordovician o 奥陶系ordovician Ord 奥陶系organic org 有机的organic org 有机的orthoquartzite Q 正石英岩orthoquartzite QTZ 正石英岩ostracoda ost 介形虫overgrowth ovgth 附生overgrowth ovgth 次生overgrowth ovgth 加大pebble pbl 砾石pebble pbl 卵石pale pl 浅色pale pl 淡色pale pl 暗淡色paleocene paleo 古新世paleogene pg 上第三纪part pt 部分part pt 成分particle par 微粒particle par 颗粒partly ptg 夹层partly ptg 断裂partly pty 部分的partly pty 局部的patch pch 碎片patch pch 斑点patch pch 块礁pearly luster prly luster 珍珠光泽pebble PEE 小砾石pebbly pbly 含砾石的pellet pel 球粒pellet pel 团粒permian P 二叠系permian perm二叠系phisphate phos 磷酸盐的phosphatic phos 磷酸盐的phlogopite phlog 金云母phosphate phos 磷酸盐phyllite phyl 千牧岩phyllite phy 千牧岩phyllite phy 鳞片状矿物pin-point pp 顶端pin-point pp 极准确pin-point porosity ppp 极小空隙性pink pink 粉红色pisolite piso 豆石pisolite piso 豆粒pisolite piso 豆状岩pitted pit 坑的plagioclase plsg 斜长石plant fossols pl fos 植物化石plastic plas 可塑的plastic plas 塑性的platy plat 板状的pleiocene pllio 更新世poor p 贫的poor p 稀少的porosity por 孔隙度porosity por 多孔的porous por 孔隙度porous por 多孔的pounds per square inch psi 每平方荧寸磅precam brian Pe 前寒武系precam brian Prec 前寒武系predominant pred 主要的predominant pred 突出predominate pred 主要的predominate pred 突出purple purp 紫色purple purp 紫红色pyrite pyr 黄铁矿pyrobitumen pyrbit 焦沥青pyroclastic pyrclas 火成碎屑pyroxene pyrxn 辉石pure 纯的quartz qtz 石英quartzite qtzt 石英岩quarzitic qtzc 石英岩的quaternary Q 第四纪quaternary Q 第四系quaternary Quat 第四纪quaternary Quat 第四系rainbow show of oil RBSO 彩色油花显示rare r 稀有的rare r 罕见的recrystallized reslzd 重结晶recrystallized reslzd 再结晶red rd 红色red rd 红色的reef rf 礁reef rf 生物礁reef rf 矿脉residual oil RO 残余油residual oil RO 渣油residual oil saturation Ros 残余油饱和度residual res 残余residual res 残余物residue res 残余residue res 残余物round rnd 圆形rubbly rbly 碎石状的rubbly rbly 角砾状的rudstone rdst 砾屑碳酸岩salt x 盐salty x 盐sam ple spl 样品sam ple as above a.a 岩性同上sam ple as above a/a 岩性同上sand sd 砂sandstone sst 砂岩sandy sdy 砂质的saturate sat 饱和的saturate sun 饱和度saturatioon sat 饱和的saturatioon sat 饱和度scales sc 尺度section sec 薄片section sec 阶段sediment sed 沉积物sediment sed 沉积的sedimentary sed 沉积物sedimentary sed 沉积的selenite sel 透石膏shale sh 页岩shale density S.D 页岩密度shaled out shout 尖灭shaled out shout 泥岩封闭shaly shy 页岩状shaly shy 页岩质siderite sid 菱铁矿silica sil 氧化硅silica sil 硅质silica sil 硅酸siliceous sil 氧化硅siliceous sil 硅质siliceous sil 硅酸silky slky 丝状silky slky 光滑的silt slt 粉砂silt slt 淤泥siltstone sltst 粉砂岩silty slty 粉砂质的silurian S 志留系silurian Sil 志留系silvery avy 银色的similar sim相似的similar sim相近的size sz 尺寸size sz 规模skeletal skel 骨骼的skeletal skel 骨架的slabby slab 板状的slant range S/R 斜距slate sl 石板slickenside sks 断面slickenside sks 擦痕slickenside sks 擦痕面slight sl 轻的slight sl 薄的slight show of gas SSG 轻微气显示slight show of oil SSO 轻微油显示slow slw 慢sm all sml 少sm all sml 少量sm ell sm ll 气味sm ooth sm光滑的sm ooth sm平坦的soft sft 软的soluble sol 可溶的solution sol 溶液solution sol 溶解sort srt 种类sort srt 类别sort srt 性质sorted srtd 分选的sorting srtdg 分选作用spar spr 亮晶spar spr 晶石sparry spr 亮晶sparry spr 晶石spare parts sp 备件sparse sps 稀少的sparse sps 稀疏的sparsely spsly 稀少的sparsely spsly 稀疏的species sp 种类species sp 性质specific gravity sp.sg 相对密度specific gravity sp.sg 比重specific gravity sg 相对密度specific gravity sg 比重speckled spec 有斑点的sphalerite sphal 闪锌矿spherical sphcl 球形状的spherical sphcl 圆的spherules sph 小球spicule spic 骨针spicule spic 针状体spicular spic 骨针spicular spic 针状体splintery splin 裂片状splintery splin 易碎裂spores spo 孢子sponge spg 海绵sponge spg 海绵状物spit spt 点spit spt 斑点spotted sptd 斑点的spotted sptd 成点的spotty spty 斑状spudded spd 开始的spudded spd 开钻squsre inch sq in 平方英寸squeeze sqz 挤压squeeze sqz 挤水泥stain stn 油斑strata strat 地层strata strat 分层strata strat 成层stratify strat 地层stratify strat 分层stratify strat 成层stratigraphic test ST 地质探井stratigraphic test ST 参数井stratum strat 地层streak strk 条纹streak strk 薄层streak strk 夹层striated stri 有条纹的stringer strg 低产井stringer strg 低平段strom atoporoid strom层孔虫类strong str 强的strong str 有力的structure struc 构造structure struc 结构stylolite styl 缝和线stylolitic styl 缝和线sub- sb 次subangular subang 次棱角状subangular SA 次棱角状subroundrd subrnd 次圆状subhedral sublitc 半自形的sublithic sublitc 次石质的subrounded subrd 次圆状subrounded subrd 半磨圆的subrounded SR 次圆状subrounded SR 半磨圆的subspherical supsph 次长形sucrose suc 蔗糖sulfur sul 硫sulfur sul 硫磺sulfur s 硫sulfur s 硫磺sulfur water SuW 含硫的水surface surf 地面surface surf 面suspend susp 悬suspend susp 吊suspend susp 停止syncline syncl 向斜syntaxial syn 共轴的tabular tab 平板状的tabular tab 扁平的tan tn 棕黄色tan tn 褐色tatal productin tim e TPT 总生产时间tem porary abandoned TA 临时弃井tem prature temp 温度tem prature difference tem pff 温差tem prature formation TF 地温terriginous ter 陆源的terriginous ter 陆成的tertiary T 第三纪tertiary Tert 第三纪texture tex 结构therm al th 热的therm al th 热力的thick thk 厚的thick thk 粗的thick thk 浓的thin thn 薄的thin thn 细的thin thn 稀的thin section T.S 薄的部分thin-bedded t.b 薄层thread thd 螺丝thread thd 丝扣through thru 通过through thru 经由through out thru 到处through out thru 完全tight tt 致密的tight tt 紧张的tight ti 致密的tight ti 紧张的tim e-depth chart T-Dchart 时深曲线top tp 顶部top tp 上部top T 顶部top T 上部top eroded TE 顶部被侵蚀top of cem ent toc 水泥返高top of sand TOS 顶部砂层total gas TG 全量total tepth TD 总深度total volum e TV 总体积total weigh Tw 总重tough tgh 刚硬的tough tgh 粘稠的trace tr 轨迹trace tr 痕迹translucent trnsl 半透明的transparent transp 透明的treat trt 处理treat trt 论述triassic Tr 三叠纪triassic Trias 三叠纪trilobite trilo 三叶虫tirp gas TG 后效气tirp gas TG 起下钻气triping Tr 起下钻tripoil Trip 硅藻土tripolitic Trip 硅藻土tuff tuf 灰质tuffaceous tuf 凝灰岩type typ 类型type typ 标志unconformity uncf 不整合unconsolidated uncons 未固结的underclay uc 低粘岩underlying undly 下伏的undifferentiated und 无差别的undifferentiated und 一致的uniform unif 相同uniform unif 一致unknown unk 未发现的unsuccessful uns 失败的upper upr 上部under gauge U.G 不规范的vadose vad 渗流variable var 变量variable var 可变的variableation var 变量variableation var 可变的varicolored vcol 杂色的variegated vgt 杂色的variegated vgt 多样的varved vred 纹泥的vein vn 脉vein vn 矿脉vein vn 岩脉veinlet vnlet 细脉veinlet vnlet 小静脉velocity vel 速度vermillon verm朱色的vermillon verm朱砂vertical vert 垂直的very v 很very v 极very coarse grained VCG 极粗的very fine grained VFG 极细的vesicular ves 多孔的vesicular ves 多泡的violet vi 紫色violet vi 紫罗兰色volcanics volc 火山岩volcanics volc 火山物质volcaniclastic vol c 火山碎屑vug vug 晶洞vug vug 孔洞vuggy vug 晶洞vuggy vug 孔洞weak wk 微软的weak wk 软的weathered wthrd 风化的weathering wthrg 风化作用wedge out wdgot 尖灭white wh 白色with w 含with w 带with w 夹cut fluorescence cut 滴照direct dir 直照kaolin kao 高岭土containing contg 含gravity gvl 砾石middle 中部lower 下部intercalated 夹层interbedded 互层porosity 多孔的fractured 裂缝状platy 片状paminated 层状massive 块状fissile 易剥状calci te 方解石dolomite 白云岩sulfats 硫酸岩iron oside 氧化铁sillica 硅石siderite 菱铁矿matrix 基质medium 中间com pact 致密moderate 中等的cem ent 胶结fragm ent 碎片spotted 有斑点的rare 稀少的Fossil 化石shell 贝壳concretion 结核form ation 地层nodule 团块with 有irregular 不规则的friable 易碎的large 大的sm all 小的pole 灰白的pink 桃色blue 蓝色glauconiete 海绿石Pyrite 黄铁矿hornblend 角闪石chlorite 绿泥石mica 云母lingite 褐煤chert 燧石calcareous 钙质soliceous 硅质sandy 砂质muddy 泥质silty 粉砂质shaly 泥质conglom erate 砾岩breccia 角砾岩flake 片状metam orphic 变质的toste 味dye hand 染手slightly 较微的top 顶部bsse 底部upper 上部的under 下部的above 在....上方less than 小于more than 大于interbedded 层间的ripple m ark 痕slichenside 擦痕面alternation 互层carbonaceous 碳质plant 植物dip 倾角geology 地质unconformity 不整合induration 固结unconsolidated 未固结cem entation 硬化com paction 紧密schist 片岩schist 片状的stain 侵然stained 侵然staining 侵然stylolit 缝合线weatheved 风化的absent 缺失altered 蚀变的asphalt 沥青band 夹层bedding 层理bedding 分层background gas 背景气carbonaceous 碳质的carbonized 碳化的conchoidal 贝壳状carbon tetrachloride 四录化碳rock salt 盐岩coaly shale 碳质页岩marly 泥灰岩chalky 白垩质dolomit ic 白云质car banate 碳酸岩calcirudite 钙质砾岩granite 花岗岩cobble 大的砾core 岩心pelletoid 球粒鲕micropelletoid 微粒鲕ooid 鲕粒other 其它的biotote 黑云母barite 重晶石lithology 岩性transparent 透明的without 没有poorly 差的moderately 中等的well 好的trace 微量的good 好的fair 较好的granules 细的砾pebble 中的砾sm all 小的large 大的thick 厚的thin 薄的platy 板状的sponty 松软的com pact 较致密的sm ooth 光滑的conchoidal fracture 贝壳状断口homogeneous 均质的weatnered 风化的banded 条带状的fine 细的coarse 粗的sticky 造浆的brittle 脆的nodule 团块micro crystalline 微晶cryptio crystalline 隐晶aphanitic 隐晶质very fine crystlline 粉晶fine crystlline 细晶medium crystalline 中晶coarse crystalline 粗晶piebald 花斑about 大钩strong 强weak 弱oil semll in general 油味spotty oilstain 油斑patchy oil stain 部分油斑streaky oil stain 油斑条痕uniform oil stain 全部油斑gold 金黄色grain size 粒径crystal 晶体characteristics 特性major 主要的minor 次要的hardness 硬度porosity 孔隙度oil shows 油显示lamina 薄层stratum单层group 系foult 断层oil stained 油浸oil patch 油斑oil spotted 油斑oil trace 油迹oil saturated 油浸sedimentary rock 沉积岩igneous rock 火山岩metam orphic rock 变质岩carbonate rock 碳酸岩silicste 硅酸盐lasalt 玄武岩salt rock 盐岩flint 燧石plastic 塑性的swell 膨涨com pact 坚实的com pact 紧密的dense 稠密的plastic 可塑的earthy 土状wire 安装biocalcarenite 生物砂屑灰岩biocalcilutite 生物泥屑灰岩biocalcirudite 生物砾屑灰岩biocatalysator 生物促长质biocatalyst 生物催化剂biocenology 生物群落学biocenose 生物群落biocenotic association 生物群落共生体biochemical conversion 生物化学转化biochemical cycle 生物化学循环biochemical degradation 生物化学降解biochemical engineering 生物化学工程biochemical factor 生物化学因素biochemical fuel-cell 生物化学燃料电池biochemical gas 生物化学气biochemical methane 生化甲烷biochemical mineralization 生物化学矿化作用biochemical origin 生物化学起源biochemical oxygen demand 生化需氧量biochemical pollution criteria 生物化学污染标准biochemical process 生物化学法biochemical reaction 生物化学反应biochemical reduction 生化还原biochemical 生物化学的biochemigenic rock 生物化学岩biochemistry 生物化学biochronologic 生物年代的biochronology 生物年代学biochronometer 生物钟biochronostratigraphic unit 生物年代地层单位biochronostratigraphic 生物年代地层的biochronotype 生物年代型biocide 杀生物剂bioclast 生物碎屑bioclastic calcarenite 生物碎屑砂屑灰岩bioclastic grainstone 生物碎屑粒状灰岩bioclastic limestone 生物碎屑灰岩bioclastic packstone 生物碎屑泥粒灰岩bioclastic rock 生物碎屑岩bioclastic wackestone 生物碎屑粒泥灰岩bioclastics 生物碎屑岩bioclimate 生物气候bioclimatic zonality 生物气候分带性bioclimatic zonation 生物气候分带bioclimatic zone 生物气候带bioclimatics 生物气候学bioclimatology 生物气候学biocoene 生物群落biocoenology 生物群落学biocoenose 生物群落biocoenosium 生物群落biocoenotic connection 生物群落关联biocoenotics 生物群落学biocolloid 生物胶体biocommunity 生物群落bioconstructed facies 生物建造相bioconstructed limestone 生物灰岩bioconversion 生物转化bioctyl 联辛基biocybernetics 生物控制论biocycle 生物带biodegrability 生物降解能力biodegradability 生物降解性biodegradable detergent 生物降解洗涤剂biodegradable fluid 生物降解液biodegradable polymer 可生物降解的聚合物biodegradable surfactant 生物降解表面活性剂biodegradable 生物可降解的biodegradation oil 生物降解油biodegradation pathway 生物降解途径biodegradation 生物降解作用biodemography 生态统计学biodeposition 生物沉积作用biodeterioration 生物退化biodetritus 生物碎屑biodinetic temperature limit 生物活动温度临界biodynamics 生物动力学biodyne 生物因素bioecology 生物生态学bioelectric current 生物电流bioelectricity 生物电bioelectronics 仿生电子学;生物电子学Bioendoglyphia 内生迹纲bioenergetics 生物力能学bioengineering 生物工程bioenvironmental 生物环境的bioerosion structure 生物侵蚀结构bioerosion 生物侵蚀作用Bioexoglyphia 外生迹纲biofacial zone 生物相带bilge block 底边枕木bilge board 舱底污水道盖板bilge bracket 舭肘板bilge chock 消摇龙骨bilge compartment 浸水舱bilge injection 舱底水注入装置bilge keel 舭龙骨;消摇龙骨bilge keelson 舭龙筋;舭部内龙骨bilge line 舱底水吸水管bilge main 舱底水总管bilge piece 消摇龙骨bilge pipe 舱底吸水管bilge stringer 舭部纵桁bilge suction 舱底吸管bilge water 船底污水bilge ways 底边板;滑板bilge 腹部bilging 船底破裂BILI 层间封隔水泥胶结指数bilianic acid 胆汁烷酸biliary calculus 胆石bilichol 胆汁醇bilicyanin 胆青素biliminal chain 双侧限地槽链biliminal geosyncline 双侧对称地槽bilinear flow 双线性流动bilinear form 双线性型bilinear function 双线性函数bilinear interpolation 双线性插值法bilinear model 双线性模型bilinear relation 双线性关系bilinear transform 双线性变换bilinear transformation 双线性变换bilinear 双线性bilinearity 双线性bilingual edition 双语版bilirubin 胆红素biliverdin 胆绿素bill in domestic 本币汇票bill of clearance 出港申报表bill of entry 入港报关单bill of exchange 汇票bill of lading 运货单bill of materials 材料单bill of quantities 工程量表bill of the hook 吊钩的锁栓bill to order 需签字照付的票据bill 帐单billboard 揭示牌billed price 帐单价格billet 木柴块;短条;坯段;钢坯;错齿饰;字条billeteer 钢坯剥皮机billibit 十亿位billicycle 千兆周billietite 黄钡铀矿Billingsastraea 毕灵星珊瑚属billion electron volts 十亿电子伏billion 千兆billisecond 毫微秒billon 金、银与其他金属的合金billow forming 热胀成型billow 巨浪billy club 镐锤bilogarithmic diagram 双对数图bilogarithmic graph 双对数图bimaceral 双组分显微煤岩类型bimag 双磁芯bimatron 电子束注入式磁控管bimetal 双金属bimetallic catalyst 双金属催化剂bimetallic cell 双金属电池bimetallic corrosion 电偶腐蚀bimetallic electrode 双金属电极bimetallic strip 双金属片bimetallic system cell 双金属温度计bimetallic 双金属的bimetallism 双金属作用bimirror 双镜bimodal cosets 双向叠合组bimodal cross-bedding 双向交错层理bimodal current rose 双向水流玫瑰图bimodal distribution 双峰分布bimodal igneous activity 双向火成活动bimodal rift volcanism 双向裂谷火山活动bimodal size distribution 双峰粒度分布bimodal volcanic complex 双向火山杂岩bimodal 双峰的;双值的;双模的;双向的bimolecular law 双分子反应定律BG 浮心与重心间的距离Bg 宽轨距BG 锥齿轮BG 总线批准BGC 二进制增益控制BGC 凝析油桶数BGG 背景气量BGL 井眼几何形状测井BGMA英国齿轮制造商协会BGO 锗酸铋探测器BGS 英国地质调查所BGT 井眼几何形状测井仪BH loop 磁滞回线BH 布氏硬度BH 观察软管BH 每小时桶数BH 钻孔BHA behavior 底部钻具组合性能BHA changes 改变底部钻具组合BHA components 底部钻具组合组件BHA data base 底部钻具组合数据库BHA deforms 底部钻具组合变形BHA directional behavior 底部钻具组合定向特性BHA dynamics 底部钻具组合动态BHA finite element model 底部钻具组合有限元模式BHA performance 底部钻具组合特性BHA selection 底部钻具组合的选择BHA trips 为改变底部钻具组合而进行的起下钻作业BHA底部钻具组合BHA’s relative rigidity 底部钻具组合的相对刚度BHAP 底部钻具组合计算机程序BHC mode 井眼补偿方式BHC 井底油嘴BHC 井眼补偿声波测井BHCK 井底节流器BHCS 井眼补偿声波测井BHCT 井底循环温度bhd 舱壁bhel 河床沙岛BHF 井内流体BHFP 井底流动压力BHFP 井底破裂压力BHFT 井底流动温度BHGM density 井下重力测量密度BHGM 井下重力仪BHHP 井底水马力BHHP 钻头水马力BHIP 原始井底压力BHM 井眼物质Bhn. 布氏硬度BHP 澳大利亚布洛肯山控股有限公司BHP 锅炉马力BHP 井底模式BHP 井底压力BHP 英制马力BHP 制动马力BHPC 关井井底压力BHPC 井底压力变化bhpf 井底流动压力bhpsi 井底关井压力BHRA英国流体力学研究协会BHS 井底取样器BHS 井眼状况BHSIP 关井井底压力BHST 井底标准温度BHST 井底静态温度BHT 井底温度BHTV 井下电视BI 胶结指数BI 绝对安培BI 双向的Bi 铋bi- 二bi-component 双组分bi-coordinate system 双坐标系bi-directional counter 双向计数器bi-directional folded-type prover system 双向折叠型标定系统bi-directional pig 双向清管器bi-directional pipe prover 双向管式标定装置bi-directional slip 双向卡瓦bi-metal liner 双金属缸套bi-polar machine 双极电机bi-product pipeline 两种油品的管线bi-rotor pump 双转子泵bi-telephone 头戴双耳耳机bending gang 弯管小队bending glide 挠曲滑动bending iron 弯钢筋搬头bending line 弯度线bending machine 弯管机bending mandrel 弯管芯bending modulus 弯曲模量bending moment arm 弯曲力臂bending moment 挠矩bending party =bending crewbending radius 弯曲半径bending restrictor 弯曲限制器bending roll 卷板机bending schedule 弯钢筋表bending sets 冷弯管外胎具bending shoe 弯管子用的架垫bending strain 挠应变bending strength 抗弯强度bending stress 弯曲应力bending sub 弯接头bending team =bending crewbending test 弯曲试验bending trestle 弯管工作台bending yield point 抗弯屈服点bending 弯曲;挠曲;配曲调整;偏移;折曲;无线电波束曲折;弯头bendover price 炼厂所付每桶油价bends 潜水病bendway 深水槽beneficial 有利的;有使用权的beneficiary party 受惠方beneficiate 增效beneficiated bentonite 增效膨润土benefit cost analysis 效益成本分析benefit 利益benefitshazards of acidizing 酸化的利弊Benfield process 本菲尔德法Benfield unit 本菲尔德装置Benioff plane 贝尼奥夫面Benioff seismic zone 贝尼奥夫地震带Benioff zone 贝尼奥夫带;俯冲带;板块消亡带benito 飞机导航装置Bennettitaceaeacuminella 本内苏铁粉属Bennettitaceaeinvolutella 具环单沟粉属Bennettiteaepollenites 原本内苏铁粉属Benneviaspis 班涅夫鱼属bent bar anchorage 弯筋锚固bent chunk 弯曲块体bent cleavage 弯曲劈理bent drill pipe 弯钻杆bent housing motor 弯壳体泥浆马达bent housing 弯外壳定向钻井用支座bent multi-turbodrill 复式弯涡轮钻具bent nose pliers 歪嘴钳bent pipe 弯管bent rod 弯曲抽油杆bent spanner 弯头扳手bent stream tip 曲流喷嘴bent sub 弯接头。
Method of manufacture for a thick film multi-layer
专利名称:Method of manufacture for a thick film multi-layer circuit发明人:Frans Peter Lautzenhiser,John KarlIsenberg,James Edward Walsh,Adam WadeSchubring申请号:US08/991685申请日:19971216公开号:US05910334A公开日:19990608专利内容由知识产权出版社提供摘要:An improved method of manufacturing multi-layer thick film circuits that effectively eliminates the trade-off between thickness and definition, permitting dielectric layers of increased thickness with no pin-holes, and at the same time, more precise definition of dielectric features, such as via openings and solder stops. The dielectric features are precisely defined by an initial thin layer of dielectric material, referred to as a feature definition print, or FDP. After the FDP has been dried but not yet fired, a via can be formed by printing a comparatively thick cover layer of dielectric, over-lapping the edges of the FDP. Due to the porous nature of the dried but not fired FDP, it absorbs solvent from the dielectric cover layer, which inhibits the spreading of the dielectric cover layer. The FDP is then co-fired with the first dielectric layer, and a second dielectric layer may be provided atop the fired first layer to further increase the overall dielectric thickness, if so desired. This results in a thicker dielectric layer for the same number of successive printing steps, and at the same time, smaller dielectric features. The thicker dielectric layer provides improved isolation between circuit layers, and the smallerdielectric features increase the available surface area for conductors and components on the upper dielectric layer. Additionally, process robustness is improved, since there is less fine tuning and batch-to-batch variation when used in high volume production.申请人:DELCO ELECTRONICS CORPORATION代理人:Jimmy L. Funke更多信息请下载全文后查看。
The properties of layered materials
The properties of layered materialsLayered materials are a class of materials that are characterized by their structure, in which individual sheets of atoms or molecules are stacked on top of each other in a repeating pattern. This layered structure is what gives these materials their unique properties, which make them attractive for a wide range of applications.One of the most interesting properties of layered materials is their anisotropy. Anisotropy refers to the fact that the physical properties of the material depend on the direction of measurement. This is a result of the layered structure, which creates different bonding interactions in different directions. For example, graphite, which is a layered material made up of sheets of carbon atoms, is highly anisotropic. In the direction parallel to the sheets, it has high electrical conductivity, while in the perpendicular direction it is an insulator.Another important property of layered materials is their mechanical strength. Because of their layered structure, these materials can exhibit exceptional mechanical properties, with high stiffness and strength in certain directions. This makes them attractive for applications where mechanical stability is important, such as in aerospace or automotive applications. For example, molybdenum disulfide (MoS2) is a layered material with exceptional strength in the direction perpendicular to the layers, making it a promising material for use in thin-film electronics.Layered materials also have interesting optical properties. Many of these materials are optically transparent, and in some cases, they can even be tuned to exhibit different colors or other optical effects. This is because the layered structure can act as a waveguide, confining light to within the layers and creating interference effects that can modify the optical properties of the material. For example, hexagonal boron nitride (h-BN) is a layered material that is transparent in the visible and infrared regions of the spectrum, and can be used as a substrate for graphene-based electronics.In addition to their unique electronic, mechanical, and optical properties, layered materials are also attractive for their thermal properties. Because of their nanoscaledimensions, these materials can conduct heat very efficiently, making them promising candidates for thermal management applications. For example, graphene, which is a layered material made up of sheets of carbon atoms, has exceptionally high thermal conductivity, making it a promising material for use in heat sinks and other thermal management applications.Overall, there are many interesting and unique properties of layered materials that make them attractive for a wide range of applications. Their anisotropic, mechanical, optical, and thermal properties all offer potential advantages in various fields, from electronics to aerospace to energy. As our understanding of these materials grows, it will be exciting to see how they are used in new technological applications in the years to come.。
Understanding the properties of graphite
Understanding the properties ofgraphiteGraphite is a fascinating substance that has many unique properties. It is a form of carbon, and is found naturally in various forms, such as flakes, needles, and lumps. Graphite is known for its ability to conduct electricity, its excellent thermal stability, and its lubricative qualities. In this article, we will explore some of the key properties of graphite, and look at how these properties make graphite useful in various applications.1. ConductivityOne of the most notable properties of graphite is its ability to conduct electricity. This is due to the fact that graphite consists of layers of carbon atoms that are arranged in a hexagonal lattice structure. The electrons in the outermost shells of these atoms are free to move between the layers, allowing graphite to conduct electricity.This property makes graphite useful in a variety of applications, such as in the production of electrodes for lithium-ion batteries, where its high conductivity ensures that the battery can operate efficiently.2. LubricationAnother important property of graphite is its lubricative qualities. This is due to the fact that the layers of carbon atoms in graphite can slide past each other with minimal friction, making it an excellent lubricant.Graphite is used as a lubricant in a variety of applications, such as in the manufacturing of metal products, where it can reduce friction and wear on machinery.3. Thermal StabilityGraphite is also known for its excellent thermal stability. It is able to withstand high temperatures without undergoing significant thermal degradation or chemical reactions.This property makes graphite useful in a wide range of high-temperature applications, such as in the construction of high-temperature furnaces and nuclear reactors.4. Chemical ResistanceGraphite is highly resistant to most chemicals, including acids, alkalis, and organic solvents. This is due to the fact that the strong covalent bonds between the carbon atoms in graphite make it highly stable, even in harsh chemical environments.This property makes graphite useful in a wide range of applications, such as in the production of chemical-resistant coatings and linings for tanks and pipes.5. Structural StrengthGraphite also has excellent structural strength, due to the fact that the layers of carbon atoms are held together by strong covalent bonds. This property makes graphite useful in a variety of structural applications, such as in the construction of high-strength composites and reinforced plastics.ConclusionIn conclusion, graphite is a fascinating substance that has many unique properties. It is highly conductive, has excellent lubricative qualities, is thermally stable, chemically resistant, and has excellent structural strength. These properties make graphite useful in a wide range of applications, from the construction of high-temperature furnaces and nuclear reactors to the manufacturing of metal products and high-strength composites. By understanding the properties of graphite, we can better appreciate its many uses and applications in modern technology.。
thickness intergration points
thickness intergration points Thickness Integration Points: The Key to Successful ImplementationIntroductionIn today's fast-paced and highly competitive world, businesses need to constantly adapt and improve their processes to stay ahead. One crucial aspect of process improvement is understanding the concept of thickness integration points. These points play a vital role in ensuring the smooth implementation of various initiatives and can significantly impact the overall success of any project. In this article, we will delve into the importance of thickness integration points, explore their various aspects, and discuss how they can be effectively managed to achieve success.Understanding Thickness Integration PointsThickness integration points refer to critical areas within a process where different functions, departments, or systems come together. They represent the junctures where collaboration, coordination, and synchronization are required to ensure smooth workflow and prevent bottlenecks or breakdowns in the process. Identifyingthese integration points early on allows businesses to allocate resources appropriately and minimize potential disruptions.The Key Aspects of Thickness Integration Points1. Alignment with Business GoalsThe first step in managing thickness integration points is to align them with the overall objectives and goals of the business. Without a clear understanding of what needs to be achieved, it becomes challenging to identify and prioritize integration points accurately. By aligning these points with business goals, companies can streamline efforts and allocate resources more efficiently.2. Mapping Process FlowsOnce business goals have been defined, mapping process flows becomes essential. Process mapping involves visualizing the sequence of activities, decisions, and information flows within a given process. This step enables businesses to identify integration points and understand the dependencies between different functions or systems. It also helps in identifying potentialbottlenecks or inefficiencies that may hinder the integration process.3. Stakeholder AnalysisSuccessful integration heavily relies on effective stakeholder management. Stakeholder analysis involves identifying and understanding the various individuals or groups involved in the integration process and their respective roles. By mapping stakeholders, their interests, and influences, businesses can develop appropriate strategies for engagement, communication, and collaboration. This analysis enables organizations to address potential conflicts and ensure a smooth integration process.4. Communication and CollaborationThickness integration points cannot be managed effectively without clear and open communication channels among stakeholders. Effective communication ensures that all parties involved have a shared understanding of objectives, timelines, and responsibilities. Collaboration becomes crucial in resolving issues, aligning efforts, and making necessary adjustments. Establishingregular communication mechanisms and fostering a collaborative culture ensures that everyone is on the same page and working towards a common goal.5. Change ManagementAny integration process brings about change, and managing this change is essential for success. Change management involves preparing employees and stakeholders for new processes, technologies, or ways of working. It requires providing adequate training, addressing concerns, and creating a supportive environment. Proactive change management not only facilitates the integration process but also minimizes resistance, reduces errors, and increases employee buy-in.Effective Management of Thickness Integration Points1. Prioritize Integration PointsNot all integration points are created equal. An essential step in managing thickness integration points is identifying and prioritizing them based on their impact on the overall process andbusiness objectives. By focusing resources on critical points, businesses can minimize disruptions and ensure the successful implementation of key initiatives.2. Establish Clear Roles and ResponsibilitiesOnce integration points have been prioritized, it is crucial to allocate clear roles and responsibilities to the respective stakeholders. This ensures accountability, reduces ambiguity, and facilitates effective coordination. Defining roles and responsibilities also helps in identifying potential gaps and addressing them early on.3. Implement Robust Monitoring and Evaluation MechanismsMonitoring progress and evaluating the effectiveness of integration efforts are critical to ensuring success. Implementing robust monitoring and evaluation mechanisms allows businesses to track progress, identify bottlenecks, and make necessary adjustments. Regular reviews and feedback mechanisms provide valuable insights and enable continuous improvement.ConclusionThickness integration points are crucial for successful implementation in today's rapidly evolving business landscape. By understanding their importance, businesses can proactively manage these points and maximize the chances of successful integration. Alignment with business goals, mapping process flows, stakeholder analysis, effective communication and collaboration, and change management are all key aspects that contribute to successful integration efforts. By prioritizing integration points, defining clear roles and responsibilities, and implementing robust monitoring and evaluation mechanisms, businesses can ensure smooth implementation and reap the benefits of successful integration initiatives.。
击穿防腐层 英语
击穿防腐层英语Penetrating the Anticorrosive LayerAbstract:This article explores the topic of penetrating the anticorrosive layer in English.Introduction:In the field of materials science and engineering, corrosion has long been a relentless enemy. Anticorrosive coatings have played a crucial role in protecting metal surfaces from degradation caused by oxidation and corrosion. However, the penetration of the anticorrosive layer has emerged as a significant challenge. This article aims to delve deeper into the issue of penetrating the anticorrosive layer and discuss potential solutions to address this problem.1. Understanding the Anticorrosive Layer1.1 Composition of the Anticorrosive LayerThe anticorrosive layer is typically composed of various substances, such as primers, paints, or specialized coatings. It consists of a combination of binders, pigments, and additives, each serving a specific purpose in preventing corrosion.1.2 Role of the Anticorrosive LayerThe primary function of the anticorrosive layer is to act as a physical barrier, shielding the metal surface from the corrosive agents present in theenvironment. It acts as a sacrificial layer, preventing direct contact between the metal and corrosive substances.2. Factors Affecting Penetration of the Anticorrosive Layer2.1 Surface PreparationProper surface preparation plays a crucial role in the adhesion and effectiveness of the anticorrosive layer. Inadequate cleaning or roughening of the metal surface can hinder the formation of a strong bond between the substrate and the coating.2.2 Coating ThicknessThe thickness of the anticorrosive layer directly influences its ability to resist penetration. A thicker coating provides a greater barrier against corrosive substances and prolongs the protection of the metal surface.2.3 Environmental FactorsExternal factors, such as temperature, humidity, UV radiation, and exposure to chemicals, affect the integrity of the anticorrosive layer. Harsh environmental conditions may lead to the degradation of the coating, making it more susceptible to penetration.3. Challenges and Solutions3.1 Delamination of CoatingsDelamination, or the separation of the coating from the metal substrate, can occur due to improper application or a weak bond between the layers. To mitigate this issue, thorough surface preparation and the use of adhesion promoters can enhance the bond strength, reducing the risk of delamination.3.2 Corrosion Under CoatingsCorrosion under coatings (CUI) is a particularly challenging problem. Moisture, contaminants, or defects on the surface can lead to localized corrosion under the protective layer. Regular inspection, proper application of coatings, and the use of corrosion inhibitors can help prevent CUI.3.3 Mechanical DamageMechanical damage, such as scratches or impact, can compromise the integrity of the anticorrosive layer. Implementing protective measures, such as coatings with high scratch resistance or the use of suitable topcoats, can improve the durability and resistance to mechanical damage.4. Innovations in Anticorrosive Coatings4.1 Self-Healing CoatingsSelf-healing coatings, which possess the ability to repair themselves when damaged, have shown promise in mitigating the penetration of the anticorrosive layer. These coatings contain encapsulated healing agents that can be activated upon damage detection, improving the coating's longevity and protection.4.2 Nanotechnology-based CoatingsNanotechnology has revolutionized many fields, including anticorrosive coatings. Nanostructured coatings offer enhanced barrier properties, improved adhesion, and increased resistance to UV radiation, providing better protection against penetration and corrosion.Conclusion:Penetrating the anticorrosive layer poses significant challenges to the protection of metal surfaces. Understanding the composition, role, and factors influencing the anticorrosive layer is vital for the development and implementation of effective solutions. By addressing challenges such as delamination, corrosion under coatings, and mechanical damage, along with exploring innovative advancements like self-healing coatings and nanotechnology, we can strive for more robust anticorrosive systems and ultimately protect metal surfaces from corrosion more effectively.。
介质层厚度英文
介质层厚度英文The thickness of the dielectric layer is a critical parameter in various applications, including electronic devices, optical systems, and telecommunications. It plays a pivotal role in determining the performance and efficiency of these systems.In electronic circuits, the dielectric layer's thickness can influence the capacitance and the isolation between different layers or components. A thicker dielectric layer can provide better insulation, reducing the risk ofelectrical leakage and improving the overall reliability of the device. However, it may also increase the size of the circuit and affect the speed of signal transmission due to increased impedance.In optical systems, the thickness of the dielectric layer is essential for controlling the reflection, transmission, and absorption of light. It is used in the fabrication ofanti-reflective coatings, waveguides, and optical filters. The precise control of dielectric layer thickness is crucial for achieving the desired optical properties and ensuring the system's performance meets the required specifications.For telecommunications, particularly in fiber optic technology, the dielectric layer forms the cladding around the core where light propagates. The thickness and refractive index of this layer are vital for maintaining the integrityof the optical signal and preventing leakage. Variations in thickness can lead to signal distortion and attenuation, impacting the quality of the transmitted data.In summary, the thickness of the dielectric layer is a fundamental aspect that needs to be carefully considered and controlled in the design and manufacturing processes of various technological applications. It directly impacts the performance, reliability, and efficiency of the systems in which it is used.。
Twist Grain Boundary Phases
298
H.-S. Kitzerow
Hale Waihona Puke (a)(b) Figure 10.1. (a) Structure of a phase which shows a local smectic order and a helical director ®eld at the same time, as proposed by Pollmann [21] and Mu È ller (from [20]). (b) Structure of the TGBA phase proposed by Renn and Lubensky. In addition to the structural features displayed in (a), the grain boundaries and the screw dislocations are shown. Characteristic lengths: d smectic layer spacing, lb thickness of the smectic slabs, ld distance between neighboring screw dislocations, and p pitch of the director ®eld (reprinted from [125]). (c) Smectic layers of two neighboring blocks above (solid lines) and below the drawing plane (dashed lines), and screw dislocations (vertical tubes) between the two blocks. The relation between the layer spacing d and the distance of the defect lines ld is given by (10.1).
动态光散射基本原理及其在纳米科技中的应用——Zeta电位测量
【专题】动态光散射基本原理及其在纳米科技中的应用——Zeta电位测量--------------------------------------------------------------------------------作者: 骑着蜗牛追火箭收录日期: 2009-11-28 发布日期: 2009-11-28动态光散射基本原理及其在纳米科技中的应用——Zeta电位测量前言:Zeta电位是纳米材料的一种重要表征参数。
现代仪器可以通过简便的手段快速准确地测得。
大致原理为:通过电化学原理将Zeta电位的测量转化成带电粒子淌度的测量,而粒子淌度的测量测是通过动态光散射,运用波的多普勒效应测得。
1.Zeta电位与双电层(图1)粒子表面存在的净电荷,影响粒子界面周围区域的离子分布,导致接近表面抗衡离子(与粒子电。
荷相反的离子)浓度增加。
于是,每个粒子周围均存在双电层。
围绕粒子的液体层存在两部分:一是内层区,称为Stern层,其中离子与粒子紧紧地结合在一起;另一个是外层分散区,其中离子不那么紧密的与粒子相吸附。
在分散层内,有一个抽象边界,在边界内的离子和粒子形成稳定实体。
当粒子运动时(如由于重力),在此边界内的离子随着粒子运动,但此边界外的离子不随着粒子运动。
这个边界称为流体力学剪切层或滑动面(slippingplane)。
在这个边界上存在的电位即称为Zeta电位。
ZETA电位是一个表征分散体系稳定性的重要指标。
由于带电微粒吸引分散系中带相反电荷的粒子,离颗粒表面近的离子被强烈束缚着,而那些距离较远的离子形成一个松散的电子云,电子云的内外电位差就叫Zeta电位。
也称电动电位(只有当胶粒在介质中运动时才会表现出来),实际上就是扩散层内的电位差。
ξ电位较高时,粒子能保持一定距离消弱和抵消了范德华引力从而提高了颗粒悬浮系统的稳定性。
反之,当ξ电位较低时,粒子间的斥力减小并逐步靠近,进入范德华引力范围内,粒子就会互相吸引、团聚。
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a r X i v :0803.0737v 2 [c o n d -m a t .m e s -h a l l ] 17 J u l 2008Finite Layer Thickness Stabilizes the Pfaffian State for the 5/2Fractional QuantumHall Effect:Wavefunction Overlap and Topological DegeneracyMichael.R.Peterson 1,Th.Jolicoeur 2,and S.Das Sarma 11Condensed Matter Theory Center,Department of Physics,University of Maryland,College Park,MD 20742,USA and 2Laboratoire de Physique Th´e orique et Mod`e les Statistiques,Universit´e Paris-Sud,91405Orsay Cedex,FranceWe find the finite-width,i.e.,the layer thickness,of experimental quasi-two dimensional systemsproduces a physical environment sufficient to stabilize the Moore-Read Pfaffian state thought to describe the fractional quantum Hall effect at filling factor ν=5/2.This conclusion is based on exact calculations performed in the spherical and torus geometries,studying wavefunction overlap and ground state degeneracy.PACS numbers:73.43.-f,71.10.PmIntroduction :Two dimensional (2D)electrons strongly interacting in the presence of a perpendicular magnetic field experience the fractional quantum Hall effect [1](FQHE)at certain fractional electronic Landau level (LL)filling factors νcharacterized by an incompressible state with fractionally charged quasiparticles with any-onic,rather than fermionic,statistics,the observation of which requires clean (high mobility)samples,low tem-peratures,and high magnetic fields.The FQHE abounds in the lowest Landau level (LLL)with the observation of over 70odd denominator FQHE states,the most fa-mous being the Laughlin state [2]describing the FQHE at ν=1/m (m odd)–the odd denominator a consequence of the Pauli exclusion principle.We are concerned with the FQHE in the second LL (SLL)where the FQHE is scarce with only about 8observed FQHE states which tend to be fragile with low activation energies.The most discussed FQH state in the SLL occurs at the even-denominator filling factor ν=5/2[3],thought to be described by the Moore-Read Pfaffian [4]state (Pf)which intriguingly possesses quasiparticle excitations with non-Abelian statistics providing the tantalizing possibility of topological quantum computation [5].The presence of this state challenges our understanding and suggests the condensation of bosons (perhaps fermion pairs)in a new type of incompressible fluid.Although the Pf state is the leading candidate for the observed 5/2FQHE,the actual nature of the state is currently debated [6,7,8].Consid-ering the importance of this state,our apparent lack of understanding of its precise nature,more than 20years after its discovery,is both embarrassing and problematic.This is particularly true in view of the existence (for more than 15years)of a beautiful candidate 5/2FQHE state,viz.the Pf state [4].The Pf is not as successful in describing the FQHE at ν=5/2as the Laughlin theory is in describing the FQHE in the LLL indicated by the modest overlap be-tween the Pf wavefunction and the exact Coulomb Hamil-tonian wavefunction [9,10](approximately ∼0.9com-pared to ∼0.999for the Laughlin theory wavefunctions).However,changing [10]the short range components of the Coulomb interaction can produce an exact wavefunc-tion with near unity overlap with the Pf.Furthermore,the actual electron-electron interaction in the FQHE ex-perimental systems is not purely Coulombic due to addi-tional physical effects such as disorder,LL mixing,finite-thickness due to the quasi-2D nature of the system,etc.A natural question arises:can any of these effects be in-corporated to produce an exact state that is accurately described by the Pf wavefunction?We answer this ques-tion affirmatively with one of the simplest extensions of the pure Coulombic interaction,namely,the inclusion of finite-thickness effects.We find,by including the finite-thickness effects per-pendicular to the 2D plane,the exact ground state is very successfully approximated by the Pf model.We con-sider two different complementary compact geometries–the sphere [11]and torus [12].Throughout this work we assume the electrons exactly fill half of the SLL yield-ing an electron filling factor of ν=2+1/2=5/2(2coming from completely filling the lowest spin-up and -down bands).Furthermore,we assume electrons in the SLL to be spin-polarized since the current consensus sup-ports that conclusion (in any case the Pf describes a spin-polarized state)and ignore disorder or LL mixing effects (neglecting LL mixing effects may not be a very good ap-proximation for the 5/2FQHE [14]).Hence,the Hamil-tonian is merely the spin-polarized electron interaction Hamiltonian.Haldane [11]showed the Hamiltonian,of interacting electrons confined in the SLL,can be parameterized bypseudopotentials V (1)m –the interaction energies between any pair of electrons with relative angular momentum mV (1)m =∞dkk [L 1(k 2/2)]2L m (k 2)e −k 2V (k ),(1)with V (k )the Fourier transform of the interaction po-tential and L n (x )Laguerre polynomials.We modelthe quasi-2D nature of the experimental system (finite-thickness)by an infinite square-well potential in the di-Figure1:(Color online)Wavefunction overlap between the exact ground state,for a quasi-2D system modeled by an in-finite square-well potential,and the Pf as a function offinite width d for N e=8,10,and12electrons,respectively.The ex-perimental d of Refs.24(solid circle),25(star),and14(open square)are also indicated.The inset shows the excitation gap ∆for N e=8as a function of d both in units of e2/ǫl(solid) and e2/ǫ√ǫ1kd−32π4(1−exp(−kd))(kd)2+4π2,(2)whereǫis the dielectric constant of the host semicon-ductor and l=Figure2:Low-lying eigenenergies as a function of the pseudo-momentum4Figure3:Low-lying eigenenergies of N e=12electrons as afunction K using the SQ potential of width d=4l and aspectratio a/b=0.99.There are doublets at the wavevectors of thePf ground states corresponding to the Pfaffian-Anti-Pfaffiansymmetric and antisymmetric combinations.Due to the al-most square symmetry,there are quasidegeneracies betweenstates at K=(6,0)and K=(0,6).observed(cf.Fig.3)on the torus atfinite width with anearly square unit cell where the two states at(0,N0/2)and(N0/2,0)(exactly degenerate for the square unit cell)are very close in energy and all three members of the Pfmultiplet have exactly one partner at a slightly higherenergy.This does not happen at zero width(d=0)andis strong evidence for the stabilization of the Pf physicsin the SLL byfinite width effects.The observation of the topological degeneracy on thetorus only forfinite thickness,d∼4l,precisely wherethe overlap is also a maximum on the sphere is,in ouropinion,compelling evidence that the5/2FQHE is likelyto be a non-Abelian state.Conclusion:Our results show the,often assumed triv-ial,effects of the quasi-2D nature of the experimentalsystem produce an exact state better described by thePf.The fact that this conclusion is reached in differentfinite sized systems for two different geometries(for sev-eral models of thickness)is compelling.Our results arenot inconsistent with previous work[6,7,8]in the d=0limit showing the absence of the Pf.Further,since wefind a robust Pf atfinite d the transport gap,seen ex-perimentally,would be weaker than predicted in d=0theoretical studies sincefinite width“trivially”reducesenergy gaps,see the inset of Fig.1.Thus,the supposedfragility of the5/2state may not necessarily be due to itbeing close to a phase boundary,perhaps between a CFFermi sea and stripe phase,instead,it may come fromthe relatively wide quasi-2D system needed to produce astable Pf.In this context,it is useful to mention that althoughearlier theoretical work[9,10]pointed to the importanceof tuning the pseudopotential ratio V(1)1/V(1)3in stabi-lizing the Pf,finite width affects[13]all pseudopoten-tials,not just V(1)1/V(1)3.Tuning V(1)1and/or V(1)3,whiletheoretically convenient[9,10],is an ambiguous tech-nique for understanding the stability in real quasi-2D systems where pseudopotentials cannot be tuned 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