SSL-LXA1725SIC-TR;中文规格书,Datasheet资料
FS2115A夸克微芯片规格书
F e a t u r e sFixed 4.9V ± 2% OutputVIN Range: 2.7V to 4.5VOutput Current: Up to 110m A（VIN≥3V）Up to 230mA（VIN≥3.6V） Low Noise Constant Frequency (360kHz) OperationShutdown Current <1µANo InductorsAvailable in Low Profile 6-Lead SOT23 PackageA p p l i c a t i o n sWhite LED BacklightingLi-Ion Battery Backup SuppliesSmart Card Readers D e s c r i p t i o nThe FS2115A is a low noise switched capacitor voltage doubler. It produce a regulated output voltage from a 2.7V to 4.5V input. Low external parts count (one flying capacitor and two small bypass capacitors at VIN and VOUT) make the FS2115A ideally suited for small,battery-powered applications.The FS2115A have thermal shutdown capability and can survive a continuous short circuit from VOUT to GND. A low current shutdown feature disconnects the load from VIN and reduces quiescent current to <1uA.The FS2115A is available in the industry standard SOT-23-6L power packages.PCMCIA Local 5V Supplies 原厂直供，技术支持T y p i c a l A p p l i c a t i o nFigure 1: Regulated 4.9V OutputP i n D e s c r i p t i o nTop ViewSOT-23-6LA b s o l u t e M a x i m u m R a t i n g s (Note 1)V IN ……………………………….…………………………….…….….…..….………- 0.3V to 6V V OUT ………………………………………………………………………………….….- 0.3V to 5.5V VOUT Short-circuit Duration.…………………………………………..….………………indefinite V EN ……………………………………………………...…………………….…...……- 0.3V to 6V IOUT (Note 2) …………………….................................………………………...................... 300mA Operating Temperature Range (Note 3)……………………………………………...……- 30℃ to 85℃ Lead Temperature (Soldering 10 sec.) ……………………………………..………………300℃ Storage Temperature Range ………………………………………………..…..- 65℃ to 125℃Note 1: Absolute Maximum Ratings are those values beyond which the life of a device may be impaired. Note 2: Based on long term current density limitations.Note 3: The FS4004A are guaranteed to meet performance spec ifications from 0°C to 70°C. Specifications over the –40°C to 85°C operating temperature range are assured by design, characterization and correlation with statistical process controls.PIN NUMBER SOT-23-6LPIN NAME1VOUT2 GND 3EN 4 C- 5 VIN 6C+E l e c t r i c a l C h a r a c t e r i s t i c sThe specifications are at TA = 25 ℃. EN= V IN , C IN =C OUT =C FLY =10uF,unless otherwise noted.＊ EFFI = [(Output Voltage × Output Current) / (Input Voltage × Input Current)] × 100%T y p i c a l P e r f o r m a n c e C h a r a c t e r i s t i c sTA=25℃, EN= V IN , C IN =10uF, C OUT =10uF, C FLY =10uF, unless otherwise noted.PARAMETERC O ND I T I O N S MIN TYP MAX UNITS Input Voltage Range (V IN )2.74.5 V Output Voltage Range (V OUT ) 2.7V <V IN <5.5V, I OUT < 65mA 4.83 4.9 4.97 VI SHDN Shutdown Current EN=0V,V OUT = 0V 0.2 µA No Load Input Current I OUT = 0mA, V IN = 3V 0.17 mA Output Ripple (VR) V IN = 3.6V , I OUT = 100mA 20 mVP-P EfficiencyV IN = 3V, I OUT =100mA 78 % Switching Frequency ( f osc )V IN = 3.6V , I OUT = 100mA360kHzOutput Noise （V IN =3.6V, I LOAD =100mA ） SW Noise （V IN =3.6V, I LOAD =100mA ）Output Noise （V IN =4.2V, I LOAD =100mA ） SW Noise （V IN =4.2V, I LOAD =100mA ）FS2115A原厂直供，技术支持P i n F u n c t i o n sGND (Pin 2): Ground. These pins should be tied to a ground plane for best performance. EN (Pin 3): Active Low Shutdown Input. This pin must not be allowed to float. C- (Pin 4): Flying Capacitor Negative Terminal.C+ (Pin 6): Flying Capacitor Positive Terminal.B l o c k D i a g r a mVOUT (Pin 1): Regulated Output Voltage. VOUT should be bypassed with a low ESR ceramic capacitor providing at least 10μF of capacitance as close to the pin as possible for best performance. VIN (Pin 5): Input Supply Voltage. VIN should be bypassed with a low ESR ceramic capacitor providing at least 10μF of capacitance as close to the pin as possible for best performance. FS2115A原厂直供，技术支持A p p l i c a t i o n I n f o r m a t i o nOperationThe FS2115A use a switched capacitor charge pump to boostVIN to a regulated output voltage.Regulation is achieved by sensing the output voltage through an internal resistor divider and modulating the charge pump output current based on the error signal. A 2-phase nonoverlapping clock activates the charge pump switches. The flying capacitor is charged from VIN on the first phase of the clock. On the second phase of the clock it is stacked in series with VIN and connected to VOUT. This sequence of charging and discharging the flying capacitor continues at a free running frequency of 360kHz (typ). In shutdown mode all circuitry is turned off and the FS2115A draw only leakage current from the VIN supply. Furthermore, VOUT is disconnected from VIN. The EN pin is a CMOS input with a threshold voltage of approximately 0.8V. The FS2115A is in shut down when a logic low is applied to the EN pin. Since the EN pin is a high impedance CMOS input it should never be allowed to float. To ensure that its state is defined it must always be driven with a valid logic level. VIN, VOUT Capacitor SelectionThe style and value of capacitors used with the FS2115A determine several important parameters such as regulator control loop stability, output ripple, charge pump strength and minimum start-up time. Flying Capacitor SelectionWarning: A polarized capacitor such as tantalum or aluminum should never be used for the flying capacitor since its voltage can reverse upon start-up of the FS2115A. Low ESR ceramic capacitors should always be used for the flying capacitor.Layout ConsiderationsDue to its high switching frequency and the high transient currents produced by the FS2115A, careful board layout is necessary. A true ground plane and short connections to all capacitors will improve performance and ensure proper regulation under all conditions. Figure 2 shows an example layout for the FS2115AFigure 2: Recommended LayoutTo reduce noise and ripple, it is recommended that low ESR (< 0.1Ω) ceramic capacitors be used for both CIN and COUT. These capacitors should be 10uF or greater. Tantalum and aluminum capacitors are not recommended because of their high ESR. The flying capacitor controls the strength of the charge pump. In order to achieve the rated output current it is necessary to have at least 10uF of capacitance for the flying capacitor.FS2115A原厂直供，技术支持P a c k a g i n g I n f o r m a t i o nSOT-23-6L Package Outline Dimension FS2115A原厂直供，技术支持。
SCALANCE X101-1 商品说明书
24 V
6GK5101-1BB00-2AA3 Page 1/4
06/28/2018
Subject to change without notice © Copyright Siemens
● at DC / maximum
Supply voltage, current consumption, power loss Supply voltage ● external ● external Type of voltage / of the supply voltage Product component / fusing at power supply input Fuse protection type / at input for supply voltage Consumed current ● maximum Power loss [W] ● at DC / at 24 V
Compact 40 mm 125 mm 124 mm 0.55 kg
Yes Yes Yes
No No
FM3611: Class 1, Divison 2, Group A, B, C, D / T.., Class 1, Zone 2, Group IIC, T.. EN 600079-15 II 3 G EEx nA II T.. KEMA 06 ATEX 0021 X
Yes
Yes Yes Yes Yes Yes No 134 y
/snst
/simatic-net https:// /industry/infocenter /bilddb /cax https://
Security information
UL 60950-1, CSA C22.2 No. 60950-1 UL 1604 and UL 2279-15 (Hazardous Location), Class 1 / Division 2 / Group A, B, C, D / T.., Class 1 / Zone 2 / Group IIC / T.. EN 61000-6-3 EN 61000-6-4:2001 EN 61000-6-2:2001, EN 61000-6-4:2001 Yes Yes Yes
SSL2103T1,518;中文规格书,Datasheet资料
/
NXP Semiconductors
SSL2103
Dimmable Greenchip controller for LED lighting
4. Quick reference data
Table 1. Symbol VCC fosc IDRAIN min max Tamb
7. Pinning information
7.1 Pinning
SB_DRV WB_DRV VCC GND BRIGHTNESS RC2 RC
1 2 3 4 5 6 7
001aam652
14 HVDET 13 DRAIN 12 PWR_DRV
SSL2103
11 SOURCE 10 AUX 9 8 ISENSE PWMLIMIT
SSL2103
Dimmable Greenchip controller for LED lighting
Rev. 2.2 — 5 December 2011 Product data sheet
1. General description
The SSL2103 is a Switched Mode Power Supply (SMPS) controller IC that operates in combination with a phase cut dimmer directly from the rectified mains. It is designed to drive LED devices. The device includes a circuit to allow direct start-up from the rectified mains voltage. For dimmer applications, an integrated dedicated circuitry optimizes the dimming curve.
2x2和2x4型号LED设备说明书
Consult installation guide for exact dimensions.CEILING CUTOUT SIZE A B C D E F 2X223 3/4”23 3/4” 4 1/8”22 1/2”22 7/8”22 7/8”2X447 3/4”23 3/4”4 1/8”46 1/2”46 3/4”22 7/8”ATOP VIEW7/8” WIRING ACCESSEDCROSS SECTIONCBFHousingPrecision die formed and welded housing with specified material (see product ordering key).MountingFlange installation is supported by swing style mounting brackets. Grid installation suitable for 1” and 1.5” T-Bar ceilings.Door FrameSingle piece precision die formed with specified material (see product ordering key). Corners are TIG welded. Tamper resistant TORX® Head with center pin fasteners secure door frame to housing.LEDAvailable in two standard colour temperatures 3500K and 4000K.LensMultiple lens choices available (see product key for options). Lens sealed to door frame with continuous retention system and supported with stainless steel aircraft cables.FinishPolyester powder painted white finish features a high reflectivity coating for improved performance and efficiency.ElectricalLong life LED’s coupled with high efficiency drivers provide quality illumination. Rated to deliver an L80 performance >50,000 hours. The standard driver has a THD of <10%. Standard low-voltage dimming (0-10v). All electrical components are CSA or UL approved. A ½” EMT hole is provided for wiring connections.Warranty5 year limited warranty. For complete warranty terms visit:/assets/Viscor_LED_Warranty.pdfDimensionsApprovalsApproved CSA and UL Standards. UL listed for insulated ceilings, wet locations.ICRATEDProduct DescriptionThe VRU series by Certolux is a vandal resistant IC-rated specification grade recessed luminaire for grid or flange applications. The luminaire features tamper resistant fasteners to protect from unauthorized fixture penetration and security lenses to maximize impact resistance.Features• SPEEDShip in 5 days (limited quantity of 25 units)Features Options• IP65 RatingOrder KeyEXAMPLE: VRUI2X2A/ALED840K055LUNV-P13/P45PhotometricCRI8 - (80-89)8A AVoltageUNV - 120-277V347 - 347VCCT35K - 3500 K40K - 4000 KSize NominalLumens Watts 2x25500532x45500477000611000082LEDVRUSeriesSize(Width xLength)2x22x4 Door StyleI - InsetO - OverlappingDoorGaugeA - 18 Ga. CRS - PaintedHousingGaugeA - 18 Ga. CRS - PaintedInternal/ExternalLensP13 - .125 Prismatic AcrylicP45 - .125 Clear Polycarbonate/-/NominalLumens055L - 5500lm070L - 7000lm100L - 10000lm2x42x2VRUI-2X2-LED840K055LUNV-P82P08IES File:VRUI-2X2-LED840K055LUNV-P82P08Lumens:5569Wattage:52Efficacy:1070°10°20°30°40°50°60°70°80°90200 cd 400 cd 600 cd 800 cd 1000 cd 1200 cd 1400 cd 1600 cd 1800 cd 2000 cd 2200 cd 2400 cdZonal Lumen SummaryZone Lumens%Lamp0.0° - 30.0°1723-43,083.6%30.9%0.0° - 40.0°2764-69,091.0%49.6%0.0° - 60.0°4646-116,155.7%83.4%0.0° - 90.0°5569-139,225.4%100.0%Average Luminance Table (cd/m2)CP Summary0.00°45.00°90.00°0.00°63646364636445.00°52025147523255.00°46644579468165.00°39103791391575.00°26592559278085.00°79711701738Coefficients of Utilizationρc80%70%50%ρw70%50%30%70%50%30%70%50%30%0119119119116116116111111111111010510110710399102999621009386989185938782392827489807385777148473658272647869625786557766456726255672595070585067564976754456553456251448624941614841584740958453757453754443610554234534134514033Effective Floor Cavity Reflectance: 20%P13P45OptionsApproval OptionsX8 IP65 RatingOther options may be available, consult factory.Specifications and data subject to change without notice.。
FPGA可编程逻辑器件芯片XCVU13P-1FLGA2577I中文规格书
综述赛灵思 Virtex ® UltraScale+™ FPGA 支持 -3、-2 和 -1 速度等级，其中 -3E 器件性能最高。
-2LE 器件可以 0.85V 或 0.72V 的 V CCINT 电压工作，并提供更低的最大静态功耗。
使用以 V CCINT = 0.85V 工作的 -2LE 器件时，L 器件的速度规格与 -2I 速度等级相同。
以 V CCINT = 0.72V 工作时，-2LE 器件的性能以及静态和动态功耗都将下降。
DC 和 AC 特性按以下温度范围来指定：扩展级 (E)、工业级 (I) 和军工级 (M)。
除正常工作的温度外或者除非另行说明，否则特定速度等级的所有 DC 和 AC 电气参数都相同（即，-1 速度等级的扩展级器件的时序特性与 -1 速度等级的工业级器件相同）。
但在每个温度范围内，仅限选定的速度等级和/或器件才可用。
本数据手册中的 XQ 参考信息仅适用于 XQ 加固型封装中可用的器件。
请参阅《军用级 UltraScale 架构数据手册：简介》(DS895)，以获取有关 XQ 军用级器件编号、封装和订购的更多信息。
所有供电电压和结温规格均代表最差情况下的规格。
所含参数为常用设计和典型应用的公用参数。
本数据手册属于 Virtex UltraScale+ FPGA 的整体文档集合的一部分，可通过赛灵思网站获取。
DC 特性绝对最大额定值条款中英文版本如有歧义，概以英文版本为准。
表 21：速度等级指定（按器件） (续)器件速度等级、温度范围和 V CCINT工作电压Advance Preliminary量产XQVU11P-2I (V CCINT = 0.85V)-1I (V CCINT = 0.85V)-2LE (V CCINT = 0.85V)，-2LE (V CCINT = 0.72V)1注释：1.最低功耗的 -2L 器件（其中 V CCINT = 0.72V）在 Vivado Design Suite 中列为 -2LV。
richtek rt8268 数据手册说明书
Function Block DiagramTypical Application CircuitOUT 3.3VAbsolute Maximum Ratings (Note 1)z Supply Voltage, V IN-----------------------------------------------------------------------------------------−0.3V to 26Vz Switching Voltage, SW-------------------------------------------------------------------------------------−0.3V to (V IN+ 0.3V)z BOOT Voltage------------------------------------------------------------------------------------------------(V SW − 0.3V) to (V SW + 6V) z All Other Voltage---------------------------------------------------------------------------------------------−0.3V to 6Vz Power Dissipation, P D @ T A = 25°CSOP-8----------------------------------------------------------------------------------------------------------0.833WMSOP-10 (Exposed Pad)----------------------------------------------------------------------------------1.163Wz Package Thermal Resistance (Note 2)SOP-8, θJA----------------------------------------------------------------------------------------------------120°C/WMSOP-10 (Exposed Pad), θJA----------------------------------------------------------------------------86°C/WMSOP-10 (Exposed Pad), θJC----------------------------------------------------------------------------30°C/Wz Junction T emperature---------------------------------------------------------------------------------------150°Cz Lead Temperature (Soldering, 10 sec.)-----------------------------------------------------------------260°Cz Storage T emperature Range-------------------------------------------------------------------------------−65°C to 150°Cz ESD Susceptibility (Note 3)HBM (Human Body Mode)---------------------------------------------------------------------------------2kVMM (Machine Mode)----------------------------------------------------------------------------------------200V Recommended Operating Conditions (Note 4)z Supply Voltage, V IN-----------------------------------------------------------------------------------------4.75V to 24Vz Enable Voltage, V EN-----------------------------------------------------------------------------------------0V to 5.5Vz Junction T emperature Range------------------------------------------------------------------------------−40°C to 125°Cz Ambient T emperature Range------------------------------------------------------------------------------−40°C to 85°C Electrical CharacteristicsTo be continuedCurrent Limit vs. Duty Cycle2.22.73.23.74.24.7102030405060708090100Duty Cycle (%)C u r r e n t L i m i t (A )Typical Operating CharacteristicsOutput Voltage vs. Output Current3.2833.2853.2873.2893.2913.2933.29500.250.50.7511.251.51.752Load Current (A)O u t p u t V o l t a g e (V )Efficiency vs. Load Current01020304050607080901000.250.50.7511.251.51.752Load Current (A)E f f i c i e n c y (%)Efficiency vs. Load Current10203040506070809010000.250.50.7511.251.51.752Load Current (A)E f f i c i e n c y (%)V REF vs. Temperature0.9000.9050.9100.9150.9200.9250.930-50-25255075100125Temperature V R E F (V )(°C)Quiescent Current vs. Temperature0.450.500.550.600.650.700.75-50-25255075100125Temperature Q u i e s c e n t C u r r e n t (m A )(°C)(1A/Div)(200mV/Div)V IN = 12V, V OUT = 3.3V, I OUT = 0 to 2APower On from ENTime (250μs/Div)V EN (5V/Div)V OUT (1V/Div)I IN(500mA/Div)V IN = 12V, V OUT = 3.3V, I OUT = 2APower Off from ENTime (25μs/Div)V EN (5V/Div)V OUT (1V/Div)V IN = 12V, V OUT = 3.3V, I OUT = 2AFerrite core material saturates “hard ”, which means that inductance collapses abruptly when the peak design current is exceeded. The previous situation results in an abrupt increase in inductor ripple current and consequent output voltage ripple.Do not allow the core to saturate!Different core materials and shapes will change the size/current and price/current relationship of an inductor.T oroid or shielded pot cores in ferrite or permalloy materials are small and do not radiate energy. However, they are usually more expensive than the similar powdered iron inductors. The rule for inductor choice mainly depends on the price vs. size requirement and any radiated field/EMI requirements.Diode SelectionWhen the power switch turns off, the path for the current is through the diode connected between the switch output and ground. This forward biased diode must have a minimum voltage drop and recovery times. Schottky diode is recommended and it should be able to handle those current. The reverse voltage rating of the diode should be greater than the maximum input voltage, and current rating should be greater than the maximum load current. For more detail please refer to Table 4.C IN and C OUT SelectionThe input capacitance, C IN, is needed to filter the trapezoidal current at the source of the high side MOSFET .To prevent large ripple current, a low ESR input capacitor sized for the maximum RMS current should be used. The RMS current is given by :This formula has a maximum at V IN = 2V OUT , where I RMS = I OUT /2. This simple worst-case condition is commonly used for design because even significant deviations do not offer much relief.Choose a capacitor rated at a higher temperature than required. Several capacitors may also be paralleled to meet size or height requirements in the design.For the input capacitor, a 10μF low ESR ceramic capacitor is recommended. For the recommended capacitor, pleaserefer to table 3 for more detail.The selection of C OUT is determined by the required ESR to minimize voltage ripple.Moreover, the amount of bulk capacitance is also a key for C OUT selection to ensure that the control loop is stable.Loop stability can be checked by viewing the load transient response as described in a later section.The output ripple, ΔV OUT , is determined by :The output ripple will be highest at the maximum input voltage since ΔI L increases with input voltage. Multiplecapacitors placed in parallel may be needed to meet the ESR and RMS current handling requirement. Dry tantalum,special polymer, aluminum electrolytic and ceramic capacitors are all available in surface mount packages.Special polymer capacitors offer very low ESR value.However, it provides lower capacitance density than other types. Although Tantalum capacitors have the highest capacitance density, it is important to only use types that pass the surge test for use in switching power supplies.Aluminum electrolytic capacitors have significantly higher ESR. However, it can be used in cost-sensitive applications for ripple current rating and long term reliability considerations. Ceramic capacitors have excellent low ESR characteristics but can have a high voltage coefficient and audible piezoelectric effects. The high Q of ceramic capacitors with trace inductance can also lead to significant ringing.Higher values, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, V IN . At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at V IN large enough to damage thepart.RMS OUT(MAX)I = I OUT L OUT 1V I ESR 8fC ⎡⎤Δ≤Δ+⎢⎥⎣⎦Figure 4. PCB Layout Guide for MSOP-10 (Exposed Pad)Figure 5. PCB Layout Guide for SOP-8CC the RT8268.connected as close to the device as possible.CThe feedback components must be connected as closeHM8-Lead SOP Plastic PackageOutline DimensionDS8268-02 March 2011。
19-213GHC-YR1S23T;中文规格书,Datasheet资料
Technical Data Sheet0603 Package Chip LED (0.6 mm Height)19-213/GHC-YR1S2/3T Features․Package in 8mm tape on 7〞diameter reel.․Compatible with automatic placement equipment.․Compatible with infrared and vapor phase reflowsolder process.․Mono-color type.․Pb-free.Descriptions․The 19-213 SMD Taping is much smaller thanlead frame type components, thus enable smallerboard size, higher packing density, reducedstorage space and finally smaller equipment to beobtained.․Besides, lightweight makes them ideal forminiature applications. etc.Applications․Automotive: backlighting in dashboard and switch.․Telecommunication: indicator and backlighting intelephone and fax.․Flat backlight for LCD, switch and symbol.․General use.Device Selection GuideChipLens Color Part No.ColorMaterial Emitted19-213/GHC-YR1S2/3T InGaN Brilliant Green Water Clear19-213/GHC-YR1S2/3TNote: The tolerances unless mentioned is ±0.1mm ,Unit = mm19-213/GHC-YR1S2/3T Absolute Maximum Ratings (Ta=25℃)Parameter SymbolRatingUnitReverse Voltage V R 5 VForward Current I F 25 mAOperating Temperature Topr -40 ~ +85 ℃Storage Temperature Tstg -40 ~ +90 ℃Soldering Temperature Tsol260(for 5 second)℃Electrostatic Discharge ESD 150 VPower Dissipation Pd 110 mWPeak Forward Current(Duty 1/10 @1KHz)I FP 100 mAElectro-Optical Characteristics (Ta=25℃)Parameter Symbol Min. Typ. Max. Unit Condition Luminous Intensity Iv 112 ---- 285 mcdViewing Angle2θ1/2 ----- 120 ----- degPeak Wavelengthλp ----- 518 ----- nmDominant Wavelengthλd520 ----- 535 nmSpectrum RadiationBandwidth△λ----- 35 ----- nm Forward Voltage V F----- 3.5 4.0 VI F=20mAReverse Current I R ----- ----- 50 μA V R=5V Notes:1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±1nm3.Tolerance of Forward Voltage ±0.1V19-213/GHC-YR1S2/3T Bin Rang Of Dom. WavelengthMin Max Unit Condition Group BinX 520 525Ynm I F=20mAY 525 530Z 530 535Bin Rang Of Luminous IntensityBin Min Max Unit ConditionR1 112 140R2 140 180mcd I F=20mAS1 180 225S2 225 285Notes:1.Tolerance of Luminous Intensity ±10%2.Tolerance of Dominant Wavelength ±1nm3.Tolerance of Forward Voltage ±0.1V19-213/GHC-YR1S2/3T19-213/GHC-YR1S2/3T Label explanationCAT:LuminousREF:Reel DimensionsNote:19-213/GHC-YR1S2/3T19-213/GHC-YR1S2/3TReliability Test Items And ConditionsThe reliability of products shall be satisfied with items listed below. Confidence level ：90% LTPD ：10%No. Items Test Condition Test Hours/Cycles SampleSizeAc/Re1 Reflow Soldering Temp. : 260℃±5℃Min. 5sec. 6 Min.22 PCS.0/1 2 Temperature Cycle H : +100℃ 15min∫ 5 minL : -40℃ 15min 300 Cycles 22 PCS.0/13 Thermal Shock H : +100℃ 5min∫ 10 secL : -10℃ 5min300 Cycles 22 PCS.0/1 4High TemperatureStorageTemp. : 100℃ 1000 Hrs. 22 PCS.0/1 5Low TemperatureStorage Temp. : -40℃ 1000 Hrs. 22 PCS.0/1 6 DC Operating Life I F = 20 mA 1000 Hrs. 22 PCS.0/1 7High Temperature /High Humidity85℃/ 85%RH1000 Hrs.22 PCS.0/119-213/GHC-YR1S2/3TPrecautions For Use1. Over-current-proofCustomer must apply resistors for protection , otherwise slight voltage shift will cause bigcurrent change ( Burn out will happen ).2. Storage2.1 Do not open moisture proof bag before the products are ready to use.2.2 Before opening the package, the LEDs should be kept at 30℃or less and 90%RH or less.2.3 The LEDs should be used within a year.2.4 After opening the package, the LEDs should be kept at 30℃or less and 70%RH or less.2.5 The LEDs should be used within 168 hours (7 days) after opening the package.2.6 If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded thestorage time, baking treatment should be performed using the following conditions.Baking treatment : 60±5℃for 24 hours.3. Soldering Condition3.1 Pb-free solder temperature profile3.2 Reflow soldering should not be done more than two times.3.3 When soldering, do not put stress on the LEDs during heating.3.4 After soldering, do not warp the circuit board.19-213/GHC-YR1S2/3T4.Soldering IronEach terminal is to go to the tip of soldering iron temperature less than 280℃for 3 seconds within once in less than the soldering iron capacity 25W. Leave two seconds and more intervals, and do soldering of each terminal. Be careful because the damage of the product is often started at the time of the hand solder.5.RepairingRepair should not be done after the LEDs have been soldered. When repairing is unavoidable, a double-head soldering iron should be used (as below figure). It should be confirmed beforehand whether分销商库存信息: EVERLIGHT19-213/GHC-YR1S2/3T。
FS6271夸克微芯片规格书
1MHz, 2.5A Step-Up Current Mode PWM ConverterF S 6271Gene r al DescriptionThe FS6271 is a current mode boost DC-DC converter. Its PWM circuitry with built-in 0.2Ωpower MOSFET make this regulator highly power efficient. The internal compensation network also minimizes as much as 6 external component counts. The non-inverting input of error amplifier connects to a 0.6V precision reference voltage and internal soft-start function can reduce the inrush current.The FS6271 is available in the SOT23-6L package and provides space-saving PCB for the application fields.FeaturesAdjustable Output up to 12VInternal Fixed PWM frequency: 1.0MHzPrecision Feedback Reference Voltage: 0.6V (±2%) Internal 0.2Ω, 2.5A, 16V Power MOSFETShutdown Current: 0.1μA Over Temperature Protection Over Voltage ProtectionAdjustable Over Current Protection: 0.5A ~ 2.5A Package: SOT23-6LApplications Chargers LCD Displays Digital Cameras Handheld Devices Portable Products Typical Application Circuit原厂直供，技术支持Function Block DiagramPin DescriptionsSOT23-6LOC ENLX GND FBV CC Top ViewNameNo.I / ODescriptionPower Switch Output O 1LXIC GroundP 2GND Error Amplifier Inverting Input I 3FB Enable Control (Active High)I 4EN V CC IC Power SupplyP 5Adjustable Current Limit (Floating Available)I6OCSOT23-6LLot NumberYearPart Number CodeLot Number ArrayYear: Production year’s last digitPart Number Code: Part number identification code for this product. It should be always “AL”.Ordering InformationPart NumberCode Operating TemperaturePackageMOQDescriptionAL-40°C ~ 85°CTape & Reel3000EASOT23-6LAbsolute Maximum RatingsParameterSymbolConditions Min.Typ. Max.UnitV Supply Voltage CC V 60VLX Voltage LXV 160V 60EN,FB Voltage P Power DissipationD SOT23-6L @T A =25°CmW 455Thermal Resistance (Note1) θJA+220SOT23-6L°C / WT Junction Temperature J+150 °C T Operating Temperature OP +85-40°C T Storage Temperature ST+150-65°C +260(soldering, 10 sec)Lead Temperature °CNote1:θJA is measured in the natural convection at T A =25°C on a low effective thermal conductivity test board of JEDEC 51-3 thermal measurement standard.IR Re-flow Soldering CurveFS6271LR-G1Recommended Operating ConditionsParameterSymbolConditionsMin.Typ. Max.UnitV Supply VoltageIN V 5.52.6T Operating Temperature RangeA°C+85-40Ambient TemperatureDC Electrical Characteristics (V CC =3.3V, T A =25°C ,unless otherwise specified)ParameterSymbol Conditions Min. Typ. Max. UnitSystem Supply Input V Input Supply Range CC V 5.52.6V Under Voltage Lockout UVLOV 2.2V 0.1UVLO Hysteresis I Quiescent Current CC V FB mA 0.19=0.66V, No switching I Average Supply Current CCV FB mA 2.84=0.55V, SwitchingI Shutdown Supply Current CC V EN µA0.1=GNDOscillatorF Operation Frequency OSC V FB MH 1.21.00.8= 1.0VZ f Frequency Change with Voltage△/△ V CC %5=2.6V to 5.5V T Maximum Duty Cycle DUTY%90Reference Voltage Reference Voltage V REF V 0.6120.60.588Line RegulationV CC =2.6V ～5.5V% / V0.2Enable Control V Enable Voltage EN V 0.96V Shutdown Voltage ENV0.6MOSFETR On Resistance of Driver DS (ON) I LX 0.2=2A ΩProtection I OCP CurrentOCPA 2.5I Adjustable OCP Current OCPWith External Resistor ：19k~96k0.5 2.5 A T OTP TemperatureOTP+150°CTypical Operating Characteristics(V CC =3.3V, V OUT =5V, T A= 25°C, unless otherwise noted)Efficiency vs. Output Current70758085909510010.90.80.70.40.50.60.30.20.1Output Current (A )E f f i c i e n c y (%)Current Limit vs. External Resistance (Roc)00.511.522.533.5100908040506070302010External Resistance (k Ω)C u r r e n t L i m i t (A )Operation Frequency vs. Input Voltage1.021.041.061.081.11.121.141.1623456Input Voltage (V)O p e r a t i o n F r e q u e n c y (M H z )Operation Frequency vs. Temperature11.021.041.061.081.110080602040-20-40Temperature (°C)O p e r a t i o n F r e q e n c y (M H z )Reference Voltage vs. Input Voltage0.60.6010.6020.6030.6040.6050.6060.60723456Input Voltage (V)F e e d b a c k V o l t a g e (V )Reference Voltage vs. Output Current0.60.6010.6020.6030.6040.60510.90.80.70.40.50.60.30.20.1Output Current (A)F e e d b a c k V o l t a g e (V )Quiescent Current vs. Input Voltage12015018021024027023456Input Voltage (V)Q u i e s c e n t C u r r e n t (u A )Average Supply Current vs. Input Voltage0.511.522.533.544.523456Input Voltage (V)A v e r a g e S u p p l y C u r r e n t (m A )V IN =5V, V OUT =9V3R 48000I OCPFunction DescriptionOperationThe FS6271 is a current mode boost converter.The constant switching frequency is 1MHz and operates with pulse width modulation (PWM). Build-in 16V / 2.5A MOSFET provides a high output voltage. The control loop architecture is peak current mode control; therefore slope compensation circuit is added to the current signal to allow stable operation for duty cycles larger than 50%.Soft Start FunctionSoft start circuitry is integrated into FS6271 to avoid inrush current during power on. After the IC is enabled, the output of error amplifier is clamped by the internal soft-start function, which causes PWM pulse width increasing slowly and thus reducing input surge current.Current Limit ProgramA resistor between OC and GND pin programs peak switch current. The resistor value should bebetween 19k and 96k. The current limit will be set from 2.5A to 0.5A. Keep traces at this pin as short as possible. Do not put capacitance at this pin. To set the over current trip point according to the following equation:Over Temperature Protection (OTP)FS6271 will turn off the power MOSFET automatically when the internal junction temperature is over 150°C . The power MOSFET wake up when the junction temperature drops 30°C under the OTP threshold temperature.Over Voltage Protection (OVP)In some condition, the resistive divider may be unconnected, which will cause PWM signal to operate with maximum duty cycle and output voltage is boosted higher and higher. The power MOSFET will be turned off immediately, when the output voltage exceeds the OVP threshold level. TheFS6271’s OVP threshold is 16V.Application InformationInductor SelectionInductance value is decided based on different condition. 3.3uH to 4.7µH inductor value is recommended for general application circuit. There are three important inductor specifications, DC resistance, saturation current and core loss. Low DC resistance has better power efficiency. Also, it avoid inductor saturation which will cause circuit system unstable and lower core loss at 1 MHz.Capacitor SelectionThe output capacitor is required to maintain the DC voltage. Low ESR capacitors are preferred to reduce the output voltage ripple. Ceramic capacitor of X5R and X7R are recommended, which have low equivalent series resistance (ESR) and wider operation temperature range.Diode SelectionSchottky diodes with fast recovery times and low forward voltages are recommended. Ensure the diode average and peak current rating exceed the average output current and peak inductor current. In addition, the diode’s reverse breakdown voltage must exceed the output voltage.Output Voltage ProgrammingThe output voltage is set by a resistive voltage divider from the output voltage to FB. The output voltage is:⎪⎭⎫ ⎝⎛+=2R 1R 1V 6.0V OUTLayout Considerations1. The power traces, consisting of the GND trace, the LX trace and the V CC trace should be kept short, direct and wide.2. LX 、L and D switching node, wide and short trace to reduce EMI.3. Place C IN near V CC pin as closely as possible to maintain input voltage steady and filter out the pulsing input current.4. The resistive divider R1and R2 must be connected to FB pin directly as closely as possible .5. FB is a sensitive node. Please keep it away from switching node, LX.6. The GND of the IC, C IN and C OUT should be connected close together directly to a ground plane.Suggested LayoutTypical ApplicationNote: Don’t pull the Vout back to the FS6271’s Vcc pin. When the system receives thenoise, it will lead to Vout ripple too high and over the absolute maximum rating ofthe Vcc pin.Package OutlineSOT23-6LUnit: mmNote:1. Package dimensions are in compliance with JEDEC outline: MO-178 AB.2. Dimension “D” does not include molding flash, protrusions or gate burrs.3. Dimension “E1” does not include inter-lead flash or protrusions.SymbolsMin. (mm)Max. (mm)1.4501.050A 0.1500.050A1 1.3000.900A20.5000.300b 0.2200.080c 2.900 BSC D 2.800 BSC E 1.600 BSC E10.950 BSC e 1.900 BSCe10.6000.300L 0.600 REF L10.250 BSCL2θ° 0° 8° θ1° 3° 7°θ2°6° 15°F S 6271。
SE2597L-R;中文规格书,Datasheet资料
DSSS 2.4 GHz WLAN (IEEE802.11b) OFDM 2.4 GHz WLAN (IEEE802.11g) OFDM 2.4 GHz WLAN (IEEE802.11n) Access Points, PCMCIA, PC cards
Skyworks Solutions, Inc. ● Phone [781] 376-3000 ● Fax [781] 376-3100 ● sales@ ● DST-00211 Rev 1.7 ● Skyworks Proprietary Information ● Products and Product Information are Subject to Change Without Notice ● April 3, 2012
Ordering Information
Part Number SE2597L SE2597L-R SE2597L-EK1 Package 16 Pin QFN 16 Pin QFN Evaluation Kit Remark Samples Tape and Reel Standard
Functional Block Diagram
2 of 9
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DATA SHEET SE2597L: 2.4 GHz Power Amplifier with Power Detector Absolute Maximum Ratings
These are stress ratings only. Exposure to stresses beyond these maximum ratings for a long period of time may cause permanent damage to, or affect the reliability of the device. Avoid operating the device outside the recommended operating conditions defined below. This device is ESD sensitive. Handling and assembly of this device should be at ESD protected workstations. Symbol VCC RFout VEN RFin TSTG ESD HBM Definition Supply Voltage on pins VCC Supply Voltage on pins VCC3 (Note: SE2597L application circuit must be followed for operation above 3.6 V) Power Amplifier Enable RF Input Power, RF_OUT terminated into 50Ω match Storage Temperature Range JEDEC JESD22-A114 all pins Min. -0.3 -0.3 -0.3 -40 Max. 4 5.5 3.6 10 150 500 Unit V V V dBm °C V
FOXBORO I A Series HARDWARE产品规格说明书
FOXBORO ®The FBM214 HART ® Communication Input Interface Module provides eight input channels, each accepting a 4 to 20mA analog signal or a digital HART signal superimposed on a 4 to 20 mA analog input signal.FEATURESKey features of the FBM214 module are:Eight analog input channels, each accepting oneof the following inputs:•Standard 4 to 20 mA analog sensor signal •Digital HART Frequency Shift Keying (FSK) signal superimposed on a 4 to 20 mA analog input signal.FSK modem dedicated to each input channel forbi-directional digital communications with a HART field deviceAnalog to digital conversion of each of the 4to20mA input signals from the HART devicesSupport for the HART universal commandsnecessary to interface the field device with the I/A Series ® system databaseGalvanic isolation of the group of 8 inputchannels from ground and module logicCompact, rugged design suitable for enclosure inClass G3 (harsh) environmentsHigh accuracy achieved by sigma-delta dataconversions for each channelTermination Assemblies (TAs) for locally orremotely connecting field wiring to the FBM214Termination Assemblies for per channel internallyand/or externally loop powered transmitters.PSS 21H-2Z14 B4 Page 2OVERVIEWThe FBM214 HART Communication Input Interface Module contains eight 4to20mA group isolated analog input channels. The FBM214 supports any mix of standard 4to20mA devices and HART devices.The FBM214 serves as a HART communications field device host, enabling the I/A Series system to request and receive two digital messages per second from the field device. The message pass-through capability can be used to support HART universal, common practice, and device-specific commands, but not the burst communication mode. These commands are implemented using the Intelligent Field Device Configurator (IFDC — refer toPSS 21S-8A3 B3 for details).The FBM214 provides a common isolated power supply to power all eight channels. Optionally, the channels can be powered by an external power supply. However, when a common external power supply is used with two or more channels, a Cable Balun module is required to prevent channel cross talk.COMPACT DESIGNThe FBM214 has a compact design, with a rugged extruded aluminum exterior for physical protection of the circuits. Enclosures specially designed for mounting the FBMs provide various levels of environmental protection, up to harsh environments per ISA Standard S71.04.HIGH ACCURACYFor high accuracy, the module incorporates a Sigma-Delta converter which can provide new analog input values for each channel every 100 milliseconds.VISUAL INDICATORSLight-emitting diodes (LEDs) incorporated into the front of the module provide visual indication of the module’s operational status, and communication activity on the channels.EASY REMOVAL/REPLACEMENTThe module can be removed/replaced without removing field device termination cabling, power, or communications cabling.FIELDBUS COMMUNICATIONA Fieldbus Communication Module or a Control Processor interfaces the redundant 2 Mbps module Fieldbus used by the FBMs. The FBM214 module accepts communication from either path (A or B) of the redundant 2 Mbps fieldbus – should one path fail or be switched at the system level, the module continues communication over the active path.The use of an external power supply common to two or more loops requires a Cable Balun Module to maintain communication signal line balance.MODULAR BASEPLATE MOUNTINGThe module mounts on a modular baseplate which accommodates up to four or eight FBMs. The modular baseplate is either DIN rail mounted or rack mounted, and includes signal connectors for redundant fieldbus, redundant independent dc power, and termination cables.TERMINATION ASSEMBLIESField input signals connect to the FBM subsystem via DIN rail mounted TAs. The TAs used with theFBM214 are described in “TERMINATION ASSEMBLIES AND CABLES” on page8.PSS 21H-2Z14 B4Page 3CABLE BALUN MODULEThe Cable Balun module is used to maintain digital communication line balance for HART Transmitter to FBM loops that are powered from a common external power supply. This powering effectively connects one line of each loop together. Without the Baluns, in each loop so powered, the common connection at the external power supply, would cause near end crosstalk at the system end of the loop wiring cable. Loops using FBM internal power source do not require Baluns.The Cable Balun module contains multiple Baluns. One Balun segment is interconnected in each loop powered from an external power supply per the diagram above. There is one Cable Balun module.Figure 1. Cable Balun Module Cable Balun ModuleModule Model ModulePart No.No. of Balunsin the ModuleCBM-4P0903SV4PSS 21H-2Z14 B4Page 4FUNCTIONAL SPECIFICATIONSField Device ChannelsVERSION SUPPORTEDHART Protocol v6INTERFACE8 group-isolated channelsCOMMUNICATION TO THE DEVICEPoint-to-point, master/slave, asynchronous, half-duplex, at 1200 baud.ERROR CHECKINGParity on each byte, and one CRC check byte.SPEED2 messages per secondFASTEST ALLOWED ECB BLOCK PERIOD500 msecMAXIMUM DISTANCE (FBM214 TO FIELDDEVICE)Meets HART FSK physical layer specificationHCF_SPEC-54, Revision 8.1 [up to 3030 m(10000ft)](1).COMPLIANCE VOLTAGE18 V dc minimum at 20.5 mACURRENT INPUTSSense Resistor61.9 Ω nominalTotal Input Resistance280 Ω minimumAccuracy (Includes Nonlinearity)±0.03% of full scaleTemperature Coefficient50 ppm/ºCResolution15 bitsUpdate Rate100 msIntegration Time500 msCommon Mode Rejection>100 db at 50 or 60 HzNormal Mode Rejection>35 db at 50 or 60 HzMAXIMUM LOOP RESISTANCE280 Ω (not including the field device)(2)LOOP POWER SUPPLY PROTECTIONEach channel is galvanically group isolated,current limited and voltage regulated. All inputsare limited by their design to less than 30 mA. Ifthe current limit circuit shorts out, the current islimited to about 85 mA.FBM INPUT IMPEDANCE280 Ω minimumFBM INTERNAL POWER FOR FIELD DEVICE24 V dc ±10% common power supply for allchannels. Loop load limited to one device perchannel.ISOLATIONThe channels are not galvanically isolated fromeach other, but are galvanically isolated (bothoptical and transformer isolation) as a group from ground and module logic. Inputs use an internal FBM isolated power supply for field power. Themodule withstands, without damage, a potential of 600 V ac applied for one minute between the group-isolated channels and earth (ground).CAUTIONThis does not imply that these channels areintended for permanent connection tovoltages of these levels. Exceeding the limitsfor input voltages, as stated elsewhere in thisspecification, violates electrical safety codesand may expose users to electric shock. Fieldbus CommunicationCommunicates with its associated FCM or FCP via the redundant 2 Mbps module FieldbusHEAT DISSIPATION4 W (maximum)(1)The maximum allowable distance decreases when the loop is operated through an intrinsic safety barrier. The maximum distance ofthe field device from the FBM is a function of compliance voltage, wire gauge and voltage drop at the device.(2)In an intrinsic safety application, if a zener barrier is used between the FBM and the field device, the power supply must be set at24V dc +5%, -1%. There are no specific constraints with the use of galvanic barriers.PSS 21H-2Z14 B4Page 5 FUNCTIONAL SPECIFICATIONS (CONTINUED)Power RequirementsINPUT VOLTAGE RANGE (REDUNDANT)24V dc ±5%CONSUMPTION7 W (maximum)Regulatory ComplianceELECTROMAGNETIC COMPATIBILITY (EMC) European EMC Directive 89/336/EECMeets:EN 50081-2 Emission standardEN 50082-2 Immunity standardEN 61326 Annex A (Industrial Levels) CISPR 11, Industrial Scientific and Medical(ISM) Radio-frequency Equipment -Electromagnetic Disturbance Characteristics- Limits and Methods of MeasurementMeets Class A LimitsIEC 61000-4-2 ESD ImmunityContact 4 kV, air 8 kVIEC 61000-4-3 Radiated Field Immunity10 V/m at 80 to 1000 MHzIEC 61000-4-4 Electrical FastTransient/Burst Immunity2 kV on I/O, dc power and communicationlinesIEC 61000-4-5 Surge Immunity2kV on ac and dc power lines; 1kV on I/Oand communications linesIEC 61000-4-6 Immunity to ConductedDisturbances Induced by Radio frequencyFields10 V (rms) at 150 kHz to 80 MHz on I/O,dc power and communication linesIEC 61000-4-8 Power Frequency MagneticField Immunity30 A/m at 50 and 60 HzPRODUCT SAFETY (FBM AND CABLE BALUN) Underwriters Laboratories (UL) for U.S. andCanadaUL/UL-C listed as suitable for use inUL/UL-C listed Class I, Groups A-D;Division 2; temperature code T4 enclosurebased systems. These modules are also ULand UL-C listed as associated apparatus forsupplying non-incendive communicationcircuits for Class I, Groups A-D hazardouslocations when connected to specifiedI/A Series® processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Wherepower is supplied by the FBM,communications circuits also meet therequirements for Class2 as defined inArticle725 of the National Electrical Code(NFPA No.70) and Section 16 of theCanadian Electrical Code (CSA C22.1).Conditions for use are as specified in theI/A Series DIN Rail Mounted SubsystemUser’s Guide (B0400FA).European Low Voltage Directive 73/23/EECand Explosive Atmospheres (ATEX) directive94/9/ECCENELEC (DEMKO) certified as EEx nA IICT4 for use in CENELEC certified Zone 2enclosure certified as associated apparatusfor supplying non-incendive field circuits forZone 2, Group IIC, potentially explosiveatmospheres when connected to specifiedI/A Series processor modules as describedin the I/A Series DIN Rail MountedSubsystem User’s Guide (B0400FA). Also,see Table1 on page9.Calibration RequirementsCalibration of the module or termination assembly is not required.PSS 21H-2Z14 B4Page 6ENVIRONMENTAL SPECIFICATIONS(3)OperatingTEMPERATUREModule-20 to +70°C (-4 to +158°F)Termination AssemblyPVC-20 to +50°C (-4 to +122°F)PA-20 to +70°C (-4 to +158°F) RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +3,000m (-1,000 to +10,000ft)StorageTEMPERATURE-40 to +70°C (-40 to +158°F)RELATIVE HUMIDITY5 to 95% (noncondensing)ALTITUDE-300 to +12,000m (-1,000 to +40,000ft) ContaminationSuitable for use in Class G3 (Harsh) environments as defined in ISA Standard S71.04, based on exposure testing according to EIA Standard 364-65, Class III. Vibration7.5 m/S2 (0.75 g) from 5 to 500 Hz(3)The environmental limits of this module may be enhanced by the type of enclosure containing the module. Refer to the applicableProduct Specification Sheet (PSS) which describes the specific type of enclosure that is to be used.PSS 21H-2Z14 B4Page 7 PHYSICAL SPECIFICATIONSMountingMODULEFBM214 mounts on a modular baseplate. Thebaseplate can be mounted on a DIN rail(horizontally or vertically), or horizontally on a19-inch rack using a mounting kit. Refer toPSS21H-2W6B4 for details.TERMINATION ASSEMBLYThe TA mounts on a DIN rail and accommodates multiple DIN rail styles including 32mm (1.26in) and 35mm 1.38in).MassMODULE284 g (10 oz) approximateTERMINATION ASSEMBLYCompression181 g (0.40 lb) approximateRing Lug249 g (0.55 lb) approximateDimensions – ModuleHEIGHT102 mm (4 in)114 mm (4.5 in) including mounting lugsWIDTH45 mm (1.75 in)DEPTH104 mm (4.11 in)Dimensions – Termination AssemblySee page10.Part NumbersFBM214 MODULEP0922VTTERMINATION ASSEMBLIESSee “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” on page8. Termination CablesCABLE LENGTHSUp to 30 m (98 ft)CABLE MATERIALSPolyurethane or Hypalon®/XLPTERMINATION CABLE TYPEType 1 – See Table2 on page9.CABLE CONNECTION – TA25-pin male D-subminiatureConstruction – Termination AssemblyMATERIALPolyvinyl Chloride (PVC), compressionPolyamide (PA), compressionPVC, ring lugFAMILY GROUP COLORGreen – communicationTERMINAL BLOCKS3 tiers, 8 positionsField Termination ConnectionsCOMPRESSION-TYPE ACCEPTED WIRINGSIZESSolid/Stranded/AWG0.2 to 4 mm2/0.2 to 2.5 mm2/24 to 12 AWGStranded with Ferrules0.2 to 2.5 mm2 with or without plastic collarRING-LUG TYPE ACCEPTED WIRING SIZES#6 size connectors (0.375 in (9.5 mm))0.5 to 4 mm2/22 AWG to 12 AWGPSS 21H-2Z14 B4Page 8TERMINATION ASSEMBLIES AND CABLESField input signals connect to the FBM subsystem via DIN rail mounted Termination Assemblies, which are electrically passive.TAs for the FBM214 are available in the following forms: Compression screw type using Polyvinyl Chloride(PVC) materialCompression screw type using Polyamide (PA) material Ring lug type using PVC material.See the following “FUNCTIONAL SPECIFICATIONS –TERMINATION ASSEMBLIES” for a list of TAs used with the FBM214.The FBM214 provides sufficient loop resistance to allow use of the HART Hand-Held Terminal, or PC20 Intelligent Field Device Configurator (PSS 2A-1Z3 E).A removable termination cable connects the DIN railmounted TA to the FBM via a field connector on the baseplate in which the FBM is installed. Termination cables are available in the following materials: PolyurethaneHypalon XLP .Termination cables are available in a variety of lengths, up to 30 meters (98feet), allowing the Termination Assembly to be mounted in either theenclosure or in an adjacent enclosure. See Table 2 for a list of termination cables used with the TAs forthe FBM214.FUNCTIONAL SPECIFICATIONS – TERMINATION ASSEMBLIESFBM Type Input SignalTA Part NumberTermination TA Cable TACertification PVC (a)(a)PVC is polyvinyl chloride rated from -20 to +50°C (-4 to +122°F).PA is Polyamide rated from -20 to +70°C (-4 to +158°F).PA (a)Type (b)(b) C = TA with compression terminals; RL = TA with ring lug terminals.Type (c)(c)See Table 2 for cable part numbers and specifications.Type (d)(d)See Table 1 for Termination Assembly certification definitions.FBM2148 input channels, 4 to 20mA analog signal, alone or with HART signal superimposedP0916BX P0926EA P0926TD CRL11, 2PSS 21H-2Z14 B4Page 9Table 1. Certification for Termination AssembliesType Certification (a)(a)All TAs are UL/UL-C listed to comply with applicable ordinary location safety standards for fire and shock hazards. Hazardous locationtypes comply with ATEX directive for II 3 G use. They also comply with the requirements of the European Low Voltage Directive. All listings/certifications require installation and use within the constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA) and the conditions stated in UL and DEMKO reports.Type 1TAs are UL/UL-C listed as suitable for use in Class I; Groups A-D; Division 2 temperature code T4 hazardous locations. They are CENELEC (DEMKO) certified EEx nA IIC T4 for use in Zone 2 potentially explosive atmospheres.Type 2TAs are UL/UL-C listed as associated apparatus for supplying non-incendive field circuits Class I; Groups A-D; Division 2 hazardous locations when connected to specified DIN rail mounted FBMs and field circuits meeting entity parameter constraints specified in DIN Rail Mounted Subsystem User’s Guide (B0400FA). They are also CENELEC (DEMKO) certified as associated apparatus for supplying field circuits for Group IIC, Zone 2 potentially explosive atmospheres. Field circuits are also Class 2 limited energy (60 V dc, 30 V ac, 100 VA or less) if customer-supplied equipment meets Class 2 limits.Table 2. Cables Types and Part NumbersCable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)Cable Lengthm (ft) Type 1P/PVC (a)Type 1H/XLPE (b)0.5 (1.6)P0916DA P0916VA 10.0 (32.8) P0916DE P0916VE 1.0 (3.2) P0916DB P0916VB 15.0 (49.2) P0916DF P0916VF 2.0 (6.6)P0931RM P0931RR 20.0 (65.6) P0916DG P0916VG 3.0 (9.8) P0916DC P0916VC 25.0 (82.0) P0916DH P0916VH 5.0 (16.4)P0916DDP0916VD30.0 (98.4)P0916DJP0916VJ(a)P/PVC is polyurethane outer jacket and semi-rigid PVC primary conductor insulation.(b)H/XLPE is Hypalon outer jacket and XLPE (cross-linked polyethylene) primary conductor insulation.PSS 21H-2Z14 B4Page 10DIMENSIONS – NOMINALRELATED PRODUCT SPECIFICATION SHEETSCompression Termination AssemblyRing Lug Termination Assembly(a) Overall width – for determining DIN rail loading.(b) Height above DIN rail (add to DIN rail height for total).PSS NumberDescriptionPSS 21H-2W1 B3DIN Rail Mounted FBM Subsystem OverviewPSS 21H-2W2 B3DIN Rail Mounted FBM Equipment, Agency CertificationsPSS 21H-2Z14 B4Page 11PSS 21H-2Z14 B4 Page 12IPS Corporate Headquarters 5601 Granite Parkway Suite 1000 Plano, TX 75024United States of AmericaFoxboro Global Client Support Inside U.S.: 1-866-746-6477 Outside U.S.: 1-508-549-2424 or contact your local Foxboro representative.Facsimile: 1-508-549-4999Invensys, Foxboro, I/A Series and the IPS Logo are trademarks of Invensys plc, its subsidiaries, and affiliates. All other brand names may be trademarks of their respective owners.Copyright 2002-2010 Invensys Systems, Inc.All rights reservedMB 21A Printed in U.S.A. 0210。
2SK2645中文资料(fuji)中文数据手册「EasyDatasheet - 矽搜」
FAP-IIS系列
特征
高速开关 低导通电阻 无二次击穿 低驱动电源 高压 V GS =±30V防护证 额定重复性雪崩
2SK2645-01MR
外形图
N沟道MOS-FET
600V
1,2
9A
50W
应用
开关稳压器
UPS DC-DC转换
通用功率放大器
最大额定值和特性
- 绝对最大额定值 （
10
[A] Eas [mJ] I
12
Starting T [°C]
V [V] 本规范如有变更,恕不另行通知！
t [s]
雪崩能力 二极管正向导通电压 反向恢复时间 反向恢复电荷
V GS =0V V DS= V GS Tch=25°C Tch=125°C V DS=0V V GS =10V V DS=25V V DS=25V V GS =0V f=1MHz V CC=300V ID=9A V GS=10V RGS =10 L = 100µH Tch=25°C I F=2xI DR V GS=0V T ch=25°C IF=I DR V GS=0V -dI F/dt=100A/µs T ch=25°C
Unit V A A V A mJ W °C °C
- 电气特性（T
Item
漏源击穿电压 门门限电压 零栅压漏电流 门源漏电流 漏源极导通状态电阻 正向跨 输入电容 输出电容 反向传输电容 导通时间t on (t on =t d(on) +t r ) 关断时间t
off (ton=t d(off)+t f)
Typical Forward Transconductance vs. I
Gate Threshold Voltage vs. T
ARTISAN TECHNOLOGY GROUP PXI-2576 产品说明书
DEVICE SPECIFICATIONSPXI-2576 SpecificationsMulti-Bank MultiplexerThis document lists specifications for the PXI-2576 multiplexer module. All specifications are subject to change without notice. Visit /manuals for the most current specifications. ContentsPXI-2576 Specifications (1)Topology (2)Input Characteristics (2)Dynamic Characteristics (3)Trigger Characteristics (4)Physical Characteristics (4)Environment (5)Shock and Vibration (5)Compliance and Certifications (6)Diagrams (7)Accessories (10)PXI-2576 SpecificationsSpecifications characterize the warranted performance of the instrument under the stated operating conditions. Data in this document are Specifications unless otherwise noted.Typical Specifications are specifications met by the majority of the instrument under the stated operating conditions and are tested at 23 °C ambient temperature. Typical specifications are not warranted.All voltages are specified in DC, AC pk, or a combination unless otherwise specified.Caution The protection provided by the PXI-2576 can be impaired if it is used in amanner not described in this document.TopologyRefer to the NI Switches Help at /manuals for detailed topology information. Topologies Independent2-wire sixteen 4 × 1 multiplexer2-wire octal 8 × 1 multiplexer2-wire quad 16 × 1 multiplexer2-wire dual 32 × 1 multiplexer2-wire 64 × 1 multiplexerInput CharacteristicsCaution This module is rated for Measurement Category I and intended to carrysignal voltages no greater than 100 V. This module can withstand up to 500 Vimpulse voltage. Do not use this module for connection to signals or formeasurements within Categories II, III, or IV.Caution When hazardous voltages (>42.4 Vpk/60 V DC) are present on anychannel, safety low-voltage (≤42.4 Vpk/60 V DC) cannot be connected to any otherchannel.Maximum switching voltageChannel-to-channel100 VChannel-to-ground100 V, Measurement Category I1 AMaximum current (per channel orcommon, switching or carry)Caution The switching power is limited by the maximum switching current andthe maximum voltage.Maximum switching power (per channel)30 W, 37.5 V ANote Switching inductive loads (for example, motors and solenoids) can producehigh voltage transients in excess of the module’s rated voltage. Without additionalprotection, these transients can interfere with module operation and impact relay life.For more information about transient suppression, visit /info and enter theInfo Code relayflyback.Maximum DC path resistance (channel-to-common)Initial<1.1 Ω (0.5 Ω, typical)End-of-life≥2 Ω2| | PXI-2576 SpecificationsPath resistance is a combination of relay contact resistance and trace resistance. Contact resistance typically remains low for the life of a relay. At the end of relay life, the contact resistance may rise rapidly above 1 Ω.Thermal EMF<10 μV, typicalMinimum switch load20 mV/1 mABandwidth50 Ω system4 × 1, 8 × 1 configurations>30 MHz, typical16 × 1 configuration>20 MHz, typical32 × 1 configuration>15 MHz, typical64 × 1 configuration>10 MHz, typical100 Ω system4 × 1, 8 × 1 configurations>60 MHz, typical16 × 1 configuration>40 MHz, typical32 × 1 configuration>20 MHz, typical64 × 1 configuration>10 MHz, typicalBank-to-bank crosstalk (50 Ω or 100 Ω system, 4 × 1 configuration)100 kHz<-75 dB, typical1 MHz<-53 dB, typical10 MHz<-35 dB, typicalOpen-channel isolation (50 Ω or 100 Ω system, 4 × 1 or 8 × 1 configuration) 100 kHz>79 dB, typical1 MHz>52 dB, typical10 MHz>40 dB, typicalDynamic CharacteristicsRelay operate time 2 ms, typical3.4 ms, maximumNote Certain applications may require additional time for proper settling. Refer tothe NI Switches Help at /manuals for more information about includingadditional settling time.Expected relay lifeMechanical 5 × 107 cycles, typicalPXI-2576 Specifications| © National Instruments| 3Electrical (resistive)30 V, 200 mA 2 × 106 cycles, typical30 V, 400 mA 5 × 105 cycles, typical30 V, 1 A 1 × 105 cycles, typical100 V, 100 mA 2 × 106 cycles, typical100 V, 200 mA 2.5 × 105 cycles, typical100 V, 300 mA 1 × 105 cycles, typicalNote Relays are field replaceable. Refer to the NI Switches Help at /manualsfor more information about replacing a failed relay.T rigger CharacteristicsInput triggerSources PXI trigger lines <0...7>Minimum pulse width150 nsNote The PXI-2576 can recognize trigger pulse widths less than 150 ns if youdisable digital filtering. For information about disabling digital filtering, refer to theNI Switches Help at /manuals.Output triggerDestinations PXI trigger lines <0...7>Pulse width Software-selectable: 1 μs to 62 μs Physical CharacteristicsCaution Clean the hardware with a soft, nonmetallic brush. Make sure that thehardware is completely dry and free from contaminants before returning it toservice.Relay type Electromechanical, latchingRelay contact material Silver, gold coveredI/O connector LFH matrix 50, 160 positions, malePXI power requirement 2.5 W at 3.3 V10 W at 5 VDimensions (L × W × H)3U, one slot, PXI/cPCI module,21.6 cm × 2.0 cm × 13.0 cm(8.5 in. × 0.8 in. × 5.1 in.)Weight300 g (12 oz)4| | PXI-2576 SpecificationsEnvironmentMaximum altitude2,000 m (at 25 °C ambient temperature) Pollution Degree2Indoor use only.Operating EnvironmentAmbient temperature range0 °C to 55 °C (Tested in accordance withIEC 60068-2-1 and IEC 60068-2-2.) Relative humidity range10% to 90%, noncondensing (Tested inaccordance with IEC 60068-2-56.) Storage EnvironmentAmbient temperature range-20 °C to 70 °C (Tested in accordancewith IEC 60068-2-1 and IEC 60068-2-2.) Relative humidity range5% to 95%, noncondensing (Tested inaccordance with IEC 60068-2-56.) Shock and VibrationOperational shock30 g peak, half-sine, 11 ms pulse (Tested inaccordance with IEC 60068-2-27. Test profiledeveloped in accordance withMIL-PRF-28800F.)Random vibrationOperating 5 Hz to 500 Hz, 0.31 g rms (Tested inaccordance with IEC 60068-2-64.) Nonoperating 5 Hz to 500 Hz, 2.46 g rms (Tested inaccordance with IEC 60068-2-64. Test profileexceeds the requirements of MIL-PRF-28800F,Class 3.)PXI-2576 Specifications| © National Instruments| 5Compliance and CertificationsSafetyThis product is designed to meet the requirements of the following electrical equipment safety standards for measurement, control, and laboratory use:•IEC 61010-1, EN 61010-1•UL 61010-1, CSA 61010-1Note For UL and other safety certifications, refer to the product label or the OnlineProduct Certification section.Electromagnetic CompatibilityThis product meets the requirements of the following EMC standards for electrical equipment for measurement, control, and laboratory use:•EN 61326-1 (IEC 61326-1): Class A emissions; Basic immunity•EN 55011 (CISPR 11): Group 1, Class A emissions•AS/NZS CISPR 11: Group 1, Class A emissions•FCC 47 CFR Part 15B: Class A emissions•ICES-001: Class A emissionsNote In the United States (per FCC 47 CFR), Class A equipment is intended foruse in commercial, light-industrial, and heavy-industrial locations. In Europe,Canada, Australia, and New Zealand (per CISPR 11), Class A equipment is intendedfor use only in heavy-industrial locations.Note Group 1 equipment (per CISPR 11) is any industrial, scientific, or medicalequipment that does not intentionally generate radio frequency energy for thetreatment of material or inspection/analysis purposes.Note For EMC declarations and certifications, refer to the Online ProductCertification section.CE ComplianceThis product meets the essential requirements of applicable European Directives, as follows:•2014/35/EU; Low-V oltage Directive (safety)•2014/30/EU; Electromagnetic Compatibility Directive (EMC)Online Product CertificationRefer to the product Declaration of Conformity (DoC) for additional regulatory compliance information. To obtain product certifications and the DoC for this product, visit / certification, search by model number or product line, and click the appropriate link in the Certification column.6| | PXI-2576 SpecificationsEnvironmental ManagementNI is committed to designing and manufacturing products in an environmentally responsible manner. NI recognizes that eliminating certain hazardous substances from our products is beneficial to the environment and to NI customers.For additional environmental information, refer to the Minimize Our Environmental Impact web page at /environment. This page contains the environmental regulations and directives with which NI complies, as well as other environmental information not included in this document.Waste Electrical and Electronic Equipment (WEEE)EU Customers At the end of the product life cycle, all NI products must bedisposed of according to local laws and regulations. For more information abouthow to recycle NI products in your region, visit /environment/weee.电子信息产品污染控制管理办法（中国RoHS）中国客户National Instruments符合中国电子信息产品中限制使用某些有害物质指令(RoHS)。
安信可 Ra-01SH 规格书说明书
Ra-01SH规格书版本V1.1版权©2020免责申明和版权公告本文中的信息，包括供参考的URL地址，如有变更，恕不另行通知。
文档“按现状”提供，不负任何担保责任，包括对适销性、适用于特定用途或非侵权性的任何担保，和任何提案、规格或样品在他处提到的任何担保。
本文档不负任何责任，包括使用本文档内信息产生的侵犯任何专利权行为的责任。
本文档在此未以禁止反言或其他方式授予任何知识产权使用许可，不管是明示许可还是暗示许可。
文中所得测试数据均为安信可实验室测试所得，实际结果可能略有差异。
文中提到的所有商标名称、商标和注册商标均属其各自所有者的财产，特此声明。
最终解释权归深圳市安信可科技有限公司所有。
注意由于产品版本升级或其他原因，本手册内容有可能变更。
深圳市安信可科技有限公司保留在没有任何通知或者提示的情况下对本手册的内容进行修改的权利。
本手册仅作为使用指导，深圳市安信可科技有限公司尽全力在本手册中提供准确的信息，但是深圳市安信可科技有限公司并不确保手册内容完全没有错误，本手册中的所有陈述、信息和建议也不构成任何明示或暗示的担保。
文件制定/修订/废止履历表版本日期制定/修订内容制定核准V1.02020.8.12首版徐V1.12020.8.19更新部分参数徐目录一、产品概述 (5)二、电气参数 (7)三、外观尺寸 (9)四、管脚定义 (10)五、原理图 (11)六、设计指导 (12)七、回流焊曲线图 (14)八、包装信息 (15)九、联系我们 (15)一、产品概述安信可LoRa系列模块（Ra-01SH）由安信可科技设计开发。
该模组用于超长距离扩频通信，其射频芯片SX1262主要采用LoRa™远程调制解调器，用于超长距离扩频通信，抗干扰性强，能够最大限度降低电流消耗。
借助SEMTECH的LoRa™专利调制技术，SX1262具有超过-148dBm的高灵敏度，+22dBm的功率输出，传输距离远，可靠性高。
Richtek技术有限公司产品说明书
RT8511B®DS8511B-05 February 20151©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Ordering InformationNote :Richtek products are :❝ RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.❝ Suitable for use in SnPb or Pb-free soldering processes.Marking InformationPin Configurations(TOP VIEW)WDFN-8L 2x243V Asynchronous Boost WLED DriverGeneral DescriptionThe RT8511B is an LED driver IC that can support up to 10 WLED in series. It is composed of a current mode boost converter integrated with a 43V/2.2A power switch running at a fixed 500kHz frequency and covering a wide VIN range from 2.7V to 24V.The white LED current is set with an external resistor, and the feedback voltage is regulated to 200mV (typ.). During operation, the LED current can be controlled by the PWM input signal in which the duty cycle determines the feedback reference voltage.For brightness dimming, the RT8511B is able to maintain steady control of the LED current. Therefore, no audible noises are generated on the output capacitor. The RT8511B also has programmable over voltage pin to prevent the output from exceeding absolute maximum ratings during open LED conditions. The RT8511B is available in WDFN-8L 2x2 package.Features●Wide Input Voltage Range : 2.7V to 24V●High Output Voltage : up to 43V●Direct PWM Dimming Control and Frequency from 100Hz to 8kHz●Internal Soft-Start and Compensation ●200mV Reference Voltage●PWM Dimming with Internal Filter●Programmable Over Voltage Protection ●Over Temperature Protection ●Current Limit Protection ●Thin 8-Lead WDFN Package●RoHS Compliant and Halogen FreeApplications●UMPC and Notebook Computer Backlight ●GPS, Portable DVD BacklightEN PWM VIN LX0F : Product CodeW : Date CodeG : Green (Halogen Free and Pb Free)RT8511BRT8511B2DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Application CircuitFigure 1. Typical Application Circuit of Normal OperationFigure 2. Typical Application Circuit of Low Voltage OperationVSET SETRT8511B3DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Function Block DiagramRT8511B4DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Electrical CharacteristicsRecommended Operating Conditions (Note 4)●Supply Input Voltage, V IN ------------------------------------------------------------------------------------------------2.7V to 24V ●Junction T emperature Range --------------------------------------------------------------------------------------------−40°C to 125°C ●Ambient T emperature Range --------------------------------------------------------------------------------------------−40°C to 85°CAbsolute Maximum Ratings (Note 1)●VIN, EN, PWM, DIMC to GND------------------------------------------------------------------------------------------−0.3V to 26.5V ●FB, OVP to GND ----------------------------------------------------------------------------------------------------------−0.3V to 48V ●LX to GND ------------------------------------------------------------------------------------------------------------------−0.3V to 48V < 500ns ----------------------------------------------------------------------------------------------------------------------−1V to 48V ● Power Dissipation, P D @ T A = 25°CWDFN-8L 2x2--------------------------------------------------------------------------------------------------------------0.833W ●Package Thermal Resistance (Note 2)WDFN-8L 2x2, θJA ---------------------------------------------------------------------------------------------------------120°C/W WDFN-8L 2x2, θJC ---------------------------------------------------------------------------------------------------------8.2°C/W ●Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------------260°C ●Junction T emperature -----------------------------------------------------------------------------------------------------150°C●Storage T emperature Range --------------------------------------------------------------------------------------------–65°C to 150°C ●ESD Susceptibility (Note 3)HBM (Human Body Model)----------------------------------------------------------------------------------------------2kV MM (Machine Model)-----------------------------------------------------------------------------------------------------200VRT8511B5DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These arestress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured at T A = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC ismeasured at the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.RT8511B6DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.LED Current vs. PWM Duty Cycle1020304050600102030405060708090100PWM Duty Cycle (%)L E D C u r r e n t (m A)Typical Operating CharacteristicsFB Reference Voltage vs. Input Voltage198.0198.3198.6198.9199.2199.54812162024Input Voltage (V)F B R e f e r e n c e V o l t a g e (m V)Frequency vs. Input Voltage3504004505005506004812162024Input Voltage (V)F r e q u e n c y (k H z ) Efficiency vs. Input Voltage6065707580859095100479121417192224Input Voltage (V)E f f i c i e n c y (%)FB Reference Voltage vs. Temperature-205305580105Temperature (°C)Current Limit vs. Input Voltage1.01.41.82.22.63.02.55.25810.7513.516.251921.7524.5Input Voltage (V)C u r r e n t L i m i t (A )RT8511B7DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Application InformationThe RT8511B is a current mode boost converter which operates at a fixed frequency of 500kHz. It is capable of driving up to 10 white LEDs in series and integrates functions such as soft-start, compensation, and internal analog dimming control. The protection block also provides over-voltage, over-temperature, and current- limit protection features.LED Current SettingThe loop structure of the boost converter keeps the FB pin voltage equal to the reference voltage V FB . Therefore,by connecting the resistor, R SET between the FB pin and GND, the LED current will be determined by the current through R SET . The LED current can be calculated by the following equation :FBLED SET VI = R Brightness ControlFor the brightness dimming control of the RT8511B, the IC provides typically 200mV reference voltage when the PWM pin is constantly pulled high. However, the PWM pin allows a PWM signal to adjust the reference voltage by changing the PWM duty cycle to achieve LED brightness dimming control. The relationship between the duty cycle and the FB voltage can be calculated according to the following equation :V FB = 200mV x Dutywhere 200mV is the typical internal reference voltage and Duty is the duty cycle of the PWM signal.As shown in Figure 3, the duty cycle of the PWM signal is used to modify the internal 200mV reference voltage.With an on-chip output clamping amplifier and a serial resistor, the PWM dimming signal is easily low-pass filtered to an analog dimming signal with one external capacitor, C DIMC , for noise-free PWM dimming. Dimming frequency can be sufficiently adjusted from 100Hz to 8kHz.However, the LED current cannot be 100% proportional to the duty cycle. Referring to T able 1, the minimum dimming duty can be as low as 1% for the frequency range from 100Hz to 8kHz. It should be noted that the accuracy of 1% duty is not guaranteed.Figure 3. Block Diagram of Programmable FB Voltage Table 1. Minimum Duty for Dimming FrequencyBecause the voltage of DIMC and FB is small to 2mV andeasily affected by LX switching noise.ToControllerThe FB pin voltage will be decreased by lower PWM duty ratio . That will achieve LED current diming function for different brightness. But LED current is more accurate when higher PWM duty. The Table 2. shows typical variation value comparison between different PWM duty and condition is V IN = 3.7V, LED array = 6S2P , R SET =5Ω.Table 2. LED Current Variation vs PWM DutyIt also should be noted that when the input voltage is too close to the output voltage [(V OUT −V IN ) < 6V] , excessive audible noise may occur. Additionally, for accurate brightness dimming control, the input voltage should be kept lower than the LEDs' turn on voltage. When operating in the light load, excessive output ripple may occur.RT8511B8DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Mode2Mode3Figure 4. Power On SequenceMode1Mode3Figure 5. Power Off SequenceV INV OUTENV INV OUTENPWMV INV OUTENPWMV INV V INV OUTENPWMDelayMode1V INV ENSoft-StartThe RT8511B provides a built-in soft-start function to limit the inrush current, while allowing for an increased PWM frequency for dimming.Current Limiting ProtectionThe RT8511B can limit the peak current to achieve over current protection. The IC senses the inductor current through the LX pin in the charging period. When the value exceeds the current limiting threshold, the internal N-MOSFET will be turned off. In the off period, the inductor current will descend. The internal MOSFET is turned on by the oscillator during the beginning of the next cycle.Power SequenceIn order to assure that the normal soft-start function is in place for suppressing the inrush current, the input voltage and enable voltage should be ready before PWM pulls high. Figure 4 and Figure 5 show the power on and power off sequences.RT8511B9DS8511B-05 February 2015©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.OUT, OVP OVP R2V = V 1+R1⎛⎫⨯ ⎪⎝⎭where R1 and R2 make up the voltage divider connected to the OVP pin.Over Temperature ProtectionThe RT8511B has an Over T emperature Protection (OTP)function to prevent overheating caused by excessive power dissipation from overheating the device. The OTP will shut down switching operation if the junction temperature exceeds 160°C. The boost converter will start switching again when the junction temperature is cooled down by approximately 30°C.Inductor SelectionThe inductance depends on the maximum input current.As a general rule, the inductor ripple current range is 20%to 40% of the maximum input current. If 40% is selected as an example, the inductor ripple current can be calculated according to the following equation :OUT OUTIN(MAX)(MIN)IN(MIN)RIPPLE IN(MAX)V I I =V I = 0.4I η⨯⨯⨯where η is the efficiency of the boost converter, I IN(MAX) is the maximum input current, I OUT is the total current from all LED strings, and I RIPPLE is the inductor ripple current.The input peak current can be calculated by maximum input current plus half of inductor ripple current shown as following equation :I PEAK = 1.2 x I IN(MAX)Note that the saturated current of the inductor must be greater than I PEAK . The inductance can eventually be determined according to the following equation :Over Voltage ProtectionThe RT8511B equips Over Voltage Protection (OVP)function. When the voltage at the OVP pin reaches a threshold of approximately 1.2V , the MOSFET drive output will turn off. The MOSFET drive output will turn on again once the voltage at the OVP pin drops below the threshold.Thus, the output voltage can be clamped at a certain voltage level, as shown in the following equation :()())2IN OUT IN 2OUT OUT OSCV (V V L =0.4V I f η⨯⨯-⨯⨯⨯where f OSC is the switching frequency. For better efficiency,it is suggested to choose an inductor with small series resistance.Diode SelectionThe Schottky diode is a good choice for an asynchronous boost converter due to its small forward voltage. However,when selecting a Schottky diode, important parameters such as power dissipation, reverse voltage rating, and pulsating peak current must all be taken into consideration. A suitable Schottky diode's reverse voltage rating must be greater than the maximum output voltage,and its average current rating must exceed the average output current.Capacitor SelectionTwo 1μF ceramic input capacitors and two 1μF ceramic output capacitors are recommended for driving 10 WLEDs in series. For better voltage filtering, ceramic capacitors with low ESR are recommended. Note that the X5R and X7R types are suitable because of their wide voltage and temperature ranges.Thermal ConsiderationsFor continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula :P D(MAX) = (T J(MAX) − T A ) / θJAwhere T J(MAX) is the maximum junction temperature, T A is the ambient temperature, and θJA is the junction to ambient thermal resistance.For recommended operating condition specifications, the maximum junction temperature is 125°C. The junction to ambient thermal resistance, θJA , is layout dependent. For WDFN-8L 2x2 package, the thermal resistance, θJA , is 120°C/W on a standard JEDEC 51-7 four-layer thermal test board. The maximum power dissipation at T A = 25°C can be calculated by the following formulas :RT8511B10DS8511B-05 February 2015 ©Copyright 2015 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Figure 7. PCB Layout GuideLayout ConsiderationFor high frequency switching power supplies, the PCBlayout is important to obtain good regulation, high efficiency and stability. The following descriptions are the suggestions for better PCB layout.❝Input and output capacitors should be placed close to the IC and connected to the ground plane to reduce noise coupling.❝The GND and Exposed Pad should be connected to a strong ground plane for heat sinking and noise protection.❝The components L, D, C IN and C OUT must be placed as close as possible to reduce current loop. Keep the main current traces as possible as short and wide.❝The LX node of the DC/DC converter experiences is with high frequency voltage swings. It should be kept in a small area.❝The component R SET should be placed as close as possible to the IC and kept away from noisy devices.Figure 6. Derating Curve of Maximum Power DissipationP D(MAX) = (125°C − 25°C) / (120°C/W) = 0.833W for WDFN-8L 2X2 packageThe maximum power dissipation depends on operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA . The derating curves in Figure 6 allow the designer to see the effect of rising ambient temperature on the maximum power dissipation.0.00.20.40.60.81.0255075100125Ambient Temperature (°C)M a x i m u m P o w e r D i s s i p a t i o n (W )IN as closed as possible to V I N pin for good filtering.directly from the output schottky diode to ground rather than across the WLEDs.The inductor should be placed as close as possible to theswitch pin to minimize the noise coupling into other circuits.LX node copper area should be minimized for reducing EMILocate R SET closeW-Type 8L DFN 2x2 PackageRichtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.DS8511B-05 February 11。
QS6J11TR;中文规格书,Datasheet资料
Data Sheet
Unit Max. ns pF
lGate Charge characteristics (Ta = 25°C) <It is the same characteristics for the Tr1 and Tr2> Values Parameter Symbol Conditions Min. Total gate charge Gate - Source charge Gate - Drain charge Qg *5 Qgs *5 Qgd *5 VDD ⋍ -6V, ID = -2A VGS = -4.5V VDD ⋍ -6V, ID = -2A VGS = -4.5V Typ. 6.5 1.3 0.8 Max. nC Unit
lInner circuit
2) Built-in G-S Protection Diode. 3) Small Surface Mount Package (TSMT6). 4) Pb-free lead plating ; RoHS compliant
(1) Tr1 Gate (2) Tr2 Source (3) Tr2 Gate
lBody diode electrical characteristics (Source-Drain)(Ta = 25°C) <It is the same characteristics for the Tr1 and Tr2> Values Parameter Symbol Conditions Min. Inverse diode continuous, forward current Forward voltage IS *1 VSD *5 Ta = 25°C VGS = 0V, Is = -2A Typ. Max. -0.75 -1.2 A V Unit
SSL1523PN2,112;SSL1522TN2,518;中文规格书,Datasheet资料
SSL152xSMPS ICs for mains LED driversRev. 3 — 17 September 2010Product data sheet1. General descriptionThe SSL152x family is a Switched Mode Power Supply (SMPS) controller IC that operatedirectly from the rectified universal AC mains. It is implemented in the high-voltage EasyHigh Voltage Silicon-On-Insulator (EZ-HV SOI) process, combined with a low-voltageBipolar Complementary Metal Oxide Semiconductor (BiCMOS) process. The deviceincludes a high-voltage power switch and a start-up circuit that operates directly from therectified mains voltage.A dedicated circuit for valley switching is built in, which makes a very efficient slim-lineelectronic concept for solid state lighting applications possible.The SSL152x family can operate in applications with a power range of up to 15 W.Applications in the range between 15 W and 25 W are more suited to the SSL1623PH.LED powers above 25W are more suited to the SSL1750.In the most basic applications, the SSL152x family act as a voltage source. Here, noadditional secondary electronics are required. A combined voltage and current source canbe realized with minimum costs for external components. Implementation of the SSL152xfamily renders an efficient and low cost power supply system for mains LED drivers. 2. Features and benefitsDesigned for mains LED drivers up to 15WIntegrated power switch:SSL1522T: 12Ω; 650VSSL1523P: 6.5 Ω; 650VOperates from universal AC mains supplies (80V to 276V)Adjustable frequency for flexible designRC oscillator for load insensitive regulation loop constantValley switching for minimum switch-on lossLow standby power (<100mW) with frequency reduction at low power outputsAdjustable overcurrent protectionUndervoltage protectionTemperature protectionShort-circuit winding protectionSimple application with both primary and secondary (opto) feedbackAvailable in DIP8 and SO14 packages3. ApplicationsRetro-fit LED lamps LED ballasts Contour lightingChannel letter lightingCommercial lighting, such as cabinet or freezer lightsOther lighting applications4. Quick reference data5.Ordering informationTable 1.Quick reference data Symbol ParameterConditionsMin Typ Max Unit V DRAIN voltage on pin DRAIN DMOS power transistor; T j >0°C −0.4-+650VR DSondrain-source on-state resistanceSSL1522T; I source =−0.25A T j =25°C -1213.8ΩT j =100°C-1719.6ΩSSL1523P; I source =−0.50A T j =25°C - 6.57.5ΩT j =100°C-9.010.0ΩV CC supply voltage continuous−0.4-+40V f osc oscillator frequency 10100200kHzI DRAINcurrent on pin DRAINV DRAIN >60V no auxiliary supply - 1.52mA with auxiliary supply-30125μATable 2.Ordering informationType numberPackage NameDescriptionVersion SSL1523P DIP8plastic dual in-line package; 8 leads (300 mil)SOT97-1SSL1522TSO14plastic small outline package; 14 leads; body width 3.9 mmSOT108-16. Block diagram7. Pinning information7.1Pinning7.2Pin descriptionTable 3.Pin descriptionSymbol Pin DescriptionDIP8SO14V CC11supply voltageGND22groundGND-3groundGND-4groundGND-5groundRC36frequency settingREG47regulation inputAUX58input for voltage from auxiliary winding for timing(demagnetization)GND-9groundGND-10groundSOURCE611source of internal MOS switchn.c.712not connectedn.c.-13not connectedDRAIN814drain of internal MOS switch; input for start-up current andvalley sensing8. Functional descriptionThe SSL152x family is the heart of a compact flyback converter, with the IC placed at theprimary side. The auxiliary winding of the transformer can be used for indirect feedback tocontrol the isolated output. This additional winding also powers the IC. A more accuratecontrol of the output voltage and/or current can be implemented with an additionalsecondary sensing circuit and optocoupler feedback.The SSL152x family uses voltage mode control. The switching frequency is determined bythe maximum transformer demagnetizing time and the frequency of the oscillator. In thefirst case, the converter operates in the Self Oscillating Power Supply (SOPS) mode. Inthe latter case, it operates at a constant frequency, which can be adjusted with externalcomponents R RC and C RC. Furthermore, a primary stroke is started only in a valley of thesecondary ringing. This can use constant power or constant current mode to drive LEDs.The valley switching principle minimizes capacitive switch-on losses.8.1Start-up and undervoltage lockoutInitially, the IC is self-supplying from the rectified mains voltage. The IC starts switching assoon as the voltage on pin V CC passes the V CC(startup) level. The supply is taken over bythe auxiliary winding of the transformer as soon as V CC is high enough and the supplyfrom the line is stopped for high efficiency operation.If the auxiliary supply is not sufficient, the high-voltage supply also supplies the IC. Assoon as the voltage on pin V CC drops below the V CC(stop) level, the IC stops switching andrestarts from the rectified mains voltage.8.2OscillatorThe frequency of the oscillator is set by the external resistor and capacitor on pin RC. Theexternal capacitor is charged rapidly to the V RC(max) level and, starting from a new primarystroke, it discharges to the V RC(min) level. Because the discharge is exponential, therelative sensitivity of the duty factor to the regulation voltage at low duty factor is almostequal to the sensitivity at high duty factors. This results in a more constant gain over theduty factor range compared to systems with a linear sawtooth oscillator. Stable operationat low duty factors is easily realized. For high efficiency, the frequency is reduced as soonas the duty factor drops below its low power threshold. This is accomplished by increasingthe oscillator charge time.To ensure that the capacitor can be charged within the charge time, the value of theoscillator capacitor should be limited to approximately 1nF.8.3Duty factor controlThe duty factor is controlled by the internal regulation voltage and the oscillator signal onpin RC. The internal regulation voltage is equal to the external regulation voltage (minus2.5V) multiplied by the gain of the error amplifier (typically 20dB).8.4Valley switchingA new cycle is started when the primary switch is switched on (see Figure 4). After acertain time (determined by the oscillator voltage RC and the internal regulation level), the switch is turned off and the secondary stroke starts. The internal regulation level is determined by the voltage on pin REG.After the secondary stroke, the drain voltage shows an oscillation with a frequency approximately equal to the value given by Equation 1:(1)where:L p = primary self-inductanceC p = parasitic capacitance on drain nodeAs soon as the oscillator voltage becomes high again and after the secondary stroke has ended, the circuit waits for a low drain voltage before starting a new primary stroke.Figure 4 shows the drain voltage together with the valley signal, the signal indicating the secondary stroke and the RC voltage.The primary stroke starts some time before the actual valley at low ringing frequencies, and some time after the actual valley at high ringing frequencies.12π×L p C p ×()×---------------------------------------------Figure5 shows a typical curve for a reflected output voltage N×V o of 80V. This voltage is the output voltage V o (see Figure6) transferred to the primary side of the transformer with the factor N (determined by the turns ratio of the transformer). Figure5 shows that the system switches at the minimum drain voltage for ringing frequencies of 480kHz, thus reducing the switch-on losses to a minimum. At 200kHz, the next primary stroke is started at 33 ° before the valley. The switch-on losses are still reduced significantly.8.5DemagnetizationThe system operates in discontinuous conduction mode all the time. As long as thesecondary stroke has not ended, the oscillator will not start a new primary stroke. During the first t sup(xfmr_ring) seconds, demagnetization recognition is suppressed. Thissuppression may be necessary in applications where the transformer has a large leakage inductance and at low output voltages.8.6Minimum and maximum duty factorThe minimum duty factor of the switched mode power supply is 0%. The maximum duty factor is set to 75% (typical value at 100kHz oscillation frequency).8.7OverCurrent Protection (OCP)The cycle-by-cycle peak drain current limit circuit uses the external source resistor R I to measure the current. The circuit is activated after the leading edge blanking time t leb. The protection circuit limits the source voltage to V SOURCE(max) and thus limits the primary peak current.8.8Short-circuit winding protectionThe short-circuit winding protection circuit is also activated after the leading edge blanking time. If the source voltage exceeds the short-circuit winding protection voltage V swp, the IC stops switching. Only a power-on reset will restart normal operation. The short-circuitwinding protection also protects in case of a secondary diode short-circuit.8.9OverTemperature Protection (OTP)An accurate temperature protection is provided in the device. When the junctiontemperature exceeds the thermal shutdown temperature, the IC stops switching. Duringthermal protection, the IC current is lowered to the start-up current. The IC continuesnormal operation as soon as the overtemperature situation has disappeared.8.10OverVoltage Protection (OVP)Overvoltage protection can be achieved in the application by pulling pin REG above itsnormal operation level. The current primary stroke is terminated immediately. No newprimary stroke is started until the voltage on pin REG drops to its normal operation level.Pin REG has an internal clamp. The current feed into this pin must be limited.8.11Characteristics of complete LED power supply8.11.1InputThe input voltage range comprises the universal AC mains from 80 V to 276 V.8.11.2AccuracyThe accuracy of the complete converter, functioning as a voltage source with primarysensing, is approximately 8 % (mainly dependent on the transformer coupling). Theaccuracy with secondary sensing is defined by the accuracy of the external components.For safety requirements in case of optocoupler feedback loss, the primary sensingremains active when an overvoltage circuit is connected.8.11.3EfficiencyAn efficiency over 80 % at maximum output power can be achieved for a completeconverter designed for universal mains.8.11.4RippleA minimum ripple is obtained in a system designed for a maximum duty factor of 50%under normal operating conditions and a minimized dead time. The magnitude of theripple in the output voltage is determined by the frequency and duty factor of theconverter, the output current level, and the value and Equivalent Series Resistance (ESR) of the output capacitor.8.11.5OutputThe SSL152x family can operate over a wide range of output power levels up to 15Wdetermined by the value of RDson.9. Limiting values[1]Human body model: equivalent to discharging a 100pF capacitor through a 1.5k Ω series resistor. All pins are 2500V maximum, except pin DRAIN, which is 1000V maximum.[2]Machine model: equivalent to discharging a 200pF capacitor through a 0.75μH coil and a 10Ω series resistor.10. Thermal characteristics[1]Thermal resistance R th(j-a) can be lower when the GND pins are connected to sufficient copper area on the printed-circuit board. See the SSL152x application notes for details.Table 4.Limiting valuesIn accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground; positive currents flow into the device; pins V CC and RC are not allowed to be current driven and pins REG and AUX are not allowed to be voltage driven.Symbol Parameter Conditions Min Max Unit Voltage V CC supply voltage continuous −0.4+40V V RC voltage on pin RC oscillator input voltage −0.4+3V V SOURCE voltage on pin SOURCE DMOS power transistor−0.4+5V V DRAIN voltage on pin DRAINDMOS powertransistor; T j >0°C−0.4+650VCurrent I REG current on pin REG -6mA I AUX current on pin AUX −10+5mA I source source current SSL1522T −1+1A SSL1523P −2+2A I DRAIN current on pin DRAINSSL1522T −1+1A SSL1523P−2+2AGeneral P tottotal power dissipationDIP8 package; T amb <45°C - 1.0W SO14 package; T amb <50°C- 1.0W T stg storage temperature −55+150°C T j junction temperature−40+145°C V ESDelectrostatic discharge voltagehuman body model [1]-±2500V machine model[2]-±200VTable 5.Thermal characteristics Symbol ParameterConditionsTyp Unit R th(j-a)thermal resistance from junction to ambient in free air[1]--DIP8 package 100K/W SO14 package91K/W11. CharacteristicsTable 6.CharacteristicsMeasurement data valid at T amb=25°C; no overtemperature; all voltages are measured with respect to ground; currents are positive when flowing into the IC; unless otherwise specified.Symbol Parameter Conditions Min Typ Max Unit SupplyI CC(oper)operating supply current normal operation- 1.3 1.9mAI CC(startup)start-up supply current start-up-180400μAI CC supply current V DRAIN>60V−6−4−3mAV CC(startup)start-up supply voltage 99.510VV CC(stop)stop supply voltage undervoltage lockout7.07.58.0VI DRAIN current on pin DRAIN V DRAIN>60Vno auxiliary supply- 1.52mAwith auxiliary supply-30125μA Pulse-width modulatorδmin minimum duty factor-0-%δmax maximum duty cycle f=100kHz-75-% SOPSV det(demag)demagnetization detection voltage50100150mV1.0 1.52.0μst sup(xfmr_ring)transformer ringing suppressiontimeRC oscillatorV RC(min)minimum voltage on pin RC607590mVV RC(max)maximum voltage on pin RC 2.4 2.5 2.6Vt ch charge time-1-μsf osc oscillator frequency10100200kHz Duty factor regulator: pin REGV REG voltage on pin REG 2.4 2.5 2.6VG v voltage gain-20-dBV clamp(REG)clamp voltage on pin REG I REG=6mA--7.5V Valley switching−102-+102V/μs (ΔV/Δt)vrec valley recognition voltage changewith timef ring ringing frequency N×V o=100V200550800kHzt d(vrec-swon)valley recognition to switch-on-150-ns delay timeCurrent and short-circuit winding protectionV SOURCE(max)maximum voltage on pin SOURCE ΔV/Δt=0.1V/μs0.470.500.53Vt d delay timeΔV/Δt=0.5V/μs-160185nsV swp short-winding protection voltageΔV/Δt=0.5V/μs0.70.750.8Vt leb leading edge blanking time250350450nsFET output stageI L(DRAIN)leakage current on pin DRAIN V DRAIN=650V--125μA分销商库存信息:NXPSSL1523P/N2,112SSL1522T/N2,518。
FPGA可编程逻辑器件芯片XCVU13P-2FLGA2577I中文规格书
Chapter2 Board Setup and ConfigurationBoard Component LocationFigure2-1 shows the KCU1500 board component locations. Each numbered componentshown in the figure is keyed to Table2-1. Table2-1 identifies the components, references the respective schematic page numbers, and links to a detailed functional description of the components and board features in Chapter3.Electrostatic Discharge Cautionreplacing components.To prevent ESD damage:•Use an ESD wrist or ankle strap and ensure that it makes skin contact. Connect the equipment end of the strap to an unpainted metal surface on the chassis.•Avoid touching the adapter against your clothing. The wrist strap protects components from ESD on the body only.•Handle the adapter by its bracket or edges only. Avoid touching the printed circuit board or the connectors.•Put the adapter down only on an antistatic surface such as the bag supplied in your kit.•If you are returning the adapter to Xilinx Product Support, place it back in its antistatic bag immediately.USB JTAG Interface[Figure2-1, callout 7, 8]The KCU1500 board XCKU115 FPGA is the only component on the JTAG chain. JTAGconfiguration is available through a 2mm JTAG header (J2), providing access by Xilinx® download cables, such as the Platform Cable USB II and the Parallel Cable IV. JTAGconfiguration is allowed at any time regardless of the FPGA mode pin settings. JTAGinitiated configuration takes priority over the configuration method selected through the FPGA mode pin M2 wired to DIP SW5 pin 7.Alternate JTAG programming is available via the USB-to-JTAG bridge function provided by the FT2232H device (U65), in which a host computer accesses the KCU1500 board JTAGchain through a type-A (host side) to micro-B (KCU1500 board side J34) USB cable.For more details about the FT2232H device, see the Future Technology DevicesInternational Ltd. website [Ref10].Clock Generation[Figure2-1, callout 9, 10]The KCU1500 board provides eight clock sources to the XCKU115 device as listed inTable3-2.Table 3-2:KCU1500 Board Clock SourcesClock Name Clock Ref.Des. DescriptionSystem clock 300 MHz U47 (CLK0) Silicon Labs Si5335A 1.8V LVDS any frequency quad clock generator CLK0. See System Clock, QSFP0 Clock, and EMCCLK (SYSCLK_300_P/N).QSFP0 clock 156.25 MHz U47 (CLK1)Silicon Labs Si5335A 1.8V LVDS any frequency quad clock generator CLK1. See System Clock, QSFP0 Clock, and EMCCLK (QSFP0_CLOCK_P/N).EMC clock 90 MHz U47 (CLK2)Silicon Labs Si5335A 1.8V LVCMOS single-ended any frequency quad clock generator CLK2. See System Clock, QSFP0 Clock, and EMCCLK (FPGA_EMCCLK).QSFP1 clock 156.25 MHz U48 (CLK1)Silicon Labs Si5335A 1.8V LVDS any frequency quad clockgenerator CLK1. See QSFP1 Clock (QSFP1_CLOCK_P/N).User MGT clock 10 MHz–810 MHz U40Silicon Labs Si570 3.3V LVDS I2C programmable oscillator, 156.250MHz default. (USER_SI570_CLOCK_P/N andUSER_MGT_SI570_CLOCK[1:0]_P/N). See Programmable MGT and User Clock.PEX_REFCLK (PCIe® input)CN1/U55PCIe edge connector. CN1 input clock 100MHz to SI53322U55 1-to-2 clock buffer (PEX_REFCLK_225/226_P/N).System Clock, QSFP0 Clock, and EMCCLK[Figure2-1, callout 9]The system clock source is a Silicon Labs SI5335A quad clock generator/buffer (U47).The KCU1500 board uses power regulators and PMBus compliant point of load (POL)controllers from Maxim Integrated Circuits to supply the core and auxiliary voltages listed in Table 3-5.Documentation describing PMBus programming for the Maxim InTune™ power controllers is available at the Maxim website [Ref 16]. The PCB layout and power system design meet the recommended criteria described in the UltraScale Architecture PCB Design User Guide (UG583) [Ref 4].Table 3-5:Onboard Power System DevicesRail NamePower System RegulatorsU18 CurrentSense SYSMON Multiplexer PortSchematic Page NumberRef. Des.Device Type Vout (V)Max. I (A)Addr.Bin. Addr.PortVCCINT_FPGA U20MAX153010.95300x0A NA NA 22VCC1V8_FPGA U21MAX15301 1.80100x14001S223VCC1V2_FPGA U25MAX15301 1.20100x12100S524MGTAVCC_FPGA U28MAX207510.95300x72NA NA 25MGTAVTT_FPGA U37MAX20751 1.20300x73111S827Non-PMBus RegulatorsSYS_5V0U34MAX17502 5.001NA NA NA 26SYS_2V5U27MAX15027 2.501NA NA NA 26MGTVCCAUX U30MAX8869E 1.811NA NA NA 26DDR4_C0_VTT U117TPS512000.603NA NA NA 26DDR4_C1_VTT U32TPS512000.603NA NA NA 26DDR4_C2_VTT U118TPS512000.603NA NA NA 26DDR4_C3_VTTU35TPS512000.603NANANA26。
埃 significance 莱特 171172 电源保护设备指南说明书
Eaton 171172Eaton Moeller series xEffect - FRCmM-125 Type A RCCB.Residual current circuit breaker (RCCB), 125A, 2p, 300mA, type S/AGeneral specificationsEaton Moeller series xEffect - FRCmM-125 Type A RCCB17117285 mm75.5 mm 36 mm 0.28 kg RoHS conform IEC/EN 610084015081676613FRCMM-125/2/03-S/AProduct NameCatalog Number Product Length/Depth Product Height Product Width Product Weight Compliances Certifications EANModel CodeTwo-pole50 ms delayed, selective switch off Selective switch off125 A10 kA with back-up fuse300 mAPulse-current sensitive5 kA (8/20 μs) surge-proof 240 V AC240 V440 V4 kV0.3 A0.3 A50 Hz125 A (max. admissible back-up fuse) A1250 A80 A gG/gL10 kA5 kA184 V AC - 250 V AC24000 operationsApplicationNumber of polesTripping timeAmperage RatingRated short-circuit strength Fault current rating Sensitivity typeImpulse withstand current Type Voltage rating (IEC/EN 60947-2)Rated operational voltage (Ue) - maxRated insulation voltage (Ui)Rated impulse withstand voltage (Uimp) Rated fault current - minRated fault current - maxFrequency ratingShort-circuit ratingLeakage current typeRated residual making and breaking capacity Admissible back-up fuse overload - max Rated short-time withstand current (Icw) Surge current capacityTest circuit rangePollution degreeLifespan, electricalSwitchgear for industrial and advanced commercial applicationsxEffect - Switchgear for industrial and advanced commercial applicationsFRCmM-125Residual current circuit breakersType S/A45 mm235 mm (2 SU)70.5 mmQuick attachment for DIN-rail EN 50022DIN railAs requiredIP20, IP40 with suitable enclosureIP20Toggle-center postitionTwin-purpose terminals1.5 mm² - 16 mm² (2x)1.5 mm² - 50 mm²1.5 mm²50 mm²1.5 mm² - 5 mm²1.5 mm² - 16 mm² (2x)1.5 mm²16 mm²Finger and hand touch safe, DGUV VS3, EN 50274 Red / green 125 A0 W18 W0 W0 W-25 °C60 °CMeets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to beFrameWidth in number of modular spacingsBuilt-in width (number of units)Built-in depthMounting MethodMounting positionDegree of protectionStatus indicationTerminals (top and bottom)Terminal capacity (solid wire)Connectable conductor cross section (solid-core) - min Connectable conductor cross section (solid-core) - max Terminal capacity (stranded cable)Connectable conductor cross section (multi-wired) - min Connectable conductor cross section (multi-wired) - max Terminal protectionContact position indicator color Rated operational current for specified heat dissipation (In) Heat dissipation per pole, current-dependentEquipment heat dissipation, current-dependentStatic heat dissipation, non-current-dependentHeat dissipation capacityAmbient operating temperature - minAmbient operating temperature - max10.2.2 Corrosion resistance10.2.3.1 Verification of thermal stability of enclosures10.2.3.2 Verification of resistance of insulating materials to normal heat10.2.3.3 Resist. of insul. mat. to abnormal heat/fire by internal elect. effects10.2.4 Resistance to ultra-violet (UV) radiation10.2.5 Lifting10.2.6 Mechanical impact10.2.7 Inscriptions10.3 Degree of protection of assemblies0.8 mm - 2 mm 10000 operations-25 °C60 °C25-55 °C / 90-95% relative humidity according to IEC 60068-2evaluated.Meets the product standard's requirements.Does not apply, since the entire switchgear needs to be evaluated.Does not apply, since the entire switchgear needs to be evaluated.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.Is the panel builder's responsibility.The panel builder is responsible for the temperature rise calculation. Eaton will provide heat dissipation data for the devices.Is the panel builder's responsibility. The specifications for the switchgear must be observed.Is the panel builder's responsibility. The specifications for the switchgear must be observed.The device meets the requirements, provided the information in the instruction leaflet (IL) is observed.Additional equipment possible Selective protectionResidual current circuit breakereaton-rcd-application-guide-br019003en-en-us.pdf eaton-xeffect-frcmm-125-rccb-catalog-ca003020en-en-us.pdfBusbar material thickness Lifespan, mechanical Permitted storage and transport temperature - min Permitted storage and transport temperature - max Climatic proofing10.4 Clearances and creepage distances 10.5 Protection against electric shock10.6 Incorporation of switching devices and components 10.7 Internal electrical circuits and connections 10.8 Connections for external conductors 10.9.2 Power-frequency electric strength 10.9.3 Impulse withstand voltage 10.9.4 Testing of enclosures made of insulating material 10.10 Temperature rise10.11 Short-circuit rating10.12 Electromagnetic compatibility10.13 Mechanical functionFeaturesApplication notesCataloguesEaton Corporation plc Eaton House30 Pembroke Road Dublin 4, Ireland © 2023 Eaton. All rights reserved. Eaton is a registered trademark.All other trademarks areproperty of their respectiveowners./socialmediaInterlocking deviceResidual current circuit breakers FRCmM-125Type S/A eaton-xeffect-industrial-switchgear-range-catalog-ca003002en-en-us.pdf DA-DC-03_FRCmMas_frcmmeaton-frcm-dimensions.jpgIL019140ZUdfs_2.dwgdfs_2.stpeaton-xeffect-frcmm-125-rccb-wiring-diagram-002.jpgFitted with:Special features Used with Certification reports DrawingsInstallation instructions mCAD modelWiring diagramsCurrent test marks as per inscriptionMaximum operating temperature is 60 °C: Starting at 40 °C, the max. permissible continuous current decreases by 2.2% for every 1 °C。
Rittal 3685268 子架、单元组件、水平轨道 500 类目：电子包装 B 3.5说明书
3685268Subracks, individual componentsHorizontal rails500Rittal Catalogue 31/Electronic packaging3.5S u b r a c k s , i n d i v i d u a l c o m p o n e n t sDouble front horizontal rail, with 10 mm extension (B1)To accommodate guide rails and for the attach-ment of front panels.●Front projection and pitch pattern of holesbased on IEEE 1101.10 and IEC 60 297-5-101, for use of type IV and VII injector/extractor handles●HP pitch patterns of holes for the precise installation of guide rails ●M4 thread on end face ●Straight-through core hole Material:Extruded aluminium section Surface finish:Clear-chromatedAlso required:Assembly screws M4 x 12,packs of 100, Model No. RP 3654.300,see page 576.Usable width (HP)Packs ofModel No. RP 8413687.724Rear horizontal rail (C1)To accommodate guide rails and for the attach-ment of Z rails, insulating strips or conductive strips and backplanes.●Tapped holes M2.5 on a 1 HP pitch pattern ●HP pitch patterns of holes for the preciseinstallation of guide rails in the HP pitch pattern ●M2.5 thread for the installation of Z-rails, or backplanes.●M4 thread on end face ●Straight-through core hole●Horizontal rail 192 HP without machining on the end faces. Suitable for cutting to length Material:Extruded aluminium section Surface finish:Clear-chromated or anodisedAlso required:Assembly screws M4 x 12,packs of 100, Model No. RP 3654.300,see page 576.Usable width (HP)Packs ofModel No. RP 2113685.9914013684.9624213684.5706313684.5718413684.5728423685.2681)19213688.0022)1) Including 4 assembly screws2) AnodisedRear horizontal rail, reinforced version (C2)For use with high loads.Material:Extruded aluminium section Surface finish:Clear-chromatedAlso required:Assembly screws M4 x 12,packs of 100, Model No. RP 3654.300, see page 576.Accessories:Threaded inserts,see page 504.Usable width (HP)Packs ofModel No. RP 4213687.6046313687.6058413687.6063685268。