您的位置：360文档中心› EMKA 2018 World Cup

EMKA 2018 World Cup

合集下载

Analytical Procedures and Methods Validation

Analytical Procedures and Methods Validation

Guidance for IndustryAnalytical Procedures andMethods Validation Chemistry, Manufacturing, and Controls DocumentationDRAFT GUIDANCEThis guidance document is being distributed for comment purposes only.Comments and suggestions regarding this draft document should be submitted within 90 days of publication in the Federal Register of the notice announcing the availability of the draft guidance. Submit comments to Dockets Management Branch (HFA-305), Food and Drug Administration, 5630 Fishers Lane, rm. 1061, Rockville, MD 20852. All comments should be identified with the docket number listed in the notice of availability that publishes in the Federal Register.For questions on the contents of this draft document contact (CDER) Radhika Rajagopalan, 301-827-5849 or (CBER) Alfred Del Grosso, 301-435-4988.U.S. Department of Health and Human ServicesFood and Drug AdministrationCenter for Drug Evaluation and Research (CDER)Center for Biologics Evaluation and Research (CBER)August 2000CMC #Guidance for Industry Analytical Procedures andMethods Validation Chemistry, Manufacturing, and Controls DocumentationAdditional copies are available from:Office of Training and CommunicationsDivision of Communications ManagementDrug Information Branch, HFD-210Center for Drug Evaluation and Research (CDER)5600 Fishers LaneRockville, Maryland 20857(Tel) 301-827-4573(Internet) /cder/guidance/index.htmorOffice of CommunicationsTraining and Manufacturers Assistance, HFM-40Center for Biologics Evaluation and Research (CBER)1401 Rockville PikeRockville, Maryland 20852-1448(Fax) 888-CBERFAX or 301-827-3844(Voice Information) 800-835-4709 or 301-827-1800(Internet) /cber/guidelines.htmU.S. Department of Health and Human ServicesFood and Drug AdministrationCenter for Drug Evaluation and Research (CDER)Center for Biologics Evaluation and Research (CBER)August 2000CMC #Table of ContentsI.INTRODUCTION (1)II.BACKGROUND (2)III.TYPES OF ANALYTICAL PROCEDURES (3)A.R EGULATORY A NALYTICAL P ROCEDURE (3)B.A LTERNATIVE A NALYTICAL P ROCEDURE (3)C.S TABILITY-I NDICATING A SSAY (4)IV.REFERENCE STANDARDS (4)A.T YPES OF S TANDARDS (4)B.C ERTIFICATE OF A NALYSIS (4)C.C HARACTERIZATION OF A R EFERENCE S TANDARD (4)V.METHODS VALIDATION FOR INDS (6)VI.CONTENT AND FORMAT OF ANALYTICAL PROCEDURES FOR NDAS, ANDAS, BLAS, AND PLAS (6)A.P RINCIPLE (6)B.S AMPLING (7)C.E QUIPMENT AND E QUIPMENT P ARAMETERS (7)D.R EAGENTS (7)E.S YSTEM S UITABILITY T ESTING (7)F.P REPARATION OF S TANDARDS (7)G.P REPARATION OF S AMPLES (8)H.P ROCEDURE (8)I.C ALCULATIONS (8)J.R EPORTING OF R ESULTS (8)VII.METHODS VALIDATION FOR NDAS, ANDAS, BLAS, AND PLAS (9)A. N ONCOMPENDIAL A NALYTICAL P ROCEDURES (9)1.Validation Characteristics (9)2.Other Methods Validation Information (10)a.Robustness (11)b.Stress Studies (11)c.Instrument Output/Raw Data (11)3.Recommended Validation Characteristics for Types of Tests (13)B.C OMPENDIAL A NALYTICAL P ROCEDURES (15)VIII.STATISTICAL ANALYSIS (15)A.G ENERAL (15)B.C OMPARATIVE S TUDIES (16)C.S TATISTICS (16)IX.REVALIDATION (16)X.METHODS VALIDATION PACKAGE: CONTENTS AND PROCESSING (17)A.M ETHODS V ALIDATION P ACKAGE (17)B.S ELECTION AND S HIPMENT OF S AMPLES (18)C.R ESPONSIBILITIES OF THE V ARIOUS P ARTIES (19)XI.METHODOLOGY (20)A.H IGH-P RESSURE L IQUID C HROMATOGRAPHY (HPLC) (20)B.G AS C HROMATOGRAPHY (GC) (22)C.S PECTROPHOTOMETRY, S PECTROSCOPY, S PECTROMETRY AND R ELATED P HYSICAL M ETHODOLOGIES (23)D.C APILLARY E LECTROPHORESIS (CE) (23)E.O PTICAL R OTATION (24)F.M ETHODOLOGIES R ELATING TO P ARTICLE S IZE A NALYSIS (25)G.D ISSOLUTION (26)H.O THER I NSTRUMENTATION (27)ATTACHMENT ANDA, ANDA, BLA, AND PLA SUBMISSION CONTENTS (28)ATTACHMENT BMETHODS VALIDATION PROBLEMS AND DELAY (29)REFERENCES (30)GLOSSARY (32)Guidance for Industry 112Analytical Procedures and Methods Validation 3456789101112If you plan to submit comments on this draft guidance, to expedite FDA review of your comments, please:1314! Clearly explain each issue/concern and, when appropriate, include a proposed revision and 15the rationale and/or justification for the proposed change.16! Identify specific comments by line numbers; use the pdf version of the document whenever 17possible.18! If possible, e-mail an electronic copy (Word or WordPerfect) of the comments you have 19submitted to the docket to cunninghamp@.2021I.INTRODUCTION 2223This guidance provides recommendations to applicants on submitting analytical procedures,2 validation 24data, and samples to support the documentation of the identity, strength, quality, purity, and potency 25of drug substances and drug products.3 This guidance is intended to assist applicants in assembling 26information, submitting samples, and presenting data to support analytical methodologies. The 27recommendations apply to drug substances and drug products covered in new drug applications 28(NDAs), abbreviated new drug applications (ANDAs), biologics license applications (BLAs), product 29license applications (PLAs), and supplements to these applications.4 The principles also apply to drug 30substances and drug products covered in Type II drug master files (DMFs). If a different approach is311 This guidance has been prepared by the Analytical Methods Technical Committee of the Chemistry,Manufacturing, and Controls Coordinating Committee (CMC CC) in the Center for Drug Evaluation and Research (CDER) and the Center for Biologics Evaluation and Research (CBER) at the Food and Drug Administration (FDA).2 Analytical procedure is interchangeable with method or test procedure .3The terms drug substance and drug product, as used in this guidance, refer to human drugs and biologics.4Sponsors preparing investigational new drug applications (INDs) should also consider therecommendations in this guidance. However, the amount and depth of the information that should be submitted to support an IND depends in large part on the phase of the investigation and the specific testing proposed inhumans (see section V).32chosen, the applicant is encouraged to discuss the matter in advance with the center with product33jurisdiction to prevent the expenditure of resources on preparing a submission that may later be34determined to be unacceptable.3536The principles of methods validation described in this guidance apply to all types of analytical37procedures. However, the specific recommendations in this guidance may not be applicable to certain 38unique analytical procedures for products such as biological, biotechnological, botanical, or39radiopharmaceutical drugs. For example, many bioassays are based on animal challenge models,40immunogenicity assessments, or other immunoassays that have unique features that should be41considered when submitting analytical procedure and methods validation information. Furthermore, 42specific recommendations for biological and immunochemical tests that may be necessary for43characterization and quality control of many drug substances and drug products are beyond the scope 44of this guidance document. Although this guidance does not specifically address the submission of45analytical procedures and validation data for raw materials, intermediates, excipients, container closure 46components, and other materials used in the production of drug substances and drug products,validated analytical procedures should be used to analyze these materials. For questions on4748appropriate validation approaches for analytical procedures or submission of information not49addressed in this guidance, applicants should consult with the appropriate chemistry review staff atFDA.505152This guidance, when finalized, will replace the FDA guidance for industry on Submitting Samples and 53Analytical Data for Methods Validation (February 1987).545556II.BACKGROUND5758Each NDA and ANDA must include the analytical procedures necessary to ensure the identity,59strength, quality, purity, and potency of the drug substance and drug product, including bioavailability 60of the drug product (21 CFR 314.50(d)(1) and 314.94(a)(9)(i)). Data must be available to establish 61that the analytical procedures used in testing meet proper standards of accuracy and reliability (2162CFR 211.165(e) and 211.194(a)(2)).6364Methods validation is the process of demonstrating that analytical procedures are suitable for their 65intended use. The methods validation process for analytical procedures begins with the planned and 66systematic collection by the applicant of the validation data to support the analytical procedures. The 67review chemist evaluates the analytical procedures and validation data submitted in the NDA or68ANDA. On request from FDA, an NDA or ANDA applicant must submit samples of drug product, 69drug substance, noncompendial reference standards, and blanks so that the applicant=s drug substance 70and drug product analytical procedures can be evaluated by FDA laboratories (21 CFR 314.50(e) 71and 314.94(a)(10)). The FDA laboratory analysis demonstrates that the analytical procedures are72reproducible by laboratory testing. The review chemists and laboratory analysts determine thesuitability of the analytical procedures for regulatory purposes. FDA investigators inspect the7374analytical laboratory testing sites to ensure that the analytical procedures used for release and stability75testing comply with current good manufacturing practices (CGMPs) (21 CFR part 211) or good76laboratory practices (GLPs) (21 CFR part 58), as appropriate.7778Each BLA and PLA must include a full description of the manufacturing methods, including analytical 79procedures, that demonstrate that the manufactured product meets prescribed standards of safety,80purity, and potency (21 CFR 601.2(a) and 601.2(c)(1)(iv)). Data must be available to establish that 81the analytical procedures used in testing meet proper standards of accuracy and reliability (21 CFR 82211.194(a)(2)). For BLAs, PLAs, and their supplements, the analytical procedures and their83validation are submitted as part of the license application or supplement and are evaluated by the84review committee. Representative samples of the product must be submitted and summaries of results 85of tests performed on the lots represented by the submitted sample must be provided (21 CFR86601.2(a) and 601.2(c)(1)(vi)). The review committee chair may request analytical testing by CBER laboratory analysts to evaluate the applicant=s analytical procedures and verify the test results.878889All analytical procedures are of equal importance from a validation perspective. In general, validated 90analytical procedures should be used, irrespective of whether they are for in-process, release,91acceptance, or stability testing. Each quantitative analytical procedure should be designed to minimize 92assay variation.9394Analytical procedures and validation data are submitted in the sections of the application on analytical 95procedures and controls. Recommendations on information to be submitted are included in sections 96III through IX and XI of this guidance. Information on submission of the methods validation97package to the NDA or ANDA and samples to the FDA laboratories is provided in section X.9899100III.TYPES OF ANALYTICAL PROCEDURES101A.Regulatory Analytical Procedure102103104A regulatory analytical procedure is the analytical procedure used to evaluate a defined 105characteristic of the drug substance or drug product. The analytical procedures in the U.S. 106Pharmacopeia/National Formulary (USP/NF) are those legally recognized under section 107501(b) of the Food, Drug, and Cosmetic Act (the Act) as the regulatory analytical proceduresfor compendial items. For purposes of determining compliance with the Act, the regulatory 108109analytical procedure is used.110B.Alternative Analytical Procedure111112113An alternative analytical procedure is an analytical procedure proposed by the applicant for 114use instead of the regulatory analytical procedure. A validated alternative analytical procedure 115should be submitted only if it is shown to perform equal to or better than the regulatory116analytical procedure. If an alternative analytical procedure is submitted, the applicant should 117provide a rationale for its inclusion and identify its use (e.g., release, stability testing), validation118data, and comparative data to the regulatory analytical procedure.119C.Stability-Indicating Assay120121122A stability-indicating assay is a validated quantitative analytical procedure that can detect 123the changes with time in the pertinent properties of the drug substance and drug product. A 124stability-indicating assay accurately measures the active ingredients, without interference from 125degradation products, process impurities, excipients, or other potential impurities. If an126applicant submits a non-stability-indicating analytical procedure for release testing, then an 127analytical procedure capable of qualitatively and quantitatively monitoring the impurities,128including degradation products, should complement it. Assay analytical procedures for129stability studies should be stability-indicating, unless scientifically justified.130131132IV.REFERENCE STANDARDS133A.Types of Standards134135136A reference standard (i.e., primary standard) may be obtained from the USP/NF or other 137official sources (e.g., CBER, 21 CFR 610.20). If there are questions on whether a source of 138a standard would be considered by FDA to be an official source, applicants should contact 139the appropriate chemistry review staff. When there is no official source, a reference standard 140should be of the highest possible purity and be fully characterized.141142A working standard (i.e., in-house or secondary standard) is a standard that is qualifiedagainst and used instead of the reference standard.143144145B.Certificate of Analysis146147A certificate of analysis (COA) for reference standards from non-official sources should be 148submitted in the section of the application on analytical procedures and controls. Forstandards from official sources, the user should ensure the suitability of the reference standard. 149150The standard should be stored correctly and used within the established use interval.151152C.Characterization of a Reference Standard153154Reference standards from USP/NF and other official sources do not require furthercharacterization. A reference standard that is not obtained from an official source should be of 155156the highest purity that can be obtained by reasonable effort, and it should be thoroughly157characterized to ensure its identity, strength, quality, purity, and potency. The qualitative and 158quantitative analytical procedures used to characterize a reference standard are expected to 159be different from, and more extensive than, those used to control the identity, strength, quality, 160purity, and potency of the drug substance or the drug product. Analytical procedures used tocharacterize a reference standard should not rely solely on comparison testing to a previously 161162designated reference standard.163Generally, this characterization information should include:164165166! A brief description of the manufacture of the reference standard, if the manufacturing 167process differs from that of the drug substance. Any additional purification168procedures used in the preparation of the reference standard should be described. 169170!Legible reproductions of the relevant spectra, chromatograms, thin-layer171chromatogram (TLC) photographs or reproductions, and other appropriate172instrumental recordings.173!Data establishing purity. The data should be obtained by using appropriate tests, such 174175as TLC, gas chromatography (GC), high-pressure liquid chromatography (HPLC), 176phase solubility analysis, appropriate thermometric analytical procedures, and others 177as necessary.178179!Appropriate chemical attribute information, such as structural formula, empiricalformula, and molecular weight. Information to substantiate the proof of structure180181should include appropriate analytical tests, such as elemental analysis, infrared182spectrophotometry (IR), ultraviolet spectrophotometry (UV), nuclear magnetic183resonance spectroscopy (NMR), and mass spectrometry (MS), as well as applicable 184functional group analysis. Detailed interpretation of the test data in support of the 185claimed structure should be provided.186187! A physical description of the material, including its color and physical form.188189!Appropriate physical constants such as melting range, boiling range, refractive index, 190dissociation constants (pK values), and optical rotation.191192! A detailed description of the analytical procedures used to characterize the reference 193standard.194195For biotechnological/biological product reference standards, the recommendations on196characterization information above may apply and should be considered. However, additional 197and/or different tests would be important to assess physicochemical characteristics, structural 198characteristics, biological activity, and/or immunochemical activity. Physicochemical199determinations may include isoform, electrophoretic, and liquid chromatographic patterns, as 200well as spectroscopic profiles. Structural characterization may include a determination of 201amino acid sequence, amino acid composition, peptide map, and carbohydrate structure.Biological and/or immunochemical activity should be assessed using the same analytical202203procedures used to determine product potency. These can include animal-based, cell culture-based, biochemical, or ligand/receptor-binding assays. While these tests may be needed for 204205complete characterization of certain reference standards, specific recommendations for206validation of biological and immunochemical tests are not contained in this guidance document. 207208209V.METHODS VALIDATION FOR INDs210211For an investigational new drug, sufficient information is required in each phase of an investigation to 212ensure proper identification, quality, purity, strength, and/or potency. The amount of information on analytical procedures and methods validation necessary will vary with the phase of the investigation 213214(21 CFR 312.23(a)(7)).215216For general guidance on analytical procedures and methods validation information to be submitted for 217phase 1 studies, sponsors should refer to the FDA guidance for industry on Content and Format of 218Investigational New Drug Applications (INDs) for Phase 1 Studies of Drugs, Including Well-219Characterized, Therapeutic, Biotechnology-Derived Products (November 1995). General220guidance regarding analytical procedures and methods validation information to be submitted for phase 2212 or phase3 studies will be provided in the FDA guidance for industry INDs for Phase 2 and 3222Studies of Drugs, Including Specified Therapeutic Biotechnology-Derived Products, Chemistry, 223Manufacturing, and Controls Content and Format, when finalized (draft guidance published April 2241999).225226All analytical procedures should be fully developed and validation completed when the NDA, ANDA, 227BLA, or PLA is submitted.228229230VI.CONTENT AND FORMAT OF ANALYTICAL PROCEDURES FOR NDAs,231ANDAs, BLAs, AND PLAs232233Any analytical procedure submitted in an NDA, ANDA, BLA, or PLA should be described in234sufficient detail to allow a competent analyst to reproduce the necessary conditions and obtain results 235comparable to the applicant=s. Aspects of the analytical procedure that require special attention236should be described. If the analytical procedure used is in the current revision of the USP/NF or other FDA recognized standard references (e.g., AOAC International Book Of Methods) and the237238referenced analytical procedure is not modified, a statement indicating the analytical procedure and 239reference may be provided rather than a description of the method (21 CFR 211.194). A description of analytical procedures from any other published sources should be provided, because the referenced 240241sources may not be readily accessible to the reviewer.242243The following is a list of information that should typically be included in a description of an analytical 244procedure.245246A.Principle248A statement of the principle of the analytical procedure should be included. For example, 249separation is based on isocratic reversed phase HPLC with detection by UV.250251B.Sampling252253The number of samples (e.g., vials, tablets) selected, how they are used (i.e., as individual or 254composite samples), and the number of replicate analyses per sample should be described. 255256C.Equipment and Equipment Parameters257258A listing of all equipment (e.g., instrument type, detector, column type, dimensions) should be 259included, as well as a list of equipment parameters (e.g., flow rate, temperatures, run time,wavelength settings). A drawing representing the experimental configuration (e.g., illustrating 260261positions for a spray pattern analytical procedure) should be provided, when appropriate. 262D.Reagents263264265A list of reagents and their grades (e.g., USP/NF, American Chemical Society (ACS)266Analytical Reagent) should be included. If in-house or modified commercial reagents are 267used, directions for their preparation should be included. Unstable or potentially hazardous 268reagents should be identified, and storage conditions, directions for safe use, and usable shelf 269life for these reagents should be specified.270271E.System Suitability Testing272273System suitability test parameters and acceptance criteria are based on the concept that theequipment, electronics, analytical operations, and samples to be analyzed constitute an274275integrated system. System suitability testing ensures that the system is working properly at the 276time of analysis. Appropriate system suitability criteria should be defined and included in the 277analytical procedure.278279All chromatographic analytical procedures should include system suitability testing and criteria. 280Parameters typically used in system suitability evaluations are defined and discussed in theCDER reviewer guidance on Validation of Chromatographic Methods (November 1994). 281282283System suitability testing is recommended as a component of any analytical procedure, not justthose that involve chromatographic techniques. Regardless of the type of analytical284285procedure, testing should be used to confirm that the system will function correctly286independent of the environmental conditions. For example, titration analytical procedures 287should always include the evaluation of a blank (commonly referred to as a blank titration). 288289F.Preparation of StandardsProcedures for the preparation of all standard solutions (e.g., stock, working standard291292solutions, internal standards) should be included.293G.Preparation of Samples294295296Sample preparation for individual tests should be clearly described. Specific details should beprovided for unusual sample preparations (e.g., solid-phase extraction, derivatization).297298299H.Procedure300301A step-by-step description of the procedure should be provided. The description should 302include, where appropriate, equilibration times, injection sampling sequence, and system303suitability or start-up parameters. Unusual hazards should be identified.304305I.Calculations306307Representative calculations, with a tabulation defining all symbols and numerical factors, and 308specific instructions for the calculation of degradation products and impurities should be309included. Any mathematical transformations or formulas used in data analysis should be310described in detail. These may include logarithmic transformations used to obtain a linear 311relationship from exponential data, or the use of multiple order regression analyses.312313J.Reporting of Results3143151.General316317The format used to report results (e.g., percent label claim, weight/weight,318weight/volume, parts per million (ppm)) including the specific number of significant 319figures to be reported should be provided.3203212.Impurities Analytical Procedures322323The name and location/identifier (e.g., retention time (RT), relative retention time(RRT)) of impurities and the type of impurity (e.g., process, degradant, excipient324325degradant) should be included in the analytical procedures for impurities in the drug 326substance and drug product. The detection limit (DL) or quantitation limit (QL)should be stated, as appropriate. The DL or QL can be set using the drug substance's 327328detection response.329330Reporting of organic impurities should cover (1) specified identified impurities by331name, (2) specified unidentified impurities by location/identifier, (3) any unspecified 332impurities, and (4) total impurities. The total organic impurities for the drug product or333drug substance is the sum of all impurities equal to or greater than their individual QL. 334See recommendations regarding appropriate QLs in FDA impurities guidances (see 335references). Inorganic impurities and residual solvents should also be addressed. 336337For the drug product, drug substance process impurities may be excluded from338reporting if an acceptable rationale is provided in the sections on analytical procedures 339and controls. Drug product impurities from the drug product manufacturing process, 340packaging, and labeling should be addressed.341342The above reporting information may not be strictly applicable to all products (e.g., 343biological, biotechnological, botanical, radiopharmaceutical drugs), but any significant 344process and product-related impurities should be determined and reported.345346347VII.METHODS VALIDATION FOR NDAs, ANDAs, BLAs, AND PLAs348A. Noncompendial Analytical Procedures349350351In an NDA, ANDA, BLA, or PLA, data must be submitted to establish that the analytical 352procedures used in testing meet proper standards of accuracy and reliability (21 CFR353211.194(a)(2)). Methods validation is the process of demonstrating that analytical354procedures are suitable for their intended use. At the time of submission, the NDA, ANDA, 355BLA, or PLA should contain methods validation information to support the adequacy of the 356analytical procedures.357358The International Conference on Harmonisation (ICH) guidance Q2A Text on Validation of 359Analytical Procedures (March 1995) and Q2B Validation of Analytical Procedures:360Methodology (November 1996) provide recommendations on validation of analytical361procedures. Analytical procedures outside the scope of the ICH guidances should still be 362validated.3633641.Validation Characteristics365Applicants should submit information on the validation characteristics of their366367proposed analytical procedures (see ICH Q2A and ICH Q2B). Although not all of 368the validation characteristics are needed for all types of tests (see section VII.A.3),typical validation characteristics are:369370371!Accuracy372!Precision (repeatability and intermediate precision)373!Specificity374!Detection limit375!Quantitation limit。

2018年第45届世界技能大赛

2018年第45届世界技能大赛

2018年第45届世界技能大赛全国选拔赛云南赛区美发项目技术工作文件目录1技术描述 (2)1.1项目描述 (2)1.2能力要求 (2)1.3基本知识要求 (2)2裁判组与选手 (2)3竞赛项目 (3)3.1竞赛项目命题原则 (3)3.2竞赛项目内容 (3)3.2.1模块A (3)3.2.2模块B (4)3.2.3模块C (5)3.2.4模块D (6)3.3 评分注意事项 (7)3.3.1效果及印象 (7)3.3.2主观分评定标准 (7)3.3.3评分方式 (8)4命题方式 (8)5成绩评定 (8)6比赛材料 (8)7赛场要求 (9)7.1赛场面积要求 (9)7.2赛场基础设施要求 (9)8安全要求 (9)8.1选手安全防护 (9)8.2赛事安全防备 (9)9竞赛实施 (10)9.1竞赛流程 (10)9.2违规与判罚 (10)9.3赛场规则 (11)10开放现场要求 (11)10.1公众要求 (11)10.2赞助商和宣传要求 (12)11绿色环保 (12)1技术描述1.1项目描述美发指的是对头发的处理与护理，包括所有类型的修剪、染色、造型和发型设计，发型师通过专业的技术处理，尽力突出顾客美发相貌和个性。

美发项目包括女士美发与男士美发。

对现代发型师的要求是：具有丰富的专业知识；时尚、创意的设计思想，精湛的技术技巧，商业和艺术应用的能力。

1.2能力要求1.2.1熟练使用美发修剪工具，如：剪刀、削刀、电推剪、吹风机等1.2.2能遵循比赛发型要求，反映自己的设计1.2.3能遵守健康与安全规定，认真仔细调配和涂抹染膏1.2.4能根据项目要求，做出任何长度的头发上的艺术化或商业化的色彩1.2.5能熟练展示各种创造性染色技巧1.2.6能为头模和发片涂抹漂粉1.2.7能熟练地使用头发造型加热器1.2.8能按照项目要求做出发型效果1.2.9能在长发和短发中吹风造型1.2.10能在需要的地方添加发片，根据项目添加饰品1.2.11合理使用造型产品1.3基本知识要求1.3.1制定计划的知识1.3.2时间管理的知识1.3.3头发分析的知识1.3.4清洁消毒，确保职业健康与安全知识1.3.5头发的修剪知识1.3.6染色产品的使用知识1.3.7发型造型知识2裁判组与选手2.1裁判组由裁判长1名，裁判员若干名共同组成，在裁判长的带领下裁判组成员负责各项赛务工作，裁判将分组并循环。

MIKE21_HD_Step_By_Step

MIKE21_HD_Step_By_Step

2005-07-22/MIKE21_HD_STEP_BY_STEP.DOC/NHP/MSD0507.lsm
DHI Software 2005
DHI Water & Environment
CONTENTS MIKE 21 Flow Model Hydrodynamic Module Step-by-step training guide
Generate Water Level Boundary Conditions .....................................................................11 Importing measured water levels to time series file ...........................................................12 Creating boundary conditions............................................................................................17 Initial Surface Level..........................................................................................................19 Wind Conditions ...............................................................................................................19 Density Variation at the Boundary ....................................................................................20

世界杯潘卡足球嘉年华暨足球训练营主题活动

世界杯潘卡足球嘉年华暨足球训练营主题活动

2018 俄罗斯世界杯潘卡足球系列主题活动
FAFI WORLD CUP RUSSIA 2018
潘卡体育 www.panka.vip
2018 世界杯潘卡足球系列主题活动
FAFI WORLD CUP RUSSIA 2018
世界杯不只是足球比赛！
它的影响超出了足球运动的范畴
针对上届欧洲杯，尼尔森公司在全球55个国家和地区对消费者进行在线调查。
潘卡体育 www.panka.vip
活动场地世界杯主题布置—潘卡足球设备
1、区域介绍：君泰·中央公园售楼部LED大屏前方区域 2、区域布置：潘卡足球游戏设备 Poolball这项运动在国内叫潘卡足球，是足球和台球的结合体，非常有趣，规则跟中式8球是 一样的，就是在一个巨大的台球桌上踢足球。足球与台球的融合又大胆实现了体能与智慧的高 度结合，技巧与激情的完美碰撞，满足不同年龄阶段对竞技项目的热爱。
调查结果显示，尽管只有两成中国网民认为自己是足球迷，但接近七成
65%
中国网民观看
(65%)中国受访者表示将观看此次世界杯。 从全球范围来看，34%受访者自认是足球迷，更有超过半数(51%)民众表示， 将会密切关注2018世界杯比赛。
大牌/专家的秀场
球迷的盛宴
大众的狂欢理由
看门道
看比赛
看热闹
是全体群众四年一次的狂欢
潘卡体育 www.panka.vip
活动区域场地布置图——室内
潘卡体育 www.panka.vi
活动区域场地布置图——室外
潘卡体育 www.panka.vip
周末暖场互动游戏体验环节
序号 上午 下午
潘卡足球嘉年华活动流程
时间
项目
互动游戏设备环节
9:30—10:00

2018俄罗斯世界杯参赛国家队情况介绍ppt模板

2018俄罗斯世界杯参赛国家队情况介绍ppt模板

德国队在世界杯和欧洲杯国际大赛总进球数都为历史第一，展现出冠绝世界足坛的强大实力
韩国共10次进入世界杯决赛圈的比赛 自1986年世界杯后从未缺席
ytuytuyuyt
其最好成绩来自于2002年日韩世界杯 当时韩国先后战胜意大利和西班牙晋级四强 创造了亚洲球队在世界杯上的最好成绩
////
Belgium England Tunisia Panama
ytuytuyuyt
////
Croatia Argentina Iceland Nigeria
克罗地亚 阿根廷 冰岛 尼日利亚
ytuytuyuyt
克罗地亚在FIFA世界杯上的经历短而甜蜜 他们首次尝试就进入了1998年的法国FIFA世界杯 2018年是克罗地亚队第五次参加世界杯
ytuytuyuyt
ytuytuyuyt
2002年的世界杯十六强遇上宿敌英格兰，结果以0-3被淘汰出局
澳大利亚是大洋洲五度盟主 先后参与了1974，2006，2010，2014，2018五届世界杯决赛圈
ytuytuyuyt
球队在世界杯的最佳成绩为2006年的十六强
秘鲁曾经是一个足球强国 曾4次进入世界杯决赛圈，两次参加奥运会 2018年，秘鲁时隔35年重回决赛圈
葡萄牙曾经在1966年英格兰世界杯上获得季军
自进入新世纪以来能够稳定的杀入世界杯和欧锦赛的决赛圈
ytuytuyuyt
现役队长C罗纳尔多已经成为了葡萄牙历史第一射手
西班牙是欧洲传统强队 在世界杯上，西班牙队曾于1950年杀入四强 2010年西班牙队首次获得世界杯冠军
ytuytuyuyt
摩洛哥分别于1970、1986、1994、1998、2018 五次参加世界杯比赛
////

2018KOB全球机器人格斗大赛

2018KOB全球机器人格斗大赛

2018 KOB 全球机器人格斗大赛赛制规则（羽量级）(Version18.5)2018 KOB全球机器人格斗大赛赛制规则（羽量级）（Version18.5）概述本文为2018KOB全球机器人格斗大赛（以下简称“本赛事”）的参赛选手需要遵守的规范准则。

本规则以遵循公平竞技、安全竞技为原则制定。

第一节：赛制1.比赛日期\地点请参看大赛官方大赛公告。

2.比赛赛制本赛事将采用淘汰赛作为主要晋级形式，根据赛时参赛队伍数量情况会加入复活赛或其他晋级形式，完整赛制会在正式比赛前发布到所有参赛选手，最终决出本次大赛冠军。

3.比赛奖金本赛事设有高额奖金，包括且不限于以下奖金：冠军1名奖金5万元人民币、亚军1名奖金2万元人民币、季军1名奖金1万元人民币、最佳设计奖1名奖金2万元人民币；此外大赛还设置晋级奖金，即每只战队每晋级一轮可以获得1000元的晋级奖金。

（特别说明：参赛战队首败之后将无法再获得晋级奖金，但根据战绩依旧有机会可以获得大赛设置的其他奖金。

）第二节：参赛规则⚫一般情况，每支参赛队伍的参赛队员人数限于2人以内，如存在需要超出的情况，可事前与本赛事协商申报。

⚫任一参赛选手只能属于一支参赛队伍。

⚫任一参赛队伍只能使用一台机器人参赛，参赛期间不可更换。

（模块化、备用机、母子、双子、多子机器人的情况，被视为一台机器人。

）⚫同一支队伍中，可由任意成员担任机器人的操作员，没有固定的限制。

⚫参赛队伍中，必须至少具有一名年满18岁以上的成年人担任队长。

⚫参赛队伍中存在18岁以下的未成年人时，需要有其法定监护人书面授权，才能参赛。

（见法定监护人参赛授权书）⚫参赛队伍中存在16岁以下的未成年人时，16岁以下的队员数量不得高于该队伍中成年人的数量。

⚫参赛选手不设置最低和最大年龄限制，但是大赛主办方，对选手能否参赛，具有最终决定权。

第二节：比赛规则1.比赛时间本赛事每场比赛的时间为3分钟。

若比赛出现中断暂停的情况发生时，比赛时间将顺延。

3GPP TS 36.331 V13.2.0 (2016-06)

3GPP TS 36.331 V13.2.0 (2016-06)

3GPP TS 36.331 V13.2.0 (2016-06)Technical Specification3rd Generation Partnership Project;Technical Specification Group Radio Access Network;Evolved Universal Terrestrial Radio Access (E-UTRA);Radio Resource Control (RRC);Protocol specification(Release 13)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification. Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, radio3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© 2016, 3GPP Organizational Partners (ARIB, ATIS, CCSA, ETSI, TSDSI, TTA, TTC).All rights reserved.UMTS™ is a Trade Mark of ETSI registered for the benefit of its members3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational PartnersLTE™ is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM AssociationBluetooth® is a Trade Mark of the Bluetooth SIG registered for the benefit of its membersContentsForeword (18)1Scope (19)2References (19)3Definitions, symbols and abbreviations (22)3.1Definitions (22)3.2Abbreviations (24)4General (27)4.1Introduction (27)4.2Architecture (28)4.2.1UE states and state transitions including inter RAT (28)4.2.2Signalling radio bearers (29)4.3Services (30)4.3.1Services provided to upper layers (30)4.3.2Services expected from lower layers (30)4.4Functions (30)5Procedures (32)5.1General (32)5.1.1Introduction (32)5.1.2General requirements (32)5.2System information (33)5.2.1Introduction (33)5.2.1.1General (33)5.2.1.2Scheduling (34)5.2.1.2a Scheduling for NB-IoT (34)5.2.1.3System information validity and notification of changes (35)5.2.1.4Indication of ETWS notification (36)5.2.1.5Indication of CMAS notification (37)5.2.1.6Notification of EAB parameters change (37)5.2.1.7Access Barring parameters change in NB-IoT (37)5.2.2System information acquisition (38)5.2.2.1General (38)5.2.2.2Initiation (38)5.2.2.3System information required by the UE (38)5.2.2.4System information acquisition by the UE (39)5.2.2.5Essential system information missing (42)5.2.2.6Actions upon reception of the MasterInformationBlock message (42)5.2.2.7Actions upon reception of the SystemInformationBlockType1 message (42)5.2.2.8Actions upon reception of SystemInformation messages (44)5.2.2.9Actions upon reception of SystemInformationBlockType2 (44)5.2.2.10Actions upon reception of SystemInformationBlockType3 (45)5.2.2.11Actions upon reception of SystemInformationBlockType4 (45)5.2.2.12Actions upon reception of SystemInformationBlockType5 (45)5.2.2.13Actions upon reception of SystemInformationBlockType6 (45)5.2.2.14Actions upon reception of SystemInformationBlockType7 (45)5.2.2.15Actions upon reception of SystemInformationBlockType8 (45)5.2.2.16Actions upon reception of SystemInformationBlockType9 (46)5.2.2.17Actions upon reception of SystemInformationBlockType10 (46)5.2.2.18Actions upon reception of SystemInformationBlockType11 (46)5.2.2.19Actions upon reception of SystemInformationBlockType12 (47)5.2.2.20Actions upon reception of SystemInformationBlockType13 (48)5.2.2.21Actions upon reception of SystemInformationBlockType14 (48)5.2.2.22Actions upon reception of SystemInformationBlockType15 (48)5.2.2.23Actions upon reception of SystemInformationBlockType16 (48)5.2.2.24Actions upon reception of SystemInformationBlockType17 (48)5.2.2.25Actions upon reception of SystemInformationBlockType18 (48)5.2.2.26Actions upon reception of SystemInformationBlockType19 (49)5.2.3Acquisition of an SI message (49)5.2.3a Acquisition of an SI message by BL UE or UE in CE or a NB-IoT UE (50)5.3Connection control (50)5.3.1Introduction (50)5.3.1.1RRC connection control (50)5.3.1.2Security (52)5.3.1.2a RN security (53)5.3.1.3Connected mode mobility (53)5.3.1.4Connection control in NB-IoT (54)5.3.2Paging (55)5.3.2.1General (55)5.3.2.2Initiation (55)5.3.2.3Reception of the Paging message by the UE (55)5.3.3RRC connection establishment (56)5.3.3.1General (56)5.3.3.1a Conditions for establishing RRC Connection for sidelink communication/ discovery (58)5.3.3.2Initiation (59)5.3.3.3Actions related to transmission of RRCConnectionRequest message (63)5.3.3.3a Actions related to transmission of RRCConnectionResumeRequest message (64)5.3.3.4Reception of the RRCConnectionSetup by the UE (64)5.3.3.4a Reception of the RRCConnectionResume by the UE (66)5.3.3.5Cell re-selection while T300, T302, T303, T305, T306, or T308 is running (68)5.3.3.6T300 expiry (68)5.3.3.7T302, T303, T305, T306, or T308 expiry or stop (69)5.3.3.8Reception of the RRCConnectionReject by the UE (70)5.3.3.9Abortion of RRC connection establishment (71)5.3.3.10Handling of SSAC related parameters (71)5.3.3.11Access barring check (72)5.3.3.12EAB check (73)5.3.3.13Access barring check for ACDC (73)5.3.3.14Access Barring check for NB-IoT (74)5.3.4Initial security activation (75)5.3.4.1General (75)5.3.4.2Initiation (76)5.3.4.3Reception of the SecurityModeCommand by the UE (76)5.3.5RRC connection reconfiguration (77)5.3.5.1General (77)5.3.5.2Initiation (77)5.3.5.3Reception of an RRCConnectionReconfiguration not including the mobilityControlInfo by theUE (77)5.3.5.4Reception of an RRCConnectionReconfiguration including the mobilityControlInfo by the UE(handover) (79)5.3.5.5Reconfiguration failure (83)5.3.5.6T304 expiry (handover failure) (83)5.3.5.7Void (84)5.3.5.7a T307 expiry (SCG change failure) (84)5.3.5.8Radio Configuration involving full configuration option (84)5.3.6Counter check (86)5.3.6.1General (86)5.3.6.2Initiation (86)5.3.6.3Reception of the CounterCheck message by the UE (86)5.3.7RRC connection re-establishment (87)5.3.7.1General (87)5.3.7.2Initiation (87)5.3.7.3Actions following cell selection while T311 is running (88)5.3.7.4Actions related to transmission of RRCConnectionReestablishmentRequest message (89)5.3.7.5Reception of the RRCConnectionReestablishment by the UE (89)5.3.7.6T311 expiry (91)5.3.7.7T301 expiry or selected cell no longer suitable (91)5.3.7.8Reception of RRCConnectionReestablishmentReject by the UE (91)5.3.8RRC connection release (92)5.3.8.1General (92)5.3.8.2Initiation (92)5.3.8.3Reception of the RRCConnectionRelease by the UE (92)5.3.8.4T320 expiry (93)5.3.9RRC connection release requested by upper layers (93)5.3.9.1General (93)5.3.9.2Initiation (93)5.3.10Radio resource configuration (93)5.3.10.0General (93)5.3.10.1SRB addition/ modification (94)5.3.10.2DRB release (95)5.3.10.3DRB addition/ modification (95)5.3.10.3a1DC specific DRB addition or reconfiguration (96)5.3.10.3a2LWA specific DRB addition or reconfiguration (98)5.3.10.3a3LWIP specific DRB addition or reconfiguration (98)5.3.10.3a SCell release (99)5.3.10.3b SCell addition/ modification (99)5.3.10.3c PSCell addition or modification (99)5.3.10.4MAC main reconfiguration (99)5.3.10.5Semi-persistent scheduling reconfiguration (100)5.3.10.6Physical channel reconfiguration (100)5.3.10.7Radio Link Failure Timers and Constants reconfiguration (101)5.3.10.8Time domain measurement resource restriction for serving cell (101)5.3.10.9Other configuration (102)5.3.10.10SCG reconfiguration (103)5.3.10.11SCG dedicated resource configuration (104)5.3.10.12Reconfiguration SCG or split DRB by drb-ToAddModList (105)5.3.10.13Neighbour cell information reconfiguration (105)5.3.10.14Void (105)5.3.10.15Sidelink dedicated configuration (105)5.3.10.16T370 expiry (106)5.3.11Radio link failure related actions (107)5.3.11.1Detection of physical layer problems in RRC_CONNECTED (107)5.3.11.2Recovery of physical layer problems (107)5.3.11.3Detection of radio link failure (107)5.3.12UE actions upon leaving RRC_CONNECTED (109)5.3.13UE actions upon PUCCH/ SRS release request (110)5.3.14Proximity indication (110)5.3.14.1General (110)5.3.14.2Initiation (111)5.3.14.3Actions related to transmission of ProximityIndication message (111)5.3.15Void (111)5.4Inter-RAT mobility (111)5.4.1Introduction (111)5.4.2Handover to E-UTRA (112)5.4.2.1General (112)5.4.2.2Initiation (112)5.4.2.3Reception of the RRCConnectionReconfiguration by the UE (112)5.4.2.4Reconfiguration failure (114)5.4.2.5T304 expiry (handover to E-UTRA failure) (114)5.4.3Mobility from E-UTRA (114)5.4.3.1General (114)5.4.3.2Initiation (115)5.4.3.3Reception of the MobilityFromEUTRACommand by the UE (115)5.4.3.4Successful completion of the mobility from E-UTRA (116)5.4.3.5Mobility from E-UTRA failure (117)5.4.4Handover from E-UTRA preparation request (CDMA2000) (117)5.4.4.1General (117)5.4.4.2Initiation (118)5.4.4.3Reception of the HandoverFromEUTRAPreparationRequest by the UE (118)5.4.5UL handover preparation transfer (CDMA2000) (118)5.4.5.1General (118)5.4.5.2Initiation (118)5.4.5.3Actions related to transmission of the ULHandoverPreparationTransfer message (119)5.4.5.4Failure to deliver the ULHandoverPreparationTransfer message (119)5.4.6Inter-RAT cell change order to E-UTRAN (119)5.4.6.1General (119)5.4.6.2Initiation (119)5.4.6.3UE fails to complete an inter-RAT cell change order (119)5.5Measurements (120)5.5.1Introduction (120)5.5.2Measurement configuration (121)5.5.2.1General (121)5.5.2.2Measurement identity removal (122)5.5.2.2a Measurement identity autonomous removal (122)5.5.2.3Measurement identity addition/ modification (123)5.5.2.4Measurement object removal (124)5.5.2.5Measurement object addition/ modification (124)5.5.2.6Reporting configuration removal (126)5.5.2.7Reporting configuration addition/ modification (127)5.5.2.8Quantity configuration (127)5.5.2.9Measurement gap configuration (127)5.5.2.10Discovery signals measurement timing configuration (128)5.5.2.11RSSI measurement timing configuration (128)5.5.3Performing measurements (128)5.5.3.1General (128)5.5.3.2Layer 3 filtering (131)5.5.4Measurement report triggering (131)5.5.4.1General (131)5.5.4.2Event A1 (Serving becomes better than threshold) (135)5.5.4.3Event A2 (Serving becomes worse than threshold) (136)5.5.4.4Event A3 (Neighbour becomes offset better than PCell/ PSCell) (136)5.5.4.5Event A4 (Neighbour becomes better than threshold) (137)5.5.4.6Event A5 (PCell/ PSCell becomes worse than threshold1 and neighbour becomes better thanthreshold2) (138)5.5.4.6a Event A6 (Neighbour becomes offset better than SCell) (139)5.5.4.7Event B1 (Inter RAT neighbour becomes better than threshold) (139)5.5.4.8Event B2 (PCell becomes worse than threshold1 and inter RAT neighbour becomes better thanthreshold2) (140)5.5.4.9Event C1 (CSI-RS resource becomes better than threshold) (141)5.5.4.10Event C2 (CSI-RS resource becomes offset better than reference CSI-RS resource) (141)5.5.4.11Event W1 (WLAN becomes better than a threshold) (142)5.5.4.12Event W2 (All WLAN inside WLAN mobility set becomes worse than threshold1 and a WLANoutside WLAN mobility set becomes better than threshold2) (142)5.5.4.13Event W3 (All WLAN inside WLAN mobility set becomes worse than a threshold) (143)5.5.5Measurement reporting (144)5.5.6Measurement related actions (148)5.5.6.1Actions upon handover and re-establishment (148)5.5.6.2Speed dependant scaling of measurement related parameters (149)5.5.7Inter-frequency RSTD measurement indication (149)5.5.7.1General (149)5.5.7.2Initiation (150)5.5.7.3Actions related to transmission of InterFreqRSTDMeasurementIndication message (150)5.6Other (150)5.6.0General (150)5.6.1DL information transfer (151)5.6.1.1General (151)5.6.1.2Initiation (151)5.6.1.3Reception of the DLInformationTransfer by the UE (151)5.6.2UL information transfer (151)5.6.2.1General (151)5.6.2.2Initiation (151)5.6.2.3Actions related to transmission of ULInformationTransfer message (152)5.6.2.4Failure to deliver ULInformationTransfer message (152)5.6.3UE capability transfer (152)5.6.3.1General (152)5.6.3.2Initiation (153)5.6.3.3Reception of the UECapabilityEnquiry by the UE (153)5.6.4CSFB to 1x Parameter transfer (157)5.6.4.1General (157)5.6.4.2Initiation (157)5.6.4.3Actions related to transmission of CSFBParametersRequestCDMA2000 message (157)5.6.4.4Reception of the CSFBParametersResponseCDMA2000 message (157)5.6.5UE Information (158)5.6.5.1General (158)5.6.5.2Initiation (158)5.6.5.3Reception of the UEInformationRequest message (158)5.6.6 Logged Measurement Configuration (159)5.6.6.1General (159)5.6.6.2Initiation (160)5.6.6.3Reception of the LoggedMeasurementConfiguration by the UE (160)5.6.6.4T330 expiry (160)5.6.7 Release of Logged Measurement Configuration (160)5.6.7.1General (160)5.6.7.2Initiation (160)5.6.8 Measurements logging (161)5.6.8.1General (161)5.6.8.2Initiation (161)5.6.9In-device coexistence indication (163)5.6.9.1General (163)5.6.9.2Initiation (164)5.6.9.3Actions related to transmission of InDeviceCoexIndication message (164)5.6.10UE Assistance Information (165)5.6.10.1General (165)5.6.10.2Initiation (166)5.6.10.3Actions related to transmission of UEAssistanceInformation message (166)5.6.11 Mobility history information (166)5.6.11.1General (166)5.6.11.2Initiation (166)5.6.12RAN-assisted WLAN interworking (167)5.6.12.1General (167)5.6.12.2Dedicated WLAN offload configuration (167)5.6.12.3WLAN offload RAN evaluation (167)5.6.12.4T350 expiry or stop (167)5.6.12.5Cell selection/ re-selection while T350 is running (168)5.6.13SCG failure information (168)5.6.13.1General (168)5.6.13.2Initiation (168)5.6.13.3Actions related to transmission of SCGFailureInformation message (168)5.6.14LTE-WLAN Aggregation (169)5.6.14.1Introduction (169)5.6.14.2Reception of LWA configuration (169)5.6.14.3Release of LWA configuration (170)5.6.15WLAN connection management (170)5.6.15.1Introduction (170)5.6.15.2WLAN connection status reporting (170)5.6.15.2.1General (170)5.6.15.2.2Initiation (171)5.6.15.2.3Actions related to transmission of WLANConnectionStatusReport message (171)5.6.15.3T351 Expiry (WLAN connection attempt timeout) (171)5.6.15.4WLAN status monitoring (171)5.6.16RAN controlled LTE-WLAN interworking (172)5.6.16.1General (172)5.6.16.2WLAN traffic steering command (172)5.6.17LTE-WLAN aggregation with IPsec tunnel (173)5.6.17.1General (173)5.7Generic error handling (174)5.7.1General (174)5.7.2ASN.1 violation or encoding error (174)5.7.3Field set to a not comprehended value (174)5.7.4Mandatory field missing (174)5.7.5Not comprehended field (176)5.8MBMS (176)5.8.1Introduction (176)5.8.1.1General (176)5.8.1.2Scheduling (176)5.8.1.3MCCH information validity and notification of changes (176)5.8.2MCCH information acquisition (178)5.8.2.1General (178)5.8.2.2Initiation (178)5.8.2.3MCCH information acquisition by the UE (178)5.8.2.4Actions upon reception of the MBSFNAreaConfiguration message (178)5.8.2.5Actions upon reception of the MBMSCountingRequest message (179)5.8.3MBMS PTM radio bearer configuration (179)5.8.3.1General (179)5.8.3.2Initiation (179)5.8.3.3MRB establishment (179)5.8.3.4MRB release (179)5.8.4MBMS Counting Procedure (179)5.8.4.1General (179)5.8.4.2Initiation (180)5.8.4.3Reception of the MBMSCountingRequest message by the UE (180)5.8.5MBMS interest indication (181)5.8.5.1General (181)5.8.5.2Initiation (181)5.8.5.3Determine MBMS frequencies of interest (182)5.8.5.4Actions related to transmission of MBMSInterestIndication message (183)5.8a SC-PTM (183)5.8a.1Introduction (183)5.8a.1.1General (183)5.8a.1.2SC-MCCH scheduling (183)5.8a.1.3SC-MCCH information validity and notification of changes (183)5.8a.1.4Procedures (184)5.8a.2SC-MCCH information acquisition (184)5.8a.2.1General (184)5.8a.2.2Initiation (184)5.8a.2.3SC-MCCH information acquisition by the UE (184)5.8a.2.4Actions upon reception of the SCPTMConfiguration message (185)5.8a.3SC-PTM radio bearer configuration (185)5.8a.3.1General (185)5.8a.3.2Initiation (185)5.8a.3.3SC-MRB establishment (185)5.8a.3.4SC-MRB release (185)5.9RN procedures (186)5.9.1RN reconfiguration (186)5.9.1.1General (186)5.9.1.2Initiation (186)5.9.1.3Reception of the RNReconfiguration by the RN (186)5.10Sidelink (186)5.10.1Introduction (186)5.10.1a Conditions for sidelink communication operation (187)5.10.2Sidelink UE information (188)5.10.2.1General (188)5.10.2.2Initiation (189)5.10.2.3Actions related to transmission of SidelinkUEInformation message (193)5.10.3Sidelink communication monitoring (195)5.10.6Sidelink discovery announcement (198)5.10.6a Sidelink discovery announcement pool selection (201)5.10.6b Sidelink discovery announcement reference carrier selection (201)5.10.7Sidelink synchronisation information transmission (202)5.10.7.1General (202)5.10.7.2Initiation (203)5.10.7.3Transmission of SLSS (204)5.10.7.4Transmission of MasterInformationBlock-SL message (205)5.10.7.5Void (206)5.10.8Sidelink synchronisation reference (206)5.10.8.1General (206)5.10.8.2Selection and reselection of synchronisation reference UE (SyncRef UE) (206)5.10.9Sidelink common control information (207)5.10.9.1General (207)5.10.9.2Actions related to reception of MasterInformationBlock-SL message (207)5.10.10Sidelink relay UE operation (207)5.10.10.1General (207)5.10.10.2AS-conditions for relay related sidelink communication transmission by sidelink relay UE (207)5.10.10.3AS-conditions for relay PS related sidelink discovery transmission by sidelink relay UE (208)5.10.10.4Sidelink relay UE threshold conditions (208)5.10.11Sidelink remote UE operation (208)5.10.11.1General (208)5.10.11.2AS-conditions for relay related sidelink communication transmission by sidelink remote UE (208)5.10.11.3AS-conditions for relay PS related sidelink discovery transmission by sidelink remote UE (209)5.10.11.4Selection and reselection of sidelink relay UE (209)5.10.11.5Sidelink remote UE threshold conditions (210)6Protocol data units, formats and parameters (tabular & ASN.1) (210)6.1General (210)6.2RRC messages (212)6.2.1General message structure (212)–EUTRA-RRC-Definitions (212)–BCCH-BCH-Message (212)–BCCH-DL-SCH-Message (212)–BCCH-DL-SCH-Message-BR (213)–MCCH-Message (213)–PCCH-Message (213)–DL-CCCH-Message (214)–DL-DCCH-Message (214)–UL-CCCH-Message (214)–UL-DCCH-Message (215)–SC-MCCH-Message (215)6.2.2Message definitions (216)–CounterCheck (216)–CounterCheckResponse (217)–CSFBParametersRequestCDMA2000 (217)–CSFBParametersResponseCDMA2000 (218)–DLInformationTransfer (218)–HandoverFromEUTRAPreparationRequest (CDMA2000) (219)–InDeviceCoexIndication (220)–InterFreqRSTDMeasurementIndication (222)–LoggedMeasurementConfiguration (223)–MasterInformationBlock (225)–MBMSCountingRequest (226)–MBMSCountingResponse (226)–MBMSInterestIndication (227)–MBSFNAreaConfiguration (228)–MeasurementReport (228)–MobilityFromEUTRACommand (229)–Paging (232)–ProximityIndication (233)–RNReconfiguration (234)–RNReconfigurationComplete (234)–RRCConnectionReconfiguration (235)–RRCConnectionReconfigurationComplete (240)–RRCConnectionReestablishment (241)–RRCConnectionReestablishmentComplete (241)–RRCConnectionReestablishmentReject (242)–RRCConnectionReestablishmentRequest (243)–RRCConnectionReject (243)–RRCConnectionRelease (244)–RRCConnectionResume (248)–RRCConnectionResumeComplete (249)–RRCConnectionResumeRequest (250)–RRCConnectionRequest (250)–RRCConnectionSetup (251)–RRCConnectionSetupComplete (252)–SCGFailureInformation (253)–SCPTMConfiguration (254)–SecurityModeCommand (255)–SecurityModeComplete (255)–SecurityModeFailure (256)–SidelinkUEInformation (256)–SystemInformation (258)–SystemInformationBlockType1 (259)–UEAssistanceInformation (264)–UECapabilityEnquiry (265)–UECapabilityInformation (266)–UEInformationRequest (267)–UEInformationResponse (267)–ULHandoverPreparationTransfer (CDMA2000) (273)–ULInformationTransfer (274)–WLANConnectionStatusReport (274)6.3RRC information elements (275)6.3.1System information blocks (275)–SystemInformationBlockType2 (275)–SystemInformationBlockType3 (279)–SystemInformationBlockType4 (282)–SystemInformationBlockType5 (283)–SystemInformationBlockType6 (287)–SystemInformationBlockType7 (289)–SystemInformationBlockType8 (290)–SystemInformationBlockType9 (295)–SystemInformationBlockType10 (295)–SystemInformationBlockType11 (296)–SystemInformationBlockType12 (297)–SystemInformationBlockType13 (297)–SystemInformationBlockType14 (298)–SystemInformationBlockType15 (298)–SystemInformationBlockType16 (299)–SystemInformationBlockType17 (300)–SystemInformationBlockType18 (301)–SystemInformationBlockType19 (301)–SystemInformationBlockType20 (304)6.3.2Radio resource control information elements (304)–AntennaInfo (304)–AntennaInfoUL (306)–CQI-ReportConfig (307)–CQI-ReportPeriodicProcExtId (314)–CrossCarrierSchedulingConfig (314)–CSI-IM-Config (315)–CSI-IM-ConfigId (315)–CSI-RS-Config (317)–CSI-RS-ConfigEMIMO (318)–CSI-RS-ConfigNZP (319)–CSI-RS-ConfigNZPId (320)–CSI-RS-ConfigZP (321)–CSI-RS-ConfigZPId (321)–DMRS-Config (321)–DRB-Identity (322)–EPDCCH-Config (322)–EIMTA-MainConfig (324)–LogicalChannelConfig (325)–LWA-Configuration (326)–LWIP-Configuration (326)–RCLWI-Configuration (327)–MAC-MainConfig (327)–P-C-AndCBSR (332)–PDCCH-ConfigSCell (333)–PDCP-Config (334)–PDSCH-Config (337)–PDSCH-RE-MappingQCL-ConfigId (339)–PHICH-Config (339)–PhysicalConfigDedicated (339)–P-Max (344)–PRACH-Config (344)–PresenceAntennaPort1 (346)–PUCCH-Config (347)–PUSCH-Config (351)–RACH-ConfigCommon (355)–RACH-ConfigDedicated (357)–RadioResourceConfigCommon (358)–RadioResourceConfigDedicated (362)–RLC-Config (367)–RLF-TimersAndConstants (369)–RN-SubframeConfig (370)–SchedulingRequestConfig (371)–SoundingRS-UL-Config (372)–SPS-Config (375)–TDD-Config (376)–TimeAlignmentTimer (377)–TPC-PDCCH-Config (377)–TunnelConfigLWIP (378)–UplinkPowerControl (379)–WLAN-Id-List (382)–WLAN-MobilityConfig (382)6.3.3Security control information elements (382)–NextHopChainingCount (382)–SecurityAlgorithmConfig (383)–ShortMAC-I (383)6.3.4Mobility control information elements (383)–AdditionalSpectrumEmission (383)–ARFCN-ValueCDMA2000 (383)–ARFCN-ValueEUTRA (384)–ARFCN-ValueGERAN (384)–ARFCN-ValueUTRA (384)–BandclassCDMA2000 (384)–BandIndicatorGERAN (385)–CarrierFreqCDMA2000 (385)–CarrierFreqGERAN (385)–CellIndexList (387)–CellReselectionPriority (387)–CellSelectionInfoCE (387)–CellReselectionSubPriority (388)–CSFB-RegistrationParam1XRTT (388)–CellGlobalIdEUTRA (389)–CellGlobalIdUTRA (389)–CellGlobalIdGERAN (390)–CellGlobalIdCDMA2000 (390)–CellSelectionInfoNFreq (391)–CSG-Identity (391)–FreqBandIndicator (391)–MobilityControlInfo (391)–MobilityParametersCDMA2000 (1xRTT) (393)–MobilityStateParameters (394)–MultiBandInfoList (394)–NS-PmaxList (394)–PhysCellId (395)–PhysCellIdRange (395)–PhysCellIdRangeUTRA-FDDList (395)–PhysCellIdCDMA2000 (396)–PhysCellIdGERAN (396)–PhysCellIdUTRA-FDD (396)–PhysCellIdUTRA-TDD (396)–PLMN-Identity (397)–PLMN-IdentityList3 (397)–PreRegistrationInfoHRPD (397)–Q-QualMin (398)–Q-RxLevMin (398)–Q-OffsetRange (398)–Q-OffsetRangeInterRAT (399)–ReselectionThreshold (399)–ReselectionThresholdQ (399)–SCellIndex (399)–ServCellIndex (400)–SpeedStateScaleFactors (400)–SystemInfoListGERAN (400)–SystemTimeInfoCDMA2000 (401)–TrackingAreaCode (401)–T-Reselection (402)–T-ReselectionEUTRA-CE (402)6.3.5Measurement information elements (402)–AllowedMeasBandwidth (402)–CSI-RSRP-Range (402)–Hysteresis (402)–LocationInfo (403)–MBSFN-RSRQ-Range (403)–MeasConfig (404)–MeasDS-Config (405)–MeasGapConfig (406)–MeasId (407)–MeasIdToAddModList (407)–MeasObjectCDMA2000 (408)–MeasObjectEUTRA (408)–MeasObjectGERAN (412)–MeasObjectId (412)–MeasObjectToAddModList (412)–MeasObjectUTRA (413)–ReportConfigEUTRA (422)–ReportConfigId (425)–ReportConfigInterRAT (425)–ReportConfigToAddModList (428)–ReportInterval (429)–RSRP-Range (429)–RSRQ-Range (430)–RSRQ-Type (430)–RS-SINR-Range (430)–RSSI-Range-r13 (431)–TimeToTrigger (431)–UL-DelayConfig (431)–WLAN-CarrierInfo (431)–WLAN-RSSI-Range (432)–WLAN-Status (432)6.3.6Other information elements (433)–AbsoluteTimeInfo (433)–AreaConfiguration (433)–C-RNTI (433)–DedicatedInfoCDMA2000 (434)–DedicatedInfoNAS (434)–FilterCoefficient (434)–LoggingDuration (434)–LoggingInterval (435)–MeasSubframePattern (435)–MMEC (435)–NeighCellConfig (435)–OtherConfig (436)–RAND-CDMA2000 (1xRTT) (437)–RAT-Type (437)–ResumeIdentity (437)–RRC-TransactionIdentifier (438)–S-TMSI (438)–TraceReference (438)–UE-CapabilityRAT-ContainerList (438)–UE-EUTRA-Capability (439)–UE-RadioPagingInfo (469)–UE-TimersAndConstants (469)–VisitedCellInfoList (470)–WLAN-OffloadConfig (470)6.3.7MBMS information elements (472)–MBMS-NotificationConfig (472)–MBMS-ServiceList (473)–MBSFN-AreaId (473)–MBSFN-AreaInfoList (473)–MBSFN-SubframeConfig (474)–PMCH-InfoList (475)6.3.7a SC-PTM information elements (476)–SC-MTCH-InfoList (476)–SCPTM-NeighbourCellList (478)6.3.8Sidelink information elements (478)–SL-CommConfig (478)–SL-CommResourcePool (479)–SL-CP-Len (480)–SL-DiscConfig (481)–SL-DiscResourcePool (483)–SL-DiscTxPowerInfo (485)–SL-GapConfig (485)。

NEMA 1000

NEMA 1000

NEMA MW 1000 M AGNET W IRENEMA Standards Publication MW 1000-2003Magnet WirePublished byNational Electrical Manufacturers Association1300 North 17th Street, Suite 1847Rosslyn, Virginia 22209© Copyright 2003 by the National Electrical Manufacturers Association. All rights including translation into other languages, reserved under the Universal Copyright Convention, the Berne Convention for the Protection of Literary and Artistic Works, and the International and Pan American Copyright Conventions.NOTICE AND DISCLAIMERThe information in this publication was considered technically sound by the consensus of persons engaged in the development and approval of the document at the time it was developed. Consensus does not necessarily mean that there is unanimous agreement among every person participating in the development of this document.The National Electrical Manufacturers Association (NEMA) standards and guideline publications, of which the document contained herein is one, are developed through a voluntary consensus standards development process. This process brings together volunteers and/or seeks out the views of persons who have an interest in the topic covered by this publication. While NEMA administers the process and establishes rules to promote fairness in the development of consensus, it does not write the document and it does not independently test, evaluate, or verify the accuracy or completeness of any information or the soundness of any judgments contained in its standards and guideline publications.NEMA disclaims liability for any personal injury, property, or other damages of any nature whatsoever, whether special, indirect, consequential, or compensatory, directly or indirectly resulting from the publication, use of, application, or reliance on this document. NEMA disclaims and makes no guaranty or warranty, expressed or implied, as to the accuracy or completeness of any information published herein, and disclaims and makes no warranty that the information in this document will fulfill any of your particular purposes or needs. NEMA does not undertake to guarantee the performance of any individual manufacturer or seller’s products or services by virtue of this standard or guide.In publishing and making this document available, NEMA is not undertaking to render professional or other services for or on behalf of any person or entity, nor is NEMA undertaking to perform any duty owed by any person or entity to someone else. Anyone using this document should rely on his or her own independent judgment or, as appropriate, seek the advice of a competent professional in determining the exercise of reasonable care in any given circumstances. Information and other standards on the topic covered by this publication may be available from other sources, which the user may wish to consult for additional views or information not covered by this publication.NEMA has no power, nor does it undertake to police or enforce compliance with the contents of this document. NEMA does not certify, test, or inspect products, designs, or installations for safety or health purposes. Any certification or other statement of compliance with any health or safety–related information in this document shall not be attributable to NEMA and is solely the responsibility of the certifier or maker of the statement.MW1000-2003Page iCONTENTSPage Foreword (xi)How to Use this Publication (xii)Part 1 GENERAL1.1 Scope (1)1.2 Normative References and Authorized Engineering Information (AEI) (1)1.3 Definitions (2)1.4 Materials (4)1.4.1 Conductors – Round, Square, and Rectangular, Copper and Aluminum (4)1.4.2 Insulating Materials (4)1.5 Manufacturing (5)of Insulation (5)1.5.1 Application1.5.2 Intermediate Sizes (5)1.5.3 Joints (5)1.5.4 Packaging (6)Conditions and Parameters (6)1.6 Test1.6.1 Safety Statement (6)of Specimens (6)1.6.2 Selection1.6.3 AmbientConditions of Test (6)Frequency (6)1.6.4 Power1.6.5 Mandrels (7)and Square Wire (7)1.6.6 Rectangular1.6.7 Round Wire (7)Conformance (8)1.6.8 Periodic1.6.9 Retests (8)1.7 Unitsof Measure (8)Class of Magnet Wire (8)1.8 Thermal1.9 OrderingInformation (8)Identification Number (8)1.9.1 ProductOrdering Data (9)1.9.2 MinimumTables1-1 Dimensions for Bare and Film Insulated Round Magnet Wire (10)1-2 Round Copper Wire, Ultra Fine Sizes by Resistance (14)1-3 Dimensions for Round Film Insulated Self-Bonding Magnet Wire (15)1-4 Dimensions for Single Glass Fiber Covered Round Bare,Single Film Coated and Heavy Film Coated Wire (17)1-5 Dimensions for Double Glass Fiber Covered Round Bare,Single Film Coated and Heavy Film Coated Wire (19)1-6 Dimensions for Single Polyester Glass Fiber Covered Round Bare,Single Film Coated and Heavy Film Coated Wire (21)1-7 Dimensions for Double Polyester Glass Fiber Covered Round Bare,Single Film Coated and Heavy Film Coated Wire (23)1-8 Dimensions and Radii for Rectangular Bare Wire (25)Conductor Tolerances (25)Rectangular1-9 BareMW 1000-2003Page ii1-10 Film Insulated Rectangular Magnet WireIncrease in Thickness and Width Due to Film Coating (25)of Square Bare Wire (26)1-11 Dimensions1-12 Heavy and Quadruple Film Insulated Square Magnet WireIncrease in Dimensions Due to Film Coating (27)1-13 Range of Increase in Dimensions, InchesSingle Glass Fiber Covered Heavy Film Insulated Rectangular Copper Wire (28)1-14 Range of Increase in Dimensions, InchesDouble Glass Fiber Covered Bare Rectangular Copper Wire (29)1-15 Range of Increase in Dimensions, InchesDouble Glass Fiber Covered Heavy Film Coated Rectangular Copper Wire (30)1-16 Range of Increase in Dimensions, InchesSingle Polyester Glass Fiber Covered Heavy Film Insulated Rectangular Copper Wire (31)1-17 Range of Increase in Dimensions, InchesDouble Polyester Glass Fiber Covered Bare Rectangular Copper Wire (32)1-18 Range of Increase in Dimensions, InchesDouble Polyester Glass Fiber Covered Heavy Film Coated Rectangular Copper Wire (33)1-19 Single Glass Fiber Covered, Heavy Film Insulated Square Copper Magnet Wire– Minimum Increase and Maximum Overall Dimensions Due to Insulation (34)1-20 Single Polyester Glass Fiber Covered Heavy Film Insulated Square Copper Magnet Wire-Minimum Increase and Maximum Overall Dimensions Due to Insulation (35)1-21 Double Glass Fiber Covered, Bare or Heavy Film Insulated Square Copper Magnet Wire–Minimum Increase and Maximum Overall Dimensions Due to Insulation (36)1-22 Double Polyester Glass Fiber Covered, Bare or Heavy Film Insulated Square Copper Magnet Wire–Minimum Increase and Maximum Overall Dimensions Due to Insulation (37)1-23 Comparison Between AWG and IEC R-40 Series Bare Wire Diameters (38)1-24 Comparison Between NEMA and IEC Increases and Overall Diameters (40)MW1000-2003Page iiiCONTENTS (continued)Part 2 PROPERTIES AND REQUIREMENTSSpecification Number ThermalClassRound Rectangularand SquarePageNo.MW 2-C Polyurethane for solderable applications(Single and Heavy)105 X — 2MW 3-C Polyurethane with self-bonding overcoat forsolderable applications (Types 1 and 2)105 X — 3 MW 5-C Polyester (Single and Heavy) 155 X — 4MW 6-C Polyamide (Single and Heavy) 105 X — 5MW 9-C Epoxy (Single, Heavy, and Triple) 130 X — 6MW 14-C Epoxy (Heavy and Quadruple) 130 — X 7MW 15-A Polyvinyl Acetal (Single and Heavy) 105 X — 8MW 15-C Polyvinyl Acetal (Single, Heavy, and Triple) 105 X — 9MW 16-C Polyimide (Single Heavy, Triple, andQuadruple)240 X — 10–17MW 17-C Polyvinyl acetal overcoated with polyamide(Single and Heavy)105 X — 18 MW 18-A Polyvinyl acetal (Heavy and Quadruple) 105 — X 19MW 18-C Polyvinyl acetal (Heavy and Quadruple) 105 — X 20MW 19-C Polyvinyl acetal with self-bonding overcoat(Types 1, 2 and 3)105 X — 21 MW 20-C Polyimide (Heavy and Quadruple) 240 — X 22MW 24-A Polyester (amide) (imide) overcoated withpolyamide (Single and Heavy)155 X — 23MW 24-C Polyester (amide) (imide) overcoated withpolyamide (Single, Heavy and Triple)155 X — 24MW 26-C Polyester (imide) for solderable applications(Single and Heavy)155 X — 25MW 27-C Polyester (imide) overcoated with polyamidefor solderable applications (Single and Heavy)155 X — 26MW 28-A Polyurethane overcoated with polyamide forsolderable applications (Single and Heavy)130 X — 27MW 28-C Polyurethane overcoated with polyamide forsolderable applications (Single and Heavy)130 X — 28MW 29-C Polyurethane overcoated with polyamide andself-bonding overcoated for solderableapplications (Types 1 and 2)105 X — 29MW 30-C Polyester (amide) (imide) (Single, Heavy, andTriple)180 X — 30MW 31-C Paper covered 90 or105X — 31MW 32-C Double paper single cotton covered 90 or105— X 32–33MW 33-C Paper covered 90 or105— X 34MW 1000-2003Page ivPart 2 PROPERTIES AND REQUIREMENTSSpecification Number ThermalClassRound Rectangularand SquarePageNo.MW 35-A Polyester (amide)(imide) overcoated withpolyamideimide (Single and Heavy)220 X — 35MW 35-C Polyester (amide)(imide) overcoated withpolyamideimide (Single, Heavy and Triple)200 X — 36MW 36-A Polyester (amide)(imide) overcoated withpolyamideimide (Heavy and Quadruple)220 — X 37MW 36-C Polyester (amide)(imide) overcoated withpolyamideimide (Heavy and Quadruple)200 — X 38 MW 41-C Glass fiber covered (Single and Double) 155 X — 39MW 42-C Glass fiber covered (Single and Double) 155 — X 40MW 43-C Glass fiber covered silicone treated(Single and Double)200 — X 41MW 44-C Glass fiber covered silicone treated(Single and Double)200 X — 42MW 45-C Polyester glass fiber covered(Single and Double)155 X — 43MW 46-C Polyester glass fiber covered(Single and Double)155 — X 44MW 47-C Polyester glass fiber covered silicone treated(Single and Double)200 X — 45MW 48-C Polyester glass fiber covered silicone treated(Single and Double)200 — X 46 MW 50-C Glass fiber covered, High Temperatureorganic varnish treated (Single and Double)180 X — 47MW 51-C Polyester glass fiber covered, HighTemperature organic varnish treated (Singleand Double)180 X — 48MW 52-C Glass fiber covered, High Temperatureorganic varnish treated (Single or Double)180 — X 49MW 53-C Polyester glass fiber covered, HighTemperature organic varnish treated (Singleand Double)180 — X 50MW 60-A Aromatic polyamide paper covered (Paper) 220 — X 52–53MW 60-C Aromatic polyamide paper covered (Paper) 220 — X 54–55MW 61-A Aromatic polyamide paper covered (Paper) 220 X — 56–57MW 61-C Aromatic polyamide paper covered (Paper) 220 X — 58–59MW 62-C Aromatic Polyimide tape covered 220 — X 60MW 63-C Aromatic Polyimide tape covered 220 X — 61MW 72-C Polyester (amide)(imide) for HermeticApplications (Heavy)180 X — 62MW 73-A Polyester (amide)(imide) overcoated withpolyamideimide for Hermetic Applications220 X — 63MW 73-C Polyester (amide)(imide) overcoated withpolyamideimide for Hermetic Applications200 X — 64 MW 74-A Polyester (amide)(imide) (Single and Heavy) 220 X — 65(continued)MW1000-2003Page v Part 2 PROPERTIES AND REQUIREMENTSSpecification Number ThermalClassRound Rectangularand SquarePageNo.MW 74-C Polyester (amide)(imide) (Single and Heavy) 200 X — 66MW 75-C Polyurethane for solderable applications(Single and Heavy)130 X — 67MW 76-A Polyester (amide)(imide) overcoated withpolyamide (Single and Heavy)180 X — 68MW 76-C Polyester (amide)(imide) overcoated withpolyamide (Single, Heavy and Triple)180 X — 69MW 77-C Polyester (imide) for solderable applications(Single and Heavy)180 X — 70MW 78-C Polyester (imide) overcoated with polyamidefor solderable applications (Single and Heavy)180 X — 71MW 79-C Polyurethane for solderable applications(Single, Heavy and Triple)155 X — 72MW 80-A Polyurethane overcoated with polyamide forsolderable applications (Single and Heavy)155 X — 73MW 80-C Polyurethane overcoated with polyamide forsolderable applications (Single, Heavy, Triple)155 X — 74 MW 81-C Polyamideimide (Single and Heavy) 220 X — 75MW 82-C Polyurethane for solderable applications(Single, Heavy and Triple)180 X — 76MW 83-C Polyurethane overcoated with polyamide forsolderable applications (Single, Heavy,Triple)180 X — 77MW 102-A Polyester (Amide) (Imide) overcoated withpolyamideimide and self-bonding overcoat(Type 1 and Type 2)180 X — 78MW 102-C Polyester (Amide) (Imide) overcoated withpolyamideimide and self-bonding overcoat(Type 1 and Type 2)180 X — 79TablesS (MW 16-C) Polyimide Single Film Insulated Round Copper Magnet Wire, Thermal Class 240 (11)H (MW 16-C) Polyimide Heavy Film Insulated Round Copper Magnet Wire, Thermal Class 240 (13)T (MW 16-C) Polyimide Triple Film Insulated Round Copper Magnet Wire, Thermal Class 240 (15)Q (MW 16-C) Polyimide Quadruple Film Insulated Round Copper Magnet Wire, Thermal Class 240..17PC (MW 32-C) Range of Increase in Dimensions (Inches) Due to Double Paper Single Cotton Covering (33)PR (MW 60-A) Increase in Dimensions of Rectangular Wire Due to Paper Covering (53)PSQ (MW 60-A) Dimensions 1–4/0 AWG (53)PR (MW 60-C) Increase in Dimensions of Rectangular Wire Due to Paper Covering (55)PSQ (MW 60-C) Dimensions 1–4/0 AWG (55)PR (MW 61-A) Dimensions 4/0–9 AWG (57)PR (MW 61-C) Dimensions 4/0–9 AWG (59)TR (MW 63-C) Insulated Wire Dimensions (61)(continued)MW 1000-2003Page viCONTENTS (continued)Part 2PROPERTIES AND REQUIREMENTS LISTING BY THERMAL CLASS, INSULATION, COATING AND FORMThermal Class Insulation, Covering and Form See Part 2, SectionAluminumCopperPageNo. FILM INSULATED ROUND MAGNET WIRE105 Polyamide -MW6-C 5105 Polyvinyl acetal MW 15-A MW 15-C 8, 9105 Polyvinyl acetal overcoated with polyamide - MW 17-C 18105 Solderable Polyurethane - MW 2-C 2105 Solderable Polyurethane and self-bonding overcoat - MW 3-C 3105 Solderable Polyurethane overcoated with polyamide and self-bonding overcoat -MW29-C 29105 Polyvinyl acetal and self-bonding overcoat - MW 19-C 21 130 Epoxy -MW9-C 6 130 Solderable Polyurethane overcoated with polyamide MW 28-A MW 28-C 27, 28 130 Solderable Polyurethane - MW 75-C 67 155 Polyester -MW5-C 4 155 Polyester (amide)(imide) overcoated with polyamide MW 24-A MW 24-C 23, 24 155 Solderable Polyester (imide) - MW 26-C 25 155 Solderable Polyester (imide) overcoated with polyamide - MW 27-C 26 155 Solderable Polyurethane - MW 79-C 72 155 Solderable Polyurethane overcoated with polyamide MW 80-A MW 80-C 73, 74 180 Polyester(amide)(imide) -MW30-C30 180 Polyester (amide)(imide) overcoated with polyamide MW 76-A MW 76-C 68, 69 180 Polyester (amide)(imide) overcoated withpolyamideimide and self-bonding overcoatMW 102-A MW 102-C 78, 79 180 Solderable Polyester (imide) - MW 77-C 70 180 Solderable Polyester (imide) overcoated with polyamide - MW 78-C 71 180 Hermetic Polyester (amide)(imide) - MW 72-C 62 180 Solderable Polyurethane - MW 82-C 76 180 Solderable Polyurethane overcoated with Polyamide - MW 83-C 77200 Polyester (amide)(imide) overcoated withpolyamideimide -MW35-C 36200 Polyester(amide)(imide) -MW74-C66200 Hermetic Polyester (amide)(imide) overcoated withpolyamideimide -MW73-C 64220 Polyester (amide)(imide) overcoated withpolyamideimideMW 35-A - 37 220 Polyester(amide)(imide) MW74-A- 65 220 Hermetic Polyester (amide)(imide) overcoated withpolyamideimideMW 73-A - 64 220 Polyamideimide MW81-C75 240 Hermetic Polyimide - MW 16-C 10–17FILM INSULATED RECTANGULAR AND SQUARE WIREMW1000-2003Page viiPart 2PROPERTIES AND REQUIREMENTS LISTING BY THERMAL CLASS, INSULATION, COATING AND FORMThermal Class Insulation, Covering and Form See Part 2, SectionAluminumCopperPageNo. 105 Polyvinyl acetal MW 18-A MW 18-C 19, 20130 Epoxy -MW14-C7200 Polyester (amide)(imide) overcoated withpolyamideimide -MW36-C 38220 Polyester (amide)(imide) overcoated withpolyamideimideMW 36-A - 37 240 Polyimide -MW20-C22 FIBROUS COVERED ROUND MAGNET WIRE90 or 105 Paper covered - MW 31-C 31 155 Glass fiber covered - MW 41-C 39 155 Polyester glass fiber covered - MW 45-C 43180 Glass fiber covered, High temperature organicvarnish treated -MW50-C 47180 Polyester glass fiber covered, High temperatureorganic varnish treated -MW51-C 48200 Glass fiber covered, silicone treated - MW 44-C 42 200 Polyester glass fiber covered, Silicone treated - MW 47-C 45 220 Aromatic polyamide paper covered MW 61-A MW 61-C 56–59 220 Aromatic polyimide tape covered - MW 63-C 61FIBROUS COVERED RECTANGULAR & SQUARE MAGNET WIRE90 or 105 Double paper, Single cotton covered - MW 32-C 32–33 90 or 105 Paper covered - MW 33-C 34 155 Glass fiber covered - MW 42-C 40 155 Polyester glass fiber covered - MW 46-C 44180 Glass fiber covered, High temperature organicvarnish treated -MW52-C 49180 Polyester glass fiber covered, High temperatureorganic varnish treated -MW53-C 50200 Glass fiber covered, Silicone treated - MW 43-C 41 200 Polyester glass fiber covered, Silicone treated - MW 48-C 46 220 Aromatic polyamide paper covered MW 60-A MW 60-C 52–55 220 Aromatic polyimide tape covered - MW 62-C 60MW 1000-2003Page viiiCONTENTS (continued)Part 3 TEST PROCEDURES3.1 Safety Statement (1)ROUTINE TESTS3.2 Dimensions (1)3.2.1 Round Wire (1)and Square Wire (3)3.2.2 Rectangularand Flexibility (3)3.3 Adherence3.3.1 Elongation and Mandrel Wrap Method (3)Wrap Method (4)3.3.2 Mandrel3.3.3 Elongation Method (4)Cut and Elongation Method (4)3.3.4 Circumferential3.3.5 Bend and Shot Dielectric Method (4)3.3.6 Flat and Edge Bend Method (4)3.4 Elongation (4)3.5 Heat Shock (6)3.6 Reserved (6)3.7 Springback (Specified for Copper Conductors Only) (6)3.7.1 MandrelWrap Method (6)3.7.2 Deflection Method (All Rectangular and Round Sizes Larger than 14 AWG) (10)3.8 Dielectric Breakdown (11)Procedure—General (11)3.8.1 TestElectrode Method (11)3.8.2 FoilPair Method (12)3.8.3 TwistedPair Method (14)3.8.4 Wound3.8.5 Layer Method (14)Method (14)3.8.6 Bend3.8.7 Cylinder Method (15)3.9 Continuity (17)3.9.1 General (17)3.9.2 High-Voltage Direct Current Continuity (14-44 AWG) (17)3.9.3 Low-Voltage Direct Current Continuity (45-56 AWG) (18)3.10 Completeness of Cure (19)3.10.1 Toluene-Ethanol Boil Method (19)3.10.2 Dissipation Factor Method (20)3.11 Reserved (22)3.12 Coverage (22)3.12.1 Mandrel Wrap Method (22)3.12.2 Flat Bend Method (22)3.13 Solderability (22)3.13.1 General (22)3.13.2 Self-Supported Specimen Method (14-36 AWG) (22)3.13.3 Fixture-Supported Specimen Method (37-56 AWG) (22)MW 1000-2003Page ixPERIODIC CONFORMANCE TESTS3.50 Thermoplastic Flow (24)3.50.1 Apparatus (24)3.50.2 Procedure (24)3.51 Solubility (25)3.51.1 Round Film Insulated Wire (10 AWG and Finer)........................................................25 3.51.2 Round Wire Larger than 10 AWG, Rectangular and Square Wire ............................25 3.52Dielectric Strength at Rated Temperature...............................................................................26 3.52.1 Test Procedure...........................................................................................................26 3.53Reserved.................................................................................................................................26 3.54Transformer Oil Resistance and Hydrolytic Stability...............................................................26 3.54.1 Principal of Test..........................................................................................................26 3.54.2 Test Apparatus...........................................................................................................26 3.54.3 Short Term Exposure Test.........................................................................................26 3.54.4 Long Term Exposure Test..........................................................................................27 3.55Refrigerant (R-22) Extraction ..................................................................................................27 3.55.1 Preparation of Specimens..........................................................................................28 3.55.2 Environmental Conditioning .......................................................................................28 3.55.3 Collecting Residue......................................................................................................29 3.55.4 Determination of Results............................................................................................30 3.56Retained Dielectric after R-22 Conditioning............................................................................30 3.57Bond ........................................................................................................................................31 3.57.1 Preparation of Specimens (31)3.57.2 Heating and Solvent Bonding.....................................................................................31 3.57.3 Room Temperature Bonding......................................................................................32 3.57.4 Elevated Temperature Bond Test Procedure.............................................................32 3.58Thermal Endurance.................................................................................................................33 3.58.1 Test Procedure...........................................................................................................33 3.59Scrape Resistance..................................................................................................................33 3.59.1 Apparatus...................................................................................................................33 3.59.2 Test Procedure...........................................................................................................34 Tables3.2.1Specification for Micrometer Anvil Diameter and Spindle Force...............................................2 3.3.1Adherence and Flexibility: Elongation and Mandrel Diameters ................................................3 3.4.1Minimum Percent Elongation, Square and Rectangular Wire...................................................4 3.4.2 MinimumPercent Elongation, Round Wire...............................................................................5 3.5.1Heat Shock: Elongation and Mandrel Diameters......................................................................6 3.7.1Springback - Mandrel Wrap Method..........................................................................................9 3.8.2Minimum Dielectric Breakdown Voltage—Foil Method...........................................................12 3.8.3.1Twisted Pair Method: Tensions and Rotations........................................................................12 3.8.3.2Minimum Dielectric Breakdown Voltage—Twisted Pair Method.............................................13 3.8.6 BendMethod Mandrel Sizes...................................................................................................14 3.8.7.1Rate of Increase in Voltage—Cylinder Method.......................................................................15 3.8.7.2 Cylinder Method Test Loads (16)MW 1000-2003Page x3.8.7.3 Minimum Dielectric Breakdown Voltage—Cylinder Method (16)3.9.2.1 Test Voltage (DC Volts ±5%) and Maximum Fault Count per 100 Feet (17)3.9.2.2 Threshold Fault Current (18)Continuity—Maximum Fault Count per 100 Feet (19)3.9.3 Low-Voltage3.50.2 Thermoplastic Flow Test Loads (24)Vessel Components (27)3.54.4 PressureSiphonCup Dimensions (28)3.55.1 TypicalTest Parameters (31)3.57.1 Bond3.59.1 Standard Scrape Resistance of Round Film Insulated Magnet Wire (35)3.59.2 Reduced Scrape Resistance of Round Film Insulated Magnet Wire (35)Figuresthe Springback Scale (7)3.7.1.1 Detailsof3.7.1.2 Springback Tester After Winding a Coil Under Tension (8)3.7.1.3 Photograph of Possible Appearance of the Springback Scales (8)3.7.2 Apparatus for Springback Deflection Method (10)PairSpecimen Winder (14)3.8.4 WoundApparatusfor Cylinder Method (15)3.8.7 Test3.9.3 Bath of Mercury or Other Suitable Material (19)3.10.2 Electrode and Specimen Arrangement for Dissipation Factor Test (21)Test Specimen Fixture (23)3.13.3 Solderability3.51.1 MachineSolubility Scrape (25)forExtractable Siphon Cup (28)3.55.1 Refrigerant3.55.2 Condenser Coil (29)3.55.3 Condenser Coil Siphon Cup Assembly (29)CoilPrep Fixture (31)3.57.1 BondStrength Test Fixture (32)3.57.3.1 BondTest Fixture (32)3.57.3.2 Bond3.59.1 MachineScrape Resistance (34)forAppendicesA Reference Test Conditions and Procedures for Film-Insulated Magnet Wire....................................A–1B Magnet Wire Packaging and Labeling................................................................................................B–11000-2003MWPage xiForewordThis publication supersedes NEMA Standards Publication MW 1000-1997. It is currently under review by ANSI for approval as an American National Standard.The standards contained in this publication are periodically reviewed by the NEMA Magnet Wire Section for revisions considered to be necessary to keep them up to date with changes in technology. Proposedor recommended revisions should be submitted to:Vice President, EngineeringNational Electrical Manufacturers Association1300 North 17th Street, Suite 1847Rosslyn, Virginia 22209These standards were developed by the Magnet Wire Section of NEMA, working closely with representatives of various industries that use magnet wire. At the time they were approved, the Magnet Wire Section had the following members:Bridgeport Insulated Wire Company—Bridgeport, CTElektrisola, Inc.—Boscawen, NHMagnekon—San Nicolas, NL, MexicoNexans—Markham, ON, CanadaPhelps Dodge Magnet Wire Company—Fort Wayne, INRea Magnet Wire Company, Inc.—Fort Wayne, INRea Algonquin Osceola Manufacturing Plant (formerly Southwire Company)—Osceola, AREssex Group, Inc.—Fort Wayne, INUniversal Lighting Technologies—Gallman, MSMW 1000-2003Page xiiHow to Use This PublicationPart 1 (blue, if in print) of this publication deals with information common to all types of magnet wire, that is, ordering information, general material requirements, general test conditions, definitions and manufacturing data in support of thermal rating. This part also includes dimensions with metric equivalents for all bare, minimum insulation increase, and overall dimensions for all Part 2 MW specification requirements. The exception to this is MW 16, where the dimensional and other requirements are provided in Part 2.Part 2 (yellow, if in print) consists of product specifications requirements (other than dimensions) for magnet wire with different types of coatings and/or coverings. Insofar as possible, the product specifications are complete on one sheet since they are arranged to include only one insulation or covering per sheet. The title on each individual sheet identifies the product. (Example: MW 15-C, Polyvinyl Acetal Round Copper Magnet Wire. MW 15-A covers the aluminum version of the same generic product).Part 3 (green, if in print) contains the test procedures to be followed and corresponding tables of specific test values to be attained in determining compliance with the requirements given in Part 2. The requirements are consolidated with the test procedures and testing parameters for a given property. An index of the main test paragraphs is given beginning on page viii of the Table of Contents.Appendix A (green, if in print) provides a cross reference between test procedures in this Standards Publication and those published by the American Society for Testing and Materials (ASTM).Appendix B (tan, if in print) consists of definitions, requirements, and recommended test procedures for reusable magnet wire packaging, standardized dimensions for spools and reels, and formatting for the labeling of magnet wire products.First, review Part 1 for general information. Then in Part 2 locate the specification for the type of insulation and conductor of interest. Part 2 is arranged in numerical order as shown beginning on page ii. The dimensions for each Part 2 MW type are provided in Part 1 beginning with Table 1-1. The specification in Part 2 will indicate the requirements to be met and will refer to the test procedures and corresponding test values to be attained in Part 3.。

足球盛宴的科技范——聚焦2018年俄罗斯世界杯黑科技

足球盛宴的科技范——聚焦2018年俄罗斯世界杯黑科技

足球盛宴的科技范——聚焦2018年俄罗斯世界杯黑科技作者：暂无来源：《发明与创新·大科技》 2018年第8期不得不说，2018年俄罗斯世界杯真的挺“聪明”——从有“智慧芯”的足球到球场内的裁判辅助，再到场外的观看体验，很多亮眼的科技元素渗透到了绿茵场，就像那些精彩绝伦的进球一样，给人留下深刻印象。

2018年俄罗斯世界杯于6月14日至7月15日举行,本届世界杯的看点除了球星炫酷的球技、热情的球迷、绿草如茵的球场之外，还有比赛中用到的黑科技。

除了精彩比赛外，作为球场上的关键道具，足球也成为每届世界杯的一大看点。

2018年俄罗斯世界杯官方指定用球“电视之星（Telstar18）”不只在外观上充满现代气息，同时也采用了一些现代化的工艺和科技。

从1970年起，世界杯组委会就指定阿迪达斯来设计比赛专用球，自第一款足球“电视之星”起，至今已经设计了13款风格独特的世界杯足球。

上一届巴西世界杯足球“桑巴荣耀”以6块十字形皮革拼成，而这次的Telstar18不仅名字致敬了第一款足球，结构也继承了上一届的前辈——它也是由六块形状独特的球面组成，运用了无缝粘贴技术，大大节省了皮料。

由于粘胶可以和皮料形成配位化学键，因此可以做到“难解难分”，保证球体的牢固。

但是，结构上的特殊性还不足以称为黑科技—— Telstar18内部装有近场通信芯片，这可以说是黑科技的核心。

近场通信（Near Field Communication，简称NFC）又称近距离无线通信，是一种通过无线电信号实现短距离数据传输的技术。

它最大的优势是可以在0.1毫秒内快速配对，而蓝牙通常需要6秒左右。

这项技术离人们的生活其实并不遥远，很多手机、公交卡、门禁卡都使用了这一技术，只是之前没人将它运用到足球上。

当芯片植入足球之后，足球就可以和靠近它的智能手机中的App进行对接，拥有权限者可以解锁足球内芯片的数据，查看该球的运动轨迹，甚至是研究球员的射门技巧。

OB2203_Demo Board Manual_(120W)

OB2203_Demo Board Manual_(120W)

120W AdaptorDemo Board Manual(OB2203 + OB6563)Key FeaturesPFC is shut down when system goes to standbyStandby power less than 0.29W under 240V AC no loadHigh efficiency more than 87.7% under normal line with full loadOCP with line compensationProgrammable soft start Precise OVP Low components count Meet EN55022 EMI Pass 4kV surge test Pass 15kV/8kV ESD testOn -B ri g ht co n f i de nt i a l toCh a r mr i chIndex1Adaptor Module Specification................................................................................................................................4 1.1 Input Characteristics...................................................................................................................................4 1.2 Output Characteristics................................................................................................................................4 1.3 Performance Specifications........................................................................................................................4 1.4 Soft Start.....................................................................................................................................................4 1.5 Protection Features.....................................................................................................................................5 1.6 Environments..............................................................................................................................................5 1.7 Dielectric withstand....................................................................................................................................5 1.8 Insulation....................................................................................................................................................5 1.9 Leakage current..........................................................................................................................................5 1.10 Printed circuit board...................................................................................................................................5 1.11 EMI.............................................................................................................................................................5 2 Adaptor Module Information. (6)2.1 Schematic...................................................................................................................................................6 2.2 PCB Gerber File.........................................................................................................................................8 2.3 Bill of material............................................................................................................................................9 2.4 Transformer Design..................................................................................................................................11 2.4.1 Transformer Specification.......................................................................................................................11 2.4.2 Transformer Winding data......................................................................................................................11 2.4.3 Boost Inductor Specicfication.................................................................................................................12 2.4.4 Boost Inductor Winding data..................................................................................................................12 2.5 Adaptor Module Snapshot........................................................................................................................12 3 Performance Evaluation. (14)3.1 Input Characteristics.................................................................................................................................15 3.1.1 Input Normal Characteristics....................................................................................................................15 3.1.2 Input current and Standby power..............................................................................................................16 3.1.3 Efficiency..................................................................................................................................................16 3.2 Output Characteristics..............................................................................................................................17 3.2.1 Line Regulation & Load Regulation.........................................................................................................17 3.2.2 Ripple & Noise..........................................................................................................................................17 3.2.3 Overshoot & Undershoot..........................................................................................................................18 3.2.4 Dynamic Test............................................................................................................................................19 3.2.5 Time Sequence..........................................................................................................................................20 3.3 Protections................................................................................................................................................22 3.3.1 Over Current Protection (OCP).................................................................................................................22 3.3.2 Over V oltage Protection (OVP).................................................................................................................22 3.3.3 Short Circuit Protection.............................................................................................................................22 3.4 EMI Test...................................................................................................................................................23 3.4.1 Conducted EMI Test ...............................................................................................................................23 3.4.2 Radiation EMI Test.................................................................................................................................23 3.5 ESD Test...................................................................................................................................................25 3.6 Lighting Test.............................................................................................................................................26 4 Other important waveform (27)On -B ri g ht co n f i de nt i a l toCh a r mr i ch4.1 Vdd, FB, Sense& Gate wave form at no load/25% load/50% load/full load............................................27 4.2MOSFET VDS wave,Output diode V AK waveform at full load,start/normal/output short (28)FiguresRipple & Noise waveform....................................................................................................................................18 Overshoot and Undershoot waveform..................................................................................................................19 Dynamic waveform...............................................................................................................................................20 Time Sequence waveform.....................................................................................................................................21 Vdd,FB,Sense&Gate waveform............................................................................................................................27 MOSFET VDS,CS&V AK start waveform............................................................................................................28 MOSFET VDS,CS&V AK normal operation waveform.......................................................................................28 MOSFET VDS,CS&V AK output short waveform (30)TablesTable 1 Input current at full load...........................................................................................................................16 Table 2 Standby power at no load with LED (with PFC)......................................................................................16 Table 3 Efficiency with PFC part..........................................................................................................................16 Table 4 Line Regulation & Load Regulation........................................................................................................17 Table 5 Ripple & Noise measure results...............................................................................................................17 Table 6 Overshoot/undershoot measurement results.............................................................................................18 Table 7 Output voltage under dynamic test...........................................................................................................20 Table 8 Turn-on delay /hold-up/Rise time/Fall time measurement results............................................................20 Table 9 OCP value vs. input voltage.....................................................................................................................22 Table 10 OVP test result........................................................................................................................................22 Table 11 SCP test result.. (23)On -B ri g ht co n f i de nt i a l toCh a r mr i ch1 Adaptor Module SpecificationModel number:OBPD120W-H240ARev.：011.1 Input CharacteristicsAC input voltage rating 100Vac ~ 240Vac AC input voltage range 90Vac ~ 264Vac AC input frequency range 47Hz ~ 63Hz25A maximum at 115V AC Inrush current at 25°C50A maximum at 230V ACInput current1.56 A rms max.1.2 Output CharacteristicsOutput V oltage 19.0V Output Tolerance ±5% Min. load current 0AMax. load current6.3A1.3 Performance SpecificationsMax. Output Power 120WStandby Power <0.5W @ 240V/50Hz, no loadEfficiency>85% @ normal line, full load , including power loss in input filters Line Regulation<1% Load Regulation<5% Ripple (Po: 10 to 90%) <350 mVpp Noise (F<640KHz) <200mVppHold up Time 16.7m Sec. Min. @100Vac with full loadTurn on Delay Time2 Sec. Max. @100Vac with full load1.4 Soft StartSettling time <15ms to within 1% at nominal loadOvershoot<3%On -B ri g ht co n f i de nt i a l toCh a r mr i ch1.5 Protection FeaturesShort circuit Protection Output shut down with automatic recovery Over V oltage Protection <25VOver Current ProtectionOutput shut down with automatic recovery. The protection functionwill be enabled if output current exceeds 110%~140% of rated outputcurrent.1.6 EnvironmentsOperating Temperature 0 to+40℃℃ Operating Humidity 20% to 90% R.H. Storage Temperature -40 to +60℃℃Storage Humidity0% to 95% R.H.1.7 Dielectric withstandThe power supply shall withstand for 1 minute without breakdown by the application of a 60Hz 1500V AC voltageapplied between both input line and ground (10mA DC cut-off current). Main transformer shall similarly withstand3000Vac applied between both primary and secondary windings for a minimum of one minute.1.8 InsulationThe insulation resistance should be not less than 30 MOHM after applying of 500VDC for 1 minute1.9 Leakage currentThe AC leakage current is less than 3.5mA when the power supply connects to 264V/50Hz AC input voltage.1.10 Printed circuit boardTechnology Single sided FR2Dimensions134mm(L), 88mm(W) and 40mm(H)1.11 EMIMeet international standardsOn -B ri g ht co n f i de nt i a l toCh a r mr i chOri g ht co n f i de nt i a l toCh a r mr i cPWM Part:On -B ri g ht co n f i de nt i a l toCh a r mr i ch2.2 PCB Gerber FileOn -B ri g ht co n f i de nt i a l toCh a r mr i chOOOB2203 Demo Board Manual (OBPD120W_Adapter)Transformer Winding dataWinging Material Start Finish N1 Φ0.45*2 2UEW 不断线 TAPE TAPE W=10mm (Y) 3 Copper Copper W =9mm P =0.02mm 5 4 TAPE TAPE W=10mm (Y) N2 Φ0.60*2 三层绝缘线 TAPE TAPE W=10mm (Y) 7 Copper Copper W 9mm P 0.02mm 5 8 TAPE TAPE W=10mm (Y) N3 Φ0.12*3 2UEW 间绕 TAPE TAPE W=10mm (Y) N1’ 0.45*2 2UEW TAPE TAPE W=10mm (Y) 13 Copper Copper 9mm P 0.02mm 5 14 TAPE TAPE W=10mm (Y) 三层绝缘线16 N40.20*1 三层绝缘线17 TAPE TAPE W=10mm (Y) 18 Copper Copper W 9mm P 0.02mmOri g ht co nf i de t i ChBoost inductor Winding dataWinging Material Start N1Φ0.20*10 利兹线TAPE TAPE W=10mm (Y)N2Φ0.20*1 2UEWTAPE TAPE W=10mm (Y)Adaptor Module SnapshotO rightconfidentohOn -B ri g ht co n f i de nt i a l toCh a r m r i chOOOmraOR&N waveform@90Vac input with no load R&N waveform@90Vac input with full loadR&N waveform@264Vac input with no load R&N waveform@264Vac input with full load3.2.3 Overshoot & UndershootOf i de nt i al toCh a r mr i chOvershoot waveform@90Vac input with full load Overshoot waveform @90Vac input with no loadOvershoot waveform @264Vac input with full load Overshoot waveform @264Vac input with no loadUndershoot waveform @264V ac input with full load3.2.4 Dynamic TestA dynamic loading with low set at 1.26 A lasting for 10mS and high set at 5.0A lasting for 50mS is added tooutput. The ramp is set at 0.125A/uS at transient. All data was measurement at PCB end.On -B ri g ht co n f i de nt i al toCh a r mr i chDynamic waveform @90Vac input Dynamic waveform @132Vac inputDynamic waveform @180Vac input Dynamic waveform @264Vac input3.2.5 Time SequenceOg ht co n f i de nt i a l toCh a r mrTurn on waveform @90Vac input with full load Turn on waveform @264Vac input with full loadHold up waveform @90Vac input with full load Hold up waveform @264Vac input with full loadRise waveform @90Vac input with full load Rise waveform @264Vac input with full loadO-B ri g ht co n f i de nt i a l toCh a r mr i chFall waveform @90Vac with full load Fall waveform @264Vac with full loadProtections O CharmrichOht co n f i de nt i a l toChOn -B ri g ht co n f i de nt i a l toCh a r mr i ch3.5 ESD TestOn -B ri g ht co n f i de nt i a l toCh a r mr i ch3.6 Lighting TestOn -B ri g ht co n f i de nt i a l toCh a r mr i ch4 Other important waveform4.1 Vdd, FB, Sense& Gate wave form at no load/25% load/50% load/fullload.Vdd,FB,Sense&Gate wave form@90Vac; no load Vdd,FB,Sense&Gate wave form@90Vac; 25% loadVdd,FB,Sense&Gate wave form@90Vac; 50% load Vdd,FB,Sense&Gate wave form@90Vac; full loadVdd,FB,Sense&Gate wave form@264Vac; no load Vdd,FB,Sense&Gate wave form@264Vac; 25% loadOn -B ri g ht co nf i de nt i a l toCh ar mr i chVdd,FB,Sense&Gate wave form@264Vac; 50% load Vdd,FB,Sense&Gate wave form@264Vac; full load4.2 MOSFET VDS wave, CS wave and Output diode V AK waveform at fullload, start/normal/output short4.2.1 VDS ,CS & V AK start waveformVDS ,CS & V AK start waveform@90Vac; full load VDS ,CS & V AK start waveform@264Vac; full load4.2.2 VDS ,CS & V AK normal waveformVDS ,CS & V AK normal waveform@90Vac; full load VDS ,CS & V AK normal waveform@90Vac; 2.4A loadOn -B ri g ht co nf i de nt i a l toCh a r mr i chVDS ,CS & V AK normal waveform@90Vac; 1.65A load VDS ,CS & V AK normal waveform@90Vac; 1.45A loadVDS ,CS & V AK normal waveform@90Vac; 1.2A load VDS ,CS & V AK normal waveform@264Vac; full loadVDS ,CS & V AK normal waveform@264Vac; 3.0A load VDS ,CS & V AK normal waveform@264Vac; 2.0A loadOn -B ri g ht co n f i de nt i a l toCh a r mr i chVDS ,CS & V AK normal waveform@264Vac; 1.6A load VDS ,CS & V AK normal waveform@264Vac; 1.4A load4.2.3 VDS ,CS & V AK output short waveformVDS ,CS & V AK output short waveform@90Vac; full load VDS ,CS & V AK output short waveform@264Vac; full loadDisclaimerOn-Bright Electronics reserves the right to make corrections, modifications, enhancements, improvements, and other changes to its documents, products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.This document is under copy right protection. Non of any part of document could be reproduced, modified without prior written approval from On-Bright Electronics.On -B ri g ht co n f i de nt i a l toCh a r mr i ch。

卡梅伦液压数据手册（第 20 版）说明书

卡梅伦液压数据手册（第 20 版）说明书
11
iv
⌂
CONTENTS OF SECTION 1
☰ Hydraulics
⌂ Cameron Hydraulic Data ☰
Introduction. . . . . . . . . . . . . ................................................................ 1-3 Liquids. . . . . . . . . . . . . . . . . . . ...................................... .......................... 1-3
4
Viscosity etc.
Steam data....................................................................................................................................................................................... 6
1 Liquid Flow.............................................................................. 1-4
Viscosity. . . . . . . . . . . . . . . . . ...................................... .......................... 1-5 Pumping. . . . . . . . . . . . . . . . . ...................................... .......................... 1-6 Volume-System Head Calculations-Suction Head. ........................... 1-6, 1-7 Suction Lift-Total Discharge Head-Velocity Head............................. 1-7, 1-8 Total Sys. Head-Pump Head-Pressure-Spec. Gravity. ...................... 1-9, 1-10 Net Positive Suction Head. .......................................................... 1-11 NPSH-Suction Head-Life; Examples:....................... ............... 1-11 to 1-16 NPSH-Hydrocarbon Corrections.................................................... 1-16 NPSH-Reciprocating Pumps. ....................................................... 1-17 Acceleration Head-Reciprocating Pumps. ........................................ 1-18 Entrance Losses-Specific Speed. .................................................. 1-19 Specific Speed-Impeller. .................................... ........................ 1-19 Specific Speed-Suction...................................... ................. 1-20, 1-21 Submergence.. . . . . . . . . ....................................... ................. 1-21, 1-22 Intake Design-Vertical Wet Pit Pumps....................................... 1-22, 1-27 Work Performed in Pumping. ............................... ........................ 1-27 Temperature Rise. . . . . . . ...................................... ........................ 1-28 Characteristic Curves. . ...................................... ........................ 1-29 Affinity Laws-Stepping Curves. ..................................................... 1-30 System Curves.. . . . . . . . ....................................... ........................ 1-31 Parallel and Series Operation. .............................. ................. 1-32, 1-33 Water Hammer. . . . . . . . . . ...................................... ........................ 1-34 Reciprocating Pumps-Performance. ............................................... 1-35 Recip. Pumps-Pulsation Analysis & System Piping...................... 1-36 to 1-45 Pump Drivers-Speed Torque Curves. ....................................... 1-45, 1-46 Engine Drivers-Impeller Profiles. ................................................... 1-47 Hydraulic Institute Charts.................................... ............... 1-48 to 1-52 Bibliography.. . . . . . . . . . . . ...................................... ........................ 1-53

2018年俄罗斯世界杯赛程表,积分排名自动生成

2018年俄罗斯世界杯赛程表,积分排名自动生成
场次
日期
[01] 06月14日 星期四
[02] 06月15日 星期五
[04] 06月16日 星期六
[03] 06月15日 星期五
[05] 06月16日 星期六
[07] 06月17日 星期日
[06] 06月16日 星期六
[08] 06月17日 星期日
[11] 06月18日 星期一
[09] 06月17日 星期日
球队 比分 球队 比赛场馆
俄罗斯
沙特阿拉伯 卢日尼基体育场
埃及
乌拉圭
叶卡捷琳堡中央体育场
葡萄牙
西班牙
圣彼得堡体育场
摩洛哥
伊朗
菲施特奥利匹克体育场
法国
澳大利亚 喀山竞技场
秘鲁
丹麦
萨兰斯克体育场
阿根廷
冰岛
斯巴达克体育场
克罗地亚
尼日利亚 加里宁格勒体育场
巴西
瑞士
顿河畔罗斯托夫体育场
哥斯达黎加
塞尔维亚 萨马拉竞技场
索契
1 哥伦比亚
0 000 0 0 0 0 0
喀山
1 日本
0 000 0 0 0 0 0
莫斯科 下诺夫哥罗德
俄罗斯
萨马拉
A1B2胜者
罗斯托夫
B2
圣彼得堡
莫斯科
法国
C1D2胜者
D2
比赛地
下诺夫哥罗德
巴西
喀山
E1F2胜者
索契
F2
萨马拉
比利时
G1H2胜者
比赛地
H2
圣彼得堡
莫斯科
葡萄牙
B1A2胜者
A2
比赛地 圣彼得堡
德国
墨西哥
卢日尼基体育场
瑞典

咖啡种类知识大全

咖啡种类知识大全

咖啡种类知识大全目录一、咖啡种类概览 (3)1. 咖啡的起源与发展 (4)2. 咖啡的分类与命名 (5)3. 不同地域的咖啡文化 (6)二、主要咖啡品种介绍 (7)1. 阿拉比卡种 (8)1.1 特性概述 (9)1.2 主要品种与产地 (10)1.3 咖啡因含量 (11)1.4 口感与风味 (12)2. 罗布斯塔种 (13)2.1 特性概述 (14)2.2 主要品种与产地 (15)2.3 咖啡因含量 (16)2.4 口感与风味 (17)3. 利比里卡种 (19)3.1 特性概述 (20)3.2 主要品种与产地 (21)3.3 咖啡因含量 (22)3.4 口感与风味 (23)三、咖啡的烘焙与处理 (24)1. 烘焙原理与目的 (25)2. 常见的烘焙程度与处理方法 (26)2.1 浅度烘焙 (27)2.2 中度烘焙 (28)2.3 深度烘焙 (29)2.4 特殊烘焙 (30)3. 烘焙过程中的化学变化 (31)四、咖啡的冲泡方法 (32)1. 滴滤法 (33)2. 法压壶冲泡 (34)3. 虹吸式冲泡 (35)4. 摩卡壶冲泡 (36)5. 冷萃法 (37)6. 水粉比例与水温控制 (38)五、咖啡的品鉴与鉴赏 (39)1. 品鉴步骤与技巧 (40)2. 咖啡的色泽与外观鉴赏 (41)3. 咖啡的香气鉴赏 (42)4. 咖啡的味道与口感鉴赏 (43)5. 咖啡的回味与余韵鉴赏 (44)六、咖啡与健康 (45)1. 咖啡中的主要成分及其作用 (46)2. 咖啡对人体的益处 (48)2.1 提神醒脑 (49)2.2 减肥美容 (50)2.3 抗氧化抗衰老 (51)3. 咖啡与疾病预防 (52)4. 咖啡的副作用及注意事项 (53)七、咖啡与文化 (54)1. 咖啡与文学艺术 (56)2. 咖啡与电影音乐 (57)3. 咖啡与世界各地的饮食文化 (58)4. 咖啡的社会意义与精神价值 (59)一、咖啡种类概览浓缩咖啡（Espresso）：浓缩咖啡是一种通过高压水萃取研磨咖啡豆制成的浓缩饮品，通常作为其他咖啡饮品的基础。

没有最长只有更长 2018巴哈1000越野拉力赛

没有最长只有更长 2018巴哈1000越野拉力赛

没有最长只有更长亚洲巴哈以“一战到底”为标志，以不断打造精品赛事，精品赛道，精品旅游为核心，让扎鲁特旗成为中国乃至世界的汽车文化圣地2018巴哈1000越野拉力赛文、摄影/孙燕初2018巴哈1000越野拉力赛组。

这是中国越野车手首次以“一战到底”的赛制挑战1000公里超长赛道，气势恢宏的千里追逐、一气呵成的英雄气魄，不仅激发了国内顶尖车手的参与热情，还吸引了来自美国、澳大利亚等国的越野名将。

今年的亚洲巴哈1000·一战到底越野赛的赛道位于扎鲁特旗全境，专业组和挑战组将完成不同的距离，专业组赛手须在14小时内完成比赛，赛段全长约880公里（后因故缩短为650公里）；挑战组为10小时（赛段长约366公里）。

18日的排位赛成绩为第二天超长赛段的发车顺序。

单个赛段长度达到650公2018亚洲巴哈1000·一战到底越野拉力赛今年规格上有了升级，成为中国汽车越野锦标赛的分站赛，全部赛程都在内蒙古扎鲁特旗。

赛事于8月18日拉开战幕，来自国内外的近300名车手、119台赛车欢聚通辽市扎鲁特旗，展开了一场“一战到底”的巅峰挑战。

今年无论在专业车手的数量还是总的参赛规模都比去年第一届赛事提升很多，这说明赛事得到了越来越多的车手的认可。

赛事设立了专业组的两驱组、四驱组、UTV 组以及挑战组的四驱组、皮卡组和UTV里，这是目前国内最长的单个赛段长度，也是巴哈1000越野拉力赛的特点，车手们需要一战到底，一个超长赛段决胜负。

这对赛车的可靠性和车手领航的身体素质都是很大的考验。

巴哈1000越野拉力赛的赛道赛前就已经开放，车手们可以自行勘路、做路书，这也是区别于其他长距离越野拉力赛的地方。

赛段都是有形的草原砂石路，但有着复杂的岔路，对于疾驰的领航员来讲，尽管有轨迹可寻但要迅速及时地判断路线并传达给车手不是一件容易的事情。

许多领航就错过了下路1口而走错路。

巴哈1000赛事还有一点与众不同，参赛车手可以在组委会指定的两个维修点进行中途加油、维修，甚至更换车手。

Imagine Cup(微软创新杯简介)微软全球学生大赛介绍

Imagine Cup(微软创新杯简介)微软全球学生大赛介绍

参赛资格 2010 年秋季学年度到 2011 年春季学年度中国大陆地区在校注册学生(包括中学、中专、 大专、大学本科和大学研究生)。 竞赛方式 软件设计（中国区）选拔赛1： 报名时间 2010 年 7 月 9 日—2011 年 1 月 9 日 报名方式 请于报名截止日期前， 在 Imagine Cup 全球站点 或中文站点 上报名注册（注：仅在其中一个网站注册报名即可） 。 提交方式 1. 初赛：提交《项目计划书》 。请于 2011 年 1 月 9 日前，以 Word 文档形式按照项目 计划书模版要求在线提交。 2. 复赛：提交文档、视频和软件运行文件。2011 年 4 月 1 日前以光盘形式邮寄到北 京市朝阳区望京街 8 号利星行广场 C 座微软大厦 20 层，创新杯项目组收”，邮编：
Imagine Cup 2006 全球总决赛在印度举行，中国学生获得界面设计项目全球第二名!
北京工业大学代表队在软件设计比赛中连闯三关, 最终进入全球前六强， 并获得赴英国参加 Imagine Cup Innovation Accelerator 培训项目的机会! 中国学生还获得了视频游戏比赛项目的 全球第五名!
中文站点： 全球站点： 微软学生技术中心：/china/msdn/student
6
Imagine Cup 2011 参赛说明
参赛主题 Imagine a world where technology helps solve the toughest problems 比赛项目
报名和第一轮比赛 截止日期 2011 年 1 月 9 日 2011 年 1 月 9 日 2011 年 3 月 7 日 2011 年 3 月 7 日 2011 年 3 月 7 日 2011 年 1 月 31 日 2011 年 3 月 7 日 2011 年 4 月 27 日

PNY Quadro 世界最强工作站图形卡说明书

PNY Quadro 世界最强工作站图形卡说明书

PNY Technologies, Inc. 100 Jefferson Road, Parsippany, NJ 07054 Tel 408 567 5500 | Fax 408 855 0680For more information visit: /quadro 1 Via adapter/connector/bracket | 2 Windows 7, 8, 8.1, 10 and Linux | 3 Product is based on a published Khronos Specification, and is expected to pass the Khronos Conformance Testing Process when available. Current conformance status can be found at /conformance | 4 GPU supports DX 12.0 API, Hardware Feature Level 12_1© 2016 NVIDIA Corporation and PNY. All rights reserved. NVIDIA, the NVIDIA logo, Quadro, nView, CUDA, and NVIDIA Maxwell are trademarks and/or registered trademarks of NVIDIA Corporation in the U.S. and other countries. The PNY logotype is a registered trademark of PNY Technologies. OpenCL is a trademark of Apple Inc. used under license to the Khronos Group Inc. All other trademarks and copyrights are the property of their respective owners. APR16The World’s Most Powerful Workstation Graphics Card.The NVIDIA M6000 24GB is the world’s most powerful workstation graphics card, giving you the extreme performance and on-board memory to take on your biggest visualization challenges.Artists, animators, and editors can now work in real-time on their most complex projects with multiple layers and advanced effects. Plus, product designers and engineers don’t have to compromise on model complexity or image quality when working on large assemblies; they can now integrate interactive, physically based rendering and simulation to evaluate product design and functionality in entirely new ways. Geophysicists can also accelerate their time-to-insight in seismic exploration by holding substantially larger data sets in memory for faster processing and analysis.Quadro cards are certified with a broad range of sophisticated professional applications, tested by leading workstation manufacturers, and backed by a global team of support specialists. This gives you the peace of mind to focus on doing your best work. Whether you’re developing revolutionary products or telling spectacularly vivid visual stories, Quadro gives you the performance to do it brilliantly.THE PNY ADVANTAGE PNY provides unsurpassed service and commitment to its professional graphics customers. In addition, PNY delivers a complete solution that includes the appropriate adapters, cables, brackets, driver software installation disc, and documentation to ensure a quick and successful install.FEATURES >Support for any combination of four connected displays >Four DisplayPort 1.2 Connectors >DisplayPort with Audio >One DVI-I Dual-Link Connector >VGA Support 1 >3D Stereo Support 1 >NVIDIA GPUDirect ™ Support >Quadro Sync Compatibility >Stereo Connector >NVIDIA nView ® multidisplay technology >NVIDIA Mosaic 2PACKAGE CONTENTS >NVIDIA Quadro M6000 24GB Professional Graphics Board >Software Installation Disc >Printed Quick Start Guide >8-Pin Auxiliary Power Cable >Stereo Connector Bracket >Three DisplayPort to DVI-D SL Adapters >DVI to VGA Adapter WARRANTY AND SUPPORT >3-Year Warranty >Pre- and Post-Sales Technical Support >Dedicated Field Application Engineers >Direct Tech Support Hot Lines PNY PART NUMBER VCQM6000-24GB-PB SPECIFICATIONS GPU Memory 24 GB GDDR5 Memory Interface 384-bit Memory Bandwidth Up to 317 GB/s NVIDIA CUDA ® Cores 3072 Peak Single Precision Performance Up to 7 TFLOPs System Interface PCI Express 3.0 x16 Max Power Consumption 250 W Thermal Solution Ultra-Quiet Active Fansink Form Factor 4.4” H × 10.5” L, Dual Slot, Full Height Display Connectors 4x DP 1.2, DVI-I DL, Optional Stereo Max Simultaneous Displays 4 direct, 4 DP 1.2 Multi-Stream Max DP 1.2 Resolution 4096 × 2160 at 60 Hz Max DVI-I DL Resolution2560 × 1600 at 60 Hz Max DVI-I SL Resolution1920 × 1200 at 60 Hz Max VGA Resolution2048 × 1536 at 85 Hz Graphics APIs Shader Model 5.0, OpenGL 4.53 , DirectX 12.04, Vulkan 1.03Compute APIsCUDA, DirectCompute, OpenCL ™REAL INTERACTIVE EXPRESSION NVIDIA ® QUADRO ®M6000 24GB。

世界杯特辑2018年俄罗斯世界杯观赛指南!

世界杯特辑2018年俄罗斯世界杯观赛指南!

世界杯特辑2018年俄罗斯世界杯观赛指南!蔡雅婷【期刊名称】《消费电子》【年(卷),期】2018(000)007【总页数】4页(P60-63)【作者】蔡雅婷【作者单位】【正文语种】中文想必今年夏天最振奋人心的活动莫过于2018年俄罗斯世界杯了，作为四年一度的足球盛宴，世界杯开幕式于北京时间6月14日晚在俄罗斯卢日尼基体育场拉开序幕。

无论你是资深球迷，还是足球小白；无论你是主要看球，还是主要看脸……请搬好小板凳，在电视机前或VIP观众席坐好，带上你的看球装备，为支持的球队/帅哥摇旗呐喊、加油助威，尽情参与到今夏最热情的比赛中来！世界杯必备影院级装备作为一场全球性的足球盛事，6月14日至7月15日，2018年世界杯在俄罗斯境内11座城市的12座球场展开角逐，巴西、德国、阿根廷、西班牙、法国等各大豪门的铁杆粉自然不会错过主队的任何一场比赛。

因此，贴心的小编特为广大球迷精挑细选了几款产品作为推荐，让你即使“错失”2018年世界杯决赛的门票，也不用太过伤心。

BenQ W1700投影仪一群朋友看球赛，一款家庭式投影仪相较电视机会更适合，其屏幕不但比电视大，还便于收纳，非常适合聚会时光。

BenQ W1700投影仪圆润的外形搭配黑白配色，更能够融入各类家居风格。

BenQ W1700投影仪能够呈现830万独立像素点并支持HDR高动态范围。

同时，它的投射比为1.47-1.76，支持1.2倍的镜头缩放，可投射出60-300英寸大小的画面。

值得一提的是，投射100英寸只需要3.25米的空间。

YAMAHA YAS-207回音壁音响YAS-207机身配备四个46mm低音单元和两个25mm高音单元，内含一个无线超低音单元，可实现100W的高功率输出。

YAS-207不仅具备杜比全景声和DTS 的解码功能，还支持全新的DTS Virtual∶X，可模拟出犹如DTS∶X一般的3D环绕音场效果，让观看世界杯的球迷宛如身临现场般，沉浸于欢呼声之中。

  1. 1、下载文档前请自行甄别文档内容的完整性，平台不提供额外的编辑、内容补充、找答案等附加服务。
  2. 2、"仅部分预览"的文档,不可在线预览部分如存在完整性等问题,可反馈申请退款(可完整预览的文档不适用该条件!)。
  3. 3、如文档侵犯您的权益，请联系客服反馈,我们会尽快为您处理(人工客服工作时间：9:00-18:30)。
工之家微信群； 5、参考附图
9 | © EMKA Beschlagteile | PowerPoint-Master 2017
A strong partner by your side!
5 | © EMKA Beschlagteile | PowerPoint-Master 2017
一 活动名称 —— “爱姆卡世界杯趣味竞猜” 二 活动时间：2018年6月15-7月15 三 参赛对象：公司全体员工（自愿参与） 四 竞猜项目（识别二维码）
1、16强赛队伍；2、8强赛队伍； 3、4强赛队伍；4、半决赛队伍； 5、决赛队伍；
附表
小组分组
8 | © EMKA Beschlagteile | PowerPoint-Master 2017
二维码竞猜操作：
1、打开微信“扫一扫”功能，识别二维码； 2、在生成的界面中选择预测小组出现队伍（每
个小组2只队伍）；
3、各小组选定出现队伍后点击“进入淘汰赛” 按钮；
4、生成的界面进行截图、保存并发送到公司员
关于公司内部对俄罗斯世界杯期间的活动策划
32 个国家！ 736 名健将！ 31 天的时间！ 2018 年最重要 的事：俄罗斯世界杯，已经火热登场！
世界杯既是球迷的盛会，也是企业的盛会。俄罗斯世 界杯到来之际，由管理部、人事部及市场部组织同事们关 注赛程，并将在公司内部打造世界杯氛围，以及世界杯决 赛有奖竞猜活动，我们希望借此把企业文化渗透到每个员 工，丰富员工业余生活，缓解员工压力，增进员工之间的 亲密感，从中学会团队协作，培养团队合作精神。
即
便
…………

依 然 没 有 中 国 队
可以不看，可以不听，但你无法阻挡它滔滔如黄河之水的迅猛冲击。
梦想与失落、期待与绝望、欣喜若狂与泪流满面
3 | © EMKA Beschlagteile | PowerPoint-Master 2017
4 | © EMKA Beschlagteile | PowerPoint-Master 2017
足球的魅力不仅限于那华丽的舞步和激情的挥洒、也 不光是赢球后的狂喜和失败后伤心的泪水，还有那不可预 知的结果让我们充满期待。世界杯是一个充满神奇的舞台， 每届的世界杯总有那么几支球队的表现让我们瞠目结舌， 比如98年法国世界杯的克罗地亚、02年日韩世界杯的土耳 其。也正是因为这些“黑马”的存在让世界杯充满了更多 的亮点，变得更加精彩。那么今年的世界杯又有谁会成为 整个世界的焦点呢？请大家积极参与我们的世界杯竞猜活 动，在乐趣的同时赢取大奖。
Ingenious Locking Technology.
Planning team Deyan Yang\ Raeka Han \Lynn Weng\ Yang Wang \Lidong Guo 2018.06.15
2 | © EMKA Beschlagteile | PowerPoint-Master 2017
6 | © EMKA Beschlagteile | PowerPoint-Master 2017
五 参赛规则
公司员工通过微信识别二维码生成竞猜结果 图片，发到EMKA员工之家微信群（每人只可提 供一次竞猜结果）
六 奖励规则 竞猜全部答对的人员公司会有神秘“奖励”
7 | © EMKA Beschlagteile | PowerPoint-Master 2017
相关文档
最新文档