中科院微电子机械系统设计MEMS课件
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3. Lateral dimensions defined by photolithography, a
process derived from offset printing Result: CMOS integrated circuits became the
ultimate “enabling technology” by circa 1980 Moore’s Law
10 nm < L < 1 mm Nano electromechanical systems … NEMS
Batch Fabrication Technology
Planar integrated circuit technology 1958 -
1. Thin-film deposition and etching 2. Modification of the top few mm of the substrate
Energy density scaling for this type of motor indicated performance degradation as dimensions were reduced …
Materials incompatibility with Stanford’s Microelectronics Lab research focus on electronic devices became a major issue
Did Harvey hear about Richard Feynman’s talk in 1959? I don’t think so …
Planar IC Technology
Planar IC Technology
Why Didn’t MEMS Take Off
in 1965?
Resonant gate transistor was a poor on-chip frequency reference metals have a high temperature sensitivity and don’t have a sharp resonance (low-Q) … specific application didn't “fly”
inkjet-printer cartridges accelerometers Microengines inertial sensors micromirrors, optical scanners fluid pumps, chemical, pressure and flow
sensors. Biosensors
What are the Goals of this Course?
Accessible to a broad audience minimal prerequisites
Design emphasis exposure to the techniques useful in analytical design of structures,transducers, and process flows
Introduction to MEMS Spring 2012
Weidong Yi
Design, Analysis , Fabrication
Course Overview
Part 1 Introduction to MEMS Part 2 Microfabrication Fundamentals Part 3 Microsystem Fabrication Processes Part 4 Mechanics, and Transduction Part 5 Electronic Interface Design Principles Part 6 MEMS Design Case Studies
2. Planar IC Technology
1958 Robert Noyce – Fairchild and Jack Kilby (Nobel Prize, Physics,2000) -Texas Instruments invent the integrated circuit
By the early 1960s, it was generally recognized that this was the way to make electronics small … and cheaper. The planar process allowed for the integration of multiple semiconductor devices onto a single piece of silicon
MEMS involve both electronic and non-electronic elements
thermal, magnetic, fluidic and optical devices
MEMS are “systems” in the true sense
Packaging, system partitioning into components, calibration, signal-to-noise ration,stability,reliability
MEMS may involve large arrays of microfabricated elements
DNA array, infrared imaging devices, both reflective and refractive projection displays
Exatch Fabrication
Processes
Historically, there aren't that many examples outside of chemical processes
However, that’s changing:
Soft (rubber-stamp) lithography Parallel assembly processes enable low-cost
Perspective on MEMS research and commercialization circa
Course Mechanics
Lectures: Monday, Wednesday 10:00-12:00 Homework: bi-weekly assignments distributed
Textsbook: 1. Stephen D. Senturia, Microsystem Design,
Kluwer Academic Press, 2001 2. Course Reader (Selected Reference Papers)
Part 1
Introduction to MEMS
In 1968, Robert Newcomb (Stanford, now Maryland)proposed and attempted to fabricate a surface micromachined electromagnetic motor after seeing the Westinghouse work
Lecture Outline
Today’s Lecture
What is MEMS Historical tour of MEMS MEMS and nanotechnology
MEMS Defined
Micro ElectroMechanical Systems
What is MEMS
Planar IC Technology
Harvey Nathanson and William Newell, got a surface-micromachined resonant gate transistor,
(Westinghouse, 1965)
The device operates a high-Q electromechanical filter
Dimensional Ranges
1 mm < L < 300 mm lateral dimensions
Surface micromachined structures … “classic MEMS”
300 mm < L < 3 mm
Bulk silicon/wafer bonded structures … still call them MEMS and cover them in this course
on Thursdays and due the following Thursday at the class beginning Exam: (TBA) Office Hours: (TBA) Credit breakdown (approximate)
10% homework 30% final Project 60% final exam
fabrication of MEMS from micro/nano components made using other batch processes …
“heterogeneous integration”
A Brief History of MEMS: 1. Feynmann’s Vision
Density (and performance, broadly defined) of digital integrated circuits increases by a factor of two every year.
Moore’s Law
Moore’s Law
In the 1990s the number of transistors on microprocessors continued to double nearly every 18 months. The rate of change followed an early prediction made by American semiconductor pioneer Gordon Moore. In 1965 Moore predicted that the number of transistors on a computer chip would double every year, a prediction that has come to be known as Moore’s Law. In the mid-1990s chips included the Intel Pentium Pro, containing 5.5 million transistors; the UltraSparc-II, by Sun Microsystems, containing 5.4 million transistors; the PowerPC620, developed jointly by Apple, IBM, and Motorola, containing 7 million transistors; and the Digital Equipment Corporation's Alpha 21164A, containing 9.3 million transistors. By the end of the decade microprocessors contained many millions of transistors, transferred 64 bits of data at once, and performed billions of instructions per second.
process derived from offset printing Result: CMOS integrated circuits became the
ultimate “enabling technology” by circa 1980 Moore’s Law
10 nm < L < 1 mm Nano electromechanical systems … NEMS
Batch Fabrication Technology
Planar integrated circuit technology 1958 -
1. Thin-film deposition and etching 2. Modification of the top few mm of the substrate
Energy density scaling for this type of motor indicated performance degradation as dimensions were reduced …
Materials incompatibility with Stanford’s Microelectronics Lab research focus on electronic devices became a major issue
Did Harvey hear about Richard Feynman’s talk in 1959? I don’t think so …
Planar IC Technology
Planar IC Technology
Why Didn’t MEMS Take Off
in 1965?
Resonant gate transistor was a poor on-chip frequency reference metals have a high temperature sensitivity and don’t have a sharp resonance (low-Q) … specific application didn't “fly”
inkjet-printer cartridges accelerometers Microengines inertial sensors micromirrors, optical scanners fluid pumps, chemical, pressure and flow
sensors. Biosensors
What are the Goals of this Course?
Accessible to a broad audience minimal prerequisites
Design emphasis exposure to the techniques useful in analytical design of structures,transducers, and process flows
Introduction to MEMS Spring 2012
Weidong Yi
Design, Analysis , Fabrication
Course Overview
Part 1 Introduction to MEMS Part 2 Microfabrication Fundamentals Part 3 Microsystem Fabrication Processes Part 4 Mechanics, and Transduction Part 5 Electronic Interface Design Principles Part 6 MEMS Design Case Studies
2. Planar IC Technology
1958 Robert Noyce – Fairchild and Jack Kilby (Nobel Prize, Physics,2000) -Texas Instruments invent the integrated circuit
By the early 1960s, it was generally recognized that this was the way to make electronics small … and cheaper. The planar process allowed for the integration of multiple semiconductor devices onto a single piece of silicon
MEMS involve both electronic and non-electronic elements
thermal, magnetic, fluidic and optical devices
MEMS are “systems” in the true sense
Packaging, system partitioning into components, calibration, signal-to-noise ration,stability,reliability
MEMS may involve large arrays of microfabricated elements
DNA array, infrared imaging devices, both reflective and refractive projection displays
Exatch Fabrication
Processes
Historically, there aren't that many examples outside of chemical processes
However, that’s changing:
Soft (rubber-stamp) lithography Parallel assembly processes enable low-cost
Perspective on MEMS research and commercialization circa
Course Mechanics
Lectures: Monday, Wednesday 10:00-12:00 Homework: bi-weekly assignments distributed
Textsbook: 1. Stephen D. Senturia, Microsystem Design,
Kluwer Academic Press, 2001 2. Course Reader (Selected Reference Papers)
Part 1
Introduction to MEMS
In 1968, Robert Newcomb (Stanford, now Maryland)proposed and attempted to fabricate a surface micromachined electromagnetic motor after seeing the Westinghouse work
Lecture Outline
Today’s Lecture
What is MEMS Historical tour of MEMS MEMS and nanotechnology
MEMS Defined
Micro ElectroMechanical Systems
What is MEMS
Planar IC Technology
Harvey Nathanson and William Newell, got a surface-micromachined resonant gate transistor,
(Westinghouse, 1965)
The device operates a high-Q electromechanical filter
Dimensional Ranges
1 mm < L < 300 mm lateral dimensions
Surface micromachined structures … “classic MEMS”
300 mm < L < 3 mm
Bulk silicon/wafer bonded structures … still call them MEMS and cover them in this course
on Thursdays and due the following Thursday at the class beginning Exam: (TBA) Office Hours: (TBA) Credit breakdown (approximate)
10% homework 30% final Project 60% final exam
fabrication of MEMS from micro/nano components made using other batch processes …
“heterogeneous integration”
A Brief History of MEMS: 1. Feynmann’s Vision
Density (and performance, broadly defined) of digital integrated circuits increases by a factor of two every year.
Moore’s Law
Moore’s Law
In the 1990s the number of transistors on microprocessors continued to double nearly every 18 months. The rate of change followed an early prediction made by American semiconductor pioneer Gordon Moore. In 1965 Moore predicted that the number of transistors on a computer chip would double every year, a prediction that has come to be known as Moore’s Law. In the mid-1990s chips included the Intel Pentium Pro, containing 5.5 million transistors; the UltraSparc-II, by Sun Microsystems, containing 5.4 million transistors; the PowerPC620, developed jointly by Apple, IBM, and Motorola, containing 7 million transistors; and the Digital Equipment Corporation's Alpha 21164A, containing 9.3 million transistors. By the end of the decade microprocessors contained many millions of transistors, transferred 64 bits of data at once, and performed billions of instructions per second.