LQFP,TQFP,QFP封装尺寸图解及区别.pptx

LQFP,TQFP,QFP,CQFP封装尺寸表

D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。

LQFP,TQFP,QFP,CQFP封装尺寸表

D u m m y C o m p o n e n t sLQFPLow Profile Quad Flat PackLow Profile Quad Flat Pack (LQFP) packages provide the same benefit of the metric QFP packages, but are thinner (body thickness of 1.4mm) and have a standard lead-frame footprint (2.0mm lead footprint).LQFPs help to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 256. Body sizes range from 5 x 5mm to 28 x 28mm. Copper lead-frames are used for the LQFP package. Lead pitches available for LQFP package are 0.65mm, 0.5mm, 0.4mm.Notes* = Available as an ExposedPad™ L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB. All LQFPs are standard in trays.LQFPs have a body thickness of 1.4mm. Tray quantity may vary. Tape type is plastic.Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.For recommended kits see pages58, 68, 71, 81, 73 and 70.Part Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn or SnCu or SnBi.LQFP48–7mm–.5mm–2.0Low Profile Quad Flat PackNumber of Pins Lead PitchBody SizeLead FootprintLQFP Low Profile Quad Flat Pack 1.4mm ThickPart NumberNumber of Pins Body Size Lead Pitch Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel AvailableLead-Free Finishes .4mm PitchLQFP64-7mm-.4mm-2.0647mm sq .4mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP80-10mm-.4mm-2.08010mm sq .4mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP120-14mm-.4mm-2.012014mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14mm-.4mm-2.012814mm sq .4mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP176-20mm-.4mm-2.017620mm sq .4mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP216-24mm-.4mm-2.021624mm sq .4mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP256-28mm-.4mm-2.025628mm sq .4mm 2444mm 40mm 500Sn, SnCu or SnBi .5mm PitchLQFP48-7mm-.5mm-2.0487mm sq .5mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP64-10mm-.5mm-2.06410mm sq .5mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-12mm-.5mm-2.08012mm sq .5mm 9024mm 20/24mm 1,000Sn, SnCu or SnBi LQFP100-14mm-.5mm-2.010014mm sq .5mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP128-14x20mm-.5mm-2.012814 x 20mm .5mm 7244mm 32mm 500Sn, SnCu or SnBi LQFP128-20mm-.5mm-2.012820mm sq .5mm 6044mm 24mm 500Sn, SnCu or SnBi LQFP144-20mm-.5mm-2.0*14420mm sq .5mm 6044mm 24mm 750Sn, SnCu or SnBi LQFP160-24mm-.5mm-2.016024mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP176-24mm-.5mm-2.0*17624mm sq .5mm 4044mm 32mm 500Sn, SnCu or SnBi LQFP208-28mm-.5mm-2.0*20828mm sq .5mm 3644mm 40mm 500Sn, SnCu or SnBi .65mm PitchLQFP52-10mm-.65mm-2.05210mm sq .65mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP80-14mm-.65mm-2.08014mm sq .65mm 9032mm 24mm 750Sn, SnCu or SnBi LQFP100-14x20mm-.65mm-2.010014x20mm .65mm 7244mm 32mm 500Sn, SnCu or SnBi .8mm PitchLQFP32-7mm-.8mm-2.0327mm sq .8mm 25016mm 12mm 1,000Sn, SnCu or SnBi LQFP44-10mm-.8mm-2.04410mm sq .8mm 16024mm 24mm 1,000Sn, SnCu or SnBi LQFP64-14mm-.8mm-2.06414mm sq.8mm9032mm24mm750Sn, SnCu or SnBiDaisy-Chain And Lead-Free Parts Available!For drawings, please visit our web site at .Dummy ComponentsTQFPThin Quad Flat PackThin Quad Flat Pack (TQFP) packages provide the same benefit of the metric QFP package, but are thinner (body thickness of 1.0mm) and have a standard lead-frame footprint (2.0mm lead footprint). TQFPs are help-ing to solve issues such as increasing board density, die shrink programs, thin end-product profile and portability. Lead counts range from 32 to 176. Body sizes range from 5 x 5mm to 20 x 20mm. Copper lead-frames are used for the TQFP package. Lead pitches available for TQFP package are 0.4mm, 0.5mm, 0.65mm 0.8mm and 1.0mm.Exposed Pad L/TQFP PackageTQFP PackageMold Die Up (Standard)Die AttachDie Down (Inverted)Notes* = Available as an Exposed Pad L/TQFP Package by Amkor. TheExposedPad™ L/TQFP can increase heat dissipation by as much as 110% over a standard L/TQFP. The E xposedPad™ L/TQFP is a cost effective, high frequency leadframe solution to thermal management when the die attach pad is soldered to the PCB.TQFP is available in die up configurations in 1.0mm thickness only. 5 x 5mm to 20 x 20mm body size (JEDEC Standard). 32 to 176 lead counts. Copper leadframes.1.0mm body thickness for TQFP. Moisture sensitivity is JEDEC level 3.Lead-free parts are available with SnCu, SnBi or 100% Sn finish.Part Number System▪ Add “ePad” to beginning of part number when orderingExposedPad™ package.▪ Add “TR” to end of part number for Tape and Reel.▪ Add “LF” to end of part number for Lead-Free.Mold Die Up (Standard)TQFP Thin Quad Flat Pack 1.0mm ThickPart NumberNumber of Pins Body SizeLead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity Per Reel A-TQFP32-5mm-.5mm-2.0*325mm sq .5mm 2.0mm 36016mm 12mm 1,000A-TQFP32-7mm-.8mm-2.0*327mm sq .8mm 2.0mm 25016mm 12mm 1,000A-TQFP40-5mm-.4mm-2.0*405mm sq .4mm 2.0mm 36016mm 12mm 1,000A-TQFP44-10mm-.8mm-2.0*4410mm sq .8mm 2.0mm 16024mm 16mm 1,000A-TQFP48-7mm-.5mm-2.0 *487mm sq .5mm 2.0mm 25016mm 12mm 1,000A-TQFP52-10mm-.65mm-2.0 *5210mm sq .65mm 2.0mm 16024mm 16mm 1,000A-TQFP64-7mm-.4mm-2.0*647mm sq .4mm 2.0mm 25016mm 12mm 1,000A-TQFP64-10mm-.5mm-2.0*6410mm sq .5mm 2.0mm 16024mm 16mm 1,000A-TQFP64-14mm-.8mm-2.0 *6414mm sq .8mm 2.0mm 9032mm 24mm 750A-TQFP80-12mm-.5mm-2.0 *8012mm sq .5mm 2.0mm 11924mm 24mm 1,000A-TQFP80-14mm-.65mm-2.0*8014mm sq .65mm 2.0mm 9032mm 24mm 750A-TQFP100-14mm-.5mm-2.0*10014mm sq .5mm 2.0mm 9032mm 24mm 750A-TQFP120-14mm-.4mm-2.0 *12014mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-14mm-.4mm-2.0*12814mm sq .4mm 2.0mm 9032mm 24mm 750A-TQFP128-20mm-.5mm-2.0 *12820mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP144-20mm-.5mm-2.0 *14420mm sq .5mm 2.0mm 6044mm 24mm 500A-TQFP176-20mm-.4mm-2.0 *17620mm sq.4mm2.0mm6044mm24mm500A-TQFP32-5mm-.5mm-2.0Thin Quad Flat PackBody SizeLead FootprintNumber of PinsLead PitchAmkorD u m m y C o m p o n e n t sNotesAll QFPs are standard in JEDEC trays. Tray quantities may vary. Carrier tape is plastic.SnCu, SnBi or 100% Sn finish.QFPQuad Flat PackQuad Flat Pack (QFP) components have four sides with leads extend-ing from the component body on all four sides. QFP componentscome packaged in trays or on tape and reel to protect the component leads that can be easily damaged. An important measurement for QFPs is coplanarity. When the first lead from the component is placedPart Number System▪ Add “TR” to end of part number for Tape and Reel.▪ Add specific finish to end of part number for Lead-Free, i.e Sn, SnCu or SnBi.QFP44–10mm–.8mm–3.9mmQuadFlat PackNumber of Pins Lead Pitch Body SizeLead FootprintDaisy-Chain And Lead-Free Parts Available!QFP Plastic Quad Flat PackPart NumberNumber of Pins Body Size Body Thickness Lead Pitch Footprint Quantity Per Tray Tape Width Tape Pitch Quantity 13" Reel AvailableLead-Free Finishes .40mm PitchQFP256-28mm-.4mm-2.625628mm sq 3.37mm .40mm 2.6mm 244440200Sn, SnCu or SnBi .50mm PitchQFP64-10mm-.50mm-3.26410mm sq 2.0mm .50mm 3.2mm 962424500Sn, SnCu or SnBi QFP64-10mm-.50mm-3.96410mm sq 2.0mm.50mm 3.9mm 962424500Sn, SnCu or SnBi QFP100-14mm-.5mm-3.210014mm sq 2.0/2.67mm .50mm 3.2mm 843224350Sn, SnCu or SnBi QFP100-14mm-.5mm-3.910014mm sq 2.67mm .50mm 3.9mm 843224350Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.212814 x 20mm 2.71mm .50mm 3.2mm 664432200Sn, SnCu or SnBi QFP128-14x20mm-.5mm-3.912814 x 20mm 2.71mm .50mm 3.9mm 664432200Sn, SnCu or SnBi QFP208-28mm-.5mm-2.620828mm sq 3.37mm .50mm 2.6mm 244440200Sn, SnCu or SnBi QFP208-28mm-.5mm-3.220828mm sq 3.37mm .50mm 3.2mm 244440200Sn, SnCu or SnBi QFP240-32mm-.5mm-2.624032mm sq 3.4mm .50mm 2.6mm 245644250Sn, SnCu or SnBi QFP304-40mm-.5mm-2.630440mm sq 3.8mm .50mm 2.6mm 12n/a n/a —Sn, SnCu or SnBi .65mm PitchQFP52-10mm-.65mm-3.25210mm sq 2.0mm .65mm 3.2mm 962424500Sn, SnCu or SnBi QFP52-10mm-.65mm-3.95210mm sq 2.0mm.65mm 3.9mm 962424500Sn, SnCu or SnBi QFP80-14mm-.65mm-3.28014mm sq 2.0/2.67mm .65mm 3.2mm 843224350Sn, SnCu or SnBi QFP80-14mm-.65mm-3.98014mm sq 2.67mm .65mm 3.9mm 843224350Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.210014 x 20mm 2.71mm .65mm 3.2mm 664432200Sn, SnCu or SnBi QFP100-14x20mm-.65mm-3.910014 x 20mm 2.71mm .65mm 3.9mm 664432200Sn, SnCu or SnBi QFP144-28mm-.65mm-2.614428mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP144-28mm-.65mm-3.214428mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-2.616028mm sq 3.37mm .65mm 2.6mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.216028mm sq 3.37mm .65mm 3.2mm 244440200Sn, SnCu or SnBi QFP160-28mm-.65mm-3.916028mm sq 3.37mm .65mm 3.9mm 244440200Sn, SnCu or SnBi .80mm PitchQFP44-10mm-.8mm-3.24410mm sq 2.0mm .80mm 3.2mm 962424500Sn, SnCu or SnBi QFP44-10mm-.8mm-3.94410mm sq 2.0mm.80mm 3.9mm 962424500Sn, SnCu or SnBi QFP64-14mm-.8mm-3.26414mm sq 2.0/2.67mm .80mm 3.2mm 843224350Sn, SnCu or SnBi QFP64-14mm-.8mm-3.96414mm sq 2.67mm .80mm 3.9mm 843224350Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.28014 x 20mm 2.71mm .80mm 3.2mm 664432200Sn, SnCu or SnBi QFP80-14x20mm-.8mm-3.98014 x 20mm 2.71mm .80mm 3.9mm 664432200Sn, SnCu or SnBi QFP120-28mm-.8mm-2.612028mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP120-28mm-.8mm-3.212028mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-2.612828mm sq 3.37mm .80mm 2.6mm 244440200Sn, SnCu or SnBi QFP128-28mm-.8mm-3.212828mm sq 3.37mm .80mm 3.2mm 244440200Sn, SnCu or SnBi 1.00mm PitchQFP52-14mm-1.0mm-3.25214mm sq 2.0/2.67mm 1.00mm 3.2mm 843224350Sn, SnCu or SnBi QFP52-14mm-1.0mm-3.95214mm sq 2.67mm 1.00mm 3.9mm 843224350Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.26414 x 20mm 2.71mm 1.00mm 3.2mm 664432200Sn, SnCu or SnBi QFP64-14x20mm-1.0mm-3.96414 x 20mm2.71mm1.00mm3.9mm664432200Sn, SnCu or SnBion the PCB coplanarity is established. Coplanarity ensures the last lead can be placed on the board. The standard for QFP coplanarity is ±4 mils. Lead-free versions of QFPs are now available. Please call for additional information.Dummy ComponentsCQFPCeramic Quad Flat PackCQFPs are hermetic packages consisting of true pieces of dry pressed ceramic surrounding a uniformed leadframe with tie bar attached. Lead counts for this package range from 14 to 304, with lead pitch rangingPart Number Systemeither metal or ceramic. Lids are attached after die attach. This allows for a hermetically sealed environment for the die.from 15.7mil to 50mils. Package leads are gold or Kovar finish and can be solder-coated by special request. Lids are optional for CQFPs, which are sealed over the package cavity at temperatures from 400° to 460° C.NotesCQFPs are available with or without combo lid. Pins are flat (sandwiched) with tie bar. Parts are packaged in non-JEDEC trays.Due to the custom nature of the package, body size and dimensions can change without notice.Parts available with a daisy-chain configuration upon request. Other ceramic packages available upon request. Glass or epoxy seal.Footprint compatible with plastic QFP packages. EIAJ and JEDEC standards.Lead-frames are embedded into the glass to create both internal die connection and external PCB connection.This surface mount package consists of a ceramic base that has metal-ized castellations/pads on the sides and bottom of the package. LCC packages have pads on all four sides of the package. Lids for LCCs can beCQFP Ceramic Quad Flat PackPart NumberNumber of Pins Body Size Pitch (Inch)(mm)52CQFP-19.0mm-1.27mm 52.750" sq 19.0mm sq 1.27mm 68CQFP-24.1mm-1.27mm 68.950" sq 24.1mm sq 1.27mm 84CQFP-16.5mm-.65mm 84.650" sq 16.5mm sq .65mm 100CQFP-19.0mm-.65mm 100.750" sq 19.0mm sq .65mm 132CQFP-24.1mm-.65mm 132.950" sq 24.1mm sq .65mm 144CQFP-26.6mm-.65mm 144 1.050" sq 26.6mm sq .65mm 172CQFP-29.2mm-.65mm 172 1.150" sq 29.2mm sq .65mm 196CQFP-32.0mm-.50mm1961.260" sq32.0mm sq.50mmNotesLCCs are available with or without combo lid.Gold castellations are standard, but can be solder-coated with 100% Sn or Sn/Cu alloy.Parts are packaged in non-JEDEC trays.upon request.LCC Leadless Ceramic CarrierPart NumberNumber of Castellations Body Size Pitch (Inch)(mm)16LCC-1.27mm-7.36x8.96mm 16.350" x .285"7.36 x 8.96mm 1.27mm 20LCC-1.27mm-8.90mm 20.350" sq 8.90mm sq 1.27mm 28LCC-1.27mm-11.5mm28.450" sq 11.50mm sq 1.27mm 32LCC-1.27mm-11.4x14.0mm 32.550" x .450"11.40 x 14.00mm 1.27mm 40LCC-1.00mm-10.1mm 40.400" sq 10.10mm sq 1.00mm 44LCC-1.27mm-16.5mm 44.650" sq 16.50mm sq 1.27mm 48LCC-1.00mm-14.2mm 48.560" sq 14.20mm sq 1.00mm 52LCC-1.27mm-19.0mm 52.750" sq 19.00mm sq 1.27mm 68LCC-1.27mm-24.11mm 68.950" sq 24.11mm sq 1.27mm 84LCC-1.27mm-29.2mm841.150" sq29.20mm sq1.27mmLCCLeadless Ceramic Carrier52CQFP–19.0mm–1.27mmI/O CountBody SizeLead PitchCeramic Quad Flat Pack20LCC–1.27mm–8.90mm Number of CastellationsPitch Body SizeLeadless Ceramic CarrierFor recommended kits see pages 71 and 55.。

几种封装形式(配图)

一直对IC贴片封装的具体名字搞不清楚，就知道是贴片的，再问我具体的，我就傻眼了。

今天决定，彻底扫盲一下。

(1)SOP(2)LQFP(现在低频最常见的一种了吧)(3)PLCC(4)QFN(5)BGA一、SOPSOP也是一种很常见的元件封装形式，始于70年代末期。

sop封装示意图由1980 年代以前的通孔插装(PTH)型态，主流产品为DIP(Dual In-Line Package)，进展至1980 年代以SMT(Surface Mount Technology)技术衍生出的SOP(Small Out-Line Package)、SOJ(Small Out-LineJ-Lead)、PLCC(Plastic Leaded Chip Carrier)、QFP(Quad Flat Package)封装方式，在IC 功能及I/O 脚数逐渐增加后，1997 年Intel 率先由QFP 封装方式更新为BGA(Ball Grid Array，球脚数组矩阵)封装方式，除此之外，近期主流的封装方式有CSP(Chip Scale Package 芯片级封装)及Flip Chip(覆晶)。

SOP封装的应用范围很广，而且以后逐渐派生出SOJ（J型引脚小外形封装）、TSOP（薄小外形封装）、VSOP（甚小外形封装）、SSOP（缩小型SOP）、TSSOP（薄的缩小型SOP）及SOT（小外形晶体管）、SOIC（小外形集成电路）等在集成电路中都起到了举足轻重的作用。

像主板的频率发生器就是采用的SOP 封装。

二、LQFP(现在低频最常见的一种了吧)LQFP也就是薄型QFP（Low-profile Quad Flat Package）指封装本体厚度为1.4mm的QFP，是日本电子机械工业会根据制定的新QFP外形规格所用的名称。

下面介绍下QFP封装：这种技术的中文含义叫方型扁平式封装技术（Plastic Quad Flat Package），该技术实现的CPU芯片引脚之间距离很小，管脚很细，一般大规模或超大规模集成电路采用这种封装形式，其引脚数一般都在100以上。

芯片封装类型图解

芯片封装类型图解本文介绍了常见的集成电路封装形式，包括BGA、CPGA、FBGA、JLCC、LDCC、LQFP100L、PCDIP、PLCC、PPGA、PQFP、TQFP100L、TSBGA217L、TSOP、CSP、SIP、ZIP、S-DIP、SK-DIP、PGA、SOP、MSP和QFP等。

SIP是单列直插式封装，引脚在芯片单侧排列，与DIP基本相同。

ZIP是Z型引脚直插式封装，引脚比SIP粗短些，节距等特征也与DIP基本相同。

S-DIP是收缩双列直插式封装，引脚在芯片两侧排列，引脚节距为1.778mm，芯片集成度高于DIP。

SK-DIP是窄型双列直插式封装，除了芯片的宽度是DIP的1/2以外，其它特征与DIP相同。

PGA是针栅阵列插入式封装，封装底面垂直阵列布置引脚插脚，插脚节距为2.54mm或1.27mm，插脚数可多达数百脚，用于高速的且大规模和超大规模集成电路。

SOP是小外型封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，字母L状，引脚节距为1.27mm。

MSP是微方型封装，表面贴装型封装的一种，又叫QFI等，引脚端子从封装的四个侧面引出，呈I字形向下方延伸，没有向外突出的部分，实装占用面积小，引脚节距为1.27mm。

QFP是四方扁平封装，表面贴装型封装的一种，引脚端子从封装的两个侧面引出，呈L字形，引脚节距为1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm，引脚可达300脚以上。

SVP是一种表面安装型垂直封装，其引脚端子从封装的一个侧面引出，中间部位弯成直角并与PCB键合，适用于垂直安装，实装占有面积很小。

其引脚节距为0.65mm和0.5mm。

LCCC是一种无引线陶瓷封装载体，其四个侧面都设有电极焊盘而无引脚，适用于高速、高频集成电路封装。

PLCC是一种无引线塑料封装载体，适用于高速、高频集成电路封装，是一种塑料封装的LCC。

SOJ是一种小外形J引脚封装，其引脚端子从封装的两个侧面引出，呈J字形，引脚节距为1.27mm。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFP LQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP: 单列直插式封装.该类型的引脚在芯片单侧排列 ,引脚节距等特征与 DIP 基本相同封装 .该类型的引脚也在芯片单侧排列 ,只是引脚比 SIP 粗短些 , 节距等特征也与.ZIP:Z 型引脚直插式DIP 基本相同 .S-DIP: 收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为 1.778mm, 芯片集成度高于DIP.SK-DIP: 窄型双列直插式封装.除了芯片的宽度是DIP 的 1/2 以外 ,其它特征与DIP 相同 .PGA: 针栅阵列插入式封装 .封装底面垂直阵列布置引脚插脚, 如同针栅 . 插脚节距为 2.54mm 或 1.27mm, 插脚数可多达数百脚用于高速的且大规模和超大规模集成电路..SOP: 小外型封装 . 表面贴装型封装的一种,引脚端子从封装的两个侧面引出, 字母 L 状.引脚节距为1.27mm.MSP:微方型封装. 表面贴装型封装的一种,又叫 QFI 等,引脚端子从封装的四个侧面引出伸,没有向外突出的部分,实装占用面积小,引脚节距为 1.27mm.,呈 I 字形向下方延QFP: 四方扁平封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 L 字形 ,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300 脚以上 .SVP: 表面安装型垂直封装. 表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB 键合 ,为垂直安装的封装. 实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC: 无引线陶瓷封装载体. 在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速, 高频集成电路封装.PLCC: 无引线塑料封装载体.一种塑料封装的LCC. 也用于高速 ,高频集成电路封装.SOJ: 小外形 J 引脚封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 J 字形 ,引脚节距为1.27mm.BGA:球栅阵列封装 .表面贴装型封装的一种,在 PCB 焊球的节距通常为 1.5mm,1.0mm,0.8mm,的背面布置二维阵列的球形端子,而不采用针脚引脚与 PGA 相比 ,不会出现针脚变形问题..CSP: 芯片级封装 .一种超小型表面贴装型封装,其引脚也是球形端子,节距为 0.8mm,0.65mm,0.5mm等.TCP: 带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比芯片更薄 ,引脚节距更小 ,达 0.25mm, 而引脚数可达500 针以上 .,介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容 )Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf 类元件Melf type Component [Cylinder]Sop 元件Small outline package 小外形封装TSop 元件Thin Sop 薄形封装SOJ 元件Small Outline J-lead Package具有丁形引线的小外形封装QFP 元件Quad Flat Package 方形扁平封装PLCC 元件Plastic Leaded Chip Carrier塑料有引线芯片载体BGABall Grid Array球脚陈列封装球栅陈列封装CSPChip Size Package 芯片尺寸封装2 特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC 卡连接器IC Card Connector附 BGA封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA 微小 BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于 1 适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model多芯片组件)英汉缩语对照SMTSurface Mount Technology表面贴装技术SMDSurface Mounting Devices表面安装器件SMBSurface Mounting Printed Circuit Board表面安装印刷板DIP Dual-In-Line Package双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面： DIP 封装 (70 年代 )->SMT 工艺 (80 年代 LCCC/PLCC/SOP/QFP)->BGA封装(90 年代 )-> 面向未来的工艺 (CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－ >塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－ >表面组装－ >直接安装一． TO 晶体管外形封装TO（Transistor Out-line ）的中文意思是“晶体管外形”。

集成电路封装图

常用集成电路芯片封装图三极管封装图LQFP BQFP PQFPSC-70SOJSSOPSOP TQFP常见集成电路（IC）芯片的封装SIP(Single In-line Package)PGA(Pin Grid Array Package)PLCC(Plastic leaded Chip Carrier).CSP (Chip Scale Package)DIP,SIP,SOP,TO,SOT元件封裝形式(图)各元器件封装形式图解, 不知道有没有人发过. 暂且放上!CDIP-----Ceramic Dual In-Line PackageCLCC-----Ceramic Leaded Chip CarrierCQFP-----Ceramic Quad Flat PackDIP-----Dual In-Line PackageLQFP-----Low-Profile Quad Flat PackMAPBGA------Mold Array Process Ball Grid ArrayPBGA-----Plastic Ball Grid ArrayPLCC-----Plastic Leaded Chip CarrierPQFP-----Plastic Quad Flat PackQFP-----Quad Flat PackSDIP-----Shrink Dual In-Line PackageSOIC-----Small Outline Integrated PackageSSOP-----Shrink Small Outline PackageDIP-----Dual In-Line Package-----双列直插式封装。

插装型封装之一，引脚从封装两侧引出，封装材料有塑料和陶瓷两种。

DIP是最普及的插装型封装，应用范围包括标准逻辑IC，存贮器LSI，微机电路等。

PLCC-----Plastic Leaded Chip Carrier-----PLCC封装方式，外形呈正方形，32脚封装，四周都有管脚，外形尺寸比DIP封装小得多。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680LFBGA FDIP FQFP 100LJLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217LPCDIP PLCC PPGAPQFP QFP SBA 192LTQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征和DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也和DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征和DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部和PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,和PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并和布线相连接的封装.和其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积和封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

电子元器件封装图示大全

电子元器件封装图示大全LQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat PackageQFPQuad Flat PackageTQFP 100LRIMMRIMMFor DirectRambus SBGASC-70 5LSDIPSIMM30SIMM30PinoutSIMM30Single In-line MemoryModuleSIMM72SIMM72PinoutSIMM72Single In-line MemoryModuleSIMM72Single In-line MemoryModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPU SNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET A For PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14L SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343SOT523 SOT89 SOT89 SSOP 16L SSOPSocket 603FosterLAMINATE TCSP 20L Chip Scale PackageTO18TO220TO247TO252TO263/TO268 TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32L Chip Scale PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayVL BusVESA Local BusXT Bus8bitZIPZig-Zag Inline PackageGull Wing LeadsHSOP28ISAIndustry StandardArchitectureITO220ITO3pJ-STDJ-STDJoint IPC / JEDEC StandardsJEPJEPJEDEC PublicationsJESDJESDJEDEC StandardsJLCCLCCLDCCLGALLP 8LaLQFPPCDIPPCI 32bit 5V Periphera l Compone nt Interconn ectPCI 64bit 3.3V Periphera l Compone nt Interconn ectPCMCIA PDIPPGA Plastic Pin Grid ArrayPLCC PQFPPS/2PS/2mouseportpinoutPSDIP DIMM 168 DIMM DDRDIMM168Dual In-lineMemoryModule DIMM168DIMM168PinoutDIMM184For DDRSDRAMDual In-lineMemoryModuleDIPDual InlinePackageDIP-tabDual InlinePackagewith MetalHeatsinkEIA EIA JEDEC formulat ed EIA Standard sEISAExtended ISA FBGAFDIPFTO220Flat PackAC'97AC'97v2.2 specification 详细规格AGP 3.3V Accelerated Graphics Port Specification 2.0 详细规格AGP PROAcceleratedGraphics PortPROSpecification 1.01详细规格AGPAcceleratedGraphics PortSpecification 2.0详细规格AMRAudio/ModemRiserAX078AX14C-Bend LeadCERQUADCeramic Quad FlatPackCLCCCNR Communication and Networking Riser Specification Revision 1.2CPGACeramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112L Chip Scale PackageBGABall Grid ArrayEBGA 680LLBGA 160L PBGA 217L Plastic Ball Grid ArraySBGA 192L TSBGA 680LCLCC CNR Communication and Networking RiserCPGA Ceramic Pin Grid Array DIP Dual Inline PackageDIP-tab Dual Inline Packagewith Metal HeatsinkFBGAFDIP FTO-220 Flat Pack HSOP-28 ITO-220 ITO-3P JLCC LCC LDCC LGA LQFP PCDIPPGA Plastic Pin Grid Array PLCC PQFP PSDIP LQFP 100L METAL QUAD 100L PQFP 100L QFP Quad Flat Package SOT143 SOT220SOT223 SOT223SOT23 SOT23/SOT323SOT25/SOT353 SOT26/SOT363 SOT343 SOT523 SOT89 SOT89Socket 603 Foster LAMINATE TCSP 20L Chip ScalePackageTO252 TO263/TO268 QFP Quad Flat Package TQFP 100LSBGA SC-70 5LSDIP SIP Single Inline Package SO Small Outline Package SOJ 32L SOJ SOP EIAJ TYPE II 14LSOT220 SSOP 16LTO247 SSOPTO18 TO220TO264 TO3TO5 TO52TO71 TO72TO78 TO8TO92 TO93TO99 TSOP Thin Small Outline PackageTSSOP or TSOP II Thin ShrinkuBGA Micro Ball Grid Array Outline PackageuBGA Micro Ball Grid Array ZIP Zig-Zag Inline Package BQFP132 C-Bend LeadCERQUAD Ceramic Quad FlatCeramic Case PackLAMINATE CSP 112L Chip ScaleGull Wing Leads PackagePDIP PLCCSNAPTK SNAPTKSNAPZP SOHAGP 3.3V Accelerated Graphics PortSpecification 2.0详细规格AGP PRO Accelerated Graphics Port PRO Specification 1.01详细规格AGPAccelerated Graphics PortSpecification 2.0详细规格AMRAudio/Modem Riser AX078AX14BGABall Grid ArrayBQFP132EBGA 680L详细规格LBGA 160L详细规格PBGA 217LPlastic Ball Grid Array 详细规格SBGA 192L详细规格TEPBGA 288L TEPBGA 288L详细规格TSBGA 680L详细规格C-Bend LeadCERQUADCeramic Quad FlatPackCLCCCNR Communication and Networking Riser Specification Revision 1.2详细规格CPGACeramic Pin Grid ArrayCeramic CaseLAMINATE CSP 112L Chip Scale Package 详细规格DIMM 168详细规格DIMM DDR详细规格DIMM168 Dual In-line Memory Module详细规格DIMM168DIMM168 Pinout详细规格DIMM184For DDR SDRAM Dual In-line Memory Module详细规格DIPDual Inline Package详细规格DIP-tabDual Inline Package with Metal HeatsinkEIA EIAJEDEC formulated EIA StandardsEISA Extended ISA 详细规格FBGAFDIPFTO220Flat PackGull Wing LeadsHSOP28ISAIndustry Standard ArchitectureITO220ITO3pJ-STD J-STDJoint IPC / JEDECStandardsJEP JEP JEDEC PublicationsJESDJESDJEDECStandardsJLCC PCDIPPCI 32bit 5V Peripheral Component Interconnect 详细规格PCI 64bit 3.3V Peripheral Component Interconnect 详细规格PCMCIA PDIPPGAPlastic Pin GridArray详细规格PLCC详细规格PQFPPS/2PS/2mouse portpinoutPSDIPLQFP 100L详细规格METAL QUAD100L详细规格PQFP 100L详细规格QFPQuad FlatPackageQFPQuad FlatPackageTQFP 100L详细规格SBGASC-70 5L详细规格SDIPSIMM30SIMM30Pinout详细规格SIMM30Single In-line Memory Module SIMM72SIMM72Pinout详细规格SIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32L详细规格SOJSOP EIAJ TYPE II 14L 详细规格SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323SOT25/SOT353 SOT26/SOT363 SOT343SOT523SOT89SOT89SSOP 16L详细规格SSOPSocket 603FosterLAMINATE TCSP 20L Chip Scale Package 详细规格TO18TO220TO247TO252TO263/TO268 TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32LChip Scale Package详细规格uBGAMicro Ball Grid ArrayuBGAMicro Ball Grid ArrayVL BusVESA Local BusXT Bus8bitZIPZig-Zag Inline Package。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFP LQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP: 单列直插式封装.该类型的引脚在芯片单侧排列 ,引脚节距等特征与 DIP 基本相同封装 .该类型的引脚也在芯片单侧排列 ,只是引脚比 SIP 粗短些 , 节距等特征也与.ZIP:Z 型引脚直插式DIP 基本相同 .S-DIP: 收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为 1.778mm, 芯片集成度高于DIP.SK-DIP: 窄型双列直插式封装.除了芯片的宽度是DIP 的 1/2 以外 ,其它特征与DIP 相同 .PGA: 针栅阵列插入式封装 .封装底面垂直阵列布置引脚插脚, 如同针栅 . 插脚节距为 2.54mm 或 1.27mm, 插脚数可多达数百脚用于高速的且大规模和超大规模集成电路..SOP: 小外型封装 . 表面贴装型封装的一种,引脚端子从封装的两个侧面引出, 字母 L 状.引脚节距为1.27mm.MSP:微方型封装. 表面贴装型封装的一种,又叫 QFI 等,引脚端子从封装的四个侧面引出伸,没有向外突出的部分,实装占用面积小,引脚节距为 1.27mm.,呈 I 字形向下方延QFP: 四方扁平封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 L 字形 ,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300 脚以上 .SVP: 表面安装型垂直封装. 表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB 键合 ,为垂直安装的封装. 实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC: 无引线陶瓷封装载体. 在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速, 高频集成电路封装.PLCC: 无引线塑料封装载体.一种塑料封装的LCC. 也用于高速 ,高频集成电路封装.SOJ: 小外形 J 引脚封装 .表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈 J 字形 ,引脚节距为1.27mm.BGA:球栅阵列封装 .表面贴装型封装的一种,在 PCB 焊球的节距通常为 1.5mm,1.0mm,0.8mm,的背面布置二维阵列的球形端子,而不采用针脚引脚与 PGA 相比 ,不会出现针脚变形问题..CSP: 芯片级封装 .一种超小型表面贴装型封装,其引脚也是球形端子,节距为 0.8mm,0.65mm,0.5mm等.TCP: 带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比芯片更薄 ,引脚节距更小 ,达 0.25mm, 而引脚数可达500 针以上 .,介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容 )Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf 类元件Melf type Component [Cylinder]Sop 元件Small outline package 小外形封装TSop 元件Thin Sop 薄形封装SOJ 元件Small Outline J-lead Package具有丁形引线的小外形封装QFP 元件Quad Flat Package 方形扁平封装PLCC 元件Plastic Leaded Chip Carrier塑料有引线芯片载体BGABall Grid Array球脚陈列封装球栅陈列封装CSPChip Size Package 芯片尺寸封装2 特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC 卡连接器IC Card Connector附 BGA封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA 微小 BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于 1 适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model多芯片组件)英汉缩语对照SMTSurface Mount Technology表面贴装技术SMDSurface Mounting Devices表面安装器件SMBSurface Mounting Printed Circuit Board表面安装印刷板DIP Dual-In-Line Package双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面： DIP 封装 (70 年代 )->SMT 工艺 (80 年代 LCCC/PLCC/SOP/QFP)->BGA封装(90 年代 )-> 面向未来的工艺 (CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－ >塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－ >表面组装－ >直接安装一． TO 晶体管外形封装TO（Transistor Out-line ）的中文意思是“晶体管外形”。

芯片封装类型图解

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680L FBGA FDIP FQFP 100L JLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217L PCDIP PLCC PPGAPQFP QFP SBA 192L TQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征与DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也与DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征与DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,与PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor )可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代 LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM)材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

LQFP,TQFP,QFP封装尺寸图解及区别

LQFP,TQFP,QFP封装尺寸图解及区别这个型号只有两种封装一种是TQFP32 一种是BGA48QFP(quad flat package)四侧引脚扁平封装。

表面贴装型封装之一，引脚从四个侧面引出呈海鸥翼(L)型。

基材有陶瓷、金属和塑料三种。

从数量上看，塑料封装占绝大部分。

当没有特别表示出材料时，多数情况为塑料QFP。

塑料QFP 是最普及的多引脚LSI 封装。

不仅用于微处理器，门陈列等数字逻辑LSI 电路，而且也用于VTR 信号处理、音响信号处理等模拟LSI 电路。

引脚中心距有1.0mm、0.8mm、0.65mm、0.5mm、0.4mm、0.3mm 等多种规格。

0.65mm 中心距规格中最多引脚数为304。

日本电子机械工业会对QFP 的外形规格进行了重新评价。

在引脚中心距上不加区别，而是根据封装本体厚度分为QFP(2.0mm～3.6mm 厚)、LQFP(1.4mm 厚)和TQFP(1.0mm 厚)三种。

LQFP指封装本体厚度为1.4mm的QFP。

TQFP指封装本体厚度为1.0mm的QFPBQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。

QFP封装之一，在封装本体的四个角设置突起(缓冲垫)以防止在运送过程中引脚发生弯曲变形。

美国半导体厂家主要在微处理器和ASIC等电路中采用.此封装。

引脚中心距0.635mm，引脚数从84到196左右FQFP(finepitchquadflatpackage)小引脚中心距QFP。

通常指引脚中心距小于0.65mm的QFP(见QFP)。

部分导导体厂家采用此名称——仅供参考。

元器件封装大全：图解文字详述

元器件封装类型：A.Axial轴状的封装（电阻的封装）AGP （Accelerate raphical Port）加速图形接口AMR(Audio/MODEM Riser) 声音/调制解调器插卡BBGA（Ball Grid Array）球形触点阵列，表面贴装型封装之一。

在印刷基板的背面按阵列方式制作出球形凸点用以代替引脚，在印刷基板的正面装配LSI 芯片，然后用模压树脂或灌封方法进行密封。

也称为凸点阵列载体(PAC)BQFP(quad flat package with bumper)带缓冲垫的四侧引脚扁平封装。

QFP封装之一，在封装本体的四个角设置突(缓冲垫)以防止在运送过程中引脚发生弯曲变形。

C 陶瓷片式载体封装C－(ceramic) 表示陶瓷封装的记号。

例如，CDIP 表示的是陶瓷DIP。

Cerdip 用玻璃密封的陶瓷双列直插式封装，用于ECL RAM，DSP(数字信号处理器)等电路。

带有玻璃窗口的Cerdip 用于紫外线擦除型EPROM 以及内部带有EPROM 的微机电路等。

CERQUAD(Ceramic Quad Flat Pack)表面贴装型封装之一，即用下密封的陶瓷QFP，用于封装DSP 等的逻辑LSI 电路。

带有窗口的Cerquad 用于封装EPROM 电路。

散热性比塑料QFP 好，在自然空冷条件下可容许1.5～2W 的功率CGA(Column Grid Array) 圆柱栅格阵列，又称柱栅阵列封装CCGA(Ceramic Column Grid Array) 陶瓷圆柱栅格阵列CNR是继AMR之后作为INTEL的标准扩展接口CLCC 带引脚的陶瓷芯片载体，引脚从封装的四个侧面引出，呈丁字形。

带有窗口的用于封装紫外线擦除型EPROM 以及带有EPROM 的微机电路等。

此封装也称为QFJ、QFJ－G COB(chip on board) 板上芯片封装，是裸芯片贴装技术之一，半导体芯片交接贴装在印刷线路板上，芯片与基板的电气连接用引线缝合方法实现，芯片与基板的电气连接用引线缝合方法实现，并用树脂覆盖以确保可靠性。

芯片封装类型图案详解

集成电路封装形式介绍(图解）BGA BGFP132 CLCCCPGA DIP EBGA 680LFBGA FDIP FQFP 100LJLCC BGA160L LCCLDCC LGA LQFPLQFP100L Metal Qual100L PBGA217LPCDIP PLCC PPGAPQFP QFP SBA 192LTQFP100L TSBGA217L TSOPCSPSIP:单列直插式封装.该类型的引脚在芯片单侧排列,引脚节距等特征与DIP基本相同.ZIP:Z型引脚直插式封装.该类型的引脚也在芯片单侧排列,只是引脚比SIP粗短些,节距等特征也与DIP基本相同.S-DIP:收缩双列直插式封装.该类型的引脚在芯片两侧排列,引脚节距为1.778mm,芯片集成度高于DIP.SK-DIP:窄型双列直插式封装.除了芯片的宽度是DIP的1/2以外,其它特征与DIP相同.PGA:针栅阵列插入式封装.封装底面垂直阵列布置引脚插脚,如同针栅.插脚节距为2.54mm或1.27mm,插脚数可多达数百脚.用于高速的且大规模和超大规模集成电路.SOP:小外型封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,字母L状.引脚节距为1.27mm.MSP:微方型封装.表面贴装型封装的一种,又叫QFI等,引脚端子从封装的四个侧面引出,呈I字形向下方延伸,没有向外突出的部分,实装占用面积小,引脚节距为1.27mm.QFP:四方扁平封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈L字形,引脚节距为1.0mm,0.8mm,0.65mm,0.5mm,0.4mm,0.3mm,引脚可达300脚以上.SVP:表面安装型垂直封装.表面贴装型封装的一种,引脚端子从封装的一个侧面引出,引脚在中间部位弯成直角,弯曲引脚的端部与PCB键合,为垂直安装的封装.实装占有面积很小.引脚节距为0.65mm,0.5mm.LCCC:无引线陶瓷封装载体.在陶瓷基板的四个侧面都设有电极焊盘而无引脚的表面贴装型封装.用于高速,高频集成电路封装.PLCC:无引线塑料封装载体.一种塑料封装的LCC.也用于高速,高频集成电路封装.SOJ:小外形J引脚封装.表面贴装型封装的一种,引脚端子从封装的两个侧面引出,呈J字形,引脚节距为1.27mm.BGA:球栅阵列封装.表面贴装型封装的一种,在PCB的背面布置二维阵列的球形端子,而不采用针脚引脚.焊球的节距通常为1.5mm,1.0mm,0.8mm,与PGA相比,不会出现针脚变形问题.CSP:芯片级封装.一种超小型表面贴装型封装,其引脚也是球形端子,节距为0.8mm,0.65mm,0.5mm等.TCP:带载封装.在形成布线的绝缘带上搭载裸芯片,并与布线相连接的封装.与其他表面贴装型封装相比,芯片更薄,引脚节距更小,达0.25mm,而引脚数可达500针以上.介绍：1 基本元件类型Basic Component Type盒形片状元件(电阻和电容)Box Type Solder ComponentResistor and Capacitor小型晶体管三极管及二极管SOTSmall Outline TransistorTransistor and Diodeelf类元件Melf type Component [Cylinder]Sop元件Small outline package小外形封装TSop元件Thin Sop薄形封装SOJ元件Small Outline J-lead Package 具有丁形引线的小外形封装QFP元件Quad Flat Package方形扁平封装PLCC元件Plastic Leaded Chip Carrier 塑料有引线芯片载体 BGABall Grid Array 球脚陈列封装球栅陈列封装CSPChip Size Package芯片尺寸封装2特殊元件类型Special Component Type钽电容( Tantalium Capacitor)铝电解电容(Aalminum Electrolytic Capacitor ) 可变电阻( Variable Resistor )针栅陈列封装BGABin Grid Array连接器ConnectorIC卡连接器IC Card Connector附BGA 封装的种类APBGAPlastic BGA塑料BGABCBGACeramic BGA陶瓷BGACCCGACeramic Column Grid Array陶瓷柱栅陈列DTBGATape Automated BGA载带自动键合BGAEMBGA微小BGA注芯片的封装技术已经历了好几代的变迁从DIPQFPPGABGA到CSP再到MCM技术指标一代比一代先进包括芯片面积与封装面积之比越来越接近于1适用频率越来越高耐温性能越来越好引脚数增多引脚间距减少重量减少可靠性提高使用更加方便等(MCMMulti Chip Model 多芯片组件)英汉缩语对照SMTSurface Mount Technology 表面贴装技术SMDSurface Mounting Devices 表面安装器件SMBSurface Mounting Printed Circuit Board 表面安装印刷板DIP Dual-In-Line Package 双列直插式组件THTThough Hole Mounting Technology插装技术PCB Printed Circuit Board 印刷电路板SMC Surface Mounting Components表面安装零件PQFP Plastic Quad Flat Package 塑料方形扁平封装SOIC Small Scale Integrated Circuit小外形集成电路LSI Large Scale Integration 大规模集成注意芯片封装图鉴封装大致经过了如下发展进程：结构方面：DIP封装(70年代)->SMT工艺(80年代LCCC/PLCC/SOP/QFP)->BGA封装(90年代)->面向未来的工艺(CSP/MCM) 材料方面：金属、陶瓷－>陶瓷、塑料－>塑料；引脚形状：长引线直插－>短引线或无引线贴装－>球状凸点；装配方式：通孔插装－>表面组装－>直接安装一．TO 晶体管外形封装TO（Transistor Out-line）的中文意思是“晶体管外形”。

元器件封装实物图.doc(实物图,DIP、PLCC、SOP、PQFP、SOJ、TQFP、TSSOP、BGA)

常见元器件封装实物图qqq芯片封装技术知多少前言我们经常听说某某芯片采用什么什么的封装方式，在我们的电脑中，存在着各种各样不同处理芯片，那么，它们又是是采用何种封装形式呢？并且这些封装形式又有什么样的技术特点以及优越性呢？那么就请看看下面的这篇文章，将为你介绍个中芯片封装形式的特点和优点。

一、DIP双列直插式封装DIP(DualIn－line Package)是指采用双列直插形式封装的集成电路芯片，绝大多数中小规模集成电路(IC)均采用这种封装形式，其引脚数一般不超过100个。

采用DIP封装的CPU芯片有两排引脚，需要插入到具有DIP结构的芯片插座上。

当然，也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP 封装的芯片在从芯片插座上插拔时应特别小心，以免损坏引脚。

DIP封装具有以下特点：1.适合在PCB(印刷电路板)上穿孔焊接，操作方便。

2.芯片面积与封装面积之间的比值较大，故体积也较大。

Intel系列CPU中8088就采用这种封装形式，缓存(Cache)和早期的内存芯片也是这种封装形式。

二、PQFP塑料方型扁平式封装和PFP塑料扁平组件式封装PQFP（Plastic Quad Flat Package）封装的芯片引脚之间距离很小，管脚很细，一般大规模或超大型集成电路都采用这种封装形式，其引脚数一般在100个以上。

用这种形式封装的芯片必须采用SMD（表面安装设备技术）将芯片与主板焊接起来。

采用SMD安装的芯片不必在主板上打孔，一般在主板表面上有设计好的相应管脚的焊点。

将芯片各脚对准相应的焊点，即可实现与主板的焊接。

用这种方法焊上去的芯片，如果不用专用工具是很难拆卸下来的。

PFP（Plastic Flat Package）方式封装的芯片与QFP方式基本相同。

唯一的区别是QFP一般为正方形，而PFP既可以是正方形，也可以是长方形。

QFP/PFP封装具有以下特点：1.适用于SMD表面安装技术在PCB电路板上安装布线。

电子元器件封装图示大全修订稿

电子元器件封装图示大全WEIHUA system office room 【WEIHUA 16H-WEIHUA WEIHUA8Q8-电子元器件封装图示大全LQFP 100LMETAL QUAD 100LPQFP 100LQFPQuad Flat PackageQFPQuad Flat Package TQFP 100LRIMMRIMMFor DirectRambus SBGASC-70 5L SDIPSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72PinoutSIMM72Single In-line Memory ModuleSIMM72Single In-line Memory ModuleSIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPU SNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET A For PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14L SOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343SOT523 SOT89 SOT89 SSOP 16L SSOPSocket 603FosterLAMINATE TCSP 20L Chip Scale PackageTO18TO220TO247TO252TO263/TO268 TO264TO3TO5TO52TO71TO72TO78TO8TO92TO93TO99TSOPThin Small Outline PackageTSSOP or TSOP IIThin Shrink Outline PackageLAMINATE UCSP 32L Chip Scale PackageuBGAMicro Ball Grid Array uBGAMicro Ball Grid Array?VL BusVESA Local BusXT Bus8bitZIPZig-Zag Inline Package Gull Wing LeadsHSOP28ISAIndustry StandardArchitectureITO220ITO3pJ-STD J-STDJoint IPC / JEDEC StandardsJEP JEPJEDEC PublicationsJESDJESDJEDEC Standards JLCCLCCLDCCLGALLP 8LaLQFPPCDIPPCI 32bit5VPeripheralComponentInterconnectPCI 64bitPeripheralComponentInterconnectPCMCIA PDIPPGA Plastic Pin Grid ArrayPLCC PQFPPS/2PS/2mouse portpinoutPSDIP DIMM 168DIMM DDRDIMM168 Dual In-line Memory ModuleDIMM168DIMM168 PinoutDIMM184 For DDR SDRAM Dual In-line Memory ModuleDIPDual Inline PackageDIP-tab Dual Inline Package with Metal HeatsinkEIAEIAJEDECformulatedEIAStandardsEISAExtendedISA? FBGAFDIP FTO220 Flat PackAC'97AC'97specification 详细规格AGP Accelerated Graphics Port Specification 详细规格AGP PRO Accelerated Graphics Port PRO Specification 详细规格AGP Accelerated Graphics Port Specification 详细规格AMRAudio/Modem RiserAX078AX14 C-Bend LeadCERQUADCeramic Quad FlatPackCLCCCNRCommunicationand NetworkingRiser SpecificationRevisionCPGACeramic Pin GridArrayCeramic CaseLAMINATE CSP 112LChip ScalePackage?BGABall Grid ArrayEBGA 680L LBGA 160LPBGA 217LPlastic BallGrid Array SBGA 192L TSBGA 680LCPGA Ceramic Pin Grid Array DIP Dual Inline PackageDIP-tab Dual Inline PackageFBGA with Metal HeatsinkFDIP FTO-220Flat Pack HSOP-28ITO-220 ITO-3PJLCC LCCLDCC LGALQFP PCDIPPGA Plastic Pin Grid Array PLCC PQFP PSDIP LQFP 100L METAL QUAD 100L PQFP 100L QFP Quad Flat Package SOT143 SOT220SOT223 SOT223SOT23 SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343 SOT523 SOT89 SOT89Socket 603 Foster LAMINATE TCSP 20L Chip ScalePackageTO252 TO263/TO268 QFP Quad Flat Package TQFP 100LSBGA SC-70 5LSDIP SIP Single Inline Package SO Small Outline Package SOJ 32L SOJ SOP EIAJ TYPE II 14LSOT220 SSOP 16LTO247 SSOPTO18 TO220TO264 TO3TO5 TO52TO71 TO72TO78 TO8TO92 TO93TO99 TSOP Thin Small Outline PackageTSSOP or TSOP II Thin ShrinkuBGA Micro Ball Grid Array Outline PackageuBGA Micro Ball Grid Array ZIP Zig-Zag Inline Package BQFP132 C-Bend LeadCERQUAD Ceramic Quad FlatCeramic Case PackLAMINATE CSP 112L ChipGull Wing Leads Scale PackagePDIP PLCCSNAPTK SNAPTKSNAPZP SOHAGPAccelerated Graphics Port SpecificationAGP PRO Accelerated Graphics Port PRO SpecificationAGPAccelerated Graphics Port SpecificationAMRAudio/Modem Riser AX078AX14BGABall Grid ArrayBQFP132 EBGA 680LLBGA 160L PBGA 217L Plastic Ball Grid ArraySBGA 192LTEPBGA 288L TEPBGA 288LTSBGA 680LC-Bend LeadCERQUADCeramic Quad FlatPackCLCCCNRCommunication andNetworking RiserSpecificationRevisionCPGACeramic Pin Grid ArrayCeramic Case LAMINATE CSP 112LChip Scale PackageDIMM 168DIMM DDRDIMM168Dual In-lineMemoryModuleDIMM168DIMM168 Pinout DIMM184 For DDR SDRAM Dual In-line Memory ModuleDIPDual Inline Package DIP-tabDual Inline Package with Metal HeatsinkEIA EIAJEDEC formulated EIA Standards EISA Extended ISAFBGAFDIPFTO220Flat Pack Gull Wing LeadsHSOP28ISA Industry Standard Architecture ITO220ITO3pJ-STD J-STD Joint IPC / JEDEC StandardsJEP JEP JEDEC PublicationsJESDJESDJEDECStandardsJLCC PCDIPPCI 32bit 5V Peripheral Component Interconnect PCI 64bit Peripheral Component InterconnectPCMCIAPDIPPGAPlastic Pin Grid ArrayPLCCPQFPPS/2PS/2 mouse port pinout PSDIPLQFP 100LMETAL QUAD100LPQFP 100LQFPQuad FlatPackageQFPQuad FlatPackageTQFP 100L SBGASC-70 5LSDIPSIMM30SIMM30PinoutSIMM30Single In-line Memory ModuleSIMM72SIMM72 PinoutSIMM72Single In-line Memory Module SIMM72Single In-line Memory Module SIPSingle Inline PackageSLOT 1For intel Pentium II Pentium III & Celeron CPUSLOT AFor AMD Athlon CPUSNAPTKSNAPTKSNAPZPSO DIMMSmall Outline Dual In-line Memory ModuleSOSmall Outline PackageSOCKET 370For intel 370 pin PGA Pentium III & Celeron CPUSOCKET 423For intel 423 pin PGA Pentium 4 CPUSOCKET 462/SOCKET AFor PGA AMD Athlon & Duron CPUSOCKET 7For intel Pentium & MMX Pentium CPUSOHSOJ 32LSOJSOP EIAJ TYPE II 14LSOT143SOT220SOT220SOT223SOT223SOT23SOT23/SOT323 SOT25/SOT353 SOT26/SOT363 SOT343SOT523 SOT89 SOT89 SSOP 16L SSOPSocket 603 FosterLAMINATE TCSP 20L Chip Scale Package TO18TO220TO247TO252TO263/TO268TO264TO3 TO5 TO52 TO71 TO72 TO78 TO8 TO92 TO93TO99TSOPThin Small Outline Package TSSOP or TSOP IIThin Shrink Outline Package LAMINATE UCSP 32LChip Scale PackageuBGAMicro Ball Grid ArrayuBGAMicro Ball Grid Array VL BusVESA Local BusXT Bus8bitZIPZig-Zag Inline Package。