PCB专业术语翻译英语
PCB专业术语中英文翻译【VIP专享】
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printed board47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
PCB专业用语中英文对照
!一、综合词汇.eda365.& m% D" Z4 O0 _6 l/ y1 }( C4 R41、印制电路：printed circuit2、印制线路：printed wiring PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计. p& Q6 n: g- S e2 C3、印制板：printed board4、印制板电路：printed circuit board (pcb).eda365.2 a* Z0 H8 t6 q5、印制线路板：printed wiring board(pwb)EDA365高速PCB论坛]. M5 I3 *, v8 O6、印制元件：printed ponent7 I f6 j! A6 C5 J7、印制接点：printed contact8、印制板装配：printed board assembly EDA365高速PCB论坛* [2 a& {0 J$ R9 M; l9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board.eda365.* "% G; n' g6 G0 k!14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计: i1 I; z5 }$ z* L18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：fle*ible multilayer printed board PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计$ Y* V$ y- f, S1 R: h* *% T20、挠性印制板：fle*ible printed board21、挠性单面印制板：fle*ible single-sided printed board.eda365. Z* ", y/ z8 e J/ a+ s* M22、挠性双面印制板：fle*ible double-sided printed board5 j' E, H% r4 G- M* G. R* z23、挠性印制电路：fle*ible printed circuit (fpc)24、挠性印制线路：fle*ible printed wiring EDA365高速PCB论坛2 n& L7 [5 T- S6 _7 U) j5 I+ r25、刚性印制板：fle*-rigid printed board, rigid-fle* printed * Q, r7 O* r/ P5 W+ *9 p9 ]9 k: Iboard EDA365高速PCB论坛0 f! ~1 Q: Q* k( H8 V26、刚性双面印制板：fle*-rigid double-sided printed board, PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 J3 Y B* T" d4 B( F*rigid-fle* double-sided printed PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计' f* i5 I8 m- P* A0 C27、刚性多层印制板：fle*-rigid multilayer printed board, PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计" t- }9 F* y' b* B/ f& d4 ~rigid-fle* multilayer printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计9 {1 ~9 v2 u1 m28、齐平印制板：flush printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; `- O, $ E" h$ "* f29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计5 \9 \( S2 ~0 _+ D3 c* H8 l* w! c31、多重布线印制板：mulit-wiring printed board% M: q8 O% B6 Y/ H" F5 b!32、瓷印制板：ceramic substrate printed board PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计& Z! T2 p0 S0 g' y$ g: q+ ]33、导电胶印制板：electroconductive paste printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计8 R( [: H6 F- V+ L34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board.eda365., h! ' g" F/ ]8 Q5 w7 i, Q4 j- \6 c36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up fle*ible printed board.eda365.+ q) b6 z; v1 ^6 n42、外表层合电路板：surface laminar circuit (slc)PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; I" U% p! z6 l% `3 h/ p5 ^43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)EDA365高速PCB论坛o. T$ $ 1 K2 J8 E) {- U45、层间全导通多层印制板：alivh multilayer printed board PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计- N% `: q, R9 h! f5 l% _46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane EDA365高速PCB论坛+ K3 ^, s+ O8 J* P1 V( P$ [51、裸板：bare board PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计O5 _/ F% t$ V( ~5 i- d/ N3 D( i52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic fle* board PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 o) v. [' |8 T' a9 |54、静态挠性板：static fle* board55、可断拼板：break-away planel56、电缆：cable3 e+ t% [" n. T t7 o5 n7 N57、挠性扁平电缆：fle*ible flat cable (ffc)PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计* q M9 V F- F/ O$ W5 H* O4 [7 H% H58、薄膜开关：membrane switch59、混合电路：hybrid circuit.eda365.+ _% ]/ h$ [. [0 A' n60、厚膜：thick film PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计% A: ]: O6 C5 O2 N1 m3 o61、厚膜电路：thick film circuit4 v _! c8 |9 _9 O7 J: u, J" m62、薄膜：thin film EDA365高速PCB论坛) F/ ], P; w *' k63、薄膜混合电路：thin film hybrid circuit PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计- T* K& m& f- Y$ ") A264、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计8 O, i) u" *! |; J. S* A67、传输线：transmission line EDA365高速PCB论坛9 *4 I, h, a& "% d. h, F" [68、跨交：crossover PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计w! }: o& M% |6 }5 N69、板边插头：edge-board contact EDA365高速PCB论坛*$ _5 G; " W. A( C* P70、增强板：stiffener PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计& v/ E+ f* Z" H* *. C71、基底：substrate PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计- C* h; *- L' _6 r72、基板面：real estate PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计*/ }2 z! B3 R( `/ O73、导线面：conductor side PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计6 ~1 M \$ e) G- H74、元件面：ponent side75、焊接面：solder side76、印制：printing PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计c: q( f5 `- {; g' B)77、网格：grid PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计, z* F+ f: G5 H+ H6 U; _78、图形：pattern.eda365.7 l& r1 y' z8 h( b. *3 H* i% w79、导电图形：conductive pattern PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计) ** C, A. Z+ j c;80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 j7 }- E* Y- n5 R$ u5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate EDA365高速PCB论坛6 ~4 Y0 R6 p. `5 Z( q9 o* J: A7、复合层压板：posite laminate PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计: g1 ^; W7 e8 ]- n+ h' U! h8、薄层压板：thin laminate.eda365.8 y3 g$ [! Z; f* h9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计E7 q k5 \! Y-11、挠性覆铜箔绝缘薄膜：fle*ible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计; K; [% {) A7 u* U- W( K15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epo*y glass substrate PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计8 Y$ u6 "- J7 M- Z/ |:17、加成法用层压板：laminate for additive process.eda365.$ u' W V' o/ ^2 g18、预制层覆箔板：mass lamination panel PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计. e% I* u3 E% w19、层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计* D+ o2 ^* D( \" M1 L! n/ W21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计7 h! V4 ^7 C6 g$24、粘结膜：film adhesive PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计) "& Q9 W( v+ O/ S8 R7 T3 w0 W25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film EDA365高速PCB论坛0 D- P2 I: E5 M2 i* n27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; A2 s _7 M( W0 c2 i)32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish 2 q; n1 F7 b! d* z$ k, v36、纵向：length wise direction PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计3 M& U& }! l' [/ R37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad 6 "& B, I: t2 p8 k* slaminates(phenolic/paper ccl)PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计7 q6 H t+ _7 P9 |40、环氧纸质覆铜箔板：epo*ide cellulose paper copper-cladlaminates (epo*y/paper ccl)41、环氧玻璃布基覆铜箔板：epo*ide woven glass fabric copper-clad PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计, o: t+ i4 M2 P" g/ Z3 ~ laminates42、环氧玻璃布纸复合覆铜箔板：epo*ide cellulose paper core, glass PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计& A* W- q: Z4 B& o6 v4 |4 L6 o! v cloth surfaces copper-clad laminates7 b, W5 h" P,43、环氧玻璃布玻璃纤维复合覆铜箔板：epo*ide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates.eda365." C% C Y. D4 B! I" y45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad 8 w5 Z$ "4 N) N: C0 ~9 H' K2 j laminates: V( *: O! v* z5 }46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epo*ide woven glass fabric copper-clad lamimates PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计, B9 W) "7 w2 s: y47、环氧合成纤维布覆铜箔板：epo*ide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计6 ^2 \$ b {) u- B4 S5 E6 h( l49、超薄型层压板：ultra thin laminate50、瓷基覆铜箔板：ceramics base copper-clad laminates5 R" ". d* *& { o$ L2 \1 v51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料, `( `* I% H8 _" g+ H1、a阶树脂：a-stage resin.eda365.4 r* K; C. t: R! K; b2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epo*y resin PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计8 Q, w5 N0 i; I" "* `. e% D5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin1 l; E! |" k0 ^4 E7、聚酰亚胺树脂：polyimide resin: D) _2 k& o, i$ k5 n7 *$ o8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计 J' P3 `. F+ F6 Y: d2 e+ d- d* ^! k10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epo*y resin12、溴化环氧树脂：brominated epo*y resin13、环氧酚醛：epo*y novolac14、氟树脂：fluroresin PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计2 E2 f0 A: S6 *1 }$ j& T15、硅树脂：silicone resin16、硅烷：silane PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计* k4 ^' t2 [% ~( O17、聚合物：polymer18、无定形聚合物：amorphous polymer EDA365高速PCB论坛1 H6 w7 m* P8 Y19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin.eda365.) H0 d V$ g* T425、感光性树脂：photosensitive resin PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计1 \. o3 S* c+ \9 O0 `4 E7 J26、环氧当量：weight per epo*y equivalent (wpe)PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计1 K. m! *& ]3 P8 *. ~* h7 d' P27、环氧值：epo*y value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive% n2 S- k' H( \5 i31、固化剂：curing agent32、阻燃剂：flame retardant PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计7 a5 B* g2 C* w" K33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计8 j- A" ]" L' z536、聚酯薄膜：polyester/ i A6 P v8 _6 F6 j37、聚酰亚胺薄膜：polyimide film (pi)EDA365高速PCB论坛/ ^) ", E5 ]6 Z, * j8 "- Q38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber.eda365.' s" ^3 *% B5 L$ i w* `42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats7 d3 D3 *6 f0 J6 N- |5 \48、纱线：yarn49、单丝：filament50、绞股：strand4 _! I" \* r) t; O. Y51、纬纱：weft yarn52、经纱：warp yarn EDA365高速PCB论坛) l$ l0 W) n6 ^4 b `0 D9 {' |53、但尼尔：denier PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计7 U* z: V U+ B c54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计4 t) L% G2 H8 D$ F+ H9 e57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric% N4 V! f* I6 *8 p- e2 g& h6 _60、稀松织物：woven scrim) W, * y! *2 H, p( R61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计n% e% r2 k0 "% C!65、折痕：crease66、云织：waviness PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计6 q: I1 *5 Y( s. R! p! `3 J* m! R& o67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark PCB设计论坛，CB layout设计，高速PCB设计，高速SI仿真设计6 *' H2 y2 [770、裂缝：split PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计. o; M/ s2 n% e,71、捻度：twist of yarn* A4 t- y$ _& R- z- f* ~72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level+ r" G. F6 P: f: h2 y75、浸润剂：size EDA365高速PCB论坛; }! P+ d( s! m" I* F1 D2 Z" *4 L8 r76、偶联剂：couplint agent PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计' v9 S* G4 d: `1 t8 L6 v77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计/ b( y6 "6 |0 J, h+ o& i1 o) M80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper.eda365.0 f6 & t2 n% H% F% Z( ^5 m82、断裂长：breaking length PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计 C9 P0 _0 `+ H* + v/ P83、吸水高度：height of capillary rise84、湿强度保存率：wet strength retention.eda365., w/ m1 y( O% ** n; [2 m2 i& N185、白度：whitenness) S6 F. ** m2 S* \9 m)86、瓷：ceramics PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计2 h3 D, E' J7 M- v87、导电箔：conductive foil88、铜箔：copper foil PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计/ "9 |* u" e- y2 N$ I9 s: R89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil.eda365. ~! *& A1 M1 O6 O2 W92、压延退火铜箔：rolled annealed copper foil (ra copper foil) L* V" ~+ K/ k9 b; \. y93、薄铜箔：thin copper foil .eda365.: Y, q; C- "6 S/ o94、涂胶铜箔：adhesive coated foil EDA365高速PCB论坛$ K* R% \! k! T( q3 t% G+ [4 P) v95、涂胶脂铜箔：resin coated copper foil (rcc)EDA365高速PCB论坛* T Q, o0 k2 o5 */ O"96、复合金属箔：posite metallic material.eda365." E5 t/ r4 w/ N& c" F0 Z97、载体箔：carrier foil.eda365.$ H. o; s) }' \0 P: G98、殷瓦：invar99、箔〔剖面〕轮廓：foil profile100、光面：shiny side PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计 d3 \+ s" H5 C. *6 s7 {101、粗糙面：matte side PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计0 e7 n9 h0 M/ A* I, f* ^*102、处理面：treated side PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计: Z, R, g+ c* s6 f+ \103、防锈处理：stain proofing104、双面处理铜箔：double treated foil EDA365高速PCB论坛+ E8 Z& A J5 m7 j四、设计1、原理图：shematic diagram2、逻辑图：logic diagram PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计/ I9 q+ S' V: ]$ j3、印制线路布设：printed wire layout4、布设总图：master drawing PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计8 y0 K/ [* E' P5、可制造性设计：design-for-manufacturability PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计0 _. v5 Y/ ** B- `' k6、计算机辅助设计：puter-aided design.(cad)7、计算机辅助制造：puter-aided manufacturing.(cam)8、计算机集成制造：puter integrat manufacturing.(cim).eda365.- b9 ^8 *- q1 L9 h j9 *, S9、计算机辅助工程：puter-aided engineering.(cae).eda365.$ m* H* u3 t B; a9 Q& g*10、计算机辅助测试：puter-aided test.(cat): a: \2 {% M% |! *4 ~2 n/ j6 O11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)& K* Z: Z! B" M. q J0 ]$ |14、计算机辅助制图：puter aided drawing PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计* s; k7 q0 R( W7 R/ V2 ^: F15、计算机控制显示：puter controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation7 v& ~* g7 P& w* f0 R; ^22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计* r2 h9 K% y! k25、布线完成率：layout effeciency PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计 j0 c2 d7 ]9 T526、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin EDA365高速PCB论坛1 w- s* C: } j& l30、优化〔设计〕：optimization (design)PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计0 _3 e3 |. Q n( V. Q" V$ O2 Z0 J31、供设计优化坐标轴：predominant a*is32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file.eda365.: y+ W0 L8 *7 V* ] `" D35、中间文件：intermediate file/ F3 `$ H7 G H) I+ D36、制造文件：manufacturing documentation PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计" b* p6 U' g% R* H$ e( k$ ^37、队列支撑数据库：queue support database- ^: y( "+ Y* q0 O5 z( C38、元件安置：ponent positioning39、图形显示：graphics dispaly EDA365高速PCB论坛2 ( Y' W! C7 `40、比例因子：scaling factor EDA365高速PCB论坛N+ G9 ~; c7 g! * \41、扫描填充：scan filling PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计- r2 R% *2 F2 N3 G4 "4 e0 E$ D42、矩形填充：rectangle filling.eda365.$ }) t3 V- s, |4 v2 F& {; v+ t43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计2 j% o* R2 q. ]4 G4 M* o7 a+ Q48、自顶向下设计：top-down design! W8 r8 T) ". G; W' }49、自底向上设计：bottom-up design EDA365高速PCB论坛3 L+ D$ E2 }9 c50、线网：net51、数字化：digitzing EDA365高速PCB论坛* l Q8 _) T2 f52、设计规那么检查：design rule checking PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计/ I- O/ p) R9 R53、走〔布〕线器：router (cad)54、网络表：net list PC设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计; R8 z6 u9 ]. k8 I, v* r55、计算机辅助电路分析：puter-aided circuit analysis56、子线网：subnet PC设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计' v4 v/ o% E"57、目标函数：objective function PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计* u4 o; G8 c+ N! "* S+ j"58、设计后处理：post design processing (pdp)' ) ^4 e" B, o) }) A& "* M59、交互式制图设计：interactive drawing design PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计3 a9 }: A$ o" h% h' R8 b* M7 l60、费用矩阵：cost metri*PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计" j! D: p) "* g4 I+ P61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：ponent density65、巡回售货员问题：traveling salesman problem.eda365./ M/ R% h2 u! B' |66、自由度：degrees freedom PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计9 q9 p3 }; g) O0 ") }8 G* F% p2 v67、入度：out going degree EDA365高速PCB论坛: l! a3 7 K% w% D8 t* Y68、出度：ining degree PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计- `1 n6 i' l4 Y% ~ b* D* M }69、曼哈顿距离：manhatton distance" U- r7 r Z0 V5 l: "7 a70、欧几里德距离：euclidean distance PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计1 c1 a5 S* Q' F, e0 B2 G71、网络：network72、阵列：array73、段：segment EDA365高速PCB论坛c6 B0 [& n- O; U74、逻辑：logic75、逻辑设计自动化：logic design automation .eda365.7 v O' S: Q8 q0 N) `( `: j76、分线：separated time PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计9 Y& A. a1 G6 G/ R* o77、分层：separated layer EDA365高速PCB论坛5 M4 y) O- d2 `& p8 Q/ N% }+ [(78、定顺序：definite sequence EDA365高速PCB论坛& o) o4 R7 E( t6 V: *五、形状与尺寸：EDA365高速PCB论坛B1 H* d0 ]8 r1、导线〔通道〕：conduction (track)PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计; d2 |; l; _3 p4 ^2 y8 B72、导线〔体〕宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space$ *2 s. D1 M2 _" T6 h6 T6、第一导线层：conductor layer no.1PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计E! b3 h. E3 ** P*7、圆形盘：round pad8、方形盘：square pad7 E0 S* A* *1 q3 h9、菱形盘：diamond pad.eda365. ~9 O+ O7 r0 _8 n( E10、长方形焊盘：oblong pad EDA365高速PCB论坛! ^0 Y' h3 O/ C6 F5 n" Z11、子弹形盘：bullet pad PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计5 n, u7 r" N! D! ".12、泪滴盘：teardrop pad4 G. h' s- "" g! ~13、雪人盘：snowman pad14、v形盘：v-shaped pad& |1 U. n. ~& T( *; *- K) I; N'15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹〔背〕裸盘：back-bard land PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计+ K: R6 *7 k f/ ] N; b21、盘址：anchoring spaur22、连接盘图形：land pattern.eda365.% c& V* }6 O" K! E) N: R4 d23、连接盘网格阵列：land grid array.eda365.8 z) D- }' j) t h7 g. .24、孔环：annular ring PCB设计论坛，PCB layout设计，高速PCB设计，高速SI仿真设计+ \1 u5 S, r5 n2 \$ k- i4 b25、元件孔：ponent hole EDA365高速PCB论坛; {/ ^* n! i; z26、安装孔：mounting hole EDA365高速PCB论坛$ _+ u) A- 5 J( W7 ]27、支撑孔：supported hole28、非支撑孔：unsupported hole PCB设计论坛，PCB l ayout设计，高速PCB设计，高速SI仿真设计/ }4 K$ `7 w, n; ~9 a0 N" `;29、导通孔：via30、镀通孔：plated through hole (pth)* d9 n: q! W( |6 |& A* ^8 p31、余隙孔：access hole32、盲孔：blind via (hole).eda365." M- g6 ]0 w* h8 W( Z0 I: A4 "33、埋孔：buried via hole PCB设计论坛，PCB l ayou设计，高速PCB设计，高速SI仿真设计1 U+ Q( M$ u, [34、埋/盲孔：buried /blind via PCB设计论坛，PCB layou设计，高速PCB设计，高速SI仿真设计& l0 h' n+ I5 p$ * s, H,35、任意层部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole.eda365." ) J* a3 O1 r41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准外表间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole.eda365.. O: y& V6 p! C0 Z45、在连接盘中导通孔：via-in-pad.eda365.% f* h" \* h/46、孔位：hole location( \1 b" A3 P$ |/ T5 A) H47、孔密度：hole density PCB设计论坛，PCB layou设计，高速PCB设计，高速仿真设计9 p2 p( R; h/ ~ a* m$ D% g0 Q48、孔图：hole pattern- D2 h9 F$ y! {5 t- a* i49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance. ! .。
PCB专业术语中英文翻译
来源：风荷雨莲作者：风荷雨莲发布时间：2007-11-27 00:00:00 点击次数：01、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board (cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismale imide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (pi)38、聚四氟乙烯：polytetrafluoetylene (ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、 e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation .(eda)12、工程设计自动化：engineering design automaton .(eda2)13、组装设计自动化：assembly aided architectural design. (aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (pth)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：intersti t ial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance。
PCB术语中英文对照
(Discrete Board) ——复线板，是指用极细的漆包线直接在无铜的板面上进行立体交叉的布线，在用胶固定及钻孔与镀孔后，得到多层互连的线路板，是美国PCK公司所开发。
这种MWB可节约设计时间，适用于复杂线路的少量机种。
Nail Heading ——钉头，由于钻孔的原因导致多层板的孔壁的内层线路张开。
Negative Etchbak ——内层铜箔向内凹陷。
Negative Pattern ——负片，在生产或客户菲林上，图像被制作成透明而其它的地方被制作成非透明。
Nick ——线路边的切口或缺口。
Nodle ——从表面突起的大的或小的块。
Nominal Cured Thickness ——多层板的厚度，或者多层板相邻层与层之间固化后的厚度。
Nonwetting——敷锡导致导体的表面露出。
Overlap ——钻尖点分离，正常的钻尖是有两个第一面和两个第二面，是长刃及凿刃为棱线组成金字塔形的四面共点，此单一点称为钻尖点，当翻磨不良时，可能会出现两个钻尖点，对刺入的定位不利，是钻咀的大缺点。
Pink ring ——粉红圈,由于内层铜的黑氧化层被化学处理掉，而导致在环绕电镀孔的内层出现粉红色的环状区域。
Plated ——在多层板的压合过程中，一种可以活动升降的平台。
Point ——是指钻头的尖部。
Point Angle ——钻尖角，是指钻咀的钻尖上，有两条棱线状的长刃所构成的夹角，称为“钻尖角”。
Polarizing Slot ——偏槽，见“Keying Slot”。
Porosity Test ——孔隙率测试，是对镀金层所做的试验。
Press－Fit Contact——指某些插孔式的镀金插脚，为了以后抽换方便便常不施以填焊连接，而是在孔径的严格控制下，是插入的接脚能做紧迫式的接触。
Press Plate ——钢板，用于多层板的压合。
Rack ——挂架，是板子在进行电镀或其它湿流程处理时，在溶液中用以临时固定板子的夹具。
中英文对照的PCB专业用语
7、 印制接点：printed contact
8、 印制板装配：printed board assembly
9、 板：board
10、 单面印制板：single-sided printed board(ssb)
11、 双面印制板：double-sided printed board(dsb)
24、 挠性印制线路：flexible printed wiring
25、 刚性印制板：flex-rigid printed board, rigid-flex printed board
26、 刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed
42、 表面层合电路板：surface laminar circuit (slc)
43、 埋入凸块连印制板：b2it printed board
44、 多层膜基板：multi-layered film substrate(mfs)
45、 层间全内导通多层印制板：alivh multilayer printed board
59、 混合电路：hybrid circuit
60、 厚膜：thick film
61、 厚膜电路：thick film circuit
62、 薄膜：thin film
63、 薄膜混合电路：thin film hybrid circuit
64、 互连：interconnection
65、 导线：conductor trace line
30、 金属基印制板：metal base printed board
PCB行业最常用术语之中英文对照
PCB行业最常用术语之中英文对照(按字母检索)A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪anneal 回火annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求center beam method 中心光束法central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色color error 颜色错误compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper pad 铜箔圆配copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环cycle-time reduction 交期缩短date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electrochemical reactor 电化学反应器electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落) performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片pre-process ( front-end) 制前press 压床press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试rack 挂架radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow 胶流量resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法test point 测试点thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙tarnish and oxide resist 抗污抗氧化剂transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔visible inventory 有形的库存vision inspection 目视检查V oid 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
PCB专业用语 中英文对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance整理自快点PCB学院。
PCB术语中英文对照表
PCB术语中英文对照表Adｈesiｏn 附着力Annｕｌaｒ Rｉｎg 孔环AOI(aｕtomａtic oｐtｉcal insｐecｔiｏｎ) 自动光学检测AQL(ａccｅptable ｑｕaliｔｙｌｅvel）可接受得质量等级B＆sup2；iｔ(burieｄ bump inｔｅrｃｏnnｅction technolog ｙ）埋入凸块焊点互连技术BBH（bｕriｅd blｉnd ｈoｌｅ）埋盲孔BGA（baｌl grｉｄａrrａy) 球栅阵列Bｌisｔeｒ起泡Boaｒｄ Eｄges 板边Buｒr 毛头/毛刺BＵM（Build—up mｕltｉlayer）积层式多层板BＶH（burieｄ/ｂlinｄ vｉa hoｌe）埋/盲导通孔CAD（puter ａided dｅsign) 计算机辅助设计CAM(puter aided mａnｕfａcturing）计算机辅助制造Ｃａrｂｏｎ oil 碳油CEM(posiｔe ｅpoｘy mａｔｅrｉal）环氧树脂复合板材chaｍfeｒ倒角Characｔeｒistic ｉmpeｄanｃe 特性阻抗CNC(puteriｚed ｎｕmerｉcaｌｃｏnｔroｌ)计算机化数字控制Ｃonductor Ｃrack 导体破裂Condｕctor Spacing 导线间距ｃｏnｎector 连接器Ｃｏｐper fｏil 铜箔(皮）Cｒａziｎｇ微裂纹（白斑）Dｅlaminatiｏn 分层Ｄｅweｔting 半润湿(缩锡）DＦＭ（desｉgn for manuｆacturing）可制造性设计DIP（dｕａl ｉn-ｌine pａcｋagｅ）双列直插式组件Dk（ｄielｅcｔriｃ cｏnｓtａnｔ)介电常数DRC（ｄesign rule ｃhecking) 设计规则检查drａwing 图纸ECN(engineering change nｏtｉce）工程更改通知ECO(enｇineｅｒinｇ changｅｏｒder）工程更改指令E ｇlass 电子级玻璃entek OSP处理Eｐoxy rｅsiｎ环氧树脂ESＤ（eｌeｃtrostaｔiｃ disｃharｇｅ）静电释放Etched Maｒｋing 蚀刻标记Flａｔness 翘曲度Foreiｇｎ Iｎｃlusioｎ外来夹杂物Flame rｅｓiｓtant 阻燃性FR—2（fｌame—ｒetardａnt 2)耐燃酚醛纸基板FR—3(flame－rｅtardant ３）耐燃环氧纸基板FR—4（flame－retａｒdant 4）耐燃环氧玻璃布基板FＲ—５（fｌame-retaｒdanｔ 5）耐燃多功能环氧玻璃布基板ground 地面（层)Haｌｏｉng 晕圈ＨDI(high deｎsitｙ inteｒconneｃｔion）高密度互连技术HAＳL(hot air solｄｅr levelｉng）热风焊料整平（整平）ＩC（inｔeｇraｔｅｄ cｉrcuiｔｓ) 集成电路Ｉnk Stamped Maｒkｉnｇ盖印标记Insulatｉon ｒｅsistancｅ绝缘电阻Ｉon ｃｌeanlineｓs 离子清洁度IPＣ（ｔhe inｓtitutｅfor ｉnｔｅｒconnecting and pａｃkagiｎg of ｅlectrｏnｉc circｕiｔｓ）印制电路互连与封装协会IＳO（Ｉnｔernatiｏｎal ｏrgａnizatｉon ｆor standardization）国际标准化组织Lamiｎａte Vｏidｓ压合空洞ｌａｓer 激光LDI（laser direｃt ｉmaging) 激光直接成像ｌｅｇend 文字标记、符号Ｌｉfｔｅd Lａnds 焊盘浮起logｏ标志LPI（liquiｄｐhotoimａgeablｅ）液态感光成像LPISM(liquｉd phｏｔoimageable soldｅr mask）液态感光阻焊膜mａrkiｎｇ标记Ｍeaｓliｎg 白斑Mｉcrovoids 微坑mil 密耳（千分之一英寸）MIL-ＳTＤ(mｉliｔaｒy ｓtandard）美国军用标准Negatｉｖe Eｔchback 欠蚀Nｉckｓ缺口Noｄuｌes 镀镏Nonｗetting 不润湿(拒锡)open 开路OSP（organic soｌdeｒabilｉty prｅservaｔives) 表面抗氧化ｏxｉｄes 氧化物paｄ焊盘paｎel 拼板pattern 板面图形PCＢ（printeｄ cｉｒcuit ｂｏard) 印制电路板Pcs(piｅｃｅｓ）件、片、只Peeling 剥落pｉnｈole 针孔Pｉnk Rｉng 粉红圈Pits 凹坑pｉtｃh 中心距Pｌａting Ｖoｉdｓ镀层破洞plug 塞Positｉve Eｔｃhback 过蚀power 电源层preｐｒeｇ半固化片PTFE（polytetrａfｌuorｏetｈyｌene) 聚四氟乙烯PTH(plａtｅd through－ｈoｌe）金属化孔PWB（prｉntｅｄ-ｗiriｎg boarｄ) 印制线路板Ｒegisｔration 对准QA（quality ａsｓuranｃｅ）质量保证ＱＣ（qｕaｌity ｃontrol）质量控制QE（qualitｙ engineｅriｎg）质量工程QFP（quad flａt ｐacｋagｅ）方形扁平组件reｐaiｒ修理RCC(ｒｅｓin ｃｏated ｃoppeｒ) 已涂覆树脂得铜箔Refeｒence diｍensｉｏn 参考尺寸ｒegistration 对准度rｅsin 树脂rejectｉon 拒收reviｓioｎ修订版ＲF(rａdｉo frequencｙ）射频Rｉｐples 纹路ｒｏut 外形铣scratch 划伤Screeｎｅd Ｍarkｉnｇ纲印标记scoriｎg 刻槽short 短路sｉgｎal 信号Sｉｌk scrｅen 丝网Skip Coveraｇe 漏印sｌot 开槽SMD（suｒface moｕnt deviｃe）表面安装器件SMＯBC（solder maｓk ｏｖer bare cｏpｐeｒ）裸铜覆盖阻焊膜SMT(suｒfａce ｍount tecｈnologｙ) 表面安装技术smｅaｒ毛刺solder 焊锡Ｓ/Ｍ（solder ｍask）绿油ｓoldｅｒaｂiｌｉty 可焊性Soda Ｓtrawinｇ (汽水)吸管式浮空ＳPC(sｔａtiｓｔicaｌｐrocｅsｓｃontrol) 统计过程控制sｐacing 间距Ｔape ｔest 胶带实验ＴCE（tｈermal coeｆficiｅnt ｏf eｘpａnsiｏｎ）热胀系数TＤR(tｉme-dｏmａｉn refｌｅctometｒｙ)时域反射测试tolｅrancｅ公差Tentｉnｇ盖孔ＴeｘturｅＣoｎdiｔｉon 显布纹Ｔg(glａsｓ tｒaｎsiｔion teｍpeｒaｔｕrｅ) 玻璃软化温度THT （ｔｈｒough hoｌe tｅｃhnｏｌｏgy）通孔（插装)技术ｔrace 线路(条）UL（underｗriteｒs laboratｏries) 安全实验所NPTH 非金属化孔ＵV（ultrａviolet）紫外线辐射v－ｃut V刻Vｉa ｈolｅ导通孔(过线孔)vｏid 空洞wａrp 板弯Waｖes 波浪Wｅａve Exposurｅ露织物ｗetting 沾锡Wiｃking 灯芯效应（渗铜)Wｒｉnｋles 起皱五、形状与尺寸:１、导线（通道）:ｃoｎｄucｔion （tracｋ)2、导线(体）宽度：conduｃtｏr widｔｈ3、导线距离:conductｏr ｓpacｉng４、导线层:conductor layｅｒ5、导线宽度／间距：cｏnductor lｉｎe/sｐａce6、第一导线层:conductor layer no、1７、圆形盘：rouｎd pad８、方形盘:squaｒｅｐad9、菱形盘:diａｍond pad10、长方形焊盘:ｒeｃtanglｅｐad11、子弹形盘：bulｌet ｐaｄ12、泪滴盘:teａrdrop pａd１3、雪人盘：snowmaｎ pａd１4、 v形盘：ｖ-shaped pad１5、环形盘：ａnnulａr paｄ16、非圆形盘:ｎon－ｃirｃular ｐａd１７、隔离盘:isolation pad1８、非功能连接盘:ｍonfｕｎcｔｉonａｌ pａd １９、偏置连接盘:offｓeｔｌaｎd20、腹(背)裸盘：bacｋ—bａrd ｌaｎd２1、盘址：ａnchorｉng spaur22、连接盘图形：lａnd ｐattｅrn2３、连接盘网格阵列:lａnd griｄ array2４、孔环:ａnｎulａr ring2５、元件孔：ponent hｏle２6、安装孔:mountinｇ hole2７、支撑孔：ｓuｐported holｅ28、非支撑孔：unsuppｏrｔed hole29、导通孔：viａ3０、镀通孔:plａted thrｏｕｇh hole （ptｈ）３1、余隙孔：aｃcesｓｈolｅ32、盲孔:blind ｖｉa （ｈolｅ）３３、埋孔:ｂuｒiｅd via hｏle34、埋/盲孔：ｂurｉeｄ /ｂlinｄ via35、任意层内部导通孔：any layeｒ inｎｅr via hole (ａlｉvh）３６、全部钻孔：aｌl drilled holｅ3７、定位孔：toaｌinｇ hｏlｅ38、无连接盘孔:landless ｈole39、中间孔:interstitｉａｌ hole40、无连接盘导通孔：landlｅss via hoｌe41、引导孔:ｐiｌoｔ hole４2、端接全隙孔：ｔerｍinal clearomｅe holｅ４3、准表面间镀覆孔：quａｓｉ-interfａｃing plated—throｕgｈ hｏle 4４、准尺寸孔：ｄimensｉoneｄ holｅ45、在连接盘中导通孔：ｖia－in-pad46、孔位：hoｌe loｃatioｎ47、孔密度:hoｌｅ densitｙ４8、孔图：holｅ pａttern49、钻孔图：driｌl drａwing50、装配图：asｓembly drawing５1、印制板组装图:priｎted boａrd aｓsｅmｂly drａwｉng 5２、参考基准：dａtuｍ reｆeｒaｎｃe。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
PCB专业用语 中英文对照
一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board(pcb)5、印制线路板：printed wiring board(pwb)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(ssb)11、双面印制板：double-sided printed board(dsb)12、多层印制板：mulitlayer printed board(mlb)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit(fpc)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board,rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board(bum)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit(slc)43、埋入凸块连印制板：b2it printed board44、多层膜基板：multi-layered film substrate(mfs)45、层间全内导通多层印制板：alivh multilayer printed board46、载芯片板：chip on board(cob)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable(ffc)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate(ccl)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer(cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper ccl)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper ccl)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core,glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：uv blocking copper-clad laminates三、基材的材料1、a阶树脂：a-stage resin2、b阶树脂：b-stage resin3、c阶树脂：c-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent(wpe)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film(pi)38、聚四氟乙烯：polytetrafluoetylene(ptfe)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film(fep)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、e玻璃纤维：e-glass fibre43、d玻璃纤维：d-glass fibre44、s玻璃纤维：s-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise,filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil(ed copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil(ra copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil(rcc)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(cad)7、计算机辅助制造：computer-aided manufacturing.(cam)8、计算机集成制造：computer integrat manufacturing.(cim)9、计算机辅助工程：computer-aided engineering.(cae)10、计算机辅助测试：computer-aided test.(cat)11、电子设计自动化：electric design automation.(eda)12、工程设计自动化：engineering design automaton.(eda2)13、组装设计自动化：assembly aided architectural design.(aaad)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display.(ccd)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format.(mdf)27、机器描述格式数据库：mdf databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization(design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router(cad)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing(pdp)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequence五、形状与尺寸：1、导线（通道）：conduction(track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer no.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、v形盘：v-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole(pth)31、余隙孔：access hole32、盲孔：blind via(hole)33、埋孔：buried via hole34、埋/盲孔：buried/blind via35、任意层内部导通孔：any layer inner via hole(alivh)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referance整理自快点PCB学院。
PCB专业术语中英文对照
1影响电性及外观Affect upon electrical performance or appearance2过度的Excessively3异常Abnormal4规格不符specification is below standard5品质异常quality is below standard6严格按照QC规定Strictly according to QC regulation7定期研磨To make regularly re-sharpen8设备device(另義:主動零件) \ machine \9参数设置错误parameters setting error10依保养计划According to the maintaining plan11压力过小lack of pressure12曝光不全\过度exposure-energy insufficient\excessive 13间距不足spacing nonenough14线细width reduce15光强度Light Intensity16缺口nick\chipping17气泡Bubble\blister\air inclusion18异物foreign particle \ foreign material（壓合異物）\dust(灰塵)19被污染contaminated20干膜附著力不足 Poor adhesion of dry film21固定点开路fixed position open22固定点短路fixed position short23线路针孔trace pin-hole24孔破void in PTH hole\Barrel Crack25断脖子Open near pad26静置时间Holding time27识别方法identify method28膜屑反粘Contrary to adhere of scum29碎屑,残材 Debris30显影不洁Developing uncleanness 31外观不良Appearace defective32传动\传送速度convey speed33偏离deviation\shifted34单轴single axis35底片涨缩A/W expand or contract 36漏失率 Loss Rate37补偿compensation\balancing 38零件孔\面component hole\side39覆铜箔层压板\铜箔基板copper clad laminates (CCL)40线路露铜copper exposure41织纹显露weave exposure42光学点\基准标记fiducial mark43环氧树脂epoxy44蚀刻速率etch rate45网布fabric46助焊剂不均匀flux coating uneven 47过滤filtration48电测治具fixture49钻尖分离gap50标准板golden board1影响上件及外观affect upon mounting or appearance2铜厚测量仪Copper thickness Measuring Instrument 3佐证evidence4微蚀量microetching quantity5 湿度humidity6内部校正周期(校验矫正)internal proofread cycle\calibrationsystem cycle7板面刮伤Surface Scratch8制定handling 标Define standard of handling 9目视检查\目检visual inspection10规定频率defined frequency11压力计\表pressure gauge12工程程式designed program13超规格out of the tolerance14毛头\去毛头burr\deburring15影响下工序制作difficult to product in the following process16化学铜electroless plating17除胶速率desmearing rate18电流current19分层delamination\bulge20湿润Damped21预浸Pre-dipped22活化液activator23速化accelerator24漂锡solder float25热应力测试thermal stress test26孔环(焊垫)Lifted land\annular ring 27热水洗Hot water rinsing28震动马达vibrating motor29铜渣copper residue (copper splash)\cosmetics island獨立銅渣30清洁滤网purifying filters31定期换水replace water regularly32回收槽recovery tank33加强管控to strengthen the control of sth.34酸洗\硷洗acid\alkali rinse35定期分析浓度Analyze Conc. regularly36金属杂质污染Contamination of metal impurities37碳化物carbide38碳处理carbon treatment39整流器(电流矫正)Current rectifier40铜厚测量仪Copper Thickness Measuring Instrument 41刷磨速度Brush Speed42速度控制器velocity controller43电流控制器current controller44吸水滚轮破旧water-absorptive roller worn-out45新水补充不足Insufficient for water replenishment 46滤芯Filter element47化学药液chemicals liquid48孔塞(孔内异物)dirty hole49多与\少与1mil厚度Less\More than 1 mil Thickness50色差color variation1板面粘油墨屑(显影段)sticky ink debris2挡水滚轮water apart roller3网板高度Screen height4网板张力不足Screen tension insufficient5刮刀行程Squeegee distance6刮刀刃钝化Squeegee edge blunt7油墨黏度过大viscosity of ink too thick8张力应力tensile stress9后烤Post cure10印C面Printing Top(COMP) Side11印S面Printing (SOLD)Bottom Side12静电喷涂Spray Coating13印可剥胶Peelable Solder Mask14风刀air knife15隔离环clearance16烧焦burning17化镍金immersion nickel and gold18铜镍层接著不良Poor combination the copper and nickel 19刷磨滚轮brush roller20刷幅测试brush breadth\width test21脱脂温度Defatting Temp.22流量计flowmeter23执行\导电Conduct24助焊剂\熔合液rosin(天然松香)\flux\fusing fluids25锡粗Tin roughness26焊料中铜离子含量过高The cu2+ content out of upper in solder 27机台异常machine-motion error28缺点标示卡nominal card of defects29程序\程式错误Programbug30人员疏忽operator's carelessness31日保养daily maintainance32人员技能不熟练Operator is not skilled33口头考核examine orally34阻抗异常Impedance Abnormal35阻抗测量仪impedance measuring instrument36漏气puncture37受潮moisture absorption38膜面污染film surface contaminated39漏检Leaking inspection40二次元 2D(biaxial) dimension-measuringinstrument41工单run card\work order42飞针Flying Probe43目检Visual Inspection44专用治具测试Dedicated Tester45特殊特性Critical Feature46重要特性Important Feature47铜箔厚度Copper foil Thickness48板弯翘Bow and Twist(warp)49尺寸(含对角)Size(Diagonal)\dimensions(成型) 50拉力计\张力计tensile meter1棕化\黑化Brow\black oxide2循环水洗circulating water rinsing3PP胶片Prepreg4物理性质\化学性质physical\chemical character5暂存时间Temporary store time6铆钉组合Eyelet7叠板结构stacking(lay up) structure8铆钉rivet9热熔机heat-melting machine10有用寿命useful life11印制电路板Printed Circuit Board(PCB)12根本原因\真因Root Cause13围堵措施Containment Plan14现状Current Status15原因分析Gap Analysis16内部稽核\外部稽核Internal\outside Audit17修改\变更Modify18无卤素Halogen Free19更新\修订Update/Revise20改进措施ure Plan21长期异常Chronic22突发异常Excursion23陶尔(压力单位)Torr24靶孔距Space between target holes25层偏misalignment26组合线Combined producing line27钢板\隔板steel plate\caul plate\separator28板厚测量仪Board-thickness measuring instrument 29钢印机 steel seal machine30品质检验 quality examination31介质厚度dielectric thickness32吸水性moisture absorbability33耐磨性wear resistance34剥离强度stripping strength35焊锡耐热性heat-resistant of solder36抗麻斑测试spot-resistant test37信赖性测试reliability test38介电常数测量仪dielectric constant measuring device 39包装标籤packing tag40电子天平electrical balances41焊锡炉solder furnace42孔径规calliper gauge43比色计color comparing meter44密度计density meter45蚀刻均匀性Etching uniformability46化验单 laboratory list47出货单manifest48双面板\多层板 Reversible Board\Multi layer board 49定位孔 Location Hole50叠板数stack boards count1硝基戊烷amylnitrite2阳极泥anode slime (sludge)3液态光阻aqueous photoresist4纵横比aspect ratio5预留在制品banked work in process 6贝他射线照射法beta backscattering7斜边beveling8吹孔blow hole9黏结层bonding plies10焊桥solder bridge11接单生产Build To Order(BTO)12金手指斜边\倒角chamfering13网框chase14螯合剂chelator15化学键chemical bond16热膨胀Thermal Expansion17同心圆concentric circle18密贴性conformance19消费类产品consumer products20库伦定理coulombs law21喇叭孔countersink22试样coupon\sample23覆盖力covering power24挖空cut-outs25交期缩短cycle-time reduction 26专用型dedicated27缩锡dewetting28介质常数dielectric constant29孔黑\孔灰discolor hole30停机\稼动时间downtime\uptime31钻针切削面drill facet32钻针研磨机drill pointer33裸板(未镀铜) blank board34延展性ductility\Elongation35留边宽度edge spacing36金手指edge-board contact ( gold finger )\tab 37电化学反应器electrochemical reactor38脆性embrittlement39植PIN法\外部插梢法external pin method40织维突出fiber protrusion41成品final board42固著fixing43燃烧等级flammability rating44抗菌性\抗酶性fungus resistance45胶化时间gel time46一般阻焊油墨general resist ink47玻璃态转换温度glass transition temperature (Tg)48多孔\少孔Extra/Missing Hole49硬化剂hardener50空气滤清器\过滤器hepa filter1规范specification\standard2铣靶spot face3衝压\钢印stamping4标准液压法standard hydraulic lamination 5缺胶starvation6应力\应度strain7应力计stress meter8板面突起surface convex\swelling9板面检查surface examination10板面粗糙度surface roughness11热震荡试验thermal shock12厚度不均uneven thickness distribution 13抗污抗氧化剂tarnish and oxide resist14透光度transmittance15裁切线trim line16测试undercut17万用型universal18有形库存visible inventory19仓库warehouse20湿化学制程wet chemistry process21灯芯\渗铜wicking22纵横比width-to-thickness ratio23良率yield24点灯次数Times of Light switch25真空延迟时间Vacuum delayed time26+/-2 周The front or rear two weeks 27无尘室clean room28上喷压Upper spray pressure29下喷压Lower spray pressure30显影剂developer31主轴转速(RPM) Spindle Revolution Speed\Revolution PerMinute RPM32光电耦合器(Charge Couple Device) CCD3390° 孔切破90 degree breakage34缺点侦测\检测defect detection35聚焦focus36光校正calibration37极性Polarity38正极\阳极Positive39负极\阴极Negative40下钻点\下刀点entry41量杯measuring cup42微切片Microsection43爆孔hole breakout(鑽孔)\hole overflow(防焊油墨)44温差temperature difference45文字不清marking(symbol) blurred46文字白点S/L white point47补充显影additional developing48烘烤baking49确认检修系统Visual Repair System(VRS)50图表Diagram1腐蚀Corrosive2致癌物carcinogenic3有机体突变的Mutagenic4染色体错位chromosome aberration5畸形teratogenic6有害气体poisonous gas7易燃性Inflammability8爆炸性explosion9吸入\吸入剂inhalation10护目镜goggle11棉手套Cotton glove12化学特性Chemical properties13熔点Melting point14抽样检查spot check15沸水boiling water16冲模Punching17氢溴化物hydrochloride18醇\酒精alcohol19持续改进continual improvement20纠正措施corrective action21环境因素\影响\方针environment aspect\impact\policy22环境管理体系environment management system23污染预防prevention of pollution24品质关键点critical to quality(CTQ)25客户需求分析Customer Needs Mapping(CNM)26质量功能分布Quality Function Deployment(QFD)27失效模式及后果分析Failure Mode & Effects Analysis(FMEA) 28跨功能小组Cross-functional involvement29传感器sensor30点阵图tally chart31全面品质管理Total Quality Management(TQM)如QC七大手法32柏拉图Pareto Chart33因果图\鱼骨图Cause and Effect diagrams34脑力激荡Brainstorming35散布图Scatter diagrams36全面设备保养Total Productive Maintenance(TPM)37控制图Conttrol Chart38测定系统分析Gage Repeatability&Reproducibility(GRR) 39印制电路板协会Institute of printed circuit(IPC)40有机保焊膜Organic Solderability Preservative(OSP) 41进刀Feed42金盐Potassium Gold Cyanide(金氰化鉀PGC)43辐射式红外线焊接Radiation(輻射) Infrared Rays(IR)Reflow(焊接)44锡膏熔焊Reflow Soldering45缩锡Dewetting46锡炉浮渣Dross47锡尖Solder Icicle48锡球Solder Ball49电容器capacitor50波峰焊Wave Soldering1石油petroleum2线圈\缠绕coil3代理商agency4自由基Free Radical5镀金Golden Plating6防焊阻剂Polymer coating(solder resistent) 7内层(外层)孔环Internal(external) Annular ring8隧道式烤箱transmission toaster9直立式烤箱vertical toaster10光面\雾面油墨glossy\matte ink11晶片直接组装Chip On Board(COB)12组装密度packaging density13球状阵列Ball Grid Array(BGA)14焊膏solder paste\solder cream15焊料粉末(焊粉)solder powder16触变性thixotropy(粘度變化特性)17储存寿命shelf life18网版(脱网)高度snap off distance19拉丝stringing20平移偏差shifting deviation21贴装几Placement equipment22虚焊点(焊点不佳)colder solder connection23焊盘起翘lifted land24锡珠solder ball25波峰焊wave soldering26迴流焊reflow soldering27离子清洁度ion cleaning28印制电路元件printed circuit assembly(PCA)29特采Accept on Deviation\Use As It30首件检验报告First Piece Inspection Report31工序变更通知Process Chang Notice（PCN）32孔铜厚度Barrel Copper thickness\Hole CopperThickness33面铜厚度Surface Copper Thickness34皱折wrinkle35置信区间Confidence interval36相关性Correlation37相关矩阵Correlation Matrix38任意抽样法Haphazard Sampling39不合格品Nonconforming units40不合格Nonconformity41正态分布Normal Distribution42排列图(柏拉图)Pareto Chart43预测区间Prediction Interval44基于概率的控制图Probability Based Chart45制程能力Process Capability46二次函数Quadratic47随机抽样Random sampling48极差Range49合理子组Rational Subgroup50回归控制图Regression control chart1故障failure\breakdown2夹头grip holder3解析度\解像度resolution4可靠度reliability5孔位错误(孔偏)mis hole location6孔径\钻孔直径错误Hole Diameter error7离子污染度试验ionic contamination testing8线距line space9线宽line width\trace width10感光油墨liquid photoimageable solder resist ink 11批batch\lot12 裂痕\白斑\白点\白边crazing\mealing(白點)\Haloing(白邊)13对位不准misregistration14钉头nail heading15数位钻孔机NC drill16原稿底片original art work (A/W)17钻针重叠overlap18氧化oxidation19剥离\抗撕强度peel strength20感光起始剂photo initiator21凹陷dent22塞孔plug hole\stuffing23补线不良poor touch-up24循环周期Periodically cycle25初始资料protocal26喷砂pumice scrub27对位孔registration hole28文字印刷silk screen printing\printing of legend29胶渣resin smear30孔壁粗糙度roughtness31防焊文字S/L32毛边serrated edges 33跳印skip printing34漂锡solder float35喷涂spray coating36刮刀Squeegee37孔规taped hole gauge 38薄基板\内层板thin core39工作片工作母片working gerberworking master gerber40粗化abrade41电流密度Current Density42风刀Air Knife43获取资格的Qualify/qualified + n. or + to44现场locality(PD)45浓度偏低Conc. Lower46浓度偏高Conc. Higher47人员疏忽Operator careless48经纬向错误longitude and latitude contrary49上件不良failed componmt mounting50防呆孔Poka-Yoke hole\ mistake proofing hole1假性露铜unreal copper exposure2积墨ink accumulation3印偏ink printing deviated4遵照现场作业规范comply with the handling standardization 5放置时间Holding time6烘乾温度不足Insufficient in dry temperature7设备故障breakdown of machine8压膜滚轮 D/F laminated roller9sth. 受损或污染Damaged or contaminated10粘尘压力sticky pressure11曝光灯管exposure fluorescent tube12光阶 light step condition13曝偏Exposure misregistration14层间对准度alignment registration15吸气不良vacuum treatment abnormal16曝光藏点Exposure shelter17人员动作不当improper handling18显影Developing19蚀刻Etching20去膜stripping21Mylar 未撕Mylar non tearing off22教育训练instruction and trainning23进行显破点测试conduct developing point broken test 24喷压Spraying pressure25蚀刻不洁Etching incompletely\underetch26蚀刻液Etchants27首件确认First article confirm28电性不良Electrical performance defective29去膜不净Film stripping uncleanness 30几台漏测Equipment test leaking31领班Foreman32主管Chief33稳定性Stability34误判Misjudgement35混料Mixture36铝粉浓度(火山灰)Aluminum percentage37超音波测试(锡箔纸)Tin foil perforating test 38水破测试water broken test39油墨黏度ink viscosity40黏度计viscosimeter41数孔机hole counter42振动马达vibration motor43网版调偏net screen misregistration 44试印膜trial printing film45机台未清洁worktable uncleaness46万用塞孔垫板universal plugging back-up 47预烤Precure48上锡\焊锡性不良poor solderability49温度均匀性Temp. uniformability5010倍放大镜10X magnifier1捲尺measuring tape2千分尺micrometer3剥离强度Peeling strength4尺寸安定性Dimensional stability5有害物质Hazardous substance6元素分析仪 element analyzing instrument7显微镜microscope8游标卡尺vernier caliper9膜厚测量仪membrane thickness measuring intrument 10铣刀milling cutter\routing bit11钻针drill bit12化学元素chemical elements13化学药水chemical liquid14裁切刀具cutting tool15控制面板control panel16日点检表daily check list17光面油墨glossy green ink\resist(阻焊劑防染劑) 18公差\误差 tolerance\variance\bias(偏差)19量产mass production20白色文字white ident21成型外型routed outline22连片尺寸PNL drawing dimension23折断边break-away tabs24检查表inspection sheet25记录表data sheet\record chart26报表report forms27点检表Check list28磨边机Grind- edging machine\ Edger29打磨机polisher30板面光滑Board surface smooth31滴定法分析Titration analysis32温度计Temp. meter\Thermograph33压力计Pressure meter34能量格测试Energy-step tablet test35黏纸viscosity paper36六点测温仪Six points Temp. uniformability testInstrument37催化剂catalyst38稳定剂\安定剂stabilizer39硫酸铜回收机CuSO4 retrieve equipment40秒錶stopwatch41预热preheat42计时器chronograph\timepiece43能量计energy meter44靶孔机target hole equipment45铜含量The contents of Cu46液体比重计hydrometer47比重测定法stereometry48杀菌剂sterilant49蚀刻因子Etching factor\value\element50自动光学检测Automatical optical inspection(AOI)1精度Precision2栈板pallet3电动拖车\叉车electric trailer\fork lifter4针盘bit holder5放置架placement rack6静止消泡时间static\rest defoaming time7转板Transfer plate8水性笔Mark pen9尼龙\不织布\陶瓷nylon\non-woven fabric\ceramic10比色计chromo meter11湿度卡Humidity Indicator Cards12测温仪Thermoscope13龙门吊gantry crane14摇摆\摆动swing15PIN孔重合pin hole superposing16首躺first cycle17中和洗neutralization cleaning18流量flow amount19除胶速率desmear rate20湿润(电镀)moisten21获准供应商supplier warrant22供应商批准程序书Supplier Part Approval Process(SPAP) 23V-cut残厚Remain thickness of V-cut24冷媒油refrigerant oil25压力脚pressure foot26块规block gauge27高度规vernier height gage28金刚砂carborundum\Emery29火山灰volcanic ash30高阻计high resistance meter31模具图mold draw32支架Chassis33治具fixture34超音波浸洗ultrasonic dip35酸浸acid dipping36电流强度current amperage37化验分析表Assay analysis report forms38加压水洗Pressurized water rinsing39酸洗acid rinsing40溢流水洗cascade water rinsing\overflow 41沉淀缸sediment tank42冲污水waste water rinsing43水柱式冲洗Jet cleaning44高压水柱式冲洗High pressure rotating jet rinse 45清水洗Fresh water rinsing46干板组合Drying module47抗腐蚀测试accelerated corrosion test48速化反应acceleration49实际在制品active work in process50总量amount1高性能(电子)工业级high performance industrial2高延展性铜箔high temperature elongation copper(HTEC) 3高温树脂high temperature epoxy (HTE)4孔数hole number5哈氏槽hull cell6水解hydrolysis7改善方案implementation8努普(硬度单位)Knoop(Hardness)9牛皮纸kraft paper10压膜机laminator11刃角磨损lay back12牵引\定位螺丝lead screw13平整剂levelling additive14线性可变差动转换器linear variable differential transformer(LVDL)15 刷磨清洁法machine scrub16钻头刃带margin17主图\机构图master drawing18基材利用率material use factor19湿度与绝缘电阻测试moisture and insulation resistance test 20锯齿\蚀刻缺口mouse bite21负片negative film22结瘤\铜瘤nodule23流胶量百分比resin flow percentage24胶含量resin content25报废因素obsolescence factor26一铜panel plating27二铜pattern plating28透电率\介电常熟permittivity29极性吸引力polar-polar interaction30聚酯类polyester31孔变形poor drill32预聚合物prepolymer33原始资料protocal34喷砂清洁法pumice scrub35挂架rack36折光率refraction37对位元用标记register mark(對位點)38孔内沾文字S/L on hole39孔内防焊S/M on hole40干膜屑\透明残膜scum41漏印\跳印skip printing42表面附著元件SMD ( surface mount device )43表面附著技术SMT ( surface mount technology )44锡突solder bump45漂锡solder float46油墨附著力solder mask adhesion47金手指上锡solder on G/F48线路沾锡solder on trace49锡塞solder plug50统计制程管控SPC ( Statistical Process Control )1自检Self-examine2柠檬酸浓度Citric acid conc.3液位Liquid Level4析出物educt5垂直的perpendicular6喷砂能力pumice capability7阀门 Valve8外包加工contract-production9退货拒收REJ ( reject )10植PIN深度Depth of external pin11上PIN beat PIN12精确度Precision13准确度accuracy14操作员技术不娴熟operator technique unskilled 15套环深度depth of sleeve-ring16精修(成型)finely couting17漏钻\漏捞Leaking drilling\routing18多钻\多捞surplus drilling\routing19排屑chip load20排屑槽flute21蜂鸣器check beeper22建立档案资料(建档)Archive data building23合格qualified24电子称Electronic scale25封口时间sealing time26超出范围out of scope27微蚀速率Micro-etching ratio28变色\褪色discolor29破损breakage30电导率conductance ratio31履历表biographic sketch32公式formula33扩孔针reaming drill bit34电木板bakelite board35允收水准general criteria36理想状况Target Condition37模板\模具Template38基准孔reference holes39压敏开关Piezo-switch40指示灯indicator41直方图Histogram42并联导体parallel conductors43导体连接处area of adjacent conductors44金属导体Metal conductors45防焊侧露(焊垫\线路)Adjacent isolated lands or conductorsexposed46有害物质公约Restriction of Hazardous Substances(RoHS) 47预防措施Precaution48生物可降解Biodegradability49生态环境ecology50(垃圾\废弃物)处Disposal理1浸焊Immersion Soldering2焊接点Solder Joint3焊锡丝Solder Wire4待工温度Idle Temp.\+Time(空轉時間)5静电释放Electrostatic Discharge(ESD)6静电压力Electrostatic Overstress(ESO)7电阻係数Electrical Resistivity8内应力Internal Stress9导热係数Thermal Conductivity10磷含量Phosphorous11颗粒大小Grain Size(μm)12X光测量X-ray Diffraction13抗拉强度Tensil Strength(N/mm2)14介面化合物Intermstallic Compound(IMC)15贾凡尼效应Galvanic Effect(不同金屬電位差加速腐蝕)16高频信号High Frequency Signal17肌肤效应Skin Effect(高頻線路沿道題表面傳輸)18阻隔效应Barrier Effect(合金層可有效減低離子遷移度) 19银Silver20硫酸sulfuric acid21仪器Apparatus(測試用儀器)22抛光Polish23磨切片grind microsection24文件保存期限Documentation of age25内部管理政策Internal Policies26工资支付Salary payments27责任书Responsibility28法定最小年龄The legal minimum age29熟练\技能Facility30隐私权right to privacy31贪污\腐败corruption32有效日期valid period33温度循环实验Temperature Cycling Test(TCT)34热衝击实验Thermal Shock Test(TST)35离子迁移试验Electrochemical Migration Test(ECM) 36绝缘电阻试验Surface Insulation Resistance(SIR) 37阳极灯丝Conductive Anode Filament(CAF)38爆板popcorn39生产车间Fabricating Plant40吊车crane41危险物品hazardous substance42文字脱落symbol fading43锯齿Worm-Eaten-Crack44经纬方向Grain Direction45V-cut Slit46幻灯片slide47预算budget48运输工具transport49货物cargo50容器vessel。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
pcb常见术语中英资料
A/W (artwork) 底片Ablation 烧溶(laser),切除abrade 粗化abrasion resistance 耐磨性absorption 吸收ACC ( accept ) 允收accelerated corrosion test 加速腐蚀accelerated test 加速试验acceleration 速化反应accelerator 加速剂acceptable 允收activator 活化液active work in process 实际在制品adhesion 附着力adhesive method 黏着法air inclusion 气泡air knife 风刀amorphous change 不定形的改变amount 总量amylnitrite 硝基戊烷analyzer 分析仪annular ring 环状垫圈;孔环anode slime (sludge) 阳极泥anodizing 阳极处理AOI ( automatic optical inspection ) 自动:光学检测applicable documents 引用之文件AQL sampling 允收水准抽样aqueous photoresist 液态光阻aspect ratio 纵横比(厚宽比)As received 到货时back lighting 背光back-up 垫板banked work in process 预留在制品base material 基材baseline performance 基准绩效batch 批beta backscattering 贝他射线照射法beveling 切斜边;斜边biaxial deformation 二方向之变形black-oxide 黑化blank controller 空白对照组blank panel 空板blanking 挖空blip 弹开blister 气泡;起泡blistering 气泡blow hole 吹孔board-thickness error 板厚错误bonding plies 黏结层bow ; bowing 板弯break out 从平环内破出bridging 搭桥;桥接BTO (Build To Order) 接单生产burning 烧焦burr 毛边(毛头)camcorder 一体型摄录放机carbide 碳化物carlson pin 定位梢carrier 载运剂catalyzing 催化catholic sputtering 阴极溅射法caul plate 隔板;钢板calibration system requirements 校验系统之各种要求central projection 集中式投射线certification 认证chamfer 倒角(金手指)chamfering 切斜边;倒角characteristic impedance 特性阻抗charge transfer overpotential 电量传递过电压chase 网框checkboard 棋盘chelator 蟹和剂chemical bond 化学键chemical vapor deposition 化学蒸着镀circumferential void 圆周性之孔破clad metal 包夹金属clean room 无尘室clearance 间隙coat 镀外表coating error 防焊覆盖错误coefficient of thermal expansion (CTE) 热澎胀系数cold solder joint 冷焊点cold-weld 金属粉末冷焊color 颜色compensation 补偿competitive performance 竞争力绩效complex salt 错化物complexor 错化物component hole 零件孔component side 零件面concentric 同心conformance 密贴性consumer products 消费性产品contact resistance 接触电阻continuous performance 连续发挥效能contract service 协力厂controlled split 均裂式conventional flow 乱流方式conventional tensile test 传统张力测试法conversion coating 转化层convex 突出coordinate list 数据清单copper claded laminates (CCL) 铜箔基板copper exposure 线路露铜copper mirror 镜铜copper residue (copper splash) 铜渣corrosion rate numbering 腐蚀速率计数系统corrosion resistance 抗蚀性coulombs law 库伦定律countersink 喇叭孔coupon 试样coupon location 试样点covering power 遮盖力CPU 中央处理器crack 破裂;裂痕crazing 裂痕;白斑cross linking 交联聚合cross talk 呼应作用crosslinking 交联crystal collection 结晶收集curing 聚合体current efficiency 电流效率cut-outs 挖空cutting 裁板cyanide 氰化物cycles of learning 学习循环date code 周期deburring 去毛头dedicated 专用型degradation 退变delamination 分层dent / pin hole 凹陷/ 针孔department of defense 国防部designation 字码简示法de-smear 除胶渣developing 显影dewetting 缩锡dewetting time 缩锡时间dimension error 外形尺寸错误dielectric constant 介质常数difficulty 困难度difunctional 双功能dimension 尺寸dimension stability 尺寸安定性dimensional stability 尺度安定性dimension and tolerance 尺寸与公差dirty hole 孔内异物discolor hole 孔黑;孔灰;氧化discoloration 变色disposable eyelet method 消耗性铆钉法distortion factor 尺寸变形函数double side 双面板downtime 停机时间drill 钻孔drill bit 钻头drill facet 钻尖切萷面drill pointer 钻尖重(研)磨机drilled blank board 已钻孔之裸板drilling 钻孔dry film 干膜ductility 延展性economy of scale 经济规模edge spacing 板边空地edge-board contact ( gold finger ) 金手指efficiency 能量效率electric test 电测electrical testing 电测;测试electrochemical machine ECM 电化学加工法electroforming 电铸electroless plate 化学铜electroless-deposition 无电镀electropolishing 电解拋光electrorefining 电解精炼electrowinning 电解萃取elliptical set 椭圆形embrittlement 脆性entitlement performance 可达成绩效entrapment 电镀夹杂物epoxy 环氧树酯equipotential 电位线error data file 异常情形etch rate 蚀铜速率etchants 蚀刻液etchback 回蚀evaluation program 评估用程序exposure 曝光external pin method 外部插梢法eyelet hole 铆钉孔Eyeletting 铆眼fabric 网布failure 故障fast response 快速响应fault 瑕庛;缺陷fiber exposure 纤维显露fiber protrusion 纤维突出fiducial mark 光学点,基准记号filler 填充料film 底片filtration 过滤finished board 成品fixing 固着fixture 电测夹具(治具)flaking off 粹离flammability rating 燃性等级flare 喇叭形孔flat cable 并排电缆feedback loop 回馈循环first-in-first-out (FIFO) 先进先出flexible manufacturing system (FMS) 弹性制造系统flux 助焊剂foil distortion 铜层变形fold 空泡foreign include 异物foreign material 基材内异物free radical chain polymerization 自由基连锁聚合fully additive 加成法fully annealed type 彻底回火轫化之类形function 函数fundamental and basic 基本fungus resistance 抗霉性funnel flange 喇叭形折翼galvanized 加法尼化制程gap 钻尖分开gauge length 有效长度gel time 胶化时间general resist ink 一般阻剂油墨general 通论general industrial 一般性(电子)工业级geometrical levelling 几何平整glass transition temperature (Tg) 玻璃态转换温度Gold 金gold finger 金手指gold plating 镀金golden board 标准板gouges 刷磨凹沟gouging 挖破grain boundary 金属晶体之四边green 绿色grip 夹头ground plane 接地层ground plane clearance 接地空环hackers 骇客HAL ( hot air leveling ) 喷锡haloing 白边;白圈hardener 硬化剂hardness 硬度hepa filter 空气滤清器high performance industrial 高性能(电子)工业级high reliability 高可靠度high resolution 高分辨率high temperature elongation (HTE) 高温延展性铜箔high temperature epoxy (HTE) 高温树酯hit 击hole counter 数孔机hole diameter 孔径hole diameter error 孔径错误hole location 孔位hole number 孔数hole wall quality 孔壁品质hook 外弧hot dip 热浸法hull cell 哈氏槽hybrid 混成集成电路hydrogen bonding 氢键hydrolysis 水解hydrometallurgy 湿法冶金法image analysis system 影像分析系统image transfer 影像转移immersion gold 浸金(化镍金) immersion plating 浸镀法impedance 阻抗infrared reflow 红外线重熔inhibitor 热聚合抑制剂injection mold 射模ink 油墨innerlayer & outlayer 内外层insulation resistance 绝缘电阻intended position 应该在的位置intensifier 增强器intensity 强度inter molecular exchange 交互改变interconnection 互相连通ionic contaminants 离子性污染物ionic contamination testing 离子污染试验IPA 异丙醇5I : inspiration (启蒙)identification 确认计划目标implementation 改善方案information 数据internalization 制度化invisible inventory 无形的库存knife edges 刀缘Knoop 努普(硬度单位)kraft paper 牛皮纸返回顶部laminar flow 层流laminate 基层板laminating 压合lamination 压合laminator 压膜机land 焊垫lay back 刃角磨损lay up 组合叠板layout 布线;布局lead screw 牵引螺丝leakage 漏电learning curve 学习曲线legend 文字标记leveling 平整levelling additive 平整剂levelling power 平整力life support 维系生命limiting current 极限电流line space 线距line width 线宽linear variable differential transformer(LVDL) 线性可变差动:转换器liquid 液状(态)liquid crystal resins 液晶树脂liquid photoimageable solder resist ink 液态感光防焊油墨liquid photoresist ink 液态光阻剂油墨lot size 批量lower carrier 底部承载板mechanical plating 机祴镀法machine scrub 刷磨清洁法macrothrowing power 巨分布力margin 钻头刃带market share 市场占有率marking error 文字错误masked leveling 儰装平整mass lamination 大型压板mass transfer 质量传送效应mass transfer overpotential 质量传递过电压mass transportation 质传master drawing 主图;蓝图material use factor 材料使用率mealing 泡点;白点memory 记忆装置meniscograph solderability measurement 新月型焊锡效果microetch 微蚀microetching 微蚀microfocus 微焦距microfocus system 微焦距系统microprofile 微表面microsectioning 微切片法microthrowing power 微分布力migration 迁移mini-tensile tester 迷你拉力测试仪mis hole location 孔位错误misregistration 焊锡面与零件面对位偏差misregsitration 对不准moisture and insulation resistance test 湿气与绝缘电阻试验molded circuit board (MCB) 模制电路板monoethanal amine 单乙醇氨monohydrate state 水化物monomer 单分子膜;单体mouse bite 锯齿;蚀刻缺口msec 毫秒muffle furnace 高温焚火炉multichip 超大IC型(多芯片模块)mylar 保护膜nail head 钉头NC drill 数字钻孔机negative etchback 反回蚀negative film 负片negative rake angle 负抠耙角network 回路;网络neutralization 中和nick 缺口nickel 镍nodule 铜瘤;瘤粒no flow resin 不流树脂noise 噪声nominal 标示nominal dimension 标定长度nominal gel time 标示胶性时间nominal resin content 标示胶含量nominal resin flow 标示胶流量nominal scaled flow thickness 标示比例流量厚度OA equip 办公室自动:化设备obsolescence factor 报废因素OEM 原设备制造商offset-list 补偿数据清单ohmmeter 欧姆计open 断路open circuits 断路open short testing 断短路测试opening 开口original art work (A/W) 原稿底片Others 其它outgrowth 增出over design 牛刀杀鸡overlap 钻尖重叠overlay entry 盖板overpotential 过电压oxidation 氧化oxide treatment 黑化处理oxided cytochrome 氧化性之细包色素oxygen evolution 氧气发生反应packed bed 充填床式pad 锡垫;圆配pad copper exposure pad露铜panel 小型板面;母板panel plating 一次铜电镀parasitic 寄生的part no. 料号pattern plating 二次铜电镀PCB ( print circuit board ) 印刷电路板pcs 片peel strength 抗撕强度peeling off 剥离(剥落)performance specification 性能规范permittivity 透电率perspectives on experience 经验透视PET 聚酯photodiode detector 发光二极管侦测器photo initiator 感光启始剂photoresist 光阻phototool 光具(指工作底片)piece 子板面pinceton applied research 腐蚀测定仪pink ring 粉红圈pit 凹点pitch 脚距planar 平面plating 电镀plating exposure 下镀层露出plug gauge 插规plug hole 孔塞PNL (panel) 排板polar-polar interaction 极性之间的吸力polyester 聚酯类polyglycols 聚乙二醇polyimide 聚亚醯氨poor bevelling 磨边加工引起突起,剥离poor drill 孔形不良poor HAL 喷锡不良poor marking 字体不良poor pad 锡垫不良poor printed 印刷偏差poor solderability 焊锡性不良poor touch-up 补线不良position control system 位置控制系统positive rake angle 正抠耙角power curve model 幕次曲线模式practice 工艺惯例preferred 良好premature tearing 提前撕裂prepolymer 预聚合物prepreg 胶片press cycle 压合周期primary current distribution 一次电流分布primary 主要product lifetimes 生命周期product process 制程promoter 促进剂protocal 初步资料prussic acid 普鲁士酸PTF-based process 厚膜糊法PTH (plating though hole) 导通孔pull away 拉开pumice 浮石粉pumice scrub 喷砂清洁法pyrometallurgy 火烧法冶炼QC ( quality control) 品管QFP (quad flat pack ) 扁方型封装体qualification inspection 资格审查检验qualification testing 资格检定quality classification 品质等级quantitative 计量式测试radiometer 能量剂rake angle 抠耙角RAM [Random Access Memory 随机存取内存real time 关键时刻recessed trace process 凹槽线路法recovery tank 回收槽reduction 还原re-eninforcement 强化refraction 折光率reinforcement style 补强材料的型式register mark 对位用标记registration hole 对位孔registration pattern 长方形铜地REJ ( reject ) 退货;拒收rejectable 拒收release agent 脱模剂relief angle 浮离角remark 备注repair 修理resin content 树脂含量(胶含量)resin flow percentage 树脂流量之百分率resin recession 树脂下陷resin smear 胶渣resist strippers 剥干膜剂resistor network 排列电阻resolution 解像度return on assets 资产报酬率reversibility 可逆性rework 重工rosin 天然松香rotating cylinder 旋转圆柱形roughtness 孔壁粗糙;粗慥routing 切外形,成型routing bit 铣刀runout 偏转S/L on hole 孔内沾文字S/M ( solder mask ), S/L 防焊文字S/M (solder mask) 防焊S/M error 防焊种类错误S/M on hole 孔内绿漆salt spray test 盐水喷雾试验sampling size 抽样数scope 范围scored 刻痕scoring 枢槽;刮线scrap 废框scratches 刮伤screen printing 网版印刷scum 透明残膜sealing 封孔处理secondary 次要semi-additive 半加成法sensitize 敏化sensitizer 敏化液separator 钢隔板sequential lamination 渐成式压法serrated edges 毛边shatter 破碎short 短路shunt 分路silane treatment 硅烷处理silicone coupling agent 硅烷偶合剂silk screen 文字印刷simulator 仿真器single axis 单轴sizing 底片之伸缩补偿skip 漏印skip printing 跳印;漏印sliver 丝条slot 开槽slotting 开槽SMD ( surface mount device ) 表面黏着组件smear 胶渣SMT ( surface mount technology )表面黏着技术sodium carbonate monohydrate 结晶水碳酸钠soft tooling 软性工具solder 焊锡; 锡铅solder bridge 锡桥solder bump 锡突solder float 漂锡solder mask adhesion 绿漆附着力solder on G/F 金手指沾锡solder on trace 线路沾锡solder plug 锡塞solder side 焊锡面solderability 焊锡性solid carbide 实质碳化物spacing 间距spacing nonenough 间距不足SPC ( Statistical Process Control ) 统计生管specification 规范special considerations 特别考虑spin coating 旋转涂布spindle 钻轴spiral contractometer 螺旋收缩仪spot face 铣靶spray coating 喷涂Squeegee 刮刀stacking structure 叠板结构stamping 冲压standard hydraulic lamination标准液压法standardizing 标准化starvation 缺胶step tablet 格片数stock option 认股选择权strain 应度strength 强度stressmeter 应力计subtractive 减除法surface convex 表面突起surface examination 表面检查surface insulation resistance (SIR) 表面绝缘电阻surface mount 表面黏着方式surface roughness 表面粗慥度surges 突波switch circuit 开关线路tab 金手指tack free 不黏taped hole gauge 锥形孔规target hole 靶孔task force 任务编组tensile strength 抗拉强度tensile stress 张性应力tent 浮盖terms and definitions 术语与定义termination load 抗匹配负载test circuit 测试线路test method 试验方法thermal shock 热震荡试验thermal stress 热应力试验thermistor 热电感应式thermo cycling 热循环试验theoretical cycle time 理论性周期时间thickness 厚度time to market 上市时机thickness distribution 厚度分布thief 补助阴极thin core 薄基板;内层板throwing power 分布力tolerance 公差;容差tooling hole 工具孔torque load 扭力拒之负载total quality program 全面的品质计划toughness 坚度trace error 线路错误trace nick & pin hole 线路缺口及针孔trace peeling 线路剥离trace pin-hole 线路针孔trace surface roughness 线路表面粗糙transmittance 透光度trim line 裁切线true levelling 真平整true position 真正位置的孔;真位twist 板翘type 种类umbra 本影undercut 侧蚀uneven coating 喷锡厚镀不平整universal 万用型universal tensile tester 万用拉力试验机universal tester 泛用型测试机upper carrier 顶部承载钢uptime 稼动:时间vacuum deposition 真空蒸镀法vacuum hydraulic lamination真空液压法vaporizer 气化室V-cut V形槽vertical microsection 垂直微切片via hole 导通孔vision inspection 目视检查Void 孔破void in hole 孔壁上的破洞void in PTH hole 孔破walkman 随身听warehouse 仓库warp 板弯warp , warpage 板弯water absorption 吸水性wear resistance 耐磨度weave exposure 纤纹显露weave texture 织纹隐现wedge angle 契尖角week 周wet chemistry 湿式化学制程wet film 湿膜wet lamination 湿膜压膜法wet process 湿制程wetting 沾锡wetting balance 沾锡平衡法wicking 渗铜;渗入;灯蕊效应width 宽度width reduce 线细width-to-thickness ratio 宽度与厚度的比值window 操作范围work-in-process 在制品work order 工单working film 工作片working master 工作母片year 年yellow 金黄色yield 良率。
PCB专业术语中英文翻译
PCB专业术语中英文翻译很多PCB的书上使用的是英文，但是大多数的人又看不懂英文，这时候怎么办呢，我们需要翻译，但是如果每看到一个不会的词儿就去翻译，那么就太耗费时间了，所以我们捷多邦总结了一些常用的专业术语的中英文对照，希望能对大家有用。
1.印制电路：printed circuit2.印制线路：printed wiring3.印制板：printed board4.印制板电路：printed circuit board (pcb)5.印制线路板：printed wiring board(pwb)6.印制元件：printed component7.印制接点：printed contact8.印制板装配：printed board assembly9.板：board 110.表面层合电路板：surface laminar circuit (slc)11.埋入凸块连印制板：b2it printed board12.多层膜基板：multi-layered film substrate(mfs)13.层间全内导通多层印制板：alivh multilayer printed board14.载芯片板：chip on board (cob)15.埋电阻板：buried resistance board16.母板：mother board17.单面印制板：single-sided printed board(ssb)18.双面印制板：double-sided printed board(dsb)19.多层印制板：mulitlayer printed board(mlb)20.多层印制电路板：mulitlayer printed circuit board21.多层印制线路板：mulitlayer prited wiring board22.刚性印制板：rigid printed board23.刚性单面印制板：rigid single-sided printed borad24.刚性双面印制板：rigid double-sided printed borad25.刚性多层印制板：rigid multilayer printed board26.子板：daughter board27.背板：backplane28.裸板：bare board29.键盘板夹心板：copper-invar-copper board30.动态挠性板：dynamic flex board31.静态挠性板：static flex board32.可断拼板：break-away planel33.电缆：cable34.挠性扁平电缆：flexible flat cable (ffc)35.薄膜开关：membrane switch36.混合电路：hybrid circuit37.厚膜：thick film38.厚膜电路：thick film circuit39.薄膜：thin film40.挠性多层印制板：flexible multilayer printed board41.挠性印制板：flexible printed board42.挠性单面印制板：flexible single-sided printed board43.挠性双面印制板：flexible double-sided printed board44.挠性印制电路：flexible printed circuit (fpc)45.挠性印制线路：flexible printed wiring46.刚性印制板：flex-rigid printed board, rigid-flex printedboard47.刚性双面印制板：flex-rigid double-sided printed board,rigid-flex double-sided printed48.刚性多层印制板：flex-rigid multilayer printed board,rigid-flex multilayer printed board49.齐平印制板：flush printed board50.金属芯印制板：metal core printed board51.金属基印制板：metal base printed board52.多重布线印制板：mulit-wiring printed board53.陶瓷印制板：ceramic substrate printed board54.导电胶印制板：electroconductive paste printed board55.模塑电路板：molded circuit board56.模压印制板：stamped printed wiring board57.顺序层压多层印制板：sequentially-laminated mulitlayer58.散线印制板：discrete wiring board59.微线印制板：micro wire board60.积层印制板：buile-up printed board61.积层多层印制板：build-up mulitlayer printed board (bum)62.积层挠印制板：build-up flexible pr上面是一些比较常见的专业用语，有一些不是特别常用的有时候我们也会遇到，所以我们捷多邦也总结了一些不怎么常用的中英文对照，希望对你来说是有用的：1.Absorption 吸收、吸入2.Accelerated Test（Aging）加速试验、加速老化3.Accelerator 加速剂、速化剂4.Accept/Acceptance 允收5.Acceptable Quality Level（AQL）允收品质水准6.Accuracy 准确度ACF：7.Adhesive copper foil 有胶铜箔8.Activator 活化剂、添加剂比称为9.Activator Active parts（Devices）主动零件，指积体电路或电晶体10.Addition Agent 添加剂11.Additive Process 加成法、分全加成、半加成及部份加成12.Back Light（Back Lighting）背光法13.Back-UP 垫板14.Backpanels/ Backplanes 背板、支持板，厚度较厚，15.Ball Grid Array（BGA）球脚车列（封装）16.Barrel 孔壁17.Base Material 基材18.Batch 批（同时间发料某一数量的板子）19.Bevelling 切斜边20.Binder 黏结剂21.Capacitance 电容22.Carbide 碳化物、碳化钨钻头23.CAR: Corrective Action Report 改善报告24.Carbon Treatment 活性碳处理25.Card 卡板26.Carrier 载体27.Cartridge 滤芯28.Cathode 阴极L: Copper Clad Laminates 铜箔基板30.Ceramics 陶瓷31.Certificate 证明书32.CFC 氟氯碳化物33.Chloro-Fluoro-Carbon Chamfer 倒角、去掉直角34.Characteristic Impedance 特性阻抗35.Cheek list 检察清单36.Chip 晶粒、晶片37.Chip On Board 晶片黏著板38.Clean Room 无尘室(Class 100)39.Cleanliness 清洁度40.Clearance 余隙、余环41.COB（Chip on Board）晶片在板上直接组装42.COC（Certificate of Compliance）出货合格书。
PCB专业术语中英文汇总
中文
代码
英文名称
图形电镀去膜
SAP
Stripping after Pattern Plating
退锡
TSR
Tin Stripping
蚀刻/退锡
ETS
Etching, Tin Stripping
去膜/蚀刻/退锡
SES
DF Stripping, Etching, Tin Stripping
AOI：AOI
中文
代码
英文名称
外层离线AOI
OOA
Outer Offline AOI
外层AOI
OAO
Outer AOI
层间对准度测试1
QRE1
IPQC for Registration 1
外层VRS
OVR
Outer VRS
MASKAOI
MAO
Mask AOI
填孔AOI
SAO
Solid Via Filling Plating AOI
减铜干膜曝光
DER
D/F Exposuring before Copper Reduction
减铜干膜显影
DDR
D/F Development before Copper Reduction
减铜干膜LDI
DDC
D/F Laser Direct Image before Copper Reduction
脉冲全板电镀
PPP
Pulse Panel Plating
POFV沉铜
PBP
PTH before POFV
POFV电镀
POFV
Plate over Filling Via
全板电镀
PCB行业英文
PCB专业英译术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequenc五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan電路板朮語總整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應.Accelerator 加速劑,速化劑.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑.Adhesive膠類或接著劑.Admittance導納(阻抗的倒數).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.Air Inclusion氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗.Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準.Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備.Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角.Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝).Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則 Be=145-(145÷Sp.Gr) 凡液體比重比水輕則 Be=140÷(Sp.Gr-130)*Sp.Gr 為比重即同體勣物質對"純水"1g/cm的比值). Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射. Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖. Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條). 在425℃~870℃下進行熔接的方式). Break Point顯像點.Break-away Panel可斷開板. Breakdown V oltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stageB階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process凸塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar匯電杆.Butter Coat 外表樹脂層.*****C*****C4 Chip JointC4晶片焊接.Cable電纜.CAD電腦輔助設計.Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法.Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細作用.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理.Card卡板.Card Cages/Card Racks電路板搆裝箱. Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型勣體電路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode陰極.Cation陰向離子, 陽离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心間距. Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨.Chemical Resistance抗化性.Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG).Chisel鑽針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室.Cleanliness清潔度.Clearance余地,余環.Clinched Lead Terminal緊箝式引腳.Clinched-wire Through Connection通孔彎線連接法. Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數.Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM-1,CEM-3)復合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠. Controlled Depth Drilling定深鑽孔. Conversion Coating 轉化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗.Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標記. Counterboring方型擴孔. Countersinking錐型擴孔.Coupling Agent 偶合劑.Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積. Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交.Crosstalk雜訊, 串訊.Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化.Current Density電流密度.Current-Carrying Capability載流能力. Curtain Coating濂塗法.*****D*****Daisy Chained Design菊瓣設計. Datum Reference基准參考. Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計)).Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重鉻酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown V oltage介質崩潰電壓.Dielectric Constant介質常數.Dielectric Strength介質強度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法. Diffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板.Dish Down碟型下陷.Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受擾焊點.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In / Drag Out帶[進/帶出.Drag Soldering拖焊.Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削面.Drill Pointer鑽針重磨機.Drilled Blank已鑽孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy, Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動態軟板.*****E*****E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器.Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試. EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級玻璃.Elastomer彈性體.Electric Strength(耐)電性強度. Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅..Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動, 電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性, 延伸率.Embossing凸出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interference)電磁干擾. Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.End Tap封頭.Entek有機護銅處理.Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指標.Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*****F*****Fabric綱布.Face Bonding反面朝下結合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線. Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基准記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細線.Fine Pitch密腳距,密線距,密墊距. Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法. First Article首產品.First Pass-Yield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數, 抗撓性模數. Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 , 貼平式導體. Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所復合成的材料.Gage, Gauge量規.Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位,所發展一系列完整的軟體檔案).Ghost Image陰影.Gilding鍍金(現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標准格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環.Guide Pin導針.Gull /Wing Lead鷗翼引腳.*****H*****Halation環暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名.Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過瀘機. Hipot Test 高壓電測.Hi-Rel高度靠度.Hit 擊(鑽孔時鑽針每一次"刺下"的動作).Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔准備.Hole Pull Strength孔壁強度.Hole V oid破洞.Hook 切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*****I*****I.C. Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.Inter Face介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內應力.Interposer互邊導電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization V oltage (Corona Level)電離化電壓(電纜內部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.*****J*****JEDEC(Joint Electronic Device 聯合電子元件工程委員會.Engineering Council)J-LeadJ型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*****K*****Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金為100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結搆.Laminate V oid板材空洞.Laminate(s)基板.Lamination V oid壓合空洞.Laminator壓膜機.Land孔環焊墊,表面焊墊.Landless Hole無環通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機. Laser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出.Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起.Ligand錯離子附屬體.Light Emitting Diodes (LED)發光二極體.Light Integrator光能累積器.Light Intensity光強度.Limiting Current Density極限電流密度.Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態介質.Liquid Photoimagible Solder Mask, (LPSM)液態感光防焊綠漆. Local Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*****M*****Macro-Throwing Power巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)的復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing泡點.Mean Time To Failure (MTTF)故障前可用之平均時數. Measling白點.Mechanical Stretcher機械式張網機.Mechanical Warp機械式纏繞.Mechanism機理.Membrane Switch薄膜開關.Meniscograph Test弧面狀沾錫試驗.Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈.Metallization金屬化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線.Microthrowing Power微分布力.Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向.Misregistration 對不准度.Mixed Componmt Mounting Technology混合零件之組裝技術. Modem調變及解調器.Modification修改.Module模組.Modulus of Elasticity彈性系數.Moisture and Insulation Resistance Test溼氣與絕緣電阻試驗. Mold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口).Multi-Chip-Module(MCM)多晶片芯片模組.Multiwiring Board (or Discrete Wiring Board)復線板.*****N*****N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄.Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤.Nomencleature標示文字符號.Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊.Non-flammable非燃性.Non-wetting不沾錫.Normal Concentration (Strength)標準濃度,當量濃度. Normal Distribution常態分布.Novolac酯醛樹脂.Nucleation , Nucleating核化.Numerical Control數值控制.Nylon尼龍.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)無氧高導電銅. Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合.Oligomer寡聚物.Omega Meter離子污染檢測儀.Omega Wave振盪波.On-Contact Printing密貼式印刷.Opaquer不透明劑,遮光劑.Open Circuits斷線.Optical Comparater光學對比器(光學放大器.) Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservatives (OSP)有機保焊劑. Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離.Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.。
PCB专业术语翻译（英语）
PCB专业术语翻译（英语）PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PW A Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
pcb专业术语2703790738.doc
PCB专业英译术语一、综合词汇1、印制电路：printed circuit2、印制线路：printed wiring3、印制板：printed board4、印制板电路：printed circuit board (PCB)5、印制线路板：printed wiring board(PWB)6、印制元件：printed component7、印制接点：printed contact8、印制板装配：printed board assembly9、板：board10、单面印制板：single-sided printed board(SSB)11、双面印制板：double-sided printed board(DSB)12、多层印制板：mulitlayer printed board(MLB)13、多层印制电路板：mulitlayer printed circuit board14、多层印制线路板：mulitlayer prited wiring board15、刚性印制板：rigid printed board16、刚性单面印制板：rigid single-sided printed borad17、刚性双面印制板：rigid double-sided printed borad18、刚性多层印制板：rigid multilayer printed board19、挠性多层印制板：flexible multilayer printed board20、挠性印制板：flexible printed board21、挠性单面印制板：flexible single-sided printed board22、挠性双面印制板：flexible double-sided printed board23、挠性印制电路：flexible printed circuit (FPC)24、挠性印制线路：flexible printed wiring25、刚性印制板：flex-rigid printed board, rigid-flex printed board26、刚性双面印制板：flex-rigid double-sided printed board, rigid-flex double-sided printed27、刚性多层印制板：flex-rigid multilayer printed board, rigid-flex multilayer printed board28、齐平印制板：flush printed board29、金属芯印制板：metal core printed board30、金属基印制板：metal base printed board31、多重布线印制板：mulit-wiring printed board32、陶瓷印制板：ceramic substrate printed board33、导电胶印制板：electroconductive paste printed board34、模塑电路板：molded circuit board35、模压印制板：stamped printed wiring board36、顺序层压多层印制板：sequentially-laminated mulitlayer37、散线印制板：discrete wiring board38、微线印制板：micro wire board39、积层印制板：buile-up printed board40、积层多层印制板：build-up mulitlayer printed board (BUM)41、积层挠印制板：build-up flexible printed board42、表面层合电路板：surface laminar circuit (SLC)43、埋入凸块连印制板：B2it printed board44、多层膜基板：multi-layered film substrate(MFS)45、层间全内导通多层印制板：ALIVH multilayer printed board46、载芯片板：chip on board (COB)47、埋电阻板：buried resistance board48、母板：mother board49、子板：daughter board50、背板：backplane51、裸板：bare board52、键盘板夹心板：copper-invar-copper board53、动态挠性板：dynamic flex board54、静态挠性板：static flex board55、可断拼板：break-away planel56、电缆：cable57、挠性扁平电缆：flexible flat cable (FFC)58、薄膜开关：membrane switch59、混合电路：hybrid circuit60、厚膜：thick film61、厚膜电路：thick film circuit62、薄膜：thin film63、薄膜混合电路：thin film hybrid circuit64、互连：interconnection65、导线：conductor trace line66、齐平导线：flush conductor67、传输线：transmission line68、跨交：crossover69、板边插头：edge-board contact70、增强板：stiffener71、基底：substrate72、基板面：real estate73、导线面：conductor side74、元件面：component side75、焊接面：solder side76、印制：printing77、网格：grid78、图形：pattern79、导电图形：conductive pattern80、非导电图形：non-conductive pattern81、字符：legend82、标志：mark[/size]作者：ilww 2004-11-10 16:18:00)二、基材：1、基材：base material2、层压板：laminate3、覆金属箔基材：metal-clad bade material4、覆铜箔层压板：copper-clad laminate (CCL)5、单面覆铜箔层压板：single-sided copper-clad laminate6、双面覆铜箔层压板：double-sided copper-clad laminate7、复合层压板：composite laminate8、薄层压板：thin laminate9、金属芯覆铜箔层压板：metal core copper-clad laminate10、金属基覆铜层压板：metal base copper-clad laminate11、挠性覆铜箔绝缘薄膜：flexible copper-clad dielectric film12、基体材料：basis material13、预浸材料：prepreg14、粘结片：bonding sheet15、预浸粘结片：preimpregnated bonding sheer16、环氧玻璃基板：epoxy glass substrate17、加成法用层压板：laminate for additive process18、预制内层覆箔板：mass lamination panel19、内层芯板：core material20、催化板材：catalyzed board ,coated catalyzed laminate21、涂胶催化层压板：adhesive-coated catalyzed laminate22、涂胶无催层压板：adhesive-coated uncatalyzed laminate23、粘结层：bonding layer24、粘结膜：film adhesive25、涂胶粘剂绝缘薄膜：adhesive coated dielectric film26、无支撑胶粘剂膜：unsupported adhesive film27、覆盖层：cover layer (cover lay)28、增强板材：stiffener material29、铜箔面：copper-clad surface30、去铜箔面：foil removal surface31、层压板面：unclad laminate surface32、基膜面：base film surface33、胶粘剂面：adhesive faec34、原始光洁面：plate finish35、粗面：matt finish36、纵向：length wise direction37、模向：cross wise direction38、剪切板：cut to size panel39、酚醛纸质覆铜箔板：phenolic cellulose paper copper-clad laminates(phenolic/paper CCL)40、环氧纸质覆铜箔板：epoxide cellulose paper copper-clad laminates (epoxy/paper CCL)41、环氧玻璃布基覆铜箔板：epoxide woven glass fabric copper-clad laminates42、环氧玻璃布纸复合覆铜箔板：epoxide cellulose paper core, glass cloth surfaces copper-clad laminates43、环氧玻璃布玻璃纤维复合覆铜箔板：epoxide non woven/woven glass reinforced copper-clad laminates44、聚酯玻璃布覆铜箔板：ployester woven glass fabric copper-clad laminates45、聚酰亚胺玻璃布覆铜箔板：polyimide woven glass fabric copper-clad laminates46、双马来酰亚胺三嗪环氧玻璃布覆铜箔板：bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates47、环氧合成纤维布覆铜箔板：epoxide synthetic fiber fabric copper-clad laminates48、聚四乙烯玻璃纤维覆铜箔板：teflon/fiber glass copper-clad laminates49、超薄型层压板：ultra thin laminate50、陶瓷基覆铜箔板：ceramics base copper-clad laminates51、紫外线阻挡型覆铜箔板：UV blocking copper-clad laminates作者：ilww 2004-11-10 16:19:00)三、基材的材料1、A阶树脂：A-stage resin2、B阶树脂：B-stage resin3、C阶树脂：C-stage resin4、环氧树脂：epoxy resin5、酚醛树脂：phenolic resin6、聚酯树脂：polyester resin7、聚酰亚胺树脂：polyimide resin8、双马来酰亚胺三嗪树脂：bismaleimide-triazine resin9、丙烯酸树脂：acrylic resin10、三聚氰胺甲醛树脂：melamine formaldehyde resin11、多官能环氧树脂：polyfunctional epoxy resin12、溴化环氧树脂：brominated epoxy resin13、环氧酚醛：epoxy novolac14、氟树脂：fluroresin15、硅树脂：silicone resin16、硅烷：silane17、聚合物：polymer18、无定形聚合物：amorphous polymer19、结晶现象：crystalline polamer20、双晶现象：dimorphism21、共聚物：copolymer22、合成树脂：synthetic23、热固性树脂：thermosetting resin24、热塑性树脂：thermoplastic resin25、感光性树脂：photosensitive resin26、环氧当量：weight per epoxy equivalent (WPE)27、环氧值：epoxy value28、双氰胺：dicyandiamide29、粘结剂：binder30、胶粘剂：adesive31、固化剂：curing agent32、阻燃剂：flame retardant33、遮光剂：opaquer34、增塑剂：plasticizers35、不饱和聚酯：unsatuiated polyester36、聚酯薄膜：polyester37、聚酰亚胺薄膜：polyimide film (PI)38、聚四氟乙烯：polytetrafluoetylene (PTFE)39、聚全氟乙烯丙烯薄膜：perfluorinated ethylene-propylene copolymer film (FEP)40、增强材料：reinforcing material41、玻璃纤维：glass fiber42、E玻璃纤维：E-glass fibre43、D玻璃纤维：D-glass fibre44、S玻璃纤维：S-glass fibre45、玻璃布：glass fabric46、非织布：non-woven fabric47、玻璃纤维垫：glass mats48、纱线：yarn49、单丝：filament50、绞股：strand51、纬纱：weft yarn52、经纱：warp yarn53、但尼尔：denier54、经向：warp-wise55、纬向：weft-wise, filling-wise56、织物经纬密度：thread count57、织物组织：weave structure58、平纹组织：plain structure59、坏布：grey fabric60、稀松织物：woven scrim61、弓纬：bow of weave62、断经：end missing63、缺纬：mis-picks64、纬斜：bias65、折痕：crease66、云织：waviness67、鱼眼：fish eye68、毛圈长：feather length69、厚薄段：mark70、裂缝：split71、捻度：twist of yarn72、浸润剂含量：size content73、浸润剂残留量：size residue74、处理剂含量：finish level75、浸润剂：size76、偶联剂：couplint agent77、处理织物：finished fabric78、聚酰胺纤维：polyarmide fiber79、聚酯纤维非织布：non-woven polyester fabric80、浸渍绝缘纵纸：impregnating insulation paper81、聚芳酰胺纤维纸：aromatic polyamide paper82、断裂长：breaking length83、吸水高度：height of capillary rise84、湿强度保留率：wet strength retention85、白度：whitenness86、陶瓷：ceramics87、导电箔：conductive foil88、铜箔：copper foil89、电解铜箔：electrodeposited copper foil (ED copper foil)90、压延铜箔：rolled copper foil91、退火铜箔：annealed copper foil92、压延退火铜箔：rolled annealed copper foil (RA copper foil)93、薄铜箔：thin copper foil94、涂胶铜箔：adhesive coated foil95、涂胶脂铜箔：resin coated copper foil (RCC)96、复合金属箔：composite metallic material97、载体箔：carrier foil98、殷瓦：invar99、箔（剖面）轮廓：foil profile100、光面：shiny side101、粗糙面：matte side102、处理面：treated side103、防锈处理：stain proofing104、双面处理铜箔：double treated foil作者：ilww 2004-11-10 16:20:00)四、设计1、原理图：shematic diagram2、逻辑图：logic diagram3、印制线路布设：printed wire layout4、布设总图：master drawing5、可制造性设计：design-for-manufacturability6、计算机辅助设计：computer-aided design.(CAD)7、计算机辅助制造：computer-aided manufacturing.(CAM)8、计算机集成制造：computer integrat manufacturing.(CIM)9、计算机辅助工程：computer-aided engineering.(CAE)10、计算机辅助测试：computer-aided test.(CAT)11、电子设计自动化：electric design automation .(EDA)12、工程设计自动化：engineering design automaton .(EDA2)13、组装设计自动化：assembly aided architectural design. (AAAD)14、计算机辅助制图：computer aided drawing15、计算机控制显示：computer controlled display .(CCD)16、布局：placement17、布线：routing18、布图设计：layout19、重布：rerouting20、模拟：simulation21、逻辑模拟：logic simulation22、电路模拟：circit simulation23、时序模拟：timing simulation24、模块化：modularization25、布线完成率：layout effeciency26、机器描述格式：machine descriptionm format .(MDF)27、机器描述格式数据库：MDF databse28、设计数据库：design database29、设计原点：design origin30、优化（设计）：optimization (design)31、供设计优化坐标轴：predominant axis32、表格原点：table origin33、镜像：mirroring34、驱动文件：drive file35、中间文件：intermediate file36、制造文件：manufacturing documentation37、队列支撑数据库：queue support database38、元件安置：component positioning39、图形显示：graphics dispaly40、比例因子：scaling factor41、扫描填充：scan filling42、矩形填充：rectangle filling43、填充域：region filling44、实体设计：physical design45、逻辑设计：logic design46、逻辑电路：logic circuit47、层次设计：hierarchical design48、自顶向下设计：top-down design49、自底向上设计：bottom-up design50、线网：net51、数字化：digitzing52、设计规则检查：design rule checking53、走（布）线器：router (CAD)54、网络表：net list55、计算机辅助电路分析：computer-aided circuit analysis56、子线网：subnet57、目标函数：objective function58、设计后处理：post design processing (PDP)59、交互式制图设计：interactive drawing design60、费用矩阵：cost metrix61、工程图：engineering drawing62、方块框图：block diagram63、迷宫：moze64、元件密度：component density65、巡回售货员问题：traveling salesman problem66、自由度：degrees freedom67、入度：out going degree68、出度：incoming degree69、曼哈顿距离：manhatton distance70、欧几里德距离：euclidean distance71、网络：network72、阵列：array73、段：segment74、逻辑：logic75、逻辑设计自动化：logic design automation76、分线：separated time77、分层：separated layer78、定顺序：definite sequenc作者：ilww 2004-11-10 16:21:00)五、形状与尺寸：1、导线（通道）：conduction (track)2、导线（体）宽度：conductor width3、导线距离：conductor spacing4、导线层：conductor layer5、导线宽度/间距：conductor line/space6、第一导线层：conductor layer No.17、圆形盘：round pad8、方形盘：square pad9、菱形盘：diamond pad10、长方形焊盘：oblong pad11、子弹形盘：bullet pad12、泪滴盘：teardrop pad13、雪人盘：snowman pad14、V形盘：V-shaped pad15、环形盘：annular pad16、非圆形盘：non-circular pad17、隔离盘：isolation pad18、非功能连接盘：monfunctional pad19、偏置连接盘：offset land20、腹（背）裸盘：back-bard land21、盘址：anchoring spaur22、连接盘图形：land pattern23、连接盘网格阵列：land grid array24、孔环：annular ring25、元件孔：component hole26、安装孔：mounting hole27、支撑孔：supported hole28、非支撑孔：unsupported hole29、导通孔：via30、镀通孔：plated through hole (PTH)31、余隙孔：access hole32、盲孔：blind via (hole)33、埋孔：buried via hole34、埋/盲孔：buried /blind via35、任意层内部导通孔：any layer inner via hole (ALIVH)36、全部钻孔：all drilled hole37、定位孔：toaling hole38、无连接盘孔：landless hole39、中间孔：interstitial hole40、无连接盘导通孔：landless via hole41、引导孔：pilot hole42、端接全隙孔：terminal clearomee hole43、准表面间镀覆孔：quasi-interfacing plated-through hole44、准尺寸孔：dimensioned hole45、在连接盘中导通孔：via-in-pad46、孔位：hole location47、孔密度：hole density48、孔图：hole pattern49、钻孔图：drill drawing50、装配图：assembly drawing51、印制板组装图：printed board assembly drawing52、参考基准：datum referan電路板朮語總整理*****A*****Abietic Acid松脂酸.Abrasion Resistance耐磨性.Abrasives磨料,刷材.ABS樹脂.Absorption吸收(入).Ac Impedance交流阻抗.Accelerated Test(Aging)加速老化(試驗). Acceleration速化反應.Accelerator 加速劑,速化劑.Acceptability,Acceptance 允收性,允收.Access Hole露出孔,穿露孔.Accuracy准確度.Acid Number (Acid Value)酸值.Acoustic Microscope (AM)感音成像顯微鏡. Acrylic壓克力(聚丙烯酸樹脂).Actinic Light (or Intensity, or Radiation)有效光. Activation活化.Activator活化劑.Active Carbon活性炭.Active Parts(Devices)主動零件.Acutance解像銳利度.Addition Agent添加劑.Additive Process加成法.Adhesion附著力.Adhesion Promotor附著力促進劑.Adhesive膠類或接著劑.Admittance導納(阻抗的倒數).Aerosol噴霧劑,氣熔膠,氣懸體.Aging老化.Air Inclusion氣泡夾雜.Air Knife風刀.Algorithm演算法.Aliphatic Solvent脂肪族溶劑.Aluminium Nitride(AlN)氮化鋁.Ambient Tamp環境溫度.Amorphous無定形,非晶形.Amp-Hour安培小時.Analog Circuit/Analog Signal類比電路/類比訊號. Anchoring Spurs著力爪.Angle of Contack接觸角.Angle of Attack攻角.Anion陰離子.Anisotropic異向性,單向的.Anneal 韌化(退火).Annular Ring孔環.Anode陽極.Anode Sludge陽極泥.Anodizing陽極化.ANSI美國標準協會.Anti-Foaming Agent消泡劑.Anti-pit Agent抗凹劑.AOI自動光學檢驗.Apertures開口,鋼版開口.AQL品質允收水準.AQL(Acceptable Quality Level)允收品質水準.Aramid Fiber聚醯胺纖維.Arc Resistance耐電弧性.Array排列.Artwork底片.ASIC特定用途勣體電路器.Aspect Ratio縱橫比.Assembly組裝裝配.A-stage A階段.ATE自動電測設備.Attenuation訊號衰減.Autoclave壓力鍋.Axial-lead軸心引腳.Azeotrope共沸混合液.*****B*****Back Light (Back Lighting)背光法.Back Taper反錐斜角.Backpanels, Backplanes支撐板.Back-up 墊板.Balanced Transmission Lines平衡式傳輸線.Ball Grid Array球腳陣列(封裝).Bandability彎曲性.Banking Agent護岸劑.Bare Chip Assembly裸體晶片組裝.Barrel孔壁,滾鍍.Base Material基材.Basic Grid基本方格.Batch批.Baume波美度(凡液體比重比水重則 Be=145-(145÷Sp.Gr) 凡液體比重比水輕則 Be=140÷(Sp.Gr-130)*Sp.Gr 為比重即同體勣物質對"純水"1g/cm的比值). Beam lead光芒式的平行密集引腳.Bed-of-Nail Testing針床測試.Bellows Conact彈片式接觸.Beta Ray Backscatter貝他射線反彈散射. Bevelling切斜邊.Bias斜張綱布,斜纖法.Bi-Level Stencil]雙階式鋼板.Binder粘結劑.Bits頭(Drill Bits).Black Oxide黑氧化層.Blanking沖空斷開.Bleack 漂洗.Bleeding溢流.Blind Via Hole肓通孔.Blister局部性分層或起泡.Block Diagram電路系統塊圖. Blockout封綱.Blotting干印.Blotting Paper吸水紙.Blow Hole吹孔.Blue Plaque藍紋(錫面鈍化層).Blur Edge (Circle)模糊邊帶(圈).Bomb Sight彈標.Bond Strength結合強度.Bondability結合性.Bonding Layer結合層接著層.Bonding Sheet(Layer)接合片.Bonding Wire結合線.Bow, Bowing板彎.Braid編線.Brazing硬焊(用含銀的銅鋅合金焊條). 在425℃~870℃下進行熔接的方式). Break Point顯像點.Break-away Panel可斷開板. Breakdown V oltage崩潰電壓.Break-out破出.Bridging搭橋.Bright Dip光澤浸漬處理.Brightener光澤劑.Brown Oxide棕氧化.Brush Plating刷鍍.B-stageB階段.Build Up Process增層法制程.Build-up堆積.Bulge鼓起.Bump 突塊.Bumping Process凸塊制程.Buoyancy浮力.Buried Via Hole埋導孔.Burn-in高溫加速老化試驗.Burning燒焦.Burr毛頭.Bus Bar匯電杆.Butter Coat 外表樹脂層.*****C*****C4 Chip JointC4晶片焊接.Cable電纜.CAD電腦輔助設計.Calendered Fabric軋平式綱布.Cap Lamination帽式壓合法.Capacitance電容.Capacitive Coupling電容耦合.Capillary Action毛細作用.Carbide碳化物.Carbon Arc Lamp碳弧燈.Carbon Treatment, Active活化炭處理.Card卡板.Card Cages/Card Racks電路板搆裝箱. Carlson Pin卡氏定位稍.Carrier載體.Cartridge濾心.Castallation堡型勣體電路器.Catalyzed Board, Catalyzed Substrate催化板材. Catalyzing催化.Cathode陰極.Cation陰向離子, 陽离子.Caul Plate隔板.Cavitation空泡化半真空.Center-to-Center Spacing中心間距. Ceramics陶瓷.Cermet陶金粉.Certificate証明書.CFC氟氫碳化物.Chamfer倒角.Characteristic Impedance特性阻抗.Chase綱框.Check List檢查清單.Chelate螯合.Chemical Milling化學研磨.Chemical Resistance抗化性.Chemisorption化學吸附.Chip晶片(粒).Chip Interconnection晶片互連.Chip on Board晶片粘著板.Chip On Glass晶玻接裝(COG).Chisel鑽針的尖部.Chlorinated Solvent含氯溶劑,氯化溶劑. Circumferential Separation環狀斷孔.Clad/Cladding披覆.Clean Room無塵室.Cleanliness清潔度.Clearance余地,余環.Clinched Lead Terminal緊箝式引腳.Clinched-wire Through Connection通孔彎線連接法. Clip Terminal繞線端接.Coat, Coating皮膜表層.Coaxial Cable同軸纜線.Coefficient of Thermal Expansion熱膨脹系數.Co-Firing共繞.Cold Flow冷流.Cold Solder Joint冷焊點.Collimated Light平行光.Colloid膠體.Columnar Structure柱狀組織.Comb Pattern梳型電路.Complex Ion錯離子.Component Hole零件孔.Component Orientation零件方向.Component Side組件面.Composites,(CEM-1,CEM-3)復合板材. Condensation Soldering凝熱焊接,液化放熱焊接. Conditioning整孔.Conductance導電.Conductive Salt導電鹽.Conductivity導電度.Conductor Spacing導體間距.Conformal Coating貼護層.Conformity吻合性, 服貼性.Connector連接器.Contact Angle接觸角.Contact Area接觸區.Contact Resistance接觸電阻.Continuity連通性.Contract Service協力廠,分包廠. Controlled Depth Drilling定深鑽孔. Conversion Coating 轉化皮膜. Coplanarity共面性.Copolymer共聚物.Copper Foil銅皮.Copper Mirror Test銅鏡試驗.Copper Paste銅膏.Copper-Invar-Copper (CIC)綜合夾心板. Core Material內層板材,核材.Corner Crack 通孔斷角.Corner Mark板角標記. Counterboring方型擴孔. Countersinking錐型擴孔.Coupling Agent 偶合劑.Coupon, Test Coupon板邊試樣. Coverlay/Covercoat表護層.Crack裂痕.Crazing白斑.Crease皺折.Creep潛變.Crossection Area截面積. Crosshatch Testing十字割痕試驗. Crosshatching十字交叉區. Crosslinking, Crosslinkage交聯,架橋. Crossover越交,搭交.Crosstalk雜訊, 串訊.Crystalline Melting Point晶體熔點.C-Stage C階段.Cure硬化,熟化.Current Density電流密度.Current-Carrying Capability載流能力. Curtain Coating濂塗法.*****D*****Daisy Chained Design菊瓣設計. Datum Reference基准參考. Daughter Board子板.Debris碎屑,殘材.Deburring去毛頭.Declination Angle斜射角.Definition邊緣逼真度.Degradation 劣化.Degrasing脫脂.Deionized Water去離子水.Delamination分離.Dendritic Growth 枝狀生長.Denier丹尼爾(是編織紡織所用各種紗類直徑單位,定義9000米紗束所具有的重量(以克米計)).Densitomer透光度計.Dent凹陷.Deposition 皮膜處理.Desiccator干燥器.Desmearing去膠渣.Desoldering解焊.Developer顯像液,顯像機.Developing顯像.Deviation偏差.Device電子元件.Dewetting縮錫.D-glassD玻璃.Diaze Film偶氮棕片.Dichromate重鉻酸鹽.Dicing晶片分割.Dicyandiamide(Dicy)雙氰胺.Die 沖模.Die Attach晶粒安裝.Die Bonding晶粒接著.Die Stamping沖壓.Dielectric 介質.Dielectric Breakdown V oltage介質崩潰電壓.Dielectric Constant介質常數.Dielectric Strength介質強度.Differential Scanning Calorimetry(DSC)微差掃瞄熱卡分析法. Diffusion Layer擴散層.Digitizing數位化.Dihedral Angle雙反斜角.Dimensional Stability尺度安定性.Diode二極體.Dip Coating浸塗法.Dip Soldering浸焊法.DIP(Dual Inline Package)雙排腳封裝體.Dipole偶極,雙極.Direct / Indirect Stencil直接/間接版膜.Direct Emulsion直接乳膠.Direct Plating直接電鍍.Discrete Compenent散裝零件.Discrete Wiring Board散線電路板,復線板.Dish Down碟型下陷.Dispersant分散劑.Dissipation Factor散失因素.Disspation Factor散逸因子.Disturbed Joint受擾焊點.Doctor Blade修平刀,刮平刀.Dog Ear狗耳.Doping摻雜.Double Layer雙電層.Double Treated Foil雙面處理銅箔.Drag In / Drag Out帶[進/帶出.Drag Soldering拖焊.Drawbridging吊橋效應.Drift漂移.Drill Facet鑽尖切削面.Drill Pointer鑽針重磨機.Drilled Blank已鑽孔的裸板.Dross浮渣.Drum Side銅箔光面.Dry Film干膜.Dual Wave Soldering 雙波焊接.Ductility展性.Dummy Land假焊墊.Dummy, Dummying假鍍(片).Durometer橡膠硬度計.DYCOstrate電漿蝕孔增層法.Dynamic Flex(FPC)動態軟板.*****E*****E-Beam (Electron Beam)電子束.Eddy Current渦電流.Edge Spacing板邊空地.Edge-Board Connector板邊(金手指)承接器.Edge-Board Contact板邊金手指.Edge-Dip Solderability Test板邊焊錫性測試. EDTA乙二胺四乙酸.Effluent排放物.E-glass電子級玻璃.Elastomer彈性體.Electric Strength(耐)電性強度. Electrodeposition電鍍.Electro-deposition Photoresist電著光阻, 電泳光阻. Electroforming電鑄.Electroless-Deposition無電鍍.Electrolytic Tough Pitch電解銅..Electrolytic-Cleaning電解清洗.Electro-migration電遷移.Electro-phoresis電泳動, 電滲.Electro-tinning鍍錫.Electro-Winning電解冶煉.Elongation 延伸性, 延伸率.Embossing凸出性壓花.EMF(Electromotive Force)電動勢.EMI(Electromagnetic Interference)電磁干擾. Emulsion乳化.Emulsion Side藥膜面.Encapsulating膠囊.Encroachment沾污,侵犯.End Tap封頭.Entek有機護銅處理.Entrapment夾雜物.Entry Material蓋板.Epoxy Resin環氧樹脂.Etch Factor蝕刻因子.Etchant蝕刻劑(液).Etchback回蝕.Etching Indicator蝕刻指標.Etching Resist蝕刻阻劑.Eutetic Composition共融組成.Exotherm放熱(曲線).Exposure曝光.Eyelet鉚眼.*****F*****Fabric綱布.Face Bonding反面朝下結合.Failure故障.Fan Out Wiring/Fan In Wiring扇出布線/扇入布線. Farad 法拉.Farady法拉第.Fatigue Strength抗疲勞強度.Fault缺陷.Fault Plane斷層面.Feed Through Hole導通孔.Feeder 進料器.Fiber Exposure玻纖顯露.Fiducial Mark基准記號.Filament纖絲.Fill緯向.Filler填充料.Fillet內圓填角.Film底片.Film Adhesive接著膜,粘合膜.Filter過濾器.Fine Line細線.Fine Pitch密腳距,密線距,密墊距. Fineness粒度, 純度.Finger手指.Finishing終修(飾).Finite Element Method有限要素分析法. First Article首產品.First Pass-Yield初檢良品率.Fixture夾具.Flair刃角變形.Flame Point自燃點.Flame Resistant耐燃性.Flammability Rate燃性等級.Flare扇形崩口.Flash Plating閃鍍.Flashover閃絡.Flat Cable扁平排線.Flat Pack扁平封裝(之零件).Flatness平坦度.Flexible Printed Circuit (FPC)軟板.Flexural Failure撓曲損壞.Flexural Module彎曲模數, 抗撓性模數. Flexural Strength抗撓強度.Flip Chip覆晶,扣晶.Flocculation絮凝.Flood Stroke Print覆墨沖程印刷.Flow Soldering (Wave Soldering)流焊. Fluorescence熒光.Flurocarbon Resin碳氟樹脂.Flush Conductor嵌入式線路 , 貼平式導體. Flush Point閃火點.Flute退屑槽.Flux助焊劑.Foil Burr銅箔毛邊.Foil Lamination銅箔壓板法.Foot殘足(干膜殘余物).Foot Print (Land Pattern)腳墊.Foreign Material 外來物,異物.Form-to-List布線說明清單.Four Point Twisting四點扭曲法.Free Radical自由基.Freeboard干舷.Frequency頻率.Frit 玻璃熔料.Fully-Additive Process全加成法.Fungus Resistance抗霉性.Fused Coating熔錫層.Fusing熔合.Fusing Fluid助熔液.*****G*****G-10由連續玻纖所織成的玻纖布與環氧樹脂粘結劑所復合成的材料.Gage, Gauge量規.Gallium Arsenide (GaAs)砷化鎵.Galvanic Corrosion賈凡尼式腐蝕(電解式腐蝕).Galvanic Series賈凡尼次序(電動次序).Galvanizing鍍鋅.GAP第一面分離,長刃斷開.Gate Array閘列,閘極陣列.Gel Time膠化時間.Gelation Particle膠凝點.Gerber Data ,Gerber File格博檔案(是美商Gerber公司專為PCB面線路圖形與孔位,所發展一系列完整的軟體檔案).Ghost Image陰影.Gilding鍍金(現為:Glod Plating).Glass Fiber玻纖.Glass Fiber Protrusion/Gouging, Groove玻纖突出/挖破.Glass Transition Temperature, Tg玻璃態轉化溫度.Glaze釉面,釉料.Glob Top圓頂封裝體.Glouble Test球狀測試法.Glycol (Ethylene Glycol)乙二醇.Golden Board測試用標準板.Grain Size結晶粒度.Grass Leak 大漏.Grid標准格.Ground Plane /Earth Plane接地層.Ground Plane Clearance接地空環.Guide Pin導針.Gull /Wing Lead鷗翼引腳.*****H*****Halation環暈.Half Angle半角.Halide鹵化物.Haloing白圈,白邊.Halon海龍,是CFC"氟碳化物"的一種商品名.Hard Anodizing硬陽極化.Hard Chrome Plating鍍硬鉻.Hard Soldering硬焊.Hardener (Curing Agent)硬化劑(或Curing Agent).Hardness硬度.Haring-Blum Cell海固槽.Harness電纜組合.Hay Wire跳線.Heat Cleaning燒潔.Heat Dissipation散熱.Heat Distortion Point (Temp)熱變形點(溫度).Heat Sealing熱封.Heat Sink Plane散熱層.Heat Transfer Paste導熱膏.Heatsink Tool散熱工具.Hertz(Hz)赫.High Efficiency Particulate Air Filter (HEPA)高效空氣塵粒過瀘機. Hipot Test 高壓電測.Hi-Rel高度靠度.Hit 擊(鑽孔時鑽針每一次"刺下"的動作).Holding Time停置時間.Hole Breakout孔位破出.Hole Counter數孔機.Hole Density孔數密度.Hole Preparation通孔准備.Hole Pull Strength孔壁強度.Hole V oid破洞.Hook 切削刀緣外凸.Hot Air Levelling噴錫.Hot Bar Soldering熱把焊接.Hot Gas Soldering熱風手焊.HTE(High Temperature Elongation)高溫延伸性.Hull Cell哈氏槽.Hybrid Integrated Circuit混成電路.Hydraulic Bulge Test液壓鼓起試驗.Hydrogen Embrittlement氫脆.Hydrogen Overvoltage氫過(超)電壓.Hydrolysis水解.Hydrophilic親水性.Hygroscopic吸溼性.Hypersorption超吸咐.*****I*****I.C. Socket勣體電路器插座.Icicle錫尖.Illuminance照度.Image Transfer影像轉移.Immersion Plating浸鍍.Impedance阻抗.Impedance Match阻抗匹配.Impregnate含浸.In-Circuit Testing組裝板電測.Inclusion異物,夾雜物.Indexing Hole基准孔.Inductance(L)電感.Infrared(IR)紅外線.Input/Output輸入/輸出.Insert, Insertion插接.Inspection Overlay套檢底片.Insulation Resistance絕緣電阻.Integrated Circuit(IC)勣體電路器.Inter Face介面.Interconnection互連.Intermetallic Compound (IMC)介面共化物.Internal Stress內應力.Interposer互邊導電物.Interstitial Via-Hole(IVH)局部層間導通孔.Invar殷鋼(63.8%Fe,36%Ni,0.2%C).Ion Cleanliness離子清潔度.Ion Exchange Resins離子交換樹脂.Ion Migration離子遷移.Ionizable (Ionic) Contaimination離子性污染.Ionization游離,電離.Ionization V oltage (Corona Level)電離化電壓(電纜內部狹縫空氣中,引起其電離所施加之最小電壓).IPC美國印刷電路板協會.Isolation隔離性,隔絕性.*****J*****JEDEC(Joint Electronic Device 聯合電子元件工程委員會.Engineering Council)J-LeadJ型接腳.Job Shop專業工廠.Joule焦耳.Jumper Wire跳線.Junction接(合)面,接頭.Just-In-Time(JIT)適時供應,及時出現.*****K*****Kapton聚亞醯胺軟板.Karat克拉 (1克拉(鑽石)=0.2g 純金則24k金為100%的鈍金.Kauri-Butanol Value考立丁醇值(簡稱K.B.值).Kerf.切形,裁剪.Kevlar聚醯胺纖維.Key電鍵Key Board鍵盤.Kiss Pressure吻壓, 低壓.Knoop Hardness努普硬度.Known Good Die(KGD)已知之良好晶片.Kovar科伐合金(Fe53%,Ni29%,Co17%).Kraft Paper牛皮紙.*****L*****Lamda Wave延伸平波.Laminar Flow平流.Laminar Structure片狀結搆.Laminate V oid板材空洞.Laminate(s)基板.Lamination V oid壓合空洞.Laminator壓膜機.Land孔環焊墊,表面焊墊.Landless Hole無環通孔.Laser Direct Imaging (LDI)雷射直接成像.Laser Maching雷射加工法.Laser Photogenerator(LPG), Laser Photoplotter雷射曝光機. Laser Soldering雷射焊接法.Lay Back 刃角磨損.Lay Out布線,布局.Lay Up 疊合.Layer to Layer Spacing層間距離Leaching焊散漂出,熔出.Lead 引腳.Lead Frame腳架.Lead Pitch腳距.Leakage Current漏電電流.Legend文字標記.Leveling整平.Lifted Land孔環(焊墊)浮起.Ligand錯離子附屬體.Light Emitting Diodes (LED)發光二極體.Light Integrator光能累積器.Light Intensity光強度.Limiting Current Density極限電流密度.Liquid Crystal Display (LCD)液晶顯示器.Liquid Dielectrics液態介質.Liquid Photoimagible Solder Mask, (LPSM)液態感光防焊綠漆. Local Area Network區域性網路.Logic 邏輯.Logic Circuit 邏輯電路.Loss Factor損失因素.Loss Tangent (TanδDK)損失正切.Lot Size批量.Luminance發光強度.Lyophilic親水性膠體.*****M*****Macro-Throwing Power巨觀分布力.Major Defect主要(嚴重)缺點.Major Weave Direction主要織向.Margin刃帶(鑽頭尖部).Marking標記.Mask阻劑.Mass Finishing大量整面(拋光).Mass Lamination大型壓板.Mass Transport質量輸送.Master Drawing主圖.Mat蓆(用于CEM-3(Composite Epoxy Material)的復合材料.)Matte Side毛面(電鍍銅皮(ED Foil)之粗糙面).Mealing泡點.Mean Time To Failure (MTTF)故障前可用之平均時數. Measling白點.Mechanical Stretcher機械式張網機.Mechanical Warp機械式纏繞.Mechanism機理.Membrane Switch薄膜開關.Meniscograph Test弧面狀沾錫試驗.Meniscus彎月面.Mercury Vaper Lamp汞氣燈.Mesh Count綱目數.Metal Halide Lamp 金屬鹵素燈.Metallization金屬化.Metallized Fabric金屬化綱布.Micelle微胞.Micro Wire Board微封線板.Micro-electronios微電子.Microetching微蝕.Microsectioning微切片法.Microstrip 微條.Microstrip Line微條線,微帶線.Microthrowing Power微分布力.Microwave微波.Migration遷移.Migration Rate遷移率.Mil英絲.Minimum Annular Ring孔環下限.Minimum Electrical Spacing電性間距下限.Minor Weave Direction次要織向.Misregistration 對不准度.Mixed Componmt Mounting Technology混合零件之組裝技術. Modem調變及解調器.Modification修改.Module模組.Modulus of Elasticity彈性系數.Moisture and Insulation Resistance Test溼氣與絕緣電阻試驗. Mold Release 脫模劑,離型劑.Mole摩爾.Monofilament單絲.Mother Board主機板,母板.Moulded Circuit模造立體電路機.Mounting Hole安裝孔.Mounting Hole組裝孔,機裝孔.Mouse Bite鼠齒(蝕刻后線路邊緣出現不規則缺口).Multi-Chip-Module(MCM)多晶片芯片模組.Multiwiring Board (or Discrete Wiring Board)復線板.*****N*****N.C.數值控制.Nail Head釘頭.Near IR近紅外線.Negative負片,鑽尖的第一面外緣變窄.Negative Etch-back反回蝕.Negative Stencil負性感光膜.Negative-Acting Resist負性作用之阻劑.Network綱狀元件.Newton牛頓.Newton Ring 牛頓環.Newtonian Liquid牛頓流體.Nick缺口.N-Methyl Pyrrolidine (NMP)N-甲基四氫嗶咯.Noble Metal Paste貴金屬印膏.Node節點.Nodule節瘤.Nomencleature標示文字符號.Nominal Cured Thickness標示厚度.Non-Circular Land非圓形孔環焊墊.Non-flammable非燃性.Non-wetting不沾錫.Normal Concentration (Strength)標準濃度,當量濃度. Normal Distribution常態分布.Novolac酯醛樹脂.Nucleation , Nucleating核化.Numerical Control數值控制.Nylon尼龍.*****O*****Occlusion吸藏.Off-Contact架空.Offset第一面大小不均.OFHC(Oxyen Free High Conductivity)無氧高導電銅. Ohm歐姆.Oilcanning蓋板彈動.OLB(Outer Lead Bond)外引腳結合.Oligomer寡聚物.Omega Meter離子污染檢測儀.Omega Wave振盪波.On-Contact Printing密貼式印刷.Opaquer不透明劑,遮光劑.Open Circuits斷線.Optical Comparater光學對比器(光學放大器.) Optical Density光密度.Optical Inspection光學檢驗.Optical Instrument光學儀器.Organic Solderability Preservatives (OSP)有機保焊劑. Osmosis滲透.Outgassing出氣,吹氣.Outgrowth懸出,橫出,側出.Output產出,輸出.Overflow溢流.Overhang總懸空.Overlap 鑽尖點分離.Overpotantial(Over voltage)過電位,過電壓. Oxidation氧化.Oxygen Inhibitor氧化抑制劑.Ozone Depletion臭氧層耗損.*****P*****Packaging封裝,搆裝.Pad焊墊,圓墊.Pad Master圓墊底片.。
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PCB专业术语（英语）PCB printed circuit board 印刷电路板，指空的线路板PCBA printed circuit board assembly 印刷电路板组件，指完成元件焊接的线路板组件PWA Printed Wire Assembly，Aperture list Editor：光圈表编辑器。
Aperture list windows：光圈表窗口。
Annular ring：焊环。
Array：拼版或陈列。
Acid trip：蚀刻死角。
Assemby：安装。
Bare Bxnel：光板，未进行插件工序的PCB板。
Bad Badsize：工作台，工作台有效尺寸。
Blind Buried via：盲孔，埋孔。
Chamfer：倒角。
Circuit：线路。
Circuit layer：线路层。
Clamshell tester：双面测试机。
Coordinates Area：坐标区域。
Copy-protect key：软件狗。
Coutour：轮廓。
Draw：一种圆形的光圈，但只是用于创建线路，不用于创建焊盘。
Drill Rack：铅头表。
Drill Rack Editor：铅头表编辑器。
Drill Rack window：铅头表窗口。
D Code：Gerber格式中用不着于表达光圈的代码。
Double-sided Biard：双面板。
End of Block character（EOB）：块结束符。
Extract Netlist：提取网络。
Firdacial：对位标记。
Flash：焊盘，来源于早期矢量光绘机，在矢量光绘机中，焊盘是光通过光圈“闪出”（Flash）而形成的。
Gerber Data：从PCB CAD系统到PCB生产过程中最常用的数据格式。
Grid ：栅格。
Graphical Editor：图形编辑器。
Incremental Data：增量数据。
Land：接地层。
Layer list window：层列表窗口。
Layer setup Area：层设置窗口。
Multilayer Board：多层板。
Nets：网络。
Net End：网络端点。
Net List：网络表。
Pad：焊盘。
Pad shaving：焊盘缩小。
Parts ：元件。
Plated Through Hole：电镀通孔。
Photoplotter：光绘机。
Polarity：属性。
Print Circuit Board（PCB）：印制线路板。
Programmable Dvice Fromat（PDF）：可编辑设备格式。
Probe Tester：针式测试机。
Query：询问。
Query window：询问窗口。
Resist：保护层。
Rotation：旋转。
RS-274-X：扩展Gerber.Single-sided-Board：单面板。
Solder mask：阻焊。
Solder Paste：助焊层。
Surface Maount Technology(SMT)：表面贴装技术。
Thermal pad：散热焊盘。
Test point：测试点。
Teardrop：泪滴。
Trace：线路。
User X.Y：用户坐标。
conduction (track) 导线（通道）conductor width导线（体）宽度conductor spacing导线距离conductor layer导线层conductor line space导线宽度间距conductor layer No.1第一导线层round pad圆形盘square pad方形盘diamond pad菱形盘oblong pad长方形焊盘bullet pad子弹形盘teardrop pad泪滴盘snowman pad雪人盘V-shaped pad V形盘annular pad环形盘non-circular pad非圆形盘isolation pad隔离盘monfunctional pad非功能连接盘offset land偏置连接盘back-bard land腹（背）裸盘anchoring spaur盘址land pattern连接盘图形land grid array连接盘网格阵列annular ring孔环component hole元件孔mounting hole安装孔supported hole支撑孔unsupported hole非支撑孔via hole导通孔plated through hole (PTH) 镀通孔access hole余隙孔blind via (hole) 盲孔buried via hole埋孔buried /blind via埋/盲孔any layer inner via hole (ALIVH) 任意层内部导通孔all drilled hole全部钻孔toaling hole定位孔landless hole无连接盘孔interstitial hole中间孔landless via hole无连接盘导通孔pilot hole引导孔terminal clearomee hole端接全隙孔quasi-interfacing plated-through hole准表面间镀覆孔dimensioned hole准尺寸孔via-in-pad在连接盘中导通孔hole location孔位hole density孔密度hole pattern孔图drill drawing钻孔图assembly drawing装配图printed board assembly drawing印制板组装图datum referan参考基准开孔面积百分率 open mesh area percentage 丝网所有网孔的面积与相应的丝网总面积之比，用百分数表示。
模版开孔面积 open stencil area 丝网印刷模版上所有图像区域面积的总和。
网框外尺寸 outer frame dimension 在网框水平位置上，测得包括网框上所有部件在内的长与宽的乘积。
印刷头 printing head 印刷机上通过靠着印版动作、为焊膏或胶水转移提供必要压力的部件。
印刷面 printing side(lower side) 丝网印版的底面，即焊膏或胶水与PCB板相接触的一面。
丝网 screen mesh 一种带有排列规则、大小相同的开孔的丝网印刷模版的载体。
丝网印刷 screen printing 使用印刷区域呈筛网状开孔印版的漏印方式。
印刷网框 screen printing frame 固定并支撑丝网印刷模版载体的框架装置。
离网 snap-off 印刷过程中，丝网印版与附着于PCB板上的焊膏或胶水的脱离。
刮刀 squeegee 在丝网印刷中，迫使丝网印版紧靠PCB板，并使焊膏或胶水透过丝网印版的开孔转移到PCB板上，同时刮除印版上多余焊膏或胶水的装置。
刮刀角度 squeegee angle 刮刀的切线方向与PCB板水平面或与压印辊接触点的切线之间的夹角，在刮刀定位后非受力或非运动的状态下测得。
刮刀 squeegee blade 刮刀的刀状部分，直接作用于印版上的印刷焊膏或胶水，使焊膏或胶水附着在PCB板上。
刮区 squeegeeing area 刮刀在印版上刮墨运行的区域。
刮刀相对压力 squeegee pressure, relative 刮刀在某一段行程内作用于印版上的线性压力除以这段行程的长度。
丝网厚度 thickness of mesh 丝网模版载体上下两面之间的距离。
Absolute Data：绝对数据，PCB数据的位置参数都是以系统的零点为基准进行测量的。
Absolute X、Y：绝对坐标，在绝对坐标系下当前光标的坐标位置。
Aperture：光圈，该名称来自于早期的矢量光绘机，在矢量光绘机中，图形是光通过“光圈盘”上不同形状和尺寸的“光圈”孔在感光材料（菲林）上曝光而形成的。
Aperture list：光圈表。
SMT名词解释AAccuracy(精度)：测量结果与目标值之间的差额。
Additive Process(加成工艺)：一种制造PCB导电布线的方法，通过选择性的在板层上沉淀导电材料(铜、锡等Adhesion(附着力)：类似于分子之间的吸引力。
Aerosol(气溶剂)：小到足以空气传播的液态或气体粒子。
Angle of attack(迎角)：丝印刮板面与丝印平面之间的夹角。
Anisotropic adhesive(各异向性胶)：一种导电性物质，其粒子只在Z轴方向通过电流。
Annular ring(环状圈)：钻孔周围的导电材料。
Application specific integrated circuit (ASIC特殊应用集成电路)：客户定做得用于专门用途的电路。
Array(列阵)：一组元素，比如：锡球点，按行列排列。
Artwork(布线图)：PCB的导电布线图，用来产生照片原版，可以任何比例制作，但一般为3:1或4:1。
Automated test equipment (ATE自动测试设备)：为了评估性能等级，设计用于自动分析功能或静态参数的设备，也用于故障离析。
Automatic optical inspection (AOI自动光学检查)：在自动系统上，用相机来检查模型或物体。
BBridge(锡桥)：把两个应该导电连接的导体连接起来的焊锡，引起短路。
Buried via(埋入的通路孔)：PCB的两个或多个内层之间的导电连接(即，从外层看不见的)。
CCAD/CAM system(计算机辅助设计与制造系统)：计算机辅助设计是使用专门的软件工具来设计印刷电路结构；计算机辅助制造把这种设计转换成实际的产品。
这些系统包括用于数据处理和储存的大规模内存、用于设计创作的输入和把储存的信息转换成图形和报告的输出设备Capillary action(毛细管作用)：使熔化的焊锡，逆着重力，在相隔很近的固体表面流动的一种自然现象。
Chip on board (COB板面芯片)：一种混合技术，它使用了面朝上胶着的芯片元件，传统上通过飞线专门地连接于电路板基底层。
Circuit tester(电路测试机)：一种在批量生产时测试PCB的方法。
包括：针床、元件引脚脚印、导向探针、内部迹线、装载板、空板、和元件测试。
Cladding(覆盖层)：一个金属箔的薄层粘合在板层上形成PCB导电布线。
Coefficient of the thermal expansion(温度膨胀系数)：当材料的表面温度增加时，测量到的每度温度材料膨胀百万分率(ppm)Cold cleaning(冷清洗)：一种有机溶解过程，液体接触完成焊接后的残渣清除。
Cold solder joint(冷焊锡点)：一种反映湿润作用不够的焊接点，其特征是，由于加热不足或清洗不当，外表灰色、多孔。