XLIN_MC6450 Preliminary Datasheet (APS-048-0017v1.2)

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MC3413 Preliminary Datasheet (APS-048-0029v1.5)

MC3413 Preliminary Datasheet (APS-048-0029v1.5)

GENERAL DESCRIPTIONThe MC3413 is a low-noise, integrated digital output 3-axis accelerometer with a feature set optimized for cell phones and consumer product motion sensing. Applications include user interface control, gaming motion input, electronic compass tilt compensation for cell phones, game controllers, remote controls and portable media products.Low noise and low power are inherent in the monolithic fabrication approach, where the MEMS accelerometer is integrated in a single-chip with the electronics integrated circuit.In the MC3413 the internal sample rate can be set from 0.25 to 256 samples / second. Specific tap or sample acquisition conditions can trigger an interrupt to a remote MCU. Alternatively, the device supports the reading of sample and event status via polling. FEATURESRange, Sampling & Power∙±2,4,8,12 or 16g ranges∙8, 10 or 14-bit resolution∙0.25 - 256 samples/sec∙50 - 130 μA typical currentEvent Detection∙Low-noise architecture minimizes false triggering∙Independent X,Y,Z TapSimple System Integration∙I2C interface, up to 400 kHz∙ 2 × 2 × 0.92 mm 12-pin package ‒Pin-compatible to Bosch BMA2xx ∙Single-chip 3D silicon MEMS∙<200µg / √Hz noiseTABLE OF CONTENTS1Order Information (4)1Functional Block Diagram (5)2Packaging and Pin Description (6)2.1Package Outline (6)2.2Package Orientation (7)2.3Pin Description (8)2.4Typical Application Circuit (9)2.5Tape and Reel (10)3Specifications (12)3.1Absolute Maximum Ratings (12)3.2Sensor Characteristics (13)3.3Electrical and Timing Characteristics (14)3.3.1Electrical Power and Internal Characteristics (14)3.3.2I2C Electrical Characteristics (15)3.3.3I2C Timing Characteristics (16)4General Operation (17)4.1Sensor Sampling (17)4.2Offset and Gain Calibration (17)4.3Tap Detection (17)5Operational States (18)6Operational State Flow (19)7Interrupts (20)7.1Enabling and Clearing Interrupts (20)7.2ACQ_INT Interrupt (20)8Sampling (21)8.1Continuous Sampling (21)9I2C Interface (22)9.1Physical Interface (22)9.2Timing (24)9.3I2C Message Format (24)9.4Watchdog Timer (25)10Register Interface (26)10.1Register Summary (27)10.2SR Status Register (29)10.3OPSTAT Device Status Register (30)10.4INTEN Interrupt Enable Register (31)10.5MODE Register (32)10.6SRTFR Sample Rate and Tap Feature Register (33)10.7TAPEN Tap Control Register (34)10.8TTTRX,TTTRY, TTTRZ X, Y and Z Tap Duration and Threshold Registers (35)10.9XOUT_EX, YOUT_EX & ZOUT_EX X, Y, Z-Axis Acceleration Registers (36)10.10OUTCFG Output Configuration Register (37)10.11X-Axis Offset Registers (38)10.12Y-Axis Offset Registers (39)10.13Z-Axis Offset Registers (40)10.14X-Axis Gain Registers (41)10.15Y-Axis Gain Registers (42)10.16Z-Axis Gain Registers (43)10.17PCODE Product Code (44)11Index of Tables (45)12Revision History (46)13Legal (47)2.5 TAPE AND REELDevices are shipped in reels, in standard cardboard box packaging. See Figure 6. MC3413 Tape Dimensions and Figure 7. MC3413 Reel Dimensions.∙Dimensions in mm.∙10 sprocket hole pitch cumulative tolerance ±0.2∙Pocket position relative to sprocket hole measured as true position of pocket, not pocket hole.Figure 6. MC3413 Tape DimensionsFigure 7. MC3413 Reel DimensionsFigure 8. I2C Interface Timing10 REGISTER INTERFACEThe device has a simple register interface which allows a MCU or I2C master to configure and monitor all aspects of the device. This section lists an overview of user programmable registers. By convention, Bit 0 is the least significant bit (LSB) of a byte register.11 INDEX OF TABLESTable 1. Order Information (4)Table 2. Pin Description (8)Table 3. Absolute Maximum Ratings (12)Table 4. Sensor Characteristics (13)Table 5. Electrical Characteristics (14)Table 6. I2C Electrical and Timing Characteristics (15)Table 7. I2C Timing Characteristics (16)Table 8. Operational States (18)Table 9. Forcing Operational States (19)Table 10. I2C Address Selection (22)Table 11. Register Summary (28)Table 12. SR Status Register (29)Table 13. OPSTAT Device Status Register (30)Table 14. INTEN Interrupt Enable Register Settings (31)Table 15. MODE Register Functionality (32)Table 16. SRTFR Register Functionality (33)Table 17. TAPEN Register Settings (34)Table 18. TTTRX, TTTRY and TTTRZ Register Settings (35)Table 19. Extended Accelerometer Registers (36)Table 20. OUTCFG Resolution and Range Select Register Settings (37)13 LEGAL1. M-CUBE reserves the right to make corrections, modifications, enhancements, improvements and other changes to its products and to this document at any time and discontinue any product without notice. The information contained in this document has been carefully checked and is believed to be accurate. However, M-CUBE shall assume no responsibilities for inaccuracies and make no commitment to update or to keep current the information contained in this document.2. M-CUBE products are designed only for commercial and normal industrial applications and are not suitable for other purposes, such as: medical life support equipment; nuclear facilities; critical care equipment; military / aerospace; automotive; security or any other applications, the failure of which could lead to death, personal injury or environmental or property damage. Use of the produ cts in unsuitable applications are at the customer’s own risk and expense.3. M-CUBE shall assume no liability for incidental, consequential or special damages or injury that may result from misapplication or improper use of operation of the product.4. No license, express or implied, by estoppel or otherwise, to any intellectual property rights of M-CUBE or any third party is granted under this document.5. M-CUBE makes no warranty or representation of non-infringement of intellectual property rights of any third party with respect to the products. M-CUBE specifically excludes any liability to the customers or any third party regarding infringement of any intellectual property rights, including the patent, copyright, trademark or trade secret rights of any third party, relating to any combination, machine, or process in which the M-CUBE products are used.6. Examples of use described herein are provided solely to guide use of M-CUBE products and merely indicate targeted characteristics, performance and applications of products. M-CUBE shall assume no responsibility for any intellectual property claims or other problems that may result from applications based on the examples described herein7. Information described in this document including parameters, application circuits and its constants and calculation formulas, programs and control procedures are provided for the purpose of explaining typical operation and usage. “Typical” parameters that may be provided in M-CUBE data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters including “Typicals,” must be validated for each customer application by customer’s technical experts. In no event shall the information described be regarded as a guarantee of conditions or characteristics of the products. Therefore, the customer should evaluate the design sufficiently as whole system under the consideration of various external or environmental conditions and determine their applicatio n at the customer’s own risk. M-CUBE shall assume no responsibility or liability for claims, damages, costs and expenses caused by the customer or any third party, owing to the use of the above information.is a trademark of M-CUBE, Inc.M-CUBE and the M-CUBE logo are trademarks of M-CUBE, Inc.,All other product or service names are the property of their respective owners.© M-CUBE, Inc. 2014. All rights reserved.。

XL8001降压型LED恒流驱动器芯片(高电压官方中文版)

XL8001降压型LED恒流驱动器芯片(高电压官方中文版)
Ordering Information
Order Information XL8001E1 Marking ID XL8001E1 Package Type SOP-8L
Preliminary Datasheet
XL8001
Packing Type Supplied As 2500 Units on Tape & Reel
Note1: Stresses greater than those listed under Maximum Ratings may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
XLSEMI Pb-free products, as designated with “E1” suffix in the par number, are RoHS compliant.
Absolute Maximum Ratings(Note1)
Parameter Input Voltage Power Dissipation Thermal Resistance (SOP-8L) (Junction to Ambient, No Heatsink, Free Air) Operating Junction Temperature Storage Temperature Lead Temperature (Soldering, 10 sec) ESD (HBM) Symbol Vin PD RJA TJ TSTG TLEAD Value -0.3 to 90 Internally limited 100 -40 to 125 -65 to 150 260 >3000 Unit V mW ºC/W ºC ºC ºC V

Belimo F6450-150SHP 热水 冷水 蒸汽阀说明书

Belimo F6450-150SHP 热水 冷水 蒸汽阀说明书

F6450-150SHP•Butterfly Valve with Lug typesReinforced Teflon Seat, 316 Stainless SteelType overviewTypeDN F6450-150SHP450Technical dataFunctional dataValve size [mm]18" [450]Fluidchilled or hot water, up to 60% glycol, steam Fluid Temp Range (water)-22...400°F [-30...204°C]Body Pressure Rating ANSI Class 150Flow characteristic modified equal percentage, unidirectional Servicing maintenance-free Flow Pattern 2-way Leakage rate0%Controllable flow range quarter turn, mechanically limited Cv11400 Maximum Inlet Pressure (Steam)50 psi Maximum Velocity 32 FPS Lug threads1 1/8-8 UNCMaterialsValve body Carbon steel full lug (ASME B16.34)Stem 17-4 PH stainless steel SeatRPTFEPipe connection ASME/ANSI class 150 flange Bearing glass backed PTFE Disc316 stainless steel Gear operator materialsGears - hardened steel Suitable actuatorsNon-SpringSY7SY8Safety notesWARNING: This product can expose you to lead which is known to the State of California to cause cancer and reproductive harm. For more information go to F6450-150SHP Product featuresFlow/Mounting detailsDimensionsType DN WeightF6450-150SHP450370 lb [170 kg]A B C D E F Number of Bolt Holes12.6" [320] 4.5" [114]47.7" [1212]33.3" [846]12.5" [317]12.5" [317]16SY7-110On/Off, Floating point, Non fail-safe, 120 VTechnical dataElectrical data Nominal voltage AC 120 VNominal voltage frequency50/60 HzNominal voltage range AC 96...132 VTransformer sizing504 VACurrent consumption 4.2 AAuxiliary switch2x SPDT, 1 mA...5 A (3 A inductive), DC 5 V...AC250 V, 1 x 3° / 1 x 87°Switching capacity auxiliary switch 1 mA...5 A (3 A inductive), DC 5 V...AC 250 VElectrical Connection Terminal blocksOverload Protection thermally protected 135°C cut-outInternal Humidty Control resistive heating elementFunctional data Torque motor1000 NmDirection of motion motor selectable with switch 0/1Manual override hand wheelAngle of rotation90°Running Time (Motor)50 sDuty cycle value30%Noise level, motor45 dB(A)Position indication top mounted domed indicatorSafety data Degree of protection IEC/EN IP66/67Degree of protection NEMA/UL NEMA 4XEnclosure UL Enclosure Type 4XAgency Listing ISO, CE, cCSAusQuality Standard ISO 9001Ambient humidity Max. 100% RHAmbient temperature-22...149°F [-30...65°C]Storage temperature-40...176°F [-40...80°C]Servicing maintenance-freeWeight Weight46 lb [21 kg]Materials Housing material die cast aluminiumGear train high alloy steel gear sets, self lockingSY7-110ApplicationProduct featuresSY Series actuators are fractional horsepower devices, and utilize full-wave power supplies. Observe wire sizing and transformer sizing requirements. Proportional models CANNOT be connected to Belimo direct coupled (AF, AM, GM…etc) actuator power supplies or any type of half-wave device. You MUST use a separate, dedicated transformer or power supply to power the SY actuator. Please do not connect other automation equipment to the dedicated SY supply source. You MUST use four wires (plus a ground) to control a proportional control SY actuator (See SY Wiring Section).AccessoriesElectrical accessoriesDescriptionTypeLocal electric disconnect for SY4...12 series actuator, AC 120 V, on/off HOA-120VBattery backup system for SY7...12 series actuator, AC 120 V, on/offEXT-NSV-B05-120Electrical installationINSTALLATION NOTESDo not change sensitivity or dip switch setting with power applied.Power supply Common/Neutral and Control Signal "-"wiring to a common is prohibited.Terminals 4 and 6 need to be wired separately.Isolation relays must be used in parallel connection of multiple actuators using a commoncontrol signal inputs. The relays should be DPDT.Isolation relays are required in parallel applications. The reason parallel applications needisolation relays is that the motor uses two sets of windings, one for each direction. When one is energized to turn the actuator in a specific direction a voltage is generated in the other due to the magnetic field created from the first. It’s called back EMF. This is not an issue with one actuator because the voltage generated in the second winding isn’t connected to anything so there is no flow. On parallel applications without isolation, this EMF voltage energizes the winding it is connected to on the other actuators in the system, the actuators are tying to turn in both directions at once. The EMF voltage is always less than the supply voltage due to the resistance of the windings, so while the actuator still turns in the commanded direction, thedrag from the other reduces the torque output and causes overheating.Warning! Live electrical components!During installation, testing, servicing and troubleshooting of this product, it may be necessary to work with live electrical components. Have a qualified licensed electrician or other individual who has been properly trained in handling live electrical components perform these tasks. Failure to follow all electrical safety precautions when exposed to live electrical components could result in death or serious injury.SY7-110Wiring diagramsAC/DC 110/120 or 220/230VAC 110/120 or 220/230 VElectrical installation。

IC+最新85NM工艺的PHY IP101G_DS_R01_20121224

IC+最新85NM工艺的PHY IP101G_DS_R01_20121224

Single Port 10/100 MII/RMII/TP/FiberFast Ethernet Transceiver(85nm/Extreme Low PW, PWMT ® and EMIMT ®)Features General DescriptionIP1IP1IP1IP1z 10/100Mbps IEEE 802.3/802.3u compliant Fast Ethernet transceiverz Supports 100Base-TX/FX Media Interface z Supports MII/ RMII Interfacez Supports Auto MDI/MDIX function z Power Management Tool- APS, auto power saving while Link-off - 802.3az, protocol based power saving - WOL+, light traffic power saving - PWD, force-off power saving- Supports MII with LPI for RX and TX - Supports RMII with LPI for RXz Supports Base Line Wander compensation z Supports Interrupt functionz Built in synchronization FIFO to support jumbo frame size up to 12KB in MII mode (10KB in RMII 100Mbps mode)z Supports MDC and MDIO to communicate with the MACz EMI Management Tool - F/W based control- 4 levels for mapping the difference layoutlength on the PCBz Single 3.3V power supply z Built-in Vcore regulatorz DSP-based PHY Transceiver technology z System Debug Assistant Tool - 16 bit RX counter- 9 bit RXError/CRC counter - Isolate MII/RMII - RX to TX Loopback - Loopback MII/RMIIz Using either 25MHz crystal/oscillator or 50MHz oscillator REF_CLK as clock sourcez Built-in 49.9ohm resistors for simplifying BOMz Flexible LED display z Process: 85nmz Package and operation temperature 01G: dice, 0~70℃01GA: 48LQFP , 0~70℃ 01GR: 32QFN, 0~70℃ 01GRI: 32QFN, -40~85℃IP101G is an IEEE 802.3/802.3u compliant single-port Fast Ethernet Transceiver for both 100Mbps and 10Mbps operations. It supports Auto MDI/MDIX function to simplify the network installation and reduce the system maintenance cost. To improve the system performance, IP101G provides a hardware interrupt pin to indicate the link, speed and duplex status change. IP101G provides Media Independent Interface (MII) or Reduced Media Independent Interface (RMII) to connect with different types of 10/100Mbps Media Access Controller (MAC). IP101G is designed to use category 5 unshielded twisted-pair cable or Fiber-Optic cables connecting to other LAN devices. A PECL interface is supported to connect with an external 100Base-FX fiber optical transceiver. Except good performance, reliability, rich power saving method and extreme low operating current, IP101G provides a serial tool for system designers to complete their projects easily. They are System Debug Assistant Tool and EMI Management Tool.IP101G is fabricated with advanced CMOS (85nm) technology and design is based onIC Plus’s 5th Ethernet-PHY architecture, this feature makes IP101G consumes very low power. Such as in the full load operation (100Mbps_FDX), it only takes below 0.15W. IP101GA / IP101GR&IP101GRI are available in 48LQFP/32QFN, lead-free package.* EMIMT: Patent under apply.Application■ NAS■ Network Printers and Servers ■ IP Set-Top Box ■IP/Smart TV■ Game console■ IP and Video Phone ■ PoE■Telecom Fiber deviceTable Of ContentsTable Of Contents (2)List of Figures (4)List of Tables (5)Revision History (6)Features comparison between IP101G and IP101A/IP101AH (7)Transmit and Receive Data Path Block Diagram (8)1Pin diagram (9)2Dice pad information (11)3Pin description (12)3.1IP101GA pin description (12)3.2IP101GR/GRI pin description (16)4Register Descriptions (19)4.1Register Page mode Control Register (20)4.2MII Registers (20)4.3MMD Control Register (30)4.4MMD Data Register (31)4.5RX Counter Register (34)4.6LED Mode Control Register (35)4.7WOL+ Control Register (35)4.8UTP PHY Specific Control Register (38)4.9Digital IO Pin Control Register (39)5Function Description (41)5.1Major Functional Block Description (41)5.1.1Transmission Description (41)5.1.2MII and Management Control Interface (42)5.1.3RMII Interface (43)5.1.4Flexible Clock Source (45)5.1.5Auto-Negotiation and Related Information (45)5.1.6Auto-MDIX function (46)5.2PHY Address Configuration (46)5.3Power Management Tool (47)5.3.1Auto Power Saving Mode (47)5.3.2IEEE802.3az EEE (Energy Efficient Ethernet) (48)5.3.3Force power down (48)5.3.4WOL+ operation mode (48)5.4LED Mode Configuration (52)5.5LED Blink Timing (52)5.6Repeater Mode (52)5.7Interrupt (52)5.8Miscellaneous (52)5.9Serial Management Interface (53)5.10Fiber Mode Setting (54)5.11Jumbo Frame (54)6Layout Guideline (55)6.1General Layout Guideline (55)6.2Twisted Pair recommendation (55)7Electrical Characteristics (56)7.1Absolute Maximum Rating (56)7.2DC Characteristics (56)7.3Crystal Specifications (57)7.4AC Timing (58)7.4.1Reset, Pin Latched-in, Clock and Power Source (58)7.4.2MII Timing (59)7.4.3RMII Timing (60)7.4.4SMI Timing (61)7.5Thermal Data (61)8Order Information (62)9Physical Dimensions (63)9.148-PIN LQFP (63)9.232-PIN QFN (64)List of FiguresFigure 1 Flow chart of IP101G (8)Figure 2 IP101GA 48 Pin Diagram (9)Figure 3 IP101GR/GRI 32 Pin Diagram (10)Figure 4 IP101G dice pad information (11)Figure 5 LPI transition (43)Figure 6 IP101G/GA/GR/GRI MII Mode with LPI transition Block Diagram (43)Figure 7 IP101G/GA/GR/GRI MII Mode without LPI transition Block Diagram (43)Figure 8 IP101G RMII Mode with internal clock Block Diagram (44)Figure 9 IP101G RMII Mode with external clock Block Diagram (44)Figure 10 IP101G RMII Clock Application Circuit (45)Figure 11 IP101G link speed and EEE ability programming guide (46)Figure 12 PHY Address Configuration (47)Figure 13 Magic Packet Format (49)Figure 14 Sleep or wake up automatically programming guide (50)Figure 15 MAC control sleep or wake up programming guide (51)Figure 16 MDC/MDIO Format (53)Figure 17 IP101G Fiber Mode Setting (54)Figure 18 Reset, Pin Latched-In, Clock and Power Source Timing Requirements (58)Figure 19 MII Transmit Timing Requirements (59)Figure 20 MII Receive Timing Specifications (59)Figure 21 RMII Transmit Timing Requirements (60)Figure 22 RMII Receive Timing Specifications (60)Figure 23 SMI Timing Requirements (61)Figure 24 48-PIN LQFP Dimension (63)Figure 25 32-PIN QFN Dimension (64)List of TablesTable 1 Features comparison between IP101G and IP101A/IP101AH (7)Table 2 Register Map (19)Table 3 Flexible Clock Source Setting (45)Table 4 PHY Address Configuration (47)Table 5 WOL+ operation mode (49)Table 6 LED Mode 1 Function (52)Table 7 LED Mode 2 Function (52)Table 8 LED Blink Timing (52)Table 9 SMI Format (53)Table 10 DC Characteristics (56)Table 11 I/O Electrical Characteristics (56)Table 12 Pin Latched-in Configuration Resistor (57)Table 13 Crystal Specifications (57)Table 14 Reset, Pin Latched-in, Clock and Power Source Timing Requirements (58)Table 15 MII Transmit Timing Requirements (59)Table 16 MII Receive Timing Specifications (59)Table 17 RMII Transmit Timing Requirements (60)Table 18 RMII Receive Timing Specifications (60)Table 19 SMI Timing Requirements (61)Table 20 Thermal Data (61)Table 21 Part Number and Package (62)Revision HistoryRevision # Change DescriptionIP101G-DS-R01 Initial release.IP101G-DS-R01-20120522 1) Correct the typo of Digital IO Pin Control Register.2) Modify the operation voltage REGOUT and DVDD_REGIN of DCCharacteristics.IP101G-DS-R01-20120611 1) Correct the typo of Linear Regulator Output Control Register.2) Correct the typo of pin description for pin type PD and PU.3) Modify the register description for RMII_V12 and RMII_V10.4) Correct the typo of register default values.5) Modify the operation voltage DVDD33_IO of DC Characteristics.IP101G-DS-R01-20120622 Add 30 seconds into the definition for register WOL_PLUS_TIMER_SEL.IP101G-DS-R01-20120629 Add the symbol SC (Self Clear) for PHY MII register 0.15 Reset and 0.9Restart Auto-Negotiation.IP101G-DS-R01-20120709 1) Add LED mode 2 in the pin description and function description.2) Correct the table of LED Blink Timing.3) Add more description of PHY Address Configuration and IEEE 802.3az.4) Add ESD reliability of Absolute Maximum Rating.5) Correct the typo of function description for Auto Power Saving Mode.6) Change register P16R16[10] description from HEART_BEAT_EN toReserved.IP101G-DS-R01-20120719 Correct the table of Register Map for page selection.IP101G-DS-R01-20120726 1) Add more description of Register RX2TX_LPBK P1R23[13] for Rx to Txloopback test.2) Add more description on Fiber Mode Setting and latched-in pin signalson AC Timing.3) Add IP101AH into the table of features comparison.IP101G-DS-R01-20120808 1) Correct the I/O type of IP101GA pin description to O(Ouput) for pin24RXER.2) Change the pin name from DVDD33_IO to VDDIO.IP101G-DS-R01-20120821 1) Change the default value of register P16R27 from 0x0022 to 0x0012.2) Remove I/O Slew Rate Control Register.3) Change the register location RMII_WITH_ER from P16R29[0] toP16R29[7].IP101G-DS-R01-20120927 1) Add more description of low power idle (LPI) state in MII and RMIImodes.2) Correct the typo of Physical Dimensions.IP101G-DS-R01-20121101 Change the LED blink timing from “On 80ms -> Off (20~40)ms” to “On 26ms-> Off 78ms”.IP101G-DS-R01-20121113 Add more function description to support Jumbo Frame.IP101G-DS-R01-20121127 Change the LED mode function as same as IP101A.IP101G-DS-R01-20121224 Add the notice that does not let these PHY address pins floating for thelatched-in settings after the power is ready.DisclaimerThis document probably contains the inaccurate data or typographic error. In order to keep this document correct, IC Plus reserves the right to change or improve the content of this document.Features comparison between IP101G and IP101A/IP101AHTable 1 Features comparison between IP101G and IP101A/IP101AHProduct Name IP101GR IP101G IP101GA IP101A IP101AH Package Type 32pin QFN Dice 48pin LQFP48pin LQFPREGOUT(1) Output Voltage and location 1.0V, pin28 1.0V, pad5and pad111.0V, pin82.5V, pin32REGIN Input Voltage and location NA(2) 1.0V, pad23and pad26NA 2.5V, pin8RMII mode setting Pin4 Pad18 Pin1 Pin1 and pin44Fiber mode setting: Fiber FXSD signal: Pin19Pin1Pad39Pad13Pin22Pin43NA Pin24 and pin48Pin37Number of LED 2 4 4 5LED mode 1 and 2 1 and 2LED Blink Timing On 26ms -> Off 78ms On 26ms -> Off 78msPHY address number(3) Single: 0 ~ 1Multi: 2 ~ 31Single: 0 ~ 7Multi: 8 ~ 31Single: 0 ~ 31Center-tap of transformer Do not connect to any power 2.5V input power Built-in 49.9ohm resistors Yes No Power consumption ~150mW ~480mW Process 85nm 0.25μm IEEE 802.3az Yes No10Base TX amplitude ~1.75V (10Base-Te) ~2.5V (10Base-T) WOL+ (Wake On LAN Plus) Yes NoAnalog OFF Yes No16 bit RX counter Yes No9 bit RXER/CRC counter Yes NoRX to TX Loopback Yes No Loopback MII/RMII Yes YesSNI mode No Yes Note 1: Regulator voltage output is for internal use only. Do not supply to any other device.Note 2: Not available for this function. The 1.0V is supplied by the regulator that built-in the chip.Note 3: Do not let these PHY address pins floating for the latched-in settings after the power is ready.Transmit and Receive Data Path Block DiagramFigure 1 Flow chart of IP101G1Pin diagramRXER CRS/LEDMODRXDV/CRS_DV/FX_HEN X1X2RXD2RXD3RXCLK/50M_CLKO DGNDRXD0NCRESET_N IP101GA (LQFP-48)242322212019181716NC NC TXER/FXSDNC Note:Those pins in "blue "are different from IP101A.NC RXD1INTRNC DGNDNC LED3/PHY_AD3VDDIOFigure 2 IP101GA 48 Pin DiagramIP101GR/GRI(VQFN-32)(GND on bottom of chip)RXD3TXCLK/50M_CLKI RXCLK/50M_CLKO LED0/PHY_AD0LED3/PHY_AD3161514131211109RESET_NISET REGOUT MDI_TN MDI_TP MDI_RP MDI_RN RXD2AVDD33Figure 3 IP101GR/GRI 32 Pin Diagram2Dice pad informationIC LogoPad 1Pad 44Pad 11Pad 45Pad 24Pad 31Pad 12Pad 22Pad 23REGINPHYAD_LED028PHYAD_LED129VSS30PHYAD_LED231PHYAD_LED332VDDIO 33RX_CLK REGOUT 34VSSIO RESET_N 35RXD[3]TXER_FXSD 36RXD[2]VSSIO 37RXD[1]15X138RXD[0]16X239RXDV_FIBMOD 17INTR40CRS18COL_RMII 41RXER_INTR 19TX_EN 4220TXD[3]21TXD[2]22TXD[1]23REGINFigure 4 IP101G dice pad information3 Pin descriptionType Description Type DescriptionLI Latched Input in power up or reset PD Internal Pull-Down 250KΩI/O Bi-directional input and output PU Internal Pull-Up 250KΩI Input Hi-Z High impedanceO Output P PowerOD Open Drain3.1 IP101GA pin descriptionIP101GAPin no. Label Type ResetStateDescriptionSerial Management Interface Pins25 MDC I Hi-Z Management Data Interface Clock: This pin provides aclock reference to MDIO. The clock rate can be up to2.5MHz.26 MDIO I/O(PU)I(PU)Management Data interface Input/Output:Thefunction of this pin is to transfer management informationbetween PHY and MAC.MII/RMII Pins2 TXEN I(PD)I(PD)Transmit Enable or Signal Detect.43 TXER/FXSD I(PD)I(PD)Transmit Error or FXSD:This is a dual-function pin which is determined by themedia type selection. If RXDV/CRS_DV/FX_HEN islatched as “0 (default)” upon reset, the TP interface isselected and its function as TXER. If the fiber interface isselected, this pin’s function as FXSD.FXSD:0: Fiber link down; 1: Fiber link upTransmit Enable:TXEN TXER Description1 1 Transmission errorpropagation.0 1 Combine TXD[3:0] that equalto 0001 for request PHY toenter LPI mode.1 00 0Normal operationThis pin TXER must be either floating or connecting toGND in RMII mode.7 TXCLK/50M_CLKI I/O Hi-Z Transmit Clock output or 50M clock input:In MII mode,this pin provides a continuous 25MHz clockat 100Base-TX and 2.5MHz at 10Base-T.In RMII mode, a 50Mhz clock should input to this pin forthe timing reference of the internal circuit.3,4,5,6 TXD[3:0] I Hi-Z Transmit Data Input:IP101GAPin no.LabelType ResetDescriptionStateIn MII mode, TXD[3:0] is synchronous to TXCLK.In RMII mode, TXD[1:0] is synchronous to 50M_CLKI.22 RXDV/CRS_DV/ FX_HEN O/LI (PD) I (PD)Receive Data Valid or Media Type Selection:FX_HENThe input state is latched upon reset to determine whether TP or fiber interface is selected. If it is at logic “0” (default) state upon reset, the TP interface is selected; otherwise the fiber interface is selected. RXDV/CRS_DVIn MII mode, this pin indicates the Receive Data Valid function.In RMII mode, this pin indicates the Carrier Sense and Receive Data Valid function.16 RXCLK/ 50M_CLKO O Hi-Z Receive Clock:In MII mode, this pin provides 25MHz for 100BT or2.5MHz for 10BT.In RMII mode, this pin output a 50 MHz clock for the timing reference of MAC side.18,19, 20,21 RXD[3:0] O Hi-Z Receive Data: In MII mode, RXD[3:0] is synchronous to RXCLK.In RMII mode, RXD[1:0] is synchronous to 50M_CLKI.24 RXER O Hi-Z Receive error:RXDV RXER Description1 1 Decoding error of thereceived signal0 1 Combine RXD[3:0] equal to0001 indicates PHY isreceiving LPI.1 0Normal operation This pin RXER is an optional input for MAC/CPU device.1 COL/RMII O/LI (PD) I (PD)Collision Detected:During the normal operation, thispin outputs a high status signal it means collision isdetected.RMII Mode Selection: During the power on reset, thispin status is latched to determine what kind MAC interface will be used. Logic “1” is for RMII mode and logic “0” is for MII mode.23 CRS/LEDMOD O/LI (PD) I (PD)Carrier Sense: When signal output from this pin is highindicates the transmission or reception is in process andat low status means the line is in idle state.LEDMOD: During power on reset, this pin status is latched to determine which either LED mode 1 or 2is selected, please refer to the LED pins description.Cable Transmission Interface 34,33 MDI_TP MDI_TN I/O I/O Hi-Z Transmit Output Pair: Differential pair shared by100Base-TX and 10Base-T modes. When configured as100Base-TX, output is an MLT-3 encoded waveform. When configured as 10Base-T , the output is ManchesterIP101GAPin no. Label Type Reset DescriptionStatecode.31,30 MDI_RPMDI_RN I/OI/OHi-Z Receive Input Pair: Differential pair shared by 100Base-TX and 10Base-T modes.Clock and Miscellaneous Pins47 X2 O O25MHz Crystal Output: Connects to crystal to providethe 25MHz output. It must be left open when X1 is drivenwith an external 25MHz oscillator.46 X1 I I 25MHz Crystal Input: Connects to crystal to provide the25MHz crystal input. If a 25MHz oscillator is used,connect X1 to the oscillator’s output. If a 50MHz clock isapplied to pin7 TXCLK/50M_CLKI, X1 must beconnected to GND or AGND33.42 RESET_N I I(PU)RESET_N: Enable a low status signal will reset the chip. For a complete reset function. 25MHz clock (x1) must be active for a minimum of 10 clock cycles before the rising edge of RESET_N. Chip will be able to operate after 2.5ms delay of the rising edge of RESET_N. The 2.5ms extension is to ensure the stability of system power.28 ISET I I Bandgap Circuit Resistor: This pin should beconnected to GND via a 6.19KΩ (1%) resistor to definethe standard current of the internal circuit.48 INTR OD Hi-Z Interrupt: Programmable Interrupt Output, this is anopen drain output, and an external pulled-up resistor isneeded for normal mode operation. Another operationmode is Rx to Tx loopback debugging test (reflect onRegister P1R23[13] RX2TX_LPBK) when connect INTRpin to GND.9 LED0/PHY_AD0 O/LI Hi-Z LED 0 and PHY Address [0]LED 0LED mode1 2LED0Link Link /ACT(blinking)10 LED1/PHY_AD1 O/LI Hi-Z LED 1 and PHY Address [1]LED1LED mode1 2LED1Duplex Duplex /COL (blinking)12 LED2/PHY_AD2 O/LI Hi-Z LED 2 and PHY Address [2]LED2LED mode1 2LED210M Link /ACT10M Link13 LED3/PHY_AD3 O/LI(PD) Hi-Z LED 3 and PHY Address [3]LED3LED mode1 2LED3100M Link /ACT 100M Link27 TEST_ON I I Test Enable: Set this pin to high to enable Test mode.IP101GAPin no. Label Type Reset DescriptionState(PD) (PD)For normal operation, this pin doesn’t need to beconnected.Power and Ground32 NC -- -- It’s a NC pin.8 REGOUT P P Regulator Power Output: This is a regulator poweroutput. A 10uF and 0.1uF should be connected to this pinto filter the power noise.14 VDDIO P P Digital Power input:Either 3.3V or 2.5V for I/O power supply.36 AVDD33 P P 3.3V Analog power input: This is a 3.3V power supplyfor analog circuitry, and it should be decoupled carefully.35 AGND33 P P Ground.29 AGND1V P P Ground45,11,17 DGND P P Ground.3.2 IP101GR/GRI pin descriptionIP101GR/GRIPin no. Label Type ResetStateDescriptionSerial Management Interface Pins22 MDC I Hi-Z Management Data Interface Clock: This pin provides aclock reference to MDIO. The clock rate can be up to2.5MHz.23 MDIO I/O(PU)I(PU)Management Data interface Input/Output:Thefunction of this pin is to transfer management informationbetween PHY and MAC.MII/RMII Pins5 TXEN I(PD)I(PD)Transmit Enable or Signal Detect.1 TXER/FXSD I(PD)I(PD)Transmit Error or FXSD:This is a dual-function pin which is determined by themedia type selection. If RXDV/CRS_DV/FX_HEN islatched as “0 (default)” upon reset, the TP interface isselected and its function as TXER. If the fiber interface isselected, this pin’s function as FXSD.FXSD:0: Fiber link down; 1: Fiber link upTransmit Enable:TXEN TXER Description1 1 Transmission errorpropagation.0 1 Combine TXD[3:0] that equalto 0001 for request PHY toenter LPI mode.1 00 0Normal operationThis pin TXER must be either floating or connecting toGND in RMII mode.10 TXCLK/50M_CLKI I/O Hi-Z Transmit Clock output or 50M clock input:In MII mode,this pin provides a continuous 25MHz clockat 100Base-TX and 2.5MHz at 10Base-T.In RMII mode, a 50Mhz clock should input to this pin forthe timing reference of the internal circuit.6,7,8,9 TXD[3:0] I Hi-Z Transmit Data Input:In MII mode, TXD[3:0] is synchronous to TXCLK.In RMII mode, TXD[1:0] is synchronous to 50M_CLKI.19 RXDV/CRS_DV/FX_HEN O/LI(PD)I(PD)Receive Data Valid or Media Type Selection:FX_HENThe input state is latched upon reset to determinewhether TP or fiber interface is selected. If it is at logic“0” (default) state upon reset, the TP interface isselected; otherwise the fiber interface is selected.RXDV/CRS_DVIn MII mode, this pin indicates the Receive Data ValidIP101GR/GRIPin no.LabelType ResetDescriptionStatefunction.In RMII mode,this pin indicates the Carrier Sense and Receive Data Valid function.14 RXCLK/ 50M_CLKO O Hi-Z Receive Clock:In MII mode, this pin provides 25MHz for 100BT or2.5MHz for 10BT.In RMII mode, this pin output a 50 MHz clock for the timing reference of MAC side.15,16, 17,18 RXD[3:0] O Hi-Z Receive Data: In MII mode, RXD[3:0] is synchronous to RXCLK.In RMII mode, RXD[1:0] is synchronous to 50M_CLKI.21 RXER/INTR_32 O/ODHi-Z The multiplex function of this pin is set by the registerSEL_INTR32, page 16, 29[2]. The default function is RXER.Receive error:RXDV RXER Description 1 1 Decoding error of thereceived signal0 1 Combine RXD[3:0] equal to0001 indicates PHY is receiving LPI. 1 0Normal operationThis pin RXER is an optional input for MAC/CPU device.Interrupt: Programmable Interrupt Output, this is an open drain output, and an external pulled-up resistor is needed.4 COL/RMII O/LI (PD) I (PD)Collision Detected:During the normal operation, thispin outputs a high status signal it means collision isdetected.RMII Mode Selection: During the power on reset, thispin status is latched to determine what kind MAC interface will be used. Logic “1” is for RMII mode and logic “0” is for MII mode.20 CRS/LEDMOD O/LI (PD) I (PD)Carrier Sense:When signal output from this pin is highindicates the transmission or reception is in process andat low status means the line is in idle state.LEDMOD: During power on reset, this pin status is latched to determine which either LED mode 1 or 2is selected, please refer to the LED pins description.Cable Transmission Interface 30,29 MDI_TP MDI_TN I/O I/O Hi-Z Transmit Output Pair: Differential pair shared by100Base-TX and 10Base-T modes. When configured as100Base-TX, output is an MLT-3 encoded waveform. When configured as 10Base-T , the output is Manchester code.27,26 MDI_RP MDI_RN I/O I/O Hi-Z Receive Input Pair: Differential pair shared by100Base-TX and 10Base-T modes.Clock and Miscellaneous PinsIP101GR/GRIPin no. Label Type Reset DescriptionState3 X2 O O25MHz Crystal Output: Connects to crystal to providethe 25MHz output. It must be left open when X1 is drivenwith an external 25MHz oscillator.2 X1 I I 25MHz Crystal Input: Connects to crystal to provide the25MHz crystal input. If a 25MHz oscillator is used,connect X1 to the oscillator’s output. If a 50MHz clock isapplied to pin10 TXCLK/50M_CLKI, X1 must beconnected to GND.32 RESET_N I I(PU)RESET_N: Enable a low status signal will reset the chip. For a complete reset function. 25MHz clock (x1) must be active for a minimum of 10 clock cycles before the rising edge of RESET_N. Chip will be able to operate after 2.5ms delay of the rising edge of RESET_N. The 2.5ms extension is to ensure the stability of system power.25 ISET I I Bandgap Circuit Resistor: This pin should beconnected to GND via a 6.19KΩ (1%) resistor to definethe standard current of the internal circuit.11 LED0/PHY_AD0 O/LI Hi-Z LED 0 and PHY Address [0]LED 0LED mode1 2LED0Link Link /ACT(blinking)12 LED3/PHY_AD3 O/LI(PD) Hi-Z LED 3 and PHY Address [3]LED3LED mode1 2LED3100M Link /ACT 100M Link24 TEST_ON I(PD)I(PD)Test Enable: Set this pin to high to enable Test mode.For normal operation, this pin doesn’t need to beconnected.Power and Ground28 REGOUT P P Regulator Power Output: This is a regulator poweroutput. A 10uF and 0.1uF should be connected to this pinto filter the power noise.13 VDDIO P P Digital Power input:IP101GR: Either 3.3V or 2.5V for I/O power supply.IP101GRI: 3.3V for I/O power supply.31 AVDD33 P P 3.3V Analog power input: This is a 3.3V power supplyfor analog circuitry, and it should be decoupled carefully. BottomPADGND P P Ground.4 Register DescriptionsTable 2 Register MapPage Register Description Default NoteX 20 Page Control Register 0x0010-- 0 Control Register 0x3100-- 1 Status Register 0x7849-- 2 PHY Identifier 1 Register 0x0243-- 3 PHY Identifier 2 Register 0x0C54-- 4 Auto-Negotiation Advertisement Register 0x01E1-- 5 Auto-Negotiation Link Partner Ability Register 0x0000-- 6 Auto-Negotiation Expansion Register 0x0004-- 7 Auto-Negotiation Next Page Transmit Register 0x2001-- 8 Auto-Negotiation Link Partner Next Page Register 0x0000-- 13 MMD Access Control Register 0x0000-- 14 MMD Access Address Data Register 0x000016 16 PHY Specific Control Register 0x000216 17 PHY Interrupt Ctrl/Status Register 0x0F0016 18 PHY Status Monitoring Register 0x020816 26 Digital IO Pin Driving Control Register 0x124916 27 Digital IO Pin Driving Control Register 0x001216 29 Digital I/O Specific Control Register 0x008216 30 PHY MDI/MDIX Control and Specific Status Register 0x0000-- MMD 3.0 PCS Control 1 Register 0x0000-- MMD 3.1 PCS Status 1 Register 0x0000-- MMD 3.20 EEE Capability Register 0x0002-- MMD 3.22 EEE Wake Error Count Register 0x0000-- MMD 7.60 EEE Advertisement Register 0x0002-- MMD 7.61 EEE Link Partner Ability Register 0x00001 17 PHY Specific Control Register 0x00001 18 RX CRC Error Counter Register 0x00001 22 Linear Regulator Output Control Register 0x20201 23 UTP PHY Specific Control Register 0x80002 18 RX Packet Counter Register 0x00003 16 LED Control Register 0x00004 16 WOL+ Control Register 0x5F404 22 Digital IO Pin Driving Control Register 0x40005 16 PHY WOL+ MAC Address Register 0x00008 17 RX Counter Control Register 0x700011 18 UTP PHY Interrupt Control/Status Register 0x0000Page Register DescriptionDefault Note 17 17 PHY WOL+ Status Register0x0000 1817RX Counter Interrupt Control/Status Register0x0000Register descriptionsR/W = Read/Write, SC = Self-Clearing, RO = Read Only, LL = Latching Low, LH = Latching High (TP): for twisted pair operation. (FX): for fiber operation. (e-fuse): only available for IP101G (dice).4.1 Register Page mode Control RegisterMII register 20 PHYMIIROMR/WDescriptionDefaultPage Control Register -- 20[4:0] -- R/W Reg16~31_Page_Sel[4:0] Register Page Select0x10The other Registers are reserved registers. User is inhibited to access to these registers. It may introduce abnormal function to write these registers.4.2 MII RegistersBitNameDescription/UsageDefault value (h): 3100Register 0 : Control Register 15 ResetWhen set, this action will bring both status and control registers of the PHY to default state. This bit is self-clearing. 1 = Software reset 0 = Normal operation0, RW/SC 14 LoopbackThis bit enables loopback of transmit data to the receive data path, i.e., TXD to RXD. 1 = enable loopback 0 = normal operation0, RW 13 Speed SelectionThis bit sets the speed of transmission. 1 = 100Mbps 0 = 10MbpsAfter completing auto-negotiation, this bit will reflect the speed status.(1: 100Mbps, 0: 10Mbps)1, RW 12 Auto-Negotiation Enable This bit determines the auto-negotiation function. 1 = enable auto-negotiation; bits 13 and 8 will be ignored. 0 = disable auto-negotiation; bits 13 and 8 will determine the link speed and the data transfer mode, under this condition.1, RW (TP) 0, RO (FX) 11 Power DownThis bit will turn down the power of the PHY chip and the internal crystal oscillator circuit if this bit is enabled. The MDC and MDIO are still activated for accessing to the MAC. 1 = power down0 = normal operation0, RW 10 Isolate1=electrically Isolate PHY from MII but not isolate MDC and MDIO0,RW。

IP113CLF原厂资料

IP113CLF原厂资料

10 /100Base-Tx/Fx Media ConverterFeaturesA 10/100BASE-TX/ 100BASE-FX converter Built in a 10/100BASE-TX transceiverBuilt in a PHY for 100BASE-FXBuilt in a 2-port switch– Pass all packets without address andCRC check (optional)– Supports modified cut-through frameforwarding for low latency– Supports pure converter mode dataforwarding for extreme low latency – Supports flow control for full and halfduplex operation– Bandwidth control– Forward 1600 bytes packet formanagement– Optional forward fragmentsBuilt in 128Kb RAM for data bufferSupports auto MDI-MDIX functionSupports link fault pass through functionSupports far end fault functionLED display for link/activity, full/half, 10/100 Built in a watchdog timer to monitor internal switch errorSupports EEPROM Configuration0.25u CMOS technologySingle 2.5V power supply48-pin LQFP packageSupport Lead Free package (Please refer to the Order Information) General DescriptionIP113C LF can be a 10/100BASE-TX to 100BASE-FX converter. It consists of a 2-port switch controller, a fast Ethernet transceiver and a PHY for 100BASE-FX. The transceivers in IP113C LF are designed in DSP approach with advance 0.25-um technology; this results in high noise immunity and robust performance.IP113C LF not only supports store and forward mode, it also supports modified cut through mode and pure converter mode for low latency data forwarding. IP113C LF can transmit packet(s) up to 1600 bytes to meet requirement of extra long packets.IP113C LF supports IEEE802.3x, collision base backpressure, and various LED functions, etc. These functions can be configured to fit the different requirements by feeding operation parameters via EEPROM interface or pull up/down resistors on specified pins.Block DiagramRevision HistoryRevision # Change DescriptionIP113C LF-DS-R01 Initial release.IP113C LF-DS-R02 Remove Operation Junction Temperature.IP113C LF-DS-R03 TP port should be linked at 100M full duplex when working at this mode.IP113C LF-DS-R04 Add the order information for lead free package.IP113C LF-DS-R05 Revise the diagram.IP113C LF-DS-R06 TP_FORCE (Pin24) &X_EN(Pin29)It is an input pin during reset period. The default value is latched at the end of reset. IP113C LF-DS-R07 Remove internal pull-high resistance & pull-low resistance on page 5.Modify the IPL : pull-low and IPH : pull-highIP113C LF-DS-R08 Add Power Pin description on Page10Application DiagramApplicationsUn-managed converter10B A S E_T/100B A S E-TX100B A S E-F XPIN DiagramN CF A S T _F W DG N D R X IP L F PG N D A 1A V C C G N D T X O M A V C C R X IM F X R D M D I R E C T _W I R E V C C F X S D F X T D P F X T D M N CT S M R E S E T B T S E X _E N L E D _F X _F E F _D E T / D U P L E X _M O D E L E D _T P _F D X L E D _T P _L IN KL E D _F X _L IN K / F X _F U L L L E D _F X _S D / S P E E D _M O D EV C C X 2G N D V C C O S C I S D A S C L / A 0N C V C C B G R E SV C C _IO G N D _IO G N DL E D _F X _F D X / A 2T X O P F X R D P A V C C N CT P _F O R C EL E D _T P _S P D1. PIN DescriptionType DescriptionpinI InputpinO OutputIPL Input pin with internal pull-low resistor.IPH Input pin with internal pull-high resistor.Pin no. Label Type DescriptionTransceiver5, 6 RXIP, RXIM I TP receive8, 9 TXOP, TXOM O TP transmit2 BGRES OBand gap resistorIt is connected to GND through a 6.19k (1%) resistor inapplication circuit.18 FXSD I100Base-FX signal detectFiber signal detect. It is an input signal from fiber MAU.Fiber signal detect is active if the voltage on FXSD is higherthan the threshold voltage, which is 1.35v ±5% when VCCis equal to 2.5v.13, 14 FXRDP, FXRDM I Fiber receiver data pairCommon-mode voltage of FXRDP and FXRDM aresuggested to near 0.5x AVCC.When voltage peak-to-peak>0.1V,FXRX could beworkable.16, 17 FXTDP, FXTDM O Fiber transmitter data pairFXTX with the external 100Ωresistor.Common-mode voltage of FXTDP and FXTDM aresuggested to near 0.5x AVCC.Swing of Voltage ≧ 0.8V.1. PIN Description (continued)Pin no. Label Type DescriptionLED pins31 LED_TP_LINK OTP port link LEDOn: link ok, Off: link fail, Flash: link ok & activity(Flash: on for 20ms and off for 80ms)33 LED_TP_SPD OTP port speed LEDOn: 100M, Off: 10M32 LED_TP_FDX OTP port full duplex LEDOn: full, Off: half,Flash: half & collision happens(Flash: on for 20ms and off for 80ms)36 LED_FX_LINK OFiber port link LEDOn: link ok, Off: link fail, Flash: link ok & activity(Flash: on for 20ms and off for 80ms)37 LED_FX_FDX OFiber port full duplex LEDOn: full, Off: half, Flash: half & collision happens(Flash: on for 20ms and off for 80ms)38 LED_FX_SD Fiber port signal detectOn: fiber signal detected, Off: fiber unplugged30 LED_FX_FEF_DETOFar end fault pattern receivedFor End Fault Patterns ReceiveLED On: 80ms, LED Off: 20msFor End Fault Pattern not ReceiveLED always OffNote: The output of LED pin is logic low when the LED is on.1. PIN Description (continued)Pin no. Label Type DescriptionMC operation mode29 X_EN O/IPH IEEE 802.3X enable on TP port and fiber port1: enable (default),0: disableIt is an input pin during reset period. The default value islatched at the end of reset.After reset, it becomes an output pin for testing.It should be connected to GND through a 1k ohm resisterto set 0.24 TP_FORCE O/IPL Local TP port auto negotiation enable1: TP port supports auto-negotiation with limited capabilitydefined in SPEED_MODE and DUPLEX_MODE.0: TP port supports auto-negotiation with 10M/100M, full/half capability (default)The default value may be updated by either programmingEEPROM register 3.5 or MII register 20.13.It is an input pin during reset period. The default value islatched at the end of reset.After reset, it becomes an output pin for testing.It should be connected to VCC through a 1k ohm resisterto set 1.38 SPEED_MODE IPHLocal TP port speed1: TP port has the 100Mb speed ability0: TP port has the 10Mb speed ability onlyIt is valid only if TP_FORCE is enabled.IPH30 DUPLEX_MODELocal TP port duplex1: TP port has the Full duplex ability0: TP port has the Half duplex ability onlyIt is valid only if TP_FORCE is enabled.36 FX_FULL IPHSet the duplex of fiber port1: full duplex (default)0: half duplex1. PIN Description (continued)Pin no. Label Type Description MC operation mode1. PIN Description (continued)Pin no. Label Type DescriptionMC operation mode21 LFP IPLLink fault pass through (LFP)1: enableLink status of one port is forwarded to the other port.0: disable (default)22, 23 DIRECT_WIRE,FAST_FWDIPL DIRECT_WIREFAST_FWD Function0 0 Store and forward switch mode(default)0 1 Modified cut-through switchmode1 0 Converter mode1 1 Converter mode withauto-change-forward functionStore and forward switch mode:IP113C LF will begin to transmit a frame right after thecompletion of receiving a frame.Modified cut-through switch mode:IP113C LF will begin to forward a frame after the first 64bytes data received. TP port should be forced at 100M atthis mode.Converter mode:Incoming frames are not buffered in IP113C LF to achievethe min latency. Both TP port and fiber port of IP113C LFshould work at 100M full duplex in this mode. If TP port islinked at half duplex, the total length of UTP cable and fibershould be less than 60 meters to meet the requirement ofCSMACD in IEEE802.3.Converter mode with auto-change-forward function:IP113C LF will change to forward mode if it detects thespeed is different in TP port and FX port.In converter mode, IP113C LF forwards IEEE802.3x pauseframe directly. In the other modes, IP113C LF doesn’tforward IEEE802.3x pause frame directly, it sends outpause frame when its internal buffer is full.1. PIN Description (continued)Pin no. Label Type DescriptionEEPROM interface45, 46 SDA, SCL IPH, O EEPROM interface37, 12, 46A[2:0] IPLPHY addressIP113C LF uses A[2:0] as EEPROM address to readEPROM.Pin no. Label Type DescriptionMisc.28 RESETB IResetIt is low active.41, 40 OSCI, X2 I, O Crystal pinsOSCI and X2 are connected to a 25Mhz crystal.If a 25MHz oscillator is used, OSCI is connected to theoscillator’s output and X2 should be left open.26, 27 TSM, TSE IPL Scan pinsThese two pins should be left open or connected to groundfor normal operation.Pin no. Label Type DescriptionPower1,7,11 AVCC 2.5VAnalogPower19,39,44 VCC 2.5V Digital Power34 VCC_IO 3.3V or 2.5V Digital Power35 GND_IO I/OGround4,10,20, 42,43 GNDGround2. Functional DescriptionData forwardingIP113C LF supports three types of data forwarding mode, store & forward mode, modified cut-through mode and pure converter mode. It can forward a frame despite of its address and CRC error. IP113C LF begins to forward the received data only after it receives the frame completely. The latency depends on the packet length.Modified cut-through modeIP113C LF begins to forward the received data when it receives the first 64 bytes of the frame. The latency is about 512 bits time width. The maximum packet length can be up to1600 bytes in this mode. Please refer to the pin description of FAST_FWD for configuration information.Pure converter modeIP113C LF operates with the minimum latency in this mode. The transmission flow does not wait until entire frame is ready, but instead it forwards the received data immediately after the data being received. Both transceivers are interconnected via internal MII signals, therefore the internal switch engine and data buffer are not used. Both TP port and fiber port of IP113C LF should work at 100M full duplex in this mode. If TP port is linked at half duplex, the total length of UTP cable and fiber should be less than 60 meters to meet the requirement of CSMACD in IEEE802.3.The packet length is not limited at this mode. Please see pin description of DIRECT_WIRE for configuration information.Fragment forwardingIP113C LF forwards CRC error packets but it will filter fragments when it works in modified cut-through mode. IP113C LF forwards fragments if user turns on bit 3 of EEPROM register 2.TP port force modeThe TP port of IP113C LF can work at auto mode or force mode. The following table shows all of the combination of its TP port.Link partner’s capabilityAN on AN off{TP_FORCE,IP113C LF’s link result100F100H10F10H100F 100H 10F10H SPEED_MODE,DUPLEX_MODE} IP113C LF’s capability011 100/10M, Full/Half, AN on 100F100H10F10H100H 100H 10H10H 010 100/10M, Half, AN on X 100H X 10H100H 100H 10H10H 001 10M, Full/Half, AN on X X 10F10H100H 100H 10H10H 000 10M, Half, AN on X X X 10H100H 100H 10H10H 111 100M, Full, AN on 100F X X X 100F 100F X X 110 100M, Half, AN on X 100H X X 100H 100H X X 101 10M, Full, AN on X X 10F X X X 10F10F 100 10M, Half, AN on X X X 10H X X 10H10H Note:AN on: with auto-negotiation capabilityAN off: without auto-negotiation capability100F: 100M full duplex100H: 100M half duplex10F: 10M full duplex10H: 10M half duplexLink fault pass throughWhen link fault pass through function is enabled, link status on TX port will inform the FX port of the same device and vice versa. From the link fault pass through procedure illustrates in the figure below, if link fail happens on IP113C LF’s TX port (1), the local FX port sends non-idle pattern to notice the remote FX port (2). The remote FX port then forces its TX port to link failed after receiving the non-idle pattern (4). In other words, this mechanism will alert the link fault status of local TX port to the remote converter’s TX port, and the link status of the remote TX port will become off. Link status LED will also be off for both IP113C LF and its link partner.(1) TP port link failedThe procedure of link fault pass through(3) fiber port gets remote link fault information (4) TP link fail(5) remote TPlink is offnon-idle patternNormal caseLED SW1LED_TP_LINK1LED_FX_LINK1LEDSW2localremote LED_FX_LINK2LED_TP_LINK2Link LED onSW1LED_TP_LINK1 LED_FX_LINK1LED_FX_LINK2LED_TP_LINK2Link LED onSW2ON ON ON ON ON ONRemote TP port disconnectedIP113C LF IP113C LFFiberSwitch1Switch2 LED SW1LED SW2local remote LED_TP_LINK1LED_FX_LINK1LED_FX_LINK2LED_TP_LINK2UTPUTPdisconnectLink LED onSW1 LED_TP_LINK1 LED_FX_LINK1LED_FX_LINK2LED_TP_LINK2Link LED onSW2Off Off Off Off Off OffFX port disconnectedIP113CLF IP113CLFUTP UTFiber P Switch1 Switch2LEDSW1LED_TP_LINK1LED_FX_LINK1LEDSW2localremoteLED_FX_LINK2LED_TP_LINK2Link LED onSW1 LED_TP_LINK1 LED_FX_LINK1LED_FX_LINK2LED_TP_LINK2Link LED onSW2Off Off Off Off Off OffLED diagnostic functions for fault indicationLED_TP_LINK LED_FX_LINK LED_FX_SD LED_FX_FEF_DET Status On On On Off Linkok Flash Flash On Off Link ok & activityOff Off On Off Remote TP link offOff Off Off Off Fiber RX off, Fiber TX/ RX offOff Off On Flash FiberTXoff NoteFlash: flash, period 100 msLink fault pass through is enabled.EEPROM – store the initial valueIP113C LF supports two ways to load initial value of MII registers. The procedure is illustrated as below.1. IP113C LF reads the default setting of MII register from pins2. IP113C LF updates the default setting of MII by reading EEPROM. If there exists an EEPROM3. After reading EEPROM, IP113C LF is virtually isolated from the EEPROM. Micro-controller can program both MII register and EEPROM.4. IP113C LF reloads the content of EEPROM to recover the value in MII registers programmed by Micro-controller after power on reset.Auto MDI_MDIXIP113C LF supports auto MDI-MDIX. It is always enabled. The following is its application circuit for auto MDI-MDIX.GND GNDIP113C LF's application circuit (auto MDI-MDIX on)EEPROM registersType Description Type Description R/W Read/Write RC Read and ClearSC Self-Clearing LL LatchingLow RO Read Only LH Latching HighPin(1) The default value is “1” and it dependson the setting of its corresponding pin.Pin(0) The default value is “0” and it dependson the setting of its corresponding pin.ROM NAME R/W DESCRIPTION DEFAULT EEPROM enable register 00[7:0] --EEPROM enable register 0This register should be filled with 55. IP113C LFwill examine the specified pattern to confirm ifthere is a valid EEPROM.55hROM NAME R/W DESCRIPTION DEFAULT EEPROM enable register 11[7:0] --EEPROM enable register 1This register should be filled with AA. IP113C LFwill examine the specified pattern to confirm ifthere is a valid EEPROM. The initial setting isupdated with the content of EEPROM only if thespecified pattern 55AA is found.AAhEEPROM registers (continued)ROM NAME R/W DESCRIPTION DEFAULT Switch configuration register 12.0 reserved -- The default value must be adopted for normaloperation.2.1 direct_wire -- Please see pin description of DIRECT_WIRE formore detail information.Pin (0)2.2 fast_fwd -- Please see pin description of FAST_FWD for moredetail information.Pin (0)2.3 mg_pass_fragment_en -- Pass fragment packet (>7B and <64B)1: pass fragment0: not pass fragment2.4 mg_col16_drop_en -- Collision 16 times drop enable1: drop0: not drop2.5 mg_col_backoff_en -- Collision back-off enable1: back after collision0: not back off after collision12.6 reserved --Thedefaultvalue must be adopted for normaloperation.2.7 p01_mg_backpress_en -- TP port backpressure control enable for halfduplex1: backpressure enable0: backpressure disable1 3.0 reserved --Thedefaultvalue must be adopted for normaloperation.0 3.1 reserved --Thedefaultvalue must be adopted for normaloperation.3.2 reserved -- The default value must be adopted for normaloperation.1 3.3 reserved --Thedefaultvalue must be adopted for normaloperation.1 3.4 mg_em_bist_en --SSRAM BIST enable (R/W by EEPROM only)1: BIST enable0: bypass BIST13.5 tp_force -- This pin overwrites the setting on pin 26TP_FORCE.Pin (0)3.6 mg_receive_en -- TP receive enable1: TP port can receive packet0: TP port drop all received packet1 3.7 reserved --Thedefaultvalue must be adopted for normaloperation.ROM NAME R/W DESCRIPTION DEFAULT Switch configuration register 2port allocated memory pages120d 4[7:0] p01_mg_port_page_no -- TPThe default is 120 pages with 64 bytes per page.120dport allocated memory pages5[7:0] p02_mg_port_page_no -- FXThe default is 120 pages with 64 bytes per page.Note: p01_mg_port_page_no adds p02_mg_port_page_no must be equal to 240.EEPROM registers (continued)ROM NAME R/W DESCRIPTION DEFAULT Local MC extended registervalue must be adopted for normaldefault6.0 reserved --Theoperation.value must be adopted for normaldefaultThe6.1 reserved --operation.6.2 p01_mg_auto_neg_en -- TP port auto-negotiation enable11: TP auto-negotiation enable0: TP auto-negotiation disable16.3 p01_mg_speed_mode -- TP port speed selection1: 100M, 0:10M6.4 p01_mg_duplex_mode -- TP port duplex mode selection11: full duplex, 0:half duplex16.5 p01_mg_flow_ctrl_en -- TP port flow control selection1: on, 0:offdefaultvalue must be adopted for normalThe6.6 reserved --operation.flow control/backpressure enablePin (1)port6.7 p02_mg_flow_ctrl_en -- Fiber1: enable, 0: disable17.0 p02_mg_duplex_mode -- Fiber port duplex mode (FX_FULL)1: full duplex, 0:half duplex7.1 reserved -- The default value must be adopted for normal1operation.7.2 reserved -- The default value must be adopted for normaloperation.7[4:3] p01_mg_throttle_confg -- TP port input Rate Control002'b00: full speed2'b01: 1/4 speed2'b10: 2/4 speed2'b11: 3/4 speed7[6:5] p01_mg_throttle_confg -- TP port output Rate Control002'b00: full speed2'b01: 1/4 speed2'b10: 2/4 speed2'b11: 3/4 speed17.7 mg_link_pass_en -- Link Fault Pass through enable (LFP)1: enable, 0: disable3. Signal RequirementsAbsolute Maximum RatingStresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Functional performance and device reliability are not guaranteed under these conditions. All voltages are specified with respect to GND.Supply Voltage –0.3V to Vcc+0.3VInput Voltage –0.3V to Vcc+0.3VOutput Voltage –0.3V to Vcc+0.3VStorage Temperature -55°C to 125°CAmbient Operating Temperature (Ta) 0°C to 70°CDC CharacteristicOperating ConditionsParameter Sym. Min. Typ. Max. Unit Conditions Supply Voltage VCC 2.375 2.5 2.625VPower Consumption 0.475 WVCC=2.5v Input ClockParameter Sym. Min. Typ. Max. Unit Conditions Frequency 25 MHzFrequencyTolerance -100 +100PPMI/O Electrical CharacteristicsParameter Sym. Min. Typ. Max. Unit Conditions Input Low Voltage VIL 0.8 VInput High Voltage VIH 2.0 VOutput Low Voltage VOL 0.4 V IOH=4mAOutput High Voltage VOH VCC_IO-0.4VIOL=4mA4. Order InformationPart No. Package NoticeIP113C48-PIN LQFP -IP113C LF 48-PIN LQFP Lead free5. Package Detail132425363748Notes:1. DIMENSION D & E DO NOT INCLUDE MOLD FLASH OR PROTRUSION.2. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION / INTRUSION.3. MAX. END FLASH IS 0.15MM.4. MAX. DAMBAR PROTRUSION IS 0.13MM.GENERAL APPEARANCE SPEC SHOULD BE BASED ON FINAL VISUAL INSPECTION SPEC.IC Plus Corp.ACTION DYNAMIC TECH(HK) TRADING COMPANYadd:Room1139-1142,Guoli Building,ZhenzhongRoad,Futian District,Shenzhen,China Tel:86-755-82539044 82539193Faxÿ86-755-82539160E-mail:DNSJ@。

HS8916_V0.6_Datasheet Preliminary

HS8916_V0.6_Datasheet Preliminary

QUAD-BAND GSM/GPRS/EDGE W Multi-Mode Transmit Module with Fourteen Linear TRx Switch Ports andDual-Band TD-SCDMA B34/39 and TDD LTE B39HS8916 Preliminary DatasheetVersion 0.62016-03-21HS8916 Front-end ModuleProduct Features ApplicationsG N DG N DG N DG N DG N DC P LG NDN CTRX10ANT TRX9TRX8GND GNDGND TRX11TRX12TRX13TRX14•LGA: 5.5 mm x 5.3 mm x 0.85 mm Max•Fully programmable MIPI RFFE control •Fourteen low -insertion-loss TRx ports (fiveultra-low loss) with enhanced linearity, for state-of-the-art 4G performance and GPS /•Cellular handsets encompassing Quad -Band GSM/EDGE, Dual-Band TD-SCDMA, and TDD LTE- Class 4 GSM850/900 - Class 1 DCS1800/PCS1900Product DescriptionThe HS8916 is a high-power, high-efficiency Front-End Module for GSM850/900, DCS1800, PCS1900 operation. The FEM supports Class.12 General Packet Radio Service (GPRS), EDGE multi-slot operation, and TD-SCDMA and TDD LTE linear transmission.The module provides 50 ohm impedance at input and output ports, consists of a CMOS Controller, a SP16T RF switch, a power amplifier supporting GSM850/900, DCS1800/PCS1900, TD-SCDMA bands 34/39, and TDD LTE band 39. The module integrated Tx low pass harmonic filtering can achieve best harmonic performance.The HS8916 provides high-power and high-efficiency Pout for GSM850/900, DCS1800, PCS1900 operation mode. In EDGE and TD-SCDMA / TDD LTE linear modes, VRAMP voltage and MIPI-based bias settings optimize PA linearity and efficiency.Absolute Maximum RatingsMIPI RFFE REGISTER MAP (1 OF 2)MIPI RFFE REGISTER MAP (2 OF 2)Electrical Specifications – TX GSM850/900 Band, GSMK ModeElectrical Specifications – TX GSM850/900 Band, EDGE ModeElectrical Specifications – TX DCS1800/1900 Band, GMSK ModeElectrical Specifications – TX DCS1800/1900 Band, EDGE ModeElectrical Specifications – TX TD-SCDMA B39 BandElectrical Specifications – TX TDD LTE B39 BandElectrical Specifications – TX TD-SCDMA B34 BandElectrical Specifications – Ports TRx1 to TRx14 ModePin-Out DiagramT R X 7T R X 6T R X 5G N DT R X 1T R X 2T R X 3T R X 4HS8916 Application CircuitT R X 7T R X 6T R X 5G N DR X 1T R X 2T R X 3T R X 4Package DrawingThe HS8916 is encapsulated in a 5.5×5.3×0.85mm Land Grid Array (LGA) package on a laminate substrate. The HS8916 is RoHS compliant.。

CR4500 ProDye 4C Matrix Standard 生物技术手册说明书

CR4500 ProDye 4C Matrix Standard 生物技术手册说明书

2021版 CTM674原英文技术手册TM674中 文 说 明 书适用产品目录号:CR4500ProDye™ 4C Matrix Standard普洛麦格(北京)生物技术有限公司Promega (Beijing) Biotech Co., Ltd 地址:北京市东城区北三环东路36号环球贸易中心B座907-909电话:************网址:技术支持电话:400 810 8133(手机拨打)技术支持邮箱:*************************CTM6742022制作1所有技术文献的英文原版均可在/ protocols 获得。

请访问该网址以确定您使用的说明书是否为最新版本。

如果您在使用该试剂盒时有任何问题,请与Promega 北京技术服务部联系。

电子邮箱:*************************1. 产品描述 (2)2. 产品组分和储存条件 (2)3. 使用Promega Spectrum Compact CE System进行仪器准备和光谱校正 (3)3. A. 基质样品制备 (3)3. B. 仪器准备和光谱校正 (4)3. C. 审核结果 (11)4. 使用Applied Biosystems® 3500和3500xL Genetic Analyzers进行仪器准备和光谱校正 (16)4. A. 基质样品制备 (16)4. B. 仪器准备和光谱校正 (17)5. 疑难解答 (18)6. 相关产品 (19)ProDye™ 4C Matrix Standard普洛麦格(北京)生物技术有限公司Promega (Beijing) Biotech Co., Ltd 地址:北京市东城区北三环东路36号环球贸易中心B座907-909电话:************网址:技术支持电话:400 810 8133(手机拨打)技术支持邮箱:*************************CTM6742022制作21. 产品描述生成适当光谱校正文件对于采用Promega Spectrum Compact CE System、Applied Biosystems® 3130、3130xl、3500、3500xL和SeqStudio® Genetic Analyzers等多色系统的评估非常重要。

Fuji Xerox维修手册 Ver.2

Fuji Xerox维修手册 Ver.2

6.2.3 Jam Counter ..........................................................
8
6.2.4 Fail Counter .........................................................
8
6.2.5 Shutdown History .....................................................
9
6.2.6 NVM Read / Write ..................................................... 10
6.2.15 Tray 5 (Bypass) Guide Adjustment .................................... 39
6.2.16 IIT Calibration ..................................................... 40
6.3.1 IOT xx ESS IF ........................................................ 43 Chain 740-xxx Recycle ....................................................... 43 Chain 740-xxx Billing ....................................................... 44 Chain 740-xxx 742-xxx 751-xxx 760-xxx PH .................................... 45 Chain 740-xxx 749-xxx 751-xxx XERO .......................................... 48 Chain 741-xxx Drive ......................................................... 49 Chain 741-xxx NOHAD ......................................................... 50 Chain 742-xxx TRAY .......................................................... 51 Chain 742-xxx 764-xxx EXIT .................................................. 54 Chain 744-xxx FUSER ......................................................... 55 Chain 749-xxx ROS ........................................................... 56 Chain 751-xxx CRU ........................................................... 57 Chain 751-xxx 752-xxx 753-xxx Procon ........................................ 59 Chain 763-xxx Finisher-C .................................................... 61 Chain 764-xxx Finisher-B .................................................... 74

安全光栅Allen-Bradley GuardShield 450L 基础和增强型说明书

安全光栅Allen-Bradley GuardShield 450L 基础和增强型说明书

Identify, Mitigate and Eliminate the Risks of Automation ObsolescenceThe Allen-Bradley® GuardShield™ 450L Safety Light Curtains from Rockwell Automation include Basic and Enhanced models both available in finger or hand resolution. The ‘single stick’ transceiver design of these POC light curtains mean that the same ‘stick’ can be used as either transmitter or receiver and is configured along with the application using plug-in modules. This means that the customer only pays for the application/functionality they require and greatly reduces the requirements for spare stock. Like the 445L, the 450L features anintegrated laser alignment system. Another advantage of the 450L family is that it offers end-to-end protection and has no dead zone. The 445L Safe 4 and 445L Safe 2 ‘POC’ Migration Reference Manual includes detailed specifications, wiring schematics and otherconsiderations to help you seamlessly convert from a legacy 445L Safe 4 or Safe 2 POC light curtain to more cost-effective design featuring 450L light curtains. Download the conversion manual by selecting this link 445L-RM001_-EN-P.Product LifecycleProduct Lifecycle Status ACTIVEACTIVE MATUREEND OF LIFEDISCONTINUEDACTIVE: Most current offering within a product category.ACTIVE MATURE: Product is fully supported, but a newer product or family exists. Gain value by migrating.END OF LIFE: Discontinued date announced – actively execute migrations and last time buys. Product generally orderable until the discontinued date.1Repair/exchange services may be available.1 - Outages on specific items may occur prior to the Discontinued date.2 - Limited stock may be available in run-out mode, regionally.450L FamilySafe 2/4 FamilyProduct SpecificationsRange Comparison Safe 4 POC to 450L445L Safe 4 to 450L-B Conversion Table 11445L part numbers refer to pairs, whereas 450L refer to equivalent single stick. In order to receive the same ‘system’ as the 445Lpair you will be required to order 2x 450L stick, plus suitable plug-in for each.445L Safe 4 to 450L-E Conversion Table22 445L part numbers refer to pairs, whereas 450L refer to equivalent single stick. In order to receive the same ‘system’ as the 445L pair you will be required to order 2x 450L stick, plus suitable plug-in for each.Transmitter Pinout DescriptionsReceiver Pinout Descriptions445L Safe 2 POC Range Comparison 445L Safe 2 to 450L-B Conversion Table 33445L part numbers refer to pairs, whereas 450L refer to equivalent single stick. In order to receive the same ‘system’ as the 445Lpair you will be required to order 2x 450L stick, plus suitable plug-in for each.445L Safe 2 to 450L-E Conversion Table 4445L Safe 2 to 440L Type 2 Conversion Table 55445L part numbers refer to pairs, whereas 450L refer to equivalent single stick. In order to receive the same ‘system’ as the 445L pair you will be required to order 2x 450L stick, plus suitable plug-in for each.4445L part numbers refer to pairs, whereas 450L refer to equivalent single stick. In order to receive the same ‘system’ as the 445Lpair you will be required to order 2x 450L stick, plus suitable plug-in for each.450L Response Time Comparison440L Response Time (With No Beam Coding)Output Load CapabilityThe 450L and 440L safety light curtains have higher output load capability than the 445L Safe 4 light curtain. The output load capability of the light curtains is shown below. All three safety light curtain systems have output short-circuit protection.Allen-Bradley, Expanding Human Possibility, GuardShield safety light curtain and Rockwell Automation are trademarks of Rockwell Automation, Inc.Trademarks not belonging to Rockwell Automation are property of their respective companies.Publication MIGRAT-PP044A-EN-P - March 2020Copyright © 2020 Rockwell Automation, Inc. All Rights Reserved. Printed in USA.。

埃森普项目器搭载兼容性信息表说明书

埃森普项目器搭载兼容性信息表说明书

Epson America, Inc. 3131 Katella Ave., Los Alamitos, CA 90720
Epson Canada Limited 185 Renfrew Drive, Markham, Ontario L3R 6G3
www.epson.ca
BrightLink 475Wi/480/485Wi BrightLink Pro 1410Wi
PowerLite 570/575W/580/585W
BrightLink 575Wi/585Wi/595Wi BrightLink Pro 1420Wi/1430Wi
PowerLite 675W/680/685W/720/ 725W/750F/760W/770F/755F/
BrightLink 475Wi/480/485Wi/575Wi/585Wi/ 595Wi/685Wi/695Wi/696Ui/697Ui/710Ui/
725Wi/735Fi/760Wi/770Fi
BrightLink Pro 1410Wi/1420Wi/ 1430Wi/1450Ui/1460Ui/1470Ui
N/A
Legacy Mounts: V12H517020 (ELPMB28) – Discontinued V12H675020 (ELPMB43) – Discontinued V12H777020 (ELPMB46) – Discontinued V12H902020 (ELPMB53) – Discontinued
V12H706020 (ELPMB45) – Discontinued V12H706020 (ELPMB45) – Discontinued
PowerLite L200SX/L200SW/ L210SW/L210SF

HP LaserJet M1005 MFP 说明书

HP LaserJet M1005 MFP 说明书

HP LaserJet M1005 MFP 用户指南版权与许可© 2007 版权所有 Hewlett-PackardDevelopment Company, L.P。

未经事先书面许可,严禁进行任何形式的复制、改编或翻译,除非版权法另有规定。

此处包含的信息如有更改,恕不另行通知。

HP 产品和服务的所有保修事项已在产品和服务所附带的保修声明中列出,此处内容不代表任何额外保修。

HP 公司对此处任何技术性或编辑性的错误或遗漏概不负责。

部件号 CB376-90954Edition 1, 12/2007商标声明Adobe® 和 PostScript® 是 Adobe Systems Incorporated 的商标。

Linux 是 Linus Torvalds 在美国的注册商标。

Microsoft®、Windows® 和 Windows® XP是 Microsoft Corporation 在美国的注册商标。

UNIX® 是 The Open Group 的注册商标。

ENERGY STAR® 和 ENERGY STARmark® 是美国环保署在美国的注册标记。

目录1 设备基本信息设备功能 (2)设备部件 (3)正视图 (3)后视图 (3)控制面板 (4)2 软件最低系统要求 (6)支持的操作系统 (7)软件安装 (8)打印机驱动程序 (9)打印机驱动程序帮助 (9)更改打印机驱动程序设置 (9)适用于 Windows 的软件 (10)HP LaserJet 扫描软件 (10)安装 Windows 设备软件 (10)卸载 Windows 设备软件 (10)适用于 Macintosh 的软件 (11)安装 Macintosh 设备软件 (11)卸载 Macintosh 设备软件 (11)3 介质规格一般准则 (14)选择纸张和其它介质 (14)HP 介质 (14)避免使用的介质 (14)可损坏设备的介质 (14)介质使用准则 (16)纸张 (16)彩色纸 (16)自定义尺寸介质 (16)标签 (17)标签结构 (17)ZHCN iii信封 (17)信封结构 (17)双面接缝信封 (17)带不干胶封条或封舌的信封 (18)信封存放 (18)卡片纸和重磅介质 (18)卡片纸结构 (18)卡片纸准则 (19)信头纸和预印表格 (19)支持的介质重量和尺寸 (20)打印和存放环境 (21)4 使用设备装入介质 (24)装入文档以备复印或扫描 (24)装入进纸盘 (24)优先进纸盘 (24)主进纸盘(纸盘 1) (25)控制打印作业 (26)打印设置优先级 (26)选择来源 (26)选择类型或尺寸 (26)使用设备控制面板 (27)更改控制面板显示语言 (27)更改默认介质尺寸和类型 (27)更改默认介质尺寸 (27)更改默认介质类型 (27)5 打印使用 Windows 打印机驱动程序的功能 (30)创建和使用快速设置 (30)创建和使用水印 (30)调整文档大小 (31)从打印机驱动程序设置自定义纸张尺寸 (31)使用不同的纸张和打印封面 (32)打印空白的第一页或最后一页 (32)在一张纸上打印多个页面 (32)双面打印 (33)使用 Macintosh 打印机驱动程序的功能 (35)创建并使用预置 (35)打印封面 (Macintosh) (35)在一张纸上打印多个页面 (Macintosh) (35)iv ZHCN在特殊介质上打印 (38)使用存档打印 (39)取消打印作业 (40)6 复印开始复印作业 (42)取消复印作业 (42)调整复印质量 (42)调整调淡/加深(对比度)设置 (43)缩小或放大复印件 (44)调整复印尺寸 (44)在一张纸上复印多个页面 (45)更改份数 (46)在不同类型和尺寸的介质上复印 (47)复印双面文档 (49)复印照片和书籍 (50)查看复印设置 (52)7 扫描了解扫描方法 (54)使用 HP LaserJet 扫描进行扫描 (Windows) (55)取消扫描作业 (55)使用其它软件扫描 (56)使用符合 TWAIN 和 WIA 标准的软件 (56)从支持 TWAIN 的程序扫描 (56)从支持 TWAIN 的程序扫描 (56)从已启用 WIA 的程序进行扫描(Windows XP 或 Windows Server 2003) (56)从支持 WIA 的程序扫描 (56)扫描照片或书籍 (57)使用光学字符识别 (OCR) 软件扫描 (58)Readiris (58)扫描仪分辨率和颜色 (59)分辨率和颜色准则 (59)分辨率 (59)颜色 (60)8 管理和维护设备信息页 (62)管理耗材 (63)检查耗材状态 (63)存放耗材 (63)更换和回收利用耗材 (63)ZHCN vHP 对非 HP 耗材的政策 (63)HP 打假热线 (63)清洁设备 (65)清洁外部 (65)清洁扫描仪玻璃板 (65)清洁盖板衬底 (65)清洁送纸道 (66)更换打印碳粉盒 (67)9 故障排除问题解决检查表 (70)清除卡塞 (72)卡纸原因 (72)避免卡塞的提示 (72)何处查找卡塞 (72)进纸盘 (73)出纸槽 (74)打印碳粉盒区域 (75)控制面板信息 (76)警报和警告信息 (76)警报和警告信息表 (76)严重错误信息 (76)严重错误信息列表 (76)打印问题 (79)打印质量问题 (79)提高打印质量 (79)了解打印质量设置 (79)识别和纠正打印缺陷 (79)打印质量检查表 (80)一般打印质量问题 (80)介质处理问题 (84)打印介质准则 (84)解决打印介质问题 (84)执行问题 (85)复印问题 (86)预防问题 (86)图像问题 (86)介质处理问题 (87)执行问题 (88)扫描问题 (89)解决扫描图像问题 (89)扫描质量问题 (89)vi ZHCN预防问题 (89)解决扫描质量问题 (90)控制面板显示屏问题 (91)解决常见的 Macintosh 问题 (92)Mac OS X V10.3 和 Mac OS X V10.4 的问题 (92)问题解决工具 (94)恢复工厂默认设置 (94)减少纸张卷曲 (94)附录 A 附件和订购信息耗材 (96)电缆和接口附件 (96)用户可更换部件 (97)纸张和其它打印介质 (97)附录 B 服务和支持Hewlett-Packard 有限保修声明 (100)打印碳粉盒有限保修声明 (101)提供的支持和服务 (102)HP 客户服务 (102)硬件服务 (103)延长保修期 (103)重新包装设备准则 (104)附录 C 设备规格物理规格 (105)电气规格 (105)功耗 (106)环境规格 (106)噪声发射 (107)附录 D 管制信息FCC 标准 (110)环境产品管理计划 (110)保护环境 (110)产生臭氧 (110)功耗 (110)HP LaserJet 打印耗材 (111)欧盟用户丢弃私人废弃设备的规定 (112)材料安全数据表 (112)关于更多信息 (112)一致性声明 (113)不同国家/地区的安全声明 (114)ZHCN vii激光安全声明 (114)加拿大 DOC 声明 (114)韩国 EMI 声明 (114)芬兰激光声明 (115)词汇 (117)索引 (119)viii ZHCN1设备基本信息●设备功能●设备部件ZHCN1打印●打印 letter 尺寸页面的速度可达每分钟 15 页 (ppm),打印 A4 尺寸页面的速度可达14 ppm●打印分辨率可达每英寸 600 点 (dpi) 和 FastRes 1200 dpi●包含各种可调设置以优化打印质量●符合 ISO/IEC 19752 标准,标准黑色打印碳粉盒的平均打印量是 2000 页。

XL1509 中文datasheet

XL1509 中文datasheet

特点:宽输入电压范围 4.5V-40V 输出可调范围1.23V-37V最大占空比100%最小饱和压降1.5V150KHz固定开关频率恒定2A电流输出能力内部优化功率管设计高效率极好的线性输出且负载可调 TTL关断能力内建频率补偿,热关断功能,限流功能,短路保护功能可选封装形式:SOP-8应用领域:LCD监控器与LCD电视数码像框机顶盒调制解调器通信/网络设备概述XL1509是一个150KHz固定频率脉宽调制(降压型)DC/DC转换器。

具有2A 负载驱动能力并且效率高,低纹波和极好的线性,负载调节能力好,仅需最少外部元件。

可调输出使用简单,内建频率补偿和固定频率震荡器。

脉宽调制控制电路可以线性调节占空比从0到100%。

具有使能功能,内置过流和短路保护功能,当发生过流和短路保护时,XL1509工作频率将从150KHz降到50KHz。

内置频率补偿模块使XL1509外部元件最少。

图1.XL1509封装类型2. XL1509引脚结构(顶视图)电压输入引脚,XL1509工作在直流电压的旁路电容到地来消除输入噪声。

功能模块图3: XL1509功能块方框图典型应用电路图4.XL1509典型应用电路12V-5V/2A元件号码记号标识温度范围无铅无铅XL1509-ADJE1 XL1509-ADJE1XL1509-3.3E1 XL1509-3.3E1XL1509-5.0E1 XL1509-5.0E1XL1509-12E1 XL1509-12E1大电流走线要粗,短,不拐弯图5:XL1509测试电路和版图指导的电阻。

12V~3.3V/2A典型应用电路图6 XL1509系统参数测试电路(12V~3.3V/2A) 12V~5V/2A典型应用电路图7 XL1513系统参数测试电路(12V~5V/2A) ADJ版本典型应用电路Preliminary Datasheet 2A 150KHz 40V Buck DC to DC Converter XL1509Rev 2.0 XinLong Semiconductor Limited Corporation11 封装信息SOP8封装机械尺寸SOIC-8单位:毫米(英寸)。

Luminex GigaCore 14R和16Xt RPSU商品说明书

Luminex GigaCore 14R和16Xt RPSU商品说明书

GigaCore RPSU Quick Start Guide Document lu_01_00054_qsg Copyright © 2002-2015 .All rights reserved.No part of this documentation may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, without the prior written permission of Luminex.The information in this documentation is supplied without warranty of any kind, either directly or indirectly, and is subject to change without prior written notice. Luminex, its employees or appointed representatives will not be held responsible for any damages to software, hardware, or data, howsoever arising as a direct or indirect result of the product(s) mentioned herein.Issued by:Publications Department,Luminex LCE, Berkenlaan 8A, Hechtel Eksel, B-3940, Belgium.Documentation last reviewed 27 February 2015 by Luminex LCE.Printed in the EU.Table of Content■Safety Instructions 3 ■Compliance information 4 ■Warranty information 5 ■Registration 5 ■In the box5■Description 6 ■Starting 8 ■Wiring 8■Additional documentation103Safety Instructions■Read Instructions - All the safety and operating instructions should be read before the appliance is operated.■Retain Instructions - The safety and operating instructions should be retained for future reference. ■Heed Warnings - All warnings on the appliance in the operating instructions should be adhered to.■Follow Instructions - All operating and user instructions should be followed.■Water and Moisture - The appliance should not be used near water; for example, near a fountain, or submitted to direct water exposure.■The apparatus shall not be exposed to dripping or splashing liquids and no objects filled with liquids, such as bottles, shall be placed on the apparatus. Do not touch the appliance with wet hands. Do not handle the appliance or power cord with wet or damp hands. If water or any other liquid enters the appliance cabinet, take it to qualified service personnel for inspection.■Cleaning - The appliance should be cleaned only as recommended by the manufacturer. From time to time you should wipe off the front and side panels and the enclosure with a soft cloth. Do not use rough material, thinners, alcohol or other chemical solvents or cloths since this may damage the finish or remove the panel lettering. ■Ventilation - The appliance should be situated so that its location or position does not interfere with its proper ventilation. Place the unit in a well-ventilated location, leaving at least 5 cm (2 inches) of clearance on front, side and rear of unit for air flow. If ventilation is blocked, the unit may overheat and malfunction.■Heat - The appliance should be situated away from heat sources such as radiators or heating systems. ■Power Cord Protection - Power supply cords should be routed so that they are not likely to be walked on or pinched by items placed upon or against them, paying particular attention to cords at plugs, receptacles, and the point where they exit from the appliance.■Power Sources - The appliance should be connected to a power supply only of the type described in the operating instructions or as marked on the appliance. ■Attachments / Options - Only use attachments/options specified by the manufacturer.■Object and Liquid Entry - Care should be taken so that objects do not fall and liquids are not spilled into the enclosure through the openings.■Servicing - The user should not attempt to service the appliance beyond that described in the operating instructions. All other servicing should be referred to qualified service personnel.■Damage Requiring Service - The appliance should be serviced by qualified service personnel when: A. The power supply cord or the inlet has been damaged; B. Objects have fallen, liquid has been spilled into the appliance; C. The appliance has been exposed to rain; or D. The appliance does not appear to operate normally; or E. The appliance has been dropped or the enclosure is damaged.■The equipment shall be used at a maximum ambient temperature of 50° C / 140° F.WARNING : TO REDUCE THE RISK OF FIRE OR ELECTRIC SHOCK, DO NOT EXPOSE THIS APPLIANCE TO RAIN OR MOISTURE.CAUTION : TO REDUCE THE RISK OF ELECTRIC SHOCK, DO NOT REMOVE THE COVER. NO USER SERVICEABLE PARTS INSIDE. REFER SERVICING TO QUALIFIED SERVICE PERSONNEL.The lightning flash with arrowhead symbol, within an equilateral triangle, is intended to alert the user to the presence of uninsulated “dangerous voltage” within the product’s enclosure that may be of sufficientmagnitude to constitute a risk of electric shock to persons.The exclamation point within anequilateral triangle is intended to alert the user to the presence of important operating and maintenance (servicing) instructions in the literature accompanying the appliance.Disposal of Waste Equipment by users in the European UnionThis symbol on the product or its packaging indicates that this product must not be disposed ofwith other waste. Instead, it is your responsibility to dispose of your waste equipment by handing itover to a designated collection point for the recycling of waste electrical and electronic equipment.The separate collectionand recycling of your waste equipment at the time of disposal will help conserve natural resourcesand ensure that it is recycled in a manner that protects human health and the environment. Formore information about where you can drop off your waste equipment for recycling, pleasecontact your local city recycling office or the dealer from whom you purchased the product.EMC (Electromagnetic Compliance)This model GigaCore RPSU complies with the following standards regulating interference and EMC:• EN 55022• EN 55024CE Compliance (EMC and Safety)Luminex is authorized to apply the CE mark on this compliant equipment thereby declaringconformity to EMC Directive 2004/108/EC and Low Voltage Directive 2006/95/EC.4Limited warrantyUnless otherwise stated, your product is covered by a two (2) years parts and labor limited warranty. It is the owner’s responsibility to furnish receipts or invoices for verification of purchase, date, and dealer or distributor. If purchase date cannot be provided, date of manufacture will be used to determine warranty period.Returning under warrantyAny Product unit or parts returned to Luminex LCE must be packaged in a suitable manner to ensure the protectionof such product unit or parts, and such package shall be clearly and prominently marked to indicate that the package contains returned product units or parts. Accompany all returned product units or parts with a written explanation of the alleged problem or malfunction.FreightAll shipping will be paid by the purchaser. Items under warranty shall have return shipping paid by the manufacturer only in the European Union.Under no circumstances will freight collect shipments be accepted. Prepaid shipping does not include rush expediting such as air freight. Air freight can be sent customer collect in the European Union.Warranty is void if the product is misused, damaged, modified in any way, or for unauthorized repairs or parts.RegistrationUse your favorite web browser, and visit http://www.luminex.be/support.php?show=registrationto register your product online.By registering, you become eligible to receive the following:■Technical support information■Software update and upgrade notices■Hardware warranty informationIn the box1 x GigaCore RPSU1 x Quick Start Guide ( including warranty information and safety instructions).4 x 1 meter Molex Micro-Fit 6 pins cable (LU 90 00879)5DescriptionThe GigaCore RPSU is able to monitor two GigaCore Ethernet switches (14R and 16Xt model) at a time. In the unlikely event one of the switch’s power supply fails, the unit will deliver power, seamlessly. The unit can backup both power and power over Ethernet supplies.Please bear in mind the unit can only deliver power or power over Ethernet to one unit a a time.Front panelLED indication for redundant PoE supply status- PoE 1- PoE 2LED indication for redundant power supply status- PSU1- PSU2■2 x LED for backup power over Ethernet supply status (PoE 1 and PoE 2)■2 x LED for backup power supply status (PoE 1 and PoE 2)6Output connectors for backup power supply Output connectors forbackup power overEthernet supply7IEC socket for mains inputFan Rear panel■1 x IEC socket for power input■1 x Fan■2 x Molex output connectors for redundant power supply■2 x Molex output connectors for redundant power over Ethernet supply8The GigaCore RPSU should be located in the same rack where the GigaCore switches to protect are installed.The RPSU is fitted with four 1 meter 6 ways MICRO-FIT Molex cables. In the case the distance between the RPSU and the connected switch to protect is less than one meter, best is to correctly roll the cable to prevent of heating issue.StartingWiringThe device operates with an AC voltage between 100V and 240VAC within a frequency range of 50Hz to 60Hz.An IEC socket is located at the rear of the unit. Please use an IEC plug compliant cable to feed power to the unit.Luminex recommends the use of a power cable, fitted with a locking mechanism to ensure a reliable connection to the device. Luminex also recommends to use power cable in accordance with the standards and the relevant authorities of your country.!!! WARNING: TO ENSURE A TOTAL PROTECTION, THIS EQUIPMENT MUST BEEARTHED !!!Backup PSU Backup PoEGigaCore 14RGigaCore 16XtGigaCore RPSUAbove illustration : wiring exampleLEDStatus MeaningPoE 1GreenUnit is active, ready to sourceRed Unit connected to this port has a failed power over Ethernet supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source PoE 2Green Unit is active, ready to sourceRed Unit connected to this port has a failed power over Ethernet supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source PSU 1Green Unit is active, ready to sourceRed Unit connected to this port has a failed power supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source PSU 2Green Unit is active, ready to sourceRed Unit connected to this port has a failed power supply, and is being fed by the RPSUOrangeThe other port is sourcing, this one cannot source9The LED indicators of the GigaCore RPSU includes power and power over Ethernet supplies status. The following shows the LED indicators for the GigaCore RPSU along with an explanation of each indicator.10Luminex LCE operates a policy of continuous development. Luminex LCE reserves the right to make changes andimprovements to any of the products described in this document above without prior notice. Specifications are subject to change without notice.Power InputPhysicalPower Input100-240VAC - 50/60Hz 2.7A - 1.2AEnclosureMetal Housing Dimensions (W x D x H)482 x 183 x 44 mm 19” x 17.4” x 1.73”Power OutputPackaging 520 x 235 x 50 mm 20.47” x 9.25” x 1.96”PSU output 2 x 15VDC / 2.7A on Molex Micro-Fit 6 pins connector Weight2.7KgPOE supply output 2 x 48VDC / 4.2A on Molex Micro-Fit 6 pins connectorApprovalsEnvironmentalCE P Operating Temperature 0 to + 50°C EN 55022P Storage temperature -10 to +70°C EN 55024P Humidity5 to 95 % RHRoHS Compliance PAdditional documentationAll additional documenttion can be downloaded from our web pages in the support section :http://www.luminex.be--> Support11。

ICE1PCS01

ICE1PCS01

Preliminary Datasheet, Version 1.1, 28 May 2003CCM-PFCICE1PCS01ICE1PCS01GStandalone Power Factor Correction (PFC) Controller in Continuous Conduction Mode (CCM)Power Management & SupplyEdition 2003-05-28Published by Infineon Technologies AG, St.-Martin-Strasse 53, D-81541 München© Infineon Technologies AG 1999. All Rights Reserved.Attention please!The information herein is given to describe certain components and shall not be considered as warranted charac-teristics.Terms of delivery and rights to technical change reserved.We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement, regarding circuits, descriptions and charts stated herein.Infineon Technologies is an approved CECC rmationFor further information on technology, delivery terms and conditions and prices please contact your nearest Infi-neon Technologies Office in Germany or our Infineon Technologies Representatives worldwide (see address list).WarningsDue to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office.Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.For questions on technology, delivery and prices please contact the Infineon Technologies Offices in Germany or the Infineon Technologies Companies and Representatives worldwide: see our webpage at CoolMOST™, CoolSET™ are trademarks of Infineon Technologies AG.CCM-PFCRevision History:2003-05-28DatasheetPrevious Version:v1.0CCM-PFCICE1PCS01Preliminary DataStandalone Power Factor Correction (PFC) Controller in Continuous Conduction Mode (CCM)Product Highlights•Wide Input Range•Output Power Controllable by External Sense Resistor•Programmable Operating Frequency •Output Under-Voltage Detection•Fast Output Dynamic Response during LoadFeatures•Ease of Use with Few External Components •Supports Wide Range •Average Current Control•External Current and Voltage Loop Compensation for Greater User Flexibility•Programmable Operating/Switching Frequency (50kHz - 250kHz)•Max Duty Cycle of 95% (typ) at 125kHz•Trimmed Internal Reference Voltage (5V+2%)•VCC Under-Voltage Lockout•Cycle by Cycle Peak Current Limiting •Over-Voltage Protection •Open Loop Detection•Output Under-Voltage Detection •Brown-Out Protection•Enhanced Dynamic Response•Unique Soft-Start to Limit Start Up Current •Fulfills Class D Requirements of IEC 1000-3-2DescriptionThe ICE1PCS01/G is a 8-pin wide input range controller IC for active power factor correction converters. It is de-signed for converters in boost topology, and requires few external components. Its power supply is recommended to be provided by an external auxiliary supply which will switch on and off the IC.The IC operates in the CCM with average current control, and in DCM only under light load condition. The switching frequency is programmable by the resistor at pin 4. Both compensations for the current and voltage loop are exter-nal to allow full user control.There are various protection features incorporated to en-sure safe system operation conditions. Examples are peak current limitation, brown-out protection and output under voltage detection. The internal reference is trimmed (5V+2%) to ensure precise protection and control level. The device has an unique soft-start function which limits the start up current thus reducing the stress on the boost diode.1Pin Configuration and Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.1Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 1.2Pin Functionality . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52Representative Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.1General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.2Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.3Start-up (Soft-Start) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 3.4System Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.4.1Brown-Out Protection (BOP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.4.2Soft Over Current Control (SOC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.4.3Peak Current Limit (PCL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 3.4.4Open Loop Protection / Input Under Voltage Protect (OLP) . . . . . . . . . . .9 3.4.5Output Under Voltage Detection (OUV) . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.4.6Over-Voltage Protection (OVP) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.5Frequency Setting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6Average Current Control . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6.1Complete Current Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6.2Current Loop Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6.3Pulse Width Modulation (PWM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 3.6.4Nonlinear Gain Block . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.7PWM Logic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.8Voltage Loop . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.8.1Voltage Loop Compensation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 3.8.2Enhanced Dynamic Response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.9Output Gate Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 4Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 4.1Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 4.2Operating Range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .12 4.3Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 4.3.1Supply Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 4.3.2Variable Frequency Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 4.3.3PWM Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .13 4.3.4System Protection Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14 4.3.5Current Loop Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.3.6Voltage Loop Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 4.3.7Driver Section . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 5Outline Dimension . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17Pin Configuration and Functionality1Pin Configuration and Functionality1.1Pin ConfigurationFigure 1Pin Configuration (top view)1.2Pin FunctionalityGND (Ground)The ground potential of the IC.ICOMP (Current Loop Compensation)Low pass filter and compensation of the current control loop. The capacitor which is connected at this pin integrates the output current of OTA2 and averages the current sense signal.ISENSE (Current Sense Input)The ISENSE Pin senses the voltage drop at the external sense resistor (R1). This is the input signal for the average current regulation in the current loop. It is also fed to the peak current limitation block.During power up time, high inrush currents cause high voltage drop at R1, driving currents into pin 3 which could be beyond the absolute maximum ratings. Therefore a series resistor (R2) of around 220Ω is recommended in order to limit this current into the IC.FREQ (Frequency Setting)This pin allows the setting of the operating switching frequency by connecting a resistor to ground. The frequency range is from 50kHz to 250kHz.VSENSE (Voltage Sense/Feedback)The output bus voltage is sensed at this pin via a resistive divider. The reference voltage for this pin is 5V.VCOMP (Voltage Loop Compensation)This pin provides the compensation of the output voltage loop with a compensation network to ground (see Figure 2). This also gives the soft start function which controls an increasing AC input current during start-up.VCC (Power Supply)The VCC pin is the positive supply of the IC and should be connected to an external auxiliary supply. The operating range is between 10V and 21V. The turn-on threshold is at 11.2V and under voltage occurs at 10.2V. There is no internal clamp for a limitation of the power supply.GATEThe GATE pin is the output of the internal driver stage, which has a capability of 1.5A source and sink current.Its gate drive voltage is clamped at 11.5V (typically).Pin Symbol Function 1GND IC Ground2ICOMP Current Loop Compensation 3ISENSE Current Sense Input 4FREQ Switching Frequency Setting 5VCOMPVoltage Loop Compensation6VSENSE V OUT Sense (Feedback) Input7VCC IC Supply Voltage 8GATEGate Drive OutputCCM-PFCPreliminary DataICE1PCS01/GRepresentative Block diagram 2Representative Block diagram ArrayFigure 2Representative Block diagram3.1GeneralThe ICE1PCS01/G is a 8 pin control IC for power factor correction converters. It comes in both DIP and DSO packages and is suitable for wide range line input applications from 85 to 265 VAC. The IC supports converters in boost topology and it operates in continuous conduction mode (CCM) with average current control.The IC operates with a cascaded control; the inner current loop and the outer voltage loop. The inner current loop of the IC controls the sinusoidal profile for the average input current. It uses the dependency of the PWM duty cycle on the line input voltage to determine the corresponding input current. This means the average input current follows the input voltage as long as the device operates in CCM. Under light load condition, depending on the choke inductance, the system may enter into discontinuous conduction mode (DCM). In DCM, the average current waveform will be distorted but the resultant harmonics are still low enough to meet the Class D requirement of IEC 1000-3-2.The outer voltage loop controls the output bus voltage. Depending on the load condition, OTA1 establishes an appropriate voltage at VCOMP pin which controls the amplitude of the average input current.The IC is equipped with various protection features to ensure safe operating condition for both the system and device. Important protection features are namely Brown-out protection, Current Limitation and Output Under-voltage Protection.3.2Power SupplyAn internal under voltage lockout (UVLO) block monitors the VCC power supply. As soon as it exceeds 11.2V and the voltage at pin 6 (VSENSE) is >0.8V, the IC begins operating its gate drive and performs its Soft- Start as shown in Figure 3..Figure 3State of Operation respect to VCC If VCC drops below 10.2V, the IC is off. The IC will then be consuming typically 200µA, whereas consuming 18mA during normal operation.The IC can be turned off and forced into standby mode by pulling down the voltage at pin 6 (VSENSE) to lower than 0.8V. The current consumption is reduced to 3mA in this mode.3.3Start-up (Soft-Start)Figure 4 and 5 show the operation of OTA1 during startup. It sources a constant 10.8µA into the compensation network at pin 5 (VCOMP). The voltage at this pin rises linearly and so does the amplitude of the input current. As soon as the output voltage V OUT reaches 80% of its rated level, the startup procedure is finished and the normal voltage control takes over. In normal operation, the IC operates with a higher maximum current at OTA1 and therefore with a higher voltage loop gain in order to improve the dynamic behavior of the device..Figure 4Soft Start Circuitof audible noise. 3Functional Description3.4System ProtectionThe IC provides several protection features in order to ensure the PFC system in safe operating range. Depending on the input line voltage (V IN) and output bus voltage (V OUT), Figure 6 and 7 show the conditions when these protections are active.Figure 6VRelated Protection FeaturesFigure 7V OUT Related Protection FeaturesThe following sections describe the functionality of these protection features.3.4.1Brown-Out Protection (BOP)Brown-out occurs when the input voltage V IN falls below the minimum input voltage of the design (i.e. 85V for universal input voltage range) and the VCC has not entered into the V CCUVLO level yet. For a system without BOP, the boost converter will increasingly draw a higher current from the mains at a given output power which may exceed the maximum design values of the input current. The ICE1PCS01/G limits internally the current drawn from the mains and therefore also limits the input power. The difference of input and output power will result in decreasing output voltage. If the condition prolongs, the decreasing V OUT will terminate in output under voltage condition (OUV, 50% of rated), and the IC will be shut down (See section 3.4.5). Figure 8 shows the occurrence of BOP in respect to the ISENSE voltage.Figure 8BOP, SOC and PCL Protection as function of V ISENSEThe V IN threshold for BOP to occur is dependent on the voltage at ISENSE and thus the output power. The rated output power with a minimum V IN (V INMIN) isDue to the internal parameter tolerance, the maximum power with V INMIN before BOP occurs isAnd the BOP takes over the normal operation under rated output power latest at an input voltage of3.4.2Soft Over Current Control (SOC)The IC is designed not to support any output power that corresponds to a voltage lower than -0.73V at the ISENSE pin. A further increase in the inductor current, which results in a lower ISENSE voltage, will activate the Soft Over Current Control (SOC). This is a soft control as it does not directly switch off the gate drive like the PCL. It acts on the nonlinear gain block to result in a reduced PWM duty cycle.3.4.3Peak Current Limit (PCL)The IC provides a cycle by cycle peak current limitation (PCL). It is active when the voltage at pin 3 (ISENSE) reaches -1.08V. This voltage is amplified by OP1 by a factor of -1.43 and connected to comparator C2 with a reference voltage of 1.5V as shown in Figure 9. A deglitcher with 300ns after the comparator improves noise immunity to the activation of this protection.V ISENSE-0.6V-0.73V-1.08VNormalOperationSOC PCLP OUT(rated)BOPIC’sState(BOP occurs at V ISENSE = -0.6V Max)P OUT(max)P OUT rated()V INMIN0.6R12⋅---------------------×=P OUT max()V INMIN0.73R12⋅---------------------×=V BOPMAX P OUT rated()R12⋅0.73---------------------×=Figure 9Peak Current Limit (PCL)3.4.4Open Loop Protection / Input UnderVoltage Protect (OLP)Whenever VSENSE voltage falls below 0.8V, or equivalently V OUT falls below 16% of its rated value, it indicates an open loop condition (i.e. VSENSE pin not connected) or an insufficient input voltage V IN for normal operation. In this case, most of the blocks within the IC will be shutdown. It is implemented using comparator C3 with a threshold of 0.8V as shown in the IC block diagram in Figure 2.3.4.5Output Under Voltage Detection (OUV)In the event of main interrupt or brown-out condition, the PFC system is not able to deliver the rated output power. This will cause the output voltage V OUT to drop below its rated value. The IC provides an output under voltage detection that checks if V OUT is falling below 50% of its rated value. Comparator C4 as shown in the device block diagram (Figure 2) senses the voltage at pin 6 (VSENSE) with a reference of 2.5V. If comparator C4 trips, the IC will be shut down as in OLP. The IC will be ready to restart if there is sufficient V IN to pull V OUT out of OLP.3.4.6Over-Voltage Protection (OVP)Whenever V OUT exceeds the rated value by 5%, the over-voltage protection OVP is active as shown in Figure 7. This is implemented by sensing the voltage at pin VSENSE with respect to a reference voltage of 5.25V. A VSENSE voltage higher than 5.25V will immediately reduce the output duty cycle, bypassing the normal voltage loop control. This results in a lower input power to reduce the output voltage V OUT.3.5Frequency SettingThe switching frequency of the PFC converter can be set with an external resistor R5 at FREQ pin. The pin voltage V FREQ is typically 2.5V. The corresponding capacitor for the oscillator is integrated in the device and the R5/frequency relationship is given at the “Electrical Characteristic” section. The recommended operating frequency range is from50kHz to 250kHz. As an example, a R5 of 33kΩ at pin FREQ will set a switching frequency F SW of 133kHz typically.3.6Average Current Control3.6.1Complete Current LoopThe complete system current loop is shown in Figure 10.Figure 10Complete System Current LoopIt consists of the current loop block which averages the voltage at pin ISENSE, resulted from the inductor current flowing across R1. The averaged waveform is compared with an internal ramp in the ramp generator and PWM block. Once the ramp crosses the average waveform, the comparator C1 turns on the driver stage through the PWM logic block. The Nonlinear Gain block defines the amplitude of the inductor current. The following sections describe the functionality of each individual blocks.3.6.2Current Loop CompensationThe compensation of the current loop is done at the ICOMP pin. This is the OTA2 output and a capacitor C3has to be installed at this node to ground (see Figure 10). Under normal mode of operation, this pin gives a voltage which is proportional to the averaged inductor current. This pin is internally shorted to 5V in the eventof IC shuts down when OLP and UVLO occur.3.6.3Pulse Width Modulation (PWM)The IC employs an average current control scheme in continuous conduction mode (CCM) to achieve the power factor correction.Assuming the voltage loop is working and output voltage is kept constant, the off duty cycle D OFF for a CCM PFC system is given as From the above equation, D OFF is proportional to V IN .The objective of the current loop is to regulate the average inductor current such that it is proportional tothe off duty cycle D OFF , and thus to the input voltageV IN . Figure 11 shows the scheme to achieve theobjective.The PWM is performed by the intersection of a ramp signal with the averaged inductor current at pin 5 (ICOMP). The PWM cycle starts with the Gate turn off for a duration of T OFFMIN (250ns typ.) and the ramp is kept discharged. The ramp is then allowed to rise after T OFFMIN expires. The off time of the boost transistor ends at the intersection of the ramp signal and theaveraged current waveform. This results in the proportional relationship between the average current and the off duty cycle D OFF .Figure 12 shows the timing diagrams of T OFFMIN and the PWM waveforms.Figure 12Ramp and PWM waveforms3.6.4Nonlinear Gain BlockThe nonlinear gain block controls the amplitude of the regulated inductor current. The input of this block is thevoltage at pin VCOMP. This block has been designed to support the wide input voltage range (85-265VAC).3.7PWM Logic The PWM logic block prioritizes the control inputsignals and generates the final logic signal to turn onthe driver stage. The speed of the logic gates in thisblock, together with the width of the reset pulse T OFFMIN , are designed to meet a maximum duty cycle D MAX of 95% at the GATE output under 133kHz of operation.In case of high input currents which result in Peak Current Limitation, the GATE will be turned off immediately and maintained in off state for the current PWM cycle. The signal Toffmin resets (highest priority, overriding other input signals) both the current limit latch and the PWM on latch as illustrated in Figure 13.Figure 13PWM Logic 3.8Voltage LoopThe voltage loop is the outer loop of the cascadedcontrol scheme which controls the PFC output busvoltage V OUT . This loop is closed by the feedbacksensing voltage at VSENSE which is a resistive divider tapping from V OUT . The pin VSENSE is the input ofOTA1 which has an internal reference of 5V. Figure 14shows the important blocks of this voltage loop.3.8.1Voltage Loop CompensationThe compensation of the voltage loop is installed at the VCOMP pin (see Figure 14). This is the output of OTA1 and the compensation must be connected at this pin to ground. The compensation is also responsible for the soft start function which controls an increasing AC input current during start-up.D OFF V INVOUT-------------=T OFFMIN 250nsV CREF (1)V RAMP PWMramp releasedPWM cycle (1)V CREF is a function of V ICOMPtFunctional DescriptionFigure 14Voltage Loop3.8.2Enhanced Dynamic ResponseDue to the low frequency bandwidth of the voltage loop, the dynamic response is slow and in the range of about several 10ms. This may cause additional stress to the bus capacitor and the switching transistor of the PFC in the event of heavy load changes.The IC provides therefore a “window detector” for the feedback voltage V VSENSE at pin 6 (VSENSE). Whenever V VSENSE exceeds the reference value (5V) by +5%, it will act on the nonlinear gain block which in turn affect the gate drive duty cycle directly. This change in duty cycle is bypassing the slow changing VCOMP voltage, thus results in a fast dynamic response of V OUT.3.9Output Gate DriverThe output gate driver is a fast totem pole gate drive. It has an in-built cross conduction currents protection and a Zener diode Z1 (see Figure 15) to protect the external transistor switch against undesirable over voltages. The maximum voltage at pin 8 (GATE) is typically clamped at 11.5V.Figure 15Gate DriverThe output is active HIGH and at VCC voltages below the under voltage lockout threshold V CCUVLO, the gate drive is internally pull low to maintain the off state.4Electrical Characteristics4.1Absolute Maximum RatingsNote:Absolute maximum ratings are defined as ratings, which when being exceeded may lead to destruction of the integrated circuit.4.2Operating RangeNote:Within the operating range the IC operates as described in the functional description.Parameter Symbol Limit Values Unit Remarksmin.max.V CC Supply Voltage V CC -0.322V FREQ Voltage V FREQ -0.37V ICOMP Voltage V ICOMP -0.37V ISENSE Voltage V ISENSE -247V ISENSE Current I ISENSE -11mA Recommended R2=220ΩVSENSE Voltage V VSENSE -0.37V VSENSE Current I VSENSE -11mA R3>400k ΩVCOMP Voltage V VCOMP -0.37V GATE Voltage V GATE -0.322V Clamped at 11.5V if driven internally.Junction Temperature T j -40150°C Storage Temperature T S-55150°C Thermal ResistanceJunction-Ambient for DSO-8-3R thJA (DSO)-185K/W P-DSO-8-3Thermal ResistanceJunction-Ambient for DIP-8-4R thJA (DIP)-90K/W P-DIP-8-4ESD ProtectionV ESD-2kVHuman Body Model 1)1)According to EIA/JESD22-A114-B (discharging a 100pF capacitor through a 1.5k Ω series resistor)Parameter Symbol Limit Values Unit Remarksmin.max.V CC Supply Voltage V CC V CCUVLO 21V Junction TemperatureT JCon-40125°C4.3Characteristics4.3.1Supply SectionNote:The electrical characteristics involve the spread of values within the specified supply voltage and junction temperature range T J from – 40 °C to 125°C.Typical values represent the median values, which are related to 25°C. If not otherwise stated, a supply voltage of V CC =15V is assumed for test condition .4.3.2Variable Frequency SectionParameter SymbolLimit ValuesUnit Test Conditionmin.typ.max.VCC Turn-On Threshold V CCon 10.511.211.9V VCC Turn-Off Threshold/Under Voltage Lock Out V CCUVLO 9.410.210.8V VCC Turn-On/Off Hysteresis V CChy 0.81 1.3V Start Up Current Before V CConI CCstart 50100200µA V VCC =V VCCon -0.1V Operating Current with active GATE I CCHG 13.51822.5mA R5 = 33k ΩC L = 4.7nF Operating Current during StandbyI CCStdby2.02.63.2mAR5 = 33k ΩV VSENSE = 0.5VParameter SymbolLimit ValuesUnit Test Conditionmin.typ.max.Switching Frequency (Typical)F SWnom 106133161kHz R5 = 33k ΩSwitching Frequency (Min.)F SWmin 405670kHz R5 = 82k ΩSwitching Frequency (Max.)F SWmax 200250320kHz R5 = 15k ΩVoltage at FREQ pinV FREQ2.402.502.60V4.3.3PWM Section4.3.4System Protection SectionParameter SymbolLimit ValuesUnit Test Conditionmin.typ.max.Max. Duty Cycle D MAX 929598%F SW = F SWnom (R5 = 33k Ω)Min. Duty Cycle D MIN 0%V VCOMP = 0V, V VSENSE = 5V V ICOMP = 6.4VMin. Off TimeT OFFMIN150250350nsV VCOMP = 5V, V VSENSE = 5V V ISENSE = 0.1VParameter SymbolLimit ValuesUnit Test Conditionmin.typ.max.Open Loop Protection (OLP)VSENSE ThresholdV OLP 0.770.810.86V Peak Current Limitation (PCL)ISENSE ThresholdV PCL -1.15-1.08-1.00V Soft Over Current Control (SOC)ISENSE ThresholdV SOC -0.79-0.73-0.66V Output Under Voltage Detection (OUV)VSENSE ThresholdV OUV 2.45 2.55 2.65V Output Over-Voltage Protection (OVP)V OVP5.125.255.38V4.3.5Current Loop Section4.3.6Voltage Loop SectionParameter SymbolLimit ValuesUnit Test Conditionmin.typ.max.OTA2 Transconductance Gain Gm OTA20.91.1 1.3mS At Temp = 25°C OTA2 Output Linear Range I OTA2+/- 50µA Guaranteed by design ICOMP Voltage during OLPV ICOMPF3.64.0VV VSENSE = 0.5VParameter SymbolLimit ValuesUnit Test Conditionmin.typ.max.OTA1 Reference Voltage V OTA1 4.90 5.00 5.10V OTA1 Transconductance Gain Gm OTA131.54252.5µS OTA1 Max. Source Current Under Normal Operation I OTA1SO 213038µA V VSENSE = 4.25V V VCOMP = 4V OTA1 Max. Sink Current Under Normal Operation I OTA1SK 213038µA V VSENSE = 6V V VCOMP = 4VSoft Start End V SOFT 3.80 4.00 4.20V OTA1 Source Current Under Soft StartI OTA1SS8.010.813.4µAV VSENSE = 2V V VCOMP = 0V Enhanced Dynamic Response VSENSE High Threshold VSENSE Low ThresholdV Hi V Lo 5.124.63 5.254.75 5.384.87V V VSENSE Input Bias Current at 5V I VSEN5V 0 1.5µA V VSENSE = 5V VSENSE Input Bias Current at 1V I VSEN1V 01µA V VSENSE = 1V VCOMP Voltage during OLPV VCOMPF0.20.4VV VSENSE = 0.5V I VCOMP = 0.5mA。

NuMicro M460系列产品简介说明书

NuMicro M460系列产品简介说明书

NuMicro® FamilyArm® Cortex®-M4-based MicrocontrollerM460 SeriesProduct BriefM460 SERIES PRODUCT BRIEFThe information described in this document is the exclusive intellectual property ofNuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton.Nuvoton is providing this document only for reference purposes of NuMicro microcontroller andmicroprocessor based system design. Nuvoton assumes no responsibility for errors or omissions.All data and specifications are subject to change without notice.For additional information or questions, please contact: Nuvoton Technology Corporation.1 GENERAL DESCRIPTIONThe NuMicro M460 series is a 32-bit microcontroller based on Arm Cortex-M4F core, with DSP instruction set and single-precision floating-point unit (FPU), targeted for IoT, Industrial, and consumer applications. The M460 series runs up to 200 MHz, and features 1.7 V to 3.6 V wide operating voltage, -40 °C to 85 °C /105°C wide operating temperature, a variety of packages choice, and excellent high immunity characteristics by ESD HBM 2 KV and EFT 4.4 KV.As the new smart function added on home appliances, the M460 series provides up to 1024 KB dual-bank of Flash memory for code storage and 512 KB SRAM for run time operation. The dual bank design of 1024 KB Flash memory supports the Firmware update through the Over-The-Air (FOTA) process. Additionally, in response to the code security requirements, the M460 series supports Execute-Only Memory (XOM) function to protect confidential program code information from stealing in the run-time. In order to reduce the data access overhead of CPU core to peripherals, up to 2 sets of peripheral direct memory access (PDMA) is provided.The M460 series supports plenty of peripherals, including Ethernet 10/100 MAC, hardware crypto engine, key store, true random number generator (TRNG), programmable audio PLL, HyperBus interface, 4 sets of CAN FD, USB HS OTG, USB FS OTG, up to 24 channels of 16-bit PWM, 10 sets of UART, 4 sets of SPI/I2S, 2 set of Quad-SPI, 5 sets of I²C, 1 set of USCI, 1 set of PSIO, 4 sets of EQEI and a real-time clock (RTC). The M460 series also provides rich analog peripherals including 4 sets of analog comparators, up to 28 channels of 12-bit SAR ADC, and 2 channel of 12-bit DAC.For the development, Nuvoton provides the NuMaker-M467HJ, NuMaker-M463KG evaluation board, and Nuvoton Nu-Link debugger. The 3rd Party IDE such as Keil MDK, IAR EWARM, Eclippse IDE with GNU GCC compilers are also supported.Product Line Core(MHz)EthernetCrypto+ TRNGCAN FDUSBOTGHBI EBI UART I2CQSPI/SPIPWM ADC DAC ACMP EQEIM467xJHAx Series200 √√ 4 HS x1FS x1√√10+3 5SPI x4QSPI x224 28 2 4 4M463xGCAx Series 200 - √ 2 HS x1 - √8+1 5SPI x4QSPI x224 16 - 2 2Table 1-1 NuMicro M460 Series Key Features Support Table The NuMicro M460 series supports six package choices.●QFN48 w/ EPAD: 5 mm x 5 mm, Load pitch: 0.35 mm●LQFP48: Body Size 7 mm x 7 mm, Load Pitch 0.5 mm●LQFP64: Body Size 7 mm x 7 mm, Load Pitch 0.4 mm●LQFP128: Body Size 14 mm x 14 mm, Load Pitch 0.4 mm●LQFP144: Body Size 20 mm x 20 mm, Load Pitch 0.5 mm●LQFP176: Body Size 24 mm x 24 mm, Load Pitch 0.5 mmThe NuMicro M460 series is suitable for a wide range of applications such as:●IoT Gateway●Industrial Control●Telecom●Data CenterM460 SERIES PRODUCT BRIEF2 FEATURES2.1 M467xJHAx Series●Operating Characteristics–Voltage range: 1.7 V to 3.6 V–Temperature range: -40 °C to +85 °C–EFT 4.4 KV–ESD HBM 2 KV●Core–Up to 200 MHz ARM Cortex-M4F–DSP instruction set–Single-precision floating point instructions (FPU) –Memory Protection Unit (MPU) with eightmemory regions●Memories–Up to 1024 KB Flash memory with dual bank structure supporting Firmware Over-The-Air(FOTA)–Flash memory supporting up to four regions of eXecute-Only-Memory (XOM)–8 KB user-defined loader (LDROM)– 3 KB One-Time-Programmable ROM–Up to 512 KB SRAM including hardware parity check 64 KB–16 KB Cache for XIP in external QSPI Flash●External Memory Interface–External bus interface (EBI), i80 mode–HyperBus interface (HBI), up to 90 MHz●Clock– 4 to 24 MHz crystal oscillator–32.768 kHz crystal oscillator for RTC–Internal 48 MHz RC oscillator–Internal 10 kHz RC oscillator–Internal PLL up to 200 MHz–Programmable Audio PLL (APLL)●Power Management–Active: 175 μA/MHz at 25°C/3.3V (peripheral off)–Low leakage power-down (LLPD): 340 μA–Standby power-down (SPD) w/o RAM retention:1.2 μA–Deep power-down (DPD): 0.2 μA (RTC off)–RTC with VBAT supply: 1 μA–Supports wake up from Normal Power-down mode by: RTC, WDT, I²C, Timer, UART, GPIO,EINT, ACMP, SDH, USB FS, USB HS, EMAC,and BOD●Timer & PWM–Four 32-bit timers–Up to 12 Enhanced PWM with twelve 16-bit counters–Up to 12 Basic PWM with two 16-bit counters–One 24-bit count-down SysTick timer–One watchdog timer–One window watchdog timer ●Peripheral Direct Memory Access (PDMA)– 2 set of PDMA, each with 16 channels–Channel can be operated by software trigger,UART, SPI, EPWM, TIMER, ADC, DAC, ACMPand I2C●Analog Peripheral– 3 set of 12-bit, up to 28-ch, 5 MSPS SAR ADC– 2 set of 12-bit, 1 MSPS DAC– 4 sets of analog comparators–Built-in internal reference voltage●Communication Interface–Up to 10 sets of UART interfaces with IrDA(Support LIN in UART0 and UART1)–Up to 3 set of ISO-7816-3 interfaces, whichsupport full duplex UART mode–Up to 5 sets of I2C interfaces with SMBus/PMBus(Up to 3.4 Mbps)–Up to 4 sets of SPI/I2S interfaces (SPI up to 100MHz in Master mode)–Up to 2 set of Quad-SPI interface (Up to 100MHz in Master mode)– 2 set of I2S interface– 4 set of CAN FD interfaces– 2 set of Secure Digital Host Controllers (Up to 50MHz)– 1 set of SPI Flash interface supports quad modeand eXecute-In-Place–Up to 1 set of USCI interfaces–Up to 1 set of PSIO interfaces–Support 6x8 KPI–Up to 4 set of enhanced quadrature encoderinterfaces (EQEI)–Up to 4 set of 24-bit, 3-ch enhanced inputcapture timer/counter units●Camera Capture Interface●Advanced Connectivity–USB 2.0 high speed device/host/OTG controllerwith on-chip PHY–USB 2.0 full speed device/host/OTG controllerwith on-chip PHY–10/100 Ethernet MAC with RMII (IEEE1588v2)●Cryptography Accelerator–ECC-571–AES-256–SHA-512–HMAC-512–RSA-4096–SM2●Pseudo Random Number Generator (PRNG)●True Random Number Generator (TRNG)●Key Store●Secure Boot●Voltage Adjustable Interface (VAI)M460 SERIES PRODUCT BRIEF●Cyclic Redundancy Calculation (CRC)●Real Time Clock (RTC) with Vbat●Up to 146 I/O pins with interrupt capability ●IEC60730-1 Class B–Supports certified IEC60730-1 Class B Software Test Library (STL)●Development Platform Support–Arm Keil RVMDK and IAR EWARM IDE–Free GNU compiler with Eclipse IDE support–ICP (In Circuit Programmer) support for updating internal code via Nu-Link debugger–ISP (In System Programmer) support forupdating code through UART, SPI, I2C, RS-485peripheral interfaces–Pin Viewer for real time monitoring the status of all I/O pins–PinConfigure tool for pin assignment, initial code generation and OrCAD/Protel part generation●96-bit Unique ID (UID)●128-bit Unique Customer ID (UCID)●Package–Package is Halogen-free, RoHS-compliant and TSCA-compliant.Pin Count 176 144 12864Type LQFP LQFP LQFP LQFPI/O Pin 146 114 100 44Lead Pitch(mm)0.5 0.5 0.4 0.4Dimensions(mm) 24x24x1.420x20x1.414x14x1.47x7x1.4M460 SERIES PRODUCT BRIEF2.2 M463xGCAx Series●Operating Characteristics–Voltage range: 1.7 V to 3.6 V–Temperature range: -40 °C to +105 °C–EFT 4.4 KV–ESD HBM 2 KV●Core–Up to 200 MHz ARM Cortex-M4F–DSP instruction set–Single-precision floating point instructions (FPU) –Memory Protection Unit (MPU) with eightmemory regions●Memories–Up to 256 KB Flash memory–Flash memory supporting up to four regions of eXecute-Only-Memory (XOM).–8 KB user-defined loader (LDROM)–Up to 128 KB SRAM including hardware parity check 64 KB●External Memory Interface–External bus interface (EBI), i80 mode●Clock– 4 to 24 MHz crystal oscillator–32.768 kHz crystal oscillator for RTC–Internal 48 MHz RC oscillator–Internal 10 kHz RC oscillator–Internal PLL up to 200 MHz●Power Management–Active: 135 μA/MHz at 25°C/3.3V (peripheral off)–Low leakage power-down (LLPD): 80 μA–Standby power-down (SPD) w/o RAM retention:0.9 μA–Deep power-down (DPD): 0.15 μA (RTC off)–RTC with VBAT supply: 0.5 μA–Supports wake up from Normal Power-down mode by: RTC, WDT, I²C, Timer, UART, GPIO,EINT, ACMP, SDH, USB HS, and BOD●Timer & PWM–Four 32-bit timers–Up to 12 Enhanced PWM with twelve 16-bit counters–Up to 12 Basic PWM with two 16-bit counters–One 24-bit count-down SysTick timer–One watchdog timer–One window watchdog timer●Peripheral Direct Memory Access (PDMA)– 1 set of PDMA with 16 channels–Channel can be operated by software trigger, UART, SPI, EPWM, TIMER, ADC, DAC, ACMPand I2C●Analog Peripheral– 1 set of 12-bit, up to 16-ch, 5 MSPS SAR ADC – 2 sets of analog comparators–Built-in internal reference voltage●Communication Interface–Up to 8 sets of UART interfaces with LIN andIrDA–Up to 1 set of ISO-7816-3 interfaces, whichsupport full duplex UART mode–Up to 5 sets of I2C interfaces with SMBus/PMBus(Up to 3.4 Mbps)–Up to 4 sets of SPI/I2S interfaces (SPI up to 100MHz in Master mode)–Up to 2 set of Quad-SPI interface (Up to 100MHz in Master mode)– 2 set of CAN FD interfaces–Up to 1 set of Secure Digital Host Controllers (upto 50 MHz)–Up to 1 set of USCI interfaces–Up to 1 set of PSIO interfaces–Support 6x8 KPI–Up to 2 set of enhanced quadrature encoderinterfaces (EQEI)–Up to 2 set of 24-bit, 3-ch enhanced inputcapture timer/counter units●Advanced Connectivity–USB 2.0 high speed device/host/OTG controllerwith on-chip PHY●Cryptography Accelerator–AES-256●Pseudo Random Number Generator (PRNG)●True Random Number Generator (TRNG)●Key Store●Secure Boot●Voltage Adjustable Interface (VAI)●Cyclic Redundancy Calculation (CRC)●Real Time Clock (RTC) with Vbat●Up to 119 I/O pins with interrupt capability●IEC60730-1 Class B–Supports certified IEC60730-1 Class B SoftwareTest Library (STL)●Development Platform Support–Arm Keil RVMDK and IAR EWARM IDE–Free GNU compiler with Eclipse IDE support–ICP (In Circuit Programmer) support for updatinginternal code via Nu-Link debugger–ISP (In System Programmer) support forupdating code through UART, SPI, I2C, CAN-FD,USB HS peripheral interfaces–Pin Viewer for real time monitoring the status ofall I/O pins–PinConfigure tool for pin assignment, initial codegeneration and OrCAD/Protel part generation●96-bit Unique ID (UID)M460 SERIES PRODUCT BRIEF●128-bit Unique Customer ID (UCID)●Package–Package is Halogen-free, RoHS-compliant and TSCA-compliant.Pin Count 128 64 4848Type LQFP LQFP LQFP QFNI/O Pin 100 44 33 33Lead Pitch(mm)0.4 0.4 0.5 0.35Dimensions(mm) 14x14x1.47x7x1.47x7x1.45x5X0.8M460 SERIES PRODUCT BRIEF3 BLOCK DIAGRAM3.1M460 Series Block DiagramM460 SERIES PRODUCT BRIEF4 PARTS INFORMATION 4.1 Package Type4.1.1 M460 SeriesPart No.QFN48(5x5mm)LQFP48(7x7mm)LQFP64(7x7mm)LQFP128(14x14mm)LQFP144(20x20mm)LQFP176(24x24mm)M463 M463YGCAE M463LGCAE M463SGCAE M463KGCAEM467 M467SJHAN M467KJHAN M467JJHAN M467HJHANM460 SERIES PRODUCT BRIEFM460 SERIES PRODUCT BRIEF4.2NuMicro M460 Series Selection Guide4.2.1M463xGCAE SeriesPART NUMBERM463KGCAESGCAELGCAEYGCAESystem Frequency (MHz)200 Flash (KB) 256 SRAM (KB) 128 LDROM (KB) 8 XOM (regions)4 PDMA16-chI/O100443333RTC (V BAT ) √ 32-bit Timer 4 16-bit EPWM 12 16-bit BPWM12 C o n n e c t i v i t yUART 8 QSPI 2 SPI/I 2S4 I 2C5 CAN-FD 2 PSIO 1USCI 1 SD Host 1 ISO-7816-31 USB High Speed OTG with PHY√ LCD Parallel Data Bus (External Bus Interface)√ EQEI 2 ECAP 2 KPI6x812-bit ADC161612 12Analog Comparator2 Crypto AES-256TRNG√ Operating Temperature-40°C ~ 105°CPackageLQFP 128(14x14mm)LQFP 64 (7x7mm)LQFP 48 (7x7mm)QFN 48 (5x5mm)M460 SERIES PRODUCT BRIEF4.2.2M467xJHAN SeriesPART NUMBERM467HJHANJJHANKJHAN SJHANSystem Frequency (MHz)200 Flash (KB) 1024 SRAM (KB) 512 LDROM (KB) 8 XOM (regions)4PDMA2 set, each with 16-ch I/O14611410044RTC (V BAT ) √ 32-bit Timer 4 16-bit EPWM 12 16-bit BPWM12C o n n e c t i v i t yUART 109QSPI 2 SPI/I 2S 4 SPI Master1 I 2S2 I 2C 5 CAN-FD 4 PSIO 1 USCI 1 SD Host 2 ISO-7816-33 USB High Speed OTG with PHY √ USB Full Speed OTG with PHY√ LCD Parallel Data Bus (External Bus Interface)√HyperBus Interface√-EQEI 4 ECAP 4 KPI6x812-bit ADC 282012-bit DAC2 Analog Comparator4Crypto AES-256, ECC-571, SHA-512, HMAC-512, RSA-4096, SM2TRNG √Ethernet 10/100 Mac √Camera Capture Interface √Operating Temperature -40°C ~ 85°CPackage LQFP 176(24x24mm)LQFP 144(20x20mm)LQFP 128(14x14mm)LQFP 64(7x7mm)M460 SERIES PRODUCT BRIEF4.3 NuMicro M460 Naming RuleM4 60 H J H A E Core Series Package Flash Size SRAM Size Revision TemperatureCortex-M4F63: CAN FD/USB HS67: Ethernet/Crypto Y: QFN48(5x5 mm)L: LQFP48(7x7 mm)S: LQFP64(7x7 mm)K: LQFP128(14x14 mm)J: LQFP144(20x20 mm)H: LQFP176(24x24 mm)J: 1024 KBG: 256 KBH: 512 KBC: 128 KBA E:-40°C ~ 105°CN:-40°C ~ 85°CM460 SERIES PRODUCT BRIEF5 DEVELOPMENT PLATFORM5.1 Programmer and DebuggerNu-Link Basic full speed USB2.0 hardware debugger/programmerNu-Link-Pro Advanced hardware debugger/programmer with programming counterNu-Link 2.0 Advanced high speed USB2.0 hardware debugger/programmer with multi-functionsNu-Link-Gang Off-line hardware programmer supporting up to four chips programming for mass-production ISP In System Programmer, a software programming tool supporting UART/USBICP In Chip Programmer, a software programming tool supporting Nu-Link programmer5.2 Development EnvironmentProgramming IDE Keil MDK, IAR, NuEclipse (GCC)Software Package Board Support Package (BSP), Sample CodeDevelopment IDE NuTool PinView, NuTool PinConfig, NuConsole5.3 Development BoardEVB NuMaker Part Number FeatureNK-M467HJ M467SJHAN, M467KJHAN, M467JJHAN,M467HJHAN Support Ethernet, CAN-FD, Crypto, USB HS, EBI, Expand Connector, and Arduino Uno InterfaceNK-M463GC M463KGCAE, M463SGCAE, M463LGCAE,M463YGCAE Support USB HS, EBI, ExpandConnector, and Arduino Uno InterfaceM460 SERIES PRODUCT BRIEF6 REVISION HISTORYDate Revision Description2022.07.05 1.00 Initial version M460 SERIES PRODUCT BRIEFM460 SERIES PRODUCT BRIEFImportant NoticeNuvoton Products are neither intended nor warranted for usage in systems or equipment, any malfunction or failure of which may cause loss of human life, bodily injury or severe propertydamage. Such applications are deemed, “Insecure Usage”.Insecure usage includes, but is not limited to: equipment for surgical implementation, atomic energycontrol instruments, airplane or spaceship instruments, the control or operation of dynamic, brakeor safety systems designed for vehicular use, traffic signal instruments, all types of safety devices,and other applications intended to support or sustain life.All Insecure Usage shall be made at customer’s risk, and in the event that third parties lay claims toNuvoton as a result of customer’s Insecure Usage, customer shall i ndemnify the damages andliabilities thus incurred by Nuvoton.。

Allegro ATS645LSH 说明书

Allegro ATS645LSH 说明书

PRELIMINARY DATASHEET (subject to change without notice)True Zero Speed Miniature Gear Tooth SensorPin 1: SupplyPin 2: No connection Pin 3: Test pinPin 4: GroundThe ATS645LSH is an optimized Hall effect sensing integrated circuit and magnet combination that provides a user-friendly solution for true zero-speed digital gear-tooth sensing in two-wire applications. The sensor consists of a single-shot molded plastic package that includes a samarium cobalt magnet, a pole piece, and a Hall effect IC that has been optimized to the magnetic circuit. This small package can be easily assembled and used in conjunction with a wide variety of gear shapes and sizes.The integrated circuit incorporates a dual element Hall effect sensor and signal processing that switches in response to differential magnetic signals created by ferrous gear teeth. The circuitry contains a sophisticated digital circuit to eliminate magnet and system offsets and to achieve true zero speed operation (ref U.S. Patent 5,917,320). A-D and D-A converters are used to adjust the device gain at power up and to allow air gap independent switching.The regulated current output is configured for two wire applications and the sensor is ideally suited for obtaining speed and duty cycle in ABS and transmission application gear-tooth-based configurations.ABSOLUTE MAXIMUM RATINGS Supply Voltage,V CC . . . . . . . . . . . . . . . . . . . . . . . . . 26.5 V* Reverse Supply Voltage,V R . . . . . . . . . . . . . . . . . . . . . . . . . . . . –18 V Operating Temperature Range,T A . . . . . . . . . . . . . . . . . –40 °C to 150 °C* Storage Temperature,T S . . . . . . . . . . . . . . . . . . . . . . . . . . . 170 °C Package Power Rating,ϑJA . . . . . . . . . . . . . . . . . . . . . . . . 126 °C/W Maximum Junction Temperature,T Jmax . . . . . . . . . . . . . . . . . . . . . 165 °C * Operation at increased supply voltages with external circuitry is described in the Applications Information.FEATURESs Fully optimized differential digital gear tooth sensor s Single chip sensing IC for high reliabilitys Internal current regulator for 2 wire operations Small mechanical size (8 mm dia x 5.5 mm length) s Air gap independent switch pointss Digital output representing gear profiles Precise duty cycle signal with temperatures Large operating air gapss Automatic Gain Control (AGC)s Automatic Offset Adjustment circuits True zero speed operations Under-voltage lockouts Wide operating voltage ranges Defined power-on state查询ATS645LSH供应商CHARACTERISTICSValid over operating temperature range and Supply Voltage within specification unless otherwise noted.LimitsCharacteristicsSymbolTest ConditionsMin.Typ.Max.UnitsELECTRICAL CHARACTERISTICS Supply Voltage V CC Operating, T J < 165°C4.0 24 V Under Voltage LockoutV CC(UV) V CC 0 → 5 V - - <Vcc MinV 1Supply Zener Clamp VoltageV Z I ZT = 1 mA 28 32 - V Max Zener Pulse Current I Z t=20mS Pulse Mode- - 50 mA Supply Zener Resistance R Z- 50 - Ω Low Current State: Icc Low 4.0 6 8.0 mA Supply Current ATS645LSH – I1 I CCHigh Current State: Icc High 12.0 14.0 16.0 mA Low Current State: Icc Low 5.9 7 8.4 mA Supply Current ATS645LSH – I2I CCHigh Current State: Icc High11.814.016.8mAPOWER-ON STATE CHARACTERISTICS Power-On StateS PO V CC 0 → 5 V - Icc High - - 2Power-On Timet onGear speed < 100 rpm-12msOUTPUT STAGE Output Current Slew RateI RIcc High à Icc Low , Icc Low à Icc High , R S = 100 Ω, C S = 10 pF, 10 to 90%10mA/µs1The zener is tested using a pulse method and is designed for transient protection, continuous operation may destroy the device. 2Power On Time is the time required to complete internal offset adjust. It does not include automatic gain control, which requires three tooth valley transitions to complete and is therefore RPM dependent.Operating Characteristics: Valid with Reference Target unless otherwise specifiedLimits Characteristics Symbol Test ConditionsMin. Typ. Max. Units SWITCH POINT CHARACTERISTICSRotation Speed S max Using Reference Target over OperatingAir Gap Range0 8K RPMAnalog Signal Bandwidth f-3db -3dB Point 20 40 KHz1Operate Point Bop Icc Highà Icc LowPositive Peak referenced, AG < AG max- 100 150mV1Release Point Brp Icc Lowà Icc HighNegative Peak referenced, AG < AG max- 100 150 mV CalibrationInitial Calibration C I Number of Rising Mechanical Edges forAccurate Edge Detection3 EdgesDAC CharacteristicsAllowable User Induced Differential Offset Output switching only; may not meetdata sheet specifications -60 60 GSWITCH POINT DETAIL1 Bop and Brp should be adjustable with metal mask changes, limits max air gap but improves vibration immunity.Operating Characteristics:Valid only if magnetic offset is within the Dynamic Offset Compensation DAC Range as specified aboveLimits Characteristics Symbol Test ConditionsMin. Typ. Max. Units OPERATING CHARACTERISTICS: Using Reference Target and Valid Over Operating Temperature Range1Operational Air Gap Range OpAGDuty cycle within specification 0.5 2.75 mmSwitching Air Gap Range Op MaxAG Output Switching: Duty cycle Not inSpecification3 - - mmDuty Cycle Variation DC Wobble < 0.5mmTypical value at 1.5mm air gapValid over operating air gap range37 53 57 %2Operating Signal Range Sig Duty cycle within SpecificationWobble < 0.5mm30 - 1000 G3Minimum Operating Signal SigMin Output Switching: Duty Cycle Not inSpecification20 - - G1 Operating air gap is dependent on the available magnetic field. The available field is target geometry and materiel dependent and should be independently characterized. The field available from the reference target is given in the reference gear parameter section of the datasheet2 In order to remain in specification the magnetic signal must be larger than the minimum value specified, this includes the effect of target wobble.3 Duty cycle is not guaranteed to be in specification. Reference the Duty Cycle vs. Air Gap Over Temperature graph in the typical operating characteristics section of this document.Reference Gear ParametersREFERENCE GEAR DIMENSIONS (60-0)Diameter G d - 120 - mm Thickness G t- 6 - mm Tooth Width T w- 3 - mm Valley Width V w - 3 - mm Valley Depth V d- 3 - mm Materiel Low Carbon SteelTypical Operating Characteristics: Duty Cycle vs. Air Gap Over TemperatureFigure #2: Sensor Orientation and Direction of Rotation of Reference Target for Duty CycleSENSOR DESCRIPTIONAssembly Description:The ATS645LSH true zero speed gear tooth sensor is a Hall IC/magnet configuration that is fully optimized to provide digital detection of gear tooth edges. This sensor is integrally molded into a plastic body that has been optimized for size, ease of assembly, and manufacturability. High operating temperature materials are used in all aspects of construction. Sensing Technology:The gear tooth sensor sub-assembly contains a single-chip differential Hall effect sensor IC, a Samarium Cobalt magnet, and a flat ferrous pole piece. The Hall IC consists of 2 Hall elements spaced 1.5 mm apart that measure the magnetic gradient created by the passing of a ferrous object. The two elements measure the magnetic gradient and convert it to an analog voltage that is then processed to provide a digital output signal.Transient Performance per ISO 7637-1at T A = 23 ±5°C(Tested at Allegro test facility – for engineering reference only)Performance Class at Test LevelPulse No. Test I II III IV1 Inductive turn off (negative) - - - C2 Inductive turn off (positive) - - - A3a Capacitive/inductive coupling (neg) - - -A3b Capacitive/inductive coupling (pos) - - - A4 Reverse battery - - - A5 Load dumb A C C E6 Ignition coil disconnect - - C E7 Field decay (negative) - - - C U A = 13.5V for pulses 1, 2, 3a, 3b, 5, 6, 7 and 12V for pulse 4.Test Circuit #1Transient & EMC test circuitPower supply voltage transients, or device output short circuits, may be caused by faulty connectors, crimped wiring harnesses, or service errors. The prevent catastrophic failure, internal protection against over-voltage, reverse voltage, and output overloads have been incorporated to meet the automotive 12 volt system protection requirements of ISO DP7637/1. A series-blocking diode or current-limiting resistor is required in order to survive pulse number six.Performance Class Definitions(for transient performance and EMC performance)A – All functions of a device perform as designed during and after the exposure.B – All functions of a device perform as designed during exposure; however, one or more of them may go beyond the specified limit tolerance. All functions return automatically to within normal limits after exposure is removed. Memory must remain Class A.C – One or more functions of the device do not perform as designed during exposure but return automatically to normal operation after exposure is removed.D – One or more functions of the device do not perform as designed during exposure and do not return to normal operation until exposure is removed and the device is reset by simple “ operator” action.E – One or more functions of the device do not perform as designed during and after the exposure and cannot be returned to proper operation without repairing or replacing the device.ELECTROMAGNETIC COMPATIBILITY (EMC) PERFORMANCEat T A = 23 ±5°C(Tested at Allegro test facility – for engineering reference only)TEM Cell Performance per ISO 11452-3Test severity levelI = 50 V/m II = 100 V/m III = 150 V/m IV = 200 V/m BCI per ISO 11452-4Test severity levelI = 25 mA II = 50 mA III = 75 mA IV = 100 mATest severity level I = 100 mW II = 200 mW III = 300 mW IV = 400 mW V = 500 mWPerformance Class at Test LevelFrequency Band(MHz)I II IIIIVF1 (0.01 to 10) –– – A F2 (0 to 30) – – – A F3 (30 to 80) – ––A F4 (80 to 200)–ABBPerformance Class at Test LevelFrequency Band(MHz) III IIIIVF1 (1 to 10) – – – A F2 (10 to 30) – – – A F3 (30 to 80) – – – A F4 (80 to 200) – – – A F5 (200 to 400)– – –AMECHANICAL INFORMATIONComponent Material Function Value Sensor PackageMaterialThermoset Epoxy Max. Temperature 170°C1 Leads Copper, 0.016” dia, 0.050” spacingLead Coating Solder, Tin / Lead 90/1021 Temperature excursions of up to 225°C for2 minutes or less are permitted.2 Industry accepted soldering techniques are acceptable for this sub-assembly as long as the indicated maximumtemperatures for each component are not exceeded.DEVICE QUALIFICATION PROGRAMTest Name Test Conditions Test Length # of Lots Sample / lot CommentsHigh Temperature Operating Life AEC-Q100 #2 (JA108)Ta = 150°C, Tj = 165°C408 hrs 1 77High Temperature Bake AEC-Q100 #3 (JA103)Ta = 170°C1000 hrs 1 77Temperature Humidity Bias AEC-Q100 #5 (JA101)85°C/85%RH1008 hrs 1 77Autoclave AEC-Q100 #6 (JA102) 96 hrs 1 77Temperature Cycling AEC-Q100 #7(JA104) 500 cycles 1 77 -65°C to +160°C, 30 sec. transition, 30 minute dwellESD AEC-Q100 #20 (AEC-Q100-002, AEC-Q100-003)- 1 3/model/stepPasses ±6kV all pincombinations: HumanBody ModelEarly Life Failure Rate AEC-Q100 #25 (AEC-Q100-008)150°C/24 hrs 1 800Functional block diagramVcc/OutputV NegTest PinTypical Application CircuitSENSOR PACKAGELSH PACKAGE REFERENCE DIMENSIONS ONLY。

英飞凌 FP10R12W1T7_B11 EasyPIM 模块 数据表

英飞凌 FP10R12W1T7_B11 EasyPIM 模块 数据表

Preliminary datasheetEasyPIM ™ 模块 采用第七代沟槽栅/场终止IGBT7和第七代发射极控制二极管 带有PressFIT 压接管脚和温度检测NTC 特性•电气特性-沟槽栅IGBT7-过载操作达175°C -低 V CEsat •机械特性-高功率密度-PressFIT 压接技术-2.5 kV 交流 1分钟 绝缘-低热阻的三氧化二铝 Al 2O 3 衬底-紧凑型设计可选应用•辅助逆变器•空调•电机传动产品认证•根据 IEC 60747、60749 和 60068标准的相关测试,符合工业应用的要求。

描述FP10R12W1T7_B11EasyPIM ™ 模块内容描述 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1特性 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1可选应用 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1产品认证 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1内容 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 1封装 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 2IGBT, 逆变器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 3二极管,逆变器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5 4二极管,整流器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 5IGBT, 制动-斩波器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7 6二极管,制动-斩波器 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8 7负温度系数热敏电阻 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .9 8特征参数图表 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .10 9电路拓扑图 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 10封装尺寸 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17 11模块标签代码 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18免责声明 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .191封装表 1绝缘参数特征参数代号标注或测试条件数值单位绝缘测试电压V ISOL RMS, f = 50 Hz, t = 1 min 2.5kV 内部绝缘基本绝缘 (class 1, IEC 61140)Al2O3爬电距离d Creep端子至散热器11.5mm 爬电距离d Creep端子至端子 6.3mm 电气间隙d Clear端子至散热器10.0mm 电气间隙d Clear端子至端子 5.0mm 相对电痕指数CTI > 200相对温度指数 (电)RTI住房140°C 表 2特征值特征参数代号标注或测试条件数值单位最小值典型值最大值杂散电感,模块L sCE30nH 模块引线电阻,端子-芯片R AA'+CC'T H=25°C, 每个开关6mΩ模块引线电阻,端子-芯片R CC'+EE'T H=25°C, 每个开关8mΩ储存温度T stg-40125°C Mounting force per clamp F2050N 重量G24g注:The current under continuous operation is limited to 25A rms per connector pin.2IGBT, 逆变器表 3最大标定值特征参数代号标注或测试条件数值单位集电极-发射极电压V CES T vj = 25 °C1200V 连续集电极直流电流I CDC T vj max = 175 °C T H = 100 °C10A 集电极重复峰值电流I CRM t P = 1 ms20A 栅极-发射极峰值电压V GES±20V表 4特征值特征参数代号标注或测试条件数值单位最小值典型值最大值集电极-发射极饱和电压V CE sat I C = 10 A, V GE = 15 V T vj = 25 °C 1.60TBD VT vj = 125 °C 1.74T vj = 175 °C 1.82栅极阈值电压V GEth I C = 0.22 mA, V CE = V GE, T vj = 25 °C 5.15 5.80 6.45V 栅极电荷Q G V GE = ±15 V, V CE = 600 V0.157µC 内部栅极电阻R Gint T vj = 25 °C0Ω输入电容C ies f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V 1.89nF 反向传输电容C res f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V0.0066nF 集电极-发射极截止电流I CES V CE = 1200 V, V GE = 0 V T vj = 25 °C0.0045mA 栅极-发射极漏电流I GES V CE = 0 V, V GE = 20 V, T vj = 25 °C100nA开通延迟时间(感性负载)t don I C = 10 A, V CE = 600 V,V GE = ±15 V, R Gon = 8.2 ΩT vj = 25 °C0.023µs T vj = 125 °C0.025T vj = 175 °C0.026上升时间(感性负载)t r I C = 10 A, V CE = 600 V,V GE = ±15 V, R Gon = 8.2 ΩT vj = 25 °C0.014µs T vj = 125 °C0.017T vj = 175 °C0.019关断延迟时间(感性负载)t doff I C = 10 A, V CE = 600 V,V GE = ±15 V, R Goff = 8.2 ΩT vj = 25 °C0.124µs T vj = 125 °C0.157T vj = 175 °C0.176下降时间(感性负载)t f I C = 10 A, V CE = 600 V,V GE = ±15 V, R Goff = 8.2 ΩT vj = 25 °C0.227µs T vj = 125 °C0.347T vj = 175 °C0.422开通损耗能量 (每脉冲)E on I C = 10 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Gon = 8.2 Ω, di/dt = 550A/µs (T vj = 175 °C)T vj = 25 °C0.73mJ T vj = 125 °C0.94T vj = 175 °C 1.13关断损耗能量 (每脉冲)E off I C = 10 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Goff = 8.2 Ω, dv/dt =2700 V/µs (T vj = 175 °C)T vj = 25 °C0.623mJ T vj = 125 °C0.97T vj = 175 °C 1.17表 4特征值 (continued)特征参数代号标注或测试条件数值单位最小值典型值最大值短路数据I SC V GE≤ 15 V, V CC = 800 V,V CEmax=V CES-L sCE*di/dt t P≤ 8 µs,T vj = 150 °C32At P≤ 7 µs,T vj = 175 °C30结-散热器热阻R thJH每个 IGBT 2.05K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.3二极管,逆变器表 5最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = 25 °C1200V 连续正向直流电流I F10A 正向重复峰值电流I FRM t P = 1 ms20A I2t-值I2t V R = 0 V, t P = 10 ms T vj = 125 °C27.5A²sT vj = 175 °C24表 6特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 10 A, V GE = 0 V T vj = 25 °C 1.72TBD VT vj = 125 °C 1.59T vj = 175 °C 1.52反向恢复峰值电流I RM I F = 10 A, V R = 600 V,V GE = -15 V, -di F/dt = 550A/µs (T vj = 175 °C)T vj = 25 °C10.5A T vj = 125 °C15.3T vj = 175 °C17.5恢复电荷Q r I F = 10 A, V R = 600 V,V GE = -15 V, -di F/dt = 550A/µs (T vj = 175 °C)T vj = 25 °C0.97µC T vj = 125 °C 1.7T vj = 175 °C 2.2表 6特征值 (continued)特征参数代号标注或测试条件数值单位最小值典型值最大值反向恢复损耗(每脉冲)E rec I F = 10 A, V R = 600 V,V GE = -15 V, -di F/dt = 550A/µs (T vj = 175 °C)T vj = 25 °C0.24mJ T vj = 125 °C0.51T vj = 175 °C0.72结-散热器热阻R thJH每个二极管 2.45K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.4二极管,整流器表 7最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = 25 °C1600V 最大正向均方根电流(每芯片)I FRMSM T H = 100 °C25A 最大整流器输出均方根电流I RMSM T H = 100 °C25A 正向浪涌电流I FSM t P = 10 ms T vj = 25 °C300AT vj = 150 °C245I2t-值I2t t P = 10 ms T vj = 25 °C450A²sT vj = 150 °C300表 8特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 10 A T vj = 150 °C0.80V 反向电流I r T vj = 150 °C, V R = 1600 V1mA 结-散热器热阻R thJH每个二极管 1.54K/W 允许开关的温度范围T vj, op-40150°C5IGBT, 制动-斩波器表 9最大标定值特征参数代号标注或测试条件数值单位集电极-发射极电压V CES T vj = 25 °C1200V 连续集电极直流电流I CDC T vj max = 175 °C T H = 100 °C10A 集电极重复峰值电流I CRM t P = 1 ms20A 栅极-发射极峰值电压V GES±20V表 10特征值特征参数代号标注或测试条件数值单位最小值典型值最大值集电极-发射极饱和电压V CE sat I C = 10 A, V GE = 15 V T vj = 25 °C 1.60TBD VT vj = 125 °C 1.74T vj = 175 °C 1.82栅极阈值电压V GEth I C = 0.22 mA, V CE = V GE, T vj = 25 °C 5.15 5.80 6.45V 栅极电荷Q G V GE = ±15 V, V CE = 600 V0.157µC 内部栅极电阻R Gint T vj = 25 °C0Ω输入电容C ies f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V 1.89nF 反向传输电容C res f = 100 kHz, T vj = 25 °C, V CE = 25 V, V GE = 0 V0.0066nF 集电极-发射极截止电流I CES V CE = 1200 V, V GE = 0 V T vj = 25 °C0.0045mA 栅极-发射极漏电流I GES V CE = 0 V, V GE = 20 V, T vj = 25 °C100nA开通延迟时间(感性负载)t don I C = 10 A, V CE = 600 V,V GE = ±15 V, R Gon = 8.2 ΩT vj = 25 °C0.023µs T vj = 125 °C0.025T vj = 175 °C0.026上升时间(感性负载)t r I C = 10 A, V CE = 600 V,V GE = ±15 V, R Gon = 8.2 ΩT vj = 25 °C0.014µs T vj = 125 °C0.017T vj = 175 °C0.019关断延迟时间(感性负载)t doff I C = 10 A, V CE = 600 V,V GE = ±15 V, R Goff = 8.2 ΩT vj = 25 °C0.124µs T vj = 125 °C0.157T vj = 175 °C0.176下降时间(感性负载)t f I C = 10 A, V CE = 600 V,V GE = ±15 V, R Goff = 8.2 ΩT vj = 25 °C0.227µs T vj = 125 °C0.347T vj = 175 °C0.422表 10特征值 (continued)特征参数代号标注或测试条件数值单位最小值典型值最大值开通损耗能量 (每脉冲)E on I C = 10 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Gon = 8.2 Ω, di/dt = 550A/µs (T vj = 175 °C)T vj = 25 °C0.73mJ T vj = 125 °C0.94T vj = 175 °C 1.13关断损耗能量 (每脉冲)E off I C = 10 A, V CE = 600 V,Lσ = 35 nH, V GE = ±15 V,R Goff = 8.2 Ω, dv/dt =2700 V/µs (T vj = 175 °C)T vj = 25 °C0.623mJ T vj = 125 °C0.97T vj = 175 °C 1.17短路数据I SC V GE≤ 15 V, V CC = 800 V,V CEmax=V CES-L sCE*di/dt t P≤ 8 µs,T vj = 150 °C32At P≤ 7 µs,T vj = 175 °C30结-散热器热阻R thJH每个 IGBT 2.05K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.6二极管,制动-斩波器表 11最大标定值特征参数代号标注或测试条件数值单位反向重复峰值电压V RRM T vj = 25 °C1200V 连续正向直流电流I F10A 正向重复峰值电流I FRM t P = 1 ms20A I2t-值I2t V R = 0 V, t P = 10 ms T vj = 125 °C27.5A²sT vj = 175 °C24表 12特征值特征参数代号标注或测试条件数值单位最小值典型值最大值正向电压V F I F = 10 A, V GE = 0 V T vj = 25 °C 1.72TBD VT vj = 125 °C 1.59T vj = 175 °C 1.52表 12特征值 (continued)特征参数代号标注或测试条件数值单位最小值典型值最大值反向恢复峰值电流I RM I F = 10 A, V R = 600 V,-di F/dt = 550 A/µs(T vj = 175 °C)T vj = 25 °C10.5A T vj = 125 °C15.3T vj = 175 °C17.5恢复电荷Q r I F = 10 A, V R = 600 V,-di F/dt = 550 A/µs(T vj = 175 °C)T vj = 25 °C0.97µC T vj = 125 °C 1.7T vj = 175 °C 2.2反向恢复损耗(每脉冲)E rec I F = 10 A, V R = 600 V,-di F/dt = 550 A/µs(T vj = 175 °C)T vj = 25 °C0.24mJ T vj = 125 °C0.51T vj = 175 °C0.72结-散热器热阻R thJH每个二极管 2.45K/W 允许开关的温度范围T vj op-40175°C注:T vj op > 150°C is allowed for operation at overload conditions. For detailed specifications, please refer to AN 2018-14.7负温度系数热敏电阻表 13特征值特征参数代号标注或测试条件数值单位最小值典型值最大值额定电阻值R25T NTC = 25 °C5kΩR100偏差ΔR/R T NTC = 100 °C, R100 = 493 Ω-55%耗散功率P25T NTC = 25 °C20mW B-值B25/50R2 = R25 exp[B25/50(1/T2-1/(298,15 K))]3375K B-值B25/80R2 = R25 exp[B25/80(1/T2-1/(298,15 K))]3411K B-值B25/100R2 = R25 exp[B25/100(1/T2-1/(298,15 K))]3433K 注:根据应用手册标定7 负温度系数热敏电阻9电路拓扑图图 210封装尺寸图 311 模块标签代码11模块标签代码图 4商标所有参照产品或服务名称和商标均为其各自所有者的财产。

ISSC IS2021S_Datasheet 规格书

ISSC IS2021S_Datasheet 规格书
simultaneously Adaptive Frequency Hopping (AFH) avoids occupied RF channels Fast Connection supported
RF Hardware Fully Bluetooth 4.1 (EDR) system in 2.4 GHz ISM band. Combined TX/RX RF terminal simplifies external matching and reduces external
联系人:廖'R / Fred Liao 手机: 135 1003 2582 Q Q: 316224953 SKYPE: szmyland_fred E-mail: 316224953@
LHL@
Preliminary Datasheet
IS2021S
Bluetooth 4.1 Multimedia SOC
ISSC/台湾创杰,2014 年已并入美国微芯(MICROCHIP,简称 MCHP),多年来专注于蓝牙芯片开发与设计,经过多年耕耘,ISSC 已成为蓝牙芯片领导品ห้องสมุดไป่ตู้。
我司是 ISSC 最资深的代理,从卖出 ISSC 品牌的第一颗芯片至今, 协助 ISSC 方案为全球用户所熟知和认可,亦辅佐和见证了数家蓝牙 成品工厂从初创到跻身为知名企业的成长历程。我司既提供性价比优 越和交期及时的 IC 或 Module,也在香港和深圳配备有多名资深软硬 件工程师,协助客人进行产品开发和设计,从 PCB layout 到试产、量 产的导入,全程提供贴心服务,是蓝牙方案公司或成品工厂的优秀合 作伙伴。请保留以下联系方式,欢迎洽询,共襄盛举!
FEATURES Support preliminary Bluetooth v4.1

HP LaserJet Pro 400和颜色MFP M475系列说明书

HP LaserJet Pro 400和颜色MFP M475系列说明书

LASERJET PRO 400COLOR MFP M475 seriesBoost productivity and gain efficiency. Produce professional-quality, two-sided, color documents in-house. Easily print, scan directly to e-mail, copy and fax with a Web-connected, color laser MFP. Print from virtually anywhere with HP ePrint.4Print Speed 1: Up to 21 ppm black (letter), Up to 21 ppm color (letter) First Page Out : As fast as 17 sec (black) and 17 sec (color)Scan Resolution (Hardware): Up to 1200 x 1200 dpi (mono), Up to 600 x 600 dpi (color)Copy Resolution: Up to 300 x 300 dpi; Max No of Copies: Up to 99 copies Monthly Volume (Duty Cycle): Up to 40,000 pagesPaper Handling: Up to 300 sheets (standard), 50-sheet multipurpose tray, 250-sheet input tray 2, 250-sheet input tray 3 (optional)Measured using ISO/IEC 24734, excludes first set of test documents. For more information see /go/printerclaims . Exact speed varies depending on the system configuration, software application, driver, and document complexity. HP Smart Install works with Windows only. Requires a wireless access point and an Internet connection to the printer. Services may requireregistration. Availability varies by country, language, and agreements, and requires a firmware upgrade. For details, /go/eprintcenter . Requires an Internet connection to the printer. Feature works with any Internet- and e-mail-capable device. Print times may vary. For a list of supported documents and image types, see /go/eprintcenter . Compared with HPLaserJet Pro M1536. Assuming customer is printing at least 30% of total pages in color with content similar to the color ISO/IEC 19798 test suite (/jtc1/sc28) and overall average job length of three pages. Yields established using ISO/IEC test standards. Actual yields and costs vary considerably depending on images printed, number of color pages printed, and other factors. HP Auto-Off capabilities subject to printer and settings. Actual results may vary. Compared with products that use traditional fusing. Program availability varies. HP print cartridge return and recycling is currently available in more than 50 countries and territories around the world through the HP Planet Partners program. For more information, or to request return envelopes and bulk collection boxes, visit /recycle . Wireless performance is dependent upon physical environment and distance from access point, and may be limited during active VPN connections. Wireless connectivity available on the HP LaserJet Pro 400 color MFP M475dw only.Versatile investment, professional color•Achieve bold text and smooth color with HP ImageREt 3600 and Original HP LaserJet toner cartridges.•Produce color marketing materials in-house on a range of media sizes and use tips and templates from HP.•Print black text affordably—at the same cost per page as a black-and-white HP LaserJet printer.5Networked multifunction capability•Boost productivity and save time with print speeds up to 21 ppm (letter).1•Print on wireless 9,10 or Ethernet networks. Plus print from—and save to—flash drives.•Easily manage paper use with automatic two-sided printing.•Install in only a few minutes—there's no CD required with HP Smart Install.2Web-connected efficiency and expandability•Use business apps and the 3.5-inch (8.89 cm) colortouchscreen to access and print information from the web.3•Convert hard copies to digital files quickly andeasily—scan straight to a USB, e-mail, or network folder.•Print from virtually anywhere with HP ePrint.4•Proactively manage office printing with HP Web Jetadmin.Optimized energy savings•Reduce energy use with HP Auto-Off Technology.6 Also save with Instant-on Technology.7•Conserve resources and save paper, using automatic two-sided printing—get up to 50% paper-savings.•Get centralized, easy access to custom, energy-saving options and printer settings with HP EcoSMART Console.•Take advantage of free, easy recycling—cartridges returned through HP Planet Partners are recycled responsibly.8LASERJET PRO 400COLOR MFP M475 seriesHP LASERJET PRO 400 COLOR MFP M475 series Product Number: CE863A and CE864AENERGY STAR qualified models; see /go/energystar Measured using ISO/IEC 24734, excludes first set of test documents. For more information see /go/printerclaims . Exact speed varies depending on the system configuration, software application, driver, and document complexity. Exact speed varies depending on the system configuration, software application, driver and document complexity. Duty cycle is defined as the maximum number of pages per month of imaged output. This value provides a comparison of product robustness in relation to other HP LaserJet or HP Color LaserJet devices, and enables appropriate deployment of printers and MFPs to satisfy the demands of connected individuals or groups. HP recommends that the number of pages per month of imaged output be within the stated range for optimum device performance, based on factors including supplies replacement intervals and device life over an extended warranty period. While scanning to file from ADF. Exact speed varies depending on the system configuration and document complexity. From flatbed, exact speed varies depending on the system configuration and document complexity. Based on standard ITU-T test image #1 at standard resolution. More complicated pages or higher resolution will take longer and use more memory. Power requirements are based on the country/region where theprinter is sold. Do not convert operating voltages. This will damage the printer and void the product warranty. Values are subject to change. For current information see Product Support page at /support . Configuration tested for printing: simplex, mono and simplex, color. Configuration tested for copying: duplex, color. Introductory cartridges included; yields ~ 1,400 color composite (C/Y/M) and black pages. Actual yields vary considerably based on images printed and other factors. For details see /go/learnaboutsupplies . Ships with preinstalled introductory print cartridges (yield ~ 1,400 pages).©2011 Hewlett-Packard Development Company, L.P. HP is a registered trademark of the Hewlett Packard Company. ENERGY STAR and the ENERGY STAR logo are registered U.S. marks. All other trademarks are the property of their respective owners. Microsoft andWindows are registered trademarks of Microsoft Corporation. Adobe and Acrobat are trademarks of Adobe Systems Incorporated. This listing of non HP products does not constitute an endorsement by Hewlett Packard Company. The information contained herein is subject to change without notice and is provides "as is" without warranty of any kind. HP shall not be liable for technical or editorial errors or omissions contained herein. November 2011FOR MORE INFORMATION VISIT OUR WEBSITE AT TECHNICAL SPECIFICATIONSPRODUCT NUMBERCE863A: LaserJet Pro 400 color MFP 475dn CE864A: LaserJet Pro 400 color MFP 475dwFUNCTIONS Print, Copy, Scan, Fax AIO MULTITASKING SUPPORTEDYesDUPLEX PRINT OPTIONS Automatic (standard)STANDARD PRINTER LANGUAGESHP PCL 6, HP PCL 5c, HP postscript level 3 emulationPRINTER MANAGEMENT Windows: HP Device Toolbox, Status Alerts (default install), SNP Alerts (minimum network install), HP Web Jetadmin (download); Mac: HP UtilityPRINT SPEED Black (Letter): Up to 21 ppm; Color (Letter): Up to 21 ppm; First Page Out : As fast as 17 sec (black) and 17 sec (color)PRINT RESOLUTION Black (Best): Up to 600 x 600 dpi; Color (Best): Up to 600 x 600 dpi PRINT TECHNOLOGY RESOLUTION HP ImageREt 3600PRINT TECHNOLOGY LaserNUMBER OF PRINT CARTRIDGES4 (1 each black, cyan, magenta, yellow)PRINTER SMARTSOFTWARE FEATURES HP ePrint, Apple AirPrint™, Smart Install, HP Auto-Off technology, Simplified control panel, Compact design, Wireless direct print (M475dw only)HP ePrint CAPABILITY YesMOBILE PRINTING CAPABILITYHP ePrint, Apple AirPrint™, Business Applications, Wireless Direct print (M475dw only)DUTY CYCLE (MONTHLY)Up to 40,000 pagesRECOMMENDED MONTHLY PAGE VOLUME Up to 1,000 to 2,500 pages COLOR SCANNING Yes TWAIN VERSION Version 1.9SCAN TYPE Flatbed, ADFSCAN RESOLUTION Hardware: Up to 1200 x 1200 dpi (mono), Up to 600 x 600 dpi (color); Optical: Up to 1200 dpi (mono), Up to 600 dpi (color)SCAN SPEED Black (Normal): Up to 11.5 ipm; Color (Normal): Up to 4.5 ipm BIT DEPTH/GRAYSCALE LEVELS24-bit/256SCAN FILE FORMAT PDF, searchable PDF, JPG, RTF, TXT, BMP, PNG, TIFFSCAN INPUT MODES From PC: Solution Center Lite (Windows Vista , Windows XP) or Device Stage (Windows 7); TWAIN-compliant or WIA-compliant softwareSCAN SIZE MAXIMUM ADF: 8.5 x 14 in (216 x 356 mm); Flatbed: 8.5 x 11.7 in (216 x 297 mm)COPY RESOLUTION Black (Text and Graphics): Up to 300 x 300 dpi; Color (Text and Graphics): Up to 300 x 300 dpi COPY SPEEDBlack (Letter): Up to 21 cpm; Color (Letter): Up to 21 cpm; First Copy Out (Color): As fast as 21 sec; First Copy Out (Letter): As fas as 19 sec MAX NUMBER OF COPIES Up to 99 copies COPIER RESIZE AND ENLARGE 25 to 400%COPIER SETTINGS Number of copies, Reduce/Enlarge, Ligher/Darker, Optimize, Paper, Multi-page copy, Collation, Tray select, Two-sided, Draft mode, Image adjustment, Set as new defaults, Restore defaults FAX RESOLUTIONBlack (Best): Up to 300 x 300 dpi; Black (Standard): 203 x 98 dpi;Black and White (Fine): 203 x 196 dpi; Black and White (Superfine): 300 x 300 dpi (no halftone); Black Photo Grayscale: 300 x 300 dpi FAX SPEED 33.6 kbps; Letter: 3 sec per pageFAX FEATURESFax Memory (Letter): Up to 250 pages; Auto Fax Reduction Supported: Yes; Auto-Redialing: Yes; Fax Delayed Sending: Yes; Distinctive Ring Detection Supported: Yes; Fax Forwarding Supported: Yes; Fax Phone TAM Interface Supported: Yes; Fax Polling Supported: Yes (receive only); Fax Telephone Mode Supported: Yes; Junk Barrier Supported: Yes; Maximum Speed Dialing Numbers: Up to 120 numbers; PC Interface Supported: Yes, PC fax send only; Remote Retrieval Capability Supported: No; Telephone Handset Supported: NoFAX SMART SOFTWARE FEATURESPermanent fax memory backup, color faxing, auto fax reduction, auto redialing, delayed sending, fax forwarding, TAM interface, polling, junk barrier, distinctive ring detection, cover page wizard, block fax, billing codes, save and load, poll receive, fax activity reports, dial prefix setting, receive to PC (not available with Macintosh), print fax logSTANDARD CONNECTIVITY 1 Hi-Speed USB 2.0 port, 1 Host USB port (front-panel), 1 Fast Ethernet 10/100Base-TX network portM475dw: Plus 1 WiFi 802.11 b/g/n NETWORK CAPABILITIES Via built-in 10/100 Fast EthernetM475dw: Plus Wireless 802.11 b/g/n WIRELESS CAPABILITYM745dn: NoM475dnw: Yes, Built-in WiFi 802.11 b/g/nMODEM 33.6 kbpsCONTROL PANEL 3.5-in intuitive touchscreen control panel with color graphic display; Buttons (Home, Cancel, Help, Right/Left Arrows, Back); LED indicator lights (Ready, Error, Wireless)DISPLAY3.5" (8.89 cm) touchscreen, LCD (color graphics)MAXIMUM MEMORY 448 MBPROCESSOR TYPE/SPEED ARM1176/600 MHzMEDIA TYPE AND CAPACITY ADF: Sheets: 50; Tray 1: Sheets: 50, transparencies: 50; envelopes: 10; Tray 2: Sheets: 250, envelopes: 10; Tray 3 (optional): Sheets: 250, envelopes: 10MEDIA TYPES Paper (bond, brochure, colored, glossy, letterhead, photo, plain, preprinted, prepunched, recycled, rough), postcards, transparencies, labels, envelopesMEDIA WEIGHTADF: 60 to 90 g/m²; Tray 1: 60 to 176 g/m² (up to 220 g/m² with postcards and HP Color laser glossy photo papers); Tray 2: 60 to 163 g/m² (up to 176 g/m² with postcards); Tray 3 (optional): 60 to 163 g/m² (up to 176 g/m² with postcards)MEDIA SIZES CUSTOMTray 1: 3 x 5 to 8.5 x 14 in; Tray 2, Tray 3 (optional): 3.94 x 5.83 to 8.5 x 14 inAUTO DOCUMENT FEEDER CAPACITYStandard, 50 sheets FONTS AND TYPEFACES 84 scalable TrueType fontsPAPER HANDLING50-sheet multipurpose tray, 250-sheet input tray 2, 150-sheet output bin, Optional 250-sheet input tray 3;Input Capacity (Standard): Up to 300 sheets, Up to 10 envelopes Input Capacity (Maximum): Up to 550 sheets (with optional tray 3)Output Capacity: Up to 150 sheets, Up to 20 envelopes, Up to 50 sheets transparencies POWER Power Supply Type: Internal (Built-in) power supply;Power Requirements: Input voltage: 110 to 127 VAC (+/- 10%), 60 Hz (+/- 3 Hz) Typical Electricity Consumption (TEC) Number: 1.880 kWh/WeekSOFTWARE INCLUDEDWindows: HP Installer/Uninstaller, HP PCL 6 print driver, HP WIA Scan Driver, HP TWAIN Scan Driver, HP Scan, HP Fax Setup Wizard, HP Send Fax, HP Fax Print Driver, Status Alerts, HP Update, DXP, ReadIris Software;Mac: HP Installer/Uninstaller, HP Postscript driver, HP Scan, HP Setup Assistant, HP Fax Print Driver, HP Utility, HP Alerts, HP Firmware Updater, ReadIris SoftwareCOMPATIBLE OPERATING SYSTEMS Full software installs supported on: Microsoft Windows 7 32-bit and 64-bit, Windows Vista 32-bit and 64-bit, Windows XP 32-bit (SP2 or higher); Driver only installs supported on: MicrosoftWindows Server 2008 32-bit and 64-bit, Windows Server 2003 32-bit (SP3 or higher); Mac OS X v 10.5, v 10.6; Linpus Linux (9.4, 9.5), Red Hat Enterprise Linux 5.0 (supported with a pre-built package); SUSE Linux (10.3, 11.0, 11, 11.1, 11.2), Fedora (9, 9.0, 10, 10.0, 11.0, 11, 12, 12.0), Ubuntu (8.04, 8.04.1, 8.04.2, 8.10, 9.04, 9.10, 10.04), Debian (5.0, 5.0.1, 5.0.2, 5.0.3) (supported by the automatic installer); HPUX 11 and Solaris 8/9MINIMUM SYSTEM REQUIREMENTSPC: Microsoft Windows 7 (32-bit/64-bit), Windows Vista (32-bit/64-bit): 1 GHz 32-bit (x86) or 64-bit (x64) processor, 1 GB RAM (32-bit) or 2 GB RAM (64-bit), 400 MB free hard disk space, CD/DVD-ROM or Internet, USB or Network port, Windows XP (32-bit) SP2: Pentium 233 MHz processor, 512 MB RAM 400 MB free hard disk space, CD/DVD-ROM or Internet, USB or Network port;Mac: Mac OSX v 10.5, v 10.6, PowerPC G4, G5, or Intel Core™ Processor, 500 MB hard disk, CD-ROM/DVD-ROM or Internet, USB or Network portACOUSTIC Acoustic Power Emissions: 6.5 B(A);Acoustic Power Emissions (Ready): 4.2 B(A)Acoustic Pressure Emissions Bystander (Active, Printing): 51 dB(A) Acoustic Pressure Emissions Bystander (Ready): 29 dB(A)OPERATING ENVIRONMENTOperating Temperature Range: 59 to 86º F (15 to 30º C)Recommended Operating Temperature: 59 to 80.6º F (15 to 27º C) Storage Temperature Range: -4 to 104º F (-20 to 40º C)Non-Operating Humidity Range: 10 to 95% RH (non-condensing) Operating Humidity Range: 10 to 80% RH (non-condensing)Recommended Humidity Operating Range: 20 to 70% RH (non-condensing) PRODUCT DIMENSIONSW x D x H: 16.5 x 19.0 x 19.7 in (420 x 483 x 500 mm) Maximum: 16.5 x 27.3 x 19.7 in (420 x 693 x 500 mm)PRODUCT WEIGHT 65 lb (29.5 kg)WHAT’S IN THE BOXMultifunction printer, Four preinstalled introductory HP LaserJet toner cartridges (yield ~ 1,400pages), In-box documentation (Hardware installation guide), Software drivers and documentation on CD-ROMs, Power cord, Telecom fax cable, Built-in Automatic duplexer for two-sided printing, USB cable (M475dw only), Built-in Wireless card (M475dw only)WARRANTY One-year limited warrantyHP SERVICES AND SUPPORT OPTIONSHP 3y Nbd Color LasjerJet M475 MFP Supp, U1H64E HP 3y 4hr 9x5 Color LaserJt M475 MFP Supp, U1H65E HP 3y 4hr 13x5 Color LsrJt M475 MFP Supp, U1H66E HP 2y Nbd Color LaserJet M475MFP HW Supp, U1H75E HP 1y PW Nbd Color LasjerJt M475MFP Supp, U1H74PE HP NtwkInstall Inkjet/prsnl LaserJet SVC, H3110EREPLACEMENT CARTRIDGES HP 305A Black LaserJet Toner Cartridge (~ 2,200 pages), CE410A HP 305X Black LaserJet Toner Cartridge (~ 4,000 pages), CE410X HP 305A Cyan LaserJet Toner Cartridge (~ 2,600 pages), CE411A HP 305A Yellow LaserJet Toner Cartridge (~ 2,600 pages), CE412A HP 305A Magenta LaserJet Toner Cartridge (~ 2,600 pages), CE413A ACCESSORIESHP LaserJet 250-sheet Paper Feeder CF106A HP 256 MB DDR2 144-pin DIMM CB423A。

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MC6450 6-Axis eCompassPreliminary DatasheetGENERAL DESCRIPTIONThe MC6450 is a 6-axis electronic compass that consists of a 3-axis linear accelerometer and a 3-axis magnetic field sensor, both with an I2C digital interface, in a single package. By combining a high precision magnetic sensor with a low noise single-chip MEMSaccelerometer, the MC6450 enables industry-leading tilt-compensated compass directional accuracy of 1 degree or less, with appropriate attention to magnetic system design.The MC6450 feature set is optimized for cell phones, portable navigation devices and fitness products. Applications taking advantage of high precision directional pointing include map orientation, virtual reality data overlay, enhanced navigation with dead reckoning assistance and gyroscope replacement.Additionally, the MC6450 maintains standard accelerometer features such as motion enabled user interface, gesture recognition and gaming control.The MC6450 supplied with mCube eMotion™ software eases integration of compass functionality into the end product. eMotion software features includes tilt-compensated heading calculation, hard- and soft-ironcalibration and World Magnetic Model (WMM) compensation.The MC6450 has a linear acceleration full-scale range of ±8g and low noise magnetic sensors with up to 0.15µT magnetic field resolution. A single I2C interface is available to separately control magnetometer and accelerometer functions, enabling independent operation of functions for applications flexibility.FEATURES∙ Single-package high performanceeCompasso 3-axis magnetometer and 3-axisaccelerometero Single I2C interface to 400 kHz ∙ Magnetometero High performance magneticsensor with 0.15µT resolution o 0.35uT Noise o 15-bit resolutiono Broad field range up to ±2.4mT o Programmable output data ratefrom 0.5 to 100 Hz∙ Accelerometero ±8g full-scale acceleration range o 14-bit resolution∙ 3 × 3 × 0.95 mm 16-pin LGA packageTABLE OF CONTENTS1FUNCTIONAL BLOCK DIAGRAM (5)2PACKAGING AND PIN DESCRIPTIONS (6)2.1Package Orientation (6)2.2Package Outline (7)2.3Pin Descriptions (8)3TYPICAL APPLICATION CIRCUIT (9)4SPECIFICATIONS (10)4.1Absolute Maximum Ratings (10)4.2Magnetometer Sensor Characteristics (11)4.3Magnetometer Electrical Characteristics (12)4.4Accelerometer Sensor Characteristics (13)4.5Accelerometer Electrical Characteristics (14)4.6I2C Electrical Characteristics (15)4.7I2C Timing Characteristics (16)4.8Power Supply Sequence (17)5MAGNETOMETER OPERATION (19)5.1Magnetometer Operational Modes (19)5.2Initialization (20)5.2.1Self-Test (20)5.3Modes (22)5.3.1OFF mode (22)5.3.2Stand-by mode (22)5.3.3Active mode (22)5.4Data Ready Interrupt Output (DRDY pin) (26)5.5Offset Calibration (27)5.6Offset Drift (28)5.7Temperature Measurement and Compensation Function (29)6ACCELEROMETER OPERATION (30)6.1Accelerometer General Operation (30)6.2Accelerometer Sensor Sampling (30)6.3Accelerometer Offset and Gain Calibration (30)6.4Accelerometer Operational States (31)6.6Accelerometer Interrupts (33)6.7Enabling and Clearing Interrupts (33)6.8Accelerometer Interrupt Support (34)6.9Accelerometer GINT Interrupt (34)6.10Accelerometer Event Detection (34)6.11Accelerometer Orientation Detection (36)6.12Orientation Hysteresis (36)6.13Portrait/Landscape Events (36)6.14Front/Back Events (41)6.15Shake Detection (43)6.16Drop Detection (45)6.17Accelerometer Tap Detection (46)6.18Accelerometer Continuous Sampling (48)7I2C INTERFACE (49)7.1I2C Support (49)7.1.1Accelerometer I2C Address (49)7.2Timing (49)7.3I2C Message Format (50)8MAGNETOMETER REGISTER INTERFACE (51)8.1Magnetometer Registers (52)9ACCELEROMETER REGISTER INTERFACE (58)9.1Accelerometer Register Summary (59)9.2Accelerometer TILT: Status Register (61)9.3Accelerometer OPSTAT: Operational State Status Register (62)9.4Accelerometer INTEN: Interrupt Enable Register (63)9.5Accelerometer MODE: Mode Register (64)9.6Accelerometer TAPEN: Tap Detection Enable Register (65)9.7Accelerometer TAPP: Tap Pulse Register (66)9.8Accelerometer Drop: Drop Event Control Register (67)9.9Accelerometer SHDB: Shake Debounce Register (68)9.10XOUT_EX, YOUT_EX & ZOUT_EX: X, Y, Z-Axis Extended Accelerometer Registers (69)9.11Accelerometer CHIPID: Chip Identification Register (70)9.12Accelerometer OUTCFG: Output Configuration Register (71)9.13Accelerometer X-Axis Offset Registers (72)9.15Accelerometer Z-Axis Offset Registers (74)9.16Accelerometer X-Axis Gain Registers (75)9.17Accelerometer Y-Axis Gain Registers (76)9.18Accelerometer Z-Axis Gain Registers (77)9.19Accelerometer Shake_Th: Shake Threshold Register (78)9.20Accelerometer UD_Z_TH: Up/Down Z Axis Threshold Register (79)9.21Accelerometer UD_X_TH: Up/Down X Axis Threshold Register (80)9.22Accelerometer RL_Z_TH: Right/Left Z Axis Threshold Register (81)9.23Accelerometer RL_Y_TH: Right/Left Y Axis Threshold Register (82)9.24Accelerometer FB_Z_TH: Front/Back Z Axis Threshold Register (83)9.25Accelerometer DROP_TH: Drop Threshold Register (84)9.26Accelerometer TAP_TH: Tap Threshold Register (85)9.27Accelerometer PCODE: Product Code (86)10EXAMPLE MC6450 SETUP CONFIGURATIONS (87)10.1EXAMPLE: SHAKE, TAP & DROP THRESHOLDS DEMO (87)11REVISION HISTORY (88)12LEGAL (89)Positive values indicate direction ofacceleration force.The magnetic sensor output valueof each axis is positive whenturned toward magnetic north. Figure 2. Package Axis Reference – Magnetometer & Accelerometer2.2 Package OutlineFigure 4. Package Outline DimensionsFigure 5 - Package PinsFigure 7. I2C Interface Timing4.8 Power Supply SequenceThe timing and sequence requirements of the power supply pins are shown below.Figure 8 - Power Supply Sequence 1Figure 9 - Power Supply Sequence 2Table 9 - Power Supply Voltage TimingTable 10 - Power Supply Voltage Levels (for sequencing purposes only)∙There is no limitation in the turn-on timing of the AVDD and the DVDD voltages.∙Case 1:o When the DVDD voltage turns on initially.o After the DVDD voltage has risen (reached VHdv).o The AVDD's voltage rising slope must rise (reach 0.9*AVDD) within 1.5 [msec].Figure 10 - AVDD and DVDD Turn-On TimingThe magnetometer has several states whose primary purpose is power management. A simplified state diagram is shown below.Figure 11. Magnetometer State Diagram5.2 Initialization‒All internal circuits and all register values are initialized by an internal POR (Power On Reset) circuit after power-on.‒After initialization, the functional mode moves to standby mode automatically.‒The software reset set by the register command SRST=1 sets all register value to defaults and reload the compensation values for internal sensor calculation.5.2.1 Self-Test-Self-test can be used to confirm the internal sensor interface and digital logic.-Self-test is performed by reading the STB register and setting the register-command CTRL3 STC bit to Hi.-The following chart shows the procedure to execute self-test.-Following a properly function self-test operation, the value of response register STB will be set to 0x55.Figure 12 - Self Test Flow ChartFigure 13 - Transferring Between ModesForce State is used for synchronous measurement (selected from register CTRL3, bit FRC). Measurements start after forced register command are written to register via I2C.‒Functional mode changes from Stand-by mode to Active mode by setting register (Control1: bit PC) to "1".‒Force State is set by control register (CNTL1: bit FS) "1".‒Acquired data stored to output register (OUTX, OUTY, OUTZ), and status register (STAT: bit DRDY) is set to "1" and output signal (DRDY PIN) are set to active.‒Output on external DRDY PIN is set by control register (CNTL2).‒During reading data, output register is not updated. After reading is complete, reading data is updated.‒Change of state from Normal to Force is valid after measurement if control register is set during the Active measuring in Normal state.Figure 14 - Measurement Control Timing (Force State)‒Normal state is a continuous measurement state, and when Normal state is set by setting “0” to control register (CNTL1: bit FS), a measurement is started.‒Measurement time and interval are managed by an internal clock.‒Functional mode is changed from Stand-by mode to Active mode by setting register (CNTL1: bit PC) to "1".‒Output data rate (ODR) is selectable between 0.5Hz or 100Hz by register (CNTL1: bit ODR).‒Acquired data are stored to register (OUTX, OUTY, OUTZ), status register (STAT: bit DRDY) is set to "1" and output PIN signal are control with (CNTL2:bit DEN).Figure 15 - Measurement Control Timing (Normal State)Figure 16 - Data Ready (DRDY) Interrupt Function5.5 Offset Calibration‒This function is enabled when control register (CNTL3:OCL) is set to Hi during the Force State.‒The offset value for inner ADC output is calculated with the measured sensor offset, and then compensation values for the amplitude offset and the digital offset are set automatically.‒The OCL bit is changed to be low after the compensation offset value is updated, and then the status is back to what it was before measurement.5.6 Offset Drift‒This function can make the digital compensation output that is add with values wrote by the host CPU on the offset drift register (OFFX, OFFY, OFFZ).‒Offset drift values can be set with 15bit signed value.Figure 17 - Magnetometer Offset Drift5.7 Temperature Measurement and Compensation Function‒The temperature measurement function is executed by setting the register command TCS to "1"while in Force State. After measurement, TCS bit change to "0" and back to what it was before measurement.‒The measurement result is updated in the temperature value register (TEMP).‒Sensor output values are compensated with the temperature value register (TEMP).6.6 Accelerometer InterruptsThe sensor device utilizes output pin INTN to signal to an external processor that an event has been sensed. The processor’s interrupt service routine performs certain tasks after receiving this interrupt and reading the associated status bits, perhaps after the product was moved into a certain orientation or had been tapped. The processor sets up the registers such that when a specific event is detected, the processor would receive the interrupt and the interrupt service routine would be executed.For products that use a polling method of interrupt servicing, the method of reading sensor data is slightly different. Instead of receiving an interrupt when an event occurs, the processor must periodically poll the sensor and read status data. In this case, the INTN pin is not used. For most applications, polling is best done at the sensor sampling rate or faster. Note that at least one I2C STOP condition must be present between samples in order for the sensor to update the sample data registers. Note: for polling support, the event detection bits (TAPD, SHAKED, DROPD) and associated interrupt enable bits in the Accelerometer TILT: Status Register must still be set up as if interrupts would occur in order for the status registers to be updated with proper data. Although the INTN is not connected, the registers in the sensor will still contain valid status and so can be used by software to know the orientation of the product or if an event has occurred.6.7 Enabling and Clearing InterruptsThe Accelerometer INTEN: Interrupt Enable Register determines which events generate interrupts. When an event is detected, it is masked with an interrupt enable bit in this register and the corresponding status bit is set in the Accelerometer TILT: Status Register. Multiple interrupt events might be reported at the same time in the Accelerometer TILT: Status Register, so software must interpret and prioritize the results.The pin INTN is cleared during the next I2C bus cycle after the device ID has been recognized by the device.When an interrupt is triggered, the first I2C read access to the device clears INTN pin. The condition (TAPD, SHAKED, DROPD) that generated the interrupt will remain held in the Accelerometer TILT: Status Register until it is read. Note that the orientation bit-fields POLA and BAFR are continuously updated (every sample) in the Accelerometer TILT: Status Register and are not held. Note that multiple interrupts may be active at the same time, and so a software routine reading the Accelerometer TILT: Status Register should account for this.Any of the following interrupts can be enabled or disabled in the Accelerometer INTEN: Interrupt Enable Register and Accelerometer Drop: Drop Event Control Register.‒Front/Back Interrupt‒Up/Down/Left/Right (portrait / landscape) Interrupt‒Tap Detection Interrupt‒GINT (real-time motion tracking, generate interrupt each sample period)‒Shake on X-axis, Shake on Y-axis, and Shake on Z-axis‒Drop event detection6.11 Accelerometer Orientation DetectionThe accelerometer in MC6450 allows an application to determine the orientation of the device. The current orientation of the device is reported as Left, Right, Up, Down, Front, and Back for each sampling period. This information generates the Portrait/Landscape status bits in the Accelerometer TILT: Status Register.6.12 Orientation HysteresisHysteresis can be added to portrait/landscape and front/back detection by modifying the default threshold offset values. See the specific sections below for more information.6.13 Portrait/Landscape EventsPortrait/landscape detection is a combination of left, right, up, and down events, also partially dependent upon Z sensor readings of the Accelerometer.The default comparison angle for portrait/landscape is 45 degrees when evaluating differences between LEFT, RIGHT, UP, and DOWN, as long as the magnitude of Z is < 0.8g (default). See Figure 19.By increasing the threshold values written to the Accelerometer UD_X_TH: Up/Down X Axis Threshold and Accelerometer RL_Y_TH: Right/Left Y Axis Threshold, hysteresis can be introduced to the angle of evaluation. These registers add a small offset to the default X and Y values and introduce additional margin in the portrait/landscape detection logic.For most applications, the same value should be written to both registers.When the device orientation is in the hysteresis region, the device will report orientation as “unknown”. When this reading is reported, in order to implement a hysteresis effect for orientation, high-level software should use the last known portrait/landscape information.In the example shown in Figure 20 the evaluation angle has been decreased to 40 degrees in each threshold, such that there is a 10 degree “deadband” or hyste resis-area between LEFT/RIGHT and DOWN/UP areas. The circle represents the acceleration in the Z axis, which has a default of 0.8g, or about a 33 degree tilt relative to the Z axis.6.18 Accelerometer Continuous SamplingThe device has the ability to read all sampled readings in a continuous sampling fashion. The device always updates the XOUT_EX, YOUT_EX, and ZOUT_EX registers at 1024 samples/second.An optional interrupt can be generated each time the sample registers have been updated (GINT interrupt bit in the Accelerometer INTEN: Interrupt Enable Register). See Sections 6.9, 9.4 and 9.12 for GINT operation and options.7 I2C INTERFACEThe I2C slave interface operates at a maximum speed of 400 kHz. MC6450 has a single set of I2C signals connecting to independent I2C interfaces. The SDA (data) signal is an open-drain, bi-directional pin. The SCL (clock) signal is an input pin. SCL and SDA each require an external pull-up resistor, typically 4.7 kΩ.The MC6450 always operates as an I2C slave on both magnetometer and accelerometer I2C interfaces.An external I2C master must initiate all communication and data transfers and generate the SCL clock that synchronizes the data transfer. The I2C device default addresses for the accelerometer is 0x4C, for the magnetic sensor is 0x0C.The I2C interface remains active as long as power is applied to the DVDD and AVDD pins.In the accelerometer, the device responds to I2C read and write cycles when it is in STANDBY state, but interrupts cannot be serviced or cleared. All registers can be written in the STANDBY state, but in WAKE state, only the Accelerometer MODE: Mode Register can be modified. Internally, the registers which are used to store samples are clocked by the sample clock gated by I2C activity. Therefore, in order to allow the device to collect and present samples in the sample registers at least one I2C STOP condition must be present between samples.The accelerometer requires a Stop bit between I2C transactions.7.1 I2C SupportThe acceleration sensor supports Standard mode and Fast mode.The magnetic sensor supports Standard mode, Fast mode , Fast mode Plus and Hi speed mode.The magnetic sensor can seamlessly change from Fast mode to Hi speed mode using the master code (00001XXX).The magnetic sensor supports multiple Read and Write mode.The I2C clock stretch function is not supported.7.1.1 Accelerometer I2C AddressThe I2C device address is 0x4C (8-bit written address 0x98, reading address 0x99).If an I2C burst read operation reads past register address 0x12 the internal addre ss pointer “wraps” to address 0x03 and the contents of the Accelerometer TILT: Status Register are returned. This allows application software to burst read the contents of the six extended registers and the relevant device state registers in a single I2C cycle.7.2 TimingSee Section 4.7 I2C Timing Characteristics for I2C timing requirements.。

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