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BU2090中文资料

Parameter
Symbol Min. Typ. Max. Unit
Input high level voltage
3.5
—
—
VIH
V
2.5
—
—
Input low level voltage
—
—
1.5
0.4
Output low level voltage
—
—
2.0
VOL
V
—
—
1.0
"H" output disable current
– 25 ~ + 75
°C
Storage temperature
Tstg
– 55 ~ + 125
°C
Input voltage
VIN
VSS – 0.3 ~ VDD + 0.3
V
Output voltage
VO
VSS ~ 25.0
V
∗1 Unmounted ∗2 When mounted on a glass epoxy board of 50mm × 50mm × 1.6mm ∗3 When mounted on a glass epoxy board of 90mm × 50mm × 1.6mm ∗4 When mounted on a glass epoxy board of 70mm × 70mm × 1.6mm
元器件交易网
Standard ICs
BU2090 / BU2090F / BU2090FS / BU2092 / BU2092F / BU2092FV
12-bit, serial IN, parallel OUT driver

三极管中文资料大全

DTA114 PNP 10K-10K 160V0.6A0.625W(带阻)
DTC143 NPN 录像机用 4.7K-4.7K
HPA100 NPN BCE 大屏彩显行管 21#
HPA150 NPN BCE 大屏彩显行管 21#
HSE830 PNP BCE 音频功放 80V115W1MHZ
A1301 PNP BCE 功放开关 160V10A100W30MHZ /C3280
A1302 PNP BCE 功放开关 200V15A150W30MHZ /C3281
A1358 ? PNP 高频 120V1A10W120MHZ
A1444 PNP BCE 高速电源开关 100V15A30W80MHZ
BUS14A NPN 12 开关功放 1000V30A250W
BUT11A NPN 28 开关功放 1000V5A100W
BUT12A NPN 28 开关功放 450V10A125W
BUV26 NPN 28 音频功放开关 90V14A65W /250ns
BUV28A NPN 28 音频功放开关 225V10A65W /250ns
2N6609 PNP 12 音频功放开关 160V15A150W COP 2N3773
品名极性管脚功能参数
2N6678 NPN 12 音频功放开关 650V15A175W15MHZ
2N6718 NPN 小铁音频功放开关 100V2A2W50MHZ
3DA87A NPN 6 视频放大 100V0.1A1W
3DG6A NPN 6 通用 15V20mA0.1W100MHz
3DG6B NPN 6 通用 20V20mA0.1W150MHz

BU2527DX中文资料

Tj = 25 C Tj = 125 C
8A 1
6A
5A
IC = 4 A
0.1
0.110. Typical collector-emitter saturation voltage. VCEsat = f (IB); parameter IC
Poff / W 100
IC
ts
IB IBend
10 %
tf
t
t
- IBM
Fig.2. Switching times definitions.
I F
I F
10%
t fr
time
VF
5V
V fr
VF
time
Fig.3. Definition of anti-parallel diode Vfr and tfr
VCC
IBend -VBB
three terminals to external
heatsink
Cisol
Capacitance from T2 to external f = 1 MHz
heatsink
MIN. TYP. MAX. UNIT
-
2500 V
-
22
-
pF
STATIC CHARACTERISTICS
Ths = 25 ˚C unless otherwise specified
IF = 8 A; dIF/dt = 50 A/µs VF = 5 V
TYP. MAX. UNIT
145
-
pF
1.7 2.0 µs 0.1 0.2 µs
16
-
V
410
-
ns
2 Measured with half sine-wave voltage (curve tracer).

BU102S资料

额定值
≥ 400 ≥ 700
≥9 1 13
150 － 55 ～ 150
单位
V V V A W ℃ ℃
电特性： ( Tc=25 ℃ )
参数名称符号
集电极－发射极击穿电压集电极－基极击穿电压发射极－基极击穿电压集电极－发射极反向漏电流集电极－基极反向漏电流发射极－基极反向漏电流
共发射极直流电流增益
TEL：0755-29799516 FAX：0755-29799515

BU102S
Jingdao Electronic Corporation V01 3/3
深圳市晶导电子有限公司 Shenzhen Jingdao Electronic Co.,Ltd.
TEL：0755-29799516 FAX：0755-29799515

BU102S NPN 功率三极管
* 主要用途：
电子镇流器、节能灯、充电器及各类功率开关电路。
SOA（DC）安全工作区 5
1 0.5
Pc （W ）耗散功率
HFE 直流电流增益
HFE 直流电流增益－ Ic 集电极电流 50
40
30
Vce=5V
20
10
1
0.001
0.01
0.1
1
Ic（A）集电极电流
Pc 耗散功率－ Tj 结温 25 20 15 10 5
0
40
80
120
160 200
Tj（℃）结温
* 主要特点：
硅三重扩散平面工艺、输出特性好、电流容量大。
极限值：( Tc=25 ℃ )
参数名称
集电极－发射极击穿电压集电极－基极击穿电压发射极－基极击穿电压最大集电极直流电流最大耗散功率最高结温贮存温度

BU406TU;BU406;BU408;中文规格书,Datasheet资料

(3.00) (3.70) 15.90 ±0.20 18.95MAX.
9.20 ±0.20 (1.46)
10.08 ±0.30
13.08 ±0.20 (1.00)
1.27 ±0.10
2.54TYP [2.54 ±0.20]
1.52 ±0.10
0.80 ±0.10 2.54TYP [2.54 ±0.20]
0.50
+0.10 –0.05
2.40 ±0.20
10.00 ±0.20
© 2012 Fairchild Semiconductor Corporation
BU406/406H/408 Rev. B0
3
/
Dimensions in Millimeters
Min. 10
Max.
5 100
1
1
Units
mA μA mA
mA
1
V
1
V
1
V
1.2
V
1.2
V
1.5
V
MHz
0.75
μs
0.4
μs
0.4
μs
© 2012 Fairchild Semiconductor Corporation
BU406/406H/408 Rev. B0
1
/
TRADEMARKS
The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks.

BU

Listening to the world
BEFORE you listen
1 Discuss and give advice to : 3. someone பைடு நூலகம்ho has too many things to do.
First, compile a checklist of all the things to be done. Moreover, prioritize the list of things.
Wrapping up Fun time
Learning objectives
1 talk about different emotions
2
identify the problem-solution pattern in listening
3 give news in an appropriate way
2 Would you describe yourself as an optimist or a pessimist? Why?
• I am an optimist. Whenever I get in a tricky situation, I think of the positives and manage to pull myself through. • I think I am a pessimist. I always feel that I can’t do well enough. I am always afraid of being laughed by others.
Second, learn to relax. • planned relaxation •music, a long soak, or a walk

BU406-S中文资料

●7 A Continuous Collector Current ●15 A Peak Collector Current ●60 W at 25°C Case Temperatureabsolute maximum ratings at 25°C case temperature (unless otherwise noted)NOTE1:This value applies for t p ≤ 10 ms, duty cycle ≤ 2%.RATINGSYMBOL VALUE UNIT Collector-base voltage (I E = 0)BU406BU407V CBO 400330V Collector-emitter voltage (V BE = -2 V)BU406BU407V CEX 400330V Collector-emitter voltage (I B = 0)BU406BU407V CEO 200150V Emitter-base voltage V EB 6V Continuous collector current I C 7A Peak collector current (see Note 1)I CM 15A Continuous base currentI B 4A Continuous device dissipation at (or below) 25°C case temperature P tot 60WOperating junction temperature range T j -55 to +150°C Storage temperature range T stg-55 to +150°CNOTES:2.These parameters must be measured using pulse techniques, t p = 300 µs, duty cycle ≤ 2%.3.These parameters must be measured using voltage-sensing contacts, separate from the current carrying contacts.4.T o obtain f t the [h FE ] response is extrapolated at the rate of -6 dB per octave from f = 1 MHz to the frequency at which [h FE ] = 1.† Voltage and current values shown are nominal; exact values vary slightly with transistor parameters.electrical characteristics at 25°C case temperature (unless otherwise noted)P ARAMETERTEST CONDITIONSMIN TYPMAXUNIT V (BR)CEOCollector-emitter breakdown voltageI C = 30 mA I B =0140VI CESCollector-emitter cut-off currentV CE = 400 V V CE = 330 VV CE = 250 V V CE = 200 V V CE = 250 V V CE = 200V V BE =0V BE =0V BE =0V BE =0V BE =0V BE =0T C = 150°C T C = 150°CBU406BU407BU406BU407BU406BU407550.10.111mAI EBO Emitter cut-off current V EB = 6 V I C =01mA h FE Forward current transfer ratio V CE = 10 V V CE = 10 V I C =4A I C =0.5A (see Notes 2 and 3)1220V CE(sat)Collector-emitter saturation voltage I B = 0.5 A I C = 5A (see Notes 2 and 3)1V V BE(sat)Base-emitter saturation voltage I B = 0.5 A I C = 5A (see Notes 2 and 3) 1.2V f t Current gain bandwidth product V CE = 5 V I C = 0.5A f = 1 MHz (see Note 4)6MHz C obOutput capacitanceV CB = 20 VI E =0f = 1 MHz60pFthermal characteristicsP ARAMETERMINTYPMAX UNIT R θJC Junction to case thermal resistance 2.08°C/W R θJAJunction to free air thermal resistance70°C/Winductive-load-switching characteristics at 25°C case temperature (unless otherwise noted)P ARAMETER TEST CONDITIONS †MINTYP MAXUNIT t s Storage time I C = 5 AI B(end) = 0.5A(see Figures 1 and 2)2.7µs t (off)T urn off time750nsPARAMETER MEASUREMENT INFORMATION。

bk是什么颜色三篇精选(最新)

GY：grey 灰色;BK：black 黑色;YE：yellow 黄色;BU：blue 蓝色。

1、蓝色(blue)光或颜料(作为颜料色中，使用青色代替蓝色)的三原色之一，这种颜色有很多种，有天蓝、湖蓝、宝蓝、粉蓝、冰蓝、碧蓝等等。

欧洲为对国家之忠诚象征。

天蓝色代表宁静、清新、自由，是很多人喜欢的颜色，天蓝色和粉红色一样，是安抚色，一看到就让人的心情感到放松;湖蓝色，海的颜色，代表忧郁、深邃、冷淡;宝蓝色即宝石蓝，最深也最亮的蓝色，也叫海军蓝，代表冷静、智慧等。

2、黄色(yellow)颜料三原色之一，活泼的颜色，亮度最高，禁不起白色的冲淡。

东方代表尊贵、优雅，西方以黄色为耻辱象征。

扩展资料：颜色搭配1、蓝色和白色：也是很经典的搭配，这两种颜色随处可见，天空和白云的颜色、青花瓷的颜色等等，都有蓝和白的影子。

让人感到清爽、明快。

另外，任何颜色和白色搭配都是很好的搭配。

2、湖蓝色和橙色：生动的搭配，两种颜色互为补色，也会让人有成熟感，可以用在衣服搭配上。

3、黄色和紫色：醒目的搭配，对比强烈，两种颜色也是互为补色。

可以用在男孩子穿的T恤上，让人感到酷感十足。

4、黄色和绿色：淡雅的搭配，两种颜色看起来很和谐，淡雅、清新、美好的风格。

Bn是brown缩写，代表棕色;Gy是grey缩写，代表灰色;Wh是white缩写，代表白色Bk是black缩写，代表黑色Bu是blue缩写，代表蓝色拓展资料英文中常常颜色与情绪挂钩：1.blue表示不愉快的心情。

eg：be in a blue mood, a blue Sunday. scream blue murder意思是惊恐的叫喊; in a blue moon 意思是极为罕见;out of blue 的意思是出乎意料; blue -brick school 好学校(知名学校); blue water 大海;blue-sky 不切实际的，空想的; blue-eyed boy 得意门生等等。

BU508D资料

Switching times(16KHz line deflecton circuit) Turn-off storage time Turn-off fall time
CONDITIONS VBE = 0V; VCE = VCESMmax VBE = 0V; VCE = VCESMmax Tj = 125 IB = 0A; IC = 100mA L = 25mH IC = 4.5A; IB = 2.0A IC = 4.5A; IB = 2.0A IC = 1.0A; VCE = 5V IF=4.0A IC = 0.1A; VCE = 10V VCB = 10V IC=4.5A,IB1=-IB2=1.2A,VCC=140V
CONDITIONS VBE = 0V
MT-100
Tmb 25 IC = 4.5A; IB = 2.0A f = 16KHz IF=4.0A IC=4.5A,IB1=-IB2=1.2A,VCC=140V
LIMITING VALUES
SYMBOL
VCESM VCEO VEBO IC IB IBM Ptot Tstg Tj
PARAMETER Collector-emitter voltage peak value Collector-emitter voltage (open base) Emitter-base voltage(open collector) Collector current (DC) Base current (DC) Base current peak value Total power dissipation Storage temperature Junction temperature
Collector-emitter saturation voltages Base-emitter satuation voltage DC current gain Diode forward voltage Transition frequency at f = 1MHz Collector capacitance at f = 1MHz

6B复习资料U10

6B U10复习资料一、重要词组：1. read some information about forests 读关于森林的一些信息2. make a display board 做一块展板3. a large area of …一大片… 的地区4. provide shelter and food for birds, animals and insects 为鸟、动物和昆虫提供庇护所和食物5. make a nest in the tree 在树上做巢6. build their homes in the hollows of trees 在树的洞里造他们的家7. cook food with wood 用木材烧饭8. get wood from forests 从森林得到木材9. make furniture 做家具10. lose their homes and food 失去他们的家和食物11. stop cutting down trees 停止砍树12. things from the environment 来自环境的东西13. get wood from trees 从树木得到木材14. use wood to make paper 用木材做纸15. get plastic from oil 从石油得到塑料16. use plastic to make cups 用塑料做杯子17. get oil, metal and clay from ground 从地下获得石油，金属和粘土18. use metal to make spoons 用金属做勺子19. use clay to make plates 用粘土做盘子20. get wool from sheep 从羊得到羊毛21. get cotton from plants 从植物得到棉花22. use wool and clothes to make clothes 用羊毛和棉花做衣服23. get glass from sand 从沙子得到玻璃24. use glass to make bottles 用玻璃做瓶子25. be made of different materials 由不同的材料构成26. touch it 触摸它27. How does it feel? 有什么感觉?28. It’s / It feels hard/soft/smooth/rough. 它是硬的/软的/光滑的/粗糙的.29. What is it made of ? 它是由什么制成的？30. a wooden box 一只木制箱子31. a woolen scarf 一条羊毛围巾32. a cotton skirt 一条棉制裙子33. a metal spoon 一把金属勺子34. a plastic bottle 一只塑料瓶子35. a glass 一只玻璃杯36. a clay vase 一只粘土花瓶6B U10复习资料默写纸一、重要词组：1.读关于森林的一些信息 __________2. 做一块展板 __________3. 一大片… 的地区__________4. 为鸟、动物和昆虫提供庇护所和食物 ___________5. 在树上做巢 __________7. 用木材烧饭 __________9. 做家具__________11. 停止砍树 __________6. 在树的洞里造他们的家 __________8. 从森林得到木材 __________10. 失去他们的家和食物 __________12. 来自环境的东西 __________13. 从树木得到木材 __________15. 从石油得到塑料 __________17. 从地下获得石油，金属和粘土19. 用粘土做盘子 __________21. 从植物得到棉花 __________23. 从沙子得到玻璃 __________14. 用木材做纸 __________16. 用塑料做杯子 ____________________ 18. 用金属做勺子 __________20. 从羊得到羊毛 __________22. 用羊毛和棉花做衣服 __________24. 用玻璃做瓶子 __________25. 由不同的材料构成 __________ 26. 触摸它 __________27. 有什么感觉? __________ 28. 它是硬的/软的/光滑的/粗糙的. __________29. 它是由什么制成的？ __________ 30. 一只木制箱子 __________31. 一条羊毛围巾 __________ 32. 一条棉制裙子 __________33. 一把金属勺子 __________ 34. 一只塑料瓶子 __________35. 一只玻璃杯 __________ 36. 一只粘土花瓶 __________二、词形转换：1. build (v.) 建造 > _________________ (n.) 建筑物2. wood (n.) 木头> _________________ (a.) 木制的3. wool (n.) 羊毛 > _________________ (a.) 羊毛的4. leaf (n.) 叶子 > ________________ (pl.)6B U10本课要点1. get …fr om … 从…得到…2. We can use …to make …我们能用…做…3. A: What is it made of? 它由什么制成？B: It ’s made of …它由…制成4. A: How does it feel? 它摸上去感觉如何？B: It ’s hard / tough / soft / smooth. 它是硬的/粗糙的/软的/光滑的.5. wood, wool, metal, glass, plastic, cotton, clay, oil, sand, furniture 均为不可数名词如： a piece of furniture 一件家具二、词形转换：1. build (v.) 建造 > building (n.) 建筑物2. wood (n.) 木头> wooden (a.) 木制的3. wool (n.) 羊毛 > woollen (a.) 羊毛的4. leaf (n.) 叶子 > leaves (pl)6B U10补充练习I.Choose the best answer( ) 1. We can get ________ from the ground.A. oilB. jamC. woolD. paper( ) 2. -- _________ do we use matchboxes __________?-- We use them _______ making the cupboards.A. How, for, forB. What, for, toC. Why, for, toD. What, for, for( ) 3. -- ____________ does the stone feel? -- It's hard and rough.A. WhatB. HowC. WhichD. Where( ) 4. The desks and chairs in our classroom _________ wood.A. are made ofB. are made fromC. are made forD. are made with( ) 5. Trees _________ both shelter and food ________ animals and insects.A. provide, toB. provide, forC. provide, onD. provide, from( ) 6. People can’t live ________ water.A. withB. forC. toD. without( ) 7. ________ gloves are made of ________.A. Woollen, woolB. Wool, woolenC. Wooden, woodD. Wood, wooden ( ) 8. We get different materials ______ the ground.A. forB. ofC. fromD. by( ) 9. ______ there is no homework this weekend, we will be very happy.A. BecauseB. SoC. WhenD. If( ) 10. Firemen need water _____ out fires.A. to putB. for putC. putD. to putting( ) 11. _________ is the scarf made of?A. WhatB. HowC. WhichD. under( ) 12. The cloth __________ soft.A. feelB. feelsC. is feelD. feeling ( ) 13. Mr. Danny wants to _________ who is wrong.A. lookB. look forC. findD. find out ( ) 14. The girl feels _______ because she has lost the match.A. happyB. happilyC. unhappyD. unhappily ( ) 15. We must do exercise to keep ourselves ________.A. healthB. healthyC. unhealthyD. healthily ( ) 16. The factory provides some supermarkets ____________ plastic bags.A. ofB. fromC. forD. with( ) 17. If you don't work, you will have no money ___________ things.A. buyB. to buyC. buyingD. to buying ( ) 18. We must stop people ________ more plastic bags.A. useB. to useC. usingD. uses( ) 19. There ________ some sheep in the field five minutes ago.A. isB. areC. wasD. were( ) 20. These T-shirts are made of ____________ materials.A. sameB. the sameC. differentD. differently plete the sentences with the given words in their proper forms.1. We use wool to make ________________ (scarf)2. Jane bought a ____________ scarf as a Christmas gift. (wool)3. Mary's _______________ box is very useful. (wood)4. Lucy is wearing a pair of _____________. (glass)5. More ____________ will go to Wenchuan to help build the homes for people there. (build)6. Linda is one of the _______________ girls in her class. (beautiful)7. It is ____________ to practise more if you want to be good at it. (importance)8. You'd better stay at home. It's raining ________ outside. (heavy)III．Rewrite the following sentences as required1． Our parents give us life and love. (保持原句意思)We _________ life and love _________ our parents.2． We use plastic to make bags. (保持原句意思)We use plastic_________ _________ bags.3． Sue had dinner in KFC yesterday. (改为一般疑问句)_________ Sue _________ dinner in KFC yesterday?4． Hold the string of the kite tightly. (改为否定句)_________ _________ the string of the kite tightly.5. Firemen use water to put out fires. (对划线部分提问)____________ _____________ firemen use to put out fires?6. It's about 5 minutes' walk from my home to the bookstore. (对划线部分提问)____________ ___________ is it from your home to the bookstore?。

BU.SocialWork.MP781

BOSTON UNIVERSITY SCHOOL OF SOCIAL WORKCommunity OrganizingMP781Spring 2006Sections A1 & A2Wednesdays 10-12 & 2-4 P.M.COURSE DESCRIPTIONMP 781 establishes the value base of community organizing practice; presents the basic philosophy, goals, and methodology of both social action and community development approaches to organizing; considers the use of self in the organizing process, including roles and ethical dilemmas; examines and critiques different organizing models; introduces organizational building skills; and increases students’ abilities for developing effective organizational leadership, conducting action research, engaging in strategic analysis, and implementing direct action tactics.This course emphasizes empowerment, participation, economic and social justice; and it features collective action strategies for combating racism, sexism, classism, heterosexism, ageism, mentalism, ableism and other forms of oppression. It also stresses the importance of involving community members in all aspects of the policies, programs, institutions, and decisions which impact their lives.COURSE OBJECTIVESI. To establish the concepts of empowerment, participation, economic andsocial justice as a value base for community organizing practice and to familiarize students with the underlying philosophical and theoreticalprinciples.II. To provide a framework and overview of community organizingapproaches for social change.III. To help students examine the use of self in the organizing process,including roles and ethical dilemmas.IV. To familiarize students with the basic philosophy, goals, and methodology of both social action and community development approaches toorganizing.V. To examine and critique a range of organizing models utilized in urban communities.VI. To help students develop organizational building skills, including groundwork, legitimization, organizing committee formation, and recruitment techniques.VII. To examine a range of recruitment/outreach techniques and to sharpen students’ skills for fostering community participation.VIII. To enable students to learn how to find and develop effectiveorganizational leadership.IX. To develop students' strategic and tactical abilities, including actionresearch methodology, strategic analysis, and direct action techniques. X. To increase students' commitment to community empowerment, theelimination of oppression, and the attainment of economic and socialjustice.By the end of the course, students will be able to:1. Apply community organizing values, principles, methods, and skills to avariety of macro practice interventions.2. Examine the appropriate and ethical use of self in an assortment of rolesin the organizing process.3. Understand the basic philosophy, goals, and methodology of both socialaction and community development approaches to organizing.4. Critically examine a wide variety of community organizing models.5. Exercise organizational building skills, including groundwork,legitimization, organizing committee formation, and recruitment.6. Find and develop indigenous community leadership for grassrootsorganizations.7. Work together with organizational members and leaders to carry outaction research.8. Facilitate a planning process for engaging in strategic analysis.9. Assist organizational leaders and members in implementing appropriatecollective action strategies and direct action tactics.10. Facilitate an evaluation process for assessing the effectiveness oforganizational initiatives, campaigns, and events.TEXTS & READINGSRoots to Power, Second Edition, Lee Staples, Greenwood Press, New York, 2004. (BU Bookstore)Reader - available On-Line Electronic Reserve.A number of handouts also will be distributed.COURSE OUTLINEI. ORGANIZING FOR COLLECTIVE EMPOWERMENT (5 sessions)l. January 18: Introductory Session1. To review the course themes, objectives, readings, and assignments.2. To introduce key concepts for the course and community organizing practice.3. To engage in an exercise that compares and contrasts social action andcommunity development.2. January 25: Organizing Philosophy, Goals, and Approaches1. To familiarize students with the basic values, philosophy, and goals ofcommunity organizing.2. To examine four arenas and two approaches for community organizing.3. To consider the most common sources of power for Grassroots CommunityOrganizations (GCOs).ReadingsCloward, R.A. and Piven, F.F. (2004). “Foreword.” In Roots To Power,pp. xi-xx. Staples, L. (2004). “Power to the People”: Basic Organizing Philosophy and Goals. Chapter 1 in Roots To Power, pp. 1-25.Youngblood, Rev. J. R. (1995). "A Call for Organizing, Confrontation, & Community Building,” Unpublished. Neighborhood Funders Group. (Reader)Kest, S. and Schur, A. (1995). “Organize! Building a Power Base," Shelterforce, November/December. (Reader)Carroll, J. and Minkler, M. (2000). “Freire’s Message for Social Workers: Looking Back, Looking Ahead,” Journal of Community Practice, 8(1): 21-36. (Reader)3. February 1: Organizing Models and Methods1. To become familiar with the major approaches to community organizing inthe United States.2. To introduce a ten-dimensional framework for analyzing GCOs: membership, leadership, staffing, structure, goals, target systems, strategy and tactics,finances, allies, and communications.3. To examine how community organizing can be a collective empowermentstrategy to combat racism, sexism, classism, heterosexism, ageism,mentalism and other forms of oppression.ReadingsDelgado, G. (1997). "Introduction," "Executive Summary" and "Roots of the CO Movement," in G. Delgado, Beyond the Politics of Place, Second Edition. Berkeley, CA: Charden Press, 1-18. (Reader)Staples, L. (2004). “Blueprint s for Action.” In Roots To Power, pp. 47-60.Sen, R. (2003). “Organizing New Constituencies.” Cha pter 2 in Stir It Up. San Francisco: Jossey-Bass, pp. 24-47. (Reader)Deegan, P.E. (1993). "The Independent Living Movement and People with Psychiatric Disabilities: Taking Back Control Over Our Own Lives," Unpublished. National Empowerment Center. (Reader)4. February 8: Staff Goals, Roles, and the Use of Self1. To consider the general goals and roles for staff in collective empowermentefforts.2. To discuss questions and dilemmas about ethics, manipulation, and the useof self as a facilitator of empowerment.3. To explore roles, barriers and opportunities for organizers who are different(“outsiders”) from the community members they work with as compared to “insiders.”ReadingsStaples, L. (2004). “Locate & Relate. Motivate & Integrate. Facil itate & Educate. Activate!: The Role of the Organizer.” Chapter 2 in Roots To Power,pp. 27-45.Gutierrez, L.M., and Lewis, E.A. (2005). “Education, Participation, and Capacity Building in Community Organizing with Women of Color.” In M. Minkler, (Ed.), Community Organizing & Community Building for Health, Second Edition. New Brunswick, NJ: Rutgers University Press, 240-253. (Reader)Morales, J. and Reyes, M. (1998). “Cultural and Political Realities for Community Social Work Practice with Puerto Rican s in the United States.” In F.G. Rivera and J. L. Erlich (Eds.), Community Organizing in a Diverse Society, Third Edition. Boston: Allyn and Bacon, 75-96. (Reader)Tully, C. T., Craig, T., and Nugent, G. (1994). "Should Only Gay and Lesbian Community Organizers Work in Gay and Lesbian Communities?" In M. A. Austin and J. I. Lowe, (Eds.), Controversial Issues In Communities And Organizations. Boston: Allyn and Bacon, 86-96. (Reader)5. February 15: M-POWER: Putting Theory into Practice1. To examine M-POWER, a member-run identity GCO of mental healthconsumers, as a case study in collective empowerment.2. To have a class presentation by M-POWER leaders, members, and staff.3. To have a question, answer, and discussion period with the class and theM-POWER representatives.Readings:Chamberlin, J. (1996). "Psychiatric Survivors and Other Disabilities," Unpublished. National Empowerment Center. (Reader)Deegan, P. E. (1994). "Dare to Vision: Shaping the National Mental Health Agenda on Abuse in the Lives of Women Labeled with Mental Illness," Unpublished. National Empowerment Center. (Reader)Chamberlin, J. (1994). "Choice and Responsibility: Legal and Ethical Dilemmas in Serving Persons with Mental Disabilities," Unpublished. National Empowerment Center. (Reader)Deegan, P.E. (1988). “Recovery: The Lived Experience of Rehabilitation," Psychosocial Rehabilitation Journal, 11(4): 11-19, April. (Reader)Deegan, P.E. (1988). "Lowell M-POWER Chapter Foundation Meeting: A Keynote Address," Unpublished. (Reader)II. ORGANIZATIONAL DEVELOPMENT (4 sessions)6. February 22: The Social Action Approach1. To familiarize students with the basic philosophy, goals, and methodology ofa range of social action organizations.2. To compare, contrast, and critique the strengths and weaknesses of thesesocial action models.3. To explore how the role of a social action organizer converges and divergeswith other social work roles.ReadingsDelgado, G. (1986). "The ACORN Model." In G. Delgado, Organizing the Movement: The Roots and Growth of ACORN. Philadelphia: Temple University Press, 63-90. (Reader)Hanna, M.G. and Robinson, B. (1994). "Lessons for Academics from Grassroots Community Organizing: A Case Study - The Industrial Areas Foundation," Journal of Community Practice, 1(4): 63-94. (Reader)Anderson, D. (1992). "M-POWER: A Case Study - People with Psychiatric Disabilities Organize," Unpublished. Boston University School of Social Work. (Reader)7. March 1: The Community Development Approach1.To examine and critique a range of community development models.2.To compare and critique social action & community development models oforganizing.3. To explore the application of these models for students’ own macro practice.ReadingsO’Do nnell, S. M. and Karanja, S. T. (2000). “Transformative Community Practice: Building a Model for Developing Extremely Low Income African-American Communities,” Journal of Community Practice, 7(3): 67-84. (Reader)Fisher, R. and Shragge, E. (2000). “Challenging Community Organizing: Facing the 21st Century,” Journal of Community Practice, 8(3): 1-19. (Reader)Pantoja, A. and Perry, W. (1998). "Community Development and Restoration: A Perspective and Case Study." In F. G. Rivera and J. L. Erlich (Eds.), Community Organizing in a Diverse Society, Third Edition. Boston: Allyn & Bacon, 220-242. (Reader)Midgley, J. and Livermore, M. (1998). "Social Capital and Local Economic Development: Implications for Community Social Work Practice," Journal of Community Practice,5(1/2): 29-40. (Reader)Traynor, B. (1993). "Community Development & Community Organizing," Shelter Force, March/April, pp. 4-7. (Reader)March 8: No Class - Mid Semester Recess8. March 15: Building Community Organization1. To familiarize students with common steps in any organizing process.2. To examine a range of recruitment/outreach techniques and to sharpenstudents' skills through role playing.3. To demonstrate the use of slide shows, housemeetings, and videotapes asorganizing tools.ReadingsStaples, L. (2004). "The Organizing Process." In Roots To Power, pp. 61-98 and “ACORN Organizing Drive Materials” Appendix, pp. 343-352.Kaye, G. (1997). “The Six “R’s” of Participation.” In M. Minkler, (Ed.), Community Organizing & Community Building for Health. New Brunswick, NJ: Rutgers University Press, 372-73. (Reader)Wilkinson, G. (1990). "We're Fired Up!: Tenants Unite at Franklin Hill," Unpublished. Boston University School of Social Work. (Reader)Pecukonis, E. V. and Wenocur, S. (1994). "Perceptions of Self and Collective Efficacy in Community Organization Theory and Practice," Journal of Community Practice, 1(2): 5-21. (Reader)Beckwith, D. (2004). “Memberships and Dues.” In Roots To Power, pp. 331-334.9. March 22: Developing Leaders1. To examine the various definitions, functions and styles of leadership.2. To discuss how leadership is “found” and “developed.”3.To consider the use of self in the leadership development process and theapplication of specific group work and community organizing approachesand methods.ReadingsStaples, L. (2004). "Broadening the Base" and “Leadership Development.”In Roots To Power, pp. 185-195.Bobo, K., Kendall, J. and Max, S. (2001). "Developing Leadership." Chapter 11 in Organizing for Social Change, Third Edition. Santa Ana, CA: Seven Locks Press, pp. 118-126. (Reader)Sen, R. (2003). “Leading the Way.” Chapter 5 in Stir It Up. San Francisco: Jossey-Bass, pp. 97-115. (Reader)Kahn S. (1991). “Leaders.” In S. Kahn, Organizing: A Guide For Grassroots Leaders. Silver Spring, MD: NASW Press, 21-49. (Reader)Cortes, E. “Making the Public Leaders,” Unpublished. (Reader)Arrien, A. (1997). “Lessons from Geese.” In M. Minkler, (Ed.), Community Organizing & Community Building for Health. New Brunswick, NJ: Rutgers University Press. (Reader)III. ASSESSMENT AND ACTION (4 sessions)10. March 29: Analyze, Strategize, and Catalyze1. To introduce a model for framing and analyzing issues.2. To learn how to develop an effective strategy.3. To familiarize students with the principles and methodology of actionresearch.ReadingsStaples, L. (2004). “Analyze, Strategize, and Catalyze.” Chapter 4 in Roots To Power, pp. 99-141 and “Nuts and Bolts, Some Do’s and Don’ts –Introduction,” pp. 219-221.Collette, W. (2004). “Research for Organizing.” In Roots To Power, pp. 222-233. McCreight, M. (2004). “Using the Law as Leverage.” In Roots To Power, pp. 254-263.Roberts-DeGennaro, M. (2004). “Using Technology for Grassroots Organizing.” In Roots To Power, pp. 270-281.11. April 5: Action Plans, Tactics, and Countertactics1. To learn the basic components for developing and implementing an actionplan.2. To en gage in a strategy exercise that increases students’ abilities to createand conduct effective action plans.3. To familiarize students with a variety of direct action tactics and oppositioncountertactics.ReadingsStaples, L. (2004). "Moving into Action": Making and Carrying Out Action Plans. Roots To Power, pp. 143-170.Rivera, F.G., Erlich, J. L., and Zippay, A. (1994). "Should Today's Community Organizers Use the Tactics Handed Down from Earlier Generations?" In M. A. Austin and J. I. Lowe, (Eds.), Controversial Issues In Communities and Organizations. Boston: Allyn and Bacon, 112-127. (Reader)Beck, E.L. and Eichler, M. (2000). “Consensus Organizing: A Practice Model for Community Building,” Journal of Community Practice, 8(1): 87-102. (Reader)Miller, M. (1997). “Leadership Teams.” In M. Minker, (Ed.), Community Organizing & Community Building for Health. New Brunswick, NJ: Rutgers University Press, 376-77. (Reader)12. April 12: From Analysis to Action1. To examine ACORN’s multistage, multilevel campaign against HouseholdFinance.2. To discuss and critique case studies in which social action was undertaken.3. To engage in a class exercise to sharpen students' direct action skills.ReadingsHurd, M. and D onner, L. (2004). “ACORN’s Campaign Against Household Finance.” In Roots To Power, pp. 170-183.Alvarez, P. (1991). "The Case of the Overflowing Dumpsters: A Maintenance Campaign of the Faneuil Tenants Organization," Unpublished. Boston University School of Social Work. (Reader)Wohlfeiler, D. (1997). "Community Organizing and Community Building among Gay and Bisexual Men: The STOP AIDS Project." In M. Minkler (Ed.), Community Organizing & Community Building for Health. New Brunswick, NJ: Rutgers University Press. (Reader)Kaminstein, D. S. (1995). "A Resource Mobilization Analysis of a Failed Protest," Journal of Community Practice, 2(2): 5-32. (Reader)Minkler, M. (2005). “Community Organizing among the Elderly Poor in San Francisco’s Tenderloin District.” In M. Minkler (Ed.), Community Organizing & Community Building for Health. Second Edition. New Brunswick, NJ: Rutgers University Press, 272-287. (Reader)Poindexter, C.C. (1997). “Sociopolitical Antecedents to Stonewall: Analysis of the Origins of the Gay Rights Movement in the United States,” Social Work, 42(6): 607-615. (Reader)April 19: No Class – Reading Week13. April 26: Anatomy of an Organizing Campaign1. To have a presentation to the class by leaders and activists from acurrent or recent social action campaign.2. To critique the strengths and weaknesses of this campaign.3. To have a question, answer, and discussion period with the class and the guest speakers.ReadingsMeredith, J.C. and Dunham, C. (2004). “Real Clout Rules and Tools for Winning Public Policy Campaigns.” In Roots To Power, pp. 234-253.Wilkinson, G. (1997). “Massachusetts Senior Action Council Public Housing Campaign,” Unpublished. Boston University School of Social Work.(Reader) Chav ez, C. “A Union in the Community,” Unpublished.(Reader)Pillsbury, G. (2004). “Grassroots Community Organizations and Voting.” In Roots To Power, pp. 289-301.IV. STEPPING BACK, LOOKING AHEAD14. May 3: Overview and Evaluation1. To discuss the potential and challenges for community organizing in theTwenty First Century.2. To examine the classic debate about organizing vs. mobilizing.3. To evaluate this course.ReadingsStaples, L. (2004). “Making Change with COINS.” In Roots To Power, pp. 210-218.Cloward, R. and Mondros, J. B. (1994). "Should Charismatic Leaders be Recruited by Grassroots Organizations to Promote Social Change?" In M. A. Austin and J. I. Lowe, (Eds.), Controversial Issues In Communities And Organizations. Boston: Allyn and Bacon, 23-37. (Reader)Delgado, G. (1997). "Major Accomplishments, Limitations and New Developments in Community Organization," and “Opportunities for Support,” in G. Delgado, Beyond the Politics of Place, Second Edition. Berkeley, CA: Chardon Press, 47-64. (Reader)Bobo, K., Kendall, J. and Max, S. (2001). "Working for the Long Haul." Chapter 25 in Organizing for Social Change, Third Edition. Santa Ana, CA: Seven Locks Press, pp. 338-344. (Reader)ASSIGNMENTSThere will be two assignments - both take-home exams.COURSE GRADING CRITERIAThere are two written assignments for this course, each accounting for one third of your final grade. Class participation will constitute the other third of your final grade. You are expected to attend classes regularly, complete all assigned readings, and participate actively in class discussions and exercises.COURSE POLICIESAttendance:Students are expected to attend all class sessions and to inform the instructor in advance of any absences. Failure to attend class sessions may have a negative effect on the student’s course grade.Academic honesty:Papers and presentations in the School of Social Work must meet standards of academic honesty and integrity, avoiding any possibility of plagiarism or other forms of academic misconduct. For specific information about the BUSSW policy regarding academic misconduct, see Ways and Means 2002-2004, pp. 64 – 67. Students with disabilities:If you have a disability and want to request reasonable accommodation, the University requires that you consult with Boston University’s Office of Disability Services for information regarding this process.Writing style and references:Students are expected to follow the editorial and reference standards set out in the Publication Manual of the American Psychological Association(2001). This manual is available at the Mugar Library reference desk. A Summary of APA Guidelines for Citations in Writing is provided to students at BUSSW Orientation. Academic writing assistance:If you would like academic writing assistance, contact the BUSSW Office of Student Services for information about available supports.。

BU4236FVE-TR中文资料

1 2 3
0.13 0.05
1
2
0.05
s
0.13 0.05 0.03
1.25Max.
1.6 1 2 3
0.6Max.
1.05MAX
0.5
1Hale Waihona Puke 1 0.050.05 0.05
0.22 0.05 0.08 M
0.05 0.05
0.9 0.05
0.32
0.05 0.04
0.42
0.05 0.04
0.42 0.95
Circuit current( A Typ.) ON OFF
Hysterisis voltage(V Typ.)
Output current when “L”(mA Typ.)
VDD=2.4V,VDS=0.5V
Delay circuit resistor(M )Typ.
Package
SSOP5 (SMP5C2) / 5.0 10.0 VSOF5 (EMP5) / SOP4 (SC82AB)
1/1
元器件交易网
Appendix
Notes
No technical content pages of this document may be reproduced in any form or transmitted by any means without prior permission of ROHM CO.,LTD. The contents described herein are subject to change without notice. The specifications for the product described in this document are for reference only. Upon actual use, therefore, please request that specifications to be separately delivered. Application circuit diagrams and circuit constants contained herein are shown as examples of standard use and operation. Please pay careful attention to the peripheral conditions when designing circuits and deciding upon circuit constants in the set. Any data, including, but not limited to application circuit diagrams information, described herein are intended only as illustrations of such devices and not as the specifications for such devices. ROHM CO.,LTD. disclaims any warranty that any use of such devices shall be free from infringement of any third party's intellectual property rights or other proprietary rights, and further, assumes no liability of whatsoever nature in the event of any such infringement, or arising from or connected with or related to the use of such devices. Upon the sale of any such devices, other than for buyer's right to use such devices itself, resell or otherwise dispose of the same, no express or implied right or license to practice or commercially exploit any intellectual property rights or other proprietary rights owned or controlled by ROHM CO., LTD. is granted to any such buyer. Products listed in this document use silicon as a basic material. Products listed in this document are no antiradiation design.

bu9796 经典资料

○Product structure ：Silicon monolithic integrated circuit ○This product is not designed protection against radioactive rays. Standard LCD Segment DriverBU9796Axxx SeriesMAX 80 segments (SEG20×COM4)●FeaturesIntegrated RAM for display data (DDRAM):20 x 4 bit (Max 80 Segment) LCD drive output :4 Common output, Max 20 Segment output Integrated Buffer AMP for LCD driving Integrated Oscillator circuit No external componentsLow power consumption design●ApplicationsTelephone FAXPortable equipment (POS, ECR, PDA etc.) DSC DVC Car audioHome electrical appliance Meter equipment etc.●Key Specifications■ Supply Voltage Range: +2.5V to +5.5V ■ Operating Temperature Range: -40°C to +85°C ■ Max Segments: BU9796AFS 80 Segments BU9796AMUV 48 SegmentsDisplay Duty: 1/4 ■Bias: 1/2, 1/3 selectable ■ Interface: 2wire serial interface●Package W (Typ.) x D (Typ.) x H (Max.)●Typical Application CircuitUsing internal oscillatorFigure 1. Typical application circuitSSOP-A3213.60mm x 7.80mm x 2.01mmVQFN024V4040 4.00mm x 4.00mm x 1.00mm●Block Diagram / Pin Configuration / Pin DescriptionBU9796AFSFigure 2. Block Diagram Figure 3. Pin Configuration (TOP VIEW)Table 1 Pin DescriptionTerminal Terminal No. I/OFunctionTEST1 26 ITest input (ROHM use only) Must be connect to VSSTEST2 27 ITest input (ROHM use only)TEST2=”L”: POR circuit enableTEST2=”H”: POR circuit disenable, refer to “Cautions in Power ON/OFF” OSCIN 28 I External clock inputExternal clock and Internal clock can be selected by command.Must be connect to VSS when use internal oscillation circuit. SDA 30 I/O serial data in-out terminal SCL29Iserial data transfer clockVSS 25GND VDD 24 Power supply VLCD 23 Power supply for LCD driving SEG0-19 31,321-18 O SEGMENT output for LCD driving COM0-319-22OCOMMON output for LCD drivingSDASCL S E G 1S E G 0S D AS C LO S C I NT E S T 2T E S T 1V S SV D DV L C DC O M 3C O M 2C O M 1C O M 0S E G 19S E G 18S E G 2S E G 3S E G 4S E G 5S E G 6S E G 7S E G 8S E G 9S E G 10S E G 11S E G 12S E G 13S E G 14S E G 15S E G 16S E G 17●Block Diagram / Pin Configuration / Pin Description- continuedBU9796AMUVFigure 4. Block Diagram Figure 5. Pin Configuration (BOTTOM VIEW)Table 1 Pin DescriptionTerminal Terminal No. I/OFunctionTEST1 23 ITest input (ROHM use only) Must be connect to VSSTEST2 24 ITest input (ROHM use only)TEST2=”L”: POR circuit enableTEST2=”H”: POR circuit disenable, refer to “Cautions in Power ON/OFF” OSCIN 1 I External clock inputExternal clock and Internal clock can be selected by command.Must be connect to VSS when use internal oscillation circuit. SDA 3 I/O serial data in-out terminal SCL2Iserial data transfer clockVSS 22 GND VDD 21 Power supply VLCD 20Power supply for LCD driving SEG0-11 4-15 O SEGMENT output for LCD driving COM0-316-19OCOMMON output for LCD drivingEXT-PAD -(*1) - Substrate*1: To radiate heat, please contact a board with the EXT-PAD which is located at the bottom side of VQFN024V4044 package.Please supply VSS level or Open state as the input condition for this PAD.SDA SCLS C I NC LD AE G 0E G 1E G 2SEG3SEG4SEG5SEG6SEG7SEG8C O M 2C O M 1C O M 0S E G 1S E G 1S E G 9Absolute Maximum Ratings (VSS=0V)Parameter Symbol Ratings Unit Remarks Power Supply Voltage1 VDD -0.5 to +7.0 V Power supplyPower Supply Voltage2 VLCD -0.5 to VDD V LCD drive voltageAllowable loss Pd 0.64 WWhen use more than Ta=25℃,subtract6.4mW per degree. (BU9796AFS)(Package only)0.27 WWhen use more than Ta=25℃,subtract2.7mW per degree. (BU9796AMUV)(Package only)Input voltage range VIN -0.5 to VDD+0.5 V Operational temperaturerangeTopr -40 to +85 ℃Storage temperature range Tstg -55 to +125 ℃●Recommended Operating Ratings (Ta=-40°C to +85°C,VSS=0V)Parameter Symbol RatingsUnit RemarksMIN TYP MAXPowerSupplyVoltage1 VDD 2.5 - 5.5 VPowersupply Power Supply Voltage2 VLCD 0 - VDD-2.4V LCD drive voltage●Electrical CharacteristicsDC Characteristics (VDD=2.5V to 5.5V, VLCD=0V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified)Parameter Symbol LimitsUnit ConditionsMIN TYP MAX“H” level input voltage VIH 0.7VDD- VDD V SDA,SCL“L” level input voltage VIL VSS - 0.3VDD V SDA,SCL“H” level input current IIH - - 1 µA SDA,SCL“L” level input current IIL -1 - - µA SDA,SCLLCD Driver on resistance SEG RON - 3 -kΩIload=±10µA COM RON - 3 - kΩVLCD supply voltage VLCD 0 - VDD-2.4V VDD-VLCD≥2.4V Standby current IDD1 - - 5 µA Display off, Oscillation offPower consumption IDD2 - 12.5 30 µA VDD=3.3V, VLCD=0V, Ta=25℃Power save mode1, FR=71Hz 1/3 bias, Frame inverseOscillation Characteristics (VDD=2.5V to 5.5V, VLCD=0V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified)Parameter Symbol LimitsUnit ConditionsMIN TYP MAXFrame frequency fCLK 56 80 104 Hz FR = 80Hz setting, VDD=3.3V●Electrical Characteristics - continuedMPU interface Characteristics (VDD=2.5V to 5.5V, VLCD=0V, VSS=0V, Ta=-40℃ to 85℃, unless otherwise specified)Parameter Symbol LimitsUnit ConditionsMIN TYP MAXInput rise time tr - - 0.3 µs Input fall time tf - - 0.3 µs SCL cycle time tSCYC 2.5 - - µs “H” SCL pulse width tSHW 0.6 - - µs “L” SCL pulse width tSLW 1.3 - - µs SDA setup time tSDS 100 - - µsSDA hold time tSDH 100 - - us Buss free timetBUF 1.3 - - µs START condition hold time tHD;STA 0.6 - - µs START condition setup time tSU;STA 0.6 - - µs STOP condition setup time tSU;STO0.6--µsFigure6. Interface Timing●I/O equivalent circuitFigure7. I/O equivalent circuitSDASCLSDAVDDVLCDVSS SDA VSS●Example of recommended circuit<BU9796AFS>Internal Oscillator circuit use modeVDDExternal clock input modeFigure8. Example of recommended circuit●Example of recommended circuit - continued<BU9796AMUV>Internal Oscillator circuit use modeVDDExternal clock input modeFigure 9. Example of recommended circuit●Functional descriptions○Command /Data transfer methodThis device is controlled by 2wire signal (SDA, SCL).Figure10. 2-SPI Command/Data transfer FormatIt has to generate the condition such as START condition and STOP condition in 2wire serial interface transfer method. Figure11. Interface protcolMethod of how to transfer command and data is shown as follows.1) Generate “START condition”. 2) Issue Slave address.3) Transfer command and display data.○AcknowledgeData format is 8bits and return Acknowledge after transfer 8bits data.When SCL 8th=’L’ after transfer 8bit data (Slave Address, Command, Display Data), output ’L’ and open SDA line. When SCL 9th=’L’, stop output function.(As Output format is NMOS-Open-Drain, can’t output ‘H’ level.)If no need Acknowledge function, please input ‘L’ level from SCL 8th=’L’ to SCL 9th=’L’. Figure 12. Acknowledge timingSTART conditionSTOP conditionSDA SCL Slave addressAcknowledgeSTART conditionSTOP condition○Command transfer methodIssue Slave Address (“01111100”) after generate “START condition”. 1byte after Slave Address always becomes command input.MSB (“command or data judge bit”) of command decide to next data is command or display data. When set “command or data judge bit”=‘1’, next byte will be command. When set “command or data judge bit”=‘0’, next byte data is display data.Once it becomes display data transfer condition, it cannot input command.When want to input command again, please generate “START condition” once.If “START condition” or “STOP condition” are inputted in the middle of command transmission, command will be canceled.If Slave address is continuously inputted following “START condition”, it will be in command input condition. Please input “Slave Address” in the first data transmission after “START condition”.When Slave Address cannot be recognized in the first data transmission, Acknowledge does not return and next transmission will be invalid. When data transmission is in invalid status, if “START conditions” are transmitted again, it will return to valid status.Please consider the MPU interface characteristic such as Input rise time and Setup/Hold time when transferring command and data (Refer to MPU Interface).○Write display and transfer method<BU9796AFS>This device has Display Data RAM (DDRAM) of 20×4=80bit.The relationship between data input and display data, DDRAM data and address are as follows;8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data.Data can be continuously written in DDRAM by transmitting Data continuously.(When RAM data is written successively after writing RAM data to 13h (SEG19), the address is returned to 00h (SEG0) by the auto-increment function.DDRAM address00 01 02 03 04 05 06 07 ・・・ 11h 12h 13h BIT0 a e i m COM0 1 b f j n COM1 2 c g k o COM2 3 d h l p COM3 SEG0 SEG1 SEG2 SEG3 SEG4SEG5SEG6SEG7SEG17 SEG18 SEG19Data transfer to DDRAM happens every 4bit data.So it will be finished to transfer with no need to wait ACK.<BU9796AMUV>This device has Display Data RAM (DDRAM) of 12×4=48bit.The relationship between data input and display data, DDRAM data and address are as follows;8 bit data will be stored in DDRAM. The address to be written is the address specified by ADSET command, and the address is automatically incremented in every 4bit data.Data can be continuously written in DDRAM by transmitting Data continuously.(When RAM data is written successively after writing RAM data to 13h (SEG19), the address is returned to 00h (SEG0) by the auto-increment function.Dummy dataData transfer to DDRAM happens every 4bit data.So it will be finished to transfer with no need to wait ACK.○OSCILLATORThe clock signals for logic and analog circuit can be generated from internal oscillator or external clock. If internal oscillator circuit is used, OSCIN must be connected to VSS level.*When using external clock mode, input external clock from OSCIN terminal after ICSET command setting.Figure 13. Internal oscillator circuit mode Figure 14. Ext clock input mode○ LCD Driver Bias CircuitThis device generates LCD driving voltage with on-chip Buffer AMP . And it can drive LCD at low power consumption. *1/3 and 1/2Bias can set in MODESET command.*Line and frame inversion can set in DISCTL command.Refer to the “LCD driving waveform” about each LCD driving waveform.○ Blink timing generatorThis device has Blink function.* This device will be Blink mode with BLKCTL command.Blink frequency varies widely by characteristic of fCLK, when internal oscillation circuit. About the characteristics of fCLK, refer to Oscillation Characteristics.○ Reset initialize conditionInitial condition after execute Software Reset is as follows. ・Display is OFF.・DDRAM address is initialized (DDRAM Data is not initialized). Refer to Command Description about initialize value of register.●Command / Function ListDescription List of Command / FunctionNo. Command Function1 Display Control (DISCTL)Set LCD display mode 1 2 Mode Set (MODESET) Set LCD drive mode 3 Address Set (ADSET) Set LCD display mode 2 4 Set IC Operation (ICSET) Set IC operation 5 Blink Control (BLKCTL) Set blink mode 6All Pixel Control (APCTL)Set pixel conditionClock●Detailed command descriptionD7 (MSB) is bit for command or data judgment. Refer to Command and data transfer method.C: 0: Next byte is RAM write data. 1: Next byte is command.○Display control (DISCTL)MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 0 1 P4 P3 P2 P1 P0Set Power save mode FRPower save mode FR P4 P3 Reset initialize conditionNormal mode (80Hz) 0 0 ○Power save mode1 (71Hz) 0 1 Power save mode2 (64Hz) 1 0 Power save mode3 (50Hz)11* Power consumption is reduced in the follow order:Normal mode > Power save mode1 > Power save mode2 > Power save mode3Set LCD drive waveformSetup P2 Reset initialize condition Line inversion 0 ○Frame inversion1* Power consumption is reduced in the follow order: Line inversion > Frame inversionRefer to LCD drive waveformSet Power save mode SRSetup P1 P0 Reset initialize condition Power save mode1 0 0 Power save mode2 0 1 Normal mode 1 0 ○High power mode11* Power consumption is increased in the follow order:Power save mode 1 < Power save mode 2 < Normal mode < High power mode(Reference current consumption data)Setup Current consumption Power save mode 1 ×0.5 Power save mode 2 ×0.67 Normal mode ×1.0 High power mode×1.8*Above data is reference. It depends on Panel load.(Note) The setting of Power save mode FR, LCD waveform, Power save mode will influence the following display image qualities.Please select most suitable value from current consumption and display image quality with LCD panel.ModeFlicker Image quality, contrastPower save mode FR ○ -LCD waveform○○ Power save mode SR -○○Mode Set (MODE SET)MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 1 0 * P3 P2 * * ( * : Don’t care)Set display ON and OFFSetting P3 Reset initialize condition Display OFF 0 ○Display ON1Display OFF : Regardless of DDRAM data, all SEGMENT and COMMON output will be stopped after 1frame offdata write. Display OFF mode will be disabled after Display ON command.Display ON : SEGMENT and COMMON output will be active and start to read the display data from DDRAM.Set bias levelsetup P2 Reset initialize condition 1/3 Bias○1/2 Bias 1Refer to LCD driving waveform○Address set (ADSET)MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 0 0 P4 P3 P2 P1 P0The range of address can be set as 00000 to 10011(2).Don’t set out of range address, otherwise address will be set 00000.○Set IC Operation (ICSET)MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 1 1 0 1 * P1 P0 ( * : Don’t care)Set software reset executionSetup P1No operation0 Software Reset execute1This command will be set initialize condition.Set oscillator modesetup P0 Reset initialize conditionInternal oscillation 0 ○External clock input1Internal oscillation: Must be connected to VSS.External clock input: Input external clock from OSCIN terminal<Frame frequency Calculation at external clock mode>DISCTL 80Hz setting : Frame frequency [Hz] = external clock [Hz] / 512 DISCTL 71Hz setting : Frame frequency [Hz] = external clock [Hz] / 576 DISCTL 64Hz setting : Frame frequency [Hz] = external clock [Hz] / 648 DISCTL 53Hz setting : Frame frequency [Hz] = external clock [Hz] / 768Command(internal)(internal) EXT clock (OSCIN)Figure 15. Oscillator mode change timing○Blink control (BLKCTL)MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 1 1 1 0 * P1 P0 ( * : Don’t care)Set blink modeBlink mode (Hz) P1 P0 Reset initialize conditionOFF 0 0 ○0.5 0 1 1 1 0 2 1 1The Blink cycle varies by fclk characteristic when the internal oscillation circuit is used.Refer to the item of oscillation characteristic for the fclk characteristic.○All Pixel control (APCTL)MSB D7 D6 D5 D4 D3 D2 D1 LSB D0 C 1 1 1 1 1 P1 P0All display set ON, OFFAPON P1 Reset initialize conditionNormal 0 ○ All pixel ON 1APOFF P0 Reset initialize condition Normal 0 ○All pixel OFF 1All pixels ON: All pixels are ON regardless of DDRAM data All pixels OFF: All pixels are OFF regardless of DDRAM data(Note) This command is valid in Display on status. The data of DDRAM don’t change by this command. If set both P1 and P0 =”1”, APOFF will be select.●LCD driving waveform(1/3bias)Line inversion Frame inversionFigure 16. LCD waveform at line inversion (1/3bias) Figure 17. LCD waveform at frame inversion (1/3bias)COM0COM1COM2COM3SEGn SEGn+1SEGn+2SEGn+3stateAstateBCOM0COM1COM2COM3SEGn SEGn+1SEGn+2SEGn+3stateAstateB(1/2bias)Line inversion Frame inversionFigure 18. LCD waveform in line inversion (1/2bias) Figure 19. LCD waveform in frame inversion (1/2bias)stateAstateBSEGnSEGn+1SEGn+2SEGn+3COM0COM1COM2COM3stateAstateBSEGnSEGn+1SEGn+2SEGn+3COM0COM1COM2COM3●Example of display dataIf LCD layout pattern is like as Figure 20, Figure 21, and display pattern is like as Figure . Display data will be shown as follows;Figure 20. E.g. COM line patternFigure 21. E.g. SEG line patternFigure 22. E.g. Display pattern<DDRAM data mapping in Figure displaypattern> S E G 0 S E G 1 S E G 2 S E G 3 S E G 4 S E G 5 SEG 6S E G 7 S E G 8 S E G 9 S E G 10 S E G 11 S E G 12 S E G 13 S E G 14 S E G 15 S E G 16 S E G 17 S E G 18 S E G 19COM0 D0 0 1 1 0 1 1110100000 0 0 000COM1 D1 0 0 1 1 1 0011110000 0 0 000COM2 D2 0 0 0 1 0 1001110000 0 0 000COM3 D31111Address00h 01h 02h 03h 04h 05h 06h 07h 08h 09h 0Ah 0Bh 0Ch 0Dh 0Eh 0Fh 10h 11h 12h 13h●Initialize sequencePlease follow below sequence after Power-on to set this LSI to initial condition.Power on↓STOP condition↓START condition↓Issue slave address↓Execute Software Reset by sending ICSET command.*Each register value and DDRAM address, DDRAM data are random condition after power on till initialize sequence is executed.●Start sequence○Start sequence example1No. Input D7 D6 D5D4D3D2D1D0Descriptions1 Power on VDD=0→5V (Tr=0.1ms)↓IC100µs Initialize2 wait↓3 Stop Stopcondition↓condition4 Start Start↓5Slave address01111100Issue slave address↓Reset6 ICSET 1 1 101* 10Software↓7 BLKCTL 1 1 110* 01↓8 DISCTL 1 0 111100↓9 ICSET 1 1 101* 01↓10 ADSET 0 0 000000RAM address set↓01h-11 DisplayData * * * * * * * * address 00h03h-Data * * * * * * * * address 02h Display……-13hData * * * * * * * * address 12h Display↓condition12 Stop Stop↓condition13 Start Start↓14Slave address01111100Issue slave address↓ON15 MODESET 1 1 0* 10* * Display↓condition16 Stop Stop○Start sequence example2Abnormal operation may occur in BU9796A due to the effect of noise or other external factor.To avoid this phenomenon, please input command according to sequence described above during initialization, displayON/OFF and refresh of RAM data.Initialize Sequence DISPON SequenceRAM write Sequence DISPOFF Sequence This LSI is initialized with Initialize Sequence. And start to display with DISPON Sequence.This LSI will update display data with RAM write Sequence. And stop the display with DISPOFF sequence.If you want to restart to display, This LSI will restart to display with DISPON Sequence.●DISCTL setup flow chartDISCTL setting "10100011" DISCTL setting "10111100"DISCTL setting "10110100" DISCTL setting "10101100"●Cautions in Power ON/OFFThis device has “P .O.R” (Power-On Reset) circuit and Software Reset function.Please keep the following recommended Power-On conditions in order to power up properly.Please set power up conditions to meet the recommended tR, tF, tOFF, and Vbot spec below in order to ensure P .O.R operation*It has to set TEST1=”L” to be valid in POR circuit.Recommended condition of tR, tF, tOFF, Vbot (Ta=25℃) tR tF tOFF VbotLess than 1ms Less than 1ms More than 100ms Less than 0.1VIf it is difficult to meet above conditions, execute the following sequence after Power-On.* It has to keep the following sequence in the case of TEST2=”H”. As POR circuit is invalid status.But it is not able to accept Command input in Power off status, it has to take care that software reset is not perfectly alternative method of POR function.(1) Generate STOP conditionFigure 44. Stop conditionFigure 24. Stop Condition(2) Generate START condition.Figure 25. Start Condition(3) Issue slave address(4) Execute Software Reset (ICSET) command●Operational Notes(1) Absolute Maximum RatingsAn excess in the absolute maximum ratings, such as supply voltage, temperature range of operating conditions, etc., canbreak down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit.If any special mode exceeding the absolute maximum ratings is assumed, consideration should be given to take physicalsafety measures including the use of fuses, etc.(2) Operating conditionsThese conditions represent a range within which characteristics can be provided approximately as expected.The electrical characteristics are guaranteed under the conditions of each parameter.(3) Reverse connection of power supply connectorThe reverse connection of power supply connector can break down ICs. Take protective measures against thebreakdown due to the reverse connection, such as mounting an external diode between the power supply and the IC’spower supply terminal.(4) Power supply lineDesign PCB pattern to provide low impedance for the wiring between the power supply and the GND lines. In this regard,or the digital block power supply and the analog block power supply, even though these power supplies has the samelevel of potential, separate the power supply pattern for the digital block from that for the analog block, thus suppressingthe diffraction of digital noises to the analog block power supply resulting from impedance common to the wiring patterns.For the GND line, give consideration to design the patterns in a similar manner.Furthermore, for all power supply terminals to ICs, mount a capacitor between the power supply and the GND terminal.At the same time, in order to use an electrolytic capacitor, thoroughly check to be sure the characteristics of the capacitorto be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining theconstant.(5) GND voltageMake setting of the potential of the GND terminal so that it will be maintained at the minimum in any operating state.Furthermore, check to be sure no terminals are at a potential lower than the GND voltage including an actual electrictransient.(6) Short circuit between terminals and erroneous mountingIn order to mount ICs on a set PCB, pay thorough attention to the direction and offset of the ICs. Erroneous mounting canbreak down the ICs. Furthermore, if a short circuit occurs due to foreign matters entering between terminals or betweenthe terminal and the power supply or the GND terminal, the ICs can break down.(7) Operation in strong electromagnetic fieldBe noted that using ICs in the strong electromagnetic field can malfunction them.(8) Inspection with set PCBOn the inspection with the set PCB, if a capacitor is connected to a low-impedance IC terminal, the IC can suffer stress.Therefore, be sure to discharge from the set PCB by each process. Furthermore, in order to mount or dismount the setPCB to/from the jig for the inspection process, be sure to turn OFF the power supply and then mount the set PCB to thejig. After the completion of the inspection, be sure to turn OFF the power supply and then dismount it from the jig.In addition, for protection against static electricity, establish a ground for the assembly process and pay thoroughattention to the transportation and the storage of the set PCB.(9) Input terminalsIn terms of the construction of IC, parasitic elements are inevitably formed in relation to potential. The operation of theparasitic element can cause interference with circuit operation, thus resulting in a malfunction and then breakdown of theinput terminal. Therefore, pay thorough attention not to handle the input terminals, such as to apply to the input terminalsa voltage lower than the GND respectively, so that any parasitic element will operate. Furthermore, do not apply a voltageto the input terminals when no power supply voltage is applied to the IC. In addition, even if the power supply voltage isapplied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value ofelectrical characteristics.(10) Ground wiring patternIf small-signal GND and large-current GND are provided, It will be recommended to separate the large-current GNDpattern from the small-signal GND pattern and establish a single ground at the reference point of the set PCB so thatresistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of thesmall-signal GND. Pay attention not to cause fluctuations in the GND wiring pattern of external parts as well.(11) External capacitorIn order to use a ceramic capacitor as the external capacitor, determine the constant with consideration given to adegradation in the nominal capacitance due to DC bias and changes in the capacitance due to temperature, etc.(12) No Connecting input terminalsIn terms of extremely high impedance of CMOS gate, to open the input terminals causes unstable state. And unstablestate brings the inside gate voltage of p-channel or n-channel transistor into active. As a result, battery current mayincrease. And unstable state can also causes unexpected operation of IC. So unless otherwise specified, input terminalsnot being used should be connected to the power supply or GND line.(13) Rush currentWhen power is first supplied to the CMOS IC, it is possible that the internal logic may be unstable and rush current mayflow instantaneously. Therefore, give special condition to power coupling capacitance, power wiring, width of GND wiring,and routing of connections.●Ordering InformationB U 9 7 9 6 A x x x - E 2Part Number PackagePackaging and forming specification E2: Embossed tape and reel(SSOP-A32/ VQFN024V4040)FSMUV: SSOP-A32: VQFN024V4040●LineupSegment outputCommon output Package Orderable Part Number20 4SSOP-A32 Reel of 2000BU9796AFS-E2 12VQFN024V4040Reel of 2500BU9796AMUV-E2Status of this documentThe Japanese version of this document is formal specification. A customer may use this translation version only for a reference to help reading the formal version.If there are any differences in translation version of this document formal version takes priority.●Physical Dimension Tape and Reel Information BU9796AFS(SSOP-A32)BU9796AMUV(VQFN024V4040)●Marking DiagramPart Number Package Part Number Marking BU9796AFS SSOP-A32 BU9796A BU9796AMUV VQFN024V40409796A●Revision HistoryDate Revision ChangesRelease31.Aug.2012 001 NewNotice●General Precaution1) Before you use our Products, you are requested to carefully read this document and fully understand its contents.ROHM shall not be in any way responsible or liable for failure, malfunction or accident arising from the use of any ROHM’s Products against warning, caution or note contained in this document.2) All information contained in this document is current as of the issuing date and subject to change without any priornotice. Before purchasing or using ROHM’s Products, please confirm the latest information with a ROHM sales representative.●Precaution on using ROHM Products1) Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you intend to use our Products in devices requiring extremely high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (“Specific Applications”), please consult with the ROHM sales representative in advance.Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM’s Products for Specific Applications.2) ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductorproducts can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, whicha failure or malfunction of our Products may cause. The following are examples of safety measures:[a] Installation of protection circuits or other protective devices to improve system safety[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure3) Our Products are designed and manufactured for use under standard conditions and not under any special orextraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary:[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,H2S, NH3, SO2, and NO2[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items[f] Sealing or coating our Products with resin or other coating materials[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue offlux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaningresidue after soldering[h] Use of the Products in places subject to dew condensation4) The Products are not subject to radiation-proof design.5) Please verify and confirm characteristics of the final or mounted products in using the Products.6) In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse) is applied,confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability.7) De-rate Power Dissipation (Pd) depending on Ambient temperature (Ta). When used in sealed area, confirm the actualambient temperature.8) Confirm that operation temperature is within the specified range described in the product specification.9) ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined inthis document.。

BU24530中文资料

Appendix1-Rev1.1
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项目BU管理培训 PPT

模块四，项目构成
项目经理
PC & MC 课长
生产制造副经理
工程工程师
品管工程师
制造课长
工程技术员
品管技术员
制造员工
品管 IPQC/FQC
模块五：项目的改善和进步

1，要构建项目的改善文化，要不断进步。
2，项目中要有改善的Leader和 co-leader, 通常leader 是项目经理，co-leader 是IE。
每个人角色/责任/权力/工作/关系

1，BU经理 2，功能部门经理 3，项目成员 4，功能部门公共组成员
BU经理的角色/责任/权力/工作/关系。

1，角色：项目的负责人，类似小厂长。 2，责任：对项目的销售额和利润负责，对项目的KPI负责。 3，权力：项目内的决策者，尤其体现在人事权力上：对认为不适合的人员，可以退回部门经理要求更换，部门经理必须给予支持。 4，工作：给项目的团队成员设定目标, 指导团队成员的工作，负责项目运营, (具体请见后续 homework)。 5，关系：与部门经理平级，向邓总监汇报
二，企业传统的结构和反馈途径
Chart Title
品管部经理工程部经理计划部经理物料部经理制造部经理
商务经理A
品管工程师
制造工程师
生产计划员
采购物控
生产部课长
客户 A
三，BU模式结构及反馈途径
独立性
功能部门 FM 客户分组 A BUM 客户分组B BUM 客户组C, D, ...
1，减少流程，提升效率 2，打破部门框架，便于发挥团队的力量 3，合理配置资源。

BU408中文资料

BU406/406H/408Figure 7. Static Characteristic Figure 8. DC current GainBU406/406H/408TRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.ACEx™Bottomless™CoolFET™CROSSVOLT™E2CMOS™FACT™FACT Quiet Series™FAST®FASTr™GTO™HiSeC™ISOPLANAR™MICROWIRE™POP™PowerTrench®QFET™QS™Quiet Series™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TinyLogic™UHC™VCX™DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR INTERNATIONAL.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONSDefinition of TermsDatasheet Identification Product Status DefinitionAdvance Information Formative or InDesign This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.Preliminary First Production This datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to makechanges at any time without notice in order to improvedesign.No Identification Needed Full Production This datasheet contains final specifications. FairchildSemiconductor reserves the right to make changes atany time without notice in order to improve design. Obsolete Not In Production This datasheet contains specifications on a productthat has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.。