HDSP-311X中文资料 - 360文档中心

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• HDS独有虚拟端口模式
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• 多个LUN 0 支持
– 更好的利用FC端口200MB/s的带宽
• 很多应用仅需要5－10MB/s的带宽
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•POR T
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SE9985
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HDS中国区业务
• 4 iSCSI ports—2 per controller (Fibre Channel models available 2008)
• Supports SATA II (500GB or 750GB) or SAS (147GB or 300GB) HDDs
• 6, 8, or 12 HDDs per model, up to 9TB of capacity
• • • •

XP-311A中文说明书

COSMOS 自动吸入式可燃性气体检测器XP-311 型XP-311A型使用说明书新宇宙电机株式会社NEW COSMOS ELECTRIC CO.,LTD目录:1. 前言 (1)2. 特点 (2)3. 技术规格 (3)4. 各部位的名称及功能 (4)5. 操作顺序 (6)6. 正确使用方法 (8)7. 当您认为机器有故障时,请再加以检查..91. 前言这次购买我公司生产的”COSMOTECTOR”,可燃性气体检知器XP-311/XP-311A型，甚感荣幸。

为了确保正确使用机器，希望仔细阅读本使用说明书，以预防事故，并且有助于维修机器。

我公司产品COSMOTECTOR系列中，有以下4种样式（6种机型），供选择。

(“COSMOTECTOR”是超小型自动吸入式,具本质安全防爆结构)2. 特点·小型,重量轻样式简单,重量仅有700克·节能型使用高性能的”宇宙”小电力型传感器,消费电力小·测定区间2档转换,检测范围大,从低到高L档测0-10%LEL浓度H档测0-100%LEL浓度·带刻度照明功能,在黑暗中也可以测量·本质安全防爆构造·操作性优良用一只手即可操作,只要旋转旋钮ON/OFF,就可以将电池电压检测、测定范围转换·自动吸入式,内有微型吸气泵·带二种警报功能,气体浓度超出警报设定值及电池电压不足时发出警报3. 技术规格型号XP-311XP-311A(带报警)检测对象气体可燃性气体检测原理接触燃烧式检测范围0～10%LEL / 0～100%LEL指示精度满量程的±5%报警设定值－－－20%LEL(标准)响应时间3秒以内使用温度范围-20°C～+50°C电源5号干电池4只防爆结构本质安全防爆结构id2G3尺寸W84×H190×D40（mm）重量约700g4. 各部分名称及功能吸引管⑥气体导入胶管⑦零调节旋钮②转换开关①过滤/除潮器⑧表盘照明按钮④表盘③电池腔⑤①转换开关开机时将转换开关转至BATT位置,确认电压正常后再转换至L或H档进行测量②零调节旋钮将转换开关转至L档,调节此旋钮将表盘指针调到0。

HDSP-50XB中文资料

14.2 mm (0.56 inch) General PurposeBlue Seven Segment DisplaysTechnical DataHDSP-50xB SeriesFeatures•Industry Standard Size •Industry Standard Pin-Out 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers •Blue Color•Mitered FontMitered Corners on Segments •Gray Face PaintGray Package Gives Optimum Contrast•±50° Viewing Angle •Design Flexibility Common Anode or Common Cathode•Categorized for Luminous IntensityApplications•Suitable for Indoor Use •Not Recommended for Industrial Applications, i.e. Operating TemperaturesRequirements Exceeding 80°C or Below –20°C[1]•Extreme Temperature Cycling Not Recommended[1] DescriptionThese 14.2 mm (0.56 inch) blue displays use industry standard size and pin-out. The devices are available as either common anode or common cathode. TheHDSP-50xB series are suitable forindoor use.DevicesBlueHDSP-Description501B Common Anode RightHand Decimal503B Common CathodeRight Hand Decimal Note:1. For details, please contact your localAgilent components sales office or an authorized distributor.Part Numbering System5082 - X XX X - X X X XXHDSP- X XX X - X X X XXMechanical Options[1]00: No Mechanical OptionColor Bin Options[1,2]0: No Color Bin LimitationMinimum Intensity Bin[1,2]0: No Maximum Intensity Bin LimitationMinimum Intensity Bin[1,2]0: No Minimum Intensity Bin LimitationDevice Configuration/Color[1]B: BlueDevice Specification Configuration[1]Refer to Respective DatasheetPackage[1]Refer to Respective DatasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet orcontact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins aretypically restricted to 1 bin per tube (exceptions may apply). Please refer torespective datasheet for specific bin limit information.Package DimensionsInternal Circuit DiagramCOMMON CATHODECOMMON ANODE COMMON ANODECOMMON CATHODEPINFUNCTION PIN 1CATHODE e 2CATHODE d3COMMON ANODE 4CATHODE c 5CATHODE DP 6CATHODE b 7CATHODE a8COMMON ANODE 9CATHODE f 10CATHODE g12345678910FUNCTION ANODE e ANODE dCOMMON CATHODE ANODE c ANODE DPANODE b ANODE aCOMMON CATHODE ANODE f ANODE gHDSP-501B HDSP-503B∅ 0.51TOP END VIEWFRONT VIEWSIDE VIEWTYP. 10 PLCSNOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS (INCHES).2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm.Absolute Maximum Ratings at T A=25°CHDSP-501BParameter Symbol HDSP-503B Units Power Dissipated per Segment or DP P D135mW Peak Forward Current per Segment or DP I PEAK70mA(1/10 Duty Cycle, 0.1 ms Pulse Width)DC Forward Current per Segment or DP[1]I F30[1]mA Reverse Voltage per Segment or DP V R5V Operating Temperature T O–20 to +80°C Storage Temperature T S–30 to +85°C Wave Soldering Conditions Temperature250°C(1.6 mm [0.063 in.] below Body)Time3sNote:1.Derate above 25°C at 0.33 mA/°C.Optical/Electrical Characteristics at T A=25°CDevices Test HDSP-Parameter Symbol Min.Typ.Max.Units Conditions Luminous Intensity/Segment I v 2.02 3.40mcd I F = 10 mA(Segment Average)[1,2]501B Forward Voltage/Segment or DP V F 3.80 4.50V I F = 20 mA 503B Peak WavelengthλPEAK428nmDominant Wavelength[3]λd466nmReverse Current/Segment or DP[4]I R100µA V R = 5 V Notes:1.Case temperature of the device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and represents the single wavelength which definesthe color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.Intensity Bin Limits[1] (µcd at 10 mA)Bin Name Min.[2]Max.[2]H20202630I26303420J34204200K42005040Notes:1.Bin categories are established for classification of products. Products may not beavailable in all bin categories.2. Tolerance for each bin limit is ±10%.Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.Device ReliabilityFor reliability information, please see the reliability data sheet 14.2 mm (0.56 inch) General Purpose Blue Seven Segment Display.Figure 2. Relative Luminous Intensity vs. DC Forward Current.Figure 3. Maximum Allowable Average Current per Dot vs. Ambient Temperature.Figure 1. Forward Current vs.Forward Voltage.I F – M A X I M U M A V E R A G E C U R R E N T – m A100T A – AMBIENT TEMPERATURE – °C208010030604010205152535R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )00I F – FORWARD CURRENT PER SEGMENT – mA1.200.800.400.2015301.000.601025520I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A0V F – FORWARD VOLTAGE – V35153530514102/semiconductorsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939Japan: (+81 3) 3335-8152 (Domestic/Interna-tional), or 0120-61-1280 (Domestic Only)Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand,Philippines, Indonesia: (+65) 6755 2044Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2004 Agilent Technologies, Inc.Obsoletes 5988-0378EN July 17, 20045988-8000EN。

HDS NAS介绍

高性能NAS平台
价格
Essential NAS
2000 2000近线性
用于文件服务器、整合、文件共享和备份的标准解决方案
3100
1100c
1300c
1500c
性能
5
3200
价格
Essential NAS Platform 设备型号
• 现场升级能力 • 可从以前的产品升级
所有的指标基于双节点集群:
Accounts
IP Network LAN
Exchange Server
DB Server
NAS
SAN
FC Backup
IP FC
3
减少或消除部门内部的服务器和存储设备
SW Development
减少或消除部门内部的服务器和存储设备
Engineering
减少或消除部门内部的服务器和存储设备
Sales
25
ProtecTIER 设备架构概述
“它是一个磁带库，同时也是一个磁带驱动器”
Virtual Tape Library Appliance
集成的服务器和磁盘存储系统
光纤通道
备份服务器
ProtecTIER 应用程序
• 模拟磁带库单元，包括驱动器、磁带盒和机械臂 • 使用光纤通道 ( FC) 连接的磁盘存储系统作为备份介质
• 中等级别业务, 远程办公室，大型企业
• 为文件共享，备份和整合提供方案
• 适用于对性能和扩展能力 NAS Platform • 企业及产品，具有高级功能
• 企业级大型环境, 对性能要求高的场合
• 为整合, 高性能的企业应用提供解决方案
• 适用于对性能和扩展能力要求非常高的场合

DSA311XC线路保护测控装置说明书

第一部分技术说明书 (3)1 概述 (3)1.1 系统概述 (3)1.2 装置特点 (4)2 技术参数 (4)2.1 额定参数 (4)2.2 功率消耗 (5)2.3 直流工作电压 (5)2.4 过载能力 (5)2.5 测量元件精度 (5)2.6 允许环境温度 (5)2.7 电磁兼容性能 (6)2.8 绝缘耐压 (6)2.9 遥测计量等级 (6)3 保护功能 (6)3.1 3112C保护功能 (6)3.2 3113C保护功能 (7)3.3 3116C保护功能 (7)3.4 3117C保护功能 (8)3.5 3118C保护功能 (8)3.6 3119C保护功能 (9)4 测控功能 (9)5 通讯功能 (10)6 保护原理 (10)6.1三段式电流保护（3112C，3113C） (10)6.2分段开关充电保护（3112C） (10)6.3带低电压及方向闭锁的三段式电流保护（3117C，3118C，3119C） (11)6.4带复合电压及方向闭锁的三段式电流保护（3116C） (11)6.5过流反时限（3116C） (12)6.6三相一次重合闸（3112C，3113C，3117C，3118C，3119C） (13)6.7低周减载（3112C，3113C，3116C，3117C，3118C，3119C） (14)6.8低压减载（3112C，3113C，3116C，3117C，3118C，3119C） (14)6.9过负荷告警（3112C，3113C，3116C，3117C，3118C，3119C） (15)6.10零序方向告警（3112C，3113C，3116C，3118C，3119C） (15)6.11低压侧零序电流保护（3116C） (16)6.12四段零序方向保护（3117C） (16)6.13母线接地告警（3112C，3113C，3116C，3118C，3119C） (16)6.14电流越限告警（3112C，3113C，3116C，3117C，3118C，3119C） (17)6.15保护电流回路异常（3112C，3113C，3116C，3117C，3118C，3119C） (17)6.16 PT断线告警（3112C，3113C，3116C，3117C，3118C，3119C） (18)6.17断路器失灵告警（3112C，3113C，3116C，3117C，3118C，3119C） (18)7 保护定值表 (18)7.1 3112C定值表 (18)7.2 3113C定值表 (20)7.3 3116C定值表 (21)7.4 3117C定值表 (22)7.5 3118C定值表 (24)7.6 3119C定值表 (26)第二部分使用说明书 (28)1 人机界面介绍 (28)1.1液晶显示内容介绍 (29)1.2六个指示灯的含义 (29)1.3按键的功能及其使用 (30)2 装置菜单介绍 (30)2.1交直流量测量值 (32)2.2信息记录 (34)2.3单元定值整定 (36)2.4保护定值投退和保护定值整定 (39)2.5测量定值整定 (43)2.6交流量精度调节 (44)2.7系统复归 (44)2.8信号复归 (44)3 遥信量介绍 (44)3.1 3112C，3113C，3118C，3119C遥信定义表 (44)3.2 3116C遥信定义表 (46)3.3 3117C遥信定义表 (47)4 遥测量介绍 (48)5 背板端子介绍 (49)5.1交流采样板 (49)5.2操作板 (50)5.3输入输出板 (51)5.4通讯端子 (52)6 装置检查 (52)6.1通电前检查 (52)6.2通电后检查 (52)7 311XC操作回路原理图 (53)第一部分技术说明书1 概述1.1 系统概述随着国家电力事业快速而深入的发展，对电网运行和管理自动化水平的要求越来越高。

HDSP-A2XC中文资料

Agilent HDSP-A2XC SeriesAlphanumeric Display, 0.54" (13.7 mm)2 Character As AlInGaP RedData SheetFeatures•As AlInGaP red color •Gray face paintGray package gives optimum contrast •Design flexibilityCommon anode or common cathodeApplications•Suitable for alphanumeric •Operating temperature range –40˚C to 105˚CDevices As AlInGaP Red Description HDSP-A22C Common Anode HDSP-A27CCommon CathodeDescriptionThese 0.54" (13.7 mm) AS AlInGaP displays are available in either common anode or common cathode.Package Dimensions6.75 [0.266] 5.95 [0.234]25.20 [0.992]8.17[0.322]1.20[0.047]13.80 [0.543]7.00 [0.276]21.00 [0.827]15.24 [0.600]NOTES:1. ALL DIMENSIONS ARE IN MILLIMETERS [INCHES]2. UNLESS OTHERWISE STATED, TOLERANCES ARE ± 0.25 mm3.70 [0.146]20.32[0.800]Internal CircuitPin Configuration A Pin Configuration B Pin Common Anode Common Cathode 11E/2E Cathode 1E/2E Anode 21M/2M Cathode 1M/2M Anode 3No Connection No Connection 41L/2L Cathode 1L/2L Anode 51K/2K Cathode 1K/2K Anode 61J/2J Cathode 1J/2J Anode 71D/2D Cathode 1D/2D Anode 8DP1 Cathode DP1 Anode 91C/2C Cathode 1C/2C Anode 101B/2B Cathode1B/2B Anode11DIGIT No. 2 Common Anode DIGIT No. 2 Common Cathode 121A/2A Cathode 1A/2A Anode 131N/2N Cathode 1N/2N Anode 141H/2H Cathode 1H/2H Anode 151G/2G Cathode1G/2G Anode16DIGIT No. 1 Common Anode DIGIT No. 1 Common Cathode 171P/2P Cathode 1P/2P Anode 181F/2F Cathode 1F/2F AnodeCOMMON ANODECOMMON CATHODECOM 1 DIG 1 COM 2COM 1 DIG 1COM 2 DIG 1DIG 2DP1DP2A B G H CDE F JK L M NPAbsolute Maximum Ratings at T A = 25˚CParameter Symbol HDSP-A22C/HDSP-A27C UnitsDC Forward Current per Segment or DP[1,2,3]I F50mAPeak Forward Current per Segment or DP[2,3]I PEAK100mA Average Forward Current[3]I AVE30mA Reverse Voltage per Segment or DP (I R = 100 µA)V R5V Operating Temperature T O–40 to +105˚C Storage Temperature T S–40 to +120˚CLead Soldering Conditions Temperature260˚CTime3sNotes:1.Derate linearly as shown in Figure 1.2.For long term performance with minimal light output degradation, drive currents between 10 mA and 30 mA are recommended. For more information on recommended drive conditions, please refer to Application Brief I-024 (5966-3087E).3.Operating at currents below 1 mA is not recommended. Please contact your local representative for further information.Optical/Electrical Characteristics at T A = 25˚CDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test ConditionsA22C Forward Voltage I V 1.70 1.90 2.20V I F = 20 mAA27C Reverse Voltage V R520V I F = 100 µA Peak WavelengthλPEAK635nm Peak Wavelengthof Spectral Distri-bution at I F = 20 mA Dominant Wavelength[3]λd622.5626630nmSpectral Halfwidth∆λ1/217nm Wavelength Widthat Spectral Distri-bution 1/2 PowerPoint at I F = 20 mA Speed of Responseτs20ns Exponential TimeConstant, e-tτs Capacitance C40pF V F = 0, f = 1 MHzIntensity Bin Limits[1](mcd at 10 mA)Bin Name Min.[2]Max.[2]T18.025.0U25.036.0Notes:1.Bin categories are established forclassification of products. Products maynot be available in all bin categories.2.Tolerance for each bin limit is ± 10%. Data subject to change.Copyright © 2001 Agilent Technologies, Inc.November 20, 20015988-4821ENFigure 1. Maximum forward current vs.ambient temperature. Derating based on T JMAX = 130˚C.Figure 2. Forward current vs. forwrad voltage.I F – M A X I M U M A V E R A G E C U R R E N T – m A00T A – AMBIENT TEMPERATURE – ˚C60301204010202040506080100I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A00V F – FORWARD VOLTAGE – V12060 2.0 3.08020 1.0 2.540 1.5100Contrast EnhancementFor information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family (methylene chloride,trichloroethylene, carbon tetrachloride, etc.) are notrecommended for cleaning LED parts. All of these varioussolvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.。

HDSP-5507-IJ000中文资料

14.2 mm (0.56 inch)Seven Segment Displays Technical DataFeatures• Industry Standard Size • Industry Standard Pinout 15.24 mm (0.6 in.) DIP Leads on 2.54 mm (0.1 in.) Centers • Choice of ColorsAlGaAs Red, High Efficiency Red, Yellow, Green, Orange • Excellent Appearance Evenly Lighted Segments Mitered Corners on Segments Gray Package Gives Optimum Contrast±50° Viewing Angle • Design FlexibilityCommon Anode or Common CathodeSingle and Dual Digits Right Hand Decimal Point ±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display • High Light Output • High Peak Current• Excellent for Long Digit String Multiplexing • Intensity and Color Selection OptionSee Intensity and ColorSelected Displays Data Sheet • Sunlight Viewable AlGaAsDescriptionThe 14.2 mm (0.56 inch) LED seven segment displays aredesigned for viewing distances upto 7 metres (23 feet). Thesedevices use an industry standard size package and pinout. Both the numeric and ±1 overflow devices feature a right hand decimalpoint. All devices are available as either common anode or common cathode.Orange AlGaAs Red HERYellowGreen Package HDSP-HDSP-[1]HDSP-[1]HDSP-HDSP- DescriptionDrawingH401H151550157015601Common Anode Right Hand Decimal A H403H153550357035603Common Cathode Right Hand Decimal B H157550757075607Common Anode ±1. Overflow C H158550857085608Common Cathode ±1. OverflowD K401552157215621Two Digit Common Anode Right Hand DecimalE K403552357235623Two Digit Common Cathode Right Hand DecimalFDevicesNote:1. These displays are recommended for high ambient light operation. Please refer to the HDSP-H10X/K12X AlGaAs and HDSP-555X HER data sheet for low current operation.HDSP-K40x Series HDSP-550x Series HDSP-552x Series HDSP-560x Series HDSP-562x Series HDSP-570x Series HDSP-572x Series HDSP-H15x Series HDSP-H40x SeriesThese displays are ideal for most applications. Pin for pin equivalent displays are alsoavailable in a low current design.The low current displays are idealfor portable applications. For additional information see the Low Current Seven Segment Displays data sheet.Part Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]1: Common Anode 3: Common CathodeDevice Specific Configuration [1]Refer to Respective DatasheetPackage [1]H: 14.2 mm (0.56 inch) Single Digit Seven Segment DisplayFUNCTIONPIN AB CDEF1CATHODE e ANODE e CATHODE c ANODE cE CATHODE NO. 1 E ANODE NO. 12CATHODE d ANODE d ANODE c, d CATHODE c, d D CATHODE NO. 1 D ANODE NO. 13ANODE [3]CATHODE [4]CATHODE b ANODE bC CATHODE NO. 1 C ANODE NO. 14CATHODE c ANODE c ANODE a, b, DP CATHODE a, b, DP DP CATHODE NO. 1DP ANODE NO. 15CATHODE DP ANODE DP CATHOPDE DP ANODE DE E CATHODE NO. 1 E ANODE NO. 26CATHODE b ANODE b CATHODE a ANODE aD CATHODE NO. 2 D ANODE NO. 27CATHODE a ANODE a ANODE a, b, DP CATHODE a, b, DP G CATHODE NO. 2G ANODE NO. 28ANODE [3]CATHODE [4]ANODE c, d CATHODE c, d C CATHODE NO. 2 C ANODE NO. 29CATHODE f ANODE f CATHODE d ANODE d DP CATHODE NO. 2DP ANODE NO. 210CATHODE g ANODE g NO PINNO PINB CATHODE NO. 2 B ANODE NO. 211 A CATHODE NO. 2 A ANODE NO. 212 F CATHODE NO. 2 F ANODE NO. 213DIGIT NO. 2 ANODE DIGIT NO. 2 CATHODE 14DIGIT NO. 1 ANODE DIGIT NO. 1 CATHODE 15 B CATHODE NO. 1 B ANODE NO. 116 A CATHODE NO. 1 A ANODE NO. 117G CATHODE NO. 1G ANODE NO. 118F CATHODE NO. 1 F ANODE NO. 1NOTES:1. ALL DIMENSIONS IN MILLIMETRES (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. REDUNDANT ANODES.4. REDUNDANT CATHODES.5. FOR HDSP-5600/-5700 SERIES PRODUCT ONLY.Package DimensionsInternal Circuit DiagramNotes:1. See Figure 2 to establish pulsed conditions.2. Derate above 46°C at 0.54 mA/°C.3. See Figure 7 to establish pulsed conditions.4. Derate above 53°C at 0.45 mA/°C.5. See Figure 8 to establish pulsed conditions.HER/Orange HDSP-5500AlGaAs Red HDSP-H40x Yellow Green HDSP-H150HDSP-K40x HDSP-5700HDSP-5600 Description SeriesSeriesSeriesSeriesUnits Average Power per Segment or DP 9610580105mW Peak Forward Current per 160[1]90[3]60[5]90[7]mA Segment or DPDC Forward Current per Segment or DP 40[2]30[4]20[6]3018]mA Operating Temperature Range -20 to +100[9]-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment or DP 3.0V Lead Solder Temperature for 3 Seconds 260°C(1.60 mm [0.063 in.] below seating plane)Absolute Maximum Ratings6. Derate above 81°C at 0.52 mA/°C.7. See Figure 9 to establish pulsed conditions.8. Derate above 39°C at 0.37 mA/°C.9. For operation below -20°C, contact your local Agilent components sales office or an authorized distributor.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2,5]I V9.116.0mcd I F = 20 mA(Digit Average)1.8I F = 20 mAForward Voltage/Segment or DP V F V2.03.0I F = 100 mAH15XPeak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin400°C/W/to-Pin SegHigh Efficiency RedDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions9002800I F = 10 mA Luminous Intensity/Segment[1,2,6]I Vµcd(Digit Average)3700I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 55XXPeak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegYellowDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions6001800I F = 10 mA Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)2750I F = 60 mA Peak:1 of 6 dfForward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mA 57XXPeak WavelengthλPEAK583nmDominant Wavelength[3,7]λd581.5586592.5nmReverse Voltage/Segment or DP[4]V R 3.040V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegOrangeDeviceSeriesHDSP- Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 2.37mcd I F = 10 mA(Segment Average)[1,2]Forward Voltage/Segment or DP V F 2.1 2.5V I F = 20 mAPeak WavelengthλPEAK600nm H40x Dominant Wavelength[3]λd603nm I F = 10 mA K40x Reverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µA Temperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED Junction-RθJ-Pin345°C/W/to-Pin SegDeviceSeries HDSP-ParameterSymbol Min.Typ.Max.UnitsTest Conditions 9002500I F = 10 mALuminous Intensity/Segment [1,2]I Vµcd(Digit Average)`3100I F = 60 mA Peak:1 of 6 df Forward Voltage/Segment or DPV F 2.1 2.5V I F = 10 mA56XXPeak Wavelength λPEAK 566nm Dominant Wavelength [3,7]λd 571577nm Reverse Voltage/Segment or DP [4]V R 3.050V I R = 100 µATemperature Coefficient of ∆V F /°C -2mV/°C V F /Segment or DPThermal Resistance LED Junction-R θJ-Pin345°C/W/to-PinSegHigh Performance GreenNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd , is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. For low current operation, the AlGaAs HDSP-H10X series displays are recommended. They are tested at 1 mA dc/segment and are pin for pin compatible with the HDSP-H15X series.6. For low current operation, the HER HDSP-555X series displays are recommended. They are tested at 2 mA dc/segment and are pin for pin compatible with the HDSP-550X series.7. The Yellow (HDSP-5700) and Green (HDSP-5600) displays are categorized for dominant wavelength. The category is designated by a number adjacent to the luminous intensity category letter.AlGaAs RedFigure 2. Maximum Tolerable Peak Current vs. Pulse Duration – AlGaAs Red.Figure 1. Maximum Tolerable Peak Current vs.Pulse Duration – Red.Figure 3. Maximum Allowable DC Current vs.Ambient Temperature.Figure 4. Forward Current vs.Forward Voltage.HER, Yellow, Green, OrangeFigure 7. Maximum Tolerable Peak Currentvs. Pulse Duration – HER, Orange.Figure 8. Maximum Tolerable Peak Current vs. Pulse Duration – Yellow.Figure 5. Relative Luminous Intensity vs. DC Forward Current.Figure 6. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.I D C M A X . – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AT A – AMBIENT TEMPERATURE – °C 5030102051525354045I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 20 m A )I F – FORWARD CURRENT PER SEGMENT – mA204010305152535ηP E A K – N O R M A L IZ E D R E L A T I V E E F F I C I E N C YI PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA40051015202530352010090807060504030T – AMBIENT TEMPERATURE – °C AI M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AD C 4550110120Figure 11. Forward Current vs.Forward Voltage.Figure 9. Maximum Tolerable PeakCurrent vs. Pulse Duration – Green.Figure 10. Maximum Allowable DC Current vs.Ambient Temperature.Figure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 13. Relative Efficiency (Luminous Intensity per Unit Current) vs. Peak Current.Electrical/OpticalFor more information onelectrical/optical characteristics,please see Application Note 1005.Contrast EnhancementFor information on contrastenhancement please see Application Note 1015.Soldering/CleaningCleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro–ethylene, carbon tetrachloride,etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs please refer to Application Note 1027.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )I F – DC FORWARD CURRENT – mAηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A P E R S E G M EN T )0.6I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA902070801001.61.41.31.10.90.860504030100.71.01.21.5HDSP-H15x IV Bin Category Min.Max.K 9.2016.90L 13.8025.30M 20.7038.00N 31.1056.90O 46.6085.40Intensity Bin Limits (mcd)AlGaAs RedHDSP-550x/552x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04HERHDSP-570x/572xIV Bin Category Min.Max.D 0.61 1.11E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.628.64J 6.9312.70K 10.3919.04YellowHDSP-560x/562x IV Bin Category Min.Max.E 0.91 1.67F 1.37 2.51G 2.05 3.76H 3.08 5.64I 4.618.46GreenColor CategoriesNote:All categories are established for classification of products. Products may not be available in all categories. Please contact your Agilent representatives for further clarification/information.10HDSP-H40x/K40x IV Bin Category Min.Max.B 0.77 1.17C 0.95 1.45D 1.19 1.82E 1.49 2.27F 1.85 2.89G 2.32 3.54H 2.904.43Orange元器件交易网元器件交易网/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(408) 654-8675Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 271 2451India, Australia, New Zealand: (+65) 271 2394Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only)Korea: (+65) 271 2194Malaysia, Singapore: (+65) 271 2054Taiwan: (+65) 271 2654Data subject to change.Copyright © 2002 Agilent Technologies, Inc.Obsoletes 5988-0383ENJanuary 17, 20025988-4273EN。

HDSP-Exxx中文资料

Seven Segment Displays—10mm (0.40 inch), 10mm Slim Font,10.9mm (0.43 inch), 14.2mm (0.56inch),13mm Slim FontReliability DataDescriptionThe following cumulative test results have been obtained from testing performed at HP Optoelec-tronics Division in accordance with the latest revision of MIL- STD-883.Hewlett-Packard tests parts at the absolute maximum rated condi-tions recommended for the device. The actual performance you obtain from HP parts depends on the electrical and environmen-tal characteristics of your applica-Point Typical PerformanceStress Test Total DeviceUnits Total Failure Rate ColorsConditionsHoursTestedFailedMTBF(% /1 K Hours)HER T A = 55°C, I F = 30 mA 420,000630420,000≤0.23 %AlGaAs T A = 55°C, I F = 30 mA 378,000630378,000≤0.26 %Green T A = 55°C, I F = 30 mA 252,000840252,000≤0.40 %Orange T A = 55°C, I F = 30 mA 147,000210147,000≤0.26 %YellowT A = 55°C, I F = 20 mA147,00021147,000≤0.26 %Table 1. Life TestsDemonstrated PerformanceFailure Rate PredictionThe failure rate of semiconductor devices is determined by the junction temperature of thedevice. The relationship between ambient temperature and actual junction temperature is given by the following:T J (°C) = T A (°C) + θJA P AVG where T A = ambient temperature in °CθJA = thermal resistance of junction-to-ambient in °C/wattHDSP-Exxx, HDSP-Fxxx,HDSP-Gxxx, HDSP- Hxxx,HDSP-Kxxx, HDSP-3xxx,HDSP-4xxx, HDSP-5xxx,HDSP-6xxx, HDSP-7xxxtion but will probably be better than the performance outlined in Table 1.P AVG = average power dissipated in wattsThe estimated MTBF and failure rate at temperatures lower than the actual stress temperature can be determined by using anArrhenius model for temperature acceleration. Results of such calculations are shown in the table below using an activation energy of 0.43 eV (reference MIL-HDBK-217).Table 2.Point Typical Performance in Time[2]Performance[1] in Time(90%Confidence) Ambient Temp.Junction Temp.Failure Rate Failure Rate I F(°C)(°C)MTBF[1](%/1K Hours)MTBF[2](%/1K Hours) 3085115457,0000.219%118,0000.850% 751056430000.156%165,0000.605%6595920,0000.109%237,0000.423%55851,344,0000.074%346,0000.289%45752,006,0000.050%516,0000.194%35653,066,0000.033%788,0000.127%25554,809,0000.021%1,236,0000.081% Notes:1.The point typical MTBF (which represents 60% confidence level) is the total device hours divided by the number offailures. In the case of zero failures, one failure is assumed for this calculation.2.The 90% confidence MTBF represents the minimum level of reliability performance which is expected from 90% of allsamples. This confidence interval is based on the statistics of the distribution of failures. The assumed distribution of failures is exponential. This particular distribution is commonly used in describing useful life failures. Refer toMIL-STD-690B for details on this methodology.3. A failure is any LED which does not emit light.Example of Failure Rate Calculation:Assume a device operating 8 hours/day, 5 days a week. The utilization factor, given 168 hours/week is:(8 hours/day) x (5 days/week) ÷ (168 hours/week) = 0.25The point failure rate per year (8760 hours) at 25°C ambient temperature is:(0.021%/1K hours) x 0.25 x (8760 hours/year) = 0.045% per yearSimilarly, 90% confidence level failure rate per year at 25°C:(0.081%/1K hours) x 0.25 x (8760 hours/year) = 0.177% per yearTable 3. Environmental TestsUnits Units Test Name Reference Test Conditions Tested Failed Solder Heat Resistance MIL-STD-883 Method 2003260°C, 3 seconds100 Temperature Cycle MIL-STD-883 Method 1010-55°C to 100°C, 15 min. dwell,260015 min. transfer, 20 cyclesHumidity Storage JIS C 7021 Method B-1185°C, 85% RH, 168 Hours2520Solderability MIL-STD-883 Method 200316 Hours steam aging followed by100solder dip at 260°C for 5 secondsSalt Atmosphere MIL-STD-883 Method 100935°C, 24 Hours100Table 4. Mechanical TestsUnits Units Test Name Reference Test Conditions Tested Failed Terminal Strength MIL-STD-883 Method 2004 Cond. A 1 lb. for 30 sec.110 Lead Strength MIL-STD-883 Method 2004 Cond. B 3 X 90 degree bend, 8 oz.110 Vibration Variable MIL-STD-883 Method 2007 2 Hours for each X, Y, Z axis at220 Frequency20 Gs, 10 to 2k Hz; 20 min. sweep/go/ledFor technical assistance or the location of your nearest Hewlett-Packard sales office, distributor or representative call: Americas/Canada: 1-800-235-0312 or 408-654-8675 • Far East/Australasia: Call your local HP sales office. Japan: (81 3) 3335-8152 • Europe: Call your local HP sales office. • Data subject to change. • Copyright © 1999 Hewlett-Packard Co.5968-7071E (8/99)。

HDSP-315E-MG000

DevicesAlGaAs HER HER Yellow Green Red Low Std.Low Std.Std.Current Current Current Current Current Package HDSP-HDSP-HDSP-HDSP-HDSP-Description Drawing315H 315E 315L 315Y 315G Common Anode,A 10 mm Display 316H 316E 316L 316Y 316G Common Cathode,B 10 mm Display 515H 515E 515L 515Y 515G Common Anode,A 13 mm Display 516H516E516L516Y516GCommon Cathode,B13 mm Display10 mm and 13 mm Slim Font Seven Segment Displays Technical DataFeatures• Excellent Appearance • Slim Font Design• Mitered Corners, Evenly Illuminated Segments • Gray Face for Optimum On/Off Contrast• Choice of Colors: DH AlGaAs Red, High Efficiency Red (HER), Yellow, and Green • Low Current Available,AlGaAs Red and HER Choice of Character Size: 10 mm and 13 mm• ±50° Viewing Angle• Characterized for Luminous IntensityHDSP-315x Series HDSP-316x Series HDSP-515x Series HDSP-516x SeriesDescriptionThe HDSP-31xx-51xx Series of displays incorporates a new slim font character design. This slim font features narrow width,specially mitered segments to give a fuller appearance to theilluminated character. Faces of these displays are painted aneutral gray for enhanced on/off contrast.All devices are available in either common anode or commoncathode configuration with right hand decimal point. Low current versions are available in either AlGaAs red or HER.Part Numbering System5082 -X X X X-X X X X XHDSP-X X X X-X X X X XMechanical Options[1]00: No Mechanical OptionColor Bin Options[1,2]0: No Color Bin LimitationMaximum Intensity Bin[1,2]0: No Maximum Intensity Bin LimitationMinimum Intensity Bin[1,2]0: No Minimum Intensity Bin LimitationDevice Configuration/Color[1]H: AlGaAs RedE: High Efficiency RedG: GreenY: YellowDevice Specific Configuration[1]Refer to Respective DatasheetPackage[1]Refer to Respective DatasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contactyour nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins aretypically restricted to 1 bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.HDSP-315x/316x SeriesHDSP-515x/516x Series12345678910g fCommon A/C e d DP cCommon A/C b a12345109876LUMINOUS INTENSITY PIN FUNCTIONLUMINOUS NOTES: 1. PACKAGE DIMENSIONS IN MILLIMETERS.Absolute Maximum RatingsAlGaAs HERRed Low LowDescription Current HER Current Yellow Green Units Average Power per371055280105mW Segment or DPPeak Forward4590[2]4560[5]90[7]mA Current per Segmentor DPDC Forward Current15[1]30[3]15[4]20[6]30[8]mA per Segment or DPOperating Tempera--20 to 100-40 to +100°C ture RangeStorage Temperature-40 to +100°C RangeReverse Voltage per 3.0V Segment or DPWavesoldering 250°C Temperature for3 seconds 1.59 mm.below bodyNotes:1. Derate above 91°C at 0.53 mA/°C.2. See Figure 4 to establish pulsed conditions.3. Derate above 53°C at 0.45 mA/°C.4. Derate above 80°C at 0.38 mA/°C.5. See Figure 5 to establish pulsed conditions.6. Derate above 81°C at 0.52 mA/°C.7. See Figure 6 to establish pulsed ocnditions.8. Derate above 39°C at 0.37 mA/°C.Electrical/Optical Characteristics at T A = 25°C AlGaAs Red Low CurrentHERHER Low CurrentGreenNotes:1. Case temperature of device immediately prior to the intensity measurement is 25°C.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λ is derived from the CIE chromaticity diagram and is that single wavelength which defines the color of the device.4. Typical specification for reference only. Do not exceed absolute maximum ratings.Yellow 16024681012142010090807060504030T A– AMBIENT TEMPERATURE – °CI F A V E . M A X – M A X I M U M A V E R A G E F O R W A R D C U R R E N T P E R S E G M E N T – m A1201102018I F – F O R W A R D C U R R E N TP E R S E G M E N T – m A1.02.550.02.00.1V F – FORWARD VOLTAGE – V1.52.020.010.01.00.50.55.0R E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 1m A )0.5202020.1I F – FORWARD CURRENT PER SEGMENT – mA1251010510.50.20.20.1AlGaAs Low CurrentHER, Yellow, and GreenFigure 4. Maximum Tolerable Peak Current vs. Pulse Duration – HER.R A T I O O F M A X I M U M O P E R A T I N GP E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI F P E A K I D C M A X t p – PULSE DURATION – µs101100R A T I O O F M A X I M U M O P E R A T I N G P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI P E A K F I M A X D C t p – PULSE DURATION –µs 101100DC Figure 5. Maximum Tolerable Peak Current vs. Pulse Duration – Yellow.Figure 9. Relative Luminous Intensity AR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 5 m A F O R H E R A N D Y E L L O W A N D T O 1 A T 10 m A F O R G R E E N )1508642205301025I F – FORWARD CURRENT PER SEGMENT – mA0R A T I O O F M A X I M U M O P E R A T I N G P E A K C U R R E N T T O T E M P E R A T U R E D E R A T E D D C C U R R E N TI F P E A K I D C M A X t p – PULSE DURATION – µs101Figure 6. Allowable Peak Current vs.Pulse Duration – Green.Figure 7. Maximum Allowable DC Current per Segment as a Function of Ambient Temperature.520807060504030T A – AMBIENT TEMPERATURE – °CI D C M A X – M A X I M U M D C C U R R E N T P E R S E G M E N T – m AHER Low CurrentFigure 12. Relative LuminousIntensity vs. DC Forward Current.Figure 11. Forward Current vs.Forward Voltage.Figure 10. Maximum AllowableAverage or DC Current vs. Ambient Temperature.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A00V F – FORWARD VOLTAGE – V 1.0 2.050403020100.5 1.5 3.0HER2.516024681012142010090807060504030T A – AMBIENT TEMPERATURE – °CI F A V E . M A X – M A X I M U M A V E R A G E F O R W A R D C U R R E N T P E R S E GM E N T – m A1201102018R E L A T I V E L U M I N O U S I N T E N S I T Y(N O R M A L I Z E D T O 1 A T 2 m A F O R H E R A N D T O 1 A T 4 m A F O R Y E L L O W A N D G R E E N0V F – FORWARD CURRENT PER SEGMENT – mA610161210622816HER141484412Intensity Bin Limits (mcd)HER Low Current, AlGaAs Red Low CurrentHER Std. Current, Green Std. Current,Yellow Std. CurrentHDSP-31xL/H, HDSP-51xL/H IV Bin Category Min.Max.E 0.1800.360F 0.2800.560G 0.4500.900H 0.700 1.400I 1.100 2.200K 1.800 3.600L 2.800 5.600M 4.5009.000N 7.00015.000HDSP-31xE/G/Y, HDSP-51xE/G/Y IV Bin Category Min.Max.G 0.4500.900H 0.700 1.400I 1.100 2.200K 1.800 3.600L 2.800 5.600M 4.5009.000Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005. Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/CleaningCleaning agents from the ketonefamily (acetone, methyl ethylketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro-ethylene, carbon tetrachloride,etc.) are not recommended forcleaning LED parts. All of thesevarious solvents attack or dissolvethe encapsulating epoxies used toform the package of plastic LEDparts.For further information onsoldering LEDs, please refer toApplication Note 1027.Note:All categories are established for classification of products. Products may not be available in all categories. Please contact your local Agilent representatives for further clarification/information. Color Categories/semiconductors For product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/Interna-tional), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.Copyright © 2005 Agilent Technologies, Inc. Obsoletes 5988-3204EN。

HDSP-301E中文资料

10 mm 1 Digit Slim Font DisplayReliability Data SheetDescriptionThe following cumulative test results have been obtained from testing performed at Agilent Technologies Optoelectronics Division in accordancewith the latest revision of MIL-STD-883.The actual performance you obtain from Agilent partsdepends on the electrical and environmental characteristics of your application but will probably be better than the performance outlined in Table 1.Table 1. Life TestsDemonstrated PerformanceStress Test TotalUnits Units Failure Rate Colors Stress Test Conditions Device Hrs.Tested Failed MTBF (% /1K Hours)YellowHigh Temperature T A = +55°C,10,5002110,500< 9.52Operating Life I F = 20 mA HER,High Temperature T A = +55°C,21,00042021,000< 4.76Green Operating Life I F = 30 mA AlGaAsHigh Temperature T A = +55°C,10,50021010,500< 9.52Operating Life I F = 15 mA HER,Low Temperature T A = -40°C 31,50063031,500< 3.17Green and Operating LifeI F = 30 mA for YellowHER & Green I F = 15 mA for Yellow AlGaAsLow Temperature T A = -20°C,10,50021010,500< 9.52Operating Life I F = 15 mA HER,Wet High T A = +85°C,42,00084042,000< 2.38Green,Temperature R.H. = 85%Yellow,Operating LifeI F = 10 mAAlGaAsPoint Typical PerformanceAgilentHDSP-301G/HDSP-303G HDSP-301E/HDSP-303E HDSP-301Y/HDSP-303Y HDSP-301A/HDSP-303ATable 2. Environmental TestsUnits Units Test Name Reference Test Conditions Tested Failed Solder Heat Agilent1x wave solder at 245°C for total of 3 seconds2,3000 Resistance Internal Test and 5 Temperature Cycles perMIL-STD-883 Method 1010.Temperature MIL-STD-883-40°C to +80°C, 15 min. dwell, 5 min. transfer,2,3000 Cycle Method 1010 up to 20 cycles.....................................Humidity JIS C 702185°C, 85% RH, 500 Hours210 Storage Method B-11Data subject to change.Copyright © 2000 Agilent Technologies, Inc.5980-2922EN (9/00)。

富士通组件热敏打印机FTP-628DSL311 312系列接口板说明书

FUJITSU Component Thermal Printer FTP-628DSL311/312 series Interface BoardsFujitsu interface boards for FTP-628MCL05x, FTP-628MCL1xx, FTP-638MCLxxx series■USB (full speed) and RS-232C serial interface■Various detection features: Paper out, mark, platen open, thermal headtemperature, power supply voltage, near end■Various alarm and protective functions: Thermal head temperature, power supplyvoltage, MCU operation, motor over current protection■Print quality stabilization by the thermal head temperature and power supplyvoltage monitoring■Thermal head energization can select fix division or automatic division■Character set: ANK (Alphabet, number, Kana)■Supports barcode printing■Wide range of power supply voltagesPart number Supply voltage Interface type Mechanism part numberFTP-628DSL311-R 4.2 to 9.5VUSB/RS-232C FTP-628MCL05x FTP-628MCL1xx FTP-638MCL1xxFTP-628DSL312-R21.6 to 26.4V* ■Part numbersItem SpecificationsRS-232C Data speedSynchronous methodHandshakeParityInput/output level:9.6k, 19.2k, 38.4k, 115.2k, 230.4k bps** AsynchronousRTS (DTR) / CTS (DSR) control, XON/XOFF control Non, even, odd**RS-232C levelUSB V2.0Data speedUSB interface classEndpoint USB ver 2.0 full speed (12Mbps max.) Device class: Printer device Interface class: PrinterSub class: PrinterProtocol: Unidirectional interface EPO: ControlEP1: Bulk OUT■ Interface specification at host side**: Selectable by RS-232C communication conditions setting command GS (+E(fn=67)) FTP-62DSL311*: The FTP-628DSL312 will convert the input voltage, 21.6V - 26.4V, to 9.5V to drive the FTP-6x8MCL mechanisms■ Specifications1.1 Base specificationsItem SpecificationsDimensions67.2 x 32.0mm (WxD)Weight Approx. 15g1.2 Print/paper feed specificationsItem SpecificationsPart number FTP-628MCL (2-inch)FTP-638MCL (3-inch) Dot pitch0.125mm (H) x 0.125mm (W)Number of dots384 dots/line576 dots/line Max. printing width48mm72mmLine space Approx. 1/8 inch (26 dots line)Print speed*1100mm/s60mm/sPaper feed speed (/ATF)Approx. 30mm/s*1: Conditions:equivalentorPD150RPaper:9.5VVoltage:Print ratio: Up to 12.5%Operating temperature/humidity: 25°C, 60+/-15% (no condensation)Symbol NameFunction Note CN1Serial interface connector Serial connection -CN2Power connector Power connection -CN3USB connectorUSB connection -CN4Printer mechanism connector Printer connection -CN5Near end connectorNear end switch connection-■ Dimensions■ Control circuit board and connector typesNote: Please connect frame ground and φ4 through hole screw hole.Tolerance: ±0.2mm Unit: mm3.02.562.267.228.032.0CN31.210.0CN2CN1CN4CN52-Ø2.5(TH)3-Ø2.5(NTH)11.62.0No.Signal I/O Content No Signal I/O Content 1Vbus I Vbus signal 2D-I/O D- signal 3D+I/O D+ signal 4N.C.-Not connected 5GND-Signal ground6FG-Frame ground• USB Connector (CN3)Mating connector part number: USB mini-B type Recommended cable: Cable conforming to USB standards (V2.0 full speed)■ Connector Pin Assignment of interface boardNote: Symbol “-” means a negative logic signal. “I” or “O” means a signal direction from the interface board side. • Serial interface connector (CN1)Mating connector part number: ZHR-8 (J.S.T.) or equivalent Recommended cable: AWG#26 to 32, cable length max. 500mm No.Signal I/O Content No Signal I/O Content 1Vp I Power input 2Vp I Power input 3GND-Ground4GND-Ground• Power connector (CN2)Mating connector part number: XHP-4 (J.S.T.) or equivalentRecommended cable: AWG#22 to 30, cable length max. 300mmNo.Signal I/O ContentNo Signal I/O Content1RXD I Receive data signal 2TXD O Transmission data signal 3RTS (DTR)O Request to send signal 4GND -Signal ground5CTS (DSR)I Clear to send signal 6/SLCTIN I Dection function disabled signal 7/INPRMIInitialization signal8/ATFIPaper feed I/O Description I/O Description 1NVcc O Near end sensor power 2/NESINear end signal3GND-Signal ground• Near end Connector (CN5)Mating connector part number: SHR-03V-S (J.S.T.) or equivalent Recommended cable: AWG#28to 32, cable length max. 300mm • Printer mechanism connector(CN4)Please refer to the printer mechanism datasheet■Connector pin assignments of printer mechanism (2-inch)Command ContentHT Moves print position to the next tabLF Line feedFF Feeds forms (new page)DC2Power downESC RS Black/white reverse printing specification ESC SP+n Character space settingESC US Black/white reverse printing cancellation ESC !+n Sets print modeESC *+m+nL+nH+d1 to dk Bit image printESC -n Undeline settingESC 2Sets default line spacingESC 3+n Line pitch settingESC @Printer resetESC A+n Line spacing settingESC C+n Sets the page length line modeESC D+n1 to nk+NUL Sets horizontal tab positionESC J+n Feeds paper in forward direction and prints ESC R+n Selects internationl characterESC V+n Right rotation 90° specification/cancellation ESC X+m+n Setting the turning time of the motor excitation ESC a+n Positional alignmentESC c+1+n Sets internal processingESC c+5+n External input signal valid/invalid setting ESC d+n Printing and n-line feedingESC s+n Sets printing speedESC t+n Character code table selectionESC {+n Sets/resets updside down printingFS 9+n Sets the detection functionsFS E+n Standard energy settingFS r+n Reply parameter settingGS !+n Character size settingGS (+E+pL+PH+fn+d1 to d9 (fn=67)RS-232C communication setting *1GS (K+pL+pH+fn Print control settingGS(K+pL+pH+fn+n (fn=49)Print density settingGS(K+pL+pH+fn+n (fn=50)Print speed settingGS(K+pL+pH+fn+n (fn=97)Number of head division settingGS <Line feeds to the next markGS A+m+n Sets the line feed length after mark detection GS E+n Sets print qualityGS L+nL+nH Left margin settingGS W+nL+nH Sets print area widthContactCopyrightAll trademarks or registered trademarks are the property of their respective owners. Fujitsu Components America or its affiliates do not warrant that the content of datasheet is error free. In a continuing effort to improve our products Fujitsu Components America, Inc. or its affiliates reserve the right to change specifications/datasheets without prior notice. Copyright ©2019 Fujitsu Components America, Inc. All rights reserved. Revised July 26, 2019.JapanFUJITSU COMPONENT LIMITED Shinagawa Seaside Park Tower 12-4, Higashi-shinagawa 4-chome,Tokyo 140 0002, Japan Tel: (81-3) 3450-1682Fax: (81-3) 3474-2385Email:***************** Web: /jp/group/fcl/en/North and South AmericaFUJITSU COMPONENTS AMERICA, INC.2290 North First Street, Suite 212 San Jose, CA 95131 U.S.A.Tel: (1-408) 745-4900Fax: (1-408) 745-4970Email:*********************.comWeb: https:///components/EuropeFUJITSU COMPONENTS EUROPE B.V.Diamantlaan 252132 WV Hoofddorp NetherlandsTel: (31-23) 5560910Fax: (31-23) 5560950Email:*****************.comWeb: /components/Asia PacificFUJITSU COMPONENTS ASIA, Ltd.102E Pasir Panjang Road#01-01 Citilink Warehouse Complex, Singapore 118529Tel: (65) 6375-8560 / Fax: (65) 6273-3021Email:*****************.com/sg/products/devices/components/ChinaFUJITSU ELECTRONIC COMPONENTS (SHANGHAI) CO., LTD.Unit 4306, InterContinental Center100 Yu Tong Road, Shanghai 200070, China Tel: (86 21) 3253 0998 /Fax: (86 21) 3253 0997Email:***************.com/cn/products/devices/ components/Hong KongFUJITSU COMPONENTS HONG KONG Co., Ltd.Room 06, 28/F, Greenfield Tower, Concordia Plaza, No.1 Science Museum Road, Tsim Sha Tsui East, Kowloon, Hong Kong Tel: (852) 2881 8495 Fax: (852) 2894 9512Email:*****************.com/sg/products/devices/components/KoreaFUJITSU COMPONENTS KOREA, LTD.Alpha Tower #403, 645 Sampyeong-dong, Bundang-gu, Seongnam-si, Gyeonggi-do, 13524 Korea Tel: (82 31) 708-7108Fax: (82 31) 709-7108Email:*****************.com /sg/products/devices/components/Command ContentGS a+n Set auto status transmission GS e+m+n Sets bar code width GS h+nBarcode height setting GS k+m+n+d1 to dn Bar code printGS w+nBar code width magnification setting*1: Makes write/erase to the nonvolative memory.。

HDS系列存储产品技术资料

HDS系列存储产品技术资料HDS存储目录第1章 HDS系列产品手册资料 (4)1.1 HDS VSP G1000（高端存储－1及高端存储扩容－1/2）产品介绍 (4)14.1.1概述 (4)14.1.2 VSP G1000产品亮点 (4)14.1.3 VSP G1000产品技术优势 (5)14.1.4 VSP G1000软件包 (14)14.1.5 VSP G1000产品技术指标 (25)1.2 HDS HUS-VM（高端存储－2/3及高端存储扩容－3/4）产品介绍 (30)14.2.1概述 (30)14.2.2 HUS VM技术的技术优势 (33)14.2.3HUS VM软件包 (40)14.2.4 HUS VM产品技术指标 (43)1.3 HDS VSP G200（中端存储1/2/3）产品介绍 (46)14.3.1概述 (46)14.3.2VSP Gx00系列产品亮点 (47)14.3.3 VSP Gx00技术优势 (48)14.3.4 VSP Gx00软件包 (49)14.3.5 VSP Gx00产品技术指标 (49)1.4 存储虚拟化兼容列表（VSP G1000/G200/HUS-VM通用） (54)1.5 HDS HCP（归档存储网关）产品介绍 (58)14.5.1什么是归档及其影响 (58)14.5.2归档平台与SAN和NAS的区别 (60)14.5.3HCP 概述 (61)14.5.4HCP优势 (62)14.5.5HCP功能介绍 (63)1.6 HDS Brocade 6510（光纤交换机－1/2及光纤交换机扩容）产品介绍 (69)14.6.1 亮点 (69)14.6.2 概述 (70)14.6.3 超高的性价比，支持不断增长的 SAN 工作负载 (70)14.6.4行业领先的技术，灵活、简单而且简便易用 (71)14.6.5拟化私有云存储的有机组成部分 (71)14.6.6 Brocade Access Gateway（接入网关）模式错误！未定义书签。

HDSP-311A资料

DescriptionThis 10.16 mm (0.4 inch) LED single digit seven segment display uses industry standard size package and pinout. The device is available in either common anode or common cathode. The choice of colors includes High Efficiency Red (HER), Green, AlGaAs Red, and Yellow. The gray face displays are suitable for indoor use.Agilent HDSP-311x/313x10.16 mm (0.4 inch) Single Digit General Purpose Seven Segment DisplayData SheetApplications•Suitable for indoor use•Not recommended for industrial application, i.e., operating temperature requirementsexceeding +85˚C or below –25˚C [1]•Extreme temperature cycling not recommendedNote:1.For additional details, please contact your local Agilent sales office or an authorized distributor.Devices HERGreenAlGaAs Red Yellow DescriptionPackage Drawing HDSP-311E HDSP-311G HDSP-311A HDSP-311Y Common Anode Right A Hand DecimalHDSP-313EHDSP-313GHDSP-313AHDSP-313YCommon Cathode Right BHand DecimalFeatures•Industry standard size•Industry standard pinout10.16 mm (0.4 inch) character height DIP lead on 2.54 mm •Choice of colorsHigh Efficiency Red (HER), Green,AlGaAs Red, and Yellow •Excellent appearanceEvenly lighted segments gray package gives optimum contrast ± 50 ft. viewing angle •Design flexibilityCommon anode right handdecimal point or common cathode right hand decimal point •Categorized for luminous intensityGreen and yellow categorized for colorPart Numbering SystemNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative for details.2. Bin options refer to shippable bins for a part number. Color and Intensity Bins are typically restricted to 1bin per tube (exceptions may apply). Please refer to respective datasheet for specific bin limit information.5082 -X X X X-X X X X X HDSP-X X X X-X X X X XMechanical Options [1]00: No Mechanical Option Color Bin Options [1,2]0: No Color Bin LimitationMaximum Intensity Bin [1,2]0: No Maximum Intensity Bin Limitation Minimum Intensity Bin [1,2]0: No Minimum Intensity Bin Limitation Device Configuration/Color [1]A: AlGaAs RedE: High Efficiency Red G: Green Y: YellowDevice Specific Configuration [1]Refer to Respective Datasheet Package [1]Refer to Respective DatasheetPackage Drawing AFRONT VIEW TOP END VIEWDIMENSIONS IN MILLIMETERS (INCHES)Package Drawing BFRONT VIEW RIGHT SIDECOUNTRY113108721193.14 COMPIN No.12378910111314CONNECTION CATHODE A CATHODE F COMMON ANODE CATHODE E CATHODE D CATHODE DP CATHODE C CATHODE G CATHODE B COMMON ANODEPINS 4, 5, 6, 12: NO PINHDSP-311E/311G/311Y/311ACOMMON ANODE RIGHT HAND DECIMALInternal Circuit Diagram1097542163.8 COMPIN NO.12345678910CONNECTION ANODE G ANODE F COMMON CATHODEANODE E ANODE D ANODE DP ANODE C COMMON CATHODEANODE B ANODE AHDSP-313E/313G/313Y/313ACOMMON CATHODE RIGHT HAND DECIMALGreen Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 1.25 3.20mcd I F = 10 mA Forward Voltage V F 2.06V I F = 10 mA 1.802.25 2.60V I F = 20 mAPeak Wavelength λPEAK 568nm Dominant Wavelength λd 573nm Reverse VoltageVR5VI R = 100 µA311G 313GAbsolute Maximum Ratings at T A = 25˚C HERGreenAlGaAs Red Yellow DescriptionHDSP-31xE HDSP-31xG HDSP-31xA HDSP-31xY Units Power Dissipation Segment 65653052mW Forward Current Segment25[1]25[2]15[3]20[4]mA Peak Forward Current per Segment 1001008080mA (1/10 Duty Factor at 10 KHz)Operating Temperature Range –35 to +85–35 to +85–35 to +85–35 to +85˚C Storage Temperature Range–35 to +85–35 to +85–35 to +85–35 to +85˚C Reverse Voltage per Segment or DP5555V Wavesoldering Temperature for 3 seconds 250250250250˚C(at 2 mm Distance from the body)Notes:1.Derate above 25˚C at 0.33 mA/˚C.2.Derate above 25˚C at 0.33 mA/˚C.3.Derate above 25˚C at 0.2 mA/˚C.4.Derate above 25˚C at 0.27 mA/˚C.Electrical/Optical Characteristics at T A = 25˚C High Efficiency Red (HER)Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 1.49mcd I F = 5 mA 1.253.20mcd I F = 10 mA Forward Voltage V F 2.05 2.40V I F = 20 mAPeak Wavelength λPEAK 635nm Dominant Wavelength λd 620nm Reverse VoltageVR5VI R = 100 µA311E 313EYellow Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 0.86mcd I F = 5 mA 0.801.50mcd I F = 10 mA Forward Voltage V F2.15 2.60V I F = 20 mAPeak Wavelength λPEAK 595nm Dominant Wavelength λd 590nm Reverse VoltageVR5VI R = 100 µA311Y 313YAlGaAs Red Devices HDSP-ParameterSymbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment I V 4.54mcd I F = 5 mA 3.207.50mcd I F = 10 mA Forward Voltage V F 1.85 2.00V I F = 20 mAPeak Wavelength λPEAK 660nm Dominant Wavelength λd 643nm Reverse VoltageVR5VI R = 100 µA311A313AColor Bin Limits (nm at 10 mA)Dominant Wavelength (nm)Color Bin Note:1.Tolerance for each bin limit is 1 nm.Intensity Bin Limits (mcd at 10 mA)Bin HER/Green Yellow AlGaAs Red Name Min.[1]Max.[1]Min.[1]Max.[1]Min.[1]Max.[1]G NA NA 0.801 1.250NA NA H 1.251 2.000 1.251 2.000NA NA I 2.001 3.200 2.001 3.200NA NA J 3.201 5.050NA NA 3.201 5.050K NA NA NA NA 5.0518.000LNANANANA8.00112.650Note:1.Tolerance for each bin limit is ± 10%.Figure 1. Maximum allowable average or DC current vs. ambient temperature.Figure 2. Forward current vs. forward voltage.Figure 3. Relative luminous intensity vs. DC forward current.High Efficiency Red (HER)Figure 4. Relative efficiency (luminousintensity per unit current) vs. peak current.30020*********T A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A2.52.01.51.00.5051015202530I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )1.4005101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 7. Relative luminous intensity vs. DC forward current.Figure 8. Relative efficiency (luminous intensity per unit current) vs. peak current.Figure 5. Maximum allowable average or DC current vs. ambient temperature.Figure 6. Forward current vs. forward voltage.Green302520151050020*********T A – AMBIENT TEMPERATURE – °CM A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m A3.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )35R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.2Figure 9. Maximum allowable average or DC current vs. ambient temperature.Figure 10. Forward current vs. forward voltage.Figure 11. Relative luminous intensity vs. DC forward current.Figure 12. Relative efficiency (luminous intensity per unit current) vs. peak current.AlGaAs RedT A – AMBIENT TEMPERATURE – °C M A X I M U M D C C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VI F – F O R W A R D C U R R E N T P E R S E G M E N T – m AR E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A )05101520253035404550I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA0.20.40.60.81.01.23.02.52.01.51.00.500510********I F – FORWARD CURRENT FOR SEGMENT – mAR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D T O 1 A T 10 m A )3511Figure 13. Maximum allowable average or DC current vs. ambient temperature.Figure 14. Forward current vs. forward voltage.Figure 15. Relative luminous intensity vs. DC forward current.Figure 16. Relative efficiency (luminous intensity per unit current) vs. peak current.Yellow2520151050T A – AMBIENT TEMPERATURE – °CM AX IMUMD CCUR RENTP ERSEG ME N T–mAV F – FORWARD VOLTAGE – V I F – F O R W A R D C U R R E N T P E R S E G M E N T – m A 3.52.52.01.51.00.50051015202530I F – FORWARD CURRENT FOR SEGMENT – mA RE L A T I V E L U M IN O U SIN T E N S IT Y (NORM ALIZ E DTO1A T1m A)353.0R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D T O 1 A T 10 m A ) 1.4005101520253035404550I PEAK – PEAK FORWARD CURRENT PER SEGMENT – mA 0.20.40.60.81.01.2/semiconduc-torsFor product information and a complete list of distributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or (916) 788-6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6756 2394India, Australia, New Zealand: (+65) 6755 1939 Japan: (+81 3) 3335-8152(Domestic/ International), or 0120-61-1280(Domestic Only) Korea: (+65) 6755 1989Singapore, Malaysia, Vietnam, Thailand, Philippines, Indonesia: (+65) 6755 2044 Taiwan: (+65) 6755 1843Data subject to change.June 30, 20045988-2969EN。

HDSP-2110资料

HDSP-210x Series, HDSP-211x Series, HDSP-250x SeriesFeatures• X stackable (HDSP-21xx)• XY stackable (HDSP-250x)• 128 sharacter ASCII decoder • Programmable functions • 16 user definable characters• Multi-level dimming and blanking • TTL compatible CMOS IC • Wave solderableApplications• Computer peripherals • Industrial instrumentation • Medical equipment• Portable data entry devices • Cellular phones• Telecommunications equipment • Test equipmentDescriptionThe HDSP-210x/-211x/-250x series of products is ideal for applications where displaying eight or more characters of dot matrix information in an aes-thetically pleasing manner is required. These devices are 8-digit, 5 x 7 dot matrix, alphanumeric displays and are all packaged in a standard 15.24 mm (0.6 inch) 28 pin DIP . The on-board CMOS IC has the ability to decode 128 ASCII characters which are permanently stored in ROM. In addition, 16 programmable symbols may be stored in on- board ROM, allowing considerable flexibility for dis-playing additional symbols and icons. Seven brightness levels provide versatility in adjusting the display intensity and power consumption. The HDSP-210x/-211x/-250x products are designed for standard microprocessor interface techniques. The display and special features are accessed through a bidirectional 8-bit data bus.Device Selection Guide AlGaAs High EfficiencyFont Height RedRedOrangeYellowGreen0.2 inches HDSP-2107 HDSP-2112 HDSP-2110 HDSP-2111 HDSP-21130.27 inchesHDSP-2504HDSP-2502HDSP-2500HDSP-2501HDSP-2503HDSP-210x SeriesEight Character 5 mm and 7 mm Smart Alphanumeric DisplaysData SheetESD WARNING: STANDARD CMOS HANDLING PRECAUTIONS SHOULD BE OBSERVED TO AVOID STATIC DISCHARGE.Absolute Maximum RatingsSupply Voltage, V DD to Ground [1] -0.3 to 7.0 V Operating Voltage, V DD to Ground [2] 5.5 VInput Voltage, Any Pin to Ground-0.3 to V DD +0.3 V Free Air Operating Temperature Range, T A [3] -45°C to +85°C Storage Temperature Range, T S -55°C to +100°C Relative Humidity (non-condensing) 85%Soldering Temperature[1.59 mm (0.063 in.) Below Body] Solder Dipping 260°C for 5 secs Wave Soldering250°C for 3 secs ESD Protection @ 1.5 kΩ, 100 pFV Z = 4 kV (each pin)Notes:1. Maximum Voltage is with no LEDs illuminated.2. 20 dots ON in all locations at full brightness.3. Maximum supply voltage is 5.25 V for operation above 70°C.PIN FUNCTION ASSIGNMENT TABLENOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.NOTES:1. DIMENSIONS ARE IN mm (INCHES).2. UNLESS OTHERWISE SPECIFIED, TOLERANCE ON ALL DIMENSIONS IS ± 0.25 mm (0.010 INCH).3. FOR YELLOW AND GREEN DEVICES ONLY.ASCII Character Set HDSP-210X, HDSP-211X, HDSP-250X SeriesRecommended Operating ConditionsParameter Symbol Minimum Nominal Maximum Units Supply Voltage V DD 4.5 5.0 5.5 VElectrical Characteristics Over Operating Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedT A = 25°C -45°C < T A < + 85°CV DD = 5.0 4.5 V < V DD < 5.5 VParameter Symbol Typ. Max. Min. Max. Units Test Conditions Input Leakage I IH 1.0 µA V IN = 0 to V DD, (Input without pullup) I IL-1.0 pins CLK, D0-DA0-A4Input Current I IPL-11 -18 -30 µA V IN = 0 to V DD, (Input with pullup) pins CLS, RST,WR, RD, CE, FL I DD Blank I DD (BLK) 0.5 3.0 4.0 mA V IN = V DDI DD 8 digits I DD(V) 200 255 330 mA “V” on in all 812 dots/character[1,2]locationsI DD 8 digits I DD(#) 300 370 430 mA “#” on in al20 dots/character[1,2,3,4] locations Input Voltage High V IH 2.0 V DD V+0.3Input Voltage Low V IL GND 0.8 V-0.3 VOutput Voltage High V OH 2.4 V V DD = 4.5 V,I OH = -40 µA Output Voltage Low V OL0.4 V V DD = 4.5 V, D0-D7 I OL = 1.6 mA Output Voltage Low V OL0.4 V V DD = 4.5 V, CLK I OL = 40 µA High Level Output I OH-60 mA V DD = 5.0 V CurrentLow Level Output I OL50 mA V DD = 5.0 V CurrentThermal Resistance R q J-C15 °C/WIC Junction-to-CaseNotes:1. Average I DD measured at full brightness. See Table 2 in Control Word Section for I DD at lower brightness levels. Peak I DD = 28/15 x I DD (#).2. Maximum I DD occurs at -55°C.3. Maximum I DD(#) = 355 mA at V DD = 5.25 V and IC T J = 150°C.4. Maximum I DD(#) = 375 mA at V DD =5.5 V and IC T J = 150°C.Optical Characteristics at 25°C[1]V DD = 5.0 V at Full BrightnessLuminous Intensity Peak DominantCharacter Average (#) Wavelength Wavelength Part Iv (mcd) l Peak l d Description Number Min. Typ. (nm) (nm) AlGaAs HDSP-2107 8.0 15.0 645 637-2504HER HDSP-2112 2.5 7.5 635 626-2502Orange HDSP-2110 2.5 7.5 600 602-2500Yellow HDSP-2111 2.5 7.5 583 585-2501High Performance HDSP-2113 2.5 7.5 568 574 Green -2503Note:1. Refers to the initial case temperature of the device immediately prior to measurement.AC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD <5.5 V, unless otherwise specifiedReferenceNumber Symbol Description Min.[1]Units1 t ACC Display Access TimeWrite 210Read 230 ns2 t ACS Address Setup Time to Chip Enable 10 ns3 t CE Chip Enable Active TimeWrite 140Read 160 ns4 t ACH Address Hold Time to Chip Enable 20 ns5 t CER Chip Enable Recovery Time 60 ns6 t CES Chip Enable Active Prior to Rising Edge ofWrite 140Read 160 ns7 t CEH Chip Enable Hold Time to Rising Edge ofRead/Write Signal[2,3]0 ns8 t W Write Active Time 100 ns9 t WSU Data Write Setup Time 50 ns10 t WH Data Write Hold Time 20 ns11 t R Chip Enable Active Prior to Valid Data 160 ns12 t RD Read Active Prior to Valid Data 75 ns13 t DF Read Data Float Delay 10 nst RC Reset Active Time300 ns Notes:1. Worst case values occur at an IC junction temperature of 150°C.2. For designers who do not need to read from the display, the Read line can be tied to V DD and the Write and Chip Enable lines can be tied to-gether.3. Changing the logic levels of the Address lines when CE = “0” may cause erroneous data to be entered into the Character RAM, regardless of the logic levels of the WR and RD lines.4. The display must not be accessed until after 3 clock pulses (110 µs min. using the internal refresh clock) after the rising edge of the reset line.Write Cycle Timing DiagramAC Timing Characteristics Over Temperature Range (-45°C to +85°C)4.5 V < V DD < 5.5 V, unless otherwise specified Symbol Description 25°C Typ. Min.[1]UnitsF OSC Oscillator Frequency 57 28 kHz F RF [2] Display Refresh Rate 256 128 Hz F FL [3] Character Flash Rate 2 1 Hz t ST [4]Self Test Cycle Time4.69.2secNotes:1. Worst case values occur at an IC junction temperature of 150°C.2. F RF = F OSC /224.3. F FL = F OSC /28,672.4. t ST = 262,144/F OSC .INPUT PULSE LEVELS: 0.6 V to 2.4 VRead Cycle Timing DiagramRelative Luminous Intensity vs. TemperatureINPUT PULSE LEVELS: 0.6 V to 2.4 VOUTPUT REFERENCE LEVELS: 0.6 V to 2.2 V OUTPUT LOADING = 1 TTL LOAD AND 100 pFR E L A T I V E L U M I N O U S I N T E NS I T Y (N O R M A L I Z E D T O 1 A T 25°C )T A – AMBIENT TEMPERATURE – °C3.53.02.51.51.00.52.0Electrical DescriptionPin Function DescriptionRESET (RST, pin 1) Initializes the display.FLASH (FL, pin 2) FL low indicates an access to the Flash RAM and is unaffected by thestate of address lines A3-A4.ADDRESS INPUTS Each location in memory has a distinct address. Address inputs (A0-A2) (A0-A4, pins 3-6, 10) select a specific location in the Character RAM, the Flash RAM or aparticular row in the UDC (User-Defined Character) RAM. A3-A4are usedto select which section of memory is accessed. Table 1 shows thelogic levels needed to access each section of memory.Table 1. Logic Levels to Access MemorySection of Memory FL A4 A3A2 A1 A0Flash RAM 0 X X Char. AddressUDC Address Register 1 0 0 Don’t CareUDC RAM 1 0 1 Row AddressControl Word Register 1 1 0 Don’t CareCharacter RAM 1 1 1 Character AddressCLOCK SELECT Used to select either an internal (CLS = 1) or external (CLS = 0) clock source. (CLS, pin 11)CLOCK INPUT/OUTPUT Outputs the master clock (CLS = 1) or inputs a clock (CLS = 0) for slave displays. (CLK, pin 12)WRITE (WR, pin 13) Data is written into the display when the WR input is low and the CE input is low. CHIP ENABLE (CE, pin 17) Must be at a logic low to read or write data to the display and must go high betweeneach read and write cycle.READ (RD, pin 18) Data is read from the display when the RD input is low and the CE input is low. DATA Bus (D0-D7, Used to read from or write to the display.pins 19, 20, 23-28)GND (SUPPLY) (pin 15) Analog ground for the LED drivers.GND (LOGIC) (pin 16) Digital ground for internal logic.V DD (POWER) (pin 14) Positive power supply input.F i g u r e 1. H D S P -210X /-211X /-212X /-250X i n t e r n a l b l o c k d i a g r a m .Character RAM This RAM stores either ASCII character data or a UDC RAM address.Flash RAMThis is a 1 x 8 RAM which stores Flash data.User-Defined Character RAM This RAM stores the dot pattern for custom characters.(UDC RAM)User-Defined Character This register is used to provide the address to the UDC RAM when the user is Address Registerwriting or reading a custom character.(UDC Address Register)Control Word Register This register allows the user to adjust the display brightness, flash individualcharacters, blink, self test, or clear the display.Display Internal Block DiagramFigure 1 shows the internal block diagram of the HDSP-210X/-211X/-250X displays. The CMOS IC consists of an 8 byte Character RAM, an 8 bit Flash RAM, a 128 character ASCII decoder, a 16 character UDC RAM, a UDC AddressRegister, a Control Word Register, and refresh circuitry necessary to synchronize the decoding and driving of eight 5 x 7 dot matrix characters. The major user-acces-sible portions of the display are listed below:Character RAMFigure 2 shows the logic levels needed to access the HDSP-210X/-211X/-250X Character RAM. During a normal access, the CE = “0” and either RD = “0” or WR = “0.” However, erroneous data may be written into the Character RAM if the address lines are unstable when CE = “0” regardless of the logic levels of the RD or WR lines. Address lines A 0-A 2 are used to select the location in the Character RAM. Two types of data can be stored in each Character RAM location: an ASCII code or a UDC RAM address. Data bit D 7 is used to differentiate between the ASCII character and a UDC RAM address. D 7 = 0 enables the ASCII decoder and D 7 = 1 enables the UDC RAM. D 0-D 6 are used to input ASCII data and D 0-D 3 are used to input a UDC address.Figure 2. Logic levels to access the character RAM.CE FL A 4A 3A 2A 1A 0RST WR RD CHARACTER ADDRESSSYMBOL IS ACCESSED IN LOCATIONSPECIFIED BY THE CHARACTER ADDRESS ABOVE 0100011111011UNDEFINEDCONTROL SIGNALSCHARACTER RAM ADDRESSCHARACTER RAM DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = LEFT MOST 111 = RIGHT MOSTD 7D 6D 5D 4D 3D 2D 1D 00128 ASCII CODEXXXUDC CODE1DISPLAY0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREDIG 0DIG 1DIG 2DIG 3DIG 4DIG 5DIG 6DIG 7001010011100101110111000UDC RAM and UDC Address RegisterFigure 3 shows the logic levels needed to access the UDC RAM and the UDC Address Register. The UDC Address Register is eight bits wide. The lower four bits (D 0-D 3) are used to select one of the 16 UDC locations. The upper four bits (D 4-D 7) are not used. Once the UDC address has been stored in the UDC Address Register, the UDC RAM can be accessed.To completely specify a 5 x 7 character, eight write cycles are required. One cycle is used to store the UDC RAM address in the UDC Address Register and seven cycles are used to store dot data in the UDC RAM. Data is entered by rows and one cycle is needed to access each row. Figure 4 shows the organization of a UDC character assuming the symbol to be stored is an “F.” A 0-A 2 are used to select the row to be accessed and D 0-D 4 are used to transmit the row dot data. The upper three bits (D 5-D 7) are ignored. D 0 (least significant bit) corresponds to the right most column of the 5 x 7 matrix and D 4 (most significant bit) corresponds to the left most column of the 5 x 7 matrix.Flash RAMFigure 5 shows the logic levels needed to access the Flash RAM. The Flash RAM has one bit associated with each location of the Character RAM. The Flash input is used to select the Flash RAM while address lines A 3-A 4 are ignored. Address lines A 0-A 2 are used to select the location in the Flash RAM to store the attribute. D 0 is used to store or remove the flash attribute. D 0 = “1” stores the attribute and D 0 = “0” removes the attribute.When the attribute is enabled through bit 3 of the Control Word and a “1” is stored in the Flash RAM, the corresponding character will flash at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock the flash rate can be calculated by dividing the clock frequency by 28,672.Figure 4. Data to load “”F’’ into the UDC RAM.Figure 3. Logic levels to access a UDC character.CE FL A 4A 3A 2A 1A 0RST WR RD 010001101XXX011UNDEFINEDCONTROL SIGNALSUDC ADDRESS REGISTER ADDRESSUDC ADDRESS REGISTER DATA FORMATWRITE TO DISPLAY READ FROM DISPLAY UNDEFINED000 = ROW 1110 = ROW 7D 7D 6D 5D 4D 3D 2D 1D 0XUDC CODEXXXFL A 4A 3A 2A 1A 011ROW SELECTUDC RAM ADDRESSUDC RAM C C DATA FORMATO O L L 150 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARED 7D 6D 5D 4D 3D 2D 1D 0XDOT DATAXXCE RST WR RD 0100011011UNDEFINEDCONTROL SIGNALSWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDC C C C C O O O O O L L L L L 1 2 3 4 5D 4D 3D 2D 1D 0UDC CHARACTER HEX CODE 1 1 1 1 1 ROW 1 • • • • • 1F 1 0 0 0 0 ROW 2 • 101 0 0 0 0 ROW 3 •101 1 1 1 0 ROW 4 • • • • 1D 1 0 0 0 0 ROW 5 • 101 0 0 0 0 ROW 6 • 101 0 0 0 0 ROW 7• 10IGNORED0 = LOGIC 0; 1 = LOGIC 1; * = ILLUMINATED LEDFigure 5. Logic levels to access the flash RAM.Table 2. Current Requirements at Different Brightness Levels V DD = 5.0 V % Current at 25°C Symbol D 2 D 1 D 0 Brightness Typ.UnitsI DD (V) 0 0 0 100 200 mA 0 0 1 80 160 mA 0 1 0 53 106 mA 0 1 1 40 80 mA 1 0 0 27 54 mA 1 0 1 20 40 mA111326mAFigure 6. Logic levels to access the control word registerControl Word RegisterFigure 6 shows how to access the Control Word Register. This 8-bit register performs five functions: Brightness control, Flash RAM control, Blinking, Self Test, and Clear. Each function is independent of the others; however, all bits are updated during each Control Word write cycle.Brightness (Bits 0-2)Bits 0-2 of the Control Word adjust the brightness of the display. Bits 0-2 are interpreted as a three bit binary code with code (000) corresponding to maximum brightness and code (111) corresponding to a blanked display. In addition to varying the display brightness, bits 0-2 also vary the average value of I DD . I DD can be calculated at any brightness level by multiplying the percent brightness level by the value of I DD at the 100% brightness level. These values of I DD are shown in Table 2.Flash Function (Bit 3)Bit 3 determines whether the flashing character attribute is on or off. When bit 3 is a“1,” the output of the Flash RAM is checked. If the content of a location in the Flash RAM is a “1,” the associated digit will flash at approximately 2 Hz. For an external clock, the blink rate can be calculated by driving the clock frequency by 28,672. If the flash enable bit of the Control Word is a “0,” the content of the Flash RAM is ignored. To use this function with multiple display systems, see the Display Reset section.Blink Function (Bit 4)Bit 4 of the Control Word is used to synchronize blinking of all eight digits of the display. When this bit is a “1” all eight digits of the display will blink at approximately 2 Hz. The actual rate is dependent on the clock frequency. For an external clock, the blink rate can be calculated by dividing the clock frequency by 28,672. This function will override the Flash function when it is active. To use this function with multiple display systems, see the Display Reset section.CE FL A 4A 3A 2A 1A 0RST WR RD 0100011XX011UNDEFINEDREMOVE FLASH ATSPECIFIED DIGIT LOCATION STORE FLASH ATSPECIFIED DIGIT LOCATIONCONTROL SIGNALS FLASH RAM ADDRESS FLASH RAM DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CAREWRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0XXXXXXX01CHARACTER ADDRESS000 = LEFT MOST 111 = RIGHT MOSTCE FL A 4A 3A 2A 1A 0RST WR RD 01000111XXX1011UNDEFINEDCONTROL SIGNALSCONTROL WORD ADDRESSCONTROL WORD DATA FORMAT0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE0 DISABLE FLASH 1 ENABLE FLASHBRIGHTNESS CONTROL LEVELS 0 DISABLE BLINKING 1 ENABLE BLINKING0 NORMAL OPERATION1 CLEAR FLASH AND CHARACTER RAMS 0 X NORMAL OPERATION; X IS IGNORED 1 X START SELF TEST; RESULT GIVEN IN X X = 0 FAILED X = 1 PASSED WRITE TO DISPLAY READ FROM DISPLAY UNDEFINEDD 7D 6D 5D 4D 3D 2D 1D 0CSSBLFB000100%00180%01053%01140%10027%10120%11013%1110%BBFigure 7. Logic levels to reset the display.CE RST WR RD 0 = LOGIC 0; 1 = LOGIC 1; X = DO NOT CARE NOTE:IF RST, CE, AND WR ARE LOW, UNKNOWN DATA MAY BE WRITTEN INTO THE DISPLAY.FL 01XXXXXA 4 -A 0D 7 -D 0Self Test Function (Bits 5, 6)Bit 6 of the Control Word Register is used to initiate the self test function. Results of the internal self test are stored in bit 5 of the Control Word. Bit 5 is a read only bit where bit 5 = “1” indicates a passed self test and bit 5 = “0” indicates a failed self test.Setting bit 6 to a logic 1 will start the self test function. The built-in self test function of the IC consists of two internal routines which exercise major portions of the IC and illuminate all of the LEDs. The first routine cycles the ASCII decoder ROM through all states and performs a checksum on the output. If the checksum agrees with the correct value, bit 5 is set to “1.” The second routine provides a visual test of the LEDs using the drive circuitry. This is accomplished by writing checkered and inverse checkered patterns to the display. Each pattern is displayed for approximately 2 seconds.During the self test function the display must not be accessed. The time needed to execute the self test function is calculated by multiplying the clock period by 262,144. For example, assume a clock frequency of 58 KHz, then the time to execute the self test function frequency is equal to (262,144/58,000) = 4.5 second duration.At the end of the self test function, the Character RAM is loaded with blanks, the Control Word Register is set to zeros except for bit 5, the Flash RAM is cleared, and the UDC Address Register is set to all ones.Clear Function (Bit 7)Bit 7 of the Control Word will clear the Character RAM and the Flash RAM. Setting bit 7 to a “1” will start the clear function. Three clock cycles (110 ms minimum using the internal refresh clock) are required to complete the clear function. The display must not be accessed while the display is being cleared. When the clear function has been completed, bit 7 will be reset to a “0.” The ASCII character code for a space (20H) will be loaded into the Character RAM to blank the display and the Flash RAM will be loaded with “0”s. The UDC RAM, UDC Address Register, and the remainder of the Control Word are unaffected.Display ResetFigure 7 shows the logic levels needed to Reset the display. The display should be Reset on Power-up. The external Reset clears the Character RAM, Flash RAM, Control Word and resets the internal counters. After the rising edge of the Reset signal, three clock cycles (110 µs minimum using the internal refresh clock) are required to complete the reset sequence. The display must not be accessed while the display is being reset. The ASCII Character code for a space (20H) will be loaded into the Character RAM to blank the display. The Flash RAM and Control Word Register are loaded with all “0”s. The UDC RAM and UDC Address Register are unaffected. All displays which operate with the same clock source must be simultaneously reset to synchronize the Flashing and Blinking functions.Mechanical and Electrical ConsiderationsThe HDSP-210X/-211X/-250X are 28 pin dual-in-line packages with 26 external pins. The devices can be stacked horizontally and vertically to create arrays of any size. The HDSP-210X/-211X/-250X are designed to operate continuously from -45°C to +85°C with a maximum of 20 dots on per character at 5.25 V. Illuminating all thirty-five dots at full brightness is not recommended.The HDSP-210X/-211X/-250X are assembled by die attaching and wire bonding 280 LED chips and a CMOS IC to a thermally conductive printed circuit board. A poly-carbonate lens is placed over the PC board creating an air gap over the LED wire bonds. A protective cap creates an air gap over the CMOS IC. Backfill epoxy environmentally seals the display package. This package construction makes the display highly tolerant to temperature cycling and allows wave soldering.The inputs to the IC are protected against static discharge and input current latchup. However, for best results standard CMOS handling precautions should be used. Prior to use, the HDSP-210X/-211X/-250X should be stored in antistatic tubes or in conductive material. During assembly, a grounded conductive work area should be used, and assembly personnel should wear conductive wrist straps. Lab coats made of synthetic material should be avoided since they are prone to static buildup. Input current latchup is caused when the CMOS inputs are subjected to either a voltage below ground (V IN < ground) or to a voltage higher than V DD (V IN > V DD ) and when a high current is forced into the input. To prevent input current latchup and ESD damage, unused inputs should be connected either to ground or to V DD . Voltages should not be applied to the inputs until V DD has been applied to the display.Thermal ConsiderationsThe HDSP-210X/-211X/-212X/250X have been designed to provide a low thermal resistance path for the CMOS IC to the 26 package pins. Heat is typically conducted through the traces of the printed circuit board to free air. For most applications no additional heatsinking is required.Measurements were made on a 32 character display string to determine the thermal resistance of the display assembly. Several display boards were constructed using 0.062 in. thick printed circuit material, and one ounce copper 0.020 in. traces. Some of the device pins were connected to a heatsink formed by etching a copper area on the printed circuit board surrounding the display. A maximally metallized printed circuit board was also evaluated. The junction temperature was measured for displays soldered directly to these PC boards, displays installed in sockets, and finally displays installed in sockets with a filter over the display to restrict airflow. The results of these thermal resistance measurements, Rq J-A are shown in Table 3 and include the effects of Rq J-C .Ground ConnectionsTwo ground pins are provided to keep the internal IC logic ground clean. The designer can, when necessary, route the analog ground for the LED drivers separately from the logic ground until an appropriate ground plane is available. On long interconnections between the display and the host system, the designer can keep voltage drops on the analog ground from affecting the display logic levels by isolating the two grounds.The logic ground should be connected to the same ground potential as the logic interface circuitry. The analog ground and the logic ground should be connected at a common ground which can withstand the current introduced by the switching LED drivers. When separate ground connections are used, the analog ground can vary from -0.3 V to +0.3 V with respect to the logic ground. Voltage below -0.3 V can cause all dots to be on. Voltage above +0.3 V can cause dimming and dot mismatch.Table 3. Thermal Resistance, q JA , Using Various Amounts of Heatsinking Material Heatsinking Metal W/Sockets W/O Sockets W/Sockets per Device W/O Filter W/O Filter W/Filter sq. in. (Avg.) (Avg.)(Avg.)Units0 31 30 35 °C/W 1 31 28 33 °C/W 330 26 33 °C/W Max. Metal 29 25 32 °C/W 4 Board Avg302733°C/WSoldering and Post SolderCleaning Instructions for the HDSP-210X/-211X/-250XThe HDSP-210X/-211X/-250X may be hand soldered or wave soldered with SN63 solder. When hand soldering, it is recommended that an electronically temperature controlled and securely grounded soldering iron be used. For best results, the iron tip temperature should be set at 315°C (600°F). For wave soldering, a rosin-based RMA flux can be used. The solder wave temperature should be set at 245°C ± 5°C (473°F ± 9°F), and the dwell in the wave should be set between 11 /2 to 3 seconds for optimum soldering. The preheat temperature should not exceed 105°C (221°F) as measured on the solder side of the PC board.For additional information on soldering and post solder cleaning, see Application Note 1027, Soldering LED Com-ponents .Contrast EnhancementThe objective of contrast enhancement is to provide good readability in a variety of ambient lighting condi-tions. For information on contrast enhancement see Application Note 1015, Contrast Enhancement Techniques for LED Displays .Color Bin LimitsColor Range (nm)Color BinMin. Max.Yellow 3 581.5 585.0 4 584.0 587.5 5 586.5 590.0 6 589.0 592.5 7 591.5 595.0Green 1 576.0 580.0 2 573.0 577.0 3 570.0 574.04567.0571.5Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-2107 Intensity Range (mcd)Bin Min. Max.I 5.12 9.01J 7.68 13.52K 11.52 20.28L 17.27 30.42M25.3945.63Note:Test conditions as specified in Optical Char-acteristic table.Intensity Bin Limits for HDSP-211x and HDSP-250x (Except HDSP-2504) Intensity Range (mcd)Bin Min. Max.G 2.50 4.00H 3.41 6.01I 5.12 9.01J 7.68 13.52K11.5220.28Note:Test conditions as specified in Optical Char-acteristic table.For product information and a complete list of distributors, please go to our website: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies Limited in the United States and other countries.Data subject to change. Copyright © 2005-2008 Avago Technologies Limited. All rights reserved. Obsoletes 5989-3183EN AV02-0629EN - May 9, 2008Intensity Bin Limit for HDSP-2504BinIntensity Range (mcd)Min.MaxJ 7.6813.52K 11.5220.28L 17.2730.42M 25.9145.63Note:Test conditions as specified in Optical Charac-teristic table.。

HDSP-711A资料

17.3 mm (0.68 inch) General Purpose 5 x 7 Dot Matrix Alphanumeric Displays Technical DataHDSP-70xE Series HDSP-71xE Series HDSP-70xG Series HDSP-71xG Series HDSP-70xA Series HDSP-71xA SeriesFeatures•5 x 7 Dot Matrix Font •Viewable up to 12 Meters •X-Y Stackable•Industry Standard Pin-out 7.6 mm (0.3 in.) Dual-in-line (DIP) Leads on 2.54 mm (0.1 in.) Centers •Choice of ColorsRed or Green or AlGaAs•Choice of Face Paint Colors Gray or Black•Design Flexibility Common Row Anode or Common Row Cathode•Categorized for Luminous Intensity•Green Categorized for ColorApplications•Suitable for Indoor Use •Not Recommended forIndustrial Applications, i.e.Operating Temperatures Requirements Exceeding 85°C or Below -35°C [1]•Extreme TemperatureCycling Not Recommended [2]DescriptionThese displays have a 17.3 mm (0.68 inch) character height and use industry standard size and pin-out. The devices are available in either common row anode or common row cathode configurations. The displays come in either gray or black face paint and are available in a choice of high efficiency red (HER) or green colors or AlGaAs.DevicesHER HDSP-Green HDSP-AlGaAs HDSP- Description701E 701G 701A 17.3 mm Gray Surface Common Row Anode 703E 703G 703A 17.3 mm Gray Surface Common Row Cathode 711E 711G 711A 17.3 mm Black Surface Common Row Anode 713E713G713A17.3 mm Black Surface Common Row CathodeNotes:1. For industrial applications, it is recommended to use HDSP-L201/L203/5401/5403/L101/L103.2. For details, please contact your local Agilent components sales office or an authorized distributor.These parts are subjected to Outgoing Quality Assurance(OQA) inspection with an AQL of 0.065% for functional and visual/cosmetic defects.For optimal intensityperformance, please consider our industrial grade displays: • HDSP-L20x • HDSP-540x • HDSP-L10xPackage DimensionsInternal Circuit DiagramCOLUMN COMMON ANODE ROWCOLUMN1234567COMMON CATHODE ROWCOMMON ROW ANODECOMMON ROW CATHODEPIN HDSP-701E/711E/701G/711G/701A/711APIN HDSP-703E/713E/703G/713G/703A/713A 1COLUMN 1 CATHODE 2ROW 3 ANODE3COLUMN 2 CATHODE 4ROW 5 ANODE 5ROW 6 ANODE 6ROW 7 ANODE7COLUMN 4 CATHODE 8COLUMN 5 CATHODE 9ROW 4 ANODE10COLUMN 3 CATHODE 11ROW 2 ANODE 12ROW 1 ANODE1ROW 1 CATHODE 2ROW 2 CATHODE 3COLUMN 2 ANODE 4COLUMN 1 ANODE 5ROW 5 CATHODE 6ROW 7 CATHODE 7COLUMN 3 ANODE 8ROW 5 CATHODE 9COLUMN 4 ANODE 10ROW 4 CATHODE 11ROW 3 CATHODE 12COLUMN 5 ANODEx = ROW OR COLUMN NUMBER, x = PIN NUMBER(NOTE 3)NOTES:1. ALL DIMENSIONS IN MILLIMETERS (INCHES).2. ALL UNTOLERANCED DIMENSIONS ARE FOR REFERENCE ONLY.3. FOR GREEN ONLY.CATEGORYMAX.MAX.LEFT SIDE VIEWFRONT VIEWEND VIEWDIA.Absolute Maximum Ratings at T A = 25°CHER AlGaAs Green HDSP-701E/HDSP-701A/HDSP-701G/ Parameter711E/703E/703A/711A/711G/703G/713E 713A 713G Units Average Power per Dot [1]657565mW Peak Forward Current per Dot [1,2]4012540mA (1/10 Duty Cycle, 0.1 ms Pulse Width)Average Forward Current per Dot [1]2523[3]25mA Reverse Voltage per Dot 333V Operating Temperature –35 to +85–35 to +85–35 to +85°C Storage Temperature–35 to +85–35 to +85–35 to + 85°C Lead Solder Temperature for 3 seconds [3]260260260°C(1.6 mm [0.063 in.] below seating plane)Notes:1. Do not exceed maximum average current per dot.2. Derate above 25°C at 0.2 mA/°C.3. Not recommended to be soldered more than 2 times. Minimum interval between solderings is 15 minutes. Total soldering time not to exceed 5 seconds.Optical/Electrical Characteristics at T A = 25°CHigh Efficiency Red Devices Test HDSP-ParameterSymbol Min.Typ.Max.UnitsConditions Luminous Intensity/Dot I V 1.33.6mcdI F = 50 mA,(Digit Average)[1]20% Duty FactorPeak Wavelength␭PEAK 635nm Dominant Wavelength [2]␭d 626nm Forward Voltage V F 2.6 3.5V I F = 50 mA Reverse Voltage [3]V R 3.025V I R = 100 µATemperature Coefficient of V F⌬V F /°C-2mV/°C701E 711E 703E 713EGreen Devices Test HDSP-ParameterSymbol Min.Typ.Max.UnitsConditions Luminous Intensity/Dot I V 0.964.0mcdI F = 50 mA,(Digit Average)[1]20% Duty FactorPeak Wavelength␭PEAK 566nm Dominant Wavelength [2]␭d 571nm Forward Voltage V F 2.6 3.5V I F = 50 mA Reverse Voltage [3]V R 3.025V I R = 100 µATemperature Coefficient of V F⌬V F /°C-2mV/°CNotes:1. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.2. The dominant wavelength ␭d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Typical specification for reference only. Do not exceed absolute maximum ratings.701G 711G 703G 713GIntensity Bin Limits [1](mcd at 50 mA, 20% Duty Factor)High Efficiency RedBin nameMin.[2]Max.[2]E 1.289 1.934F 1.934 2.900G 2.900 4.350H4.3506.525Notes:1. Bin categories are established for classification of products.Products may not be available in all bin categories.2. Tolerance for each intensity bin limit is ±10%.Green Bin nameMin.[2]Max.[2]H 0.96 1.44I 1.44 2.15J 2.15 3.23K 3.23 4.85L4.857.28AlGaAs Devices Test HDSP-ParameterSymbol Min.Typ.Max.Units Conditions Luminous Intensity/Dot I V 1.43.58.5mcdI F = 10 mA,(Digit Average)[1]20% Duty FactorPeak Wavelength␭PEAK 660nmDominant Wavelength [2]␭d 643nm Forward Voltage V F 2.0V I F = 10 mA Reverse Voltage [3]V R3.025VI R = 100 µANotes:1. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.2. The dominant wavelength ␭d is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device.3. Typical specification for reference only. Do not exceed absolute maximum ratings.701A 711A 703A 713A(mcd at 10 mA, 20% Duty Factor)AlGaAsBin nameMin.[2]Max.[2]I 1.40 2.56J 2.10 3.84K 3.14 5.75L4.708.55Notes:1. Bin categories are established for classification of products.Products may not be available in all bin categories.2. Tolerance for each intensity bin limit is ±10%.Figure 1. Maximum Allowable Average Current Per Dot vs. Ambient Temperature.Figure 2. Forward Current vs. Forward Voltage.Figure 3. Relative Luminous Intensity vs.DC Forward Current.Figure 4. Relative Efficiency (Luminous Intensity Per Unit Current Per Dot) vs. Peak Current Per Dot.I F – F O R W A R D C U R R E N T P E R S E G M E N T – m AV F – FORWARD VOLTAGE – VR E L A T I V E L U M I N O U S I N T E N S I T Y (N O R M A L I Z E D A T 10 m A )0I F – DC FORWARD CURRENT – mA4.03.02.51.50.53.52.01.0ηV – R E L A T I V E E F F I C I E N C Y (N O R M A L I Z E D A T 10 m A P E R S EG M E N T )0.8I PEAK – PEAK FORWARD CURRENTPER SEGMENT – mA1.41.31.21.11.00.9I D C – M A X I M U M D C C U R R E N T PE R S E G M E N T – m A0T A – AMBIENT TEMPERATURE – °C 3515510202530Contrast EnhancementFor information on contrastenhancement please seeApplication Note 1015.Soldering/CleaningCleaning agents from the ketonefamily (acetone, methyl ethylketone, etc.) and from thechlorinated hydrocarbon family(methylene chloride, trichloro-ethylene, carbon tetrachloride,etc.) are not recommended forcleaning LED parts. All of thesevarious solvents attack or dissolvethe encapsulating epoxies usedto form the package of plasticLED parts.For information on solderingLEDs please refer to ApplicationNote 1027.Device ReliabilityFor reliability information, pleasesee the reliability datasheet17.3 mm General Purpose5 x 7 Dot Matrix AlphanumericDisplays.Data subject to change.Copyright © 2000 Agilent Technologies, Inc.Obsoletes 5968-7199E (9/99)5980-0463E (4/00)。

HDSP-5551-D0000资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven SegmentDisplays Technical Data HDSP-335x SeriesHDSP-555x SeriesHDSP-751x SeriesHDSP-A10x Series HDSP-A80x Series HDSP-A90x Series HDSP-E10x Series HDSP-F10x Series HDSP-G10x Series HDSP-H10x Series HDSP-K12x, K70x Series HDSP-N10x SeriesHDSP-N40x SeriesDevicesAlGaAs HER Yellow Green Package HDSP-HDSP-HDSP-HDSP-Description Drawing A1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. Overflow H G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow[1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. Overflow P K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N101N40120 mm Common Anode Right Hand Decimal T N103N40320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N106N40620 mm Universal ±1. Overflow[1]W Note:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Part Numbering System5082-x xx x-x x x xxHDSP-x xx x-x x x xxMechanical Options[1]00: No mechanical optionColor Bin Options[1,2]0: No color bin limitationMaximum Intensity Bin[1,2]0: No maximum intensity bin limitationMinimum Intensity Bin[1,2]0: No minimum intensity bin limitationDevice Configuration/Color[1]G: GreenDevice Specific Configuration[1]Refer to respective datasheetPackage[1]Refer to Respective datasheetNotes:1. For codes not listed in the figure above, please refer to the respective datasheet or contact your nearest Agilent representative fordetails.2. Bin options refer to shippable bins for a part-number. Color and Intensity Bins are typically restricted to 1 bin per tube (excep-tions may apply). Please refer to respective datasheet for specific bin limit information.Package DimensionsPackage Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red - HDSP-HERA10X/E10X/H10X HDSP-751X/Yellow GreenK12X/N10X/N40X335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPWave Soldering Temperature for 3Seconds (1.60 mm [0.063 in.] below 250°C seating body)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10x3600I F = 5 mA330650I F = 1 mAF10x, G10x3900I F = 5 mA390650I F = 1 mA E10x Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mAH10x, K12x4200I F = 5 mA270590I F = 1 mAN10x, N40x3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 µATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10x255F10x, G10x320E10x340Thermal Resistance LED RθJ-PIN°C/W/SegH10x, K12x Junction-to-Pin400N10x, N40x430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751x1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335x, 555x,K70x270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751x200335x Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555x, K70x345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90x2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 µATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.AlGaAs RedIntensity Bin Limits (mcd)AlGaAs RedHDSP-A10xIV Bin Category Min.Max.E0.3150.520F0.4280.759G0.621 1.16H0.945 1.71I 1.40 2.56J 2.10 3.84K 3.14 5.75L 4.708.55HDSP-E10x/F10x/G10xIV Bin Category Min.Max.D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-H10x/K12xIV Bin Category Min.Max.C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50HDSP-N10xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued HERHDSP-751xIV Bin Category Min.Max.B0.1600.240C0.2000.300D0.2500.385E0.3150.520F0.4280.759G0.621 1.16HDSP-751xIV Bin Category Min.Max.B0.2400.366C0.3000.477D0.3910.650E0.5320.923F0.755 1.39G 1.13 2.08H 1.70 3.14HDSP-555x/K70xIV Bin Category Min.Max.A0.2700.400B0.3250.500C0.4150.690D0.5650.990E0.810 1.50F 1.20 2.20G 1.80 3.30H 2.73 5.00I 4.097.50Intensity Bin Limits (mcd), continued YellowHDSP-A80xIV Bin Category Min.Max.D0.2500.385E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60GreenHDSP-A90xIV Bin Category Min.Max.E0.3150.520F0.4250.760G0.625 1.14H0.940 1.70I 1.40 2.56J 2.10 3.84K 3.14 5.76L 4.718.64M7.0713.00N10.6019.40O15.9029.20P23.9043.80Q35.8065.60Electrical/OpticalFor more information on electrical/optical characteristics, please see Application Note 1005.Contrast Enhancement For information on contrast enhancement, please see Application Note 1015.Soldering/Cleaning Cleaning agents from the ketone family (acetone, methyl ethyl ketone, etc.) and from the chorinated hydrocarbon family (methylene chloride, trichloro-ethylene, carbon tetrachloride, etc.) are not recommended for cleaning LED parts. All of these various solvents attack or dissolve the encapsulating epoxies used to form the package of plastic LED parts.For information on soldering LEDs, please refer to Application Note 1027.Note:All categories are established for classification of products. Productsmay not be available in all categories. Please contact your localAgilent representatives for further clarification/information.Color Categories/semiconductorsFor product information and a complete list ofdistributors, please go to our web site.For technical assistance call:Americas/Canada: +1 (800) 235-0312 or(916) 788 6763Europe: +49 (0) 6441 92460China: 10800 650 0017Hong Kong: (+65) 6271 2451India, Australia, New Zealand: (+65) 6271 2394Japan: (+81 3) 3335-8152(Domestic/International), or0120-61-1280(Domestic Only)Korea: (+65) 6271 2194Malaysia, Singapore: (+65) 6271 2054Taiwan: (+65) 6271 2654Data subject to change.Copyright © 2005 Agilent Technologies, Inc.Obsoletes 5988-8412ENJanuary 19, 20055989-0080EN。

HDSP3353资料

Features• Low Power Consumption • Industry Standard Size• Industry Standard Pinout • Choice of Character Size7.6 mm (0.30 in), 10 mm (0.40 in), 10.9 mm (0.43 in), 14.2 mm (0.56 in), 20 mm (0.80 in)• Choice of ColorsAlGaAs Red, High Efficiency Red (HER), Yellow, Green• Excellent Appearance Evenly Lighted Segments±50° Viewing Angle• Design FlexibilityCommon Anode or Common CathodeSingle and Dual DigitLeft and Right Hand Decimal Points±1. Overflow Character• Categorized for Luminous IntensityYellow and Green Categorized for ColorUse of Like Categories Yields a Uniform Display• Excellent for Long Digit String Multiplexing DescriptionThese low current seven segment displays are designed for applica-tions requiring low power consumption. They are tested and selected for their excellent low current characteristics to ensure that the segments are matched at low currents. Drive currents as low as 1 mA per segment are available.Pin for pin equivalent displays are also available in a standard current or high light ambient design. The standard current displays are available in all colors and are ideal for most applica-tions. The high light ambient displays are ideal for sunlight ambients or long string lengths. For additional information see the 7.6 mm Micro Bright Seven Segment Displays, 10 mm Seven Segment Displays, 7.6 mm/10.9 mm Seven Segment Displays, 14.2 mm Seven Segment Displays, 20 mm Seven Segment Displays, or High Light Ambient Seven Segment Displays data sheets.Low Current Seven Segment DisplaysTechnical Data HDSP-335X SeriesHDSP-555X SeriesHDSP-751X SeriesHDSP-A10X Series HDSP-A80X Series HDSP-A90X Series HDSP-E10X Series HDSP-F10X Series HDSP-G10X Series HDSP-H10X Series HDSP-K12X, K70X SeriesHDSP-N10X SeriesPackage DimensionsDevicesAlGaAs HERYellow Green Package HDSP-HDSP-HDSP-HDSP-DescriptionDrawingA1017511A801A9017.6 mm Common Anode Right Hand Decimal A A1037513A803A9037.6 mm Common Cathode Right Hand Decimal B A1077517A807A9077.6 mm Common Anode ±1. Overflow C A1087518A808A9087.6 mm Common Cathode ±1. Overflow D F10110 mm Common Anode Right Hand Decimal E F10310 mm Common Cathode Right Hand Decimal F F10710 mm Common Anode ±1. Overflow G F10810 mm Common Cathode ±1. OverflowH G10110 mm Two Digit Common Anode Right Hand Decimal X G10310 mm Two Digit Common Cathode Right Hand Decimal Y E100335010.9 mm Common Anode Left Hand Decimal I E101335110.9 mm Common Anode Right Hand Decimal J E103335310.9 mm Common Cathode Right Hand Decimal K E106335610.9 mm Universal ±1. Overflow [1]L H101555114.2 mm Common Anode Right Hand Decimal M H103555314.2 mm Common Cathode Right Hand Decimal N H107555714.2 mm Common Anode ±1. Overflow O H108555814.2 mm Common Cathode ±1. OverflowP K121K70114.2 mm Two Digit Common Anode Right Hand Decimal R K123K70314.2 mm Two Digit Common Cathode Right Hand Decimal S N10020 mm Common Anode Left Hand Decimal Q N10120 mm Common Anode Right Hand Decimal T N10320 mm Common Cathode Right Hand Decimal U N10520 mm Common Cathode Left Hand Decimal V N10620 mm Universal ±1. Overflow [1]WNote:1. Universal pinout brings the anode and cathode of each segment’s LED out to separate pins. See internal diagrams L or W.Package Dimensions (cont.)Package Dimensions (cont.)*The Side View of package indicates Country of Origin.Package Dimensions (cont.)Package Dimensions (cont.)元器件交易网7 Package Dimensions (cont.)Internal Circuit DiagramInternal Circuit Diagram (cont.)Absolute Maximum RatingsAlGaAs Red HERHDSP-A10X/E10X/HDSP-751X/Yellow GreenH10X/K12X/N10X/335X/555X/HDSP-A80X HDSP-A90X Description F10X, G10X Series K70X Series Series Series Units Average Power per Segment or DP375264mW Peak Forward Current per 45mA Segment or DPDC Forward Current per15[1]15[2]mA Segment or DPOperating Temperature Range-20 to +100-40 to +100°C Storage Temperature Range -55 to +100°C Reverse Voltage per Segment 3.0V or DPLead Solder Temperature for 3Seconds (1.60 mm [0.063 in.] below 260°C seating plane)Notes:1. Derate above 91°C at 0.53 mA/°C.2. Derate HER/Yellow above 80°C at 0.38 mA/°C and Green above 71°C at 0.31 mA/°C.元器件交易网10Electrical/Optical Characteristics at T A = 25°CAlGaAs RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions315600I F = 1 mA A10X3600I F = 5 mA330650I F = 1 mA F10X, G10X3900I F = 5 mA390650I F = 1 mA E10X Luminous Intensity/Segment[1,2]I Vµcd(Digit Average)3900I F = 5 mA400700I F = 1 mA H10X, K12X4200I F = 5 mA270590I F = 1 mA N10X3500I F = 5 mA1.6I F = 1 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA1.82.2I F = 20 mA PkAll Devices Peak WavelengthλPEAK645nmDominant Wavelength[3]λd637nmReverse Voltage/Segment or DP[4]V R 3.015V I R = 100 mATemperature Coefficient of∆V F/°C-2 mV mV/°CV F/Segment or DPA10X255F10X, G10X320E10X340Thermal Resistance LED RθJ-PIN°C/W/SegH10X, K12X Junction-to-Pin400N10X430High Efficiency RedDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions160270I F = 2 mA 751X1050I F = 5 mA200300I F = 2 mA Luminous Intensity/Segment[1,2]I V mcd(Digit Average)1200I F = 5 mA335X, 555X,K70X270370I F = 2 mA1480I F = 5 mA1.6I F = 2 mAForward Voltage/Segment or DP V F 1.7V I F = 5 mA2.1 2.5I F = 20 mA Pk All Devices Peak WavelengthλPEAK635nmDominant Wavelength[3]λd626nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DP751X200335X Thermal Resistance LED RθJ-PIN280°C/WJunction-to-Pin555X, K70X345YellowDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250420I F = 4 mA(Digit Average)I V mcd1300I F = 10 mA1.7I F = 4 mAForward Voltage/Segment or DP V F 1.8V I F = 5 mA A80X2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK583nmDominant Wavelength[3,5]λd581.5585592.5nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinGreenDeviceSeriesHDSP-Parameter Symbol Min.Typ.Max.Units Test Conditions Luminous Intensity/Segment[1,2]250475I F = 4 mA(Digit Average)I V mcd1500I F = 10 mA1.9I F = 4 mAForward Voltage/Segment or DP V F 2.0V I F = 10 mA A90X2.1 2.5I F = 20 mA PkPeak WavelengthλPEAK566nmDominant Wavelength[3,5]λd571577nmReverse Voltage/Segment or DP[4]V R 3.030V I R = 100 mATemperature Coefficient of∆V F/°C-2mV/°CV F/Segment or DPThermal Resistance LED RθJ-PIN200°C/WJunction-to-PinNotes:1. Device case temperature is 25°C prior to the intensity measurement.2. The digits are categorized for luminous intensity. The intensity category is designated by a letter on the side of the package.3. The dominant wavelength, λd, is derived from the CIE chromaticity diagram and is the single wavelength which defines the color of thedevice.4. Typical specification for reference only. Do not exceed absolute maximum ratings.5. The yellow (HDSP-A800) and Green (HDSP-A900) displays are categorized for dominant wavelength. The category is designated by anumber adjacent to the luminous intensity category letter.Data subject to change.Copyright © 1999 Agilent Technologies, Inc.5091-8365E (11/99)。

HDSP211x系列LED字符显示器的使用

HDSP211x系列LED字符显示器的使用
丁志军
【期刊名称】《无线电工程》
【年(卷),期】1998(028)005
【摘要】美国惠普公司生产的ＬＥＤ字符显示器是一种很有应用前途的显示器件。

本文就以ＨＤＳＰ２１１Ｘ为例，详细地说明其性能和使用方法，以期推动其在各个方面尤其是在军品方面的应用。

【总页数】4页(P53-56)
【作者】丁志军
【作者单位】无
【正文语种】中文
【中图分类】TN873.93
【相关文献】
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2.8×8点阵LED字符显示器的设计 [J], 何海滨
3.CPLD在LED点阵显示器中实现字符滚动的应用 [J], 王广军;邓记才;毕立恒
4.CPLD在LED点阵显示器中实现字符滚动的应用 [J], 王广军;邓记才;毕立恒
5.HDSP211X系列LED字符显示器的使用 [J], 丁志军
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