Electrical properties of a-antimony selenide

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电镀参数

电镀参数

第五章镀镍5.1镍的性质(1) 色泽:银白色,发黄 (2) 结晶构造:FCC (3) 比重:8.908(4) 原子量:58.69 (5) 原子序:28(6) 电子组态:1S^2 2S^2 2P^6 3S^2 3P^6 3d^8 4S^2 (7) 熔点:1457 C(8) 沸点:2730 C (9) 电阻:6.84 uohs-cm (10) 抗拉强度:317 Mpa(11) 电解镍有较高硬度(12) 大气中化学性安定不易变色,在600 C以上才被氧化(13) 液中不被溶解(14) 镍抗蚀性比铜强,铜制品宜镀上镍(15) 镍易溶于稀硝酸,但在浓硝酸形成钝态不易溶解(16) 镍在硫酸、盐酸中溶解比在稀硝酸溶解慢(17) 镍的标准电位-0.25伏特,比铁正,对钢铁是属于阴极性镀层只有完全覆盖镍才能保护防止生锈(18) 镍易于抛光可做为电镀中间层(19) 当镍缺乏时可用铜锡合金代替5.2镀镍工程镍镀层的性质及外观能被控制而且操作范围很广,所以广泛被应用于装饰性工程性电镀及电铸(1) 装镜面光泽的特性工程性镀镍用于防腐蚀、耐磨、焊接性、磁性及其它特兴其镀层为纯的镍镍电铸是用电镀的方法制造全镍质的零件及物品,如镍工具、模具、铸模、唱片压板(record stampers),无缝管、染印网(printing screens)电镀反应为Ni+2e-Ni,其中Ni是由水溶液中镍盐提供而由阳极镍来补充、阳极效率近100% ,大于阴极电流效率所以镀浴之 Ni 离子及 pH 会曾加,虽带出 (drag-out)可抵消Ni的增加,但有时仍不足须加水及其它成份调节镀浴成份,并加酸来保持pH值镀镍一般可分为全光泽镍、半光泽镍、双重镍、三重镍、工程镍、犁地镍、电镀镍及镀黑镍5.3装饰镍电镀其各种镀浴配方(见5.4),其主要成份为硫酸镍(nickel sulfate)、氯化镍(nickel chloride)及硼酸(boric acid)。

小度写范文五年级英语上册单词表_专业英语单词表模板

小度写范文五年级英语上册单词表_专业英语单词表模板

五年级英语上册单词表_专业英语单词表词汇表Chapter-1-wordsmaterial world 物质世界distinguish 区别,辨别chemical, mechanical, electrical properties 化学、力学、电学性质physical state 物理状态plasma 等离子体apparent 显然的,外观的distinct 截然不同的,独特的diversity 差异,多样性element 元素bond 结合联结in turn 依次,轮流arise from 起于basic particle 基本粒子electrons, protons, neutrons 电子、质子、中子internal forces and energy 内力和内能gravitational, electrostatic, electromagnetic, nuclear force 引(重)力、静电力、电磁力、核力ability to do work 做功的本领(能力)stored, released, transformed, transferred, “used”energ y 能量的存储、释放、转换、转移、使用entity 实体vice versa 反之亦然review 回顾,复习recall 回忆,回想,记起product (quotient,sum, difference) 乘积(商、和、差)muscles 肌肉object 物体potential (kinetic)energy 势(动) 能rest 静止其余Newton’slaw 牛顿定律law(theorem,definition) 定律(定义、定理)mass(m),acceleration(a),speed(v)质量、加速度、速度conservation of energy 能量守恒(conversation会话;谈话)hydroelectric plant 水电厂turbine 汽轮机,涡轮机electric generator 发电机blade 叶片joule(J)焦耳friction 摩檫electrical potential difference 电位势charged particles 带电粒子automobile (motorcar) 汽车a storage battery 蓄电池mechanical parts 机械部件thermodynamics 热力学specify 详述,载明inherent 固有的,天生的convert 转变,变换petroleum 石油fossil 化石,远古生物形成的nuclear reaction 核反应intimate 亲密的, 熟悉的, 私人的fission 裂变thermometer 温度计specific heat capacity 比热macroscopic 宏观的microscopic 微观的Celsius scale 摄氏温标Kelvin scale 开氏温标translational motion 平动Boltzmann’sconstant 玻尔兹曼常数(K)proportional to 正比于appreciate 估价,理解inversely proportional to 反比于prefix 前缀,词首(postfix后缀,词尾)astronomical 天文的,极大的submicroscopic 亚微观的oscillation 振荡,振动transmitter 无线电,电视讯号发送装置X-ray X 射线gamma ra y γ射线sophisticate 改进,采用先进技术,完善gasoline 汽油dissociate 分离latent energy 潜能fusion 熔解,聚变agitation 激发,搅拌theory 理论(experiment 实验)rigor 精确special relativity 狭义相对论rest mass 静止质量impart 给予,传授startling 令人吃惊的viz. 即consume 消耗,消费magnitude 大小,数量,量级dimensions 尺寸,尺度,维(数),度(数),元efficient 有效的,效率高的discrepancy 差异,矛盾vital至关重要的,所必需的long-term 长期survival 幸存,生存crisis 危机scarce缺乏的,稀有的inequitable 不公平的Chapter-2-wordsnature n 诞生(源自拉丁语nasci) descriptive adj 描述的,起描述作用的analogy n 类似,类推retain vt 留住;保住identity 完全相同;本身;恒等式carbon monoxide 一氧化碳oxide 氧化物(ironoxide 氧化铁)dioxide 二氧化物artificially adv. 人工(man-made)atomic number n 原子序数the periodic table of the elements 元素周期表atomic weight 原子量(gramatom 克原子)Avogadro’snumber 阿弗加德罗常数turn out v. 打扫,生产,制造,关掉time 乘perfect gas law 理想气体规律(方程)bombardment n 炮击;轰击Maxwell’sgas theory 麦克斯韦气体理论Maxwellian distribution 麦克斯韦分布kinetic theory of gas 气体动力学Deduce v. 推论;推想;演绎Pressure 压力,压强Volume n. 卷,册,体积,量,大量,音量Absolute temperature 绝对温度uniform一致的;同一的;一律的;均匀的Rutherford t n 卢瑟福(物理学家,化学家)crucial adj. 极重要的;有决定性的pave the way for 为…..铺平道路in the form of 以…形式存在Emission n. 散发,发射,喷射,遗精Absorption n 吸收;专注;兼并,合并incandescent adj 白热的,白炽的Bohr n 波尔novel n. 小说,adj. 新奇的,异常的sketched n. 草图,梗概,vi. v. 勾画equality n 同等;平等centripetal adj 向心的;向心力的centrifugal adj 离心的;离心力的spontaneously adv. 自然地,本能地integers n 整数(fraction 分数小数)quantum n. 量,额,[物]量子,量子论quantum numbers 量子数radius (radiusesradii) 半径(直径diameter ) positive adj. 肯定的,正的,阳的negative n. 负数,底片;adj. 否定的,负的Shell model 壳层模型discrete adj 离散的;分立的;不连续的continuous 连续的,持续的outermost or valence shell 外层或化合价层inner shell 内层(outershell 外层)Laser 激光;激光器;[雷射]缩自lightamplification by stimulated emission of radiation phases 阶段,状态,相,相位使同步stimulate vt. 刺激,激励in step adv. 步调一致(inphases) avalanche n, v 雪崩,纷至沓来other than adv. 不同于,除了,而不是axis n. 轴,轴线proceed vi. 进行,继续下去,发生coherent adj. 一致的,相干的crystalline 结晶的,水晶的,晶态,晶体gem n. 宝石,精华,被喜爱的人,美玉ruby n. 红宝石affinity n. 密切关系,姻亲关系,亲合力neon n. [化]氖helium n. 氦(化学元素,符号为He)semiconductor n 半导体(semicircle半圆)energetic adj. 精力充沛的,高能的phonograph n. 留声机,vi. 灌入留声机dye n. 染料,染色vt. 染v. 染noise-free 没有(无)噪声hologram 全息摄影,全息图submarine n 潜艇adj 海生的;海底的reside 住,居住,(与in连用)存在于thermonuclear adj 核热能的,热核的isotopes n. 同位素hydrogen 氢deuterium 氘,重氢tritium 氚mass number 质量数atomic number 原子序数ground state 基态(excitedstates 激发态)neutral 中性的,不带电的qualitative adj 性质的;定性的quantitive =quantitative 定量的sodium n 〈化〉钠(元素符号为:Na)uranium n〈化〉铀(元素符号为:U)dimension n. 尺寸,尺度,维(数),度(数)whereas conj. 然而,反之,尽管,但是dense adj. 密集的,浓厚的range n. 行列,范围,射程vt.排列Appendix n. 附录,附属品,[解]阑尾label 标签,商标,标志vt. 贴标签于atomic mass unit 原子质单位(原子量)thumb 拇指,经验方式,作搭车手势repulsion n. 推斥,排斥,严拒,厌恶,反驳Chapter-3-wordsradioactivity n 放射性,放射现象disintegration (decay)n. 分裂,衰变mineral n. 矿物,矿石,无机物fiber 纤维;纤维质man-made fiber 人造纤维tissue n 薄纸,棉纸,[生]组织,连篇product n. 产品,产物,乘积protactinium 镤(Pa)helium 氦(He)thorium 钍(Th)neutrinos n 中微子radium 镭(Ra) polonium, bismuth 钋(Po)、铋(Bi)“chain” of disintegrations 衰变“链”positron n 正电子,阳电子negatron(electron)n. 阴电子species n. 种类,(原)核素intact adj. 完整无缺的,尚未被人碰过的,half-life 半衰期becquerel (Bq)n. [核]贝可(勒尔)activity 活度curie (Ci)居里Chapter-4-wordsnuclear processes 核过程nuclear reaction 核反应induce vt. 劝诱,促使,导致,引起,感应emphasize vt. 强调,着重v. 强调transmutation n 变形,变质,嬗变,蜕变Rutherford n. 卢瑟福(物理学家,化学家)counterpart n. 副本,配对物,对称物readily adv. 乐意地,欣然,容易地alchemist n. 炼金术士cobalt n. [化]钴(符号为Co) capture n. 捕获,战利品vt. 俘获,捕获control rods 控制棒omit vt. 省略,疏忽,遗漏compound nucleus 复合核recall vt 记起;想起;召回;取回Coulomb n. [电]库仑(电量单位)imagine vt. 想象,设想,以为probe n. 探针,探测器vt. 探查,查明apparent adj. 显然的,外观上的collision. n. 碰撞,冲突clarify v. 澄清,阐明sweep v. 打扫,清扫,冲光,扫过,掠过perpendicular adj. 垂直的,n. 垂线abpeviated v. 缩写,缩短,简化consistent adj. 一致的,调和的resonance n. 共鸣,谐振,共振,共振子boron n. [化]硼logarithmic adj. 对数的exponential migrate vi. 移动,移往,移植immigrate vt. 使移居入境vi. 移来metal 金属metalloid 非金属Actinium(Ac)锕Aluminium(Al)铝Americium(Am)镅Antimony(Sb)锑Argon(Ar)氩Arsenic(As)砷Astatine(At)砹Barium(Ba)钡Berkelium(Bk)锫Beryllium(Be)铍Bismuth(Bi)铋Boron(B)硼flux [物]流量,通量random n. adj. adv. 随机,无规则,任意elastic scattering 弹性散射inelastic scattering 非弹性散射classical physics 经典物理predominant 占主导地位的dominant adj. 占优势的,支配的light elements 轻元素heavy elements 重元素instead adv. 代替,改为,抵作,更换exceedingly adv. 非常地,极度地barn n. 靶(恩)(核反应截面单位),农仓diminish v. (使)减少,(使)变小attenuation n. 变薄,稀薄化,变细,衰减incident n. 事件,事变penetrate vt. 穿透,渗透,看穿,洞察half-thickness 半衰减厚度(half-life半衰期)quantity n. 量,数量mean free path 平均自由程the mean life 平均寿命applicable adj. 可适用的,可应用的deflected v. (使)偏斜,(使)偏转slab n. 厚平板,厚片,混凝土路面,板层infinitesimal adj. 无穷小的n. 极微量cite vt. 引用, 引证, 提名表扬integral n. [数学]积分,完整,部分Bromine(Br)溴Cadmium(Cd)镉Caesium(Cs)铯Calcium(Ca)钙Californium(Cf)锎Carbon(C)碳Cerium(Ce)铈Chlorine(Cl)氯Chromium(Cr)铬Cobalt(Co)钴Copper(Cu)铜Curium(Cm)锔Dysprosium(Dy)镝Einsteinium(Es)锿Erbium(Er)铒Europium(Eu)铕Fermium(Fm)镄Fluorine(F)氟Francium(Fr)钫Gadolinium(Gd)钆Gallium(Ga)镓Germanium(Ge)锗Gold(Au)金Hafnium(Hf)铪Helium(He)氦Holmium(Ho)钬Hydrogen(H)氢Indium(In)铟Iodine(I)碘Iridium(Ir)铱Iron(Fe)铁Krypton(Kr)氪Lanthanum(La)镧Lawrencium(Lr)铹Lead(Pb)铅Lithium(Li)锂Lutetium(Lu)镥Magnesium(Mg)镁Manganese(Mn)锰Mendelevium(Md)钔Mercury(Hg)汞Molybdenum(Mo)钼Neodymium(Nd)钕Neon(Ne)氖Neptunium(Np)镎Nickel(Ni)镍Niobium(Nb)铌Nitrogen(N)氮Nobelium(No)锘Osmium(Os)锇Oxygen(O)氧Palladium(Pd)钯Phosphorus(P)磷Platinum(Pt)铂Plutonium(Pu)钚Polonium(Po)钋Chapter-5-wordsPotassium(K)钾Praseodymium(Pr)镨Promethium(Pm)钷Protactinium(Pa)镤Radium(Ra)镭Radon(Rn)氡Rhenium(Re)铼Rhodium(Rh)铑Rubidium(Rb)铷Ruthenium(Ru)钌Samarium(Sm)钐Scandium(Sc)钪Selenium(Se)硒Silicon(Si)硅Silver(Ag)银Sodium(Na)钠Strontium(Sr)锶Sulphur(S)锍Tantalum(Ta)钽Technetium(Tc)锝Tellurium(Te)碲Terbium(Tb)铽Thallium(Tl)铊Thorium(Th)钍Tin(Sn)锡Thulium(Tm)铥Titanium(Ti)钛Tungsten(W)钨Uranium(U)铀Vanadium(V)钒Xenon(Xe)氙Ytterbium(Yb)镱Yttrium(Y)钇Zinc(Zn)锌Zirconium(Zr)锆empace vt. 拥抱,包含,收买,信奉origin n. 起源,出身,血统,[数]原点accelerator n. 加速者,加速器cosmic rays n. 宇宙射线reactor n. 反应堆refer to 查阅,提到,谈到,涉及bulk n. 大小,体积,大批,大多数,散装biological adj. 生物学的distinguish v. 区别,辨别irradiate v. 照射content n. 内容,adj.满意的,vt. 使满足excitation n. 刺激,激励,[物]激发,励磁ionization n. 离子化,电离fluorescent adj. 荧光的,莹光的subsequent adj. 后来的,并发的displace vt. 移置,转移,取代,v. 转移resultant adj. 作为结果而发生的,合成的class n. 班级,阶级,种类,vt. 把...分类inner orbits 内层轨道transition n. 转变,转换,跃迁,过渡pemsstrahlung(德语)轫致辐射paking radiation 轫致辐射rule of thumb 单凭经验的方法heavy charged particle 重带电粒子slowing 慢化,减速fragments of fission 裂变碎片massive adj. 厚重的,大块的,结实的inertia n. 惯性,惯量hyperbolic adj. 双曲线的Photon-Electron Scattering 光电散射visualize vt. 形象,形象化,想象vi. 显现stationary 固定的,稳定的Compton effect 康普顿效应Compton scattering 康普顿散射derivation n. 引出,出处,词源deduce vt. 推论,演绎出successive adj. 继承的,连续的photoelectric effect 光电效应competition n. 竞争,竞赛dislodges v. 驱逐eliminate vt. 排除,消除v. 除去mechanism n. 机械装置,机制,机理ejection n. 喷出,排出物outer shell 外层inner shell 内层electron-positron pair production 电子对产生效应in accord with adv. 与...一致opposite adj. 相对的,相反的,n. 相反的事物reverse n. 相反, 反面, 相反的, 倒转的, vt. 颠倒annihilate vt. 消灭,歼灭electron-positron pair annihilate 正负电子对湮灭total n. 合计adj. 总的,v. 合计,总数达consequence n. 结果,推论,因果关系component n. 成分adj. 组成的,构成的carry over v. 继续,结转次页,延期至...attenuation n. 变薄,稀薄化,变细,衰减neutron reaction 中子反应in a position to adv. 能够cell n. 单元,细胞,蜂房,电池tissue n. 薄纱织品, 薄纸, 棉纸, [生]组织, 连篇primary adj. 主要的, 初级的, 原来的, 根源的secondary adj. 次要的,次级的,中级的hydrocarbon n. 烃,碳氢化合物regard A as B 把 A 视为 B radiation damage n. 辐射损伤recoil n. 后退,弹回,vi. 弹回,撤退,反冲take place v. 发生interest n. 兴趣,重要性,影响,利息tend vi. 趋向,往往是vt. 照管,护理exponential law 指数规律molecular adj. [化]分子的,由分子组significance n. 意义,重要性fission 裂变chain reaction n. 连锁反应,链式反应at present adv. 现在,目前mechanism n.机械装置,机构,机制byproduct n. 副产品consumption n. 消费,消费量,肺病radiative adj. 辐射的notably adv. 显著地,特别地plutonium n. [化]钚alternate adj. v. 交替,轮流,改变split v. 分裂,分离n. 裂开,裂口sequence n. 次序,顺序,序列事物illustrate vt. 举例说明,图解vi. 举例approach n. 接近,走进,方法,步骤,途径,vt.接近excess n. 过度,剩于,超额adj. 过度的,额外的distortion n. 扭曲,变形,曲解,失真dumbbell n. 哑铃蠢人,笨蛋oscillate v. 振荡analogous adj. 类似的,相似的,可比拟的dominance n. 优势,统治bear n. 熊v. 负担,忍受,带给,具有around adv. 周围,大约prep. 在...周围resultant adj. 作为结果而发生的,合成的recoverable adj. 可重获的takes p1ace 发生prompt adj. 敏捷的,迅速的,即时的prompt neutrons 瞬发中子give rise to v. 引起,使发生asterisk n. 星号signifies vt. 表示,意味vi. 有重要性ground state 基态on the ground that 基于,由于undergo vt. 经历,遭受,忍受terminology n. 术语学fissile adj. 易分裂的,易裂的,裂变的fissionable n. 可裂变物质adj. 可引起核分裂的peed v. 增殖(使)繁殖,教养n. 品种californium n. 锎explanation n. 解释,解说,说明,辩解trigger vt. 引发,引起,触发n. 板机emerge vi. 显现,浮现,暴露,形成sustaining adj. 支持的,持续的emerge from 自...出现so-called adj. 所谓的,号称的inherent adj. 固有的,内在的,与生俱来的controllability 可控性krypton n. [化]氪barium n. 钡ordinate n. [数]纵线,纵座标deficiency n. 缺乏,不足prominent adj. 卓越的,显著的,突出的emanations n. 散发,发出extract n. 榨出物vt. 拔出,榨取,摘录neodymium n. [化]钕Nd moderator n. 缓和剂succession n. 连续,继承,轮栽,连续性extraneous adj. 无关系的,外来的accounted for v. 说明,考虑,解决,得分ultimately adv. 最后,终于,根本,基本上fuse n. 保险丝,熔丝v. 熔合due n. 应得物adj. 应得的comments 注解,注释in effect adv. 有效terrestrial adj. 陆地hydrogen bomb 氢弹proceed vi. 进行,继续下去,发生utilize vt. 利用as yet adv. 至今promising adj. 有希望的,有前途的abpeviate v. 缩写,简化,简写成inexhaustible adj. 无穷无尽的deuteron n. 氘核designate vt. 指明,任命,指派likelihood 可能,可能性(possibility)deuterium [化]氘(氢的放射性同位素)tritium [化]氚(氢的放射性同位素)composite 合成的,复合的合成物feasible adj. 可行的,切实可行的ingredients n. 成分,因素other than adv. 不同于,除了go into v. 进入,加入,探究,变得heat up v. 加热plasma 血浆,乳浆等离子体(区)constraint n. 约束,强制,局促prematurely adv. 过早地,早熟地elevated 提高的,严肃的,欢欣的rarefied adj. 纯净的,稀薄的ignition n. 点火,点燃Chapter8-wordsaccelerator n. 加速者,加速器ever-increasing 连续增长的capacitor n. (=capacitator)电容器experience n. vt. 经验,体验,经历perpendicularly adv. 垂直地,直立地gyration n. 旋回,回转,旋转,[动]螺层helix n. 螺旋,螺旋状物,[解剖]耳轮in parallel 并联in series 串联rectifier n. 纠正者,校正者,整流器transformer n. [电]变压器,使变化的人insulate vt. 使绝缘,隔离rather than 胜于electrodes n. 电极gap 缺口,裂口,间隙,缝隙,差距,隔阂linear accelerator 直线加速器cyclotron n. 回旋加速器poles n. 柱,杆,极,磁极,电极electromagnet n. 电磁石hollow n. 洞,山谷adj. 空腹的,凹的dee n. D 字,D 字形马具polarity n. 极性impetus n. 推动力,促进synchronize v. 同步spiral adj. 螺旋形的n. 螺旋v. 盘旋outermost adj. 最外面的,最远的betatron n. 电子感应加速器doughnut n. 油炸圈饼n. 圆环图tangential adj. 切线的synchrotron n. 同步加速器circumference n. 圆周,周围superpose vt. 放在上面,重叠booster n 支持者,后援者,调压器spallation n. 分裂,蜕变relativistic adj. 相对论的。

HSF-技术标准

HSF-技术标准

物质:甲醛
对象禁止供货时期1 级各式使用于销售产品本体或其包装等用途,如扬声器、机架本体或栈板等木工产
品,或其他非木质材料制成的产品等。

立即禁止备注:栈板之甲醛限值不受本标准规范。

标准值(排放浓度):
胶合木质材料标准值(排放浓度):依木制品类型分二阶段管制排放浓度
说明:
第一阶段:Phase 1 (简称P1)
第二阶段:Phase 2 (简称P2)
HWPW-VC:Hardwood plywood-Veneer Core,单板芯之硬木胶合板
HWPW-CC:Hardwood plywood-Composite Core,复合芯之硬木胶合板
PB:ParticleBoard,粒片板
MDF:Medium density fiberboard,中密度纤维板
Thin MDF:最大厚度小于8mm 之MDF
(二) 其它非胶合木质材料排放浓度:
于12m3、1m3、或者0.0225m3 之气密试验腔体中试验,于空气中的浓度在0.1ppm (0.124mg/m3)
以下(依照EN 717-1)
量测方法:
(一) 胶合木质材料:
(1) 穿孔器测试法-EN 120 (PB, MDF, thin MDF)
(2) Chamber 测试法-ASTM E 1333-96(2002)
(3) 干燥器测试法-JIS A 1460
(二) 其它非胶合木质材料:密闭腔体测试法-EN 717-1
甲醛︰不得检出。

半导体制造技术

半导体制造技术

Semiconductor Manufacturing Technology半导体制造技术Instructor’s ManualMichael QuirkJulian SerdaCopyright Prentice HallTable of Contents目录OverviewI. Chapter1. Semiconductor industry overview2. Semiconductor materials3. Device technologies—IC families4. Silicon and wafer preparation5. Chemicals in the industry6. Contamination control7. Process metrology8. Process gas controls9. IC fabrication overview10. Oxidation11. Deposition12. Metallization13. Photoresist14. Exposure15. Develop16. Etch17. Ion implant18. Polish19. Test20. Assembly and packagingII. Answers to End-of-Chapter Review QuestionsIII. Test Bank (supplied on diskette)IV. Chapter illustrations, tables, bulleted lists and major topics (supplied on CD-ROM)Notes to Instructors:1)The chapter overview provides a concise summary of the main topics in each chapter.2)The correct answer for each test bank question is highlighted in bold. Test bankquestions are based on the end-of-chapter questions. If a student studies the end-of-chapter questions (which are linked to the italicized words in each chapter), then they will be successful on the test bank questions.2Chapter 1Introduction to the Semiconductor Industry Die:管芯 defective:有缺陷的Development of an Industry•The roots of the electronic industry are based on the vacuum tube and early use of silicon for signal transmission prior to World War II. The first electronic computer, the ENIAC, wasdeveloped at the University of Pennsylvania during World War II.•William Shockley, John Bardeen and Walter Brattain invented the solid-state transistor at Bell Telephone Laboratories on December 16, 1947. The semiconductor industry grew rapidly in the 1950s to commercialize the new transistor technology, with many early pioneers working inSilicon Valley in Northern California.Circuit Integration•The first integrated circuit, or IC, was independently co-invented by Jack Kilby at Texas Instruments and Robert Noyce at Fairchild Semiconductor in 1959. An IC integrates multiple electronic components on one substrate of silicon.•Circuit integration eras are: small scale integration (SSI) with 2 - 50 components, medium scale integration (MSI) with 50 – 5k components, large scale integration (LSI) with 5k to 100kcomponents, very large scale integration (VLSI) with 100k to 1M components, and ultra large scale integration (ULSI) with > 1M components.1IC Fabrication•Chips (or die) are fabricated on a thin slice of silicon, known as a wafer (or substrate). Wafers are fabricated in a facility known as a wafer fab, or simply fab.•The five stages of IC fabrication are:Wafer preparation: silicon is purified and prepared into wafers.Wafer fabrication: microchips are fabricated in a wafer fab by either a merchant chip supplier, captive chip producer, fabless company or foundry.Wafer test: Each individual die is probed and electrically tested to sort for good or bad chips.Assembly and packaging: Each individual die is assembled into its electronic package.Final test: Each packaged IC undergoes final electrical test.•Key semiconductor trends are:Increase in chip performance through reduced critical dimensions (CD), more components per chip (Moore’s law, which predicts the doubling of components every 18-24 months) andreduced power consumption.Increase in chip reliability during usage.Reduction in chip price, with an estimated price reduction of 100 million times for the 50 years prior to 1996.The Electronic Era•The 1950s saw the development of many different types of transistor technology, and lead to the development of the silicon age.•The 1960s were an era of process development to begin the integration of ICs, with many new chip-manufacturing companies.•The 1970s were the era of medium-scale integration and saw increased competition in the industry, the development of the microprocessor and the development of equipment technology. •The 1980s introduced automation into the wafer fab and improvements in manufacturing efficiency and product quality.•The 1990s were the ULSI integration era with the volume production of a wide range of ICs with sub-micron geometries.Career paths•There are a wide range of career paths in semiconductor manufacturing, including technician, engineer and management.2Chapter 2 Characteristics of Semiconductor MaterialsAtomic Structure•The atomic model has three types of particles: neutral neutrons(不带电的中子), positively charged protons(带正电的质子)in the nucleus and negatively charged electrons(带负电的核外电子) that orbit the nucleus. Outermost electrons are in the valence shell, and influence the chemical and physical properties of the atom. Ions form when an atom gains or loses one or more electrons.The Periodic Table•The periodic table lists all known elements. The group number of the periodic table represents the number of valence shell electrons of the element. We are primarily concerned with group numbers IA through VIIIA.•Ionic bonds are formed when valence shell electrons are transferred from the atoms of one element to another. Unstable atoms (e.g., group VIIIA atoms because they lack one electron) easily form ionic bonds.•Covalent bonds have atoms of different elements that share valence shell electrons.3Classifying Materials•There are three difference classes of materials:ConductorsInsulatorsSemiconductors•Conductor materials have low resistance to current flow, such as copper. Insulators have high resistance to current flow. Capacitance is the storage of electrical charge on two conductive plates separated by a dielectric material. The quality of the insulation material between the plates is the dielectric constant. Semiconductor materials can function as either a conductor or insulator.Silicon•Silicon is an elemental semiconductor material because of four valence shell electrons. It occurs in nature as silica and is refined and purified to make wafers.•Pure silicon is intrinsic silicon. The silicon atoms bond together in covalent bonds, which defines many of silicon’s properties. Silicon atoms bond together in set, repeatable patterns, referred to asa crystal.•Germanium was the first semiconductor material used to make chips, but it was soon replaced by silicon. The reasons for this change are:Abundance of siliconHigher melting temperature for wider processing rangeWide temperature range during semiconductor usageNatural growth of silicon dioxide•Silicon dioxide (SiO2) is a high quality, stable electrical insulator material that also serves as a good chemical barrier to protect silicon from external contaminants. The ability to grow stable, thin SiO2 is fundamental to the fabrication of Metal-Oxide-Semiconductor (MOS) devices. •Doping increases silicon conductivity by adding small amounts of other elements. Common dopant elements are from trivalent, p-type Group IIIA (boron) and pentavalent, n-type Group VA (phosphorus, arsenic and antimony).•It is the junction between the n-type and p-type doped regions (referred to as a pn junction) that permit silicon to function as a semiconductor.4Alternative Semiconductor Materials•The alternative semiconductor materials are primarily the compound semiconductors. They are formed from Group IIIA and Group VA (referred to as III-V compounds). An example is gallium arsenide (GaAs).•Some alternative semiconductors come from Group IIA and VIA, referred to as II-VI compounds. •GaAs is the most common III-V compound semiconductor material. GaAs ICs have greater electron mobility, and therefore are faster than ICs made with silicon. GaAs ICs also have higher radiation hardness than silicon, which is better for space and military applications. The primary disadvantage of GaAs is the lack of a natural oxide.5Chapter 3Device TechnologiesCircuit Types•There are two basic types of circuits: analog and digital. Analog circuits have electrical data that varies continuously over a range of voltage, current and power values. Digital circuits have operating signals that vary about two distinct voltage levels – a high and a low.Passive Component Structures•Passive components such as resistors and capacitors conduct electrical current regardless of how the component is connected. IC resistors are a passive component. They can have unwanted resistance known as parasitic resistance. IC capacitor structures can also have unintentional capacitanceActive Component Structures•Active components, such as diodes and transistors can be used to control the direction of current flow. PN junction diodes are formed when there is a region of n-type semiconductor adjacent to a region of p-type semiconductor. A difference in charge at the pn junction creates a depletion region that results in a barrier voltage that must be overcome before a diode can be operated. A bias voltage can be configured to have a reverse bias, with little or no conduction through the diode, or with a forward bias, which permits current flow.•The bipolar junction transistor (BJT) has three electrodes and two pn junctions. A BJT is configured as an npn or pnp transistor and biased for conduction mode. It is a current-amplifying device.6• A schottky diode is formed when metal is brought in contact with a lightly doped n-type semiconductor material. This diode is used in faster and more power efficient BJT circuits.•The field-effect transistor (FET), a voltage-amplifying device, is more compact and power efficient than BJT devices. A thin gate oxide located between the other two electrodes of the transistor insulates the gate on the MOSFET. There are two categories of MOSFETs, nMOS (n-channel) and pMOS (p-channel), each which is defined by its majority current carriers. There is a biasing scheme for operating each type of MOSFET in conduction mode.•For many years, nMOS transistors have been the choice of most IC manufacturers. CMOS, with both nMOS and pMOS transistors in the same IC, has been the most popular device technology since the early 1980s.•BiCMOS technology makes use of the best features of both CMOS and bipolar technology in the same IC device.•Another way to categorize FETs is in terms of enhancement mode and depletion mode. The major different is in the way the channels are doped: enhancement-mode channels are doped opposite in polarity to the source and drain regions, whereas depletion mode channels are doped the same as their respective source and drain regions.Latchup in CMOS Devices•Parasitic transistors can create a latchup condition(???????) in CMOS ICs that causes transistors to unintentionally(无心的) turn on. To control latchup, an epitaxial layer is grown on the wafer surface and an isolation barrier(隔离阻障)is placed between the transistors. An isolation layer can also be buried deep below the transistors.Integrated Circuit Productsz There are a wide range of semiconductor ICs found in electrical and electronic products. This includes the linear IC family, which operates primarily with anal3og circuit applications, and the digital IC family, which includes devices that operate with binary bits of data signals.7Chapter 4Silicon and Wafer Preparation8z Semiconductor-Grade Silicon•The highly refined silicon used for wafer fabrication is termed semiconductor-grade silicon (SGS), and sometimes referred to as electronic-grade silicon. The ultra-high purity of semiconductor-grade silicon is obtained from a multi-step process referred to as the Siemens process.Crystal Structure• A crystal is a solid material with an ordered, 3-dimensional pattern over a long range. This is different from an amorphous material that lacks a repetitive structure.•The unit cell is the most fundamental entity for the long-range order found in crystals. The silicon unit cell is a face-centered cubic diamond structure. Unit cells can be organized in a non-regular arrangement, known as a polycrystal. A monocrystal are neatly arranged unit cells.Crystal Orientation•The orientation of unit cells in a crystal is described by a set of numbers known as Miller indices.The most common crystal planes on a wafer are (100), (110), and (111). Wafers with a (100) crystal plane orientation are most common for MOS devices, whereas (111) is most common for bipolar devices.Monocrystal Silicon Growth•Silicon monocrystal ingots are grown with the Czochralski (CZ) method to achieve the correct crystal orientation and doping. A CZ crystal puller is used to grow the silicon ingots. Chunks of silicon are heated in a crucible in the furnace of the puller, while a perfect silicon crystal seed is used to start the new crystal structure.• A pull process serves to precisely replicate the seed structure. The main parameters during the ingot growth are pull rate and crystal rotation. More homogeneous crystals are achieved with a magnetic field around the silicon melt, known as magnetic CZ.•Dopant material is added to the melt to dope the silicon ingot to the desired electrical resistivity.Impurities are controlled during ingot growth. A float-zone crystal growth method is used toachieve high-purity silicon with lower oxygen content.•Large-diameter ingots are grown today, with a transition underway to produce 300-mm ingot diameters. There are cost benefits for larger diameter wafers, including more die produced on a single wafer.Crystal Defects in Silicon•Crystal defects are interruptions in the repetitive nature of the unit cell. Defect density is the number of defects per square centimeter of wafer surface.•Three general types of crystal defects are: 1) point defects, 2) dislocations, and 3) gross defects.Point defects are vacancies (or voids), interstitial (an atom located in a void) and Frenkel defects, where an atom leaves its lattice site and positions itself in a void. A form of dislocation is astacking fault, which is due to layer stacking errors. Oxygen-induced stacking faults are induced following thermal oxidation. Gross defects are related to the crystal structure (often occurring during crystal growth).Wafer Preparation•The cylindrical, single-crystal ingot undergoes a series of process steps to create wafers, including machining operations, chemical operations, surface polishing and quality checks.•The first wafer preparation steps are the shaping operations: end removal, diameter grinding, and wafer flat or notch. Once these are complete, the ingot undergoes wafer slicing, followed by wafer lapping to remove mechanical damage and an edge contour. Wafer etching is done to chemically remove damage and contamination, followed by polishing. The final steps are cleaning, wafer evaluation and packaging.Quality Measures•Wafer suppliers must produce wafers to stringent quality requirements, including: Physical dimensions: actual dimensions of the wafer (e.g., thickness, etc.).Flatness: linear thickness variation across the wafer.Microroughness: peaks and valleys found on the wafer surface.Oxygen content: excessive oxygen can affect mechanical and electrical properties.Crystal defects: must be minimized for optimum wafer quality.Particles: controlled to minimize yield loss during wafer fabrication.Bulk resistivity(电阻系数): uniform resistivity from doping during crystal growth is critical. Epitaxial Layer•An epitaxial layer (or epi layer) is grown on the wafer surface to achieve the same single crystal structure of the wafer with control over doping type of the epi layer. Epitaxy minimizes latch-up problems as device geometries continue to shrink.Chapter 5Chemicals in Semiconductor FabricationEquipment Service Chase Production BayChemical Supply Room Chemical Distribution Center Holding tank Chemical drumsProcess equipmentControl unit Pump Filter Raised and perforated floorElectronic control cablesSupply air ductDual-wall piping for leak confinement PumpFilterChemical control and leak detection Valve boxes for leak containment Exhaust air ductStates of Matter• Matter in the universe exists in 3 basic states (宇宙万物存在着三种基本形态): solid, liquid andgas. A fourth state is plasma.Properties of Materials• Material properties are the physical and chemical characteristics that describe its unique identity.• Different properties for chemicals in semiconductor manufacturing are: temperature, pressure andvacuum, condensation, vapor pressure, sublimation and deposition, density, surface tension, thermal expansion and stress.Temperature is a measure of how hot or cold a substance is relative to another substance. Pressure is the force exerted per unit area. Vacuum is the removal of gas molecules.Condensation is the process of changing a gas into a liquid. Vaporization is changing a liquidinto a gas.Vapor pressure is the pressure exerted by a vapor in a closed container at equilibrium.Sublimation is the process of changing a solid directly into a gas. Deposition is changing a gas into a solid.Density is the mass of a substance divided by its volume.Surface tension of a liquid is the energy required to increase the surface area of contact.Thermal expansion is the increase in an object’s dimension due to heating.Stress occurs when an object is exposed to a force.Process Chemicals•Semiconductor manufacturing requires extensive chemicals.• A chemical solution is a chemical mixture. The solvent is the component of the solution present in larger amount. The dissolved substances are the solutes.•Acids are solutions that contain hydrogen and dissociate in water to yield hydronium ions. A base is a substance that contains the OH chemical group and dissociates in water to yield the hydroxide ion, OH-.•The pH scale is used to assess the strength of a solution as an acid or base. The pH scale varies from 0 to 14, with 7 being the neutral point. Acids have pH below 7 and bases have pH values above 7.• A solvent is a substance capable of dissolving another substance to form a solution.• A bulk chemical distribution (BCD) system is often used to deliver liquid chemicals to the process tools. Some chemicals are not suitable for BCD and instead use point-of-use (POU) delivery, which means they are stored and used at the process station.•Gases are generally categorized as bulk gases or specialty gases. Bulk gases are the relatively simple gases to manufacture and are traditionally oxygen, nitrogen, hydrogen, helium and argon.The specialty gases, or process gases, are other important gases used in a wafer fab, and usually supplied in low volume.•Specialty gases are usually transported to the fab in metal cylinders.•The local gas distribution system requires a gas purge to flush out undesirable residual gas. Gas delivery systems have special piping and connections systems. A gas stick controls the incoming gas at the process tool.•Specialty gases may be classified as hydrides, fluorinated compounds or acid gases.Chapter 6Contamination Control in Wafer FabsIntroduction•Modern semiconductor manufacturing is performed in a cleanroom, isolated from the outside environment and contaminants.Types of contamination•Cleanroom contamination has five categories: particles, metallic impurities, organic contamination, native oxides and electrostatic discharge. Killer defects are those causes of failure where the chip fails during electrical test.Particles: objects that adhere to a wafer surface and cause yield loss. A particle is a killer defect if it is greater than one-half the minimum device feature size.Metallic impurities: the alkali metals found in common chemicals. Metallic ions are highly mobile and referred to as mobile ionic contaminants (MICs).Organic contamination: contains carbon, such as lubricants and bacteria.Native oxides: thin layer of oxide growth on the wafer surface due to exposure to air.Electrostatic discharge (ESD): uncontrolled transfer of static charge that can damage the microchip.Sources and Control of Contamination•The sources of contamination in a wafer fab are: air, humans, facility, water, process chemicals, process gases and production equipment.Air: class number designates the air quality inside a cleanroom by defining the particle size and density.Humans: a human is a particle generator. Humans wear a cleanroom garment and follow cleanroom protocol to minimize contamination.Facility: the layout is generally done as a ballroom (open space) or bay and chase design.Laminar airflow with air filtering is used to minimize particles. Electrostatic discharge iscontrolled by static-dissipative materials, grounding and air ionization.Ultrapure deiniozed (DI) water: Unacceptable contaminants are removed from DI water through filtration to maintain a resistivity of 18 megohm-cm. The zeta potential represents a charge on fine particles in water, which are trapped by a special filter. UV lamps are used for bacterial sterilization.Process chemicals: filtered to be free of contamination, either by particle filtration, microfiltration (membrane filter), ultrafiltration and reverse osmosis (or hyperfiltration).Process gases: filtered to achieve ultraclean gas.Production equipment: a significant source of particles in a fab.Workstation design: a common layout is bulkhead equipment, where the major equipment is located behind the production bay in the service chase. Wafer handling is done with robotic wafer handlers. A minienvironment is a localized environment where wafers are transferred on a pod and isolated from contamination.Wafer Wet Cleaning•The predominant wafer surface cleaning process is with wet chemistry. The industry standard wet-clean process is the RCA clean, consisting of standard clean 1 (SC-1) and standard clean 2 (SC-2).•SC-1 is a mixture of ammonium hydroxide, hydrogen peroxide and DI water and capable of removing particles and organic materials. For particles, removal is primarily through oxidation of the particle or electric repulsion.•SC-2 is a mixture of hydrochloric acid, hydrogen peroxide and DI water and used to remove metals from the wafer surface.•RCA clean has been modified with diluted cleaning chemistries. The piranha cleaning mixture combines sulfuric acid and hydrogen peroxide to remove organic and metallic impurities. Many cleaning steps include an HF last step to remove native oxide.•Megasonics(兆声清洗) is widely used for wet cleaning. It has ultrasonic energy with frequencies near 1 MHz. Spray cleaning will spray wet-cleaning chemicals onto the wafer. Scrubbing is an effective method for removing particles from the wafer surface.•Wafer rinse is done with overflow rinse, dump rinse and spray rinse. Wafer drying is done with spin dryer or IPA(异丙醇) vapor dry (isopropyl alcohol).•Some alternatives to RCA clean are dry cleaning, such as with plasma-based cleaning, ozone and cryogenic aerosol cleaning.Chapter 7Metrology and Defect InspectionIC Metrology•In a wafer fab, metrology refers to the techniques and procedures for determining physical and electrical properties of the wafer.•In-process data has traditionally been collected on monitor wafers. Measurement equipment is either stand-alone or integrated.•Yield is the percent of good parts produced out of the total group of parts started. It is an indicator of the health of the fabrication process.Quality Measures•Semiconductor quality measures define the requirements for specific aspects of wafer fabrication to ensure acceptable device performance.•Film thickness is generally divided into the measurement of opaque film or transparent film. Sheet resistance measured with a four-point probe is a common method of measuring opaque films (e.g., metal film). A contour map shows sheet resistance deviations across the wafer surface.•Ellipsometry is a nondestructive, noncontact measurement technique for transparent films. It works based on linearly polarized light that reflects off the sample and is elliptically polarized.•Reflectometry is used to measure a film thickness based on how light reflects off the top and bottom surface of the film layer. X-ray and photoacoustic technology are also used to measure film thickness.•Film stress is measured by analyzing changes in the radius of curvature of the wafer. Variations in the refractive index are used to highlight contamination in the film.•Dopant concentration is traditionally measured with a four-point probe. The latest technology is the thermal-wave system, which measures the lattice damage in the implanted wafer after ion implantation. Another method for measuring dopant concentration is spreading resistance probe. •Brightfield detection is the traditional light source for microscope equipment. An optical microscope uses light reflection to detect surface defects. Darkfield detection examines light scattered off defects on the wafer surface. Light scattering uses darkfield detection to detectsurface particles by illuminating the surface with laser light and then using optical imaging.•Critical dimensions (CDs) are measured to achieve precise control over feature size dimensions.The scanning electron microscope is often used to measure CDs.•Conformal step coverage is measured with a surface profiler that has a stylus tip.•Overlay registration measures the ability to accurately print photoresist patterns over a previously etched pattern.•Capacitance-voltage (C-V) test is used to verify acceptable charge conditions and cleanliness at the gate structure in a MOS device.Analytical Equipment•The secondary-ion mass spectrometry (SIMS) is a method of eroding a wafer surface with accelerated ions in a magnetic field to analyze the surface material composition.•The atomic force microscope (AFM) is a surface profiler that scans a small, counterbalanced tip probe over the wafer to create a 3-D surface map.•Auger electron spectroscopy (AES) measures composition on the wafer surface by measuring the energy of the auger electrons. It identifies elements to a depth of about 2 nm. Another instrument used to identify surface chemical species is X-ray photoelectron spectroscopy (XPS).•Transmission electron microscopy (TEM) uses a beam of electrons that is transmitted through a thin slice of the wafer. It is capable of quantifying very small features on a wafer, such as silicon crystal point defects.•Energy-dispersive spectrometer (EDX) is a widely used X-ray detection method for identifying elements. It is often used in conjunction with the SEM.• A focused ion beam (FIB) system is a destructive technique that focuses a beam of ions on the wafer to carve a thin cross section from any wafer area. This permits analysis of the wafermaterial.Chapter 8Gas Control in Process ChambersEtch process chambers••The process chamber is a controlled vacuum environment where intended chemical reactions take place under controlled conditions. Process chambers are often configured as a cluster tool. Vacuum•Vacuum ranges are low (rough) vacuum, medium vacuum, high vacuum and ultrahigh vacuum (UHV). When pressure is lowered in a vacuum, the mean free path(平均自由行程) increases, which is important for how gases flow through the system and for creating a plasma.Vacuum Pumps•Roughing pumps are used to achieve a low to medium vacuum and to exhaust a high vacuum pump. High vacuum pumps achieve a high to ultrahigh vacuum.•Roughing pumps are dry mechanical pumps or a blower pump (also referred to as a booster). Two common high vacuum pumps are a turbomolecular (turbo) pump and cryopump. The turbo pump is a reliable, clean pump that works on the principle of mechanical compression. The cryopump isa capture pump that removes gases from the process chamber by freezing them.。

半导体中英对照

半导体中英对照

倒序浏览|•Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.•受主- 一种用来在半导体中形成空穴的元素,比如硼、铟和镓。

受主原子必须比半导体元素少一价电子•Alignment Precision - Displacement of patterns that occurs during the photolithography process. . u! F. W' }! b# j4 q•套准精度- 在光刻工艺中转移图形的精度。

2 v I; S4 U, T* r' d9 H3 b! c•Anisotropic - A process of etching that has very little or no undercutting , i( N: Z7 u; {3 z •各向异性- 在蚀刻过程中,只做少量或不做侧向凹刻。

: `3 v& P1 s1 }3 z. `; ?•Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc. + {7 c* p' x H3 B0 m; r•沾污区域- 任何在晶圆片表面的外来粒子或物质。

2024届高考英语阅读理解高频词清单

2024届高考英语阅读理解高频词清单

高中阅读理解高频词1.excite 激发2.scholar 学术3.perspective 视角4.practical 实际的5.application 应用6.suitcase 行李箱7.cupboard 橱柜,衣柜8.hallway 门厅,走廊9.authentic 原作的,正宗的10.master v.精通,掌握n.大师,主人11.shame 羞愧,羞耻12.a couple of 几个13.cardboard 纸板箱14.explode 爆炸15.bomb 炸弹16.efficiency 效率17.contractor 承包商,利约人18.tax paying 纳税19.bake 烘焙20.bunny 兔子21.plant 植物,工厂,发电厂22.wage 工资23.belt 传送带24.attach 系,贴,覆25.pile up 堆积26.reserve 预留,保留,储存27.technical 技术上的28.excuse 借口,原谅29.remove 移开,拿开30.stay on 继续停留31.move on 继续前进32.witness 目击,见证33.deliver 接生,传递,履行,发表34.breathtaking 激动人心的35.out-of-this world 极美的,世外桃源的36.put...into place 把......放在合适的位置37.highlight 突出,强调38.best- rated 评价非常高的39.recreation 娱乐,消遣40.be desired to do 旨在做......,被设计去做......41.windsurfing 风帆冲浪,帆版运动42.demonstration 演示,展示43.essential 必不可少的,必需品44.skateboarder 滑板运动员45.mechanics 机械学,力学46.switch 改变,切换,开关,切换,假发47.knee 膝盖48.elbow 肘部49.pad 护具50.knot 结51.helmet 头盔52.campsite 营地53.inappropriate 不合适的54.issue v.发行,发布,颁发n.议题,问题,期刊号55.certificate 证书56.discount 打折57.camp-goers 露营爱好者58.autographical 自传体的59.correspondence 通信,信件60.relatively 相对的,相当的61.memoir 回忆录62.integrate 合并,成为一体63.context 语境,上下文64.political 政治的65.intellectual 智力的66.artistic 艺术的67.humanitarian 人道主义的68.revolution 革命69.attendance 出席,出勤70.recharge 恢复体力,恢复精力71.collective 集体的,共同体的72.at all point 完全的,彻底的,73.construct 建造,构建74.discharge 释放75.reach across 横跨76.preface 前言mand 命令78.insist on 坚持panion 陪伴80.document 文件,记录,记载81.press 出版社82.insight 洞察83.reputation 名誉84.entry v.进入,加入n.参赛作品,参赛人数,账目,记录85.rank 等级,排名,地位ndfill 垃圾填埋87.sustainability 持续性88.peel 皮89.foodstuff 食品90.concrete 混凝土91.cement 水泥92.emission 排放物93.recipe 食谱,秘诀,烹饪法94.durability 持久性ponent 成分96.ground 渣,地面97.coaster 杯托98.dish 盘子99.patent 专利,100.currently 目前101.novel adj.新颖的n.小说102.prospect 展望,预期,前景103.innovation 革新,新鲜的事物104.solid adj.坚固的n.固体105.delicate 虚弱的,脆弱的,精致的。

电镀参数

电镀参数

第五章镀镍5.1镍的性质(1) 色泽:银白色,发黄 (2) 结晶构造:FCC (3) 比重:8.908(4) 原子量:58.69 (5) 原子序:28(6) 电子组态:1S^2 2S^2 2P^6 3S^2 3P^6 3d^8 4S^2 (7) 熔点:1457 C(8) 沸点:2730 C (9) 电阻:6.84 uohs-cm (10) 抗拉强度:317 Mpa(11) 电解镍有较高硬度(12) 大气中化学性安定不易变色,在600 C以上才被氧化(13) 液中不被溶解(14) 镍抗蚀性比铜强,铜制品宜镀上镍(15) 镍易溶于稀硝酸,但在浓硝酸形成钝态不易溶解(16) 镍在硫酸、盐酸中溶解比在稀硝酸溶解慢(17) 镍的标准电位-0.25伏特,比铁正,对钢铁是属于阴极性镀层只有完全覆盖镍才能保护防止生锈(18) 镍易于抛光可做为电镀中间层(19) 当镍缺乏时可用铜锡合金代替5.2镀镍工程镍镀层的性质及外观能被控制而且操作范围很广,所以广泛被应用于装饰性工程性电镀及电铸(1) 装镜面光泽的特性工程性镀镍用于防腐蚀、耐磨、焊接性、磁性及其它特兴其镀层为纯的镍镍电铸是用电镀的方法制造全镍质的零件及物品,如镍工具、模具、铸模、唱片压板(record stampers),无缝管、染印网(printing screens)电镀反应为Ni+2e-Ni,其中Ni是由水溶液中镍盐提供而由阳极镍来补充、阳极效率近100% ,大于阴极电流效率所以镀浴之 Ni 离子及 pH 会曾加,虽带出 (drag-out)可抵消Ni的增加,但有时仍不足须加水及其它成份调节镀浴成份,并加酸来保持pH值镀镍一般可分为全光泽镍、半光泽镍、双重镍、三重镍、工程镍、犁地镍、电镀镍及镀黑镍5.3装饰镍电镀其各种镀浴配方(见5.4),其主要成份为硫酸镍(nickel sulfate)、氯化镍(nickel chloride)及硼酸(boric acid)。

NEMA电气设备封闭式容器类型定义-适用于非危险地区说明书

NEMA电气设备封闭式容器类型定义-适用于非危险地区说明书

E49—Enclosures for electrical equipmentNEMA Types – definitions pertaining tonon-hazardous locationsAn enclosure is a surrounding case constructed to provide protection from accidental contact with theenclosed equipment and to provide protection to the enclosed equipment from specifiedenvironmental conditions. A brief description of the more common types of enclosures used by theelectrical industry follows. For more information, see Table 110.28 of the National Electrical Code® andTable 65 from the Canadian Electrical Code.Type 1 enclosure:I ntended for indoor use, primarily to provide protection against contact with enclosed equipment and a degree of protection against falling dirt.Type 2 enclosure:I ntended for indoor use, primarily to provide a degree of protection against limited amounts of falling water and dirt.Type 3 enclosure:I ntended for outdoor use, primarily to provide a degree of protection against wind-blown dust, rain, sleet and external ice formation.Type 3R enclosure:Intended for outdoor use, primarily to provide a degree of protection against falling rain, sleet and external ice formation.Type 3S enclosure:I ntended for outdoor use, primarily to provide a degree of protection against wind-blown dust, rain and sleet, and to provide for operation of external mechanism when ice laden.Type 3X enclosure:I ntended for outdoor use, primarily to provide a degree of protection against wind-blown dust, rain, sleet, external ice formation and corrosion.Type 3SX enclosure:Intended for outdoor use, primarily to provide a degree of protection against wind-blown dust, rain, sleet and corrosion, and to provide for operation of external mechanism when ice laden.Type 4 enclosure:I ntended for indoor or outdoor use, primarily to provide a degree of protection against wind-blown dust and rain, splashing water and hose-directed water.Type 4X enclosure:Intended for indoor or outdoor use, primarily to provide a degree of protection against corrosion, wind-blown dust and rain, splashing water and hose-directed water.Type 6 enclosure:Intended for indoor or outdoor use, primarily to avoid a degree of protection against contact with enclosed equipment, falling dirt, hose-directed water, entry of water during occasional temporary submersion at a limited depth and external ice formation.Type 6P enclosure:Intended for indoor or outdoor use, primarily to provide a degree of protection against contact with enclosed equipment, falling dirt, hose-directed water, entry of water during prolonged submersion at a limited depth and external ice formation.Type 12 enclosure:Intended for indoor use, primarily to provide a degree of protection against dust, falling dirt and dripping non-corrosive liquids.Type 13 enclosure:Intended for indoor use, primarily to provide a degree of protection against dust, spraying of water, oil and non-corrosive coolant.NEC and National Electrical Code are registered trade-TECHNI C A L INFOR M ATI ONE50C A R LO N EN CLOSU R E S & J U N C TI O N B OX E S68 68Protection against solid bodiesDegree of protection for persons againstaccess to hazardous parts inside theenclosure and/or against the ingress ofsolid foreign objects.No protection—IEC 60529 IP Rating and NEMA 250 EnclosuresIP suitability ratings are a system for classifying the degree of protection providedby enclosures of electrical equipment.inside enclosures against damagefrom the ingress of water.No protectionProtected against vertically fallingdrops of waterProtected against direct sprays ofwater 15° from verticalProtected against sprays of water to60° from verticalProtected against water sprayedfrom all directions - limitedingress permittedProtected against low pressure jets ofwater from all directions - limitedingress permittedProtected against strong pressurejets of water, heavy seas - limitedingress permittedProtection against the effects ofimmersion between 15cm - 1 mProtection against long periods ofimmersion under a quoted pressure,e.g. 2 bar at 24 hoursIP69 Automotive standard DIN40050and signifies resistance to highpressure jets of water (up to 80bar)from any angleE51—NEMA 250 to IEC 60529—Conversion of NEMA enclosure type ratings to IEC 60529 enclosure Classification Designations (IP)(Cannot be used to convert Classification Designations to NEMA type ratings)IP3, 3X, 3R, 12, IPTECHNI C A L INFOR M ATI ONE52C A R LO N EN CLOSU R E S & J U N C TI O N B OX E SPropertyTest methodOpaquepolycarbonate covers & boxesClearpolycarbonatecover FRPNORYL Thermal and mechanical Temperature Range (°C)—-34° to 110°-30° to 230°-50° to 160°-40° to 80°Temperature Range (°F)—-30° to 230°-30° to 230°-58° to 320°-40° to 185°Specific Gravity (oz.in 3)ASTM D792 1.20 1.20 1.79.85Thermal Conductivity (BTU•in/hr•ft 2•°F)ASTM D177 1.35 1.35 1.68.86Heat Deflection Temperature @ 264 PSI (°F)ASTM D648265260392180Tensile Strength (PSI)ASTM D6388,8009,00013,0003,400Flexural Strength (PSI)ASTM D79013,50014,00019,0006,800Compressive Strength @ 10% Deformation (PSI)ASTM D69512,50012,50024,0005,200Impact Strength IZOD Notched (ft.lb/in.)ASTM D256121212—Water Absorption – 24 hrs. @ 73°F (%)ASTM D570.15.15.17.06UV Rating UL 746C F1F1F2—ElectricalDielectric Strength (volts/mil.)ASTM D149380380467192Dielectric Constant ASTM D15060 Hz 3.0 3.0— 100 Hz —— 2.27 106 Hz2.962.96—2.18Volume Resistivity @ 73°F (OHM-CM)ASTM D257>1016>1016 2.0 x 10151.0 x 1016Arc Resistance (sec)ASTM D495120120200+67Carflex fittings & PVCMale terminal adapters trade sizesNominal size (in.)Actual size (in.)Actual size (mm)1⁄2.875.87922.43⁄41.093 1.10728.21 1.344 1.35734.611⁄4 1.813 1.69943.211⁄2 1.938 1.94949.62 2.375 2.41361.521⁄2 2.875 2.91474.03 3.5 3.53989.831⁄24 4.044102.74 4.5 4.544115.455.6255.675143.7—Engineering properties of enclosures—Clearance holes for Carflex® fittings or PVC male terminal adapters —Technical informationE53—Environmental resistance table: E–Excellent, G–Good, L–Limited, U–UnsatisfactoryImportant : These environmental resistance ratings are based upon tests where the specimens wereplaced in complete submergence in the reagent listed. Ratings listed in this chart apply to a 48-hour exposure period. (The information in this chart is to be used ONLY as a guide in selecting equipment for appropriate chemical compatibility. Before permanent installation, test the equipment with the chemicals and under the specific conditions of your application.)—Technical informationChemical PVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICAcetaldehyde U L ——Acetamide U U ——Acetate Solvent U ——U Acetic Acid U G E E Acetic Acid 20%U E E E Acetic Acid 80%L G E E Acetic Acid, Glacial U G E E Acetic Anhydride U U E U Acetone U U U U Acetyl Bromide U ———Acetyl Chloride (dry)L U —U Acetylene E U ——Acrylonitrile G U ——Adipic Acid E ———Alcohols:Amyl E G —L Alcohols:Benzyl U ——U Alcohols:Butyl E E —E Alcohols:Diacetone G ——E Alcohols:Ethyl L G —E Alcohols:Hexyl E ——E Alcohols:Isobutyl E ——E Alcohols:Isopropyl E E —E Alcohols:Methyl E G —E Alcohols:Octyl ———E Alcohols:Propyl E ——E Aluminum Chloride E E E E Aluminum Chloride 20%E E —E Aluminum Fluoride E ——E Aluminum Hydroxide E G —E Aluminum NitrateG E ——Aluminum Potassium Sulfate 10%E E —E Aluminum Potassium Sulfate 100%E E —E Aluminum Sulfate E E E E Amines U U —U Ammonia 10%G U —E Ammonia Nitrate G ——E Ammonia, anhydrous E U —G Ammonia, liquid E U L —Ammonium Acetate E ———Ammonium Bifluoride E ——E Ammonium Carbonate E —L E Ammonium Caseinate ———E Ammonium Chloride E E E E ChemicalPVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICAmmonium Oxalate E E ——Ammonium PersulfateE ——E Ammonium Phosphate, Dibasic E E —E Ammonium Phosphate, Monobasic E ——E Ammonium Phosphate, Tribasic E ——E Ammonium Sulfate E E E E Ammonium Sulfite E —E E Amyl Acetate U U L U Amyl Alcohol E G L L Amyl Chloride U —U U AnilineL U U U Aniline Hydrochloride G U ——AntifreezeE ——E Antimony TrichlorideE E E E Aqua Regia (80% HCl, 20% HNO )L U —U Aromatic Hydrocarbons U ——U Arsenic Acid E E —E Arsenic Salts E ———AsphaltE U ——Barium Carbonate E E E E Barium Chloride E E E E Barium Cyanide U ———Barium Hydroxide E U U E Barium Nitrate E U —E Barium Sulfate G U E E Barium Sulfide E —E E BeerE E —E Beet Sugar Liquids E ——E Benzaldehyde U U U G BenzeneL U L U Benzene Sulfonic Acid E U E E Benzoic Acid E G —G Benzol —U —G Benzonitrile —E ——Benzyl Chloride ———U Bleaching Liquors E ———Borax (Sodium Borate)E ——E Boric Acid E —E E Bromine L L —E Butadiene L U —U ButaneL U —U Butanol (Butyl Alcohol)L G —E Butyl Amine U U —U TECHNI C A L INFOR M ATI ONE54C A R LO N EN CLOSU R E S & J U N C TI O N B OX E S—Environmental resistance table: E–Excellent, G–Good, L–Limited, U–UnsatisfactoryImportant : These environmental resistance ratings are based upon tests where the specimens wereplaced in complete submergence in the reagent listed. Ratings listed in this chart apply to a 48-hour exposure period. (The information in this chart is to be used ONLY as a guide in selecting equipment for appropriate chemical compatibility. Before permanent installation, test the equipment with the chemicals and under the specific conditions of your application.)—Technical informationChemical PVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICButylacetate U U U G Butylene E U ——Butyric Acid G U —U Calcium Bisulfate —U ——Calcium Bisulfide E ——E Calcium Bisulfite G U —E Calcium Carbonate E L E E Calcium Chlorate G —E —Calcium Chloride L —E E Calcium Hydroxide G U U E Calcium Hypochlorite G U L E Calcium Nitrate E E E E Calcium Oxide G ——E Calcium Sulfate G E E E Calgon ———E Cane JuiceE ———Carbolic Acid (Phenol)U U —U Carbon Bisulfide U —L —Carbon Dioxide (dry)E ——E Carbon Dioxide (wet)E ——E Carbon Disulfide U U —U Carbon Monoxide E ——E Carbon Tetrachloride U U E U Carbon Tetrachloride (dry)———U Carbon Tetrachloride (wet)———U Carbon Disulfide U U —U Carbon Monoxide E ——E Carbon Tetrachloride U U E U Carbon Tetrachloride (dry)———U Carbon Tetrachloride (wet)———U Carbonated Water E ——E Carbonic Acid E E —E Catsup E ——E Chloric Acid E ——U Chlorine (dry)U ——G Chlorine WaterE —E L Chlorine, Anhydrous Liquid U L —G Chloroacetic Acid G U ——Chlorobenzene (Mono)U U U U Chlorobromomethane U ———Chloroform U U —U Chlorosulfonic Acid U L —U Chocolate Syrup —E —E Chemical PVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICChromic Acid 5%E G —E Chromic Acid 50%U U —U Chromium Salts E ———Citric Acid G E E E Citric Oils ———E Clorox (Bleach)E ——E Copper Chloride E ——E Copper Cyanide E U —E Copper Fluoborate E ———Copper Nitrate E U —E Copper Sulfate >5%E E —E Copper Sulfate 5%E E —E Cresols U U U U Cresylic Acid U U ——Cupric Acid E E —E Cyclohexane U G —U Cyclohexanone U U —U Detergents E E —E Diacetone Alcohol U U ——Dichlorobenzene U U ——Dichloroethane U U —E Diesel Fuel E E —U Diethyl Ether U U ——Diethylamine U U ——Diethylene Glycol L G —E Dimethyl Aniline U U U U Dimethyl Formamide U U —U Diphenyl Oxide U ———DyesG ——E Epsom Salts (Magnesium Sulfate)E E —E Ethane E ———Ethanol L G —E Ethanolamine U ——E Ether U —L U Ethyl Acetate U U L E Ethyl Benzoate U U —E Ethyl Chloride U U L U Ethyl Ether U —U U Ethylene Bromide U U ——Ethylene Chloride U U —U Ethylene Chlorohydrin U U E —Ethylene Diamine U E —U Ethylene Dichloride U U U UE55—Environmental resistance table: E–Excellent, G–Good, L–Limited, U–UnsatisfactoryImportant : These environmental resistance ratings are based upon tests where the specimens wereplaced in complete submergence in the reagent listed. Ratings listed in this chart apply to a 48-hour exposure period. (The information in this chart is to be used ONLY as a guide in selecting equipment for appropriate chemical compatibility. Before permanent installation, test the equipment with the chemicals and under the specific conditions of your application.)—Technical informationChemical PVC HimelineHE Opaque Cover w/BasePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICFatty Acids E G —E Ferric Chloride E E E E Ferric Nitrate E E E E Ferric Sulfate E E E E Ferrous Chloride E U E E Ferrous Sulfate E E E E Fluoboric Acid E ——E Fluorine U L ——Fluosilicic Acid U E —E Formaldehyde 100%E E —E Formaldehyde 40%E E E E Formic Acid E E L E Freon 113G G —U Freon 12E ——U Freon 22E ——G Freon TF G ———Freon 11E ——G Fuel Oils E G —G Furan Resin E ———Furfural U U L U Gallic AcidG ——E Gasoline (high-aromatic)E E —G Gasoline, leaded, ref.G E E G Gasoline, unleaded L E —U Gelatin G ——E Glucose E E E E Glue, P.V.A.L ———Glycerin E E E E Glycolic Acid G ———Grease E ———Heptane L G E G HexaneG U U G Hydraulic Oil (Petro)E ———Hydraulic Oil (Synthetic)E ———Hydrazine—U ——Hydrobromic Acid 100%E ——G Hydrobromic Acid 20%G ——G Hydrochloric Acid 100%U U —E Hydrochloric Acid 20%E G E E Hydrochloric Acid 37%G U L E Hydrochloric Acid, Dry Gas E ——E Hydrocyanic AcidG ——E Hydrocyanic Acid (Gas 10%)E G —L ChemicalPVC HimelineHE Opaque Cover w/BasePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICHydrofluoric Acid 50%G U —U Hydrofluoric Acid 75%L U —U Hydrofluosilicic Acid 100%G ——G Hydrofluosilicic Acid 20%E ——G Hydrogen GasE E —E Hydrogen Peroxide 10%E E —E Hydrogen Peroxide 100%E E —E Hydrogen Peroxide 30%E E E E Hydrogen Peroxide 50%E E E —Hydrogen Sulfide (aqua)G E —E Hydrogen Sulfide (dry)E ———HydroquinoneG ———Hydroxyacetic Acid 70%U ———Ink L ———IodineE ——L Iodine (in alcohol)E ———Iodoform E ———Isooctane E G —U Isopropyl Acetate U U ——Isopropyl Ether G U ——IsotaneE ———Jet Fuel (JP3, JP4, JP5)L E —U Kerosene E U —U KetonesU U —U Lacquer Thinners U G —U Lacquers U U —U Lactic Acid G G E E LardE E —E Lead Acetate G ——E Lead Nitrate E ——E Lead Sulfamate G E ——Lime G ———Linoleic Acid E ———Lithium Chloride U G ——Lithium Hydroxide —U ——LubricantsG E —L Lye: Ca(OH) Calcium Hydroxide G U —E Lye: KOH Potassium Hydroxide G U —E Lye: NaOH Sodium Hydroxide E U —E Epsom Salts (Magnesium Sulfate)E E —E Magnesium Bisulfate E E ——Magnesium Carbonate G E E E Magnesium Chloride G E E E TECHNI C A L INFOR M ATI ONE56C A R LO N EN CLOSU R E S & J U N C TI O N B OX E S—Environmental resistance table: E–Excellent, G–Good, L–Limited, U–UnsatisfactoryImportant : These environmental resistance ratings are based upon tests where the specimens wereplaced in complete submergence in the reagent listed. Ratings listed in this chart apply to a 48-hour exposure period. (The information in this chart is to be used ONLY as a guide in selecting equipment for appropriate chemical compatibility. Before permanent installation, test the equipment with the chemicals and under the specific conditions of your application.)—Technical InformationChemicalPVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICMagnesium Oxide————Magnesium Sulfate (Epsom Salts)E E E E Maleic Acid E ——E Malic AcidE ———Manganese Sulfate L E —E Mayonnaise U ———MelamineU ———Mercuric Chloride (dilute)E E —E Mercuric Cyanide E ———Mercurous Nitrate E E —E Mercury E U —E MethaneG ———Methanol (Methyl Alcohol)E G L E Methyl Acetate U U ——Methyl Acetone U ———Methyl Alcohol 10%E G —E Methyl Bromide U ———Methyl Butyl Ketone E U ——Methyl Cellosolve U U ——Methyl Chloride U U —U Methyl Dichloride E ———Methyl Ethyl Ketone U U E U Methyl Isobutyl Ketone U U —U Methyl Isopropyl Ketone U U —U Methyl Methacrylate E ———Methylamine U ———Methylene Chloride U U U U Mineral SpiritsE L —E Monochloroacetic acid —U ——Monoethanolamine U ——E Morpholine —U —U Motor oil G E —E Naphtha E G E U Naphthalene U ——U Natural Gas E ———Nickel Chloride E E —E Nickel Nitrate E U —E Nickel SulfateE E —E Nitrating Acid (<15% HNO )U ———Nitrating Acid (>15% H SO )U ———Nitrating Acid (_1% Acid)U ———Nitrating Acid (_15% H SO )U ———Nitric Acid (20%)E G G G ChemicalPVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICNitric Acid (5–10%)E E —E Nitric Acid (Concentrated)G L —G Nitrobenzene U U L U Nitromethane G U —U Nitrous Acid E ———Nitrous Oxide E ———Oil: Aniline U ——U Oil: Citric G E —E Oil: CreosoteL ——U Oil: Diesel Fuel (20, 30, 40, 50)G ——U Oils: Fuel (1, 2, 3, 5A, 5B, 6)E G —E Oil: Hydraulic Oil (Petro)E ———Oil: Hydraulic Oil (Synthetic)E ———Oil: Mineral G G —E Oil: Olive L E —E Oil: Orange L L ——Oil: Pine U E ——Oil: Rosin L ———Oil: Silicone E ——E Oil: Transformer G ———Oil: Turbine E ———Oleic Acid L —E E Oleum 100%U ——E Oleum 25%U ———Oxalic Acid (cold)G —E E Ozone G E ——Palmitic Acid G ———Paraffin G E —E Pentane E E ——Perchloric Acid L ———Perchloroethylene L U —U Petrolatum G ———Petroleum ———U Phenol (10%)L G L U Phenol (Carbolic Acid)U U —U Phosphoric Acid (>40%)G E —E Phosphoric Acid (crude)G E —E Phosphoric Acid (molten)U ———Phosphoric Acid (_40%)G E —E Phosphoric Acid Anhydride —U ——PhosphorusE ———Phosphorus Trichloride U L ——Photographic Developer E E —EE57—Environmental resistance table: E–Excellent, G–Good, L–Limited, U–UnsatisfactoryImportant : These environmental resistance ratings are based upon tests where the specimens wereplaced in complete submergence in the reagent listed. Ratings listed in this chart apply to a 48-hour exposure period. (The information in this chart is to be used ONLY as a guide in selecting equipment for appropriate chemical compatibility. Before permanent installation, test the equipment with the chemicals and under the specific conditions of your application.)—Technical InformationChemical PVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICPicric AcidU U ——Potash (Potassium Carbonate)E —L E Potassium Bicarbonate E ——E Potassium Bromide E E —E Potassium Chlorate E E —E Potassium Chloride E E E E Potassium Chromate E —E E Potassium Cyanide Solutions E ——E Potassium Dichromate E E —E Potassium Ferricyanide E —E E Potassium FerrocyanideE —E E Potassium Hydroxide (Caustic Potash)E U L E Potassium Hypochlorite G ———Potassium Iodide E ———Potassium Nitrate E E E E Potassium Oxalate ————Potassium Permanganate E E E E Potassium Sulfate E E E E Potassium Sulfide E ——E Propane (liquefied)E L —E Propylene G ———Propylene Glycol L G ——Pyridine U U —G Pyrogallic Acid E ———Resorcinal L G ——Rosins L ———Salicylic AcidG E ——Salt Brine (NaCl saturated)E E —E Sea Water E E —E Silicone E E —E Silver Bromide ———E Silver Nitrate E E —E Soap SolutionsE E —E Soda Ash (see Sodium Carbonate)E E —E Sodium Acetate G E E E Sodium Aluminate ———E Sodium Benzoate G E ——Sodium Bicarbonate E E E E Sodium Bisulfate E E —E Sodium Bisulfite E E —E Sodium Borate (Borax)E E —E Sodium Bromide G —E E Sodium Carbonate E E —E ChemicalPVC HimelineHE opaque cover w/basePolycarbonateCircuit safe NEMA JIC Himeline HE clear cover w/ base HimelineHS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit safe mediumJICSodium Chromate —E —E Sodium Cyanide E ——E Sodium Ferrocyanide E —E E Sodium Fluoride E ——E Sodium Hydrosulfite L ———Sodium Hydroxide (20%)E E U E Sodium Hydroxide (50%)E U U E Sodium Hydroxide (80%)E U U E Sodium Hypochlorite (<20%)E L L E Sodium Hypochlorite (100%)G ——E Sodium Metaphosphate E ———Sodium Metasilicate E ———Sodium Nitrate E —U E Sodium Perborate E ——E Sodium Peroxide G E ——Sodium Polyphosphate E ——E Sodium Silicate E ——E Sodium Sulfate E E E E Sodium Sulfide E U U E Sodium Sulfite E —E E Sodium Tetraborate E ——E Sodium Thiosulfate (hypo)E U —E Stannic Chloride E E —E Stannic Fluoborate ———E Stannous Chloride E ——E Stearic Acid G E —E Stoddard Solvent L E —U StyreneU U —E Sulfate (Liquors)G ———Sulfur Chloride L ——E Sulfur Dioxide E ——E Sulfur Dioxide (dry)E E —E Sulfur Hexafluoride G ———Sulfur Trioxide E ——U Sulfur Trioxide (dry)E ——U Sulfuric Acid (<10%)E E E E Sulfuric Acid (10–75%)E G U E Sulfuric Acid (75–100%)U U —E Sulfuric Acid (cold concentrated)U ——E Sulfuric Acid (hot concentrated)U U —U Sulfurous Acid E ——E Tallow ———E Tannic Acid E L —EE58C A R LO N EN CLOSU R E S & J U N C TI O N B OX E S—Environmental Resistance Table: E–Excellent, G–Good, L–Limited, U–UnsatisfactoryImportant : These environmental resistance ratings are based upon tests where the specimens wereplaced in complete submergence in the reagent listed. Ratings listed in this chart apply to a 48-hour exposure period. (The information in this chart is to be used ONLY as a guide in selecting equipment for appropriate chemical compatibility. Before permanent installation, test the equipment with the chemicals and under the specific conditions of your application.)—Technical informationChemicalPVC HimelineHE opaquecover w/basePolycarbonateCircuit SafeNEMA JICHimeline HEclear cover w/base HimelineHS opaquew/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLP Noryl Circuit Safe medium JICTetrachloroethane L ——U Tetrachloroethylene U U —U Tetrahydrofuran U U L U Tin Salts E ———Toluene (Toluol)U U —U Trichloroacetic Acid G U ——Trichloroethane L U —U Trichloroethylene U —U U Trichloropropane ———U Tricresylphosphate U ——E Triethylamine G ——G Trisodium Phosphate E ——E Turpentine U U E U Urea U U L E Uric Acid E ———VarnishU——UChemical PVC HimelineHE opaque cover w/basePolycarbonateCircuit Safe NEMA JIC Himeline HE clear cover w/base Himeline HS opaque w/clear lidsFRP(Fiberglass reinforced polyester) Himeline HS – bases HimelineHP Himeline HLA/HLS Himeline HLPNoryl Circuit Safe mediumJICVinegar G E E E Vinyl Acetate U ———Vinyl Chloride U ———Water, Acid, Mine G G ——Water, Deionized E ——E Water, Distilled E E —E Water, Fresh G E —E Water, Salt G E —E Whiskey & Wines E E —E White Liquor (Pulp Mill)E ——E White Water (Paper Mill)E ——U Xylene U U E G Zinc Chloride G E E E Zinc Hydrosulfite ———E Zinc SulfateEEEE。

掺杂三氧化二锑的钛酸铋钠钾陶瓷的显微结构和电学性能

掺杂三氧化二锑的钛酸铋钠钾陶瓷的显微结构和电学性能

万帅等:水基流延片式ZnO压敏电阻器低温共烧工艺及其性能・ 529 ・第40卷第4期掺杂三氧化二锑的钛酸铋钠钾陶瓷的显微结构和电学性能樊慧庆,邹敏江(凝固技术国家重点实验室,西北工业大学材料学院,西安 710072)摘要:采用固相合成工艺制备了(1–x)[0.82Bi0.5Na0.5TiO3–0.18Bi0.5K0.5TiO3]–x Sb2O3 (BNKT–x Sb)压电陶瓷,研究了Sb2O3掺杂对BNKT陶瓷的显微结构和电学性能的影响规律。

研究表明:Sb2O3掺杂量x小于0.020时,不改变基体的钙钛矿结构,且Sb具有可变化合价,能形成“施主”和“受主”2种掺杂而起到“软化”或“硬化”的作用。

当Sb2O3掺杂量x≤0.005时,其压电系数d33随Sb2O3掺杂量的增加而增大,此时Sb2O3表现出了“软化”的特征;当Sb2O3掺杂量x>0.005时,d33降低,从而又表现出了“硬化”的特性;当Sb2O3掺杂≥0.010时,诱使陶瓷室温下反铁电微畴的形成,导致铁电性和压电性的骤减。

关键词:压电陶瓷;三氧化二锑;钛酸铋钠;掺杂改性;显微结构;电学性能中图分类号:TB34 文献标志码:A 文章编号:0454–5648(2012)04–0529–05网络出版时间:DOI:网络出版地址:Microstructure and Electrical Properties of Antimony Trioxide Doped PotassiumSodium Bismuth Titanate CeramicsF AN Huiqing,ZOU Minjiang(State Key Laboratory of Solidification Processing, School of Materials Science and Engineering, NorthwesternPolytechnical University, Xi'an 710072, China)Abstract: (1–x)[0.82Bi0.5Na0.5TiO3–0.18Bi0.5K0.5TiO3]–x Sb2O3 (BNKT–x Sb) ceramics were prepared by a conventional solid-state solution technique. The influence of Sb2O3 additive on the microstructure and electrical properties of the BNKT–x Sb ceramics was investigated. The BNKT–x Sb ceramics appeared a pure perovskite structure in the whole range of Sb2O3 (x<0.020). Sb2O3 might act as a “donor” or an “acceptor” in this piezoelectric ceramics due to its variable valences, which could change the electrical properties to “soft” or “hard”. When x≤0.005, the piezoelectric coefficient (d33) of BNKT–x Sb increased with the increase of Sb2O3 content, which is a characteristic of the “soft” doping. On the contrary, a “hard” property was induced when x>0.005 at which d33 decreased again. The ferroelectric and piezoelectric properties of BNKT–x Sb ceramics changed when x≥0.010, which could be correlated to the formation of anti-ferroelectric micro-domains at room temperature.Key words: piezoelectric ceramics; antimony trioxide; bismuth sodium titanate; doping effect; microstructure; electrical property入微量添加物的方法来改进其性能。

半导体英文词汇

半导体英文词汇

Acceptor - An element, such as boron, indium, and gallium used to create a free hole in a semiconductor. The acceptor atoms are required to have one less valence electron than the semiconductor.受主- 一种用来在半导体中形成空穴的元素,比如硼、铟和镓。

受主原子必须比半导体元素少一价电子Alignment Precision - Displacement of patterns that occurs during the photolithography process.套准精度- 在光刻工艺中转移图形的精度。

Anisotropic - A process of etching that has very little or no undercut ti ng各向异性- 在蚀刻过程中,只做少量或不做侧向凹刻。

Area Contamination - Any foreign particles or material that are found on the surface of a wafer. This is viewed as discolored or smudged, and it is the result of stains, fingerprints, water spots, etc.沾污区域- 任何在晶圆片表面的外来粒子或物质。

由沾污、手印和水滴产生的污染。

Azimuth, in Ellipsometry - The angle measured between the plane of incidence and the major axis of the ellipse.椭圆方位角- 测量入射面和主晶轴之间的角度。

航海英语改革版海上搜索

航海英语改革版海上搜索

Ê®Æß º£ÉÏËѾÈ14.1 º£ÉÏËÑË÷[4601]______ the survivors known more of how to cope with cold water in the sinking of MV Titanic in 1912 countless lives ______.A. Have£¯could have been savedB. Have£¯could have savedC. Had£¯could has savedD. Had£¯could have been savedKEY: D[4602]A marker pole£¬with a horseshoe buoy and a sea anchor attached£¬should be used to ______.A. mark the position of a lost mooringB. determine your vessel's sideslip underwayC. determine your speed through the waterD. indicate location of a man overboardKEY: D[4603]A rescuer can most easily determine whether or not an adult victim has a pulse by checking the pulse at the ______.A. carotid artery in the neckB. femoral artery in the groinC. brachial artery in the armD. radial artery in the wristKEY: A[4604]A seaman has a small£¬gaping laceration of the arm that is not bleeding excessively. What can be done as an alternative to suturing to close the wound?A. Wrap a tight bandage around the wound.B. Apply a compression bandage.C. Use temporary stitches of sail twine.D. Apply butterfly strips£¬then a sterile dressing.KEY: D[4605]A seaman is reported missing in the morning and was last seen after coming off the mid-watch. Which type of turn would you use to return to the trackline steamed during the night?A. WilliamsonB. RacetrackC. 180turnD. AndersonKEY: A[4606]A ship must have on board a first-aid kit that is approved by the ______.A. Minerals Management ServiceB. Occupational Safety and Health AdministrationC. Mine Safety and Health AdministrationD. American Bureau of ShippingKEY: C[4607]A shipmate chokes suddenly£¬cannot speak£¬and starts to turn blue. You should ______.A. perform the Heimlich maneuverB. make the victim lie down with the feet elevated to get blood to the brainC. immediately administer CPRD. do nothing until the victim becomes unconsciousKEY: A[4608]A shipmate suffers a heart attack and stops breathing. You must ______.A. administer oxygenB. immediately check his pulse and start CPRC. make the victim comfortable in a bunkD. immediately give a stimulant£¬by force if necesssaryKEY: B[4609]A snag or other underwater obstruction may form a ______.A. V-shaped ripple with the point of the V pointing upstreamB. V-shaped ripple with the point of the V pointing downstreamC. small patch of smooth water on a windy dayD. smoothing out of the vessel's wakeKEY: A[4610]A survival craft being used to pick up a person who has fallen overboard from a vessel should approach the person ______.A. at a high rate of speedB. under oarsC. against the windD. with the windKEY: C[4611]A tourniquet should be used to control bleeding ONLY ______.A. with puncture woundsB. when all other means have failedC. when the victim is unconsciousD. to prevent bleeding from minor woundsKEY: B[4612]A tug is approaching a broken down steamer in moderately heavy weather preparing to take it in tow. In most cases the ______.A. steamer will drift stern downwindB. tug will drift faster than the steamerC. tug should approach stern toD. tug should approach from downwindKEY: D[4613]After you activate your emergency position indicating radiobeacon£¬you should ______.A. turn it off for five minutes every half-hourB. turn it off and on at five-minute intervalsC. turn it off during daylight hoursD. leave it on continuouslyKEY: D[4614]All casualties such as personnel injuries or illness£¬oil spills£¬accidental fire£¬collision£¬stranding£¬and unusually severe weather damage£¬whether at sea£¬in port£¬or in shipyard£¬must be promptly ______to the company.A. spokenB. saidC. toldD. communicatedKEY: D[4615]AN APPOINTMENT BETWEEN VESSELS NORMALLY MADE ON RADIO TO MEET IN A CERTAIN AREA OR POSITION defines ______.A. Bona fideB. Rendez-vousC. Prima facieD. Action in personamKEY: B[4616]An emergency sea anchor may be constructed by using ______.A. a boat bucketB. an air tank filled with waterC. an oar and canvas weighted downD. All of the aboveKEY: D[4617]An immersion suit must be equipped with a(n) ______.A. air bottle for breathingB. whistle and lightC. whistle£¬light£¬and reflective tapeD. whistle£¬light£¬and sea dye markerKEY: C[4618]If you see anybody fall overboard£¬act as follows except __________.A. tell an officer/crew the person's position in the water£¬or telephone the bridge immediatelyB. throw lifebuoys overboardC. call out "Man overboard" and keep your eyes on the person in the waterD. try to find medicine for the person to use when he is rescuedKEY: D[4619]If£¬for any reason£¬it is necessary to abandon ship while far out at sea£¬it is important that the crew members should ______.A. separate from each other as this will increase the chances of being rescuedB. get away from the area because sharks will be attracted to the vesselC. immediately head for the nearest landD. remain together in the area because rescuers will start searching at the vessel's last known positionKEY: D[4620]Immediately after abandoning a vessel£¬lookouts should be posted aboard liferafts to look for ______.A. survivors in the waterB. food and waterC. landD. bad weatherKEY: A[4621]In a racetrack turn£¬to recover a man overboard£¬the vessel is steadied for the SECOND time after a turn of how many degrees from the original heading?A. 60B. 135C. 180D. 360KEY: D[4622]In relation to the turning circle of a ship£¬the term advance means the distance ______.A. gained at right angles to the original courseB. gained in the direction of the original courseC. moved sidewise from the original course when the rudder is first put overD. around the circumference of the turning circleKEY: A[4623]Information on search and rescue procedures will be found in the ______.A. World Port IndexB. International Code of SignalsC. Sailing DirectionsD. Merchant Ship Search and Rescue Manual (MERSAR)KEY: D[4624]MOVING OF AN ANCHOR OVER THE SEA BOTTOM INVOLUNTARILY BECAUSE IT IS NO LONGER PREVENTING THE MOVEMENT OF THE VESSEL defines ______.A. Dredging (of anchor)B. Dragging (of anchor)C. Weighing anchorD. Walking out anchorKEY: B[4625]One of your crew members falls overboard from the starboard side. You should IMMEDIATELY ______.A. apply left rudderB. throw the crew member a life preserverC. begin backing your enginesD. position your vessel to windward and begin recoveryKEY: B[4626]The best method to secure a towline to bitts is to ______.A. take a round turn on the bitt farthest from the pull and use figure-eightsB. take a round turn on the bitt closest to the pull and use figure-eightsC. use figure-eights and take a round turn at the top of the bittsD. use only figure-eightsKEY: B[4627]The distance a vessel moves at right angles to the original course£¬when a turn of 180has been completed£¬is called the ______.A. advanceB. pivoting pointC. tactical diameterD. kickKEY: C[4628]The distance a vessel moves parallel to the original course from the point where the rudder is put over to any point on the turning circle is called the ______.A. advanceB. drift angleC. pivoting pointD. transferKEY: A[4629]The distance gained in the direction of the original course when you are making a turn is known as ______.A. advanceB. driftC. tactical diameterD. transferKEY: A[4630]The major cause of anchor buoy pendant wire failures is ______.A. corrosionB. rough weatherC. defective socketsD. mishandlingKEY: B[4631]The most likely location for a liquid cargo fire to occur on a tanker would be ______.A. in the midships houseB. at the main deck manifoldC. at the vent headerD. in the pumproomKEY: D[4632]The only type of helicopter that may be refueled with the engine running and the blades turning is ______.A. a helicopter carrying cargo onlyB. a turbine-equipped helicopterC. a SikorskyD. a helicopter carrying injured personnel in an emergency situationKEY: B[4633]The patrolman£¬while on duty on a passenger vessel£¬must have in his possession a(n) ______.A. nightstickB. flashlightC. passenger list showing assigned berthsD. A-I fire extinguisherKEY: B[4634]The signal for fire alarm on a ship must be indicated ______.A. at each alarm bellB. at each alarm actuatorC. near all exitsD. on the station billKEY: D[4635]The survival craft is manufactured with fire retardant ______.A. foamB. marine plywoodC. steelD. fiberglassKEY: D[4636]Upon receipt of a distress message£¬a merchant vessel is bound to proceed to the scene of the distress. Under which of the following cases would this NOT be true?A. The vessel would arrive at the distress scene more than 36 hours after the receipt of the initial distress message.B. There are vessels closer to the distress scene that are proceeding to assist.C. The Master of the vessel in distress has requisitioned another vessel£¬and that vessel has accepted the requisition.D. You are on a tanker and the distress involves a major fire on board the other vessel.KEY: C[4637]What is one of the FIRST actions you should take after abandoning and clearing away from a vessel?A. Identify the person in charge.B. Gather up useful floating objects.C. Prepare for arrival of rescue units.D. Arrange watches and duties.KEY: A[4638]What should you do if you have transmitted a distress call a number of times on channel 16 and have received no reply?A. Repeat the message using any other channel on which you might attract attention.B. Key the microphone several times before transmitting again.C. Turn up the volume on the receiver before transmitting again.D. Report the problem to the head electrician.KEY: A[4639]When evacuating a seaman by helicopter lift£¬the vessel should be ______.A. stopped with the wind dead aheadB. stopped with the wind on the beamC. underway with the wind 30on the bowD. underway on a course to provide no apparent windKEY: C[4640]When evacuating a seaman by helicopter lift£¬which course should the ship take?A. Downwind so that the apparent wind is close to nil.B. A course that will keep a free flow of air£¬clear of smoke£¬over the hoist area.C. A course that will have the hoist area in the lee of the superstructure.D. With the wind dead ahead because the helicopter is more maneuverable when going into the wind.KEY: B[4641]When evacuating a seaman by helicopter lift£¬which statement is TRUE?A. The vessel should be stopped with the wind dead ahead during the hoisting operation.B. Flags should be flown to provide a visual reference as to the direction of the apparent wind.C. The drop line should be grounded first then secured as close to the hoist point as possible.D. The hoist area should be located as far aft as possible so the pilot will have a visual reference while approaching.KEY: B[4642]When joining a vessel£¬do not forget personal documents and your spectacles£¬and ______ if necessary.A. drugB. remedyC. medicineD. healerKEY: C[4643]When jumping into water upon which there is an oil-fire£¬you should ______.A. break the water surface with your hands when diving head-firstB. use your hands to hold your knees to your chestC. cover your eyes with one hand while pinching your nose shut and covering your mouth with the otherD. enter the water at the bow or stern on the windward side of the vesselKEY: D[4644]When retrieving the survival craft£¬the winch operator should stop the winch and check ______.A. that all personnel are seated in the craftB. that the cable has not jumped any grooves on the drumC. which way the wind is blowingD. the hydraulic fluid level before liftingKEY: B[4645]Which condition is necessary for a substance to burn?A. The temperature of the substance must be equal to or above its fire point.B. The air must contain oxygen in sufficient quantity.C. The mixture of vapors with air must be within the explosive range.D. All of the aboveKEY: D[4646]Which is the proper method of determining whether a portable CO2 fire extinguisher needs recharging?A. Check the tag to see when the extinguisher was last charged.B. Release a small amount of CO2; if the CO2 discharges£¬the extinguisher is acceptable.C. Weigh the extinguisher and compare the weight against that stamped on the valve.D. Recharge the extinguisher at least once each year.KEY: C[4647]Which of the following is not a maritime perils£¿ ______.A. Stranding or grounding£®B. Striking upon rocks or shoalsC. Collision between shipsD. FireKEY: D[4648]Which of the following statements regarding low expansion foam and its application is INCORRECT£¿ ______.A. Foam should not be used on electrical firesB. One kilo of low expansion foam solution produces much more foam£®C. Foam is only efficient when it covers the top of burning combustibles£®D. A stream of foam should be deflected off the deck in order to best agitate the fireKEY: D[4649]Which procedure should be followed when individuals are rescued in cold climates and suffer from hypothermia?A. Give them brandy.B. Keep them in motion.C. Immerse them in a warm bath (105F£¬40C).D. Cover them with an electric blanket set for maximum temperature.KEY: C[4650]Which statement about firefighting foam is TRUE?A. Foam conducts electricity.B. To be most effective£¬foam should be directed at the base of the fire.C. Foam is most effective on burning liquids which are flowing.D. Foam can ONLY be used to extinguish class A fires.KEY: A14.2 º£ÉϾÈÖú[4651]As a vessel sinks to a depth of 15 feet£¬the hydrostatic trip releases the liferaft container from its cradle by ______.A. breaking the weak linkB. releasing the tie-down strapC. pulling the operating cordD. releasing the CO2 canisterKEY: B[4652]An inflatable liferaft should be manually released from its cradle by ______.A. cutting the straps that enclose the containerB. removing the rubber sealing strip from the containerC. loosening the turnbuckle on the securing strapD. pushing the button on the hydrostatic releaseKEY: D[4653]An inflatable liferaft is hand-launched by ______.A. pulling a cordB. cutting the wire restraining bandsC. removing the rubber packing stripD. throwing the entire container overboardKEY: D[4654]An inflatable liferaft can be launched by ______.A. the float-free method ONLYB. breaking the weak link on the painterC. throwing the entire container overboard and then pulling on the operating cord to inflate the raftD. removing the securing strapsKEY: C[4655]Progressive flooding may be indicated by ______.A. ballast control alarmsB. excessive draftC. excessive list or trimD. a continual worsening of list or trimKEY: D[4656]You are proceeding to a distress site and expect large numbers of people in the water. Which statement is TRUE?A. You should stop to windward of the survivors in the water and only use the ship's boats to recover the survivors.B. If the survivors are in inflatable rafts you should approach from windward to create a lee for the survivors.C. An inflatable liferaft secured alongside can be an effective boarding station for transfer of survivors from the boats.D. Survivors in the water should never be permitted alongside due to the possibility of injury from the vessel.KEY: C[4657]A breeches buoy is being rigged from the shore to a stranded vessel. The initial shot line passed to the vessel is normally made fast to a ______.A. hawser which is used to pass a tail-block and whip to the vesselB. hawser with breeches buoy and harness attachedC. hawser which should be made fast to the vessel below the intended location of the tail-blockD. tail-block and whip which may be used to pass a hawser to the vesselKEY: D[4658]A cable used by helicopters for lifting or lowering persons in a pick-up operation is a ______.A. HoistB. RopeC. CableD. LineKEY: A[4659]A capsized small sail vessel is best righted when what part of the vessel is downwind?A. SternB. BowC. CenterboardD. MastKEY: D[4660]A floating ship with an initial negative metacentric height ______.A. will capsizeB. will incline furtherC. may lie at an angle of lollD. may be initially levelKEY: C[4661]A helicopter making a round trip from a helideck with refueling capabilities to an unmanned platform will take 45 minutes each way. The helicopter should be carrying enough fuel to last ______.A. 45 minutesB. 1 hour and 15 minutesC. 1 hour and 30 minutesD. 2 hoursKEY: D[4662]A mechanical davit is designed to automatically ______.A. position the boat at the embarkation stationB. lift the boat off the inboard chocksC. energize the winch for the fallsD. set the brake on the winchKEY: B[4663]A minor heat burn of the eye should be treated by ______.A. gently flooding with waterB. warming the eye with moist warm packsC. laying the person flat on his backD. mineral oil drops directly on the eyeKEY: A[4664]A negative metacentric height ______.A. will always cause a vessel to capsizeB. should always be immediately correctedC. always results from off-center weightsD. All of the above are correctKEY: B[4665]A person has fallen overboard and is being picked up with a lifeboat. If the person appears in danger of drowning£¬the lifeboat should make ______.A. an approach from leewardB. an approach from windwardC. the most direct approachD. an approach across the windKEY: C[4666]A person has suffered a laceration of the arm. Severe bleeding has been controlled by using a sterile dressing and direct pressure. What should you do next?A. Apply a tourniquet to prevent the bleeding from restarting.B. Apply a pressure bandage over the dressing.C. Remove any small foreign matter and apply antiseptic.D. Administer fluids to assist the body in replacing the lost blood.KEY: B[4667]A person may operate an air compressor in which of the following areas on board a tank barge?A. PumproomB. Generator roomC. A space adjacent to a cargo tankD. A space two meters from a cargo valveKEY: B[4668]A person who gets battery acid in an eye should IMMEDIATELY wash the eye with ______.A. boric acid solutionB. waterC. baking soda solutionD. ammoniaKEY: B[4669]A person with diabetes has received a minor leg injured. The symptoms of the onset of a diabetic coma include ______.A. reduced appetite and thirstB. sneezing and coughingC. only a low grade feverD. slurred speech and loss of coordinationKEY: D[4670]A racetrack turn would be better than a Williamson turn in recovering a man overboard if ______.A. the man has been missing for a period of timeB. the sea water is very cold and the man is visibleC. there is thick fogD. the wind was from astern on the original courseKEY: B[4671]A rescuer can most easily determine whether or not an adult victim has a pulse by checking the pulse at the ______.A. carotid artery in the neckB. femoral artery in the groinC. brachial artery in the armD. radial artery in the wristKEY: A[4672]A right-handed propeller will cause the survival craft to ______.A. walk the stern to starboard in reverseB. walk the stern to port in reverseC. run faster than a left-handed propellerD. right itself if capsizedKEY: B[4673]A shipmate chokes suddenly£¬cannot speak£¬and starts to turn blue. You should ______.A. perform the Heimlich maneuverB. make the victim lie down with the feet elevated to get blood to the brainC. immediately administer CPRD. do nothing until the victim becomes unconsciousKEY: A[4674]A towline should be fastened to ______.A. the chocks at the bow of a towed vesselB. the most forward£¬centermost point of a towed vessel such asa sturdy bow railC. the mast of a towed sailboatD. a secure fitting near the bow of the towed vesselKEY: D[4675]Aboard a survival craft£¬ether can be used to ______.A. start the engine in cold weatherB. aid in helping personnel breatheC. prime the sprinkler systemD. prime the air supplyKEY: A[4676]AN ILLNESS PREFERABLY OF AN INFECTIOUS NATURE SEIZING MORE THAN TWO PERSONS ON BOARD AT THE SAME TIME defines ______.A. Disease of CrewB. Crew illnessC. Group illnessD. Mass diseaseKEY: D[4677]An obstruction on a helideck is any object that might present a hazard to the______.A. rotor blades and landing gearB. unloading of passengersC. loading of cargoD. pilot's visibilityKEY: A[4678]Any vessel in need of carrying out deck washing must be ______ by the department concerned beforehand£®A. requestedB. allowedC. approvedD. inquiredKEY: C[4679]For a ship not on an international voyage£¬an approved substitute for an impulse projected rocket-type line throwing appliance is a ______.A. spring loaded line throwerB. hand thrown buoyant lineC. shoulder-type line throwing gunD. heaving lineKEY: C[4680]If the coxswain of your lifeboat gives the command HOLD WATER you should ______.A. complete the stroke£¬raise your oar slightly£¬swinging the oar slightly forward£¬and place it in the boatB. lift the oar in a vertical positionC. complete the stroke and hold the oar out of the waterD. dip the blade of your oar into the water vertically and hold it perpendicular to the keel lineKEY: D[4681]If you have to jump in the water when abandoning a vessel£¬your legs should be ______.A. spread apart as far as possibleB. held as tightly against your chest as possibleC. in a kneeling positionD. extended straight down and crossed at the anklesKEY: D[4682]If you must land on a beach with an oar-propelled lifeboat through a heavy surf£¬the recommended method is to ______.A. keep the bow directly in toward the beach£¬and tow the sea anchor off the sternB. ride in on the back of a large breakerC. keep the bow into the seas with the sea anchor out over the bow£¬and row to meet the breaking wavesD. head directly into the beach by staying between the crests of the waves KEY: C[4683]In an open lifeboat£¬the lifeboat compass is usually ______.A. placed in a fixed bracket when being usedB. clamped to any position convenient for the coxswain to see itC. permanently mounted on the lifeboat's centerlineD. mounted in the center of the boat to eliminate deviationKEY: A[4684]In heavy seas the helmsman should steer the motor lifeboat ______.A. into the seasB. broadside to the seasC. in the same direction as the seasD. in a series of figure-eightsKEY: A[4685]In heavy seas you decide to heave to. The lifeboat should be ______.A. brought to a position with the stern into the seasB. allowed to take its own headC. brought to lay in the troughD. brought bow into the seasKEY: D[4686]In which situation could a vessel most easily capsize?A. Running into head seasB. Running in the troughC. Running with following seasD. Anchored with your bow into the seasKEY: B[4687]Inflatable liferafts are less maneuverable than lifeboats due to their ______.A. shapeB. shallow draftC. large sail areaD. All of the aboveKEY: D[4688]Large volumes of carbon dioxide are safe and effective for fighting fires in enclosed spaces£¬such as in a pumproom£¬provided that the ______.A. persons in the space wear gas masksB. persons in the space wear damp cloths over their mouths and nostrilsC. ventilation system is secured and all persons leave the spaceD. ventilation system is kept operatingKEY: C[4689]Multiple fire pumps may be used for other purposes provided that one pump is ______.A. on line to the fire mainB. kept available for use on the fire main at all timesC. capable of being connected to the fire mainD. rated at or above 125 psiKEY: B[4690]Oil fires are best extinguished by ______.A. cutting off the supply of oxygenB. removing the fuelC. cooling below the ignition temperatureD. spraying with waterKEY: A[4691]On a rigid liferaft which is equipped with all of the required equipment you may NOT find a ______.A. boathookB. fishing kitC. lifeline or grab railD. sea painterKEY: B[4692]On a ship£¬a fire pump may be used for other purposes if ______.A. the other services are run off a reducing station with a pressure gageB. a separate fire pump is available for use on the fire mainC. all other services are operated by a manifold near the pumpD. All of the aboveKEY: B[4693]On a vessel£¬if someone fell overboard and you did not know over which side the person fell£¬you should ______.A. immediately reverse the enginesB. stop the propellers from turning and throw a ring buoy over the sideC. increase speed to full to get the vessel away from the personD. first put the rudder hard over in either directionKEY: B[4694]Releasing oil from the sea anchor of a lifeboat may ______.A. keep the propeller from being fouledB. increase propeller speedC. help calm the waves in the vicinity of the craftD. increase the holding power of the sea anchorKEY: C[4695]Seasickness is caused by rolling or rocking motions which affect fluids in the ______.A. stomachB. lower intestinesC. inner earD. bladderKEY: C[4696]Separation cloths may be used to ______.A. absorb moisture from hygroscopic cargoesB. fill gaps between layers of cargoC. wrap cargo that leaks from packagingD. keep bagged cargo leakage from contacting the deckKEY: D[4697]Severe exposure to chlorine gas can be fatal. Chlorine gas is primarily a ______.A. respiratory irritantB. skin burning agentC. blood poisoning agentD. nerve paralyzing irritantKEY: A[4698]Steering a motor lifeboat broadside to the sea could cause it to ______.A. capsizeB. run smootherC. run fasterD. sinkKEY: A[4699]Steering a survival craft broadside to the sea could cause it to ______.A. capsizeB. run smootherC. run fasterD. sinkKEY: A[4700]Survival practice in the mooring system is to slack off the tensions on the leeward side and ______.A. deballast the unit to transit draftB. adjust as evenly as practical the windward tensionsC. release the anchors on the windward sideD. tighten the anchor buoys on the leeward side anchorsKEY: BÊ®°Ë º£ÉÏÏû·À18.1 ȼÉÕÓ뱬ը[4701]The emergency signal for fires is sounded on the ship's whistle and general alarm as ______ £®A. a continuous ringing for 10 secondsB. one short ring followed by one long ringC. two long rings of at least 20 secondsD. a continuous ringing until the fire is extinguishedKEY: A[4702]A carbon dioxide fire extinguisher should be recharged ______.A. at least annuallyB. whenever it is below its required weightC. only if the extinguisher has been usedD. before every safety inspectionKEY: B[4703]A carburetor is required to have a safety device called a(n) ______.A. pressure releaseB. backfire flame arrestorC. automatic shut off。

高分子专业英语

高分子专业英语

单词engineeringmaterials 工程材料ductile 延展metallic materials 金属材料durable 耐久的ferrous alloys 黑色金属合金合金quote 引用援引non-ferrous metals 有色金属eminently 杰出地organic polymer materials 有机高分子材料rust 生锈plastic 塑料precipitation 沉淀沉积rubber 橡胶dislocation 位错synthetic fibers 合成纤维arbitrary 独断的,任意的inorganic non-metallic materials 无机非金属材料smelt 熔炼,精炼composite materials 复合材料Intricate 复杂的,精巧的wrought iron 熟铁combination 结合,化合物pig iron 生铁ductile 易延展的four general types of cast iron 铸铁的四种类型low ductility 低延展性ductile iron 球墨铸铁tough 艰难的gray iron 灰铸铁toughness 韧性white iron 白口铸铁porosity 孔隙度,气孔,气泡malleable iron 可锻铸铁insulating 绝缘alloying elements 合金元素flexible 灵活的chromium 铬corrosion resistance 抗腐蚀性nickel 镍lightweight 轻impurity 杂质reduce 还原,减少majority 多数weight reduction of vehicle 汽车轻量化wool fibres 毛纤维automobile bodies 汽车车身the sheep 羊cutlery 餐具silk fibres 丝纤维springs 弹簧silkworms 蚕slip systems 滑移性cementite 渗碳体oxide 氧化物proteins 蛋白质spheroidal graphite 球状石墨varnish 清漆ballbearing 滚珠轴承pigment 颜料dislocation motion 位错的运动solvent 溶剂precipitation hardening 沉积硬化additives 添加剂balance 平衡paint 油漆cultivate 培养drying oils 干燥油shatterproof 碎cure 固化against 反对cured or dried 固化或干燥compared to 相比ancient times 古代aesthetic appeal 艺术感染力millennia 千年more dense 更密集的arbitrary boundary 任意边界判断1.The name “cast iron”derives from the fact that there is only iron in cast irons2.There are a lot of alloys in which there is no iron.3.3.Tungsten can bear the temperature of 2000℃in air.4.There are more than one step in the process to make a plstic product。

电工胶布(胶带)物质安全资料表MSDS 1298 1350 1350F 1350T

电工胶布(胶带)物质安全资料表MSDS 1298 1350 1350F 1350T

Material Safety Data SheetCopyright, 2009, Company. All rights reserved. Copying and/or downloading of this information for the purpose of properly utilizing products is allowed provided that: (1) the information is copied in full with no changes unless prior written agreement is obtained from and (2) neither the copy nor the original is resold or otherwise distributed with the intention of earning a profit thereon.This material safety data sheet (MSDS) is provided as a courtesy in response to a customer request. This product is not regulated under, and a MSDS is not required for this product by the OSHA Hazard Communication Standard (29 CFR 1910.1200) because, when used as recommended or under ordinary conditions, it should not present a health and safety hazard. However, use or processing of the product not in accordance with the product's recommendations or not under ordinary conditions may affect the performance of the product and may present potential health and safety hazards.PRODUCT NAME: ELECTRICAL TAPE 1298, 1350, 1350F, 1350T, LRT-S/YMANUFACTURER:DIVISION: International OperationsElectrical Markets DivisionADDRESS: CenterIssue Date: 03/10/2009Supercedes Date: 10/21/2005Document Group:07-7791-2Product Use:Intended Use:ELECTRICAL INSULATIONIngredient C.A.S. No.% by WtPOLYESTER FILM None40 -50FLAME RETARDENT ADHESIVE Trade Secret40 -503.1 EMERGENCY OVERVIEWSpecific Physical Form: Roll of TapeOdor, Color, Grade: White or YellowGeneral Physical Form: SolidImmediate health, physical, and environmental hazards: This product, when used under reasonable conditions and in accordance with the directions for use, should not present a health hazard. However, use or processing of the product in a manner not in accordance with the product's directions for use may affect the performance of the product and may present potentialhealth and safety hazards.3.2 POTENTIAL HEALTH EFFECTSEye Contact:No health effects are expected.Skin Contact:No health effects are expected.Inhalation:No health effects are expected.Ingestion:No health effects are expected.4.1 FIRST AID PROCEDURESThe following first aid recommendations are based on an assumption that appropriate personal and industrial hygiene practices are followed.Eye Contact: No need for first aid is anticipated.Skin Contact: No need for first aid is anticipated.Inhalation: No need for first aid is anticipated.If Swallowed: No need for first aid is anticipated.5.1 FLAMMABLE PROPERTIESAutoignition temperature Not ApplicableFlash Point Not ApplicableFlammable Limits -LEL Not ApplicableFlammable Limits -UEL Not Applicable5.2 EXTINGUISHING MEDIAUse fire extinguishers with class B extinguishing agents (e.g., dry chemical, carbon dioxide).5.3 PROTECTION OF FIRE FIGHTERSSpecial Fire Fighting Procedures: Wear full protective equipment (Bunker Gear) and a self-contained breathing apparatus (SCBA).Unusual Fire and Explosion Hazards: No unusual fire or explosion hazards are anticipated.Accidental Release Measures:Not applicable.7.1 HANDLINGThis product is considered to be an article which does not release or otherwise result in exposure to a hazardous chemical under normal use conditions. Store at temperature and conditions as recommended on product literature.7.2 STORAGENot applicable.8.1 ENGINEERING CONTROLSNot applicable.8.2 PERSONAL PROTECTIVE EQUIPMENT (PPE)8.2.1 Eye/Face ProtectionNot applicable.8.2.2 Skin ProtectionNot applicable. Gloves are not required.8.2.3 Respiratory ProtectionUnder normal use conditions, airborne exposures are not expected to be significant enough to require respiratory protection. 8.2.4 Prevention of SwallowingNot applicable.8.3 EXPOSURE GUIDELINESIngredient Authority Type Limit Additional Information ANTIMONY COMPOUNDS ACGIH TWA, as Sb0.5 mg/m3ANTIMONY COMPOUNDS OSHA TWA, as Sb0.5 mg/m3 Table Z-1ASpecific Physical Form: Roll of TapeOdor, Color, Grade: White or YellowGeneral Physical Form: SolidAutoignition temperature Not ApplicableFlash Point Not ApplicableFlammable Limits -LEL Not ApplicableFlammable Limits -UEL Not ApplicableBoiling point Not ApplicableDensity No Data AvailableVapor Density Not ApplicableVapor Pressure Not ApplicableSpecific Gravity No Data AvailablepH Not ApplicableMelting point No Data AvailableSolubility In Water No Data AvailableEvaporation rate Not ApplicableVolatile Organic Compounds Not ApplicablePercent volatile Not ApplicableVOC Less H2O & Exempt Solvents Not ApplicableViscosity Not ApplicableStability:Stable.Materials and Conditions to Avoid: None knownHazardous Polymerization: Hazardous polymerization will not occur.Hazardous Decomposition or By-ProductsSubstance ConditionCarbon monoxide During CombustionCarbon dioxide During CombustionHazardous Decomposition: Under recommended usage conditions, hazardous decomposition products are not expected. Hazardous decomposition products may occur as a result of oxidation, heating, or reaction with another material.ECOTOXICOLOGICAL INFORMATIONNot applicable.CHEMICAL FATE INFORMATIONNot applicable.Waste Disposal Method: Dispose of waste product in a sanitary landfill. As a disposal alternative, incinerate in an industrial or commercial facility.EPA Hazardous Waste Number (RCRA):Not regulatedID Number(s):80-6112-0391-2, XE-0021-8753-4, XE-0042-1630-7, XE-0042-1773-5US FEDERAL REGULATIONSContact for more information.311/312 Hazard Categories:Fire Hazard -No Pressure Hazard -No Reactivity Hazard -No Immediate Hazard -No Delayed Hazard -NoSTATE REGULATIONSContact for more information.CHEMICAL INVENTORIESThe components of this product are in compliance with the chemical notification requirements of TSCA.All applicable chemical ingredients in this material are listed on the European Inventory of Existing Chemical Substances (EINECS), or are exempt polymers whose monomers are listed on EINECS.This product is an article as defined by TSCA regulations, and is exempt from TSCA Inventory listing requirements.Contact for more information.INTERNATIONAL REGULATIONSContact for more information.NFPA Hazard ClassificationHealth: 0 Flammability: 0 Reactivity: 0 Special Hazards: NoneNational Fire Protection Association (NFPA) hazard ratings are designed for use by emergency response personnel to address the hazards that are presented by short-term, acute exposure to a material under conditions of fire, spill, or similar emergencies. Hazard ratings are primarily based on the inherent physical and toxic properties of the material but also include the toxic properties of combustion or decomposition products that are known to be generated in significant quantities.Reason for Reissue: The MSDS has been revised because has adopted the 16-section ANSI/ISO format. The potential hazards of the product have not changed. We encourage you to reread the MSDS and review the information.Revision Changes:Section 1: Division name was modified.Copyright was modified.Section 1: Secondary Division name was added.Section 14: ID Number Heading Template 1 was added.Section 14: ID Number(s) Template 1 was added.Section 2: Ingredient table was added.Section 8: Exposure guidelines ingredient information was added.DISCLAIMER: The information in this Material Safety Data Sheet (MSDS) is believed to be correct as of the date issued. MAKES NO WARRANTIES, EXPRESSED OR IMPLIED, INCLUDING, BUT NOT LIMITED TO, ANY IMPLIED WARRANTY OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR COURSE OF PERFORMANCE OR USAGE OF TRADE. User is responsible for determining whether the product is fit for a particular purpose and suitable for user's method of use or application. Given the variety of factors that can affect the use and application of a product, some of which are uniquely within the user's knowledge and control, it is essential that the user evaluate the product to determine whether it is fit for a particular purpose and suitable for user's method of use or application.provides information in electronic form as a service to its customers. Due to the remote possibility that electronic transfer may have resulted in errors, omissions or alterations in this information, makes no representations as to its completeness or accuracy. In addition, information obtained from a database may not be as current as the information in the MSDS available directly from 3M.。

品目注释 中英文对照

品目注释 中英文对照

写一篇关于介绍电器的英语作文English:Electrical appliances have become an indispensable part of modern life, offering convenience, comfort, and efficiency in various tasks. From kitchen appliances like refrigerators, microwaves, and blenders to entertainment devices such as televisions and gaming consoles, and even essential utilities like washing machines and air conditioners, electrical appliances permeate every aspect of daily living. These appliances have revolutionized household chores, making tasks quicker and more manageable, thus freeing up time for other activities. Moreover, technological advancements have led to the development of smart appliances equipped with features like remote control, energy efficiency, and connectivity to smartphones or home networks, enhancing user experience and optimizing resource usage. However, alongside their benefits, electrical appliances also raise concerns regarding energy consumption, environmental impact, and electronic waste management. Therefore, it is crucial for consumers to make informed choices, opting for energy-efficient models, practicing responsible disposal methods,and embracing sustainable habits to minimize the ecological footprint of using electrical appliances.Translated content:电器已成为现代生活中不可或缺的一部分,为各种任务提供便利、舒适和效率。

五氧化物的英语

五氧化物的英语

五氧化物的英语The Enigma of PentoxidePentoxide is a fascinating chemical compound that has captivated the scientific community for decades. This intriguing substance, with its unique properties and diverse applications, has become a subject of intense study and research. In this comprehensive essay, we will delve into the world of pentoxide, exploring its chemical structure, its various forms, and its remarkable uses in various industries.At the outset, it is essential to understand the chemical composition of pentoxide. Pentoxide is a compound consisting of five oxygen atoms and one atom of another element, typically a metal or a nonmetal. The specific composition of pentoxide can vary depending on the element it is combined with, leading to a diverse range of pentoxide compounds, each with its own distinct characteristics and applications.One of the most well-known forms of pentoxide is phosphorus pentoxide, also known as diphosphorus pentoxide. This compound is composed of two phosphorus atoms and five oxygen atoms, with the chemical formula P2O5. Phosphorus pentoxide is a white,crystalline solid that is highly reactive and hygroscopic, meaning it readily absorbs moisture from the atmosphere. This property makes it an excellent desiccant, a substance used to remove moisture from enclosed spaces, and it is widely used in various industries for this purpose.Another prominent form of pentoxide is sulfur pentoxide, or disuflur pentoxide, with the chemical formula SO3. Sulfur pentoxide is a colorless, volatile liquid that is highly reactive and corrosive. It is a key intermediate in the production of sulfuric acid, one of the most widely used industrial chemicals in the world. Sulfur pentoxide is also used in the manufacture of certain types of fertilizers and in the production of various other chemicals.In addition to these well-known forms, pentoxide can also exist in other configurations, such as arsenic pentoxide (As2O5), antimony pentoxide (Sb2O5), and bismuth pentoxide (Bi2O5). Each of these pentoxide compounds has its own unique properties and applications, making them valuable in a variety of industries.One of the most fascinating aspects of pentoxide is its ability to exist in different physical states, depending on the specific conditions. For example, phosphorus pentoxide can exist as a crystalline solid, a glassy solid, or even a liquid, depending on the temperature and pressure conditions. This versatility allows pentoxide to be used in awide range of applications, from desiccants to catalysts to high-temperature insulation materials.The applications of pentoxide are truly diverse and far-reaching. In the field of materials science, pentoxide compounds are used in the production of specialized ceramics, glass, and advanced coatings. These materials are valued for their high-temperature resistance, chemical stability, and unique optical properties.In the realm of electronics, pentoxide compounds, particularly tantalum pentoxide (Ta2O5), are used in the manufacturing of capacitors, which are essential components in various electronic devices. Tantalum pentoxide is valued for its high dielectric constant, allowing for the creation of compact and efficient capacitors.In the energy sector, pentoxide compounds are finding increasing use in the development of high-performance batteries and fuel cells. For example, vanadium pentoxide (V2O5) is being explored as a potential material for use in advanced energy storage systems, thanks to its ability to undergo reversible redox reactions.The importance of pentoxide in the field of catalysis cannot be overstated. Numerous pentoxide compounds, such as molybdenum pentoxide (MoO5) and tungsten pentoxide (WO5), are widely used as catalysts in various industrial processes, from the production ofammonia to the refining of crude oil.In the realm of environmental protection, pentoxide compounds are playing a crucial role. Titanium pentoxide (TiO2), for instance, is used in the production of self-cleaning and air-purifying coatings, as well as in the development of advanced water treatment technologies.The versatility of pentoxide is truly remarkable, and its impact on various industries is undeniable. As scientific research and technological advancements continue to push the boundaries of our understanding of this fascinating compound, the future applications of pentoxide are sure to be even more diverse and impactful.In conclusion, the world of pentoxide is a complex and intriguing one, filled with a wealth of chemical and technological wonders. From its unique physical and chemical properties to its diverse applications in various industries, pentoxide has proven to be an indispensable component of modern society. As we continue to explore and harness the potential of this remarkable compound, the possibilities for its future impact on our world are truly limitless.。

英语词汇—金属

英语词汇—金属

English Vocabulary — Metals Essential Metal Terms:Corrosion: The process which metals deteriorate due to chemical reactions with their environment, often leading to rust.Conductivity: The ability of a material to conduct heat or electricity; metals are generally good conductors.Ductility: The capacity of a metal to be drawn out into a thin wire without breaking.Malleability: The ability of a metal to be hammered or pressed into various shapes without breaking.Common Metal Types:Iron: A strong, magnetic metal that is the primary constituent of steel and is widely used in construction and manufacturing.Steel: An alloy of iron with carbon and often other elements like manganese and chromium, known for its strength and durability.Aluminum: A lightweight, corrosionresistant metal usedin everything from packaging to aerospace.Copper: A reddishbrown metal known for its highelectrical and thermal conductivity, often used in wiring and plumbing.Gold: A precious metal valued for its resistance to corrosion and its use in jewelry, electronics, and currency.Specialized Metal Terms:Tungsten: One of the hardest metals, with the highest melting point, used in light bulb filaments and heavyduty tools.Titanium: A strong, lightweight metal with corrosionresistant properties, often used in aerospace and medical applications.Nickel: A lustrous, silverywhite metal used in alloys, particularly stainless steel, and for plating to prevent corrosion.Zinc: A bluishwhite metal used to galvanize steel and in alloys like brass and bronze, which are used in musical instruments and decorative arts.Platinum: A rare and valuable metal known for its resistance to corrosion and its use in jewelry and catalytic converters.Metallurgy and Metalworking Terms:Smelting: The process of extracting metal from its ore heating and reduction with a reducing agent.Casting: A manufacturing process in which a liquid metal is somehow delivered into a mold where it is allowed to cool and solidify to the configuration of the mold cavity.Understanding these terms can help you navigate the world of metals, whether you're discussing industrial applications, scientific research, or simply admiring the craftsmanship of a piece of jewelry. Metals are fundamental to our modern world, and their unique properties make them indispensable in countless ways.Exploring the World of Metals: A Deeper Dive into English VocabularyDelving into the Intricacies of Metal Alloys:Brass: A metal alloy made of copper and zinc, known for its golden color and used in musical instruments, decorative items, and plumbing fittings.Bronze: An alloy consisting primarily of copper, withtin and sometimes other elements like aluminum or nickel, used for sculptures, coins, and ship hardware.Pewter: A soft alloy, traditionally 85–99% tin, with the remainder consisting of copper and antimony, used for tableware and decorative objects.Inconel: A family of austenitic nickelchromiumbased superalloys, known for their high corrosion resistance and strength at high temperatures, used in gas turbines and chemical plants.Metalworking Techniques and Processes:Annealing: A heat treatment process that alters the physical and sometimes chemical properties of a material to increase its ductility and reduce its hardness.Brazing: A metaljoining process that employs a filler metal to join two or more workpieces, which must be heated to a temperature above the melting point of the filler but below the melting point of the workpieces.Soldering: A process in which two or more items are joined together melting and putting a filler metal (solder) into the joint, the filler metal having a lower melting point than the workpieces.Machining: A process in which a material is removed from a workpiece using a controlled materialremoval process to generate a desired shape and size.Plating: A surface covering in which a metal is deposited onto a conductive surface to improve corrosion resistance, wearability, or aesthetics.Metals in Everyday Life:Coins: Small, flat, round pieces of metal used primarily as a medium of exchange or legal tender in many countries.Environmental and Ethical Considerations:Recycling: The process of converting waste metals into reusable material, reducing the need for mining and conserving natural resources.Sustainable Mining: Practices that minimize the environmental impact of extracting metals from the earth, focusing on efficiency, recycling, and responsible land use.Unearthing the Versatility of Metals: Expanding Your English VocabularyThe Beauty and Utility of Metal Finishes:Polishing: The process of smoothing a metal surface to a high degree of reflectivity, often used to enhance the appearance and durability of metals.Brushed Finish: A texture applied to metal surfaces through the use of a wire brush, creating a pattern of parallel lines, popular in modern design for its sleek appearance.Matte Finish: A nonglossy surface treatment that absorbs light rather than reflecting it, providing a subtle and sophisticated look.Chrome Plating: The process of coating a metal object with a thin layer of chromium for a shiny, reflective, and corrosionresistant surface.Patina: A natural or artificial finish that forms on the surface of metals through oxidation, often valued for its unique color and texture.Metal Properties and Applications:Magnetism: The property of certain metals, like iron, nickel, and cobalt, that allows them to attract or repel other magnetic materials, essential in electronics and data storage.Thermal Expansion: The tendency of metals to expand when heated, a critical consideration in engineering and construction to prevent structural damage.Elasticity: The ability of a metal to deform under stress and return to its original shape upon the removal of the stress, crucial for materials used in springs and shock absorbers.Reflectivity: The measure of a material's ability to reflect light, a property that makes metals ideal for mirrors and solar panels.Metal Extraction and Processing:Ore: A naturally occurring solid material containing valuable minerals, such as metals, which can be mined and processed.Refining: The process of purifying an impure metal to increase its value and usability removing unwanted substances.Electroplating: A process that uses electric current to deposit a layer of metal onto a conductive surface, used to embellish objects or for corrosion protection.Foundry: A factory that produces metal castings melting metal in a furnace and pouring it into a mold, used to create a wide range of metal products.Health and Safety Considerations:Heavy Metals: A group of metals that can be harmful to human health when ingested or inhaled, such as lead, mercury, and cadmium, often regulated in industrial and consumer products.Occupational Health: The branch of public health that focuses on the health and safety of people at work, particularly relevant for those working with metals and their alloys.。

泉州2024年02版小学五年级第14次英语第3单元寒假试卷(含答案)

泉州2024年02版小学五年级第14次英语第3单元寒假试卷(含答案)

泉州2024年02版小学五年级英语第3单元寒假试卷(含答案)考试时间:100分钟(总分:110)B卷考试人:_________题号一二三四五总分得分一、综合题(共计100题)1、听力题:A __________ is a substance that changes color in response to pH changes.2、填空题:I like to spend time with my family during ________ (假期) and enjoy special meals together.3、听力题:I like to run in the _____ (公园).4、听力题:The chemical properties of an element are determined by its ______.5、填空题:A firefly's light is used to attract ______ (配偶).6、填空题:The __________ (历史的多样化解读) enriches scholarship.7、Which instrument has strings?A. PianoB. FluteC. GuitarD. Drum答案:C8、What is the opposite of "north"?A. EastB. WestC. SouthD. Up答案: C. South9、填空题:I like to draw pictures of ________.10、填空题:My favorite fruit is ______ (香蕉). They are sweet and easy to ______ (吃).11、填空题:A parakeet can be green, blue, or ______ (黄色).12、Which animal is known for its black and white stripes?A. TigerB. ZebraC. LeopardD. Cheetah答案: B13、urban) area is characterized by high population density. 填空题:The ____14、听力题:We like to ________ together.15、What is the name of the famous wizarding school in Harry Potter?A. HogwartsB. NarniaC. OzD. Middle-Earth答案:A16、填空题:The ______ (木本植物) includes trees and shrubs.17、听力题:My sister loves _______ (fishing).18、填空题:I think it's important to ________ (锻炼) regularly.19、听力题:There are _____ (two/three) apples on the table.20、听力题:The __________ is the process of breaking down large molecules into smaller ones.21、听力题:A chemical reaction can be affected by the _____ of reactants.22、听力题:The __________ is known for its ancient ruins.23、听力题:The sun sets and the sky is ______. (beautiful)24、填空题:I have a toy _____ that spins and twirls.25、What is the primary color that mixes with yellow to create green?A. BlueB. RedC. PurpleD. Orange答案:A26、What is the name of the first robotic probe to explore the outer planets?A. Voyager 1B. Pioneer 10C. Mariner 10D. New Horizons27、What is the name of the largest animal on land?A. HippoB. GiraffeC. ElephantD. Rhino答案: C28、What do we call the study of life in the oceans?A. Marine BiologyB. OceanographyC. Aquatic ScienceD. All of the above答案:D29、听力题:Solutions can be __________ or concentrated.30、Which one is a type of tree?A. RoseB. OakC. DaisyD. Sunflower31、听力题:A compound that contains both carbon and nitrogen is called a ______.32、听力题:A __________ is a place where many people relax.33、听力题:She loves _____ (reading) stories.34、听力题:It is _____ outside today. (cold/hot/warm)35、What is the largest country in the world?A. CanadaB. RussiaC. ChinaD. USA答案:B. Russia36、填空题:_____ (spore) is used by ferns to reproduce.37、听力题:The kitten is ___. (cute)38、听力题:I like to ___ (explore/hike) in the woods.39、听力题:A _______ is a type of tree that produces acorns.40、填空题:A ____(biodiversity loss) threatens ecosystems.41、听力题:The _____ (socks) are mismatched.42、填空题:A bee buzzes from flower to _______ collecting nectar.43、听力题:The chemical symbol for barium is _______.44、Which animal is known for its long neck?A. ElephantB. GiraffeC. LionD. Tiger答案:B45、填空题:_____ (水果) trees produce many tasty treats.46、听力题:The ______ works with computers.47、听力题:A snake moves by __________ its body.48、填空题:The dog loves to fetch a ______.49、sustainable transit) options encourage eco-friendly travel. 填空题:The ____50、听力题:We have ___ (art/music) class soon.51、What is the capital of Guinea?A. ConakryB. NzérékoréC. KankanD. Kindia答案:A52、听力题:The capital of the Maldives is __________.53、选择题:What do we call a group of animals of the same species?A. HerdB. PackC. FlockD. Colony54、What do you call a young pig?A. PigletB. CalfC. FoalD. Kid55、听力题:He _____ (plays/played) the guitar well.56、听力题:The ______ helps protect the body from bacteria.57、What do we call the time when the sun rises?A. SunriseB. SunsetC. DuskD. Dawn答案: A58、选择题:What is the fastest land animal?A. CheetahB. LionC. HorseD. Gazelle59、填空题:The parakeet chirps happily in its _________. (笼子)60、填空题:I enjoy learning about different ______ (科学) topics. Each lesson is an opportunity to discover something new.61、填空题:My uncle is a __________ (历史学家).62、听力题:Organic chemistry studies compounds that contain _____.63、填空题:The __________ (历史的相关性) impacts present-day issues.64、填空题:The __________ (历史的影响) can create change.65、填空题:My _______ (猫) sleeps in the sun.66、填空题:The _____ (栖息地) of many animals relies on plants.67、What is the name of the boundary beyond which no light can escape a black hole?A. Event HorizonB. SingularityC. Photon SphereD. Accretion Disk68、What do we call a picture taken with a camera?A. ImageB. GraphC. DrawingD. Painting答案:A69、听力题:Chemical bonds are formed when atoms _____ electrons.70、What is the most common color of an orange?A. GreenB. YellowC. OrangeD. Red答案:C71、听力题:A _______ can help to demonstrate the principles of energy transformation.72、填空题:I enjoy ______ (参加) art competitions.73、填空题:The garden has many different _______ (花园里有许多不同的_______).74、What is a baby dog called?A. KittenB. PuppyC. CubD. Chick答案:B75、What is the capital of Japan?A. BeijingB. SeoulC. TokyoD. Bangkok76、What do we call a person who helps in emergencies?A. NurseB. FirefighterC. TeacherD. Chef77、What do we call the act of moving quickly on foot?A. WalkingB. RunningC. JoggingD. Sprinting答案:B78、填空题:My cousin has a toy _____ that walks.79、听力题:Many _______ lose their leaves in the fall.80、What is the main ingredient in mashed potatoes?a. Riceb. Potatoesc. Cornd. Carrots答案:B81、填空题:I want to _______ (参加) a cooking class.82、听力题:A ______ is a systematic review of literature.83、听力题:A __________ is known for its bright colors and beautiful patterns.84、听力题:There are three _____ (apples/oranges) on the table.85、Which of these is a vegetable?A. AppleB. CarrotC. BananaD. Grape86、Which season comes after winter?A. FallB. SpringC. SummerD. Autumn答案: B87、填空题:The ________ (日落) over the ocean is breathtaking.88、听力题:Acid rain can harm ______ and buildings.89、听力题:He is going to the ___. (store)90、What is the capital of Saudi Arabia?A. RiyadhB. MeccaC. JeddahD. Medina答案: A. Riyadh91、听力题:I want to learn how to ________.92、What do we call the process of converting a liquid into a gas?A. EvaporationB. CondensationC. SublimationD. Freezing答案:A93、填空题:The doll wears a pretty _______ (娃娃穿着漂亮的_______).94、填空题:The puppy is _______ (很可爱).95、Which bird is known for its colorful feathers and can mimic sounds?A. SparrowB. ParrotC. PenguinD. Eagle答案:B96、What do we call a scientist who studies living things?A. ChemistB. BiologistC. PhysicistD. Geologist答案:B97、填空题:We have a ______ (特别的) day planned for school.98、What do you call a baby elephant?A. CalfB. CubC. KidD. Foal99、What is the capital city of Italy?A. VeniceB. FlorenceC. RomeD. Milan答案:C100、What do you call a person who plays music?A. ArtistB. MusicianC. DancerD. Singer。

ITO薄膜光电性能红外-可见光谱分析方法

ITO薄膜光电性能红外-可见光谱分析方法

ITO薄膜光电性能红外-可见光谱分析方法全国性建材科技期刊——《玻璃》2007年第3期总第192期ITO薄膜光电性能红外一可见光谱分析方法余刚王慧刘静(中国建筑材料科学研究总院北京市100024)摘要研究了射频磁控溅射制备ITO薄膜,利用四探针方法,分光光度计测试薄膜面电阻及红外一可见光光谱,利用光谱特征研究了不同工艺对薄膜面电阻,载流子浓度,折射率等光电性能的影响.研究表明,随温度的升高ITO薄膜面电阻减小,载流子浓度增加,折射率减小,透过率增加;随氧分压的增加面电阻增大,载流子浓度减小.关键词ITO薄膜面电阻载流子浓度光谱中图分类号:TQ171文献标识码:A文章编号:1003—1987(2007)03—0006—031前言目前氧化铟锡ITO(InO.:Sn)薄膜以其优异的光电性能得到广泛的应用.ITO结晶具有体心立方铁锰矿结构,是一种重掺杂,高简并的n型半导体薄膜,不仅具有优良的光电性能,还具有高硬度,耐磨性,耐化学腐蚀特性以及良好的可加工性能,这使它广泛应用于FED,PDP,LED等多种电子显示器件,太阳能电池,电加热玻璃和高层建筑物窗口玻璃口].本文利用射频磁控溅射方法制备ITO薄膜,分别利用四探针,分光光度计测量薄膜面电阻,红外透过及反射光谱和可见光段透过光谱,由红外光谱,可见光谱分析了薄膜制备工艺与光电性能之间的关系.2实验2.1试样制备本实验采用射频磁控溅射方法制备ITO薄膜,靶材为ITO陶瓷靶(InO.:SnOz质量比为9:1),样品架与溅射靶面成45.,中心距离15cm,并且样品架无级变速旋转以保证膜层均匀性.基底平板玻璃经丙酮酒精混合溶液超声清洗,尺寸为100mm×100mm×3mm.溅射前真空室本底真6空4.5×10一Pa,溅射时Ar流量为32cm./min,真空为0.75Pa,功率100W,溅射时间60min,在此条件下分别讨论氧分压Po一0Pa不同温度以及100℃不同氧分压下薄膜的光电性能.2.2性能测试采用四探针测试仪在室温条件下测量所制备的ITO薄膜面电阻,日本岛津UV一3101PC分光光度计测量薄膜红外波段,可见光光谱.3结果与讨论3.1电性能分析口G一爱脚恒壤0b0l(IbU200250300衬底温度/℃图l不同温度下ITO薄膜面电阻图1,图2分别为氧分压Po一0Pa不同温度和温度100℃不同氧分压条件时面电阻与工艺的关系,从图中可以看出其他条件不变的情况下,薄膜的面电阻随温度的升高而降低,随氧分压的升高而升高,这是由于温度升高有利于薄膜结晶提高载流子浓度及迁移率,使薄膜面电阻降低;而氧分压升全国性建材科技期刊——《玻璃》2007年第3期总第192期高减少薄膜中的氧空位,使载流子浓度减少,面电阻升高.l一口a一蛊脚嚏餐教U.UU.1U.ZU.3U.4U.b氧分压/%图2不同氧分压下ITO薄膜面电阻3.2红外光谱分析同一ITO薄膜样品的透射和反射光谱线在红外区相交,交点处的波长为等离子体共振吸收波长(入.),这一光学现象可用Drude理论来解释口].根据Drude理论等离子体共振吸收波长可以表示为:2c(式中:N为介质载流子浓度,是电子的有效质量,入.为等离子体共振吸收波长.可以看出入...N一专,即随载流子浓度的增加等离子体共振吸收波长向短波方向移动.图3,图4分别为氧分压为0Pa不同温度和温度i00℃不同氧分压条件时ITO薄膜红外透射及反射光谱,可以看出等离子体共振吸收波长(入p) 在相同氧分压条件下随温度的升高向短波方向移动,相同温度下随氧分压升高向长波方向移动,根据Drude理论可知在相同氧分压条件下随温度的升高薄膜载流子浓度增加,相同温度下随氧分压升高载流子浓度降低,并且可以看出氧分压对载流子的影响更为明显,根据以上结果可以认为在仅仅升高温度的条件下并没有从根本上改变载流子的来源,而氧分压的增加使氧空位减少.3.3可见光谱分析由光学理论可知薄膜各界面反射光将引起干涉现象;由菲涅尔公式可知光在反射时将在界面发生位相改变;光从光疏介质入射到光密介质反射光将产生半波损失,而从光密介质到光疏介质时反射光线不存在半波损失;当薄膜的折射率小于基底折射率时将使膜系的反射率降低,薄膜折射率大于基底时将使膜系的反射率增高,因此在考虑垂直入射单层薄膜的情况下(.,分别为薄膜,基底的折射率),达到干涉极值时光程差的条件为:l\操巽褥操蜊10001500200025003000波长/nm图3不同温度下薄膜透射和反射光谱1008O褥6O操4O巽褥2O操蝌0波长/nm图4不同氧分压薄膜透射和反射光谱(1)当.&lt;入射光在空气一薄膜,薄膜一基底均发生半波损失.2n,d—时,反射率在入处取得最小值,透射率最大,R一(n~干--n0n2); 2n.一是时,反射率在入处取得最大值,透射率最小,为玻璃基底的透射率;(2).&gt;仅在空气一薄膜界面发生半波损失.2n一是时,反射率在入处取得在最小值,透射率最大,为玻璃基底的透射率;2n,d—时,反射率在入处取得最大值,R—f;\i1_no2志一l,2,3……(3)随着光学厚度.d的增加光谱曲线上出现的极值数将增加,也即是的取值范围变大;7全国性建材科技期刊——《玻璃》2007年第3期总第192期400500600700波长/nm图5ITO薄膜可见光波段透射光谱图5为功率100W,时间1h,氧分压为0Pa,的升高向长波方向移动,载流子浓度降低.(3)氧分压对薄膜面电阻,载流子浓度影响更为明显,主要是由于氧分压的提高将减少氧空位的数量,减少载流子来源使面电阻显着升高.(4)利用ITO薄膜可见光干涉现象可以计算薄膜折射率及膜层厚度.(5)在相同的条件下ITO薄膜的折射率随温度的升高而减小,透过率增加,光程差减小,干涉温度100℃条件下ITO可见光透射光谱,已知ITO峰向短波方向移动. 薄膜折射率大于玻璃折射率,利用透过率的极小值可以计算出薄膜在波长506nm折射率n一2.30,在波长670nm处折射率n一2.18,这是由于色散导致的随波长的增加折射率减小,从图中也可以看出薄膜的透过率平均值随波长的增加而增加.根据干涉条件对光程差的要求可知在波长506,670nm处k值分别取3,4,薄膜厚度为385nm.图6为功率100W,时间1h,氧分压为0Pa,不同温度下ITO薄膜可见光透射光谱,可以看出随温度升高薄膜透过率增加,干涉峰向短波方向移动,这说明薄膜折射率随温度升高而减小,透过率增加,并使光程差减小,使在相同的干涉级序下极值波长向短波移动.uu-,200"(2100"(2I^^————..L.,一,.,,,一,400450500550600650700750800波长/nm图6不同温度下ITO薄膜可见光波段透射光谱4结论(1)在相同工艺条件下ITO薄膜面电阻随温度的升高而减小,随氧分压的升高而增大.(2)相同工艺下,随着基底温度的升高,ITO薄膜等离子共振吸收波长向短波方向移动,载流子浓度增加;薄膜等离子共振吸收波长随溅射氧分压8参考文献[1]范志新.ITO薄膜载流子浓度的理论上限.现代显示, 2000,3:18~2ll[2]陶海华,姚宁,辛荣生等.ITO透明导电薄膜的制备及光电特性研究.郑州大学,2003,35(4):37~40.[3]HowsonRP,RidgeMI,BishopCA.Productionof transparentelectricallyconductingfilmsbyionplating [J].ThinSolidFilms,1981,80:137-140E4]ShantiE,DuttaV,BanerjeeA,eta1.Electricalandop—ticalpropertiesofundopedandantimony--dopedtinOX—idefilms[J].JApplPhys,1980,53:1619—1624[5]HaackeG.Newfigureofmeritfortransparentconduc—tors[J].JApplPhys,1976,47:4086 AnalysisofOpticalandElectricalProperties ofIToFilmsbyInfrared--VisibleSpectraYuGang,WangHui.LiuJing (ChinaBuildingMaterialAcademy,Beiiing100024)Abstract:Inthisarticleindium—tin—oxide(ITO) filmsweredepositedonglasssubstratesbyRF—magnetronsputtering.Thesheetresistanceandin—flared—visiblespectrawereinvestigatedusinga four—pointprobe,spectrophotometer.Inorderto investigatetheinfluencesoftheprocessparame—ters,thesheetresistance.carrierconcentration andrefractiveindexwereanalyzedbyspectrachar—acteristic.Itisdemonstratedthatthesheetresist—anceandrefractiveindexdecreasedwhilethecarri—erconcentrationandtransmittanceincreasedwith thesubstratetemperaturerises.Ontheother handthesheetresistanceincreasedandcarriercon—centrationdecreasedwiththeoxygenpartialpres—sureup—rises?Keywords:ITOfilm,Sheetresistance,Carrier concentration,Spectra∞∞∞∞∞0,瓣蒜魁瓣希缎。

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a rXiv:c ond-ma t/982046v14Fe b1998Electrical properties of a-antimony selenide SANJEEV GAUTAM ∗,D K SHUKLA,SHELLY JAIN and N GOYAL Centre of Advanced Study in Physics,Panjab University,Chandigarh -160014(India).(February 1,2008)This paper reports conduction mechanism in a-Sb 2Se 3over a wide range of temperature (238K to 338K)and frequency (5Hz to 100kHz).The d.c.conductivity measured as a function of temperature shows semiconducting behaviour with activation energy ∆E=0.42eV.Thermally induced changes in the electrical and dielectric properties of a-Sb 2Se 3have been examined.The a.c.conductivity in the material has been explained using modified CBH model.The band conduction and single polaron hopping is dominant above room temperature.However,in the lower temperature range the bipolaron hopping dominates.Keywords.Chalcogenides glasses;amorphous semiconductors;a.c.conductivity;electri-cal properties.PAC Nos 72-20;71-55I.INTRODUCTIONDuring the last few years amorphous semiconductors have been used in the manufac-ture of solar cells,batteries and phototransistors as well as in some steps of technological processing of very large scale integration (VLSI)microelectronics circuits [1].Thermally induced structural and electrical effects are known to be important in inducing the mem-ory phenomenon in semiconducting chalcogenide glasses [2]-[6].Alzewel et al.,[7,8]have studied the electrical conductivity of powdered antimony chalcogenides.Antimony alloyshave recieved great attention in the past due to semiconductivity of Sb concentration.It was reported by Mott and Devis[9]that the effect of Sb in Se is even greater than in Te in promoting crystallisation.Recently,study has been made on thin and thickfilms of the system Bi10Sb x Se90−x(x=35,40and45)[10].Crystalline Sb2Se3has been pre-pared and studied by several workers[11,12].Antimony triselenide(band gap∼1.2eV), [13]a p-type semiconductor having an orthorhombic D58structure with unit cell dimensions a=11.77±1,b=3.962±7,c=11.62±1A0[14]is used in preparation of recording optical laser disc and as an insulating material in MIS solar cells.The preparation and study of amorphous-Sb2Se3can throw light on the possible applications of this material in that form. Measurements of electrical properties of a-Sb2Se3are reported in this paper over a wide tem-perature and frequency range.Results indicate that electrical properties can be explained on the basis of widely accepted modified-Correlated Barrier Hopping(m-CBH)model for chalcogenide glasses.II.EXPERIMENTAL DETAILSIngots of glassy material Sb2Se3were prepared by melt quench method.The99.99%pure elements were sealed in an evacuated(1×10−6torr)quartz ampoule(12mm diameter and 160mm long).The ampoule was heated in a muffle furnace at the reaction temperature (630±30C for24hr).The composition(Sb:Se:1:1)of the glasses was determined by EDAX and amorphous nature was verified by X-ray diffraction pattern obtained using by X-ray diffractometer(Philips PW1130/60).The pellets of0.677cm diameter were prepared in the hydraulic press at a pressure of≈107P a.The measurements were carried out in a specially designed vacuum cell in the tempera-ture range233to313K and frequencies from6Hz to100kHz.A sophisticated computer controlled ac-impedance system(Model5206,EG&G,PARC USA)was used for the mea-surements[17].Polished samples with a thickness0.04-0.10cm and area0.36cm2were put in contact with aquadag(a conducting emulsion)in a sandwich configuration.The samplewas kept in vacuum in a copper sample holder ensuring no temperature gradient between the electrods and the sample.The effect of temperature is studied by using a closed cy-cle refrigerator(Model F-70,Julabo)was used to obtain different temperatures,which can maintain constant temperature within±1K for all the measurements.Ohmic contacts were confirmed through linear I-V characterstics in the voltage range.All electrical mea-surements of real and imaginary components of impedance parameters(Z′and Z′′)and real and imaginary component of admittance parameters(Y′and Y′′)were made over a wide range of temperature(233to313K)and frequency(6Hz to100kHz).III.RESULTS AND DISCUSSIONA.Dipolar behaviour of Sb2Se3Figure1shows the plot of lnσdc versus1000/T which was obtained using the expressionσdc=C′exp(−∆E/kT).(1)The plots in Fig.1are found to be linear over the temperature range studied.In the above expression C′=σ0exp(γ/k)andγis the temperature coefficient of the band gap.From thefigure,the activation energy∆E and C′for the sample are found to be0.43eV and 3.35×10−4Ω−1cm−1respectively.It has also been observed that∆E is constant for different pellets(thickness=0.04cm to0.08cm)with a statistical error of0.3%.The variation of log|Z|versus log f(Fig.2)indicates that the impedance is sensitive to frequency at lower temperatures and gradually becomes independent of frequency with increase in temperature.This type of behaviour indicates dominance of band conduction at higher temperatures.The sensitivity of Sb2Se3to temperature is shown in Fig.3.Thefigure gives the Nyquist plots(Z′versus Z′′)for Sb2Se3at different temperatures over the frequency range studied. The semicircular Nyquist plots indicate dipolar nature of the sample,which may be due to hopping back and forth of bipolarons between charged defects states(D+and D−)reported to be present in chalcogenides[14].The size of the Nyquist plots reduces with rise in temperature and regain their original size when temperature is increased.The Nyquist plots for Sb2Se3form a perfect arc of a semicircle with its centre lying considerably below the abscissa(i.e.,distribution parameterα>>0).Figure3also gives the value ofαcalculated at different temperatures.In dielectric materials,thefinite value of the distribution parameterαand a depressed arc are typical for a dipolar system involving multirelaxation processes[14]-[17].But the dependence ofαon temperature indicates that the mean position of the dipole is varying with variation in temperature.The dipolar nature of Sb2Se3is further confirmed by investigating the variation of capacitance with temperature at different frequencies.It is clear from Fig.4that in the lower temperature range the value of C is nearly constant and it increases with increase in temperature.However the rate of change of capacitance(i.e.,dC/dT)is higher for lower frequencies and decreases with increasing temperature.These results can be explained by the fact that thermally assisted hopping results in increasing the capacitance of the material.In other words,in the lower temperature range,the dipoles remain frozen and attain rotational freedom when the temperature is increased.Thus the relaxation effects are confirmed by the rate of increase in capacitance with frequency.The inversion of Nyquist plots in the admittance plane are shown in the Fig. 5.It is clear from thefigure that the angle of inclination is less thanπ/2.This type of behaviour has been explained on the basis of R-C network model(Fig.6),such that total impedance is given by[18]Y(ω)=B(iω)n+iωCα+G0=G0+B{cos(sπ/2)+i sin(sπ/2)}ωn+iωCα(2) Moreover,this angle(shown in Fig.5)is also temperature dependent.At lower temperatures (below273K)it is almost constant,while after a certain temperature(276-278K)it shows a sudden decrease,which implies a change in the conduction mechanism.B.CBH model for a-Sb2Se3The complex impedance plots show the dipolar multi-relaxation nature of a-Sb2Se3.This behaviour is explained by the R-C network model(Fig.6).However,this does not further elucidate the nature of conduction mechanism in this sample.Therefore a.c.conductivity σac(ω)at different temperatures is calculated.It is found that dispersion in the tempera-ture dependence ofσac(ω)curves increases at lower frequencies while it merges at higher frequencies(Fig.7).From the expressionσac(ω)=σtotal(ω)−σdc(3)the a.c.conductivity is obtained,whereσdc is given by Eqn.1and its behaviour is shown in the Fig.1.Theσtotal(ω)is measured directly from lock-in-analyser(Section II).Theσac(ω) dominates overσdc at lower temperatures,whileσdc dominates at higher temperatures(Fig.7).The modified Correlated Barrier Hopping(m-CBH)model explains the experimental re-sults reported in this paper.It states that bipolaron hopping between the charged defects states D+and D−is responsible for the a.c.conductivity in these semiconductors.Dipolar multi-relaxation behaviour of this sample is already indicated from the Nyquist plots de-scribed in the last subsection.So the charged defect states are expected to be present in a-Sb2Se3.According to CBH model a.c.conductivity is given by[19,20]nπ2NN pǫ′ωR6ωσac=(5)ǫ′[W m−kT ln(1/ωτ0)]where W m is the maximum barrier height andτ0is the characteristic relaxation time for the material.Figure7shows the variation of a.c.conductivity with temperature at different frequen-cies.It is evident from thefigure thatσac is very sensitive to temperature in the higher temperature regime.The low temperature a.c.conduction can be explained by considering bipolaron hopping between D+and D−centers whereas the higher temperature behaviour is due to thermally activated single polaron hopping.At higher temperatures a number of thermally generated D0centers are produced with a temperature dependent concentration [21]N0=N T exp(−U eff/2kT)(6)where N T is the concentration of D+or D−centers at T=0K.The defect concentration factor NN P in Eqn.4is replaced by:NN P=N2T/2(For bipolaron hopping)(7) NN P=N2T/2exp(−U eff/2kT)(For single polaron hopping)(8) Thus for single bipolaron hopping this factor is thermally activated and henceσac(ω)is also activated.According to CBH model[22]B=W m−W1+W2(9)where B is optical band gap,W m is the maximum band width and behaviour with frequency ωis asσac(ω)=Aωs(10)Here[[19]],d(lnσac)s=While W=W m for bipolaron hopping and W=W1or W2for single polaron hopping. Therefore,W m is estimated from the s values at lower temperatures.Values of W1,W2and U eff were estimated from the values of s at higher temperatures.These parameters are then fed to CBH model tofit the a.c.conductivity data calculated from the experiments.The behaviour of Eqn.11(s=1−6kT/W∗)can be seen in the Fig.8.This indicates that W∗follows W M for lower temperatures and W2for higher temperatures.Figure8also shows a sudden change in conduction mechanism at a certain temperature(276-278K).The similar behaviour is noticed in the admittance plots(Fig.5).The different parameters used for CBH model calculations are as followingFurther,the effect of temperature and frequency on the hopping length Rω,which is a measure of the effective length of a dipole can be studied using CBH model.The variation of Rωwith frequency at different temperature is shown in the Fig.9.Thefigure indicates that Rωis more sensitive to frequency in the high temperature regime and the sensitivity decreases with decreasing temperature.Thus at low temperature,Rωis constant with frequency,which implies a constant value of capacitance which is found to be true from the Fig.4.IV.CONCLUSIONNyquist plots or complex impedance studies confirm the dipolar nature of Sb2Se3and multi-relaxation behaviour as seen in most chalcogenide glasses.These plots also indicate that the capacitive nature dominates over the resistive nature of the sample at lower tem-perature(<273K),while the resistive nature is dominant at higher temperatures.The conduction mechanism has a sudden change from bipolaron to single polaron hopping(276-278K).The temperature and frequency dependence of a.c.conductivity is well explained by the m-CBH model.The contribution to a.c.conductivity from single polaron hopping is dominant at higher temperatures.AcknowledgementsThe authors are grateful to University Grant Commission for providing funds under COSIST and CAS programmes for purchase of measurement system which was essential for investigations reported in this paper.[14]W E Pearson in Handbook of Lattice Spacing and Crystal Structure of metals(PergamonPress,New York,1964)p.843.[15]Vohra A and Srivastva K K,Philos.Mag.61,201(1990).[16]Shukla R,Khurana P and Srivastva K K,J.Mat.Sci:Mat in electr;3,132(1992).[17]Navdeep Goyal,Parmana J.Phys.40,97(1993).[18]A K Jonscher in Dielectric relaxation in solids(Chelsea Dielectric Press,London,1983)p.90.[19]S R Elliott,Phil.Mag.36,1291(1977).[20]S R Elliott,Phil.Mag.B36,135(1977).[21]S R Elliott,Adv.Phys.36,135(1989).[22]K Shimakawa,Phil.Mag.46,123(1982).List of Figures1Variation ofσdc(Ω−1cm−1)with respect to1000/T(/K) (11)2Frequency dependence of log|Z|(Ω)over the entire temperature range studied.12 3Nyquist plots(Z′versus Z′′)at different temperatures.Variation of angle α=(1−s)π/2with respect to temperature (13)4Temperature variation of capacitance at different frequencies (14)5Admittance plots(Y′(Ω−1)versus Y′′(Ω−1).The variation of angleα=sπ/2 with temperature (15)6R-C Network model for lossy capacitance (16)7CBH Fitting-The variation ofσac(Ω−1cm−1)with respect to1000/T for experimental points and theoretical curves(m-CBH)at different frequencies.178Temperature dependence of s(=1−6kT/W∗)for theoretical curves(m-CBH) and experimental points (18)9Variation of Rω(A0)with respect to temperature(K)at different frequencies19FIG.1.Variation ofσdc(Ω−1cm−1)with respect to1000/T(/K).FIG.2.Frequency dependence of log|Z|(Ω)over the entire temperature range studied.with respect to temperature.FIG.4.Temperature variation of capacitance at different frequencies.temperature.FIG.6.R-C Network model for lossy capacitance.points and theoretical curves(m-CBH)at different frequencies.experimental points.FIG.9.Variation of Rω(A0)with respect to temperature(K)at different frequencies。

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