Mechanicalpropertiesandchargesignalcharacteristics
第三章 Mechanical Properties(材料的力学性能)
3 Mechanical Properties (1)—1 Introduction and Concepts of Stress and strain教学目的:了解材料力学性能在实际中的应用,掌握表征材料力学性能的参数,施加载荷的类型;了解拉伸试验和测试的标准样品;熟练掌握工程应力和应变的概念。
教学重点:材料的工程应力和应变。
教学难点:剪切和扭转测试。
教学方法:多媒体和板书相结合。
学时分配:3.1 Introduction 30 min3.2 Concepts of stress and strain3.2.1 Tension tests 30 min3.2.2 Compression tests 10 min3.2.3 Shear and torsional tests 20 min教学过程与内容:3.1 Introduction回顾:性能与结构,性能与加工、制备间的关系。
Many materials, when in service, are subjected to forces or loads; examples include the aluminum alloy from which an airplane wing is constructed and the steel in an automobile axle. In such situations it is necessary to know the characteristics of the material and to design the member from which it is made such that any resulting deformation will not be excessive and fracture will not occur. The mechanical behavior of a material reflects the relationship between its response or deformation to an applied load or force. Important mechanical properties are strength, hardness, ductility, and stiffness.The mechanical properties of materials are ascertained by performing carefully designed laboratory experiments that replicate as nearly as possible the service conditions. Factors to be considered include the nature of the applied load and its duration, as well as the environmental conditions. It is possible for the load to be tensile, compressive, or shear, and its magnitude may be constant with time, or it may fluctuate continuously. Application time may be only a fraction of a second, or it may extend over a period of many years. Service temperature may be an importantfactor.Mechanical properties are of concern to a variety of parties (e.g., producers and consumers of materials, research organizations, and government agencies) that have differing interests. Consequently, it is imperative that there be some consistency in the manner in which tests are conducted, and in the interpretation of their results. This consistency is accomplished by using standardized testing techniques. Establishment and publication of these standards are often coordinated by professional societies.The role of structural engineers is to determine stresses and stress distributions within members that are subjected to well-defined loads. This may be accomplished by experimental testing techniques and/or by theoretical and mathematical stress analyses. These topics are treated in traditional stress analysis and strength of materials texts.Materials and metallurgical engineers, on the other hand, are concerned with producing and fabricating materials to meet service requirements as predicted by these stress analyses. This necessarily involves an understanding of the relationships between the microstructure (i.e., internal features) of materials and their mechanical properties.Materials are frequently chosen for structural applications because they have desirable combinations of mechanical characteristics. This chapter discusses the stress–strain behaviors of metals, ceramics, and polymers and the related mechanical properties; it also examines their other important mechanical characteristics.3.2 Concepts of stress and strainIf a load is static or changes relatively slowly with time and is applied uniformly over a cross section or surface of a member, the mechanical behavior may be ascertained by a simple stress–strain test; these are most commonly conducted for metals at room temperature. There are three principal ways in which a load may be applied: namely, tension, compression, and shear (Figures 3.1 a, b, c). In engineering practice many loads are torsional rather than pure shear; this type of loading is illustrated in Figure 3.1 d.Figure 3.13.2.1 Tension testsOne of the most common mechanical stress–strain tests is performed in tension. As will be seen, the tension test can be used to ascertain several mechanical properties of materials that are important in design. A specimen is deformed, usually to fracture, with a gradually increasing tensile load that is applied uniaxially along the long axis of a specimen. A standard tensile specimen is shown in Figure 3.2. Normally, the cross section is circular, but rectangular specimens are also used. During testing, deformation is confined to the narrow center region, which has a uniform cross section along its length. The standard diameter is approximately 12.8 mm, whereas the reduced section length should be at least four times this diameter; 60 mm is common. Gauge length is used in ductility computations; the standard value is 50 mm. The specimen is mounted by its ends into the holding grips of the testing apparatus. The tensile testing machine is designed to elongate the specimen at a constant rate, and to continuously and simultaneously measure the instantaneous applied load and the resulting elongations. A stress–strain test typically takes several minutes to perform and is destructive; that is, the test specimen is permanently deformed and usually fractured.Figure 3.2To minimize these geometrical factors, load and elongation are normalized to the respective parameters of engineering stress and engineering strain. Engineering stress σ is defined by the relationshipA F =σ (3.1) in which F is the instantaneous load applied perpendicular to the specimen cross section, in units of newtons (N), and A 0 is the original crosssectional area before any load is applied (m 2). The units of engineering stress are megapascals, MPa (SI).Engineering strain ε is defined according to00l l l l l i ∆=-=ε (3.2) in which l 0 is the original length before any load is applied, and l i is the instantaneous length. Sometimes the quantity l i - l 0 is denoted as Δl , and is the deformation elongation or change in length at some instant, as referenced to the original length. Engineering strain (subsequently called just strain) is unitless, but meters per meter or inches per inch are often used; the value of strain is obviously independent of the unit system.3.2.2 Compression testsCompression stress –strain tests may be conducted if in-service forces are of this type. A compression test is conducted in a manner similar to the tensile test, except that the force is compressive and the specimen contracts along the direction of the stress. Equations 3.1 and 3.2 are utilized to compute compressive stress and strain, respectively. By convention, a compressive force is taken to be negative, which yields a negative stress. Furthermore, since l 0 is greater than l i , compressive strains computed from Equation 3.2 are necessarily also negative. Tensile tests are more common because they are easier to perform; also, for most materials used in structural applications, very little additional information is obtained from compressive tests. Compressive tests are used when a material’s behavior under large and permanent (i.e., plastic) strains is desired, as in manufacturing applications, or when the material is brittle in tension.3.2.3 shear and torsional testsFor tests performed using a pure shear force as shown in Figure 3.1c, the shearstress τ is computed according toA F =τ (3.3) where F is the load or force imposed parallel to the upper and lower faces, each of which has an area of A 0 . The shear strain γ is defined as the tangent of the strain angle θ, as indicated in the figure. The units for shear stress and strain are the same as for their tensile counterparts. Torsion is a variation of pure shear, wherein a structural member is twisted in the manner of Figure 3.1d; torsional forces produce a rotational motion about the longitudinal axis of one end of the member relative to the other end. Examples of torsion are found for machine axles and drive shafts, and also for twist drills. Torsional tests are normally performed on cylindrical solid shafts or tubes. A shear stress τ is a function of the applied torque T , whereas shear strain γ is related to the angle of twist, ф in Figure 3.1d.Brief Summary总结本节讲的主要内容,及其重点。
机械毕业设计英文外文翻译论述压痕测试法和原子力显微镜的SI可跟踪力计量学
机械毕业设计英文外文翻译论述压痕测试法和原子力显微镜的SI可跟踪力计量学The SI traceable force metrology of indentations test method and atomic force microscope machiningIntroduction:The SI traceable force metrology is an important aspect in the field of mechanical engineering. The measurement of forces accurately and precisely is critical in various applications, such as materials testing, quality control, and design analysis. This paper aims to discuss the indentations test method and atomic force microscope (AFM) machining, which are two techniques used in SI traceable force metrology.Indentations Test Method:Indentations test method is a widely used technique for measuring the mechanical properties of materials. It involves applying a known force on the surface of a material and measuring the resulting indentation depth or hardness. In order to ensure the accuracy and reliability of the measurements, itis essential to have a SI traceable force calibration. The force calibration is typically done using a certified force standard, such as a deadweight machine or a force transducer, which provides SI traceable force values. The force applied during the indentation test is then traceable to the SI unit of force, the newton (N).Atomic Force Microscope (AFM) Machining:AFM is a powerful tool used for imaging and manipulating materials at the nanoscale. It operates by scanning a sharp probe over the surface of a material, while measuring the forces between the probe and the surface. The forces can be measured using a variety of techniques, including optical interferometry, piezoresistive sensors, and capacitive sensors. In order to achieve SI traceability in AFM force measurements, it is necessary to calibrate the AFM system using a SI traceable force standard.The AFM machining is particularly useful for measuring forces at the nanoscale. It allows for the precise control and manipulation of materials, enabling the fabrication ofstructures with nanoscale features. The force measurements obtained from AFM can be used to characterize the mechanical properties of materials, such as the elastic modulus, adhesion strength, and friction coefficient. Furthermore, AFM can be used for force spectroscopy, which involves mapping the force-distance relationship between the probe and the surface.Conclusion:In conclusion, the SI traceable force metrology is essential for accurate and reliable force measurements in mechanical engineering. The indentations test method and AFM machining are both techniques that can be used for SI traceable forcemeasurements. The indentations test method is a non-destructive technique that can be used on a wide range of materials, while AFM machining allows for precise measurements at the nanoscale. Both techniques require the calibration of force standards to ensure SI traceability.。
试验机常用英语词汇整理
1 摆锤冲击刀刃pendulum striking edge2 摆锤冲击速度impact velocity of the pendulum3 摆锤空击free swing of pendulum4 摆锤力矩moment of pendulum5 摆锤式冲击试验机pendulum impact testing machine6 摆动周期swing period7 摆杆rod of pendulum8 摆轴axle of rotation9 半自动试验机semi-automatic testing machine10 杯突试验机cupping testing machine11 变形速率rate of deformation12 标称值nominal value13 标度盘(尺)dial(scale)14 标度盘几何中心geometric centre of the dial15 标距gauge length16 标准测力仪standard dynamometer17 标准扭矩仪standard torquemeter18 标准硬度机standard hardness tester19 表面洛氏硬度计Rockwell superficial hardness tester20 表面洛氏硬度值Rockwell superficial hardness number21 布氏硬度计Brinell hardness tester22 布氏硬度压头Brinell hardness indenter23 布氏硬度值Brinell hardness number24 材料工艺性能material processibility25 材料试验机material testing machine26 测力系统dynamometric system27 测量measurement28 测量重复性repeatability of measurement29 测量再(复)现性reproducibility of measurement30 测量范围measuring range31 [测量范围]上限值[measuring range] higher limit32 [测量范围]下限值[measuring range] lower limit33 超声硬度计ultrasonic hardness tester34 超试验力over test force35 程序控制试验机program-controlled testing machine36 持久强度creep rupture strength37 持久强度试验机creep rupture strength testing machine38 冲击摆锤impact pendulum39 冲击锤体impact hammer40 冲击韧性impact toughness41 冲击试验机impact testing machine42 冲击试验支座impact specimen support43 冲击试样支座跨距span of impact specimen supports44 冲击能量impact energy45 从动针follow-up pointer46 初试验力initial test force47 传感器transducer48 锤式布氏硬度计hammering type Brinell hardness tester49 打击点striking point50 打击中心center of strike51 低频疲劳试验机low frequency fatigue testing machine52 低温试验机low temperature testing machine53 低温装置low temperature device54 颠簸实验bump test55 点漂point drift56 电液伺服疲劳试验机electro-hydraulic servo-controlled fatigue testing machine57 电子式试验机electronic testing machine58 动静万能试验机static/dynamic universal testing machine59 动蠕变dynamic creep60 动态[试验]力dynamic [test] force61 断后标距final gauge length62 断后伸长率percentage elongation after fracture63 断裂韧性fracture toughness64 断面收缩率percentage reduction of area65 断面增大率percentage increase of area66 多次冲击试验机repeated impact testing machine67 反向器reverser68 非金属材料试验机non-metallic material testing machine69 分度值division value70 复合试验机combined test force testing machine71 腐蚀试验机corrosion testing machine72 高频疲劳试验机high frequency fatigue testing machine73 高温试验机high temperature testing machine74 高温装置high temperature device75 隔热屏radial beat shield76 工程应力engineering stress77 工艺性能试验processibility test78 规定残余伸长应力permanent set stress79 规定非比例伸长(压缩)应力proof stress of non-proportional elongation(compression)80 规定总伸长(压缩)应力proof stress of total elongation(compression)81 横梁cross-beam82 横应变transverse strain83 缓冲器buffer84 机械式试验机mechanical testing machine85 记录装置recorder86 加热元件heating element87 夹头grip88 剪切强度shear strength90 金属材料试验机metallic material testing machine91 [静]蠕变[static]creep92 静态[试验]力static [test] force93 径向间隙radial clearance94 均热带长度uniform temperature zone length95 空试验力no test force96 拉杆pull rod97 拉力试验机tensile testing machine98 拉伸强度tensile strength99 [试验]力[test] force100 力标准机force standard machine101 力传感器force transducer102 力基准机primary force standard machine103 力学性能mechanical properties104 力学性能试验mechanical test105 量程measuring span106 灵敏度sensitivity107 洛氏硬度值Rockwell hardness number108 洛氏硬度计Rockwell hardness tester109 洛氏硬度压头Rockwell hardness indenter110 落锤式冲击试验机falling impact testing machine 111 满量程误差full scale error112 磨损abrasion113 摩擦磨损试验机friction-abrasion testing machine 114 内力internal force115 能量损失energy loss116 粘弹性viscoelasticity117 扭矩标准机standard torquer118 扭矩基准机primary standard torquer119 扭应变torsional strain120 扭应力torsional stress121 扭转试验机torsion testing machine122 努氏硬度压头Knoop hardness indenter123 努氏硬度值Knoop hardness number124 挠度deflection125 疲劳fatigue126 疲劳断裂fatigue fracture127 疲劳极限fatigue limit128 疲劳试验机fatigue testing machine129 疲劳寿命fatigue life130 漂移drift131 平均试验力mean test force132 平均应变mean strain134 平面应变断裂韧度plane-strain fracture toughness135 钳口jaw136 强度strength137 切应变shear strain138 屈服点yield point139 蠕变强度creep strength140 蠕变试验机creep testing machine141 蠕变速度rate of creep142 热疲劳试验机thermal fatigue testing machine143 上屈服点upper yield point144 邵氏硬度计Shore durometer145 邵氏硬度值Shore durometer number146 始点漂移zero drift147 示波冲击试验机impact testing machine with the scope148 示值indicating value149 示值重复性误差repeatability error in the indicating value150 示值重复性相对误差relative error of repeatability in the indicating value151 示值进回程误差error between forward and backward in indicating value152 示值进回程相对误差relative error between forward and backward in indicating value 153 示值误差indicating value154 示值相对误差relative error of indicating value155 试件sample156 试台testing bench157 试验机附件accessories of testing machine158 试验空间test space159 [试验]力[test] force160 试验力保持时间duration of test force161 试验力范围range of test force162 试验力幅test force amplitude163 试验力施加速度rate of applying test force164 试验力施加系统system of applying test force165 试验系统的柔度testing system flexibility166 试样specimen167 松弛relaxation168 松弛试验机relaxation testing machine169 松弛应力relaxation stress170 塑性plasticity171 塑性变形plastic deformation172 算术平均值arithmetic mean173 缩短率percentage reduction of length174 弹簧试验机spring testing machine175 弹性elasticity176 弹性变形elastic deformation177 弹性模量modulus of elasticity178 弹性滞后elastic hysteresis179 条件疲劳极限conditional fatigue limit180 同轴度coaxiality181 弯曲强度bending strength182 弯折试验机reverse bend tester183 万能试验机universal testing machine184 温度波动variation in testing temperature 185 温度范围temperature range186 温度控制器temperature control equipment 187 温度梯度temperature gradient188 维氏硬度计Vickers hardness tester189 维氏硬度压头Vickers hardness indenter 190 维氏硬度值Vickers hardness number191 位移传感器displacement transducer192 下屈服点lower yield point193 线材扭转试验机wire torsion tester194 线性应变linear strain195 肖氏硬度计Shore hardness tester196 肖氏硬度压头Shore hardness indenter 197 肖氏硬度值Shore hardness number198 携带式硬度计portable hardness tester 199 循环[试验]力cyclic [test]force200 循环应变cyclic strain201 循环应力cyclic stress202 压板compression plate203 压力试验机compression testing machine 204 压缩强度compressive strength205 压头主轴main axle of indenter206 引伸计extensometer207 引伸计标距extensometer gauge length 208 应变strain209 应变范围range of strain210 应变幅strain amplitude211 应力stress212 应力比stress ratio213 应力范围range of stress214 应力幅stress amplitude215 应力强度因子stress intensity factor216 应力—应变图stress-strain diagram217 硬度hardness218 硬度计hardness tester219 硬度压头hardness indenter220 液压式试验机hydraulic testing machine221 原始标距original gauge length222 约定真值conventional true value223 运输包装件试验机transport packages testing machine224 赵氏硬度计Pusey and Jones indentation instrument225 赵氏硬度值Pusey and Jones indentation hardness number 226 真应力true stress227 真值true value228 正应力normal stress229 指示装置indicating device230 指针pointer231 轴向间隙axial clearance232 轴应变axial strain233 最大[试验]力maximum [test]force234 最大循环[试验]力maximum cyclic [test]force235 最大循环应力maximum cyclic stress236 最大应变maximum strain237 最小[试验]力minimum [test] force238 最小循环[试验]力minimum cyclic [test] force239 最小循环应力minimum cyclic stress240 最小应变minimum strain241 准确度accuracy242 准确度等级accuracy class243 自动试验机automatic testing machine244 总试验力total test force。
半导体一些术语的中英文对照
半导体一些术语的中英文对照离子注入机ion implanterLSS理论Lindhand Scharff and Schiott theory 又称“林汉德—斯卡夫—斯高特理论”。
沟道效应channeling effect射程分布range distribution深度分布depth distribution投影射程projected range阻止距离stopping distance阻止本领stopping power标准阻止截面standard stopping cross section退火annealing激活能activation energy等温退火isothermal annealing激光退火laser annealing应力感生缺陷stress-induced defect择优取向preferred orientation制版工艺mask-making technology图形畸变pattern distortion初缩first minification精缩final minification母版master mask铬版chromium plate干版dry plate乳胶版emulsion plate透明版see-through plate高分辨率版high resolution plate,HRP超微粒干版plate for ultra—microminiaturization 掩模mask掩模对准mask alignment对准精度alignment precision光刻胶photoresist又称“光致抗蚀剂”。
负性光刻胶negative photoresist正性光刻胶positive photoresist无机光刻胶inorganic resist多层光刻胶multilevel resist电子束光刻胶electron beam resistX射线光刻胶X—ray resist刷洗scrubbing甩胶spinning涂胶photoresist coating后烘postbaking光刻photolithographyX射线光刻X-ray lithography电子束光刻electron beam lithography离子束光刻ion beam lithography深紫外光刻deep—UV lithography光刻机mask aligner投影光刻机projection mask aligner曝光exposure接触式曝光法contact exposure method接近式曝光法proximity exposure method光学投影曝光法optical projection exposure method 电子束曝光系统electron beam exposure system分步重复系统step-and—repeat system显影development线宽linewidth去胶stripping of photoresist氧化去胶removing of photoresist by oxidation等离子[体]去胶removing of photoresist by plasma 刻蚀etching干法刻蚀dry etching反应离子刻蚀reactive ion etching,RIE各向同性刻蚀isotropic etching各向异性刻蚀anisotropic etching反应溅射刻蚀reactive sputter etching离子铣ion beam milling又称“离子磨削”。
Murata LQW03AW_00系列芯片电容器(芯片导纳)参考规格书说明书
CHIP COILS (CHIP INDUCTORS) LQW03AW□□□□00□ REFERENCE SPECIFICATION1. ScopeThis reference specification applies to chip coils (chip inductors) LQW03AW_00 series for general electronic equipment.2. Part Numbering(Ex.)LQ W 03 A W 5N4 J 0 0 DProductID Structure Dimension(L × W)ApplicationandcharacteristicCategory Inductance Tolerance Performance ElectrodespecificationPackagingD: taping*B: bulk*B: Bulk packing is also available (taping condition: however, products without reels are put in plastic bags).3. Part Number and RatingOperating temperature range -55°C to +125°C (including self-generated heat)Storage temperature range -55°C to +125°CCustomer Part numberMurataPart numberInductance Q(900 MHz)(Typicalvalue)DCresistance(Ω max.)Self-resonantfrequency(GHz min.)Ratedcurrent(mA) Nominalvalue(nH)ToleranceLQW03AW1N0C00D1.0C:±0.2nH 48 0.03 19.0 900 LQW03AW1N1C00D1.1C:±0.2nH 41 0.06 19.0 660 LQW03AW1N7C00D1.7C:±0.2nH 41 0.07 19.0 600 LQW03AW1N8C00D1.8C:±0.2nH 37 0.10 19.0 520 LQW03AW1N9C00D1.9C:±0.2nH 41 0.08 19.0 620 LQW03AW2N0C00D2.0C:±0.2nH 42 0.10 19.0 490 LQW03AW2N1C00D2.1C:±0.2nH 35 0.16 19.0 400 LQW03AW2N2C00D2.2C:±0.2nH 33 0.16 19.0 400 LQW03AW2N7C00D2.7C:±0.2nH 46 0.06 15.0 720 LQW03AW2N8C00D2.8C:±0.2nH 44 0.08 14.0 600 LQW03AW2N9C00D2.9C:±0.2nH 41 0.10 13.0 540 LQW03AW3N0C00D3.0C:±0.2nH 34 0.22 14.0 350 LQW03AW3N1C00D3.1C:±0.2nH 48 0.07 12.0 720 LQW03AW3N2C00D3.2C:±0.2nH 48 0.08 10.0 580 LQW03AW3N3C00D3.3C:±0.2nH 47 0.11 11.0 520 LQW03AW3N4C00D3.4C:±0.2nH 43 0.15 11.0 440 LQW03AW3N5C00D3.5C:±0.2nH 43 0.15 12.0 440 LQW03AW3N6C00D3.6C:±0.2nH 36 0.23 11.0 340 LQW03AW3N7C00D3.7C:±0.2nH 38 0.23 11.0 340 LQW03AW3N9C00D3.9C:±0.2nH 48 0.07 11.0 650 LQW03AW4N3J00D4.3 J:±5% 45 0.12 11.0 480 LQW03AW4N7J00D4.7 J:±5% 45 0.09 9.5 620 LQW03AW5N1J00D5.1 J:±5% 45 0.14 9.5 480 LQW03AW5N4J00D5.4 J:±5% 46 0.21 9.5 420 LQW03AW5N6J00D5.6 J:±5% 37 0.33 8.3 330 LQW03AW5N8J00D5.8 J:±5% 47 0.16 8.8 460 LQW03AW6N2J00D6.2 J:±5% 39 0.22 9.9 360 LQW03AW6N8J00D6.8 J:±5% 42 0.18 7.7 460 LQW03AW7N5J00D7.5 J:±5% 41 0.24 7.5 400 LQW03AW8N2J00D8.2 J:±5% 40 0.26 8.5 290Customer Part numberMurataPart numberInductance Q(900 MHz)(Typicalvalue)DCresistance(Ω max.)Self-resonantfrequency(GHz min.)Ratedcurrent(mA)Nominalvalue(nH)ToleranceLQW03AW8N7J00D8.7J:±5% 39 0.42 7.5 290 LQW03AW9N1J00D9.1J:±5% 46 0.22 6.4 460 LQW03AW10NJ00D10.0J:±5% 37 0.46 7.2 250 LQW03AW11NJ00D11.0J:±5% 37 0.47 7.0 260 LQW03AW12NJ00D12.5J:±5% 39 0.54 6.0 280 LQW03AW13NJ00D13.0J:±5% 39 0.54 5.9 280 LQW03AW14NJ00D13.5J:±5% 37 0.53 6.0 240 LQW03AW15NJ00D15.5J:±5% 38 0.60 5.7 230 4. Testing ConditionsUnless otherwise specified Temperature: ordinary temperature (15°C to 35°C)Humidity: ordinary humidity [25% to 85% (RH)]In case of doubt Temperature: 20°C±2°CHumidity: 60% to 70% (RH)Atmospheric pressure: 86 kPa to 106 kPa5. Appearance and DimensionsUnit mass (typical value): 0.23 mg6. MarkingNo marking.7. Electrical PerformanceNo.ItemSpecificationTest method7.1 InductanceMeet chapter 3 ratings.Measuring equipment: Keysight E4991A or the equivalentMeasuring frequency: Inductance 250 MHz 1.0 nH to 3.9 nH 100 MHz 4.3 nH to 15.5 nH Measuring conditions:Measurement signal level: Approx. 0 dBm Measurement terminal distance: 0.3 mm Electrical length: 10.0 mmMeasuring fixture: Keysight 16197APosition the chip coil under test as shown in the measuring example below and connect it to the electrode by applying weight. Measurement example:Measuring method: see "Electrical performance: Measuring method for inductance/Q" in the chapter"16. Appendix".7.2 QMeet chapter 3 ratings.7.3 DC resistance Meet chapter 3 ratings. Measuring equipment: digital multimeter 7.4 Self-resonantfrequency Meet chapter 3 ratings.Measuring equipment: Keysight N5230A or theequivalent7.5 Rated currentProduct temperature rise: 20°C max.Apply the rated current specified in chapter 3.8. Mechanical PerformanceNo.ItemSpecificationTest method8.1 Bending testNo significant mechanical damage or no sign of electrode peeling off shall be observed. Test substrate: glass-epoxy substrate (100 mm × 40 mm × 0.8 mm) Pressurizing speed: 1 mm/sDeflection: 2 mm Holding time: 5 s8.2 VibrationAppearance shall have no significant mechanical damage.Oscillation frequency: 10 Hz to 55 Hz to 10 Hz, for approx. 1 minTotal amplitude: 1.5 mmTest time: 3 directions perpendicular to each other, 2 h for each direction (6 h in total)No.ItemSpecificationTest method8.3 Solderability90% or more of the outer electrode shall be covered with new solder seamlessly. Flux: immersed in ethanol solution [including anactivator with a chlorine conversion value of 0.06(wt)%]with a rosin content of 25(wt)% for 5 s to 10 s. Solder: Sn-3.0Ag-0.5Cu solderPre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 240°C±5°C Immersion time: 4 s±1 s 8.4 Resistance tosoldering heatAppearance: No significant mechanical damage shall be observed.Inductance change rate: within ±5%Flux: immersed in ethanol solution [including anactivator with a chlorine conversion value of 0.06(wt)%] with a rosin content of 25(wt)% for 5 s to 10 s. Solder: Sn-3.0Ag-0.5Cu solderPre-heating: 150°C±10°C/60 s to 90 s Solder temperature: 270°C±5°C Immersion time: 5 s±1 sPost-treatment: left at a room condition for 24 h±2 h9. Environmental PerformanceThe product is soldered on a substrate for test. No. Item Specification Test method9.1 Heat resistanceAppearance: No significant mechanicaldamage shall be observed.Inductance change rate: within ±5%Q change rate: within ±20%Temperature: 125°C±2°CTest time: 1000 h (+48 h, -0 h)Post-treatment: left at a room condition for 24 h±2 h 9.2 Cold resistanceAppearance: No significant mechanical damage shall be observed.Inductance change rate: within ±5% Q change rate: within ±20%Temperature: -55°C±2°CTest time: 1000 h (+48 h, -0 h)Post-treatment: left at a room condition for 24 h±2 h9.3 HumidityAppearance: No significant mechanical damage shall be observed.Inductance change rate: within ±5% Q change rate: within ±20%Temperature: 70°C±2°CHumidity: 90% (RH) to 95% (RH) Test time: 1000 h (+48 h, -0 h)Post-treatment: left at a room condition for 24 h±2 h 9.4 Temperature cycle Appearance: No significant mechanicaldamage shall be observed.Inductance change rate: within ±5% Q change rate: within ±20%Single cycle conditions:Step 1: -55°C±2°C/30 min±3 minStep 2: ordinary temperature/10 min to 15 min Step 3: +125°C±2°C/30 min±3 minStep 4: ordinary temperature/10 min to 15 min Number of testing: 10 cyclesPost-treatment: left at a room condition for 24 h±2 h10. Specification of Packaging10.1 Appearance and dimensions of tape (8 mm width/paper tape)A (0.52)B (0.65) t 0.75 max.(in mm)10.2 Taping specificationsPacking quantity (Standard quantity) 10000 pcs/reelPacking method The products are placed in embossed cavities of a base tape and sealed by a cover tape.Feed hole position The feed holes on the base tape are on the right side when the cover tape is pulled toward the user. JointThe base tape and the cover tape are seamless.Number of missing productsNumber of missing products within 0.025% of the number per reel or 1 pc., whichever is greater, and are not continuous. The specified quantity per reel is kept.10.3 Break down force of tapeBreak down force of cover tape5 N min.10.4 Peeling off force of cover tapeSpeed of peeling off 300 mm/minPeeling off force0.1 N to 0.6 N (The lower limit is for typical value.)10.5 Dimensions of leader section, trailer section and reelA vacant section is provided in the leader (start) section and trailer (end) section of the tape for the product. The leader section is further provided with an area consisting only of the cover tape (or top tape). (See the diagram below.)10.6 Marking for reelCustomer part number, Murata part number, inspection number (*1), RoHS marking (*2), quantity, etc. *1 Expression of inspection No.: □□ ○○○○(1) (2) (3)(1) Factory code(2) Date First digit: year/last digit of yearSecond digit: month/Jan. to Sep.→1 to 9, Oct. to Dec.→O, N, D Third, Fourth digit: day (3) Serial No.*2 Expression of RoHS marking: ROHS- Y ( ) (1) (2)(1) RoHS regulation conformity(2) Murata classification number10.7 Marking on outer box (corrugated box)Customer name, purchasing order number, customer part number, Murata part number, RoHS marking (*2), quantity, etc.FCover tapetape165°to 180゜10.8 Specification of outer boxDimensions of outer box(mm) Standard reel quantity in outer box (reel)WDH186 186 935* Above outer box size is typical. It depends on a quantity of an order.11. Caution11.1 Restricted applicationsPlease contact us before using our products for the applications listed below which require especially high reliability for the prevention of defects which might directly cause damage to the third party's life, body or property. (1) Aircraft equipment (2) Aerospace equipment (3) Undersea equipment (4) Power plant controlequipment(5) Medical equipment (6) Transportation equipment (vehicles, trains, ships, etc.) (7) Traffic signal equipment (8) Disaster/crimeprevention equipment(9) Data-processing equipment (10) Applications of similar complexity and/or reliability requirements to the applications listed in the above11.2 Precautions on ratingAvoid using in exceeded the rated temperature range, rated voltage, or rated current.Usage when the ratings are exceeded could lead to wire breakage, burning, or other serious fault.11.3 Inrush currentIf an inrush current (or pulse current or rush current) that significantly exceeds the rated current is applied to the product, overheating could occur, resulting in wire breakage, burning, or other serious fault.11.4 Corrosive gasPlease refrain from use since contact with environments with corrosive gases (sulfur gas [hydrogen sulfide, sulfur dioxide, etc.], chlorine, ammonia, etc.) or oils (cutting oil, silicone oil, etc.) that have come into contact with the previously stated corrosive gas environment will result in deterioration of product quality or an open from deterioration due to corrosion of product electrode, etc. We will not bear any responsibility for use under these environments.12. Precautions for UseThis product is for use only with reflow soldering. It is designed to be mounted by soldering. If you want to use other mounting method, for example, using a conductive adhesive, please consult us beforehand.Also, if repeatedly subjected to temperature cycles or other thermal stress, due to the difference in the coefficient of thermal expansion with the mounting substrate, the solder (solder fillet part) in the mounting part may crack.The occurrence of cracks due to thermal stress is affected by the size of the land where mounted, the solder volume, and the heat dissipation of the mounting substrate. Carefully design it when a large change in ambient temperature is assumed.12.1 Land dimensionsThe following diagram shows the recommended land dimensions for reflow soldering.The land dimensions are designed in consideration of electrical characteristics and mountability. Use of other landdimensions may preclude achievement of performance. In some cases, it may result in poor solderability, including positional shift. If you use other land pattern, consider it adequately.a 0.23b 0.65c 0.4(in mm)WDLabelH12.2 Flux and solder usedFlux• Use a rosin-based flux that includes an activator with a chlorine conversion value of 0.06(wt)% to 0.1(wt)%. • Do not use a highly acidic flux with a halide content exceeding 0.2(wt)% (chlorine conversion value). • Do not use a water-soluble flux.Solder• Use Sn-3.0Ag-0.5Cu solder.• Standard thickness of solder paste: 80 μm to 100 μmIf you want to use a flux other than the above, please consult our technical department.12.3 Soldering conditions (reflow)• Pre-heating should be in such a way that the temperature difference between solder and product surface is limited to 150°C max.Cooling into solvent after soldering also should be in such a way that the temperature difference is limited to 100°C max. Insufficient pre-heating may cause cracks on the product, resulting in the deterioration of product quality. • Standard soldering profile and the limit soldering profile is as follows.The excessive limit soldering conditions may cause leaching of the electrode and/or resulting in the deterioration of product quality.Standard profile Limit profilePre-heating 150°C to 180°C/90 s±30 s 150°C to 180°C/90 s±30 s HeatingAbove 220°C/30 s to 60 sAbove 230°C/60 s max.Peak temperature 245°C±3°C 260°C/10 s Number of reflow cycles2 times2 times12.4 Reworking with soldering ironDo not perform reworking with a soldering iron on this product.12.5 Solder volumeSolder shall be used not to increase the volume too much.An increased solder volume increases mechanical stress on the product. Exceeding solder volume may cause the failure of mechanical or electrical performance.Limit ProfileStandard Profile90s±30s230℃260℃245℃±3℃220℃30s~60s60s max.180150Temp.(s)(℃)Time.12.6 Product's locationThe following shall be considered when designing and laying out PCBs.(1) PCB shall be designed so that products are not subject to mechanical stress due to warping the board. [Products direction]Products shall be located in the sideways direction (length: a < b) to the mechanical stress.(2) Components location on PCB separationIt is effective to implement the following measures, to reduce stress in separating the board.It is best to implement all of the following three measures; however, implement as many measures as possible to reduce stress.Contents of measures Stress level(1) Turn the mounting direction of the component parallel to theboard separation surface.A > D *1 (2) Add slits in the board separation part.A >B (3) Keep the mounting position of the component away from the board separation surface.A > C*1 A > D is valid when stress is added vertically to the perforation as with hand separation. If a cutting disc is used, stress will be diagonal to the PCB, therefore A > D is invalid.(3) Mounting components near screw holesWhen a component is mounted near a screw hole, it may be affected by the board deflection that occurs during the tightening of the screw.Mount the component in a position as far away from the screw holes as possible.12.7 Handling of substrateAfter mounting products on a substrate, do not apply any stress to the product caused by bending or twisting to the substrate when cropping the substrate, inserting and removing a connector from the substrate or tightening screw to the substrate. Excessive mechanical stress may cause cracking in the product.Bending Twisting〈Poor example 〉〈Good example〉ba12.8 CleaningThe product shall be cleaned under the following conditions.(1) The cleaning temperature shall be 60°C max. If isopropyl alcohol (IPA) is used, the cleaning temperature shall be 40°Cmax.(2) Perform ultrasonic cleaning under the following conditions. Exercise caution to prevent resonance phenomenon inmounted products and the PCB.Item RequirementPower 20 W/L max.Time 5 min max.Frequency 28 kHz to 40 kHz(3) CleanerAlcohol-based cleaner: IPAAqueous agent: PINE ALPHA ST-100S(4) There shall be no residual flux or residual cleaner. When using aqueous agent, rinse the product with deionized wateradequately and completely dry it so that no cleaner is left.* For other cleaning, consult our technical department.12.9 Storage and transportationStorage period Use the product within 12 months after delivery.If you do not use the product for more than 12 months, check solderability before using it.Storage conditions • The products shall be stored in a room not subject to rapid changes in temperature and humidity.The recommended temperature range is -10°C to +40°C. The recommended relative humidityrange is 15% to 85%.Keeping the product in corrosive gases, such as sulfur, chlorine gas or acid, oxidizes theelectrode, resulting in poor solderability or corrosion of the coil wire of the product.• Do not keep products in bulk packaging. Doing so may cause collision between the products orbetween the products and other products, resulting in core chipping or wire breakage.• Do not place the products directly on the floor; they should be placed on a palette so that they arenot affected by humidity or dust.• Avoid keeping the products in a place exposed to direct sunlight, heat or vibration.Transportation Excessive vibration and impact reduces the reliability of the products. Exercise caution whenhandling the products.12.10 Resin coatingThe inductance value may change due to high cure-stress of resin to be used for coating/molding products.A wire breakage issue may occur by mechanical stress caused by the resin, amount/cured shape of resin, or operatingcondition etc. Some resin contains some impurities or chloride possible to generate chlorine by hydrolysis under some operating condition may cause corrosion of wire of coil, leading to wire breakage.So, please pay your careful attention when you select resin in case of coating/molding the products with the resin.Prior to use the coating resin, please make sure no reliability issue is observed by evaluating products mounted on your board.12.11 Handling of product• Sharp material such as a pair of tweezers or other material such as bristles of cleaning brush, shall not be touched to the winding portion to prevent the breaking of wire.• Mechanical shock should not be applied to the products mounted on the board to prevent the breaking of the core.12.12 Handling with mounting equipment• With some types of mounting equipment, a support pin pushes up the product from the bottom of the base (paper) tape when the product is sucked with the pick-up nozzle.When using this type of equipment, detach the support pin to prevent the breaking of wire on the product.• In some cases, the laser recognition function of the mounting equipment may not recognize this product correctly.Please contact us when using laser recognition. (There is no problem with the permeation and reflection type.)13. Note(1) Please make sure that your product has been evaluated in view of your specifications with our product being mounted toyour product.(2) You are requested not to use our product deviating from the reference specifications.(3) The contents of this reference specification are subject to change without advance notice. Please approve our productspecifications or transact the approval sheet for product specifications before ordering.14. AppendixElectrical performance: Measuring method for inductance/Q (Q measurement is applicable only when the Q value is included in the rating table.)Perform measurement using the method described below. (Perform correction for the error deriving from the measuring terminal.)(1) Residual elements and stray elements of the measuring terminal can be expressed by the F parameter for the 2-poleterminal as shown in the figure below.(2) The product's impedance value (Zx) and measured impedance value (Zm) can be expressed as shown below, by usingthe respective current and voltage for input/output.Zm=V1I1Zx=V2I2(3) Thus, the relationship between the product's impedance value (Zx) and measured impedance value (Zm) is as follows.Zx=αZm-β1-ZmΓHere,α=D/A=1β=B/D=Zsm - (1 - Yom Zsm) ZssΓ=C/A=YomZsm: measured impedance of short chipZss: residual impedance of short chip (0.480 nH)Yom: measured admittance when measuring terminal is open (4) Calculate inductance Lx and Qx using the equations shown below.Lx=Im (Zx)2πfLx: inductance of chip coilQx: Q of chip coilf: measuring frequencyQx=Im (Zx) Re (Zx)。
mechanical properties中文名演变过程及定义
mechanical properties中文名演变过程及定义作者:赵中平等来源:《中国科技术语》2015年第01期摘要:文章阐述了mechanical properties中译名由“机械性能”到“力学性能”的演变过程,认为mechanical properties译为“力学性能”并不合适,应译为“机械性能”。
指出了这种变更存在的问题,进一步说明了mechanical properties一词的定义。
关键词:术语,金属材料,机械性能,力学性能中图分类号:N04;H059;TH文献标识码:A文章编号:1673-8578(2015)01-0042-05Abstract: This article mainly elaborates the evolution process of the Chinese translation on “mechanical properties”. The author points out that “lixue xingnen” is not suitable for the Chinese tran slation of “mechanical properties”, and further illustrate that the definition on the term “mechanical properties”.Keywords: term,metal material,mechanical properties对于金属材料的重要的术语mechanical properties(以下简称MP),20世纪80年代前中国大陆称为“机械性能”,以后改称为“力学性能”,并成了固定的术语。
在资料[1]~[4]中,笔者认为“力学性能”的译法并不合适,阐明了MP正确的定名应是国际通用、概念确切的“机械性能”,并认为所谓的“力学性能”并不存在。
下面通过历史回顾和事实分析,叙述“机械性能”怎样被引导成“力学性能”,指出MP等同于“力学性能”的观点是由不恰当的翻译形成的误解,进一步阐明MP的定义就是“机械性能”。
电子专业中英文词汇翻译
电子专业词汇的中英文对照电路的基本概念及定律电源source电压源voltage source电流源current source理想电压源ideal voltage source理想电流源ideal current source伏安特性volt-ampere characteristic 电动势electromotive force电压voltage电流current电位potential电位差potential difference欧姆Ohm伏特Volt安培Ampere瓦特Watt焦耳Joule电路circuit电路元件circuit element电阻resistance电阻器resistor电感inductance电感器inductor电容capacitance电容器capacitor电路模型circuit model参考方向reference direction参考电位reference potential欧姆定律Ohm’s law基尔霍夫定律Kirchhoff’s law基尔霍夫电压定律Kirchhoff’s voltage law(KVL)基尔霍夫电流定律Kirchhoff’s current law(KCL)结点node支路branch回路loop网孔mesh支路电流法branch current analysis网孔电流法mesh current analysis结点电位法node voltage analysis电源变换source transformations叠加原理superposition theorem网络network无源二端网络passive two-terminal network有源二端网络active two-terminal network戴维宁定理Thevenin’s theorem诺顿定理Norton’s theorem开路(断路)open circuit短路short circuit开路电压open-circuit voltage短路电流short-circuit current交流电路直流电路direct current circuit (dc)交流电路alternating current circuit (ac)正弦交流电路sinusoidal a-c circuit平均值average value有效值effective value均方根值root-mean-squire value (rms) 瞬时值instantaneous value电抗reactance感抗inductive reactance容抗capacitive reactance法拉Farad亨利Henry阻抗impedance复数阻抗complex impedance相位phase初相位initial phase相位差phase difference相位领先phase lead相位落后phase lag倒相,反相phase inversion频率frequency角频率angular frequency赫兹Hertz相量phasor相量图phasor diagram有功功率active power无功功率reactive power视在功率apparent power功率因数power factor功率因数补偿power-factor compensation串联谐振series resonance并联谐振parallel resonance谐振频率resonance frequency频率特性frequency characteristic幅频特性amplitude-frequency response characteristic相频特性phase-frequency response characteristic截止频率cutoff frequency品质因数quality factor 通频带pass-band带宽bandwidth (BW)滤波器filter一阶滤波器first-order filter二阶滤波器second-order filter低通滤波器low-pass filter高通滤波器high-pass filter带通滤波器band-pass filter带阻滤波器band-stop filter转移函数transfer function波特图Bode diagram傅立叶级数Fourier series三相电路三相电路three-phase circuit三相电源three-phase source对称三相电源symmetrical three-phase source对称三相负载symmetrical three-phase load相电压phase voltage相电流phase current线电压line voltage线电流line current三相三线制three-phase three-wire system三相四线制three-phase four-wire system三相功率three-phase power星形连接star connection(Y-connection) 三角形连接triangular connection(D- connection ,delta connection)中线neutral line电路的暂态过程分析暂态transient state稳态steady state暂态过程,暂态响应transient response 换路定理low of switch一阶电路first-order circuit三要素法three-factor method时间常数time constant积分电路integrating circuit微分电路differentiating circuit磁路与变压器磁场magnetic field磁通flux磁路magnetic circuit磁感应强度flux density磁通势magnetomotive force磁阻reluctance电动机直流电动机dc motor交流电动机ac motor异步电动机asynchronous motor同步电动机synchronous motor三相异步电动机three-phase asynchronous motor单相异步电动机single-phase asynchronous motor旋转磁场rotating magnetic field定子stator转子rotor转差率slip起动电流starting current起动转矩starting torque额定电压rated voltage 额定电流rated current额定功率rated power机械特性mechanical characteristic继电器-接触器控制按钮button熔断器fuse开关switch行程开关travel switch继电器relay接触器contactor常开(动合)触点normally open contact 常闭(动断)触点normally closed contact 时间继电器time relay热继电器thermal overload relay中间继电器intermediate relay可编程控制器(PLC)可编程控制器programmable logic controller语句表statement list梯形图ladder diagram半导体器件本征半导体intrinsic semiconductor掺杂半导体doped semiconductorP型半导体P-type semiconductorN型半导体N--type semiconductor自由电子free electron空穴hole载流子carriersPN结PN junction扩散diffusion漂移drift二极管diode硅二极管silicon diode锗二极管germanium diode阳极anode阴极cathode发光二极管light-emitting diode (LED) 光电二极管photodiode稳压二极管Zener diode晶体管(三极管)transistorPNP型晶体管PNP transistorNPN型晶体管NPN transistor发射极emitter集电极collector基极base电流放大系数current amplification coefficient场效应管field-effect transistor (FET) P沟道p-channelN沟道n-channel结型场效应管junction FET(JFET)金属氧化物半导体metal-oxide semiconductor (MOS)耗尽型MOS场效应管depletion mode MOSFET(D-MOSFET)增强型MOS场效应管enhancement mode MOSFET(E-MOSFET)源极source栅极grid漏极drain跨导transconductance夹断电压pinch-off voltage热敏电阻thermistor开路open短路shorted 基本放大器放大器amplifier正向偏置forward bias反向偏置backward bias静态工作点quiescent point (Q-point)等效电路equivalent circuit电压放大倍数voltage gain总的电压放大倍数overall voltage gain 饱和saturation截止cut-off放大区amplifier region饱和区saturation region截止区cut-off region失真distortion饱和失真saturation distortion截止失真cut-off distortion零点漂移zero drift正反馈positive feedback负反馈negative feedback串联负反馈series negative feedback并联负反馈parallel negative feedback 共射极放大器common-emitter amplifier 射极跟随器emitter-follower共源极放大器common-source amplifier 共漏极放大器common-drain amplifier 多级放大器multistage amplifier阻容耦合放大器resistance-capacitance coupled amplifier直接耦合放大器direct- coupled amplifier输入电阻input resistance输出电阻output resistance负载电阻load resistance动态电阻dynamic resistance负载电流load current旁路电容bypass capacitor耦合电容coupled capacitor直流通路direct current path交流通路alternating current path直流分量direct current component交流分量alternating current component 变阻器(电位器)rheostat电阻(器)resistor电阻(值)resistance电容(器)capacitor电容(量)capacitance电感(器,线圈)inductor电感(量),感应系数inductance正弦电压sinusoidal voltage集成运算放大器及应用差动放大器differential amplifier运算放大器operationalamplifier(op-amp)失调电压offset voltage失调电流offset current共模信号common-mode signal差模信号different-mode signal共模抑制比common-mode rejection ratio (CMRR)积分电路integrator(circuit)微分电路differentiator(circuit)有源滤波器active filter低通滤波器low-pass filter高通滤波器high-pass filter带通滤波器band-pass filter带阻滤波器band-stop filter 波特沃斯滤波器Butterworth filter切比雪夫滤波器Chebyshev filter贝塞尔滤波器Bessel filter截止频率cut-off frequency上限截止频率upper cut-off frequency下限截止频率lower cut-off frequency中心频率center frequency带宽Bandwidth开环增益open-loop gain闭环增益closed-loop gain共模增益common-mode gain输入阻抗input impedance电压跟随器voltage-follower电压源voltage source电流源current source单位增益带宽unity-gain bandwidth频率响应frequency response频响特性(曲线)response characteristic 波特图the Bode plot稳定性stability补偿compensation比较器comparator迟滞比较器hysteresis comparator阶跃输入电压step input voltage仪表放大器instrumentation amplifier隔离放大器isolation amplifier对数放大器log amplifier反对数放大器antilog amplifier反馈通道feedback path反向漏电流reverse leakage current相位phase相移phase shift锁相环phase-locked loop(PLL)锁相环相位监测器PLL phase detector 和频sum frequency差频difference frequency波形发生电路振荡器oscillatorRC振荡器RC oscillatorLC振荡器LC oscillator正弦波振荡器sinusoidal oscillator三角波发生器triangular wave generator 方波发生器square wave generator幅度magnitude电平level饱和输出电平(电压)saturated output level功率放大器功率放大器power amplifier交越失真cross-over distortion甲类功率放大器class A power amplifier 乙类推挽功率放大器class B push-pull power amplifierOTL功率放大器output transformerless power amplifierOCL功率放大器output capacitorless power amplifier直流稳压电源半波整流full-wave rectifier全波整流half-wave rectifier电感滤波器inductor filter电容滤波器capacitor filter串联型稳压电源series (voltage) regulator开关型稳压电源switching (voltage) regulator集成稳压器IC (voltage) regulator 晶闸管及可控整流电路晶闸管thyristor单结晶体管unijunction transistor(UJT)可控整流controlled rectifier可控硅silicon-controlled rectifier峰点peak point谷点valley point控制角controlling angle导通角turn-on angle门电路与逻辑代数二进制binary二进制数binary number十进制decimal十六进制hexadecimal二-十进制binary coded decimal (BCD)门电路gate三态门tri-state gate与门AND gate或门OR gate非门NOT gate与非门NAND gate或非门NOR gate异或门exclusive-OR gate反相器inverter布尔代数Boolean algebra真值表truth table卡诺图the Karnaugh map逻辑函数logic function逻辑表达式logic expression组合逻辑电路组合逻辑电路combination logic circuit 译码器decoder编码器coder比较器comparator半加器half-adder全加器full-adder七段显示器seven-segment display 时序逻辑电路时序逻辑电路sequential logic circuit R-S 触发器R-S flip-flopD触发器D flip-flopJ-K触发器J-K flip-flop主从型触发器master-slave flip-flop 置位set复位reset直接置位端direct-set terminal直接复位端direct-reset terminal寄存器register移位寄存器shift register双向移位寄存器bidirectional shift register计数器counter同步计数器synchronous counter异步计数器asynchronous counter 加法计数器adding counter减法计数器subtracting counter定时器timer清除(清0)clear载入load时钟脉冲clock pulse触发脉冲trigger pulse上升沿positive edge下降沿negative edge 时序图timing diagram波形图waveform脉冲波形的产生与整形单稳态触发器monostable flip-flop双稳态触发器bistable flip-flop无稳态振荡器astable oscillator晶体crystal555定时器555 timer模拟信号与数字信号的相互转换模拟信号analog signal数字信号digital signalAD转换器analog -digital converter (ADC) DA转换器digital-analog converter (DAC)半导体存储器只读存储器read-only memory(ROM)随机存取存储器random-access memory(RAM)可编程ROM programmable ROM (PROM)Linear Control System(线性系统), Single Input Single Output(单输入单输出), Laplace Transform(拉普拉斯变换), Differential Equations(微分方程), Transfer Functions(传递函数), Models of System(系统模型), Block Diagrams(方框图), Mason’s Gain Formula(梅森公式), First-order System(一阶系统), Second-order System(二阶系统), Higher-order System(高阶系统), Close-loop Control System(闭环控制系统), Stability(稳定性), Transient Response(瞬态响应), Routh-Hurwitz Stability Criterion(劳斯判据), Steady-state Accuracy(稳态精度), Root-locus(根轨迹), Root-locus Principles(根轨迹基本规则), Frequency Responses(频率响应), Bode Diagrams(波特图), Nyquist Criterion(奈氏判据), Relative Stability(相对稳定性).。
NORMA 4000 5000 Power Analyzer 用户说明手册说明书
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BEGRENZTE GEWÄHRLEISTUNG UND HAFTUNGSBESCHRÄNKUNG
Fluke gewährleistet, daß jedes Fluke-Produkt unter normalem Gebrauch und Service frei von Material- und Fertigungsdefekten ist. Die Garantiedauer beträgt 2 Jahre ab Versanddatum. Die Garantiedauer für Teile, Produktreparaturen und Service beträgt 90 Tage. Diese Garantie wird ausschließlich dem Erster
过程装备与控制工程专业英语 1-13
tensile strength抗拉强度
tensile test拉力(抗拉)试验
Lesson 1
universal testing machine万能试验机 specimen样本(品),试样(件) cross section横截面 gauge length标距长度 elongation拉伸,延长;延伸率 elastic range弹性范围 yield point屈服点 elastic limit弹性极限 yield strength屈服强度
硬度是一个很重要的特性,这是因为制造在很大程度上取 决于它。硬度是由材料提供的对压痕的抵抗能力。一般来说, 用于测量材料硬度的压痕试验有好几种。这些试验通常包含一 个由硬度更大的材料制成的球、圆锥或棱锥,这个球、圆锥或 棱锥在规定载荷的作用下压入试验材料,通过测量由此形成的 永久性压痕可以得到给定试验条件下的硬度值。
The deformation caused in a material is of two types, elastic and plastic. Elastic deformation is that part of the deformed material which when the applied load is removed, would spring back to its normal shape. Plastic deformation is on the other hand, permanently set in a material and cannot be regained.
L 5.65 d
抗拉强度是由在万能试验机上进行的拉力试验
测得的,这个试验涉及到试件的制备,其规格如
Biorad基因导入电转仪
Table of ContentsSection 1Introduction and Safety Information:The Gene Pulser XcellSystem (1)1.1General Safety Information (1)1.2Electrical Hazards (2)1.3Mechanical Hazards (2)1.4Other Safety Precautions (2)Section 2Unpacking and System Installation (3)2.1Unpacking the System Components (3)2.2Setting up the System (4)2.2.1Setting up the Gene Pulser Xcell Main Unit and Connectingthe ShockPod (Cat. #s 165-2660, 165-2661, 165-2662,165-2666) (4)2.2.2Connecting the PC Module to the Gene Pulser Xcell MainUnit (Cat. #s 165-2660, 165-2662, and 165-2668) (5)2.2.3Connecting the CE Module to the Gene Pulser Xcell MainUnit (Cat. #s 165-2660, 165-2661, and 165-2667) (6)2.2.4ShockPod (Cat. #s 165-2660, 165-2661, 165-2662, and165-2669) (6)Section 3Gene Pulser Xcell Operating Instructions (8)3.1Section Overview (8)3.2Front Panel and Home Screen (9)3.2.1Description of Keypad (9)3.2.2Home Screen (10)3.2.3Help Screens (11)3.3Manual Operation (12)3.3.1Manual Operation (Guide Guide) (12)3.3.2Electroporation using Exponential Decay Pulses (12)3.3.3Electroporation Specifying Time Constant (14)3.3.4Electroporation using Square Wave Pulses (15)3.3.5Results Screens (17)3.3.6Saving a Program from Manual Operation (19)3.3.6A Saving in a Location without a Named User Entry (20)3.3.6B Saving in a Location with a Named User Entry (20)3.4Pre-Set Protocols (21)3.4.1Using a Pre-set Protocol (Quick Guide) (21)3.4.2Electroporation using a Pre-Set Protocol (22)3.4.3Modifying Pre-Set Protocol Parameters (25)3.4.4Saving Changes to Pre-Set Protocols (25)3.5User Protocols (26)3.5.1Using a User Protocol (Quick Guide) (26)3.5.2Creating a New User Name (26)3.5.3Creating a New User Protocol (26)3.5.4Modifying a User Protocol (30)3.5.5Deleting a User Name and a User Protocol (31)3.5.6Renaming a User Name or a User Protocol (33)3.6Last Pulse (34)3.7Optimize Operation (34)3.8Data Management (36)3.9Measurements (39)3.9.1Sample Resistance Measurements (39)3.9.2Calibration and Measurement of Capacitors in theCE Module (40)3.10User Preferences (41)3.10.1Setting the Clock (41)3.10.2Adjusting the Screen Intensity (42)3.10.3Sleep Function Setting (42)3.11The Pulse Trac System (43)3.11.1Pulse Trac System Description (43)3.11.2Pulse Trac Diagnostic Algorithm (44)Section 4Overview of Electroporation Theory (44)4.1Exponential Decay Pulses (45)4.2Square Wave Pulses (45)Section 5Factors Affecting Electroporation:OptimizingElectroporation (48)5.1Cell Growth (48)5.2DNA (49)5.3Electroporation Media (49)5.4Temperature (50)Section 6Electroporation of Bacterial Cells (52)6.1Escherichia coli (52)6.1.1Preparation of Electrocompetent Cells (52)6.1.2Electroporation (53)6.1.3Solutions and Reagents (53)6.2Staphylococcus aureus (54)6.2.1Preparation of Electrocompetent Cells (54)6.2.2Electroporation (54)6.2.3Solutions and Reagents (55)6.3Agrobacterium tumefaciens (56)6.3.1Preparation of Electrocompetent Cells (56)6.3.2Electroporation (56)6.3.3Solutions and Reagents (57)6.4Bacillus cereus (57)6.4.1Preparation of Electrocompetent Cells (57)6.4.2Electroporation (57)6.4.3Solutions and Reagents (58)6.5Pseudomonas aeruginosa (58)6.5.1Preparation of Electrocompetent Cells (58)6.5.2Electroporation (59)6.5.3Solutions and Reagents (59)6.6Streptococcus pyogenes (60)6.6.1Preparation of Electrocompetent Cells (60)6.6.2Electroporation (60)6.6.3Solutions and Reagents (61)6.7Lactobacillus plantarum (61)6.7.1Preparation of Electrocompetent Cells (61)6.7.2Electroporation (61)6.7.3Solutions and Reagents (62)Section 7Electroporation of Fungal Cells (62)7.1Saccaromyces cerevisiae (62)7.1.1Preparation of Electrocompetent Cells (62)7.1.2Electroporation (63)7.1.3Solutions and Reagents (64)7.2Schizosaccharomyces pombe (64)7.2.1Preparation of Electrocompetent Cells (64)7.2.2Electroporation (65)7.2.3Solutions and Reagents (65)7.3Pichia pastoris (65)7.3.1Preparation of Electrocompetent Cells (65)7.3.2Electroporation (66)7.3.3Solutions and Reagents (66)7.4Candida albicans (67)7.4.1Preparation of Electrocompetent Cells (67)7.4.2Electroporation (67)7.4.3Solutions and Reagents (68)7.5Dictyostelium discoideum (68)7.5.1Preparation of Electrocompetent Cells (68)7.5.2Electroporation (69)7.5.3Solutions and Reagents (69)Section 8Mammalian Cells (70)8.1Preparation of Electrocompetent Cells (70)8.1.1Attached Cells (70)8.1.2Suspension Cells (70)8.2Electroporation (70)8.3Solutions and Reagents (71)Section 9References (72)Section 10Specifications and Product Information (75)10.1System Specifications (75)10.2Product Information (76)Section 1The Gene Pulser Xcell™Electroporation SystemThe Gene Pulser Xcell is a pulse generator that uses capacitors to produce controlled exponential or square wave electrical pulses for cell electroporation. The unit is capable of producing pulses of up to 3000 V on a high-voltage circuit, and up to 500 V on a low-voltage circuit. For generating pulses on the high voltage circuit, capacitors of 10, 15, and 25 µF present in the Gene Pulser Xcell main unit are used and generating pulses on the low-voltage circuit requires use of capacitors in the CE Module. Exponential decay (or capacitance discharge) and square wave pulses are the most commonly used types of electrical pulse. Anin-depth discussion of these two waveforms can be found in Section 4.The Gene Pulser Xcell is a modular system, comprising of a main unit and two accessory modules,the CE module and the PC module, in addition to the shocking chamber and a cuvette with incorporated electrodes. The CE Module is recommended for use with the Gene Pulser Xcell main unit for electroporation of most eukaryotic cells, including mammalian cells and plant protoplasts. The CE Module should only be used with low-resistance media (<1000 ohms). For exponential decay pulses, the CE Module provides a means of controlling the capacitance of the circuit by increasing the time constant of the pulse. For square wave pulses, the CE Module provides the large capacitor necessary for delivering a square wave pulse into low resistance media. This module contains a set of capacitors with a functional range between 50 and 3275 µF and selectable in 25 µF increments. For square wave pulses, the CE Module provides the large capacitance, 3275 µF, necessary for delivering a square wave pulse into low resistance media.The PC Module is recommended for the electroporation of bacteria and fungi using exponential decay, as well as in other applications where high-voltage pulses are applied to samples of small volume and high resistance. The PC Module selects resistance of 50 ohms 1000 ohms in 50-ohm increments. The unit is used to control the resistance of the circuit by placing resistors in parallel with the sample, thereby provid-ing a means of reducing the time constant of an exponential decay pulse. This provides an effective means of controlling the time constant when using high-resistance media but has little effect on the time constant when using low-resistance media. The PC Module greatly reduces the likelihood of an arc occurring at high voltage. It is not recommended that the PC module be used for square wave pulses due to the increase in droop of the pulse that can occur (see Section 4).Both the PC Module and CE Module have integral leads that connect to the main unit (see Section 2 for installation) and both units are controlled directly from the user interface on the front panel of the main unit.1.1General Safety InformationThis Bio-Rad instrument is designed and certified to meet the safety requirements of EN61010 and the EMC requirements of EN61326 (for Class A) and conforms to the “Class A” standards for electromagnetic emissions intended for laboratory equipment applications. This instrument is intended for laboratory application only. It is possible that emissions from this product may interfere with some sensitive appliances when placed nearby or in the same circuit as those appliances. The user should be aware of this potential and take appropriate measures to avoid interference.No part of the Gene Pulser Xcell system should be used if obvious external case damage has occurred or the electronic displays are not functioning as described in the manual. This instrument is only to be used with the components provided (or their authorized additions or replacements) including, but not limited to, supplied cables and ShockPod. The operating temperature range for the Gene Pulser Xcell system and its associated components is 0–35°C.1There are no user serviceable parts within the unit. The operator should make no attempt to open any case cover or defeat any safety interlock. This instrument must not be altered or modified in any way. Alteration of this instrument will•Void the manufacturer’s warranty•Void the IEC 1010 safety certification•Create a potential safety hazardBio-Rad is not responsible for any injury or damage caused by the use of this instrument for purposes other than those for which it is intended or by modification of the instrument not performed by Bio-Rad or an authorized agent.1.2Electrical HazardsThe Gene Pulser Xcell produces voltages up to 3,000 volts and is capable of passing very high currents. When charged to maximum voltage, the instrument stores about 400 joules. A certain degree of respect is required for energy levels of this order. System safety features prevent operator access to the recessed input jacks and to the recessed electrode contacts inside the sample chamber. These mechanical interlocks should never be circumvented.The pulse button is active whenever the character space in the lower right corner is flashing. There is high voltage present whenever the pulse button is depressed and “Pulsing” is shown on the LCD display on the front of the instrument. Because of the built-in safety interlock in the ShockPod, no pulse is delivered to the cuvette when the ShockPod lid is opened. If the capacitor has been partially charged but not fired (for example, when the charging cycle has been interrupted before the pulse is delivered), some charge may remain on the internal capacitor. This charge will dissipate over 1–2 minutes. However, the user cannot make contact with any charged electrical components due to the system safety features.1.3Mechanical HazardsThe Gene Pulser Xcell contains a patented arc-protection circuit that dramatically reduces the incidence of arcing in the cuvette when high voltage is delivered into the sample. The unit incorporates a circuit that senses the beginning of an arc and diverts current from the sample within <10 µsec, preventing, or greatly reducing, mechanical, visual, and auditory phenomena at the ShockPod. Should an arc occur, the sample chamber is effective in containing these small discharges, but nonetheless we strongly recommend wearing safety glasses when using the instrument.1.4Other Safety PrecautionsAvoid spilling any liquids onto the apparatus. Use only a paper towel or a cloth wet with either water or alcohol to clean the outside surfaces of the Gene Pulser Xcell.Use only the Bio-Rad cables supplied with the Gene Pulser Xcell.Use the ShockPod only in the assembled condition. Do not attempt to circumvent the protection of the ShockPod or use it while disassembled.Verify the display segments periodically.Read the instruction manual before using the Gene Pulser Xcell Electroporation System. For technical assistance contact your local Bio-Rad office or, in the US, call technical services at 1-800-4BIORAD(1-800-424-6723).2Warning: The Gene Pulser Xcell generates, uses, and radiates radio frequency energy. If it is not used in accordance with the instructions given in this manual, it may cause interference with radio communications. The Gene Pulser Xcell has been tested and found to comply with the limits for Class A computing devices (pursuant to Subpart J of Part 15 of FCC Rules) which provide reasonable protection against such interference when operated in a commercial environment. Operation of this equipment in a residential area is likely to cause interference. In this case the user will be required, at their expense, to take whatever measure may be required to correct the interference.Section 2Unpacking and System InstallationThe Gene Pulser XCell™ can be purchased as three systems as well as component parts:165-2660Gene Pulser Xcell Total System for eukaryotic and microbial cells, 100–240 V, 50/60 Hz, exponential decay and square wave delivery, includes main unit, CE Module, PCModule, ShockPod, 15 sterile cuvettes (5 each of 0.1, 0.2, and 0.4 cm gap),instruction manual165-2661Gene Pulser Xcell Eukaryotic System, 100/240 V, 50/60 Hz, exponential decay (25–3,275 µF range) and square wave delivery, includes main unit, CE Module,ShockPod, 5 sterile cuvettes (0.4 cm gap), instruction manual165-2662Gene Pulser Xcell Microbial System, 100/240 V, 50/60 Hz, exponential decay and square wave delivery, includes main unit, PC Module, ShockPod, 10 sterile cuvettes(5 each of 0.1 and 0.2 cm gap), instruction manual165-2666Gene Pulser Xcell main unit, 100/240 V, 50/60 Hz165-2667Gene Pulser Xcell CE Module, 25–3,275 µF range controlled by main unit, includes integral leads, 5 sterile cuvettes (0.4 cm gap), instruction manual165-2668Gene Pulser Xcell PC Module, 50–1,000 ohm range controlled by main unit, includes integral leads, 10 sterile cuvettes (5 each of 0.1 and 0.2 cm gap)165-2669Gene Pulser Xcell ShockPod shocking chamber, includes integral leads for connection to Gene Pulser Xcell, Gene Pulser II, or MicroPulser2.1Unpacking the System ComponentsRemove all packing material and connect components on a flat, dry surface near an appropriate electrical outlet.Upon receiving your instrument, please check that all items listed were shipped. If any items are missing or damaged, contact your local Bio-Rad office.3Section 3Gene Pulser Xcell™Operating Instructions3.1 Section OverviewThis section describes the operation of the Gene Pulser Xcell. The following summarizes the organization of this section.Section 3.2 below describes the functions of the keys on the front panel, the Home screen on the LCD display, and the Help functions built into the Gene Pulser Xcell.•The keys on the front panel of the main unit control the Gene Pulser Xcell. Section 3.2.1 describes the uses of these keys.•The Home screen provides easy access to programs built into the Gene Pulser Xcell as well as a direct method of manually entering pulse parameters to electroporate a sample. Section 3.2.2 describes these programs.•On-screen help is built into the software of the Gene Pulser Xcell. This may be accessed from any screen as described in Section 3.2.3.The Gene Pulser Xcell has three modes of operation: manual operation, pre-set protocols, and user protocols.Section 3.3 describes the Manual mode, which may be used to rapidly program the parameters necessary for delivering either an exponential decay or a square wave pulse.•Section 3.3.2 describes delivering an exponential decay pulse.•Section 3.3.3 describes delivering an exponential decay pulse but specifying a time constant rather than a capacitance and resistance value.•Section 3.3.4 describes delivering a square wave pulse.•Section 3.3.6 explains how programmed settings may be saved as user protocols.Section 3.4 describes the Pre-set protocols in which the pulse parameters have been optimized for a number of commonly used bacterial and fungal species and mammalian cell lines.•Pre-set Protocols may be called up and used directly (Section 3.4.2) or may be modified prior to being used (Section 3.4.3).• A modified Pre-set Protocol may be saved as a User Protocol (Section 3.4.4).Section 3.5 describes a custom mode (User Protocols) in which users may store optimized pulse parameters that they use in their own work.•User Protocols may be created in any of four ways:•In the User Protocols menu as a new protocol (Section 3.5.3).•In the User Protocols menu as an edited (modified) program (Section 3.5.4)•In the Manual menu as a new protocol (Section 3.3.4).•In the Pre-set Protocol Menu as a modified protocol (Section 3.4.4).•User Protocols, once created and saved, may be called up and used directly like Pre-set Protocols (Section 3.5.1).3.2 Front Panel and Home Screen3.2.1 Description of the keypadSee Figure 3.1 for a view of the Gene Pulser Xcell front panel.Alpha-numeric keys This array of keys permits entering numbers and letters into the Gene PulserXcell. Pressing the Shift key toggles between alphabetic and numeric input. Totype an alphabetic character, press the Shift key to enter alpha mode, thenpress the key with the appropriate letter. To type an a, press the 2 key once; totype a b, press the 2 key twice; to type a c, press the 2 key three times. To usethe same key twice, for example to type a then b, advance the cursor usingthe Right Arrow Key. The firmware on Gene Pulser Xcell will automaticallychange between alpha and numeric input depending on the parameter beingentered. In Protocol screens and Directory screens where a two-digit entrymust be made, the second digit must be entered within 2 seconds of the firstentry, otherwise the screen will default to the single-digit entry.Home key Returns the user to the Home screen from anywhere in the program.Back key Returns the user one level back in hierarchy toward the Home screen.Help key Displays on-screen help text.Save key Saves User Names and User Protocols.Delete key Removes only the last entry in the field; also used to remove User Name andUser Protocol files.Clear key Removes the entire line of the field.Enter key Indicates that a choice has been made and moves the cursor to the nextlocation.Arrow keys The Up and Down Arrow keys move the cursor up or down one row at a time.Depending on the screen and location of the cursor, the Right and Left Arrowsmay (1) move the cursor right or left one space at a time, (2) toggle forwardand backward one screen when there are multiple screens for the samemenu, or (3) increase or decrease numerical input values.Pulse button:Results in discharging a pulse. During this time “Pulsing” is shown on the LCDdisplay. A tone sounds to indicate that the pulse has been delivered. Whenmultiple pulses are delivered, a tone sounds after the last pulse has beendelivered. The Pulse is discharged to the electrodes if the ShockPod isconnected and the lid is closed. Otherwise, it is discharged safely within theinstrument.3.3 Manual Operation3.3.1 Manual Operation (Quick Guide)•From the Home screen:•Press Enter to select exponential decay;•Press 2, then Enter to select exponential decay but specifying a time constant;•Press 3, then Enter to select square wave.•Use the Up and Down Arrow keys to scroll through the parameter value spaces on the screen.When a parameter value is highlighted, use the keypad to enter a value, then press Enter to accept that value.•When the necessary parameter values have been entered, the Pulse button on the Gene Pulser Xcell is active.•Press the Pulse button to electroporate the sample.•Press the Back key to return to the Protocol Detail screen and to deliver another pulse.3.3.2 Electroporation using Exponential Decay PulsesSee Section 4.1 for a discussion of electroporation using exponential decay pulses.•When the Home screen (Figure 3.2) is selected, the number 1, corresponding to “Exponential protocol” is highlighted as the default choice. Press Enter to view the Protocol Detail Screen. If the number 1 on the Home screen is not highlighted, press 1 or use the Up or Down Arrow keys to highlight “Exponential protocol”, then press Enter to select. The Protocol Detail screen appears (Figure 3.3).•The following combination of parameters may be entered:Capacitance + VoltageCapacitance + Voltage + ResistanceThe three variables may be selected in any order, however, the set voltage will determine whether the high voltage or the low voltage circuit is to be used and will limit the range of the capacitance as indicated in Table 3.1. If a value for the capacitance is chosen that outside the range of the system, this value will default to the closest allowable value.Specifying a resistance value requires that the PC Module be attached. This is always recommended with high resistance media (i.e., >600 ohm) such as water, sucrose, glycerol, sorbitol, or polyethylene glycol. The PC Module places a resistor in parallel with the sample to reduce the resistance of the circuit. In this way, the time constant of a high-resistance sample may be reduced and controlled.•When the necessary parameter values have been specified, a flashing “P” appears in the character space in the lower right corner of the LCD display indicating that the pulse button on the Gene Pulser Xcell is active and that a pulse may be delivered.•Press the Pulse button to deliver a pulse. When the Pulse button is depressed, the LCD display will blank then show “Pulsing”. Upon completion, a tone will sound and the pulse measurements will be displayed on the Protocol Results screen (see Figure 3.8, Section 3.3.5).•Use the Left and Right Arrow keys to toggle between the Protocol Results screen and the last Protocol Detail screen.•With the Protocol Detail screen on the LCD display another pulse can be delivered using the same pulse parameters. To change the pulse conditions, press Enter; the cursor appears in the voltage parameter value. The parameters may be changed as described above.•To save the pulse parameters, see Section 3.3.6.•To review previously delivered pulses, see Section 3.8.3.3.5 Results ScreensAfter delivering a pulse, the LCD displays the results on a Protocol Results screen. This screen shows the results in both graphic and tabular form. Figures 3.6, 3.7, and 3.8 show examples of the results from an exponential decay pulse, an exponential decay pulse in which the time constant was specified, and a square wave pulse, respectively.Results of the last 100 pulses as well as of the pulse parameters are stored in Gene Pulser Xcell memory and are accessible from the Data Management program (Section 3.8).3.4.2 Electroporation using Pre-set ProtocolsThere are nine Pre-set Bacterial Protocols, six Pre-set Fungal Protocols, and 12 Pre-set Mammalian Protocols. These protocols are pre-programmed with the optimal parameters for the given organism. Use the Pre-set Protocols as follows.•From the Home screen, press 4 or use the Up and Down Arrow keys to highlight “Pre-set Protocols”, then press Enter to select and to show the Pre-set Protocols screen (Figure 3.12).•Press 1–3, or use the Up and Down Arrow keys, to highlight Bacterial, Fungal, or Mammalian Pre-set Protocols, then press Enter to select.•Use the alpha-numeric keypad or the Up and Down Arrow keys to scroll through the list of names.For the Bacterial and Mammalian Pre-set Protocols, use the Right and Left Arrow keys to toggle between the two screens. When the number corresponding to the desired name is highlighted, press Enter to select and to view the Protocol Detail Screen showing the electroporation parameters for that protocol. A flashing “P” in the character space in the lower right corner of the LCD display indicates that the Pulse button is active.•For example, from the Pre-set Protocols screen, press 3 to highlight “Mammalian”, then press Enter to select and to bring up the first Pre-set Mammalian Protocols screen with the names of six pre-set mammalian protocols (Figure 3.13). Press the Right and Left Arrow keys to togglebetween the two Mammalian Pre-set Protocols screens. Use the alpha-numeric keypad or the Up and Down Arrow keys to scroll through the list of names. When the desired name on theMammalian Pre-set Protocols screen is highlighted,press Enter to select that protocol and toview the Protocol Detail Screen showing the electroporation parameters for that protocol. Forexample, from the Mammalian Pre-set Protocols screen, press 1, then Enter to bring up theProtocol Detail Screen for CHO cells in a 2 mm cuvette (Figure 3.14).•Press the Pulse button to deliver a pulse. When the Pulse button is depressed, the LCD display will blank then show “Pulsing”. Upon completion, a tone will sound and the pulse measurements will be displayed on the Protocol Results screen (see Section 3.3.5).•Use the Left and Right Arrow keys to toggle between the Protocol Results screen and the last Protocol Detail screen.•With the Protocol Detail screen on the LCD display another pulse can be delivered using the same pulse parameters. To change the pulse conditions, press Enter; the cursorappears in the voltage parameter value. The parameters may be changed as described in Section 3.4.3.•To review previously delivered pulses, see Section 3.8.3.4.3 Modifying Pre-set Protocol ParametersThe parameters for a Pre-set protocol may be changed as follows.•From the Protocol Detail screen, press the Up or Down Arrow keys to highlight the value for one of the parameter settings (voltage, capacitance, or resistance for exponential decay pulses;voltage or time constant for time constant mode; pulse length, voltage, number of pulses, or pulse interval for square wave pulses). (Note: the waveform cannot be changed in the Pre-set Protocols Mode.) When the desired parameter is selected, use the alpha-numeric keypad to input the new value.Alternatively, use the Right and Left Arrow keys to incrementally increase or decrease, respectively, the parameter value. Use the Delete or Clear keys to correct entries. When the correct value has been specified, press Enter. If a value outside the limits of the Gene Pulser Xcell is selected, the value in the field will default to the closest permitted value. Use the Up and Down Arrow keys to select other parameter values to be changed, then use the alpha-numeric keypad or the Left and Right Arrow keys to enter the desired value.• A pulse may be delivered when appropriate parameters have been entered in the Protocol Detail screen and the character space at the lower right of the LCD display is flashing “P”.•To return to the last Protocol Detail screen, press the Back key or the Left Arrow key. Another pulse may be delivered using the same parameters shown on the LCD display. To return to the Protocol Results Screen, press the Right Arrow key. (Note: Returning to the Protocol Detail Screen returns to the modified parameters. To return to the Pre-set Protocol, press the Back key again to return to the Pre-set Protocols screen. This will remove any changes made.)•To change the pulse conditions, with the Protocol Detail screen on the LCD display, press Enter;the cursor appears in the voltage parameter value. The parameters may be changed as described above.•To review previously delivered pulses, see Section 3.8.3.4.4 Saving Changes to Pre-set ProtocolsChanges to a Pre-set Protocol may be saved as a User Protocol as follows:•Change the Pre-set Protocol as described in Section 3.4.3.•With the Protocol Detail screen open, press Save.•The first User Directory screen will appear (Figure 3.9); the second line will read “Choose location for protocol”.•Use the Right and Left Arrow keys to toggle between the two User Directory screens. Press 1–12 or use the Up and Down Arrow keys to highlight the User Name under which to store the protocol.Press Enter to select the User Name. The User Protocols screen will appear (Figure 3.10); the second line will read “Choose location for protocol”. If it is necessary to create a new User Name, seeSection 3.5.2.•Use the Right and Left Arrow keys to toggle between the two User Protocols screens. Press 1–12 or use the Up and Down Arrow keys to highlight a location for the new protocol. A protocol may be stored in a position without an entry (see Section 3.3.6A) or in a position with an entry (seeSection 3.3.6B). If necessary, delete a User Protocol as described in Section 3.5.5.•To use the saved protocol, press Enter to view the Protocol Detail screen. Press the Pulse button to deliver a pulse.。
伯斯电力力学5说明书
The Challenge:Using a Customized Waveform to Mimic theHuman Cartilage Mechanical EnvironmentBackgroundApproximately 40 million Americans suffer from localized damage to the cartilage and subchondral bone. This leads to pain, loss of joint function and osteoarthritis. There is a pervasive need for effective clinical treatments to repair cartilage injuries.Regenerative medicine approaches are currently investigated through the replacement of the damaged cartilage with tissue-engineered cartilage constructs. Porous scaffolds not only provide a boundary for retention of cells, but also act as a substrate to which the anchorage-dependent chondrocytes can adhere.It is known that mechanical modulation has a significant impact on cell differentiation and proliferation. Thus,applying accurate and efficient mechanical stimuli is crucial in quality control of the tissue product. This may also in turn guide diagnosis and future therapy improvement. In this study, the Bose ® ElectroForce ® 5500 test instrument (Figure 1) was used to impose a customized waveform on a hydrogel, and the changes in sample properties were monitored over time.Sinusoidal cyclic waveforms are typically used when studying relationships between cell growth and mechanical stimulation; however, there is limitedinformation on using customized waveforms. It would be beneficial to use a waveform that mimics the mechanical environment of a human knee joint while walking during the in vitro tissue-engineered cartilage development.Polyethylene glycol (PEG) hydrogel sheets (4” x 4”) were purchased from MedlineIndustries. Hydrogel specimens, punched from the hydrogel sheet, were 12 mm in diameter and 6 mm in height (Figure 2).The ElectroForce 5500 systemhas a maximum force capacityof 200 N and a maximumdisplacement of 13 mm. The system was equipped with a 200 N load cell and a pair of 25 mm diameter platens. A preloading force of 0.1 N was used to ensure that the entire scaffold surface was in contact with the compression platens prior to testing (Figure 3).External waveform is a feature of the WinTest software that offers users with the ability to run custom waveforms whenmore complex mechanicalanalysis is required. Externalwaveform allows the importation of point by point files whichdefine evenly spaced data points as a function of time.Meeting the ChallengeThe ElectroForce 5500 test instrument, in combination with WinTest ® software, is ideal for mechanical studies in biomedical research. It provides precise force and displacement control throughout the experiment. Customized waveforms can be realized by externallyimporting them into the WinTest software at which point they can be reproduced by the patented Bose linearactuator that features a frictionless moving-magnet design.Materials and MethodsFigure 2 - Hydrogel Specimen Figure 1 - Bose ® ElectroForce ®5500 Test InstrumentFigure 3 - Specimen Loaded Between Compression PlatensBose Corporation – ElectroForce Systems Group10250 Valley View Road, Suite 113, Eden Prairie, Minnesota 55344 USA Email:*********************–Website: Phone: 952-278-3070 – Fax: 952-278-3071©2014 Bose Corporation. Patent rights issued and/or pending in the United States and other countries. Bose, the Bose logo, ElectroForce and WinT est are registered trademarks of Bose Corporation. 063014In order to create a WinTest ® software readable point by point file, the following steps were used:The waveform was extracted and replotted in Excel.According to normal human walking speed of 5 km/h, a one gait cycle time of 1.1 sec was obtained and used as a new X axis (Figure 5).An ASCII file was constructed by the text editor. The Y axis strain points were scaled according to the specimenthickness and used for the ASCII file. The above waveform contained 1100 points, so the time interval between points was set to 0.001 sec to match with the gait cycle time.Each pass through the waveform = 1100 x 0.001 = 1.1 sec. The ASCII file was imported into WinTest software. A point by point file was exported and used for the test setup.The same external waveform was successfully applied to all the specimens (Figure 6). Similar testing results of three specimens were achieved and reliable repeatability of this testing method was demonstrated (Displacement difference between samples: <2.5%; Load difference between samples:<13.9%). Compared to the original extracted waveform in the ASCII file, the majority of the waveform details were retained accurately.The Bose ® ElectroForce ® 5500 test instrument is a powerful tool, which is not only capable of generating sinusoidal, triangle, square, ramp and block waveforms, but also excels in precise waveform customization. Combined with easy to use WinTest software, the ElectroForce 5500 testinstrument is able to deliver waveform profiles that fit the needs of a particular experiment and gives researchers the ability to implement their ideas.SummaryFigure 4 - Strain at the Contact of Joint Cartilage during the Gait Cycle (Halonen et al., 2013)A waveform model (Figure 4, pink line) of strain vs. gait cycle based on simulation of human walking was used inthis study (Halonen, et al., 2013).Figure 5 - Extracted WaveformResultsThree specimens were tested with the externalwaveform, and displacement and load data were tracked during the test.(1) Halonen, K.S., M. E. Mononen, J. S. Jurvelin, J. Töyräs, and R.K. Korhonen. “Importance of depth-wise distibution of collagen and proteoglycans in articular cartilage - a 3D finite elment study of stresses and strains in the human knee joint.” Journal of Biomechanics (2013).ReferenceFigure 6 - Average Result of Three Specimens。
振动方面的专业英语及词汇
振动方面的专业英语及词汇1 振动信号的时域、频域描述振动过程 (Vibration Process)简谐振动 (Harmonic Vibration)周期振动 (Periodic Vibration)准周期振动 (Ouasi-periodic Vibration)瞬态过程 (Transient Process)随机振动过程 (Random Vibration Process)各态历经过程 (Ergodic Process)确定性过程 (Deterministic Process)振幅 (Amplitude)相位 (Phase)初相位 (Initial Phase)频率 (Frequency)角频率 (Angular Frequency)周期 (Period)复数振动 (Complex Vibration)复数振幅 (Complex Amplitude)峰值 (Peak-value)平均绝对值 (Average Absolute Value)有效值 (Effective Value,RMS Value)均值 (Mean Value,Average Value)傅里叶级数 (FS,Fourier Series)傅里叶变换 (FT,Fourier Transform)傅里叶逆变换 (IFT,Inverse Fourier Transform)离散谱 (Discrete Spectrum)连续谱 (Continuous Spectrum)傅里叶谱 (Fourier Spectrum)线性谱 (Linear Spectrum)幅值谱 (Amplitude Spectrum)相位谱 (Phase Spectrum)均方值 (Mean Square Value)方差 (Variance)协方差 (Covariance)自协方差函数 (Auto-covariance Function)互协方差函数 (Cross-covariance Function)自相关函数 (Auto-correlation Function)互相关函数 (Cross-correlation Function)标准偏差 (Standard Deviation)相对标准偏差 (Relative Standard Deviation)概率 (Probability)概率分布 (Probability Distribution)高斯概率分布 (Gaussian Probability Distribution) 概率密度 (Probability Density)集合平均 (Ensemble Average)时间平均 (Time Average)功率谱密度 (PSD,Power Spectrum Density)自功率谱密度 (Auto-spectral Density)互功率谱密度 (Cross-spectral Density)均方根谱密度 (RMS Spectral Density)能量谱密度 (ESD,Energy Spectrum Density)相干函数 (Coherence Function)帕斯瓦尔定理 (Parseval''''s Theorem)维纳,辛钦公式 (Wiener-Khinchin Formula2 振动系统的固有特性、激励与响应振动系统 (Vibration System)激励 (Excitation)响应 (Response)单自由度系统 (Single Degree-Of-Freedom System) 多自由度系统 (Multi-Degree-Of- Freedom System) 离散化系统 (Discrete System)连续体系统 (Continuous System)刚度系数 (Stiffness Coefficient)自由振动 (Free Vibration)自由响应 (Free Response)强迫振动 (Forced Vibration)强迫响应 (Forced Response)初始条件 (Initial Condition)固有频率 (Natural Frequency)阻尼比 (Damping Ratio)衰减指数 (Damping Exponent)阻尼固有频率 (Damped Natural Frequency)对数减幅系数 (Logarithmic Decrement)主频率 (Principal Frequency)无阻尼模态频率 (Undamped Modal Frequency)模态 (Mode)主振动 (Principal Vibration)振型 (Mode Shape)振型矢量 (Vector Of Mode Shape)模态矢量 (Modal Vector)正交性 (Orthogonality)展开定理 (Expansion Theorem)主质量 (Principal Mass)模态质量 (Modal Mass)主刚度 (Principal Stiffness)模态刚度 (Modal Stiffness)正则化 (Normalization)振型矩阵 (Matrix Of Modal Shape)模态矩阵 (Modal Matrix)主坐标 (Principal Coordinates)模态坐标 (Modal Coordinates)模态分析 (Modal Analysis)模态阻尼比 (Modal Damping Ratio)频响函数 (Frequency Response Function)幅频特性 (Amplitude-frequency Characteristics)相频特性 (Phase frequency Characteristics)共振 (Resonance)半功率点 (Half power Points)波德图(Bodé Plot)动力放大系数 (Dynamical Magnification Factor)单位脉冲 (Unit Impulse)冲激响应函数 (Impulse Response Function)杜哈美积分(Duhamel’s Integral)卷积积分 (Convolution Integral)卷积定理 (Convolution Theorem)特征矩阵 (Characteristic Matrix)阻抗矩阵 (Impedance Matrix)频响函数矩阵 (Matrix Of Frequency Response Function) 导纳矩阵 (Mobility Matrix)冲击响应谱 (Shock Response Spectrum)冲击激励 (Shock Excitation)冲击响应 (Shock Response)冲击初始响应谱 (Initial Shock Response Spectrum)冲击剩余响应谱 (Residual Shock Response Spectrum)冲击最大响应谱 (Maximum Shock Response Spectrum)冲击响应谱分析 (Shock Response Spectrum Analysis3 模态试验分析模态试验 (Modal Testing)机械阻抗 (Mechanical Impedance)位移阻抗 (Displacement Impedance)速度阻抗 (Velocity Impedance)加速度阻抗 (Acceleration Impedance)机械导纳 (Mechanical Mobility)位移导纳 (Displacement Mobility)速度导纳 (Velocity Mobility)加速度导纳 (Acceleration Mobility)驱动点导纳 (Driving Point Mobility)跨点导纳 (Cross Mobility)传递函数 (Transfer Function)拉普拉斯变换 (Laplace Transform)传递函数矩阵 (Matrix Of Transfer Function)频响函数 (FRF,Frequency Response Function)频响函数矩阵 (Matrix Of FRF)实模态 (Normal Mode)复模态 (Complex Mode)模态参数 (Modal Parameter)模态频率 (Modal Frequency)模态阻尼比 (Modal Damping Ratio)模态振型 (Modal Shape)模态质量 (Modal Mass)模态刚度 (Modal Stiffness)模态阻力系数 (Modal Damping Coefficient)模态阻抗 (Modal Impedance)模态导纳 (Modal Mobility)模态损耗因子 (Modal Loss Factor)比例粘性阻尼 (Proportional Viscous Damping)非比例粘性阻尼 (Non-proportional Viscous Damping)结构阻尼 (Structural Damping,Hysteretic Damping)复频率 (Complex Frequency)复振型 (Complex Modal Shape)留数 (Residue)极点 (Pole)零点 (Zero)复留数 (Complex Residue)随机激励 (Random Excitation)伪随机激励 (Pseudo Random Excitation)猝发随机激励 (Burst Random Excitation)稳态正弦激励 (Steady State Sine Excitation)正弦扫描激励 (Sweeping Sine Excitation)锤击激励 (Impact Excitation)频响函数的H1 估计 (FRF Estimate by H1)频响函数的H2 估计 (FRF Estimate by H2)频响函数的H3 估计 (FRF Estimate by H3)单模态曲线拟合法 (Single-mode Curve Fitting Method)多模态曲线拟合法 (Multi-mode Curve Fitting Method)模态圆 (Mode Circle)剩余模态 (Residual Mode)幅频峰值法 (Peak Value Method)实频-虚频峰值法 (Peak Real/Imaginary Method)圆拟合法 (Circle Fitting Method)加权最小二乘拟合法 (Weighting Least Squares Fitting method) 复指数拟合法 (Complex Exponential Fitting method)1.2 振动测试的名词术语1 传感器测量系统传感器测量系统 (Transducer Measuring System)传感器 (Transducer)振动传感器 (Vibration Transducer)机械接收 (Mechanical Reception)机电变换 (Electro-mechanical Conversion)测量电路 (Measuring Circuit)惯性式传感器 (Inertial Transducer,Seismic Transducer)相对式传感器 (Relative Transducer)电感式传感器 (Inductive Transducer)应变式传感器 (Strain Gauge Transducer)电动力传感器 (Electro-dynamic Transducer)压电式传感器 (Piezoelectric Transducer)压阻式传感器 (Piezoresistive Transducer)电涡流式传感器 (Eddy Current Transducer)伺服式传感器 (Servo Transducer)灵敏度 (Sensitivity)复数灵敏度 (Complex Sensitivity)分辨率 (Resolution)频率范围 (Frequency Range)线性范围 (Linear Range)频率上限 (Upper Limit Frequency)频率下限 (Lower Limit Frequency)静态响应 (Static Response)零频率响应 (Zero Frequency Response)动态范围 (Dynamic Range)幅值上限 Upper Limit Amplitude)幅值下限 (Lower Limit Amplitude)最大可测振级 (Max.Detectable Vibration Level)最小可测振级 (Min.Detectable Vibration Level)信噪比 (S/N Ratio)振动诺模图 (Vibration Nomogram)相移 (Phase Shift)波形畸变 (Wave-shape Distortion)比例相移 (Proportional Phase Shift)惯性传感器的稳态响应 (Steady Response Of Inertial Transducer)惯性传感器的稳击响应 (Shock Response Of Inertial Transducer)位移计型的频响特性 (Frequency Response Characteristics Vibrometer)加速度计型的频响特性 (Frequency Response Characteristics Accelerometer) 幅频特性曲线 (Amplitude-frequency Curve)相频特性曲线 (Phase-frequency Curve)固定安装共振频率 (Mounted Resonance Frequency)安装刚度 (Mounted Stiffness)有限高频效应 (Effect Of Limited High Frequency)有限低频效应 (Effect Of Limited Low Frequency)电动式变换 (Electro-dynamic Conversion)磁感应强度 (Magnetic Induction, Magnetic Flux Density)磁通 (Magnetic Flux)磁隙 (Magnetic Gap)电磁力 (Electro-magnetic Force)相对式速度传 (Relative Velocity Transducer)惯性式速度传感器 (Inertial Velocity Transducer)速度灵敏度 (Velocity Sensitivity)电涡流阻尼 (Eddy-current Damping)无源微(积)分电路 (Passive Differential (Integrate) Circuit) 有源微(积)分电路 (Active Differential (Integrate) Circuit) 运算放大器 (Operational Amplifier)时间常数 (Time Constant)比例运算 (Scaling)积分运算 (Integration)微分运算 (Differentiation)高通滤波电路 (High-pass Filter Circuit)低通滤波电路 (Low-pass Filter Circuit)截止频率 (Cut-off Frequency)压电效应 (Piezoelectric Effect)压电陶瓷 (Piezoelectric Ceramic)压电常数 (Piezoelectric Constant)极化 (Polarization)压电式加速度传感器 (Piezoelectric Acceleration Transducer) 中心压缩式 (Center Compression Accelerometer)三角剪切式 (Delta Shear Accelerometer)压电方程 (Piezoelectric Equation)压电石英 (Piezoelectric Quartz)电荷等效电路 (Charge Equivalent Circuit)电压等效电路 (Voltage Equivalent Circuit)电荷灵敏度 (Charge Sensitivity)电压灵敏度 (Voltage Sensitivity)电荷放大器 (Charge Amplifier)适调放大环节 (Conditional Amplifier Section)归一化 (Uniformization)电荷放大器增益 (Gain Of Charge Amplifier)测量系统灵敏度 (Sensitivity Of Measuring System)底部应变灵敏度 (Base Strain Sensitivity)横向灵敏度 (Transverse Sensitivity)地回路 (Ground Loop)力传感器 (Force Transducer)力传感器灵敏度 (Sensitivity Of Force Transducer)电涡流 (Eddy Current)前置器 (Proximitor)间隙-电压曲线 (Voltage vs Gap Curve)间隙-电压灵敏度 (Voltage vs Gap Sensitivity)压阻效应 (Piezoresistive Effect)轴向压阻系数 (Axial Piezoresistive Coefficient)横向压阻系数 (Transverse Piezoresistive Coefficient)压阻常数 (Piezoresistive Constant)单晶硅 (Monocrystalline Silicon)应变灵敏度 (Strain Sensitivity)固态压阻式加速度传感器 (Solid State Piezoresistive Accelerometer) 体型压阻式加速度传感器 (Bulk Type Piezoresistive Accelerometer) 力平衡式传感器 (Force Balance Transducer)电动力常数 (Electro-dynamic Constant)机电耦合系统 (Electro-mechanical Coupling System)2 检测仪表、激励设备及校准装置时间基准信号 (Time Base Signal)李萨茹图 (Lissojous Curve)数字频率计 (Digital Frequency Meter)便携式测振表 (Portable Vibrometer)有效值电压表 (RMS Value Voltmeter)峰值电压表 (Peak-value Voltmeter)平均绝对值检波电路 (Average Absolute Value Detector)峰值检波电路 (Peak-value Detector)准有效值检波电路 (Quasi RMS Value Detector)真有效值检波电路 (True RMS Value Detector)直流数字电压表 (DVM,DC Digital Voltmeter)数字式测振表 (Digital Vibrometer)A/D 转换器 (A/D Converter)D/A 转换器 (D/A Converter)相位计 (Phase Meter)电子记录仪 (Lever Recorder)光线示波器 (Oscillograph)振子 (Galvonometer)磁带记录仪 (Magnetic Tape Recorder)DR 方式(直接记录式) (Direct Recorder)FM 方式(频率调制式) (Frequency Modulation)失真度 (Distortion)机械式激振器 (Mechanical Exciter)机械式振动台 (Mechanical Shaker)离心式激振器 (Centrifugal Exciter)电动力式振动台 (Electro-dynamic Shaker)电动力式激振器 (Electro-dynamic Exciter)液压式振动台 (Hydraulic Shaker)液压式激振器 (Hydraulic Exciter)电液放大器 (Electro-hydraulic Amplifier)磁吸式激振器 (Magnetic Pulling Exciter)涡流式激振器 (Eddy Current Exciter)压电激振片 (Piezoelectric Exciting Elements)冲击力锤 (Impact Hammer)冲击试验台 (Shock Testing Machine)激振控制技术 (Excitation Control Technique)波形再现 (Wave Reproduction)压缩技术 (Compression Technique)均衡技术 (Equalization Technique)交越频率 (Crossover Frequency)综合技术 (Synthesis Technique)校准 (Calibration)分部校准 (Calibration for Components in system)系统校准 (Calibration for Over-all System)模拟传感器 (Simulated Transducer)静态校准 (Static Calibration)简谐激励校准 (Harmonic Excitation Calibration)绝对校准 (Absolute Calibration)相对校准 (Relative Calibration)比较校准 (Comparison Calibration)标准振动台 (Standard Vibration Exciter)读数显微镜法 (Microscope-streak Method)光栅板法 (Ronchi Ruling Method)光学干涉条纹计数法 (Optical Interferometer Fringe Counting Method)光学干涉条纹消失法 (Optical Interferometer Fringe Disappearance Method) 背靠背安装 (Back-to-back Mounting)互易校准法 (Reciprocity Calibration)共振梁 (Resonant Bar)冲击校准 (Impact Exciting Calibration)摆锤冲击校准 (Ballistic Pendulum Calibration)落锤冲击校准 (Drop Test Calibration)振动和冲击标准 (Vibration and Shock Standard)迈克尔逊干涉仪 (Michelson Interferometer)摩尔干涉图象 (Moire Fringe)参考传感器 (Reference Transducer)3 频率分析及数字信号处理带通滤波器 (Band-pass Filter)半功率带宽 (Half-power Bandwidth)3 dB 带宽 (3 dB Bandwidth)等效噪声带宽 (Effective Noise Bandwidth)恒带宽 (Constant Bandwidth)恒百分比带宽 (Constant Percentage Bandwidth)1/N 倍频程滤波器 (1/N Octave Filter)形状因子 (Shape Factor)截止频率 (Cut-off Frequency)中心频率 (Centre Frequency)模拟滤波器 (Analog Filter)数字滤波器 (Digital Filter)跟踪滤波器 (Tracking Filter)外差式频率分析仪 (Heterodyne Frequency Analyzer) 逐级式频率分析仪 (Stepped Frequency Analyzer)扫描式频率分析仪 (Sweeping Filter Analyzer)混频器 (Mixer)RC 平均 (RC Averaging)平均时间 (Averaging Time)扫描速度 (Sweeping Speed)滤波器响应时间 (Filter Response Time)离散傅里叶变换 (DFT,Discrete Fourier Transform) 快速傅里叶变换 (FFT,Fast Fourier Transform)抽样频率 (Sampling Frequency)抽样间隔 (Sampling Interval)抽样定理 (Sampling Theorem)抗混滤波 (Anti-aliasing Filter)泄漏 (Leakage)加窗 (Windowing)窗函数 (Window Function)截断 (Truncation)频率混淆 (Frequency Aliasing)乃奎斯特频率 (Nyquist Frequency)矩形窗 (Rectangular Window)汉宁窗 (Hanning Window)凯塞-贝塞尔窗 (Kaiser-Bessel Window)平顶窗 (Flat-top Window)平均 (Averaging)线性平均 (Linear Averaging)指数平均 (Exponential Averaging)峰值保持平均 (Peak-hold Averaging)时域平均 (Time-domain Averaging)谱平均 (Spectrum Averaging)重叠平均 (Overlap Averaging)栅栏效应 (Picket Fence Effect)吉卜斯效应 (Gibbs Effect)基带频谱分析 (Base-band Spectral Analysis)选带频谱分析 (Band Selectable Sp4ctralAnalysis) 细化 (Zoom)数字移频 (Digital Frequency Shift)抽样率缩减 (Sampling Rate Reduction)功率谱估计 (Power Spectrum Estimate)相关函数估计 (Correlation Estimate)频响函数估计 (Frequency Response Function Estimate) 相干函数估计 (Coherence Function Estimate)冲激响应函数估计 (Impulse Response Function Estimate) 倒频谱 (Cepstrum)功率倒频谱 (Power Cepstrum)幅值倒频谱 (Amplitude Cepstrum)倒频率 (Quefrency)4 旋转机械的振动测试及状态监测状态监测 (Condition Monitoring)故障诊断 (Fault Diagnosis)转子 (Rotor)转手支承系统 (Rotor-Support System)振动故障 (Vibration Fault)轴振动 (Shaft Vibration)径向振动 (Radial Vibration)基频振动 (Fundamental Frequency Vibration)基频检测 (Fundamental Frequency Component Detecting) 键相信号 (Key-phase Signal)正峰相位 (+Peak Phase)高点 (High Spot)光电传感器 (Optical Transducer)同相分量 (In-phase Component)正交分量 (Quadrature Component)跟踪滤波 (Tracking Filter)波德图 (Bode Plot)极坐标图 (Polar Plot)临界转速 (Critical Speed)不平衡响应 (Unbalance Response)残余振幅 (Residual Amplitude)方位角 (Attitude Angle)轴心轨迹 (Shaft Centerline Orbit)正进动 (Forward Precession)同步正进动 (Synchronous Forward Precession)反进动 (Backward Precession)正向涡动 (Forward Whirl)反向涡动 (Backward Whirl)油膜涡动 (Oil Whirl)油膜振荡 (Oil Whip)轴心平均位置 (Average Shaft Centerline Position)复合探头 (Dual Probe)振摆信号 (Runout Signal)电学振摆 (Electrical Runout)机械振摆 (Mechanical Runout)慢滚动向量 (Slow Roll Vector)振摆补偿 (Runout Compensation)故障频率特征 (Frequency Characteristics Of Fault) 重力临界 (Gravity Critical)对中 (Alignment)双刚度转子 (Dual Stiffness Rotor)啮合频率 (Gear-mesh Frequency)间入简谐分量 (Interharmonic Component)边带振动 (Side-band Vibration)三维频谱图 (Three Dimensional Spectral Plot)瀑布图 (Waterfall Plot)级联图 (Cascade Plot)阶次跟踪 (Order Tracking)阶次跟踪倍乘器 (Order Tracking Multiplier)监测系统 (Monitoring System)适调放大器 (Conditional Amplifier)趋势分析 (Trend Analysis)倒频谱分析 (Cepstrum Analysis)直方图 (Histogram)确认矩阵 (Confirmation Matrix)通频幅值 (Over-all Amplitude)幅值谱 (Amplitude Spectrum)相位谱 (Phase Spectrum)报警限 (Alarm Level)。
适用于轴承故障诊断的数据增强算法
2021577轴承故障诊断在制造业的故障预测和健康管理中起着十分重要的作用。
除了传统的故障诊断方法以外,学者们将改进过的机器学习[1-4]和深度学习算法[5-8]应用于故障诊断领域,其诊断效率与准确率得到了较大的提高。
在大部分应用中,这些算法有两个共同点[9]:第一、根据经验风险最小化原则(Empirical Risk Minimization,ERM)[10]训练故障诊断模型。
第二、使用此原则训练的诊断模型的性能优劣主要取决于所使用的训练样本的数量和质量。
但在工业应用中,数据集中正负样本的比例不平衡:故障数据包含着区分类别的有用信息,但是所占比例较少。
此外由于机器的载荷、转轴转速等工况的不同,所记录的数据并不服从ERM原则中的独立同分布假设。
这两点使得ERM原则不适用于训练工业实际场景中的故障诊断模型,并且文献[11]表明使用ERM原则训练的模型无法拥有较好的泛化性能。
数据增强算法是邻域风险最小化原则[12](Vicinal Risk Minimization,VRM)的实现方式之一,能够缓解ERM原则所带来的问题。
在VRM中通过先验知识来构建每个训练样本周围的领域区域,然后可从训练样本的领域分布中获取额外的模拟样本来扩充数据集。
例如,对于图像分类来说,通过将一个图片的领域定义为其经过平移、旋转、翻转、裁剪等变化之后的集合。
但与机器学习/深度学习中的数据不同,故障诊断中的数据(例如轴承故障诊断中的振动信号)具有明显的物理意义和机理特征,适用于机器视觉的数据增强方法可能导致物理意义的改变。
因此,本文从信号处理和信号分析的角度出发,设计了一种适用于轴承故障诊断中振动信号的数据增强方法。
适用于轴承故障诊断的数据增强算法林荣来,汤冰影,陈明同济大学机械与能源工程学院,上海201804摘要:针对在轴承故障诊断中存在的故障数据较少、数据所属工况较多的问题,提出了一种基于阶次跟踪的数据增强算法。
该算法利用阶次跟踪中的角域不变性,对原始振动信号进行时域重采样从而生成模拟信号,随后重新计算信号的幅值来抵消时域重采样以及环境噪声对原始信号能量的影响,最后使用随机零填充来保证信号在变化过程中采样长度不变。
RCVD翻译21章中英文对照
Suspe nsion spri ng悬架弹簧In triducti on介绍In this chapter we will discuss ways to calculate(approximately)certa in properties of在这一章中我们将讨论如何计算(约)的某些特性suspension system springs . We will concentrate on spring rate and maximum stressbut弹簧悬挂系统。
我们将集中在春季率和最大应力而also touch OU problems associated with usage , i. e., fatigue。
The types of springscovered也抚摸你相关的问题与使用,即,fatigue.the类型的弹簧盖will in clude torsi on spri ngs , coil spri ngs , and leafspri ngs .将包括扭力弹簧,螺旋弹簧,和leafsprings。
The material covered is insufficient for detailed design engineering calculations--forthat材料覆盖是不够详细的工程计算,设计一一the reader will have to go to the literature , especially the referenced SAE desig n hand-读者将要去的文学,尤其是汽车设计方面的参考一books and spring manufacturers ' handbooks书籍和弹簧manufacturers'handbooks 。
21 . 1 Torsio n Spri ngs21.1个扭转弹簧In a torsi on spri ng the elastic properties ofa long thi n “ bar' ' in tors ion( twist)is used to在扭簧的弹性性能的细长的酒吧去扭转(扭曲)是用来produce a rectilinear spring rate that is comparable to that era coil spring , The spring产生直线弹簧率相比,时代的螺旋弹簧,弹簧load or forceis usually con verted to torque around the cen terl ine of the bar by means负载或forceis通常转化为扭矩围绕中心线的酒吧的手段of a lever arm at one or both (anti-roll bar)ends . Figure 21 . 1 gives the basic geometry of杠杆臂的一个或两个(防侧倾杆) en ds.figure21.1给出了基本几何a tors ion spri ng .扭转弹簧。
机械设计制造与自动化专业英语翻译超级大全
Unit 1 MetalsUnit 2 Selection of Construction Materials淬透性:指在规定条件下,决定钢材淬硬深度和硬度分布的特性。
即钢淬火时得到淬硬层深度大小的能力,它表示钢承受淬火的能力。
钢材淬透性好与差,常用淬硬层深度来表示。
淬硬层深度越大,则钢的淬透性越好。
钢的淬透性是钢材本身所固有的属性,它只取决于其本身的部因素,而与外部因素无关。
钢的淬透性主要取决于它的化学成分,特别是含增大淬透性的合金元素与晶粒度,加热温度和保温时间等因素有关。
淬透性好的钢材,可使钢件整个截面获得均匀一致的力学性能以与可选用钢件淬火应力小的淬火剂,以减少变形和开裂。
淬透性主要取决于其临界冷却速度的大小,而临界冷却速度则主要取决于过冷奥氏体的稳定性,影响奥氏体的稳定性主要是:1.化学成分的影响碳的影响是主要的,当C%小于1.2%时,随着奥氏体中碳浓度的提高,显著降低临界冷却速度,C曲线右移,钢的淬透性增大;当C%大于时,钢的冷却速度反而升高,C曲线左移,淬透性下降。
其次是合金元素的影响,除钴外,绝大多数合金元素溶入奥氏体后,均使C曲线右移,降低临界冷却速度,从而提高钢的淬透性。
2.奥氏体晶粒大小的影响奥氏体的实际晶粒度对钢的淬透性有较大的影响,粗大的奥氏体晶粒能使C曲线右移,降低了钢的临界冷却速度。
但晶粒粗大将增大钢的变形、开裂倾向和降低韧性。
3.奥氏体均匀程度的影响在相同冷度条件下,奥氏体成分越均匀,珠光体的形核率就越低,转变的孕育期增长,C曲线右移,临界冷却速度减慢,钢的淬透性越高。
4.钢的原始组织的影响钢的原始组织的粗细和分布对奥氏体的成分将有重大影响。
5.部分元素,例如Mn,Si等元素对提高淬透性能起到一定作用,但同时也会对钢材带来其他不利的影响。
可锻性(forgeability)金属具有热塑性,在加热状态(各种金属要求温度不同),可以进行压力加工,称为具有可锻性。
可锻性:指金属材料在压力加工时,能改变形状而不产生裂纹的性能。
机械测试技术英语词汇
机械测试技术英语词汇机械工程测试技术词汇注释第一章periodic signal 周期信号transient signal 瞬态信号non-periodic/aperiodic signal非周期信号quasiperiodic signal 准周期信号stationary random signa稳态随机信号analog signal 模拟信号digital signal 数字信号sampled signal 取样信号energy signal 能量信号power signal 功率信号time domain 时域frequency domain 频域amplitude 幅值spectrum 频谱amplitude spectrum 幅频谱phase spectrum 相频谱coefficient 系数Fourier coefficient 傅里叶系数Fourier series 傅里叶级数constant 常量integrable 可积的angular/circular frequency圆角频率odd function 奇函数even function 偶函数fundamental frequency 基频harmonic 谐波module 模Fourier transform 傅里叶变换Fourier transform pair 傅里叶变换对rectangular function矩形窗函数exponential 指数positive 正数negative 负数partial fraction 部分分式symmetry/duality 对称性scaling property 时间尺度改变特性decay 衰减convolution 卷积set 集合random process 随机过程probability density function概率密度函数ergodic 各态历经time shifting 时移frequency shift 频移probability 概率denote 指示abscissa 横坐标ordinate 纵坐标duration 持续时间sinusoidal 正弦的origin 原点differentiate 求微分arbitrary 任意的coordinate 坐标normal distribution 正态分布Poisson distribution 泊松分布standard deviation 标准差correlation function 相关函数密度函数autocorrelation function 自相关函数power spectral density function 功率谱密度函数cross-correlation function 互相关函数mean value 均值variance 方差covariance 协方差mean square value 均方值unit impulse function 单位脉冲函数linear 线性的mathematical expectation 数学期望第二章static performance 静态特性dynamic performance 动态特性excitation 激励accuracy 准确度linearity 线性度nonlinearity 非线性度range 量程span 范围precision 精密度sensitivity 灵敏度resolution 分辨率hysteresis 回程误差full-scale deflection 最大偏置量drift 漂移gain 增益linear time invariant(lti) 线性时变系统offset 偏移transfer function 传递函数frequency response function 频率响应函数frequency preservation property 频率保持特性superposition property 线性叠加性proportionality 比例特性differentiation 微分特性integration 积分特性amplitude -frequency characteristic 幅频特性phase-frequency characteristic 相频特性weighting function 权函数parallel combination 并联环节组合series combination 串联环节组合first-order system 一阶系统second-order system 二阶系统time constant 时间常数step input 阶跃信号damping ratio 阻尼比undamped natural frequency 无阻尼固有频率critically damped 临界阻尼over damped 过阻尼overshoot 超调量non-distortional measuring system不失真测量loading effects 负载效应第三章transducers 传感器sensing elements 敏感元件operating principles 工作原理resistive transducers 电阻式传感器resistance 电阻值resistor 电阻器resistivity of material 电阻率cross-sectional area 截面面积resistance strain-gauges 电阻应变计sliding-contact devices 滑线变阻器piezo-resistance 压阻效应foil strain gauges 箔式应变计Poisson's ratio 泊松比gauge factor 灵敏度dielectric constant 介电常数capacitive transducers 电容式传感器stray capacitance 寄生电容capacitor 电容chopper 限幅deform 变形inductance 电感值inductor 电感inductive transducers 电感式传感器simple permeance-varying 可变磁阻式variable self-inductance 自感式variable mutual-inductance 互感式numbers of turns 线圈匝数reluctance 磁阻armatures 衔铁eddy current 涡流式linear variable differential 差动式resonant frequency 谐振频率transformer 变压器electro-magnetic transducers 磁电式传感器induced electromotive force 感生电动势translational velocity type 线速度型angular velocity type 角速度型diaphragm 隔板piezo-electric transducers 压电式传感器thermocouple 热电偶thermoelectric transducers 热电式传感器optical encoder 光学编码器fiber optics transducers 光纤传感器bond 粘结impedance 阻抗flux 磁通permeability 磁导率permittivity 电容率第四,五章DC bridges 直流电桥AC bridges 交流电桥Wheatstone bridges 惠斯通电桥single-arm-half-bridges 单臂半桥double-arm-bridges 双臂半桥full-bridges 全桥compensation 补偿the null type 归零法the deflection type 偏值法modulation 调制demodulation 解调modem 调制解调器modulated-signal 已调制信号carrier 载波modulating-signal 调制信号phase modulation 调相frequency modulation 调频amplitude modulation 调幅synchronizing 同步解调phase-sensible demodulation 相敏解调rectifying demodulation 整流检波low pass filter 低通滤波器high pass filter 高通滤波器band pass filter 带通滤波器band stop filter 带阻滤波器cut-off frequencies 截止频率half-power point 半功率点band width 带宽octave selectivity 倍频程选择性rectangular coefficient 矩形系数active filter 有源滤波器passive filter 无源滤波器normalized frequency 相关频率multiplier 乘法器amplifier 放大器operational amplifier 运算放大器inverting 反相的non-inverting 同相的follower/buffer 跟随器quantization 量化仅供参考!预祝大家考试顺利!。
机械设计制造及其自动化英文
英文原文:Mechanical properties of materialsThe material properties can be classified into three major headings: (1)physical, (2)chemical,(3) mechanicalPhysical propertiesDensity or specific gravity, moisture content, etc。
,can be classified under this category.Chemical propertiesMany chemical properties come under this category. These include acidity or alkalinity,react6ivity and corrosion。
The most important of these is corrosion which can be explained in layman's terms as the resistance of the material to decay while in continuous use in a particular atmosphere。
Mechanical propertiesMechanical properties include in the strength properties like tensile, compression,shear, torsion,impact,fatigue and creep。
The tensile strength of a material is obtained by dividing the maximum load, which the specimen bears by the area of cross-section of the specimen。
矿井提升机_外文翻译
外文翻译部分:英文原文Mine-hoist fault-condition detection based on the wavelet packet transform and kernel PCAAbstract: A new algorithm was developed to correctly identify fault conditions and accurately monitor fault development in a mine hoist. The new method is based on the Wavelet Packet Transform (WPT) and kernel PCA (Kernel Principal Component Analysis, KPCA). For non-linear monitoring systems the key to fault detection is the extracting of main features. The wavelet packet transform is a novel technique of signal processing that possesses excellent characteristics of time-frequency localization. It is suitable for analyzing time-varying or transient signals. KPCA maps the original input features into a higher dimension feature space through a non-linear mapping. The principal components are then found in the higher dimension feature space. The KPCA transformation was applied to extracting the main nonlinear features from experimental fault feature data after wavelet packet transformation. The results show that the proposed method affords credible fault detection and identification.Key words: kernel method; PCA; KPCA; fault condition detection1 IntroductionBecause a mine hoist is a very complicated and variable system, the hoist will inevitably generate some faults during long-terms of running and heavy loading. This can lead to equipment being damaged , to work stoppage, to reduced operating efficiency and may even pose a threat to the security of mine personnel. Therefore, the identification of running faults has become an important component of the safety system. The key technique for hoist condition monitoring and fault identification isextracting information from features of the monitoring signals and then offering a judgmental result. However, there are many variables to monitor in a mine hoist and, also, there are many complex correlations between the variables and the working equipment. This introduces uncertain factors and information as manifested by complex forms such as multiple faults or associated faults, which introduce considerable difficulty to fault diagnosis and identification [1].There are currently many conventional methods for extracting mine hoist fault features, such as Principal Component Analysis(PCA) and Partial Least Squares (PLS) [2]. These methods have been applied to the actual process. However, these methods are essentially a linear transformation approach. But the actual monitoring process includes nonlinearity in different degrees. Thus, researchers have proposed a series of nonlinear methods involving complex nonlinear transformations. Furthermore, these non-linear methods are confined to fault detection: Fault variable separation and fault identification are still difficult problems.This paper describes a hoist fault diagnosis feature exaction method based on the Wavelet Packet Transform (WPT) and kernel principal component analysis(KPCA). We extract the features by WPT and then extract the main features using a KPCA transform, which projects low-dimensional monitoring data samples into ahigh-dimensional space. Then we do a dimension reduction and reconstruction back to the singular kernel matrix. After that, the target feature is extracted from the reconstructed nonsingular matrix. In this way the exact target feature is distinct and stable. By comparing the analyzed data we show that the method proposed in this paper is effective.2 Feature extraction based on WPT and KPCA2.1 Wavelet packet transformThe wavelet packet transform (WPT) method [3],which is a generalization of waveletdecomposition, offers a rich range of possibilities for signal analysis. The frequency bands of a hoist-motor signal as collected by the sensor system are wide. The useful information hides within the large amount of data. In general, some frequencies of the signal are amplified and some are depressed by the information. That is to say, these broadband signals contain a large amount of useful information: But the information can not be directly obtained from the data. The WPT is a fine signal analysis method that decomposes the signal into many layers and gives a better resolution in the time-frequency domain.The useful information within the different frequency bands will be expressed by different wavelet coefficients after the decomposition of the signal. The concept of “energy information” is presented to identify new information hidden the data. An energy eigenvector is then used to quickly mine information hiding within the large amount of data.The algorithm is:Step 1: Perform a 3-layer wavelet packet decomposition of the echo signals andextract the signal characteristics of the eight frequency components, from low to high, in the 3rd layer.Step 2: Reconstruct the coefficients of the wavelet packet decomposition. Use 3 j S (j =0, 1, …, 7) to denote the reconstructed signals of each frequency band range in the 3rd layer. The total signal can then be denoted as:730j j s S ==∑ (1)Step 3: Construct the feature vectors of the echo signals of the GPR. When the coupling electromagnetic waves are transmitted underground they meet variousinhomogeneous media. The energy distributing of the echo signals in each frequency band will then be different. Assume that the corresponding energy of 3 j S (j =0, 1,…,7) can be represented as3 j E (j =0, 1, …, 7). The magnitude of the dispersed points of the reconstructed signal 3 j S is: jk x (j =0,1, …, 7; k =1, 2, …, n ), where n is the length of the signal. Then we can get:22331()n j j jk k E S t dt x ===∑⎰ (2)Consider that we have made only a 3-layer wavelet package decomposition of the echo signals. To make the change of each frequency component more detailed the 2-rank statistical characteristics of the reconstructed signal is also regarded as a feature vector:2311()njk j jk k D x x n ==-∑ (3) Step 4: The 3 j Eare often large so we normalize them. Assume that E =thus the derived feature vectors are, at last:T=[30313637/1,/1,.......,/1,/1E E E E ] (4) The signal is decomposed by a wavelet package and then the useful characteristicinformation feature vectors are extracted through the process given above. Compared to other traditional methods, like the Hilbert transform, approaches based on the WPT analysis are more welcome due to the agility of the process and its scientificdecomposition.2.2 Kernel principal component analysisThe method of kernel principal component analysis applies kernel methods to principal component analysis[4–5].1,1,2,...,,0.MNk k k Letx R k M x =∈==∑The principal component is the element at the diagonal after the covariance matrix ,11M T ij j C x x M ==∑has been diagonalized.Generally speaking, the first N values along the diagonal, corresponding to the large eigenvalues, are the useful information in the analysis. PCA solves the eigenvalues and eigenvectors of the covariance matrix. Solving the characteristic equation [6]:11()M j j j c xx M λννν===∙∑ (5)where the eigenvalues 0λ≠ and the eigenvectors {}\0N R ν∈ is essence of PCA. Let the nonlinear transformations, Φ: RN → F , x → X , project the original space into feature space, F . Then the covariance matrix, C , of the original space has the following form in the feature space:11()()M T i jJ C x x M ==ΦΦ∑ (6)Nonlinear principal component analysis can be considered to be principal component analysis of C in the feature space, F . Obviously, all the eigenvalues of C (0)λ≠ and eigenvectors, V ∈F \ {0} satisfy λV =C V . All of the solutions are in the subspace that transforms from (),1,2,...,j x i M Φ=(())(),1,2,...,k k x V x C V k M λΦ=Φ= (7)There is a coefficient i α Let1()Mi i i V x α=Φ=∑ (8) From Eqs.(6), (7) and (8) we can obtain:111(()())1(()())(()())Mi k j i M M i k j k j i j a x x a x x x x Mλ===ΦΦΦ=ΦΦΦ∑∑∑ (9) where k =1, 2, ….., M . Define A as an M ×M rankmatrix. Its elements are:()()ij i j A x x =ΦΦ (10)From Eqs.(9) and (10), we can obtain M λAa =2A a . This is equivalent to:M λa =Aa . (11)Make 12....M λλλ≤≤≤ as A ’s eigenvalues, and 12,,...,M ααα,as the correspondingeigenvector.We only need to calculate the test points’ projections on the eigenvectors k V that correspond to nonzero eigenvalues in F to do the principal component extraction. Defining this as k βit is given by:1(())(())Mkk i i k i V x x x αβ=Φ()Φ=Φ=∑ (12) Principal component we need to know the exact form of the non-linear image. Also as the dimension of the feature space increases the amount of computation goes up exponentially. Because Eq.(12) involves an inner-product computation,()()i x x ΦΦ according to the principles of Hilbert-Schmidt we can find a kernel function that satisfies the Mercer conditions and makes (,)()()i i K x x x x =ΦΦ Then Eq.(12) can be written:1(())((,))Mkk i i k i V x K x x αβ=Φ==∑ (13) Here α is the eigenvector of K . In this way the dot product must be done in the original space but the specific form of x Φ()need not be known. The mapping,x Φ(), and the feature space, F , are all completely determined by the choice of kernel function[ 7–8].2.3 Description of the algorithmThe algorithm for extracting target features in recognition of fault diagnosis is: Step 1: Extract the features by WPT;Step 2: Calculate the nuclear matrix, K , for each sample,(1,2,...,)N i x R i N ∈= in the original input space, and (()())ij i K x x =ΦΦStep 3: Calculate the nuclear matrix after zero-mean processing of the mapping data in feature space;Step 4: Solve the characteristic equation M a =A a ;Step 5: Extract the k major components using Eq.(13) to derive a new vector. Because the kernel function used in KPCA met the Mercer conditions it can be used instead of the inner product in feature space. It is not necessary to consider the precise form of the nonlinear transformation. The mapping function can be non-linear and the dimensions of the feature space can be very high but it is possible to get the main feature components effectively by choosing a suitable kernel function andkernel parameters[9].3 Results and discussionThe character of the most common fault of a mine hoist was in the frequency of the equipment vibration signals. The experiment used the vibration signals of a mine hoist as test data. The collected vibration signals were first processed by wavelet packet. Then through the observation of different time-frequency energy distributions in a level of the wavelet packet we obtained the original data sheet shown in Table 1 by extracting the features of the running motor. The fault diagnosis model is used for fault identification or classification.Experimental testing was conducted in two parts: The first part was comparing the performance of KPCA and PCA for feature extraction from the original data, namely: The distribution of the projection of the main components of the tested fault samples. The second part was comparing the performance of the classifiers, which wereconstructed after extracting features by KPCA or PCA. The minimum distance and nearest-neighbor criteria were used for classification comparison, which can also test the KPCA and PCA performance. In the first part of the experiment, 300 faultsamples were used for comparing between KPCA and PCA for feature extraction. To simplify the calculations a Gaussian kernel function was used:22(,)(),()exp()2x y K x y x y φφσ-≤≥- 10 The value of the kernel parameter, σ , is between 0.8 and 3, and the interval is 0.4 when the number of reduced dimensions is ascertained. So the best correctclassification rate at this dimension is the accuracy of the classifier having the best classification results. In the second part of the experiment, the classifiers’ recognition rate after feature extraction was examined. Comparisons were done two ways: theminimum distance or the nearest-neighbor. 80% of the data were selected for training and the other 20% were used for testing. The results are shown in Tables 2 and 3.From Tables 2 and 3, it can be concluded from Tables 2 and 3 that KPCA takes less time and has relatively higher recognition accuracy than PCA.4 ConclusionsA principal component analysis using the kernel fault extraction method was described. The problem is first transformed from a nonlinear space into a linear higher dimension space. Then the higher dimension feature space is operated on by taking the inner product with a kernel function. This thereby cleverly solves complex computing problems and overcomes the difficulties of high dimensions and local minimization. As can be seen from the experimental data, compared to the traditional PCA the KPCA analysis has greatly improved feature extraction and efficiency in recognition fault states.References[1] Ribeiro R L. Fault detection of open-switch damage in voltage-fed PWM motor drive systems. IEEE Trans Power Electron, 2003, 18(2): 587–593.[2] Sottile J. An overview of fault monitoring and diagnosis in mining equipment. IEEE Trans Ind Appl, 1994, 30(5):1326–1332.[3] Peng Z K, Chu F L. Application of wavelet transform in machine condition monitoring and fault diagnostics: areview with bibliography. Mechanical Systems and Signal Processing, 2003(17): 199–221.[4] Roth V, Steinhage V. Nonlinear discriminant analysis using kernel function. In: Advances in Neural Information Proceeding Systems. MA: MIT Press, 2000: 568–574.[5] Twining C, Taylor C. The use of kernel principal component analysis to model data distributions. Pattern Recognition, 2003, 36(1): 217–227.[6] Muller K R, Mika S, Ratsch S, et al. An introduction tokernel-based learning algorithms. IEEE Trans on Neural Network, 2001, 12(2): 181.[7] Xiao J H, Fan K Q, Wu J P. A study on SVM for fault diagnosis. Journal of Vibration, Measurement & Diagnosis,2001, 21(4): 258–262.[8] Zhao L J, Wang G, Li Y. Study of a nonlinear PCA fault detection and diagnosis method. Information and Control,2001, 30(4): 359–364.[9] Xiao J H, Wu J P. Theory and application study of feature extraction based on kernel. Computer Engineering,2002, 28(10): 36–38.中文译文基于小波包变换和核主元分析技术的矿井提升机的自我故障检测摘要:这是一种新的运算法,它能正确识别矿井提升机的故障并且准确地监测矿井提升机故障的发展过程。
电子电工术语词汇大全(中英)
电子电工术语词汇大全(中英)Aa.c.b alance indicator,交流平衡指示器a.c.bridge,交流电桥a.c.c urrent calibrator,交流电流校准器a.c.current distortion,交流电流失真a.c.inducedpolarization instrument,交流激电仪a.c.potentiometer,交流电位差计a.c.resistance box,交流电阻箱a.c.standard resistor,交流标准电阻器a.c.voltage distortion,交流电压失真a.c.voltage distortion,交流电压校准器Abbe comparator,阿贝比长仪aberration,象差ability of anti prereduced component,抗先还原物质能力ablative thickness transducer (sensor),烧蚀厚度传感器abrasion testing machine,磨损试验机absolute calibration,绝对法校准absolute coil,独立线圈absoluteerror,绝对误差absolutegravimeter,绝对重力仪absolute gravity survey,绝对重力测量absolute humidity,绝对湿度absolute method,绝对法absolute moisture of the soil,土壤(绝对)湿度absolute pressure transducer(sensor),绝对压力传感器absolute pressure,绝对压力absolute read-out,单独读出absolute resolution,绝对分辨率absolute salinity,绝对盐度absolute stability of a linear system,线性系统的绝对稳定性absolute stability,绝对稳定性absolute static pressure of the fluid,流体绝对静压absolute temperature scale,绝对温标absolute(pressure transducer,绝对压力表absoluteerror of measurement,测量的绝对误差absorbance,吸光度absorbed current image,吸收电流象absorptance, 吸收比absorptiometer,吸收光度计absorption cell,吸收池absorption coefficient,吸收系数absorption correction,吸收修正absorption edges,吸收边absorption factor,吸收系数absorption hygrometer,吸收温度表absorption spectrum,吸收光谱absorption X-ray spectrometry,吸收X射线谱法absorptivity of an absorbing,吸引材料的吸收率absorptivity,吸收率abstract system,抽象系统abundance sensityivity,丰度灵敏度AC-ACLVDT displacement transducer,交流差动变压器式位移传感器accelerated test,加速试验acceleration error coefficient,加速度误差系数acceleration of gravity,重力加速度acceleration simulator,加速度仿真器acceleration transducer(sensor),加速度传感器acceleration,加速度accelerationg voltage,加速电压accelerometer,加速度计acceptance of the mass filter,滤质器的接收容限acceptance test,验(交)收检验access,存取access time,存取时间accessibility,可及性accessories of testing machine,试验机附件accessory hardware,附属硬件accessory of limited interchangeability,有限互换附件accessory(for a measuring instrument),(测量仪表的)附件accumulated error,积累误差accumulated time difference,累积时差accumulative raingauge,累积雨量器accumulator,累加器accuracy class,精(准)确度等级accuracy limit factor(of a protective current transformer), (保护用电流互感器的)精确度极限因数accuracy of measurement,测量精(准)确度accuracy of the wavelength,波长精确度accuracy rating,精确度限accuracy,精(准)确度acetylene regulator,乙炔减压器acetylene(pressure)gauge,乙炔压力表acoustic amplitude logger,声波幅度测井仪acoustic beacon,水声信标acoustic current meter,声学海流计acoustic element,声学元件acoustic emission amplitude,声发射振幅acoustic emission analysis system,声发射分析系统acoustic emission detection system,声发射检测系统acoustic emission detector,声发射检测仪acoustic emission energy,声发射能量acoustic emission event,声发射事件acoustic emission preamplifier,声发射前置放大器acoustic emission pulser,声发射脉冲发生器acoustic emission rate,声发射率acoustic emission rate,声发射信号acoustic emission signal processor(conditioner),声发射信号处理器acoustic emission source location and analysis system,声发射源定位及分析系统acoustic emission source location system,声发射源定位系统acoustic emission source,声发射源acoustic emission spectrum,声发射频谱acoustic emission technique,声发射技术acoustic emission transducer(sensor),声发射换能器acoustic emission,声发射acoustic fatigue,声疲劳acoustic impedance,声阻抗acoustic logging instrument,声波测井仪acoustic malfunction,声失效acoustic matching layer,声匹配层acoustic ratio,声比acoustic releaser,声释放器acoustic resistance,声阻acoustic thermometer,声学温度计;声波温度表acoustic tide gauge,回声验潮仪acoustic transponder,声应答器acoustic(quantity)transducer(sensor),声(学量)传感器acoustical frequency electric,声频大地电场仪acousticalhologram,声全息图acoustical holography by electron-beam scanning,电子束扫描声全息acoustical holography by laser scanning,激光束扫描声全息acoustical holography by mechanical scanning,机械扫查声全息acoustical holography,声全息acoustical imaging by Bragg diffraction,布拉格衍射声成像acoustical impedance method,声阻法acoustical lens,声透镜acoustically transparent pressure vessel,透声压力容器acquisition time,取数据时间actinometer,光能计;直接日射强度表;日射表active gauge length,有效基长active gauge width,有效基宽active metal indicated electrode,活性金属指示电极active remote sensing,主动遥感active transducer(sensor),有源传感器activeenergy meter,有功电度表activity,活度activity coefficient,活度系数actral transformation ratio of current transformer,电流互感器的实际变化actual material calibration,实物校准actual time of observation,实际观测时间actual transformation ratio of voltage transformer,电压互感器的实际变化actual value,实际值actual voltage ratio,实际电压比actuator bellows,执行机构波纹管actuator load,执行机构负载actuator power unit,执行机构动力部件actuator sensor interface(ASI),执行器传感器接口actuator shaft,执行机构输出轴actuator spring,执行机构弹簧actuator stem force,执行机构刚度actuator stem,执行机构输出杆actuator travel characteristic,执行机构行程特性actuator,执行机构;驱动器adaptation layer,适应层adaptive control system,适应控制系统adaptive control,(自)适应控制adaptive controller,适应控制器adaptive prediction,适应预报adaptive telemetering system,适应遥测系统adder,加法器addition method,叠加法additional correction,补充修正additivity of mass spectra,质谱的可迭加性address,地址adiabatic calorimeter,绝热式热量计adjust buffer total ion strength,总离子强度调节缓冲剂adjustable cistern barometer,动槽水银气压表adjustable relative humidity range,相对湿度可调范围adjustable temperature range,温度可调范围adjusted retention time,调整保留时间adjusted retention volume,调整保留体积adjuster,调整机构;调节器adjusting pin,校正针adjustment bellows,调节波纹管adjustment device,调整装置adjustment,调整adsorbent,吸附剂adsorption chromatography,吸附色谱法aerial camera,航空照相机aerial remote sensing,航空遥感aerialsurveying camera,航摄仪aerodynamic balance,空气动力学天平aerodynamic noise,气体动力噪声aerograph,高空气象计aerogravity survey,航空重力测量aerometeorograph,高空气象计aerosol,县浮微料;气溶胶aging of column,柱老化agitator,搅拌器agricultural analyzer,农用分析仪air capacitor,空气电容器air consumption,耗气量air damper,空气阻尼器air duct,风道air gun,空气枪air inlet,进风口air lock,气锁阀air outlet,回风口air pressrue balance,空气压力天平air pressure test,空气压力试验air sleeve,风(向)袋air temperature,气温air to close,气关air to open,气开air-borne gravimeter,航空重力仪air-deployable buoy,空投式极地浮标air-drop automatic station,空投自动气象站air-lock device,锁气装置air-tight instrument,气密式仪器仪表airborne electromagnetic system;AEM system,航空电磁系统airborne flux-gate magnetometer,航空磁通门磁力仪airborne gamma radiometer,航空伽玛辐射仪airborne gamma spectrometer,航空伽玛能谱仪airborne infrared spectroradiometer,机载红外光谱辐射计airborne optical pumping magnetometer,航空光泵磁力仪airborne proton magnetometer,航空甚低频电磁系统airborne XBT,机载投弃式深温计airgun controller,气控制器airmeter,气流表alarm summery panel,报警汇总画面alarm unit,报警单元albedograph,反射计alcohol thermometer,酒精温度表algorithm,算法algorithmic language,算法语言alidade,照准仪alignment instrument,准线仪alkali flame ionization detector(AFID),碱焰离子化检测器alkaline error,碱误差alkalinity of seawater,海水碱度all-sky camera,全天空照相机all-weather wind vane and anemometer,全天候风向风速计allocation problem,配置问题;分配问题allowable load impedance,允许的负载阻抗allowable pressure differential,允许压差allowable unbalance,许用不平衡量alpha spectrometer,α粒子能谱仪alternating(exchange)load,交变负荷alternating-current linear variable differential transformer(AC-ACLVDT), 交流极谱仪alternating temperature humidity test chamber,交变湿热试验箱altimeter,高度计altitude angle,高度角altitude meter,测高仪ambient humidity range,环境湿度范围ambient pressure error,环境压力误差ambient pressure,环境压力ambient temperature range,环境温度范围ambient temperature,环境ambient vibration,环境振动ambiguity error,模糊误差ammeter,电流表ammonia(pressure)gauge,氨压力表amount of precipitation,雨量amount of unbalance indicatior,不平衡量指示器amount of unbalance,不平衡量ampere-hour meter,安时计amplitude detector module,振幅检测组件amplitude error,振幅误差amplitude modulation(AM),幅度调制;调幅amplitude ratio-phase difference instrument,振幅比—相位差仪amplitude response,幅值响应amplitude,幅值amplitude-phase error,幅相误差analog computer,模拟计算机analog control,模拟控制analog data,模拟数据analog deep-level seismograhp,模拟深层地震仪analog input,模拟输入analog magnetic tape record type strong-motion instrument,模拟磁带记录强震仪analog model,模拟模型analog output,模拟输出analog seismograph tape recorder,模拟磁带地震记录仪analog simulation,模拟仿真analog stereopotter,模拟型立体测图仪analog superconduction magnetometer,模拟式超导磁力仪analog system,模拟系统analog telemetering system,模拟遥测系统analog transducer(sensor),模拟传感器analog-to-digital conversion accuracy,模-数转换精确度analog-to-digital conversion rate,模-数转换速度analogue computer,模拟计算单元analogue date,模拟数据analogue measuring instrument,模拟式测量仪器仪表analogue representation of a physical quantity,物理量的模拟表示analogue signal,模拟试验analogue-digital converter;A/D converter,模-数转换器;A/D转换器analogue-to-digital conversion,模/数转(变)换analysis of simulation experiment,仿真实验分析analytical balance,分析天平analytical electron microscope,分析型电子显微镜analytical gap,分析间隙analytical instrument,分析仪器analytical line,分析线analytical plotter,解析测图仪analyzer tube,分析管anechoic chamber,消声室;电波暗室anechoic tank,消声水池anemograph,风速计anemometer meast,测风杆anemometer tower,测风塔anemometer,风速表aneroid barograph,空盒气压计aneroid barometer,空盒气压表;空盒气压计aneroidograph,空盒气压计angle beam technique,斜角法angle beam testing,斜角法angle form,角型angle of attach,冲角angle of field of view,视场角angle of incidence,入射角angle of refraction,折射角angle of spread,指向角;半扩散角angle of view of telescope,望远镜视场角angle of X-ray projiction,X射线辐射圆锥角angle probe,斜探头angle resolved electron spectroscopy(ARES),角分辨电子谱法angle strain,角应变angle transducer(sensor),角度传感器angle valve,角形阀angle,角度anglg-attack transducer(sensor),迎角传感器angular acceleration transducer(sensor),角加速度传感器angular acceleration,角加速度angular displacement grationg,角位移光栅angular displacement,角加速度传感器angular displacement,角位移angular encoder,角编码器angular sensitivity,角灵敏度angular velocity transducer(sensor),角速度传感器annular chamber,环室annular coil clearance,环形线圈间隙annular space,环形间隙annunciator,信号源anode,阳极answering,应答anti-cavitation valve,防空化阀anti-contamination device,防污染装置anti-coupling bi-frequency induced polarization instrument,抗耦双频激电仪anti-magnetized varistor,消磁电压敏电阻器anti-stockes line,反斯托克线antiresonance frequency,反共振频率antiresonance,反共振aperiodic dampong,非周期阻尼;过阻尼aperiodic vibration,非周期振动aperture of pressure difference,压差光阑aperture photographic method,针孔摄影法aperture stop,孔径光栏aperture time,空隙时间aperture,光阑apparatus for measuring d.c.magnetic characteristic with ballistic galvanometer, 冲击法直流磁特性测量装置apparent temperature,表观温度appearance potential spectrometer(APS),出现电热谱法appearance potential spectrometer,出现电热谱仪appearance potentical,出现电位application layer protocol specification,应用层协议规范application layer service definition,应用室服务定义application layer(AL),应用层application software,应用软件approval,批准approximate absolute temperature scale,近似绝对温标aqueous vapour,水汽arc suppressing varstor,消弧电压敏电阻器arctic buoy,极地浮标area effect,面积影响area location,区域定位area of cross section of the main air flow,主送风方向横截面积argon ionization detector,氩离子化检测器argon-ion gun,氩离子枪arithmetic logic unit(ALU),算术逻辑运算单元arithmetic mean,算术平均值arithmetic weighted mean,算术加权平均值arithmetical mean deviation of the(foughness)profile,(粗糙度)轮廓的算术平均偏差arm error,不等臂误差armature,动铁芯array configuration,阵排列array,阵,阵列arrester varistor,防雷用电压敏电阻器articulated robot,关节型机器人artificial defect,人工缺陷artificial environment,人工环境artificial field method instrument,人工电场法仪器artificial intelligence,人工智能artificial seawater,人工海水ash fusion point determination meter,异步通信接口适配器asynchronous input,异步输入asynchronous transmission,异步传输atmidometer,蒸发仪,蒸发表atmometer,蒸发仪;蒸发表atmoradiograph,天电强度计atmosphere,气氛atmospheric counter radiation,天气向下辐射atmospheric electricity,大气电atmospheric opacity,大气不透明度atmospheric pressure altimeter,气压高度计atmospheric pressure ionization(API),大气压电离atmospheric pressure,气压atmospherics,天电;远程雷电atom force microscope,原子力显微镜atomic absorption spectrometry,原子吸收光谱法atomic fluorescence spectrometry,原子荧光光谱法atomic fluorescence spectrophotometer,原子荧光光度计atomicmass unit,原子质量单位atomic number correction,原子序数修正atomic-absorption spectrophotometer,原子吸收分光光度计atomin spectrum,原子光谱atomization,原子化atomizer,原子化器attenuation coefficient,衰减系数attenuation length,衰减长度attenuation,衰减attenuator,衰减器attitude transducer(sensor),姿态传感器attitude,姿态audio monitor,监听器audio-frequency spectrometer,声频频谱仪audit,审核Auger electron energy spectrometer(AEES),俄歇电子能谱仪Auger electron image,俄歇电子象Auger electron spectrometer,俄歇电子能谱仪Augerelectron spectroscopy(AES),俄歇电子能谱法aurora,极光auto-compensation logging instrument,电子自动测井仪auto-compound current transformer,自耦式混合绕组电流互感器auto-polarization compensator,自动极化补偿器autocorrelation function,自相关函数automatic a.c.,d.c.B-H curve tracer,交、直流磁特性自动记录装置automatic balancing machine,自动平衡机automatic control souce of vacuum,真空自动控制电源automatic control system,自动控制系统automatic control,自动控制automatic data processing,自动数据处理automatic exposure device,自动曝光装置automatic feeder for brine,盐水溶液自动补给器automatic focus and stigmator,自动调焦和消象散装置automatic level,自动安平水准仪automatic levelling compensator,视轴安平补偿器automatic programming,自动程度设计automatic radio wind wane and anemometer,无线电自动风向风速仪automatic railway weigh bridge,电子轨道衡automatic scanning,自动扫查automatic spring pipette,自动弹簧式吸液管automatic testing machine,自动试验机automatic titrator,自动滴定仪automatic tracking,自动跟踪automatic vertical index,竖直度盘指标补偿器automaticweather station,自动气象站automatic/manualstation;A/M station,自动/手动操作器automation,自动化automaton,自动机auxiliary attachment,辅件auxiliary controller bus(ACB),辅助控制器总线auxiliary crate controller,辅助机箱控制器auxiliary devices,辅助装置auxiliary equipment(of potentiometer),(电位差计的)辅助设备auxiliary gas,辅助气体auxiliary output signal,辅助输出信号auxiliary storage,辅助存储器auxiliary terminal,辅助端auxiliary type gravimeter,助动型重力仪availability,可用性available time,可用时间average availability,平均可用度average nominal characteristic,平均名义特性average sound level,平均声级average value of contarmination,污染的平均值average wind speed,平均风速average,平均值axial clearance,轴向间隙axial current flow method,轴向通电法axial load,轴向载荷axial sensitivity,轴向灵敏度axial vibration,轴向振动axis of rotation,摆轴;旋转轴axix of strain gauge,应变计(片)轴线BB-scope,B型显示back flushing,反吹background current,基流backgroundmass spectrum,本底质谱backgroundnoise,背景噪声backgroundprocessing,后台处理backgroundprogram,后台程度background,后台,背景,本底Backman thermometer,贝克曼温度计backscattered electron image,背散射电子象backward channel,反向信道baffle wall,隔板balance for measuring amount of precipitation,水量秤balance output,对称输出balance quality of rotor,转子平衡精度balance wieght,平衡块balance,天平balanced plug,平衡型阀芯balancing machine sensitivity,平衡机灵敏度balancing machine,平衡机balancing speed,平衡转速balancing,平衡ball pneumatic dead wieght tester,浮球压力计ball screw assembly,滚珠丝杠副ball valve,球阀ballistic galvanometer,冲击栓流计balzed grating,闪耀光栅band width of video amplifier,视频放大器频宽band,频带bandwidth,带宽bar primary bushing type current transformer,棒形电流互感器barograph,气压计barometer cistern,气压表水银槽barometer,气压表barometric correction,气压表器差修正barometrograph,空盒气压计barothermograph,气压温度计barrel distortion,桶形畸变;负畸变base line,基线base peak,基峰base unit(of measurement),基本(测量)单位base,基底baseband LAM,基带局域网baseline drift,基线漂移baseline noise,基线噪声baseline potential,空白电位baseline value,空白值basic NMR frequency,基本核磁共振频率basic standard,基础标准batch control station,批量控制站batch control,批量控制batch inlet,分批进样batch of strain gauge,应变计(片)批batch processing simulation,批处理仿真batch processing,成批处理Baud,波特bdaring support,支承架beam deflector,电子束偏转器beam path distance,声程beam ratio,声束比beam spot diameter,束斑直径beam,横梁;声速beam-deflection ultrasonic flowmeter,声速偏转式超声流量计beam-loading thermobalance,水平式热天平bearing axis,轴承中心线bearing,轴承;刀承beat frequency oscillator,拍频振荡器beat method(of measurement),差拍(测量)法Beaufort scale,蒲福风级Beckman differential thermometer,贝克曼温度计bed,机座Beer' law,比尔定律bell manometer,钟罩压力计bell prover,钟罩校准器bellows seal bonnet,波纹管密封型上阀盖bellows(pressure)gauge,波纹管压力表bellows,波纹管bench mark,水准点bending strength,弯曲强度bending vibration,弯曲振动bent stem earth thermometer,曲管地温表Besson nephoscope,贝森测云器betatron,电子回旋加速器;电子感应加速器bezel ring,盖环bi-directional vane,双向风向标;双风信标bias voltage,偏压bilateral current stabilizer,双向稳流器bimetallic element,双金属元件bimetallic instrument,双金属式仪表bimetallic temperature transducer(sensor),双金属温度传感器bimetallic thermometer,双金属温度计binary coded decimal(BCD),二-十进制编码binary control,二进制控制binary digital,二进制数字binary elastic scattering event,双弹性散射过程binary elastic scattering peak,双弹性散射峰binary element,二进制元binary signal,二进制信号biochemical oxygen demand (BOD)microbial transducer(sensor),微生物BOD传感器biochemical oxygen demand meter for seawater,海水生化需氧量测定仪biochemical quantity transducer(sensor),生化量传感器biological quantity transducer(sensor),生物量传感器biomedical analyzer,生物医学分析仪biosensor,生物传感器bird receiving system,吊舱接收系统bit error rate,误码率bit serial,位串行bit,比特;位bit-serial higgway,位串行信息公路bivane,双向风向标;双风信标black box,未知框black light filter,透过紫外线的滤光片black light lamp,紫外线照射装置blackbody chamber,黑体腔blackbody furnace,黑体炉blackbody,黑体bland test,空白试验block check,块检验block diagram,方块(框)图block length,字块长度blocktransfer,块传递block,块体;字块;字组;均温块blood calcium ion transducer(sensor),血钙传感器blood carbon dioxide transducer(sensor),血液二氧化碳传感器blood chloried ion transducer(sensor),血氯传感器blood electrolyte transducer(sensor),血液电解质传感器blood flow transducer(sensor),血流传感器blood gas transducer(sensor),血气传感器blood oxygen transducer(sensor),血氧传感器blood PH transducer(sensor),血液PH传感器blood potassium ion transducer(sensor),血钾传感器blood sodium ion transducer(sensor),血钠传感器blood-group immune transducer(sensor),免疫血型传感器blood-pressure transducer(sensor),血压传感器blood-volume transducer(sensor),血容量传感器blower device,鼓风装置bluff body,阻流体Bode diagram,博德图body temperature transducer,体温传感器bolometer,辐射热计;热副射仪bomb head tray,弹头托盘bonnet,上阀盖boomerang grab,自返式取样器boomeranggravity corer,自返式深海取样管booster,增强器bore(of liquid-in-glass thermometer),(玻璃温度计的)内孔borehloe gravimetry,井中重力测量borehole acoustic television logger,超声电视测井仪borehole compensated sonic logger,补偿声波测井仪borehole gravimeter,井中重力仪borehole thermometer,井温仪bottom flange,下阀盖bottom surface,底面bottom-loading thermobalance,下皿式热天平bottorm echo,底面反射波Bouguer's law,伯格定律Bourdon pressure sensor,弹簧管压力检测元件Bourdon tube(pressure)gauge,弹簧管压力表Bourdon tube,弹簧管;波登管box gauge,箱式验潮仪BP-scope,BP 型显示Bragg's equation,布拉格方程braking time,制动时间braking torque(of an integrating instrument),(积分式仪表的)制动力矩branch cable,支线电缆branch,分支breakdown voltage rating,绝缘强度breakpoint,断点breather,换气装置bremsstrahlung,韧致辐射bridge for measuring temperature,测温电桥bridge resistance,桥路电阻bridge's balance range,电桥平衡范围bridge,桥接器Brienll hardenss tester,布氏硬度计bright field electron image,明场电子象brightness,亮度Brinell hardnell penetrator,布氏硬度压头Brinell hardness number,布氏硬度值broad band spectrum,宽波段broad-band random vibration,宽带随机振动broadband LAN,定带局域网broadcast,广播BT-calibrationg installation,深温计(BT)检定装置bubble,水准泡bubble-tube,吹气管bucket thermometer,表层温度表buffer solution,缓冲溶液buffer storage,缓冲存储器buffer,缓冲器built-in galvanometer,内装式检流计built-in-weigthts,挂码bulb length(of liquid-in-glass thermometer),(玻璃温度计的)感温泡长度bulb(of filled system themometer),(压力式温度计的)温包bulb(of liquid-in-glass thermometer),(玻璃温度计的)感温泡bulb,温包;感温泡bulk type semiconductor strain gauge,体型半导体应变计bulk zinc oxide varistor,体型氧化锌电压敏电阻器bump test,连续冲击试验;颠簸试验bump testing machine,连续冲击台bump,连续冲击buoy array,浮标阵buoy float,浮标体buoy motion package,浮标运动监测装置buoy station,浮标站buoy,浮标buoyancy correction,浮力修正buoyancy level measuring device,浮力液位测量装置burden(of a instrument transformer),(仪用互感器的)负载burning method,燃烧法burst acoustic emission signal,突发传输bus line,总线bus master,总线主设备bus mother board,总线母板bus network,总线网bus slave,总线从设备bus topology,总线拓扑bus type current transformer,母线式电流互感器bus,总线bushing type current transformer,套管式流互感器busy state,忙碌状态busy,忙butterfly valve,蝶阀by-pass,旁路by-pass injector,旁通进样器by-pass manifold,旁路接头by-pass valve,旁通阀Byram anemometer,拜拉姆风速表byte frame,字节帧byte serial,字节串行byte,字节byte-serial highway,字节串行住信处公路CC-scope,C型显示cabinet ,柜cable noise,电缆噪声cable type current transformer,电缆式电流互感器cable-tension transducer,电缆张力传感器cage guiding,套筒导向cage,套筒;潜水罐笼cake adhesive retention meter,泥饼粘滞性测定仪calcuated nornal folw coefficient,正常计算流量系数calculated maximum flow coefficient,最大计算流量系数calibrate,定标calibrated measuringpvolumetric)tank,校准测量(容积计量)容器calibrating period,校准周期calibrating voltage,校准电压calibration (of thermometer),(温度计的)标定calibration block,标准试块calibration characteristics,校准特性;分度特性calibration coefficient of wave height,波高校正系数calibration component,校准组分calibration curve,校准曲线;分度曲线calibration cycle,校准循环calibration equation,校准公式,分度公式calibration equipment of reversing thermometers,颠倒温度表检定设备calibration factor of the primary device,一次装置的校准系数calibration gas mixture,校准混合气calibration hierarchy,校准层次calibration point,校准点;分度点calibration quantity,校准量calibration record,校准记录calibration rotor,标定转子calibration solution,校准液calibration table,校准表(格)calibration traceability,校准溯源性calibration,校准calibrator above ice-point,零上检定器calibrator below ice-point,零下检定器calibrator for ice-point,零点检定器calibrator,校验器caliper profiler,横幅厚度计calling,呼叫calomel electrode,甘汞电极calorifier,加热器calorimeter,热量计cam bezel ring,卡口式盖环CAMAC branch driver,CAMAC 分支驱动器CAMAC branch-highway,CAMAC 分支信息公路CAMAC compatible crate,CAMAC兼容机箱CAMAC crate assembly,CAMAC 机箱装置CAMAC crate,CAMAC 机箱CAMAChighway,CAMAC 信息公路CAMACmodule,CAMAC 模块CAMACoperation,CAMAC 操作CAMAC parallel highway,CAMAC 并行信息公路CAMAC serial driver,CAMAC 串行驱动器CAMAC serial highway,CAMAC 串行信息公路CAMAC system,CAMAC 系统camera length,相机长度camflex valve,偏心旋转阀Campbell-stokes sunshine recorder,聚集日照计;歇贝斯托克日照计canonical state variable,规范化状态变量capacitance balance,电容平衡capacitance hygrometer,电视湿度计capacitance pressure transducer,电容式压力传感器capacity correction,容量修正capacity factor,容量因子capillary column,毛细管柱capillary gas chromatograph,毛细管气相色谱仪capillary gas chromatography,毛细管气相色谱法capillary phenomenon,毛细现象capillary tube (of liquid-in-glass thermometer),(玻璃温度计的)毛细管capillary viscometer,毛细管粘度计capsule(pressure)gauge,膜盒压力表capsule,膜盒captive chains calibration,链码校准carat balance,克拉天平carbon and hydrogen analysis meter,碳氢元素分析仪carbon humidity-dependent resistor,碳湿敏电阻器card punch,卡片穿孔机card reader,卜片阅读机Carlson type strain gauge,卡尔逊应变计carrier gas,载气carrier ring,夹持环carrier sense multiple access with collision detection(CSMA/CD), 具有冲突检测的载波侦听多路访问carrier sense,载波侦听carrier sync,载波同步carrier,载波cartridge disk drive,盒式磁盘机cartridge disk,盒式磁盘cascade control,串级控制cascade system,串级系统cascade(inductive)voltage transformer,级联式(感应式)电压互感器case,外壳casing,外壳cassette,盒式磁带;卡式磁带;暗盒catadioptric telescope,折反射望远镜catalysis element,催化元件catalyticanalyzer,催化分析器catalytic chromatography,催化色谱法catalytic gas transducer(sensor),催化式气体传感器cathode of electron gun,电子枪阴极cathode ray null indicator,阴极射线指零仪cathode,阴极cavitation corrosion,气蚀cavitation noise,空化噪声cavitation,空化ceilometer,云幂仪cell constant,电池常数cell potential transducer(sensor),细胞电位传感器cell,电池;传感器Celsius temperature scale,摄氏温标Celsius temperature,摄氏温度Celsius,摄氏度center of strike,打击中心central conductor method,中心导体法;电流贯通法central principal inertia axis,中心主惯性轴central processing unit(CPU),中央处理单元central processor,中央处理器centrality, 集中性centralized control,集中控制centralized intelligence,集中智能centralized management system,集中管理系统centralized network,集中式网络centralized process control computer,集中型过程控制计算机centrifugal balancing machine,离心力式平衡机centrifugal tachometer,离心式转速表ceramic microphone,陶瓷传声器ceraunograph, 雷电计ceraunometer,雷电仪certificate of conformity,合格证书certificate of control,控制证书certification of conformity of an instrument for explosive atmosphere,防爆合格证certification system,认证体系certification,认证certified standard material,有证标准物质chained list,链接表change of temperature test,温度变化试验channel,信道;通道character code,字符码character recognition,字符识别character set,字符集;字符组character,字符character-at-time printer,一次一字符打印机(印刷机);串行打印机characteristic "fast",“快”特性characteristic "impulse",“脉冲”响应特性characteristic curve,特性曲线characteristic impedance,特性阻抗characteristic locus,特征轨迹characteristic X-ray,特征X射线characteristic"slow",“慢”特性charge amplifier,电荷放大器chargeneutralization,电荷中和chargesensitivity,电荷灵敏度chart drivingmechanism,传纸机构chart lines,记录纸分度线chart scale length,记录纸标度尺长度chart,记录纸closed loop transfer function,闭环传递函数closed loop zero,闭环零点closed position,关闭位置closed system,封闭系统closing valve time,关阀时间closure member,截流件cloud amount,云量cloud balancer,测支平衡器cloud base,云底cloud chamber,云室;云零室cloud detection radar,测云雷达cloud direction,云向cloud height indicator,云高指示器cloud height meter,云幂仪cloud searchlight,云幂灯cloud speed,云速cloud top,云顶cloud-base recorder,云底记录仪cloud-drop sampler,云滴取校器cloudiness radiometer,云辐射仪cloverleaf buoy,三叶浮标Coanda effect,附壁效应coarse vacuum,粗真空;前级真空coastal zone color scanner(CZCS),海岸带水色扫描仪coaxiality,同轴度code,代码;代号;规程;规范code converter;D/D converter,代码转换器;D/D转换器code-transparent data communication,代码透明的数据通信coded circle,编码度盘coefficient of chromatic aberration,色差系数coefficient of interference,干扰系数coefficient of radial distortion,径向畸变系数coefficient of rotational distortion,旋转畸变系数coefficient of spherical aberration,球差系数coefficient of variation,变异系数coercivity meter,矫顽力计coil galvanometer,线圈式振动子coil method,线圈材料coil method,线圈法coincidence discrimination,符合鉴别coincidence level,度盘合像装置cold test,寒冷试验cold-cathode source,冷阴极离子源collate,整理collector slit,接收器狭缝collector,集电器collimation axis,视轴collimation line,视准线collision,冲突,碰撞collisional activation mass spectrometer,碰撞激活质谱计collisional activation,碰撞激活colorimeter,比色计;色度计colour filter,颜色滤光片colour meter,水色计column capacity,柱效能column life,柱寿命columnswitching,柱切换column,镜筒column-parity field,列奇偶校验字段coma,彗差combination digital logger,数字式综合测井仪combination electrode,复合电极combination logging instrument,组合测井仪combination water meter,复式水表combined column,复合柱combined load testing machine,得合试验机combined pressure and vacuum gauge,压力真空表combined test cabinet,综合试验箱combined test,综合试验command accepted,命令接受command message,命令报文command operation,命令操作command,命令command-reply transaction,命令—回答事务commissioning test,运行试验common control signals,公共控制信号common magnet galvanometer,共磁式振动子common mode rejection ratio(CMRR),共模抑制比common mode rejection,共模抑制common mode signal,共模信号。
材料科学与工程专业英语第三版-翻译以及答案
UNIT 1一、材料根深蒂固于我们生活的程度可能远远的超过了我们的想象,交通、装修、制衣、通信、娱乐(recreation)和食品生产,事实上(virtually),我们生活中的方方面面或多或少受到了材料的影响。
历史上,社会的发展和进步和生产材料的能力以及操纵材料来实现他们的需求密切(intimately)相关,事实上,早期的文明就是通过材料发展的能力来命名的(石器时代、青铜时代、铁器时代)。
二、早期的人类仅仅使用(access)了非常有限数量的材料,比如自然的石头、木头、粘土(clay)、兽皮等等。
随着时间的发展,通过使用技术来生产获得的材料比自然的材料具有更加优秀的性能。
这些性材料包括了陶瓷(pottery)以及各种各样的金属,而且他们还发现通过添加其他物质和改变加热温度可以改变材料的性能。
此时,材料的应用(utilization)完全就是一个选择的过程,也就是说,在一系列有限的材料中,根据材料的优点来选择最合适的材料,直到最近的时间内,科学家才理解了材料的基本结构以及它们的性能的关系。
在过去的100年间对这些知识的获得,使对材料性质的研究变得非常时髦起来。
因此,为了满足我们现代而且复杂的社会,成千上万具有不同性质的材料被研发出来,包括了金属、塑料、玻璃和纤维。
三、由于很多新的技术的发展,使我们获得了合适的材料并且使得我们的存在变得更为舒适。
对一种材料性质的理解的进步往往是技术的发展的先兆,例如:如果没有合适并且没有不昂贵的钢材,或者没有其他可以替代(substitute)的东西,汽车就不可能被生产,在现代、复杂的(sophisticated)电子设备依赖于半导体(semiconducting)材料四、有时,将材料科学与工程划分为材料科学和材料工程这两个副学科(subdiscipline)是非常有用的,严格的来说,材料科学是研究材料的性能以及结构的关系,与此相反,材料工程则是基于材料结构和性能的关系,来设计和生产具有预定性能的材料,基于预期的性能。
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I nt J Coal Sci Technol (2019) 6(1):138-149https:///10.1007/s40789-019-0239-4Mechanical properties and charge signal characteristics in coal material failure under different loading pathsXin Ding ,©e Xiao-chun Xiao 2 • Di Wu 1 • Xiang-feng Lv 3Received: 15 September 2018/Revised: 24 November 2018/Accepted: 14 January 2019/Published online: 8 February 2019© The Author(s) 2019Abstract Rock burst is a catastrophic dynamic disaster caused by sudden failure and instability of coal, loading paths play an important role in the failure of coal, the coal failure process is associated with charge exception infonnation. Hence, violent coal failure mechanics and time-frequency domain distribution of charge signal such as rock burst under different loading paths should be studied in-depth. In this paper, grade and cyclic loading test were carried out for coal with impact tendency samples produced by blocks cored from 800 depth in Xiaoqing coal mine of the Tiefa coal group in northeast China. Theory discussion was carried out for the result of stress and strain, frequency-spectra analysis was conducted for the wavelet charge data, figures showing the evolution mechanism of mechanical properties and the relationship of time frequency domain amplitude of charge signals in coal with different loading paths and stage were obtained. The failure process and characteristics of coal under different loading paths were summarized. It found that the loading path changed the manner of energy accelerate-release, there were more plastic strain generation in coal under cyclic loading than that under grade loading, the former was more likely to cause greater damage and failure, then the strength of coal under cyclic loading is generally lower than that under grade loading, an energy conversion mechanical model of stress, damage and deformation was developed and explained the effect of the loading path. Charge signal was primarily distributed in the strengthening and peak stages, where there was a high amplitude pulse at each stress drop. The charge pulse was a type of low frequency signal with a primary frequency distribution range of 1 -100 Hz. Discussion on the charge generating mechanism from the perspective of friction slip, it demonstrated that the charge obtained during the coal failure process directly to stress loaded on and damage, the result verified it better. We propose that the research results in this study could be efficiently applied to daily mining activities, to provide an early warning and effectively avoid rock burst disaster.Keywords Rock burst • Coal failure • Loading path • Damage • Energy accelerate-release • Charge time-frequency signalList of symbolsStrain energy PStress f(7Actual stress s Stressed area elementse 'pPlastic strain D Damage variable 区1Xiao-chun Xiao AEffective loaded area Xin DingPeak strengthDingx9054@a Stress correction factor dEffective stressSchool of Mechanics and Engineering, Liaoning Technical Stress perpendicular to crack face 2University, Fuxin 123000, ChinaSliding friction coefficient Center of Rock Mechanics and Geological Disasters.n..Magnitude of charge Shaoxing University. Shaoxing 312009. Zhejiang. China W External work School of Civil and Resource Engineering, University of Science & Technology Beijing, Beijing 1()()()83, ChinaEElastic modulusg SpringerMechanical properties and charge signal characteristics in coal material failure under (139)8e Elastic deformation ideally?!e Actual elastic strainU Dissipated energyA Loaded areaE Effective elastic modulev,Max Strain of peak strengthb Failure stress-strain ratio(y x Stress parallel to crack face0Angel between crack extended direction and horiz o ntala x Acceleration alone the fractured surfacep Density of coal1IntroductionRock burst is a dynamic disaster that causes spontaneous, violent fracture of coal in underground mines,which primarily occurs in roadways and working faces.It can cause instantaneous failure of the coal mine and release elastic deformation energy sprayi n g shattered coal into the mini ng space,inflicting injury and destroying equipment.Rock burst has caused serious problems for underground mining in the past century(Alber et al.2009;Mark2016;Lan-nacchione and Tadolini2016),especially in China(Pan et al.2003:Jiang et al.2014).By the end of2()16,there were over140mines experiencing this problem.Along with deep coal mining,the frequency and scale of rock burst is increasing,posing a serious threat to daily pro-duction and the safety of the miners'lives.Thus,the pre-diction and mininiization of rock burst is a critical problem to be resolved.The main aim of this study was to investigate the cause and mechanical mechanism of coal failure.Since coal is the main part of rock burst,describing its mechanical behavior,energy acceleration,and the relationships between them correctly was the first step in this investi-gation.Coal as a special type of rock,whose mechanical properties are similar to rock.However,its pore-crack structure contributes to its properties of discontinuity, heterogeneity,and anisotropy.From a macroscopic view, in flue n ee of external loading on the failure and deformation behaviors,induced by a mining stress field,become substantially evident and it causes the rock burst hazard evaluation to become considerably more difficult.Understanding the connection between the loading path and the mechanical behavior of coal accurately is of substantial significance in forecasting the occurrence probability of a disaster.A considerable number of scholars had paid attention to coal mechanics,the mechanism of rock burst and the relationships between them(Aubertin et al.1994;Hoek and Brown199&Bobet and Einstein1998;Pan et al.2009; Wang et al.2011;Jaeger et al.2007),they observed that the maximum loading capacity improved with the increase in con f ining pressure,in a non-linear pattern.The energy dissipation and release play an important role in deformation and failure,it's the key to control the catastrophe (Salamon1984;Boler et al.1997;Peng et al.2015;Jiang et al.2011).Medhurst and Brown(1998)investigated the effects of scale on the mechanical behavior of coal, strength data was observed to be related to the degree of cieating or brightness of the coal wson et al. (2016)analyzed306coal records from the Pennsylvania State coal sample database,and observed that both inhere n t susceptibility and appropriate stress conditions are necessary to facilitate a dynamic failure.Aguado and Gonzalez (2009)conducted studies in tow mines and observed that sublevel caving is one of the methods primarily influencing the stress state,thus the condition of sublevel caving is an extremely import a n t parameter to prevent disaster in mines.Zhang et al.(2016)considered that if the width of the isolated coal pillar is not sufficiently large,the shallow coal seam would be damaged at first,and.subsequently,the high abutment pressure would be transferred to the deep coal seam that might cause an overall burst-in s tability accident.Pan et al.(2009)considered that the crack is primarily a tear-type crack under quasi-static loading,and could be analyzed with the mode I crack theory using the three-point bending experiment.The failure of coal is an evolutionary process from mesoscopic to macroscopic damage,and it includes crack propagation and beari ng structure in t eraction.During this process,faint charge would appear at the crack tip and fracture surface,which combines the action of the friction effect,piezoelectric effect,and other mechanisms.Volar-ovich and Parkhomenko(1954)detected micro electric signals for the first time in the rock failure experiment. Kuksenko(1997a,b)explored the effect of mechanical loading on electric field variation in natural dielectrics. Frid et al.(2003);Bahat et al.(2()()4):Rabinovitch et al. (2005)obtained a relationship between the width of a fracture and the wavelength,frequency,time duration,and rise-fall time of the emitted electromagnetic radiation (EMR)pulse.Song et al.(2012,2016)analyzed the EMR and dissipated energy,and a relationship between them was established using the voltage amplitude of the EMR signal during the coal failure process.Pan et al.(2013);Xiao et al.(2015)explored charge signal law under different loading rates of coal,granite,and sand rock,and explained0Springer140X. Ding et al.the charge generation mechanism from a microscopic viewpoint.Investigating the law of energy dissipation-release during the coal failure process, and the time-frequency distribution of charge signal, handing the relationship between them, using it to invert the stress and damage, to achieve the objective of early disaster warning and finally reduce disaster accident rates.2 Experimental system and methodsThe coal specimens were obtained from a depth of 80() ni in the Xiaoqing mine of the Tie f a Coal Group in northeast China, see in Fig. 1. In the long coal-forming process, the coal seams may not always extend in the horizontal direction, due to geological structure, then there had a certain angle between the coalbed bedding and the principal stress direc- lion. On the one hand, in order to eliminate the influence of the bedding on the test results as much as possible, on the other hand, it's also intended to explore the influence of bedding on the mechanical properties of coal. The core drill was drilled vertical and parallel to the bedding of coal block, the cylindrical specimens measuring 5() mm x 10() mm were prepared and divided into two groups, namely. I and II. which the group. I had a load direction parallel to the bed ding, group. II had a load direction perpendicular to the bedding in lhe experiment, both ends of each specimen were polished to ensure that the 什atness error was less than 土 0.02 mm, the samples is shown in Fig. 2.Tests were conducted at the Liaoning Key Laboratory of mine environmeand disaster inechanics, Liaoning Technical University, Fuxin. An MTS digital hydraulic servo testing machine was used for the uniaxial compres sion test, the load and displacement data was used to automatically obtain the measurements. The machine had acompression capacity of 600 kN with a resolution of 5%o, show in Fig. 3a.The charge exception information generated for the coal failure process was obtained by the self- developed charge signa 】 mon i tori ng system, which was included a micro electro sensitive alloy sheet, preamplifier, acquisition instrument, and computer, the devices is shown in Fig. 4.The cyclic and grade loading were con d ucted to investi- gating the effect of loading path on mechanical properties, energy dissipation and release characteristics, charge signal time- frequency domai n evolution of coal in deformation and fracture process. The test was carried out according to the following scheme. (1) Placed the coal specimen in the shield pressure cylinder, shown in Fig. 3b. (2) Set the axial dis placement control mode with a loading/unloading rate of 0.2 mni/min. input the displacenient point of loading and unloading to the control system, the data was automatically recorded by the computer six times per second, and the loading path set by programming, shown in Fig. 5. (3) Turn on the testing mac h i ne and charge signal mon i toring system simultaneously, applied axial loading until coal destroyed completely. (4) Stored the test data and recorded the fracture characteristics of coal. It should be pointed out that, the evide n ee for the selection of displace m em points was the strenglh of coal, which were the result of 10 samples under uniaxial compression.3 Experimental result and discussions3.1 Uniaxial mechanical properties of coalwith different loading paths and analysisIn Fig. 6a, b illustrated the typical stress-strain relationship of coal specimens at cyclic and grade loading, the resultsFig. 1 Location map of sample Xiaoqing mine of the Tiefa Coal Gro 叩Fig. 2 Coal specimens§SpringerMechanical properties and charge signal characteristics in coal material failure under (141)(a)(b)Fig.3Mechanical properties testing system,a MTS digital hydraulic servo testing machine,b Shield pressure cylinder,c Schematic diagram of test systemFig.4Charge signa)monitoring system,a Preamplifier and acqui-sition instruinent,b Circuit boarddemonstrated that the loading path had a significant effect on the mechanical characteristics of coal.The observation that the stress-strain curve of cyclic loading had certain differences compared with previous studies was unexpected,shown in Fig.6a,b.For each loading and unloading cycle,the curve formed an tk open-ing”in s tead of a Toop"(Jaeger et al.2007),and the size of“opening"increased with the cycle time.It also could be observed that the stress-strain curve of coal by the grade loading was considerably smoother than that by the cyclic loading,this phenomen o n was more pronounced in the results of the group.II.We divided evolution of stress into two parts:pre-peak and post-peak.At the pre-peak stage, when the specimen was under a cyclic loading path,the slope of the curve reduced with increased in the number of cycles.Notably,there was a distinct yield segment before reached the peak stress.When the specimen under grade loading,the slope of the curve was approximately constant(a)EE、3=・Alloz・sodFig.5The loading paths of program setting, a.Grade loading, b.Cyclic loadingEE、U OE SO dand the yield segment hardly existed.At the post-peak stage,the stress drop was slow when coal under cyclic loading,and the drop was sudden under grade loading.Failure of coal was a complex mechanical evolution process,which included not only elastic deformation,bu( also plastic deformation caused by damage.The mechanics of coal failure cannot be fully explained by only elastic or plastic deformation.Further,the failure process,owing to energy accumulation and release,which was a result of elastic and plastic deformation,thus,the phenomenon could be explained from the point of view of energy.②Springer142X.Ding et al.Strain(s)(a)Strain(£)(b)Fig.6Stress-strain curve,a group I:load direction parallel to bedding,b group II:load direction perpendicular to bedding The test was conducted by the testing machine.We proposed a function to describe the strain energy from machine work as follows:P={Px-Py^Pz}(1) W=[\p x ii+p y v+p-\\]ds(2) swhere/?x,p y,p7are the stress of x,y,z.//,v,w are the strain of x,y,z.W is the strain energy,s is the stressed area elements.In the uniaxial compression test/八=p x=0,then the strain energy is given by:W=]\j7-w]ds(3) sBased on elastic theory,the strain energy contained in the coal was the area under the stress-strain curve.In Fig.7,under external loading,the total strain of a pure elastomer was caused by elastic deformation,which expressed as the red dash line in the figure,the actual situation was express as the dark blue solid line.Therefore, the strain energy(W1)was equal to the area under stressstrain curve,which was the area enclosed by ted dash and could be described as:where E is the elastic modulus,W1is the strain energy,%is the ideal elastic deformation.Coal is an elastoplastic material,under the external loading,the strain not only included elastic strain,but also plastic strain.At the same times,we provided a definition that the plastic part was no carrying capacity“n(J the elastic part is load-bearing structure.In Fig.7,the coal actual energy contained was the blue dash enclosed and the(Essvhs(D)ssabs-------Actual stress-strain curvePure elastomer stress-strain curveStrain(E)(b)Fig.7A typical model of energy evolution,a Grade loading, b CYCLIC loadinggSpringerMechanical properties and charge signal characteristics in coal material failure under (143)relationship describes actual energy with elastic and plastic strain:de=ds f e+d^v(7) do'=Ed*:(8) W=I J Edi-,d84£,where o'is the actual stress,d e is actual elastic strain,is plastic strain.Based on the damage theory,under uniaxial stress, Broberg defined the damage variable as the ratio of nondestructive load area to actual destructive load area(Li 2002).expressed as:D=ln2A(10)The relationship between coal damage effective elastic modulus and elastic modulus is given by(1-D)Ewhere D is the damage variable,A and A are the loaded area and effective loaded area,respectively,E is the effective elastic modulus,in the analysis of Eq.(10),the actual elastic modulus became progressively smaller with increased in coal damage,subsequently Eq.(9)introduced the elastic modulus containing damage variables.We proposed the following function to describe the variation of energy with the elastic modulus and the damage variables:(13) where U is dissipated energy,defined it caused damage:I-D)Ed皿(14)For the Eq.(14)can be used to determine the dissipated energy and damage variables.The relational expression demonstrates that total energy is equal to external work during the loading process,which was proportional to the actual elastic-plastic strain combination"务+»the elastic part of which was converted to elastic strain energy, the other is converted to surface energy of cracks and promoted they development causing plastic failure at last, as the green area shown in Fig.7a,b.We observed that when all strain was elastic and no dissipation this behaved like a perfect elastomer,conversely,when it was plastic the energy dissipation as to forming damage caused the failed of coal.Thus,we concluded that when the total energy was constant,the more energy dissipation caused damage,the less elastic energy of coal,and vice versa.Once damage caused by plastic strain appeared,the dissipated energy in c reased and promoti ng further cracks source expansion, then the coal destruction was accelerated,as illustrated in Eq.(14).As shown in Fig.8,we could observed that the broken fragment of coal under grade loading was more complete than the one under cyclic loading.Further,it was evident that cyclic loading caused substantial damage when specimens had the same dependent variables.In addition,we thought that the result of“opening"in each loading-unloading cycle was mainly due to the rela-tionship of elastic and plastic strain.With the loading in c reased the elastic and plastic strain emerged inside of coal,unloading for the stress reach a certain value the stress-strain curve given an expression of the elastic part rebound.When loading again,there was the elastic deformation of elastic part and new damage to caused plastic strain,then the curve of loading can't along that of unloading before,that's why,there had an“opening”in(b)Fig.8Broken pictures of coal,a Grade loading,b Cyclic loadinggSpringer144X.Ding et al. each loading and unloading cycle.It worth notice that thesize of“opening"improved during multiple cycles,because the elastic part was much more than the plastic at initial phase,the damage accumulation gradually increases as the number of cycles and more plastic strain formed, which promoted more energy release and caused damage further,based on the Eq.(14),as the result,the difference between elastic strain amount of recovery during the unloading and that of compression during the loading was increased in each cycle,then the elastic the curves of loading can't along that of unloading before and the larger “opening”between two lines.As is known to all,the strength of coal bedding is much less than that of matrix (Jaeger et al.2007).and it's more likely damaged the latter. The bedding in the samples of group.1were compressed, but that of group.II were tension under external stress. Cracks produced in the bedding firstly and expansion easier,then the size of“opening"in group.II was larger than that in group.I.for the result shown in Fig.8.It also verified the rationality of the previous analysis.Counted the test results of all specimens treated separately accorded groups(I and II),lhe peak value of stress and its corresponding strain was investigated.As shown in Fig.9a,b,the results illustrated that the loading path had a significant effect on the strength.In general,the strength of coal under grade loading was higher than that under cyclic loading for both groups I and II.The relationship between the peak stress and its corresponding strain was an approximately linear function,which could be expressed as:=Cl+b?.Max(15) where<r Max is the peak stress,E Max is the strain of peak stress,we defined"a"as stress correction factor and"b" as failure stress-strain bined with the fitting results,both“q"and W were affected by the loading path,the angle of loading direction and the bedding,the smaller the angle,the smaller value of failure stress-strain ratio.According to the afore m e n tioned analysis,the loading path changed the phase of the energy release.In case of coal under grade loading,the external work converted into elastic energy of coal and the dissipated energy little. Shown in Fig.7a,after attaini ng peak st r e n gth,where the smaller the curve enveloping area,the less coal rupture was consumed,that the major energy was released concentrically at the post peak phase.When under cyclic loading, the elastic strain and plastic damage caused by repeated stress initiated cracking by fatigue.With the increased damage of coal,the elastic modulus became progressively smaller,as illustrated in Eq.(14).Then the dissipated energy further promoted cracks source expansion and caused energy to dissipate considerably.In Fig.7b.theEdw/sstJSjo JnwAdejd206v=4.0377+605.47463*x_〜x♦Cyclic loading▼Grade loading0.0100.0120.0140.0160.0180.020Strain(a).y-0.36084+416.72155*xBd-wssaJJSjo onwAZBad0.0100.0120.0140.0160.0180.020Strain(b)Fig.9The peak value of stress under different loading path,a Group 上loading direction perpendicular to bedding.I)Group II:loading direction parallel to bedding■Cyclic loading•Grade loadingexternal work converted into elastic and plastic energy. Further,the dissipated energy caused gradual energy release before peak stress.During to the energy release effect on coal failure,the cracks propagation promoted and the damage of coal was increased,the macroscopic manifestation of this was the energy release under grade loading was comparatively less than that for cyclic loading at pre-peak,the damage occurred in"advance”for the latter,as a result there had a lower peak stress of specimens under cyclic loading.The difference in energy release phase is the reason behind the effect of the loading path on the mechanical characteristics variation in coal.3.2Charge signal time-frequency characteristicsthiring coal failureIn this section we discussed the distribution of the signal in time and frequency domain,a set of typical data was selected for resular elaboration,as shown in Fis.10,itg SpringeiMechanical properties and charge signal characteristics in coal material failure under (145)demonstrated the charge time-domain signal at differentloading stages for coal under uniaxial loading,it worthnotice that the charge signal pulse demonstrated a satisfactory relationship with stress.From Fig.1(),it was evident that the high amplitude charge time-domain signal distribution had a satisfactory inversion of stress phases.At the compaction and elastic phase,few signal pulses appeared,until the later stages of the elastic phase,where low amplitude pulses occurred discretely.Owing to loading in the strengthening phase,the amplitude of signal pulse converted from low to high,and the distribution transformed from discrete to intensive as the stress in c reased.At the time of peak strength,there existed a distinct high amplitude signal,and subsequently at the post-peak phase,near ultimate destruction,the high amplitude signal became intensive.In particular,at each stress drop there was a high amplitude signal occuiTence.The set of typical frequencies obtained by Fourier transformation(FFT)to the charge waveform recorded for the samples,analysis of the spectrum of charge pulse production at different stages based on Nyquist sampling theorem,the characteristics of charge time-domain signal at different stress states was investigated,as shown in Fig.1L it illustrated the signal spectrum result,where the yellow line is time signal and the blue line is the corresponding frequency distribution.In Fig.1la,the signal was a regular sine wave,which was mainly the white noise of the laboratory power-line interference,and its frequency composition was fixed.During the coal was loaded from the elastic to the post peak phase,shown in Fig.1lb-d,the time-domain signal converted from a small fluctuation to a high amplitude pulse.Further,some flat phenomenon existed and the amplitude of frequency distribution increased considerably as the time-domain signal pulse improved,which is the ranging between1and100Hz.o521apnj二dul<Aul、apn=c.ulv5040(a)Charge time-domain signal Stress-time cruve n A nu^zc35o53220s u w s ao£. l«l l u L,/Strengthen phaseA/Elastic phasez*-------------------5o I{/Compaction phase Postpeak phase0100200300400500600700800Time(t)/sFig.10A typical charge time-domain signal during coal under uniaxial compression552211apnad-uv6()2040oooo864upnsdulv20time/s200300Frequency/Hz(b)200300Frequency/Hz(C)40050011.010.112o.iu(l.<MTime/s40050(1Auvapnzdluv2003(H)400500Frequency/Hz(d)146X.Ding et al.◄Fig.11The charge signal spectrum excited in different compressionphase,a Compaction phase,b Elastic phase,c Strengthen phase,d Post-peak phaseThus,it can be inferred that the charge is a type of low-frequency signal with primary frequency distribution from1to10()Hz,the feature of frequency is the most significantdifference between charge induction and electromagneticradiation(Frid et al.2003,2004,2005;Song et al.2012,2016).(a)3.3The charge tribological mechanism during coalfailure processPrevious studies demonstrated that the charge appearing inrock or coal failure processes was directly related to thecracks under the influence of a complicated mechanism,and the coal failure at uniaxial compression as a result oftension creak owing to micro shear slip(Xiao et al.2015).In this section we had provided a discussion on the chargeinduction mechanism from the perspective of tribology, which was caused by shear slip between both sides of the crack faces.Owing to the loading on the coal,the primary and new fractures developed gradually.Both sides of the crack face contacted and compressed each other under the action of the stress,and there was a relative displacement between them during the process of shear slip.Therefore,numbers of electrons formed on both sides,creating a charge effect that we monitored(Fig.12).For a crack,we assumed there was an angle()with the horizontal,under the action of force there was a relative slip,and concluded that the friction on the crack face was expressed as follows.(7=aexpD(17) where a is the effective stress.According to Amontons,first law,the stress loading on the crack face is represented as a x and(r v.as illustrated by Eqs.(17)and(18).(j x=g exp D(sin()—(.1cos0)(17) cr v=a exp D cos0(18) where(j x and are stresses parallel and perpendicular to the crack face,respectively,0is the angle between crack extension direction and the horizontal,and“is the sliding friction coefficient.Research illustrated that the charge created by the sliding friction was directly related to the positive pressure and the relative velocity(Budakian and Putterman2000; Zeghloul et al.2017).Fig.12Crack of coal variation and analysis,a The crack of coal, b Analysis for a crackn q ocHq*y v(19)(20) where n(/is magnitude of charge and v A.is relative velocity along the fractured surface.For one side of the crack,there was a relative displacement u to the other side,and the relative velocity was as shown in Eq.(23).During the coal failure process,the stress and the creak developmern controlled the charge affecting factors.The higher the stress loaded on and fragment,the higher is the charge signal monitored.d~u d(j x ds dn ex p D(si n0—“cos9)ds~d^t=pdV pdV(21) V.vdudtI cl(7exp£)(sin()—“cos0)dsdtn q ex rrexpD(22)(23) where ci x is acceleration along the fractured surface and p is density of coal.3.4Charge signal time-frequency characteristicsduring coal failure at different loading paths Based on the a f ore m e n tioned analysis,the energy accu-mulated-released law was affected by loading path.It had a direct impact on the mechanical properties.Simultaneously,the bearing of charge was affected bythe。