Pairing and persistent currents - the role of the far levels

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计算机网络英文题库(附答案)chapter3解析

计算机网络英文题库(附答案)chapter3解析

Chapter 3 Transport Layer1. A transport-layer protocol provides for logical munication between ____.A Application processesB HostsC RoutersD End systems2. Transport-layer protocols run in ____.A ServersBClientsCRoutersDEnd systems3. In transport layer, the send side breaks application messages into ____, passes to network layer.A FramesB SegmentsC Data-gramsD bit streams4. Services provided by transport layer include ____.A HTTP and FTPB TCP and IPC TCP and UDPD SMTP5. Which of the following services is not provided by TCP"A Delay guarantees and bandwidth guaranteesB Reliable data transfers and flow controlsC Congestion controlsD In-order data transfers6. These two minimal transport-layer services----____ and ____----are the only two services that UDP provides!A process-to-process data delivery, error checkingB congestion control, reliable data transferC flow control, congestion controlD In-order data transfer, error checking7. Port number’s scope is ____ to ____.A 0, 1023B 0, 65535C 0, 127D 0,2558. The port numbers ranging from ____to ____ are called well-known port number and are restricted.A 0, 1023B 0, 65535C 0, 127D 0,2559. UDP socket identified by two ponents, they are____.A source IP addresses and source port numbersB source IP addresses and destination IP addressesC destination IP address and destination port numbersD destination port numbers and source port numbers10. TCP socket identified by a (an) ____.A 1-tupleB 2-tupleC 3-tupleD 4-tuple11. Which of the following applications normally uses UDP services"A SMTPB Streaming multimediaC FTPD HTTP12.Reliable data transfer protocol over a perfectly reliable channel is____.A rdt1.0B rdt2.0C rdt3.0D rdt2.113.Reliable data transfer protocol over a channel with bit errors and packet losses is_ ___.A rdt1.0B rdt2.0C rdt3.0D rdt2.114.Which of the following about reliable data transfer over a channel with bit errors is not correct"A RDT2.0:assuming ACK and NAK will not be corruptedB RDT2.1:assuming ACK and NAK can be corruptedC RDT2.2:only use ACK-sD RDT2.2:use both ACK-s and NAK-s15.Which of the following protocols is not pipelining protocols"A TCPB rdt3.0C GO-BACK-ND selective repeat16.Which of the following is not correct about GBN protocol"A Only using ACK-sB Using cumulative ACK-sC Receiver discards all out-of-order packetsD It is not pipelined protocol17.Which of the following is not correct about SR protocol"A receiver individually acknowledges all correctly received packetsB sender only resends packets for which ACK not receivedC It limits sequence number of sent but un-ACK-ed packetsD It is not a pipelined protocol18. Which of the following about TCP connection is not correct"A It is a broadcast connectionB It is a point-to-point connectionC It is a pipelined connectionD It is a full duplex connection19. The SYN segment is used for____.A TCP connection setupB TCP flow controlC TCP congestion controlD Closing a TCP connection20. The FIN segment is used for____.A TCP connection setupB TCP flow controlC TCP congestion controlD Closing a TCP connection21.How does TCP sender perceive congestion"A Through a timeout eventB Through a receiving duplicate ACK-s eventC Both A and BD Either A or B22. Extending host-to-host delivery to process-to-process delivery is called transport-layer____ and .A multiplexing and de-multiplexingB storing and forwardingC forwarding and filteringD switching and routing23. UDP is a ____ service while TCP is a connection-oriented service.A ConnectionlessB ReliableC Connection-orientedD In-order24. The UDP header has only four fields, they are____.A Source port number, destination port number, length and checksumB Source port number, destination port number, source IP and destination IPC source IP, destination IP, source MAC address and destination MAC addressD source IP, destination IP, sequence number and ACK sequence number25. There are two 16-bit integers: 1110 0110 0110 0110, 1101 0101 0101 0101. Their checksum is____.A 00011B 11100C 11111D 0000026.The maximum amount of data that can be grabbed and placed in a segment is limited by the____.A Maximum segment size (MSS)B MTUC ChecksumD Sequence number27.The MSS is typically set by first determining the length of the largest link-layerframe that can be sent by the local sending host----the so-called____.A Maximum transmission unit (MTU)B MSSC ChecksumD Sequence number28. A File size of 500,000bytes, MSS equals 1000bytes. When we want to transmit this file with TCP, the sequence number of the first segment is 0, and the sequence number of the second segment is ____.A 1000B 999C 1001D 50000029.Because TCP only acknowledges bytes up to the first missing byte in the stream, TCP is said to provide____.A Cumulative acknowledgementsB Selective acknowledgementsC 3 duplicate ACKsD positive ACKs30. Provided α=0.125, current value of Estimated-RTT is 0.4s, Sample-RTT is 0.8s, then the new value of Estimated-RTT is ____s.A 0.45B 0.6C 0.7D 0.831.Provided RcvBuffer=20,LastByteRcvd=20,LastByteRead=15, thenRcvWindow=____.A 14B 15C 16D 1032. TCP service does not provide____.A Reliable data transferB Flow controlC Delay guaranteeD Congestion control33. There are two states in TCP congestion control, which are ____.A slow start and congestion avoidanceB safe start and congestion avoidanceC slow start and congestion abandonD safe start and congestion abandon34. The transport-layer protocol provides logical munication between ____, and the network-layer protocol provides logical munication ____.A hosts, processesB processes, hostsC threads, processesD processes, threads35.To implement the multicast services the Internet employs the____protocol.A FTPB TCPC IGMPD UDP36. If an application developer chooses ____ protocol, then the application process is almost directly talking with IP.A HTTPB RIPC CSMA/CDD UDP37. ____ maintains connection-state in the end systems. This connection state includes receive and send buffers, congestion-control parameters, and sequence and acknowledgment number parameters.A UDPB TCPC DNSD HTTP38. The host that initiates the session in the Internet is labeled as ____.A serverB user agentC clientD router39. With TCP there is no _____ between sending and receiving transport-layer entities.A flow controlB handshakingC.congestion control D VC setup40. The Internet’s ____ service helps prevent the Internet from entering a state of gridlock.A datagramB congestion controlC sliding windowD timeout event41. Connection setup at the transport layer involves ____.A serverB only the two end systemsC clientD router42. A ____layer protocol provides for logical munication between applications.A transportB applicationC networkingD MAC43. In static congestion window, if it satisfies W*S/R > RTT + S/R, the Latency is ____.A W*S/R – ( RTT+ S/R)B 2RTT + O/RC 2RTT + O/R + (k-1)[W* S/R- (RTT + S/R)]D 2RTT + S/R44. The receive side of transport layer reassembles segments into messages, passes to ____layer.A ApplicationB NetworkingC PhysicalD MAC45. In the following four options, which one is correct"A The variations in the SampleRTT are smoothed out in the putation of the EstimatedRTTB The timeout should be less than the connection’s RTTC Suppose that the last SampleRTT in a TCP connection is equal to 1 sec. Then the current value of TimeoutInterval will necessarily be≥1 secD Suppose that the last SampleRTT in a TCP connection is equal to 1 sec. Then the current value of TimeoutInterval will necessarily be≤1 sec46. The port number used by HTTP is ____.A 80B 25C 110D 5347. The port number used by SMTP is ____.A 80B 25C 110D 5348. The port number used by pop3 is ____.A 80B 25C 110D 5349. The port number used by DNS is ____.A 80B 25C 110D 5350. The port number used by FTP is ____.A 20 and 21B 20C 21D 5351. A UDP socket identified by a ____ tuple(s).A 2B 4C 1D 352. A TCP socket identified by a ____ tuple(s).A 2B 4C 1D 353. A TCP socket does not include____.A Source MAC addressB Source port numberC Destination IP addressD Destination port number54. Which of following about UDP is not correct.A It is a reliable data transfer protocolB It is connectionlessC no handshaking between UDP sender, receiverD it is a best effort service protocol55. DNS uses ____ service.A TCPB UDPC Both TCP and UDPD None of above56. Which of following about UDP is correct"A Finer application-level control over what data is sent, and whenB No connection establishment (which can add delay), so no delay for establish a connectionC No connection state (so, UDP can typically support many active clients)D Large packet header overhead (16-B)57. Streaming media uses a ____ service normally.A TCPB UDPC Both TCP and UDPD None of above58. The UDP header has only ____ fields.A 2B 4C 1D 359. Which of the following does not included in UDP header.A Source port numberB Destination port numberC ChecksumD Sequence number60. Which of the following is not a pipelining protocol.A Rdt1.0B Go-Back-NC Selective repeatD TCP61. In the following four descriptions about MSS and MTU, which one is not correct"A The MSS is the maximum amount of application-layer data in the segmentB The MSS is the maximum size of the TCP segment including headersC The MSS is typically set by MTUD The MTU means the largest link-layer frame62. The job of gathering data chunks, encapsulating each data chunk with header information to create segments and passing the segments to the network is called ____.A multiplexingB de-multiplexingC forwardingD routing63. In the following four descriptions about the relationship between the transport layer and the network layer, which one is not correct"A The transport-layer protocol provides logical munication between hostsB The transport-layer protocol provides logical munication between processesC The services that a transport-layer protocol can provide are often constrained by the service model of the network-layer protocolD A puter network may make available multiple transport protocols64. Suppose the following three 8-bit bytes: 01010101, 01110000, 01001100. What’s the 1s plement of the sum of these 8-bit bytes"A 00010001B 11101101C 00010010D 1000100065. The following four descriptions about multiplexing and de-multiplexing, which one is correct"A A UDP socket is identified by a two-tuples consisting of a source port number and a destination port number.B If two UDP segment have different source port number, they may be directed to thesame destination process.C If two TCP segments with different source port number, they may be directed to the same destination process.D If two TCP segments with same destination IP address and destination port number, they must be the same TCP connection.66. UDP and TCP both have the fields except ____.A source port numberB destination port numberC checksumD receive window67. If we define N to be the window size, base to be the sequence number of the oldest unacknowledged packet, and next-seq-num to be the smallest unused sequence number, then the interval [nextseqnum,base+N-1] corresponds to packet that ____.A can be sent immediatelyB have already been transmitted and acknowledgedC cannot be usedD have been sent but not yet acknowledged68. Which of the following about TCP is not correct"A It is a connectionless protocolB Point-to-point protocolC Reliable, in-order byte steam protocolD Pipelined protocol69. Which of the following about TCP is not correct"A It is a connectionless protocolB full duplex data transfer protocolC connection-oriented protocolD flow controlled protocol70. The maximum amount of data that can be grabbed and placed in a segment is limited by the ____.A Maximum segment size (MSS)B MTUC Sequence numberD Check sum71. The MSS is typically set by first determining the length of the largest link-layer frame that can be sent by the local sending host (the so-called____), and then will fit into a single link-layer frame.A Maximum segment size (MSS)B MTUC Sequence numberD Check sum72. The MSS is the maximum amount of ____layer data in the segment, not the maximum size of the TCP segment including headers.A ApplicationB TransportD Link73. Which of the following field is not used for connection setup and teardown"A Sequence numberB TSTC SYND FIN74. ____ is the byte stream number of first byte in the segment.A Sequence numberB ACK numberC ChecksumD port number75. ____ is the byte sequence numbers of next byte expected from other side.A Sequence numberB ACK numberC ChecksumD port number76. Because TCP only acknowledges bytes up to the first missing byte in the stream, TCP is said to provide ____ acknowledgements.A CumulativeB SelectiveC Single77. Fast retransmit means in the case that ____ duplicate ACK-s are received, the TCP sender resend segment before timer expires.A 3B 4C 5D 678. TCP____ means sender won’t overflow receiver’s buffer by transmitting too much, too fast.A Flow controlB Congestion controlC Reliable data transferD Connection-oriented service79. TCP provides flow control by having the sender maintain a variable called the ____.A Receive windowB Congestion windowC Sliding windowD buffer80. How does TCP sender perceive congestion"A TimeoutB 3 duplicate ACK-sC Both A and BD None of above81. Transport protocols run in ____.A ServersB ClientsC RoutersD End systems82. Which of the following services is not provided by TCP"A Delay guarantees and bandwidth guaranteesB Reliable data transfers and flow controlsC Congestion controlsD In-order data transfers83. Which service does UDP not provide"A multiplexingB de-multiplexingC error-detectionDerror-correction84. There are three major events related to data transmission and retransmission in the TCP sender, which one is not in it"A data received from application aboveB de-multiplexing segmentC timer timeoutD ACK receipt85. Which of the following applications normally uses UDP services"A SMTPB Streaming multimediaC FTPD HTTP86. Which of the following about TCP connection is not correct"A It is a broadcast connectionB It is a point-to-point connectionC It is a pipelined connectionD It is a full duplex connection87. The SYN segment is used for____.A TCP connection setupB TCP flow controlC TCP congestion controlD Closing a TCP connection88. Which service helps prevent the internet from entering a state of gridlock"A reliable data transferB flow controlC congestion controlD handshaking procedure89. The Internet’s _____is responsible for moving packets from one host to another.A application layerB transport layerC network layerD link layer90.In the following applications, which one is a bandwidth-sensitive application"AB web applicationC real-time audioD file transfer91. In the following applications, which one uses UDP"AB web applicationC file transferD DNS92. In the following four descriptions, which one is correct"A If one host’s transport layer uses TCP, then its network layer must use virtual-circuit network.B Datagram network provides connection serviceC The transport-layer connection service is implemented in the routerD The network-layer connection service is implemented in the router as well as in the end system.93.____ is a speeding-matching service---matching the rate which the sender is sending against the rate at which the receiving application is reading.A congestion controlB flow controlC sliding-window controlD variable control94. In the following four descriptions about Rcv-Window, which one is correct"A The size of the TCP RcvWindow never changes throughout the duration of the connectionB The size of the TCP RcvWindow will change with the size of the TCP RcvBufferC The size of the TCP RcvWindow must be less than or equal to the size of the TCP RcvBufferD Suppose host A sends a file to host B over a TCP connection, the number of unacknowledged bytes that A sends cannot exceed the size of the size of the RcvWindow.95. There are 6 flag fields. Which one is to indicate that the receiver should pass the data to the upper layer immediately"A PSHB URGC ACKD RST96. Suppose the TCP receiver receives the segment that partially or pletely fills in gap in received data, it will ____.A immediately send ACKB immediately send duplicate ACKC wait some time for arrival of another in-order segmentD send single cumulative97. _____ imposes constrain on the rate at which a TCP sender can send traffic into the network.A sliding windowB congestion windowC receive windowD variable window98. Flow control and congestion control are same at that they all limit the rate of the sender, but differ in that ____.A flow control limits its rate by the size of RcvWindow, but congestion control by the traffic on the linkB congestion control limits its rate by the size of RcvWindow, but flow control by the traffic on the linkC flow control mainly is acplished by the sender, but congestion control by the receiver.D flow control mainly is acplished by the receiver, but congestion control by the link.99. This job of delivering the data in a transport-layer segment to the correct socket is called ____.A multiplexingB de-multiplexingC forwardingD routing100. If we define N to be the window size, base to be the sequence number of the oldest unacknowledged packet, and next-seq-num to be the smallest unused sequence number, then the interval [base, nextseqnum-1] corresponds to packet that ____.A can be sent immediatelyB have already been transmitted and acknowledgedC cannot be usedD have been sent but not yet acknowledged101. ____ are the two types of transport services that the Internet provides to the applications.A TCP and UDPB connection-oriented and connectionless serviceC TCP and IPD reliable data transfer and flow control102. In the following descriptions about persistent connection, which one is not correct"A The server leaves the TCP connection open after sending a responseB Each TCP connection is closed after the server sending one objectC There are two versions of persistent connection: without pipelining and with pipeliningD The default mode of HTTP uses persistent connection with pipelining103. The field of Length in UDP segment specifies the length of ____.A the UDP segment, not including the headerB the UDP segment, including the headerC the UDP segment’s headerD the Length field104. In TCP segment header, which field can implement the reliable data transfer"A source port number and destination port numberB sequence number and ACK numberC urgent data pointerD Receive window105. In the following four descriptions about TCP connection management, which one is not correct"A Either of the two processes participating in a TCP connection can end the connectionB If the FIN bit is set to 1, it means that it wants to close the connectionC In the first two step of the three-way handshake, the client and server randomly choose an initial sequence numberD In the three segments of the three-way handshake, the SYN bit must be set to 1 106. Suppose host A sends two TCP segments back to back to host B over a TCP connection. The first segment has sequence number 42, and the second has sequence number 110. If the 1st is lost and 2nd arrives at host B. What will be the acknowledgment number"A 43B ACK42C 109D ACK1101.Consider sending an object of size O=500,000bytes from server to client. Let S=500bytes and RTT=0.2s. Suppose the transport protocol uses static windows with window size 5. For a transmission rate of 100Kbps, determine the latency for sending the whole object. Recall the number of windows K=O/ WS), and there is K-1 stalled state (that is idle time gaps).2.Consider the following plot of TCP congestion window size as a function of time.Fill in the blanks as follow:a) The initial value of Threshold at the first transmission round is ____. b) The value of Threshold at the 11st transmission round is ____. c) The value of Threshold at the 21st transmission round is ____. d) After the 9th transmission round, segment loss detected by ____.(A) Timeout (B) Triple duplicate ACKe) After the 19th transmission round, segment loss detected by ____.(A) Timeout (B) Triple duplicate ACKf) During ____ transmission round, the 18th segment is sent.0 00 Congestion window size Transmission round3.Consider the TCP reliable data transfer in the given graph. If in Segment 1’s Sequence number =10,data=“AC〞, please fill in the following blanks.a)In Segment 2, ACK number=____;b)In Segment 3, Sequence number =____; data=“0123456789”c)If there are some bits corrupted in segment 3 when it arrives Host B, then the ACKnumber in Segment 5 is ____; and the ACK number in Segment 6 is ____.12345674. The client A wants to request a Web page from Server B. Suppose the URL of the page is 172.16.0.200/experiment, and also it wants to receive French version of object.The time-sequence diagram is shown below, please fill in the blanks.12345Packet① to Packet③ are TCP connection’s segment, then:Packet ①: SYN flag bit= aACK flag bit= bSequence number= 92Packet ②: SYN flag bit=1ACK flag bit= cSequence number=100Packet ③: SYN flag bit= dACK flag bit=1Sequence number= e5. Consider sending an object of size O=100 Kbytes from server to client. Let S=536 bytes and RTT=100msec. Suppose the transport protocol uses static windows withwindow size W.(1) For a transmission rate of 25 kbps, determine the minimum possible latency. Determine the minimum window size that achieves this latency. (2) Repeat (1) for 100 kbps.6. Consider the following plot of TCP congestion window size as a function of time. Please fill in the blanks as below.a) The initial value of Threshold at the first transmission round is____.b) The value of Threshold at the 11th transmission round is_____.c) The value of Threshold at the 21st transmission round is_____.d) After the 9th transmission round, _____ occurs. 14 18 26 30 0 2 6 4 8 10 12 16 20 22 24 28 32 Congestion window size Transmission round 4 8 12 16e) After the 19th transmission round, ____ are detected.。

制冷专业英语大全e

制冷专业英语大全e

制冷专业英语根本术语制冷refrigeration蒸发制冷evaporative refrigeration沙漠袋desert bag制冷机refrigerating machine制冷机械refrigerating machinery制冷工程refrigeration engineering制冷工程承包商refrigeration contractor制冷工作者refrigerationist制冷工程师refrigeration engineer制冷技术员refrigeration technician制冷技师refrigeration technician制冷技工refrigeration mechanic冷藏工人icer制冷安装技工refrigeration installation mechanic 制冷维修技工refrigeration serviceman冷藏链cold chain制冷与空调维修店refrigeration and air conditioning repair shop冷藏refrigerated prvservation一般制冷换热器英语换热器heat exchanger热交换器heat exchanger紧凑式换热器compact heat exchanger管式换热器tubular heat exchanger套管式换热器double-pipe heat exchanger间壁式换热器surface type heat exchanger外表式换热器surface type heat exchanger板管式换热器tube-on-sheet heat exchanger板翅式换热器plate-fin heat exchanger板式换热器plate heat exchanger螺旋板式换热器spiral plate heat exchanger平板式换热器flat plate heat exchanger顺流式换热器parallel flow heat exchanger逆流式换热器counter flow heat exchanger*流式换热器cross-flow heat echanger折流式换热器turn back flow heat exchanger直接接触式换热器direct heat exchanger旋转式换热器rotary heat exchanger刮削式换热器scraped heat exchanger热管式换热器heat pipe exchanger蓄热器recuperator壳管式换热器shell and tube heat exchanger管板tube plate可拆端盖removable head管束bundle of tube 管束尺寸size of tube bundle顺排管束in-line hank of tubes错排管束staggered hank of tubes盘管coil蛇形管serpentine coilU形管U-tube光管bare tube肋片管finned tube翅片管finned tube肋管finned tube肋管束finned tube bundle肋片fin套片plate fin螺旋肋spiral fin整体肋integral fin纵向肋longitudinal fin钢丝肋wire fin内肋inner fin肋片管尺寸size of fin tube肋片厚度fin thickness肋距spacing of fin肋片数pitch of fin肋片长度finned length肋片高度finned height肋效率fin efficiency换热面积heat exchange surface传热面积heat exchange surface冷却面积cooling surface加热外表heat exchange surface基外表primary surface扩展外表extended surface肋化外表finned surface迎风外表face area流通外表flow area净截面积net area;effective sectional area迎风面流速face velocity净截面流速air velocity at net area迎风面质量流速face velocity of mass净截面质量流速mass velocity at net area冷〔热〕媒有效流通面积effective area for cooling or heating medium冷〔热〕媒流速velocity of cooling or heating medium干工况dry condition;sensible cooling condition 湿工况wet condition;dehumidifying condition接触系数contact factor旁通系数bypass factor换热效率系数coefficient of heat transmission effectiveness盘管风阻力air pressure drop of coil;air resistance of coil盘管水阻力pressure drop of cooling or heating medium外表冷却surface cooling蒸发冷却evaporating cooling冷却元件cooling element涡流管制冷英语涡流制冷效应vortex refrigerating effect兰克-赫尔胥效应Ranque-Hilsch effect涡流管制冷vortex tube refrigeration涡流管vortex tube兰克管Ranque tube膨胀喷嘴expansion injector涡流室vortex device别离孔板separation orifice调节阀control valve膨胀压力比expansion pressure ratio冷气流分量cold gas fraction热气流分量hot gas fraction冷却效应cooling effect加热效应heating effect冷却效率cooling efficiency磁制冷英语磁热效应magnetocaloric effect磁制冷magnetic refrigeration磁制冷机magnetic refrigerating machine磁冰箱magnetic refrigerator压缩机制冷系统及机组制冷系统refrigeration system制冷机refrigerating machine机械压缩制冷系统mechanical compression refrigeration system蒸气压缩制冷系统vapour compression refrigeration system压缩式系统compression system压缩机compressor制冷压缩机refrigerating compressor,refrigerant compressor吸气端suction end排气端discharge end低压侧low pressure side高压侧high pressure side蒸发压力evaporating pressure 吸气压力suction pressure,back pressure排气压力discharge pressure蒸发温度evaporating temperature冷凝压力condensing pressure冷凝温度condensing temperature吸气温度suction temperature回气温度back temperature排气温度discharge temperature压缩比compression ratio双效压缩dual compression单级压缩single-stage compression双级压缩compound compression多级压缩multistage compression压缩级compression stage低压级low pressure stage高压级high pressure stage中间压力intermediate pressure中间冷却intercooling多级膨胀multistage expansion湿压缩wet compression干压缩dry compression制冷系统refrigerating system机械制冷系统mechanical refrigerating system氟利昂制冷系统freon refrigerating system氨制冷系统ammonia refrigerating system压缩式制冷系统compression refrigerating system 单级压缩制冷系统single-stage compression refrigeration system双级压缩制冷系统two-stage compression refrigeration system多级制冷系统multistage refrigerating system复叠式制冷系统cascade refrigerating system混合制冷剂复叠系统mixed refrigerant cascade集中制冷系统central refrigerating plant直接制冷系统direct refrigeration system直接膨胀供液制冷系统refrigeration system with supply liqiud direct expansion重力供液制冷系统refrigeration system with supply liquid refrigerant for the evaporator by gravity液泵供液制冷系统refrigeration system with supply liquid refrigerant for evaporator by liquid pump间接制冷系统indirect refrigeration system融霜系统defrosting system热气融霜系统defrosting system by superheated vapour电热融霜系统eletrothermal defrosting system制冷系统故障breakdown of the refrigeratingsystem冰堵freeze-up冰塞ice plug脏堵filth blockage油堵greasy blockage液击〔冲缸、敲缸〕slugging湿行程wet stroke镀铜现象appearance of copper-plating烧毁burn-out倒霜frost back制冷机组refrigerating unit压缩机组compressor unit开启式压缩机组open type compresssor unit开启式压缩机open type compressor半封闭式压缩机组semihermetic compressor unit 半封闭式压缩机semihermetic compressor全封闭式压缩机组hermetically sealed compressor unit全封闭式压缩机hermetically sealed compressor压缩冷凝机组condensing unit全封闭式压缩冷凝机组hermetically sealed condensing unit半封闭式压缩冷凝机组semihermetically sealed condensing unit开启式压缩冷凝机组open type compressor condensing unit工业用压缩冷凝机组industrial condensing unit商业用压缩冷凝机组commercial condensing unit 整马力压缩冷凝机组integral horsepower condensing unit分马力压缩冷凝机组fractional horsepower condensing unit跨式制冷机组straddle refrigerating unit容积式压缩机及零部件英语容积式压缩机positive displacement compressor往复式压缩机〔活塞式压缩机〕reciprocating compressor回转式压缩机rotary compressor滑片式压缩机sliding vane compressor单滑片回转式压缩机single vane rotary compressor滚动转子式压缩机rolling rotor compressor三角转子式压缩机triangle rotor compressor多滑片回转式压缩机multi-vane rotary compressor 滑片blade旋转活塞式压缩机rolling piston compressor 涡旋式压缩机scroll compressor涡旋盘scroll固定涡旋盘stationary scroll,fixed scroll驱动涡旋盘driven scroll,orbiting scroll斜盘式压缩机〔摇盘式压缩机〕swash plate compressor斜盘swash plate摇盘wobble plate螺杆式压缩机screw compressor单螺杆压缩机single screw compressor阴转子female rotor阳转子male rotor主转子main rotor闸转子gate rotor无油压缩机oil free compressor膜式压缩机diaphragm compressor活塞式压缩机reciprocating compressor单作用压缩机single acting compressor双作用压缩机double acting compressor双效压缩机dual effect compressor双缸压缩机twin cylinder compressor闭式曲轴箱压缩机closed crankcase compressor开式曲轴箱压缩机open crankcase compressor顺流式压缩机uniflow compressor逆流式压缩机return flow compressor干活塞式压缩机dry piston compressor双级压缩机compund compressor多级压缩机multistage compressor差动活塞式压缩机stepped piston compound compressor,differential piston compressor串轴式压缩机tandem compressor,dual compressor截止阀line valve,stop valve排气截止阀discharge line valve吸气截止阀suction line valve局部负荷旁通口partial duty port能量调节器energy regulator容量控制滑阀capacity control slide valve容量控制器capacity control消声器muffler联轴节coupling曲轴箱crankcase曲轴箱加热器crankcase heater轴封crankcase seal,shaft seal填料盒stuffing box轴封填料shaft packing机械密封mechanical seal波纹管密封bellows seal转动密封rotary seal迷宫密封labyrinth seal轴承bearing滑动轴承sleeve bearing偏心环eccentric strap滚珠轴承ball bearing滚柱轴承roller bearing滚针轴承needle bearing止推轴承thrust bearing外轴承pedestal bearing臼形轴承footstep bearing轴承箱bearing housing止推盘thrust collar偏心销eccentric pin曲轴平衡块crankshaft counterweight,crankshaft balance weight曲柄轴crankaxle偏心轴eccentric type crankshaft曲拐轴crankthrow type crankshaft连杆connecting rod连杆大头crank pin end连杆小头piston pin end曲轴crankshaft主轴颈main journal曲柄crank arm,crank shaft曲柄销crank pin曲拐crank throw曲拐机构crank-toggle阀盘valve disc阀杆valve stem阀座valve seat阀板valve plate阀盖valve cage阀罩valve cover阀升程限制器valve lift guard阀升程valve lift阀孔valve port吸气口suction inlet压缩机气阀compressor valve吸气阀suction valve排气阀delivery valve圆盘阀disc valve环片阀ring plate valve簧片阀reed valve舌状阀cantilever valve条状阀beam valve 提升阀poppet valve菌状阀mushroom valve杯状阀tulip valve缸径cylinder bore余隙容积clearance volume附加余隙〔补充余隙〕clearance pocket活塞排量swept volume,piston displacement理论排量theoretical displacement实际排量actual displacement实际输气量actual displacement,actual output of gas气缸工作容积working volume of the cylinder活塞行程容积piston displacement气缸cylinder气缸体cylinder block气缸壁cylinder wall水冷套water cooled jacket气缸盖〔气缸头〕cylinder head平安盖〔假盖〕safety head假盖false head活塞环piston ring气环sealing ring刮油环scraper ring油环scrape ring活塞销piston pin活塞piston活塞行程piston stroke吸气行程suction stroke膨胀行程expansion stroke压缩行程compression stroke排气行程discharge stroke升压压缩机booster compressor立式压缩机vertical compressor卧式压缩机horizontal compressor角度式压缩机angular type compressor对称平衡型压缩机symmetrically balanced type compress吸收式制冷机英语吸收式制冷机absorption refrigerating machine吸收式制冷系统absorption refrigerating system间歇式吸收系统intermittent absoprtion system连续循环吸收式系统continuous cycle absorption system固体吸收式制冷solid absorption refrigeration氨-水吸收式制冷机ammonia/water absorption refrigerating machine单级氨-水吸收式制冷机single stage ammonia/water absorption refrigerating machine 多级氨-水吸收式制冷机multistage ammonia/water absorption refrigerating machine 双级氨-水吸收式制冷机ammonia/water absorption refrigerating machine with two stage absorption process双级发生和双级吸收式氨-水制冷机ammonia/water absorption refrigerating machine with two stage generation and absoprtion process 分解decomposition水解hydrolysis扩散diffusion能量增强剂energy booster缓蚀剂anticorrsive发生缺乏incomplete boiling吸收缺乏incomplete absorption喷淋密度sprinkle density溴化锂lithium bromide溴化锂水溶液aqueous solution of lithium bromide 氨水溶液aqueous solution of ammonia吸收剂absorbent,absorbing agent吸附剂adsorbent溶液solution浓度concentration溶解度solubility溶剂solvent溶质solute浓溶液rich solution,concentrated solution稀溶液weak solution,diluted solution溶液分压partial pressure of liquor吸收absorption吸附adsorption吸收式制冷absorption refrigeration吸附式制冷adsorption refrigeration工质对working substance热力系数heat ratio放气范围deflation ratio焓-浓度图enthalpy concentration chart溴化锂吸收式制冷机lithiumbromide absorption refrigerating machine单效型溴化锂吸收式制冷机single-effect lithiumbromide absorption refrigerating machine两效型溴化锂吸收式制冷机double-effect lithiumbromide absorption refrigerating machine单筒型溴化锂吸收式制冷机one-shell lithiumbromide absorption refrigerating machine 双筒型溴化锂吸收式制冷机two-shell lithiumbromide absorption refrigerating machine三筒型溴化锂吸收式制冷机three-shell lithiumbromide absorption refrigerating machine两级溴化锂吸收式制冷机two-stage lithiumbromide absorption refrigerating machine直燃式溴化锂吸收式制冷机direct-fired lithiumbormide absorption refrigerating machine 溴化锂吸收式冷温水机组lithiumbromide absorption water heater chiller无泵型溴化锂吸收式制冷机lithiumbromide absorption refrigerating machine with bubble pump 蒸汽型吸收式制冷机steam operated absorption refrigerating machine热水型吸收式制冷机hot water operated absorption refrigerating machine发生器generator沉浸式发生器submerged generator喷淋式发生器spray-type generator立式降膜式发生器vertical falling film generator直燃式发生器direct-fired generator高压发生器high pressure generator低压发生器low pressure generator吸收器absorber喷淋式吸收器spray absorber降膜式吸收器falling film absorber立式降膜式吸收器vertical falling film absorber卧式降膜式吸收器horizontal falling film absorber 喷淋装置spray system溶液换热器solution heat exchanger溶晶管anti-crystallinic pipe抽气装置purging system精馏器rectifier屏蔽泵shield pump发生器泵generator pump吸收器泵absorber pump蒸发器泵evaporator pump溶液泵solution pump氨水泵aqua-ammonia pump混合阀mixing valve太阳能制冷与供热英语太阳能solar energy太阳常数solar constant太阳能系统solar energy system被动式太阳能系统passive solar energy system主动式太阳能系统active solar energy system混合式太阳能系统hybrid solar energy system太阳能制冷solar cooling太阳能热机驱动制冷solarpowered cooling太阳能吸收式制冷机solar absorption refrigerating machine光-热转换制冷photothermal refrigeration光-电转换制冷photoelectrical refrigeration太阳能蒸汽喷射制冷机solar steam jet refrigerating machine连续式太阳能吸收式制冷机continual solar absorption refrigerating machine间歇式太阳能吸收式制冷机intermittent solar absorption refrigerating machine敞开式太阳能吸收式制冷机open solar absorption refrigerating machine太阳能空调装置solar air-conditioning system太阳能制冷系统solar energy cooling system,solar cooling system太阳能集热器solar collector选择式吸收外表selective absorber surface电淀积electrodeposition平板型太阳能集热器flat plate solar collector真空管太阳能集热器tubular solar collector,vacuum tube collector聚光型太阳能机热器focus solar collector集热量heat-collecting capacity集热温度heat-collecting temperature集热效率heat-collecting efficiency蓄热介质heat storge medium岩石蓄热容器rock storge container辅助热源supplementary heat source太阳能贮存系统solar energy storge system太阳能供热系统solar heating system,solar space heating installation自然循环闭式供水系统natural convection closed water system强制循环闭式供水系统forced convection in a closed water system热风供热系统warm air heating system家用太阳能热水系统solar domestic water heating system热管与余热制冷英语热管heat pipe深冷热管cryogenic heat pipe低温热管low temperature heat pipe中温热管moderate temperature heat pipe 高温热管liquid metal heat pipe管芯wick相容性compatibility传热极限heat transport limitation重力热管gravity assisted heat pipe热管换热器heat pipe exchanger深冷热管手术器heat pipe surgery cryoprobe余热exhaust heat低温余热low temperature exhaust heat余热制冷utilizing waste heat for refrigeration氟利昂透平freon turbine氟利昂透平离心式制冷机centrifugal refrigerating machine driven by freon turbine动力-制冷循环power/refrigeration cycle透平压缩机及零部件英语涡流swirl叶片颤振blade flutter叶片通过频率blade passing frequency喘振surging脱流stall叶轮反响度(反作用度) impeller reaction叶轮impeller半开式叶轮unshrouded impeller闭式叶轮shrouded impeller叶片blade,vane导流叶片组件pre-rotary vane assembly扩压器diffuser蜗壳scroll滑动slip透平压缩机turbocompressor离心式压缩机centrifugal compressor轴流式压缩机axial flow compressor刚性轴离心式压缩机stiff-shaft centrifugal compressor挠性轴离心式压缩机flexibleshaft centrifugal compressor亚音速压缩机subsonic compressor超音速压缩机supersonic compressor冷却塔英语自然通风式冷却塔atmpspheric cooling tower,natural draught cooling tower机械通风式冷水塔mechanical draught cooling tower吸风式冷水塔induced draught cooling tower送风式冷水塔forced draught cooling tower水膜式冷水塔film cooling tower水滴式冷水塔drop cooling tower喷雾式冷水塔spray cooling tower拉西环Rasching rings温度接近值approach水垢scale水垢抑制剂scale inhibitor藻类algae防藻剂algaecide淀渣slime升压阀back-up valve冷水塔water cooling tower,cooling tower凉水塔water cooling tower,cooling tower冷却塔water cooling tower,cooling tower喷水池spray pond干式冷水塔dry cooling tower湿-干式冷水塔wet-dry cooling tower冷水塔填料packing of cooling tower,fill of cooling tower膜式填料film packing帘栅形填料grid packing,grid fill片式填料plate packing,plate fill松散填料random packing,random fill飞溅式填料splash packing空气压缩制冷系统英语空气循环制冷air-cycle refrigeration空气循环制冷机air-cycle refrigerating machine涡轮冷却器turbine cooler温降temperature drops开式循环open cycle闭式循环closed cycle除水water elimination补气air supply回热式空气制冷循环regenerative air cycle飞机座舱空调系统aircraft air-conditioning system 增压式飞机空调系统"Bootstrap" system冲压空气ram air制冷系统自动调节流量调节flow regulation制冷剂控制器refrigerant control膨胀阀expansion valve节流阀throttle valve热力膨胀阀thermostatic expansion valve热电膨胀阀thermal electric expansion valve内平衡热力膨胀阀internal equalizer thermostaice expansion valve外平衡热力膨胀阀external equalizer thermostaice expansion valve外平衡管external equalizer pipe内平衡管internal equalizer pipe蒸发器阻力损失pressure drop of evaporator同工质充注same material charge交*充注cross charge吸附充注absorptive charge气体充注gas charge膨胀阀过热度superheat degree of expansion valve 过热温度调节superheat temperature regulation膨胀阀容量expansion valve capacity手动膨胀阀hand expansion valve自动膨胀阀automatic expansion valve浮球调节阀float regulation valve浮球阀float valve低压浮球阀low pressure float valve高压浮球阀high pressure float valve流量调节flow regualation制冷剂控制器refrigerant control膨胀阀expansion valve节流阀throttle valve热力膨胀阀thermostatic expansion valve热电膨胀阀thermal electric expansion valve内平衡热力膨胀阀internal equalizer thermostaice expansion valve外平衡热力膨胀阀external equalizer thermostaice expansion valve外平衡管external equalizer pipe内平衡管internal equalizer pipe蒸发器阻力损失pressure drop of evaporator同工质充注same material charge交*充注cross charge吸附充注absorptive charge气体充注gas charge膨胀阀过热度superheat degree of expansion valve 过热温度调节superheat temperature regulation膨胀阀容量expansion valve capacity手动膨胀阀hand expansion valve自动膨胀阀automatic expansion valve浮球调节阀float regulation valve浮球阀float valve低压浮球阀low pressure float valve高压浮球阀high pressure float valve恒压膨胀阀constant pressure expansion valve能量调节capacity regulator单机能量调节capacity regulation of single unit卸载能量调节capacity regulation of load drainage 程序指令式能量调节系统capacity regulation system of program order电磁阀solenoid valve电磁滑阀magnetic slide valve三通电磁阀three way magnetic valve蒸汽喷射式制冷系统英语蒸汽喷射制冷steam jet refrigeration蒸汽喷射制冷机steam-jet refrigerating machine蒸发式蒸汽喷射制冷机evaporation-type steam jet refrigeration machine混合式蒸汽喷射制冷机contact-type steam jet refrigerating machine蒸汽喷射制冷系统steam jet refrigerating system 蒸汽喷射器steam ejector主喷射器main ejector辅助喷射器auxiliary ejector喷射系数jet coefficient主冷凝器main condenser辅助冷凝器auxiliary condenser多效蒸发multieffective evaporation高位安装high-level installation低位安装low-level installation上下位安装high-low-level installation臭氧层保护英语臭氧ozone臭氧层ozonesphere,ozone layer臭氧层破坏ozonesphere depletion,ozonesphere disturbance消耗臭氧层物质ozone depleting substances〔ODS〕禁用制冷剂forbidden refrigerant过渡制冷剂transition refrigerant替代制冷剂substitute refrigerant自然制冷剂natural refrigerant氟利昂家族freon group全氟代烃fluorocarbon 〔FC〕氯氟烃chloroflurocarbon〔CFC〕氢氟烃hydrofluorocarbon〔HCF〕含氢氯氟烃hydrochloroflurocarbon〔HCFC〕含氢氯化烃hydrochlorocarbon〔HCC〕全氯化烃polychlorocarbon〔PCC〕哈龙Halon共沸混合物azeotropic mixture碳氢化合物hydrocarbon compound,hydrocarbon 〔HC〕臭氧消耗潜能值ozone depletion potential〔ODP〕温室效应greenhouse effect全球变暖global warming京都议定书kyoto protocol全球变暖潜能值global warming potential〔GWP〕变暖影响总当量total equivalent warming impact 〔TEWI〕寿命期气候性能life cycle climate performance 〔LCCP〕蕴含能量embodied energy不易收集的排放fugitive emissions热电制冷英语热电制冷thermoelectric refrigeration温差电制冷thermoelectric refrigeration半导体制冷semiconductor refrigeration热电效应thermoelectric effect塞贝克效应Seebeck effect珀尔帖效应Peltier effect热电制冷效应thermoelectric refrigeration effect汤姆逊效应Thomson effect焦耳效应Joule effect傅里叶效应Fourier effect温差电动势thermoelectric power塞贝克系数Seebeck coefficient优值系数figure of merit热电堆thermoelectric pile温差电堆thermoelectric pile最正确电流optimum current经济电流economic current热电半导体thermoelectric semiconductors热电材料thermoelectric material热电制冷材料thermoelectric cooling materialn型半导体n-type semiconductorsp型半导体p-type semiconductors半导体制冷器thermoelectric-refrigerating unit热电制冷器thermoelectric refrigerating unit热电空调器thermoelectric air conditioner半导体空调器thermoelectric air conditioner半导体恒温器thermoelectric thermostat半导体冷饮水器thermoelectric drinking water cooler半导体热泵thermoelectric heat pump半导体降温机thermoelectric dehumidifier低温半导体制冷器low temperature thermoelectric unit焊接式半导体制冷器soldered thermoelectric refrigerating unit粘接式半导体制冷器sticky thermoelectric refrigerating unit嵌装式半导体制冷器inlaid thermoelectric refrigerating unit复叠式半导体制冷器cascade thermoelectric refrigerating unit医用半导体制冷器medicine thermoelectric refrigerating unit盐水冷却系统开式盐水冷却系统open brine system闭式盐水系统closed brine system盐水箱brine bank盐水混合箱brine mixing tank盐水溢流箱brine return tank盐水回流箱brine return tank盐水膨胀箱brine balance tank盐水加热器brine heater盐水冷却器brine cooler盐水筒brine drum盐水集管brine header盐水泵brine pump盐水喷雾brine spray盐水喷淋brine sparge制冷暖通行业品牌中英文对照AEROFLEX “亚罗弗〞保温ALCO “艾科〞自控Alerton 雅利顿Alfa laval阿法拉伐ARMSTRONG “阿姆斯壮〞保温AUX 奥克斯BELIMO 瑞士“搏力谋〞BERONOR西班牙“北诺尔〞电加热器BILTUR 意大利“百得〞BOSIC “柏诚〞自控BROAD 远大Burnham美国“博恩汉〞锅炉CALPEDA意大利“科沛达〞水泵CARLY 法国“嘉利〞制冷配件Carrier 开利Chigo 志高Cipriani 意大利斯普莱力CLIMAVENETA意大利“克莱门特〞Copeland“谷轮〞压缩机CYRUS意大利〞赛诺思〞自控DAIKIN 大金Danfoss丹佛斯Dorin “多菱〞压缩机DUNHAM-BUSH 顿汉布什DuPont美国“杜邦〞制冷剂Dwyer 美国德威尔EBM “依必安〞风机ELIWELL意大利“伊力威〞自控EVAPCO美国“益美高〞冷却设备EVERY CONTROL意大利“美控〞Erie 怡日FRASCOLD 意大利“富士豪〞压缩机FRICO瑞典“弗瑞克〞空气幕FUJI “富士〞变频器FULTON 美国“富尔顿〞锅炉GENUIN “正野〞风机GREE 格力GREENCOOL格林柯尔GRUNDFOS “格兰富〞水泵Haier 海尔Hisense 海信HITACHI 日立Honeywell 霍尼韦尔Johnson 江森Kelon 科龙KRUGER瑞士“科禄格〞风机KU BA德国“库宝〞冷风机Liang Chi 良机LIEBERT 力博特MARLEY “马利〞冷却塔Maneurop法国“美优乐〞压缩机McQuary 麦克维尔Midea 美的MITSUBISHI三菱Munters 瑞典“蒙特〞除湿机Oventrop德国“欧文托普〞阀门Panasonic 松下RANCO “宏高〞自控REFCOMP意大利“莱富康〞压缩机RIDGID 美国“里奇〞工具RUUD美国“路德〞空调RYODEN “菱电〞冷却塔SanKen “三垦〞变频器Samsung 三星SANYO 三洋SASWELL英国森威尔Schneider 施耐德SenseAir 瑞典“森尔〞传感器SIEMENS 西门子SINKO "新晃“空调SINRO “新菱〞冷却塔STAND “思探得〞加湿器SWEP 舒瑞普TECKA “台佳〞空调Tecumseh“泰康〞压缩机TRANE 特灵TROX德国“妥思〞VASALA芬兰“维萨拉〞传感器WILO德国“威乐〞水泵WITTLER 德国〞威特〞阀门YORK 约克ZENNER德国“真兰〞计量制冷能力及计算术语英语运行工况operating conditions标准性能standard rating标准工况standard condition空调工况air conditioning condition内部条件internal conditions外部条件external conditions蓄热accumulation of heat蓄冷accumulation of cold制冰能力ice-making capacity热泵用压缩机的供热系数heat-pump compressor coefficient of performance容积效率volumetric efficiency容积输气量vulumetric displacement实际输气量actual displacement理论输气量theoretical displacement冷凝热量condenser heat过冷热量heat of subcooling过热热量superheat运转工况下的制冷量rating under working conditions标准制冷量standard rating名义工况normal conditions试验工况test conditions轴功率brake power效率efficiency指示效率indicated efficiency机械效率mechanical efficiency总效率overall efficiency制冷系数coefficient of performance 〔COP〕制冷压缩机的制冷系数refrigerating compressor coefficient of performance热力完善度thermodynamical perfectness能效比energy efficiency ratio 〔EER〕热泵供热系数heat-pump coefficient of performance空调有效显热制冷量useful sensible heat capacity of air conditioner空调有效潜热〔减湿〕制冷量useful latent heat (dehumidifyying) capacity of air conditioner空调器有效总制冷量useful total capacity of air conditioner制冷剂循环量circulating mass of refrigerant制冷剂循环容积circulating volume of refrigerant 单位压缩功compress work per mass示功图indicator diagram指示功indicated work摩擦功frictional work功率power摩擦功率frictional power指示功率indicated power理论功率idea power制冷量refrigerating capacity总制冷量gross refrigerating capacity净制冷量net refrigerating capacity单位制冷量refrigerating capacity per weighing单位容积制冷量refrigerating capacity per unit of swept volume制冷系统制冷量system refrigerating capacity单位轴功率制冷量refrigerating effect per shaft power压缩冷凝机组制冷量compressor condensing unit refrigerating capacity制冷压缩机制冷量refrigerant compressor capacity 蒸发器净制冷量net cooler refrigerating capacity制冷装置制冷装置refrigerating installation,refrigerating plant工业制冷装置industrial refrigerating plant商业制冷装置commercial refrigerating plant中心站房central station成套机组self-contained system标准安装code installation制冷回路refrigerating circuit热平衡heat balance货物负荷product load操作负荷service load设计负荷design load负荷系数load factor制冷装置试验与操作试运转commissioning吹污flush气密性试验gas-tight test,air-right test密闭容器closed container漏气air infiltration放气air vent检漏leak hunting,leak detection检漏仪leak detector卤素灯halide torch电子检漏仪electronic leak detector真空试验vacuum test试验压力test pressure工作压力operating pressure,working pressure最高工作压力highest operating pressure气密试验压力gas-tight test pressure设计压力design pressure平衡压力balance pressure充气aerate,gas charging制冷剂充注refrigerant charging首次充注initial charge保护充注holding charge,service charge制冷剂缺乏lack of refrigerant,under-charge,gas shortage缺液starveling充灌台charging board充灌量charge充注过多overcharge供液过多overfeeding制冷剂抽空pump down of refrigerant降温试验pull down test制冷[功能]试验refrigeration test卸载起动no-load starting,unloaded start卸载机构unloader闪发flash vaporization,instantaneous vaporization 闪发气体flash gas不凝性气体non condensable gas气体排除gas purging,degassing,gasoff阀针跳动hammering,needle hammer阀振荡hunting of a valve阀片跳动valve flutter,valve bounce短期循环short-cycling异常温升overheating 泄漏leak气蚀cavitation制冷剂瓶refrigerant cylinder,gas bottle检修用瓶service cylinder,gas bottle紧急泄放阀emergency-relief valve检修阀service valve平安阀pressure relief valve抽空阀pump out valve加油阀oil charge valve放油阀oil drain valve放空阀purge valve充灌阀charging valve喷液阀liquid injection valve润滑油润滑油lubricant oil冷冻机油refrigeration oil冷冻油refrigerant oil凝点condensation point闪点flash point浊点cloud point絮凝点flock point流动点pour point起泡foaming皂化saponify油泥sludge结碳carbonization制冷剂制冷剂〔制冷工质〕refrigerant高温制冷剂high temperature refrigerant低压制冷剂low pressure refrigerant中温制冷剂medium temperature refrigerant 中压制冷剂medium pressure refrigerant低温制冷剂low temperature refrigerant高压制冷剂high pressure refrigerant氟利昂freon卤化碳制冷剂halocarbo refrigerant氟利昂11 freon 11氟利昂12 freon 12氟利昂13 freon 13氟利昂14 freon 14氟利昂22 freon 22氟利昂113 freon 113氟利昂125 freon 125氟利昂134a freon 134a氟利昂152a freon 152a碳氢化合物制冷剂hydrocarbon refrigerant甲烷methane乙烷ethane丙烷propane丁烷butane异丁烷isobutane乙烯ethylene无机化合物制冷剂inorganic compund refrigerant 氨ammonia二氧化碳carbon dioxide二氧化硫sulphur dioxide干冰dry ice共沸制冷剂azeotropic mixture refrigerant氟里昂500 freon 500氟里昂501 freon 501氟里昂502 freon 502氟里昂503 freon 503氟里昂504 freon 504近共沸溶液制冷剂near azeotropic mixture refrigerant非共沸溶液制冷剂nonazeotropic mixture refrigerant蒸发器壳盘管式蒸发器shell-and-coil evaporator壳管式蒸发器shell-and-tube evaporator喷淋式蒸发器spray-type evaporator立管式蒸发器vertical-type evaporator平行管蒸发器receway coil螺旋管式蒸发器spiral tube evaporator“V〞型管蒸发器herringbone type evaporator沉浸式盘管蒸发器submerged evaporator板式蒸发器plate-type evaporator螺旋板式蒸发器spiral sheet evaporator平板式蒸发器plate-type evaporator,tube-in-sheet evaporator管板式蒸发器tube-on-sheet evaporator凹凸板式蒸发器embossed-plate evaporator吹胀式蒸发器roll-bond evaporator压焊板式蒸发器roll-bond evaporator制冰块器的蒸发器ice cube maker evaporator结冰式蒸发器ice-bank evaporator蓄冰式蒸发器ice-bank evaporator结霜蒸发器frosting evaporator除霜蒸发器defrosting evaporator无霜蒸发器nonfrosting evaporator强制通风蒸发器forced circulation evaporator 冷液式蒸发器liquid cooling evaporator封套式蒸发器wrap-round evaporator蒸发器evaporator直接冷却式蒸发器direct evaporator直接式蒸发器direct evaporator间接冷却式蒸发器indirect cooled evaporator间接式蒸发器indirect evaporator干式蒸发器dry expansion evaporator满液式蒸发器flooded evaporator再循环式蒸发器recirculation-type evaporator强制循环式蒸发器pump-feed evaporator冷凝器英语冷凝器condenser冷凝液condensate空冷式冷凝器air-cooled condenser风冷式冷凝器air-cooled condenser自然对流空冷式冷凝器natural convecton air-cooled condenser强制通风式冷凝器forced draught condenser冷凝风机condensate fan线绕式冷凝器wire and tube condenser水冷式冷凝器water-cooled condenser沉浸式盘管冷凝器submerged coil condenser套管式冷凝器double pipe condenser壳管式冷凝器shell and tube condenser组合式冷凝器multishell condenser卧式壳管式冷凝器closed shell and tube condenser 卧式冷凝器closed condenser立式壳管式冷凝器open shell and tube condenser 立式冷凝器open condenser,vertical condenser 壳盘管式冷凝器shell and coil condenser分隔式冷凝器split condenser淋激式冷凝器atmospheric condenser溢流式冷凝器bleeder-type condenser蒸发式冷凝器evaporative condenser板式冷凝器plate-type condenser空冷板式冷凝器air-cooled plate-type condenser 水冷板式冷凝器water-cooled plate-type condenser焊接板式冷凝器welded sheet condenser螺旋板式冷凝器spiral sheet condenser冷凝-贮液器condenser-receiver混合式冷凝器barometric condenser液化器liquefier冷凝水泵condensate pump冷凝器梳condensate comb。

Bluetooth Smart Module FEAT UR ES 产品说明书

Bluetooth Smart Module FEAT UR ES 产品说明书

26080111240012608011024001Bluetooth® Smart Module∙Embedded 2.4 GHz Bluetooth 4.2 module∙ 1.7 to 3.6 V operation∙Up to +2 dBm output power∙-96 dBm sensitivity∙UART∙Event driven API∙Automated power management system withautomatic power management of each peripheral∙AES HW encryption∙Compact dimensions: 11 x 8 x 1.8 mm∙Antenna options: integrated or RF padThe AMB2621 is an ultra-low power 2.4 GHz wireless module integrating the nRF52832 System on Chip including a 2.4 GHz transceiver and an ARM Cortex TM-M4F CPU with flash memory. The module is optimized for applications where costs and low-power optimization really matter. Several pins with alternate functions are available to e.g. connect LEDs, or realize an SPI, I2C, ADC or handshake for the UART as well as NFC.By default the AMB2621 contains the AMBER firmware according to option 1. Upon request the customer’s own firmware (option 2) may be flashed during production.Option 1: AMBER firmwareBy default, the module provides the industry proven, fully qualified Bluetooth® Smart (previously called Bluetooth low energy) stack from Nordic, plus the AMBER firmware. The latter contains an SPP-like profile, which offers a fast secured data transmission of packets with up to 128 bytes payload. Furthermore the AMB2621 includes an easy-to-use command interface allowing a convenient configuration and operation. The module can perform both, an advertising mode in order to be found, or a scan for finding other devices, which are advertising. Data transmission can be executed as soon as a (secured) connection has been set up. In addition data can be broadcasted quickly using so called Beacons. The module enables distance estimation (localization) using RSSI and output power in just one advertise packet for optimized power consumption.As a second option the module can be switched into peripheral only mode with transparent UART and static passkey pairing.As interface to the host system a 2-wire UART interface is provided with a default data rate of 115200 Baud. OTA firmware update via PC or Android / iOS App is supported. An Android App supporting the SPP-like operation is also available on request.Option 2: Custom developmentBased on the free Nordic Semiconductor SDK and demo examples various BLE-profiles and custom applications can be realized and flashed on the AMB2621 module. The versatile and well documented Nordic stack ensures quick and easy realization of various standard BLE-profiles, such as:∙HID services∙Medical services (BLS, HRS, HTP…)∙Alert services (ANS, IAS, PASS …)∙In formation services (CTS, DIS, TPS …)∙and othersFor full feature list see the nRF52832 documentation .SpecificationsTA = 25°C, VCC = 3 V if nothing else stated. Performance RF data rate 1 Mbit/sInterface data rate Typ. 115200 BaudOutput power Up to +2 dBm @ 50 OhmRF sensitivity Typ. -96 dBm @ 50 OhmRange AMB2621: 50m, AMB2621-1: 125mGeneral Power supply 1.7 - 3.6 VPower consumption TX: typ. 5.3 mA @ 0dB, 7.5 mA@ 4dBm / RX: 5.4 mA *Low Power: typ. 0.4 µA (System OFF mode)Dimensions 8 x 11 x 1.8 mmOperating temperature -40 to +85 °CWeight Approx. 3 gAntenna Integrated antenna or RF padRF Technology Bluetooth® Smart 4.2Frequency range 2.402 GHz to 2.48 GHzModulation DSSSCompliance Europe EN 60950, EN 301 489, EN 62311, EN 300 328US FCCBluetooth SIG SIG listing is mandatory* DC/DC converter in use, transceiver only. Complete currents with CPU active: TX 8mA @ 0 dBm, TX 11mA @ 4 dBm, RX 8mA Dimensions and Pin AssignmentNo. Pad Name No. Pad Name1 RF 1 9 P0.09/NFC1 22, 17 GND 10 P0.00/XL1 23 SWDCLK 11 P0.01/XL2 24 SWDIO 12 P0.02/AIN0 25 P0.21/Reset 13 P0.03/AIN1 26 P0.05/AIN3 214 P0.04/AIN2 27 VDD 15 P0.28/AIN4 28 P0.10/NFC2 216 P0.29/AIN5 212 can be used with customer specific firmware. Refer to AMB2621 manual for function in standard (SPP-like)firmwareOrdering InformationItem No. DescriptionAMB2621 Bluetooth Smart Module w/ integrated antennaAMB2621-1 Bluetooth Smart Module w/ RF padAMB2621-EV Bluetooth Smart Evaluation Board (Module AMB2621) Phone +49.651.993.550**************************** Internet 26080111240012608011024001。

3gpp协议

3gpp协议

3GPP TR 36.942 V9.0.1(2010-04)Technical Report3rd Generation Partnership Project;Technical Specification Group Radio Access Network; Evolved Universal Terrestrial Radio Access (E-UTRA);Radio Frequency (RF) system scenarios(Release 9)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM ) and may be further elaborated for the purposes of 3GPP.The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification. Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsLTE, Radio3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© 2010, 3GPP Organizational Partners (ARIB, ATIS, CCSA, ETSI, TTA, TTC).All rights reserved.UMTS™ is a Trade Mark of ETSI registered for the benefit of its members3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational PartnersLTE™ is a Trade Mark of ETSI currently being registered for the benefit of i ts Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM AssociationContentsForeword (6)1Scope (7)2References (7)3Definitions, symbols and abbreviations (8)3.1Definitions (8)3.2Symbols (8)3.3Abbreviations (8)4General assumptions (9)4.1Interference scenarios (10)4.2Antenna Models (10)4.2.1BS antennas (10)4.2.1.1BS antenna radiation pattern (11)4.2.1.2BS antenna heights and antenna gains for macro cells (11)4.2.2UE antennas (12)4.2.3MIMO antenna Characteristics (12)4.3Cell definitions (12)4.4Cell layouts (12)4.4.1Single operator cell layouts (12)4.4.1.1Macro cellular deployment (12)4.4.2Multi operator / Multi layer cell layouts (12)4.4.2.1Uncoordinated macro cellular deployment (13)4.4.2.2Coordinated macro cellular deployment (13)4.5Propagation conditions and channel models (14)4.5.1Received signal (14)4.5.2Macro cell propagation model – Urban Area (14)4.5.3Macro cell propagation model – Rural Area (15)4.6Base-station model (15)4.7UE model (17)4.8RRM models (18)4.8.1Measurement models (18)4.8.2Modelling of the functions (18)4.9Link level simulation assumptions (18)4.10System simulation assumptions (18)4.10.1System loading (18)5Methodology description (18)5.1Methodology for co-existence simulations (18)5.1.1Simulation assumptions for co-existence simulations (18)5.1.1.1Scheduler (18)5.1.1.2Simulated services (19)5.1.1.3ACIR value and granularity (19)5.1.1.4.1Uplink Asymmetrical Bandwidths ACIR (Aggressor with larger bandwidth) (19)5.1.1.4.2Uplink Asymmetrical Bandwidths ACIR (Aggressor with smaller bandwidth) (22)5.1.1.4Frequency re-use and interference mitigation schemes for E-UTRA (22)5.1.1.5CQI estimation (23)5.1.1.6Power control modelling for E-UTRA and 3.84 Mcps TDD UTRA (23)5.1.1.7SIR target requirements for simulated services (23)5.1.1.8Number of required snapshots (23)5.1.1.9Simulation output (23)5.1.2Simulation description (24)5.1.2.1Downlink E-UTRA interferer UTRA victim (24)5.1.2.2Downlink E-UTRA interferer E-UTRA victim (24)5.1.1.1Uplink E-UTRA interferer UTRA victim (24)5.1.2.4Uplink E-UTRA interferer E-UTRA victim (25)6System scenarios (25)6.1Co-existence scenarios (26)7Results (26)7.1Radio reception and transmission (26)7.1.1FDD coexistence simulation results (26)7.1.1.1ACIR downlink 5MHz E-UTRA interferer – UTRA victim (26)7.1.1.2ACIR downlink 10MHz E-UTRA interferer – 10MHz E-UTRA victim (27)7.1.1.3ACIR uplink 5MHz E-UTRA interferer – UTRA victim (29)7.1.1.4ACIR uplink 10MHz E-UTRA interferer – 10MHz E-UTRA victim (31)7.1.2TDD coexistence simulation results (34)7.1.2.1ACIR downlink 5MHz E-UTRA interferer – UTRA 3.84 Mcps TDD victim (34)7.1.2.2ACIR downlink 10MHz E-UTRA interferer – 10MHz E-UTRA TDD victim (36)7.1.2.3ACIR downlink 1.6 MHz E-UTRA interferer – UTRA 1.28 Mcps TDD victim (38)7.1.2.4ACIR uplink 5MHz E-UTRA interferer – UTRA 3.84 Mcps TDD victim (41)7.1.2.5ACIR uplink 10MHz E-UTRA interferer – 10MHz E-UTRA TDD victim (43)7.1.2.6ACIR uplink 10MHz E-UTRA interferer – 10MHz E-UTRA TDD victim (LCR frame structurebased) (45)7.1.2.7ACIR downlink 10MHz E-UTRA interferer – 10MHz E-UTRA TDD victim (LCR framestructure based) (46)7.1.3Additional coexistence simulation results (48)7.1.3.1ACIR downlink E-UTRA interferer – GSM victim (48)7.1.3.2ACIR uplink E-UTRA interferer – GSM victim (50)7.1.3.3Asymmetric coexistence 20 MHz and 5 MHz E-UTRA (51)7.1.3.4Impact of cell range and simulation frequency on ACIR (53)7.1.3.5Uplink Asymmetric coexistence TDD E-UTRA to TDD E-UTRA (54)7.1.4Base station blocking simulation results (56)7.2RRM (58)8Rationales for co-existence requirements (58)8.1BS and UE ACLR (58)8.1.1Requirements for E-UTRA – UTRA co-existence (58)8.1.2Requirements for E-UTRA – E-UTRA co-existence (59)9Deployment aspects (59)9.1UE power distribution (59)9.1.1Simulation results (60)10Multi-carrier BS requirements (62)10.1Unwanted emission requirements for multi-carrier BS (62)10.1.1General (62)10.1.2Multi-carrier BS of different E-UTRA channel bandwidths (63)10.1.3Multi-carrier BS of E-UTRA and UTRA (63)10.2Receiver requirements for multi-carrier BS (64)10.2.1General (64)10.2.2Test principles for a multi-carrier BS of equal or different E-UTRA channel bandwidths (65)11Rationale for unwanted emission specifications (65)11.1Out of band Emissions (65)11.1.1Operating band unwanted emission requirements for E-UTRA BS (spectrum emission mask) (65)11.1.2ACLR requirements for E-UTRA BS (67)11.2Spurious emissions (69)11.2.1BS Spurious emissions (69)11.2.2General spurious emissions requirements for E-UTRA BS (69)11.2.3Specification of BS Spurious emissions outside the operating band (70)11.2.4Additional spurious emissions requirements (71)Annex A (informative): Link Level Performance Model (71)A.1Description (71)A.2Modelling of Link Adaptation (73)A.3UTRA 3.84 Mcps TDD HSDPA Link Level Performance (75)A.4Link Level Performance for E-UTRA TDD (LCR TDD frame structure based) (76)Annex B (informative): Smart Antenna Model for UTRA 1.28 Mcps TDD (79)B.1Description (79)Annex C (informative): Change history (83)ForewordThis Technical Report has been produced by the 3rd Generation Partnership Project (3GPP).The contents of the present document are subject to continuing work within the TSG and may change following formal TSG approval. Should the TSG modify the contents of the present document, it will be re-released by the TSG with an identifying change of release date and an increase in version number as follows:Version x.y.zwhere:x the first digit:1 presented to TSG for information;2 presented to TSG for approval;3 or greater indicates TSG approved document under change control.y the second digit is incremented for all changes of substance, i.e. technical enhancements, corrections, updates, etc.z the third digit is incremented when editorial only changes have been incorporated in the document.1 ScopeDuring the E-UTRA standards development, the physical layer parameters will be decided using system scenarios, together with implementation issues, reflecting the environments that E-UTRA will be designed to operate in.2 ReferencesThe following documents contain provisions which, through reference in this text, constitute provisions of the present document.•References are either specific (identified by date of publication, edition number, version number, etc.) or non-specific.•For a specific reference, subsequent revisions do not apply.•For a non-specific reference, the latest version applies. In the case of a reference to a 3GPP document (includinga GSM document), a non-specific reference implicitly refers to the latest version of that document in the sameRelease as the present document.[1] 3GPP TR 25.896, “Feasibility Study for Enhanced Uplink for UTRA FDD”[2] 3GPP TR 25.816, “UMTS 900 MHz Work Item Technical Report”[3] 3GPP TR 25.942, “Radio Frequency (RF) system scenarios”[4] 3GPP TR 25.814, “Physical Layer Aspects for Evolved UTRA”[5] 3GPP TR 30.03, “Selection procedures for the choice of radio transmission technologies of theUMTS”[6] R4-051146, “Some operators’ requirements for prioritization of performance requirements work inRAN WG4”, RAN4#37[7] 3GPP TR 25.951, “FDD Base Station (BS) classification”[8] 3GPP TR 25.895, ”Analysis of higher chip rates for UTRA TDD evolution.”[9] R4-070235, “Analysis of co-existence simulation results”, RAN4#42[10] R4-070084, “Coexistence Simulation Results for 5MHz E-UTRA -> UTRA FDD Uplink withRevised Simulation Assumptions”, RAN4#42[11] R4-070034, “Additional simulation results on 5 MHz LTE to WCDMA FDD UL co-existencestudies”, RAN4#42[12] R4-070262, “Simulation results on 5 MHz LTE to WCDMA FDD UL co-existence studies withrevised simulation assumptions”, RAN4#42[13] R4-070263, “Proposal on LTE ACLR requirements for UE”, RAN4#42[14] R4-061288, “Downlink LTE 900 (Rural Macro) with Downlink GSM900 (Rural Macro) Co-existence Simulation Results”, RAN4#41[15] R4-070391, “LTE 900 - GSM 900 Downlink Coexistence”, RAN4#42bis[16] R4-061304, “LTE 900 - GSM 900 Uplink Simulation Results”, RAN4#41[17] R4-070390, “LTE 900 - GSM 900 Uplink Simulation Results”, RAN4#42bis[18] R4-070392 “LTE-LTE Coexistence with asymmetrical bandwidth”, RAN4#42bis[19] 3GPP TS 36.104, ”Base Station (BS) radio transmission and reception”[20] 3GPP TS 25.104, ”Base Station (BS) radio transmission and reception (FDD)”[21] 3GPP TS 36.141, ”Base Station (BS) conformance testing”[22] Recommendation ITU-R SM.329-10, “Unwanted emissions in the spurious domain”[23] “International Telecommunications Union Radio Regulations”, Edition 2004, Volume 1 – Articles,ITU, December 2004.[24] “Adjacent Band Compatibility between UMTS and Other Services in the 2 GHz Band”, ERCReport 65, Menton, May 1999, revised in Helsinki, November 1999.[25] “Title 47 of the Code of Federal Regulations (CFR)”, Federal Communications Commission.[26] R4-070337, "Impact of second adjacent channel ACLR/ACS on ACIR" (Nokia SiemensNetworks).[27] R4-070430, "UE ACS and BS ACLRs" (Fujitsu ).[28] R4-070264, "Proposal on LTE ACLR requirements for Node B" (NTT DoCoMo).[29] Recommendation ITU-R M.1580-1, “Generic unwanted emission characteristics of base stationsusing the terrestrial radio interfaces of IMT-2000”.[30] Report ITU-R M.2039, “Characteristics of terrestrial IMT-2000 systems for frequencysharing/interference analyses”.[31] E TSI EN 301 908-3 V2.2.1 (2003-10), “Electromagnetic compatibility and Radio spectrumMatters (ERM); Base Stations (BS), Repeaters and User Equipment (UE) for IMT-2000 Third-Generation cellular networks; Part 3: Harmonized EN for IMT-2000, CDMA Direct Spread(UTRA FDD) (BS) covering essential requirements of article 3.2 of the R&TTE Directive”.3 Definitions, symbols and abbreviations3.1 Definitions3.2 Symbols3.3 AbbreviationsFor the purposes of the present document, the following abbreviations apply:ACIR Adjacent Channel Interference RatioACLR Adjacent Channel Leakage power RatioACS Adjacent Channel SelectivityAMC Adaptive Modulation and CodingAWGN Additive White Gaussian NoiseBS Base StationCDF Cumulative Distribution FunctionDL DownlinkFDD Frequency Division DuplexMC Monte-CarloMCL Minimum Coupling LossMCS Modulation and Coding SchemePC Power ControlPSD Power Spectral DensityRX ReceiverTDD Time Division DuplexTX TransmitterUE User EquipmentUL Uplink4 General assumptionsThe present document discusses system scenarios for E-UTRA operation primarily with respect to the radio transmission and reception including the RRM aspects. To develop the E-UTRA standard, all the relevant scenarios need to be considered for the various aspects of operation and the most critical cases identified. The process may then be iterated to arrive at final parameters that meet both service and implementation requirements.The E-UTRA system is intended to be operated in the same frequency bands specified for UTRA. In order to limit the number of frequency bands to be simulated in the various simulation scenarios a mapping of frequency bands to two simulation frequencies (900 MHz and 2000 MHz) is applied. When using the macro cell propagation model ofTR25.942 [3], the frequency contributes to the path loss by 21*log10(f). The maximum path loss difference between the lowest/highest frequencies per E-UTRA frequency band and corresponding simulation frequency is shown in tables 4.1 and 4.2.Table 4.1: Simulation frequencies for FDD mode E-UTRA frequency bandsTable 4.2: Simulation frequencies for TDD mode E-UTRA frequency bandsIt can be observed that the difference of path loss between simulation frequency and operating frequency (except bands 7, 11 and 38) is in the worst case less than 0.8 dB for the downlink and less the 1,5 dB for the uplink. Hence the mapping of operating frequency to simulation frequency will provide valid results.The validity of simulations performed at 2 GHz for the 2.6 GHz bands 7 and 38 was already analyzed in TR 25.810. Considering the expected higher antenna gain in the 2.6 GHz band the difference in path loss is in the order of 1 dB what is comparable to the other frequency bands.4.1 Interference scenariosThis chapter should cover how the interference scenarios could occur e.g. BS-BS, UE-BS etc.4.2 Antenna ModelsThis chapter contains the various antenna models for BS and UE4.2.1 BS antennas4.2.1.1 BS antenna radiation patternThe BS antenna radiation pattern to be used for each sector in 3-sector cell sites is plotted in Figure 4.1. The pattern is identical to those defined in [1], [2] and [4]:()23min 12, where 180180m dB A A θθθθ⎡⎤⎛⎫⎢⎥=--≤≤ ⎪⎢⎥⎝⎭⎣⎦,dB 3θ is the 3dB beam width which corresponds to 65 degrees, and dB A m 20= is the maximum attenuationFigure 4.1: Antenna Pattern for 3-Sector Cells4.2.1.2 BS antenna heights and antenna gains for macro cellsAntenna heights and gains for macro cells are given in table 4.3.Table 4.3: Antenna height and gain for Macro Cells4.2.2 UE antennasFor UE antennas, a omni-directional radiation pattern with antenna gain 0dBi is assumed [2], [3], [4].4.2.3 MIMO antenna Characteristicsxxxx4.3 Cell definitionsThis chapter contain the cell properties e.g. cell range, cell type (omni, sector), MIMO cell definitions etc.4.4 Cell layoutsThis chapter contains different cell layouts in form of e.g. single operator, multi-operator and multi layer cell layouts(e.g. macro-micro etc).4.4.1 Single operator cell layouts4.4.1.1 Macro cellular deploymentBase stations with 3 sectors per site are placed on a hexagonal grid with distance of 3*R, where R is the cell radius (see Figure 4.2), with wrap around. The number of sites shall be equal to or higher than 19. [2] [4].Figure 4.2: Single operator cell layout4.4.2 Multi operator / Multi layer cell layouts4.4.2.1 Uncoordinated macro cellular deploymentFor uncoordinated network simulations, identical cell layouts for each network shall be applied, with worst case shift between sites. Second network’s sites are located at the first network’s cell edge, as shown in Figure 4.3 [2].Figure 4.3: Multi operator cell layout - uncoordinated operation4.4.2.2 Coordinated macro cellular deploymentFor coordinated network simulations, co-location of sites is assumed; hence identical cell layouts for each network shall be applied [2].Figure 4.4: Multi operator cell layout - coordinated operation4.5 Propagation conditions and channel modelsThis chapter contains the definition of channel models, propagation conditions for various environments e.g. urban, suburban etc.For each environment a propagation model is used to evaluate the propagation pathloss due to the distance. Propagation models are adopted from [3] and [4] and presented in the following clauses.4.5.1 Received signalAn important parameter to be defined is the minimum coupling loss (MCL). MCL is the parameter describing the minimum loss in signal between BS and UE or UE and UE in the worst case and is defined as the minimum distance loss including antenna gains measured between antenna connectors. MCL values are adopted from [3] and [7] as follows:Table 4.4: Minimum Coupling LossesWith the above definition, the received power in downlink and uplink can be expressed as [3]: RX_PWR = TX_PWR – Max (pathloss – G_TX – G_RX, MCL) where:RX_PWR is the received signal power TX_PWR is the transmitted signal power G_TX is the transmitter antenna gain G_RX is the receiver antenna gain4.5.2 Macro cell propagation model – Urban AreaMacro cell propagation model for urban area is applicable for scenarios in urban and suburban areas outside the high rise core where the buildings are of nearly uniform height [3]:80dB (f)log 21(Dhb)log 18(R)log Dhb)104(140L 1010103+⋅+⋅-⋅⋅⋅-⋅=-where:R is the base station-UE separation in kilometres f is the carrier frequency in MHzDhb is the base station antenna height in metres, measured from the average rooftop levelConsidering a carrier frequency of 900MHz and a base station antenna height of 15 metres above average rooftop level, the propagation model is given by the following formula [4]:(R)37,6log 120,9L 10+=where:R is the base station-UE separation in kilometresConsidering a carrier frequency of 2000MHz and a base station antenna height of 15 metres above average rooftop level, the propagation model is given by the following formula:(R)37,6log 128,1L 10+=where:R is the base station-UE separation in kilometresAfter L is calculated, log-normally distributed shadowing (LogF) with standard deviation of 10dB should be added [2], [3]. A Shadowing correlation factor of 0.5 for the shadowing between sites (regardless aggressing or victim system) and of 1 between sectors of the same site shall be used The pathloss is given by the following formula:LogF L acro Pathloss_m +=NOTE 1: L shall in no circumstances be less than free space loss. This model is valid for NLOS case only anddescribes worse case propagation NOTE 2: The pathloss model is valid for a range of Dhb from 0 to 50 metres.NOTE 3: This model is designed mainly for distance from few hundred meters to kilometres. This model is notvery accurate for short distances. NOTE 4: The mean building height is equal to the sum of mobile antenna height (1,5m) and 10,5m Δh m = [5]. NOTE 5: Some downlink simulations in this TR were performed without shadowing correlation, however it wasreported this has a negligible impact on the simulation results.4.5.3 Macro cell propagation model – Rural AreaFor rural area, the Hata model was used in the work item UMTS900[2], this model can be reused:L (R)= 69.55 +26.16log 10(f)–13.82log 10(Hb)+[44.9-6.55log 10(Hb)]log(R) – 4.78(Log 10 (f))2+18.33 log 10 (f) -40.94 where:R is the base station-UE separation in kilometres f is the carrier frequency in MHzHb is the base station antenna height above ground in metresConsidering a carrier frequency of 900MHz and a base station antenna height of 45 meters above ground the propagation model is given by the following formula:(R)34,1log 5,95L 10+=where:R is the base station-UE separation in kilometresAfter L is calculated, log-normally distributed shadowing (LogF) with standard deviation of 10dB should be added [2], [3]. A Shadowing correlation factor of 0.5 for the shadowing between sites (regardless aggressing or victim system) and of 1 between sectors of the same site shall be used. The pathloss is given by the following formula:LogF L acro Pathloss_m +=NOTE 1: L shall in no circumstances be less than free space loss. This model is valid for NLOS case only anddescribes worse case propagation NOTE 2: This model is designed mainly for distance from few hundred meters to kilometres. This model is notvery accurate for short distances.4.6 Base-station modelThis chapter covers the fundamental BS properties e.g. output power, dynamic range, noise floor etc.Reference UTRA FDD base station parameters are given in Table 4.5.Table 4.5: UTRA FDD reference base station parameters(wcdma)Reference base station parameters for UTRA 1.28Mcps TDD are given in Table 4.5a.Table 4.5a: Reference base station for UTRA 1.28Mcps TDD(td-scdma)Reference UTRA 3.84 Mcps TDD base station parameters are given in Table 4.5b.Table 4.5b: Reference base station for UTRA 3.84Mcps TDD(td-cdma)Reference E-UTRA FDD and E-UTRA TDD base station parameters are given in Table 4.6.Table 4.6: E-UTRA FDD and E-UTRA TDD reference base station parametersReference base station parameters for E-UTRA TDD (LCR TDD frame structure based) are given in Table 4.6a.Table 4.6a: Reference base station for E-UTRA TDD (LCR TDD frame structure based)(td-lte)4.7 UE modelThis chapter covers the fundamental UE properties e.g. output power, dynamic range, noise floor etc. Reference UTRA FDD parameters are given in Table 4.7.Table 4.7: UTRA FDD reference UE parametersfor simulation alignment purpose, a Noise Figure of 9 dB will be used.Reference UTRA 1.28 Mcps TDD parameters are given in Table 4.7aTable 4.7a: Reference UE for UTRA 1.28 Mcps TDDReference UTRA 3.84 Mcps TDD UE parameters are given in Table 4.7b.Table 4.7b: UTRA 3.84 Mcps TDD reference UE parametersfor simulation alignment purpose, a Noise Figure of 9 dB will be used.Reference E-UTRA FDD and E-UTRA TDD UE parameters are given in Table 4.8.Table 4.8: E-UTRA FDD and E-UTRA TDD reference UE parametersHowever, for simulation alignment purpose, a Noise Figure of 9 dB will be used. Reference E-UTRA TDD UE (LCR TDD frame structure based) parameters are given in Table 4.8a.Table 4.8a: Reference UE for EUTRA TDD (LCR TDD frame structure based)4.8 RRM modelsThis chapter contains models that are necessary to study the RRM aspects e.g.4.8.1 Measurement modelsxxxx4.8.2 Modelling of the functionsxxxx4.9 Link level simulation assumptionsThis chapter covers Layer 1 aspects and assumptions (e.g. number of HARQ retransmissions) etc.4.10 System simulation assumptionsThis chapter contains system simulation assumptions e.g. Eb/No values for different services, activity factor for voice, power control steps, performance measures (system throughput, grade of service), confidence interval etc.4.10.1 System loadingxxxx5 Methodology descriptionThis chapter describes the methods used for various study items e.g. deterministic analysis for BS-BS interference, Monte-Carlo simulations and dynamic type of simulations for RRM.5.1 Methodology for co-existence simulationsSimulations to investigate the mutual interference impact of E-UTRA, UTRA and GERAN are based on snapshots were users are randomly placed in a predefined deployment scenario (Monte-Carlo approach). Assumptions or E-UTRA in this chapter are based on the physical layer (OFDMA DL and SC-FDMA UL) as described in the E-UTRA study item report [4]. It must be noted that actual E-UTRA physical layer specification of frequency resource block is different regarding number ofsub-carriers per resource block (12 instead of 25 specified in [4]) and regarding the size of a resource block (180 kHz instead of 375 kHz in [4]). However, this has no impact on the results and conclusions of the present document.5.1.1 Simulation assumptions for co-existence simulations5.1.1.1 SchedulerFor initial E-UTRA coexistence simulations Round Robin scheduler shall be used.5.1.1.2 Simulated servicesWhen using Round Robin scheduler, full buffer traffic shall be simulated. For E-UTRA downlink, one frequency resource block for one user shall be used. The E-UTRA system shall be maximum loaded, i.e. 24 frequency resource blocks in 10 MHz bandwidth and 12 frequency resource blocks in 5 MHz bandwidth respectively. For E-UTRA uplink, the number of allocated frequency resource blocks for one user is 4 for 5 MHz bandwidth and 8 for 10 MHz bandwidth respectively.For the 5 MHz TDD UTRA victim using 3.84 Mcps TDD, Enhanced Uplink providing data service shall be used where 1 UE shall occupy 1 Resource Unit (code x timeslot). Here the number of UE per timeslot is set to 3 UEs/timeslot.Other services, e.g. constant bit rate services are FFS.5.1.1.3 ACIR value and granularityFor downlink a common ACIR for all frequency resource blocks to calculate inter-system shall be used. Frequency resource block specific ACIR is FFS.For uplink it is assumed that the ACIR is dominated by the UE ACLR. The ACLR model is described in table 5.1 and table 5.2Table 5.1: ACLR model for 5MHz E-UTRA interferer and UTRAvictim, 4 RBs per UETable 5.2: ACLR model for E-UTRA interferer and 10MHz E-UTRA victimNote: This ACLR models are agreed for the purpose of co-existence simulations. ACLR/ACS requirements need to be discussedseparately.5.1.1.4.1 Uplink Asymmetrical Bandwidths ACIR (Aggressor withlarger bandwidth)Since the uplink ACLR of the aggressor is measured in the aggressor’s bandwidth, for uplink asymmetrical bandwidth coexistence, a victim UE with a smaller bandwidth than that of the aggressor will receive a fraction of the interference power caused by the aggressor’s ACLR. For two victim UEs falling within the 1st ACLR of the aggressor, the victim UE closer in frequency to the aggressor will experience higher interference than one that is further away in frequency. The difference in interference depends on the power spectral density (PSD) within the aggressor’s 1st ACLR bandwidth. For simplicity, it is assumed that the PSD is flat across the aggressor’s ACLR bandwidth. Hence, the ACLR can be relaxed (or increased) by the factor, F ACLR:F ACLR = 10 × LOG10(B Aggressor/B Victim)Where, B Aggressor and B Victim are the E-UTRA aggressor and victim bandwidths respectively.20 MHz E-UTRA 5 MHz E-UTRAFigure 5.1: 20 MHz E-UTRA UE aggressor to 5 MHz E-UTRA UEvictims20 MHz E-UTRA 10 MHz E-UTRAFigure 5.2: 20 MHz E-UTRA UE aggressor to 10 MHz E-UTRAUE victimsIn Table 5.2, the aggressor UE that is non adjacent to the victim UE, the victim UE will experience an interference due to an ACLR of 43 + X –F ACLR. For the case where the aggressor UE is adjacent to the victim UEs, consider the scenarios in Figure 5.1, 5.2 and 5.3, where a 20 MHz E-UTRA aggressor is adjacent to 3 victim UEs of 5 MHz, 10 MHz and 15 MHz E-UTRA systems respectively.In Figure 5.1, all the UEs in the 5 MHz E-UTRA system will be affected by an ACLR of 30 + X - F ACLR. For the 10 MHz E-UTRA victims in Figure 5.2, two UEs will be affected by an ACLR of 30 + X - F ACLR whilst 1 UE will be affected by a less severe ACLR of 43 + X- F ACLR . In the 15 MHz E-UTRA victim as shown in Figure 5.3, the UE next to the band edge will be affected by an ACLR of 30 + X - F ACLR whilst the UE farthest from the band edge will be affected by an ACLR of 43 + X - F ACLR. The victim UE of the 15 MHz E-UTRA occupying the centre RB (2nd from band edge) is affected by 1/3 ACLR of 30 + X - F ACLR and 2/3 ACLR of 43 + X - F ACLR. This gives an ACLR of 34 + X - F ACLR.Using a similar approach for 15 MHz, 10 MHz and 5 MHz aggressor with a victim of smaller system bandwidth, the ACLR affecting each of the 3 victim UEs can be determined. This is summarised in Table 5.2A. Here the value Y is defined for victim UE, where ACLR = Y + X - F ACLR. UE1 is the UE adjacent to the aggressor, UE2 is located at the centre and UE3 is furthest away from the aggressor.。

sae_j2534-1_2004

sae_j2534-1_2004

SURFACEVEHICLERECOMMENDED PRACTICESAE Technical Standards Board Rules provide that: “This report is published by SAE to advance the state of technical and engineering sciences. The use of this report is entirely voluntary, and its applicability and suitability for any particular use, including any patent infringement arising therefrom, is the sole responsibility of the user.”SAE reviews each technical report at least every five years at which time it may be reaffirmed, revised, or cancelled. SAE invites your written comments and suggestions.Copyright © 2004 SAE InternationalAll rights reserved. No part of this publication may be reproduced, stored in a retrieval system or transmitted, in any form or by any means, electronic, mechanical, photocopying, recording, or otherwise, without the prior written permission of SAE.TO PLACE A DOCUMENT ORDER: Tel: 877-606-7323 (inside USA and Canada)Tel: 724-776-4970 (outside USA)SAE J2534-1 Revised DEC2004TABLE OF CONTENTS 1. Scope (5)2. References (5)2.1 Applicable Documents (5)2.1.1 SAE Publications (5)2.1.2 ISO Documents (6)3. Definitions (6)4. Acronyms (6)5. Pass-Thru C oncept (7)6. Pass-Thru System Requirements (8)6.1 P C Requirements (8)6.2 Software Requirements and Assumptions (8)6.3 Connection to PC (9)6.4 Connection to Vehicle............................................................................................................9 6.5 C ommunication Protocols (9)6.5.1 ISO 9141................................................................................................................................9 6.5.2 ISO 14230-4 (KWP2000).. (10)6.5.3 SAE J1850 41.6 kbps PWM (Pulse Width Modulation) (10)6.5.4 SAE J1850 10.4 kbps VPW (Variable Pulse Width) (10)6.5.5 C AN (11)6.5.6 ISO 15765-4 (CAN) (11)6.5.7 SAE J2610 DaimlerChrysler SCI (11)6.6 Simultaneous Communication on Multiple Protocols (11)6.7 Programmable Power Supply (12)6.8 Pin Usage (13)6.9 Data Buffering (14)6.10 Error Recovery (14)6.10.1 Device Not Connected (14)6.10.2 Bus Errors (14)7. Win32 Application Programming Interface (15)7.1 API Functions – Overview (15)7.2 API Functions - Detailed Information (15)7.2.1 PassThruOpen (15)7.2.1.1 C /C ++ Prototype (15)7.2.1.2 Parameters (16)7.2.1.3 Return Values (16)7.2.2 PassThru C lose (16)7.2.2.1 C /C ++ Prototype (16)7.2.2.2 Parameters (16)7.2.2.3 Return Values (17)7.2.3 PassThru C onnect (17)7.2.3.1 C /C ++ Prototype (17)7.2.3.2 Parameters (17)7.2.3.3 Flag Values (18)7.2.3.4 Protocal ID Values (19)SAE J2534-1 Revised DEC20047.2.3.5 Return Values (20)7.2.4 PassThruDisconnect............................................................................................................20 7.2.4.1 C /C ++ Prototype (20)7.2.4.2 Parameters (21)7.2.4.3 Return Values ......................................................................................................................21 7.2.5 PassThruReadMsgs. (21)7.2.5.1 C /C ++ Prototype (22)7.2.5.2 Parameters...........................................................................................................................22 7.2.5.3 Return Values . (23)7.2.6 PassThruWriteMsgs (23)7.2.6.1 C /C ++ Prototype ..................................................................................................................24 7.2.6.2 Parameters (24)7.2.6.3 Return Values (25)7.2.7 PassThruStartPeriodicMsg..................................................................................................26 7.2.7.1 C /C ++ Prototype (26)7.2.7.2 Parameters (26)7.2.7.3 Return Values ......................................................................................................................27 7.2.8 PassThruStopPeriodicMsg .. (27)7.2.8.1 C /C ++ Prototype (28)7.2.8.2 Parameters...........................................................................................................................28 7.2.8.3 Return Values . (28)7.2.9 PassThruStartMsgFilter.......................................................................................................28 7.2.9.1 C /C ++ Prototype (31)7.2.9.2 Parameters (31)7.2.9.3 Filter Types ..........................................................................................................................32 7.2.9.4 Return Values . (33)7.2.10 PassThruStopMsgFIlter (33)7.2.10.1 C /C ++ Prototype ..................................................................................................................33 7.2.10.2 Parameters (34)7.2.10.3 Return Values (34)7.2.11 PassThruSetProgrammingVoltage (34)7.2.11.1 C /C ++ Prototype (34)7.2.11.2 Parameters (35)7.2.11.3 Voltage Values (35)7.2.11.4 Return Values (35)7.2.12 PassThruReadVersion (36)7.2.12.1 C /C ++ Prototype (36)7.2.12.2 Parameters (36)7.2.12.3 Return Values (37)7.2.13 PassThruGetLastError (37)7.2.13.1 C /C ++ Prototype (37)7.2.13.2 Parameters (37)7.2.13.3 Return Values (37)7.2.14 PassThruIoctl (38)7.2.14.1 C /C ++ Prototype (38)7.2.14.2 Parameters (38)7.2.14.3 Ioctl ID Values (39)7.2.14.4 Return Values (39)7.3 IO C TL Section (40)7.3.1 GET_C ONFIG (41)7.3.2 SET_C ONFIG (42)SAE J2534-1 Revised DEC20047.3.3 READ_VBATT (46)7.3.4 READ_PROG_VOLTAGE....................................................................................................46 7.3.5 FIVE_BAUD_INIT . (47)7.3.6 FAST_INIT (47)7.3.7 C LEAR_TX_BUFFER (48)7.3.8 C LEAR_RX_BUFFER (48)7.3.9 C LEAR_PERIODI C _MSGS (49)7.3.10 C LEAR_MSG_FILTERS (49)7.3.11 C LEAR_FUN C T_MSG_LOOKUP_TABLE (49)7.3.12 ADD_TO_FUN C T_MSG_LOOKUP_TABLE (50)7.3.13 DELETE_FROM_FUN C T_MSG_LOOKUP_TABLE (50)8. Message Structure (51)8.1 C /C ++ Definition (51)8.2 Elements (51)8.3 Message Data Formats (52)8.4 Format Checks for Messages Passed to the API (53)8.5 Conventions for Returning Messages from the API (53)8.6 Conventions for Returning Indications from the API (53)8.7 Message Flag and Status Definitions..................................................................................54 8.7.1 RxStatus. (54)8.7.2 RxStatus Bits for Messaging Status and Error Indication....................................................55 8.7.3 TxFlags.................................................................................................................................56 9. DLL Installation and Registry...............................................................................................57 9.1 Naming of Files....................................................................................................................57 9.2 Win32 Registy. (57)9.2.1 User Application Interaction with the Registry (59)9.2.2 Attaching to the DLL from an application (60)9.2.2.1 Export Library Definition File (61)10. Return Value Error Codes (61)11. Notes (63)11.1 Marginal Indicia (63)Appendix A General ISO 15765-2 Flow Control Example (64)A.1 Flow Control Overview (64)A.1.1 Examples Overview (65)A.2 Transmitting a Segmented Message (66)A.2.1 C onversation Setup (66)A.2.2 Data Transmission (67)A.2.3 Verification (68)A.3 Transmitting an Unsegmented Message (69)A.3.1 Data Transmission (70)A.3.2 Verification (70)A.4 Receiving a Segmented Message (70)A.4.1 C onversation Setup (70)A.4.2 Reception Notification (70)A.4.3 Data Reception (71)A.5 Receiving and Unsegmented Messages (72)1.ScopeThis SAE Recommended Practice provides the framework to allow reprogramming software applications from all vehicle manufacturers the flexibility to work with multiple vehicle data link interface tools from multiple tool suppliers. This system enables each vehicle manufacturer to control the programming sequence for electronic control units (EC Us) in their vehicles, but allows a single set of programming hardware and vehicle interface to be used to program modules for all vehicle manufacturers.This document does not limit the hardware possibilities for the connection between the PC used for the software application and the tool (e.g., RS-232, RS-485, USB, Ethernet…). Tool suppliers are free to choose the hardware interface appropriate for their tool. The goal of this document is to ensure that reprogramming software from any vehicle manufacturer is compatible with hardware supplied by any tool manufacturer.U.S. Environmental Protection Agency (EPA) and the C alifornia Air Resources Board (ARB) "OBD service information" regulations include requirements for reprogramming emission-related control modules in vehicles for all manufacturers by the aftermarket repair industry. This document is intended to conform to those regulations for 2004 and later model year vehicles. For some vehicles, this interface can also be used to reprogram emission-related control modules in vehicles prior to the 2004 model year, and for non-emission related control modules. For other vehicles, this usage may require additional manufacturer specific capabilities to be added to a fully compliant interface. A second part to this document, SAE J2534-2, is planned to include expanded capabilities that tool suppliers can optionally include in an interface to allow programming of these additional non-mandated vehicle applications. In addition to reprogramming capability, this interface is planned for use in OBD compliance testing as defined in SAE J1699-3. SAE J2534-1 includes some capabilities that are not required for Pass-Thru Programming, but which enable use of this interface for those other purposes without placing a significant burden on the interface manufacturers.Additional requirements for future model years may require revision of this document, most notably the inclusion of SAE J1939 for some heavy-duty vehicles. This document will be reviewed for possible revision after those regulations are finalized and requirements are better understood. Possible revisions include SAE J1939 specific software and an alternate vehicle connector, but the basic hardware of an SAE J2534 interface device is expected to remain unchanged.2.References2.1Applicable PublicationsThe following publications form a part of this specification to the extent specified herein. Unless otherwise indicated, the latest version of SAE publications shall apply.2.1.1SAE P UBLICATIONSAvailable from SAE, 400 Commonwealth Drive, Warrendale, PA 15096-0001.SAE J1850—Class B Data Communications Network InterfaceSAE J1939—Truck and Bus Control and Communications Network (Multiple Parts Apply)SAE J1962—Diagnostic ConnectorSAE J2610—DaimlerChrysler Information Report for Serial Data Communication Interface (SCI)2.1.2 ISO D OCUMENTSAvailable from ANSI, 25 west 43rd Street, New York, NY 10036-8002.ISO 7637-1:1990—Road vehicles—Electrical disturbance by conduction and coupling—Part 1:Passenger cars and light commercial vehicles with nominal 12 V supply voltageISO 9141:1989—Road vehicles—Diagnostic systems—Requirements for interchange of digital informationISO 9141-2:1994—Road vehicles—Diagnostic systems—C ARB requirements for interchange of digitalinformationISO 11898:1993—Road vehicles—Interchange of digital information—Controller area network (CAN) forhigh speed communicationISO 14230-4:2000—Road vehicles—Diagnostic systems—Keyword protocol 2000—Part 4:Requirements for emission-related systemsISO/FDIS 15765-2—Road vehicles—Diagnostics on controller area networks (C AN)—Network layerservicesISO/FDIS 15765-4—Road vehicles—Diagnostics on controller area networks (C AN)—Requirements foremission-related systems3.Definitions 3.1 RegistryA mechanism within Win32 operating systems to handle hardware and software configuration information.4. AcronymsAPI Application Programming InterfaceASCII American Standard Code for Information InterchangeCAN Controller Area NetworkC R C C yclic Redundancy C heckDLL Dynamic Link LibraryECU Electronic Control UnitIFR In-Frame ResponseIOCTL Input / Output ControlKWP Keyword ProtocolOEM Original Equipment ManufacturerP C Personal C omputerPWM Pulse Width ModulationSCI Serial Communications InterfaceSCP Standard Corporate ProtocolUSB Universal Serial BusVPW Variable Pulse Width5.Pass-Thru ConceptProgramming application software supplied by the vehicle manufacturer will run on a commonly available generic PC. This application must have complete knowledge of the programming requirements for the control module to be programmed and will control the programming event. This includes the user interface, selection criteria for downloadable software and calibration files, the actual software and calibration data to be downloaded, the security mechanism to control access to the programming capability, and the actual programming steps and sequence required to program each individual control module in the vehicle. If additional procedures must be followed after the reprogramming event, such as clearing Diagnostic Trouble C odes (DTC), writing part numbers or variant coding information to the control module, or running additional setup procedures, the vehicle manufacturer must either include this in the PC application or include the necessary steps in the service information that references reprogramming.This document defines the following two interfaces for the SAE J2534 pass-thru device:a. Application program interface (API) between the programming application running on a PC and asoftware device driver for the pass-thru deviceb. Hardware interface between the pass-thru device and the vehicleThe manufacturer of an SAE J2534 pass-thru device shall supply connections to both the PC and the vehicle. In addition to the hardware, the interface manufacturer shall supply device driver software, and a Windows installation and setup application that will install the manufacturer's SAE J2534 DLL and other required files, and also update the Windows Registry. The interface between the PC and the pass-thru device can be any technology chosen by the tool manufacturer, including RS-232, RS-485, USB, Ethernet, or any other current or future technology, including wireless technologies.All programming applications shall utilize the common SAE J2534 API as the interface to the pass-thru device driver. The API contains a set of routines that may be used by the programming application to control the pass-thru device, and to control the communications between the pass-thru device and the vehicle. The pass-thru device will not interpret the message content, allowing any message strategy and message structure to be used that is understood by both the programming application and the ECU being programmed. Also, because the message will not be interpreted, the contents of the message cannot be used to control the operation of the interface. For example, if a message is sent to the ECU to go to high speed, a specific instruction must also be sent to the interface to go to high speed.The OEM programming application does not need to know the hardware connected to the PC, which gives the tool manufacturers the flexibility to use any commonly available interface to the PC. The pass-thru device does not need any knowledge of the vehicle or control module being programmed. This will allow all programming applications to work with all pass-thru devices to enable programming of all control modules for all vehicle manufacturers.The interface will not handle the tester present messages automatically. The OEM application is responsible to handle tester present messages.6.3Connection to PCThe interface between the PC and the pass-thru device shall be determined by the manufacturer of the pass-thru device. This can be RS-232, USB, Ethernet, IEEE1394, Bluetooth or any other connection that allows the pass-thru device to meet all other requirements of this document, including timing requirements. The tool manufacturer is also required to include the device driver that supports this connection so that the actual interface used is transparent to both the PC programming application and the vehicle.6.4Connection to VehicleThe interface between the pass-thru device and the vehicle shall be an SAE J1962 connector for serial data communications. The maximum cable length between the pass-thru device and the vehicle is five (5) meters. The interface shall include an insulated banana jack that accepts a standard 0.175" diameter banana plug as the auxiliary pin for connection of programming voltage to a vehicle specific connector on the vehicle.If powered from the vehicle, the interface shall:a. operate normally within a vehicle battery voltage range of 8.0 to 18.0 volts D.C.,b. survive a vehicle battery voltage of up to 24.0 volts D.C. for at least 10 minutes,c. survive, without damage to the interface, a reverse vehicle battery voltage of up to 24.0 volts D.C. forat least 10 minutes.6.5Communication ProtocolsThe following communication protocols shall be supported:6.5.1ISO9141The following specifications clarify and, if in conflict with ISO 9141, override any related specifications in ISO 9141:a. The maximum sink current to be supported by the interface is 100 mA.b. The range for all tests performed relative to ISO 7637-1 is –1.0 to +40.0 V.c. The default bus idle period before the interface shall transmit an address, shall be 300 ms.d. Support following baud rate with ±0.5% tolerance: 10400.e. Support following baud rate with ±1% tolerance: 10000.f. Support following baud rates with ±2% tolerance: 4800, 9600, 9615, 9800, 10870, 11905, 12500,13158, 13889, 14706, 15625, and 19200.g. Support other baud rates if the interface is capable of supporting the requested value within ±2%.h. The baud rate shall be set by the application, not determined by the SAE J2534 interface. Theinterface is not required to support baud rate detection based on the synchronization byte.i. Support odd and even parity in addition to the default of no parity, with seven or eight data bits.Always one start bit and one stop bit.j. Support for timer values that are less than or greater than those specified in ISO 9141 (see Figure 30 in Section 7.3.2).k. Support ability to disable automatic ISO 9141-2 / ISO 14230 checksum verification by the interface to allow vehicle manufacturer specific error detection.l. If the ISO 9141 checksum is verified by the interface, and the checksum is incorrect, the message will be discarded.m. Support both ISO 9141 5-baud initialization and ISO 14230 fast initialization.n. Interface shall not adjust timer parameters based on keyword values.6.5.2ISO14230-4(KWP2000)The ISO 14230 protocol has the same specifications as the ISO 9141 protocol as outlined in the previous section. In addition, the following specifications clarify and, if in conflict with ISO 14230, override any related specifications in ISO 14230:a. The pass-thru interface will not automatically handle tester present messages. The application needsto handle tester present messages when required.b. The pass-thru interface will not perform any special handling for the $78 response code. Anymessage received with a $78 response code will be passed from the interface to the application. The application is required to handle any special timing requirements based on receipt of this response code, including stopping any periodic messages.6.5.3SAE J185041.6 KBPS PWM(P ULSE W IDTH M ODULATION)The following additional features of SAE J1850 must be supported by the pass-thru device:a. Capable of 41.6 kbps and high speed mode of 83.3 kbps.b. Recommend Ford approved SAE J1850PWM (SCP) physical layer6.5.4SAE J185010.4 KBPS VPW(V ARIABLE P ULSE W IDTH)The following additional features of SAE J1850 must be supported by the pass-thru device:a. Capable of 10.4 kbps and high speed mode of 41.6 kbpsb. 4128 byte block transferc. Return to normal speed after a break indication6.5.5CANThe following features of ISO 11898 (CAN) must be supported by the pass-thru device:a. 125, 250, and 500 kbpsb. 11 and 29 bit identifiersc. Support for 80% ± 2% and 68.5% ± 2% bit sample pointd. Allow raw C AN messages. This protocol can be used to handle any custom C AN messagingprotocol, including custom flow control mechanisms.6.5.6ISO15765-4(CAN)The following features of ISO 15765-4 must be supported by the pass-thru device:a. 125, 250, and 500 kbpsb. 11 and 29 bit identifiersc. Support for 80% ± 2% bit sample pointd. To maintain acceptable programming times, the transport layer flow control function, as defined inISO 15765-2, must be incorporated in the pass-thru device (see Appendix A). If the application does not use the ISO 15765-2 transport layer flow control functionality, the CAN protocol will allow for any custom transport layer.e. Receive a multi-frame message with an ISO15765_BS of 0 and an ISO15765_STMIN of 0, asdefined in ISO 15765-2.f. No single frame or multi-frame messages can be received without matching a flow control filter. Nomulti-frame messages can be transmitted without matching a flow control filter.g. Periodic messages will not be suspended during transmission or reception of a multi-framesegmented message.6.5.7SAE J2610D AIMLER C HRYSLER SCIReference the SAE J2610 Information Report for a description of the SCI protocol.When in the half-duplex mode (when SCI_MODE of TxFlags is set to {1} Half-Duplex), every data byte sent is expected to be "echoed" by the controller. The next data byte shall not be sent until the echo byte has been received and verified. If the echoed byte received doesn't match the transmitted byte, or if after a period of T1 no response was received, the transmission will be terminated. Matching echoed bytes will not be placed in the receive message queue.6.6Simultaneous Communication On Multiple ProtocolsThe pass-thru device must be capable of supporting simultaneous communication on multiple protocols during a single programming event. Figure 2 indicates which combinations of protocols shall be supported. If SC I (SAE J2610) communication is not required during the programming event, the interface shall be capable of supporting one of the protocols from data link set 1, data link set 2, and data link set 3. If SC I (SAE J2610) communication is required during the programming event, the interface shall be capable of supporting one of the SCI protocols and one protocol from data link set 1.6.9Data BufferingThe interface/API shall be capable of receiving 8 simultaneous messages. For ISO 15765 these can be multi-frame messages. The interface/API shall be capable of buffering a maximum length (4128 byte) transmit message and a maximum length (4128 byte) receive message.6.10Error Recovery6.10.1D EVICE N OT C ONNECTEDIf the DLL returns ERR_DEVICE_NOT_CONNECTED from any function, that error shall continue to be returned by all functions, even if the device is reconnected. An application can recover from this error condition by closing the device (with PassThruC lose) and re-opening the device (with PassThruOpen, getting a new device ID).6.10.2B US E RRORSAll devices shall handle bus errors in a consistent manner. There are two error strategies: Retry and Drop.The Retry strategy will keep trying to send a packet until successful or stopped by the application. If loopback is on and the message is successfully sent after some number of retries, only one copy of the message shall be placed in the receive queue. Even if the hardware does not support retries, the firmware/software must retry the transmission. If the error condition persists, a blocking write will wait the specified timeout and return ERR_TIMEOUT. The DLL must return the number of successfully transmitted messages in pNumMsgs. The DLL shall not count the message being retried in pNumMsgs. After returning from the function, the device does not stop the retries. The only functions that will stop the retries are PassThruDisconnect (on that protocol), PassThruC lose, or PassThruIoctl (with an IoctllD of CLEAR_TX_BUFFER).Devices shall use the Retry strategy in the following scenarios:•All CAN errors, such as bus off, lack of acknowledgement, loss of arbitration, and no connection (lack of terminating resistor)•SAE J1850PWM or SAE J1850VPW bus fault (bus stuck passive) or loss of arbitration (bus stuck active)The Drop strategy will delete a message from the queue. The message can be dropped immediately on noticing an error or at the end of the transmission. PassThruWriteMsg shall treat dropped messages the same as successfully transmitted messages. However, if loopback is on, the message shall not be placed in the receive queue.Devices shall use the Drop strategy in the following scenarios:•If characters are echoed improperly in SCI•Corrupted ISO 9141 or ISO 14230 transmission•SAE J1850PWM lack of acknowledgement (Exception: The device must try sending the message 3 times before dropping)7.2.5.1 C / C++ Prototypeextern “C” long WINAPI PassThruReadMsgs(unsigned long ChannelID,*pMsg,PASSTHRU_MSGunsigned long *pNumMsgs,unsigned long Timeout)7.2.5.2ParametersChannelID The channel ID assigned by the PassThruConnect function.pMsg Pointer to message structure(s).pNumMsgs Pointer to location where number of messages to read is specified. On return from the function this location will contain the actual number of messages read.Timeout Read timeout (in milliseconds). If a value of 0 is specified the function retrieves up to pNumMsgs messages and returns immediately. Otherwise, the API will not return untilthe Timeout has expired, an error has occurred, or the desired number of messageshave been read. If the number of messages requested have been read, the functionshall not return ERR_TIMEOUT, even if the timeout value is zero.When using the ISO 15765-4 protocol, only SingleFrame messages can be transmitted without a matching flow control filter. Also, P I bytes are transparently added by the API. See PassThruStartMsgFilter and Appendix A for a discussion of flow control filters.7.2.6.1 C / C++ Prototypeextern “C” long WINAPI PassThruWriteMsgs(u nsigned long ChannelID,*pMsg,PASSTHRU_MSGunsigned long *pNumMsgs,unsigned long Timeout)7.2.6.2ParametersChannelID The channel ID assigned by the PassThruConnect function.pMsg Pointer to message structure(s).pNumMsgs Pointer to the location where number of messages to write is specified. On return will contain the actual number of messages that were transmitted (when Timeout is non-zero) or placed in the transmit queue (when Timeout is zero).Timeout Write timeout (in milliseconds). When a value of 0 is specified, the function queues as many of the specified messages as possible and returns immediately. When a valuegreater than 0 is specified, the function will block until the Timeout has expired, an errorhas occurred, or the desired number of messages have been transmitted on the vehiclenetwork. Even if the device can buffer only one packet at a time, this function shall beable to send an arbitrary number of packets if a Timeout value is supplied. Since thefunction returns early if all the messages have been sent, there is normally no penalty forhaving a large timeout (several seconds). If the number of messages requested havebeen written, the function shall not return ERR_TIMEOUT, even if the timeout value iszero.W hen an ERR_TIMEOUT is returned, only the number of messages that were sent onthe vehicle network is known. The number of messages queued is unknown. Applicationwriters should avoid this ambiguity by using a Timeout value large enough to work onslow devices and networks with arbitration delays.。

川大软院计网选择题答案Chapter4(含答案)

川大软院计网选择题答案Chapter4(含答案)

CHAPTER 4: NETWORK LAYER1.Which of the following groups belongs to network layer protocol? _____D____A.IP, TCP and UDPB.ARP, IP, and UDPC.FTP, IMAP and IPD.ICMP, BGP, and RIP2.The 3-PDU is named as ____C_____A.messageB.packetC.datagramD.segment3.In a datagram network, the forwarding decision is based on the value of the____B field in the packet header.A.source addressB.destination addressbelD.None of the choices are4.HOL blocking happens on ____A_____A.input portB.output portC.switching fabricsD.all of above5.If no free buffers in router, the arriving packets will be: AA.droppedB.queuedC.returnedD.marked6.During normal IP packet forwarding at a router, which of the following packetfields are updated? ____C____A.Source IP addressB.Destination IP addressC.ChecksumD.Destination port number7.Which of the following IP address doesn’t belong to the 202.115.32.0/25 network?______D___A.202.115.32.1B.202.115.32.11C.202.115.32.120D.202.115.32.1298.You are given an IP network of 192.168.5.0 and told that you need to separatethis network into sub networks that can support a maximum of 30 hosts per subnet.This will help alleviate congestion on the network. What subnet mask can you use to create the subnets necessary to meet the given criteria? ___C______A.255.255.255.0B.255.255.255.128C.255.255.255.224D.255.255.255.2409.An IP datagram of 1500 bytes (20 byte of IP header plus 1480 bytes of IP payload)arrives at a router and must be forwarded to a link with an MTU of 500 bytes.Thus the router has to fragment the datagram. To the last fragment, the value of offset should be _____D____A.1440B.1000C.186D.18010.IP is a ____C_____ protocol.A.connection-oriented unreliableB.connection-oriented reliableC.connectionless unreliableD.connectionless reliable11.Which ICMP message type is the basis for the Traceroute utility?BA.Echo RequestB.TTL expiredC.Host UnreachableD.Fragment Reassembly Time Exceed12.Routers in the path are not allowed to _________________B__________.A.fragment the packet they receiveB.change source or destination addressC.decapsulate the packetD.All of the choices are correct13.____B_____ allows a site to use a set of private addresses for internalcommunication and a set of global Internet addresses for communication with the rest of the world.A.DHCPB.NATC.ICMPD.None of the choices are correct14.How many bits are there in IPv6 ? ______C___A.32B.64C.128D.25615.In CIDR notation, which of the following networks contains host 192.168.14.2?CA.192.168.10.0/22B.192.168.11.0/21C.192.168.12.0/23D.192.168.13.0/2416.What is the limited broadcast address corresponding to the node with thefollowing IP address: 131.15.46.59?DA.131.15.46.255B.131.15.255.255C.255.255.255.255D.None of the above17.In classful IP addressing, how many network bits does 125.140.128.16 have?AA.8B.16C.24D.3218.What is the broadcast IP address for 193.140.141.128 / 26 ?DA.193.140.141.128B.193.140.141.127C.255.255.255.63D.193.140.141.19119.What’s a network? From IP address perspective they can physically reach eachother without intervening router and the device interfaces with: CA.same IP addressB.same TCP port #C.same network part of IP addressD.same host part of IP address20.The Internet’s network layer has three major components, the first component isthe IP protocol, the second component is the routing protocol, the final component is____.DA.forwardingB.address translationC.checkD.ICMP21.IP addressing assigns an address to 223.10.198.250/29, the network address forthis network is____.A()A.223.10.198.248B.223.10.198.250C.223.10.198.0D.223.10.0.022.There are two 16-bit integers: 1110 0110 0110 0110, 1101 0101 0101 0101. Theirchecksum isA____.A.0100010001000011B.1011101110111100C.1111111111111111D.100000000000000023.The use of hierarchy in routing tables can __A______ the size of the routingtables.A.reduceB.increaseC.neither reduce nor increaseD.None of the choices are correct24.Which of the following protocol doesn’t belong to intra-AS routing protocol?_____B____A.RIPB.BGPC.OSPFD.IRAP25.Which of the following protocol belongs to intra-AS routing protocol?______A___A.RIPB.BGPC.DV (Distance Vector)D.LS (Link State)26.In OSPF network, a ____B_____ belongs to both an area and the backbone.A.internal routerB.area border routerC.boundary routerD.backbone router27._A___ is an inter-domain routing protocol using path vector routing.A.BGPB.RIPC.OSPFD.None of the choices are correct28.RIP uses the services of ___C____.A.TCPB.IPC.UDPD.None of the choices are correct29.The Routing Information Protocol (RIP) is an intra-domain routing based on_______A__ routing.A.distance vectorB.link stateC.path vectorD.all of the above30.Which of the following algorithm has the so called count-to-infinity problem?CA.Flooding algorithmB.Link-state algorithmC.Distance vector algorithmD.None of the above。

NORMA 4000 5000 Power Analyzer 用户说明手册说明书

NORMA 4000 5000 Power Analyzer 用户说明手册说明书

Since some countries or states do not allow limitation of the term of an implied warranty, or exclusion or limitation of incidental or consequential damages, the limitations and exclusions of this warranty may not apply to every buyer. If any provision of this Warranty is held invalid or unenforceable by a court or other decision-maker of competent jurisdiction, such holding will not affect the validity or enforceability of any other provision.
BEGRENZTE GEWÄHRLEISTUNG UND HAFTUNGSBESCHRÄNKUNG
Fluke gewährleistet, daß jedes Fluke-Produkt unter normalem Gebrauch und Service frei von Material- und Fertigungsdefekten ist. Die Garantiedauer beträgt 2 Jahre ab Versanddatum. Die Garantiedauer für Teile, Produktreparaturen und Service beträgt 90 Tage. Diese Garantie wird ausschließlich dem Erster

拉扎维授课课件 Ch1-8

拉扎维授课课件 Ch1-8

CH2
Basic Physics of Semiconductors
19
Current Flow: General Case
I v W h n q
Electric current is calculated as the amount of charge in v meters that passes thru a cross-section if the charge travel with a velocity of v m/s.
CH1 Why Microelectronics? 3
Frequency Up-conversion
Voice is “up-converted” by multiplying two sinusoids. When multiplying two sinusoids in time domain, their spectra are convolved in frequency domain.
CH2
Basic Physics of Semiconductors
15
Doping (P type)
If Si is doped with B (boron), then it has more holes, or becomes type P.
CH2
Basic Physics of Semiconductors
9
Charge Carriers in Semiconductor
To understand PN junction‟s IV characteristics, it is important to understand charge carriers‟ behavior in solids, how to modify carrier densities, and different mechanisms of charge flow.

Switchgear HMI Dashboard System SECTION XXXXX, REV

Switchgear HMI Dashboard System SECTION XXXXX, REV

SECTION XXXXXSWITCHGEAR HMI DASHBOARD SYSTEMPART 1GENERAL1.01SCOPEA.This section describes the visualization requirements for a modular, scalable HMIinterface offering monitoring and control for meters, relays, gateways, trip units, andother electronic components as installed in low and medium voltage switchgear.B.The Contractor shall furnish and install the necessary equipment specified herein. The equipment shall be as shown on the drawings and outlined below.C.This section includes the supply and installation of a standalone/ localized Dashboardsystem for each switchgear line up as detailed on the drawings and described in thisspecification. The Dashboard system is defined to include, but not to be limited to,electronic devices for metering, monitoring, control and protection, any necessaryEthernet communications devices, communication wiring, HMI, ancillary equipment,startup and training services, and ongoing technical support.D.The Dashboard system shall be Eaton Power Xpert Dashboard or approved equal. PART 2PRODUCTSSWITCHGEAR DASHBOARD SYSTEM2.01A.The Dashboard software shall run on a dedicated processor installed in the switchgear.The processor will control access to the electronic devices connected to it. Theprocessor shall be the Power Xpert Dashboard Processor or approved equal. Thereshall be a Power Xpert Dashboard Processor dedicated for each switchgear line up.Each processor shall offer monitoring and control for the switchgear lineup to which it is interfaced.B.The HMI used with the dashboard shall be equivalent to 21.5” or 15.6” Eaton XP-503with a resolution of 1920 x 1080.1.The HMI shall support intuitive multi-touch functionality permitting user to pinch,zoom, scroll and swipe.C.* The HMI shall be mounted in a switchgear control compartment at a convenientviewing height.D.* The HMI shall be mounted in an enclosure mounted on the wall and wired by thecontractor. The enclosure shall include a disconnect and power supply to power theHMI. The enclosure shall be located near the switchgear but outside the arc flashboundary.E.* The HMI shall be mounted in a self-supporting kiosk mounted on the floor and wired by the contractor. The enclosure shall include a disconnect and power supply to power the HMI. The enclosure shall be located near the switchgear but outside the arc flashboundary.F.When multiple switchgear lineups are located in the same room, one HMI may connect to each Power Xpert Dashboard Processor with the ability to switch between lineups as desired.G.The HMI shall use Ethernet CAT6 as physical media to communicate with the Power Xpert Dashboard Processor located in the switchgear either directly or via an Ethernet switch.H.The electronic components connecting to the Power Xpert Dashboard Processor shall include E-Series protective relays, Magnum DS Digitrip 1150 or 520MC trip units, Power Xpert and IQ Series electronic meters, Insulgard Partial Discharge relays, Eaton ELC PLC, and Eaton Transformer Monitoring system (TC-50/100).I.Security1.Local viewing of the Dashboard on the HMI shall not require a login. All otheraccess will require a username and password subject to configurable passwordrules.2.The Dashboard shall support multiple security levels that can be assigned asroles to simplify creating user accounts. Role-Based Access Control (RBAC)shall be used to create the set of users and role-based permissions. Acomprehensive set of password management features shall be available to allowcompliance with security policies in effect at the site.3.Control access points shall be strictly controlled through pairing of the HMI, withthe processor. Additional security shall be provided by limiting access to thecommunication ports by authorized trusted hosts’ IP addresses4.SSL Encryption shall be available to ensure that information and passwordsexchanged with the Dashboard cannot be intercepted on the LAN.J.Remote access to view information on the Power Xpert Dashboard Processor shall be available through a web interface. The web interface shall be accessible on personal computers, tablets or phones. All remote breaker control through the web interface shall be disabled unless the user enables this access for specific users.K.Using the onboard SMTP support, a user shall have the ability to customize and direct email to notifications to up to 10 users in their organization. These shall be selectable from alarm notifications, waveform notifications, trend log, alarm log, and daily emails. L.The Power Xpert Dashboard Processor shall support the following Network protocols for connection to DCS, BMS or SCADA systems:1.Modbus TCP/IP: Supports data access from Modbus TCP clients2.BACnet/IP: Supports data access from BACnet clientsM.Arc Flash1.The Dashboard shall display the appropriate PPE level and ARMS status basedon data provided from an arc flash study and status of the main breaker’s ArcFlash Reduction Mode on all the screens.2.Touching the PPE level indicator shall display customizable diagrams of relevantPPE that meet site requirements for the incident energy levels shown in theswitchgear. This page shall also display the arc flash boundary distance andcalculated incident energy level at this distance.3.Arc flash incident energy levels shall be shown for each switchgear bus both onthe one line and elevation screens.Changes in ARMS status will cause the energy levels to update based on the arc 4.flash study data.N.The Dashboard shall have following tabs:1.One-line2.ElevationTimeline3.4.DocumentsSettings5.O.Tapping each device shall open a new window on the HMI screen showing the details as follows:1.Protective Relays: maintenance mode status, total trip, last trip, device alarmconditions, metering trends, sequence of events and cause of trip.2.Trip Units: maintenance mode status, total trip, last trip, device alarm conditions,metering trends if supported by the device, sequence of events and cause of trip,waveform and setpoints.3.Meters: basic metering information not limited to currents, voltages, frequency,power factor, power, energy, THD, harmonics, trends, waveforms, alarms and I/Ostatus.4.For meters with web interfaces the meter’s web page should be accessiblethrough the detail screen on the HMI.P.Under the One-line tab the Dashboard shall display the switchgear one line diagram.The one line diagrams shall include the following, but not limited to:1.Source, and bus status indicated by different colors depending on energized/de-energized conditions or arc flash reduction maintenance mode2.Breaker status (open, closed, tripped, ARMS, racked in and racked out), each ofthe status described above shall be differentiated visually by color.Breaker control such as open, close and Arc Flash Reduction Maintenance Mode 3.activation.4.Basic values from relays, trip units and meters shall be shown in widgets on theone line. Detailed information on a particular electronic component shall beavailable by tapping the widget. The information displayed shall be in tabularformat.5.Alarm conditions in red, further information on the type of alarm shall be availableby tapping the device.Arc flash energy levels for each bus shall be displayed on the one line.6.Q.Under the Elevation tab the graphics shall mimic the physical switchgear elevation or front view. The view shall include the following, but not limited to:1.Representation of the switchgear including appropriate number of structures,breaker counts and breaker locations.2.Breaker status (open, closed, tripped, racked in and racked out) shall bedisplayed on the elevation view, relative to physical location of the breaker.Breaker control such as open, close, Arc Flash Reduction Maintenance Mode 3.activation and MV remote breaker rack in-out when the switchgear is soequipped.The structure and breaker locations shall be clearly identified in this mode.4.5.A color coded mimic bus shall be displayed, bus and breaker status shall beindicated by different colors depending on energized/de-energized conditions.7.Alarm conditions in red, further information on the type of alarm shall be availableby tapping the device.R.Under the Timeline tab, time stamped alarm or fault conditions as well as useroperations and login information shall be displayed identifying user names.Under the Settings tab with the appropriate password level, users will be able to:S.1.Update systems settings like colors, date and time and screen defaults 2.Add and modify devices3.Add additional switchgear structures4.Configure alarms5.Update safety information such as PPE requirements.Modify network settings6.7.Configure user accounts and passwordsT.Under the Docs tab, the following documents shall be available:1.O&M Manual for the switchgear2.Project Specific Drawings (Elevation, three-line, BOM, wiring diagrams, etc.) 3.User Manuals for Electronic components such as Protective Relays/ Trip Units,Meters and any other devices as seemed suitable by the end user.4.Breaker Manuals5.Coordination studies* Note to Spec. Writer – Optional* Note to Spec. Writer – Insert data in blanksAdditional product features shall be able to be added through future Apps that canU.downloaded and installed on the Power Xpert Dashboard Processor.*The Dashboard shall have the Setpoints App installed from the factory. This app shallV.provide the ability to read and modify LV breaker trip unit settings and to store and load setpoint files created offline.EXECUTION PART 3FACTORY TESTING3.01The Dashboard system shall be completely assembled, wired and adjusted at theA.factory. After assembly, the complete Dashboard system shall be fully tested to ensure the accuracy of the wiring and the functioning of all equipment andcommunications connections.*Factory test as outlined above shall be witnessed by the owner’s representative.B.The manufacturer shall notify the owner two (2) weeks prior to the date 1.the tests are to be performedFIELD QUALITY CONTROL3.02Provide the services of a qualified factory-trained manufacturer’s representative toA.provide start-up of the equipment specified under this section for a period of *____ working days.The Contractor shall provide three (3) copies of the manufacturer’s field startupB.report.TRAINING3.03The Contractor shall provide a training session for up to five (5) owner’sA.representatives for *____ normal workdays at a job site location determined by the owner.The training session shall be conducted by a manufacturer’s qualified representative.B.The training program shall consist of the instruction on the operation of theDashboard system.。

Pattern Generation and Estimation for Power-Supply Noise Analysis

Pattern Generation and Estimation for Power-Supply Noise Analysis

Pattern Generation and Estimation for Power Supply Noise Analysis Mehrdad Nourani1,Mohammad Tehranipoor2,Nisar Ahmed31Dept.of EE,Univ.of Texas at Dallas,nourani@2Dept.of CSEE,Univ.of Maryland Baltimore County,tehrani@3Texas Instruments,n-ahmed2@A BSTRACTThis paper presents a new automatic pattern generationmethodology to stimulate the maximum power supply noise indeep submicron CMOS circuits.Our ATPG-based approachfirst generates the required patterns to cover01and10transitions on each node of internal circuitry.Then,we ap-ply a greedy heuristic tofind the worst-case(maximum)instan-taneous current and stimulate maximum switching activity in-side the circuit.The quality of these patterns were verified bySPICE simulation.Experimental results show that the patternpair generated by this approach produces a tight lower boundon the maximum power supply noise.I.I NTRODUCTIONA.MotivationPower supply noise(PSN)due to switching current has be-come an important factor for deep submicron designs.Thisnoise effect is becoming more detrimental as VLSI technol-ogy scales.As the number of interconnect layers and gate den-sity increases,the switching activity increases which lead to in-crease current density and voltage drop along the power supplynet.Increasing the frequency and decreasing the rise/fall transi-tion time in today’s designs causes more simultaneous switch-ing activity within a small time interval and increases the in-stantaneous currents.The power supply noise reduces the ac-tual voltage level reaching a device,which increases the signaldelay and results in signal integrity loss and performance degra-dation.It may also cause logic errors,degradation in switchingspeed and hence timing errors.PSN includes the inductive∆I noise(L dIdt )and IR voltagedrop.The former is derived from the distributed RLC modelof on-chip power lines and the latter is caused by the switching inside the circuit as well as input and output buffers.Applyinginput patterns to a CMOS circuit creates the signal switchingand causes the switching currents.To activate the switching ina circuit,a pair of patterns is required to be applied to the inputsof the circuit.Assuming there are n number of inputs,2n2n22n number of pair patterns are required for an exhaustive search tofind the pair of patterns that generate the maximumPSN.Therefore,applying all possible patterns to a circuit tofind such pairs is possible only for the circuits with very smallnumber of inputs.New techniques are needed to estimate powersupply noise efficiently andfind the pattern(s)that generate the maximum PSN in reasonable amount of time.B.Prior WorkSeveral approaches have been proposed for power supply noise analysis and estimation in recent years.Some closed-form equations are derived in[1]to calculate simultaneous switching noise.Estimation of the ground bounce,caused by the switching in internal circuitry for deep-submicron cir-cuits,using a scaling model is discussed in[2].Reference[3] proposes a simulated switching circuit model to estimate PSN which includes IR voltage drop and∆I noise based on an inte-grated package-level and chip-level power bus mode.Modeling of PSN on distributed on-chip power networks is described in[4].A TE and neural network are used tofind the patterns gen-erating maximum instantaneous current[5].The neural net-work is used to learn the behavior of chip power consumption and changes due to different input patterns applied.Several ge-netic algorithms forfinding pattern(s)that stimulate the worst cases are proposed in[6-10].In[7],the standard cells in the technology library are pre-characterized with SPICE to derive the delay and switching current waveform characteristics and a event-driven simulator along with a delay lookup table is used to perform timing analysis of switching events.A combination of Monte Carlo and genetic algorithm is employed to search for the worst case input vector pair(s)that induce the maximum switching noise.The current waveform of the entire design is not a direct su-perposition of the individual block current waveforms when RC power/ground network is considered.The wire/substrate capac-itances provide some of the current drawn and help in reducing the instantaneous current surge.The authors in[6][9]tackle this problem.Current/voltage waveform libraries for each cell in a library are derived using SPICE.A current waveform simulator is used to simulate a small set of patterns derived iteratively us-ing a genetic algorithm.Finding the maximum voltage drop in the power bus of digital VLSI circuits using a genetic algorithm is discussed in[10].In this work,thefitness value for different input vector pairs is the worst-case voltage drop at a specified node in the power bus.C.Contribution and Paper OrganizationIn previous test pattern generation methods,impact of noise on the transient characteristics is not taken into consideration during the initial generation of current/voltage waveform li-braries.Hence,the estimated noise level may not be accu-rate.On average10%overestimate in noise voltage was re-ported compared to SPICE for025µm technology[6].This estimation error may increase as the technology scales down.Vdd pinFig.1.The circuit model and power supply noise measurement.We propose a pattern generation algorithm that targets power supply noise.Our methodology employs common Automatic Test Pattern Generation(A TPG)technique applied to conven-tional stuck-at faults.With the aid of an A TPG our technique quickly and accurately identifies the transient characteristics of gates for a given pattern and its relationship with PSN.The pat-tern generation process is independent of the physical layout information and preprocessing of library cells and guarantees a tight lower bound for maximum PSN.The rest of the paper is organized as follows.Section II de-scribes power noise model that includes the effect of gate fanout on the maximum PSN induced in the circuit.The pattern gener-ation strategy to obtain maximum PSN is explained in Section III.The algorithm and a small example are shown in Section IV.The experimental results are discussed in Section V.Fi-nally,the concluding remarks are in Section VI.II.P OWER S UPPLY N OISE(PSN)M ODELIn general,PSN includes two components:inductive∆I noise and power net IR voltage drop and is given by PSNL dIdt IR.The inductive∆I noise(L dIdt)depends on the rateof change of the instantaneous current,while the IR voltage drop is caused by the instantaneous current through the resis-tive power and ground network.The inductance is mainly due to package lead and wire/substrate parasitics. Simultaneous switching of a large number of gates often in-duces a very large current spike on the power/ground lines in a short time interval.With low-k copper(Cu)interconnects be-ing used in deep-submicron designs,the resistance of the wires is drastically reduced.This will generate considerable induc-tive noise L dIdt even though the inductance L can be relativelysmall.The simulation results in literature,e.g.[8],shows that inductive noise dominates the resistive noise.For the worst case analysis,the idea is to generate the steepest maximum switch-ing current spike.In order to create maximum switching noise, it is important to analyze the characteristics of the switching current waveform.The switching current waveform of each gate is determined by the propagation delay(t d)and its drive capacity(I max).Em-pirical evidence shows that all switching currents last for ap-proximately3t d and the peak drive current may slightlychange Fig.2.Current I t of the entire block in two different cases.for different capacitive load.The propagation delay is directlyrelated to the fanout of the gate.Therefore,a gate with a smaller fanout has less propagation delay and hence a shorter current waveform duration,i.e the rate of change of current dIdtis higher. Hence,it induces greater inductive noise.To illustrate the effect of fanout on power supply noise,we performed a simple experimentation.Consider a block con-sisting of10NAND gates which switch simultaneously in two different cases.In Case1,each gate has a fanout of3minimum-sized inverters while in Case2,each gate has a fanout of2min-imum sized inverters.The circuit model used for power/ground pin and power/ground network is shown in Figure1.Each V dd and V ss pin is modeled as an RLC circuit.The pin parasitics are R p,L p and C p for V dd pin and R s,L s and C s for V ss pin.The power/ground network is essentially modeled as a lumped RLC network.The simulations are performed on the circuit implemented in 013µm technology.Figure2shows the SPICE simulation re-sults for the block current waveforms in the two different cases. The variation of peak current value in the two cases is insignifi-cant.The duration of the switching current waveform in Case1 is greater than in Case2due to large propagation delay which is proportional to fanout.Figure3shows the corresponding rateof current change.The rate of change of switching current dIdtis greater in Case2and hence induces greater inductive noise. Figure4shows the corresponding PSN waveforms.We com-pute the power supply noise from the transient voltage wave-forms on the power/ground lines as:V PSN t V dd pin V ss pin V dd block t V ss block t where V dd pin(V ss pin)is the input supply(ground)voltages to the package lead(1.2V and0V respectively in our case), V dd block t and V ss block t are the transient voltage waveforms on the power and ground network,respectively.It is clear that noise induced in Case2is greater than in Case1even thoughFig.4.PSN induced in two different cases.the peak current occurs in Case1.This confirms that maxi-mum switching current does not necessarily generate maximum switching noise.Based on these analytical and empirical observations,as a main guideline to generate maximum PSN,we give pref-erence to patterns that cause more switching in gates with smaller fanouts.More formally,suppose a circuit G has n gates g1g2g n with fanout values of f1f2f n corre-sponding to those gates.Let g i V1and g i V2be the out-put of gate g i for two input patterns V1and V2,respectively.s V1V2 i g i V1g i V2will be a binary variable indicat-ing if gate g i has a transition in its output when pattern pair (V1V2)is applied.According to our guideline,to maximizef i.andweun-dtand also the peak current drawn.As explained in Section II, the inductive noise dominates the resistive noise.More specif-ically,the rate of current change can be increased by stimulat-ing simultaneous switching in large number of gates with low fanout in a circuit.A.Timing of Switching EventsThe propagation delay of a gate depends on many factors such as fanout load,input rise/fall time and drive strength.Due to difference in propagation delay of the gates,a change in pri-mary input(PI)will trigger a sequence of switching events in the gates that are directly or indirectly connected to it.Since the switching activity inside the circuit determines the switching noise,it is important tofind the time intervals where maximum simultaneous switchings occur.To determine the simultaneous switching activity within a clock cycle T,we break down theclock cycle into N small time frames.Each time frame has a duration of T N and N is chosen based on the required resolution.We simulated an ISCAS’85benchmark circuit (c 432)for a random pattern pair that generated high PSN,using PowerMill tool in Synopsys which is an event driven transistor-level sim-ulator [11].Figure 5shows the number of switchings over a period of time when the pattern pair V 1V 2is applied.Thehorizontal axis plots the time intervals (TN 10ps )from the time the second vector V 2is applied .Maximum simultane-ous switching activity occurs at the beginning of the simulation time frame and small peaks occur later in the simulation pe-riod.Simulation results for all ISCAS’85benchmarks confirm that the maximum simultaneous switching activity occurs in the early period of the simulation cyle.Figure 6shows the corresponding SPICE simulation current waveform for the pattern applied to circuit c432.It shows that the current drawn from the power supply is maximum at the early stage of the clock cycle and decreases later on.The first peak in the current waveform is due to the initial maximum si-multaneous switching activity.Therefore,to generate the steep-est maximum current (maximum noise)we need to increase the number of switchings in the low-fanout gates of the circuit dur-ing the early period of the cycle.B.PreprocessingFor each time frame T ,a subset of active gates in a circuit G will be chosen and the pattern generation works according to the following three guidelines:1)Gate Fanout:Sort gates in increasing order of their fanouts.2)Gate Level:Within each group,formed in the previous step,sort them according to the level that they are posi-tioned in.A level of a gate is the distance of the gate from the primary inputs (PI).When back-traced,a gate close to the PI’s has more number of don’t-cares (X’s)in the input pattern than a gate far away from the PI’s.Hence,choos-ing a node with more number of X’s,i.e.a gate in lower level,leaves us with more choices of assigning transitions on the other nodes and increases the chance of generating maximum switching activity in the time frame.3)Gate Transition:Both types of transitions (01and 10)are tested in each iteration.Depending on the topology of the circuit,the location of the gate and the way that it affects others,one of these transitions may have a better chance in maximizing PSN.In the next subsection,we show how our algorithm uses these guidelines and the conventional model of stuck-at-fault (saf )and A TPG process to justify a transition at each gate and find vector pairs that maximize PSN.IV.A LGORITHMThe pattern generation algorithm is shown in Figure 7.Given a design,in the preprocessing phase the target time frames with the likelihood of having switching activity are obtained.We then use an A TPG algorithm,independent of the simulation method,to find target time frames.01:For each target time frame T 02:03:G gates switch in time frame T04:Sort gates in G in increasing order of their fanouts05:Sort equal-fanout gates in G in increasing order of their levels 06:PSN max 007:V max08:for (i 1G i )09:10:Perform A TPG using TetraMax to get sa 0sa 1patterns for g i G 11:if (both patterns V 1and V 2exists)12:13:Try V 1V 2;if successful run PowerMill to compute PSN 114:Try V 2V 1;if successful run PowerMill to compute PSN 215:16:if (successful and PSN 1and/or PSN 2are computed)17:18:PSN max MAX PSN 1PSN 2PSN max 19:V max Update input vector pair(s)accordingly 20:21:22:23:Return PSN max and vector pair set V max creating it.Fig.7.Deterministic test pattern generation procedure.A.PseudocodeFor each target time frames,the corresponding set of gates (G )that switch in this time frame are extracted (line 03).The gates are sorted (lines 04-05)using the criteria explained in the Section III.In the pattern generation process (lines 08-21),tran-sitions are assigned and justified to gates from the sorted list of gates.To justify a transition at a node,we use an A TPG mechanism (i.e.TetraMax [12]in our case)originally used for stuck-at fault testing.The algorithm obtains patterns to justify a value ’0’at a node,(viewed as a stuck-at-1sa 1fault)and a ’1’at a node,(viewed as a stuck-at-0sa 0fault).When both patterns exist (line 11-15),a 01or 10transition can be generated at the output of a selected gate.The A TPG process generates the pattern pair (V 1V 2)based on zero-delay model.Now we use a power simulator (i.e.Pow-erMill [11]in our case)to accurately measure PSN (lines 13-14).PowerMill is a variable delay event-driven simulator and it takes into account the hazards and glitches caused due to dif-ference in the gate propagation delays during the PSN mea-surement.The result of PSN measurement for this pattern pair is compared to the maximum found so far (PSN max )and the worst case scenario of power supply noise is saved.The vec-tor pair set (V max )are also updated accordingly (line 19).Note that the A TPG based pattern generation is technology indepen-dent and does not require any pre-processing of library cells.On the other hand,the power estimator is used to evaluate the patterns based on the library/technology.Instead of finding one pair of patterns,the procedure can be slightly modified to find and report all pattern pairs that create noise in a given range,e.g.PSN max PSN max ∆.B.ExampleFor purpose of illustration consider Figure 8showing generic test pattern generation process applied to a small example cir-cuit.The stuck-at fault patterns are generated by back-tracing the node towards the primary inputs and are listed in Figurez1z2(a)sa0sa1sa0sa1sa0sa1sa0sa1sa0sa1sa0sa1a b c d ef z2z1igh X X X 0X X X X 10X XX 10X X X0X X 0X X 0X 0X X X X0X X 11XX XX 01X XX 0X X X1X XX 10X X 1X 1PrimaryInput(b)(c)Fig.8.A TPG process for a small example circuit.8(b).In conventional stuck-at fault test generation,the obser-vation points are the primary outputs.In our method,however,as we are interested in only back-tracing,the node itself is con-sidered to be the observation point.Initially,the input vector pair V 1V 2is assumed to be all unknown X values.The gates are sorted in increasing order of fanout as shown in Figure 8(c).An untried node with the lowest fanout is selected from the sorted list and a transition is assigned to it.For example,in the first iteration,node f is selected and a 01transition is assigned to it.The 01transition assignment can be viewed as a sa 1sa 0fault pair at the node.Since f is the first node in the list and a 01transition is selected,therefore V 1and V 2patterns are equal to sa 1and sa 0patterns for node f ,respectively.Note carefully,there is no conflict for the first chosen node.A conflict occurs when there is a mismatch in the compari-son of the respective stuck-at fault patterns with the input vector pair.If the patterns match then the input pattern pair is updated by replacing the corresponding ’X’values with known justified values in the stuck-at fault patterns.For example,after justify-ing a 01transition at node f ,the input vector pair becomesTABLE IC OMPARING EXHAUSTIVE SIMULATION AND OUR METHOD .Circuit #PI’s #Gates Peak NoiseCPU Time [sec][V]SPICE Our Method c17560.421810.5cm424180.58354 2.0cm1386150.612682 3.5TABLE IIE XPERIMENTAL RESULTS FOR VARIOUS ISCAS85BENCHMARK CIRCUITS .Circuit #PI’s #Gates Peak Noise Peak Noise CPU Time (near end)[V](far end)[V][sec]c432361600.760.86179c499412020.410.52170c880603570.810.99246c1355415140.520.64332c1908338800.730.87386c35405016670.620.75444c531517822900.820.99568c62883224160.89 1.06636V 1V 21X 1XX 0XXXX .The updated input pattern after each gate transition justification is shown in the last column of Figure 8(c).The same procedure is repeated for the next node i and a 10transition is justified.The input pattern pair be-comes V 1V 21X 1X 00X 0X 1after a 10transition is justified on gate i .When there is a mismatch,then the assigned transition cannot be justified and thus the opposite transition is tried.For node z1,when a 01transition is tried to be justi-fied,a conflict occurs.In case of a conflict,an opposite transi-tion,i.e.10transition is tried.If both transition assignments fail,the node is skipped and the next node in the list is tried.The process is repeated for all the nodes in the list.After processing the entire list,any leftover X’s in the generated pattern input pair V 1V 2will be changed to create transitions because they might still induce more glitches and cause more power supply noise in the circuit.Based on this guideline,’X’in V 2000X 1will be replaced by ’0’and the final pattern generated for the example shown in Figure 8(a)is V 1V 21011000001.V.E XPERIMENTAL R ESULTSExperiments are performed on ISCAS’85benchmark cir-cuits implemented in 025µm technology.The V dd pin char-acteristic values used in our simulations are R p R s 03Ω,L p L s 8nH and C p C s 4pF .These typical values are chosen from the TSMC 025µm library application notes.The effective resistance and capacitance values in the power/ground network are estimated based on the parasitic values per unit length.The resistance and capacitance per unit length used for the power/ground lines are r 004Ωµm and c 10aF µm ,respectively.The primary input’s rise time is set to 100ps.To show the quality of patterns generated by the proposed technique we performed exhaustive simulation for three small benchmark circuits.Our algorithm generated the pattern pairs that cause maximum power supply noise compared to exhaus-tive pattern simulation results in much shorter CPU time.Forbenchmark circuit c17,it took181sec to perform the exhaustive simulation while it takes less than a second for the same vector pair to be generated by our method.Table I shows the results of exhaustive simulation and compares the run times with our method.In all three cases,our method generates the worst case power supply noise test patterns,identical to those found by SPICE,in very short time.The power supply noise is calculated from the transient volt-age waveforms on the power/ground lines as[7]:V PSN t V dd pin V dd block t V ss block twhere V dd pin is the input supply voltage to the package lead (2.5V olt in our case)V dd block t and V ss block t are the tran-sient voltage waveforms on the power and ground network, respectively.When V noise t is positive,the effective supply voltage is less than the nominal supply voltage V dd pin.Ta-ble II shows the peak noise voltages at near end(node clos-est to the power/ground pins)and far end(node farthest from power/ground pins).As expected(see Section II),the far end noise is more severe due to larger effective resistive parasitics experienced by the blocks close to the far end.The main advan-tage of our method is its short runtime.For example,SPICE takes12minutes to simulate one input vector pair for circuit c432,while it takes179sec to generate and simulate500pat-terns for maximum power supply noise by our method.VI.C ONCLUSIONAn automatic pattern generation mechanism to stimulate the maximum power supply noise has been presented in this paper. The basic strategy is to maximize the switching activities of those gates in thefirst few levels of the circuit that have lower fanouts.Our methodology uses conventional A TPG and power simulators to evaluate a gate-level circuit andfinds patterns that cause maximum switching activity and thus maximum instan-taneous current.We have verified the quality of these patterns using SPICE simulation.In all cases,our methodfinds the same (or comparable)patterns while its running time is2to3order of magnitude faster than that of SPICE.A CKNOWLEDGEMENTSThis work was supported in part by the National Science Foundation CAREER Award#CCR-0130513.R EFERENCES[1]R.Senthinatharr and J.L.Prince,Simultaneous SwitchingNoise of CMOS Devices and Systems,Kluwer Academic Publishers,1994.[2]Y.Chang,S.Gupta and M.Breuer,”Analysis of GroundBounce in Deep Sub-Micron Circuits,”in Proc.VLSI Test Symp.(VTS’97),pp.110-116,1997.[3]H.Chen and D.Ling,”Power Supply Noise AnalysisMethodology for Deep-Submicron VLSI Design,”in Proc.Design Automation Conf.(DAC’97),pp.638-643,1997. [4]L.Zheng,B.Li,and H.Tenhunen,”Efficient and AccurateModeling of Power Supply Noise on Distributed On-Chip Power Networks,”in Proc.Int.Symposium on Circuits and Systems(ISCAS’00),pp.513-516,2000.[5]E.Liau and ndsiedel,”Automatic Worst Case Pat-tern Generation Using Neural Networks&Genetic Algo-rithm for Estimation of Switching Noise on Power Supply Lines in CMOS Circuits,”in Proc.European Test Work-shop(ETW’03),pp.105-110,2003.[6]Y.Jiang,K.Cheng and A.Deng,”Estimation of Maxi-mum Power Supply Noise for Deep Sub-Micron Designs,”in Proc.Int.Symp.on Low Power Electronics and Design (ISLPED’98)),pp.233-238,1998.[7]S.Zhao,K.Roy and C.Koh,”Estimation of Inductive andResistive Switching Noise on Power Supply Network in Deep Sub-micron CMOS Circuits,”in Proc.Int.Conf.on Computer Design(ICCD’00),pp.65-72,2000.[8]S.Zhao and K.Roy,”Estimation of Switching Noise onPower Supply Lines in Deep Sub-micron CMOS Circuits,”in Proc.Thirteenth Int.Conf.on VLSI Design,,pp.168-173,2000.[9]Y.Jiang,K.Cheng and A.Krstic,”Estimation of Maxi-mum Power and Instantaneous Current Using a Genetic Algorithm,”in Proc.Custom Integrated Circuits Conf.(CICC’97),pp.135-138,1997.[10]G.Bai,S.Bobba and I.Haji,”Maximum Power Sup-ply Noise Estimation in VLSI Circuits Using Multimodal Genetic Algorithms,”in Proc.Int.Conf.on Electronics, Circuits and Systems(ICECS’01),vol.3,pp.1437-1440, 2001.[11]Synopsys Inc.,Power Mill Reference Manual,2003.[12]Synopsys Inc.,TetraMAX Reference Manual,2003.。

(StOMP)Sparse Solution of Underdetermined Linear Equations by Stagewise Orthogonal Matching Pursuit

(StOMP)Sparse Solution of Underdetermined Linear Equations by Stagewise Orthogonal Matching Pursuit

Sparse Solution of Underdetermined Linear Equationsby Stagewise Orthogonal Matching PursuitDavid L.Donoho 1,Yaakov Tsaig 2,Iddo Drori 1,Jean-Luc Starck 3March 2006AbstractFinding the sparsest solution to underdetermined systems of linear equations y =Φx is NP-hard in general.We show here that for systems with ‘typical’/‘random’Φ,a good approximation to the sparsest solution is obtained by applying a fixed number of standard operations from linear algebra.Our proposal,Stagewise Orthogonal Matching Pursuit (StOMP),successively transforms the signal into a negligible residual.Starting with initial residual r 0=y ,at the s -th stage it forms the ‘matched filter’ΦT r s −1,identifies all coordinates with amplitudes exceeding a specially-chosen threshold,solves a least-squares problem using the selected coordinates,and subtracts the least-squares fit,producing a new residual.After a fixed number of stages (e.g.10),it stops.In contrast to Orthogonal Matching Pursuit (OMP),many coefficients can enter the model at each stage in StOMP while only one enters per stage in OMP;and StOMP takes a fixed number of stages (e.g.10),while OMP can take many (e.g.n ).StOMP runs much faster than competing proposals for sparse solutions,such as 1minimization and OMP,and so is attractive for solving large-scale problems.We use phase diagrams to compare algorithm performance.The problem of recovering a k -sparse vector x 0from (y,Φ)where Φis random n ×N and y =Φx 0is represented by a point (n/N,k/n )in this diagram;here the interesting range is k <n <N .For n large,StOMP correctly recovers (an approximation to)the sparsest solution of y =Φx over a region of the sparsity/indeterminacy plane comparable to the region where 1minimization is successful.In fact,StOMP outperforms both 1minimization and OMP for extremely underdetermined problems.We rigorously derive a conditioned Gaussian distribution for the matched filtering coefficients at each stage of the procedure and rigorously establish a large-system limit for the performance variables of StOMP.We precisely calculate large-sample phase transitions;these provide asymptot-ically precise limits on the number of samples needed for approximate recovery of a sparse vector by StOMP.We give numerical examples showing that StOMP rapidly and reliably finds sparse solutions in compressed sensing,decoding of error-correcting codes,and overcomplete representation.Keywords:compressed sensing,decoding error-correcting codes,sparse overcomplete representation.phase transition,large-system limit.random matrix theory.Gaussian approximation. 1minimization.stepwise regression.thresholding,false discovery rate,false alarm rate.MIMO channel,mutual access interference,successive interference cancellation.iterative decoding.Acknowledgements This work was supported by grants from NIH,ONR-MURI,a DARPA BAA,and NSF DMS 00-77261,DMS 01-40698(FRG)and DMS 05-05303.1:Department of Statistics,Stanford University,Stanford CA,943052:Institute for Computational Mathematics in Engineering,Stanford University,Stanford CA,943053:DAPNIA/SEDI-SAP,Service d’Astrophysique,Centre Europeen d’Astronomie/Saclay,F-91191Gif-sur-Yvette Cedex France.欠定的可以忽略的渐近的1IntroductionThe possibility of exploiting sparsity in signal processing is attracting growing attention.Over the years, several applications have been found where signals of interest have sparse representations and exploiting this sparsity offers striking benefits;see for example[11,28,26,25,7].At the ICASSP2005conference a special session addressed the theme of exploiting sparsity,and a recent international workshop,SPARS05, was largely devoted to this topic.Very recently,considerable attention has focused on the following Sparse Solutions Problem(SSP). We are given an n×N matrixΦwhich is in some sense‘random’,for example a matrix with iid Gaussian entries.We are also given an n-vector y and we know that y=Φx0where x0is an unknown sparse vector.We wish to recover x0;however,crucially,n<N,the system of equations is underdetermined and so of course,this is not a properly-stated problem in linear algebra.Nevertheless,sparsity of x0is a powerful property that sometimes allows unique solutions.Applications areas for which this model is relevant include:App1:Compressed Sensing.x0represents the coefficients of a signal or image in a known basis which happens to sparsely represent that signal or image.Φencodes a measurement operator,i.e.an operator yielding linear combinations of the underlying object.Here n<N means that we collect fewer data than unknowns.Despite the indeterminacy,sparsity of x0allows for accurate recon-struction of the object from what would naively seem to be‘too few samples’[17,8,48].App2:Error rmation is transmitted in a coded block in which a small fraction of the entries may be corrupted.From the received data,one constructs a system y=Φx0;here x0 represents the values of errors which must be identifed/corrected,y represents(generalized)check sums,andΦrepresents a generalized checksum operator.It is assumed that the number of errors is smaller than a threshold,and so x0is sparse.This sparsity allows to perfectly correct the gross errors[9,48,28].App3:Sparse Overcomplete Representation.x0represents the synthesis coefficients of a signal y,which is assumed to be sparsely represented from terms in an overcomplete expansion;those terms are the columns ofΦ.The sparsity allows to recover a unique representation using only a few terms, despite the fact that representation is in general nonunique[43,11,21,20,50,51].In these applications,several algorithms are available to pursue sparse solutions;in some cases attractive theoretical results are known,guaranteeing that the solutions found are the sparsest possible solutions. For example,consider the algorithm of 1minimization,whichfinds the solution to y=Φx having minimal 1norm.Also called Basis Pursuit(BP)[11],this method enjoys some particularly striking theoretical properties,such as rigorous proofs of exact reconstruction under seemingly quite general circumstances[21,35,32,7,16,8,17,18]Unfortunately,some of the most powerful theoretical results are associated with fairly heavy com-putationally burdens.The research reported here began when,in applying the theory of compressed sensing to NMR spectroscopy,we found that a straightforward application of the 1minimization ideas in[17,58]required several days solution time per(multidimensional)spectrum.This seemed prohibitive computational expense to us,even though computer time is relatively less precious than spectrometer time.In fact,numerous researchers have claimed that general-purpose 1minimization is much too slow for large-scale applications.Some have advocated a heuristic approach,Orthogonal Matching Pursuit (OMP),(also called greedy approximation and stepwise regression in otherfields)[43,52,53,55,54], which though often effective in empirical work,does not offer the strong theoretical guarantees that attach to 1minimization.(For other heuristic approaches,see[50,51,29].)In this paper we describe Stagewise Orthogonal Matching Pursuit(StOMP),a method for approx-imate sparse solution of underdetermined systems with the property either thatΦis‘random’or that the nonzeros in x0are randomly located,or both.StOMP is significantly faster than the earlier methods BP and OMP on large-scale problems with sparse solutions.Moreover,StOMP permits a theoretical analysis showing that StOMP is similarly succcessful to BP atfinding sparse solutions.Our analysis uses the notion of comparison of phase transitions as a performance metric.We con-sider the phase diagram,a2D graphic with coordinates measuring the relative sparsity of x0(numberof nonzeros in x0/number of rows inΦ),as well as the indeterminacy of the system y=Φx(number of rows inΦ/number of columns inΦ).StOMP’s large-n performance exhibits two phases(success/failure) in this diagram,as does the performance of BP.The“success phase”(the region in the phase diagram where StOMP successfullyfinds sparse solutions)is large and comparable in size to the success phase for 1minimization.In a sense StOMP is more effective atfinding sparse solutions to large extremely under-determined problems than either 1minimization or OMP;its phase transition boundary is even higher at extreme sparsity than the other methods.Moreover,StOMP takes a few seconds to solve problems that may require days for 1solution.As a result StOMP is well suited to large-scale applications.Indeed we give several explicitly worked-out examples of realistic size illustrating the performance benefits of this approach.Our analysis suggests the slogannoiseless underdetermined problems behave like noisy well-determined problems,i.e.coping with incompleteness of the measurement data is(for‘randomΦ’)similar to coping with Gaus-sian noise in complete measurements.At each StOMP stage,the usual set of matchedfilter coefficients is a mixture of‘noise’caused by cross-talk(non-orthogonality)and true signal;setting an appropriate threshold,we can subtract identified signal,causing a reduction in cross-talk at the next iteration.This is more than a slogan;we develop a theoretical framework for rigorous asymptotic analysis.Theorems 1-3below allow us to track explicitly the successful capture of signal,and the reduction in cross-talk, stage by stage,rigorously establishing(asymptotic)success below phase transition,together with the failure that occurs above phase transition.The theory agrees with empiricalfinite-n results.Our paper is organized as follows.Section2presents background on the sparse solutions problem; Section3introduces the StOMP algorithm and documents its favorable performance;Section4develops a performance measurement approach based on the phase diagram and phase transition.Section5analyzes the computational complexity of the algorithm.Section6develops an analytic large-system-limit for predicting phase transitions which agree with empirical performance characteristics of StOMP.Section 7develops the Gaussian noise viewpoint which justifies our thresholding rules.Section8describes the performance of StOMP under variations[adding noise,of distribution of nonzero coefficients,of matrix ensemble]and documents the good performance of StOMP under all these variations.Section9presents computational examples in applications App1-App3that document the success of the method in simulated model problems.Section10describes the available software package which reproduces the results in this paper and Section11discusses the relationship of our results to related ideas in multiuser detection theory and to previous work in the sparse solutions problem.2Sparse Solution PreliminariesRecall the Sparse Solutions Problem(SSP)mentioned in the introduction.In the SSP,an unknown vector x0∈R N is of interest;it is assumed sparse,which is to say that the number k of nonzeros is much smaller than N.We have the linear measurements y=Φx0whereΦis a known n by N matrix, and wish to recover x0.Of course,ifΦwere a nonsingular square matrix,with n=N,we could easily recover x from y; but we are interested in the case where n<N.Elementary linear algebra tells us that x0is then not uniquely recoverable from y by linear algebraic means,as the equation y=Φx may have many solutions.However,we are seeking a sparse solution,and for certain matricesΦ,sparsity will prove a powerful constraint.Some of the rapidly accumulating literature documenting this phenomenon includes [21,20,32,55,56,50,51,8,18,16,57,58,48].For now,we consider a specific collection of matrices where sparsity proves valuable.Until we say otherwise,letΦbe a random matrix taken from the Uniform Spherical ensemble(USE);the columns of Φare iid points on the unit sphere S n−1[16,17].Later,several other ensembles will be introduced.3Stagewise Orthogonal Matching PursuitStOMP aims to achieve an approximate solution to y=Φx0whereΦcomes from the USE and x0is sparse.In this section,we describe its basic ingredients.In later sections we document and analyse itsMatched Filter"T r s Projection "I s T "I s ()#1"I s T y Interference Construction "x sFigure 1:Schematic Representation of the StOMP algorithm.performance.3.1The Procedure StOMP operates in S stages,building up a sequence of approximations x 0,x 1,...by removing detected structure from a sequence of residual vectors r 1,r 2,....Figure 1gives a diagrammatic representation.StOMP starts with initial ‘solution’x 0=0and initial residual r 0=y .The stage counter s starts at s =1.The algorithm also maintains a sequence of estimates I 1,...,I s of the locations of the nonzeros in x 0.The s -th stage applies matched filtering to the current residual,getting a vector of residual correlationsc s =ΦT r s −1,which we think of as containing a small number of significant nonzeros in a vector disturbed by Gaussian noise in each entry.The procedure next performs hard thresholding to find the significant nonzeros;the thresholds,are specially chosen based on the assumption of Gaussianity [see below].Thresholding yields a small set J s of “large”coordinates:J s ={j :|c s (j )|>t s σs };here σs is a formal noise level and t s is a threshold parameter.We merge the subset of newly selected coordinates with the previous support estimate,thereby updating the estimate:I s =I s −1∪J s .We then project the vector y on the columns of Φbelonging to the enlarged support.Letting ΦI denote the n ×|I |matrix with columns chosen using index set I ,we have the new approximation x s supported in I s with coefficients given by (x s )I s =(ΦT I s ΦI s )−1ΦT I s y.The updated residual isr s =y −Φx s .We check a stopping condition and,if it is not yet time to stop,we set s :=s +1and go to the next stage of the procedure.If it is time to stop,we set ˆx S =x s as the final output of the procedure.Remarks:1.The procedure resembles Orthogonal Matching Pursuit(known to statisticians as Forward StepwiseRegression).In fact the two would give identical results if S were equal to n and if,by coincidence, the threshold t s were set in such a way that a single new term were obtained in J s at each stage.2.The thresholding strategy used in StOMP(to be described below)aims to have numerous termsenter at each stage,and aims to have afixed number of stages.Hence the results will be different from OMP.3.The formal noise levelσs= r s 2/√n,and typically the threshold parameter takes values in therange2≤t s≤3.4.There are strong connections to:stagewise/stepwise regression in statistical model building;succes-sive interference cancellation multiuser detectors in digital communications and iterative decoders in error-control coding.See the discussion in Section11.Our recommended choice of S(10)and our recommended threshold-setting procedures(see Section 3.4below)have been designed so that when x0is sufficiently sparse,the following two conditions are likely to hold upon termination:•All nonzeros in x0are selected in I S.•I S has no more than n entries.The next lemma motivates this design criterion.Recall thatΦis sampled from the USE and so columns ofΦare in general position.The following is proved in Appendix A.Lemma3.1Let the columns ofΦbe in general position.Let I S denote the support ofˆx S.Suppose that the support I0of x0is a subset of I S.Suppose in addition that#I S≤n.Then we have perfect recovery:ˆx S=x0.(3.1)3.2An ExampleWe give a simple example showing that the procedure works in a special case.We generated a coefficient vector x0with k=32nonzeros,having amplitudes uniformly distributed on[0,1].We sampled a matrixΦat random from the USE with n=256,N=1024,and computed a linear measurement vector y=Φx0.Thus the problem of recovering x0given y is1:4underdetermined (i.e.δ=n/N=.25),with underlying sparsity measureρ=k/n=.125.To this SSP,we applied StOMP coupled with the CFAR threshold selection rule to be discussed below.The results are illustrated in Figure2.Panels(a)-(i)depict each matchedfiltering output,its hard thresholding and the evolving approxi-mation.As can be seen,after3stages a result is obtained which is quite sparse and,as thefinal panel shows,matches well the object x0which truly generated the data.In fact,the error at the end of the third stage measures ˆx3−x0 2/ x0 2=0.022,i.e.a mere3stages were required to achieve an accuracy of2decimal digits.3.3Approximate Gaussianity of Residual MAIAt the heart of our procedure are two thresholding schemes often used in Gaussian noise removal.(N.B. at this point we assume there is no noise in y!)To explain the relevance of Gaussian‘noise’concepts, note that at stage1,the algorithm is computing˜x=ΦT y;this is essentially the usual matchedfilter estimate of x0.If y=Φx0and x0vanishes except in one coordinate,the matchedfilter output˜x equals x0perfectly.Hence z=˜x−x0is a measure of the disturbance to exact reconstruction caused by multiple nonzeros in x0.The same notion arises in digital communications where it is called Multiple-Access Interference(MAI)[60].Perhaps surprisingly-because there is no noise in the problem-the MAI in our setting typically has a Gaussian behavior.MoreFigure2:Progression of the StOMP algorithm.Panels(a),(d),(g):successive matchedfiltering outputs c1,c2,c3;Panels(b),(e),(h):successive thresholding results;Panels(c),(f),(i):successive partial solutions. In this example,k=32,n=256,N=1024.specifically,ifΦis a matrix from the USE and if n and N are both large,then the entries in the MAI vector z have a histogram which is nearly Gaussian with standard deviationσ≈ x0 2/√n.(3.2)The heuristic justification is as follows.The MAI has the formz(j)=˜x(j)−x0(j)=j=φj,φ x0( ).The thing we regard as‘random’in this expression is the matrixΦ.The termξjk ≡ φj,φk measures theprojection of a random point on the sphere S n−1onto another random point.This random variable has approximately a Gaussian distribution N(0,1n).ForΦfrom the USE,for a givenfixedφj,the differentrandom variables(ξjk :k=j)are independently distributed.Hence the quantity z(j)is an iid sum ofapproximately normal r.v.’s,and so,by standard arguments,should be approximately normal with mean 0and varianceσ2j=V ar[j= ξjx0( )]=(j=x0( )2)·V ar(ξj1)≈n−1 x0 22Settingσ2= x0 2/n,this justifies(3.2).Computational experiments validate Gaussian approximation for the MAI.In Figure3,Panels(a),(d),(g) display Gaussian QQ-plots of the MAI in the sparse case with k/n=.125,.1875and.25,in the Uniform Spherical Ensemble with n=256and N=1024.In each case,the QQ-plot appears straight,as the Gaussian model would demand.Through the rest of this paper,the phrase Gaussian approximation means that the MAI has an approximately Gaussian marginal distribution.(The reader interested in formal proofs of Gaussian approximation can consult the literature of multiuser detection e.g.[46,61,12];such a proof is implicitin the proofs of Theorems1and2below.The connection between our work and MUD theory will be amplified in Section11below).Properly speaking,the term‘MAI’applies only at stage1of StOMP.At later stages there is residual MAI,i.e.MAI which has not yet been cancelled.This can be defined asz s(j)=x0(j)−φT j r s/ P Is−1φj 22,j∈I s−1;Figure3:QQ plots comparing MAI with Gaussian distribution.Left column:k/n=.125,middle column:k/n=.1875,right column:k/n=.25.Top row:USE,middle row:RSE,bottom row:URP. The RSE and URP ensembles are discussed in Section8.The plots all appear nearly linear,indicating that the MAI has a nearly Gaussian distribution.the coordinates j∈I s−1are ignored at stage s-the residual in those coordinates is deterministically0.Empirically,residual MAI has also a Gaussian behavior.Figure4shows quantile-quantile plots for the first few stages of the CFAR variant,comparing the residual MAI with a standard normal distribution. The plots are effectively straight lines,illustrating the Gaussian ter,we provide theoretical support for a perturbed Gaussian approximation to residual MAI.3.4Threshold SelectionOur threshold selection proposal is inspired by the Gaussian behavior of residual MAI.We view the vector of correlations c s at stage s as consisting of a small number of‘truly nonzero’entries,combined with a large number of‘Gaussian noise’entries.The problem of separating‘signal’from‘noise’in such problems has generated a large literature including the papers[24,27,26,1,23,37],which influenced our way of thinking.We adopt language from statistical decision theory[39]and thefield of multiple comparisons[38]. Recall that the support I0of x0is being(crudely)estimated in the StOMP algorithm.If a coordinate belonging to I0does not appear in I S,we call this a missed detection.If a coordinate not in I0does appear in I S we call this a false alarm.The coordinates in I S we call discoveries,and the coordinates in I S\I0we call false discoveries.(Note:false alarms are also false discoveries.The terminological distinction is relevant when we normalize to form a rate;thus the false alarm rate is the number of false alarms divided by the number of coordinates not in I0;the false discovery rate is the fraction of false discoveries within I S.)We propose two strategies for setting the threshold.Ultimately,each strategy should land us in a position to apply Lemma3.1:i.e.to arrive at a state where#I S≤n and there are no missed detections. Then,Lemma3.1assures us,we perfectly recover:ˆx S=x.The two strategies are:•False Alarm Control.We attempt to guarantee that the number of total false alarms,across all stages,does not exceed the natural codimension of the problem,defined as n−k.Subject to this, we attempt to make the maximal number of discoveries possible.To do so,we choose a threshold so the False Alarm rate at each stage does not exceed a per-stage budget.•False Discovery Control.We attempt to arrange that the number of False Discoveries cannot exceedFigure4:QQ plots comparing residual MAI with Gaussian distribution.Quantiles of residual MAI at different stages of StOMP are plotted against Gaussian quantiles.Near-linearity indicates approximate Gaussianity.afixed fraction q of all discoveries,and to make the maximum number of discoveries possible subject to that constraint.This leads us to consider Simes’rule[2,1].The False Alarm Control strategy requires knowledge of the number of nonzeros k or some upper bound.False Discovery Control does not require such knowledge,which makes it more convenient for applications,if slightly more complex to implement and substantially more complex to analyse[1].The choice of strategy matters;the basic StOMP algorithm behaves differently depending on the threshold strategy,as we will see below.Implementation details are available by downloading the software we have used to generate the results in this paper;see Section10below.4Performance Analysis by Phase TransitionWhen does StOMP work?To discuss this,we use the notions of phase diagram and phase transition.4.1Problem Suites,Performance MeasuresBy problem suite S(k,n,N)we mean a collection of Sparse Solution Problems defined by two ingredients: (a)an ensemble of random matricesΦof size n by N;(b)an ensemble of k-sparse vectors x0.By standard problem suite S st(k,n,N)we mean the suite withΦsampled from the uniform spherical ensemble,with x0a random variable having k nonzeros sampled iid from a standard N(0,1)distribution.For a given problem suite,a specific algorithm can be run numerous times on instances sampled from the problem suite.Its performance on each realization can then be measured according to some numerical or qualitative criterion.If we are really ambitious,and insist on perfect recovery,we use the performancemeasure1{ˆxS =x0}.More quantitative is the 0-norm, ˆx S−x0 0,the number of sites at which the twovectors disagree.Both these measures are inappropriate for use withfloating point arithmetic,which does not produce exact agreement.We prefer to use instead 0, ,the number of sites at which the reconstruction and the target disagree by more than =10−4.We can also use the quantitative measure relerr2= ˆx S−x0 2/ x0 2,declaring success when the measure is smaller than afixed threshold(say ).For a qualitative performance indicator we simply report the fraction of realizations where the qual-itative condition was true;for a quantitative performance measure,we present the mean value across instances at a given k,n,N.Figure5:Phase Diagram for 1minimization.Shaded attribute is the number of coordinates of recon-struction which differ from optimally sparse solution by more than10−4.The diagram displays a rapid transition from perfect reconstruction to perfect disagreement.Overlaid red curve is theoretical curve ρ1.4.2Phase DiagramA phase diagram depicts performance of an algorithm at a sequence of problem suites S(k,n,N).The average value of some performance measure as displayed as a function ofρ=k/n andδ=n/N.Both of these variablesρ,δ∈[0,1],so the diagram occupies the unit square.To illustrate such a phase diagram,consider a well-studied case where something interesting happens. Let x1solve the optimization problem:(P1)min x 1subject to y=Φx.As mentioned earlier,if y=Φx0where x0has k nonzeros,we mayfind that x1=x0exactly when k is small enough.Figure5displays a grid ofδ−ρvalues,withδranging through50equispaced points in the interval[.05,.95]andρranging through50equispaced points in[.05,.95];here N=800.Each point on the grid shows the mean number of coordinates at which original and reconstruction differ by more than10−4,averaged over100independent realizations of the standard problem suite S st(k,n,N). The experimental setting just described,i.e.theδ−ρgrid setup,the values of N,and the number of realizations,is used to generate phase diagrams later in this paper,although the problem suite being used may change.This diagram displays a phase transition.For smallρ,it seems that high-accuracy reconstruction is obtained,while for largeρreconstruction fails.The transition from success to failure occurs at different ρfor different values ofδ.This empirical observation is explained by a theory that accurately predicts the location of the observed phase transition and shows that,asymptotically for large n,this transition is perfectly sharp. Suppose that problem(y,Φ)is drawn at random from the standard problem suite,and consider the event E k,n,N that x0=x1i.e.that 1minimization exactly recovers x0.The paper[19]defines a functionρ1(δ)(called thereρW)with the following property.Consider sequences of(k n),(N n)obeying k n/n→ρand n/N n→δ.Suppose thatρ<ρ1(δ).Then as n→∞P rob(E kn ,n,N n)→1.On the other hand,suppose thatρ>ρ1(δ).Then as n→∞P rob(E kn ,n,N n)→0.The theoretical curve(δ,ρ1(δ))described there is overlaid on Figure5,showing good agreement betweenasymptotic theory and experimental results.Figure6:Phase diagram for CFAR thresholding.Overlaid red curve is heuristically-derived analytical curveρF AR(see Appendix B).Shaded attribute:number of coordinates wrong by more than10−4 relative error.4.3Phase Diagrams for StOMPWe now use phase diagrams to study the behavior of StOMP.Figure6displays performance of StOMP with CFAR thresholding with per-iteration false alarm rate(n−k)/(S(N−k)).The problem suite and un-derlying problem size,N=800,are the same as in Figure5.The shaded attribute again portrays the number of entries where the reconstruction misses by more than10−4.Once again,for very sparse problems(ρsmall),the algorithm is successful at recovering(a good approximation to)x0,while for less sparse problems(ρlarge),the algorithm fails.Superposed on this display is the graph of a heuristically-derived functionρF AR,which we call the Predicted Phase transition for CFAR thresholding.Again the agreement between the simulation results and the predicted transition is reasonably good.AppendixB explains the calculation of this predicted transition,although it is best read only afterfirst reading Section6.Figure7shows the number of mismatches for the StOMP algorithm based on CFDR thresholding with False Discovery Rate q=1/2.Here N=800and the display shows that,again,for very sparse problems(ρsmall),the algorithm is successful at recovering(a good approximation to)x0,while for less sparse problemsρlarge,the algorithm fails.Superposed on this display is the graph of a heuristically-derived functionρF DR,which we call the Predicted Phase transition for CFDR thresholding.Again the agreement between the simulation results and the predicted transition is reasonably good,though visibly not quite as good as in the CFAR case.5ComputationSince StOMP seems to work reasonably well,it makes sense to study how rapidly it runs.5.1Empirical ResultsTable1shows the running times for StOMP equipped with CFAR and CFDR thresholding,solving an instance of the problem suite S st(k,n,N).We compare thesefigures with the time needed to solve the same problem instance via 1minimization and OMP.Here 1minimization is implemented using Michael Saunders’PDCO solver[49].The simulations used to generate thefigures in the table were all executed on a3GHz Xeon workstation,comparable with current desktop CPUs.Table1suggests that a tremendous saving in computation time is achieved when using the StOMP scheme over traditional 1minimization.The conclusion is that CFAR-and CFDR-based methods have a large。

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LapFinger腔镜手指

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• Microline Surgical, a leading manufacturer of instruments for minimally invasive surgery, today announced the launch of its LapFinger™ finger activated laparoscopic instrument. LapFinger mimics the ultimate dissection tool - the human index finger enabling surgeons to dissect with confidence, retract with strength and palpate with feel. “In surgery, patient safety is critical so my goal as an inventor was to develop new technology that would enable surgeons to dissect along anatomic planes with greater precision to minimize complications such as bleeding” Many conventional instruments used for laparoscopic surgery provide a limited range of motion, increasing the risk for inadvertent damage, compromising the surgeon's ability to perform certain complex maneuvers and prolonging surgical times. Modeled after the anatomical structure of the human finger, Microline's LapFinger is a instrument that provides the safety, ease of use and versatility to overcome these challenges and facilitate advanced general surgical and gynecological procedures.

Razer Leviathan 5.1 Channel Surround Sound Bar 使用说

Razer Leviathan 5.1 Channel Surround Sound Bar 使用说

The Razer Leviathan 5.1 Channel Surround Sound Bar easily fits under any desktop monitor or living room console setup. Versatile enough to be repositioned constantly in any situation, this sound bar features cutting-edge Dolby® technology, superior sound drivers, and a dedicated subwoofer, projecting rich sounds that recreate epic in-gamebattle scenes or just streaming your favorite tunes from your smartphone.TABLE OF CONTENTS1. PACKAGE CONTENTS / HARDWARE REQUIREMENTS (2)2. REGISTRATION / TECHNICAL SUPPORT (3)3. TECHNICAL SPECIFICATIONS (4)4. DEVICE LAYOUT (5)5. USING YOUR RAZER LEVIATHAN (8)6. SAFETY AND MAINTENANCE (16)7. LEGALESE (19)1. PACKAGE CONTENTS / HARDWARE REQUIREMENTS PACKAGE CONTENTS∙Razer Leviathan∙Power adapter with interchangeable plugs∙Subwoofer∙Optical cable∙ 3.5mm analog audio cable∙ 2 pairs of detachable feet∙Quick start guide∙Important product information guideHARDWARE REQUIREMENTSFor Gaming / Movies∙PC or console devices with 3.5mm audio jack or an optical port For Mobile∙Mobile devices with a 3.5mm audio jack or Bluetooth®2. REGISTRATION / TECHNICAL SUPPORTREGISTRATIONSign up now for a Razer Synapse account to get real-time information on your product’s warranty status . To learn more about Razer Synapse and all its features, visit /synapse .If you are already a Razer Synapse user, register your product by clicking on your email address at the Razer Synapse application and select Warranty Status from the dropdown list.To register your product online, visit /registration . Please note that you will not be able to view your warranty status if you register via the website.TECHNICAL SUPPORT What you’ll get:• 1 year limited manufacturer’s warranty .• Free online technical support at .Your product’s serial number can be found here.3. TECHNICAL SPECIFICATIONSSound bar∙Total power output: 30W (15W x 2RMS) ∙Full range drivers: 2 x 2.5” / 63.5mm∙Tweeter drivers: 2 x 0.74” / 19 mm∙Impedance: 8Ω∙Frequency response rate: 180Hz – 20kHz ∙Approximate weight: 4.4lbs / 2Kg Subwoofer∙Type: Passive∙Total power output: 30W RMS∙Full range drivers: 5.25” / 133mm∙Impedance: 4Ω∙Frequency response rate: 20Hz – 180Hz ∙Approximate weight: 5.1lbs / 2.35Kg4. DEVICE LAYOUTA.Top panel (Buttons & LEDs)B.Subwoofer with attached cableC.Optical cableD.3.5mm to 3.5mm cableE.Power adapter with interchangeable plugs**Use the appropriate adapter plug for your regionF.Mounting keyholesG.Input panelH.Detachable feet for sound bar angle adjustmentA. Power buttonTurns the sound bar on/offB. Input indicator LEDIndicates the current input audio source. ∙ OPT: Optical ∙ AUX: Analog∙ : BluetoothC. Equalizer indicatorLEDIndicates the currently selected preset equalizer setting. ∙ : Game∙ : Music∙ : MoviesD. Input selector Toggles between the 3 types of inputE. Bluetooth PairingbuttonActivates BluetoothF. Dolby® processingtoggleActivates Dolby processing for optical audio inputs G. Mute/unmute button Mutes / unmutes the sound bar H. Volume down Decreases the overall audio volume I. Volume upIncreases the overall audio volumeJ. Equalizer presetselector Toggles between the 3 preset equalizer settingsK.Subwoofer output L.Main power input M.Optical inputN.Analog 3.5mm input5. USING YOUR RAZER LEVIATHANSETTING UP AND POSITIONING YOUR SOUND BAR1. Select the appropriate power plug for your region andattach it to the power adapter.2. Position your sound bar and subwoofer.For optimal performance, ensure that the subwoofer is placed on the floor regardless of the positioning of your sound bar.3. Connect your sound bar to the subwoofer and an appropriate power source. Note: Ensure that you press down on the connector catch clip and have it aligned accurately when connecting/disconnecting the subwoofer to/from the Razer Leviathan. Detaching the subwoofer cable incorrectly may void your product warranty.POWERING ON / OFFCONNECTING TO AN AUDIO SOURCENote: When connected to devices with inbuilt speaker systems, audio may continue to be played via the inbuilt speaker. In such cases, manually switch your device’s audio output to the Razer Leviathan.Connecting via the optical cableConnect via Razer Leviathan’s optical port and press the button until the OPT LEDindicator lights up.10 | For gamers by gamers™Connecting via the analog cableConnect via Razer Leviathan’s auxiliary port and press the button until the AUX LED indicator lights up.11 | raze r™Connecting via NFCSimply activate NFC on your device and tap it on the sound bar's NFC connectivity region to pair. The input source will automatically switch to the paired device.Connecting via Bluetooth®If you are using the sound bar’s Bluetooth input for the first time, or if you are attempting to connect a new device to the sound bar via Bluetooth, you will need to activate pairing mode.1. Press and hold the Bluetooth button for 3 seconds or more to enter pairing mode. The Bluetooth LED will start to blink slowly.2. Enable Bluetooth on your device and search for new Bluetooth devices.3. Select “Razer Leviathan” from the list of devices found.4. Wait for pairing to complete. The Bluetooth indicator on your sound bar top panel will change to a solid lighting once successfully connected.12 | For gamers by gamers™Understanding the Bluetooth modesThe sound bar’s Bluetooth module operates in 3 modes- Pairing mode, Connecting mode, and Connectable mode.Pairing Mode ConnectingMode ConnectableModeConnectedModePairing with new devices Connecting tothe last paireddeviceReady to connectto 1 of 4 lastpaired devices.Turn on Bluetoothon your deviceand select RazerLeviathan toconnect.When a deviceis connected tothe sound barvia BluetoothDiscoverable? Any Bluetoothenabled device Only the lastpaired deviceOnly the last 4paired devicesNoHow to activate? Press and holdthe Bluetoothbutton for >3secondsPress theBluetoothbutton onceAutomaticallyactivated whenpairing mode orconnecting modetimes outAutomaticallyactivated whena device issuccessfullypairedTimeout 90s 10s Never NeverAutomatically Changes to? Connectablemode aftertimeoutConnectablemode aftertimeout- Connectingmode whenthe paireddevice isdisconnected(out of range)LED indication Breathes onceper second Breathes twiceper secondRepeatedlybreathes twicefollowed by apauseSolid13 | raze r™CHANGING THE INPUT SOURCEThe Razer Leviathan supports 3 types of audio input - Optical, Analog and Bluetooth. The sound bar starts up in analog input when powered on. You can manually changethe input source by pressingthe button. The LED indicator displays the currentlyselected input source. ADJUSTING THE VOLUMEPresstheor buttons repeatedly or press and hold the buttons toincrease/decrease the volume respectively.Volume UpVolume DownSELECTING AN EQUALIZER PRESET3 equalizer preset settings are programmed into the sound bar, gaming, music andmovies. Press the button to select your desired preset. The LED indicator shows which equalizer preset is currently in use.ADJUSTING THE SUBWOOFER LEVELPress and holdthe button, then presstheor buttons to increase ordecrease the output level of the subwoofer respectively.Increase Subwoofer LevelDecrease Subwoofer Level14 | For gamers by gamers™TURNING THE LED ON/OFFUsing a combination of button presses, you can adjust the LED lighting on your soundbar. Press and hold thebutton, then press to turn the LED off/on.RESETTING THE SOUND BAR TO FACTORY DEFAULTTo reset the sound bar to its factory default settings, press and holdthebutton for more than 10 seconds. The sound bar will turn off. You can then turn the device back on.ADJUSTING THE SOUND BAR ANGLE2 pairs of detachable feet lets you adjust your sound bar angle to ensure that sound is delivered to you with the least amount of obstruction. Depending on the feet / orientation, you can set the sound bar to an angle of 15°, 0° or 18°.15 | raze r™6. SAFETY AND MAINTENANCEIMPORTANT SAFETY & MAINTENANCE INFORMATIONWARNING : Failure to follow these safety instructions could result in fire, electric shock, or other injury or damage.Please follow these safety rules for handling your Razer Leviathan and for working more comfortably. Keep these guide handy for future reference by you and others.To operate your Razer Leviathan safely and reduce the possibility of heat-related injuries, follow these guidelines:1.Set up your Razer Leviathan and power adapter on a stable work surfacethat allows for adequate air circulation under and around thecomputer/TV.2.Do not use or install near water, moisture, or other wet surfaces.3.Do not use or install near any heat or naked flame sources. Do not usearound radiators, stoves, fire places, candles or other hot surfaces.4.Do not block ventilation grills or openings. Install the apparatus in a cool,dry place.5.Clean only with a dry or damp cloth. Unplug the apparatus before cleaningand do not use aerosol or liquid cleaning agents.6.Do not insert or push any objects into openings on the product.7.Refer all servicing to qualified service personnel. Do not attempt to servicethis apparatus yourself. Removing the covers will expose you to dangerouselectric currents.16 | For gamers by gamers™POWER ADAPTER FOR THE RAZER LEVIATHANNOTICE : Incorrect storage or use of your power adapter may void the manufacturer’s warranty.This power adapter complies with the user-accessible surface temperature limits defined by the International Standard for Safety of Information Technology Equipment (IEC 60950-1).This apparatus should only be operated from the type of power source indicated on the label. If you are unsure of the power source in the location you intend to operate the apparatus please consult the local power company or a qualified technician. The use of AC Plug Adapters is cautioned because it can allow the product to be plugged into voltages in which the product was not designed to operate. If you are unsure of the correct operational voltage, please contact your local distributor and/or retailer.e only the power adapter that came with your Razer Leviathan, or theRazer-authorized power adapter that is compatible with this product.2.The power adapter is equipped with exchangeable adapter plug, use onlythe appropriate adapter plug for your region.3.Make sure the exchangeable adapter plug is fully inserted into the poweradapter before plugging the adapter into a power outlet.4.The power adapter may become very warm during normal use. Never placeanything over the power adapter when operating your apparatus.5.Unplug this apparatus during lightning storms or when unused forextended periods of time to further protect the apparatus.6.Protect the power cord from being walked on or pinched, particularly atplugs, convenience receptacles, or the point where they exit fromthe apparatus.7.Do not overload wall electricity outlets, extension cords and plugs. This mayresult in fire or electrical shock.8.Disconnect the power adapter and disconnect any other cables if any of thefollowing conditions exists:•You want to clean the case•The power cord or plug becomes frayed or otherwise damaged.•Your Razer Leviathan or power adapter is exposed to rain, excessive moisture, or liquid spilled into the case.•Your Razer Leviathan or power adapter has been dropped, the case has been damaged, or you suspect that service or repair is required.17 | raze r™SAFETY GUIDELINESIn order to achieve maximum safety while using your Razer Leviathan, we suggest that you adopt the following guidelines:1. Should you have trouble operating the device properly and troubleshooting does not work, unplug the device and contact the Razer hotline or go to for support. Do not attempt to service or fix the device yourself at any time.2. Do not take the device apart (doing so will void your warranty) and do not attempt to service it yourself or operate it under abnormal current loads.3. Keep your device away from liquid, humidity or moisture. Operate your device only within the specified temperature r ange of 0˚C (32˚F) to 40˚C (104˚F). Should you operate it in a temperature that is beyond this range, unplug and switch off the device in order to let the temperature stabilize within the optimal temperature range.4. Listening to excessively loud volumes over extended periods of time can damage your hearing. Furthermore, legislation of certain countries permits a maximum sound level of 86dB to affect your hearing for 8 hours a day. We therefore recommend that you reduce the volume to a comfortable level when listening for prolonged periods of time. Please, take good care of your hearing. MAINTENANCE AND USEThe Razer Leviathan requires minimum maintenance to keep it in optimum condition. Once a month we recommend you unplug the device and clean it using a soft cloth or cotton swab with a bit of warm water to prevent dirt buildup. Do not use soap or harsh cleaning agents.18 | For gamers by gamers™19 | raze r™7. LEGALESECOPYRIGHT AND INTELLECTUAL PROPERTY INFORMATION©2014 Razer Inc . Patent Pending. All Rights Reserved. Razer™, the Razer Triple-Headed Snake logo, the Razer distressed word logo and other trademarks contained herein are trademarks or registered trademarks of Razer Inc. and/or its affiliated or associated companies, registered in the United States and/or other countries.Razer Inc. (“Razer”) may have copyright, trademarks, trade secrets, patents, patent applications, or other intellectual property rights (whether registered or unregistered) concerning the product in this guide. Furnishing of this guide does not give you a license to any such copyright, trademark, patent or other intellectual property right. The Razer Leviathan (the “Product”) may differ from pictures whether on packaging or otherwise. Razer assumes no responsibility for such differences or for any errors that may appear. Information contained herein is subject to change without notice.Manufactured under license from Dolby Laboratories.Dolby, Pro Logic, and the double-D symbol are trademarks of Dolby Laboratories.The N Mark is a trademark or registered trademark of NFC Forum, Inc. in the United States and in other countries.The aptX® mark and the aptX logo are trade marks of CSR plc or one of its groupcompanies and may be registered in one or more jurisdictions.LIMITED PRODUCT WARRANTYFor the latest and current terms of the Limited Product Warranty, please visit /warranty .LIMITATION OF LIABILITYRazer shall in no event be liable for any lost profits, loss of information or data, special, incidental, indirect, punitive or consequential or incidental damages, arising in any way out of distribution of, sale of, resale of, use of, or inability to use the Product. In no event shall Razer’s liability exceed the retail purchase price of the Product.COSTS OF PROCUREMENTFor the avoidance of doubt, in no event will Razer be liable for any costs of procurement unless it has been advised of the possibility of such damages, and in no case shall Razer be liable for any costs of procurement liability exceeding the retail purchase price of the Product.GENERALThese terms shall be governed by and construed under the laws of the jurisdiction in which the Product was purchased. If any term herein is held to be invalid or unenforceable, then such term (in so far as it is invalid or unenforceable) shall be given no effect and deemed to be excluded without invalidating any of the remaining terms. Razer reserves the right to amend any term at any time without notice.20 | For gamers by gamers™。

写一篇度假的英文小作文

写一篇度假的英文小作文

写一篇度假的英文小作文Embarking on a Rejuvenating Vacation: A Journey of Relaxation and ExplorationVacations hold a special place in our lives, offering a much-needed respite from the hustle and bustle of our daily routines. They provide us with the opportunity to step away from the stresses of work, unwind, and immerse ourselves in new experiences. Recently, I had the pleasure of embarking on a vacation that left an indelible mark on my mind and soul.The planning for this trip began months in advance, as I meticulously researched various destinations, weighed the pros and cons, and ultimately settled on a location that promised to cater to my desire for relaxation and adventure. After finalizing the itinerary and making the necessary arrangements, the day of departure finally arrived, and I found myself filled with a palpable sense of excitement.As the plane took off, I gazed out of the window, watching the cityscape below gradually give way to lush, verdant landscapes. Theanticipation grew with each passing minute, and I couldn't wait to immerse myself in the new surroundings. Upon landing, I was greeted by a warm and welcoming local guide who effortlessly navigated the unfamiliar roads, providing insightful commentary about the region's history and culture.The first stop on my itinerary was a luxurious resort nestled amidst towering mountains and serene lakes. As I stepped into my room, I was immediately struck by the breathtaking view that unfolded before me. The floor-to-ceiling windows offered a panoramic vista of the majestic peaks, their snow-capped summits glistening in the sun.I couldn't resist the urge to step out onto the balcony, taking a deep breath of the crisp, clean air and letting the tranquility of the surroundings wash over me.Over the next few days, I indulged in a variety of activities designed to rejuvenate both my mind and body. Each morning, I would wake up early to participate in a gentle yoga session, the sound of the gentle lapping of the lake providing a soothing backdrop. After my practice, I would embark on a leisurely hike, traversing trails that wound through lush forests and offered breathtaking views of the serene landscape.One of the highlights of my vacation was the opportunity to explore the local culture. I visited a nearby village, where I was welcomedwith open arms by the friendly residents. They invited me into their homes, sharing traditional dishes and regaling me with stories of their way of life. I was fascinated by the intricate craftsmanship of the handmade textiles and pottery, and I couldn't resist the urge to purchase a few souvenirs to take back home as a reminder of my experience.As the days passed, I found myself gradually shedding the stresses of everyday life, allowing my mind to drift into a state of tranquility. I spent hours lounging by the resort's infinity pool, gazing out at the majestic mountains and letting my thoughts wander. In the evenings, I would indulge in the resort's exquisite culinary offerings, savoring the flavors of the local cuisine and pairing them with fine wines.But the vacation wasn't solely about relaxation; it also offered opportunities for adventure and exploration. One day, I embarked on a guided kayaking expedition, gliding across the serene waters of the lake, surrounded by towering peaks and lush forests. The experience was both exhilarating and calming, as I navigated the gentle currents and took in the breathtaking scenery.Another highlight of my trip was a visit to a nearby wildlife preserve, where I had the chance to observe a variety of indigenous species in their natural habitat. I was awestruck by the grace and power of the animals, and I found myself captivated by the intricate balance of theecosystem. The experience left me with a renewed appreciation for the beauty and fragility of our natural world.As my vacation drew to a close, I found myself reluctant to leave the tranquil oasis I had discovered. The days spent immersed in the serene surroundings, engaging in rejuvenating activities, and exploring the local culture had left an indelible mark on my soul. I knew that the memories of this vacation would linger long after I had returned home.In the weeks and months that followed, I found myself reflecting on the lessons I had learned during my time away. The importance of taking a step back, disconnecting from the stresses of everyday life, and allowing oneself to truly relax and rejuvenate had become clearer to me. I realized that these types of experiences are not just a luxury, but a necessary component of a balanced and fulfilling life.As I look back on my vacation, I am filled with a profound sense of gratitude. The opportunity to escape the routine, immerse myself in new surroundings, and connect with the natural world had been a true gift. It is my hope that others will have the chance to embark on similar journeys, to discover the restorative power of a well-deserved vacation, and to return home with a renewed sense of purpose and passion for life.。

诺亚电子有限公司产品说明说明书

诺亚电子有限公司产品说明说明书

LAUREL ELECTRONICS, ureate™ Quadrature EncoderPosition & Rate MeterFeatures•Accepts low-level differential or single-ended 5V logic level outputs fromquadrature encoders•Quadrature count x1, x2 or x4•Combined encoder pulse rate to 250 kHz•Programmable display update rate up to 25/s•Zero channel input 6-digit red or green LED display•Universal AC power Input, 85-264 Vac•Isolated 5, 10 or 24 Vdc excitation output•NEMA 4X, 1/8 DIN case•Optional serial I/O: Ethernet, USB, RS232, RS485, Ethernet-to-RS485 converter•Optional relay outputs: dual or quad relays, contact or solid state•Optional isolated analog output: 4-20 mA, 0-20 mA, 0-10V, -10 to +10V•Optional low voltage power: 10-48 Vdc or 12-32 VacDescriptionPosition, Length or Angle MeasurementThe Laureate™ quadrature meter with the Standard countermain board accepts the A & B quadrature signals from linearencoders and shaft encoders to provide a highly accurate, scaleddisplay of position, length, or angle in engineering units, such asft, cm or degrees. The A & B quadrature signals are 90° out ofphase, and their phase relationship determines whether upcounts (+) or down counts (-) are counted. The meter totalizesthe counts and then scales the total in software for display andcontrol. A zero index signal, or Z signal, may be added as a thirdinput to the A & B signals.Scaled Rate MeasurementUse of the Extended counter main board can convert thequadrature meter from scaled position to scaled rate. Forexample, it can display the speed of a moving slab in ft/sec.Simultaneous display of position and rate will require two meters.The display and control output update rate for position or rate isnormally set to a maximum of 25/s, as determined by a user-programmable gate time.Quadrature Meter Capabilities•One, two or four transitions may be counted at a maximumcombined rate of 250 kHz and be mathematically scaled fordisplay in engineering units from -999,999 to +999,999. Thequadrature board has input circuitry which may be jumperedfor either single-ended input signals or for balanced line driversignals. Anti-jitter circuitry eliminates errors produced byvibration of the encoder.• A zero index pulse, if available, is interpreted by the meteras indicating a zero reference for an integral number ofrevolutions of a rotary shaft encoder or the home position of alinear encoder. It is used by the meter for initializing and tocorrect for any cumulative pulse count errors. Special circuitrycorrects for width of the zero index pulse.•In the event of a power failure, the latest total may be storedin non-volatile memory and can be used as the starting pointfor counting when power resumes. Power fail save or zeroindex capabilities are alternate meter setup choices.Designed for system use. Optional plug-in boards includeEthernet and other serial communication boards, dual or quadrelay boards, and an isolated analog output board. Laureatesmay be powered from 85-264 Vac or optionally from 12-32 Vacor 10-48 Vdc. The display is available with red or green LEDs.The 1/8 DIN case meets NEMA 4X (IP65) specifications from thefront when panel mounted. Any setup functions and front panelkeys can be locked out for simplified usage and security. A built-in isolated 5, 10, or 24 Vdc excitation supply can power trans-ducers and eliminate the need for an external power supply.All power and signal connections are via UL / VDE / CSA ratedscrew clamp plugs.SpecificationsDisplayReadout Display Range Zero Adjust Span Adjust Indicators 6 LED digits, 7-segment, 14.2 mm (.56"), red or green LED -999999 to +999999, XXXXEX notation beyond 999999-999999 to +9999990 to 999999Four LED lampsInputsTypeTransitions Monitored Max Pulse RatePosition Error Differential high threshold Differential low threshold Differential common mode Single-ended high voltage Single-ended low voltage Input Resistance, typ. Differential or single-ended quadraturex1, x2 or x4250 kHz at x1, 125 kHz at x2, 62.5 kHz at x4 No error contributed by meter+200 mV-200 mV± 7V2.5V to 10V-1V to +1V17 kOhmQuadrature Position ModeZero Adjust Span Adjust -999999 to +999999 0 to 999999Quadrature Rate ModeConversion Technique Conversion TimeGate timeTime Before Zero Output Output & Display Update Time Base Accuracy Inverse periodGate time + 30 ms + 0-2 signal periods Selectable 10 ms to 199.99 s Selectable 10 ms to 199.99 sSame as conversion timeCalibrated to ±2 ppmPowerVoltage, standard Voltage, optional Power frequency Power consumption (typical, base meter) Power isolation 85-264 Vac or 90-300 Vdc12-32 Vac or 10-48 VdcDC or 47-63 Hz1.2W @ 120 Vac, 1.5W @ 240 Vac, 1.3W @ 10 Vdc, 1.4W @ 20 Vdc, 1.55W @ 30 Vdc, 1.8W @ 40 Vdc,2.15W @ 48 Vdc250V rms working, 2.3 kV rms per 1 min testExcitation Output (standard)5 Vdc10 Vdc24 VdcOutput Isolation 5 Vdc ± 5%, 100 mA 10 Vdc ± 5%, 120 mA 24 Vdc ± 5%, 50 mA 50 Vdc to meter groundAnalog Output (optional)Output Levels Current compliance Voltage compliance Scaling Resolution Isolation 4-20 mA, 0-20 mA, 0-10V, -10 to +10V (single-output option) 4-20 mA, 0-20 mA, 0-10V (dual-output option)2 mA at 10V ( > 5 kΩ load)12V at 20 mA ( < 600Ω load)Zero and full scale adjustable from -99999 to +9999916 bits (0.0015% of full scale)250V rms working, 2.3 kV rms per 1 min test(dual analog outputs share the same ground)Relay Outputs (optional)Relay Types Current Ratings Output common 2 Form C contact relays or 4 Form A contact relays (NO)2 or 4 Form A, AC/DC solid state relays (NO)8A at 250 Vac or 24 Vdc for contact relays120 mA at 140 Vac or 180 Vdc for solid state relays Isolated commons for dual relays or each pair of quad relaysIsolation250V rms working, 2.3 kV rms per 1 min testSerial Data I/O (optional) Board SelectionsProtocols Data RatesDigital Addresses Isolation Ethernet, Ethernet-to-RS485 converter, USB, USB-to-RS485 converter, RS485 (dual RJ11), RS485 Modbus (dual RJ45), RS232. Modbus RTU, Modbus ASCII, Laurel ASCII protocol 300 to 19200 baud247 (Modbus), 31 (Laurel ASCII),250V rms working, 2.3 kV rms per 1 min testEnvironmental Operating Temp. Storage Temp. Relative Humidity Protection0°C to 55°C -40°C to 85°C95% at 40°C, non-condensingNEMA-4X (IP-65) when panel mountedMechanicalApplication ExamplesUsing Quadrature for Cutting to LengthControlling the repetitive cutting of material to length is an excellent application of the Laureate quadrature meter.The quadrature encoder shares the shaft of a sensing wheel, whose rotation corresponds to linealdisplacement of material. The meter compares the displacement reading against setpoint information, and then uses its dual relays to first slow down and then cut the material.Using Quadrature for X-Y PositioningAccurate X-Y position or rate can be obtained from two shaft encoders, which convert linear position toquadrature signals as a shaft turns. In addition to serving as a display, each Laureate can use its optional dual relay setpoint capability for closed loop control. It can also transmit data via RS-232, RS-485, or a 4-20 mA analog signal. Using Quadrature to Monitor a Drilling OperationQuadrature can be used to track position and vertical drilling speed of the bit in an oil drilling operation. A shaft encoder is rotated by a cable that moves with the drilling shaft.In this application, the same encoder signal is applied to a Laureate quadrature meter for position, and to a second quadrature meter for rate. Both meters can be scaled to read out in appropriate engineering units, such as feet and inches per minute, and can be alarmed. A Laureate 6-digit remote display could be added to read out peak rate.Ordering GuideCreate a model number in this format: L50000QD, IPCMain Board L5 Standard Main Board, Green LEDs (for position)L6 Standard Main Board, Red LEDs (for position)L7 Extended Main Board, Green LEDs (for position or rate)L8 Extended Main Board, Red LEDs (for position or rate)Power0 Isolated 85-264 Vac1 Isolated 12-32 Vac or 10-48 VdcRelay Output (isolated) 0 None1 Two 8A Contact Relays2 Two 120 mA Solid State Relays3 Four 8A Contact Relays4 Four 120 mA Solid State RelaysAnalog Output (isolated) 0 None1 Single isolated 4-20 mA, 0-20 mA, 0-10 V, -10 to +10V2 Dual isolated 4-20 mA, 0-20 mA, 0-10VDigital Interface (isolated) 0 None1 RS-2322 RS485 (dual RJ11 connectors)4 RS485 Modbus (dual RJ45 connectors)5 USB6 USB-to-RS485 converter7 Ethernet8 Ethernet-to-RS485 converterInput Type QD Quadrature Signal ConditionerAdd-on Options CBL01RJ11-to-DB9 cable. RJ11 to DB9. Connects RS232 ports of meter and PC.CBL02USB-to-DB9 adapter cable. Combination of CBL02 and CBL01 connects meterRS232 port to PC USB port.CBL03-16-wire data cable, RJ11 to RJ11, 1 ft. Used to daisy chain meters via RS485.CBL03-76-wire data cable, RJ11 to RJ11, 7 ft. Used to daisy chain meters via RS485.CBL05USB cable, A-B. Connects USB ports of meter and PC.CBL06USB to RS485 adapter cable, half duplex, RJ11 to USB. Connects meter RS485 portto PC USB port.CASE1Benchtop laboratory case for one 1/8 DIN meterCASE2Benchtop laboratory case for two 1/8 DIN metersIPC Splash-proof coverBOX1NEMA-4 EnclosureBOX2NEMA-4 enclosure plus IPCBL Blank Lens without button padsNL Meter lens without button pads or Laurel logo。

Victron VE.Smart Networking说明书

Victron VE.Smart Networking说明书

ENGLISHVE.Smart Networkingrev04 - 08/2022Table of Contents1. Introduction (1)2. Voltage, temperature and current sense - further details (2)3. Synchronised charging - further details (3)4. VE.Smart Networking Product Compatibility (4)5. Limitations (5)6. Step by step instructions (6)6.1. Setup the Smart Battery Sense or BMV (6)6.2. Join the Solar Chargers to the network (6)6.3. Verify operation (6)7. FAQ (8)VE.Smart Networking is a wireless communication network between Victron products. It is a wireless technology using Bluetooth Smart.Features:•Remote Voltage reading•Temperature sensing•Current sensing•Synchronised chargingRemote voltage-, temperature and/or current sensingUse VE.Smart to add remote voltage, temperature and/or current sensing to your Victron MPPT Solar Chargers. Connect either a BMV battery monitor, a SmartShunt, or the new Smart Battery Sense, to a Solar Charger. The Solar Charger will receive the available information from the battery , like battery voltage and temperature (depending on the sensor) information, and use that data to optimize its charge parameters. This will improve charging-efficiency and prolong battery life.This video introduces the Smart Battery Sense:https:///embed/v62wCfXaWXYSynchronised chargingPairing two or more SmartSolar chargers in VE.Smart Networking, enables synchronised charging. This improves the charge efficiency and battery life.The battery voltage data is used to compensate for voltage-drop over the battery cables. This ensures that the battery is charged with the exact voltage as configured in the charger - instead of a lower voltage due to resistance in the wiring.The battery temperature data is used to adjust the charge voltages. When cold, a lead/acid battery typically needs a higher charge-voltage …and a lower charge-voltage when it's hot.For lithium batteries the charge-voltages remain the same at all temperatures, as long as it’s not too cold. Its better to not charge Ltihium batteries below 5C, to prevent them from being damaged and degraded.The battery current data is used to allow the tail current setting (see the Solar Charger manual for more details) to be used more precisely as, by having the actual battery current, the Solar Charger can decide better if absorption phase should stop and go to equalisation/float phase.In VictronConnect, the usage of the battery current data is only shown when the Solar Charger is actually charging. When Synchronized charging is enabled, the Solar Charger also needs to be the master. When the Solar Charger is connected to a Venus device that sends the battery current, the value from the Venus device is used, so the battery current will not show up in the VE.Smart networking menu (see also chapter 5: Limitations [5]).Connect multiple SmartSolar charge controllers together in a VE.Smart network to make them charge the battery as if they were one large charger. The chargers will synchronise the charge algorithm between themselves, with no further hardware required. They will simultaneously switch from one charge state to another, for example from bulk to absorption.Each unit will (and should) regulate its own output current. Which, among others, depends on the output of each PV array, cable resistance and the configured maximum output current of the charger. As such, it is not possible to configure a 'network-wide' maximum charge current. In case such feature is needed, for example in a system with both an East- and a West-facing PV array and relatively small battery bank, consider using a GX Device and its DVCC features.Synchronised charging is not always necessaryThere are certain system types in which synchronised charging is not necessary:1.ESS Systems with managed batteries: the inverter/charger is already controlling all solar chargers.2.ESS Systems with unmanaged batteries: the inverter/charger is already controlling all solar chargers.3.Other systems with managed batteries: the battery is already controlling the solar charger.In all above situations, the solar charger is already being controlled. Managed batteries are CAN-bus connected lithium batteries, as well as other chemistries, where the Battery BMS asserts control over the Victron system with regards to charge current &amp; voltage.For chargers that are already connected and synchronised over VE.Can, pairing them in a VE.Smart Network is not necessary. In case they are paired, the pairing will be ignored.How synchronising works on solar chargersSynchronising the chargers works in a master-slave manner. The chargers will elect a master among them and that master will be the one to dictate the charge algorithm. As the master cannot be determined by the user, it is important to make sure all chargers belonging to the same network have the same battery settings. To know more about the battery settings and some other information, check the solar charger manuals.After being elected, the master will make sure all chargers are on the same charge state and with the same voltage setpoint. As mentioned before, battery charge current is not controlled by the master, but by each of the chargers individually.At the beginning of the day, the master will measure the battery voltage before any of the other chargers in the network start charging (to find battery idle voltage). This information is used to decide what should be the total absorption time for some types of batteries. The battery idle voltage is shared with the other chargers, as well as the total absorption time, and the elapsed time on the current charge state. That information is important so the charge algorithm can be resumed by the chargers if, for any reason, the master stops charging (i.e. sun went down on its panels, charger was shut down, charger loses contact with the network, etc).In the absence of battery current sensor, such as the BMV, the chargers on the network will have their output current combinedto estimate a better battery charge current. This improves the precision of the tail current setting, a feature intended to finish the charge cycle earlier if necessary.1.To measure battery temperature, the BMV series temperature sensor is required.2.Early production batches of some models are not VE.Smart Networking capable. Check the table in chapter 5.3.Synchronised charging is available on the SmartSolar on version v1.47 or higher except for the models listed on the tablebelow.4.Synchronised charging on VE.Smart Networking is only available on SmartSolar Chargers. It is not possible to enablesynchronised charging when using a VE.Direct Bluetooth Smart dongle.5.See Smart Battery Sense manual for more information, and specific limitations.6.Only Blue Smart IP22 Chargers starting production date week 24 of 2020 (serial number HQ2024nnnnn and newer) aresupported. The hardware revision printed on the product label should be “hw rev 02” or higher.•The maximum number of devices which can be connected on one network is 10.•VE.Smart Networking is designed for small systems which do not have a GX device - such as a Color Control GX or VenusGX - controlling the chargers (e.g. in an ESS system) - See FAQ Q5. In systems which the GX device is used for logging purposes only, VE.Smart Networking can be used to allow chargers to synchronise, or even receive information from sensors. Keep in mind that if, for some reason, the same information (i.e. voltage sense) is being received by the charger over BLE and VE.Can/VE.Direct, the information coming over BLE (through VE.Smart Networking) will be ignored.•The transmitter range will be found to be the same as the Bluetooth range - as experienced when connecting a device to VictronConnect.•It is not possible to measure multiple battery temperatures/voltages/charge currents: only one Smart Battery Sense, or one BMV can be used in a system. Having multiple sensors connected to different batteries can lead to charging issues as overcharging or heating up the batteries. Always make sure to have your sensors/chargers on the VE.Smart Networking connected to the same battery. If, by accident, two or more sensors (e.g. Smart Battery Sense and/or BMV) are connected to the same VE.Smart Networking, a priority mechanism is used to decide which battery temperature, battery voltage and battery current should be used by the charger. The priority mechanism is first based on the type of sensor (e.g. BMV has higher priority than the Smart Battery Sense), and second based on the serial number of the sensor. At the end, only one information will be used by the charger.SmartSolar MPPTs that do not support VE.Smart NetworkingAll currently shipping SmartSolar MPPTs support VE.Smart Networking. However some older versions of those modelsdo not support VE.Smart Networking. Those devices will also not become compatible later with a firmware update: the incompatibility is due to a hardware limitation in those devices. There is a work around: connect a VE.Direct Bluetooth Smart dongle. This enables VE.Smart Networking support. Both Voltage and Temperature sense will work. In such scenario the internal Bluetooth interface of the SmartSolar should not be used anymore as communication errors may occur - instead the VE.Direct Bluetooth Smart dongle is to be used when connecting by phone or tablet. This is the list of the older incompatible products and part-numbers - together with the part numbers of their compatible successors:We recommend you configure the Smart Battery Sense, or BMV first …and then add one or more solar chargers to that network. You can read the Smart Battery Sense manual here.6.1. Setup the Smart Battery Sense or BMVOpen VictronConnect, connect the device, and then navigate to Settings and select VE.Smart Networking.Click Create Network, enter a name. Click Save and wait for the 'OK' to show up.6.2. Join the Solar Chargers to the networkGo back and navigate to the Solar charger, then click Settings followed by VE.Smart Networking followed by Join Existing. Now select the network which you created at the previous step.Wait for the 'OK' to show.6.3. Verify operationWhen everything is working OK, you will be able to see that the VE.Smart Networking page of the Solar Charger is receiving data:Also the network icon will be shown on the main page:Clicking on that icon will show the network status.The current LED State will also blink every 4 seconds when a VE.Smart Network is configured and the charger is receiving data.Q1: Can several MPPTs be paired to one Smart Battery Sense or BMV?Yes. And, when SmartSolars are connected to the same network, they will also synchronize their charge state.Q2: Is VE.Smart Networking disrupted if I connect a smartphone to it at the same time?Not at all. It is possible to connect with a smartphone, computer or tablet, at the same time.Q3: Will you add the same functionality to the BlueSmart Charger product range?Yes we will - though the exact functionality, and the models to be included has yet to be determined.Q4: Can Smart Battery Sense be used as a standalone product?Yes. In this instance it will simply act as a voltage- and temperature-measuring device. Note that the functionality is limited in that it does not (yet) show the graphs or other data which would normally be generated from these measurements.Q5: Can I use Smart Battery Sense in systems already controlled by a GX device (eg CCGX/VenusGX)?Yes, but keep in mind that if, voltage or temperature information is also present on the GX Device, the charger will use that information in favor of the information coming from the Smart Battery Sense. The GX device already has, in most cases, voltage sensing (soon they will have temperature sensing too), so adding a Smart Battery Sense to the installation is not necessary. For further information please see: CCGX/Distributed Voltage and Current Control.。

学习记忆LTD和LTP解析

学习记忆LTD和LTP解析

Action Potential/current, EPSP/EPSC, IPSP/IPSC
Advantage:
. Single cell recording . Record currents through multiple channels at once . Can do both current clamp and voltage clamp . lower access resistance & easier to clamp . Bigger response . Easy to apply compound intracellularly & modify intracellular component & pathway . Using membrane impermeable drug can distinguish post/pre-synaptic effect
突触可塑性) induced by afferent activity.
Two types of synaptic plasticity :
Long-term potentiation (LTP长时程增强) ; Long-term depression (LTD长时程减弱) ; They are two potential mechanism that
(二) 两种信号系统学说
①第一信号系统(first signal system) 现实具体的信号为第一信号,对第一
信号发生反应的系统称为第一信号系统。 ②第二信号系统(seconed signal system) 相应的语词为第二信号,对第二信号
发生反应的系统功能称为第二信号系统。是 动物和人类区别的重要特征。

Figure legends

Figure legends

Figure legendsFig.1. CCL exposure impaired hippocampus-dependent spatial memory in the MWM task. (A) Locomotor activity rhythm was disrupted by CCL exposure in the open field test compared with CTL rats. (B) CCL rats showed shorter escape latency during training day 1 – 2. (C) CCL rats spent less time in the target quadrant in the retrieval test. (D) CCL exposure did not influence the visible platform learning.(E) CCL exposure did not influence working memory in the MWM. (F) Jumping behaviours/rat (jump back into the pool when they have escaped on the hidden platform during the training day). Data are mean ± SEM. * p < 0.05, ** p < 0.01 CCL vs.CTL rats.Fig.2. CCL exposure reduced stress response. (A) CCL exposure reduced thigmotaxis behavior on training day 1 – 3 in the MWM compared with CTL rats. (B) CCL rats spent more time in the open arms than CTL rats in the elevated-plus maze test. (C) CCL rats made more frequent entries to open arm than CTL rats. Data are mean ±SEM. * p < 0.05, ** p < 0.01 CCL vs. CTL rats.Fig.3. CCL exposure influenced hippocampal LTD. (A) CCL exposure failed to induce LTD measured 50 – 60 min after low frequency stimulation (LFS, bar, 1 Hz) (p > 0.05 vs. baseline),while short-term depression (within 30 min after LFS) was significantly smaller in CCL rats than in control rats (CCL vs. CTL). (B)Additional acute elevated platform stress enabled LFS to induce LTD in CTL but not in CCL rats (p < 0.01, CCL+EP vs. CTL+EP). All sample traces were taken 10 min aftercommencement of baseline recording and 55 min after stimulation protocol. Calibration: 0.5 mV, 10 ms.Fig.4. CCL exposure impaired L-LTP in the hippocampus CA1 region. (A)Input–output curve for the fEPSP amplitude remained unchanged after CCL exposure. The stimulus intensity is controlled by Scope Software in mV to trigger a stimulus isolator to output the corresponding currents in mA. (B)E-LTP is similar between the CTL and CCL rats induced by 3 bursts of theta-burst stimulation (TBS). (C) 12 bursts of TBS evoked L-LTP in CCL slices (CCL, filled circles) that decayed to baseline after 3-h but evoked L-LTP in CTL slices (CTL, open circles) that endured for at least 3-h.Fig.5. The role of D1/D5 receptors in CCL exposure induced impairment of L-LTP.(A)Pairing 12 bursts of TBS with SCH23390 application rescues the impairment ofL-LTP in CCL rats (Sch, filled circles). (B)SCH23390 or SKF38393 application alone respectively has no long-lasting effects on synaptic strength. (C)Pairing 12 bursts of TBS with SKF38393 application further impaired L-LTP in CCL rats (Skf, filled circles). (D)Summary histogram. **p < 0.01, *p < 0.05 vs. CCL.Fig.6. The role of D1/D5 receptors in L-LTP of CTL rats. (A)Pairing 12 bursts of TBS with SCH23390 (1μm) application impaired L-LTP in CTL rats (Sch, filled circles). (B)Pairing 3 bursts of TBS with SKF38393 (25μm) converts E-LTP toL-LTP in CTL rats (Skf, filled circles).Fig.7. CCL increased locomotor activity (means ± SEM) in an open field test. (A)CCL rats traveled a longer distance than CTL rats. **p < 0.01, CCL versus CTL rats. (B) Vertical rears in an open field. **p < 0.01 CCL versus CTL rats.。

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a r X i v :c o n d -m a t /0211315v 1 [c o n d -m a t .m e s -h a l l ] 15 N o v 2002Pairing and persistent currents -the role of the far levelsM.Schechter The Racah Institute of Physics,The Hebrew University,Jerusalem 91904,Israel Y.Imry,Y.Levinson and Y.Oreg Department of Condensed Matter Physics,The Weizmann Institute of Science,Rehovot 76100,Israel Abstract We calculate the orbital magnetic response to Aharonov Bohm flux of disordered metallic rings with attractive pairing interaction.We consider the reduced BCS model,and obtain the result as an expansion of its exact solution to first order in the interaction.We emphasize the connection between the large magnetic response and the finite occupation of high energy levels in the many-body ground state of the ring.I.INTRODUCTION One of the remarkable phenomena of mesoscopic physics is the existence of equilibrium persistent currents in small normal metal rings,in the regime where the elastic mean free path l is much smaller than the ring’s circumference L .This was both predicted theo-retically [1]and observed experimentally.[2,3,4,5,6,7]For the ensemble-averaged persistent current,the experimental results [2,5,6,7]are much larger than the value obtained using the model of noninteracting electrons,[8,9]and show predominantly diamagnetic response at zero flux.In an attempt to resolve this discrepancy,the contribution of electron-electron(“e-e”)interactions was calculated[10]and it was later suggested that the diamagnetic re-sponse is due to effective attractive e-e interactions.[11]Though indeed the inclusion of e-e interactions increased the theoretical value,it was still smaller by a factor of about5than the experimental results,for both repulsive and attractive interactions.[11] In a recent work[13]we suggested that the contribution of high energy levels(denoted “far levels”),further than the Thouless energy E Th from the Fermi energy E F,results in an enhanced orbital magnetic response(the derivative of the persistent current at zeroflux). This was shown for the model of attractive pairing interactions described by the reduced BCS Hamiltonian,by doing perturbation theory in both the magneticfield and the e-e interaction.In this paper we repeat the calculation for the same model,doing perturbation theory in the magneticfield only,using the exact many-body states of the system with e-e interactions.In this way we can treat on the same footing different regimes of the strength of the interaction.We consider briefly the limits of zero interaction and the opposite limit where the interaction is strong enough and the system is superconducting.We then treat in more detail the case of weak e-e interaction,using Richardson’s exact solution for the reduced BCS Hamiltonian.[14,15]In this way we obtain[see Eq.(18)]the result of Ref.[II]as a leading order expansion of an exact solution,instead offirst order perturbation theory in the interaction.Furthermore,the present derivation has the merit of emphasizing the connection between the enhanced magnetic response and the pairing correlations of all the levels up to the high energy cutoffat the Debye frequencyωD.These correlations exist in the exact many-body ground state(g.s.)of the ring[see Eqs.(14),(15)and discussion after Eq.(16)]. The contribution of the pairing correlations of the far levels wasfirst realized in connection to superconductivity in small grains.[16]There it was shown that this contribution results in a much larger condensation energy than that given by the BCS theory in a large regime in which superconducting correlations are well developed,as well as in a correction to the spin magnetization and susceptibility as function of magneticfield H that persists up to H=ωD/µB.II.MAGNETIC RESPONSEWe consider a quasi one dimensional disordered ring with a finite number of electrons N e ,penetrated by a constant Aharonov Bohm (AB)flux in its middle.We take the case of zero temperature,and the average spacing between noninteracting energy levels is d .The Hamiltonian is given byH = α dr ψ†α(r ) 1c A )2+U (r ) ψα(r )+H ee (1)where U (r )is the external potential which includes the disorder,and H ee represents the e-e interactions.The vector potential corresponding to the AB flux Φin the middle of the ringis given in the London gauge by A=Φ/(2πρ)ˆφ,where ρis the distance from the origin and the angle ˆφis in the clockwise direction of the ring.The ground state energy of the system is flux dependent,and can be written for small flux asE (Φ)=E 0−12m +U (r ) ψα(r )+H ee (3)and the magnetic field represented by the vector potential as perturbationH I = α dr ψ†α(r ) −e2mc 2A 2 ψα(r ).(4)We assume that the width of the ring is much smaller than its circumference L .[18]Then the A 2term gives the “diamagnetic”contribution,1mcL 2ˆN ,(5)which is independent of the e-e interactions and results inE dia2=− eΦP ij c†iαc jα.(7)mcLHere c i destroys an electron in the state|i with wavefunctionχi(r)and P ij= i|P |j is the matrix element of the momentum parallel to the ring’s direction.We choose theχi’s to be real,and then P ij is pure imaginary and P ii=ing second order perturbation theory in H1I we write the paramagnetic part of E2asE par2=−2 e E g.s.−E I(8) where E I are the energies of the intermediate states|I .We model the e-e interactions by the reduced BCS interactionH ee=−λd ij′c†i↑c†i↓c j↓c j↑,(9) whereλis the dimensionless pairing parameter and the sum is over all levels with energies between E F−ωD and E F+ωD.This interaction Hamiltonian is the usual one used when discussing superconducting grains,both in the perturbative and nonperturbative regimes [19]and its validity is discussed in,e.g.Refs.[II,II,II].(In particular,for the model to be valid the grain’s dimensionless conductance g must be much larger than one.)In this model the ground state has no singly occupied noninteracting states[14,15](we assume,for simplicity,that the number of electrons in the ring is even).Therefore,|I has two singly occupied states,with opposite spins.We denote by I mn the set of many-body states where state m(n)in occupied with one electron with spin up(down).Eq.(8)can then be written asE par2=−2 e E g.s.−E I.(10)We now analyze this equation for the cases ofλ=0(normal metal),λ>1/ln N (superconductor,see Ref.[II]),and0<λ≪1/ln N(weak attractive interactions).Here N≡ωD/d.Forλ=0the ground state is the noninteracting Fermi state,and the only relevant intermediate states are those with one electron-hole pair(the lowest energy states within each subspace I mn).A straightforward calculation results inE par(n)= 2eωmn(11)2where m>0denotes states with energies larger than E F andωmn=ǫm−ǫn,the differ-ence between the energies of the single particle states m and n.For a diffusive ring this paramagnetic term is of the same order as the diamagnetic term in Eq.(6).The difference between these terms is of the order of the contribution of the last level(and can therefore have either sign)and constitutes the noninteracting sample specific result for the magnetic response.[17]The opposite limit is the superconducting regime.In this regime one can use the BCS approximation for the ground and excited states of the system,and the Bogoliubov trans-formation for the creation and annihilation operators.Eq.(10)is then reduced to=2 e E m+E n.(12)E par(BCS)2Here u m,v m are the coherence factors,and E m is the energy of the electron-hole quasiparticle of state m.In the ballistic case,P mn=P mδmn and therefore the paramagnetic term is zero. This results in the well known perfect diamagnetism of a superconductor.For the diffusive case the ensemble-averaged momentum matrix elements are given by[13]|P mn|2 =p2Fτdapproximate magnitude of(l/ξ)E dia2,whereξis the(ballistic)superconducting coherence length.We now turn to the calculation of E par2for the case of weak attractive interaction(λ< 1/ln N).We calculate the interaction correction to E2tofirst order inλ.Using Richardson’s exact solution[15]onefinds that tofirst order inλthe ground state can be written asΨg.s.= {f1...f N}φ(f1...f N)b†f N...b†f1|vac (14) withφ(1...N)=1λdφ(1...N;=j,k)=(16)2ωmnand E g.s.−E I=ωmn+λd.Thus,the pairing interaction contributes to the magnetic response in two ways.First,due to thefinite occupancy of levels above E F the matrix element in Eq.(16)has a contribution not only from the annihilation of an electron in state n below E F and the creation of an electron in state m above E F.Since in the ground state there is afinite amplitude for state m to be doubly occupied and state n to be empty,there is afinite contribution to the matrix element from annihilating and electron in state m above E F and creating it in state n below E F[second term in Eq.(16)].Second,it adds a termλd to the energy of the excited states due to the excess pairing energy of a doubly occupied state. The latter term is a Hartree-like contribution,coming from the diagonal part of the pairing interaction,while the former is due to pairing correlations of pairs in different single-particle states[offdiagonal part of the Hamiltonian in Eq.(9)].Both of these contributions suppress the paramagnetic term in the case of attractive interaction,and as a result,tofirst order in λ,E par(fo) 2=E par(n)2−λd 2eω2mn.(17)Using Eq.(13)wefind that the derivative of the persistent current at zeroflux,tofirst orderin the interaction,is given byE fo2 =8πλE Th d.(18) In comparison with the known result for thefirst order interaction correction to the mag-netic response[10],our result has a much larger logarithmic cutoff,ωD compared with E Th.This enhancement is irrespective of the higher order correction,which for attractive inter-action further increases thefirst order result.[11]The large logarithm we obtain is a resultof enhanced pairing correlations of all the states within1/τfrom E F.We expect that semi-classically this term necessitates only one circulation of the ring,and will therefore affectthe magnitude of the persistent current as well(see discussion in Ref.[II]).This may leadto a resolution of the discrepancy between the experimental results and theory of persistentcurrents in diffusive normal rings.ACKNOWLEDGMENTSWe benefited from valuable discussions with N.Argaman,A.Punnoose,B.Altshuler,H.Bouchiat,J.von Delft,A.Finkel’stein,Y.Gefen,D.Gobert,M.Khodas,ad,Z.Ovadyahu,U.Smilansky,and R.A.Webb.M.S.is thankful for the support by the Lady Davis fund.This work was supported by a Center of Excellence of the Israel Science Foundation,Jerusalem and by the German Federal Ministry of Education and Research (BMBF)within the Framework of the German-Israeli Project Cooperation(DIP)and by the German-Israeli Foundation(GIF).REFERENCES[1]M.Buttiker,Y.Imry,and ndauer,Phys.Lett.A96,365(1983).[2]L.P.Levy,G.Dolan,J.Dunsmuir,and H.Bouchiat,Phys.Rev.Lett.64,2074(1990).[3]V.Chandrasekhar,R.A.Webb,M.J.Brady,M.B.Ketchen,W.J.Gallagher,and A.Kleinsasser,Phys.Rev.Lett.67,3578(1991).[4]D.Mailly,C.Chapelier,and A.Benoit,Phys.Rev.Lett.70,2020(1993).[5]B.Reulet,M.Ramin,H.Bouchiat,and D.Mailly,Phys.Rev.Lett.75,124(1995).[6]E.M.Q.Jariwala,P.Mohanty,M.B.Ketchen,and R.A.Webb,Phys.Rev.Lett.86,1594(2001).[7]R.Deblock,R.Bel,B.Reulet,H.Bouchiat,and D.Mailly,cond-mat/0109527.[8]F.von Oppen and E.K.Riedel,Phys.Rev.Lett.66,84(1991).[9]B.L.Altshuler,Y.Gefen,and Y.Imry,Phys.Rev.Lett.66,88(1991).[10]V.Ambegaokar and U.Eckern,Phys.Rev.Lett.65,381(1990),ibid.67,3192(1991).[11]V.Ambegaokar and U.Eckern,Europhys.Lett.13,733(1990).[12]A.Schmid,Phys.Rev.Lett.66,80(1991).[13]M.Schechter,Y.Oreg,Y.Imry,and Y.Levinson,submitted to PRL(cond-mat/0205390).[14]R.W.Richardson,Phys.Lett.3,277(1963).[15]R.W.Richardson and N.Sherman,Nucl.Phys.52,221(1964).[16]M.Schechter,Y.Imry,Y.Levinson,and J.von Delft,Phys.Rev.B63,214518(2001).[17]Y.Imry,Introduction to mesoscopic physics,2nd ed.(Oxford,2002).[18]Under this assumption of thin ring the response to constant magneticfield can be foundalong the same lines as done here for ABflux.[19]J.von Delft and D.C.Ralph,Phys.Rep.345,61(2001).[20]I.L.Aleiner and B.L.Altshuler,Phys.Rev.Lett.79,4242(1997).[21]O.Agam,in Supersymmetry and Trace Formulae:Chaos and Disorder,edited by I.V.Lerner,J.P.Keating,and D.E.Khmelnitskii(Plenum Press,New York,1999),pp.133-151.。

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