MBRF30H150C-D

MBRF30H150CTG,MBR30H150CTG SWITCHMODE ™Power Rectifier 150 V , 30 A
Features and Benefits
•ăLow Forward V oltage
•ăLow Power Loss/High Efficiency •ăHigh Surge Capability
•ă30 A Total (15 A Per Diode Leg)•ăGuard-Ring for Stress Protection •ăThese are Pb-Free Devices
Applications
•ăPower Supply - Output Rectification •ăPower Management •ăInstrumentation
Mechanical Characteristics:
•ăCase: Epoxy, Molded
•ăEpoxy Meets UL 94 V-0 @ 0.125 in
•ăWeight (Approximately): 1.9 Grams (TO-220 & TO-220FP)•ăFinish: All External Surfaces Corrosion Resistant and Terminal
Leads are Readily Solderable
•ăLead Temperature for Soldering Purposes:260°C Max. for 10 Seconds
MAXIMUM RATINGS
Please See the Table on the Following Page
TO-220AB CASE 221A STYLE 6
SCHOTTKY BARRIER
RECTIFIER
30 AMPERES, 150 VOLTS
1
3
2, 4
MARKING DIAGRAMS
A = Assembly Location Y = Year
WW
= Work Week B30H150= Device Code G = Pb-Free Device
AKA
= Polarity Designator
]
CASE 221D STYLE 3
3
See detailed ordering and shipping information in the package dimensions section on page 2 of this data sheet.
ORDERING INFORMATION
MAXIMUM RATINGS (Per Diode Leg)
Rating Symbol Value Unit
Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage V RRM
V RWM
V R
150V
Average Rectified Forward Current(Per Leg) (Rated V R) T C = 124°C(Per Device)I F(AV)15
30
A
Nonrepetitive Peak Surge Current
(Surge applied at rated load conditions halfwave, single phase, 60 Hz)
I FSM200A Operating Junction Temperature (Note 1)T J-20 to +150°C Storage Temperature T stg-65 to +150°C Voltage Rate of Change (Rated V R)dv/dt10,000V/m s
ESD Ratings:Machine Model = C
Human Body Model = 3B
> 400
> 8000
V
THERMAL CHARACTERISTICS
Rating Symbol Value Unit Maximum Thermal Resistance
(MBR30H150CTG)- Junction-to-Case
- Junction-to-Ambient (MBRF30H150CTG)- Junction-to-Case R q JC
R q JA
R q JC
2.0
45
2.5
°C/W
ELECTRICAL CHARACTERISTICS (Per Diode Leg)
Rating Symbol Typ Max Unit
Maximum Instantaneous Forward Voltage (Note 2)
(I F = 5 A, T C = 25°C)
(I F = 5 A, T C = 125°C)
(I F = 15 A, T C = 25°C)
(I F = 15 A, T C = 125°C)v F
0.69
0.55
0.98
0.68
0.60
0.73
V
Maximum Instantaneous Reverse Current (Note 2)
(Rated DC Voltage, T C = 25°C)
(Rated DC Voltage, T C = 125°C)i R
60
50
m A
mA
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.
1.The heat generated must be less than the thermal conductivity from Junction-to-Ambient: dP D/dT J < 1/R q JA.
2.Pulse Test: Pulse Width = 300 m s, Duty Cycle ≤2.0%.
DEVICE ORDERING INFORMATION
Device Order Number Package Type Shipping†
MBRF30H150CTG TO-220FP
(Pb-Free)
50 Units / Rail
MBR30H150CTG TO-220
(Pb-Free)
50 Units / Rail
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
I F , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )
Figure 1. Typical Forward Voltage V F , INSTANTANEOUS FORWARD VOLTAGE (V)
0.1
10
100
I F , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )
Figure 2. Maximum Forward Voltage
V F , INSTANTANEOUS FORWARD VOLTAGE (V)
0.1
1
10
100
I R , R E V E R S E C U R R E N T (A )Figure 3. Typical Reverse Current V R , REVERSE VOLTAGE (V)
0102030405060708090100110120130140150
R Figure 4. Maximum Reverse Current
V R , REVERSE VOLTAGE (V)
0102030405060708090100110120130140150I F , A V E R A G E F O R W A R D C U R R E N T (A M P S )
Figure 5. Current Derating T C , CASE TEMPERATURE (°C)
P F O , A V E R A G E P O W E R D I S S I P A T I O N (W A T T S )
I O , AVERAGE FORWARD CURRENT (AMPS)
Figure 6. Forward Power Dissipation
C , C A P A C I T A N C E (p F )
V R , REVERSE VOLTAGE (V)
Figure 7. Capacitance
10100
1000
10000
50
100
150
R (t ), T R A N S I E N T T H E R M A L R E S I S T A N C E
Figure 8. Thermal Response Junction-to-Ambient for MBR30H150CTG
1000
0.1
0.00001
t 1, TIME (sec)
1
0.0001
0.001
0.011
10
100
0.000001
0.1
10
100
R (t ), T R A N S I E N T T H E R M A L R E S I S T A N C E
Figure 9. Thermal Response Junction-to-Case for MBR30H150CTG
t 1, TIME (sec)
0.01
R (t ), T R A N S I E N T T H E R M A L R E S I S T A N C E
Figure 10. Thermal Response Junction-to-Case for MBRF30H150CTG
1000
0.1
0.00001
t 1, TIME (sec)
0.1
0.0001
0.001
0.011
10
100
0.000001
0.01
1
10
0.001
PACKAGE DIMENSIONS
TO-220 FULLPAK CASE 221D-03
ISSUE J
DIM A MIN MAX MIN MAX MILLIMETERS
0.6170.63515.6716.12INCHES B 0.3920.4199.9610.63C 0.1770.193 4.50 4.90D 0.0240.0390.60 1.00F 0.1160.129 2.95 3.28G 0.100 BSC 2.54 BSC H 0.1180.135 3.00 3.43J 0.0180.0250.450.63K 0.5030.54112.7813.73L 0.0480.058 1.23 1.47N 0.200 BSC 5.08 BSC Q 0.1220.138 3.10 3.50R 0.0990.117 2.51 2.96S 0.0920.113 2.34 2.87U
0.2390.271
6.06 6.88
M
B
M
0.25 (0.010)Y
SEATING PLANE
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: INCH
3.221D-01 THRU 221D-02 OBSOLETE, NEW STANDARD 221D-03.
STYLE 3:
PIN 1.ANODE
2.CATHODE
3.ANODE
TO-220CASE 221A-09ISSUE AE
NOTES:
1.DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 198
2.
2.CONTROLLING DIMENSION: INCH.
3.DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE ALLOWED.
STYLE 6:
PIN 1.
ANODE 2.CATHODE 3.ANODE 4.
CATHODE
DIM MIN MAX MIN MAX MILLIMETERS INCHES A 0.5700.62014.4815.75B 0.3800.4059.6610.28C 0.1600.190 4.07 4.82D 0.0250.0350.640.88F 0.1420.161 3.61 4.09G 0.0950.105 2.42 2.66H 0.1100.155 2.80 3.93J 0.0140.0250.360.64K 0.5000.56212.7014.27L 0.0450.060 1.15 1.52N 0.1900.210 4.83 5.33Q 0.1000.120 2.54 3.04R 0.0800.110 2.04 2.79S 0.0450.055 1.15 1.39T 0.2350.255 5.97 6.47U 0.0000.0500.00 1.27V 0.045--- 1.15---Z
---0.080--- 2.04
F
SEATING PLANE
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