ASML 光机介绍

SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
• Advanced reticle management system (ARMS)
Purpose
The purpose of the ARMS, is to provide a means of automatically retrieving and placing the desired reticle accurately on the reticle table. To accomplish this the system must:
The system forms part of a lithographic process, and is suitable for batch production of large and very large scale integrated circuits.
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SMSECIUCRITY 3 SMIC- INTERNAL
SMIC
ASML Scanner
General Introduction
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SMSECIUCRITY 3 SMIC- INTERNAL
Course Overview
• System Overview • Basic Operation • Recovery
5. Place and remove the reticle on the reticle table,
6. Import the relative machine constants and layout data (if available)
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SMSECIUCRITY 3 SMIC- INTERNAL
SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
• LEVEL SENSOR
• Purpose
The PAS 5500 projects reticle images on to wafers at an extremely high resolution. High resolution can only be achieved when the wafer is accurately positioned in the optimum focal plane. The Usable Depth Of Focus (UDOF), that is the range in which images can be sharply reproduced, is only a few micrometres. When using extremely fine resolution, it can be as low as one micrometre.
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SMIC
9/15/2019
SMSECIUCRITY 3 SMIC- INTERNAL
System Overview
SMIC
• PAS 5500 WAFER SCANNER OVERVIEW
• Purpose
The PAS 5500 is a fully automatic step-and-repeat camera for exposing wafers used for manufacturing of integrated circuits.
Its second main task is to prealign a wafer that has come from the wafer transport system, so that it can be accepted by the wafer stage. This is accomplished by the Wafer Prealignment System (WPS).
SMSECIUCRITY 3 SMIC- INTERNAL
System Overview
SMIC
The PAS 5500 wafer scanner comprises the following main units: • Exposure unit, • Wafer transport system, • Operator console, • Electronics cabinet, • Contamination and Temperature (C&T) cabinet.
1. Control the Standard Mechanical InterFace (SMIF) port,
2. Identify the reticles,
3. Load and unload reticles to/from the library,
4. Prealign the reticle on the reticle table,
Separating machine into two parts: Silent World and External World
• Purpose: Vibration Isolation Position Control Diagnostic Tool
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SMIC
9/15/2019
• WH (Wafer Handling)
• LS (Level Sensor)
• SWS (Scanning Wafer Stage)
• SRS (Scanning Reticle Stage)
• AL (Alignment)
• IS (Image Sensor)
• IP&IL (Illumination and Projection)
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
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• OA (Off-Axis illumination, ATHENA)
• CT (Contamination and Temperature control)
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
• Airmount
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SMSECIUCRITY 3 SMIC- INTERNAL
System Overview
SMIC
SAFETY
OVERVIEW OF POTENTIAL HAZARDS The main hazards related to the PAS 5500/500, /550, /700 are: • Laser radiation, including high intensity deep ultra violet (DUV) laser radiation of 248 nm • Laser gases, including very-toxic fluorine • Mechanical movements. • Other hazards are: • Magnetic fields • Remote control of the unit using the Remote Monitoring and Control System (RMCS)
The function of the alignment system is to align the wafer to the reticle on the reticle table.
The specification is critical because a wafer can be exposed up to 30 times, so good overlay accuracy is required.
Sub-Modules
SMIC
• WAFER HANDLING
• Purpose
The WH system has two primary functions.
Its first main task is to transport wafers between a carrier (or a pedestal) and the prealignment system, this task is performed by the Wafer Transport System (WTS).
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9/15/2019
SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
• ALIGNMENT
• Purpose
• The main units of the PAS 5500 can be further divided into the following subsystems:
• AM (Air Mount)
• ARMS (Advanced Reticle Management System)
• IRIS (Integrated Reticle Inspection System)
SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
• ILLUMINATION AND PROJECTION
• Purpose
The purpose of the illumination system is to expose the reticle image through the projection lens on to the wafer. The illumination system creates a light beam of high intensity and even uniformity, at reticle level, which has the proper spectral composition.
• The purpose of the level sensor subsystem is to:
1. Determine the distance between the wafer surface and the bottom surface of the projection lens,
2. Control the wafer stage level actuators to bring the wafer surface into the desired optimum image plane.
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9/15/2019
SMSECIUCRITY 3 SMIC- INTERNAL
System Overview
SMIC
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SMIC
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SMSECIUCRITY 3 SMIC- INTERNAL
System Overview
SYMBOLS
SMIC
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SMSECIUCRITY 3 SMIC- INTERNAL
System Overview
SMIC
SYSTEM BUILDUP
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
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SMSECIUCRITY 3 SMIC- INTERNAL
Sub-Modules
SMIC
Eng-3 / Photo
9/15/2019