Leadframe（引线框架）制造流程

CAD DRAWING
DRAWING FROM CUSTOMERS
ARTWORK DRAWING
-CHECK THE SPEC
-BY AUTO CAD
-ETCHING FACTOR -BY AUTO CAD
PRE-TREATMENT
COATING
EXPOSING
ETCHING
REEL TYPE
SHEET TYPE
-UNDER CLASS 1,000
-UNDER CLASS 1,000
E/G DIMENSION INSPECTION
DEVELOPING
P R O G R A M
P L O T T I N G
MASTER PATTERN
WORKING PATTERN
-UNDER CLASS 10
-GLASS
-BY Mento
-GLASS
NG
STRIP CUTTING PLATING TAPING DOWN SET
STRIP TYPE
P/T & D/S DIMENSION
VISUAL
SECOND INSPECTION
FINAL INSPECTION
INPUT
Clean & Rinse
PR Coating & OUTPUT
Clean & PR Coating
1. Purpose
: Photo resist : Material
2. Process Flow
Input → Removing Dust & Oil (Alkali) → Acid Zone (HNO 3)→ Neutral Zone → Coating Zone → Dry Zone → Output
☞TO ELEVATE CONTACTIVITY OF PR BY SURFACE
CLEANING & SURFACE TREATMENT
☞TO COAT STRONG ANTI-ACIDITY RESIST AGAINST FeCl 3
INPUT
Exposing
OUTPUT
Exposing
1. Purpose
: Photo resist : Material UV Lamp
: W/P Glass
☞TO DIVIDE INTO EXPOSED & NON-EXPOSED PART
ON PHOTO-RESIST BY ULTRA-VIOLET LIGHT -EXPOSED PART : WATER-INSOLUABLE -NON-EXPOSED PART : WATER-SOLUABLE
2. Process Flow
Input → Loading → Vacuum → Exposing →Non Vacuum → Unloading → Transfer → Output
INPUT
DEVELOPING
DRY ＆OUTPUT
Developing
: Photo resist : Material
1. Purpose
2. Process Flow
Input → Developing → PR Hardening → Dry → Output
☞TO REMOVE NON-EXPOSED PART BY HOT
INDUSTRIAL WATER
☞TO GIVE STRONG ANTI-ACIDITY & HARDNESS
TO EXPOSED PART(LOW MATERIAL)
: Photo resist
: Material Etching
1. Purpose
2. Process Flow FeCl3
☞TO SHAPE PRODUCT BY ERODING THE NON-EXPOSED SURFACE(LOW MATERIAL)
☞TO STRIP THE WATER-INSOLUABLE PHOTO-RESIST BY SWELLING METHOD AFTER ETCHING -Process for making the figure of lead frame by melting the material with spraying the chemical solution on the surface of the material which the design of the product was printed.
Sheet Loading → Pre-Etching → Etching → Stripping → Neutralization → Anti-Rust → Dry
→ Sheet Unloading
SPOT PLATING
RING PLATING
Plating
DOUBLE RING PLATING
2. Process Flow
☞PROCESS FOR PLATING THE SILVER ON THE LEAD TIP FOR BONDING THE GOLD WIRE
IN THE ASSEMBLY PROCESS OF THE SEMICONDUCTOR.
Strip Loading → Clean Activator → Chemical Polishing → Cu-strike → Anti-immersion → Ag Plating → Stripping → Rinse → Dry → Strip Unloading
1. Purpose
Taping Tool
Down setting
2. Process Flow
☞PROCESS FOR DEPRESSING THE PAD TO PUT THE CHIP ON AND ATTACHING THE TAPE
TO PREVENT THE LEAD FROM DEFORMATION IN THE ASSEMBLY OF SEMICONDUCTOR.
Loading → Taping(Taping Tool) → Down setting(D/S Tool)→ Unloading 1. Purpose
Tie bar
Pad
Q F P
2. Process Flow
☞PROCESS FOR DETECT A DEFECT BY AUTOMATIC INSPECTION MACHINE AND HUMAN
BEING(MIMENSION AND VISUAL)
Loading → Auto Inspection(Dimension/Visual) → Unloading → Visual Inspection → OQC 1. Purpose
Q F P。