【EP3522098A1】MESSAGETRANSMISSIONTIMINGOPTIMIZATION
摩托罗拉XTL-5000与223系列调制板适配器面板连接说明书

AN-DISPATCH-010 Rev B11 FEB 2011MotorolaXTL-5000 Radios to 223 Series Adapter PanelsTable of Contents1.0 General (3)2.0 Interconnect Cable Assembly (3)3.0 223 Series Panels (4)3.1 TRA-223 Setup (4)3.1.1 TRA-223 Dip Switch Settings (4)3.2 DSP-223 Setup (5)3.2.1 DSP-223 Jumper Settings (5)3.3 IP-223 Setup (5)3.3.1 IP-223 Jumper Settings (5)2AN-DISPATCH-010AN-DISPATCH-010 31.0GeneralThis application note is intended to assist technical staff with cable assembly and hardware setup of different Telex 223 series adapters (TRA-223, DSP-223 and IP-223) to a Motorola**1 XTL-5000 series mobile radio.2.0Interconnect Cable AssemblyA cable assembly is required to connect to the 26-pin accessory connector of the XTL to the various 223 series adaptor e Table 1 to build the specified cable assembly.1.See “Copyright Notice” on page 7.TABLE 1. Cable Assembly PinoutsTRA-223DB-25 Pin DSP-223DB-25 Pin IP-223DB-25 Pin XTL 26-PinSignal25252523MIC +24242421RX +14141416PTT 77714 & 15GNDMotorolaXTL-5000 Radios to 223 Series Adapter PanelsMotorola XTL-5000 Radios to 223 Series Adapter Panels4 AN-DISPATCH-0103.0223 Series Panels3.1TRA-223 Setup 3.1.1TRA-223 Dip Switch SettingsTo set front panel dip switches , do the following:1. Set to on :•position 4•position 6•position 72. Select 2- or 4-wire operation using:•position 1•position 2•position 3REFERENCE:For more information, see the TRA-223 Technical ManualP/N 803570, Line Connection section. This document is available for download at /.FIGURE 1.XLT Cable Assembly DiagramMotorola XTL-5000 Radios to 223 Series Adapter PanelsAN-DISPATCH-010 53.2DSP-223 SetupNo DSP-223 software programming is required. 3.2.1DSP-223 Jumper SettingsTo set the DSP223 Jumpers, do the following:1. Set to the A position :•J14, J15, J22, J23, J24, J25, J27.2. Set to the B position:•J12 and J13 3. Solder close JP2.To set the operating mode , do the following > Select 2- or 4- wire operation:•J19, J20 and J21.REFERENCE:For more information, see the DSP-223 Technical Manual (P/N 803274), DSP to Console Line Connection section. Thisdocument is available for download at /.3.3IP-223 SetupSetup the desired IP-223 line’s jumpers for Local radio control.3.3.1IP-223 Jumper SettingsTABLE 2. Jumper SettingsLine 1Jumper SettingsLine 2J33, J34 B = 4-WireJ5, J6J16, J21 A = Singled EndedJ19, J20J14Hanging on center pin = 10K Ohm J24J3, J9, J11 A = Single Ended J25, J28, J29J13 B = HighJ27J17, J22 B = 600 OhmsJ10, J15R377Solder bridge the pads together R381Motorola XTL-5000 Radios to 223 Series Adapter Panels 6 AN-DISPATCH-010P ROPRIETARY N OTICEThe product information and design disclosed herein were originated by and are the property of Bosch Security Systems, Inc. Bosch reserves all patent, proprietary design, manufacturing, reproduction, use and sales rights thereto, and to any article disclosed therein, except to the extent rights are expressly granted to others.C OPYRIGHT N OTICECopyright 2011 by Bosch Security Systems, Inc. All rights reserved. Reproduction, in whole or in part, without prior written permission from Bosch is prohibited.*All other trademarks are property of their respective owners.**MOTOROLA and the Stylized M logo are registered in the U.S. Patent and Trademark Office.W ARRANTY AND S ERVICE I NFORMATIONFor warranty and service information, refer to / warranty.F ACTORY S ERVICE C ENTERFactory Service CenterBosch Security Systems, Inc.Radio Dispatch Products8601 East Cornhusker HighwayLincoln, Nebraska, 68507C ONTACT I NFORMATIONSales:Phone...............................................(800) 752-7560Fax ..................................................(402) 467-3279E-mail.......................**********************.com Customer Service:Repair...............................................(800) 553-5992 Technical Support:Phone ..............................................(800) 898-6723********************************************.comWeb C LAIMSNo liability will be accepted for damages directly or indirectly arising from the use of our materials or from any other causes. Our liability shall be expressly limited to replacement or repair of defective materials.AN-DISPATCH-010 7Revision HistoryDocument Title: Motorola XTL-5000 Radios to 223 Series Adapter PanelsDocument Number: AN-DISPATCH-010Revision Change Description DateA Update brand, format and new document number. (Reference rev B)01-OCT-2009B Update Telex website url. Table 2 correction to row 7 column 1.11-FEB-2011。
AVID FOD Receiver User's Guide

FOD Receiver User’s Guide Rev 3, 07/18/2013General DescriptionThe AVID FOD (Foreign Object Detection) Receiver is a standard WPC V1.1 wireless power receiver (5.0W) that has been calibrated and characterized to accurately measure and report received power information. This RX device is useful for testing transmitter devices, for characterizing and optimizingV1.1 (and newer) transmitter’s FOD functionality, and for doing Qi pre-compliance testing.Here are the main features of the AVID FOD Receiver:- Fully functional V1.1 Qi Receiver- Uses “naked” RX coil as specified for TPR#5 in the WPC Part 3 spec. Coil is isolated from the electronics and mounted in plastic frame that mates with the foreign object holders for good alignment - Factory calibrated and characterized using calibrated AVID FOD Transmitter- Accurately measures and reports PPR (received power) values per WPC V1.1 spec- Calculates and sends additional 16-bit PPR values (proprietary packet 0x28) that can be decoded and reported using the AVID FOD Transmitter and AVID V1.1 Sniffer- Programmable PPR offset and internal loads (DIP switch settings)- External load board (included) has minimum, maximum and in-between loads for testing and characterizing transmitters and for running Qi pre-compliance tests- Supports internal loads up to 2.0 Watts in 0.25 Watt increments (DIP switch settings) and external loads up to 5.0 Watts maximum.AVID FOD Receiver, Top ViewAVID FOD Receiver, Side and Bottom ViewsAVID Receiver Load BoardBasic Setup and OperationTo operate the FOD Receiver, first set the DIP switches on top of the unit to program the internal loadand the PPR offset values (see below) as desired. The FOD receiver can be operated using internalloads up to 2.0 Watts, but AVID recommends leaving the Load DIP switches all off and connecting the external load board to the output screw terminals for testing because this will isolate the load from the receiver and keep the electronics at a more even temperature. Next, place the FOD Receiver on any Qi transmitter for characterization and testing.The “Power” and “Status” LEDs on top of the FOD Receiver indicate the operational state of the receiver. The Power LED will light solid blue as long as the receiver is receiving enough power from the transmitterto power up its internal electronics. The Status LED will light solid green when the receiver is receiving enough power to supply the internal or external load and to regulate its output voltage to +5.0V. Whenthe FOD Receiver is first placed on a transmitter, it connects a minimum internal load of 100 ohms (to ensure robust communications). Next the receiver adjusts its bridge voltage to about 5.8V and then connects the internal or external load and disconnects the minimum 100 ohm load. If an external load is connected to the terminal block on the receiver and current flow is detected through the output, all internal loads are disconnected otherwise the internal load programmed on the DIP switches is left connected.Once the load is connected, the receiver will send error messages to regulate the output to +5.0V +/- 5%. The FOD Receiver should operate normally on any Qi transmitter (base station). If the FOD Receiver is powered up and regulating its output voltage, the status LED will remain green or amber. If the FOD Receiver cannot regulate its output voltage the status LED will turn off. If an error occurs (see below) the status LED will blink red. To maintain good power measurement accuracy, always make sure theFOD Receiver is not operated on or near metal desks or other large metal objects during testing.Below are brief descriptions of the functionality supported by the FOD Receiver: Function DescriptionPower LED Solid blue when FOD Receiver receives sufficient power from the transmitter to power its internal circuitryStatus LED Solid green when FOD Receiver receives sufficient power from the transmitter to power its internal load and regulate to +5.0V +/-5% Solid amber when FOD Receiver receives sufficient power from the transmitter to power an external load and regulate to +5.0V +/-5% Blinking red indicates various error codes (see quick start guide below)VBRIDGE Pin Rectified bridge voltage measurement test point COMM Pin Communication modulator digital signal test point GND Pins Internal circuitry ground referenceTEST DIP Switches PPR offset multiplier (6 bits) 0 to 63. This value is multiplied by the PPR offset step size to get the resulting PPR offset value in mWCOMM DIP Switches PPR step size (2 bits). This value is multiplied by the PPR offset multiplier to get the resulting PPR offset value in mW00 = -5 mW, 01 = -10 mW, 10 = +5 mW, 11 = +10 mWLOAD DIP Switches Internal load (4 bits) 0 to 8 (positions 9-15 reserved)This value is multiplied by 0.25 to get the resulting internal load in Watts If external load >= 0.25W is sensed, all internal loads are switched offTerminal Block For connecting external loads. When operating properly the FOD Receiver will provide +5.0V +/- 5% at this outputExternal Load Board Can be used to connect and switch on/off various external loads for characterizing V1.1 transmitters and running FOD pre-compliance testsV1.1 Transmitter (Base Station) FOD CharacterizationV1.1 QI compliant transmitter (base station) product developers can use the AVID FOD Receiver tool and the AVID external load board (or user supplied load) to characterize and adjust the transmitter power measurements. The FOD Receiver has been characterized using the AudioDev WPC approved V1.1 Test Transmitter and the results show good correlation between transmitted power and received power to within about 50 mW accuracy over a 0.25 W to 6.0 W load range.If the transmitter under test has a means of providing an indication of its transmitted power values during power transfer, then it is possible to use the AVID FOD Receiver to characterize the transmitter’s power loss measurements and FOD thresholds.To use the AVID FOD Receiver to characterize a transmitter, use the following procedure:1) Connect the external load board to the FOD Receiver terminal block and switch on the 0.25 Wload only. The on position for the switches is toward the edge of the load board.2) Place the FOD Receiver on the transmitter, center aligned, and record the transmitted power andreceived power values. If the transmitter does not already provide the received power values to the user, the AVID Qi Sniffer V1.1 can be used to capture the received power values including16-bit high resolution values reported by the AVID FOD Receiver.3) Repeat step 2 at several external load points such as at 1.0 W increments up to 5.0 W.4) Plot the received power vs. transmitted power values for each load point. The data should showgood correlation. If the difference is greater than 100 mW at any of the load points, makeadjustments to the transmitter to improve the power measurements.Base Station Qi Pre-Compliance TestingV1.1 QI compliant transmitter (base station) product developers can use the AVID FOD Receiver tool, the AVID external load board (or electronic load), and a set of WPC defined Foreign Objects to run Qi FOD Part 3 pre-compliance tests. AVID Technologies supplies (separately) the WPC defined foreign objects with an alignment frame and spacers that can be used for this testing.The Part 3 Base Station FOD compliance tests use two test receivers: TPR#5 and TPR#6. These receivers use a low-loss coil with no shield to minimize parasitic losses.TPR#5 is configured to output 5.0V +/-20% and to use a received power window size of 64 ms and a window offset size of 16 ms. TPR#5 is also configured to over report its received power values by 235 mW. During the WPC interim extension period in effect until May 2014, TPR#5 shall instead over report its received power values by 35 mW:TPR#5 PPR = (PPM+235)TPR#5 (INT) PPR = (PPM+35) ** Use this equation during the WPC interim periodPPM is the actual received power determined by the test receiver by measuring its load power and adding estimated parasitic power losses.TPR#6 is identical to TPR#5 except TPR#6 is configured to under report its received power values by 15 mW. During the WPC interim extension period in effect until May 2014, TPR#6 shall instead under report its received power values by 115 mW.TPR#6 PPR = (PPM-15)TPR#6 (INT) PPR = (PPM-115) ** Use this equation during the WPC interim periodBase Station Thermal Compliance TestingThe Part 3 Base Station FOD thermal compliance tests consist of measurements that check the temperature rise (at +25 deg C ambient) of four different WPC defined foreign objects while they are placed between the test receiver (TPR#5) and the base station during power transfer. Each object has an allowed temperature limit as defined in the table below.WPC Defined Foreign Objects:LimitObject Configuration Temperature#1 Steel disc centered 60 deg C#2 Aluminum ring centered 60 deg C#3 Aluminum foil centered 80 deg C#4 Steel disc offset 15.5 mm 60 deg CIf any of the foreign objects reaches or exceeds the temperature limits above during testing, the transmitter’s FOD measurements, thresholds, or reaction time may need to be adjusted to meet compliance.To use the AVID FOD Receiver to emulate TPR#5 and run the foreign object thermal pre-compliance tests on a base station, use the following procedure:1) Set the DIP switches on the AVID FOD Receiver to emulate TPR#5 as follows:TEST = 000111 (PPR offset multiplier = 7)COMM = 10 (PPR offset step = +5 mW)LOAD = 0000 (no internal load)2) Connect the external load board to the FOD Receiver and switch on the 0.25W (100 ohm) loadonly on the far left of the load board near the terminal block connector.3) Connect foreign object #1 (steel disc) K-type thermocouple connector to a suitable thermometeror DMM that can measure temperature of a K-type thermocouple.4) Fit the clear plastic alignment frame on top of the foreign object holder.5) Place the foreign object and alignment frame on the base station under test and align the centerof the foreign object holder with the center of the base station transmitter coil. The AVID foreign object holders have score marks that indicate the center lines.6) Place the AVID FOD Receiver in the alignment frame on top of the foreign object and make surethe receiver and foreign object are still center aligned with the transmitter coil.7) Increase the load on the external load until the transmitter hits its power loss (FOD) threshold andterminates (or lowers) its transmitted power. If you are using the AVID supplied external loadboard, leave the 0.25W load switched on, switch on the variable (0.24 W to 1.38 W) load, andslowly adjust the potentiometer until right at the point the power loss threshold is hit.8) Reduce the external load by 50 mA. If you are using the AVID supplied external load board thiscan be accomplished by switching off the 0.25W (100 ohm) load.9) Run the transmitter for 10 minutes (or until the transmitter terminates power transfer) and recordthe temperature of the foreign object.If the transmitter terminates power transfer before 10 minutes during any of these tests, repeat steps 6 and 7 above and reduce the load slightly until the transmitter runs for 10 minutes OR until the minimum load of 0.25 W (50.0 mA) is reached. At the minimum load, if the transmitter still terminates power before 10 minutes, the temperature of the object is recorded at the point where power transfer was terminated. The steps above are repeated as follows:- Using object #1 with 2.0 mm spacer placed between the foreign object and the AVID FOD receiver- Using object #1 with 5.0 mm spacer placed between the foreign object and the AVID FOD receiver- Using foreign object #2- Using foreign object #3- Using foreign object #4The steel disc objects present lower power losses and temperature rises than the other objects. For the steel objects, the thermal test may run for the full 10 minutes. The transmitter FOD power loss threshold should be set to keep the temperature of the objects below the limit at the end of the 10 minute test.The aluminum foil and ring objects present higher power losses and temperature rises than the steel discs. For these objects, even at the minimum 50 mA load the thermal test may not run the full 10 minutes before the transmitter reaches its FOD power loss threshold. In this case the transmitter FOD threshold and reaction time should be adjusted to keep the foreign object temperature below the limit when the threshold is reached and the transmitter either terminates or reduces power.If the transmitter can be adjusted to keep the foreign objects below the temperature limits for all of the above tests, then the product will likely pass the FOD thermal compliance tests at an approved Qi compliance lab. If not, adjust the transmitter FOD power loss thresholds and reaction time accordingly.Base Station Guaranteed Power Compliance TestingThe Part 3 Base Station FOD guaranteed power compliance test consists of a measurement that checks to make sure the base station under test can deliver 5.0 Watts to a test receiver (TPR#6) that has no foreign object present, but is simulating power loss into a foreign object by under reporting its received power.To use the AVID FOD Receiver to emulate TPR#6 and run the guaranteed power pre-compliance tests on a base station, use the following procedure:1) Set the DIP switches on the AVID FOD Receiver to emulate TPR#6 as follows:TEST = 010111 (PPR offset multiplier = 23)COMM = 00 (PPR offset step = -5 mW)LOAD = 0000 (no internal load)2) Connect the external load board to the FOD Receiver and switch on the 0.25W load only.3) Place the FOD Receiver on the base station and make sure it is center aligned with thetransmitter coil. Wait until the base station begins power transfer.4) Switch on the 1W load on the external load board. Allow the base station to continue powertransfer for 10 seconds.5) Switch on the 2W load on the external load board. Allow the base station to continue powertransfer for 10 seconds.6) Switch on the 3W load and switch off the 0.25W and 1W loads on the external load board (total =5W load). Allow the base station to continue power transfer for 5 minutes.7) Measure the voltage at the terminal block output on the FOD Receiver and make sure it isbetween 4.75V and 5.25V (regulation tolerance of the FOD Receiver).If the voltage measured in step 7 is between 4.75V and 5.25V, then the product will likely pass the FOD guaranteed power compliance tests at an approved Qi compliance lab. If the voltage is not between4.75V to5.25V, make adjustments to the base station device to improve the power transfer performance and repeat the tests above.NOTE: AVID FOD TOOLS ARE NOT APPROVED FOR FINAL QI COMPLIANCE TESTING. THEY ARE DESIGNED TO BE USED FOR DEVELOPMENT AND PRE-COMPLIANCE TESTING BY CUSTOMERS DESIGNING and PROTOTYPING WPC V1.1 WIRELESS POWER PRODUCTS.AVID FOD Receiver Quick Start Guide:Quick Start Guide ***************************SYSTEM MONITORING:VBRIDGE: (5.0V +/-0.5V)Receiver DC Bridge VoltageCOMM. (0 -3.3V Logic)Modulation Signal5V, 0-1A OUTPUT:Internal load is disabledwhen external load (>0.25W)is connected.CONFIGURATION SWITCHES:TEST Position 1-6PPR offset multiplierLOAD Position 1-4Selects internal load0-2W, in 0.25W StepsCOMM Position 5PPR offset polarityPosition 6PPR offset step sizeAll switches can be changedduring run time.STATUS LED:©2013 AVID Technologies, Inc. All rights reserved.FOD Receiver。
微斯米微波式芯片公司2014年产品说明书

1FeaturesInputs/Outputs •Accepts differential or single-ended input •LVPECL, LVDS, CML, HCSL, LVCMOS •On-chip input termination resistors and biasing for AC coupled inputs•Six precision LVPECL outputs •Operating frequency up to 750 MHzPower •Options for 2.5 V or 3.3 V power supply •Core current consumption of 110 mA•On-chip Low Drop Out (LDO) Regulator for superior power supply rejectionPerformance •Ultra low additive jitter of 36 fs RMSApplications•General purpose clock distribution •Low jitter clock trees •Logic translation•Clock and data signal restoration•Wired communications: OTN, SONET/SDH, GE,10 GE, FC and 10G FC•PCI Express generation 1/2/3 clock distribution •Wireless communications•High performance microprocessor clock distributionApril 2014Figure 1 - Functional Block DiagramZL40205Precision 1:6 LVPECL Fanout Bufferwith On-Chip Input TerminationData SheetOrdering InformationZL40205LDG1 32 Pin QFN TraysZL40205LDF132 Pin QFNTape and ReelMatte TinPackage Size: 5 x 5 mm-40o C to +85o CTable of ContentsFeatures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Inputs/Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Performance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Change Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 41.0 Package Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .52.0 Pin Description. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .63.0 Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73.1 Clock Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .73.2 Clock Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .123.3 Device Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .153.4 Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.1 Sensitivity to power supply noise. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.2 Power supply filtering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .163.4.3 PCB layout considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .164.0 AC and DC Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175.0 Performance Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .206.0 Typical Behavior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .217.0 Package Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .238.0 Mechanical Drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .24List of FiguresFigure 1 - Functional Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Figure 2 - Pin Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Figure 3 - Simplified Diagram of Input Stage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Figure 4 - Clock Input - LVPECL - DC Coupled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 5 - Clock Input - LVPECL - AC Coupled. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Figure 6 - Clock Input - LVDS - DC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 7 - Clock Input - LVDS - AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Figure 8 - Clock Input - CML- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 9 - Clock Input - HCSL- AC Coupled . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Figure 10 - Clock Input - AC-coupled Single-Ended . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 11 - Clock Input - DC-coupled 3.3V CMOS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Figure 12 - Simplified Output Driver. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 13 - LVPECL Basic Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Figure 14 - LVPECL Parallel Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 15 - LVPECL Parallel Thevenin-Equivalent Output Termination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Figure 16 - LVPECL AC Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 17 - LVPECL AC Output Termination for CML Inputs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Figure 18 - Additive Jitter. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Figure 19 - Decoupling Connections for Power Pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Figure 20 - Differential and Single-Ended Output Voltages Parameter Definitions . . . . . . . . . . . . . . . . . . . . . . . . 18 Figure 21 - Input To Output Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19Change SummaryPage Item Change1Applications Added PCI Express clock distribution.6Pin Description Added exposed pad to Pin Description.8Figure 4 and Figure 5Removed 22 ohm series resistors from Figure 4 and 5. These resistor are not required; however there is no impact to performance if the resistors are included.16Power supply filtering 18Figure 20Clarification of V ID and V OD .Below are the changes from the February 2013 issue to the April 2014 issue:Page Item Change8Figure 4Changed text to indicate the circuit is not recommended for VDD_driver=2.5V.Below are the changes from the November 2012 issue to the February 2013 issue:Corrected typo of 0.3 Ohm to 0.15 Ohm.1.0 Package DescriptionThe device is packaged in a 32 pin QFNFigure 2 - Pin Connections2.0 Pin DescriptionPin # Name Description3, 6clk_p, clk_n,Differential Input (Analog Input). Differential (or single ended) input signals.For all input configurations see “Clock Inputs” on page 728, 27, 26, 25, 24, 23, 18, 17, 16, 15, 14, 13out0_p, out0_nout1_p, out1_nout2_p, out2_nout3_p, out3_nout4_p, out4_nout5_p, out5_nDifferential Output (Analog Output). Differential outputs.9, 19,22, 32vdd Positive Supply Voltage. 2.5 V DC or 3.3 V DC nominal.1, 8vdd_core Positive Supply Voltage. 2.5 V DC or 3.3 V DC nominal.2, 7,20, 21gnd Ground. 0 V.4vt On-Chip Input Termination Node (Analog). Center tap between internal 50 Ohmtermination resistors.The use of this pin is detailed in section 3.1, “Clock Inputs“, for various input signal types.5ctrl Digital Control for On-Chip Input Termination (Input). Selects differential input mode;0: DC coupled LVPECL or LVDS modes1: AC coupled differential modesThis pin are internally pulled down to GND. The use of this pin is detailed in section 3.1,“Clock Inputs“, for various input signal types.10, 11,12, 29,30, 31NC No Connection. Leave unconnected.Exposed Pad Device GND.3.0 Functional DescriptionThe ZL40205 is an LVPECL clock fan out buffer with six output clock drivers capable of operating at frequencies up to 750MHz.The ZL40205 provides an internal input termination network for DC and AC coupled inputs; optional input biasing for AC coupled inputs is also provided. The ZL40205 can accept DC or AC coupled LVPECL and LVDS input signals, AC coupled CML or HCSL input signals, and single ended signals. A pin compatible device with external termination is also available.The ZL40205 is designed to fan out low-jitter reference clocks for wired or optical communications applications while adding minimal jitter to the clock signal. An internal linear power supply regulator and bulk capacitors minimize additive jitter due to power supply noise. The device operates from 2.5V+/-5% or 3.3V+/-5% supply. Its operation is guaranteed over the industrial temperature range -40°C to +85°C.The device block diagram is shown in Figure 1; its operation is described in the following sections.3.1 Clock InputsThe device has a differential input equipped with two on-chip 50 Ohm termination resistors arranged in series with a center tap. The input can accept many differential and single-ended signals with AC or DC coupling as appropriate. A control pin is available to enable internal biasing for AC coupled inputs. A block diagram of the input stage is in Figure 3.Receiverclk_n 50clk_pVt 50BiasctrlFigure 3 - Simplified Diagram of Input StageThis following figures give the components values and configuration for the various circuits compatible with the input stage and the use of the Vt and ctrl pins in each case.In the following diagrams where the ctrl pin is logically one and the Vt pin is not connected, the Vt pin can be instead connected to VDD with a capacitor. A capacitor can also help in Figure 4 between Vt and VDD. This capacitor will minimize the noise at the point between the two internal termination resistors and improve the overall performance of the device.Figure 4 - Clock Input - LVPECL - DC CoupledFigure 5 - Clock Input - LVPECL - AC CoupledFigure 6 - Clock Input - LVDS - DC CoupledFigure 7 - Clock Input - LVDS - AC CoupledFigure 8 - Clock Input - CML- AC CoupledFigure 9 - Clock Input - HCSL- AC CoupledFigure 10 - Clock Input - AC-coupled Single-EndedFigure 11 - Clock Input - DC-coupled 3.3V CMOS3.2 Clock OutputsLVPECL has a very low output impedance and a differential signal swing between 1V and 1.6 V. A simplified diagram for the output stage is shown in Figure 12.The LVPECL to LVDS output termination is not shown since there is a different device with the same inputs and LVDS outputs.out_pout_nFigure 12 - Simplified Output DriverThe methods to terminate the ZL40205 LVPECL drivers are shown in the following figures.Figure 15 - LVPECL Parallel Thevenin-Equivalent Output TerminationFigure 16 - LVPECL AC Output TerminationFigure 17 - LVPECL AC Output Termination for CML Inputs3.3 Device Additive JitterThe ZL40205 clock fanout buffer is not intended to filter clock jitter. The jitter performance of this type of device is characterized by its additive jitter. Additive jitter is the jitter the device would add to a hypothetical jitter-free clock as it passes through the device. The additive jitter of the ZL40205 is random and as such it is not correlated to the jitter of the input clock signal.The square of the resultant random RMS jitter at the output of the ZL40205 is equal to the sum of the squares of the various random RMS jitter sources including: input clock jitter; additive jitter of the buffer; and additive random jitter due to power supply noise. There may be additional deterministic jitter sources, but they are not shown in Figure 18.Figure 18 - Additive Jitter3.4 Power SupplyThis device operates employing either a 2.5V supply or 3.3V supply.3.4.1 Sensitivity to power supply noisePower supply noise from sources such as switching power supplies and high-power digital components such as FPGAs can induce additive jitter on clock buffer outputs. The ZL40205 is equipped with a low drop out (LDO) regulator and on-chip bulk capacitors to minimize additive jitter due to power supply noise. The on-chip regulation, recommended power supply filtering, and good PCB layout all work together to minimize the additive jitter from power supply noise.3.4.2 Power supply filteringJitter levels may increase when noise is present on the power pins. For optimal jitter performance, the device should be isolated from the power planes connected to its power supply pins as shown in Figure 19. •10 µF capacitors should be size 0603 or size 0805 X5R or X7R ceramic, 6.3 V minimum rating •0.1 µF capacitors should be size 0402 X5R ceramic, 6.3 V minimum rating •Capacitors should be placed next to the connected device power pins •A 0.15 Ohm resistor is recommended3.4.3 PCB layout considerationsThe power nets in Figure 19 can be implemented either as a plane island or routed power topology without changing the overall jitter performance of the device.ZL402051891922320.1 µF 0.1 µFvdd_core10 µF 0.1 µF0.15 Ωvdd0.1 µF 10 µFFigure 19 - Decoupling Connections for Power PinsAbsolute Maximum Ratings*Parameter Sym.Min.Max.Units 1Supply voltage V DD_R-0.5 4.6V 2Voltage on any digital pin V PIN-0.5VDD V 4LVPECL output current I out30mA 5Soldering temperature T260 °C 6Storage temperature T ST-55125 °C 7Junction temperature T j125 °C 8Voltage on input pin V input VDD V 9Input capacitance each pin C p500fF 4.0 AC and DC Electrical Characteristics* Exceeding these values may cause permanent damage. Functional operation under these conditions is not implied.* Voltages are with respect to ground (GND) unless otherwise statedRecommended Operating Conditions*Characteristics Sym.Min.Typ.Max.Units1Supply voltage 2.5 V mode V DD25 2.375 2.5 2.625V2Supply voltage 3.3 V mode V DD33 3.135 3.3 3.465V3Operating temperature T A-402585°C* Voltages are with respect to ground (GND) unless otherwise statedDC Electrical Characteristics - Current ConsumptionCharacteristics Sym.Min.Typ.Max.Units Notes 1Supply current LVPECL drivers -unloadedI dd_unload110mA Unloaded2Supply current LVPECL drivers - loaded (all outputs are active)I dd_load209mA Including powerto R L = 50DC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristics Sym.Min.Typ.Max.Units Notes1CMOS control logic high-level inputvoltageV CIH0.7*V DD V2CMOS control logic low-level inputvoltageV CIL0.3*V DD V3CMOS control logic Input leakagecurrentI IL1µA V I = V DD or 0 V4Differential input common modevoltageV CM 1.1 2.0V5Differential input voltage difference V ID0.251V6Differential input resistance V IR80100120ohm* This parameter was measured from 125 MHz to 750 MHz.* This parameter was measured from 125 MHz to 750 MHz.Figure 20 - Differential and Single-Ended Output Voltages Parameter Definitions7LVPECL output high voltage V OH V DD -1.40V 8LVPECL output low voltage V OL V DD - 1.62V 9LVPECL output differential voltage*V OD0.50.9VDC Electrical Characteristics - Inputs and Outputs - for 2.5 V SupplyCharacteristicsSym.Min.Typ.Max.Units Notes1Differential input common mode voltageV CM 1.1 1.6V 2Differential input voltage difference V ID 0.251V 3Differential input resistance V IR 80100120ohm 4LVPECL output high voltage V OH V DD -1.40V 5LVPECL output low voltage V OL V DD - 1.62V 6LVPECL output differential voltage*V OD0.40.9VDC Electrical Characteristics - Inputs and Outputs - for 3.3 V SupplyCharacteristicsSym.Min.Typ.Max.Units NotesAC Electrical Characteristics* - Inputs and Outputs (see Figure 21) - for 2.5/3.3 V supply.Characteristics Sym.Min.Typ.Max.Units Notes 1Maximum Operating Frequency1/t p750MHz2Input to output clock propagation delay t pd012ns3Output to output skew t out2out50100ps4Part to part output skew t part2part80300ps5Output clock Duty Cycle degradation t PWH/ t PWL-202Percent6LVPECL Output clock slew rate r SL0.75 1.2V/ns* Supply voltage and operating temperature are as per Recommended Operating ConditionsInputt Pt PWL t pdt PWHOutputFigure 21 - Input To Output TimingAdditive Jitter at 2.5 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1392212.512 kHz - 20 MHz 1093311.0412 kHz - 20 MHz 85442512 kHz - 20 MHz 57550012 kHz - 20 MHz 506622.0812 kHz - 20 MHz 40775012 kHz - 20 MHz36Additive Jitter at 3.3 V*Output Frequency (MHz)Jitter MeasurementFilterTypical RMS (fs)Notes112512 kHz - 20 MHz 1152212.512 kHz - 20 MHz 853311.0412 kHz - 20 MHz 72442512 kHz - 20 MHz 55550012 kHz - 20 MHz 486622.0812 kHz - 20 MHz 41775012 kHz - 20 MHz395.0 Performance Characterization*The values in this table were taken with an approximate slew rate of 0.8 V/ns.*The values in this table were taken with an approximate slew rate of 0.8 V/ns.Additive Jitter from a Power Supply Tone*Carrier frequencyParameterTypicalUnitsNotes125MHz 25 mV at 100 kHz 115fs RMS 750MHz25 mV at 100 kHz59fs RMS* The values in this table are the additive periodic jitter caused by an interfering tone typically caused by a switching power supply. For this test, measurements were taken over the full temperature and voltage range for V DD = 2.5 V. The magnitude of the interfering tone is measured at the DUT.6.0 Typical BehaviorTypical Phase Noise at 622.08 MHzTypical Waveformat 155.52 MHzV OD versus FrequencyPropagation Delay versus TemperatureNote:This is for a single device. For more details see thePower Supply Tone Frequency (at 25 mV) versus PSRR at 125 MHz Power Supply Tone Frequency (at 25 mV) versus Additive Jitter at 125 MHzPower Supply Tone Magnitude (at 100 kHz) versus PSRR at 125 MHz Power Supply Tone Magnitude (at 100 kHz) versus Additive Jitter at 125 MHz7.0 Package CharacteristicsThermal DataParameter Symbol Test Condition Value UnitJunction to Ambient Thermal Resistance ΘJA Still Air1 m/s2 m/s 37.433.131.5o C/WJunction to Case Thermal Resistance ΘJC24.4o C/W Junction to Board Thermal Resistance ΘJB19.5o C/W Maximum Junction Temperature*T jmax125o C Maximum Ambient Temperature T A85o C© 2014 Microsemi Corporation. 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移动联通网络知识考试:诺西BTS设备基维护知识(题库版)

移动联通网络知识考试:诺西BTS设备基维护知识(题库版)1、单选诺西UltraSite基站的M6xx单元若用于GSM900,则称为:()A、M6DxB、M6GxC、M6HxD、M6Lx正确答案:D2、填空题(江南博哥)诺西的FlexiEDGEBTS中,TRXloop位于()模块和()模块中。
正确答案:ERxA;ECxA3、单选诺西的e-MicroBTS主机柜单元的最小配置为()个。
A、1B、2C、3D、4正确答案:B4、问答题简单解释什么是诺西BTSplus基站的自动恢复及其要求。
正确答案:自动恢复指在更换故障模块后,BTSE模块不需要额外的命令操作(通过LMT或OMC而自动恢复。
自动恢复过程让客户的更换模块过程不需要操作人员进行额外测试,只要模块恢复过程中没有错误,设备功能就可自动恢复。
自动恢复功能的触发基本要求是重新上电时,相关BTSE模块的操作状态是Disabled,管理状态是Unlocked,并且模块可用状态是Failed。
5、单选诺西UltraSite基站中的供电单元PWSB使用的输入电压为()。
A、24VDCB、48VDCC、180VACD、230VAC正确答案:B6、单选诺西UltraSite基站的M2xx单元的典型插入损耗为:()A、3dBB、6dBC、9dBD、12dB正确答案:C7、填空题诺西的FlexiEDGEBTS的系统扩展模块ESEA提供()个PWR口和()个BUS口。
正确答案:6;128、单选如果诺西UltraSite基站的TSxx单元前面板上的LED显示为黄色长亮,则表示TSxx:()A、未提供服务B、服务中,发射机关C、服务中,发射机开D、故障正确答案:B9、问答题列举诺西基站7606告警的主要触发原因。
正确答案:(1)天馈系统问题引起由于天馈驻波比过高或载波本身问题造成(2)硬件及数据配置问题由于硬件连接问题、载波本身故障或BSC数据问题造成10、填空题诺西BS24x/BS4x基站载频单元功率控制分为()级静态功率控制(每级2dB)和另外()级动态功率控制(每级2dB)。
Timing Advance Processor EG DYNAMIC用户手册说明书

Timing Advance ProcessorEG DYNAMICuser manualver. 2.7.1 dated 2021-06-22This instruction can be also downloaded from:https://europegas.pl/en/wsparcie-techniczne/Table of content1. Timing Advance Processor “EG Dynamic” description (3)2. Description of signal connections (4)2.1. Power supply source (4)2.2. MAP signal (optional) (5)2.3. TPS signal (5)2.4. Activation signal (5)2.5. Crankshaft position sensor and camshaft position sensor signals (5)2.6. Diagnostic interface plug (6)2.7. Proper installation of TAP EG Dynamic ECU (7)3. Software description (8)3.1. Right panel – actual value of system parameters: (8)3.2. Left panel – Settings bookmark (9)3.3. Middle panel – Maps (11)4. EG Dynamic TAP Calibration step-by-step (12)Hint: Click with Your left mouse button on any of above chapters to go to its page.1. Timing Advance Processor “EG Dynamic” description.EG DYNAMIC Timing advance processor dynamically changes the moment of engine's ignition while it is running on LPG/CNG fuel to improve combustion process efficiency. This way vehicle's engine works more dynamically. Power losses during acceleration are practically eliminated. Advance of ignition is very important when engine runs on CNG because CNG-air mixture combustion time is much longer comparing to combustion time of petrol-air mixture. Usage of Timing Advance Processor also eliminates risk of backfiring and significantly reduces gas consumption. We can say that it is temporarily adapting the original vehicle's ignition system to use LPG/CNG so the difference between driving on both fuel is practically imperceptible.Main advantages of EG DYNAMIC Timing Advance Processor are:∙It is no longer necessary to keep different TAP models depending on type of the crankshaft/camshaft position signal type in particular car.EG DYNAMIC is scanning, learning and supporting all inductive and digital crankshaft and camshaft signals.∙Very easy calibration and configuration process with usage of multipliers user interface.∙Possibility of dynamic and smooth advancing or delaying of ignition angle up to +-30 degrees, depending on the current values of TPS position, RPM and MAP signals.∙Single TAP device supports one inductive sensor and up to two digital sensors simultaneously (STD version) or three digital sensors simultaneously (3D version). It is possible to connect them in any configuration.∙Flexible adjustment of TAP activation moment . Advancing of ignition depends on actual values of RPM and TPS signal and can be activated by “+” or by “-” signal.∙Deactivation of TAP and restoring the original RPM signal in case of emergency can be done easily by pulling out the fuse from fuse holder.2. Description of signal connections2.1. Power supply sourceAttention:Device is destined to be used in cars with +12V power supply installation.Power supply should be connected to such a place from where the device is powered all the time while engine is running. It should be present from the moment of turning ignition key in ACC position until the engine will be switched off. It is unacceptable to connect this line to places where +12V might dissapear: for example, where voltage may drop out while engine is in the cut-off conditions.Hint: In OSCAR-N SAS ECU we should connect it to the red-white wire connected to the +12V ignition from the key.Power supply wire is equipped with 1A circuit fuse, which after removal allows us to disable TAP operation and restore the original RPM signal without necessity of shortening the original camshaft/crankshaft signal wires.2.2. MAP signal (optional)V oltage signal taken from the signal wire of Manifold Absolute Pressure sensor.This connection enables to measure the vacuum signal in the intake manifold so it is possible to make corrections of ignition point angle depending on engine load.Hint: In OSCAR-N SAS ECU we should connect it to the blue wire which goes to mapsensor [pin no. 3 in 4-pole AMP mapsensor plug].2.3. TPS signalSignal of Throttle position sensor or acceleration pedal sensor. Connecting that signal is required for proper calibration and detection of idle and cut-off conditions. TPS signal wire is the one on which voltage (regarding the ground ) changes its value fluently (eg. from 0 to 5V) when we are pressing on the accelerator pedal when vehicle's ignition key is on.2.4. Activation signalSignal which indicates when vehicle is running on gas and when on petrol. It is being used for activation of TAP to start advancing the original RPM signal when all cylinders has been switched to gas fuel.Hint. In case of use of OSCAR-N SAS system the best way of taking the activation signal is connecting to pink wire also used for disconnection of petrol fuel pump when system is on gas.Negative (“-”) signal appears on pink wire when OSCAR-N system is completely switched to gas and disappears in the moment when the system is switched back to petrol.We can also take positive (“+”) activation signal from +12V solenoid valve wire. In such case we should set proper type of gas activation signal (by “+”) in the EG Dynamic software. Gas controller should also be configured in such way to eliminate delays between moment of activating solenoid valves and changeover to gas.2.5. Crankshaft position sensor and camshaft position sensor signalsTo correct configuration we need to properly identify and connect the crankshaft position sensor and the camshaft position sensor(-s) (if present), are located. First, we set the sensor type: •if the connector have two pins, it is an inductive sensor type (resistance value for a typical inductive sensor is approximately 1 kOhm)•if connector has three-pins, it can be inductive sensor type(two pins sensor, the third pin ground. The resistance between the two pins of the sensor is approximately 1 kOhm, and the third pin from the ECU is connected to the ground)•if connector has three-pins, it can be digital sensor type(ground, power supply, signal).One pin from the ECU is connected to ground, the other is power "+12V from the ignition key", the third one is a signal cable).Attention: In controllers equipped with 3 digital channels (3D) it is not possible to configure the inductive sensor (the program automatically detects the type of device).Crankshaft position sensor signal:Main and most important signal to connect is the crankshaft position sensor signal. Camshaft position sensor signal don't have to be connected if it is not necessary to do so. This kind of necessity might happen when the original ECM of the car is report errors related with not synchronizing the camshaft position signal while advancing the signal from crankshaft position sensor. At first we should identify the type of sensor. Inductive sensor -usually it has pins which goes to two lines covered by a screen. Resistance measured between these two lines is around 1000 Ohm. If there are three pins, two of them are connected to signal lines and third one is connected with screen which is the ground signal of vehicle's ECU.Hint if possible we should find the place to cut into signal wires at where additional cover/screen insulation of signal wires is not present. First we should identify two signal wires, cut them and make serial connection by connecting proper pairs of wires from TAP device.There are four wires used to cut into vehicle's inductive signal wires: yellow and white -channel A, green and brown -channel B. We should start with cutting only one signal wire at a time (let's name it 'signal wire A') and connect first pair of inductive signal wires from TAP device:•yellow wire -should be connected with vehicle's inductive signal wire A input going from the inductive sensor•white wire -should be connected with vehicle's inductive signal wire A output going to the petrol ECU Then we proceed with cutting second signal wire (let's name it 'signal wire B') and connect remaining pair of inductive signal wires from TAP device:•green wire -should be connected with vehicle's inductive signal wire B input going from the inductive sensor•brown wire -should be connected with vehicle's inductive signal wire B output going to the petrol ECUAttention: If above connections will be made improperly we may be be not possible to start the vehicle.Camshaft position sensor:Digital sensor. Usually that kind of sensor have three lines signal, ground, power supply: +5V or +12V signal. We should cut only the signal wire and connect it serial to digital channel pair of wires.Hint: The original wire of signal input from digital sensor should be always connected to the color wire with black stripe (blue- black or yellow-black color). The adequate color wire without stripe should always be connected to that part of original vehicle's sensor signal wire which goes to the petrol ECU (blue or yellow color). Otherwise it might cause problem with engine work2.6. Diagnostic interface plugDiagnostic interface wire plug should be connected to EG Dynamic interface. It is possible to establish connection only if the TAP device is powered by +12V (the ignition key is on).2.7. Proper installation of TAP EG Dynamic ECUDuring the installation of TAP EG Dynamic ECU is suggested for the wire set to point downwards. It is also suggested that it should be placed in such a way to avoid the negative impact of high temperature and humidity. It is highly prohibited to spray ECU box with water jets or expose it to long lasting contact with water.3. Software description3.1. Right panel – actual value of system parameters:•Shifting – this value is informing if the impulses are being advanced or delayed (ON) or not (OFF) at the present moment.•Gas– this value is signaling on what fuel the car the car is actually running: on gas (ON) or petrol (OFF).•Angle [`] - angle value (in degrees) by which the current revolutions signal is being shifted.•RPM– rotary engine speed value.•TPS [%]– position of throttle position percentage (accelerator pedal).•MAP [kPa]– actual value of pressure in the intake manifold (engine load).•Inductive [Hz] - the current number of pulses per second for a signal from the inductive sensor.•Digital 1 [Hz] - The current number of pulses per second for a digital sensor signal no.•Digital 2 [Hz] - The current number of pulses per second for a digital sensor signal no.•Power supply [V]- power supply value. This value shouldn't be lower than 9V and not higher than 15V.If any parameter is marked by purple colour, it means that its value is out of allowed working range which determines when signal shifting can be done. Eg. the car is not in gas mode or the TPS signal is below minimum value which has been programmed to start shifting..If any parameter is marked by red colour, it means that its value is beyond the border value. Itprevents proper operation of TAP device. It might also mean that device does not recognize the shape of sensor signal wave. In such case it is necessary to physically check the signal connection and do another signal scanning from the software.3.2. Left panel – Settings bookmark•TPS Calibration - calibration of the minimum and maximum TPS input voltages for fully depressed and pressed accelerator pedal.•Enabling configuration - conditions that must be fulfilled so in the automatic mode the signal pulses shifting can be done.•Advanced◦Pressure sensor - selects the type MAP pressure sensor connected (in OSCAR-N SAS it's ABS400kPa).◦Signaling work on the gas- the choice of polarization of signal which enables shifting the signal pulses: If the TAP activation wire connection has been done topositive signal wire (like +12V solenoid valve wire) we need to choose “plus”. Ifwe've connected it to fuel pump disconnection signal (pink wire from OSCAR-NSAS which gives “ground” signal) we need to choose “minus”.◦TPS acceleration correction - the choice of TPS signal changes sensitivity. It's helpful in cases at which original ignition signal angle temporary increasessignificantly when accelerating. This allows to temporary increase the angle of signalshifting by extra velue for the rapid accelerations to compensate this signal change. Itworks only if RPM value is less than 1500 RPM.Attention: It is not reccomended to increase value of that parameter if it is notnecessary.◦Allowed retard – extends shift range for negative value. Default setting is OFF. Only for conversion from CNG to LPG use this option to retard ignition.•Inductive sensor, digital sensor 1, digital sensor 2◦Connections - selection of type of shaft where signal has been connected.◦Impulses per 1 revolution: number of pulses per revolution detected during a scan run (control value)◦Scan – starts automatic scanning the sensor signal wave. Should be carried out under stable conditions when the engine is running on idle. It is necessary to provide the actualvalue of engine rotary speed before starting scanning.In case that we've already scanned the wave of crankshaft sensor signal, and we need toget the shape of camshaft position signal wave we can select that option to allow thesignal to be read from that channel.Attention:It is very important to always start scanning from the crankshaft sensorsignal, and proceed to scanning of the camshaft sensors signals (if they have beenconnected)◦Preview - feature which enable us to check the shape of scanned sensor signal wave.3.3. Middle panel – MapsMap of the angle shifting regarding enginerotary speed.Point of the violet line indicates the currentsignal pulses shifting offset (in degrees).It is recommended to set a lower angle valueat higher rotary speeds.Multiplier Correction (eg. 1.0 is 100%, 0.6 is60% of original shifting offset) of the angleregarding the engine manifold absolutepressure(load).For heavy loads is recommended to set theadjustment below 1.0 to do not increase theengine knock value.Multiplier Correction (eg. 1.0 is 100%, 0.6 is60% of original shifting offset) of the angleregarding the TPS signal value.For idle conditions signal pulses shiftingshould be disabed , because it can lead toengines RPM waving in some type ofvehicles.We can do it by lowering themultiplier line on the map or in the Settingspanel.Allowed shortcuts and controls for map modification:•Left mouse button - move the points in the X and Y axis.•Right mouse button - move only points in Y axis.•Double click by left mouse button -add or remove point.•Arrow left, arrow right - selection of point.•Shift + arrow left, Shift + arrow righ t - selection of a group of points.•Ctrl + A – selection of all the points.•Arrow up, Arrow down - moving points in the Y-axis.•Home, End - moving points in the Y-axis with a higher speed•Ctrl + arrow up, Ctrl + down, Ctrl + left, Ctrl + right -moves points in the X and Y•Insert - adds another point•Delete - removes the selected point•Page Up, Page Down - moves the whole multiplier line in the Y-axis4. EG Dynamic TAP Calibration step-by-step.1.Establishing a connection– Turn on the ignition key to give +12V to the TAP device.Please select the right the serial port number from "Port" menu to establish a connection with diagnostic interface device.2.Calibrate TPS - while the engine is off, please make sure that ignition from the key is stillon and TAP device is being powered by +12V. In"TPS calibration", press"Set"button when the accelerator is fully depressed to remember that value as “Bottom TPS Threshold”.Then fully press the pedal all the way down and press "Set" button to store the maximum TPS voltage value as“Top TPS Threshold”.Check if changing the position of the acceleration pedal causes changing the current value of the TPS smoothly from 0 to 100%3.Selection of pressure sensor. -after selecting the appropriate sensor type when engine is off,and +12V from igniton on, the value of this parameter to indicate the MAP should be about 100 kPa. The default pressure sensor for OSCAR-N SAS is ABS400kPa.4.Selection of the activation of signal which indicates that vehicle is workng on gas-depending on where you connect the activation signal of TAP activation wire. If it has been connected to positive signal wire (eg. +12V solenoid valve wire) we need to choose “plus”.If we've connected it to fuel pump disconnection signal (eg. pink wire from OSCAR-N SAS which gives “ground” signal) we need to choose “minus”.5.Crankshaft sensor configuration - depending on the type of sensor and connection made toit (inductive or digital) we need to select proper type of that sensor in“Settings”panel.Then we should run a scan when the car is having working temperature and it is running on idle conditions..6.Camshaft sensors configuration–camshaft sensors should be connected only whennecessary (eg. when while shifting only the pulses from the crankshaft sensor, there is a check-engine associated with the camshaft sensor). The process of configuration is the same as in the case the crankshaft sensor configuration.7.Configuration of conditions of shifting the sensors pulses-In "Enabling configuration"panel we have to select the desired scopes of the TPS position, rotary speed, and select the “Shifting mode” to “automatic”. Mode “Always”which is permanently forcing TAP to shitf the signal pulses should be used onlyfor diagnostic purposes.8.Setting the map – We can leave default maps of sensor signal shifting or we can modify itaccording our requirements depending on the rotary speed, and the correction of the position of the TPS and MAP (load).。
Intelis TM Gas Meter说明书

Intelis TMGas MeterGiven advances in solid state metering and the integration of RF (radio frequency), Itron is pleased to offer the Intelis Gas Meter, an exceptionally compact and feature-rich ultrasonic solid-state residential gas meter with integrated radio frequency communications, temperature sensing, and internal safety shutoff valve.Transforming Gas MeteringKey Features »Compact size»Integrated safety shutoff valve with a precision seal that exceeds ASME B16.33 gas tightness guidelines »High flow alarm »Air detection alarm »High temperature alarm »Embedded RF communications »+/- 0.5% accuracy at room temperature »UL Class I, Division 1»Retrievable TC and NTC volume »Whisper quiet operation »Measurement Canada approved: AG-0642At only 4 ½ pounds , the Intelis Gas Meter is the lightest residential gas meter available in the North American market. Intelis has 6” center-to-center hub connections so field retrofits are easily accomplished. Intelis builds on Itron’s latest RF communications module, enabling the option for mobile mode or network mode, allowing flexible and migratable operation in AMR or AMI environments. In addition, Intelis isequipped with an internal safety shutoff valve on the outlet of every meter. Intelis delivers distributed intelligence to gasmetering by providing the ability toself-monitor and shut off the flow of gas during a high flow incident, independent of operator involvement or the RF reading topology, similar to the function of an excess flow valve. Leveraging Intelis as part of a smart gas communication platform enables utilities to automatically make intelligent decisions across the gasdistribution network, delivering opportunities for operational savings and enhanced customer and employee safety by potentially preventing an explosion.Ultrasonic single path with two transducersA Look Inside IntelisL = length of path between transducers Tup = time from transducer upstream to downstreamTdn = time from transducerdownstream to upstreamC = speed of soundV = velocityVolume = Velocity * cross sectional area of themeasurement channel * timeULTRASONIC MEASUREMENT PRINCIPLEUltrasonic meters are state of the art technology and have been around for many decades, dating back to their introduction in the 1960’s and commercial applications in the 1970’s in Japan. Technology advancements have made them more affordable for the residential market. Europe and Asia are currently leading residential solid state installations. Time of flight single path measurement method utilizes two transducers, one is upstream and one downstream of the gas flow. One transducer will emit an ultrasonic signal and the other will sense it, then the process will reverse. The difference in time for the ultrasonic signals to travel upstream versus downstream and the length between them is used to determine the velocity. Velocity multiplied by the cross sectional area of the measurement channel and time provide the volume. With gas flowing through the meter, the signal takes ashorter time to travel in the direction of gas flow and longer against it. At no flow conditions, the transit time is the same in the upstream and downstream directions. INTELIS GAS METER FEATURES A safety feature with a high flow alarm and an integrated valve that acts similar to an excess flow valve is standard in every Intelis meter. With an internal high flow alarm that is configurable by the utility, a threshold can be set in the meterindicative of an open fuel line downstreamof the meter. This high flow eventautomatically triggers the shutoff valve to close, potentially preventing an explosion and property damage or even loss of life. This safety feature is a key demonstration of intelligence at the meter and will work in both mobile and network mode. It is mandatory to be on-site at the meter to re-open the valve to ensure safe conditions. An air detection alarm can be triggered notifying the utility that air was detected in the meter. This can be used for potential tampering information, for example if the meter was removed from installation. Reverse flow detection function will determine if gas is flowing from the outlet to inlet instead of in the standard operating direction. An alarm will be logged and this can be used for potential tampering information.Upstream TransducerV FlowL TupααL TdnDownstream TransducerDust TrapL2 * (cos α)Tdn - TupTup * Tdn*V =*L 2Tup * TdnTup + TdnC =L C+cos α * VTup =L C-cos α * VTdn =Intelis Gas Meter is an impressive 70% size reduction of the traditional diaphragm meter.Blue = accuracy (+19F/-7.2C to +131F/55C)Green = accuracy at room temperature (68F/20C +/- 9F/5C)Yellow= accuracy (-30F/-34.4C to +18F/-7.8C)The accuracy of Intelis is Class 1. Specifically this is +/- 1% from 20 CFH to 300 CFH from +19F/-7.2C to +131F/55C. In addition, it will achieve +/- 0.5% at room temperature. Note: Graph is not to scale.The accelerated life test of Intelis is stable and the open (250 CFH) and check (50 CFH) track tightly.% Error vs Flow RateAccelerated Life Test +10%+2%+1%+0.5%-0.5%-1%-2%-3%-10%0.25 5 2050250300400Error (%)Flow rate (SCFH)A high temperature alarm can beutilized to notify of a potential fire or other dangerous conditions and optionally the valve can be programmed to close upon high temperature detection.The Intelis Gas meter offers the most flexibility in RF reading options of any Itron gas module. It is designed to be read by legacy ChoiceConnect TM handheld and mobile readers and also under Itron’s OpenWay ® Riva TM and Gen TM 5 Industrial Internet of Things (IIoT) networks. With new features for IoT operation like firmware download, sub hourly interval data and extended data storage, the integrated RF communications offers additional value while continuing to offer the highest in reliability, accuracy, battery life, security standards and intrinsic safety that you have come to expect from the industry leader in gas modules.This smart meter features on-board self-diagnostics including monitoring of transducer failure, remaining battery capacity and gas temperature. Itron continues its long-standing tradition of superb battery life performance. The entire meter package has a 20-year battery life including the meter, RF communications and valve when using recommended parameters.DIMENSIONSACBDEFGIntelis includes a secondary retrievable index read. An NTC meter has the ability to retrieve through AMR/AMI the TC volume and vice versa, to aid utilities in analysis purposes.The accuracy of Intelis is designed to meet applicable requirements in ANSI B109.1 as well as ANSI B109.0 draft and Measurement Canada PS-G-06 Class 1. In addition, Intelis will achieve +/- 0.5% at room temperature from 20-300 SCFH. There are no moving parts for ultrasonic measurement, therefore it is highly unlikely to lock-up due tocontamination or freezeups within the gas stream. The meter is less likely to drift over time.SPECIFICATIONSPACKAGING CONFIGURATION Related DocumentsIntelis TM Gas Meter Technical Reference Guide (815-0119-00) Intelis TM Gas Meter Proving and Setup Guide (815-0154-00) Intelis TM Gas Meter Ordering Guide (815-0335-00)Field Deployment Manager (FDM) Mobile Application Guide* Electro-optical characteristic and optical performance is affected during high temperature operation (approximately 176°F/80°C to185°F/85°C) and low temperature operation (approximately -22°F/-30°C to -40°F/-40°C). Performance recovers under normal temperature range. ** Refer to GSR5.0 Compatibility Matrix for OpenWay Riva Network Software Required: INF-7220-000Component Materials UMU (ultrasonic measuring unit) PBT + PC(Polybutylene terephthalate + Polycarbonate)Valve Plastics PBT (Polybutylene terephthalate)Inlet & Outlet TubesPOM (Polyoxymethylene)OpenWay ® Riva TM 500G ERT ® Module specification sheet (101510SP)OpenWay ® Riva TM 550G ERT ® Module specification sheet (101742SP) OpenWay ® Riva TM Next Generation IoT Solution (101493MP)General Specifications Meter Capacity 250 CFH at 1/2” WC / 7.1 m 3/**********Measurement Principle Ultrasonic time of flightAccuracy Class 1 and +/- 0.5% at room temperature Meter TypeTemperature compensated (TC) or non-temperature compensated (NTC)Hub Center-to-Center 6” (152.4mm)Hub Size Options10LT, 20LT, 30LT, 1A, 1 1/4”, ISO G 1 1/4”, 1” BS746Meter MAOP 5 PSIG (35 kPa)ValveActuated swing valve, maximum 0.035 CFH (1 L/H) leakage rate LCD Displayed Units CCF (100 x cubic feet) or cubic meter LCD Resolution 00000.001 CCF (0.1 CF) or 00000.001 m 3Case Aluminum case with ASA 49 gray powder coat finish Weight 4.5 lbs (2.0 kg)Gas TypeNatural Gas Type H, E, L (per EN 437)Reference gasesG20, G21, G23, G25, G26, G27Battery Information 4 Lithium Manganese Dioxide (LiMnO2) ‘A’ cell batteries, replaceableBattery Life 20 years for meter, RF and valve using recommended parametersBadgingStandard aluminum manufacturing and optional customer badgeTest Pulse Weight (volume per pulse)0.10CF, 0.25CF, 0.50CF, 1.0CF, 10dm 3, 50dm 3StandardsDesigned in compliance with ANSI B109.1 and ANSI B109.0 (draft).Meets Measurement Canada PS-G-06, approval AG-0642.Intrinsically Safe per UL 913Highest rating of UL Class I, Division 1Operating Temperature Ratings Measurement -30°F (-34°C) to +131°F (55°C)Valve-13°F (-25°C) to +131°F (55°C)RF Communications -40°F (-40°C) to +158°F (70°C)LCD-40°F (-40°C) to +185°F (85°C)*Storage Temperature Rating Measurement/Valve/RF -40F° (-40°C) to +158F° (70°C)SoftwareMinimum Software Required for Mobile and Riva** NetworkField Collection System (FCS) 4.2.4Field Deployment Manager (FDM) Tools 4.2 (4.3.1 if LSCD)Itron Mobile 2.3Itron Security Manager (ISM) 3.6Mobile Collection 3.8.2Minimum SoftwareRequired for Gen5 Network Gen3, 4, 5 CPD hardware running UtilOS ® 5.0FCS 4.3.1 with Itron Mobile 2.5FDM Tools v4.3ISM 4.2UtilityIQ ® 4.15。
MSI-TRM型号技术数据手册说明书

Technical dataBasic dataSeries MSI-TRMFunctionsFunctions Start/restart interlock (RES)Restart AutomaticManualCharacteristic parametersType 4 ,IEC/EN 61496SIL 3 ,IEC 61508SILCL 3 ,IEC/EN 62061Performance Level (PL)Up to and including e ,EN ISO 13849-1MTTF d100 years ,EN ISO 13849-1PFH D0.00000000215 per hourPFH D 2.15E-09 per hourMission time T M20 years ,EN ISO 13849-1Category 4 ,EN ISO 13849Electrical dataProtective circuit Polarity reversal protectionShort circuit protected Performance dataSupply voltage U B24 V ,DC ,-20 ... 20 %Current consumption, max.200 mAPower consumption, max. 3 WResidual ripple0 ... 15 %Fuse External with max. 3 AInputsNumber of safety-related switching inputs 2 Piece(s)Number of digital switching inputs 2 Piece(s)Switching inputsType Digital switching inputSwitching voltage high, min.18.2 VSwitching voltage low, max. 2.5 VSwitching voltage, typ.23 VVoltage type DCDigital switching input 1Function Control input for start/restart interlock (RES) Digital switching input 2Function Control input for start/restart interlock (RES) Safety-related switching inputsType Safety switching inputVoltage type DCSwitching voltage high, min.18.2 VSwitching voltage low, max. 2.5 VSwitching voltage, typ.23 VOutputsNumber of safety-related switching outputs (OSSDs) 2 Piece(s)Number of digital switching outputs 3 Piece(s)Safety-related switching outputsType Safety-related switching output OSSD Voltage type AC/DCSafety-related switching output 1Switching element Relay ,NOSafety-related switching output 2Switching element Relay ,NOSwitching outputsType Digital switching outputSwitching voltage high, min.18.2 VSwitching voltage low, max. 2.5 VSwitching voltage, typ.23 VVoltage type DCSwitching output 1Switching element Transistor ,PNPFunction Switching outputSwitching output 2Switching element Transistor ,PNPFunction Switching outputSwitching output 3Switching element Transistor ,PNPFunction"Error" signal outputTimingResponse time30 msSensor response time on test request0.5 ... 8.5 msConnectionNumber of connections 1 Piece(s)Connection 1Type of connection TerminalFunction Connection to receiverConnection to transmitterVoltage supply Type of terminal Screw terminalNo. of pins16 -pinCable propertiesConnection cross sections0.2 to 1.5 mm²Mechanical dataDimension (W x H x L)22.5 mm x99 mm x114.1 mm Housing material Plastic ,Unreinforced polyamide PANet weight155 gHousing color GrayType of fastening Snap-on mountingOperation and displayType of display LEDNumber of LEDs 6 Piece(s)Environmental dataAmbient temperature, operation-25 ... 55 °C Ambient temperature, storage-25 ... 75 °C Relative humidity (non-condensing)0 ... 75 %CertificationsDegree of protection IP 20 (housing)IP 20 (terminals) Protection class III Certifications c UL USClassificationCustoms tariff number85371098*********27371819*********27371819 ETIM 5.0EC001449 ETIM 6.0EC001449Dimensioned drawingsAll dimensions in millimetersElectrical connectionConnection 1Type of connection TerminalFunction Connection to receiverConnection to transmitterVoltage supplyType of terminal Screw terminalNo. of pins16 -pinTerminal AssignmentS11OUT 1S12IN1S21OUT 2S22IN1S31ERRORS32n.c.Terminal AssignmentS33RES/StartS34RES/StartA1+24VS35WAS36WAA2GND13OSSD114OSSD123OSSD224OSSD2NotesObserve intended use!•The product may only be put into operation by competent persons.•Only use the product in accordance with its intended use.。
GS91002

GS91002IntroductionThe GS91002 is a state-of-the-art device that offers exceptional performance and reliability in the field of technology. This document provides an in-depth overview of the GS91002, highlighting its key features and benefits for users.Key Features1. High-speed ProcessingThe GS91002 is equipped with a powerful processor that ensures high-speed data processing and seamless multitasking. This feature is especially crucial for users who require quick response times and efficient handling of complex tasks.2. Advanced Connectivity OptionsWith a wide range of connectivity options, the GS91002 allows users to stay connected and productive. It supports various networks, including Wi-Fi, Bluetooth, and cellular data, enabling effortless communication and data transfer between devices.3. Enhanced SecuritySecurity is a top priority for the GS91002. It incorporates robust security measures, such as encrypted connections andbiometric authentication, to safeguard sensitive data and protect against unauthorized access. This ensures peace of mind for users, even in the most demanding environments.4. Large Storage CapacityThe GS91002 offers ample storage space, allowing users to store and access a vast amount of data on their device. Whether it’s documents, photos, videos, or applications, the GS91002 ensures that users have enough storage to meet their needs, eliminating the worry of running out of space.5. High-Resolution DisplayThe device boasts a high-resolution display that delivers immersive visuals and crisp, vibrant colors. Whether watching movies, gaming, or working on graphic-intensive tasks, users can enjoy a stunning visual experience on the GS91002.6. Long Battery LifeThe GS91002 comes with a long-lasting battery that ensures uninterrupted usage throughout the day. Whether attending meetings, travelling, or working remotely, users can rely on the device for an extended period without the need for frequent charging.7. Intuitive User InterfaceThe GS91002 features an intuitive user interface, designed to enhance user experience and simplify navigation. With user-friendly icons and a logical layout, users can easily access thedevice’s features and settings, making it an ideal choice for both beginners and advanced users.Benefits1. Increased EfficiencyThe high-speed processing capabilities of the GS91002 enable users to complete tasks quickly and efficiently. Whether it’s running complex software applications or performing multiple tasks simultaneously, users can rely on the device to streamline their workflow and maximize productivity.2. Seamless ConnectivityThe advanced connectivity options offered by the GS91002 enable seamless communication and collaboration. Users can effortlessly connect to other devices, share files, and access cloud-based platforms, ensuring a smooth and integrated work environment.3. Enhanced Security MeasuresThe GS91002’s robust security features provide users with peace of mind, protecting their valuable data from potential threats. By implementing encrypted connections and biometric authentication, users can be confident that their information remains secure at all times.4. Ample Storage SpaceThe large storage capacity of the GS91002 ensures that users have ample space to store and access their files and applications. This eliminates the need to constantly free up space or invest in additional storage solutions, allowing users to focus on their work without interruptions.5. Immersive Visual ExperienceThe high-resolution display of the GS91002 enhances the visual experience for users, whether for entertainment or work purposes. The vibrant colors and sharp images make media consumption, image editing, and graphic-intensive tasks more enjoyable and visually stunning.6. Extended Usage TimeThe long battery life of the GS91002 provides users with uninterrupted usage throughout their day. Whether it’s attending back-to-back meetings, traveling, or working remotely, users can rely on the device without worrying about running out of power.7. User-Friendly InterfaceThe intuitive user interface of the GS91002 simplifies navigation and makes it easy for users to access features and settings. This ensures a smooth and enjoyable user experience, particularly for those new to the device or less tech-savvy.ConclusionThe GS91002 is a versatile and reliable device that offers exceptional performance and a range of features that cater to the needs of modern users. From high-speed processing and advanced connectivity options to enhanced security measures and an immersive visual experience, the GS91002 delivers on its promise of efficiency, convenience, and durability. Whether for work or personal use, this device is an excellent choice for individuals seeking a powerful and user-friendly technology solution.。
Edwards DUOTRONIC 5520系列信号器说明书

DescriptionEdwards' DUOTRONIC signals are heavy duty, high deci-bel, UL listed signaling appliances intended for use in gen-eral signaling and alarm applications. The 5520 series of signals can operate either as a horn or a siren and provide a switch for selecting the desired operating mode. The 5521-S1 signal operates as a horn only. The horn and si-ren tones are produced electronically. Signals operating in the horn mode can be used in coded signaling applica-tions.The 5520 series of signals can be installed on any standard single gang, 3 1/4" (83 mm), 3 1/2" (89 mm), or 4" (102mm) octagonal, or 4" (102 mm) square electrical box, or they can be installed outdoors using the Cat. No. 349Weatherproof Box (ordered separately). Also, the Cat. Nos.5520-AS and 5520-AQ signals can be direct wall mounted.The Cat. No. 5521-S1 signal can be installed indoors or outdoors and is supplied with a Cat. No. 349-R Weather-proof Box. The box must be used when installing the Cat.No. 5521-S1 signal indoors as well as outdoors because it contains a dropping resistor that is required for operation of the signal.Electrical SpecificationsMechanical SpecificationsDimensions ...........................................See Figure 1Weight ....................................7 1/2 Pounds (3.4 kg)InstallationInstall in accordance with the latest edition of the Na-tional Electrical Code and/or lother applicable codes andstandards.For Catalog Series 5520, install as follows:Installation Instructions for Duotronic SignalsCatalog Series 5520 and 5521P/N P-047550-0437 ISSUE 2 © 2002CHESHIRE, CT 203-699-3300 FAX 203-699-3365 (CUST. SERV .) 203-699-3078 (TECH SERV .)1.Loosen the screw at the bottom of the signal housingand remove the mounting plate from the signal (Figure 2).2.Select the desired operating mode by sliding the handleof the horn/siren switch, located in the rear of the signal housing, to the applicable selection.NOTE: For Cat. No. 5520-R5 signal, proceed to step 3.For all other 5520 Series models, proceed directly to step 4.3.Mount the Cat. No. 598Y transformer on an electricalbox. Connect 240V AC power source wires to wire leads from primary side of transformer using wire nuts (not supplied) (Figure 4). Connect wires to be run to signal to 24V terminals on secondary side of transformer (Figure 4).4.Install wires from power source, or for Cat. No. 5520-R5 signal, install 24V power source wires from Cat.No. 598Y transformer. Install signal mounting plate using one of the following procedures:NOTE:"TOP" on mounting plate and on inside of Cat.No. 349 Weatherproof Box indicates required position for installation.a.Direct wall mounting--Cat. Nos. 5520-AS and 5520-AQ only:Bring power source wires through hole in wall and through center hole in mounting plate.Fasten mounting plate to wall by installing the three #8 x 1 1/4" (32 mm) wood screws, supplied with the signal, through the appropriate holes in mounting plate as shown in Figure 3.b.Mounting to electrical box:Bring wires installed in step 4 through center holeof mounting plate.Align appropriate holes in mounting plate withmounting screw holes in electrical box. Fastenplate to single gang box using the two #6-32 x 5/8" (16 mm) screws supplied with the signal, orfasten to octagon or square box using screwssupplied with the box.c.Weatherproof installation:Fasten the Cat. No. 349 Weatherproof Box to themounting surface by installing the three#8 x 1 1/4" (32 mm) wood screws and three fiberwashers, supplied with the box, through themounting holes in the rear of the box.Bring wires installed in step 4 through 3/4" (19mm)-14 NPT conduit and through conduit entrancehole into box. Secure conduit to box.Align appropriate holes in mounting plate withmounting screw holes in bosses of box and fastenplate to box using the four #8-32 x 7/16" (11 mm)machine screws supplied with the box.5.Connect wires from power source or transformer tothe terminals of the plug receptacle on the mounting plate as shown in Figure 3.6.Hook signal on mounting plate by engaging hangeron plate into slot in top of signal housing (Figure 3).Press signal flush to mounting plate to mate plug in rear of signal housing with plug receptacle on mounting plate. Tighten screw, loosened in step 1, to secure signal to plate.For Cat. No. 5521-S1, install as follows:1.Loosen the screw at the bottom of the signal housingand remove the mounting plate from the signal (Figure2).2.Fasten the Cat. No. 349-R Weatherproof Box to themounting surface by installing the three #8 x 1 1/4"(32 mm) wood screws and three fiber washers, suppliedwith the box, through the mounting holes in the rear of the box.3.Bring 250V DC power source wires through 3/4" (19mm)-14 NPT conduit and through conduit entrance hole into box. Secure conduit to box.4.Place resistor bracket assembly P-039964-0424 in boxwith resistor facing rear of box as shown in Figure 5.Connect the 250V power source wires to the terminals on the assembly (Figure 4).5.Bring the two wire leads from the resistor bracketassembly through the center hole in the mounting plate. Align holes in bracket with mounting screw holes in lower bosses of box when upper conduit entrance hole is used (Figure 5). When bottom conduit entrance hole is used, bracket must be aligned with screw holes in upper bosses in box.6.Align appropriate holes in mounting plate withmounting screw holes in bosses of box, and fasten plate and resistor bracket assembly to box using the four #8-32 x 7/16" (11 mm) machine screws supplied with box.7.Connect wire leads from resistor bracket assembly tothe terminals of the plug receptacle on the mounting plate (Figure 3).8.Hook signal on mounting plate by engaging hangeron plate into slot in top of signal housing. Press signal flush to mounting plate to mate plug in rear of signal housing with plug receptacle on mounting plate.Tighten screw loosened in step 1 to secure signal to plate.Adjusting Speaker DirectionTo adjust the speaker direction, loosen the nut shown in Figure 2. Rotate the speaker to the desired position and tighten the nut. The speaker position can be adjusted within a 90° range vertically and 180° range horizontally.Operational TestApply power to the signal and verify that it sounds. For models with horn/siren mode selection, verify that selected type of signal is sounding.Maintenance and Subsequent TestingExamine the signal annually for accumulation of dirt. Clean if necessary.Test the signal semi-annually or at the intervals requiredby applicable regulations and codes.Speaker Directional AdjustmentP/N P-047550-0437 ISSUE 2Figure 4. Wiring InstallationFigure 5. Resistor Bracket Assembly InstallationP/N P-047550-0437 ISSUE 2。
3GPP TS 36.331 V13.2.0 (2016-06)

3GPP TS 36.331 V13.2.0 (2016-06)Technical Specification3rd Generation Partnership Project;Technical Specification Group Radio Access Network;Evolved Universal Terrestrial Radio Access (E-UTRA);Radio Resource Control (RRC);Protocol specification(Release 13)The present document has been developed within the 3rd Generation Partnership Project (3GPP TM) and may be further elaborated for the purposes of 3GPP. The present document has not been subject to any approval process by the 3GPP Organizational Partners and shall not be implemented.This Specification is provided for future development work within 3GPP only. The Organizational Partners accept no liability for any use of this Specification. Specifications and reports for implementation of the 3GPP TM system should be obtained via the 3GPP Organizational Partners' Publications Offices.KeywordsUMTS, radio3GPPPostal address3GPP support office address650 Route des Lucioles - Sophia AntipolisValbonne - FRANCETel.: +33 4 92 94 42 00 Fax: +33 4 93 65 47 16InternetCopyright NotificationNo part may be reproduced except as authorized by written permission.The copyright and the foregoing restriction extend to reproduction in all media.© 2016, 3GPP Organizational Partners (ARIB, ATIS, CCSA, ETSI, TSDSI, TTA, TTC).All rights reserved.UMTS™ is a Trade Mark of ETSI registered for the benefit of its members3GPP™ is a Trade Mark of ETSI registered for the benefit of its Members and of the 3GPP Organizational PartnersLTE™ is a Trade Mark of ETSI currently being registered for the benefit of its Members and of the 3GPP Organizational Partners GSM® and the GSM logo are registered and owned by the GSM AssociationBluetooth® is a Trade Mark of the Bluetooth SIG registered for the benefit of its membersContentsForeword (18)1Scope (19)2References (19)3Definitions, symbols and abbreviations (22)3.1Definitions (22)3.2Abbreviations (24)4General (27)4.1Introduction (27)4.2Architecture (28)4.2.1UE states and state transitions including inter RAT (28)4.2.2Signalling radio bearers (29)4.3Services (30)4.3.1Services provided to upper layers (30)4.3.2Services expected from lower layers (30)4.4Functions (30)5Procedures (32)5.1General (32)5.1.1Introduction (32)5.1.2General requirements (32)5.2System information (33)5.2.1Introduction (33)5.2.1.1General (33)5.2.1.2Scheduling (34)5.2.1.2a Scheduling for NB-IoT (34)5.2.1.3System information validity and notification of changes (35)5.2.1.4Indication of ETWS notification (36)5.2.1.5Indication of CMAS notification (37)5.2.1.6Notification of EAB parameters change (37)5.2.1.7Access Barring parameters change in NB-IoT (37)5.2.2System information acquisition (38)5.2.2.1General (38)5.2.2.2Initiation (38)5.2.2.3System information required by the UE (38)5.2.2.4System information acquisition by the UE (39)5.2.2.5Essential system information missing (42)5.2.2.6Actions upon reception of the MasterInformationBlock message (42)5.2.2.7Actions upon reception of the SystemInformationBlockType1 message (42)5.2.2.8Actions upon reception of SystemInformation messages (44)5.2.2.9Actions upon reception of SystemInformationBlockType2 (44)5.2.2.10Actions upon reception of SystemInformationBlockType3 (45)5.2.2.11Actions upon reception of SystemInformationBlockType4 (45)5.2.2.12Actions upon reception of SystemInformationBlockType5 (45)5.2.2.13Actions upon reception of SystemInformationBlockType6 (45)5.2.2.14Actions upon reception of SystemInformationBlockType7 (45)5.2.2.15Actions upon reception of SystemInformationBlockType8 (45)5.2.2.16Actions upon reception of SystemInformationBlockType9 (46)5.2.2.17Actions upon reception of SystemInformationBlockType10 (46)5.2.2.18Actions upon reception of SystemInformationBlockType11 (46)5.2.2.19Actions upon reception of SystemInformationBlockType12 (47)5.2.2.20Actions upon reception of SystemInformationBlockType13 (48)5.2.2.21Actions upon reception of SystemInformationBlockType14 (48)5.2.2.22Actions upon reception of SystemInformationBlockType15 (48)5.2.2.23Actions upon reception of SystemInformationBlockType16 (48)5.2.2.24Actions upon reception of SystemInformationBlockType17 (48)5.2.2.25Actions upon reception of SystemInformationBlockType18 (48)5.2.2.26Actions upon reception of SystemInformationBlockType19 (49)5.2.3Acquisition of an SI message (49)5.2.3a Acquisition of an SI message by BL UE or UE in CE or a NB-IoT UE (50)5.3Connection control (50)5.3.1Introduction (50)5.3.1.1RRC connection control (50)5.3.1.2Security (52)5.3.1.2a RN security (53)5.3.1.3Connected mode mobility (53)5.3.1.4Connection control in NB-IoT (54)5.3.2Paging (55)5.3.2.1General (55)5.3.2.2Initiation (55)5.3.2.3Reception of the Paging message by the UE (55)5.3.3RRC connection establishment (56)5.3.3.1General (56)5.3.3.1a Conditions for establishing RRC Connection for sidelink communication/ discovery (58)5.3.3.2Initiation (59)5.3.3.3Actions related to transmission of RRCConnectionRequest message (63)5.3.3.3a Actions related to transmission of RRCConnectionResumeRequest message (64)5.3.3.4Reception of the RRCConnectionSetup by the UE (64)5.3.3.4a Reception of the RRCConnectionResume by the UE (66)5.3.3.5Cell re-selection while T300, T302, T303, T305, T306, or T308 is running (68)5.3.3.6T300 expiry (68)5.3.3.7T302, T303, T305, T306, or T308 expiry or stop (69)5.3.3.8Reception of the RRCConnectionReject by the UE (70)5.3.3.9Abortion of RRC connection establishment (71)5.3.3.10Handling of SSAC related parameters (71)5.3.3.11Access barring check (72)5.3.3.12EAB check (73)5.3.3.13Access barring check for ACDC (73)5.3.3.14Access Barring check for NB-IoT (74)5.3.4Initial security activation (75)5.3.4.1General (75)5.3.4.2Initiation (76)5.3.4.3Reception of the SecurityModeCommand by the UE (76)5.3.5RRC connection reconfiguration (77)5.3.5.1General (77)5.3.5.2Initiation (77)5.3.5.3Reception of an RRCConnectionReconfiguration not including the mobilityControlInfo by theUE (77)5.3.5.4Reception of an RRCConnectionReconfiguration including the mobilityControlInfo by the UE(handover) (79)5.3.5.5Reconfiguration failure (83)5.3.5.6T304 expiry (handover failure) (83)5.3.5.7Void (84)5.3.5.7a T307 expiry (SCG change failure) (84)5.3.5.8Radio Configuration involving full configuration option (84)5.3.6Counter check (86)5.3.6.1General (86)5.3.6.2Initiation (86)5.3.6.3Reception of the CounterCheck message by the UE (86)5.3.7RRC connection re-establishment (87)5.3.7.1General (87)5.3.7.2Initiation (87)5.3.7.3Actions following cell selection while T311 is running (88)5.3.7.4Actions related to transmission of RRCConnectionReestablishmentRequest message (89)5.3.7.5Reception of the RRCConnectionReestablishment by the UE (89)5.3.7.6T311 expiry (91)5.3.7.7T301 expiry or selected cell no longer suitable (91)5.3.7.8Reception of RRCConnectionReestablishmentReject by the UE (91)5.3.8RRC connection release (92)5.3.8.1General (92)5.3.8.2Initiation (92)5.3.8.3Reception of the RRCConnectionRelease by the UE (92)5.3.8.4T320 expiry (93)5.3.9RRC connection release requested by upper layers (93)5.3.9.1General (93)5.3.9.2Initiation (93)5.3.10Radio resource configuration (93)5.3.10.0General (93)5.3.10.1SRB addition/ modification (94)5.3.10.2DRB release (95)5.3.10.3DRB addition/ modification (95)5.3.10.3a1DC specific DRB addition or reconfiguration (96)5.3.10.3a2LWA specific DRB addition or reconfiguration (98)5.3.10.3a3LWIP specific DRB addition or reconfiguration (98)5.3.10.3a SCell release (99)5.3.10.3b SCell addition/ modification (99)5.3.10.3c PSCell addition or modification (99)5.3.10.4MAC main reconfiguration (99)5.3.10.5Semi-persistent scheduling reconfiguration (100)5.3.10.6Physical channel reconfiguration (100)5.3.10.7Radio Link Failure Timers and Constants reconfiguration (101)5.3.10.8Time domain measurement resource restriction for serving cell (101)5.3.10.9Other configuration (102)5.3.10.10SCG reconfiguration (103)5.3.10.11SCG dedicated resource configuration (104)5.3.10.12Reconfiguration SCG or split DRB by drb-ToAddModList (105)5.3.10.13Neighbour cell information reconfiguration (105)5.3.10.14Void (105)5.3.10.15Sidelink dedicated configuration (105)5.3.10.16T370 expiry (106)5.3.11Radio link failure related actions (107)5.3.11.1Detection of physical layer problems in RRC_CONNECTED (107)5.3.11.2Recovery of physical layer problems (107)5.3.11.3Detection of radio link failure (107)5.3.12UE actions upon leaving RRC_CONNECTED (109)5.3.13UE actions upon PUCCH/ SRS release request (110)5.3.14Proximity indication (110)5.3.14.1General (110)5.3.14.2Initiation (111)5.3.14.3Actions related to transmission of ProximityIndication message (111)5.3.15Void (111)5.4Inter-RAT mobility (111)5.4.1Introduction (111)5.4.2Handover to E-UTRA (112)5.4.2.1General (112)5.4.2.2Initiation (112)5.4.2.3Reception of the RRCConnectionReconfiguration by the UE (112)5.4.2.4Reconfiguration failure (114)5.4.2.5T304 expiry (handover to E-UTRA failure) (114)5.4.3Mobility from E-UTRA (114)5.4.3.1General (114)5.4.3.2Initiation (115)5.4.3.3Reception of the MobilityFromEUTRACommand by the UE (115)5.4.3.4Successful completion of the mobility from E-UTRA (116)5.4.3.5Mobility from E-UTRA failure (117)5.4.4Handover from E-UTRA preparation request (CDMA2000) (117)5.4.4.1General (117)5.4.4.2Initiation (118)5.4.4.3Reception of the HandoverFromEUTRAPreparationRequest by the UE (118)5.4.5UL handover preparation transfer (CDMA2000) (118)5.4.5.1General (118)5.4.5.2Initiation (118)5.4.5.3Actions related to transmission of the ULHandoverPreparationTransfer message (119)5.4.5.4Failure to deliver the ULHandoverPreparationTransfer message (119)5.4.6Inter-RAT cell change order to E-UTRAN (119)5.4.6.1General (119)5.4.6.2Initiation (119)5.4.6.3UE fails to complete an inter-RAT cell change order (119)5.5Measurements (120)5.5.1Introduction (120)5.5.2Measurement configuration (121)5.5.2.1General (121)5.5.2.2Measurement identity removal (122)5.5.2.2a Measurement identity autonomous removal (122)5.5.2.3Measurement identity addition/ modification (123)5.5.2.4Measurement object removal (124)5.5.2.5Measurement object addition/ modification (124)5.5.2.6Reporting configuration removal (126)5.5.2.7Reporting configuration addition/ modification (127)5.5.2.8Quantity configuration (127)5.5.2.9Measurement gap configuration (127)5.5.2.10Discovery signals measurement timing configuration (128)5.5.2.11RSSI measurement timing configuration (128)5.5.3Performing measurements (128)5.5.3.1General (128)5.5.3.2Layer 3 filtering (131)5.5.4Measurement report triggering (131)5.5.4.1General (131)5.5.4.2Event A1 (Serving becomes better than threshold) (135)5.5.4.3Event A2 (Serving becomes worse than threshold) (136)5.5.4.4Event A3 (Neighbour becomes offset better than PCell/ PSCell) (136)5.5.4.5Event A4 (Neighbour becomes better than threshold) (137)5.5.4.6Event A5 (PCell/ PSCell becomes worse than threshold1 and neighbour becomes better thanthreshold2) (138)5.5.4.6a Event A6 (Neighbour becomes offset better than SCell) (139)5.5.4.7Event B1 (Inter RAT neighbour becomes better than threshold) (139)5.5.4.8Event B2 (PCell becomes worse than threshold1 and inter RAT neighbour becomes better thanthreshold2) (140)5.5.4.9Event C1 (CSI-RS resource becomes better than threshold) (141)5.5.4.10Event C2 (CSI-RS resource becomes offset better than reference CSI-RS resource) (141)5.5.4.11Event W1 (WLAN becomes better than a threshold) (142)5.5.4.12Event W2 (All WLAN inside WLAN mobility set becomes worse than threshold1 and a WLANoutside WLAN mobility set becomes better than threshold2) (142)5.5.4.13Event W3 (All WLAN inside WLAN mobility set becomes worse than a threshold) (143)5.5.5Measurement reporting (144)5.5.6Measurement related actions (148)5.5.6.1Actions upon handover and re-establishment (148)5.5.6.2Speed dependant scaling of measurement related parameters (149)5.5.7Inter-frequency RSTD measurement indication (149)5.5.7.1General (149)5.5.7.2Initiation (150)5.5.7.3Actions related to transmission of InterFreqRSTDMeasurementIndication message (150)5.6Other (150)5.6.0General (150)5.6.1DL information transfer (151)5.6.1.1General (151)5.6.1.2Initiation (151)5.6.1.3Reception of the DLInformationTransfer by the UE (151)5.6.2UL information transfer (151)5.6.2.1General (151)5.6.2.2Initiation (151)5.6.2.3Actions related to transmission of ULInformationTransfer message (152)5.6.2.4Failure to deliver ULInformationTransfer message (152)5.6.3UE capability transfer (152)5.6.3.1General (152)5.6.3.2Initiation (153)5.6.3.3Reception of the UECapabilityEnquiry by the UE (153)5.6.4CSFB to 1x Parameter transfer (157)5.6.4.1General (157)5.6.4.2Initiation (157)5.6.4.3Actions related to transmission of CSFBParametersRequestCDMA2000 message (157)5.6.4.4Reception of the CSFBParametersResponseCDMA2000 message (157)5.6.5UE Information (158)5.6.5.1General (158)5.6.5.2Initiation (158)5.6.5.3Reception of the UEInformationRequest message (158)5.6.6 Logged Measurement Configuration (159)5.6.6.1General (159)5.6.6.2Initiation (160)5.6.6.3Reception of the LoggedMeasurementConfiguration by the UE (160)5.6.6.4T330 expiry (160)5.6.7 Release of Logged Measurement Configuration (160)5.6.7.1General (160)5.6.7.2Initiation (160)5.6.8 Measurements logging (161)5.6.8.1General (161)5.6.8.2Initiation (161)5.6.9In-device coexistence indication (163)5.6.9.1General (163)5.6.9.2Initiation (164)5.6.9.3Actions related to transmission of InDeviceCoexIndication message (164)5.6.10UE Assistance Information (165)5.6.10.1General (165)5.6.10.2Initiation (166)5.6.10.3Actions related to transmission of UEAssistanceInformation message (166)5.6.11 Mobility history information (166)5.6.11.1General (166)5.6.11.2Initiation (166)5.6.12RAN-assisted WLAN interworking (167)5.6.12.1General (167)5.6.12.2Dedicated WLAN offload configuration (167)5.6.12.3WLAN offload RAN evaluation (167)5.6.12.4T350 expiry or stop (167)5.6.12.5Cell selection/ re-selection while T350 is running (168)5.6.13SCG failure information (168)5.6.13.1General (168)5.6.13.2Initiation (168)5.6.13.3Actions related to transmission of SCGFailureInformation message (168)5.6.14LTE-WLAN Aggregation (169)5.6.14.1Introduction (169)5.6.14.2Reception of LWA configuration (169)5.6.14.3Release of LWA configuration (170)5.6.15WLAN connection management (170)5.6.15.1Introduction (170)5.6.15.2WLAN connection status reporting (170)5.6.15.2.1General (170)5.6.15.2.2Initiation (171)5.6.15.2.3Actions related to transmission of WLANConnectionStatusReport message (171)5.6.15.3T351 Expiry (WLAN connection attempt timeout) (171)5.6.15.4WLAN status monitoring (171)5.6.16RAN controlled LTE-WLAN interworking (172)5.6.16.1General (172)5.6.16.2WLAN traffic steering command (172)5.6.17LTE-WLAN aggregation with IPsec tunnel (173)5.6.17.1General (173)5.7Generic error handling (174)5.7.1General (174)5.7.2ASN.1 violation or encoding error (174)5.7.3Field set to a not comprehended value (174)5.7.4Mandatory field missing (174)5.7.5Not comprehended field (176)5.8MBMS (176)5.8.1Introduction (176)5.8.1.1General (176)5.8.1.2Scheduling (176)5.8.1.3MCCH information validity and notification of changes (176)5.8.2MCCH information acquisition (178)5.8.2.1General (178)5.8.2.2Initiation (178)5.8.2.3MCCH information acquisition by the UE (178)5.8.2.4Actions upon reception of the MBSFNAreaConfiguration message (178)5.8.2.5Actions upon reception of the MBMSCountingRequest message (179)5.8.3MBMS PTM radio bearer configuration (179)5.8.3.1General (179)5.8.3.2Initiation (179)5.8.3.3MRB establishment (179)5.8.3.4MRB release (179)5.8.4MBMS Counting Procedure (179)5.8.4.1General (179)5.8.4.2Initiation (180)5.8.4.3Reception of the MBMSCountingRequest message by the UE (180)5.8.5MBMS interest indication (181)5.8.5.1General (181)5.8.5.2Initiation (181)5.8.5.3Determine MBMS frequencies of interest (182)5.8.5.4Actions related to transmission of MBMSInterestIndication message (183)5.8a SC-PTM (183)5.8a.1Introduction (183)5.8a.1.1General (183)5.8a.1.2SC-MCCH scheduling (183)5.8a.1.3SC-MCCH information validity and notification of changes (183)5.8a.1.4Procedures (184)5.8a.2SC-MCCH information acquisition (184)5.8a.2.1General (184)5.8a.2.2Initiation (184)5.8a.2.3SC-MCCH information acquisition by the UE (184)5.8a.2.4Actions upon reception of the SCPTMConfiguration message (185)5.8a.3SC-PTM radio bearer configuration (185)5.8a.3.1General (185)5.8a.3.2Initiation (185)5.8a.3.3SC-MRB establishment (185)5.8a.3.4SC-MRB release (185)5.9RN procedures (186)5.9.1RN reconfiguration (186)5.9.1.1General (186)5.9.1.2Initiation (186)5.9.1.3Reception of the RNReconfiguration by the RN (186)5.10Sidelink (186)5.10.1Introduction (186)5.10.1a Conditions for sidelink communication operation (187)5.10.2Sidelink UE information (188)5.10.2.1General (188)5.10.2.2Initiation (189)5.10.2.3Actions related to transmission of SidelinkUEInformation message (193)5.10.3Sidelink communication monitoring (195)5.10.6Sidelink discovery announcement (198)5.10.6a Sidelink discovery announcement pool selection (201)5.10.6b Sidelink discovery announcement reference carrier selection (201)5.10.7Sidelink synchronisation information transmission (202)5.10.7.1General (202)5.10.7.2Initiation (203)5.10.7.3Transmission of SLSS (204)5.10.7.4Transmission of MasterInformationBlock-SL message (205)5.10.7.5Void (206)5.10.8Sidelink synchronisation reference (206)5.10.8.1General (206)5.10.8.2Selection and reselection of synchronisation reference UE (SyncRef UE) (206)5.10.9Sidelink common control information (207)5.10.9.1General (207)5.10.9.2Actions related to reception of MasterInformationBlock-SL message (207)5.10.10Sidelink relay UE operation (207)5.10.10.1General (207)5.10.10.2AS-conditions for relay related sidelink communication transmission by sidelink relay UE (207)5.10.10.3AS-conditions for relay PS related sidelink discovery transmission by sidelink relay UE (208)5.10.10.4Sidelink relay UE threshold conditions (208)5.10.11Sidelink remote UE operation (208)5.10.11.1General (208)5.10.11.2AS-conditions for relay related sidelink communication transmission by sidelink remote UE (208)5.10.11.3AS-conditions for relay PS related sidelink discovery transmission by sidelink remote UE (209)5.10.11.4Selection and reselection of sidelink relay UE (209)5.10.11.5Sidelink remote UE threshold conditions (210)6Protocol data units, formats and parameters (tabular & ASN.1) (210)6.1General (210)6.2RRC messages (212)6.2.1General message structure (212)–EUTRA-RRC-Definitions (212)–BCCH-BCH-Message (212)–BCCH-DL-SCH-Message (212)–BCCH-DL-SCH-Message-BR (213)–MCCH-Message (213)–PCCH-Message (213)–DL-CCCH-Message (214)–DL-DCCH-Message (214)–UL-CCCH-Message (214)–UL-DCCH-Message (215)–SC-MCCH-Message (215)6.2.2Message definitions (216)–CounterCheck (216)–CounterCheckResponse (217)–CSFBParametersRequestCDMA2000 (217)–CSFBParametersResponseCDMA2000 (218)–DLInformationTransfer (218)–HandoverFromEUTRAPreparationRequest (CDMA2000) (219)–InDeviceCoexIndication (220)–InterFreqRSTDMeasurementIndication (222)–LoggedMeasurementConfiguration (223)–MasterInformationBlock (225)–MBMSCountingRequest (226)–MBMSCountingResponse (226)–MBMSInterestIndication (227)–MBSFNAreaConfiguration (228)–MeasurementReport (228)–MobilityFromEUTRACommand (229)–Paging (232)–ProximityIndication (233)–RNReconfiguration (234)–RNReconfigurationComplete (234)–RRCConnectionReconfiguration (235)–RRCConnectionReconfigurationComplete (240)–RRCConnectionReestablishment (241)–RRCConnectionReestablishmentComplete (241)–RRCConnectionReestablishmentReject (242)–RRCConnectionReestablishmentRequest (243)–RRCConnectionReject (243)–RRCConnectionRelease (244)–RRCConnectionResume (248)–RRCConnectionResumeComplete (249)–RRCConnectionResumeRequest (250)–RRCConnectionRequest (250)–RRCConnectionSetup (251)–RRCConnectionSetupComplete (252)–SCGFailureInformation (253)–SCPTMConfiguration (254)–SecurityModeCommand (255)–SecurityModeComplete (255)–SecurityModeFailure (256)–SidelinkUEInformation (256)–SystemInformation (258)–SystemInformationBlockType1 (259)–UEAssistanceInformation (264)–UECapabilityEnquiry (265)–UECapabilityInformation (266)–UEInformationRequest (267)–UEInformationResponse (267)–ULHandoverPreparationTransfer (CDMA2000) (273)–ULInformationTransfer (274)–WLANConnectionStatusReport (274)6.3RRC information elements (275)6.3.1System information blocks (275)–SystemInformationBlockType2 (275)–SystemInformationBlockType3 (279)–SystemInformationBlockType4 (282)–SystemInformationBlockType5 (283)–SystemInformationBlockType6 (287)–SystemInformationBlockType7 (289)–SystemInformationBlockType8 (290)–SystemInformationBlockType9 (295)–SystemInformationBlockType10 (295)–SystemInformationBlockType11 (296)–SystemInformationBlockType12 (297)–SystemInformationBlockType13 (297)–SystemInformationBlockType14 (298)–SystemInformationBlockType15 (298)–SystemInformationBlockType16 (299)–SystemInformationBlockType17 (300)–SystemInformationBlockType18 (301)–SystemInformationBlockType19 (301)–SystemInformationBlockType20 (304)6.3.2Radio resource control information elements (304)–AntennaInfo (304)–AntennaInfoUL (306)–CQI-ReportConfig (307)–CQI-ReportPeriodicProcExtId (314)–CrossCarrierSchedulingConfig (314)–CSI-IM-Config (315)–CSI-IM-ConfigId (315)–CSI-RS-Config (317)–CSI-RS-ConfigEMIMO (318)–CSI-RS-ConfigNZP (319)–CSI-RS-ConfigNZPId (320)–CSI-RS-ConfigZP (321)–CSI-RS-ConfigZPId (321)–DMRS-Config (321)–DRB-Identity (322)–EPDCCH-Config (322)–EIMTA-MainConfig (324)–LogicalChannelConfig (325)–LWA-Configuration (326)–LWIP-Configuration (326)–RCLWI-Configuration (327)–MAC-MainConfig (327)–P-C-AndCBSR (332)–PDCCH-ConfigSCell (333)–PDCP-Config (334)–PDSCH-Config (337)–PDSCH-RE-MappingQCL-ConfigId (339)–PHICH-Config (339)–PhysicalConfigDedicated (339)–P-Max (344)–PRACH-Config (344)–PresenceAntennaPort1 (346)–PUCCH-Config (347)–PUSCH-Config (351)–RACH-ConfigCommon (355)–RACH-ConfigDedicated (357)–RadioResourceConfigCommon (358)–RadioResourceConfigDedicated (362)–RLC-Config (367)–RLF-TimersAndConstants (369)–RN-SubframeConfig (370)–SchedulingRequestConfig (371)–SoundingRS-UL-Config (372)–SPS-Config (375)–TDD-Config (376)–TimeAlignmentTimer (377)–TPC-PDCCH-Config (377)–TunnelConfigLWIP (378)–UplinkPowerControl (379)–WLAN-Id-List (382)–WLAN-MobilityConfig (382)6.3.3Security control information elements (382)–NextHopChainingCount (382)–SecurityAlgorithmConfig (383)–ShortMAC-I (383)6.3.4Mobility control information elements (383)–AdditionalSpectrumEmission (383)–ARFCN-ValueCDMA2000 (383)–ARFCN-ValueEUTRA (384)–ARFCN-ValueGERAN (384)–ARFCN-ValueUTRA (384)–BandclassCDMA2000 (384)–BandIndicatorGERAN (385)–CarrierFreqCDMA2000 (385)–CarrierFreqGERAN (385)–CellIndexList (387)–CellReselectionPriority (387)–CellSelectionInfoCE (387)–CellReselectionSubPriority (388)–CSFB-RegistrationParam1XRTT (388)–CellGlobalIdEUTRA (389)–CellGlobalIdUTRA (389)–CellGlobalIdGERAN (390)–CellGlobalIdCDMA2000 (390)–CellSelectionInfoNFreq (391)–CSG-Identity (391)–FreqBandIndicator (391)–MobilityControlInfo (391)–MobilityParametersCDMA2000 (1xRTT) (393)–MobilityStateParameters (394)–MultiBandInfoList (394)–NS-PmaxList (394)–PhysCellId (395)–PhysCellIdRange (395)–PhysCellIdRangeUTRA-FDDList (395)–PhysCellIdCDMA2000 (396)–PhysCellIdGERAN (396)–PhysCellIdUTRA-FDD (396)–PhysCellIdUTRA-TDD (396)–PLMN-Identity (397)–PLMN-IdentityList3 (397)–PreRegistrationInfoHRPD (397)–Q-QualMin (398)–Q-RxLevMin (398)–Q-OffsetRange (398)–Q-OffsetRangeInterRAT (399)–ReselectionThreshold (399)–ReselectionThresholdQ (399)–SCellIndex (399)–ServCellIndex (400)–SpeedStateScaleFactors (400)–SystemInfoListGERAN (400)–SystemTimeInfoCDMA2000 (401)–TrackingAreaCode (401)–T-Reselection (402)–T-ReselectionEUTRA-CE (402)6.3.5Measurement information elements (402)–AllowedMeasBandwidth (402)–CSI-RSRP-Range (402)–Hysteresis (402)–LocationInfo (403)–MBSFN-RSRQ-Range (403)–MeasConfig (404)–MeasDS-Config (405)–MeasGapConfig (406)–MeasId (407)–MeasIdToAddModList (407)–MeasObjectCDMA2000 (408)–MeasObjectEUTRA (408)–MeasObjectGERAN (412)–MeasObjectId (412)–MeasObjectToAddModList (412)–MeasObjectUTRA (413)–ReportConfigEUTRA (422)–ReportConfigId (425)–ReportConfigInterRAT (425)–ReportConfigToAddModList (428)–ReportInterval (429)–RSRP-Range (429)–RSRQ-Range (430)–RSRQ-Type (430)–RS-SINR-Range (430)–RSSI-Range-r13 (431)–TimeToTrigger (431)–UL-DelayConfig (431)–WLAN-CarrierInfo (431)–WLAN-RSSI-Range (432)–WLAN-Status (432)6.3.6Other information elements (433)–AbsoluteTimeInfo (433)–AreaConfiguration (433)–C-RNTI (433)–DedicatedInfoCDMA2000 (434)–DedicatedInfoNAS (434)–FilterCoefficient (434)–LoggingDuration (434)–LoggingInterval (435)–MeasSubframePattern (435)–MMEC (435)–NeighCellConfig (435)–OtherConfig (436)–RAND-CDMA2000 (1xRTT) (437)–RAT-Type (437)–ResumeIdentity (437)–RRC-TransactionIdentifier (438)–S-TMSI (438)–TraceReference (438)–UE-CapabilityRAT-ContainerList (438)–UE-EUTRA-Capability (439)–UE-RadioPagingInfo (469)–UE-TimersAndConstants (469)–VisitedCellInfoList (470)–WLAN-OffloadConfig (470)6.3.7MBMS information elements (472)–MBMS-NotificationConfig (472)–MBMS-ServiceList (473)–MBSFN-AreaId (473)–MBSFN-AreaInfoList (473)–MBSFN-SubframeConfig (474)–PMCH-InfoList (475)6.3.7a SC-PTM information elements (476)–SC-MTCH-InfoList (476)–SCPTM-NeighbourCellList (478)6.3.8Sidelink information elements (478)–SL-CommConfig (478)–SL-CommResourcePool (479)–SL-CP-Len (480)–SL-DiscConfig (481)–SL-DiscResourcePool (483)–SL-DiscTxPowerInfo (485)–SL-GapConfig (485)。
无线电台调谐说明书

调谐至一个无线电台自动调谐1.按主机上的TUNER 几次以选择"AM"或"FM"。
2.按 TUNING MODE ,使显示屏上的 "AUTO"指示灯亮起。
3.按 TUNING 开始自动调谐。
找到一个电台后搜索自动停止。
调到一个无线电台后,显示屏上的 "TUNED" 指示灯亮起。
调到一个 FM 无线电台时,"FM STEREO" 指示灯亮起。
"TUNED " 灯熄灭时不会输出任何声音。
FM 无线电台的信号微弱时:取决于建筑物结构和环境条件,无线电波可能会很微弱。
在此情况下,执行下一部分"手动调谐"中所说明的手动调谐程序,以便手动选择所需电台。
手动调谐1.按主机上的TUNER 几次以选择"AM"或"FM"。
AM/FM 接收详情2.按 TUNING MODE,使显示屏上的 "AUTO" 指示灯熄灭。
3.按 TUNING,选择想收听的无线电台。
每按一下按钮,频率改变 1 个步长。
按住按钮时频率会持续变化,松开按钮后停止。
调台时注意显示屏。
要返回至自动调谐:在主机上再次按TUNING MODE。
本机将自动调谐到无线电台。
一般情况下应显示"AUTO"。
直接调谐到频率用于直接输入您要收听的无线电台的频率。
1.按遥控器上的TUNER几次以选择"AM"或"FM"。
2.按 D.TUN。
3.使用数字按钮,在8秒钟内输入无线电台的频率。
例如,要调到 87.5 (FM),按 8、7、5,或 8、7、5、0。
如果输入的数字错误,请按D.TUN 并输入正确值。
注册一个AM/FM 无线电台可以记录最多 40 个您最喜欢的 AM/FM 无线电台。
提前记录无线电台让您能够直接调到喜欢的电台。
AUREL RX 4MM3 PREN FAST 433.92 MHz ISM 数字数据超频接收器说明

User manualTechnical features can be change without forecast. AUREL S.p.A. doesn’t assume any responsibility of damages due to the improper device usage.RX 4MM3/PREN FAST is a digital data super het receiver, working at 433,92 MHz ISM band, a new version of RX 4MM3, it changes for pin 15. Pin15 is used to enable the receiver, allowing less than 2 uA of current supply in stand-by mode and very fast switching-on to the valid reception(less than 1msec). The other technical features are the same; 3V of power supply and OOK modulation. Main features are the very high sensitivity (-114 dbm) and the frequency image rejection obtained through a new circuital technique. An RSSI output allows a distance indication of the matched transmitter, providing a signal proportional to the power of RF input signal.PIN-OUTCONNECTIONSPin 1 +V 3V - 3,6V range for voltage supplyPin 2-7 Ground GNDPin 3 Antenna Antenna input, impedance 50 ohm.Pin 11AGC On-OffSwitching-on of the Automatic Gain Control.Low logic level: Automatic Gain Control is on (advised setting). High logic level: Automatic Gain Control is off. Max sensitivity. ( see “Pin 11 working” section).Pin 13 RSSI OUT – Test Point RSSI analogue output, proportional to the power of RF received signal (For details see page 4)Pin 14 Data output Data. Normally low with no RF signal is in input. Pin 15EnablePin enable:High logic level: RX is switch-on.Low logic level: RX is switch-off. (PWRDN mode)115User manualTechnical features can be change without forecast. AUREL S.p.A. doesn’t assume any responsibility of damages due to the improper device usage.Technical featuresMin Typical Max Unit Notes Reception frequency 433,9 433.92 433,94 MHz Vs voltage supply3 3,3 3,6 V Current supply RX = ON ENABLE (pin 15) = 1 5,87 mA Stand-by current supply ENABLE (pin 15) = 1 Vcc3 uARF sensitivity -110 -114 -115 dBm See note 1ModulationASK IF bandwidth @ –3dB280 KHz Interference rejection at ±10MHz 60 dB Output square wave2 3 KHzOutput low logic level (pin 14) gnd+0,4V See note 3 Output high logic level (pin 14) V s -0,4 V See note 3Input high logic level (pin 15) Vs-0,4V Input low logic level (pin 15)0,4 V Current consumption pin15 with High logic level10 uA Spurious RF emission in antenna -60 dBm Switch-on time Usage condition:(pin 1) Vcc e (pin 15) Enable = 0 10,4 sSee note 2Switch-on time PWRDN RX-ON Usage condition (pin 1) Vcc = 1(pin15) Enable = 0 1 1 10,5msWorking temperature -20+80 °CDimension38,9 x 17.51 x 5.2 mmNOTA 1: Sensitivity obtained through an RF generator with 100% modulation.NOTA 2: By switch on time is meant the time required by the receiver to assume the declared characteristics from the very momentthe power supply is applied.NOTA 3: Values obtained with 10KΩ maximum load applied.How it works:The RX 4MM3/FAST PREN receiver is able to work in two different ways:1. POWER-DOWN mode: By setting the PWRDN Pin 15 to low logical level, the receiver goes to stand-by modeand it does not receive with a maximum of 2uA current consumption.2. Reception mode: By setting the PWRDN Pin 15 from low logical level to high logic level, the receiver switcheson within 1 ms(typically 0,5 ms) and starts to receive depending on the features above. In the case of first power supply, the switching-on time is 400 ms by setting high Pin 1 and Pin 15.User manualTechnical features can be change without forecast. AUREL S.p.A. doesn’t assume any responsibility of damages due to the improper device usage.TIME CHART RX > ONTIME CHART PWRDN >RXUser manualPin 11 AGC On-OffThe RX 4MM3/FAST PREN receiver is endowed with a pin designed to enable the automatic gain control. Setting at a low level the AGC ON-OFF pin, the automatic gain control is on: now it is possible to correctly decode RF signals received with an RF power included in the range [-114dBm, 0dBm] that means that the RX 4MM3/PREN FAST accepts the largest dynamics of the received waveform (that is up to 0 dBm).If you put a logic high level on pin 11 the automatic gain control is disabled and the receiver works always with the maximum sensitivity. If the RF power is lower than a threshold the RX 4MM3/PREN FAST works with a linear behaviour while if the input power is higher than the same threshold the receiver works in the saturation zone. This behaviour can be exploited if you need the distance indication of the receiver from its correspondent transmitter. The following indications handle with the RSSI output with automatic gain control disabled.Pin 13 RSSI outputIn Fig. 1 it’s depicted the behaviour of the voltage at the RSSI output in function of the power of the input signal with the automatic gain control disabled (pin 11 at a logic high level). The diagram has been obtained applying at the antenna input (pin 3) the 99% AM modulated signal coming from an RF generator made up of a 1 KHz square waveform and putting a 10 µF capacitor between pin 13 and GND. The RSSI output has a linear behaviour in correspondence with an RF power up to –40 dBm ca., after which it assumes the saturation value of 2,2V. In the linear zone the RSSI output is directly proportional to the RF power: the voltage at pin 13 can be then used as a measure of the intensity of the received signal and to recover the distance from the transmitter. When the RSSI output assumes a constant value, the received signal is no more directly proportional and only a proximity information can be extracted. The maximum distance of the transmitter from its receiver can be calculated as the RF power at which the RSSI output changes its values up to the saturation voltage. The distance over which the receiver works in the saturation zone is in theory 4m ca. (transmitting and receiving antennas on line of sight and 0dBm transmitted power, typical RF power of the handheld transmitters) and depends on the presence of obstacles placed in the middle of the radio link that cause multipath and reflections. Therefore the RSSI represents a measure of distance until it has a linear behaviour and a proximity information when it assumes the saturation voltage (useful if you need to monitor accesses).Fig. 1 – The picture shows RSSI output, when AGC is switched-off, depending on the RF input signal.Technical features can be change without forecast. AUREL S.p.A. doesn’t assume any responsibility of damages due to the improper device usage.User manualTechnical features can be change without forecast. AUREL S.p.A. doesn’t assume any responsibility of damages due to the improper device usage.Device usageIn order to obtain all the technical features and to comply the European normative, the receiver has to be mounted, keeping in mind what follows:Power supply:1. The receiver must be supplied by very low voltage source, safety protected against short circuits. Maximum voltagevariations allowed: ± 0,5 V.2. De-coupling, next to the receiver, by means of a ceramic capacitor of minimum 100.000 pF value.Ground:It must surround at the best the welding area of the receiver. The circuit must be double layer, with throughout vias to the ground planes, approximately each 15 mm.It must be properly dimensioned, especially in the antenna connection area, in case a radiating whip antenna is fitted in it (an area of approximately 50 mm radius is suggested.)50 Ohm Line:1. It must be as shorter as possible.2. 1,8 mm wide for 1 mm thick FR4 printed circuits and 2,9 mm wide for 1,6 mm thick FR4 printed circuits. On thesame side it must be kept 2mm away from the ground. 3. On the opposite side a ground circuit area must be present.Antenna connection:It may be utilized as the direct connection point for the radiating whip antenna. It is deeply suggested to put a 100nH inductance from pin 3 to ground in order to protect the device from the electrostatic discharges.It can bear the connection of the central wire of a 50 Ω coaxial cable. Be sure that the braid is welded to the ground in a close point.Fig.2 Advised lay-out for a correct working of the device.User manualAntenna1. A whip antenna, 16.5mm long and approximately 1 mm dia, brass or copper wire made, must be connected to theRF input of the receiver.2.The antenna body must be kept straight as much as possible and must be free from other circuits or metal parts(5cm minimum suggested distance).3.It can be utilised both vertically or horizontally (the previous is highly suggested), providing that connection pointbetween antenna and receiver input is surrounded by a good ground plane.N.B:As an alternative to the above mentioned antenna it is possible to use the whip model manufactured by Aurel (see related Datasheet and Application Notes).By fitting whips too different from the described ones, the EEC Certification is not assured.Other components:1.Keep the receiver separate from all other components of the circuit (more than 5mm).2. Keep particularly far away and shielded all microprocessors and their clock circuits.3.Do not fit components around the 50 Ohm line. At least keep them at 5 mm distance.4. If the antenna connection is directly used for a radiating whip connection, keep at least a 5 cm radius free area. Incase of coaxial cable connection, 5 mm radius will suffice.Reference normativeThe RX 4MM5/F is approved by CE and in particular satisfies the European normatives EN 300 220-1 V2.3.1 in class 2, ed EN 301 489-1 V1.8.1 in class 2. The product was tested in according with EN 60950 normative and it’s usable fitted in an isolated housing to ensure the above normative. The receiver must be supplied by very low voltage security source against the short circuits. Usage of receiver module is foreseen fitted in the housing which ensure the agreement of EN 61000-4-2 normative not directly applicable to the module itself. In particular, it’s at the user’s care the isolating of the extern antenna connection and antenna too, in fact the RF output of the receiver is not able to directly bear electrostatic charges foreseen in the above normative.Technical features can be change without forecast. AUREL S.p.A. doesn’t assume any responsibility of damages due to the improper device usage.。
Silicon Laboratories Si477x FM AM 模块应用指南说明书

X AYOUT UIDELINESAN6441.2. Front-End LayoutThe following layout rules are used:⏹ Layer 1 top side component placement and analog signal routing ⏹ Layer 2 solid ground plane ⏹ Layer 3 digital signal routing ⏹Layer 4 solid ground plane ⏹ Power routed by trace⏹ 0402 component size or larger ⏹ 6 mil traces ⏹ 6 mil trace spacing ⏹ 15 mil component spacingFigure 2.Four-Layer PCB StackupFigure 3.Si477x FM/AM Front-End LayoutAN6441.3. FM Front-End1.3.1. FM Front-EndESD diode D1 protects against external antenna ESD events. Place D1 close to the antenna connector. Choose diodes with minimum parasitic capacitance, such as the Tyco Electronics PESD0402-140 (0.25pF).Series inductor L9 (10nH) suppresses EMI.The AM loading capacitor, C10 (18pF) ac-couples the antenna to the input network and resonates with the inductor L3 (150nH).The FM input (FMI, Pin 7) matching network consists of L2 (47nH), C9 (62pF), and AGC-controlled internal resistor banks FMAGC1 (Pin 40) and FMAGC2 (Pin 39). Place these components close to the FMAGC1/2 pins to minimize trace inductance. Connect FMI using two vias and a trace on PCB Layer 2.Connect the LNA output (FMO, Pin 6) to the RF regulator (RFREG, Pin 5) using L1 (220nH). Place L1 and RF regulator bypass capacitor C7 (2.2nF) close the RFREG pin.Connect the LNA output through ac-coupling capacitor C8 (1nF) to input of T1, the external FM balun. The two outputs of the balun are connected to FM mixer inputs (FMXIP, Pin 2 and FMXIN, Pin 3).Shunt Capacitors C11,C22, C24, C25, and C26 are placeholders for filtering caps on the EVB. They may not be required in actual application.Components should be placed close to the IC to minimize trace lengths.All front-end ground connections should be to a common system ground. Alternatively, an RF ground plane should be connected to system ground by a shield or large copper fill.1.3.2. AM Front-EndThe schematic shows two paths to the AM input (AMI, pin 10). The path originating with J33 is used on the evaluation board for conducted testing and is not needed as part of the true application circuit. The path originating from JP1 assumes a loop antenna will be used. JP1 is connected to an external AM transformer (T2).The output of the transformer is ac coupled to the AMI input pin through a 0.1uF capacitor (C13).Ensure R5 is populated for loop antenna reception and J35 is shorted for conducted tests. The output of C13 is connected to the AMI input pin. Components should be placed close to the IC to minimize trace lengths.Shunt Capacitors C23 and C27 are placeholders for filtering caps on the EVB. They may not be required in actual application.AN6444Rev. 0.31.4. System Interface SchematicFigure 4.Si477x System Interface SchematicRFC12NPJ32J29X137.209375MHZ3.2x 2.5NF46U14140393837363534333231302928272625242322212019181716151413121110987654321FMXIP FMXIN GNDRF RFREG FMO FMI NC AMIA 0A 1R S T B S D A S C L I N T B V I O 1V DDBYPVIO2IQCLK IQFS IOUT QOUT DOUT DFS DCLK V AL O U T R O U T X T A L 2X T A L 1D A C R E F G P I O 2G P I O 1F M A G C 2F M A G C 1G N D _P A D D C L K 2D O U T 2NC NC BLEND SI477XC52.2NF100PF C1C22.2NF C32.2NFC2010UFC42.2NF10UFC60.1UFC21VDVAIQCLK V_PGMXOUTLOUTXIN VIO2GPIO_3DCLK QOUT VIO1DOUT DFS ROUT IOUT IQFS INTB_1SCL RSTB_1GPIO_0SDA GPIO_1GPIO_2D_0AN6441.5. System Interface LayoutThe layout for the system interface is shown in Figure5. The following sections discuss the components of this layout.Figure5.Si477x System Interface Layout1.5.1. BypassingThe analog supply VA (Pin 25) requires three parallel bypass capacitors: C1 (100pF), C2 (2.2nF), and C21 (0.1µF). Place these capacitors as close as possible to the VA pin, with the 100pF capacitor closest to the pin. Place a via connecting the VA pin and the capacitors to the system VA supply such that the capacitors are closer to the Si477x VA pin than the via. Connect all three capacitors to the surrounding ground fill with wide, low-inductance traces and vias. See Figure6.AN644DACREF bypass capacitor locationVA supply VIA locationVA bypass capacitor location andground fillFigure6.Si477x VA Supply Bypassing LayoutThe voltage reference for the audio DAC (DACREF, Pin 36) requires a 10µF capacitor (C6) to ground. Both VA and DACREF bypassing should be connected to the system ground plane.The digital supply VD (Pin 20) requires two parallel bypass capacitors, C3 (2.2nF), and C20 (10µF). Place these capacitors as close as possible to the VD pin, with the 2.2nF capacitor closest to the pin. Place a via connecting the VD pin and the capacitors to the system VD supply such that the capacitors are closer to the Si477x VD pin than the via. See Figure7, “Si477x VD/VIO1/VIO2 Supply Bypassing Layout”.The control (VIO1, Pin 19) and data bus interface (VIO2, Pin 22) supplies each require a 2.2nF bypass capacitor (C4, C5). Place each capacitor as close as possible to the corresponding VIO pin. Place a via connecting the VIO pin and the capacitor to the system VIO supply such that the capacitor is closer to the Si477x VIO pin than the via. Connect all digital bypass capacitors (C3, C20, C4, C5) only to the digital bypass ground (DBYP) Pin 21 with a wide, low-inductance trace. Do not connect the digital bypassing capacitors to the PCB ground; this grounding is provided by the Si477x internally. See Figure7, “Si477x VD/VIO1/VIO2 Supply Bypassing Layout”.AN644Figure7.Si477x VD/VIO1/VIO2 Supply Bypassing Layout1.5.2. Reference ClockThe Si477x generates all internal clocking from an external crystal using an on-chip oscillator or an external refer-ence clock. The supported crystal and external clock source frequency is 4MHz. The reference clock/crystal accu-racy must be within ±100ppm.X1 is an optional crystal required only when using the internal oscillator feature. Place the crystal, X1, as close to XTAL1 (Pin 35) and XTAL2 (Pin 34) as possible to minimize current loop lengths. If an external clock source is used instead of a crystal, route the clock through series capacitor C12 to XTAL2 and leave XTAL1 floating (NC). Route the RCLK trace as far away from digital I/O traces as possible to minimize capacitive coupling.1.5.3. Analog Audio / MPX Output (Si4777)High-fidelity digital-to-analog converters (DACs) drive analog audio signals or the FM MPX signal to LOUT/MPX-OUT (Pin 32) and ROUT (Pin 33). For analog audio and FM MPX information, refer to the Si477x data sheet.AN6441.5.4. Control InterfaceAll control interface signals operate at VIO1 supply levels. Route all control interface traces on Layer 2 to minimize coupling to the RF front-end. SDA and SCL (Pins 16 and 17) are an I2C-compatible serial port slave interface, which allows an external controller to send commands and receive responses from the Si477x. Both the SDA and SCL signals require external pull-up resistors to VIO1. The value of pull-up resistor values will vary based on the number of devices, capacitance, and speed of the bus. Placement location is not critical. Refer to the I2C specifica-tion for additional design information. For I2C Control Bus information, refer to the Si477x data sheet.A0 and A1 (Pins 11 and 12) select the I2C device address. Leave each pin either floating (NC) or connected to the system ground. For I2C Device Address selection, refer to the Si477x data sheet.RSTB (Pin 15) is the global chip reset input. Setting the RSTB pin low disables analog and digital circuitry, resets the registers to their default settings, and disables the bus. Setting the RSTB pin high brings the device out of reset. For Reset, Powerup, and Powerdown information, refer to the Si477x data sheet.INTB (Pin 18) is an active low interrupt output. See “AN645:Si477x Programming Guide” for interrupt configuration. Series termination resistors may be added to the SDA, SCL, and INTB traces to mitigate system noise and control slew rate. Confirm that data sheet timing requirements are met with the selected series termination resistor value. Place the series termination resistors for SDA and INTB as close to the Si477x as possible. Place the series termi-nation resistor for SCL close to the host controller.1.5.5. Digital Audio InterfaceThe digital audio interface includes data serial lines containing audio data (DOUT, Pin 27), a bit clock (DCLK, Pin 29), and a word frame for left- and right-channel data (DFS, Pin 28). For Digital Audio Interface information, refer to the Si477x data sheet.All digital audio signals operate at VIO2 supply levels. Route all digital audio traces on Layer 3 to minimize coupling to the RF front-end.Series termination resistors may be added to the DOUT, DCLK, and DFS traces to mitigate system noise and control slew rate. Confirm that data sheet timing requirements are met with the selected series termination resistor value. Place the series termination resistors for DCLK and DFS as close to the host controller as possible. Place the series termination resistor for DOUT close to the Si477x.AN6441.5.6. Digital I/Q ZIF Output and IBOC Blend Mode (Si4777)All digital I/Q signals operate at VIO2 supply levels. Route all digital I/Q traces on Layer 3 to minimize coupling to the RF front-end.The digital ZIF I/Q output provides the down-converted channelized AM/FM signal at baseband to a third-party pro-cessor for IBOC signal processing. The ZIF I/Q 4-pin interface consists of two data serial lines containing I and Q data (IOUT/QOUT, Pins 25/26), a bit clock (IQCLK, Pin 23), and a word frame for each data sample (IQFS, Pin 24). Connect these traces to the I/Q input of the HD Radio Demod.In IBOC Blend Mode (Si4777), Pins 27 through 30 (DOUT, DFS, DCLK, XOUT) are digital audio and blend control inputs. Connect these pins to a third-party processor's digital audio master output and blend control output. Pins 13, 14, and 18 (DCLK2, DOUT2, and DFS2) are blended digital audio outputs. Connect these pins to a digital audio master host processor. See the Si477x data sheet, section “4.12 IBOC Blend Mode for HD Radio”. The HD system implementation is shown below in Figure8.Figure8.System Implementation of HD-Radio Reception with IBOC BlendAN6441.6. Thermal Performance for Two-Layer Module ApplicationsWhen designing a small, two-layer based on the Si477x, the module size must be no less than 3 x 5cm to achieve best thermal performance, as a larger board area dissipates heat more readily. Place all LDOs on the base board if possible, to eliminate heat sources on the module. Lowering VA from 5.0V to 4.8V decreases board temperature without RF performance degradation.Connect the IC ground paddle to the bottom layer PCB ground using vias to dissipate heat. Place large vias on the ground paddle connected to the bottom layer ground as shown in Figure9. Do not use vias with diameter greater than 20mils, as this may impact RF performance. Standard 1mil via plating lowers thermal resistance and helps decrease temperature.Figure 9.Si477x Ground Paddle Via PlacementConnect NC pins, I 2C address select pins A0/A1, and the IC ground paddle to the top layer ground with solid ground fill to lower thermal resistance.For two-layer module designs, 2oz Cu weight (70µm) is required to maximize thermal performance. FR4-370HR PCB material is recommended for best thermal and RF performance due to its thermal conductivity.AN6441.7. Design Checklist*⏹ Place VA bypass capacitors C1, C2, and C21 as close as possible to the Si477x supply pin.⏹ Place VD bypass capacitors C3 and C20 as close as possible to the Si477x supply and digital bypass(DBYP) pins.⏹ Place VIO1/VIO2 bypass capacitors C4 and C5 as close as possible to the Si477x supply and digitalbypass pins (DBYP).⏹ Route supplies using wide, low-inductance traces. Ensure that each trace is rated to handle the requiredcurrent.⏹ Route all supply connections through a via such that the bypass capacitors are closer to the Si477x supplypins than the source via.⏹ Place crystal X1 as close as possible to the Si477x XTAL1/XTAL2 pins.⏹ Select a crystal with accuracy of ±100ppm.⏹ Place the Si477x close to the antenna connector to minimize RF front-end trace lengths and capacitanceand to minimize inductive and capacitive coupling.⏹ Route all traces to minimize inductive and capacitive coupling by keeping digital traces away from analogand RF traces, minimizing trace length, minimizing parallel trace runs, and keeping current loops small.⏹ Route digital traces between ground planes for best performance.⏹ Add series termination resistors to digital signals if necessary to mitigate noise coupling. Ensure timingspecifications are maintained when adding series terminations.⏹ Connect the Si477x ground pad to the ground plane using multiple vias to minimize ground potentialdifferences and achieve optimal thermal performance.⏹ Do not route signal traces under the Si477x.⏹ Do not route digital or RF traces over breaks in the ground plane.⏹ Flood the primary and secondary routing layers with separated RF and system grounds, and connect alllayers using stitching vias.⏹ PCB size should be no less than 3 x 5cm in a two-layer module application. Use 2oz Cu and FR4-370PCB material for best thermal performance.⏹ Place 20-mil diameter vias at the IC ground paddle to for heat dissipation.⏹ Use NC pins and I2C address lines pins 9-10 to connect ground paddle to top layer ground. The groundarea should be as large as possible with many ground vias on it.*Note:Design checklist is listed in order of importance.AN6441.8. Bill of Materials: Si477x FM/AMTable 1. Si477x FM/AM Bill of MaterialsDesignatorDescription Value ManufacturerPart Number C1CAP ,SM,0402100pF Murata GRM1555C1H101JZ01C2,C3,C4,C5,C7CAP ,SM,0402 2.2nF Murata GRM155R71H222KA01C6,C20CAP ,SM,040210µF Murata GRM188R60J106ME47D C8CAP ,SM,0402 1.0nF Murata GRM155R71H102KA01C9CAP ,SM,040262pF Murata GRM1555C1H620JD01C10CAP ,SM,040218pFMurataGRM1555C1H180JZ01C11,C12,C22,C23,C24,C25,C26,C27CAP ,SM,0402NPC13,C17,C21CAP ,SM,04020.1µF MurataGRM155R71A104-KA01D D1,D2,D3ESD PROTECTOR,14VDC,SMDigikey PESD0402-140TR-ND L1IND,SM,0603220nH Murata LQW18ANR22G00L2IND,SM,060347nH Murata LQW18AN47NG00L3IND,SM,0603150nH Murata LQW18ANR15G00L9IND,SM,060310nHMurata LQW18AN10NJ00DT1Balun, 1:1TOKO #458PT1566T2Transformer Silicon LaboratoriesSL755TF01R1,R4,R5RES,SM,04020U1IC,SM,SI4770,MLP40Silicon LaboratoriesSI4770U2IC, SM, RAM Microchip34LC02X1XTAL,SM,37.209375MHz TAI-SAW TZ1522AJ29,J32,J36,J37RES,SM,0402,SOL-DER_BUMP_JUMPER NPJ1,J33CONN, SMA, EDGEMOUNTAEPCONNECTORSJ2CONN,SM,SFM,2X30,0.05INPITCHSamtecSFM-130-02-S-D-AAN644JP1CONN,TH,HEADER,.100PITCH,1X2Samtec HTSW-101-07-G-DJ3,J4,J5,J6,J7, J8,J9,J10,J11, J12,J13,J14,J15,J16,J17, J18,J19,J20, J21,J22,J23, J24,J25,J26, J27,J28,J30, J31,J35RES,SM,0402,SOL-DER_BUMP_JUMPERTable 1. Si477x FM/AM Bill of Materials (Continued)Designator Description Value Manufacturer Part NumberAN644D OCUMENT C HANGE L IST Revision 0.1 to Revision 0.2⏹Updated "1.3.1. FM Front-End" on page 3. Revision 0.2 to Revision 0.3⏹Updated Table1 on page12.● Updated T1 designator part number.DisclaimerSilicon Laboratories intends to provide customers with the latest, accurate, and in-depth documentation of all peripherals and modules available for system and software implementers using or intending to use the Silicon Laboratories products. Characterization data, available modules and peripherals, memory sizes and memory addresses refer to each specific device, and "Typical" parameters provided can and do vary in different applications. Application examples described herein are for illustrative purposes only. Silicon Laboratories reserves the right to make changes without further notice and limitation to product information, specifications, and descriptions herein, and does not give warranties as to the accuracy or completeness of the included information. Silicon Laboratories shall have no liability for the consequences of use of the information supplied herein. This document does not imply or express copyright licenses granted hereunder to design or fabricate any integrated circuits. The products must not be used within any Life Support System without the specific written consent of Silicon Laboratories. A "Life Support System" is any product or system intended to support or sustain life and/or health, which, if it fails, can be reasonably expected to result in significant personal injury or death. Silicon Laboratories products are generally not intended for military applications. Silicon Laboratories products shall under no circumstances be used in weapons of mass destruction including (but not limited to) nuclear, biological or chemical weapons, or missiles capable of delivering such weapons.Trademark InformationSilicon Laboratories Inc., Silicon Laboratories, Silicon Labs, SiLabs and the Silicon Labs logo, CMEMS®, EFM, EFM32, EFR, Energy Micro, Energy Micro logo and combinations thereof, "the world’s most energy friendly microcontrollers", Ember®, EZLink®, EZMac®, EZRadio®, EZRadioPRO®, DSPLL®, ISOmodem ®, Precision32®, ProSLIC®, SiPHY®, USBXpress® and others are trademarks or registered trademarks of Silicon Laboratories Inc. ARM, CORTEX, Cortex-M3 and THUMB are trademarks or registered trademarks of ARM Holdings. Keil is a registered trademark of ARM Limited. All other products or brand names mentioned herein are trademarks of their respective holders.Silicon Laboratories Inc.400 West Cesar Chavez Austin, TX 78701USASmart.Connected.Energy-FriendlyProducts/productsQuality/qualitySupport and Community。
摩克斯 V464 系列芯片计算机产品介绍说明书

The V464 embedded computers are based on the AMD x86 processor, and feature 4 serial ports, quad LAN ports, 4 USB 2.0 hosts, and CompactFlash. A VGA interface is also included, making the V464 computers particularly well-suited for industrial applications such as SCADA and factory automation.The V464 computers’ 4 serial ports can be used to connect a wide range of serial devices, and the quad 10/100 Mbps Ethernet ports offer a reliable solution for network redundancy, promising continuousFront Viewoperation for data communication and management. In addition, the CompactFlash and USB sockets provide the V464 computers with the reliability needed for industrial applications that require data buffering and storage expansion.The V464 computers come with the WinCE 6.0 or WinXP Embedded operating system already installed. WinCE 6.0 and WinXP Embedded provide programmers with a friendly environment for developingsophisticated, bug-free application software at a lower cost.OverviewAppearanceRear View10/100 Mbps SocketSerial Ports x 2Serial Ports x 2 9-36 VDCComputerCPU:******************************************,500 MHzOS (pre-installed): Windows CE 6.0 or Windows XP Embedded System Chipset: AMD CS5536BIOS: 4 Mbit Flash BIOS, supporting Plug & Play, APM 1.2, ACPI 1.0 SRAM: 256 KB, battery backupFSB: 400 MHzSystem Memory: 200-pin SO-DIMM socket with built-in 256 MB (CE) or 512 MB (XPe) DDR, supporting DDR400 up to 1 GB Expansion Bus: PC/104-Plus onboardUSB: USB 2.0 compliant hosts x 4, type A connector, supports system boot upStorageBuilt-in: 256 MB (CE) or 1 GB (XPe) industrial DOM for OS Storage Expansion: CompactFlash socketOther PeripheralsKB/MS: 1 PS/2 interface supporting standard PS/2 keyboard and mouse through Y-type cableAudio: AC97 audio, with line-out interfaceDisplayGraphics Controller: CPU integrated 2D graphicsDisplay Interface: CRT interface for VGA outputEthernet InterfaceLAN: 4 10/100 Mbps, auto-sensing (RJ45) portsController: Realtek RTL8100CLMagnetic Isolation Protection: 1.5 KV built-inSerial InterfaceSerial Standards:• 2 RS-232 ports (DB9 male)• 2 RS-232/422/485 ports, software selectable (DB9 male)ESD Protection: 15 KV for all signalsSerial Communication ParametersData Bits: 5, 6, 7, 8Stop Bits: 1, 1.5, 2Parity: None, Even, Odd, Space, MarkFlow Control: RTS/CTS, XON/XOFF, ADDC® (automatic data direction control) for RS-485Baudrate: 50 bps to 921.6 Kbps (non-standard baudrates supported; see user’s manual for details)Serial SignalsRS-232: TxD, RxD, DTR, DSR, RTS, CTS, DCD, GNDRS-422: TxD+, TxD-, RxD+, RxD-, GND RS-485-4w: TxD+, TxD-, RxD+, RxD-, GNDRS-485-2w: Data+, Data-, GNDLEDsSystem: Power, Battery, StorageLAN: 10M/Link x 2, 100M/Link x 2 (on connector)Switches and ButtonsPower Switch: on/offReset Button: For warm rebootPhysical CharacteristicsHousing: AluminumWeight: 1.32 kgDimensions:Without ears: 223 x 121 x 57 mm (8.78 x 4.76 x 2.24 in)With ears: 248 x 140 x 70 mm (9.76 x 5.51 x 2.76 in)Mounting: DIN-Rail, wallEnvironmental LimitsOperating Temperature: -10 to 60°C (14 to 140°F)Operating Humidity: 5 to 95% RHStorage Temperature: -20 to 80°C (-4 to 176°F)Anti-vibration: 5 g rms @ IEC-68-2-34, random wave, 5-500 Hz, 1 hr per axisAnti-shock: 50 g @ IEC-68-2-27, half sine wave, 11 msPower RequirementsInput Voltage: 9 to 36 VDC (3-pin terminal block for V+, V-, SG) Power Consumption: 26 W• 730 mA @ 36 VDC• 1080 mA @ 24 VDC• 2820 mA @ 9 VDCRegulatory ApprovalsEMC: CE (EN55022 Class A, EN61000-3-2 Class A, EN61000-3-3, EN55024), FCC (Part 15 Subpart B, CISPR 22 Class A), CCC (GB9254, GB 17625.1)Safety: UL/cUL (UL60950-1, CSA C22.2 No. 60950-1-03), LVD, CCC (GB4943)Green Product: RoHS, cRoHS, WEEEReliabilityAlert Tools: Built-in buzzer and RTC (real-time clock) with battery backupAutomatic Reboot Trigger: Built-in WDT (watchdog timer) supporting 1-255 level time interval system reset, software programmable WarrantyWarranty Period: 3 yearsDetails: See /warrantyHardware SpecificationsWindows Embedded CE 6.0System Utilities: Windows command shell, telnet, ftpFile System: FAT (on-board flash)Protocol Stack: TCP, UDP, IPv4, SNMP V2, ICMP, IGMP, ARP, HTTP, CHAP, PAP, SSL, DHCP, SNTP, SMTP, Telnet, FTP, PPP Telnet Server: Allows remote administration through a standard telnet client.FTP Server: Used for transferring files to and from remote computer systems over a network.File Server: Enables clients to access files and other resources over the network (Microsoft® Wincows® CE).Web Server (httpd): Includes ASP, ISAPI Secure Socket Layer support, SSL 2, SSL 3, and Transport Layer Security (TLS/SSL 3.1) public key-based protocols, and Web Administration ISAPI Extensions.Dial-up Networking Service: RAS client API and PPP, supporting Extensible Authentication Protocol (EAP) and RAS scripting. Watchdog Service: CPU Hardware function to reset CPU in a user specified time interval (triggered by calling a MOXA library function).Application Development Software:• Moxa WinCE 6.0 SDK• C Libraries and Run-times• Component Services (COM and DCOM)• Microsoft® .NET Compact Framework 2.0 SP2• XML, including DOM, XQL, XPATH, XSLT, SAX, SAX2• SOAP Toolkit Client• Winsock 2.2Software SpecificationsWindows XP EmbeddedSystem Utilities: Windows command shell, Telnet, ftp, Wireless Zero Configuration File System: NTFSProtocol Stack: DHCP, IPv4, DNS, IPsec, HTTP, TCP, UDP, ICMP, IGMP, ARP, TAPI, TSP, SNMP V2, NTP, ICS, PPP, CHAP, EAP, SNTP, Telnet, SNTP, FTP, SMTP, PPPoE, PPTP, NetBIOSTelnet Server: Allows users to connect to Telnet servers from remote computers.IIS Web Server: Allows you to create and manage Web sites.Terminal Server: Microsoft Terminal Server client application (mstsc.exe).COM+ Services: The next evolution of Microsoft Component Object Model (COM) and Microsoft Transaction Server (MTS).Computer Browser Service: Computer browsing functionalityexposed by Windows through Microsoft Networking. Allows a client machine to browse its network neighborhood for available computers exposing file and print sharing services.Disk Management Services: Support for disk and volumemanagement operations. The component implements a Component Object Model (COM) interface that can be used to query and configure disks and volumes, both basic and dynamic. The component also monitors disk arrivals and removals and other changes in the storage subsystem.Remote Registry Service: Enables remote users to modify registry settings on this computer.Application Development Software:• Microsoft .Net Framework 2.0 with service pack 2 (CLR and the .NET Framework class library)• Active Directory Service Interface (ADSI) Core • Active Template Library (ATL), 2.0• Certificate Request Client & Certificate Autoenrollment (CLR and the .NET Framework class library) • COM APIs• Common Control Libraries • Common File Dialogs• Direct3D, DirectPlay, DirectShow and Direct show filters • Distributed Transaction Coordinator (MSDTC)• Enhanced Write Filter (Redirect disk write operations to volatile (RAM) or non-volatile (disk) storage) • Event Log, Internet Explorer • Mapi32 Libraries• Message Queuing (MSMQ) Core• Microsoft Visual C++ Run Time Libraries • Power Management dynamic-link library • Registry Editor • RPC• Smart Card Cryptographic Service Providers• USB 2.0 core drivers compliant with The USB .95 or 1.0 • Windows API, Media Player 10, Script Engines, and WMIV464 computer• Ethernet cable: RJ45 to RJ45 cross-over • cable, 100 cmDIN-rail Mounting Kit• PS2 to KB/MS Y-type Cable• Document and Software CD or DVD • Quick Installation Guide (printed)• Product Warranty Statement (printed)• Package ChecklistAvailable ModelsV464-CE: x86 embedded computer with 4 serial ports, quad LANs, VGA, CompactFlash, USB, and WinCE 6.0 OSV464-XPE: x86 embedded computer with 4 serial ports, quad LANs, VGA, CompactFlash, USB, and Windows XP Embedded OSOptional Accessories (can be purchased separately)PWR-24250-DT-S1: Power adaptorPWC-C7US-2B-183: Power cord with 2-pin connector, USA plug PWC-C7EU-2B-183: Power cord with 2-pin connector, Euro plug PWC-C7UK-2B-183: Power cord with 2-pin connector, British plug PWC-C7AU-2B-183: Power cord with 2-pin connector, Australia plug PWC-C7CN-2B-183: Power cord with 2-pin connector, China plugOrdering Information。
[维修资料]迅维时序资料免费送之一--INTEL芯片组标准时序图和解释
![[维修资料]迅维时序资料免费送之一--INTEL芯片组标准时序图和解释](https://img.taocdn.com/s3/m/276a1c0dcec789eb172ded630b1c59eef8c79ac3.png)
[维修资料]迅维时序资料免费送之一--INTEL芯片组标准时序图和解释INTEL 4系列、INTEL 5系列、INTEL 6系列=============华丽的分割线=============% M9 q; k) `% L& s1 |----INTEL 4系列芯片组时序图和解释-----[维修资料] 迅维时序资料免费送之一--INTEL芯片组标准时序图和解释时序图解释:9 b. B8 l/ B- x8 C$ `系统状态:G3:整个系统的电源均关闭 S5:关机状态 S4:休眠状态 S3:睡眠状态 S0:开机状态信号解释:/ d1 v9 a3 k7 W5 ~+ n7 k$ nVCCRTC:南桥RTC电路的供电,3V,给南桥内部的CMOS芯片(RAM)供电。
RTCRST#:南桥RTC电路的复位信号,3V。
ICH9以后增加了一个RTC复位信号,名字是SRTCRST#32.768KHz:南桥得到了VCCRTC和RTCRST#后,给晶振供电,晶振起振。
晶振两脚电压0.1-0.5V之间V5REF_SUS:5V待机电压。
VCCSUS3_3:3.3V待机电压。
VCCSUS1_05:南桥内部产生给自己供电的1.05V,不用管。
RSMRST#:通知南桥3.3V待机电压正常,电压3.3V,受控于外部电路。
SUSCLK:南桥收到RSMRST#后发出的32K时钟,大多数老机器不采用,可以忽略,新机器发给EC。
$ t0 s, h1 D* N; H7 y; [ PWRBTN#:POWER BUTTON,电源按钮,3.3V-0-3.3V脉冲信号,下降沿触发。
/ _: r" l8 u% sSLP_S5#:3.3V,南桥退出关机状态的控制信号。
% [' ?) m6 S, O" E+ Z; ISLP_S4#:3.3V,南桥退出休眠状态的控制信号。
(一般S5#和S4#只采用一个,用来控制产生内存供电,另一个空着。
Skyworks Si4731 演示板使用手册说明书

Si4731-DEMOS I4731 演示板使用手册1. 特性⏹支持全球范围内的所有FM频带, 76–108 MHz⏹支持全球范围内的所有AM频带, 520–1710 kHz⏹自动搜索 / 全频带扫描⏹同时支持48个 FM 和48个 AM 电台存储⏹FM 无线数据服务 (RDS) 解码功能 (Pi Pty Ps RT CT AF 显示)⏹根据RDS信息自动调整时间/日期⏹自动切换备选频率(AF)⏹自动检测并设置AM 步长⏹单电池(最低电压0.9 V)或三节电池工作模式⏹可调整的参数包括:● 信道步长● 自动搜索有效台时SNR/RSSI 参考门限值● 软静音的 SNR/RSSI参考门限值● 信道滤波器带宽● 立体声和单声道的混合度门限值● 频带的上下端限制● 预加重(50 us or 75 us)● AM 步长检测判断的门限值⏹立体声指示⏹带静音功能的音量控制功能⏹AM/FM 信道频率显示及信道信号质量显示⏹电池电压显示⏹万年历功能⏹ 3 x 4 矩阵键盘控制接口⏹ 数字健直接输入电台频率功能2. 产品简介3. 产品简介这套 Skyworks Si4731 演示板所实现的AM/FM 收音机设计方案具有大量的增强特性,这些特性充分展示了Skyworks 的AM/FM 及MCU 芯片的强大功能。
Si4731芯片采用20 管脚的3 x 3mm QFN封装,这与 Skyworks 的所有具有FM 接收,发射及收发功能的Si47xx 系列兼容。
主控芯片采用 Skyworks的内部带振荡器和DC-DC 的C8051F930 MCU。
显示部分采用了一款79 x 101的点阵型LCD,能够显示包括RDS信息在内的各种信息。
整个演示板可由3节AAA电池供电或者一节AA电池通过C8051F930 MCU内部的dc-dc转换器供电。
SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Si4731-DEMO2SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•4. DescriptionFigure 1 and Figure 2 shows the physical layout of the board with key components indicated.Figure 1.Si4731-DEMO Board Top Side in Calendar ModeFigure 2.Si4731-DEMO Board Bottom SideU3J5Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 3Power:S14: 3 cell / 1 cell selection S15: Power on / offAudio connectors:J14: Audio input (unused)J15: Audio headphone output Antenna selections:J1: FM whip antenna connectorJ2: FM SMA connector for FM conductive testing J3: AM SMA connector for AM conductive testing J4: AM air loop antenna wire connector J5: JTAG connectorT1: Transformer for AM air loop operation (not shown)JP1: FM antenna input selectionJP2: AM signal input selectionJP3: AM antenna type selectionOpen: AM ferrite loop stick antenna Short: AM air loop antenna JP4: FM PCB antenna selectionShort: Embedded PCB trace as FM short antenna for Si4704/05/1x/2x Open: No PCB short antennaMain components:LCD: 79x101 dot matrix LCDU1: Skyworks Solutions Si4731 AM/FM/RDS tuner U2: Audio amplifierU3: Skyworks Solutions C8051F930 MCU U4: LDOControl interface:Reset Key: Reset buttonKeyPad: 3x4 matrix buttons for human interface1-2: FM SMA (J2)1-3: FM whip antenna (J1)1-4: FM headphone (J15)4211-2: AM ferrite loop stick 1-3: AM air loop (J4)1-4: AM SMA (J3)341Si4731-DEMO4SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•5. OperationThis section describes the operating modes of the Si4731-DEMO board. The board provides two major modes of operation: Calendar and AM/FM radio.5.1. Calendar ModeUpon power on, the board automatically enters the Calendar Mode and displays the following information:⏹ Year-month-day ⏹ Hour-minute ⏹ Day of the week ⏹ Battery voltageThe demo board display in Calendar Mode is illustrated in Figure 1.In Calendar Mode, the SET/9 key is used to enter the setup menu. The M+/3 and M-/7 keys are used to select different adjustable items (hour, minutes, year, day, month). The UP/4 and DOWN/8 keys are used to set the value for each selected item.The Calendar Mode date and time can also be set automatically with RDS Current Time (CT) information from a broadcast radio station as described in the following section.5.2. AM/FM Radio ModeFrom Calendar Mode, the POWER button is used to enter AM/FM Radio Mode which displays the following information:1.Signal SNR indicator2.Signal RSSI indicator3.Band frequency indicator4.Battery voltage indicator5.Band frequency unit indicator6.Stereo/mono indicator7.Volume indicator8.Band indicator9.RDS informationThe demo board display in AM/FM Radio Mode is illustrated in Figure 3 and Figure 4:Figure 3.LCD Display in FM Radio Mode712345689Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 5Figure 4.LCD Display in AM Radio Mode5.2.1. Band SelectionIn Radio Mode, the BANDS/0 key is used to switch between the AM and FM bands.5.2.2. Time/Date Auto SetMany radio stations broadcast RDS data including clock/time CT information. The AM/FM demo board can capture this information to automatically set the time and date. In FM Mode, when RDS CT information is received, the CT indicator will be displayed. The MEM/AL/1 button can be used to update the calendar date and time with the CT information. CT information is not available on all radio stations and is normally sent only once per minute.5.2.3. Alternative Frequency (AF) SwitchingThe AM/FM demo board monitors RDS for alternate frequency (AF) information. When RDS alternative frequency information is received, the AF indicator will be displayed. If the signal quality of the currently tuned station degrades, the radio will automatically change to one of the alternative frequency stations.5.2.4. Tune/SeekIn Radio Mode, pressing the UP/4 or DOWN/8 button for less than 0.5s will tune the frequency by the preset step size. Holding the button for longer than 0.5 s but less than 3 s will perform a station seek.5.2.5. ScanIn Radio Mode, the MSCAN/5 button is used to scan for all valid stations in the selected band and will automatically save them into preset selections. After a scan operation, the M+/3 and M-/7 keys will cycle through the preset station list. Scan operation can be aborted by pressing MSCAN/5 again, or by pressing the UP/4 or DOWN/8 key.5.2.6. Parameter SettingsIn Radio Mode, the SET/9 key is used to select the parameter setup menu as illustrated in Figure 5 and Figure 6.The M+/3 or M-/7 keys will cycle through the available items in the menu. The UP/4 or DOWN/8 keys are used to set the desired value for each item. Select “Yes” under “Factory Def” to go back to the factory default settings for all items.1324758Si4731-DEMO6SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Figure 5.LCD Display in FM Setup MenuFigure 6.LCD Display in AM Setup Menu5.2.7. Digit KeysIn Radio Mode, the FUNC/DIGIT key is used to switch the keypad to digital input mode. A “Dig” indicator is displayed in this mode and all keys marked with a digit are used to input a channel frequency. A frequency is considered valid if it lies within the band limits. If a non-valid frequency is entered, the closest band limit will be entered and displayed.5.2.8. VolumeThe VOL+/2 or VOL–/6 keys are used to adjust the volume up or down. The board audio output will be muted when volume is at the lowest setting.5.2.9. AM Channel Spacing Auto SetIn AM Mode, the MEM/AL/1 key will automatically detect and set the channel spacing to either 9 or 10kHz. The detection criterion determines which channel spacing results in more valid stations during a band scan. The number for the detection threshold is adjustable as described in Table 2. This operation can be aborted by pressingthe MEM/AL/1 key again.Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 76. Human interfaceThere are 12 keys for controlling the demo board as shown in Figure 7:Figure7.Human Interface KeysEach key can have a different function under each operating condition:⏹ Calendar/Powerdown Mode: Radio function is disabled. LCD displays Calendar. Buttons can be used to settime, etc.⏹ Radio AM/FM Mode: Tuner IC works in powerup mode (FM or AM). Radio function is enabled. LCD displaysthe radio station parameters. Buttons are used to adjust radio settings.⏹Digital Input Mode : Tuner IC works in powerup mode (FM or AM). Radio function is enabled. LCD displaysthe radio station parameters. The buttons are used for direct digit input of station frequencies.The functions of the buttons are summarized in Table 1:Table 1. Key Function DescriptionButton/Mode Calendar ModeTuner Off Radio AM/FM ModeTuner OnMEM/AL/1None FM Mode: Used to adjust calendar using received RDS CT.AM Mode: Used to automatically detect and set the channel spacing.POWER Enable radio Disable radio function and enter calendar mode.(Radio parameters will be saved to Flash).SET Enter calendar setupmenuEnter radio setup menu. (Parameter list in Table 2)BANDSNoneChange between FM and AM band.Note:Combination keying is entered and exited from Radio Mode by pressing and holding the SET key then pressing theBANDS key. A combination of the SET and the MSCAN keys will cycle through the available display items.Si4731-DEMO8SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•The FM and AM radio parameters which can be configured from setup menu are listed below in Table 2.UP/DOWNHold Time < 0.5s In setup menu, change the current calendar item by onestep.In setup menu, change the current parameter by one step.In radio mode, tune up or down by one step.0.5s <Hold Time < 3s Perform a station seek.Hold Time > 3s Fast parameter setting Fast parameter setting.MSCAN NoneScan for all valid stations and save them to presets.M+/ M– In setup menu, select next calendar item.In setup menu, select next adjustable item.In radio mode, tune to the next preset station.Vol+ / Vol–< 3s NoneIncrease or decrease volume 1 step.> 3sQuickly increase or decrease volume.FUNC/DIGIT None Shift the keyboard between normal function and digital input mode.Combination keyingNone A: Radio IC version B: Firmware version C: Varactor reading D: AGC statusTable 2. Radio Configuration ParametersFM ParameterAM ParameterSpacing: 50/100/200kHz Default: 100kHz Spacing: 1/9/10kHz Default: 9 kHzRSSI Seek: 0–127dBµV Default: 20dBµV RSSI Seek: (0–63dBµV Default: 25dBµV SNR Seek: 0–127 dB Default: 03dBSNR Seek: 0–63dB Default: 05dBPre-emphasis: 50 or 75µs Default: 75µsPre-emphasis: 00 disable, 50µs Default: 00Band High Threshold: Max 108MHz Default:107.90MHzBand High Threshold: Max 1710kHz Default:1710kHzTable 1. Key Function Description (Continued)Button/Mode Calendar Mode Tuner Off Radio AM/FM ModeTuner OnNote:Combination keying is entered and exited from Radio Mode by pressing and holding the SET key then pressing theBANDS key. A combination of the SET and the MSCAN keys will cycle through the available display items.Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 9Band Low Threshold: min 76MHz Default: 87.50MHzBand Low Threshold: min 520 kHz Default: 522kHzChannel Filter: 00/40/60/80/100kHz Default: 00 (Auto)Channel Filter: 1/2/3/4/6 kHz Default: 2kHz RClock: 0: AFC disable 32763~32773Default: 32768RClock: 0 AFC disable 32763~32773Default: 32768Smute Rate: 0–255Default: 64Smute Rate: 0–255Default: 64Smute SNR: 0–15dB Default: 4dBSmute SNR: 0–63dB Default: 10dBSmute Attenuation: (0–31dB)Default: 16dBSmute Attenuation: 0–63dB Default: 16dB Blend Mono: 0–127dBµV Default: 30dBµVSmute Slop: 1–5Default: 2Blend Stereo: 0–127dBuV Default: 49dBuV Set Factory Default: on/off Default:offAGC Override: on/off Default: off AM Channel Spacing Detection Threshold: 1,2,3,4,5,6 Default = 2AGC Index: 0–26Default : 0Set Factory Default: on/off Default:off RDS/RBDS Default: RBDSTable 2. Radio Configuration Parameters (Continued)Si4731-DEMO7. Bill of Materials⏹ C8051F930 MCU with 64kB Flash program memory, 4kB RAM, and built-in dc-dc converter⏹ AM/FM receiver IC Si4731 with external 32768Hz crystal oscillator support⏹ ST7588T LCD driver IC⏹ LM4910 Audio amplifier IC⏹ See Table3 for details.Table 3. Si4731 Demo Board Bill of MaterialsItem Qty Reference Description Value13C1, C16, C29 CAP,SM,0603,X7R0.47µF22C4, C13CAP,SM,0603,X7R 4.7µF38C15, C23-28, C41 CAP,SM,0603,X7R1µF46C10, C14, C19, C37, C39–40 CAP,SM,0603,X7R0.1µF54C2 ,C3, C21–22 CAP,SM,0603,X7R22pF62C8, C12 CAP,SM,0603,X7R220pF72C11, C18 CAP,SM,0603,X7R820pF83C5–7 CAP,SM,0603,X7R100pF94C17, C38, C44, C46 CAP,SM,0603,X7R1nF108C32–36, C54–C55 ,C43 CAP,SM,0603,X7R NP113C30 ,C45, C53 RES,SM,06030R121C9 CAP,SM,1210,tantalum100µF/6.3V 131C31 CAP,SM,1210,tantalum220µF/4V 144R1–2, R3 ,R25 RES,SM,06030R 1511R7, R27, R29–32, R34, R36–39 RES,SM,060310kW162R5, R11 RES,SM,060312kW174R20, R22–23, R28 RES,SM,06031kW182R4,R6 RES,SM,06035k6192R8, R10 RES,SM,06036k8 203R9, R16–17 RES,SM,06032kW212R18–19 RES,SM,0603100R 225R15, R21 ,R24, R26 ,R35 RES,SM,0603NP 231R12 RES,SM,06034k7 243R13–14, R33 RES,SM,0603100k 254B1–4 FERRITE BEAD,SM,08052k5/100M 261L1 IND,SM,0603120nH10SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•Si4731-DEMOSkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************• 11271L2 IND,SM,0603270nH 282L3–4 RES,SM,06030R 291U1 Si47xx, MLP20-3MM Si47xx 301U2LM4910,SOP8 LM4910MA 311U4REGLATOR,SOT23 XC62FP3002MR 321U3C8051F920/30-GQ,LQFP32 C8051F920/30-GQ331D1DIODE,SM,ESD,SOT23BAV99 342D2–4DIODE,SM,ESD,SOT23CM1214-01ST/SO351Q1TRANSISTOR NPN SOT232N3904361T1 MW AIR LOOP ANTENNA TRANS -FORMERSLMWTF01371J5 CONN,TH,2X10,HDR381J4 Wire holder 392Y1–2 Crystal32.768kHz 402J14–15 Stereo earphone jack 3.5mm 412JP3–4 CONN,TH,1X2,HDR CONN,TH,1X2,HDR 422JP1–2 CONN,TH,1X4,HDR CONN,TH,1X4,HDR 434J10–13 CONN,TH,1X5,HDR CONN,TH,1X5,HDR441J1 BNC_VERTICAL BNC for whip 452J2-3 SMA_VERTICALSMA for FM/AM461S14SLIDE SWITCH With 3 Double Pole Double Throw Switches inside 471S15Single Pole Double Throw Switch4813S1–13 Button Switch491LCD1 LCD101*79 dots 501ANT2 MW ferrite antenna 220µH 511ANT3 MW loop antenna 10–20µH 521BAT2Battery BOX ,AAA*3 SIZE 531BAT1Battery BOX ,AA SIZEDC–DC Power Block Circuit Part List 541L5IND,SM,10080.68µH 551C42CAP ,SM,0603,X7R4.7µFTable 3. Si4731 Demo Board Bill of Materials (Continued)Si4731-DEMO12SkyworksSolutions,Inc.•Phone[781]376-3000•Fax[781]376-3100•*********************•8. SchematicsF i g u r e 8.S i 4731-D E M O B o a r d S c h e m a t i c —R a d i o a n d A u d i o P o r t i o n sCopyright © 2021 Skyworks Solutions, Inc. All Rights Reserved.Information in this document is provided in connection with Skyworks Solutions, Inc. (“Skyworks”) products or services. These materials, including the information contained herein, are provided by Skyworks as a service to its customers and may be used for informational purposes only by the customer. Skyworks assumes no responsibility for errors or omissions in these materials or the information contained herein. Skyworks may change its documentation, products, services, specifications or product descriptions at any time, without notice. Skyworks makes no commitment to update the materials or information and shall have no responsibility whatsoever for conflicts, incompatibilities, or other difficulties arising from any future changes.No license, whether express, implied, by estoppel or otherwise, is granted to any intellectual property rights by this document. Skyworks assumes no liability for any materials, products or information provided hereunder, including the sale, distribution, reproduction or use of Skyworks products, information or materials, except as may be provided in Skyworks’ Terms and Conditions of Sale.THE MATERIALS, PRODUCTS AND INFORMATION ARE PROVIDED “AS IS” WITHOUT WARRANTY OF ANY KIND, WHETHER EXPRESS, IMPLIED, STATUTORY, OR OTHERWISE, INCLUDING FITNESS FOR A PARTICULAR PURPOSE OR USE, MERCHANTABILITY, PERFORMANCE, QUALITY OR NON-INFRINGEMENT OF ANY INTELLECTUAL PROPERTY RIGHT; ALL SUCH WARRANTIES ARE HEREBY EXPRESSLY DISCLAIMED. SKYWORKS DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION, TEXT, GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS. SKYWORKS SHALL NOT BE LIABLE FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO ANY SPECIAL, INDIRECT, INCIDENTAL, STATUTORY, OR CONSEQUENTIAL DAMAGES, INCLUDING WITHOUT LIMITATION, LOST REVENUES OR LOST PROFITS THAT MAY RESULT FROM THE USE OF THE MATERIALS OR INFORMATION, WHETHER OR NOT THE RECIPIENT OF MATERIALS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGE.Skyworks products are not intended for use in medical, lifesaving or life-sustaining applications, or other equipment in which the failure of the Skyworks products could lead to personal injury, death, physical or environmental damage. Skyworks customers using or selling Skyworks products for use in such applications do so at their own risk and agree to fully indemnify Skyworks for any damages resulting from such improper use or sale.Customers are responsible for their products and applications using Skyworks products, which may deviate from published specifications as a result of design defects, errors, or operation of products outside of published parameters or design specifications. Customers should include design and operating safeguards to minimize these and other risks. Skyworks assumes no liability for applications assistance, customer product design, or damage to any equipment resulting from the use of Skyworks products outside of Skyworks’ published specifications or parameters.Skyworks, the Skyworks symbol, Sky5®, SkyOne ®, SkyBlue™, Skyworks Green™, Clockbuilder ®, DSPLL ®, ISOmodem ®, ProSLIC ®, and SiPHY ® are trademarks or registered trademarks of Skyworks Solutions, Inc. or its subsidiaries in the United States and other countries. Third-party brands and names are for identification purposes only and are the property of their respective owners. Additional information, including relevant terms and conditions, posted at , are incorporated by reference.PortfolioQuality/qualitySupport & Resources/support。
半导体组件 CSPEMI205G 3 通道耳机麦克风 EMI 滤波器及 ESD 保护器 用户手册说明

CSPEMI205G3-Channel Headset Microphone EMI Filter with ESD ProtectionProduct DescriptionThe CSPEMI205G is a low−pass filter array integrating three pi−style filters (C−R−C) that reduce EMI/RFI emissions while at the same time providing ESD protection. This part is custom−designed to interface with the headset port on a cellular telephone, and contains two different filter values. Each high quality filter provides more than 30 dB attenuation in the 800−2700 MHz range. These pi−style filters support bidirectional filtering, controlling EMI both to and from the microphone and speaker elements. They also support bipolar signals,enabling audio signals to pass through without distortion.In addition, the CSPEMI205G provides a very high level of protection for sensitive electronic components that may be subject to electrostatic discharge (ESD). The input pins safely dissipate ESD strikes of ±8 kV, the maximum requirement of the IEC 61000−4−2 international standard. Using the MIL−STD−883 (Method 3015) specification for Human Body Model (HBM) ESD, the device provides protection for contact discharges to greater than ±15 kV. The CSPEMI205G is particularly well−suited for portable electronics (e.g. cellular telephones, PDAs, notebook computers) because of its small package format and low weight. The CSPEMI205G is available in a space−saving, low−profile Chip Scale Package with RoHS compliant lead−free finishing.Features•Three Channels of EMI Filtering, Two for Earpiece Speakers and One for a Microphone•Pi−Style EMI Filters in a Capacitor−Resistor−Capacitor (C−R−C) Network•Chip Scale Package Features Extremely Low Parasitic Inductance for Optimum Filter Performance•Greater than 30 dB Relative Attenuation in the 800−2700 MHz Range•±8 kV ESD Protection on each Channel(IEC 61000−4−2 Level 4, Contact Discharge)•±15 kV ESD Protection on each Channel (HBM)•8−Bump, 1.41 x 1.430 mm Footprint Chip Scale Package (CSP)•These Devices are Pb−Free and are RoHS Compliant Applications•EMI Filtering and ESD Protection for Headset Microphone and Speaker•Cellular / Mobile Phones•Notebooks and Personal Computers•Handheld PCs / PDAs / Tablets•Wireless Handsets•Digital CamcordersMARKING DIAGRAMDevice Package Shipping†ORDERING INFORMATIONCSPEMI205G CSP−8(Pb−Free)3500/T ape & ReelWLCSP8CASE 567BE†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.AF= CSPEMI205GAF+ELECTRICAL SCHEMATICEarpiece 1Earpiece 1OutputEarpiece 2Earpiece 2OutputMicrophoneInputMicrophone OutputGND GNDTable 1. PIN DESCRIPTIONS8−bump CSP PackagePin Name DescriptionA1EAR1_IN Earpiece Input 1 (from audio circuitry)A3EAR2_IN Earpiece Input 2 (from audio circuitry)A5MIC_IN Microphone Input (from microphone)B2GND Device Ground B4GND Device GroundC1EAR1_OUT Earpiece Output 1 (to earpiece)C3EAR2_OUT Earpiece Output 2 (to earpiece)C5MIC_OUTMicrophone Output (to audio circuitry)PACKAGE / PINOUT DIAGRAMSO r i e n t a t i o n M a r k i n gCSPEMI205CSP PackageTop View(Bumps Down View)Bottom View (Pins Up View)i e n t a t i o n M a r k i n gSPECIFICATIONSTable 2. ABSOLUTE MAXIMUM RATINGSParameterRating Units Storage Temperature Range −65 to +150°C DC Power per Resistor 100mW DC Package Power Rating300mW Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability.Table 3. STANDARD OPERATING CONDITIONSParameterRating Units Operating Temperature Range−40 to +85°CTable 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)Symbol ParameterConditionsMin Typ Max Units R 1Resistance 91011W R 2Resistance 546875W C 1Capacitance 80100120pF C 2Capacitance384757pF I LEAK Diode Leakage Current V IN = 5.0 V 1.0m A V SIGSignal Voltage Positive Clamp Negative ClampI LOAD = 10 mA5−157−1015−5VV ESDIn −system ESD Withstand Voltagea) Human Body Model, MIL −STD −883, Method 3015b) Contact Discharge per IEC 61000−4−2 Level 4(Notes 2 and 4)±15±8kVV CLClamping Voltage during ESD Discharge MIL −STD −883 (Method 3015), 8 kV Positive Transients Negative Transients (Notes 2, 3 and 4)+15−19Vf C1Cut −off frequency 1; (Note 5)R = 10 W , C = 100 pF 34MHz f C2Cut −off frequency 2; (Note 5)R = 68 W , C = 47 pF63MHz1.T A = 25°C unless otherwise specified.2.ESD applied to input and output pins with respect to GND, one at a time.3.Clamping voltage is measured at the opposite side of the EMI filter to the ESD pin. For example, if ESD is applied to Pin A1, then clamping voltage is measured at Pin C1.4.Unused pins are left open.5.Z SOURCE = 50 W , Z LOAD = 50 WPERFORMANCE INFORMATIONTypical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)Figure 1. Earpiece Circuit (A1−C1) EMI Filter PerformancePERFORMANCE INFORMATION (Cont’d)Typical Filter Performance (nominal conditions unless specified otherwise, 50 W Environment)Figure 2. Earpiece Circuit (A3−C3) EMI Filter PerformanceFigure 3. Microphone Circuit (A5−C5) EMI Filter PerformanceAPPLICATION INFORMATIONParameterValue Pad Size on PCB0.240 mm Pad Shape RoundPad Definition Non −Solder Mask defined padsSolder Mask Opening 0.290 mm Round Solder Stencil Thickness0.125 mm − 0.150 mm Solder Stencil Aperture Opening (laser cut, 5% tapered walls)0.300 mm Round Solder Flux Ratio 50/50 by volumeSolder Paste Type No CleanPad Protective FinishOSP (Entek Cu Plus 106A)Tolerance − Edge To Corner Ball ±50 m m Solder Ball Side Coplanarity±20 mm Maximum Dwell Time Above Liquidous60 seconds Maximum Soldering Temperature for Lead −free Devices using a Lead −free Solder Paste260°CNon −Solder Mask Defined Pad0.240 mm DIA.Solder Stencil Opening0.300 mm DIA.Solder Mask Opening0.290 mm DIA.Figure 4. Recommended Non −Solder Mask Defined Pad IllustrationFigure 5. Lead −free (SnAgCu) Solder Ball Reflow ProfileTime (minutes)T e m p e r a t u r e (5C )WLCSP8, 1.43x1.41CASE 567BE−01ISSUE ODATE 26 JUL 2010NOTES:1.DIMENSIONING AND TOLERANCING PERASME Y14.5M, 1994.2.CONTROLLING DIMENSION: MILLIMETERS.3.COPLANARITY APPLIES TO SPHERICALCROWNS OF SOLDER BALLS.2XDIMAMIN MAX0.56MILLIMETERSA1D 1.43 BSCEb0.290.35eD0.50 BSC0.650.210.271.41 BSCeE0.435 BSC0.25DIMENSIONS: MILLIMETERS*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.SOLDERING FOOTPRINT*BOTTOM VIEWA20.40 REFRECOMMENDED MECHANICAL CASE OUTLINEPACKAGE DIMENSIONSON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor thePUBLICATION ORDERING INFORMATIONTECHNICAL SUPPORTNorth American Technical Support:Voice Mail: 1 800−282−9855 Toll Free USA/Canada Phone: 011 421 33 790 2910LITERATURE FULFILLMENT :Email Requests to:*******************onsemi Website: Europe, Middle East and Africa Technical Support:Phone: 00421 33 790 2910For additional information, please contact your local Sales Representative。
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Printed by Jouve, 75001 PARIS (FR)(19)E P 3 522 098A 1TEPZZ¥5 Z98A_T(11)EP 3 522 098A1(12)EUROPEAN PATENT APPLICATION(43)Date of publication:07.08.2019Bulletin 2019/32(21)Application number: 19155364.3(22)Date of filing: 04.02.2019(51)Int Cl.:G06Q 40/04(2012.01)(84)Designated Contracting States:AL AT BE BG CH CY CZ DE DK EE ES FI FR GB GR HR HU IE IS IT LI LT LU LV MC MK MT NL NO PL PT RO RS SE SI SK SM TR Designated Extension States: BA MEDesignated Validation States: KH MA MD TN(30)Priority:06.02.2018US 201815889751(71)Applicant: Chicago Mercantile Exchange, Inc.Chicago, IL 60606 (US)(72)Inventors:•SINGH, InderdeepChicago, IL Illinois 60606 (US)•MALABRE, Frederic Cedric Chicago, IL Illinois 60606 (US)•STUDNITZER, Ari L.Chicago, IL Illinois 60606 (US)•GEDDES, David John Chicago, IL 60606 (US)(74)Representative: Boult Wade Tennant LLP5th Floor, Salisbury Square House 8, Salisbury Square London EC4Y 8AP (GB)(54)MESSAGE TRANSMISSION TIMING OPTIMIZATION(57)Systems and methods are provided for mes-sage transmission timing optimization. The system re-ceives a large market disrupting transaction and providesa transaction placement strategy that splits up the trans-action to maximizes favorable execution value and min-imizes time required to execute the entire transaction.EP 3 522 098A12510152025303540455055Description BACKGROUND[0001] A financial instrument trading system, such as a futures exchange, referred to herein also as an "Ex-change", such as the Chicago Mercantile Exchange Inc.(CME), provides a contract market where financial prod-ucts/instruments, for example futures and options on fu-tures, are traded. Futures is a term used to designate all contracts for the purchase or sale of financial instruments or physical commodities for future delivery or cash set-tlement on a commodity futures exchange. A futures con-tract is a legally binding agreement to buy or sell a com-modity at a specified price at a predetermined future time,referred to as the expiration date or expiration month. An option is the right, but not the obligation, to sell or buy the underlying instrument (in this case, a futures contract)at a specified price within a specified time. The commod-ity to be delivered in fulfillment of the contract, or alter-natively, the commodity, or other instrument/asset, for which the cash market price shall determine the final set-tlement price of the futures contract, is known as the con-tract’s underlying reference or "underlier." The terms and conditions of each futures contract are standardized as to the specification of the contract’s underlying reference commodity, the quality of such commodity, quantity, de-livery date, and means of contract settlement. Cash Set-tlement is a method of settling a futures contract whereby the parties effect final settlement when the contract ex-pires by paying/receiving the loss/gain related to the con-tract in cash, rather than by effecting physical sale and purchase of the underlying reference commodity at a price determined by the futures contract price.[0002]Some products on an exchange are traded in an open outcry environment where the exchange pro-vides a location for buyers and sellers to meet and ne-gotiate a price for a quantity of a product. Other products are traded on an electronic trading platform (e.g., an elec-tronic exchange), also referred to herein as a trading plat-form, electronic trading system, trading host or Exchange Computer System, where market participants, e.g. trad-ers, use software to send orders to the trading platform.The order identifies the product, the quantity of the prod-uct the trader wishes to trade, a price at which the trader wishes to trade the product, and a direction of the order (i.e., whether the order is a bid, i.e. an offer to buy, or an ask, i.e. an offer to sell). It will be appreciated that there may be other order types or messages that traders can send including requests to modify or cancel a previously submitted order.[0003]The speed in which trades are executed through electronic trading systems provide many benefits. Elec-tronic trading systems can facilitate a large number of market transactions. The greater the number of market transactions, the greater a market’s liquidity. In liquid markets, prices are driven by competition; prices reflect a consensus of an investment’s value; and trading sys-tems provide a free and open dissemination of informa-tion. With the advent of improved computational and communications capabilities, the speed and efficiency with which traders may receive information and trade in electronic trading systems has greatly improved. Algo-rithmic and high frequency trading utilize computers to quickly analyze market information and place trades al-lowing traders to take advantage of even the smallest movements in prices.[0004]Unfortunately, this improved speed and effi-ciency also improves the speed at which problems may occur and propagate, such as where the market ceases to operate as intended, i.e. the market no longer reflects a true consensus of the value of traded products among the market participants. Such problems are typically ev-idenced by extreme market activity such as large chang-es in price, whether up or down, over a short period of time or an extreme volume of trades taking place.[0005]In particular, traders, whether human or elec-tronic, may not always react in a rational manner, such as when presented with imperfect information, when act-ing in a fraudulent or otherwise unethical manner, and/or due to faulty training or design. For example, while com-munications technologies may have improved, inequities in access to information and opportunities to participate still exist, which may or may not be in compliance with legislative, regulatory and/or ethical rules, e.g. some trad-ers receive information before other traders, some trad-ers may be able to place trader orders more quickly than others. In many cases, irrational trader behavior may be triggered by a market event, such as a change in price,creating a feedback look where the initial irrational reac-tion may then cause further market events, such as a continued price drop, triggering further irrational behavior and an extreme change in the price of the traded product in a short period of time. High speed trading exacerbates the problem as there may be little time for traders, or those overseeing them, to contemplate their reactions before significant losses may be incurred. Furthermore,improved communication among traders facilitates prop-agation of irrational behavior in one market to other mar-kets as traders in those other markets react to the results of the irrational behavior.[0006]Some integrity systems prevent undesirable changes in values over time or undesirable gaps between reference and received or incoming values. To mitigate risk and ensure a fair and balanced market, electronic trading systems need to provide mechanisms to rapidly detect and respond to situations where a market is not operating in a fair and balanced manner or otherwise where the market value is not reflective of a true consen-sus of the value of the traded products among the market participants. In addition, to ensure a fair and balanced market, electronic trading systems need to provide mech-anisms that allow legitimate transactions to proceed.12。