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spectramax iD5多模式微量板阅读器使用手册说明书

spectramax iD5多模式微量板阅读器使用手册说明书

SpectraMax iD5Multi-Mode Microplate Reader Y our all access pass to your next breakthrough2SpectraMax iD5 Multi-Mode Microplate ReaderFive-mode microplate reader with automatic filter identification and western blot capabilityThe SpectraMax® iD5 Multi-Mode Microplate Reader is the complete laboratory solution to help you increase your research capabilities and comes with built-in absorbance, fluorescence, luminescence, time-resolved fluorescence (TRF), and tunable fluorescence polarization (FP) read modes. In addition, the SpectraMax iD5 reader can be expanded to include bottom-read luminescence, TR-FRET, HTRF®, BRET, dual luciferase reporter assays with injectors, and western blot detection.With optimized reagents and the industry-leading data acquisition and analysis tool, SoftMax® Pro 7 Software, the SpectraMax iD5 reader is your all access passto helping you unleash your brilliance.UNLEASH YOUR BRILLIANCESpectraMax iD5 Multi-Mode Microplate Reader3Y our all access pass to personalized workflowsBuilt-in near-field communication (NFC) functionality in the SpectraMax iD5 reader enables you to pull up your custom protocols with a single tap, saving you precious time better spent on your research.Using built-in near-field communication (NFC) tags, the SpectraMax iD5 reader automatically detects the identification code of the filter to recognize the slide and filter configuration, eliminating confusion and simplifying your filter workflow.It features a large, high-resolution touchscreen interface with embedded SoftMax T ouch Software allowing you to set up custom protocols, take advantage of preloaded protocols, and run your experiment without the need for a dedicated computer workstation.A complete solution to answer all your research needsThe SpectraMax iD5 reader measures absorbance, fluorescence, luminescence, TRF, FP, and much more. The superior optical system includes a xenon flash lamp and features an ultra-cooled photomultiplier tube (PMT) that reduces background noise for excellent sensitivity and a wide dynamic range.Featuring temperature control up to 66°C, linear, orbital, and doubleorbital shaking, a four-monochromator optical pathway with high efficiency gratings, option to use filters or a hybrid mix of monochromator and filter-based reads, well scanning up to a 20x20 read matrix, spectral scanning and detection of plate formats from 6- to 384-wells, the SpectraMax iD5 reader is the complete solution for all your research needs.Key features4Automatic filter identificationUsing built-in near-fieldcommunication (NFC) tags, theSpectraMax iD5 reader automatically detects the identification code of the filter to recognize the slide and filter configuration, eliminating confusionand simplifying your filter workflow.Western blot capableThe SpectraMax iD5 reader, utilizing an optional enhanced TRF detection module, is capable of scanning and analyzing your membranes for western blot data. The Europium-incubated membranes are resistant to photo bleaching and allow you to read the membranes without loss of signal for longer periods.Flexible temperature controlSimple-to-use temperature control allows you to adjust your experiment’s conditions from ambient up to 66°C, expanding your laboratory’s capabilities to include temperature sensitive assays.Intuitive touchscreenEasy-to-use touchscreen interface allows you to easily set up your experiments, use preconfigured protocols, or view tutorial videos.Enhanced securityIn busy, multi-user labs, reader access control is crucial. The SoftMax T ouch Software secures user accounts with PIN- or NFC-protection and features a lock screen option for long kinetic reads. Data is stored on the reader’s hard drive ensuring safe data storage before, during, and after transfer to a computer for analysis.Capture flash assays with easeThe SpectraMax iD5 reader isinjector-ready allowing you to expand your lab’s capabilities to include flash applications such as dual luciferase and ATP assays. The SpectraMax Injector System with SmartInject™T echnology features low dead volume (10 µL), overflow protection, andensures equal mixing across the platefor high-precision experiments.5Reduce the amount of time you spend collecting data and increase your productivity. The SpectraMax iD5 reader allows you to interact with your data any way you want from anywhere you want. View your data quickly using the large touchscreen interface, export your data to a USB drive for analysis in the program of your choice, or analyze your data using the industry’s leading data acquisition and analysis tool, SoftMax Pro 7 Software. The SpectraMax iD5 reader also features networkconnectivity that allows you to walk away from the instrument to focus on additional research. Data is automatically deliveredto any workstation on the same network, eliminating the need to physically retrieve data from the instrument.View data on the large touchscreen for quick drive for analysis in the program of your choice for advanced data acquisition and analysisAutomatically send data to any workstation on theExpanded read mode capabilitiesEquipped for high performance, the SpectraMax iD5 is red-shifted assays can be read with great sensitivity using the iD5 reader’s filter system. Specialized filters allow for IR fluorescence detection ranging from 10-40 times more sensitive than conventional monochromator detectionreader. With the novel filter system, assays such as hydrogen peroxide detection assays and IRantibody-binding assays can be run confidently with Molecular Devices set of IR filters.QuickSync data push technologySpectraMax iD5 Multi-Mode Microplate ReaderReliable performance with a proven track recordBuilt on a foundation of excellenceFor nearly 30 years, Molecular Devices has provided scientists with tools to expand the boundaries of their research. Ourmicroplate readers are the industry’s most cited instruments and have empowered life science researchers to advanceprotein and cell biology, breaking the barriers to novel, landmark discoveries. The SpectraMax iD5 reader is built on the same foundation that has made our entire SpectraMax microplate reader product line among the most trusted in the industry.An ATP standard curve spanning five decades was run using the ATPlite 1step Luminescence Assay System (PerkinElmer) on the SpectraMax iD5 reader. Standard concentrations ranged from 1x10-11 M to 1x10-6 M. A wide linear dynamic range ensures accurate assay results across a broad span of sample types. Standards were plotted using a log-log curve fit in SoftMax Pro Software.The SpectraMax iD5 reader is fully compatible with the SpectraDrop™ Micro-Volume Microplate, enabling quantitation of precious low-volume samples. 4-µL DNA standards from 2 ng/µL to 1000 ng/µL were read in absorbance detection mode with a preconfigured protocol in SoftMax Pro Software. Performance matching the 2 ng/µL sensitivity specification is demonstrated here.ATP concentration (M)R L UDNA (ng/µL)O D 260SoftMax Pro GxP Compliance SoftwareParallel Line AnalysisConc log [ng/ML]R L USecure, traceable electronic recordkeeping• C ontrolled user access through a granular permission structure and unique logins • E lectronic signature support for verification, authorization, and approval • A udit trails to document the history of user actions for each data file • L ocal and remote administration of user accounts for straightforward deploymentSave time and reduce cost• E xtensive suite of tools available for validation can reduce the cost and time of validation by 50% as compared to using multiple platforms to collect and analyze data • P rovides end-to-end chain of custody from capture through analysis to validation of data • V alidation tools for PLA, 4-P and 5-P curve fits• R eady-to-use data for OQ confirmation tests • P rintable IQ/OQ documents for GLP/GMP paper trail6SoftMax Pro GxP Compliance Software extends Molecular Devices leading data acquisition and analysis solution into regulated laboratories working under GMP, GLP, 21 CFR Part 11, and other similar guidelines for secure electronic records.7SpectraMax iD5 Multi-Mode Microplate ReaderGeneral specifications Dimensions (in.)15.79 (H) x 20.94 (W) x 23.54 (D)Dimensions (cm)40.1 (H) x 53.2 (W) x 59.8 (D)Weight88.1 lbs. (40 kg)Power requirements 100–240 VAC, 2 A, 50/60 Hz Robotic compatible Y esGeneral performance Plate formats 6 to 384 wells Light source Xenon flash lampReading capabilities Microplates, cuvettes (via adapter)Detectors Photomultiplier Tube and Photodiode Shaking Linear, orbital and double orbital T emp. control 5°C above ambient to 66°C ❶T emp. uniformity ± 0.75°CT emp. accuracy ± 1°C at 37°C set point Spectral scanning Abs, FI, Lum, TRFEndpoint reading Abs, FI, Lum, TRF, FP, FRET, TR-FRET Kinetic reading Abs, FI, Lum, TRF, FP, FRET, TR-FRET Well scanning Over 20 by 20Wavelength selection1.0 nm incrementsStandard read times (minutes:seconds)96 wells384 wells Absorbance0:301:30Fluorescence intensity ❷0:301:30Luminescence ❷0:301:30Time-Resolved Fluorescence 0:301:30Fluorescence Polarization 1:003:00Optimized bottom sensitivity (fluorescein)Monochromator Filters 96 wells 2 pM 2 pM 384 wells2.5 pM2.5 pMFluorescence polarization performance Wavelength range (EX mono)(300-)❸ 400–750 nm, 1.0 nm increments Wavelength range (EM mono)(300-)❸ 400–750 nm, 1.0 nm increments Wavelength range (Filters)See accessory listDetection limit ❹MonochromatorFilters 96 wells black 2 mP @ 10 nM 1 mP @ 1 nM 384 wells black 2 mP @ 10 nM 2 mP @ 1 nM Measurement range ❺Delta > 200 mPDelta > 320 mPLuminescence performance Wavelength range300–850 nm300–650 nm for “All Wavelengths” setting Wavelength selection Choice of simultaneous detection of all wavelengths or selection in 1.0 nm increments Dynamic range> 7 decadesCross-talk< 0.1% in white 96- and < 0.2% in 384-well microplatesDetection limit20 amol ATP (“Flash” luminescence using Promega ENLITEN® ATP Assay System)Time-Resolved Fluorescence performanceWavelength range (EM mono)450–750 nm Wavelength range (EX filter)350 nmWavelength range ( EM filter)490 nm (T erbium), 616 nm (Europium) For other filters, please see accessory list Linear dynamic range Up to 5 logs Detection limit96 wells (white)384 wells (white)Standard TRF30 fM Europium (6 amol/well)30 fM Europium (3 amol/well)Enhanced TRF Module (Optional)10 fM Europium (2 amol/well)10 fM Europium (1 amol/well)Injector system with SmartInject Technology (optional)Injectors 2Read modes Absorbance, fluorescence, luminescence Dispense accuracy ± 5% at 100 µL Dispense precision CV ≤ 2% at 100 µLDead volumeInjector Tubing: 250 µL< 10 µL with Reverse Prime function❶For > 66°C, minimum 25°C ambient temperature is required.❷ 10 msec integration time for fluoresence measurement. 100 msec integration time for luminescence for a 96-well plate and 40 msec integration time for a 384-well plate.❸ R equires optional UVIS polarizer ❹ 1x Stdev Fluorescein replicates [mP]❺ ThermoFisher P3088, FP One-Step reference kitSpectraMax iD5 Multi-Mode Microplate ReaderYOUR ALL ACCESS PASS TO YOUR NEXT BREAKTHROUGH/iD5The trademarks used herein are the property of Molecular Devices, LLC or their respective owners. Specifications subject to change without notice. Patents: /productpatents FOR RESEARCH USE ONL Y. NOT FOR USE IN DIAGNOSTIC PROCEDURES.©2017 Molecular Devices, LLC 9/17 2134A Printed in USARegional Offices USA and Canada +1.800.635.5577United Kingdom +44.118.944.8000Europe*00800.665.32860China (Beijing) +86.10.6410.8669China (Shanghai) +86.21.3372.1088Hong Kong+852.2248.6000Japan (Osaka) +81.6.7174.8331Japan (T okyo) +81.3.6362.5260South Korea +82.2.3471.9531Brazil +55.11.3616.6607Contact Us Phone: 800.635.5577Web: Email:***************Check our website for a current listing of worldwide distributors*Austria, Belgium, Denmark, Finland, France, Germany, Ireland, Netherlands, Spain, Sweden and Switzerland。

ESDH155ADM用户手册

ESDH155ADM用户手册
3.2.1 MCP 模块......................................................................................................... 8 3.2.2 时钟模块 ...................................................................................................... 8 3.2.3 公务模块 ...................................................................................................... 9 3.2.4 交叉模块 ...................................................................................................... 9 3.2.5 双光模块 ...................................................................................................... 9 3.2.6 E1 支路模块................................................................................................... 10 3.2.7 以太网接口模块 ........................................................................................ 10

DS17887完整资料

DS17887完整资料

General DescriptionThe DS17285, DS17485, DS17885, DS17287, DS17487,and DS17887 real-time clocks (RTCs) are designed to be successors to the industry-standard DS12885 and DS12887. The DS17285, DS17485, and DS17885 (here-after referred to as the DS17x85) provide a real-time clock/calendar, one time-of-day alarm, three maskable interrupts with a common interrupt output, a programma-ble square wave, and 114 bytes of battery-backed NV SRAM. The DS17x85 also incorporates a number of enhanced functions including a silicon serial number,power-on/off control circuitry, and 2k, 4k, or 8kbytes of battery-backed NV SRAM. The DS17287, DS17487, and DS17887 (hereafter referred to as the DS17x87) integrate a quartz crystal and lithium energy source into a 24-pin encapsulated DIP package. The DS17x85 and DS17x87power-control circuitry allows the system to be powered on by an external stimulus such as a keyboard or by a time-and-date (wake-up) alarm. The PWR output pin is triggered by one or either of these events, and is used to turn on an external power supply. The PWR pin is under software control, so that when a task is complete, the sys-tem power can then be shut down.For all devices, the date at the end of the month is auto-matically adjusted for months with fewer than 31 days,including correction for leap years. It also operates in either 24-hour or 12-hour format with an AM/PM indicator.A precision temperature-compensated circuit monitors the status of V CC . If a primary power failure is detected,the device automatically switches to a backup supply. A lithium coin cell battery can be connected to the V BAT input pin on the DS17x85 to maintain time and date oper-ation when primary power is absent. The DS17x85 and DS17x87 include a V BAUX input used to power auxiliary functions such as PWR control. The device is accessed through a multiplexed byte-wide interface.ApplicationsEmbedded Systems Utility Meters Security SystemsNetwork Hubs, Bridges, and RoutersFeatures♦Incorporates Industry-Standard DS12887 PC Clock Plus Enhanced Functions ♦RTC Counts Seconds, Minutes, Hours, Day, Date,Month, and Year with Leap Year Compensation Through 2099♦Optional +3.0V or +5.0V Operation ♦SMI Recovery Stack ♦64-Bit Silicon Serial Number♦Power-Control Circuitry Supports System Power-On from Date/Time Alarm or Key Closure ♦Crystal Select Bit Allows Operation with 6pF or 12.5pF Crystal ♦12-Hour or 24-Hour Clock with AM and PM in 12-Hour Mode ♦114 Bytes of General-Purpose, Battery-Backed NV SRAM ♦Extended Battery-Backed NV SRAM2048 Bytes (DS17285/DS17287)4096 Bytes (DS17485/DS17487)8192 Bytes (DS17885/DS17887)♦RAM Clear Function♦Interrupt Output with Six Independently Maskable Interrupt Flags ♦Time-of-Day Alarm Once per Second to Once per Day ♦End of Clock Update Cycle Flag ♦Programmable Square-Wave Output♦Automatic Power-Fail Detect and Switch Circuitry ♦Available in PDIP, SO, or TSOP Package (DS17285, DS17485, DS17885)♦Optional Encapsulated DIP (EDIP) Package with Integrated Crystal and Battery (DS17287,DS17487, DS17887)♦Optional Industrial Temperature Range Available ♦Underwriters Laboratory (UL) RecognizedDS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clocks______________________________________________Maxim Integrated Products 1Rev 0; 4/06For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering Information, Pin Configurations, and Typical Operating Circuit appear at end of data sheet.D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 2_____________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V= +4.5V to +5.5V, or V = +2.7V to +3.7V, T = Over the operating temperature range, unless otherwise noted.Typical Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Range on V CC Pin Relative to Ground....-0.3V to +6.0V Operating Temperature Range (Noncondensing)Commercial.........................................................0°C to +70°C Industrial..........................................................-40°C to +85°CStorage Temperature.........................................-55°C to +125°C Soldering Temperature.....................See IPC/JEDEC J-STD-020Specification (Note 1)Soldering Temperature (leads, 10 seconds)...................+260°CDC ELECTRICAL CHARACTERISTICSDS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksAC ELECTRICAL CHARACTERISTICSD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 4_____________________________________________________________________AC ELECTRICAL CHARACTERISTICSWrite TimingDS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clocks_____________________________________________________________________5Read TimingPower-Up/Power-Down TimingD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 6_____________________________________________________________________POWER-UP/POWER-DOWN CHARACTERISTICS(T A = -40°C to +85°C) (Note 2)CAPACITANCENote 1:RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature exposure to the lithium energy source contained within does not exceed +85°C. However, post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibrations not used to prevent damage to the crystal.Note 2:Limits at -40°C are guaranteed by design and not production tested.Note 3:All voltages are referenced to ground.Note 4:All outputs are open.Note 5:Specified with CS = RD = WR = V CC , ALE, AD0–AD7 = 0.Note 6:Applies to the AD0–AD7 pins, IRQ , and SQW when each is in a high-impedance state.Note 7:Measured with a 32.768kHz crystal attached to X1 and X2.Note 8:Measured with a 50pF capacitance load plus 1TTL gate.Note 9:If the oscillator is disabled in software, or if the countdown chain is in reset, t REC is bypassed, and the part becomesimmediately accessible.Note 10:Guaranteed by design. Not production tested.data.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clocks_____________________________________________________________________7SUPPLY CURRENT vs. INPUT VOLTAGEV BAT (V)S U P P L Y C U R R E N T (n A )3.53.33.02.82503003504002002.53.8SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (n A )655035205-10-25300350400250-4080OSCILLATOR FREQUENCY vs. SUPPLY VOLTAGED S 17285/87 t o c 03SUPPLY VOLTAGE (V)O S C I L L A T O R F R E Q U E N C Y (H z )5.04.54.03.53.032768.132768.232768.332768.432768.532768.632768.732768.02.55.5Typical Operating Characteristics(V CC = +3.3V, T A = +25°C, unless otherwise noted.)D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 8_____________________________________________________________________Pin Description (continued)DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 10____________________________________________________________________Figure 1. Functional DiagramDetailed DescriptionThe DS17x85 is a successor to the DS1285 real-time clock (RTC). The device provides 18 bytes of real-time clock/calendar, alarm, and control/status registers and 114 bytes of nonvolatile battery-backed RAM. The device also provides additional extended RAM in either 2k/4k/8kbytes (DS17285/DS17485/DS17885). A time-of-day alarm, six maskable interrupts with a common interrupt output, and a programmable square-wave output are available. It also operates in either 24-hour or 12-hour format with an AM/PM indicator. A precision temperature-compensated circuit monitors the status of V CC . If a primary power-supply failure is detected, the device automatically switches to a backup supply. The backup supply input supports a primary battery, such as a lithium coin cell. The device is accessed by a mul-tiplexed address/data bus.Oscillator CircuitThe DS17x85 uses an external 32.768kHz crystal. The oscillator circuit does not require any external resistors or capacitors to operate. Table 1 specifies several crystal parameters for the external crystal, and Figure 2shows a functional schematic of the oscillator circuit.The oscillator is controlled by an enable bit in the con-trol register. Oscillator startup times are highly depen-dent upon crystal characteristics, PC board leakage,and layout. High ESR and excessive capacitive loads are the major contributors to long startup times. A cir-cuit using a crystal with the recommended characteris-tics and proper layout usually starts within one second.An external 32.768kHz oscillator can also drive the DS17x85. In this configuration, the X1 pin is connected to the external oscillator signal and the X2 pin is floated.Clock AccuracyThe accuracy of the clock is dependent upon the accu-racy of the crystal and the accuracy of the match between the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed.Additional error will be added by crystal frequency drift caused by temperature shifts. External circuit noise coupled into the oscillator circuit may result in the clock running fast. Figure 3 shows a typical PC board layout for isolation of the crystal and oscillator from noise.Refer to Application Note 58: Crystal Considerations with Dallas Real-Time Clocks for detailed information.Clock Accuracy (DS17287, DS17487, and DS17887)The encapsulated DIP (EDIP) modules are trimmed at the factory to ±1 minute per month accuracy at 25°C.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksFigure 2. Oscillator Circuit Showing Internal Bias NetworkFigure 3. Layout ExampleD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Power-Down/Power-UpConsiderationsThe RTC function continues to operate, and all the RAM, time, calendar, and alarm memory locations remain nonvolatile regardless of the level of the V CC input. V BAT or V BAUX must remain within the minimum and maximum limits when V CC is not applied. When V CC falls below V PF , the device inhibits all access,putting the part into a low-power mode. When V CC is applied and exceeds V PF (power-fail trip point), the device becomes accessible after t REC , if the oscillator is running and the oscillator countdown chain is not in reset (Register A). This time period allows the system to stabilize after power is applied. If the oscillator is not enabled, the oscillator enable bit is enabled on power-up, and the device becomes immediately accessible.Power ControlThe power control function is provided by a precise,temperature-compensated voltage reference and a comparator circuit that monitors the V CC level. The device is fully accessible and data can be written and read when V CC is greater than V PF . However, when V CC falls below V PF , the device inhibits read and write access. If V PF is less than V BAT , the device power is switched from V CC to the higher of V BAT or V BAUX when V CC drops below V PF . If V PF is greater than the higher of V BAT or V BAUX , the device power is switched from V CC to the higher of V BAT or V BAUX when V CC drops below the higher backup source. The registers are maintained from the V BAT or V BAUX source until V CC is returned to nominal levels. After V CC returns above V PF , read and write access is allowed after t REC .Time, Calendar, and AlarmLocationsThe time and calendar information is obtained by read-ing the appropriate register bytes. The time, calendar,and alarm are set or initialized by writing the appropri-ate register bytes. The contents of the 12 time, calen-dar, and alarm bytes can be either binary or binary-coded decimal (BCD) format. Tables 3A and 3B show the BCD and binary formats of the 12 time, date,and alarm registers, control registers A to D, plus the two extended registers that reside in bank 1 only (bank 0 and bank 1 switching is explained later in this text).The day-of-week register increments at midnight, incre-menting from 1 through 7. The day-of-week register is used by the daylight saving function, and so the value 1 is defined as Sunday. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including correction for leap years.Before writing the internal time, calendar, and alarm registers, the SET bit in Register B should be written to logic 1 to prevent updates from occurring while access is being attempted. In addition to writing the 12 time,calendar, and alarm registers in a selected format (binary or BCD), the data mode bit (DM) of Register B must be set to the appropriate logic level. All 12 time,calendar, and alarm bytes must use the same data mode. The set bit in Register B should be cleared after the data mode bit has been written to allow the real time clock to update the time and calendar bytes. Once initialized, the real time clock makes all updates in the selected mode. The data mode cannot be changed without reinitializing the 12 data bytes. Tables 3A and 3B show the BCD and binary formats of the 12 time,calendar, and alarm locations.The 24-12 bit cannot be changed without reinitializing the hour locations. When the 12-hour format is selected,the high order bit of the hours byte represents PM when it is logic 1. The time, calendar, and alarm bytes are always accessible because they are double-buffered.Once per second, the eight bytes are advanced by one second and checked for an alarm condition.If a read of the time and calendar data occurs during an update, a problem exists where seconds, minutes,hours, etc., may not correlate. The probability of read-ing incorrect time and calendar data is low. Several methods of avoiding any possible incorrect time and calendar reads are covered later in this text.Real-Time ClocksThe alarm bytes can be used in two ways. First, when the alarm time is written in the appropriate hours, min-utes, and seconds alarm locations, the alarm interrupt is initiated at the specified time each day, if the alarm enable bit is high. In this mode, the “0” bits in the alarm registers and the corresponding time registers must always be written to 0 (see Table3A and 3B). Writing the 0 bits in the alarm and/or time registers to 1 can result in undefined operation.The second use condition is to insert a “don’t care”state in one or more of the alarm bytes. The don’t care code is any hexadecimal value from C0 to FF. The two most significant bits of each byte set the don’t care condition when at logic 1. An alarm will be generated each hour when the “don’t care” bits are set in the hours byte. Similarly, an alarm is generated every minute with don’t care codes in the hours and minute alarm bytes. An alarm is generated every second with don’t care codes in the hours, minutes, and seconds alarm bytes.All 128 bytes can be directly written or read except for the following:1)Registers C and D are read-only.2)Bit 7 of register A is read-only.3)The MSB of the seconds byte is read-only.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clockster, 0 bits in the time and date registers can be written to 1, but can be modified when the clock updates. 0 bits should always be written to 0 except for alarm mask bits.flag that can be monitored. When the UIP bit is 1, the update transfer will soon occur. When UIP is 0, the update transfer does not occur for at least 244µs. The time, calendar, and alarm information in RAM is fully available for access when the UIP bit is 0. The UIP bit is read-only. Writing the SET bit in Register B to 1 inhibits any update transfer and clears the UIP status bit.used to turn the oscillator on or off and to reset the countdown chain. A pattern of 01X is the only combina-tion of bits that turns the oscillator on and allows the RTC to keep time. A pattern of 11X enables the oscillator but holds the countdown chain in reset. The next update occurs at 500ms after a pattern of 01X is written to DV0,DV1, and DV2. DV0 is used to select bank 0 or bank 1 as defined in Table 5. When DV0 is set to 0, bank 0 is selected. When DV0 is set to 1, bank 1 is selected.D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks written to 0 except for alarm mask bits.Control RegistersThe four control registers (A, B, C, and D) reside inboth bank 0 and bank 1. These registers are accessi-ble at all times, even during the update cycle.Register A (0Ah)Bits 3 to 0: Rate Selector Bits (RS3 to RS0). These four rate-selection bits select one of the 13 taps on the 15-stage divider or disable the divider output. The tap selected can be used to generate an output square wave (SQW pin) and/or a periodic interrupt. The user can do one of the following:1)Enable the interrupt with the PIE bit;2)Enable the SQW output pin with the SQWE or E32kbits;3)Enable both at the same time and the same rate; or4)Enable neither.Table4 lists the periodic interrupt rates and the square-wave frequencies that can be chosen with the RS bits.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887functions normally by advancing the counts once per second. When the SET bit is written to 1, any update transfer is inhibited, and the program can initialize the time and calendar bytes without an update occurring in the midst of initializing. Read cycles can be executed in a similar manner. SET is a read/write bit and is not affected by any internal functions of the DS17x85.Bit 6: Periodic Interrupt Enable (PIE).This bit is a read/write bit that allows the periodic interrupt flag (PF)bit in Register C to drive the IRQ pin low. When PIE is set to 1, periodic interrupts are generated by driving the IRQ pin low at a rate specified by the RS3–RS0 bits of Register A. A 0 in the PIE bit blocks the IRQ output from being driven by a periodic interrupt, but the PF bit is still set at the periodic rate. PIE is not modified by any internal DS17x85 functions.Bit 5: Alarm Interrupt Enable (AIE).This bit is a read/write bit that, when set to 1, permits the alarm flag (AF) bit in Register C to assert IRQ . An alarm interrupt occurs for each second that the three time bytes equal the three alarm bytes, including a don’t care alarm code of binary 11XXXXXX. When the AIE bit is set to 0,the AF bit does not initiate the IRQ signal. The internal functions of the DS17x285/87 do not affect the AIE bit.Bit 4: Update-Ended Interrupt Enable (UIE).This bit is a read/write bit that enables the update-end flag (UF)bit in Register C to assert IRQ . The SET bit going high clears the UIE bit.set to 1 and E32k = 0, a square-wave signal at the fre-quency set by RS3–RS0 is driven out on the SQW pin.When the SQWE bit is set to 0 and E32k = 0, the SQW pin is held low. SQWE is a read/write bit. SQWE is set to 1 when V CC is powered up.Bit 2: Data Mode (DM). This bit indicates whether time and calendar information is in binary or BCD format.The program sets the DM bit to the appropriate format and can be read as required. This bit is not modified by internal functions. A 1 in DM signifies binary data, while a 0 in DM specifies binary-coded decimal (BCD) data.Bit 1: 24/12 Control (24/12).This bit establishes the format of the hours byte. A 1 indicates the 24-hour mode and a 0 indicates the 12-hour mode. This bit is read/write and is not affected by internal functions.Bit 0: Daylight Saving Enable (DSE). This bit is a read/write bit that enables two daylight saving adjust-ments when DSE is set to 1. On the first Sunday in April, the time increments from 1:59:59AM to 3:00:00AM. On the last Sunday in October when the time first reaches 1:59:59AM, it changes to 1:00:00AM.When DSE is enabled, the internal logic tests for the first/last Sunday condition at midnight. If the DSE bit is not set when the test occurs, the daylight saving func-tion does not operate correctly. These adjustments do not occur when the DSE bit is zero. This bit is not affected by internal functions.Real-Time Clocks Register B (0Bh)1 when any of the following are true:PF = PIE = 1 WF = WIE = 1AF = AIE = 1 KF = KSE = 1UF = UIE = 1 RF = RIE = 1Any time the IRQF bit is 1, the IRQ pin is driven low.Flag bits PF, AF, and UF are cleared after reading Register C.Bit 6: Periodic Interrupt Flag (PF).This is a read-only bit that is set to 1 when an edge is detected on the selected tap of the divider chain. The RS3–RS0 bits establish the periodic rate. PF is set to 1 independentthe IRQ signal is active and sets the IRQF bit. Reading Register C clears this bit.Bit 5: Alarm Interrupt Flag (AF). A 1 in this bit indicates that the current time has matched the alarm time. If the AIE bit is also 1, the IRQ pin goes low and a 1 appears in the IRQF bit. Reading Register C clears this bit.Bit 4: Update-Ended Interrupt Flag (UF). This bit is set after each update cycle. When the UIE bit is set to 1, the 1 in UF causes the IRQF bit to be 1, which asserts IRQ . Reading Register C clears this bit.Bits 3 to 0: Unused. These unused bits always read 0and cannot be written.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksRegister C (0Ch)Register D (0Dh)Register D (0Dh)Bit 7: Valid RAM and Time (VRT).This bit indicates the condition of the battery connected to the V BAT and V BAUX pin. If either supply is above the internal voltage threshold, VRT TRIP , the bit will be high. This bit is not writeable and should always be a 1 when read. If a 0 isever present, an exhausted internal lithium energy source is indicated and both the contents of the RTC data and RAM data are questionable.Bits 6 to 0: Unused. These bits cannot be written and,when read, always read 0.D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Nonvolatile RAMThe user RAM bytes are not dedicated to any special function within the DS17x85. They can be used by the processor program as battery-backed memory and are fully available during the update cycle.The user RAM is divided into two separate memory banks. When the bank 0 is selected, the 14 real-time clock registers and 114 bytes of user RAM are accessi-ble. When bank 1 is selected, an additional 2kbytes,4kbytes, or 8kbytes of user RAM are accessible through the extended RAM address and data registers.InterruptsThe RTC includes six separate, fully automatic sources of interrupt for a processor:1)Alarm Interrupt 2)Periodic Interrupt3)Update-Ended Interrupt 4)Wake-Up Interrupt 5)Kickstart Interrupt 6)RAM Clear InterruptThe conditions that generate each of these indepen-dent interrupt conditions are described in detail in other sections of this data sheet. This section describes the overall control of the interrupts.The application software can select which interrupts, if any, are to be used. There are 6 bits, including 3 bits in Register B and 3 bits in Extended Register 4B, that enable the interrupts. The extended register locations are described later. Writing logic 1 to an interrupt-enable bit permits that interrupt to be initiated when the event occurs. A logic 0 in the interrupt-enable bit pro-hibits the IRQ pin from being asserted from that interrupt condition. If an interrupt flag is already set when an interrupt is enabled, IRQ is immediately set at an active level, although the event initiating the interrupt condition might have occurred much earlier. Therefore, there are cases where the software should clear these earlier generated interrupts before first enabling new interrupts.When an interrupt event occurs, the relating flag bit is set to logic 1 in Register C or in Extended Register 4A.These flag bits are set regardless of the setting of the corresponding enable bit located either in Register B or in Extended Register 4B. The flag bits can be used in a polling mode without enabling the corresponding enable bits.However, care should be taken when using the flag bits of Register C as they are automatically cleared to 0immediately after they are read. Double latching isimplemented on these bits so that set bits remain sta-ble throughout the read cycle. All bits that were set are cleared when read and new interrupts that are pending during the read cycle are held until after the cycle is completed. One, two, or three bits can be set when reading Register C. Each used flag bit should be exam-ined when read to ensure that no interrupts are lost.The flag bits in Extended Register 4A are not automati-cally cleared following a read. Instead, each flag bit can be cleared to 0 only by writing 0 to that bit.When using the flag bits with fully enabled interrupts,the IRQ line is driven low when an interrupt flag bit is set and its corresponding enable bit is also set. IRQ is held low as long as at least one of the six possible interrupt sources has its flag and enable bits both set.The IRQF bit in Register C is 1 whenever the IRQ pin is being driven low as a result of one of the six possible active sources. Therefore, determination that the DS17x85/DS17x87 initiated an interrupt is accom-plished by reading Register C and finding IRQF = 1.IRQF remains set until all enabled interrupt flag bits are cleared to 0.Oscillator Control BitsA pattern of 01X in bits 4 to 6 of Register A turns the oscillator on and enables the countdown chain. A pat-tern of 11X (DV2 = 1, DV1 = 1, DV0 = X) turns the oscil-lator on, but holds the countdown chain of the oscillator in reset. All other combinations of bits 4 to 6 keep the oscillator off.When the DS17x87 is shipped from the factory, the internal oscillator is turned off. This feature prevents the lithium energy cell from being used until it is installed in a system.Square-Wave Output SelectionThirteen of the 15 divider taps are made available to a 1-of-16 multiplexer, as shown in Figure 1. The square wave and periodic interrupt generators share the out-put of the multiplexer. The RS0–RS3 bits in Register A establish the output frequency of the multiplexer. These frequencies are listed in Table 4. Once the frequency is selected, the output of the SQW pin can be turned on and off under program control with the square-wave enable bit (SQWE).If E32K = 0, the square-wave output is determined by the RS3 to RS0 bits. If E32K = 1, a 32kHz square wave is output on the SQW pin, regardless of the RS3 to RS0bits’ state. If E32K = ABE = 1 and a valid voltage is applied to V BAUX , a 32kHz square wave is output on SQW when V CC is below V TP .Real-Time ClocksPeriodic Interrupt Selection The periodic interrupt causes the IRQ pin to go to an active state from once every 500ms to once every 122µs. This function is separate from the alarm inter-rupt, which can be output from once per second to once per day. The periodic interrupt rate is selected using the same Register A bits that select the square-wave frequency (see Table4). Changing the Register A bits affects both the square-wave frequency and the periodic interrupt output. However, each function has a separate enable bit in Register B. The SQWE and E32k bits control the square-wave output. Similarly, the peri-odic interrupt is enabled by the PIE bit in Register B. The periodic interrupt can be used with software coun-ters to measure inputs, create output intervals, or await the next needed software function.Update Cycle The DS17x85 executes an update cycle once per sec-ond regardless of the SET bit in Register B. When the SET bit in Register B is set to 1, the user copy of the double-buffered time, calendar, and alarm bytes is frozen and does not update as the time increments. However, the time countdown chain continues to update the internal copy of the buffer. This feature allows time to maintain accuracy independent of read-ing or writing the time, calendar, and alarm buffers, and also guarantees that time and calendar information is consistent. The update cycle also compares each alarm byte with the corresponding time byte and issues an alarm if a match or if a don’t care code is present inall alarm locations.There are three methods that can handle access of theRTC that avoid any possibility of accessing inconsistenttime and calendar data. The first method uses the update-ended interrupt. If enabled, an interrupt occursafter every update cycle that indicates that over 999msare available to read valid time and date information. Ifthis interrupt is used, the IRQF bit in Register C shouldbe cleared before leaving the interrupt routine.A second method uses the update-in-progress (UIP) bitin Register A to determine if the update cycle is in progress. The UIP bit pulses once per second. Afterthe UIP bit goes high, the update transfer occurs 244µs later. If a low is read on the UIP bit, the user has at least244µs before the time/calendar data is changed. Therefore, the user should avoid interrupt service rou-tines that would cause the time needed to read validtime/calendar data to exceed 244µs.The third method uses a periodic interrupt to determineif an update cycle is in progress. The UIP bit in RegisterA is set high between the setting of the PF bit in Register C (see Figure4). Periodic interrupts that occurat a rate of greater than t BUC allow valid time and date information to be reached at each occurrence of the periodic interrupt. The reads should be complete within1 (t PI/2+ t BUC) to ensure that data is not read during the update cycle.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887 Real-Time ClocksFigure4. UIP and Periodic Interrupt Timing。

ICP DAS DL-100TM485 用户手册 V1.00说明书

ICP DAS DL-100TM485 用户手册 V1.00说明书
1/4 1/3 3.0 V 64 Hz
Power reverse polarity protection +10 ~ +30 VDC ≤ 0.15 W @ 24 VDC
86 mm x 128 mm x 52 mm
-20 ~ +60℃ -30 ~+80℃ 5 ~ 95% RH, Non-condensing
0 ~ 100% RH (Relative Humidity) 0.1% RH Typical: ±3% RH Max.: Refer to Figure 1 ±0.1% RH -20 ~ +60℃ 0.1℃ Typical: ±0.4℃ Max.: refer to Figure 2. ±0.1℃
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to find more valuable
information.
The DL-100TM485 module supports the Modbus RTU
protocol. The communication Baud Rate is 9600bps,
Humidity Repeatability Temperature Range Temperature Resolution Temperature Accuracy
Temperature Repeatability LCD Display LCD Duty LCD Bias LCD Operating Voltage LCD Operating Frequency Power Protection Required Supply Voltage Power Consumption Mechanical Dimensions (W x L x H) Environment Operating Temperature Storage Temperature Relative Humidity Communication Interface Baud Rate

Richtek RT8057 DS8057-04 February 2014 数据手册说明书

Richtek RT8057  DS8057-04 February 2014 数据手册说明书

RT8057®©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Pin ConfigurationsOrdering InformationNote :Richtek products are :❝ RoHS compliant and compatible with the current require-ments of IPC/JEDEC J-STD-020.❝ Suitable for use in SnPb or Pb-free soldering processes.(TOP VIEW)WDFN-6SL 2x22.25MHz 1A Synchronous Step-Down ConverterGeneral DescriptionThe RT8057 is a high efficiency Pulse-Width-Modulated (PWM) step-down DC/DC converter, capable of delivering 1A output current over a wide input voltage range from 2.7V to 5.5V. The RT8057 is ideally suited for portable electronic devices that are powered from 1-cell Li-ion battery or from other power sources such as cellular phones, PDAs, hand-held devices, game console and related accessories.The internal synchronous rectifier with low R DS(ON)dramatically reduces conduction loss at PWM mode.No external Schottky diode is required in practical applications. The RT8057 enters Low Dropout Mode when normal Pulse -Width Mode cannot provide regulated output voltage by continuously turning on the upper P-MOSFET .The RT8057 enters shut-down mode and consumes less than 1μA when the EN pin is pulled low. The switching ripple is easily smoothed-ou t by small package filtering elements due to a fixed operating frequency of 2.25MHz.The RT8057 is available in a small WDFN-6SL 2x2 package.Features●2.7V to 5.5V Wide Input Operation Range●2.25MHz Fixed-Frequency PWM Operation ●Up to 1A Output Current ●Up to 90% Efficiency●0.6V Reference Allows Low Output Voltage ●Internal Soft-Start●No Schottky Diode Required●Internal Compensation to Reduce External Components●Low Dropout Operation : 100% Duty Cycle ●RoHS Compliant and Halogen FreeApplications●Portable Instruments●Game Console and Accessories●Microprocessors and DSP Core Supplies ●Cellular Phones●Wireless and DSL Modems ●PC CardsLXNC GND VIN ENFBJ7 : Product CodeW : Date CodeG : Green (Halogen Free and Pb Free)RT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Function Pin DescriptionFunction Block DiagramTypical Application CircuitOUT 2.3VRT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Absolute Maximum Ratings (Note 1)●Supply Input Voltage, V IN ------------------------------------------------------------------------------------------------6.5V ●Power Dissipation, P D @ T A = 25°CWDFN-6SL 2x2------------------------------------------------------------------------------------------------------------0.606W ●Package Thermal Resistance (Note 2)WDFN-6SL 2x2, θJA -------------------------------------------------------------------------------------------------------165°C/W WDFN-6SL 2x2, θJC ------------------------------------------------------------------------------------------------------8.2°C/W ●Lead Temperature (Soldering, 10 sec.)-------------------------------------------------------------------------------260°C ●Junction T emperature -----------------------------------------------------------------------------------------------------150°C●Storage T emperature Range --------------------------------------------------------------------------------------------−65°C to 150°C ●ESD Susceptibility (Note 3)HBM --------------------------------------------------------------------------------------------------------------------------2kV MM ----------------------------------------------------------------------------------------------------------------------------200VRecommended Operating Conditions (Note 4)●Supply Input Voltage, V IN ------------------------------------------------------------------------------------------------2.7V to 5.5V ●Junction T emperature Range --------------------------------------------------------------------------------------------−40°C to 125°C ●Ambient T emperature Range --------------------------------------------------------------------------------------------−40°C to 85°CElectrical CharacteristicsRT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Note 1. Stresses beyond those listed “Absolute Maximum Ratings ” may cause permanent damage to the device. These are stressratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect device reliability.Note 2. θJA is measured in natural convection at T A = 25°C on a low-effective thermal conductivity test board of JEDEC 51-3 thermalmeasurement standard. The measurement case position of θJC is on the exposed pad of the package.Note 3. Devices are ESD sensitive. Handling precaution is recommended.Note 4. The device is not guaranteed to function outside its operating conditions.Note 5. The reference voltage accuracy is ±2.5% at recommended ambient temperature range, guaranteed by design.RT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Typical Operating CharacteristicsOutput Voltage vs. Input Voltage2.222.242.262.282.302.322.342.362.382.53.03.54.04.55.05.5Input Voltage (V)O u t p u t V o l t a g e (V)Efficiency vs. Output Current01020304050607080901000.00.20.40.60.81.0Output Current (A)E f f i c i e n c y (%)Frequency vs. Input Voltage2.002.052.102.152.202.252.302.352.402.53.03.54.04.55.05.5Input Voltage (V)F r e q u e n c y(M H z )Output Current Limit vs. Input Voltage1.01.11.21.31.41.51.62.53.03.54.04.55.05.5Input Voltage (V)O u t p u t C u r r e n t l im i t (A )Frequency vs. Temperature1.901.952.002.052.102.152.202.252.30-50-25255075100125Temperature (°C)F r e q u e n c y (M H z )Output Current Limit vs. Temperature1.01.11.21.31.41.51.6-50-25255075100125Temperature (°C)O u t p u t C u r r e n t Li m i t (A )RT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Reference Voltage vs. Temperature0.5920.5940.5960.5980.6000.6020.6040.6060.608-50-25255075100125Temperature (°C)R e f e r e n c e V o l t a g e (V)Load Transient Response Time (100μs/Div)V IN = 5V, V OUT = 2.3V,I OUT = 0A to 1AI OUT(500mA/Div)V OUT(100mV/Div) Output RippleV IN = 3.3V, V OUT = 2.3V,I OUT = 1ATime (250ns/Div)V LX (5V/Div)V OUT (5mV/Div)Load Transient ResponseTime (100μs/Div)I OUT(500mA/Div)V OUT(100mV/Div)V IN = 5V, V OUT = 2.3V,I OUT = 0.4A to 1AOutput Voltage vs. Temperature2.252.262.272.282.292.302.312.322.332.342.35-50-25255075100125Temperature (°C)O u t p u t V o l t a g e (V)Output Ripple Time (250ns/Div)V LX (5V/Div)V OUT (5mV/Div)V IN = 5V, V OUT = 2.3V, I OUT = 1ART8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.En Threshold vs. Temperature0.600.620.640.660.680.700.720.740.760.780.80-50-25255075100125Temperature (°C)E N T h r e s h o l d (V )UVLO vs. Temperature1.51.61.71.81.92.02.12.22.32.4-50-25255075100125Temperature (°C)U V L O (V)Power On from ENTime (100μs/Div)V EN (2V/Div)V OUT (2V/Div)I OUT(500mA/Div)V IN = 5V, V OUT = 2.3V,I OUT = 1APower Off from ENTime (100μs/Div)V EN (2V/Div)V OUT (2V/Div)I OUT(500mA/Div)V IN = 5V, V OUT = 2.3V,I OUT = 1AOutput Voltage vs. Output Current2.262.272.282.292.302.312.322.332.340.00.10.20.30.40.50.60.70.80.91.0Output Current (A)O u t p u t V o lt a g e (V )RT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Application InformationThe basic RT8057 application circuit is shown in Typical Application Circuit. External component selection is determined by the maximum load current and begins with the selection of the inductor value and operating frequency followed by C IN and C OUT .Output Voltage SettingThe output voltage is set by an external resistive divider according to the following equation :OUT REFR1V V x (1)R2=+where VREF equals to 0.6V typical. The resistive divider allows the FB pin to sense a fraction of the output voltage as shown in Figure 1.Figure 1. Setting the Output VoltageSoft-StartThe RT8057 contains an internal soft-start clamp that gradually raises the clamp on the FB pin.100% Duty Cycle OperationWhen the input supply voltage decreases toward the output voltage, the duty cycle increases toward the maximum on-time. Further reduction of the supply voltage forces the main switch to remain on for more than one cycle,eventually reaching 100% duty cycle.The output voltage will then be determined by the input voltage minus the voltage drop across the internal P-MOSFET and the inductor.Low Supply OperationThe RT8057 is designed to operate down to an input supply voltage of 2.7V. One important consideration at low input supply voltages is that the R DS(ON) of the P-Channel and N-Channel power switches increases. The user should calculate the power dissipation when the RT8057 is used at 100% duty cycle with low input voltages to ensure that thermal limits are not exceeded.Under Voltage Protection (UVP)The output voltage can be continuously monitored for under voltage protection. When the output voltage is less than 33% of its set voltage threshold after OCP occurs, the under voltage protection circuit will be triggered to auto re-soft-start.Input Voltage Over Voltage protection (V IN OVP)When the input voltage (V IN ) is higher than 6V, V IN OVP will be triggered and the IC stops switching. Once the input voltage drops below 6V, the IC will return to normal operation.Output Over Voltage Protection (V OUT OVP)When the output voltage exceeds more than 5% of the nominal reference voltage, the feedback loop forces the internal switches off within 50μs. Therefore, the output over voltage protection is automatically triggered by the loop.Short Circuit ProtectionWhen the output is shorted to ground, the inductor current decays very slowly during a single switching cycle. A current runaway detector is used to monitor inductor current. As current increases beyond the control of current loop, switching cycles will be skipped to prevent current runaway from occurring.RT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.C IN and C OUT SelectionThe input capacitance, C IN , is needed to filter the trapezoidal current at the source of the top MOSFET . To prevent large ripple voltage, a low ESR input capacitor sized for the maximum RMS current should be used. RMScurrent is given by :RMS OUT(MAX)I I =This formula has a maximum at V IN = 2V OUT , where I RMS =I OUT /2. This simple worst case condition is commonly used for design because even significant deviations do not result in much difference. Choose a capacitor rated at a higher temperature than required.Several capacitors may also be paralleled to meet size or height requirements in the design.The selection of C OUT is determined by the effective series resistance (ESR) that is required to minimize voltage ripple and load step transients, as well as the amount of bulk capacitance that is necessary to ensure that the control loop is stable. Loop stability can be checked by viewing the load transient response. The output ripple, ΔV OUT , is determined by :OUT L OUT 1V I ESR 8fC ⎡⎤∆≤∆+⎢⎥⎣⎦The output ripple is highest at maximum input voltagesince ΔI L increases with input voltage. Multiple capacitors placed in parallel may be needed to meet the ESR andRMS current handling requirements. Dry tantalum, special polymer, aluminum electrolytic and ceramic capacitors are all available in surface mount packages. Special polymer capacitors offer very low ESR, but have lower capacitance density than other types. Tantalum capacitors have the highest capacitance density, but it is important to only use types that have been surge tested for use in switching power supplies. Aluminum electrolytic capacitors have significantly higher ESR, but can be used in cost-sensitive applications provided that consideration is given to ripple current ratings and long term reliability. Ceramic capacitors have excellent low ESR characteristics, but can have a high voltage coefficient and audible piezoelectric effects.The high Q of ceramic capacitors with trace inductance can also lead to significant ringing.Using Ceramic Input and Output CapacitorsHigher value, lower cost ceramic capacitors are now becoming available in smaller case sizes. Their high ripple current, high voltage rating and low ESR make them ideal for switching regulator applications. However, care must be taken when these capacitors are used at the input and output. When a ceramic capacitor is used at the input and the power is supplied by a wall adapter through long wires, a load step at the output can induce ringing at the input, V IN . At best, this ringing can couple to the output and be mistaken as loop instability. At worst, a sudden inrush of current through the long wires can potentially cause a voltage spike at V IN large enough to damage the part.Table 2. Capacitors for C IN and C OUTRT8057©Copyright 2014 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.Thermal ConsiderationsFor continuous operation, do not exceed absolute maximum junction temperature. The maximum power dissipation depends on the thermal resistance of the IC package, PCB layout, rate of surrounding airflow, and difference between junction and ambient temperature. The maximum power dissipation can be calculated by the following formula :P D(MAX) = (T J(MAX) − T A ) / θJAwhere T J(MAX) is the maximum junction temperature, T A is the ambient temperature, and θJA is the junction to ambient thermal resistance.For recommended operating condition specifications of the RT8057, the maximum junction temperature is 125°C and T A is the ambient temperature. The junction to ambient thermal resistance, θJA , is layout dependent. For WDFN-6SL 2x2 packages, the thermal resistance, θJA , is 165°C/W on a standard JEDEC 51-3 single-layer thermal test board. The maximum power dissipation at T A = 25°C can be calculated by the following formula :P D(MAX) = (125°C − 25°C) / (165°C/W) = 0.606W for WDFN-6SL 2x2 packageThe maximum power dissipation depends on the operating ambient temperature for fixed T J(MAX) and thermal resistance, θJA . For the RT8057 package, the derating curve in Figure 2 allows the designer to see the effect of rising ambient temperature on the maximum power dissipation.Figure 2. Derating Curve for the RT8057 PackageLayout ConsiderationsFollow the PCB layout guidelines for optimal performance of the RT8057.❝ Connect the terminal of the input capacitor(s), C IN , asclose as possible to the VIN pin. This capacitor provides the AC current into the internal power MOSFETs.❝ LX node experiences high frequency voltage swing andshould be kept within a small area. Keep all sensitive small-signal nodes away from the LX node to prevent stray capacitive noise pick up.❝ Flood all unused areas on all layers with copper. Floodingwith copper will reduce the temperature rise of power components. Connect the copper areas to any DC net (V IN , V OUT , GND, or any other DC rail in the system).❝ Connect the FB pin directly to the feedback resistors.The resistive voltage divider must be connected between V OUT and GND.Figure 3. PCB Layout GuideINLX should be connected to inductor by wide and short trace. Keep sensitive 0.000.050.100.150.200.250.300.350.400.450.500.550.600.650255075100125Ambient Temperature (°C)M a x i m u m P o w e r D i s s i p a t i o n (W )W-Type 6SL DFN 2x2 PackageRichtek Technology Corporation14F, No. 8, Tai Yuen 1st Street, Chupei CityHsinchu, Taiwan, R.O.C.Tel: (8863)5526789Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.DS8057-04 February 11。

RT duroid 6035HTC 高性能材料说明书

RT duroid 6035HTC 高性能材料说明书

1 of 4产品数据安全说明书1.产品及企业标示化学品名称: RT/duroid ® 6035HTC 高性能材料 化学品类别: 含氟聚合类HMIS 等级:H 1 F 1 R 0 产品用途 印刷线路板应急电话: 860-774-9605(周一至周五8:00-17:00 ,美国东部时区)2.成分/组成信息此物质是作为 20CFR 1910.1200 和EC 中1907/2006 的“物品”来生产的,因此不受危害协会标准和新化学物质法规控制。

既然此物质不分解,在正常条件下使用也不分解成危害化学物,因此不需要物质安全数据说明书。

组分名称 CAS No.EINECS /ELINCSOSHA PEL ACGIH TLVEU Classification熔融石英 60676-86-0 262-373-8 80 mg/m 3%SiO 2未建立 根据67/548/EC 未分类二氧化钛 13463-67-7 236-675-5 15 mg/m 3(总尘)10 mg/m 3 根据67/548/EC 未分类聚乙烯 (PTFE)9002-84-0 NE NE NE 根据67/548/EC 未分类 氮化硼10043-11-5 NE15 mg/m 3(总尘)10 mg/m 3根据67/548/EC 未分类夹层(铜或者铝黄铜)铜 7440-50-8 231-159-6 1 mg/m 3 1 mg/m 3 根据67/548/EC 未分类根据OSHA 的危害通识标准29 CFR1910.1200或欧盟指令1999/45/ EC 号指令规定该材料不包含其他有害成分,并根据67/548/ EC 号指令物质不含有危害健康或环境的有害成分。

3. 危害识别材料分类: 无资料 标签要求: 无资料过度暴露影响: 正常处理不会产生。

当切割或其他操作可能产生粉尘。

超过分解温度下进行操作时可能会产生有毒烟雾。

吸入:灰尘可引起呼吸道刺激。

暴露在铜尘或者PTFE 分解产物下可能会引起肺部金属或者聚合物烟尘发热。

AD8005中文资料

AD8005中文资料

TMIN to TMAX Offset Drift +Input Bias Current TMIN to TMAX –Input Bias Current Input Bias Current Drift (± ) Open-Loop Transimpedance INPUT CHARACTERISTICS Input Resistance Input Capacitance Input Common-Mode Voltage Range Common-Mode Rejection Ratio OUTPUT CHARACTERISTICS Output Voltage Swing Output Current Short Circuit Current POWER SUPPLY Quiescent Current Power Supply Rejection Ratio OPERATING TEMPERATURE RANGE
元器件交易网
a
FEATURES Ultralow Power 400 ␮ A Power Supply Current (4 mW on ؎5 VS) Specified for Single Supply Operation High Speed 270 MHz, –3 dB Bandwidth (G = +1) 170 MHz, –3 dB Bandwidth (G = +2) 280 V/␮ s Slew Rate (G = +2) 28 ns Settling Time to 0.1%, 2 V Step (G = +2) Low Distortion/Noise –63 dBc @ 1 MHz, V O = 2 V p-p –50 dBc @ 10 MHz, VO = 2 V p-p 4.0 nV/√Hz Input Voltage Noise @ 10 MHz Good Video Specifications (RL = 1 k⍀, G = +2) Gain Flatness 0.1 dB to 30 MHz 0.11% Differential Gain Error 0.4؇ Differential Phase Error APPLICATIONS Signal Conditioning A/D Buffer Power-Sensitive, High-Speed Systems Battery Powered Equipment Loop/Remote Power Systems Communication or Video Test Systems Portable Medical Instruments PRODUCT DESCRIPTION

RoHS指令的IPC1750系列标准

RoHS指令的IPC1750系列标准

RoHS指令的IPC1750系列标准随着欧盟《关于在电气电子设备中限制使用某些有害物质指令》(RoHS指令)正式开始,电子产品供应链中许多公司需要表明自己的产品符合欧盟RoHS指令,不含有镉、汞、铅、六价铬和PBB、PBDE六种有害物质,及其它禁用的有害物质。

现在美国IPC已制定发布或正在制定有关电子产品材料与零部件成份的申报规范,有IPC-1750系列标准。

IPC 制定IPC-1750系列标准的目的是为适应执行RoHS指令,电子产品制造供应链中材料与零部件供方向客户说明,其所提供物品,包括散装材料、层压构件、元件、印制板、组装件等含有什么物质,是否含有RoHS或其它法规规定的限禁物质等。

IPC标准对这些申报过程规定了管理程序,统一申报表单格式,简化申报过程,以提高工作效率和减少成本。

这套IPC-1750系列标准由IPC组织申报过程管理分委会、数据产生与传递委员会起草,有电子产品供应链中50多位代表参加,包括IBM、 HP、Motolora、Intel及美国标准技术协会和日本JPCA,并得到国际电子制造组织(iNEMI)的认可。

IPC-1750系列标准包括下列八项:IPC- 1751 申报过程管理通用要求 (2006年2月发布)IPC- 1752 材料申报管理分要求 (2006年2月发布)IPC- 1752-1 材料申报格式– 1至4级 (2006年2月发布)IPC- 1752-2 材料申报格式– 1, 2, 5与6级 (2006年2月发布)IPC- 1752-3 材料申报格式用户指南 (2006年2月发布)IPC- 1753 层压构件申报管理分要求 (还在制定之中)IPC- 1754 印制板申报管理分要求 (还在制定之中)IPC- 1755 电子组装件申报管理分要求 (还在制定之中)以上IPC已发布的IPC-1750系列标准,可从IPC网站上下载。

IPC- 1751是申报过程管理通用要求,规定了电子产品制造供应链中供方应向客户进行有关申报的规则,申报物品包括散装材料、层压构件、元件、印制板、组装件等相关信息,标准目的是在供方与客户之间建立了一种沟通信息的统一方法。

ZXCTN 9004(V2.08.31)分组传送产品硬件描述

ZXCTN 9004(V2.08.31)分组传送产品硬件描述
2 设备子架 ............................................................................................2-1
2.1 子架结构 ............................................................................................................2-1 2.2 风扇插箱 ............................................................................................................2-2 2.3 子架板位资源 .....................................................................................................2-3
3.5.1 单板功能 ..................................................................................................3-4 3.5.2 单板原理 ..................................................................................................3-5 3.5.3 面板说明 ..................................................................................................3-6 3.5.4 指示灯状态 ...............................................................................................3-7 3.5.5 告警、性能、事件 ....................................................................................3-8 3.6 P90S1-2XGE-XFP ............................................................................................ 3-11 3.6.1 单板功能 ................................................................................................ 3-11 3.6.2 单板原理 ................................................................................................ 3-11 3.6.3 面板说明 ................................................................................................ 3-13 3.6.4 指示灯状态 ............................................................................................. 3-13 3.6.5 告警、性能、事件 .................................................................................. 3-13 3.7 P90S1-4XGE-XFP ............................................................................................ 3-15 3.7.1 单板功能 ................................................................................................ 3-15 3.7.2 单板原理 ................................................................................................ 3-16

uc3875中文资料

uc3875中文资料

uc3875中文资料篇一:关于uc3875UC3875相移谐振控制器(PhaeShiftReonantController)特点:FEATURESZeroto100%DutyCycleControl输出PWM脉冲0到100%占空比dutycycle(占空比)ModeTopologie(拓扑)电压或电流型拓扑相兼容PracticalOperationatSwitching(开关)Frequencie(频率)to1MHz开关工作频率1MHZFour2ATotemPoleOutput4个2A图腾柱输出TotemPole(图腾柱)(图腾柱输出(TotemPole的音译)结构介绍图腾柱就是上下各一个三极管,上管为NPN,c极(集电极)接正电源,下管为PNP,c极(集电极)接地。

两个b极(基极)接一起,接输入,上管和下管的e极(发射极)接到一起,接输出,像一个“图腾柱”。

用同一信号驱动两个b极。

驱动信号为高时,NPN导通;信号为低时,PNP导通。

利用两个晶体管构成推挽输出。

用来匹配电压,或者提高IO口的驱动能力。

上下两个输出管,从直流角度看是串联,两管联接处为输出端。

上管导通下管截止输出高电平,下管导通上管截止输出低电平,如果电路逻辑可以上下两管均截止则输出为高阻态。

在开关电源中,类似的电路常称为半桥。

)10MHzErrorAmplifier(放大器)10MHZ误差放大器(误差放大器是指用来放大“误差”信号的放大器,与其他放大器的区别主要在被处理信号类型不同。

在控制环路中,误差放大器将误差信号(输出与参考之差)放大,以提高控制系统的灵敏度,提高调节精度(降低调节误差)。

)UndervoltageLockout欠压锁定(UVLO)(电压不足时,为不工作的状态)LowStartupCurrent–150A低的软上升电流OutputActiveLowDuringUVLOSoft-StartControl软启动控制TrimmedReference二十个管脚1.VREF基准电压可输出精确的5V基准电压,其电流可以达到60mA。

宽压大功率超高速双运放AD815中文

宽压大功率超高速双运放AD815中文

a特征灵活的配置差分输入和输出驱动器或两个单端驱动程序高输出功率电力包装26 dBm微分ADSL线车道的应用40 V p - P的差分输出电压,R L= 50500 mA最小输出驱动器/放大器,R L = 5耐热增强SOIC400 mA最小输出驱动器/放大器,R L= 10低失真–66 dB @ 1 MHz THD, R L = 200 , V OUT= 40 V p - P0.05%和0.45差分增益和相位,R L = 25(6反向端接视频负载)高速120 MHz带宽(–3 dB)900 V/ s微分转换率70 ns建立时间0.1%热关断应用ADSL, HDSL和VDSL线路接口驱动器线圈或变压器驱动器CRT收敛性和散光调整视频分配放大器双绞线电缆驱动器产品说明高输出电流微分驱动器AD815功能框图15-Lead通孔的SIP (Y)和表面贴装DDPAK (VR )151413TAB IS +VS121110987654321NC = NO CONNECTREFER TO PAGE 3 FOR 24-LEAD SOIC PACKAGENC NC NC NC +IN2–IN2OUT2+VS–V S OUT1–IN1+IN1NC NC NCAD815耦合比1:1更大的变压器匝数比.该低谐波失真–66 dB @ 1 MHz到200Ω与宽带宽和高电流驱动结合,使为通信应用,如差分驱动器理想至于ADSL, HDSL和用户线接口VDSL.该AD815微分900第V / µs和高负载驱动摆率为快速线圈或变压器的动态控制适宜,和0.05%和0.45°差分增益视频性能and phase into a load of 25Ω使多达12反向端接负荷驱动.三包装样式可用,和各地的工作工业温度范围(–40°C到+85°C).最大输出功率为实现与权力包装供通孔安装(Y)和表面(VR).的安装24-lead SOIC (RB)是驾驶能力全额26 dBm ADSL适当的散热.+15V100由有能力的AD815两个高速放大器供应一500 mA.最低它们通常配置作为驱动器使本40 V PP输出信号差±15 V用品.这可以进一步增加与一个使用–40TOTAL HARMONIC DISTORTION – dBc –50–60–70–80–90–100–110100R L = 50(DIFFERENTIAL)R L = 200(DIFFERENTIAL)V S = 15VG = +10V OUT = 40V p-p1/2AD815AMP1499R 1= 15V IN =4Vp-p110G = +10499V D =40Vp-pR L 120V OUT =40Vp-p1001k10k 100k FREQUENCY – Hz1M10MAMP21/2AD815–15VR 2= 151:2TRANSFORMER总谐波失真与频率订户线路差动驱动器REV的. B由ADI公司提供的信息被认为是准确和可靠.但是,没有承担责任的模拟装置使用,也没有侵犯任何专利或其它第三方权利这可能是由于它的使用.没有获发牌照以暗示或否则根据ADI公司的任何专利或专利的权利.其中技术的方式,P.O.盒9106,诺伍德,MA 02062-9106, U.S.A.电话:781/329-4700万维网网址: 传真:781/326-8703©模拟装置,Inc., 1999AD815–SPECIFICATIONS(@ T = +25 C, V =A S15 V dc, R FB= 1 k和R LOAD= 100V S±15±5±15±5±15±15±15±5,±15±5,±15±5,±15±15±15±5±15最小10090除非另有说明)AD815ATyp 最大120110401090070–661.851.8190.050.45510200.50.5101021081530245901505575100单位MHzMHzMHzMHzV/µsnsdBcnV/√HzpA/√HzpA/√Hz%学位mVmVmVµV/°CmVmVmVµV/°CµAµAµAµAµAµAMΩMΩMΩΩpF±V±VdBdB±V±V±V±VmAmAmAAΩdB±1830404055VmAmAmAmAdB模型动态性能小信号带宽(–3 dB)带宽(0.1 dB)微分转换率建立时间0.1%噪音/谐波性能总谐波失真输入电压噪声输入电流噪声(+I IN)输入电流噪声(–I IN)微分增益误差差分相位误差DC性能输入失调电压条件G = +1G = +1G = +2G = +2V OUT= 20 V的P -磷,G = +210 V步骤,G = +2f = 1 MHz, R LOAD= 200Ω,V OUT= 40 V p - Pf = 10千赫,G = +2(单端)f = 10千赫,G = +2f = 10千赫,G = +2NTSC, G = +2, R LOAD= 25ΩNTSC, G = +2, R LOAD= 25Ω800 T MIN– T MAX输入失调电压漂移差分偏移电压T MIN– T MAX 差分偏移电压漂移输入电流偏置T MIN– T MAX +输入电流偏置T MIN– T MAX 差分输入电流偏置T MIN– T MAX 开环转阻T MIN– T MAX 输入特性差分输入电阻差分输入电容输入共模电压范围共模抑制比差分共模抑制比输出特性电压摆幅T MIN– T MAXT MIN– T MAX单端,R LOAD= 25Ω差分,R LOAD= 50ΩT MIN– T MAXR LOAD= 5ΩR LOAD= 10Ω+Input–Input±15±15±15±5±5,±15±5,±15±15±5±15±15±15±5±15±15±15±15±5±15±5±15±5,±15±5,±15±5,±15±5,±15±5,±15 1.00.5±5±155.0578011.01.12122.55003504007151.413.53.56510011.71.82324.57504005001.013–65输出电流1, 2VR, YRB-24短路电流输出电阻匹配特性串音电源工作范围3静态电流f = 1 MHzT MIN– T MAXT MIN– T MAX2330电源抑制比T MIN– T MAX–55–66附注1输出电流限制在24-lead SOIC 包装最大功率耗散.见绝对最大额定值和降额曲线.2见图12的带宽,增益,输出驱动器建议操作范围.3观察最高结温度降额曲线.规格如有变更,恕不另行通知.–2–REV的. BAD815电源电压. . . . . . . . . . . . . . . . . . . . . . . . . . .±18 V总计内部功耗2塑料(Y和VR) . . 3.05瓦(观察降额曲线)小外形 (RB) . . 2.4瓦(观察降额曲线)输入电压(共模). . . . . . . . . . . . . . . . . . . .±V S 差分输入电压. . . . . . . . . . . . . . . . . . . . . . . .±6 V输出短路持续时间. . . . . . . . . . . . . . . . . . . . . .观察功率降额曲线只能对地短路存储温度范围Y, VR和RB 包装 . . . . . . . . . . . . . . . –65°C到+125°C 工作温度范围AD815A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C到+85°C 铅温度范围(焊接,10秒). . . . . . . +300°C附注1上述最大绝对额定值上市,可能引起佩尔马-nent损坏设备.这是一个额定值只是强调,功能运作,在这些或以上的任何其他条件显示设备在运行这说明部分将得不到保证.暴露在绝对最大额定值长时间会影响器件的可靠性.2规范适用于设备与0英尺在空气/分钟的空气流量:15-Lead通孔与表面装载:θJA = 41°C /瓦; 24-Lead表面装载:θJA = 52°C/W.绝对最大额定值1最大功耗最大功率可安全通过AD815消退是有限的,在结温上升有关.该塑料封装的最大安全结温部分是由玻璃化转变温度塑料,约150°C.暂时可能会超过这个限额导致在性能参数变化,由于在改变应力由电路小片 包装发挥.超过交界温度的175°C长时间会导致设备故障.该AD815具有热关断保护,从而保证,该电路小片最高结温度仍然低于一安全的水平,即使在输出短路到地.短路对任一电源的输出会导致设备故障.为了确保正常运行,重要的是要观察降额曲线,并参照对权力的考虑部分.还必须指出,在高(同相)的增益配置(与低增益电阻值),高层次的输入过驱动可能导致大的输入误差电流,这可能导致在输入阶段的一个重大的功耗.这股力量计算时,必须包括结温上升由于全内的权力.14MAXIMUM POWER DISSIPATION –Watts 13121110987654321T J = 150 C引脚配置24-Lead热增强型SOIC (RB-24)NC 1NC 2NC 3NC 45THERMAL HEAT TABS+V S *624 NC 23 NC 22 NC 21 NCθJA= 16 C/WSOLDERED DOWN TO COPPER HEAT SINK (STILL AIR = 0FT/MIN)AD815 AVR, AYθJA= 41 C/W(STILL AIR = 0FT/MIN)NO HEAT SINKAD815 AVR, AYAD81520THERMALHEAT TABS +V S *TOP VIEW 19(Not to Scale) 187817+IN1 9–IN1 10OUT1 11–V S 1216 +IN215 –IN214 OUT213 +VSθJA= 52 C/W(STILL AIR = 0 FT/MIN)NO HEAT SINKAD815ARB-2470 8090–50 –40 –30 –20 –10 0 10 20 30 40 50 60AMBIENT TEMPERATURE –CNC = NO CONNECT*HEAT TABS ARE CONNECTED TO THE POSITIVE SUPPLY.积最大功耗与温度的关系订购指南模型AD815ARB-24AD815ARB-24-REEL AD815AVR AD815AY AD815AYS AD815-EB温度范围–40°C到+85°C –40°C到+85°C –40°C到+85°C –40°C到+85°C –40°C到+85°C包装描述24-Lead热增强SOIC 24-Lead热增强SOIC15-Lead表面装载 DDPAK15-Lead通孔交错的SIP信息和90°引脚形式15-Lead通孔直交错的SIP信息和引脚形式评估板包装选项RB-24RB-24VR-15Y-15YS-15注意ESD(静电放电)敏感器件.静电像4000 V容易高堆积在人体和测试设备,可排出而不被发现.虽然AD815特征专有ESD保护电路,可永久性损伤发生在受到高能静电放电设备.因此,适当ESD 预防措施建议,以避免性能退化或丧失功能.WARNING!ESD SENSITIVE DEVICEREV的. B –3–AD815–Typical性能特点AD81520Volts3634V S =SUPPLY CURRENT –mA 1532302826V S =242220018–405V 15VCOMMON-MODE VOLTAGE RANGE –105510SUPPLY VOLTAGE –15Volts20–200204060JUNCTION TEMPERATURE –C80100图1.输入共模电压范围与电源电压图4.总电源电流与温度的关系40SINGLE-ENDED OUTPUT VOLTAGE – V p-p 80DIFFERENTIAL OUTPUT VOLTAGE –V p-p33TOTAL SUPPLY CURRENT –mA T A = +25 C3030NO LOAD602720R L = 50(DIFFERENTIAL)R L = 25(SINGLE-ENDED)402410202100510SUPPLY VOLTAGE –15Volts0201824681012SUPPLY VOLTAGE –Volts1416图2.输出电压摆幅与电源电压图5.总电源电流与电源电压30SINGLE-ENDED OUTPUT VOLTAGE – Volts p-p V S =2515V60DIFFERENTIAL OUTPUT VOLTAGE –Volts p-p 100INPUT BIAS CURRENT –A –10–20–30–40–50–60SIDE A, B V S =15V,+I B5V502040V S =5V1530SIDE B –I BSIDE ASIDE B SIDE A–I B 15V10010V S =55V2010–70V S =–80–40–200204060JUNCTION TEMPERATURE –C8010100LOAD RESISTANCE – (Differential –1k) (Single-Ended –10k /2)图3.输出电压摆幅与负载电阻图6.输入偏置电流与温度的关系–4–REV的. BAD815–2INPUT OFFSET VOLTAGE – mV –4V S =–6–8–10V S =–12–14–4015V–401k–60–2.0 –1.6 –1.20–0.8 –0.40.40.8LOAD CURRENT –Amps5V80T A = 25 C6040RTI OFFSET –mV20–20VINf = 0.1Hz 10049.91kV S =5VV S =10VV S =15V1/2AD815V OUTR L =5–200204060JUNCTION TEMPERATURE –C 80100 1.2 1.6 2.0图7.输入失调电压随温度的变化热图10.非线性与输出电流驱动750V S =SHORT CIRCUIT CURRENT – mA700SOURCE65015VCLOSED-LOOP OUTPUT RESISTANCE –10010V S =5V600SINK5501V S =15V0.15000.01450–60–40–2020406080100JUNCTION TEMPERATURE – C12014030k100k300k1M 3M 10M FREQUENCY –Hz30M100M300M图8.短路电流与温度的关系图11.闭环输出阻抗与频率的关系15T A = 25 C R L = 25V S =RTI OFFSET – mV55VV S =10VV S =15VDIFFERENTIAL OUTPUT VOLTAGE –V p-p40T A = 25 C V S = ±15VR L = 10030R L = 5020R L = 2510R L = 10–16–12–8–404V OUT – Volts8121620241068FREQUENCY –MHz121410VINf = 0.1Hz 10049.9–51/2AD815V OUT R L =25–101k–15–201k图9.增益非线性与输出电压图12.大信号频率响应REV的. B –5–AD815100100120110VOLTAGE NOISE – nV/√HzTRANSIMPEDANCE –dBINVERTING INPUT CURRENT NOISECURRENT NOISE – pA/√Hz100908070605040INPUT VOLTAGE NOISE1001kFREQUENCY – Hz10k301100k1001k 10k 100k1M FREQUENCY –Hz10M PHASE100500PHASE –Degrees0–50–100–150–200–250100MTRANSIMPEDANCE1010NONINVERTING INPUTCURRENT NOISE110图13.输入电流和电压噪声与频率的关系图16.开环阻与频率的关系90TOTAL HARMONIC DISTORTION –dBc 80V S =7060504030201010k562V IN562562SIDE BSIDE A562V OUT15V–40–50–60–70–80–90–100–110100R L = 50(DIFFERENTIAL)R L = 200(DIFFERENTIAL)V S = 15VG = +10V OUT = 40V p-pCOMMON-MODE REJECTION – dB1/2AD815100k1MFREQUENCY – Hz10M 100M1k10k 100k FREQUENCY –Hz1M 10M图14.共模抑制与频率的关系图17.总谐波失真与频率的关系0OUTPUT SWING FROM ±V TO 0 –Volts –10–20–30PSRR – dB –40–PSRR–50–60–70–80–90–1000.010.1110FREQUENCY – MHz100300+PSRRV S = 15V G = +2R L = 1001081%6420–2–4–61%–8020604070SETTLING TIME –ns801000.1%GAIN = +2V S = 15V0.1%–10图15.电源抑制与频率的关系图18.输出摆幅稳定时间和错误对比–6–REV的. BAD815700G = +10SINGLE-ENDED SLEW RATE – V/ s (PER AMPLIFIER)DIFFERENTIAL SLEW RATE –V/ s600500G = +24003002001000051015OUTPUT STEP SIZE – V p-p202580060040020012001000OPEN-LOOP TRANSRESISTANCE –M4SIDE B3SIDE A2–T Z1SIDE B+T ZSIDE A14005–40–200204060JUNCTION TEMPERATURE –C80100图19.摆率和输出步长图22.开环转阻与温度的关系–85V S =SIDE B–80SIDE A–75OUTPUT SWING –Volts +PSRR15V15V S =1415VR L = 150+V OUT| –VOUT|+V OUT12| –VOUT|11–PSRRR L = 25PSRR – dB 13–70SIDE A–65SIDE B–60–40–20204060JUNCTION TEMPERATURE – C8010010–40–200204060JUNCTION TEMPERATURE –C80100温度曲线图20. PSRR 图23.单端输出摆幅与温度–74–732726OUTPUT SWING –Volts –72CMRR – dB –71–70–69–CMRR–68–67–66–40+CMRR23V S = 15V R L = 5025–V OUT +VOUT24–20204060JUNCTION TEMPERATURE –C8010022–40–20204060JUNCTION TEMPERATURE –C80100温度曲线图21. CMRR图24.差分输出摆幅与温度REV的. B –7–AD815DIFF PHASE – Degrees6 BACK TERMINATED LOADS (25 )0.040.030.020.010.00–0.01–0.02–0.03–0.040.0100.0050.000–0.005–0.010–0.015–0.020–0.025–0.0300.50.40.30.20.10.0–0.1–0.2–0.30.120.100.080.060.040.020.00–0.02–0.04DIFF GAIN – %15V0.1NORMALIZED FLATNESS –dB 0–0.1–0.2–0.3–0.4–0.5–0.6–0.70.1V IN10049.9499499100V OUT5V BB AA15V–1–2–3–4–5–6–7–8–9300NORMALIZED FREQUENCY 15VPHASEG = +2R F = 1k NTSCGAIN1234567891011DIFF GAIN – %PHASEGAING = +2R F = 1k NTSCPHASE34567891011GAINDIFF PHASE – Degrees 2 BACK TERMINATED LOADS (75 )12110FREQUENCY –MHz100图25.差分增益和差分相位(每放大器)图与频率28.带宽,G = +2–10NORMALIZED OUTPUT VOLTAGE –dB–20–30CROSSTALK – dB –40–50–60–70SIDE A–80–90–100–1100.03G = +2R F = 499V S = 15V, 5V V IN = 400mVrms R L = 100SIDE B1V S =–1–2–3V IN–449.9–5–6–70.1124499100100V OUTSIDE B15VSIDE A0.1110FREQUENCY – MHz100300110FREQUENCY –MHz100300图26. Output-to-Output 串音与频率的关系图29. –3与频率dB带宽,G = +5210OUTPUT VOLTAGE – dB –1–2–3–4–5–6–7–90.149.9562100100%V S = 15V V IN = 0 dBmSIDE ASIDE B10090V IN100V OUT5V1 s110FREQUENCY – MHz100300图27. –3与频率dB带宽,G = +1图30. 40 V页微分正弦波,R L= 50Ω,f = 100千赫–8–REV的. BAD815562+15V10 F0.1 F8R F+15V10 F0.1 FR S81/2 AD815100V INPULSE GENERATORT R/T F= 250ps 50–15V71/2 AD8150.1 F RL= 100V INPULSEGENERATORTR/TF= 250ps10070.1 F10 F–15VR L= 10010 F50图31.测试电路,增益= +1SIDE A图35.测试电路,增益= 1 + R F/R SG = +1R F= 698R L= 100SIDE AG = +5R F= 562R L= 100R S= 140SIDE B SIDE B100mV20ns5V100ns 图32. 500 mV阶跃响应,G = +1图36. 20 V阶跃响应,G = +5SIDE A G = +1R F= 562R L= 100562+15V10 F0.1 F562V INPULSEGENERATORT R/T F= 250ps5510078SIDE B1/2 AD8150.1 F10 F–15VR L= 100 1V20ns图33. 4 V阶跃响应,G = +1图37.测试电路,增益= –1SIDE A G = +1R F= 562R L= 100SIDE A G = –1R F= 562R L= 100SIDE B SIDE B2V50ns 100mV20ns 图34. 10 V阶跃响应,G = +1图38. 500 mV阶跃响应,G = –1REV的. B–9–AD815选择反馈和增益电阻SIDE A G = –1R F= 562 R L= 100SIDE B 晴朗的规模收益平直度将在一定程度上,随反馈电阻.因此,它建议,一旦最佳电阻值已经确定,1%宽容应使用的值,如果它是理想的维持平直度以上表的生产lots.广泛I显示最佳值几个有用的配置.这些应作为在任何应用的角度出发.电阻值表I.1V20nsR F( )G=+1–1+2+5+105624994994991kR G( )499499125110图39. 4 V阶跃响应,G = –1操作原理该AD815是双高电流反馈放大器(500 mA)输出电流能力.作为电流反馈放大器,AD815的开放式循环的行为表示为阻,∆V O/∆I–IN,或T Z.开环阻的行为就像开环电压增益一个电压反馈放大器,也就是说,它有一个大的dc值并在大约6 dB /倍频程的频率降低.由于R IN成正比1 /克M,的等效电压增益刚刚T Z×g M,其中g M问题是跨导输入的阶段.以此为一个具有增益输出放大器,图40,基本分析得出以下结果:T Z (S)V O=G×V IN TZ (S)+G×RIN+RF其中:R FR GR IN= 1/g M≈25ΩG=1+R FRGR INR NV IN印刷电路板布局注意事项正如所预期的宽频放大器,PC板寄生可以影响整个闭环性能.令人关注的在输出杂散电容和反相输入节点.如果地面平面是用于对电路板的同一面,信号的痕迹,一个空间(5 mm分钟)应由各地信号线,以减少耦合.电源旁路V OUT充足的电力供应旁路优化时可能是至关重要的一个高频率的电路性能.在电感电源引线可以产生共振电路形式高峰在放大器的响应.此外,如果大电流瞬变必须提供给负载,然后旁路电容器(通常比1更大µF)将被要求提供最好的建立时间和最低的失真.并行组合10.0µF和0.1µF建议.在一些低频率申请,比10更大的旁路电容µF可必要的.由于大负载电流的交付AD815,必须给予特别考虑到小心绕过.在两个电源旁路电容的接地回路,以及常见的信号必须是“明星”连接,如图所示41.+V S+IN图40.电流反馈放大器工作R FRG (OPTIONAL)R F+OUT认识到G×R IN<< R F低收益,它可以被视为第一批订单,为了这个放大器的带宽是独立的增益(G).考虑到额外的极点相,过量贡献高频率,有一个反馈电阻低于最低这可能会导致峰值或振荡.这其实是用来确定最佳反馈电阻,RF.在实践中在反相输入端的寄生电容也将增加相在反馈回路,所以挑选一个最佳值的RF可能是困难的.实现和维护获得比在0.1 dB更好平直度上述10 MHz频率需要仔细考虑几个问题.–10––IN–OUT–V S图41.信号地在“星”连配置REV的. BAD815DC ERRORS AND NOISE有三个主要的噪声和失调方面考虑电流反馈放大器.偏移误差是指公式如下.对于噪声误差的条款root-sum-squared 给予净输出错误.在下面的电路(图42),他们是输入失调(V IO )这在乘以输出出现电路的噪声增益(1 + R F /R G ),同相输入当前(I BN ×R N )也乘以噪声增益,而反相输入电流,当它们之间的分歧R F和RG随后乘以噪声增益总是出现在输出为I BI×R F .的输入电压噪声的AD815在比2 nV/√Hz.虽然少,低增益反相输入电流噪声倍R F 是主要噪声源.小心布局和设备配套,并有助于更好地抵消为AD815漂移规范相比,许多其他电流反馈放大器.典型的性能曲线在下面可以用方程来预测结合在任何的应用程序AD815性能. R R V OUT =V IO × 1+F ±I BN ×R N × 1+F ±I BI ×R F R G R G  RFR GI BI图44给出了输出电压摆幅之间的关系成各种载荷和功率消耗的AD815 (P IN).鉴于此数据为正弦波和方波(最差案)的条件.应该指出的是,这些图表大部分电阻(相位<±10°)负载.当功耗需求已经确定,公式1和对图图45可以用来选择合适的散热配置.f = 1kHz 4SQUARE WAVESINE WAVEP IN– Watts3R L = 1002R L = 2001R L = 50102030V OUT – Volts p-p40图44.总功耗对比差分输出电压V OUTR NI BN通常情况下,AD815将直接焊接到铜焊垫.图图45θJA 对铜焊垫大小.该数据属于铜对pads环氧玻璃机板都连接双方G10连同上5 mm中心贯穿件网格.这些数据表明,100 ohms或负载较少,通常不会要求任何比这更多.这是一个AD815的功能15-lead权力的SIP 包装.一个重要组成部分θJA 是热电阻包装到散热器.给出的数据是直接的焊接铜连接的包装 焊垫.使用的散热器无论是使用或不使用绝缘垫圈油脂会增加这个电话号码.现在存在着几种选择干热连接,系统蒸发散.这些都是从贝格基斯特可作为部分# SP600-90.请与这些产品的制造商的详细资料他们的申请.35图42.输出失调电压力的几点思考该500 mA的AD815驱动能力使其能够车道a 50Ω在40 V页加载时它被配置为差分驱动器.这意味着功耗,P IN,近5瓦.为确保可靠性,该AD815结温应保持在比175°C.扣除这个原因,在AD815将需要一些形式的散热最申请.在图43热图给出了结温之间的基本关系(TJ)和各部件θJA .T J =T A +P INθJAT J1θA(JUNCTION TO DIE MOUNT)30AD815AVR, AY(θJC= 2 C/W)θB(DIE MOUNT T ACASE T JP INTO CASE)θJA– C/W 25θA+θB=θJCθCAθJAT A20θJC15WHERE:P IN = DEVICE DISSIPATIONT A = AMBIENT TEMPERATURET J = JUNCTION TEMPERATURE θJC = THERMAL RESISTANCE – JUNCTION TO CASE θCA= THERMAL RESISTANCE – CASE TO AMBIENT100.5k1k1.5k2k2.5kCOPPER HEAT SINK AREA (TOP AND BOTTOM) –mm2图45.电力包装热电阻与热沉陷区图43.的各种包装热击穿抗性REV的. B –11–AD815其他力的几点思考还有其他的考虑适用于电源AD815.首先,正如许多电流反馈放大器,有一在电源电流增加时,提供一个大peak-to-peak 在高电压,频率,电阻负载.此行为是受在放大器的输出负载存在.图12总结了AD815.全功率响应能力这些曲线向驱动器应用微分(e.g.,图49或图53).最大连续在图12,peak-to-peak输出电压与频率的各种绘制阻性负载.在连续的基础上超过这个值可以损坏AD815.该AD815配备了热敏关闭电路.这电路确保了AD815 电路小片温度保持低于安全水平.在正常工作时,电路将关闭在大约AD815 180°C并允许电路回头约140°C.这个内置的滞后意味着持续的热过载将循环之间上电和断电条件.热循环通常发生在一个1 ms率几秒钟,这取决于在功耗和热时间常数包装和散热.数字46和47说明开车后OUT1到+铁路热关机操作,和OUT2到–铁路,然后短路到地每个AD815.的AD815输出不会损坏在这短暂的运作状态,但在超载情况应予删除.OUT 110090电阻器应放置在每个输出端串联.见图该电路可提供48.到注册到800负载mA 12.5Ω.499+15V0.1 F549910 F110041/2AD8158650499499R L10100111/2AD8157190.1 F–15V10 F图48.高电流输出并联运行微分运算各种电路配置,可用于鉴别如果一对差分驱动信号AD815.操作是无济于事,能,这两个半可以用在一个典型的仪器配置提供一个差分输入电路和输出.图49电路就是这样一个例子.随着电阻所示,电路的增益,增益是可以11.通过更改值的R G.此电路中,然而,不提供共模抑制.+15V+IN10040.1 F10 FOUT 11/2AD81586OUT 2 100%5RF499R LRF499VOUTV IN5V200 sR G100图46. OUT2地短路,方波OUT1, R F= 1 kΩ, R G= 222Ω10–IN100111/2AD8157OUT 290.1 F100 9010 F–15VOUT 1图49.全差分操作创建差分信号OUT 210 0%如果只有一个单端信号可用来驱动AD815和差分输出信号需要,一些电路可以用于执行single-ended-to-differential转换.5ms5V图47. OUT1地短路,方波OUT2, R F= 1 kΩ, R G= 222Ω并联运行为了增加驱动电流,负载都放大器,在AD815可并行连接.每个放大器应设置为相同的增益,以同样的信号驱动.为了确保这两个放大器共享当前,小一个电路来执行,这是用一个双运放预驱动器被配置为一noninverter和逆变器.该如图所示电路50执行此功能.它uses一AD826双运放同一个放大器增益和设置在+1在–1.获得另一方的1 kΩ整个输入电阻终端的追随者,使噪声增益(NG = 1)平等到inverter's.两个输出则差异驱动没有共同的模信号一阶AD815投入.–12–REV的. BAD815+15V+15V0.1 F38+15V0.1 F 1004810 FV IN481k21/2AD8261k151/2AD8156AMP 151/2AD8156R F 499R LR F499R G 100R F1402R L R F2499V OUTR G 1001k61k1/2AD826410751000.1 F111/2AD8157109AMP 2111/2AD81579–15V–15V0.1 F 10 F–15V图50.差分驱动器单端差分转换器图52.直接Single-Ended-to-Differential转换另一个方法创建一个从单一的差分信号端信号是使用变压器中心抽头次级.变压器的中心抽头接地,两个次级绕组连接获得对面极性信号的AD815放大器的两个输入.该为AD815投入偏置电流由该中心提供自来水通过变压器绕组接地连接.使用变压器的一个优点是它能够提供电路之间的路段和隔离,以提供良好的共模抑制.缺点是变压器有没有dc反应,有时会大,重,且价格昂贵.该电路如图51.+15V安培1有其+输入与输入信号驱动的,而+腺苷酸2输入接地.因此,放大器的输入– 2其输出驱动虚地的潜力.因此,安培1配置为五同相增益,(1 + R F1/R G ),因为R G 是连接到放大器2's –输入虚地.当输入放大器+ 1驱动的一个信号,同样信号出现在放大器的输入,这个信号– 1.作为服务输入放大器2配置为增益的–5, (–R F2/R G ).因此,两个输出朝着相反的方向具有相同的增益和建立一个平衡的差分信号.该电路可以工作在不同的收益适当的电阻选择.但在一般情况下,为了改变所产生的收益电路,至少有两个电阻值将被改变.在此外,在此配置的两个运amps噪声增益将永远是一个不同的,因此带宽将不匹配.第二个电路,有没有对上述缺点在上面的电路产生一个差分输出电压反馈在电流反馈运算amps在AD815.对运放出来该电路,在图53,画可作为高功率差分线驱动器,如ADSL需要(非对称数字用户环路)线路驱动.该AD815的运算amps每个配置为单位增益通过反馈电阻跟随(R A ).每个运算放大器的输出也推动通过两个R为其他单位增益反相器B s,创建一个完全对称的电路.100480.1 F10 F50502001/2AD815561kR L1k10100111/2AD815790.1 F–15V10 F图51.与变压器输入差动驱动器直接Single-Ended-to-Differential转换两种类型的电路可以产生差分输出信号一个没有任何其他组件使用单端输入比电阻.这些首先是如图52.如果+输入放大器2接地和一个小积极的信号是适用于放+ 1,输入输出的AMP 1会饱和驱动的积极方向和输出驱动放大器2饱和负方向.这是类似的方式与传统运算放大器在不加任何行为反馈.REV的. B –13–AD815~20pF十二通道视频分配放大器+15VR I49948R F4990.1 F6该AD815高电流使它能够驱动多达十二标准75Ω反向端接视频负载.图54是一这样的应用程序示意图.10 F50(OPTIONAL)V CC V INAMP151/2 AD815250(50 ) (OPTIONAL)R A499R A499R B499R B499100输入视频信号终止75Ω并应用到对每两个放大器的同相AD815.投入放大器配置为两个增益,以补偿divide-by-two每个电缆终端的功能.六个独立75Ω每个放大器的输出电阻是用于电缆回终止.在这种方式下,所有电缆都比较独立于任何电缆互相干扰小会不会对其他连接线的效果.驾驶时以这种方式6个视频电缆,看到的负载每个放大器的输出电阻,等于150Ω/6或25Ω.差分增益和差分相位0.05%是0.45°.+15V0.1 F49910 F1275 10AMP2111/2AD8155097VCC0.1 F–15V10 F图53. Single-Ended-to-Differential 驱动器如果一个电阻(R F)连接从输出到放大器2+负反馈的放大器1,投入是提供哪些关闭循环.输入电阻(R I)将使看起来像一个电路与传统的差分运算放大器的反相配置输出.反相输入输出运算放大器这种双变Pin 4,的安培1.积极投入该电路从输入输出增益,要么将被±R F/ R I.或者是single-ended-to-differential增益为2×R F/R I.差分输出可应用于一初级变压器.如果每个输出摆幅±10 V,有效摆动对变压器初级是40 V的P -磷.可选的电容器可以添加,以防止变压器因电流的任何dc到dc在AD815.输出偏移4995864100VIDEO IN7510011AD81512VIDEO OUTTO 75CABLES91074994990.1 F–15V10 F图54.视频分配放大器驱动AD81512视频电缆C1 B2B1B3J1–15VR148+15VTP4 TP3TP2+15VC20.1 FR3J5C310 F6T1R7C6R8175R223R15C9310R149118JP1126R20J412214R19R5R2R41J22C131/2AD8155U1R6R17J7R162TP13–15VC100.1 FJ3R9R10117R21R121/2AD81510U1C1110 F9R13J6R11R18图55. AD815评估板电路图–14–REV的. BAD815图56. AD815 AVR评估板汇编图图57. AD815 AVR评估板布局(元件层)图58. AD815 AVR评估板布局(焊接面)REV的. B–15–AD815外形尺寸在显示尺寸英寸和(mm).0.110(2.79) 0.152 (3.86)BSC 0.148 (3.76)0.394(10.007)0.137(3.479)0.516TYP(13.106)0.042(1.066)TYP0.080 (2.03)0.065 (1.65)2 PLACES0.079 (2.006)DIA2 PLACES 0.063 (1.60)0.057 (1.45)0.110(2.79)BSC0.152 (3.86)0.148 (3.76)0.394(10.007)0.516 (13.106)0.137(3.479)TYP0.063 (1.60)0.057 (1.45)0.694 (17.63)0.684 (17.37)0.426 (10.82)0.416 (10.57)115115 PIN 10.146 (3.70) 0.138 (3.50)0.600 (15.24)BSC0.798 (20.27)0.778 (19.76)8°0°0.024 (0.61)0.014 (0.36)0.671±0.006(17.043±0.152)SHORT0.080 (2.03) LEAD0.065 (1.65)2 PLACES0.042(1.066)TYP0.079 (2.006)DIA2 PLACES0.182 (4.62)0.172 (4.37)0.426 (10.82)0.416 (10.57)0.088 (2.24)0.068 (1.72)0.666±0.006(16.916±0.152)LONGLEADPIN 10.798 (20.27)0.778 (19.76)0.024 (0.61)0.014 (0.36)0.182 (4.62)0.172 (4.37)0.100 (2.54)BSC0.031 (0.79)SEATING0.024 (0.60) PLANESEATINGPLANE0.050(1.27)BSC0.031 (0.79)0.024 (0.60)0.209±0.010(5.308±0.254)0.700 (17.78) BSC24-Lead热增强SOIC(RB-24)0.6141 (15.60)0.5985 (15.20)241315-Lead通孔和交错的SIP信息直引脚形式(YS-15)0.1100.152 (3.86)(2.79)BSC 0.148 (3.76)0.063 (1.60)0.057 (1.45)0.137(3.48)TYP0.042(1.07)TYP0.516 (13.106)0.394(10.007)0.4193 (10.65)0.3937 (10.00)0.2992 (7.60)0.2914 (7.40)0.694 (17.63)0.684 (17.37)0.426 (10.82)0.416 (10.57)112PIN 10.1043 (2.65)0.0926 (2.35)0.0291 (0.74)x 45°0.0098 (0.25)1150.080 (2.03)0.627±0.010(15.926±0.254)SHORTLEAD0.601±0.010(15.265 0.710 (18.03)±0.254)0.690 (17.53)LONGLEAD0.176 (4.47)0.150 (3.81)0.065 (1.65)2 PLACESPIN 10.700 (17.78) BSC0.798 (20.27)0.778 (19.76)0.079(2.007) DIA2 PLACES0.182 (4.62)0.172 (4.37)SEATINGPLANE0.031 (0.79)0.024 (0.60)0.050 (1.27)BSC–16–REV的. B印刷U.0.0118 (0.30)0.0040 (0.10)0.0500(1.27)BSC8°0.0201 (0.51)0°SEATING 0.0125 (0.32)0.0130 (0.33) PLANE0.0091 (0.23)0.0500 (1.27)0.0157 (0.40)0.024 (0.61)0.014 (0.36)0.169 0.200(4.29) (5.08)BSC BSC0.691±0.010(17.551±0.254)0.766±0.010(19.456±0.254)0.791±0.010(20.091±0.254)0.694 (17.63)0.684 (17.37)C2106 15-Lead表面装载 DDPAK(VR-15)15-Lead通孔和交错的SIP信息90引脚形式(Y-15)。

IOS-MAT-0054_CNv5

IOS-MAT-0054_CNv5
本规范不适用于产品的包装材料,除非包装属于产品的一部分(如:液体涂料的塑料容器)。
参考
本技术规范中化学品要求和测试所引用的标准,如欧盟指令,都适用标准、指令的最新版本,除非 另有说明。
本资料仅供参考,英文版本 IOS-MAT-0054 具有最终法律效力。
1 of 23 2009-10-26 Elsa Hou 译稿
表2. 实木、木基材料和天然材料的要求
物质
要求
测试方法
文件
硼及其化合物
不允许使用硼及其化合物。
在实木(包括实木拼板)、 污染限值:硼及其化合物的迁移 天然纤维、胶合板、层压 值:30 mg 硼/kg 板/弯曲木中
如果木材有涂层,在 SD 测试前应去除涂层。
DIN 53160(用人工 合成汗液进行萃取, 16小时,23 °C), 然后依照EN ISO 11885(ICP/AES分 析)
IOS-MAT-0054 第五版译文
原版本代号:
审稿人:Jason Liu, Teresa Xu, Sebrina Chen
AA-92520-5 2009-10-09
化合物和化学物质:对儿童产品与玩具的附加要求
内容
本规范阐述了宜家对所有儿童产品(包括玩具)的化合物和化学物质的附加要求。
关于此规范
本规范的目的是确保儿童产品和玩具在儿童使用时是安全的,因为儿童更为敏感,并且接触产品的 方式与成人不同(如吮吸和咀嚼)。
染料
不允许使用。
在印刷或上色的纸/纸板中 污染限值:每种染料10 mg/kg
甲醛(50-00-0)
甲醛含量不可高于30mg/kg。 EN 71-11
文件 SD
SD
2.3 纺织品
表4.对纺织品的要求

DS1881Z-045T中文资料

DS1881Z-045T中文资料
♦ Configuration Option 1: 63 Positions Provide 1dB Attenuation Steps from 0dB to -62dB Plus Mute
♦ Configuration Option 2: (Software-Compatible with the DS1808): 33 Positions Plus Mute as Follows Positions 0–12: 1dB per Step for 12 Steps Positions 13–24: 2dB per Step for 12 Steps Positions 25–32: 3dB per Step for 8 Steps
Two attenuation configuration options provide optimum flexibility for the specific application. Configuration Option 1 provides 63 logarithmic tapered steps (0dB to -62dB, 1dB/step) plus a mute setting. Configuration Option 2 has 32 logarithmic steps plus mute and provides software compatibility with the DS1808. When Configuration Option 2 is used in combination with the 16-pin SO package, the DS1881 is both software and pin compatible with the DS1808 in 5V applications.

BOSCH NWD-455 FlexiDome IP 摄像机 说明书

BOSCH NWD-455 FlexiDome IP 摄像机 说明书

NWD-455 FlexiDome IP 是一款精心设计的高性能 1/3 英寸 CCD 网络摄像机,可以在任何时刻拍摄出绝佳品质的图像。

这款结构精巧的防破坏摄像机能够以每秒高达 25 幅 (PAL) 和 30 幅 (NTSC)图像的速度产生 DVD 品质的 MPEG-4 视频。

网络视频信号通过 IP 网络发送,可由 PC Web 浏览器接收和显示,通过 DiBos 混合录像系统查看或记录,或者作为 VIDOS 或 BVMS 视频管理系统的一部分进行管理。

此外,BOSCH Video over IP (BVIP)解码器还可解码 MPEG4 视频流,以便在 CVBS 或 VGA 监视器上查看。

FlexiDome IP 采用了 MPEG-4 压缩、带宽限制和组播功能,不仅可以高效地管理带宽和存储要求,同时还能提供无与伦比的图像品质和清晰度。

模拟监视视频输出和屏显菜单 (OSD) 简化了焦距调节和网络配置,进而降低了安装和支持成本。

以太网供电 (PoE) 功能使摄像机不必使用交流电源,不仅简化了安装,同时也节省了成本。

基本功能MPEG-4 视频编码技术FlexiDome MPEG-4 编码器能够以较低的比特率产生高品质的视频流,不仅大大减少了带宽和存储要求,而且还进一步降低了成本。

每个 FlexiDome IP 摄像机均能以每秒 25/30 幅(PAL 和NTSC)的速度生成真正 4CIF 清晰度的图像。

高度智能FlexiDome IP 摄像机支持尖端的增强型智能技术,能为下列方面造成的多种组合画面情况提供强大的防破坏检测功能:视频丢失、遮挡、覆盖、散焦和转移摄像机方向。

此外,博世还提供智能视频移动探测 (IVMD) 功能(需另购许可证)。

这种功能可以在视频输入线路上直接提供视频内容分析 (VCA),从而实现更先进的 VCA。

三重视频流FlexiDome IP 摄像机可以同步生成两条独立的 MPEG-4 视频流和一条 JPEG 流,并允许五位用户同步进行访问。

UL1598中文版本

UL1598中文版本
6.H签 – 不须要的警告标签 6.5.3(CAN) 标签 – 不须要的警告标签 6.5.5(CAN) 标签 – 不须要的警告标签 6.6.5(CAN) 标签 – 不须要的警告标签
7.装于天花板的灯具-副属条款 7.2.5(USA) 最重 50 磅的灯具 7.3.13(CAN) 户外灯用铁柱的额外规定 7.6.7(USA) 无固定电源线的说明书 7.6.9(CAN) 75℃的电源线
风而避免发生湿气累积之处. Luminaire—能提供装上灯泡并连接到电源供应处的完整照明设备. Luminaire,canopy type—装于室外天房盖或帐蓬的灯具,非用于装有隔热的室内或室外处. Luminaire,convertible—可将 IC Type 的崁灯变为 Non- IC Type,或将 Non- IC Type 崁灯变成
热质包住. Lamp –supported lampholder—由灯泡所支撑的灯头,意即由灯具所支撑.. Live part—无基本绝缘的导电零件而具有触电的危险,电线的白线即为 Live part. Location,damp—室内或室外包括部份有保护之处,于正常或周期性的于电器产品里头,外头
或上头会产生湿气. Location,dry—针对潮湿的正常情形下但或许包含于建筑物于建筑其间暂时会潮湿,提供通
4.白热灯具-副属条款 4.1.2(CAN) 标签-不须要的警告标签 4.2.5.2(CAN) 标签-不须要的警告标签 4.2.6.1(CAN) 标签-不须要的警告标签 4.3.1.2(CAN) 标签-不须要的警告标签 4.3.1.4(USA) 标签-不须标示的灯泡保护罩 4.3.2.1(CAN) 标签-不须要的警告标签 4.3.2.3(CAN) 标签-不须要的警告标签 5.日光灯具-副属条款 5.3.3(CAN) 崁灯用的电源线 5.5.2(USA) 免温度测试的灯具

RFID电子标签30577

RFID电子标签30577

4、声表面波电子标签
• 声表面波(Surface Acoustic Wave, SAW)是传播于晶体 表面的一种机械波,其声速仅为电磁波速的十万分之一, 传播衰耗很小。
• 声表面波器件的功能部分,是采用现代微电子技术在表面 抛光的压电材料基片上制作的叉指换能器、反射体和耦合 栅等金属电极结构,基于(逆)压电效应,射频信号在经 历电磁波---声表面波---电磁波的换能过程中得到处理,达 到预定功能要求。
2、电子标签的组成
• 电子标签主要由天线、射频接口和芯片三部分组成,其内 部框图如下图所示:
ROM
射频接口

调制器
线
解调器
电压调节器
芯片
逻辑控制单元
EEPROM
2、电子标签的组成
• 电子标签内部又可细分为以下几个小单元:
①天线:主要的功能是接收阅读器传送过来的电磁信号或者将 阅读器所需要的数据传回给阅读器,也就是负责发射和接收 电磁波。它是电子标签与读写器之间联系的重要一环;

三线折叠偶极子
3、电子标签的分类
• 射频识别系统可以应用于不同的领域和场合,不同的应用 场合对RFID系统中电子标签的要求也不尽相同。为了满 足这些多种多样的需求,电子标签的种类也多种多样。
• ①按照标签获取能量的方式分类 • ②按照标签的工作频率分类 • ③按照数据调制方式分类 • ④按照存储器类型分类 • ⑤按照标签作用距离分类 • ⑥按照标签封装材质分类
2.2 电子标签天线
• 此外,考虑到天线的阻抗问题、辐射模式、局部结构、作用 距离等因素的影响,为了以最大功率进行传输数据,天线后 的芯片的输入阻抗必须和天线的输出阻抗相匹配。
• 因此在电子标签中应该使用方向性天线,而不是全向天线, 方向性天线具有更少的辐射模式和更少的返回损耗干扰。

英特尔商品说明书:RoHS限制有害物质数据表,2005年11月版

英特尔商品说明书:RoHS限制有害物质数据表,2005年11月版

Material Declaration DatasheetRestriction on Hazardous Substances (RoHS) ComplianceManufacturer:IntelCorporation Date: 11 November 2005Equipment type: desktop board Product weight: 610.6 gramsModel designation: D915GUX Lead-free product: Lead-free Second Level Interconnects (SLI) onlyRoHS Definitions:Quantity limit of 0.1% by mass (1000 ppm) for; Lead (Pb); Mercury; Hexavalent Chromium; Polybrominated Biphenyls (PBB); Polybrominated Diphenyl Ethers (PBDE). Quantity limit of 0.010% by mass (100 ppm) for Cadmium.Intel understands RoHS compliance requires Lead and other materials banned in RoHS Directive are either (1) below all applicable substance thresholds as proposed by the EU, or (2) an approved or pending exemption applies. Note, RoHS implementation details are subject to change.RoHS Declaration:This product is RoHS directive compliant but does contain Lead, a RoHS restricted substance per the definitions above. This product uses the following applicable RoHS technology exemptions:- Lead in glass of electronic components- Lead in electronic ceramic parts (e.g. piezoelectronic devices)- Lead as an alloying element in aluminum containing up to 0.4% lead by weight- Lead in high melting temperature type solders (i.e. lead based alloys containing 85 % by weight or more lead)- Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packagesThis product has been verified to be in conformance with EU directive 2002/95/EC as currently understood. To the best ofour knowledge the information contained in this declaration is true and correct.Level A Materials and Substances:Materials from Annex A of the EIA/EICTA/JGPSSI Material Composition Declaration Guide and listed below are not contained in this product in quantities above the threshold level for these materials, nor intentionally added to this product.AsbestosAzo colorantsCadmium/Cadmium compounds Hexavalent Chromium Hexavalent Chromium compounds Mercury/Mercury compoundsOzone Depleting SubstancesPolybrominated Biphenyls (PBBs)Polybrominated Diphenylethers (PBDEs)Polychlorinated Biphenyls (PCBs)Polychlorinated NaphthalenesRadioactive substancesShortchain Chlorinated ParaffinsTributyl Tin (TBT) and Triphenyl Tin (TPT)Tributyl Tin Oxide (TBTO)This product may contain Lead or Lead compounds in discreet component parts above the homogenous material threshold level of 1000 ppm per the RoHS exemptions above. In the aggregate, the Lead concentration for this product is 589 ppm. Level B Materials and Substances:This product does contain materials listed in Annex B of the EIA/EICTA/JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm as listed below.Material / Substance Antimony/Antimony compounds Brominated flame retardants Nickel/Nickel compounds Description of Useflame retardantflame retardantplatingLocation in Productboard substrateboard substratecomponent platingMaterial Concentration3,410ppm33,200ppm4,520ppmCOMMENTS1.The data reported for Level A and B materials and substances are based on analytical testing of a representative sample product.Individual test results may vary due to differences in production and/or sensitivities of analytical testing methods. Data shown reflect analytical testing intended to validate Intel's RoHS compliance systems. Intel’s certification of RoHS compliance at the homogenous material level is based on Supplier Declarations of Conformance.2.This declaration is based on the product specified, with all product skus of this product eligible to be covered by this declaration.3.Material concentration data in parts per million (ppm) is representative of all product skus within the product family.4.Material mass can be estimated by multiplying concentration (in ppm) by product weight.5.The remainder of this product consists of non-reportable metals (i.e., copper, iron, tin), epoxy resin and other non-metal materials. INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO THIS MDDS. INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES, DIRECT OR INDIRECT, CONSEQUENTIAL OR OTHERWISE, SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS MDDS THAT HAS BEEN UPDATED OR CHANGED.Page 1 of 2关于符合中国《电子信息产品污染控制管理办法》的声明Management Methods on Control of Pollution fromElectronic Information Products(China RoHS declaration)产品中有毒有害物质的名称及含量有毒有害物质或元素 部件名称(Parts) 铅(Pb)汞(Hg)镉(Cd)六价铬(Cr6+)多溴联苯(PBB)多溴二苯醚(PBDE)主板组件Motherboard Assembly× ○○○○○○:表示该有毒有害物质在该部件所有均质材料中的含量均在SJ/T 11363-2006标准规定的限量要求以下。

DA芯片大全

DA芯片大全

常见的D/A和A/DPart Number D escriptionDAC5571 具有高速I2C 输入的低功耗8 位DACDAC5573 具有I2C 接口的8 位四路DACDAC5574 具有I2C 接口的8 位四路数模转换器DAC908 8 位165MSPS SpeedPlus(TM) DAC,可伸缩电流输出在2mA 与20mA 之间THS5641A 8 位、100MSPS、CommsDAC(TM) DAC、介于2mA 至20mA 的可伸缩电流输出TLC5602 8 位,30MSPS 单DACTLC5620 8 位、10us 四路DAC,串行输入、1x 或2x 输出可编程、同步更新、低功耗TLC5628 8 位,10us 八路DAC,串行输入,1x 或2x 输出可编程,同步更新,低功耗TLC7225 8 位5us 四路DAC 并行输入同步更新二进制输入编码TLC7226 8 位,5us 四路DAC,并行输入、单/双电源TLC7524 8 位,0.1us MDAC,并行输入,DSP 快速控制信号,简单微接口TLC7528 8 位,0.1us 双路MDAC,并行输入,DSP 快速控制信号,简单微I/FTLC7628 8 位,0.1us 双路MDAC,并行输入,DSP 快速控制信号TLV5620 8 位、10us DAC 串行输入四路DAC 可编程 1x 或2x 输出,同步更新TLV5621 8 位、10us 四路DAC,串行输入、简单2 线接口、可编程 1x 或2x 输出、断电功能TLV5623 8 位3us DAC,具有串行输入、可编程稳定时间/功耗、超低功耗TLV5624 8 位1.0 至3.5us DAC,具有串行输入、可编程内部参考和稳定时间TLV5625 8 位2.5 或12us 双路DAC,具有串行输入、可编程稳定时间TLV5626 8 位1us 双路DAC,具有串行输入、可编程内部参考和稳定时间TLV5627 8 位3us 四路DAC,具有串行输入、低功耗、H/W 或S/W 关断状态TLV5628 8 位,10us 八路DAC,串行输入,可编程 1x 或2x 输出,低功耗TLV5629 8 位8 通道1/3 us DAC,具有串行输入、可编程建立时间/功耗、低功耗和电源关闭功能TLV5632 8 位8 通道1/3us DAC,串行输入、可编程建立时间/功耗、低功耗、自动断电、内部参考10 位分辨率数模转换器DAC (15)Part Number D escriptionDAC2900 双路10 位125Msps 数模转换器DAC5652 双路10 位200MSPS 数模转换器DAC6571 DAC6571:10 位数模转换器DAC6573 具有I2C 接口的10 位四路DACDAC6574 具有I2C 接口的10 位4 路数模转换器DAC900 10 位165MSPS SpeedPlus(TM) DAC,可伸缩电流输出在2mA 与20mA 之间THS5651A 10 位、100MSPS、CommsDAC、差动介于2mA 至20mA 的可伸缩电流输出TLC5615 10 位,12.5us DAC,串行输入,低功耗TLV5604 10 位3us 四路DAC,具有串行输入、同步更新、可编程稳定时间和断电功能TLV5606 10 位、3 或9 us DAC、串行输入、可编程建立时间/功耗、超低功耗TLV5608 2.7V 至5.5V 10 位8 通道串行DACTLV5608IYE 采用晶圆芯片级封装的2.7V 至5.5V、12 位和10 位八路DACTLV5617A 10 位2.5 双路DAC,具有串行输入、可编程稳定时间TLV5631 具有内部参考的2.7V 至5.5V 10 位8 通道串行DACTLV5637 10 位1us DAC,具有串行输入、双路DAC、可编程内部参考和稳定时间12 位分辨率数模转换器DAC (55)Part Number D escriptionDAC2902 双路12 位125Msps 数模转换器DAC2932 超低功耗29mW 12 位双路40MSPS D/A,具有 4 个附加的控制DAC 用于进行发送/接收路径控制DAC5662 12 位200MSPS 双DACDAC7512 低功耗轨至轨输出12 位串行输入DACDAC7513 低功耗轨至轨输出12 位串行输入DACDAC7541 低成本12 位CMOS 四象限乘法D/A 转换器DAC7545 CMOS 12 位乘法位数模转换器,与微处理器兼容DAC7551 12 位超低短时脉冲波形干扰电压输出数模转换器DAC7552 12 位、双路、超低短时脉冲波形干扰、电压输出数模转换器DAC7553 12 位、双路、超低短时脉冲波形干扰、电压输出数模转换器DAC7554 低功耗低短时脉冲波形干扰12 位DACDAC7558 12 位、八路、超低短时脉冲波形干扰、电压输出数模转换器DAC7571 低功耗轨至轨输出12 位I2C 输入DACDAC7573 具有I2C 数字接口的四路12 位10us 数模转换器DAC7574 具有I2C 接口的12 位四路电压输出数模转换器DAC7611 12 位串行输入数模转换器DAC7612 双路12 位串行输入数模转换器DAC7613 12 位电压输出数模转换器DAC7614 四路串行输入12 位电压输出数模转换器DAC7615 四路串行输入,12 位电压输出数模转换器DAC7616 四路串行输入12 位电压输出数模转换器DAC7617 四路串行输入12 位电压输出数模转换器DAC7621 12 位并行输入数模转换器DAC7624 12 位四路电压输出数模转换器DAC7625 12 位四路电压输出数模转换器DAC7714 四路串行输入12 位电压输出数模转换器DAC7715 四路串行输入,12 位电压输出数模转换器DAC7724 12 位四路电压输出数模转换器DAC7725 12 位四路电压输出数模转换器DAC7800 双路单片CMOS 12 位乘数模转换器DAC7801 双路单片CMOS 12 位乘数模转换器DAC7802 双路单片CMOS 12 位乘数模转换器DAC7811 12 位串行输入乘法数模转换器DAC7821 12 位串行输入乘法DACDAC7822 双路12 位串行输入乘法DACDAC8043 CMOS 12 位串行输入乘法数模转换器DAC811 兼容微处理器的12 位数模转换器DAC813 兼容微处理器的12 位数模转换器DAC902 12 位165MSPS SpeedPlus(TM) DAC,可伸缩电流输出在2mA 与20mA 之间THS5661A 12 位、125MSPS、CommsDAC、差动介于2mA 至20mA 的可变电流输出TLC5618A 12 位、2.5us 二路DAC、串行输入、可编程稳定时间、同步更新、低功耗TLV5610 2.7V 至5.5V 12 位8 通道串行DACTLV5610IYE 采用晶圆芯片级封装的2.7V 至5.5V、12 位和10 位八路DACTLV5610IYZ 采用晶圆芯片级封装的2.7V 至5.5V、12 位和10 位八路DACTLV5613 12 位,DAC,并行电压输出,可编程设定时间/功耗,自动断电TLV5614 12 位3us 四路DAC,具有串行输入、可编程稳定时间、低功耗和H/W 或S/W 断电功能TLV5614Y 采用晶圆芯片级封装的2.7V 至5.5V 12 位DACTLV5616 12 位3us DAC 串行输入可编程设置时间/功耗,电压O/P 范围= 2x 基准电压TLV5618A 12 位2.5us 双路DAC,具有串行输入、可编程稳定时间、在Q temp 温度范围内运行TLV5619 12 位单通道并行DAC,具有电压输出、低功耗和异步更新TLV5630 具有内部参考的2.7V 至5.5V 12 位8 通道串行DACTLV5633 12 位DAC,具有并行电压输出可编程内部参考设置时间、功耗、8 位微控制器兼容接口TLV5636 12 位1us DAC,具有串行输入、可编程内部参考和稳定时间TLV5638 12 位、1 或3.5us DAC,具有串行输入、双路DAC、可编程内部参考和稳定时间、功耗TLV5639 12 位,DAC,并行,电压输出,可编程内部参考,建立时间、功耗、1 通道14 位分辨率数模转换器DAC (11)Part Number D escriptionDAC2904 14 位125MSPS 双路通信DACDAC5672 数模转换器DAC5674 具有2x/4x 插值滤波器的14 位400 CommsDACDAC5675A 14 位400MSPS 数模转换器DAC8801 14 位串行输入乘法数模转换器DAC8802 二路、串行输入14 位乘法DACDAC8803 14 位、四路、串行输入乘法数模转换器DAC8805 Dual, Parallel Input, 14-Bit, Multiplying Digital-to-Analog ConverterDAC8806 14 位并行输入乘法DACDAC904 可伸缩电流输出在2mA 与20mA 之间的14 位165MSPS SpeedPlus(TM) DAC THS5671A 14 位125 MSPS CommsDAC,差动介于2mA 至20mA 的可伸缩电流输出16 位分辨率数模转换器DAC (45)Part Number D escriptionDAC1221 16 位低功耗数模转换器DAC5686 具有16x 内插的高性能16 位 500MSPS 双DACDAC5687 16 位500 MSPS 2x-8x 内插双通道数模转换器(DAC)DAC712 具有16 位总线接口的16 位数模转换器DAC714 具有串行数据接口的16 位数模转换器DAC715 具有16 位总线接口的16 位数模转换器DAC716 具有串行数据接口的16 位数模转换器DAC7631 串行输入16 位电压输出数模转换器DAC7632 具有串行接口的16 位双路电压输出DACDAC7634 16 位四路电压输出数模转换器DAC7641 16 位电压输出数模转换器DAC7642 具有并行接口和复位到中间等级功能的16 位双路电压输出DACDAC7643 具有并行接口和复位到最小等级功能的16 位双路电压输出DACDAC7644 16 位四路电压输出数模转换器DAC7654 16 位四路电压输出数模转换器DAC7664 数模转换器;四路、16 位、12uS 稳定时间、+/- 1 LSB DNLDAC7731 具有内部+10V 参考和串行I/F 的16 位单通道数模转换器DAC7734 16 位四路电压输出串行输入数模转换器DAC7741 具有内部+10V 参考和并行I/F 的16 位单通道数模转换器DAC7742 具有内部参考的16 位单通道并行接口DAC7744 16 位四路电压输出数模转换器DAC8501 乘法、低功耗、轨至轨输出、16 位串行输入数模转换器DAC8531 低功耗轨至轨输出16 位串行输入数模转换器DAC8532 具有串行接口和轨至轨电压输出的16 位双通道低功耗模数转换器DAC8534 2.7V 至5.5V 四通道16 位串行输入DACDAC8541 具有1.8V 兼容并行接口和轨至轨电压输出的低功耗16 位数模转换器DAC8544 四路16 位四路轨至轨电压输出并行接口数模转换器DAC8550 16 位、超低短时脉冲波形干扰、电压输出DACDAC8551 16 位、超低短时脉冲波形干扰、电压输出数模转换器DAC8552 DAC8552:16 位双路电压输出数模转换器DAC8554 16 位、四通道、超低短时脉冲波形干扰、电压输出数模转换器DAC8555 16 位、四通道、超低短时脉冲波形干扰、电压输出数模转换器DAC8560 DAC8560DAC8571 低功耗轨至轨输出16 位I2C 输入DACDAC8574 低功耗四路轨至轨输出16 位I2C 输入DACDAC8580 16 位高速低噪声电压输出数模转换器DAC8581 16 位高速低噪声电压输出数模转换器DAC8811 16 位串行输入乘法数模转换器DAC8812 16 位、双串行输入乘法数模转换器DAC8814 16 位、四路、串行输入乘法数模转换器DAC8820 16 位并行输入乘法DACDAC8822 Dual, Parallel Input, 16-Bit, Multiplying Digital-to-Analog Converter DAC8830 16 位超低功耗电压输出数模转换器DAC8831 16 位、超低功耗、电压输出数模转换器DAC8832 16 位、超低功耗、电压输出数模转换器20 位分辨率数模转换器DAC (1)Part Number D escriptionDAC1220 20 位低功耗数模转换器10 位通用A/D 转换器(转换速率<1MSPS )。

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General DescriptionThe DS17285, DS17485, DS17885, DS17287, DS17487,and DS17887 real-time clocks (RTCs) are designed to be successors to the industry-standard DS12885 and DS12887. The DS17285, DS17485, and DS17885 (here-after referred to as the DS17x85) provide a real-time clock/calendar, one time-of-day alarm, three maskable interrupts with a common interrupt output, a programma-ble square wave, and 114 bytes of battery-backed NV SRAM. The DS17x85 also incorporates a number of enhanced functions including a silicon serial number,power-on/off control circuitry, and 2k, 4k, or 8kbytes of battery-backed NV SRAM. The DS17287, DS17487, and DS17887 (hereafter referred to as the DS17x87) integrate a quartz crystal and lithium energy source into a 24-pin encapsulated DIP package. The DS17x85 and DS17x87power-control circuitry allows the system to be powered on by an external stimulus such as a keyboard or by a time-and-date (wake-up) alarm. The PWR output pin is triggered by one or either of these events, and is used to turn on an external power supply. The PWR pin is under software control, so that when a task is complete, the sys-tem power can then be shut down.For all devices, the date at the end of the month is auto-matically adjusted for months with fewer than 31 days,including correction for leap years. It also operates in either 24-hour or 12-hour format with an AM/PM indicator.A precision temperature-compensated circuit monitors the status of V CC . If a primary power failure is detected,the device automatically switches to a backup supply. A lithium coin cell battery can be connected to the V BAT input pin on the DS17x85 to maintain time and date oper-ation when primary power is absent. The DS17x85 and DS17x87 include a V BAUX input used to power auxiliary functions such as PWR control. The device is accessed through a multiplexed byte-wide interface.ApplicationsEmbedded Systems Utility Meters Security SystemsNetwork Hubs, Bridges, and RoutersFeatures♦Incorporates Industry-Standard DS12887 PC Clock Plus Enhanced Functions ♦RTC Counts Seconds, Minutes, Hours, Day, Date,Month, and Year with Leap Year Compensation Through 2099♦Optional +3.0V or +5.0V Operation ♦SMI Recovery Stack ♦64-Bit Silicon Serial Number♦Power-Control Circuitry Supports System Power-On from Date/Time Alarm or Key Closure ♦Crystal Select Bit Allows Operation with 6pF or 12.5pF Crystal ♦12-Hour or 24-Hour Clock with AM and PM in 12-Hour Mode ♦114 Bytes of General-Purpose, Battery-Backed NV SRAM ♦Extended Battery-Backed NV SRAM2048 Bytes (DS17285/DS17287)4096 Bytes (DS17485/DS17487)8192 Bytes (DS17885/DS17887)♦RAM Clear Function♦Interrupt Output with Six Independently Maskable Interrupt Flags ♦Time-of-Day Alarm Once per Second to Once per Day ♦End of Clock Update Cycle Flag ♦Programmable Square-Wave Output♦Automatic Power-Fail Detect and Switch Circuitry ♦Available in PDIP, SO, or TSOP Package (DS17285, DS17485, DS17885)♦Optional Encapsulated DIP (EDIP) Package with Integrated Crystal and Battery (DS17287,DS17487, DS17887)♦Optional Industrial Temperature Range Available ♦Underwriters Laboratory (UL) RecognizedDS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clocks______________________________________________Maxim Integrated Products 1Rev 0; 4/06For pricing, delivery, and ordering information,please contact Maxim/Dallas Direct!at 1-888-629-4642, or visit Maxim’s website at .Ordering Information, Pin Configurations, and Typical Operating Circuit appear at end of data sheet.D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 2_____________________________________________________________________ABSOLUTE MAXIMUM RATINGSDC ELECTRICAL CHARACTERISTICS(V= +4.5V to +5.5V, or V = +2.7V to +3.7V, T = Over the operating temperature range, unless otherwise noted.Typical Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.Voltage Range on V CC Pin Relative to Ground....-0.3V to +6.0V Operating Temperature Range (Noncondensing)Commercial.........................................................0°C to +70°C Industrial..........................................................-40°C to +85°CStorage Temperature.........................................-55°C to +125°C Soldering Temperature.....................See IPC/JEDEC J-STD-020Specification (Note 1)Soldering Temperature (leads, 10 seconds)...................+260°CDC ELECTRICAL CHARACTERISTICSDS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksAC ELECTRICAL CHARACTERISTICSD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 4_____________________________________________________________________AC ELECTRICAL CHARACTERISTICSWrite TimingDS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clocks_____________________________________________________________________5Read TimingPower-Up/Power-Down TimingD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 6_____________________________________________________________________POWER-UP/POWER-DOWN CHARACTERISTICS(T A = -40°C to +85°C) (Note 2)CAPACITANCENote 1:RTC modules can be successfully processed through conventional wave-soldering techniques as long as temperature exposure to the lithium energy source contained within does not exceed +85°C. However, post-solder cleaning with water-washing techniques is acceptable, provided that ultrasonic vibrations not used to prevent damage to the crystal.Note 2:Limits at -40°C are guaranteed by design and not production tested.Note 3:All voltages are referenced to ground.Note 4:All outputs are open.Note 5:Specified with CS = RD = WR = V CC , ALE, AD0–AD7 = 0.Note 6:Applies to the AD0–AD7 pins, IRQ , and SQW when each is in a high-impedance state.Note 7:Measured with a 32.768kHz crystal attached to X1 and X2.Note 8:Measured with a 50pF capacitance load plus 1TTL gate.Note 9:If the oscillator is disabled in software, or if the countdown chain is in reset, t REC is bypassed, and the part becomesimmediately accessible.Note 10:Guaranteed by design. Not production tested.data.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clocks_____________________________________________________________________7SUPPLY CURRENT vs. INPUT VOLTAGEV BAT (V)S U P P L Y C U R R E N T (n A )3.53.33.02.82503003504002002.53.8SUPPLY CURRENT vs. TEMPERATURETEMPERATURE (°C)S U P P L Y C U R R E N T (n A )655035205-10-25300350400250-4080OSCILLATOR FREQUENCY vs. SUPPLY VOLTAGED S 17285/87 t o c 03SUPPLY VOLTAGE (V)O S C I L L A T O R F R E Q U E N C Y (H z )5.04.54.03.53.032768.132768.232768.332768.432768.532768.632768.732768.02.55.5Typical Operating Characteristics(V CC = +3.3V, T A = +25°C, unless otherwise noted.)D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 8_____________________________________________________________________Pin Description (continued)DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks 10____________________________________________________________________Figure 1. Functional DiagramDetailed DescriptionThe DS17x85 is a successor to the DS1285 real-time clock (RTC). The device provides 18 bytes of real-time clock/calendar, alarm, and control/status registers and 114 bytes of nonvolatile battery-backed RAM. The device also provides additional extended RAM in either 2k/4k/8kbytes (DS17285/DS17485/DS17885). A time-of-day alarm, six maskable interrupts with a common interrupt output, and a programmable square-wave output are available. It also operates in either 24-hour or 12-hour format with an AM/PM indicator. A precision temperature-compensated circuit monitors the status of V CC . If a primary power-supply failure is detected, the device automatically switches to a backup supply. The backup supply input supports a primary battery, such as a lithium coin cell. The device is accessed by a mul-tiplexed address/data bus.Oscillator CircuitThe DS17x85 uses an external 32.768kHz crystal. The oscillator circuit does not require any external resistors or capacitors to operate. Table 1 specifies several crystal parameters for the external crystal, and Figure 2shows a functional schematic of the oscillator circuit.The oscillator is controlled by an enable bit in the con-trol register. Oscillator startup times are highly depen-dent upon crystal characteristics, PC board leakage,and layout. High ESR and excessive capacitive loads are the major contributors to long startup times. A cir-cuit using a crystal with the recommended characteris-tics and proper layout usually starts within one second.An external 32.768kHz oscillator can also drive the DS17x85. In this configuration, the X1 pin is connected to the external oscillator signal and the X2 pin is floated.Clock AccuracyThe accuracy of the clock is dependent upon the accu-racy of the crystal and the accuracy of the match between the capacitive load of the oscillator circuit and the capacitive load for which the crystal was trimmed.Additional error will be added by crystal frequency drift caused by temperature shifts. External circuit noise coupled into the oscillator circuit may result in the clock running fast. Figure 3 shows a typical PC board layout for isolation of the crystal and oscillator from noise.Refer to Application Note 58: Crystal Considerations with Dallas Real-Time Clocks for detailed information.Clock Accuracy (DS17287, DS17487, and DS17887)The encapsulated DIP (EDIP) modules are trimmed at the factory to ±1 minute per month accuracy at 25°C.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksFigure 2. Oscillator Circuit Showing Internal Bias NetworkFigure 3. Layout ExampleD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Power-Down/Power-UpConsiderationsThe RTC function continues to operate, and all the RAM, time, calendar, and alarm memory locations remain nonvolatile regardless of the level of the V CC input. V BAT or V BAUX must remain within the minimum and maximum limits when V CC is not applied. When V CC falls below V PF , the device inhibits all access,putting the part into a low-power mode. When V CC is applied and exceeds V PF (power-fail trip point), the device becomes accessible after t REC , if the oscillator is running and the oscillator countdown chain is not in reset (Register A). This time period allows the system to stabilize after power is applied. If the oscillator is not enabled, the oscillator enable bit is enabled on power-up, and the device becomes immediately accessible.Power ControlThe power control function is provided by a precise,temperature-compensated voltage reference and a comparator circuit that monitors the V CC level. The device is fully accessible and data can be written and read when V CC is greater than V PF . However, when V CC falls below V PF , the device inhibits read and write access. If V PF is less than V BAT , the device power is switched from V CC to the higher of V BAT or V BAUX when V CC drops below V PF . If V PF is greater than the higher of V BAT or V BAUX , the device power is switched from V CC to the higher of V BAT or V BAUX when V CC drops below the higher backup source. The registers are maintained from the V BAT or V BAUX source until V CC is returned to nominal levels. After V CC returns above V PF , read and write access is allowed after t REC .Time, Calendar, and AlarmLocationsThe time and calendar information is obtained by read-ing the appropriate register bytes. The time, calendar,and alarm are set or initialized by writing the appropri-ate register bytes. The contents of the 12 time, calen-dar, and alarm bytes can be either binary or binary-coded decimal (BCD) format. Tables 3A and 3B show the BCD and binary formats of the 12 time, date,and alarm registers, control registers A to D, plus the two extended registers that reside in bank 1 only (bank 0 and bank 1 switching is explained later in this text).The day-of-week register increments at midnight, incre-menting from 1 through 7. The day-of-week register is used by the daylight saving function, and so the value 1 is defined as Sunday. The date at the end of the month is automatically adjusted for months with fewer than 31 days, including correction for leap years.Before writing the internal time, calendar, and alarm registers, the SET bit in Register B should be written to logic 1 to prevent updates from occurring while access is being attempted. In addition to writing the 12 time,calendar, and alarm registers in a selected format (binary or BCD), the data mode bit (DM) of Register B must be set to the appropriate logic level. All 12 time,calendar, and alarm bytes must use the same data mode. The set bit in Register B should be cleared after the data mode bit has been written to allow the real time clock to update the time and calendar bytes. Once initialized, the real time clock makes all updates in the selected mode. The data mode cannot be changed without reinitializing the 12 data bytes. Tables 3A and 3B show the BCD and binary formats of the 12 time,calendar, and alarm locations.The 24-12 bit cannot be changed without reinitializing the hour locations. When the 12-hour format is selected,the high order bit of the hours byte represents PM when it is logic 1. The time, calendar, and alarm bytes are always accessible because they are double-buffered.Once per second, the eight bytes are advanced by one second and checked for an alarm condition.If a read of the time and calendar data occurs during an update, a problem exists where seconds, minutes,hours, etc., may not correlate. The probability of read-ing incorrect time and calendar data is low. Several methods of avoiding any possible incorrect time and calendar reads are covered later in this text.Real-Time ClocksThe alarm bytes can be used in two ways. First, when the alarm time is written in the appropriate hours, min-utes, and seconds alarm locations, the alarm interrupt is initiated at the specified time each day, if the alarm enable bit is high. In this mode, the “0” bits in the alarm registers and the corresponding time registers must always be written to 0 (see Table3A and 3B). Writing the 0 bits in the alarm and/or time registers to 1 can result in undefined operation.The second use condition is to insert a “don’t care”state in one or more of the alarm bytes. The don’t care code is any hexadecimal value from C0 to FF. The two most significant bits of each byte set the don’t care condition when at logic 1. An alarm will be generated each hour when the “don’t care” bits are set in the hours byte. Similarly, an alarm is generated every minute with don’t care codes in the hours and minute alarm bytes. An alarm is generated every second with don’t care codes in the hours, minutes, and seconds alarm bytes.All 128 bytes can be directly written or read except for the following:1)Registers C and D are read-only.2)Bit 7 of register A is read-only.3)The MSB of the seconds byte is read-only.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time Clockster, 0 bits in the time and date registers can be written to 1, but can be modified when the clock updates. 0 bits should always be written to 0 except for alarm mask bits.flag that can be monitored. When the UIP bit is 1, the update transfer will soon occur. When UIP is 0, the update transfer does not occur for at least 244µs. The time, calendar, and alarm information in RAM is fully available for access when the UIP bit is 0. The UIP bit is read-only. Writing the SET bit in Register B to 1 inhibits any update transfer and clears the UIP status bit.used to turn the oscillator on or off and to reset the countdown chain. A pattern of 01X is the only combina-tion of bits that turns the oscillator on and allows the RTC to keep time. A pattern of 11X enables the oscillator but holds the countdown chain in reset. The next update occurs at 500ms after a pattern of 01X is written to DV0,DV1, and DV2. DV0 is used to select bank 0 or bank 1 as defined in Table 5. When DV0 is set to 0, bank 0 is selected. When DV0 is set to 1, bank 1 is selected.D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Real-Time Clocks written to 0 except for alarm mask bits.Control RegistersThe four control registers (A, B, C, and D) reside inboth bank 0 and bank 1. These registers are accessi-ble at all times, even during the update cycle.Register A (0Ah)Bits 3 to 0: Rate Selector Bits (RS3 to RS0). These four rate-selection bits select one of the 13 taps on the 15-stage divider or disable the divider output. The tap selected can be used to generate an output square wave (SQW pin) and/or a periodic interrupt. The user can do one of the following:1)Enable the interrupt with the PIE bit;2)Enable the SQW output pin with the SQWE or E32kbits;3)Enable both at the same time and the same rate; or4)Enable neither.Table4 lists the periodic interrupt rates and the square-wave frequencies that can be chosen with the RS bits.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksD S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887functions normally by advancing the counts once per second. When the SET bit is written to 1, any update transfer is inhibited, and the program can initialize the time and calendar bytes without an update occurring in the midst of initializing. Read cycles can be executed in a similar manner. SET is a read/write bit and is not affected by any internal functions of the DS17x85.Bit 6: Periodic Interrupt Enable (PIE).This bit is a read/write bit that allows the periodic interrupt flag (PF)bit in Register C to drive the IRQ pin low. When PIE is set to 1, periodic interrupts are generated by driving the IRQ pin low at a rate specified by the RS3–RS0 bits of Register A. A 0 in the PIE bit blocks the IRQ output from being driven by a periodic interrupt, but the PF bit is still set at the periodic rate. PIE is not modified by any internal DS17x85 functions.Bit 5: Alarm Interrupt Enable (AIE).This bit is a read/write bit that, when set to 1, permits the alarm flag (AF) bit in Register C to assert IRQ . An alarm interrupt occurs for each second that the three time bytes equal the three alarm bytes, including a don’t care alarm code of binary 11XXXXXX. When the AIE bit is set to 0,the AF bit does not initiate the IRQ signal. The internal functions of the DS17x285/87 do not affect the AIE bit.Bit 4: Update-Ended Interrupt Enable (UIE).This bit is a read/write bit that enables the update-end flag (UF)bit in Register C to assert IRQ . The SET bit going high clears the UIE bit.set to 1 and E32k = 0, a square-wave signal at the fre-quency set by RS3–RS0 is driven out on the SQW pin.When the SQWE bit is set to 0 and E32k = 0, the SQW pin is held low. SQWE is a read/write bit. SQWE is set to 1 when V CC is powered up.Bit 2: Data Mode (DM). This bit indicates whether time and calendar information is in binary or BCD format.The program sets the DM bit to the appropriate format and can be read as required. This bit is not modified by internal functions. A 1 in DM signifies binary data, while a 0 in DM specifies binary-coded decimal (BCD) data.Bit 1: 24/12 Control (24/12).This bit establishes the format of the hours byte. A 1 indicates the 24-hour mode and a 0 indicates the 12-hour mode. This bit is read/write and is not affected by internal functions.Bit 0: Daylight Saving Enable (DSE). This bit is a read/write bit that enables two daylight saving adjust-ments when DSE is set to 1. On the first Sunday in April, the time increments from 1:59:59AM to 3:00:00AM. On the last Sunday in October when the time first reaches 1:59:59AM, it changes to 1:00:00AM.When DSE is enabled, the internal logic tests for the first/last Sunday condition at midnight. If the DSE bit is not set when the test occurs, the daylight saving func-tion does not operate correctly. These adjustments do not occur when the DSE bit is zero. This bit is not affected by internal functions.Real-Time Clocks Register B (0Bh)1 when any of the following are true:PF = PIE = 1 WF = WIE = 1AF = AIE = 1 KF = KSE = 1UF = UIE = 1 RF = RIE = 1Any time the IRQF bit is 1, the IRQ pin is driven low.Flag bits PF, AF, and UF are cleared after reading Register C.Bit 6: Periodic Interrupt Flag (PF).This is a read-only bit that is set to 1 when an edge is detected on the selected tap of the divider chain. The RS3–RS0 bits establish the periodic rate. PF is set to 1 independentthe IRQ signal is active and sets the IRQF bit. Reading Register C clears this bit.Bit 5: Alarm Interrupt Flag (AF). A 1 in this bit indicates that the current time has matched the alarm time. If the AIE bit is also 1, the IRQ pin goes low and a 1 appears in the IRQF bit. Reading Register C clears this bit.Bit 4: Update-Ended Interrupt Flag (UF). This bit is set after each update cycle. When the UIE bit is set to 1, the 1 in UF causes the IRQF bit to be 1, which asserts IRQ . Reading Register C clears this bit.Bits 3 to 0: Unused. These unused bits always read 0and cannot be written.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887Real-Time ClocksRegister C (0Ch)Register D (0Dh)Register D (0Dh)Bit 7: Valid RAM and Time (VRT).This bit indicates the condition of the battery connected to the V BAT and V BAUX pin. If either supply is above the internal voltage threshold, VRT TRIP , the bit will be high. This bit is not writeable and should always be a 1 when read. If a 0 isever present, an exhausted internal lithium energy source is indicated and both the contents of the RTC data and RAM data are questionable.Bits 6 to 0: Unused. These bits cannot be written and,when read, always read 0.D S 17285/D S 17287/D S 17485/D S 17487/D S 17885/D S 17887Nonvolatile RAMThe user RAM bytes are not dedicated to any special function within the DS17x85. They can be used by the processor program as battery-backed memory and are fully available during the update cycle.The user RAM is divided into two separate memory banks. When the bank 0 is selected, the 14 real-time clock registers and 114 bytes of user RAM are accessi-ble. When bank 1 is selected, an additional 2kbytes,4kbytes, or 8kbytes of user RAM are accessible through the extended RAM address and data registers.InterruptsThe RTC includes six separate, fully automatic sources of interrupt for a processor:1)Alarm Interrupt 2)Periodic Interrupt3)Update-Ended Interrupt 4)Wake-Up Interrupt 5)Kickstart Interrupt 6)RAM Clear InterruptThe conditions that generate each of these indepen-dent interrupt conditions are described in detail in other sections of this data sheet. This section describes the overall control of the interrupts.The application software can select which interrupts, if any, are to be used. There are 6 bits, including 3 bits in Register B and 3 bits in Extended Register 4B, that enable the interrupts. The extended register locations are described later. Writing logic 1 to an interrupt-enable bit permits that interrupt to be initiated when the event occurs. A logic 0 in the interrupt-enable bit pro-hibits the IRQ pin from being asserted from that interrupt condition. If an interrupt flag is already set when an interrupt is enabled, IRQ is immediately set at an active level, although the event initiating the interrupt condition might have occurred much earlier. Therefore, there are cases where the software should clear these earlier generated interrupts before first enabling new interrupts.When an interrupt event occurs, the relating flag bit is set to logic 1 in Register C or in Extended Register 4A.These flag bits are set regardless of the setting of the corresponding enable bit located either in Register B or in Extended Register 4B. The flag bits can be used in a polling mode without enabling the corresponding enable bits.However, care should be taken when using the flag bits of Register C as they are automatically cleared to 0immediately after they are read. Double latching isimplemented on these bits so that set bits remain sta-ble throughout the read cycle. All bits that were set are cleared when read and new interrupts that are pending during the read cycle are held until after the cycle is completed. One, two, or three bits can be set when reading Register C. Each used flag bit should be exam-ined when read to ensure that no interrupts are lost.The flag bits in Extended Register 4A are not automati-cally cleared following a read. Instead, each flag bit can be cleared to 0 only by writing 0 to that bit.When using the flag bits with fully enabled interrupts,the IRQ line is driven low when an interrupt flag bit is set and its corresponding enable bit is also set. IRQ is held low as long as at least one of the six possible interrupt sources has its flag and enable bits both set.The IRQF bit in Register C is 1 whenever the IRQ pin is being driven low as a result of one of the six possible active sources. Therefore, determination that the DS17x85/DS17x87 initiated an interrupt is accom-plished by reading Register C and finding IRQF = 1.IRQF remains set until all enabled interrupt flag bits are cleared to 0.Oscillator Control BitsA pattern of 01X in bits 4 to 6 of Register A turns the oscillator on and enables the countdown chain. A pat-tern of 11X (DV2 = 1, DV1 = 1, DV0 = X) turns the oscil-lator on, but holds the countdown chain of the oscillator in reset. All other combinations of bits 4 to 6 keep the oscillator off.When the DS17x87 is shipped from the factory, the internal oscillator is turned off. This feature prevents the lithium energy cell from being used until it is installed in a system.Square-Wave Output SelectionThirteen of the 15 divider taps are made available to a 1-of-16 multiplexer, as shown in Figure 1. The square wave and periodic interrupt generators share the out-put of the multiplexer. The RS0–RS3 bits in Register A establish the output frequency of the multiplexer. These frequencies are listed in Table 4. Once the frequency is selected, the output of the SQW pin can be turned on and off under program control with the square-wave enable bit (SQWE).If E32K = 0, the square-wave output is determined by the RS3 to RS0 bits. If E32K = 1, a 32kHz square wave is output on the SQW pin, regardless of the RS3 to RS0bits’ state. If E32K = ABE = 1 and a valid voltage is applied to V BAUX , a 32kHz square wave is output on SQW when V CC is below V TP .Real-Time ClocksPeriodic Interrupt Selection The periodic interrupt causes the IRQ pin to go to an active state from once every 500ms to once every 122µs. This function is separate from the alarm inter-rupt, which can be output from once per second to once per day. The periodic interrupt rate is selected using the same Register A bits that select the square-wave frequency (see Table4). Changing the Register A bits affects both the square-wave frequency and the periodic interrupt output. However, each function has a separate enable bit in Register B. The SQWE and E32k bits control the square-wave output. Similarly, the peri-odic interrupt is enabled by the PIE bit in Register B. The periodic interrupt can be used with software coun-ters to measure inputs, create output intervals, or await the next needed software function.Update Cycle The DS17x85 executes an update cycle once per sec-ond regardless of the SET bit in Register B. When the SET bit in Register B is set to 1, the user copy of the double-buffered time, calendar, and alarm bytes is frozen and does not update as the time increments. However, the time countdown chain continues to update the internal copy of the buffer. This feature allows time to maintain accuracy independent of read-ing or writing the time, calendar, and alarm buffers, and also guarantees that time and calendar information is consistent. The update cycle also compares each alarm byte with the corresponding time byte and issues an alarm if a match or if a don’t care code is present inall alarm locations.There are three methods that can handle access of theRTC that avoid any possibility of accessing inconsistenttime and calendar data. The first method uses the update-ended interrupt. If enabled, an interrupt occursafter every update cycle that indicates that over 999msare available to read valid time and date information. Ifthis interrupt is used, the IRQF bit in Register C shouldbe cleared before leaving the interrupt routine.A second method uses the update-in-progress (UIP) bitin Register A to determine if the update cycle is in progress. The UIP bit pulses once per second. Afterthe UIP bit goes high, the update transfer occurs 244µs later. If a low is read on the UIP bit, the user has at least244µs before the time/calendar data is changed. Therefore, the user should avoid interrupt service rou-tines that would cause the time needed to read validtime/calendar data to exceed 244µs.The third method uses a periodic interrupt to determineif an update cycle is in progress. The UIP bit in RegisterA is set high between the setting of the PF bit in Register C (see Figure4). Periodic interrupts that occurat a rate of greater than t BUC allow valid time and date information to be reached at each occurrence of the periodic interrupt. The reads should be complete within1 (t PI/2+ t BUC) to ensure that data is not read during the update cycle.DS17285/DS17287/DS17485/DS17487/DS17885/DS17887 Real-Time ClocksFigure4. UIP and Periodic Interrupt Timing。

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