BAT254中文资料
IRFS254B中文资料
IRFS254B中⽂资料(Note 4)(Note 4, 5)(Note 4, 5) (Note 4)Notes:1. Repetitive Rating : Pulse width limited by maximum junction temperature2. L = 4.37mH, I AS = 16A, V DD = 50V, R G = 25 ?, Starting T J = 25°C3. I SD ≤ 25A, di/dt ≤ 300A/µs, V DD ≤ BV DSS, Starting T J = 25°C4. Pulse Test : Pulse width ≤300µs, Duty cycle ≤2%5. Essentially independent of operating temperatureBV DSS Drain-Source Breakdown Voltage V GS = 0 V, I D = 250 µA250----V ?BV DSS / ?T J Breakdown Voltage Temperature CoefficientI D = 250 µA, Referenced to 25°C --0.26--V/°C I DSS Zero Gate Voltage Drain Current V DS = 250 V, V GS = 0 V ----10µA V DS = 200 V, T C = 125°C ----100µA I GSSF Gate-Body Leakage Current, Forward V GS = 30 V, V DS = 0 V ----100nA I GSSRGate-Body Leakage Current, ReverseV GS = -30 V, V DS = 0 V-----100nAOn CharacteristicsV GS(th)Gate Threshold Voltage V DS = V GS , I D = 250 µA 2.0-- 4.0V R DS(on)Static Drain-Source On-ResistanceV GS = 10 V, I D = 8.0 A --0.10.14?g FSForward TransconductanceV DS = 40 V, I D = 8.0 A--19--SDynamic CharacteristicsC iss Input Capacitance V DS = 25 V, V GS = 0 V, f = 1.0 MHz--26003400pF C oss Output Capacitance--290380pF C rssReverse Transfer Capacitance--6080pFSwitching Characteristicst d(on)Turn-On Delay Time V DD = 125 V, I D = 25 A,R G = 25 ?--3580ns t r Turn-On Rise Time --195400ns t d(off)Turn-Off Delay Time --300610ns t f Turn-Off Fall Time --180370ns Q g Total Gate Charge V DS = 200 V, I D = 25 A,V GS = 10 V--95123nC Q gs Gate-Source Charge --12--nC Q gdGate-Drain Charge--43--nCDrain-Source Diode Characteristics and Maximum RatingsI S Maximum Continuous Drain-Source Diode Forward Current ----16A I SM Maximum Pulsed Drain-Source Diode Forward Current----64A V SD Drain-Source Diode Forward Voltage V GS = 0 V, I S = 16 A ---- 1.5V t rr Reverse Recovery Time V GS = 0 V, I S = 25 A,dI F / dt = 100 A/µs--300--ns Q rrReverse Recovery Charge-- 3.23--µCDISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBEDHEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonablyexpected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status DefinitionAdvance InformationFormative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.TRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.STAR*POWER is used under licenseACEx?Bottomless?CoolFET?CROSSVOLT ?DenseTrench?DOME?EcoSPARK?E 2CMOS?EnSigna?FACT?FACT Quiet Series?FAST ?FASTr?FRFET?GlobalOptoisolator?GTO?HiSeC?ISOPLANAR?LittleFET?MicroFET?MicroPak?MICROWIRE?OPTOLOGIC?OPTOPLANAR?PACMAN?POP?Power247?PowerTrench ?QFET?QS?QT Optoelectronics?Quiet Series?SLIENT SWITCHER ?SMART START?STAR*POWER?Stealth?SuperSOT?-3SuperSOT?-6SuperSOT?-8SyncFET?TruTranslation?TinyLogic?UHC?UltraFET ?VCX?。
BAT54HT1G_NL中文资料
BAT54HT1GSmall Signal DiodeAbsolute Maximum Ratings *T A= 25°C unless otherwise noted* These ratings are limiting values above which the serviceability of the diode may be impaired.NOTES:1)These ratings are based on a maximum junction temperature of 150 degrees C.2)These are steady limits. The factory should be consulted on applications involving pulsed or low duty cycle operations.Thermal CharacteristicsElectrical Characteristics T A=25°C unless otherwise notedSymbol ParameterValue Units V RRM Maximum Repetitive Reverse Voltage 30V I F(AV)Average Rectified Forward Current 200mA I FSM Non-repetitive Peak Forward Surge CurrentPulse Width = 1.0 second 600mA T STG Storage Temperature Range -65 to +150°C T JOperating Junction Temperature-55 to +150°CSymbol ParameterValue Units P D Power Dissipation200mW R θJAThermal Resistance, Junction to Ambient600°C/WSymbol ParameterTest Conditions Min.Max.Units V R Breakdown Voltage I R = 10µA 30V V FForward VoltageI F = 0.1mA I F = 1.0mA I F = 10mA I F = 30mA I F = 100mA 2403204005000.8mV mV mV mV V I R Reverse Leakage V R = 25V2.0µA C T Total Capacitance V R = 1V, f = 1.0MHz 10pF t rrReverse Recovery TimeI F = I R = 10mA, I RR = 1.0mA, R L = 100Ω5.0nsBAT54HT1GConnection Diagram2112A2SOD-323BAT54HT1GBAT54HT1GTRADEMARKSThe following are registered and unregistered trademarks Fairchild Semiconductor owns or is authorized to use and is not intended to be an exhaustive list of all such trademarks.DISCLAIMERFAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN;NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS.LIFE SUPPORT POLICYFAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION.As used herein:1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body,or (b) support or sustain life, or (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in significant injury to the user.2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.PRODUCT STATUS DEFINITIONS Definition of TermsDatasheet Identification Product Status DefinitionAdvance InformationFormative or In Design This datasheet contains the design specifications for product development. Specifications may change in any manner without notice.PreliminaryFirst ProductionThis datasheet contains preliminary data, andsupplementary data will be published at a later date.Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.No Identification Needed Full ProductionThis datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice in order to improve design.Obsolete Not In ProductionThis datasheet contains specifications on a product that has been discontinued by Fairchild semiconductor.The datasheet is printed for reference information only.FAST ®FASTr™FPS™FRFET™GlobalOptoisolator™GTO™HiSeC™I 2C™i-Lo ™ImpliedDisconnect™ISOPLANAR™LittleFET™MICROCOUPLER™MicroFET™MicroPak™MICROWIRE™MSX™MSXPro™OCX™OCXPro™OPTOLOGIC ®OPTOPLANAR™PACMAN™POP™Power247™PowerSaver™PowerTrench ®QFET ®QS™QT Optoelectronics™Quiet Series™RapidConfigure™RapidConnect™µSerDes™SILENT SWITCHER ®SMART START™SPM™Stealth™SuperFET™SuperSOT™-3SuperSOT™-6SuperSOT™-8SyncFET™TinyLogic ®TINYOPTO™TruTranslation™UHC™UltraFET ®VCX™A CEx™ActiveArray™Bottomless™CoolFET™CROSSVOLT ™DOME™EcoSPARK™E 2CMOS™EnSigna™FACT™FACT Quiet Series™Across the board. Around the world.™The Power Franchise ®Programmable Active Droop™。
IRFP254B中文资料
8000 6000
Ciss = Cgs + Cgd (Cds = shorted) C =C +C
oss ds gd
Crss = Cgd
4000 2000
C iss
C oss
C rss
※ Notes : 1. VGS = 0 V 2. f = 1 MHz
0
10-1
100
101
V , Drain-Source Voltage [V] DS
102
101
100 0.2
150℃ 25℃
※ Notes :
1. 2.
2V5G0Sμ=s0VPulse
Test
0.4
0.6
0.8
1.0
1.2
1.4
1.6
1.8
VSD, Source-Drain voltage [V]
Figure 4. Body Diode Forward Voltage Variation with Source Current and Temperature
-- 35
80
ns
-- 195 400
ns
-- 300 610
ns
(Note 4, 5)
--
180
370
ns
VDS = 200 V, ID = 25 A,
--
95
123
nC
VGS = 10 V
-- 12
--
nC
(Note 4, 5) --
43
--
nC
Drain-Source Diode Characteristics and Maximum Ratings
--
SW-254中文资料
Matched GaAs SP4T Switch 5 - 2000 MHzSW-254M/A-COM, Inc.1Specifications Subject to Change Without Notice.V2.00FeaturesLow Insertion Loss, 1.0 dB Typical Fast Switching Speed, 20 ns TypicalUltra Low DC Power Consumption, 0.3 mA Typical Integral TTL DriverGuaranteed Specifications * (From -55°C to +85°C)Frequency Range 5-2000 MHz Insertion Loss5-2000 MHz 2.1 dB Max 5-1000 MHz 1.6 dB Max 5-500 MHz 1.4 dB Max VSWR5-2000 MHz 2.3:1 Max 5-1000 MHz 1.8:1 Max 5-500 MHz 1.4:1 Max Isolation5-2000 MHz 35 dB Min 5-1000 MHz 36 dB Min 5-500 MHz42 dB MinOperating CharacteristicsImpedance50 Ohms NominalSwitching CharacteristicsTrise, Tfall7 ns Ton, Toff (50% CTL to 90/10% RF)20 ns Transients (In-Band)80 mV Input Power for 1 dB Compression500-2000 MHz +27 dBm Typ 50 MHz+21 dBm TypIntermodulation Intercept Point(for two-tone input power up to +13 dBm)Intercept Points IP 2IP 3500-2000 MHz +68+46dBm Typ 50 MHz +60+40dBm Typ Bias Power +5 VDC @ 0.30 mA Typ, 1 mA Max EnvironmentalMIL-STD-883 screening available.* All specifications apply when operated with bias voltage of +5 VDC and 50 ohm impedance at all RF ports.q q q qTruth TableControl Input Condition of Switch “1” = Logic High RF Common To Each RF Port TTLCTL1CTL2CTL3CTL4RF1RF2RF3RF41000ON OFF OFF OFF 0100OFF ON OFF OFF 0010OFF OFF ON OFF 0001OFFOFFOFFONDI-5RF 4GNDGNDRF COMMONGND GND GNDRF 1RF 3CTL 4CTL 3CTL 2CTL 1+VDC NC RF 2Ordering InformationModel No.Package SW-254 PINDual InlineDimensions in ( ) are in mm.Unless Otherwise Noted: .xxx = ±0.010 (.xx = ±0.25).xx = ±0.02 (.x = ±0.5)WEIGHT (APPROX.): 0.26 OUNCES 73 GRAMS元器件交易网Matched GaAs SP4T Switch SW-254V2.00M/A-COM, Inc.2Specifications Subject to Change Without Notice.0.0050.5 1.0 1.52.0+85°C-55°C+25°CFREQUENCY GHZ元器件交易网。
BAT54中文资料
Document Number Small Signal Schottky Diodes, Single & DualFeatures•These diodes feature very low turn-on voltage and fast switching.•These devices are protected by a PN junction guard ring against excessive voltage, such as electrostatic discharges.Mechanical DataCase: SOT-23 Plastic case Weight: approx. 8.8 mgPackaging Codes/Options:GS18 / 10 k per 13" reel (8 mm tape), 10 k/box GS08 / 3 k per 7" reel (8 mm tape), 15 k/boxParts TableAbsolute Maximum RatingsT amb = 25°C, unless otherwise specified1) Device on fiberglass substrate, see layout on next page.PartOrdering codeMarkingRemarksBAT54BAT54-GS18 or BAT54-GS08L4Tape and Reel BAT54A BAT54A-GS18 or BAT54A-GS08L42Tape and Reel BAT54C BAT54C-GS18 or BAT54C-GS08L43Tape and Reel BAT54SBAT54S-GS18 or BAT54S-GS08L44Tape and ReelParameterT est condition Symbol Value Unit Repetitive peak reverse voltage V RRM 30V Forward continuous current I F 2001)mA Repetitive peak forward current I FRM3001)mA Surge forward current current t p < 1 s I FSM 6001)mA Power dissipationP tot230mW Document Number 85508Thermal CharacteristicsT amb = 25°C, unless otherwise specified1) Device on fiberglass substrate, see layout on next page.Electrical CharacteristicsT amb = 25°C, unless otherwise specifiedLayout for R thJA testThickness:Fiberglass 1.5 mm (0.059 in.)Copper leads 0.3 mm (0.012 in.)ParameterTest condition Symbol Value Unit Thermal resistance junction to ambiant airR thJA 4301)°C/W Junction temperature T j = T stg- 65 to + 150°C Storage temperature rangeT S- 65 to + 150°CParameterTest conditionSymbol Min Typ.MaxUnit Reverse Breakdown voltage I R = 100 µA pulsesV (BR)30V Leakage current Pulse test t p < 300 µs, δ < 2 % at V R = 25 VI R 2µA Forward voltageI F = 0.1 mA, t p < 300 µs, δ < 2 %V F 240mV I F = 1 mA, t p < 300 µs, δ < 2 %V F 320mV I F = 10 mA, t p < 300 µs, δ < 2 %V F 400mV I F = 30 mA, t p < 300 µs, δ < 2 %V F 500mV I F = 100 mA, t p < 300 µs, δ < 2 %V F 1000mV Diode capacitance V R = 1 V , f = 1 MHzC tot 10pF Reverse recovery timeI F = 10 mA through I R = 10 mA to I rr = 1mA, R L = 100 Ωt rr5nsDocument Number Typical Characteristics (Tamb = 25 °C unless otherwise specified)Figure 1. Typical Forward Voltage Forward Current at VariousTemperaturesFigure 2. Typical Capacitance °C vs. Reverse Applied Voltage V RFigure 3. Typical Variation of Reverse Current at VariousTemperatures0.0110001001010.1V F in VI F i n mA180250048121012148642V R in VC i n p F1620242818026Package Dimensions in mm (Inches) Document Number 85508Ozone Depleting Substances Policy StatementIt is the policy of Vishay Semiconductor GmbH to1.Meet all present and future national and international statutory requirements.2.Regularly and continuously improve the performance of our products, processes, distribution andoperatingsystems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment.It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs).The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances.Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents.1.Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendmentsrespectively2.Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the EnvironmentalProtection Agency (EPA) in the USA3.Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances.We reserve the right to make changes to improve technical designand may do so without further notice.Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use Vishay Semiconductors products for any unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use.Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, GermanyTelephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423Document Number 。
BR254中文资料
VOLTAGE RANGE 50 to 1000 Volts CURRENT 25 AmperesFEATURES*Superior thermal desing *300 amperes surge rating*1/4//universal faston terminal * Hole thru for # 8 screw* UL listed the recognized component directory, file #E94233* Epoxy: Device has UL flammability classification 94V-OMAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICSRatings at 25 o C ambient temperature unless otherwise specified.Single phase, half wave, 60 Hz, resistive or inductive load.For capacitive load, derate current by 20%.MAXIMUM RATINGS (At T A = 25o C unless otherwise noted)ELECTRICAL CHARACTERISTICS (At T A = 25o C unless otherwise noted)NOTE: Suffix ”W” for wire typeBR-25BR-25W2001-5RATINGSMaximum Recurrent Peak Reverse Voltage Maximum RMS Bridge Input Voltage Maximum DC Blocking VoltagePeak Forward Surge Current 8.3 ms single half sine-wave superimposed on rated load (JEDEC method)Operating and Storage Temperature RangeSYMBOL V RRM V DC I O I FSMT J,T STGV RMS Volts Volts Amps 25.0300-55 to + 175CUNITS Maximum Average Forward Rectified Output Current at Tc = 55o C 5020040010060080010003514028070420560700502004001006008001000Volts AmpsBR2505BR152BR254BR251BR256BR258BR2510DC Blocking Voltage per element CHARACTERISTICSV F SYMBOL I RUNITS1.10.5mAmps uAmps Maximum Reverse Current at Rated Maximum Forward Voltage Drop per element at 12.5A DC Volts @T A = 25oC @T C = 100o C10BR2505BR252BR254BR251BR256BR258BR2510MECHANICAL DATARATING AND CHARACTERISTIC CURVES ( BR2505 THRU BR2510 )PERCENT OF RATED PEAK REVERSE VOLTAGE, ( % )I N S T A N T A N E O U S R E V E R S E C U R R E N T , (u A )FIG. 4 - TYPICAL REVERSE CHARACTERISTICS101.0.1.01020406080100120140FIG. 1 - MAXIMUM NON-REPETITIVE FORWARDP E A K F O R W A R D S U R G E C U R R E N T , (A )NUMBER OF CYCLES AT 60HzSURGE CURRENT5004003002001001246810204060801008.3ms Single Half Sine-Wave (JEDEC Method)FIG. 3- TYPICAL INSTANTANEOUS FORWARD I N S T A N T A N E O U S F O R W A R D C U R R E N T , (A )INSTANTANEOUS FORWARD VOLTAGE, (V)100101.0.1.01.8.6.7.9 1.0 1.1 1.2 1.3CHARACTERISTICSFIG. 2 - TYPICAL FORWARD CURRENTA V E R A G E F O R W A R D C U R R E N T , (A )DERATING CURVECASE TEMPERATURE, ( )252015105050100150Single Phase Half Wave 60Hz Indutive or Resistive Load175BR-25BR-25W。
BAT54;BAT54_D87Z;BAT54A;BAT54C;BAT54S;中文规格书,Datasheet资料
intended to be an exhaustive list of all such trademarks.
2Cool¥ AccuPower¥ AX-CAP¥* BitSiC¥ Build it Now¥ CorePLUS¥ CorePOWER¥ CROSSVOLT¥ CTL¥ Current Transfer Logic¥ DEUXPEED® Dual Cool™ EcoSPARK® EfficientMax¥ ESBC¥
®*
The Power Franchise®
TinyBoost¥ TinyBuck¥ TinyCalc¥ TinyLogic® TINYOPTO¥ TinyPower¥ TinyPWM¥ TinyWire¥ TranSiC¥ TriFault Detect¥ TRUECURRENT®* PSerDes¥
2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness.
UHC® Ultra FRFET¥ UniFET¥ VCX¥ VisualMax¥ VoltagePlus¥ XS™
FPS¥ ®
* Trademarks of System General Corporation, used under license by Fairchild Semiconductor.
DO-254是什么
DO-254,福兮?祸兮?一、DO-254是什么?DO-254标准为用在航空或者发动机的机载系统和设备的复杂电子硬件设计提供了质量保证导则。
于2005年获得FAA(联邦航空管理局)的正式认可,要求DO-254组织授权的航空组件生产公司必须遵循DO-254的流程设计其产品。
遵循流程无可争辩地会提高费用,因此按照DO-254流程进行产品开发就需要更多时间并增加工作的复杂度。
正因为如此,遵循DO-254项目比起不按照DO-254流程开发的项目会多出25-150%的费用。
所以对于服务于航空市场的硬件服务商,不仅仅要努力达到DO-254所要求的设计质量保证,同时需要增加由于遵循规范而产生的费用。
令人欣慰的是我们有各种方式可以减少这方面的费用,而且公司还可以从遵循规范获得成本效益以及显著的商业利益。
二、DO-254会影响到谁?DO-254标准主要针对飞行系统组件中的PLD、FPGA和ASIC设计。
因此一些针对飞行系统设计电子产品的公司,在他们的PLD、FPGA和ASIC设计流程中必须遵循DO-254规范。
与此同时,该标准在军事、防御与空间领域也正在被强制执行。
而其它相关的危及人身安全的行业(如:医疗,交通,核能等)也正在寻求和DO-254相近的标准。
三、DO-254从哪里来?RTCA DO-254/EUROCAE ED-80,亦即“航空电子硬件设计保证导则”这一标准关注的焦点是确保飞行安全的硬件设备的可靠性。
也就是说,FAA、EASA(欧洲航空安全部)和其它航空局由于希望确保应用在民航系统中的复杂电子硬件会如期望的那样可靠工作,从而避免错误操作和潜在的航空灾难,于是通过DO-254定义了硬件设备供应商提供的应用在航空系统中的硬件必须达到的认证目标。
直到几年前,航空硬件一直被认为是“简单的”或者“可通过系统级测试进行验证的”。
因此,硬件的认证相对容易。
这个结果导致很多功能从软件转移成硬件方式实现,达到避免认证的目的。
BAT54A中文资料
CJ
-
7.6
10
trr
-
-
5.0
Unit Volts Vdc
uAdc pF nS
REV. : 0
Zowie Technology Corporation
Zowie Technology Corporation
BAT54
820
+10 V
2k 100uH IF 0.1uF
FIGURE 1. RECOVERY TIME EQUIVALENT TEST CIRCUIT
Rating Reverse Voltage Forward Power Dissipation @ TA=25oC Derate above 25oC Operating Junction Temperature Range Storage Temperature Range
Symbol VR
PF
2. Input pulse is adjusted so IR(peak) is equal to 10mA. 3. tp » trr
iR(REC) = 1mA
OUTPUT PULSE (IF = I R = 10 mA; measured
at iR(REC) = 1mA
FIGURE 2. FORWARD VOLTAGE
-
0.22
0.24
-
0.29
0.32
VF
-
0.35
0.40
-
0.41
0.50
-
0.52
1.0
Reverse Leakage ( VR=25 Vdc )
IR
-
0.5
2.0
Diode Capacitance ( VR=1.0, f=1.0MHZ )
BAT54W,115;BAT54CW,115;BAT54SW,115;BAT54AW,115;中文规格书,Datasheet资料
DATA SHEETProduct specificationSupersedes data of October 19931996Mar 19BAT54W seriesSchottky barrier (double) diodesook, halfpageM3D088Schottky barrier (double) diodes BAT54W seriesFEATURES•Low forward voltage•Guard ring protected•Very small SMD package.APPLICATIONS•Ultra high-speed switching •Voltage clamping•Protection circuits•Blocking diodes.DESCRIPTIONPlanar Schottky barrier diodes encapsulated in a SOT323 very small plastic SMD package. Single diodes and double diodes with different pinning are available.PINNINGPINBAT54W AW CW SW1a k1a1a12n.c.k2a2k23k a1,a2k1,k2k1,a 2Fig.1Simplified outline(SOT323) and pinconfiguration.handbook, 2 columns312MBC870Top viewFig.2BAT54W single diodeconfiguration (symbol).312n.c.MLC357Fig.3BAT54AW diodeconfiguration (symbol).312MLC360Fig.4BAT54CW diodeconfiguration (symbol).312MLC359Fig.5BAT54SW diodeconfiguration (symbol).312MLC358MARKINGTYPE NUMBER MARKING CODEBAT54W L4 BAT54AW42 BAT54CW43 BAT54SW44Schottky barrier (double) diodesBAT54W seriesLIMITING VALUESIn accordance with the Absolute Maximum Rating System (IEC 134).ELECTRICAL CHARACTERISTICS T amb =25°C unless otherwise specified.Note1.Pulsed test: t p =300µs;δ=0.02.THERMAL CHARACTERISTICS Note1.Refer to SOT323 standard mounting conditions.SYMBOL PARAMETERCONDITIONSMIN.MAX.UNITPer diode V R continuous reverse voltage −30V I F continuous forward current −200mA I FRM repetitive peak forward current t p ≤1s;δ≤0.5−300mA I FSM non-repetitive peak forward current t p <10ms −600mA P tot total power dissipation (per package)T amb ≤25°C−200mW T stg storage temperature −65+150°C T j junction temperature−125°C T amboperating ambient temperature−65+125°CSYMBOL PARAMETERCONDITIONSMAX.UNITPer diode V Fforward voltagesee Fig.6I F =0.1mA 240mV I F =1mA 320mV I F =10mA 400mV I F =30mA 500mV I F =100mA800mV I R reverse current V R =25V; note 1; see Fig.72µA t rrreverse recovery timewhen switched from I F =10mA to I R =10mA; R L =100Ω; measured at I R =1mA: see Fig.95nsC d diode capacitance f =1MHz; V R =1V; see Fig.810pFSYMBOL PARAMETERCONDITIONSVALUE UNIT R th j-a thermal resistance from junction to ambientnote 1625K/WSchottky barrier (double) diodesBAT54W seriesGRAPHICAL DATAhandbook, halfpage10I F V F (V)310(mA)21011011.20.80.40MSA892(3)(2)(1)(3)(2)(1)(1)T amb =125°C.(2)T amb =85°C.(3)T amb =25°C.Fig.6Forward current as a function of forward voltage; typical values.0102030V (V)R103I R(µA)102101101(1)(2)(3)MSA893(1)T amb =125°C.(2)T amb =85°C.(3)T amb =25°C.Fig.7Reverse current as a function of reverse voltage; typical values.010203051015V (V)RC d (pF)MSA891Fig.8Diode capacitance as a function of reversevoltage; typical values.f =1MHz; T amb =25°C.Fig.9 Reverse recovery definitions.handbook, halfpage 90%10%t fQ dI dttIFI RMRC129 - 1F rSchottky barrier (double) diodesBAT54W seriesPACKAGE OUTLINEDEFINITIONS LIFE SUPPORT APPLICATIONSThese products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.Data sheet status Objective specification This data sheet contains target or goal specifications for product development.Preliminary specification This data sheet contains preliminary data; supplementary data may be published later.Product specification This data sheet contains final product specifications.Limiting valuesLimiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.Application informationWhere application information is given, it is advisory and does not form part of the specification.handbook, full pagewidth0.250.10B0.20.2AAM M 1230.651.32.21.80.400.30B1.351.152.22.0detail XX1.1max0.10.01.00.80.30.10.2MBC871Dimensions in mm.Fig.10 SOT323.分销商库存信息:NXPBAT54W,115BAT54CW,115BAT54SW,115 BAT54AW,115。
BAT54C-V-GS08;中文规格书,Datasheet资料
BAT54-V-G, BAT54A-V-G, BAT54C-V-G, BAT54S-V-GDocument Number 83344Rev. 1.0, 28-Jun-10Vishay Semiconductors1For technical questions within your region, please contact one of the following:DiodesAmericas@ , DiodesAsia@ , DiodesEurope@Small Signal Schottky Diodes, Single and DualFeatures•These diodes feature very low turn-on voltage and fast switching •These devices are protected by a PN junction guard ring against excessive voltage, such as electrostatic discharges•AEC-Q101 qualified•Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/ECMechanical DataCase: SOT-23Weight: approx. 8.1 mg Packaging codes/options:18/10K per 13" reel (8 mm tape), 10K/box 08/3K per 7" reel (8 mm tape), 15K/boxParts TableAbsolute Maximum RatingsT amb = 25°C, unless otherwise specifiedNote 1)Device on fiberglass substrate, see layout on next page.Thermal CharacteristicsT amb = 25°C, unless otherwise specifiedNote1) Device on fiberglass substrate, see layout on next page.** Please see document “V ishay Material Category Policy”: /doc?99902PartOrdering codeT ype markingRemarks BAT54-V -G BA T54-V -G-18 or BAT54-V -G-08L8Tape and reel BAT54A-V -G BAT54A-V -G-18 or BAT54A-V -G-08L46Tape and reel BAT54C-V -G BAT54C-V -G-18 or BAT54C-V -G-08L47Tape and reel BAT54S-V -GBAT54S-V -G-18 or BAT54S-V -G-08L48Tape and reelParameterT est conditionSymbol V alue Unit Repetitive peak reverse voltage V RRM 30V Forward continuous current I F 200 1)mA Repetitive peak forward current I FRM 300 1)mA Surge forward current current t p < 1 s I FSM 600 1)mA Power dissipationP tot230mWParameterTest conditionSymbol V alue Unit Thermal resistance junction to ambient air R thJA 430 1)K/W Junction temperature T j 125°C Storage temperature rangeT stg- 65 to + 150°C 2Document Number 83344Rev. 1.0, 28-Jun-10BAT54-V-G, BAT54A-V-G, BAT54C-V-G, BAT54S-V-GVishay Semiconductors For technical questions within your region, please contact one of the following:DiodesAmericas@ , DiodesAsia@ , DiodesEurope@ Electrical CharacteristicsT amb = 25°C, unless otherwise specifiedLayout for R thJA testThickness:Fiberglass 1.5 mm (0.059 in.)Copper leads 0.3 mm (0.012 in.)Typical CharacteristicsT amb = 25°C, unless otherwise specifiedParameterTest condition Symbol Min.Typ.Max.Unit Reverse Breakdown voltage I R = 100 µA (pulsed)V (BR)30V Leakage currentPulse test t p < 300 µs, δ < 2 % atV R = 25 V I R 2µA Forward voltageI F = 0.1 mA, t p < 300 µs, δ < 2 %V F 240m V I F = 1 mA, t p < 300 µs, δ < 2 %V F 320m V I F = 10 mA, t p < 300 µs, δ < 2 %V F 400m V I F = 30 mA, t p < 300 µs, δ < 2 %V F 500m V I F = 100 mA, t p < 300 µs, δ < 2 %V F 800m V Diode capacitance V R = 1 V , f = 1 MHz C D 10pF Reverse recovery timeI F = 10 mA to I R = 10 mA,i R = 1 mA, R L = 100 Ωt rr5nsFigure 1. Typical Forward V oltage Forward Current vs.V arious TemperaturesFigure 2. Diode Capacitance vs. Reverse V oltage V RBAT54-V-G, BAT54A-V-G, BAT54C-V-G, BAT54S-V-GDocument Number 83344Rev. 1.0, 28-Jun-10Vishay Semiconductors3For technical questions within your region, please contact one of the following:DiodesAmericas@ , DiodesAsia@ , DiodesEurope@Package Dimensions in millimeters (inches): SOT-23Figure 3. Typical V ariation of Reverse Currentvs. V arious TemperaturesLegal Disclaimer Notice VishayDisclaimerALL PRODU CT, PRODU CT SPECIFICATIONS AND DATA ARE SU BJECT TO CHANGE WITHOU T NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product.Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special, consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability.Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All operating parameters, including typical parameters, must be validated for each customer application by the customer’s technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein.Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners.Material Category PolicyVishay Intertechnology, Inc. hereb y certifies that all its products that are identified as RoHS-Compliant fulfill the definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment (EEE) - recast, unless otherwise specified as non-compliant.Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.Revision: 12-Mar-121Document Number: 91000分销商库存信息:VISHAY-GENERAL-SEMICONDUCTOR BAT54C-V-GS08。
BAT54SWT1G;BAT54SWT1;中文规格书,Datasheet资料
November, 2011 − Rev. 10
1
Publication Order Number: BAT54SWT1/D
/
BAT54SWT1G, NSVBAT54SWT1G
TA = 85C
TA = 25C 0 5 15 25 10 20 VR, REVERSE VOLTAGE (VOLTS) 30
Figure 3. Leakage Current
14 CT, TOATAL CAPACITANCE (pF) 12 10 8 6 4 2 0 0 5 10 15 20 25 30
Figure 1. Recovery Time Equivalent Test Circuit
2
/
BAT54SWT1G, NSVBAT54SWT1G
100 1 25C IF, FORWARD CURRENT (mA) 85C 10 1 50C 1.0 25C 0.1 0.0 − 40C
ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
BAT54WS-7-F;BAT54WS-7;中文规格书,Datasheet资料
BAT54WS
http://onDeocicum.ceonmt n/umber: DS30098 Rev. 11 - 2
Symbol PD RθJA
TJ, TSTG
Value
30
21 100 200 300 600
Value 200 625
-65 to +150
Unit
V
V mA mA mA mA
Unit mW °C/W °C
Electrical Characteristics @TA = 25°C unless otherwise specified
TA, AMBIENT TEMPERATURE (°C) Fig. 5 Power Derating Curve
BAT54WS
http://onDeocicum.ceonmt n/umber: DS30098 Rev. 11 - 2
2 of 3
August 2008
© Diodes Incorporated
2.30 2.70
H
1.60 1.80
J
0.00 0.10
J
K
1.0 1.1
L
0.20 0.40
M 0.10 0.15
α
0°
8°
All Dimensions in mm
Suggested Pad Layout
C
X
Y
G
Z
Dimensions Z G X Y C
BAT54WT-TP;BAT54SWT-TP;BAT54AWT-TP;BAT54CWT-TP;中文规格书,Datasheet资料
BAT54WT thruBAT54SWT200mWatt, 30Volt Schottky Barrier DiodeFeatures• Low Forward Voltage• Surface Mount SOT-323 Package• Capable of 200mWatts of Power DissipationPart Number Device Marking Type PinConfigurationBAT54WT KL5Single Figure 1BAT54AWT KL6Dual Figure 2BAT54CWT KL7Dual Figure 3BAT54SWTKL8DualFigure 4Maximum RatingsContinuous Reverse Voltage V R 30VRepetitive Peak Forward Current I FRM 300mA Non-Repetitive Peak Forward Current t<1s I FSM600mA Total Power Dissipation @ T A = 25°CP D 200mW Storage Temperature Range T stg -55°C to 125°C Electrical Characteristics @ 25°C Unless Otherwise SpecifiedRatingsSymbolMax.NotesForward Voltage at I F = 0.1mA I F = 1mA I F = 10mA I F = 30mA I F = 100mA V F240mV 320mV 400mV 500mV 1000mV Reverse Current I R 2uA V R = 25VReverse Breakdown VoltageV (BR)>30VCapacitanceC J 10pFMeasured at1.0MHz, V R =1.0V Reverse Recovery Timet rr 5nSI F =I R =10mA;I (REC) = 1mAThermal Resistance,Junction to AmbientR θJA 500K/WForward Current I F 200mA Junction Temperature T jomp onents 20736 Marilla Street Chatsworth! "# $ % ! "#www.mccsemi .comRevision:A 2011/01/01TMMicro Commercial Components1 of 3-55°C to 125°C• Epoxy meets UL 94 V-0 flammability rating • Moisture Sensitivity Level 1• Lead Free Finish/Rohs Compliant ("P"Suffix designatesRoHS Compliant. See ordering information)/Figure 1Figure 3Figure 4Figure 2Pin Configuration - Top Viewwww.mccsemi .comRevision: A 2011/01/01BAT54WT thru BAT54SWTMicro Commercial Components050100150200250255075100125150P , P O W E R D I S S I P A T I O N (m W)d T , AMBIENT TEMPERATURE (°C)A Fi g. 4 Power Derating Curve3002410861210155203025C , T O T A L C A P A C I T A N C E (p F )T V , REVERSE VOLTAGE (V)R Fig. 3 Typical Capacitance vs. Reverse Voltage0.0010.010.110110051015202530V , INSTANTANEOUS REVERSE VOLTAGE (V)R Fig. 2 Typical Reverse Characteristics0.10.0110.0010.00011.00.40.60.80.2I , I N S T A N T A N E O U S F O R W A R D C U R R E N T (A )F V , INSTANTANEOUS FORWARD VOLTAGE (V)F Fig. 1 Forward Characteristics2 of 3/Revision: A 2011/01/01Micro Commercial Componentswww.mccsemi .com3 of 3DevicePackingPart Number-TP Tape&Reel: 3Kpcs/ReelOrdering Information :***IMPORTANT NOTICE***Micro Commercial Components Corp. reserve s the right to make changes without further notice to any product herein to make corrections, modifications , enhancements , improvements , or other changes . Micro Commercial Components Corp . does not assume any liability arising out of the application or use of any product described herein; neither does it convey any license under its patent rights ,nor the rights of others . The user of products in such applications shall assume all risks of such use and will agree to hold Micro Commercial Components Corp . and all the companies whose products are represented on our website, harmless against all damages.***LIFE SUPPORT***MCC's products are not authorized for use as critical components in life support devices or systems without the express writtenapproval of Micro Commercial Components Corporation.***CUSTOMER AWARENESS***Counterfeiting of semiconductor parts is a growing problem in the industry. Micro Commercial Components (MCC) is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. MCC strongly encourages customers to purchase MCC parts either directly from MCC or from Authorized MCC Distributors who are listed by country on our web page cited below . Products customers buy either from MCC directly or from Authorized MCC Distributors are genuine parts, have full traceability, meet MCC's quality standards for handling and storage. MCC will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. MCC is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors.分销商库存信息:MICRO-COMMERICAL-COBAT54WT-TP BAT54SWT-TP BAT54AWT-TP BAT54CWT-TP。
BAT54C中文资料_数据手册_参数
Typ.
Max. Unit
1 µA
100
240
320
400 mV
500
900
Symbol
Table 5. Dynamic characteristics
Parameter
Test conditions
C Diode capacitance
current (typical values)
C(pF) 10
F=1MHz
VOSC=30mVRMS Tj=25°C
1.E+00 IFM(A) 1.E-01
Tj=100°C
1.E-02 1.E-03
Tj=50°C Tj=25°C Tj=-40 °C
VR(V) 1
1.E-04
VFM(V)
1
10
100
0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3
1
Characteristics
BAT54
Table 2. Absolute ratings (limiting values at Tj = 25 °C, unless otherwise specified)
Symbol
Parameter
Value
Unit
VRRM IF
IFSM Tstg Tj TL
0.148
Figure 12. SOD123 footprint dimensions in mm (inches)
6/15
德国艾德克斯气体压力调节器RS 254 RS 255产品手册说明书
Accuracy class
PS
Upper response pressure
pu
group
Qn
Lower response pressure
group
RE
High-pressure screw spindle BV
value
RSD
Outlet pressure
SSV
SRV closing pressure
RS 254 / RS 255 Integral pressure-tight (IS) 16 bar RS 254: DN 25, DN 50, DN 80, DN 100, DN 150, DN 200 RS 255: DN 50, DN 80, DN 100 DIN EN 1092 - PN 16 flanges / ASME - B16.5 flanges Class 150 RF
Maximum allowable pressure Inlet pressure Standard volumetric flow rate Control unit Breather valve Throttle valve Safety shut-off valve Safety relief valve Closing pressure group Gas inlet temperature Valve seat Outlet gas velocity Inlet gas velocity Upper adjustment range (SSV) Lower adjustment range
response pressure and
normal operating pressure
DO-254标准编译稿
RTCA/DO254标准机载电子设备硬件的设计保证指南二00八年四月目录前言本文件由航空无线电委员会(RTCA)180专委会(SC-180)制订,并于2000年4月19日由RTCA项目管理委员会批准通过。
本指南是RTCA SC-180和EUROCAE(欧洲民用航空设备组织)WG-46在协商一致的基础上共同编写完成的。
RTCA公司是一家非营利性的组织,其宗旨是推进航空和航空电子系统科学与技术的发展,为公众的福祉服务。
本组织起到了联邦顾问委员会的作用,并就当前航空方面的议题提出一致通过的建议。
RTCA的目标包括但并不仅限于:●结合航空系统用户和供应商的技术要求,帮助政府和企业实现和履行彼此的目标及职责;●对航空业界在追求更高安全、系统性能和效能时所面临的系统技术问题进行分析,并提供解决方案;●推进相关技术应用的通过,以满足用户和供应商的要求,包括支持飞行的电子系统和设备的最低工作性能标准的制定;●帮助制定相关技术资料,以此确定国际民航组织、国际电信联盟以及其它感兴趣的国际组织的地位。
本组织的建议通常被政府和民间组织作为决策的依据,并且还是众多联邦航空管理技术标准规程的基础。
由于RTCA并不是美国政府的官方代理机构,本组织的建议未经美国政府或在这些建议所涉及到的任何问题上拥有法定权限的组织公布,不能被认定为官方政策。
执行概要航空业界中复杂电子设备的使用和研发引起了新的安全和验证问题。
为解决此问题,成立了RTCA SC-180和EUROCAE WG-46。
RTCA SC-180和EUROCAE WG-46早在制订本文件时就已同意并组成了联合委员会。
该联合委员会经特许为机载电子设备制定清晰和一致的设计保证指南,从而使机载电子设备可安全地发挥其既定功能。
机载电子设备包括线可替代单元、电路板组件、专用集成电路、可编程逻辑器件等。
本指南适用于现有的、新的以及刚出现的技术。
前言本文件由航空无线电委员会(RTCA)180专委会(SC-180)制订,并于2000年4月19日由RTCA项目管理委员会批准通过。
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MSA893
IF (mA) 10
2
(1) (2) (3)
10
10
1
(1)
(2)
(3)
1
(3)
10 1
10 1
0 0.4 0.8 VF (V) 1.2
0
10
20
VR (V)
30
(1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C.
(1) Tamb = 125 °C. (2) Tamb = 85 °C. (3) Tamb = 25 °C.
BAT254
UNIT mV mV mV mV mV µA ns
Cd Note
diode capacitance
10
pF
1. Pulse test: tp = 300 µs; δ = 0.02. THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Refer to SOD110 standard mounting conditions. PARAMETER thermal resistance from junction to ambient note 1 CONDITIONS VALUE 315 UNIT K/W
2002 May 28
3
Philips Semiconductors
Product specification
Schottky barrier diode
GRAPHICAL DATA
MSA892
BAT254
3 10 handbook, halfpage
10 3 IR (µA) 10 2
(2) (1)
15
MSA891
Cd (pF)
handbook, halfpage I
F
dI F
10
dt
10% t
5
Qr 90% IR tf
MRC129 - 1
0
0
10
20
VR (V)
30
f = 1 MHz; Tamb = 25 °C.
Fig.4
Diode capacitance as a function of reverse voltage; typical values.
Product specification
Schottky barrier diode
FEATURES • Low forward voltage • Guard ring protected • Very small ceramic SMD package. APPLICATIONS • Ultra high-speed switching • Voltage clamping • Protection circuits • Blocking diodes.
2002 May 28
2
Philips Semiconductors
Product specification
Schottky barrier diode
ELECTRICAL CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL VF PARAMETER forward voltage see Fig.2 IF = 0.1 mA IF = 1 mA IF = 10 mA IF = 30 mA IF = 100 mA IR trr reverse current reverse recovery time VR = 25 V; note 1; see Fig.3 when switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA; see Fig.5 f = 1 MHz; VR = 1 V; see Fig.4 240 320 400 500 800 2 5 CONDITIONS MAX.
BAT254
This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Changes will be communicated according to the Customer Product/Process Change Notification (CPCN) procedure SNW-SQ-650A.
cathode mark k k a
a
MAM214
Fig.1 Simplified outline (SOD110) and symbol.
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VR IF IFRM IFSM Tstg Tj Tamb PARAMETER continuous reverse voltage continuous forward current repetitive peak forward current non-repetitive peak forward current storage temperature junction temperature operating ambient temperature tp ≤ 1 s; δ ≤ 0.5 tp < 10 ms CONDITIONS − − − − −65 − −65 MIN. MAX. 30 200 300 600 +150 125 +125 V mA mA mA °C °C °C UNIT
Fiቤተ መጻሕፍቲ ባይዱ.2
Forward current as a function of forward voltage; typical values.
Fig.3
Reverse current as a function of reverse voltage; typical values.
handbook, halfpage
D E
BAT254
SOD110
A
y cathode identifier
DIMENSIONS (mm are the original dimensions)
1
2
0 0.5 scale 1 mm
UNIT mm
A max. 1.6
D 2.10 1.90
E 1.40 1.10
y 0.1
OUTLINE VERSION SOD110
REFERENCES IEC JEDEC EIAJ
EUROPEAN PROJECTION
ISSUE DATE 97-04-14
2002 May 28
5
Philips Semiconductors
Product specification
Schottky barrier diode
DATA SHEET STATUS DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2) Development DEFINITIONS
Preliminary data
Qualification
Product data
Production
Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL . DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes, without notice, in the products, including circuits, standard cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.