中北大学微电子专业英语1
电子科学与技术专业英语(微电子技术分册)第一章译文
——电材专业英语课文翻译Semiconductor Materials• 1.1 Energy Bands and Carrier Concentration• 1.1.1 Semiconductor Materials•Solid-state materials can be grouped into three classes—insulators(绝缘体), semiconductors, and conductors. Figure 1-1 shows the electrical conductivities δ(and the corresponding resistivities ρ≡1/δ)associated with(相关)some important materials in each of three classes. Insulators such as fused(熔融)quartz and glass have very low conductivities, in the order of 1E-18 to 1E-8 S/cm;固态材料可分为三种:绝缘体、半导体和导体。
图1-1 给出了在三种材料中一些重要材料相关的电阻值(相应电导率ρ≡1/δ)。
绝缘体如熔融石英和玻璃具有很低电导率,在10-18 到10-8 S/cm;and conductors such as aluminum and silver have high conductivities, typically from 104 to 106 S/cm. Semiconductors have conductivities between those of insulators and those of conductors. The conductivity of a semiconductor is generally sensitive to temperature, illumination(照射), magnetic field, and minute amount of impurity atoms. This sensitivity in conductivity makes the semiconductor one of the most important materials for electronic applications.导体如铝和银有高的电导率,典型值从104到106S/cm;而半导体具有的电导率介乎于两者之间。
微电子技术英语课件oxidation 1
1.2 Experimental Fit and Limitation of D-G model
Temperature dependence – Activation Energy
dry
B
1.24 eV
B/A 2.0 eV
wet 0.71 eV 1.96 eV
remarks
Similar to the D in fused silica ( D : 1.17 eV for O2, 0.80 eV for H2O ) Similar to the Si-Si bond breaking Energy ( ~ 1.83 eV )
Oxidation rate :
✓
N1
ddox dt
F3
ksCi
1
ksC * ks ksdox
hD
❖ Initial condition : when t = 0, dox = di. ( assuming that an oxide may initially
be present )
……… (13)
At steady state : F1 = F2 = F3
✓ F1 hG (CG CS ) …………… (3)
where hG is the gas-phase mass-transfer coefficient. ❖ F1 is linearly approximated by assuming that the flux of oxidant
© Cho Byung Jin, SNDL, ECE, NUS, 2005
2
1.1 Deal & Groove Model
The oxidizing species are transported with flux ; ✓ F1 : from the bulk of the gas to the gas/oxide interface ✓ F2 : diffusion across the existing oxide toward the silicon ✓ F3 : reaction with silicon at oxide/silicon interface
微电子专业英语
Abrupt junction 突变结Accelerated testing 加速实验Acceptor 受主Acceptor atom 受主原子Accumulation 积累、堆积Accumulating contact 积累接触Accumulation region 积累区Accumulation layer 积累层Active region 有源区Active component 有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance 导纳Allowed band 允带Alloy-junction device合金结器件Aluminum(Aluminium)铝Aluminum - oxide 铝氧化物Aluminum passivation 铝钝化Ambipolar 双极的Ambient temperature 环境温度Amorphous 无定形的,非晶体的Amplifier 功放扩音器放大器Analogue(Analog)comparator 模拟比较器Angstrom 埃Anneal 退火Anisotropic 各向异性的Anode 阳极Arsenic (AS)砷Auger 俄歇Auger process 俄歇过程Avalanche 雪崩Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子Background doping 本底掺杂Backward 反向Backward bias 反向偏置Ballasting resistor 整流电阻Ball bond 球形键合Band 能带Band gap 能带间隙Barrier 势垒Barrier layer 势垒层Barrier width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit time 基区渡越时间Base transport efficiency基区输运系数Base-width modulation基区宽度调制Basis vector 基矢Bias 偏置Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫Blocking band 阻挡能带Blocking contact 阻挡接触Body - centered 体心立方Body-centred cubic structure 体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃Boundary condition 边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk 体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination 体复合Burn - in 老化Burn out 烧毁Buried channel 埋沟Buried diffusion region 隐埋扩散区Can 外壳Capacitance 电容Capture cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade 级联Case 管壳Cathode 阴极Center 中心Ceramic 陶瓷(的)Channel 沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance 特征阻抗Charge 电荷、充电Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP)化学机械抛光Chip 芯片Chip yield 芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage plane 解理面Clock rate 时钟频率Clock generator 时钟发生器Clock flip-flop 时钟触发器Close-packed structure 密堆积结构Close-loop gain 闭环增益Collector 集电极Collision 碰撞Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection ratio (CMRR)共模抑制比Compatibility 兼容性Compensation 补偿Compensated impurities 补偿杂质Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM)计算机辅助设计/ 测试/制造Compound Semiconductor 化合物半导体Conductance 电导Conduction band (edge)导带(底)Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration 组态Conlomb 库仑Conpled Configuration Devices 结构组态Constants 物理常数Constant energy surface 等能面Constant-source diffusion恒定源扩散Contact 接触Contamination 治污Continuity equation 连续性方程Contact hole 接触孔Contact potential 接触电势Continuity condition 连续性条件Contra doping 反掺杂Controlled 受控的Converter 转换器Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的Crossover 跨交Critical 临界的Crossunder 穿交Crucible坩埚Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度Curvature 曲率Cut off 截止Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样Curvature 弯曲Custom integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel (dB)分贝Decode 译码Deep acceptor level 深受主能级Deep donor level 深施主能级Deep impurity level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation 退化Degree Celsius(centigrade)/Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOSDepletion region 耗尽区Deposited film 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation 介质隔离Difference-mode input 差模输入Differential amplifier 差分放大器Differential capacitance 微分电容Diffused junction 扩散结Diffusion 扩散Diffusion coefficient 扩散系数Diffusion constant 扩散常数Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路Dipole domain 偶极畴Dipole layer 偶极层Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体Direct transition 直接跃迁Discharge 放电Discrete component 分立元件Dissipation 耗散Distribution 分布Distributed capacitance 分布电容Distributed model 分布模型Displacement 位移Dislocation 位错Domain 畴Donor 施主Donor exhaustion 施主耗尽Dopant 掺杂剂Doped semiconductor 掺杂半导体Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移Drift field 漂移电场Drift mobility 迁移率Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化Dose 剂量Duty cycle 工作周期Dual-in-line package (DIP)双列直插式封装Dynamics 动态Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应Early failure 早期失效Effective mass 有效质量Einstein relation(ship)爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM)一次性电可擦除只读存储器Electrode 电极Electrominggratim 电迁移Electron affinity 电子亲和势Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气Electron-grade water 电子级纯水Electron trapping center 电子俘获中心Electron Volt (eV)电子伏Electrostatic 静电的Element 元素/元件/配件Elemental semiconductor 元素半导体Ellipse 椭圆Ellipsoid 椭球Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试Energy state 能态Energy momentum diagram 能量-动量(E-K)图Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试Epitaxial 外延的Epitaxial layer 外延层Epitaxial slice 外延片Expitaxy 外延Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement (erfc)余误差函数Etch 刻蚀Etchant 刻蚀剂Etching mask 抗蚀剂掩模Excess carrier 过剩载流子Excitation energy 激发能Excited state 激发态Exciton 激子Extrapolation 外推法Extrinsic 非本征的Extrinsic semiconductor 杂质半导体Face - centered 面心立方Fall time 下降时间Fan-in 扇入Fan-out 扇出Fast recovery 快恢复Fast surface states 快界面态Feedback 反馈Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布Femi potential 费米势Fick equation 菲克方程(扩散)Field effect transistor 场效应晶体管Field oxide 场氧化层Filled band 满带Film 薄膜Flash memory 闪烁存储器Flat band 平带Flat pack 扁平封装Flicker noise 闪烁(变)噪声Flip-flop toggle 触发器翻转Floating gate 浮栅Fluoride etch 氟化氢刻蚀Forbidden band 禁带Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应Function 函数Gain 增益Gallium-Arsenide(GaAs)砷化钾Gamy ray r 射线Gate 门、栅、控制极Gate oxide 栅氧化层Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸Germanium(Ge)锗Graded 缓变的Graded (gradual)channel 缓变沟道Graded junction 缓变结Grain 晶粒Gradient 梯度Grown junction 生长结Guard ring 保护环Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件Heat of formation 形成热Heat sink 散热器、热沉Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂Hell - effect 霍尔效应Heterojunction 异质结Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.(H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力Impact ionization 碰撞电离Impedance 阻抗Imperfect structure 不完整结构Implantation dose 注入剂量Implanted ion 注入离子Impurity 杂质Impurity scattering 杂质散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO)铟锡氧化物Induced channel 感应沟道Infrared 红外的Injection 注入Input offset voltage 输入失调电压Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分Interconnection 互连Interconnection time delay 互连延时Interdigitated structure 交互式结构Interface 界面Interference 干涉International system of unions国际单位制Internally scattering 谷间散射Interpolation 内插法Intrinsic 本征的Intrinsic semiconductor 本征半导体Inverse operation 反向工作Inversion 反型Inverter 倒相器Ion 离子Ion beam 离子束Ion etching 离子刻蚀Ion implantation 离子注入Ionization 电离Ionization energy 电离能Irradiation 辐照Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET)结型场效应管Junction isolation 结隔离Junction spacing 结间距Junction side-wall 结侧壁Latch up 闭锁Lateral 横向的Lattice 晶格Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流Level shifting 电平移动Life time 寿命linearity 线性度Linked bond 共价键Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻Light Emitting Diode(LED)发光二极管Load line or Variable 负载线Locating and Wiring 布局布线Longitudinal 纵向的Logic swing 逻辑摆幅Lorentz 洛沦兹Lumped model 集总模型Majority carrier 多数载流子Mask 掩膜板,光刻板Mask level 掩模序号Mask set 掩模组Mass - action law质量守恒定律Master-slave D flip-flop主从D触发器Matching 匹配Maxwell 麦克斯韦Mean free path 平均自由程Meandered emitter junction梳状发射极结Mean time before failure (MTBF)平均工作时间Megeto - resistance 磁阻Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化Microelectronic technique 微电子技术Microelectronics 微电子学Millen indices 密勒指数Minority carrier 少数载流子Misfit 失配Mismatching 失配Mobile ions 可动离子Mobility 迁移率Module 模块Modulate 调制Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管Multiplication 倍增Modulator 调制Multi-chip IC 多芯片ICMulti-chip module(MCM)多芯片模块Multiplication coefficient倍增因子Naked chip 未封装的芯片(裸片)Negative feedback 负反馈Negative resistance 负阻Nesting 套刻Negative-temperature-coefficient 负温度系数Noise margin 噪声容限Nonequilibrium 非平衡Nonrolatile 非挥发(易失)性Normally off/on 常闭/开Numerical analysis 数值分析Occupied band 满带Officienay 功率Offset 偏移、失调On standby 待命状态Ohmic contact 欧姆接触Open circuit 开路Operating point 工作点Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子Optical quenching光猝灭Optical transition 光跃迁Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体Orientation 晶向、定向Outline 外形Out-of-contact mask非接触式掩模Output characteristic 输出特性Output voltage swing 输出电压摆幅Overcompensation 过补偿Over-current protection 过流保护Over shoot 过冲Over-voltage protection 过压保护Overlap 交迭Overload 过载Oscillator 振荡器Oxide 氧化物Oxidation 氧化Oxide passivation 氧化层钝化Package 封装Pad 压焊点Parameter 参数Parasitic effect 寄生效应Parasitic oscillation 寄生振荡Passination 钝化Passive component 无源元件Passive device 无源器件Passive surface 钝化界面Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压Peak voltage 峰值电压Permanent-storage circuit 永久存储电路Period 周期Periodic table 周期表Permeable - base 可渗透基区Phase-lock loop 锁相环Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件Photolithographic process 光刻工艺(photo)resist (光敏)抗腐蚀剂Pin 管脚Pinch off 夹断Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺Planar transistor 平面晶体管Plasma 等离子体Plezoelectric effect 压电效应Poisson equation 泊松方程Point contact 点接触Polarity 极性Polycrystal 多晶Polymer semiconductor聚合物半导体Poly-silicon 多晶硅Potential (电)势Potential barrier 势垒Potential well 势阱Power dissipation 功耗Power transistor 功率晶体管Preamplifier 前置放大器Primary flat 主平面Principal axes 主轴Print-circuit board(PCB)印制电路板Probability 几率Probe 探针Process 工艺Propagation delay 传输延时Pseudopotential method 膺势发Punch through 穿通Pulse triggering/modulating 脉冲触发/调制Pulse Widen Modulator(PWM)脉冲宽度调制punchthrough 穿通Push-pull stage 推挽级Quality factor 品质因子Quantization 量子化Quantum 量子Quantum efficiency量子效应Quantum mechanics 量子力学Quasi - Fermi-level准费米能级Quartz 石英Radiation conductivity 辐射电导率Radiation damage 辐射损伤Radiation flux density 辐射通量密度Radiation hardening 辐射加固Radiation protection 辐射保护Radiative - recombination辐照复合Radioactive 放射性Reach through 穿通Reactive sputtering source 反应溅射源Read diode 里德二极管Recombination 复合Recovery diode 恢复二极管Reciprocal lattice 倒核子Recovery time 恢复时间Rectifier 整流器(管)Rectifying contact 整流接触Reference 基准点基准参考点Refractive index 折射率Register 寄存器Registration 对准Regulate 控制调整Relaxation lifetime 驰豫时间Reliability 可*性Resonance 谐振Resistance 电阻Resistor 电阻器Resistivity 电阻率Regulator 稳压管(器)Relaxation 驰豫Resonant frequency共射频率Response time 响应时间Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷Saturated current range电流饱和区Saturation region 饱和区Saturation 饱和的Scaled down 按比例缩小Scattering 散射Schockley diode 肖克莱二极管Schottky 肖特基Schottky barrier 肖特基势垒Schottky contact 肖特基接触Schrodingen 薛定厄Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶Segregation 分凝Selectivity 选择性Self aligned 自对准的Self diffusion 自扩散Semiconductor 半导体Semiconductor-controlled rectifier 可控硅Sendsitivity 灵敏度Serial 串行/串联Series inductance 串联电感Settle time 建立时间Sheet resistance 薄层电阻Shield 屏蔽Short circuit 短路Shot noise 散粒噪声Shunt 分流Sidewall capacitance 边墙电容Signal 信号Silica glass 石英玻璃Silicon 硅Silicon carbide 碳化硅Silicon dioxide (SiO2)二氧化硅Silicon Nitride(Si3N4)氮化硅Silicon On Insulator 绝缘硅Siliver whiskers 银须Simple cubic 简立方Single crystal 单晶Sink 沉Skin effect 趋肤效应Snap time 急变时间Sneak path 潜行通路Sulethreshold 亚阈的Solar battery/cell 太阳能电池Solid circuit 固体电路Solid Solubility 固溶度Sonband 子带Source 源极Source follower 源随器Space charge 空间电荷Specific heat(PT)热Speed-power product 速度功耗乘积Spherical 球面的Spin 自旋Split 分裂Spontaneous emission 自发发射Spreading resistance扩展电阻Sputter 溅射Stacking fault 层错Static characteristic 静态特性Stimulated emission 受激发射Stimulated recombination 受激复合Storage time 存储时间Stress 应力Straggle 偏差Sublimation 升华Substrate 衬底Substitutional 替位式的Superlattice 超晶格Supply 电源Surface 表面Surge capacity 浪涌能力Subscript 下标Switching time 开关时间Switch 开关Tailing 扩展Terminal 终端Tensor 张量Tensorial 张量的Thermal activation 热激发Thermal conductivity 热导率Thermal equilibrium 热平衡Thermal Oxidation 热氧化Thermal resistance 热阻Thermal sink 热沉Thermal velocity 热运动Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT)薄膜晶体Threshlod 阈值Thyistor 晶闸管Transconductance 跨导Transfer characteristic 转移特性Transfer electron 转移电子Transfer function 传输函数Transient 瞬态的Transistor aging(stress)晶体管老化Transit time 渡越时间Transition 跃迁Transition-metal silica 过度金属硅化物Transition probability 跃迁几率Transition region 过渡区Transport 输运Transverse 横向的Trap 陷阱Trapping 俘获Trapped charge 陷阱电荷Triangle generator 三角波发生器Triboelectricity 摩擦电Trigger 触发Trim 调配调整Triple diffusion 三重扩散Truth table 真值表Tolerahce 容差Tunnel(ing)隧道(穿)Tunnel current 隧道电流Turn over 转折Turn - off time 关断时间Ultraviolet 紫外的Unijunction 单结的Unipolar 单极的Unit cell 原(元)胞Unity-gain frequency 单位增益频率Unilateral-switch单向开关Vacancy 空位Vacuum 真空Valence(value)band 价带Value band edge 价带顶Valence bond 价键Vapour phase 汽相Varactor 变容管Varistor 变阻器Vibration 振动Voltage 电压Wafer 晶片Wave equation 波动方程Wave guide 波导Wave number 波数Wave-particle duality 波粒二相性Wear-out 烧毁Wire routing 布线Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿。
微电子技术专业英语
Aabruptly 立刻abundance 分布量accelerated 加速accommodat接纳,供应adjacent 接近的affinity 倾向alloying 合金align 排列amorphous type不定形amplifier 放大器analog 模拟的anisotropic 各向异性的anncal 退火annihilate 消灭approximate 近似;相符性arbitary 任意的arsenic 砷at rest 静止avalanche 雪崩Bbarrier 势垒base 基极bias 偏压bipolar junction transistor双极性晶体管(BJT)biasing 偏置boron 硼boundary 边界bulk 体积buried layer 埋层Ccapacitance 电容channel 沟道coefficient 系数collision 碰撞collector 集电极compensate 补偿composite 复合的concentration 浓度conductor 导体conduction band 导带conductivity 磁场configuration 结构constant 常数constitute 构成constituent 要素consumption 功耗constant 恒定core 核心corresponding 对应的correspond 相一致covalent band 价带critical 临界crystal 晶体crystal lattice 晶格crystal orientation 晶向cube 立方cubic 立方的current 电流cutoff 节制DDangling bond 悬挂键dashed line 虚线decay 衰减deficiency 缺乏degenerate 简并density 浓度deplete 耗尽depletion region 耗尽层device 器件dielectic constant 介电常数dielectic 绝缘体,电介质diffusion 扩散dimension 量纲diode 二极管discontinuity 中断discrete 离散的displacement 位移distribution 分布donor 施主doping level 掺杂浓度dopant 掺杂剂drain 漏drift 漂移duplicate 复制Eeffective potential energy有效势能electrode 电极electrostatic 静电学的election 电子自旋element semiconductor 元素半导体elevate 提升emitter 发射极epitaxy 外延equidistant 等距的equilibrium 平衡excess 过盛excitation 激发external 外部的extracted 抽取extrapotation 外推extrinic 非本征FFabrication制作finite 限定的figure of merit 品质因子flat band voltage平带电压flexibility 适应性flux 流动fraction 比例forbidden region 禁带forward bia 正向偏压Ggallium 镓gaseous 气态的gate 栅;门germanium 锗generate 生成graded 缓变gradient 梯度Hhomejunction同质节Iillumination 光照impact ionization 碰撞电离implantation 注入impurity 杂质incident ion 射入离子incorporate 合并infinite 无限的influx 流入inherently 本身insulator 绝缘体interaligitated structure 叉指型结构interatomic 原子间的intercept 截距interest 意义interface 界面,接口integration 积分intrinsic 本征inverted 反向inversion layer反型层ionized 电离isolated 孤立的isotropic 各向同性JJoule 焦耳KKinetic 运动的LLateral 侧面的leakage 漏load 负载lowercase 小写的MMacroscopic 宏观的mass 质量magnitude 数值上MBE 分子束外延merit 优点mfinity 无穷大microsopic微观的migration 迁移modulation 调制momentum 要素multiplication 倍增Nnet doping 净掺杂neutral 中性normalized 归一化nucleus 核OOhmis 欧姆的optical 光学orbit 轨道,转orientation 倾向性oscillator 振荡器oscilloscope 示波器overlap 重叠Pparallel resistant 并联电阻parasitic 寄生的parameters 参数peak 峰值permittivity 介电常数perpendicular竖直的penetrate 进入,渗透photoconductivity光电导性photon 光子polysilicon 多晶硅practical 替代predominate 控制probability 几率proportional 比例的profile 分布pn junction PN结pulse 脉冲Qquantum mechanics 量子力学qualitative 定性Rrange 射程ratio 比值rearranging 排列reclaimable 可回收reciprocal 互惠的recombination center 复合中心resistivity 抵抗力response 响应reverse bia 正向偏压Ssaturation 饱和区scatter 散射self-aligned 自对准的semilog 半对数short-circuiting 短路simulation 仿真slope 斜率solid-state 固体材料solubility 溶度source 源space-charge 空间电荷spatial 空间的stationary 固定的step junction 突变节substrate 衬底,基片subthreshold 亚阈值supersede 替代supply 电源switch 开关Tterminal voltage 端电压tern 项tetrahedron 四分体thermal 热量的traverse 横越transit 运输transiston region 过渡区transistor 晶体管transconduction跨导transconductance互导transiet 瞬时的trunnel 遂穿Uuniform 均匀Vvacancy 空缺vaccum 真空valence band 价带valid 有效的vertical 直立的velocity 速率vibration 振动voltage 电压varies exponentially 指数变化Wwell 阱wafer 晶片work function功函数。
微电子专业英语
Diffusion扩散,传播diffusion furnaces扩散炉facility设施设备quartz石英Tube管子,管,真空管diameter直径transformer变压器pipe管子;笛子Valve阀门;阀flowmeter流量计resemble像;很像wafers晶圆profile规范;概要Vent通风口;出口;排放exhaust排气;排放装置etiquette礼仪;礼节chain smoker老烟枪optics光学MIT麻省理工学院align排列;对准mesa transistor台面型晶体管geometry几何学,图形emitter发射者;发射体base基区emulsion感光剂;乳状液masking plate掩模板expose使··曝光mercury lamp汞灯aluminum铝ohmic欧姆的ohmic contanct欧姆接触moderately相当地dope掺杂antimony锑boron硼yield成品率prevail流行;成功;优先tentative试验的;暂时的advertising campaign广告宣传silicon硅portfolio业务量despite尽管diffusion capacitance扩散电容quartz crystal石英晶体tube diode真空二极管Program Overview and File程序概要和文件exhaust valve排气阀exhaust algorithm穷举算法chain break链中断optics design光学设计mesa diffusion台面扩散Geometry Theorem Prover几何学定理证明emitter follower射极跟随器Base Band基带Mercury tank水银槽ohmic resistance 欧姆电阻doped oxide diffusion掺杂氧扩散Yield criteria合格率标准tentative table of equipment 试行设备表silicon MESFET process硅金属半导体场效应晶体管工艺epitaxial(晶体)取向附生的;外延的micrologic显微科学的WESCON(Western Electronic Show and Convention)西部电子展览和会议shift register移位寄存器inverter反相器order of magnitude数量级isolation绝缘;隔离isolation diffusion隔离扩散result in造成warpage热变形;扭曲IC(integrated circuits)集成电路obsolete废弃的,过时的RTL(resistor transistor logic)电阻晶体管逻辑(电路)DTL(diode transistor logic)二极管晶体管逻辑(电路)unilaterally单方地IRE(Institute of Radio Engineers)无线电工程师学会NAND gate与非门discrete分立的discrete component分立元件the crowd大众Revenue收入hide躲藏;隐瞒reliability可靠性vibration振动;颤动vibration test振动测试explosive爆炸的trigger触发;发射capacity容量estimate估计climb on the bandwagon赶时髦cycle time周期overall从头到尾;总的inertial guidance惯性制导flight control飞行控制ground地Texas Instruments德克萨斯(德州)仪器RCA美国无线电公司General Electric通用电气公司Autonetics自动控制学qualification资格;限制;执照shift register latch移位寄存器锁存电路isolation barrier隔离势垒isolation region隔离区isolation masking隔离掩蔽isolation leakage隔离漏流discrete IC分立集成电路revenue bond收益债券revenue tax财政关税hidden field隐式字段reliability statistics可靠性统计vibration noise振动干扰inertial mass惯性质量ground base共基极接地qualification test合格性试验ground circuit接地电路qualification time鉴定时间qualification phase限定相位mulish执拗的unyielding不易弯曲的obstinate顽固的persistent坚持不懈的Utah犹他州Salt Lake City盐湖城solid state固态responsibility责任priority优先权field effect场效应FET场效应晶体管originate from源于doctorate博士学位flip-flop触发器amplifier放大器gate栅oxide氧化物aluminum铝deposit放置,淀积vaccum真空oxidation氧化threshold voltage阈值电压drain漏fabrication制造instability不稳定性pinch-off夹断pinch-off voltage夹断电压alloy合金standby备用的power density功率密度triode三级真空管circuitry电路packing density存储密度patent专利complementary互补的persistent registration持久性定位solid unit固态器件gate region栅区gate oxide thickeness栅氧化层厚度vacuum tube真空管oxidation film氧化膜oxidation mask氧化掩膜threshold control阈值控制alloying reaction熔合反应Standby Power Supply备用电源general perpose通用的operational amplifier运算放大器industry standards工业标准plug-in插入式的overload protection过载保护freedom from没有identical to和··完全不同operational control unit运算控制单元plug and play即插即用latch mode锁存模式overload circuit breaker过载断路器identical operation恒等运算Schottky-clamped肖特基箝位memory-decoding存储译码data routing数据选择propagation delay time传播延迟时间access time存取时间negligible可忽略不计的demultiplexing多路输出选择Schottky Clamped Transistor肖特基箝位晶体管Schottky Barrier肖特基势垒Access Register存取寄存器Power功耗channel通道serial串行ADC模数转换器data-acquisition数据采集Multiplexer多路复用器bandwidth带宽track/hold采样/保持interface接口Ultra极端的single +5V supply +5V单电源analog input模拟输入single-ended单端Differential差分的unipolar/bipolar单极的/双极的TM(trade mark)商标strobe选通Family系列digital signal processor数字信号处理器successive逐次的approximation 逼近的reference基准drift漂移ppm(parts per million)百万分之几buffer缓冲Amplifier放大器gain增益trim微调LSB(least significant bit)最低有效位pin引脚Quantization error量化误差power-down断电power up加电shut down关闭sampling rate抽样率DIP(dual in-line package)双列直插式封装SO package(small outline package)小外形SOP SSOP(shrink-small-outline package)缩小型SOP anti-aliasing filter抗混叠滤波器data sheet数据表capacitor电容float悬空Falling edge下降沿impedance阻抗clock period时钟周期rising edge上升沿Duty cycle占空比circuitry电路flexible可变的microprocessor微处理器block diagram 框图pseudo伪的differential input差分输入comparator比较器equivalent相等的With respect to关于span跨越cycle周期restore恢复binary-weighted capacitor二进制加权电容General Input总输入General Register通用寄存器Analog to Digital Converter模数转换Multiplexer circuit多路转换电路Ultra Large Scale IC超大规模集成电路differential amplifier差动放大器unipolar transistor单极晶体管bipolar COMS双极型互补金属氧化物半导体Digital Clock Pulse数字时钟脉冲Reference Voltage参考电压Gain margin增益裕度quantization noise量化噪声SOJ J型引脚小外形封装TSOP薄小外形封装VSOP甚小外形封装TSSOP薄的缩小型SOP SOT小外形晶体管SOIC小外形集成电路impedance mismatch阻抗失配flexible printed circuit柔性印制电路Ion implantation离子注入molecule分子electric field电场target靶子;目标A wide variety of各种各样的dose剂量substrate基板;衬底crystal structure晶体结构Incidence发生phosphorus磷dope掺杂homogeneity同质性reproducibility可重复性profile剖面concentration浓度relatively比较而言nitride氮化物penetration刺穿;渗透penetration depth穿透深度gradient梯度sequence序列optimization最佳化dopant掺杂property性质restricted to限于domain领域shallow浅的theoretical理论上trajectory轨道distribute分配collision碰撞randomly随机的impact冲击力arsenic砷的crystalline silicon单晶硅dominant支配channel effect沟道效应tail尾巴tendency趋势saturate浸透,饱和conventional通常的tilt倾斜simulation仿真thermal vibration热振动interaction相互作用ion absorption离子吸收ion beam etching离子束蚀刻ion laser离子激光dose of medicine药剂量substrate interconnection衬底互连incidence zone入射区optimization cost优化成本dopant diffusion掺杂剂扩散domain name域名shallow binding浅结合distributed capacitance分布电容collision channel冲突通道randomly distributed data随机分布数据impact strength冲击强度impact response击打响应channeling diode沟道二极管conventional model传统模型thermal conduction热传导Simulation Analysis and Modeling模拟分布与模型化thermal agitation noise热噪声Thermal oxidation热氧化elevate提升angstroms埃inclination低下来ambient环境Room temperature室温oxidation furnace氧化炉diffusion furnace扩散炉cabinet机壳Fuse熔断quartz石英tube管undergo经受;承担heating coil加热线圈Glassware玻璃制品paddles短桨oxidizing agent氧化剂dry oxidation干法氧化Wet oxidation湿法氧化silicon硅silicon dioxide二氧化硅relative density相对密度Parabolic抛物线hamper妨碍empirically经验地halogen卤素flux变化Ambient condition环境条件ambient noise环境噪音ambient temperature环境温度Quartz crystal石英晶体quartz oscillator石英振荡器undergo change历经变化Quartz Crystal Frequencey Oscillator石英晶体频率振荡器undergo examination受到审讯Undergo experience经历undergo surgery接受手术undergo punishment遭受处罚Heating and ventilation供暖和通风heating effect热效应heating time加热时间Silicon chip硅片silicon dioxide layer二氧化硅层relative accuracy相对精度Relative divergence相对偏差relative magnitude相对值parabolic antenna抛物线天线Flux coating焊剂涂敷flux counter磁通计数器flux leakage漏磁Assemble装配packaging封装manufacture制造transform改变semiconductor半导体functional product功能产品end user终端用户electrical connection电连接Transmission传送thermal dissipation热损reliability可靠性innovation革新Architecture 建筑system integration系统集成expansion膨胀wireless无线的Bio-chips生物芯片optoelectronics光电子学scale等级gap间隙diversification多样化MEMS:Micro Electro Mechanical System微电子机械系统slack松弛mechanism混合SIP(system-in-package)系统芯片functional density功能密度printable可印刷的Embedded devices嵌入式器件emerging新兴的regulatory管理的assemble cell装配单元packaging technique组装技术transforming principle转化要素semiconductor junction半导体结transmission band传输频带expansion connector扩展接口System Application Architecture系统应用程序体系wireless terminal无线终端chip addressing芯片寻址gap junction间隙结合gap length间隙长度slack business松弛业务slack variable松弛变量mechanism design机械设计printable character可打印字符emerging technology新兴技术pin assignment引脚分配pin configuration引脚配置category construction类别构造identical equation恒等方程identical entry恒等项fan out扇出perspective view透视图perspective projection透视投影portable terminal 便携式终端stacked graph叠式图stacked interrupt栈式中断minimal automaton最小自动化precision coding精确编码precision instrument精密仪器alignment pattern对准模式alignment requirement校准请求absorption spectrum吸收谱absorption coefficient吸收系数refractive index折射率scattering layer散射层coupling capacitance耦合电容filter condition筛选条件filter factor过滤因子dielectric layer介电层impedance bridge阻抗电桥impedance mismatch阻抗失配integrated passive devices(IPD)集成无源器件exclusive专有地filter过滤器resistive电阻性的inductive电感性的capacitive电容性的capacitor电容器polymer聚合物dielectric电介质impedance阻抗RF-signal射频信号cellular网眼的thin film薄膜mountable可安装的bondable能捆绑的alumina氧化铝filter conditions筛选条件filter plate滤光板dielectric breakdown电介质击穿dielectric constant介电常数dielectric isolation电介质隔离法。
微电子专业英语词汇-推荐下载
Chip 芯片
Chip yield 芯片成品率
Clamped 箝位
Clamping diode 箝位二极管
Cleavage plane 解理面
Clock rate 时钟频率
Clock generator 时钟发生器
Clock flip-flop 时钟触发器
Close-packed structure 密堆积结
偿半导体
Complementary Darlington circuit
互补达林顿电路
Complementary Metal-Oxide-
Semiconductor
Field-Effect-
Transistor(CMOS)
互补金属氧化物半导体场效应
晶体管
Complementary error function 余
误差函数
Compound Semiconductor 化合
物半导体 Conductance 电导
对全部高中资料试卷电气设备,在安装过程中以及安装结束后进行高中资料试卷调整试验;通电检查所有设备高中资料电试力卷保相护互装作置用调与试相技互术通关,1系电过,力管根保线据护敷生高设产中技工资术0艺料不高试仅中卷可资配以料置解试技决卷术吊要是顶求指层,机配对组置电在不气进规设行范备继高进电中行保资空护料载高试与中卷带资问负料题荷试22下卷,高总而中体且资配可料置保试时障卷,各调需类控要管试在路验最习;大题对限到设度位备内。进来在行确管调保路整机敷使组设其高过在中程正资1常料中工试,况卷要下安加与全强过,看2度并22工且22作尽22下可22都能2可地护1以缩关正小于常故管工障路作高高;中中对资资于料料继试试电卷卷保破连护坏接进范管行围口整,处核或理对者高定对中值某资,些料审异试核常卷与高弯校中扁对资度图料固纸试定,卷盒编工位写况置复进.杂行保设自护备动层与处防装理腐置,跨高尤接中其地资要线料避弯试免曲卷错半调误径试高标方中高案资等,料,编5试要写、卷求重电保技要气护术设设装交备备4置底高调、动。中试电作管资高气,线料中课并3敷试资件且、设卷料中拒管技试试调绝路术验卷试动敷中方技作设包案术,技含以来术线及避槽系免、统不管启必架动要等方高多案中项;资方对料式整试,套卷为启突解动然决过停高程机中中。语高因文中此电资,气料电课试力件卷高中电中管气资壁设料薄备试、进卷接行保口调护不试装严工置等作调问并试题且技,进术合行,理过要利关求用运电管行力线高保敷中护设资装技料置术试做。卷到线技准缆术确敷指灵设导活原。。则对对:于于在调差分试动线过保盒程护处中装,高置当中高不资中同料资电试料压卷试回技卷路术调交问试叉题技时,术,作是应为指采调发用试电金人机属员一隔,变板需压进要器行在组隔事在开前发处掌生理握内;图部同纸故一资障线料时槽、,内设需,备要强制进电造行回厂外路家部须出电同具源时高高切中中断资资习料料题试试电卷卷源试切,验除线报从缆告而敷与采设相用完关高毕技中,术资要资料进料试行,卷检并主查且要和了保检解护测现装处场置理设。备高中资料试卷布置情况与有关高中资料试卷电气系统接线等情况,然后根据规范与规程规定,制定设备调试高中资料试卷方案。
微电子专业英语词汇
微电子专业英语词汇 IMB standardization office【IMB 5AB- IMBK 08- IMB 2C】Abrupt junction 突变结['brpt] 突然的;Accelerated testing 加速实验[k'selreitid]Acceptor 受主 Acceptor atom 受主原子['tm] n. 原子Accumulation [,kju:mju'lein]积累,堆积Accumulating contact(n. 接触,联系)积累接触Accumulation region['ri:dn]地区积累区 Accumulation layer['lei] 层积累层Active region 有源区['ktiv]积极的,有源的 Active component [km'punnt]元件有源元Active device 有源器件 Activation 激活Activation energy 激活能 Active region 有源(放大)区Admittance [d'mitns]导纳 Allowed band [b?nd]带允带Alloy-junction device ['l]合金结器件 Aluminum(Aluminium) ['lju:minm]铝Aluminum – oxide ['ksaid]铝氧化物 Aluminum passivation [psi'vein]钝化铝钝化Ambipolar [,mbi'pul]双极的 Ambient temperature ['mbint]环境温度Amorphous ['m:fs]无定形的,非晶体的 Amplifier ['mplifai]功放扩音器放大器Analogue(Analog) ['nlɡ] comparator ['kmpreit]模拟比较器 Angstrom ['strm]埃Anneal ['ni:l]退火 Anisotropic [n,aisu'trpik]各向异性的Anode ['nud]阳极 Arsenic ['ɑ:s?nik (AS) 砷Auger [':ɡ]俄歇 Auger process 俄歇过程Avalanche ['vlɑ:nt]雪崩 Avalanche breakdown(击穿) 雪崩击穿Avalanche excitation [,eksi'tei?n](激发)雪崩激发Background(背景,本底,基底) carrier 本底载流子 Background doping 本底掺杂Backward ['bkwd]反向 Backward bias ['bai?s](偏置,)偏爱反向偏置Ballasting ['blst] resistor 整流电阻 Ball bond [b?nd](结合)球形键合Band 能带 Band gap [ɡ?p](间隙)能带间隙Barrier 势垒 Barrier layer 势垒层Barrier ['bri] width 势垒宽度 Base 基极Base contact 基区接触 Base stretching 基区扩展效应Base transit(运输)time基区渡越时间 Base transport efficiency [i'fi?nsi](效率)基区输运系数Base-width modulation [,mdju'lein(调制)基区宽度调制 Basis vector ['vekt]矢量基矢Bias 偏置 Bilateral [,bai'ltrl] switch 双向开关Binary ['bain?ri]code(代码)二进制代码Binary compound semiconductor二元化合物半导体Bipolar [bai'pul]双极性的 Bipolar Junction Transistor (晶体管)(BJT)双极晶体管Bloch [bl?k]布洛赫 Blocking ['blki](截止,阻塞) band 阻挡能带Blocking contact 阻挡接触 Body(身体,主题) - centered(居中的)体心立方Body-centred cubic ['kju:bik]立方体structure ['strkt]结构体立心结构 Boltzmann 波尔兹曼Bond 键、键合 Bonding electron 价电子Bonding pad 键合点 Bootstrap circuit ['s:kit]电路自举电路Bootstrapped emitter [i'mit]发射器 follower(追随者)自举射极跟随器 Boron ['b:rn]硼Borosilicate [,b:ru'silikit]硼硅酸盐 glass 硼硅玻璃 Boundary condition 边界条件Bound electron 束缚电子 Breadboard 模拟板、实验板Break down 击穿 Break over 转折Brillouin 布里渊 Brillouin zone 布里渊区Built-in 内建的 Build-in electric field 内建电场Bulk [b?lk]体/体内 Bulk absorption 体吸收Bulk generation 体产生 Bulk recombination [,ri:kmbi'nein]体复合Burn - in 老化 Burn out 烧毁Buried ['berid]埋葬的 channel埋沟 Buried diffusion扩散 region 隐埋扩散区Can 外壳 Capacitance[k'p?st()ns]电容Capture俘获 cross section 俘获截面 Capture carrier 俘获载流子Carrier 载流子、载波 Carry bit 进位位Carry-in bit 进位输入 Carry-out bit 进位输出Cascade [k?s'keid]级联,串联级联 Case 管壳Cathode['kθud]阴极 Center 中心Ceramic [si'r?mik]陶瓷(的) Channel['tnl] (频道)沟道Channel breakdown 沟道击穿 Channel current 沟道电流Channel doping 沟道掺杂 Channel shortening 沟道缩短Channel width 沟道宽度 Characteristic impedance[im'pi:d?ns]特征阻抗Charge (控告)电荷,充电 Charge-compensation[,kmpen'sein](补偿) effects 电荷补偿效应Charge conservation(保存,保持) 电荷守恒Charge neutrality[nju'trlt](中性) condition电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching[nju'trlt]化学腐蚀法 Chemically-Polish['pl](磨光)化学抛光Chemmically-Mechanically [m'knkl](机械地)Polish (CMP) 化学机械抛光 Chip 芯片Chip yield(产量)芯片成品率 Clamped 箝位Clamping diode 箝位二极管 Cleavage['klivd] plane(平面)解理面Clock rate(比率)时钟频率 Clock generator 时钟发生器Clock flip-flop(触发器)时钟触发器 Close-packed structure(构造)密堆积结构Close-loop(环) gain(获利,增加)闭环增益 Collector 集电极Collision[k'l()n](冲突)碰撞 Compensated(补偿) OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益 Common-mode input 共模输入Common-mode rejection(抑制,拒绝)ratio (CMRR) 共模抑制比Compatibility[km,pt'blt]兼容性 Compensation 补偿Compensated impurities(杂质)补偿杂质 Compensated semiconductor 补偿半导体Complementary(补足的) Darlington circuit(电路,回路)互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(晶体管)(CMOS) 互补金属氧化物半导体场效应晶体管Complementary error function(功能,函数)余误差函数Computer-aided【辅助的】design (CAD)/test(CAT)/manufacture(CAM)Compound['kmpand] Semiconductor 化合物半导体 Conductance[kn'dkt()ns]电导Conduction(传导band (edge) 导带(底) Conduction level/state 导带态Conductor 导体 Conductivity 电导率Configuration(配置)组态 Conlomb['kulm]库仑Conpled Configuration Devices 结构组态 Constants(常量,常数)物理常数Constant energy surface 等能面 Constant-source diffusion(扩散,传播)恒定源扩散Contact(联系,接触)接触 Contamination[kn,tm'nen]玷污Continuity[,knt'njut](连续性)equation(方程式,等式)连续性方程Contact hole孔接触孔Contact potential(潜能,潜在的)接触电势 Continuity condition 连续性条件Contra['kntr]相反 doping 反掺杂 Controlled 受控的Converter[kn'vt](converter转变,转换)转换器 Conveyer[kn've]传输器Copper(铜) interconnection[,ntk'nkn](互联) system 铜互连系统 Couping 耦合Covalent[k'vel()nt](共价的)共阶的 Crossover 跨交Critical (批评的)临界的 Crossunder 穿交Crucible['krusb()l]坩埚Crystal defect缺陷/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density(密度)电流密度 Curvature'kvt曲率Cut off 截止Current drift(漂移)/dirve/sharing电流漂移/驱动/共享Current Sense(感觉,检测)电流取样 Curvature 弯曲Custom(风俗,习惯,定制的integrated circuit 定制集成电路 Cylindrical 柱面的Czochralshicrystal 直立单晶crystal(晶体,单晶)Czochralski technique 切克劳斯基技术(Cz 法直拉晶体 J)Dangling ['d?g()l;bonds 悬挂键 Dark current 暗电流Dead time 空载时间 Debye length 德拜长度德布洛意 Decderate 减速Decibel ['des?bel] (dB) 分贝 Decode 译码Deep acceptor level 深受主能级 Deep donor['dn(捐赠者level 深施主能级Deep impurity(杂质,不存,不洁)level 深度杂质能级 Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体 Degeneracy 简并度Degradation[,degr'de()n]退化 Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟 Density 密度Density of states 态密度 Depletion 耗尽Depletion approximation 耗尽近似 Depletion contact 耗尽接触Depletion depth 耗尽深度 Depletion effect 耗尽效应Depletion layer 耗尽层 Depletion MOS 耗尽 MOSDepletion region 耗尽区 Deposited film(电影,薄膜) 淀积薄膜Deposition process 淀积工艺 Design rules 设计规则Die 芯片(复数 dice) Diode 二极管Dielectric 介电的 Dielectric isolation(隔离。
微电子专业英语,文库
sides, χn=χp, Egn=Egp, and γn=γp. This implies that the bottom of the conduction band is (for neutrality) at the same energy for both materials, and ECn=ECp. Similarly Egn=Egp and EVn=EVp. Since electron affinities and ionization potentials are constant, EC and EV at the material edges are secondary references. However, because the doping is different in the two materials, the positions of the Fermi
• 热平衡状态下的能带图 由于没有净电流通过pn结,
所以Jn=Jp=0,而且费米能级相等。内建电场ξ被称作过 渡区(?空间电荷区?)。在空间度梯度引起的扩 散电流。同理,对于空穴的漂移电流和扩散电流,情况完 全类似。结中的内建电场改变了能带。因为我们参考的是 真空能级,所以这一观点维持不变。
•
电子亲和力χ,电离势γ,能量差Eg表示各种材料的 特性。下标n表示n型半导体,下标p表示p型半导体。另 外还显示了一个参数,也就是功函数Φ。功函数等于真 空能级和费米能级的能量差。 Φ=Evac-Ef.
Upon contact between the two materials, because there are more quasi-free electrons on the n side than on the p side, electrons flow (diffuse) from the n-type semiconductor to the p-type semiconductor. As the electrons move toward file ptype region, they leave behind ionized donors (charged positively) that are locked into the crystal lattice. At the same time, holes flow from the p semiconductor to the n semiconductor, leaving behind negatively charged acceptors. This separation of charges sets up an electric field, as shown in Fig.3.3.
微电子专业英语词汇
Chapter One 第一章Semiconductor fundamental 半导体基础1.1 Semiconductor Materials 半导体材料1 Solid stare 固态2 insulator 绝缘体3 electrical conductivity电导率4 conductor 导体5 semicoductor 半导体6 Fused quartz熔融石英7 order 有序8 impurity 杂质9 element semiconductor元素半导体10 illumination 阐明11 silicon 硅12 Periodic table周期表13 germanium 锗14 gallium 嫁15two-terminal 两端16 Arsenic 砷17 silica 石英18bipolar transistor 双极晶体管19 rectifier 整流器20 optical 光21photodiodes 光电二极管22silicates 硅酸盐23dimension 维度24 Gallium arsenide 砷化镓25 microwave 微波26compound semicondutor 化合物半导体1.2 Crystal Structure 晶体结构1 Crystal 晶体2 amorphous 非晶的3 formlessness 无定形的4 solar cell 太阳能电池5 polycrystalline 多晶的6 silicon dioxide 二氧化硅7 gate 门栅8 lattice 晶格9 single crystal 单晶10 Fashion 方式11 vibration 振动12 unit cell 原胞13 cubic-crystal 立方晶体14 fcc 面心立方15 lattice constant 晶格常数16 Polonium 钋17 bcc 体心立方18 Miller indices 密勒指数19 sodium 钠20 tungsten 钨21 gallium phosphide 磷化镓22 Aluminum 铝23 copper 铜24 diamondlattice 金刚石点阵25 platinum 铂26 Sublattice 子格27 interpenetrate 互相贯通28 diagonal 对角式29 terahedron 四面体30 zincblende lattice 闪锌矿晶格31 zincsulfide 硫化锌32 anisotropic 各向异性33 crystal orientation 晶向34 interceot 截距35 reciprocal 倒数36 perpendicular垂直37 integer 完整38 Cartesian coordinate 笛卡尔坐标系1.3 Bohrˊs Atom Model 波尔原子模型1 nucleus 原子核2 discrete 分立3 engery level 能级4 electronvolt 电子伏5 wavelength 波长6 binding engery 结合能7 shell 壳8 force 力9 angular momentum 角动量10 photon 光子11 joule 焦耳12 excited state 激发态13 potential 电势14 MKS system米千克秒制15 kinetic energy 动能16 ground state 基态17 valence electron 价电子18 principal quantum number 主量子数1.4 V alence Bonds Model of Solid 固体材料价键模型1 current 电流2 resistivity 电阻率3 electric field 电场4 covalent bond 共价键5 nuclei 核6 metallic conductor 金属导体7 electrostatic 静电的8 deficiency 缺陷9 ionic bond 离子键10 hole 空穴11 vacancy 空位1.5 Energy Bonds Model of Solid 固体材料的能带模型1 gaseous 气态2 mass 质量3 plank constant 普朗克常量4 permittivity 介电常数5 bandgap频带间隙6 energy band 能带7 valence band 价带8 conduction band 导带9 band diagram 能带图10 at rest 静态11 discrete energy level 不连续能级离散能级12 quantum mechanics 量子力学13 doubly degenerate energy lever1.6 Free-Carrier Density in Semicondutor 半导体中的自由载流子的密度1 standing-wave 驻波2 wavelength 波长3 momentum 动量4 sphere 球面5 volume 体积6 electron spin 电子自旋7 agitation 振荡8 intrinsic 本征的9 allowed state 允态10 product 乘积11 integrate 集成12 Fermi level 费米能级13 function 函数14 concentration 浓度15 forbidden-gap 禁带16 unity 单元17 exponential 指数函数18 infinity 无穷大19 excitation 激发20 recombination 复合21 deviation 误差22 extrinsic 非本征的23 term 项24 mass-action law 质量守恒定律1.7Donors and Acceptors1 donor 施主2 accepter 受主3 dope 掺杂4 negative 负的5 positive 正的6 boron 硼7 ionization 电离第二章mobility [məu'biliti]迁移率drift [drift] 漂移diffusion [di'fju:ʒən] 扩散gradient ['greidiənt] 梯度generation [,dʒenə'reiʃən]Injection [in'dʒekʃən] 注入None-equilibrium 非平衡Excess carrier 过剩载流子Recombination 符合Lifetime 寿命Thermal equilibrium 热平衡particle ['pɑ:tikl] 粒子质点motion 运动Equipartition 均分Degree of freedom 自由度Three-dimensional ['θri:di'menʃənəl] 三维的kinetic energy 动能collision [kə'liʒən] 碰撞deflect [di'flekt] 偏转挠曲phonon ['fəunɔn] 声子mechanism ['mekənizəm] 机制,机理,操作机构coulomb force 库仑力displacement 位移,迁移mean free path 平均自由行程component [kəm'pəunənt] 子件,组件vacuum ['vækjuəm] 真空,负压proportionality [prəu,pɔ:ʃə'næliti] 比例性factor因素、因数subscript ['sʌbskript] 下标valley 谷最小值cross-sectional area 截面积conductivity [,kɔndʌk'tiviti] 电导率linearity [lini'ærəti] 线性度convection [kən'vekʃən] 对流stationary ['steiʃənəri] 固定的molecule ['mɔlikju:l] 分子spatial ['speiʃəl] 空间的half-width 半角Fick's first law:菲克(扩散)第一定理;菲克第一定律carrier injection 载子注入forward bias 正向偏压;前向偏移optical excitation 光激励electron hole pair 电子空穴对majority carrier 多数载流子injection level 注入水平order of magnitude 数量级low level injection 低水平注入low level injection 高水平注入dissipate 使消散,驱散;驱散;浪费;耗散radiative ['reidieitiv] 辐射的band to band带间direct-bandgap 直接带隙transient trænʃənt] 瞬态response 响应decay 衰减photoconductivity fəutəu,kɔndʌk'tiviti] 光电导性setup 装置pulse 脉冲propagation 传播传导generation 产生世代carrier scattering 载流子散射Chapter Three3.1Device 器件diode 二极管wafer 晶片Alloying 合金epitaxy 外延implantation 注入Substrate 沉底vacuum chamber 真空室furnace 熔炉Eutectic 共晶体dopant 掺杂剂VPE气象外延LPE 液相外延MBE 分子束外延slice 切片Solubility 溶解度range 范围incident ion 入射离子Anneal 退火oven 恒温炉metallurgical 冶金Clectrostatic 静电的dashed line 虚线homojunction 同质结Huterojunction 异质结3.2Electron affinity 电子亲和势work function 功函数reference 基准点Built-in 内建depletion region 耗尽区polarity 极性Quasi-neutral 准中性reverse bias 反偏tunneling current 漏电流3.3Numenclature 命名,命名法sterdy-state 稳态counterintuitive 违反直觉地Avalanche 雪崩interband 带间extrapolate 外推Quality factot 品质因子zener tunneling 齐纳隧道multiplication factor 倍增因子Impedance 阻抗differential 差分dimension 量纲维数Trap 陷阱rectangle 长方的,矩形Chapter FourBJT---双极结式晶体管Collector---集电极Saturation mode---饱和状态Cut off mode---截止状态Minority carrier---少数载流子Qualitatively---质量上Diode---二极管Injection efficiency---注入系数Tunneling---隧道(穿)Ionized acceptor---离子化受主Approximation---近似Barrier---势垒Simulation---仿真Lateral---横向Sheet resistance---表面电阻MOS---金属氧化半导体Gate---栅极Buried layer---势垒层Forward biased---正向偏压Nondegenerate---非简并Injection---注入Milliampere---毫安培Lifetime---寿命Terminal---终端Capacitance---电容Width---宽度Substitute---代替Uniform doping---均匀掺杂Horizontal axis---水平轴Intrinsic---本征的Slope---斜面,坡度,跨导Terminal---电极Transistor---晶体管Active mode---有源状态Reverse biased---反向偏压Assumption---假想,假设Recombination---复合Leakage current---漏电电流Diffusion length---扩散长度Quantitatively---数量上Breakdown---击穿Flux---通量Simplify---简化Doping profile---掺杂分布Normalization---正规化,标准化Extrinsic---非本征的Avalanche---电子雪崩Emitter---发射极Junction---结Common base configuration---共基极组态Common emitter configuration-共射极组态Degenerate---简并的Extract---提取Base contact---基极接点Micrometer---千分尺Principle---原理Steady-state---平衡状态Concentration---集中,浓度Denominator---分母Semilog---半对数的Extrapolation---外推法Lumped resistance---集中电阻Interdigitated structure---交互式结构Base---基极Well---井Boundary condition---边界条件Generation---产生,代Order of magnitude---数量级Current gain---电流增益Collection efficiency---收集效率Neutrality---中性Hyperbolic function---双曲函数Multiplication---乘Gradient---坡度,斜率Depletion layer---耗尽层Polarity---极性,偏极Chapt 5frequency 频率analog模拟digital数字transient瞬态的/过渡的uppercase大写字母lowercase小写字母load resistance负载电容supply voltage供给电压load line 负载电路equivalent circuit 等效电路differential 微分measure 测量reciprocal 交互的/倒数Transconductance跨导series resistance串联电阻Infinite无穷的shaded area 阴影区operating speed工作速度Response反应figure of merit品质因数Delay延时Parasitic寄生的Oscillation振动self-aligned自动对准ion implantation离子注入heat treatment热处理Polysilicon多晶硅Discontinuity中断Switch开关Pulse脉冲Waveform 波形charging time充电时间Parallel并联State状态Chapt 6dielectric constant电介质常数channel 沟道Macroscopic宏观的work function自由能Equilibrium平衡Substrate衬底Interface接触面Permittivity介电常数Thickness 厚度Electrode电极Accumulation积聚Dc直流电Ac交流电space charge空间电荷inversion layer反型层Source源Length长度Conductance 电导率Drain漏Subthreshold次于最低限度的Perpendiculat垂直的Threshold阈值Bulk体积surfacepotential表面势flat-band voltage平能带电压Symbol符号Longitudinal 纵向的Transverse横向的Expression表达式NFET n沟道场效应晶体管Derivation推论/起源Mobility迁移率Constant 常数Bias偏压enhancement-type增强型parallel plate并联板ground 地V ariable变量Modulation调制Scattering散射Collision碰撞kinetic energy动能mean free path 平均自由能mean free time 平均自由时间Parameter参数Integral积分Minimum最小的Maximum 最大的Evaluate赋值dangling bond悬空键electrostatic potential静电势。
《微电子专业外语》课件
总结词:理解句子结构详细描述:科技文献中长句和复杂句较多,需要学会分析句子结构,把握主要信息,理解文献含义。
总结词:注重逻辑关系详细描述:科技文献的逻辑关系较为严密,应注意把握句子之间的联系,理解作者的思路和观点。总结词:利用上下文推测词义详细描述:遇到生词时,可以根据上下文语境推测其含义,这有助于保持阅读的连贯性。
《微电子专业外语》PPT课件
延时符
Contents
目录
微电子专业外语概述微电子专业外语基础知识微电子专业外语阅读与翻译技巧微电子专业外语实践应用微电子专业外语常见问题与解答
延时符
微电子专业外语概述
技术交流
在微电子产业领域,掌握微电子专业外语有助于与国际同行进行技术交流与合作,共同推动产业发展。
通过学术数据库(如IEEE Xplore、ACM Digital Library等)订阅相关期刊和会议论文,定期获取最新的研究成果。
利用学术数据库的高级搜索功能,筛选出与微电子领域相关的文献,进行深入阅读和分析。
掌握专业外语是获取国际前沿科技文献的重要手段,有助于跟踪微电子领域最新研究成果。
参加国际学术会议是提升个人学术影响力和拓展国际合作的重要途径。
总结词
延时符
微电子专业外语常见问题与解答
阅读大量英文文献
经常阅读最新的微电子领域英文论文和行业报告,提高对专业词汇的熟悉度。
使用专业词典
遇到生词时,及时查阅专业词典,并记录下常用词汇。
注重语法和句型
理解并掌握常见的科技英语语法和句型,有助于准确理解文章含义。
阅读与思考结合
在阅读过程中,思考文章的结构、逻辑和观点,提高理解和分析能力。
光刻
Photolithography
微电子专业英语课件
Principles and Design of Integrated Circuits
Integrated Circuit (IC) Basics
An IC is a miniaturized electronic circuit consisting of transistors, resistors, capacitors, and other components integrated onto a single silicon chip.
of microelectronics.
02
To develop students' ability to read, write, and communicate effectively in English within the context of
microelectronics.
03
To prepare students for future careers in the global microelectronics industry, where English is the lingua
Coverage of analog and digital circuit design principles, including circuit analysis techniques and design methodologies.
Course content and structure
Students should be able to communicate effectively in English during oral presentations, seminars, and discussions related to microelectronics.
微电子专业英语课件
Cecil A. Lasch, Jr., a technician who worked at Fairchild, did most of the work on the diffusion furnace hardware.
译文:Cecil A. Lasch, Jr,仙童公司 的技术员,在扩散炉硬件上作出了大 量工作。
Chapter I History Unit 1
The First Transistor in Fairchild The first seven bench diffusion furnaces
used in the corner of Fairchild’s Palo Alto facility were very similar to furnaces used by Shockley Semiconductor.
wafers n. 晶圆
译文:手动把晶圆送入和退出石英管。晶 圆冷却通常在扩散管的阴凉区内进行,使 晶圆冷却到适合处理的温度。
The programmed heating and cooling was not used because of the difficulty in maintaining good temperature profiles.
vent n. 通风口, 开衩, 通风孔, 出口, 排放 exhaust n. 排气,排气装置
Supplementary Words:
exhaust valve 排气阀 exhaust algorithm 穷举算法
译文:通过扩散管排气孔上方的通风孔把 使用的气体通入到特定空间中。
There was no “clean room etiquette”, and the chain smoker Robert Noyce frequently smoked in the Fairchild manufacturing facility.
中北大学微电子专业英语3综述
• 热平衡状态下的能带图 由于没有净电流通过pn结,
所以Jn=Jp=0,而且费米能级相等。内建电场ξ被称作过 渡区。在空间电荷区,电场产生电子的漂移电流,该漂移 电流用于补偿由于浓度梯度引起的扩散电流。同理,对于 空穴的漂移电流和扩散电流,情况完全类似。结中的内建 电场改变了能带。因为我们参考的是真空能级,所以这一 观点维持不变。
The electron affinity(亲和力) χ,the ionzation potential (潜能,潜力) γ, and the energy gap Eg are indicated for each material. The subscript n indicates n type semiconductor while the subscript p indicates p-type semiconductor. Also shown is an additional parameter, the work function Φ. The work function is equal to the energy difference between the vacuum level and the Fermi level, Φ=Evac-Ef.
•
电子亲和力χ,电离势γ,能量差Eg表示各种材料的 特性。下标n表示n型半导体,下标p表示p型半导体。另 外还显示了一个参数,也就是功函数Φ。功函数等于真 空能级和费米能级的能量差。 Φ=Evac-Ef.
Upon contact between the two materials, because there are more quasi-free electrons on the n side than on the p side, electrons flow (diffuse) from the n-type semiconductor to the p-type semiconductor. As the electrons move toward file ptype region, they leave behind ionized donors (charged positively) that are locked into the crystal lattice. At the same time, holes flow from the p semiconductor to the n semiconductor, leaving behind negatively charged acceptors. This separation of charges sets up an electric field, as shown in Fig.3.3.
微电子专业英语
M. Sze and Kwok K. Ng Wiley
推荐采用合适的字典
“英汉科学技术词典”
清华大学外语系“英汉科学技术词典”编写组
编 国防工业出版社
“Longman Dictionary of Contemporary English”
朗文当代英语词典
外语教学与研究出版社
专业英语学习的三要素
专业词汇 基本语法关系 结合专业内容
1、专业词汇
特别注意行业内的普遍认可的名称。
Wafer;
Die;
Chip
晶片(晶圆);
裸片;
芯片
1、专业词汇
特别注意行业内的普遍认可的名称。
The majority of bipolar transistors used in ICs are of the n–p–n type because the higher mobility of minority carriers (electrons) in the base region results in higher speed performance than can be obtained with p–n–p types. 翻译1:IC中所用双极晶体管大多数是NPN型的,因为它在基区中少数载 体(电子)的更高移动性产生比PNP型所能得到的更高速度的性能。
提示:该句有5个谓语,分析从句关系有助于理解内容。 全局可翻译为:本节讨论具有下述特点的半导体存储器中 采用的物理效应:这种存储器在切断电源后仍然能保留业 已存储的数据,而且其中存储的数据可以被修改。
3、结合专业内容
Hence carriers move away from the junctions after injection by diffusion and the action of any fields built in by variable doping. 提示:如果根据其位置关系分析,可能认为“by diffusion and the action of any fields”是修饰直接位于其前面的 “injection”。但是基于物理含义分析,应该修饰“move”。 这是专业英语中经常出现的问题,即如果对物理含义不是 很清楚,在翻译时出现的错误不是语法问题,而是违背了 物理含义;“by variable doping”修饰其前面的“built in”。 全句可翻译为:因此,载流子在注入以后将通过扩散的方 式离开结,如果(基区)杂质分布不均匀还会受到自建电 场的作用。
微电子专业英语词汇
Abrupt junction 突变结[ə'brʌpt] 突然的;Accelerated testing 加速实验[ək'seləreitid] Acceptor 受主Acceptor atom 受主原子['ætəm] n. 原子Accumulation [ə,kju:mju'leiʃən]积累,堆积Accumulating contact(n. 接触,联系)积累接触Accumulation region['ri:dʒən]地区积累区Accumulation layer['leiə] 层积累层Active region 有源区['æktiv]积极的,有源的Active component [kəm'pəunənt]元件有源元Active device 有源器件Activation 激活Activation energy 激活能Active region 有源(放大)区Admittance [əd'mitəns]导纳Allowed band [bænd]带允带Alloy-junction device ['ælɒɪ]合金结器件Aluminum(Aluminium) [ə'lju:minəm]铝Aluminum – oxide ['ɔksaid]铝氧化物Aluminum passivation [pæsi'veiʃən]钝化铝钝化Ambipolar [,æmbi'pəulə]双极的Ambient temperature ['æmbiənt]环境温度Amorphous [ə'mɔ:fəs]无定形的,非晶体的Amplifier ['æmplifaiə]功放扩音器放大器Analogue(Analog) ['ænəlɔɡ] comparator ['kəmpəreitə]模拟比较器Angstrom['æŋstrəm]埃Anneal [ə'ni:l]退火Anisotropic [æn,aisəu'trɔpik]各向异性的Anode ['ænəud]阳极Arsenic ['ɑ:sənik (AS) 砷Auger ['ɔ:ɡə]俄歇Auger process 俄歇过程Avalanche ['ævəlɑ:ntʃ]雪崩Avalanche breakdown(击穿) 雪崩击穿Avalanche excitation [,eksi'teiʃən](激发)雪崩激发Background(背景,本底,基底) carrier 本底载流子Background doping 本底掺杂Backward ['bækwəd]反向Backward bias ['baiəs](偏置,)偏爱反向偏置Ballasting ['bæləst] resistor 整流电阻Ball bond [bɔnd](结合)球形键合Band 能带Band gap [ɡæp](间隙)能带间隙Barrier 势垒Barrier layer 势垒层Barrier ['bæriə] width 势垒宽度Base 基极Base contact 基区接触Base stretching 基区扩展效应Base transit(运输)time基区渡越时间Base transport efficiency [i'fiʃənsi](效率)基区输运系数Base-width modulation [,mɔdju'leiʃən(调制)基区宽度调制Basis vector ['vektə]矢量基矢Bias 偏置Bilateral [,bai'lætərəl] switch 双向开关Binary ['bainəri]code(代码)二进制代码Binary compound semiconductor二元化合物半导体Bipolar [bai'pəulə]双极性的Bipolar Junction Transistor (晶体管)(BJT)双极晶体管Bloch [blɔk]布洛赫Blocking ['blɔkiŋ](截止,阻塞)band 阻挡能带Blocking contact 阻挡接触Body(身体,主题)- centered(居中的)体心立方Body-centred cubic ['kju:bik]立方体structure ['strʌktʃə]结构体立心结构Boltzmann 波尔兹曼Bond 键、键合Bonding electron 价电子Bonding pad 键合点Bootstrap circuit ['sə:kit]电路自举电路Bootstrapped emitter [i'mitə]发射器follower(追随者)自举射极跟随器Boron ['bɔ:rɔn]硼Borosilicate [,bɔ:rəu'silikit]硼硅酸盐glass 硼硅玻璃Boundary condition条件,状况边界条件Bound electron 束缚电子Breadboard 模拟板、实验板Break down 击穿Break over 转折Brillouin 布里渊Brillouin zone 布里渊区Built-in 内建的Build-in electric field 内建电场Bulk [bʌlk]体/体内Bulk absorption 体吸收Bulk generation 体产生Bulk recombination [,ri:kɔmbi'neiʃən]体复合Burn - in 老化Burn out 烧毁Buried ['berid]埋葬的channel通道;频道;海峡埋沟Buried diffusion扩散region 隐埋扩散区Can 外壳Capacitance[kə'pæsɪt(ə)ns]电容Capture俘获cross section 俘获截面Capture carrier 俘获载流子Carrier 载流子、载波Carry bit 进位位Carry-in bit 进位输入Carry-out bit 进位输出Cascade [kæs'keid]级联,串联级联Case 管壳Cathode['kæθəud]阴极Center 中心Ceramic [si'ræmik]陶瓷(的)Channel['tʃænəl] (频道)沟道Channel breakdown 沟道击穿Channel current 沟道电流Channel doping 沟道掺杂Channel shortening 沟道缩短Channel width 沟道宽度Characteristic impedance[im'pi:dəns]特征阻抗Charge (控告)电荷,充电Charge-compensation[,kɔmpen'seiʃən](补偿) effects 电荷补偿效应Charge conservation(保存,保持) 电荷守恒Charge neutrality[njuː'trælɪtɪ](中性) condition电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching[njuː'trælɪtɪ]化学腐蚀法Chemically-Polish['pɒlɪʃ](磨光)化学抛光Chemmically-Mechanically [mɪ'kænɪkəlɪ](机械地)Polish (CMP) 化学机械抛光Chip 芯片Chip yield(产量)芯片成品率Clamped 箝位Clamping diode 箝位二极管Cleavage['kliːvɪdʒ] plane(平面)解理面Clock rate(比率)时钟频率Clock generator 时钟发生器Clock flip-flop(触发器)时钟触发器Close-packed structure(构造)密堆积结构Close-loop(环)gain(获利,增加)闭环增益Collector 集电极Collision[kə'lɪʒ(ə)n](冲突)碰撞Compensated(补偿)OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益Common-mode input 共模输入Common-mode rejection(抑制,拒绝)ratio (CMRR) 共模抑制比Compatibility[kəm,pætɪ'bɪlɪtɪ]兼容性Compensation 补偿Compensated impurities(杂质)补偿杂质Compensated semiconductor 补偿半导体Complementary(补足的)Darlington circuit(电路,回路)互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(晶体管)(CMOS) 互补金属氧化物半导体场效应晶体管Complementary error function(功能,函数)余误差函数Computer-aided【辅助的】design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试/制造Compound['kɒmpaʊnd] Semiconductor 化合物半导体Conductance[kən'dʌkt(ə)ns]电导Conduction(传导band (edge) 导带(底) Conduction level/state 导带态Conductor 导体Conductivity 电导率Configuration(配置)组态Conlomb['kuːlɒm]库仑Conpled Configuration Devices 结构组态Constants(常量,常数)物理常数Constant energy surface 等能面Constant-source diffusion(扩散,传播)恒定源扩散Contact(联系,接触)接触Contamination[kən,tæmɪ'neɪʃən]玷污Continuity[,kɒntɪ'njuːɪtɪ](连续性)equation(方程式,等式)连续性方程Contact hole孔接触孔Contact potential(潜能,潜在的)接触电势Continuity condition 连续性条件Contra['kɒntrə]相反doping 反掺杂Controlled 受控的Converter[kən'vɜːtə](converter转变,转换)转换器Conveyer[kən'veɚ]传输器Copper(铜)interconnection[,ɪntɚkə'nɛkʃən](互联)system 铜互连系统Couping 耦合Covalent[kəʊ'veɪl(ə)nt](共价的)共阶的Crossover 跨交Critical (批评的)临界的Crossunder 穿交Crucible['kruːsɪb(ə)l]坩埚Crystal defect缺陷/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density(密度)电流密度Curvature'kɜːvətʃə曲率Cut off 截止Current drift(漂移)/dirve/sharing电流漂移/驱动/共享Current Sense(感觉,检测)电流取样Curvature 弯曲Custom(风俗,习惯,定制的integrated circuit 定制集成电路Cylindrical 柱面的Czochralshicrystal 直立单晶crystal(晶体,单晶)Czochralski technique 切克劳斯基技术(Cz 法直拉晶体J)Dangling ['dæŋg(ə)lɪŋ;bonds 悬挂键Dark current 暗电流Dead time 空载时间Debye length 德拜长度De.broglie 德布洛意Decderate 减速Decibel ['desɪbel] (dB) 分贝Decode 译码Deep acceptor level 深受主能级Deep donor['dəʊnə(捐赠者level 深施主能级Deep impurity(杂质,不存,不洁)level 深度杂质能级Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体Degeneracy 简并度Degradation[,degrə'deɪʃ(ə)n]退化Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟Density 密度Density of states 态密度Depletion 耗尽Depletion approximation 耗尽近似Depletion contact 耗尽接触Depletion depth 耗尽深度Depletion effect 耗尽效应Depletion layer 耗尽层Depletion MOS 耗尽MOSDepletion region 耗尽区Deposited film(电影,薄膜) 淀积薄膜Deposition process 淀积工艺Design rules 设计规则Die 芯片(复数dice)Diode 二极管Dielectric 介电的Dielectric isolation(隔离。
课程名称:微电子学专业英语
课程名称:微电子学专业英语课程编号:1203011课程学分:2.0适用专业:微电子学专业微电子学专业英语(English for Microelectronics)教学大纲一、课程性质与任务:《微电子学专业英语》是微电子学专业的专业选修课,适用于微电子学专业、综合班工学物理方向的本科生。
该课程在主修大学英语、半导体器件物理、半导体物理以及电子技术等课程基础之上,系统地介绍微电子学专业的基础知识。
通过本课程的学习,使同学掌握半导体物理,半导体器件物理,集成电路等方面的专业词汇,了解某些专业词汇的特殊含义和汉译方法,由浅入深地提高阅读原版专业文献的速度及理解能力.二、课程内容及要求:本课程要求学生掌握足够的专业词汇量,具有一定的对科技英语的双向翻译能力,并且能够依靠自身的专业背景知识阅读和翻译具有一定难度和深度的技术文献.Chapter 1Semiconductors Physics1.1 Energy Bands and Carrier Concentration:Semiconductor Materials, crystal Structure, Valence Bonds, Energy Bands, Density of States, Donors and Acceptors1.2 Carrier Transport Phenomena:Carrier Drift, Carrier Diffusion, Carrier Injection, Generation and Recombination Processes1.3 The PN Junction:Methods of Making Junctions, The Junction in Equilibrium, The Junction Under Reverse Bias and Forward Bias, Metal-Semiconductor Contacts. Heterojunction.重点:能带,输运现象,PN结难点:能带的形成,异质结。
微电子专业外语
专业外语姓乞:IQC筒件挺lUl'd:•()- -I* UJ• Basic MOS Device Physicsflexibility of PFETs is exploited in some analogcircuits・ The circuit symbolsused to represent NMOS and PMOS transistors are shown inFig.2.5.♦:♦注意:flexibility, J exploited,use• flexibility f exploited/flexibility[英][ fleksi biliti][美][fl&ksd bileti]n.柔新性,机动性,灵活性exploit vt■开采;开拓;利用(……为自己谋利);剥削近义词advantage得益,获利• use/Jet used to强调的是由“不习惯”到“习惯”的个过程,而“be used to”所强调的只是“习惯了” 这个状态• Basic MOS Device Physics/^❖The symbols in Fig. 2.5(b) contain all four~ terminals, with the substrate denoted by n B n (bulk) rather than 0to avoid confusion with the source・♦:♦注意:avoid +n/-ing• Basic MOS Device Physicspositioned^ /^❖The source of the PMOS device ison top as a visual aid because it has ahigher potential than its gate.♦:♦注意:as a visual aid作为视觉辅助• Basic MOS Device Physics/ ❖Since in most circuits the bulk terminals of ** NMOS and PMOS devices are tied to ground and Vdd, respectively, we usually omit these connections in drawing Fig.2.5(a).V♦注意:omit; in drawing Figxx• omit/^mit是省略neglect是不经意的忽视而ignore是故意不理其他近义词skip, miss• Basic MOS Device Physics/❖In digital circuits, it is customary to use the “switch”symbols depicted in Fig. 2.5(c) for the two types, but weprefer those in Fig. 2.5(a) because the visual distinctionbetween D andS proves helpful in understanding the operation of circuits. 、[注意:prefer• p referU Prefer+名词或动名词“宁愿”,“更喜欢I prefer going by bike.我宁愿骑单车去。
微电子专业英语
Abrupt junction 突变结 Accelerated testing 加速实验Acceptor 受主 Acceptor atom 受主原子Accumulation 积累、堆积 Accumulating contact 积累接触Accumulation region 积累区 Accumulation layer 积累层Active region 有源区 Active component 有源元Active device 有源器件 Activation 激活Activation energy 激活能 Active region 有源(放大)区Admittance 导纳 Allowed band 允带Alloy-junction device合金结器件 Aluminum(Aluminium) 铝Aluminum – oxide 铝氧化物 Aluminum passivation 铝钝化Ambipolar 双极的 Ambient temperature 环境温度Amorphous 无定形的,非晶体的 Amplifier 功放扩音器放大器Analogue(Analog) comparator 模拟比较器 Angstrom 埃Anneal 退火 Anisotropic 各向异性的Anode 阳极 Arsenic (AS) 砷Auger 俄歇 Auger process 俄歇过程Avalanche 雪崩 Avalanche breakdown 雪崩击穿Avalanche excitation雪崩激发Background carrier 本底载流子 Background doping 本底掺杂Backward 反向 Backward bias 反向偏置Ballasting resistor 整流电阻 Ball bond 球形键合Band 能带 Band gap 能带间隙Barrier 势垒 Barrier layer 势垒层Barrier width 势垒宽度 Base 基极Base contact 基区接触 Base stretching 基区扩展效应Base transit time 基区渡越时间 Base transport efficiency基区输运系数Base-width modulation基区宽度调制 Basis vector 基矢Bias 偏置 Bilateral switch 双向开关Binary code 二进制代码Binary compound semiconductor 二元化合物半导体Bipolar 双极性的 Bipolar Junction Transistor (BJT)双极晶体管Bloch 布洛赫 Blocking band 阻挡能带Blocking contact 阻挡接触 Body - centered 体心立方Body-centred cubic structure 体立心结构 Boltzmann 波尔兹曼Bond 键、键合 Bonding electron 价电子Bonding pad 键合点 Bootstrap circuit 自举电路Bootstrapped emitter follower 自举射极跟随器Boron 硼Borosilicate glass 硼硅玻璃 Boundary condition 边界条件Bound electron 束缚电子 Breadboard 模拟板、实验板Break down 击穿 Break over 转折Brillouin 布里渊 Brillouin zone 布里渊区Built-in 内建的 Build-in electric field 内建电场Bulk 体/体内 Bulk absorption 体吸收Bulk generation 体产生 Bulk recombination 体复合Burn - in 老化 Burn out 烧毁Buried channel 埋沟 Buried diffusion region 隐埋扩散区Can 外壳 Capacitance 电容Capture cross section 俘获截面 Capture carrier 俘获载流子Carrier 载流子、载波 Carry bit 进位位Carry-in bit 进位输入 Carry-out bit 进位输出Cascade 级联 Case 管壳Cathode 阴极 Center 中心Ceramic 陶瓷(的) Channel 沟道Channel breakdown 沟道击穿 Channel current 沟道电流Channel doping 沟道掺杂 Channel shortening 沟道缩短Channel width 沟道宽度 Characteristic impedance 特征阻抗Charge 电荷、充电 Charge-compensation effects 电荷补偿效应Charge conservation 电荷守恒 Charge neutrality condition 电中性条件Charge drive/exchange/sharing/transfer/storage 电荷驱动/交换/共享/转移/存储Chemmical etching 化学腐蚀法 Chemically-Polish 化学抛光Chemmically-Mechanically Polish (CMP) 化学机械抛光 Chip 芯片Chip yield 芯片成品率 Clamped 箝位Clamping diode 箝位二极管 Cleavage plane 解理面Clock rate 时钟频率 Clock generator 时钟发生器Clock flip-flop 时钟触发器 Close-packed structure 密堆积结构Close-loop gain 闭环增益 Collector 集电极Collision 碰撞 Compensated OP-AMP 补偿运放Common-base/collector/emitter connection 共基极/集电极/发射极连接Common-gate/drain/source connection 共栅/漏/源连接Common-mode gain 共模增益 Common-mode input 共模输入Common-mode rejection ratio (CMRR) 共模抑制比Compatibility 兼容性 Compensation 补偿Compensated impurities 补偿杂质 Compensated semiconductor 补偿半导体Complementary Darlington circuit 互补达林顿电路Complementary Metal-Oxide-Semiconductor Field-Effect-Transistor(CMOS)互补金属氧化物半导体场效应晶体管Complementary error function 余误差函数Computer-aided design (CAD)/test(CAT)/manufacture(CAM) 计算机辅助设计/ 测试 /制造Compound Semiconductor 化合物半导体 Conductance 电导Conduction band (edge) 导带(底) Conduction level/state 导带态Conductor 导体 Conductivity 电导率Configuration 组态 Conlomb 库仑Conpled Configuration Devices 结构组态 Constants 物理常数Constant energy surface 等能面 Constant-source diffusion恒定源扩散Contact 接触 Contamination 治污Continuity equation 连续性方程 Contact hole 接触孔Contact potential 接触电势 Continuity condition 连续性条件Contra doping 反掺杂 Controlled 受控的Converter 转换器 Conveyer 传输器Copper interconnection system 铜互连系统Couping 耦合Covalent 共阶的 Crossover 跨交Critical 临界的 Crossunder 穿交Crucible坩埚 Crystal defect/face/orientation/lattice 晶体缺陷/晶面/晶向/晶格Current density 电流密度 Curvature 曲率Cut off 截止 Current drift/dirve/sharing 电流漂移/驱动/共享Current Sense 电流取样 Curvature 弯曲Custom integrated circuit 定制集成电路 Cylindrical 柱面的Czochralshicrystal 直立单晶Czochralski technique 切克劳斯基技术(Cz法直拉晶体J)Dangling bonds 悬挂键 Dark current 暗电流Dead time 空载时间 Debye length 德拜长度De.broglie 德布洛意 Decderate 减速Decibel (dB) 分贝 Decode 译码Deep acceptor level 深受主能级 Deep donor level 深施主能级Deep impurity level 深度杂质能级 Deep trap 深陷阱Defeat 缺陷Degenerate semiconductor 简并半导体 Degeneracy 简并度Degradation 退化 Degree Celsius(centigrade) /Kelvin 摄氏/开氏温度Delay 延迟 Density 密度Density of states 态密度 Depletion 耗尽Depletion approximation 耗尽近似 Depletion contact 耗尽接触Depletion depth 耗尽深度 Depletion effect 耗尽效应Depletion layer 耗尽层 Depletion MOS 耗尽MOS Depletion region 耗尽区 Deposited film 淀积薄膜Deposition process 淀积工艺 Design rules 设计规则Die 芯片(复数dice) Diode 二极管Dielectric 介电的 Dielectric isolation 介质隔离Difference-mode input 差模输入 Differential amplifier 差分放大器Differential capacitance 微分电容 Diffused junction 扩散结Diffusion 扩散 Diffusion coefficient 扩散系数Diffusion constant 扩散常数 Diffusivity 扩散率Diffusion capacitance/barrier/current/furnace 扩散电容/势垒/电流/炉Digital circuit 数字电路 Dipole domain 偶极畴Dipole layer 偶极层 Direct-coupling 直接耦合Direct-gap semiconductor 直接带隙半导体 Direct transition 直接跃迁Discharge 放电 Discrete component 分立元件Dissipation 耗散 Distribution 分布Distributed capacitance 分布电容 Distributed model 分布模型Displacement 位移 Dislocation 位错Domain 畴 Donor 施主Donor exhaustion 施主耗尽 Dopant 掺杂剂Doped semiconductor 掺杂半导体 Doping concentration 掺杂浓度Double-diffusive MOS(DMOS)双扩散MOS.Drift 漂移 Drift field 漂移电场Drift mobility 迁移率 Dry etching 干法腐蚀Dry/wet oxidation 干/湿法氧化 Dose 剂量Duty cycle 工作周期 Dual-in-line package (DIP)双列直插式封装Dynamics 动态 Dynamic characteristics 动态属性Dynamic impedance 动态阻抗Early effect 厄利效应 Early failure 早期失效Effective mass 有效质量 Einstein relation(ship) 爱因斯坦关系Electric Erase Programmable Read Only Memory(E2PROM) 一次性电可擦除只读存储器Electrode 电极 Electrominggratim 电迁移Electron affinity 电子亲和势 Electronic -grade 电子能Electron-beam photo-resist exposure 光致抗蚀剂的电子束曝光Electron gas 电子气 Electron-grade water 电子级纯水Electron trapping center 电子俘获中心 Electron Volt (eV) 电子伏Electrostatic 静电的 Element 元素/元件/配件Elemental semiconductor 元素半导体 Ellipse 椭圆Ellipsoid 椭球 Emitter 发射极Emitter-coupled logic 发射极耦合逻辑Emitter-coupled pair 发射极耦合对Emitter follower 射随器 Empty band 空带Emitter crowding effect 发射极集边(拥挤)效应Endurance test =life test 寿命测试 Energy state 能态Energy momentum diagram 能量-动量(E-K)图 Enhancement mode 增强型模式Enhancement MOS 增强性MOS Entefic (低)共溶的Environmental test 环境测试 Epitaxial 外延的Epitaxial layer 外延层 Epitaxial slice 外延片Expitaxy 外延 Equivalent curcuit 等效电路Equilibrium majority /minority carriers 平衡多数/少数载流子Erasable Programmable ROM (EPROM)可搽取(编程)存储器Error function complement 余误差函数Etch 刻蚀 Etchant 刻蚀剂Etching mask 抗蚀剂掩模 Excess carrier 过剩载流子Excitation energy 激发能 Excited state 激发态Exciton 激子 Extrapolation 外推法Extrinsic 非本征的 Extrinsic semiconductor 杂质半导体Face - centered 面心立方 Fall time 下降时间Fan-in 扇入 Fan-out 扇出Fast recovery 快恢复 Fast surface states 快界面态Feedback 反馈 Fermi level 费米能级Fermi-Dirac Distribution 费米-狄拉克分布 Femi potential 费米势Fick equation 菲克方程(扩散) Field effect transistor 场效应晶体管Field oxide 场氧化层 Filled band 满带Film 薄膜 Flash memory 闪烁存储器Flat band 平带 Flat pack 扁平封装Flicker noise 闪烁(变)噪声 Flip-flop toggle 触发器翻转Floating gate 浮栅 Fluoride etch 氟化氢刻蚀Forbidden band 禁带 Forward bias 正向偏置Forward blocking /conducting正向阻断/导通Frequency deviation noise频率漂移噪声Frequency response 频率响应 Function 函数Gain 增益 Gallium-Arsenide(GaAs) 砷化钾Gamy ray r 射线 Gate 门、栅、控制极Gate oxide 栅氧化层 Gauss(ian)高斯Gaussian distribution profile 高斯掺杂分布Generation-recombination 产生-复合Geometries 几何尺寸 Germanium(Ge) 锗Graded 缓变的 Graded (gradual) channel 缓变沟道Graded junction 缓变结 Grain 晶粒Gradient 梯度 Grown junction 生长结Guard ring 保护环 Gummel-Poom model 葛谋-潘模型Gunn - effect 狄氏效应Hardened device 辐射加固器件 Heat of formation 形成热Heat sink 散热器、热沉 Heavy/light hole band 重/轻空穴带Heavy saturation 重掺杂 Hell - effect 霍尔效应Heterojunction 异质结 Heterojunction structure 异质结结构Heterojunction Bipolar Transistor(HBT)异质结双极型晶体High field property 高场特性High-performance MOS.( H-MOS)高性能MOS. Hormalized 归一化Horizontal epitaxial reactor 卧式外延反应器 Hot carrior 热载流子Hybrid integration 混合集成Image - force 镜象力 Impact ionization 碰撞电离Impedance 阻抗 Imperfect structure 不完整结构Implantation dose 注入剂量 Implanted ion 注入离子Impurity 杂质 Impurity scattering 杂志散射Incremental resistance 电阻增量(微分电阻)In-contact mask 接触式掩模Indium tin oxide (ITO) 铟锡氧化物 Induced channel 感应沟道Infrared 红外的 Injection 注入Input offset voltage 输入失调电压 Insulator 绝缘体Insulated Gate FET(IGFET)绝缘栅FET Integrated injection logic集成注入逻辑Integration 集成、积分 Interconnection 互连Interconnection time delay 互连延时 Interdigitated structure 交互式结构Interface 界面 Interference 干涉International system of unions国际单位制 Internally scattering 谷间散射Interpolation 内插法 Intrinsic 本征的Intrinsic semiconductor 本征半导体 Inverse operation 反向工作Inversion 反型 Inverter 倒相器Ion 离子 Ion beam 离子束Ion etching 离子刻蚀 Ion implantation 离子注入Ionization 电离 Ionization energy 电离能Irradiation 辐照 Isolation land 隔离岛Isotropic 各向同性Junction FET(JFET) 结型场效应管 Junction isolation 结隔离Junction spacing 结间距 Junction side-wall 结侧壁Latch up 闭锁 Lateral 横向的Lattice 晶格 Layout 版图Lattice binding/cell/constant/defect/distortion 晶格结合力/晶胞/晶格/晶格常熟/晶格缺陷/晶格畸变Leakage current (泄)漏电流 Level shifting 电平移动Life time 寿命 linearity 线性度Linked bond 共价键 Liquid Nitrogen 液氮Liquid-phase epitaxial growth technique 液相外延生长技术Lithography 光刻 Light Emitting Diode(LED) 发光二极管Load line or Variable 负载线 Locating and Wiring 布局布线Longitudinal 纵向的 Logic swing 逻辑摆幅Lorentz 洛沦兹 Lumped model 集总模型Majority carrier 多数载流子 Mask 掩膜板,光刻板Mask level 掩模序号 Mask set 掩模组Mass - action law质量守恒定律 Master-slave D flip-flop主从D触发器Matching 匹配 Maxwell 麦克斯韦Mean free path 平均自由程 Meandered emitter junction梳状发射极结Mean time before failure (MTBF) 平均工作时间Megeto - resistance 磁阻 Mesa 台面MESFET-Metal Semiconductor金属半导体FETMetallization 金属化 Microelectronic technique 微电子技术Microelectronics 微电子学 Millen indices 密勒指数Minority carrier 少数载流子 Misfit 失配Mismatching 失配 Mobile ions 可动离子Mobility 迁移率 Module 模块Modulate 调制 Molecular crystal分子晶体Monolithic IC 单片IC MOSFET金属氧化物半导体场效应晶体管Mos. Transistor(MOST )MOS. 晶体管 Multiplication 倍增Modulator 调制 Multi-chip IC 多芯片ICMulti-chip module(MCM) 多芯片模块 Multiplication coefficient倍增因子Naked chip 未封装的芯片(裸片) Negative feedback 负反馈Negative resistance 负阻 Nesting 套刻Negative-temperature-coefficient 负温度系数 Noise margin 噪声容限Nonequilibrium 非平衡 Nonrolatile 非挥发(易失)性Normally off/on 常闭/开 Numerical analysis 数值分析Occupied band 满带 Officienay 功率Offset 偏移、失调 On standby 待命状态Ohmic contact 欧姆接触 Open circuit 开路Operating point 工作点 Operating bias 工作偏置Operational amplifier (OPAMP)运算放大器Optical photon =photon 光子 Optical quenching光猝灭Optical transition 光跃迁 Optical-coupled isolator光耦合隔离器Organic semiconductor有机半导体 Orientation 晶向、定向Outline 外形 Out-of-contact mask非接触式掩模Output characteristic 输出特性 Output voltage swing 输出电压摆幅Overcompensation 过补偿 Over-current protection 过流保护Over shoot 过冲 Over-voltage protection 过压保护Overlap 交迭 Overload 过载Oscillator 振荡器 Oxide 氧化物Oxidation 氧化 Oxide passivation 氧化层钝化Package 封装 Pad 压焊点Parameter 参数 Parasitic effect 寄生效应Parasitic oscillation 寄生振荡 Passination 钝化Passive component 无源元件 Passive device 无源器件Passive surface 钝化界面 Parasitic transistor 寄生晶体管Peak-point voltage 峰点电压 Peak voltage 峰值电压Permanent-storage circuit 永久存储电路 Period 周期Periodic table 周期表 Permeable - base 可渗透基区Phase-lock loop 锁相环 Phase drift 相移Phonon spectra 声子谱Photo conduction 光电导 Photo diode 光电二极管Photoelectric cell 光电池Photoelectric effect 光电效应Photoenic devices 光子器件 Photolithographic process 光刻工艺(photo) resist (光敏)抗腐蚀剂 Pin 管脚Pinch off 夹断 Pinning of Fermi level 费米能级的钉扎(效应)Planar process 平面工艺 Planar transistor 平面晶体管Plasma 等离子体 Plezoelectric effect 压电效应Poisson equation 泊松方程 Point contact 点接触Polarity 极性 Polycrystal 多晶Polymer semiconductor聚合物半导体 Poly-silicon 多晶硅Potential (电)势 Potential barrier 势垒Potential well 势阱 Power dissipation 功耗Power transistor 功率晶体管 Preamplifier 前置放大器Primary flat 主平面 Principal axes 主轴Print-circuit board(PCB) 印制电路板 Probability 几率Probe 探针 Process 工艺Propagation delay 传输延时 Pseudopotential method 膺势发Punch through 穿通 Pulse triggering/modulating 脉冲触发/调制PulseWiden Modulator(PWM) 脉冲宽度调制Punchthrough 穿通 Push-pull stage 推挽级Quality factor 品质因子 Quantization 量子化Quantum 量子 Quantum efficiency量子效应Quantum mechanics 量子力学 Quasi – Fermi-level准费米能级Quartz 石英Radiation conductivity 辐射电导率 Radiation damage 辐射损伤Radiation flux density 辐射通量密度 Radiation hardening 辐射加固Radiation protection 辐射保护 Radiative - recombination辐照复合Radioactive 放射性 Reach through 穿通Reactive sputtering source 反应溅射源 Read diode 里德二极管Recombination 复合 Recovery diode 恢复二极管Reciprocal lattice 倒核子 Recovery time 恢复时间Rectifier 整流器(管) Rectifying contact 整流接触Reference 基准点基准参考点 Refractive index 折射率Register 寄存器 Registration 对准Regulate 控制调整 Relaxation lifetime 驰豫时间Reliability 可靠性 Resonance 谐振Resistance 电阻 Resistor 电阻器Resistivity 电阻率 Regulator 稳压管(器)Relaxation 驰豫 Resonant frequency共射频率Response time 响应时间 Reverse 反向的Reverse bias 反向偏置Sampling circuit 取样电路 Sapphire 蓝宝石(Al2O3)Satellite valley 卫星谷 Saturated current range电流饱和区Saturation region 饱和区 Saturation 饱和的Scaled down 按比例缩小 Scattering 散射Schockley diode 肖克莱二极管 Schottky 肖特基Schottky barrier 肖特基势垒 Schottky contact 肖特基接触Schrodingen 薛定厄 Scribing grid 划片格Secondary flat 次平面Seed crystal 籽晶 Segregation 分凝Selectivity 选择性 Self aligned 自对准的Self diffusion 自扩散 Semiconductor 半导体Semiconductor-controlled rectifier 可控硅 Sendsitivity 灵敏度Serial 串行/串联 Series inductance 串联电感Settle time 建立时间 Sheet resistance 薄层电阻Shield 屏蔽 Short circuit 短路Shot noise 散粒噪声 Shunt 分流Sidewall capacitance 边墙电容 Signal 信号Silica glass 石英玻璃 Silicon 硅Silicon carbide 碳化硅 Silicon dioxide (SiO2) 二氧化硅Silicon Nitride(Si3N4) 氮化硅 Silicon On Insulator 绝缘硅Siliver whiskers 银须 Simple cubic 简立方Single crystal 单晶 Sink 沉Skin effect 趋肤效应 Snap time 急变时间Sneak path 潜行通路 Sulethreshold 亚阈的Solar battery/cell 太阳能电池 Solid circuit 固体电路Solid Solubility 固溶度 Sonband 子带Source 源极 Source follower 源随器Space charge 空间电荷 Specific heat(PT) 热Speed-power product 速度功耗乘积 Spherical 球面的Spin 自旋 Split 分裂Spontaneous emission 自发发射 Spreading resistance扩展电阻Sputter 溅射 Stacking fault 层错Static characteristic 静态特性 Stimulated emission 受激发射Stimulated recombination 受激复合 Storage time 存储时间Stress 应力 Straggle 偏差Sublimation 升华 Substrate 衬底Substitutional 替位式的 Superlattice 超晶格Supply 电源 Surface 表面Surge capacity 浪涌能力 Subscript 下标Switching time 开关时间 Switch 开关Tailing 扩展 Terminal 终端Tensor 张量 Tensorial 张量的Thermal activation 热激发 Thermal conductivity 热导率Thermal equilibrium 热平衡 Thermal Oxidation 热氧化Thermal resistance 热阻 Thermal sink 热沉Thermal velocity 热运动 Thermoelectricpovoer 温差电动势率Thick-film technique 厚膜技术 Thin-film hybrid IC薄膜混合集成电路Thin-Film Transistor(TFT) 薄膜晶体 Threshlod 阈值Thyistor 晶闸管 Transconductance 跨导Transfer characteristic 转移特性 Transfer electron 转移电子Transfer function 传输函数 Transient 瞬态的Transistor aging(stress) 晶体管老化 Transit time 渡越时间Transition 跃迁 Transition-metal silica 过度金属硅化物Transition probability 跃迁几率 Transition region 过渡区Transport 输运 Transverse 横向的Trap 陷阱 Trapping 俘获Trapped charge 陷阱电荷 Triangle generator 三角波发生器Triboelectricity 摩擦电 Trigger 触发Trim 调配调整 Triple diffusion 三重扩散Truth table 真值表 Tolerahce 容差Tunnel(ing) 隧道(穿) Tunnel current 隧道电流Turn over 转折 Turn - off time 关断时间Ultraviolet 紫外的 Unijunction 单结的Unipolar 单极的 Unit cell 原(元)胞Unity-gain frequency 单位增益频率 Unilateral-switch单向开关Vacancy 空位 Vacuum 真空Valence(value) band 价带 Value band edge 价带顶Valence bond 价键 Vapour phase 汽相Varactor 变容管 Varistor 变阻器Vibration 振动 Voltage 电压Wafer 晶片 Wave equation 波动方程Wave guide 波导 Wave number 波数Wave-particle duality 波粒二相性 Wear-out 烧毁Wire routing 布线 Work function 功函数Worst-case device 最坏情况器件Yield 成品率Zener breakdown 齐纳击穿Zone melting 区熔法。
微电子专业外语1
Scales n. 天平;磅秤;鳞屑;缩放
Design of Analog COMS Integrated Circuit • Basic MOS Device Physics
Since the designer must often decide which effects can be neglected in a given circuit, insight into device operation proves invaluable. 注意given, insight, invaluable
Design of Analog COMS Integrated Circuit • Basic MOS Device Physics
Experience shows that neither approach is optimum. In the first case, the reader cannot see the relevance of all of the physics to designing circuits, and in the second, he/she is constantly mystified by the contents of the black box. 注意neither , In the first case , relevance
Design of Analog COMS Integrated Circuit • Basic MOS Device Physics
(1) begin with quantum mechanics and understand solid-state physics, semiconductor device physics, device modeling, and finally the design of circuits; begin with… and finally …
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24sample with uniform donor concentration in thermal equilibrium在热平衡均匀的施主浓度的样品essentially particle基本粒子particular特别的lattice格donor site供体位点crystal晶体incorporated结合thermal motion热运动in the effective mass of在有效质量the influence of crystal lattices is incorporated如果考虑晶体的影响theorem定理constant恒定的boltzmann玻尔兹曼three-dimensional三维kinetic energy动能average thermal velocity平均热运动速度visualize可视化a succession of random scattering from collisions with lattice atoms一系列的晶格原子的碰撞散射scattering centers散射中心the effect of the periodic field established by the lattice atoms has been taken into account by the effective mass由晶格原子建立周期场的影响已被有效质量的考虑the lattice atoms do not deflect the conduction electrons晶格原子不偏离传导电子do not account for the deviation of the atoms from their periodic position不考虑从周期性位置原子的偏差deviation偏差scatter散射deflect偏转the thermal vibrations may be treated quantum-mechanically as discrete particle called phonons, and the collision of phonons with elections and holes is called lattice or phonon scattering热振动可以被视为量子力学的离散粒子称为声子,声子与电子和空穴的碰撞叫做格或声子散射periodic positions周期性位置vibration振动it dominates other scattering processes at and above room temperature in lightly doped silicon它支配着其他散射过程和高于室温的温度在轻掺杂硅most semiconductor devices are operated in this temperature range大多数半导体器件在该温度范围内运行的scattering mechanisms散射机制atom原子the ionized impurity atoms are charged centers that may deflect the free carriers电离杂质原子的电荷的中心,可能偏转自由载流子neutral impurity atoms may introduce scattering中性杂质原子可能引入散射when the free carriers are influenced by the atomic core and orbiting electrons ually, the effect of this scattering当自由载流子的原子核和电子轨道ually影响,这种散射的影响是可以忽略不计coulomb force库仑力carrier densities载流子密度the random motion of electrons leads to a zero net displacement of an electron over a sufficiently long period of time电子的随机运动导致一零的电子净位移在一个足够长的时间a displacement of一个位移sufficiently足够的the mean free path平均自由路径dominate占主导地位will be accelerated along the field将加速沿场an additional velocity component will be superimposed upon the thermal motion of electrons一个额外的速度分量将被叠加在电子的热运动component组件superimposed叠加applied field应用领域thus,current flow is induced induction 感应因此,电流是感应的unlike electrons moving in a vacuum, electrons in a semiconductor under an extermal field do not achieve constant acceleration不同的运动在真空电子,外部电场下半导体电子不实现恒定的加速度the carriers are accelerated by the field and then decelerated by collisions载流子的加速和减速的那场碰撞the drift velocity is a function of the applied field,漂移速度所施加的电场的函数,the magnitude of the velocity can be derived by using the following simple model速度的大小可以通过使用下面的简单模型得出can be derived可以得出by equating the momentum通过等同的动量free flight自由飞行the momentum gained by the electron in the same period通过在同一时期,电子获得动量the equality is valid平等是有效的steady state稳定状态is proportional to是成比例的electron mobility电子迁移率a similar expression can be written for holes in the valence band 一个类似的表达可以在价带空穴写drift漂移negative sign负号的in preceding section在前面的部分thermal vibrations热振动these vibrations disturb lattice periodic potential这些振动干扰晶格周期势lattice scattering becomes dominant at high temperature在高温下的晶格散射成为主导hence the electrons mobility decrease with increasing tempurature 因此,电子迁移率随温度的降低demonstrate证明most pronounced最明显fixed charged ions固定电荷离子curve曲线contribution的贡献mechanisms机制bottleneck瓶颈the subscripts denote the lattice and impurity scattering,respectively下标表示格和杂质散射,分别concentration浓度the insert shows the theoretical temperature dependence of mobility due to both lattice and impurity scatterings插入表明理论迁移率的温度依赖性的由于晶格和杂质散射enhanced impurity scattering增强的杂质散射this corresponds to the lattice-scattering limitation这对应于晶格缺陷note also that也请注意valid有效的velocity速度will be lost through将失去the emission of optical phonons光学声子的发射i.e.,generating a lattice vibration of optical mode即,产生光学晶格振动模式mode model模式模型the field-dependent drift velocity in silicon are plotted in fig.2.4在硅中的场依赖的漂移速度绘制在图2.4which can be approximated by the empirical expression它可以由经验公式近似critical field临界磁场the most striking feature of this curve这条曲线的最显着的特征two separate valleys in the conduction band导带中的两个单独的山谷electrons reside in the low vally where electron motion is slow电子驻留在低谷电子的运动是缓慢的the decrease in velocity with increasing electric field随着电场的速度下降gives rise to a differential negative mobility提出了一个微分/差别的负迁移since a positive resistance consumes power and a negative resistance supplies power,a negative differential mobility may generate ac power,i.e.,oscillation in the microwave regime由于正电阻消耗功率与负电阻提供电源,负微分迁移率可能产生的交流电源,即,在微波体系的振荡this is known as the Gunn effect and is the basis of operation of the Gunn or transfer-electron oscillator这就是众所周知的狄氏效应是对狄或转移电子振荡器运行的基础applied field应用领域produce生产current电流the current flow in the semiconductor bar have n electrons per unit volume在半导体的酒吧电流有N个电子的每单位体积magnitude of electronic charge电子电荷量的大小the cross-sectional area横截面积voltage-to-current ratio电压电流比in addition Eq.(2.10)has been employed此外,方程(2.10)已被使用the resistivity of a semiconductor is an important parameter in device design半导体的电阻率在设备设计的重要参数the deviation from linearity in these curves从这些曲线的线性度偏差is caused by the nonlinear mobility effect由非线性流动的影响the propagation of flower fragrance or the tinting of cup of hot water by adding a tea bag花香或调色杯热水加一袋茶的传播propagation传播air convection or water motion could give rise to our sense 对流的空气或水的运动可以引起我们的感觉give rise to引起perfectly stationary air or water can produce the same effect完全静止的空气或水可以产生相同的效果chemical molecules化学分子a spatial variation of carrier concentration载流子浓度的空间变化current component电流分量is not disturbed不打扰color pigments彩色颜料collisions碰撞ink droplet墨滴tiny微小的schematically示意图the migration of molecules分子的迁移half-width半宽度migrate迁移be permeated with red ink to become uniform light red liquid 洋溢着红墨水成为均匀的淡红色液体concentration gradient浓度梯度have a net tendency有一个净趋势particle diffusion粒子扩散macroscopically宏观的the density of the color pigments is the same throughout颜色的颜料的密度是相同的so that the diffusion stops因而扩散停止distribution分布give rise to引起the diffusion flux obeys Fick's first law扩散通量服从Fick第一定律gradient梯度the total electron and hole currents电流的总的电子和空穴are obtained by adding the drift and diffusion component通过添加扩散和漂移分量these equations will be used throughout the text to characterize semiconductor devices 这些方程将整个文本,用来表征半导体器件that varies in the x derection在x方向的变化finite temperature有限温度a mean free path一个平均自由路径move across the plane在平面上移动is proportional to是成比例的spatial derivative of the electron density的电子密度的空间导数carrier injection载流子注入carrier injection载流子注入in thermal equilibrium the relationship pn=ni2 is valid在热平衡关系的PN = Ni2是有效的excess carriers过剩载流子be introduced to被引入none-equilibrium不平衡optical excitation and forward biasing a p-n junction光激发和正向偏置的p-n结optical光学的;视觉的in case of万一,如果发生Photon phonon光子声子an electron-hole pair is generated产生电子空穴对the magnitude of the excess carrier concentration relative to the majority carrier concentration determines the injection level相对于多数载流子浓度,过剩载流子浓度的大小确定注入级/注入水平relative to相对于Denote表示be seven orders of magnitude是7个数量级Negligibly可以忽略不计the percentage change is only 0.1%变化率只有0.1%is reffer to as low-level injection是指为低级别的注射excess carriers过剩载流子overwhelm压倒be comparable to可比in the figure在图because of the complexities involved in its treatment,we shall be concerned mainly with low-level injection因为涉及的处理的复杂性,我们将主要关注低级别的注射high-level injection is sometime encountered in device operations高层次的注射是在设备操作的时候遇到了generation and recombination process代重组过程(产生与复合过程)restores equilibrium恢复平衡depending on the nature of the recombination process根据复合过程的本质the nature of本质the released energy that results from the recombination process can be emitted as a photon or dissipated as heat to the lattice释放的能量,来自复合过程,可以以一个光子形式发射或以热量形式散失到晶格radiative recombination辐射复合indirect recombination via bandgap recombination centers dominates in indirect bandgap semiconductors通过复合中心的间接复合带隙在间接带隙半导体占主导地位dominate占主导地位the continuous thermal vibration of lattice atoms cause some bonds between neighboring atoms to be broken晶格原子连续的热振动引起相邻原子之间的键被打破valance band价带a valence electron to make an upward transition to一个价电子向上跃迁到reverse process逆过程it is represented by the rate R它是由速率R代表maintained保持they are lined up and no additional crystal momentum is required他们一字排开,没有额外的晶体动量是必需的lifetime of the excess carriers can best be illustrated by the transient response of a device after the sudden removal of the light source过剩载流子的寿命最好被解释为一个器件对光源突然移去后的跃迁响应Throughout始终,贯穿,在…期间,在所有方面decay exponentially指数衰减correspond to对应的show a schematic setup显示一个示意图设置The decay of the conductivity can be observed on a oscilloscope导电性的衰减可以在示波器观察Characteristics of diodes二极管的特性be referred to被称为two-terminal device二端设备the techniques of alloying,epitaxy,diffusion ,and ion implantation have reported in some references to produce the pn junction机械合金化,外延,扩散和离子注入技术在一些参考文献中报道的,产生的pn结wafer晶片a thin aluminum film is evaporated onto a clean n-type silicon wafer,called a substrate,inside a vacuum chamber铝薄膜蒸发到一个干净的n型硅晶片,称为一基板,在一个真空室in a furnace set at about 600℃在炉中Al and Si constitute a eutectic system构成共晶系统form a recrystallized layer形成重结晶层a significant amount of大量的in practice在实践中ion implantation离子注入constitute a eutectic system构成一个共晶体系alloy合金is evaporated onto被蒸发到epitaxy describes the growth technique of arranging atoms in single-crystal fashion upon a crystalline substrate so that the lattice structure of the newly growth film duplicates that of the substrate外延描述的安排单晶方式原子生长技术的结晶基板时,使基板的新生长膜的晶格结构重复的外延生长技术的描述中安排单晶时尚原子在晶体基质使晶格结构的新生长的薄膜基板的副本single-crystal fashion单晶时尚crystalline substrate结晶基板duplicates重复;副本the flexibility of impurity control in the epitaxial film在外延膜的杂质控制的灵活性may be independent of the substrate doping可能是独立的衬底掺杂dopant掺杂剂gaseous atmosphere气体气氛these impurity atoms may come from slices of boron nitride inserted between silicon wafers这些杂质原子可能是氮化硼硅晶圆片之间插入slices片boron nitride氮化硼from slices of从片solid solubility固溶度a beam of dopant ions is accelerated through a desired energy potential ranging between掺杂离子束加速所需的能量通过电位介于before an incident ion loses its Ek,it collides with lattice atoms and the host atoms are dislodged事件发生之前,入射离子失去其EK,它与晶格原子碰撞和晶格原子脱落is aimed at the semiconductor target so that the high-energy ions penetrate the semiconductor surface 针对半导体靶,高能离子穿透半导体表面with the target nuclei and electrons与靶原子核和电子come to rest来休息penetration depth is called the range穿透深度被称为范围kinetic energy动能structural properties结构特性lattice spacing and mass of atoms的晶格间距和质量的原子an amorphous target一种无定形靶into a disordered or amorphous layer在一个无序的或无定形层it is necessary to anneal the semiconductor after implantation to reestablish the crystalline structure 退火注入后的半导体重新建立的晶体结构,有必要a typical doping profile for ion implantation is shown schematically in fig.3.1图3.1示意性地示出一个典型的离子注入的掺杂分布profile轮廓网络轮廓;侧面;概况;侧面图is assumed constant throughout the crystal被假定为恒定的在整个晶体metallurgical junction冶金结it is the net doping profile that determines the energy band diagram它是净掺杂分布确定的能带图net doping profile净掺杂分布is plotted as绘制step approximation步逼近step function阶跃函数dashed line虚线boundary边界as opposed to作为反对the term heterojunction任期异质结homojunction同质结the simplifying approximations permit analytical calculations for many of the device properties 简化近似允许为许多设备性能的分析计算we refer to this as the prototype homojunction我们称这为原型的同质结impurity-induced band-gap narrowing effects are neglected杂质引起的带隙窄化效应被忽视impurity-induced杂质诱导stationary固定的1in the order of 103在数量级为103be sensitive to temperature,illumination,magnetic field,and minute amount of impurity atoms 敏感的温度,光照,磁场,和微量的杂质原子corresponding resistivity相应的电阻率fused quartz and glass have very low conductivities熔融石英和玻璃具有非常低的热导率electronic application电子应用has been investigated已经被研究了shows a portion of the periodic table related to semiconductors显示有关半导体周期表的一部分a portion of一部分those composed of single species of atoms由单一品种的原子组成element semiconductors元素半导体numerous compound semiconductors许多化合物半导体3prior to the invention of the bipolar transistor对双极晶体管的发明之前rectifiers and photodiodes整流器和光电二极管leakage current漏电流leakage current at only moderately elevated temperatures在只有中等程度的升高的温度下的泄漏电流germanium oxide is water soluble and unsuited for device fabrication氧化锗是水溶性的,不适合移动设备的制造silicon become a practical substitute and has now virtually supplanted germanium硅成为一个实用的替代品,现在已几乎取代了锗supplanted取代Substitute替代品can be grown thermally可以热生长device grade silicon设备级别的硅silicon in the form of silica and silicates comprises 25% of the earth's crust,and silicon is second only to oxygen in abundance硅的形式二氧化硅和硅酸盐含有25%的地壳,丰富度仅次于氧in abundance丰富度compound semiconductors化合物半导体optical properties光学性能photonic application amorphous types amorphous光子应用非晶型无定型;非晶型solids may be classified by structure organization into crystalline,polycrystalline,and,amorphous types an amorphous solid does not have a well-define structure;in fact,it is distinguished by its formlessness 固体组织结构,可以被分类成晶型,多晶型,非晶类型无定形固体不具有良好定义的结构,事实上,它的特点是它的无形solar cells太阳能电池consumer electronics消费类电子产品exploratory work is being performed to build amorphous field-effect transistor for large-area display and sensors正在执行探索性工作,建立无定形的大面积显示和传感器的场效应晶体管nevertheless然而in the foreseeable future在可预见的未来insulator绝缘子silicon dioxide二氧化硅is used as a conductor , contact , or gate in transistors作为一个导体,接触,或栅极晶体管5Fashion时尚,时装;时装领域,时尚界;方式,方法;the atoms are arranged in a three-dimensional periodic fashion原子排列在一个三维的周期的方式stray far from远远偏离cubic-crystal unit cells立方晶体单元there is a unit cell that is representative of the entire lattice有一个单元,是代表整个晶格has six equidistant nearest neighboring atoms有六个等距离的近邻原子the dimension a is called the lattice constant被称为尺寸a的晶格常数Dimension尺寸only polonium is crystallized in the simple cubic lattice只有钋是在简单立方晶格的结晶crystals exhibiting bcc lattices include those of sodium and tungsten晶体具有体心立方晶格,包括钠钨aluminum copper gold platinuma diamond lattice structureelement semiconductors铝铜黄金铂金金刚石晶格结构元素半导体it may be seen as two interpenetrating fcc sublattices with one displaced from the other by one-quarter of the distance along a diagonal of the cube它可以被看作是两个互穿的面心立方子晶格有一个位移沿对角线的距离的四分之一adjacent unit cell相邻单元all atoms are identical in a diamond lattice所有的原子是相同的金刚石晶格equidistant等距的tetrahedron四面体GaAs zincblendeGaAs闪锌矿gallium phosphide zinc sulfide cadmium sulfide磷化镓硫化锌硫化镉ABCD planeABCD平面spacings间距the crystal is anisotropic晶体是各向异性are depend on the crystal orientation依赖于晶体取向orientation取向Miller indices米勒指数find the intercepts of the plane on the three Cartesian coordinates in terms of the lattice constant平面上的三个笛卡儿坐标中的晶格常数方面的截距in terms of依据take the reciprocals of these numbers and reduce them to the smallest three integers having the same ratio把这些数字的倒数,减少到最小的三个整数具有相同的比例intercepts the x-axisfor planes of equivalent symmetrysymmetry截取的x轴等效的对称平面对称enclose the result in parentheses as the miller indices for a single plane把括号中的结果为一个单一的平面的米勒指数enclose the result in parentheses as the miller indices for a single planeencloseParentheses结果括在括号内为米勒指数为一个单一的平面括括号some conventions are given as follows一些约定如下be perpendicular to垂直于7 1.3electrons orbiting电子轨道around it它周围positive charge nucleus正电荷的原子核analogous to the relation between the sun and the planets类似于太阳和行星之间的关系bohr postulates that the angular momentum of an electron may assume only certain discrete values which in turn give rise to a set of discrete allowable energy levelsangular momentumgive rise toa set of玻尔假设,一个电子的角动量可假设只有特定的离散值,这反过来又产生一组离散允许的能级角动量?引起?一组these energy levels are derived for the hydrogen atomare derived for这些来自氢原子的能量水平衍生为principal quantum numberelectron binding energy in electronvoltthe corresponding energiesground stateexcited statesthe orbits of the electrons are specified by their energy levelsare specified by主量子数电子伏特的电子结合能相应的能量基态激发态电子的轨道被自己的能量水平指定所指定的accompanied the emission of a quantumquantumcorrespondingbunch together to form shellelectrons shell伴随着发射的量子?量子相应一堆在一起,形成层电子层give rise torepresent tightly bound electronbound electronrepresentinteratomic force or chemical reactionvalence electronsinteratomic bonding引起代表紧密结合电子?束缚电子代表原子力或化学反应价电子原子间的键合relatively freeone may therefore visualize that the nucleus and the two inner shells form the core with an effective charge of +4q相对自由因此,人们可以可视化,原子核和两个内电子层形成一个有效电荷q4核心constituent atoms组成的原子simplification简化description描述orbiting轨道in each constituent atom在各个组成部分的原子if the atom is closely packed如果原子紧密排列packed充满的overlap重叠的resulting resistivity得到的电阻率quartz(sio2)石英(SiO2)electron configuration电子构型covalent bonding共价键nuclei核nucleus核the electrons are bound in their respective tetrahedron lattice电子被束缚在各自的四面体晶格the liberated electrons被释放电子vacancy空位this deficiency may be filled这种空位可以填充fictitious particle虚拟粒子the concept of a hole is analogous to that of a bubble in a liquid 空穴的概念是类似于在液体中的气泡gaseous气态的applicable适用的separated分离的discrete energy levels分立能级free-space permittivity自由空间的介电常数principal quantum number主量子数in a solid ,the atoms are closely packed,so they tend to interact 在固体中,原子紧密排列,所以他们往往相互作用two identical atomsconsist of one doubly degenerate leveldegenerate level两个相同的原子由一个双重简并能级简并能级split into two levels by the interaction between the atoms分割为两个能级被原子之间的相互作用in the case of a solid在固体的情况下discrete energy levelinteratomic spacingoriginating fromlose their identities and merge together分立能级原子间距源自失去他们的个性(身份),并合并在一起reside within the energy bandsdiscrete energy levelDistinct (identical相同的)overlappartiallyand independent mechanismseither is partially filled or overlap the valence band驻留在能带分立能级不同交叠部分?和独立的机制要么是部分填充的或重叠的价带current conduction can readily occur in conductorsreadilyseparation between...and...we designate Ecthe conduction electron is at restthe kinetic energy of a hole is measured downward from Ev导体中电流传导,可以很容易地发生?容易分离...和...之间我们指定EC传导电子处于静止从EV向下一个孔的动能的测量move back and forth along the x-directionthe movement can be described by standing-wave oscillations vibration振动运动可谓驻波振荡沿x方向来回移动volumecubemomentum spaceincremental changethe volume in momentum spacethe volume between two concentric spheresthe factor 2 accounts for the electron spinsaccounts for体积立方体动量空间增量变化在动量空间的体积两个同心的球体之间的体积因素2占电子自旋比例?占...比例we can substitute E for Pdensity of stateat finite temperaturecontinuous thermal agitationan intrinsic semiconductorcontain relatively small amount of impuritiesrelativelyevaluateincremental energy range dE我们可以为P代用e态密度在有限温度下连续热扰动本征半导体含有较少量的杂质?相对评估能量增量的范围by integrating...fromfermi-dirac distribution functionupper shaded areahenceby contrastnearly unitybecause F(E) is an exponentially decreasing function of E Infinity finity有限的substituting intowe obtain forbridge the forbidden gapexternal force or excitationthis np productnote thatshaded areas通过整合...费米- 狄拉克分布函数上阴影区域因此相比之下近团结因为F(E)是一个指数递减函数的E无穷代入我们获得弥合禁带外力或激发本NP产品注意:阴影区an extrinsic semiconductorintrinsic semiconductor非本征半导体本征半导体mass action lawwhich is validnear-exponential temperature dependence质量作用定律这是有效的近指数的温度依赖性denoted Eithe small deviation of Ei from...from here onwe shall use Ei to specify the midgap energy of semiconductor记EI小偏差EI...从这里开始我们将使用EI指定中间带隙的半导体能源graphic procedure图示arsenic atomboron atomshallow donorscomplete ionization砷原子硼原子的浅施主完全离子化arise from产生于the topic of adding excess carriers by means of generation and injection 通过生成和注射的手段增加过剩载流子的话题they are annihilated by recombination他们通过重组被消灭8emerging fieldseveral new fabrication techniques have evolved which helped popularize MEMSnumerous novel devices have been reported in diverse areas of engineering and scienceintegrated device 在不同的领域Actuate新兴领域一些新的制造技术已经进化捧红MEMS无数新奇的设备在工程和科学的不同领域中,已报告集成的器件开动the interdisciplinary nature of MEMS utilizes design,engineering and manufacturing expertise from a wide and diverse range of technical areas 来自微机电系统的跨学科的性质,采用的设计,工程和制造从各种不同技术领域的专业知识///////// 从技术领域的广泛和多样化的跨学科性质的MEMS设计,工程和制造方面的专长,运用utilize利用extensive rangeincorporate MEMS deviceaccelerometers for airbag sensorsinkjet printer headscomputer disk drive read/write headsprojection display chipsblood pressure sensors范围广泛结合MEMS器件安全气囊传感器的加速度计喷墨打印机头计算机的磁盘驱动器的读/写磁头投影型显示芯片血压传感器optical switchesmicrovalvesbiosensorsare manufactured and shipped in high commercial volumes光开关微型阀生物传感器高商业量的制造和运输dramatically affect显著地影响issuse concerning miniaturization关于小型化问题assembly,integration and packaging of MEMS组装,集成和封装的MEMSfundamental fabrication基本的制作photolithography,bulk micromachining,surface micromachining光刻,体微加工,表面微加工high-aspect-ratio micromachining高深宽比的微加工uniting factor of a MEMS device结合因子的MEMS装置review the range of MEMS sensors and actuator审查的MEMS传感器和执行器的范围actuation驱动sophisticated manipulations of silicon and other substrate using micromachining processes硅和其他基材采用微机械加工工艺复杂的操作、、、、、复杂的操作的硅和其它基材采用微机械加工工艺exploit the propertiesmicrosensors detect changes by measuring magnetic,phenomenasignal the microactuatortheir component are usually microscopiclevers,gears,pistons,motors and steam engines利用属性微型检测通过测量磁场,现象的变化给微致动器发信号去。