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AVID FOD Receiver User's Guide

FOD Receiver User’s Guide Rev 3, 07/18/2013General DescriptionThe AVID FOD (Foreign Object Detection) Receiver is a standard WPC V1.1 wireless power receiver (5.0W) that has been calibrated and characterized to accurately measure and report received power information. This RX device is useful for testing transmitter devices, for characterizing and optimizingV1.1 (and newer) transmitter’s FOD functionality, and for doing Qi pre-compliance testing.Here are the main features of the AVID FOD Receiver:- Fully functional V1.1 Qi Receiver- Uses “naked” RX coil as specified for TPR#5 in the WPC Part 3 spec. Coil is isolated from the electronics and mounted in plastic frame that mates with the foreign object holders for good alignment - Factory calibrated and characterized using calibrated AVID FOD Transmitter- Accurately measures and reports PPR (received power) values per WPC V1.1 spec- Calculates and sends additional 16-bit PPR values (proprietary packet 0x28) that can be decoded and reported using the AVID FOD Transmitter and AVID V1.1 Sniffer- Programmable PPR offset and internal loads (DIP switch settings)- External load board (included) has minimum, maximum and in-between loads for testing and characterizing transmitters and for running Qi pre-compliance tests- Supports internal loads up to 2.0 Watts in 0.25 Watt increments (DIP switch settings) and external loads up to 5.0 Watts maximum.AVID FOD Receiver, Top ViewAVID FOD Receiver, Side and Bottom ViewsAVID Receiver Load BoardBasic Setup and OperationTo operate the FOD Receiver, first set the DIP switches on top of the unit to program the internal loadand the PPR offset values (see below) as desired. The FOD receiver can be operated using internalloads up to 2.0 Watts, but AVID recommends leaving the Load DIP switches all off and connecting the external load board to the output screw terminals for testing because this will isolate the load from the receiver and keep the electronics at a more even temperature. Next, place the FOD Receiver on any Qi transmitter for characterization and testing.The “Power” and “Status” LEDs on top of the FOD Receiver indicate the operational state of the receiver. The Power LED will light solid blue as long as the receiver is receiving enough power from the transmitterto power up its internal electronics. The Status LED will light solid green when the receiver is receiving enough power to supply the internal or external load and to regulate its output voltage to +5.0V. Whenthe FOD Receiver is first placed on a transmitter, it connects a minimum internal load of 100 ohms (to ensure robust communications). Next the receiver adjusts its bridge voltage to about 5.8V and then connects the internal or external load and disconnects the minimum 100 ohm load. If an external load is connected to the terminal block on the receiver and current flow is detected through the output, all internal loads are disconnected otherwise the internal load programmed on the DIP switches is left connected.Once the load is connected, the receiver will send error messages to regulate the output to +5.0V +/- 5%. The FOD Receiver should operate normally on any Qi transmitter (base station). If the FOD Receiver is powered up and regulating its output voltage, the status LED will remain green or amber. If the FOD Receiver cannot regulate its output voltage the status LED will turn off. If an error occurs (see below) the status LED will blink red. To maintain good power measurement accuracy, always make sure theFOD Receiver is not operated on or near metal desks or other large metal objects during testing.Below are brief descriptions of the functionality supported by the FOD Receiver: Function DescriptionPower LED Solid blue when FOD Receiver receives sufficient power from the transmitter to power its internal circuitryStatus LED Solid green when FOD Receiver receives sufficient power from the transmitter to power its internal load and regulate to +5.0V +/-5% Solid amber when FOD Receiver receives sufficient power from the transmitter to power an external load and regulate to +5.0V +/-5% Blinking red indicates various error codes (see quick start guide below)VBRIDGE Pin Rectified bridge voltage measurement test point COMM Pin Communication modulator digital signal test point GND Pins Internal circuitry ground referenceTEST DIP Switches PPR offset multiplier (6 bits) 0 to 63. This value is multiplied by the PPR offset step size to get the resulting PPR offset value in mWCOMM DIP Switches PPR step size (2 bits). This value is multiplied by the PPR offset multiplier to get the resulting PPR offset value in mW00 = -5 mW, 01 = -10 mW, 10 = +5 mW, 11 = +10 mWLOAD DIP Switches Internal load (4 bits) 0 to 8 (positions 9-15 reserved)This value is multiplied by 0.25 to get the resulting internal load in Watts If external load >= 0.25W is sensed, all internal loads are switched offTerminal Block For connecting external loads. When operating properly the FOD Receiver will provide +5.0V +/- 5% at this outputExternal Load Board Can be used to connect and switch on/off various external loads for characterizing V1.1 transmitters and running FOD pre-compliance testsV1.1 Transmitter (Base Station) FOD CharacterizationV1.1 QI compliant transmitter (base station) product developers can use the AVID FOD Receiver tool and the AVID external load board (or user supplied load) to characterize and adjust the transmitter power measurements. The FOD Receiver has been characterized using the AudioDev WPC approved V1.1 Test Transmitter and the results show good correlation between transmitted power and received power to within about 50 mW accuracy over a 0.25 W to 6.0 W load range.If the transmitter under test has a means of providing an indication of its transmitted power values during power transfer, then it is possible to use the AVID FOD Receiver to characterize the transmitter’s power loss measurements and FOD thresholds.To use the AVID FOD Receiver to characterize a transmitter, use the following procedure:1) Connect the external load board to the FOD Receiver terminal block and switch on the 0.25 Wload only. The on position for the switches is toward the edge of the load board.2) Place the FOD Receiver on the transmitter, center aligned, and record the transmitted power andreceived power values. If the transmitter does not already provide the received power values to the user, the AVID Qi Sniffer V1.1 can be used to capture the received power values including16-bit high resolution values reported by the AVID FOD Receiver.3) Repeat step 2 at several external load points such as at 1.0 W increments up to 5.0 W.4) Plot the received power vs. transmitted power values for each load point. The data should showgood correlation. If the difference is greater than 100 mW at any of the load points, makeadjustments to the transmitter to improve the power measurements.Base Station Qi Pre-Compliance TestingV1.1 QI compliant transmitter (base station) product developers can use the AVID FOD Receiver tool, the AVID external load board (or electronic load), and a set of WPC defined Foreign Objects to run Qi FOD Part 3 pre-compliance tests. AVID Technologies supplies (separately) the WPC defined foreign objects with an alignment frame and spacers that can be used for this testing.The Part 3 Base Station FOD compliance tests use two test receivers: TPR#5 and TPR#6. These receivers use a low-loss coil with no shield to minimize parasitic losses.TPR#5 is configured to output 5.0V +/-20% and to use a received power window size of 64 ms and a window offset size of 16 ms. TPR#5 is also configured to over report its received power values by 235 mW. During the WPC interim extension period in effect until May 2014, TPR#5 shall instead over report its received power values by 35 mW:TPR#5 PPR = (PPM+235)TPR#5 (INT) PPR = (PPM+35) ** Use this equation during the WPC interim periodPPM is the actual received power determined by the test receiver by measuring its load power and adding estimated parasitic power losses.TPR#6 is identical to TPR#5 except TPR#6 is configured to under report its received power values by 15 mW. During the WPC interim extension period in effect until May 2014, TPR#6 shall instead under report its received power values by 115 mW.TPR#6 PPR = (PPM-15)TPR#6 (INT) PPR = (PPM-115) ** Use this equation during the WPC interim periodBase Station Thermal Compliance TestingThe Part 3 Base Station FOD thermal compliance tests consist of measurements that check the temperature rise (at +25 deg C ambient) of four different WPC defined foreign objects while they are placed between the test receiver (TPR#5) and the base station during power transfer. Each object has an allowed temperature limit as defined in the table below.WPC Defined Foreign Objects:LimitObject Configuration Temperature#1 Steel disc centered 60 deg C#2 Aluminum ring centered 60 deg C#3 Aluminum foil centered 80 deg C#4 Steel disc offset 15.5 mm 60 deg CIf any of the foreign objects reaches or exceeds the temperature limits above during testing, the transmitter’s FOD measurements, thresholds, or reaction time may need to be adjusted to meet compliance.To use the AVID FOD Receiver to emulate TPR#5 and run the foreign object thermal pre-compliance tests on a base station, use the following procedure:1) Set the DIP switches on the AVID FOD Receiver to emulate TPR#5 as follows:TEST = 000111 (PPR offset multiplier = 7)COMM = 10 (PPR offset step = +5 mW)LOAD = 0000 (no internal load)2) Connect the external load board to the FOD Receiver and switch on the 0.25W (100 ohm) loadonly on the far left of the load board near the terminal block connector.3) Connect foreign object #1 (steel disc) K-type thermocouple connector to a suitable thermometeror DMM that can measure temperature of a K-type thermocouple.4) Fit the clear plastic alignment frame on top of the foreign object holder.5) Place the foreign object and alignment frame on the base station under test and align the centerof the foreign object holder with the center of the base station transmitter coil. The AVID foreign object holders have score marks that indicate the center lines.6) Place the AVID FOD Receiver in the alignment frame on top of the foreign object and make surethe receiver and foreign object are still center aligned with the transmitter coil.7) Increase the load on the external load until the transmitter hits its power loss (FOD) threshold andterminates (or lowers) its transmitted power. If you are using the AVID supplied external loadboard, leave the 0.25W load switched on, switch on the variable (0.24 W to 1.38 W) load, andslowly adjust the potentiometer until right at the point the power loss threshold is hit.8) Reduce the external load by 50 mA. If you are using the AVID supplied external load board thiscan be accomplished by switching off the 0.25W (100 ohm) load.9) Run the transmitter for 10 minutes (or until the transmitter terminates power transfer) and recordthe temperature of the foreign object.If the transmitter terminates power transfer before 10 minutes during any of these tests, repeat steps 6 and 7 above and reduce the load slightly until the transmitter runs for 10 minutes OR until the minimum load of 0.25 W (50.0 mA) is reached. At the minimum load, if the transmitter still terminates power before 10 minutes, the temperature of the object is recorded at the point where power transfer was terminated. The steps above are repeated as follows:- Using object #1 with 2.0 mm spacer placed between the foreign object and the AVID FOD receiver- Using object #1 with 5.0 mm spacer placed between the foreign object and the AVID FOD receiver- Using foreign object #2- Using foreign object #3- Using foreign object #4The steel disc objects present lower power losses and temperature rises than the other objects. For the steel objects, the thermal test may run for the full 10 minutes. The transmitter FOD power loss threshold should be set to keep the temperature of the objects below the limit at the end of the 10 minute test.The aluminum foil and ring objects present higher power losses and temperature rises than the steel discs. For these objects, even at the minimum 50 mA load the thermal test may not run the full 10 minutes before the transmitter reaches its FOD power loss threshold. In this case the transmitter FOD threshold and reaction time should be adjusted to keep the foreign object temperature below the limit when the threshold is reached and the transmitter either terminates or reduces power.If the transmitter can be adjusted to keep the foreign objects below the temperature limits for all of the above tests, then the product will likely pass the FOD thermal compliance tests at an approved Qi compliance lab. If not, adjust the transmitter FOD power loss thresholds and reaction time accordingly.Base Station Guaranteed Power Compliance TestingThe Part 3 Base Station FOD guaranteed power compliance test consists of a measurement that checks to make sure the base station under test can deliver 5.0 Watts to a test receiver (TPR#6) that has no foreign object present, but is simulating power loss into a foreign object by under reporting its received power.To use the AVID FOD Receiver to emulate TPR#6 and run the guaranteed power pre-compliance tests on a base station, use the following procedure:1) Set the DIP switches on the AVID FOD Receiver to emulate TPR#6 as follows:TEST = 010111 (PPR offset multiplier = 23)COMM = 00 (PPR offset step = -5 mW)LOAD = 0000 (no internal load)2) Connect the external load board to the FOD Receiver and switch on the 0.25W load only.3) Place the FOD Receiver on the base station and make sure it is center aligned with thetransmitter coil. Wait until the base station begins power transfer.4) Switch on the 1W load on the external load board. Allow the base station to continue powertransfer for 10 seconds.5) Switch on the 2W load on the external load board. Allow the base station to continue powertransfer for 10 seconds.6) Switch on the 3W load and switch off the 0.25W and 1W loads on the external load board (total =5W load). Allow the base station to continue power transfer for 5 minutes.7) Measure the voltage at the terminal block output on the FOD Receiver and make sure it isbetween 4.75V and 5.25V (regulation tolerance of the FOD Receiver).If the voltage measured in step 7 is between 4.75V and 5.25V, then the product will likely pass the FOD guaranteed power compliance tests at an approved Qi compliance lab. If the voltage is not between4.75V to5.25V, make adjustments to the base station device to improve the power transfer performance and repeat the tests above.NOTE: AVID FOD TOOLS ARE NOT APPROVED FOR FINAL QI COMPLIANCE TESTING. THEY ARE DESIGNED TO BE USED FOR DEVELOPMENT AND PRE-COMPLIANCE TESTING BY CUSTOMERS DESIGNING and PROTOTYPING WPC V1.1 WIRELESS POWER PRODUCTS.AVID FOD Receiver Quick Start Guide:Quick Start Guide ***************************SYSTEM MONITORING:VBRIDGE: (5.0V +/-0.5V)Receiver DC Bridge VoltageCOMM. (0 -3.3V Logic)Modulation Signal5V, 0-1A OUTPUT:Internal load is disabledwhen external load (>0.25W)is connected.CONFIGURATION SWITCHES:TEST Position 1-6PPR offset multiplierLOAD Position 1-4Selects internal load0-2W, in 0.25W StepsCOMM Position 5PPR offset polarityPosition 6PPR offset step sizeAll switches can be changedduring run time.STATUS LED:©2013 AVID Technologies, Inc. All rights reserved.FOD Receiver。

servomex4100培训手册

• 传感器温度 Cell Temperature
–Pm1158 (氧控制模块不加热); 典型 30oC –范围 5 ~ 70oC –S4100995A (氧纯度模块加热); 设为 55oC –范围 50 ~ 60oC
• 压力传感器输出(仅氧纯度模块) Cell Pressure
–典型 15psia –范围 5 ~ 25psia
卡槽前框架
1 4 3 2
电源入口机架
传感器信号连接器
4 3 2 1
变压器
多路转换器 (MUX)板传感器电源连接器主板
PDF 文件使用 "pdfFactory Pro" 试用版本创建
外部风扇装配图
风向
风扇隔离板
电源连接主板
过滤网(可更换)
过滤器网罩
PDF 文件使用 "pdfFactory Pro" 试用版本创建
电磁阀 #1 电磁阀 #2
PL5
主板
开关电源
SK12
外部通道E1, E2
PL1
终端接线板 mA/继电器板 A(选配) 终端接线板 mA/继电器板 B(选配) 终端接线板 mA/继电器板 B(选配) 终端接线板
PL6
PL3
传感器接口板(SIB) 微处理器板
SK2 SK3
SK5 SK22 SK6 SK7
PDF 文件使用 "pdfFactory Pro" 试用版本创建
人机界面
方向键(上,下,左,右) 选择或输入文字及数字等
ENTER键确认或执行
MEASURE键返回测量显示状态
MENU键 QUIT键显示顶层菜单返回上一级菜单
EDIT键显示编辑功能的快捷键

S04-H019-01E(SNA-1)

DOCUMENT NUMBER S04-H019-01E SNA-1 SeriesFC ADAPTOR- for Angled-PC - TECHNICAL SPECIFICATIONSFiber Optic Products Division296-1, MATSUHIDAI, MATSUDO-SHI,CHIBA, 270-2214 JAPAN.TEL: +81-47-388-6111 FAX: +81-47-388-4477iiSNA-1 Series FC ADAPTOR - for Angled-PC - TECHNICAL SPECIFICATIONSNCD-4oC2-01 October 1994 NCD-4oC2-02 June 1997 NCD-4oC2-03 May 1998 NCD-4oC2-04 February 2001 S04-H019-01E July 2006Copyright ©1994 - 2006 byAll right reserved.The information contained herein shall not be reproduced or disclosed to any third party without the express written consent of SEIKOH GIKEN Co., Ltd.The specifications contained herein are subject to change without notice.Please address any questions, comments, and suggestions to:Frankfurt BranchSiemensstrasse 9 D-63263 Neu-Isenburg, Germany TEL: +49-6102-297-701FAX: +49-6102-297-750Headquarters4405 International Blvd., Suite B109 Norcross, GA 30093 U.S.A. TEL: +1-770-279-6602 FAX: +1-770-279-8839 Northeastern Field Office714 Executive Drive Princeton, NJ 08540TEL: +1-609-279-0225 FAX: +1-609-279-0207Western Field Office21250 Hawthorne Boulevard, Suite 700Torrance, CA 90503TEL: +1-310-792-7450 FAX: +1-310-792-7451Concordia Plaza 21/F Rm2111,1 Science Museum Road, Tsim Sha Tsui East, Kowloon, Hong Kong. TEL: +852-******** FAX: +852-********TABLE OF CONTENTSSection Page1 SCOPE 12 PART NUMBER 13 GENERAL SPECIFICATIONS 23.1 Parts and Materials 23.2 Physical Dimensions 23.3 General Tolerance 23.4 Insertion Loss 23.5 Appearance 34 PACKING 45 IDENTIFICATION 46 HANDLING AND CARE 46.1 Conditions of Storage 46.2 Precautions of Use 46.3 Disposal 4TableTable 1 Part Number 1 Table 2 Parts and Materials 2 Table 3 General Tolerance 2 Table 4 Insertion Loss and Measurement Conditions 3FigureFigure 1 Insertion Loss and Measurement System 3 Figure 2 SNA-1 Series Adaptor (N-type - Wide Key -) 5 Figure 3 SNA-1 Series Adaptor (R-type - Narrow Key -) 6 Figure 4 ⑤Cap 7 Figure 5 Cut-hole Dimensions for Reference 7iiiiv1 SCOPEThese specifications apply to the SNA-1 Series FC adaptor - for angled-PC - supplied by SEIKOH GIKEN Co., Ltd.2 PART NUMBERPart number of the adaptor is shown in Table 1.Table 1 Part NumberCap13 GENERAL SPECIFICATIONS3.1 Parts and MaterialsParts and materials are shown in Table 2.3.2 Physical DimensionsFigure 2 and 3 show the SNA-1 series adaptor.Figure 4 shows the part dimensions.· In accordance with IEC 61754-13 Type FC-PC connector family.· In accordance with JIS C 5970 F01 Type connectors.3.3 General TolerancesPermissible deviation in dimensions without tolerance indication is in accordance with ISO 2768-m (JIS B 0405-m), as shown in Table 3.3.4 Insertion LossInsertion loss of the adaptor and measurement conditions are shown in Table 4.Figure 1 shows the measurement system.2Figure 1 Insertion Loss Measurement System3.5 AppearanceThere shall be no burrs or scratches that affect the product.34 PACKINGThe product is packed to prevent damage during shipment.5 IDENTIFICATIONIdentification label should indicate the part number and the lot number of the product(s) and should be permanently attached to the packing bag.6 HANDLING AND CARE6.1 Conditions of StorageKeep the product, in the packing bag, at the following conditions for its storage.· Storage temperature: -40 to +85 degrees C· Storage humidity: 0 to 85%RH, non-condensing6.2 Precautions for UseContamination, oil, sweat and others debris on the inside of the slit sleeve may influence the performance of the product. If contamination is on the inside of the slit sleeve, clean the inside before connecting.6.3 DisposalWhen discarding this product, please follow the regulations of your own country.4Note: This drawing does not include the cap.Unit: mm Figure 2 SNA-1 Series Adaptor (N-type - Wide Key -)5Note: This drawing does not include the cap.Unit: mm Figure 3 SNA-1 Series Adaptor (R-type - Narrow Key -)6S04-H019-01E SNA-1 Series7Unit: mm Figure 4 ⑤CapUnit: mm Figure 5 Cut-hole Dimensions for Reference。

Cressi SUB 3985 Octopus Manual

Strumenti AnalogiciAnalog DevicesAppareils AnalogiquesAnaloge Geräteinstrumentos AnalógicosРуководство Пользователя模拟装备Manuale d’usoUser’s manualManuel de l’utilisateurBedienerhandbuchManual de usoАналоговые приборы用户手册made in ItalyITA: La dichiarazione di conformità UE del presente DPI è consultabile all’interno del sito EN: The EU declaration of conformity of this PPE is available on the websiteFRA: La déclaration UE de conformité de cet EPI est disponible sur le site internet ES: La declaración de conformidad de la UE de este PPE está disponible en el sitio web DE: Die EU-Konformitätserklärung dieser PSA ist auf der Website verfügbarRUS: Декларация ЕС о соответствии этого СИЗ доступна на веб-сайте CN: 欧盟的PPE符合性声明可在网站上获得43简介恭喜您！通过了解我们的技术中心进行的持续研究和发展以及Cressi-sub享有盛誉的可靠性品质，您购买了我们的产品，您可以长时间舒适、安全地进行潜水运动。

SOP-LE513,V01-SZI-ASM004 Body拆解包装作业标准书_1_0

此圖僅做示意用此圖僅做示意用
Step7: Step8: 1. 使用夾鏈袋「5160801-xx」，將拆解下來的螺 1. 使用 10 號夾鏈袋「5160018-xx」，將拆解下 1. 將 Engine 流程卡收納歸檔保存絲袋在一起來的 3 條 cableb 及螺絲請人
Owen 4/24
包裝程序
Step1: Step2: Step3: 1. 如圖將 Engine Body 上的 SD card 上方，以 1. 依據搭配的 CU 機種將 Safety Label 1. 將鏡頭保護蓋貼著的美紋膠袋撕掉，比照下圖 [5140618-xx]，1pcs 貼起來,避免 SD card 脫「 5140541-xx 」或 [5140623-xx] ，及 Model 位置貼上[5140618-xx]，2pcs 落 Label 「5140872-xx」，貼到 Chassis 上
第 1 頁，共 2 頁
SOP-LE513,V01-SZI-ASM004 Body 拆解包裝作業標準書 2008-04024 捷揚光電 Step4: Step6: Step5: 1. 在 Engine Chassis 上面加貼 IP5X 防塵 1. 確認是否 Engine 有手紋及髒污，並加以清潔 1. 將 Engine 鏡頭朝上擺放，再將 3 條 D-Sub Lable[5140869-xx] Cable 拆下 2. 距離左側弧面及上側組裝縫隙各 2mm，如下圖 2. 用手將倒鈎鈑金扳開，將 Ballast 點燈線鬆開 3. 將 Optical Chassis 及 Power Module 組合的固定螺絲拆下，將兩 Module 分開
SOP-LE513,V01-SZI-ASM004 Body 拆解包裝作業標準書 2008-04024

SN74F521NSR,SN74F521NSRE4,SN74F521DW,SN74F521DWE4,SN74F521N,SN74F521NE4, 规格书,Datasheet 资料

Addendum-Page 1PACKAGING INFORMATIONOrderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball Finish MSL Peak Temp (3)Samples (Requires Login)5962-9759101Q2A ACTIVE LCCC FK 201TBD Call TI Call TI 5962-9759101QRA ACTIVE CDIP J 201TBD Call TI Call TI 5962-9759101QSA ACTIVE CFP W 201TBD Call TI Call TIJM38510/34701B2A ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeJM38510/34701BRA ACTIVE CDIP J 201TBD A42N / A for Pkg Type JM38510/34701BSA ACTIVE CFP W 201TBD Call TI N / A for Pkg Type M38510/34701B2A ACTIVE LCCC FK 201TBD POST-PLATE N / A for Pkg TypeM38510/34701BRA ACTIVE CDIP J 201TBD A42N / A for Pkg Type M38510/34701BSAACTIVE CFP W 201TBD Call TI N / A for Pkg Type SN54F521J ACTIVE CDIP J 201TBDA42N / A for Pkg TypeSN74F521DW ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521DWE4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521DWG4ACTIVE SOIC DW 2025Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521DWR ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521DWRE4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521DWRG4ACTIVE SOIC DW 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521N ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74F521N3OBSOLETE PDIP N 20TBD Call TICall TISN74F521NE4ACTIVE PDIP N 2020Pb-Free (RoHS)CU NIPDAU N / A for Pkg Type SN74F521NSR ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521NSRE4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SN74F521NSRG4ACTIVE SO NS 202000Green (RoHS & no Sb/Br)CU NIPDAU Level-1-260C-UNLIM SNJ54F521FKACTIVELCCCFK201TBDPOST-PLATE N / A for Pkg Type芯天下--/Addendum-Page 2Orderable Device Status(1)Package Type PackageDrawingPins Package QtyEco Plan(2)Lead/Ball FinishMSL Peak Temp (3)Samples (Requires Login)SNJ54F521J ACTIVE CDIP J 201TBD A42N / A for Pkg Type SNJ54F521WACTIVECFPW201TBDCall TIN / A for Pkg Type(1)The marketing status values are defined as follows:ACTIVE: Product device recommended for new designs.LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.PREVIEW: Device has been announced but is not in production. Samples may or may not be available.OBSOLETE: TI has discontinued the production of the device.(2)Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check /productcontent for the latest availability information and additional product content details.TBD: The Pb-Free/Green conversion plan has not been defined.Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)(3)MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.OTHER QUALIFIED VERSIONS OF SN54F521, SN74F521 :•Catalog: SN74F521•Military: SN54F521NOTE: Qualified Version Definitions:芯天下--/•Catalog - TI's standard catalog product•Military - QML certified for Military and Defense ApplicationsAddendum-Page 3芯天下--/TAPE AND REEL INFORMATION*All dimensions are nominalDevicePackage Type Package Drawing Pins SPQReel Diameter (mm)Reel Width W1(mm)A0(mm)B0(mm)K0(mm)P1(mm)W (mm)Pin1Quadrant SN74F521DWR SOIC DW 202000330.024.410.813.0 2.712.024.0Q1SN74F521NSRSONS202000330.024.48.213.02.512.024.0Q1*All dimensions are nominalDevice Package Type Package Drawing Pins SPQ Length(mm)Width(mm)Height(mm) SN74F521DWR SOIC DW202000367.0367.045.0SN74F521NSR SO NS202000367.0367.045.0IMPORTANT NOTICETexas Instruments Incorporated and its subsidiaries(TI)reserve the right to make corrections,enhancements,improvements and other changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B.Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete.All semiconductor products(also referred to herein as“components”)are sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.TI warrants performance of its components to the specifications applicable at the time of sale,in accordance with the warranty in TI’s terms and conditions of sale of semiconductor products.Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty.Except where mandated by applicable law,testing of all parameters of each component is not necessarily performed.TI assumes no liability for applications assistance or the design of Buyers’products.Buyers are responsible for their products and applications using TI components.To minimize the risks associated with Buyers’products and applications,Buyers should provide adequate design and operating safeguards.TI does not warrant or represent that any license,either express or implied,is granted under any patent right,copyright,mask work right,or other intellectual property right relating to any combination,machine,or process in which TI components or services are rmation published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or endorsement e of such information may require a license from a third party under the patents or other intellectual property of the third party,or a license from TI under the patents or other intellectual property of TI.Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties,conditions,limitations,and notices.TI is not responsible or liable for such altered rmation of third parties may be subject to additional restrictions.Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements.Buyer acknowledges and agrees that it is solely responsible for compliance with all legal,regulatory and safety-related requirements concerning its products,and any use of TI components in its applications,notwithstanding any applications-related information or support that may be provided by TI.Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures,monitor failures and their consequences,lessen the likelihood of failures that might cause harm and take appropriate remedial actions.Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety-critical applications.In some cases,TI components may be promoted specifically to facilitate safety-related applications.With such components,TI’s goal is to help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and requirements.Nonetheless,such components are subject to these terms.No TI components are authorized for use in FDA Class III(or similar life-critical medical equipment)unless authorized officers of the parties have executed a special agreement specifically governing such use.Only those TI components which TI has specifically designated as military grade or“enhanced plastic”are designed and intended for use in military/aerospace applications or environments.Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer's risk,and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use.TI has specifically designated certain components which meet ISO/TS16949requirements,mainly for automotive ponents which have not been so designated are neither designed nor intended for automotive use;and TI will not be responsible for any failure of such components to meet such requirements.Products ApplicationsAudio /audio Automotive and Transportation /automotiveAmplifiers Communications and Telecom /communicationsData Converters Computers and Peripherals /computersDLP®Products Consumer Electronics /consumer-appsDSP Energy and Lighting /energyClocks and Timers /clocks Industrial /industrialInterface Medical /medicalLogic Security /securityPower Mgmt Space,Avionics and Defense /space-avionics-defense Microcontrollers Video and Imaging /videoRFID OMAP Mobile Processors /omap TI E2E Community Wireless Connectivity /wirelessconnectivityMailing Address:Texas Instruments,Post Office Box655303,Dallas,Texas75265Copyright©2012,Texas Instruments Incorporated。

富士医疗干式激光相机4000说明书

FUJIFILM富士医疗干式激光相机DRYPIX4000操作手册第一版：2005年2月Fuji Photo Film Co., Ltd.（富士照相胶片有限公司）安全操作 1 产品总览 2 基本操作 3 效用 4 排除故障 5 保养和维护 6 规格7维护和检查软件许可协议实际运行DRYPIX 4000系统之前，请详细阅读本操作手册。

阅读本手册之后，请存放在DRYPIX 4000附近，以便需要时随时查看。

ii DRYPIX 4000操作手册897N0218 2005年2月介绍介绍非常感谢您购买富士医疗干式激光相机DRYPIX 4000。

富士医疗干式激光相机DRYPIX 4000是将数字图像数据以所选格式打印至专用胶片的设备，数字图像数据来自FCR图像阅读器或CT、MRI和其它成像设备，经DICOM网络传送。

本DRYPIX 4000操作手册提供操作方法和注意事项的详细解释，以便促进正确理解功能并且能够更有效地使用。

我们要求首次使用的用户在实际应用DRYPIX 4000之前，详细阅读本手册。

阅读之后，请将其存放在DRYPIX 4000附近，便于使用，以保证在最佳状态下使用该设备。

小心The DRYPIX 4000使用Vx Works。

Vx Works的版权属于Wind River Systems, Inc。

2005 富士照相胶片有限公司。

DRYPIX 4000操作手册897N0218 2005年2月iiiiv DRYPIX 4000操作手册897N0218 2005年2月内容浏览内容浏览第1章安全操作本章介绍我们希望您注意的安全操作本设备所需了解的警告（Warning）和小心（Caution）。

第2章产品总览本章介绍该设备的总览和主要特性。

第3章基本操作本章描述常规操作程序，包括如何启动/关闭该设备以及如何更换胶片盒。

第4章效用本章解释如何校准胶片输出密度和设置Economy Mode（经济模式）。

沃恩润光电有限公司产品说明书

Jiangsu Wenrun Optoelectronic Co. Rev:1SpecificationCustomer confirmApproved byChecked byIssued byJiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 1 of 7 ◆Features:● E mitting dot 3.0mm diameter.● High efficiency, low power consumption. ● Extremely low current. ● Low development cost.● Big viewing angle vertically and horizontally.◆Descriptions:● The LMD10057 is a 27.94mm (1.0") matrix height 5×7 dot matrix display. ● These devices are made with white dots and black surface.◆Application● Instrument panels.● Digital read out display.◆Selection Guide:ChipPart No. Material Emitting Color Lens ColorLMD10057BUY-101AnodeAlGaInPHigh Super YellowWhite DiffusedJiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 2 of 7 ◆Absolute Maximum Rating （Ta=25℃）Parameter Symbol High Super YellowUnit Power Dissipation/Dot P d 70 mW Peak Forward Current /Dot ① I FP 80 mA Continuous Forward Current/DotI F 20 mA Reverse V oltage /Dot V R 5 V Operating Temperature Range Topr -40~ +85 ℃ Storage Temperature Range Tstg -40 ~ +85 ℃ Solder Temperature ②Tsol260±5℃Notes ：1、This is the limit current . It is not allowed to use when the product work continuously. 2、Soldering time ≤5 seconds.3、I FP condition: pulse width ≤1ms ,duty cycle ≤1/10◆Electrical Optical Characteristics （Ta=25℃）High Super YellowParameter SymbolTyp.Max. UnitTestCondition Luminous Intensity /Dot I V 96 -- mcd I F =10mA Forward Voltage /Dot V F 2.0 2.5 V I F =20mA Reverse Current /Dot I R -- 50 uA V R =5V Dominant Wavelength λd 590 -- nm I F =20mA Spectral Line Half WidthΔλ30--nm I F =20mAJiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 3 of 7 ◆Package Dimensions:NOTES ：∙ All dimensions are in millimetres (mm), Tolerance is ±0.25mm unless otherwise noted. ∙ Specifications are subject to change without notice.nternal Circuit:Common AnodeLMD10057BUY-101674523RO 1254321COL 1ROW 76543Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 4 of 7 ◆Reliability(1) Test Items and ConditionsNO Test Item Test ConditionsSample Ac/Re 1 Temperature Cycle -40±5℃→25±5℃→85±5℃→25±5℃ (30min ，5min ，30min ，5min) 20 Cycles 20 0/1 2 High Temperature Storage Ta ：100±5℃Test time=1000HRS(-24HRS,+72HRS) 20 0/1 3 High Temperature And High Humidity Working Ta ：85±5℃，R H :85±5%，I F =10mA/seg Test time=500HRS(-24HRS,+72HRS) 20 0/1 4 Low Temperature Storage Ta ：-40±5℃Test time=1000HRS(-24HRS,+72HRS) 20 0/1 5 Operating Life Test Connect with a power I F =10mA/seg Ta=25±5℃Test time=1000HRS(-24HRS,+72HRS) 20 0/1 6 Solder Resistance T.Sol=260±5℃ one timeDwell Time=5±1Secs ，distance 3mm 20 0/1 7Thermal Shock-40±5℃→85±5℃(15min ，15min) 20Cycles200/1(2)Criteria of judging the damageCriteria for judgement Item Symbol Test condition Min. Max. Forward voltage V F I F =10mA/Seg / U.S.L*1.1 Reverse current I R V R =5V / 15uA Luminous intensity I V I F =10mA/Seg L.S.L*0.7/ Wave length λD/λPI F =10mA/Seg /U.S.L ±2nmAppearance/View checkNo mechanical damage* U.S.L: Upper standard level L.S.L: Lower standard levelJiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 5 of 7 ◆Typical Electro-Optical Characteristics Curves◆Storage and application notices1、 Storage1. Before opening package: the LEDs should be kept at 18-30℃, related humility: 30-70%RH.They should be used out within 3mothes;2. LEDs should be used out within 24Hs after opening package to avoid the lead frame’s corrode;3. The internal box can not be contacted with ground to prevent absorption of moisture4. No acid, alkali, salt, corrosive and explosive gas; away from sunlight and keep the environment clean;2、 Application1．Do not use any unknown chemical liquid to clean LED, it will damage the LED resin surface; use the alcohol under the room temperature if necessary but less than 1 min;2．When forming lead frame, the lead frame should be bent at a point at least 2mm from the base of epoxy.Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 6 of 7 The forming should be done before soldering which can avoid epoxy’s broken and internal structure’s damage. Forming must be operated by the specific jig or the qualified operator to make sure the lead frame and distance are as same as the circuit board. Specific is shown as below,Mark:“○” means correct ，“×”means incorrect.3．Do not apply any bending stress to the surface of the LED. The stress to the surface may damage the surface ink color and internal connection which causes the electric character & appearance’s failure. 4．a. Soldering iron power: under 30W; soldering temperature: 295℃±5℃; soldering time: within 3sec.(only1time) ;b. Soldering temperature in solder machine: 250℃±10℃; soldering time: within 5sec.c. Soldering temperature during wave soldering process: 230℃±10℃, soldering time: within 5sec. 5．The LEDs should be soldered at the coordinated position on the PCB; the distance from soldering point to epoxy resin should be 3mm at least. If the 2nd soldering process required, 3mins must be left to ensure the high temperature status can return to room temperature. But the recommended soldering time is only 1time in principle.6．If solder the LEDs on one PCB by the soldering iron; do not solder the different lead frames of one LED, but solder in proper sequence; 7．Note of Electrical matter:Jiangsu Wenrun Optoelectronic Co.,LTD Rev:1 Tel************** Fax ：************* Page 7 of 7 ① One-way conduction, LED does not allow the reverse driving; ②a. LED is a kind of constant current component which can not be lighted by the constant voltage mode;a smaller voltage fluctuation can cause the large current fluctuation which causes the failure of LED; b. Each LED should be drove under constant current mode if in a parallel circuit design, otherwise, thecolour and brightness will be nonuniform;c. When the environmental temperature rising, the LED junction temperature will rise, internalresistance will decrease, so the current will be increased by the constant voltage power which short the life span;③ If the brightness of lighting source can meet the requirement, we recommend using the drivingcurrent less than the rated current, in order to improve the product’s reliability;8．LED is a kind of electrostatic sensitive devises, anti-static measures have to be processed during storage and operation:① LED production workshop should lay anti-static floor and ground connection, the work table haveto use the anti-static materials and cover a table mater with the surface resistance of 106-109Ω ② Production machine: REFLOW, SMT equipment, electric iron, test equipment; all the equipmentsmust be well grounded, and the grounding alternating current impedance should be less than 1.0Ω. A fan need to be installed on the equipments and production processes that easy to generate static electricity; the operators must wear anti-static clothing, shoes, wristband , and gloves, etc. in the process;③ LEDs must be contained in the anti-static box, and all the package material should be the anti-staticmaterials;9．The details electronic characters can refer to our product specification.◆Notes:1、Above specification may be changed without notice. We will reserve authority on material change for above specification.2、When use this product, please observe the absolute maximum ratings and the instructions for the specification sheets. We assume no responsibility for any damage resulting from using of the product which does not comply with the instructions included in the specification sheets.。

гомдустру roduction EFPAU TEST NO说明书

感谢您购买产品！请仔细阅读本手册，它将帮助你妥善设置并运行您的系统，使其发挥卓越的性能。

并保留这些说明以供日后参照。

警告：为了降低火灾与电击的风险，请不要将产品暴露在雨中或潮湿环境中。

警告：为了降低电击的风险，非专业人士请勿擅自拆卸该系统。

仅供专业人士操作。

等边三角形中的闪电标记，用以警示用户该部件为非绝缘体，系统内部存在着电压危险，电压。

可能足以引起触电。

可能足以引起触电如系统标有带惊叹号的等边三角形，则是为提示用户严格遵守本用户指南中的操作与维护规定。

注意：请勿对系统或附件作擅自的改装。

未经授权擅自改装将造成安全隐患。

警告：燃不得将明火源(如点的蜡烛)放在器材上面。

1. 请先阅读本说明。

2. 保留这些说明以供日后参照。

3. 注意所有警告信息。

4. 遵守各项操作指示。

5. 不要在雨水中或潮湿环境中使用本产品。

6. 不要将产品靠近热源安装，例如暖气管、加热器、火炉或其它能产生热量的装置（包括功放机）。

7. 不要破坏极性或接地插头的安全性设置。

如果提供的插头不能插入插座，则应当请专业人员更换插座。

8. 保护好电源线和信号线，不要在上面踩踏或拧在一起（尤其是插头插座及穿出机体以外的部分）。

9. 使用厂商规定及符合当地安全标准的附件。

10.雷电或长时间不使用时请断电以防止损坏产品。

12. 不要让物体或液体落入产品内——它们可能引起火灾或触电。

13. 请注意产品外罩上的相关安全标志。

. 仅与厂商指定或与电器一同售出的推车、架子、三脚架、支架或桌子一起使用。

推动小车/电器时，应谨防翻倒。

11注意事项产品的安装调试须由专业人士操作。

在使用非本厂规定的吊装件时，要保证结构的强度并符合当地的安全规范。

警告：1扬声器及扬声器系统的产品有限保修期为自正式购买日起的3年。

由于用户不合理的应用而导致音圈烧毁或纸盆损坏等故障，不包含于产品保修项目。

产品吊附件(包括音箱装配五金件和吊挂配件)的有限保修期为自正式购买日起的1年。

200703-DIVING-PAM中文操作手册

水下调制荧光仪——DIVING-PAM操作手册2006年11月版泽泉国际集团（香港）有限公司泽泉科技有限公司德国WA L Z 公司中国技术服务中心中国总部：上海市中江路879号天地软件园28幢402-403座（200333）电话：021-********/13/14/15/16/17/18 传真：021-********E-Mail ：sevice@ 网址：北京分部：北京市海淀区花园北路48号院华思特商务楼209室（100083）电话：010-********/53/58，89110167 传真：010-********转20成都分部：成都市人民南路1段97号现代之窗1018室（610016）电话：028-********，86719836 传真：028-********目录1 安全指导...................................................................................................................................- 4 -1.1 一般安全指导................................................................................................................- 4 -1.2 特殊安全指导................................................................................................................- 4 -2 光合作用与叶绿素荧光原理....................................................................................................- 5 -2.1 光合作用基本过程........................................................................................................- 5 -2.2 活体叶绿素荧光..........................................................................................................- 7 -2.2.1 叶绿素荧光的产生............................................................................................- 7 -2.2.2 叶绿素荧光诱导曲线........................................................................................- 8 -2.2.3 调制叶绿素荧光的测量....................................................................................- 8 -2.2.4 光响应曲线和快速光曲线..............................................................................- 10 -2.2.5 叶绿素荧光的暗弛豫......................................................................................- 10 -2.2.6 调制叶绿素荧光成像......................................................................................- 11 -3 DIVING-PAM简介..................................................................................................................- 12 -4 常用荧光参数.........................................................................................................................- 13 -4.1 Fo、Fm和Fv/Fm.........................................................................................................- 13 -4.3 Fm’.................................................................................................................................- 13 -4.3 Ft....................................................................................................................................- 13 -4.4 量子产量Yield.............................................................................................................- 13 -4.5 ETR和PAR..................................................................................................................- 14 -4.6 qP、qN和NPQ............................................................................................................- 14 -5 基础操作步骤.........................................................................................................................- 16 -6 按键操作.................................................................................................................................- 17 -6.1 单键操作......................................................................................................................- 17 -6.2 双键操作......................................................................................................................- 18 -7 数据存储功能.........................................................................................................................- 19 -8 MODE菜单介绍......................................................................................................................- 20 -8.1 MODE界面列表...........................................................................................................- 20 -8.2 MODE界面功能介绍...................................................................................................- 21 -9 DIVING-PAM的组成..............................................................................................................- 28 -9.1 主控单元......................................................................................................................- 28 -9.1.1 荧光的激发与检测............................................................................................- 28 -9.1.2 内置卤素灯.......................................................................................................- 29 -9.1.3 可充电电池.......................................................................................................- 29 -9.1.4 显示器...............................................................................................................- 30 -9.1.5 电子元件...........................................................................................................- 30 -9.1.6 接口介绍...........................................................................................................- 30 -9.2 标准光纤DIVING-PAM/F和微光纤DIVING-PAM/F1...........................................- 32 -9.3 光量子传感器..............................................................................................................- 32 -9.4 深度传感器..................................................................................................................- 33 -9.5 水温传感器..................................................................................................................- 33 -9.6 水下通用样品架DIVING-USH..................................................................................- 33 -9.6.1 介绍...................................................................................................................- 33 -9.6.2 应用方法：叶片状样品....................................................................................- 35 -9.6.3 应用方法：珊瑚、附着藻类等样品................................................................- 36 -9.6.4 应用方法：暗适应后测量Fv/Fm....................................................................- 37 -9.6.5 应用方法：测量叶片状样品吸收到的PAR...................................................- 38 -9.6.6 DIVING-USH的详细配件................................................................................- 39 -9.7 特殊叶夹/样品室.......................................................................................................- 40 -9.7.1 暗适应叶夹DIVING-LC................................................................................- 40 -9.7.2 表面样品室DIVING-SH（适合于珊瑚等0.................................................- 40 -9.7.3 磁性样品架DIVING-MLC（可选）.............................................................- 40 -10 数据传输...............................................................................................................................- 42 -11 通过PC终端控制DIVING-PAM........................................................................................- 43 -12 维护.......................................................................................................................................- 44 -12.1 内置电池的更换......................................................................................................- 44 -12.2 卤素灯的更换..........................................................................................................- 46 -12.3 EPROM的更换........................................................................................................- 47 -12.4 保险丝的更换..........................................................................................................- 47 -12.5 清洁..........................................................................................................................- 47 - 附录1 技术参数......................................................................................................................- 48 - 附录2 警告和错误列表..........................................................................................................- 50 - 附录3 PIN分配.......................................................................................................................- 51 - 附录4 PC终端控制DIVING-PAM的命令列表...................................................................- 52 - 附录5 部分荧光基础理论文献...............................................................................................- 55 - 附录6 部分利用DIVING-PAM发表的文献.........................................................................- 59 -1 安全指导1.1 一般安全指导为避免触电，请不要拆开DIVING-PAM的主机。

UM_FR05_S1_N_0_110

3.2. VSWR Values
Antenna
Z2
Z3
Z1
Z1: Not necessary Z2: L= 7,5 nH Z3: C= 1,2 pF
Graph 1 - VSWR (Voltage Standing Wave Ratio) and Efficiency (%) vs. Frequency (GHz) Note: Matching network values vary depending on the antenna environment. Please contact info@ if support for the integration of the antenna in a specific application is required.
1.0 mm 2.0 mm 4.1 mm
TOP APPLICATIONS USB Dongles Medical Wireless Telephony Sensors (Proximity, etc...) BENEFITS
BOTTOM
Small form factor and footprint Reduced clearance area within PCB Cost-effective Easy to Use (pick and place)
Fractus Micro Reach Xtend™
Bluetooth®, Zigbee®, 802.11 b/g/n WLAN
Chip Antenna
Antenna Part Number: FR05-S1-N-0-110
This product is protected by at least the following patents PAT. US 7,148,850, US 7,202,822 and other domestic and international patents pending. Any update on new patents linked to this product will appear in

SINUMERIK SINUMERIK 840D sl 前置操作面板：OP 015A 设备手册 06

1.4 1.4.1 1.4.1.1 1.4.1.2 1.4.1.3 1.4.1.4 1.4.2 1.4.2.1 1.4.2.2 1.4.2.3 1.4.2.4 1.4.2.5 1.4.2.6 1.4.2.7 1.4.2.8 1.4.2.9 1.4.2.10
联网................................................................................................................................40 系统设置.........................................................................................................................40 采用 SINUMERIK solution line 时的设置........................................................................40 设备网络中的系统启动....................................................................................................42 精简型客户端单元（TCU）............................................................................................43 出厂预设置......................................................................................................................44 调试 TCU........................................................................................................................46 操作 TCU 主菜单............................................................................................................46 操作其他 TCU 菜单.........................................................................................................49 在设备网络中注册 TCU..................................................................................................61 校准触摸面板..................................................................................................................64 连接 SIMATIC Thin Client 触摸面板...............................................................................66 配置 SIMATIC Thin Client 触摸面板...............................................................................67 文件“config.ini”中的设置...............................................................................................69 文件“tcu.ini”中的设置....................................................................................................72 采用 TCU 时的置换机制.................................................................................................79 通过 PLC 禁止 TCU 之间的切换.....................................................................................81

RS04A052L5F

APPROVAL SHEETCustomer InformationCustomer :Part Name : Part No. :Model No. :COMPANY PURCHASE R&DVendor InformationName: RS INDUSTRY LIMITED Part Name Chip ESD Part No. RS 0402-12V2R5SLot No.RS INDU STRY LIMITEDRS Chip Single ESD Suppressor Chip Varistor RS Chip Single Varistor Suppressor RS04A052LAFRS04A052L5F ＴＯ光與電子（香港）有限公司　ＲＳ經銷商1.1 Technology DataSymbol Value Unit Maximum allowable continuous AC voltage at 50-60Hz V RMS 6V Maximum allowable continuous DC voltage V DC12VESD voltage measured ＊1Vv 21~27 VTypical capacitance value measured at 1MHz C 2.5pF Typical capacitance value tolerance 30 % Maximum ESD allowable clamping Voltage ＊2V CLAMP ≦50VLeakage current at V DC ＊3 (At initial state) I LDC < 0.1 uA Leakage current at V DC ＊3 (After ESD Test)I LDCA < 2 uA 1.2 Reference DataResponse timeT rise < 1 ns Operatiog ambient temperature -50～ +85 ℃ Storage temperature-50～+125 ℃ ESD testingIEC61000-4-2 level 4 1.3 Other DataBody ZnOEnd terminationAg/Ni/SnPackaging Reel Complies with Standard IEC61000-4-2Lead Content < 1000 ppm MarkingNoneNotes ：＊ 1 The varistor voltage was measured at 1 mA current＊ 2 The Clamping voltage was measured at 8*20 us standard current. ＊ 3 The Leakage current was measured at working voltage. ＊ 4 The Energy only for customer reference.＊ 5 The components shall be employed within 1 year, in the nitrogen condition.PART NO. RS 0402-12V2R5SRS INDU STRY LIMITED15~20 20PART NO. RS04A052L5F 3.35RS Chip Single Varistor Suppressor Varistor voltage measured Maximum Varistor allowable clamping Voltage2 .SizeModel0402(1005) 0603(1608)0805(2012)1210(3225)1812(4532)1206(3216)2220(5750)Length(L) 1.00 ±0.10 1.60±0.15 2.00±0.20 3.20±0.20 3.20±0.20 4.50±0.20 5.70±0.20Width(W)0.50 ±0.100.80±0.10 1.25±0.15 1.60±0.15 2.50±0.20 3.20±0.20 5.00±0.20Thickness(T)0.60 max0.90 max 1.20 max 1.50 max 1.50 max 2.00 max 2.50 maxTermination(a) 0.25±0.1 0.3±0.1 0.3±0.1 0.5±0.2 0.5±0.20.5+0.3/-0.1 0.5+0.3/-0.1IEC61000-4-2 StandardsSEVERITY LEVEL AIRDIRCHARGEDIRECTDISCHARGE4. Environment Reliability TestCharacteristic Test method and descriptionHigh TemperatureStorageThe specimen shall be subjected to 125 ± 2℃for 1000 ± 12 hours in a thermostaticbath without load and then stored at room temperature and normal humidity for 1 to2 hours. The change of varistor voltage shall be within 10 ﹪.Step Temperature Period1 -40±3℃ 30Min±32 RoomTemperature 1hour3 125±3℃ 30Min±3Temperature CycleThe temperature cycle of specifiedtemperature shall be repeated five timesand then stored at room temperature andnormal humidity for one or two hours. Thechange of varistor voltage shall be within 10﹪and mechanical damage shall beexamined. 4 RoomTemperature 1hourHigh TemperatureLoadAfter being continuously applied the maximum allowable voltage at 85 ± 2℃ for1000± 2 hours, the specimen shall be stored at room temperature and normalhumidity for one or two hours, the change of varistor voltage shall be within 10﹪.Damp Heat Load/Humidity LoadThe specimen should be subjected to 40 ± 2℃, 90 to 95 ﹪RH environment, and themaximum allowable voltage applied for 1000 hours, then stored at room temperatureand normal humidity for one or two hours. The change of varistor voltage shall bewithin 10﹪Low TemperatureStorageThe specimen should be subjected to -40 ± 2℃, without load for 500 hours and thenstored at room temperature for one or two hours. The change of varistor voltage shallbe within 10 ﹪1 2 KV 2 KV2 4 KV 4 KV3 8 KV 6 KV4 15 KV8 KVIEC 61000-4-2 Compliant ESD Current Pulse WaveformRS INDU STRY LIMITEDRS Chip Single Varistor Suppressor3. ESD Wave Form5. Soldering Recommendations 5.1 Recommended solder pad layout（Unit ：mm ）ABCD0402 0.4~0.6 1.4~1.8 0.5~0.6 0.6~1.20603 0.9~1.2 2.7~3.2 0.7~1.0 0.9~1.20805 1.0~1.5 2.6~3.2 1.2~1.5 1.1~1.81206 1.8~2.5 4.2~5.2 1.2~1.8 1.2~1.81210 1.8~2.5 4.2~5.2 2.2~3.0 1.3~2.01812 2.5~3.3 5.5~6.7 2.8~3.6 1.3~2.22220 3.8~4.6 6.6~7.8 4.8~5.5 1.3~2.25.2 The SIR test of the solder paste shall be done 5.3 Steel plate and foot distance printing Foot distance printing (mm)Steel Plate thickness (mm)> 0.65mm0.18mm0.65mm~0.5mm 0.15mm 0.50mm~0.40mm 0.12mm >=0.40 mm0.10mm5.4The IR reflow and temperature of Soldering for Pb Free☆ IR reflow Pb Free Process suggestion profile(1) The solder recommend is Sn96.5/Ag 3.5 of 120 to 150μm(2) Ramp-up rate (217℃ to Peak) + 3℃/second max (3) Temp. maintain at 175 +/-25℃ 180 seconds max (4) Temp. maintain above 217 ℃ 60-150 seconds(5) Peak temperature range 245℃ +20℃/ -10 ℃time within 5 ℃of actually peak temperature(tp) 10~20 seconds(6) Ramp down rate +6 ℃/second max.※Perform adequate test in advance as the reflow temperature profile will vary according to the conditions of the manufacturing process, and the specification of the reflow furnace.5.5 Resistance to soldering heat-High Temperature Resistance:260℃,10sec-3times.5.6 Hand SolderingIn hand soldering of the Varistors. Large temperature gradient between preheated the Varistorsand the tip of soldering iron may cause electrical failures and mechanical damages such ascrackings or breakings of the devices. The soldering shall be carefully controlled and carried out sothat the temperature gradient is kept minimum with following recommended conditions for handsoldering.5.6.1 Recommended Soldering Condition 1（1） Solder ：0.12~0.18mm Thread solder (Sn96.5:Ag3.5) with soldering flux in the core.Rosin-based and non-activated flux is recommended.（2） PreheatingThe Varistors shall be preheated so that Temperature Gradient between the devicesand the tip of soldering iron is 150℃ or below.（3）Soldering IronRated Power of 20w max with 3mm soldering tip in diameter.Temperature of soldering iron tip 380℃max,3-5sec ( The required amount of soldershall be melted in advance on the soldering tip.)（4）CoolingAfter soldering. The Varistors shall be cooled gradually at room ambient temperature.5.6.2 Recommended Soldering Condition 2（Without preheating）（1）Solder iron tip shall not directly touch to ceramic dielectrics.（2）Solder iron tip shall be fully preheated before soldering while soldering iron tip to theexternal electrode of Varistors.5.7 Post Soldering Cleaning5.7.1 Residues of corrosive soldering fluxes on the PC board after cleaning may greatly haveinfluences on the electrical characteristic and the reliability (such as humidity resistance)ofthe Varistors which have been mounted on the board. It shall be confirmed that thecharacteristic and the reliability of the devices are not affected by the applied cleaningconditions.5.7.2. When an ultrasonic cleaning is applied to the mounted Varistors on PC Boards. Followingconditions are recommended for preventing failures or damages of the devices due to thelarge vibration energy and the resonance caused by the ultrasonic waves.（1）Frequency 29MHz max（2）Radiated Power 20w/lithr max（3）Period 5minuets max。

Infrared viewers ABRIS M series instruction 说明书

Manual infrared viewers RoHs Infrared viewers ABRIS M seriesABRM-1300-x ABRM-1700-x ABRM-2000-xPOLYTEC GmbHPolytec-Platz 1 - 7 D -76337 Waldbronn GERMANY Tel: +49 (72 43) 604-1540Fax:+49(7243)69944E-Mail:****************.polytec .deinfrared viewers ContentContent (3)Safety requirements (4)About (4)Applications (5)How does it work? (5)Operation (6)IR viewer in comparison with a CCD camera (8)Visualization of infrared laser beam in “mid-air” (9)The Maintenance instruction (9)Black spots on screen (9)Spectral sensitivity (10)Power density (11)Photosensitivity (12)Technical information (13)Warranty (15)Safety requirements•The customer is responsible for light source safety while using a viewer as a standalone device or integrated into system.•The customer must consider protective measures if necessary.•While assembling or operating viewer, do not stare at the direct laser (or other source) light even with safety goggles.•This device will not protect you from direct or high light radiation. Use viewer with caution and appropriate attenuation•Electrical safety requirements must be complied while operating this device.AboutHigh performance image conversion viewers ABRIS-M, based on high- grade image converter, are designed to observe indirect radiation of infrared laser, light emitting diodes (LED), dye and other IR-sources in 350 - 2000 nm spectral region. The lightweight, compact device can be used hand-held, post mounted with the 1/4-20 internal thread or face-mask mounted for hands free operation.ABRIS-M viewer has better resolution, infrared sensitivity and factor of intensification. Also, it can be used with a CCD camera adapter for PC and video registration of the image.This device allows viewing continuous lasers radiation as well as pulsed lasers radiation with pulse duration from ps to µs without synchronization.Applications•Laser alignment and safety.IR viewers are ideal for alignment of infrared laser beam and optical components in near infrared systems.•Semiconductors wafer inspection.With a microscope adapter IR viewer can be used to view through the surface of silicon and gallium arsenide wafers.•Forensics and art restoration•Photo processing•Thermal imaging•Food sorting•Vein and blood vessel observation under the skin•Fluid inspection How does it work?IR viewer is based on a first-generation high-grade image converter that has an electro-static focusing system, photocathode S-1+ with increasedconcentration of oxygen and screen of type P-20 with maximum of luminescence at 550nm.Infrared viewer focusemitted or re ﬂected light from a chosen subject into the image tube where electron image is generated. When powered (with battery or power supply) the 16-18 kV voltage is generated required to accelerate the electron image into the output phosphor screen. The ﬂuorescent green light output (550 nm) is observed via an adjustable eyepiece lens.Electrostatic lens Visible phosphor screen Photo-cathode surface Imaging optics +HVOperationCAUTION! Do not use the device for direct beam viewing. Long-term over-exposure may cause satiation of screen and decrease of resolution or irreversible reduction of photocathode response.1.Unscrew the lid (1) of the battery compartment and install one AAAsize battery into battery compartment, observing the polarity.2.Screw the handle (7) into the tripod thread ¼ inches (10) in body.3.Take of the lens cover. To switch the unit on, press button (2).NOTE: after switching off, the device continues to work some minutes due to the accumulated power.4.Rotate the ring (3) to focus the lens 1Х (F1.4/25mm). Rotate ring (13) tofocus the lens 2Х(F1.8/50mm). For adjustment of diaphragm (11), release the screw, adjust the diaphragm (11) and tighten the screw. Turn the ring (5) for eyepiece focus adjustment.5.When viewing in near-infrared range, use cut-off filter (4). Whileviewing a reflected radiation, use metallic surface as a reflector. A nypaper surface absorbs the radiation greatly.6.For "goggle" operation, place the IR viewer onto "dovetail” (9) of face-mask and clamp it with screw. Adjust the position with fixing screws for the most convenient operation.Figure 1. ABRIS M 1X viewe r12 21 6 9 7 101.Lid of battery2.Button ON/OFF3.Focusing ring ofF1.4/25mm lens4.IR Filter5.Eyepiece6.Socket 3V7.Handle8.LED9.Dovetail (for face-mask clamping)10.Tripod thread11.Diaphragm12.C-mount ring13.Focusing ring ofF1.8/50mm lensFigure 2. Lenses F1.8/50mm (left) and F1.4/25mm (right)IR viewer in comparison with a CCD cameraCertain models of CCD cameras can be used to observe near-infrared radiation at wavelengths up to 1100 nm. However, because these cameras are designed for optimum performance in the visible wavelength range, as a result, they exhibit mediocre performance in the near-infrared range; image bleeding, blooming, low sensitivity and low contrast are some of the observed characteristics. Image conversion viewers are design to observemuch wider spectrum.Visualization of infrared laser beam in “mid-air”It is a misconception that an IR viewer can be used to view infrared laser beams in “mid-air” (1100 – 2000 nm). However, if dust particles are in the beam path, the beam will become partly visible. Basically, IR viewers can be used to see the projection of the infrared beam spot on a flat diffusing surface such as a white card or metallic surface.The Maintenance instruction1.During IR viewer operation there is no danger of electric shock.2.When brought into a warm room from the cold outside the optical elements may become wet.3.Keep away viewer from mechanical damage and moisture.4.Protect the lenses from dirt. If necessary, clean them with clean soft cloth; remove oiled spots or deposit with cotton wool slightly wetted in rectified alcohol or with alcohol-ether mixture.5.If necessary, unscrew the lens and clean the photocathode window, because dust can be seen through eyepiece.Black spots on screenBlack spots on the screen are cosmetic blemishes in the image converter which do not affect the performance or reliability of an infrared viewers. Some spots are inherent in the manufacturing processes.Spectral sensitivityFigure 3. Spectral sensitivity (Abris M series IR viewers)infrared viewers Power densityApproximate minimum of power densities required to view an infrared laser beam from a one meter distance:Figure 4. Power density (Abris M series IR viewers)PhotosensitivityThe minimum detectable signal for a near-infrared viewer depends on: •Power density;•Wavelength of incident radiation;•Effective aperture of the objective lens;•Distance between observed target and the viewer;•Time duration of the signal (pulsed or continuous);•Reflectivity of the diffusing surface;•Sensitivity of human eye or device used in viewing the output of the IR viewer.Approximate minimum of power densities required for observing an infrared laser source from a distance of one meter:•20 µW/cm2 for a 1060 nm; 500 µW/cm2 for a 1300 nm.The IR viewer with sensitivity 350-2000 nm has the photocathode S-1+ type which contain the increased concentration of oxygen. It increases sensitivity of the photocathode. IR viewer can be used to view 2.0 µm laser beam at minimum power density 2 W/cm2. When operated in the 1500-2000 nm range, IR viewer has a low spectral response, therefore observations can be performed when the following requirements are met:e an IR cut-off filter or interference filter and darken the room toreduce external background;e a metallic surface for observation reflected radiation, as any othermaterial might absorb infrared radiation.Lenses 1X (F1.4/25mm) and 2X (F1.8/50mm) are exchangeable.infrared viewersStandard kit for version 1X includes: • IR viewer; • lens 1X; • C-mount ring; • IR filter; • handle;• battery and case.Standard kit for version 2X includes: • IR viewer; • lens 2X; • macro ring; • IR filter; • handle;• battery and case.Accessories available upon request:• Neutral density filter for lens 1X(3-5% @ 1064nm) • Neutral density filter for lens 2X(3-5% @ 1064nm) • Microscope adapter• Face-mask for hands free operation • IR illuminator (940nm, 850nm)• 1:1 Optical relay lens adapter for c-mount camera • Video adapter VA-1 to Abris • Lens 2X (F1.8/50mm) • Lens 1X(F1.4/25mm) • Macro ring• C-mount ring for any C-mount type lenses • Tripodinfrared viewers WarrantyInfrared viewing device ABRIS M meets specifications of the manufacturer and declared operation.The warranty period of the device is 24 months from the date it was sold to the consumer.Claims not accepted, and warranty repair are not made, because of the improper use or incorrect service and maintenance of product instructions. The company shall not accept warranty claim:-non-authorized alteration,-disassembling of device,-mechanical or any external damages,-if 2 years warranty term has expired.Serial No.Version No.Spectral rangeDate of Invoiceinfrared viewersirviPOLYTEC GmbH Polytec-Platz 1 - 7 D -76337 Waldbronn GERMANY Tel: +49 (72 43) 604-1540Fax:+49(7243)69944E-Mail:****************.polytec.de。

balluff bni iol-709-000-k006 bni iol-710-000-k006

BNI IOL-709-000-K006 BNI IOL-710-000-K006IO-Link Sensor-Hub analogUser’s GuideContent1Notes to the user 21.1Structure of the guide 21.2Typographical conventions 2Enumerations 2 Actions 2 Syntax 2 Cross-references 21.3Symbols 21.4Abbreviations 21.5Divergent views 2 2Safety 32.1Intended use 32.2Installation and startup 32.3General safety Notes 32.4Resistance to Aggressive Substances 3Hazardous voltage 3 3Getting Started 43.1Connection overview 43.2Mechanical connection 53.3Electrical connection 53.4Function ground 53.5IO-Link connection 53.6Digital Sensors 63.7Analogue Sensors 6 4IO-Link Interface 74.1IO-Link Data 74.2Process data inputs 74.3Process data outputs 84.4Parameter data/ On-request data 8Identification data 8 Inversion 9 Switch point enable 9 Switch point 94.5Errors 104.6Events 10 5Technical Data 115.1Dimensions 115.2Mechanical data 115.3Electrical data 115.4Operating conditions 115.5Function indicators 12Module LEDs 12 Digital Input LEDs 12 Analogue Input LEDs 12 6Appendix 136.1Type designation code 136.2Order information 13IO-Link Sensor-HubBNI IOL-709-… / BNI IOL-710-…1 Notes to the user1.1 Structure of theguide The Guide is organized so that the sections build on one another. Section 2 : Basic safety information. …………1.2 Typographicalconventions The following typographical conventions are used in this Guide. EnumerationsEnumerations are shown in list form with bullet points.• Entry 1, • Entry 2.Actions Action instructions are indicated by a preceding triangle. The result of an action is indicated by an arrow.Action instruction 1. Action result.Action instruction 2. SyntaxNumbers:Decimal numbers are shown without additional indicators (e.g. 123),Hexadecimal numbers are shown with the additional indicator hex (e.g. 00hex ).Cross-references Cross-references indicate where additional information on the topic can be found.1.3 SymbolsAttention!This symbol indicates a security notice which most be observed.NoteThis symbol indicates general notes.1.4 AbbreviationsBCD BNI CV DPP I-Port EMC FE IOL LSB MSB SP SPDU VVBinary coded switch Balluff Network InterfaceCurrent Version: BNI IOL 709… Direct Parameter Page Digital input portElectromagnetic Compatibility Function ground IO-LinkLeast Significant Bit Most Significant Bit Switch PointService Protocol Data UnitVoltage version: BNI IOL 710…1.5 Divergent views Product views and images can differ from the specified product in this manual. They serve only as an illustration.2 Safety2.1 Intended use The BNI IOL-… is a decentralized sensor input module which is connected to a host IO-Linkmaster over an IO-Link interface.2.2 Installation andstartup Attention!Installation and startup are to be performed by trained technical personnel only. Skilled specialists are people who are familiar with the work such as installation and the operation of the product and have the necessary qualifications for these tasks. Any damage resulting from unauthorized tampering or improper use shall void warranty and liability claims against the manufacturer. The operator is responsible for ensuring that the valid safety and accident prevention regulations are observed in specific individual cases.2.3 General safetyNotes Commissioning and inspectionBefore commissioning, carefully read the User's Guide.The system must not be used in applications in which the safety of persons depends on the function of the device.Intended useWarranty and liability claims against the manufacturer shall be rendered void by damage from:•Unauthorized tampering•Improper use•Use, installation or handling contrary to the instructions provided in this User's Guide.Obligations of the owner/operator!The device is a piece of equipment in accordance with EMC Class A. This device can produce RF noise. The owner/operator must take appropriate precautionary measures against this for its use. The device may be used only with a power supply approved for this. Only approved cables may be connected.MalfunctionsIn the event of defects and device malfunctions that cannot be rectified, the device must be taken out of operation and protected against unauthorized use.Approved use is ensured only when the housing is fully installed.2.4 Resistance toAggressiveSubstances Attention!The BNI modules always have good chemical and oil resistance. When used in aggressive media (such as chemicals, oils, lubricants and coolants, each in a high concentration (i.e. too little water content)), the material must first be checked for resistance in the particular application. No defect claims may be asserted in the event of a failure or damage to the BNI modules caused by such aggressive media..Hazardous voltage Attention!Disconnect all power before servicing equipment.NoteIn the interest of continuous improvement of the product,Balluff GmbH reserves the right to change the technical data of the product and the content of these instructions at any time without notice.IO-Link Sensor-HubBNI IOL-709-… / BNI IOL-710-…3 Getting Started3.1 Connectionoverview1 Mounting hole2 IO-Link interface3 Analogue input-Port 14 Status-LED: Analogue port5 Analogue input port 36 Status-LED: digital input Pin 27 Digital input port 18 Status-LED: Digital port Pin 49 Digital input port 3 10 Status LED “Power Supply”11 Digital input port 212 Digital input port 013 Analogue input port 214 Analogue input port 015 Label16 Status-LED …COM“17 Function ground connection3 Getting Started3.2 Mechanicalconnection The BNI IOL modules are attached using 3 M4 screws (Item 1, Fig. 3-1/3-2).3.3 Electricalconnection The Sensor Hub modules require no separate supply voltage connection. Power is provided through the IO-Link interface by the host IO-Link Master.3.4 Function groundThe modules are provided with a ground terminal.Connect Sensor Hub module to the ground terminal.NoteThe FE connection from the housing to the machine must be low-impedance and as short as possible.3.5 IO-LinkconnectionThe IO-Link connection is made using an M12 connector (A-coded, male).IO-Link (M12, A-coded, male)Pin Function 1Supply voltage, +24 V, max. 1.6 A 2 - 3 GND, reference potential4 C/Q, IO-Link data transmission channelConnection protection ground to FE terminal, if present. Connect the incoming IO-Link line to the Sensor Hub.NoteA standard sensor cable is used for connecting to the host IO-Link Master.IO-Link Sensor-HubBNI IOL-709-… / BNI IOL-710-…3 Getting Started3.6 Digital Sensors Digital input port (M12, A-coded, female)Pin Function 1 +24 V, 100 mA 2 Standard Input 3 0 V, GND 4 Standard Input 5 -NoteFor the digital sensor inputs follow the input guideline per EN 61131-2, Type 2.3.7 AnalogueSensors Analogue input port (M12, A-coded, female)Pin Function1 +24 V, 100 mA2BNI IOL-709...: 4 - 20 mABNI IOL-710…:n.c. 3 0 V, GND4BNI IOL-710...: 0 - 10 V BNI IOL-709…:n.c 5 FE, function groundNoteUnused I/O port sockets must be fitted with cover caps to ensure IP67 protection rating.NoteOvercurrent (> 25mA) on the BNI IOL-709 Module´s inputs can distort the measurement results of the other channels and it may leads to malfunction..4 IO-Link Interface4.1 IO-Link Data Baudrate COM2 (38,4 kBaud)Frame type 1Minimum cycle time 3 msProcess data cycle 30 ms with minimum cycle time4.2 Process datainputs BNI IOL-710-…/BNI IOL-709-…(Sensor-Hub digital/analog)Process data length 10Byte:Byte 0 Byte 17 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0InputPort7Pin4InputPort6Pin4InputPort5Pin4InputPort4Pin4SwitchPoint1Port3SwitchPoint1Port2SwitchPoint1Port1SwitchPoint1PortInputPort7.Pin2InputPort6.Pin2InputPort5.Pin2InputPort4.Pin2SwitchPoint2Port3SwitchPoint2Port2SwitchPoint2Port1SwitchPoint2PortByte 2 Byte 37 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0Error1Error2Error3MSBAnalogue valueLSBPort 0Byte 4 Byte 57 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0Error1Error2Error3MSBAnalogue valueLSBPort 1Byte 6 Byte 77 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0Error1Error2Error3MSBAnalogue valueLSBPort 2Byte 8 Byte 97 6 5 4 3 2 1 0 7 6 5 4 3 2 1 0Error1Error2Error3MSBAnalogue valueLSBPort 3IO-Link Sensor-HubBNI IOL-709-… / BNI IOL-710-…4 IO-Link InterfaceInput: Input-Signal at Port and PinSwitch Point: The switch point bits show a switch pointoverrun. The switch point can be configuredby parameter ( see 0.0 - “Switch pointenable” and 0.0 - “Switch point”)Analogue value: VV: actual voltage value between0 and 1056 (1Bit = 0.01V)CV: actual current value between0 and 2150 (1Bit = 0.01mA)Error:• Error 1 • Error 2 • Error 3 Overcurrent/short circuit on sensor supply Measurement range overflow Measurement range undercut (only CV)4.3 Process dataoutputsThere are no outputs at BNI IOL-710-... and BNI IOL-709-... modules.4.4 Parameter data/On-request dataDPP SPDU Parameter DatawidthAccess Index Index Sub-indexIdentificationData07hex Vendor ID 2 ByteReadonly 08hex09hex Device ID 3 Byte0A hex0B hex10hex0 Vendor Name 8 Byte11hex0 Vendor text 16 Byte12hex0 Product Name 34 Byte13hex0 Product ID 21 Byte14hex0 Product text 34 Byte16hex Hardware Revision 3 Byte17hex0 Firmware Revision 3 ByteIdentification data Type Device ID VersionBNI IOL-710-000-K006 050201hex Voltage versionBNI IOL-709-000-K006 050202hex Current version4 IO-Link InterfaceDPPSPDUParameter Data width Value rangeDefault- valueIndex Index Sub-index P a r a m e t e r D a t a10hex 40hex640 1-16 Inversion 2 Byte 0000hex …FFFF hex 0000hex 11hex 12hex 41hex650 1-8 Switch point enable 1 Byte 00hex …FF hex 00hex 42hex660 Switch point 1 Port 0 2 Byte 0000hex … 03E8hex 0000hex 43hex670 Switch point 1 Port 1 2 Byte 0000hex … 03E8hex 0000hex 44hex680 Switch point 1 Port 2 2 Byte 0000hex … 03E8hex 0000hex 45hex690 Switch point 1 Port 3 2 Byte 0000hex … 03E8hex 0000hex 46hex700 Switch point 2 Port 0 2 Byte 0000hex … 03E8hex 0000hex 47hex710 Switch point 2 Port 1 2 Byte 0000hex … 03E8hex 0000hex 48hex720 Switch point 2 Port 2 2 Byte 0000hex … 03E8hex 0000hex 49hex73Switch point 2 Port 32 Byte0000hex … 03E8hex0000hexInversionInversion of the input signals:Byte 0Byte 176543217654321I n v e r s i o n P o r t 7 P i n 4I n v e r s i o n P o r t 6 P i n 4I n v e r s i o n P o r t 5 P i n 4I n v e r s i o n P o r t 4 P i n 4I n v e r s i o n S P 1 P o r t 3I n v e r s i o n S P 1 P o r t 2I n v e r s i o n S P 1 P o r t 1I n v e r s i o n S P 1 P o r t 0I n v e r s i o n P o r t 7 P i n 2I n v e r s i o n P o r t 6 P i n 2I n v e r s i o n P o r t 5 P i n 2I n v e r s i o n P o r t 4 P i n 2I n v e r s i o n S P 2 P o r t 3I n v e r s i o n S P 2 P o r t 2I n v e r s i o n S P 2 P o r t 1I n v e r s i o n S P 2 P o r t 0Switch point enableEnable the switch points by setting the enable bitsByte 07654321E n a b l e s w i t c h p o i n t 2 P o r t 3E n a b l e s w i t c h p o i n t 2 P o r t 2E n a b l e s w i t c h p o i n t 2 P o r t 1E n a b l e s w i t c h p o i n t 2 P o r t 0E n a b l e s w i t c h p o i n t 1 P o r t 3E n a b l e s w i t c h p o i n t 1 P o r t 2E n a b l e s w i t c h p o i n t 1 P o r t 1E n a b l e s w i t c h p o i n t 1 P o r t 0Switch pointByte 0Byte 1 7 6 5 4 3217654321Switch pointValue range (dec) CV= 400...2000 VV= 0 (1000)BNI IOL-709-… / BNI IOL-710-…4 IO-Link Interface4.5 Errors Byte 0Byte 1Device application error: 80hex11hex Index not available 12hex Subindex not available 30hex Value out of range4.6 EventsClass/QualifierCode (high + low)Mode Type InstanceP a r a m e t e r D a t aappears Error AL Device Hardware supply Supply low voltage U2 = supply + 24VC0hex 30hex 03hex 5000hex 0100hex 0010hex 0002hex F3hex5112hex disappears ErrorAL Device Hardware supply Supply low voltage U2 = supply + 24V80hex 30hex 03hex 5000hex 0100hex 0010hex 0002hexB3hex 5112hexappears Error AL Device Hardware supply supply peripheryC0hex30hex 03hex 5000hex 0100hex0060hexF3hex 5160hexdisappears ErrorAL Device Hardware supply supply periphery80hex30hex 03hex5000hex0100hex0060hexB3hex5160hex5 Technical Data5.1 Dimensions5.2 Mechanical data Housing Material Plastic, transparentIO-Link-Port M12, A-coded, maleInput-Ports 8x M12, A-coded, femaleEnclosure rating IP67 (only when plugged-in and threaded-in)Weight 90 gDimensions(L × W × H, excluding connector)115 × 50 × 30,8 mm5.3 Electrical data Operating voltage 18 ... 30,2 V DC, per EN 61131-2Ripple < 1 %Current draw without load ≤ 40 mA5.4 Operatingconditions Operating temperature -5 °C … +55 °C Storage temperature -25 °C … +70 °CBNI IOL-709-… / BNI IOL-710-…5 Technical Data5.5 FunctionindicatorsModule LEDs LED 5, IO-Link CommunicationStatus FunctionGreen No CommunicationGreen negative pulsed Communication OKRed Communication line overloadOff Module unpoweredLED 4, Power supply statusStatus FunctionGreen Module power is OKGreen slowly flashing Short circuitGreen rapidly flashing Module power supply < 18 VOff Module unpowered Digital Input LEDs LED 3, Input Pin 4 and LED 2, Input Pin 2Status FunctionYellow Input signal = 1Off Input signal = 0Analogue Input LEDs LED 1, Analogue input portStatus Signal 709 (4-20 mA) Signal 710 (0-10 V) Green ≥ 4 mA - ≤ 20 mA> 0,05 VRed < 4 mA - > 20 mA > 10,05 V6 Appendix6.1 Type designationcode6.2 OrderinformationType Order CodeBNI IOL-709-000-K006 BNI0007BNI IOL-710-000-K006 BNI0008BNI IOL-7xx-000-K006 Balluff Network InterfaceIO-Link interfaceFunctions710 = 8 digital inputs 0,15 A + 4 analog inputs 0 - 10 V709 = 8 digital inputs 0,15 A + 4 analog inputs 4 - 20 mAVariant000 = StandardvarianteMechanical configurationK006 =Plastic housing,Connectors:- BUS and Power supply: 1x M12x1, external thread- Input ports: 8x M12x1, internal threadBNI IOL-709-… / BNI IOL-710-… NotesBalluff GmbHSchurwaldstrasse 973765 Neuhausen a.d.F. GermanyTel. +49 7158 173-0 N r . 910442-726 E •01.125277 • E d i t i o n K 17 • R e p l a c e s E d i t i o n 1311 • S u b j e c t t o m o d i f i c a t i o n。

Presentation Stand ET40 ET45 User Guide

Presentation Stand ET40/ET45User GuideZEBRA and the stylized Zebra head are trademarks of Zebra Technologies Corporation, registered in manyjurisdictions worldwide. All other trademarks are the property of their respective owners. ©2022 ZebraTechnologies Corporation and/or its affiliates. All rights reserved.Information in this document is subject to change without notice. The software described in this documentis furnished under a license agreement or nondisclosure agreement. The software may be used or copiedonly in accordance with the terms of those agreements.For further information regarding legal and proprietary statements, please go to:SOFTWARE: /linkoslegal.COPYRIGHTS: /copyright.WARRANTY: /warranty.END USER LICENSE AGREEMENT: /eula.Terms of UseProprietary StatementThis manual contains proprietary information of Zebra Technologies Corporation and its subsidiaries(“Zebra Technologies”). It is intended solely for the information and use of parties operating andmaintaining the equipment described herein. Such proprietary information may not be used, reproduced,or disclosed to any other parties for any other purpose without the express, written permission of ZebraTechnologies.Product ImprovementsContinuous improvement of products is a policy of Zebra Technologies. All specifications and designs aresubject to change without notice.Liability DisclaimerZebra Technologies takes steps to ensure that its published Engineering specifications and manuals arecorrect; however, errors do occur. Zebra Technologies reserves the right to correct any such errors anddisclaims liability resulting therefrom.Limitation of LiabilityIn no event shall Zebra Technologies or anyone else involved in the creation, production, or delivery of theaccompanying product (including hardware and software) be liable for any damages whatsoever (including,without limitation, consequential damages including loss of business profits, business interruption, or lossof business information) arising out of the use of, the results of use of, or inability to use such product, evenif Zebra Technologies has been advised of the possibility of such damages. Some jurisdictions do not allowthe exclusion or limitation of incidental or consequential damages, so the above limitation or exclusion maynot apply to you.About this Guide (4)Accessories List (4)Notational Conventions (5)Icon Conventions (5)Service Information (5)Getting Started (7)Presentation Stand (7)Cable Routing (8)Mounting the Presentation Stand (9)Installing the Presentation Back (12)Using the Stand (15)Setting the Locking Mode (15)Docking the Tablet (16)Removing the Tablet (17)Adjusting the Stand (18)Presentation Stand API (19)Specifications (20)The Presentation stand charges ET40 and ET45 tables and provides a port to connect an expansion I/Ohub for communication with peripherals.Accessories ListThe following accessories are available for the Presentation stand.Presentation AccessoriesPresentation BackMISC-ET4X-BTDPS-01Use to attach the tablet to the Presentation stand.Charge and Communication CableCBL-ET4X-SCHCAB-01Charging and communication to the Presentation stand.Desktop Mount PlateBRKT-ET4X-DSKPS-01Desktop mounting option for the Presentation stand.Unlocking ToolKT-MC18-CKEY-20Use to manually unlock devices from the stand. Pack of 20.Power SuppliesPower Supply (50 W)PWR-BGA12V50W0WWProvides power to the Presentation Stand.DC Line CordCBL-DC-388A2-01Provides power from the power supply (PWR-BGA12V50W0WW) to the Presentation stand.US AC Line Cord23844-00-00RProvides power to the power supply.Notational ConventionsThe following conventions are used in this document:•Bold text is used to highlight the following:•Dialog box, window, and screen names•Drop-down list and list box names•Checkbox and radio button names•Icons on a screen•Key names on a keypad•Button names on a screen•Bullets (•) indicate:•Action items•List of alternatives•Lists of required steps that are not necessarily sequential.•Sequential lists (for example, those that describe step-by-step procedures) appear as numbered lists. Icon ConventionsThe documentation set is designed to give the reader more visual clues. The following visual indicators areused throughout the documentation set.NOTE: The text here indicates information that is supplemental for the user to know and that isnot required to complete a task.IMPORTANT: The text here indicates information that is important for the user to know.CAUTION: If the precaution is not heeded, the user could receive a minor or moderate injury.WARNING: If danger is not avoided, the user CAN be seriously injured or killed.DANGER: If danger is not avoided, the user WILL be seriously injured or killed.Service InformationIf you have a problem with your equipment, contact Zebra Global Customer Support for your region.Contact information is available at: /support.When contacting support, please have the following information available:•Serial number of the unit•Model number or product name•Software type and version numberZebra responds to calls by email, telephone, or fax within the time limits set forth in support agreements.If your problem cannot be solved by Zebra Customer Support, you may need to return your equipment for servicing and will be given specific directions. Zebra is not responsible for any damages incurred during shipment if the approved shipping container is not used. Shipping the units improperly can possibly void the warranty.If you purchased your Zebra business product from a Zebra business partner, contact that business partner for support.This section describes how to set up the stand.Presentation StandThe Presentation Stand provides the following features:•Power for operating the device.•Charge the device’s battery.•Cable management.•Rotate, tilt, and adjust the height of the stand while the tablet is docked.•Desktop mount.Cable RoutingThe Presentation stand has various cable routing options.If using the charge and communication cable, split the cables apart for easier cable routing.Figure 3 Cable Routing OptionsMounting the Presentation StandUse the Desktop Mount Plate to secure the Presentation stand to a desktop.1.Place the mounting plate on the desktop with the three tabs facing up.2.Install four wood screws.3.Align the front of the stand base with the front of the mounting plate.4.Lower the stand onto the mounting plate.The mounting plate tabs fit inside the square cutouts on the bottom of stand.5.Slide the stand base forward slightly onto the mounting plate.6.Install two M3x5 screws to secure the stand base to the mounting plate.Installing the Presentation BackCAUTION: Power off the device before installing or removing the Presentation back.CAUTION: Do not use any tools for battery cover removal. Puncturing the battery or seal maycause a hazardous condition and a potential risk of injury.1.Remove battery cover and store in safe place.2.Insert the tabbed end of the Presentation back into the slots in the battery well (1).3.Rotate the cover down (2).4.Carefully press down around the edges of the cover. Make sure that the cover is seated properly.ing a T5 Torx screwdriver, secure the Presentation back to device using four M2 screws. Torque to0.43N-m.This section describes how to use and adjust the stand.Setting the Locking ModeConfigure the Presentation stand to automatically lock or always remain unlocked using the Anti-lockingswitch.•Slide the Anti-Locking switch (1) up to enable auto-lock mode.The Locking LED is only on when the tablet is in the stand and unlocked.•Slide the Anti-Locking switch down to enable always unlocked mode.The Locking LED is always on and the tablet is never locked in the stand.Docking the Tablet1.Align the back of the device with the slot on the Presentation Stand.2.Gently push the tablet down until it clicks.If the stand is in auto-lock mode, the tablet locks in the stand and the Locking LED on the base turns off.If the stand is in always unlocked mode, the Locking LED on the stand remains illuminated and thetablet is not locked in the stand.Removing the TabletWhen the stand is in auto-lock mode, you need to unlock the tablet to remove it from the stand.•Unlock the tablet by touching an on-screen unlock button. For more information, see Presentation Stand API on page 19.•If there is no power to the stand or you cannot turn on the tablet, manually unlock the tablet by inserting the release key (1) all the way into the release slot (2).Adjusting the StandAdjust the height and viewing angle of the tablet using the Presentation stand.•Gently tilt the screen up or down to adjust the viewing angle.•Lift the height adjustment lever (1), adjust the height of the stand (2), then press the lever all the way down to lock the position (3).Presentation Stand APIUse the API for the Presentation stand to lock or unlock the tablet and customize presentation mode. Fordetailed API information, refer to .The information displayed on the screen can change based on the rotation of the Presentation stand.This section provides detail specifications for the Presentation stand. Table 1 Presentation Stand。

荧光体视显微镜M205FA操作规程

荧光体视显微镜（M205FA）操作规程1.开总电源，打开显微镜电源开关由“O”至“I”，开关在显微镜主机的背部如图1。

图1 如需使用荧光观察，打开荧光电源开关“O”至“I”，开关在荧光电源前面如图2。

图22.打开电脑开关，打开电脑LASX软件。

3.观察成像操作流程1)操作按钮简介显微镜操作屏幕上四个黑色按钮从左到右（图3），依次图3为向上调焦粗调按钮（1），向下调焦粗调按钮（2），RL 1 2 3 4 开关（3），FL挡板开关（4）。

显微镜旁操作按钮（图4）下层黑色圆形按钮，用于调节放大倍数，上层的用于细微聚焦。

表面的白色圆圈用于荧光滤片切换。

图4 2)明场观察及成像打开RL开关,光路切换至显微镜（VIS状态，图5），低倍下观察样品，通过粗、细调焦旋钮聚焦，然后调至高倍，准备拍照，首先光路切换至相机（由VIS转至DOC）。

打开软件后，先点击软件界面图5左上角的“Projects”，新建一个project文件夹，并重新命名。

点“Acquisition”，明场照相选择彩色模式，打开明场光源-软件上“RL Light”，点击“live”进入预览模式，通过调节光亮度、曝光时间、增益调节图像。

在图像采集前，先点“Pause”，停止预览模式，点击“single image”,进行图像采集。

3)荧光观察及成像打开显微镜操作屏上荧光挡板（FL挡板），光路切换至显微镜（VIS状态），选择合适的滤块，在显微镜下找到图像，调整好图像，关闭荧光挡板，光路转到相机，打开软件后，荧光照相使用黑白模式,选择伪彩颜色，双击图6中蓝色箭头所指的部分，图6弹出一系列的颜色条，根据荧光滤块,选择相应的颜色（如绿色荧光，选绿色）。

打开荧光光源-软件上“IL Light”，点击“live”进入预览模式，通过调节曝光时间，增益，荧光强度来调节图像，通常情况下，拍摄荧光样品时曝光时间和增益都要调大点，但曝光时间不超过1秒。

图像达到要求后，点击“Pause”，退出图像预览，点击“single image”，进行照相。

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Report from the Coalition Battle Coalition Battle Management Language
Division Mission
Tasks to Subordinates
On order Follows and Assumes (B-M-
BLUE-ARMOR-BDE1On order Attacks BLUE-MECH-BDE2On order Attacks BLUE-MECH-BDE1When What Who
C-BML C-BML, MSDL MSDL <Initialize><WHAT>TANK <WHERE> POS <WHEN> TIME <RUN ON>
Simulation X <EXECUTE> A Series of C-BML orders Infrastructure Software e.g. Middleware C4I
Real C4I
Model Unit
Model
Soldier Model Robotic Force
Tank Real
Evaluation
Intention Situation Object
Signal
Backup
HLA Opportunity in Phase 1 C–BML: C2IEDM and BOMs
Difficult to represent C2IEDM in HLA – Opportunity to partition C2IEDM into BOMs
Exploit BOM Conceptual Model Capability Define BOM Object Model Definitions (HLA OMT constructs) Results in reusable C2IEDM mappings Leverage BOMs to create BOM Assembly Use BOM Assemblies to generate FOMs

FOCUS ON FUNDAMENTAL ELEMENTS OF THE BATTLEFIELD • Facility, Feature, Materiel, Organization, Person Representation both generic (by class) and specific (by item) • Location and geometry • Relationships between items (e.g., unit to unit) • Activities • FOCUS ON BATTLEFIELD ACTIVITY • Objects serve as resources and objectives: “Use these objects against these objects this way” • Represents Events, Plans, Orders, and Requests • Activities can be grouped and structured to specify sub-activities, modifications, and (time) dependence
Could Explore / Test with an initial Use Case
C2 Reports (Input C2IEDM Spot Reports to Sim) C2 Orders (Compose C2IEDM/C-BML Orders for Sim) Initialization (Initialize Sim using Scenario data from C2IEDM and MSDL)
BOMs are a natural way to package C2IEDM "functionality" for HLA environments
11

C-BML and MSDL Capabilities
C-BML Capabilities • Unambiguous language for orders,
reports, and situational awareness. • Used to communicate between humans, robotics, and simulations within and between echelons. • Leverages common tasking language grammar developed by MSDL & BML participants. • Supports all phases of military operations: planning, execution, and review. • Supports multiple doctrines. • Provides a standard data representation using the C2IEDM. • Provides an unambiguous vocabulary across the international C4I domain. • Includes a reference implementation and recommended practices for message distribution.
Common Capabilities
• Support for simulation preinitialization phase (operational planning phase). • Common tasking language grammar shared between MSDL & BML allows for consistent data interchange for simulation initialization. • Common vocabulary across the international C4I domain. • Supports multiple doctrines.
MSDL Capabilities • Unambiguous language to represent military scenario data and file transmittal format for simulation initialization.
• Provides military scenario information that is simulation independent in format and content. • Leverages common tasking language grammar developed by MSDL & BML participants. • Supports activities leading up to the simulation initialization phase. • Supports multiple doctrines. • Provides a standard interchange representation using XML. • Leverages C-BML vocabulary across the international C4I domain. • Includes a reference implementation.
September 2005
05S-SIW-041
23
12

。