M38236GF-XXXFP中文资料
CPU供电常识
R后面的数字是电感量,单位是微亨。R50是0.5,R25是0.25,R68是0.68 电感量的取值与PWM和MOSFET工作频率,电路的纹波电流等因素都有一定的 关系,设计时需要按公式计算。
Page 7 of
识别CPU供电电路的元件
电容:滤波和蓄电池
富士通固态电容
日本化工固态电容
电感输出的电流对电容充电,经过电容的电流被滤波,滤出一些交流成分,电 流曲线更平滑。 电容可以充电/放电,就像一个大的蓄电池,存储电能。经过电感的电流给电容 充电。当CPU负载瞬时增大,电容可以瞬时提供大电流(MOSFET和电感的反 应时间较慢)。 供电电路的电容是电解电容。以前常用的是液态铝电解电容(导电的电解液是液 态的),当电容长期工作在高温状态下,电解液会热膨胀,发生爆裂。 现在常用的固态铝电解电容(导电的是固态高分子聚合物),热膨胀系数很小, 不会发生爆裂。
Page 13 of
单相供电电路工作原理
电容的滤波效果
输出的不是平稳的1.2V的直流 是0V-1.2V-0V的脉动直流。
经电容存储和滤波后,脉动的幅度减小 接近恒稳的1.2V直流。
Page 14 of
单相供电电路工作原理
PWM芯片的原理
CPU VID:每颗CPU都有电压识别针脚, 5-8根。VID针脚的编码定义了CPU的电压。 PWM读取VID针脚的代码,知道这颗CPU的 电压。 然后按VID确定输出的脉冲宽度(占空比) 调制MOSFET的开关时间和时序。 监控电感输出的电压、电流,随时调整。 过电压保护防止过高的电压。
Page 17 of
多相供电原理
4相供电的输出
输出电压 无输出
左图是示波器抓取的 4相供电输出波型 棕、蓝、粉、绿代表 1、2、3、4相 凸起的脉冲表示这一相 正在工作,有输出电压 低平线段表示这一相在 休息,无电压输出 4相不是同时工作,是 按一定顺序轮流工作, 目的是降低纹波电压和 MOSFET发热量 假设4相工作1秒,每1相 工作1/4秒,休息3/4秒
三极管 MMBT3906 中文规格参数资料
2000 Apr 11
2
Philips Semiconductors
Product specification
PNP switching transistor
THERMAL CHARACTERISTICS SYMBOL Rth j-a Note 1. Transistor mounted on an FR4 printed-circuit board. CHARACTERISTICS Tamb = 25 °C unless otherwise specified. SYMBOL ICBO IEBO hFE PARAMETER collector cut-off current emitter cut-off current DC current gain CONDITIONS IE = 0; VCB = −30 V IC = 0; VEB = −6 V VCE = −1 V; (see Fig.2) IC = −0.1 mA IC = −1 mA IC = −10 mA IC = −50 mA IC = −100 mA VCEsat VBEsat Cc Ce fT F collector-emitter saturation IC = −10 mA; IB = −1 mA voltage IC = −50 mA; IB = −5 mA base-emitter saturation voltage collector capacitance emitter capacitance transition frequency noise figure IC = −10 mA; IB = −1 mA IC = −50 mA; IB = −5 mA IE = ie = 0; VCB = −5 V; f = 1 MHz IC = −10 mA; VCE = −20 V; f = 100 MHz 60 80 100 60 30 − − − − − 250 − − − − MIN. PARAMETER thermal resistance from junction to ambient CONDITIONS note 1 VALUE 500
SST38LF6401RT 4M ×16 CMOS Advanced Multi-Purpose F
SummaryThe SST38LF6401RT is a 4M ×16 CMOS Advanced Multi-Purpose Flash Plus (Advanced MPF+) upgraded for space applications. It is manufactured with SST proprietary, high-performance CMOS SuperFlash ® technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST38L-F6401RT writes (program or erase) with a 3.0V to 3.6V power supply. This device conforms to JEDEC standard pin assignments for ×16 memories.SST38LF6401RT Parallel Rad Tolerant Flash MemoryFeatures• Density: 64 Mbit• Read access time: 90 ns • Page size (bytes): 8• Temperature range: –55°C to +125°C • Endurance: 10,000 cycles • Organized as 4M ×16• Single voltage read and write operations : 3.0V to 3.6V • Superior reliability, endurance: up to 10,000 cycles mini-mum, greater than 100 years data retention•Low-power consumption (typical values at 5 MHz)• Active current: 4 mA (typical)• Standby current: 3 µA (typical)• Auto low-power mode: 3 µA (typical)• 128-bit unique ID• Security-ID feature, 256 word, user one-time programmable• Protection and security features, hardware boot block protection/WP# input• Hardware Reset Pin (RST#)•Fast read and page read access times: 90 ns page read access times, 4-word page read buffer• Latched address and data• Fast erase times: sector-erase time: 18 ms (typical), block-erase time: 18 ms (typical), chip-erase time: 40 ms (typical)• Erase-suspend/resume capabilities• Fast word and write-buffer programming times:• Word-program time: 7 µs (typical)• Write buffer programming time: 1.75 µs/word(typical)• 16-word write buffer• Automatic write timing: internal V pp generation• End-of-write detection, toggle bits, data# polling, ry/by# output• CMOS I/O compatibility• JEDEC standard, Flash EEPROM pinouts and command sets• Pin, uniform (32 KWord) and non-uniform (8 KWord) op-tions available, user-controlled individual block (32 KWord) protection, using software only methods • Password protection • CFI Compliant•Packages available: 48-lead TSOP ceramic or plasticThe Microchip name and logo, the Microchip logo and SuperFlash are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. All other trademarks mentioned herein are property of their respective companies.© 2020, Microchip Technology Incorporated. All Rights Reserved. 11/20 DS00003649AWhat is SuperFlash Technology?SuperFlash Technology is an innovative, highly reliable and versatile type of NOR Flash memory invented by Silicon Storage Technology (SST, which is owned by Microchip). SuperFlash memory is much more flexible and reliable than competing non-volatile memories. This technology utilizes a split-gate cell architecture which uses a robust thick-oxide process that requires fewer mask steps resulting in a lower-cost nonvolatile memory solution with excellent data retention and higher reliability.Advantages of SuperFlash Technology• Fast, fixed program and erase times (typical chip-erase time: 40 ms)• No pre-programming or verify required prior to erase (Results in significantly lower power consumption)• Superior reliability (10K cycles and 100 years data retention)• Inherent small sector size (4 KB erase sector vs. 64 KB), results in faster re-write operations and contributes to lowering overall power consumptionSpace Environment• Full wafer lot traceability• 48-lead hermetic ceramic dual flat package (CDFP)• Space-grade screening and qualification (QML and ESCC flow)• T otal ionizing dose: better than 50 Krad, (biased & unbiased) • Heavy ions and protons tested• Single event latch-up immune with a LET > 78 MeV .cm²/mg • Full SEU characterization• No SEU corruption up to 46 MeV .cm²/mgFunctional Block Diagram®。
M63823FP资料
7.2k 3k
GND
The seven circuits share the COM and GND The diode, indicated with the dotted line, is parasitic, and cannot be used.
Unit : Ω
ABSOLUTE MAXIMUM RATINGS
q q q q q
PIN CONFIGURATION
IN1→ 1 IN2→ 2 IN3→ 3 INPUT IN4→ 4 IN5→ 5 IN6→ 6 IN7→ 7 GND
8 16 →O1 15 →O2 14 →O3 13 →O4 12 →O5 11 →O6 10 →O7 9
OUTPUT
→COM COMMON
Jan. 2000
元器件交易网
MITSUBISHI SEMICONDUCTOR <TRANSISTOR ARRAY>
M63823P/FP/GP
7-UNIT 500mA DARLINGTON TRANSISTOR-ARRAY WITH CLAMP DIODE
TYPICAL CHARACTERISTICS
M63823P/FP/GP
7-UNIT 500mA DARLINGTON TRANSISTOR-ARRAY WITH CLAMP DIODE
RECOMMENDED OPERATING CONDITIONS (Unless otherwise noted, Ta = –40 ~ +85°C)
Symbol VO Output voltage Collector current (Current per 1 circuit when 7 circuits are coming on simultaneously) Duty Cycle P : no more than 8% FP : no more than 5% GP : no more than 4% Duty Cycle P : no more than 30% FP : no more than 20% GP : no more than 15% IC ≤ 400mA IC ≤ 200mA Parameter Limits min 0 0 typ — — max 50 400 mA 0 3.85 3.4 0 — — — — 200 25 25 0.6 Unit V
HPMLDL系列服务器
HPMLDL系列服务器hpML系列服务器HP ProLiant ML110G7(C8R00A)参数规格差不多参数产品类型工作组级产品类别塔式产品结构4U处理器CPU类型奔腾双核CPU型号奔腾双核G860CPU频率3GHzHP ProLiant ML330 G6(600911-AA1)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核HP ProLiant ML330 G6(B9D22A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强5600 CPU型号Xeon E5606CPU频率 2.13GHz标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存8MB总线规格QPI 4.8GT/sHP ProLiant ML330 G6(600911-AA1)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核HP ProLiant ML350 G6(638180-AA1)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5606CPU频率 2.13GHz标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存8MB总线规格QPI 4.8GT/sCPU核心四核CPU线程四线程数主板HP ProLiant ML350 G6(600431-AA5)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核CPU线程八线程数HP ProLiant ML350 G6(594869-AA1)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强5600CPU型号Xeon E5620CPU频率 2.4GHz智能加速主2.666GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存12MB总线规格QPI 5.86GT/sCPU核心四核CPU线程八线程数HP ProLiant ML310e Gen8(686146-AA5)参数规格差不多参数产品类型企业级产品类别塔式产品结构4U处理器CPU类型Intel 至强E3-1200 v2 CPU型号Xeon E3-1220 v2CPU频率 3.1GHz标配CPU1颗数量最大CPU4颗数量制程工艺22nm三级缓存8MB总线规格DMI 5GT/sHP ProLiant ML310e Gen8(686147-AA5)参数规格差不多参数产品类型企业级产品类别塔式产品结构4U处理器CPU类型Intel 至强E3-1200 v2 CPU型号Xeon E3-1240 v2CPU频率 3.4GHz智能加速主3.8GHz频标配CPU1颗数量最大CPU4颗数量制程工艺22nm三级缓存8MBHP ProLiant ML350e Gen8(C3Q10A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2403CPU频率 1.8GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存10MB总线规格QPI 6.4GT/sHP ProLiant ML350e Gen8(C3Q08A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2407CPU频率 2.2GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存10MB总线规格QPI 6.4GT/sHP ProLiant ML350e Gen8(C3Q09A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2420CPU频率 1.9GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存15MB总线规格QPI 6.4GT/sHP ProLiant ML350e Gen8(C3F91A)参数规格差不多参数产品类型企业级产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2400 CPU型号Xeon E5-2430CPU频率 2.2GHz标配CPU1颗数量最大CPU4颗数量制程工艺32nm三级缓存15MB总线规格QPI 6.4GT/sHP ProLiant ML350p Gen8(646675-AA1)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2600 CPU型号Xeon E5-2609CPU频率 2.4GHz标配CPU1颗数量最大CPU2颗数量制程工艺32nm三级缓存10MB总线规格QPI 6.4GT/sHP ProLiant ML350p Gen8(668271-AA5)参数规格差不多参数产品类别塔式产品结构5U处理器CPU类型Intel 至强E5-2600 CPU型号Xeon E5-2620CPU频率2GHz智能加速主2.5GHz频标配CPU1颗数量最大CPU2颗数量制程工艺32nm。
hp_2U
HP ProLiant DL380 G7(589152-AA1) 1.84基本参数产品类别 机架式产品结构 2U处理器CPU类型 Intel 至强5600CPU型号 Xeon E5620CPU频率 2.4GHz智能加速主频 2.666GHz标配CPU数量 1颗最大CPU数量 2颗制程工艺 32nm三级缓存 12MB总线规格 QPI 5.86GT/sCPU核心 四核CPU线程数 八线程主板扩展槽 最多6个内存内存类型 DDR3内存容量 6GB内存插槽数量 18最大内存容量 192GB存储硬盘接口类型 SATA/SAS标配硬盘容量 标配不提供最大硬盘容量 8TB热插拔盘位 支持热插拔RAID模式 1个智能阵列 P410i/256MB光驱 标配不提供网络网络控制器 2个NC382i 双端口千兆网卡管理及其他系统管理 iLO 3电源性能电源类型 热插拔电源电源数量 1个电源功率 460WHP ProLiant DL380 G7(583917-B21)1.5基本参数产品类别 机架式产品结构 2U处理器CPU类型 Intel 至强5600CPU型号 Xeon E5620CPU频率 2.4GHz智能加速主频 2.666GHz标配CPU数量 1颗最大CPU数量 2颗制程工艺 32nm三级缓存 12MB总线规格 QPI 5.86GT/sCPU核心 四核CPU线程数 八线程主板扩展槽 最多6个内存内存类型 DDR3内存容量 2GB内存描述 1×2GB PC3-10600E ECC内存内存插槽数量 18最大内存容量 192GB存储硬盘接口类型 SATA/SAS标配硬盘容量 标配不提供内部硬盘架数 最大支持6块LFF热插拔硬盘热插拔盘位 支持热插拔RAID模式 1个集成Smart Array P410i智能阵列控制器,无缓存光驱 薄型SATA DVD-RW网络网络控制器 2个NC382i 双端口千兆网卡管理及其他系统管理 HP Insight Control套件24x7支持iLO 3电源性能电源类型 热插拔高效电源电源数量 1个电源功率 460WHP ProLiant DL380 G7(583914-B21)3.39基本参数产品类别 机架式产品结构 2U处理器CPU类型 Intel 至强5600CPU型号 Xeon E5620CPU频率 2.4GHz智能加速主频 2.666GHz标配CPU数量 2颗最大CPU数量 2颗制程工艺 32nm三级缓存 12MB总线规格 QPI 5.86GT/sCPU核心 四核CPU线程数 八线程主板扩展槽 最多6个内存内存类型 DDR3内存容量 12GB内存描述 6×2GB内存插槽数量 18最大内存容量 192GB存储标配硬盘容量 584GB硬盘描述 4块146GB 2.5英寸硬盘内部硬盘架数 最大支持16块SAS/SATA(SFF)硬盘热插拔盘位 支持热插拔RAID模式 1个集成的智能阵列 P410i,256M缓存光驱 DVD网络网络控制器 2个NC382i 双端口千兆网卡管理及其他系统管理 带iLO高级软件包的 Insight Control (iLO 3)电源性能电源类型 热插拔电源电源数量 2个电源功率 460WHP ProLiant DL380 G7(583966-AA1) 4.05基本参数产品类别 机架式产品结构 2U处理器CPU类型 Intel 至强5600CPU型号 Xeon X5650CPU频率 2.66GHz智能加速主频 3.066GHz标配CPU数量 2颗最大CPU数量 2颗制程工艺 32nm三级缓存 12MB总线规格 QPI 6.4GT/sCPU核心 六核CPU线程数 12线程主板扩展槽 最多6个内存内存类型 DDR3内存容量 12GB内存插槽数量 18最大内存容量 192GB存储硬盘接口类型 SATA/SAS标配硬盘容量 标配不提供最大硬盘容量 8TB热插拔盘位 支持热插拔RAID模式 1个智能阵列 P410i/1GB FBWC光驱 薄型SATA DVD-RW网络网络控制器 2个NC382i 双端口千兆网卡管理及其他系统管理 HP Insight Control套件24x7支持iLO 3电源性能电源类型 热插拔电源电源数量 2个电源功率 750WHP ProLiant DL380 G7(583970-AA1) 4.49基本参数产品类别 机架式产品结构 2U处理器CPU类型 Intel 至强5600CPU型号 Xeon X5660CPU频率 2.8GHz智能加速主频 3.2GHz标配CPU数量 2颗最大CPU数量 2颗制程工艺 32nm三级缓存 12MB总线规格 QPI 6.4GT/sCPU核心 六核CPU线程数 12线程主板扩展槽 最多6个内存内存类型 DDR3内存容量 12GB内存插槽数量 18最大内存容量 192GB存储硬盘接口类型 SATA/SAS标配硬盘容量 标配不提供最大硬盘容量 8TB热插拔盘位 支持热插拔RAID模式 1个智能阵列 P410i/1GB FBWC光驱 薄型SATA DVD-RW网络网络控制器 2个NC382i 双端口千兆网卡管理及其他系统管理 HP Insight Control套件24x7支持iLO 3电源性能电源类型 热插拔电源电源数量 2个电源功率 750WHP ProLiant DL388 G7(QP854A)1.65基本参数产品类别 机架式产品结构 2U处理器CPU类型 Intel 至强5600CPU型号 Xeon E5606CPU频率 2.13GHz标配CPU数量 1颗最大CPU数量 2颗制程工艺 32nm三级缓存 8MB总线规格 QPI 4.8GT/sCPU核心 四核CPU线程数 四线程主板扩展槽 6内存内存类型 DDR3内存容量 2GB内存描述 PC3-10600R RDIMM DDR3 或 PC3-10600E UDIMM DDR3内存插槽数量 18最大内存容量 192GB存储硬盘接口类型 SATA/SAS标配硬盘容量 标配不提供最大硬盘容量 8TB内部硬盘架数 最大支持8块SFF SATA/SAS硬盘热插拔盘位 支持热插拔RAID模式 P410i控制器网络网络控制器 两个NC382i 双端口千兆网卡管理及其他系统管理 iLO 3电源性能电源功率 460W外观特征产品尺寸 85.9×660.7×445.4mm电话备注 周一到周五:8:30-18:00(节假日休息)详细内容 保修于指定日期开始和结束。
HP Color LaserJet CB382A-AC-YC 黄色打印筒说明 说明书
SAFETY DATA SHEET1. IdentificationProduct identifier HP Color LaserJet CB382A-AC-YC Yellow Print CartridgeOther means of identification Not available.Recommended use This product is a yellow toner preparation that is used in HP Color LaserJet CP6015, CP6030 MFP,and CM6040 MFP series printers.Recommended restrictions None known.Company identification HP1501 Page Mill RoadPalo Alto, CA 94304-1112United StatesTelephone 650-857-5020HP health effects line(Toll-free within the US) 1-800-457-4209(Direct) 1-760-710-0048HP Customer Care Line(Toll-free within the US) 1-800-474-6836(Direct) 1-208-323-25512. Hazard(s) identificationNot classified.Physical hazardsNot classified.Health hazardsNot classified.Environmental hazardsNot classified.OSHA defined hazardsLabel elementsNone.Hazard symbolSignal word None.Hazard statement Not available.Precautionary statementPrevention Not available.Response Not available.Storage Not available.Disposal Not available.Hazard(s) not otherwise classified (HNOC)None of the other ingredients in this preparation are classified as carcinogens according to ACGIH, EU, IARC, MAK, NTP or OSHA.Supplemental information This product is not classified as hazardous according to OSHA CFR 1910.1200 (HazCom 2012).3. Composition/information on ingredientsMixturesCAS number% Chemical name Common name and synonymsTrade Secret Styrene acrylate copolymer<85Wax Trade Secret Wax<15Pigment Trade Secret Pigment<5Amorphous silica7631-86-9 Amorphous silica<24. First-aid measuresInhalation Move person to fresh air immediately. If irritation persists, consult a physician.Skin contact Wash affected areas thoroughly with mild soap and water. Get medical attention if irritationdevelops or persists.Eye contact Do not rub eyes. Immediately flush with large amounts of clean, warm water (low pressure) for atleast 15 minutes or until particles are removed. If irritation persists, consult a physician.Ingestion Rinse mouth out with water. Drink one to two glasses of water. If symptoms occur, consult aphysician.Most importantsymptoms/effects, acute anddelayedNot available.5. Fire-fighting measuresSuitable extinguishing media CO2, water, or dry chemicalUnsuitable extinguishingmediaNone known.Specific hazards arising fromthe chemicalNot applicable.Special protective equipmentand precautions forfirefightersNot available.Fire-fightingequipment/instructionsIf fire occurs in the printer, treat as an electrical fire.Specific methods None established.6. Accidental release measuresPersonal precautions,protective equipment andemergency proceduresMinimize dust generation and accumulation.Methods and materials forcontainment and cleaning upNot available.Environmental precautions Do not flush into surface water or sanitary sewer system. See also section 13 Disposalconsiderations.7. Handling and storagePrecautions for safe handling Keep out of the reach of children. Avoid inhalation of dust and contact with skin and eyes. Use withadequate ventilation. Keep away from excessive heat, sparks, and open flames.Conditions for safe storage, including any incompatibilities Keep out of the reach of children. Keep tightly closed and dry. Store at room temperature. Store away from strong oxidizers.8. Exposure controls/personal protectionOccupational exposure limitsUS. NIOSH: Pocket Guide to Chemical HazardsValueComponents TypeTWA 6 mg/m3Amorphous silica (CAS7631-86-9)Biological limit values No biological exposure limits noted for the ingredient(s).Exposure guidelines USA OSHA (TWA/PEL): 15 mg/m3 (Total Dust), 5 mg/m3 (Respirable Fraction)ACGIH (TWA/TLV): mg/m3 (Inhalable Particulate), 3 mg/m3 (Respirable Particulate)Amorphous silica: USA OSHA (TWA/PEL): 20 mppcf 80 (mg/m3)/%SiO2, ACGIH (TWA/TLV): 10mg/m3TRGS 900 (Luftgrenzwert) - 10 mg/m3 (Einatembare partikel), 3 mg/m3 (Alveolengängige fraktion)UK WEL: 10 mg/m3 (Respirable Dust), 5 mg/m3 (Inhalable Dust)Appropriate engineeringcontrolsUse in a well ventilated area.Individual protection measures, such as personal protective equipment Eye/face protection Not available.Skin protectionHand protection Not available.Other Not available.Respiratory protection Not available.Thermal hazards Not available.9. Physical and chemical propertiesAppearance Fine powderPhysical state Solid.Color YellowOdor Slight plastic odorOdor threshold Not available.pH Not applicableMelting point/freezing point Not available.Initial boiling point andNot applicableboiling rangeFlash point Not applicableEvaporation rate Not applicableFlammability (solid, gas)Not available.Upper/lower flammability or explosive limitsFlammability limit - lowerNot flammable(%)Not available.Flammability limit -upper (%)Not available.Explosive limit - lower(%)Explosive limit - upperNot available.(%)Vapor pressure Not applicableSolubility(ies)Solubility (water)Negligible in water. Partially soluble in toluene and xylene. Partition coefficientNot available.(n-octanol/water)Auto-ignition temperature Not applicableDecomposition temperature Not available.Viscosity Not applicableOther informationPercent volatile0 % estimatedSoftening point212 - 302 °F (100 - 150 °C)Specific gravity 1 - 1.210. Stability and reactivityReactivity Not available.Chemical stability Stable under normal storage conditions.Will not occur.Possibility of hazardousreactionsConditions to avoid Imaging Drum: Exposure to lightIncompatible materials Strong oxidizersHazardous decompositionCarbon monoxide and carbon dioxide.productsSymptoms related to the physical, chemical andtoxicological characteristics Not available.Information on toxicological effectsAcute toxicityBased on available data, the classification criteria are not met.Skin corrosion/irritation Based on available data, the classification criteria are not met.Serious eye damage/eye irritationBased on available data, the classification criteria are not met.Respiratory or skin sensitizationRespiratory sensitization Based on available data, the classification criteria are not met.Skin sensitization Based on available data, the classification criteria are not met.Germ cell mutagenicity Negative, does not indicate mutagenic potential (Ames Test: Salmonella typhimurium)Based on available data, the classification criteria are not met.Carcinogenicity Based on available data, the classification criteria are not met.Reproductive toxicity Based on available data, the classification criteria are not met.Specific target organ toxicity - single exposureBased on available data, the classification criteria are not met.Specific target organ toxicity - repeated exposure Based on available data, the classification criteria are not met.Aspiration hazard Based on available data, the classification criteria are not met.Further information Complete toxicity data are not available for this specific formulationRefer to Section 2 for potential health effects and Section 4 for first aid measures.Test ResultsComponentsSpeciesAmorphous silica (CAS 7631-86-9)LD50Mouse OralAcute> 15000 mg/kg Rat> 22500 mg/kg12. Ecological informationEcotoxicityProductTest ResultsSpeciesCB382A-AC-YCAquatic LL50Fish> 100 mg/l, 96 HoursRainbow TroutPersistence and degradability Not available.Bioaccumulative potential Not available.Mobility in soil Not available.Other adverse effectsNot available.13. Disposal considerationsDisposal instructionsDo not shred toner cartridge, unless dust-explosion prevention measures are taken. Finelydispersed particles may form explosive mixtures in air. Dispose of in compliance with federal, state,and local regulations.HP's Planet Partners (trademark) supplies recycling program enables simple, convenient recycling of HP original inkjet and LaserJet supplies. For more information and to determine if this service is available in your location, please visit /recycle.14. Transport informationFurther informationNot a dangerous good under DOT, IATA, ADR, IMDG, or RID.US federal regulations US EPA TSCA Inventory: All chemical substances in this product comply with all rules or ordersunder TSCA.TSCA Section 12(b) Export Notification (40 CFR 707, Subpt. D)Not regulated.CERCLA Hazardous Substance List (40 CFR 302.4)Not listed.SARA 304 Emergency release notificationNot regulated.OSHA Specifically Regulated Substances (29 CFR 1910.1001-1050)Not listed.Superfund Amendments and Reauthorization Act of 1986 (SARA)Hazard categories Immediate Hazard - NoDelayed Hazard - NoFire Hazard - NoPressure Hazard - NoReactivity Hazard - NoSARA 302 Extremely hazardous substanceNot listed.NoSARA 311/312Hazardous chemicalOther federal regulationsNot regulated.Safe Drinking Water Act(SDWA)US state regulationsUS. Massachusetts RTK - Substance ListNot regulated.US. New Jersey Worker and Community Right-to-Know ActNot listed.US. Pennsylvania Worker and Community Right-to-Know LawNot listed.US. Rhode Island RTKNot regulated.US. California Proposition 65Not Listed.Regulatory information All chemical substances in this HP product have been notified or are exempt from notification underchemical substances notification laws in the following countries: US (TSCA), EU (EINECS/ELINCS),Switzerland, Canada (DSL/NDSL), Australia, Japan, Philippines, South Korea, New Zealand, andChina.16. Other information, including date of preparation or last revisionIssue date17-Sep-2015Revision date12-Oct-2015Version #02Disclaimer This Safety Data Sheet document is provided without charge to customers of HP. Data is the mostcurrent known to HP at the time of preparation of this document and is believed to be accurate. Itshould not be construed as guaranteeing specific properties of the products as described orsuitability for a particular application. This document was prepared to the requirements of thejurisdiction specified in Section 1 above and may not meet regulatory requirements in othercountries.Manufacturer information HP11311 Chinden BoulevardBoise, ID 83714 USA(Direct) 1-503-494-7199(Toll-free within the US) 1-800-457-4209Explanation of abbreviationsACGIH CAS DOT EPCRA CERCLA CFR COC IARC NIOSH NTP OSHA PEL RCRA REC REL SARA STEL TCLP TLV TSCA VOCAmerican Conference of Governmental Industrial Hygienists Chemical Abstracts ServiceComprehensive Environmental Response Compensation and Liability Act Code of Federal Regulations Cleveland Open CupDepartment of TransportationEmergency Planning and Community Right-to-Know Act (aka SARA)International Agency for Research on Cancer National Institute for Occupational Safety and Health National Toxicology ProgramOccupational Safety and Health Administration Permissible Exposure LimitResource Conservation and Recovery Act RecommendedRecommended Exposure LimitSuperfund Amendments and Reauthorization Act of 1986Short-Term Exposure LimitToxicity Characteristics Leaching Procedure Threshold Limit Value Toxic Substances Control Act Volatile Organic Compounds。
M38235G9-XXXFP中文资料
DESCRIPTIONThe 3823 group is the 8-bit microcomputer based on the 740 fam-ily core technology.The 3823 group has the LCD drive control circuit, an 8-channel A/ D converter, a serial interface, a watchdog timer, a ROM correc-tion function, and as additional functions.The various microcomputers in the 3823 group include variations of internal memory size and packaging. For details, refer to the section on part numbering.FEATURES●Basic machine-language instructions (71)●The minimum instruction execution time...........................0.4 µs (at f(X IN) = 10 MHz, High-speed mode)●Memory size ROM...............................................................16 K to 60 K bytes RAM.................................................................640 to 2560 bytes ●ROM correction function..............................32 bytes ✕ 2 blocks ●Watchdog timer..............................................................8-bit ✕ 1●Programmable input/output ports.. (49)●Input ports (5)●Software pull-up/pull-down resistors (Ports P0-P7 except port P40)●Interrupts.................................................17 sources, 16 vectors(includes key input interrupt)●Key Input Interrupt (Key-on Wake-Up) (8)●Timers...........................................................8-bit ✕ 3, 16-bit ✕ 2●Serial interface............8-bit ✕ 1 (UART or Clock-synchronized)●A/D converter............10-bit ✕ 8 channels or 8-bit ✕ 8 channels ●LCD drive control circuit Bias...................................................................................1/2, 1/3 Duty...........................................................................1/2, 1/3, 1/4 Common output.. (4)Segment output (32)●Main clock generating circuits..............Built-in feedback resistor(connect to external ceramic resonator or quartz-crystal oscillator)●Sub-clock generating circuits(connect to external quartz-crystal oscillator or on-chip oscillator)●Power source voltageIn frequency/2 mode (f(X IN) ≤ 10 MHz)...................4.5 to 5.5 V In frequency/2 mode (f(X IN) ≤ 8 MHz).....................4.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/4 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In frequency/8 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/8 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/8 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In low-speed mode....................................................1.8 to 5.5 V ●Power dissipationIn frequency/2 mode...............................................18 mW (std.) (at f(X IN) = 8 MHz, Vcc = 5 V, Ta = 25 °C)In low-speed mode at X CIN................................................18 µW (std.) (at f(X IN) stopped, f(X CIN) = 32 kHz, Vcc = 2.5 V, Ta = 25 °C)In low-speed mode at on-chip oscillator..................35 µW (std.) (at f(X IN) stopped, f(X CIN) = stopped, Vcc = 2.5 V, Ta = 25 °C)●Operating temperature range..................................– 20 to 85 °C APPLICATIONSCamera, audio equipment, household appliances, consumer elec-tronics, etc.3823 GroupSINGLE-CHIP 8-BIT CMOS MICROCOMPUTER REJ03B0146-0202Rev.2.02Jun.19.2007Table 1 Performance overviewParameter710.4 µs (Minimum instruction, f(X IN ) 10 MHz, High-speed mode)10 MHz (Maximum)16 K to 60 K bytes 640 to 2560 bytes 4-bit ✕ 1, 1-bit ✕ 1(4 pins sharing SEG)8-bit ✕ 5, 7-bit ✕ 1, 2 bit ✕ 1(16 pins sharing SEG)17 sources, 16 vectors (includes key input interrupt)8-bit ✕ 3, 16-bit ✕ 28-bit ✕ 1 (UART or Clock-synchronized)10-bit ✕ 8 channels or 8 bit ✕ 8 channels 8-bit ✕ 132 bytes ✕ 2 blocks 1/2, 1/32, 3, 4432Built-in feedback resistor(connect to external ceramic rasonator or quartz-crystal oscillator)Built-in feedback resistor(connect to external quartz-crystal oscillator or on-chip oscillator)4.5 to 5.5V 4.0 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 1.8 to 5.5VStd. 18 mW (Vcc = 5V, f(X IN ) = 8MHz, Ta = 25 °C)Std. 18 µW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = 32kHz, Ta = 25 °C)Std. 35 µW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = stopped, Ta = 25 °C)V CC 10mA -20 to 85 °C CMOS sillicon gate80-pin plastic molded LQFP/QFPNumber of basic instructions Instruction execution time Oscillation frequency Memory sizes ROM RAM Input port P34-P37, P40I/O port P0-P2, P41-P47, P5, P6, P70, P71Interrupt TimerSerial interface A/D converter Watchdog timer ROM correction function LCD drive control Bias circuitDutyCommon output Segment outputMain clock generating circuits Sub-clock generating circuits Power source voltageIn frequency/2 mode (f(X IN ) ≤ 10MHz)In frequency/2 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 10MHz)In frequency/4 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 5MHz)In frequency/8 mode (f(X IN ) ≤ 10MHz)In frequency/8 mode (f(X IN ) ≤ 8MHz)In frequency/8 mode (f(X IN ) ≤ 5MHz)In low-speed modePower dissipationIn frequency/2 mode In low-speed mode at X CINIn low-speed mode at on-chip oscillatorInput/Output Input/Output withstand voltage characteristicsOutput current Operating temperature range Device structure PackageFunctionPIN DESCRIPTIONTable 2 Pin description (1)V CC , V SS FunctionPin Name Function except a port function•LCD segment output pinsPower source •Apply voltage of power source to V CC , and 0 V to V SS . (For the limits of V CC , refer to “Recom-mended operating conditions”).V REF AV SS RESET X IN X OUTV L1–V L3COM 0–COM 3SEG 0–SEG 11P00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0 –P27/KW 7P34/SEG 12 –P37/SEG 15Analog refer-ence voltage Analog power source Reset input Clock input Clock outputLCD power sourceCommon outputSegment output I/O port P0I/O port P1I/O port P2•Reference voltage input pin for A/D converter.•GND input pin for A/D converter.•Connect to V SS .•Reset input pin for active “L”.•Input and output pins for the main clock generating circuit.•Feedback resistor is built in between X IN pin and X OUT pin.•Connect a ceramic resonator or a quartz-crystal oscillator between the X IN and X OUT pins to set the oscillation frequency.•If an external clock is used, connect the clock source to the X IN pin and leave the X OUT pin open.•This clock is used as the oscillating source of system clock.•Input 0 ≤ V L1 ≤ V L2 ≤ V L3 voltage.•Input 0 – V L3 voltage to LCD.•LCD common output pins.•COM 2 and COM 3 are not used at 1/2 duty ratio.•COM 3 is not used at 1/3 duty ratio.•LCD segment output pins.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each port to be individually programmed as either input or output.•Pull-down control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•4-bit input port.•CMOS compatible input level.•Pull-down control is enabled.•Key input (key-on wake-up) interrupt input pins•LCD segment output pinsInput port P3Table 3 Pin description (2)FunctionPin Function except a port function P40P42/INT 0,P43/INT 1P44/R X D,P45/T X D,P46/S CLK ,P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0,P55/CNTR 1P56/T OUT P57/ADT P60/AN 0–P67/AN 7P70/X COUT,P71/X CIN•1-bit Input port.•CMOS compatible input level.•7-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•2-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•φ clock output pin •Interrupt input pins•Interrupt input pins •Real time port function pins •Timer X, Y function pins •Timer 2 output pins •A/D conversion input pins •Sub-clock generating circuit I/O pins.(Connect a resonator. External clock cannot be used.)P41/φ•Serial interface function pins•A/D trigger input pinsName I/O port P4I/O port P5I/O port P6I/O port P7Input port P4•QzROM program power pinPART NUMBERINGFig. 4 Part numbering Package codeFP :PRQP0080GB-A packageHP :PLQP0080KB-A packageROM numberOmitted in the shipped in blank version.ROM/PROM size1 :4096 bytes2 :8192 bytes3 :12288 bytes4 :16384 bytes5 :20480 bytes6 :24576 bytes7 :28672 bytes8 :32768 bytesThe first 128 bites and the last 2 bytes of ROM are reserved areas ; they cannot be used.Memory typeG :QzROM versionRAM size0 :192 bytes1 :256 bytes2 :384 bytes3 :512 bytes4 :640 bytes5 :768 bytes6 :896 bytes7 :1024 bytes8 :1536 bytes9 :2048 bytesA :2560 bytesProduct M38234G6-XXX FP9 :36864 bytesA :40960 bytesB :45056 bytesC :49152 bytesD :53248 bytesE :57344 bytesF :61440 bytesCurrently products are listed below.RemarksPackage Part No.RAM size (bytes)61440(61310)49152(49022)32768(32638)24576(24446)16384(16254)ROM size (bytes) ROM size for User in ( )Table 4 List of productsM3823AGF-XXXFP M3823AGF-XXXHP M3823AGFFP M3823AGFHPM38239GC-XXXFP M38239GC-XXXHP M38239GCFP M38239GCHPM38238G8-XXXFP M38238G8-XXXHP M38238G8FP M38238G8HPM38235G6-XXXFP M38235G6-XXXHP M38235G6FP M38235G6HPM38234G4-XXXFP M38234G4-XXXHP M38234G4FP M38234G4HP2560(Note 1)2048(Note 2)1536(Note 2)768(Note 2)640(Note 2)PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-ABlank BlankBlank BlankBlank BlankBlank BlankBlank BlankNote 1: RAM size includes RAM for LCD display and ROM corrections.Note 2: RAM size includes RAM for LCD display.FUNCTIONAL DESCRIPTIONCENTRAL PROCESSING UNIT (CPU)The 3823 group uses the standard 740 family instruction set. Re-fer to the table of 740 family addressing modes and machine instructions or the 740 Family Software Manual for details on the instruction set.Machine-resident 740 family instructions are as follows:The FST and SLW instruction cannot be used.The STP , WIT, MUL, and DIV instruction can be used.The central processing unit (CPU) has six registers. Figure 6shows the 740 Family CPU register structure.[Accumulator (A)]The accumulator is an 8-bit register. Data operations such as data transfer, etc., are executed mainly through the accumulator.[Index Register X (X)]The index register X is an 8-bit register. In the index addressing modes, the value of the OPERAND is added to the contents of register X and specifies the real address.[Index Register Y (Y)]The index register Y is an 8-bit register. In partial instruction, the value of the OPERAND is added to the contents of register Y and specifies the real address.[Stack Pointer (S)]The stack pointer is an 8-bit register used during subroutine calls and interrupts. This register indicates start address of stored area (stack) for storing registers during subroutine calls and interrupts.The low-order 8 bits of the stack address are determined by the contents of the stack pointer. The high-order 8 bits of the stack ad-dress are determined by the stack page selection bit. If the stack page selection bit is “0” , the high-order 8 bits becomes “0016”. If the stack page selection bit is “1”, the high-order 8 bits becomes “0116”.The operations of pushing register contents onto the stack and popping them from the stack are shown in Figure 7.Store registers other than those described in Table 4 with program when the user needs them during interrupts or subroutine calls.[Program Counter (PC)]The program counter is a 16-bit counter consisting of two 8-bit registers PC H and PC L . It is used to indicate the address of the next instruction to be executed.Fig. 6 740 Family CPU register structureAAccumulator b7b7b7b7b0b7b15b0b7b0b0b0b0XIndex register X YIndex register Y SStack pointer PC LProgram counter PC HN V T B D I Z CProcessor status register (PS)Carry flag Zero flagInterrupt disable flag Decimal mode flag Break flagIndex X mode flag Overflow flag Negative flag[Processor status register (PS)]The processor status register is an 8-bit register consisting of 5 flags which indicate the status of the processor after an arithmetic operation and 3 flags which decide MCU operation. Branch opera-tions can be performed by testing the Carry (C) flag , Zero (Z) flag, Overflow (V) flag, or the Negative (N) flag. In decimal mode, the Z, V, N flags are not valid.•Bit 0: Carry flag (C)The C flag contains a carry or borrow generated by the arithmetic logic unit (ALU) immediately after an arithmetic operation. It can also be changed by a shift or rotate instruction.•Bit 1: Zero flag (Z)The Z flag is set if the result of an immediate arithmetic operation or a data transfer is “0”, and cleared if the result is anything other than “0”.•Bit 2: Interrupt disable flag (I)The I flag disables all interrupts except for the interrupt generated by the BRK instruction.Interrupts are disabled when the I flag is “1”.•Bit 3: Decimal mode flag (D)The D flag determines whether additions and subtractions are executed in binary or decimal. Binary arithmetic is executed when this flag is “0”; decimal arithmetic is executed when it is “1”.Decimal correction is automatic in decimal mode. Only the ADC and SBC instructions can be used for decimal arithmetic.•Bit 4: Break flag (B)The B flag is used to indicate that the current interrupt was generated by the BRK instruction. The BRK flag in the processor status register is always “0”. When the BRK instruction is used to generate an interrupt, the processor status register is pushed onto the stack with the break flag set to “1”.•Bit 5: Index X mode flag (T)When the T flag is “0”, arithmetic operations are performed between accumulator and memory. When the T flag is “1”, direct arithmetic operations and direct data transfers are enabled between memory locations.•Bit 6: Overflow flag (V)The V flag is used during the addition or subtraction of one byte of signed data. It is set if the result exceeds +127 to -128. When the BIT instruction is executed, bit 6 of the memory location operated on by the BIT instruction is stored in the overflow flag.•Bit 7: Negative flag (N)The N flag is set if the result of an arithmetic operation or data transfer is negative. When the BIT instruction is executed, bit 7 of the memory location operated on by the BIT instruction is stored in the negative flag.Table 6 Set and clear instructions of each bit of processor status registerSet instruction Clear instruction C flagSECCLCZ flag––I flagSEICLID flagSEDCLDB flag––T flagSETCLTV flag–CLVN flag––Real time port function output A/D conversion inputA/D trigger inputDiagram No.Related SFRs Input/Output Name Pin Non-Port Function I/O Format Table 7 List of I/O port functionP00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0–P27/KW 7P34/SEG 12–P37/SEG 15P40P41/φP42/INT 0,P43/INT 1P44/R X D P45/T X D P46/S CLK P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0Port P0Port P1Port P2Port P3Port P4Input/output,individual portsInput/output,individual bits InputInputInput/output,individual bitsCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input level CMOS compatible input levelCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input levelCMOS 3-state output LCD segment outputKey input (key-on wake-up) interrupt inputLCD segment outputφ clock outputX CIN frequency signal outputExternal interrupt inputSerial I/O function input/outputExternal interrupt input Timer X function I/O Timer Y function input Timer 2 function output PULL register A Segment output enable registerPULL register AInterrupt control register 2PULL register ASegment output enable registerPULL register Bφ output control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BSerial I/O control register Serial I/O status register UART control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BTimer X mode register PULL register BTimer X mode register PULL register BTimer Y mode register PULL register BTimer 123 mode register PULL register B A/D control registerPULL register A CPU mode register (1)(2)(3)(4)(6)(5)(2)(8)(7)Port P5(9)(2)Input/output,individual bits(10)P55/CNTR 1(11)(12)(13)(12)(14)P56/T OUT P57/ADT P60/AN 0–P67/AN 7(15)P70/X COUT P71/X CIN COM 0–COM 3SEG 0–SEG 11(16)(17)(18)Input/output,individual bits Input/output,individual bits Output OutputSub-clockgenerating circuit I/O LCD common output LCD segment outputPort P6Port P7Common SegmentLCD mode registerNotes 1: For details of how to use double function ports as function I/O ports, refer to the applicable sections.2: When an input level is at an intermediate potential, a current will flow from V CC to V SS through the input-stage gate.Especially, power source current may increase during execution of the STP and WIT instructions.Fix the unused input pins to “H” or “L” through a resistor.QzROM program power pinTermination of unused pins• Termination of common pinsI/O ports:Select an input port or an output port and follow each processing method.Output ports: Open.Input ports:If the input level become unstable, through current flow to an input circuit, and the power supply currentmay increase.Especially, when expecting low consumption current(at STP or WIT instruction execution etc.), pull-up orpull-down input ports to prevent through current(built-in resistor can be used). Pull-down the P40/(V PP) pin.We recommend processing unused pins through aresistor which can secure I OH(avg) or I OL(avg).Because, when an I/O port or a pin which have anoutput function is selected as an input port, it mayoperate as an output port by incorrect operation etc.Table 8 Termination of unused pinsPinP00/SEG16–P17/SEG23 P10/SEG24–P17/SEG31 P20/KW0–P27/KW7P34/SEG12–P37/SEG15 P40/(V PP)P41/φP42/INT0P43/INT1P44/RxDP45/TxDP46/S CLKP47/S RDY/S OUTP50/INT2P51/INT3P52/RTP0P53/RTP1P54/CNTR0P55/CNTR1P56/T OUTP57/ADTP60/AN0–P67/AN7P70/X COUTP71/X CINV L3 (Note)V L2 (Note)V L1 (Note)COM0–COM3SEG0–SEG11AV SSV REFX OUTTermination 2When selecting SEG output, open.When selecting KW function, performtermination of input port.When selecting SEG output, open.–When selecting φ output, open.When selecting INT0 function,perform termination of input port.When selecting INT1 function,perform termination of input port.When selecting R X D function,perform termination of input port.When selecting T X D function,perform termination of output port.When selecting external clock input,perform termination of input port.When selecting S RDY function,perform termination of output port.When selecting INT2 function,perform termination of input port.When selecting INT3 function,perform termination of input port.When selecting RTP0 function,perform termination of output port.When selecting RTP1 function,perform termination of output port.When selecting CNTR0 input function,perform termination of input port.When selecting CNTR1 function,perform termination of input port.When selecting T OUT function,perform termination of output port.When selecting ADT function,perform termination of input port.When selecting AN function, thesepins can be opened. (A/D conversionresult cannot be guaranteed.)Do not select X CIN-X COUT oscillationfunction by program.––––––––Termination 3–––––––––When selecting internal clock output,perform termination of output port.When selecting S OUT function,perform termination of output port.––––When selecting CNTR0 output function,perform termination of output port.–––––––––––––Termination 1 (recommend)I/O portInput portInput port (pull-down)I/O portConnect to V SSConnect to V SSConnect to V SSOpenOpenConnect to V SSConnect to V CC or V SSWhen an external clock isinput to the X IN pin, leavethe X OUT pin open.Note :The termination of V L3, V L2 and V L1 is applied when the bit 3 of the LCD mode register is “0”INTERRUPTSThe 3823 group interrupts are vector interrupts with a fixed prior-ity scheme, and generated by 16 sources among 17 sources: 8external, 8 internal, and 1 software.The interrupt sources, vector addresses (1) , and interrupt priority are shown in Table 9.Each interrupt except the BRK instruction interrupt has the inter-rupt request bit and the interrupt enable bit. These bits and the interrupt disable flag (I flag) control the acceptance of interrupt re-quests. Figure 16 shows an interrupt control diagram.Notes1: Vector addresses contain interrupt jump destination addresses.2: Reset function in the same way as an interrupt with the highest priority.Table 9 Interrupt vector addresses and priorityRemarksInterrupt Request Generating Conditions At resetAt detection of either rising or falling edge of INT 0 input At detection of either rising or falling edge of INT 1 input At completion of serial interface data receptionAt completion of serial interface transmit shift or when transmis-sion buffer is empty Interrupt Source LowHigh PriorityVector Addresses (Note 1)Reset (Note 2)INT 0INT 1Serial I/O reception Serial I/O transmission Timer X Timer Y Timer 2Timer 3CNTR 0CNTR 1Timer 1INT 2INT 3Key input(Key-on wake-up)ADTA/D conversion BRK instruction1234567891011121314151617FFFD 16FFFB 16FFF916FFF716FFF516FFF316FFF116FFEF 16FFED 16FFEB 16FFE916FFE716FFE516FFE316FFE116FFDF 16FFDD 16FFFC 16FFFA 16FFF816FFF616FFF416FFF216FFF016FFEE 16FFEC 16FFEA 16FFE816FFE616FFE416FFE216FFE016FFDE 16FFDC 16At timer X underflow At timer Y underflow At timer 2 underflowAt timer 3 underflowAt detection of either rising or falling edge of CNTR 0 input At detection of either rising or falling edge of CNTR 1 input At timer 1 underflowAt detection of either rising or falling edge of INT 2 input At detection of either rising or falling edge of INT 3 input At falling of conjunction of input level for port P2 (at input mode)At falling of ADT inputAt completion of A/D conversion At BRK instruction executionNon-maskableExternal interrupt(active edge selectable)External interrupt(active edge selectable)Valid when serial interface is se-lectedValid when serial interface is se-lectedExternal interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt (Valid at falling)Valid when ADT interrupt is se-lected, External interrupt (Valid at falling)Valid when A/D interrupt is se-lectedNon-maskable software interruptAn interrupt requests is accepted when all of the following conditions are satisfied:• Interrupt disable flag.................................“0”• Interrupt disable request bit .....................“1”• Interrupt enable bit.. (1)Though the interrupt priority is determined by hardware, priority processing can be performed by software using the above bits and flag.[Transmit Buffer/Receive Buffer Register (TB/RB)] 001816The transmit buffer register and the receive buffer register are lo-cated at the same address. The transmit buffer register is write-only and the receive buffer register is read-only. If a charac-ter bit length is 7 bits, the MSB of data stored in the receive buffer register is “0”.[Serial I/O Status Register (SIOSTS)] 001916 The read-only serial I/O status register consists of seven flags (bits 0 to 6) which indicate the operating status of the serial I/O function and various errors.Three of the flags (bits 4 to 6) are valid only in UART mode.The receive buffer full flag (bit 1) is cleared to “0” when the receive buffer is read.If there is an error, it is detected at the same time that data is transferred from the receive shift register to the receive buffer reg-ister, and the receive buffer full flag is set. A write to the serial I/O status register clears all the error flags OE, PE, FE, and SE. Writ-ing “0” to the serial I/O enable bit (SIOE) also clears all the status flags, including the error flags.All bits of the serial I/O status register are initialized to “0” at reset, but if the transmit enable bit (bit 4) of the serial I/O control register has been set to “1”, the transmit shift register shift completion flag (bit 2) and the transmit buffer empty flag (bit 0) become “1”. [Serial I/O Control Register (SIOCON)] 001A16 The serial I/O control register contains eight control bits for the se-rial I/O function.[UART Control Register (UARTCON) ]001B16 The UART control register consists of four control bits (bits 0 to 3) which are valid when asynchronous serial I/O is selected and set the data format of an data transfer. One bit in this register (bit 4) is always valid and sets the output structure of the P45/T X D pin. [Baud Rate Generator (BRG)] 001C16The baud rate generator determines the baud rate for serial trans-fer.The baud rate generator divides the frequency of the count source by 1/(n + 1), where n is the value written to the baud rate genera-tor.■Notes on serial I/OWhen setting the transmit enable bit to “1”, the serial I/O transmit interrupt request bit is automatically set to “1”. When not requiring the interrupt occurrence synchronized with the transmission enalbed, take the following sequence.➀Set the serial I/O transmit interrupt enable bit to “0” (disabled).➁Set the transmit enable bit to “1”.➂Set the serial I/O transmit interrupt request bit to “0” after 1 or more instructions have been executed.➃Set the serial I/O transmit interrupt enable bit to “1” (enabled).。
瑞萨MCU型号速查手册
SSOP-20 SOP-20
家电、OA设备、民用设备
M34508G4H-XXXFP/GP
○○
4509
M34509G4FP M34509G4-XXXFP
M34509G4HFP M34509G4H-XXXFP
--
4096W
256W
6MHz/ 1.8V~5.6V
0.5us @6MHz
18 - - ○ -
10位×6
M37546G4GP/HP/SP M37546G4-XXXGP/HP/SP
8K 16K
384
8MHz/ 1.8~5.5V
0.25us @8MHz
25 - - ○ ○ ○ ○ 10位×6
-
2 2 ○ ○ ○ ○ - - ○ ○ ○ - - 12 -20~85
512
SDIP-32 LQFP-32
WQFN-36
2K
60K
2.5K
照相机、音频设备、家电、民用设备
3850A
M38503G4AFP/SP M38503G4A-XXXFP/SP
16K
512
12.5MHz/ 1.8~5.5V
0.32us @12.5MHz
34
-
○
-
-
-
-
10位×9
-
4 - - - ○ ○ - - ○ ○ ○ - - 6 -20~85
SDIP-42 SSOP-42
75
芯片封装说明
78
QzROM
720、740工具
低功耗
R8C族及工具
M16C
R32C
M16C族工具 SuperH族及工具 安全MCU
78K
V850
78K、V850工具 芯片封装说明
BD3823FV中文资料
The products listed in this document are designed to be used with ordinary electronic equipment or devices (such as audio visual equipment, office-automation equipment, communications devices, electrical appliances and electronic toys). Should you intend to use these products with equipment or devices which require an extremely high level of reliability and the malfunction of with would directly endanger human life (such as medical instruments, transportation equipment, aerospace machinery, nuclear-reactor controllers, fuel controllers and other safety devices), please be sure to consult with our sales representative in advance. About Export Control Order in Japan Products described herein are the objects of controlled goods in Annex 1 (Item 16) of Export Trade Control Order in Japan. In case of export from Japan, please confirm if it applies to "objective" criteria or an "informed" (by MITI clause) on the basis of "catch all controls for Non-Proliferation of Weapons of Mass Destruction.
M63814GP中文资料
Unit V mA V mA V
Input voltage Clamping diode forward current Clamping diode reverse voltage Ta = 25°C, when mounted on board
Pd
Power dissipation
W
Topr Tstg
Symbol VO Parameter Output voltage M63814P Collector current (Current per 1 cirIC cuit when 7 circuits are coming on simultaneously) M63814GP M63814KP VIN Input voltage M63814FP Duty Cycle no more than 45% Duty Cycle no more than 100% Duty Cycle no more than 30% Duty Cycle no more than 100% Duty Cycle no more than 24% Duty Cycle no more than 100% Duty Cycle no more than 24% Duty Cycle no more than 100% Test conditions Limits min 0 0 0 0 0 0 0 0 0 0 typ — — — — — — — — — — max 35 250 160 250 130 250 120 250 120 30 Unit V
100
0 0
•The collector current values represent the current per circuit. •Repeated frequency ≥ 10Hz •The value the circle represents the value of the simultaneously-operated circuit. •Ta = 25°C
MMBT3906中文资料_数据手册_参数
400
200 -1
-3
-10
-30
-50
COLLECTOR CURRENT I (mA) C
COLLECTOR POWER DISSIPATION P (mW)
C
CAPACITANCE C (pF)
-0.0 -1
9
3
-3
-10
-30
COLLECTOR CURRENT I (mA) C
D,May,2012
TRANSITION FREQUENCY f (MHz) T
DC current gain
Collector-emitter saturation voltage Base-emitter saturation voltage Transition frequency Delay Time Rise Time Storage Time Fall Time
CLASSIFICATION OF hFE(1)
D,May,2012
w万联芯城专注电子元器件配单服务,只售原装现货 库存,万联芯城电子元器件全国供应,专为终端生产,研发企业提供现货 物料,价格优势明显,BOM配单采购可节省逐个搜索购买环节,只需提交 BOM物料清单,商城即可为您报价,订单最快可当天发出,为客户节省采购 时间,提高生产效率,点击进入万联芯城。
MMBT3904 is Recommended z Epitaxial planar die construction MARKING: 2A
MAXIMUM RATINGS (TA=25℃ unless otherwise noted)
1. BASE 2. EMITTER 3. COLLECTOR
Symbol VCBO VCEO VEBO IC PC RθJA TJ Tstg
LTC3826资料
Voltages ........................................... INTVCC to –0.3V EXTVCC ...................................................... 10V to –0.3V ITH1, ITH2, VFB1, VFB2 Voltages ................. 2.7V to –0.3V PGOOD1, PGOOD2 Voltages ..................... 8.5V to –0.3V
元器件交易网
LTC3826
FEATURES
30µA IQ, Dual, 2-Phase Synchronous Step-Down Controller
DESCRIPTION
n Wide Output Voltage Range: 0.8V ≤ VOUT ≤ 10V n Ultralow Operating IQ: 30μA (One Channel On) n Out-of-Phase Controllers Reduce Required Input
APPLICATIONS
n Automotive Systems n Battery-Operated Digital Devices n Distributed DC Power Systems
The LTC®3826 is a high performance dual step-down switching regulator controller that drives all N-channel synchronous power MOSFET stages. A constant frequency current mode architecture allows a phase-lockable frequency of up to 650kHz. Power loss and noise due to the ESR of the input capacitor are minimized by operating the two controller output stages out of phase.
M1A3P600-FFG256中文资料(Microsemi)中文数据手册「EasyDatasheet - 矽搜」
温度等级
C2 I3
–F 1
Std.
–1
–2
✓
✓
✓
✓
–
✓
✓
✓
注意事项:
1.直流并为-F速度等级目标开关特性只是基于模拟. 规定-F速度等级特点是主题建立FPGA规格后更改.一些限制可能会增加,并会反映在该文档后续版本.该-F速度等 级只在商用温度范围内支持.
IV
v1.1
芯片中文手册,看全文,戳
A3P125 = 125000个系统门 A3P250 = 25万系统门 A3P400 = 40万系统门
A3P600 = 60万系统门 A3P1000 = 1,000,000个系统门
ProASIC3器件与 ARM7
M7A3P1000 = 1,000,000个系统门
ProASIC3器件具有 Cortex-M1
M1A3P250 = 250000系统门
M1A3P400 = 400000系统门 M1A3P600 = 600000个系统门 M1A3P1000 = 百万个系统门
* 为-F速度等级目标DC和开关特性只是基于模拟. 规定-F速度等级特点是主题建立FPGA规格后更改.一些限制可能会增加,并会反映在该文档后续版本.该-F速度等 级只在商用温度范围内支持.
1. C =商业级温度范围:0°C至70°C环境温度 2. I =工业级温度范围:-40°C至85°C环境温度
A3P060
– – C, I C, I C, I – C, I – –
A3P125
– – C, I C, I C, I C, I C, I – –
A3P250
M1A3P250 – – C, I C, I – C, I C, I C, I –
彩显常用大功率三极管、场效应管参数表
型号 可代用型号 用途 价格
2SA562 CG673B、2SB689 预视放
2SA670 2SA1069、2SB513 电源调整管
2SA673 2SA719、2SA697 帧激励
2SA715 3CF3A、2SB529 场输出管
2SA778A 3CG21C、CG75-1AB 开关电源误差放大
*C4269 60 1500 7 行管
*C4293 50 1500 5 行管
*C4294 50 1500 6 行管
*C4589 50 1500 10 行管
*C4742 50 1500 6 行管
*C4744 50 1500 6 行管
C4747 50 1500 10 行管
*C4769 60 1500 7 行管
2SK790 150 15 500
2SK872 150 6 900
2SK955 150 9 800
2SK956 150 9 800
2SK962 150 8 900
2SK1019 300 30 500
2SK1020 300 30 500
2SK1045 150 5 900
2SK1081 125 7 800
整管
2SB407 3L780 电源调整管
2SB548 3CF3B、
2SA794 场输出管
2SB566AK CD77-1A、3CF5A 电源调整管
2SB556K CD77-1A、3CF5B 电源调整
2SB621 3CG23B、2SB1035 电源推动管
C3686 50 1400 8 行管
C3687 150 1500 8 行管
SS3P6中文资料
New ProductSS3P5 & SS3P6Vishay General Semiconductor Document Number: 88997For technical questions within your region, please contact one of the following: High-Current Density Surface Mount Schottky RectifierFEATURES•Very low profile - typical height of 1.0 mm•Ideal for automated placement•Low forward voltage drop, low powerlosses•High efficiency•Low thermal resistance•Meets MSL level 1, per J-STD-020, LF maximumpeak of 260 °C•Component in accordance to RoHS 2002/95/ECand WEEE 2002/96/ECTYPICAL APPLICATIONSFor use in low voltage high frequency inverters,freewheeling, dc-to-dc converters and polarityprotection applications.MECHANICAL DATACase: DO-220AA (SMP)Epoxy meets UL 94V-0 flammability ratingTerminals: Matte tin plated leads, solderable perJ-STD-002 and JESD22-B102E3 suffix for consumer grade, meets JESD 201 class1A whisker test, HE3 suffix for high reliability grade(AEC Q101 qualified), meets JESD 201 class 2whisker testPolarity:Color band denotes the cathode end PRIMARY CHARACTERISTICSI F(AV)3.0 AV RRM50 V, 60 VI FSM45 AE AS11.25 mJV F at I F = 3.0 A0.61 VT J max.150 °CDO-220AA (SMP)eSMP TM SeriesNotes:(1) Pulse test: 300 µs pulse width, 1 % duty cycle(2) Pulse test: Pulse width ≤ 40 msMAXIMUM RATINGS(T A = 25°C unless otherwise noted)PARAMETER SYMBOL SS3P5SS3P6UNITDevice marking code 3536Maximum repetive peak reverse voltage V RRM5060VMaximum average forward rectified current (Fig. 1)I F(AV) 3.0APeak forward surge current 10 ms single half sine-wavesuperimposed on rated loadI FSM45ANon-repetitive avalanche energyat I AS = 1.5 A, L = 10 mH, T J = 25 °CE AS11.25mJVoltage rate of change (rated V R)dV/dt10 000V/usOperating junction and storage temperature range T J, T STG- 55 to + 150°CELECTRICAL CHARACTERISTICS(T A = 25°C unless otherwise noted)PARAMETER TEST CONDITIONS SYMBOL TYP.MAX.UNITMaximum instantaneous forward voltage (1)I F = 3 AT J = 25 °CT J = 125 °CV F0.710.610.780.65V Maximum reverse current at rated V R (2)T J = 25 °CT J = 125 °CI R-2.010010µAmA T ypical junction capacitance 4.0 V, 1 MHz C J 80pF 元器件交易网New ProductSS3P5 & SS3P6Vishay General Semiconductor For technical questions within your region, please contact one of the following:Document Number: 88997Note:(1)Thermal resistance from junction to ambient and junction to lead mounted on P.C.B. with 15 x 15 mm copper pad areas. R θJL is measuredat the terminal of cathode band. R θJC is measured at the top centre of the bodyNote:(1)Automotive grade AEC Q101 qualifiedRATINGS AND CHARACTERISTICS CURVES (T A = 25°C unless otherwise noted)THERMAL CHARACTERISTICS (T A = 25°C unless otherwise noted)PARAMETERSYMBOL SS3P5SS3P6UNIT Typical thermal resistance (1)R θJA R θJL R θJC1151520°C/WORDERING INFORMATION (Example)PREFERRED P/N UNIT WEIGHT (g)PREFERRED PACKAGE CODEBASE QUANTITYDELIVERY MODESS3P6-E3/84A 0.02484A 30007" diameter plastic tape and reel SS3P6-E3/85A 0.02485A 10 00013" diameter plastic tape and reel SS3P6HE3/84A (1)0.02484A 30007" diameter plastic tape and reel SS3P6HE3/85A (1)0.02485A10 00013" diameter plastic tape and reelFigure 1. Forward Current Derating Curve Figure 2. Forward Power Loss CharacteristicsFigure 3. Maximum Non-Repetitive Peak Forward Surge CurrentFigure 4. Typical Instantaneous Forward Characteristics元器件交易网New ProductSS3P5 & SS3P6Vishay General SemiconductorDocument Number: 88997For technical questions within your region, please contact one of the following: PACKAGE OUTLINE DIMENSIONS in inches (millimeters)Figure 5. Typical Reverse Leakage CharacteristicsFigure 6. Typical Junction CapacitanceFigure 7. Typical Transient Thermal impedance元器件交易网Disclaimer Legal Disclaimer NoticeVishayAll product specifications and data are subject to change without notice.Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein or in any other disclosure relating to any product.Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any information provided herein to the maximum extent permitted by law. The product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed therein, which apply to these products.No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay.The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications unless otherwise expressly indicated. Customers using or selling Vishay products not expressly indicated for use in such applications do so entirely at their own risk and agree to fully indemnify Vishay for any damages arising or resulting from such use or sale. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.Product names and markings noted herein may be trademarks of their respective owners.元器件交易网Document Number: 。
CFP-820系列打印机用户手册说明书
用 户 手 册 CFP-820系列打印机本产品依据国家标准:GB 21521-2014执行声明关于商标各公司名称、产品名称是各个公司的注册商标或者商品名称。
Jolimark、映美是新会江裕信息产业有限公司的注册商标。
EPSON、ESC/PK2是Seiko Epson Corporation的注册商标。
OKI、OKI 5530SC是OKI Data Corporation的注册商标。
IBM 2391是International Business Machines Corporation的注册商标。
Windows是Microsoft Corporation的注册商标。
产品中有毒有害物质或元素的名称及含量有毒有害物质或元素部件名称铅 (Pb ) 汞 (Hg ) 镉 (Cd ) 六价铬 (Cr (VI ))多溴联苯(PBB )多溴二苯醚(PBDE )塑料部件 ○ ○ ○ ○ ○ ○ 金属部件 × ○ ○ ○ ○ ○ 电源板 × ○ ○ ○ ○ ○ 主板 × ○ ○ ○ ○ ○ 色带盒○○○○○○○:表示该有毒有害物质在该部件所有均质材料中的含量均在 SJ/T 11363-2006标准规定的限量要求以下。
×:表示该有毒有害物质至少在该部件的某一均质材料中的含量超出 SJ/T 11363-2006标准规定的限量要求。
×的技术原因:以下情况之一,电子元器件含铅,或者快削钢中含有0.35wt%以下的铅,或者铜合金中含有4wt%以下的铅,或者铝中含有0.4wt%以下的铅。
电子信息产品污染控制标志:在中华人民共和国境内销售的电子信息产品必须标识电子信息产品污染控制标志,标志内的数字表示在正常使用条件下电子信息产品的环保使用期限。
本用户手册的说明标记使打印机正常工作所需的注意事项和限制等。
为了避免错误操作,请务必阅读。
使用打印机时可带来方便和具有参考价值的事项。
警示操作时的重要事项,忽视时可能会导致生命危险或重大人身事故。
M3823AG2-XXXFP中文资料
M3823AG2-XXXFP中文资料DESCRIPTIONThe 3823 group is the 8-bit microcomputer based on the 740 fam-ily core technology.The 3823 group has the LCD drive control circuit, an 8-channel A/ D converter, a serial interface, a watchdog timer, a ROM correc-tion function, and as additional functions.The various microcomputers in the 3823 group include variations of internal memory size and packaging. For details, refer to the section on part numbering.FEATURES●Basic machine-language instructions (71)●The minimum instruction execution time...........................0.4 μs (at f(X IN) = 10 MHz, High-speed mode)●Memory size ROM...............................................................16 K to60 K bytes RAM.................................................................640 to 2560 bytes ●ROM correction function..............................32 bytes ? 2 blocks ●Watchdog timer..............................................................8-bit ? 1●Programmable input/output ports.. (49)●Input ports (5)●Software pull-up/pull-down resistors (Ports P0-P7 except port P40)●Interrupts.................................................17 sources, 16 vectors(includes key input interrupt)●Key Input Interru pt (Key-on Wake-Up) (8)●Timers...........................................................8-bit ? 3, 16-bit ? 2●Serial interface............8-bit ? 1 (UART or Clock-synchronized)●A/D converter............10-bit ? 8 channels or 8-bit ?8 channels ●LCD drive control circuitBias...................................................................................1/2, 1/3 Duty...........................................................................1/2, 1/3, 1/4 Common output.. (4)Segment output (32)●Main cloc k generating circuits..............Built-in feedback resistor(connect to external ceramic resonator or quartz-crystal oscillator)●Sub-clock generating circuits(connect to external quartz-crystal oscillator or on-chip oscillator)●Power source voltageIn f requency/2 mode (f(X IN) ≤ 10 MHz)...................4.5 to 5.5 V In frequency/2 mode (f(X IN) ≤ 8 MHz).....................4.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/4 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In frequency/8 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/8 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/8 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In low-speed mode....................................................1.8 to 5.5 V ●Power dissipationIn frequency/2 mode...............................................18 mW (std.) (at f(X IN) = 8 MHz, Vcc = 5 V, Ta = 25 °C)In low-speed mode at X CIN................................................18 μW (std.) (at f(X IN) stopped, f(X CIN) = 32 kHz, Vcc = 2.5 V, Ta = 25 °C) In low-speed mode at on-chip oscillator..................35 μW (std.) (at f(X IN) stopp ed, f(X CIN) = stopped, Vcc = 2.5 V, Ta = 25 °C)●Operating temperature range..................................–20 to 85 °C APPLICATIONSCamera, audio equipment, household appliances, consumer elec-tronics, etc.3823 GroupSINGLE-CHIP 8-BIT CMOS MICROCOMPUTER REJ03B0146-0202Rev.2.02Jun.19.2007Table 1 Performance overviewParameter710.4 μs (Minimum instruction, f(X IN ) 10 MHz, High-speedmode)10 MHz (Maximum)16 K to 60 K bytes 640 to 2560 bytes 4-bit ? 1, 1-bit ? 1(4 pins sharing SEG)8-bit ? 5, 7-bit ? 1, 2 bit ? 1(16 pins sharing SEG)17 sources, 16 vectors (includes key input interrupt)8-bit ? 3, 16-bit ? 28-bit ? 1 (UART or Clock-synchronized)10-bit ? 8 channels or 8 bit ? 8 channels 8-bit ? 132 bytes ? 2 blocks 1/2, 1/32, 3, 4432Built-in feedback resistor(connect to external ceramic rasonator or quartz-crystal oscillator)Built-in feedback resistor(connect to external quartz-crystal oscillator or on-chip oscillator)4.5 to 5.5V 4.0 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 1.8 to 5.5VStd. 18 mW (Vcc = 5V, f(X IN ) = 8MHz, Ta = 25 °C)Std. 18 μW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = 32kHz, Ta = 25 °C)Std. 35 μW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = stopped, Ta = 25 °C)V CC 10mA -20 to 85 °C CMO S sillicon gate 80-pin plastic molded LQFP/QFPNumber of basic instructions Instruction execution time Oscillation frequency Memory sizes ROM RAM Input port P34-P37, P40I/O port P0-P2, P41-P47, P5, P6, P70, P71Interrupt TimerSerial interface A/D converter Watchdog timer ROM correction function LCD drive control Bias circuitDutyCommon output Segment outputMain clock generating circuits Sub-clock generating circuits Power source voltageIn frequency/2 mode (f(X IN ) ≤ 10MHz)In frequency/2 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 10MHz)In frequency/4 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 5MHz)In frequency/8 mode (f(X IN ) ≤ 10MHz)In frequency/8 mode (f(X IN ) ≤ 8MHz)In frequency/8 mode (f(X IN ) ≤ 5MHz)In low-speed modePower dissipationIn frequency/2 mode In low-speed mode at X CINIn low-speed mode at on-chip oscillatorInput/Output Input/Output withstand voltage characteristics Output current Operating temperature range Device structure PackageFunctionPIN DESCRIPTION Table 2 Pin description (1) V CC , V SS FunctionPin Name Function except a port functionLCD segment output pinsPower source ?Apply voltage of power source to V CC , and 0 V to V SS . (For the limits of V CC , refer to “Recom-mended operating condit ions”).V REF AV SS RESET X IN X OUTV L1–V L3COM 0–COM 3SEG 0–SEG 11P00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0 –P27/KW 7P34/SEG 12 –P37/SEG 15Analog refer-ence voltage Analog power source Reset input Clock input Clock outputLCD power sourceCommon outputSegment output I/O port P0I/O port P1I/O port P2Reference voltage input pin for A/D converter.?GND input pin for A/D converter.?Connect to V SS .Reset input pin for active “L”.Input and output pins for the main clock generating circuit.?Feedback resistor is built in between X IN pin and X OUT pin.Connect a ceramic resonator or a quartz-crystal oscillator between the X IN and X OUT pins to set the oscillation frequency.If an external clock is used, connect the clock source to the X IN pin and leave the X OUT pin open.?This clock is used as the oscillating source of system clock.Input 0 ≤ V L1 ≤ V L2 ≤ V L3 voltage.?Input 0 – V L3 voltage to LCD.?LCD common output pins.COM 2 and COM 3 are not used at 1/2 duty ratio.?COM 3 is not used at 1/3 duty ratio.LCD segment output pins.?8-bit I/O port.CMOS compatible input level.?CMOS 3-state output structure.I/O direction register allows each port to be individually programmed as either input or output.?Pull-down control is enabled.?8-bit I/O port.CMOS compatible input level.?CMOS 3-state output structure.I/O direction register allows each pin to be individually programmed as either input or output.?Pull-up control is enabled.4-bit input port.CMOS compatible input level.?Pull-down control is enabled.Key input (key-on wake-up) interrupt input pinsLCD segment output pinsInput port P3Table 3 Pin description (2)FunctionPin Function except a port function P40P42/INT 0,P43/INT 1P44/R X D,P45/T X D,P46/S CLK ,P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0,P55/CNTR 1P56/T OUT P57/ADT P60/AN 0–P67/AN 7P70/X COUT,P71/X CIN1-bit Input port.CMOS compatible input level.?7-bit I/O port.CMOS compatible input level.?CMOS 3-state outputstructure.I/O direction register allows each pin to be individually programmed as either input or output.?Pull-up control is enabled.?8-bit I/O port.CMOS compatible input level.?CMOS 3-state output structure.I/O direction register allows each pin to be individually programmed as either input or output.?Pull-up control is enabled.8-bit I/O port.CMOS compatible input level.?CMOS 3-state output structure.I/O direction register allows each pin to be individually programmed as either input or output.?Pull-up control is enabled.2-bit I/O port.CMOS compatible input level.?CMOS 3-state output structure.I/O direction register allows each pin to be individually programmed as either input or output.?Pull-up control is enabled.φ clock output pin ?Interrupt input pinsInterrupt input pins ?Real time port function pins ?Timer X, Y function pins ?Timer 2 output pins ?A/D conversion input pins ?Sub-clock generating circuit I/O pins.(Connect a resonator. External clock cannot be used.)P41/φSerial interface function pinsA/D trigger input pinsName I/O port P4I/O port P5I/O port P6I/O port P7Input port P4?QzROM program power pinPART NUMBERINGFig. 4 Part numbering Package codeFP :PRQP0080GB-A packageHP :PLQP0080KB-A packageROM numberOmitted in the shipped in blank version.ROM/PROM size1 :4096 bytes2 :8192 bytes3 :12288 bytes4 :16384 bytes5 :20480 bytes6 :24576 bytes7 :28672 bytes8 :32768 bytesThe first 128 bites and the last 2 bytes of ROM are reserved areas ; they cannot be used.Memory typeG :QzROM versionRAM size0 :192 bytes1 :256 bytes2 :384 bytes3 :512 bytes4 :640 bytes5 :768 bytes6 :896 bytes7 :1024 bytes8 :1536 bytes9 :2048 bytesA :2560 bytesProduct M38234G6-XXX FP9 :36864 bytesA :40960 bytesB :45056 bytesC :49152 bytesD :53248 bytesE :57344 bytesF :61440 bytesCurrently products are listed below.Remarks Package Part No.RAM size (bytes)61440(61310)49152(49022)32768(32638)24576(24446)16384(16254)ROM size (bytes) ROM size for User in ( )Table 4 List of productsM3823AGF-XXXFP M3823AGF-XXXHP M3823AGFFP M3823AGFHPM38239GC-XXXFP M38239GC-XXXHP M38239GCFP M38239GCHPM38238G8-XXXFP M38238G8-XXXHP M38238G8FP M38238G8HPM38235G6-XXXFP M38235G6-XXXHP M38235G6FP M38235G6HPM38234G4-XXXFP M38234G4-XXXHP M38234G4FP M38234G4HP2560(Note 1)2048(Note 2)1536(Note 2)768(Note 2)640(Note 2)PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-ABlank BlankBlank BlankBlank BlankBlank BlankBlank BlankNote 1: RAM size includes RAM for LCD display and ROMcorrections.Note 2: RAM size includes RAM for LCD display.FUNCTIONAL DESCRIPTIONCENTRAL PROCESSING UNIT (CPU)The 3823 group uses the standard 740 family instruction set. Re-fer to the table of 740 family addressing modes and machine instructions or the 740 Family Software Manual for details on the instruction set.Machine-resident 740 family instructions are as follows:The FST and SLW instruction cannot be used.The STP , WIT, MUL, and DIV instruction can be used.The central processing unit (CPU) has six registers. Figure 6shows the 740 Family CPU register structure.[Accumulator (A)]The accumulator is an 8-bit register. Data operations such as data transfer, etc., are executed mainly through the accumulator.[Index Register X (X)]The index register X is an 8-bit register. In the index addressing modes, the value of the OPERAND is added to the contents of register X and specifies the real address.[Index Register Y (Y)]The index register Y is an 8-bit register. In partial instruction, the value of the OPERAND is added to the contents of register Y and specifies the real address.[Stack Pointer (S)]The stack pointer is an 8-bit register used during subroutine calls and interrupts. This register indicates start address of stored area (stack) for storing registers during subroutine calls and interrupts.The low-order 8 bits of the stack address are determined by the contents of the stack pointer. The high-order 8 bits of the stack ad-dress are determined by the stack pageselection bit. If the stack page selection bit is “0” , the high-order 8 bits becomes “0016”. If the stack page selection bit is “1”, the high-orde r 8 bits becomes “0116”.The operations of pushing register contents onto the stack and popping them from the stack are shown in Figure 7.Store registers other than those described in Table 4 with program when the user needs them during interrupts or subroutine calls.[Program Counter (PC)]The program counter is a 16-bit counter consisting of two 8-bit registers PC H and PC L . It is used to indicate the address of the next instruction to be executed.AAccumulator b7b7b7b7b0b7b15b0b7b0b0b0b0XIndex register X YIndex register Y SStack pointer PC LProgram counter PC HN V T B D I Z CProcessor status register (PS)Carry flag Zero flagInterrupt disable flag Decimal mode flag Break flagIndex X mode flag Overflow flag Negative flag[Processor status register (PS)]The processor status register is an 8-bit register consisting of 5 flags which indicate the status of the processor after an arithmetic operation and 3 flags which decide MCU operation. Branch opera-tions can be performed by testing the Carry (C)flag , Zero (Z) flag, Overflow (V) flag, or the Negative (N) flag. In decimal mode, the Z, V, N flags are not valid.Bit 0: Carry flag (C)The C flag contains a carry or borrow generated by the arithmetic logic unit (ALU) immediately after an arithmetic operation. It can also be changed by a shift or rotate instruction.Bit 1: Zero flag (Z)The Z flag is set if the result of an immediate arithmetic operation or a data transfer is “0”, and cleared if the result is anything other than “0”.Bit 2: Interrupt disable flag (I)The I flag disables all interrupts except for the interrupt generated by the BRK instruction.Interrupts are disabled when the I flag is “1”.Bit 3: Decimal mode flag (D)The D flag determines whether additions and subtractions are executed in binary or decimal. Binary arithmetic is executed when this flag is “0”; decimal arithmetic is executed when it is “1”.Decimal correction is automatic in decimal mode. Only the ADC and SBC instructions can be used for decimal arithmetic.?Bit 4: Break flag (B)The B flag is used to indicate that the current interrupt was generated by the BRK instruction. The BRK flag in the processor status register is always “0”. When the BRK instruction is used to generate an interrupt, the processor status register is pushed onto the stack with the break flag set to “1”.Bit 5: Index X mode flag (T)When the T flag is “0”, arithmetic operations are performed between accumulator and memory. When the T flagis “1”, direct arithmetic operations and direct dat a transfers are enabled between memory locations.Bit 6: Overflow flag (V)The V flag is used during the addition or subtraction of one byte of signed data. It is set if the result exceeds +127 to -128. When the BIT instruction is executed, bit 6 of the memory location operated on by the BIT instruction is stored in the overflow flag.?Bit 7: Negative flag (N)The N flag is set if the result of an arithmetic operation or data transfer is negative. When the BIT instruction is executed, bit 7 of the memory location operated on by the BIT instruction is stored in the negative flag.Table 6 Set and clear instructions of each bit of processor status registerSet instruction Clear instruction C flagSECCLCZ flag––I flagSEICLID flagSEDCLDB flag––T flagSET CLT V flag –CLV N flag ––Real time port function output A/D conversion inputA/D trigger inputDiagram No.Related SFRs Input/Output Name Pin Non-PortFunction I/O Format Table 7 List of I/O port functionP00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0–P27/KW 7P34/SEG 12–P37/SEG 15P40P41/φP42/INT 0,P43/INT 1P44/R X D P45/T X D P46/S CLK P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0Port P0 Port P1Port P2Port P3Port P4Input/output,individual portsInput/output,individual bits InputInputInput/output,individual bitsCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input level CMOS compatible input levelCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input levelCMOS 3-state output LCD segment outputKey input (key-on wake-up) interrupt inputLCD segment outputφ clock outputX CIN frequency signal outputExternal interrupt inputSerial I/O function input/outputExternal interrupt input Timer X function I/O Timer Y function input Timer 2 function output PULL register A Segment output enable registerPULL register AInterrupt control register 2PULL register ASegment output enable registerPULL register Bφ output control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BSerial I/O control register Serial I/O status register UART control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BTimer X mode register PULL register BTimer X mode register PULL register BTimer Y mode register PULL register BTimer 123 mode register PULL register B A/D control register PULL register A CPU mode register (1)(2)(3)(4)(6)(5)(2)(8)(7)Port P5(9)(2)Input/output,individual bits(10)P55/CNTR 1(11)(12)(13)(12)(14)P56/T OUT P57/ADT P60/AN 0–P67/AN 7(15)P70/X COUT P71/X CIN COM 0–COM 3SEG 0–SEG 11(16)(17)(18)Input/output,individual bits Input/output,individual bits Output OutputSub-clockgenerating circuit I/O LCD common output LCD segment outputPort P6Port P7Common SegmentLCD mode registerNotes 1: For details of how to use double function ports as function I/O ports, refer to the applicable sections.2: When an input level is at an intermediate potential, a current will flow from V CC to V SS through the input-stage gate.Especially, power source current may increase during execution of the STP and WIT instructions.Fix the unused input pins to “H” or “L” through a resistor.QzROM program power pin。
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DESCRIPTIONThe 3823 group is the 8-bit microcomputer based on the 740 fam-ily core technology.The 3823 group has the LCD drive control circuit, an 8-channel A/ D converter, a serial interface, a watchdog timer, a ROM correc-tion function, and as additional functions.The various microcomputers in the 3823 group include variations of internal memory size and packaging. For details, refer to the section on part numbering.FEATURES●Basic machine-language instructions (71)●The minimum instruction execution time...........................0.4 µs (at f(X IN) = 10 MHz, High-speed mode)●Memory size ROM...............................................................16 K to 60 K bytes RAM.................................................................640 to 2560 bytes ●ROM correction function..............................32 bytes ✕ 2 blocks ●Watchdog timer..............................................................8-bit ✕ 1●Programmable input/output ports.. (49)●Input ports (5)●Software pull-up/pull-down resistors (Ports P0-P7 except port P40)●Interrupts.................................................17 sources, 16 vectors(includes key input interrupt)●Key Input Interrupt (Key-on Wake-Up) (8)●Timers...........................................................8-bit ✕ 3, 16-bit ✕ 2●Serial interface............8-bit ✕ 1 (UART or Clock-synchronized)●A/D converter............10-bit ✕ 8 channels or 8-bit ✕ 8 channels ●LCD drive control circuit Bias...................................................................................1/2, 1/3 Duty...........................................................................1/2, 1/3, 1/4 Common output.. (4)Segment output (32)●Main clock generating circuits..............Built-in feedback resistor(connect to external ceramic resonator or quartz-crystal oscillator)●Sub-clock generating circuits(connect to external quartz-crystal oscillator or on-chip oscillator)●Power source voltageIn frequency/2 mode (f(X IN) ≤ 10 MHz)...................4.5 to 5.5 V In frequency/2 mode (f(X IN) ≤ 8 MHz).....................4.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/4 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/4 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In frequency/8 mode (f(X IN) ≤ 10 MHz)...................2.5 to 5.5 V In frequency/8 mode (f(X IN) ≤ 8 MHz).....................2.0 to 5.5 V In frequency/8 mode (f(X IN) ≤ 5 MHz).....................1.8 to 5.5 V In low-speed mode....................................................1.8 to 5.5 V ●Power dissipationIn frequency/2 mode...............................................18 mW (std.) (at f(X IN) = 8 MHz, Vcc = 5 V, Ta = 25 °C)In low-speed mode at X CIN................................................18 µW (std.) (at f(X IN) stopped, f(X CIN) = 32 kHz, Vcc = 2.5 V, Ta = 25 °C)In low-speed mode at on-chip oscillator..................35 µW (std.) (at f(X IN) stopped, f(X CIN) = stopped, Vcc = 2.5 V, Ta = 25 °C)●Operating temperature range..................................– 20 to 85 °C APPLICATIONSCamera, audio equipment, household appliances, consumer elec-tronics, etc.3823 GroupSINGLE-CHIP 8-BIT CMOS MICROCOMPUTER REJ03B0146-0202Rev.2.02Jun.19.2007Table 1 Performance overviewParameter710.4 µs (Minimum instruction, f(X IN ) 10 MHz, High-speed mode)10 MHz (Maximum)16 K to 60 K bytes 640 to 2560 bytes 4-bit ✕ 1, 1-bit ✕ 1(4 pins sharing SEG)8-bit ✕ 5, 7-bit ✕ 1, 2 bit ✕ 1(16 pins sharing SEG)17 sources, 16 vectors (includes key input interrupt)8-bit ✕ 3, 16-bit ✕ 28-bit ✕ 1 (UART or Clock-synchronized)10-bit ✕ 8 channels or 8 bit ✕ 8 channels 8-bit ✕ 132 bytes ✕ 2 blocks 1/2, 1/32, 3, 4432Built-in feedback resistor(connect to external ceramic rasonator or quartz-crystal oscillator)Built-in feedback resistor(connect to external quartz-crystal oscillator or on-chip oscillator)4.5 to 5.5V 4.0 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 2.5 to 5.5V 2.0 to 5.5V 1.8 to 5.5V 1.8 to 5.5VStd. 18 mW (Vcc = 5V, f(X IN ) = 8MHz, Ta = 25 °C)Std. 18 µW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = 32kHz, Ta = 25 °C)Std. 35 µW (Vcc = 2.5V, f(X IN ) = stopped, f(X CIN ) = stopped, Ta = 25 °C)V CC 10mA -20 to 85 °C CMOS sillicon gate80-pin plastic molded LQFP/QFPNumber of basic instructions Instruction execution time Oscillation frequency Memory sizes ROM RAM Input port P34-P37, P40I/O port P0-P2, P41-P47, P5, P6, P70, P71Interrupt TimerSerial interface A/D converter Watchdog timer ROM correction function LCD drive control Bias circuitDutyCommon output Segment outputMain clock generating circuits Sub-clock generating circuits Power source voltageIn frequency/2 mode (f(X IN ) ≤ 10MHz)In frequency/2 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 10MHz)In frequency/4 mode (f(X IN ) ≤ 8MHz)In frequency/4 mode (f(X IN ) ≤ 5MHz)In frequency/8 mode (f(X IN ) ≤ 10MHz)In frequency/8 mode (f(X IN ) ≤ 8MHz)In frequency/8 mode (f(X IN ) ≤ 5MHz)In low-speed modePower dissipationIn frequency/2 mode In low-speed mode at X CINIn low-speed mode at on-chip oscillatorInput/Output Input/Output withstand voltage characteristicsOutput current Operating temperature range Device structure PackageFunctionPIN DESCRIPTIONTable 2 Pin description (1)V CC , V SS FunctionPin Name Function except a port function•LCD segment output pinsPower source •Apply voltage of power source to V CC , and 0 V to V SS . (For the limits of V CC , refer to “Recom-mended operating conditions”).V REF AV SS RESET X IN X OUTV L1–V L3COM 0–COM 3SEG 0–SEG 11P00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0 –P27/KW 7P34/SEG 12 –P37/SEG 15Analog refer-ence voltage Analog power source Reset input Clock input Clock outputLCD power sourceCommon outputSegment output I/O port P0I/O port P1I/O port P2•Reference voltage input pin for A/D converter.•GND input pin for A/D converter.•Connect to V SS .•Reset input pin for active “L”.•Input and output pins for the main clock generating circuit.•Feedback resistor is built in between X IN pin and X OUT pin.•Connect a ceramic resonator or a quartz-crystal oscillator between the X IN and X OUT pins to set the oscillation frequency.•If an external clock is used, connect the clock source to the X IN pin and leave the X OUT pin open.•This clock is used as the oscillating source of system clock.•Input 0 ≤ V L1 ≤ V L2 ≤ V L3 voltage.•Input 0 – V L3 voltage to LCD.•LCD common output pins.•COM 2 and COM 3 are not used at 1/2 duty ratio.•COM 3 is not used at 1/3 duty ratio.•LCD segment output pins.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each port to be individually programmed as either input or output.•Pull-down control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•4-bit input port.•CMOS compatible input level.•Pull-down control is enabled.•Key input (key-on wake-up) interrupt input pins•LCD segment output pinsInput port P3Table 3 Pin description (2)FunctionPin Function except a port function P40P42/INT 0,P43/INT 1P44/R X D,P45/T X D,P46/S CLK ,P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0,P55/CNTR 1P56/T OUT P57/ADT P60/AN 0–P67/AN 7P70/X COUT,P71/X CIN•1-bit Input port.•CMOS compatible input level.•7-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•8-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•2-bit I/O port.•CMOS compatible input level.•CMOS 3-state output structure.•I/O direction register allows each pin to be individually programmed as either input or output.•Pull-up control is enabled.•φ clock output pin •Interrupt input pins•Interrupt input pins •Real time port function pins •Timer X, Y function pins •Timer 2 output pins •A/D conversion input pins •Sub-clock generating circuit I/O pins.(Connect a resonator. External clock cannot be used.)P41/φ•Serial interface function pins•A/D trigger input pinsName I/O port P4I/O port P5I/O port P6I/O port P7Input port P4•QzROM program power pinPART NUMBERINGFig. 4 Part numbering Package codeFP :PRQP0080GB-A packageHP :PLQP0080KB-A packageROM numberOmitted in the shipped in blank version.ROM/PROM size1 :4096 bytes2 :8192 bytes3 :12288 bytes4 :16384 bytes5 :20480 bytes6 :24576 bytes7 :28672 bytes8 :32768 bytesThe first 128 bites and the last 2 bytes of ROM are reserved areas ; they cannot be used.Memory typeG :QzROM versionRAM size0 :192 bytes1 :256 bytes2 :384 bytes3 :512 bytes4 :640 bytes5 :768 bytes6 :896 bytes7 :1024 bytes8 :1536 bytes9 :2048 bytesA :2560 bytesProduct M38234G6-XXX FP9 :36864 bytesA :40960 bytesB :45056 bytesC :49152 bytesD :53248 bytesE :57344 bytesF :61440 bytesCurrently products are listed below.RemarksPackage Part No.RAM size (bytes)61440(61310)49152(49022)32768(32638)24576(24446)16384(16254)ROM size (bytes) ROM size for User in ( )Table 4 List of productsM3823AGF-XXXFP M3823AGF-XXXHP M3823AGFFP M3823AGFHPM38239GC-XXXFP M38239GC-XXXHP M38239GCFP M38239GCHPM38238G8-XXXFP M38238G8-XXXHP M38238G8FP M38238G8HPM38235G6-XXXFP M38235G6-XXXHP M38235G6FP M38235G6HPM38234G4-XXXFP M38234G4-XXXHP M38234G4FP M38234G4HP2560(Note 1)2048(Note 2)1536(Note 2)768(Note 2)640(Note 2)PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-A PRQP0080GB-A PLQP0080KB-ABlank BlankBlank BlankBlank BlankBlank BlankBlank BlankNote 1: RAM size includes RAM for LCD display and ROM corrections.Note 2: RAM size includes RAM for LCD display.FUNCTIONAL DESCRIPTIONCENTRAL PROCESSING UNIT (CPU)The 3823 group uses the standard 740 family instruction set. Re-fer to the table of 740 family addressing modes and machine instructions or the 740 Family Software Manual for details on the instruction set.Machine-resident 740 family instructions are as follows:The FST and SLW instruction cannot be used.The STP , WIT, MUL, and DIV instruction can be used.The central processing unit (CPU) has six registers. Figure 6shows the 740 Family CPU register structure.[Accumulator (A)]The accumulator is an 8-bit register. Data operations such as data transfer, etc., are executed mainly through the accumulator.[Index Register X (X)]The index register X is an 8-bit register. In the index addressing modes, the value of the OPERAND is added to the contents of register X and specifies the real address.[Index Register Y (Y)]The index register Y is an 8-bit register. In partial instruction, the value of the OPERAND is added to the contents of register Y and specifies the real address.[Stack Pointer (S)]The stack pointer is an 8-bit register used during subroutine calls and interrupts. This register indicates start address of stored area (stack) for storing registers during subroutine calls and interrupts.The low-order 8 bits of the stack address are determined by the contents of the stack pointer. The high-order 8 bits of the stack ad-dress are determined by the stack page selection bit. If the stack page selection bit is “0” , the high-order 8 bits becomes “0016”. If the stack page selection bit is “1”, the high-order 8 bits becomes “0116”.The operations of pushing register contents onto the stack and popping them from the stack are shown in Figure 7.Store registers other than those described in Table 4 with program when the user needs them during interrupts or subroutine calls.[Program Counter (PC)]The program counter is a 16-bit counter consisting of two 8-bit registers PC H and PC L . It is used to indicate the address of the next instruction to be executed.Fig. 6 740 Family CPU register structureAAccumulator b7b7b7b7b0b7b15b0b7b0b0b0b0XIndex register X YIndex register Y SStack pointer PC LProgram counter PC HN V T B D I Z CProcessor status register (PS)Carry flag Zero flagInterrupt disable flag Decimal mode flag Break flagIndex X mode flag Overflow flag Negative flag[Processor status register (PS)]The processor status register is an 8-bit register consisting of 5 flags which indicate the status of the processor after an arithmetic operation and 3 flags which decide MCU operation. Branch opera-tions can be performed by testing the Carry (C) flag , Zero (Z) flag, Overflow (V) flag, or the Negative (N) flag. In decimal mode, the Z, V, N flags are not valid.•Bit 0: Carry flag (C)The C flag contains a carry or borrow generated by the arithmetic logic unit (ALU) immediately after an arithmetic operation. It can also be changed by a shift or rotate instruction.•Bit 1: Zero flag (Z)The Z flag is set if the result of an immediate arithmetic operation or a data transfer is “0”, and cleared if the result is anything other than “0”.•Bit 2: Interrupt disable flag (I)The I flag disables all interrupts except for the interrupt generated by the BRK instruction.Interrupts are disabled when the I flag is “1”.•Bit 3: Decimal mode flag (D)The D flag determines whether additions and subtractions are executed in binary or decimal. Binary arithmetic is executed when this flag is “0”; decimal arithmetic is executed when it is “1”.Decimal correction is automatic in decimal mode. Only the ADC and SBC instructions can be used for decimal arithmetic.•Bit 4: Break flag (B)The B flag is used to indicate that the current interrupt was generated by the BRK instruction. The BRK flag in the processor status register is always “0”. When the BRK instruction is used to generate an interrupt, the processor status register is pushed onto the stack with the break flag set to “1”.•Bit 5: Index X mode flag (T)When the T flag is “0”, arithmetic operations are performed between accumulator and memory. When the T flag is “1”, direct arithmetic operations and direct data transfers are enabled between memory locations.•Bit 6: Overflow flag (V)The V flag is used during the addition or subtraction of one byte of signed data. It is set if the result exceeds +127 to -128. When the BIT instruction is executed, bit 6 of the memory location operated on by the BIT instruction is stored in the overflow flag.•Bit 7: Negative flag (N)The N flag is set if the result of an arithmetic operation or data transfer is negative. When the BIT instruction is executed, bit 7 of the memory location operated on by the BIT instruction is stored in the negative flag.Table 6 Set and clear instructions of each bit of processor status registerSet instruction Clear instruction C flagSECCLCZ flag––I flagSEICLID flagSEDCLDB flag––T flagSETCLTV flag–CLVN flag––Real time port function output A/D conversion inputA/D trigger inputDiagram No.Related SFRs Input/Output Name Pin Non-Port Function I/O Format Table 7 List of I/O port functionP00/SEG 16–P07/SEG 23P10/SEG 24–P17/SEG 31P20/KW 0–P27/KW 7P34/SEG 12–P37/SEG 15P40P41/φP42/INT 0,P43/INT 1P44/R X D P45/T X D P46/S CLK P47/S RDY /S OUTP50/INT 2,P51/INT 3P52/RTP 0,P53/RTP 1P54/CNTR 0Port P0Port P1Port P2Port P3Port P4Input/output,individual portsInput/output,individual bits InputInputInput/output,individual bitsCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input level CMOS compatible input levelCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state outputCMOS compatible input levelCMOS 3-state output CMOS compatible input levelCMOS 3-state output LCD segment outputKey input (key-on wake-up) interrupt inputLCD segment outputφ clock outputX CIN frequency signal outputExternal interrupt inputSerial I/O function input/outputExternal interrupt input Timer X function I/O Timer Y function input Timer 2 function output PULL register A Segment output enable registerPULL register AInterrupt control register 2PULL register ASegment output enable registerPULL register Bφ output control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BSerial I/O control register Serial I/O status register UART control register Peripheral function extension register PULL register BInterrupt edge selection registerPULL register BTimer X mode register PULL register BTimer X mode register PULL register BTimer Y mode register PULL register BTimer 123 mode register PULL register B A/D control registerPULL register A CPU mode register (1)(2)(3)(4)(6)(5)(2)(8)(7)Port P5(9)(2)Input/output,individual bits(10)P55/CNTR 1(11)(12)(13)(12)(14)P56/T OUT P57/ADT P60/AN 0–P67/AN 7(15)P70/X COUT P71/X CIN COM 0–COM 3SEG 0–SEG 11(16)(17)(18)Input/output,individual bits Input/output,individual bits Output OutputSub-clockgenerating circuit I/O LCD common output LCD segment outputPort P6Port P7Common SegmentLCD mode registerNotes 1: For details of how to use double function ports as function I/O ports, refer to the applicable sections.2: When an input level is at an intermediate potential, a current will flow from V CC to V SS through the input-stage gate.Especially, power source current may increase during execution of the STP and WIT instructions.Fix the unused input pins to “H” or “L” through a resistor.QzROM program power pinTermination of unused pins• Termination of common pinsI/O ports:Select an input port or an output port and follow each processing method.Output ports: Open.Input ports:If the input level become unstable, through current flow to an input circuit, and the power supply currentmay increase.Especially, when expecting low consumption current(at STP or WIT instruction execution etc.), pull-up orpull-down input ports to prevent through current(built-in resistor can be used). Pull-down the P40/(V PP) pin.We recommend processing unused pins through aresistor which can secure I OH(avg) or I OL(avg).Because, when an I/O port or a pin which have anoutput function is selected as an input port, it mayoperate as an output port by incorrect operation etc.Table 8 Termination of unused pinsPinP00/SEG16–P17/SEG23 P10/SEG24–P17/SEG31 P20/KW0–P27/KW7P34/SEG12–P37/SEG15 P40/(V PP)P41/φP42/INT0P43/INT1P44/RxDP45/TxDP46/S CLKP47/S RDY/S OUTP50/INT2P51/INT3P52/RTP0P53/RTP1P54/CNTR0P55/CNTR1P56/T OUTP57/ADTP60/AN0–P67/AN7P70/X COUTP71/X CINV L3 (Note)V L2 (Note)V L1 (Note)COM0–COM3SEG0–SEG11AV SSV REFX OUTTermination 2When selecting SEG output, open.When selecting KW function, performtermination of input port.When selecting SEG output, open.–When selecting φ output, open.When selecting INT0 function,perform termination of input port.When selecting INT1 function,perform termination of input port.When selecting R X D function,perform termination of input port.When selecting T X D function,perform termination of output port.When selecting external clock input,perform termination of input port.When selecting S RDY function,perform termination of output port.When selecting INT2 function,perform termination of input port.When selecting INT3 function,perform termination of input port.When selecting RTP0 function,perform termination of output port.When selecting RTP1 function,perform termination of output port.When selecting CNTR0 input function,perform termination of input port.When selecting CNTR1 function,perform termination of input port.When selecting T OUT function,perform termination of output port.When selecting ADT function,perform termination of input port.When selecting AN function, thesepins can be opened. (A/D conversionresult cannot be guaranteed.)Do not select X CIN-X COUT oscillationfunction by program.––––––––Termination 3–––––––––When selecting internal clock output,perform termination of output port.When selecting S OUT function,perform termination of output port.––––When selecting CNTR0 output function,perform termination of output port.–––––––––––––Termination 1 (recommend)I/O portInput portInput port (pull-down)I/O portConnect to V SSConnect to V SSConnect to V SSOpenOpenConnect to V SSConnect to V CC or V SSWhen an external clock isinput to the X IN pin, leavethe X OUT pin open.Note :The termination of V L3, V L2 and V L1 is applied when the bit 3 of the LCD mode register is “0”INTERRUPTSThe 3823 group interrupts are vector interrupts with a fixed prior-ity scheme, and generated by 16 sources among 17 sources: 8external, 8 internal, and 1 software.The interrupt sources, vector addresses (1) , and interrupt priority are shown in Table 9.Each interrupt except the BRK instruction interrupt has the inter-rupt request bit and the interrupt enable bit. These bits and the interrupt disable flag (I flag) control the acceptance of interrupt re-quests. Figure 16 shows an interrupt control diagram.Notes1: Vector addresses contain interrupt jump destination addresses.2: Reset function in the same way as an interrupt with the highest priority.Table 9 Interrupt vector addresses and priorityRemarksInterrupt Request Generating Conditions At resetAt detection of either rising or falling edge of INT 0 input At detection of either rising or falling edge of INT 1 input At completion of serial interface data receptionAt completion of serial interface transmit shift or when transmis-sion buffer is empty Interrupt Source LowHigh PriorityVector Addresses (Note 1)Reset (Note 2)INT 0INT 1Serial I/O reception Serial I/O transmission Timer X Timer Y Timer 2Timer 3CNTR 0CNTR 1Timer 1INT 2INT 3Key input(Key-on wake-up)ADTA/D conversion BRK instruction1234567891011121314151617FFFD 16FFFB 16FFF916FFF716FFF516FFF316FFF116FFEF 16FFED 16FFEB 16FFE916FFE716FFE516FFE316FFE116FFDF 16FFDD 16FFFC 16FFFA 16FFF816FFF616FFF416FFF216FFF016FFEE 16FFEC 16FFEA 16FFE816FFE616FFE416FFE216FFE016FFDE 16FFDC 16At timer X underflow At timer Y underflow At timer 2 underflowAt timer 3 underflowAt detection of either rising or falling edge of CNTR 0 input At detection of either rising or falling edge of CNTR 1 input At timer 1 underflowAt detection of either rising or falling edge of INT 2 input At detection of either rising or falling edge of INT 3 input At falling of conjunction of input level for port P2 (at input mode)At falling of ADT inputAt completion of A/D conversion At BRK instruction executionNon-maskableExternal interrupt(active edge selectable)External interrupt(active edge selectable)Valid when serial interface is se-lectedValid when serial interface is se-lectedExternal interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt(active edge selectable)External interrupt (Valid at falling)Valid when ADT interrupt is se-lected, External interrupt (Valid at falling)Valid when A/D interrupt is se-lectedNon-maskable software interruptAn interrupt requests is accepted when all of the following conditions are satisfied:• Interrupt disable flag.................................“0”• Interrupt disable request bit .....................“1”• Interrupt enable bit.. (1)Though the interrupt priority is determined by hardware, priority processing can be performed by software using the above bits and flag.[Transmit Buffer/Receive Buffer Register (TB/RB)] 001816The transmit buffer register and the receive buffer register are lo-cated at the same address. The transmit buffer register is write-only and the receive buffer register is read-only. If a charac-ter bit length is 7 bits, the MSB of data stored in the receive buffer register is “0”.[Serial I/O Status Register (SIOSTS)] 001916 The read-only serial I/O status register consists of seven flags (bits 0 to 6) which indicate the operating status of the serial I/O function and various errors.Three of the flags (bits 4 to 6) are valid only in UART mode.The receive buffer full flag (bit 1) is cleared to “0” when the receive buffer is read.If there is an error, it is detected at the same time that data is transferred from the receive shift register to the receive buffer reg-ister, and the receive buffer full flag is set. A write to the serial I/O status register clears all the error flags OE, PE, FE, and SE. Writ-ing “0” to the serial I/O enable bit (SIOE) also clears all the status flags, including the error flags.All bits of the serial I/O status register are initialized to “0” at reset, but if the transmit enable bit (bit 4) of the serial I/O control register has been set to “1”, the transmit shift register shift completion flag (bit 2) and the transmit buffer empty flag (bit 0) become “1”. [Serial I/O Control Register (SIOCON)] 001A16 The serial I/O control register contains eight control bits for the se-rial I/O function.[UART Control Register (UARTCON) ]001B16 The UART control register consists of four control bits (bits 0 to 3) which are valid when asynchronous serial I/O is selected and set the data format of an data transfer. One bit in this register (bit 4) is always valid and sets the output structure of the P45/T X D pin. [Baud Rate Generator (BRG)] 001C16The baud rate generator determines the baud rate for serial trans-fer.The baud rate generator divides the frequency of the count source by 1/(n + 1), where n is the value written to the baud rate genera-tor.■Notes on serial I/OWhen setting the transmit enable bit to “1”, the serial I/O transmit interrupt request bit is automatically set to “1”. When not requiring the interrupt occurrence synchronized with the transmission enalbed, take the following sequence.➀Set the serial I/O transmit interrupt enable bit to “0” (disabled).➁Set the transmit enable bit to “1”.➂Set the serial I/O transmit interrupt request bit to “0” after 1 or more instructions have been executed.➃Set the serial I/O transmit interrupt enable bit to “1” (enabled).。